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1. General description The 74HC595; 74HCT595 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard No. 7A. The 74HC595; 74HCT595 are 8-stage serial shift registers with a storage register and 3-state outputs. The registers have separate clocks. Data is shifted on the positive-going transitions of the shift register clock input (SHCP). The data in each register is transferred to the storage register on a positive-going transition of the storage register clock input (STCP). If both clocks are connected together, the shift register will always be one clock pulse ahead of the storage register. The shift register has a serial input (DS) and a serial standard output (Q7S) for cascading. It is also provided with asynchronous reset (active LOW) for all 8 shift register stages. The storage register has 8 parallel 3-state bus driver outputs. Data in the storage register appears at the output whenever the output enable input (OE) is LOW. 2. Features and benefits  8-bit serial input  8-bit serial or parallel output  Storage register with 3-state outputs  Shift register with direct clear  100 MHz (typical) shift out frequency  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  Multiple package options  Specified from 40 C to +85 C and from 40 C to +125 C 3. Applications  Serial-to-parallel data conversion  Remote control holding register 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Rev. 7 — 26 January 2015 Product data sheet 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 2 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 4. Ordering information 5. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC595N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT595N 74HC595D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT595D 74HC595DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT595DB 74HC595PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 74HCT595PW 74HC595BQ 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5  3.5  0.85 mm SOT763-1 74HCT595BQ Fig 1. Functional diagram PQD 67$7(2873876 %,76725$*(5(*,67(5 67$*(6+,)75(*,67(5 4 4 4 4 4 4 4 4 46           '6 6+&3 67&3 2(     05 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 3 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Fig 2. Logic symbol Fig 3. IEC logic symbol 05 2(              PQD 4 4 4 4 4 4 4 4 46 '6 6+&3 67&3 PQD          ' ' &    &   (1 5 65*  Fig 4. Logic diagram 67$*( 67$*(672 67$*( )) ' &3 4 5 /$7&+ ' &3 4 )) ' &3 4 5 /$7&+ ' &3 4 PQD ' 4 4 4 4 4 4 4 4 46 4 '6 67&3 6+&3 2( 05 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 4 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 6. Pinning information 6.1 Pinning Fig 5. Pin configuration DIP16, SO16 Fig 6. Pin configuration SSOP16, TSSOP16 +& +&7 4 9&& 4 4 4 '6 4 2( 4 67&3 4 6+&3 4 05 *1' 46 DDR                 +& +&7 4 9&& 4 4 4 '6 4 2( 4 67&3 4 6+&3 4 05 *1' 46 DDR                 (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 7. Pin configuration for DHVQFN16 DDR +& +&7 4 05 4 6+&3 4 67&3 4 2( 4 '6 4 4 *1' 46 4 9&& 7UDQVSDUHQWWRSYLHZ                 WHUPLQDO LQGH[DUHD *1'  74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 5 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 6.2 Pin description 7. Functional description [1] H = HIGH voltage state; L = LOW voltage state;  = LOW-to-HIGH transition; X = don’t care; NC = no change; Z = high-impedance OFF-state. Table 2. Pin description Symbol Pin Description Q1 1 parallel data output 1 Q2 2 parallel data output 2 Q3 3 parallel data output 3 Q4 4 parallel data output 4 Q5 5 parallel data output 5 Q6 6 parallel data output 6 Q7 7 parallel data output 7 GND 8 ground (0 V) Q7S 9 serial data output MR 10 master reset (active LOW) SHCP 11 shift register clock input STCP 12 storage register clock input OE 13 output enable input (active LOW) DS 14 serial data input Q0 15 parallel data output 0 VCC 16 supply voltage Table 3. Function table[1] Control Input Output Function SHCP STCP OE MR DS Q7S Qn X X L L X L NC a LOW-level on MR only affects the shift registers X  L L X L L empty shift register loaded into storage register X X H L X L Z shift register clear; parallel outputs in high-impedance OFF-state  X L H H Q6S NC logic HIGH-level shifted into shift register stage 0. Contents of all shift register stages shifted through, e.g. previous state of stage 6 (internal Q6S) appears on the serial output (Q7S). X  L H X NC QnS contents of shift register stages (internal QnS) are transferred to the storage register and parallel output stages   L H X Q6S QnS contents of shift register shifted through; previous contents of the shift register is transferred to the storage register and the parallel output stages 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 6 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 8. Limiting values [1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C. [2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. [3] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C. [4] For DHVQFN16 package: Ptot derates linearly with 4.5 mW/K above 60 C. Fig 8. Timing diagram 6+&3 '6 67&3 05 2( 4 4 4 4 46 =VWDWH =VWDWH =VWDWH =VWDWH PQD Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +7 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA IO output current VO = 0.5 V to (VCC + 0.5 V) pin Q7S - 25 mA pins Qn - 35 mA ICC supply current - 70 mA IGND ground current 70 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation DIP16 package [1] - 750 mW SO16 package [2] - 500 mW SSOP16 package [3] - 500 mW TSSOP16 package [3] - 500 mW DHVQFN16 package [4] - 500 mW 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 7 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 9. Recommended operating conditions 10. Static characteristics Table 5. Recommended operating conditions Symbol Parameter Conditions 74HC595 74HCT595 Unit Min Typ Max Min Typ Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 -VCC V VO output voltage 0 - VCC 0 -VCC V t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V Tamb ambient temperature 40 +25 +125 40 +25 +125 C Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max 74HC595 VIH HIGH-level input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - V VIL LOW-level input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 V VOH HIGH-level output voltage VI = VIH or VIL all outputs IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - V Q7S output IO = 4 mA; VCC = 4.5 V 3.84 4.32 - 3.7 - V IO = 5.2 mA; VCC = 6.0 V 5.34 5.81 - 5.2 - V Qn bus driver outputs IO = 6 mA; VCC = 4.5 V 3.84 4.32 - 3.7 - V IO = 7.8 mA; VCC = 6.0 V 5.34 5.81 - 5.2 - V 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 8 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state VOL LOW-level output voltage VI = VIH or VIL all outputs IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 V Q7S output IO = 4 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V Qn bus driver outputs IO = 6 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 1.0 - 1.0 A IOZ OFF-state output current VI = VIH or VIL; VCC = 6.0 V; VO = VCC or GND - - 5.0 - 10 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 80 - 160 A CI input capacitance - 3.5 - - - pF 74HCT595 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V all outputs IO = 20 A 4.4 4.5 - 4.4 - V Q7S output IO = 4 mA 3.84 4.32 - 3.7 - V Qn bus driver outputs IO = 6 mA 3.7 4.32 - 3.7 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V all outputs IO = 20 A - 0 0.1 - 0.1 V Q7S output IO = 4.0 mA - 0.15 0.33 - 0.4 V Qn bus driver outputs IO = 6.0 mA - 0.16 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 1.0 - 1.0 A Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 9 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 11. Dynamic characteristics IOZ OFF-state output current VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND - - 5.0 - 10 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 80 - 160 A ICC additional supply current per input pin; IO = 0 A; VI = VCC  2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V pins MR, SHCP, STCP, OE - 150 675 - 735 A pin DS - 25 113 - 123 A CI input capacitance - 3.5 - - - pF Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 14. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max 74HC595 tpd propagation delay SHCP to Q7S; see Figure 9 [2] VCC = 2 V - 52 160 - 200 - 240 ns VCC = 4.5 V - 19 32 - 40 - 48 ns VCC = 6 V - 15 27 - 34 - 41 ns STCP to Qn; see Figure 10 [2] VCC = 2 V - 55 175 - 220 - 265 ns VCC = 4.5 V - 20 35 - 44 - 53 ns VCC = 6 V - 16 30 - 37 - 45 ns MR to Q7S; see Figure 12 [3] VCC = 2 V - 47 175 - 220 - 265 ns VCC = 4.5 V - 17 35 - 44 - 53 ns VCC = 6 V - 14 30 - 37 - 45 ns ten enable time OE to Qn; see Figure 13 [4] VCC = 2 V - 47 150 - 190 - 225 ns VCC = 4.5 V - 17 30 - 38 - 45 ns VCC = 6 V - 14 26 - 33 - 38 ns tdis disable time OE to Qn; see Figure 13 [5] VCC = 2 V - 41 150 - 190 - 225 ns VCC = 4.5 V - 15 30 - 38 - 45 ns VCC = 6 V - 12 27 - 33 - 38 ns 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 10 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state tW pulse width SHCP HIGH or LOW; see Figure 9 VCC = 2 V 75 17 - 95 - 110 - ns VCC = 4.5 V 15 6 - 19 - 22 - ns VCC = 6 V 13 5 - 16 - 19 - ns STCP HIGH or LOW; see Figure 10 VCC = 2 V 75 11 - 95 - 110 - ns VCC = 4.5 V 15 4 - 19 - 22 - ns VCC = 6 V 13 3 - 16 - 19 - ns MR LOW; see Figure 12 VCC = 2 V 75 17 - 95 - 110 - ns VCC = 4.5 V 15 6 - 19 - 22 - ns VCC = 6 V 13 5 - 16 - 19 - ns tsu set-up time DS to SHCP; see Figure 10 VCC = 2 V 50 11 - 65 - 75 - ns VCC = 4.5 V 10 4 - 13 - 15 - ns VCC = 6 V 9 3 - 11 - 13 - ns SHCP to STCP; see Figure 11 VCC = 2 V 75 22 - 95 - 110 - ns VCC = 4.5 V 15 8 - 19 - 22 - ns VCC = 6 V 13 7 - 16 - 19 - ns th hold time DS to SHCP; see Figure 11 VCC = 2 V 3 6 - 3 - 3 - ns VCC = 4.5 V 3 2 - 3 - 3 - ns VCC = 6 V 3 2 - 3 - 3 - ns trec recovery time MR to SHCP; see Figure 12 VCC = 2 V 50 19 - 65 - 75 - ns VCC = 4.5 V 10 7 - 13 - 15 - ns VCC = 6 V 9 6 - 11 - 13 - ns fmax maximum frequency SHCP or STCP; see Figure 9 and 10 VCC = 2 V 9 30 - 4.8 - 4 - MHz VCC = 4.5 V 30 91 - 24 - 20 - MHz VCC = 6 V 35 108 - 28 - 24 - MHz CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC [6][7] - 115 - - - - - pF Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 14. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 11 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state [1] Typical values are measured at nominal supply voltage. [2] tpd is the same as tPHL and tPLH. [3] tpd is the same as tPHL only. [4] ten is the same as tPZL and tPZH. [5] tdis is the same as tPLZ and tPHZ. [6] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL  VCC2  fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V. [7] All 9 outputs switching. 74HCT595; VCC = 4.5 V to 5.5 V tpd propagation delay SHCP to Q7S; see Figure 9 [2] - 25 42 - 53 - 63 ns STCP to Qn; see Figure 10 [2] - 24 40 - 50 - 60 ns MR to Q7S; see Figure 12 [3] - 23 40 - 50 - 60 ns ten enable time OE to Qn; see Figure 13 [4] - 21 35 - 44 - 53 ns tdis disable time OE to Qn; see Figure 13 [5] - 18 30 - 38 - 45 ns tW pulse width SHCP HIGH or LOW; see Figure 9 16 6 - 20 - 24 - ns STCP HIGH or LOW; see Figure 10 16 5 - 20 - 24 - ns MR LOW; see Figure 12 20 8 - 25 - 30 - ns tsu set-up time DS to SHCP; see Figure 10 16 5 - 20 - 24 - ns SHCP to STCP; see Figure 11 16 8 - 20 - 24 - ns th hold time DS to SHCP; see Figure 11 3 2 - 3 - 3 - ns trec recovery time MR to SHCP; see Figure 12 10 7 - 13 - 15 - ns fmax maximum frequency SHCP and STCP; see Figure 9 and 10 30 52 - 24 - 20 - MHz CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC  1.5 V [6] [7] - 130 - - - - - pF Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 14. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 12 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 12. Waveforms Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. Shift clock pulse, maximum frequency and input to output propagation delays PQD 6+&3LQSXW 46RXWSXW W3/+ W3+/ W: IPD[ 90 92+ 9, *1' 92/ 90 Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig 10. Storage clock to output propagation delays PQD 67&3LQSXW 4QRXWSXW W3/+ W3+/ W: WVX IPD[ 90 92+ 9, *1' 92/ 90 6+&3LQSXW 9, *1' 90 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 13 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Measurement points are given in Table 8. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical output voltage levels that occur with the output load. Fig 11. Data set-up and hold times PQD *1' *1' WK WVX WK WVX 90 90 90 9, 92+ 92/ 9, 46RXWSXW 6+&3LQSXW '6LQSXW Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig 12. Master reset to output propagation delays PQD 05 LQSXW 6+&3LQSXW 46RXWSXW W3+/ W: WUHF 90 92+ 92/ 9, *1' 9, *1' 90 90 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 14 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig 13. Enable and disable times PVD W 3/= W 3+= RXWSXWV GLVDEOHG RXWSXWV HQDEOHG   RXWSXWV HQDEOHG 2(LQSXW 90 W 3=/ W 3=+ 90 90 4QRXWSXW /2:WR2)) 2))WR/2: 4QRXWSXW +,*+WR2)) 2))WR+,*+ W U W I   Table 8. Measurement points Type Input Output VM VM 74HC595 0.5VCC 0.5VCC 74HCT595 1.3 V 1.3 V 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 15 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Test data is given in Table 9. Definitions for test circuit: CL = load capacitance including jig and probe capacitance. RL = load resistance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator. S1 = test selection switch. Fig 14. Test circuit for measuring switching times 90 90 W: W:   9 9, 9, QHJDWLYH SXOVH SRVLWLYH SXOVH 9 90 90   WI WU WU WI DDG '87 9&& 9&& 9, 92 57 5/ 6 &/ RSHQ * Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC595 VCC 6 ns 50 pF 1 k open GND VCC 74HCT595 3 V 6 ns 50 pF 1 k open GND VCC 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 16 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 13. Package outline Fig 15. Package outline SOT38-4 (DIP16) 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ 627   0+ F H  0( $ / VHDWLQJSODQH $ Z 0 E E H ' $ =     ( SLQLQGH[ E   PP VFDOH 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG 81,7 $ PD[   E    E F ' ( H 0 = / + PP ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV $ PLQ $ PD[ E PD[ H 0( Z                         LQFKHV                            ',3SODVWLFGXDOLQOLQHSDFNDJHOHDGV PLO 627 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 17 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Fig 16. Package outline SOT109-1 (SO16) ; Z 0 ș $ $ $ ES ' +( /S 4 GHWDLO; ( = H F / Y 0 $ $  $     \ SLQLQGH[ 81,7 $ PD[ $ $ $ ES F '  (   H +( / /S 4 Y Z \ = ș 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ PP LQFKHV                        R R   ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG   627   ( 06                                PP VFDOH 62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 18 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Fig 17. Package outline SOT338-1 (SSOP16) 81,7 $ $ $ ES F '  (  H +( / /S 4 Y Z \ = ș 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ PP                          R    R ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 627    Z 0 ES ' +( ( = H F Y 0 $ ; $ \     ș $ $ $ /S 4 GHWDLO; / $  02 SLQLQGH[   PP VFDOH 6623SODVWLFVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 $ PD[  74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 19 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Fig 18. Package outline SOT403-1 (TSSOP16) 81,7 $ $ $ ES F '  (   H +( / /S 4 Y Z \ = ș 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ PP                      R     R ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG   627 02   Z 0 ES ' = H      ș $ $ $ /S 4 GHWDLO; / $  +( ( F Y 0 $ ; $ \   PP VFDOH 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 $ PD[  SLQLQGH[ 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 20 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Fig 19. Package outline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ll information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 21 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 14. Abbreviations 15. Revision history Table 10. Abbreviations Acronym Abbreviation CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT595 v.7 20150126 Product data sheet - 74HC_HCT595 v.6 Modifications: • Table 7: Power dissipation capacitance condition for 74HCT595 is corrected. 74HC_HCT595 v.6 20111212 Product data sheet - 74HC_HCT595 v.5 Modifications: • Legal pages updated. 74HC_HCT595 v.5 20110628 Product data sheet - 74HC_HCT595 v.4 74HC_HCT595 v.4 20030604 Product specification - 74HC_HCT595_CNV v.3 74HC_HCT595_CNV v.3 19980604 Product specification - - 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 22 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state 16. Legal information 16.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 74HC_HCT595 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 26 January 2015 23 of 24 NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors 74HC595; 74HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 January 2015 Document identifier: 74HC_HCT595 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 5 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Recommended operating conditions. . . . . . . . 7 10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17 Contact information. . . . . . . . . . . . . . . . . . . . . 23 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 La chaîne de signal analogique, selon National Semiconductor Haute vitesse et basse puissance 19 Il y a quelques années, on annonçait le déclin de l’électronique analogique, mais en fait ce secteur va de mieux en mieux. Dans nombre de domaines, les composants analogiques ont été remplacés par des numériques, mais ils ont trouvé d’autres niches de marché. Par exemple, on estime à dix le nombre de composants analogiques requis pour le fonctionnement de chaque DSP dans un circuit. L’organisation mondiale des statistiques du commerce des semi-conducteurs estime le marché analogique à 36.77 milliards de dollars US en 2007 et il semblerait que sa croissance atteigne 12,6% l’année prochaine (le deuxième plus important secteur de croissance de l’industrie, après le logique). Ce développement a été alimenté par une croissance considérable de l’utilisation des appareils électroniques portables grand public et de l’infrastructure de communications venant en support de ceux-ci. Les deux fonctions principales qui restent et demeureront analogiques dans l’avenir prévisible sont la gestion de puissance et la chaîne de signal. Le rôle de la gestion de puissance est évident, notamment dans les appareils portables alimentés sur batteries, la durée de vie de celles-ci étant primordiale au succès d’un produit portable. La chaîne de signal constitue la seconde fonction analogique d’un circuit et, bien qu’elle ait un rôle moins évident qu’auparavant, elle est tout aussi importante. Focus sur les composants analogiques de National Semiconductor National Semiconductor est l’un des premiers fabricants de composants analogiques. L’entreprise a cédé son activité microprocesseur Geode à AMD en 2003 afin de cibler exclusivement ses solutions analogiques. L’entreprise focalise tous ses efforts de R&D dans ce domaine technologique. National offre des solutions de transfert de données série et de conversion, de conditionnement de signal analogique haute performance pour répondre aux besoins des applications finales techniquement exigeantes, telles que les stations de base sans fil, la réseautique, l’instrumentation, l’équipement militaire, aérospatial et médical. L’entreprise tente de simplifier le processus de conception de la chaîne de signal avec une offre étendue de solutions. Cet article traite de certaines solutions de National et explique les spécifications les plus importantes requises par les ingénieurs concepteurs. Les trois domaines du concept MIDAS, sur lesquels l’article se concentre, sont les amplificateurs, les convertisseurs de données et les produits d’interface. Besoins pour la conception La sélection des composants de la chaîne de signal implique la prise en compte du flux d’un signal, de sa source (souvent un capteur ou une source de signal) vers l’univers numérique des contrôleurs, processeurs et FPGA où le traitement du signal a lieu. Le processus de conception nécessite des valeurs d’impédance appariées, une minimisation des sources de bruit et la garantie d’un gain suffisant au niveau de l’entrée pour commander un CAN. Dès que la chaîne de base est élaborée, le travail de développement subsidiaire implique de s’assurer que chaque composant de la chaîne est correctement entraîné et protégé. La sélection du CAN le « mieux adapté » pour une application donnée repose sur plusieurs facteurs. La résolution est l’une des priorités car la précision du système en dépend, généralement. La précision elle-même dépend beaucoup de l’exécution du CAN et peut varier selon qu’il s’agit d’applications à très haut débit avec des fréquences d’échantillonnage supérieures à 200Msps (ex., ADC08D1000WG-QV), d’applications à haut débit allant de 1Msps à 200Msps (ex., ADC14V155) ou d’applications à usage général et débit plus faible, inférieur à 1Msps. En général, le choix entre le CAN ou l’amplificateur est habituellement le facteur restrictif dans les chaînes de signal à haute fréquence, si bien que la sélection des deux exige une grande attention. L’un des besoins les plus exigeants pour ce qui concerne le traitement de signal analogique est la fonction de conversion d’une terminaison simple vers une différentielle : éclatement du signal en deux signaux identiques qui peuvent être comparés pour filtrer le bruit, la distorsion ou tout autre effet non désiré au niveau signal. Celle-ci est souvent réalisée avec des transformateurs, mais si la gamme de fréquence du signal inclut du courant continu, le transformateur ne fonctionnera pas et il sera nécessaire d’utiliser un amplificateur terminaison simple / différentielle (ex., LMH6551). L’amplificateur ne fournit pas seulement une amplification, mais offre également déphasage niveau (permettant de soustraire le composant CC du signal), fonctions de correspondance d’impédance et gain. Bande passante, gain, bruit et distorsion constituent les principales spécifications dont il faut tenir compte pour un amplificateur. Le gain d’un amplificateur qui est légèrement inférieur au signal maximum de la pleine échelle d’un CAN est idéal pour éviter que le signal amplifié ne surcharge l’entrée du CAN et écrêter le signal en raison d’un décalage ou de légères imprécisions des valeurs de gain. Pour éviter également l’atténuation du signal avant qu’il arrive au CAN, il est souhaitable d’utiliser une bande passante d’amplificateur de 3dB supérieure à la bande passante du signal d’entrée. Enfin, dans tout système intégrant une chaîne de signal, le rapport signal/bruit est sans conteste une métrique clé. Du fait que le bruit d’horloge contribue au bruit d’ensemble du système, et que les horloges sont des composants essentiels de tout système, la régulation du bruit d’horloge est un élément capital de la conception système. National fabrique des conditionneurs d’horloge de précision avec VCO intégré (ex., LMK03000). Ce dispositif permet au concepteur de créer une architecture d’horloge complète (sous-système) qui réalise la meilleure performance possible et, à un niveau fonctionnel, non seulement génère une horloge de précision, mais également reconditionne et distribue une horloge générée en externe. Invitez vos clients à consulter cet article en ligne sur www.electronicsdesignworld.com 11 Puissance utile pour une performance de pointe Aujourd’hui, cette déclaration est devenue une nécessité. Dans la conception électronique moderne, la puissance représente un produit fini et la plus grande partie de la puissance qui fait fonctionner l’électronique finit en chaleur perdue car inutilisée. De plus en plus de pays ajoutent des fonctionnalités technologiquement avancées, la courbe de la consommation énergétique va cependant continuer à monter. Conscient de cette tendance à la hausse, National Semiconductor a développé des produits PowerWise pour offrir un niveau de performance avec une consommation énergétique réduite. Le rapport performance/puissance Une mesure métrique simple pour une voiture est la consommation moyenne de 0 à 100 km/h. Du fait de l’augmentation du prix des carburants, cette mesure métrique prend de l’importance. Ce concept s’applique également au rapport performance/puissance et pour un ingénieur cela peut signifier une ou deux choses : consommation plus faible ou performance supérieure. L’avantage évident d’une consommation moindre est l’économie plus importante réalisée ou la durée de vie prolongée des batteries, en plus d’une usure thermique réduite des composants électroniques. Plus la température ambiante est faible, plus la durée de vie du produit est prolongée, impliquant une baisse des coûts de remplacement. Améliorer le rapport performance/ puissance peut aussi offrir des avantages lorsqu’il est nécessaire d’installer un nouveau design avec des ressources sortantes. Par exemple, un boîtier Set Top (STB) pour connexion par câble peut nécessiter un espace physique égal ou plus petit que le modèle précédent, une puissance de même niveau ou supérieur, mais requiert un niveau de performance supérieur. Même si les ressources n’ont pas changées, pour réaliser avec succès son projet, le concepteur doit utiliser des composants plus performants et consommant la même énergie ou moins. Technologie de processus, architecture et systèmes La technologie de processus est importante, non seulement pour un niveau de qualité constant, mais également pour une meilleure performance avec une consommation moindre. Des traitements à bande passante élevée et faible déperdition sont essentiels pour fournir une performance globale optimale dans les semiconducteurs, mais ils ne représentent que 50% des critères requis. Les techniques et propriétés intellectuelles à la base de la conception des dispositifs sont aussi importantes que les traitements employés. Autre aspect important de la mesure du rapport performance/puissance qui n’est pas toujours apparent au niveau des composants individuels : la façon dont ces composants interagissent entre eux et qui permettra de réduire la consommation d’énergie. Outils pour augmenter l’efficacité Certains composants ont besoin d’outils pour contribuer à améliorer le rapport performance/puissance. Cela s’applique essentiellement, mais non exclusivement, aux régulateurs de commutation de puissance. L’outil de conception WEBENCH de National Semiconductor permet aux ingénieurs de ‘composer en interne’ un niveau de performance pour circuits d’alimentation en contrepartie d’autres paramètres, c.-à-d. la taille des composants. La famille PowerWise de régulateurs commutateurs simples (LM5576) en est un bon exemple. Cette famille est prise en charge par l’outil WEBENCH avec un contrôle du réglage du rendement requis pour le système, comme indiqué en Figure 1. En 1908, William A. Smith déclarait, « L’ingénierie est la science de la maîtrise, de la conservation de l’énergie fournie et stockée sous forme naturelle pour les besoins de l’homme. C’est le rôle de l’ingénierie d’utiliser cette énergie de manière optimale afin qu’il y ait le moins de pertes possible. » Figure 1. Contrôle d’optimisation WEBENCH Premier Farnell Global Technology Centre Conception de systèmes médicaux avec des microprocesseurs Abrégé Les dispositifs électroniques médicaux représentent toute une gamme de matériel comprenant aussi bien des machines de diagnostic par imagerie qui occupent toute une pièce, que des petits dispositifs portables que les patients peuvent emporter partout. Pour atteindre leurs objectifs de prestations optimales et de coûts réduits, les prestataires de soins de santé réclament aux fabricants des améliorations dans le domaine de la visualisation et de la transmission des données médicales image et vidéo. En réponse à cette demande, nous assistons à l'émergence de plusieurs tendances techniques susceptibles d'influencer l'architecture des matériels futurs : 􀁺 Le développement de matériel disponible dans le commerce et de matériel portable ; 􀁺 L'interface parallèle propriétaire sera remplacée par une interface HSIO standardisée ; 􀁺 Ajout de dispositifs de communication par Internet filaires et sans-fil. Alors que le public se préoccupe de plus en plus des questions de santé, la demande en produits médicaux électroniques sur le marché augmente, plus particulièrement dans le secteur des produits haut de gamme, comme les scanners CT, les IRM, les appareils de diagnostic à ultrasons ultra performants, etc. La taille du marché mondial de l'électronique médicale a connu une croissance importante. Espicom (une société d'étude de marché) prévoit que le volume des ventes sur le marché mondial de l'instrumentation médicale dépassera les 200 milliards de dollars, la part des produits médicaux électroniques étant de 45 %, c'est-à-dire 90 milliards de dollars. Quant à la perspective sur le marché médical chinois, il est évident que l'influence favorable provient des changements de politique gouvernementale, des progrès en matière de libéralisation du milieu hospitalier et d'une croissance accélérée du marché. La tendance au développement de matériel de petites dimensions plus portable sera accompagnée d'exigences plus strictes en matière de consommation d'énergie et de traitement des signaux. Les ingénieurs vont donc devoir relever des défis encore plus importants. Le marché chinois de l'électronique médicale poursuivait son expansion en 2006. Le volume total des ventes sur ce marché a dépassé les 20 milliards de RMB pour atteindre 21,08 milliards de RMB, une croissance de 15,6 % par rapport à l'année précédente, ce qui, de toute évidence, dépasse celle du même marché à l'échelle mondiale. Le marché chinois de l'électronique médicale maintiendra une croissance régulière avec un taux de croissance annuel moyen de 18,2 % dans les années à venir et on peut s'attendre à ce qu'en 2011, le volume de ce marché approche les 50 milliards de RMB. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Taux de croissance annuel moyen 11 % Figure 1 Marché international des semi-conducteurs médicaux Taux de croissance annuel moyen 12 % Taux de croissance annuel moyen ultrasons 15 % Source : Databeans, 2007 Figure 2 Marché international des semi-conducteurs d'imagerie médicale NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ bone density scanner scanner de densité osseuse MRI scanner scanner IRM Premier Farnell Global Technology Centre X-ray Rayon-X PET scanner scanner PET CT Scanner scanner CT electrocardiogram électrocardiogramme other imaging autre type d'imagerie ultrasound ultrasons Les secteurs de l'industrie tels que les semi-conducteurs, les composants, les matériaux électroniques médicaux et le matériel de fabrication ont vu leur production accélérée par la croissance du marché de l'électronique médicale. Dans les cinq prochaines années, le volume du marché des semi-conducteurs électroniques médicaux dépassera les 3,5 milliards de dollars avec un taux de croissance annuel moyen de 11 %. Pour répondre aux exigences strictes concernant la stabilité et les performances du matériel électronique médical, la sécurité du matériel et la sécurité personnelle des utilisateurs, ainsi qu'aux exigences spécifiques de certification des systèmes médicaux, les éléments électroniques médicaux et les programmes de conception, ainsi que les matériaux et les technologies de fabrication, etc., doivent satisfaire des exigences plus strictes. Architecture des systèmes médicaux À l'exclusion des analyseurs des gaz du sang, des tensiomètres numériques, des moniteurs de rythme cardiaque/pouls numériques, des glucomètres ou même des thermomètres numériques, la plupart des dispositifs médicaux se composent de cinq blocs de niveau système communs à chaque : 􀁺 Élément de biocapteur 􀁺 Module AFE 􀁺 Contrôle et traitement des données 􀁺 Interface utilisateur 􀁺 Gestion de batterie/d'alimentation électrique En apparence, la topologie de mise en oeuvre effective diffère largement d'un bloc à l'autre selon les exigences de détection, de traitement et d'affichage des informations qui dépendent du type d'appareil de mesure et de l'ensemble des caractéristiques. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Figure 3 Schéma fonctionnel d'un système médical uProcessor microprocesseur biosensor biocapteur precision amp ampli. précision buffer/ op. amp. buffer/ampli op. monitor moniteur speaker haut-parleur ADC CAN LCD Ctrl Commande LCD data bus bus de données Bluetooth ..... Transmission de données sans fil Bluetooth Zigbee WiFi/WiMax LED/KEY driver Driver de LED/Clavier USB controller wired data transmission Contrôleur USB - Transmission de données filaire Flash/ROM Mémoire flash/ROM Keypad clavier Power charger/management chargeur/gestion d'alimentation sensor capteur user interface interface utilisateur power alimentation back end arrière data ctrl contrôle des données LED display affichage LED NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Matériel à ultrasons utilisant des DSP et MCU Les systèmes à ultrasons tant médicaux qu'industriels utilisent des techniques d'imagerie focales pour obtenir des images performantes ; cette technique dépasse largement ce qui peut être obtenu par une approche à une voie. En utilisant un réseau de récepteurs, on peut créer une image haute définition en décalant, en mettant à l'échelle puis en résumant intelligemment l'énergie d'écho. Le concept de décalage et les signaux reçus d'un réseau de transducteurs de mise à l'échelle lui permettent de se concentrer sur un point unique dans la région balayée. En se concentrant sur différents points en une seule séquence, on peut finalement assembler une image. Figure 4 Schéma fonctionnel d'un système à ultrasons scan conversion post processing post-traitement de conversion de scan spectral doppler processing traitement de doppler spectral color/power doppler processing traitement de doppler couleur/Power doppler B mode processing traitement mode B switches commutateurs feedback retour time gain control contrôle de gain de temps audio amp. ampli audio monitor moniteur speaker haut-parleur beamformer unit Tx & Tx Transmission/réception - filtre de formation de voies numériques ADC CAN transducer matrix matrice de transducteur data bus bus de données Power management gestion de puissance NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Core power alimentation de coeur I/O power alimentation des E/S system power alimentation du système Flash/ROM Mémoire flash/ROM data storage stockage de données Keypad clavier Power management gestion d'alimentation sensor capteur user interface interface utilisateur power alimentation back end arrière data ctrl contrôle des données LED display affichage LED On utilise généralement un filtre passe-bas comme filtre anti-alias entre la tension Vac et le CAN, pour limiter la bande passante du bruit. On pourra trouver ici les topologies en phase linéaire basées sur le filtre deux à cinq pôles d'un système spécifique. Quant à la sélection d'un ampli op., les considérations primaires doivent inclure les fréquences d'entrée minimales et maximales, les déviations de signal, les distorsions harmoniques et les exigences de gain. Typiquement, les convertisseurs analogique/numérique (CAN) sont de 10 et 12 bits. Le rapport signal/bruit et la consommation électrique sont les facteurs les plus importants, suivis de l'intégration de voie. Source : www.ti.com/ADS527x EVM User’s Guide Figure 5 Mise en oeuvre des convertisseurs analogiques/numériques (CAN) [see note = voir note] L'ajout d'une interface LVDS entre le CAN et le filtre de formation de voies représente une autre tendance dans les CAN, le nombre de lignes d'interface pouvant être réduit de 6144 à 1024 pour un système à 512 voies en sérialisant les données sortant du CAN. Cette réduction permet d'utiliser des cartes de circuit imprimé plus petites et plus économiques qui forment une partie essentielle des systèmes d'imagerie portables. Les fonctions du DSP pouvant être utilisées dans un système d'imagerie comprennent le traitement Doppler, l'imagerie 2D, 3D et même 4D ainsi que tout un éventail d'algorithmes post-traitement destinés à améliorer la fonctionnalité et les performances. Les exigences les plus importantes d'un système d'imagerie sont des performances élevées et une large bande passante. Les systèmes à ultrasons offrent de nombreux niveaux de performance et de fonctionnalité différents. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Certaines solutions peuvent contenir des composants réclamant une gamme dynamique élevée, ou des composants dont les fonctions consistent à réaliser un traitement en virgule flottante en beaucoup moins de cycles. On peut citer la réduction spectrale ou la racine carrée comme exemples de ce type de fonctions. Les DSP conviennent parfaitement dans les applications qui favorisent un traitement en virgule flottante. Lorsqu'une application à ultrasons réclame un système d'exécution, un microcontrôleur de type processeur ARM, peut fournir la solution, car il est capable de gérer les exigences d'un système d'exécution. L'assemblage des signaux est assuré par un filtre de formation des voies numérique. Il s'agit d'un ASIC normal conçu sur mesure, mais sa fonction est mise en oeuvre par un procédé de logique programmable différent. Le signal numérisé est mis à l'échelle et décalé dans le filtre de formation des voies de manière à générer l'effet de concentration dans la chaîne réceptrice. Après le réglage correct, les signaux de toutes les voies réceptrices sont alors rassemblés et transférés au système d'imagerie. Le système d'imagerie peut être développé en tant qu'ASIC séparé, être un processeur programmable tel qu'un DSP, ou être entièrement un ordinateur de bureau. Les éléments de transmission doivent pouvoir être capables de contrôler des déviations de signal entre 100 V et 200 V. La plupart du temps cette opération est assurée par des FET haute tension. Deux types de commandes de FET peuvent être utilisés : marche/arrêt (pousser/tirer) ou linéaire classe-AB. La plus populaire est la méthode pousser/tirer qui ne demande qu'une interface très simple et très économique pour connecter les FET. La méthode classe-AB peut beaucoup améliorer la distorsion harmonique mais réclame des pilotes plus complexes et consomme plus d'énergie. Les fabricants de systèmes et d'équipement ont choisi de nombreux types de produits différents de plusieurs fournisseurs pour leurs applications d'imagerie à ultrasons, y compris les amplis op., les CAN simples, doubles et octaux (tous avec récupération de surcharge d'entrée rapide et d'excellentes performances dynamiques), les processeurs de signaux numériques, une circuit intégré frontal ultrason basse puissance à 8 voies, par exemple VCA8617 et ADS5270, conçu spécifiquement pour le marché des appareils à ultrasons. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Conception d'un scanner PET avec FPGA /PLD Selon le type d'isotope utilisé, on peut observer différentes fonctions métaboliques. Un scanner PET étant capable de suivre le trajet d'un cancer dans le corps et d'illustrer avec précision l'étendue de la maladie, c'est un outil particulièrement efficace dans le diagnostic des cancers, par exemple. Un autre secteur d'application en développement constant des scanners PET est le diagnostic des troubles neurologiques courants tels que la maladie d'Alzheimer, la maladie de Hodgkins et les accidents cérébrovasculaires. Figure 6 Schéma fonctionnel d'un scanner PET radiation radiation PMT array réseau PMT motors moteurs Precision amps amplis de précision HV supply control commande d'alimentation HT Rx gain control commande réception gain motor driver Driver moteur motion control contrôle de mouvement monitor moniteur timing and control relation temps et commande image processor processeur d'image ADC CAN data bus bus de données Power management gestion d'alimentation Core power alimentation coeur I/O power alimentation E/S system power alimentation système Flash/ROM Mémoire flash/ROM NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre data storage stockage de données Keypad clavier À cause du grand nombre de détecteurs qu'ils contiennent et de leurs caractéristiques avancées, les scanners PET ont besoin d'une solution de traitement frontal économique, souple, puissante et rapide. L'avantage d'utiliser des FPGA/PLD dans les scanners PET plutôt qu'un circuit intégré spécifique à l'application (ASIC) parait évident aux ingénieurs système. La reconfigurabilité en circuit (ICR) des dispositifs FPGA /PLD leur permet d'être configurés pour l'installation, reconfigurés pour le processus de détection effectif, et reconfigurés encore une fois pour réaliser des autodiagnostics, le cas échéant. Par exemple, pendant la configuration, l'ordinateur PC/104 programme les algorithmes d'étalonnage dans les dispositifs Altera, permettant ainsi à toutes les voies de traitement en bloc de réaliser l'étalonnage en même temps, réduisant ainsi la durée de configuration des détecteurs. La reconfigurabilité du dispositif FPGA/PLD lui permet de traiter facilement toutes ces fonctions. Il suffit de reconfigurer dans le système à chaque étape du processus. De même, la durée de traitement du signal reste minimale car le dispositif Altera peut accéder simultanément à tous les autres dispositifs du sous-système. Les dispositifs FPGA/PLD pouvant être facilement reconfigurés dans le système, ils représentent le meilleur choix pour la plupart des scanner PET haute résolution. Ils peuvent mettre en oeuvre la configuration, le processus de détection et un autodiagnostic dans les mêmes dispositifs FPGA/PLD, et permettent ainsi de raccourcir les temps de développement, d'économiser de l'espace au niveau des cartes et de réduire la consommation et les coûts d'énergie. Ils offrent également l'avantage supplémentaire d'un support garanti en cas de modifications futures éventuelles des exigences ou de la configuration du système. Tensiomètre avec microcontrôleurs Un microcontrôleur est conçu pour les applications haute précision en temps réel portables qui ont besoin d'un circuit intégré avec une grande mémoire. Il est utilisé en général dans les tensiomètres, les moniteurs du rythme cardiaque, les analyseurs de sang, les thermomètres numériques, les oxymètres de pouls, etc. Le système mesure la pression artérielle par l'une de trois méthodes, c'est-à-dire Korotkoff, oscillométrie ou pouls. À l'aide d'un brassard, d'une pompe et d'un transducteur, il mesure la pression artérielle et le rythme cardiaque en trois étapes : gonflement, mesure, et dégonflement. Il comporte un écran LCD, des boutons de sélection, un rappel de mémoire, une gestion d'alimentation et une interface USB. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre LCD display afficheur LCD LED display afficheur LED air pressure control commande de pression d'air Precision amp ampli de précision Pressure transducer transducteur de pression audio amp ampli audio MCU processor processeur MCU LCD ctrl commande LCD speaker haut-parleur I/O port LED driver port E/S Driver de LED I/O port keypad port E/S clavier I/O port air pressure control port E/S Commande de pression d'air ADC can data bus bus de données Power charger/management Chargeur/gestion d'alimentation USB controller wired data transmission Contrôleur USB - transmission de données filaire Flash/ROM Mémoire flash/ROM Présentation du modèle : Processeur MCU : commande du système, traitement des données. Mémoire flash : données et consignes d'enregistrement. Interface utilisateur : manipulation par l'utilisateur et affichage des résultats. Capteur : conversion de la pression en signal électronique Modèle AFE : amplification et numérisation du signal analogique Alimentation : électrique. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Suggestions de conception de dispositif médical électronique avec MCU, DSP, FPGA ou PLD Suggestions de dispositif médical électronique avec microcontrôleur (coeur ARM) 􀁺 Les capacités de traitement d'image améliorée par moteur HD avec contrôles de graphiques accélérés 2D répondent aux besoins de la plupart des produits avec des écrans larges ; 􀁺 Algorithmes matériels propriétaires et calculs logiques pour les différents produits ; 􀁺 Conception hautement intégrée pour assurer portabilité, fiabilité et économie ; 􀁺 Consommation d'énergie ultra-basse pour garantir la portabilité des appareils ; 􀁺 Les systèmes sur puce hautement intégrés à consommation ultra-basse sont les systèmes de choix pour les dispositifs médicaux implantables. Suggestions de dispositif médical électronique avec DSP 􀁺 Utilisation d'un DSP pour mettre en oeuvre des algorithmes complexes ; 􀁺 Utilisation d'un DSP pour mettre en oeuvre des performances d'imagerie 3D et 4D avec plus de précision et de clarté qu'en 2D. Suggestions de dispositif médical électronique avec FPGA/PLD 􀁺 Utilisation d'un FPGA quand les données d'un appareil médical doivent être fréquemment mises à jour ; 􀁺 Utilisation d'un FPGA haute performance avec plusieurs modules DSP, bus PCIe, mémoires DDR2 et DDR3 ; 􀁺 Utilisation d'un FPGA avec E/S multi-types et interface mémoire ; 􀁺 Développement avec les outils IP rapides intégrés ; 􀁺 Utilisation d'un FPGA avec une interface série haute vitesse, telle que LVDS. Références : www.ti.com www.eetchina.com www.ednchina.com www.analog.com www.altera.com www.xilinx.com NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tel.: 04 74 68 99 99 Fax: 04 74 68 99 90 Semiconducteurs 12 TECHNOLOGY FIRST Récemment, ZigBee™ a été un sujet largement discuté. Le standard, ZigBee ou 802.15.4 peut être, un très bon choix dans de nombreuses applications de communication à faible puissance, faible taux de transfert. Cependant, est-il adapté pour toutes les applications? Bien sûr que non ! Il y a des situations où un réseau local sans fil (WLAN) 802.11 est meilleur, car son taux de transfert est plus élevé. De la même façon, il y a des applications qui nécessitent une plus grande portée ou une autonomie plus longue. En fait, l’architecture nécessaire permet de déterminer le type de réseau sans fil le plus adapté à une application. Cet article vous expose les différentes solutions disponibles pour réaliser des réseaux industriels sans fil. 8Ko «Réseaux propriétaires» BANDE ISM 315, 433, 915 GHz Ressources système (Ko de mémoire) Zigbee™ 2,4 GHz mondial 915 GHz NA 868 GHz Europe Bluetooth 2,4GHz Réseau local sans fil (WLAN) 2,4GHz, 5,4 GHz 32-7Ko 1000 _ 100 _ 10 _ 1 _ 250Ko 1MOctet Dans les réseaux sans fil, lorsque le taux de transfert augmente, les ressources système nécessaire augmentent également. Par exemple un réseau local sans fil avec un protocole 802.11, ne fonctionnerait pas avec la plupart des applications embarquées (comme les téléphones portables), à cause de la consommation et de la taille du code nécessaires pour réaliser ce type de réseau. Un réseau local sans fil 802.11 nécessite jusqu’à 1 Mo de mémoire programme pour réaliser un noeud et la consommation, de l’émetteur radio, ajoutée à celle du processeur système, le rend plus adapté aux applications informatiques ou aux réseaux industriels pour lesquels la puissance n’est pas un problème. De nombreuses tâches, comme le contrôle à distance de températures, de pressions et l’activation, tiennent compte de l’importance de la consommation et de la taille de code des réseaux sans fil 802.11. Les protocoles ZigBee sont relativement légers en ce qui concerne les tailles de code (32 à 70 Ko) et ont une portée comprise entre 10 et 100 mètres. Cela leur permet d’être un bonne alternative pour le réseautage industriel. Un de ces principaux avantages, est sa capacité de «maillage». Un réseau maillé permet le passage des messages d’un noeud à l’autre, de manière que, si un des noeuds échoue ou est coupé, le message peut tout de même atteindre sa destination par un autre noeud. Les réseaux maillés ZigBee ou les différents réseaux sans fil, adaptés à votre application par Vince Stueve FAE, Micrel, Inc. Figure 1. Ressources système nécessaires pour différents types de réseaux RF nécessitent un traitement sophistiqué des paquets et donc, plus de mémoire. La figure 1 montre la taille de code utilisé par différents réseaux sans fil. Certains réseaux propriétaires utilisent les bandes ISM (réservées aux utilisations industrielles, scientifiques, et médicales). Les applications de surveillance à distance de températures, de pressions et d’activation sont nettement mieux traitées sur ce type de réseaux. La portée des réseaux propriétaires à bande ISM est nettement plus importante que celle des réseaux réalisés avec les protocoles ZigBee, Bluetooth ou WLAN (réseau local sans fil). La figure 2 montre une comparaison des portées en fonction de la technologie utilisée. Participez au premier concours de conception électronique où vos idées deviennent réalité ... et gagnez un prix de 100.000$ US ! www.live-edge.com/fr RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Semiconducteurs 13 TECHNOLOGY FIRST La consommation d’énergie d’un réseau ZigBee ou d’un réseau propriétaire sur bande ISM est plus en ligne avec les besoins des applications de surveillance à distance des températures, des pressions et l’activation. Un noeud ZigBee doit pouvoir fonctionner environ un an avec deux piles AA, alors que les noeuds utilisant les protocoles propriétaires sur bande ISM peuvent facilement durer jusqu’à dix ans sur la même source d’alimentation. Une durée de vie plus longue, des piles, peut être un critère de choix important, pour le concepteur, qui doit adapter le choix de la solution à la situation. La fréquence des systèmes ZigBee 802.15.4 est 2,4 GHz. Elle est largement et mondialement utilisée, pour les techniques de DSSS (étalement de spectre à séquence directe, O-QPSK). Les émissions ZigBee sont également autorisées à 915 MHz DSSS aux États-Unis et à 868 MHz DSSS en Europe. Ces fréquences utilisent la modulation BPSK (Binary Phase Shift Keying) une modulation de phase à enveloppe du spectre. La plupart des solutions ZigBee utilisent actuellement la bande des 2,4 GHz, mais elle est devenue de plus en plus encombrée à cause de son utilisation mondiale, notamment pour les fours à micro-ondes. Les bandes ISM sont moins encombrées, et les fréquences de 915MHz, 868 MHz ou 433 MHz offrent une alternative aux réseaux sans fil 2,4 GHz. Jusqu’à 200 Ko ps «Réseaux propriétaires» BANDE ISM 315, 433, 915 GHz Portée (mètres) Zigbee™ 2,4 GHz mondial 915 GHz NA 868 GHz Europe Bluetooth 2,4GHz Réseau local sans fil (WLAN) 2,4GHz, 5,4 GHz 20-250 Ko ps 1000 _ 100 _ 10 _ 1-3 Mo ps 11-54 Mo ps La longueur d’onde d’antenne à 2.4GHz est plus courte que celles des fréquences inférieures ou égales à 915MHz. C’est la raison pour laquelle de nombreux routeurs WLAN nécessitent deux antennes (voir même 3 antennes pour les 802.11g à 5,6 GHz). Les réflexions et les trajets multiples provoquent des trous de polarisation sur les transmissions à 2,4 GHz. Les réseaux qui utilisent des fréquences plus basses comme le 915 MHz présentent moins de trajets multiples ou de trous de polarisation. De ce fait, ils fonctionnent très bien avec une seule antenne. De nombreuses applications qui fonctionnent sur des fréquences de 915 MHz ou inférieures, peuvent être réalisées avec une antenne PCB intégrée. Cette diminution de l’antenne permet de réduire considérablement le coût total du système. Ceci est une des raisons pour laquelle les réseaux qui fonctionnent hors de la bande des 2,4 GHz sont souvent choisis pour les réseaux industriels à faible coût et ou la portée est plus longue. Quelles sont donc les autres options disponibles avec les bandes ISM ? Pendant très longtemps, les ingénieurs ont créé des réseaux RF propriétaires en utilisant les modulations OOK (On/Off Key) une modulation en tout ou rien, ASK (Amplitude Shift Key) une modulation d’amplitude ou FSK (Frequency Shift Key) une modulation de fréquence. Très souvent, ces réseaux offrent des avantages que les ingénieurs ne peuvent pas se permettre d’omettre. Micrel propose, des émetteurs-récepteurs pour la bande de 310 MHz à 950 MHz Figure 2. Portée en fonction de la technologie pour différents type de réseaux Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tel.: 04 74 68 99 99 Fax: 04 74 68 99 90 Semiconducteurs 14 TECHNOLOGY FIRST ƒ 25-50 Sauts Figure 3. Modulation par étalement du spectre à sauts de fréquence (FHSS) qui peuvent exécuter de nombreux RKE (télé déverrouillage) et des protocoles de réseau sans fil à deux voies sur la bande ISM. La principale difficulté d’un réseau sans fil est la pile de protocole utilisée par le microcontrôleur. Cette partie du développement est généralement celle qui pose le plus de problèmes. Pour le protocole 15.247, Micrel rend maintenant disponible un code source générique en C, conforme FCC pour la modulation à spectre étalé à saut de fréquence (FHSS) utilisable avec les émetteurs-récepteurs MICRF505 FSK. Ce logiciel est appelé MicrelNet™, il permet une modulation FHSS d’une largeur de bande de 250 KHz avec 25 sauts de fréquence. Le circuit MICRF505 dispose d’un amplificateur de puissance intégré (PA) permettant une transmission de -3 dBm à +10 dBm avec une antenne sans commutateur émetteur/récepteur externe. En utilisant l’amplificateur intégré, réglé à 10 dBm, la portée du MICRF505, peut facilement atteindre jusqu’à 300 mètres avec un taux de transfert allant jusqu’à 200 Kbps. La figure 3 montre différentes fréquences de porteuses utilisées dans les systèmes FHSS. Tous les noeuds sont synchronisés pour permettre un saut. S’il y a une mauvaise fréquence ou une fréquence utilisée, le système saute simplement sur la fréquence suivante. La pile de protocole gère le rassemblement des paquets qui sont envoyés entre les noeuds. MicrelNet dispose d’un programme d’adressage IP qui prend en charge le formatage de l’adresse de destination et de source, et rend facilement reconnaissable les paquets de données. Les contrôles par redondance cyclique logiciels assurent l’acheminement des données. Dans les réseaux industriels sans fil, l’application et l’environnement sont déterminant, pour choisir le type de réseau le plus adapté. Les choix de la fréquence, du protocole, et la consommation sont les éléments clés qui permettent de prendre la bonne décision. Des protocoles comme 802.11, ZigBee, et mêmes les systèmes propriétaires comme MicrelNet peuvent tous cohabiter. L’émergence de «contrôleurs de porte», comme le montre la figure 4, permettra à différents réseaux de communiquer sur le réseau le plus commun de tous. Note : MicrelNet est une marque déposée de Micrel, Inc. Toutes les autres maques déposées sont les propriétaires de leurs sociétés respectives. Contrôleur de passerelle 10/100 Copper Ethernet, RS232 ou tRS485 o el 0 e ZigBee™ 65 000 noeuds possibles LIAISON VIRTUELLE COORDINATEUR DE RÉSEAU NOEUD À FONCTION INTÉGRALE NOEUD À FONCTION RÉDUITE 802.11 WLAN 30 noeuds par routeur Bande ISM MicrelNet™ 65 000 noeuds possibles MAÎTRE CENTRAL MAÎTRE ESCLAVE Figure 4. Différents exemples de réseaux 19 www.rohs.fr Les derniers semiconducteurs discrets conformes RoHS Semiconducteurs discrets Commutateurs de charge très performants en petits signaux Transistors bipolaires à émetteur commuté Modules de puissance IGBT Diodes Schottky ThinQ!™ de 600V au SiC Modules de puissance intelligents Transistors pour applications Triacs Sanrex d’éclairage Drivers intelligents MOSFET MOSFET de puissance DirectFET™ IGBT NPT (Non-Punch Through) visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Transistors à valeur VCE(sat) ultrabasse et transistors numériques réunis dans des boîtiers miniatures SOT-666. Commutation 150kHz. Tension assignée 1700V, avec faibles pertes et RBSOA carrée (zone de fonctionnement sûre avec polarisation inverse). Tension assignée 1200V. Technologie Trench, pouvant supporter le courant d’avalanche. Tension assignée 600V - 1700V, faisant appel à une technologie évoluée de mise sous boîtier. Module original, effficace d’un point de vue thermique. Compatibilité SO-8. Caractéristiques de commutation presque parfaites, à base de carbure de silicum. Contrôleur autonome SMPS (alimentation à commutation) en mode courant avec CoolMOS™ intégré de 650V/800V. Pont inverseur IGBT 600V 10A triphasé, comprenant des circuits intégrés pour la commande de grille et la protection. Gamme de transistors de puissance bipolaires pour ballasts de lampes industrielles et domestiques. Gamme très variée, offrant la commutation standard et haute dans des modules de puissance couramment demandés. Increase System Reliability and Effi ciency www.fairchildsemi.com Industrial Applications Integrated solutions Fairchild Semiconductor offers the industry’s widest range of integrated motor drive solutions (50VA to 10kVA). Motion-SPM provides complete adjustable speed motor drive control and fully integrated circuit protection for AC motors in appliance applications. The PFC-SPM™ reduce component count and board space while increasing system reliability and effi ciency. The PFC-SPM™ provides 99% power factor (typical) to meet the mandatory PFC standard (IEC61000-3-2). Discrete solutions Fairchild Semiconductor offers a wide portfolio of discrete solutions. Gate Drivers: Fairchild’s high voltage gate drivers improve system reliability by using an innovative noise cancelling circuit that provides excellent noise immunity. IGBTs: Fairchild IGBTs are designed for high speed switching to improve power density, system effi ciency, and reliability compared to the MOSFET technology. SuperFETs™: N-channel SuperFET™ MOSFETs minimize conduction losses and increase switching performance by lowering RDS[ON] and gate charge (Qg). These devices are designed to operate reliably at higher frequencies. 21 www.rohs.fr Condensateurs Les derniers condensateurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection parmi les plus récentes technologies de condensateurs conformes RoHS proposées par Farnell InOne. Pour toutes informations complémentaires, veuillez consulter www.farnellinone.fr Condensateurs céramique multicouche série Série FM Série FCA & FKA Série T528 Kits de condensateurs AVX pour concepteurs Gamme élargie de condensateurs tantale et Oxicap™ Série VE Série VC32 Il s’agit de deux condensateurs connectés en série dans un seul composant, ce qui réduit le risque de court-circuit. Condensateurs électrolytiques en aluminium à faible impédance et excellente endurance, livrés dans un boîtier qui est environ 30% plus petit que celui de la série FC. Les condensateurs de ces nouvelles séries se basent sur les séries FC et FK, et ils sont réalisés spécialement pour supporter les conditions sévères de brasage par refusion. Condensateurs tantales organiques montés en surface, cathodes en polymères, présentant une faible inductance et un bon comportement en hautes fréquences. Gamme de 12 kits offrant un choix maximum d’échantillons en nombre suffisant pour servir la conception et le développement. Pour ajouter aux kits de condensateurs pour concepteurs, cinq gammes courantes élargies plus cinq nouvelles séries. Varistances radiales en métal-oxyde pour applications de protection contre les surtensions. Varistances monocouche à montage en surface, offrant des tensions assignées et des énergies transitoires plus élevées que les varistances typiques multicouches. Pour le RoHS ne vous risquez pas ailleurs Condensateurs 22 Les derniers condensateurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Séries W2H et W3H Séries W2F4 et W3F4 Série MLCC Hi-Cap Condensateurs céramiques multicouches à connexions flexibles Condensateurs Oxicap™ Série T510 Série A700 Série BXA Série ZLH Série NP Condensateurs céramiques miniatures fort courant, réunissant des condensateurs et inductances dans un seul circuit de filtre à régime permanent. Condensateurs céramiques multicouches de forte capacité dans des boîtiers compacts. Les condensateurs de cette série sont également livrables sur bobines. Condensateurs électrolytiques, dont la céramique est faite d’oxyde de niobium. En cas de défaillance sous une tension inférieure ou égale à la tension assignée, le condensateur OxiCap™ ne prend pas feu. Ensembles de condensateurs de fuite contenant quatre éléments et une connexion de mise à la masse commune, donnant une faible inductance parallèle et une excellente capacité de découplage. Les connexions flexibles garantissent une flexion minimum de 5mm sans aucune fissuration. Ces condensateurs conviennent idéalement pour les circuits-imprimés soumis à des flexions importantes. Condensateurs tantales multianodes d’une résistance série équivalente très faible, donnant un courant d’ondulation allant jusqu’à 4 ampères. Condensateurs en aluminium polymères offrant une plus grande rétention de capacité, et donc plus performants aux hautes fréquences. Conception assurant une bonne protection contre la fissuration. Condensateurs électrolytiques miniatures haute température en aluminium, à très longue durée de vie et courant d’ondulation très élevé. Série améliorée de condensateurs électrolytiques miniatures en aluminium, très fiables et à longue durée de vie, présentant une faible impédance aux hautes fréquences. Condensateurs électrolytiques aluminium, non polarisés, de type radial, présentant d’excellentes caractéristiques de fréquences, et utilisable dans les réseaux de transition. 23 www.rohs.fr Les dernières résistances RoHS Résistances visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Série WP-S Résistances de puissance bobinées et compactes résistant à la flamme, excellente tenue aux impulsions. Disponibles en versions 2W ou 4W. Deux résistances parallèles dans un seul boîtier, excellente tenue en impulsions. Série DSC Série WSL Résistances métalliques de puissance avec une grande capacité résistive aux surtensions, excellente stabilité sur une large plage de conditions environnementales. visitez www.rohs.fr visitez www.rohs.fr Résistances à couches épaisses, haute puissance, à résistance thermique extrêmement basse, livrées dans un boîtier mince pour l’installation haute densité sur circuits-imprimés. Série MHP140 Sélection parmi des milliers de nouvelles résistances conformes RoHS en provenance des plus grands fabricants. Pour toutes informations complémentaires, veuillez consulter www.farnellinone.fr Série CB10 Série CT6 Série CP16 Série Modèle 18 Potentiomètres d’ajustement en carbone, avec flèche indicatrice de position. Livrés avec axe de réglage. Potentiomètres de réglage contenant un élément moulé en résine dans un boîtier miniature. A l’abri de la poussière et du flux et stable en présence d’une forte humidité. Potentiomètres en plastique avec axe de réglage, haute résistance d’isolement et capables de supporter des tensions élevées. Différentes tailles disponibles, grande fiabilité. Diamètre 22,2mm, cadrans 15 tours et “frein à encliquetage” puissant. Pour le RoHS ne vous risquez pas ailleurs 24 Les dernières résistances RoHS Résistances visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Série SMHP Série FC Série YR1 Série RWM 6 x 22 Série BSC8 Série LVR Série B57540 Série B59601 Série 3204 Séries PRC201 et PRC221 Résistances non inductives, haute puissance, à résistance thermique extrêmement basse. Montage sur circuits-imprimés par soudure ou par clip. Résistances de précision à faible résistance interne, qui fonctionnent presque comme des résistances pures dans une bande de fréquences très large. Résistances à couches métalliques, très faible bruit et faible coefficient de tension, et excellente stabilité en présence de charges et de conditions environnementales sévères. Résistances de puissance émaillées à bobinage axial, forte dissipation et grande fiabilité. Disponibles en faible valeurs ohmiques. Résistances de détection de courant, excellente tenue en présence d’impulsions et de surtensions, livrées dans un boîtier bas profil pour montage en surface. Résistances de puissance de précision à bobinage axial offrant des valeurs de résistance extrêmement faibles et une excellente stabilité en présence de charges. Thermistances haute stabilité à coefficient de température négatif, encapsulées dans du verre avec fils “dumet”, conçues pour les hautes températures et des temps de réponse très rapide. Thermistances compactes à coefficient de température positif, conçues pour fournir une réponse rapide et fiable. Conviennent pour le brasage par refusion. Potentiomètres de réglage Cermet CMS compacts monotour, dont la disposition des bornes empêche le chevauchement des soudures. Résistances CMS, dissipation thermique de 1 watt. Les résistances de la série PRC221 sont également livrables en bobines. visitez www.rohs.fr 25 www.rohs.fr Les derniers composants optoélectroniques conformes RoHS Optoélectronique visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection de Leds mono ou multicouleurs pour l’affi chage ou la détection. Densité de flux lumineux élevée, émettant vers le haut ou le côté. Choix de couleurs. Types: BA9S, BA15D, BA15S, GX53 et S6S. Livrée sur bobines de 4,5m. 6 LED indicatrices de tension, choix de couleurs: rouge, blanc et bleu. Solution souple et modulaire pour l’éclairage. Génération la plus récente, intensité lumineuse parmi la plus élevées du marché. Intensités de flux les plus élevées dans cette catégorie, encombrement réduit. visitez www.rohs.fr visitez www.rohs.fr Système LinkLED™ LED de puissance Atlas 8,6W Source lumineuse LED - RVB (rouge, vert, bleu) Bande lumineuse flexible Ampoule de remplacement à LED Bande de LED Bande de LED de puissance, 8W LED de puissance K2 visitez www.rohs.fr visitez www.rohs.fr www.avagotech.com/LED For more information please visit our website Technical Specifications © 2006 Avago Technologies, Ltd. All rights reserved. LED Lighting Solutions Technology Features • IR-reflow solderable, compatible with standard SMT assembly process • Robust moisture sensitivity level (MLS) 2a, for flexible assembly at customers’ site • Low thermal resistance, for reliable long operating life • High current operation • Wide viewing angle • Silicon encapsulation • Available in white, blue and green color Key Applications • Portable Lighting– flash light, bicycle head light, miner’s head lamp • Focused Lighting– reading light, spot light, accent light • General Lighting– decorative, architectural & garden • Back Lighting– signs and billboards From lighting your way through the darkness to high performance lighting for your outdoor signage, Avago Technologies has a high power LED lighting solution for you. Avago’s high brightness, high performance, energy efficient LEDs can handle high thermal and high driving current. A smooth radiation pattern offers a 120º viewing angle and the low profile package design is ideal for a wide range of applications especially where height is a constraint. The ASMT-Mx00 is the first of Avago’s 1W high Power LED products with moisture sensitivity level (MSL) 2a and can be driven at 350mA. It is one of the thinnest packages available and has superior heat dissipation. It is compatible with IR soldering, and is encapsulated in a heat and UV resistant silicon compound. High brightness LED lighting solutions from Avago Technologies give you reliable, high performance illumination, flexibility of design and robust, easy to handle packaging Light up the night These products are available from Farnell InOne: www.farnellinone.com 27 www.rohs.fr Optoélectronique Les derniers composants optoélectroniques conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Montées dans un module TO-220 facilitant la dissipation thermique. LED de puissance, 350mW et 700mW LED de puissance ‘Lednium’ 10W LED de puissance Platinum Dragon LED de puissance Ostar Modules LCD d’interface série I2C Afficheurs OLED Afficheurs industriels LCD Capteur de couleurs RVB dans un boîtier QFN Capteurs de distance Convertisseur lumière-signal numérique Génération la plus récente de LED de 4,6W dans des modules à profil réduit montés en surface. Module tridimensionnel révolutionnaire donnant un angle de visualisation de 120°. Luminosité et luminance exceptionnelles dans un module en forme d’étoile thermiquement efficace. Dimensions très demandées, avec interfaçage simplifié et souple. Affichages clair, brillant et efficaces sur une large gamme de couleurs. Capacité vidéo intégrale. 6.5” à 12.1” - VGA, SVGA et XGA. Convertit la lumière pour la séparer en tensions de sortie RVB. Choix très varié, avec mesures précises entre 4,5 mm et 800 mm. Se rapproche du comportement de l’oeil humain. Option I2C offerte. Pour le RoHS ne vous risquez pas ailleurs 28 Optoélectronique Les derniers composants optoélectroniques conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Ecran couleur à matrice active, de 3.6” à 10.4” Kits de démarrage pour écrans couleurs à matrice active Sharp Module LCD interfaçable facilement Modules émetteurs/récepteurs à fibres optiques LC Kits d’évaluation des lentilles pour LED LED CMS Emetteurs et récepteurs numériques audio à fibres optiques Guides de lumière flexibles ou rigides Le plus petit multiplexeur/ démultiplexeur au monde Emetteurs infrarouges rapides à montage en surface Série ‘Strong’: brillance et facteur de contraste élevés. Livré avec contrôleur RVB, panneau d’affichage sur écran et câbles de raccordement nécessaires. Ecran couleur à matrice active 320 x 234 de 32K, avec bus d’interface 8051. Conformes aux normes de l’industrie, faible facteur de forme. Conçus pour les LEDde puissance Osram Golden Dragon et Luxeon K2. Choix très varié de couleurs et de designs, y compris le blanc. Conforme à la norme JEITA CP-1212. Livrés en tronçons de 1m et 3m de long, avec systèmes optiques correspondants. 4 et 8 voies. Haute intensité 35mW dans un très petit boîtier . To explore the possibilities or receive free samples please contact us at +49 6322 95670 or visit us online at www.cml-it.com Europe - Robert-Bunsen-Str.1, 67098, Bad Durkheim, Germany America - 147 Central Avenue, Hackensack, NJ07601 Asia - 61 Aida Street, Singapore 459975 Un-leading by example! European product range from CML Innovative Technologies now fully RoHS compliant CML Innovative Technologies (CML-IT) is producing its wide European range of miniature lighting products according to the RoHS directive from the European Commission. All devices are manufactured featuring the same product specifications as before but now comply with the RoHS' significant limitations on the use of lead, mercury, cadmium and hexavalent chromium. All lamps and bulbs in CML-IT's European product range are manufactured using lead-free glass and RoHS-compliant chips for the company's range of LEDs and Power LEDs More Innovative Technology from CML-IT! Engineering Know-How from CML-IT 30 Pour le RoHS ne vous risquez pas ailleurs Connecteur Les dernières gammes de connecteurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Vous trouverez ci-dessous une sélection de nouveaux connecteurs originaux issus des plus grands fabricants Connecteurs autodénudants 0,27 mm Série UTS de connecteurs circulaires étanches Série Harax M12 Ecomate SCE & PPS Série Datamate à montage en surface et vis d’accouplement MicroClasp Mini USB Bucanneer • Système d’accouplement triphasé robuste • Interface autodénudante très performante du type bosselé • Capot-verrou métallique et serrecâble en option assurant la fiabilité à long terme • Connecteurs circulaires en plastique IP68/IP69K • Système de blocage rapide et sûr, sertissage et installation rapides • Etanchéité extrême à l’eau • Comportant le système de raccordement rapide HARAX • Pour les applications utilisant auparavant du câble préassemblé • Connecteur ergonomique et résistant à la poussière • Convient pour usage dans des environnements hostiles • Utilisable avec câbles de 6 à 12,5 mm de diamètre • Connecteurs miniatures PPS (du type push-pull) et SCE (à désaccouplement) et assemblages de câbles • Robustes avec excellente étanchéité (IP65 à IP68) • Nouveaux connecteurs J-Tek (vis d’accouplement) venant s’ajouter à la gamme Datamate très fiable de Harwin • Livrés en double rangée, de 6 à 50 voies • Nouveau connecteur MicroClasp™ au pas de 2,00 mm • Système fils/cartes à simple et double rangée conçu par Molex • Conception unique pour le marché des connecteurs • Nouveau Mini USB Buccaneer - résistant à la poussière conformément à IP68 après accouplement • Câbles livrés en tronçons longueurs de 2, 3 et 4,5m Farnell InOne exclusif 31 www.rohs.fr Connecteurs Les dernières gammes de connecteurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Connecteurs Sub D avec filtres Connecteurs Sub D double empilage I Pass Série ZDC, SMA, SMC Accessoires modulaires HAN Connecteurs pour câbles plats souples Mate N Lock Type RJ48 Fiches et douilles de test 1mm Champ RJ • Mini-connecteurs Harting bas profil et autodénudants pour circuits imprimés • Hauteur après montage inférieure à 5,5 mm • Connecteurs Sub D à montage sur carte, et empilables • Réduisent l’espace total occupé sur le circuit-imprimé par les connecteurs individuels • Totalement interconnectables avec les autres connecteurs Sub D • Ensembles connecteurs et câbles offrant une plus grande densité et des vitesses plus élevées • Solution idéale pour l’interconnexion dans le marché des serveurs en pleine croissance • Solutions rentables pour applications commerciales • Composants moulés de précision avec diélectriques thermoplastiques • La série comprend à présent les connecteurs SMA et SMC • Gamme plus étendue d’accessoires modulaires HAN • Comprenant USB (bus série universel), Firewire, D Sub et DDD • Les nouveaux accessoires comprennent des serre-câble métalliques et en plastique Tyco Electronics présente sa gamme de connecteurs pour câbles plats souples (FFC). Tailles 0,5mm à 1,25mm, 4 à 30 voies. Montage en surface et options ZIF prévues. • Farnell InOne ajoute à sa gamme de connecteurs Mate N Lock • Utiles pour les connexions internes des équipements, fils à fils, et fils à cartes • Nouvelle gamme RJ48 10 voies proposée par Farnell InOne • Fiche sans blindage et fiche à angle droit sans blindage • Fiches et douilles de test 1mm pour le raccordement fiable dans les espaces très restreints • Livrés en un choix de couleurs • Permet de transformer les groupes de cordons standard RJ45 ou USB pour usage dans les applications industrielles • Etanchéité assurée en une minute - sans aucun outillage 32 Pour le RoHS ne vous risquez pas ailleurs Les dernières gammes d’accessoires conformes RoHS Accessoires visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection dans notre gamme courante de vêtements/ équipements de protection antistatique et d’accessoires pour semi-conducteurs Connecteurs d’extension mémoire DIMM Matériau conducteur thermique Sil-Pad SP900S Ruban auto-adhésif à conductivité thermique Bond-Ply 100 Matériau conducteur thermique Gap-Pad™ Ensembles de dissipateurs thermiques avec ventilation forcé en option Ensembles de bracelets économiques Bracelet ajustable économique Cordons de mise à la terre économique Comportant SDRAM, DRAM DDR, DDR1 et DDR2. Grosseur moyenne, haute conformité et faible impédance thermique. Ruban adhésif très performant, à conductivité thermique, et à forte adhérence. Elément de conduction thermique, placé entre les dissipateurs thermiques et les circuits électroniques. Dissipateurs thermiques à utiliser avec les modules d’alimentation isolés Semikron: Semipack, Semitrans et redresseurs en pont Semipoint. Bracelet ajustable et cordon spiralé de mise à la terre de 3m. Non allergénique - pas de fibres en acier inoxydable, choix de boutons 4mm ou 10mm. Cordons jaunes à haute visibilité, longueur déployée 3m. 33 www.rohs.fr Les dernières gammes d’accessoires conformes RoHS Accessoires visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Talons de mise à la terre économique Kit d’entretien sur le terrain Ioniseur de table Vestes et blouses de protection antistatiques Tablier de mise à la terre (ESD) Caisses antistatiques pour pièces détachées Couvre-chaussure jetable antistatique Appareil de contrôle continu des bracelets de mise à la terre Boîte à outils antistatique Sonde à anneaux concentriques Talons durables double couche en PVC/caoutchouc nitrile à dissipation/ conduction. Kit d’entretien sur le terrain offrant une protection optimale contre l’électricité statique. Ioniseur compact et léger à autoéquilibrage, courant continu. Montage sur banc ou mural. Vêtements antistatiques fabriqués avec du tissu haute qualité. Protège les vêtements des salissures et des taches dans la zone de protection électrostatique. Caisses empilables fabriquées en polypropylène E9 à propriétés antistatiques permanentes. Modèle élégant et confortable, revêtement en polyuréthane, résistant aux produits chimiques avec sole non glissante. Signale toute interruption accidentelle de la boucle de mise à la terre dans une zone de protection électrostatique. Boîte à outils robuste, résistant aux chocs, fabriquée en E9 durAstatic. Mesure la résistivité de surface des matériaux. 34 Pour le RoHS ne vous risquez pas ailleurs Câbles Les dernières gammes de câbles conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection de produits dans notre gamme de câbles et accessoires conformes RoHS pour des applications très variées. Pour toutes informations complémentaires, veuillez consulter www.farnellinone.fr Fils UL pour la connexion des équipements XTRA-GUARD® 1 - Câble de transmission de données Câble Belden Câble coaxial Presse-étoupes SKINTOP® et SKINDICHT® Marqueurs Helagrip en chevrons Attaches et montures de câble Panduit Gaines thermorétractables Fil de connexion UL1007, 1015, 1061 & 1213, à isolant en PVC et TFE. Conducteurs torsadés en cuivre étamé. Applications possibles: périphériques connectés aux ordinateurs, équipements commerciaux, électroniques médicaux et autres environnements de haute technologie. Gamme variée de câbles à paires torsadées offrant un large choix de longueurs, d’applications et de nombres de paires. Gamme de câbles coaxiaux proposée par Nexans - Possibilité de coupe au mètre. Gamme de presse-étoupes, contreécrous et bouchons en nylon, polyamide et laiton nickelé. Gamme de marqueurs de câble en PVC. Gamme Panduit d’attaches et de montures et plaques de fixation de câble adhésives/vissées. Tubes souples en polyoléfine livrés en longueurs de 1,2 m et aussi sur bobines. Choix varié de couleurs et de tailles. Et si vous pouviez devenir quelqu’un d’autre? NXP– La nouvelle compagnie née de Philips Semiconducteurs Avec toute l’énergie d’un nouveau commencement, alimenté par 50 années de sagesse, NXP Semiconducteurs est prêt à répondre à toutes vos questions, et tout spécialement aux questions impossibles. Celles qui ne sont encore que des rêves, mais qui se transformeront rapidement en expériences sensorielles étonnantes. Conduit par l’ouverture d’esprit et la curiosité d’un nouveau-né, NXP est déjà à l’avant-garde d’un univers vibrant des technologies multimédias. Cette position de leader se reflète dans les milliards de dollars investis dans les projets de recherche, le dépôt de plus de 25 000 brevets, ainsi que dans le nombre de solutions innovantes dans les secteurs de l’identification, de l’automobile, de la mobilité et de l’électronique domestique. Découvrez comment vos idées d’avant-garde peuvent être vues, entendues et ressenties d’une manière totalement nouvelle sur www.what-if-you-could.com, parce que la question à partir de maintenant est la suivante: qu’aimeriezvous mettre en question? Et si vous pouviez Pour le RoHS ne vous risquez pas ailleurs 36 Pro-Power La dernière gamme Pro-Power conforme RoHS Gaines thermorétractable 2:1 Fils d’équipements Fil pour appareillage de commutation conforme TRI Câble résistant à la chaleur de 1/0,80mm Fil de connexion Câble coaxial RG58BU/CU Gaines thermorétractable 3:1 à revêtement adhésif Gaine thermorétractable 4:1 en PTFE Gaine isolante Gaine en PTFE Tube thermorétractable 2:1 ignifuge, livré en longueurs différentes. Fils d’équipements de 1/0,60mm à isolant en PVC. Entre autres applications: câblage des tableaux de commutation et de commande, et câblage interne général. Câbles à âme unique servant normalement au câblage d’éclairage fluorescent. Fil de connexion homologué UL et certifié CSA. Câbles coaxiaux à isolant en polyéthylène solide. Tube thermorétractable de rapport 3:1 à revêtement adhésif noir. Gaine thermorétractable haute température en PTFE translucide naturel. Gaine isolante en PVC souple sans plomb, livrée en bobines de 100m. Excellentes propriétés d’isolement, convient idéalement pour les applications haute température. visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr A selection of quality products from Pro-Power - platine à adaptateur multiple doté de six éléments semi-conducteurs micro-miniature - fibre de verre époxyde FR4 1,50 mm, simple face 35 μm CU - côté des composants chimiques nickel/or, cache d'arrêt de brasage et impression d'équipement - le placement de vingt différents types de semi-conducteurs énoncés dans le tableau est possible sur la platine - baguette à 8 broches pas 2,54 mm, diamètre de perçage 1,00 mm - point rainuré destiné à la rupture de séparation des modules - données de Gerber pour la fabrication de la cache d'arrêt de brasage et de l'impression de la pâte à braser sont gratuitement mises à disposition sur simple demande - dimensions 22,86 mm x 46,72 mm Layout Pad Size Pad Pitch Taille Configuration Occupation TO252 * * * * TO252 SOT223 * * * * SOT223 SOT89 * * * * SOT89A SOT23 0,71 x 1,0 mm 0,95 mm 2,4 mm 2 Reihen x 3 SC59, SC74 SC74A,SMT3, SMT5, SMT6, SOT23, SOT23-5, SOT23-6 SOT23-8 0,46 x 1,1 mm 0,65 mm 2,4 mm 2 Reihen x 4 SC70, SC88A, SOT23-8, UMT3, UMT5, UMT6 SC75 * * * * EMT3, SC75 SOT 23 Multiadaptateur-CMS RE901 26 Réaliser un circuit de protection fiable La technologie HDMI comble cet écart en utilisant des débits de transmission très élevés, jusqu’à 10Gbit/s (norme HDMI 1.3). En raison de leur microélectronique complexe, les téléviseurs à écran plat sont extrêmement sensibles aux surtensions transitoires, telles que les ESD (surtensions électrostatiques). La protection ESD de l’interface HDMI présente un défi particulier pour les fabricants d’équipements électroniques grand public. Il y a de très fortes chances qu’une impulsion ESD atteigne l’appareil si des câbles périphériques sont touchés ou si des connecteurs sont débranchés. L’impulsion circule alors du terminal vers la carte, détruisant potentiellement la carte ou ses composants. Les diodes à semiconducteurs conventionnelles ne sont pas bien adaptées à la protection ESD dans les téléviseurs à écran plat car leurs propriétés protectrices commencent à s’altérer à partir de 25°C (réduction des caractéristiques de fonctionnement). À l’opposé, la CeraDiode, développée par EPCOS, est immunisée contre les températures élevées souvent rencontrées dans les téléviseurs LCD et plasma. Ses propriétés protectrices restent stables jusqu’à une température de fonctionnement de 85°C. La CeraDiode est fabriquée à base d’oxydes de céramique selon une technologie multicouche. Ces composants suppriment efficacement les tensions transitoires. Ses couches sont composées de nombreux grains d’oxyde de zinc, formant une micro- CeraDiode, comparable à une diode Zener. Grâce au grand nombre de micro-CeraDiodes individuelles, la puissance globale ESD d’une CeraDiode est supérieure à celle d’une diode de suppression, qui ne présente qu’une simple jonction PN. Les CeraDiodes offrent une résistance très stable, insensible aux variations de température et aux tensions de polarisation continues. Cela signifie que la résistance elle-même peut servir de filtre pour les composants haute fréquence, remplaçant ainsi plusieurs composants externes qui auraient été nécessaires pour la protection ESD et la fonction de filtrage. En raison de leur structure interne et d’un boîtier plus petit, les CeraDiodes ont des inductances parasites très faibles, par conséquent, les temps de réponse sont inférieur à 0,5ns et garantissent une protection ESD fiable. Les diodes de suppression ont des temps de réponse de 0,8ns ou plus en raison d’un format plus grand et d’une inductance parasite supérieure. Les CeraDiodes ne sont pas seulement une alternative rentable par rapport aux composants de protection ESD à base de semiconducteurs – comme les diodes Zener ou TVS – Elles offrent également des avantages techniques. Elles remplacent dans de nombreux cas une diode à semiconducteur sans modifications. Les CeraDiodes étant des composants bidirectionnels, il n’y a aucun risque de mauvais positionnement au cours du processus de placement automatique. Avoir une norme de connexion numérique à haut débit pour la transmission audio et vidéo de qualité optimale n’a jamais été un besoin aussi pressant qu’aujourd’hui. L’utilisation très répandue des écrans plats et l’avènement de la télévision haute définition (jusqu’à 1920 x 1080 pixels) ont créé un réel décalage dans le domaine de la connexion. 0 Time [ns] 1.8 875 -875 Voltage [mV] Source Eye Diagram 17 Les tendances du marché incitent à réduire la consommation d’énergie tout en continuant à satisfaire aux demandes de performances et de fonctionnalités accrues. Plusieurs domaines sont concernés par l’optimisation, comme la technologie des semiconducteurs, les techniques de conception, les architectures système, les configurations de plate-forme et les méthodes de conception. Cette optimisation s’étend également au logiciel système, un composant intégral des produits à base de semiconducteurs. La consommation électrique dans les circuits intégrés CMOS est en général classée en puissance dynamique dans un circuit de commande, comme la puissance commutée et la puissance statique ; la déperdition d’électricité qui est mesurée à chaque fois qu’un circuit est mis sous tension en est un exemple. Traditionnellement, la puissance statique consomme moins d’énergie que la puissance dynamique. Cependant, du fait que les configurations CMOS continuent à se réduire, la puissance statique commence à représenter une portion plus importante de l’énergie totale utilisée. Par conséquent, les technologies d’économie d’énergie doivent s’attaquer aux deux formes de consommation électrique. Exemple d’application : Microcontrôleurs QE128 Le ColdFire V1 MCF51QE128 (32 bits) fait partie de la série de microcontrôleur Flexis. La série Flexis fait preuve d’une efficacité énergétique optimale, prolongeant la durée de vie des batteries dans les applications portables grâce à des modes de veille prolongée « Deep-Sleep ». Chaque appareil dispose de plusieurs modes d’arrêt, en plus des nouveaux modes d’attente et de fonctionnement en basse puissance, chacun d’eux économisant encore plus l’énergie consommée. Les modes d’attente et de fonctionnement en basse puissance permettent à l’appareil d’opérer en mode basse puissance avec tous les périphériques activés. En outre, un oscillateur externe 32KHz ultra-basse puissance consomme moins de 1uA et peut être utilisé dans toutes ces configurations. Normalement, en mode exécution un circuit intégré doit fonctionner à une fréquence d’au moins 1MHz. Les passages répétés entre le mode veille et le mode réveil pour contrôler les besoins et les événements système peuvent augmenter considérablement la consommation d’énergie (les arborescences peuvent consommer jusqu’à 40% de la puissance active du circuit). Les MCU QE128, par contre, utilisent un oscillateur 32kHz avec un courant d’alimentation très faible, évitant ainsi les pointes de courant qui se produisent normalement lors de chaque changement de mode. Les MCU QE128 sont fabriqués à l’aide d’une technique LVLP (basse tension – basse puissance), utilisant des transistors avec une longueur de canal plus grande pour réduire le courant de fuite qui, à terme, diminue la consommation de puissance statique. La bibliothèque de cellules standard a aussi été considérablement optimisée et comprend des éléments basse puissance. Ces appareils sont également dotés d’un registre périphérique ‘clock gating’ pour désactiver les modules non utilisés, ainsi que l’oscillateur externe 32kHz qui fournit une source d’horloge précise au compteur temps réel. Collaborer pour un rendement énergétique rentable Enfin, l’efficacité énergétique est mesurée par rapport aux besoins du client. Que l’application nécessite une longévité batterie accrue ou une diminution de la dissipation thermique, les concepteurs se basent sur les semiconducteurs qui répondent à leurs exigences de performance sans dépasser le budget énergie fixé. Freescale travaille en étroite collaboration avec ses clients pour définir clairement les paramètres de performance énergétique requis. Cette étroite collaboration contribue à optimiser des solutions en vue de développer facilement des applications économiques d’énergie, accélérer la commercialisation et rendre le produit fini plus attrayant pour les clients. L’efficacité énergétique pour un rendement optimum Les fabricants de produits électroniques disent que l’objectif de performance pure n’est plus leur préoccupation première. Il s’agit désormais de réduire la facture énergétique au maximum, en raison de l’augmentation des coûts et des responsabilités environnementales. Produits Luxeon, SuperFlux et SnapLED G U I D E D E S P R O D U I T S 2 Qu’est-ce que Luxeon ? Les diodes Luxeon sont les diodes électroluminescentes qui ont le flux lumineux le plus élevé au monde, pour fournir les solutions d’éclairage à semiconducteurs les plus lumineuses. La couleur blanche Luxeon produit plus de 20 lumens par Watt ; les diodes Luxeon sont 10 à 20 fois plus lumineuses que les DEL standard, ce qui permet d’obtenir des densités lumineuses de 5 à 20 fois supérieures. Luxeon est une source lumineuse optimale. Dure plus longtemps que toute autre source lumineuse — plus de 10 ans Luxeon a recours à des technologies de semi-conducteurs utilisées dans la Silicon Valley et similaires à celles des derniers microprocesseurs. A la différence des sources lumineuses classiques, les DEL ne tombent pas en panne d’un seul coup, dans le sens où elles ne brûlent pas et ne cessent de fonctionner sans prévenir. Dans de nombreuses applications, les solutions Luxeon fonctionnent pendant plus de 10 ans. Frais de maintenance réduits Du fait que les produits Luxeon durent au moins 10 fois plus longtemps qu’une source lumineuse classique, il n’est pas nécessaire de remplacer la source lumineuse, ce qui réduit, et même élimine, les frais de maintenance récurrents et de remplacement de l’éclairage. Meilleur rendement énergétique Adoptez la solution écologique. Luxeon, avec un meilleur rendement que les sources halogènes et incandescentes, se rapproche rapidement du rendement des solutions fluorescentes. Couleurs vives saturées — sans filtre Luxeon ne nécessite aucun filtre pour générer une lumière colorée, ce qui a pour effet des couleurs saturées plus profondes sans perte de lumière. La profondeur des rouges, verts et bleus est générée directement par cette source lumineuse à semi-conducteur. Eclairage dirigé pour améliorer le rendement lumineux Les sources lumineuses Luxeon sont de petits points de lumière directionnels. Leur taille et la commande de leur direction en font des systèmes optiques très contrôlables, sans gaspillage de lumière. Eclairage à semi-conducteurs fiable Les sources lumineuses Luxeon sont des appareils à semi-conducteurs. Elles ne comportent pas de pièces mobiles, aucun élément susceptible de rompre, de se briser, de fuir ou de contaminer l’environnement. Contrôle dynamique des couleurs, réglable sur le blanc Les couleurs vives et saturées de Luxeon permettent d’obtenir une large gamme d’effets d’éclairage statiques et dynamiques. Du blanc réglable à une seule lumière capable de générer numériquement n’importe quelle couleur de l’arc-en-ciel, Luxeon ouvre de nouvelles dimensions au monde de l’éclairage. Totalement réglable — sans variation de couleur Les sources lumineuses Luxeon sont totalement réglables — plus de 1000 fois — sans compromettre les caractéristiques de la lumière. Pas de mercure dans la source A la différence de la plupart des sources fluorescentes, Luxeon ne contient pas de mercure. Absence de chaleur ou d’UV dans le rayon lumineux Pas de rayons ultraviolets ou infrarouges nuisibles dans le rayon lumineux Luxeon. Démarrage à froid Luxeon n’a aucun problème de démarrage aux basses températures — jusqu’à -400 C. Fonctionnement basse tension CC Luxeon est un appareil à semi-conducteur commandé par le courant, qui fonctionne sous des tensions aussi faibles que 3,5 VCC. Caractéristiques Luxeon 3 Conservation supérieure de l’intensité lumineuse — par conception Les sources lumineuses Luxeon ne contiennent pas d’époxy. L’époxy se dégrade dans le temps, ce qui entraîne une médiocre conservation de l’intensité lumineuse. La technologie Luxeon apporte une conservation supérieure de l’intensité lumineuse par rapport à d’autres sources semi-conductrices et aux éclairages classiques. Meilleur rendement — par conception La lumière émise par un produit Luxeon est directionnelle. Les sources lumineuses classiques (incandescentes, halogènes, fluorescentes) sont omnidirectionnelles : la lumière est émise dans toutes les directions. Pour éclairer un objet, la lumière qui n’est pas dirigée vers l’endroit voulu doit être redirigée au moyen d’optiques secondaires. Chaque fois qu’un rayon lumineux est reflété, il perd de son intensité. Les pertes typiques sont de l’ordre de 40 à 60 % : cela signifie que dans certains cas, la moitié de la lumière générée par la source est dirigée vers l’endroit voulu. La nature dirigée de la lumière Luxeon fournit des rendements de 80 à 90%. L’intensité lumineuse totale nécessaire est donc inférieure pour obtenir la même luminosité. Par exemple, la source Luxeon Star/O génère un rayon étroit de 2x5 degrés avec un rendement optique égal à 85 %. Lorsque vous envisagez d’utiliser un produit Luxeon comme source lumineuse, il est important de prendre en compte tous les facteurs, y compris le modèle de rayonnement le plus adapté à votre application. Il existe différents modèles de rayonnement pour de nombreux produits Luxeon. Le choix et la conception du modèle de rayonnement améliore notablement le rendement de votre système d’éclairage. 