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Farnell PDF
12mm Size Insulated Shaft Type Encoder Variety
EC12E Series - PDF - Farnell Element 14
12mm Size Insulated Shaft Type Encoder Variety
EC12E Series - PDF - Farnell Element 14
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Farnell Element 14 :
See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…
Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.
Puce électronique / Microchip :
Sans fil - Wireless :
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Incremental
Type
Absolute
Type
186
Power
Push
Slide
Rotary
Encoders
Jog
Shuttle
Telephone
-hook
Detector
Vibration/
Tilt Sensors
Dual-in-line
Package Type
Multi Control
Devices
TACT
Insulated shaft type with a push-on switch and other features has a wide variety of applications.
A 12mm sized unit achieved high resolution,12- pulse /12-
detent and 24 -pulse / 24 -detent.
Used a new structure for the shaft and bushing, and achieved
a high precision, responsive system.
Also available with a 0.5mm push switch.
● Incremental type.
●
●
●
5mA 5V DC
Without detent
Other
15,000 cycles
30,000 cycles
Rating(max.)(Resistive load)
Items Specifications
Operating life
Features
Typical Specifications
Products Line
Controls for image and sound devices, including DVD
players, mini component stereos, CD players, portable audio
players and monitors.
● Controls for audio mixers and electronic instruments.
●
Applications
Products No. Drawing
No.
Minimum packing
unit(pcs.) Detent torque Resolution
Length of
operating section
(mm)
2
1,200
1
3
1
3
2
1
3
1
3
1
Vertical
Number
of detent
12
24
Without
Standard
3 to 20 mN・m
15
20
25
15
20
25
8.5
(Hollow shaft)
20
25
8.5
(Hollow shaft)
20
25
20
25 Lightest(jog)
3±2 mN・m
Standard
3 to 20 mN・m
Lightest(jog)
3±2 mN・m
Standard
25±15 mN・m
EC12E1220407
EC12E1220406
EC12E1220405
EC12E1240405
EC12E1240406
EC12E1220301
EC12E1240301
EC12E24204A2
EC12E24204A8
EC12E24204A9
EC12E2420301
EC12E24404A8
EC12E24404A6
EC12E2440301
EC12E2430404
EC12E2430401
With High Collar Type
Without ――
Push-on
switch
Travel of push-on
switch(mm)
Operating
direction
12
24
8.5
(Hollow shaft)
8.5
(Hollow shaft)
12mm Size Insulated Shaft Type Encoder Variety
EC12E Series
Lead FreeIncremental
Type
Absolute
Type
187
Power
Push
Slide
Rotary
Encoders
Jog
Shuttle
Telephone
-hook
Detector
Vibration/
Tilt Sensors
Dual-in-line
Package Type
Multi Control
Devices
TACT
5 7
3.5 15
2 3.5 surface
Mounting
ø6.6
(0.6)
(0.8)
12.4
(8.2)
14
(10.2)
13.2
4.5
ø6
3.5 LM1
5 (5) R1
(0.8)
2 3.5
ø6.8 4.5
ø6
Mounting surface
14
12.4
(8.2)
(10.2)
13.2
Products Line
With Switch Type
Products
No.
Drawing
No.
Number
of detent Resolution Length of operating
section (mm)
Vertical Without ―― 4
12
24
20
25
20
25
Standard
3 to 20 mN・m
Standard
25±15 mN・m
12
24
Without
EC12E1220801
EC12E2420802
EC12E2420801
EC12E2430804
EC12E2430803
Push-on
switch
Travel of push-on
switch(mm)
Operating
direction
Vertical 5
12
24
Standard
3 to 20 mN・m
Lightest(jog)
3±2 mN・m
Standard
3 to 20 mN・m
Lightest(jog)
3±2 mN・m
With 0.5
12
24
20
25
20
25
20
25
20
25
EC12E12244A3
EC12E12244A4
EC12E1244401
EC12E1244403
EC12E2424407
EC12E2424404
EC12E2444400
EC12E24444A3
Detent
torque
950
Minimum packing
unit (pcs.)
1,200
Minimum packing
unit (pcs.)
Products
No.
Drawing
No.
Number
of detent Resolution Length of operating
section (mm)
Push-on
switch
Travel of push-on
switch(mm) Operating
direction
Detent
torque
No nuts or washers attached. If necessary, contact us.
Note
For other products, check varieties on P.189
For other detailed specifications, see P.190
Dimensions
7.5
5
2.1
2 2
13.2
A C B
3-ø1 hole
13.2 2 2
7.5
2.1
5 A CB 3-ø1 hole
Model Style
Short shaft
No.
1
2
LM1 R1
20 7
25 12
PC board mounting hole
dimensions
(Viewed from mounting face)
Unit : mm
With Bushing Type
12mm Size Insulated Shaft Type Encoder Variety EC12E SeriesIncremental
Type
Absolute
Type
188
Power
Push
Slide
Rotary
Encoders
Jog
Shuttle
Telephone
-hook
Detector
Vibration/
Tilt Sensors
Dual-in-line
Package Type
Multi Control
Devices
TACT
Dimensions Unit : mm
LM1 R1
20 7
25 12
3.5 8.5
5
1.2 2.65
(0.6)
2
ø6
3.5
(0.8)
ø6.6
Mounting surface
14
12.4
(8.2)
ø3.1
5
(10.2)
5.2
13.2
2.1
13.2
2 2
7.5
2.1
5 A CB 3-ø1 hole
Model Style
Hollow shaft
No.
3
PC board mounting hole
dimensions
(Viewed from mounting face)
12.4
(8.2)
14
2
Mounting
surface 3.5 M9x0.75
7
3.5
5.5
LM1
4.5
ø6
(10.2)
13.2
8
1
R1
13.2
2
3-ø1
2
2.1
5
A C B
7.5
hole
With bushing
4
2.5
0.4
7
X X
Y
Locating lug detail
Y
LM1 R1
20 7
25 12
3.5 LM1
6 (5) R1
0.5
(0.8)
2
3.5
ø6.8
Switch
travel
Mounting surface
14
12.4
(8.2)
(10.2)
13.2
4.5
ø6
13.2 2 2
A C B
5
7 7.5
2.1
5-ø1 hole
With push-on switch
5
12mm Size Insulated Shaft Type Encoder Variety EC12E SeriesIncremental
Type
Absolute
Type
189
Power
Push
Slide
Rotary
Encoders
Jog
Shuttle
Telephone
-hook
Detector
Vibration/
Tilt Sensors
Dual-in-line
Package Type
Multi Control
Devices
TACT
Variety
Shaft Dimensions
Flat Type Unit : mm
With high collar type
LM1
R1
4.5
0.5
ø6
LM1 R1
17.5
20
22.5
25
5
7
7
12
30 12
3.5
4.5
ø6
1
3.5
2
5.5 LB
LM1
Mounting surface
R1
With bushing type
LM1 R1
20
25
30
35
LB
7
7
12
12
7
12
12
12
Vertical type
Detail dimensions
Except 12 detent.
Detail dimensions
12mm Size Insulated Shaft Encoders
PIC24FJ256GB110 Family
Data Sheet
64/80/100-Pin,
16-Bit Flash Microcontrollers
with USB On-The-Go (OTG)
DS39897C-page 2 2009 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2009 Microchip Technology Inc. DS39897C-page 3
PIC24FJ256GB110 FAMILY
Power Management:
• On-Chip 2.5V Voltage Regulator
• Switch between Clock Sources in Real Time
• Idle, Sleep and Doze modes with Fast Wake-up and
Two-Speed Start-up
• Run mode: 1 mA/MIPS, 2.0V Typical
• Sleep mode Current Down to 100 nA Typical
• Standby Current with 32 kHz Oscillator: 2.5 A,
2.0V typical
Universal Serial Bus Features:
• USB v2.0 On-The-Go (OTG) Compliant
• Dual Role Capable – can act as either Host or Peripheral
• Low-Speed (1.5 Mb/s) and Full-Speed (12 Mb/s) USB
Operation in Host mode
• Full-Speed USB Operation in Device mode
• High-Precision PLL for USB
• Internal Voltage Boost Assist for USB Bus Voltage
Generation
• Interface for Off-Chip Charge Pump for USB Bus
Voltage Generation
• Supports up to 32 Endpoints (16 bidirectional):
- USB Module can use any RAM location on the
device as USB endpoint buffers
• On-Chip USB Transceiver with On-Chip Voltage Regulator
• Interface for Off-Chip USB Transceiver
• Supports Control, Interrupt, Isochronous and Bulk Transfers
• On-Chip Pull-up and Pull-Down Resistors
High-Performance CPU:
• Modified Harvard Architecture
• Up to 16 MIPS Operation at 32 MHz
• 8 MHz Internal Oscillator
• 17-Bit x 17-Bit Single-Cycle Hardware Multiplier
• 32-Bit by 16-Bit Hardware Divider
• 16 x 16-Bit Working Register Array
• C Compiler Optimized Instruction Set Architecture with
Flexible Addressing modes
• Linear Program Memory Addressing, Up to 12 Mbytes
• Linear Data Memory Addressing, Up to 64 Kbytes
• Two Address Generation Units for Separate Read and
Write Addressing of Data Memory
Analog Features:
• 10-Bit, Up to 16-Channel Analog-to-Digital (A/D)
Converter at 500 ksps:
- Conversions available in Sleep mode
• Three Analog Comparators with Programmable Input/
Output Configuration
• Charge Time Measurement Unit (CTMU)
Device
Pins
Program
Memory (Bytes)
SRAM (Bytes)
Remappable Peripherals
I2C™
10-Bit A/D (ch)
Comparators
PMP/PSP
JTAG
CTMU
USBOTG
Remappable
Pins
Timers 16-Bit
Capture Input
Compare/
PWM Output
UART w/IrDA®
SPI
PIC24FJ64GB106 64 64K 16K 29 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ128GB106 64 128K 16K 29 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ192GB106 64 192K 16K 29 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ256GB106 64 256K 16K 29 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ64GB108 80 64K 16K 40 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ128GB108 80 128K 16K 40 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ192GB108 80 192K 16K 40 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ256GB108 80 256K 16K 40 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ64GB110 100 64K 16K 44 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ128GB110 100 128K 16K 44 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ192GB110 100 192K 16K 44 5 9 9 4 3 3 16 3 Y Y Y Y
PIC24FJ256GB110 100 256K 16K 44 5 9 9 4 3 3 16 3 Y Y Y Y
64/80/100-Pin, 16-Bit Flash Microcontrollers
with USB On-The-Go (OTG)
PIC24FJ256GB110 FAMILY
DS39897C-page 4 2009 Microchip Technology Inc.
Peripheral Features:
• Peripheral Pin Select (PPS):
- Allows independent I/O mapping of many
peripherals at run time
- Continuous hardware integrity checking and safety
interlocks prevent unintentional configuration
changes
- Up to 44 available pins (100-pin devices)
• Three 3-Wire/4-Wire SPI modules (supports
4 Frame modes) with 8-Level FIFO Buffer
• Three I2C™ modules support Multi-Master/Slave modes
and 7-Bit/10-Bit Addressing
• Four UART modules:
- Supports RS-485, RS-232, LIN/J2602 protocols
and IrDA®
- On-chip hardware encoder/decoder for IrDA
- Auto-wake-up and Auto-Baud Detect (ABD)
- 4-level deep FIFO buffer
• Five 16-Bit Timers/Counters with Programmable
Prescaler
• Nine 16-Bit Capture Inputs, each with a
Dedicated Time Base
• Nine 16-Bit Compare/PWM Outputs, each with a
Dedicated Time Base
• 8-Bit Parallel Master Port (PMP/PSP):
- Up to 16 address pins
- Programmable polarity on control lines
• Hardware Real-Time Clock/Calendar (RTCC):
- Provides clock, calendar and alarm functions
• Programmable Cyclic Redundancy Check (CRC)
Generator
• Up to 5 External Interrupt Sources
Special Microcontroller Features:
• Operating Voltage Range of 2.0V to 3.6V
• Self-Reprogrammable under Software Control
• 5.5V Tolerant Input (digital pins only)
• Configurable Open-Drain Outputs on Digital I/O
• High-Current Sink/Source (18 mA/18 mA) on all I/O
• Selectable Power Management modes:
- Sleep, Idle and Doze modes with fast wake-up
• Fail-Safe Clock Monitor Operation:
- Detects clock failure and switches to on-chip,
Low-Power RC Oscillator
• On-Chip LDO Regulator
• Power-on Reset (POR), Power-up Timer (PWRT),
Low-Voltage Detect (LVD) and Oscillator Start-up
Timer (OST)
• Flexible Watchdog Timer (WDT) with On-Chip.
Low-Power RC Oscillator for Reliable Operation
• In-Circuit Serial Programming™ (ICSP™) and
In-Circuit Debug (ICD) via 2 Pins
• JTAG Boundary Scan and Programming Support
• Brown-out Reset (BOR)
• Flash Program Memory:
- 10,000 erase/write cycle endurance (minimum)
- 20-year data retention minimum
- Selectable write protection boundary
- Write protection option for Flash Configuration
Words
2009 Microchip Technology Inc. DS39897C-page 5
PIC24FJ256GB110 FAMILY
Pin Diagram (64-Pin TQFP and QFN)
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
22
44
24
25
26
27
28
29
30
31
32
PIC24FJ64GB106
1
46
45
23
43
42
41
40
39
C3INB/CN15/RD6
RP20/PMRD/CN14/RD5
RP25/PMWR/CN13/RD4
RP22/PMBE/CN52/RD3
DPH/RP23/CN51/RD2
VCPCON/RP24/CN50/RD1
PMD4/CN62/RE4
PMD3/CN61/RE3
PMD2/CN60/RE2
PMD1/CN59/RE1
VBUSST/VCMPST1/CN68/RF0
VCAP/VDDCORE
SOSCI/C3IND/CN1/RC13
DMH/RP11/INT0/CN49/RD0
SCL1/RP3/PMCS2/CN55/RD10
DPLN/SDA1/RP4/CN54/RD9
RTCC/DMLN/RP2/CN53/RD8
RP12/PMCS1/CN56/RD11
OSCO/CLKO/CN22/RC15
OSCI/CLKI/CN23/RC12
VDD
D+/RG2
VUSB
VBUS
RP16/USBID/CN71/RF3
D-/RG3
SOSCO/T1CK/C3INC/RPI37/
AVDD
AN8/RP8/CN26/RB8
AN9/RP9/PMA7/CN27/RB9
TMS/CVREF/AN10/PMA13/CN28/RB10
TDO/AN11/PMA12/CN29/RB11
VDD
PGEC2/AN6/RP6/CN24/RB6
PGED2/AN7/RP7/RCV/CN25/RB7
SCL2/RP17/PMA8/CN18/RF5
SDA2/RP10/PMA9/CN17/RF4
PMD5/CN63/RE5
SCL3/PMD6/CN64/RE6
SDA3/PMD7/CN65/RE7
C1IND/RP21/PMA5/CN8/RG6
VDD
PGEC3/AN5/C1INA/VBUSON/RP18/CN7/RB5
PGED3/AN4/C1INB/USBOEN/RP28/CN6/RB4
AN3/C2INA/VPIO/CN5/RB3
AN2/C2INB/VMIO/RP13/CN4/RB2
C1INC/RP26/PMA4/CN9/RG7
C2IND/RP19/PMA3/CN10/RG8
PGEC1/AN1/VREF-/RP1/CN3/RB1
PGED1/AN0/VREF+/RP0/PMA6/CN2/RB0
RP27/PMA2/C2INC/CN11/RG9
MCLR
TCK/AN12/PMA11/CTED2/CN30/RB12
TDI/AN13/PMA10/CTED1/CN31/RB13
AN14/CTPLS/RP14/PMA1/CN32/RB14
AN15/RP29/REFO/PMA0/CN12/RB15
PMD0/CN58/RE0
VCMPST2/CN69/RF1
C3INA/CN16/RD7
VSS
VSS
VSS
ENVREG
63
62
61
59
60
58
57
56
54
55
53
52
51
49
50
38
37
34
36
35
33
17
19
20
21
18
AVSS
64
CN0/RC14
PIC24FJ128GB106
PIC24FJ192GB106
PIC24FJ256GB106
Legend: Shaded pins indicate pins tolerant to up to +5.5 VDC.
RPn represents remappable pins for the Peripheral Pin Select feature.
Note 1: For QFN devices, the backplane on the underside of the device must also be connected to VSS.
PIC24FJ256GB110 FAMILY
DS39897C-page 6 2009 Microchip Technology Inc.
Pin Diagram (80-Pin TQFP)
80
79
78
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
60
59
26
56
40
39
28
29
30
31
32
33
34
35
36
37
38
PIC24FJ64GB108
17
18
19
1
76
77
58
57
27
55
54
53
52
51
RP20/PMRD/CN14/RD5
RP25/PMWR/CN13/RD4
CN19/RD13
RPI42/CN57/RD12
RP22/PMBE/CN52/RD3
DPH/RP23/CN51/RD2
VCPCON/RP24/CN50/RD1
PMD2/CN60/RE2
PMD1/CN59/RE1
PMD0/CN58/RE0
CN77/RG0
PMD4/CN62/RE4
PMD3/CN61/RE3
VBUSST/VCMPST1/CN68/RF0
VCAP/VDDCORE
SOSCI/C3IND/CN1/RC13
DMH/RP11/INT0/CN49/RD0
SCL1/RP3/PMCS2/CN55/RD10
SDA1/DPLN/RP4/CN54/RD9
DMLN/RTCC/RP2/CN53/RD8
RP12/PMCS1/CN56/RD11
SDA2/RPI35/CN44/RA15
SCL2/RPI36/CN43/RA14
OSCO/CLKO/CN22/RC15
OSCI/CLKI/CN23/RC12
VDD
D+/RG2
VUSB
VBUS
RP15/CN74/RF8
D-/RG3
RP30/CN70/RF2
RP16/USBID/CN71/RF3
SOSCO/T1CK/C3INC/RPI37/CN0/RC14
VREF+/PMA6/CN42/RA10
VREF-/PMA7/CN41/RA9
AVDD
AN8/RP8/CN26/RB8
AN9/RP9/CN27/RB9
AN10/CVREF/PMA13/CN28/RB10
AN11/PMA12/CN29/RB11
VDD
RPI43/CN20/RD14
RP5/CN21/RD15
PGEC2/AN6/RP6/CN24/RB6
PGED2/AN7/RP7/RCV/CN25/RB7
RP17/PMA8/CN18/RF5
RP10/PMA9/CN17/RF4
PMD5/CN63/RE5
SCL3/PMD6/CN64/RE6
SDA3/PMD7/CN65/RE7
RPI38/CN45/RC1
RPI40/CN47/RC3
PMA5/RP21/C1IND/CN8/RG6
VDD
TMS/RPI33/CN66/RE8
TDO/RPI34/CN67/RE9
AN3/C2INA/VPIO/CN5/RB3
AN2/C2INB/VMIO/RP13/CN4/RB2
C1INC/RP26/PMA4/CN9/RG7
C2IND/RP19/PMA3/CN10/RG8
PGEC1/AN1/RP1/CN3/RB1
PGED1/AN0/RP0/CN2/RB0
C2INC/RP27/PMA2/CN11/RG9
MCLR
TCK/AN12/PMA11/CTED2/CN30/RB12
TDI/AN13/PMA10/CTED1/CN31/RB13
AN14/CTPLS/RP14/PMA1/CN32/RB14
AN15/REFO/RP29/PMA0/ACN12/RB15
CN78/RG1
VCMPST2/CN69/RF1
C3INA/CN16/RD7
C3INB/CN15/RD6
VSS
Vss
VSS
ENVREG
75
74
73
71
72
70
69
68
66
67
65
64
63
61
62
50
49
46
48
47
45
44
43
42
41
21
23
24
25
22
AVSS
PGEC3/AN5/C1INA/VBUSON/RP18/CN7/RB5
PGED3/AN4/C1INB/USBOEN/RP28/CN6/RB4
Legend: Shaded pins indicate pins tolerant to up to +5.5 VDC.
RPn represents remappable pins for the Peripheral Pin Select feature.
PIC24FJ128GB108
PIC24FJ192GB108
PIC24FJ256GB108
2009 Microchip Technology Inc. DS39897C-page 7
PIC24FJ256GB110 FAMILY
Pin Diagram (100-Pin TQFP)
92
94
93
91
90
89
88
87
86
85
84
83
82
81
80
79
78
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
65
64
63
62
61
60
59
26
56
45
44
43
42
41
40
39
28
29
30
31
32
33
34
35
36
37
38
PIC24FJ64GB110
17
18
19
21
22
95
1
76
77
72
71
70
69
68
67
66
75
74
73
58
57
24
23
25
96
98
97
99
27
46
47
48
49
50
55
54
53
52
51
100
RP20/PMRD/CN14/RD5
RP25/PMWR/CN13/RD4
CN19/RD13
RPI42/CN57/RD12
RP22/PMBE/CN52/RD3
DPH/RP23/CN51/RD2
VCPCON/RP24/CN50/RD1
CN40/RA7
CN39/RA6
PMD2/CN60/RE2
CN80/RG13
CN79/RG12
CN81/RG14
PMD1/CN59/RE1
PMD0/CN58/RE0
CN77/RG0
PMD4/CN62/RE4
PMD3/CN61/RE3
VBUSST/VCMPST1/CN68/RF0
VCAP/VDDCORE
SOSCI/C3IND/CN1/RC13
DMH/RP11/INT0/CN49/RD0
RP3/PMCS2/CN55/RD10
DPLN/RP4/CN54/RD9
DMLN/RTCC/RP2/CN53/RD8
RP12/PMCS1/CN56/RD11
SDA1/RPI35/CN44/RA15
SCL1/RPI36/CN43/RA14
OSCO/CLKO/CN22/RC15
OSCI/CLKI/CN23/RC12
VDD
D+/RG2
VUSB
VBUS
RP15/CN74/RF8
D-/RG3
RP30/CN70/RF2
RP16/USBID/CN71/RF3
VSS
SOSCO/T1CK/C3INC/RPI37/
VREF+/PMA6/CN42/RA10
VREF-/PMA7/CN41/RA9
AVDD
AVSS
AN8/RP8/CN26/RB8
AN9/RP9/CN27/RB9
AN10/CVREF/PMA13/CN28/RB10
AN11/PMA12/CN29/RB11
VDD
RPI32/CN75/RF12
RP31/CN76/RF13
VSS
VDD
RP5/CN21/RD15
RPI43/CN20/RD14
PGEC2/AN6/RP6/CN24/RB6
PGED2/AN7/RP7/RCV/CN25/RB7
RP17/PMA8/CN18/RF5
RP10/PMA9/CN17/RF4
PMD5/CN63/RE5
SCL3/PMD6/CN64/RE6
SDA3/PMD7/CN65/RE7
RPI38/CN45/RC1
RPI39/CN46/RC2
RPI40/CN47/RC3
RPI41/CN48/RC4
C1IND/RP21/PMA5/CN8/RG6
VDD
TMS/CN33/RA0
RPI33/CN66/RE8
RPI34/CN67/RE9
PGEC3/AN5/C1INA/VBUSON/RP18/CN7/RB5
AN3/C2INA/VPIO/CN5/RB3
AN2/C2INB/VMIO/RP13/CN4/RB2
C1INC/RP26/PMA4/CN9/RG7
C2IND/RP19/PMA3/CN10/RG8
PGEC1/AN1/RP1/CN3/RB1
PGED1/AN0/RP0/CN2/RB0
CN82/RG15
VDD
C2INC/RP27/PMA2/CN11/RG9
MCLR
AN12/PMA11/CTED2/CN30/RB12
AN13/PMA10/CTED1/CN31/RB13
AN14/CTPLS/RP14/PMA1/CN32/RB14
AN15/REFO/RP29/PMA0/CN12/RB15
CN78/RG1
VCMPST2/CN69/RF1
C3INA/CN16/RD7
C3INB/CN15/RD6
TDO/CN38/RA5
SDA2/CN36/RA3
SCL2/CN35/RA2
VSS
VSS
VSS
ENVREG
TDI/CN37/RA4
TCK/CN34/RA1
PGED3/AN4/C1INB/USBOEN/RP28/CN6/RB4
Legend: Shaded pins indicate pins tolerant to up to +5.5 VDC.
RPn and RPIn represent remappable pins for the Peripheral Pin Select features.
CN0/RC14
PIC24FJ128GB110
PIC24FJ192GB110
PIC24FJ256GB110
PIC24FJ256GB110 FAMILY
DS39897C-page 8 2009 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 11
2.0 Guidelines for Getting Started with 16-bit Microcontrollers ........................................................................................................ 27
3.0 CPU ........................................................................................................................................................................................... 33
4.0 Memory Organization ................................................................................................................................................................. 39
5.0 Flash Program Memory.............................................................................................................................................................. 63
6.0 Resets ........................................................................................................................................................................................ 71
7.0 Interrupt Controller ..................................................................................................................................................................... 77
8.0 Oscillator Configuration ............................................................................................................................................................ 121
9.0 Power-Saving Features............................................................................................................................................................ 131
10.0 I/O Ports ................................................................................................................................................................................... 133
11.0 Timer1 ...................................................................................................................................................................................... 161
12.0 Timer2/3 and Timer4/5 ............................................................................................................................................................ 163
13.0 Input Capture with Dedicated Timers ....................................................................................................................................... 169
14.0 Output Compare with Dedicated Timers .................................................................................................................................. 173
15.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 181
16.0 Inter-Integrated Circuit (I2C™) ................................................................................................................................................. 191
17.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 199
18.0 Universal Serial Bus with On-The-Go Support (USB OTG) ..................................................................................................... 207
19.0 Parallel Master Port (PMP)....................................................................................................................................................... 241
20.0 Real-Time Clock and Calendar (RTCC) .................................................................................................................................. 251
21.0 Programmable Cyclic Redundancy Check (CRC) Generator .................................................................................................. 263
22.0 10-Bit High-Speed A/D Converter ............................................................................................................................................ 267
23.0 Triple Comparator Module........................................................................................................................................................ 277
24.0 Comparator Voltage Reference................................................................................................................................................ 281
25.0 Charge Time Measurement Unit (CTMU) ................................................................................................................................ 283
26.0 Special Features ...................................................................................................................................................................... 287
27.0 Development Support............................................................................................................................................................... 299
28.0 Instruction Set Summary .......................................................................................................................................................... 303
29.0 Electrical Characteristics .......................................................................................................................................................... 311
30.0 Packaging Information.............................................................................................................................................................. 327
Appendix A: Revision History............................................................................................................................................................. 341
Index ................................................................................................................................................................................................. 343
The Microchip Web Site ..................................................................................................................................................................... 349
Customer Change Notification Service .............................................................................................................................................. 349
Customer Support .............................................................................................................................................................................. 349
Reader Response .............................................................................................................................................................................. 350
Product Identification System............................................................................................................................................................. 351
2009 Microchip Technology Inc. DS39897C-page 9
PIC24FJ256GB110 FAMILY
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
PIC24FJ256GB110 FAMILY
DS39897C-page 10 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 11
PIC24FJ256GB110 FAMILY
1.0 DEVICE OVERVIEW
This document contains device-specific information for
the following devices:
This expands on the existing line of Microchip‘s 16-bit
microcontrollers, combining an expanded peripheral
feature set and enhanced computational performance
with a new connectivity option: USB On-The-Go. The
PIC24FJ256GB110 family provides a new platform for
high-performance USB applications, which may need
more than an 8-bit platform, but don’t require the power
of a digital signal processor.
1.1 Core Features
1.1.1 16-BIT ARCHITECTURE
Central to all PIC24F devices is the 16-bit modified
Harvard architecture, first introduced with Microchip’s
dsPIC® digital signal controllers. The PIC24F CPU core
offers a wide range of enhancements, such as:
• 16-bit data and 24-bit address paths with the
ability to move information between data and
memory spaces
• Linear addressing of up to 12 Mbytes (program
space) and 64 Kbytes (data)
• A 16-element working register array with built-in
software stack support
• A 17 x 17 hardware multiplier with support for
integer math
• Hardware support for 32 by 16-bit division
• An instruction set that supports multiple
addressing modes and is optimized for high-level
languages such as ‘C’
• Operational performance up to 16 MIPS
1.1.2 POWER-SAVING TECHNOLOGY
All of the devices in the PIC24FJ256GB110 family
incorporate a range of features that can significantly
reduce power consumption during operation. Key
items include:
• On-the-Fly Clock Switching: The device clock
can be changed under software control to the
Timer1 source or the internal, Low-Power RC
Oscillator during operation, allowing the user to
incorporate power-saving ideas into their software
designs.
• Doze Mode Operation: When timing-sensitive
applications, such as serial communications,
require the uninterrupted operation of peripherals,
the CPU clock speed can be selectively reduced,
allowing incremental power savings without
missing a beat.
• Instruction-Based Power-Saving Modes: The
microcontroller can suspend all operations, or
selectively shut down its core while leaving its
peripherals active, with a single instruction in
software.
1.1.3 OSCILLATOR OPTIONS AND
FEATURES
All of the devices in the PIC24FJ256GB110 family offer
five different oscillator options, allowing users a range
of choices in developing application hardware. These
include:
• Two Crystal modes using crystals or ceramic
resonators.
• Two External Clock modes offering the option of a
divide-by-2 clock output.
• A Fast Internal Oscillator (FRC) with a nominal
8 MHz output, which can also be divided under
software control to provide clock speeds as low as
31 kHz.
• A Phase Lock Loop (PLL) frequency multiplier,
available to the external oscillator modes and the
FRC Oscillator, which allows clock speeds of up
to 32 MHz.
• A separate internal RC Oscillator (LPRC) with a
fixed 31 kHz output, which provides a low-power
option for timing-insensitive applications.
The internal oscillator block also provides a stable
reference source for the Fail-Safe Clock Monitor. This
option constantly monitors the main clock source
against a reference signal provided by the internal
oscillator and enables the controller to switch to the
internal oscillator, allowing for continued low-speed
operation or a safe application shutdown.
1.1.4 EASY MIGRATION
Regardless of the memory size, all devices share the
same rich set of peripherals, allowing for a smooth
migration path as applications grow and evolve. The
consistent pinout scheme used throughout the entire
family also aids in migrating from one device to the next
larger, or even in jumping from 64-pin to 100-pin
devices.
The PIC24F family is pin-compatible with devices in the
dsPIC33 family, and shares some compatibility with the
pinout schema for PIC18 and dsPIC30. This extends
the ability of applications to grow from the relatively
simple, to the powerful and complex, yet still selecting
a Microchip device.
• PIC24FJ64GB106 • PIC24FJ192GB108
• PIC24FJ128GB106 • PIC24FJ256GB108
• PIC24FJ192GB106 • PIC24FJ64GB110
• PIC24FJ256GB106 • PIC24FJ128GB110
• PIC24FJ64GB108 • PIC24FJ192GB110
• PIC24FJ128GB108 • PIC24FJ256GB110
PIC24FJ256GB110 FAMILY
DS39897C-page 12 2009 Microchip Technology Inc.
1.2 USB On-The-Go
With the PIC24FJ256GB110 family of devices,
Microchip introduces USB On-The-Go functionality on
a single chip to its product line. This new module
provides on-chip functionality as a target device compatible
with the USB 2.0 standard, as well as limited
stand-alone functionality as a USB embedded host. By
implementing USB Host Negotiation Protocol (HNP),
the module can also dynamically switch between
device and host operation, allowing for a much wider
range of versatile USB-enabled applications on a
microcontroller platform.
In addition to USB host functionality, PIC24FJ256GB110
family devices provide a true single-chip USB solution,
including an on-chip transceiver and voltage regulator,
and a voltage boost generator for sourcing bus power
during host operations.
1.3 Other Special Features
• Peripheral Pin Select: The Peripheral Pin Select
(PPS) feature allows most digital peripherals to be
mapped over a fixed set of digital I/O pins. Users
may independently map the input and/or output of
any one of the many digital peripherals to any one
of the I/O pins.
• Communications: The PIC24FJ256GB110 family
incorporates a range of serial communication
peripherals to handle a range of application
requirements. There are three independent I2C
modules that support both Master and Slave
modes of operation. Devices also have, through
the Peripheral Pin Select feature, four independent
UARTs with built-in IrDA encoder/decoders and
three SPI modules.
• Analog Features: All members of the
PIC24FJ256GB110 family include a 10-bit A/D
Converter module and a triple comparator
module. The A/D module incorporates programmable
acquisition time, allowing for a channel to
be selected and a conversion to be initiated
without waiting for a sampling period, as well as
faster sampling speeds. The comparator module
includes three analog comparators that are
configurable for a wide range of operations.
• CTMU Interface: In addition to their other analog
features, members of the PIC24FJ256GB110
family include the brand new CTMU interface
module. This provides a convenient method for
precision time measurement and pulse generation,
and can serve as an interface for capacitive
sensors.
• Parallel Master/Enhanced Parallel Slave Port:
One of the general purpose I/O ports can be
reconfigured for enhanced parallel data communications.
In this mode, the port can be configured
for both master and slave operations, and
supports 8-bit and 16-bit data transfers with up to
16 external address lines in Master modes.
• Real-Time Clock/Calendar: This module
implements a full-featured clock and calendar with
alarm functions in hardware, freeing up timer
resources and program memory space for use of
the core application.
1.4 Details on Individual Family
Members
Devices in the PIC24FJ256GB110 family are available
in 64-pin, 80-pin and 100-pin packages. The general
block diagram for all devices is shown in Figure 1-1.
The devices are differentiated from each other in four
ways:
1. Flash program memory (64 Kbytes for
PIC24FJ64GB1 devices, 128 Kbytes for
PIC24FJ128GB1 devices, 192 Kbytes for
PIC24FJ192GB1 devices and 256 Kbytes for
PIC24FJ256GB1 devices).
2. Available I/O pins and ports (51 pins on 6 ports
for 64-pin devices, 65 pins on 7 ports for 80-pin
devices and 83 pins on 7 ports for 100-pin
devices).
3. Available Interrupt-on-Change Notification (ICN)
inputs (49 on 64-pin devices, 63 on 80-pin
devices and 81 on 100-pin devices).
4. Available remappable pins (29 pins on 64-pin
devices, 40 pins on 80-pin devices and 44 pins
on 100-pin devices)
All other features for devices in this family are identical.
These are summarized in Table 1-1.
A list of the pin features available on the
PIC24FJ256GB110 family devices, sorted by function,
is shown in Table 1-4. Note that this table shows the pin
location of individual peripheral features and not how
they are multiplexed on the same pin. This information
is provided in the pinout diagrams in the beginning of
the data sheet. Multiplexed features are sorted by the
priority given to a feature, with the highest priority
peripheral being listed first.
2009 Microchip Technology Inc. DS39897C-page 13
PIC24FJ256GB110 FAMILY
TABLE 1-1: DEVICE FEATURES FOR THE PIC24FJ256GB110 FAMILY: 64-PIN DEVICES
Features 64GB106 128GB106 192GB106 256GB106
Operating Frequency DC – 32 MHz
Program Memory (bytes) 64K 128K 192K 256K
Program Memory (instructions) 22,016 44,032 67,072 87,552
Data Memory (bytes) 16,384
Interrupt Sources (soft vectors/NMI traps) 66 (62/4)
I/O Ports Ports B, C, D, E, F, G
Total I/O Pins 51
Remappable Pins 29 (28 I/O, 1 Input only)
Timers:
Total Number (16-bit) 5(1)
32-Bit (from paired 16-bit timers) 2
Input Capture Channels 9(1)
Output Compare/PWM Channels 9(1)
Input Change Notification Interrupt 49
Serial Communications:
UART 4(1)
SPI (3-wire/4-wire) 3(1)
I2C™ 3
Parallel Communications (PMP/PSP) Yes
JTAG Boundary Scan/Programming Yes
10-Bit Analog-to-Digital Module
(input channels)
16
Analog Comparators 3
CTMU Interface Yes
Resets (and delays) POR, BOR, RESET Instruction, MCLR, WDT; Illegal Opcode,
REPEAT Instruction, Hardware Traps, Configuration Word Mismatch
(PWRT, OST, PLL Lock)
Instruction Set 76 Base Instructions, Multiple Addressing Mode Variations
Packages 64-Pin TQFP
Note 1: Peripherals are accessible through remappable pins.
PIC24FJ256GB110 FAMILY
DS39897C-page 14 2009 Microchip Technology Inc.