0 20 40 60 80 100 120 4000 8000 12000 20000 temps (heures) puissance lumineuse relative % DEL blanche 5 mm incandescence typique luxeon forte puissance déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % aile de chauve-souris modèle de rayonnement (sans optique) -100 0 100 20 60 100 Supériorité de la conception lambert modèle de rayonnement (sans optique) -100 20 60 100 0 100 déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % émission latérale modèle de rayonnement (sans optique) 20 60 100 -120 0 120 déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % 0 - 40 20 60 100 40 modèle de rayonnement optique de réglage déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % 4 Diode Luxeon Emitter Description La puissance Luxeon sous sa forme la plus basique. Concevez et construisez votre source lumineuse Luxeon selon vos spécifications. Diodes standard Luxeon disponibles en blanc chaud, blanc, vert, cyan, bleu, bleu roi, rouge, rouge/orange et ambre. LXHL-BW02 Blanc 5500 K 25 LXHL-BW03 Blanc chaud 3300 K 20 LXHL-BM01 Vert 530 nm 30 LXHL-BE01 Cyan 505 nm 30 LXHL-BB01 Bleu 470 nm 10 LXHL-BR02 Bleu roi 455 nm 150 mW LXHL-BD01 Rouge 625 nm 27 LXHL-BL01 Ambre 590 nm 25 LXHL-BD03 Rouge 625 nm 42 LXHL-BH03 Rouge/Orange 617 nm 55 LXHL BL03 Ambre 590 nm 42 LXHL-PL01 Ambre 590 nm 42 LXHL-DW01 Blanc 5500 K 22 LXHL-DM01 Vert 530 nm 27 LXHL-DE01 Cyan 505 nm 27 LXHL-DB01 Bleu 470 nm 9 LXHL-DR01 Bleu roi 455 nm 135 mW LXHL-DD01 Rouge 625 nm 40 LXHL-DH01 Rouge/Orange 617 nm 50 LXHL-DL01 Ambre 590 nm 38 Aile de chauve-souris Lambert Emission latérale DESSINS A L’ECHELLE REELLE LXHL-PM01 Vert 530 nm 30 LXHL-PE01 Cyan 505 nm 30 LXHL-PB01 Bleu 470 nm 10 LXHL-PR03 Bleu roi 455 nm 150 mW LXHL-PD01 Rouge 625 nm 44 LXHL-PH01 Rouge/Orange 617 nm 55 LXHL-PW01 Blanc 5500 K 25 Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement Luxeon Star 5 LXHL-FD1C N/A N/A Rouge 625 nm 40 — LXHL-FH1C N/A N/A Rouge/Orange 617 nm 50 — LXHL-FL1C N/A N/A Ambre 590 nm 38 — Description Modules Luxeon de forme carrée et hexagonale. Fournis avec connecteur AMP 2 broches, ou pastilles à souder pour la connexion électrique. Pour un contrôle précis du rayonnement, également disponible avec optique secondaire PMMA à haut rendement. Disponible en blanc, blanc chaud, vert, cyan, bleu, bleu roi, rouge, rouge/orange et ambre. LXHL-MM1C LXHL-MM1A LXHL-NM98 Vert 530 nm 30 600 LXHL-ME1C LXHL-ME1A LXHL-NE98 Cyan 505 nm 30 600 LXHL-MB1C LXHL-MB1A LXHL-NB98 Bleu 470 nm 10 200 LXHL-MRRC LXHL-MRRA LXHL-NRR8 Bleu roi 455 nm 150 mW 120 LXHL-MD1C LXHL-MD1A LXHL-ND98 Rouge 625 nm 27 810 LXHL-ML1C LXHL-ML1A LXHL-NL98 Ambre 590 nm 25 750 LXHL-MDAC N/A N/A Rouge 625 nm 42 — LXHL-MHAC N/A N/A Rouge/Orange 617 nm 55 — LXHL-MLAC N/A N/A Ambre 590 nm 42 — LXHL-MW1D LXHL-MW1B N/A Blanc 5500 K 25 — LXHL-MM1D LXHL-MM1B N/A Vert 530 nm 30 — LXHL-ME1D LXHL-ME1B N/A Cyan 505 nm 30 — LXHL-MB1D LXHL-MB1B N/A Bleu 470 nm 10 — LXHL-MRRD LXHL-MRRB N/A Bleu roi 455 nm 150 mW — LXHL-MD1D LXHL-MD1B LXHL-ND94 Rouge 625 nm 44 660 LXHL-MH1D LXHL-MH1B LXHL-NH94 Rouge/Orange 617 nm 55 825 LXHL-ML1D LXHL-ML1B LXHL-NL94 Ambre 590 nm 42 540 LXHL-FW1C N/A N/A Blanc 5500 K 22 — LXHL-FM1C N/A N/A Vert 530 nm 27 — LXHL-FE1C N/A N/A Cyan 505 nm 27 — LXHL-FB1C N/A N/A Bleu 470 nm 10 — LXHL-FR1C N/A N/A Bleu roi 455 nm 135 mW — Blanc chaud 3300 K 20 200 LXHL-MWEC LXHL-MWEA LXHL-NWE8 Blanc 5500 K 25 500 DESSINS A L’ECHELLE REELLE LXHL-MWGC N/A LXHL-NWG8 La valeur “Lumens typique” pour les produits Star/O est approximativement inférieure de 10% à la même valeur pour les produits Luxeon Star sans optique de réglage. Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Candela typique (Star/O) Modèle de rayonnement Star (aile de chauve-souris, Lambert) Star/O (avec optique) Star (émission latérale) Star/C (avec connecteur) Référence Luxeon Star Référence Luxeon Star/C Référence Luxeon Star/O Emission latérale Lambert Aile de chauve-souris Pour de plus amples informations, veuillez visiter le site www.luxeon.com. 6 Luxeon III Emitter & Star Star Modules Luxeon de forme hexagonale. Deux ou trois fois plus de lumière que les produits Luxeon I. Livré avec pastilles à souder pour la connexion électrique. Disponibles en blanc, vert, cyan, bleu et bleu roi. Prévu pour fonctionner en 700 mA et 1000 mA. Emitter La puissance Luxeon III sous sa forme la plus basique. Concevez et construisez votre source lumineuse Luxeon III selon vos spécifications. Luxeon III est prévu pour fonctionner en 700 mA et 1000 mA. Les diodes Luxeon III sont disponibles en blanc, vert, cyan, bleu et bleu roi. LXHL-PW09 Blanc 5500 K 65 80 LXHL-PM09 Vert 530 nm 64 80 LXHL-PE09 Cyan 505 nm 64 80 LXHL-PB09 Bleu 470 nm 23 30 LXHL-PR09 Bleu roi 455 nm 340 mW 450 mW Lambert Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP (700 mA) Lumens TYP (1000 mA) Modèle de rayonnement Pour de plus amples informations, veuillez visiter le site www.luxeon.com. LXHL-LW3C Blanc 5500 K 65 80 LXHL-LM3C Vert 530 nm 64 80 LXHL-LE3C Cyan 505 nm 64 80 LXHL-LB3C Bleu 470 nm 23 30 LXHL-LR3C Bleu roi 455 nm 340 mW 450 mW Lambert Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP (700 mA) Lumens TYP (1000 mA) Modèle de rayonnement DESSINS A L’ECHELLE REELLE Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement 7 Luxeon V Emitter & Star Star Star (émission latérale) Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement LXHL-LM5C Vert 530 nm 120 LXHL-LE5C Cyan 505 nm 120 LXHL-LB5C Bleu 470 nm 45 LXHL-LR5C Bleu roi 455 nm 500 mW LXHL-FW6C Blanc 5500 K 105 Emission latérale LXHL-FM5C Vert 530 nm 110 LXHL-FE5C Cyan 505 nm 110 LXHL-FB5C Bleu 470 nm 27 LXHL-FR5C Bleu roi 455 nm 450 mW Star Modules Luxeon de forme hexagonale. Quatre fois plus de lumière que les produits Luxeon standard. Livré avec pastilles à souder pour la connexion électrique. Disponibles en vert, cyan, bleu et bleu roi. Les diodes Luxeon V portables, disponibles en blanc, sont conçues pour les applications avec piles (1000 heures), les «lampes de mineur» et les issues de secours. Lambert Emission latérale LXHL-LW6C Blanc 5500 K 120 Lambert Remarque : Les diodes portables Luxeon V sont conçues et spécifiées pour une durée de vie de 1 000 heures. Voir la fiche technique (document DS40) pour la conservation de l’intensité lumineuse. Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Lambert Emission latérale LXHL-PM02 Vert 530 nm 120 LXHL-PE02 Cyan 505 nm 120 LXHL-PB02 Bleu 470 nm 45 LXHL-PR02 Bleu roi 455 nm 500 mW LXHL-DM02 Vert 530 nm 110 LXHL-DE02 Cyan 505 nm 110 LXHL-DB02 Bleu 470 nm 27 LXHL-DR02 Bleu roi 455 nm 450 mW LXHL-PW03 Blanc 5500 K 120 Lambert LXHL-DW03 Blanc 5500 K 105 Emission latérale Luxeon V Emitter Remarque : Les diodes portables blanches Luxeon V sont conçues et spécifiées pour une durée de vie de 1 000 heures. Voir la fiche technique (document DS40) pour la conservation de l’intensité lumineuse. Emitter La puissance des diodes Luxeon V et Luxeon V portables sous sa forme la plus basique. Concevez et construisez votre source lumineuse Luxeon V selon vos spécifications. Les diodes Luxeon V sont disponibles en vert, cyan, bleu et bleu roi. Les diodes portables Luxeon V sont disponibles en blanc. Luxeon V Portable DESSIN A L’ECHELLE REELLE Luxeon V Star Luxeon V Portable Star 8 Luxeon Warm White LXHL-BW03 Blanc chaud 3300 K 20 Aile de chauve-souris LXHL-NWG8 Blanc chaud 3300 K 17 Avec optique de réglage Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement Description Les produits Luxeon Emitter et Star Warm White sont les seules sources de lumière blanche à semi-conducteurs de faible CCT et de CRI élevé. Avec un indice de rendu des couleurs de 90 et une température de couleur corrélée de 3200 K, les produits Luxeon en lumière blanche ouvrent la porte à l’utilisation plus importante d’éclairages par semi-conducteurs dans les applications intérieures et spécialisées en apportant le caractère apaisant et chaud des lampes incandescentes et halogènes. DESSINS A L’ECHELLE REELLE Emitter LXHL-MWGC Blanc chaud 3300 K 20 Aile de chauve-souris Pour de plus amples informations, veuillez visiter le site www.luxeon.com. LXHL-BRD1 Bleu dentaire 460nm 140mw Aile de chauve-souris LXHL-PRD5 Bleu dentaire 460nm 600mw Lambert 9 Luxeon Dental Référence Couleur Longueur d’onde dominante ou temp. couleur Puissance Radiométrique Typique Modèle de rayonnement LXHL-MRD1 Bleu dentaire 460nm 140mw Aile de chauve-souris LXHL-LRD5 Bleu dentaire 460nm 600mw Lambert Star Emitter Description Les solutions Luxeon Dental incluent les produits Luxeon et Luxeon V qui offrent deux options de correction des puissances élevées. La gamme Luxeon Dental est disponible en configurations diode et étoile qui permettent une conception souple des systèmes de corrections de puissance. Les produits Luxeon Dental sont choisis sur la base de la longueur d’onde en pointe pour des temps de correction courts. Ils sont produits avec des niveaux élevés de puissance minimale pour fournir la courte longueur d’onde bleue nécessaire à la réduction des temps de correction tout en autorisant des baguettes portatives. Cette gamme révolutionnaire est particulièrement adaptée au secteur des soins dentaires pour fournir le meilleur rendement nécessaire à ces applications. Pour de plus amples informations, veuillez visiter le site www.luxeon.com. DESSINS A L’ECHELLE REELLE 10 Luxeon DCC DESSIN A L’ECHELLE REELLE Description Luxeon DCC est une matrice linéaire de DEL Luxeon RVB spécialement conçue comme source lumineuse de rétro-éclairage des écrans à cristaux liquides (LCD). Pour ces applications, Luxeon DCC offre des avantages significatifs par rapport aux solutions classiques et à base d’autres DEL. Luxeon DCC permet aux fabricants de réaliser des écrans plus lumineux, plus colorés et plus solides avec des avantages concurrentiels sur le marché. Lumileds a mis rassemblé les compétences de base pour profiter des caractéristiques uniques de chaque diode Luxeon. Chacune a été choisie pour compléter les caractéristiques de chaque autre diode de la source lumineuse. LXHL-MGAA 99 x 32 LXHL-MGBA 153 x 32 Source lumineuse Taille (mm) 5” 7” 8” 9” 10.1” 12.1” 15.0” 18.1” 4:3 16:10 4:3 4:3 4:3 4:3 4:3 4:3 Taille & proportions de l’écran B S B B B S LXHL-MGCA 225 x 32 LXHL-MGDA 306 x 32 B S S B LXHL-MGEA 360 x 32 B S= source lumineuse Luxeon DCC placée sur le côté de l’écran B= source lumineuse Luxeon DCC placée au bas de l’écran 11 Luxeon Flood LXHL-MWCA Blanc 5500 K 300 LXHL-MMCA Vert 530 nm 360 LXHL-MECA Cyan 505 nm 360 LXHL-MBCA Bleu 470 nm 120 LXHL-MDCA Rouge 625 nm 320 LXHL-MLCA Ambre 590 nm 300 LXHL-MWJA Blanc 5500 K 450 LXHL-MMJA Vert 530 nm 540 LXHL-MEJA Cyan 505 nm 540 LXHL-MBJA Bleu 470 nm 180 LXHL-MDJA Rouge 625 nm 480 LXHL-MLJA Ambre 590 nm 450 LXHL-MDCB Rouge 625 nm 525 LXHL-MLCB Ambre 590 nm 500 LXHL-MDJB Rouge 625 nm 790 LXHL-MLJB Ambre 590 nm 750 12 18 12 18 Aile de chauvesouris Lambert Nombre Référence Couleur de DEL Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Description Matrice rectangulaire de 12 ou 18 sources lumineuses Luxeon densément conditionnées. Connecteur AMP fourni pour faciliter la connexion électrique. Disponible en blanc, vert, cyan, bleu, rouge et ambre. DESSIN A L’ECHELLE REELLE 12 Luxeon Line & Ring LXHL-NW97 Blanc 5500 K 125 LXHL-NM97 Vert 530 nm 150 LXHL-NE97 Cyan 505 nm 150 LXHL-NB97 Bleu 470 nm 50 LXHL-ND93 Rouge 625 nm 225 LXHL-NL93 Ambre 590 nm 215 LXHL-NW96 Blanc 5500 K 250 LXHL-NM96 Vert 530 nm 300 LXHL-NE96 Cyan 505 nm 300 LXHL-NB96 Bleu 470 nm 100 LXHL-ND92 Rouge 625 nm 450 LXHL-NL92 Ambre 590 nm 425 Jusqu’à 6 Luxeon Ring Jusqu’à 12 Luxeon Ring Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Configuration Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Ring Matrices circulaires de 6 ou 12 sources lumineuses, utilisables séparément ou conjointement. Livrées avec optique secondaire PMMA haut rendement pour le contrôle précis du rayonnement. Connecteur AMP 2 broches fourni pour faciliter la connexion électrique. Disponible en blanc, vert, cyan, bleu, rouge et ambre. Line Matrice linéaire de 12 sources lumineuses Luxeon. Livrée avec optique secondaire PMMA haut rendement pour le contrôle précis du rayonnement. Deux connecteurs AMP 2 broches permettent la connexion en chaîne de mètres de lumière. Disponible en blanc, vert, cyan, bleu, rouge et ambre. LXHL-NW99 Blanc 5500 K 250 LXHL-NM99 Vert 530 nm 300 LXHL-NE99 Cyan 505 nm 300 LXHL-NB99 Bleu 470 nm 100 LXHL-ND95 Rouge 625 nm 450 LXHL-NL95 Ambre 590 nm 425 Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Pour de plus amples informations, veuillez visiter le site www.luxeon.com. DESSINS A L’ECHELLE REELLE 13 HPWN-MG00 Vert 525 nm 4,5 4,1 90 HPWN-MC00 Cyan 505 nm 5,0 4,5 90 HPWN-MB00 Bleu 470 nm 2,0 1,8 90 HPWT-RD00 Rouge 630 nm 3,0 3,8 25 x 68 HPWT-MD00 Rouge 630 nm 3,0 1,8 70 HPWT-DD00 Rouge 630 nm 3,0 4,5 40 HPWT-BD00 Rouge 630 nm 3,0 6,0 30 HPWT-RH00 Rouge/Orange 620 nm 3,8 4,8 25 x 68 HPWT-MH00 Rouge/Orange 620 nm 3,8 2,3 70 HPWT-DH00 Rouge/Orange 620 nm 3,8 5,7 40 HPWT-BH00 Rouge/Orange 620 nm 3,8 7,6 30 HPWT-RL00 Ambre 594 nm 1,5 1,9 25 x 68 HPWT-ML00 Ambre 594 nm 1,5 0,9 70 HPWT-DL00 Ambre 594 nm 1,5 2,3 40 HPWT-BL00 Ambre 594 nm 1,5 3,0 30 Référence Couleur Longueur d’onde dominante Lumens Candela Angle de vision (deg.) SuperFlux DEL carrées, 4 broches, montage sur trou. Disponible en vert, cyan, bleu, rouge, rouge/orange et ambre et avec différents angles de vision pour tous besoins de conception. DEL SuperFlux & SnapLED DESSINS A L’ECHELLE REELLE Pour de plus amples informations, veuillez visiter le site www.lumileds.com. SnapLED DEL SnapLED rectangulaires haute luminosité. Il est possible de créer des dispositions innovantes dans des boîtiers qui utilisent une technologie de montage sans soudure. Disponibles en couleurs rouge/orange et ambre en versions 70 mA et 150 mA. HPWT-TH00 Rouge/Orange 621 nm 3,0 1,8 85 HPWT-TL00 Ambre 594 nm 1,5 0,9 85 HPWT-FH00 Rouge/Orange 621 nm 3,0 6,0 30 HPWT-FL00 Ambre 594 nm 1,5 3,0 30 HPWS-TH00 Rouge/Orange 621 nm 6,0 3,6 85 HPWS-TL00 Ambre 594 nm 3,0 1,8 85 HPWS-FH00 Rouge/Orange 621 nm 6,0 12,0 30 HPWS-FL00 Ambre 594 nm 3,0 6,0 30 Référence Couleur Longueur d’onde dominante Lumens (min.) Candela (min.) Angle de vision (deg.) Pour de plus amples informations, veuillez visiter le site www.lumileds.com. 70mA 150mA 14 Documentation générale Lumileds Plug and Play Guide Lumileds Application Overview Luxeon Lighting Vitrines des applications AS01 Portable Lighting AS02 Task/Reading Lights AS03 Architectural Detail Lighting AS04 Landscape and Path Lighting AS05 Stairway and Marker Lighting AS06 Interior Decorative Color Lighting AS08 Colored Signal Lighting AS10 Interior Decorative Lighting AS11 Museum Quality/Fiber Alternative/Display Pinpoint Lighting AS12 Entertainment, Film and Studio Lighting AS13 LED Retrofit Lamps AS14 Luxeon DCC AS15 Lighting for Digital Imaging AS16 Sign Lighting Fiches techniques DS05 SuperFlux LEDs DS21 Luxeon Line DS22 Luxeon Ring DS23 Luxeon Star DS23A Luxeon Star Option Code Selections DS24 Luxeon Flood DS25 Luxeon Emitter DS25A Luxeon Emitter Option Code Selections DS26 Luxeon Collimator DS30 Luxeon V Star DS34 Luxeon V Emitter DS35 Luxeon Dental DS40 Luxeon V Portable DS45 Luxeon III Emitter DS46 Luxeon III Star DS47 Luxeon Warm White Light Sources DS48 Luxeon DCC Notes d’applications résumées AB05 Luxeon Thermal Design Guide AB07 Lumen Maintenance of White Luxeon Light Sources AB08 Optical Testing for SuperFlux, SnapLED and Luxeon Emitters AB10 Luxeon Emitter Assembly Guide AB11 Electrical Drive Information for Luxeon Samples AB12 Luxeon Custom Design Guide AB13 Soldering SuperFlux LEDs AB16 Lumileds SuperFlux LEDs versus Other LEDs AB17 Benefits of Lumileds Solid-State Lighting Solutions vs. Conventional Lighting Ressources Documentation Luxeon - Index Lumileds modifie et met à jour régulièrement sa documentation. Pour les versions les plus récentes de ces documents et d’autres, veuillez visiter la bibliothèque Lumileds à l’adresse : www.lumileds.com. 15 Guide des fournisseurs Le Guide des fournisseurs (Lumileds Vendor Resource Guide) est un annuaire complet des sociétés qui fournissent dans le monde entier les produits et services Luxeon, SuperFlux et SnapLED. Vous pouvez les rechercher par nom, par pays ou par spécialité. Si vous avez besoin de l’assistance d’experts pour le développement de vos solutions à base de produits Lumileds, consultez d’abord notre Guide des fournisseurs. AB20-3 Electrical Design Considerations for Super FluxLEDs AB20-3A Advanced Electrical Design Models AB20-3B SuperFlux and SnapLED Emitter Forward Voltage Data AB20-4 Thermal Management Considerations for SuperFlux LEDs AB20-5 Secondary Optics Design Considerations for SuperFlux LEDs AB20-6 Reliability Considerations for SuperFlux LEDs AB20-7 SuperFlux Categories and Labels AB21 Luxeon Product Binning and Labeling (June 2003) AB22 Thyristor Application Brief AB23 Thermal Design Considerations for Luxeon V Power Light Sources AB25 Luxeon Reliability Modèles de référence DR01 Luxeon for Camera, Phone Flash PDA and DSC Applications Lumileds Lighting 370 W. Trimble Road San Jose, CA 95131 +1 408.435.6044 en Amérique du Nord +31 499.339.439 en Europe +60 4680.5342 en Asie / Japon www.lumileds.com www.luxeon.com Luxeon distribué par Future Electronics www.FutureElectronics.com 888.589.3662 en Amérique du Nord 00.800.443.88.873 en Europe 800.5864.5337 en Asie Document : PG-01-E Mars 2004 TO-220AB BT136-600D 4Q Triac 30 September 2013 Product data sheet Scan or click this QR code to view the latest information for this product 1. General description Planar passivated very sensitive gate four quadrant triac in a SOT78 plastic package intended for use in general purpose bidirectional switching and phase control applications, where high sensitivity is required in all four quadrants. This very sensitive gate "series D" triac is intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. 2. Features and benefits • Direct triggering from low power drivers and logic ICs • High blocking voltage capability • Low holding current for low current loads and lowest EMI at commutation • Planar passivated for voltage ruggedness and reliability • Triggering in all four quadrants • Very sensitive gate 3. Applications • General purpose motor control • General purpose switching 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDRM repetitive peak offstate voltage - - 600 V ITSM non-repetitive peak onstate current full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 - - 25 A IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; Fig. 1; Fig. 2; Fig. 3 - - 4 A Static characteristics VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 IGT gate trigger current - 2 5 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 2 / 13 Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 °C; Fig. 7 - 5 10 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.2 10 mA 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 1 2 mb 3 TO-220AB (SOT78) sym051 T1 G T2 6. Ordering information Table 3. Ordering information Type number Package Name Description Version BT136-600D TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 BT136-600D/DG TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 3 / 13 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDRM repetitive peak off-state voltage - 600 V IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; Fig. 1; Fig. 2; Fig. 3 - 4 A full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 ITSM non-repetitive peak on-state - 25 A current full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 27 A I2t I2t for fusing tp = 10 ms; SIN - 3.1 A2s IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2+ G+ - 50 A/μs IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2+ G- - 50 A/μs IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2- G- - 50 A/μs dIT/dt rate of rise of on-state current IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2- G+ - 10 A/μs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power over any 20 ms period - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 4 / 13 Tmb (°C) - 50 0 50 100 150 003aae828 2 3 1 4 5 IT(RMS) (A) 0 Fig. 1. RMS on-state current as a function of mounting base temperature; maximum values 003aae830 4 8 12 IT(RMS) (A) 0 surge duration (s) 10- 2 10- 1 1 10 2 6 10 f = 50 Hz Tmb ≤ 107 °C Fig. 2. RMS on-state current as a function of surge duration; maximum values 003aae827 4 2 6 8 Ptot (W) 0 IT(RMS) (A) 0 1 2 3 4 5 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α α = 180° 120° 90° 60° 30° α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 5 / 13 003aae831 10 20 30 ITSM (A) 0 number of cycles 1 10 102 103 104 5 15 25 ITSM t IT Tj(init) = 25 °C max 1/f f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aae829 tp (s) 10- 5 10- 4 10- 3 10- 2 10- 1 102 103 ITSM (A) 10 ITSM t IT Tj(init) = 25 °C max tp (1) (2) tp ≤ 20 ms (1) dIT/dt limit (2) T2- G+ quadrant limit Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 6 / 13 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance half cycle; Fig. 6 - - 3.7 K/W from junction to mounting base full cycle; Fig. 6 - - 3 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W 003aae836 tp (s) 10- 5 10- 4 10- 3 10- 2 10- 1 1 10 1 10- 1 10 Zth(j-mb) (K/W) 10- 2 bidirectional unidirectional tp P t Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 7 / 13 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 - 2 5 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA IGT gate trigger current VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 °C; Fig. 7 - 5 10 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 8 - 1.6 10 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 8 - 4.5 15 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 8 - 1.2 10 mA IL latching current VD = 12 V; IG = 0.1 A; T2- G+; Tj = 25 °C; Fig. 8 - 2.2 15 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.2 10 mA VT on-state voltage IT = 5 A; Tj = 25 °C; Fig. 10 - 1.4 1.7 V VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 11 VGT gate trigger voltage - 0.7 1 V VD = 400 V; IT = 0.1 A; Tj = 125 °C; Fig. 11 0.25 0.4 - V ID off-state current VD = 600 V; Tj = 125 °C - 0.1 0.5 mA Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 125 °C; RGT1 = 1 kΩ; (VDM = 67% of VDRM); exponential waveform - 5 - V/μs tgt gate-controlled turn-on time ITM = 6 A; VD = 600 V; IG = 0.1 A; dIG/ dt = 5 A/μs - 2 - μs NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 8 / 13 Tj (°C) - 60 - 10 40 90 140 003aae833 1 2 3 0 (1) (2) (3) (4) (1) (2) (3) (4) IGT IGT (25 °C) (1) T2- G+ (2) T2- G- (3) T2+ G- (4) T2+ G+ Fig. 7. Normalized gate trigger current as a function of junction temperature Tj (°C) - 60 - 10 40 90 140 003aae835 1 2 3 0 IL IL(25°C) Fig. 8. Normalized latching current as a function of junction temperature Tj (°C) - 60 - 10 40 90 140 003aae837 1.0 0.5 1.5 2.0 0 IH IH(25°C) Fig. 9. Normalized holding current as a function of junction temperature VT (V) 0 1 2 3 003aae834 4 8 12 IT (A) 0 (1) (2) (3) Vo = 1.27 V Rs = 0.091 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 10. On-state current as a function of on-state voltage NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 9 / 13 Tj (°C) - 60 - 10 40 90 140 003aae832 0.8 0.4 1.2 1.6 0 VGT VGT (25 °C) Fig. 11. Normalized gate trigger voltage as a function of junction temperature NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 10 / 13 10. Package outline OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT78 3-lead TO-220AB SC-46 SOT78 08-04-23 08-06-13 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. UNIT A mm 4.7 4.1 1.40 1.25 0.9 0.6 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 15.0 12.8 3.30 2.79 3.8 3.5 A1 DIMENSIONS (mm are the original dimensions) Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB 0 5 10 mm scale b b1(2) 1.6 1.0 c D 1.3 1.0 b2(2) D1 E e 2.54 L L1(1) L2(1) max. 3.0 p q 3.0 2.7 Q 2.6 2.2 D D1 q p L 1 2 3 L1(1) b1(2) (3×) b2(2) (2×) e e b(3×) E A A1 c Q L2(1) mounting base Fig. 12. Package outline TO-220AB (SOT78) NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 11 / 13 11. Legal information 11.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 12 / 13 grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 13 / 13 12. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ............................................. 2 7 Limiting values .......................................................3 8 Thermal characteristics .........................................6 9 Characteristics .......................................................7 10 Package outline ................................................... 10 11 Legal information .................................................11 11.1 Data sheet status ............................................... 11 11.2 Definitions ...........................................................11 11.3 Disclaimers .........................................................11 11.4 Trademarks ........................................................ 12 © NXP N.V. 2013. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 September 2013 Page 26-1 Semiconductors Integrated Circuits Part Number Description NTE4001B IC-CMOS, Quad 2-Input NOR Gate NTE4001BT IC-CMOS, Quad 2-Input NOR Gate (Surface Mount) NTE4002B IC-CMOS, Dual 4-Input NOR Gate NTE4002BT IC-CMOS, Dual 4-Input NOR Gate (Surface Mount) NTE4006B IC-CMOS, 18-Stage Static Shift Register NTE4007 IC-CMOS, Dual Complementary Pair Plus Inverter NTE4007T IC-CMOS, Dual Complementary Pair Plus Inverter (Surface Mount) NTE4008B IC-CMOS, 4-Bit Full Adder w/Parallel Carry Out NTE4009 IC-CMOS, Hex Buffer/Converter (Inverting) NTE40098B IC-CMOS, Hex 3-State Buffer (Inverting) NTE40100B IC-CMOS, 32-Stage Static Shift Left/Right, Shift Register NTE40106B IC-CMOS, Hex Schmitt Trigger NTE40106BT IC-CMOS, Hex Schmitt Trigger (Surface Mount) NTE4011B IC-CMOS, Quad 2-Input NAND Gate NTE4011BT IC-CMOS, Quad 2-Input NAND Gate (Surface Mount) NTE4012B IC-CMOS, Dual 4-Input NAND Gate NTE4012BT IC-CMOS, Dual 4-Input NAND Gate (Surface Mount) NTE4013B IC-CMOS, Dual D Type Flip-Flop NTE4013BT IC-CMOS, Dual D Type Flip-Flop (Surface Mount) NTE4014B IC-CMOS, 8-Stage Shift Register Synchronous Parallel or Serial Input/Serial Output NTE4015B IC-CMOS, Dual 4-Stage Static Shift Register w/Serial Input/Parallel Output NTE4015BT IC-CMOS, Dual 4-Stage Static Shift Register w/Serial Input/Parallel Output (Surface Mount) NTE40160B IC-CMOS, Synchronous Programmable 4-Bit BCD Counter w/Asynchronous Clear Integrated Circuits (cont.) Part Number Description NTE40161B IC-CMOS, Synchronous Programmable 4-Bit Binary Counter w/Asynchronous Clear NTE40162B IC-CMOS, Synchronous Programmable 4-Bit BCD Counter w/Synchronous Clear NTE40163B IC-CMOS, Synchronous Programmable 4-Bit BCD Counter w/Synchronous Clear NTE4016B IC-CMOS, Quad Bilateral Switch for Transmission or Multiplexing of Analog or Digital Signals NTE40174B IC-CMOS, Hex D-Type Flip-Flop NTE40174BT IC-CMOS, Hex D-Type Flip-Flop (Surface Mount) NTE40175B IC-CMOS, Quad D-Type Flip-Flop NTE4017B IC-CMOS, Decade Counter w/10 Decoder Outputs NTE40182B IC-CMOS, Look Ahead Carry Generator NTE4018B IC-CMOS, Presettable Divide-By-"N" Counter NTE40192B IC-CMOS, Presettable Up/Down BCD Counter, Dual Clock w/Reset NTE40193B IC-CMOS, Presettable Up/Down Binary Counter, Dual Clock w/Reset NTE40194B IC-CMOS, 4-Bit Bidirectional Universal Shift Register w/Asynchronous Master/Reset NTE40195B IC-CMOS, 4-Bit Shift Register NTE4020B IC-CMOS, 14-Stage Ripple-Carry Binary Counter/Divider NTE4020BT IC-CMOS, 14-Stage Ripple-Carry Binary Counter/Divider (Surface Mount) NTE4021B IC-CMOS, 8-Stage Static Shift Register Asynchronous Parallel Input or Synchronous Serial Input/Serial Output NTE4021BT IC-CMOS, 8-Stage Static Shift Register Asynchronous Parallel Input or Synchronous Serial Input/Serial Output (Surface Mount) NTE4022B IC-CMOS, Octal Counter/Divider w/8 Decoded Outputs NTE4023B IC-CMOS, Triple 3-Input NAND Gate NTE4023BT IC-CMOS, Triple 3-Input NAND Gate (Surface Mount) NTE4024B IC-CMOS, 7-Stage Ripple-Carry Binary Counter/Divider NTE4025B IC-CMOS, Triple 3-Input NOR Gate NTE4016BT NTE4019B IC-CMOS, Quad Bilateral Switch for Transmission or Multiplexing of Analog or Digital Signals (Surface Mount) IC-CMOS, Quad AND/OR Select Gate NTE4025BT IC-CMOS, Triple 3-Input NOR Gate (Surface Mount) NTE4026B IC-CMOS, Decade Counter/Divider w/Decoded Seven- Segment Display Outputs and Display Enable NTE4027B IC-CMOS, Dual J-K Master-Slave Flip-Flop NTE4027BT IC-CMOS, Dual J-K Master-Slave Flip-Flop (Surface Mount) NTE4028B IC-CMOS, BCD-to-Decimal Decoder NTE4029BT IC-CMOS, Presettable Up/Down Counter, Binary or BCD Decade Decoder (Surface Mount) NTE4030B IC-CMOS, Quad Exclusive OR Gate NTE4028BT IC-CMOS, BCD-to-Decimal Decoder (Surface Mount) NTE4029B IC-CMOS, Presettable Up/Down Counter, Binary or BCD Decade Decoder NTE4031B IC-CMOS, 64-Stage Static Shift Register NTE4032B IC-CMOS, Triple Serial Positive Logic Adder NTE4033B IC-CMOS, Decade Counter/Divider w/Decoded Seven- Segment Display Outputs and Ripple Blanking NTE4034B IC-CMOS, 8-Stage Static Bi-Directional Parallel/Serial Input/Output Bus Register NTE4035B IC-CMOS, 4-Stage Parallel In/Parallel Out Shift Register w/J-K Serial Input and True Complement Output NTE4038B IC-CMOS, Triple Serial Negative Logic Adder NTE4040B IC-CMOS, 12-Stage Ripple-Carry Binary Counter/Divider Page 26-2 Semiconductors NTE4256 IC-NMOS, 256K Dynamic RAM, 100ns NTE4501 IC-CMOS, Dual 4-Input NAND Gate, 2-Input NOR/OR Gate, 8- Input AND/NAND Gate NTE4503B IC-CMOS, Hex 3-State Non-Inverting Buffer NTE4510B IC-CMOS, Presettable UP/Down BCD Counter NTE4510BT IC-CMOS, Presettable UP/Down BCD Counter (Surface Mount) NTE4511B IC-CMOS, BCD-to-Seven-Segment Latch Decoder Driver Integrated Circuits (cont.) Part Number Description NTE4041 IC-CMOS, Quad True/Complement Buffer NTE4042B IC-CMOS, Quad, Clocked D-Type Latch NTE4042BT IC-CMOS, Quad, Clocked D-Type Latch (Surface Mount) NTE4043B IC-CMOS, Quad, 3-State NOR R/S Latch NTE4043BT IC-CMOS, Quad, 3-State NOR R/S Latch (Surface Mount) NTE4044B IC-CMOS, Quad 3-State NAND R/S Latch NTE4044BT IC-CMOS, Quad 3-State NAND R/S Latch (Surface Mount) NTE4045B IC-CMOS, 21-Stage Counter NTE4045BT IC-CMOS, 21-Stage Counter (Surface Mount) NTE4046B IC-CMOS, Phase-Lock Loop (PLL) NTE4046BT IC-CMOS, Phase-Lock Loop (PLL) (Surface Mount) Integrated Circuits (cont.) Part Number Description NTE4047B IC-CMOS, Low-Power Monostable/Astable Multivibrator NTE4047BT IC-CMOS, Low-Power Monostable/Astable Multivibrator (Surface Mount) NTE4048B IC-CMOS, Multi-Function Expandable 8-Input Gate NTE4049 IC-CMOS, Hex Buffer/Converter, Inverting NTE4049T IC-CMOS, Hex Buffer/Converter, Inverting (Surface Mount) NTE4050BT IC-CMOS, Hex Buffer/Converter, Non-Inverting (Surface Mount) NTE4051B IC-CMOS, Analog, Single 8-Channel Multiplexer/Demultiplexer NTE4051BT IC-CMOS, Analog, Single 8-Channel Multiplexer/Demultiplexer (Surface Mount) NTE4052B IC-CMOS, Analog, Differential 4-Channel Multiplexer NTE4052BT IC-CMOS, Analog, Differential 4-Channel Multiplexer NTE4053B IC-CMOS, Triple 2-Channel Analog Multiplexer NTE4053BT IC-CMOS, Triple 2-Channel Analog Multiplexer (Surface Mount) NTE4055B IC-CMOS, BCD-to-7 Segment Decoder/Driver w/"Display- Frequency" Output NTE4056B IC-CMOS, BCD-to-7-Segement Decoder/Divider w/Strobed Latch Function NTE4060B IC-CMOS 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator NTE4060BT IC-CMOS 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator (Surface Mount) NTE4063B IC-CMOS, 4-Bit Magnitude Comparator (High-Voltage Type) NTE4066B IC-CMOS, Quad Bilateral Switch NTE4066BT IC-CMOS, Quad Bilateral Switch (Surface Mount) NTE4067B IC-CMOS, Analog, Single 16-Channel Multiplexer/Demultiplexer NTE4068B IC-CMOS, 8-Input NAND/AND Gate (High Voltage Type) NTE4050B IC-CMOS, Hex Buffer/Converter, Non-Inverting NTE4040BT IC-CMOS, 12-Stae Ripple-Carry Binary Counter/Divider (Surface Mount) NTE4070B IC-CMOS, Quad Exclusive OR Gate NTE4070BT IC-CMOS, Quad Exclusive OR Gate (Surface Mount) NTE4071B IC-CMOS, Quad 2-Input OR Gate NTE4071BT IC-CMOS, Quad 2-Input OR Gate (Surface Mount) NTE4072B IC-CMOS, Dual 4-Input OR Gate NTE4073B IC-CMOS, Triple 3-Input AND Gate NTE4073BT IC-CMOS, Triple 3-Input AND Gate (Surface Mount) NTE4075BT IC-CMOS, Triple 3-Input OR Gate NTE4076B IC-CMOS, 4-Bit D-Type Register (High Voltage Type) NTE4077B IC-CMOS, Quad Exclusive NOR Gate NTE4077BT IC-CMOS, Quad Exclusive NOR Gate (Surface Mount) NTE4078B IC-CMOS, 8-Input NOR Gate NTE4081B IC-CMOS, Quad 2-Input AND Gate NTE4082B IC-CMOS, Dual 4-Input AND Gate NTE4085B IC-CMOS, Dual 2-Wide, 2-Input AND/OR Invert Gate NTE4086B IC-CMOS, Expandable 4-Wide, 2-Input AND/OR Invert Gate NTE4089B IC-CMOS, Binary Rte Multiplier NTE4093B IC-CMOS, Quad 2-Input NAND Schmitt Trigger NTE4093BT IC-CMOS, Quad 2-Input NAND Schmitt Trigger (Surface Mount) NTE4094B IC-CMOS, 8-Stage Shift and Storage Bus Register NTE4094BT IC-CMOS, 8-Stage Shift and Storage Bus Register (Surface Mount) NTE4095B IC-CMOS, Gated J-K Master/Slave Flip-Flop w/Set-Reset Capability Non-Inverting J and K Inputs NTE4096B IC-CMOS, Gated J-K Master/Slave Flip-Flop w/Set-Reset Capability Inverting and Non-Inverting J and K Inputs NTE4097B IC-CMOS, Analog, Differential 8-Channel Multiplexer/Demultiplexer NTE4098B IC-CMOS, Dual Monostable Multivibrator NTE4099B IC-CMOS, 8-Bit Addressable Latch NTE4164 IC-NMOS, 64K Dynamic RAM, 150ns NTE4075B IC-CMOS, Triple 3-Input AND Gate (Surface Mount) NTE4068BT IC-CMOS, 8-Input NAND/AND Gate (High Voltage Type) NTE4069 IC-CMOS, Hex Inverter (High Voltage Type) NTE4069T IC-CMOS, Hex Inverter (High Voltage Type) (Surface Mount) NTE4511BT IC-CMOS, BCD-to-Seven-Segment Latch Decoder Driver (Surface Mount) NTE4512B IC-CMOS, 8-Channel Data Selector Page 26-3 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE4513B IC-CMOS, BCD-to-Seven-Segment Latch Decoder Driver NTE4514B IC-CMOS, 4-Bit Latch/4-to-16 Decoder Line (Output "High" on Select) NTE4515B IC-CMOS, 4-Bit Latch/4-to-16 Line Decoder (Output "Low" on Select) NTE4516B IC-CMOS, Presettable UP/Down Binary Counter NTE4517B IC-CMOS, Dual 64-Stage Static Shift Register NTE4518B IC-CMOS, Dual BCD UP-Counter NTE4518BT IC-CMOS, Dual BCD UP-Counter (Surface Mount) NTE4520B IC-CMOS, Dual Binary Up-Counter NTE4520BT IC-CMOS, Dual Binary Up-Counter (Surface Mount) NTE4522B IC-CMOS, Programmable Diode-by-"N" 4-Bit BCD Counter NTE4526B IC-CMOS, Programmable Divide-by-"N" 4-Bit Binary Counter NTE4527B IC-CMOS, BCD Rate Multiplier NTE4528B IC-CMOS, Dual Retriggerable/Resettable Monostable Multivibrator NTE4528BT IC-CMOS, Dual Retriggerable/Resettable Monostable Multivibrator (Surface Mount) NTE4529B IC-CMOS, Dual 4-Channel Analog Data Selector NTE4531B IC-CMOS, 12-Bit Parity Tree NTE4532B IC-CMOS, 8-Bit Priority Encoder NTE4536B IC-CMOS, Programmable Timer NTE4538B IC-CMOS, Dual Precision Monostable Multivibrator NTE4521B IC-CMOS, 24-Stage Frequency Divider NTE4539B IC-CMOS, Dual 4-Channel Data Selector/Multiplexer NTE4541B NTE4541BT IC-CMOS, Programmable Timer (Surface Mount) NTE4543B IC-CMOS, BCD-to-Seven-Segment Latch/Decoder/Driver for Liquid Crystals NTE4547B IC-CMOS, High Current BCD-to-Seven-Segment Decoder/Driver NTE4553B IC-CMOS, 3-Digit BCD Counter NTE4555B IC-CMOS, Dual Binary to 1-of-4 Decoder/Demultiplexer (Output "High" on Select) NTE4556B IC-CMOS, Dual Binary to 1-of-4 Decoder/Demultiplexer (Output "Low" on Select) NTE4558B IC-CMOS, BCD-to-Seven-Segment Decoder NTE4566B IC-CMOS, Industrial Time Base Generator NTE4569B IC-CMOS, Programmable Divide-by-"N" Dual 4-Bit BCD/Binary Counter NTE4583B IC-CMOS, Dual Schmitt Trigger NTE4551B IC-CMOS, Quad 2-Input analog Multiplexer/Demultiplexer Part Number Description NTE4597B IC-CMOS, 8-Bit, Bus Compatible Counter Latch NTE4598B IC-CMOS, 8-Bit, Bus Compatible Addressable Latch NTE7400 IC-TTL, Quad 2-Input Pos NAND Gate NTE7401 IC-TTL, Quad 2-Input Pos NAND Gate w/Open Collector Outputs NTE7402 IC-TTL, Quad 2-Input Positive NOR Gate NTE7403 IC-TTL, Quad 2-Input Positive NAND Gate w/Open Collector Outputs NTE7404 IC-TTL, Hex Inverter NTE7405 IC-TTL Hex Inverter w/Open Collector Outputs NTE7406 IC-TTL, Hex Inverter Buffer/Driver w/Open Collector HV Outputs NTE7407 IC-TTL, Hex Buffer/Driver w/Open Collector HV Outputs NTE7408 IC-TTL, Quad 2-Input Pos AND Gate NTE7409 IC-TTL, Quad 2-Input Pos AND Gate w/Open Collector Outputs NTE7410 IC-TTL, Triple 3-Input Pos NAND Gate NTE74107 IC-TTL, Dual J-K Negative Edge Triggered Flip-FLop w/Clear and Preset NTE74109 IC-TTL, Dual J-K Pos Edge Triggered Flip-FLop w/Clear and Preset NTE7411 IC-TTL, Triple 3-Input Pos AND Gate NTE74110 IC-TTL, AND Gated J-K Master/Slave Flip-FLop w/Data Lockout NTE74116 IC-TTl, Dual 4-Bit Latch NTE7412 IC-TTL, Triple 3-Input Pos NAND Gate w/Collector Outputs NTE74120 IC-TTL, Dual Pulse Synchronizer/Driver NTE74121 IC-TTL, Monostable Multivibrator NTE74122 IC-TTL, Retriggerable Monostable Multivibrator w/Clear NTE74123 IC-TTL, Dual Retriggerable Monostable Multivibrator w/Clear NTE74126 IC-TTL, Quad Bus Buffer w/3-State Outputs NTE74128 IC-TTL, Quad 2-Input NOR 50ohm Line Driver NTE7413 IC-TTL, Dual 4-Input NAND Schmitt Trigger NTE74132 IC-TTL, Quad 2-Input Pos NAND Schmitt Trigger NTE7414 IC-TTL, Hex Schmitt Trigger NTE74141 IC-TTL, BCD-to-Decimal Decoder/Driver, Driver Filled Cold Cathode Indicator Tubes Directly NTE74145 IC-TTL, BCD-to-Decimal Decoder/Driver for Lamps, Relays, MOS NTE74147 IC-TTL, 10-Line Decimal-to-4-Line BCD Priority Encoder NTE74136 IC-TTL, Quad Exclusive OR Gate w/Open Collector Outputs NTE74150 IC-TTL, 1-of-16 Data Selector/Mulitplexer NTE74151 IC-TTL, 8-Channel Multiplexer NTE74148 IC-TTL, 8-Line to 3-Line OCtal Priority Encoder NTE74152 IC-TTL, 1-of-8 Data Selector/Multiplexer IC-CMOS, Programmable Timer NTE4584B IC-CMOS, Hex Schmitt Trigger NTE4585B IC-CMOS, 4-Bit Magnitude Comparator NTE74153 IC-TTL, Dual 4-Line-to-1-Line Data Selector/Mulitplexer NTE74154 IC-TTL, 4-Line-to-16-Line Decoder/Demultiplexer Page 26-4 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE74155 IC-TTL, Dual 2-Line-to-4-Line Decoder/Demultiplexer w/Totem Pole Outputs NTE74156 IC-TTL, Dual 2-Line-to-4-Line Decoder/Demultiplexer w/Open Collector Outputs NTE74157 IC-TTL, Quad 2-to-1-Line Data Selector/ Multiplexer w/Non- Inverted Data Outputs NTE74158 IC-TTL, Quad 2-to-1-Line Data Selector/ Multiplexer w/Inverted Data Outputs NTE7416 IC-TTL, Hex Inverter Buffer/Driver w/Open Collector HV Outputs NTE74160 IC-TTL, Synchronous 4-Bit Decade Counter w/Direct Clear NTE74161 IC-TTL, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74162 IC-TTL, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74163 IC-TTL, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74164 IC-TTL, 8-Bit Parallel-Out Serial Shift Register w/Async Clear NTE74165 IC-TTL, 8-Bit Parallel-In/Serial Out Shift Register NTE74166 IC-TTL, 8-Bit Parallel-In or Serieal-In/Serial Out Shift Register NTE7417 IC-TTL, Hex Buffer/Driver w/Open Collector HV Outputs NTE74170 IC-TTL, 4-by-4 Register File w/Open Collector Outputs NTE74173 IC-TTL, 4-Bit D-Type Flip-Flop w/3-State Outputs NTE74174 IC-TTL, Hex D-Type Flip-Flop w/Serial Rail Outputs and Common Direct Clear NTE74175 IC-TTl, Quad D-Type Flip-FLop w/Common Direct Clear and Complementary Outputs NTE74176 IC-TTL, Presettable Decade Counter/Latch NTE74177 IC-TTL, Presettable Binary Counter/Latch NTE74179 IC-TTL, 4-Bit Universal Shift Register w/Direct Clear NTE74180 IC-TTL, 9-Bit Odd/Even Parity Generator/Checker NTE74182 IC-TTL, Look-Ahead Carry Generator NTE74191 IC-TTL, Synchronous Up/Down Binary Counter NTE74192 IC-TTL, Synchronous Up/Down BCD Counter (Dual Clock w/Clear) NTE74193 IC-TTL, Synchronous Up/Down Binary Counter (Dual Clock w/Clear) NTE74195 IC-TTL, 4-Bit Parallel Access Shift Register NTE74196 IC-TTL, Presettable Decade Counter/Latch NTE74197 IC-TTL, Presettable Modulo-16 Binary Counter/Latch NTE74199 IC-TTL, 8-Bit Bidirectional Universal Shift Register NTE7420 IC-TTL, Dual 4-Input NAND Gate NTE7421 IC-TTL, Dual 4-Input AND Gate NTE7422 IC-TTL, Dual 4-Input NAND Gate w/Open COllector Outputs Part Number Description NTE74251 IC-TTL, Data Selector/Mulitplexer w/True and Inverted 3-State Outputs NTE7426 IC-TTL, Quad 2-Input High Voltage Interface NAND Gate NTE74265 IC-TTL, Quad Complementary Output Elements NTE7427 IC-TTL, Triple 3-Input Pos NOR Gate NTE74278 IC-TTL, 4-Bit Cascadable Priority Register w/Latched Data Inputs and Priority Output Gating NTE74279 IC-TTL, Quad Set-Reset Latch w/Diode-Clamped Inputs and Totem Pole Outputs NTE7428 IC-TTL, Quad 2-Input Pos NOR Buffer/Clock Driver w/Totem Pole Outputs NTE7430 IC-TTL, 8-Input Pos NAND Gate NTE7432 IC-TTL, Quad 2-Input OR Gate NTE7433 IC-TTL, Quad 2-Input NOR Buffer w/Open Collector Outputs NTE74298 IC-TTL, Quad 2-Input Multiplexer w/Storage NTE74365 IC-TTL, 3-State Hex Bus/Buffer Driver w/Non-Inverted Outputs NTE74366 IC-TTL, 3-State Hex Bus/Buffer Driver w/Inverted Outputs NTE74367 IC-TTL, Hex Bus/Buffer Driver w/Non-Inverted 3-State Outputs, Organized to Handle 4-Bit Data NTE74368 IC-TTL, Hex Bus/Buffer Driver w/Inverted 3-State Outputs, Organized to Handle 4-Bit Data NTE7437 IC-TTL, Quad 2-Input NAND Buffer NTE74376 IC-TTL, Quardruple J-K Flip-Flop NTE7438 IC-TTL, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE7439 IC-TTL, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE74390 IC-TTL, Dual 4-Bit Decade Ripple Counter NTE74393 IC-TTL, Dual 4-Bit Binary Ripple Counter NTE7440 IC-TTL, Dual 4-Input NAND Buffer NTE7441 IC-TTL, 1-of-10 Decoder Driver for Cold Cathode Indicator Tubes NTE7442 IC-TTL, 4-Line-to-10-Line BCD-to-Decimal Decoder NTE74426 IC-TTL, Quad Gate w/3-State Outputs and Active High Enabling NTE7443 IC-TTL, 4-Line-to-10-Line Excess-3-Decimal Decoder NTE7444 IC-TTL, 4-Line-to-10-Line Excess-3-Gray-to Decimal Decoder NTE7445 IC-TTL, BCD-to-Decimal Decoder/Driver NTE7446 IC-TTL, BCD-to-Seven-Segment Decoder/Driver w/Active Low, Open Collector Outputs NTE7423 IC-TTL, Expandable Dual 4-Input NOR Gate w/Strobe NTE74221 IC-TTL, Dual Monostable Multivibrator NTE74249 IC-TTL, BCD-to-Seven-Segment Decoder/driver w/Open Collector Outputs NTE7425 IC-TTL, Dual 4-Input Pos NOR Gate w/Strobe NTE7447 IC-TTL, BCD-to-Seven-Segment Decoder/Driver w/Active Low, Open Collector Outputs NTE7448 IC-TTL, BCD-to-Seven-Segment Decoder/Driver w/Internal Pull-Up Outputs NTE74490 IC-TTL, Dual BCD Decade Ripple Counter NTE7450 IC-TTL, Dual 2-Wide, 2-Input, AND/OR Invert Gate (One Gate Expandable) NTE7451 IC-TTL, Dual 2-Wide, 2-Input, AND/OR Gate Page 26-5 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE7453 IC-TTL, Expandable AND/OR Invert Gate NTE7454 IC-TTL, 4-Wide AND/OR Invert Gate NTE7460 IC-TTL, Dual 4-Input Expander NTE7470 IC-TTL, AND Gated J-K Pos Edge Triggered Flip-Flop w/Present and Clear NTE7472 IC-TTL, AND Gated J-K Master/Slave Flip-Flop w/Present and Clear NTE7473 IC-TTL, Dual J-K Flip-Flop w/Clear NTE7474 IC-TTL, Dual D-Type Pos Edge Triggered Flip-Flop w/Present and Clear NTE7475 IC-TTL, 4-Bit Bistable Latch NTE7476 IC-TTL, Dual J-K Flip-Flop w/Present and Clear NTE7480 IC-TTL, Gated Full Adder w/Complementary Inputs and Complementary Sum Outputs NTE7482 IC-TTL, 2-Bit Binary Full Adder NTE7483 IC-TTL, 4-Bit Binary Full Adder w/Fast Carry NTE7485 IC-TTL, 4-Bit Magnitude Comparator NTE7486 IC-TTL, Quad 2-Input Exclusive OR Gate NTE7489 IC-TTL, 64-Bit Read/Write Memory NTE7490 IC-TTL, Decade Counter (Divide by 2 and 5) NTE7491 IC-TTL, 8-Bit Shift Register w/Gated Serial INputs and Serial Outputs NTE7492 IC-TTL, Divide-by-Twelve Counter NTE7493A IC-TTL, 4-Bit Binary Counter (Divide by 2 and 8) NTE7495 IC-TTL, 4-Bit Parallel In/Parallel Out Shift Register NTE7496 IC-TTL, 5-Bit Shift Register w/Async Preset NTE7497 IC-TTL, Sychronous 6-Bit Binary Rate Multiplier NTE74C160 IC-CMOS, Synchronous 4-Bit Decade Counter with Direct Clear NTE74C161 IC-CMOS, Synchronous 4-Bit Binary Counter with Direct Clear NTE74C164 IC-CMOS, 8-Bit Parallel-Out Serial Shift Register with Async Clear NTE74C174 IC-CMOS, Hex D-Type Flip-Flop with Serial Rail Outputs and Common Direct Clear NTE74C173 IC-CMOS, 4-Bit D-Type Flip-Flop w/3-State Outputs NTE74C175 IC-CMOS, Quad D-Type Flip-Flop with Common Direct Clear and Complementary Outputs NTE74C192 IC-CMOS, Synchronous Up/Down BCD Counter (Dual Clock with Clear) Part Number Description NTE74C373 IC-CMOS, Octal D-Type Latch with 3-State Outputs and Common Output Control NTE74C901 IC-CMOS, Hex Inverting TTL Buffer NTE74C902 IC-CMOS, Hex Non-Inverting TTL Buffer NTE74C903 IC-CMOS, Hex Inverting DMOS Buffer NTE74C904 IC-CMOS, Hex Non-Inverting DMOS Buffer NTE74C922 IC-CMOS, 16-Key Keyboard Encoder with 3-State Output NTE74C923 IC-CMOS, 20 Key Keyboard Encoder with 3-State Output NTE74C925 IC-CMOS, 4-Digit Counter with Multiplexed Seven-Segment Output Driver NTE74H00 IC-TTL, High Speed, Quad 2-Input Pos NAND Gate NTE74H01 IC-TTL, High Speed, quad 2-Input Pos NAND Gate with Open Collector Outputs NTE74H04 IC-TTL, High Speed, Hex Inverter NTE74H05 IC-TTL, High Speed, Hex Inverter with Open Collector Outputs NTE74H101 IC-TTL, High Speed, AND OR Gate J-K Neg Edge Triggered Flip-Flop w/Present NTE74H102 IC-TTL, High Speed, AND Gated J-K Neg Edge Triggered Flip- Flop w/Clear & Reset NTE74H103 IC-TTL, High Speed, Dual J-K Neg Edge Triggered Flip-Flop w/Clears NTE74H106 IC-TTL, High Speed, Dual J-K Neg Edge Triggered Flip-Flop w/Present and Clear NTE74C374 IC-CMOS, Octal D-Type Flip-Flop w/3-State Outputs, Common Output Control and Common Clock NTE74H108 IC-TTL, High Speed, Dual J-K Neg Triggered Flip-Flop w/Presents, Common Clear & Common Clock NTE74H183 IC-TTL, High Speed Dual Carry/ Save Full Adder NTE74H21 IC-TTL, High Speed, Dual 4-Input AND Gate NTE74H22 IC-TTL, High Speed, Dual 4-Input NAND Gate with Open Collector Outputs NTE74H30 IC-TTL, High Speed, 8-Input Pos NAND Gate NTE74H40 IC-TTL, High Speed, Dual 4-Input NAND Buffer NTE74H50 IC-TTL, High Speed, Dual 2-Wide, 2-Input, AND/OR Invert Gate (One Gate Expandable) NTE74H51 IC-TTL, High Speed, Dual 2-Wide, 2-Input AND/OR Gate NTE74H52 IC-TTL, High Speed, Expandable 4-Wide AND/OR Gate NTE74H53 IC-TTL, High Speed, Expandable AND/OR Inver Gate NTE74H54 IC-TTL, High Speed, 4-Wide AND/OR Invert Gate NTE74H55 IC-TTL, High Speed, Expandable, 2-Wide, 4-Input AND/OR Invert Gate NTE74C193 IC-CMOS, Synchronous Up/Down Binary Counter (Dual Clock with Clear) NTE74C221 IC-CMOS, Dual Monostable Multivibrator NTE74C240 IC-CMOS, Octal Buffer/Line Driver/Receiver with 3-State Inverted Outputs NTE74C244 IC-CMOS, Octal Buffer/Line Driver/Receiver with 3-State Non- Inverted Outputs NTE74H61 IC-TTL, High Speed Triple 3-Input Expander NTE74H62 IC-TTL, High Speed 4-Wide AND/OR Expander NTE74H71 IC-TTL, High Speed AND Gated J-K Master/Slave Flip-Flop with Preset and Clear NTE74H60 IC-TTL, High Speed Dual 4-Input Expander NTE74H72 IC-TTL, High Speed, AND Gated Page 26-6 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE74H73 IC-TTL, High Speed, Dual J-K Flip-Flop w/Clear NTE74H74 IC-TTL, High Speed Dual D-Type Pos Edge Triggered Flip-Flop w/Present & Clear NTE74H76 IC-TTL, High Speed, Dual J-K Flip-Flop w/Present & Clear NTE74H78 IC-TTL, High Speed, Dual J-K Flip-Flop w/Present Common Clear & Common Clock NTE74H87 IC-TTL, High Speed, 4-Bit True/ Complement Zero/One Element NTE74HC00 IC-TTL, High Speed CMOS, QUAD 2-Input NAND Gate NTE74HC02 IC-TTL, High Speed CMOS, Quad 2-Input NOR Gate NTE74HC04 IC-TTL, High Speed CMOS, Hex Inverter NTE74HC08 IC-TTL, High Speed CMOS, Quad 2-Input AND Gate NTE74HC10 IC-TTL, High Speed CMOS, Triple 3-Input NAND Gate NTE74HC109 IC-TTL, High Speed CMOS, Dual J-K Flip-Flop w/Present & Clear NTE74HC11 IC-TTL, High Speed CMOS, Triple 3-Input AND Gate NTE74HC123 IC-TTL, High Speed CMOS, Dual Retriggerable Monostable Multivibrator NTE74HC125 IC-TTL, High Speed CMOS, TRI-STATE Quad Buffer NTE74HC126 IC-TTL, High Speed CMOS, TRI-STATE Quad Buffer NTE74HC132 IC-TTL, High Speed CMOS, Quad 2-Input NAND Schmitt Trigger NTE74HC138 IC-TTL, High Speed CMOS, 3-to-8-Line Decoder/ Demultiplexer NTE74HC139 IC-TTL, High Speed CMOS, Dual 2-to-4-line Decoder/ Demultiplexer NTE74HC14 IC-TTL, High Speed CMOS, Hex Schmitt Trigger Inverter NTE74HC151 IC-TTL, High Speed CMOS, 8-Channel Multiplexer NTE74HC153 IC-TTL, High Speed CMOS, Dual 4-Input, Multiplexer NTE74HC154 IC-TTL, High Speed CMOS, 4-to-16-Line Decoder/ Demultiplexer NTE74HC161 IC-TTL, High Speed CMOS, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74HC163 IC-TTL, High Speed CMOS, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74HC164 IC-TTL, High Speed CMOS, 8-Bit Serial-In/ Parallel-Out Shift Register NTE74HC165 IC-TTL, High Speed CMOS, Parallel-In/ Serial-Out 8-Bit Shift Register NTE74HC173 IC-TTL, High Speed CMOS, Tri-State Quad D-Type Flip-Flop Part Number Description NTE74HC273 IC-TTL, High Speed CMOS, Octal D-Type Flip-Flop w/ Clear NTE74HC299 IC-TTL, High Speed CMOS, 8-Bit TRI-STATE Universal Shift Register NTE74HC32 IC-TTL, High Speed CMOS, Quad 2-Input OR Gate. NTE74HC373 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HC374 IC-TTL, High Sped CMOS, TRI-STATE Octal D-Type Flip-Flop NTE74HC377 IC-TTL, High Speed CMOS, Octal D-Type Flip-Flop NTE74HC390 IC-TTL, High Speed CMOS, Dual 4-Bit Decade Counter NTE74HC393 IC-TTL, High Speed CMOS, Dual 4-Bit Binary Counter NTE74HC40105 IC-TTL, High Speed CMOS, 4-Bit x 16 Word FIFO Register NTE74HC4020 IC-TTL, High Speed CMOS, 14-Stage Binary Counter NTE74HC4040 IC-TTL, High Speed CMOS, 12-Stage Binary Counter NTE74HC4053 IC-TTL, High Speed CMOS, Triple 2-Channel Analog Multiplexer/Demultiplexer NTE74HC4060 IC-TTL, High Speed CMOS, 14-Stage Binary Counter/ Oscillator NTE74HC4067 IC-TTL, High Speed CMOS, 16-Channel/ Multiplexer/Demultiplexer NTE74HC574 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Edge Triggered Edge NTE74HC86 IC-TTL, High Speed CMOS, Quad 2-Input Exclusive OR Gate NTE74HCT00 IC-TTL, High Speed CMOS, Quad 2-Input NAND Gate NTE74HCT04 IC-TTL, High Speed CMOS, Hex Inverter NTE74HC573 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HCT08 IC-TTL, High Speed CMOS, Quad 2-Input AND Gate NTE74HCT138 IC-TTL, High Speed CMOS, 3-to-8-Line Decoder/ Demultiplexer NTE74HCT14 IC-TTL, High Speed CMOS, Hex Schmitt Trigger Inverter NTE74HCT161 IC-TTL, High Speed CMOS, 4-Bit Binary Counter w/Asynchronous Clear NTE74HCT163 IC-TTL, High Speed CMOS, 4-Bit Binary Counter w/Asynchronous Clear NTE74HCT174 IC-TTL, High Speed CMOS, Hex D-Type Flip-Flop w/ Clock and Clear NTE74HC175 IC-TTL, High Speed CMOS, Quad D-Type Flip-Flop w/Clear NTE74HC240 IC-TTL, High Speed CMOS, Inverting Octal TRI-STATE Buffer NTE74HC244 IC-TTL, High Speed CMOS, Octal TRI-STATE Buffer NTE74HC257 IC-TTL, High Speed CMOS, Quad 2-Channel TRI-STATE Multiplexer NTE74HC174 IC-TTL, High Speed CMOS, Hex D-Type Flip-Flops w/Clock & Clear NTE74HC259 IC-TTL, High Speed CMOS, 8-Bit Addressable Latch/3-to-8 Line Decoder NTE74HCT240 IC-TTL, High Speed CMOS, Inverting Octal TRI-STATE Buffer NTE74HCT244 IC-TTL, High Speed CMOS, Octal TRI-STATE Buffer NTE74HCT273 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Flip- Flop w/ Clear NTE74HCT32 IC-TTL, High Speed CMOS, Quad 2-Input OR Gate. NTE74HCT373 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HCT573 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HCT574 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Flip- Flop NTE74L93 IC-TTL, 4-Bit Counter (Divide by 2 & 8) Page 26-7 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) NTE74LS00 Quad 2-Input Pos NAND Gate NTE74LS01 IC-TTL, Low Power Schottky, Quad 2-Input Pos NAND Gate w/Open Collector Outputs NTE74LS02 IC-TTL, Low Power Schottky, Quad 2-Input Pos NOR Gate NTE74LS03 IC-TTL, Low Power Schottky, Quad 2-Input Pos NAND Gate w/Power Collector Outputs NTE74LS04 IC-TTL, Low Power Schottky, Hex Inverter NTE74LS05 IC-TTL, Low Power Schottky, Hex Inverter w/Open Collector Outputs NTE74LS06 IC-TTL, Low Power Schottky, Hex Inverter Buffer/Driver w/Open Collector HV Outputs NTE74LS08 IC-TTL, Low Power Schottky, Triple 3-Input Pos AND Gate NTE74LS09 IC-TTL, Low Power Schottky, Triple 3-Input Pos NAND Gate w/Open Collector Outputs NTE74LS124 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS125A IC-TTL, Low Power Schottky, Quad Bus w/3-State Outputs NTE74LS126A IC-TTL, Low Power Schottky, Quad Bus w/3-State Outputs Part Number Description NTE74LS10 IC-TTL, Low Power Schottky, Triple 3-Input Pos NAND Gate NTE74LS107 IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Clear NTE74LS109A IC-TTL, Low Power Schottky, Dual J-K Pos Edge Triggered Flip-Flop w/Clear & Present NTE74LS11 IC-TTL, Low Power Schottky, Triple 3-Input Pos AND Gate NTE74LS112A IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Present & Clear NTE74LS113 IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Present NTE74LS114 IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Present Common Clock & Clear NTE74LS12 IC-TTL, Low Power Schottky, Triple 3-Input Pos NAND Gate w/Open Collector Outputs NTE74LS122 IC-TTL, Low Power Schottky, Retriggerable Monostable Multivibrator w/Clear NTE74LS123 IC-TTL, Low Power Schottky, Dual Retriggerable Monostable Multivibrator w/Clear Part Number Description NTE74LS140 IC-TTL, Ultra-High Speed, Dual 4-Input Pos NAND "W"50 Line Driver NTE74LS145 IC-TTL, Low Power Schottky, BCD-to-Decimal Decoder/ Drive For Lamps, Relays MOS NTE74LS147 IC-TTL, Low Power Schottky, 10-Line Decimal-to-4-Line BCD Priority Encoder NTE74LS148 IC-TTL, Low Power Schottky, 8-Line-to-3-Line Octal Priority Encoder NTE74LS15 IC-TTL, Low Power Schottky, Triple 3-Input AND Gate w/Open Collector Outputs NTE74LS151 IC-TTL, Low Power Schottky, 8-Channel Multiplexer NTE74LS153 IC-TTL, Low Power Schottky, Dual4-Line-to-1 Line Data Selector/ Multiplexer NTE74LS155 IC-TTL, Low Power Schottky, Dual 2-Line-to-4-Line Decoder/ Demultiplxer w/Totem Pole Outputs NTE74LS156 IC-TTL, Low Power Schottky, Dual 2-Line-to-4-Line Decoder/Demultiplexer w/Open Collector Outputs NTE74LS157 IC-TTL, Low Power Schottky, Quad 2-to1-Line Data Selector/Multiplexer w/Non-Inverted Date Outputs NTE74LS158 IC-TTL, Low Pwr Schottky, Quad 2-to-1- Line Data Selector/Multiplexer w/Inverted Data Outputs NTE74LS160A IC-TTL, Low Power Schottky, Synchronous 4-Bit Decade Counter w/Direct Clear NTE74LS161A IC-TTL, Low Power Schottky, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74LS162A IC-TTL, Low Power Schottky, Synchronous 4-Bit Decade Counter w/ Synchronous Clear NTE74LS163 IC-TTL, Ultra-High Speed, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74LS163A IC-TTL, Low Power Schottky, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74LS164 IC-TTL, Low Power Schottky, 8-Bit Parallel-Out Serial Shift Register w/Async Clear NTE74LS165 IC-TTL, Low Power Schottky, 8-Bit Parallel-In/Serial-Out Shift Register NTE74LS166 IC-TTL, Low Power Schottky, 8-Bit, Parallel-In/Serial-Out Shift Register NTE74LS168A IC-TTL, Low Power Schottky, Synchronous Presettable BCD NTE74LS13 IC-TTL, Low Power Schottky, Dual 4-Input NAND Schmitt Decade Up-Down Counter Trigger NTE74LS132 IC-TTL, Low Power Schottky, Quad 2-Input Pos NAND Schmitt Trigger NTE74LS133 IC-TTL, Low Power Schottky, 13-Input Pos NAND Gate NTE74LS136 IC-TTL, Low Power Schottky, Quad Exclusive OR Gate w/Open Collector Outputs NTE74LS138 IC-TTL, Low Power Schottky, 3-of-8 Decoder/Demultiplexer NTE74LS139 IC-TLL, Low Power Schottky, Dual 4-to-4 Line Decoder/ Demultiplexer NTE74LS14 IC-TTL, Low Power Schottky, Hex Schmitt Trigger Inverter NTE74LS169A IC-TTL, Low Power Schottky, Synchronous Presettable 4-Bit Binary Up/Down Counter NTE74LS170 IC-TTL , Low Power Schottky, 4-by-4 Register File w/Open Collector Output NTE74LS173A IC-TTL, Low Power Schottky, 4-Bit D-Type Flip-Flop w/3-State Outputs NTE74LS174 IC-TTL, Low Power Schottky, Hex D-Type Flip Flop w/3-State Outputs NTE74LS175 IC-TTL, Low Power Schottky, Hex D-Type Flip Flop w/Serial Rail Outputs & Common Direct Clear Page 26-8 Semiconductors Part Number Description Integrated Circuits (cont.) Integrated Circuits (cont.) IC-TTL, Schottky, 256-Bit (32 x 8) PROM w/Open Collector Outputs NTE74LS181 IC-TTL, Low Power Schottky, Quad D-Type Flip-Flop w/Common Direct Clear & Complementary Outputs NTE74LS182 IC-TTL, Ultra-High Speed, Lock-Ahead Carry Generator NTE74LS188 NTE74LS189 IC-TTL, Schottky, 64-Bit RAM w/3-State Outputs NTE74LS190 IC-TTL, Low Power Schottky, Arithmetic Logic Unit/ Function Generator NTE74LS191 IC-TTL, Low Power Schottky, Synchronous Up/Down BCD Counter NTE74LS192 IC-TTL, Low Power Schottky, Synchronous Up/ Down BCD Counter (Dual Clock w/Clear) NTE74LS193 IC-TTL, Low Power Schottky, Synchronous Up/ Down Binary Counter (Dual Clock w/Clear) NTE74LS194 IC-TTL, Low Power Schottky, 4-Bit BiDirectional Universal Shift Register NTE74LS194A IC-TTL, Low Power Schottky, 4-Bit BiDirectional Universal Shift Register NTE74LS195A IC-TTL, Low Power Schottky, 4-Bit Parallel Access Shift Register NTE74LS196 IC-TTL, Low Power Schottky, Presentable Decade Counter/Latch NTE74LS197 IC-TTL, Low Power Schottky, Presettable Modulo-16 Binary Counter/Latch NTE74LS20 IC-TTL, Low Power Schottky, Dual 4-Input NAND Gate NTE74LS21 IC-TTL, Low Power Schottky, Dual 4-Input AND Gate NTE74LS22 IC-TTL, Low Power Schottky, Dual 4-Input NAND Gate w/Open Collector Outputs NTE74LS221 IC-TTL, Low Power Schottky, Dual Monostable Multivibrator NTE74LS240 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver/Receiver w/3-State Inverted Outputs NTE74LS241 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver/Receiver w/3-State Non-Inverted Outputs NTE74LS242 IC-TTL, Low Power Schottky, Quad Bus Transceiver w/Inverted 3-State Outputs NTE74LS243 IC-TTL, Low Power Schottky, Quad Bus Transceiver w/Non- Inverted 3-State Outputs NTE74LS244 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver/Receiver w/3-State Non-Inverted Outputs NTE74LS245 IC-TTL, Low Power Schottky, Octal Bus Transceiver w/Non- Inverted 3-State Outputs Part Number Description NTE74LS253 IC-TTL, Low Power Schottky, Quad Data Selector/Multiplexer w/3-State Outputs NTE74LS257 IC-TTL, Low Power Schottky, Quad Data Selector/Multiplexer w/Non-Inverted 3-State Outputs NTE74LS258 IC-TTL, Low Power Schottky, Quad Data Selector/Multiplexer w/Non-Inverted 3-State Outputs NTE74LS259 IC-TTL, Low Power Schottky, 8-Bit Addressable Latch NTE74LS26 IC-TTL, Low Power Schottky, Quad 2-Input High Voltage Interface NAND Gate NTE74LS260 IC-TTL, Low Power Schottky, Dual 5-Input NOR Gate NTE74LS266 IC-TTL, Low Power Schottky, Quad 2-Input Exclusive NOR Gate w/Open Collector Outputs NTE74LS27 IC-TTL, Low Power Schottky, Triple 3-Input Positive NOR Gate NTE74LS273 IC-TTL, Low Power Schottky, Octal D-Type Flip-Flop w/Common Clock & Single Rail Outputs NTE74LS279 IC-TTL, Low Power Schottky, Quad Set-Reset Latch w/Diode- Clamped Inputs & Totem Pole Outputs NTE74LS28 IC-TTL, Low Power Schottky, Quad 2-Input NOR Buffer/Clock Driver w/ Totem Pole Outputs NTE74LS280 IC-TTL, Low Power Schottky, 9-Bit Odd/ Even Parity Generator/Checker (N-Bit Cascadable) NTE74LS283 IC-TTL, Low Power Schottky, 4-Bit Binary Full Adder NTE74LS287 IC-TTL, Schottky, Bipolar 1024-Bit PROM, 50ns Max Addressable Access NTE74LS288 IC-TTL, Schottky, 256-Bit (32 x 8) PROM w/TRI-STATE Outputs NTE74LS290 IC-TTL,Low Power Schottky,Decade Counter(Divide by 2 & 5) NTE74LS293 IC-TTL, Low Power Schottky, 4-Bit Binary Counter (Divide by 2 & 5) NTE74LS295 IC-TTL, Low Power Schottky, 4-Bit Bidirectional Universal Shift Register NTE74LS295A IC-TTL, Low Power Schottky, 4-Bit Bidirectional Universal Shift Register NTE74LS298 IC-TTL, Low Power Schottky, Quad 2-Input Multiplexer w/Storage NTE74LS299 IC-TTL, Low Power Schottky, 8-Bit Shift Register w/3-State Outputs NTE74LS30 IC-TTL, Low Power, Schottky, 8-Input Pos NAND Gate. NTE74LS32 IC-TTL, Low Power Schottky, Quad 2-Input OR Gate. NTE74LS324 IC-TTL, Low Power Schottky, Voltage Controlled Oscillator NTE74LS247 IC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/3-State Non-Inverted Outputs NTE74LS248 lC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/International Pull-Up Outputs NTE74LS249 lC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/Open Collector Outputs NTE74LS251 IC-TTL, Low Power Schottky, Data Selector/Multiplexer w/True & Inverted 3-State Outputs NTE74LS327 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS33 IC-TTL, Low Power Schottky, Quad 2-Input NOR Buffer/Clock w/Open Collector Outputs NTE74LS348 IC-TTL, Low Power Schottky, 8-Line-to-3-Line Priority Encoder NTE74LS352 IC-TTL, Low Power Schottky, Dual 4-Line-to-1-Line Data Selector/Multiplexer (Inverting Version of NTE74LS153) Page 26-9 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE74LS365A IC-TTL, Low Power Schottky, 3-State Hex Bus/Buffer w/Non- Inverted Outputs NTE74LS366A IC-TTL, Low Power Schottky, 3-State Hex Bus/Buffer Drive w/Inverted Outputs NTE74LS367 IC-TTL, Low Power Schottky, Hex Bus/Buffer Driver w/Non- Inverted 3-State Outputs, Organize to Handle 4-Bit Data NTE74LS368 IC-TTL, Low Power Schottky, Hex Bus/Buffer Driver w/Inverted 3-State Outputs, Organize to Handle 4-Bit Data NTE74LS37 IC-TTL, Low Power Schottky, Quad 2-Input NAND Buffer NTE74LS373 IC-TTL, Low Power Schottky, Octal D-Type Latch w/3-State Outputs & Common Output Control NTE74LS374 IC-TTL, Low Power Schottky, Octal D-Type Flip-Flop w/3-State Outputs, Common Output Control & Common Clock NTE74LS377 IC-TTL, Low Power Schottky, Octal D-Type Flip-Flop w/Common Enable w/Clock & Single Rail Outputs NTE74LS378 IC-TTL, Low Power Schottky, Hex D-Type Flip-Flop w/Clock Enable NTE74LS379 IC-TTL, Low Power Schottky, Quad D-Type Flip-Flop NTE74LS38 IC-TTL, Low Power Schottky, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE74LS386 IC-TTL, Low Power Schottky, Quad 2-Input Exclusive OR Gate NTE74LS387 IC-TTL, Schottky, 1024-Bit (256 x 4) PROM w/Open Collector Outputs, 50ns Max Address Access NTE74LS390 IC-TTL, Low Power Schottky, Dual 4-Bit Decade Ripple Counter NTE74LS393 IC-TTL, Low Power Schottky, Dual 4-Bit Binary Ripple Counter NTE74LS395A IC-TTL, Low Power Schottky, 4-Bit Cascadable Shift Register w/3-State Outputs NTE74LS396 IC-TTL, Low Power Schottky, Octal Storage Register w/Parallel Access NTE74LS398 IC-TTL, Low Power Schottky, Quad 2-Port Register NTE74LS399 IC-TTL, Low Power Schottky, Quad 2-Input Multiplexer w/Storage NTE74LS40 IC-TTL, Low Power Schottky, Dual 4-Input NAND Buffer NTE74LS42 IC-TTL, Low Power Schottky, 4-Line-to-10-Line BCD-to- Decimal Decoder Part Number Description NTE74LS49 IC-TTL, Low Power Schottky, BCD-to-Seven -Segment Decoder/ Driver w/Open Collector Outputs NTE74LS490 IC-TTL, Low Power Schottky, Dual BCD Decade Ripple Counter NTE74LS51 IC-TTL, Low Pwr Schottky, Dual 2-Wide2-Input AND/OR Gate. NTE74LS54 IC-TTL, Low Power Schottky, 4-Wide AND/OR Invert Gate. NTE74LS540 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver w/Inverted 3-State Outputs NTE74LS541 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver w/Non- Inverted 3-State Outputs NTE74LS55 IC-TTL, Low Power Schottky, Expandable 2-Wide 4-Input AND/OR Invert Gate NTE74LS570 IC-TTL, Schottky, 2048-Bit PROM w/Open Collector Outputs NTE74LS571 IC-TTL, Schottky, 2048-Bit PROM w/3-State Outputs NTE74LS572 IC-TTL, Schottky, 4096-Bit PROM w/Open Collector Outputs NTE74LS624 IC-TTL, Low Power Schottky, Voltage Controlled Oscillator NTE74LS625 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS627 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS629 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS63 IC-TTL, Low Power Schottky, Hex Current-Sensing Interface Gate NTE74LS640 IC-TTL, Low Power Schottky, Inverting Octal Bus Transceiver w/3-State Outputs NTE74LS641 IC-TTL, Low Power Schottky, Non-Inverting, Octal Bus Transceiver w/Open Collector Outputs NTE74LS642 IC-TTL, Low Power Schottky, Inverting Octal Bus Transceiver w/Open Collector Outputs NTE74LS643 IC-TTL, Low Power Schottky, True & Inverting Octal Bus Transceiver w/3-State Outputs NTE74LS645 IC-TTL, Low Power Schottky, Non-Inverting, Octal Bus Transceiver w/3-State Outputs NTE74LS670 IC-TTL, Low Power Schottky, 4-By-4-Register File w/Simultaneous Read/Write, 3-State Outputs & Expandable to 1024 Words NTE74LS353 IC-TTL, Low Power Schottky, Dual 4-Line-to-1-Line Data Selector/Multiplexer NTE74LS363 IC-TTL, Low Power Schottky, Octal Transparent Latch w/3- State Outputs NTE74LS445 IC-TTL, Low Power Schottky, BCD-to-Decimal Decoder/Driver w/Open Collector Outputs NTE74LS47 IC-TTL, Low Power Schottky, BCD-to-Seven Segment Decoder/Driver w/Active Low, Open Collector Outputs NTE74LS472 IC-TTL, Schottky, 4096-Bit (512 x 8) PROM w/3-State Outputs NTE74LS474 IC-TTL, Schottky, 4096-Bit (512 x 8) PROM w/3-State Outputs NTE74LS48 IC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/International Pull-Up Outputs NTE74LS73 IC-TTL, Low Power Schottky, Dual J-K-Flip-Flop w/Clear NTE74LS74A IC-TTL, Low Power Schottky, Dual D-Type Pos Edge Triggered Flip-Flip w/Present & Clear NTE74LS75 IC-TTL, Low Power Schottky, 4-Bit Bistable Latch NTE74LS76A IC-TTL, Low Power Schottky, Dual J-K-Flip w/Present & Clear NTE74LS77 IC-TTL, Low Power Schottky, 4-Bit D-Type Latch NTE74LS78 IC-TTL, Low Power Schottky, Dual J-K Flip-Flop w/Present, Common Clear & Common Clock NTE74LS83A IC-TTL, Low Power Schottky, 4-Bit Binary Full Adder w/Fast Carry NTE74LS85 IC-TTL, Low Power Schottky, 4-Bit Magnitude Comparator Page 26-10 Semiconductors Part Number Description NTE74LS86 IC-TTL, Low Power Schottky, Quad 2-Input Exclusive OR Gate NTE74LS90 IC-TTL, Low Power Schottky, Decade Counter (Divide by 2&5) NTE74LS91 IC-TTL, Low Power Schottky, 8-Bit Shift Register w/Gated Serial Inputs & Serial Outputs NTE74LS92 IC-TTL, Low Power Schottky, Divide - by - Twelve Counter NTE74LS93 IC-TTL, Low Power Schottky, 4-Bit Binary Counter (Divide by 2 & 8) Integrated Circuits (cont.) Integrated Circuits (cont.) NTE74LS95B IC-TTL, Low Power Schottky, 4-Bit Shift Register NTE74S00 IC-TTL, Ultra-High Speed, Quad 2-Input Pos NAND Gate NTE74S02 IC-TTL, Ultra-High Speed, Quad 2-Input Pos NOR Gate NTE74S03 IC-TTL, Ultra-High Speed, Quad 2-Input Pos NAND Gate w/Open Collector Ouputs NTE74S04 IC-TTL, Ultra-High Speed, Hex Inverter NTE74S05 IC-TTL, Ultra-High Speed, Hex Inverter NTE74S08 IC-TTL, Ultra-High Speed, Quad 2-Input Pos AND Gate NTE74S09 IC-TTL, Ultra-High Speed, Quad 2-Input Pos AND Gate w/Collector Outputs NTE74S10 IC-TTL, Ultra-High Speed, Triple 3-Input Pos NAND Gate NTE74S11 IC-TTL, Ultra-High Speed, Triple 3-Input Pos AND Gate NTE74S112 IC-TTL, Ultra-High Speed, Dual J-K Neg Edge Triggered Flip- Flop w/Present & Clear Part Number Description NTE74S74 IC-TTL, Ultra-High Speed, Dual D-Type Pos Edge Triggered Flip-Flop w/Present & Clear NTE74S85 IC-TTL, Ultra-High Speed, 4-Bit Magnitude Comparator NTE74S86 IC-TTL, Ultra-High Speed, Quad 2-Input Exclusive OR Gate NTE75188 IC-TTL, DTL Quad Line Driver RS232C NTE75189 IC-TTL, DTL Quad Line Driver RS232C NTE74S51 IC-TTL, Ultra-High Speed, Dual 2-Wide 2-Input AND/OR Gate NTE74S64 IC-TTL, Ultra-High Speed, 4-2-3-2 Input AND/OR Invert Gate w/Totem Pole Ouputs NTE74S65 IC-TTL, Ultra-High Speed, 4-2-3-2 Input AND/OR Invert Gate w/Open Collector Outputs NTE75450B IC-TTL, Dual Peripheral AND Driver NTE75451B IC-TTL, Dual Peripheral AND Driver NTE75454B IC-TTL, Dual Peripheral NOR Driver NTE75491B IC-TTL, 4-Segment MOS TO LED Anode Driver NTE75492B IC-TTL, 6-Digit MOS to LED Cathode Driver NTE75493 IC-TTL, 4-Segment MOS to LED Anode Driver NTE75494 IC-TTL, 6-Digit MOS to LED Cathode Driver NTE74S40 IC-TTL, Ultra-High Speed, Dual 4-Input NAND Buffer Transient Suppressors Part Number Description NTE4900 Overvoltage Transient Suppressor, Vr =5.0V NTE4901 Overvoltage Transient Suppressor, Bi-Directional Vr =5.0V NTE4902 Overvoltage Transient Suppressor, Vr =5.8V NTE4903 Overvoltage Transient Suppressor, Bi-Directional Vr =5.50V NTE4904 Overvoltage Transient Suppressor, Vr =6.40V NTE4905 Overvoltage Transient Suppressor, Bi-Directional Vr =6.40V NTE4906 Overvoltage Transient Suppressor, Vr =7.02V NTE4907 Overvoltage Transient Suppressor, Bi-Directional Vr =7.02V NTE4910 Overvoltage Transient Suppressor, Vr =8.55V NTE4911 Overvoltage Transient Suppressor, Bi-Directional Vr =8.55V NTE4914 Overvoltage Transient Suppressor, Vr =10.20V NTE4915 Overvoltage Transient Suppressor, Bi-Directional Vr =10.20V NTE4918 Overvoltage Transient Suppressor, Vr =11.1V NTE4919 Overvoltage Transient Suppressor, Bi-Directional Vr =11.1V NTE4920 Overvoltage Transient Suppressor, Vr =12.80V NTE4921 Overvoltage Transient Suppressor, Bi-Directional Vr =12.80V NTE74S113 IC-TTL, Ultra-High Speed, Dual J-K Neg Edge Triggered Flip- Flop w/Present NTE4922 Overvoltage Transient Suppressor, Vr =13.60V NTE4923 Overvoltage Transient Suppressor, Bi-Directional Vr =13.60V NTE4926 Overvoltage Transient Suppressor, Vr =15.3V NTE4927 Overvoltage Transient Suppressor, Bi-Directional Vr =15.3V NTE4929 Overvoltage Transient Suppressor, Bi-Directional Vr =17.1V NTE4933 Overvoltage Transient Suppressor, Bi-Directional Vr =20.50V NTE4934 Overvoltage Transient Suppressor, Vr =23.1V NTE4935 Overvoltage Transient Suppressor, Bi-Directional Vr =23.1V NTE4936 Overvoltage Transient Suppressor, Vr =25.60V NTE4932 Overvoltage Transient Suppressor, Vr=20.50V NTE4937 Overvoltage Transient Suppressor, Bi-Directional Vr =25.60V NTE4938 Overvoltage Transient Suppressor, Vr =28.20V NTE4939 Overvoltage Transient Suppressor, Bi-Directional Vr =28.20V NTE4940 Overvoltage Transient Suppressor, Vr =30.80V NTE4944 Overvoltage Transient Suppressor, Vr =36.80V NTE4941 Overvoltage Transient Suppressor, Bi-Directional Vr =30.80V NTE4942 Overvoltage Transient Suppressor, Vr =33.30V NTE4943 Overvoltage Transient Suppressor, Bi-Directional Vr =33.30V NTE4928 Overvoltage Transient Suppressor, Vr =17.1V NTE74S114 IC-TTL, Ultra-High Speed, Dual J-K Neg Edge Triggered Flip- Flop w/Present, Common Clock & Clear NTE74S15 IC-TTL, Ultra-High Speed, Triple 3-Input And Gate w/Open Collector Outputs NTE74S20 IC-TTL, Ultra-High Speed, Dual 4-Input NAND Gate NTE74S22 IC-TTL, Ultra-High Speed, Dual 4-Input NAND Gate w/Open Collector Outputs NTE74S30 IC-TTL, Ultra-High Speed, 8-Input Pos NAND Gate NTE74S37 IC-TTL, Ultra-High Speed, Quad 2-Input NAND Buffer NTE74S38 IC-TTL, Ultra-High Speed, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE75452B IC-TTL, Dual Peripheral NAND Driver NTE75453B IC-TTL, Dual Peripheral OR Driver Page 26-11 Semiconductors Part Number Description NTE4945 Overvoltage Transient Suppressor, Bi-Directional Vr =36.80V NTE4946 Overvoltage Transient Suppressor, Vr =40.2V NTE4947 Overvoltage Transient Suppressor, Bi-Directional Vr =40.20V NTE4950 Overvoltage Transient Suppressor, Vr =43.6V NTE4951 Overvoltage Transient Suppressor, Bi-Directional Vr =43.6V NTE4952 Overvoltage Transient Suppressor, Vr =47.80V NTE4953 Overvoltage Transient Suppressor, Bi-Directional Vr =47.80V NTE4954 Overvoltage Transient Suppressor, Vr =53V NTE4955 Overvoltage Transient Suppressor, Bi-Directional Vr =53V NTE4958 Overvoltage Transient Suppressor, Vr =58.1V NTE4960 Overvoltage Transient Suppressor, Vr =64.10V NTE4961 Overvoltage Transient Suppressor, Bi-Directional Vr =64.10V Part Number Description NTE4959 Overvoltage Transient Suppressor, Bi-Directional Vr =58.1V NTE4979 Overvoltage Transient Suppressor,Bi-Directional Vr =145.00V NTE4980 Overvoltage Transient Suppressor, Vr =154.00V NTE4981 Overvoltage Transient Suppressor,Bi-Directional Vr =154.00V NTE4982 Overvoltage Transient Suppressor, Vr =185.00V NTE4983 Overvoltage Transient Suppressor,Bi-Directional Vr =185.00V NTE4984 Overvoltage Transient Suppressor, Vr =214.00V NTE4985 Overvoltage Transient Suppressor,Bi-Directional Vr =214.00V NTE4988 Overvoltage Transient Suppressor, Vr =171V NTE4989 Overvoltage Transient Suppressor,Bi-Directional Vr =171V NTE4990 Overvoltage Transient Suppressor, Vr =256.00V NTE4991 Overvoltage Transient Suppressor,Bi-Directional Vr =256.00V NTE4992 NTE4993 Overvoltage Transient Suppressor,Bi-Directional Vr =273.00V NTE4994 Overvoltage Transient Suppressor, Vr =300V NTE4962 Overvoltage Transient Suppressor, Vr =70.10V NTE4963 Overvoltage Transient Suppressor, Bi-Directional Vr =70.10V NTE4964 Overvoltage Transient Suppressor, Vr =77.80V NTE4965 Overvoltage Transient Suppressor, Bi-Directional Vr =77.80V NTE4966 Overvoltage Transient Suppressor, Vr =85.80V NTE4967 Overvoltage Transient Suppressor, Bi-Directional Vr =85.50V NTE4968 Overvoltage Transient Suppressor, Vr =94.00V NTE4969 Overvoltage Transient Suppressor, Bi-Directional Vr =94.00V NTE4970 Overvoltage Transient Suppressor, Vr =102.00V NTE4971 Overvoltage Transient Suppressor, Bi-Directional Vr =102.00V NTE4972 Overvoltage Transient Suppressor, Vr =111.00V NTE4973 Overvoltage Transient Suppressor, Bi-Directional Vr =111.00V NTE4995 Overvoltage Transient Suppressor,Bi-Directional Vr =300V NTE4996 Overvoltage Transient Suppressor, Vr =342.00V NTE4997 Overvoltage Transient Suppressor,Bi-Directional Vr =342.00V NTE4998 Overvoltage Transient Suppressor, Vr =376.00V NTE4999 Overvoltage Transient Suppressor,Bi-Directional Vr =376.00V NTE4976 Overvoltage Transient Suppressor, Vr =136.00V NTE4977 Overvoltage Transient Suppressor,Bi-Directional Vr =136.00V NTE4974 Overvoltage Transient Suppressor, Vr =121.00V NTE4975 Overvoltage Transient Suppressor,Bi-Directional Vr =128.00V NTE4978 Overvoltage Transient Suppressor, Vr =145.00V Transient Suppressors (cont.) Transient Suppressors (cont.) NTE5000A Zener Diode, 2.4V, 1/2W, 5% Tol NTE5001A Zener Diode, 2.5V, 1/2W, 5% Tol NTE5002A Zener Diode, 2.7V, 1/2W, 5% Tol NTE5003A Zener Diode, 2.8V, 1/2W, 5% Tol NTE5004A Zener Diode, 3.0V, 1/2W, 5% Tol NTE5005SM Zener Diode, 3.3V, 300mW, 5% Tol, Surface Mount NTE5007A Zener Diode, 3.9V, 1/2W, 5% Tol NTE5005A NTE5007SM Zener Diode, 3.3V, 1/2W, 5% Tol Zener Diode, 3.9V, 300mW, 5% Tol, Surface Mount NTE5008A Zener Diode, 4.3V, 1/2W, 5% Tol NTE5008SM Zener Diode, 4.3V, 300mW, 5% Tol, Surface Mount NTE5009A Zener Diode, 4.7V, 1/2W, 5% Tol NTE5009SM Zener Diode, 4.7V, 300mW, 5% Tol, Surface Mount NTE5010A Zener Diode, 5.1V, 1/2W, 5% Tol NTE5010SM Zener Diode, 5.1V, 300mW, 5% Tol, Surface Mount NTE5010T1 Zener Diode, 5.1V, 1/2W, 1% Tol NTE5011A Zener Diode, 5.6V, 1/2W, 5% Tol NTE5011SM Zener Diode, 5.6V, 300mW, 5% Tol, Surface Mount NTE5011T1 Zener Diode, 5.6V, 1/2W, 1% Tol NTE5012A Zener Diode, 6.0V, 1/2W, 5% Tol NTE5013SM Zener Diode, 6.2V, 300mW, 5% Tol, Surface Mount NTE5013A Zener Diode, 6.2V, 1/2W, 5% Tol NTE5013T1 Zener Diode, 6.2V, 1/2W, 1% Tol NTE5014A Zener Diode, 6.8V, 1/2W, 5% Tol NTE5014SM Zener Diode, 6.8V, 300mW, 5% Tol, Surface Mount NTE5015A Zener Diode, 7.5V, 1/2W, 5% Tol Part Number Description Zener Diodes Overvoltage Transient Suppressor, Vr =273.00V Page 26-12 Semiconductors 2.4 5000A 5061A - - - 2.5 5001A 5062A - - - 2.7 5002A 5063A - - - 2.8 5003A 5064A - - - 3.0 5004A 5065A - - - 3.3 5005A 5066A 5111A - - 3.6 5006A 134A 5112A - - 3.9 5007A 5067A 5113A 5174A 5240A 4.3 5008A 5068A 5114A 5175A 5241A 4.7 5009A 5069A 5115A 5176A 5242A 5.1 5010A 135A 5116A 5177A 5243A 5.6 5011A 136A 5117A 5178A 5244A 6.0 5012A 5070A 5118A 5179A 5245A 6.2 5013A 137A 5119A 5180A 5246A 6.8 5014A 5071A 5120A 5181A 5247A 7.5 5015A 138A 5121A 5182A 5248A 8.2 5016A 5072A 5122A 5183A 5249A 8.7 5017A 5073A 5123A 5184A 5250A 9.1 5018A 139A 5124A 5185A 5251A 10.0 5019A 140A 5125A 5186A 5252A 11.0 5020A 5074A 5126A 5187A 5253A 11.5 - 141A - - - Zener Diodes (cont.) Rated Voltage ±5% PD NTE Number Axial Leads 1/2 Watt 1 Watt 5 Watt 10 Watt 50 Watt NTE Number Stud Mount Package Type Package Style DO35 DO41/DO15 DO4 DO5 Page 26-13 Semiconductors 12.0 5021A 142A 5127A 5188A 5254A 13.0 5022A 143A 5128A 5189A 5255A 14.0 5023A 144A 5129A 5190A 5256A 15.0 5024A 145A 5130A 5191A 5257A 16.0 5025A 5075A 5131A 5192A 5258A 17.0 5026A 5076A 5132A 5193A 5259A 18.0 5027A 5077A 5133A 5194A 5260A 19.0 5028A 5078A 5134A 5195A 5261A 20.0 5029A 5079A 5135A 5196A 5262A 22.0 5030A 5080A 5136A 5197A 5263A 24.0 5031A 5081A 5137A 5198A 5264A 25.0 5032A 5082A 5138A 5199A 5265A 27.0 5033A 146A 5139A 5200A 5266A 28.0 5034A 5083A 5140A 5201A 5267A 30.0 5035A 5084A 5141A 5202A 5268A 33.0 5036A 147A 5142A 5203A 5269A 36.0 5037A 5085A 5143A 5204A 5270A 39.0 5038A 5086A 5144A 5205A 5271A 43.0 5039A 5087A 5145A 5206A 5272A 45.0 - - - 5207A 5273A 47 5040A 5088A 5146A 5208A 5274A 50.0 - - - 5209A 5275A 51.0 5041A 5089A 5147A 5210A 5276A Zener Diodes (cont.) Rated Voltage ±5% PD NTE Number Axial Leads 1/2 Watt 1 Watt 5 Watt 10 Watt 50 Watt NTE Number Stud Mount Package Type Package Style DO35 DO41/DO15 DO4 DO5 Page 26-14 Semiconductors 52.0 - - - 5211A 5277A 55.0 - 148A - - - 56.0 5042A 5090A 5148A 5212A 5278A 60.0 5043A 5091A 5149A 5213A 5279A 62.0 5044A 149A 5150A 5214A 5280A 68.0 5045A 5092A 5151A 5215A 5281A 75.0 5046A 5093A 5152A 5216A 5282A 82.0 5047A 150A 5153A 5217A 5283A 87.0 5048A 5094A 5154A 5218A - 91.0 5049A 5095A 5155A 5219A 5284A 100.0 5050A 5096A 5156A 5220A 5285A 105.0 - - - 5221A 5286A 110.0 5051A 151A 5157A 5222A 5287A 120.0 5052A 5097A 5158A 5223A 5288A 130.0 5053A 5098A 5159A 5224A 5289A 140.0 5054A 5099A 5160A 5225A 5290A 150.0 5055A 5100A 5161A 5226A 5291A 160.0 5056A 5101A 5162A 5227A 5292A 170.0 5057A 5102A 5163A 5228A - 175.0 - - - 5229A 5293A 180.0 5058A 5103A 5164A 5230A 5294A 190.0 5059A 5104A 5165A 5231A 5295A 200.0 5060A 5105A 5166A 5232A 5296A Zener Diodes (cont.) Rated Voltage ±5% PD NTE Number Axial Leads 1/2 Watt 1 Watt 5 Watt 10 Watt 50 Watt NTE Number Stud Mount Package Type Package Style DO35 DO41/DO15 DO4 DO5 Page 26-15 Semiconductors Part Number Case Style Description NTE1961 TO220 (Isol) IC-Vltg Reg, Neg, -5V, 1A, Isol Tab NTE1913 TO3 IC-Vltg Reg, Neg, -5V, 1.5A NTE1917 TO92 IC-Vltg Reg, Neg, -5V, 100mA NTE963 TO220 IC-Vltg Reg, Neg, -6V, 1A NTE1963 TO220 (Isol) IC-Vltg Reg, Neg, -6V, 1A, Isol Tab NTE965 TO220 IC-Vltg Reg, Neg, -8V, 1A NTE961 TO220 IC-Vltg Reg, Neg, -5V, 1A Part Number Case Style Description NTE309K TO3 IC-Vltg Reg, Pos, 5V, 1A NTE 1934 TO3P IC-Vltg Reg, Pos, 5V, 2A NTE1934X TO3P IC-Vltg Reg, Pos, 5V, 2A NTE931 TO3 IC-Vltg Reg, Pos 5V, 3A NTE932 TO3 IC-Vltg Reg, Pos 5V, 5A NTE960 TO220 IC-Vltg Reg, Pos, 5V, 1A NTE 1960 TO220 (Isol) IC-Vltg Reg, Pos, 5V, 1A, Isol Tab NTE977 TO92 IC-Vltg Reg, Pos, 5V, 100mA NTE 1962 TO220 (Isol) IC-Vltg Reg, Pos, 6V, 1A, Isol Tab NTE988 TO92 IC-Vltg Reg, Pos, 6.2V, 100mA NTE964 TO220 IC-Vltg Reg, Pos, 8V, 1A NTE1964 TO220 (isol) IC-Vltg Reg, Pos, 8V, 1A, Isol Tab NTE981 TO92 IC-Vltg Reg, Pos, 8V, 100mA NTE1902 TO92 IC-Vltg Reg, Pos, 9V, 100mA NTE1910 TO220 IC-Vltg Reg, Pos, 9V, 1A NTE 1966 TO220 (Isol) IC-Vltg Reg, Pos, 9V, 1A, Isol Tab NTE1932 TO220 IC-Vltg Reg, Pos, 10V, 1A NTE 1968 TO220 (Isol) IC0Vltg Reg, Pos, 10V, 1A, Isol Tab NTE933 TO3 IC-Vltg Reg, Pos 12V, 5A NTE1912 TO3 IC-Vltg Reg, Pos, 12V, 3A NTE1914 TO3 IC-Vltg Reg, Pos, 12V, 1.5A NTE1936 TO3P IC-Vltg Reg, Pos, 12V, 2A NTE950 TO92 IC-Vltg Reg, Pos, 12V, 100mA NTE966 TO220 IC-Vltg Reg, Pos, 12V, 1A Voltage Regulators Positive, 3 terminal, arranged by output voltage TO3 TO3P TO220 TO220(Isol) TO92 Positive, 3 terminal, arranged by output voltage (cont.) Negative, 3 terminal, arranged by output voltage Part Number Case Style Description NTE1970 TO220 (Isol) IC-Vltg Reg, Pos, 12V, 1A, Isol Tab NTE951 TO92 IC-Vltg Reg, Pos, 15V, 100mA NTE968 TO220 IC-Vltg Reg, Pos, 15V, 1A NTE1972 TO220 (Isol) IC-Vltg Reg, Pos, 15V, 1A, Isol Tab NTE1938 TO3P IC-Vltg Reg, Pos, 15V, 2A NTE1920 TO3 IC-Vltg Reg, Pos, 18V, 3A NTE958 TO220 IC-Vltg Reg, Pos, 18V, 1A NTE1974 TO220 (Isol) IC-Vltg Reg, Pos, 18V, 1A, Isol Tab NTE1906 TO92 IC-Vltg Reg, Pos, 18V, 100mA NTE1924 TO3 IC-Vltg Reg, Pos, 24V, 1.5A NTE972 TO220 IC-Vltg Reg, Pos, 24V, 1A NTE1976 TO220 (Isol) IC-Vltg Reg, Pos, 24V, 1A, Isol Tab NTE1908 TO92 IC-Vltg, Pos, 24V, 100mA NTE1940 TO3P IC-Vltg, Pos, 24V, 2A IC-Vltg Page 26-16 Semiconductors Part Number Case Style Description NTE935 TO3 IC-Vltg Reg, Pos Adj., 1.2V to 32V, 5A NTE970 TO3 IC-Vltg Reg, Pos Adj., 1.2V to 33V, 3A NTE956 TO220 IC-Vltg Reg, Pos Adj., 1.2V to 37V, 1.5A NTE1900 TO92 IC-Vltg Reg, Pos Adj., 1.2V to 37V, 100mA NTE1942 TO220 IC-Vltg Reg, Pos Adj., 2.85V to 36V, 2A NTE1928 8-Lead Metal Can IC-Vltg Reg, Pos Adj., 4.5 V to 40 V, 45mA NTE953 4-Lead Power Tab IC-Vltg Reg, Pos Adj., 4-Terminal, 7.5V to 40V, 1A Part Number Case Style Description NTE1951 TO220 IC-Vltg Reg, Pos, 5V, 1A, Low Dropout NTE1952 TO220 IC-Vltg Reg, Pos, 8V, 1A, Low Dropout NTE1953 TO220 IC-Vltg Reg, Pos, 10V, 1A, Low Dropout NTE1954 TO220 IC-Vltg Reg, Pos, 12V, 1A, Low Dropout NTE1955 TO220 IC-Vltg Reg, Pos, 15V, 1A, Low Dropout Part Number Case Style Description NTE1965 TO220 (Isol) IC-Vltg Reg, Neg, -8V, 1A, Isol Tab NTE1967 TO220 (Isol) IC-Vltg Reg, Neg, -9V, 1A, Isol Tab NTE967 TO220 IC-Vltg Reg, Neg, -12V, 1A NTE1971 TO220 (Isol) IC-Vltg Reg, Neg, -12V, 1A, Isol Tab NTE1903 TO92 IC-Vltg Reg, Neg, -12V, 100mA NTE1915 TO3 IC-Vltg Reg, Neg, -12V, 1.5A NTE969 TO220 IC-Vltg Reg, Neg, -15V, 1A NTE1973 TO220 (Isol) IC-Vltg Reg, Neg, -15V, 1A, Isol Tab NTE1905 TO92 IC-Vltg Reg, Neg, -15V, 100mA NTE1919 TO3 IC-Vltg Reg, Neg, -15V, 1.5A NTE959 TO220 IC-Vltg Reg, Neg, -18V, 1A NTE1975 TO220 (Isol) IC-Vltg Reg, Neg, -18V, 1A, Isol Tab NTE1907 TO92 IC-Vltg Reg, Neg,-18V, 100mA NTE1923 TO3 IC-Vltg Reg, Neg, -18V, 100mA NTE971 TO220 IC-Vltg Reg, Neg, -24V, 1A NTE1977 TO220 (Isol) IC-Vltg Reg, Neg, -24V, 1A, Isol Tab NTE1909 TO92 IC-Vltg Reg, Neg, -24V, 100mA NTE1925 TO3 IC-Vltg Reg, Neg, -24V, 1.5A Voltage Regulators (cont.) Negative, 3 terminal, arranged by output voltage (cont.) Positive, low dropout voltage, arranged by output voltage 8-Lead Metal Can 8-Lead Dip 4-Lead Power 4-Lead TO3 10-Lead Metal Can 14-Lead Dip Axial TO3 TO220 TO92 Positive adjustable, arranged by output voltage Page 26-17 Semiconductors Part Number Output Configuration Viso Pt Ctr If Vf Vr Bvcbo Bvceo Ic NTE3040 NPN Transistor 7500 250 20 80 1.5 3 70 30 100 NTE3041 NPN Transistor 7500 300 100 60 1.5 6 70 30 50 NTE3042 NPN Transistor 7500 250 20 60 1.5 3 70 30 50 NTE3043 NPN Transistor 3550 260 70 60 1.5 3 70 80 50 NTE3044 NPN Darlington 7500 250 300 80 2.0 3 - 80 1000 NTE3045 NPN Darlington 7500 250 500 80 2.0 3 - 80 1000 NTE3081 NPN Transistor 6000 250 20 60 1.7 4 - 30 100 NTE3082 NPN Darlington 6000 250 400 60 1.7 4 - 30 100 NTE3083 NPN Darlington 7500 250 200 60 1.5 3 - 30 100 NTE3084 NPN Darlington 7500 250 100 60 1.5 3 - 55 100 NTE3086 Dual NPN Transistor 7500 400 50 60 1.5 3 - 30 100 NTE3088 HV NPN Transistor 7500 300 20 60 1.5 6 300 300 (Vcer) 100 NTE3089 AC Input NPN Transistor 7500 250 20 60 1.5 - 70 30 100 NTE3096 Low LED Drive NPN Transistor 7500 300 50 @ If = 1mA 60 1.4 6 70 30 25 NTE3098 NPN Transistor 5000 200 100 50 1.3 5 - 55 100 NTE3220 Dual NPN Transistor 5000 200 50 @ If = 5mA 50 1.2 6 - 35 50 NTE3221 Quad NPN Transistor 5000 200 50 @ If = 5mA 50 1.2 6 - 35 50 Part Number Case Style Description NTE1927 4-Lead TO3 IC-Vltg Reg, Neg Adj., -2.2V to -30V, 1A NTE957 TO220 IC-Vltg Reg, Neg Adj., - 1.2V to - 37V, 1.5A NTE1901 TO92 IC-Vltg Reg, Neg Adj., -1.2V to -37V, 100mA NTE1911 TO3 IC-Vltg Reg, Neg, Adj., -1.2V to -37V, 1.5A Voltage Regulators (cont.) Negative adjustable, arranged by output voltage Precision Voltage Regulators 0.01% line and load regulation, Positive or negative supply. Reference Voltage Regulators For electronic tuner. Optoisolators Phototransitor Outputs Part Number Case Style Description NTE923 10-Lead Metal Can IC-Linear, Precision Voltage Regulator NTE923D 14-Lead DIP IC-Linear, Precision Voltage Regulator Part Number Case Style Description NTE615 Axial Reference Voltage Regulator for Electronic Tuner NTE615P TO92 Reference Voltage Regulator for Electronic Tuner Page 26-18 Semiconductors 123AP 159 Amp, Gen Purpose 75/80 40/80 0.6/1 0.625 200/180 300 Min/200 TO92 46 - Darlington, Gen Purp Amp, Preamp, Driver 100 100 0.5 0.625 10000 Min 200 TO92 289A 290A Audio Pwr Amp 100 80 0.5 0.6 100 Min 120 TO92 194 - Audio Pwr Amp 180 160 0.6 0.31 100 100 Min TO92 287 288 High Vltg, Gen Purp Amp 300 300 0.5 0.625 40 Min 50 Min TO92 192 193 Audio Pwr Amp, Gen Purp 70 70 (CES) 1 1* 150 120 Min TO92HS 192A 193A Audio Pwr Output 70 70 (CES) 0.5 0.6 120 Min 120 TO92HS 48 - Darlington, High Current, Gen Purp Amp 60 50 (CES) 1 2.5* 25000 Min 100 Min Giant TO92 293 294 Audio Amp & Driver 60 50 1 1 120 Min 200 Giant TO92 297 298 Audio Amp Driver 80 80 0.5 0.75 130 Min 120 Giant TO92 90 91 Amp, High Vltg, High Gain 120 120 0.05 0.75/150 400 Min 350/20 Giant TO92 Part Number Output Configuration Viso Pt Ctr If Vf Vr Bvcbo Bvceo Ic NTE3100 NPN Transistor 6 60 1.7 55 100 100 250 8 50 NTE3101 NPN Darlington 6 60 1.7 55 100 100 250 7 45 NTE3102 NPN Transistor 6 60 1.7 55 100 100 250 8 50 NTE3103 NPN Darlington 6 60 1.7 55 100 100 250 7 45 NTE3105 NPN Transistor 3 50 1.3 30 20 200 75 20 20 TO92 TO92HS Giant TO92 Silicone Transistor Selector Guide NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagram Number IC PD hFE fT Maximum Collector Current (Amps) Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Diss. (Watts) Optoisolators Phototransitor Outputs (cont.) *Tc=25ºC Page 26-19 Semiconductors 31 32 Sound/Vert Output 160 160 1 0.9 100 Min 20 Min/15 Min Giant TO92 399 - High Vltg Video Amp 300 300 0.1 0.9 100 Min 50 Min Giant TO92 108-1 - Amp, RF/IF Video 30 15 0.05 0.625 20 Min 800 TO106 75 - High Pwr Amp, Switch 100 80 5 50 40 Min 50 Min TO111 95 - High Vltg, Switch Isolated Stud 250 250 3 40 90 Min 40 TO111 76 - Amp, Broad Band, CATV 50 30 0.4 5 30 Min 1500 TO117 2338 - Darlington Power Amp w/Internal Damper 60±10 60±10 1.5 10 2000 Min - TO126 184 185 Amp, High Speed Switch 80 80 4 40 25 Min 2 Min TO126 253 254 Darlington Pwr Amp 80 80 4 40 2,500 - TO126 295 - RF Power Output/Driver 80 40 1.5 5 20 Min 150 Min TO126 - 374 Audio Amp, Gen Purp 180 160 1.5 20 190 140 TO126 157 39 High Vltg Amp, Gen Purp 325/300 300 0.5 20 90/92 10 Min TO126 2327 - High Vltg, High Speed Sw 1000 (CES) 450 0.5 20 50 20 TO126 2501 2502 HV for Video Output 300 300 0.1 1.5 100 Min 70 TO126ML 78 - RF Pwr Output 36 18 0.6 5 5 Min - TO220 152 153 Amp, Gen Purp 60 60 5 50 60 10 TO220 236 - Final RF Pwr Amp 60 25 6 1.5 15 - B26 TO106 TO111 TO117 TO126 Silicone Transistor Selector Guide (cont.) NTE Type Number Application Package Style/Diagram Number Typical Forward Current Gain Typical Freq (MHZ) NPN PNP BVCBO BVCEO IC PD hFE fT Maximum Breakdown Voltage (Volts) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC Giant TO92 TO126ML TO220 Page 26-20 Semiconductors 2332 - Darlington w/Internal Damper & Zener Diode 60±10 60±10 2 20 4000 - TO220 2334 - Darlington Driver w/Internal Damper & Zener Diode 60±10 60±10 5 40 4000 20 TO220 235 - Final RF Pwr Amp 65 65(CER) 3 Pulse 12 80 300 TO220 241 242 Amp Gen Purp 80 80 4 60 25 Min 25 Min TO220 377 378 Pwr Amp, Pwr Driver, Switch 80 80 10 50 60 Min 50 TO220 196 197 Amp Gen Purp 90 80 (CER) 7 50* 20 Min 4 TO220 56 - High Gain Switch 100 80 3 30 500 Min 15 TO220 261 262 Darlington Pwr Amp 100 100 8 65 1000 Min - TO220 263 264 Darlington Pwr Amp 100 100 10 65 1000 Min - TO220 331 332 Audio Amp, Switch 100 100 15 90 40 Min 3 Min TO220 2343 2344 Darlington Audio Amp, Dr 100 100 12 80* 1000 Min - TO220 291 292 Amp, Gen Purp 130 120 4 40 70 4 Min/5 Min TO220 54 55 High Freq Audio Driver 150 150 8 50 100/120 30 Min TO220 375 398 Vert Deflection Amp 200 150 3/2 25 150/100 8/5 TO220 376 - TV Pwr Supply Driver 300 300 0.2 15* 100 70 TO220 2315 - Fast Switch Pwr Darlington 400 200 8 60 125 - TO220 198 - High Vltg Audio Output 500 500 (CES) 1 40* 80 10 Min TO220 51 - High Vltg, High Speed Sw 700 400 4 75 30 4 Min TO220 379 - High Vltg Switch 700 400 12 100 12 4 Min TO220 Silicone Transistor Selector Guide (cont.) TO220 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC Page 26-21 Semiconductors 2312 - HV High Speed Switch 700 CEV 400 (SUS) 8 80 60 Max 4 Min TO220 2325 - High Voltage Switch 900 800 3 50 8 Min 15 TO220 2313 - High Speed Switch 1000 (CES) 450 2 40 50 20 TO220 2333 - High Vltg, High Speed Sw 1000 (CES) 450 8 100* 4 Min 10 TO220 2303 - High Vltg Horiz Output 1500 750 2.5 65 4.5 4 TO220 2336 - Darlington Switch w/Internal Damper & Zener Diode 60±10 60±10 8 45 2000 Min - TO220 Isol Tab 2337 - High Vltg, High Speed Sw 900 500 7 2/45* 15 Min 20 TO220 Isol Tab 2339 - High Vltg, High Speed Sw 1100 800 3 30 20 Min 15 TO220 Isol Tab 216 - High Speed Switch 80 50 1 1.5 60 Min - TO237 128P 129P General Purp Amp 100 80 1 1/2 100 Min 150/125 TO237 24 25 General Purp Amp, Switch 100 80 1 2* 50 Min/40Min 150/125 TO237 227 - HV Amp Video Output 300 300 0.01 2* 40 Min 50 Min TO237 255 - Horiz Dr, Amp 325 300 0.5 2* 110 60 TO237 2340 - Darlington Sw w/Internal Damper Diode 60±10 60±10 8 45 2000 - "N" Pack 2351 2352 Darlington Pwr Amp, Sw 100 80 4 1 1000 Min - "N" Pack 2504 - High Gain Audio Amp 30 25 2 1.2 1500 260 TO126LP 182 183 High Speed Amp, Switch 70 60 10 90 20 min. 2 TO127 267 - Darlington Pwr Amp Switch 30 30 0.5 6.25 90000 min - TO202 265 - Darlington Pwr Amp Sw 50 50 0.5 6.25 10000 min - TO202 266 - Darlington Pwr Amp Switch 50 50 0.5 6.25 40000 min - TO202 - 269 Darlington Pwr Amp 50 50 2 10 1000 min - TO202 300 307 Audio Pwr Amp 50 40 1.5 7 90 min 65 TO202 186 187 Audio Driver, Output 70 60 3 12.5 100 min 50 TO202 299 - RF Pwr Amp Driver 75 35 1 4 70 min - TO202 Silicone Transistor Selector Guide (cont.) TO202 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagr am Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) “N” Pack TO126LP TO127 Max. Collector Current (Amps) Max. Collector Diss. (Watts) TO220 TO220 Isol Tab TO237 *Tc=25ºC Page 26-22 Semiconductors 210 211 Gen Purp Output Driver 90 75 1 6.25 120 min 200/150 min TO202 49 50 High Vltg Amp, Driver 120 100 2 10 100 150 TO202 171 - Audio, Video Amp 300 300 0.5 6.25 30 min 75 TO202 78 - RF Pwr Output 36 18 0.6 5 5 min - TO202M 79 - RF Pwr Output 36 18 2 15 5 min - TO202M 186A 187A Med Audio Amp 40/50 50/40 3 10 120 150 TO202M 228A - HV Amp Video Output 450 350 0.5 2-10* 25 Min 45 Min TO202M 272 273 Darlington Pwr Amp, Switch 50 40 2 10* 25000 Min - TO202N 322 - RF Pwr Output 65 65 (CES) 0.5 10 10 Min 100 TO202N 188 189 High Vltg Amp 80 80 2 10 60 Min 100 TO202N 190 - High Vltg Amp 180 180 1 10 40 Min 100 TO202N 191 240 High Vltg Amp 300 300 0.5 10 45 min/70 40 min/60 min TO202N 270 271 Darlington Pwr Amp Switch 100 100 10 125 1000 min - TO218 390 391 Pwr Amp, Switch 100 100 10 80 40 min 3 TO218 392 393 Pwr Amp, Switch 100 100 25 125 25 min 3 TO218 2305 2306 High Pwr Audio Amp 160 160 16 125 35 1 min TO218 2316 - HV Pwr Darlington 500 450 10 120 130 - TO218 394 - Pwr Amp, High Speed Sw 500 400 3 100 30 min - TO218 2317 - High Vltg. Fast Switch, Power Darlington 500 (CES) 450 15 150 300 min - TO218 256 - Darlington with Damper Diode 600 400 28 150 30 min - TO218 2310 - High Vltg 1000 450 8 125 10 - TO218 2311 - High Vltg/Speed Sw 1000 450 15 150 10 - TO218 2300 - High Vltg, Horiz Output 1500 700 8 125 6 - TO218 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) Silicone Transistor Selector Guide (cont.) TO202M TO202N *Tc=25ºC TO218 Page 26-23 Semiconductors 2301 - High Vltg Horiz Output 1500 750 5 100 5 4 TO218 2318 - HV Sw with Internal Damper Diode 1500(CES) 700 8 125 5 0.5 TO218 16002 - RF Power, Dr 65 40 3 23* 5 min 400 TO60 16003 - RF Power, Dr 65 40 1.5 11.6* 10 min 500 TO60 72 - High Current, Fast Switch 120 100 10 115 30 min 30 TO61 73 - High Vltg Switch 220 200 10 85 15 min 40 TO61 71 - High Current, Fast Switch 150 90 20 200 20 min 20 TO63 70 - Pwr Amp, High Vltg, Switch 180 150 50 250 30 min - TO63 274 275 Darlington Pwr Amp Switch 80 80 4 50 3000 - TO66 - 218 Audio Power Output 90 80 4 25 30 min 4 min TO66 124 - High Vltg, Gen Purpose 300 300 0.15 20 100 10 TO66 384 - High Vltg Pwr Amp/Switch 375 350 7 45 28 1 min TO66 175 38 Pwr Amp, Gen Purpose 500/400 300 (CER)/350 3/2 40/35 60/50 15/20 TO66 369 - Vert Deflection, Switch 800 400 3 Peak 40 30 min 7 TO66 319 - VHF Amp with AGC 20 20 0.05 0.26 80 300 min TO92 - 395 Wide Band Amp 30 25 0.05 0.36 80 2.3Ghz TO92 316 - High Gain, Lo Noise UHF Amp 30 15 0.05 0.2 25 min 1400 TO92 161 - VHF-UHF Amp, Mixer/OSC 45 45 (CES) 0.05 0.2 60 800 TO92 81 - Amp, Dual VHF, Switch 75/60 40/60 0.5/0.6 0.6/each 2 total 100 250/320 TO92 10 - UHF Low noise Amp 25 12 0.07 0.4 40 min 4.5GHz TO92 23 - Ultra High Freq Amp 30 14 0.05 0.25 80 2GHz TO92 107 - UHF OSC 30 15 0.05 0.2 75 1000 TO92 108 - RF-IF Amp 30 15 0.05 0.625 20 min. 800 TO92 Silicone Transistor Selector Guide (cont.) TO218 TO60 TO61 TO63 TO66 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC TO92 Page 26-24 Semiconductors 233 - Video IF OSC 30 30 0.1 0.625 45 300 min TO92 - 232 Gen Purp Darlington Amp 30 30 0.3 0.625 50000 min 175 TO92 69 - UHF/VHF Amplifier 35 25 0.05 1 60 1100 TO92 289 290 Audio Amp, Switch 35 30 0.8 0.6 120 min 100/120 TO92 11 12 High Current Am 40/27 20/18 5 0.75 230 min/180 min 150/120 TO92 319P - VHF Amp with AGC Control 40 30 0.05 0.5 80 300 min TO92 172A - Darlington Pre-Amp 40 40 0.3 0.4 7000 min 60 min TO92 229 - VHF OSC, Mixer 40 40 0.05 0.425 30 min 500 min TO92 47 - High Gain, Low Noise Amp 45 45 0.2 0.625 1150 160 TO92 199 234 Amp, Gen Purpose 70/120 50/120 0.1 0.36/0.3 400 min/350 min 90 min/100 TO92 85 - Amp, Gen Purp Switch 70 70 (CES) 0.4 0.625 120 min 200 min TO92 20 21 AF PO, Dr, Series Pass 40 32 2 1 120 min 100 ATR 16 17 Gen Purp Sm Sig Amp, Low Noise 50 40 0.1 0.3 270 min 180/140 ATR 18 19 High Breakdown Voltage Large Current Capacity Driver 80 80 0.7 1 120 min 120/100 ATR 22 - AF PO, Dr, Gen Purp Amp 100 80 1 0.9 120 min 100 ATR 302 - CB, Driver Switch 100 50 1.5 Peak 7.9 199 min 70 B2 306 - CB, Driver, Switch 100 50 1.5 Peak 7.9* 199 min 70 B2 15 - VHF Amp, Mixer, OSC, UHF OSC 30 19 50 0.3 39 min 1100 FTR - 14 Low Freq, Driver 80 80 0.7 0.75 120 min 100 FTR 315 - Medium Pwr Audio Amp 100 50 1 0.75 199 min - R245 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagr am Number IC PD hFE fT Max. Collector Diss. (Watts) Max. Collector Current (Amps) Typical Forward Current Gain Typical Freq (MHZ) Silicone Transistor Selector Guide (cont.) *Tc=25ºC TO92 ATR B2 FTR R245 Page 26-25 Semiconductors 382 383 Audio Freq Driver 120 100 1 0.9 200 140 R245 42 43 Dual, Differential Amp, High Gain Low Noise, Common Emitter 50 50 0.1 0.2/unit 0.4 total 400 min 100 min SIP-5 - 41 Dual, Differential Amp, High Gain Low Noise, Common Emitter 100 100 0.05 0.2/unit 0.4 total 400 min 100 min SIP-5 44 45 Dual, High Gain, Low Noise, Bias Amp, Common Base 100 100 0.1 0.2/unit 0.4 total 400 min 100 min SIP-5 2402 2403 Low Noise, UHF/VHF amp 20 15 0.025 0.2 90/50 5GHz SOT-23 - 2401 RF Stages in FM Front-Ends 30 30 0.025 0.3 - 450 SOT-23 2404 2405 Darlington 40 30 0.3 0.35 4000 min 220 SOT-23 2414 2415 Digital with 2 Built-in Bias 10k Resistors 50 50 0.1 0.2 50 min 250 SOT-23 2416 2417 Digital with 2 Built-in Bais 22k Resistors 50 50 0.1 0.2 50 min 250 SOT-23 2418 2419 Digital with 2 Built-in Bias 47k Resistors 50 50 0.1 0.2 50 min 250 SOT-23 2406 2407 General Purpose Amp 75/60 40/60 0.6 0.35 100 min 300 min/200 min SOT-23 2408 2409 Low Noise, Driver, Output 80 65 0.1 0.2 125 min/220 min 300/150 SOT-23 2410 2411 HV Amp/Dr 160 140/150 0.6/0.5 0.3/0.35 80 min/60 min 100 min SOT-23 2412 2413 General Purpose HV Amp 300 300 (CER) 0.05 0.31 50 min 60 min SOT-23 2345 2346 Dalington Power Amp 120 120 3 30 750 min - SOT-82 2426 2427 Darlington Switch 90 80 (CER) 0.5 1 2000 min - SOT-89 2428 2429 General Purpose Amp, SW 90 80 1 1 100 min 100 min SOT-89 2430 2431 HV Amp/Sw 400/350 350/300 1 1 30 min 15 min SOT-89 29 30 High Current Switch 80 80 50 300 25 2 TO3 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) IC Silicone Transistor Selector Guide (cont.) *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) R245 SIP-5 SOT-23 SOT-82 SOT-89 TO3 Page 26-26 Semiconductors 243 244 Darlington Power Amp 80 80 8 150 2500 - TO3 245 246 Darlington Power Amp 80 80 10 150 4000 - TO3 247 248 Darlington Power Amp 100 100 12 150 3000 - TO3 249 250 Darlington Power Amp 100 100 16 150 4000 - TO3 251 252 Darlington Power Amp 100 100 20 160 2500 - TO3 130 219 Power Amp, Gen Purpose 100 70 (CER) 15 115 20 min 2.5 min TO3 181 180 High Power Audio Amp 100 100 (CER) 30 200 25 min 2 min TO3 2349 2350 High Current Darlington 120 120 50 300 2000 min - TO3 60 61 High Power Audio Amp 140 140 20 250 150 max 2 min TO3 280 281 Audio Power Amp 150 150 12 100 70 5/6 TO3 328 - Power Amp, Switch 150 130 (CER) 15 140 12 min 60 min TO3 284 285 Audio Amp Output 180 180 16 150 70 6 TO3 327 - Power Amp, Switch 180 150 25 200 30 min 40 min TO3 387 - Power Amp, Switch 180 150 50 250 80 30 min TO3 87 88 High Power AF, Switch 250 250 (CEX) 10 200 20 min. - TO3 94 - High Voltage Switch 300 300 5 100 40 2.5 min TO3 388 68 Power Amp, Gen Purpose 400 250 16 250 30/35 4 min TO3 162 - TV Vert Deflection 500 300 10 Peak 100 20 min. - TO3 97 - HV Darlington Pwr Amp, Fast Sw 500 400 10 150 40 min - TO3 385 - Audio Power Amp, Switch 550 350 10 150 17 - TO3 99 - HV Darlington Pwr Amp, Fast Sw 600 400 50 250 25 min - TO3 98 - HV Darlington Pwr Amp, Fast Sw 700 500 20 175 40 min - TO3 163A - TV Horiz Deflection 700 700 (CEV) 6 100 10 min - TO3 Silicone Transistor Selector Guide (cont.) NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) IC TO3 *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) Page 26-27 Semiconductors 52 - High Vltg, High Speed Sw 750 450 5 125 17 - TO3 386 - Audio Power Amp, Switch 800 500 20 175 20 - TO3 283 - Horiz Output, Switch 800 325 10 100 10 min 6 TO3 53 - High Vltg, High Speed, Sw 850 400 15 175 25 6 min TO3 2319 - High Vltg, High Speed, Sw 850 (CES) 450 15 Cont 175 5 min - TO3 89 - Horiz Output with Internal Damper Diode 1500 600 7 50 8 min - TO3 164 - TV Vertical Output 1500 700 (CER) 1 50 30 min 3 TO3 389 - Horizontal Output 1500 1500 (CER) 4 100 10 min 4 min TO3 165 - TV Horizontal Output 1500 1400 (CES) 6 50 8 min 3 TO3 238 - TV Horizontal Output 1500 1500 (CEX) 8 100 8 - TO3 62 - Very High Vltg Horiz Output 2500 900 3 50 7 - TO3 2330 - High Gain Amp, with Internal Zener Diode 55+15- 10 55+15-10 4 80 1000 - TO3P 2335 - Darlington with Internal Zener Diode for Line Operated TV 60±15 60±15 5 80 2000 min - TO3P 2304 2314 High Current, Speed Switch 60 50 15 90 100 Min/ 70 Min 20 TO3P 214 - Darlington Driver 70 60 10 60* 5000 20 TO3P 215 - Darlington Driver 110 100 8 60* 4000 20 TO3P 36 37 Audio Power Amp 160 140 12 100 100 15 TO3P Silicone Transistor Selector Guide (cont.) TO3P NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) IC Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC TO3 Page 26-28 Semiconductors 2307 - High Gain, Power Amp 200 180 5 80 500 Min - TO3P 2308 - High Voltage/Current Switch 500 400 12 100* 15 Min 20 TO3P 2309 - High Voltage/Speed Switch 900 800 6 100 10 min 15 TO3P 2348 - High Voltage/Speed Switch 1100 800 12 150 10 min 15 TO3P 2302 - High Voltage Output with Internal Damper diode 1500 800 5 120 8 min 3 TO3P 2354 - High Vltg, Horiz Output for High Definition CRT 1500 800 10 150* 8 min - TO3P 2353 - Color TV Horiz Deflection with Damper Diode 1500 800 10 70* 5 min - TO3PML 2324 - High Voltage Switch 1500 800 8 70* 8 min - TO3PML 2331 - TV Horiz Deflection with Damper Diode 1500 800 6 60 8 min - TO3PML 16007 - Med Power Gen Purp 100 100 (CEV) 3 25 35 min 1.25 TO8 - 106 Amp, OSC, FM Mixer 35 15 0.05 0.35 50 min 650 min TO18 123A 159M General Purpose Amp 75/60 40/60 0.8/0.6 0.4 200/100 min 300/200 min TO18 278 - RF Amp, Broad Band 40 20 0.4 3.5 40 min 1400 TO39 346 - RF Driver, Predriver 40 20 0.4 1 10 min 500 min TO39 77 - Broad Band, CATV 50 30 0.4 3.5 30 min 1500 TO39 311 - Driver, VHF/UHF OSC 55 30 0.4 5 25 min 800 min TO39 329 - RF Power Amp - 30 1.5 Peak 5 - - TO39 195A - RF Pwr Amp, Driver 70 70 (CER) 1.5 8 30 min 150 TO39 123 - Amp, Gen Purpose 75 40 0.8 0.8 200 300 min TO39 Silicone Transistor Selector Guide (cont.) NPN PNP NTE Type Number Application BVCB O BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagr am Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC TO3P TO3PML TO8 TO18 Page 26-29 Semiconductors 282 - Final RF Powr Amp, Sw 100 60 4 10* 100 140 TO39 16005 16004 High Current Gen Purpose 100 75 2 10 30 min - TO39 128 129 Amp, Gen Purpose 120/90 80 1 1 90 min 100/150 min TO39 2347 - Med Power Gen Purp 120 80 5 4 40 min - TO39 324 323 Amp, Gen Purpose 120 100 1.5 0.8 90/80 20 min TO39 154 - High Vltg Video Output 300 300 0.2 1 100 80 TO39 396 397 Pwr Amp, High Vltg 450 350 350 300 1 10 40 min/30 min 15 min TO39 224 - Final RF Pwer Output 60 60 (CEV) 2 10 60 200 TO39 with Flange 225 - High Speed Sw Linear Amp 450 350 1 10 40 min 15 TO39 with Flange 237 - Final RF Pwr Out 80 40 3 Pulse 10 50 250 TO39HS 74 - Amp, Gen Purpose, Switch 100 100 7 60 60 min 30 TO59 96 - Switching Power Transistor 100 100 7 60 60 min 30 min TO59 95 - High Vltg, Switch Isolated Stud 250 250 3 40 90 min 40 TO59 2320 2320 Quad Gen Purp Sw Amp 60 30 0.5 0.65/Unit 1.25 total 100 min 350 14-Lead DIP 2321 - Quad Gen Purpose 60 40 0.5 0.65/Unit 1.25 total 100 min 350 14-Lead DIP - 2322 Quad Gen Purpose 60 40 0.6 0.65/Unit 1.25 total 100 min 350 14-Lead DIP 2323 - Quad High Vltg Gen Purpose Amp 200 200 0.5 0.75/Unit 1.7 total 80 80 14-Lead DIP Silicone Transistor Selector Guide (cont.) NPN PNP NTE Type Number Application BVCB O BVCE O Maximum Breakdown Voltage (Volts) Package Style/Diagram Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) TO39 TO39 w/Flange TO39HS TO59 14-Lead Dip Page 26-30 Semiconductors 58 59 High Pwr Audio Output 200 200 17 200 30 min 20 92 93 Hi-Fi Pwr Amp, Audio Output 200 200 15 150 120 20 63 - High gain, Low Noise, Wide Band, Small Signal Amp 20 12 0.04 0.4 40 5GHz 64 - UHF/Microwave Amp/Hi Speed Sw 25 15 0.03 0.375 80 4.5GHz 313 - VHF Mixer and UHF/RF Amp, High Gain Low Noise 30 30 0.02 0.15 60 530 2363 2364 High Current Gen Purp Amp 60 50 2 1 200 min 150 315 - Medium Power Audio Amp 100 50 1 0.75 199 min - 344 - RF Power Output 35 17 7 50 50 - 65 - High Vltg, Low Noise for CATV, MATV 20 15 0.025 0.18 70 6GHz 26 - Low Noise Audio Amp 120 120 0.1 0.2 350 min 100 2355 2356 Digital with 2 Built-in Bias 10k Resistors 50 50 0.1 0.3 50 min 250 2357 2358 Digital with 2 Built-in Bias 22k Resistors 50 50 0.1 0.3 50 min 250 2359 2360 Digital with 2 Built-in Bias 47k Resistors 50 50 0.1 0.3 50 min 250 2367 2368 Digital with 2 Built-in Bias 4.7k Resistors 50 50 0.1 0.3/0.2 30 min 250/200 2369 2370 Digital with 2 Built-in Bias 4.7k/47k Resistors 50 50 0.1 0.3/0.2 80 min 250/200 2361 2362 High Speed Switch 60 50 0.5 0.3 200 min 300/200 13 - Low Vlt Output Amp 25 20 0.5 0.6 400 min 200 16006 - AF Amp 20 20 0.7 1 1000 min - 16001 - Video IF Amp 45 35 0.05 0.6 50 500 NPN PNP NTE Type Number Application BVCB O BVCE O Maximum Breakdown Voltage (Volts) Package Type IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) Silicone Transistor Selector Guide (cont.) Page 26-31 Semiconductors 50 5800 5830 5850 - 5870 - 5940 5892 5912 - 5980 50 - 5831* 5851* - 5871* - 5941* 5893* 5913* - 5981* 100 5801 5832 5852 5812 5872 - 5942 5894 5914 - 5982 100 - 5833* 5853* - 5873* - 5943* 5895* 5915* - 5893* 200 5802 5834 5854 - 5874 - 5944 5896 5916 - 5986 200 - 5835* 5855* - 5875* - 5945* 5897* 5917* - 5987* 300 5803 5836 5856 - 5876 - 5946 5898 5918 - 5988 300 - 5837* 5857* - 5877* - 5947* 5899* 5919* - 5989* 400 5804 5838 5858 5814 5878 - 5948 5900 5920 5962 5990 400 - 5839* 5859* - 5879* - 5949* 5901* 5921* 5963* 5991* 500 5805 5840 5860 - 5880 - 5950 5902 5922 - 5992 500 - 5841* 5861* - 5881* - 5951* 5903* 5923* - 5993* 600 5806 5842 5862 5815 5882 6013 5952 5904 5924 - 5994 600 - 5843* 5863* - 5883* - 5953* 5905* 5925* - 5995* IFSM 200A 40A 150A 400A 250A 300A 250A 300A 400A 300A 500A VF @ IF 1.2V max 0.9V Typ 1.1V Max 0.9V Typ 1.1V Max 0.9V Typ 0.9V Max 0.8V Typ 1.2V Max 1V TyP 1.6V Max 1V Typ 1.5V Max 1.1V Typ 1.2V Max 0.9V Typ 1.5V Max 1.1V Typ 107V Max 1V Typ 1.2V Max 1V Typ TC @ IF (ºC) +105 (TL) +150 +150 +60 +150 - +150 +150 +150 +100 +150 Mtg Torque inlb (mN) - 20 (2.22) 20 (2.22) - 20 92.22) - 30 (3.33) 20 (2.22) 20 (2.22) - 30 (3.33) Thread Size - 10-32 NF-2A 10-32 NF-2A - 10-34 NF-2A - 1/4-28 UNF-2A 10-32 NF-2A 10-32 NF-2A - 1/4-28 UNF-2A Industrial Rectifiers Package Type Case Style Axial Lead TO220 DO5 PRV Volts Maximum Average Rectified Forward Current IF in Amperes 3A 6A 12A 12.7A 15A 16A 25A 40A DO27 DO4 DO4 20A DO4 Press Fit DO5 Page 26-32 Semiconductors 800 5808 5846 5866 - 5886 - - 5908 5928 5966 5998 800 - 5847* 5867* - 5887* - - 5909* 5929* 5967* 5999* 1000 5809 5848 5868 5817 5890 - - 5910 5932 - 6002 1000 - 5849* 5869* - 5891* - - 5911* 5933* - 6003* IFSM 200A 40A 150A 400A 250A 300A 250A 300A 400A 300A 500A VF @ IF 1.2V max 0.9V Typ 1.1V Max 0.9V Typ 1.1V Max 0.9V Typ 0.9V Max 0.8V Typ 1.2V Max 1V TyP 1.6V Max 1V Typ 1.5V Max 1.1V Typ 1.2V Max 0.9V Typ 1.5V Max 1.1V Typ 107V Max 1V Typ 1.2V Max 1V Typ TC @ IF (ºC) +105 (TL) +150 +150 +60 +150 - +150 +150 +150 +100 +150 Mtg Torque inlb (mN) - 20 (2.22) 20 (2.22) - 20 92.22) - 30 (3.33) 20 (2.22) 20 (2.22) - 30 (3.33) Thread Size - 10-32 NF-2A 10-32 NF-2A - 10-34 NF-2A - 1/4-28 UNF-2A 10-32 NF-2A 10-32 NF-2A - 1/4-28 UNF-2A Industrial Rectifiers (cont.) PRV Volts Maximum Average Rectified Forward Current IF in Amperes 3A 6A 12A 12.7A 15A 16A 20A 25A 40A Package Type Case Style DO27 DO4 Axial Lead DO4 TO220 DO5 DO4 Press Fit DO5 Not only do we have local experts, but Edge members have hundreds of specially trained professionals on staff who are experts in providing answers and prompt solutions to all your product needs. Page 26-33 Semiconductors PRV 1A 1.5A 2A 4A 4A 6A 8A 25A 40A 80A 100A 100 - - NTE166 - - - NTE5312 - - - - 200 - - NTE167 NTE5309 NTE5318 NTE5329 NTE5313 NTE5322 NTE5340 - - 400 - NTE5304 NTE168 - - - NTE5314 NTE5324 - - - 600 NTE5332 NTE5305 NTE169 NTE5310 NTE5319 NTE5330 NTE5315 NTE5326 NTE5342 NTE5346 NTE5348 800 - NTE5306 - - - - NTE5316 NTE5327 - - - 1000 NTE5334 NTE5307 NTE170 NTE5311 NTE5320 NTE5331 NTE5317 NTE5328 NTE5344 - - IFSM (AMP) 25 50 60 20 200 200 200 300 300 1000 1000 VF @ IF 1.2V @ 1A 1V @ 1A 1V @1A 1V @ 3A 1V @ 3A 1V @ 3A 1.1V @4A 1.2V @12.5A 1.2V @ 20A 1.3V @80A 1.3V @100A Max TA @ IF ºC +40 +30 +55 +50 +50 +50 +50 +55 +55 +150 +150 Single Phase Bridge Rectifiers IF Averaged Rectified Forward Current Maximum Average Rectified Current @ Half - Wave Resistive Load 60HZ Package Type PRV Volts No part of this catalog may be reproduced without the express written permission of Edge, Inc. Page 26-34 Semiconductors 25 - - - NTE5600 - - - - 50 - - - NTE5601 - - - NTE5661 100 - NTE5640 NTE560 NTE5602 - - - - 200 NTE5655 NTE5641 NTE5651 NTE5603 - - - - 300 - - - NTE5604 - - - - 400 NTE5656 NTE5642 NTE5652 NTE5605 NTE5629 NTE5608 NTE5638 - 500 - - - NTE5606 - - - - 600 NTE5657 NTE5643 NTE5653 NTE5607 - NTE5609 - - 800 - - - - - NTE5610 NTE5620 - IGT (mA) 5 Max 25/40 Max 3 Max 30 Max 3 Max 10 Max 10 Max 50/75 Max VGT (V) 2 Max 2.2 Max 2.2 Max 2.5 Max 2 Max 2.5 Max 2 Max 2 Max VFDN (V) 1.5 Max 1.8 Max 2.2Max 2 Max 1.6 Max 1.5 Max 1.6 Max 2 Max ISURGE (A) 8 Max 25 Max 25 Max 30 Max 40 Max 80 Max 80 Max 100 Max IHOLD (Ma) 20 Max 35 Max 5 Max 30 Max 5 Max 15 Max 15 Max 50 Max Firing Quads ALL ALL ALL ALL ALL ALL ALL ALL Triacs VRRM Dc or Pk Volts IT RMS Maximum Forward Current 0.8A 2.5A 4A 8A 10A Package Type Package TO92 TO5 TO126 TO202 TO220 TO220 Full Pack TO64** Page 26-35 Semiconductors 25 NTE5611 NTE5621 - - - - - NTE5680 - - 50 NTE5612 NTE5622 NTE5631 - - - - NTE5681 - - 100 NTE5613 NTE5623 NTE5632 - - - - MTE5682 - - 200 - - NTE5633 - NTE5673 NTE56004 - NTE5683 NTE56019 NTE56015 300 NTE5615 - NTE5634 - - - - NTE5684 - - 400 - - NTE5635 - NTE5675 NTE56006 - NTE5685 NTE56020 NTE56016 500 - - NTE5636 - NTE5676 - - NTE5686 - - 600 NTE5618 - NTE5637 NTE5645 NTE5677 NTE56008 - NTE5687 - NTE56017 800 - - - - - NTE56010 NTE5671 - - NTE56018 IGT (mA) 50/75 Max 50 Max 50 Max 25/50 Max 50/80 Max 40/75 Max 50/75 Max 75/100 Max 80 Max 50/100 Max VGT (V) 2.5 Max 2 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max VFON (V) 1.8 Max 1.8 Max 1.65 Max 1.6 Max 2.2 Max 1.6 Max 1.7 Max 1.8 Max 1.8 Max 1.8 Max ISURGE (A) 100 Max 100 Max 100 Max 110 Max 150 Max 150 Max 150 Max 250 Max 250 Max 180 Max IHOLD (Ma) 50 Max 50 Max 50 Max 50 Max 60 Max 40 Max 40 Max 80 Max 100 Max 50 Max Firing Quads ALL I, II I, II, III ALL ALL ALL ALL ALL I, II, III ALL Triacs (cont.) VRRM Dc or Pk Volts IT RMS Maximum Forward Current 10A 15A 20A 25A Package Type Package TO127 TO220 TO220 Full Pack TO220 Isolated TO48** 1/4-28 UNF-2A TO220 TO48** 1/4-28 UNF-2A TO220 Isolated TO220 Page 26-36 Semiconductors Package Type Case Style TO92 TO5 TO126 TO202 TO64 TO66 TO5 TO220 TO127 TO220 Full Pack TO64 TO220 25 NTE5480 30 NTE5400 NTE5411 NTE5452 50 NTE5453 NTE570 NTE5442 NTE5481 NTE5461 60 NTE5401 NTE5412 100 NTE5402 NTE5413 NTE5454 NTE5471 NTE5482 NTE5461 150 NTE5403 200 NTE5404 NTE5408 NTE5414 NTE5455 NTE5472 NTE5511 NTE5427 NTE5483 NTE5463 250 300 NTE5456 NTE5473 NTE5484 400 NTE5405 NTE5408 NTE5415 NTE5457 NTE5474 NTE5512 NTE5428 NTE5437 NTE5485 NTE5465 500 NTE5475 NTE5486 600 NTE5406 NTE5410 NTE5416 NTE5458 NTE5476 NTE5413 NTE5429 NTE5438 NTE5448 NTE5487 NTE5466 700 800 NTE5440 NTE5468 1200 IGT MAX 200 NA# 1mA# 200 NA# 200 NA# 10mA 15mA 25mA 200 NA# 30mA 30mA 15mA 15mA VGT MAX (V) 0.8 1.0 1.0 1.5 1.5 2.0 1.5 0.08 1.5 1.5 1.5 1.5 IHOLD MAX(ma) 5 10 5 3 25 20 50 3 40 30 20 20 VF(ON)(V) 1.7 1.2 2.0 2.2 2.0 2.8 2.6 1.6 1.5 2.0 1.75 2.0 Silicon Controlled Rectifiers Dc or Pk Volts VDRM IT RMS Maximum Forward Current (All Conducting Angles 4A Sensitive Gate 0.8A Sensitive Gate 3A Sensitive Gate 5A 7A 8A Sensitive Gate 8A 10A NTE5409 NTE5462 NTE5470 Page 26-37 Semiconductors 25 - - - - NTE5500 - NTE5520 - - - - - 30 - - - - - - - - - - - - 50 - - - - NTE5501 - NTE5521 NTE5550 - NTE5541 - - 100 - - NTE5491 - NTE5502 - NTE5522 - - NTE5542 - - 150 - - - - NTE5503 - NTE5523 - - - - - 200 NTE5417 - NTE5492 - NTE5504 NTE5514 NTE5524 NTE5552 NTE5543 NTE5517 NTE5- 562 250 - - - - NTE5505 - NTE5525 - - - - - 300 - - - - NTE5506 - NTE5526 - - NTE5544 - - 400 NTE5418 NTE5426 NTE5494 NTE314 NTE5507 NTE5515 NTE5527 NTE5554 - NTE5545 NTE5518 NTE5- 564 IGT MAX 15mA 200NA 15mA 40mA 30mA 15mA 40mA 30mA 40mA 30mA 30mA 30mA VGT MAX 1.5 0.8 2 2 1.5 2 3 1.5 1.5 2 2 2 IHOLD MAX 30 3 20 50 40 20 50 40 40 50 50 50 VF(ON) 1.6 1.6 2.5 1.8 1.6 2.4 2 1.6 1.8 1.6 1.6 1.6 ISURGE(A) 100 100 100 200 150 200 150 300 300 300 300 300 VGFM(V) - - 10 - 10 10 10 - - 10 10 10 GRM(V) - - 10 - 5 5 5 - - 10 10 10 Mtg Torque - - 30(3.33) - 30(3.33) - 30(3.33) - - 30(3.33) - 30(3.3- 3) Thread Size - - 1/4-28 UNF-2A - 1/4-28 UNF-2A - 1/4-28 UNF-2A - - 1/4-28 UNF-2A - 1/4-28 UNF-2- A Silicon Controlled Rectifiers (cont.) Dc or Pk Volts+ VDRM IT RMS Maximum Forward Current (All Conducting Angles 10A 10A 10A Sensitive Gate 12.5A 16A 20A 25A 35A 35A Package Type Case Style TO220 Isolated TO48 TO3 TO48 1/2” Press Fit TO48 TO220 TO220 Full Pack TO48 1/2” Press Fit TO48 Isol Stud Page 26-38 Semiconductors 500 - - - - NTE5508 - NTE5528 - - NTE5546 - - 600 NTE5419 NTE5496 - NTE5509 NTE5516 NTE5529 NTE5556 - NTE5547 NTE5- 519 NTE5566 700 - - - - - - NTE5530 - - - - - 800 - - - - - - NTE5531 NTE5558 NTE5460 NTE5548 - - 1200 - - - - - - - - - - - - IGT MAX 15mA 200A 15mA 40mA 30mA 15mA 40mA 30mA 40mA 30mA 30mA 30mA VGT MAX 1.5 0.8 2 2 1.5 2 3 1.5 1.5 2 2 2 IHOLD MAX 30 3 20 50 40 20 50 40 40 50 50 50 VF(ON) 1.6 1.6 2.5 1.8 1.6 2.4 .2 1.6 1.8 1.6 1.6 1.6 ISURGE(A) 100 100 100 200 150 200 150 300 300 300 300 300 VGFM(V) - - 10 - 10 10 10 - - 10 10 10 GRM(V) - - 10 - 50 5 5 - - 10 10 10 Mtg Torque - - 30(3.33) - 30 (3.33) - 30 (3.33) - - 30 93.33) - 30 (3.33) Thread Size - - 1/4-28 UNF-2A - 1/4-28 UNF-28 - 1/4-28 UNF-28 - - 1/4-28 UNF-28 - 1/4-28 UNF-28 Silicon Controlled Rectifiers (cont.) Dc or Pk Volts+ VDRM IT RMS Maximum Forward Current (All Conducting Angles 10A 10A 10A Sensitive Gate 12.5A 16A 20A 25A 35A 35A Package Type Case Style TO220 Isolated TO48 TO3 TO48 1/2” Press Fit TO48 TO220 TO220 Full Pack TO48 1/2” Press Fit TO48 Isol Stud Page 26-39 Semiconductors 200 - - - - NTE5567 NTE5570 NTE5575 NTE5580 NTE5590 - NTE5594 - 250 - - - - - - - - - - - - 300 - - - - - - - - - - - - 400 - - - NTE5539 - - - - - - - - 500 - - - - - - - - - - - - 600 NTE5534A - - - NTE5568 NTE5572 NTE5577 NTE5582 NTE5591 NTE5587 NTE5595 NTE5598 700 - - - - - - - - - - - - 800 - NTE5536 NTE5538 NTE5540 - - - - - - - - 1200 - - - - NTE5569 NTE5574 NTE5579 NTE5584 NTE5592 NTE5589 NTE5596 NTE5599 IGT Max 80mA 50mA 80mA 40mA 100mA 150mA 150mA 150mA 150mA 150mA 150mA 200mA VGT Max 1.5 1.5 3 1.5 2.5 3 3 3 3 3 3 3 IHOLD Max 150 60 150 60 200 - - - - - - - VF(ON) 2.0 1.6 2 1.8 1.6 1.95 2.2 1.5 1.55 1.4 1.4 1.35 ISURGE (A) 525 400 525 650 1255 1800 1600 5500 5500 10,000 10,000 27,000 VGFM (V) - - 15 - 20 4 - 4 5 5 5 5 VGRM (V) - - 5 - 5 5 5 5 5 5 5 5 Mtg Torque - - - - 30 (3.33) 130 (14.46) 130 (14.46) 360 (40.06) 1400 Lbs (6.2 KN) 360 (40.06) 2400 LBS (10.7KN) 5500 Lbs (24.5KN) Thread Size - - - - 1/4-28 1/2-20 1/2-20 3/4-16 - 3/4-16 - - Silicon Controlled Rectifiers (For Phase Control Applications) DC or Pk Volts VDRM IT RMS Maximum Forward Current Amps (All Conducting Angles) 40A 50A 55A 80A 125A 275A 470A 550A 850A 1800A Package Type Case Style TO3 Isolated Flange TO218 Isolated TO220 TO218 TO65 TO94 TO83 TO93 Hockey Puck 1.65” Dia TO118 Hockey Puck 2.3” Dia Hockey Puck 2.9” Dia Page 26-40 Semiconductors 600 5351 5360 5368 5371 5374 5380 5377 5386 1200 5369 5372 5375 5381 5378 5387 IGT Max 50mA 180mA 150mA 150mA 150mA 150mA 150mA 150mA VGT Max (V) 2 3 3 3 3 3 3 3 IHOLDMax (mA) 100 150 - - - - - - VF(on) Max (V) 2.06 2.05 3.2 3.3 1.85 1.85 1.45 1.45 ISURGE (A) 90 180 1400 1400 4500 4500 8000 8000 "Repetitive di/dt Amps/us Max" - - 150 150 300 300 400 400 "Non-Repetitive di/dt Amps/ns Max" 500 400 800 800 800 800 500 800 dv/dt Volts/μs Max 400 (Typ) 200 200 200 300 300 300 300 Turn-Off tq/μs Max 2.9 (Typ) 10 10 10 10 15 25 25 "Mounting Torque in.lb (m.N)" - 30 (3.33) 130 (14.46) 130 (14.46) 360 (40.06) 1400 lbs (6.2 kN) 360 (40.06) 2400 lbs (10.7 kN) Thread Size - 1/4-28 UNF-2A 1/2-20 UNF-2A 1/2-20 UNF-2A 3/4-16 UNF-2A - 3/4-16 UNF-2A - DC or Pk Volts VDRM IT RMS Maximum Forward Current Amps (All Conducting Angles) 5A 35A 125A 275A 400A 475A 700A Package Type Case Style TO66 TO83 TO94 Hockey Puck 1.65” Dia TO118 Hockey Puck 2.3” Dia TO48 TO93 Silicon Controlled Rectifiers (For High Speed Switching) Cross Reference NTE Semiconductors at: http://nte01.nteinc.com/nte/NTExRefSemiProd.nsf/$$Search?OpenForm Page 26-41 Semiconductors 1V010 8.5mm 10 12 0.8 250 18 45 0.25 2V010 16mm 10 12 3.5 1000 18 45 0.60 1V014 8.5mm 14 18 1.2 250 22 55 0.25 2V014 16mm 14 18 4.0 1000 22 55 0.60 1V015 8.5mm 15 20 1.0 250 24 52 0.25 2V015 16mm 15 20 4.5 1000 24 48 0.60 1V017 8.5mm 17 22 1.3 250 27 60 0.25 2V017 16mm 17 22 5.0 1000 27 60 0.60 1V020 8.5mm 20 26 1.5 250 33 70 0.25 2V020 16mm 20 26 6.0 1000 33 70 0.60 1V025 8.5mm 25 31 1.7 250 39 80 0.25 2V025 16mm 25 31 7.0 1000 39 80 0.60 1V030 8.5mm 30 38 2.3 250 47 95 0.25 230 Deflection Circuit of TV 700 8 90 2 50 1.8 100 - TO66 231 Deflection Circuit of TV 600 8 90 2 50 3.8 100 - TO66 314 Power Regulating Switch 400 12.5 200 2 40 20 Typ 50 5 TO3 Metal Oxide Varistor TO66 Silicon Controlled Rectifiers (For High Speed Switching Applications) TO3 NTE Type Number VDRM Description and Application ITRMS ITSM Package Style/Diag. Number Repetitive Peak Forward Off-State Voltage (V) RMS On- State Current (Amps) Peak Forward Surge Current (Amps) Maximum Ratings Gate Trigger Voltage (Volts) Gate Trigger Current (mA) VGT IGT Turn-Off Time (μs) toff Holding Current (mA) IHOLD Typical Reverse Recovery Time (μs) trr NTE Type Number Vm (AC) Case Diameter WTM RMS Voltage (Volts) DC Voltage (Volts) Energy (10/1000μs) (Joules) Maximum Ratings (TA=25ºC) Peak Current (8/20μs) (Amps) ITM Nom. Varistor Volt.@1 mA DC Test Current (V) VNOM Max. Clamping Volt.,Vc @Test Current (8/20μs)(V) Vm (DC) VCL PD Continuous Transient Characteristics Transient Pwr. Dissipation (Watts) Page 26-42 Semiconductors 2V030 16mm 30 38 8.5 1000 47 95 0.60 1V035 8.5mm 35 45 2.7 250 56 110 0.25 2V035 16mm 35 45 10.0 1000 56 110 0.60 1V040 8.5mm 43 55 3.2 250 68 135 0.25 2V040 16mm 43 55 13.0 1000 68 135 0.60 1V050 8.5mm 52 6 4.0 250 82 150 0.25 2V050 16mm 52 66 14.0 1000 82 150 0.60 1V060 8.5mm 63 80 6.0 1200 100 175 0.25 2V060 16mm 63 80 18.0 4500 100 175 0.60 1V075 8.5mm 75 95 5.0 1200 120 205 0.25 2V075 16mm 75 95 21.0 4500 120 205 0.60 1V095 8.5mm 95 125 7.0 1200 150 250 0.25 2V095 16mm 95 125 29.0 4500 150 250 0.60 1V115 8.5mm 115 150 10.0 1200 171 295 0.25 2V115 16mm 115 150 35.0 4500 171 300 0.60 1V130 8.5mm 135 180 10.0 1200 216 355 0.25 524V13 23mm 135 180 72.0 6500 216 355 1.00 1V150 8.5mm 160 210 10.0 1200 240 410 0.25 2V150 16mm 160 210 40.0 4500 240 410 0.60 524V15 23mm 160 210 80.0 6500 240 410 1.00 1V175 8.5mm 170 225 12.0 1200 270 450 0.25 524V17 23mm 170 225 90.0 6500 270 450 1.00 1V250 8.5mm 240 320 20.0 1200 390 630 0.25 2V250 16mm 240 320 70.0 4500 390 630 0.60 524V25 23mm 240 320 129.0 6500 390 630 1.00 1V275 8.5mm 260 330 20.0 1200 430 685 0.25 2V275 16mm 260 330 72.0 4500 430 685 0.60 524V27 23mm 260 330 135.0 6500 430 685 1.00 Metal Oxide Varistor (cont.) NTE Type Number Vm (AC) Case Diameter WTM RMS Voltage (Volts) DC Voltage (Volts) Energy (10/1000μs) (Joules) Maximum Ratings (TA=25ºC) Peak Current (8/20μs) (Amps) ITM Nom. Varistor Volt.@1 mA DC Test Current (V) VNOM Max. Clamping Volt.,Vc @Test Current (8/20μs)(V) Vm (DC) VCL PD Continuous Transient Characteristics Transient Pwr. Dissipation (Watts) Page 26-43 Semiconductors IC Sockets (Stamp Pins) Tin plated, stamped contacts. Pin spacing 0.1" (2.54mm). Two different row widths. Narrow: A= 7.62mm (0.3"). Wide: A= 15.20mm (0.6"). Multi Row Part #: SCS-38 Narrow (0.3") Part #’s: SCS-06, SCS-08, SCS-14, SCS-16, SCS-18, SCS-20, SCS-22, SCS-24, SCS-28, SCS-34 Pin Sockets (Machined Pins) Gold plated, 4 finger beryllium copper contacts. Tin plated outer sleeve. Pin spacing is 0.10" (2.54mm). Notched sides for cleaner breaking. Part #’s: HQ-1X16, HQ-1X20, HQ-1X30, HQ-1X40, HQ-2X30 Wire Wrap Pins Part #: HQA-1X40 IC Extractor Part #: SCS-IC-XTR Dual Wipe Standard I.C. Sockets 30% glass filled polyester UL94V-0 insulator. Contacts are phosphor bronze with 50 microinches hot tin dip. Bulk. Part Number Pins 39-008-0 8-position 39-014-0 14-position 39-016-0 16-position 39-018-0 18-position 39-024-0 24-position 39-028-0 28-position 39-020-0 20-position 39-032-0 32-position Wide (0.6") Part #’s: SCL-24, SCL-32, SCL-28, SCL-40 Thru Holes Part #’s: PLCC-28, PLCC-32, PLCC-44, PLCC-52, PLCC-68, PLCC- 84 Tin Plated Contacts Part #: PLCC-28T Chip Carriers Gold plated contacts and solder post. Plastic leaded chip carrier and surface mount chip carrier. Surface Mount Part #’s: SMT-28 NT, SMT-32 NT, SMT-44 NT, SMT-52 NT, SMT- 68 NT, SMT-84 NT Regular Part #’s: SQ-06, SQ-08, SQ-14, SQ-16, SQ-18, SQ-20, SQ-22, SQ-24, SQ-24N, SQ-28, SQ-40 Wire Wrap Part #’s: SQA-06, SQA-08, SQA-14, SQA-16, SQA-18, SQA-20, SQA-24, SQA-28, SQA-40 IC Socket (Machined Pins) Gold plated, 4 finger beryllium copper contacts. Tin plated outer sleeve. Pin spacing is 8-24 = 2.54mm x 7.62mm (0.1" x 0.3") and 24-40 = 2.54mm x 15.24mm (0.1" x 0.6"). Machined Contact I.C. Sockets 94V-0 PBT insulator 15 micro inch gold plated contact area. Part Number Type Pins 39-108-0 Bulk 8-position 39-114-0 Bulk 14-position 39-116-0 Bulk 16-position 39-140-0 Bulk 40-position P.C. Board Mount Dip IC Sockets Part Number Position 70-4608 8 70-4614 14 70-4616 16 70-4618 18 70-4620 20 70-4624 24 70-4628 28 70-4640 40 Features: 8, 14 ,16, 18, 20, 24, 28 and 40 contact available. Tin plated contact. Industry standard spacing. Specification: Contact resistance: 30m ohm max. at DC 100mA. Insulator resistance: 1000m ohm min. at DC 500V; Current rating: 1 amp dielectric withstanding. Voltage: AC 500V for one minute; Operating temperature: -55°C to 105°C. Contact: Phosphor bronze. Housing: PBT and 30% glass fiber (UL-94V-0). 39-040-0 40-position © 2010 Microchip Technology Inc. DS51775B-page 1 Overview The PIC32 USB Plug-In Module (PIM) demonstrates the capabilities of PIC32MX460F512 and PIC32MX795F512 microcontrollers using the Explorer 16 Development Board and the PICtail™ Plus Daughter Boards. This PIM supports USB device, embedded host, and On-The-Go (OTG) designs, when used in conjunction with the Explorer 16 and the USB PICtail Plus Daughter Board. The pinout for the PIC32 family of USB On-The-Go microcontrollers varies slightly from that of the General Purpose (GP) family. Therefore, on the USB PIM (MA320002), signals from the MCU are routed differently than those on the GP PIM (MA320001). This routing is intended to maximize the compatibility of the USB PIM with the Explorer 16 and its PICtail Plus daughter cards, therefore, some signals have changed location. See Figure 1 and Figure 3 for an overview of the PIM routing changes. Refer the PIM schematics (see Figure 2 and Figure 4 and the PIC32MX4XX (DS61143) and PIC32MX5XX/ 6XX/7XX (DS61156) family data sheets for additional details. FIGURE 1: USB PIM INTERCONNECT DIAGRAM FOR PIC32MX460F512 DEVICES RA14/SCL1 (66) *D-/RG3 (56) *VBUS (54) *USBID/RF3 (51) RB8/AN8 (32) *VBUSON/RB5 (20) *D+/RG2 (57) PIC32MX460F512 USB PICtail™ Plus RG2/SCL1 (57) D+ DVBUS USBID RA15/SDA1 (67) RA15 (67) RG3/SDA1 (56) RC4/*SDI1 (9) RC4 (9) RF7/SDI1 (54) RF8/*U1TX (53) U1TX/RF3 (51) RE8/INT1 (18) RE8/INT1 (18) RA14/INT3 (66) (32) [OVERCURRENT] (96) SHDN Explorer 16 (95) (89) (90) (1) (65) (60) (62) (68) (43) (67) J1/P1 P9/J4 RG15 (1) RD9 (69) RB2/C2IN-/AN2 (23) RB5/C1IN+/AN5 (20) RD9/SS1 (69) RB2/SS1 (23) RD0/*SDO1 (72) RF8/SDO1 (53) RD0 (72) *VUSB (55) VDD RG0 (90) NO CONNECT RG1 (89) NO CONNECT RG14 (95) NO CONNECT RG12 (96) NO CONNECT RD10/SCK1 (70) RD10 (70) RF6/SCK1 (55) RG13 (97) [PGOOD] (97) (66) RB6 (26) RB6 (26) Explorer 16 USB PIM RB0/CN2 (25) J10 RB0 (25) Legend: *xxx - Pin function changed from the PIC32MX3XX family. [xxx] - Pin function is optional, based on the USB PICtail™ Plus (xx) pin number. Pins not listed are unchanged from the PIC32MX3XX family. Revision History: REVB: Initial release REVC: Removed short between RB6 and RB8 REV1: Added Jumper J10 to allow CN2 to be used with PGOOD. PIC32MX PIC32 USB Plug-In Module for the Explorer 16 Development Board PIC32MX DS51775B-page 2 © 2010 Microchip Technology Inc. FIGURE 2: PIC32 USB PLUG-IN MODULE SCHEMATIC FOR PIC32MX460F512 DEVICES U1 PIC32MX460F512L © 2010 Microchip Technology Inc. DS51775B-page 3 PIC32MX FIGURE 3: USB PIM INTERCONNECT DIAGRAM FOR PIC32MX795F512 DEVICES RA14/SCL1 (66) *D-/RG3 (56) *VBUS (54) *USBID/RF3 (51) *RB8/AN8 (32) *VBUSON/RB5 (20) *D+/RG2 (57) PIC32MX795F512 USB PICtail™ Plus RG2/SCL1 (57) D+ DVBUS USBID RA15/SDA1 (67) RA15 (67) RG3/SDA1 (56) RC4/*SDI1 (9) RC4 (9) RF7/SDI1 (54) RF8/*U1TX (53) U1TX/RF3 (51) RE8/INT1 (18) RE8/INT1 (18) RA14/INT3 (66) (32) [OVERCURRENT] (96) [SHDN] Explorer 16 (95) (89) (90) (1) (65) (60) (62) (68) (43) (67) J1/P1 P9/J4 RG15 (1) RD9 (69) RB2/C2IN-/AN2 (23) RB5/C1IN+/AN5 (20) RD9/SS1 (69) RB2/SS1 (23) RD0/*SDO1 (72) RF8/SDO1 (53) RD0 (72) *VUSB (55) VDD RG0/C2RX (90) NO CONNECT RG1/C2TX (89) NO CONNECT RG14 (95) NO CONNECT RG12 (96) NO CONNECT RD10/SCK1 (70) RD10 (70) RF6/SCK1 (55) *RG13 (97) [PGOOD] (97) (66) Explorer 16 USB PIM RB0 (25) J10 RB0 (25) VCAP (85) C6 10 μF VCAP (85) Legend: *xxx - Pin function changed from the PIC32MX3XX family. [xxx] - Pin function is optional, based on the USB PICtail™ Plus (xx) pin number. Pins not listed are unchanged from the PIC32MX3XX family. Revision History: REV1: Initial release PIC32MX DS51775B-page 4 © 2010 Microchip Technology Inc. FIGURE 4: PIC32 USB PLUG-IN MODULE SCHEMATIC FOR PIC32MX795F512 DEVICES U1 PIC32MX795F512L © 2010 Microchip Technology Inc. DS51775B-page 5 PIC32MX REVISION HISTORY Revision A (October 2008) This is the original released version of the document. Revision B (April 2010) This revision includes the following updates: • Revised the “Overview” section • Updated Figure 1 and Figure 2 • Updated document to include information on the PIC32MX795F512 device • Added Figure 3 and Figure 4 PIC32MX DS51775B-page 6 © 2010 Microchip Technology Inc. NOTES: © 2010 Microchip Technology Inc. DS51775B-page 7 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-123-9 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51775B-page 8 © 2010 Microchip Technology Inc. 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As defined by IEC 60539, NTC (Negative Temperature Coefficient) thermistors are thermally sensitive semiconductor resistors which show a decrease in resistance as temperature increases.  SMD NTCs are designed for temperature measurement and compensation. Benefits for customer applications  Available case sizes 0402, 0603 and 0805 (1206 upon request)  Resistance values 1 kV up to 680 kV  Operating temperature range: –55 … +125 °C  Excellent long-term aging stability in high-temperature environment  Nickel barrier termination and lead-free solderability Important information: Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products. We expressly point out that these statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. It is incumbent on the customer to check and decide whether a product is suitable for use in a particular application. This publication is only a brief product survey which may be changed from time to time. Our products are described in detail in our data sheets. The Important notes (www.epcos.com /ImportantNotes) and the product-specific Cautions and warnings must be observed. All relevant information is available through our sales offices. B57221 V2472J060 B57230 V2103F260 B57221 V2103J060 B57261 V2223J060 B57221 V2473J060 B57321 V2102J060 B57301 V2472J060 B57330 V2103F260 B57321 V2103J060 B57371 V2103J060 B57321 V2223J060 B57371 V2223J060 B57321 V2473J060 B57371 V2473J060 B57371 V2104J060 B57371 V2474J060 B57421 V2102J062 B57421 V2222J062 B57401 V2472J062 B57471 V2472J062 B57421 V2103J062 B57471 V2103J062 B57421 V2223J062 B57471 V2223J062 B57471 V2473J062 B57471 V2104J062 B57471 V2474J062 Components Product range Electrical specifications and ordering codes EIA R25 DRR B25/50 B25/85 B25/100 Ordering code case size [kV] % [K] [K] [K] Case size 0402 0402 4.7 ±5 3940 3980 4000 ±3% B57221V2472J060 0402 10 ±1 3380 3435 3455 ±1% B57230V2103F260 0402 10 ±5 3940 3980 4000 ±3% B57221V2103J060 0402 22 ±5 4473 4548 4575 ±3% B57261V2223J060 0402 47 ±5 3940 3980 4000 ±3% B57221V2473J060 Case size 0603 0603 1 ±3, ±5 3940 3980 4000 ±3% B57321V2102+060 0603 4.7 ±3, ±5 3590 3635 3650 ±3% B57301V2472+060 0603 10 ±1 3380 3435 3455 ±1% B57330V2103F260 0603 10 ±3, ±5 3940 3980 4000 ±3% B57321V2103+060 0603 10 ±3, ±5 4386 4455 4480 ±3% B57371V2103+060 0603 22 ±3, ±5 3940 3980 4000 ±3% B57321V2223+060 0603 22 ±3, ±5 4386 4455 4480 ±3% B57371V2223+060 0603 47 ±3, ±5 3940 3980 4000 ±3% B57321V2473+060 0603 47 ±3, ±5 4386 4455 4480 ±3% B57371V2473+060 0603 100 ±3, ±5 4386 4455 4480 ±3% B57371V2104+060 0603 470 ±3, ±5 4386 4455 4480 ±3% B57371V2474+060 Case size 0805 0805 1 ±3, ±5 3940 3980 4000 ±3% B57421V2102+062 0805 2.2 ±3, ±5 3940 3980 4000 ±3% B57421V2222+062 0805 4.7 ±3, ±5 3590 3635 3650 ±3% B57401V2472+062 0805 4.7 ±3, ±5 4386 4455 4480 ±3% B57471V2472+062 0805 10 ±3, ±5 3940 3980 4000 ±3% B57421V2103+062 0805 10 ±3, ±5 4386 4455 4480 ±3% B57471V2103+062 0805 22 ±3, ±5 3940 3980 4000 ±3% B57421V2223+062 0805 22 ±3, ±5 4386 4455 4480 ±3% B57471V2223+062 0805 47 ±3, ±5 4386 4455 4480 ±3% B57471V2473+062 0805 100 ±3, ±5 4386 4455 4480 ±3% B57471V2104+062 0805 470 ±3, ±5 4386 4455 4480 ±3% B57471V2474+062 See enclosed CD-ROM for data sheets and further details. + = Resistance tolerance: H = ±3%, J = ±5% Application examples for SMD NTC thermistors Diagrams for LED, power amplifier and battery pack LED LED lifetime is extended if the current through the LED is controlled by using a NTC thermistor as temperature sensor. 10 kV ±5% 10 kV ±1% 100 kV ±5% Power amplifier Compensation circuit of a power amplifier using a NTC thermistor as temperature sensor. Battery pack Schematic drawing of the charging control unit of a battery pack using NTC thermistors as temperature sensors. 10 kV ±5% 10 kV ±1% Further applications: Temperature sensing and compensation in e.g.  Household electronics (refrigerators and deep-freezers, washing machines, water boilers, LED lighting etc.)  Heating and air-conditioning  Industrial electronics  Computer and consumer electronics  Telecommunications © EPCOS AG · A Member of TDK-EPC Corporation Edition 07/2012 · Ordering No. B57999V2999J099 · Printed in Germany · SO 0712.5 1. General description The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, and smaller packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc. The PCA9555 consists of two 8-bit Configuration (Input or Output selection); Input, Output and Polarity Inversion (active HIGH or active LOW operation) registers. The system master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each Input or Output is kept in the corresponding Input or Output register. The polarity of the read register can be inverted with the Polarity Inversion register. All registers can be read by the system master. Although pin-to-pin and I2C-bus address compatible with the PCF8575, software changes are required due to the enhancements, and are discussed in Application Note AN469. The PCA9555 open-drain interrupt output is activated when any input state differs from its corresponding input port register state and is used to indicate to the system master that an input state has changed. The power-on reset sets the registers to their default values and initializes the device state machine. Three hardware pins (A0, A1, A2) vary the fixed I2C-bus address and allow up to eight devices to share the same I2C-bus/SMBus. The fixed I2C-bus address of the PCA9555 is the same as the PCA9554, allowing up to eight of these devices in any combination to share the same I2C-bus/SMBus. 2. Features n Operating power supply voltage range of 2.3 V to 5.5 V n 5 V tolerant I/Os n Polarity Inversion register n Active LOW interrupt output n Low standby current n Noise filter on SCL/SDA inputs n No glitch on power-up n Internal power-on reset n 16 I/O pins which default to 16 inputs n 0 Hz to 400 kHz clock frequency n ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Rev. 08 — 22 October 2009 Product data sheet PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 2 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA n Six packages offered: DIP24, SO24, SSOP24, TSSOP24, HVQFN24 and HWQFN24 3. Ordering information 3.1 Ordering options Table 1. Ordering information Type number Package Name Description Version PCA9555N DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 PCA9555D SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 PCA9555DB SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 PCA9555PW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 PCA9555BS HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 ´ 4 ´ 0.85 mm SOT616-1 PCA9555HF HWQFN24 plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 ´ 4 ´ 0.75 mm SOT994-1 Table 2. Ordering options Type number Topside mark Temperature range PCA9555N PCA9555 -40 °C to +85 °C PCA9555D PCA9555D -40 °C to +85 °C PCA9555DB PCA9555 -40 °C to +85 °C PCA9555PW PCA9555 -40 °C to +85 °C PCA9555BS 9555 -40 °C to +85 °C PCA9555HF P55H -40 °C to +85 °C PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 3 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 4. Block diagram 5. Pinning information 5.1 Pinning Remark: All I/Os are set to inputs at reset. Fig 1. Block diagram of PCA9555 PCA9555 POWER-ON RESET 002aac702 I2C-BUS/SMBus CONTROL INPUT FILTER SCL SDA VDD INPUT/ OUTPUT PORTS IO0_0 VSS 8-bit write pulse read pulse IO0_2 IO0_1 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 INPUT/ OUTPUT PORTS IO1_0 8-bit write pulse read pulse IO1_2 IO1_1 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 INT A1 A0 A2 LP filter VDD Fig 2. Pin configuration for DIP24 Fig 3. Pin configuration for SO24 VDD SDA SCL A0 IO1_7 IO1_6 IO1_5 IO1_4 IO1_3 IO1_2 IO1_1 IO1_0 INT A1 A2 IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS PCA9555N 002aac697 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 INT VDD A1 SDA A2 SCL IO0_0 A0 IO0_1 IO1_7 IO0_2 IO1_6 IO0_3 IO1_5 IO0_4 IO1_4 IO0_5 IO1_3 IO0_6 IO1_2 IO0_7 IO1_1 VSS IO1_0 PCA9555D 002aac698 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 4 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 4. Pin configuration for SSOP24 Fig 5. Pin configuration for TSSOP24 Fig 6. Pin configuration for HVQFN24 Fig 7. Pin configuration for HWQFN24 INT A1 A2 IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS PCA9555DB 002aac699 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 VDD SDA SCL A0 IO1_7 IO1_6 IO1_5 IO1_4 IO1_3 IO1_2 IO1_1 IO1_0 VDD SDA SCL A0 IO1_7 IO1_6 IO1_5 IO1_4 IO1_3 IO1_2 IO1_1 IO1_0 INT A1 A2 IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS PCA9555PW 002aac700 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 002aac701 PCA9555BS Transparent top view IO1_3 IO0_4 IO0_5 IO1_4 IO0_3 IO1_5 IO0_2 IO1_6 IO0_1 IO1_7 IO0_0 A0 IO0_6 IO0_7 VSS IO1_0 IO1_1 IO1_2 A2 A1 VDD SDA SCL terminal 1 index area 6 13 5 14 4 15 3 16 2 17 1 18 7 8 9 10 11 12 24 23 22 21 20 19 INT 002aac881 Transparent top view IO1_3 IO0_4 IO0_5 IO1_4 IO0_3 IO1_5 IO0_2 IO1_6 IO0_1 IO1_7 IO0_0 A0 IO0_6 IO0_7 VSS IO1_0 IO1_1 IO1_2 A2 A1 INT VDD SDA SCL terminal 1 index area 6 13 5 14 4 15 3 16 2 17 1 18 7 8 9 10 11 12 24 23 22 21 20 19 PCA9555HF PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 5 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 5.2 Pin description [1] HVQFN and HWQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region. Table 3. Pin description Symbol Pin Description DIP24, SO24, SSOP24, TSSOP24 HVQFN24, HWQFN24 INT 1 22 interrupt output (open-drain) A1 2 23 address input 1 A2 3 24 address input 2 IO0_0 4 1 port 0 input/output IO0_1 5 2 IO0_2 6 3 IO0_3 7 4 IO0_4 8 5 IO0_5 9 6 IO0_6 10 7 IO0_7 11 8 VSS 12 9[1] supply ground IO1_0 13 10 port 1 input/output IO1_1 14 11 IO1_2 15 12 IO1_3 16 13 IO1_4 17 14 IO1_5 18 15 IO1_6 19 16 IO1_7 20 17 A0 21 18 address input 0 SCL 22 19 serial clock line SDA 23 20 serial data line VDD 24 21 supply voltage PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 6 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6. Functional description Refer to Figure 1 “Block diagram of PCA9555”. 6.1 Device address 6.2 Registers 6.2.1 Command byte The command byte is the first byte to follow the address byte during a write transmission. It is used as a pointer to determine which of the following registers will be written or read. Fig 8. PCA9555 device address R/W 002aac219 0 1 0 0 A2 A1 A0 programmable slave address fixed Table 4. Command byte Command Register 0 Input port 0 1 Input port 1 2 Output port 0 3 Output port 1 4 Polarity Inversion port 0 5 Polarity Inversion port 1 6 Configuration port 0 7 Configuration port 1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 7 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.2.2 Registers 0 and 1: Input port registers This register is an input-only port. It reflects the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by Register 3. Writes to this register have no effect. The default value ‘X’ is determined by the externally applied logic level. 6.2.3 Registers 2 and 3: Output port registers This register is an output-only port. It reflects the outgoing logic levels of the pins defined as outputs by Registers 6 and 7. Bit values in this register have no effect on pins defined as inputs. In turn, reads from this register reflect the value that is in the flip-flop controlling the output selection, not the actual pin value. 6.2.4 Registers 4 and 5: Polarity Inversion registers This register allows the user to invert the polarity of the Input port register data. If a bit in this register is set (written with ‘1’), the Input port data polarity is inverted. If a bit in this register is cleared (written with a ‘0’), the Input port data polarity is retained. Table 5. Input port 0 Register Bit 7 6 5 4 3 2 1 0 Symbol I0.7 I0.6 I0.5 I0.4 I0.3 I0.2 I0.1 I0.0 Default X X X X X X X X Table 6. Input port 1 register Bit 7 6 5 4 3 2 1 0 Symbol I1.7 I1.6 I1.5 I1.4 I1.3 I1.2 I1.1 I1.0 Default X X X X X X X X Table 7. Output port 0 register Bit 7 6 5 4 3 2 1 0 Symbol O0.7 O0.6 O0.5 O0.4 O0.3 O0.2 O0.1 O0.0 Default 1 1 1 1 1 1 1 1 Table 8. Output port 1 register Bit 7 6 5 4 3 2 1 0 Symbol O1.7 O1.6 O1.5 O1.4 O1.3 O1.2 O1.1 O1.0 Default 1 1 1 1 1 1 1 1 Table 9. Polarity Inversion port 0 register Bit 7 6 5 4 3 2 1 0 Symbol N0.7 N0.6 N0.5 N0.4 N0.3 N0.2 N0.1 N0.0 Default 0 0 0 0 0 0 0 0 Table 10. Polarity Inversion port 1 register Bit 7 6 5 4 3 2 1 0 Symbol N1.7 N1.6 N1.5 N1.4 N1.3 N1.2 N1.1 N1.0 Default 0 0 0 0 0 0 0 0 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 8 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.2.5 Registers 6 and 7: Configuration registers This register configures the directions of the I/O pins. If a bit in this register is set (written with ‘1’), the corresponding port pin is enabled as an input with high-impedance output driver. If a bit in this register is cleared (written with ‘0’), the corresponding port pin is enabled as an output. Note that there is a high value resistor tied to VDD at each pin. At reset, the device's ports are inputs with a pull-up to VDD. 6.3 Power-on reset When power is applied to VDD, an internal power-on reset holds the PCA9555 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9555 registers and SMBus state machine will initialize to their default states. The power-on reset typically completes the reset and enables the part by the time the power supply is above VPOR. However, when it is required to reset the part by lowering the power supply, it is necessary to lower it below 0.2 V. 6.4 I/O port When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a high-impedance input with a weak pull-up to VDD. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, then either Q1 or Q2 is on, depending on the state of the Output Port register. Care should be exercised if an external voltage is applied to an I/O configured as an output because of the low-impedance path that exists between the pin and either VDD or VSS. Table 11. Configuration port 0 register Bit 7 6 5 4 3 2 1 0 Symbol C0.7 C0.6 C0.5 C0.4 C0.3 C0.2 C0.1 C0.0 Default 1 1 1 1 1 1 1 1 Table 12. Configuration port 1 register Bit 7 6 5 4 3 2 1 0 Symbol C1.7 C1.6 C1.5 C1.4 C1.3 C1.2 C1.1 C1.0 Default 1 1 1 1 1 1 1 1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 9 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.5 Bus transactions 6.5.1 Writing to the port registers Data is transmitted to the PCA9555 by sending the device address and setting the least significant bit to a logic 0 (see Figure 8 “PCA9555 device address”). The command byte is sent after the address and determines which register will receive the data following the command byte. The eight registers within the PCA9555 are configured to operate as four register pairs. The four pairs are Input Ports, Output Ports, Polarity Inversion Ports, and Configuration Ports. After sending data to one register, the next data byte will be sent to the other register in the pair (see Figure 10 and Figure 11). For example, if the first byte is sent to Output Port 1 (register 3), then the next byte will be stored in Output Port 0 (register 2). There is no limitation on the number of data bytes sent in one write transmission. In this way, each 8-bit register may be updated independently of the other registers. At power-on reset, all registers return to default values. Fig 9. Simplified schematic of I/Os VDD I/O pin output port configuration register data register D Q CK Q data from shift register write configuration pulse output port register D Q write pulse CK polarity inversion register D Q CK data from shift register write polarity pulse input port register D Q read pulse CK input port register data polarity inversion register data 002aac703 FF data from shift register FF FF FF Q1 Q2 VSS to INT 100 kW xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 10 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 10. Write to Output port registers S 0 1 0 0 A2 A1 A0 0 A START condition R/W acknowledge from slave 002aac220 A SCL SDA A write to port data out from port 0 P tv(Q) 1 2 3 4 5 6 7 8 9 command byte data to port 0 DATA 0 slave address 0 0 0 0 0 0 1 0 STOP condition 0.7 0.0 acknowledge from slave acknowledge from slave data to port 1 1.7 DATA 1 1.0 A data out from port 1 tv(Q) DATA VALID Fig 11. Write to Configuration registers S 0 1 0 0 A2 A1 A0 0 A START condition R/W acknowledge from slave 002aac221 A SCL SDA A P 1 2 3 4 5 6 7 8 9 command byte data to register DATA 0 slave address 0 0 0 0 0 1 1 0 STOP condition MSB LSB acknowledge from slave acknowledge from slave data to register DATA 1 MSB LSB A PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 11 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.5.2 Reading the port registers In order to read data from the PCA9555, the bus master must first send the PCA9555 address with the least significant bit set to a logic 0 (see Figure 8 “PCA9555 device address”). The command byte is sent after the address and determines which register will be accessed. After a restart, the device address is sent again, but this time the least significant bit is set to a logic 1. Data from the register defined by the command byte will then be sent by the PCA9555 (see Figure 12, Figure 13 and Figure 14). Data is clocked into the register on the falling edge of the acknowledge clock pulse. After the first byte is read, additional bytes may be read but the data will now reflect the information in the other register in the pair. For example, if you read Input Port 1, then the next byte read would be Input Port 0. There is no limitation on the number of data bytes received in one read transmission but the final byte received, the bus master must not acknowledge the data. Remark: Transfer can be stopped at any time by a STOP condition. Fig 12. Read from register S A START condition R/W acknowledge from slave 002aac222 A acknowledge from slave SDA A P acknowledge from master DATA (first byte) slave address STOP condition S (repeated) START condition (cont.) (cont.) 0 1 0 0 A2 A1 A0 1 A R/W acknowledge from slave slave address at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter NA no acknowledge from master 0 1 0 0 A2 A1 A0 0 COMMAND BYTE data from lower or upper byte of register MSB LSB DATA (last byte) data from upper or lower byte of register MSB LSB xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 12 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read Input Port register). Fig 13. Read Input port register, scenario 1 S 0 1 0 0 A2 A1 A0 1 A START condition R/W acknowledge from slave 002aac223 A SCL SDA A read from port 0 P 1 2 3 4 5 6 7 8 9 slave address I0.x STOP condition acknowledge from master I1.x acknowledge from master A I0.x acknowledge from master 1 I1.x non acknowledge from master data into port 0 read from port 1 data into port 1 INT 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 tv(INT_N) trst(INT_N) xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 13 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read Input Port register). Fig 14. Read Input port register, scenario 2 S 0 1 0 0 A2 A1 A0 1 A START condition R/W acknowledge from slave 002aac224 A SCL SDA A read from port 0 P 1 2 3 4 5 6 7 8 9 slave address I0.x STOP condition acknowledge from master I1.x acknowledge from master A I0.x acknowledge from master 1 I1.x non acknowledge from master data into port 0 read from port 1 data into port 1 INT tv(INT_N) trst(INT_N) DATA 00 DATA 10 DATA 03 DATA 12 DATA 00 DATA 01 th(D) th(D) DATA 02 tsu(D) DATA 03 tsu(D) DATA 10 DATA 11 DATA 12 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 14 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.5.3 Interrupt output The open-drain interrupt output is activated when one of the port pins changes state and the pin is configured as an input. The interrupt is deactivated when the input returns to its previous state or the Input Port register is read (see Figure 13). A pin configured as an output cannot cause an interrupt. Since each 8-bit port is read independently, the interrupt caused by Port 0 will not be cleared by a read of Port 1 or the other way around. Remark: Changing an I/O from an output to an input may cause a false interrupt to occur if the state of the pin does not match the contents of the Input Port register. 7. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 15). 7.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 16). Fig 15. Bit transfer mba607 data line stable; data valid change of data allowed SDA SCL Fig 16. Definition of START and STOP conditions mba608 SDA SCL P STOP condition S START condition PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 15 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 7.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 17). 7.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold time must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Fig 17. System configuration 002aaa966 MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER SDA SCL I2C-BUS MULTIPLEXER SLAVE Fig 18. Acknowledgement on the I2C-bus 002aaa987 S START condition 1 2 8 9 clock pulse for acknowledgement not acknowledge acknowledge data output by transmitter data output by receiver SCL from master PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 16 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 8. Application design-in information Device address configured as 0100 000xb for this example. IO0_0, IO0_2, IO0_3 configured as outputs. IO0_1, IO0_4, IO0_5 configured as inputs. IO0_6, IO0_7, and IO1_0 to IO1_7 configured as inputs. Fig 19. Typical application PCA9555 IO0_0 IO0_1 SCL SDA VDD (5 V) MASTER CONTROLLER SCL SDA INT IO0_2 VDD A2 A1 A0 VDD GND INT 10 kW SUB-SYSTEM 1 (e.g., temp sensor) IO0_3 INT SUB-SYSTEM 2 (e.g., counter) RESET controlled switch (e.g., CBT device) VDD A B ENABLE SUB-SYSTEM 3 (e.g., alarm system) ALARM IO0_4 IO0_5 IO0_6 10 DIGIT NUMERIC KEYPAD VSS 002aac704 10 kW 10 kW 2 kW IO0_7 IO1_0 IO1_1 IO1_2 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 17 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 9. Limiting values Table 13. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage -0.5 +6.0 V VI/O voltage on an input/output pin VSS - 0.5 6 V IO output current on an I/O pin - ±50 mA II input current - ±20 mA IDD supply current - 160 mA ISS ground supply current - 200 mA Ptot total power dissipation - 200 mW Tstg storage temperature -65 +150 °C Tamb ambient temperature operating -40 +85 °C PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 18 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 10. Static characteristics [1] VDD must be lowered to 0.2 V for at least 5 ms in order to reset part. Table 14. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = -40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDD supply voltage 2.3 - 5.5 V IDD supply current Operating mode; VDD = 5.5 V; no load; fSCL = 100 kHz - 135 200 mA Istb standby current Standby mode; VDD = 5.5 V; no load; VI = VSS; fSCL = 0 kHz; I/O = inputs - 1.1 1.5 mA Standby mode; VDD = 5.5 V; no load; VI = VDD; fSCL = 0 kHz; I/O = inputs - 0.25 1 mA VPOR power-on reset voltage[1] no load; VI = VDD or VSS - 1.5 1.65 V Input SCL; input/output SDA VIL LOW-level input voltage -0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.4 V 3 - - mA IL leakage current VI = VDD = VSS -1 - +1 mA Ci input capacitance VI = VSS - 6 10 pF I/Os VIL LOW-level input voltage -0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VDD = 2.3 V to 5.5 V; VOL = 0.5 V [2] 8 (8 to 20) - mA VDD = 2.3 V to 5.5 V; VOL = 0.7 V [2] 10 (10 to 24) - mA VOH HIGH-level output voltage IOH = -8 mA; VDD = 2.3 V [3] 1.8 - - V IOH = -10 mA; VDD = 2.3 V [3] 1.7 - - V IOH = -8 mA; VDD = 3.0 V [3] 2.6 - - V IOH = -10 mA; VDD = 3.0 V [3] 2.5 - - V IOH = -8 mA; VDD = 4.75 V [3] 4.1 - - V IOH = -10 mA; VDD = 4.75 V [3] 4.0 - - V ILIH HIGH-level input leakage current VDD = 5.5 V; VI = VDD - - 1 mA ILIL LOW-level input leakage current VDD = 5.5 V; VI = VSS - - -100 mA Ci input capacitance - 3.7 5 pF Co output capacitance - 3.7 5 pF Interrupt INT IOL LOW-level output current VOL = 0.4 V 3 - - mA Select inputs A0, A1, A2 VIL LOW-level input voltage -0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V ILI input leakage current -1 - +1 mA PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 19 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt [2] Each I/O must be externally limited to a maximum of 25 mA and each octal (IO0_0 to IO0_7 and IO1_0 to IO1_7) must be limited to a maximum current of 100 mA for a device total of 200 mA. [3] The total current sourced by all I/Os must be limited to 160 mA. (1) IOH = -8 mA (2) IOH = -10 mA (1) IOH = -8 mA (2) IOH = -10 mA Fig 20. VOH maximum Fig 21. VOH minimum VDD = 5.5 V; VI/O = 5.5 V; A2, A1, A0 set to logic 0. (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 22. IDD versus number of I/Os held LOW 2.0 5.0 4.0 3.0 6.0 VOH (V) VDD (V) 2.7 3.6 5.5 002aac706 (1) (2) 2.5 3.5 4.5 VOH (V) 1.5 VDD (V) 2.3 3.0 4.75 002aac707 (1) (2) 0 1.2 0.8 0.4 1.6 IDD (mA) number of I/Os 002aac705 all 1s one 0 three 0s all 0s (1) (2) (3) PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 20 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 11. Dynamic characteristics [1] tVD;ACK = time for acknowledgement signal from SCL LOW to SDA (out) LOW. [2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. [3] Cb = total capacitance of one bus line in pF. Table 15. Dynamic characteristics Symbol Parameter Conditions Standard-mode I2C-bus Fast-mode I2C-bus Unit Min Max Min Max fSCL SCL clock frequency 0 100 0 400 kHz tBUF bus free time between a STOP and START condition 4.7 - 1.3 - ms tHD;STA hold time (repeated) START condition 4.0 - 0.6 - ms tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - ms tSU;STO set-up time for STOP condition 4.0 - 0.6 - ms tVD;ACK data valid acknowledge time [1] 0.3 3.45 0.1 0.9 ms tHD;DAT data hold time 0 - 0 - ns tVD;DAT data valid time [2] 300 - 50 - ns tSU;DAT data set-up time 250 - 100 - ns tLOW LOW period of the SCL clock 4.7 - 1.3 - ms tHIGH HIGH period of the SCL clock 4.0 - 0.6 - ms tf fall time of both SDA and SCL signals - 300 20 + 0.1Cb [3] 300 ns tr rise time of both SDA and SCL signals - 1000 20 + 0.1Cb [3] 300 ns tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 ns Port timing tv(Q) data output valid time - 200 - 200 ns tsu(D) data input set-up time 150 - 150 - ns th(D) data input hold time 1 - 1 - ms Interrupt timing tv(INT_N) valid time on pin INT - 4 - 4 ms trst(INT_N) reset time on pin INT - 4 - 4 ms PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 21 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 12. Test information Fig 23. Definition of timing on the I2C-bus tBUF tSP tHD;STA P S P tLOW tr tHD;DAT tf tHIGH tSU;DAT tSU;STA Sr tHD;STA tSU;STO SDA SCL 002aaa986 RL = load resistor. CL = load capacitance includes jig and probe capacitance. RT = termination resistance should be equal to the output impedance of Zo of the pulse generators. Fig 24. Test circuitry for switching times Fig 25. Load circuit PULSE GENERATOR VO CL 50 pF RL 500 W 002aab284 RT VI VDD DUT VDD open GND CL 50 pF 002aac226 RL 500 W from output under test 2VDD open GND RL S1 500 W PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 22 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 13. Package outline Fig 26. Package outline SOT101-1 (DIP24) UNIT A max. 1 2 b1 c D E e MH L OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT101-1 99-12-27 03-02-13 A min. A max. b e1 ME w 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 3.9 3.4 2.54 15.24 0.25 15.80 15.24 17.15 15.90 5.1 0.51 4 2.2 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.15 0.13 0.1 0.6 0.01 0.62 0.60 0.68 0.63 0.2 0.02 0.16 0.087 051G02 MO-015 SC-509-24 MH c (e 1 ) ME A L seating plane A1 w M b1 e D A2 Z 24 1 13 12 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Z max. (1) (1) (1) DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 23 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 27. Package outline SOT137-1 (SO24) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT137-1 X 12 24 w M q A A1 A2 bp D HE Lp Q detail X E Z c L v M A 13 (A 3 ) A y 0.25 075E05 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 e 1 0 5 10 mm scale SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 99-12-27 03-02-19 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 24 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 28. Package outline SOT340-1 (SSOP24) UNIT A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 0.8 0.4 8 0 o 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 SOT340-1 MO-150 99-12-27 03-02-19 X w M q A A1 A2 bp D HE Lp Q detail X E Z e c L v M A (A 3 ) A 1 12 24 13 0.25 y pin 1 index 0 2.5 5 mm scale SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 A max. 2 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 25 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 29. Package outline SOT355-1 (TSSOP24) UNIT A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT355-1 MO-153 99-12-27 03-02-19 0.25 0.5 0.2 w M bp Z e 1 12 24 13 pin 1 index q A A1 A2 Lp Q detail X L (A 3 ) HE E c v M A X D A y 0 2.5 5 mm scale TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 A max. 1.1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 26 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 30. Package outline SOT616-1 (HVQFN24) 1 0.2 0.5 UNIT A1 b Eh e y OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 4.1 3.9 Dh 2.25 1.95 y1 4.1 3.9 2.25 1.95 e1 2.5 e2 2.5 0.30 0.18 c 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT616-1 - - - MO-220 - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT616-1 HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm A(1) max. A A1 c detail X y1 C y e L Eh Dh e e1 b 7 12 24 19 18 13 6 1 X D E C B A e2 01-08-08 02-10-22 terminal 1 index area terminal 1 index area C A C v M B w M 1/2 e 1/2 e E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 27 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 31. Package outline SOT994-1 (HWQFN24) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT994-1 - - - MO-220 - - - SOT994-1 07-02-07 07-03-03 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. UNIT A(1) max mm 0.8 0.05 0.00 0.30 0.18 4.1 3.9 2.25 1.95 4.1 3.9 2.25 1.95 2.5 2.5 0.1 A1 DIMENSIONS (mm are the original dimensions) HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm 0 2.5 5 mm scale b c 0.2 D(1) Dh E(1) Eh e 0.5 e1 e2 L 0.5 0.3 v w 0.05 y 0.05 y1 0.1 B A terminal 1 index area E D detail X A A1 c b e2 e1 e e 1/2 e 1/2 e Æ v M C A B Æ w M C terminal 1 index area 6 13 7 12 18 24 19 1 L Eh Dh C y1 C y X PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 28 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 14. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 29 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 32) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 16 and 17 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 32. Table 16. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ³ 350 < 2.5 235 220 ³ 2.5 220 220 Table 17. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 30 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages This text gives a very brief insight into wave, dip and manual soldering. Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 16.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds. MSL: Moisture Sensitivity Level Fig 32. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 31 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 16.4 Package related soldering information [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. 17. Abbreviations Table 18. Suitability of through-hole mount IC packages for dipping and wave soldering Package Soldering method Dipping Wave CPGA, HCPGA - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] - not suitable Table 19. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor GPIO General Purpose Input/Output I2C-bus Inter-Integrated Circuit bus SMBus System Management Bus I/O Input/Output ACPI Advanced Configuration and Power Interface LED Light Emitting Diode ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model CDM Charged Device Model PCB Printed-Circuit Board FET Field-Effect Transistor MSB Most Significant Bit LSB Least Significant Bit PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 32 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 18. Revision history Table 20. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9555_8 20091022 Product data sheet - PCA9555_7 Modifications: • Table 2 “Ordering options”, Topside mark for TSSOP24 package, PCA9555PW, is changed from “PCA9555PW” to “PCA9555” • Figure 13 “Read Input port register, scenario 1” modified • Figure 14 “Read Input port register, scenario 2” modified • Table 14 “Static characteristics”, Table note [1] modified (added phrase “for at least 5 ms”) • updated soldering information PCA9555_7 20070605 Product data sheet - PCA9555_6 PCA9555_6 20060825 Product data sheet - PCA9555_5 PCA9555_5 (9397 750 14125) 20040930 Product data sheet - PCA9555_4 PCA9555_4 (9397 750 13271) 20040727 Product data sheet - PCA9555_3 PCA9555_3 (9397 750 10164) 20020726 Product data 853-2252 28672 of 2002 July 26 PCA9555_2 PCA9555_2 (9397 750 09818) 20020513 Product data - PCA9555_1 PCA9555_1 (9397 750 08343) 20010507 Product data - - PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 33 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 19. Legal information 19.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 19.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 October 2009 Document identifier: PCA9555_8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 6 6.1 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2.1 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2.2 Registers 0 and 1: Input port registers . . . . . . . 7 6.2.3 Registers 2 and 3: Output port registers. . . . . . 7 6.2.4 Registers 4 and 5: Polarity Inversion registers . 7 6.2.5 Registers 6 and 7: Configuration registers . . . . 8 6.3 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.4 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.5 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9 6.5.1 Writing to the port registers . . . . . . . . . . . . . . . 9 6.5.2 Reading the port registers . . . . . . . . . . . . . . . 11 6.5.3 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 14 7 Characteristics of the I2C-bus. . . . . . . . . . . . . 14 7.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.1.1 START and STOP conditions . . . . . . . . . . . . . 14 7.2 System configuration . . . . . . . . . . . . . . . . . . . 15 7.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 15 8 Application design-in information . . . . . . . . . 16 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 18 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 20 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 21 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22 14 Handling information. . . . . . . . . . . . . . . . . . . . 28 15 Soldering of SMD packages . . . . . . . . . . . . . . 28 15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 28 15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 28 15.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 28 15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 29 16 Soldering of through-hole mount packages . 30 16.1 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 16.2 Soldering by dipping or by solder wave . . . . . 30 16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 30 16.4 Package related soldering information . . . . . . 31 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 31 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . 32 19 Legal information . . . . . . . . . . . . . . . . . . . . . . 33 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33 19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 33 19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 33 20 Contact information . . . . . . . . . . . . . . . . . . . . 33 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Features • High Performance, Low Power Atmel® AVR® 8-Bit Microcontroller • Advanced RISC Architecture – 130 Powerful Instructions – Most Single Clock Cycle Execution – 32 × 8 General Purpose Working Registers – Fully Static Operation – Up to 16 MIPS Throughput at 16 MHz – On-Chip 2-cycle Multiplier • High Endurance Non-volatile Memory segments – 16 Kbytes of In-System Self-programmable Flash program memory – 512 Bytes EEPROM – 1 Kbytes Internal SRAM – Write/Erase cycles: 10,000 Flash/100,000 EEPROM – Data retention: 20 years at 85°C/100 years at 25°C(1) – Optional Boot Code Section with Independent Lock Bits In-System Programming by On-chip Boot Program True Read-While-Write Operation – Programming Lock for Software Security • JTAG (IEEE std. 1149.1 compliant) Interface – Boundary-scan Capabilities According to the JTAG Standard – Extensive On-chip Debug Support – Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface • Peripheral Features – 4 × 25 Segment LCD Driver – Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode – One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode – Real Time Counter with Separate Oscillator – Four PWM Channels – 8-channel, 10-bit ADC – Programmable Serial USART – Master/Slave SPI Serial Interface – Universal Serial Interface with Start Condition Detector – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator – Interrupt and Wake-up on Pin Change • Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal Calibrated Oscillator – External and Internal Interrupt Sources – Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby • I/O and Packages – 54 Programmable I/O Lines – 64-lead TQFP, 64-pad QFN/MLF and 64-pad DRQFN • Speed Grade: – ATmega169PV: 0 - 4 MHz @ 1.8V - 5.5V, 0 - 8 MHz @ 2.7V - 5.5V – ATmega169P: 0 - 8 MHz @ 2.7V - 5.5V, 0 - 16 MHz @ 4.5V - 5.5V • Temperature range: – -40°C to 85°C Industrial • Ultra-Low Power Consumption – Active Mode: 1 MHz, 1.8V: 330 μA 32 kHz, 1.8V: 10 μA (including Oscillator) 32 kHz, 1.8V: 25 μA (including Oscillator and LCD) – Power-down Mode: 0.1 μA at 1.8V – Power-save Mode: 0.6 μA at 1.8V (Including 32 kHz RTC) 8-bit Microcontroller with 16K Bytes In-System Programmable Flash ATmega169P ATmega169PV Preliminary Summary Rev. 8018PS–AVR–08/10 2 8018PS–AVR–08/10 ATmega169P 1. Pin Configurations 1.1 Pinout - TQFP/QFN/MLF Figure 1-1. 64A (TQFP)and 64M1 (QFN/MLF) Pinout ATmega169P Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 64 63 62 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 17 61 60 18 59 20 58 19 21 57 22 56 23 55 24 54 25 53 26 52 27 51 29 28 50 32 49 31 30 PC0 (SEG12) VCC GND PF0 (ADC0) PF7 (ADC7/TDI) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) AREF GND AVCC (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 LCDCAP (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SS/PCINT8) PB0 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC2A/PCINT15) PB7 (T1/SEG24) PG3 (OC1B/PCINT14) PB6 (T0/SEG23) PG4 (OC1A/PCINT13) PB5 PC1 (SEG11) PG0 (SEG14) (SEG15) PD7 PC2 (SEG10) PC3 (SEG9) PC4 (SEG8) PC5 (SEG7) PC6 (SEG6) PC7 (SEG5) PA7 (SEG3) PG2 (SEG4) PA6 (SEG2) PA5 (SEG1) PA4 (SEG0) PA3 (COM3) PA0 (COM0) PA1 (COM1) PA2 (COM2) PG1 (SEG13) (SEG16) PD6 (SEG17) PD5 (SEG18) PD4 (SEG19) PD3 (SEG20) PD2 (INT0/SEG21) PD1 (ICP1/SEG22) PD0 (TOSC1) XTAL1 (TOSC2) XTAL2 RESET/PG5 GND VCC INDEX CORNER 3 8018PS–AVR–08/10 ATmega169P 1.2 Pinout - DRQFN Figure 1-2. 64MC (DRQFN) Pinout ATmega169P Top view Bottom view A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 A6 B6 A7 B7 A8 A9 B8 A10 B9 A11 B10 A12 B11 A13 B12 A14 B13 A15 B14 A16 B15 A17 A25 B22 A24 B21 A23 B20 A22 B19 A21 B18 A20 B17 A19 B16 A18 A34 B30 A33 B29 A32 B28 A31 B27 A30 B26 A29 B25 A28 B24 A27 B23 A26 A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 A6 B6 A7 B7 A8 A25 B22 A24 B21 A23 B20 A22 B19 A21 B18 A20 B17 A19 B16 A18 A17 B15 A16 B14 A15 B13 A14 B12 A13 B11 A12 B10 A11 B9 A10 B8 A9 A26 B23 A27 B24 A28 B25 A29 B26 A30 B27 A31 B28 A32 B29 A33 B30 A34 Table 1-1. DRQFN-64 Pinout ATmega169P. A1 PE0 A9 PB7 A18 PG1 (SEG13) A26 PA2 (COM2) B1 VLCDCAP B8 PB6 B16 PG0 (SEG14) B23 PA3 (COM3) A2 PE1 A10 PG3 A19 PC0 (SEG12) A27 PA1 (COM1) B2 PE2 B9 PG4 B17 PC1 (SEG11) B24 PA0 (COM0) A3 PE3 A11 RESET A20 PC2 (SEG10) A28 VCC B3 PE4 B10 VCC B18 PC3 (SEG9) B25 GND A4 PE5 A12 GND A21 PC4 (SEG8) A29 PF7 B4 PE6 B11 XTAL2 (TOSC2) B19 PC5 (SEG7) B26 PF6 A5 PE7 A13 XTAL1 (TOSC1) A22 PC6 (SEG6) A30 PF5 B5 PB0 B12 PD0 (SEG22) B20 PC7 (SEG5) B27 PF4 A6 PB1 A14 PD1 (SEG21) A23 PG2 (SEG4) A31 PF3 B6 PB2 B13 PD2 (SEG20) B21 PA7 (SEG3) B28 PF2 A7 PB3 A15 PD3 (SEG19) A24 PA6 (SEG2) A32 PF1 B7 PB5 B14 PD4 (SEG18) B22 PA4 (SEG0) B29 PF0 A8 PB4 A16 PD5 (SEG17) A25 PA5 (SEG1) A33 AREF B15 PD7 (SEG15) B30 AVCC A17 PD6 (SEG16) A34 GND 4 8018PS–AVR–08/10 ATmega169P 2. Overview The ATmega169P is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega169P achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram PROGRAM COUNTER INTERNAL OSCILLATOR WATCHDOG TIMER STACK POINTER PROGRAM FLASH MCU CONTROL REGISTER SRAM GENERAL PURPOSE REGISTERS INSTRUCTION REGISTER TIMER/ COUNTERS INSTRUCTION DECODER DATA DIR. REG. PORTB DATA DIR. REG. PORTE DATA DIR. REG. PORTA DATA DIR. REG. PORTD DATA REGISTER PORTB DATA REGISTER PORTE DATA REGISTER PORTA DATA REGISTER PORTD TIMING AND CONTROL OSCILLATOR INTERRUPT UNIT EEPROM USART SPI STATUS REGISTER Z Y X ALU PORTE DRIVERS PORTB DRIVERS PORTF DRIVERS PORTA DRIVERS PORTD DRIVERS PORTC DRIVERS PE0 - PE7 PB0 - PB7 PF0 - PF7 PA0 - PA7 VCC GND AREF XTAL1 XTAL2 CONTROL LINES + - ANALOG COMPARATOR PC0 - PC7 8-BIT DATA BUS RESET AVCC CALIB. OSC DATA DIR. REG. PORTC DATA REGISTER PORTC ON-CHIP DEBUG JTAG TAP PROGRAMMING LOGIC BOUNDARYSCAN DATA DIR. REG. PORTF DATA REGISTER PORTF ADC PD0 - PD7 DATA DIR. REG. PORTG DATA REG. PORTG PORTG DRIVERS PG0 - PG4 UNIVERSAL SERIAL INTERFACE AVR CPU LCD CONTROLLER/ DRIVER 5 8018PS–AVR–08/10 ATmega169P The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATmega169P provides the following features: 16 Kbytes of In-System Programmable Flash with Read-While-Write capabilities, 512 bytes EEPROM, 1 Kbyte SRAM, 53 general purpose I/O lines, 32 general purpose working registers, a JTAG interface for Boundary-scan, On-chip Debugging support and programming, a complete On-chip LCD controller with internal step-up voltage, three flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, Universal Serial Interface with Start Condition Detector, an 8- channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, an SPI serial port, and five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or hardware reset. In Power-save mode, the asynchronous timer and the LCD controller continues to run, allowing the user to maintain a timer base and operate the LCD display while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except asynchronous timer, LCD controller and ADC, to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low-power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI serial interface, by a conventional non-volatile memory programmer, or by an On-chip Boot program running on the AVR core. The Boot program can use any interface to download the application program in the Application Flash memory. Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega169P is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The ATmega169P AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators, and Evaluation kits. 6 8018PS–AVR–08/10 ATmega169P 2.2 Pin Descriptions 2.2.1 VCC Digital supply voltage. 2.2.2 GND Ground. 2.2.3 Port A (PA7:PA0) Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port A” on page 73. 2.2.4 Port B (PB7:PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B has better driving capabilities than the other ports. Port B also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port B” on page 74. 2.2.5 Port C (PC7:PC0) Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port C also serves the functions of special features of the ATmega169P as listed on ”Alternate Functions of Port C” on page 77. 2.2.6 Port D (PD7:PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port D” on page 79. 7 8018PS–AVR–08/10 ATmega169P 2.2.7 Port E (PE7:PE0) Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port E output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up resistors are activated. The Port E pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port E also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port E” on page 81. 2.2.8 Port F (PF7:PF0) Port F serves as the analog inputs to the A/D Converter. Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins can provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port F pins that are externally pulled low will source current if the pull-up resistors are activated. The Port F pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will be activated even if a reset occurs. Port F also serves the functions of the JTAG interface, see ”Alternate Functions of Port F” on page 83. 2.2.9 Port G (PG5:PG0) Port G is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port G output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port G pins that are externally pulled low will source current if the pull-up resistors are activated. The Port G pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port G also serves the functions of various special features of the ATmega169P as listed on page 85. 2.2.10 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in Table 28-4 on page 333. Shorter pulses are not guaranteed to generate a reset. 2.2.11 XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit. 2.2.12 XTAL2 Output from the inverting Oscillator amplifier. 2.2.13 AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. 8 8018PS–AVR–08/10 ATmega169P 2.2.14 AREF This is the analog reference pin for the A/D Converter. 2.2.15 LCDCAP An external capacitor (typical > 470 nF) must be connected to the LCDCAP pin as shown in Figure 23-2 on page 236. This capacitor acts as a reservoir for LCD power (VLCD). A large capacitance reduces ripple on VLCD but increases the time until VLCD reaches its target value. 9 8018PS–AVR–08/10 ATmega169P 3. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. Note: 1. 4. Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 10 8018PS–AVR–08/10 ATmega169P 5. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page (0xFF) Reserved – – – – – – – – (0xFE) LCDDR18 – – – – – – – SEG324 250 (0xFD) LCDDR17 SEG323 SEG322 SEG321 SEG320 SEG319 SEG318 SEG317 SEG316 250 (0xFC) LCDDR16 SEG315 SEG314 SEG313 SEG312 SEG311 SEG310 SEG309 SEG308 250 (0xFB) LCDDR15 SEG307 SEG306 SEG305 SEG304 SEG303 SEG302 SEG301 SEG300 250 (0xFA) Reserved – – – – – – – – (0xF9) LCDDR13 – – – – – – – SEG224 250 (0xF8) LCDDR12 SEG223 SEG222 SEG221 SEG220 SEG219 SEG218 SEG217 SEG216 250 (0xF7) LCDDR11 SEG215 SEG214 SEG213 SEG212 SEG211 SEG210 SEG209 SEG208 250 (0xF6) LCDDR10 SEG207 SEG206 SEG205 SEG204 SEG203 SEG202 SEG201 SEG200 250 (0xF5) Reserved – – – – – – – – (0xF4) LCDDR8 – – – – – – – SEG124 250 (0xF3) LCDDR7 SEG123 SEG122 SEG121 SEG120 SEG119 SEG118 SEG117 SEG116 250 (0xF2) LCDDR6 SEG115 SEG114 SEG113 SEG112 SEG111 SEG110 SEG109 SEG108 250 (0xF1) LCDDR5 SEG107 SEG106 SEG105 SEG104 SEG103 SEG102 SEG101 SEG100 250 (0xF0) Reserved – – – – – – – – (0xEF) LCDDR3 – – – – – – – SEG024 250 (0xEE) LCDDR2 SEG023 SEG022 SEG021 SEG020 SEG019 SEG018 SEG017 SEG016 250 (0xED) LCDDR1 SEG015 SEG014 SEG013 SEG012 SEG011 SEG010 SEG09 SEG008 250 (0xEC) LCDDR0 SEG007 SEG006 SEG005 SEG004 SEG003 SEG002 SEG001 SEG000 250 (0xEB) Reserved – – – – – – – – (0xEA) Reserved – – – – – – – – (0xE9) Reserved – – – – – – – – (0xE8) Reserved – – – – – – – – (0xE7) LCDCCR LCDDC2 LCDDC1 LCDDC0 LCDMDT LCDCC3 LCDCC2 LCDCC1 LCDCC0 249 (0xE6) LCDFRR – LCDPS2 LCDPS1 LCDPS0 – LCDCD2 LCDCD1 LCDCD0 247 (0xE5) LCDCRB LCDCS LCD2B LCDMUX1 LCDMUX0 – LCDPM2 LCDPM1 LCDPM0 246 (0xE4) LCDCRA LCDEN LCDAB – LCDIF LCDIE LCDBD LCDCCD LCDBL 245 (0xE3) Reserved – – – – – – – – (0xE2) Reserved – – – – – – – – (0xE1) Reserved – – – – – – – – (0xE0) Reserved – – – – – – – – (0xDF) Reserved – – – – – – – – (0xDE) Reserved – – – – – – – – (0xDD) Reserved – – – – – – – – (0xDC) Reserved – – – – – – – – (0xDB) Reserved – – – – – – – – (0xDA) Reserved – – – – – – – – (0xD9) Reserved – – – – – – – – (0xD8) Reserved – – – – – – – – (0xD7) Reserved – – – – – – – – (0xD6) Reserved – – – – – – – – (0xD5) Reserved – – – – – – – – (0xD4) Reserved – – – – – – – – (0xD3) Reserved – – – – – – – – (0xD2) Reserved – – – – – – – – (0xD1) Reserved – – – – – – – – (0xD0) Reserved – – – – – – – – (0xCF) Reserved – – – – – – – – (0xCE) Reserved – – – – – – – – (0xCD) Reserved – – – – – – – – (0xCC) Reserved – – – – – – – – (0xCB) Reserved – – – – – – – – (0xCA) Reserved – – – – – – – – (0xC9) Reserved – – – – – – – – (0xC8) Reserved – – – – – – – – (0xC7) Reserved – – – – – – – – (0xC6) UDR0 USART0 I/O Data Register 190 (0xC5) UBRRH0 USART0 Baud Rate Register High 194 (0xC4) UBRRL0 USART0 Baud Rate Register Low 194 (0xC3) Reserved – – – – – – – – (0xC2) UCSR0C – UMSEL0 UPM01 UPM00 USBS0 UCSZ01 UCSZ00 UCPOL0 190 (0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 190 (0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 190 11 8018PS–AVR–08/10 ATmega169P (0xBF) Reserved – – – – – – – – (0xBE) Reserved – – – – – – – – (0xBD) Reserved – – – – – – – – (0xBC) Reserved – – – – – – – – (0xBB) Reserved – – – – – – – – (0xBA) USIDR USI Data Register 207 (0xB9) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 207 (0xB8) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 208 (0xB7) Reserved – – – – – – – (0xB6) ASSR – – – EXCLK AS2 TCN2UB OCR2UB TCR2UB 156 (0xB5) Reserved – – – – – – – – (0xB4) Reserved – – – – – – – – (0xB3) OCR2A Timer/Counter2 Output Compare Register A 155 (0xB2) TCNT2 Timer/Counter2 (8-bit) 155 (0xB1) Reserved – – – – – – – – (0xB0) TCCR2A FOC2A WGM20 COM2A1 COM2A0 WGM21 CS22 CS21 CS20 153 (0xAF) Reserved – – – – – – – – (0xAE) Reserved – – – – – – – – (0xAD) Reserved – – – – – – – – (0xAC) Reserved – – – – – – – – (0xAB) Reserved – – – – – – – – (0xAA) Reserved – – – – – – – – (0xA9) Reserved – – – – – – – – (0xA8) Reserved – – – – – – – – (0xA7) Reserved – – – – – – – – (0xA6) Reserved – – – – – – – – (0xA5) Reserved – – – – – – – – (0xA4) Reserved – – – – – – – – (0xA3) Reserved – – – – – – – – (0xA2) Reserved – – – – – – – – (0xA1) Reserved – – – – – – – – (0xA0) Reserved – – – – – – – – (0x9F) Reserved – – – – – – – – (0x9E) Reserved – – – – – – – – (0x9D) Reserved – – – – – – – – (0x9C) Reserved – – – – – – – – (0x9B) Reserved – – – – – – – – (0x9A) Reserved – – – – – – – – (0x99) Reserved – – – – – – – – (0x98) Reserved – – – – – – – – (0x97) Reserved – – – – – – – – (0x96) Reserved – – – – – – – – (0x95) Reserved – – – – – – – – (0x94) Reserved – – – – – – – – (0x93) Reserved – – – – – – – – (0x92) Reserved – – – – – – – – (0x91) Reserved – – – – – – – – (0x90) Reserved – – – – – – – – (0x8F) Reserved – – – – – – – – (0x8E) Reserved – – – – – – – – (0x8D) Reserved – – – – – – – – (0x8C) Reserved – – – – – – – – (0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte 132 (0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte 132 (0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte 132 (0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte 132 (0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte 133 (0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte 133 (0x85) TCNT1H Timer/Counter1 - Counter Register High Byte 132 (0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte 132 (0x83) Reserved – – – – – – – – (0x82) TCCR1C FOC1A FOC1B – – – – – – 131 (0x81) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 130 (0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 128 (0x7F) DIDR1 – – – – – – AIN1D AIN0D 214 (0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D 232 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 12 8018PS–AVR–08/10 ATmega169P (0x7D) Reserved – – – – – – – – (0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 228 (0x7B) ADCSRB – ACME – – – ADTS2 ADTS1 ADTS0 213, 232 (0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 230 (0x79) ADCH ADC Data Register High byte 231 (0x78) ADCL ADC Data Register Low byte 231 (0x77) Reserved – – – – – – – – (0x76) Reserved – – – – – – – – (0x75) Reserved – – – – – – – – (0x74) Reserved – – – – – – – – (0x73) Reserved – – – – – – – – (0x72) Reserved – – – – – – – – (0x71) Reserved – – – – – – – – (0x70) TIMSK2 – – – – – – OCIE2A TOIE2 156 (0x6F) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 133 (0x6E) TIMSK0 – – – – – – OCIE0A TOIE0 104 (0x6D) Reserved – – – – – – – – (0x6C) PCMSK1 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 63 (0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 64 (0x6A) Reserved – – – – – – – – (0x69) EICRA – – – – – – ISC01 ISC00 62 (0x68) Reserved – – – – – – – – (0x67) Reserved – – – – – – – – (0x66) OSCCAL Oscillator Calibration Register 38 (0x65) Reserved – – – – – – – – (0x64) PRR – – – PRLCD PRTIM1 PRSPI PRUSART0 PRADC 45 (0x63) Reserved – – – – – – – – (0x62) Reserved – – – – – – – – (0x61) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 38 (0x60) WDTCR – – – WDCE WDE WDP2 WDP1 WDP0 54 0x3F (0x5F) SREG I T H S V N Z C 13 0x3E (0x5E) SPH – – – – – SP10 SP9 SP8 15 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 15 0x3C (0x5C) Reserved 0x3B (0x5B) Reserved 0x3A (0x5A) Reserved 0x39 (0x59) Reserved 0x38 (0x58) Reserved 0x37 (0x57) SPMCSR SPMIE RWWSB – RWWSRE BLBSET PGWRT PGERS SPMEN 293 0x36 (0x56) Reserved – – – – – – – – 0x35 (0x55) MCUCR JTD – – PUD – – IVSEL IVCE 60, 88, 278 0x34 (0x54) MCUSR – – – JTRF WDRF BORF EXTRF PORF 278 0x33 (0x53) SMCR – – – – SM2 SM1 SM0 SE 45 0x32 (0x52) Reserved – – – – – – – – 0x31 (0x51) OCDR IDRD/OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 257 0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 213 0x2F (0x4F) Reserved – – – – – – – – 0x2E (0x4E) SPDR SPI Data Register 167 0x2D (0x4D) SPSR SPIF WCOL – – – – – SPI2X 166 0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 165 0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 29 0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 29 0x29 (0x49) Reserved – – – – – – – – 0x28 (0x48) Reserved – – – – – – – – 0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A 104 0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) 104 0x25 (0x45) Reserved – – – – – – – – 0x24 (0x44) TCCR0A FOC0A WGM00 COM0A1 COM0A0 WGM01 CS02 CS01 CS00 102 0x23 (0x43) GTCCR TSM – – – – – PSR2 PSR10 137, 157 0x22 (0x42) EEARH – – – – – – – EEAR8 27 0x21 (0x41) EEARL EEPROM Address Register Low Byte 27 0x20 (0x40) EEDR EEPROM Data Register 27 0x1F (0x3F) EECR – – – – EERIE EEMWE EEWE EERE 27 0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 29 0x1D (0x3D) EIMSK PCIE1 PCIE0 – – – – – INT0 62 0x1C (0x3C) EIFR PCIF1 PCIF0 – – – – – INTF0 63 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 13 8018PS–AVR–08/10 ATmega169P Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 4. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. The ATmega169P is a complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from 0x60 - 0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. 0x1B (0x3B) Reserved – – – – – – – – 0x1A (0x3A) Reserved – – – – – – – – 0x19 (0x39) Reserved – – – – – – – – 0x18 (0x38) Reserved – – – – – – – – 0x17 (0x37) TIFR2 – – – – – – OCF2A TOV2 156 0x16 (0x36) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 134 0x15 (0x35) TIFR0 – – – – – – OCF0A TOV0 105 0x14 (0x34) PORTG – – PORTG5 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 90 0x13 (0x33) DDRG – – DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 90 0x12 (0x32) PING – – PING5 PING4 PING3 PING2 PING1 PING0 90 0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 90 0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 90 0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 90 0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 89 0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 89 0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 90 0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 89 0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 89 0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 89 0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 89 0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 89 0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 89 0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 88 0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 88 0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 88 0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 88 0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 88 0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 88 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 14 8018PS–AVR–08/10 ATmega169P 6. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z,C 2 MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z,C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z,C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z,C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2 BRANCH INSTRUCTIONS RJMP k Relative Jump PC ← PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC ← Z None 2 JMP k Direct Jump PC ← k None 3 RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ← Z None 3 CALL k Direct Subroutine Call PC ← k None 4 RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 15 8018PS–AVR–08/10 ATmega169P BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C 1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N 1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z 1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I 1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S 1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Twos Complement Overflow. V ← 1 V 1 CLV Clear Twos Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T 1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H 1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd ← Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 LPM Load Program Memory R0 ← (Z) None 3 LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 SPM Store Program Memory (Z) ← R1:R0 None - IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 Mnemonics Operands Description Operation Flags #Clocks 16 8018PS–AVR–08/10 ATmega169P PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 BREAK Break For On-chip Debug Only None N/A Mnemonics Operands Description Operation Flags #Clocks 17 8018PS–AVR–08/10 ATmega169P 7. Ordering Information Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 331 and Figure 28-2 on page 332. Speed (MHz)(3) Power Supply Ordering Code Package(1)(2) Operation Range 8 1.8V - 5.5V ATmega169PV-8AU ATmega169PV-8MU ATmega169PV-8MCH 64A 64M1 64MC Industrial (-40°C to 85°C) 16 2.7V - 5.5V ATmega169P-16AU ATmega169P-16MU ATmega169P-16MCH 64A 64M1 64MC Industrial (-40°C to 85°C) Package Type 64A 64-Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 × 9 × 1.0 mm body, lead pitch 0.50 mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 64MC 64-lead (2-row Staggered), 7 × 7 × 1.0 mm body, 4.0 × 4.0 mm Exposed Pad, Quad Flat No-Lead Package (QFN) 18 8018PS–AVR–08/10 ATmega169P 8. Packaging Information 8.1 64A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 64A B 10/5/2001 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP 19 8018PS–AVR–08/10 ATmega169P 8.2 64M1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, 64M1 G 5/25/06 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 – 0.02 0.05 b 0.18 0.25 0.30 D D2 5.20 5.40 5.60 8.90 9.00 9.10 E 8.9 0 9.00 9.10 E2 5.20 5.40 5.60 e 0.50 BSC L 0.35 0.40 0.45 Note: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD. 2. Dimension and tolerance conform to ASMEY14.5M-1994. TOP VIEW SIDE VIEW BOTTOM VIEW D E Marked Pin# 1 ID SEATING PLANE A1 C A 0.08 C 1 2 3 K 1.25 1.40 1.55 E2 D2 b e Pin #1 Corner L Pin #1 Triangle Pin #1 Chamfer (C 0.30) Option A Option B Pin #1 Notch (0.20 R) Option C K K 5.40 mm Exposed Pad, Micro Lead Frame Package (MLF) 20 8018PS–AVR–08/10 ATmega169P 8.3 64MC TITLE GPC DRAWING NO. REV. Package Drawing Contact: packagedrawings@atmel.com ZXC 64MC A 64MC, 64QFN (2-Row Staggered), 7 x 7 x 1.00 mm Body, 4.0 x 4.0 mm Exposed Pad, Quad Flat No Lead Package 10/3/07 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 0.00 0.02 0.05 b 0.18 0.23 0.28 C 0.20 REF D 6.90 7.00 7.10 D2 3.95 4.00 4.05 E 6.90 7.00 7.10 E2 3.95 4.00 4.05 eT – 0.65 – eR – 0.65 – K 0.20 – – (REF) L 0.35 0.40 0.45 y 0.00 – 0.075 SIDE VIEW TOP VIEW BOTTOM VIEW Note: 1. The terminal #1 ID is a Laser-marked Feature. Pin 1 ID D E A1 A y C eT/2 R0.20 0.40 B1 A1 B30 A34 b A8 B7 eT D2 B16 A18 B22 A25 E2 K (0.1) REF B8 A9 (0.18) REF L B15 A17 L eR A26 B23 eT 21 8018PS–AVR–08/10 ATmega169P 9. Errata 9.1 ATmega169P Rev. G No known errata. 9.2 ATmega169P Rev. A to F Not sampled. 22 8018PS–AVR–08/10 ATmega169P 10. Datasheet Revision History Please note that the referring page numbers in this section are referring to this document. The referring revision in this section are referring to the document revision. 10.1 Rev. 8018P 08/10 10.2 Rev. 8018O 10/09 10.3 Rev. 8018N 08/09 10.4 Rev. 8018M 07/09 10.5 Rev. L 08/08 10.6 Rev. K 06/08 1. Status changed to active 2. EEPROM minimum wait delay, Table 27-15 on page 312, has been changed from 9.0 ms to 3.6 ms 3. Datasheet layout and technical terminology updated 1. Changed datasheet status to “Mature” 2. Added Capacitance for Low-frequency Crystal Oscillator, Table 8-5 on page 33. 1. Updated ”Ordering Information” on page 17, MCU replaced by MCH. 1. Updated the last page with new Atmel’s addresses. 1. Updated package information in ”Features” on page 1. 2. Added ”Pinout - DRQFN” on page 3: • The Staggered QFN is named Dual Row QFN (DRQFN). 1. Updated package information in ”Features” on page 1. 2. Removed “Disclaimer” from section ”Pin Configurations” on page 2 3. Added ”64MC (DRQFN) Pinout ATmega169P” on page 3 4. Added ”Data Retention” on page 9. 5. Updated ”Stack Pointer” on page 13. 6. Updated ”Low-frequency Crystal Oscillator” on page 34. 7. Updated ”USART Register Description” on page 194, register descriptions and tables. 8. Updated ”UCSRnB – USART Control and Status Register n B” on page 195. 9. Updated VIL2 in ”DC Characteristics” on page 329, by removing 0.2VCC from the table. 23 8018PS–AVR–08/10 ATmega169P 10.7 Rev. J 08/07 10.8 Rev. I 11/06 10.9 Rev. H 09/06 10.10 Rev. G 08/06 10.11 Rev. F 08/06 10.12 Rev. E 08/06 10. Replaced Figure 29-36 on page 357 by a correct one. 11. Updated ”Ordering Information” on page 17. 12. Added ”64MC” on page 20 package to ”Packaging Information” on page 18. 1. Updated ”Features” on page 1. 2. Added ”Minimizing Power Consumption” on page 237 in the LCD section. 3. Updated ”System and Reset Characteristics” on page 333. 1. Updated ”Low-frequency Crystal Oscillator” on page 34. 2. Updated Table 8-8 on page 35, Table 8-9 on page 35, Table 8-10 on page 35, Table 28-7 on page 336. 3. Updated note in Table 28-7 on page 336. 1. All characterization data moved to ”Electrical Characteristics” on page 329. 2. Updated ”Calibrated Internal RC Oscillator” on page 32. 3. Updated ”System Control and Reset” on page 47. 4. Added note to Table 27-16 on page 314. 5. Updated ”LCD Controller Characteristics” on page 337. 1. Updated ”LCD Controller Characteristics” on page 337. 1. Updated ”DC Characteristics” on page 329. 2. Updated Table 13-19 on page 84. 1. Updated ”Low-frequency Crystal Oscillator” on page 34. 2. Updated ”Device Identification Register” on page 260. 3. Updated ”Signature Bytes” on page 299. 4. Added Table 27-6 on page 299. 24 8018PS–AVR–08/10 ATmega169P 10.13 Rev. D 07/06 10.14 Rev. C 06/06 10.15 Rev. B 04/06 10.16 Rev. A 03/06 1. Updated ”Register Description for I/O-Ports” on page 88. 2. Updated ”Fast PWM Mode” on page 97. 3. Updated ”Fast PWM Mode” on page 120. 4. Updated Table 14-2 on page 102, Table 14-4 on page 103, Table 15-3 on page 129, Table 15-4 on page 130, Table 17-2 on page 153 and Table 17-4 on page 154. 5 Updated ”UCSRnC – USART Control and Status Register n C” on page 196. 6. Updated Features in ”USI – Universal Serial Interface” on page 199. 7. Added ”Clock speed considerations.” on page 206. 8. Updated Features in ”LCD Controller” on page 234. 9. Updated ”Register Summary” on page 10. 1. Updated typos. 2. Updated ”Calibrated Internal RC Oscillator” on page 32. 3. Updated ”OSCCAL – Oscillator Calibration Register” on page 38. 4. Added Table 28-2 on page 332. 1. Updated ”Calibrated Internal RC Oscillator” on page 32. 1. Initial revision. 8018PS–AVR–08/10 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-en- Yvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site www.atmel.com Technical Support avr@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Rev. 04 — 9 March 2011 Product data sheet LFPAK Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤175°C - - 30 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 1 - - 76 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 51 W Tj junction temperature -55 - 175 °C Static characteristics RDSon drain-source on-state resistance VGS = 10 V; ID = 15 A; Tj = 25 °C - 4.92 7 mΩ Dynamic characteristics QGD gate-drain charge VGS = 4.5 V; ID = 10 A; VDS = 12 V; see Figure 14; see Figure 15 - 2.9 - nC QG(tot) total gate charge - 10 - nC Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 65 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - - 21 mJ PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 2 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 2. Pinning information 3. Ordering information 4. Limiting values Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 S source SOT669 (LFPAK) 2 S source 3 S source 4 G gate mb D mounting base; connected to drain mb 1 2 3 4 S D G mbb076 Table 3. Ordering information Type number Package Name Description Version PSMN7R0-30YL LFPAK plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 30 V VDSM peak drain-source voltage tp ≤ 25 ns; f ≤ 500 kHz; EDS(AL) ≤ 90 nJ; pulsed - 35 V VDGR drain-gate voltage Tj ≥ 25 °C; Tj ≤ 175 °C; RGS = 20 kΩ - 30 V VGS gate-source voltage -20 20 V ID drain current VGS = 10 V; Tmb = 100 °C; see Figure 1 - 53 A VGS = 10 V; Tmb = 25 °C; see Figure 1 - 76 A IDM peak drain current pulsed; tp ≤ 10 μs; Tmb = 25 °C; see Figure 3 - 260 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 51 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Source-drain diode IS source current Tmb = 25 °C - 65 A ISM peak source current pulsed; tp ≤ 10 μs; Tmb = 25 °C - 260 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 65 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - 21 mJ PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 3 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 1. Continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage 003aac720 0 20 40 60 80 100 0 50 100 150 200 Tmb (°C) ID (A) Tmb (°C) 0 50 100 150 200 03aa16 40 80 120 Pder (%) 0 003aac732 10-1 1 10 102 103 10-1 1 10 102 VDS (V) ID (A) DC Limit RDSon = VDS / ID 100 ms 10 ms 1 ms 100 μs 10 μs PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 4 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - 1.4 2.45 K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration 003aac721 single shot 0.2 0.1 0.05 0.02 10-2 10-1 1 10 10-6 10-5 10-4 10-3 10-2 10-1 tp (s) 1 Zth(j-mb) (K/W) δ = 0.5 tp T P t tp T δ = PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 5 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 6. Characteristics Table 6. Characteristics Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Static characteristics V(BR)DSS drain-source breakdown voltage ID = 250 μA; VGS = 0 V; Tj=25°C 30 - - V ID = 250 μA; VGS = 0 V; Tj = -55 °C 27 - - V VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 11; see Figure 12 1.3 1.7 2.15 V ID = 1 mA; VDS = VGS; Tj = 150 °C; see Figure 12 0.65 - - V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 12 - - 2.45 V IDSS drain leakage current VDS = 30 V; VGS = 0 V; Tj=25°C - - 1 μA VDS = 30 V; VGS = 0 V; Tj = 150 °C - - 100 μA IGSS gate leakage current VGS = 16 V; VDS = 0 V; Tj = 25 °C - - 100 nA VGS = -16 V; VDS = 0 V; Tj = 25 °C - - 100 nA RDSon drain-source on-state resistance VGS = 4.5 V; ID = 15 A; Tj = 25 °C - 6.97 9.1 mΩ VGS = 10 V; ID = 15 A; Tj = 150 °C; see Figure 13 - - 12.2 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C - 4.92 7 mΩ RG gate resistance f = 1 MHz - 0.6 1.5 Ω Dynamic characteristics QG(tot) total gate charge ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14; see Figure 15 - 10 - nC ID = 0 A; VDS = 0 V; VGS = 10 V - 20 - nC ID = 10 A; VDS = 12 V; VGS = 10 V; see Figure 14; see Figure 15 - 22 - nC QGS gate-source charge ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14; see Figure 15 - 3.7 - nC QGS(th) pre-threshold gate-source charge - 2.1 - nC QGS(th-pl) post-threshold gate-source charge - 1.6 - nC QGD gate-drain charge - 2.9 - nC VGS(pl) gate-source plateau voltage VDS = 12 V; see Figure 14; see Figure 15 - 2.6 - V Ciss input capacitance VDS = 12 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 16 - 1270 - pF Coss output capacitance - 255 - pF Crss reverse transfer capacitance - 145 - pF td(on) turn-on delay time VDS = 12 V; RL = 0.5 Ω; VGS = 4.5 V; RG(ext) = 4.7 Ω - 24 - ns tr rise time - 39 - ns td(off) turn-off delay time - 30 - ns tf fall time - 11 - ns PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 6 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; see Figure 17 - 0.88 1.2 V trr reverse recovery time IS = 20 A; dIS/dt = -100 A/μs; VGS = 0 V; VDS = 20 V - 30 - ns Qr recovered charge - 22 - nC Table 6. Characteristics …continued Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Fig 5. Transfer characteristics: drain current as a function of gate-source voltage; typical values Fig 6. Forward transconductance as a function of drain current; typical values Fig 7. Drain-source on-state resistance as a function of gate-source voltage; typical values Fig 8. Output characteristics: drain current as a function of drain-source voltage; typical values 003aac729 0 20 40 60 80 0 1 2 3 VGS (V) 4 ID (A) Tj = 150 °C 25 °C 003aac728 30 40 50 60 0 10 20 30 I 40 D (A) gfs (S) 003aac727 4 6 8 10 12 14 2 4 6 8 V 10 GS (V) RDSon (mΩ) 003aac726 0 20 40 60 80 100 0 2 4 6 8 10 VDS (V) ID (A) VGS (V) = 4.5 10 3.2 3 2.8 2.6 2.4 2.2 PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 7 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 9. Input and reverse transfer capacitances as a function of gate-source voltage; typical values Fig 10. Drain-source on-state resistance as a function of drain current; typical values Fig 11. Sub-threshold drain current as a function of gate-source voltage Fig 12. Gate-source threshold voltage as a function of junction temperature 003aac724 0 500 1000 1500 2000 2500 0 2 4 6 8 10 VGS (V) C (pF) Ciss Crss 003aac722 4 6 8 10 12 14 16 0 20 40 60 80 100 ID (A) RDSon (mΩ) VGS (V) = 4.5 10 3.2 003aab271 10-6 10-5 10-4 10-3 10-2 10-1 0 1 2 VGS (V) 3 ID (A) min typ max 003aac337 0 1 2 3 -60 0 60 120 180 Tj (°C) VGS(th) (V) max typ min PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 8 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 13. Normalized drain-source on-state resistance factor as a function of junction temperature Fig 14. Gate charge waveform definitions Fig 15. Gate-source voltage as a function of gate charge; typical values Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 03aa27 0 0.5 1 1.5 2 −60 0 60 120 180 Tj (°C) a 003aaa508 VGS VGS(th) QGS1 QGS2 QGD VDS QG(tot) ID QGS VGS(pl) 003aac725 0 2 4 6 8 10 0 5 10 15 20 25 QG (nC) VGS (V) VDS = 19 (V) VDS = 12 (V) 003aac723 0 400 800 1200 1600 10-1 1 10 102 VDS (V) C (pF) Ciss Coss Crss PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 9 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values 003aac730 0 20 40 60 80 0.0 0.2 0.4 0.6 0.8 1.0 VSD (V) IS (A) Tj = 150 °C 25 °C PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 10 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 7. Package outline Fig 18. Package outline SOT669 (LFPAK) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 04-10-13 06-03-16 0 2.5 5 mm scale e E1 b c2 A2 UNIT A A2 b c e DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A1 A3 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8° 0° D(1) w y 5.0 4.8 E(1) 3.3 3.1 E1 D1 (1) (1) max 0.25 4.20 1.27 0.25 0.1 1 2 3 4 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A w M A C C X 1/2 e y C θ θ (A 3 ) L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 11 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PSMN7R0-30YL v.4 20110309 Product data sheet - PSMN7R0-30YL v.3 Modifications: • Various changes to content. PSMN7R0-30YL v.3 20100104 Product data sheet - PSMN7R0-30YL v.2 PSMN7R0-30YL v.2 20090105 Product data sheet - PSMN7R0-30YL v.1 PSMN7R0-30YL v.1 20081015 Preliminary data sheet - - PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 12 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 9. Legal information 9.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. 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Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 13 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 March 2011 Document identifier: PSMN7R0-30YL Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. DPO4000 Series Digital Phosphor Oscilloscopes User Manual www.tektronix.com 071-1785-00 Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specifications and price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. e*Scope, iView, OpenChoice, TekSecure, and TekVPI are registered trademarks of Tektronix, Inc. Wave Inspector is a trademark of Tektronix, Inc. Contacting Tektronix Tektronix, Inc. 14200 SW Karl Braun Drive P.O. Box 500 Beaverton, OR 97077 USA For product information, sales, service, and technical support: In North America, call 1-800-833-9200. Worldwide, visit www.tektronix.com to find contacts in your area. Warranty 4 Tektronix warrants that this product will be free from defects in materials and workmanship for a period of three (3) years from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be new or reconditioned to like new performance. All replaced parts, modules and products become the property of Tektronix. In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations. This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product. THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. Table of Contents Table of Contents General Safety Summary ................................................................................................................... v Environmental Considerations ............................................................................................................ viii Preface....................................................................................................................................... x Key Features........................................................................................................................... x Where to Find More Information..................................................................................................... xii Conventions Used in This Manual................................................................................................... xiii Installation .................................................................................................................................. 1 Before Installation..................................................................................................................... 1 Operating Considerations ............................................................................................................ 6 Connecting Probes .................................................................................................................. 10 Powering On the Oscilloscope ...................................................................................................... 11 Powering Off the Oscilloscope ...................................................................................................... 14 Functional Check .................................................................................................................... 15 Compensating the Probe ............................................................................................................ 17 Installing an Application Module..................................................................................................... 19 Changing the User Interface Language ............................................................................................. 20 Changing the Date and Time ........................................................................................................ 23 Signal Path Compensation .......................................................................................................... 25 Upgrading Firmware ................................................................................................................. 28 Connecting Your Oscilloscope to a Computer ...................................................................................... 34 DPO4000 Series User Manual i Table of Contents Get Acquainted with the Instrument....................................................................................................... 45 Front-Panel Menus and Controls.................................................................................................... 45 Front-Panel Connectors ............................................................................................................. 66 Side-Panel Connector ............................................................................................................... 67 Rear-Panel Connectors.............................................................................................................. 68 Acquire the Signal ......................................................................................................................... 70 Setting Up Signal Input .............................................................................................................. 70 Using the Default Setup ............................................................................................................. 73 Using Autoset ........................................................................................................................ 74 Acquisition Concepts ................................................................................................................ 75 How the Acquisition Modes Work ................................................................................................... 78 Changing the Acquisition Mode and Record Length................................................................................ 80 Using Roll Mode ..................................................................................................................... 83 Defining a Serial Bus ................................................................................................................ 84 Trigger Setup and Run .................................................................................................................... 91 Triggering Concepts ................................................................................................................. 91 Choosing a Trigger................................................................................................................... 98 Selecting Triggers.................................................................................................................... 99 Triggering on Buses ................................................................................................................ 102 Checking Trigger Status ............................................................................................................ 107 Using A (Main) and B (Delayed) Triggers .......................................................................................... 107 Starting and Stopping an Acquisition............................................................................................... 111 ii DPO4000 Series User Manual Table of Contents Display Waveform Data .................................................................................................................. 112 Adding and Removing a Waveform ................................................................................................ 112 Setting the Display Style and Persistence ......................................................................................... 112 Setting Waveform and Graticule Intensity.......................................................................................... 115 Setting the Graticule Style .......................................................................................................... 117 Setting the LCD Backlight .......................................................................................................... 118 Scaling and Positioning a Waveform............................................................................................... 120 Setting Input Parameters ........................................................................................................... 122 Analyze Waveform Data.................................................................................................................. 129 Taking Automatic Measurements................................................................................................... 129 Selecting Automatic Measurements................................................................................................ 131 Customizing an Automatic Measurement .......................................................................................... 137 Taking Manual Measurements with Cursors ....................................................................................... 144 Using Math Waveforms ............................................................................................................. 150 Using FFT........................................................................................................................... 153 Using Advanced Math .............................................................................................................. 157 Using Reference Waveforms ....................................................................................................... 160 Managing Long Record Length Waveforms........................................................................................ 163 Save and Recall Information ............................................................................................................. 174 Saving a Screen Image............................................................................................................. 174 Saving and Recalling Waveform Data.............................................................................................. 176 Saving and Recalling Setups ....................................................................................................... 184 DPO4000 Series User Manual iii Table of Contents Saving with One Button Push ...................................................................................................... 187 Printing a Hard Copy................................................................................................................ 189 Erasing DPO4000 Memory ......................................................................................................... 196 Use Application Modules ................................................................................................................. 200 Application Examples..................................................................................................................... 201 Taking Simple Measurements ...................................................................................................... 201 Analyzing Signal Detail ............................................................................................................. 217 Triggering on a Video Signal ....................................................................................................... 226 Capturing a Single-Shot Signal..................................................................................................... 230 Correlating Data With a TLA5000 Logic Analyzer ................................................................................. 235 Tracking Down Bus Anomalies ..................................................................................................... 238 Index iv DPO4000 Series User Manual General Safety Summary General Safety Summary Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified. Only qualified personnel should perform service procedures. To Avoid Fire or Personal Injury Use Proper Power Cord. Use only the power cord specified for this product and certified for the country of use. Connect and Disconnect Properly. Do not connect or disconnect probes or test leads while they are connected to a voltage source. Connect and Disconnect Properly. De-energize the circuit under test before connecting or disconnecting the current probe. Ground the Product. This product is grounded through the grounding conductor of the power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded. Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product. The inputs are not rated for connection to mains or Category II, III, or IV circuits. Connect the probe reference lead to earth ground only. Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal. DPO4000 Series User Manual v General Safety Summary Power Disconnect. The power switch disconnects the product from the power source. See instructions for the location. Do not block the power switch; it must remain accessible to the user at all times. Do Not Operate Without Covers. Do not operate this product with covers or panels removed. Do Not Operate With Suspected Failures. If you suspect that there is damage to this product, have it inspected by qualified service personnel. Avoid Exposed Circuitry. Do not touch exposed connections and components when power is present. Do Not Operate in Wet/Damp Conditions. Do Not Operate in an Explosive Atmosphere. Keep Product Surfaces Clean and Dry. Provide Proper Ventilation. Refer to the manual’s installation instructions for details on installing the product so it has proper ventilation. Terms in this Manual These terms may appear in this manual: WARNING. Warning statements identify conditions or practices that could result in injury or loss of life. CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property. vi DPO4000 Series User Manual General Safety Summary Symbols and Terms on the Product These terms may appear on the product: DANGER indicates an injury hazard immediately accessible as you read the marking. WARNING indicates an injury hazard not immediately accessible as you read the marking. CAUTION indicates a hazard to property including the product. The following symbols may appear on the product: DPO4000 Series User Manual vii Environmental Considerations Environmental Considerations This section provides information about the environmental impact of the product. Product End-of-Life Handling Observe the following guidelines when recycling an instrument or component: Equipment Recycling. Production of this equipment required the extraction and use of natural resources. The equipment may contain substances that could be harmful to the environment or human health if improperly handled at the product’s end of life. In order to avoid release of such substances into the environment and to reduce the use of natural resources, we encourage you to recycle this product in an appropriate system that will ensure that most of the materials are reused or recycled appropriately. The symbol shown below indicates that this product complies with the European Union’s requirements according to Directive 2002/96/EC on waste electrical and electronic equipment (WEEE). For information about recycling options, check the Support/Service section of the Tektronix Web site (www.tektronix.com). Mercury Notification. This product uses an LCD backlight lamp that contains mercury. Disposal may be regulated due to environmental considerations. Please contact your local authorities or, within the United States, the Electronics Industries Alliance (www.eiae.org) for disposal or recycling information. viii DPO4000 Series User Manual Environmental Considerations Restriction of Hazardous Substances This product has been classified as Monitoring and Control equipment, and is outside the scope of the 2002/95/EC RoHS Directive. This product is known to contain lead, cadmium, mercury, and hexavalent chromium. DPO4000 Series User Manual ix Preface Preface This manual describes the installation and operation of the following DPO4000 Series Instruments: DPO4104 DPO4054 DPO4034 DPO4032 Key Features DPO4000 Series instruments can help you verify, debug, and characterize electronic designs. Key features include: 1 GHz, 500 MHz, and 350 MHz bandwidths 2 and 4 channel models Sample rates up to 5 GS/s on all channels 10 Megapoint record length on all channels I2C, SPI, and CAN serial triggering and analysis (Requires use of the DPO4EMBD (for I2C and SPI) or DPO4AUTO (for CAN) application modules) Wave Inspector controls for managing long record lengths, with zoom and pan, play and pause, search and mark 10.4 inch (264 mm) XGA color display Small footprint and lightweight, at 140 mm (5.5 inches) deep and 5 kg (11 pounds) USB and CompactFlash available for quick and easy storage Built-in Ethernet port USB 2.0 device port for direct PC control of the oscilloscope using USBTMC protocol x DPO4000 Series User Manual Preface OpenChoice documentation and analysis software Remote viewing with control (e*Scope and OpenChoice connectivity) TekVPI Versatile Probe Interface supports active, differential, and current probes for automatic scaling and units DPO4000 Series User Manual xi Preface Where to Find More Information The following information is available for your oscilloscope: To read about Use these documents Installation and Operation This DPO4000 User Manual English: 071-1785-XX French: 071-1799-XX Italian: 071-1800-XX German: 071-1801-XX Spanish: 071-1802-XX Japanese: 071-1803-XX Portuguese: 071-1804-XX Simplified Chinese: 071-1805-XX Traditional Chinese: 071-1806-XX Korean: 071-1807-XX Russian: 071-1808-XX Specifications and Performance Verification The DPO4000 Technical Reference (071-1843-XX) (PDF only) Programmer Commands The DPO4000 Programmer Manual (071-1845-XX) (PDF only) Analysis and Connectivity Tools The optional Getting Started with OpenChoice Solutions Manual (020-2514-XX) (includes a CD) xii DPO4000 Series User Manual Preface To read about Use these documents Servicing and calibration The optional DPO4000 Service Manual (071-1844-XX) Installing and testing application modules The DPO4000 Series Application Module Installation Instructions manual (071-1833-XX) (11 languages) Conventions Used in This Manual The following icons are used throughout this manual. Sequence Step Front panel power Connect power Network USB DPO4000 Series User Manual xiii Preface xiv DPO4000 Series User Manual Installation Installation Before Installation Unpack the oscilloscope and check that you received all items listed as standard accessories. The following pages list recommended accessories and probes, instrument options, and upgrades. Check the Tektronix Web site (www.tektronix.com) for the most current information. Standard Accessories Accessory Tektronix part number English (Option L0) 071-1785-XX French (Option L1) 071-1799-XX Italian (Option L2) 071-1800-XX German (Option L3) 071-1801-XX Spanish (Option L4) 071-1802-XX Japanese (Option L5) 071-1803-XX Portuguese (Option L6) 071-1804-XX Simple Chinese (Option L7) 071-1805-XX Traditional Chinese (Option L8) 071-1806-XX Korean (Option L9) 071-1807-XX DPO4000 User Manual Russian (Option L10) 071-1808-XX DPO4000 Series User Manual 1 Installation Standard Accessories (cont.) Accessory Tektronix part number DPO4000 Documentation Browser CD Electronic versions of DPO4000 documents, including the Programmer Manual and the Technical Reference. 063-1810-XX OpenChoice Desktop CD Applications that let you capture and transfer data from your oscilloscope to an external PC. Use the standalone OpenChoice Desktop, MS Word, or MS Excel Toolbars. 020-2514-XX Calibration certificate documenting traceability to national metrology institute(s), and ISO9001 quality system registration. —— One 500 MHz, 10x passive probe per channel P6139A Front Cover Hard plastic cover to help protect the instrument 200-4908-00 CompactFlash memory card Extra storage 156-9413-00 2 DPO4000 Series User Manual Installation Standard Accessories (cont.) Accessory Tektronix part number North America (Option A0) 161-0104-00 Universal Euro (Option A1) 161-0104-06 United Kingdom (Option A2) 161-0104-07 Australia (Option A3) 161-0104-05 Switzerland (Option A5) 161-0167-00 Japan (Option A6) 161-A005-00 China (Option A10) 161-0306-00 India (Option A11) 161-0400-00 Power Cord No power cord or AC adapter (Option A99) —— DPO4000 Series User Manual 3 Installation Optional Accessories Accessory Tektronix Part Number DPO4EMBD The embedded serial triggering and analysis module enables triggering on packet level information on I2C and SPI serial buses, as well as digital views of the signal, bus views, bus decoding, search tools, and packet decode tables with timestamp information DPO4EMBD DPO4AUTO The embedding automotive serial triggering and analysis module enables triggering on packet level information on CAN serial buses, as well as digital views of the signal, bus views, bus decoding, search tools, and packet decode tables with timestamp information DPO4AUTO TPA-BNC TekVPI to TekProbe 2 BNC Adapter TPA-BNC TEK-USB-488 Adapter GPIB to USB Adapter TEK-USB-488 Getting Started with OpenChoice Solutions Manual with CD Describes ways to develop host-computer software applications that work with your oscilloscope 020-2513-XX Rackmount kit Adds rackmount brackets RM4000 Soft transit case Case for carrying instrument AC4000 Hard transit case Traveling case, which requires use of the soft transit case (AC4000) HCTEK4321 4 DPO4000 Series User Manual Installation Optional Accessories (cont.) Accessory Tektronix Part Number CompactFlash memory card Extra storage 156-9413-00 CompactFlash to USB memory card reader Card reader 119-6827-00 DPO4000 Programmer Manual Describes commands for remote control of the DPO4000 oscilloscope. Available electronically on the Documentation Browser CD or for download from www.tektronix.com. 071-1845-XX DPO4000 Technical Reference Manual Describes the DPO4000 oscilloscope specifications and performance verification procedure. Available electronically on the Documentation Browser CD or for download from www.tektronix.com. 071-1809-XX DPO4000 Service manual Service information 071-1844-XX DPO4000 Module Installation Instructions Manual 071-1833-XX The DPO4000 oscilloscope works with multiple optional probes. (See page 10, Connecting Probes.) Check the Tektronix Web site (www.tektronix.com) for the most current information. DPO4000 Series User Manual 5 Installation Operating Considerations DPO4000 Series Oscilloscope Input Voltage: 100 V to 240 V ±10% Input Power Frequency: 47 Hz to 66 Hz (100 V to 240 V) 400 Hz (100 V to 132 V) Power Consumption: 250 W maximum Weight: 5 kg (11 lbs), stand-alone instrument Height, including feet but not handle: 229 mm (9.0 in) Width, from handle hub to handle hub: 439 mm (17.3 in) Depth, from feet to front of knobs: 137 mm (5.4 in) Depth, from feet to front of front cover: 145 mm (5.7 in) Clearance: 51 mm (2 in) Temperature: Operating: +0 °C to +50 °C Nonoperating: -20 °C to +60 °C 6 DPO4000 Series User Manual Installation Humidity: Operating: High: 40 °C to 50 °C, 10% to 60% RH Operating: Low: 0 °C to 40 °C, 10 to 90% RH Non-operating: High: 40 °C to 60 °C, 5 to 60% RH Non-operating: Low: 0 °C to 40 °C, 5 to 90% RH Altitude: Operating: 3,000 m (about 10,000 ft) Nonoperating Altitude: 12,192 m (40,000 ft) Random Vibration: Operating: 0.31 GRMS, 5 – 500 Hz, 10 minutes per axis, 3 axes (30 minutes total) Non-operating: 2.46 GRMS, 5 – 500 Hz, 10 minutes per axis, 3 axes (30 minutes total) Pollution Degree: 2, Indoor use only Acquisition System: 1 MΩ The maximum input voltage at the BNC, between center conductor and shield is 400 Vpeak (DF ≤ 39.2%), 250 VRMS to 130 kHz derated to 2.6 V RMS at 500 MHz. The maximum transient withstand voltage is ± 800 Vpeak. For steady-state sinusoidal waveforms, derate at 20 dB/decade above 200 kHz to 13 Vpk at 3 MHz and above. Acquisition System: 50Ω The maximum input voltage at the BNC, between center conductor and shield is 5 VRMS, with peaks ≤ ±20 V (DF ≤ 6.25%) DPO4000 Series User Manual 7 Installation External Trigger: 1 MΩ The maximum input voltage at the BNC, between center conductor and shield is 400 Vpeak (DF ≤ 39.2%), 250 VRMS to 2 MHz derated to 5 VRMS at 500 MHz. The maximum transient withstand voltage is ±800 Vpeak. For steady-state sinosoidal waveforms, derate at 20 dB/decade above 200 kHz to 13 Vpeak at 3 MHz and above. P6139A Passive Probe Input Voltage: 400 VRMS or 400 V DC; CAT I (2,500 Vpeak transient) 300 VRMS or 300 V DC; CAT II (2,500 Vpeak transient 150 VRMS or 150 V DC; CAT III (2,500 Vpeak transient) For steady-state, sinusoidal waveforms, derate at 20 dB/decade above 2.5 MHz to 50 VRMS at 20 MHz and above. Output Voltage (terminated into 1 MΩ): 40 VRMS or 40 V DC; CAT I (2,500 Vpeak impulse) 30 VRMS or 30 V DC; CAT I (250 Vpeak impulse) 15 VRMS or 15 V DC; CAT I (250 Vpeak impulse) Temperature: Operating: -15 °C to +65 °C ( +5 °F to +149 °F) Nonoperating: -62 °C to +85 °C ( -80 °F to +185 °F) Altitude: ≤ 2,000 meters 8 DPO4000 Series User Manual Installation Pollution Degree: 2, Indoor use only Humidity: Operating: High: 40 °C to 50 °C, 10% to 60% RH Operating: Low: 0 °C to 40 °C, 10 to 90% RH CAUTION. To ensure proper cooling, keep the sides and rear of the instrument clear of obstructions. Cleaning Inspect the oscilloscope and probes as often as operating conditions require. To clean the exterior surface, perform the following steps: 1. Remove loose dust on the outside of the oscilloscope and probes with a lint-free cloth. Use care to avoid scratching the clear glass display filter. 2. Use a soft cloth dampened with water to clean the oscilloscope. Use an aqueous solution of 75% isopropyl alcohol for more efficient cleaning. CAUTION. To avoid damage to the surface of the oscilloscope or probes, do not use any abrasive or chemical cleaning agents. DPO4000 Series User Manual 9 Installation Connecting Probes The DPO4000 oscilloscope supports probes with the following: 1. Tektronix Versatile Probe Interface (TekVPI) These probes support two-way communication with the oscilloscope through on-screen menus and remotely through programmable support. The remote control is useful in applications like ATE where you want the system to preset probe parameters. 2. TPA-BNC Adapter The TPA-BNC Adapter allows you to use TekProbe Level II probe capabilities, such as providing probe power and passing information to the oscilloscope on scaling and whether the units are volts or amperes. 3. Plain BNC interfaces These probes only pass the waveform signal to the oscilloscope. There is no other communication. 10 DPO4000 Series User Manual Installation For more information on the many probes available for use with DPO4000 oscilloscopes, refer to www.tektronix.com. Powering On the Oscilloscope Ground the Oscilloscope and Yourself Before pushing the power switch, connect the oscilloscope to an electrically neutral reference point, such as earth ground. Do this by plugging the three-pronged power cord into an outlet grounded to earth ground. Grounding the oscilloscope is necessary for safety and to take accurate measurements. The oscilloscope needs to share the same ground as any circuits that you are testing. DPO4000 Series User Manual 11 Installation If you are working with static sensitive components, ground yourself. Static electricity that builds up on your body can damage static-sensitive components. Wearing a grounding strap safely sends static charges on your body to earth ground. 12 DPO4000 Series User Manual Installation To connect the power cord and power on the oscilloscope: DPO4000 Series User Manual 13 Installation Powering Off the Oscilloscope To power off the oscilloscope and remove the power cord: 14 DPO4000 Series User Manual Installation Functional Check Perform this quick functional check to verify that your oscilloscope is operating correctly. 1. Connect the oscilloscope power cable as described above. 2. Power on the oscilloscope. DPO4000 Series User Manual 15 Installation 3. Connect the oscilloscope P6139A probe tip and reference lead to the PROBE COMP connectors. 4. Press Default Setup. 16 DPO4000 Series User Manual Installation 5. Push the Autoset button. The screen should now display a square wave, approximately 2.5 V at 1 kHz. If the signal appears but is misshapen, perform the procedures for compensating the probe. (See page 17, Compensating the Probe.) If no signal appears, rerun the procedure. If it no signal still appears, have the instrument serviced by qualified service personnel. Compensating the Probe Whenever you attach a passive voltage probe for the first time to any input channel, compensate the probe to match it to the corresponding oscilloscope input channel. To properly compensate your passive probe: 1. Follow the steps for the functional check. (See page 15, Functional Check.) DPO4000 Series User Manual 17 Installation 2. Check the shape of the displayed waveform to determine if your probe is properly compensated. Properly compensated Under compensated Over compensated 3. If necessary, adjust your probe. Repeat as needed. 18 DPO4000 Series User Manual Installation Quick Tips Use the shortest possible ground lead and signal path to minimize probe-induced ringing and distortion on the measured signal. Short ground lead Long ground lead Installing an Application Module CAUTION. To avoid damage to the oscilloscope or application module, observe ESD precautions. (See page 11, Powering On the Oscilloscope.) Turn off the oscilloscope power while removing or adding an application module. (See page 14, Powering Off the Oscilloscope.) DPO4000 Series User Manual 19 Installation Optional application module packages extend the capability of your oscilloscope. Install up to four application modules at one time into the two slots with windows in the upper right corner of the front panel and the two additional slots hidden behind the two you can see. Refer to the DPO4000 Series Application Module Installation Instructions that came with your application module for instructions on installing and testing an application module. NOTE. If you remove an application module, the features provided by the application module become unavailable. To restore the features, turn off the oscilloscope power, reinstall the module and turn on the oscilloscope power. Changing the User Interface Language To change the language of the oscilloscope user interface and the front-panel button labels: 1. Push Utility. 2. Push System repeatedly until you select Config from the pop-up menu. Config 20 DPO4000 Series User Manual Installation 3. Push Language from the resulting lower-bezel menu. System Config Language English Set Date & Time TekSecure Erase Memory Version v1.00 4. Push the side-bezel button corresponding to the desired language. Choose among: English, French, Italian, German, Spanish, Japanese, Brazilian Portuguese, Simplified Chinese, Traditional Chinese, Korean, and Russian. Language English Francais Deutsch Italiano -more- 1 of 3 DPO4000 Series User Manual 21 Installation 5. If you choose to use English, be sure that the plastic front-panel overlay is removed. If you choose a language other than English, place the plastic overlay for the language that you desire over the front panel to display labels in that language. 22 DPO4000 Series User Manual Installation Changing the Date and Time To set the internal clock with the current date and time: 1. Push Utility. 2. Push System repeatedly until you select Config from the pop-up menu. Config 3. Push Set Date & Time. System Config Language English Set Date & Time TekSecure Erase Memory Version DPO4000 Series User Manual 23 Installation Date Time Set Display Date/Time ON OFF 4. Push the side-panel buttons and rotate both multipurpose knobs (a and b) to set the time and date values. Hour: 4 Min: 1 Month: July Day: 19 Year: 2005 OK Enter Date & Time 5. Push OK Enter Date & Time. OK Enter Date & Time 24 DPO4000 Series User Manual Installation Signal Path Compensation Signal Path Compensation (SPC) corrects for DC inaccuracies caused by temperature variations and/or long-term drift. Run the compensation whenever the ambient temperature has changed by more than 10 °C or once a week if you use vertical settings of 5 mV/division or less. Failure to do so may result in the instrument not meeting warranted performance levels at those volts/div settings. To compensate the signal path: 1. Warm up the oscilloscope for at least 20 minutes. Remove all input signals (probes and cables) from channel inputs. Input signals with AC components adversely affect SPC. DPO4000 Series User Manual 25 Installation 2. Push Utility. 3. Push System repeatedly until you select Calibration from the resulting pop-up menu. Calibration 4. Push Signal Path from the lower-bezel menu. System Calibration Signal Path Pass Factory Pass 5. Push OK Compensate Signal path from the resulting side-bezel menu. OK Compensate Signal Path The calibration will take approximately 10 minutes to complete. 26 DPO4000 Series User Manual Installation 6. After calibration, verify that the status indicator on the lower-bezel menu displays Pass. System Calibration Signal Path Pass Factory Pass If it does not, then recalibrate the instrument or have the instrument serviced by qualified service personnel. 7. Service personnel use the factory calibration functions to calibrate the internal voltage references of the oscilloscope using external sources. Refer to your Tektronix field office or representative for assistance with factory calibration. NOTE. Signal Path Compensation does not include calibration to the probe tip. (See page 17, Compensating the Probe.) DPO4000 Series User Manual 27 Installation Upgrading Firmware To upgrade the firmware of the oscilloscope: 1. Open up a Web browser and go to www.tektronix.com. Proceed to the software finder. Download the latest firmware for your DPO4000 series oscilloscope onto a USB storage device. 28 DPO4000 Series User Manual Installation 2. Power off your DPO4000. DPO4000 Series User Manual 29 Installation 3. Insert the USB storage device into the front-panel USB port on your DPO4000. 30 DPO4000 Series User Manual Installation 4. Power on the DPO4000. The instrument automatically recognizes the replacement firmware and installs it. If the instrument does not install the firmware, rerun the procedure. It the problem continues, contact qualified service personnel. CAUTION. Do not power off the oscilloscope or remove the USB storage device until the oscilloscope finishes installing the firmware. DPO4000 Series User Manual 31 Installation 5. Power off the DPO4000 and remove the USB storage device. 32 DPO4000 Series User Manual Installation 6. Power on the DPO4000. 7. Push Utility. DPO4000 Series User Manual 33 Installation 8. Push Version. The oscilloscope displays the firmware version number. System Config Language English Set Date & Time TekSecure Erase Memory Version 9. Confirm that the version number matches that of the new firmware. Connecting Your Oscilloscope to a Computer You may want to document your work for future reference. Instead of saving screen images and waveform data to a CompactFlash or USB storage device, and then generating a report later, you may want to send it directly to a remote PC for analysis. You may also want to control an oscilloscope at a remote location from your computer. Two ways to connect your oscilloscope to a computer are the TekVISA-based OpenChoice and the e*Scope Web-enabled tool. Use OpenChoice to communicate with your oscilloscope from your computer through a software application. Use e*Scope to communicate with your oscilloscope through a Web browser. Using OpenChoice OpenChoice lets you use your MS-Windows computer to acquire data from your oscilloscope for use in an analysis package that runs on your PC, such as Microsoft Excel, National Instruments LabVIEW. or a program of your own creation. You can use a common communications protocol, such as USB, Ethernet, or GPIB to connect the computer to the oscilloscope. 34 DPO4000 Series User Manual Installation To set up OpenChoice communications between your oscilloscope and a computer: 1. Load the TekVISA drivers on your computer. Find these on the OpenChoice Desktop CD or at the Tektronix software finder Web page (www.tektronix.com). When done, the TekVISA icon appears in the Windows System Tray. Typically, this is the bottom right of the Windows desktop on your MS-Windows computer. DPO4000 Series User Manual 35 Installation 2. Connect the DPO4000 to your computer with the appropriate USB or Ethernet cable. To communicate between the DPO4000 and a GPIB system, connect the oscilloscope to the TEK-USB-488 GPIB-to-USB Adapter with a USB cable. Then connect the adapter to your GPIB system with a GPIB cable. 36 DPO4000 Series User Manual Installation 3. Push Utility. 4. Push System repeatedly to select I/O. I/O 5. To use Ethernet, push Ethernet Network Settings. System I/O USB Enabled Ethernet Network Settings GPIB 1 DPO4000 Series User Manual 37 Installation Network Configuration Change Instrument Settings DHCP/ BOOTP On Off On the side-bezel menu, if you are on a DHCP Ethernet network and using a through cable, set DHCP to On. If you are using a cross-over cable, set it to Off and set a hard coded TCPIP address. Test Connection 6. If you are using GPIB, push GPIB. 7. Enter the GPIB address on the side-bezel menu, using multipurpose knob a. Talk/Listen Address a 1 This will set the GPIB address on an attached TEK-USB-488 Adapter. 38 DPO4000 Series User Manual Installation 8. If you are using USB, the system sets itself up automatically for you, if USB is enabled. Check USB on the bottom-bezel menu to be sure that USB is enabled. If it is not enabled, push USB. Then push Enabled on the side-bezel menu. 9. Run your application software on your computer. 10. In case of problems getting oscilloscope-to-PC communications to work, refer to the networking troubleshooter. To bring up the troubleshooter, click the TekVISA icon on the System Tray of your MS-Windows computer. Then go to the online help. Quick Tips The DPO4000 comes with a variety of Windows-based software tools designed to ensure efficient connectivity between your oscilloscope and your computer. There are tool bars that speed connectivity with Microsoft Excel and Word. There is also a standalone acquisition program called the OpenChoice Desktop. The rear-panel USB 2.0 device port is the correct USB port for computer connectivity. Use the rear- and front-panel USB 2.0 host ports to connect your oscilloscope to storage devices and printers. DPO4000 Series User Manual 39 Installation Using e*Scope e*Scope lets you access any Internet-connected DPO4000 Series Oscilloscope from a browser on your workstation, PC, or laptop computer. No matter where you are, your DPO4000 is as close as the nearest browser. To set up e*Scope communications between your oscilloscope and a Web browser running on a remote computer: 1. Connect the DPO4000 to your computer network with the appropriate Ethernet cable. 2. Push Utility. 40 DPO4000 Series User Manual Installation 3. Push System repeatedly to select I/O. I/O 4. Push Ethernet Network Settings. System I/O USB Ethernet Network Settings GPIB DPO4000 Series User Manual 41 Installation Network Configuration 5. Push Change Instrument Settings to determine the Ethernet address and instrument name. On the side-bezel menu, if you are on a DHCP Ethernet network and using dynamic addressing, set DHCP to On. If you are using static addressing, set it to Off. Change Instrument Settings DHCP/ BOOTP On Off Test Connection 6. Start your browser on your remote computer. In the browser address line, enter the IP address or, if DHCP is set to On in the oscilloscope, simply enter the instrument name. 42 DPO4000 Series User Manual Installation 7. You should now see the e*Scope screen, with a copy of the oscilloscope display, on your Web browser. If e*Scope does not work, rerun the procedure. If it still does not work, contact qualified service personnel. DPO4000 Series User Manual 43 Installation 44 DPO4000 Series User Manual Get Acquainted with the Instrument Get Acquainted with the Instrument Front-Panel Menus and Controls The front panel has buttons and controls for the functions that you use most often. Use the menu buttons to access more specialized functions. DPO4000 Series User Manual 45 Get Acquainted with the Instrument Using the Menu System To use the menu system: 1. Push a front-panel menu button to display the menu that you want to use. 46 DPO4000 Series User Manual Get Acquainted with the Instrument 2. Push a lower-bezel button to select a menu item. If a pop-up menu appears, push the lower-bezel button repeatedly to select the desired choice. 3. Push a side-bezel button to choose a side-bezel menu item. If the menu item contains more than one choice, push the side-bezel button repeatedly to cycle through the choices. DPO4000 Series User Manual 47 Get Acquainted with the Instrument 4. To remove a side-bezel menu, push the lower-bezel button again or push Menu Off. 5. Certain menu choices require you to set a numerical value to complete the setup. Use the upper and lower multipurpose knobs a and b to adjust values. 6. Push Fine to turn off or on the ability to make smaller adjustments. 48 DPO4000 Series User Manual Get Acquainted with the Instrument Using the Menu Buttons Use the menu buttons to perform many functions in the oscilloscope. 1. Measure. Push to perform automated measurements on waveforms or to configure cursors. 2. Search. Push to search through an acquisition for user-defined events/criteria. 3. Test. Push to activate advanced or application-specific testing features. 4. Acquire. Push to set the acquisition mode and adjust the record length. 5. Autoset. Push to perform an automatic setup of oscilloscope settings. 6. Trigger Menu. Push to specify trigger settings. DPO4000 Series User Manual 49 Get Acquainted with the Instrument 7. Utility. Push to activate the system utility functions, such as selecting a language or setting the date/time. 8. Default Setup. Push to restore the oscilloscope to the default settings. 9. Save / Recall Menu. Push to save and recall setups, waveforms, and screen images to internal memory, a CompactFlash card, or a USB storage device. 10. Channel 1,2,3, or 4. Push to set vertical parameters for input waveforms and to display or remove the corresponding waveform from the display. 50 DPO4000 Series User Manual Get Acquainted with the Instrument 11. B1 or B2. Push to define and display a bus, if you have the appropriate module application keys. The DPO4AUTO module supports CAN. The DPO4EMBD module supports I2C and SPI. Also, push the B1 or B2 button to display or remove the corresponding bus from the display. 12. R. Push to manage reference waveforms, including the display or removal of each reference waveform from the display. 13. M. Push to manage the math waveform, including the display or removal of the math waveform from the display. DPO4000 Series User Manual 51 Get Acquainted with the Instrument Using Other Controls These buttons and knobs control waveforms, cursors and other data input. 1. Turn the upper multipurpose knob a, when activated, to move a cursor or set a numerical parameter value for a menu item. Push the nearby Fine button to toggle between coarse and fine adjustment. Screen icons tell you when a or b are active. 2. Cursors. Push once to activate the two vertical cursors. Push again to turn on the two vertical and two horizontal cursors. Push again to turn off all cursors. When the cursors are on, you can turn the multipurpose knobs to control their position. 52 DPO4000 Series User Manual Get Acquainted with the Instrument 3. Select. Push to activate special functions. For example, when using the two vertical cursors (and no horizontal ones are visible), you can push this button to link or unlink the cursors. When the two vertical and two horizontal cursors are both visible, you can push this button to make either the vertical cursors or the horizontal ones active. 4. Fine. Push to toggle between making coarse and fine adjustments with the vertical and horizontal position knobs, the trigger level knob, and many operations of multipurpose knobs a and b. 5. Waveform Intensity. Push to enable multipurpose knob a to control waveform display intensity and knob b to control graticule intensity. DPO4000 Series User Manual 53 Get Acquainted with the Instrument 6. Turn the lower multipurpose knob b, when activated, to move a cursor or set a numerical parameter value for a menu item. Push Fine to make adjustments more slowly. 7. Zoom button. Push to activate zoom mode. 8. Pan (outer knob). Turn to scroll the zoom window through the acquired waveform. 9. Zoom (inner knob). Turn to control the zoom factor. Turning it clockwise zooms in further. Turning it counterclockwise zooms out. 10. Play-pause button. Push to start or stop the automatic panning of a waveform. Control the speed and direction with the pan knob. 11. ← Prev. Push to jump to the previous waveform mark. 54 DPO4000 Series User Manual Get Acquainted with the Instrument 12. Set/Clear Mark. Push to establish or delete a waveform mark. 13. → Next. Push to jump to the next waveform mark. 14. Horizontal Position. Turn to adjust the trigger point location relative to the acquired waveforms. Push Fine to make smaller adjustments. 15. Horizontal Scale. Turn to adjust the horizontal scale (time/division). DPO4000 Series User Manual 55 Get Acquainted with the Instrument 16. Run/Stop. Push to start or stop acquisitions. 17. Single. Push to make a single acquisition. 18. Autoset. Push to automatically set the vertical, horizontal, and trigger controls for a usable, stable display. 19. Trigger Level. Turn to adjust the trigger level. 20. Set to 50%. Push to set the trigger level to the midpoint of the waveform. 21. Force Trig. Push to force an immediate trigger event. 56 DPO4000 Series User Manual Get Acquainted with the Instrument 22. Vertical Position. Turn to adjust the vertical position of the corresponding waveform. Push Fine to make smaller adjustments. 23. 1, 2, 3, 4. Push to display or remove the corresponding waveform from the display and access the vertical menu. 24. Vertical Scale. Turn to adjust the vertical scale factor of the corresponding waveform (volts/division). 25. Print. Push to initiate a hard copy using the printer selected in the Utility menu. 26. Power switch. Push to power on or off the instrument. DPO4000 Series User Manual 57 Get Acquainted with the Instrument 27. USB 2.0 host port. Insert a USB cable here to connect peripherals, such as printers and storage devices, to the oscilloscope. There are also two more USB 2.0 host ports on the rear panel. 28. CompactFlash Drive. Insert a CompactFlash card here. 29. CompactFlash Eject. Pops the CompactFlash card out of the CompactFlash drive. 30. Save. Push to perform an immediate save operation. The save operation uses the current save parameters, as defined in the Save / Recall menu. 31. Default Setup. Push to perform an immediate restore of the oscilloscope to the default settings. 32. Menu Off. Push to clear a displayed menu from the screen. 58 DPO4000 Series User Manual Get Acquainted with the Instrument Identifying Items in the Display The items shown to the right may appear in the display. Not all of these items are visible at any given time. Some readouts move outside the graticule area when menus are turned off. DPO4000 Series User Manual 59 Get Acquainted with the Instrument 1. The acquisition readout shows when an acquisition is running, stopped, or when acquisition preview is in effect. Icons are: Run: Acquisitions enabled Stop: Acquisitions not enabled Roll: In roll mode (40 ms/div or slower) PreVu: In this state, the oscilloscope is stopped or between triggers. You can change the horizontal or vertical position or scale to see approximately what the next acquisition will look like. RUN 60 DPO4000 Series User Manual Get Acquainted with the Instrument 2. The trigger position icon shows the trigger position in the acquisition. 3. The expansion point icon (an orange triangle) shows the point that the horizontal scale expands and compresses around. 4. The waveform record view shows the trigger location relative to the waveform record. The line color corresponds to the selected waveform color. DPO4000 Series User Manual 61 Get Acquainted with the Instrument 5. The trigger status readout shows trigger status. Status conditions are: Trig’d: Triggered Auto: Acquiring untriggered signal PrTrig: Acquiring pretrigger data Trig?: Waiting for trigger Trig’d 6. The cursor readout shows time, amplitude, and delta (Δ) values for each cursor. For FFT measurements, it shows frequency and magnitude. 62 DPO4000 Series User Manual Get Acquainted with the Instrument 7. The trigger level icon shows the trigger level on the waveform. The icon color corresponds to the trigger source channel color. 8. The edge trigger readout shows the trigger source, slope, and level. The trigger readouts for other trigger types show other parameters. 9. The top line of the record length/sampling rate readout shows the sampling rate (adjust with the Horizontal Scale knob). The bottom line shows the record length (adjust with the Acquire menu). DPO4000 Series User Manual 63 Get Acquainted with the Instrument 10. The horizontal position/scale readout shows on the top line the horizontal scale (adjust with the Horizontal Scale knob) and on the bottom line the time from the T symbol to the expansion point icon (adjust with the Horizontal Position knob). Use horizontal position to insert added delay between when the trigger occurs and when you actually capture the data. Insert a negative time to capture more pretrigger information. 11. The auxiliary waveform readouts show the vertical and horizontal scale factors of the math or reference waveforms. 12. The channel readout shows the channel scale factor (per division), coupling, and invert status. Adjust with the Vertical Scale knob and the channel 1, 2, 3, or 4 menus. 64 DPO4000 Series User Manual Get Acquainted with the Instrument 13. Measurement readouts show the selected measurements. You can select up to four measurements to display at one time. A symbol appears instead of the expected numerical measurement if a vertical clipping condition exists. Part of the waveform is above or below the display. To obtain a proper numerical measurement, turn the vertical scale and position knobs to make all of the waveform appear in the display. 14. The waveform baseline indicator shows the zero-volt level of a waveform (ignoring the effect of offset). The icon colors correspond to the waveform colors. DPO4000 Series User Manual 65 Get Acquainted with the Instrument Front-Panel Connectors 1. Channel 1, 2, (3, 4). Channel inputs with TekVPI Versatile Probe Interface. 2. Aux In. Trigger level range is adjustable from +8 V to –8 V. The maximum input voltage is 400V peak, 250V RMS. Input resistance is 1 MΩ ± 1% in parallel with 13 pF ±2 pF. 3. PROBE COMP. Square wave signal source to compensate probes. Output voltage: 0 – 2.5V, amplitude ± 1% behind 1k Ω ±2%. Frequency: 1 kHz. 4. Ground. 5. Application Module Slots. 66 DPO4000 Series User Manual Get Acquainted with the Instrument Side-Panel Connector 1. Ground strap connector. This is a receptacle for a grounding strap. DPO4000 Series User Manual 67 Get Acquainted with the Instrument Rear-Panel Connectors 1. Trigger Out. Use the trigger signal output to synchronize other test equipment with your oscilloscope. A LOW to HIGH transition indicates the trigger occurred. The logic level for Vout (HI) is ≥2.5V open circuit; ≥1.0 V into a 50Ω load to ground. The logic level for Vout (LO) is ≤0.7 V into a load of ≤4 mA; ≤0.25 V into a 50Ω load to ground. 2. XGA Out. Use the XGA Video port (DB-15 female connector) to show the oscilloscope display on an external monitor or projector. 3. LAN. Use the LAN (Ethernet) port (RJ-45 connector) to connect the oscilloscope to a 10/100 Base-T local area network. 4. Device. Use the USB 2.0 High speed device port to control the oscilloscope through USBTMC or GPIB with a TEK-USB-488 Adapter. The USBTMC protocol allows USB devices to communicate using IEEE488 style messages. This lets you run your GPIB software applications on USB hardware. 68 DPO4000 Series User Manual Get Acquainted with the Instrument 5. Host. Use the USB 2.0 Full speed host ports (two) to take advantage of USB mass storage devices and printers. 6. Power input. Attach to an AC power line with integral safety ground. (See page 6, Operating Considerations.) DPO4000 Series User Manual 69 Acquire the Signal Acquire the Signal This section describes concepts of and procedures for setting up the oscilloscope to acquire the signal as you want it to. Setting Up Signal Input Use front-panel buttons to set up your instrument to acquire the signal. 1. Connect the P6139A or VPI probe to the input signal source. 70 DPO4000 Series User Manual Acquire the Signal 2. Select the input channel by pushing the front-panel buttons. NOTE. If you are using a probe that does not supply probe encoding (not a P6139A nor a VPI probe), set the attenuation (probe factor) on the oscilloscope side-bezel menu. 3. Push Autoset. DPO4000 Series User Manual 71 Acquire the Signal 4. Push the desired channel button. Then adjust the vertical position and scale. 5. Adjust the horizontal position and scale. The horizontal position determines the number of pretrigger and posttrigger samples. The horizontal scale determines the size of the acquisition window relative to the waveform. You can scale the window to contain a waveform edge, a cycle, several cycles, or thousands of cycles. 72 DPO4000 Series User Manual Acquire the Signal Quick Tip Use the zoom feature to see multiple acquisition cycles in the upper part and a single cycle in the lower part of the display. (See page 163, Managing Long Record Length Waveforms.) Using the Default Setup To return the oscilloscope to its default settings: 1. Push Default Setup. 2. If you change your mind, push Undo Default Setup to undo the last default setup. Undo Default Setup Quick Tip The DPO4000 Technical Reference describes the default setup settings in detail. This manual is available on the accompanying CD or at www.tektronix.com. DPO4000 Series User Manual 73 Acquire the Signal Using Autoset Autoset adjusts the instrument (acquisition, horizontal, trigger, and vertical controls) such that it displays two or three waveform cycles with the trigger near the midlevel. 1. Connect the probe, and then select the input channel. (See page 70, Setting Up Signal Input.) 2. Push Autoset to execute an Autoset. 3. If desired, push Autoset Undo to undo the last Autoset. Undo Autoset 74 DPO4000 Series User Manual Acquire the Signal Quick Tips To position the waveform appropriately, Autoset may change the vertical position. Autoset always sets vertical offset to 0 V. If you use Autoset when no channels are displayed, the instrument turns on channel one (1) and scales it. Acquisition Concepts Before a signal can be displayed, it must pass through the input channel where it is scaled and digitized. Each channel has a dedicated input amplifier and digitizer. Each channel produces a stream of digital data from which the instrument extracts waveform records. Sampling Process Acquisition is the process of sampling an analog signal, converting it into digital data, and assembling it into a waveform record, which is then stored in acquisition memory. Input signal Sampled points Digital values DPO4000 Series User Manual 75 Acquire the Signal Real-time Sampling Record points DPO4000 series oscilloscopes use real-time sampling. In real-time sampling, the instrument digitizes all of the points it acquires using a single trigger event. Sampling rate 76 DPO4000 Series User Manual Acquire the Signal Waveform Record The instrument builds the waveform record through use of the following parameters: Sample interval: The time between recorded sample points. Adjust this by turning the Horizontal Scale knob. Record length: The number of samples required to fill a waveform record. Set this by pushing the Acquire button and using the resulting lower-bezel menu. Trigger point: The zero time reference in a waveform record. It is shown on the screen by an orange T. DPO4000 Series User Manual 77 Acquire the Signal Horizontal position: The time from the trigger point to the expansion point. Adjust this by turning the Horizontal Position knob. Use a positive time to acquire the record after the trigger point. Use a negative time to acquire it before the trigger point. Expansion point: The point that the horizontal scale expands and contracts around. It is shown by an orange triangle. How the Acquisition Modes Work Sample mode retains the first sampled point from each acquisition interval. Sample is the default mode. 78 DPO4000 Series User Manual Acquire the Signal Peak Detect mode uses the highest and lowest of all the samples contained in two consecutive acquisition intervals. This mode only works with real-time, noninterpolated sampling and is useful for catching high frequency glitches. Hi Res mode calculates the average of all the samples for each acquisition interval. This mode also only works with real-time, noninterpolated sampling. Hi-Res provides a higher-resolution, lower-bandwidth waveform. Envelope mode finds the highest and lowest record points over all acquisitions. Envelope uses Peak Detect for each individual acquisition. Average mode calculates the average value for each record point over a user-specified number of acquisitions. Average uses Sample mode for each individual acquisition. Use average mode to reduce random noise. DPO4000 Series User Manual 79 Acquire the Signal Changing the Acquisition Mode and Record Length Use this procedure to change the acquisition mode. 1. Push Acquire. 2. Push Mode. Mode Average Record Length 10k Reset Horizontal Position Waveform Display 80 DPO4000 Series User Manual Acquire the Signal Acquisition Mode Sample Peak Detect Hi Res Envelope 3. Then choose the acquisition mode from the side-bezel menu. You can chose from: Sample, Peak Detect, Hi Res, Envelope, or Average. NOTE. Peak Detect and High Res require more than one sample point per sample interval. If there is only one sample point, these two modes will appear the same as sample mode. Average 16 DPO4000 Series User Manual 81 Acquire the Signal 4. If you chose Average, turn multipurpose knob a to set the number of waveforms to average over. 5. Push Record Length. 6. Push the side-bezel menu, record length button. 1000 points Choose between: 1000, 10 k, 100 k, 1 M, and 10 M points. 82 DPO4000 Series User Manual Acquire the Signal Using Roll Mode Roll mode gives a display similar to a strip chart recorder for low-frequency signals. Roll mode lets you see acquired data points without waiting for the acquisition of a complete waveform record. Roll mode is enabled when the trigger mode is auto and the horizontal scale is set to 40 ms/div or slower. Quick Tips Switching to Envelope or Average acquisition mode, using math waveforms, or switching to normal trigger will disable Roll mode. Roll mode is disabled when you set the horizontal scale to 20 ms per division or faster. Push Run/Stop to halt Roll mode. DPO4000 Series User Manual 83 Acquire the Signal Defining a Serial Bus Your DPO4000 oscilloscope can trigger on I2C and SPI serial buses if the DPO4EMBD application module is installed. It can trigger on CAN serial buses if the DPO4AUTO application module is installed. It can display the physical layer of a bus (as analog waveforms), digital waveforms, and protocol level information (as symbolic waveforms). Plug in the DPO4EMBD application module to use the I2C and SPI features. Plug in the DPO4AUTO application module to use the CAN features. Using buses in two steps To quickly use serial bus triggering: 1. Push B1 or B2 and enter parameters of the bus to trigger on. You can separately use B1 and B2 to view two different buses. 2. Push Trigger Menu and enter trigger parameters. (See page 98, Choosing a Trigger.) You can display bus information without triggering on the bus signal. 84 DPO4000 Series User Manual Acquire the Signal Setting up serial bus parameters To set up bus parameters: 1. Push B1 or B2 to bring up the lower-bezel bus menu. I2C SPI 2. Push Bus as many times as needed to select the desired bus (I2C, SPI, or CAN) from the pop-up menu. CAN DPO4000 Series User Manual 85 Acquire the Signal 3. Push Define Inputs and use the side-bezel buttons to assign oscilloscope channels to the serial bus signal(s). Bus I2C Define Inputs Thresholds Display As Bus Bus Decode Hex For example, with an I2C bus, you might assign channel 1 to supply the SCLK signal and channel 2 to supply the SDA signal. You can assign any channel to a predefined bus signal. For all serial bus sources, use channel 1 to channel 4. Do not use the Aux In input. 4. Push Thresholds. Bus I2C Define Inputs Thresholds Display As Bus Decode 86 DPO4000 Series User Manual Acquire the Signal For each signal that makes up the serial bus, push the appropriate side-bezel menu button. Then turn the appropriate multipurpose knob to define the voltage level above which the oscilloscope treats the signal as high and below which as low. 5. If you selected CAN above, push Bit Rate and the desired side-bezel menu choice. Bus CAN Define Inputs Thresholds Bit Rate 500 Kbps Display As Bus Bus Decode Hex 6. If you selected SPI above, push Polarity and the desired side-bezel menu choice. Bus SPI Define Inputs Thresholds Polarity Display As Bus Bus Decode Hex Active High means when a signal is greater than the threshold value, it is considered a logical 1. Active Low means when the signal is lower than the threshold value, it is considered a logical 1. DPO4000 Series User Manual 87 Acquire the Signal 7. Push Display As and use the side-bezel menu to define how to display the serial bus. Display As Push Bus to display packet level information decoded for easy visual inspection, much like what you would see on a logic analyzer. Bus Push Waveforms to display the digital (high or low) representations of the waveforms. Waveforms Push Bus and Waveforms to display both views of the signal. Bus and Waveforms Push Event Table On to display a list of packets in the bus. Event Table On Off Sample bus information: 88 DPO4000 Series User Manual Acquire the Signal Sample waveforms: Sample event table: 8. Push Bus Decode and the desired side-bezel menu choice to display the bus data in hexadecimal or binary format. 9. Turn multipurpose knob a to move the bus display up or down on the screen. DPO4000 Series User Manual 89 Acquire the Signal You can also trigger on packet level information on your serial bus. (See page 102, Triggering on Buses.) NOTE. To acquire signals from two buses simultaneously, use this procedure once to define the parameters of the B1 bus and again to define the B2 bus. 90 DPO4000 Series User Manual Trigger Setup and Run Trigger Setup and Run This section contains concepts and procedures for setting up the oscilloscope to trigger on your signal. Triggering Concepts Trigger Event The trigger event establishes the time-reference point in the waveform record. All waveform record data is located in time with respect to that point. The instrument continuously acquires and retains enough sample points to fill the pretrigger portion of the waveform record. That is the part of the waveform that is displayed before, or to the left of, the triggering event on screen. When a trigger event occurs, the instrument starts acquiring samples to build the posttrigger portion of the waveform record, that is, the part displayed after or to the right of the trigger event. After a trigger is recognized, the instrument will not accept another trigger until the acquisition is complete and the holdoff time has expired. DPO4000 Series User Manual 91 Trigger Setup and Run Untriggered display Triggered display Trigger Modes The trigger mode determines how the instrument behaves in the absence of a trigger event: Normal trigger mode enables the instrument to acquire a waveform only when it is triggered. If no trigger occurs, the last waveform record acquired remains on the display. If no last waveform exists, no waveform is displayed. Auto trigger mode enables the instrument to acquire a waveform even if a trigger does not occur. Auto mode uses a timer that starts when the acquisition is started, and the pretrigger information is obtained. If a trigger event is not detected before the timer times out, the instrument forces a trigger. The length of time it waits for a trigger event depends on the time base setting. 92 DPO4000 Series User Manual Trigger Setup and Run Auto mode, when forcing triggers in the absence of valid triggering events, does not synchronize the waveform on the display. The waveform will appear to roll across the screen. If valid triggers occur, the display will become stable. You can also force the instrument to trigger by pushing the front-panel Force Trig button. Trigger Holdoff Adjust holdoff to obtain stable triggering when the instrument is triggering on undesired trigger events. Trigger holdoff can help stabilize triggering, since the oscilloscope does not recognize new triggers during the holdoff time. When the instrument recognizes a trigger event, it disables the trigger system until acquisition is complete. In addition, the trigger system remains disabled during the holdoff period that follows each acquisition. Holdoffs DPO4000 Series User Manual 93 Trigger Setup and Run Trigger Coupling Trigger coupling determines what part of the signal is passed to the trigger circuit. Edge triggering can use all available coupling types: DC, Low Frequency Rejection, High Frequency Rejection, and Noise Rejection. All other trigger types use DC coupling only. Horizontal Position Use horizontal position to acquire waveform detail in a region that is separated from the trigger location by a significant interval of time. 94 DPO4000 Series User Manual Trigger Setup and Run 1. Adjust the position (delay) time by rotating the Horizontal Position knob. 2. Turn horizontal SCALE to acquire the detail that you need around the position (delay) expansion point. DPO4000 Series User Manual 95 Trigger Setup and Run The part of the record that occurs before the trigger is the pretrigger portion. The part that occurs after the trigger is the posttrigger portion. Pretrigger data can help you troubleshoot. For example, to find the cause of an unwanted glitch in your test circuit, you can trigger on the glitch and make the pretrigger period large enough to capture data before the glitch. By analyzing what happens before the glitch, you may uncover information that helps you find the source of the glitch. Alternatively, to see what is happening in your system as a result of the trigger event, make the posttrigger period large enough to capture data after the trigger. Slope and Level The slope control determines whether the instrument finds the trigger point on the rising or the falling edge of a signal. The level control determines where on that edge the trigger point occurs. The DPO4000 provides a long horizontal bar or bars across the graticule to temporarily show the trigger level. 96 DPO4000 Series User Manual Trigger Setup and Run 1. Turn the front-panel Trigger Level knob to adjust the trigger level without going to a menu. 2. Push the front-panel Set to 50% button to quickly set the trigger level to the midpoint of the waveform. Delayed Trigger System Trigger with the A (Main) trigger system alone or, if using an edge trigger, combine the A (Main) trigger with the B (Delayed) trigger to trigger on sequential events. When using sequential triggering, the A trigger event arms the trigger system, and the B trigger event triggers the instrument when the B trigger conditions are met. A and B triggers can (and typically do) have separate sources. The B trigger condition can be based on a time delay or a specified number of events. (See page 107, Using A (Main) and B (Delayed) Triggers.) DPO4000 Series User Manual 97 Trigger Setup and Run Choosing a Trigger To select a trigger: 1. Push Trigger Menu. Edge Pulse Width Runt Logic Setup & Hold Rise/Fall Time Video 2. Push Type repeatedly to select the trigger type to use. NOTE. The bus trigger requires use of the DPO4EMBD or the DPO4AUTO application module. Bus 98 DPO4000 Series User Manual Trigger Setup and Run 3. Complete the trigger setup using the lower-bezel menu controls displayed for the trigger type. The controls to set up the trigger vary depending on the trigger type. Type Edge Source 1 Coupling DC Slope Level 100 mV Mode Auto & Holdoff Configure B Trigger Selecting Triggers Trigger Type Trigger Conditions Edge Trigger on a rising or falling edge, as defined by the slope control. Coupling choices are DC, LF Reject, HF Reject, and Noise Reject. Edge triggers are the simplest and most commonly used trigger type, with both analog and digital signals. An edge trigger event occurs when the trigger source passes through a specified voltage level in the specified direction. DPO4000 Series User Manual 99 Trigger Setup and Run Trigger Type Trigger Conditions Pulse/Width Trigger on pulses that are less than, greater than, equal to, or not equal to a specified time. You can trigger on positive or negative pulses. Pulse/width triggers are primarily used on digital signals. Runt Trigger on a pulse amplitude that crosses one threshold but fails to cross a second threshold before recrossing the first. You can detect positive or negative (or either) runts, or only those wider than, less than, greater than, equal to, or not equal to a specified width. Runt triggers are primarily used on digital signals. Logic Logic triggers are primarily used with digital signals. You can set each input to high, low, or don’t care. In addition, you can use one channel as a clock source set to either the rising or falling edge. Trigger when logic inputs cause the selected function to become True or False. You can also specify that the logic conditions be satisfied for a specific amount of time before triggering. 