TABLE 1-2: DEVICE FEATURES FOR THE PIC24FJ256GB110 FAMILY: 80-PIN DEVICES
Features 64GB108 128GB108 192GB108 256GB108
Operating Frequency DC – 32 MHz
Program Memory (bytes) 64K 128K 192K 256K
Program Memory (instructions) 22,016 44,032 67,072 87,552
Data Memory (bytes) 16,384
Interrupt Sources (soft vectors/NMI traps) 66 (62/4)
I/O Ports Ports A, B, C, D, E, F, G
Total I/O Pins 65
Remappable Pins 40 (31 I/O, 9 Input only)
Timers:
Total Number (16-bit) 5(1)
32-Bit (from paired 16-bit timers) 2
Input Capture Channels 9(1)
Output Compare/PWM Channels 9(1)
Input Change Notification Interrupt 63
Serial Communications:
UART 4(1)
SPI (3-wire/4-wire) 3(1)
I2C™ 3
Parallel Communications (PMP/PSP) Yes
JTAG Boundary Scan/Programming Yes
10-Bit Analog-to-Digital Module
(input channels)
16
Analog Comparators 3
CTMU Interface Yes
Resets (and delays) POR, BOR, RESET Instruction, MCLR, WDT; Illegal Opcode,
REPEAT Instruction, Hardware Traps, Configuration Word Mismatch
(PWRT, OST, PLL Lock)
Instruction Set 76 Base Instructions, Multiple Addressing Mode Variations
Packages 80-Pin TQFP
Note 1: Peripherals are accessible through remappable pins.
2009 Microchip Technology Inc. DS39897C-page 15
PIC24FJ256GB110 FAMILY
TABLE 1-3: DEVICE FEATURES FOR THE PIC24FJ256GB110 FAMILY: 100-PIN DEVICES
Features 64GB110 128GB110 192GB110 256GB110
Operating Frequency DC – 32 MHz
Program Memory (bytes) 64K 128K 192K 256K
Program Memory (instructions) 22,016 44,032 67,072 87,552
Data Memory (bytes) 16,384
Interrupt Sources (soft vectors/NMI traps) 66 (62/4)
I/O Ports Ports A, B, C, D, E, F, G
Total I/O Pins 83
Remappable Pins 44 (32 I/O, 12 Input only)
Timers:
Total Number (16-bit) 5(1)
32-Bit (from paired 16-bit timers) 2
Input Capture Channels 9(1)
Output Compare/PWM Channels 9(1)
Input Change Notification Interrupt 81
Serial Communications:
UART 4(1)
SPI (3-wire/4-wire) 3(1)
I2C™ 3
Parallel Communications (PMP/PSP) Yes
JTAG Boundary Scan/Programming Yes
10-Bit Analog-to-Digital Module
(input channels)
16
Analog Comparators 3
CTMU Interface Yes
Resets (and delays) POR, BOR, RESET Instruction, MCLR, WDT; Illegal Opcode,
REPEAT Instruction, Hardware Traps, Configuration Word Mismatch
(PWRT, OST, PLL Lock)
Instruction Set 76 Base Instructions, Multiple Addressing Mode Variations
Packages 100-Pin TQFP
Note 1: Peripherals are accessible through remappable pins.
PIC24FJ256GB110 FAMILY
DS39897C-page 16 2009 Microchip Technology Inc.
FIGURE 1-1: PIC24FJ256GB110 FAMILY GENERAL BLOCK DIAGRAM
Instruction
Decode &
Control
16
PCH PCL
16
Program Counter
16-Bit ALU
23
24
Data Bus
Inst Register
16
Divide
Support
Inst Latch
16
EA MUX
Read AGU
Write AGU
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Block
Stack
Control
Logic
Repeat
Control
Logic
Data Latch
Data RAM
Address
Latch
Address Latch
Program Memory
Data Latch
16
Address Bus
Literal Data
23
Control Signals
16
16
16 x 16
W Reg Array
Multiplier
OSCI/CLKI 17x17
OSCO/CLKO
VDD,
Timing
Generation
VSS MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
BOR and
Precision
Reference
Band Gap
FRC/LPRC
Oscillators
Regulator
Voltage
VDDCORE/VCAP
ENVREG
PORTA(1)
PORTC(1)
(13 I/O)
(8 I/O)
PORTB
(16 I/O)
Note 1: Not all I/O pins or features are implemented on all device pinout configurations. See Table 1-4 for specific implementations by pin count.
2: BOR functionality is provided when the on-board voltage regulator is enabled.
3: These peripheral I/Os are only accessible through remappable pins.
PORTD(1)
(16 I/O)
Timer1 Timer2/3(3) RTCC Comparators(3)
IC
ADC
10-Bit
PWM/OC SPI I2C
Timer4/5(3)
PMP/PSP
1-9(3) ICNs(1) UART
LVD(2)
REFO
PORTE(1)
PORTG(1)
(10 I/O)
(12 I/O)
PORTF(1)
(9 I/O)
1-9(3) 1/2/3(3) 1/2/3 1/2/3/4(3) CTMU
USB OTG
2009 Microchip Technology Inc. DS39897C-page 17
PIC24FJ256GB110 FAMILY
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
AN0 16 20 25 I ANA A/D Analog Inputs.
AN1 15 19 24 I ANA
AN2 14 18 23 I ANA
AN3 13 17 22 I ANA
AN4 12 16 21 I ANA
AN5 11 15 20 I ANA
AN6 17 21 26 I ANA
AN7 18 22 27 I ANA
AN8 21 27 32 I ANA
AN9 22 28 33 I ANA
AN10 23 29 34 I ANA
AN11 24 30 35 I ANA
AN12 27 33 41 I ANA
AN13 28 34 42 I ANA
AN14 29 35 43 I ANA
AN15 30 36 44 I ANA
AVDD 19 25 30 P — Positive Supply for Analog modules.
AVSS 20 26 31 P — Ground Reference for Analog modules.
C1INA 11 15 20 I ANA Comparator 1 Input A.
C1INB 12 16 21 I ANA Comparator 1 Input B.
C1INC 5 7 11 I ANA Comparator 1 Input C.
C1IND 4 6 10 I ANA Comparator 1 Input D.
C2INA 13 17 22 I ANA Comparator 2 Input A.
C2INB 14 18 23 I ANA Comparator 2 Input B.
C2INC 8 10 14 I ANA Comparator 2 Input C.
C2IND 6 8 12 I ANA Comparator 2 Input D.
C3INA 55 69 84 I ANA Comparator 3 Input A.
C3INB 54 68 83 I ANA Comparator 3 Input B.
C3INC 48 60 74 I ANA Comparator 3 Input C.
C3IND 47 59 73 I ANA Comparator 3 Input D.
CLKI 39 49 63 I ANA Main Clock Input Connection.
CLKO 40 50 64 O — System Clock Output.
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
PIC24FJ256GB110 FAMILY
DS39897C-page 18 2009 Microchip Technology Inc.
CN0 48 60 74 I ST Interrupt-on-Change Inputs.
CN1 47 59 73 I ST
CN2 16 20 25 I ST
CN3 15 19 24 I ST
CN4 14 18 23 I ST
CN5 13 17 22 I ST
CN6 12 16 21 I ST
CN7 11 15 20 I ST
CN8 4 6 10 I ST
CN9 5 7 11 I ST
CN10 6 8 12 I ST
CN11 8 10 14 I ST
CN12 30 36 44 I ST
CN13 52 66 81 I ST
CN14 53 67 82 I ST
CN15 54 68 83 I ST
CN16 55 69 84 I ST
CN17 31 39 49 I ST
CN18 32 40 50 I ST
CN19 — 65 80 I ST
CN20 — 37 47 I ST
CN21 — 38 48 I ST
CN22 40 50 64 I ST
CN23 39 49 63 I ST
CN24 17 21 26 I ST
CN25 18 22 27 I ST
CN26 21 27 32 I ST
CN27 22 28 33 I ST
CN28 23 29 34 I ST
CN29 24 30 35 I ST
CN30 27 33 41 I ST
CN31 28 34 42 I ST
CN32 29 35 43 I ST
CN33 — — 17 I ST
CN34 — — 38 I ST
CN35 — — 58 I ST
CN36 — — 59 I ST
CN37 — — 60 I ST
CN38 — — 61 I ST
CN39 — — 91 I ST
CN40 — — 92 I ST
CN41 — 23 28 I ST
CN42 — 24 29 I ST
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
2009 Microchip Technology Inc. DS39897C-page 19
PIC24FJ256GB110 FAMILY
CN43 — 52 66 I ST Interrupt-on-Change Inputs.
CN44 — 53 67 I ST
CN45 — 4 6 I ST
CN46 — — 7 I ST
CN47 — 5 8 I ST
CN48 — — 9 I ST
CN49 46 58 72 I ST
CN50 49 61 76 I ST
CN51 50 62 77 I ST
CN52 51 63 78 I ST
CN53 42 54 68 I ST
CN54 43 55 69 I ST
CN55 44 56 70 I ST
CN56 45 57 71 I ST
CN57 — 64 79 I ST
CN58 60 76 93 I ST
CN59 61 77 94 I ST
CN60 62 78 98 I ST
CN61 63 79 99 I ST
CN62 64 80 100 I ST
CN63 1 1 3 I ST
CN64 2 2 4 I ST
CN65 3 3 5 I ST
CN66 — 13 18 I ST
CN67 — 14 19 I ST
CN68 58 72 87 I ST
CN69 59 73 88 I ST
CN70 — 42 52 I ST
CN71 33 41 51 I ST
CN74 — 43 53 I ST
CN75 — — 40 I ST
CN76 — — 39 I ST
CN77 — 75 90 I ST
CN78 — 74 89 I ST
CN79 — — 96 I ST
CN80 — — 97 I ST
CN81 — — 95 I ST
CN82 — — 1 I ST
CTED1 28 34 42 I ANA CTMU External Edge Input 1.
CTED2 27 33 41 I ANA CTMU External Edge Input 2.
CTPLS 29 35 43 O — CTMU Pulse Output.
CVREF 23 29 34 O — Comparator Voltage Reference Output.
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
PIC24FJ256GB110 FAMILY
DS39897C-page 20 2009 Microchip Technology Inc.
D+ 37 47 57 I/O — USB Differential Plus line (internal transceiver).
D- 36 46 56 I/O — USB Differential Minus line (internal transceiver).
DMH 46 58 72 O — D- External Pull-up Control Output.
DMLN 42 54 68 O — D- External Pull-down Control Output.
DPH 50 62 77 O — D+ External Pull-up Control Output.
DPLN 43 55 69 O — D+ External Pull-down Control Output.
ENVREG 57 71 86 I ST Voltage Regulator Enable.
INT0 46 58 72 I ST External Interrupt Input.
MCLR 7 9 13 I ST Master Clear (device Reset) Input. This line is brought low
to cause a Reset.
OSCI 39 49 63 I ANA Main Oscillator Input Connection.
OSCO 40 50 64 O ANA Main Oscillator Output Connection.
PGEC1 15 19 24 I/O ST In-Circuit Debugger/Emulator/ICSP™ Programming Clock.
PGED1 16 20 25 I/O ST In-Circuit Debugger/Emulator/ICSP Programming Data.
PGEC2 17 21 26 I/O ST In-Circuit Debugger/Emulator/ICSP Programming Clock.
PGED2 18 22 27 I/O ST In-Circuit Debugger/Emulator/ICSP Programming Data.
PGEC3 11 15 20 I/O ST In-Circuit Debugger/Emulator/ICSP Programming Clock.
PGED3 12 16 21 I/O ST In-Circuit Debugger/Emulator/ICSP Programming Data.
PMA0 30 36 44 I/O ST Parallel Master Port Address Bit 0 Input (Buffered Slave
modes) and Output (Master modes).
PMA1 29 35 43 I/O ST Parallel Master Port Address Bit 1 Input (Buffered Slave
modes) and Output (Master modes).
PMA2 8 10 14 O — Parallel Master Port Address (Demultiplexed Master
PMA3 6 8 12 O — modes).
PMA4 5 7 11 O —
PMA5 4 6 10 O —
PMA6 16 24 29 O —
PMA7 22 23 28 O —
PMA8 32 40 50 O —
PMA9 31 39 49 O —
PMA10 28 34 42 O —
PMA11 27 33 41 O —
PMA12 24 30 35 O —
PMA13 23 29 34 O —
PMCS1 45 57 71 I/O ST/TTL Parallel Master Port Chip Select 1 Strobe/Address Bit 15.
PMCS2 44 56 70 O ST Parallel Master Port Chip Select 2 Strobe/Address Bit 14.
PMBE 51 63 78 O — Parallel Master Port Byte Enable Strobe.
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
2009 Microchip Technology Inc. DS39897C-page 21
PIC24FJ256GB110 FAMILY
PMD0 60 76 93 I/O ST/TTL Parallel Master Port Data (Demultiplexed Master mode) or
PMD1 61 77 94 I/O ST/TTL Address/Data (Multiplexed Master modes).
PMD2 62 78 98 I/O ST/TTL
PMD3 63 79 99 I/O ST/TTL
PMD4 64 80 100 I/O ST/TTL
PMD5 1 1 3 I/O ST/TTL
PMD6 2 2 4 I/O ST/TTL
PMD7 3 3 5 I/O ST/TTL
PMRD 53 67 82 O — Parallel Master Port Read Strobe.
PMWR 52 66 81 O — Parallel Master Port Write Strobe.
RA0 — — 17 I/O ST PORTA Digital I/O.
RA1 — — 38 I/O ST
RA2 — — 58 I/O ST
RA3 — — 59 I/O ST
RA4 — — 60 I/O ST
RA5 — — 61 I/O ST
RA6 — — 91 I/O ST
RA7 — — 92 I/O ST
RA9 — 23 28 I/O ST
RA10 — 24 29 I/O ST
RA14 — 52 66 I/O ST
RA15 — 53 67 I/O ST
RB0 16 20 25 I/O ST PORTB Digital I/O.
RB1 15 19 24 I/O ST
RB2 14 18 23 I/O ST
RB3 13 17 22 I/O ST
RB4 12 16 21 I/O ST
RB5 11 15 20 I/O ST
RB6 17 21 26 I/O ST
RB7 18 22 27 I/O ST
RB8 21 27 32 I/O ST
RB9 22 28 33 I/O ST
RB10 23 29 34 I/O ST
RB11 24 30 35 I/O ST
RB12 27 33 41 I/O ST
RB13 28 34 42 I/O ST
RB14 29 35 43 I/O ST
RB15 30 36 44 I/O ST
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
PIC24FJ256GB110 FAMILY
DS39897C-page 22 2009 Microchip Technology Inc.
RC1 — 4 6 I/O ST PORTC Digital I/O.
RC2 — — 7 I/O ST
RC3 — 5 8 I/O ST
RC4 — — 9 I/O ST
RC12 39 49 63 I/O ST
RC13 47 59 73 I/O ST
RC14 48 60 74 I/O ST
RC15 40 50 64 I/O ST
RCV 18 22 27 I ST USB Receive Input (from external transceiver).
RD0 46 58 72 I/O ST PORTD Digital I/O.
RD1 49 61 76 I/O ST
RD2 50 62 77 I/O ST
RD3 51 63 78 I/O ST
RD4 52 66 81 I/O ST
RD5 53 67 82 I/O ST
RD6 54 68 83 I/O ST
RD7 55 69 84 I/O ST
RD8 42 54 68 I/O ST
RD9 43 55 69 I/O ST
RD10 44 56 70 I/O ST
RD11 45 57 71 I/O ST
RD12 — 64 79 I/O ST
RD13 — 65 80 I/O ST
RD14 — 37 47 I/O ST
RD15 — 38 48 I/O ST
RE0 60 76 93 I/O ST PORTE Digital I/O.
RE1 61 77 94 I/O ST
RE2 62 78 98 I/O ST
RE3 63 79 99 I/O ST
RE4 64 80 100 I/O ST
RE5 1 1 3 I/O ST
RE6 2 2 4 I/O ST
RE7 3 3 5 I/O ST
RE8 — 13 18 I/O ST
RE9 — 14 19 I/O ST
REFO 30 36 44 O — Reference Clock Output.
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
2009 Microchip Technology Inc. DS39897C-page 23
PIC24FJ256GB110 FAMILY
RF0 58 72 87 I/O ST PORTF Digital I/O.
RF1 59 73 88 I/O ST
RF2 — 42 52 I/O ST
RF3 33 41 51 I/O ST
RF4 31 39 49 I/O ST
RF5 32 40 50 I/O ST
RF8 — 43 53 I/O ST
RF12 — — 40 I/O ST
RF13 — — 39 I/O ST
RG0 — 75 90 I/O ST PORTG Digital I/O.
RG1 — 74 89 I/O ST
RG2 37 47 57 I ST
RG3 36 46 56 I ST
RG6 4 6 10 I/O ST
RG7 5 7 11 I/O ST
RG8 6 8 12 I/O ST
RG9 8 10 14 I/O ST
RG12 — — 96 I/O ST
RG13 — — 97 I/O ST
RG14 — — 95 I/O ST
RG15 — — 1 I/O ST
RP0 16 20 25 I/O ST Remappable Peripheral (input or output).
RP1 15 19 24 I/O ST
RP2 42 54 68 I/O ST
RP3 44 56 70 I/O ST
RP4 43 55 69 I/O ST
RP5 — 38 48 I/O ST
RP6 17 21 26 I/O ST
RP7 18 22 27 I/O ST
RP8 21 27 32 I/O ST
RP9 22 28 33 I/O ST
RP10 31 39 49 I/O ST
RP11 46 58 72 I/O ST
RP12 45 57 71 I/O ST
RP13 14 18 23 I/O ST
RP14 29 35 43 I/O ST
RP15 — 43 53 I/O ST
RP16 33 41 51 I/O ST
RP17 32 40 50 I/O ST
RP18 11 15 20 I/O ST
RP19 6 8 12 I/O ST
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
PIC24FJ256GB110 FAMILY
DS39897C-page 24 2009 Microchip Technology Inc.
RP20 53 67 82 I/O ST Remappable Peripheral (input or output).
RP21 4 6 10 I/O ST
RP22 51 63 78 I/O ST
RP23 50 62 77 I/O ST
RP24 49 61 76 I/O ST
RP25 52 66 81 I/O ST
RP26 5 7 11 I/O ST
RP27 8 10 14 I/O ST
RP28 12 16 21 I/O ST
RP29 30 36 44 I/O ST
RP30 — 42 52 I/O ST
RP31 — — 39 I/O ST
RPI32 — — 40 I ST Remappable Peripheral (input only).
RPI33 — 13 18 I ST
RPI34 — 14 19 I ST
RPI35 — 53 67 I ST
RPI36 — 52 66 I ST
RPI37 48 60 74 I ST
RPI38 — 4 6 I ST
RPI39 — — 7 I ST
RPI40 — 5 8 I ST
RPI41 — — 9 I ST
RPI42 — 64 79 I ST
RPI43 — 37 47 I ST
RTCC 42 54 68 O — Real-Time Clock Alarm/Seconds Pulse Output.
SCL1 44 56 66 I/O I2C I2C1 Synchronous Serial Clock Input/Output.
SCL2 32 52 58 I/O I2C I2C2 Synchronous Serial Clock Input/Output.
SCL3 2 2 4 I/O I2C I2C3 Synchronous Serial Clock Input/Output.
SDA1 43 55 67 I/O I2C I2C1 Data Input/Output.
SDA2 31 53 59 I/O I2C I2C2 Data Input/Output.
SDA3 3 3 5 I/O I2C I2C3 Data Input/Output.
SOSCI 47 59 73 I ANA Secondary Oscillator/Timer1 Clock Input.
SOSCO 48 60 74 O ANA Secondary Oscillator/Timer1 Clock Output.
T1CK 48 60 74 I ST Timer1 Clock.
TCK 27 33 38 I ST JTAG Test Clock/Programming Clock Input.
TDI 28 34 60 I ST JTAG Test Data/Programming Data Input.
TDO 24 14 61 O — JTAG Test Data Output.
TMS 23 13 17 I ST JTAG Test Mode Select Input.
USBID 33 41 51 I ST USB OTG ID (OTG mode only).
USBOEN 12 16 21 O — USB Output Enable Control (for external transceiver).
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
2009 Microchip Technology Inc. DS39897C-page 25
PIC24FJ256GB110 FAMILY
VBUS 34 44 54 P — USB Voltage, Host mode (5V).
VBUSON 11 15 20 O — USB OTG External Charge Pump Control.
VBUSST 58 72 87 I ANA USB OTG Internal Charge Pump Feedback Control.
VCAP 56 70 85 P — External Filter Capacitor Connection (regulator enabled).
VCMPST1 58 72 87 I ST USB VBUS Boost Generator, Comparator Input 1.
VCMPST2 59 73 88 I ST USB VBUS Boost Generator, Comparator Input 2.
VCPCON 49 61 76 O — USB OTG VBUS PWM/Charge Output.
VDD 10, 26, 38 12, 32, 48 2, 16, 37,
46, 62
P — Positive Supply for Peripheral Digital Logic and I/O Pins.
VDDCORE 56 70 85 P — Positive Supply for Microcontroller Core Logic (regulator
disabled).
VMIO 14 18 23 I/O ST USB Differential Minus Input/Output (external transceiver).
VPIO 13 17 22 I/O ST USB Differential Plus Input/Output (external transceiver).
VREF- 15 23 28 I ANA A/D and Comparator Reference Voltage (low) Input.
VREF+ 16 24 29 I ANA A/D and Comparator Reference Voltage (high) Input.
VSS 9, 25, 41 11, 31, 51 15, 36, 45,
65, 75
P — Ground Reference for Logic and I/O Pins.
VUSB 35 45 55 P — USB Voltage (3.3V)
TABLE 1-4: PIC24FJ256GB110 FAMILY PINOUT DESCRIPTIONS (CONTINUED)
Function
Pin Number
I/O Input
64-Pin Buffer Description
TQFP, QFN
80-Pin
TQFP
100-Pin
TQFP
Legend: TTL = TTL input buffer ST = Schmitt Trigger input buffer
ANA = Analog level input/output I2C™ = I2C/SMBus input buffer
PIC24FJ256GB110 FAMILY
DS39897C-page 26 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 27
PIC24FJ256GB110 FAMILY
2.0 GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
2.1 Basic Connection Requirements
Getting started with the PIC24FJ256GB110 family of
16-bit microcontrollers requires attention to a minimal
set of device pin connections before proceeding with
development.
The following pins must always be connected:
• All VDD and VSS pins
(see Section 2.2 “Power Supply Pins”)
• All AVDD and AVSS pins, regardless of whether or
not the analog device features are used
(see Section 2.2 “Power Supply Pins”)
• MCLR pin
(see Section 2.3 “Master Clear (MCLR) Pin”)
• ENVREG/DISVREG and VCAP/VDDCORE pins
(PIC24FJ devices only)
(see Section 2.4 “Voltage Regulator Pins
(ENVREG/DISVREG and VCAP/VDDCORE)”)
These pins must also be connected if they are being
used in the end application:
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSCI and OSCO pins when an external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
Additionally, the following pins may be required:
• VREF+/VREF- pins used when external voltage
reference for analog modules is implemented
The minimum mandatory connections are shown in
Figure 2-1.
FIGURE 2-1: RECOMMENDED
MINIMUM CONNECTIONS
Note: The AVDD and AVSS pins must always be
connected, regardless of whether any of
the analog modules are being used.
PIC24FXXXX
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
C1
R1
VDD
MCLR
VCAP/VDDCORE
R2
(EN/DIS)VREG
(1)
C7
C2(2)
C3(2)
C5(2) C4(2)
C6(2)
Key (all values are recommendations):
C1 through C6: 0.1 F, 20V ceramic
C7: 10 F, 6.3V or greater, tantalum or ceramic
R1: 10 kΩ
R2: 100Ω to 470Ω
Note 1: See Section 2.4 “Voltage Regulator Pins
(ENVREG/DISVREG and VCAP/VDDCORE)”
for explanation of ENVREG/DISVREG pin
connections.
2: The example shown is for a PIC24F device
with five VDD/VSS and AVDD/AVSS pairs.
Other devices may have more or less pairs;
adjust the number of decoupling capacitors
appropriately.
(1)
PIC24FJ256GB110 FAMILY
DS39897C-page 28 2009 Microchip Technology Inc.
2.2 Power Supply Pins
2.2.1 DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A 0.1 F (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
• Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1 F in parallel with 0.001 F).
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
2.2.2 TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including microcontrollers to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device, and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7 F to 47 F.
2.3 Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions: device Reset, and device programming
and debugging. If programming and debugging are
not required in the end application, a direct
connection to VDD may be all that is required. The
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage sags, may be beneficial. A typical
configuration is shown in Figure 2-1. Other circuit
designs may be implemented, depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (VIH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR pin during programming and
debugging operations by using a jumper (Figure 2-2).
The jumper is replaced for normal run-time
operations.
Any components associated with the MCLR pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1: R1 10 k is recommended. A suggested
starting value is 10 k. Ensure that the
MCLR pin VIH and VIL specifications are met.
2: R2 470 will limit any current flowing into
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
C1
R2
R1
VDD
MCLR
JP PIC24FXXXX
2009 Microchip Technology Inc. DS39897C-page 29
PIC24FJ256GB110 FAMILY
2.4 Voltage Regulator Pins
(ENVREG/DISVREG and
VCAP/VDDCORE)
The on-chip voltage regulator enable/disable pin
(ENVREG or DISVREG, depending on the device
family) must always be connected directly to either a
supply voltage or to ground. The particular connection
is determined by whether or not the regulator is to be
used:
• For ENVREG, tie to VDD to enable the regulator,
or to ground to disable the regulator
• For DISVREG, tie to ground to enable the
regulator or to VDD to disable the regulator
Refer to Section 26.2 “On-Chip Voltage Regulator”
for details on connecting and using the on-chip
regulator.
When the regulator is enabled, a low-ESR (<5Ω)
capacitor is required on the VCAP/VDDCORE pin to
stabilize the voltage regulator output voltage. The
VCAP/VDDCORE pin must not be connected to VDD, and
must use a capacitor of 10 F connected to ground. The
type can be ceramic or tantalum. A suitable example is
the Murata GRM21BF50J106ZE01 (10 F, 6.3V) or
equivalent. Designers may use Figure 2-3 to evaluate
ESR equivalence of candidate devices.
The placement of this capacitor should be close to
VCAP/VDDCORE. It is recommended that the trace
length not exceed 0.25 inch (6 mm). Refer to
Section 29.0 “Electrical Characteristics” for
additional information.
When the regulator is disabled, the VCAP/VDDCORE pin
must be tied to a voltage supply at the VDDCORE level.
Refer to Section 29.0 “Electrical Characteristics” for
information on VDD and VDDCORE.
FIGURE 2-3: FREQUENCY vs. ESR
PERFORMANCE FOR
SUGGESTED VCAP
2.5 ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming (ICSP) and debugging purposes.
It is recommended to keep the trace length between
the ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recommended,
with the value in the range of a few tens of
ohms, not to exceed 100Ω.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communications
to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(VIH) and input low (VIL) requirements.
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGECx/PGEDx pins) programmed
into the device matches the physical connections for the
ICSP to the Microchip debugger/emulator tool.
For more information on available Microchip
development tools connection requirements, refer to
Section 27.0 “Development Support”.
Note: This section applies only to PIC24FJ
devices with an on-chip voltage regulator.
10
1
0.1
0.01
0.001
0.01 0.1 1 10 100 1000 10,000
Frequency (MHz)
ESR ()
Note: Data for Murata GRM21BF50J106ZE01 shown.
Measurements at 25°C, 0V DC bias.
PIC24FJ256GB110 FAMILY
DS39897C-page 30 2009 Microchip Technology Inc.
2.6 External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency secondary oscillator (refer to
Section 8.0 “Oscillator Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator circuit
to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to completely
surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assignments,
ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC™ and PICmicro® Devices”
• AN849, “Basic PICmicro® Oscillator Design”
• AN943, “Practical PICmicro® Oscillator Analysis
and Design”
• AN949, “Making Your Oscillator Work”
FIGURE 2-4: SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
GND
`
`
`
OSCI
OSCO
SOSCO
SOSC I
Copper Pour Primary Oscillator
Crystal
Secondary
Crystal
DEVICE PINS
Primary
Oscillator
C1
C2
Sec Oscillator: C1 Sec Oscillator: C2
(tied to ground)
GND
OSCO
OSCI
Bottom Layer
Copper Pour
Oscillator
Crystal
Top Layer Copper Pour
C2
C1
DEVICE PINS
(tied to ground)
(tied to ground)
Single-Sided and In-line Layouts:
Fine-Pitch (Dual-Sided) Layouts:
Oscillator
2009 Microchip Technology Inc. DS39897C-page 31
PIC24FJ256GB110 FAMILY
2.7 Configuration of Analog and
Digital Pins During ICSP
Operations
If an ICSP compliant emulator is selected as a debugger,
it automatically initializes all of the A/D input pins
(ANx) as “digital” pins. Depending on the particular
device, this is done by setting all bits in the ADnPCFG
register(s), or clearing all bit in the ANSx registers.
All PIC24F devices will have either one or more
ADnPCFG registers or several ANSx registers (one for
each port); no device will have both. Refer to
Section 22.0 “10-Bit High-Speed A/D Converter” for
more specific information.
The bits in these registers that correspond to the A/D
pins that initialized the emulator must not be changed
by the user application firmware; otherwise,
communication errors will result between the debugger
and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must modify the appropriate bits during
initialization of the ADC module, as follows:
• For devices with an ADnPCFG register, clear the
bits corresponding to the pin(s) to be configured
as analog. Do not change any other bits, particularly
those corresponding to the PGECx/PGEDx
pair, at any time.
• For devices with ANSx registers, set the bits
corresponding to the pin(s) to be configured as
analog. Do not change any other bits, particularly
those corresponding to the PGECx/PGEDx pair,
at any time.
When a Microchip debugger/emulator is used as a
programmer, the user application firmware must
correctly configure the ADnPCFG or ANSx registers.
Automatic initialization of this register is only done
during debugger operation. Failure to correctly
configure the register(s) will result in all A/D pins being
recognized as analog input pins, resulting in the port
value being read as a logic '0', which may affect user
application functionality.
2.8 Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 kΩ
to 10 kΩ resistor to VSS on unused pins and drive the
output to logic low.
PIC24FJ256GB110 FAMILY
DS39897C-page 32 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 33
PIC24FJ256GB110 FAMILY
3.0 CPU
The PIC24F CPU has a 16-bit (data) modified Harvard
architecture with an enhanced instruction set and a
24-bit instruction word with a variable length opcode
field. The Program Counter (PC) is 23 bits wide and
addresses up to 4M instructions of user program
memory space. A single-cycle instruction prefetch
mechanism is used to help maintain throughput and
provides predictable execution. All instructions execute
in a single cycle, with the exception of instructions that
change the program flow, the double-word move
(MOV.D) instruction and the table instructions.
Overhead-free program loop constructs are supported
using the REPEAT instructions, which are interruptible at
any point.
PIC24F devices have sixteen, 16-bit working registers
in the programmer’s model. Each of the working
registers can act as a data, address or address offset
register. The 16th working register (W15) operates as
a Software Stack Pointer for interrupts and calls.
The upper 32 Kbytes of the data space memory map
can optionally be mapped into program space at any
16K word boundary defined by the 8-bit Program Space
Visibility Page Address (PSVPAG) register. The program
to data space mapping feature lets any instruction
access program space as if it were data space.
The Instruction Set Architecture (ISA) has been
significantly enhanced beyond that of the PIC18, but
maintains an acceptable level of backward compatibility.
All PIC18 instructions and addressing modes are
supported, either directly, or through simple macros.
Many of the ISA enhancements have been driven by
compiler efficiency needs.
The core supports Inherent (no operand), Relative,
Literal, Memory Direct and three groups of addressing
modes. All modes support Register Direct and various
Register Indirect modes. Each group offers up to seven
addressing modes. Instructions are associated with
predefined addressing modes depending upon their
functional requirements.
For most instructions, the core is capable of executing
a data (or program data) memory read, a working register
(data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, three parameter instructions can be supported,
allowing trinary operations (that is, A + B = C) to be
executed in a single cycle.
A high-speed, 17-bit by 17-bit multiplier has been
included to significantly enhance the core arithmetic
capability and throughput. The multiplier supports
Signed, Unsigned and Mixed mode, 16-bit by 16-bit or
8-bit by 8-bit, integer multiplication. All multiply
instructions execute in a single cycle.
The 16-bit ALU has been enhanced with integer divide
assist hardware that supports an iterative non-restoring
divide algorithm. It operates in conjunction with the
REPEAT instruction looping mechanism and a selection
of iterative divide instructions to support 32-bit (or
16-bit), divided by 16-bit, integer signed and unsigned
division. All divide operations require 19 cycles to
complete but are interruptible at any cycle boundary.
The PIC24F has a vectored exception scheme with up
to 8 sources of non-maskable traps and up to 118 interrupt
sources. Each interrupt source can be assigned to
one of seven priority levels.
A block diagram of the CPU is shown in Figure 3-1.
3.1 Programmer’s Model
The programmer’s model for the PIC24F is shown in
Figure 3-2. All registers in the programmer’s model are
memory mapped and can be manipulated directly by
instructions. A description of each register is provided
in Table 3-1. All registers associated with the
programmer’s model are memory mapped.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 2. “CPU” (DS39703).
PIC24FJ256GB110 FAMILY
DS39897C-page 34 2009 Microchip Technology Inc.
FIGURE 3-1: PIC24F CPU CORE BLOCK DIAGRAM
Instruction
Decode &
Control
PCH PCL
16
Program Counter
16-Bit ALU
23
23
24
23
Data Bus
Instruction Reg
16
16 x 16
Divide W Register Array
Support
ROM Latch
16
EA MUX
RAGU
WAGU
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Block
Stack
Control
Logic
Loop
Control
Logic
Data Latch
Data RAM
Address
Latch
Control Signals
to Various Blocks
Program Memory
Data Latch
Address Bus
16
Literal Data
16 16
Hardware
Multiplier
16
To Peripheral Modules
Address Latch
2009 Microchip Technology Inc. DS39897C-page 35
PIC24FJ256GB110 FAMILY
TABLE 3-1: CPU CORE REGISTERS
FIGURE 3-2: PROGRAMMER’S MODEL
Register(s) Name Description
W0 through W15 Working Register Array
PC 23-Bit Program Counter
SR ALU STATUS Register
SPLIM Stack Pointer Limit Value Register
TBLPAG Table Memory Page Address Register
PSVPAG Program Space Visibility Page Address Register
RCOUNT Repeat Loop Counter Register
CORCON CPU Control Register
N OV Z C
TBLPAG
22 0
7 0
15 0
Program Counter
Table Memory Page
ALU STATUS Register (SR)
Working/Address
Registers
W0 (WREG)
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
Frame Pointer
Stack Pointer
PSVPAG
7 0
Program Space Visibility
RA
0
RCOUNT
15 0
Repeat Loop Counter
SPLIM Stack Pointer Limit
SRL
Registers or bits shaded for PUSH.S and POP.S instructions.
0
0
Page Address Register
15 0
CPU Control Register (CORCON)
SRH
W14
W15
DC IPL
—— — —— —— 2 1 0
— —— — — —— — — —— —IPL3 PSV — —
PC
Divider Working Registers
Multiplier Registers
15 0
Value Register
Address Register
Register
PIC24FJ256GB110 FAMILY
DS39897C-page 36 2009 Microchip Technology Inc.
3.2 CPU Control Registers
REGISTER 3-1: SR: ALU STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — — DC
bit 15 bit 8
R/W-0(1) R/W-0(1) R/W-0(1) R-0 R/W-0 R/W-0 R/W-0 R/W-0
IPL2(2) IPL1(2) IPL0(2) RA N OV Z C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-9 Unimplemented: Read as ‘0’
bit 8 DC: ALU Half Carry/Borrow bit
1 = A carry out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data)
of the result occurred
0 = No carry out from the 4th or 8th low-order bit of the result has occurred
bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(1,2)
111 = CPU interrupt priority level is 7 (15); user interrupts disabled
110 = CPU interrupt priority level is 6 (14)
101 = CPU interrupt priority Level is 5 (13)
100 = CPU interrupt priority level is 4 (12)
011 = CPU interrupt priority level is 3 (11)
010 = CPU interrupt priority level is 2 (10)
001 = CPU interrupt priority level is 1 (9)
000 = CPU interrupt priority level is 0 (8)
bit 4 RA: REPEAT Loop Active bit
1 = REPEAT loop in progress
0 = REPEAT loop not in progress
bit 3 N: ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2 OV: ALU Overflow bit
1 = Overflow occurred for signed (2’s complement) arithmetic in this arithmetic operation
0 = No overflow has occurred
bit 1 Z: ALU Zero bit
1 = An operation which effects the Z bit has set it at some time in the past
0 = The most recent operation which effects the Z bit has cleared it (i.e., a non-zero result)
bit 0 C: ALU Carry/Borrow bit
1 = A carry out from the Most Significant bit of the result occurred
0 = No carry out from the Most Significant bit of the result occurred
Note 1: The IPL Status bits are read-only when NSTDIS (INTCON1<15>) = 1.