100 DPO4000 Series User Manual Trigger Setup and Run Trigger Type Trigger Conditions Setup and Hold Violation Trigger when a logic data input changes state inside of the setup or hold time relative to a clock edge. Setup is the amount of time that data should be stable and not change before a clock edge occurs. Hold is the time that data should be stable and not change after a clock edge occurs. Rise/Fall Time Trigger on rise and fall times. Trigger on pulse edges that traverse between two thresholds at faster or slower rates than the specified time. Specify pulse edges as positive or negative or either. Video Trigger on specified fields or lines of a composite video signal. Only composite signal formats are supported. Trigger on NTSC, PAL, or SECAM.Works with Macrovision signals. DPO4000 Series User Manual 101 Trigger Setup and Run Trigger Type Trigger Conditions Bus Optional: Trigger on common, serial-bus, packet-level information with the following application modules: DPO4EMBD — I2C and SPI DPO4AUTO — CAN Triggering on Buses You can use your DPO4000 oscilloscope to trigger on CAN, I2C, and SPI buses, if you have the DPO4AUTO or the DPO4EMBD application module installed. The DPO4000 can display both physical layer (as analog waveforms ) and protocol level information (as digital and symbolic waveforms). To set up the bus trigger: 1. If you have not already defined your bus using the front-panel B1 or B2 buttons, do so now. (See page 84, Defining a Serial Bus.) 102 DPO4000 Series User Manual Trigger Setup and Run 2. Push Trigger Menu. Bus 3. Push and keep pushing the Type button of the lower-bezel menu until you select Bus. Type Bus Source Bus B1 (I2C) Trigger On Address Address 07F Direction Write Mode Auto & Holdoff DPO4000 Series User Manual 103 Trigger Setup and Run 4. Push and keep pushing the Source Bus B1 (I2C) button of the lower-bezel menu until you select the bus that you want to trigger on. B2 (I2C) 5. Push and keep pushing the lower-bezel menu Trigger On button until you select the desired trigger on feature. If you are using the I2C bus trigger, you can trigger on Start, Repeated Start, Stop, Missing Ack, Address, Data, or Address/Data. If you are using the SPI bus trigger, you can trigger on SS Active, MOSI, MISO, or MOSI & MISO. If you are using the CAN bus trigger, you can trigger on Start of Frame, Type of Frame, Identifier, Data, Id & Data, End of Frame, and Missing Ack. 104 DPO4000 Series User Manual Trigger Setup and Run 6. If you are setting up an I2C trigger and have selected a Trigger On selection of Address or Address/Data, push the lower-bezel menu Address button to access the Address side-bezel menu. Press the side-bezel menu Address button. Enter the address parameters of interest with multipurpose knobs a and b. Then push the lower-bezel menu Direction button to enter the direction of interest. Choices are: Read, Write, and Read or Write. DPO4000 Series User Manual 105 Trigger Setup and Run Bus Trigger Data Matching Rolling window byte matching for I2C and SPI. You can use a rolling window to trigger on data with SPI and I2C buses. You define the number of bytes to match. Then the oscilloscope uses a rolling window to find any match within a packet, with the window rolling one byte at a time. For example, if the number of bytes is one, the oscilloscope will match the first byte, second byte, third, and so on within the packet. If the number of bytes is two, the oscilloscope will try to match any two consecutive bytes, such as one and two, two and three, three and four, and so on. If the oscilloscope finds a match, it will then trigger. Specific byte matching (non-rolling window matching) for CAN, I2C, and SPI. You can trigger on a specific byte for SPI and I2C in two ways: For I2C and SPI, enter the number of bytes to match the number of bytes in the signal. Then use don’t cares (X) to mask the bytes that you are not interested in. For I2C, push the bottom-bezel Trigger On to trigger on Address/Data. Push Address. On the side-bezel menu, push Address and rotate multipurpose knobs a and b as needed. Set the address to don’t cares (X) if you want to mask the address. The data will be matched starting at the first byte without using a rolling window. For CAN, triggering occurs when the user-selected data input matches the data and qualifier in the signal starting at the first byte. Set the number of bytes to match the number of bytes of interest. Use the data qualifier to perform: =, !=, <, >, >=, and <= operations. Triggering on identifier and data always matches the identifier and data selected by the user, with the data starting at the first byte. No rolling window is used. 106 DPO4000 Series User Manual Trigger Setup and Run Checking Trigger Status To quickly determine the settings of some key trigger parameters, check the Trigger readout at the bottom of the display. The readouts differ for edge and the advanced triggers. 1. Trigger source = channel 1. 2. Trigger slope = rising. 3. Trigger level = 0.00 V. Edge trigger readout Using A (Main) and B (Delayed) Triggers Combine an edge A Event (Main) trigger with the B Event (Delayed) trigger to capture more complex signals. After the A Event occurs, the trigger system looks for the B Event before triggering and displaying the waveform. To use the B trigger: 1. Push Trigger Menu. DPO4000 Series User Manual 107 Trigger Setup and Run 2. Press Type repeatedly to select a trigger type of Edge. 3. Push Configure B Trigger. This brings up the B trigger menu. The B Trigger Setup item only appears if the A trigger is set to edge trigger. Type Edge Source 1 Coupling DC Slope Level 0.00 V Mode Auto & Holdoff Configure B Trigger 4. Set the B trigger parameters as defined in the B trigger lower-bezel and side-bezel menu items. B Trigger On B Trigger After A Time Source 1 Coupling DC Slope Level 0.00V Configure A Trigger 108 DPO4000 Series User Manual Trigger Setup and Run Trigger on B Event The A trigger arms the instrument. Posttrigger acquisition starts on the nth B event. DPO4000 Series User Manual 109 Trigger Setup and Run B Trigger After Delay Time The A trigger arms the instrument. Posttrigger acquisition starts on the first B edge after the trigger delay time. Quick Tips B-trigger delay time and horizontal position are independent functions. When you establish a trigger condition using either the A trigger alone or the A and B triggers together, you can also use horizontal position to delay the acquisition by an additional amount. When using the B trigger, the A and B trigger types can only be Edge. 110 DPO4000 Series User Manual Trigger Setup and Run Starting and Stopping an Acquisition After you have defined the acquisition and trigger parameters, start the acquisition with Run/Stop or Single. Push Run/Stop to start the acquisition. Push it again to stop the acquisition. Push Single to take a single acquisition. Single sets the trigger mode to Normal for the single acquisition. DPO4000 Series User Manual 111 Display Waveform Data Display Waveform Data This section contains concepts and procedures for displaying the acquired waveform. Adding and Removing a Waveform 1. To add or remove an active waveform from the display, push the relevant front-panel channel button. You can use the channel as a trigger source whether or not it is displayed. Setting the Display Style and Persistence 1. To set the display style, push Acquire. 112 DPO4000 Series User Manual Display Waveform Data 2. Push Waveform Display. Mode Sample Record Length 10k Reset Horizontal Position Waveform Display DPO4000 Series User Manual 113 Display Waveform Data 3. Push Dots Only On Off from the side-bezel menu. Dots on will display the waveform record points as dots on the screen. Dots off connects the dots with vectors. Waveform Display Dots Only On Off 4. Push Persist Time, and turn multipurpose knob a to have waveform data remain on screen for a user-specified amount of time. Persist Time a Auto 5. Push Set to Auto to have the oscilloscope automatically determine a persistence time for you. Set to Auto 6. Push Clear Persistence to reset the persistence information. Clear Persistence 114 DPO4000 Series User Manual Display Waveform Data Quick Tips Variable persistence accumulates record points for a specified time interval. Each record point decays independently according to the time interval. Use variable persistence for displaying infrequently appearing signal anomalies, such as glitches. Infinite persistence continuously accumulates record points until you change one of the acquisition display settings. Use infinite persistence for displaying unique signal anomalies, such as glitches. Setting Waveform and Graticule Intensity 1. Push the front-panel Intensity button. This will bring up the intensity readout on the display. DPO4000 Series User Manual 115 Display Waveform Data 2. Rotate multipurpose knob a to select the desired waveform intensity. 3. Rotate multipurpose knob b to select the desired intensity for the graticule and text. 4. Push Intensity again to clear the intensity readout from the display. 116 DPO4000 Series User Manual Display Waveform Data Setting the Graticule Style 1. To set the graticule style, push Utility. 2. Push System repeatedly until you select Display from the pop-up menu. Display 3. Push Graticule from the lower-bezel menu. System Display Backlight Intensity High Graticule Full DPO4000 Series User Manual 117 Display Waveform Data 4. Select the desired style from the resulting side-bezel menu. Use the Full graticule for quick estimates of waveform parameters. Use the Grid graticule for full-screen measurements with cursors and automatic readouts when cross hairs are not needed. Use the Cross Hair graticule for making quick estimates of waveforms while leaving more room for automatic readouts and other data. Use the Frame graticule with automatic readouts and other screen text when display features are not needed. Setting the LCD Backlight 1. Push Utility. 118 DPO4000 Series User Manual Display Waveform Data 2. Push System repeatedly until you select Display. Display 3. Push Backlight Intensity. System Display Backlight Intensity High Graticule Full Backlight Intensity High Medium 4. Select the intensity level from the resulting side-bezel menu. Choices are: High, Medium, and Low. Low DPO4000 Series User Manual 119 Display Waveform Data Scaling and Positioning a Waveform Use the horizontal controls to adjust the time base, adjust the trigger point, and to examine waveform details more closely. Original waveform Scaled horizontally Positioned horizontally 120 DPO4000 Series User Manual Display Waveform Data Use the vertical controls to select waveforms, adjust the waveform vertical position and scale, and set input parameters. Push a channel button (1, 2, 3, or 4), the MATH button, or the REF button or the B1 or B2 button as many times as needed and the associated menu items to select, add, or remove a waveform. Original waveform Scaled vertically Positioned vertically Quick Tips Preview. If you change the Position or Scale controls when the acquisition is stopped or when it is waiting for the next trigger, the oscilloscope rescales and repositions the relevant waveforms in response to the new control settings. It simulates what you will see when you next push the RUN button. The oscilloscope uses the new settings for the next acquisition. You may see a clipped waveform if the original acquisition went off the screen. The math waveform, cursors, and automatic measurements remain active and valid when using preview. DPO4000 Series User Manual 121 Display Waveform Data Setting Input Parameters Use the vertical controls to select waveforms, adjust the waveform vertical position and scale, and set input parameters. 1. Push channel button 1, 2, 3, or 4 to bring up the vertical menu for the designated waveform. The vertical menu only affects the selected waveform. Pushing a channel button will also select or cancel that waveform selection. 2. Push Coupling. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1X 122 DPO4000 Series User Manual Display Waveform Data 3. Push DC, AC, or GND (ground). Use DC coupling to pass both AC and DC components. DC Use AC coupling to block the DC component and show only the AC signal. AC Use Ground (GND) to display the reference potential. GND 4. Push Ω. Ω 1M 50 Set the input impedance (termination) to 50 Ω or 1 MΩ if using DC or Gnd coupling. Input impedance is automatically set to 1 MΩ when using AC coupling. For more information on input impedance, see Quick Tips below. DPO4000 Series User Manual 123 Display Waveform Data 5. Push Invert to invert the signal. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1X Select Invert Off for normal operation and Invert On to invert the polarity of the signal in the preamplifier. 6. Push Bandwidth, and select the desired bandwidth from the resulting side-bezel menu. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X The set choices are: Full, 250 MHz, and 20 MHz. Additional choices may appear, depending on the probe that you use. Select Full to set the bandwidth to the full oscilloscope bandwidth. Select 250 MHz to set the bandwidth to 250 MHz. Select 20 MHz to set the bandwidth to 20 MHz. 124 DPO4000 Series User Manual Display Waveform Data 7. Push Fine Scale to enable multipurpose knob a to make fine vertical scale adjustments. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X 8. Push Offset to enable multipurpose knob a to make vertical offset adjustments. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X On the side-bezel menu, choose Set to 0 V to set the vertical offset to 0 V. For more information on offset, see the Quick Tips below. DPO4000 Series User Manual 125 Display Waveform Data 9. Push Position to enable multipurpose knob a to make vertical position adjustments. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X NOTE. You can also use the position knob on the front panel to do this. On the side-bezel menu, choose Set to 0 divs to set the vertical position to the center of the screen. For more information on vertical position, see the Quick Tips below. 126 DPO4000 Series User Manual Display Waveform Data 10. Push Probe Setup to define probe parameters. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X On the resulting side-bezel menu: Select Voltage Probe or Current Probe to set the probe gain or attenuation for probes that do not have the TekProbe II or TekVPI interface. Push Deskew to set the time skew correction to zero. Turn multipurpose knob a to adjust the time skew (deskew) correction for the probe attached to the selected channel. This shifts acquisition and display of the waveform left or right, relative to the trigger time. Use this to compensate for differences in cable lengths or probe types. Select Attenuation to choose the probe attenuation. DPO4000 Series User Manual 127 Display Waveform Data Quick Tips Using Probes with the TekProbe II and TekVPI Interfaces. When you attach a probe with the TekProbe II or the TekVPI interface, the oscilloscope sets the channel sensitivity, coupling, and termination resistance automatically to match the probe requirements. Tek Probe II probes require use of the TPA-BNC Adapter. The Difference Between Vertical Position and Offset. Vertical position is a display function. Adjust the vertical position to place the waveforms where you want to see them. The waveform baseline locations track adjustments made to their positions. When you adjust vertical offset, you see a similar effect, but it is actually quite different. Vertical offset is applied before the oscilloscope preamplifier and can be used to increase the effective dynamic range of the inputs. For example, you can use vertical offset to look at small variations in a large DC voltage. Set the vertical offset to match the nominal DC voltage and the signal appears in the center of the screen. 50 Ω Protection. If you select 50 Ω termination, the maximum vertical scale factor is limited to 1 V/div. If you apply excessive input voltage, the oscilloscope automatically switches to 1 M Ω termination to protect the internal 50 Ω termination. For more details, refer to the specifications in the DPO4000 Technical Reference. 128 DPO4000 Series User Manual Analyze Waveform Data Analyze Waveform Data After having properly set up the acquisition, triggering, and display of your desired waveform, you can then analyze the results. Select from features such as cursors, automatic measurements, statistics, math, and FFT. Taking Automatic Measurements To take an automatic measurement: 1. Push Measure. 2. Push Select Measurement. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 129 Analyze Waveform Data 3. Turn multipurpose knob a to select the channel from which you want to measure. This step is only needed if you are acquiring data on more than one channel. 4. Select the specific measurement or measurements from the side-bezel menu. 5. To remove a measurement, push Remove Measurement and the specific measurement from the resulting side-bezel menu. Quick Tips To remove all measurements, select Remove All. A symbol appears instead of the expected numerical measurement if a vertical clipping condition exists. Part of the waveform is above or below the display. To obtain a proper numerical measurement, turn the vertical scale and position knobs to make all of the waveform appear in the display. 130 DPO4000 Series User Manual Analyze Waveform Data Selecting Automatic Measurements The following tables list each automatic measurement by category: amplitude or time. (See page 129, Taking Automatic Measurements.) Time Measurements Measurement Description Period The time required to complete the first cycle in a waveform or gated region. Period is the reciprocal of frequency and is measured in seconds. Frequency The first cycle in a waveform or gated region. Frequency is the reciprocal of the period; it is measured in hertz (Hz) where one Hz is one cycle per second. Delay The time between the mid reference (default 50%) amplitude point of two different waveforms. See also Phase. Rise Time The time required for the leading edge of the first pulse in the waveform or gated region to rise from the low reference value (default = 10%) to the high reference value (default = 90%) of the final value. Fall Time The time required for the falling edge of the first pulse in the waveform or gated region to fall from the high reference value (default = 90%) to the low reference value (default = 10%) of the final value. Positive Duty Cycle The ratio of the positive pulse width to the signal period expressed as a percentage. The duty cycle is measured on the first cycle in the waveform or gated region. DPO4000 Series User Manual 131 Analyze Waveform Data Time Measurements (cont.) Measurement Description Negative Duty Cycle The ratio of the negative pulse width to the signal period expressed as a percentage. The duty cycle is measured on the first cycle in the waveform or gated region. Positive Pulse Width The distance (time) between the mid reference (default 50%) amplitude points of a positive pulse. The measurement is made on the first pulse in the waveform or gated region. Negative Pulse Width The distance (time) between the mid reference (default 50%) amplitude points of a negative pulse. The measurement is made on the first pulse in the waveform or gated region. Burst Width The duration of a burst (a series of transient events) and is measured over the entire waveform or gated region. Phase The amount of time that one waveform leads or lags another waveform, expressed in degrees where 360° comprises one waveform cycle. See also Delay. 132 DPO4000 Series User Manual Analyze Waveform Data Amplitude Measurements Measurement Description Positive Overshoot This is measured over the entire waveform or gated region and is expressed as: Positive Overshoot = (Maximum – High) / Amplitude x 100%. Negative Overshoot This is measured over the entire waveform or gated region and is expressed as: Negative Overshoot = (Low – Minimum) / Amplitude x 100%. DPO4000 Series User Manual 133 Analyze Waveform Data Amplitude Measurements (cont.) Measurement Description Pk-Pk The absolute difference between the maximum and minimum amplitude in the entire waveform or gated region. Amplitude The high value less the low value measured over the entire waveform or gated region. High This value is used as 100% whenever high reference, mid reference, or low reference values are needed, such as in fall time or rise time measurements. Calculate using either the min/max or histogram method. The min/max method uses the maximum value found. The histogram method uses the most common value found above the midpoint. This value is measured over the entire waveform or gated region. Low This value is used as 0% whenever high reference, mid reference, or low reference values are needed, such as in fall time or rise time measurements. Calculate using either the min/max or histogram method. The min/max method uses the minimum value found. The histogram method uses the most common value found below the midpoint. This value is measured over the entire waveform or gated region. Max The most positive peak voltage. Max is measured over the entire waveform or gated region. Min The most negative peak voltage. Min is measured over the entire waveform or gated region. 134 DPO4000 Series User Manual Analyze Waveform Data Amplitude Measurements (cont.) Measurement Description Mean The arithmetic mean over the entire waveform or gated region. Cycle Mean The arithmetic mean over the first cycle in the waveform or the first cycle in the gated region. RMS The true Root Mean Square voltage over the entire waveform or gated region. Cycle RMS The true Root Mean Square voltage over the first cycle in the waveform or the first cycle in the gated region. DPO4000 Series User Manual 135 Analyze Waveform Data Miscellaneous Measurements Measurement Description Area Area measurement is a voltage over time measurement. It returns the area over the entire waveform or gated region in volt-seconds. Area measured above ground is positive; area measured below ground is negative. Cycle Area A voltage over time measurement. The measurement is the area over the first cycle in the waveform or the first cycle in the gated region expressed in volt-seconds. The area above the common reference point is positive while the area below the common reference point is negative. 136 DPO4000 Series User Manual Analyze Waveform Data Customizing an Automatic Measurement You can customize automatic measurements by using gating, modifying measurement statistics, adjusting the measurement reference levels, or taking a snapshot. Gating Gating confines the measurement to a certain portion of a waveform. To use: 1. Push Measure. 2. Push Gating. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 137 Analyze Waveform Data 3. Position the gates from the side-bezel menu options. Gating Off (Full record) Screen Between cursors Bring cursors on screen 138 DPO4000 Series User Manual Analyze Waveform Data Statistics Statistics characterize the stability of measurements. To adjust statistics: 1. Push Measure. 2. Push Statistics. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 139 Analyze Waveform Data Measurement Statistics On Off Mean & Std Dev Samples a 32 3. Push the side-bezel menu options. These include whether to turn statistics on or off and how many samples to use for mean and standard deviation calculations. Reset Statistics Snapshot To see all the single-sourced measurements at one moment in time: 1. Push Measure. 140 DPO4000 Series User Manual Analyze Waveform Data 2. Push Select Measurement. Select measurement Remove Measurement Gating Off Statistics Off High-Low Setup Reference Levels Indicators Off 3. Push Snapshot All Measurements. Snapshot All Measurements 4. View results. Snapshot on 1 Period: 588.0 ns Freq: 1.701 MHz +Width: 529.7 ns -Width: 58.33 ns BrstW: 39.91 μs Rise: 2.014 μs Fall: 1.522 μs ... ... ... ... DPO4000 Series User Manual 141 Analyze Waveform Data Reference Levels Reference levels determine how time-related measurements are taken. For example, they are used in calculating rise and fall times. 1. Push Measure. 2. Push Reference Levels. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 142 DPO4000 Series User Manual Analyze Waveform Data 3. Set the levels from the side-bezel menu. Reference Levels Set Levels in % units Use High and Low reference to calculate rise and fall times. High Ref a 90.0 % Use Mid reference primarily for measurements between edges such as pulse widths. Mid Ref a 50.0 % b 50.0 % Low Ref a 10.0 % - more - 1 of 2 DPO4000 Series User Manual 143 Analyze Waveform Data Taking Manual Measurements with Cursors Cursors are on-screen markers that you position in the waveform display to take manual measurements on acquired data. They appear as horizontal and/or as vertical lines. To use cursors: 1. Push Cursors. This changes the cursor state. The three states are: No cursors appear on the screen, Two vertical waveform cursors appear. They are attached to the selected waveform Four screen cursors appear. Two are vertical and two are horizontal. They are no longer specifically attached to a waveform For example, the first time you push Cursors the state might be off. 144 DPO4000 Series User Manual Analyze Waveform Data 2. Push Cursors again. In the example, two vertical cursors appear on the selected screen waveform. As you turn multipurpose knob a, you move one cursor to the right or left. As you turn knob b, you move the other cursor. If you change the selected waveform by pushing the front-panel 1, 2, 3, 4, M or R button, both cursors jump to the new selected waveform. 3. Push Select. This turns the cursor linking on and off. If linking is on, turning multipurpose knob a moves the two cursors together. Turning multipurpose knob b adjusts the time between the cursors. DPO4000 Series User Manual 145 Analyze Waveform Data 4. Push Fine to toggle between a coarse or a fine adjustment for multipurpose knobs a and b. Pushing Fine also changes the sensitivity of other knobs as well. 5. Push Cursors again. This will put the cursors into screen mode. Two horizontal bars and two vertical bars span the graticule. 6. Turn multipurpose knobs a and b to move the pair of horizontal cursors. 146 DPO4000 Series User Manual Analyze Waveform Data 7. Push Select. This makes the vertical cursors active and the horizontal ones inactive. Now, as you turn the multipurpose knobs, the vertical cursors will move. Push Select again to make the horizontal cursors active again. 8. View the cursor and the cursor readout. DPO4000 Series User Manual 147 Analyze Waveform Data 9. Push Cursors again. This will turn off the cursor mode. The screen will no longer display the cursors and the cursor readout. 148 DPO4000 Series User Manual Analyze Waveform Data Using cursor readouts Cursor readouts supply textual and numeric information relating to the current cursor positions. Readouts appear in the upper right corner of the graticule. If Zoom is on, the readout appears in the upper right corner of the zoom window. The oscilloscope always shows the readouts when the cursors are turned on. When a bus is the currently selected waveform, the readout is the decoded bus data in whatever format you have selected (hexadecimal or binary). Δ Readout: The Δ readouts indicate the difference between the cursor positions. a Readout: Indicates the value is controlled by multipurpose knob a. b Readout: Indicates the value is controlled by multipurpose knob b. The horizontal cursor lines on the display measure the vertical parameters, typically voltage. DPO4000 Series User Manual 149 Analyze Waveform Data The vertical cursor lines on the display measure horizontal parameters, typically time. Using Math Waveforms Create math waveforms to support the analysis of your channel and reference waveforms. By combining and transforming source waveforms and other data into math waveforms, you can derive the data view that your application requires. Use the following procedure for executing simple (+, –, *, ÷) math operations on two waveforms: 1. Push Math. 150 DPO4000 Series User Manual Analyze Waveform Data 2. Push Dual Wfm Math. Dual Wfm Math FFT Advanced Math 3. On the side-bezel menu, set the sources to either channel 1, 2, 3, 4, or reference waveforms R1, 2, 3, or 4. Choose the +, –, x, or ÷ operators. 4. For example, you might calculate power by multiplying a voltage waveform and a current waveform. DPO4000 Series User Manual 151 Analyze Waveform Data Quick Tips Math waveforms can be created from channel or reference waveforms or a combination of them. Measurements can be taken on math waveforms in the same way as on channel waveforms. Math waveforms derive their horizontal scale and position from the sources in their math expressions. Adjusting these controls for the source waveforms also adjusts the math waveform. You can zoom in on math waveforms using the inner knob of the Pan-Zoom control. Use the outer knob for positioning the zoomed area. (See page 163, Managing Long Record Length Waveforms.) 152 DPO4000 Series User Manual Analyze Waveform Data Using FFT An FFT breaks down signals into component frequencies, which the oscilloscope uses to display a graph of the frequency domain of a signal, as opposed to the oscilloscope’s standard time domain graph. You can match these frequencies with known system frequencies, such as system clocks, oscillators, or power supplies. 1. Push Math. 2. Push FFT. Dual Wfm Math FFT Advanced Math DPO4000 Series User Manual 153 Analyze Waveform Data 3. Push the side-bezel menu FFT Source button repeatedly to select the source to use. Choices are: channels 1, 2, 3, 4, reference waveforms 1, 2, 3, and 4. Math Definition FFT Source 1 4. Push the side-bezel Vertical Scale button repeatedly to select either Linear RMS or dBV RMS. Vertical Scale Linear RMS 5. Push the side-bezel Window button repeatedly to select the desired window. Window choices are: Rectangular, Hamming, Hanning, and Blackman-Harris. Window Hanning 6. Push the side-bezel Horizontal button to activate multipurpose knobs a and b to pan and zoom the FFT display. Horizontal 0.00 Hz 40.0 154 DPO4000 Series User Manual Analyze Waveform Data 7. The FFT will appear on the display. Quick Tips Use short record lengths for faster instrument response. Use long record lengths to lower the noise relative to the signal and increase the frequency resolution. DPO4000 Series User Manual 155 Analyze Waveform Data If desired, use the zoom feature along with the horizontal Position and Scale controls to magnify and position the FFT waveform. Use the default dBV RMS scale to see a detailed view of multiple frequencies, even if they have very different amplitudes. Use the linear RMS scale to see an overall view of how all frequencies compare to each other. The FFT feature provides four windows. Each is a trade-off between frequency resolution and magnitude accuracy. What you want to measure and your source signal characteristics help determine which window to use. Use the following guidelines to select the best window. Description Window Rectangular This is the best type of window for resolving frequencies that are very close to the same value but worst for accurately measuring the amplitude of those frequencies. It is the best type for measuring the frequency spectrum of nonrepetitive signals and measuring frequency components near DC. Use Rectangular for measuring transients or bursts where the signal level before and after the event are nearly equal. Also, use this window for equal-amplitude sine waves with frequencies that are very close and for broadband random noise with a relatively slow varying spectrum. Hamming This is a very good window for resolving frequencies that are very close to the same value with somewhat improved amplitude accuracy over the rectangular window. It has a slightly better frequency resolution than the Hanning. Use Hamming for measuring sine, periodic, and narrow band random noise. This window works on transients or bursts where the signal levels before and after the event are significantly different. 156 DPO4000 Series User Manual Analyze Waveform Data Description Window Hanning This is a very good window for measuring amplitude accuracy but less so for resolving frequencies. Use Hanning for measuring sine, periodic, and narrow band random noise. This window works on transients or bursts where the signal levels before and after the event are significantly different. Blackman-Harris: This is the best window for measuring the amplitude of frequencies but worst at resolving frequencies. Use Blackman-Harris for measuring predominantly single frequency waveforms to look for higher order harmonics. Using Advanced Math The advanced math feature lets you create a custom math waveform expression that can incorporate active and reference waveforms, measurements, and/or numeric constants. To use this feature: 1. Push Math. DPO4000 Series User Manual 157 Analyze Waveform Data 2. Push Advanced Math. Dual Wfm Math FFT Advanced Math 3. Use the side-bezel menu buttons to create custom expressions. 4. Push Edit Expression and use the multipurpose knobs and the resulting lower-bezel buttons to create an expression. When done, push the side-bezel menu OK Accept button. 158 DPO4000 Series User Manual Analyze Waveform Data For example, to use Edit Expression to take the integral of a square wave: 1. Push the lower-bezel Clear button 2. Turn multipurpose knob a to select INTG( 3. Push Enter Selection 4. Turn multipurpose knob a to select channel 1 5. Push Enter Selection 6. Turn multipurpose knob a to select ) 7. Push OK Accept. DPO4000 Series User Manual 159 Analyze Waveform Data Using Reference Waveforms Create a reference waveform to store a waveform. For example, you might do this to set up a standard against which to compare other waveforms. To use the reference waveforms: 1. Push Ref R. This brings up the lower-bezel reference menu. 2. Use the resulting lower-bezel menu selections to display or select a reference waveform. R 1 (On) 25–Oct- 2006 R 2 (Off) R 3 (Off) R 4 (Off) 160 DPO4000 Series User Manual Analyze Waveform Data 3. Use the side-bezel menu and the multipurpose knobs to adjust the vertical and horizontal settings of the reference waveform. R1 Vertical a 0.00 div b 100 mV/div Horizontal 0.00 s 4.00 μs/div Quick Tips Selecting and Displaying Reference Waveforms. You can display all the reference waveforms at the same time. Push the appropriate screen button to select a particular reference waveform. The selected waveform appears brighter than other displayed reference waveforms. Removing Reference Waveforms from the Display. To remove a reference waveform from the display, push the front-panel R button to access the lower-bezel menu. Then push the associated button from the lower-bezel menu to turn it off. Scaling and Positioning a Reference Waveform. You can position and scale a reference waveform independently from all other displayed waveforms. Select the reference waveform and then adjust it with a multipurpose knob. You can do this whether acquisition is running or not. DPO4000 Series User Manual 161 Analyze Waveform Data If a reference waveform is selected, scaling and repositioning of the reference waveform operates the same way whether zoom is turned on or off. Saving 10M Reference Waveforms. 10M reference waveforms are volatile and not saved when the oscilloscope power is turned off. To keep these waveforms, save them to external storage. Recalling Reference Waveforms from External Storage. 162 DPO4000 Series User Manual Analyze Waveform Data Managing Long Record Length Waveforms The DPO4000 Series Wave Inspector controls (zoom/pan, play/pause, marks, search) help you to efficiently work with long record length waveforms. To magnify a waveform horizontally, rotate the Zoom knob. To scroll through a zoomed waveform, rotate the Pan knob. The Pan-Zoom Control consists of: 1. An outer pan knob 2. An inner zoom knob DPO4000 Series User Manual 163 Analyze Waveform Data Zooming a Waveform To use zoom: 1. Rotate the inner knob on the Pan-Zoom control clockwise to zoom in on a selected portion of the waveform. Rotate the knob counterclockwise to zoom back out. 2. Alternatively, enable or disable the zoom mode by pushing the zoom button. 164 DPO4000 Series User Manual Analyze Waveform Data 3. Examine the zoomed view of the waveform that appears on the larger, lower portion of the display. The upper portion of the display will show the position and size of the zoomed portion in the waveform, within the context of the overall record. DPO4000 Series User Manual 165 Analyze Waveform Data Panning a Waveform While the zoom feature is on, you can use the pan feature to quickly scroll through the waveform. To use pan: 1. Rotate the pan (outer) knob of the pan-zoom controls to pan the waveform. Turn the knob clockwise to pan forward. Turn it counterclockwise to pan backwards. The further you turn the knob, the faster the zoom window pans. 166 DPO4000 Series User Manual Analyze Waveform Data Playing and Pausing a Waveform Use the play-pause feature to automatically pan through a waveform record. To use it: 1. Enable the play-pause mode by pushing the play-pause button. 2. Adjust the play speed by turning the pan (outer) knob further. The further you turn it, the faster it goes. DPO4000 Series User Manual 167 Analyze Waveform Data 3. Change the play direction by reversing the direction that you are turning the pan knob. 4. During play, up to a point, the more you turn the ring, the faster the waveform accelerates. If you rotate the ring as far as it can go, the play speed does not change, but the zoom box quickly moves in that direction. Use this maximum rotation feature to replay a portion of the waveform that you just saw and want to see again. 5. Pause the play-pause feature by pushing the play-pause button again. 168 DPO4000 Series User Manual Analyze Waveform Data Searching and Marking Waveforms You can mark locations of interest in the acquired waveform. These marks help you limit your analysis to particular regions of the waveform. You can mark areas of the waveform automatically, if they meet some special criteria, or you can manually mark each item of interest. You can use arrow keys to jump from mark to mark (area of interest to area of interest). You can automatically search and mark many of the same parameters that you can trigger on. Search marks provide a way to mark a waveform region for reference. You can set marks automatically with search criteria. You can search for and mark regions with particular edges, pulse widths, runts, logic states, rise/fall times, setup and hold, and bus search types. To manually set and clear (delete) marks: 1. Move (the zoom box) to the area on the waveform where you want to set (or clear) a search mark by turning the pan (outer) knob. Push the next ( →) or previous (←) arrow button to jump to an existing mark. 2. Push Set/Clear. If no search mark is at the screen center, the oscilloscope will add one. DPO4000 Series User Manual 169 Analyze Waveform Data 3. Now investigate your waveform by moving from search mark to search mark. Use the next ( →) or previous (←) arrow button to jump from one marked location to another, without adjusting any other controls. 4. Delete a mark. Push the next ( →) or previous (←) arrow button to jump to the mark you want to clear. To remove the current, center-positioned mark, just push Set/Clear. It works on both manually and automatically created marks. To automatically set and clear (delete) search marks: 1. Push Search. 170 DPO4000 Series User Manual Analyze Waveform Data 2. Select the search type desired from the lower-bezel menu. Search Off Search Type Edge Source 1 Slope Threshold 0.00V The search menu is similar to the trigger menu. 3. From the side-bezel menu, turn on the search. 4. On the screen, hollow triangles show the location of automatic marks and solid triangles show the custom (user-defined) locations. These appear on both normal and zoomed waveform views. DPO4000 Series User Manual 171 Analyze Waveform Data 5. Again, you can quickly investigate your waveform by moving from search mark to search mark with the next ( →) and previous (←) arrow buttons. No other adjustments are needed. Quick Tips. You can copy trigger settings to search for other locations in your acquired waveform that meet the trigger conditions. You can also copy search settings to your trigger. Custom (User) marks are saved with the waveform when the waveform is saved and when the setup is saved. Automatic search marks are not saved with the waveform when the waveform is saved. However, you can easily recapture them by re-using the search function. The search criteria are saved in the saved setup. With the optional DPO4EMBD and DPO4AUTO application modules installed, you can use the front-panel B1 and B2 buttons to define a combination of inputs to be either I2C, SPI, or CAN serial bus. Once set up, you can trigger on user-specified packet level content and have the DPO4000 automatically decode every packet in the acquisition into either binary or hex. The Wave Inspector includes the following search capabilities: Search Description Edge Searches for edges (rising or falling) with a user-specified threshold level. Pulse Width Searches for positive or negative pulse widths that are >, <, =, or ≠ a user specified pulse width. 172 DPO4000 Series User Manual Analyze Waveform Data Search Description Runt Searches for positive or negative pulses that cross one amplitude threshold but fail to cross a second threshold before crossing the first again. Search for all runt pulses or only those with a duration >, <, =, or ≠ a user specified time. Logic Search for a logic pattern (AND, OR, NAND, or NOR) across multiple waveforms with each input set to either High, Low, or Don’t Care. Search for when the event goes true, goes false, or stays valid for >, <, =, or ≠ a user specified time. Additionally, you can define one of the inputs as a clock for synchronous (state) searches. Setup & Hold Search for violations of user specified Setup and Hold times. Rise/Fall Time Search for rising and/or falling edges that are >, <, =, or ≠ a user specified time. Bus I2C: Search for Start, Repeated Start, Stop, Missing Ack, Address, Data, or Address and Data. SPI: Search for SS Active, MOSI, MISO, or MOSI & MISO CAN: Search for Start of Frame, Type of Frame (Data, Remote, Error, Overload), Identifier (standard or extended), Data, Identifier and Data, End of Frame, or Missing Ack. DPO4000 Series User Manual 173 Save and Recall Information Save and Recall Information The DPO4000 Series oscilloscope provides permanent storage for setups, waveforms, and screen images. Use the internal storage of the oscilloscope to save setups and reference waveform data. Use external storage, such as CompactFlash media and USB flash-memory storage devices to save setups, waveforms, and screen images. Use the external storage to carry data to remote computers for further analysis and for archiving. Saving a Screen Image A screen image consists of a graphical image of the oscilloscope screen. This is different from waveform data, which consists of numeric values for each point in the waveform. To save a screen image: 1. Push Save / Recall Menu. Do not yet push the Save button. 2. Push Save Screen Image from the lower-bezel menu. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 174 DPO4000 Series User Manual Save and Recall Information Save Screen Image 3. From the side-bezel menu, push File Format repeatedly to select among: .tif, .bmp, and .png formats. File Format .png 4. Push Orientation to select between saving the image in a landscape (horizontal) and a portrait (vertical) orientation. Orientation 5. Push Ink Saver to turn the Ink Saver mode on or off. When on, this mode provides a white background. Ink Saver On Off 6. Push Edit File Name to create a custom name for the screen image file. Skip this step to use a default name. Edit File Name 7. Push OK Save Screen Image to write the image to the selected media. OK Save Screen Image DPO4000 Series User Manual 175 Save and Recall Information For information on printing screen images of waveforms, go to Printing a Hardcopy. (See page 189, Printing a Hard Copy.) Saving and Recalling Waveform Data Waveform data consists of the numeric values for each point in the waveform. It copies the data, as opposed to a graphical image of the screen. To save the current waveform data or to recall previously stored waveform data: 1. Push Save / Recall Menu. 2. Push Save Waveform or Recall Waveform from the lower-bezel menu. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Waveform File Utilities 176 DPO4000 Series User Manual Save and Recall Information 3. From the resulting side-bezel menu, select the location to save the waveform data to or to recall it from. Save the information externally to a file on a CompactFlash card or USB memory stick. Alternatively, save the information internally to one of the four reference memories in the oscilloscope. 4. Push To File to save to a CompactFlash card or USB memory stick. To File This brings up the file manager screen. Use it to define a custom file name. Skip this step to use the default name and location. Editing File, Directory, Reference Waveform, or Instrument Setup Names. Give files descriptive names that you can recognize at a later date. To edit file names, directory names, reference waveform and instrument setup labels: 1. Push Save / Recall Menu. DPO4000 Series User Manual 177 Save and Recall Information 2. Push Save Screen Image, Save Waveform, or Save Setup. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 3. Enter the file manager by pushing the side-bezel menu To File item. To File 4. Turn multipurpose knob a to scroll through the file structure. D: is the CompactFlash drive. E: is the USB drive plugged into the USB port on the front of the oscilloscope. F: and G: are the USB drives plugged into the USB host ports on the rear of the oscilloscope. 178 DPO4000 Series User Manual Save and Recall Information 5. Push Select to open or close file folders. 6. Push the Menu Off button to cancel the save operation, or push a side-bezel menu OK Save. item to complete the operation. OK Save DPO4000 Series User Manual 179 Save and Recall Information Naming Your File. The oscilloscope gives all files it creates the default name tekxxxxx where xxxxx is an integer from 00000 to 99999. For example, the first time you save a file, that file is named tek00000. The next file is named tek00001. To define a file name of your own choosing: 1. Push Save / Recall Menu. 2. Push Save Screen Image, Save Waveform, or Save Setup. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Map Save Button File Utilities 3. Enter the file manager by pushing the side-bezel menu To File item. To File 180 DPO4000 Series User Manual Save and Recall Information 4. Push the front-panel Select or the lower-bezel menu Enter Character to select a character. 5. Push the Menu Off button to cancel the file naming operation or push a side-bezel menu Save to Selected File item to complete the operation. Save to Selected File DPO4000 Series User Manual 181 Save and Recall Information Saving a Waveform to File. When you push the To File side-bezel menu button, the oscilloscope changes the side- menu contents. The following table describes these side-bezel menu items for saving data to a mass storage file. Side-bezel menu button Description Internal File Format (.ISF) Sets the oscilloscope to save waveform data in internal waveform save file (.isf) format. This format is the fastest to write and creates the smallest-sized file. Use this format if you intend to recall a waveform to reference memory for viewing or measuring. Spreadsheet File Format (.CSV) Sets the oscilloscope to save waveform data as a comma-separated data file compatible with popular spreadsheet programs. This file cannot be recalled to reference memory. Saving a Waveform to Reference Memory. To save a waveform to nonvolatile memory inside the oscilloscope, first select the waveform that you want to save. Push the Save Waveform screen button. Then select one of the reference waveform locations. Four-channel models have four reference locations. Two-channel models have two reference locations. Saved waveforms contain only the most current acquisition. Gray-scale information, if any, is not saved. Displaying a Reference Waveform. To display a waveform stored in nonvolatile memory: 1. Push Ref R. 182 DPO4000 Series User Manual Save and Recall Information 2. Push R1, R2, R3, or R4. R 1 (On) R 2 (Off) R 3 (Off) R 4 (Off) Removing a Reference Waveform from the Display. To remove a reference waveform from the display: 1. Push Ref R. 2. Push the R1, R2, R3, or R4 screen button to select a reference waveform. R 1 (On) R 2 (Off) R 3 (Off) R 4 (Off) 3. Push the front-panel Ref or the appropriate lower-bezel R button again to remove the reference waveform from the display. The reference waveform is still in nonvolatile memory and can be displayed again. DPO4000 Series User Manual 183 Save and Recall Information Saving and Recalling Setups Setup information includes acquisition information, such as vertical, horizontal, trigger, cursor, and measurement information. It does not include communications information, such as GPIB addresses. To save the setup information: 1. Push Save / Recall Menu. 2. Push Save Setup or Recall Setup from the lower-bezel menu. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 184 DPO4000 Series User Manual Save and Recall Information Save Setup To File To Setup 1 3. From the resulting side-bezel menu, select the location to save the setup to or to recall it from. To save setup information to one of the ten internal setup memories in the oscilloscope, push the appropriate side-bezel button. To save setup information to a CompactFlash or USB file, push the To File button. To Setup 2 To Setup 3 – more – DPO4000 Series User Manual 185 Save and Recall Information 4. If you are saving information to a CompactFlash or USB memory device, turn multipurpose knob a to scroll through the file structure. D: is the CompactFlash drive. E: is the USB drive plugged into the USB port on the front of the oscilloscope. F: and G: are the USB drives plugged into the USB ports on the rear of the oscilloscope. Push Select to open or close file folders. Push the Menu Off button to cancel the save operation, or push a side-bezel menu Save to Selected File item to complete the operation. 186 DPO4000 Series User Manual Save and Recall Information Save 1 to Selected File Quick Tips Recalling the Default Setup. Push the front-panel Default Setup button to initialize the oscilloscope to a known setup. (See page 73, Using the Default Setup.) Saving with One Button Push After you have defined the save/recall parameters with the Save/Recall Menu button and menu, you can make saves to files with a single push of the Save button. For example, if you have defined the save operation to save waveform data to a USB drive, then each push of the Save button will save current waveform data to the defined USB drive. 1. To define the Save button behavior, push Save/Recall Menu. DPO4000 Series User Manual 187 Save and Recall Information 2. Push Assign Save button. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 3. Push the action to assign to the Save button. Assign Save to Screen Image Waveform Setup 4. From now on, when you push Save the button will perform the action that you just specified rather than having to navigate menus each time. 188 DPO4000 Series User Manual Save and Recall Information Printing a Hard Copy To print an image of what appears on the oscilloscope screen, do the following procedure. Connect a Printer to Your Oscilloscope Connect your printer to a USB port on the rear or front panel of the oscilloscope. Alternatively, you can print to networked printers through the Ethernet port. Set Up Print Parameters To set up the oscilloscope to print hard copies: 1. Push Utility. 2. Push System as many times as needed to select Print Setup from the resulting pop-up menu. Print Setup DPO4000 Series User Manual 189 Save and Recall Information System Print Setup Select Printer N/A Orientation Landscape Ink Saver On 3. Push Select Printer if you are changing the default printer. Turn multipurpose knob a to scroll through the list of available printers. Push Select to choose the desired printer. To add a USB printer to the list, plug the printer into the USB slot. The oscilloscope will automatically recognize it. To add an Ethernet printer to the list, use the instructions in the section titled Printing Over Ethernet. 190 DPO4000 Series User Manual Save and Recall Information 4. Select the image orientation (portrait or landscape). Landscape Portrait 5. Choose Ink Saver On or Off. The On selection will print out a copy with a clear (white) background. Ink Saver on Ink Saver off DPO4000 Series User Manual 191 Save and Recall Information Printing Over Ethernet To set up the oscilloscope to print over Ethernet: 1. Connect an Ethernet cable to the rear-panel Ethernet port. 2. Push Utility. 192 DPO4000 Series User Manual Save and Recall Information 3. Push System repeatedly until you select Print Setup. Print Setup 4. Push Select Printer. System Print Setup Select Printer (N/A) Orientation Landscape Ink Saver Off Select Printer 5. Push Add Network Printer. Add Network Printer Rename Printer DPO4000 Series User Manual 193 Save and Recall Information 6. Turn multipurpose knob a to scroll through the list of letters, numbers, and other characters to find the first character in the printer name that you want to enter. ABCDEFGHIJKLMNOPQRSTUVWXYZ abcdefghijklmnopqrstuvwxyz 0123456789_=+-!@#$%^&*()[]{}<>/~’”\|:,.? 7. Push Select or Enter Character to let the oscilloscope know that you have picked the proper character to use. You can use the lower-bezel buttons to edit the name, as needed. Enter Character Back Space Delete Clear 8. Continue scrolling and pushing Select until you have entered all the desired characters. 194 DPO4000 Series User Manual Save and Recall Information 9. Push the down arrow key to move the character cursor down a row to the Server Name field. 10. Turn multipurpose knob a and push Select or Enter Character as often as needed to enter the name. 11. If desired, push the down arrow key to move the character cursor down a row to the Server IP Address: field. 12. Turn multipurpose knob a and push Select or Enter Character as often as needed to enter the name. Add Printer 13. When done, push OK Accept. OK Accept DPO4000 Series User Manual 195 Save and Recall Information NOTE. If you have multiple printers connected to the oscilloscope at the same time, the oscilloscope will print to the printer listed in the Utility > System > Print Setup > Select Printer menu item. Print to a Printer Once you have connected a printer to your oscilloscope and set up print parameters, you can print current screen images with a single push of a button: 1. Push the printer icon button in the lower left corner of the front panel. Erasing DPO4000 Memory You can erase all setup and waveform information saved in the nonvolatile memory with the TekSecure function. If you have acquired confidential data on your oscilloscope, you may want to execute the TekSecure function before you return the oscilloscope to general use. The TekSecure function: Replaces all waveforms in all reference memories with null values 196 DPO4000 Series User Manual Save and Recall Information Replaces the current front-panel setup and all stored setups with the default setup Displays a confirmation or warning message, depending on whether the verification is successful or unsuccessful To use TekSecure: 1. Push Utility. 2. Push System repeatedly until you select Config. Config 3. Push TekSecure. System Config Language English Set Date & Time TekSecure Erase Memory Version v1.00 DPO4000 Series User Manual 197 Save and Recall Information 4. Push OK Erase Setup and Ref Memory from the side-bezel menu. OK Erase Setup and Ref Memory To abort the procedure, push Menu Off. 198 DPO4000 Series User Manual Save and Recall Information 5. Power off the oscilloscope, and then power it back on to complete the process. DPO4000 Series User Manual 199 Use Application Modules Use Application Modules Optional application module packages extend the capability of your oscilloscope. Install up to four application modules at one time. Application modules go into the two slots with windows in the upper right corner of the front panel. Two additional slots are directly behind the two that you can see. Refer to the DPO4000 Series Application Module Installation Instructions that came with your application module for instructions on installing and testing an application module. Some modules are described below. Additional packages may be available. Contact your Tektronix representative or visit our Web site at www.tektronix.com for more information. Also, refer to Contacting Tektronix at the beginning of the manual. The DPO4EMBD Serial Triggering and Analysis Module adds triggering on packet level information in serial buses used in embedded designs (I2C and SPI), as well as analytical tools to help you efficiently analyze your serial bus. These include digital views of the signal, bus views, packet decoding, search tools, and event tables with timestamp information. The DPO4AUTO Serial Triggering and Analysis Module adds triggering on packet level information in serial buses used in automotive designs (CAN), as well as analytical tools to help you efficiently analyze your serial bus. These include digital views of the signal, bus views, packet decoding, search tools, and event tables with timestamp information. 200 DPO4000 Series User Manual Application Examples Application Examples This section contains ways to use your instrument in both common and advanced troubleshooting tasks. Taking Simple Measurements If you need to see a signal in a circuit, but you do not know the signal amplitude or frequency, connect the probe from channel 1 of the oscilloscope to the signal. Then display the signal and measure its frequency and peak-to-peak amplitude. DPO4000 Series User Manual 201 Application Examples Using Autoset To quickly display a signal: 1. Push Autoset. 202 DPO4000 Series User Manual Application Examples The oscilloscope sets vertical, horizontal, and trigger controls automatically. You can manually adjust any of these controls if you need to optimize the display of the waveform. When you are using more than one channel, the autoset function sets the vertical controls for each channel and uses the lowest-numbered active channel to set the horizontal and trigger controls. Selecting Automatic Measurements The oscilloscope can take automatic measurements of most displayed signals. To measure signal frequency and peak-to-peak amplitude: 1. Push Measure. 2. Push Select Measurement. Select Measurement a 1 Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 203 Application Examples 3. Turn multipurpose knob a to select the channel from which you want to measure. For example, select channel 1. This step is only needed if you are acquiring data on more than one channel. 4. Select the Frequency measurement from the side-bezel menu. Frequency 5. Push -more- until you can select the Pk-Pk measurement. -more- 6. Push Menu Off. 204 DPO4000 Series User Manual Application Examples 7. Observe that the measurements appear on the screen and update as the signal changes. DPO4000 Series User Manual 205 Application Examples Measuring Two Signals In this example, you are testing a piece of equipment and need to measure the gain of its audio amplifier. You have an audio generator that can inject a test signal at the amplifier input. Connect two oscilloscope channels to the amplifier input and output as shown. Measure both signal levels and use these measurements to calculate the gain. 206 DPO4000 Series User Manual Application Examples To display the signals connected to channels 1 and 2: 1. Push channel 1 and channel 2 to activate both channels. 2. Push Autoset. To select measurements for the two channels: 1. Push Measure to see the measurement menu. DPO4000 Series User Manual 207 Application Examples 2. Push Select Measurement. Select Measurement a 1 Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 3. Turn multipurpose knob a to select channel 1. 4. Page through the measurement menus until you find Amplitude. Select Amplitude. Amplitude 208 DPO4000 Series User Manual Application Examples 5. Turn multipurpose knob a to select channel 2. 6. Select Amplitude. Amplitude 7. Calculate the amplifier gain using the following equations: Gain = (output amplitude ÷ input amplitude) = (3.155 V ÷ 130.0 mV) = 24.27 Gain (dB) = 20 x log(24.27) = 27.7 dB DPO4000 Series User Manual 209 Application Examples Customizing Your Measurements In this example, you want to verify that the incoming signal to digital equipment meets its specifications. Specifically, the transition time from a low logic level (0.8 V) to a high logic level (2.0 V) must be 10 ns or less. To select the rise time measurement. 1. Push Measure. 210 DPO4000 Series User Manual Application Examples 2. Push Select Measurement. Select Measurement a 1 Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 3. Turn multipurpose knob a to select channel 1. This step is only needed if you are acquiring data on more channels than just channel 1. 4. Select the Rise Time measurement from the side-bezel menu. Rise Time DPO4000 Series User Manual 211 Application Examples 5. Press Reference Levels. Reference Levels 6. Push Set Levels in to select units. Set Levels in % units 7. Push High Ref and turn multipurpose knob a to enter 2.00 V. If needed, push Fine to change the sensitivity of the multipurpose knob. High Ref a 2.00 V Mid Ref 8. Push Low Ref and turn multipurpose knob a to enter 800 mV. If needed, push Fine to change the sensitivity of the multipurpose knob. Low Ref a 800 mV 212 DPO4000 Series User Manual Application Examples Rise time is typically measured between the 10% and 90% amplitude levels of a signal. These are the default reference levels that the oscilloscope uses for rise time measurements, However, in this example, you need to measure the time that the signal takes to pass between the 0.8 V and 2.0 V levels. You can customize the rise time measurement to measure the signal transition time between any two reference levels. You can set each of these reference levels to a specific percent of the signal amplitude or to a specific level in vertical units (such as volts or amperes). Measuring Specific Events. Next you want to see the pulses in the incoming digital signal, but the pulse widths vary so it is hard to establish a stable trigger. To look at a snapshot of the digital signal, do this step: 1. Push Single to capture a single acquisition. Now you want to measure the width of each displayed pulse. You can use measurement gating to select a specific pulse to measure. To measure the second pulse: 1. Push Measure. DPO4000 Series User Manual 213 Application Examples 2. Push Select Measurement. Select measurement a 1 Remove Measurement Gating Statistics Reference Levels Indicators Configure Cursors 3. Turn multipurpose knob a to select channel 1. 4. Select Positive Pulse Width measurement. Positive Pulse Width 214 DPO4000 Series User Manual Application Examples 5. Push Gating. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 6. Select Between Cursors from the side-bezel menu to choose measurement gating using cursors. Between Cursors 7. Place one cursor to the left and one cursor to the right of the second pulse. DPO4000 Series User Manual 215 Application Examples 8. View the resulting width measurement (160 ms) for the second pulse. 216 DPO4000 Series User Manual Application Examples Analyzing Signal Detail In this example, you have a noisy signal displayed on the oscilloscope, and you need to know more about it. You suspect that the signal contains much more detail than you can currently see in the display. DPO4000 Series User Manual 217 Application Examples Looking at a Noisy Signal The signal appears noisy. You suspect that noise is causing problems in your circuit. To better analyze the noise: 1. Push Acquire. 2. Push Mode on the lower-bezel menu. Mode Record Length 10k Reset Horizontal Position Waveform Display 218 DPO4000 Series User Manual Application Examples 3. Push Peak Detect on the side-bezel menu. Sample Peak Detect Hi Res Envelope Average 4. Push Intensity and turn multipurpose knob a to see the noise more easily. DPO4000 Series User Manual 219 Application Examples 5. View the results on the display. Peak detect emphasizes noise spikes and glitches in your signal as narrow as 1 ns, even when the time base is set to a slow setting. 220 DPO4000 Series User Manual Application Examples Peak-detect and the other acquisition modes are explained earlier in this manual. (See page 75, Acquisition Concepts.) Separating the Signal from Noise Now you want to analyze the signal shape and ignore the noise. To reduce random noise in the oscilloscope display: 1. Push Acquire. 2. Push Mode. Mode Record Length Reset Horizontal Position Waveform Display 3. Push Average on the side-bezel menu. Average DPO4000 Series User Manual 221 Application Examples Averaging reduces random noise and makes it easier to see detail in a signal. In the example to the right, a ring shows on the rising and falling edges of the signal when the noise is removed. 222 DPO4000 Series User Manual Application Examples Taking Cursor Measurements You can use the cursors to take quick measurements on a waveform. To measure the ring frequency at the rising edge of the signal: 1. Push channel 1 to select the channel 1 signal. 2. Push Measure. 3. Push Configure Cursors. Select Measurement Remove Measurement Gating Statistics Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 223 Application Examples 4. Push Vertical Bar Units repeatedly to select Hz (1/s). Vertical Bar Units Hz (1/s) 5. Push Cursors repeatedly until the two vertical bar cursors appear on the selected waveform. 6. Place one cursor on the first peak of the ring using multipurpose knob a. 7. If the cursor readout says that the cursors are linked, push Select to unlink them. 224 DPO4000 Series User Manual Application Examples 8. Place the other cursor on the next peak of the ring using multipurpose knob b. 9. The cursor Δ readout shows the measured ring frequency is 227 kHz. DPO4000 Series User Manual 225 Application Examples Triggering on a Video Signal The DPO4000 Series of oscilloscopes supports triggering on NTSC, SECAM, and PAL signals. In this example, you are testing the video circuit in a piece of medical equipment and need to display the video output signal. The video output is an NTSC standard signal. Use the video signal to obtain a stable display. To trigger on the video fields: 1. Push Trigger Menu. 226 DPO4000 Series User Manual Application Examples 2. Push Type repeatedly to select Video. Video 3. Push Standard repeatedly to select 525/NTSC. Type Video Standard 525/NTSC Source 1 Trigger on All Lines Mode Auto & Holdoff 4. Push Trigger On. 5. Select Odd Fields. Odd Fields If the signal had been noninterlaced, you could choose to trigger on All Fields. 6. Turn the Horizontal Scale knob to see a complete field across the screen. DPO4000 Series User Manual 227 Application Examples 7. View results. Triggering on Lines Triggering on Lines. To look at the video lines in the field: 1. Push Trigger Menu. 228 DPO4000 Series User Manual Application Examples 2. Push Type repeatedly to select Video. Video Type Video Standard 525/NTSC Source 1 Trigger On All Lines Mode Auto & Holdoff 3. Push Trigger On. 4. Select All Lines. All Lines 5. Adjust Horizontal Scale to see a complete video line across the screen. DPO4000 Series User Manual 229 Application Examples 6. Observe the results. Capturing a Single-Shot Signal In this example, the reliability of a reed relay in a piece of equipment has been poor, and you need to investigate the problem. You suspect that the relay contacts arc when the relay opens. The fastest you can open and close the relay is about once per minute, so you need to capture the voltage across the relay as a single-shot acquisition. To set up for a single-shot acquisition: 1. Adjust the Vertical Scale and Horizontal Scale to appropriate ranges for the signal you expect to see. 230 DPO4000 Series User Manual Application Examples 2. Push Acquire. 3. Push Mode. 4. Select Sample. 5. Push Trigger Menu. 6. Push Slope and . 7. Turn the Trigger Level knob to adjust the trigger level to a voltage midway between the open and closed voltages of the replay. DPO4000 Series User Manual 231 Application Examples 8. Push Single (single sequence). When the relay opens, the oscilloscope triggers and captures the event. The Single sequence button disables auto triggering so that only a valid triggered signal is acquired. 232 DPO4000 Series User Manual Application Examples Optimizing the Acquisition The initial acquisition shows the relay contact beginning to open at the trigger point. This is followed by large spikes that indicate contact bounce and inductance in the circuit. The inductance can cause contact arcing and premature relay failure. Before you take the next acquisition, you can adjust the vertical and horizontal controls to give you a preview of how the next acquisition might appear. As you adjust these controls, the current acquisition is repositioned, expanded, or compressed. This preview is useful to optimize the settings before the next single-shot event is captured. When the next acquisition is captured with the new vertical and horizontal settings, you can see more detail about the relay contact opening. You can now see that the contact bounces several times as it opens. DPO4000 Series User Manual 233 Application Examples Using the Horizontal Zoom Function To take a close look at a particular point on the acquired waveform, use the horizontal zoom function. To look closely at the point where the relay contact first begins to open: 1. Turn the Zoom knob. 2. Turn the Pan knob to place the center of the zoom box close to where the relay contact begins to open. 3. Turn the Zoom knob to magnify the waveform in the zoom window. 234 DPO4000 Series User Manual Application Examples The ragged waveform and the inductive load in the circuit suggest that the relay contact may be arcing as it opens. The zoom function works equally well when the acquisition is running or is stopped. Horizontal position and scale changes affect only the display, not the next acquisition. Correlating Data With a TLA5000 Logic Analyzer To troubleshoot designs with fast clock edges and data rates, it helps to view analog characteristics of digital signals in relation to complex digital events in the circuit. You can do that with iView, which lets you transfer analog waveforms from the oscilloscope to the logic analyzer display. You can then view time-correlated analog and digital signals side-by-side and use this to pinpoint sources of glitches and other problems. DPO4000 Series User Manual 235 Application Examples The iView External Oscilloscope Cable allows you to connect your logic analyzer to a Tektronix oscilloscope. This enables communication between the two instruments. The Add External Oscilloscope wizard, which is available from the TLA application System menu, guides you through the process of connecting the iView cable between your logic analyzer and oscilloscope. The TLA also provides a setup window to assist you in verifying, changing, and testing the oscilloscope settings. Before acquiring and displaying a waveform you must establish a connection between your Tektronix logic analyzer and oscilloscope using the Add External Oscilloscope wizard. To do this: 1. Select Add iView External Oscilloscope ... from the logic analyzer System menu. 236 DPO4000 Series User Manual Application Examples 2. Select your model of oscilloscope. 3. Follow the on-screen instructions, and then click Next. 4. See your Tektronix Logic Analyzer documentation for more information on correlating data between a DPO4000 Series Oscilloscope and a Tektronix Logic Analyzer. DPO4000 Series User Manual 237 Application Examples Tracking Down Bus Anomalies In this example, you are testing your new I2C circuit. Something is not working. You tell the master IC to send a message to the slave IC. Then you expect to receive data back and an LED to light. The light never goes on. Where in the ten or so commands that were sent out did the problem occur? Once you locate the problem location, how do you determine what went wrong? You can use your DPO4000 Series oscilloscope, with its serial triggering and long-record length management features, to track down the problem in both the physical layer and in the protocol layer of the bus. Basic strategy First, you will display and acquire the bus signal by setting up the bus parameters and trigger. Then, you will search through each packet with the search/mark functions. NOTE. Triggering on bus signals requires use of the DPO4EMBD or the DPO4AUTO Serial Triggering and Analysis Module. 238 DPO4000 Series User Manual Application Examples 1. Connect the channel 1 probe to the clock line. 2. Connect the channel 2 probe to the data line. 3. Push Autoset. DPO4000 Series User Manual 239 Application Examples 4. Push the B1 button and enter the parameters of your I2C bus in the resulting screen menus. 5. Push Trigger Menu. 6. Push Type to select Bus. Enter trigger parameters in the resulting screen menus. Type Bus Source Bus B1 (I2C) Trigger On Address Address 07F Direction Read Mode Auto & Holdoff 240 DPO4000 Series User Manual Application Examples 7. Analyze the physical layer. For example, you can use the cursors for manual measurements. (See page 144, Taking Manual Measurements with Cursors.) You can also use the automated measurements. (See page 129, Taking Automatic Measurements.) 8. Push Search. Set Search Marks to On. Enter a search type, source, and other parameters as relevant on the lower-bezel menu and associated side-bezel menus. (See page 163, Managing Long Record Length Waveforms.) 9. Jump ahead to the next search point by pushing the right arrow key. Push it again and again until you see all the events. Jump back with the left arrow key. Do you have all the packets that you expected to have? If not, at least you have narrowed your search down to the last packet sent. DPO4000 Series User Manual 241 Application Examples 10. Analyze the decoded packets in the protocol layer. Did you send the data bytes in the correct order? Did you use the correct address? 242 DPO4000 Series User Manual Index Index Symbols and Numbers 50 Ω protection, 128 A Accessories, 1 Acquire button, 49, 80, 112, 218, 221 Acquisition input channels and digitizers, 75 modes defined, 78 readout, 60 sampling, 75 Adapter TEK-USB-488, 4 TPA-BNC, 4, 10 Adding waveform, 112 Advanced math, 157 Altitude DPO4000, 7 P6139A, 8 Analysis and Connectivity, xii Application module DPO4AUTO, 84 DPO4EMBD, 84 Application Module, xiii, 19 Applications modules, 200 Attenuation, 127 Auto trigger mode, 92 Autoset, 74, 202 Autoset button, 17, 49, 56, 71, 74, 202, 207 Autoset undo, 74 Auxiliary readout, 64 Average acquisition mode, 79 BB Trigger, 109 B1 / B2 button, 51, 84, 85, 102 Backlight intensity, 119 Bandwidth, x Before Installation, 1 Blackman-Harris FFT window, 157 BNC interface, 10 Bus button, 84, 85, 102 menu, 51, 85 Bus trigger, defined, 102 Buses, 84, 102 Button Acquire, 49, 80, 112, 218, 221 Autoset, 17, 49, 56, 71, 74, 202, 207 B1 / B2, 51, 84, 85, 102 bus, 84, 85, 102 Channel, 50 Cursors, 52, 144, 224 Default Setup, 50, 58, 73 Fine, 48, 52, 53, 54, 55, 57 Force Trig, 56, 93 hard copy, 57, 196 Intensity, 115 M, 51, 150, 153 Math, 51, 150, 153 Measure, 49, 129, 139, 140, 203, 207, 210, 213 Menu Off, 58, 204 Next, 55 play-pause, 167 Play-pause, 54 Previous, 54 printer icon, 57, 196 Ref, 51, 160, 182 DPO4000 Series User Manual 243 Index Run/Stop, 56, 83, 111 Save / Recall, 50, 58, 174 Search, 49, 170 Select, 53, 224 Set / Clear Mark, 55, 169 Set to 50%, 56, 97 Single, 56, 111, 213, 232 Test, 49 Trigger, 49 Trigger level, 56 Trigger menu, 226 Trigger Menu, 98 Utility, 20, 23, 26, 50, 117, 118, 189 Vertical, 50 Zoom, 54 C Calibration, 25, 27 Calibration certificate, 2 CAN, 51, 84, 102 Channel button, 50 Channel readout, 64 Clearance, DPO4000, 6 Communications, 35, 40 CompactFlash, x, 2, 5, 50, 58, 174 Compensate probe, 17 Compensate signal path, 25 Confidential data, 196 Connectivity, 2, 35, 40 Connector, side-panel, 67 Connectors front-panel, 66 rear-panel, 68 Controls, 45 Coupling, trigger, 94 Cover, front, 2 Cross Hair graticule style, 118 Cursor readout, 62, 149 Cursor, measurements, 144 Cursors, 144 button, 52, 144, 224 linking, 145 Cursors menu, 144 D Date and time, changing, 23 Default setup, 187 Default Setup, 73 button, 50, 58, 73 menu, 50 Undo, 73 Delayed trigger, 107 Depth, DPO4000, 6 Deskew, 127 Display persistence, 112 style, 112 Displaying, reference waveforms, 182 Documentation, xii DPO4AUTO, 84 DPO4EMBD, 84 Drivers, 35, 39 Dual waveform math, 150 Ee *Scope, 40 Edge trigger, defined, 99 Envelope acquisition mode, 79 Erase setup and ref memory, 196 Ethernet, x, 37, 40, 41 port, 68 printing, 192 Event Table, 88, 89 Excel, 34 Expansion point icon, 61 244 DPO4000 Series User Manual Index FF actory calibration, 27 FFT Blackman-Harris, 157 controls, 153 Hamming, 156 Hanning, 157 Rectangular, 156 File format, 175 Internal File Format (ISF), 182 Spreadsheet file format (.CSV), 182 File system, 174, 177, 180 Fine, 53 Fine button, 48, 52, 54, 55, 57 Firmware upgrade, 28 Force Trig button, 56, 93 Frame graticule style, 118 Frequency, Input power DPO4000, 6 Front cover, 2 Front panel, 45 Front-panel connectors, 66 Front-panel overlay, 22 Full graticule style, 118 Functional check, 15 G Gating, 137 GPIB, 36, 38, 68 GPIB address, 38 Graticule Cross Hair, 118 Frame, 118 Full, 118 Grid, 118 intensity, 115 styles, 117 Grid graticule style, 118 Ground, 11 Ground lead, 19 Ground strap, 67 H Hamming FFT window, 156 Hanning FFT window, 157 Hard copy, 57, 189 Height, DPO4000, 6 Hi Res acquisition mode, 79 Holdoff, trigger, 93 Horizontal delay, 94 Horizontal position, 55, 94, 95, 120, 156, 234, 235 and math waveforms, 152 defined, 72 Horizontal position/scale readout, 64 Horizontal scale, 55, 120, 156, 227, 229, 230, 234 and math waveforms, 152 defined, 72 How to erase memory, 196 print a hard copy, 189 recall setups, 184 recall waveforms, 174 save screen images, 174 save setups, 184 save waveforms, 174 Humidity DPO4000, 7 P6139A, 9 I I2C, 51, 84, 102 DPO4000 Series User Manual 245 Index Icon Expansion point, 61 Trigger level, 63 Trigger position, 61 Image orientation, 175, 191 Impedance, 123 Indicator, waveform baseline, 65 Infinite persistence, 115 Ink Saver, 175, 191 Inner knob, 54, 152 Installing, application modules, xiii Intensity button, 115 Internal File Format, 182 K Knob inner, 54, 152 Multipurpose, 24, 48, 53, 54, 80, 86, 177, 224, 225 outer, 54 pan, 54, 166, 169 Trigger level, 97 Vertical position, 57, 72 Vertical scale, 57, 72 zoom, 54, 152, 164 LL abView, 34 Landscape, 175, 191 Language change, 20 overlay, 22 Level, trigger, 96 Logic trigger, defined, 100 Long record length, 238 Long record length management, 163 MM button, 51, 150, 153 Main trigger, 107 Mark, 169 Math Advanced, 157 button, 51, 150, 153 Dual waveform, 150 FFT, 153 menu, 51 waveforms, 150 Measure button, 49, 129, 139, 140, 203, 207, 210, 213 Measurement menu, 49 Measurements automatic, 129 cursor, 144 defined, 131 reference levels, 142 snapshot, 140 statistics, 139 Memory, erasure of, 196 Menu Bus, 51, 85 Cursors, 144 Default Setup, 50 Math, 51 Measurement, 49 Reference, 51, 160, 161 Save / Recall, 50, 58, 174 Trigger, 49, 98, 108, 226 Utility, 20, 23, 50, 57, 117, 189 Vertical, 50, 122 Menu buttons, 49 Menu Off button, 58, 204 Menus, 45 Mode, roll, 83 Multipurpose knob, 48, 53, 54, 80, 86, 177, 224, 225 246 DPO4000 Series User Manual Index N Network printing, 192 Next button, 55 Normal trigger mode, 92 O Offset and position, 128 OpenChoice, 2, 35 Operating specifications, 6 Orientation of the image, 175, 191 Outer knob, 54 Overlay, 22 P Pan, 164, 166 knob, 54, 166, 169 Pause, 166 Peak detect acquisition mode, 79 Performance verification, xii Persistence display, 112 infinite, 115 variable, 115 Play, 166 Play-pause button, 54, 167 Play-pause mode, 167 Pollution Degree DPO4000, 7 P6139A, 9 Portrait, 175, 191 Position Horizontal, 94, 95, 120, 156, 234, 235 Vertical, 121 Position and offset, 128 Posttrigger, 91, 96 Power cord, 3 input, 69 off, 14 removing, 14 supply, 11 switch, 57 Power consumption, DPO4000, 6 Predefined math expressions, 150 Pretrigger, 91, 96 Previous button, 54 Print, 57, 189 Printing a hard copy, 189 Printing, Ethernet, 192 Probe Comp, 16 Probe compensation, 17 Probes BNC, 10 connecting, 10 ground lead, 19 TEK-USB-488 Adapter, 4 TekVPI, 10 TPA-BNC Adapter, 4, 10 Programmer Commands, xii Pulse/Width trigger, defined, 100 R Rackmount, 4 Readout Acquisition, 60 Auxiliary, 64 Channel, 64 Cursor, 62, 149 Horizontal position/scale, 64 Record length/sampling rate, 63 Trigger, 63, 107 Trigger status, 62 Rear-panel connectors, 68 Recalling setups, 184 waveforms, 174 Record length, x DPO4000 Series User Manual 247 Index Record length/sampling rate readout, 63 Rectangular FFT window, 156 Ref button, 51, 160 Ref R, 182 Reference button, 182 Reference levels, 142 Reference menu, 51, 160, 161 Reference waveforms, 160 displaying, 182 removing, 161, 183 saving, 182 saving 10M waveforms, 162 Related documents, xii Removing reference waveforms, 183 Removing reference waveforms, 161 Removing waveform, 112 Rise/Fall trigger, defined, 101 Roll mode, 83 Run/Stop button, 56, 83, 111 Runt trigger, defined, 100 SS afety Summary, v Sample acquisition mode, 78 Sample rates, x Sampling process, defined, 75 Sampling, real-time, 76 Save / Recall menu, 50, 58, 174 Save / Recall Menu button, 50 Save / Recall Save button, 58, 174 Saving reference waveforms, 182 screen images, 174 waveforms, 174 Saving and recalling Information, 174 Saving setups, 184 Scale Horizontal, 55, 120, 156, 227, 229, 230, 234 Vertical, 121, 230 Search, 169 Search / Mark, 238 Search button, 49, 170 Securing DPO4000 memory, 196 Select button, 53, 224 Sequential triggering, 107 Serial, 84, 102, 238 Service information, xiii Set / Clear Mark button, 55, 169 Set to 50% button, 56, 97 Setup default, 58, 187 Default, 73 Setup and Hold trigger, defined, 101 Side panel connector, 67 Signal path compensation, 25 Single button, 56, 111, 213, 232 Single sequence, 83, 111 Slope, trigger, 96 Snapshot, 140 Software drivers, 35, 39 Software, optional, 200 SPC, 25 Specifications, xii operating, 6 power supply, 11 SPI, 51, 84, 102 Spreadsheet file format (.CSV), 182 Start an acquisition, 111 Statistics, 139 Stop an acquisition, 111 Switch, power, 57 T Table, Event, 88, 89 TDSPCS1, 35 248 DPO4000 Series User Manual Index TEK-USB-488 Adapter, 36, 38, 68 TEK-USB–488 Adapter, 4 TekSecure, 196 TekVPI, 10 Temperature DPO4000, 6 P6139A, 8 Termination, 123 Test button, 49 TPA-BNC Adapter, 4, 10 Transit case, 4 Transition trigger, defined, 101 Trigger concepts, 91 coupling, 94 delayed, 107 event, defined, 91 forcing, 92 holdoff, 93 level, 96 modes, 92, 98 posttrigger, 91, 96 pretrigger, 91, 96 readout, 107 sequential, 107 Serial, 84, 102, 238 slope, 96 Trigger level button, 56 Icon, 63 knob, 97 Trigger menu, 49, 98, 108, 226 Trigger menu button, 226 Trigger Menu button, 98 Trigger modes Auto, 92 Normal, 92 Trigger position icon, 61 Trigger readout, 63 Trigger status readout, 62 Trigger types, defined, 99 U Undo Autoset, 74 Default Setup, 73 Upgrading firmware, 28 USB, x, 5, 36, 39, 50, 58, 69, 174, 189 port, 68 USBTMC, 68 User marks, 169 Utility button, 20, 23, 26, 50, 117, 118, 189 Utility menu, 20, 23, 50, 57, 117 V Variable persistence, 115 Versatile Probe Interface, 10 Vertical button, 50 menu, 50, 122 Position, 121 position and autoset, 75 position and offset, 128 Position knob, 57, 72 Scale, 121, 230 Scale knob, 57, 72 Vibration, DPO4000, 7 Video lines, 228 port, 68 Video trigger, defined, 101 View waveform record, 61 Voltage, Input DPO4000, 6 P6139A, 8 DPO4000 Series User Manual 249 Index Voltage, Output, P6139A, 8 W Waveform adding, 112 display style, 112 intensity, 115 pan, 164, 166 pause, 166 play, 166 play-pause, 167 record defined, 77 removing, 112 search and mark, 169 user marks, 169 zoom, 164 Waveform baseline indicator, 65 Waveform record, 77 Waveform record view, 61 Weight DPO4000, 6 Width DPO4000, 6 ZZ oom, 164 button, 54 graticule size, 166 Horizontal, 234 knob, 54, 164 PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor Rev. 03 — 11 December 2009 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - −100 V IC collector current - - −1 A ICM peak collector current single pulse; tp ≤ 1 ms - - −3 A RCEsat collector-emitter saturation resistance IC = −1 A; IB = −100 mA [1] - 170 320 mΩ PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 2 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values Table 2. Pinning Pin Description Simplified outline Symbol 1 base 2 collector 3 emitter 4 collector 1 2 3 4 sym028 2, 4 3 1 Table 3. Ordering information Type number Package Name Description Version PBSS9110Z SC-73 plastic surface-mounted package with increased heat sink; 4 leads SOT223 Table 4. Marking codes Type number Marking code PBSS9110Z PB9110 Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - −120 V VCEO collector-emitter voltage open base - −100 V VEBO emitter-base voltage open collector - −5 V IC collector current - −1 A ICM peak collector current single pulse; tp ≤ 1 ms - −3 A IB base current - −0.3 A Ptot total power dissipation Tamb ≤ 25 °C [1] - 0.65 W [2] - 1 W [3] - 1.4 W PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 3 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C (1) FR4 PCB, mounting pad for collector 6cm2 (2) FR4 PCB, mounting pad for collector 1cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tamb (°C) 0 40 80 120 160 001aaa508 0.8 0.4 1.2 1.6 Ptot (W) 0 (1) (2) (3) Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1]- - 192 K/W [2]- - 125 K/W [3]- - 89 K/W Rth(j-sp) thermal resistance from junction to solder point - - 17 K/W PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 4 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values FR4 PCB, mounting pad for collector 1cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aaa819 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10−4 10−2 10−1 10 102 tp (s) 10−3 1 103 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 006aaa820 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10−4 10−2 10−1 10 102 tp (s) 10−3 1 103 duty cycle = 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 1 PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 5 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor FR4 PCB, mounting pad for collector 6cm2 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aaa821 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10−4 10−2 10−1 10 102 tp (s) 10−3 1 103 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 6 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 7. Characteristics [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. Table 7. Characteristics Tamb = 25°C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = −80 V; IE = 0 A - - −100 nA VCB = −80 V; IE = 0 A; Tj = 150 °C - - −50 μA ICES collector-emitter cut-off current VCE = −80 V; VBE = 0 V - - −100 nA IEBO emitter-base cut-off current VEB = −4 V; IC = 0 A - - −100 nA hFE DC current gain VCE = −5 V; IC = −1 mA 150 - - VCE = −5 V; IC = −250 mA 150 - - VCE = −5 V; IC = −0.5 A [1] 150 - 450 VCE = −5 V; IC = −1 A [1] 125 - - VCEsat collector-emitter saturation voltage IC = −250 mA; IB = −25 mA - - −120 mV IC = −500 mA; IB = −50 mA [1]- - −180 mV IC = −1 A; IB = −100 mA [1]- - −320 mV RCEsat collector-emitter saturation resistance IC = −1 A; IB = −100 mA [1] - 170 320 mΩ VBEsat base-emitter saturation voltage IC = −1 A; IB = −100 mA [1]- - −1.1 V VBEon base-emitter turn-on voltage VCE = −5 V; IC = −1 A [1]- - −1.0 V td delay time VCC = −10 V; IC = −0.5 A; IBon = −0.025 A; IBoff = 0.025 A - 20 - ns tr rise time - 60 - ns ton turn-on time - 80 - ns ts storage time - 290 - ns tf fall time - 120 - ns toff turn-off time - 410 - ns fT transition frequency VCE = −10 V; IC = −50 mA; f = 100 MHz 100 - - MHz Cc collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz - - 17 pF PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 7 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor VCE = −10 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C Fig 5. DC current gain as a function of collector current; typical values Fig 6. Collector current as a function of collector-emitter voltage; typical values VCE = −10 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig 7. Base-emitter voltage as a function of collector current; typical values Fig 8. Base-emitter saturation voltage as a function of collector current; typical values 001aaa376 200 400 600 hFE 0 IC (mA) −10−1 −1 −10 −102 −103 −104 (1) (2) (3) VCE (V) 0 −1 −2 −3 −4 −5 001aaa384 −0.8 −1.2 −0.4 −1.6 −2 IC (A) 0 IB (mA) = −45 −40.5 −36 −31.5 −27 −22.5 −18 −13.5 −9 −4.5 001aaa377 −0.4 −0.8 −1.2 VBE (V) 0 IC (mA) −10−1 −1 −10 −102 −103 −104 (1) (2) (3) 001aaa381 IC (mA) −10−1 −1 −10 −102 −103 −104 −1 −10 VBEsat (V) −10−1 (1) (2) (3) PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 8 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor IC/IB = 10 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C (1) IC/IB = 50 (2) IC/IB = 20 Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Tamb = 25 °C (1) IC/IB = 50 (2) IC/IB = 20 Fig 11. Collector-emitter saturation resistance as a function of collector current; typical values Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values 001aaa378 IC (mA) −10−1 −1 −10 −102 −103 −104 −10−1 −1 VCEsat (V) −10−2 (1) (2) (3) 001aaa380 IC (mA) −10−1 −1 −10 −102 −103 −104 −10−1 −1 VCEsat (V) −10−2 (1) (2) 001aaa382 IC (mA) −10−1 −1 −10 −102 −103 −104 1 10 102 103 RCEsat (Ω) 10−1 (1) (2) (3) 001aaa383 IC (mA) −10−1 −1 −10 −102 −103 −104 1 10 102 103 RCEsat (Ω) 10−1 (1) (2) PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 9 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 8. Test information Fig 13. BISS transistor switching time definition VCC = −10 V; IC = −0.5 A; IBon = −0.025 A; IBoff = 0.025 A Fig 14. Test circuit for switching times 006aaa266 −IBon (100 %) −IB input pulse (idealized waveform) −IBoff 90 % 10 % −IC (100 %) −IC td ton 90 % 10 % tr output pulse (idealized waveform) tf t ts toff RC R2 R1 DUT mgd624 Vo RB (probe) 450 Ω (probe) 450 Ω oscilloscope oscilloscope VBB VI VCC PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 10 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 14. Fig 15. Package outline SOT223 (SC-73) Dimensions in mm 04-11-10 6.7 6.3 3.1 2.9 1.8 1.5 7.3 6.7 3.7 3.3 1.1 0.7 1 2 3 4 4.6 2.3 0.8 0.6 0.32 0.22 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 1000 4000 PBSS9110Z SOT223 8 mm pitch, 12 mm tape and reel -115 -135 PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 11 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 11. Soldering Fig 16. Reflow soldering footprint SOT223 (SC-73) Fig 17. Wave soldering footprint SOT223 (SC-73) sot223_fr 1.2 (4×) 1.2 (3×) 1.3 (4×) 1.3 (3×) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 1 2 3 solder lands solder resist occupied area solder paste Dimensions in mm sot223_fw 1.9 6.7 8.9 8.7 1.9 (3×) 1.9 1.1 (2×) 6.2 2.7 2.7 2 4 1 3 solder lands solder resist occupied area preferred transport direction during soldering Dimensions in mm PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 12 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PBSS9110Z_3 20091211 Product data sheet - PBSS9110Z_2 Modifications: • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 16 “Reflow soldering footprint SOT223 (SC-73)”: updated • Figure 17 “Wave soldering footprint SOT223 (SC-73)”: updated PBSS9110Z_2 20060724 Product data sheet - PBSS9110Z_1 PBSS9110Z_1 20040609 Product data sheet - - PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 13 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 December 2009 Document identifier: PBSS9110Z_3 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 43020-1200 Status: Active Overview: Micro-Fit 3.0™ Connectors Description: Micro-Fit 3.0™ Plug Housing, Dual Row, with Panel Mount Ears, 12 Circuits Documents: 3D Model Test Summary TS-43045-001 (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Product Specification PS-43045 (PDF) Product Literature (PDF) Packaging Specification PK-43020-001 (PDF) Agency Certification CSA LR19980 TUV R72081037 UL E29179 General Product Family Crimp Housings Series 43020 Application Power, Wire-to-Wire Comments Glow Wire Equivalent Part Number 43020-1208 Overview Micro-Fit 3.0™ Connectors Product Literature Order No 987650-5984 Product Name Micro-Fit 3.0™ UPC 800754383530 Physical Circuits (maximum) 12 Circuits Detail 12 Color - Resin Black Flammability 94V-0 Gender Male Glow-Wire Compliant No Lock to Mating Part Yes Material - Resin Polyester Net Weight 1.476/g Number of Rows 2 Packaging Type Bag Panel Mount Yes Pitch - Mating Interface 3.00mm Pitch - Termination Interface 3.00mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -40°C to +105°C Electrical Current - Maximum per Contact 5A Material Info Reference - Drawing Numbers Packaging Specification PK-43020-001 Product Specification PS-43045, RPS-43045-003, RPS-43045-004 Sales Drawing SDA-43020-**** Test Summary TS-43045-001 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 43020Series Mates With 43025 Micro-Fit 3.0™ Receptacle Housing Use With Micro-Fit 3.0™ Crimp Terminal, MaleThis document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 07/03/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 87439-0800 Status: Active Overview: Pico-Spox™ Description: 1.50mm Pitch Pico-SPOX™ Wire-to-Board Housing, 8 Circuits, Off-White Housing Documents: 3D Model RoHS Certificate of Compliance (PDF) Drawing (PDF) Product Literature (PDF) Product Specification PS-87437 (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family Crimp Housings Series 87439 Application Signal, Wire-to-Board MolexKits Yes Overview Pico-Spox™ Product Literature Order No USA-235 Product Name Pico-SPOX™ UPC 800754313278 Physical Circuits (maximum) 8 Color - Resin Natural Flammability 94V-0 Gender Female Glow-Wire Compliant No Lock to Mating Part Yes Material - Resin Nylon Net Weight 0.120/g Number of Rows 1 Packaging Type Bag Panel Mount No Pitch - Mating Interface 1.50mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -55°C to +105°C Electrical Current - Maximum per Contact 2.5A Material Info Reference - Drawing Numbers Product Specification PS-87437, RPS-87437, RPS-87437-001, RPS-87437-200 Sales Drawing SD-87439-**00 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 87439Series Mates With Pico-SPOX™ Wire-to-Board Header 87437 , 87438 Use With 87421 Pico-SPOX™ Crimp Terminal This document was generated on 07/03/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 01/08/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 43160-3102 Status: Active Overview: Sabre™ Power Connector Description: 7.50mm Pitch Sabre™ Header, Right Angle, 2 Circuits, Glow Wire Compatible. Recommended PCB Thickness 1.60mm, with Board Lock Documents: 3D Model RoHS Certificate of Compliance (PDF) Drawing (PDF) Product Literature (PDF) Product Specification PSX-44441-9999 (PDF) Agency Certification CSA LR19980 TUV R72130381 UL E29179 General Product Family PCB Headers Series 43160 Application Power, Wire-to-Board Comments "Fully Polarized, high power wire to board and wire to wire connector system