2: The IPL Status bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU Interrupt Priority
Level (IPL). The value in parentheses indicates the IPL when IPL3 = 1.
2009 Microchip Technology Inc. DS39897C-page 37
PIC24FJ256GB110 FAMILY
3.3 Arithmetic Logic Unit (ALU)
The PIC24F ALU is 16 bits wide and is capable of addition,
subtraction, bit shifts and logic operations. Unless
otherwise mentioned, arithmetic operations are 2’s
complement in nature. Depending on the operation, the
ALU may affect the values of the Carry (C), Zero (Z),
Negative (N), Overflow (OV) and Digit Carry (DC)
Status bits in the SR register. The C and DC Status bits
operate as Borrow and Digit Borrow bits, respectively,
for subtraction operations.
The ALU can perform 8-bit or 16-bit operations,
depending on the mode of the instruction that is used.
Data for the ALU operation can come from the W
register array, or data memory, depending on the
addressing mode of the instruction. Likewise, output
data from the ALU can be written to the W register array
or a data memory location.
The PIC24F CPU incorporates hardware support for
both multiplication and division. This includes a
dedicated hardware multiplier and support hardware
for 16-bit divisor division.
3.3.1 MULTIPLIER
The ALU contains a high-speed, 17-bit x 17-bit
multiplier. It supports unsigned, signed or mixed sign
operation in several multiplication modes:
1. 16-bit x 16-bit signed
2. 16-bit x 16-bit unsigned
3. 16-bit signed x 5-bit (literal) unsigned
4. 16-bit unsigned x 16-bit unsigned
5. 16-bit unsigned x 5-bit (literal) unsigned
6. 16-bit unsigned x 16-bit signed
7. 8-bit unsigned x 8-bit unsigned
REGISTER 3-2: CORCON: CPU CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R/C-0 R/W-0 U-0 U-0
— — — — IPL3(1) PSV — —
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0’
bit 3 IPL3: CPU Interrupt Priority Level Status bit(1)
1 = CPU interrupt priority level is greater than 7
0 = CPU interrupt priority level is 7 or less
bit 2 PSV: Program Space Visibility in Data Space Enable bit
1 = Program space visible in data space
0 = Program space not visible in data space
bit 1-0 Unimplemented: Read as ‘0’
Note 1: User interrupts are disabled when IPL3 = 1.
PIC24FJ256GB110 FAMILY
DS39897C-page 38 2009 Microchip Technology Inc.
3.3.2 DIVIDER
The divide block supports signed and unsigned integer
divide operations with the following data sizes:
1. 32-bit signed/16-bit signed divide
2. 32-bit unsigned/16-bit unsigned divide
3. 16-bit signed/16-bit signed divide
4. 16-bit unsigned/16-bit unsigned divide
The quotient for all divide instructions ends up in W0
and the remainder in W1. Sixteen-bit signed and
unsigned DIV instructions can specify any W register
for both the 16-bit divisor (Wn), and any W register
(aligned) pair (W(m + 1):Wm) for the 32-bit dividend.
The divide algorithm takes one cycle per bit of divisor,
so both 32-bit/16-bit and 16-bit/16-bit instructions take
the same number of cycles to execute.
3.3.3 MULTI-BIT SHIFT SUPPORT
The PIC24F ALU supports both single bit and
single-cycle, multi-bit arithmetic and logic shifts.
Multi-bit shifts are implemented using a shifter block,
capable of performing up to a 15-bit arithmetic right
shift, or up to a 15-bit left shift, in a single cycle. All
multi-bit shift instructions only support Register Direct
Addressing for both the operand source and result
destination.
A full summary of instructions that use the shift
operation is provided below in Table 3-2.
TABLE 3-2: INSTRUCTIONS THAT USE THE SINGLE AND MULTI-BIT SHIFT OPERATION
Instruction Description
ASR Arithmetic shift right source register by one or more bits.
SL Shift left source register by one or more bits.
LSR Logical shift right source register by one or more bits.
2009 Microchip Technology Inc. DS39897C-page 39
PIC24FJ256GB110 FAMILY
4.0 MEMORY ORGANIZATION
As Harvard architecture devices, PIC24F microcontrollers
feature separate program and data memory
spaces and busses. This architecture also allows the
direct access of program memory from the data space
during code execution.
4.1 Program Address Space
The program address memory space of the
PIC24FJ256GB110 family devices is 4M instructions.
The space is addressable by a 24-bit value derived
from either the 23-bit Program Counter (PC) during program
execution, or from table operation or data space
remapping, as described in Section 4.3 “Interfacing
Program and Data Memory Spaces”.
User access to the program memory space is restricted
to the lower half of the address range (000000h to
7FFFFFh). The exception is the use of TBLRD/TBLWT
operations which use TBLPAG<7> to permit access to
the Configuration bits and Device ID sections of the
configuration memory space.
Memory maps for the PIC24FJ256GB110 family of
devices are shown in Figure 4-1.
FIGURE 4-1: PROGRAM SPACE MEMORY MAP FOR PIC24FJ256GB110 FAMILY DEVICES
000000h
0000FEh
000002h
000100h
F8000Eh
F80010h
FEFFFEh
FFFFFFh
000004h
000200h
0001FEh
000104h
Reset Address
DEVID (2)
GOTO Instruction
Reserved
Alternate Vector Table
Reserved
Interrupt Vector Table
PIC24FJ128GB1XX
Configuration Memory Space User Memory Space
Flash Config Words
Note: Memory areas are not shown to scale.
Reset Address
Device Config Registers
DEVID (2)
GOTO Instruction
Reserved
Alternate Vector Table
Reserved
Interrupt Vector Table
PIC24FJ192GB1XX
FF0000h
F7FFFEh
Device Config Registers F80000h
800000h
7FFFFFh
Reserved
Reserved
Flash Config Words
02AC00h
02ABFEh
Unimplemented
Read ‘0’
Unimplemented
Read ‘0’
Reset Address
Device Config Registers
User Flash
Program Memory
(87K instructions)
DEVID (2)
GOTO Instruction
Reserved
Alternate Vector Table
Reserved
Interrupt Vector Table
PIC24FJ256GB1XX
Reserved
Flash Config Words
Unimplemented
Read ‘0’
Reset Address
DEVID (2)
GOTO Instruction
Reserved
Alternate Vector Table
Reserved
Interrupt Vector Table
PIC24FJ64GB1XX
Flash Config Words
Device Config Registers
Reserved
Unimplemented
Read ‘0’
015800h
0157FEh
00AC00h
00ABFEh
User Flash
Program Memory
(22K instructions)
020C00h
020BFEh
User Flash
Program Memory
(67K instructions)
User Flash
Program Memory
(44K instructions)
PIC24FJ256GB110 FAMILY
DS39897C-page 40 2009 Microchip Technology Inc.
4.1.1 PROGRAM MEMORY
ORGANIZATION
The program memory space is organized in
word-addressable blocks. Although it is treated as
24 bits wide, it is more appropriate to think of each
address of the program memory as a lower and upper
word, with the upper byte of the upper word being
unimplemented. The lower word always has an even
address, while the upper word has an odd address
(Figure 4-2).
Program memory addresses are always word-aligned
on the lower word and addresses are incremented or
decremented by two during code execution. This
arrangement also provides compatibility with data
memory space addressing and makes it possible to
access data in the program memory space.
4.1.2 HARD MEMORY VECTORS
All PIC24F devices reserve the addresses between
00000h and 000200h for hard coded program execution
vectors. A hardware Reset vector is provided to
redirect code execution from the default value of the
PC on device Reset to the actual start of code. A GOTO
instruction is programmed by the user at 000000h, with
the actual address for the start of code at 000002h.
PIC24F devices also have two interrupt vector tables,
located from 000004h to 0000FFh and 000100h to
0001FFh. These vector tables allow each of the many
device interrupt sources to be handled by separate
ISRs. A more detailed discussion of the interrupt vector
tables is provided in Section 7.1 “Interrupt Vector
Table”.
4.1.3 FLASH CONFIGURATION WORDS
In PIC24FJ256GB110 family devices, the top three
words of on-chip program memory are reserved for
configuration information. On device Reset, the configuration
information is copied into the appropriate
Configuration registers. The addresses of the Flash
Configuration Word for devices in the
PIC24FJ256GB110 family are shown in Table 4-1.
Their location in the memory map is shown with the
other memory vectors in Figure 4-1.
The Configuration Words in program memory are a
compact format. The actual Configuration bits are
mapped in several different registers in the configuration
memory space. Their order in the Flash Configuration
Words does not reflect a corresponding arrangement in
the configuration space. Additional details on the device
Configuration Words are provided in Section 26.1
“Configuration Bits”.
TABLE 4-1: FLASH CONFIGURATION
WORDS FOR
PIC24FJ256GB110 FAMILY
DEVICES
FIGURE 4-2: PROGRAM MEMORY ORGANIZATION
Device
Program
Memory
(Words)
Configuration
Word
Addresses
PIC24FJ64GB 22,016 00ABFAh:
00ABFEh
PIC24FJ128GB 44,032 0157FAh:
0157FEh
PIC24FJ192GB 67,072 020BFAh:
020BFEh
PIC24FJ256GB 87,552 02ABFAh:
02ABFEh
16 8 0
PC Address
000000h
000002h
000004h
000006h
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(read as ‘0’)
most significant word least significant word
Instruction Width
000001h
000003h
000005h
000007h
MSW
Address (LSW Address)
2009 Microchip Technology Inc. DS39897C-page 41
PIC24FJ256GB110 FAMILY
4.2 Data Address Space
The PIC24F core has a separate, 16-bit wide data memory
space, addressable as a single linear range. The
data space is accessed using two Address Generation
Units (AGUs), one each for read and write operations.
The data space memory map is shown in Figure 4-3.
All Effective Addresses (EAs) in the data memory space
are 16 bits wide and point to bytes within the data space.
This gives a data space address range of 64 Kbytes or
32K words. The lower half of the data memory space
(that is, when EA<15> = 0) is used for implemented
memory addresses, while the upper half (EA<15> = 1) is
reserved for the program space visibility area (see
Section 4.3.3 “Reading Data from Program Memory
Using Program Space Visibility”).
PIC24FJ256GB110 family devices implement a total of
16 Kbytes of data memory. Should an EA point to a
location outside of this area, an all zero word or byte will
be returned.
4.2.1 DATA SPACE WIDTH
The data memory space is organized in
byte-addressable, 16-bit wide blocks. Data is aligned
in data memory and registers as 16-bit words, but all
data space EAs resolve to bytes. The Least Significant
Bytes of each word have even addresses, while the
Most Significant Bytes have odd addresses.
FIGURE 4-3: DATA SPACE MEMORY MAP FOR PIC24FJ256GB110 FAMILY DEVICES
0000h
07FEh
FFFEh
LSB
MSB LSB Address
MSB
Address
0001h
07FFh
1FFFh
FFFFh
8001h 8000h
7FFFh
0801h 0800h
2001h
Near
1FFEh
SFR Space SFR
Data RAM
2000h
7FFFh
Program Space
Visibility Area
Note: Data memory areas are not shown to scale.
47FEh
4800h
47FFh
4801h
Space
Data Space
Implemented
Data RAM
Unimplemented
Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 42 2009 Microchip Technology Inc.
4.2.2 DATA MEMORY ORGANIZATION
AND ALIGNMENT
To maintain backward compatibility with PIC® devices
and improve data space memory usage efficiency, the
PIC24F instruction set supports both word and byte
operations. As a consequence of byte accessibility, all
Effective Address calculations are internally scaled to
step through word-aligned memory. For example, the
core recognizes that Post-Modified Register Indirect
Addressing mode [Ws++] will result in a value of Ws + 1
for byte operations and Ws + 2 for word operations.
Data byte reads will read the complete word which contains
the byte, using the LSb of any EA to determine
which byte to select. The selected byte is placed onto
the LSB of the data path. That is, data memory and registers
are organized as two parallel, byte-wide entities
with shared (word) address decode but separate write
lines. Data byte writes only write to the corresponding
side of the array or register which matches the byte
address.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word
operations, or translating from 8-bit MCU code. If a
misaligned read or write is attempted, an address error
trap will be generated. If the error occurred on a read,
the instruction underway is completed; if it occurred on
a write, the instruction will be executed but the write will
not occur. In either case, a trap is then executed, allowing
the system and/or user to examine the machine
state prior to execution of the address Fault.
All byte loads into any W register are loaded into the
Least Significant Byte. The Most Significant Byte is not
modified.
A sign-extend instruction (SE) is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions operate only on words.
4.2.3 NEAR DATA SPACE
The 8-Kbyte area between 0000h and 1FFFh is
referred to as the near data space. Locations in this
space are directly addressable via a 13-bit absolute
address field within all memory direct instructions. The
remainder of the data space is addressable indirectly.
Additionally, the whole data space is addressable using
MOV instructions, which support Memory Direct
Addressing with a 16-bit address field.
4.2.4 SFR SPACE
The first 2 Kbytes of the near data space, from 0000h
to 07FFh, are primarily occupied with Special Function
Registers (SFRs). These are used by the PIC24F core
and peripheral modules for controlling the operation of
the device.
SFRs are distributed among the modules that they control
and are generally grouped together by module.
Much of the SFR space contains unused addresses;
these are read as ‘0’. A diagram of the SFR space,
showing where SFRs are actually implemented, is
shown in Table 4-2. Each implemented area indicates
a 32-byte region where at least one address is implemented
as an SFR. A complete listing of implemented
SFRs, including their addresses, is shown in Tables 4-3
through 4-30.
TABLE 4-2: IMPLEMENTED REGIONS OF SFR DATA SPACE
SFR Space Address
xx00 xx20 xx40 xx60 xx80 xxA0 xxC0 xxE0
000h Core ICN Interrupts —
100h Timers Capture Compare
200h I2C™ UART SPI/UART SPI/I2C SPI UART I/O
300h A/D A/D/CTMU — — — — — —
400h — — — — USB —
500h — — — — — — — —
600h PMP RTC/Comp CRC — PPS —
700h — — System NVM/PMD — — — —
Legend: — = No implemented SFRs in this block
2009 Microchip Technology Inc. DS39897C-page 43
PIC24FJ256GB110 FAMILY
TABLE 4-3: CPU CORE REGISTERS MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
WREG0 0000 Working Register 0 0000
WREG1 0002 Working Register 1 0000
WREG2 0004 Working Register 2 0000
WREG3 0006 Working Register 3 0000
WREG4 0008 Working Register 4 0000
WREG5 000A Working Register 5 0000
WREG6 000C Working Register 6 0000
WREG7 000E Working Register 7 0000
WREG8 0010 Working Register 8 0000
WREG9 0012 Working Register 9 0000
WREG10 0014 Working Register 10 0000
WREG11 0016 Working Register 11 0000
WREG12 0018 Working Register 12 0000
WREG13 001A Working Register 13 0000
WREG14 001C Working Register 14 0000
WREG15 001E Working Register 15 0800
SPLIM 0020 Stack Pointer Limit Value Register xxxx
PCL 002E Program Counter Low Word Register 0000
PCH 0030 — — — — — — — — Program Counter Register High Byte 0000
TBLPAG 0032 — — — — — — — — Table Memory Page Address Register 0000
PSVPAG 0034 — — — — — — — — Program Space Visibility Page Address Register 0000
RCOUNT 0036 Repeat Loop Counter Register xxxx
SR 0042 — — — — — — — DC IPL2 IPL1 IPL0 RA N OV Z C 0000
CORCON 0044 — — — — — — — — — — — — IPL3 PSV — — 0000
DISICNT 0052 — — Disable Interrupts Counter Register xxxx
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
PIC24FJ256GB110 FAMILY
DS39897C-page 44 2009 Microchip Technology Inc.
TABLE 4-4: ICN REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CNPD1 0054 CN15PDE CN14PDE CN13PDE CN12PDE CN11PDE CN10PDE CN9PDE CN8PDE CN7PDE CN6PDE CN5PDE CN4PDE CN3PDE CN2PDE CN1PDE CN0PDE 0000
CNPD2 0056 CN31PDE CN30PDE CN29PDE CN28PDE CN27PDE CN26PDE CN25PDE CN24PDE CN23PDE CN22PDE CN21PDE(1) CN20PDE(1) CN19PDE(1) CN18PDE CN17PDE CN16PDE 0000
CNPD3 0058 CN47PDE(1) CN46PDE(2) CN45PDE(1) CN44PDE(1) CN43PDE(1) CN42PDE(1) CN41PDE(1) CN40PDE(2) CN39PDE(2) CN38PDE(2) CN37PDE(2) CN36PDE(2) CN35PDE(2) CN34PDE(2) CN33PDE(2) CN32PDE 0000
CNPD4 005A CN63PDE CN62PDE CN61PDE CN60PDE CN59PDE CN58PDE CN57PDE(1) CN56PDE CN55PDE CN54PDE CN53PDE CN52PDE CN51PDE CN50PDE CN49PDE CN48PDE(2) 0000
CNPD5 005C CN79PDE(2) CN78PDE(1) CN77PDE(1) CN76PDE(2) CN75PDE(2) CN74PDE(1) — — CN71PDE CN70PDE(1) CN69PDE CN68PDE CN67PDE(1) CN66PDE(1) CN65PDE CN64PDE 0000
CNPD6(2) 005E — — — — — — — — — — — — — CN82PDE(2) CN81PDE(2) CN80PDE(2) 0000
CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000
CNEN2 0062 CN31IE CN30IE CN29IE CN28IE CN27IE CN26IE CN25IE CN24IE CN23IE CN22IE CN21IE(1) CN20IE(1) CN19IE(1) CN18IE CN17IE CN16IE 0000
CNEN3 0064 CN47IE(1) CN46IE(2) CN45IE(1) CN44IE(1) CN43IE(1) CN42IE(1) CN41IE(1) CN40IE(2) CN39IE(2) CN38IE(2) CN37IE(2) CN36IE(2) CN35IE(2) CN34IE(2) CN33IE(2) CN32IE 0000
CNEN4 0066 CN63IE CN62IE CN61IE CN60IE CN59IE CN58IE CN57IE(1) CN56IE CN55IE CN54IE CN53IE CN52IE CN51IE CN50IE CN49IE CN48IE(2) 0000
CNEN5 0068 CN79IE(2) CN78IE(1) CN77IE(1) CN76IE(2) CN75IE(2) CN74IE(1) — — CN71IE CN70IE(1) CN69IE CN68IE CN67IE(1) CN66IE(1) CN65IE CN64IE 0000
CNEN6(2) 006A — — — — — — — — — — — — — CN82IE(2) CN81IE(2) CN80IE(2) 0000
CNPU1 006C CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000
CNPU2 006E CN31PUE CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE(1) CN20PUE(1) CN19PUE(1) CN18PUE CN17PUE CN16PUE 0000
CNPU3 0070 CN47PUE(1) CN46PUE(2) CN45PUE(1) CN44PUE(1) CN43PUE(1) CN42PUE(1) CN41PUE(1) CN40PUE(2) CN39PUE(2) CN38PUE(2) CN37PUE(2) CN36PUE(2) CN35PUE(2) CN34PUE(2) CN33PUE(2) CN32PUE 0000
CNPU4 0072 CN63PUE CN62PUE CN61PUE CN60PUE CN59PUE CN58PUE CN57PUE(1) CN56PUE CN55PUE CN54PUE CN53PUE CN52PUE CN51PUE CN50PUE CN49PUE CN48PUE(2) 0000
CNPU5 0074 CN79PUE(2) CN78PUE(1) CN77PUE(1) CN76PUE(2) CN75PUE(2) CN74PUE(1) — — CN71PUE CN70PUE(1) CN69PUE CN68PUE CN67PUE(1) CN66PUE(1) CN65PUE CN64PUE 0000
CNPU6(2) 0076 — — — — — — — — — — — — — CN82PUE(2) CN81PUE(2) CN80PUE(2) 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Unimplemented on 64-pin devices; read as ‘0’.
2: Unimplemented on 64-pin and 80-pin devices; read as ‘0’.
2009 Microchip Technology Inc. DS39897C-page 45
PIC24FJ256GB110 FAMILY
TABLE 4-5: INTERRUPT CONTROLLER REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS — — — — — — — — — — MATHERR ADDRERR STKERR OSCFAIL — 0000
INTCON2 0082 ALTIVT DISI — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000
IFS0 0084 — — AD1IF U1TXIF U1RXIF SPI1IF SPF1IF T3IF T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF 0000
IFS1 0086 U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF — IC8IF IC7IF — INT1IF CNIF CMIF MI2C1IF SI2C1IF 0000
IFS2 0088 — — PMPIF OC8IF OC7IF OC6IF OC5IF IC6IF IC5IF IC4IF IC3IF — — — SPI2IF SPF2IF 0000
IFS3 008A — RTCIF — — — — — — — INT4IF INT3IF — — MI2C2IF SI2C2IF — 0000
IFS4 008C — — CTMUIF — — — — LVDIF — — — — CRCIF U2ERIF U1ERIF — 0000
IFS5 008E — — IC9IF OC9IF SPI3IF SPF3IF U4TXIF U4RXIF U4ERIF USB1IF MI2C3IF SI2C3IF U3TXIF U3RXIF U3ERIF — 0000
IEC0 0094 — — AD1IE U1TXIE U1RXIE SPI1IE SPF1IE T3IE T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE 0000
IEC1 0096 U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE — IC8IE IC7IE — INT1IE CNIE CMIE MI2C1IE SI2C1IE 0000
IEC2 0098 — — PMPIE OC8IE OC7IE OC6IE OC5IE IC6IE IC5IE IC4IE IC3IE — — — SPI2IE SPF2IE 0000
IEC3 009A — RTCIE — — — — — — — INT4IE INT3IE — — MI2C2IE SI2C2IE — 0000
IEC4 009C — — CTMUIE — — — — LVDIE — — — — CRCIE U2ERIE U1ERIE — 0000
IEC5 009E — — IC9IE OC9IE SPI3IE SPF3IE U4TXIE U4RXIE U4ERIE USB1IE MI2C3IE SI2C3IE U3TXIE U3RXIE U3ERIE — 0000
IPC0 00A4 — T1IP2 T1IP1 T1IP0 — OC1IP2 OC1IP1 OC1IP0 — IC1IP2 IC1IP1 IC1IP0 — INT0IP2 INT0IP1 INT0IP0 4444
IPC1 00A6 — T2IP2 T2IP1 T2IP0 — OC2IP2 OC2IP1 OC2IP0 — IC2IP2 IC2IP1 IC2IP0 — — — — 4440
IPC2 00A8 — U1RXIP2 U1RXIP1 U1RXIP0 — SPI1IP2 SPI1IP1 SPI1IP0 — SPF1IP2 SPF1IP1 SPF1IP0 — T3IP2 T3IP1 T3IP0 4444
IPC3 00AA — — — — — — — — — AD1IP2 AD1IP1 AD1IP0 — U1TXIP2 U1TXIP1 U1TXIP0 0044
IPC4 00AC — CNIP2 CNIP1 CNIP0 — CMIP2 CMIP1 CMIP0 — MI2C1P2 MI2C1P1 MI2C1P0 — SI2C1P2 SI2C1P1 SI2C1P0 4444
IPC5 00AE — IC8IP2 IC8IP1 IC8IP0 — IC7IP2 IC7IP1 IC7IP0 — — — — — INT1IP2 INT1IP1 INT1IP0 4404
IPC6 00B0 — T4IP2 T4IP1 T4IP0 — OC4IP2 OC4IP1 OC4IP0 — OC3IP2 OC3IP1 OC3IP0 — — — — 4440
IPC7 00B2 — U2TXIP2 U2TXIP1 U2TXIP0 — U2RXIP2 U2RXIP1 U2RXIP0 — INT2IP2 INT2IP1 INT2IP0 — T5IP2 T5IP1 T5IP0 4444
IPC8 00B4 — — — — — — — — — SPI2IP2 SPI2IP1 SPI2IP0 — SPF2IP2 SPF2IP1 SPF2IP0 0044
IPC9 00B6 — IC5IP2 IC5IP1 IC5IP0 — IC4IP2 IC4IP1 IC4IP0 — IC3IP2 IC3IP1 IC3IP0 — — — — 4440
IPC10 00B8 — OC7IP2 OC7IP1 OC7IP0 — OC6IP2 OC6IP1 OC6IP0 — OC5IP2 OC5IP1 OC5IP0 — IC6IP2 IC6IP1 IC6IP0 4444
IPC11 00BA — — — — — — — — — PMPIP2 PMPIP1 PMPIP0 — OC8IP2 OC8IP1 OC8IP0 0044
IPC12 00BC — — — — — MI2C2P2 MI2C2P1 MI2C2P0 — SI2C2P2 SI2C2P1 SI2C2P0 — — — — 0440
IPC13 00BE — — — — — INT4IP2 INT4IP1 INT4IP0 — INT3IP2 INT3IP1 INT3IP0 — — — — 0440
IPC15 00C2 — — — — — RTCIP2 RTCIP1 RTCIP0 — — — — — — — — 0400
IPC16 00C4 — CRCIP2 CRCIP1 CRCIP0 — U2ERIP2 U2ERIP1 U2ERIP0 — U1ERIP2 U1ERIP1 U1ERIP0 — — — — 4440
IPC18 00C8 — — — — — — — — — — — — — LVDIP2 LVDIP1 LVDIP0 0004
IPC19 00CA — — — — — — — — — CTMUIP2 CTMUIP1 CTMUIP0 — — — — 0040
IPC20 00CC — U3TXIP2 U3TXIP1 U3TXIP0 — U3RXIP2 U3RXIP1 U3RXIP0 — U3ERIP2 U3ERIP1 U3ERIP0 — — — — 4440
IPC21 00CE — U4ERIP2 U4ERIP1 U4ERIP0 — USB1IP2 USB1IP1 USB1IP0 — MI2C3P2 MI2C3P1 MI2C3P0 — SI2C3P2 SI2C3P1 SI2C3P0 4444
IPC22 00D0 — SPI3IP2 SPI3IP1 SPI3IP0 — SPF3IP2 SPF3IP1 SPF3IP0 — U4TXIP2 U4TXIP1 U4TXIP0 — U4RXIP2 U4RXIP1 U4RXIP0 4444
IPC23 00D2 — — — — — — — — — IC9IP2 IC9IP1 IC9IP0 — OC9IP2 OC9IP1 OC9IP0 0044
INTTREG 00E0 CPUIRQ — VHOLD — ILR3 ILR2 ILR1 ILR0 — VECNUM6 VECNUM5 VECNUM4 VECNUM3 VECNUM2 VECNUM1 VECNUM0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
PIC24FJ256GB110 FAMILY
DS39897C-page 46 2009 Microchip Technology Inc.
TABLE 4-6: TIMER REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TMR1 0100 Timer1 Register 0000
PR1 0102 Timer1 Period Register FFFF
T1CON 0104 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS — 0000
TMR2 0106 Timer2 Register 0000
TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) 0000
TMR3 010A Timer3 Register 0000
PR2 010C Timer2 Period Register FFFF
PR3 010E Timer3 Period Register FFFF
T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000
T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000
TMR4 0114 Timer4 Register 0000
TMR5HLD 0116 Timer5 Holding Register (for 32-bit operations only) 0000
TMR5 0118 Timer5 Register 0000
PR4 011A Timer4 Period Register FFFF
PR5 011C Timer5 Period Register FFFF
T4CON 011E TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000
T5CON 0120 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2009 Microchip Technology Inc. DS39897C-page 47
PIC24FJ256GB110 FAMILY
TABLE 4-7: INPUT CAPTURE REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
IC1CON1 0140 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC1CON2 0142 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC1BUF 0144 Input Capture 1 Buffer Register 0000
IC1TMR 0146 Timer Value 1 Register xxxx
IC2CON1 0148 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC2CON2 014A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC2BUF 014C Input Capture 2 Buffer Register 0000
IC2TMR 014E Timer Value 2 Register xxxx
IC3CON1 0150 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC3CON2 0152 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC3BUF 0154 Input Capture 3 Buffer Register 0000
IC3TMR 0156 Timer Value 3 Register xxxx
IC4CON1 0158 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC4CON2 015A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC4BUF 015C Input Capture 4 Buffer Register 0000
IC4TMR 015E Timer Value 4 Register xxxx
IC5CON1 0160 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC5CON2 0162 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC5BUF 0164 Input Capture 5 Buffer Register 0000
IC5TMR 0166 Timer Value 5 Register xxxx
IC6CON1 0168 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC6CON2 016A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC6BUF 016C Input Capture 6 Buffer Register 0000
IC6TMR 016E Timer Value 6 Register xxxx
IC7CON1 0170 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC7CON2 0172 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC7BUF 0174 Input Capture 7 Buffer Register 0000
IC7TMR 0176 Timer Value 7 Register xxxx
IC8CON1 0178 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC8CON2 017A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC8BUF 017C Input Capture 8 Buffer Register 0000
IC8TMR 017E Timer Value 8 Register xxxx
IC9CON1 0180 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC9CON2 0182 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC9BUF 0184 Input Capture 9 Buffer Register 0000
IC9TMR 0186 Timer Value 9 Register xxxx
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
PIC24FJ256GB110 FAMILY
DS39897C-page 48 2009 Microchip Technology Inc.
TABLE 4-8: OUTPUT COMPARE REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
OC1CON1 0190 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC1CON2 0192 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC1RS 0194 Output Compare 1 Secondary Register 0000
OC1R 0196 Output Compare 1 Register 0000
OC1TMR 0198 Timer Value 1 Register xxxx
OC2CON1 019A — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC2CON2 019C FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC2RS 019E Output Compare 2 Secondary Register 0000
OC2R 01A0 Output Compare 2 Register 0000
OC2TMR 01A2 Timer Value 2 Register xxxx
OC3CON1 01A4 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC3CON2 01A6 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC3RS 01A8 Output Compare 3 Secondary Register 0000
OC3R 01AA Output Compare 3 Register 0000
OC3TMR 01AC Timer Value 3 Register xxxx
OC4CON1 01AE — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC4CON2 01B0 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC4RS 01B2 Output Compare 4 Secondary Register 0000
OC4R 01B4 Output Compare 4 Register 0000
OC4TMR 01B6 Timer Value 4 Register xxxx
OC5CON1 01B8 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC5CON2 01BA FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC5RS 01BC Output Compare 5 Secondary Register 0000
OC5R 01BE Output Compare 5 Register 0000
OC5TMR 01C0 Timer Value 5 Register xxxx
OC6CON1 01C2 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC6CON2 01C4 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC6RS 01C6 Output Compare 6 Secondary Register 0000
OC6R 01C8 Output Compare 6 Register 0000
OC6TMR 01CA Timer Value 6 Register xxxx
OC7CON1 01CC — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC7CON2 01CE FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC7RS 01D0 Output Compare 7 Secondary Register 0000
OC7R 01D2 Output Compare 7 Register 0000
OC7TMR 01D4 Timer Value 7 Register xxxx
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2009 Microchip Technology Inc. DS39897C-page 49
PIC24FJ256GB110 FAMILY
OC8CON1 01D6 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC8CON2 01D8 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC8RS 01DA Output Compare 8 Secondary Register 0000
OC8R 01DC Output Compare 8 Register 0000
OC8TMR 01DE Timer Value 8 Register xxxx
OC9CON1 01E0 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000
OC9CON2 01E2 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC9RS 01E4 Output Compare 9 Secondary Register 0000
OC9R 01E6 Output Compare 9 Register 0000
OC9TMR 01E8 Timer Value 9 Register xxxx
TABLE 4-8: OUTPUT COMPARE REGISTER MAP (CONTINUED)
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-9: I2C™ REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
I2C1RCV 0200 — — — — — — — — Receive Register 0000
I2C1TRN 0202 — — — — — — — — Transmit Register 00FF
I2C1BRG 0204 — — — — — — — Baud Rate Generator Register 0000
I2C1CON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
I2C1STAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000
I2C1ADD 020A — — — — — — Address Register 0000
I2C1MSK 020C — — — — — — Address Mask Register 0000
I2C2RCV 0210 — — — — — — — — Receive Register 0000
I2C2TRN 0212 — — — — — — — — Transmit Register 00FF
I2C2BRG 0214 — — — — — — — Baud Rate Generator Register 0000
I2C2CON 0216 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
I2C2STAT 0218 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000
I2C2ADD 021A — — — — — — Address Register 0000
I2C2MSK 021C — — — — — — Address Mask Register 0000
I2C3RCV 0270 — — — — — — — — Receive Register 0000
I2C3TRN 0272 — — — — — — — — Transmit Register 00FF
I2C3BRG 0274 — — — — — — — Baud Rate Generator Register 0000
I2C3CON 0276 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
I2C3STAT 0278 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000
I2C3ADD 027A — — — — — — Address Register 0000
I2C3MSK 027C — — — — — — Address Mask Register 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
PIC24FJ256GB110 FAMILY
DS39897C-page 50 2009 Microchip Technology Inc.
TABLE 4-10: UART REGISTER MAPS
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
U1MODE 0220 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000
U1STA 0222 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110
U1TXREG 0224 — — — — — — — Transmit Register xxxx
U1RXREG 0226 — — — — — — — Receive Register 0000
U1BRG 0228 Baud Rate Generator Prescaler Register 0000
U2MODE 0230 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000
U2STA 0232 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110
U2TXREG 0234 — — — — — — — Transmit Register xxxx
U2RXREG 0236 — — — — — — — Receive Register 0000
U2BRG 0238 Baud Rate Generator Prescaler Register 0000
U3MODE 0250 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000
U3STA 0252 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110
U3TXREG 0254 — — — — — — — Transmit Register xxxx
U3RXREG 0256 — — — — — — — Receive Register 0000
U3BRG 0258 Baud Rate Generator Prescaler Register 0000
U4MODE 02B0 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000
U4STA 02B2 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110
U4TXREG 02B4 — — — — — — — Transmit Register xxxx
U4RXREG 02B6 — — — — — — — Receive Register 0000
U4BRG 02B8 Baud Rate Generator Prescaler Register 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-11: SPI REGISTER MAPS
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
SPI1STAT 0240 SPIEN — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000
SPI1CON1 0242 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000
SPI1CON2 0244 FRMEN SPIFSD SPIFPOL — — — — — — — — — — — SPIFE SPIBEN 0000
SPI1BUF 0248 Transmit and Receive Buffer 0000
SPI2STAT 0260 SPIEN — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000
SPI2CON1 0262 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000
SPI2CON2 0264 FRMEN SPIFSD SPIFPOL — — — — — — — — — — — SPIFE SPIBEN 0000
SPI2BUF 0268 Transmit and Receive Buffer 0000
SPI3STAT 0280 SPIEN — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000
SPI3CON1 0282 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000
SPI3CON2 0284 FRMEN SPIFSD SPIFPOL — — — — — — — — — — — SPIFE SPIBEN 0000
SPI3BUF 0288 Transmit and Receive Buffer 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2009 Microchip Technology Inc. DS39897C-page 51
PIC24FJ256GB110 FAMILY
TABLE 4-12: PORTA REGISTER MAP(1)
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7(2) Bit 6(2) Bit 5(2) Bit 4(2) Bit 3(2) Bit2(2) Bit 1(2) Bit 0(2) All
Resets
TRISA 02C0 TRISA15 TRISA14 — — — TRISA10 TRISA9 — TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 36FF
PORTA 02C2 RA15 RA14 — — — RA10 RA9 — RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx
LATA 02C4 LATA15 LATA14 — — — LATA10 LATA9 — LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 xxxx
ODCA 02C6 ODA15 ODA14 — — — ODA10 ODA9 — ODA7 ODA6 ODA5 ODA4 ODA3 ODA2 ODA1 ODA0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices.
Note 1: PORTA and all associated bits are unimplemented on 64-pin devices and read as ‘0’. Bits are available on 80-pin and 100-pin devices only, unless otherwise noted.
2: Bits are implemented on 100-pin devices only; otherwise read as ‘0’.
TABLE 4-13: PORTB REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF
PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx
LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx
ODCB 02CE ODB15 ODB14 ODB13 ODB12 ODB11 ODB10 ODB9 ODB8 ODB7 ODB6 ODB5 ODB4 ODB3 ODB2 ODB1 ODB0 0000
Legend: Reset values are shown in hexadecimal.
TABLE 4-14: PORTC REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4(1) Bit 3(2) Bit 2(1) Bit 1(2) Bit 0 All
Resets
TRISC 02D0 TRISC15 TRISC14 TRISC13 TRISC12 — — — — — — — TRISC4 TRISC3 TRISC2 TRISC1 — F01E
PORTC 02D2 RC15(3,4) RC14 RC13 RC12(3) — — — — — — — RC4 RC3 RC2 RC1 — xxxx
LATC 02D4 LATC15 LATC14 LATC13 LATC12 — — — — — — — LATC4 LATC3 LATC2 LATC1 — xxxx
ODCC 02D6 ODC15 ODC14 ODC13 ODC12 — — — — — — — ODC4 ODC3 ODC2 ODC1 — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices.
Note 1: Bits are unimplemented on 64-pin and 80-pin devices; read as ‘0’.
2: Bits are unimplemented on 64-pin devices; read as ‘0’.
3: RC12 and RC15 are only available when the Primary Oscillator is disabled or when EC mode is selected (POSCMD<1:0> Configuration bits = 11 or 00); otherwise read as ‘0’.
4: RC15 is only available when the POSCMD<1:0> Configuration bits = 11 or 00 and the OSCIOFN Configuration bit = 1.
TABLE 4-15: PORTD REGISTER MAP
File
Name Addr Bit 15(1) Bit 14(1) Bit 13(1) Bit 12(1) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISD 02D8 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 FFFF
PORTD 02DA RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx
LATD 02DC LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 xxxx
ODCD 02DE ODD15 ODD14 ODD13 ODD12 ODD11 ODD10 ODD9 ODD8 ODD7 ODD6 ODD5 ODD4 ODD3 ODD2 ODD1 ODD0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices.
Note 1: Bits are unimplemented on 64-pin devices; read as ‘0’.
PIC24FJ256GB110 FAMILY
DS39897C-page 52 2009 Microchip Technology Inc.
TABLE 4-16: PORTE REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9(1) Bit 8(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISE 02E0 — — — — — — TRISE9 TRISE8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 03FF
PORTE 02E2 — — — — — — RE9 RE8 RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 xxxx
LATE 02E4 — — — — — — LATE9 LATE8 LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 xxxx
ODCE 02E6 — — — — — — ODE9 ODE8 ODE7 ODE6 ODE5 ODE4 ODE3 ODE2 ODE1 ODE0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices.
Note 1: Bits are unimplemented on 64-pin devices; read as ‘0’.
TABLE 4-17: PORTF REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13(1) Bit 12(1) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2(2) Bit 1 Bit 0 All
Resets
TRISF 02E8 — — TRISF13 TRISF12 — — — — — — TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 31FF
PORTF 02EA — — RF13 RF12 — — — — — — RF5 RF4 RF3 RF2 RF1 RF0 xxxx
LATF 02EC — — LATF13 LATF12 — — — — — — LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 xxxx
ODCF 02EE — — ODF13 ODF12 — — — — — — ODF5 ODF4 ODF3 ODF2 ODF1 ODF0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices.
Note 1: Bits are unimplemented on 64-pin and 80-pin devices; read as ‘0’.
2: Bits are unimplemented on 64-pin devices; read as ‘0’.
TABLE 4-18: PORTG REGISTER MAP
File
Name Addr Bit 15(1) Bit 14(1) Bit 13(1) Bit 12(1) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1(2) Bit 0(2) All
Resets
TRISG 02F0 TRISG15 TRISG14 TRISG13 TRISG12 — — TRISG9 TRISG8 TRISG7 TRISG6 — — TRISG3 TRISG2 TRISG1 TRISG0 F3CF
PORTG 02F2 RG15 RG14 RG13 RG12 — — RG9 RG8 RG7 RG6 — — RG3 RG2 RG1 RG0 xxxx
LATG 02F4 LATG15 LATG14 LATG13 LATG12 — — LATG9 LATG8 LATG7 LATG6 — — LATG3 LATG2 LATG1 LATG0 xxxx
ODCG 02F6 ODG15 ODG14 ODG13 ODG12 — — ODG9 ODG8 ODG7 ODG6 — — ODG3 ODG2 ODG1 ODG0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices.
Note 1: Bits unimplemented on 64-pin and 80-pin devices; read as ‘0’.
2: Bits unimplemented on 64-pin devices; read as ‘0’.
TABLE 4-19: PAD CONFIGURATION REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PADCFG1 02FC — — — — — — — — — — — — — — RTSECSEL PMPTTL 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2009 Microchip Technology Inc. DS39897C-page 53
PIC24FJ256GB110 FAMILY
TABLE 4-20: ADC REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADC1BUF0 0300 ADC Data Buffer 0 xxxx
ADC1BUF1 0302 ADC Data Buffer 1 xxxx
ADC1BUF2 0304 ADC Data Buffer 2 xxxx
ADC1BUF3 0306 ADC Data Buffer 3 xxxx
ADC1BUF4 0308 ADC Data Buffer 4 xxxx
ADC1BUF5 030A ADC Data Buffer 5 xxxx
ADC1BUF6 030C ADC Data Buffer 6 xxxx
ADC1BUF7 030E ADC Data Buffer 7 xxxx
ADC1BUF8 0310 ADC Data Buffer 8 xxxx
ADC1BUF9 0312 ADC Data Buffer 9 xxxx
ADC1BUFA 0314 ADC Data Buffer 10 xxxx
ADC1BUFB 0316 ADC Data Buffer 11 xxxx
ADC1BUFC 0318 ADC Data Buffer 12 xxxx
ADC1BUFD 031A ADC Data Buffer 13 xxxx
ADC1BUFE 031C ADC Data Buffer 14 xxxx
ADC1BUFF 031E ADC Data Buffer 15 xxxx
AD1CON1 0320 ADON — ADSIDL — — — FORM1 FORM0 SSRC2 SSRC1 SSRC0 — — ASAM SAMP DONE 0000
AD1CON2 0322 VCFG2 VCFG1 VCFG0 r — CSCNA — — BUFS — SMPI3 SMPI2 SMPI1 SMPI0 BUFM ALTS 0000
AD1CON3 0324 ADRC r r SAMC4 SAMC3 SAMC2 SAMC1 SAMC0 ADCS7 ADCS6 ADCS5 ADCS4 ADCS3 ADCS2 ADCS1 ADCS0 0000
AD1CHS 0328 CH0NB — — CH0SB4 CH0SB3 CH0SB2 CH0SB1 CH0SB0 CH0NA — — CH0SA4 CH0SA3 CH0SA2 CH0SA1 CH0SA0 0000
AD1PCFGH 032A — — — — — — — — — — — — — — PCFG17 PCFG16 0000
AD1PCFGL 032C PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
AD1CSSL 0330 CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000
Legend: — = unimplemented, read as ‘0’, r = reserved, maintain as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-21: CTMU REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CTMUCON 033C CTMUEN — CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT 0000
CTMUICON 033E ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0 — — — — — — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
PIC24FJ256GB110 FAMILY
DS39897C-page 54 2009 Microchip Technology Inc.
TABLE 4-22: USB OTG REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
U1OTGIR 0480 — — — — — — — — IDIF T1MSECIF LSTATEIF ACTVIF SESVDIF SESENDIF — VBUSVDIF 0000
U1OTGIE 0482 — — — — — — — — IDIE T1MSECIE LSTATEIE ACTVIE SESVDIE SESENDIE — VBUSVDIE 0000
U1OTGSTAT 0484 — — — — — — — — ID — LSTATE — SESVD SESEND — VBUSVD 0000
U1OTGCON 0486 — — — — — — — — DPPULUP DMPULUP DPPULDWN DMPULDWN VBUSON OTGEN VBUSCHG VBUSDIS 0000
U1PWRC 0488 — — — — — — — — UACTPND — — USLPGRD — — USUSPND USBPWR 0000
U1IR 048A(1) — — — — — — — — STALLIF — RESUMEIF IDLEIF TRNIF SOFIF UERRIF URSTIF 0000
— — — — — — — — STALLIF ATTACHIF(1) RESUMEIF IDLEIF TRNIF SOFIF UERRIF DETACHIF(1) 0000
U1IE 048C(1) — — — — — — — — STALLIE — RESUMEIE IDLEIE TRNIE SOFIE UERRIE URSTIE 0000
— — — — — — — — STALLIE ATTACHIE(1) RESUMEIE IDLEIE TRNIE SOFIE UERRIE DETACHIE(1) 0000
U1EIR 048E(1) — — — — — — — — BTSEF — DMAEF BTOEF DFN8EF CRC16EF CRC5EF PIDEF 0000
— — — — — — — — BTSEF — DMAEF BTOEF DFN8EF CRC16EF EOFEF(1) PIDEF 0000
U1EIE 0490(1) — — — — — — — — BTSEE — DMAEE BTOEE DFN8EE CRC16EE CRC5EE PIDEE 0000
— — — — — — — — BTSEE — DMAEE BTOEE DFN8EE CRC16EE EOFEE(1) PIDEE 0000
U1STAT 0492 — — — — — — — — ENDPT3 ENDPT2 ENDPT1 ENDPT0 DIR PPBI — — 0000
U1CON 0494(1) — — — — — — — — — SE0 PKTDIS — HOSTEN RESUME PPBRST USBEN 0000
— — — — — — — — JSTATE(1) SE0 TOKBUSY RESET HOSTEN RESUME PPBRST SOFEN(1) 0000
U1ADDR 0496 — — — — — — — — LSPDEN(1) USB Device Address (DEVADDR) Register 0000
U1BDTP1 0498 — — — — — — — — Buffer Descriptor Table Base Address Register — 0000
U1FRML 049A — — — — — — — — Frame Count Register Low Byte 0000
U1FRMH 049C — — — — — — — — Frame Count Register High Byte 0000
U1TOK(2) 049E — — — — — — — — PID3 PID2 PID1 PID0 EP3 EP2 EP1 EP0 0000
U1SOF(2) 04A0 — — — — — — — — Start-Of-Frame Count Register 0000
U1CNFG1 04A6 — — — — — — — — UTEYE UOEMON — USBSIDL — — PPB1 PPB0 0000
U1CNFG2 04A8 — — — — — — — — — — — PUVBUS EXTI2CEN UVBUSDIS UVCMPDIS UTRDIS 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Alternate register or bit definitions when the module is operating in Host mode.
2: This register is available in Host mode only.
2009 Microchip Technology Inc. DS39897C-page 55
PIC24FJ256GB110 FAMILY
U1EP0 04AA — — — — — — — — LSPD(1) RETRYDIS(1) — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP1 04AC — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP2 04AE — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP3 04B0 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP4 04B2 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP5 04B4 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP6 04B6 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP7 04B8 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP8 04BA — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP9 04BC — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP10 04BE — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP11 04C0 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP12 04C2 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP13 04C4 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP14 04C6 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1EP15 04C8 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
U1PWMRRS 04CC USB Power Supply PWM Duty Cycle Register USB Power Supply PWM Period Register 0000
U1PWMCON 04CE PWMEN — — — — — PWMPOL CNTEN — — — — — — — — 0000
TABLE 4-23: PARALLEL MASTER/SLAVE PORT REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMCON 0600 PMPEN — PSIDL ADRMUX1 ADRMUX0 PTBEEN PTWREN PTRDEN CSF1 CSF0 ALP CS2P CS1P BEP WRSP RDSP 0000
PMMODE 0602 BUSY IRQM1 IRQM0 INCM1 INCM0 MODE16 MODE1 MODE0 WAITB1 WAITB0 WAITM3 WAITM2 WAITM1 WAITM0 WAITE1 WAITE0 0000
PMADDR 0604 CS2 CS1 ADDR13 ADDR12 ADDR11 ADDR10 ADDR9 ADDR8 ADDR7 ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 0000
PMDOUT1 Parallel Port Data Out Register 1 (Buffers 0 and 1) 0000
PMDOUT2 0606 Parallel Port Data Out Register 2 (Buffers 2 and 3) 0000
PMDIN1 0608 Parallel Port Data In Register 1 (Buffers 0 and 1) 0000
PMDIN2 060A Parallel Port Data In Register 2 (Buffers 2 and 3) 0000
PMAEN 060C PTEN15 PTEN14 PTEN13 PTEN12 PTEN11 PTEN10 PTEN9 PTEN8 PTEN7 PTEN6 PTEN5 PTEN4 PTEN3 PTEN2 PTEN1 PTEN0 0000
PMSTAT 060E IBF IBOV — — IB3F IB2F IB1F IB0F OBE OBUF — — OB3E OB2E OB1E OB0E 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-22: USB OTG REGISTER MAP (CONTINUED)
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Alternate register or bit definitions when the module is operating in Host mode.
2: This register is available in Host mode only.
PIC24FJ256GB110 FAMILY
DS39897C-page 56 2009 Microchip Technology Inc.
TABLE 4-24: REAL-TIME CLOCK AND CALENDAR REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ALRMVAL 0620 Alarm Value Register Window Based on ALRMPTR<1:0> xxxx
ALCFGRPT 0622 ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0 ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0 0000
RTCVAL 0624 RTCC Value Register Window Based on RTCPTR<1:0> xxxx
RCFGCAL 0626 RTCEN — RTCWREN RTCSYNC HALFSEC RTCOE RTCPTR1 RTCPTR0 CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 xxxx
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-25: COMPARATORS REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CMSTAT 0630 CMIDL — — — C3EVT C2EVT C1EVT — — — — — C3OUT C2OUT C1OUT 0000
CVRCON 0632 — — — — — — — — CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000
CM1CON 0634 CEN COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 0000
CM2CON 0636 CEN COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 0000
CM3CON 0638 CEN COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-26: CRC REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CRCCON 0640 — — CSIDL VWORD4 VWORD3 VWORD2 VWORD1 VWORD0 CRCFUL CRCMPT — CRCGO PLEN3 PLEN2 PLEN1 PLEN0 0040
CRCXOR 0642 X15 X14 X13 X12 X11 X10 X9 X8 X7 X6 X5 X4 X3 X2 X1 — 0000
CRCDAT 0644 CRC Data Input Register 0000
CRCWDAT 0646 CRC Result Register 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2009 Microchip Technology Inc. DS39897C-page 57
PIC24FJ256GB110 FAMILY
TABLE 4-27: PERIPHERAL PIN SELECT REGISTER MAP
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPINR0 0680 — — INT1R5 INT1R4 INT1R3 INT1R2 INT1R1 INT1R0 — — — — — — — — 3F00
RPINR1 0682 — — INT3R5 INT3R4 INT3R3 INT3R2 INT3R1 INT3R0 — — INT2R5 INT2R4 INT2R3 INT2R2 INT2R1 INT2R0 3F3F
RPINR2 0684 — — — — — — — — — — INT4R5 INT4R4 INT4R3 INT4R2 INT4R1 INT4R0 003F
RPINR3 0686 — — T3CKR5 T3CKR4 T3CKR3 T3CKR2 T3CKR1 T3CKR0 — — T2CKR5 T2CKR4 T2CKR3 T2CKR2 T2CKR1 T2CKR0 3F3F
RPINR4 0688 — — T5CKR5 T5CKR4 T5CKR3 T5CKR2 T5CKR1 T5CKR0 — — T4CKR5 T4CKR4 T4CKR3 T4CKR2 T4CKR1 T4CKR0 3F3F
RPINR7 068E — — IC2R5 IC2R4 IC2R3 IC2R2 IC2R1 IC2R0 — — IC1R5 IC1R4 IC1R3 IC1R2 IC1R1 IC1R0 3F3F
RPINR8 0690 — — IC4R5 IC4R4 IC4R3 IC4R2 IC4R1 IC4R0 — — IC3R5 IC3R4 IC3R3 IC3R2 IC3R1 IC3R0 3F3F
RPINR9 0692 — — IC6R5 IC6R4 IC6R3 IC6R2 IC6R1 IC6R0 — — IC5R5 IC5R4 IC5R3 IC5R2 IC5R1 IC5R0 3F3F
RPINR10 0694 — — IC8R5 IC8R4 IC8R3 IC8R2 IC8R1 IC8R0 — — IC7R5 IC7R4 IC7R3 IC7R2 IC7R1 IC7R0 3F3F
RPINR11 0696 — — OCFBR5 OCFBR4 OCFBR3 OCFBR2 OCFBR1 OCFBR0 — — OCFAR5 OCFAR4 OCFAR3 OCFAR2 OCFAR1 OCFAR0 3F3F
RPINR15 069E — — IC9R5 IC9R4 IC9R3 IC9R2 IC9R1 IC9R0 — — — — — — — — 3F00
RPINR17 06A2 — — U3RXR5 U3RXR4 U3RXR3 U3RXR2 U3RXR1 U3RXR0 — — — — — — — — 3F00
RPINR18 06A4 — — U1CTSR5 U1CTSR4 U1CTSR3 U1CTSR2 U1CTSR1 U1CTSR0 — — U1RXR5 U1RXR4 U1RXR3 U1RXR2 U1RXR1 U1RXR0 3F3F
RPINR19 06A6 — — U2CTSR5 U2CTSR4 U2CTSR3 U2CTSR2 U2CTSR1 U2CTSR0 — — U2RXR5 U2RXR4 U2RXR3 U2RXR2 U2RXR1 U2RXR0 3F3F
RPINR20 06A8 — — SCK1R5 SCK1R4 SCK1R3 SCK1R2 SCK1R1 SCK1R0 — — SDI1R5 SDI1R4 SDI1R3 SDI1R2 SDI1R1 SDI1R0 3F3F
RPINR21 06AA — — U3CTSR5 U3CTSR4 U3CTSR3 U3CTSR2 U3CTSR1 U3CTSR0 — — SS1R5 SS1R4 SS1R3 SS1R2 SS1R1 SS1R0 3F3F
RPINR22 06AC — — SCK2R5 SCK2R4 SCK2R3 SCK2R2 SCK2R1 SCK2R0 — — SDI2R5 SDI2R4 SDI2R3 SDI2R2 SDI2R1 SDI2R0 3F3F
RPINR23 06AE — — — — — — — — — — SS2R5 SS2R4 SS2R3 SS2R2 SS2R1 SS2R0 003F
RPINR27 06B6 — — U4CTSR5 U4CTSR4 U4CTSR3 U4CTSR2 U4CTSR1 U4CTSR0 — — U4RXR5 U4RXR4 U4RXR3 U4RXR2 U4RXR1 U4RXR0 3F3F
RPINR28 06B8 — — SCK3R5 SCK3R4 SCK3R3 SCK3R2 SCK3R1 SCK3R0 — — SDI3R5 SDI3R4 SDI3R3 SDI3R2 SDI3R1 SDI3R0 3F3F
RPINR29 06BA — — — — — — — — — — SS3R5 SS3R4 SS3R3 SS3R2 SS3R1 SS3R0 003F
RPOR0 06C0 — — RP1R5 RP1R4 RP1R3 RP1R2 RP1R1 RP1R0 — — RP0R5 RP0R4 RP0R3 RP0R2 RP0R1 RP0R0 0000
RPOR1 06C2 — — RP3R5 RP3R4 RP3R3 RP3R2 RP3R1 RP3R0 — — RP2R5 RP2R4 RP2R3 RP2R2 RP2R1 RP2R0 0000
RPOR2 06C4 — — RP5R5(1) RP5R4(1) RP5R3(1) RP5R2(1) RP5R1(1) RP5R0(1) — — RP4R5 RP4R4 RP4R3 RP4R2 RP4R1 RP4R0 0000
RPOR3 06C6 — — RP7R5 RP7R4 RP7R3 RP7R2 RP7R1 RP7R0 — — RP6R5 RP6R4 RP6R3 RP6R2 RP6R1 RP6R0 0000
RPOR4 06C8 — — RP9R5 RP9R4 RP9R3 RP9R2 RP9R1 RP9R0 — — RP8R5 RP8R4 RP8R3 RP8R2 RP8R1 RP8R0 0000
RPOR5 06CA — — RP11R5 RP11R4 RP11R3 RP11R2 RP11R1 RP11R0 — — RP10R5 RP10R4 RP10R3 RP10R2 RP10R1 RP10R0 0000
RPOR6 06CC — — RP13R5 RP13R4 RP13R3 RP13R2 RP13R1 RP13R0 — — RP12R5 RP12R4 RP12R3 RP12R2 RP12R1 RP12R0 0000
RPOR7 06CE — — RP15R5(1) RP15R4(1) RP15R3(1) RP15R2(1) RP15R1(1) RP15R0(1) — — RP14R5 RP14R4 RP14R3 RP14R2 RP14R1 RP14R0 0000
RPOR8 06D0 — — RP17R5 RP17R4 RP17R3 RP17R2 RP17R1 RP17R0 — — RP16R5 RP16R4 RP16R3 RP16R2 RP16R1 RP16R0 0000
RPOR9 06D2 — — RP19R5 RP19R4 RP19R3 RP19R2 RP19R1 RP19R0 — — RP18R5 RP18R4 RP18R3 RP18R2 RP18R1 RP18R0 0000
RPOR10 06D4 — — RP21R5 RP21R4 RP21R3 RP21R2 RP21R1 RP21R0 — — RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0 0000
RPOR11 06D6 — — RP23R5 RP23R4 RP23R3 RP23R2 RP23R1 RP23R0 — — RP22R5 RP22R4 RP22R3 RP22R2 RP22R1 RP22R0 0000
RPOR12 06D8 — — RP25R5 RP25R4 RP25R3 RP25R2 RP25R1 RP25R0 — — RP24R5 RP24R4 RP24R3 RP24R2 RP24R1 RP24R0 0000
RPOR13 06DA — — RP27R5 RP27R4 RP27R3 RP27R2 RP27R1 RP27R0 — — RP26R5 RP26R4 RP26R3 RP26R2 RP26R1 RP26R0 0000
RPOR14 06DC — — RP29R5 RP29R4 RP29R3 RP29R2 RP29R1 RP29R0 — — RP28R5 RP28R4 RP28R3 RP28R2 RP28R1 RP28R0 0000
RPOR15 06DE — — RP31R5(2) RP31R4(2) RP31R3(2) RP31R2(2) RP31R1(2) RP31R0(2) — — RP30R5 RP30R4 RP30R3 RP30R2 RP30R1 RP30R0 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Bits are unimplemented on 64-pin devices; read as ‘0’.
2: Bits are unimplemented on 64-pin and 80-pin devices; read as ‘0’.
PIC24FJ256GB110 FAMILY
DS39897C-page 58 2009 Microchip Technology Inc.
TABLE 4-28: SYSTEM REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RCON 0740 TRAPR IOPUWR — — — — CM PMSLP EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR Note 1
OSCCON 0742 — COSC2 COSC1 COSC0 — NOSC2 NOSC1 NOSC0 CLKLOCK IOLOCK LOCK — CF POSCEN SOSCEN OSWEN Note 2
CLKDIV 0744 ROI DOZE2 DOZE1 DOZE0 DOZEN RCDIV2 RCDIV1 RCDIV0 CPDIV1 CPDIV0 — — — — — — 0100
OSCTUN 0748 — — — — — — — — — — TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 0000
REFOCON 074E ROEN — ROSSLP ROSEL RODIV3 RODIV2 RODIV1 RODIV0 — — — — — — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: The Reset value of the RCON register is dependent on the type of Reset event. See Section 6.0 “Resets” for more information.
2: The Reset value of the OSCCON register is dependent on both the type of Reset event and the device configuration. See Section 8.0 “Oscillator Configuration” for more information.
TABLE 4-29: NVM REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
NVMCON 0760 WR WREN WRERR — — — — — — ERASE — — NVMOP3 NVMOP2 NVMOP1 NVMOP0 0000(1)
NVMKEY 0766 — — — — — — — — NVMKEY Register<7:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.
TABLE 4-30: PMD REGISTER MAP
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0770 T5MD T4MD T3MD T2MD T1MD — — — I2C1MD U2MD U1MD SPI2MD SPI1MD — — ADC1MD 0000
PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000
PMD3 0774 — — — — — CMPMD RTCCMD PMPMD CRCMD — — — U3MD I2C3MD I2C2MD — 0000
PMD4 0776 — — — — — — — — — UPWMMD U4MD — REFOMD CTMUMD LVDMD USB1MD 0000
PMD5 0778 — — — — — — — IC9MD — — — — — — — OC9MD 0000
PMD6 077A — — — — — — — — — — — — — — — SPI3MD 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2009 Microchip Technology Inc. DS39897C-page 59
PIC24FJ256GB110 FAMILY
4.2.5 SOFTWARE STACK
In addition to its use as a working register, the W15
register in PIC24F devices is also used as a Software
Stack Pointer. The pointer always points to the first
available free word and grows from lower to higher
addresses. It pre-decrements for stack pops and
post-increments for stack pushes, as shown in
Figure 4-4. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
The Stack Pointer Limit Value register (SPLIM), associated
with the Stack Pointer, sets an upper address
boundary for the stack. SPLIM is uninitialized at Reset.
As is the case for the Stack Pointer, SPLIM<0> is
forced to ‘0’ because all stack operations must be
word-aligned. Whenever an EA is generated using
W15 as a source or destination pointer, the resulting
address is compared with the value in SPLIM. If the
contents of the Stack Pointer (W15) and the SPLIM register
are equal, and a push operation is performed, a
stack error trap will not occur. The stack error trap will
occur on a subsequent push operation. Thus, for
example, if it is desirable to cause a stack error trap
when the stack grows beyond address 2000h in RAM,
initialize the SPLIM with the value, 1FFEh.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0800h. This prevents the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 4-4: CALL STACK FRAME
4.3 Interfacing Program and Data
Memory Spaces
The PIC24F architecture uses a 24-bit wide program
space and 16-bit wide data space. The architecture is
also a modified Harvard scheme, meaning that data
can also be present in the program space. To use this
data successfully, it must be accessed in a way that
preserves the alignment of information in both spaces.
Aside from normal execution, the PIC24F architecture
provides two methods by which program space can be
accessed during operation:
• Using table instructions to access individual bytes
or words anywhere in the program space
• Remapping a portion of the program space into
the data space (program space visibility)
Table instructions allow an application to read or write
to small areas of the program memory. This makes the
method ideal for accessing data tables that need to be
updated from time to time. It also allows access to all
bytes of the program word. The remapping method
allows an application to access a large block of data on
a read-only basis, which is ideal for look ups from a
large table of static data. It can only access the least
significant word of the program word.
4.3.1 ADDRESSING PROGRAM SPACE
Since the address ranges for the data and program
spaces are 16 and 24 bits, respectively, a method is
needed to create a 23-bit or 24-bit program address
from 16-bit data registers. The solution depends on the
interface method to be used.
For table operations, the 8-bit Table Memory Page
Address register (TBLPAG) is used to define a 32K word
region within the program space. This is concatenated
with a 16-bit EA to arrive at a full 24-bit program space
address. In this format, the Most Significant bit of
TBLPAG is used to determine if the operation occurs in
the user memory (TBLPAG<7> = 0) or the configuration
memory (TBLPAG<7> = 1).
For remapping operations, the 8-bit Program Space
Visibility Page Address register (PSVPAG) is used to
define a 16K word page in the program space. When
the Most Significant bit of the EA is ‘1’, PSVPAG is concatenated
with the lower 15 bits of the EA to form a
23-bit program space address. Unlike table operations,
this limits remapping operations strictly to the user
memory area.
Table 4-31 and Figure 4-5 show how the program EA is
created for table operations and remapping accesses
from the data EA. Here, P<23:0> refers to a program
space word, whereas D<15:0> refers to a data space
word.
Note: A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
PC<15:0>
000000000
15 0
W15 (before CALL)
W15 (after CALL)
Stack Grows Towards
Higher Address
0000h
PC<22:16>
POP : [--W15]
PUSH : [W15++]
PIC24FJ256GB110 FAMILY
DS39897C-page 60 2009 Microchip Technology Inc.
TABLE 4-31: PROGRAM SPACE ADDRESS CONSTRUCTION
FIGURE 4-5: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
Access Type Access
Space
Program Space Address
<23> <22:16> <15> <14:1> <0>
Instruction Access
(Code Execution)
User 0 PC<22:1> 0
0xx xxxx xxxx xxxx xxxx xxx0
TBLRD/TBLWT
(Byte/Word Read/Write)
User TBLPAG<7:0> Data EA<15:0>
0xxx xxxx xxxx xxxx xxxx xxxx
Configuration TBLPAG<7:0> Data EA<15:0>
1xxx xxxx xxxx xxxx xxxx xxxx
Program Space Visibility
(Block Remap/Read)
User 0 PSVPAG<7:0> Data EA<14:0>(1)
0 xxxx xxxx xxx xxxx xxxx xxxx
Note 1: Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of
the address is PSVPAG<0>.
Program Counter 0
23 Bits
1
PSVPAG
8 Bits
EA
15 Bits
Program Counter(1)
Select
TBLPAG
8 Bits
EA
16 Bits
Byte Select
0
0
1/0
User/Configuration
Table Operations(2)
Program Space Visibility(1)
Space Select
24 Bits
23 Bits
(Remapping)
1/0
0
Note 1: The LSb of program space addresses is always fixed as ‘0’ in order to maintain word alignment of
data in the program and data spaces.
2: Table operations are not required to be word-aligned. Table read operations are permitted in the
configuration memory space.
2009 Microchip Technology Inc. DS39897C-page 61
PIC24FJ256GB110 FAMILY
4.3.2 DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
The TBLRDL and TBLWTL instructions offer a direct
method of reading or writing the lower word of any
address within the program space without going through
data space. The TBLRDH and TBLWTH instructions are
the only method to read or write the upper 8 bits of a
program space word as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two, 16-bit
word-wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the least significant
data word, and TBLRDH and TBLWTH access the space
which contains the upper data byte.
Two table instructions are provided to move byte or
word-sized (16-bit) data to and from program space.
Both function as either byte or word operations.
1. TBLRDL (Table Read Low): In Word mode, it
maps the lower word of the program space
location (P<15:0>) to a data address (D<15:0>).
In Byte mode, either the upper or lower byte of
the lower program word is mapped to the lower
byte of a data address. The upper byte is
selected when byte select is ‘1’; the lower byte
is selected when it is ‘0’.
2. TBLRDH (Table Read High): In Word mode, it
maps the entire upper word of a program address
(P<23:16>) to a data address. Note that
D<15:8>, the ‘phantom’ byte, will always be ‘0’.
In Byte mode, it maps the upper or lower byte of
the program word to D<7:0> of the data
address, as above. Note that the data will
always be ‘0’ when the upper ‘phantom’ byte is
selected (byte select = 1).
In a similar fashion, two table instructions, TBLWTH
and TBLWTL, are used to write individual bytes or
words to a program space address. The details of
their operation are explained in Section 5.0 “Flash
Program Memory”.
For all table operations, the area of program memory
space to be accessed is determined by the Table
Memory Page Address register (TBLPAG). TBLPAG
covers the entire program memory space of the
device, including user and configuration spaces. When
TBLPAG<7> = 0, the table page is located in the user
memory space. When TBLPAG<7> = 1, the page is
located in configuration space.
FIGURE 4-6: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS
Note: Only table read operations will execute in
the configuration memory space, and only
then, in implemented areas such as the
Device ID. Table write operations are not
allowed.
23 16 8 0
00000000
00000000
00000000
00000000
‘Phantom’ Byte
TBLRDH.B (Wn<0> = 0)
TBLRDL.W
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
23 15 0
TBLPAG
02
000000h
800000h
020000h
030000h
Program Space
Data EA<15:0>
The address for the table operation is determined by the data EA
within the page defined by the TBLPAG register.
Only read operations are shown; write operations are also valid in
the user memory area.
PIC24FJ256GB110 FAMILY
DS39897C-page 62 2009 Microchip Technology Inc.
4.3.3 READING DATA FROM PROGRAM
MEMORY USING PROGRAM SPACE
VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word page of the program space.
This provides transparent access of stored constant
data from the data space without the need to use
special instructions (i.e., TBLRDL/H).
Program space access through the data space occurs if
the Most Significant bit of the data space EA is ‘1’, and
program space visibility is enabled by setting the PSV bit
in the CPU Control register (CORCON<2>). The location
of the program memory space to be mapped into the
data space is determined by the Program Space Visibility
Page Address register (PSVPAG). This 8-bit register
defines any one of 256 possible pages of 16K words in
program space. In effect, PSVPAG functions as the
upper 8 bits of the program memory address, with the
15 bits of the EA functioning as the lower bits. Note that
by incrementing the PC by 2 for each program memory
word, the lower 15 bits of data space addresses directly
map to the lower 15 bits in the corresponding program
space addresses.
Data reads to this area add an additional cycle to the
instruction being executed, since two program memory
fetches are required.
Although each data space address, 8000h and higher,
maps directly into a corresponding program memory
address (see Figure 4-7), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits of any program space locations used as
data should be programmed with ‘1111 1111’ or
‘0000 0000’ to force a NOP. This prevents possible
issues should the area of code ever be accidentally
executed.
For operations that use PSV and are executed outside
a REPEAT loop, the MOV and MOV.D instructions will
require one instruction cycle in addition to the specified
execution time. All other instructions will require two
instruction cycles in addition to the specified execution
time.
For operations that use PSV which are executed inside
a REPEAT loop, there will be some instances that
require two instruction cycles in addition to the
specified execution time of the instruction:
• Execution in the first iteration
• Execution in the last iteration
• Execution prior to exiting the loop due to an
interrupt
• Execution upon re-entering the loop after an
interrupt is serviced
Any other iteration of the REPEAT loop will allow the
instruction accessing data, using PSV, to execute in a
single cycle.
FIGURE 4-7: PROGRAM SPACE VISIBILITY OPERATION
Note: PSV access is temporarily disabled during
table reads/writes.
PSVPAG 23 15 0
Program Space Data Space
0000h
8000h
FFFFh
02
000000h
800000h
010000h
018000h
When CORCON<2> = 1 and EA<15> = 1:
PSV Area
The data in the page
designated by
PSVPAG is mapped
into the upper half of
the data memory
space....
Data EA<14:0>
...while the lower 15
bits of the EA specify
an exact address
within the PSV area.
This corresponds
exactly to the same
lower 15 bits of the
actual program space
address.
2009 Microchip Technology Inc. DS39897C-page 63
PIC24FJ256GB110 FAMILY
5.0 FLASH PROGRAM MEMORY
The PIC24FJ256GB110 family of devices contains
internal Flash program memory for storing and executing
application code. It can be programmed in four
ways:
• In-Circuit Serial Programming™ (ICSP™)
• Run-Time Self-Programming (RTSP)
• JTAG
• Enhanced In-Circuit Serial Programming
(Enhanced ICSP)
ICSP allows a PIC24FJ256GB110 family device to be
serially programmed while in the end application circuit.
This is simply done with two lines for the programming
clock and programming data (which are named PGECx
and PGEDx, respectively), and three other lines for
power (VDD), ground (VSS) and Master Clear (MCLR).
This allows customers to manufacture boards with
unprogrammed devices and then program the microcontroller
just before shipping the product. This also
allows the most recent firmware or a custom firmware
to be programmed.
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions. With RTSP, the user
may write program memory data in blocks of 64 instructions
(192 bytes) at a time, and erase program memory
in blocks of 512 instructions (1536 bytes) at a time.
5.1 Table Instructions and Flash
Programming
Regardless of the method used, all programming of
Flash memory is done with the table read and table
write instructions. These allow direct read and write
access to the program memory space from the data
memory while the device is in normal operating mode.
The 24-bit target address in the program memory is
formed using the TBLPAG<7:0> bits and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 5-1.
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
both Word and Byte modes.
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can also access program memory in Word
or Byte mode.
FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 4. “Program Memory”
(DS39715).
Program Counter 0
24 Bits
Program
TBLPAG Reg
8 Bits
Working Reg EA
16 Bits
Using
Byte
24-Bit EA
0
1/0
Select
Table
Instruction
Counter
Using
User/Configuration
Space Select
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DS39897C-page 64 2009 Microchip Technology Inc.
5.2 RTSP Operation
The PIC24F Flash program memory array is organized
into rows of 64 instructions or 192 bytes. RTSP allows
the user to erase blocks of eight rows (512 instructions)
at a time and to program one row at a time. It is also
possible to program single words.
The 8-row erase blocks and single row write blocks are
edge-aligned, from the beginning of program memory, on
boundaries of 1536 bytes and 192 bytes, respectively.
When data is written to program memory using TBLWT
instructions, the data is not written directly to memory.
Instead, data written using table writes is stored in
holding latches until the programming sequence is
executed.
Any number of TBLWT instructions can be executed
and a write will be successfully performed. However,
64 TBLWT instructions are required to write the full row
of memory.