This Molex product is manufactured from material that has the following ratings, tested by independent agencies:. a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with the requirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire.

The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s).

If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options." Overview Sabre™ Power Connector Product Literature Order No 987650-5662 Product Name Sabre™ UPC 800754378185 Physical Breakaway No Circuits (Loaded) 2 Circuits (maximum) 2 Color - Resin Black Durability (mating cycles max) 25 First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant Yes Guide to Mating Part No Keying to Mating Part Yes Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Not Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 43160Series Mates With 44441-2002 Sabre™ Receptacle Housing Lock to Mating Part Yes Material - Metal Brass Material - Plating Mating Tin Material - Plating Termination Tin Material - Resin High Temperature Thermoplastic Net Weight 3.331/g Number of Rows 1 Orientation Right Angle PC Tail Length 3.81mm PCB Locator Yes PCB Retention Yes PCB Thickness - Recommended 1.60mm Packaging Type Tray Pitch - Mating Interface 7.50mm Pitch - Termination Interface 7.50mm Plating min - Mating 0.889μm Plating min - Termination 0.889μm Polarized to Mating Part Yes Polarized to PCB Yes Shrouded Fully Stackable No Surface Mount Compatible (SMC) No Temperature Range - Operating -40°C to +75°C Termination Interface: Style Through Hole Electrical Current - Maximum per Contact 18A Voltage - Maximum 600V Solder Process Data Duration at Max. Process Temperature (seconds) 5 Lead-free Process Capability Wave Capable (TH only) Max. Cycles at Max. Process Temperature 1 Process Temperature max. C 235 Material Info Reference - Drawing Numbers Product Specification PSX-44441-9999 Sales Drawing SDA-43160-**** This document was generated on 01/08/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 39-00-0038 Status: Active Overview: Mini-Fit Jr.™ Power Connectors Description: Mini-Fit® Female Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass, 18-24 AWG, Reel Documents: Drawing (PDF) Product Specification PS-52034-003 (PDF) Product Specification PS-51010-005 (PDF) Product Specification PS-52034-004 (PDF) Product Specification PS-51010-006 (PDF) Product Specification PS-5556-001 (PDF) Product Specification PS-51045-001 (PDF) Product Specification PS-5556-002 (PDF) Product Specification PS-51045-002 (PDF) Packaging Specification PK-5556-001 (PDF) Product Specification PS-51045-004 (PDF) Test Summary TS-5556-002 (PDF) Product Specification PS-51096-001 (PDF) RoHS Certificate of Compliance (PDF) General Product Family Crimp Terminals Series 5556 Application Power Crimp Quality Equipment Yes Overview Mini-Fit Jr.™ Power Connectors Packaging Alternative 39-00-0039 (Loose) Product Name Mini-Fit® UPC 800753585010 Physical Durability (mating cycles max) 30 Gender Receptacle Material - Metal Brass Material - Plating Mating Tin Material - Plating Termination Tin Net Weight 0.130/g Packaging Type Reel Plating min - Mating 0.889μm Plating min - Termination 0.889μm Termination Interface: Style Crimp or Compression Wire Insulation Diameter 1.30-3.10mm Wire Size AWG 18, 20, 22, 24 Wire Size mm² N/A Electrical Current - Maximum per Contact 9A Voltage - Maximum 600V Material Info Old Part Number 5556T Reference - Drawing Numbers Packaging Specification PK-5556-001 Product Specification PS-51010-005, PS-51010-006, PS-51045-001, PS-51045-002, PS-51045-004, PS-51096-001, PS-52034-003, PS-52034-004, PS-5556-001, PS-5556-002, RPS-30067-001, RPS-30067-002, RPS-42474-001, RPS-51045-001, RPS-5557-008, RPS-5557-024, RPS-5557-031, RPS-5557-036, RPS-5557-037, RPS-5557-045, RPS-5557-046, RPS-5566-002 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 5556Series Mates With 5558 Mini-Fit® Crimp Male Terminals. Mini- Fit Jr.™ Header, Dual Row, 5566 , 5569 Use With 5557 Mini-Fit Jr.™ Receptacle Housing, 30067 Mini-Fit® TPA, 42474 Mini-Fit® BMI Panel Mount, 5559 Mini-Fit Jr.™ Plug Housing, Dual Row Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # FineAdjust™ Applicator for Insulation OD 0639023900 Sales Drawing SD-5556**** Test Summary TS-5556-002 1.40-1.70mm - 18-24 AWG Extraction Tool 0011030044 Hand Crimp Tool for Male and Female Crimp Terminals, 16-24 AWG Wire 0638190900 FineAdjust™ Applicator for Insulation OD 2.50-2.95mm - 18-24 AWG 0639002600 FineAdjust™ Applicator for Insulation OD 1.65-2.05mm - 18-24 AWG 0639002900 FineAdjust™ Applicator for Insulation OD 1.90-2.30mm - 18-24 AWG 0639015600 FineAdjust™ Applicator for Insulation OD 2.50-2.95mm Optimized for 18 AWG Only 0639024800 FineAdjust™ Applicator for Insulation OD 2.30-2.60mm - 18-24 AWG 0639024900 T2 Terminator™ for insulation OD 2.50-2.95mm - 18-24 AWG 0639102600 T2 Terminator™ for insulation OD 1.65 – 2.05mm – 18 – 24 AWG 0639102900 T2 Terminator™ for insulation OD 1.90-2.30mm - 18-24 AWG 0639115600 T2 Terminator™ for insulation OD 1.40-1.70mm - 18-24 AWG 0639123900 T2 Terminator™ for insulation OD 2.50-2.95mm optimized for 18 AWG only 0639124800 T2 Terminator™ for insulation OD 2.30-2.60mm - 18-24 AWG 0639124900 Japan Description Product # Applicator for M211A Bench Press, 18-24 AWG Wire 0570223000 Side-Feed Applicator For Full-Auto Machine 0570223200 Hand Extraction Tool 0570316000 This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION For more complete information on any product, please visit our web site: www.aimtti.com Measurably better value manual & bus programmable - Laboratory Power Supplies Mixed-mode Regulation Mixed-mode regulation with linear output stage 4 digit voltage and current meters on each output * Constant voltage or constant current operation Variable auxiliary output (1.5-5V@5A) on triple model Switched remote sensing (not EX355P or EX752M) Silent fan-free cooling ** DC output switches        Compact bench power supplies Single, dual or triple outputs Mixed-mode regulation Power from 175W to 420W Switched remote sense terminals RS-232 interface model available       EX-R series Model Outputs Voltage / Current Power Interfaces EX355R One 0 to 35V / 0 to 5A 175W - EX355P One 0 to 35V / 0 to 5A 175W RS232 EX355P-USB One 0 to 35V / 0 to 5A 175W USB EX1810R One 0 to 18V / 0 to 10A 180W - EX2020R One 0 to 20V / 0 to 20A 400W - EX4210R One 0 to 42V / 0 to 10A 420W - EX354RD Two 2 x (0 to 35V / 0 to 4A) 280W - EX354RT Three 2 x (0 to 35V / 0 to 4A) plus 1.5 to 5.0V @ 5A 305W EX752M Two 2 x (0 to 75V / 0 to 2A) or 0 to 75V / 0 to 4A or 0 to 150V / 0 to 2A 300W Brief specifications for main outputs: Line & load regulation: <0.01%. Output noise: < 2mV rms. Meter accuracies: voltage - 0.3% ± 1digit, current - 0.6% ± 1digit. Sizes: singles - 140 x 160 x 295mm; dual/triple - 260 x 160 x 295mm (WxHxD) The EX752M is a dual output 300 watt PSU with Multi-Mode capability. This enables it to operate as a dual power supply with two independent and isolated outputs, or as a single power supply of double the power.  As a dual, each output provides 0 to 75V at 0 to 2A (mode A). As a single, the output can be selected as either 0 to 75V at 0 to 4A (mode B) or 0 to 150V at 0 to 2A (mode C). In single modes, the unused half of the unit becomes completely inoperative and its displays are blanked. For those requiring a basic bus controllable power supply, versions with an RS-232 interface (EL302P) or a USB interface (EL302P-USB) are available.  The EX series is the value-for-money PSU for users who require higher power levels. Mixed-mode regulation gives excellent performance combined with compact size and low weight. Dual output and triple output models are available in a similar casing style. The EX354RT triple (illustrated) has a variable voltage auxiliary output which can be set using the digital displays.  ** Note that the EX2020R and EX4210R use fan assisted cooling. All-linear regulation becomes impractical at higher power levels, so Aim-TTi have developed a technology that combines HF switch-mode pre-regulation with linear final regulation. This technique combines exceptional efficiency with noise levels that are close to that of pure linears. Mixed-mode regulation is used in the EX-R and TSX series. * Note that 3 digit current meters are used on the EX355P and EX752M and that voltmeter resolution on the EX752M is 0.1V. * Note that a 3 digit current meters is used on the EL302P & EL302P-USB, and that these models do not have remote sense terminals. http://www.farnell.com/datasheets/1796748.pdf SS-331 LCD Desoldering Station User’s Manual 1st Edition, ©2014 Copyright by Prokit’s Industries Co., Ltd. 1 Description SS‐331 designed for lead free desoldering especially. The quick heating and strong power are for convenient and clear soldering / desoldering all types of DIP components. Reasonable structure, single hand operation and strong absorbing power can be easy removal of the residual solder from the one‐sided or two sided of the PCB. This tool is used in the fields of electronic research, teaching and production, especially in the repairing and desoldering on the electronic appliances and communication equipments. 1. Control Unit The desoldering iron gun is controlled automatically by the micro‐processor. The digital control electronics and high‐quality sensor and heat exchange system guarantee precise temperature control at the soldering tip. The highest degree of temperature precision and optimal dynamic thermal behavior under load conditions is obtained by the quick and accurate recording of the measured values in a closed control circuit, and this design is especially for the lead‐free production techniques. 2. Desoldering Iron gun Desoldering iron gun with a power of 60W(Heat up rating 130W)and a wide spectrum of soldering tips can be used anywhere in the electronics field. The high power and gun type design make this iron gun suitable for fine desoldering work. The heating element is made of ceramic and the sensor on the desoldering tip can control the desoldering temperature quickly and accurately. 2 Technical Specification Voltage 220~240V AC Power Consumption 140W Temperature 160°C ~ 480°C Vacuum Pressure 600mm Hg Heating Element Ceramic Heater Accessories Spare tip x 3 ( 0.8(on the gun)1.0/  1.3mm) Cleaning tool x 3 (0.7/0.9/ 1.2mm) Filter sponge x 4 (φ20.8x1 +φ16.8x3) Certificate CE, GS, RoHS Station Size (mm) 225 x 160 x 130 Weight (kgs) 2.5 Operating Instruction Caution:Make sure that the four screws which are used to fasten the Diaphragm pump are removed from the control system before use. Otherwise serious damages may be caused to the user and the system. 1. Place the desoldering iron gun in the holder separately. Then connect the plug to the receptacle on the station and turn clockwise to tighten the plug nut. Check that the power supply is corresponding to the specification on the type plate and the power switch is on the “OFF” position. Connect the control unit to the power supply and switch on the power. Then a self‐test is carried out in which all display elements are switched on briefly. The electronic system then switches on automatically to the set temperature and displays this value. 2. The display and temperature setting ①. Shows the actual temperature of the desoldering tip. ②. Shows the setting temperature: Pressing the “UP” or “DOWN” button can switch the digital display to the set point display. The set‐point can be changed for ±1℃ by tapping the “UP” or “DOWN” button. Pressing the button will change the set‐point quickly. The digital display will return automatically to the actual value and the iron will reach to the setting temperature quickly. ③. ℃/℉ display: Switching the temperature display from ℃ to ℉ by pressing the “℃/℉”button and then the electronic system will display the actual temperature① and setting temperature② in ℉, and vice versa. ④. When the actual temperature on the soldering tip is less than the set‐point, “HEAT ON” will display and make the desoldering tip heating up. ⑤. When the absolute offset is more than ±10℃ between the actual temperature and the set‐point on the soldering tip or the nozzle, “WAIT” will display. It means that the temperature electronic control system is not in the stable situation, we should wait a moment to let the “WAIT” disappear. ⑥. When “ERROR” display, there may be a trouble on the 3 4 Safety Instruction 1. The manufacturer assumes no liability for uses other than those described in the operating instructions or for unauthorized alterations. 2. The operating instructions and cautions should be read carefully and kept in an easily visible location in the vicinity of the control system. Non‐observance of the cautions will result in accidents, injury or risks to health. Caution 1. The power cord only can be inserted in approved power sockets or adapters. 2. High Temperature The temperature of the soldering tip will reach as high as around 400℃(752℉) when the power switch is on. Since mishandling may lead to burns and fire, be sure to comply with the following precautions: ①. Do not touch metallic parts near the soldering tip/ nozzle. ②. Do not use this system near the flammable items. ③. Advise other people in the work area that the unit can reach a very high temperature and should be considered potentially dangerous. ④. Turn off the power switch while taking breaks and when finishing using. ⑤. Before replacing parts or storing the system, turn off the power and let it cool down to the room temperature. ⑥. Warning: this tool must be placed on its stand when not in use. 5 ⑦. A fire may result if the appliance is not used with care, therefore: 1) Be careful when using the appliance in places where there is combustible material. 2) Do not apply to the same place for a long time. 3) Do not use in presence of an explosive atmosphere. 4) Be aware heat may be conducted to combustible materials that out of sight. 5) Place the appliance on its stand after use and allow it to cool down before storage. 6) Do not leave the appliance unattended when it is switched on. 3. Take care of your tools Do not use the tools for any applications other than soldering or desoldering. Do not rap the iron against the work bench or otherwise subject the iron to severe shocks. Do not file the soldering tip to remove the oxide, please wipe the tip on the cleaning sponge. Use only accessories or attachments which are listed in the operation manual. Use of other tools and other accessories can lead to a danger of injury. Please turn off the power before connecting or disconnecting the soldering iron. 4. Maintenance Before further use, safety devices or slightly damaged parts must be carefully checked for error‐free and intended operation. Inspect moving parts for error‐free operation and that they don’t bind, or whether any parts are damaged. Damaged safety devices and parts must be repaired or replaced by a qualified technician, so long as nothing else is indicated in the operation manual. Use only accessories or 6 attachments which are listed in the operation manual. Use of other tools and other accessories can lead to a danger of injury. 5. Keep children at a distance Warning: this appliance is not intended for use by young children and infirm persons unless they have been adequately supervised by a responsible person to ensure that they can use the appliance safely. Warning: Young children should be supervised to ensure that they do not play with the appliance. Unused soldering tools should be stored in a dry location which is out of the reach of children. Switch off all unused soldering tools. 6. Protect yourself against electrical shocks Avoid touching grounded parts with your body, e.g. pipes, heating radiators and so on. The grip of antistatic designed soldering tool is conductive. 7. Work environment Do not use the soldering tool in a moist or wet environment. The soldering iron should be placed on the holder after finished using. 8. Observe the valid safety regulations at your work place. SS-331數顯吸焊台 概述 SS-331 特別為無鉛吸焊而設計。快速升溫和大功率的特點使其可以方便快速的焊接/拆焊所有類型的DIP元器件。 合理的結構,單手操作和強大的吸焊功率能夠輕鬆的從PCB一面或兩面除去殘餘錫渣。 目前已廣泛的應用於電子科研,教學以及生產等單位,特別是家電維修和通訊器材維修人員所不可缺少的首選專用工具。 1. 控制單元 吸焊槍由微處理器自動控制。數位控制裝置和高品質的感測器及加熱交換系統保證對烙鐵頭的溫度進行精確的控制。通過快速準確的記錄閉和控制回路測量可以獲得作高的溫度精度和帶負載狀況下最佳熱量轉遞性能,特別適合用於無鉛制程工藝。 2. 吸焊槍 (5SS-331-DG) 吸焊槍的功率為 60W(額定加熱功率 130W),可以配各種尺寸的烙鐵頭(U系列),廣泛應用於電子領域。 大功率和細長外形設計使這個電烙鐵適合做精密的焊接操作,發熱芯採用陶瓷發熱材料製作,頂端溫度感測器設計其特點在於能夠快速並準確的控制焊接溫度。 7 技術規範. 電壓 220~240V AC 消耗功率 140W 溫度 160°C ~ 480°C 真空吸力 600mm Hg 發熱原件 陶磁發熱芯 配件 吸嘴 x 3(0.8(裝在吸槍上)1.0/  1.3mm) 通針 x 3( 0.7/  0.9/  1.2mm) 過濾棉 x 4 ( 20.8mm x1 +  16.8mm x3) 認證 CE, GS, RoHS 尺寸(mm) 225 x 160 x 130 重量(kgs ) 2.5 操作說明: 1 將吸焊槍放置在支架上。然後將插頭插入插座順時針方向鎖緊螺母。檢查供電電源符合本產品的規格並確認總電源開關處於OFF的位置。接通控制系統的電源並打開電源開關。系統進行自檢,所有的液晶顯示都暫時被點亮。電子系統自動打開並迅速達到設定的溫度值。 2 顯示幕和溫度設置: 數位顯示說明: ① . 顯示吸焊烙鐵頭的實際溫度。 8 9 ② . 顯示的是設定溫度,通過按“UP"或“DOWN"鍵來改變設定值。輕壓單下“UP"或“DOWN"鍵設定值將以±1℃變化,持續按下“UP"或“DOWN"鍵設定值將會快速改變。改變設定值後,電子系統自動工作,顯示溫度會迅速到達設定值。 ③ . ℃或℉溫度,通過按“℃/℉"按鈕切換攝氏或華氏溫度,切換後電子系統會自動顯示的攝氏或華氏實際溫度①和設定溫度②數值。 ④ . 當烙鐵頭實際溫度小於設定溫度時顯示“HEAT ON"表示電子系統對烙鐵正在加熱。 ⑤ . 當烙鐵頭實際溫度與設定溫度的絕對偏差大於±10℃時顯示“WAIT",表示電子控溫系統還沒到達穩定狀態,請稍做等待,待“WAIT"不顯示時即可正常使用了。 ⑥ . 顯示“---"則表示系統有故障,或者是電烙鐵沒有正確連接到控制系統。 3 安全操作說明 3.1 製造商對於超出操作說明中所到的其他使用或未經授權的更改,不負任何責任。 3.2 應仔細閱讀操作說明及警告並將其放置在控制系統附近,如不遵守這些警告,將有可能發生意外事故,人體傷害或健康傷害。 4 警告及注意事項 4.1 電源線只能插入經認證過的電源插座或適配器中。 4.2 小心高溫:在開機狀態下,烙鐵頭或熱風槍焊嘴的溫度可以達到大約400℃(752℉)左右,由於不正確的操作可能會造成燒傷或引起火災,故應確保遵守以下預防措施:  不要讓金屬部件接觸到焊嘴和烙鐵頭;  不要在易燃物品附近使用該系統;  告知工作區域中的其他人員此設備會達到非常高的溫度應注意識別其潛在的危險性;  在休息及使用完後應關閉總電源  在更換零件或儲存前,應關閉總電源並讓其冷卻到 10 室溫  警告:不用時一定要將此工具放置在特定的支架上。  如使用不當可能會引起火災,因此  在有易燃物品的場所使用該設備一定要小心;  不要長時間在同一位置使用該設備;  不要在有爆炸性氣體的場所使用;  要知道熱量有可能會引燃不在視線範圍內的可燃物質;  使用完畢後要將器具放置在特定的支架上,且要在冷卻後方可收藏起來;  離開時必須要關閉電源開關。 4.3 愛護工具  不要將此設備用於焊接或脫焊以外的其他操作。  不要在工作臺上敲打電烙鐵或熱風筒或其他嚴重的撞擊。  不要銼烙鐵頭上的氧化層,請使用浸水的清潔棉擦除氧化層。  確保使用操作說明上列明的附件或配件,使用其他的工具或其他配件使本系統損壞或會有受傷的危險。  在接通或斷開錫槍前應先關閉電源。 4.4 工具保養 在使用前,應仔細檢查安全裝置或有輕微損害的零件無故障及在指定操作狀態。檢查活動的零件無故障操作,並且沒有繞線及零件損壞。已損壞的安全設備及零件都應由有資格的專業人員進行維修或更換。只使用操作說明中列出的配件。如果使用其他工具或配件有可能對操作人員造成傷害。 4.5 放置在兒童接觸不到的地方 警告:老人和兒童必須在監護人在場確保可安全使用的情況下方可使用該設備。警告:應確保兒童在沒有監護的情況下無法接觸到該設 備。 4.6 不用的焊接工具應存放在乾燥的,兒童接觸不到的地方。而且應該關閉所有未在使用狀態下的焊接工具的電源。 4.7 避免遭受電擊 避免用身體接觸接地零件,如:烙鐵管,散熱器等。抗靜電設計的焊接工具的把手是導電的。 4.8 工作環境 不要在潮濕的環境中使用焊接工具。電烙鐵及熱風槍用完後要放回到支架上。 4.9 遵守工作場所中的安全操作規定。 寶工實業股份有限公司 PROKIT’S INDUSTRIES CO., LTD. http://www.prokits.com.tw E-mail:pk@mail.prokits.com.tw ©2014 Prokit’s Industries Co., LTD. All rights reserved 2014001(C) Connections to a Wider Range of Slaves Ensured by Upgraded Models Master Conventional models New models C200HW-SRM21 CQM1-SRM21 SRM1-C01 SRM1-C02 SRM1-C01-V1 SRM1-C02-V1 3G8B3-SRM00 3G8B3-SRM01 C200PC-ISA02-SRM C200PC-ISA12-SRM C200HW-SRM21-V1 CQM1-SRM21-V1 SRM1-C01-V2 SRM1-C02-V2 NKE-made Uniwire C B /SS d Communications mode Slave ade U e CompoBus/S Send Unit SDD-CS1 High-speed communications mode Long-distance communications mode SRT1 Series FND-X􀀀-SRT Yes Yes Yes Yes No No Products from other companies SMC Solenoid valve for SI manifold use VQ Series SX Series SY Series Yes Yes Yes Yes Yes Yes No No No CKD Solenoid valve for saving wiring effort 4TB1 and 4TB2 Series 4TB3 and 4TB4 Series 4G Series MN4SO Series Yes Yes Yes Yes Yes Yes Yes Yes No No No No Koganei Valve for saving wiring effort YS1A1, A2 YS2A1, A2 Yes Yes Yes Yes No No New product SRT2-AD02 SRT2-DA02 No No Yes Yes Yes Yes SRT2-VID08S(-1) SRT2-VOD08S(-1) SRT2-VID16ML(-1) SRT2-VOD16ML(-1) Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes SRT2-ID16(-1) SRT2-OD16(-1) SRT2-ID08(-1) SRT2-OD08(-1) SRT2-ROC16 SRT2-ROF16 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes CPM1A-SRT21 Yes Yes Yes Products to be released soon SRT2-ID04(-1) SRT2-OD04(-1) SRT2-ID16T(-1) SRT2-OD16T(-1) SRT2-MD16T(-1) SRT2-ROC08 SRT2-ROF08 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Note: 1. In high-speed communications mode, the maximum transmission distance is 100 m at a baud rate of 750 kbps. In long-distance communications mode (i.e., a newly available mode), the maximum transmission distance is 500 m at a baud rate of 93.75 kbps. 2. The SRT2-AD04 and SRT2-DA02 are available for 16-bit synchronous communications. 11 Master Control Unit SRM1-C01-V2/C02-V2 Subminiature, Stand-alone Model with CompoBus/S Master and SYSMAC Controller Functions Maximum number of Remote I/O points per Master: 256 Maximum number of Slaves per Master: 32 Communications cycle time: 0.5 ms max. (at baud rate 750 kbps). Communications distance: Extended to 500 m max. (at baud rate 93.75 kbps). Additional instructions (PID, SCL, NEG, ZCP) ensure analog compatibility. RS-232C port incorporated (SRM1-C02-V2). RC Ordering Information Specifications Model Buuilt-in sstaandd-aaloonee ccoontroolleer fuuncctioonss Without RS-232C SRM1-C01-V2 With RS-232C SRM1-C02-V2 Specifications Master Specifications Number of I/O points 256 points (128 inputs/128 outputs) 128 points (64 inputs/64 outputs) Selectable by DM setting. The default setting is 256 points. Max. number of Slaves per Master 256 points: 32 128 points: 16 I/O words Input words: 000 to 007 Output words: 010 to 017 Programming language Ladder diagram Types of instruction 14 basic and 72 special instructions (123 instructions in total) Execution time LD instruction: 0.97 ms MOV instruction: 9.1 ms Program capacity 4,096 words Data memory 2,048 + 512 (read-only) words Timers/Counters 128 timers/counters Work bits 640 bits Memory backup Flash memory (without battery): User programs Super capacitor: Data memory (backed up for 20 days at an ambient temperature of 25°C) Peripheral port 1 point RS-232C port 1 point (SRM1-C02-V1 only) Host Link, NT Link, 1:1 Link, or no protocol Programming tool Programming Consoles: CQM1-PRO01-E, C200H-PRO27-E SYSMAC-CPT: WS01-CPTB1-E (CD-ROM/FD) SYSMAC Support Software (MS-DOS version): C500-ZL3AT1-E Note: PID, SCL, NEG, and ZCP instructions are not supported by the SYSMAC-CPT. SRM1-C01-V2/C02-V2 SRM1-C01-V2/C02-V2 12 Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note 1) Communications baud rate 750,000 bps/93,750 bps (see note 2) Communications cycle time High-speed comm nications 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Long-distance comm nications 4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance High-speed communications mode VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Long-distance communications mode VCTF cable: Main line length: 500 m max. Branch line length: 6 m max. Total branch line length: 120 m max. Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: 1. A terminator must be connected to the point in the system farthest from the Master. 2. The communications baud rate is switched using DM settings (default setting is 750,000 bps). General Specifications Supply voltage 24 VDC Allowable supply voltage 20.4 to 26.4 VDC Power consumption 3.5 W max. Inrush current 12.0 A max. Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 57 Hz, 0.075-mm amplitude, 57 to 150 Hz, acceleration: 9.8 m/s2 in X, Y, and Z directions for 80 minutes each (Time coefficient; 8 minutes × coefficient factor 10 = total time 80 minutes) Shock resistance 147 m/s2 three times each in X, Y, and Z directions Ambient temperature Operating: 0°C to 55°C Storage: –20°C to 75°C Humidity 10% to 90% (with no condensation) Atmosphere Must be free from corrosive gas. Terminal screw size M3 Power interrupt time DC type: 2 ms min. Weight 150 g max. SRM1-C01-V2/C02-V2 SRM1-C01-V2/C02-V2 13 Nomenclature SRM1-C01-V2 SRM1-C02-V2 CPU Unit status indicator CompoBus/S communications status indicator Indicates the status of the Compo- Bus/S in operation and in communication with Slaves. Peripheral port communications status indicator Flashes when the peripheral port or RS-232C port is in communication. Connector cover Peripheral port Connect this port to programming tools through dedicated cables. Terminal block Connector cover RS-232C port Connect this port to the RS-232C interfaces of personal computers and Programmable Terminals. Dimensions Note: All units are in millimeters unless otherwise indicated. SRM1-C01/C02-V2 The above dimensions apply to the SRM1-C02-V2. The SRM-C01-V2 has no RS-232C port. 14 Master Unit C200HW-SRM21-V1 Master Unit for CS1, C200HX, C200HG, C200HE, and C200HS A maximum of 256 I/O points available. Connects to a maximum of 32 Slaves. Communications cycle time: 0.5 ms max. (at baud rate 750 kbps). Communications distance: Extended to 500 m max. (at baud rate 93.75 kbps). Connection to Analog Terminals now supported. RC Ordering Information PC Max. number of I/O points Model C200HX (-Z), C200HG (-Z), C200HE (-Z), C200HS, CS1 256 points (128 inputs/128 outputs) C200HW-SRM21-V1 Specifications Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note 1) Communications baud rate 750,000 bps, 93,750 bps (see note 2) Communications cycle time High-speed comm nications 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Long-distance comm nications 4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance High-speed communications mode VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Long-distance communications mode VCTF cable: Main line length: 500 m max. Branch line length: 6 m max. Total branch line length: 120 m max. Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: 1. A terminator must be connected to the point in the system farthest from the Master. 2. The communications baud rate is switched with the DIP switch. C200HW-SRM21-V1 C200HW-SRM21-V1 15 Unit Specifications Current consumption 150 mA max. at 5 VDC Number of I/O points 256 points (128 inputs/128 outputs), 128 points (64 inputs/64 outputs) (switchable) Number of occupied words 256 points: 20 words (8 input words/8 output words, 4 status data) 128 points: 10 words (4 input words/4 output words, 2 status data) PC CS1, C200HX (-ZE), C200HG (-ZE), C200HE (-ZE), C200HS Number of points per node number 8 points Max. number of Slaves per Master 32 Status data Communications Error Flag and Active Slave Node (see note) Weight 200 g max. Approved standards UL 508 (E95399), CSA C22.2 No. 142 (LR51460) Note: These flags use the AR area. Ratings The ratings of the Unit are the same as those of the CS1, C200HX, C200HG, C200HE, and C200HS. Nomenclature Indicators Indicates the operating status of the Master Unit and the status of communications with the Slaves. Rotary Switch This switch sets the Master’s one-digit hexadecimal unit number. DIP Switch These pins have the following functions: Pin 1: Max. number of Slaves setting Pin 2: Baud rate setting Pins 3 to 4: Reserved (Always OFF.) Communications Terminals Connect the Slaves’ transmission cable to these terminals. C200HW-SRM21-V1 C200HW-SRM21-V1 16 Dimensions Note: All units are in millimeters unless otherwise indicated. C200HW-SRM21-V1 Note: Refer to the C200HX, C200HG, C200HE, C200HS, or CS1 Operation Manual for details on the dimensions when the Master Unit is installed in the PC’s Backplane. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. 17 Master Unit CQM1-SRM21-V1 Master Unit for CQM1 A maximum of 128 I/O points available (Possible to set 32, 64, or 128 I/O points). Connects to a maximum of 16/32 Slaves. Communications cycle time: 0.5 ms max. (at baud rate 750 kbps). Communications distance: Extended to 500 m max. (at baud rate 93.75 kbps). Connection to Analog Terminals now supported. RC Ordering Information PC Max. number of I/O points Model CQM1-series PC 128 points (64 inputs/64 outputs) CQM1-SRM21-V1 Specifications Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note 1) Communications baud rate 750,000 bps, 93,750 bps (see note 2) Communications cycle time High-speed comm nications 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Long-distance comm nications 4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance High-speed communications mode VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Long-distance communications mode VCTF cable:: Main line length: 500 m max. Branch line length: 6 m max. Total branch line length: 120 m max. Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: 1. A terminator must be connected to the point in the system farthest from the Master. 2. The communications baud rate is switched with the DIP switch. CQM1-SRM21-V1 CQM1-SRM21-V1 18 Unit Specifications Current consumption 180 mA max. at 5 VDC Number of I/O points 128 points (64 inputs/64 outputs), 64 points (32 inputs/32 outputs), 32 points (16 inputs/16 outputs) (switchable) Number of occupied words 128 points: 4 input words/4 output words 64 points: 2 input words/2 output words 32 points: 1 input word/1 output word PC 128 points: CQM1-CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1 64 points: CQM1-CPU11-E/CPU21-E/CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1 32 points: CQM1-CPU11-E/CPU21-E/CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1 Number of points per node number 4/8 points (switchable) Max. number of Slaves per Master 32 (4 points per node number) Status data Alarm terminal output Weight 200 g max. Approved standards UL 508 (E95399), CSA C22.2 No. 142 (LR51460) Alarm Output Specifications Maximum switching capacity 2 A at 24 VDC Minimum switching capacity 10 mA at 5 VDC Relay G6D-1A Minimum ON time 100 ms Circuit configuration 2 A at 24 VDC max. Internal circuit CQM1-SRM21-V1 Ratings The ratings of the Unit are the same as those for the CQM1. Nomenclature Indicators Indicates the operating status of the Master Unit and the status of communications with the Slaves. DIP Switch These pins have the following functions: Pins 1 and 2: PC word allocation setting Pin 3: Number of points setting Pin 4: Baud rate setting Pins 5 to 6: Reserved (Always OFF.) Alarm Output Terminals These terminals are shorted when an error occurs. Connect to a warning device. Communications Terminals Connect the Slaves’ transmission cable to these terminals. Terminal block screws These screws attach the terminal block. The terminal block can be removed when these screws are loosened. CQM1-SRM21-V1 CQM1-SRM21-V1 19 Dimensions Note: All units are in millimeters unless otherwise indicated. CQM1-SRM21-V1 Note: Refer to the CQM1 Operation Manual for details on the dimensions when the Master Unit is installed in the PC’s Backplane. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. 20 SYSMAC Board C200PC-ISA􀀀2-SRM SYSMAC C200HX/HG/HE and CompoBus/S Master Functions Integrated into a Single PCB Operates as a Programmable Controller to be built into personal computers. Programming is possible through Programming Devices like the programming on C200HX/HG. An optional Expansion Board is available for serial communications. Dedicated library in C is available for control. Driver for Windows use is available. Connects to a maximum of three Expansion I/O Racks. CompoBus/S Slave data is automatically read. Ordering Information PC Max. number of I/O points Model C200HG-CPU43 256 points ( 128 inputs/128 outputs) C200PC-ISA02-SRM C200HX-CPU64 56 o s 8 u s/ 8 ou u s) C200PC-ISA12-SRM Specifications Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note) Communications baud rate 750,000 bps Communications cycle time 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: A terminator must be connected to the point in the system farthest from the Master. C200PC-ISA􀀀2-SRM C200PC-ISA􀀀2-SRM 21 Unit Specifications Power supply voltage 4.875 to 5.25 VDC Current consumption 0.5 A max. (see note 1) Number of I/O points 256 points (128 inputs/128 outputs), 128 points (64 inputs/64 outputs), (switchable) Number of occupied words 256 points: 20 words (8 input words, 8 output words, and 4 status data words) (see note 2) 128 points: 10 words (4 input words, 4 output words, and 2 status data words) Number of points per node number 8 points Max. number of Slaves per Master 32 Status data Communications Error Flag and Active Slave Node (see note 2) Weight 200 g max. Note: 1. The current consumption will be 0.8 A max. if the Programming Console is connected through the optional Expansion Board. 2. The occupied words are in the IR area. 22 I/O Link Unit CPM1A-SRT21 I/O Link Unit for CPM2A/CPM1A Operates as a Slave of the CompoBus/S Master Unit. Exchanges eight inputs and eight outputs with the Master. Approved by UL and CSA standards, and bears the CE marking. RC Ordering Information CPU Units I/O configuration Power supply Output method Input Output Model 30-point I/O model AC Relay 18 12 CPM1A-30CDR-A* DC Relay CPM1A-30CDR-D* Transistor (sink) CPM1A-30CDT-D Transistor (source) CPM1A-30CDT1-D AC Relay CPM2A-30CDR-A DC Relay CPM2A-30CDR-D Transistor (sink) CPM2A-30CDT-D Transistor (source) CPM2A-30CDT1-D 40-point I/O model AC Relay 24 16 CPM1A-40CDR-A* DC Relay CPM1A-40CDR-D* Transistor (sink) CPM1A-40CDT-D Transistor (source) CPM1A-40CDT1-D AC Relay CPM2A-40CDR-A DC Relay CPM2A-40CDR-D Transistor (sink) CPM2A-40CDT-D Transistor (source) CPM2A-40CDT1-D 60-point I/O model AC Relay 36 24 CPM2A-60CDR-A DC Relay CPM2A-60CDR-D Transistor (sink) CPM2A-60CDT-D Transistor (source) CPM2A-60CDT1-D Note: Models marked with asterisks do not bear CE markings. Expansion Units Product Number of connectable Units per CPU Unit Output method Input Output Model Expansion I/O Units 3 max. (see note) Relay 12 8 CPM1A-20EDR1 Transistor (sink) CPM1A-20EDT Transistor (source) CPM1A-20EDT1 --- 8 --- CPM1A-8ED Relay --- 8 CPM1A-8ER Transistor (sink) --- 8 CPM1A-8ET Transistor (source) CPM1A-8ET1 Analog I/O Unit 3 max. (see note) Analog 2 1 CPM1A-MAD01 CompoBus/S I/O Link Unit 3 max. (see note) --- 8 I/O link points 8 I/O link points CPM1A-SRT21 Note: Only a single Unit will be connectable if the NT-AL001 is connected to the RS-232C port. CPM1A-SRT21 CPM1A-SRT21 23 Specifications Slave CompoBus/S Slave Number of I/O points 8 inputs and 8 outputs Number of occupied I/O memory words of CPM2A 1 input word and 1 output word (same as other Expansion Units in allocation) Node address setting DIP switch Dimensions Note: All units are in millimeters unless otherwise indicated. CPM1A-SRT21 Installation Connection Examples CompoBus/S Master Unit or SRM1 CompoBus/S Master Control Unit CPM1A or CPM2A CPU Unit CPM1A-SRT21 CompoBus/S I/O Link Unit CS1􀀀 C200H􀀀 CQM1 SRM1 Dedicated flat cable or VCTF cable Connectable to 16 Units max. (Eight CQM1-SRM21 Units max.) Note: A single CompoBus/S I/O Link Unit together with a maximum of two other Expansion I/O Units can be connected to the CPM1A or CPM2A CPU Unit. 24 Transistor Remote Terminal SRT-ID/OD Long-distance Communications Supported by SRT2 Models (Long-distance/High-speed Communications Selection) SRT1 models support high-speed communications only. SRT2 models support long-distance communications and high-speed communications. Ultra-compact at 80 x 48 x 50 (W x H x D) mm for 4-point and 8-point terminals and 105 x 48 x 50 (W x H x D) mm for 16-point terminals. Two independent power supplies can be used because the I/O terminals are insulated from the internal circuits. DIN track mounting and screw mounting are both supported. RC Ordering Information I/O classification Internal I/O circuit common I/O points Rated voltage I/O rated voltage Model Input NPN (+ common) 4 24 VDC 24 VDC SRT1-ID04 PNP (– common) C C SRT1-ID04-1 Output NPN (– common) SRT1-OD04 PNP (+ common) SRT1-OD04-1 Input NPN (+ common) 8 SRT2-ID08 PNP (– common) SRT2-ID08-1 Output NPN (– common) SRT2-OD08 PNP (+ common) SRT2-OD08-1 Input NPN (+ common) 16 SRT2-ID16 PNP (– common) 6 SRT2-ID16-1 Output NPN (– common) SRT2-OD16 PNP (+ common) SRT2-OD16-1 Note: For more details about connections supported by the Master Unit, refer to page 10. Specifications Ratings Inputs Input current 6 mA max./point ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage 15 VDC min. between each input terminal and V OFF voltage 5 VDC max. between each input terminal and V OFF current 1 mA max. Insulation method Photocoupler Input indicators LED (yellow) SRT-ID/OD SRT-ID/OD 25 Outputs Rated output current 0.3 A/point Residual voltage 0.6 V max. Leakage current 0.1 mA max. Insulation method Photocoupler Output indicators LED (yellow) Characteristics Communications power supply voltage 14 to 26.4 VDC I/O power supply voltage 24 VDC +10%/–15% I/O power supply current 1 A max. Current consumption (see note) 50 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Connecting Units 4-point and 8-point Terminals: 16 Input Terminals and 16 Output Terminals per Master 16-point Terminals: 8 Input Terminals and 8 Output Terminals per Master Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting strength No damage when 50 N pull load was applied for 10 s in all directions Terminal strength No damage when 50 N pull load was applied for 10 s Screw tightening torque 0.6 to 1.18 N 􀀀 m Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 4-point and 8-point Terminals: 80 g max. 16-point Terminals: 110 g max. Approved standards (4/8 points) UL 508, CSA C22.2 No. 14 Note: The above current consumption is the value with all 4 and 8 and 16 points turned ON excluding the current consumption of the external sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal. SRT-ID/OD SRT-ID/OD 26 Nomenclature I/O Terminals I/O Power Supply Terminals Connect 24-VDC power supply Communications Power Supply Terminals Connect 14- to 26.4-VDC power supply. CompoBus/S Terminal Connect the CompoBus/S DIP Switch communications cable. Used for node number setting and holding or clearing outputs for communications error. Refer to the Compobus/S Operation Manual (W266) for details on DIP switch settings. Baud rate setting 0 to 7 ERR COMM PWR Node Number Settings Output HOLD/CLEAR settings (Output Terminals only) Screw mounting hole Indicators Indicator Display Color Meaning PWR Lit Green The communications power supply is ON. Not lit The communications power supply is OFF. COMM Lit Yellow Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Lit Red A communications error has occurred. Not lit Normal communications or the Unit is in standby status. 0 to 7 Lit Yellow The corresponding I/O signal is ON. Not lit The corresponding I/O signal is OFF. Output HOLD/CLEAR Mode Mode Pin 1 Setting HOLD ON Output status is maintained. CLEAR OFF Output status is cleared when a communications error occurs. Note: 1. Pin 1 is factory-set to OFF. 2. This function is available to Output Terminals only. SRT-ID/OD SRT-ID/OD 27 Node Number Settings Node number Pin 3 Pin 4 Pin 5 Pin 6 8 4 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF ON 14 ON ON ON OFF 15 ON ON ON ON Note: 1. The node number is factory-set to 0. 2. For node number settings, refer to the CompoBus/S Operation Manual (W266). Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID04 (-1) SRT1-OD04 (-1) SRT2-ID08 (-1) SRT2-OD08 (-1) (54) 27 80 48 65 Two, 4.2 dia. or M4 Sixteen, M3 Mounting Holes (20.5) (11) SRT-ID/OD SRT-ID/OD 28 SRT2-ID16 (-1) SRT2-OD16 (-1) 48 Two, 4.2 dia. or M4 (50) (28) Mounting Holes (54) 27 50 (20.5) (11) 105 22–M3 Installation Internal Circuit Configuration SRT1-ID04 SRT1-ID04-1 Photocoupler Photocoupler Internal circuit Internal circuit 24 VDC(+) Photocoupler Photocoupler (–) SRT1-OD04 Internal circuit 24 VDC Photocoupler Photocoupler Voltage stepdown SRT1-OD04-1 Internal circuit Photocoupler Photocoupler 24 VDC (P) (P) 24 VDC (P) (P) Voltage stepdown V V V 1 G 0 2 G G V V V 1 V 0 2 G SRT-ID/OD SRT-ID/OD 29 SRT2-OD08-1 Internal circuit Photocoupler Photocoupler SRT2-ID08 SRT2-ID08-1 Photocoupler Photocoupler Internal circuit 24 VDC(+) Internal circuit Photocoupler Photocoupler (–) SRT2-OD08 Internal circuit 24 VDC Photocoupler Photocoupler Voltage stepdown SRT2-ID16 Photocoupler Internal Photocoupler circuit SRT2-ID16-1 Internal circuit Photocoupler Photocoupler Internal circuit SRT2-OD16 Photocoupler Photocoupler Voltage stepdown SRT2-OD16-1 Internal circuit Photocoupler Photocoupler Voltage stepdown 24 VDC (P) 24 VDC (P) (P) Voltage stepdown (P) 24 VDC (P) (P) 24 VDC (P) (P) V V 1 0 2 G G V V 1 0 2 G V V 1 0 2 G SRT-ID/OD SRT-ID/OD 30 External Connections (NPN Models) Input Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Three-wired Sensors SRT1-ID04 with NPN Output SRT2-ID08 and SRT2-ID16 with NPN Output Two-wired Sensors SRT1-ID04 SRT2-ID08 and SRT2-ID16 Sensor 1 Blue Brown Sensor 2 Blue Brown Sensor 1 Blue Brown Sensor 2 Blue Brown Output SRT1-OD04 SRT2-OD08 and SRT2-ID16 L 1 L 2 L 1 L 2 Terminal Arrangement and I/O Device Connection Example (PNP Models) Note: The connections examples shown are for PNP models. Input SRT1-ID04 SRT2-ID08 Output SRT1-OD04 SRT2-OD08 Blue Brown Blue Brown Blue Brown Brown Blue Communications path Communications power supply power supply power supply Communications path Communications power supply Communications path Communications power supply power supply Photoelectric sensor or proximity sensor (threewired sensor with a builtin- amplifier) Limit switch (two-wired sensor) Solenoid, valve Solenoid I/O Communications path Communications power supply Photoelectric sensor or proximity sensor (threewired sensor with a builtin- amplifier) Limit switch (two-wired sensor) Black Black SRT2-ID16 SRT2-OD16 Communications path Communications power supply I/O power supply Photoelectric sensor or proximity sensor (threewired sensor with a builtin- amplifier) Limit switch (two-wired sensor) I/O power supply Communications path Communications power supply Solenoid Valve Valve power supply I/O Blue Brown Blue Brown Black I/O I/O SRT-ID/OD SRT-ID/OD 31 External Connections (PNP Models) Input Three-wired Sensors SRT1-ID04-1 with NPN Output SRT2-ID08-1 and SRT2-ID16-1 with NPN Output Two-wired Sensors SRT1-ID04-1 SRT2-ID08-1 and SRT2-ID16-1 Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Sensor 1 Blue Brown Sensor 2 Blue Brown Sensor 1 Blue Brown Sensor 2 Blue Brown Output SRT1-OD04-1 SRT2-OD08-1 and SRT2-ID16-1 L 1 L 2 L 1 L 2 Terminal Arrangement and I/O Device Connection Example (PNP Models) Note: The connections examples shown are for NPN models. Input SRT1-ID04-1 SRT2-ID08-1 Output SRT1-OD04-1 SRT2-OD08-1 Blue Brown Blue Brown Blue Brown Brown Blue Communications path Communications power supply power supply power supply Communications path Communications power supply Communications path Communications power supply power supply Photoelectric sensor or proximity sensor (three-wired sensor with a built-in-amplifier) Limit switch (two-wired sensor) Solenoid, valve Solenoid I/O Communications path Communications power supply Photoelectric sensor or proximity sensor (three-wired sensor with a built-in-amplifier) Limit switch (two-wired sensor) Black Black SRT2-ID16-1 SRT2-OD16-1 Communications path Communications power supply I/O power supply Photoelectric sensor or proximity sensor (three-wired sensor with a built-in-amplifier) Limit switch (two-wired sensor) I/O power supply Communications path Communications power Valve supply Solenoid Valve power supply I/O Blue Brown Blue Brown Black I/O I/O Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. For general precautions refer to page 80. 32 Remote I/O Terminal SRT1-D16T(-1) Models with 3-tier Terminals (16 Points) are Added to the Remote I/O Terminal Series. Six Models are Available Depending on the NPN or PNP Configuration, Input Points, I/O Points, or Output Points. Incorporates easy-to-wire terminals each connecting to a single wire. Reduces designing and wiring effort. Incorporates a removable circuit block of cassette construction. Ordering Information I/O classification Internal I/O circuit common I/O points I/O connection method Model Digital input NPN (+ common) 16 M3 terminal block SRT1-ID16T PNP (– common) 6 3 e a boc SRT1-ID16T-1 Digital I/O NPN (+ common) SRT1-MD16T PNP (– common) SRT1-MD16T-1 Digital output NPN (– common) SRT1-OD16T PNP (+ common) SRT1-OD16T-1 Specifications Ratings Inputs Input current 6 mA max./point at 24 V and 3 mA min./point at 17 V ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage NPN: 15 VDC min. between V terminals and each input terminal PNP: 15 VDC min. between G terminals and each input terminal OFF voltage NPN: 5 VDC max. between V terminals and each input terminal PNP: 5 VDC max. between G terminals and each input terminal OFF current 1 mA max. Insulation method Photocoupler Outputs Rated output current 0.5 A max./point Residual voltage 1.2 V max. ON delay time 0.5 ms max. OFF delay time 1.0 ms max. Leakage current 0.1 mA max. Insulation method Photocoupler SRT1-D16T(-1) SRT1-D16T(-1) 33 Characteristics Communications power supply voltage 14 to 26.4 VDC I/O power supply voltage 24 VDC +10%/–15% I/O power supply current 4 A max./common Current consumption (see note) 50 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC between insulated circuits Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 Shock resistance 200 m/s2 Mounting strength No damage with 100 N pull load applied in all directions. Terminal strength No damage with 100 N pull load applied Screw tightening torque 0.3 to 0.5 N 􀀀 m Ambient temperature Operating: –10°C to 55°C Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Weight 300 g max. Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal. Nomenclature ERR Indicator: Indicates communications errors. COMM Indicator: ON while the Unit is in data communication. Power Indicator HOLD/CLR DIP Switch The DIP switch is on the left-hand side under the cover on the upper part of the Remote I/O Terminal. Holding or clearing output when a communications error occurs. Address Setting Switch Set the rotary switch to the node address by referring to the following table. I/O Indicators M4 Mounting Screw Terminal Cover The Unit stops operating with the cover opened. I/O and I/O Device Power Supply Terminals 8 to 15 These terminals will be used as output terminals 0 through 7 if the connected device handles both input and output signals. I/O and I/O Device Power Supply Terminals 0 to 7 These terminals will be used as input terminals if the connected device handles both input and output signals. I/O Power Supply Terminals Connect 24-VDC I/O power supply Fixture Track Used for DIN track mounting. CompoBus/S Internal Power Supply Terminals (BS+ and BS–) CompoBus/S Communications Cable Terminals (BDH and BDL) Address Setting Switch Node address Setting (Hex) 0 0 1 1 2 2 3 3 4 4 5 5 6 6 7 7 Node address Setting (Hex) 8 8 9 9 10 A 11 B 12 C 13 D 14 E 15 F SRT1-D16T(-1) SRT1-D16T(-1) 34 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID16T (-1) SRT1-MD16T (-1) SRT1-OD16T (-1) Mounting Holes Two, 4.2 dia. or M4 Two, 4.2 dia. or M4 Installation Internal Circuit Configuration SRT1-ID16T SRT1-MD16T SRT1-ID16T-1 SRT1-MD16T-1 SRT1-OD16T SRT1-OD16T-1 DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (8 to 15) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (0 to 7) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (8 to 15) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (8 to 15) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Outputs (0 to 7) DC-DC converter (isolated type) Photocoupler Photocoupler Outputs (0 to 7) Outputs (8 to 15) I/O power supply I/O power supply I/O power supply Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Voltage drop Voltage drop Voltage drop Voltage drop Voltage drop Voltage drop SRT1-D16T(-1) SRT1-D16T(-1) 35 External Connections Input (NPN Models) SRT1-ID16T SRT1-MD16T Output (NPN Models) SRT1-OD16T SRT1-MD16T Input (PNP Models) SRT1-ID16T-1 SRT1-MD16T-1 Output (PNP Models) SRT1-OD16T-1 SRT1-MD16T-1 Two-wired sensor Three-wired sensor Three-wired sensor Solenoid, valve, etc. Solenoid, valve, etc. Blue (Black) Brown (White) Blue (Black) Brown (Red) Black (White) Black (Black) Blue (Red) Brown (White) 36 Relay-mounted Remote Terminal SRT-R Ultra-miniature 8-point and 16-point Relay-mounted Terminals Ultra-compact (8-point models: 101 x 51 x 51 mm (W x H x D); 16-point models: 156 x 51 x 51 mm (W x H x D)) Power MOS FET Relay and Relay models. DIN track mounting and screw mounting are available. RC Ordering Information Classification I/O points Rated voltage Relay coil rating Model Applicable relay Relay output 8 points 24 VDC 24 VDC SRT1-ROC08 G6D-1A 16 points SRT2-ROC16 Power MOS FET l t t o e OS 8 points SRT1-ROF08 G3DZ-2R6PL relay output 16 points SRT2-ROF16 Note: For details about connections to the Master Unit, refer to page 10. Specifications Ratings Relay Output Item SRT1-ROC08, SRT2-ROC16 Applicable relay G6D-1A (one for each output point) Rated load 3 A at 250 VAC, 3 A at 30 VDC (resistive load) Rated carry current 3 A (see note 1) Max. contact voltage 250 VAC, 30 VDC Max. contact current 3 A Max. switching capacity 730 VA (AC), 90 W (DC) Min. permissible load (see note 2) 10 mA at 5 VDC Life expectancy Electrical: 100,000 operations min. (rated load, at 1,800 operations/h) Mechanical: 20,000,000 operations min. (at 18,000 operations/h) Note: 1. The maximum permissible current of COM0 to COM7 is 3 A. 2. This value fulfills the P reference value of opening/closing at a rate of 120 times per min (ambient operating environment and determination criteria according to JIS C5442). Power MOS FET Relay Output Item SRT1-ROF08, SRT2-ROF16 Applicable relay G3DZ-2R6PL (one for each output point) Load voltage 3 to 264 VAC, 3 to 125 VDC Load current 100 mA to 0.3 A Inrush current 6 A (10 ms) SRT-R SRT-R 37 Characteristics Power supply voltage 24 VDC +10%/–15% Current consumption (see note) 350 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Connecting Units 8-point Units: 16 per Master 16-point Units: 8 per Master Dielectric strength 2,000 VAC for 1 min (1-mA sensing current) between all output terminals and power supply, between communication terminals, and between contacts of different polarities 500 VAC for 1 min (1-mA sensing current) between all output terminals and power supply, between communication terminals, and between all power supply terminals and communications terminals Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 55 Hz, 0.75-mm double amplitude Shock resistance Malfunction: 100 m/s2 Destruction: 300 m/s2 Mounting strength No damage when 50 N pull load was applied for 10 s in all directions Terminal strength No damage when 50 N pull load was applied for 10 s Screw tightening torque 0.6 to 1.18 N 􀀀 m Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 8-point models: 145 g max., 16-point models: 240 g max. Approved standards UL 508, CSA C22.2 No. 14 Note: The above current consumption is a value with all the points turned ON including the current consumption of the G6D coil for the Remote Output Terminal. SRT-R SRT-R 38 Nomenclature SRT2-ROC16 SRT2-ROF16 SRT1-ROC08 SRT1-ROF08 Mounting Holes Output Terminals I/O Power Supply Terminals Connect 24-VDC power supply Communications Power Supply Terminals Connect 24-VDC power supply. CompoBus/S Terminals Connect the CompoBus/S communications cable. Mounting Holes DIP Switch Used for node number setting and holding or clearing outputs for communications error. Note: Always turn off the Unit before changing DIP switch settings. Mounting Holes Output Terminals I/O Power Supply Terminals Connect 24-VDC power supply Communications Power Supply Terminals Connect 24-VDC power supply. CompoBus/S Terminals Connect the CompoBus/S communications cable. Mounting Holes DIP Switch Used for node number setting and holding or clearing outputs for communications error. 0 to 15 ERR COMM PWR Output HOLD/CLEAR setting (Output model only) Baud rate setting Node address setting Indicators Indicator Display Color Meaning PWR Lit Green The communications power supply is ON. Not lit The communications power supply is OFF. COMM Lit Yellow Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Lit Red A communications error has occurred. Not lit Normal communications or the Unit is in standby status. 0 to 15 (see note) Lit Yellow The corresponding I/O signal is ON. Not lit The corresponding I/O signal is OFF. Note: The SRT1-RO08 does not have indicators 8 to 15. SRT-R SRT-R 39 Output HOLD/CLEAR Mode Mode Pin 1 Setting HOLD ON Output status is maintained when a communications error occurs. CLEAR OFF Output status is cleared when a communications error occurs. Note: 1. Pin 1 is factory-set to OFF. 2. This function is available to the Output Terminal only. Node Number Settings Node number Pin 3 Pin 4 Pin 5 Pin 6 8 4 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF ON 14 ON ON ON OFF 15 ON ON ON ON Note: 1. The node number is factory-set to 0. 2. For node number setting, refer to the CompoBus/S Operation Manual (W266). SRT-R SRT-R 40 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ROC08 SRT1-ROF08 Mounting Holes SRT2-ROC16 SRT2-ROF16 Mounting Holes 100 50 Two, 4.2 dia. or M4 Two, 4.2 dia. or M4 50 50 155 Thirty two, M3 Sixteen, M3 50 50 50 80 40 135 40 SRT-R SRT-R 41 Installation Internal Circuit Configuration SRT1-ROC08 SRT2-ROC16 Note: The G3DZ-2R6PL Power MOS FET Relay is inserted into this portion of the SRT1-ROF08 and SRT2-ROF16. Relay driver circuit Internal circuit Later blocks (See note) * Relay driver circuit Relay driver circuit Relay driver circuit External Connections Lamp Lamp Lamp Lamp Load power supply Terminal Arrangement and I/O Device Connection Example Output SRT2-ROC16 SRT2-ROF16 Note: 1. Dotted lines indicate internal connections. SRT1-ROC08 and SRT1-ROF08 have the 0 to 7 and COM0 to COM3 terminals only. 2. The above is a connection example of the SRT2-ROC16 with G6D Relays mounted. G3DZ Power MOS FET Relays are mounted to the SRT1-ROF08 and SRT2-ROF16. 24-VDC power supply Communications path Load Power supply Load Power supply Load Load Load Power supply Load Power supply Load Load Load Power supply Load Power supply Load Load Load Power supply Load Power supply Load Load *(see note 2) Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Refer to page 80 for details. 42 Connector Terminal SRT2-VID/VOD Compact Connector Terminals Save Wiring Effort and Enable Long-distance Communications Long-distance or high-speed communications mode is selectable. Incorporates I/O connectors making it possible to minimize the size. I/O connectors save wiring effort. Flexible DIN track mounting is possible through a DIN track attachment. Eight-point sensor connector models and 16-point MIL connector models are the same size. Features Vertical or horizontal DIN track mounting according to the available space is possible. Saves space and easily connects to other devices without wiring effort. Standard mounting (Sensor connector model) Mounting with DIN track attachment Standard mounting (MIL connector model) Communications and power supply connector DIN track G7TC Sensor connector Indicators Setting switch DIN track mounting hook MIL connector Ordering Information I/O classification Internal I/O circuit common I/O points I/O connection method Model Digital input NPN (+ common) 8 Sensor connector SRT2-VID08S PNP (– common) Se so co ec o SRT2-VID08S-1 Digital output NPN (– common) SRT2-VOD08S PNP (+ common) SRT2-VOD08S-1 Digital input NPN (+ common) 16 MIL connector SRT2-VID16ML PNP (– common) 6 co ec o SRT2-VID16ML-1 Digital output NPN (– common) SRT2-VOD16ML PNP (+ common) SRT2-VOD16ML-1 Mounting hook A SRT2-ATT01 Mounting hook B SRT2-ATT02 Note: For details about connecting the SRT2-VID or SRT2-VOD to the Master Unit, refer to page 10. SRT2-VID/VOD SRT2-VID/VOD 43 Specifications Ratings Inputs Item SRT2-VID08S SRT2-VID08S-1 SRT2-VID16ML SRT2-VID16ML-1 Input current 6 mA max./point at 24 V, 3 mA max./point at 17 V ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage 15 VDC min. (Between each input terminal and V: NPN. Between each input and G: PNP.) OFF voltage 5 VDC max. (Between each input terminal and V: NPN. Between each input and G: PNP.) OFF current 1 mA max. Insulation method Photocoupler Maximum number of inputs 8 12 Number of circuits 8 points/common, 1 circuit 16 points/common, 1 circuit Outputs Item SRT2-VID08S SRT2-VID08S-1 SRT2-VID16ML SRT2-VID16ML-1 Rated output current 0.3 A/point 0.3 A/point (2-A common) (See note.) Residual voltage 1.2 V max. ON delay time 0.5 ms max. OFF delay time 1.5 ms max. Leakage current 0.1 mA max. Insulation method Photocoupler Number of circuits 8 points/common, 1 circuit 16 points/common, 1 circuit Note: When using V/G terminals in an MIL connector, ensure that the current per terminal for the V/G terminals does not exceed 1 A. Characteristics Communications power supply voltage 14 to 26.4 VDC I/O power supply voltage 20.4 to 26.4 VDC (24 VDC +10%/–15%) I/O power supply current Sensor connector: 2.4 A max., MIL connector: 2.0 A max. Current consumption (see note) 50 mA max. at 24 VDC Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 (50 m/s2 for SRT2-ATT02) Shock resistance 200 m/s2 Dielectric strength 500 VAC (between insulated circuits) Ambient temperature Operating: –10°C to 55°C (with no icing or condensation) Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Storage: 25% to 85% Mounting strength No damage when 100 N pull load was applied in all directions (40 N load for SRT2-ATT02) Terminal strength No damage when the following loads were applied: Communications connector: 100 N Sensor connector: 40 N MIL connector: 100 N Screw tightening torque Communications connector: 0.25 N 􀀀 m Node address setting Settings made at DIP switch (set before supplying power for Slave communications) Weight Approx. 75 g max. Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal. SRT2-VID/VOD SRT2-VID/VOD 44 Nomenclature SRT2-VID08S/SRT2-VID08S-1 SRT2-VOD08S/SRT2-VOD08S-1 (Sensor Connector Models) SRT2-VID16ML/SRT2-VID16ML-1 SRT2-VOD16ML/SRT2-VOD16ML-1 (MIL Connector Models) Communications Connectors I/O Connectors Indicators DIP Switch Communications Connectors I/O Connectors Output HOLD/CLEAR Mode Setting Communications Mode Setting Node Address Setting Reserved for System Use (Always OFF) Indicators Indicator Color Display Meaning PWR Green Lit The communications power supply is ON. Not lit The communications power supply is OFF. COMM Yellow Lit Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Red Lit A communications error has occurred. Not lit Normal communications or the Unit is in standby status. 0 to 7 (for 8-point I/O) 0 to 15 (for 16-point I/O) Yellow Lit The corresponding I/O signal is ON. Not lit The corresponding I/O signal is OFF. Name Power Communications Communications error Input (output) Output HOLD/CLEAR Mode SW8 (HOLD) Setting OFF Output status is cleared. ON Output status is maintained. Communications Mode SW7 (HOLD) Setting OFF High-speed communications mode ON Long-distance communications mode Node Number Settings Node number Pin 4 Pin 3 Pin 2 Pin 1 8 4 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF OFF 14 ON ON ON OFF 15 ON ON ON ON Note: Be sure to perform settings with the Slave power supply OFF. SRT2-VID/VOD SRT2-VID/VOD 45 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT2-VID08S SRT2-VID08S-1 SRT2-VOD08S SRT2-VOD08S-1 SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD16ML SRT2-VOD16ML-1 SRT2-ATT01 SRT2-ATT02 Dimensions when Unit is mounted. SRT2-VID/VOD SRT2-VID/VOD 46 Installation Internal Circuit Configuration SRT2-VOD08S-1 SRT2-VID08S SRT2-VID08S-1 SRT2-VOD08S SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD16ML SRT2-VOD16ML-1 Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Voltage drop Voltage drop Voltage drop Voltage drop SRT2-VID/VOD SRT2-VID/VOD 47 Terminal Arrangement and I/O Device Connection Examples SRT2-VID08S SRT2-VID08S-1 SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD08S SRT2-VOD16ML SRT2-VOD08S-1 SRT2-VOD16ML-1 CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers Sensor Brown (Red) Black (White) Blue (Black) Three-wired sensor Sensor Brown (White) Blue (Black) Two-wired sensor Sensor Three-wired sensor Sensor Two-wired sensor Sensor Three-wired sensor Sensor Two-wired sensor Sensor Three-wired sensor Sensor Two-wired sensor Output device Solenoid etc. Output device Valve etc. Output device Solenoid etc. Output device Valve etc. Output device Solenoid etc. Output device Valve etc. Output device Solenoid etc. Output device Valve etc. Brown (Red) Black (White) Blue (Black) Brown (White) Blue (Black) Brown (Red) Black (White) Blue (Black) Brown (White) Blue (Black) Brown (Red) Black (White) Blue (Black) Brown (White) Blue (Black) Note: 1. V terminals and G terminals are respectively connected internally. When supplying power for I/O from communications connectors, power can be supplied to the sensor output devices from V and G terminals. 2. When using an inductive load (solenoid, valve etc.), either use one with an internal reverse electromotive force absorption diode or attach a diode externally. SRT2-VID/VOD SRT2-VID/VOD 48 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Refer to page 80 for common precautions. Communications Connector Pin Arrangement 24-VDC communications power supply 24-VDC I/O power supply CompoBus/S communications The following solderless terminals are recommended. • Manufacturer: Weidmuller Sleeve (Part No. 046290) Solderless terminal Cable Two-wire insertion (Part No. 901851) Solderless terminal Cable The following product is a dedicated tool. • Manufacturer: Weidmuller PZ1.5 Crimper (Part No. 900599) Sensor Connector Pin Arrangement SRT2-VID08S/VID08S-1 SRT2-VOD08S/VOD08S-1 Model Cable conductor size XS8A-0441 0.3 to 0.5 mm2 XS8A-0442 0.14 to 0.2 mm2 Note: The XS8A-0441 or XS8A-0442 Connector is not provided with the SRT-VID or SRT2-VOD. Place an order for the connector separately. Calculate the cable conductor size as follows. The following information is given on each sensor cable: Cable dia. (Number of conductors/Conductor dia.) Conductor size (mm2) = (Conductor dia./2)2 x p x Number of conductors Example: E3S-A 4 dia. (18/0.12) Conductor size (mm2) = (0.12/2)2 x 3.14 x 18 􀀀 0.20 The conductor size is 0.2 mm2. Therefore, use the XS8A-0442. MIL Connector Pin Arrangement SRT2-VID16ML/VID16ML-1 Function Pin No. Pin No. OUT0 IN0 OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 G G V V 20 20 18 18 16 16 14 14 12 12 10 10 8 8 6 6 4 4 2 2 Function Function Pin No. Pin No. OUT8 IN8 OUT9 IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12 OUT13 IN13 OUT14 IN14 OUT15 IN15 G G V V 19 19 17 17 15 15 13 13 11 11 9 9 7 7 5 5 3 3 1 1 SRT2-VOD16ML/VOD16ML-1 Function Note: 1. No cable connector is provided. Order the connector separately. • Applicable Connector XG4M-2030-T • Applicable Connector Cables G79-O50C G79-O25C G79-I50C G79-I25C 2. Refer to the following table for ordering information on the applicable Cables. SRT2-VID/VOD SRT2-VID/VOD 49 Applicable Cables Connectable product Model Applicable Cable I/O Block G7TC-OC16 G7TC-OC08 G7TC-ID16-5 G7TC-IA16-5 G79-O50C (L = 500 mm) G7TC IA16 G7VC Series G70A Series G70D Series e G79-O25C (L = 250 mm) Connector-Terminal Conversion Unit XW2B Series Digital Display Unit M7F I/O Block G7TC-ID16 G7TC-IA16 e G79-I50C (L = 500 mm) G7TC-OC16-1 G79-I25C (L = 250 mm) 50 Sensor Terminal SRT1-D08S Connector Connection Models that Allows Easy Connection to Sensors and Output Devices Sensors with easy-to-wire connectors are easily attached or detached. Connects to 2-wired sensors. Remote teaching of the Sensor Terminal is possible with the PC by using output signals of the Sensor Terminal. DIN track mounting and screw mounting are available. Ordering Information Classification Internal I/O circuit common I/O points Model For input NPN (– common) 8 input points SRT1-ID08S For I/O NPN (– common) 4 input/4 output points SRT1-ND08S For output NPN (– common) 8 output points SRT1-OD08S Specifications Ratings Input Item SRT1-ID08S/-ND08S Input current 10 mA max./point ON delay time 1 ms max. OFF delay time 1.5 ms max. ON voltage 12 VDC min. between each input terminal and VCC, the external sensor power supply OFF voltage 4 VDC max. between each input terminal and VCC, the external sensor power supply OFF current 1 mA max. Insulation method Photocoupler Input indicator LED (yellow) Output Item SRT1-ND08S SRT1-OD08S Rated output current 20 mA/point 30 mA/point Residual voltage 1 V max. 0.6 V max. ON delay time 1 ms max. --- OFF delay time 1.5 ms max. --- Leakage current 0.1 mA max. Insulation method Photocoupler Output indicator LED (yellow) SRT1-D08S SRT1-D08S 51 Characteristics Communications power supply voltage (see note 1) 14 to 26.4 VDC Current consumption (see note 2) 50 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) Noise immunity Power supply normal: ±600 V for 10 minutes with a pulse width of 100 ns to 1 ms Power supply common: ±1,500 V for 10 minutes with a pulse width of 100 ns to 1 ms Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting method M4 screw mounting or 35-mm DIN track mounting Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track directions and a pulling force of 10 N Terminal strength No damage when 50 N pull load was applied for 10 s in all directions Tighten each screw to a torque of 0.6 to 1.18 N 􀀀 m Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight SRT1-ID08S/OD08S: 100 g max., SRT1-ND08S: 80 g max. Note: 1. The communications power supply voltage must be 20.4 to 26.4 VDC if the Unit is connected to 2-wired proximity sensors. 2. The above current consumption is a value with all the points turned OFF excluding the current consumption of the sensor connected to the Sensor Terminal. External Sensor Power Supply Power supply voltage 13.5 to 26.4 VDC Current consumption 500 mA max. in total Nomenclature SRT1-ID08S SRT1-ND08S CompoBus/S Terminals Connect the CompoBus/S communications cable. Sensor Terminal I/O Connectors Connect the cables from the sensors here. I/O Indicators Indicate the status of each point. (Lit when the input or output is ON.) The SRT1-ID08S has 8 input indicators and the SRT1-ND08S has 4 input indicators and 4 output indicators. DIP Switch The DIP switch’s pins have the following functions: Pins 1 to 4: Node number setting Pin 5: Reserved (Always OFF.) Pin 6: Hold/clear outputs for communications error DIN Track Mounting Hook Used when mounting the Unit to a DIN track. CompoBus/S Indicators Indicate the operating status of the Slave and the status of communications. Mounting Screw Holes Used when screwing the Unit to a control panel. Indicators PWR COMM ERR IN0 to 3 IN0 to 7 OUT0 to 3 Communications Power Supply Terminals Connect the communications power supply. SRT1-D08S SRT1-D08S 52 Indicators Indicator Name Display Color Meaning PWR Power supply Lit Green The communications power supply is ON. Not lit The communications power supply is OFF. COMM Communication Lit Yellow Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Communication Lit Red A communications error has occurred. error Not lit Normal communications or the Unit is in standby status. 0 to 3 (4 inputs/outputs) Input Lit Yellow The corresponding input is ON. 0 to 7 (8 inputs) Not lit The corresponding input is OFF or the Unit is in standby status. 0 to 3 (4i t / t t ) o Output Lit Yellow The corresponding output is ON. 4 inputs/outputs) Not lit The corresponding output is OFF or the Unit is in standby status. Switch Setting All pins are factory-set to OFF. Hold/Clear outputs for Node number communications error settings Reserved (OFF) Pin 5 (Reserved) Always set pin 5 to OFF. Output HOLD/CLEAR Mode (SRT-ND16S) HOLD Function OFF Output status is cleared when a communications error occurs. ON Output status is maintained when a communications error occurs. Node Number Settings Node number 1 2 4 8 0 OFF OFF OFF OFF 1 ON OFF OFF OFF 2 OFF ON OFF OFF 3 ON ON OFF OFF 4 OFF OFF ON OFF 5 ON OFF ON OFF 6 OFF ON ON OFF 7 ON ON ON OFF 8 OFF OFF OFF ON 9 ON OFF OFF ON 10 OFF ON OFF ON 11 ON ON OFF ON 12 OFF OFF ON ON 13 ON OFF ON ON 14 OFF ON ON ON 15 ON ON ON ON SRT1-D08S SRT1-D08S 53 SRT1-OD08S DIP Switch Mounting Screw Holes Used when screwing the Unit to a control panel. CompoBus/S Indicators Indicate the operating status of the Slave and the status of communications. Output Indicators Indicate the output status of each channel. Communications Terminals Communications Power Supply Terminals Connect the communications cable. DIN Track Mounting Hook Used when mounting the Unit to a DIN track. Output Connectors Connect the cables from the output device. Switch Setting All pins are factory-set to OFF. Hold/Clear outputs for Node number communications error settings Reserved (OFF) Pin 5 (Reserved) Always set pin 5 to OFF. Output HOLD/CLEAR Mode (SRT-ND16S) HOLD Function OFF Output status is cleared when a communications error occurs. ON Output status is maintained when a communications error occurs. Node Number Settings Node number 4 3 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF ON 14 ON ON ON OFF 15 ON ON ON ON SRT1-D08S SRT1-D08S 54 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID08S Mounting Holes SRT1-ND08S Mounting Holes 100 Cover opening and closing directions Two, 4.2 dia or M4 Four, M3 50 50 70 max. Four, M3 Cover opening and closing directions Two, 4.2 dia or M4 (75) (75) SRT1-D08S SRT1-D08S 55 SRT1-OD08S 100 Cover opening and closing directions (75) 2.8 37 Two, 4.2 dia. or M4 7 Four, M3 50 40 92 40±0.2 92±0.2 Mounting Holes 4 6 Cable Connector for SRT1-OD08S Applicable conductor size (mm2) Model 0.3 to 0.5 XS8A-0441 0.14 to 0.2 XS8A-0442 0.3 to 0.5 XS8B-0443 XS8B-0443 (Relay Socket ) XS8A-044 (Cable Connector) Plug connector Cover Model number Pin number Check window Calculate the cable conductor size as explained below. The following information is given on each sensor cable: Cable dia. (Number of conductors/Conductor dia.) Conductor size (mm2) = (Conductor dia./2)2 x p x Number of conductors Example: E3S-A 4 dia. (18/0.12) Conductor size (mm2) = (0.12/2)2 x 3.14 x 18 􀀀 0.20 The conductor size is 0.2 mm2. Therefore, use the XS8A-0442. SRT1-D08S SRT1-D08S 56 Installation Internal Circuit Configuration SRT1-ID08S SRT1-ND08S Internal circuit Photocoupler Internal circuit Photocoupler Photocoupler SRT1-OD08S Internal circuit For one output External Connections SRT1-ID08S SRT1-ND08S Three-wired Sensor Two-wired Sensor Sensor with Teaching Function Sensor with External Diagnostic function Sensor with Bank-switching Function Three-wired Sensor Brown Black Blue Sensor Brown Blue Sensor Brown Black Pink Blue Sensor Brown Black Blue Sensor Two-wired Sensor Brown Blue Sensor SRT1-D08S SRT1-D08S 57 Terminal Arrangement and I/O Device Connection Example Input SRT1-ID08S I/O SRT1-ND08S Photoelectric Sensor Proximity Sensor (Sensor with Teaching Function, Sensor with External Diagnostic function, Sensor with Bank-switching Function) 24 VDC Communications power supply CompoBus/S communications CompoBus/S communications Communications power supply Blue Brown Blue Black Brown Photoelectric Sensor Proximity Sensor (3-wired Sensor) Proximity Sensor (2-wired Sensor) CompoBus/S communications Communications power supply CompoBus/S communications Communications power supply Brown Brown Blue 24 VDC Orange CompoBus/S CompoBus/S Output SRT1-OD08S CompoBus/S SOURCE 24 VDC BDL BDH – + CompoBus/S communications Communications power supply Output connector Pin number Solenoid, etc. Valve, etc. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. General Safety Precautions Installation Environment Do not install the Unit in the following places. • Places with water, oil, or chemical sprayed on the Unit. • Places with rapid temperature changes. • Places with high humidity resulting in condensation. • Places with intense electric and magnetic fields. • Places with excessive vibration or shock. Wiring To prevent inductive noise, do not wire power lines or high-tension lines along with or near the cables. Make sure that the polarity of each terminal is correct. Make sure that the communications path and power line are connected correctly. Secure the cables properly. Do not pull the cables with strong force, otherwise the cables may be disconnected from the terminals or connectors of the Unit. Do not touch the Unit when the Unit is used in places with high ambient temperatures because the surface temperature of the Unit may be high. Do not use paint thinner to clean the surface of the Unit, otherwise the surface will be damaged or discolored. SRT1-D08S SRT1-D08S 58 Correct Use Use the Unit under its rated conditions. Mount the Unit with M4 screws or to DIN tracks securely. Typical Causes of Communications Errors • The cables are not connected correctly. • The node number setting is incorrect. • The baud rate setting is incorrect. • There is a strong noise source, such as an inverter motor, near the Unit. Install the Unit as far as possible from the noise source or shield the noise source. Others Use OMRON’s XS8A-0441 or XS8A-0442 Connectors with the Unit. Insert each connector into the Unit until the connector snaps in place. Make sure that terminal number 1 of the connector is on the lock lever side when inserting the connector. Refer to the CompoBus/S Operation Manual (W266) for wiring the Unit. 59 Sensor Amplifier Terminal SRT1-D04S Snap On to Connect and Save Wiring Effort The 4-channel fiber photoelectric amplifiers in Terminals with connectors offer a low cost and space savings. The product lineup included Terminal Block Units for easy connection to sensors with amplifiers, limit switches, etc. Connect to up to eight channels of sensors by using Expansion Blocks. Features Low Cost and Space Savings with Four-channel Fiber Connectors Just Snap On to Connect Connector Units Fiber connector (1 channel) Fiber connector (4 channels) Terminal Block Unit Photoelectric sensor Various input units can be connected. Proximity sensor Basic switch and limit switch SRT1-D04S SRT1-D04S 60 Ordering Information CompoBus/S Sensor Amplifier Terminals Classification I/O points Model Communications 4 SRT1-TID04S SRT1-TKD04S Expansion SRT1-XID04S SRT1-XKD04S Connector Units Classification Specifications Model E3X-N Connector Type General-purpose, 1 channel E3X-NT16 Multi-functional, 1 channel E3X-NT26 Long distance, high accuracy, 1 channel E3X-NH16 Multi-functional, 4 channels E3X-NM16 Terminal Block Unit One input point E39-JID01 SRT1-D04S SRT1-D04S 61 Specifications Characteristics CompoBus/S Sensor Amplifier Terminals Item Communication Terminals Expansion Terminals Model SRT1-TID04S SRT1-TKD04S SRT1-XID04S SRT1-XKD04S Communications power supply voltage 14 to 26.4 VDC (See note 1) --- --- I/O points 4 input points Connected sensors Total of four E3X-NT6 or E39-JID01 (See note 2) One E3X-NM16 (See note 2) Total of four E3X-NT6 or E39-JID01 One E3X-NM16 Current consumption 60 mA max. (See note 3) 10 mA max. (See note 3) Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) Noise immunity Power supply normal: ±600 V for 10 minutes with a pulse width of 100 ns to 1 ms Power supply common: ±1,500 V for 10 minutes with a pulse width of 100 ns to 1 ms Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting method M4 screw mounting or 35-mm DIN track mounting Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track directions and a pulling force of 10 N Terminal strength No damage when 49 N pull load was applied for 10 s in all directions. Tighten each screw to a torque of 0.6 to 1.18 N 􀀀 m. Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 70 g max. 65 g max. 45 g max. 35 g max. Note: 1. The communications power supply voltage must be 20.4 to 26.4 VDC if the Terminal is connected to 2-wired proximity sensors. 2. When adding Connector Units, use SRT1-XID04S or SRT1-XKD04S. 3. The value doesn’t include the current consumption of Connector Units. With E3X-N Connectors Model E3X-NH16 E3X-NT16 E3X-NT26 E3X-NM16 Current consumption 75 mA max. 50 mA max. 150 mA Response time 1 ms max. (4.0 ms max. when connected to the SRM1-D04S) 500 mS max. (2.0 ms max. when connected to the SRT1-D04S) Timer function Not available OFF-delay timer (fixed to 40 ms) Remote teaching input Not available Available (Remote teaching disabled) Indicator Orange LED: Lit during output operation Green LED: Lit with stable light reception or no light Teaching confirmation function Indicators (red/green LED) and buzzer Output Light ON and Dark ON switch selectable Ambient illumination Sunlight: 10,000 lux max.; incandescent lamp: 3,000 lux max. Insulation resistance 20 MW max. (at 500 VDC) Dielectric strength 1,000 VAC at 50/60 Hz for 1 min Vibration resistance Destruction:10 to 55 Hz, 1.5-mm double amplitude Shock resistance Destruction:500 m/s2 Mounting method Connector connection to the SRT1-D04S Mounting strength No damage when 49 N pull load was applied for 10 s in all directions Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 30 g max. 30 g max. 30 g max. 60 g max. SRT1-D04S SRT1-D04S 62 Terminal Block Units Model E39-JID01 Input current 10 mA max. ON voltage 12 VDC min. between input terminal and external sensor power supply OFF voltage 4 VDC max. between input terminal and external sensor power supply OFF current 1 mA max. ON delay time 1 ms max. (connected to SRT1-D04S) OFF delay time 1.5 ms max. (connected to SRT1-D04S) Input indicators LED (Orange) External sensor current capacity 50 mA max. Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting method M4 screws or 35-mm DIN track mounting Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track directions and a pulling force of 10 N Terminal strength No damage when 49 N pull load was applied for 10 s in all directions. Tighten each screw to a torque of 0.6 to 1.18 N 􀀀 m. Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 25 g max. SRT1-D04S SRT1-D04S 63 Nomenclature SRT1-TID04S SRT1-TKD04S Mounting Screw Holes Communications Terminals Communications Power Supply Terminals Contact 0 Contact 1 Contact 2 Contact 3 DIN Track Mounting Hook Node Number Settings Refer to the CompoBus/S Operation Manual (W266) for details on DIP switch settings. Mounting Screw Holes DIN Track Mounting Hook Contacts 0 to 3 Communications Power Supply Terminals Connect a 24-VDC power supply. Communications Terminals Connect a communications cable. DIP Switch Indicators Indicator Name Display Color Meaning PWR Power supply Lit Green The communications power supply is ON. Not lit G ee The communications power supply is OFF. COMM Communications Lit Yellow Normal communications. Not lit e o A communications error has occurred or the Unit is in standby status. ERR Communications Lit Red A communications error has occurred. error Not lit ed Normal communications or the Unit is in standby status. SRT1-D04S SRT1-D04S 64 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-TID04 Two, 4.2 dia. or M4 Two, 4.5 dia. Mounting Holes (75) 3.4 Two, 4.2 dia. or M4 Two, 4.5 dia. SRT1-XID04S Mounting Holes (75) 3.4 SRT1-D04S SRT1-D04S 65 SRT1-TKD04S Two, 4.2 dia. or M4 Two, 4.5 dia. Mounting Holes (75) 3.4 SRT1-XKD04S Two, 4.2 dia. or M4 Two, 4.5 dia. Mounting Holes (75) 3.4 SRT1-D04S SRT1-D04S 66 E3X-NM16 Output indicator Stability indicator Eight, 2.4 dia. E3X-NT6 Output indicator Stability indicator Two, 2.4 dia. SRT1-D04S SRT1-D04S 67 E3X-NH16 Light level indicators Threshold indicators Output indicator Two, 2.4 dia. E39-JID01 Output indicator Installation Internal Circuit Configuration E39-JID01 Internal circuit SRT1-D04S SRT1-D04S 68 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Terminal. Refer to page 80 for precautions common to all SRT1 Terminals. General Safety Precautions Connector Units Use only the Connector Units listed in this data sheet for the Sensor Amplifier Units. E39-JID01 Terminal Block Unit Do not apply any voltage to the Terminal Block Unit. Correct Use Expanding Sensor Amplifier Terminals 1. Remove the cover from the side of the SRT1-TD04S. (See Figure 1.) 2. When the cover is removed, you can see the expansion connector inside. 3. Connect this expansion connector to the connector located on the side of the SRT1-XD04S. (See Figure 2.) Figure 1 Cover Figure 2 Connector Attaching and Removing Connector Units (SRT1-TID04S, SRT1-XID04S, E3X-NT6, E39-JID01) Attaching Connector Units 1. Hook Section A of the Connector Unit onto Section B of the Sensor Amplifier Terminal. 2. Push in the Connector Unit until Section C locks inside Section D of the Sensor Amplifier Terminal. Section C Section D Section A Section B Bottom View Section A Removing Connector Units 1. While pushing Section D, pull the Connector Unit in direction E. 2. When Section D releases from the lock, the Connector Unit can be removed. Push here Section D SRT1-D04S SRT1-D04S 69 Attaching or Removing Connector Unit (SRT1-TKD04S, SRT1-XKD04S, E3X-NM16) Attaching Connector Unit 1. Hook Section A of the Connector Unit onto Section B of the Sensor Amplifier Terminal. 2. Push in the Connector Unit until Section C locks inside Section D of the Sensor Amplifier Terminal. Bottom View Section A Section C Section D Section A Section B Removing Connector Unit 1. While pushing Section D, pull the Connector Unit in direction E. 2. When Section D releases from the lock, the Connector Unit can be removed. Push here Section D Channel Numbers Channel numbers 1 to 4 of the E3X-NM16 correspond to contact numbers 0 to 3 of the SRT1-TKD04S, and to contact numbers 4 to 7 of the SRT1-XKD04S. 70 Analog Input Terminal SRT2-AD04 Compact Analog Input Model is the Same Shape as 16-point Remote I/O Terminals Allows flexible input point settings up to a maximum of four points. Resolution: 1/6,000 Takes only 1 ms to exchange each input point. Wide input ranges available. 105 x 48 x 50 (W x H x D) Ordering Information Classification I/O points Model Analog Input Terminal 1 to 4 (selectable with DIP switch) SRT2-AD04 Note: For details about connecting the SRT2-AD04 to the Master Unit. Refer to page 10. Specifications Ratings Input Item Voltage input Current input Max. signal input ±15 V ±30 mA Input impedance 1 MW max. Approx. 250 W Resolution 1/6,000 (FS) Total 25°C ±0.3% FS ±0.4% FS accuracy –10 to 55°C ±0.6% FS ±0.8% FS Conversion time 4 ms/4 points, 3 ms/3 points, 2 ms/2 points, and 1 ms/1 point Dielectric strength 500 VAC for 1 min between communications power supply, analog input, and communications terminals (see note) Note: There is no insulation between analog inputs. Characteristics Communications power supply voltage 14 to 26.4 VDC (possible to provide through dedicated flat cable) Current consumption 100 mA max. Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC (between insulated circuits) Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 Shock resistance 200 m/s2 Mounting strength No damage with 100 N pull load applied in all directions. Terminal strength No damage with 100 N pull load applied Screw tightening torque 0.3 to 0.5 N 􀀀 m Ambient temperature Operating: –10°C to 55°C Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Weight Approx. 120 g SRT2-AD04 SRT2-AD04 71 Nomenclature SRT2-AD04 Mounting Screw Holes DIN Track Mounting Hook Terminal Block Indicators Indicators Indicator Name Color Display Meaning PWR Power supply Green Lit The communications power supply is ON. Not lit The communications power supply is OFF. COMM Communication Yellow Lit Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Communication Red Lit A communications error has occurred. error Not lit Normal communications or the Unit is in standby status. U.ERR Unit error Red Lit An error has occurred in the Unit. Not lit Normal communications or the Unit is in standby status. DIP Switch (SW101) (Open cover to access.) Pin 1 Pin 2 Input points OFF OFF 4 points (default setting) OFF ON 3 points (inputs 0 to 2 enabled) ON OFF 2 points (inputs 0 and 2 enabled) ON ON 1 point (input 0 enabled) Pin 3 Communications mode OFF High-speed communications (default setting) ON Long-distance communications Pin 4 Be sure to turn OFF. Pin No. Node address Pin 5 23 Pin 6 22 Pin 7 21 Pin 8 20 The default setting is for all of these pins to be OFF. DIP Switch (SW102) (Open cover to access.) Pin 1 Pin 2 Pin 3 Range for inputs 0, 1 Pin 4 Pin 5 Pin 6 Range for inputs 2, 3 OFF OFF OFF 0 to 5 (V) (default setting) ON OFF OFF 1 to 5 (V) OFF ON OFF 0 to 10 (V) ON ON OFF –10 to 10 (V) OFF OFF ON 4 to 20 (mA) ON OFF ON 0 to 20 (mA) Do not make any settings other than the ones listed above. Pin 7 Mean value processing OFF Without mean value processing (default setting) ON With mean value processing (mean for 8 operations) Pin 8 Be sure to turn OFF. SRT2-AD04 SRT2-AD04 72 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT2-AD04 Mounting Holes Two, 4.2 dia. or M4 Installation Internal Circuit Configuration SRT2-AD04 Isolation DC-DC static converter Internal circuit Input 0 Input 1 Input 2 Input 3 Analog ground Terminal Arrangement SRT2-AD04 Note: When the input is current input, short-circuit the “V+” terminals and the “I+” terminals. When short-circuiting, use the short-circuiting tool provided as an accessory. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. For details about general precautions, refer to page 80. Connections to the Master Unit Connections cannot be made to the following Master Units. If the following Master Units are connected, incorrect data may be transferred. C200HW-SRM21 (-V1 and later versions supported) CQM1-SRM21 (-V1 and later versions supported) SRM1-C0, SRM1-C0-V1 (-V2 and later versions supported) C200PC-ISA2-SRM 3G8B3-SRM0 SDD-CS1 (made by NKE Ltd.) 73 Analog Output Terminal SRT2-DA02 Compact Analog Output Model is the Same Shape as 16-point Remote I/O Terminals Two output points or 1 output point is selectable. Resolution: 1/6,000 105 x 48 x 50 (W x H x D) Ordering Information Classification I/O points Model Analog Output Terminal 1 or 2 (selectable with DIP switch) SRT2-DA02 Note: For details about connecting the SRT2-DA02 to the Master Unit, refer to page 10. Specifications Ratings Output Item Voltage output Current output External output permissible load resistance 5 kW min. 600 W max. Output impedance 0.5 W max. --- Resolution 1/6,000 (FS) Total 25°C ±0.4% FS accuracy –10 to 55°C ±0.8% FS Conversion time 2 ms/2 points and 2 ms/1 point Dielectric strength 500 VAC for 1 min between communications power supply, analog output, and communications terminals (see note) Note: There is no insulation between analog outputs. Characteristics Communications power supply voltage 14 to 26.4 VDC (power supply possible from dedicated flat cable) Current consumption (see note) 170 mA max. Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC (between insulated circuits) Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 Shock resistance 200 m/s2 Mounting strength No damage when 100 N pull load was applied in all directions Terminal strength No damage when 100 N pull load was applied Screw tightening torque 0.3 to 0.5 N 􀀀 m Ambient temperature Operating: –10°C to 55°C Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Weight Approx. 100 g Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external load. SRT2-DA02 SRT2-DA02 74 Nomenclature SRT2-DA02 Mounting Screw Holes DIN Track Mounting Hook Terminal Block Indicators Indicators Indicator Name Color Display Meaning PWR Power supply Green Lit The communications power supply is ON. Not lit The communications power supply is OFF. COMM Communication Yellow Lit Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Communication Red Lit A communications error has occurred. error Not lit Normal communications or the Unit is in standby status. U.ERR Unit error Red Lit An error has occurred in the Unit. Not lit A communications error has occurred or the Unit is in standby status. DIP Switch (SW101) (Open cover to access.) Pin 1 Be sure to turn OFF. Pin 2 Output points OFF 2 points (default setting) ON 1 point (output 0 enabled) Pin 3 Communications mode OFF High-speed communications (default setting) ON Long-distance communications Pin 4 Be sure to turn OFF. Pin No. Node addresses Pin 5 23 Pin 6 22 Pin 7 21 Pin 8 20 The default setting is for all of these switches to be OFF. DIP Switch (SW102) (Open cover to access.) Pin 1 Pin 2 Pin 3 Range for output 0 Pin 4 Pin 5 Pin 6 Range for output 1 OFF OFF OFF 0 to 5 (V) (default setting) ON OFF OFF 1 to 5 (V) OFF ON OFF 0 to 10 (V) ON ON OFF –10 to 10 (V) OFF OFF ON 4 to 20 (mA) Do not make any settings other than the ones listed above. Pin 7 Pin 8 Output during communications error OFF OFF Clear at the output lower limit when communications error occurs. (default setting) OFF ON Clear at the output upper limit when communications error occurs. ON OFF Clear at the output lower limit when communications error occurs (however, if the range is –10 to 10 V, the output will be 0). ON ON Output held when communications error occurs. SRT2-DA02 SRT2-DA02 75 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT2-DA02 Mounting Holes Two, 4.2 dia. or M4 Installation Internal Circuit Configuration SRT2-DA02 Isolation DC-DC static converter Internal circuit Output 0 Output 1 Analog ground Terminal Arrangement SRT2-DA02 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. For details about general precautions, refer to page 80. Connections to the Master Unit Connections cannot be made to the following Master Units. If the following Master Units are connected, incorrect data may be transferred. C200HW-SRM21 (-V1 and later versions supported) CQM1-SRM21 (-V1 and later versions supported) SRM1-C0, SRM1-C0-V1 (-V2 and later versions supported) C200PC-ISA2-SRM 3G8B3-SRM0 SDD-CS1 (made by NKE Ltd.) 76 Remote I/O Module SRT1-ID􀀀P/OD􀀀P Module Type that Allows PCB Mounting Compact size at 60 x 16 x 35 (W x H x D) Lineup now includes the 16-point input model and 16-point output model. Ordering Information I/O classification Internal I/O circuit common I/O points Rated voltage I/O rated voltage Model Input NPN (+ common) 16 24 VDC 24 VDC SRT1-ID16P Output NPN (– common) SRT1-OD16P Specifications Ratings Input (SRT1-ID16P) Input current 2 mA max./point ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage 15 VDC min. between each input terminal and BS+ terminal OFF voltage 5 VDC max. between each input terminal and BS + terminal Output (SRT1-OD16P) Rated output current 0.2 A/point, 0.6 A/common Residual voltage 0.6 V max. between each output terminal and G terminal at 0.2 A Leakage current 0.1 mA max. between each output terminal and G terminal at 24 VDC SRT1-ID􀀀P/OD􀀀P SRT1-ID􀀀P/OD􀀀P 77 Characteristics Communications power supply voltage 20.4 to 26.4 VDC I/O power supply voltage 24 VDC +10%/–15% Current consumption (see note) 60 mA max. Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Connecting Units 8 Input Terminals and 8 Output Terminals per Master Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) 5-V output current 20 mA max. (5 V 􀀀 0.5 V) LED drive current (COMM, ERR) 10 mA max. (5 VDC) SW carry current (ADR0 to 3, HOLD) 1 mA max. Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 35 g max. Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected to the input model and the current consumption of the load connected to the output model. Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID16P SRT1-OD16P Incorrect insertion prevention pin PCB dimensions (top view) No cumulative tolerance allowed 16 2.54x15=38.1 27.94±0.1 2.54±0.1 2.54x15=38.1 8.95±0.1 1.53±0.1 0.63 27.94±0.1 1.6 1.6 dia. 0.63 3.5 2.54 35 60 2.2 dia. +0.1 0 32-0.9 dia. +0.1 0 SRT1-ID􀀀P/OD􀀀P SRT1-ID􀀀P/OD􀀀P 78 Installation Internal Circuit Configuration SRT1-ID16P SRT1-OD16P Internal circuit Internal circuit External Connections Communications Two-wired proximity sensor BS– or G Input Module (SRT1-ID16P) Output Module (SRT1-OD16P) Communications Relay Internal circuit Internal circuit D1: Reverse voltage prevention diode Note: NC in parentheses is for the Input Modules. Node Number Settings and Output HOLD/CLEAR Mode Internal circuit BS– or G Note: Refer to the CompoBus/S Operation Manual (W266) for details on the switch. Indicators R: LED current limiting resistor LED1: LED for COMM LED2: LED for ERR The maximum current for LED1 and 2 is 10 mA. Internal circuit The 5-V Output Terminals have positive power supplies (maximum output current of 20 mA) for the ERR and COMM LEDs. Recommended LED colors are red for ERR and yellow for COMM. SRT1-ID􀀀P/OD􀀀P SRT1-ID􀀀P/OD􀀀P 79 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Refer to page 80 for precautions common to all SRT1 Terminals. Correct Use Noise Protection Circuit Add the following protection circuit if noise is generated from the power supply, input section, or output section. Power Supply Noise Protection Circuit L: Coil for the common mode Install the coil near the SRT1. 50 V 100 mF 50 V 0.1 mF BS􀀀 L V BS Input Section Noise Protection Circuit C: 0.1 mF min. R: Resistor for limiting current to PC PC: Photocoupler Input device 0 to 15 V R G PC C Output Section Noise Protection Circuit V1 and V2: Power supply. R: Resistor for limiting current to PC PC: Photocoupler 0 to 15 Load G V2 PC R V1 5-V Output Terminals The 5-V Output Terminals have positive power supplies (maximum output current of 20 mA) for the ERR and COMM LED. Use them as shown below. Recommended LED colors are red for ERR and yellow for COMM. Wiring Method R: LED current limiting resistor LED1: LED for COMM LED2: LED for ERR The maximum current for the LED1 and 2 is 10 mA. LED1 R R 5 VOUT COMM ERR LED2 SRT SRT 80 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Terminal. The following precautions are the same for all SRT1 Terminals. Refer also to the precautions specified for individual Terminals. General Safety Precautions Wiring Turn OFF the Unit before wiring the Unit and do not remove the terminal block cover or touch the terminal block while the Unit is turned ON, otherwise an electric shock may occur. Do not impose any voltage other than the rated voltage on the input terminal. Doing so may result in damage to the Unit or cause the Unit to malfunction. Relay I/O Type SRT1-ROC08 and SRT2-ROC16 Do not connect the Unit to loads operating at any voltage or consuming a total current exceeding the permissible switching voltage or current of the Unit. Doing so may result in the faulty insulation, contact weld, or faulty contact of the relays, or damage to the relays, or cause the relays to malfunction or burn. The life of a relay varies with the switching condition. Test the relays under the actual operating conditions before using the relays within the permissible switching frequency. The use of deteriorated relays may result in the faulty insulation of the relays or cause the relays to burn. Do not use the Unit in places with inflammable gas. Doing so may result in a fire or explosion due to the heat of the relays or a spark from the relays when they are switched. Transistor, Power MOS FET, and SSR I/O Types SRT1-OD04, SRT2-OD08, SRT2-OD16, SRT1-OD16P, SRT1-ROF08, and SRT2-ROF16 Do not connect the Unit to loads consuming a total current exceeding the rated output current of the Unit. Doing so may damage the output element and a short or open-circuit malfunction may result. If the Unit is connected to a DC inductive load, connect a diode to the Unit to protect the Unit from counter-electromotive voltage, otherwise the counter-electromotive voltage may damage the output element and a short or open-circuit malfunction may result. Correct Use Replacing Relays Use the relay removal tool to the left of the screw terminals to replace relays. Turn OFF the Unit to replace relays, otherwise an electric shock may occur or the Unit may malfunction. Installation Environment Do not install the Unit in the following places. Doing so may result in damage to the Unit or cause the Unit to malfunction. • Places with direct sunlight. • Places with ambient temperature ranges not within 0°C to 55°C. • Places with rapid temperature changes resulting in condensation or relative humidity ranges not within 10% to 90%. • Places with corrosive or inflammable gas. • Places with excessive dust, salinity, or metal powder. • Places with vibration or shock affecting the Unit. • Places with water, oil, or chemical sprayed on the Unit. Screw Tightening Torques Tighten all screws of the Unit properly, otherwise the Unit may malfunction. • Tighten each terminal screw to a torque of 0.6 to 1.18 N 􀀀 m (6.2 to 12.0 kgf 􀀀 cm). • Tighten each mounting screw to a torque of 0.6 to 0.98 N 􀀀 m (6.2 to 10.0 kgf 􀀀 cm). Terminal screws Mounting screws Cleaning Use alcohol or benzine to clean the surface of the Unit. Do not use paint thinner to clean the surface, otherwise the surface will be damaged or discolored. Handling Do not drop the Unit or shock or vibrate the Unit excessively. Doing so may result in damage to the Unit or cause the Unit to malfunction. Disassembling, Repairing, and Modifying Do not disassemble, repair, or modify the Unit, otherwise an electric shock may occur or the Unit may malfunction. 81 Position Driver FND-X􀀀-SRT Advanced Servodrivers with Positioner Functions DIO and CompoBus/S Models are Newly Added Servodriver and positioner are combined into one Unit. Conventional U-series, U-series UE type, H-series, and M-series AC Servomotors can be used. Feeder control/DTP control and single operation/ automatic incremental/continuous operation are available. Easy to set, operate, and adjust. Ordering Information Specifications Model CCoompooBuuss//SS mooddeelss For 200-VAC input 6 A FND-X06H-SRT 12 A FND-X12H-SRT 25 A FND-X25H-SRT 50 A FND-X50H-SRT For 100-VAC input 6 A FND-X06L-SRT 12 A FND-X12L-SRT Note: For details, refer to OMNUC FND-X-series User’s Manual (I524). Specifications General Specifications Ambient temperature Operating: 0°C to 55°C Storage: –10°C to 70°C Ambient humidity Operating: 35% to 90% (with no icing) Storage: 35% to 90% (with no icing) Operating atmosphere No corrosive gases Dielectric strength 1,500 VACRMS for 1 min at 50/60 Hz Insulation resistance 5 MW min. (at 500 VDC) between power input terminals and between the power terminal and the case Vibration resistance 10 to 150 Hz in X, Y, and Z directions with 0.10-mm single amplitude; acceleration: 9.8 m/s2 max.; time coefficient: 8 min; 4 sweeps Shock resistance 98 m/s2 max., three times each in X, Y, and Z directions Degree of protection Built into panel (IP00) FND-X􀀀-SRT FND-X􀀀-SRT 82 Performance Specifications Model (see note 1) Item FND-X06H-SRT FND-X12H-SRT FND-X25H-SRT FND-X06L-SRT FND-X12L-SRT Continuous output current (0-P) 2.0 A 4.8 A 8.0 A 2.0 A 3.0 A Momentary maximum output current (0-P) 6.0 A 12 A 25 A 6.0 A 12 A Input power supply Single-phase 200/240 VAC (170 to 264 V) 50/60 Hz Single-phase 100/115 VAC (85 to 127 V) 50/60 Hz Position/speed f db k os o /U Series (INC) Optical Incremental encoder, 2,048 pulses/revolution feedback U Series (ABS) Optical Absolute encoder, 1,024 pulses/revolution U-UE Series Optical Incremental encoder, 1,024 pulses/revolution H Series Magnetic Incremental encoder, 2,000 pulses/revolution M Series Resolver, absolute accuracy 0.18° max.; ambient temperature 25° Applicable load inertia U Series (INC) Maximum of 30 times motor’s rotor inertia Maximum of 20 times motor’s rotor inertia Maximum of 30 times motor’s rotor inertia U Series (ABS) Maximum of 20 times motor’s rotor inertia Maximum of 18 times motor’s rotor inertia Maximum of 20 times motor’s rotor inertia U-UE Series Maximum of 30 times motor’s rotor inertia Maximum of 20 times motor’s rotor inertia Maximum of 30 times motor’s rotor inertia H Series Maximum of 10 times motor’s rotor inertia M Series Maximum of 10 times motor’s rotor inertia Inverter method PWM method based on IGBT PWM frequency 10 kHz Weight Approx. 1.5 kg Approx. 2.5 kg Approx. 1.5 kg Frequency response (speed control) 100 Hz (at a load inertia equivalent to motor’s rotor inertia) Position loop gain 1 to 200 (rad/s) Feed forward 0% to 200% of speed reference Pulse rate 1/32,767 􀀀 (pulse rate 1 / pulse rate 2) 􀀀 32,767/1 Positioning completion width 1 to 32,767 (pulses) U Series (INC): 8,192 pulses/revolution; U Series (ABS): 4,096 pulses/revolution; M Series 24,000 pulses/revolution Acceleration/Deceleration time 0 to 9,999 (ms); acceleration and deceleration times set separately. Two types can be set for each. S-curve acceleration/deceleration function available (filter time constant: 0.00 to 32.76 s). Sequence input 19 pts. (limit inputs, origin proximity, RUN command, START, alarm reset, origin search, JOG operation, teaching, point selection, position data, deceleration stop) Photocoupler input: 24 VDC, 8 mA External power supply: 24 VDC ±1 V, 150 mA min. Sequence output 15 pts. (brake output, READY, origin search completion, origin, teaching, motor running, positioning completion, alarm, point output, position selection, speed selection) Open collector output: 24 VDC, 40 mA Monitor output (S t 2 ) o o ou pu Speed monitor 3 V/motor’s rated speed (output accuracy: approx. ±10%) See note 2.) Current monitor 3 V/motor’s maximum current (output accuracy: approx. ±10%) Regenerative absorption capacity 13 W + 17 J 24 W + 17 J 37 W + 22 J 13 W + 17 J 17 W + 17 J Protective functions Overcurrent, overvoltage, voltage drop, resolver disconnection, power status error, clock stopped, overcurrent (soft), speed amp saturation, motor overload, temporary overload, resolver error, speed over, error counter over, parameter setting error, software limit over, coordinate counter over, overrun, encoder disconnection, encoder communications error, absolute encoder backup error, absolute encoder checksum error, absolute encoder absolute error, absolute encoder over speed, encoder data not transmitted, BCD data error, present value undetermined, PTP data not set Note: 1. When using the 100-VAC-input Position Drivers in combination with the U-series or U-series UE type models, use 200-VAC Servomotors (-HA, -TA , or -H models). 2. For the monitor output, the monitor items and voltage polarity can be set by parameter UP-25 (monitor output selection). FND-X􀀀-SRT FND-X􀀀-SRT 83 Dimensions Note: All units are in millimeters unless otherwise indicated. 200-VAC FND-X06H-SRT/-X12H-SRT 100-VAC FND-X06L-SRT/-X12L-SRT 200-VAC FND-X25H-SRT 80 68 150 158 170 Three, 6 dia. 158 68 Three, M5 Mounting Holes Mounting Holes 119 150 107 158 170 Three, 6 dia. 158 Three, M5 107 Position Drivers Item Model Continuous output current (0-P) Momentary maximum output current (0-P) Input power supply Inverter method PWM frequency Weight 200-VAC input FND-X06H-SRT 2.0 A 6.0 A Single-phase 200/240 VAC PWM method b d 10 kH Approx. 1 5 k 00 C u FND-X12H-SRT 4.8 A 12 A S g e ase (170 to 264 V) e od based on IGBT 0 kHz o 1.5 kg FND-X25H-SRT 8.0 A 25 A 50/60 Hz Approx. 2.5 kg 100-VAC input FND-X06L-SRT 2.0 A 6.0 A Single-phase 100/115 VAC (85 Approx. 1.5 kg FND-X12L-SRT 3.0 A 12 A to 127 V) 50/60 Hz 84 Peripheral Devices Connectors, Cables, and Terminal-block Terminator Dedicated Flat Cable Allows Communication Path Extension and T-branching with Ease Ordering Information Product Appearance Model Specification Branch Connector SCN1-TH4 --- Extension Connector SCN1-TH4E --- Connector Terminator SCN1-TH4T --- Communications Cable SCA1-4F10 Flat cable, 100 m, 4 conductors (0.75 mm2 each) Terminal-block Terminator SRS1-T --- Note: Branch Connectors and Extension Connectors are sold in blocks of 10 Units. Peripheral Devices Peripheral Devices 85 Specifications Ratings/Characteristics Rated current 4 A Contact resistance 20 mW max. Insulation resistance 1,000 MW min. (at 500 VDC) Withstand voltage 1,000 VAC for 1 min, leakage current: 1 mA max. Cable pulling strength 50 N (5.1 kgf) min. Operating temperature –20°C to 70°C Materials Housing PA66 resin (UL94V-2) Branching and extension: Gray Cover Terminator: Black Contact Phosphor bronze and nickel base, tin plated Dimensions Note: All units are in millimeters unless otherwise indicated. SCN1-TH4 Branch Connector SCN1-TH4E Extension Connector SCN1-TH4T Connector Terminator Peripheral Devices Peripheral Devices 86 SRS1-T Terminal-block Terminator 40 Two, 4.4 dia. 30±0.2 Two, 4.2 dia. or M4 20 20 Mounting Holes Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Correct Use The SCN1-TH4, SCN1-TH4E, and SCN1-TH4T are dedicated connectors for CompoBus/S. Always use dedicated CompoBus/S cables with these connectors. Do not locate the cables in places where excessive force may be imposed on the connectors of the cables such as an area where cables may entangle feet. These connectors cannot be reused once they have been attached to cables. Use new connectors if they were not attached to cables properly. Refer to the CompoBus/S Operation Manual (W266) to assemble the connectors. CompoBus/S CompoBus/S 87 Ordering Information Note: Abbreviations for standards: U: UL, C: CSA, CE: EC Directive Product Appearance Model Specifications Standards Master Control Units SRM1-C01-V2 Stand-alone model with built-in controller functions (without RS-232C) UL CSA CE (see SRM1-C02-V2 Stand-alone model with built-in controller functions and RS-232C note 2) Master Units C200HW-SRM21-V1 For C200HX (-ZE), C200HG (-ZE), C200HE (-ZE), and C200HS CQM1-SRM21-V1 For CQM1 SYSMAC Boards C200PC-ISA02-SRM C200PC-ISA12-SRM For C200HX/HG/HE --- I/O Link Unit CPM1A-SRT21 8 inputs 8 outputs UL CSA CE (see note 2) Remote Terminals (Transistor Models) SRT1-ID04 SRT1-ID04-1 SRT2-ID08 SRT2-ID08-1 SRT2-ID16 SRT2-ID16-1 SRT1-OD04 SRT1-OD04-1 SRT2-OD08 SRT2-OD08-1 SRT2-OD16 SRT2-OD16-1 4 transistor input (NPN) 4 transistor inputs (PNP) 8 transistor inputs (NPN) 8 transistor inputs (PNP) 16 transistor inputs (NPN) 16 transistor inputs (PNP) 4 transistor outputs (NPN) 4 transistor outputs (PNP) 8 transistor outputs (NPN) 8 transistor outputs (PNP) 16 transistor outputs (NPN) 16 transistor outputs (PNP) Remote Terminals (M3 Terminal Block Models) SRT1-ID16T SRT1-ID16T-1 SRT2-MD16T SRT2-MD16T-1 SRT2-OD16T SRT2-OD16T-1 16 transistor inputs (NPN) 16 transistor inputs (PNP) 16 transistor I/O points (NPN) 16 transistor I/O points (PNP) 16 transistor outputs (NPN) 16 transistor outputs (PNP) CE (see note 2) Remote Terminals (Relay-mounted Models) SRT2-ROC08 SRT2-ROC16 SRT2-ROF08 SRT2-ROF16 8 relay outputs 16 relay outputs 8 power MOS FET relay outputs 16 power MOS FET relay outputs UL CSA CE (see note 2) Connector Terminals SRT2-VID08S SRT2-VID08S-1 SRT2-VOD08S SRT2-VOD08S-1 SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD16ML SRT2-VOD16ML-1 SRT2-ATT01 SRT2-ATT02 8 transistor input (NPN) 8 transistor inputs (PNP) 8 transistor outputs (NPN) 8 transistor outputs (PNP) 16 transistor inputs (NPN) 16 transistor inputs (PNP) 16 transistor outputs (NPN) 16 transistor outputs (PNP) Mounting hook A Mounting hook B CE (see note 2) Sensor Terminals SRT1-ID08S SRT1-ND08S SRT1-OD08S 8 inputs (NPN) 4 automatic teaching points (NPN) 8 outputs --- CompoBus/S CompoBus/S 88 Product Standards Appearance Model Specifications Sensor Amplifier Terminals for CompoBus/S SRT1-TID04S SRT1-TKD04S SRT1-XID04S SRT1-XKD04S --- --- E3X-N Connector Type E3X-NH16 E3X-NT16 E3X-NT26 Long-distance, high-precision, 1 channel General-purpose, 1 channel Multi-functional, 1 channel E3X-NM16 Multi-functional, 4 channels Terminal Block Unit E39-JID01 One input point Analog Input Terminal SRT2-AD04 1 to 4 inputs (set with DIP switch) CE (see note 2) Analog Output Terminal SRT2-DA02 1 or 2 outputs (set with DIP switch) Remote I/O Modules SRT1-ID16P SRT1-OD16P --- --- Position Drivers FND-X06H-SRT 200-VAC input, momentary maximum output current: 6.0 A FND-X12H-SRT 200-VAC input, momentary maximum output current: 12 A FND-X25H-SRT 200-VAC input, momentary maximum output current: 25 A FND-X06L-SRT 100-VAC input, momentary maximum output current: 6.0 A FND-X12L-SRT 100-VAC input, momentary maximum output current: 12 A Branch Connector Extension Connector Connector Terminator SCN1-TH4 SCN1-TH4E SCN1-TH4T --- Flat Cable SCA1-4F10 100 m Terminal-block Terminator SRS1-T --- Note: 1. Refer to the C200HS Catalog (P32). Refer to the C200HX/C200HG/C200HE (-ZE) Catalog 2. Information on EC Directives Individual OMRON products that comply with EC Directives conform to the common emission standards of EMC Directives. However, the emission characteristics of these products installed on customers’ equipment may vary depending on the configuration, wiring, layout, and other conditions of the control panel used. For this reason, customers are requested to check whether the emission characteristics of the entire machine or equipment comply with the EMC Directives. CompoBus/S CompoBus/S 89 Model Number Legend SRT􀀀-􀀀􀀀􀀀􀀀􀀀 2 3 4 5 6 7 -1 1 1. Communications Mode 1: High-speed communications mode 2: High-speed/Long-distance communications mode 2. I/O Module Replacement None: Impossible R: Possible (Relays and power MOS FET relays) 3. I/O Specifications I: Input O: Output N: Input and output (with remote teaching) AD: Analog input DA: Analog output 4. I/O Voltage Specifications D: DC C: AC/DC (contact type) F: AC/DC (power MOS FET type) 5. I/O Points 04: 4 points 08: 8 points 16: 16 points 6. I/O Connection Method None: Screw terminals S: Connector P: PCB terminals 7. None: NPN -1: PNP CompoBus/S CompoBus/S 90 Notes: Cat. No. Q103-E1-6 Note: Specifications subject to change without notice. Printed in Japan 0200-8C (0796) a Authorized Distributor: OMRON Corporation Systems Components Division 66 Matsumoto Mishima-city, Shizuoka 411-8511 Japan Tel: (81)559-77-9633/Fax: (81)559-77-9097 Regional Headquarters OMRON EUROPE B.V. Wegalaan 67-69, NL-2132 JD Hoofddorp The Netherlands Tel: (31)2356-81-300/Fax: (31)2356-81-388 OMRON ELECTRONICS, INC. 1 East Commerce Drive, Schaumburg, IL 60173 U.S.A. Tel: (1)847-843-7900/Fax: (1)847-843-8568 OMRON ASIA PACIFIC PTE. LTD. 83 Clemenceau Avenue, #11-01, UE Square, Singapore 239920 Tel: (65)835-3011/Fax: (65)835-2711 The essential guide Harmony Control and Signalling units 2013 Control and signalling units Harmony, simple and innovative solutions for your applications World leader in control and signalling components, Schneider Electric continues its policy of innovation within the Harmony ranges in order to perfect the efficiency of your dialogue solutions. Invest with complete peace of mind! The right solution for your application An offer unrivalled in content and complementarity Optimised cost saving solutions due to increased flexibility of the offers, enabling multiple combinations and full compatibility Quality you can rely on Robust products that comply to the highest quality standards Valuable time that you save Simple selection and quick installation for all Harmony components This document is a selection of the top selling products. For more information: http://www.schneider-electric.com Contents Pushbuttons, switches, pilot lights and control stations Ø 16, plastic bezel, Harmony XB6 .......................................................................................... 2 to 4 Ø 8 and 12, pilot lights, Harmony XVL .......................................................................................... 5 Ø 22, metal bezel, Harmony XB4 / Control stations Harmony XAP ...................................... 6 to 9 Ø 22, plastic bezel, Harmony XB5 / Control stations Harmony XAL ................................. 10 to 13 Ø 22, plastic bezel, wireless and batteryless, Harmony XB5R ........................................... 14 to 15 Ø 22, plastic bezel - Monolithic, Harmony XB7 .................................................................. 16 to 17 Ø 30, metal and plastic bezel, Harmony 9001K, 9001SK .................................................. 18 to 20 Cam switches Harmony K series ............................................................................................................... 21 to 22 Signalling solutions Ø 40, 60, 100 mm monolithic tower lights, Harmony XVC ........................................................... 23 Ø 45 mm monolithic beacons and tower lights, accessories, Harmony XVDLS / XVC ............... 24 Ø 70 mm modular tower lights (IP 66), Harmony XVB ................................................................ 25 Ø 70 mm modular tower lights (up to IP 54), Harmony XVE ....................................................... 26 Ø 45, 50 mm modular tower lights (up to IP 54), Harmony XVM / XVP ...................................... 27 Modular tower lights accessories, Harmony XV .......................................................................... 28 Ø 84, 106, 120, 130 mm rotating mirror beacons, Harmony XVR ............................................... 29 Accessories for rotating mirror beacons, Harmony XVR ............................................................. 30 Electronic alarms and multisound sirens, Harmony XVS ............................................................ 30 Components for hoisting applications Pendant control stations, Harmony XAC ............................................................................ 31 to 32 Illuminated pushbuttons Type of head Flush push Shape of head rectangular (2) Degree of protection IP 65 / Nema 4, 4X, 13 / Class II Mounting (mm) panel cut-out Ø 16.2 mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head Connection (3) Tags for 2.8 x 0.5 Faston connectors or for soldering Type of push Spring return Complete products 12 … 24 V AC/DC Products for user assembly References white NO XB6DW1B1B ZB6Ep1B (1) ZB6Z1B ZB6DW1 NO + NC XB6DW1B5B ZB6Ep1B (1) ZB6Z5B ZB6DW1 green NO XB6DW3B1B ZB6Ep3B (1) ZB6Z1B ZB6DW3 NO + NC XB6DW3B5B ZB6Ep3B (1) ZB6Z5B ZB6DW3 red NC XB6DW4B2B ZB6Ep4B (1) ZB6Z2B ZB6DW4 NO + NC XB6DW4B5B ZB6Ep4B (1) ZB6Z5B ZB6DW4 yellow NO – ZB6Ep5B (1) ZB6Z1B ZB6DW5 NO + NC XB6DW5B5B ZB6Ep5B (1) ZB6Z5B ZB6DW5 Type of push Latching References white NO – ZB6Ep1B (1) ZB6Z1B ZB6DF1 NO + NC XB6DF1B5B ZB6Ep1B (1) ZB6Z5B ZB6DF1 green NO XB6DF3B1B ZB6Ep3B (1) ZB6Z1B ZB6DF3 NO + NC XB6DF3B5B ZB6Ep3B (1) ZB6Z5B ZB6DF3 red NC XB6DF4B2B ZB6Ep4B (1) ZB6Z2B ZB6DF4 NO + NC XB6DF4B5B ZB6Ep4B (1) ZB6Z5B ZB6DF4 yellow NO – ZB6Ep5B (1) ZB6Z1B ZB6DF5 NO + NC – ZB6Ep5B (1) ZB6Z5B ZB6DF5 Pilot lights Type of head Smooth lens cap Shape of head rectangular (2) Complete products Products for user assembly 12 … 24 V AC/DC References white XB6DV1BB ZB6Ep1B (1) ZB6DV1 green XB6DV3BB ZB6Ep3B (1) ZB6DV3 red XB6DV4BB ZB6Ep4B (1) ZB6DV4 yellow XB6DV5BB ZB6Ep5B (1) ZB6DV5 blue – ZB6Ep6B (1) ZB6DV6 (1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above. (2) For products with a square head, replace the letter D in the reference by the letter C (XB6DW1B1B becomes XB6CW1B1B). For products with a circular head, replace the letter D in the reference by the letter A (XB6DW1B1B becomes XB6AW1B1B). (3) Alternative connection: 1 x 0.5 pins for printed circuit boards. Pushbuttons, switches and pilot lights Ø 16 with plastic bezel Contact functions and light functions with integral LED (1): Voltage Letter (p) 12…24 V AC/DC (15 mA) B 48…120 V AC (25 mA) G 230…240 V AC (25 mA) M + 0.2 0 Harmony XB6 = + + = + Pushbuttons Type of head Flush push Shape of head rectangular (1) Degree of protection IP 65 / Nema 4, 4X, 13 / Class II Mounting (mm) panel cut-out Ø 16.2 mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head Connection (2) Tags for 2.8 x 0.5 Faston connectors or for soldering Type of push Spring return Complete products Products for user assembly References white NO XB6DA11B ZB6Z1B ZB6DA1 NO + NC XB6DA15B ZB6Z5B ZB6DA1 black NO – ZB6Z1B ZB6DA2 NO + NC XB6DA25B ZB6Z5B ZB6DA2 green NO XB6DA31B ZB6Z2B ZB6DA3 NO + NC XB6DA35B ZB6Z5B ZB6DA3 red NO – ZB6Z1B ZB6DA4 NO + NC XB6DA45B ZB6Z5B ZB6DA4 (1) For products with a square head, replace the letter D in the reference by the letter C (XB6DA11B becomes XB6CA11B). For products with a circular head, replace the letter D in the reference by the letter A (XB6DA11B becomes XB6AA11B). (2) Alternative connection: 1 x 0.5 pins for printed circuit boards. Ø 30 mushroom head Emergency stop pushbuttons (3) Type of head Trigger action (EN/ISO 13850) Shape of head cylindrical Type of push Turn to release Complete products Products for user assembly References red 2 NC + 1 NO XB6AS8349B ZB6E2B ZB6Z5B ZB6AS834 Type of push Key release, 200 References red 2 NC + 1 NO XB6AS9349B ZB6E2B ZB6Z5B ZB6AS934 (3) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. + 0.2 0 Contact functions = + = + + Selector switches and key switches Type of head Black handle Shape of head rectangular (2) Degree of protection IP 66 / Nema 4, 4X, 13 / Class II Mounting (mm) panel cut-out Ø 16.2 mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head Connection (3) Tags for 2.8 x 0.5 Faston connectors or for soldering Type of operator Black handle Complete products Products for user assembly Number and type of positions 2 positions 2 positions 2 positions stay put stay put spring return to centre References NO XB6DD221B ZB6Z1B ZB6DD22 ZB6Z1B ZB6DD24 NO + NC XB6DD225B ZB6Z5B ZB6DD22 ZB6Z5B ZB6DD24 Number and type of positions 3 positions 3 positions 3 positions stay put stay put spring return to centre References NO XB6DD235B ZB6Z5B ZB6DD23 ZB6Z5B ZB6DD25 Type of operator Key, n° 200 Complete products Products for user assembly Number and type of positions 2 positions 2 positions 2 positions stay put stay put spring return to centre References NO + NC XB6DGC5B ZB6Z5B ZB6DGC ZB6Z5B ZB6DGB Number and type of positions 3 positions 3 positions 3 positions stay put stay put spring return to centre References NO + NC XB6DGH5B ZB6Z5B ZB6DGH ZB6Z5B ZB6DGS Illuminated selector switches Type of operator Coloured handle Products for user assembly Number and type of positions 2 positions 3 positions stay put stay put References white NO + NC ZB6Ep1B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK1 green NO + NC ZB6Ep3B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK3 red NO + NC ZB6Ep4B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK4 (1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above. (2) For products with a square head, replace the letter D in the reference by the letter C (XB6DD221B becomes XB6CD221B). For products with a circular head, replace the letter D in the reference by the letter A (XB6DD221B becomes XB6AD221B). (3) Alternative connection: 1 x 0.5 pins for printed circuit boards. (1): Voltage Letter (p) 12…24 V AC/DC (15 mA) B 48…120 V AC (25 mA) G 230…240 V AC (25 mA) M + 0.2 0 Harmony XB6 60° 60° 45° 60° 60° 60° 60° 45° 45° 70° 70° 45° 70° 70° 70° 70° 45° 45° 60° 60° 60° Pushbuttons, switches and pilot lights Ø 16 with plastic bezel Contact functions and light functions with integral LED = + = + = + + LED pilot lights With black bezel With integral lens cap Type of head Protruding LED, Ø 8 mm Covered LED, Ø 8 mm Covered LED, Ø 12 mm Degree of protection IP 40, IP 65 with seal (2) Mounting (mm) panel cut-out Ø 8.2 mm Ø 8.2 mm Ø 12.2 mm mounting centres 12.5 x 12.5 mm 10.5 x 10.5 mm 16.5 x 16.5 mm Dimensions (mm) Ø x Depth (below head) Ø 12 x 32 Ø 10 x 34 Ø 16 x 45 Connection Tags (3) Tags (3) Threaded connectors References (1) green XVLA1p3 XVLA2p3 XVLA3p3 red XVLA1p4 XVLA2p4 XVLA3p4 yellow XVLA1p5 XVLA2p5 XVLA3p5 Tightening key For Ø 8 mm pilot lights For Ø 12 mm pilot lights References XVLX08 XVLX12 (1) Basic reference, to be completed by the number 1, 2, 3 or 4 indicating the required voltage. See voltage table above. (2) For an IP 65 degree of protection, include the seals: XVLZ911 for pilot lights XVLA1pp and XVLA2pp; XVLZ912 for pilot lights XVLA3pp. (3) Tags for 2.8 x 0.5 Faston connectors or for soldering. Sub-assemblies & accessories for Ø 16 plastic bezel control and signalling units Sub-assemblies Bodies for pushbuttons and selector switches Bodies for pilot lights Rated operational characteristics, AC-15: Ue = 240 V and Ie = 1.5 A or Ue = 120 V and Ie = 3 A Consumption Positive operation of contacts conforming to IEC/EN 60947-5-1: NC contacts with positive opening operation, 15 mA 12…24 V AC/DC positive opening force 20 N 25 mA 48…120 V AC 25 mA 230…240 V AC Type of Fixing collar Contacts Pilot light 12 … 24 V 48 … 120 V 230 … 240 V contact + contacts bodies References NO ZB6Z1B ZB6E1B White ZB6EB1B ZB6EG1B ZB6EM1B NC ZB6Z2B ZB6E2B Green ZB6EB3B ZB6EG3B ZB6EM3B 2 NO ZB6Z3B – Red ZB6EB4B ZB6EG4B ZB6EM4B 2 NC ZB6Z4B – Yellow ZB6EB5B ZB6EG5B ZB6EM5B NO + NC ZB6Z5B – Blue ZB6EB6B ZB6EG6B ZB6EM6B LED pilot lights Ø 8 and 12 (1): Voltage Number (p) 5 V (25 mA) 1 12 V (18 mA) 2 24 V (18 mA) 3 48 V (10 mA) 4 Accessories Legend holders 24 x 28 mm (8 x 21 mm legend) 24 x 36 mm (16 x 21 mm legend) Blank legend Background colour without legend yellow or white black or red without legend yellow or white black or red References (10)* ZB6YD20 ZB6YD21 ZB6YD22 ZB6YD30 ZB6YD31 ZB6YD32 Blank legends for legend holders 8 x 21 mm (24 x 28 mm legend holder) 16 x 21 mm (24 x 36 mm legend holder) Background colour – yellow or white black or red – yellow or white black or red References (20)* – ZB6Y1001 ZB6Y2001 – ZB6Y4001 ZB6Y3001 Ø 45 mm yellow legend for mushroom head Emergency stop pushbutton Marking Blank, for engraving EMERGENCY STOP ARRET D’URGENCE References ZB6Y7001 ZB6Y7330 ZB6Y7130 Body/fixing collar Plate Tightening tool Dismantling tool anti-rotation and slackening, for fixing nut for removal of contact blocks References ZB6Y009 (10)* ZB6Y003 (10)* ZB6Y905 (2)* ZB6Y018 (5)* Protective shutter for pushbuttons and switches Connector Blanking plug for rectangular heads for circular and square heads Faston, female IP 65 References ZB6YD001 ZB6YA001 ZB6Y004 (100)* ZB6Y005 (10)* * sold in lots of Harmony XVL Pushbuttons, spring return Type of head Chromium plated circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class I Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals Type of push Flush Flush, booted Unmarked Products Complete For user assembly Complete For user assembly References black NO XB4BA21 ZB4BZ101 ZB4BA2 XB4BP21 ZB4BZ101 ZB4BP2 green NO XB4BA31 ZB4BZ101 ZB4BA3 XB4BP31 ZB4BZ101 ZB4BP3 red NC XB4BA42 ZB4BZ102 ZB4BA4 XB4BP42 ZB4BZ102 ZB4BP4 yellow NO XB4BA51 ZB4BZ101 ZB4BA5 XB4BP51 ZB4BZ101 ZB4BP5 blue NO XB4BA61 ZB4BZ101 ZB4BA6 XB4BP61 ZB4BZ101 ZB4BP6 Type of push Flush With international marking Products Complete For user assembly References green NO XB4BA3311 ZB4BZ101 ZB4BA331 – – – red NC XB4BA4322 ZB4BZ102 ZB4BA432 – – – white NO XB4BA3341 ZB4BZ101 ZB4BA334 – – – black NO XB4BA3351 ZB4BZ101 ZB4BA335 _ _ _ Type of push Projecting Mushroom head, Ø 40 mm Unmarked Products Complete For user assembly Complete For user assembly References black NO – – – XB4BC21 ZB4BZ101 ZB4BC2 red NC XB4BL42 ZB4BZ102 ZB4BL4 – – – Type of push Double-headed pushbuttons Triple-headed pushbuttons Degree of protection IP 66 - IP 69K IP 66 - IP 69K With international marking Products Complete For user assembly Complete For user assembly (A) (B) References (A) NO + NC XB4BL73415 ZB4BZ105 ZB4BL7341 – – – (B) NO + NC + NO – – – XB4BA711237 ZB4BZ103 + ZBE102 ZB4BA71123 (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8). Ø 40 mm mushroom head Emergency stop pushbuttons (2) Trigger action (EN/ISO 13850) Type of push Push-pull NO + NC Unmarked Products Complete For user assembly References red NO + NC XB4BT845 ZB4BZ105 ZB4BT84 Type of push Turn to release NO + NC References red NO + NC XB4BS8445 ZB4BZ105 ZB4BS844 Type of push Key release NO + NC References red NO + NC XB4BS9445 ZB4BZ105 ZB4BS944 (2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. Harmony XB4 + 0.4 0 Pushbuttons, switches and pilot lights Ø 22 with metal bezel Contact functions + = + = + Contact functions Selector switches and key switches Type of head Chromium plated circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class I Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals Type of operator Key, n° 455 Products Complete For user assembly Complete For user assembly Number and type of positions (2) 2 positions 2 positions 2 positions 2 positions stay put stay put stay put stay put References black NO XB4BG21 ZB4BZ101 ZB4BG2 XB4BG41 ZB4BZ101 ZB4BG4 Number and type of positions 2 positions 2 positions 3 positions 3 positions spring return to left spring return to left stay put stay put References black NO XB4BG61 ZB4BZ101 ZB4BG6 – – – black NO + NO – – – XB4BG33 ZB4BZ103 ZB4BG3 + 0.4 0 Type of operator Handle Products Complete For user assembly Complete For user assembly Number and type of positions 2 positions 2 positions 2 positions 2 positions stay put stay put spring return to left spring return to left References black NO XB4BD21 ZB4BZ101 ZB4BD2 XB4BD41 ZB4BZ101 ZB4BD4 Number and type of positions 3 positions 3 positions 3 positions 3 positions stay put stay put spring return to centre spring return to centre References black NO + NO XB4BD33 ZB4BZ103 ZB4BD3 XB4BD53 ZB4BZ103 ZB4BD5 = + = + Type Double-headed pushbuttons with LED pilot light Illuminated selector switches (1 flush green push, 1 projecting red push) (2 position stay put) Degree of protection IP 66 - IP 69K IP 66 Light source Integral LED Integral LED Products Complete Complete Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 24 V AC/DC 110…120 V AC 230…240 V AC References green NO + NC – – – XB4BK123B5 XB4BK123G5 XB4BK123M5 red NO + NC – – – XB4BK124B5 XB4BK124G5 XB4BK124M5 orange NO + NC – – – XB4BK125B5 XB4BK125G5 XB4BK125M5 White NO + NC XB4BW73731B5 XB4BW73731G5 XB4BW73731M5 – – – (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal. Harmony XB4 Pushbuttons, switches and pilot lights Ø 22 with metal bezel Light functions Pilot lights Type of head Circular bezel Smooth lens cap Degree of protection IP 66 / Nema 4X, 13 / Class I Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth below head 43 Connection (1) Screw clamp terminals Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white XB4BVB1 XB4BVG1 XB4BVM1 XB4BV61 ZB4BV6 ZB4BV01 green XB4BVB3 XB4BVG3 XB4BVM3 XB4BV63 ZB4BV6 ZB4BV03 red XB4BVB4 XB4BVG4 XB4BVM4 XB4BV64 ZB4BV6 ZB4BV04 yellow XB4BVB5 XB4BVG5 XB4BVM5 XB4BV65 ZB4BV6 ZB4BV05 blue XB4BVB6 XB4BVG6 XB4BVM6 – – – + 0.4 0 Illuminated pushbuttons and selector switches Type Flush push, spring return, illuminated pushbuttons Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white NO + NC XB4BW31B5 XB4BW31G5 XB4BW31M5 XB4BW3165 ZB4BW065 ZB4BW31 green NO + NC XB4BW33B5 XB4BW33G5 XB4BW33M5 XB4BW3365 ZB4BW065 ZB4BW33 red NO + NC XB4BW34B5 XB4BW34G5 XB4BW34M5 XB4BW3465 ZB4BW065 ZB4BW34 orange NO + NC XB4BW35B5 XB4BW35G5 XB4BW35M5 XB4BW3565 ZB4BW065 ZB4BW35 blue NO + NC XB4BW36B5 XB4BW36G5 XB4BW36M5 – – – = + = + Separate components and accessories Electrical blocks (1) (2) Single contact blocks Light blocks with integral LED Light block, direct supply Rated operational characteristics AC-15, 240 V - 3 A Consumption 18 mA 24 V AC/DC Positive operation of contacts NC contacts with positive opening operation 14 mA 120 V AC conforming to IEC/EN 60947-5-1 14 mA 240 V AC Screw clamp terminal Spring clamp terminal To combine with heads for integral LED For BA 9s bulb (not included) 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References (5)* NC ZBE101 ZBE1015 white ZBVB1 ZBVG1 ZBVM1 ZBV6 NO ZBE102 ZBE1025 green ZBVB3 ZBVG3 ZBVM3 Colour provided by lens red ZBVB4 ZBVG4 ZBVM4 orange ZBVB5 ZBVG5 ZBVM5 blue ZBVB6 ZBVG6 ZBVM6 Diecast metal enclosures (Zinc alloy, usable depth 49 mm) 1 vertical row 2 vertical rows Number of cut-outs Front face dimensions 1 2 3 4 2 4 6 References 80 x 80 mm XAPM1201 – – – XAPM1202 – – 80 x 130 mm – XAPM2202 XAPM2203 – – XAPM2204 – 80 x 175 mm – – XAPM3203 XAPM3204 – – XAPM3206 Accessories (2) Legend holders, 30 x 40 mm, for 8 x 27 mm legends Marking Background colour: black or red white or yellow References (10)* Blank ZBY2101 ZBY4101 International 0 (red background) ZBY2931 I ZBY2147 AUTO ZBY2115 STOP ZBY2304 – English OFF ZBY2312 ON ZBY2311 START ZBY2303 – – French ARRET (red b/grnd) ZBY2104 ARRET-MARCHE ZBY2166 MARCHE ZBY2103 – – German AUS ZBY2204 AUS-EIN ZBY2266 EIN ZBY2203 – – Spanish PARADA (red b/grnd) ZBY2404 PARADA-MARCHA ZBY2466 MARCHA ZBY2403 – – Legend holders, 30 x 50 mm, for 18 x 27 mm legends Background colour black or red white or yellow References (10)* Blank ZBY6101 ZBY6102 Ø 60 mm legend for mushroom head Emergency stop pushbutton Background colour yellow Marking Blank EMERGENCY STOP ARRET D’URGENCE NOT HALT PARADA DE EMERGENCIA References ZBY9140 ZBY9330 ZBY9130 ZBY9230 ZBY9430 (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal. (2) Electrical blocks and accessories also for use with Harmony XB5 plastic range * sold in lots of Type of push Double-headed pushbuttons Triple-headed pushbuttons Degree of protection IP 66 - IP 69K IP 66 - IP 69K With international marking Products Complete (A) For user assembly Complete (B) For user assembly References (A) NO + NC XB5AL73415 ZB5AZ105 ZB5AL7341 – – – (B) NO + NC + NO – – – XB5AA711237 ZB5AZ103 + ZBE102 ZB5AA71123 (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8). Harmony XB5 Pushbuttons, switches and pilot lights Ø 22 with plastic bezel Contact functions Pushbuttons, spring return Type of head Circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class II Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals + 0.4 0 Type of push Flush Flush, booted Unmarked Products Complete For user assembly Complete For user assembly References black NO XB5AA21 ZB5AZ101 ZB5AA2 XB5AP21 ZB5AZ101 ZB5AP2 green NO XB5AA31 ZB5AZ101 ZB5AA3 XB5AP31 ZB5AZ101 ZB5AP3 red NC XB5AA42 ZB5AZ102 ZB5AA4 XB5AP42 ZB5AZ102 ZB5AP4 yellow NO XB5AA51 ZB5AZ101 ZB5AA5 XB5AP51 ZB5AZ101 ZB5AP5 blue NO XB5AA61 ZB5AZ101 ZB5AA6 XB5AP61 ZB5AZ101 ZB5AP6 Type of push Flush With international marking Products Complete For user assembly Complete For user assembly References green NO XB5AA3311 ZB5AZ101 ZB5AA331 – – – red NC XB5AA4322 ZB5AZ102 ZB5AA432 – – – white NO XB5AA3341 ZB5AZ101 ZB5AA334 – – – black NO XB5AA3351 ZB5AZ101 ZB5AA335 – – – Type of push Projecting Mushroom head, Ø 40 mm Unmarked Products Complete For user assembly Complete For user assembly References black NO – – – XB5AC21 ZB5AZ101 ZB5AC2 red NC XB5AL42 ZB5AZ102 ZB5AL4 – – – Ø 40 mm mushroom head Emergency stop pushbuttons (2) Trigger action (EN/ISO 13850) Type of push Push-pull NO + NC Unmarked Products Complete For user assembly References red NO + NC XB5AT845 ZB5AZ105 ZB5AT84 Type of push Turn to release NO + NC References red NO + NC XB5AS8445 ZB5AZ105 ZB5AS844 Type of push Key release NO + NC References red NO + NC XB5AS9445 ZB5AZ105 ZB5AS944 (2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850: to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. + = + = + 10 Contact functions Selector switches and key switches Type of head Circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class II Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals Type of operator Handle Products Complete For user assembly Complete For user assembly Number and type of positions 2 positions 2 positions 2 positions 2 positions stay put stay put spring return to left spring return to left References black NO XB5AD21 ZB5AZ101 ZB5AD2 XB5AD41 ZB5AZ101 ZB5AD4 Number and type of positions 3 positions 3 positions 3 positions 3 positions stay put stay put spring return to centre spring return to centre References black NO + NO XB5AD33 ZB5AZ103 ZB5AD3 XB5AD53 ZB5AZ103 ZB5AD5 Type of operator Key, n° 455 Number and type of positions (2) 2 positions 2 positions 2 positions 2 positions stay put stay put stay put stay put References black NO XB5AG21 ZB5AZ101 ZB5AG2 XB5AG41 ZB5AZ101 ZB5AG4 (2) The symbol indicates key withdrawal position. + 0.4 0 = + 11 Harmony XB5 Pushbuttons, switches and pilot lights Ø 22 with plastic bezel Light functions Pilot lights Type of head Circular bezel Smooth lens cap Degree of protection IP 66 / Nema 4X, 13 / Class II Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth below head 43 Connection (1) Screw clamp terminals Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white XB5AVB1 XB5AVG1 XB5AVM1 XB5AV61 ZB5AV6 ZB5AV01 green XB5AVB3 XB5AVG3 XB5AVM3 XB5AV63 ZB5AV6 ZB5AV03 red XB5AVB4 XB5AVG4 XB5AVM4 XB5AV64 ZB5AV6 ZB5AV04 orange XB5AVB5 XB5AVG5 XB5AVM5 XB5AV65 ZB5AV6 ZB5AV05 blue XB5AVB6 XB5AVG6 XB5AVM6 – – – Illuminated pushbuttons and selector switches Type Flush push, spring return, illuminated pushbuttons Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white NO + NC XB5AW31B5 XB5AW31G5 XB5AW31M5 XB5AW3165 ZB5AW065 ZB5AW31 green NO + NC XB5AW33B5 XB5AW33G5 XB5AW33M5 XB5AW3365 ZB5AW065 ZB5AW33 red NO + NC XB5AW34B5 XB5AW34G5 XB5AW34M5 XB5AW3465 ZB5AW065 ZB5AW34 orange NO + NC XB5AW35B5 XB5AW35G5 XB5AW35M5 XB5AW3565 ZB5AW065 ZB5AW35 blue NO + NC XB5AW36B5 XB5AW36G5 XB5AW36M5 – – – Type Double-headed pushbuttons with LED pilot light Illuminated selector switches (1 flush green push, 1 projecting red push) (2 position stay put) Degree of protection IP 66 - IP 69K IP 66 Light source Integral LED Integral LED Products Complete Complete Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 24 V AC/DC 110…120 V AC 230…240 V AC References green NO + NC – – – XB5AK123B5 XB5AK123G5 XB5AK123M5 red NO + NC – – – XB5AK124B5 XB5AK124G5 XB5AK124M5 orange NO + NC – – – XB5AK125B5 XB5AK125G5 XB5AK125M5 white NO + NC XB5AW73731B5 XB5AW73731G5 XB5AW73731M5 – – – (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal. + 0.4 0 = + = + 12 Separate components and accessories: see page 9. Control stations For XB5 pushbuttons, switches and pilot lights Ø 22 with plastic bezel Harmony XAL (1) Empty enclosures: Basic reference: XALK0p, replace the p by the number of cut-outs required (see cut-out table above) (1): Number of cut-outs Number (p) 1 1 2 2 3 3 4 4 5 5 Complete stations with 1 pushbutton, selector switch or key switch (light grey RAL 7035 base with dark grey RAL 7016 lid) Degree of protection IP 65 / Nema 4X and 13 / Class II Dimensions (mm) W x H x D 68 x 68 x 113 max. (with key release Ø 40 mushroom head pushbutton) Fixing (mm) 2 x Ø 4.3 on 54 mm centres Function 1 Start or Stop function 1 Start-Stop function Marking On spring return push On legend holder and legend below head Number and type of pushbutton/selector switch/key switch 1 flush green p/b 1 flush red p/b 1 projecting red p/b 1 2 position stay put selector switch or key switch Black handle Key n° 455 (key withdrawal LH pos.) References NO I XALD102 – – – – Start XALD103 – – – – O - I – – – XALD134 XALD144 O – XALD112 XALD115 – – Function Emergency stop (2) (light grey RAL 7035 base with yellow RAL 1012 lid) Number and type of mushroom head pushbutton 1 red Ø 40 head, turn to release 1 red Ø 40 head, key release Latching mechanism Trigger action (EN/ISO 13850) Trigger action (EN/ISO 13850) References NC XALK178 XALK188 NC + NC XALK178F XALK188F NO + NC XALK178E XALK188E NC + NC + NO XALK178G XALK188G (2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. (1) Empty enclosures: Basic reference: XALD0p, replace the p by the number of cut-outs required (see cut-out table above) Complete stations with 2 and 3 pushbuttons or 2 pushbuttons + 1 pilot light (light grey RAL 7035 base with dark grey RAL 7016 lid) Dimensions (mm) W x H x D 2-way control stations: 68 x 106 x 62; 3-way control stations: 68 x 136 x 87 Fixing (mm) 2-way control stations: 2 x Ø 4.3 on 54 x 68 centres; 3-way control stations: 2 x Ø 4.3 on 54 x 98 centres Function Start-Stop functions 2 functions 3 functions Marking On spring return push Number and type of pushbutton/pilot light 1 flush green p/b 1 flush green pushbutton 1 flush white p/b 1 flush white p/b 1 flush white p/b 1 flush red p/b 1 flush red pushbutton 1 flush black p/b 1 flush red p/b 1 Ø 30 red mush- 1 red pilot light with integral LED 1 flush black p/b room head p/b 1 flush black p/b 24 V AC/DC 230 V AC References NO + NC I - O XALD213 XALD363B XALD363M – – – Start - Stop XALD215 – – – – – NO + NO – – – XALD222 – – NO + NC + NO – – – – XALD324 XALD328 Accessories Standard contact blocks Light blocks with integral LED, colour red Description NO contact NC contact 24 V AC/DC 230 V AC References ZENL1111 ZENL1121 ZALVB4 ZALVM4 13 Harmony XB5R Wireless and batteryless pushbuttons Packages and components Ready to use packs Panel mounting Mobile application Wireless and batteryless 22mm pushbutton assembled on fixing collar Plastic head Metal head Plastic head Metal head Plastic head in handy box Caps 1 black cap 1 set of 10 different coloured caps 1 black cap 1 set of 10 different coloured caps Receiver Non configurable Configurable functions: monostable, bistable, stop/start Non configurable Configurable functions: monostable, bistable, stop/start Relay output 1relay output type RT 3A 2 relays output type RT 3A 1relay output type RT 3A 2 relays output type RT 3A Voltage receiver 24 VDC 24….240 AC/DC 24 VDC 24….240 AC/DC References XB5RFB01 XB4RFB01 XB5RFA02 XB4RFA02 XB5RMB03 XB5RMA04 The pushbutton and receiver are factory paired Transmitter components for wireless and batteryless pushbuttons Plastic mushroom head Plastic head Metal head Wireless and batteryless pushbuttons including - a transmitter fitted with fixing collar - a spring return pushbutton head with clipped-in cap Reference Cap colour White – ZB5RTA1 ZB4RTA1 Black – ZB5RTA2 ZB4RTA2 Green – ZB5RTA3 ZB4RTA3 White I on green background – ZB5RTA331 ZB4RTA331 Red – ZB5RTA4 ZB4RTA4 White O on red background – ZB5RTA432 ZB4RTA432 Yellow – ZB5RTA5 ZB4RTA5 Blue – ZB5RTA6 ZB4RTA6 Black ZB5RTC2 – – Transmitter components for wireless and batteryless rope pull switch Rope pull switch with wireless and batteryless transmitter Reference ZBRP1 14 Components and accessories Configurable receivers Description - 2 buttons (learn, parameter setting) - 6 indicating LEDs (power ON, outputs, signal strenght) Output function Monostable Monostable, bistable Monostable, bistable, stop/start Output type 4 PNP outputs 200 mA / 24V 2 relay outputs type RT 3A Receiver voltage 24 VDC 24….240 AC/DC References ZBRRC ZBRRD ZBRRA Configurable access point (1) Description - 7-segment display - jog dial - 8 indicating LEDs (power ON, functions mode, communication status, signal strength) - external antenna connector and protective plug Output function Monostable Output type 2 RS485 for Modbus RS485 serial line 1 slot for communication module ZBRCETH Receiver voltage 24….240 AC/DC References ZBRN2 ZBRN1 (1) Available 1st quarter 2013. Complementary accessories Relay antennas Communication module Plastic empty boxes Description 1 power-ON LED 2 LEDs reception / transmission 1 RF connector Modbus/TCP protocol 2 RJ45 connectors Handy, 1 cut-out 1 cut-out 2 cut-outs Cable lenght 5m 2m Voltage 24….240 AC/DC Reference ZBRA1 ZBRA2 (1) ZBRCETH (1) ZBRM01 XALD01 XALD02 (1) Available 1st quarter 2013. 15 Pushbuttons Type of head Flush or projecting push circular Degree of protection IP 65, class II, NEMA type 3 and 12 Mounting (mm) panel cut-out Ø 22.4 (0 +0.1) mounting centres 30 (horizontal) x 40 (vertical) Dimensions (mm) Ø x Depth (below head) Ø 29 x 41.5 (Ø 40 x 41.5 for Emergency stop) Connection Screw clamp terminals, 1 x 0.34 mm2 to 1 x 1.5 mm2 Type of push Flush, spring return Flush, push and latching References (10)* white NO XB7NA11 – NO + NC XB7NA15 – black NO XB7NA21 XB7NH21 NO + NC XB7NA25 XB7NH25 green NO XB7NA31 XB7NH31 NO + NC XB7NA35 XB7NH35 red NC XB7NA42 – NO + NC XB7NA45 – yellow NO XB7NA81 – Type of push Flush, spring return Projecting, spring return References green NO XB7NA3131 – red NC – XB7NL4232 white NO XB7NA11341 – black NO XB7NA21341 – NO + NC XB7NA25341 – Selector switches and key switches Type of operator Black handle Key, n° 455 Number and type of positions 2 positions 3 positions 2 positions 3 positions stay put stay put stay put stay put References (10*) NO XB7ND21 – XB7NG21 – NO + NC XB7ND25 – – – 2 NO – XB7ND33 – XB7NG33 Ø 40mm Emmergency Stop trigger action and mechanical latching pushbuttons (EN/ISO 13850, UL) (1) Type of push Turn to release Push, Pull Key release (n° 455) References* red NC XB7 NS8442 XB7 NT842 - red NO + NC XB7 NS8445 XB7 NT845 XB7 NS9445 red 2NC XB7 NS8444 XB7 NT844 XB7 NS9444 (1) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. Please consult your Customer Care Centre for a full explanation of these standards and directives. * Sold in lots of 10. Harmony XB7 Pushbuttons, switches and pilot lights Ø 22 with plastic bezel - Monolithic Contact functions 16 Illuminated pushbuttons Type of head Projecting push circular Degree of protection IP 65, class II, NEMA type 12 Mounting (mm) panel cut-out Ø 22.4 (0 +0.1) mounting centres 30 (horizontal) x 40 (vertical) Dimensions (mm) Ø x Depth (below head) Ø 29 x 41.5, (Ø 40 x 41.5 for Emergency stop) Connection Screw clamp terminals, 1 x 0.34 mm2 to 1 x 1.5 mm2 Light source Integral LED BA 9s base fitting Incandescent bulb direct supply (bulb not included) Type of push Spring return References (10)* green NO XB7NW33p1 (1) XB7NW3361 red NO XB7NW34p1 (1) XB7NW3461 NC XB7NW34p2 (1) _ orange NO XB7NW35p1 (1) – blue NO XB7NW36p1 (1) – clear NO XB7NW37p1 (1) – yellow NO XB7NW38p1 (1) XB7NW3561 Type of push Push and latching References (10)* green NO XB7NH03p1 (1) XB7NH0361 red NO XB7NH04p1 (1) XB7NH0461 NC XB7NH04p2 (1) – yellow NO XB7NH08p1 (1) XB7NH0861 Pilot lights (2) Light source Integral LED Ba 9s base fitting incandescent bulb Incandescent bulb direct supply direct through resistor (bulb not included) (bulb included) Supply voltage 24VAC/DC or 120VAC or 230…240VAC 6 or 24 V DC, or 130 V AC 230 V AC References (10)* clear XB7EV07pP (1) XB7EV67P XB7EV77P green XB7EV03pP (1) XB7EV63P XB7EV73P red XB7EV04pP (1) XB7EV64P XB7EV74P yellow XB7EV05pP (1) XB7EV65P XB7EV75P blue XB7EV06pP (1) XB7EV66P XB7EV76P orange XB7EV08pP (1) XB7EV68P XB7EV78P Incandescent bulbs, long life BA 9s base fitting, Ø 11 mm max., length 28 mm max. 6 V (1.2 W) 24 V (2 W) 130 V (2.4 W) References DL1CB006 DL1CE024 DL1CE130 (1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above. (2) Alternative connection: 1 x 6.35 and 2 x 2.8 mm Faston connectors. * sold in lots of 10 Contact functions and light functions (1): Supply voltage for integral LED light source only Letter (p) 24 V AC/DC B 120 V AC G 230 V AC M 17 Pushbuttons, spring return Type of push Flush Projecting Projecting (high guard) Colour of push Multi-colour (set of 7 clip-in coloured caps) Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals References CO 9001KR1UH13 9001KR3UH13 9001KR2UH13 NO 9001KR1UH5 9001KR3UH5 9001KR2UH5 Mushroom head pushbuttons, latching (1) Emergency switching off Emergency stop Type of push Push-pull Turn-to-Release, trigger action Ø 41 mushroom head Ø 35 mushroom head Ø 40 red mushroom head Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class III Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) 57,2 x 44,5 (without legend plate), 100 x 100 ((with legend plate 9001KN8330) (2) Depth below head (mm) 42 60 Connection Screw clamp terminals References – – – 9001KR16 CO 9001KR9R94H13 9001KR9R20H13 – NC 9001KR9RH6 9001KR9R20H6 – 2NO + 2NC – – 9001KR16H2 NO – – 9001KR16H13 (1) Mushroom head switching off mechanical latching pushbuttons conform to standard IEC 60364-5-53 and EN/IEC 60947-5-5. Mushroom head Emergency stop trigger action and mechanical latching pushbuttons conforming to standard EN/IEC 60204‑1 and EN/ISO 13850, to Machinery directive 2006/42/EC and standard EN/IEC 60947-5-5. Selector switches and key switches Type of operator Long black handle Key, n° 455 positions (2) 3 - spring return 2 - stay put 2 - spring return 3 - stay put 2 - stay put Number and type of positions Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals References NO – 9001KS11FBH5 9001KS34FBH5 – – CO 9001KS53FBH1 – – 9001KS43FBH1 9001KS11K1RH1 (2) The symbol indicates key withdrawal position. Harmony 9001K/SK Pushbuttons, switches and pilot lights Ø 30 with metal bezel Contact functions 18 (2) For yellow circular Emergency Stop legend plates: see page 9 Pilot lights Type of head Smooth lens cap Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals Type of light block With high luminosity LED (included) Incandescent BA 9s bulb (included) 24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC References green 9001KP35LGG9 9001KP36LGG9 9001KP38LGG9 9001KP7G9 red 9001KP35LRR9 9001KP36LRR9 9001KP38LRR9 9001KP7R9 yellow 9001KP35LYA9 9001KP36LYA9 9001KP38LYA9 9001KP7A9 Illuminated pushbuttons, spring return Type of head Spring return flush push Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals Type of light block With high luminosity LED (included) Incandescent BA 9s bulb (included) 24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC References green CO 9001K3L35LGGH13 9001K3L36LGGH13 9001K3L38LGGH13 9001K2L7RH13 red CO 9001K3L35LRRH13 9001K3L36LRRH13 9001K3L38LRRH13 9001K2L7GH13 yellow CO 9001K3L35LYAH13 9001K3L36LYAH13 9001K3L38LYAH13 9001K2L7AH13 Illuminated Ø 41 mushroom head pushbuttons, latching, high luminosity LED Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals Type of light block With high luminosity LED (included) Incandescent BA 9s bulb (included) 24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC/DC Type of head 2 position, push-pull References red CO 9001KR9P35RH13 9001KR9P36RH13 9001KR9P38RH13 9001KR9P7RH13 Type of head 3 position, push-pull (pull: spring return, centre: stay put, push: spring return) References red NC + NC late break 9001KR8P35RH25 9001KR8P36RH25 9001KR8P38RH25 9001KR8P7RH25 Light functions 19 Contact blocks with protected terminals Type of contact Single contact blocks Connection Screw clamp terminals References CO 9001KA1 NO 9001KA2 NC 9001KA3 CO, late break 9001KA4 NC, late break 9001KA5 NO, early make 9001KA6 Enclosures Type Number of Ø 30 mm cut-outs NEMA ratings Reference Aluminium 1 1, 3, 4, 6, 12, 13 9001KY1 2 1, 3, 4, 6, 12, 13 9001KY2 3 1, 3, 4, 6, 12, 13 9001KY3 4 1, 3, 4, 6, 12, 13 9001KY4 Stainless steel 1 1, 3, 4, 4X, 13 9001KYSS1 2 1, 3, 4, 4X, 13 9001KYSS2 3 1, 3, 4, 4X, 13 9001KYSS3 Legends 44 x 43 mm 57 x 57 mm Ø 60 Ø 90 Type Aluminium Plastic Plastic Colour of legend black background white background Yellow background Marking Blank 9001KN200 9001KN100WP 9001KN9100 9001KN8100 START 9001KN201 9001KN101WP – – STOP (red background) 9001KN202 9001KN102RP – – FORWARD 9001KN206 9001KN106WP – – REVERSE 9001KN207 9001KN107WP – – RESET 9001KN223 9001KN123WP – PULL TO START/ 9001KN379 9001KN179WP – – PUSH TO STOP EMERGENCY STOP – – 9001KN9330 9001KN8330 ARRET D’URGENCE – – 9001KN9330F 9001KN8330F PARADA DE EMERGENCIA – – 9001KN9330S 9001KN8330S Harmony 9001K/SK Pushbuttons, switches and pilot lights Ø 30 with metal bezel Accessories 20 Cam switches 12 and 20 A ratings Harmony K series positions (°) Cam switches, K1 / K2 series Function Switches ON-OFF switches Stepping switches 45° switching angle 90° switching angle with “0” position Degree of protection front face IP 65 (1) IP 65 (1) IP 65 (1) Conventional thermal current (Ith) 12 A 20 A 12 A 20 A 12 A 20 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V Number of positions 2 2 2 + “0” position Number of poles 2 2 2 Dimensions of front plate (mm) 45 x 45 45 x 45 45 x 45 Front mounting method Multifixing plate, 45 x 45 mm K1B002ALH K2B 002ALH K1B1002HLH K2B 1002HLH K1D012QLH K2D012QLH Plastic mounting plate for Ø 22 mm hole K1B002ACH K2B 002ACH K1B1002HCH K2B 1002HCH K1D012QCH K2D012QCH positions (°) Cam switches, K1 / K2 series Function Changeover switches Ammeter switches Voltmeter switches Degree of protection front face IP 65 (1) IP 65 (1) IP 65 (1) Conventional thermal current (Ith) 12 A 20 A 12 A 20 A 12 A 20 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V Number of positions 2 + “0” position 3 + “0” position 6 + “0” position (measurements (3 circuits + “0” position) between 3 phases & N + “0” pos.) Number of poles 2 4 7 Dimensions of front plate (mm) 45 x 45 45 x 45 45 x 45 Front mounting method Multifixing plate, 45 x 45 mm K1D002ULH K2D002ULH K1F003MLH to be compiled * K1F027MLH to be compiled * Plastic mounting plate for Ø 22 mm hole K1D002UCH K2D002UCH K1F003MCH to be compiled * K1F027MCH to be compiled * (1) With seal KZ73 for switch with Multifixing plate, with seal KZ65 for Ø 22 mm hole mounting switches. Seal to be ordered separately. (*) Please consult your Schneider Electric agency. positions (°) Cam switches with key operated lock, K1 series Function Stepping switches Run switches Changeover switches + “0” pos. Degree of protection front face IP 65 IP 65 IP 65 Conventional thermal current (Ith) 12 A 12 A 12 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V Number of positions 2 + “0” position 3 + “0” position 2 + “0” position Number of poles 3 2 2 Dimensions of front plate (mm) 55 x 100 55 x 100 55 x 100 Colour of handle red black red black red black Front mounting method Ø 22 mm hole + Ø 43.5 mm hole K1F022QZ2 K1F022QZ4 K1G043RZ2 K1G043RZ4 K1D002UZ2 K1D002UZ4 12 0 45 34 1-pole 2-pole 12 0 90 34 2-pole 90 1 0 45 2345678 135 180 225 2-pole 45 1 315 0 2345678 1-pole 2-pole 180 1 234 0 90 270 56789 10 11 12 0 1 234 270 315 5678 225 9 10 45 90 11 12 135 0 1 23456789 10 11 12 60 120 123456789 10 11 12 13 14 0 60 120 180 300 1 2345678 0 60 21 positions (°) Cam switches, K10 series Function Switches Changeover switches Ammeter Voltmeter 60° switching angle with “0” position switches switches Degree of protection front face IP 65 IP 65 IP 65 IP 65 Conventional thermal current (Ith) 10 A 10 A 10 A 10 A Rated insulation voltage (Ui) conforming to IEC60947-1 440 V 440 V 440 V 440 V Number of positions 2 2 + “0” position 3 + “0” pos. (1) 6 + “0” pos. (2) Number of poles 1 2 3 2 3 3 3 Dimensions of front plate (mm) 30 x 30 30 x 30 30 x 30 30 x 30 Front mounting method By Ø 16 mm or 22 mm hole K10A001ACH K10B002ACH K10C003ACH K10D002UCH K10F003UCH K10F003MCH K10F027MCH (1) (3 circuits + “0” position). (2) (Measurements between 3 phases and N + “0” position). positions (°) Cam switches, K30 series Function Switches Switches Changeover Starting Starting Reversing ON-OFF with “0” position star-delta 2-speed Degree of protection front face IP 40 IP 40 IP 40 IP 40 IP 40 IP 40 Conventional thermal current (Ith) 32 A 32 A 32 A 32 A 32 A 32 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V 690 V 690 V 690 V Number of positions 2 2 3 3 3 3 Number of poles 3 3 4 4 3 3 3 Dimensions of front plate (mm) 64 x 64 64 x 64 64 x 64 64 x 64 64 x 64 64 x 64 Front mounting method Multifixing K30C003AP(3) K30C003HP(3) K30D004HP(3) K30H004UP(3) K30H001YP(3) K30H004PP(3) K30E003WP(3) (3) To order switches with other thermal current ratings (50, 63, 115, 150 A): replace the number 30 in the reference by 50, 63, 115 or 150 respectively. Example: a switch with a 32 A current rating, for example K30C003AP, becomes K50 C003AP for a current rating of 50 A. Accessories for cam switches K1/K2 Rubber seals for IP 65 degree of protection For use with heads with 45 x 45 mm front plate with 60 x 60 mm front plate with 45 x 45 mm front plate Ø 22 mm hole or 4 hole front mtg. Ø 22 mm hole or 4 hole front mtg. multifixing References* KZ65 KZ66 KZ73 * Sold in lots of 5. Cam switches 10 to 150 A ratings Harmony K series 0 1 23456 60 1-pole 2-pole 3-pole 0 1 2 60 34 300 56789 10 11 12 1-pole 2-pole 3-pole 90 1 2 180 34 0 270 56789 10 11 12 300 1 2 330 34 270 0 30 60 90 56789 10 11 12 0 1 23456 60 1-pole 2-pole 3-pole 0 1 2345678 90 1-pole 2-pole 0 12 60 34 1234 300 56789 10 11 12 13 14 15 16 1-pole 2-pole 3-pole 4-pole 0 12 60 34 1234 300 56789 10 11 12 13 14 15 16 0 1260 34 1234 300 56789 10 11 12 13 14 15 16 0 12 60 34 1234 300 56789 10 11 12 22 Monolithic tower lights Ø 40, Ø 60, Ø 100 mm, complete, pre-wired tower lights Harmony XVC Ø 40 mm / Up to IP54 Complete, pre-wired tower lights Steady light Steady / Flashing light (1) Light source (included) LEDs LEDs Base mount Base mounting Support tube mounting, 17 mm Support tube mounting, 17 mm Buzzer Without buzzer With buzzer + flashing light Degree of protection up to IP54 up to IP54 Voltage 24V AC/DC 24V AC/DC 100-240V AC 24V AC/DC 100 - 240V AC References (2) Red XVC4B1K XVC4B1 XVC4M1 (4) XVC4B15S XVC4M15S (4) Red / orange XVC4B2K XVC4B2 XVC4M2 XVC4B25S XVC4M25S Red / Orange / green XVC4B3K XVC4B3 XVC4M3 XVC4B35S XVC4M35S red / orange / green / blue XVC4B4K XVC4B4 XVC4M4 XVC4B45S XVC4M45S red / orange / green / blue / Clear XVC4B5K XVC4B5 XVC4M5 XVC4B55S XVC4M55S Ø 60 mm / Up to IP54 Complete, pre-wired tower lights Steady light Steady / Flashing light (1) Light source (included) LEDs LEDs Base mount Base mounting Support tube mounting, 22 mm Support tube mounting, 22 mm Base mounting Buzzer Without buzzer With buzzer + flashing light Degree of protection up to IP54 up to IP54 Voltage 24V AC/DC 24V AC/DC 100-240 V AC (4) 24V AC/DC 100-240 V AC (4) References (2) Red XVC6B1K XVC6B1 XVC6M1 (3) XVC6B15S (3) XVC6M15S XVC6M15SK Red / orange XVC6B2K XVC6B2 XVC6M2 (3) XVC6B25S (3) XVC6M25S XVC6M25SK Red / Orange / green XVC6B3K XVC6B3 XVC6M3 (3) XVC6B35S (3) XVC6M35S XVC6M35SK red / orange / green / blue XVC6B4K XVC6B4 XVC6M4 (3) XVC6B45S (3) XVC6M45S XVC6M45SK red / orange / green / blue / Clear XVC6B5K XVC6B5 XVC6M5 (3) XVC6B55S (3) XVC6M55S XVC6M55SK Ø 100 mm / Up to IP54 Complete, pre-wired tower lights Steady / Flashing light (1) Light source (included) LEDs Base mount Base mounting Buzzer Without buzzer With buzzer + flashing light Degree of protection up to IP54 up to IP54 Voltage 24V DC (4) 100-240V AC (4) 24VDC (4) 100-240V AC (4) 24VDC (4) 100-240V AC (4) References (2) Red XVC1B1K XVC1M1K XVC1B1SK XVC1M1SK XVC1B1HK XVC1M1HK Red / orange XVC1B2K XVC1M2K XVC1B2SK XVC1M2SK XVC1B2HK XVC1M2HK Red / Orange / green XVC1B3K XVC1M3K XVC1B3SK XVC1M3SK XVC1B3HK XVC1M3HK red / orange / green / blue XVC1B4K XVC1M4K XVC1B4SK XVC1M4SK - - red / orange / green / blue / Clear XVC1B5K XVC1M5K XVC1B5SK XVC1M5SK - - (1) Flashing function can be simply selected/programmed by wiring (2) The colours are listed in the same order as the mounting order of the illuminated units (from top to bottom) (3) To order products for base mounting, add the letter K to the end of the reference (ex. XVC6M1K) (4) NPN only 23 Monolithic tower lights and accessories Ø 45 mm, complete illuminated beacons Harmony XVDLS / XVC Ø 45 mm / IP40 Illuminated beacons XVDLS Steady light Flashing light Light source Incandescent BA 15d bulb, 5 W max. (not included) “Flash” discharge tube, 0.5 J Degree of protection IP 40 References (1) 24…230 V AC/DC XVDLS3p – 24 V AC/DC – XVDLS6Bp 120 V AC – XVDLS6Gp 230 V AC – XVDLS6Mp (1) To obtain the complete reference, replace the p by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. Accessories XVDLS Incandescent bulbs, with BA 15d base Beacons XVDLS Description 24 V, 4 W 120 V, 5 W 230 V, 5 W References DL1BEBS DL1BEGS DL1BEMS XVC4 / XVC6 Mounting accessories Tower lights Ø 40 mm, XVC4 Tower lights Ø 60 mm, XVC6 Description Support tube mounting Support tube mounting Base mounting Support tube mounting Diameter (mm) Ø 90 Ø 84 – Ø 100 Ø 84 – For use with – – – XVC6ppand XVC6pp5S XVC6ppK and XVC6pp5SK XVC6Bpand XVC6Bpp5S, XVC6Mpand XVC6Mp5S Height to be added (mm) 32 24,5 82 30 21,6 82 References Metal fixing plate XVCZ11 – – XVCZ02 XVCZ12 – Plastic fixing plate – XVCZ01 – – – – Wall mounting bracket – – XVCZ31 – – XVCZ32 XVC1 Mounting accessories Tower lights Ø 100 mm, XVC1 Description Vertical support Diameter (mm) Ø 140 Ø 140 – – For use with XVC1ppK and XVC1ppSK XVC1ppHK (with siren) XVC1ppK and XVC1ppSK XVC1ppHK (with siren) Height to be added (mm) 300 306 – – References Metal fixing plate (2) XVCZ13 XVCZ14 – – Metal fixing bracket – – XVCZ23 XVCZ24 (2) Chromium plated-steel extension tube 24 Modular tower lights Ø 70 mm, for customer assembly Harmony XVB Ø 70 mm / Up to IP66 Illuminated beacons XVBL Steady light Flashing light Light source Incandescent BA 15d bulb, Protected BA 15d LED Protected BA 15d LED “Flash” discharge tube 10 W max. (not included) (included) (included) 5 J (2) Degree of protection IP 66 References (1) 12…250 V AC/DC XVBL3p – – – 24 V AC/DC – XVBL0Bp XVBL1Bp XVBL6Bp 120 V AC – XVBL0Gp XVBL1Gp XVBL6Gp 230 V AC – XVBL0Mp XVBL1Mp XVBL6Mp Ø 70 mm / Up to IP66 Tower lights XVBC comprising 2 to 5 signalling units (3) Base units Steady light Flashing light “Flash” light Audible units (90 db at 1 m) Light source – Incandescent Integral Integral “Flash” – BA 15d bulb, 10 W protected LED protected LED discharge tube max. (not included) 5 J (2) Degree of protection IP 66 Base unit references with cover XVBC21 (4) – – – – – without cover XVBC07 (5) – – – – – References (2) 12… 230 V AC/DC – XVBC3p – – – – 24 V AC/DC – – XVBC2Bp XVBC5Bp XVBC6Bp – 120 V AC – – XVBC2Gp XVBC5Gp XVBC6Gp – 230 V AC – – XVBC2Mp XVBC5Mp XVBC6Mp – Audible unit references 12…48 V AC/DC – – – – – XVBC9B unidirectional 120…230 V AC – – – – – XVBC9M (1) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. (2) To order a lens unit with a 10 J discharge tube, replace the number 6 by 8 in the reference (example: XVBL6Bp becomes XVBL8Bp). (3) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum. (4) For connection on AS-Interface, order base unit XVBC21A (side cable entry) or XVBC21B (bottom cable entry with M12 connector on flying lead). (5) For indicator banks with “flash” discharge tube unit. 25 Modular tower lights Ø 70 mm, for customer assembly Harmony XVE Ø 70 mm / Up to IP54 Illuminated beacons XVEL Steady light Flashing light Light source Incandescent Integral “Flash” discharge tube, 1 J BA 15d bulb, 5 W max. LED (not included) Degree of protection IP 42/IP 54 (with sealing kit) References (1) 24… 240 V AC/DC XVEL3p – 24 V AC/DC – XVEL2Bp XVEL6Bp 120 V AC – XVEL2Gp XVEL6Gp 230 V AC – XVEL2Mp XVEL6Mp Ø 70 mm / Up to IP54 Indicator banks XVEC comprising 2 to 5 signalling units (2) Base units Steady light Flashing light “Flash” light Audible units (85 db at 1 m) Light source – Incandescent Integral Integral “Flash” – BA 15d bulb, 5 W LED LED discharge tube max. (not included) 1 J Degree of protection IP 42/IP 54 (with sealing kit) Base unit references IP 42 XVEC21 – – – – – IP 54 XVEC21P – – – – – Lens unit references (1) 24…230 V AC/DC – XVEC3p – 24 V AC/DC – – XVEC2Bp XVEC5Bp XVEC6Bp XVEC9B 120 V AC – – XVEC2Gp XVEC5Gp XVEC6Gp XVEC9G 230 V AC – – XVEC2Mp XVEC5Mp XVEC6Mp XVEC9M (1) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. (2) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum. 26 Modular tower lights Ø 45, Ø 50 mm, complete or for customer assembly Harmony XVM / XVP Ø 45 mm / IP42 Complete, pre-wired tower light XVM (1) 2 sig. units + integral buzzer (2) Steady light 3 signalling units + integral buzzer (2) Steady light Steady light + “flash” (3) Light source (included) Incandescent BA 15d Incandescent BA 15d Incandescent BA 15d BA 15d bulb, 5 W “Super bright” LED BA 15d bulb, 5 W “Super bright” LED BA 15d bulb, 5 W “Super bright” max. max. max. LED Degree of protection IP 54 Signalling colours Red - Green Red - Orange - Green References 24 V AC/DC XVMB1RGS XVMB2RGSSB XVMB1RAGS XVMB2RAGSSB XVMB1R6AGS XVMB2R6AGSSB 120 V AC/DC (bulb) - 120 V AC (LED) XVMG1RGS XVMG2RGSSB XVMG1RAGS XVMG2RAGSSB XVMG1R6AGS XVMG2R6AGSSB 230 V AC/DC (bulb) - 230 V AC (LED) XVMM1RGS XVMM2RGSSB XVMM1RAGS XVMM2RAGSSB XVMM1RA6GS XVMM2R6AGSSB (1) Tower lights XVM are also available as separate components for customised assembly by the user: please refer to www.schneider-electric.com. (2) To order products without an integral buzzer, delete the letter S at the end of the reference (example: XVMB2RGS becomes XVMB2RG, XVMB2RGSSB becomes XVMB2RGSB). (3) Flash signalling colour: red - 0.8 J. Ø 50 mm / IP65 Tower lights XVP comprising 2 to 5 signalling units (4), black clamping ring (5) Base unit Steady or flashing light signalling “Flash” light signalling Audible units (55…85 dB at 1 m) Light source – Incandescent “Flash” “Flash” – BA 15d bulb, 7 W discharge tube discharge tube max. (not included) 0.3 J 0.6 J Degree of protection IP 65 Base unit with cover XVPC21 – – – – References (6) 250 V max. – XVPC3p – – – 24 V AC/DC (flash) - 24 V DC (buzzer) – – XVPC6Bp – XVPC09B 120 V AC – – – XVPC6Gp XVPC09G 230 V AC – – – XVPC6Mp XVPC09M (4) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum. (5) To order products with a cream clamping ring, add the letter W to the end of the reference (example: base unit + green lens unit: XVPC21W + XVPC33W etc.). (6) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. 27 Bulbs Beacons and tower lights XVB / XVP (1) Type of light source Incandescent Incandescent LED (2) Flashing BA 15d base BA 15d base BA 15d base LED (2) 7 W 10 W (not XVP) BA 15d base References 12 V DL1BEJ DL1BLJ – – 24 V DL1BEB DL1BLB DL1BDBp DL1BKBp 48 V DL1BEE DL1BLE – – 120 V DL1BEG DL1BLG DL1BDGp DL1BKGp 230 V DL1BEM DL1BLM DL1BDMp DL1BKMp (1) Tower lights XVP can be fitted with 5 W incandescent bulbs: see beacons XVDLS / XVE. (2) To obtain the complete reference, replace the p by the number designating the colour as follow: 1 = white, 3 = green , 4 = red , 5 = orange, 6 = blue, 8 = yellow. Bulbs Tower lights XVM Type of light source Incandescent LED (3) Flashing “Flash” discharge BA 15d base BA 15d base LED (3) tube, 0.8 Joule 5 W BA 15d base BA 15d base References 24 V DL1EDBS DL2EDBpSB DL1EKBpSB DL6BB 120 V DL1EDGS DL2EDGpSB DL1EKGpSB DL6BG 230 V DL1EDMS DL2EDMpSB DL1EKMpSB DL6BM (3) To obtain the complete reference, replace the p by the number designating the colour as follows: 1 = white, 3 = green , 4 = red , 6 = blue, 8 = orange. Mounting accessories Beacons and tower lights XVB / XVE Tower lights Tower lights XVP XVM Description Aluminium tube Plastic tube Aluminium tube Aluminium tube Aluminium tube Aluminium tube with integral black with integral black with integral black with steel fixing with integral cream with steel fixing plastic fixing base plastic fixing base plastic fixing base bracket plastic fixing base bracket Diameter (mm) Ø 25 Ø 25 Ø 20 Ø 20 Ø 20 Ø 20 Support tubes 60 mm XVEZ13 – – – – – 100 mm – – – XVPC02T XVMZ02 XVMZ02T 112 mm – – XVPC02 (4) – – – 120 mm XVBZ02 – – – – – 140 mm – XVDC02 – – – – 250 mm – – – XVPC03T XVMZ03 XVMZ03T 260 mm – – XVPC03 (4) – – – 400 mm – – – XVPC04T XVMZ04 XVMZ04T 410 mm – – XVPC04 (4) – – – 420 mm XVBZ03 – – – – – 820 mm XVBZ04 – – – – – Fixing plates, for vertical support XVBC12 XVPC12 (4) – for horizontal support XVBZ01 – XVMZ06 (4) To order an aluminium support tube with integral cream fixing base, add the letter W to the end of the reference (example: XVPC02W). Modular tower lights accessories For XVB, XVP, XVE, XVM Harmony XV 28 Rotating beacons Ø 84, 106, 120, 130 mm rotating beacons Harmony XVR Ø 84 / 106 mm Complete, pre-wired rotating beacons Ø 84 mm Ø 106 mm Light source (included) “ Super bright “ LEDs Base mount 3 x Ø 05 Buzzer Without buzzer Degree of protection IP23 (IP 65 with accessories) IP23 (IP 55 with accessories) Voltage 12V AC/DC 24V AC/DC 12V AC/DC 24V AC/DC References Red XVR08J04 XVR08B04 XVR10J04 XVR10B04 Orange XVR08J05 XVR08B05 XVR10J05 XVR10B05 Green XVR08J03 XVR08B03 XVR10J03 XVR10B03 Blue XVR08J06 XVR08B06 XVR10J06 XVR10B06 Ø 120 mm Complete, pre-wired rotating beacons Ø 120 mm Light source (included) “ Super bright “ LEDs Base mount 3 x M5 Buzzer Without buzzer With buzzer Degree of protection IP23 Voltage 12V AC/DC 24V AC/DC 12V AC/DC 24V AC/DC References Red XVR12J04 XVR12B04 XVR12J04S XVR12B04S Orange XVR12J05 XVR12B05 XVR12J05S XVR12B05S Green XVR12J03 XVR12B03 XVR12J03S XVR12B03S Blue XVR12J06 XVR12B06 XVR12J06S XVR12B06S Ø 130 mm Complete, pre-wired rotating beacons Ø 130 mm Light source (included) “ Super bright “ LEDs Base mount 3 x Ø 09 Buzzer Without buzzer Degree of protection IP66 - Resistant to vibration IP66 and IP67 Voltage 12V DC 24V DC 24V AC/DC 120V AC 230V AC References Red XVR13J04 XVR13B04 XVR13B04L XVR13G04L XVR13M04L Orange XVR13J05 XVR13B05 XVR13B05L XVR13G05L XVR13M05L 29 Accesories for rotating mirrors Reflecting prism Rubber base Metal angle bracket Metal fixing plate To be used for/with – Increasing the IP degree Horizontal support Horizontal support Height (mm) – – – 300 References Ø 84 mm XVRZR1 XVRZ081 XVCZ23 – Ø 106 mm XVRZR2 XVRZ082 XVCZ23 XVCZ13 Ø 120 mm XVRZR3 – XVCZ23 XVCZ13 Ø 130 mm XVRZR3 – XVR012L – Electronic alarms and multisound sirens Sirens and electronic alarms Sirens Multisound sirens pre-wired Electronic alarms Panel Mount DIN72 Electronic alarms Panel Mount DIN96 Sound level 106 dB 105 dB 90 dB 96 dB Tones 2 43 16 16 Channels – 8 4 4 Degree of protection IP 53 IP53 IP 54 IP 54 Colors White White Black White Black White References 12/24V AC/DC XVS10BMW – XVS72BMBp (1) XVS72BMWp (1) XVS96BMBp (1) XVS96BMWp (1) 12/24V DC – XVS14BMW – – – – 120V AC XVS10GMW XVS14GMW – – – – 230V AC XVS10MMW XVS14MMW – – – – (1) To obtain a complete reference, replace the p by the letter as follow: P = PNP, N = NPN (ex. XVS72BMBP) Rotating beacons accessories and sound solutions Accessories for rotating beacons Harmony XVR / XVS 30 Type XACA “Pistol grip” Degree of protection IP 65 / Nema 4, 4X / Class II Rated operational characteristics AC 15 (240 V 3 A), DC 13 Conventional thermal current Ithe 10 A Connection Screw clamp terminals, 1 x 2.5 mm2 or 2 x 1.5 mm2 For control of single-speed motors 2-speed motors Dimensions (mm) W x H x D 52 x 295 x 71 (x 85 with ZA2BS834) 52 x 295 x 71 (x 85 with ZA2BS834) Number of operators mechanically interlocked 2 2 Emergency stop without ZA2BS834 without ZA2BS834 References XACA201 XACA2014 XACA207 XACA2074 Type XACA For control of single-speed motors Dimensions (mm) W x H x D 80 x 314 x 70 (x 90 with ZA2BS834) 80 x 440 x 70 (x 90 with ZA2BS844) Number of operators mechanically interlocked between pairs 2 4 Emergency stop without ZA2BS834 without ZA2BS844 References XACA271 XACA2714 XACA471 XACA4714 For control of single-speed motors + I / O Dimensions (mm) W x H x D 80 x 500 x 70 (x 90 with ZA2BS844) 80 x 560 x 70 Number of operators mechanically interlocked between pairs 6 8 Emergency stop without ZA2BS844 without References XACA671 XACA6714 XACA871 Empty enclosures type XACA Number of ways 2 3 4 5 6 8 12 References XACA02 XACA03 XACA04 XACA05 XACA06 XACA08 XACA12 Pendant control stations for control circuits Ready to use Harmony XAC 31 (1) Trigger action mechanically latching Emergency stop pushbuttons conform to standards EN/IEC 60204-32, EN/ISO 13850, Machinery directive 2006/42/EC and standard EN/IEC 60947-5-5. Legends, 30 x 40 mm With symbols conforming to NF E 52-124 With text References ZB2BY4901 ZB2BY4903 ZB2BY4907 ZB2BY4909 ZB2BY4913 ZB2BY4915 ZB2BY4930 ZB2BY2303 ZB2BY2304 References ZB2BY2904 ZB2BY2906 ZB2BY2910 ZB2BY2912 ZB2BY2916 ZB2BY2918 ZB2BY2931 ZB2BY1W140 blank white or yellow background Separate components (for mounting in enclosures XACA) Booted operators white XACA9411 black XACA9412 Mushroom head, latching, trigger action (1) turn to release Ø 40 ZA2BS844 Ø 30 ZA2BS834 Mushroom head, latching, trigger action (1) key release Ø 40 ZA2BS944 Ø 30 ZA2BS934 Selector switch 2 pos. stay put ZA2BD2 3 pos. stay put ZA2BD3 Key switch key n° 455 2 pos. stay put ZA2BG4 3 pos. stay put ZA2BG5 Blanking plug with seal and ZB2SZ3 fixing nut Pilot light heads white ZA2BV01 green ZA2BV03 red ZA2BV04 yellow ZA2BV05 Pilot light bodies direct supply ZB2BV006 direct supply, through resistor ZB2BV007 Protective guard (for base mounted units) For selector switch XACA982/983 For emergency stop pushbutton XACA984 Contact blocks Single-speed NO ZB2BE101 Single-speed NC ZB2BE102 Contacts blocks for XACA941p Single-speed NC+NO XENG1491 2-speed NC+NO+NO XENG1191 Contact blocks (for mounting in enclosure base) NO XACS101 NC+NO XACS105 Isolating switch, slow break, for front mounting Emergency stop NC+NC+NC with positive opening operation XENT1192 Double blocks latching, slow break Single-speed NO+NO XENG3781 Single-speed NO+NC XENG3791 32 Notes 33 ART. 097419 01/2013 - V10.0 DIA4ED2040408EN Head Office 35, rue Joseph Monier - CS 30323 F92500 Rueil-Malmaison Cedex France www.schneider-electric.com The information provided in this documentation contains general descriptions and/or technical characteristics of the performance of the products contained herein. This documentation is not intended as a substitute for and is not to be used for determining suitability or reliability of these products for specific user applications. It is the duty of any such user or integrator to perform the appropriate and complete risk analysis, evaluation and testing of the products with respect to the relevant specific application or use thereof. Neither Schneider Electric nor any of its affiliates or subsidiaries shall be responsible or liable for misuse of the information contained herein. Design : IGS-CP Photos : Schneider Electric Print : http://www.farnell.com/datasheets/1761538.pdf This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 39-01-2020 Status: Active Overview: Mini-Fit Jr.™ Power Connectors Description: Mini-Fit Jr.™ Receptacle Housing, Dual Row, UL 94V-2, 2 Circuits Documents: 3D Model Product Specification PS-5556-001 (PDF) Drawing (PDF) Test Summary TS-5556-002 (PDF) Product Specification PS-45750-001 (PDF) RoHS Certificate of Compliance (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family Crimp Housings Series 5557 Application Power, Wire-to-Wire Comments Current = 13A max. per circuit when header is mated to a receptacle loaded with 45750 series terminals crimped to 16 AWG wire. . See Molex product specification PS-45750-001 for additional current derating information.. Glow Wire Equivalent Part. MolexKits Yes Overview Mini-Fit Jr.™ Power Connectors Product Name Mini-Fit Jr.™ UPC 800753584259 Physical Breakaway No Circuits (maximum) 2 Color - Resin Natural Flammability 94V-2 Gender Female Glow-Wire Compliant No Material - Resin Nylon Net Weight 0.657/g Number of Rows 2 Packaging Type Bag Panel Mount No Pitch - Mating Interface 4.20mm Pitch - Termination Interface 4.20mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -40°C to +105°C Electrical Current - Maximum per Contact 13A Material Info Old Part Number 5557-02R Reference - Drawing Numbers Product Specification PS-45750-001, PS-5556-001, RPS-5557-046 Sales Drawing SD-5557-003 Test Summary TS-5556-002 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 5557Series Mates With 5559 Dual Row, 5566 Vertical with Pegs, 5566 Vertical without Pegs, 5569 Right Angle Dual Row with Flanges, 5569 Right Angle Dual Row with Pegs, 43810 , 44068 , 44281 , 87427 , 42404 , 42440 Use With 5556 Mini-Fit® Female Crimp Terminals, 45750 Mini-Fit® Plus HCS Crimp TerminalThis document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 10/10/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 87439-0400 Status: Active Overview: Pico-Spox™ Wire-to-Board Connector System Description: 1.50mm Pitch Pico-SPOX™ Wire-to-Board Housing, 4 Circuits, Off-White Housing Documents: 3D Model RoHS Certificate of Compliance (PDF) Drawing (PDF) Product Literature (PDF) Product Specification PS-87437 (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family Crimp Housings Series 87439 Application Signal, Wire-to-Board MolexKits Yes Overview Pico-Spox™ Wire-to-Board Connector System Product Literature Order No USA-235 Product Name Pico-SPOX™ UPC 800753537224 Physical Circuits (maximum) 4 Color - Resin Natural Flammability 94V-0 Gender Female Glow-Wire Compliant No Lock to Mating Part Yes Material - Resin Nylon Net Weight 55.000/mg Number of Rows 1 Packaging Type Bag Panel Mount No Pitch - Mating Interface 1.50mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -55°C to +105°C Electrical Current - Maximum per Contact 2.5A Material Info Reference - Drawing Numbers Product Specification PS-87437, RPS-87437, RPS-87437-001, RPS-87437-200, RPS-87438-002 Sales Drawing SD-87439-**00 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 87439Series Mates With Pico-SPOX™ Wire-to-Board Header 87437 , 87438 Use With 87421 Pico-SPOX™ Crimp Terminal This document was generated on 10/10/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION PMBFJ620 Dual N-channel field-effect transistor Rev. 2 — 15 September 2011 Product data sheet CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per FET VDS drain-source voltage - - 25 V VGSoff gate-source cut-off voltage VDS = 10 V; ID = 1 A 2 - 6.5 V IDSS drain current VGS = 0 V; VDS = 10 V 24 - 60 mA Ptot total power dissipation Ts  90 C - - 190 mW yfs forward transfer admittance VDS = 10 V; ID = 10mA 10 - - mS PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 2 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 2. Pinning information 3. Ordering information 4. Marking [1] * = p: made in Hong Kong. * = t: made in Malaysia. * = W: made in China. Table 2. Discrete pinning information Pin Description Simplified outline Symbol 1 source (1) 2 source (2) 3 gate (2) 4 drain (2) 5 drain (1) 6 gate (1) 1 2 3 6 5 4 sym034 6 3 2 4 1 5 Table 3. Ordering information Type number Package Name Description Version PMBFJ620 - plastic surface mounted package; 6 leads SOT363 Table 4. Marking Type number Marking code[1] PMBFJ620 A8* PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 3 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 5. Limiting values 6. Thermal characteristics [1] Ts is the temperature at the soldering point of the gate pins, see Figure 1. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per FET VDS drain-source voltage - 25 V VGSO gate-source voltage open drain - 25 V VGDO drain-gate voltage open source - 25 V IG forward gate current (DC) - 50 mA Ptot total power dissipation Ts  90 C - 190 mW Tstg storage temperature 65 +150 C Tj junction temperature - 150 C Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-s) thermal resistance from junction to soldering points single loaded [1] 315 K/W double loaded [1] 160 K/W (1) Double loaded. (2) Single loaded. Fig 1. Power derating curve. Ts (°C) 0 50 100 150 200 001aaa742 200 100 300 400 Ptot (mW) 0 (1) (2) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 4 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 7. Static characteristics 8. Dynamic characteristics Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per FET V(BR)GSS gate-source breakdown voltage IG = 1 A; VDS = 0 V 25 - - V VGSoff gate-source cut-off voltage ID = 1 A; VDS = 10 V 2 - 6.5 V VGSS gate-source forward voltage IG = 1 mA; VDS = 0 V - - 1 V IDSS drain-source leakage current VDS = 10 V; VGS = 0 V 24 - 60 mA IGSS gate-source leakage current VGS = 15 V; VDS = 0 V - - 1 nA RDSon drain-source on-state resistance VGS = 0 V; VDS = 100mV - 50 -  yfs common source forward transfer admittance ID = 10 mA; VDS = 10 V 10 - - mS yos common source output admittance ID = 10 mA; VDS = 10 V - - 250 S Table 8. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per FET Ciss input capacitance VDS = 10 V; VGS = 10 V; f =1 MHz - 3 5 pF VDS = 10 V; VGS = 0 V; Tamb = 25 C - 6 - pF Crss reverse transfer capacitance VDS = 0 V; VGS = 10 V; f = 1 MHz - 1.3 2.5 pF gis common source input conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 200 - S VDS = 10 V; ID = 10 mA; f = 450 MHz - 3 - mS gfs common source transfer conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 13 - mS VDS = 10 V; ID = 10 mA; f = 450 MHz - 12 - mS grs common source reverse conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 30 - S VDS = 10 V; ID = 10 mA; f = 450 MHz - 450 - S gos common source output conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 150 - S VDS = 10 V; ID = 10 mA; f = 450 MHz - 400 - S Vn equivalent input noise voltage VDS = 10 V; ID = 10 mA; f = 100 Hz - 6 - nV/Hz PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 5 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor VDS = 10 V; Tj = 25 C. VDS = 10 V; ID = 10 mA; Tj = 25 C. Fig 2. Drain current as a function of gate-source cut-off voltage; typical values. Fig 3. Common source forward transfer admittance as a function of gate-source cut-off voltage; typical values. VDS = 10 V; ID = 10 mA; Tj = 25 C. VDS = 100 mV; VGS = 0 V; Tj = 25 C. Fig 4. Common-source output conductance as a function of gate-source cut-off voltage; typical values. Fig 5. Drain-source on-state resistance as a function of gate-source cut-off voltage; typical values. VGSoff (V) 0 −1 −2 −3 −4 mcd220 20 30 10 40 50 IDSS (mA) 0 0 −2 −4 −8 mcd219 −6 20 0 16 12 8 yfs (mS) 4 VGSoff (V) 0 150 100 50 0 −1 −2 −4 mcd221 −3 gos (μS) VGSoff (V) 0 −1 −2 −4 80 60 20 0 40 mcd222 −3 RDSon (Ω) VGSoff (V) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 6 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor Tj = 25 C. VDS = 10 V; Tj = 25 C. Fig 6. Typical output characteristics. Fig 7. Typical transfer characteristics. VDS = 10 V; Tj = 25 C. VDS = 10 V; Tj = 25 C. Fig 8. Reverse transfer capacitance as a function of gate-source voltage; typical values. Fig 9. Input capacitance as a function of gate-source voltage; typical values. VDS (V) 0 4 8 12 16 mcd217 20 10 30 40 ID (mA) 0 (2) (4) (1) (5) (6) (3) −4 −3 −2 0 40 30 10 0 20 mcd214 −1 ID (mA) VGS (V) −10 −4 0 4 3 1 0 2 mcd224 −8 −6 −2 Crs (pF) VGS (V) −10 0 10 0 mcd223 −8 −6 −4 −2 8 6 4 2 Cis (pF) VGS (V) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 7 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor VDS = 10 V; Tj = 25 C. Fig 10. Drain current as a function of gate-source voltage; typical values. Tj = 25 C. Fig 11. Gate current as a function of drain-gate voltage; typical values. mcd229 1 10−2 10−1 102 10 103 ID (μA) 10−3 VGS (V) −2.5 −2.0 −1.5 −1.0 −0.5 0 mcd230 −10 −1 −103 −102 −104 IGSS (pA) −10−1 VDG (V) 0 4 8 12 16 (1) (2) (3) (4) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 8 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor Fig 12. Gate current as a function of junction temperature; typical values. mcd231 10 1 103 102 104 IGSS (pA) 10−1 Tj (°C) −25 25 75 125 175 PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 9 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor VDS = 10 V; ID = 10 mA; Tamb = 25 C. VDS = 10 V; ID = 10 mA; Tamb = 25 C. Fig 13. Input admittance as a function of frequency; typical values. Fig 14. Forward transfer admittance as a function of frequency; typical values. VDS = 10 V; ID = 10 mA; Tamb = 25 C. VDS = 10 V; ID = 10 mA; Tamb = 25 C. Fig 15. Reverse transfer admittance as a function of frequency; typical values. Fig 16. Output admittance as a function of frequency; typical values. mcd228 10 1 gis, bis (mS) 10−1 102 f (MHz) 10 102 103 bis gis f (MHz) 10 102 103 mcd227 10 102 gfs,−bfs (mS) 1 gfs −bfs mcd226 f (MHz) 10 102 103 −10−1 −1 −10 −102 brs, grs (mS) −10−2 brs grs mcd225 10 1 bos, gos (mS) 10−1 102 f (MHz) 10 102 103 bos gos PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 10 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 9. Package outline Fig 17. Package outline. OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT363 SC-88 bp w M B D e1 e pin 1 index A A1 Lp Q detail X HE E v M A B A y 0 1 2 mm scale c X 1 2 3 6 5 4 Plastic surface-mounted package; 6 leads SOT363 UNIT A1 max bp c D E e1 HE Lp Q v w y mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.2 0.1 DIMENSIONS (mm are the original dimensions) 0.45 0.15 0.25 0.15 A 1.1 0.8 04-11-08 06-03-16 PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 11 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBFJ620 v.2 20110915 Product data sheet - PMBFJ620 v.1 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package outline drawings have been updated to the latest version. PMBFJ620 v.1 (9397 750 13006) 20040511 Product data sheet - - PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 12 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 11. Legal information 11.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 13 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 September 2011 Document identifier: PMBFJ620 Advanced Materials Araldite® 2014-1 Structural Adhesives TECHNICAL DATA SHEET Araldite® 2014-1 Two component epoxy paste adhesive Key properties Grey paste High temperature and chemical resistance Low shrinkage Very resistant to water and a variety of chemicals Gap filling, non sagging up to 5mm thickness Description Araldite 2014-1 is a two component, room temperature curing, thixotropic paste adhesive of high strength with good environmental and excellent chemical resistance. Used for bonding of metals, electronic components, GRP structures and many other items where a higher than normal temperature or more aggressive environment is to be encountered in service. The low out gassing makes this product suitable for specialist electronic telecommunication and aerospace applications. Product data Property 2014-1/A 2014-1/B 2014-1 (mixed) Colour (visual) beige paste grey paste grey paste Specific gravity ca. 1.6 ca. 1.6 ca. 1.6 Viscosity at 25°C (Pas) ca. 100 thixotropic thixotropic Pot Life (100 gm at 25 C) - - 60 minutes Shelf life (2-40 C) 3 years 3 years - Processing Pretreatment The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. Low grade alcohol, gasoline (petrol) or paint thinners should never be used. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching ( pickling ) the degreased surfaces. Abrading should be followed by a second degreasing treatment. Mix ratio Parts by weight Parts by volume Araldite 2014-1/A 100 100 Araldite 2014-1/B 50 50 Araldite 2014-1 is available in cartridges incorporating mixers and can be applied as ready to use adhesive with the aid of the tool recommended by Huntsman Advanced Materials. April 2007 Araldite® 2014-1 2/6 Application of adhesive The resin/hardener mix may be applied manually or robotically to the pretreated and dry joint surfaces. Huntsman's technical support group can assist the user in the selection of an suitable application method as well as suggest a variety of reputable companies that manufacture and service adhesive dispensing equipment. A layer of adhesive 0.05 to 0.10 mm thick will normally impart the greatest lap shear strength to the joint. Huntsman stresses that proper adhesive joint design is also critical for a durable bond. The joint components should be assembled and secured in a fixed position as soon as the adhesive has been applied. For more detailed explanations regarding surface preparation and pretreatment, adhesive joint design, and the dual syringe dispensing system, visit www.araldite2000plus.com. Equipment maintenance All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Times to minimum shear strength Temperature C 10 15 23 40 60 100 Cure time to reach hours 14 8 3 - - - LSS > 1MPa minutes - - - 60 15 3 Cure time to reach hours 20 11 5 - - - LSS > 10MPa minutes - - - 80 20 4 LSS = Lap shear strength. Typical cured properties Unless otherwise stated, the figures given below were all determined by testing standard specimens made by lapjointing 114 x 25 x 1.6 mm strips of aluminium alloy. The joint area was 12.5 x 25 mm in each case. The figures were determined with typical production batches using standard testing methods. They are provided solely as technical information and do not constitute a product specification. Average lap shear strengths of typical metal-to-metal joints (ISO 4587) Cured for 16 hours at 40°C and tested at 23 C Pretreatment - Sand blasting 0 5 10 15 20 25 Aluminium Steel 37/11 Stainless steel V4A Galvanised steel Copper Brass MPa April 2007 Araldite® 2014-1 3/6 Average lap shear strengths of typical plastic-to-plastic joints (ISO 4587) Cured for 16 hours at 40 C and tested at 23 C. Pretreatment - Lightly abrade and alcohol degrease. 0 2 4 6 8 10 12 14 GRP CFRP SMC ABS PVC PMMA Polycarbonate Polyamides MPa Lap shear strength versus temperature (ISO 4587) (typical average values) Cure: (a) = 7 days /23 C; (b) = 24 hours/23 C + 30 minutes/80 C 0 5 10 15 20 25 30 °C -40 -20 0 20 40 60 80 100 120 140 MPa a b Roller peel test (ISO 4578) Cured: 16 hours/40 C 3.0 N/mm Glass transition temperature (DSC) Cure: 24 hours at 23 C plus 1 hour at 80 C: ca. 85 C Shear modulus (DIN 53445) Cure: 16 hours/40 C 50 C - 1.2 GPa 75 C - 400 MPa 100 C - 180 Mpa 125 C - 20 Mpa E - modulus (ISO R527) at 23 C 4 GPa April 2007 Araldite® 2014-1 4/6 Flexural Properties (ISO 178) Cure 16 hours/ 40ºC Cure 1 day/ 23°C +30mins/ 80°C tested at 23°C Flexural Strength 61 MPa Flexural Modulus 4355 MPa Tensile strength (ISO R527) at 23 C 26 MPa Elongation at break 0,7% Lap shear strength versus immersion in various media (typical average values) Unless otherwise stated, L.S.S. was determined after immersion for 90 days at 23 C 0 5 10 15 20 25 30 As-made value IMS Gasoline (petrol) Ethyl acetate Acetic acid, 10% Xylene Lubricating oil Paraffin Water at 23°C Water at 60°C Water at 90°C 30 days 60 days 90 days MPa Cure: 16 hour/40°C Lap shear strength versus tropical weathering (40/92, DIN 50015; typical average values) Cure: 16 hours/40C Test: at 23 C 0 5 10 15 20 25 As made value After 30 days After 60 days After 90 days MPa April 2007 Araldite® 2014-1 5/6 Lap shear strength versus heat ageing Cure: 16 hours/40 C 0 5 10 15 20 25 As-made value 30 days/ 70°C 60 days/ 70°C 90 days/ 70°C MPa April 2007 Araldite® 2014-1 6/6 Huntsman Advanced Materials All recommendations for the use of our products, whether given by us in writing, verbally, or to be implied from the results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will not infringe any third party s intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply. Storage Araldite 2014-1A and Araldite 2014-1/B may be stored for up to 3 years at room temperature provided the components are stored in sealed containers. The expiry date is indicated on the label. Handling precautions Caution Our products are generally quite harmless to handle provided that certain precautions normally taken when handling chemicals are observed. The uncured materials must not, for instance, be allowed to come into contact with foodstuffs or food utensils, and measures should be taken to prevent the uncured materials from coming in contact with the skin, since people with particularly sensitive skin may be affected. The wearing of impervious rubber or plastic gloves will normally be necessary; likewise the use of eye protection. The skin should be thoroughly cleansed at the end of each working period by washing with soap and warm water. The use of solvents is to be avoided. Disposable paper - not cloth towels - should be used to dry the skin. Adequate ventilation of the working area is recommended. These precautions are described in greater detail in the Material Safety Data sheets for the individual products and should be referred to for fuller information. Huntsman Advanced Materials (Switzerland) GmbH Klybeckstrasse 200 4057 Basel Switzerland Tel: +41 (0)61 966 33 33 Fax: +41 (0)61 966 35 19 www.huntsman.com/advanced_materials Huntsman Advanced Materials warrants only that its products meet the specifications agreed with the buyer. Typical properties, where stated, are to be considered as representative of current production and should not be treated as specifications. The manufacture of materials is the subject of granted patents and patent applications; freedom to operate patented processes is not implied by this publication. While all the information and recommendations in this publication are, to the best of our knowledge, information and belief, accurate at the date of publication, NOTHING HEREIN IS TO BE CONSTRUED AS A WARRANTY, EXPRESS OR OTHERWISE. IN ALL CASES, IT IS THE RESPONSIBILITY OF THE USER TO DETERMINE THE APPLICABILITY OF SUCH INFORMATION AND RECOMMENDATIONS AND THE SUITABILITY OF ANY PRODUCT FOR ITS OWN PARTICULAR PURPOSE. The behaviour of the products referred to in this publication in manufacturing processes and their suitability in any given end-use environment are dependent upon various conditions such as chemical compatibility, temperature, and other variables, which are not known to Huntsman Advanced Materials. It is the responsibility of the user to evaluate the manufacturing circumstances and the final product under actual end-use requirements and to adequately advise and warn purchasers and users thereof. Products may be toxic and require special precautions in handling. The user should obtain Safety Data Sheets from Huntsman Advanced Materials containing detailed information on toxicity, together with proper shipping, handling and storage procedures, and should comply with all applicable safety and environmental standards. Hazards, toxicity and behaviour of the products may differ when used with other materials and are dependent on manufacturing circumstances or other processes. Such hazards, toxicity and behaviour should be determined by the user and made known to handlers, processors and end users. Except where explicitly agreed otherwise, the sale of products referred to in this publication is subject to the general terms and conditions of sale of Huntsman Advanced Materials LLC or of its affiliated companies including without limitation, Huntsman Advanced Materials (Europe) BVBA, Huntsman Advanced Materials Americas Inc., and Huntsman Advanced Materials (Hong Kong) Ltd. Huntsman Advanced Materials is an international business unit of Huntsman Corporation. Huntsman Advanced Materials trades through Huntsman affiliated companies in different countries including but not limited to Huntsman Advanced Materials LLC in the USA and Huntsman Advanced Materials (Europe) BVBA in Europe. [Araldite® 2014-1] is a registered trademark of Huntsman Corporation or an affiliate thereof. Copyright © 2007 Huntsman Corporation or an affiliate thereof. All rights reserved. Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France : 1.1 Identifiant du produit 1.3 Renseignements concernant le fournisseur de la fiche de données de sécurité Adresse email de la personne responsable pour cette FDS : Global_Product_EHS_AdMat@huntsman.com Description du produit : Non disponible. 1.2 Utilisations identifiées pertinentes de la substance ou du mélange et utilisations déconseillées SECTION 1: Identification de la substance/du mélange et de la société/l’entreprise Code du produit : 00057058 1.4 Numéro d’appel d’urgence Organisme de conseil/centre antipoison national Fournisseur Numéro de téléphone : EUROPE: +32 35 75 1234 France ORFILA: +33(0)145425959 ASIA: +65 6336-6011 China: +86 20 39377888 Australia: 1800 786 152 New Zealand: 0800 767 437 USA: +1/800/424.9300 Système Utilisation du produit : adhésif bi-composants Fournisseur : Huntsman Advanced Materials (Europe)BVBA Everslaan 45 3078 Everberg / Belgium Tel.: +41 61 299 20 41 Fax: +41 61 299 20 40 France : ORFILA 01.45.42.59.59 - Hors de France : +33.(0)1.45.42.59.59 Classification Xi; R41, R38 R43 N; R51/53 : Dangers pour la santé : humaine Risque de lésions oculaires graves. Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau. Dangers pour : l’environnement Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. Pour plus de détails sur les conséquences en termes de santé et les symptômes, reportez-vous à la section 11. SECTION 2: Identification des dangers 2.1 Classification de la substance ou du mélange Définition du produit : Working pack (preparation) Voir section 16 pour le texte intégral des phrases R et mentions H déclarées ci-dessus. Classification selon la directive 1999/45/CE [DPD] Le produit est classé dangereux selon la directive 1999/45/CE et ses amendements. 2.2 Éléments d’étiquetage Date d'édition / Date de révision : 3 Août 2011 1/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 2/19 SECTION 2: Identification des dangers Autres dangers qui ne : donnent pas lieu à une classification Non disponible. Récipients devant être pourvus d'une fermeture de sécurité pour les enfants Non applicable. Avertissement tactile de danger Non applicable. : : Exigences d‘emballages spéciaux Symbole(s) de danger Conseils de prudence S26- En cas de contact avec les yeux, laver immédiatement et abondamment avec de l'eau et consulter un spécialiste. S39- Porter un appareil de protection des yeux/du visage. S61- Éviter le rejet dans l'environnement. Consulter les instructions spéciales/la fiche de données de sécurité. R41- Risque de lésions oculaires graves. R38- Irritant pour la peau. R43- Peut entraîner une sensibilisation par contact avec la peau. R51/53- Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. Phrases de risque Ingrédients dangereux : : : : Irritant, Dangereux pour l'environnement produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) résine époxidique à base de bisphénol F éther diglycidique du 1,4-butanediol N(3-diméthylaminopropyl)-1,3-propylènediamine Indication de danger : 2.3 Autres dangers Éléments d’étiquetage supplémentaires : Contient des composés époxydiques. Voir les informations transmises par le fabricant. Substance/préparation : Working pack (preparation) Nom du Identifiants 67/548/CEE produit/composant SECTION 3: Composition/informations sur les composants % Règlement (CE) Type n° 1272/2008 [CLP] Classification produit de réaction: bisphénol-Aépichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) REACH #: 01- 2119456619-26 CAS: 25068-38-6 13 - 30 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] résine époxidique à base de bisphénol F REACH #: 01- 2119454392-40 CAS: 9003-36-5 3 - 7 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] éther diglycidique du 1,4-butanediol REACH #: 01- 2119494060-45 CAS: 2425-79-8 1 - 3 Xn; R20/21 Xi; R36/38 Acute Tox. 4, H312 Acute Tox. 4, H332 [1] Date d'édition / Date de révision : 3 Août 2011 2/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 3/19 SECTION 3: Composition/informations sur les composants Les limites d'exposition professionnelle, quand elles sont disponibles, sont énumérées à la section 8. Dans l'état actuel des connaissances du fournisseur et dans les concentrations d'application, aucun autre ingrédient présent n'est classé comme dangereux pour la santé ou l'environnement, et donc nécessiterait de figurer dans cette section. Voir section 16 pour le texte intégral des phrases R mentionnées cidessus Voir section 16 pour le texte intégral des mentions H déclarées ci-dessus. R43 R52/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 N(3- diméthylaminopropyl)- 1,3-propylènediamine CAS: 10563-29-8 1 - 3 Xn; R21/22 C; R34 R43 Acute Tox. 4, H302 Acute Tox. 4, H312 Skin Corr. 1B, H314 Eye Dam. 1, H318 Skin Sens. 1, H317 [1] diglycidylester de l'acide téréphthalique CAS: 7195-44-0 0.1 - 1 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] triglycidylester de l'acide trimellitique CAS: 7237-83-4 0.1 - 1 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] [1] Substance classée avec un danger pour la santé ou l'environnement [2] Substance avec une limite d'exposition au poste de travail [3] La substance remplit les critères des PTB selon le Règlement (CE) n° 1907/2006, Annexe XIII [4] La substance remplit les critères des tPtB selon le Règlement (CE) n° 1907/2006, Annexe XIII Type Contact avec la peau Consulter un médecin immédiatement. Rincer immédiatement les yeux à grande eau, en soulevant de temps en temps les paupières supérieures et inférieures. Vérifier si la victime porte des verres de contact et dans ce cas, les lui enlever. Continuez de rincer pendant 10 minutes au moins. Les brûlures chimiques doivent être traitées sans tarder par un médecin. Rincer la peau contaminée à grande eau. Retirer les vêtements et les chaussures contaminés. Laver abondamment à l'eau les vêtements contaminés avant de les retirer, ou porter des gants. Continuez de rincer pendant 10 minutes au moins. Consulter un médecin. En cas d'affections ou de symptômes, évitez d'exposer plus longuement. Laver les vêtements avant de les réutiliser. Laver les chaussures à fond avant de les remettre. 4.1 Description des premiers secours Transporter la victime à l'extérieur et la maintenir au repos dans une position où elle peut confortablement respirer. S'il ne respire pas, en cas de respiration irrégulière ou d'arrêt respiratoire, que le personnel qualifié pratique la respiration artificielle ou administre de l'oxygène. Il peut être dangereux pour la personne assistant une victime de pratiquer le bouche à bouche. Appelez un médecin en cas de persistance ou d'aggravation des effets néfastes sur la santé. En cas d'évanouissement, placez la personne en position latérale de sécurité et appelez un médecin immédiatement. Assurez-vous d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon. En cas d’inhalation de produits de décomposition lors d’un incendie, les symptômes peuvent être différés. La personne exposée peut avoir besoin de rester sous surveillance médicale pendant 48 heures. Inhalation Contact avec les yeux : : : SECTION 4: Premiers secours Date d'édition / Date de révision : 3 Août 2011 3/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 4/19 SECTION 4: Premiers secours Rincez la bouche avec de l'eau. Enlever les prothèses dentaires s'il y a lieu. Transporter la victime à l'extérieur et la maintenir au repos dans une position où elle peut confortablement respirer. Si une personne a avalé de ce produit et est consciente, lui faire boire de petites quantités d’eau. Si la personne est indisposée, cesser de la faire boire car des vomissements pourraient entraîner un risque supplémentaire. Ne pas faire vomir sauf indication contraire émanant du personnel médical. En cas de vomissement, maintenez la tête vers le bas pour empêcher le passage des vomissures dans les poumons. Appelez un médecin en cas de persistance ou d'aggravation des effets néfastes sur la santé. Ne rien faire ingérer à une personne inconsciente. En cas d'évanouissement, placez la personne en position latérale de sécurité et appelez un médecin immédiatement. Assurez-vous d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon. Note au médecin traitant En cas d’inhalation de produits de décomposition lors d’un incendie, les symptômes peuvent être différés. La personne exposée peut avoir besoin de rester sous surveillance médicale pendant 48 heures. Ingestion : : Traitements spécifiques Protection des sauveteurs : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Il peut être dangereux pour la personne assistant une victime de pratiquer le bouche à bouche. Laver abondamment à l'eau les vêtements contaminés avant de les retirer, ou porter des gants. 4.2 Effets et symptômes les plus importants, aigus ou différés Effets aigus potentiels sur la santé Inhalation : L'exposition aux produits de décomposition peut présenter des risques pour la santé. Les effets graves d’une exposition peuvent être différés. Irritant pour la bouche, Ingestion : la gorge et l'estomac. Contact avec la peau : Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau. Contact avec les yeux : Gravement irritant pour les yeux. Risque de lésions oculaires graves. Signes/symptômes de surexposition Contact avec la peau Ingestion Inhalation Aucune donnée spécifique. Aucune donnée spécifique. Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: irritation rougeur : : : Contact avec les yeux : Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: douleur ou irritation larmoiement rougeur 4.3 Indication quant à la nécessité d’une prise en charge médicale immédiate ou d’un traitement spécial : Traitement symptomatique et thérapie de soutien comme indiqué. Après une exposition sévère le patient doit être gardé sous contrôle médical pendant au moins 48 heures. Utiliser un agent extincteur approprié pour étouffer l'incendie avoisinant. 5.1 Moyens d’extinction Aucun connu. Moyens d’extinction appropriés : Moyens d’extinction inappropriés : SECTION 5: Mesures de lutte contre l’incendie 5.2 Dangers particuliers résultant de la substance ou du mélange Date d'édition / Date de révision : 3 Août 2011 4/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 5/19 SECTION 5: Mesures de lutte contre l’incendie En présence d'incendie, circonscrire rapidement le site en évacuant toute personne se trouvant près des lieux de l'accident. Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Ce produit est toxique pour les organismes aquatiques. L'eau du réseau d'extinction d'incendie qui a été contaminée par ce produit doit être conservée en milieu fermé et ne doit être déversée ni dans le milieu aquatique, ni aucun égout ou conduit d'évacuation. Risque lié aux produits de décomposition thermique Dangers dus à la substance ou au mélange Les produits de décomposition peuvent éventuellement comprendre les substances suivantes: dioxyde de carbone monoxyde de carbone oxydes d'azote oxydes de soufre oxyde/oxydes de métal L’augmentation de pression résultant d’un incendie ou d’une exposition à des températures élevées peut provoquer l’explosion du conteneur. Les pompiers devront porter un équipement de protection approprié ainsi qu'un appareil de protection respiratoire autonome avec masque intégral fonctionnant en mode pression positive. Les vêtements pour sapeurs-pompiers (y compris casques, bottes de protection et gants) conformes à la Norme européenne EN 469 procurent un niveau de protection de base contre les accidents chimiques. Équipement de protection spécial pour le personnel préposé à la lutte contre l'incendie : : : 5.3 Conseils aux pompiers Précautions spéciales pour les pompiers : 6.2 Précautions pour la protection de l’environnement Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone de déversement accidentel. S'approcher des émanations dans la même direction que le vent. Bloquer toute pénétration possible dans les égouts, les cours d’eau, les caves ou les zones confinées. Laver le produit répandu dans une installation de traitement des effluents ou procéder comme suit. Contenir les fuites et les ramasser à l'aide de matières absorbantes non combustibles telles que le sable, la terre, la vermiculite, la terre à diatomées. Les placer ensuite dans un récipient pour élimination conformément à la réglementation locale. Élimination par une entreprise Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Informez les autorités compétentes en cas de pollution de l'environnement (égouts, voies d'eau, sol et air) par le produit. Matière propre à polluer l’eau. Peut-être nocif pour l'environnement en cas de déversement de grandes quantités. Grand déversement accidentel : Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone de déversement accidentel. Diluer avec de l'eau et éponger si la matière est soluble dans l'eau. Sinon, ou si la matière est insoluble dans l'eau, absorber avec un matériau sec inerte et placer dans un conteneur à déchets approprié. Élimination par une entreprise autorisée de collecte des déchets. Petit déversement accidentel : 6.3 Méthodes et matériel de confinement et de nettoyage SECTION 6: Mesures à prendre en cas de dispersion accidentelle 6.1 Précautions individuelles, équipement de protection et procédures d’urgence Pour le personnel autre que le personnel d’intervention : Pour les agents d'intervention : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Évacuer les environs. Empêcher l'accès aux personnes non requises et ne portant pas de vêtements de protection. NE PAS TOUCHER ni marcher dans le produit répandu. Éviter de respirer les vapeurs ou le brouillard. Assurer une ventilation adéquate. Porter un appareil de protection respiratoire approprié lorsque le système de ventilation est inadéquat. Porter un équipement de protection individuelle adapté. Si des vêtements spécifiques sont nécessaires pour traiter le déversement, consulter la section 8 pour les matériaux appropriés et inappropriés. Voir également la section 8 pour plus d'informations sur les mesures d'hygiène. : Date d'édition / Date de révision : 3 Août 2011 5/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 6/19 SECTION 6: Mesures à prendre en cas de dispersion accidentelle autorisée de collecte des déchets. Les matériaux absorbants contaminés peuvent présenter les mêmes risques que le produit répandu. 6.4 Référence à d’autres sections Voir section 1 pour les coordonnées d'urgence. Voir la section 8 pour toute information sur les équipements de protection individuelle adaptés. Voir la section 13 pour toute information supplémentaire sur le traitement des déchets. : Stocker entre les températures suivantes: 2 à 40°C (35.6 à 104°F). Stocker conformément à la réglementation locale. Stocker dans le récipient d'origine à l'abri de la lumière directe du soleil dans un endroit sec, frais et bien ventilé à l'écart des matériaux incompatibles (cf. la section 10). Garder le récipient hermétiquement fermé lorsque le produit n'est pas utilisé. Les récipients ayant été ouverts doivent être refermés avec soin et maintenus en position verticale afin d'éviter les fuites. Ne pas stocker dans des conteneurs non étiquetés. Utiliser un récipient approprié pour éviter toute contamination du milieu ambiant. SECTION 7: Manipulation et stockage Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition. 7.1 Précautions à prendre pour une manipulation sans danger Mesures de protection : Conseils sur l'hygiène professionnelle en général : 7.2 Conditions d’un stockage sûr, y compris d’éventuelles incompatibilités 7.3 Utilisations finales spécifiques Recommandations : Solutions spécifiques au : secteur industriel Non disponible. Non disponible. Revêtir un équipement de protection individuelle approprié (voir Section 8). Les personnes ayant des antécédents de sensibilisation cutanée ne doivent pas intervenir dans les processus utilisant ce produit. Ne pas mettre en contact avec les yeux, la peau ou les vêtements. Ne pas ingérer. Éviter de respirer les vapeurs ou le brouillard. Éviter le rejet dans l'environnement. Consulter les instructions spéciales/la fiche de données de sécurité. Garder dans le conteneur d'origine ou dans un autre conteneur de substitution homologué fabriqué à partir d'un matériau compatible et tenu hermétiquement clos lorsqu'il n'est pas utilisé. Les conteneurs vides retiennent des résidus de produit et peuvent présenter un danger. Ne pas réutiliser ce conteneur. Il est interdit de manger, boire ou fumer dans les endroits où ce produit est manipulé, entreposé ou mis en oeuvre. Il est recommandé au personnel de se laver les mains et la figure avant de manger, boire ou fumer. Retirer les vêtements contaminés et les équipements de protection avant d'entrer dans un lieu de restauration. Voir également la section 8 pour plus d'informations sur les mesures d'hygiène. : Classe de danger de stockage Huntsman Advanced Materials : Classe de stockage 10, Liquide nocif pour l'ambience Date d'édition / Date de révision : 3 Août 2011 6/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 7/19 Procédures de surveillance recommandées Limites d'exposition professionnelle Si ce produit contient des ingrédients présentant des limites d'exposition, il peut s'avérer nécessaire d'effectuer un examen suivi des personnes, de l'atmosphère sur le lieu de travail ou des organismes vivants pour déterminer l'efficacité de la ventilation ou d'autres mesures de contrôle ou évaluer le besoin d'utiliser du matériel de protection des voies respiratoires. Il importe de vous reporter à la norme européenne EN 689 concernant les méthodes pour évaluer l'exposition par inhalation aux agents chimiques et aux documents de politique générale nationaux relatifs aux méthodes pour déterminer les substances dangereuses. Protection des mains Le port de gants imperméables et résistants aux produits chimiques conformes à une norme approuvée, est obligatoire en tout temps lors de la manutention de produits chimiques si une évaluation des risques le préconise. Utiliser une protection oculaire conforme à une norme approuvée dès lors qu'une évaluation du risque indique qu'il est nécessaire d'éviter l'exposition aux projections de liquides, aux fines particules pulvérisées ou aux poussières. Protection oculaire/faciale Aucune valeur de limite d'exposition connue. : : : Protection de la peau Contrôles d’ingénierie appropriés : Aucune ventilation particulière requise. Une bonne ventilation générale devrait être suffisante pour contrôler l'exposition du technicien aux contaminants en suspension dans l'air. Si ce produit contient des composants pour lesquels des contraintes liées à l'exposition existent, utiliser des enceintes de protection, une ventilation locale par aspiration, ou d'autres moyens de contrôle automatiques intégrés afin de maintenir le seuil d'exposition du technicien inférieur aux limites recommandées ou légales. Se laver abondamment les mains, les avant-bras et le visage après avoir manipulé des produits chimiques, avant de manger, de fumer et d'aller aux toilettes ainsi qu'à la fin de la journée de travail. Il est recommandé d'utiliser les techniques appropriées pour retirer les vêtements potentiellement contaminés. Les vêtements de travail contaminés ne devraient pas sortir du lieu de travail. Laver les vêtements contaminés avant de les réutiliser. S'assurer que les dispositifs rince-oeil automatiques et les douches de sécurité se trouvent à proximité de l'emplacement des postes de travail. 8.2 Contrôles de l’exposition Mesures d'hygiène : Aucune DEL disponible. Concentrations prédites avec effet Aucune PEC disponible. SECTION 8: Contrôles de l’exposition/protection individuelle Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition. 8.1 Paramètres de contrôle Doses dérivées avec effet Mesures de protection individuelles Les limites d'exposition sur la place de travail doivent être dans les normes (poussière totale, poussière de quartz potentiellement inhalable). Si les limites sont dépassées, portez un masque à poussière approprié. A T T E N T I O N ! Ce produit contient du quartz, classé par l'IARC parmi les substances carcinogènes pour l'homme (Groupe 1), pouvant causer une silicose ou un cancer des poumons par inhalation des poussières. Il est donc important d'éviter de s'exposer à toute inhalation lors des opérations mécaniques effectuées avec le produit fini (mouture, décapage, coupe...). QUARTZ (CAS RN 14808-60-7): France: TWA: 0.1 mg/m³ 8 hour(s). Form: respirable aerosol Suisse: TWA: 0.15 mg/m³ 8 hour(s). Form: respirable dust Belgique: TWA: 0.1 mg/m³ 8 hour(s). Form: respirable dust Date d'édition / Date de révision : 3 Août 2011 7/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 8/19 SECTION 8: Contrôles de l’exposition/protection individuelle Lorsque la ventilation du local est insuffisante, porter un équipement de protection respiratoire. Le choix de l'appareil de protection respiratoire doit être fondé sur les niveaux d'expositions prévus ou connus, les dangers du produit et les limites d'utilisation sans danger de l'appareil de protection respiratoire retenu. Protection respiratoire : L'équipement de protection personnel pour le corps devra être choisi en fonction de la tâche à réaliser ainsi que des risques encourus, et il est recommandé de le faire valider par un spécialiste avant de procéder à la manipulation du produit. : Contrôle de l'exposition de l'environnement : Il importe de tester les émissions provenant des systèmes de ventilation ou du matériel de fabrication pour vous assurer qu'elles sont conformes aux exigences de la législation sur la protection de l'environnement. Dans certains cas, il sera nécessaire d'équiper le matériel de fabrication d'un épurateur de gaz ou d'un filtre ou de le modifier techniquement afin de réduire les émissions à des niveaux acceptables. Protection corporelle : Autre protection cutanée Des chaussures adéquates et toutes mesures de protection corporelle devraient être déterminées en fonction de l'opération effectuée et des risques impliqués, et devraient être approuvées par un spécialiste avant toute manipulation de ce produit. Alcool éthylvinylique laminé (EVAL), caoutchouc butyle néoprène, Matériaux pour gants caoutchouc nitrile pour utilisation à court terme/projection (10 min480 min): Non disponible. État physique Point de fusion/point de congélation Point d'ébullition initial et intervalle d'ébullition Liquide. [Pâte.] Non disponible. Odeur Non disponible. pH Couleur Non disponible. Vitesse d'évaporation Non disponible. Point d'éclair Vase clos: >100°C [DIN 51758 EN 22719 (Pensky-Martens Closed Cup)] Non disponible. Non disponible. Seuil d'odeur Non disponible. Limites supérieures/inférieures d'inflammabilité ou d'explosion : : : : : : : : : : 9.1 Informations sur les propriétés physiques et chimiques essentielles Aspect Durée de combustion Non applicable. Vitesse de combustion Non applicable. : : SECTION 9: Propriétés physiques et chimiques Inflammabilité (solide, gaz) : Non disponible. Date d'édition / Date de révision : 3 Août 2011 8/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 9/19 SECTION 9: Propriétés physiques et chimiques Pression de vapeur Densité relative Densité de vapeur Solubilité(s) Non disponible. Non disponible. Non disponible. Température d'autoinflammation Non disponible. Non disponible. Non disponible. Viscosité Non disponible. Coefficient de partage noctanol/ eau Propriétés d'explosivité : : : : : : : Propriétés comburantes : Non disponible. 9.2 Autres informations Température de décomposition : Non disponible. Masse volumique : 1.4 g/cm3 [20°C (68°F)] Solubilité dans l'eau : 10.6 Produits de décomposition dangereux 10.4 Conditions à éviter Aucune donnée spécifique. Dans des conditions normales de stockage et d'utilisation, aucun produit de décomposition dangereux ne devrait apparaître. 10.2 Stabilité chimique Le produit est stable. Aucune donnée spécifique. : : : 10.5 Matières incompatibles : 10.3 Possibilité de réactions dangereuses : Dans des conditions normales de stockage et d'utilisation, aucune réaction dangereuse ne se produit. SECTION 10: Stabilité et réactivité 10.1 Réactivité : Aucune donnée d'essai spécifique relative à la réactivité n'est disponible pour ce produit ou ses composants. Toxicité aiguë produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) CL0 Inhalation Vapeurs Rat - Mâle 0.00001 ppm 5 heures DL50 Cutané Rat - Mâle, Femelle >2000 mg/kg - DL50 Orale Rat - Femelle >2000 mg/kg - résine époxidique à base de bisphénol F DL50 Cutané Rat - Mâle, Femelle >2000 mg/kg - DL50 Orale Rat - Mâle, >5000 mg/kg - Nom du produit/composant Endpoint Espèces Résultat Exposition SECTION 11: Informations toxicologiques 11.1 Informations sur les effets toxicologiques Date d'édition / Date de révision : 3 Août 2011 9/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 10/19 SECTION 11: Informations toxicologiques Femelle éther diglycidique du 1,4- butanediol DL50 Cutané Rat - Mâle, Femelle >2150 mg/kg - DL50 Orale Rat - Mâle, Femelle 1163 mg/kg - N(3-diméthylaminopropyl)- 1,3-propylènediamine DL50 Cutané Lapin 1310 mg/kg - DL50 Orale Rat 1670 mg/kg - Mutagénicité Irritation/Corrosion produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 404 Effet irritant/corrosif aigu sur la peau Lapin Faiblement irritant OECD 405 Effet irritant/corrosif aigu sur les yeux Lapin Faiblement irritant résine époxidique à base de bisphénol F OECD 405 Effet irritant/corrosif aigu sur les yeux Lapin Non irritant. OECD 404 Effet irritant/corrosif aigu sur la peau Lapin Faiblement irritant éther diglycidique du 1,4- butanediol OECD 404 Effet irritant/corrosif aigu sur la peau Lapin Non irritant. OECD 405 Effet irritant/corrosif aigu sur les yeux Lapin Irritant puissant Nom du produit/composant Test Résultat Conclusion/Résumé : Peau : produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700): Légèrement irritant pour la peau. résine époxidique à base de bisphénol F: Légèrement irritant pour la peau. éther diglycidique du 1,4-butanediol: Non irritant pour la peau. Yeux : produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700): Légèrement irritant pour les yeux. résine époxidique à base de bisphénol F: Non irritant pour les yeux. éther diglycidique du 1,4-butanediol: Gravement irritant pour les yeux. Non disponible. Sensibilisant produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 429 Sensibilisation cutanée : essai des ganglions lymphatiques locaux peau Souris Sensibilisant résine époxidique à base de bisphénol F OECD 429 Sensibilisation cutanée : essai des ganglions lymphatiques locaux peau Souris Sensibilisant éther diglycidique du 1,4- butanediol OECD 406 Sensibilisation de la peau peau cobaye Sensibilisant Nom du produit/composant Test Voie d'exposition Résultat Conclusion/Résumé : Non disponible. Espèces Espèces Date d'édition / Date de révision : 3 Août 2011 10/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 11/19 SECTION 11: Informations toxicologiques Cancérogénicité produit de réaction: bisphénol-Aépichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 453 Etudes combinées de toxicité chronique et de cancérogénèse Rat 2 années; 7 jours par semaine Négatif Orale - OECD 453 Etudes combinées de toxicité chronique et de cancérogénèse Rat 2 années; 5 jours par semaine Négatif Cutané - OECD 453 Etudes combinées de toxicité chronique et de cancérogénèse Souris 2 années; 3 jours par semaine Négatif Cutané - Nom du produit/composant Test Espèces Exposition Résultat produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 471 Essai de mutation réverse sur des bactéries Positif OECD 476 Essai in vitro de mutation génique sur des cellules de mammifères Positif OECD 478 Toxicologie génétique : Essai de mutation létale dominante chez le rongeur Négatif EPA OPPTS Négatif résine époxidique à base de bisphénol F OECD 471 Essai de mutation réverse sur des bactéries Positif OECD 476 Essai in vitro de mutation génique sur des cellules de mammifères Positif OECD 473 Essai d'aberration chromosomique in vitro chez les mammifères Positif OECD 474 Le test de micronoyaux sur les érythrocytes de mammifère Négatif OECD 486 Essai de synthèse non programmée de l’ADN (UDS) sur des hépatocytes de mammifères in vivo Négatif éther diglycidique du 1,4- butanediol OECD 471 Essai de mutation réverse sur des bactéries Positif OECD 473 Essai d'aberration chromosomique in vitro chez les mammifères Positif OECD 474 Le test de micronoyaux sur les érythrocytes de mammifère Négatif Nom du produit/composant Test Résultat Conclusion/Résumé : Non disponible. Toxicité pour la reproduction Nom du produit/composant Test Espèces Résultat/Type de résultat Organes cibles Voie d'exposition Organes cibles Date d'édition / Date de révision : 3 Août 2011 11/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 12/19 SECTION 11: Informations toxicologiques Effets chroniques potentiels pour la santé Effets aigus potentiels sur la santé Inhalation : L'exposition aux produits de décomposition peut présenter des risques pour la santé. Les effets graves d’une exposition peuvent être différés. Irritant pour la bouche, Ingestion : la gorge et l'estomac. Contact avec la peau : Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau. Contact avec les yeux : Gravement irritant pour les yeux. Risque de lésions oculaires graves. Nom du produit/composant Test Type de résultat Résultat Organes cibles Tératogénicité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 414 Etude de la toxicité pour le développement prénatal Rat - Femelle >540 mg/kg Pas d'effets observés à : EPA CFR Lapin - Femelle >300 mg/kg Pas d'effets observés à : OECD 414 Etude de la toxicité pour le développement prénatal Lapin - Femelle 180 mg/kg NOAEL résine époxidique à base de bisphénol F EPA CFR Lapin - Femelle >300 mg/kg Pas d'effets observés à : Nom du produit/composant Test Espèces Résultat/Type de résultat produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 416 Étude de toxicité pour la reproduction sur deux générations Rat Orale: 540 mg/kg Pas d'effets observés à : - résine époxidique à base de bisphénol F OECD 416 Étude de toxicité pour la reproduction sur deux générations Rat Orale: 540 mg/kg Pas d'effets observés à : - Symptômes correspondant aux caractéristiques physiques, chimiques et toxicologiques Contact avec la peau Ingestion Inhalation Aucune donnée spécifique. Aucune donnée spécifique. Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: irritation rougeur : : : Contact avec les yeux : Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: douleur ou irritation larmoiement rougeur Informations sur les voies Non disponible. d’exposition probables : Effets retardés, effets immédiats et effets chroniques d’une exposition à court ou long terme Exposition de courte durée Exposition prolongée Effets potentiels immédiats Effets potentiels différés : : Effets potentiels immédiats Effets potentiels différés : : Non disponible. Non disponible. Non disponible. Non disponible. Date d'édition / Date de révision : 3 Août 2011 12/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 13/19 SECTION 11: Informations toxicologiques Une fois sensibilisé, une vive réaction allergique peut éventuellement se déclencher lors d'une exposition ultérieure à de très faibles niveaux. Généralités : Aucun effet important ou Cancérogénicité : danger critique connu. Mutagénicité : Aucun effet important ou danger critique connu. Tératogénicité : Aucun effet important ou danger critique connu. produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 408 Toxicité orale à doses répétées –rongeurs : 90 jours NOAEL Subchronique NOAEL Oral 50 mg/kg - OECD 411 Toxicité cutanée subchronique : 90 jours Pas d'effets observés à : Subchronique Pas d'effets observés à : Dermal 10 mg/kg - OECD 411 Toxicité cutanée subchronique : 90 jours NOAEL Subchronique NOAEL Dermal 100 mg/kg - résine époxidique à base de bisphénol F OECD 408 Toxicité orale à doses répétées –rongeurs : 90 jours NOAEL Subchronique NOAEL Oral 250 mg/kg - éther diglycidique du 1,4- butanediol OECD 407 Toxicité orale à dose répétée - pendant 28 jours sur les rongeurs NOAEL Subchronique NOAEL Oral 200 mg/kg - Conclusion/Résumé : Non disponible. Effets sur le développement : Aucun effet important ou danger critique connu. Effets sur la fertilité : Aucun effet important ou danger critique connu. Autres informations : Non disponible. 12.1 Toxicité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) - Aiguë CE50 72 heures Static Algues 9.4 mg/L OECD 202 Daphnia sp. Essai d'immobilisation immédiate Aiguë CE50 48 heures Static Daphnie 1.7 mg/L - Aiguë CI50 3 heures Static Bactéries >100 mg/L OECD 203 Poisson, essai de toxicité aiguë Aiguë CL50 96 heures Static Poisson 1.5 mg/L OECD 211 Daphnia magna, essai de reproduction Chronique NOEC 21 jours Semistatic Daphnie 0.3 mg/L résine époxidique à base de bisphénol F OECD 201 Algues, essai d'inhibition de la croissance Aiguë CE50 72 heures Static Algues 1.8 mg/L OECD OECD 202: Part I (Daphnia sp., Acute Immobilisation test) Aiguë CE50 48 heures Static Daphnie 1.6 mg/L - Aiguë CI50 3 heures Static Bactéries >100 mg/L OECD 203 Poisson, essai de Aiguë CL50 96 Poisson 0.55 mg/L Nom du produit/composant Exposition Espèces Résultat SECTION 12: Informations écologiques Test Endpoint Date d'édition / Date de révision : 3 Août 2011 13/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 14/19 SECTION 12: Informations écologiques LogPow FBC Potentiel 12.3 Potentiel de bioaccumulation Nom du produit/composant produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) 3.242 31 faible résine époxidique à base de bisphénol F 2.7 à 3.6 - élevée éther diglycidique du 1,4- butanediol -0.269 - faible Nom du produit/composant Demi-vie aquatique Photolyse Biodégradabilité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) Eau douce 4.83 jours Eau douce 3.58 jours Eau douce 7.1 jours - Non facilement résine époxidique à base de bisphénol F - - Non facilement éther diglycidique du 1,4- butanediol - - Non facilement toxicité aiguë heures Semistatic OECD 211 Daphnia magna, essai de reproduction Chronique NOEC 21 jours Semistatic Daphnie 0.3 mg/L éther diglycidique du 1,4- butanediol OECD 202 Daphnia sp. Essai d'immobilisation immédiate Aiguë CE50 24 heures Static Daphnie 75 mg/L OECD 201 Algues, essai d'inhibition de la croissance Aiguë EL50 72 heures Static Algues >160 mg/L OECD 209 Boue activée, essai d'inhibition de la respiration Aiguë CI50 3 heures Static Bactéries >100 mg/L OECD 203 Poisson, essai de toxicité aiguë Aiguë CL50 96 heures Static Poisson 24 mg/L 12.2 Persistance et dégradabilité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD Derived from OECD 301F (Biodegradation Test) 28 jours 5 % résine époxidique à base de bisphénol F EU 28 jours 0 % éther diglycidique du 1,4- butanediol OECD 301F Biodégradabilité facile - Essai de respirometrie manométrique 28 jours 43 % Nom du produit/composant Test Résultat Conclusion/Résumé : produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700): Non facilement biodégradable. Période Date d'édition / Date de révision : 3 Août 2011 14/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 15/19 SECTION 12: Informations écologiques Mobilité : Non disponible. 12.6 Autres effets néfastes Aucun effet important ou danger critique connu. 12.4 Mobilité dans le sol Coefficient de répartition sol/eau (KOC) : Non disponible. 12.5 Résultats de l'évaluation PTB et tPtB : 12.7 Autres renseignements écologiques Non applicable. Catalogue Européen des Déchets Déchets Dangereux : Oui. Il est recommandé d'éviter ou réduire autant que possible la production de déchets. Ne pas éliminer de quantités significatives de déchets résiduels du produit par les égouts. Les traiter dans une usine de traitement des eaux usées appropriée. Élimination des produits excédentaires et non recyclables par une entreprise autorisée de collecte des déchets. La mise au rebut de ce produit, des solutions et des sous-produits devra en permanence respecter les exigences légales en matière de protection de l'environnement et de mise au rebut des déchets ainsi que les exigences de toutes les autorités locales. Recycler les déchets d'emballage. Envisager l'incinération ou la mise en décharge uniquement si le recyclage est impossible. Ne se débarrasser de ce produit et de son récipient qu'en prenant toutes précautions d'usage. Manipuler avec prudence les récipients vides non nettoyés ni rincés. Les conteneurs vides ou les sachets internes peuvent retenir des restes de produit. Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Méthodes d'élimination : des déchets SECTION 13: Considérations relatives à l’élimination Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition. 13.1 Méthodes de traitement des déchets Produit Emballage Code de déchets Désignation du déchet Méthodes d'élimination des déchets : Précautions particulières : 07 02 08* autres résidus de réaction et résidus de distillation Il est recommandé d'éviter ou réduire autant que possible la production de déchets. Recycler les déchets d'emballage. Envisager l'incinération ou la mise en décharge uniquement si le recyclage est impossible. Ne se débarrasser de ce produit et de son récipient qu'en prenant toutes précautions d'usage. Manipuler avec prudence les récipients vides non nettoyés ni rincés. Les conteneurs vides ou les sachets internes peuvent retenir des restes de produit. Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Date d'édition / Date de révision : 3 Août 2011 15/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 16/19 Matière dangereuse du point de vue de l'environnement, liquide, n.s.a. BISPHENOL A/F EPOXY RESIN 9 III Matière dangereuse du point de vue de l'environnement, liquide, n.s.a. (BISPHENOL A/F EPOXY RESIN) Polluant marin (produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700), résine époxidique à base de bisphénol F) 9 III Matière dangereuse du point de vue de l'environnement, liquide, n.s.a. (BISPHENOL A/F EPOXY RESIN) UN3082 9 non disponible non disponible III UN3082 UN3082 Numéro d'identification du danger 90 Dispositions particulières 274 335 601 Code tunnel E Emergency schedules (EmS) F-A, S-F Avion passager et avion cargoLimitation de quantité: 450 L Instructions d'emballage 964 Avion cargo uniquementLimitation de quantité: 450 L Instructions d'emballage 964 SECTION 14: Informations relatives au transport ADR/RID IMDG IATA 14.1 Numéro ONU 14.2 Désignation officielle de transport ONU 14.3 Classe(s) de danger pour le transport 14.4 Groupe d’emballage ADN/ADNR Autres informations 14.5 Dangers pour l’environnement 14.6 Précautions particulières à prendre par l’utilisateur 14.7 Transport en vrac conformément à l’annexe II de la convention Marpol 73/78 et au recueil IBC Oui. Oui. Yes. Non disponible. Non disponible. Non disponible. : Non applicable. ADN/ADNR IMDG IATA ADR/RID SECTION 15: Informations réglementaires 15.1 Réglementations/législation d'hygiène, sécurité et environnement spécifique à la substance ou au mélange Règlement UE (CE) n° 1907/2006 (REACH) Annexe XIV - Liste des substances soumises à autorisation Substances extrêmement préoccupantes Aucun des composants n'est répertorié. Date d'édition / Date de révision : 3 Août 2011 16/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 17/19 SECTION 15: Informations réglementaires Réglementations nationales Autres Réglementations UE Annexe XVII - Restrictions Non applicable. applicables à la fabrication, à la mise sur le marché et à l'utilisation de certaines substances et préparations dangereuses et de certains articles dangereux : Inventaire d'Europe : Tous les composants sont répertoriés ou exclus. Surveillance médicale renforcée : Arrêté du 11 Juillet 1977 fixant la liste des travaux nécessitant une surveillance médicale renforcée: non concerné Substances chimiques sur liste noire : Non inscrit Substances chimiques sur liste prioritaire : Non inscrit Liste de la Directive IPPC (Prévention et Réduction Intégrées de la Pollution) - Air : Non inscrit Liste de la Directive IPPC (Prévention et Réduction Intégrées de la Pollution) - Eau : Non inscrit Liste des substances chimiques du tableau I de la Convention sur les armes chimiques : Non inscrit Liste des substances chimiques du tableau II de la Convention sur les armes chimiques : Non inscrit Liste des substances chimiques du tableau III de la Convention sur les armes chimiques : Non inscrit Réglementations Internationales 15.2 Évaluation de la sécurité chimique Ce produit contient des substances nécessitant encore une évaluation du risque chimique : Indique quels renseignements ont été modifiés depuis la version précédente. SECTION 16: Autres informations Abréviations et acronymes : ETA = Estimation de la Toxicité Aiguë CLP = Règlement 1272/2008/CE relatif à la classification, à l'étiquetage et à l'emballage des substances et des mélanges DNEL = Dose dérivée sans effet mention EUH = mention de danger spécifique CLP CPSE = concentration prédite sans effet RRN = Numéro d'enregistrement REACH Classification selon le Règlement (CE) n° 1272/2008 [CLP/SGH] Date d'édition / Date de révision : 3 Août 2011 17/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 18/19 SECTION 16: Autres informations Date d'impression 3 Août 2011 Date d'édition/ Date de révision Date de la précédente édition : : : R20/21- Nocif par inhalation et par contact avec la peau. R21/22- Nocif par contact avec la peau et par ingestion. R34- Provoque des brûlures. R41- Risque de lésions oculaires graves. R38- Irritant pour la peau. R36/38- Irritant pour les yeux et la peau. R43- Peut entraîner une sensibilisation par contact avec la peau. R51/53- Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. R52/53- Nocif pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. Texte intégral des phrases R : abrégées Texte intégral des classifications [DSD/DPD] : C - Corrosif Xn - Nocif Xi - Irritant N - Dangereux pour l'environnement 3 Août 2011 Aucune validation antérieure. Texte intégral des mentions : H abrégées Procédure employée pour déterminer la classification selon le Règlement (CE) n° 1272/2008 [CLP/SGH] Classification Justification Skin Irrit. 2, H315 Jugement expert Eye Dam. 1, H318 Jugement expert Skin Sens. 1, H317 Jugement expert Aquatic Chronic 2, H411 Jugement expert Texte intégral des classifications [CLP/SGH] : H302 Nocif en cas d'ingestion. H312 Nocif par contact cutané. H314 Provoque des brûlures de la peau et des lésions oculaires graves. H315 Provoque une irritation cutanée. H317 Peut provoquer une allergie cutanée. H318 Provoque des lésions oculaires graves. H319 Provoque une sévère irritation des yeux. H332 Nocif par inhalation. H411 Toxique pour les organismes aquatiques, entraîne des effets néfastes à long terme. Acute Tox. 4, H302 TOXICITÉ AIGUË: ORALE - Catégorie 4 Acute Tox. 4, H312 TOXICITÉ AIGUË: PEAU - Catégorie 4 Acute Tox. 4, H332 TOXICITÉ AIGUË: INHALATION - Catégorie 4 Aquatic Chronic 2, H411 DANGER CHRONIQUE POUR LE MILIEU AQUATIQUE - Catégorie 2 Eye Dam. 1, H318 LÉSIONS OCULAIRES GRAVES/IRRITATION OCULAIRE - Catégorie 1 Eye Irrit. 2, H319 LÉSIONS OCULAIRES GRAVES/IRRITATION OCULAIRE - Catégorie 2 Skin Corr. 1B, H314 CORROSION CUTANÉE/IRRITATION CUTANÉE - Catégorie 1B Skin Irrit. 2, H315 CORROSION CUTANÉE/IRRITATION CUTANÉE - Catégorie 2 Skin Sens. 1, H317 SENSIBILISATION CUTANÉE - Catégorie 1 Skin Irrit. 2, H315 Eye Dam. 1, H318 Skin Sens. 1, H317 Aquatic Chronic 2, H411 N° de FDS. : 00057058 Date d'édition / Date de révision : 3 Août 2011 18/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 19/19 SECTION 16: Autres informations Version Avis au lecteur : 1 Les informations et recommandations figurant dans cette publication sont fondées sur notre expérience générale et sont fournies de bonne foi au mieux de nos connaissances actuelles, MAIS RIEN DANS LES PRESENTES NE DOIT ÊTRE INTERPRETE COMME CONSTITUANT UNE GARANTIE OU UNE DECLARATION, EXPRESSE, IMPLICITE OU AUTRE. DANS TOUS LES CAS, IL INCOMBE A L'UTILISATEUR DE DETERMINER ET DE VERIFIER L'EXACTITUDE, AINSI QUE LE CARACTERE SUFFISANT ET APPLICABLE DE TELLES INFORMATIONS ET RECOMMANDATIONS, DE MEME QUE L'ADEQUATION ET L'ADAPTATION D'UN QUELCONQUE PRODUIT A UNE UTILISATION SPECIFIQUE OU DANS UN BUT PARTICULIER. LES PRODUITS MENTIONNES PEUVENT PRESENTER DES RISQUES INCONNUS ET DOIVENT ETRE UTILISES AVEC PRECAUTION. MEME SI CERTAINS RISQUES SONT DECRITS DANS CETTE PUBLICATION, IL N'EXISTE AUCUNE GARANTIE QU'IL S'AGIT DES SEULS RISQUES EXISTANTS. Les risques, la toxicité et le comportement des produits peuvent différer lorsque ceux-ci sont utilisés avec d'autres matériaux et dépendent des conditions de fabrication et d'autres processus. Ces risques, cette toxicité et ces comportements doivent être déterminés par l'utilisateur et portés à la connaissance des personnes ou entités chargés du transport ou de la manutention, du traitement ou de la transformation, ainsi que de tous utilisateurs finaux. ARALDITE® est une marque déposée de Huntsman Corporation ou une filiale dans un ou plusieurs pays, mais pas dans tous les pays. AUCUNE PERSONNE OU ORGANISATION A L’EXCEPTION D'UN EMPLOYE HUNTSMAN DUMENT QUALIFIE EST AUTORISE A FOURNIR OU METTRE A DISPOSITION DES FICHES DE DONNEES DE SECURITE POUR LES PRODUITS HUNTSMAN. LES FICHES DE DONNEES DE SECURITE DE SOURCES NON AUTORISEE PEUVENT CONTENIR DES INFORMATIONS QUI NE SONT PLUS A JOUR OU INEXACTES. AUCUNE PARTIE DE CETTE FICHE NE PEUT ETRE REPRODUITE OU DIFFUSEE SOUS QUELQUE FORME QUE CE SOIT, OU PAR TOUT MOYEN, SANS L'ACCORD ECRIT DE HUNTSMAN. TOUTES LES DEMANDES D'AUTORISATION DE REPRODUCTION DES DONNEES DE CE FEUILLET DOIVENT ETRE ADRESSEES A HUNTSMAN, AU RESPONSABLE DE LA SECURITE DU PRODUIT A L’ADRESSE CI-DESSUS. Date d'édition / Date de révision : 3 Août 2011 19/19 http://www.farnell.com/datasheets/1442064.pdf 1. Product profile 1.1 General description Logic level N-channel MOSFET in LFPAK package qualified to 175 °C. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment. 1.2 Features and benefits  Advanced TrenchMOS provides low RDSon and low gate charge  High efficiency gains in switching power convertors  Improved mechanical and thermal characteristics  LFPAK provides maximum power density in a Power SO8 package 1.3 Applications  DC-to-DC converters  Lithium-ion battery protection  Load switching  Motor control  Server power supplies 1.4 Quick reference data PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Rev. 1 — 30 May 2011 Product data sheet LFPAK Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 30 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 1 [1] - - 100 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 109 W Tj junction temperature -55 - 175 °C Static characteristics RDSon drain-source on-state resistance VGS = 10 V; ID = 15 A; Tj = 100 °C; see Figure 13 - - 2.4 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C - 1.3 1.7 mΩ Dynamic characteristics QGD gate-drain charge VGS = 4.5 V; ID = 10 A; VDS = 12 V; see Figure 14; see Figure 15 - 8.7 - nCPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 2 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK [1] Continuous current is limited by package. 2. Pinning information 3. Ordering information QG(tot) total gate charge VGS = 4.5 V; ID = 10 A; VDS = 12 V; see Figure 14 - 36.2 - nC Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 100 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - - 241 mJ Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 S source SOT669 (LFPAK; Power-SO8) 2 S source 3 S source 4 G gate mb D mounting base; connected to drain mb 1234 S D G mbb076 Table 3. Ordering information Type number Package Name Description Version PSMN1R7-30YL LFPAK; Power-SO8 plastic single-ended surface-mounted package; 4 leads SOT669PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 3 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 4. Limiting values [1] Continuous current is limited by package. Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 30 V VDSM peak drain-source voltage tp ≤ 25 ns; f ≤ 500 kHz; EDS(AL) ≤ 360 nJ; pulsed - 35 V VDGR drain-gate voltage Tj ≥ 25 °C; Tj ≤ 175 °C; RGS = 20 kΩ - 30 V VGS gate-source voltage -20 20 V ID drain current VGS = 10 V; Tmb = 100 °C; see Figure 1 [1] - 100 A VGS = 10 V; Tmb = 25 °C; see Figure 1 [1] - 100 A IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; see Figure 3 - 790 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 109 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Source-drain diode IS source current Tmb = 25 °C [1] - 100 A ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 790 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 100 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - 241 mJ Fig 1. Continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature 003aac446 0 20 40 60 80 100 120 0 50 100 150 200 Tmb (°C) ID (A) (1) Tmb (°C) 0 200 50 100 150 03aa16 40 80 120 Pder (%) 0PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 4 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage 003aad111 1 10 102 103 104 10-1 1 10 102 VDS (V) ID (A) Limit RDSon = VDS / ID (1) DC 100 ms 10 ms 1 ms 100 μs 10 μsPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 5 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - 0.5 1.1 K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration 003aac456 single shot 0.2 0.1 0.05 0.02 10-3 10-2 10-1 1 10 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) Zth(j-mb) (K/W) δ = 0.5 tp T P t tp T δ =PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 6 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 6. Characteristics Table 6. Characteristics Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Static characteristics V(BR)DSS drain-source breakdown voltage ID = 250 µA; VGS = 0 V; Tj = 25 °C 30 - - V ID = 250 µA; VGS = 0 V; Tj = -55 °C 27 - - V VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 11; see Figure 12 1.3 1.7 2.15 V ID = 1 mA; VDS = VGS; Tj = 150 °C; see Figure 12 0.65 - - V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 12 - - 2.45 V IDSS drain leakage current VDS = 30 V; VGS = 0 V; Tj = 25 °C - - 1 µA VDS = 30 V; VGS = 0 V; Tj = 150 °C - - 100 µA IGSS gate leakage current VGS = 16 V; VDS = 0 V; Tj = 25 °C - - 100 nA VGS = -16 V; VDS = 0 V; Tj = 25 °C - - 100 nA RDSon drain-source on-state resistance VGS = 4.5 V; ID = 15 A; Tj = 25 °C - 1.8 2.1 mΩ VGS = 10 V; ID = 15 A; Tj = 150 °C; see Figure 13 - - 2.8 mΩ VGS = 10 V; ID = 15 A; Tj = 100 °C; see Figure 13 - - 2.4 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C - 1.3 1.7 mΩ RG gate resistance f = 1 MHz - 0.77 1.5 Ω Dynamic characteristics QG(tot) total gate charge ID = 10 A; VDS = 12 V; VGS = 10 V; see Figure 14; see Figure 15 - 77.9 - nC ID = 0 A; VDS = 0 V; VGS = 10 V - 70 - nC ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14 - 36.2 - nC QGS gate-source charge ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14; see Figure 15 - 11.6 - nC QGS(th) pre-threshold gate-source charge - 8 - nC QGS(th-pl) post-threshold gate-source charge - 3.6 - nC QGD gate-drain charge - 8.7 - nC VGS(pl) gate-source plateau voltage VDS = 12 V; see Figure 14; see Figure 15 - 2.34 - V Ciss input capacitance VDS = 12 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 16 - 5057 - pF Coss output capacitance - 1082 - pF Crss reverse transfer capacitance - 398 - pF td(on) turn-on delay time VDS = 12 V; RL = 0.5 Ω; VGS = 4.5 V; RG(ext) = 4.7 Ω - 46 - ns tr rise time - 72 - ns td(off) turn-off delay time - 76 - ns tf fall time - 34 - nsPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 7 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; see Figure 17 - 0.78 1.2 V trr reverse recovery time IS = 20 A; dIS/dt = -100 A/µs; VGS = 0 V; VDS = 20 V - 45 - ns Qr recovered charge - 56 - nC Table 6. Characteristics …continued Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values Fig 6. Drain-source on-state resistance as a function of drain current; typical values Fig 7. Forward transconductance as a function of drain current; typical values Fig 8. Input and reverse transfer capacitances as a function of gate-source voltage; typical values 003aac449 0 50 100 150 200 250 300 0 2 4 6 8 10 VDS (V) ID (A) 2.2 2.4 2.6 2.8 3 VGS (V) = 3.2 3.4 3.6 4 10 003aac450 1 2 3 4 5 0 50 100 150 200 250 ID (A) RDSon (mΩ) 7 10 4 3.6 VGS (V) = 3.4 003aac452 0 50 100 150 200 0 20 40 60 80 ID (A) gfs (S) 003aac455 0 2000 4000 6000 8000 2 4 6 810 VGS (V) C (pF) Ciss CrssPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 8 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 9. Drain-source on-state resistance as a function of gate-source voltage; typical values Fig 10. Transfer characteristics: drain current as a function of gate-source voltage; typical values Fig 11. Sub-threshold drain current as a function of gate-source voltage Fig 12. Gate-source threshold voltage as a function of junction temperature 003aac451 1.0 1.5 2.0 2.5 3.0 2 4 6 8 10 VGS (V) RDSon (mΩ) 003aac453 0 20 40 60 80 01234 VGS (V) ID (A) Tj = 150 °C 25 °C 003aab271 10-6 10-5 10-4 10-3 10-2 10-1 0123 VGS (V) ID (A) min typ max 003aac982 0 1 2 3 -60 0 60 120 180 Tj (°C) VGS(th) (V) max typ minPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 9 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 13. Normalized drain-source on-state resistance factor as a function of junction temperature Fig 14. Gate charge waveform definitions Fig 15. Gate-source voltage as a function of gate charge; typical values Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 03aa27 0 0.5 1 1.5 2 −60 0 60 120 180 Tj (°C) a 003aaa508 VGS VGS(th) QGS1 QGS2 QGD VDS QG(tot) ID QGS VGS(pl) 003aac448 0 2 4 6 8 10 0 20 40 60 80 QG (nC) VGS (V) VDS = 19 (V) VDS = 12 (V) 003aac454 0 2000 4000 6000 10-1 1 10 102 VDS (V) C (pF) Ciss Coss CrssPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 10 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values 003aac447 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 VSD (V) IS (A) Tj = 150 °C 25 °CPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 11 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 7. Package outline Fig 18. Package outline SOT669 (LFPAK; Power-SO8) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 06-03-16 11-03-25 0 2.5 5 mm scale e E1 b c2 A2 UNIT A A2 b c e DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A1 A3 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8° 0° D w y (1) 5.0 4.8 E(1) 3.3 3.1 E1 D1 (1) (1) max 0.25 4.20 1.27 0.25 0.1 1 2 34 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A w M A C C X 1/2 e y C θ θ (A )3 L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 12 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PSMN1R7-30YL v.5 20110530 Product data sheet - PSMN1R7-30YL v.4 Modifications: • Various changes to content. PSMN1R7-30YL v.4 20100420 Product data sheet - PSMN1R7-30YL v.3PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 13 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 9. Legal information 9.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 14 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 May 2011 Document identifier: PSMN1R7-30YL Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11 8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13 9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14 10 Contact information. . . . . . . . . . . . . . . . . . . . . .14 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Rev. 01 — 13 August 2009 Product data sheet 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 2 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 3. Ordering information 4. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74VHC126D -40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74VHCT126D 74VHC126PW -40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74VHCT126PW 74VHC126BQ -40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 ´ 3 ´ 0.85 mm SOT762-1 74VHCT126BQ Fig 1. Functional diagram mna235 2 1A 1Y 1 3 1OE 5 2A 2Y 4 6 2OE 9 3A 3Y 10 8 3OE 12 4A 4Y 13 11 4OE Fig 2. Logic symbol Fig 3. IEC logic symbol mna234 nOE nA nY mna236 1 EN1 1 3 2 4 6 5 10 8 9 13 11 12 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 3 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 5. Pinning information 5.1 Pinning 5.2 Pin description (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 4. Pin configuration SO14 and TSSOP14 Fig 5. Pin configuration DHVQFN14 74VHC126 74VHCT126 1OE VCC 1A 4OE 1Y 4A 2OE 4Y 2A 3OE 2Y 3A GND 3Y 001aak056 1 2 3 4 5 6 7 8 10 9 12 11 14 13 001aak076 74VHC126 74VHCT126 Transparent top view 2Y 3A 2A 3OE 2OE 4Y 1Y 4A 1A 4OE GND 3Y 1OE VCC 6 9 5 10 4 11 3 12 2 13 7 8 1 14 terminal 1 index area GND(1) Table 2. Pin description Symbol Pin Description 1OE 1 output enable input 1 (active HIGH) 1A 2 data input 1 1Y 3 data output 1 2OE 4 output enable input 2 (active HIGH) 2A 5 data input 2 2Y 6 data output 2 GND 7 ground (0 V) 3Y 8 data output 3 3A 9 data input 3 3OE 10 output enable input 3 (active HIGH) 4Y 11 data output 4 4A 12 data input 4 4OE 13 output enable input 4 (active HIGH) VCC 14 supply voltage 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 4 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 6. Functional description [1] H = HIGH voltage state; L = LOW voltage state; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K. Table 3. Function table[1] Control Input Output nOE nA nY H L L H H H L X Z Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage -0.5 +7.0 V VI input voltage -0.5 +7.0 V IIK input clamping current VI < -0.5 V [1] -20 - mA IOK output clamping current VO < -0.5 V or VO > VCC + 0.5 V [1] -20 +20 mA IO output current VO = -0.5 V to (VCC + 0.5 V) -25 +25 mA ICC supply current - +75 mA IGND ground current -75 - mA Tstg storage temperature -65 +150 °C Ptot total power dissipation Tamb = -40 °C to +125 °C [2] - 500 mW 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 5 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 8. Recommended operating conditions 9. Static characteristics Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 74VHC126 VCC supply voltage 2.0 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature -40 +25 +125 °C Dt/DV input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74VHCT126 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature -40 +25 +125 °C Dt/DV input transition rise and fall rate VCC = 4.5 V to 5.5 V - - 20 ns/V Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ Max Min Max Min Max 74VHC126 VIH HIGH-level input voltage VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VIL LOW-level input voltage VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V VOH HIGH-level output voltage VI = VIH or VIL IO = -50 mA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = -50 mA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = -50 mA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = -4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = -8.0 mA; VCC = 4.5 V 3.94 - - 3.80 - 3.70 - V VOL LOW-level output voltage VI = VIH or VIL IO = 50 mA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 mA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 mA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 6 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 mA IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 mA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2.0 - 20 - 40 mA CI input capacitance VI = VCC or GND - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF 74VHCT126 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = -50 mA 4.4 4.5 - 4.4 - 4.4 - V IO = -8.0 mA 3.94 - - 3.80 - 3.70 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 50 mA - 0 0.1 - 0.1 - 0.1 V IO = 8.0 mA - - 0.36 - 0.44 - 0.55 V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 mA IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 mA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2.0 - 20 - 40 mA DICC additional supply current per input pin; VI = VCC - 2.1 V; other pins at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance VI = VCC or GND - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ Max Min Max Min Max 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 7 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ[1] Max Min Max Min Max 74VHC126 tpd propagation delay nA to nY; see Figure 6 [2] VCC = 3.0 V to 3.6 V CL = 15 pF - 4.7 8.0 1.0 9.5 1.0 10.0 ns CL = 50 pF - 6.7 11.5 1.0 13.0 1.0 14.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF - 3.3 5.5 1.0 6.5 1.0 7.0 ns CL = 50 pF - 4.7 7.5 1.0 8.5 1.0 9.5 ns ten enable time nOE to nY; see Figure 7 [3] VCC = 3.0 V to 3.6 V CL = 15 pF - 5.3 8.0 1.0 9.5 1.0 10.0 ns CL = 50 pF - 7.6 11.5 1.0 13.0 1.0 14.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF - 3.6 5.3 1.0 6.1 1.0 7.0 ns CL = 50 pF - 5.1 7.6 1.0 8.7 1.0 9.5 ns tdis disable time nOE to nY; see Figure 7 [4] VCC = 3.0 V to 3.6 V CL = 15 pF - 6.6 9.7 1.0 11.5 1.0 12.5 ns CL = 50 pF - 9.4 13.2 1.0 15.0 1.0 16.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF - 4.7 6.8 1.0 8.0 1.0 8.5 ns CL = 50 pF - 6.7 8.8 1.0 10.0 1.0 11.0 ns CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC [5] - 10 - - - - - pF 74VHCT126; VCC = 4.5 V to 5.5 V tpd propagation delay nA to nY; see Figure 6 [2] CL = 15 pF - 3.0 5.5 1.0 6.5 1.0 7.0 ns CL = 50 pF - 4.3 7.5 1.0 8.5 1.0 9.5 ns ten enable time nOE to nY; see Figure 7 [3] CL = 15 pF - 3.3 5.1 1.0 6.0 1.0 6.5 ns CL = 50 pF - 4.7 7.1 1.0 8.0 1.0 9.0 ns tdis disable time nOE to nY; see Figure 7 [4] CL = 15 pF - 4.8 6.8 1.0 8.0 1.0 8.5 ns CL = 50 pF - 6.9 8.9 1.0 10.0 1.0 11.5 ns CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC [5] - 12 - - - - - pF 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 8 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] ten is the same as tPZL and tPZH. [4] tdis is the same as tPLZ and tPHZ. [5] CPD is used to determine the dynamic power dissipation (PD in mW). PD = CPD ´ VCC 2 ´ fi ´ N + S(CL ´ VCC 2 ´ fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; S(CL ´ VCC 2 ´ fo) = sum of the outputs. 11. Waveforms Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Input to output propagation delays mna237 tPHL tPLH VM nA input VM nY output GND VI VOH VOL Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Enable and disable times mna949 tPLZ tPHZ outputs disabled outputs enabled VY VX outputs enabled output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH nOE input VOL VOH VCC VI VM GND GND tPZL tPZH VM VM 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 9 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Table 8. Measurement points Type Input Output VM VM VX VY 74VHC126 0.5VCC 0.5VCC VOL + 0.3 V VOH - 0.3 V 74VHCT126 1.5 V 0.5VCC VOL + 0.3 V VOH - 0.3 V Test data is given in Table 9. Definitions test circuit: RT = termination resistance should be equal to output impedance Zo of the pulse generator. CL = load capacitance including jig and probe capacitance. RL = load resistance. S1 = test selection switch. Fig 8. Test circuitry for measuring switching times VM VM tW tW 10 % 90 % 0 V VI VI negative pulse positive pulse 0 V VM VM 90 % 10 % tf tr tr tf 001aad983 DUT VCC VCC VI VO RT RL S1 CL G open Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74VHC126 VCC £ 3.0 ns 15 pF, 50 pF 1 kW open GND VCC 74VHCT126 3.0 V £ 3.0 ns 15 pF, 50 pF 1 kW open GND VCC 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 10 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 12. Package outline Fig 9. Package outline SOT108-1 (SO14) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT108-1 X w M q A A 1 A2 bp D HE Lp Q detail X E Z e c L v M A (A 3 ) A 7 8 1 14 y 076E06 MS-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 11 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Fig 10. Package outline SOT402-1 (TSSOP14) UNIT A1 A2 A3 bp c D(1) E (2) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT402-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 1 7 14 8 q A A1 A2 Lp Q detail X L (A 3 ) HE E c v M A X A y 0 2.5 5 mm scale TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 A max. 1.1 pin 1 index 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 12 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Fig 11. Package outline SOT762-1 (DHVQFN14) terminal 1 index area 1 0.5 UNIT A1 b Eh e y 0.2 c OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 Dh 1.65 1.35 y1 2.6 2.4 1.15 0.85 e1 2 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT762-1 - - - MO-241 - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT762-1 DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm A(1) max. A A1 c detail X e y1 C y L Eh Dh e e1 b 2 6 13 9 8 1 7 14 X D E C B A 02-10-17 03-01-27 terminal 1 index area C A C v M B w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 13 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 13. Abbreviations 14. Revision history Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74VHC_VHCT126_1 20090813 Product data sheet - - 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 14 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 August 2009 Document identifier: 74VHC_VHCT126_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. Product specification July 1998 DISCRETE SEMICONDUCTORS BYV79E series Rectifier diodes ultrafast, rugged Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged FEATURES SYMBOL QUICK REFERENCE DATA • Low forward volt drop VR = 150 V/ 200 V • Fast switching • Soft recovery characteristic VF ≤ 0.9 V • Reverse surge capability • High thermal cycling performance IF(AV) = 14 A • Low thermal resistance IRRM ≤ 0.2 A trr ≤ 30 ns GENERAL DESCRIPTION PINNING SOD59 (TO220AC) Ultra-fast, epitaxial rectifier diodes PIN DESCRIPTION intended for use as output rectifiers in high frequency switched mode 1 cathode power supplies. 2 anode The BYV79E series is supplied in the conventional leaded SOD59 tab cathode (TO220AC) package. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT BYV79E -150 -200 VRRM Peak repetitive reverse voltage - 150 200 V VRWM Crest working reverse voltage - 150 200 V VR Continuous reverse voltage Tmb ≤ 145˚C - 150 200 V IF(AV) Average forward current1 square wave - 14 A δ = 0.5; Tmb ≤ 120 ˚C IFRM Repetitive peak forward current t = 25 μs; δ = 0.5; - 28 A Tmb ≤ 120 ˚C IFSM Non-repetitive peak forward t = 10 ms - 150 A current t = 8.3 ms - 160 A sinusoidal; with reapplied VRWM(max) IRRM Repetitive peak reverse current tp = 2 μs; δ = 0.001 - 0.2 A IRSM Non-repetitive peak reverse tp = 100 μs - 0.2 A current Tstg Storage temperature -40 150 ˚C Tj Operating junction temperature - 150 ˚C 1. Neglecting switching and reverse current losses. ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VC Electrostatic discharge Human body model; - 8 kV capacitor voltage C = 250 pF; R = 1.5 kΩ k a 1 2 1 tab 2 July 1998 1 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Rth j-mb Thermal resistance junction to - - 2 K/W mounting base Rth j-a Thermal resistance junction to in free air - 60 - K/W ambient STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF Forward voltage IF = 14 A; Tj = 150˚C - 0.83 0.90 V IF = 14 A - 0.95 1.05 V IF = 50 A - 1.2 1.4 V IR Reverse current VR = VRWM; Tj = 100 ˚C - 0.5 1.3 mA VR = VRWM - 5 50 μA Qs Reverse recovery charge IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/μs - 6 15 nC trr1 Reverse recovery time IF = 1 A; VR ≥ 30 V; - 20 30 ns -dIF/dt = 100 A/μs trr2 Reverse recovery time IF = 0.5 A to IR = 1 A; Irec = 0.25 A - 13 22 ns Vfr Forward recovery voltage IF = 1 A; dIF/dt = 10 A/μs - 1 - V July 1998 2 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged Fig.1. Definition of trr1, Qs and Irrm Fig.2. Definition of Vfr Fig.3. Circuit schematic for trr2 Fig.4. Definition of trr2 Fig.5. Maximum forward dissipation PF = f(IF(AV)); square current waveform where IF(AV) =IF(RMS) x √D. Fig.6. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Q s 10% 100% time dI dt F I R I F I rrm t rr I = 1A R I rec = 0.25A 0A trr2 0.5A IF IR time time V F V fr V F I F 0 5 10 15 20 25 0 5 10 15 20 0.5 0.2 0.1 BYV79 IF(AV) / A PF / W D = 1.0 Tmb(max) / C 150 140 130 120 110 Vo = 0.744 V Rs = 0.0112 Ohms tp D = tp T T t I shunt Current to ’scope D.U.T. Voltage Pulse Source R 0 5 10 15 0 5 10 15 1.9 2.2 2.8 4 BYV79 IF(AV) / A PF / W Tmb(max) / C 150 140 130 a = 1.57 120 Vo = 0.744 V Rs = 0.0112 Ohms July 1998 3 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged Fig.7. Maximum trr at Tj = 25 ˚C. Fig.8. Maximum Irrm at Tj = 25 ˚C. Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.10. Maximum Qs at Tj = 25 ˚C. Fig.11. Transient thermal impedance; Zth j-mb = f(tp). 1 10 trr / ns 1 10 100 1000 dIF/dt (A/us) IF=1A IF=10A 100 1.0 10 100 Qs / nC 1.0 10 100 -dIF/dt (A/us) 1000 IF=10A 5A 2A 10 1 0.1 0.01 Irrm / A 1 10 100 -dIF/dt (A/us) IF=10A IF=2A 1us 10us 100us 1ms 10ms 100ms 1s 10s 0.001 0.01 0.1 1 10 pulse width, tp (s) BYV79E Transient thermal impedance, Zth j-mb (K/W) tp D = tp T T P t D 0 2 60 50 40 30 20 10 0 max typ Tj = 150 C Tj = 25 C 0.5 1.0 IF / A VF / V 1.5 July 1998 4 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.12. SOD59 (TO220AC). pin 1 connected to mounting base. Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10,3 max 3,7 2,8 3,0 3,0 max not tinned 1,3 max (2x) 2,4 0,6 4,5 max 5,9 min 15,8 max 1,3 0,9 max (2x) 13,5 min 5,08 1 2 July 1998 5 Rev 1.200 NXP Semiconductors Legal information DATA SHEET STATUS Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DEFINITIONS Product specification ⎯ The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. DISCLAIMERS Limited warranty and liability ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors Legal information NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products ⎯ Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers. © NXP B.V. 2011 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands  Product specification July 1998 DISCRETE SEMICONDUCTORS BYV79E series Rectifier diodes ultrafast, rugged AC Current Probes P6021A & P6022 The P6021 and P6022 Current Probes provide versatile AC current measurements. Both probes provide accurate current measurements over a wide range of frequencies. The P6021 and P6022 allow current measurements without breaking the circuit by clipping onto the current carrying conductor. Shielded probe heads are not grounded when the slides are in their open positions, eliminating accidental grounding of the circuit under test. Key performance specifications P6021A 120 Hz to 60 MHz 10.6 A RMS, 250 A peak, 10 mA sensitivity P6022 935 Hz to 120 MHz 4 A RMS, 100 A peak, 1 mA sensitivity Key features For 1 MΩ inputs Shielded probe head AC only Split core construction allows easy circuit connection 1.5 m (5 ft) cable Applications Motor drives Power inverters/converters Power supplies Avionics P6021A For general purpose applications, the P6021A provides wide-band performance with excellent low-frequency characteristics. Bandwidth is 120 Hz to 60 MHz. The probe range is switchable between 2 mA/mV and 10 mA/mV. P6022 With a head size of 0.47 in. x 0.25 in. (10 mm x 6 mm, about half the size of the P6021A) and a bandwidth of 935 Hz to 120 MHz, the P6022 is ideal for measuring currents in compact, high-performance circuits. Passive termination output is switchable between 1 mA/mV and 10 mA/mV.Specifications All specifications apply to all models unless noted otherwise. Physical characteristics Cable length 1.5 m (59 in) P6021A probe head Length 20 cm (7.77 in) Width 16 mm (0.625 in) Height 32 mm (1.25 in) Maximum conductor diameter 5 mm (0.197 in) P6022 probe head Length 152 mm (6.0 in) Width 6.4 mm (0.25 in) Height 12 mm (0.47 in) Maximum conductor diameter 2.8 mm (0.11 in) EMC environment and safety Compliance CAN/CSA-C22.2 No. 61010-1 CAN/CSA-C22.2 No. 61010-2-032 UL 61010-1 UL61010B-2-032 EN 61010-1 EN 61010-2-032 Datasheet 2 www.tektronix.comOrdering information Models P6021A Current Probe P6022 Current Probe with termination Standard accessories 6 in. ground lead 196-3521-00 Instruction manual 071-3004-00 (P6021A), 070-0948-03 (P6022) Termination 011-0106-00 (P6022 only) Recommended accessories Nylon carrying case 016-1952-xx Current loop, 1 turn, 50 Ω with BNC connector, used for Performance Verification 067-2396-xx Deskew/calibration fixture 067-1686-xx Warranty One year parts and labor. Service options Opt. C3 Calibration Service 3 Years Opt. C5 Calibration Service 5 Years Opt. D1 Calibration Data Report Opt. D3 Calibration Data Report 3 Years (with Opt. C3) Opt. D5 Calibration Data Report 5 Years (with Opt. C5) Opt. R3 Repair Service 3 Years (including warranty) Opt. R3DW Repair Service Coverage 3 Years (includes product warranty period). 3-year period starts at time of instrument purchase Opt. R5 Repair Service 5 Years (including warranty) Opt. R5DW Repair Service Coverage 5 Years (includes product warranty period). 5-year period starts at time of instrument purchase Tektronix is registered to ISO 9001 and ISO 14001 by SRI Quality System Registrar. AC Current Probes www.tektronix.com 3Datasheet ASEAN / Australasia (65) 6356 3900 Austria 00800 2255 4835* Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777 Belgium 00800 2255 4835* Brazil +55 (11) 3759 7627 Canada 1 800 833 9200 Central East Europe and the Baltics +41 52 675 3777 Central Europe & Greece +41 52 675 3777 Denmark +45 80 88 1401 Finland +41 52 675 3777 France 00800 2255 4835* Germany 00800 2255 4835* Hong Kong 400 820 5835 India 000 800 650 1835 Italy 00800 2255 4835* Japan 81 (3) 6714 3010 Luxembourg +41 52 675 3777 Mexico, Central/South America & Caribbean 52 (55) 56 04 50 90 Middle East, Asia, and North Africa +41 52 675 3777 The Netherlands 00800 2255 4835* Norway 800 16098 People's Republic of China 400 820 5835 Poland +41 52 675 3777 Portugal 80 08 12370 Republic of Korea 001 800 8255 2835 Russia & CIS +7 (495) 6647564 South Africa +41 52 675 3777 Spain 00800 2255 4835* Sweden 00800 2255 4835* Switzerland 00800 2255 4835* Taiwan 886 (2) 2722 9622 United Kingdom & Ireland 00800 2255 4835* USA 1 800 833 9200 * European toll-free number. If not accessible, call: +41 52 675 3777 Updated 10 April 2013 For Further Information. Tektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit www.tektronix.com. Copyright © Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specification and price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks, or registered trademarks of their respective companies. 12 Apr 2013 60W-06647-3 www.tektronix.com CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 14,15WAY,SKT CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 14,15WAY,SKT CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 14,15WAY,SKT CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT (L/C) CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT (L/C) CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,25WAY,PIN CIRCULAR,SIZE 20,25WAY,PIN (L/C) CIRCULAR,SIZE 20,25WAY,PIN CIRCULAR,SIZE 20,25WAY,PIN (L/C) CIRCULAR,SIZE 20,25WAY,PIN CIRCULAR,SIZE 20,25WAY,PIN (L/C) CIRCULAR,SIZE 20,25WAY,SKT CIRCULAR,SIZE 20,25WAY,SKT (L/C) CIRCULAR,SIZE 20,25WAY,SKT CIRCULAR,SIZE 20,25WAY,SKT (L/C) CIRCULAR,SIZE 20,25WAY,SKT CIRCULAR,SIZE 20,25WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,39WAY,PIN CIRCULAR,SIZE 20,39WAY,PIN (L/C) CIRCULAR,SIZE 20,39WAY,PIN CIRCULAR,SIZE 20,39WAY,PIN (L/C) BINDING POST,30A,#8-32,STUD,WHITE CIRCULAR,SIZE 20,39WAY,PIN CIRCULAR,SIZE 20,39WAY,PIN (L/C) CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT (L/C) CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT (L/C) CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT (L/C) CIRCULAR,SIZE 20,41WAY,PIN CIRCULAR,SIZE 20,41WAY,PIN (L/C) CIRCULAR,SIZE 20,41WAY,PIN CIRCULAR,SIZE 20,41WAY,PIN (L/C) CIRCULAR,SIZE 20,41WAY,PIN CIRCULAR,SIZE 20,41WAY,PIN (L/C) CIRCULAR,SIZE 20,41WAY,SKT CIRCULAR,SIZE 20,41WAY,SKT (L/C) CIRCULAR,SIZE 20,41WAY,SKT CIRCULAR,SIZE 20,41WAY,SKT (L/C) CIRCULAR,SIZE 20,41WAY,SKT CIRCULAR,SIZE 20,41WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) BINDING POST,30A,#8-32,STUD,RED CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN Binding Post CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) BINDING POST,30A,#8-32,STUD,RED CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT BINDING POST,30A,#8-32,STUD,BLACK CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) BINDING POST,30A,#8-32,STUD,BLUE CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN BINDING POST,30A,#8-32,STUD,GREEN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) BINDING POST,30A,#8-32,STUD,WHITE CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CONNECTOR,HEADER,2.54MM,4POS,SMT CONNECTOR,HEADER,2.54MM,8POS,T/H BI LEV PRISM R-B SMPL STRIP BILEV PRISM W-B SMPL STRIP 41T5240 IR EMITTING DIODE,850NM,SMD IR EMITTING DIODE,850NM,SMD CAPACITOR TANT,4.7UF,100V,AXIAL 10% CONNECTOR,HEADER,2.54MM,16POS,SMT CAPACITOR TANT,33UF,15V,AXIAL 10% TRIAC,BIDIRECTIONAL,600V,16A,TO-220AB CAPACITOR TANT,82UF,75V,AXIAL 10% SPRING LOADED PIN,2A CAPACITOR TANT,120UF,100V,AXIAL 10% RECTIFIER,MOD,100A,800V,POW-R-BLOK RECTIFIER,MOD,100A,1.6KV,POW-R-BLOK RECTIFIER,MOD,100A,1.6KV,POW-R-BLOK RECTIFIER,MOD,100A,1.8KV,POW-R-BLOK SCR / RECTIFIER,MOD,90A,800V,POW-R-BLOK SCR / RECTIFIER,MOD,90A,1.6KV,POW-R-BLOK SCR / RECTIFIER,MOD,90A,1.8KV,POW-R-BLOK SCR,MOD,90A,1.6KV,POW-R-BLOK SCR,MOD,90A,1.8KV,POW-R-BLOK RECTIFIER,MOD,160A,800V,POW-R-BLOK RECTIFIER,MOD,160A,1.6KV,POW-R-BLOK REC