To ensure that no data is corrupted during a write, any
unused addresses should be programmed with
FFFFFFh. This is because the holding latches reset to
an unknown state, so if the addresses are left in the
Reset state, they may overwrite the locations on rows
which were not rewritten.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the buffers. Programming is performed by
setting the control bits in the NVMCON register.
Data can be loaded in any order and the holding registers
can be written to multiple times before performing
a write operation. Subsequent writes, however, will
wipe out any previous writes.
All of the table write operations are single-word writes
(2 instruction cycles), because only the buffers are written.
A programming cycle is required for programming
each row.
5.3 JTAG Operation
The PIC24F family supports JTAG boundary scan.
Boundary scan can improve the manufacturing
process by verifying pin-to-PCB connectivity.
5.4 Enhanced In-Circuit Serial
Programming
Enhanced In-Circuit Serial Programming uses an
on-board bootloader, known as the program executive,
to manage the programming process. Using an SPI
data frame format, the program executive can erase,
program and verify program memory. For more
information on Enhanced ICSP, see the device
programming specification.
5.5 Control Registers
There are two SFRs used to read and write the
program Flash memory: NVMCON and NVMKEY.
The NVMCON register (Register 5-1) controls which
blocks are to be erased, which memory type is to be
programmed and when the programming cycle starts.
NVMKEY is a write-only register that is used for write
protection. To start a programming or erase sequence,
the user must consecutively write 55h and AAh to the
NVMKEY register. Refer to Section 5.6 “Programming
Operations” for further details.
5.6 Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. During a programming or erase operation, the
processor stalls (waits) until the operation is finished.
Setting the WR bit (NVMCON<15>) starts the
operation and the WR bit is automatically cleared when
the operation is finished.
Note: Writing to a location multiple times without
erasing is not recommended.
2009 Microchip Technology Inc. DS39897C-page 65
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REGISTER 5-1: NVMCON: FLASH MEMORY CONTROL REGISTER
R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0
WR WREN WRERR — — — — —
bit 15 bit 8
U-0 R/W-0(1) U-0 U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1)
— ERASE — — NVMOP3(2) NVMOP2(2) NVMOP1(2) NVMOP0(2)
bit 7 bit 0
Legend: SO = Settable Only bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 WR: Write Control bit(1)
1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is
cleared by hardware once operation is complete.
0 = Program or erase operation is complete and inactive
bit 14 WREN: Write Enable bit(1)
1 = Enable Flash program/erase operations
0 = Inhibit Flash program/erase operations
bit 13 WRERR: Write Sequence Error Flag bit(1)
1 = An improper program or erase sequence attempt or termination has occurred (bit is set
automatically on any set attempt of the WR bit)
0 = The program or erase operation completed normally
bit 12-7 Unimplemented: Read as ‘0’
bit 6 ERASE: Erase/Program Enable bit(1)
1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command
0 = Perform the program operation specified by NVMOP<3:0> on the next WR command
bit 5-4 Unimplemented: Read as ‘0’
bit 3-0 NVMOP<3:0>: NVM Operation Select bits(1,2)
1111 = Memory bulk erase operation (ERASE = 1) or no operation (ERASE = 0)(3)
0011 = Memory word program operation (ERASE = 0) or no operation (ERASE = 1)
0010 = Memory page erase operation (ERASE = 1) or no operation (ERASE = 0)
0001 = Memory row program operation (ERASE = 0) or no operation (ERASE = 1)
Note 1: These bits can only be reset on POR.
2: All other combinations of NVMOP<3:0> are unimplemented.
3: Available in ICSP™ mode only. Refer to device programming specification.
PIC24FJ256GB110 FAMILY
DS39897C-page 66 2009 Microchip Technology Inc.
5.6.1 PROGRAMMING ALGORITHM FOR
FLASH PROGRAM MEMORY
The user can program one row of Flash program memory
at a time. To do this, it is necessary to erase the 8-row
erase block containing the desired row. The general
process is:
1. Read eight rows of program memory
(512 instructions) and store in data RAM.
2. Update the program data in RAM with the
desired new data.
3. Erase the block (see Example 5-1 for an
implementation in assembler):
a) Set the NVMOP bits (NVMCON<3:0>) to
‘0010’ to configure for block erase. Set the
ERASE (NVMCON<6>) and WREN
(NVMCON<14>) bits.
b) Write the starting address of the block to be
erased into the TBLPAG and W registers.
c) Write 55h to NVMKEY.
d) Write AAh to NVMKEY.
e) Set the WR bit (NVMCON<15>). The erase
cycle begins and the CPU stalls for the duration
of the erase cycle. When the erase is
done, the WR bit is cleared automatically.
4. Write the first 64 instructions from data RAM into
the program memory buffers (see Example 5-3
for the implementation in assembler).
5. Write the program block to Flash memory:
a) Set the NVMOP bits to ‘0001’ to configure
for row programming. Clear the ERASE bit
and set the WREN bit.
b) Write 55h to NVMKEY.
c) Write AAh to NVMKEY.
d) Set the WR bit. The programming cycle
begins and the CPU stalls for the duration
of the write cycle. When the write to Flash
memory is done, the WR bit is cleared
automatically.
6. Repeat steps 4 and 5, using the next available
64 instructions from the block in data RAM by
incrementing the value in TBLPAG, until all
512 instructions are written back to Flash
memory.
For protection against accidental operations, the write
initiate sequence for NVMKEY must be used to allow
any erase or program operation to proceed. After the
programming command has been executed, the user
must wait for the programming time until programming
is complete. The two instructions following the start of
the programming sequence should be NOPs, as shown
in Example 5-5.
EXAMPLE 5-1: ERASING A PROGRAM MEMORY BLOCK (ASSEMBLY LANGUAGE CODE)
Note: The equivalent C code for these steps,
prepared using Microchip’s MPLAB C30
compiler and specific library of built-in
hardware functions, is shown in
Examples 5-2, 5-4 and 5-6.
; Set up NVMCON for block erase operation
MOV #0x4042, W0 ;
MOV W0, NVMCON ; Initialize NVMCON
; Init pointer to row to be ERASED
MOV #tblpage(PROG_ADDR), W0 ;
MOV W0, TBLPAG ; Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR), W0 ; Initialize in-page EA[15:0] pointer
TBLWTL W0, [W0] ; Set base address of erase block
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55, W0
MOV W0, NVMKEY ; Write the 55 key
MOV #0xAA, W1 ;
MOV W1, NVMKEY ; Write the AA key
BSET NVMCON, #WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
2009 Microchip Technology Inc. DS39897C-page 67
PIC24FJ256GB110 FAMILY
EXAMPLE 5-2: ERASING A PROGRAM MEMORY BLOCK (C LANGUAGE CODE)
EXAMPLE 5-3: LOADING THE WRITE BUFFERS (ASSEMBLY LANGUAGE CODE)
// C example using MPLAB C30
unsigned long progAddr = 0xXXXXXX; // Address of row to write
unsigned int offset;
//Set up pointer to the first memory location to be written
TBLPAG = progAddr>>16; // Initialize PM Page Boundary SFR
offset = progAddr & 0xFFFF; // Initialize lower word of address
__builtin_tblwtl(offset, 0x0000); // Set base address of erase block
// with dummy latch write
NVMCON = 0x4042; // Initialize NVMCON
asm("DISI #5"); // Block all interrupts with priority <7
// for next 5 instructions
__builtin_write_NVM(); // C30 function to perform unlock
// sequence and set WR
; Set up NVMCON for row programming operations
MOV #0x4001, W0 ;
MOV W0, NVMCON ; Initialize NVMCON
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV #0x0000, W0 ;
MOV W0, TBLPAG ; Initialize PM Page Boundary SFR
MOV #0x6000, W0 ; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV #LOW_WORD_0, W2 ;
MOV #HIGH_BYTE_0, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 1st_program_word
MOV #LOW_WORD_1, W2 ;
MOV #HIGH_BYTE_1, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 2nd_program_word
MOV #LOW_WORD_2, W2 ;
MOV #HIGH_BYTE_2, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
•
•
•
; 63rd_program_word
MOV #LOW_WORD_31, W2 ;
MOV #HIGH_BYTE_31, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0] ; Write PM high byte into program latch
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DS39897C-page 68 2009 Microchip Technology Inc.
EXAMPLE 5-4: LOADING THE WRITE BUFFERS (C LANGUAGE CODE)
EXAMPLE 5-5: INITIATING A PROGRAMMING SEQUENCE (ASSEMBLY LANGUAGE CODE)
EXAMPLE 5-6: INITIATING A PROGRAMMING SEQUENCE (C LANGUAGE CODE)
// C example using MPLAB C30
#define NUM_INSTRUCTION_PER_ROW 64
unsigned int offset;
unsigned int i;
unsigned long progAddr = 0xXXXXXX; // Address of row to write
unsigned int progData[2*NUM_INSTRUCTION_PER_ROW]; // Buffer of data to write
//Set up NVMCON for row programming
NVMCON = 0x4001; // Initialize NVMCON
//Set up pointer to the first memory location to be written
TBLPAG = progAddr>>16; // Initialize PM Page Boundary SFR
offset = progAddr & 0xFFFF; // Initialize lower word of address
//Perform TBLWT instructions to write necessary number of latches
for(i=0; i < 2*NUM_INSTRUCTION_PER_ROW; i++)
{
__builtin_tblwtl(offset, progData[i++]); // Write to address low word
__builtin_tblwth(offset, progData[i]); // Write to upper byte
offset = offset + 2; // Increment address
}
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55, W0
MOV W0, NVMKEY ; Write the 55 key
MOV #0xAA, W1 ;
MOV W1, NVMKEY ; Write the AA key
BSET NVMCON, #WR ; Start the erase sequence
NOP ;
NOP ;
BTSC NVMCON, #15 ; and wait for it to be
BRA $-2 ; completed
// C example using MPLAB C30
asm("DISI #5"); // Block all interrupts with priority < 7
// for next 5 instructions
__builtin_write_NVM(); // Perform unlock sequence and set WR
2009 Microchip Technology Inc. DS39897C-page 69
PIC24FJ256GB110 FAMILY
5.6.2 PROGRAMMING A SINGLE WORD
OF FLASH PROGRAM MEMORY
If a Flash location has been erased, it can be programmed
using table write instructions to write an
instruction word (24-bit) into the write latch. The
TBLPAG register is loaded with the 8 Most Significant
Bytes of the Flash address. The TBLWTL and TBLWTH
instructions write the desired data into the write latches
and specify the lower 16 bits of the program memory
address to write to. To configure the NVMCON register
for a word write, set the NVMOP bits (NVMCON<3:0>)
to ‘0011’. The write is performed by executing the
unlock sequence and setting the WR bit, as shown in
Example 5-7. An equivalent procedure in C, using the
MPLAB C30 compiler and built-in hardware functions,
is shown in Example 5-8.
EXAMPLE 5-7: PROGRAMMING A SINGLE WORD OF FLASH PROGRAM MEMORY
(ASSEMBLY LANGUAGE CODE)
EXAMPLE 5-8: PROGRAMMING A SINGLE WORD OF FLASH PROGRAM MEMORY
(C LANGUAGE CODE)
; Setup a pointer to data Program Memory
MOV #tblpage(PROG_ADDR), W0 ;
MOV W0, TBLPAG ;Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR), W0 ;Initialize a register with program memory address
MOV #LOW_WORD, W2 ;
MOV #HIGH_BYTE, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; Setup NVMCON for programming one word to data Program Memory
MOV #0x4003, W0 ;
MOV W0, NVMCON ; Set NVMOP bits to 0011
DISI #5 ; Disable interrupts while the KEY sequence is written
MOV #0x55, W0 ; Write the key sequence
MOV W0, NVMKEY
MOV #0xAA, W0
MOV W0, NVMKEY
BSET NVMCON, #WR ; Start the write cycle
NOP ; Insert two NOPs after the erase
NOP ; Command is asserted
// C example using MPLAB C30
unsigned int offset;
unsigned long progAddr = 0xXXXXXX; // Address of word to program
unsigned int progDataL = 0xXXXX; // Data to program lower word
unsigned char progDataH = 0xXX; // Data to program upper byte
//Set up NVMCON for word programming
NVMCON = 0x4003; // Initialize NVMCON
//Set up pointer to the first memory location to be written
TBLPAG = progAddr>>16; // Initialize PM Page Boundary SFR
offset = progAddr & 0xFFFF; // Initialize lower word of address
//Perform TBLWT instructions to write latches
__builtin_tblwtl(offset, progDataL); // Write to address low word
__builtin_tblwth(offset, progDataH); // Write to upper byte
asm(“DISI #5”); // Block interrupts with priority < 7
// for next 5 instructions
__builtin_write_NVM(); // C30 function to perform unlock
// sequence and set WR
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DS39897C-page 70 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 71
PIC24FJ256GB110 FAMILY
6.0 RESETS
The Reset module combines all Reset sources and
controls the device Master Reset Signal, SYSRST. The
following is a list of device Reset sources:
• POR: Power-on Reset
• MCLR: Pin Reset
• SWR: RESET Instruction
• WDT: Watchdog Timer Reset
• BOR: Brown-out Reset
• CM: Configuration Mismatch Reset
• TRAPR: Trap Conflict Reset
• IOPUWR: Illegal Opcode Reset
• UWR: Uninitialized W Register Reset
A simplified block diagram of the Reset module is
shown in Figure 6-1.
Any active source of Reset will make the SYSRST
signal active. Many registers associated with the CPU
and peripherals are forced to a known Reset state.
Most registers are unaffected by a Reset; their status is
unknown on POR and unchanged by all other Resets.
All types of device Reset will set a corresponding status
bit in the RCON register to indicate the type of Reset
(see Register 6-1). A Power-on Reset will clear all bits,
except for the BOR and POR bits (RCON<1:0>), which
are set. The user may set or clear any bit at any time
during code execution. The RCON bits only serve as
status bits. Setting a particular Reset status bit in
software will not cause a device Reset to occur.
The RCON register also has other bits associated with
the Watchdog Timer and device power-saving states.
The function of these bits is discussed in other sections
of this manual.
FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 7. “Reset” (DS39712).
Note: Refer to the specific peripheral or CPU
section of this manual for register Reset
states.
Note: The status bits in the RCON register
should be cleared after they are read so
that the next RCON register value after a
device Reset will be meaningful.
MCLR
VDD
VDD Rise
Detect
POR
Sleep or Idle
Brown-out
Reset
Enable Voltage Regulator
RESET
Instruction
WDT
Module
Glitch Filter
BOR
Trap Conflict
Illegal Opcode
Uninitialized W Register
SYSRST
Configuration Mismatch
PIC24FJ256GB110 FAMILY
DS39897C-page 72 2009 Microchip Technology Inc.
REGISTER 6-1: RCON: RESET CONTROL REGISTER(1)
R/W-0, HS R/W-0, HS U-0 U-0 U-0 U-0 R/W-0, HS R/W-0
TRAPR IOPUWR — — — — CM PMSLP
bit 15 bit 8
R/W-0, HS R/W-0, HS R/W-0 R/W-0, HS R/W-0, HS R/W-0, HS R/W-1, HS R/W-1, HS
EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR
bit 7 bit 0
Legend: HS = Hardware settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TRAPR: Trap Reset Flag bit
1 = A Trap Conflict Reset has occurred
0 = A Trap Conflict Reset has not occurred
bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit
1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an Address
Pointer caused a Reset
0 = An illegal opcode or uninitialized W Reset has not occurred
bit 13-10 Unimplemented: Read as ‘0’
bit 9 CM: Configuration Word Mismatch Reset Flag bit
1 = A Configuration Word Mismatch Reset has occurred
0 = A Configuration Word Mismatch Reset has not occurred
bit 8 PMSLP: Program Memory Power During Sleep bit
1 = Program memory bias voltage remains powered during Sleep.
0 = Program memory bias voltage is powered down during Sleep and voltage regulator enters Standby mode.
bit 7 EXTR: External Reset (MCLR) Pin bit
1 = A Master Clear (pin) Reset has occurred
0 = A Master Clear (pin) Reset has not occurred
bit 6 SWR: Software Reset (Instruction) Flag bit
1 = A RESET instruction has been executed
0 = A RESET instruction has not been executed
bit 5 SWDTEN: Software Enable/Disable of WDT bit(2)
1 = WDT is enabled
0 = WDT is disabled
bit 4 WDTO: Watchdog Timer Time-out Flag bit
1 = WDT time-out has occurred
0 = WDT time-out has not occurred
bit 3 SLEEP: Wake From Sleep Flag bit
1 = Device has been in Sleep mode
0 = Device has not been in Sleep mode
bit 2 IDLE: Wake-up From Idle Flag bit
1 = Device has been in Idle mode
0 = Device has not been in Idle mode
bit 1 BOR: Brown-out Reset Flag bit
1 = A Brown-out Reset has occurred. Note that BOR is also set after a Power-on Reset.
0 = A Brown-out Reset has not occurred
bit 0 POR: Power-on Reset Flag bit
1 = A Power-up Reset has occurred
0 = A Power-up Reset has not occurred
Note 1: All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the
SWDTEN bit setting.
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TABLE 6-1: RESET FLAG BIT OPERATION
6.1 Clock Source Selection at Reset
If clock switching is enabled, the system clock source at
device Reset is chosen as shown in Table 6-2. If clock
switching is disabled, the system clock source is always
selected according to the oscillator Configuration bits.
Refer to Section 8.0 “Oscillator Configuration” for
further details.
TABLE 6-2: OSCILLATOR SELECTION vs.
TYPE OF RESET (CLOCK
SWITCHING ENABLED)
6.2 Device Reset Times
The Reset times for various types of device Reset are
summarized in Table 6-3. Note that the system Reset
signal, SYSRST, is released after the POR and PWRT
delay times expire.
The time at which the device actually begins to execute
code will also depend on the system oscillator delays,
which include the Oscillator Start-up Timer (OST) and
the PLL lock time. The OST and PLL lock times occur
in parallel with the applicable SYSRST delay times.
The FSCM delay determines the time at which the
FSCM begins to monitor the system clock source after
the SYSRST signal is released.
Flag Bit Setting Event Clearing Event
TRAPR (RCON<15>) Trap Conflict Event POR
IOPUWR (RCON<14>) Illegal Opcode or Uninitialized W Register Access POR
CM (RCON<9>) Configuration Mismatch Reset POR
EXTR (RCON<7>) MCLR Reset POR
SWR (RCON<6>) RESET Instruction POR
WDTO (RCON<4>) WDT Time-out PWRSAV Instruction, POR
SLEEP (RCON<3>) PWRSAV #SLEEP Instruction POR
IDLE (RCON<2>) PWRSAV #IDLE Instruction POR
BOR (RCON<1>) POR, BOR —
POR (RCON<0>) POR —
Note: All Reset flag bits may be set or cleared by the user software.
Reset Type Clock Source Determinant
POR FNOSC Configuration bits
BOR (CW2<10:8>)
MCLR COSC Control bits
WDTO (OSCCON<14:12>)
SWR
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DS39897C-page 74 2009 Microchip Technology Inc.
TABLE 6-3: RESET DELAY TIMES FOR VARIOUS DEVICE RESETS
Reset Type Clock Source SYSRST Delay System Clock
Delay Notes
POR(6) EC TPOR + TPWRT — 1, 2
FRC, FRCDIV TPOR + TPWRT TFRC 1, 2, 3, 6
LPRC TPOR + TPWRT TLPRC 1, 2, 3
ECPLL TPOR + TPWRT TLOCK 1, 2, 4
FRCPLL TPOR + TPWRT TFRC + TLOCK 1, 2, 3, 4
XT, HS, SOSC TPOR+ TPWRT TOST 1, 2, 5
XTPLL, HSPLL TPOR + TPWRT TOST + TLOCK 1, 2, 4, 5
BOR EC TPWRT — 2
FRC, FRCDIV TPWRT TFRC 2, 3, 6
LPRC TPWRT TLPRC 2, 3
ECPLL TPWRT TLOCK 2, 4
FRCPLL TPWRT TFRC + TLOCK 2, 3, 4
XT, HS, SOSC TPWRT TOST 2, 5
XTPLL, HSPLL TPWRT TFRC + TLOCK 2, 3, 4
All Others Any Clock — — —
Note 1: TPOR = Power-on Reset delay.
2: TPWRT = 64 ms nominal if regulator is disabled (ENVREG tied to VSS).
3: TFRC and TLPRC = RC Oscillator start-up times.
4: TLOCK = PLL lock time.
5: TOST = Oscillator Start-up Timer (OST). A 10-bit counter waits 1024 oscillator periods before releasing
oscillator clock to the system.
6: If Two-Speed Start-up is enabled, regardless of the Primary Oscillator selected, the device starts with
FRC, and in such cases, FRC start-up time is valid.
Note: For detailed operating frequency and timing specifications, see Section 29.0 “Electrical Characteristics”.
2009 Microchip Technology Inc. DS39897C-page 75
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6.2.1 POR AND LONG OSCILLATOR
START-UP TIMES
The oscillator start-up circuitry and its associated delay
timers are not linked to the device Reset delays that
occur at power-up. Some crystal circuits (especially
low-frequency crystals) will have a relatively long
start-up time. Therefore, one or more of the following
conditions is possible after SYSRST is released:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has not expired (if a
crystal oscillator is used).
• The PLL has not achieved a lock (if PLL is used).
The device will not begin to execute code until a valid
clock source has been released to the system. Therefore,
the oscillator and PLL start-up delays must be
considered when the Reset delay time must be known.
6.2.2 FAIL-SAFE CLOCK MONITOR
(FSCM) AND DEVICE RESETS
If the FSCM is enabled, it will begin to monitor the
system clock source when SYSRST is released. If a
valid clock source is not available at this time, the
device will automatically switch to the FRC Oscillator
and the user can switch to the desired crystal oscillator
in the Trap Service Routine.
6.3 Special Function Register Reset
States
Most of the Special Function Registers (SFRs) associated
with the PIC24F CPU and peripherals are reset to a
particular value at a device Reset. The SFRs are
grouped by their peripheral or CPU function and their
Reset values are specified in each section of this manual.
The Reset value for each SFR does not depend on the
type of Reset, with the exception of four registers. The
Reset value for the Reset Control register, RCON, will
depend on the type of device Reset. The Reset value
for the Oscillator Control register, OSCCON, will
depend on the type of Reset and the programmed
values of the FNOSC bits in Flash Configuration
Word 2 (CW2) (see Table 6-2). The RCFGCAL and
NVMCON registers are only affected by a POR.
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DS39897C-page 76 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 77
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7.0 INTERRUPT CONTROLLER
The PIC24F interrupt controller reduces the numerous
peripheral interrupt request signals to a single interrupt
request signal to the PIC24F CPU. It has the following
features:
• Up to 8 processor exceptions and software traps
• 7 user-selectable priority levels
• Interrupt Vector Table (IVT) with up to 118 vectors
• A unique vector for each interrupt or exception
source
• Fixed priority within a specified user priority level
• Alternate Interrupt Vector Table (AIVT) for debug
support
• Fixed interrupt entry and return latencies
7.1 Interrupt Vector Table
The Interrupt Vector Table (IVT) is shown in Figure 7-1.
The IVT resides in program memory, starting at location
000004h. The IVT contains 126 vectors, consisting of
8 non-maskable trap vectors, plus up to 118 sources of
interrupt. In general, each interrupt source has its own
vector. Each interrupt vector contains a 24-bit wide
address. The value programmed into each interrupt
vector location is the starting address of the associated
Interrupt Service Routine (ISR).
Interrupt vectors are prioritized in terms of their natural
priority; this is linked to their position in the vector table.
All other things being equal, lower addresses have a
higher natural priority. For example, the interrupt
associated with vector 0 will take priority over interrupts
at any other vector address.
PIC24FJ256GB110 family devices implement
non-maskable traps and unique interrupts. These are
summarized in Table 7-1 and Table 7-2.
7.1.1 ALTERNATE INTERRUPT VECTOR
TABLE
The Alternate Interrupt Vector Table (AIVT) is located
after the IVT, as shown in Figure 7-1. Access to the
AIVT is provided by the ALTIVT control bit
(INTCON2<15>). If the ALTIVT bit is set, all interrupt
and exception processes will use the alternate vectors
instead of the default vectors. The alternate vectors are
organized in the same manner as the default vectors.
The AIVT supports emulation and debugging efforts by
providing a means to switch between an application
and a support environment without requiring the interrupt
vectors to be reprogrammed. This feature also
enables switching between applications for evaluation
of different software algorithms at run time. If the AIVT
is not needed, the AIVT should be programmed with
the same addresses used in the IVT.
7.2 Reset Sequence
A device Reset is not a true exception because the
interrupt controller is not involved in the Reset process.
The PIC24F devices clear their registers in response to
a Reset which forces the PC to zero. The microcontroller
then begins program execution at location
000000h. The user programs a GOTO instruction at the
Reset address, which redirects program execution to
the appropriate start-up routine.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 8. “Interrupts” (DS39707).
Note: Any unimplemented or unused vector
locations in the IVT and AIVT should be
programmed with the address of a default
interrupt handler routine that contains a
RESET instruction.
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DS39897C-page 78 2009 Microchip Technology Inc.
FIGURE 7-1: PIC24F INTERRUPT VECTOR TABLE
TABLE 7-1: TRAP VECTOR DETAILS
Vector Number IVT Address AIVT Address Trap Source
0 000004h 000104h Reserved
1 000006h 000106h Oscillator Failure
2 000008h 000108h Address Error
3 00000Ah 00010Ah Stack Error
4 00000Ch 00010Ch Math Error
5 00000Eh 00010Eh Reserved
6 000010h 000110h Reserved
7 000012h 000112h Reserved
Reset – GOTO Instruction 000000h
Reset – GOTO Address 000002h
Reserved 000004h
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0 000014h
Interrupt Vector 1
———
Interrupt Vector 52 00007Ch
Interrupt Vector 53 00007Eh
Interrupt Vector 54 000080h
———
Interrupt Vector 116 0000FCh
Interrupt Vector 117 0000FEh
Reserved 000100h
Reserved 000102h
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0 000114h
Interrupt Vector 1
———
Interrupt Vector 52 00017Ch
Interrupt Vector 53 00017Eh
Interrupt Vector 54 000180h
———
Interrupt Vector 116
Interrupt Vector 117 0001FEh
Start of Code 000200h
Decreasing Natural Order Priority
Interrupt Vector Table (IVT)(1)
Alternate Interrupt Vector Table (AIVT)(1)
Note 1: See Table 7-2 for the interrupt vector list.
2009 Microchip Technology Inc. DS39897C-page 79
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TABLE 7-2: IMPLEMENTED INTERRUPT VECTORS
Interrupt Source Vector
Number IVT Address AIVT
Address
Interrupt Bit Locations
Flag Enable Priority
ADC1 Conversion Done 13 00002Eh 00012Eh IFS0<13> IEC0<13> IPC3<6:4>
Comparator Event 18 000038h 000138h IFS1<2> IEC1<2> IPC4<10:8>
CRC Generator 67 00009Ah 00019Ah IFS4<3> IEC4<3> IPC16<14:12>
CTMU Event 77 0000AEh 0001AEh IFS4<13> IEC4<13> IPC19<6:4>
External Interrupt 0 0 000014h 000114h IFS0<0> IEC0<0> IPC0<2:0>
External Interrupt 1 20 00003Ch 00013Ch IFS1<4> IEC1<4> IPC5<2:0>
External Interrupt 2 29 00004Eh 00014Eh IFS1<13> IEC1<13> IPC7<6:4>
External Interrupt 3 53 00007Eh 00017Eh IFS3<5> IEC3<5> IPC13<6:4>
External Interrupt 4 54 000080h 000180h IFS3<6> IEC3<6> IPC13<10:8>
I2C1 Master Event 17 000036h 000136h IFS1<1> IEC1<1> IPC4<6:4>
I2C1 Slave Event 16 000034h 000134h IFS1<0> IEC1<0> IPC4<2:0>
I2C2 Master Event 50 000078h 000178h IFS3<2> IEC3<2> IPC12<10:8>
I2C2 Slave Event 49 000076h 000176h IFS3<1> IEC3<1> IPC12<6:4>
I2C3 Master Event 85 0000BEh 0001BEh IFS5<5> IEC5<5> IPC21<6:4>
I2C3 Slave Event 84 0000BCh 0001BCh IFS5<4> IEC5<4> IPC21<2:0>
Input Capture 1 1 000016h 000116h IFS0<1> IEC0<1> IPC0<6:4>
Input Capture 2 5 00001Eh 00011Eh IFS0<5> IEC0<5> IPC1<6:4>
Input Capture 3 37 00005Eh 00015Eh IFS2<5> IEC2<5> IPC9<6:4>
Input Capture 4 38 000060h 000160h IFS2<6> IEC2<6> IPC9<10:8>
Input Capture 5 39 000062h 000162h IFS2<7> IEC2<7> IPC9<14:12>
Input Capture 6 40 000064h 000164h IFS2<8> IEC2<8> IPC10<2:0>
Input Capture 7 22 000040h 000140h IFS1<6> IEC1<6> IPC5<10:8>
Input Capture 8 23 000042h 000142h IFS1<7> IEC1<7> IPC5<14:12>
Input Capture 9 93 0000CEh 0001CEh IFS5<13> IEC5<13> IPC23<6:4>
Input Change Notification 19 00003Ah 00013Ah IFS1<3> IEC1<3> IPC4<14:12>
LVD Low-Voltage Detect 72 0000A4h 0001A4h IFS4<8> IEC4<8> IPC18<2:0>
Output Compare 1 2 000018h 000118h IFS0<2> IEC0<2> IPC0<10:8>
Output Compare 2 6 000020h 000120h IFS0<6> IEC0<6> IPC1<10:8>
Output Compare 3 25 000046h 000146h IFS1<9> IEC1<9> IPC6<6:4>
Output Compare 4 26 000048h 000148h IFS1<10> IEC1<10> IPC6<10:8>
Output Compare 5 41 000066h 000166h IFS2<9> IEC2<9> IPC10<6:4>
Output Compare 6 42 000068h 000168h IFS2<10> IEC2<10> IPC10<10:8>
Output Compare 7 43 00006Ah 00016Ah IFS2<11> IEC2<11> IPC10<14:12>
Output Compare 8 44 00006Ch 00016Ch IFS2<12> IEC2<12> IPC11<2:0>
Output Compare 9 92 0000CCh 0001CCh IFS5<12> IEC5<12> IPC23<2:0>
Parallel Master Port 45 00006Eh 00016Eh IFS2<13> IEC2<13> IPC11<6:4>
Real-Time Clock/Calendar 62 000090h 000190h IFS3<14> IEC3<14> IPC15<10:8>
SPI1 Error 9 000026h 000126h IFS0<9> IEC0<9> IPC2<6:4>
SPI1 Event 10 000028h 000128h IFS0<10> IEC0<10> IPC2<10:8>
SPI2 Error 32 000054h 000154h IFS2<0> IEC2<0> IPC8<2:0>
SPI2 Event 33 000056h 000156h IFS2<1> IEC2<1> IPC8<6:4>
SPI3 Error 90 0000C8h 0001C8h IFS5<10> IEC5<10> IPC22<10:8>
SPI3 Event 91 0000CAh 0001CAh IFS5<11> IEC5<11> IPC22<14:12>
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DS39897C-page 80 2009 Microchip Technology Inc.
7.3 Interrupt Control and Status
Registers
The PIC24FJ256GB110 family of devices implements
a total of 37 registers for the interrupt controller:
• INTCON1
• INTCON2
• IFS0 through IFS5
• IEC0 through IEC5
• IPC0 through IPC23 (except IPC14 and IPC17)
• INTTREG
Global interrupt control functions are controlled from
INTCON1 and INTCON2. INTCON1 contains the Interrupt
Nesting Disable (NSTDIS) bit, as well as the
control and status flags for the processor trap sources.
The INTCON2 register controls the external interrupt
request signal behavior and the use of the Alternate
Interrupt Vector Table.
The IFSx registers maintain all of the interrupt request
flags. Each source of interrupt has a status bit which is
set by the respective peripherals, or an external signal,
and is cleared via software.
The IECx registers maintain all of the interrupt enable
bits. These control bits are used to individually enable
interrupts from the peripherals or external signals.
The IPCx registers are used to set the interrupt priority
level for each source of interrupt. Each user interrupt
source can be assigned to one of eight priority levels.
The INTTREG register contains the associated interrupt
vector number and the new CPU interrupt priority
level, which are latched into the Vector Number
(VECNUM<6:0>) and the Interrupt Level (ILR<3:0>) bit
fields in the INTTREG register. The new interrupt
priority level is the priority of the pending interrupt.
The interrupt sources are assigned to the IFSx, IECx
and IPCx registers in the order of their vector numbers,
as shown in Table 7-2. For example, the INT0 (External
Interrupt 0) is shown as having a vector number and a
natural order priority of 0. Thus, the INT0IF status bit is
found in IFS0<0>, the INT0IE enable bit in IEC0<0>
and the INT0IP<2:0> priority bits in the first position of
IPC0 (IPC0<2:0>).
Although they are not specifically part of the interrupt
control hardware, two of the CPU Control registers contain
bits that control interrupt functionality. The ALU
STATUS register (SR) contains the IPL<2:0> bits
(SR<7:5>). These indicate the current CPU interrupt
priority level. The user may change the current CPU
priority level by writing to the IPL bits.
The CORCON register contains the IPL3 bit, which
together with IPL<2:0>, indicates the current CPU
priority level. IPL3 is a read-only bit so that trap events
cannot be masked by the user software.
All interrupt registers are described in Register 7-1
through Register 7-39, in the following pages.
Timer1 3 00001Ah 00011Ah IFS0<3> IEC0<3> IPC0<14:12>
Timer2 7 000022h 000122h IFS0<7> IEC0<7> IPC1<14:12>
Timer3 8 000024h 000124h IFS0<8> IEC0<8> IPC2<2:0>
Timer4 27 00004Ah 00014Ah IFS1<11> IEC1<11> IPC6<14:12>
Timer5 28 00004Ch 00014Ch IFS1<12> IEC1<12> IPC7<2:0>
UART1 Error 65 000096h 000196h IFS4<1> IEC4<1> IPC16<6:4>
UART1 Receiver 11 00002Ah 00012Ah IFS0<11> IEC0<11> IPC2<14:12>
UART1 Transmitter 12 00002Ch 00012Ch IFS0<12> IEC0<12> IPC3<2:0>
UART2 Error 66 000098h 000198h IFS4<2> IEC4<2> IPC16<10:8>
UART2 Receiver 30 000050h 000150h IFS1<14> IEC1<14> IPC7<10:8>
UART2 Transmitter 31 000052h 000152h IFS1<15> IEC1<15> IPC7<14:12>
UART3 Error 81 0000B6h 0001B6h IFS5<1> IEC5<1> IPC20<6:4>
UART3 Receiver 82 0000B8h 0001B8h IFS5<2> IEC5<2> IPC20<10:8>
UART3 Transmitter 83 0000BAh 0001BAh IFS5<3> IEC5<3> IPC20<14:12>
UART4 Error 87 0000C2h 0001C2h IFS5<7> IEC5<7> IPC21<14:12>
UART4 Receiver 88 0000C4h 0001C4h IFS5<8> IEC5<8> IPC22<2:0>
UART4 Transmitter 89 0000C6h 0001C6h IFS5<9> IEC5<9> IPC22<6:4>
USB Interrupt 86 0000C0h 0001C0h IFS5<6> IEC5<6> IPC21<10:8>
TABLE 7-2: IMPLEMENTED INTERRUPT VECTORS (CONTINUED)
Interrupt Source Vector
Number IVT Address AIVT
Address
Interrupt Bit Locations
Flag Enable Priority
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REGISTER 7-1: SR: ALU STATUS REGISTER (IN CPU)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R-0
— — — — — — — DC(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
IPL2(2,3) IPL1(2,3) IPL0(2,3) RA(1) N(1) OV(1) Z(1) C(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2,3)
111 = CPU interrupt priority level is 7 (15). User interrupts disabled.
110 = CPU interrupt priority level is 6 (14)
101 = CPU interrupt priority level is 5 (13)
100 = CPU interrupt priority level is 4 (12)
011 = CPU interrupt priority level is 3 (11)
010 = CPU interrupt priority level is 2 (10)
001 = CPU interrupt priority level is 1 (9)
000 = CPU interrupt priority level is 0 (8)
Note 1: See Register 3-1 for the description of the remaining bit(s) that are not dedicated to interrupt control
functions.
2: The IPL bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU interrupt priority level.
The value in parentheses indicates the interrupt priority level if IPL3 = 1.
3: The IPL Status bits are read-only when NSTDIS (INTCON1<15>) = 1.
REGISTER 7-2: CORCON: CPU CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R/C-0 R/W-0 U-0 U-0
— — — — IPL3(2) PSV(1) — —
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 3 IPL3: CPU Interrupt Priority Level Status bit(2)
1 = CPU interrupt priority level is greater than 7
0 = CPU interrupt priority level is 7 or less
Note 1: See Register 3-2 for the description of the remaining bit(s) that are not dedicated to interrupt control
functions.
2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level.
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DS39897C-page 82 2009 Microchip Technology Inc.
REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
NSTDIS — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
— — — MATHERR ADDRERR STKERR OSCFAIL —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disabled
0 = Interrupt nesting is enabled
bit 14-5 Unimplemented: Read as ‘0’
bit 4 MATHERR: Arithmetic Error Trap Status bit
1 = Overflow trap has occurred
0 = Overflow trap has not occurred
bit 3 ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
bit 2 STKERR: Stack Error Trap Status bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1 OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 83
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REGISTER 7-4: INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
ALTIVT DISI — — — — — —
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — INT4EP INT3EP INT2EP INT1EP INT0EP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit
1 = Use Alternate Interrupt Vector Table
0 = Use standard (default) vector table
bit 14 DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13-5 Unimplemented: Read as ‘0’
bit 4 INT4EP: External Interrupt 4 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 3 INT3EP: External Interrupt 3 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
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DS39897C-page 84 2009 Microchip Technology Inc.
REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — AD1IF U1TXIF U1RXIF SPI1IF SPF1IF T3IF
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 AD1IF: A/D Conversion Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 SPF1IF: SPI1 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 T3IF: Timer3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 T2IF: Timer2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4 Unimplemented: Read as ‘0’
bit 3 T1IF: Timer1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 INT0IF: External Interrupt 0 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
2009 Microchip Technology Inc. DS39897C-page 85
PIC24FJ256GB110 FAMILY
REGISTER 7-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF —
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IC8IF IC7IF — INT1IF CNIF CMIF MI2C1IF SI2C1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 U2TXIF: UART2 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14 U2RXIF: UART2 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13 INT2IF: External Interrupt 2 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 T5IF: Timer5 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11 T4IF: Timer4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10 OC4IF: Output Compare Channel 4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 OC3IF: Output Compare Channel 3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 Unimplemented: Read as ‘0’
bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 Unimplemented: Read as ‘0’
bit 4 INT1IF: External Interrupt 1 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3 CNIF: Input Change Notification Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 CMIF: Comparator Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 MI2C1IF: Master I2C1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 SI2C1IF: Slave I2C1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
PIC24FJ256GB110 FAMILY
DS39897C-page 86 2009 Microchip Technology Inc.
REGISTER 7-7: IFS2: INTERRUPT FLAG STATUS REGISTER 2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — PMPIF OC8IF OC7IF OC6IF OC5IF IC6IF
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0
IC5IF IC4IF IC3IF — — — SPI2IF SPF2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 PMPIF: Parallel Master Port Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 OC8IF: Output Compare Channel 8 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11 OC7IF: Output Compare Channel 7 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10 OC6IF: Output Compare Channel 6 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 OC5IF: Output Compare Channel 5 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 IC6IF: Input Capture Channel 6 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 IC5IF: Input Capture Channel 5 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 IC4IF: Input Capture Channel 4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 IC3IF: Input Capture Channel 3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4-2 Unimplemented: Read as ‘0’
bit 1 SPI2IF: SPI2 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 SPF2IF: SPI2 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
2009 Microchip Technology Inc. DS39897C-page 87
PIC24FJ256GB110 FAMILY
REGISTER 7-8: IFS3: INTERRUPT FLAG STATUS REGISTER 3
U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
— RTCIF — — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0
— INT4IF INT3IF — — MI2C2IF SI2C2IF —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14 RTCIF: Real-Time Clock/Calendar Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13-7 Unimplemented: Read as ‘0’
bit 6 INT4IF: External Interrupt 4 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 INT3IF: External Interrupt 3 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4-3 Unimplemented: Read as ‘0’
bit 2 MI2C2IF: Master I2C2 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 SI2C2IF: Slave I2C2 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 88 2009 Microchip Technology Inc.
REGISTER 7-9: IFS4: INTERRUPT FLAG STATUS REGISTER 4
U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0
— — CTMUIF — — — — LVDIF
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0
— — — — CRCIF U2ERIF U1ERIF —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 CTMUIF: CTMU Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12-9 Unimplemented: Read as ‘0’
bit 8 LVDIF: Low-Voltage Detect Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7-4 Unimplemented: Read as ‘0’
bit 3 CRCIF: CRC Generator Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 U2ERIF: UART2 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 U1ERIF: UART1 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 89
PIC24FJ256GB110 FAMILY
REGISTER 7-10: IFS5: INTERRUPT FLAG STATUS REGISTER 5
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — IC9IF OC9IF SPI3IF SPF3IF U4TXIF U4RXIF
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
U4ERIF USB1IF MI2C3IF SI2C3IF U3TXIF U3RXIF U3ERIF —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 IC9IF: Input Capture Channel 9 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 OC9IF: Output Compare Channel 9 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11 SPI3IF: SPI3 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10 SPF3IF: SPI3 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 U4TXIF: UART4 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 U4RXIF: UART4 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 U4ERIF: UART4 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 USB1IF: USB1 (USB OTG) Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 MI2C3IF: Master I2C3 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4 SI2C3IF: Slave I2C3 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3 U3TXIF: UART3 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 U3RXIF: UART3 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 U3ERIF: UART3 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 90 2009 Microchip Technology Inc.
REGISTER 7-11: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — AD1IE U1TXIE U1RXIE SPI1IE SPF1IE T3IE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 AD1IE: A/D Conversion Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10 SPI1IE: SPI1 Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 SPF1IE: SPI1 Fault Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 T3IE: Timer3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7 T2IE: Timer2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4 Unimplemented: Read as ‘0’
bit 3 T1IE: Timer1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 INT0IE: External Interrupt 0 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
2009 Microchip Technology Inc. DS39897C-page 91
PIC24FJ256GB110 FAMILY
REGISTER 7-12: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
U2TXIE U2RXIE INT2IE(1) T5IE T4IE OC4IE OC3IE —
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IC8IE IC7IE — INT1IE(1) CNIE CMIE MI2C1IE SI2C1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 U2TXIE: UART2 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 14 U2RXIE: UART2 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13 INT2IE: External Interrupt 2 Enable bit(1)
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 T5IE: Timer5 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11 T4IE: Timer4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10 OC4IE: Output Compare Channel 4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 OC3IE: Output Compare Channel 3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 Unimplemented: Read as ‘0’
bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 Unimplemented: Read as ‘0’
bit 4 INT1IE: External Interrupt 1 Enable bit(1)
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3 CNIE: Input Change Notification Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 CMIE: Comparator Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
Note 1: If an external interrupt is enabled, the interrupt input must also be configured to an available RPn or RPIn
pin. See Section 10.4 “Peripheral Pin Select” for more information.
PIC24FJ256GB110 FAMILY
DS39897C-page 92 2009 Microchip Technology Inc.
bit 1 MI2C1IE: Master I2C1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 SI2C1IE: Slave I2C1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
REGISTER 7-12: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 (CONTINUED)
Note 1: If an external interrupt is enabled, the interrupt input must also be configured to an available RPn or RPIn
pin. See Section 10.4 “Peripheral Pin Select” for more information.
2009 Microchip Technology Inc. DS39897C-page 93
PIC24FJ256GB110 FAMILY
REGISTER 7-13: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — PMPIE OC8IE OC7IE OC6IE OC5IE IC6IE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0
IC5IE IC4IE IC3IE — — — SPI2IE SPF2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 PMPIE: Parallel Master Port Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 OC8IE: Output Compare Channel 8 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11 OC7IE: Output Compare Channel 7 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10 OC6IE: Output Compare Channel 6 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 OC5IE: Output Compare Channel 5 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 IC6IE: Input Capture Channel 6 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7 IC5IE: Input Capture Channel 5 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 IC4IE: Input Capture Channel 4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 IC3IE: Input Capture Channel 3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4-2 Unimplemented: Read as ‘0’
bit 1 SPI2IE: SPI2 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 SPF2IE: SPI2 Fault Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
PIC24FJ256GB110 FAMILY
DS39897C-page 94 2009 Microchip Technology Inc.
REGISTER 7-14: IEC3: INTERRUPT ENABLE CONTROL REGISTER 3
U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
— RTCIE — — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0
— INT4IE(1) INT3IE(1) — — MI2C2IE SI2C2IE —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14 RTCIE: Real-Time Clock/Calendar Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13-7 Unimplemented: Read as ‘0’
bit 6 INT4IE: External Interrupt 4 Enable bit(1)
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 INT3IE: External Interrupt 3 Enable bit(1)
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4-3 Unimplemented: Read as ‘0’
bit 2 MI2C2IE: Master I2C2 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 SI2C2IE: Slave I2C2 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 Unimplemented: Read as ‘0’
Note 1: If an external interrupt is enabled, the interrupt input must also be configured to an available RPn or RPIn
pin. See Section 10.4 “Peripheral Pin Select” for more information.
2009 Microchip Technology Inc. DS39897C-page 95
PIC24FJ256GB110 FAMILY
REGISTER 7-15: IEC4: INTERRUPT ENABLE CONTROL REGISTER 4
U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0
— — CTMUIE — — — — LVDIE
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0
— — — — CRCIE U2ERIE U1ERIE —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 CTMUIE: CTMU Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12-9 Unimplemented: Read as ‘0’
bit 8 LVDIE: Low-Voltage Detect Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7-4 Unimplemented: Read as ‘0’
bit 3 CRCIE: CRC Generator Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 U2ERIE: UART2 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 U1ERIE: UART1 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 96 2009 Microchip Technology Inc.
REGISTER 7-16: IEC5: INTERRUPT ENABLE CONTROL REGISTER 5
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — IC9IE OC9IE SPI3IE SPF3IE U4TXIE U4RXIE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
U4ERIE USB1IE MI2C3IE SI2C3IE U3TXIE U3RXIE U3ERIE —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 IC9IE: Input Capture Channel 9 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 OC9IE: Output Compare Channel 9 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11 SPI3IE: SPI3 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10 SPF3IE: SPI3 Fault Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 U4TXIE: UART4 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 U4RXIE: UART4 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7 U4ERIE: UART4 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 USB1IE: USB1 (USB OTG) Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 MI2C3IE: Master I2C3 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4 SI2C3IE: Slave I2C3 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3 U3TXIE: UART3 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 U3RXIE: UART3 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 U3ERIE: UART3 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 97
PIC24FJ256GB110 FAMILY
REGISTER 7-17: IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— T1IP2 T1IP1 T1IP0 — OC1IP2 OC1IP1 OC1IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— IC1IP2 IC1IP1 IC1IP0 — INT0IP2 INT0IP1 INT0IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 98 2009 Microchip Technology Inc.
REGISTER 7-18: IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— T2IP2 T2IP1 T2IP0 — OC2IP2 OC2IP1 OC2IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— IC2IP2 IC2IP1 IC2IP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 99
PIC24FJ256GB110 FAMILY
REGISTER 7-19: IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— U1RXIP2 U1RXIP1 U1RXIP0 — SPI1IP2 SPI1IP1 SPI1IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— SPF1IP2 SPF1IP1 SPF1IP0 — T3IP2 T3IP1 T3IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 SPF1IP<2:0>: SPI1 Fault Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 100 2009 Microchip Technology Inc.
REGISTER 7-20: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— AD1IP2 AD1IP1 AD1IP0 — U1TXIP2 U1TXIP1 U1TXIP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0’
bit 6-4 AD1IP<2:0>: A/D Conversion Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
2009 Microchip Technology Inc. DS39897C-page 101
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REGISTER 7-21: IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— CNIP2 CNIP1 CNIP0 — CMIP2 CMIP1 CMIP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— MI2C1P2 MI2C1P1 MI2C1P0 — SI2C1P2 SI2C1P1 SI2C1P0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 CNIP<2:0>: Input Change Notification Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 CMIP<2:0>: Comparator Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 MI2C1P<2:0>: Master I2C1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 SI2C1P<2:0>: Slave I2C1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 102 2009 Microchip Technology Inc.
REGISTER 7-22: IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— IC8IP2 IC8IP1 IC8IP0 — IC7IP2 IC7IP1 IC7IP0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
— — — — — INT1IP2 INT1IP1 INT1IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7-3 Unimplemented: Read as ‘0’
bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
2009 Microchip Technology Inc. DS39897C-page 103
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REGISTER 7-23: IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— T4IP2 T4IP1 T4IP0 — OC4IP2 OC4IP1 OC4IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— OC3IP2 OC3IP1 OC3IP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 T4IP<2:0>: Timer4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 OC4IP<2:0>: Output Compare Channel 4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 OC3IP<2:0>: Output Compare Channel 3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
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DS39897C-page 104 2009 Microchip Technology Inc.
REGISTER 7-24: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— U2TXIP2 U2TXIP1 U2TXIP0 — U2RXIP2 U2RXIP1 U2RXIP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— INT2IP2 INT2IP1 INT2IP0 — T5IP2 T5IP1 T5IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 U2TXIP<2:0>: UART2 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 U2RXIP<2:0>: UART2 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 T5IP<2:0>: Timer5 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
2009 Microchip Technology Inc. DS39897C-page 105
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REGISTER 7-25: IPC8: INTERRUPT PRIORITY CONTROL REGISTER 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— SPI2IP2 SPI2IP1 SPI2IP0 — SPF2IP2 SPF2IP1 SPF2IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0’
bit 6-4 SPI2IP<2:0>: SPI2 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 SPF2IP<2:0>: SPI2 Fault Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 106 2009 Microchip Technology Inc.
REGISTER 7-26: IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— IC5IP2 IC5IP1 IC5IP0 — IC4IP2 IC4IP1 IC4IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— IC3IP2 IC3IP1 IC3IP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 IC5IP<2:0>: Input Capture Channel 5 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 IC4IP<2:0>: Input Capture Channel 4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 IC3IP<2:0>: Input Capture Channel 3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 107
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REGISTER 7-27: IPC10: INTERRUPT PRIORITY CONTROL REGISTER 10
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— OC7IP2 OC7IP1 OC7IP0 — OC6IP2 OC6IP1 OC6IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— OC5IP2 OC5IP1 OC5IP0 — IC6IP2 IC6IP1 IC6IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 OC7IP<2:0>: Output Compare Channel 7 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 OC6IP<2:0>: Output Compare Channel 6 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 OC5IP<2:0>: Output Compare Channel 5 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 IC6IP<2:0>: Input Capture Channel 6 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 108 2009 Microchip Technology Inc.
REGISTER 7-28: IPC11: INTERRUPT PRIORITY CONTROL REGISTER 11
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— PMPIP2 PMPIP1 PMPIP0 — OC8IP2 OC8IP1 OC8IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0’
bit 6-4 PMPIP<2:0>: Parallel Master Port Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 OC8IP<2:0>: Output Compare Channel 8 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
2009 Microchip Technology Inc. DS39897C-page 109
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REGISTER 7-29: IPC12: INTERRUPT PRIORITY CONTROL REGISTER 12
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
— — — — — MI2C2P2 MI2C2P1 MI2C2P0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— SI2C2P2 SI2C2P1 SI2C2P0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 MI2C2P<2:0>: Master I2C2 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 SI2C2P<2:0>: Slave I2C2 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 110 2009 Microchip Technology Inc.
REGISTER 7-30: IPC13: INTERRUPT PRIORITY CONTROL REGISTER 13
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
— — — — — INT4IP2 INT4IP1 INT4IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— INT3IP2 INT3IP1 INT3IP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 INT4IP<2:0>: External Interrupt 4 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 INT3IP<2:0>: External Interrupt 3 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 111
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REGISTER 7-31: IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
— — — — — RTCIP2 RTCIP1 RTCIP0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 RTCIP<2:0>: Real-Time Clock/Calendar Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7-0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 112 2009 Microchip Technology Inc.
REGISTER 7-32: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— CRCIP2 CRCIP1 CRCIP0 — U2ERIP2 U2ERIP1 U2ERIP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— U1ERIP2 U1ERIP1 U1ERIP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 CRCIP<2:0>: CRC Generator Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 U2ERIP<2:0>: UART2 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 U1ERIP<2:0>: UART1 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 113
PIC24FJ256GB110 FAMILY
REGISTER 7-33: IPC18: INTERRUPT PRIORITY CONTROL REGISTER 18
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
— — — — — LVDIP2 LVDIP1 LVDIP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Unimplemented: Read as ‘0’
bit 2-0 LVDIP<2:0>: Low-Voltage Detect Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
REGISTER 7-34: IPC19: INTERRUPT PRIORITY CONTROL REGISTER 19
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— CTMUIP2 CTMUIP1 CTMUIP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0’
bit 6-4 CTMUIP<2:0>: CTMU Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 114 2009 Microchip Technology Inc.
REGISTER 7-35: IPC20: INTERRUPT PRIORITY CONTROL REGISTER 20
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— U3TXIP2 U3TXIP1 U3TXIP0 — U3RXIP2 U3RXIP1 U3RXIP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
— U3ERIP2 U3ERIP1 U3ERIP0 — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 U3TXIP<2:0>: UART3 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 U3RXIP<2:0>: UART3 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 U3ERIP<2:0>: UART3 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 115
PIC24FJ256GB110 FAMILY
REGISTER 7-36: IPC21: INTERRUPT PRIORITY CONTROL REGISTER 21
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— U4ERIP2 U4ERIP1 U4ERIP0 — USB1IP2 USB1IP1 USB1IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— MI2C3P2 MI2C3P1 MI2C3P0 — SI2C3P2 SI2C3P1 SI2C3P0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 U4ERIP<2:0>: UART4 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 USB1IP<2:0>: USB1 (USB OTG) Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 MI2C3P<2:0>: Master I2C3 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 SI2C3P<2:0>: Slave I2C3 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 116 2009 Microchip Technology Inc.
REGISTER 7-37: IPC22: INTERRUPT PRIORITY CONTROL REGISTER 22
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— SPI3IP2 SPI3IP1 SPI3IP0 — SPF3IP2 SPF3IP1 SPF3IP0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— U4TXIP2 U4TXIP1 U4TXIP0 — U4RXIP2 U4RXIP1 U4RXIP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 SPI3IP<2:0>: SPI3 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0’
bit 10-8 SPF3IP<2:0>: SPI3 Fault Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0’
bit 6-4 U4TXIP<2:0>: UART4 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 U4RXIP<2:0>: UART4 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
2009 Microchip Technology Inc. DS39897C-page 117
PIC24FJ256GB110 FAMILY
REGISTER 7-38: IPC23: INTERRUPT PRIORITY CONTROL REGISTER 23
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
— IC9IP2 IC9IP1 IC9IP0 — OC9IP2 OC9IP1 OC9IP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0’
bit 6-4 IC9IP<2:0>: Input Capture Channel 9 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0’
bit 2-0 OC9IP<2:0>: Output Compare Channel 9 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•••
001 = Interrupt is priority 1
000 = Interrupt source is disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 118 2009 Microchip Technology Inc.
REGISTER 7-39: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
R-0 U-0 R/W-0 U-0 R-0 R-0 R-0 R-0
CPUIRQ — VHOLD — ILR3 ILR2 ILR1 ILR0
bit 15 bit 8
U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
— VECNUM6 VECNUM5 VECNUM4 VECNUM3 VECNUM2 VECNUM1 VECNUM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CPUIRQ: Interrupt Request from Interrupt Controller CPU bit
1 = An interrupt request has occurred but has not yet been Acknowledged by the CPU; this happens
when the CPU priority is higher than the interrupt priority
0 = No interrupt request is unacknowledged
bit 14 Unimplemented: Read as ‘0’
bit 13 VHOLD: Vector Number Capture Configuration bit
1 = VECNUM contains the value of the highest priority pending interrupt
0 = VECNUM contains the value of the last Acknowledged interrupt (i.e., the last interrupt that has
occurred with higher priority than the CPU, even if other interrupts are pending)
bit 12 Unimplemented: Read as ‘0’
bit 11-8 ILR<3:0>: New CPU Interrupt Priority Level bits
1111 = CPU Interrupt Priority Level is 15
•••
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7 Unimplemented: Read as ‘0’
bit 6-0 VECNUM<6:0>: Pending Interrupt Vector ID bits (pending vector number is VECNUM + 8)
0111111 = Interrupt vector pending is number 135
•••
0000001 = Interrupt vector pending is number 9
0000000 = Interrupt vector pending is number 8
2009 Microchip Technology Inc. DS39897C-page 119
PIC24FJ256GB110 FAMILY
7.4 Interrupt Setup Procedures
7.4.1 INITIALIZATION
To configure an interrupt source:
1. Set the NSTDIS Control bit (INTCON1<15>) if
nested interrupts are not desired.
2. Select the user-assigned priority level for the
interrupt source by writing the control bits in the
appropriate IPCx register. The priority level will
depend on the specific application and type of
interrupt source. If multiple priority levels are not
desired, the IPCx register control bits for all
enabled interrupt sources may be programmed
to the same non-zero value.
3. Clear the interrupt flag status bit associated with
the peripheral in the associated IFSx register.
4. Enable the interrupt source by setting the
interrupt enable control bit associated with the
source in the appropriate IECx register.
7.4.2 INTERRUPT SERVICE ROUTINE
The method that is used to declare an ISR and initialize
the IVT with the correct vector address will depend on
the programming language (i.e., ‘C’ or assembler) and
the language development toolsuite that is used to
develop the application. In general, the user must clear
the interrupt flag in the appropriate IFSx register for the
source of the interrupt that the ISR handles. Otherwise,
the ISR will be re-entered immediately after exiting the
routine. If the ISR is coded in assembly language, it
must be terminated using a RETFIE instruction to
unstack the saved PC value, SRL value and old CPU
priority level.
7.4.3 TRAP SERVICE ROUTINE
A Trap Service Routine (TSR) is coded like an ISR,
except that the appropriate trap status flag in the
INTCON1 register must be cleared to avoid re-entry
into the TSR.
7.4.4 INTERRUPT DISABLE
All user interrupts can be disabled using the following
procedure:
1. Push the current SR value onto the software
stack using the PUSH instruction.
2. Force the CPU to priority level 7 by inclusive
ORing the value E0h with SRL.
To enable user interrupts, the POP instruction may be
used to restore the previous SR value.
Note that only user interrupts with a priority level of 7 or
less can be disabled. Trap sources (level 8-15) cannot
be disabled.
The DISI instruction provides a convenient way to
disable interrupts of priority levels 1-6 for a fixed period
of time. Level 7 interrupt sources are not disabled by
the DISI instruction.
Note: At a device Reset, the IPCx registers are
initialized, such that all user interrupt
sources are assigned to priority level 4.
PIC24FJ256GB110 FAMILY
DS39897C-page 120 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 121
PIC24FJ256GB110 FAMILY
8.0 OSCILLATOR
CONFIGURATION
The oscillator system for PIC24FJ256GB110 family
devices has the following features:
• A total of four external and internal oscillator options
as clock sources, providing 11 different clock modes
• An on-chip USB PLL block to provide a stable,
48 MHz clock for the USB module as well as a range
of frequency options for the system clock
• Software-controllable switching between various
clock sources
• Software-controllable postscaler for selective
clocking of CPU for system power savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and permits safe application recovery
or shutdown
• A separate and independently configurable system
clock output for synchronizing external hardware
A simplified diagram of the oscillator system is shown
in Figure 8-1.
FIGURE 8-1: PIC24FJ256GB110 FAMILY CLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 6. “Oscillator” (DS39700).
PIC24FJ256GB110 Family
Secondary Oscillator
SOSCEN
Enable
Oscillator
SOSCO
SOSCI
Clock Source Option
for Other Modules
OSCI
OSCO
Primary Oscillator
XT, HS, EC
CPU
Peripherals
Postscaler
CLKDIV<10:8>
WDT, PWRT
8 MHz
FRCDIV
31 kHz (nominal)
FRC
Oscillator
LPRC
Oscillator
SOSC
LPRC
Postscaler
Clock Control Logic
Fail-Safe
Clock
Monitor
CLKDIV<14:12>
FRC
CLKO
(nominal)
XTPLL, HSPLL
ECPLL,FRCPLL
8 MHz
4 MHz
PLL &
DIV
PLLDIV<2:0> CPDIV<1:0>
48 MHz USB Clock
USB PLL
Reference Clock
Generator
REFO
REFOCON<15:8>
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DS39897C-page 122 2009 Microchip Technology Inc.
8.1 CPU Clocking Scheme
The system clock source can be provided by one of
four sources:
• Primary Oscillator (POSC) on the OSCI and
OSCO pins
• Secondary Oscillator (SOSC) on the SOSCI and
SOSCO pins
• Fast Internal RC (FRC) Oscillator
• Low-Power Internal RC (LPRC) Oscillator
The Primary Oscillator and FRC sources have the
option of using the internal USB PLL block, which
generates both the USB module clock and a separate
system clock from the 96 MHZ PLL. Refer to
Section 8.5 “Oscillator Modes and USB Operation”
for additional information.
The Fast Internal FRC provides an 8 MHz clock
source. It can optionally be reduced by the programmable
clock divider to provide a range of system clock
frequencies.
The selected clock source generates the processor and
peripheral clock sources. The processor clock source is
divided by two to produce the internal instruction cycle
clock, FCY. In this document, the instruction cycle clock
is also denoted by FOSC/2. The internal instruction cycle
clock, FOSC/2, can be provided on the OSCO I/O pin for
some operating modes of the Primary Oscillator.
8.2 Initial Configuration on POR
The oscillator source (and operating mode) that is used
at a device Power-on Reset event is selected using
Configuration bit settings. The oscillator Configuration
bit settings are located in the Configuration registers in
the program memory (refer to Section 26.1 “Configuration
Bits” for further details). The Primary Oscillator
Configuration bits, POSCMD<1:0> (Configuration
Word 2<1:0>), and the Initial Oscillator Select Configuration
bits, FNOSC<2:0> (Configuration Word 2<10:8>),
select the oscillator source that is used at a Power-on
Reset. The FRC Primary Oscillator with Postscaler
(FRCDIV) is the default (unprogrammed) selection. The
Secondary Oscillator, or one of the internal oscillators,
may be chosen by programming these bit locations.
The Configuration bits allow users to choose between
the various clock modes, shown in Table 8-1.
8.2.1 CLOCK SWITCHING MODE
CONFIGURATION BITS
The FCKSM Configuration bits (Configuration
Word 2<7:6>) are used to jointly configure device clock
switching and the Fail-Safe Clock Monitor (FSCM).
Clock switching is enabled only when FCKSM1 is
programmed (‘0’). The FSCM is enabled only when
FCKSM<1:0> are both programmed (‘00’).
TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode Oscillator Source POSCMD<1:0> FNOSC<2:0> Note
Fast RC Oscillator with Postscaler
(FRCDIV)
Internal 11 111 1, 2
(Reserved) Internal xx 110 1
Low-Power RC Oscillator (LPRC) Internal 11 101 1
Secondary (Timer1) Oscillator
(SOSC)
Secondary 11 100 1
Primary Oscillator (XT) with PLL
Module (XTPLL)
Primary 01 011
Primary Oscillator (EC) with PLL
Module (ECPLL)
Primary 00 011
Primary Oscillator (HS) Primary 10 010
Primary Oscillator (XT) Primary 01 010
Primary Oscillator (EC) Primary 00 010
Fast RC Oscillator with PLL Module
(FRCPLL)
Internal 11 001 1
Fast RC Oscillator (FRC) Internal 11 000 1
Note 1: OSCO pin function is determined by the OSCIOFCN Configuration bit.
2: This is the default oscillator mode for an unprogrammed (erased) device.
2009 Microchip Technology Inc. DS39897C-page 123
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8.3 Control Registers
The operation of the oscillator is controlled by three
Special Function Registers:
• OSCCON
• CLKDIV
• OSCTUN
The OSCCON register (Register 8-1) is the main control
register for the oscillator. It controls clock source
switching and allows the monitoring of clock sources.
The CLKDIV register (Register 8-2) controls the
features associated with Doze mode, as well as the
postscaler for the FRC Oscillator. The OSCTUN
register (Register 8-3) allows the user to fine tune the
FRC Oscillator over a range of approximately ±12%.
REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER
U-0 R-0 R-0 R-0 U-0 R/W-x(1) R/W-x(1) R/W-x(1)
— COSC2 COSC1 COSC0 — NOSC2 NOSC1 NOSC0
bit 15 bit 8
R/SO-0 R/W-0 R-0(3) U-0 R/CO-0 R/W-0 R/W-0 R/W-0
CLKLOCK IOLOCK(2) LOCK — CF POSCEN SOSCEN OSWEN
bit 7 bit 0
Legend: CO = Clear Only bit SO = Set Only bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 COSC<2:0>: Current Oscillator Selection bits
111 = Fast RC Oscillator with Postscaler (FRCDIV)
110 = Reserved
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator with PLL module (XTPLL, HSPLL, ECPLL)
010 = Primary Oscillator (XT, HS, EC)
001 = Fast RC Oscillator with Postscaler and PLL module (FRCPLL)
000 = Fast RC Oscillator (FRC)
bit 11 Unimplemented: Read as ‘0’
bit 10-8 NOSC<2:0>: New Oscillator Selection bits(1)
111 = Fast RC Oscillator with Postscaler (FRCDIV)
110 = Reserved
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator with PLL module (XTPLL, HSPLL, ECPLL)
010 = Primary Oscillator (XT, HS, EC)
001 = Fast RC Oscillator with Postscaler and PLL module (FRCPLL)
000 = Fast RC Oscillator (FRC)
Note 1: Reset values for these bits are determined by the FNOSC Configuration bits.
2: The state of the IOLOCK bit can only be changed once an unlocking sequence has been executed. In
addition, if the IOL1WAY Configuration bit is ‘1’, once the IOLOCK bit is set, it cannot be cleared.
3: Also resets to ‘0’ during any valid clock switch or whenever a non PLL clock mode is selected.
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DS39897C-page 124 2009 Microchip Technology Inc.
bit 7 CLKLOCK: Clock Selection Lock Enabled bit
If FSCM is enabled (FCKSM1 = 1):
1 = Clock and PLL selections are locked
0 = Clock and PLL selections are not locked and may be modified by setting the OSWEN bit
If FSCM is disabled (FCKSM1 = 0):
Clock and PLL selections are never locked and may be modified by setting the OSWEN bit.
bit 6 IOLOCK: I/O Lock Enable bit(2)
1 = I/O lock is active
0 = I/O lock is not active
bit 5 LOCK: PLL Lock Status bit(3)
1 = PLL module is in lock or PLL module start-up timer is satisfied
0 = PLL module is out of lock, PLL start-up timer is running or PLL is disabled
bit 4 Unimplemented: Read as ‘0’
bit 3 CF: Clock Fail Detect bit
1 = FSCM has detected a clock failure
0 = No clock failure has been detected
bit 2 POSCEN: Primary Oscillator Sleep Enable bit
1 = Primary Oscillator continues to operate during Sleep mode
0 = Primary Oscillator disabled during Sleep mode
bit 1 SOSCEN: 32 kHz Secondary Oscillator (SOSC) Enable bit
1 = Enable Secondary Oscillator
0 = Disable Secondary Oscillator
bit 0 OSWEN: Oscillator Switch Enable bit
1 = Initiate an oscillator switch to clock source specified by the NOSC<2:0> bits
0 = Oscillator switch is complete
REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER (CONTINUED)
Note 1: Reset values for these bits are determined by the FNOSC Configuration bits.
2: The state of the IOLOCK bit can only be changed once an unlocking sequence has been executed. In
addition, if the IOL1WAY Configuration bit is ‘1’, once the IOLOCK bit is set, it cannot be cleared.
3: Also resets to ‘0’ during any valid clock switch or whenever a non PLL clock mode is selected.
2009 Microchip Technology Inc. DS39897C-page 125
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REGISTER 8-2: CLKDIV: CLOCK DIVIDER REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
ROI DOZE2 DOZE1 DOZE0 DOZEN(1) RCDIV2 RCDIV1 RCDIV0
bit 15 bit 8
R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
CPDIV1 CPDIV0 — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ROI: Recover on Interrupt bit
1 = Interrupts clear the DOZEN bit and reset the CPU peripheral clock ratio to 1:1
0 = Interrupts have no effect on the DOZEN bit
bit 14-12 DOZE<2:0>: CPU Peripheral Clock Ratio Select bits
111 = 1:128
110 = 1:64
101 = 1:32
100 = 1:16
011 = 1:8
010 = 1:4
001 = 1:2
000 = 1:1
bit 11 DOZEN: DOZE Enable bit(1)
1 = DOZE<2:0> bits specify the CPU peripheral clock ratio
0 = CPU peripheral clock ratio is set to 1:1
bit 10-8 RCDIV<2:0>: FRC Postscaler Select bits
111 = 31.25 kHz (divide-by-256)
110 = 125 kHz (divide-by-64)
101 = 250 kHz (divide-by-32)
100 = 500 kHz (divide-by-16)
011 = 1 MHz (divide-by-8)
010 = 2 MHz (divide-by-4)
001 = 4 MHz (divide-by-2)
000 = 8 MHz (divide-by-1)
bit 7-6 CPDIV<1:0>: USB System Clock Select bits (postscaler select from 32 MHz clock branch)
11 = 4 MHz (divide-by-8)(2)
10 = 8 MHz (divide-by-4)(2)
01 = 16 MHz (divide-by-2)
00 = 32 MHz (divide-by-1)
bit 5-0 Unimplemented: Read as ‘0’
Note 1: This bit is automatically cleared when the ROI bit is set and an interrupt occurs.
2: This setting is not allowed while the USB module is enabled.
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DS39897C-page 126 2009 Microchip Technology Inc.
8.4 Clock Switching Operation
With few limitations, applications are free to switch
between any of the four clock sources (POSC, SOSC,
FRC and LPRC) under software control and at any
time. To limit the possible side effects that could result
from this flexibility, PIC24F devices have a safeguard
lock built into the switching process.
8.4.1 ENABLING CLOCK SWITCHING
To enable clock switching, the FCKSM1 Configuration
bit in CW2 must be programmed to ‘0’. (Refer to
Section 26.1 “Configuration Bits” for further details.)
If the FCKSM1 Configuration bit is unprogrammed (‘1’),
the clock switching function and Fail-Safe Clock
Monitor function are disabled. This is the default
setting.
The NOSCx control bits (OSCCON<10:8>) do not
control the clock selection when clock switching is disabled.
However, the COSCx bits (OSCCON<14:12>)
will reflect the clock source selected by the FNOSCx
Configuration bits.
The OSWEN control bit (OSCCON<0>) has no effect
when clock switching is disabled; it is held at ‘0’ at all
times.
REGISTER 8-3: OSCTUN: FRC OSCILLATOR TUNE REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — TUN5(1) TUN4(1) TUN3(1) TUN2(1) TUN1(1) TUN0(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0’
bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1)
011111 = Maximum frequency deviation
011110 =
000001 =
000000 = Center frequency, oscillator is running at factory calibrated frequency
111111 =
100001 =
100000 = Minimum frequency deviation
Note 1: Increments or decrements of TUN<5:0> may not change the FRC frequency in equal steps over the FRC
tuning range, and may not be monotonic.
Note: The Primary Oscillator mode has three
different submodes (XT, HS and EC)
which are determined by the POSCMDx
Configuration bits. While an application
can switch to and from Primary Oscillator
mode in software, it cannot switch
between the different primary submodes
without reprogramming the device.
2009 Microchip Technology Inc. DS39897C-page 127
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8.4.2 OSCILLATOR SWITCHING
SEQUENCE
At a minimum, performing a clock switch requires this
basic sequence:
1. If desired, read the COSCx bits
(OSCCON<14:12>) to determine the current
oscillator source.
2. Perform the unlock sequence to allow a write to
the OSCCON register high byte.
3. Write the appropriate value to the NOSCx bits
(OSCCON<10:8>) for the new oscillator source.
4. Perform the unlock sequence to allow a write to
the OSCCON register low byte.
5. Set the OSWEN bit to initiate the oscillator
switch.
Once the basic sequence is completed, the system
clock hardware responds automatically as follows:
1. The clock switching hardware compares the
COSCx bits with the new value of the NOSCx
bits. If they are the same, then the clock switch
is a redundant operation. In this case, the
OSWEN bit is cleared automatically and the
clock switch is aborted.
2. If a valid clock switch has been initiated, the
LOCK (OSCCON<5>) and CF (OSCCON<3>)
bits are cleared.
3. The new oscillator is turned on by the hardware if
it is not currently running. If a crystal oscillator
must be turned on, the hardware will wait until the
Oscillator Start-up Timer (OST) expires. If the
new source is using the PLL, then the hardware
waits until a PLL lock is detected (LOCK = 1).
4. The hardware waits for 10 clock cycles from the
new clock source and then performs the clock
switch.
5. The hardware clears the OSWEN bit to indicate a
successful clock transition. In addition, the
NOSCx bit values are transferred to the COSCx
bits.
6. The old clock source is turned off at this time,
with the exception of LPRC (if WDT or FSCM is
enabled) or SOSC (if SOSCEN remains set).
A recommended code sequence for a clock switch
includes the following:
1. Disable interrupts during the OSCCON register
unlock and write sequence.
2. Execute the unlock sequence for the OSCCON
high byte by writing 78h and 9Ah to
OSCCON<15:8> in two back-to-back
instructions.
3. Write new oscillator source to the NOSCx bits in
the instruction immediately following the unlock
sequence.
4. Execute the unlock sequence for the OSCCON
low byte by writing 46h and 57h to
OSCCON<7:0> in two back-to-back instructions.
5. Set the OSWEN bit in the instruction immediately
following the unlock sequence.
6. Continue to execute code that is not clock-sensitive
(optional).
7. Invoke an appropriate amount of software delay
(cycle counting) to allow the selected oscillator
and/or PLL to start and stabilize.
8. Check to see if OSWEN is ‘0’. If it is, the switch
was successful. If OSWEN is still set, then
check the LOCK bit to determine the cause of
the failure.
The core sequence for unlocking the OSCCON register
and initiating a clock switch is shown in Example 8-1.
EXAMPLE 8-1: BASIC CODE SEQUENCE
FOR CLOCK SWITCHING
Note 1: The processor will continue to execute
code throughout the clock switching
sequence. Timing-sensitive code should
not be executed during this time.
2: Direct clock switches between any
Primary Oscillator mode with PLL and
FRCPLL mode are not permitted. This
applies to clock switches in either direction.
In these instances, the application
must switch to FRC mode as a transition
clock source between the two PLL
modes.
;Place the new oscillator selection in W0
;OSCCONH (high byte) Unlock Sequence
MOV #OSCCONH, w1
MOV #0x78, w2
MOV #0x9A, w3
MOV.b w2, [w1]
MOV.b w3, [w1]
;Set new oscillator selection
MOV.b WREG, OSCCONH
;OSCCONL (low byte) unlock sequence
MOV #OSCCONL, w1
MOV #0x46, w2
MOV #0x57, w3
MOV.b w2, [w1]
MOV.b w3, [w1]
;Start oscillator switch operation
BSET OSCCON,#0
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DS39897C-page 128 2009 Microchip Technology Inc.
8.5 Oscillator Modes and USB
Operation
Because of the timing requirements imposed by USB,
an internal clock of 48 MHz is required at all times while
the USB module is enabled. Since this is well beyond
the maximum CPU clock speed, a method is provided
to internally generate both the USB and system clocks
from a single oscillator source. PIC24FJ256GB110
family devices use the same clock structure as other
PIC24FJ devices, but include a two-branch PLL system
to generate the two clock signals.
The USB PLL block is shown in Figure 8-2. In this
system, the input from the Primary Oscillator is divided
down by a PLL prescaler to generate a 4 MHz output.
This is used to drive an on-chip 96 MHz PLL frequency
multiplier to drive the two clock branches. One branch
uses a fixed divide-by-2 frequency divider to generate
the 48 MHz USB clock. The other branch uses a fixed
divide-by-3 frequency divider and configurable PLL
prescaler/divider to generate a range of system clock
frequencies. The CPDIV bits select the system clock
speed; available clock options are listed in Table 8-2.
The USB PLL prescaler does not automatically sense
the incoming oscillator frequency. The user must manually
configure the PLL divider to generate the required
4 MHz output, using the PLLDIV<2:0> Configuration
bits. This limits the choices for Primary Oscillator frequency
to a total of 8 possibilities, shown in Table 8-3.
TABLE 8-2: SYSTEM CLOCK OPTIONS
DURING USB OPERATION
TABLE 8-3: VALID PRIMARY OSCILLATOR
CONFIGURATIONS FOR USB
OPERATIONS
FIGURE 8-2: USB PLL BLOCK
MCU Clock Division
(CPDIV<1:0>)
Microcontroller
Clock Frequency
None (00) 32 MHz
2 (01) 16 MHz
4 (10) 8MHz
8 (11) 4MHz
Input Oscillator
Frequency Clock Mode PLL Division
(PLLDIV<2:0>)
48 MHz ECPLL 12 (111)
40 MHz ECPLL 10 (110)
24 MHz HSPLL, ECPLL 6 (101)
20 MHz HSPLL, ECPLL 5 (100)
16 MHz HSPLL, ECPLL 4 (011)
12 MHz HSPLL, ECPLL 3 (010)
8 MHz ECPLL, XTPLL 2 (001)
4 MHz ECPLL, XTPLL 1 (000)
PLL
96 MHz
PLL
3
2
Prescaler
4 MHz
PLL
Prescaler
48 MHz Clock
for USB Module
PLL Output
for System Clock
CPDIV<1:0>
PLLDIV<2:0>
Input from
POSC
Input from
FRC
FNOSC<2:0>
(4 MHz or
8 MHz)
00
01
10
11
32 MHz
111
110
101
100
011
010
001
000
12
8
10
6
5
4
3
2
1
4
2
1
PLLDIS
2009 Microchip Technology Inc. DS39897C-page 129
PIC24FJ256GB110 FAMILY
8.5.1 CONSIDERATIONS FOR USB
OPERATION
When using the USB On-The-Go module in
PIC24FJ256GB110 family devices, users must always
observe these rules in configuring the system clock:
• For USB operation, the selected clock source
(EC, HS or XT) must meet the USB clock
tolerance requirements.
• The Primary Oscillator/PLL modes are the only
oscillator configurations that permit USB operation.
There is no provision to provide a separate
external clock source to the USB module.
• While the FRCPLL Oscillator mode is available in
these devices, it should never be used for USB
applications. FRCPLL mode is still available when
the application is not using the USB module. However,
the user must always ensure that the FRC
source is configured to provide a frequency of
4 MHz or 8 MHz (RCDIV<2:0> = 001 or 000) and
that the USB PLL prescaler is configured
appropriately.
• All other oscillator modes are available; however,
USB operation is not possible when these modes
are selected. They may still be useful in cases
where other power levels of operation are
desirable and the USB module is not needed
(e.g., the application is in Sleep and waiting for
bus attachment).
8.6 Reference Clock Output
In addition to the CLKO output (FOSC/2) available in
certain oscillator modes, the device clock in the
PIC24FJ256GB110 family devices can also be configured
to provide a reference clock output signal to a port
pin. This feature is available in all oscillator configurations
and allows the user to select a greater range of
clock submultiples to drive external devices in the
application.
This reference clock output is controlled by the
REFOCON register (Register 8-4). Setting the ROEN
bit (REFOCON<15>) makes the clock signal available
on the REFO pin. The RODIV bits (REFOCON<11:8>)
enable the selection of 16 different clock divider
options.
The ROSSLP and ROSEL bits (REFOCON<13:12>)
control the availability of the reference output during
Sleep mode. The ROSEL bit determines if the oscillator
on OSC1 and OSC2, or the current system clock
source, is used for the reference clock output. The
ROSSLP bit determines if the reference source is
available on REFO when the device is in Sleep mode.
To use the reference clock output in Sleep mode, both
the ROSSLP and ROSEL bits must be set. The device
clock must also be configured for one of the primary
modes (EC, HS or XT); otherwise, if the POSCEN bit is
not also set, the oscillator on OSC1 and OSC2 will be
powered down when the device enters Sleep mode.
Clearing the ROSEL bit allows the reference output
frequency to change as the system clock changes
during any clock switches.
PIC24FJ256GB110 FAMILY
DS39897C-page 130 2009 Microchip Technology Inc.
REGISTER 8-4: REFOCON: REFERENCE OSCILLATOR CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ROEN — ROSSLP ROSEL RODIV3 RODIV2 RODIV1 RODIV0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ROEN: Reference Oscillator Output Enable bit
1 = Reference oscillator enabled on REFO pin
0 = Reference oscillator disabled
bit 14 Unimplemented: Read as ‘0’
bit 13 ROSSLP: Reference Oscillator Output Stop in Sleep bit
1 = Reference oscillator continues to run in Sleep
0 = Reference oscillator is disabled in Sleep
bit 12 ROSEL: Reference Oscillator Source Select bit
1 = Primary Oscillator used as the base clock. Note that the crystal oscillator must be enabled using
the FOSC<2:0> bits; crystal maintains the operation in Sleep mode.
0 = System clock used as the base clock; base clock reflects any clock switching of the device
bit 11-8 RODIV<3:0>: Reference Oscillator Divisor Select bits
1111 = Base clock value divided by 32,768
1110 = Base clock value divided by 16,384
1101 = Base clock value divided by 8,192
1100 = Base clock value divided by 4,096
1011 = Base clock value divided by 2,048
1010 = Base clock value divided by 1,024
1001 = Base clock value divided by 512
1000 = Base clock value divided by 256
0111 = Base clock value divided by 128
0110 = Base clock value divided by 64
0101 = Base clock value divided by 32
0100 = Base clock value divided by 16
0011 = Base clock value divided by 8
0010 = Base clock value divided by 4
0001 = Base clock value divided by 2
0000 = Base clock value
bit 7-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 131
PIC24FJ256GB110 FAMILY
9.0 POWER-SAVING FEATURES
The PIC24FJ256GB110 family of devices provides the
ability to manage power consumption by selectively
managing clocking to the CPU and the peripherals. In
general, a lower clock frequency and a reduction in the
number of circuits being clocked constitutes lower
consumed power. All PIC24F devices manage power
consumption in four different ways:
• Clock frequency
• Instruction-based Sleep and Idle modes
• Software controlled Doze mode
• Selective peripheral control in software
Combinations of these methods can be used to
selectively tailor an application’s power consumption,
while still maintaining critical application features, such
as timing-sensitive communications.
9.1 Clock Frequency and Clock
Switching
PIC24F devices allow for a wide range of clock
frequencies to be selected under application control. If
the system clock configuration is not locked, users can
choose low-power or high-precision oscillators by simply
changing the NOSC bits. The process of changing a
system clock during operation, as well as limitations to
the process, are discussed in more detail in Section 8.0
“Oscillator Configuration”.
9.2 Instruction-Based Power-Saving
Modes
PIC24F devices have two special power-saving modes
that are entered through the execution of a special
PWRSAV instruction. Sleep mode stops clock operation
and halts all code execution; Idle mode halts the CPU
and code execution, but allows peripheral modules to
continue operation. The assembly syntax of the
PWRSAV instruction is shown in Example 9-1.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset.
When the device exits these modes, it is said to
“wake-up”.
9.2.1 SLEEP MODE
Sleep mode has these features:
• The system clock source is shut down. If an
on-chip oscillator is used, it is turned off.
• The device current consumption will be reduced
to a minimum provided that no I/O pin is sourcing
current.
• The Fail-Safe Clock Monitor does not operate
during Sleep mode since the system clock source
is disabled.
• The LPRC clock will continue to run in Sleep
mode if the WDT is enabled.
• The WDT, if enabled, is automatically cleared
prior to entering Sleep mode.
• Some device features or peripherals may
continue to operate in Sleep mode. This includes
items such as the input change notification on the
I/O ports, or peripherals that use an external clock
input. Any peripheral that requires the system
clock source for its operation will be disabled in
Sleep mode.
The device will wake-up from Sleep mode on any of the
these events:
• On any interrupt source that is individually
enabled
• On any form of device Reset
• On a WDT time-out
On wake-up from Sleep, the processor will restart with
the same clock source that was active when Sleep
mode was entered.
EXAMPLE 9-1: PWRSAV INSTRUCTION SYNTAX
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 10. “Power-Saving Features”
(DS39698).
Note: SLEEP_MODE and IDLE_MODE are constants
defined in the assembler include
file for the selected device.
PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode
PWRSAV #IDLE_MODE ; Put the device into IDLE mode
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DS39897C-page 132 2009 Microchip Technology Inc.
9.2.2 IDLE MODE
Idle mode has these features:
• The CPU will stop executing instructions.
• The WDT is automatically cleared.
• The system clock source remains active. By
default, all peripheral modules continue to operate
normally from the system clock source, but can
also be selectively disabled (see Section 9.4
“Selective Peripheral Module Control”).
• If the WDT or FSCM is enabled, the LPRC will
also remain active.
The device will wake from Idle mode on any of these
events:
• Any interrupt that is individually enabled.
• Any device Reset.
• A WDT time-out.
On wake-up from Idle, the clock is reapplied to the CPU
and instruction execution begins immediately, starting
with the instruction following the PWRSAV instruction or
the first instruction in the ISR.
9.2.3 INTERRUPTS COINCIDENT WITH
POWER SAVE INSTRUCTIONS
Any interrupt that coincides with the execution of a
PWRSAV instruction will be held off until entry into Sleep
or Idle mode has completed. The device will then
wake-up from Sleep or Idle mode.
9.3 Doze Mode
Generally, changing clock speed and invoking one of
the power-saving modes are the preferred strategies
for reducing power consumption. There may be circumstances,
however, where this is not practical. For
example, it may be necessary for an application to
maintain uninterrupted synchronous communication,
even while it is doing nothing else. Reducing system
clock speed may introduce communication errors,
while using a power-saving mode may stop
communications completely.
Doze mode is a simple and effective alternative method
to reduce power consumption while the device is still
executing code. In this mode, the system clock continues
to operate from the same source and at the same
speed. Peripheral modules continue to be clocked at
the same speed while the CPU clock speed is reduced.
Synchronization between the two clock domains is
maintained, allowing the peripherals to access the
SFRs while the CPU executes code at a slower rate.
Doze mode is enabled by setting the DOZEN bit
(CLKDIV<11>). The ratio between peripheral and core
clock speed is determined by the DOZE<2:0> bits
(CLKDIV<14:12>). There are eight possible
configurations, from 1:1 to 1:256, with 1:1 being the
default.
It is also possible to use Doze mode to selectively
reduce power consumption in event driven applications.
This allows clock-sensitive functions, such as
synchronous communications, to continue without
interruption while the CPU Idles, waiting for something
to invoke an interrupt routine. Enabling the automatic
return to full-speed CPU operation on interrupts is
enabled by setting the ROI bit (CLKDIV<15>). By
default, interrupt events have no effect on Doze mode
operation.
9.4 Selective Peripheral Module
Control
Idle and Doze modes allow users to substantially
reduce power consumption by slowing or stopping the
CPU clock. Even so, peripheral modules still remain
clocked, and thus, consume power. There may be
cases where the application needs what these modes
do not provide: the allocation of power resources to
CPU processing with minimal power consumption from
the peripherals.
PIC24F devices address this requirement by allowing
peripheral modules to be selectively disabled, reducing
or eliminating their power consumption. This can be
done with two control bits:
• The Peripheral Enable bit, generically named,
“XXXEN”, located in the module’s main control
SFR.
• The Peripheral Module Disable (PMD) bit,
generically named, “XXXMD”, located in one of
the PMD Control registers.
Both bits have similar functions in enabling or disabling
their associated module. Setting the PMD bit for a
module disables all clock sources to that module,
reducing its power consumption to an absolute minimum.
In this state, the control and status registers
associated with the peripheral will also be disabled, so
writes to those registers will have no effect and read
values will be invalid. Many peripheral modules have a
corresponding PMD bit.
In contrast, disabling a module by clearing its XXXEN
bit disables its functionality, but leaves its registers
available to be read and written to. This reduces power
consumption, but not by as much as setting the PMD
bit does. Most peripheral modules have an enable bit;
exceptions include input capture, output compare and
RTCC.
To achieve more selective power savings, peripheral
modules can also be selectively disabled when the
device enters Idle mode. This is done through the
control bit of the generic name format, “XXXIDL”. By
default, all modules that can operate during Idle mode
will do so. Using the disable on Idle feature allows
further reduction of power consumption during Idle
mode, enhancing power savings for extremely critical
power applications.
2009 Microchip Technology Inc. DS39897C-page 133
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10.0 I/O PORTS
All of the device pins (except VDD, VSS, MCLR and
OSCI/CLKI) are shared between the peripherals and
the parallel I/O ports. All I/O input ports feature Schmitt
Trigger inputs for improved noise immunity.
10.1 Parallel I/O (PIO) Ports
A parallel I/O port that shares a pin with a peripheral is,
in general, subservient to the peripheral. The peripheral’s
output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pin. The logic also prevents “loop through”, in
which a port’s digital output can drive the input of a
peripheral that shares the same pin. Figure 10-1 shows
how ports are shared with other peripherals and the
associated I/O pin to which they are connected.
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read, but the output driver for the parallel port
bit will be disabled. If a peripheral is enabled, but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
All port pins have three registers directly associated
with their operation as digital I/O. The Data Direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the Output Latch register (LATx),
read the latch. Writes to the latch, write the latch.
Reads from the port (PORTx), read the port pins, while
writes to the port pins, write the latch.
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers, and the port pin, will read as zeros.
When a pin is shared with another peripheral or function
that is defined as an input only, it is regarded as a
dedicated port because there is no other competing
source of outputs.
FIGURE 10-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 12. “I/O Ports with Peripheral
Pin Select (PPS)” (DS39711).
D Q
CK
WR LAT +
TRIS Latch
I/O Pin
WR PORT
Data Bus
D Q
CK
Data Latch
Read PORT
Read TRIS
1
0
1
0
WR TRIS
Peripheral Output Data
Output Enable
Peripheral Input Data
I/O
Peripheral Module
Peripheral Output Enable
PIO Module
Output Multiplexers
Output Data
Input Data
Peripheral Module Enable
Read LAT
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DS39897C-page 134 2009 Microchip Technology Inc.
10.1.1 OPEN-DRAIN CONFIGURATION
In addition to the PORT, LAT and TRIS registers for
data control, each port pin can also be individually
configured for either digital or open-drain output. This is
controlled by the Open-Drain Control register, ODCx,
associated with each port. Setting any of the bits configures
the corresponding pin to act as an open-drain
output.
The open-drain feature allows the generation of
outputs higher than VDD (e.g., 5V) on any desired
digital only pins by using external pull-up resistors. The
maximum open-drain voltage allowed is the same as
the maximum VIH specification.
10.2 Configuring Analog Port Pins
The AD1PCFGL and TRIS registers control the operation
of the A/D port pins. Setting a port pin as an analog
input also requires that the corresponding TRIS bit be
set. If the TRIS bit is cleared (output), the digital output
level (VOH or VOL) will be converted.
When reading the PORT register, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
10.2.1 I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically, this instruction
would be a NOP.
10.2.2 ANALOG INPUT PINS AND
VOLTAGE CONSIDERATIONS
The voltage tolerance of pins used as device inputs is
dependent on the pin’s input function. Pins that are used
as digital only inputs are able to handle DC voltages up
to 5.5V, a level typical for digital logic circuits. In contrast,
pins that also have analog input functions of any kind
can only tolerate voltages up to VDD. Voltage excursions
beyond VDD on these pins are always to be avoided.
Table 10-1 summarizes the input capabilities. Refer to
Section 29.1 “DC Characteristics” for more details.
TABLE 10-1: INPUT VOLTAGE LEVELS(1)
EXAMPLE 10-1: PORT WRITE/READ EXAMPLE
Note: For easy identification, the pin diagrams at
the beginning of the data sheet also
indicate 5.5V tolerant pins with dark grey
shading.
Port or Pin Tolerated
Input Description
PORTA<10:9> VDD Only VDD input
PORTB<15:0> levels tolerated.
PORTC<15:12>
PORTD<7:6>
PORTF<0>
PORTG<9:6>,
PORTG<3:2>
PORTA<15:14>,
PORTA<7:0>
5.5V Tolerates input
levels above
VDD, useful for
most standard
logic.
PORTC<4:1>
PORTD<15:8>,
PORTD<5:0>
PORTE<9:0>
PORTF<13:12>,
PORTF<8>,
PORTF<5:1>
PORTG<15:12>,
PORTG<1:0>
Note 1: Not all port pins shown here are implemented
on 64-pin and 80-pin devices.
Refer to Section 1.0 “Device Overview”
to confirm which ports are available in
specific devices.
MOV 0xFF00, W0 ; Configure PORTB<15:8> as inputs
MOV W0, TRISBB ; and PORTB<7:0> as outputs
NOP ; Delay 1 cycle
BTSS PORTB, #13 ; Next Instruction
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10.3 Input Change Notification
The input change notification function of the I/O ports
allows the PIC24FJ256GB110 family of devices to
generate interrupt requests to the processor in
response to a Change-Of-State (COS) on selected
input pins. This feature is capable of detecting input
Change-Of-States even in Sleep mode, when the
clocks are disabled. Depending on the device pin
count, there are up to 81 external inputs that may be
selected (enabled) for generating an interrupt request
on a Change-Of-State.
Registers, CNEN1 through CNEN6, contain the interrupt
enable control bits for each of the CN input pins.
Setting any of these bits enables a CN interrupt for the
corresponding pins.
Each CN pin has a both a weak pull-up and a weak
pull-down connected to it. The pull-ups act as a current
source that is connected to the pin, while the
pull-downs act as a current sink that is connected to the
pin. These eliminate the need for external resistors
when push button or keypad devices are connected.
The pull-ups and pull-downs are separately enabled
using the CNPU1 through CNPU6 registers (for
pull-ups) and the CNPD1 through CNPD6 registers (for
pull-downs). Each CN pin has individual control bits for
its pull-up and pull-down. Setting a control bit enables
the weak pull-up or pull-down for the corresponding
pin.
When the internal pull-up is selected, the pin pulls up to
VDD – 0.7V (typical). Make sure that there is no external
pull-up source when the internal pull-ups are enabled,
as the voltage difference can cause a current path.
10.4 Peripheral Pin Select
A major challenge in general purpose devices is providing
the largest possible set of peripheral features while
minimizing the conflict of features on I/O pins. In an
application that needs to use more than one peripheral
multiplexed on a single pin, inconvenient workarounds
in application code or a complete redesign may be the
only option.
The Peripheral Pin Select (PPS) feature provides an
alternative to these choices by enabling the user’s
peripheral set selection and their placement on a wide
range of I/O pins. By increasing the pinout options
available on a particular device, users can better tailor
the microcontroller to their entire application, rather
than trimming the application to fit the device.
The Peripheral Pin Select feature operates over a fixed
subset of digital I/O pins. Users may independently
map the input and/or output of any one of many digital
peripherals to any one of these I/O pins. Peripheral Pin
Select is performed in software and generally does not
require the device to be reprogrammed. Hardware
safeguards are included that prevent accidental or
spurious changes to the peripheral mapping once it has
been established.
10.4.1 AVAILABLE PINS
The Peripheral Pin Select feature is used with a range
of up to 44 pins, depending on the particular device and
its pin count. Pins that support the Peripheral Pin
Select feature include the designation, “RPn” or “RPIn”,
in their full pin designation, where “n” is the remappable
pin number. “RP” is used to designate pins that support
both remappable input and output functions, while
“RPI” indicates pins that support remappable input
functions only.
PIC24FJ256GB110 family devices support a larger
number of remappable input only pins than remappable
input/output pins. In this device family, there are up to
32 remappable input/output pins, depending on the pin
count of the particular device selected; these are numbered,
RP0 through RP31. Remappable input only pins
are numbered above this range, from RPI32 to RPI43
(or the upper limit for that particular device).
See Table 1-4 for a summary of pinout options in each
package offering.
Note: Pull-ups on change notification pins
should always be disabled whenever the
port pin is configured as a digital output.
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DS39897C-page 136 2009 Microchip Technology Inc.
10.4.2 AVAILABLE PERIPHERALS
The peripherals managed by the Peripheral Pin Select
are all digital only peripherals. These include general
serial communications (UART and SPI), general purpose
timer clock inputs, timer related peripherals (input
capture and output compare) and external interrupt
inputs. Also included are the outputs of the comparator
module, since these are discrete digital signals.
Peripheral Pin Select is not available for I2C™ change
notification inputs, RTCC alarm outputs or peripherals
with analog inputs.
A key difference between pin select and non pin select
peripherals is that pin select peripherals are not associated
with a default I/O pin. The peripheral must
always be assigned to a specific I/O pin before it can be
used. In contrast, non pin select peripherals are always
available on a default pin, assuming that the peripheral
is active and not conflicting with another peripheral.
10.4.2.1 Peripheral Pin Select Function
Priority
Pin-selectable peripheral outputs (e.g., OC, UART
Transmit) take priority over general purpose digital
functions on a pin, such as PMP and port I/O. Specialized
digital outputs, such as USB functionality, will take
priority over PPS outputs on the same pin. The pin
diagrams provided at the beginning of this data sheet
list peripheral outputs in the order of priority. Refer to
them for priority concerns on a particular pin.
Unlike PIC24F devices with fixed peripherals,
pin-selectable peripheral inputs never take ownership
of a pin. The pin’s output buffer is controlled by the
TRISx setting or by a fixed peripheral on the pin. If the
pin is configured in Digital mode, the PPS input will
operate correctly. If an analog function is enabled on
the pin, the PPS input will be disabled.
10.4.3 CONTROLLING PERIPHERAL PIN
SELECT
Peripheral Pin Select features are controlled through
two sets of Special Function Registers: one to map
peripheral inputs and one to map outputs. Because
they are separately controlled, a particular peripheral’s
input and output (if the peripheral has both) can be
placed on any selectable function pin without
constraint.
The association of a peripheral to a
peripheral-selectable pin is handled in two different
ways, depending on if an input or an output is being
mapped.
10.4.3.1 Input Mapping
The inputs of the Peripheral Pin Select options are
mapped on the basis of the peripheral; that is, a control
register associated with a peripheral dictates which pin
it will be mapped to. The RPINRx registers are used to
configure peripheral input mapping (see Register 10-1
through Register 10-21). Each register contains two
sets of 6-bit fields, with each set associated with one of
the pin-selectable peripherals. Programming a given
peripheral’s bit field with an appropriate 6-bit value
maps the RPn pin with that value to that peripheral. For
any given device, the valid range of values for any of
the bit fields corresponds to the maximum number of
peripheral pin selections supported by the device.
10.4.3.2 Output Mapping
In contrast to inputs, the outputs of the Peripheral Pin
Select options are mapped on the basis of the pin. In
this case, a control register associated with a particular
pin dictates the peripheral output to be mapped. The
RPORx registers are used to control output mapping.
Each register contains two 6-bit fields, with each field
being associated with one RPn pin (see Register 10-22
through Register 10-37). The value of the bit field
corresponds to one of the peripherals and that
peripheral’s output is mapped to the pin (see
Table 10-3).
Because of the mapping technique, the list of peripherals
for output mapping also includes a null value of
‘000000’. This permits any given pin to remain disconnected
from the output of any of the pin-selectable
peripherals.
2009 Microchip Technology Inc. DS39897C-page 137
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TABLE 10-2: SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)(1)
Input Name Function Name Register Function Mapping
Bits
External Interrupt 1 INT1 RPINR0 INT1R<5:0>
External Interrupt 2 INT2 RPINR1 INT2R<5:0>
External Interrupt 3 INT3 RPINR1 INT3R<5:0>
External Interrupt 4 INT4 RPINR2 INT4R<5:0>
Input Capture 1 IC1 RPINR7 IC1R<5:0>
Input Capture 2 IC2 RPINR7 IC2R<5:0>
Input Capture 3 IC3 RPINR8 IC3R<5:0>
Input Capture 4 IC4 RPINR8 IC4R<5:0>
Input Capture 5 IC5 RPINR9 IC5R<5:0>
Input Capture 6 IC6 RPINR9 IC6R<5:0>
Input Capture 7 IC7 RPINR10 IC7R<5:0>
Input Capture 8 IC8 RPINR10 IC8R<5:0>
Input Capture 9 IC9 RPINR15 IC9R<5:0>
Output Compare Fault A OCFA RPINR11 OCFAR<5:0>
Output Compare Fault B OCFB RPINR11 OCFBR<5:0>
SPI1 Clock Input SCK1IN RPINR20 SCK1R<5:0>
SPI1 Data Input SDI1 RPINR20 SDI1R<5:0>
SPI1 Slave Select Input SS1IN RPINR21 SS1R<5:0>
SPI2 Clock Input SCK2IN RPINR22 SCK2R<5:0>
SPI2 Data Input SDI2 RPINR22 SDI2R<5:0>
SPI2 Slave Select Input SS2IN RPINR23 SS2R<5:0>
SPI3 Clock Input SCK3IN RPINR23 SCK3R<5:0>
SPI3 Data Input SDI3 RPINR28 SDI3R<5:0>
SPI3 Slave Select Input SS3IN RPINR29 SS3R<5:0>
Timer2 External Clock T2CK RPINR3 T2CKR<5:0>
Timer3 External Clock T3CK RPINR3 T3CKR<5:0>
Timer4 External Clock T4CK RPINR4 T4CKR<5:0>
Timer5 External Clock T5CK RPINR4 T5CKR<5:0>
UART1 Clear To Send U1CTS RPINR18 U1CTSR<5:0>
UART1 Receive U1RX RPINR18 U1RXR<5:0>
UART2 Clear To Send U2CTS RPINR19 U2CTSR<5:0>
UART2 Receive U2RX RPINR19 U2RXR<5:0>
UART3 Clear To Send U3CTS RPINR21 U3CTSR<5:0>
UART3 Receive U3RX RPINR17 U3RXR<5:0>
UART4 Clear To Send U4CTS RPINR27 U4CTSR<5:0>
UART4 Receive U4RX RPINR27 U4RXR<5:0>
Note 1: Unless otherwise noted, all inputs use the Schmitt Trigger input buffers.
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DS39897C-page 138 2009 Microchip Technology Inc.
TABLE 10-3: SELECTABLE OUTPUT SOURCES (MAPS FUNCTION TO OUTPUT)
Output Function Number(1) Function Output Name
0 NULL(2) Null
1 C1OUT Comparator 1 Output
2 C2OUT Comparator 2 Output
3 U1TX UART1 Transmit
4 U1RTS(3) UART1 Request To Send
5 U2TX UART2 Transmit
6 U2RTS(3) UART2 Request To Send
7 SDO1 SPI1 Data Output
8 SCK1OUT SPI1 Clock Output
9 SS1OUT SPI1 Slave Select Output
10 SDO2 SPI2 Data Output
11 SCK2OUT SPI2 Clock Output
12 SS2OUT SPI2 Slave Select Output
18 OC1 Output Compare 1
19 OC2 Output Compare 2
20 OC3 Output Compare 3
21 OC4 Output Compare 4
22 OC5 Output Compare 5
23 OC6 Output Compare 6
24 OC7 Output Compare 7
25 OC8 Output Compare 8
28 U3TX UART3 Transmit
29 U3RTS(3) UART3 Request To Send
30 U4TX UART4 Transmit
31 U4RTS(3) UART4 Request To Send
32 SDO3 SPI3 Data Output
33 SCK3OUT SPI3 Clock Output
34 SS3OUT SPI3 Slave Select Output
35 OC9 Output Compare 9
36 C3OUT Comparator 3 Output
37-63 (unused) NC
Note 1: Setting the RPORx register with the listed value assigns that output function to the associated RPn pin.
2: The NULL function is assigned to all RPn outputs at device Reset and disables the RPn output function.
3: IrDA® BCLK functionality uses this output.
2009 Microchip Technology Inc. DS39897C-page 139
PIC24FJ256GB110 FAMILY
10.4.3.3 Mapping Limitations
The control schema of the Peripheral Pin Select is
extremely flexible. Other than systematic blocks that
prevent signal contention caused by two physical pins
being configured as the same functional input, or two
functional outputs configured as the same pin, there
are no hardware enforced lockouts. The flexibility
extends to the point of allowing a single input to drive
multiple peripherals or a single functional output to
drive multiple output pins.
10.4.3.4 Mapping Exceptions for
PIC24FJ256GB110 Family Devices
Although the PPS registers theoretically allow for up to
64 remappable I/O pins, not all of these are implemented
in all devices. For PIC24FJ256GB110 family
devices, the maximum number of remappable pins
available are 44, which includes 12 input only pins. In
addition, some pins in the RP and RPI sequences are
unimplemented in lower pin count devices. The
differences in available remappable pins are
summarized in Table 10-4.
When developing applications that use remappable
pins, users should also keep these things in mind:
• For the RPINRx registers, bit combinations corresponding
to an unimplemented pin for a particular
device are treated as invalid; the corresponding
module will not have an input mapped to it. For all
PIC24FJ256GB110 family devices, this includes
all values greater than 43 (‘101011’).
• For RPORx registers, the bit fields corresponding
to an unimplemented pin will also be
unimplemented. Writing to these fields will have
no effect.
10.4.4 CONTROLLING CONFIGURATION
CHANGES
Because peripheral remapping can be changed during
run time, some restrictions on peripheral remapping
are needed to prevent accidental configuration
changes. PIC24F devices include three features to
prevent alterations to the peripheral map:
• Control register lock sequence
• Continuous state monitoring
• Configuration bit remapping lock
10.4.4.1 Control Register Lock
Under normal operation, writes to the RPINRx and
RPORx registers are not allowed. Attempted writes will
appear to execute normally, but the contents of the
registers will remain unchanged. To change these registers,
they must be unlocked in hardware. The register
lock is controlled by the IOLOCK bit (OSCCON<6>).
Setting IOLOCK prevents writes to the control
registers; clearing IOLOCK allows writes.
To set or clear IOLOCK, a specific command sequence
must be executed:
1. Write 46h to OSCCON<7:0>.
2. Write 57h to OSCCON<7:0>.
3. Clear (or set) IOLOCK as a single operation.
Unlike the similar sequence with the oscillator’s LOCK
bit, IOLOCK remains in one state until changed. This
allows all of the Peripheral Pin Selects to be configured
with a single unlock sequence, followed by an update
to all control registers, then locked with a second lock
sequence.
10.4.4.2 Continuous State Monitoring
In addition to being protected from direct writes, the
contents of the RPINRx and RPORx registers are
constantly monitored in hardware by shadow registers.
If an unexpected change in any of the registers occurs
(such as cell disturbances caused by ESD or other
external events), a Configuration Mismatch Reset will
be triggered.
10.4.4.3 Configuration Bit Pin Select Lock
As an additional level of safety, the device can be configured
to prevent more than one write session to the
RPINRx and RPORx registers. The IOL1WAY
(CW2<4>) Configuration bit blocks the IOLOCK bit
from being cleared after it has been set once. If
IOLOCK remains set, the register unlock procedure will
not execute and the Peripheral Pin Select Control registers
cannot be written to. The only way to clear the bit
and re-enable peripheral remapping is to perform a
device Reset.
In the default (unprogrammed) state, IOL1WAY is set,
restricting users to one write session. Programming
IOL1WAY allows users unlimited access (with the
proper use of the unlock sequence) to the Peripheral
Pin Select registers.
TABLE 10-4: REMAPPABLE PIN EXCEPTIONS FOR PIC24FJ256GB110 FAMILY DEVICES
Device Pin Count
RP Pins (I/O) RPI Pins
Total Unimplemented Total Unimplemented
64-pin 28 RP5, RP15, RP30, RP31 1 RPI32-36, RPI38-43
80-pin 31 RP31 9 RPI32, RPI39, RPI41
100-pin 32 — 12 —
PIC24FJ256GB110 FAMILY
DS39897C-page 140 2009 Microchip Technology Inc.
10.4.5 CONSIDERATIONS FOR
PERIPHERAL PIN SELECTION
The ability to control peripheral pin selection introduces
several considerations into application design that
could be overlooked. This is particularly true for several
common peripherals that are available only as
remappable peripherals.
The main consideration is that the Peripheral Pin
Selects are not available on default pins in the device’s
default (Reset) state. Since all RPINRx registers reset
to ‘111111’ and all RPORx registers reset to ‘000000’,
all Peripheral Pin Select inputs are tied to VSS, and all
Peripheral Pin Select outputs are disconnected.
This situation requires the user to initialize the device
with the proper peripheral configuration before any
other application code is executed. Since the IOLOCK
bit resets in the unlocked state, it is not necessary to
execute the unlock sequence after the device has
come out of Reset. For application safety, however, it is
best to set IOLOCK and lock the configuration after
writing to the control registers.
Because the unlock sequence is timing-critical, it must
be executed as an assembly language routine in the
same manner as changes to the oscillator configuration.
If the bulk of the application is written in C or
another high-level language, the unlock sequence
should be performed by writing in-line assembly.
Choosing the configuration requires the review of all
Peripheral Pin Selects and their pin assignments,
especially those that will not be used in the application.
In all cases, unused pin-selectable peripherals should
be disabled completely. Unused peripherals should
have their inputs assigned to an unused RPn pin
function. I/O pins with unused RPn functions should be
configured with the null peripheral output.
The assignment of a peripheral to a particular pin does
not automatically perform any other configuration of the
pin’s I/O circuitry. In theory, this means adding a
pin-selectable output to a pin may mean inadvertently
driving an existing peripheral input when the output is
driven. Users must be familiar with the behavior of
other fixed peripherals that share a remappable pin and
know when to enable or disable them. To be safe, fixed
digital peripherals that share the same pin should be
disabled when not in use.
Along these lines, configuring a remappable pin for a
specific peripheral does not automatically turn that
feature on. The peripheral must be specifically configured
for operation and enabled, as if it were tied to a fixed
pin. Where this happens in the application code (immediately
following device Reset and peripheral configuration
or inside the main application routine) depends on the
peripheral and its use in the application.
A final consideration is that Peripheral Pin Select functions
neither override analog inputs, nor reconfigure
pins with analog functions for digital I/O. If a pin is
configured as an analog input on device Reset, it must
be explicitly reconfigured as digital I/O when used with
a Peripheral Pin Select.
Example 10-2 shows a configuration for bidirectional
communication with flow control using UART1. The
following input and output functions are used:
• Input Functions: U1RX, U1CTS
• Output Functions: U1TX, U1RTS
EXAMPLE 10-2: CONFIGURING UART1
INPUT AND OUTPUT
FUNCTIONS
Note: In tying Peripheral Pin Select inputs to
RP63, RP63 does not have to exist on a
device for the registers to be reset to it.
// Unlock Registers
__builtin_write_OSCCONL(OSCCON & 0xBF);
// Configure Input Functions (Table 9-1))
// Assign U1RX To Pin RP0
RPINR18bits.U1RXR = 0;
// Assign U1CTS To Pin RP1
RPINR18bits.U1CTSR = 1;
// Configure Output Functions (Table 9-2)
// Assign U1TX To Pin RP2
RPOR1bits.RP2R = 3;
// Assign U1RTS To Pin RP3
RPOR1bits.RP3R = 4;
// Lock Registers
__builtin_write_OSCCONL(OSCCON | 0x40);
2009 Microchip Technology Inc. DS39897C-page 141
PIC24FJ256GB110 FAMILY
10.4.6 PERIPHERAL PIN SELECT
REGISTERS
The PIC24FJ256GB110 family of devices implements
a total of 37 registers for remappable peripheral
configuration:
• Input Remappable Peripheral Registers (21)
• Output Remappable Peripheral Registers (16)
Note: Input and output register values can only be
changed if IOLOCK (OSCCON<6>) = 0.
See Section 10.4.4.1 “Control Register
Lock” for a specific command sequence.
REGISTER 10-1: RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — INT1R5 INT1R4 INT1R3 INT1R2 INT1R1 INT1R0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 INT1R<5:0>: Assign External Interrupt 1 (INT1) to Corresponding RPn or RPIn Pin bits
bit 7-0 Unimplemented: Read as ‘0’
REGISTER 10-2: RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — INT3R5 INT3R4 INT3R3 INT3R2 INT3R1 INT3R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — INT2R5 INT2R4 INT2R3 INT2R2 INT2R1 INT2R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 INT3R<5:0>: Assign External Interrupt 3 (INT3) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 INT2R<5:0>: Assign External Interrupt 2 (INT2) to Corresponding RPn or RPIn Pin bits
PIC24FJ256GB110 FAMILY
DS39897C-page 142 2009 Microchip Technology Inc.
REGISTER 10-3: RPINR2: PERIPHERAL PIN SELECT INPUT REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — INT4R5 INT4R4 INT4R3 INT4R2 INT4R1 INT4R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0’
bit 5-0 INT4R<5:0>: Assign External Interrupt 4 (INT4) to Corresponding RPn or RPIn Pin bits
REGISTER 10-4: RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — T3CKR5 T3CKR4 T3CKR3 T3CKR2 T3CKR1 T3CKR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — T2CKR5 T2CKR4 T2CKR3 T2CKR2 T2CKR1 T2CKR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 T3CKR<5:0>: Assign Timer3 External Clock (T3CK) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 T2CKR<5:0>: Assign Timer2 External Clock (T2CK) to Corresponding RPn or RPIn Pin bits
2009 Microchip Technology Inc. DS39897C-page 143
PIC24FJ256GB110 FAMILY
REGISTER 10-5: RPINR4: PERIPHERAL PIN SELECT INPUT REGISTER 4
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — T5CKR5 T5CKR4 T5CKR3 T5CKR2 T5CKR1 T5CKR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — T4CKR5 T4CKR4 T4CKR3 T4CKR2 T4CKR1 T4CKR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 T5CKR<5:0>: Assign Timer5 External Clock (T5CK) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 T4CKR<5:0>: Assign Timer4 External Clock (T4CK) to Corresponding RPn or RPIn Pin bits
REGISTER 10-6: RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC2R5 IC2R4 IC2R3 IC2R2 IC2R1 IC2R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC1R5 IC1R4 IC1R3 IC1R2 IC1R1 IC1R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 IC2R<5:0>: Assign Input Capture 2 (IC2) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IC1R<5:0>: Assign Input Capture 1 (IC1) to Corresponding RPn or RPIn Pin bits
PIC24FJ256GB110 FAMILY
DS39897C-page 144 2009 Microchip Technology Inc.
REGISTER 10-7: RPINR8: PERIPHERAL PIN SELECT INPUT REGISTER 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC4R5 IC4R4 IC4R3 IC4R2 IC4R1 IC4R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC3R5 IC3R4 IC3R3 IC3R2 IC3R1 IC3R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 IC4R<5:0>: Assign Input Capture 4 (IC4) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IC3R<5:0>: Assign Input Capture 3 (IC3) to Corresponding RPn or RPIn Pin bits
REGISTER 10-8: RPINR9: PERIPHERAL PIN SELECT INPUT REGISTER 9
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC6R5 IC6R4 IC6R3 IC6R2 IC6R1 IC6R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC5R5 IC5R4 IC5R3 IC5R2 IC5R1 IC5R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 IC6R<5:0>: Assign Input Capture 6 (IC6) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IC5R<5:0>: Assign Input Capture 5 (IC5) to Corresponding RPn or RPIn Pin bits
2009 Microchip Technology Inc. DS39897C-page 145
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REGISTER 10-9: RPINR10: PERIPHERAL PIN SELECT INPUT REGISTER 10
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC8R5 IC8R4 IC8R3 IC8R2 IC8R1 IC8R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC7R5 IC7R4 IC7R3 IC7R2 IC7R1 IC7R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 IC8R<5:0>: Assign Input Capture 8 (IC8) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IC7R<5:0>: Assign Input Capture 7 (IC7) to Corresponding RPn or RPIn Pin bits
REGISTER 10-10: RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — OCFBR5 OCFBR4 OCFBR3 OCFBR2 OCFBR1 OCFBR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — OCFAR5 OCFAR4 OCFAR3 OCFAR2 OCFAR1 OCFAR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 OCFBR<5:0>: Assign Output Compare Fault B (OCFB) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 OCFAR<5:0>: Assign Output Compare Fault A (OCFA) to Corresponding RPn or RPIn Pin bits
PIC24FJ256GB110 FAMILY
DS39897C-page 146 2009 Microchip Technology Inc.
REGISTER 10-11: RPINR15: PERIPHERAL PIN SELECT INPUT REGISTER 15
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — IC9R5 IC9R4 IC9R3 IC9R2 IC9R1 IC9R0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 IC9R<5:0>: Assign Input Capture 9 (IC9) to Corresponding RPn or RPIn Pin bits
bit 7-0 Unimplemented: Read as ‘0’
REGISTER 10-12: RPINR17: PERIPHERAL PIN SELECT INPUT REGISTER 17
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U3RXR5 U3RXR4 U3RXR3 U3RXR2 U3RXR1 U3RXR0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 U3RXR<5:0>: Assign UART3 Receive (U3RX) to Corresponding RPn or RPIn Pin bits
bit 7-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 147
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REGISTER 10-13: RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U1CTSR5 U1CTSR4 U1CTSR3 U1CTSR2 U1CTSR1 U1CTSR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U1RXR5 U1RXR4 U1RXR3 U1RXR2 U1RXR1 U1RXR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 U1CTSR<5:0>: Assign UART1 Clear to Send (U1CTS) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 U1RXR<5:0>: Assign UART1 Receive (U1RX) to Corresponding RPn or RPIn Pin bits
REGISTER 10-14: RPINR19: PERIPHERAL PIN SELECT INPUT REGISTER 19
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U2CTSR5 U2CTSR4 U2CTSR3 U2CTSR2 U2CTSR1 U2CTSR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U2RXR5 U2RXR4 U2RXR3 U2RXR2 U2RXR1 U2RXR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 U2CTSR<5:0>: Assign UART2 Clear to Send (U2CTS) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 U2RXR<5:0>: Assign UART2 Receive (U2RX) to Corresponding RPn or RPIn Pin bits
PIC24FJ256GB110 FAMILY
DS39897C-page 148 2009 Microchip Technology Inc.
REGISTER 10-15: RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SCK1R5 SCK1R4 SCK1R3 SCK1R2 SCK1R1 SCK1R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SDI1R5 SDI1R4 SDI1R3 SDI1R2 SDI1R1 SDI1R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 SCK1R<5:0>: Assign SPI1 Clock Input (SCK1IN) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 SDI1R<5:0>: Assign SPI1 Data Input (SDI1) to Corresponding RPn or RPIn Pin bits
REGISTER 10-16: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U3CTSR5 U3CTSR4 U3CTSR3 U3CTSR2 U3CTSR1 U3CTSR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SS1R5 SS1R4 SS1R3 SS1R2 SS1R1 SS1R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 U3CTSR<5:0>: Assign UART3 Clear to Send (U3CTS) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 SS1R<5:0>: Assign SPI1 Slave Select Input (SS1IN) to Corresponding RPn or RPIn Pin bits
2009 Microchip Technology Inc. DS39897C-page 149
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REGISTER 10-17: RPINR22: PERIPHERAL PIN SELECT INPUT REGISTER 22
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SCK2R5 SCK2R4 SCK2R3 SCK2R2 SCK2R1 SCK2R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SDI2R5 SDI2R4 SDI2R3 SDI2R2 SDI2R1 SDI2R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 SCK2R<5:0>: Assign SPI2 Clock Input (SCK2IN) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 SDI2R<5:0>: Assign SPI2 Data Input (SDI2) to Corresponding RPn or RPIn Pin bits
REGISTER 10-18: RPINR23: PERIPHERAL PIN SELECT INPUT REGISTER 23
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SS2R5 SS2R4 SS2R3 SS2R2 SS2R1 SS2R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0’
bit 5-0 SS2R<5:0>: Assign SPI2 Slave Select Input (SS2IN) to Corresponding RPn or RPIn Pin bits
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REGISTER 10-19: RPINR27: PERIPHERAL PIN SELECT INPUT REGISTER 27
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U4CTSR5 U4CTSR4 U4CTSR3 U4CTSR2 U4CTSR1 U4CTSR0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — U4RXR5 U4RXR4 U4RXR3 U4RXR2 U4RXR1 U4RXR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 U4CTSR<5:0>: Assign UART4 Clear to Send (U4CTS) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 U4RXR<5:0>: Assign UART4 Receive (U4RX) to Corresponding RPn or RPIn Pin bits
REGISTER 10-20: RPINR28: PERIPHERAL PIN SELECT INPUT REGISTER 28
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SCK3R5 SCK3R4 SCK3R3 SCK3R2 SCK3R1 SCK3R0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SDI3R5 SDI3R4 SDI3R3 SDI3R2 SDI3R1 SDI3R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 SCK3R<5:0>: Assign SPI3 Clock Input (SCK3IN) to Corresponding RPn or RPIn Pin bits
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 SDI3R<5:0>: Assign SPI3 Data Input (SDI3) to Corresponding RPn or RPIn Pin bits
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REGISTER 10-21: RPINR29: PERIPHERAL PIN SELECT INPUT REGISTER 29
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— — SS3R5 SS3R4 SS3R3 SS3R2 SS3R1 SS3R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0’
bit 5-0 SS3R<5:0>: Assign SPI3 Slave Select Input (SS31IN) to Corresponding RPn or RPIn Pin bits
REGISTER 10-22: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP1R5 RP1R4 RP1R3 RP1R2 RP1R1 RP1R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP0R5 RP0R4 RP0R3 RP0R2 RP0R1 RP0R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP1R<5:0>: RP1 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP1 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP0R<5:0>: RP0 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP0 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-23: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP3R5 RP3R4 RP3R3 RP3R2 RP3R1 RP3R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP2R5 RP2R4 RP2R3 RP2R2 RP2R1 RP2R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP3R<5:0>: RP3 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP3 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP2R<5:0>: RP2 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP2 (see Table 10-3 for peripheral function numbers)
REGISTER 10-24: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP5R5(1) RP5R4(1) RP5R3(1) RP5R2(1) RP5R1(1) RP5R0(1)
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP4R5 RP4R4 RP4R3 RP4R2 RP4R1 RP4R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP5R<5:0>: RP5 Output Pin Mapping bits(1)
Peripheral output number n is assigned to pin, RP5 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP4R<5:0>: RP4 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP4 (see Table 10-3 for peripheral function numbers)
Note 1: Unimplemented on 64-pin devices; read as ‘0’.
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REGISTER 10-25: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP7R5 RP7R4 RP7R3 RP7R2 RP7R1 RP7R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP6R5 RP6R4 RP6R3 RP6R2 RP6R1 RP6R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP7R<5:0>: RP7 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP7 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP6R<5:0>: RP6 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP6 (see Table 10-3 for peripheral function numbers)
REGISTER 10-26: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP9R5 RP9R4 RP9R3 RP9R2 RP9R1 RP9R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP8R5 RP8R4 RP8R3 RP8R2 RP8R1 RP8R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP9R<5:0>: RP9 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP9 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP8R<5:0>: RP8 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP8 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-27: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP11R5 RP11R4 RP11R3 RP11R2 RP11R1 RP11R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP10R5 RP10R4 RP10R3 RP10R2 RP10R1 RP10R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP11R<5:0>: RP11 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP11 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP10R<5:0>: RP10 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP10 (see Table 10-3 for peripheral function numbers)
REGISTER 10-28: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP13R5 RP13R4 RP13R3 RP13R2 RP13R1 RP13R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP12R5 RP12R4 RP12R3 RP12R2 RP12R1 RP12R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP13R<5:0>: RP13 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP13 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP12R<5:0>: RP12 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP12 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-29: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP15R5(1) RP15R4(1) RP15R3(1) RP15R2(1) RP15R1(1) RP15R0(1)
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP14R5 RP14R4 RP14R3 RP14R2 RP14R1 RP14R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP15R<5:0>: RP15 Output Pin Mapping bits(1)
Peripheral output number n is assigned to pin, RP0 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP14R<5:0>: RP14 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP14 (see Table 10-3 for peripheral function numbers)
Note 1: Unimplemented on 64-pin devices; read as ‘0’.
REGISTER 10-30: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP17R5 RP17R4 RP17R3 RP17R2 RP17R1 RP17R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP16R5 RP16R4 RP16R3 RP16R2 RP16R1 RP16R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP17R<5:0>: RP17 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP17 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP16R<5:0>: RP16 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP16 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-31: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP19R5 RP19R4 RP19R3 RP19R2 RP19R1 RP19R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP18R5 RP18R4 RP18R3 RP18R2 RP18R1 RP18R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP19R<5:0>: RP19 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP19 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP18R<5:0>: RP18 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP18 (see Table 10-3 for peripheral function numbers)
REGISTER 10-32: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP21R5 RP21R4 RP21R3 RP21R2 RP21R1 RP21R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP21R<5:0>: RP21 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP21 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP20R<5:0>: RP20 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP20 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-33: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP23R5 RP23R4 RP23R3 RP23R2 RP23R1 RP23R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP22R5 RP22R4 RP22R3 RP22R2 RP22R1 RP22R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP23R<5:0>: RP23 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP23 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP22R<5:0>: RP22 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP22 (see Table 10-3 for peripheral function numbers)
REGISTER 10-34: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP25R5 RP25R4 RP25R3 RP25R2 RP25R1 RP25R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP24R5 RP24R4 RP24R3 RP24R2 RP24R1 RP24R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP25R<5:0>: RP25 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP25 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP24R<5:0>: RP24 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP24 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-35: RPOR13: PERIPHERAL PIN SELECT OUTPUT REGISTER 13
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP27R5 RP27R4 RP27R3 RP27R2 RP27R1 RP27R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP26R5 RP26R4 RP26R3 RP26R2 RP26R1 RP26R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP27R<5:0>: RP27 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP27 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP26R<5:0>: RP26 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP26 (see Table 10-3 for peripheral function numbers)
REGISTER 10-36: RPOR14: PERIPHERAL PIN SELECT OUTPUT REGISTER 14
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP29R5 RP29R4 RP29R3 RP29R2 RP29R1 RP29R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP28R5 RP28R4 RP28R3 RP28R2 RP28R1 RP28R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP29R<5:0>: RP29 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP29 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP28R<5:0>: RP28 Output Pin Mapping bits
Peripheral output number n is assigned to pin, RP28 (see Table 10-3 for peripheral function numbers)
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REGISTER 10-37: RPOR15: PERIPHERAL PIN SELECT OUTPUT REGISTER 15
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP31R5(1) RP31R4(1) RP31R3(1) RP31R2(1) RP31R1(1) RP31R0(1)
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — RP30R5 RP30R4 RP30R3 RP30R2 RP30R1 RP30R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-8 RP31R<5:0>: RP31 Output Pin Mapping bits(1)
Peripheral output number n is assigned to pin, RP31 (see Table 10-3 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RP30R<5:0>: RP30 Output Pin Mapping bits(2)
Peripheral output number n is assigned to pin, RP30 (see Table 10-3 for peripheral function numbers)
Note 1: Unimplemented on 64-pin and 80-pin devices; read as ‘0’.
2: Unimplemented on 64-pin devices; read as ‘0’.
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NOTES:
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11.0 TIMER1
The Timer1 module is a 16-bit timer which can serve as
the time counter for the Real-Time Clock (RTC), or
operate as a free-running, interval timer/counter.
Timer1 can operate in three modes:
• 16-Bit Timer
• 16-Bit Synchronous Counter
• 16-Bit Asynchronous Counter
Timer1 also supports these features:
• Timer Gate Operation
• Selectable Prescaler Settings
• Timer Operation during CPU Idle and Sleep
modes
• Interrupt on 16-Bit Period Register Match or
Falling Edge of External Gate Signal
Figure 11-1 presents a block diagram of the 16-bit timer
module.
To configure Timer1 for operation:
1. Set the TON bit (= 1).
2. Select the timer prescaler ratio using the
TCKPS<1:0> bits.
3. Set the Clock and Gating modes using the TCS
and TGATE bits.
4. Set or clear the TSYNC bit to configure
synchronous or asynchronous operation.
5. Load the timer period value into the PR1
register.
6. If interrupts are required, set the interrupt enable
bit, T1IE. Use the priority bits, T1IP<2:0>, to set
the interrupt priority.
FIGURE 11-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 14. “Timers” (DS39704).
TON
Sync
SOSCI
SOSCO/
PR1
Set T1IF
Equal
Comparator
TMR1
Reset
SOSCEN
1
0
TSYNC
Q
Q D
CK
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
T1CK
TCS
1x
01
TGATE
00
Gate
Sync
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REGISTER 11-1: T1CON: TIMER1 CONTROL REGISTER(1)
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON — TSIDL — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0
— TGATE TCKPS1 TCKPS0 — TSYNC TCS —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TON: Timer1 On bit
1 = Starts 16-bit Timer1
0 = Stops 16-bit Timer1
bit 14 Unimplemented: Read as ‘0’
bit 13 TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7 Unimplemented: Read as ‘0’
bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4 TCKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3 Unimplemented: Read as ‘0’
bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit
When TCS = 1:
1 = Synchronize external clock input
0 = Do not synchronize external clock input
When TCS = 0:
This bit is ignored.
bit 1 TCS: Timer1 Clock Source Select bit
1 = External clock from T1CK pin (on the rising edge)
0 = Internal clock (FOSC/2)
bit 0 Unimplemented: Read as ‘0’
Note 1: Changing the value of TxCON while the timer is running (TON = 1) causes the timer prescale counter to
reset and is not recommended.
2009 Microchip Technology Inc. DS39897C-page 163
PIC24FJ256GB110 FAMILY
12.0 TIMER2/3 AND TIMER4/5
The Timer2/3 and Timer4/5 modules are 32-bit timers,
which can also be configured as four independent, 16-bit
timers with selectable operating modes.
As 32-bit timers, Timer2/3 and Timer4/5 can each
operate in three modes:
• Two independent 16-bit timers with all 16-bit
operating modes (except Asynchronous Counter
mode)
• Single 32-bit timer
• Single 32-bit synchronous counter
They also support these features:
• Timer Gate Operation
• Selectable Prescaler Settings
• Timer Operation during Idle and Sleep modes
• Interrupt on a 32-Bit Period Register Match
• ADC Event Trigger (Timer4/5 only)
Individually, all four of the 16-bit timers can function as
synchronous timers or counters. They also offer the
features listed above, except for the ADC Event
Trigger; this is implemented only with Timer3. The
operating modes and enabled features are determined
by setting the appropriate bit(s) in the T2CON, T3CON,
T4CON and T5CON registers. T2CON and T4CON are
shown in generic form in Register 12-1; T3CON and
T5CON are shown in Register 12-2.
For 32-bit timer/counter operation, Timer2 and Timer4
are the least significant word; Timer3 and Timer4 are
the most significant word of the 32-bit timers.
To configure Timer2/3 or Timer4/5 for 32-bit operation:
1. Set the T32 bit (T2CON<3> or T4CON<3> = 1).
2. Select the prescaler ratio for Timer2 or Timer4
using the TCKPS<1:0> bits.
3. Set the Clock and Gating modes using the TCS
and TGATE bits. If TCS is set to external clock,
RPINRx (TxCK) must be configured to an available
RPn pin. See Section 10.4 “Peripheral
Pin Select” for more information.
4. Load the timer period value. PR3 (or PR5) will
contain the most significant word of the value
while PR2 (or PR4) contains the least significant
word.
5. If interrupts are required, set the interrupt enable
bit, T3IE or T5IE; use the priority bits, T3IP<2:0>
or T5IP<2:0>, to set the interrupt priority. Note
that while Timer2 or Timer4 controls the timer,
the interrupt appears as a Timer3 or Timer5
interrupt.
6. Set the TON bit (= 1).
The timer value, at any point, is stored in the register
pair, TMR3:TMR2 (or TMR5:TMR4). TMR3 (TMR5)
always contains the most significant word of the count,
while TMR2 (TMR4) contains the least significant word.
To configure any of the timers for individual 16-bit
operation:
1. Clear the T32 bit corresponding to that timer
(T2CON<3> for Timer2 and Timer3 or
T4CON<3> for Timer4 and Timer5).
2. Select the timer prescaler ratio using the
TCKPS<1:0> bits.
3. Set the Clock and Gating modes using the TCS
and TGATE bits. See Section 10.4 “Peripheral
Pin Select” for more information.
4. Load the timer period value into the PRx register.
5. If interrupts are required, set the interrupt enable
bit, TxIE; use the priority bits, TxIP<2:0>, to set
the interrupt priority.
6. Set the TON bit (TxCON<15> = 1).
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 14. “Timers” (DS39704).
Note: For 32-bit operation, T3CON and T5CON
control bits are ignored. Only T2CON and
T4CON control bits are used for setup and
control. Timer2 and Timer4 clock and gate
inputs are utilized for the 32-bit timer
modules, but an interrupt is generated with
the Timer3 or Timer5 interrupt flags.
PIC24FJ256GB110 FAMILY
DS39897C-page 164 2009 Microchip Technology Inc.
FIGURE 12-1: TIMER2/3 AND TIMER4/5 (32-BIT) BLOCK DIAGRAM
TMR3 TMR2
Set T3IF (T5IF)
Equal
Comparator
PR3 PR2
Reset
MSB LSB
Note 1: The 32-Bit Timer Configuration bit, T32, must be set for 32-bit timer/counter operation. All control bits are
respective to the T2CON and T4CON registers.
2: The timer clock input must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral
Pin Select” for more information.
3: The ADC Event Trigger is available only on Timer 2/3 in 32-bit mode and Timer 3 in 16-bit mode.
Data Bus<15:0>
TMR3HLD
Read TMR2 (TMR4)(1)
Write TMR2 (TMR4)(1)
16
16
16
Q
Q D
CK
TGATE
0
1
TON
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TCY
TCS(2)
TGATE(2)
Gate
T2CK
Sync
ADC Event Trigger(3)
Sync
(T4CK)
(PR5) (PR4)
(TMR5HLD)
(TMR5) (TMR4)
1x
01
00
2009 Microchip Technology Inc. DS39897C-page 165
PIC24FJ256GB110 FAMILY
FIGURE 12-2: TIMER2 AND TIMER4 (16-BIT SYNCHRONOUS) BLOCK DIAGRAM
FIGURE 12-3: TIMER3 AND TIMER5 (16-BIT ASYNCHRONOUS) BLOCK DIAGRAM
TON
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TCY TCS(1)
1x
01
TGATE(1)
00
Gate
T2CK
Sync
PR2 (PR4)
Set T2IF (T4IF)
Equal
Comparator
TMR2 (TMR4)
Reset
Q
Q D
CK
TGATE
1
0
(T4CK)
Sync
Note 1: The timer clock input must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral
Pin Select” for more information.
TON
TCKPS<1:0>
2
TCY TCS(1)
1x
01
TGATE(1)
00
T3CK
PR3 (PR5)
Set T3IF (T5IF)
Equal
Comparator
TMR3 (TMR5)
Reset
Q
Q D
CK
TGATE
1
0
ADC Event Trigger(2)
(T5CK)
Prescaler
1, 8, 64, 256
Sync
Note 1: The timer clock input must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral
Pin Select” for more information.
2: The ADC Event Trigger is available only on Timer3.
PIC24FJ256GB110 FAMILY
DS39897C-page 166 2009 Microchip Technology Inc.
REGISTER 12-1: TxCON: TIMER2 AND TIMER4 CONTROL REGISTER(3)
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON — TSIDL — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0
— TGATE TCKPS1 TCKPS0 T32(1) — TCS(2) —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TON: Timerx On bit
When TxCON<3> = 1:
1 = Starts 32-bit Timerx/y
0 = Stops 32-bit Timerx/y
When TxCON<3> = 0:
1 = Starts 16-bit Timerx
0 = Stops 16-bit Timerx
bit 14 Unimplemented: Read as ‘0’
bit 13 TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7 Unimplemented: Read as ‘0’
bit 6 TGATE: Timerx Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4 TCKPS<1:0>: Timerx Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3 T32: 32-Bit Timer Mode Select bit(1)
1 = Timerx and Timery form a single 32-bit timer
0 = Timerx and Timery act as two 16-bit timers
In 32-bit mode, T3CON control bits do not affect 32-bit timer operation.
bit 2 Unimplemented: Read as ‘0’
bit 1 TCS: Timerx Clock Source Select bit(2)
1 = External clock from pin, TxCK (on the rising edge)
0 = Internal clock (FOSC/2)
bit 0 Unimplemented: Read as ‘0’
Note 1: In 32-bit mode, the T3CON or T5CON control bits do not affect 32-bit timer operation.
2: If TCS = 1, RPINRx (TxCK) must be configured to an available RPn pin. For more information, see
Section 10.4 “Peripheral Pin Select”.
3: Changing the value of TxCON while the timer is running (TON = 1) causes the timer prescale counter to
reset and is not recommended.
2009 Microchip Technology Inc. DS39897C-page 167
PIC24FJ256GB110 FAMILY
REGISTER 12-2: TyCON: TIMER3 AND TIMER5 CONTROL REGISTER(3)
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON(1) — TSIDL(1) — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0
— TGATE(1) TCKPS1(1) TCKPS0(1) — — TCS(1,2) —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TON: Timery On bit(1)
1 = Starts 16-bit Timery
0 = Stops 16-bit Timery
bit 14 Unimplemented: Read as ‘0’
bit 13 TSIDL: Stop in Idle Mode bit(1)
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7 Unimplemented: Read as ‘0’
bit 6 TGATE: Timery Gated Time Accumulation Enable bit(1)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4 TCKPS<1:0>: Timery Input Clock Prescale Select bits(1)
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3-2 Unimplemented: Read as ‘0’
bit 1 TCS: Timery Clock Source Select bit(1,2)
1 = External clock from pin TyCK (on the rising edge)
0 = Internal clock (FOSC/2)
bit 0 Unimplemented: Read as ‘0’
Note 1: When 32-bit operation is enabled (T2CON<3> or T4CON<3> = 1), these bits have no effect on Timery
operation; all timer functions are set through T2CON and T4CON.
2: If TCS = 1, RPINRx (TxCK) must be configured to an available RPn pin. See Section 10.4 “Peripheral
Pin Select” for more information.
3: Changing the value of TyCON while the timer is running (TON = 1) causes the timer prescale counter to
reset and is not recommended.
PIC24FJ256GB110 FAMILY
DS39897C-page 168 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 169
PIC24FJ256GB110 FAMILY
13.0 INPUT CAPTURE WITH
DEDICATED TIMERS
Devices in the PIC24FJ256GB110 family all feature
9 independent input capture modules. Each of the
modules offers a wide range of configuration and
operating options for capturing external pulse events
and generating interrupts.
Key features of the input capture module include:
• Hardware-configurable for 32-bit operation in all
modes by cascading two adjacent modules
• Synchronous and Trigger modes of output
compare operation, with up to 30 user-selectable
trigger/sync sources available
• A 4-level FIFO buffer for capturing and holding
timer values for several events
• Configurable interrupt generation
• Up to 6 clock sources available for each module,
driving a separate internal 16-bit counter
The module is controlled through two registers,
ICxCON1 (Register 13-1) and ICxCON2
(Register 13-2). A general block diagram of the module
is shown in Figure 13-1.
13.1 General Operating Modes
13.1.1 SYNCHRONOUS AND TRIGGER
MODES
By default, the input capture module operates in a
free-running mode. The internal 16-bit counter,
ICxTMR, counts up continuously, wrapping around
from FFFFh to 0000h on each overflow, with its period
synchronized to the selected external clock source.
When a capture event occurs, the current 16-bit value
of the internal counter is written to the FIFO buffer.
In Synchronous mode, the module begins capturing
events on the ICx pin as soon as its selected clock
source is enabled. Whenever an event occurs on the
selected sync source, the internal counter is reset. In
Trigger mode, the module waits for a Sync event from
another internal module to occur before allowing the
internal counter to run.
Standard, free-running operation is selected by setting
the SYNCSEL bits to ‘00000’, and clearing the ICTRIG
bit (ICxCON2<7>). Synchronous and Trigger modes
are selected any time the SYNCSEL bits are set to any
value except ‘00000’. The ICTRIG bit selects either
Synchronous or Trigger mode; setting the bit selects
Trigger mode operation. In both modes, the SYNCSEL
bits determine the sync/trigger source.
When the SYNCSEL bits are set to ‘00000’ and
ICTRIG is set, the module operates in Software Trigger
mode. In this case, capture operations are started by
manually setting the TRIGSTAT bit (ICxCON2<6>).
FIGURE 13-1: INPUT CAPTURE BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 34. “Input Capture with
Dedicated Timer” (DS39722).
ICxBUF
4-Level FIFO Buffer
ICx Pin(1)
ICM<2:0>
Edge Detect Logic Set ICxIF
ICI<1:0>
ICOV, ICBNE
Interrupt
Logic
System Bus
Prescaler
Counter
1:1/4/16
and
Clock Synchronizer
Note 1: The ICx inputs must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral
Pin Select” for more information.
Event and
Trigger and
Sync Logic
Clock
IC Clock Select
Sources
Trigger and
Sync Sources
ICTSEL<2:0>
SYNCSEL<4:0>
TRIGGER
16
16
16
ICxTMR
Increment
Reset
PIC24FJ256GB110 FAMILY
DS39897C-page 170 2009 Microchip Technology Inc.
13.1.2 CASCADED (32-BIT) MODE
By default, each module operates independently with
its own 16-bit timer. To increase resolution, adjacent
even and odd modules can be configured to function as
a single 32-bit module. (For example, modules 1 and 2
are paired, as are modules 3 and 4, and so on.) The
odd numbered module (ICx) provides the Least Significant
16 bits of the 32-bit register pairs, and the even
module (ICy) provides the Most Significant 16 bits.
Wraparounds of the ICx registers cause an increment
of their corresponding ICy registers.
Cascaded operation is configured in hardware by
setting the IC32 bits (ICxCON2<8>) for both modules.
13.2 Capture Operations
The input capture module can be configured to capture
timer values and generate interrupts on rising edges on
ICx, or all transitions on ICx. Captures can be configured
to occur on all rising edges, or just some (every 4th or
16th). Interrupts can be independently configured to
generate on each event, or a subset of events.
To set up the module for capture operations:
1. Configure the ICx input for one of the available
Peripheral Pin Select pins.
2. If Synchronous mode is to be used, disable the
sync source before proceeding.
3. Make sure that any previous data has been
removed from the FIFO by reading ICxBUF until
the ICBNE bit (ICxCON1<3>) is cleared.
4. Set the SYNCSEL bits (ICxCON2<4:0>) to the
desired sync/trigger source.
5. Set the ICTSEL bits (ICxCON1<12:10>) for the
desired clock source.
6. Set the ICI bits (ICxCON1<6:5>) to the desired
interrupt frequency
7. Select Synchronous or Trigger mode operation:
a) Check that the SYNCSEL bits are not set to
‘00000’.
b) For Synchronous mode, clear the ICTRIG
bit (ICxCON2<7>).
c) For Trigger mode, set ICTRIG, and clear the
TRIGSTAT bit (ICxCON2<6>).
8. Set the ICM bits (ICxCON1<2:0>) to the desired
operational mode.
9. Enable the selected trigger/sync source.
For 32-bit cascaded operations, the setup procedure is
slightly different:
1. Set the IC32 bits for both modules
(ICyCON2<8> and (ICxCON2<8>), enabling the
even numbered module first. This ensures the
modules will start functioning in unison.
2. Set the ICTSEL and SYNCSEL bits for both
modules to select the same sync/trigger and
time base source. Set the even module first,
then the odd module. Both modules must use
the same ICTSEL and SYNCSEL settings.
3. Clear the ICTRIG bit of the even module
(ICyCON2<7>); this forces the module to run in
Synchronous mode with the odd module,
regardless of its trigger setting.
4. Use the odd module’s ICI bits (ICxCON1<6:5>)
to the desired interrupt frequency.
5. Use the ICTRIG bit of the odd module
(ICxCON2<7>) to configure Trigger or
Synchronous mode operation.
6. Use the ICM bits of the odd module
(ICxCON1<2:0>) to set the desired capture
mode.
The module is ready to capture events when the time
base and the trigger/sync source are enabled. When
the ICBNE bit (ICxCON1<3>) becomes set, at least
one capture value is available in the FIFO. Read input
capture values from the FIFO until the ICBNE clears to
‘0’.
For 32-bit operation, read both the ICxBUF and
ICyBUF for the full 32-bit timer value (ICxBUF for the
lsw, ICyBUF for the msw). At least one capture value is
available in the FIFO buffer when the odd module’s
ICBNE bit (ICxCON1<3>) becomes set. Continue to
read the buffer registers until ICBNE is cleared
(perform automatically by hardware).
Note: For Synchronous mode operation, enable
the sync source as the last step. Both
input capture modules are held in Reset
until the sync source is enabled.
2009 Microchip Technology Inc. DS39897C-page 171
PIC24FJ256GB110 FAMILY
REGISTER 13-1: ICxCON1: INPUT CAPTURE x CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
— — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R-0, HC R-0, HC R/W-0 R/W-0 R/W-0
— ICI1 ICI0 ICOV ICBNE ICM2(1) ICM1(1) ICM0(1)
bit 7 bit 0
Legend: HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 ICSIDL: Input Capture x Module Stop in Idle Control bit
1 = Input capture module halts in CPU Idle mode
0 = Input capture module continues to operate in CPU Idle mode
bit 12-10 ICTSEL<2:0>: Input Capture Timer Select bits
111 = System clock (FOSC/2)
110 = Reserved
101 = Reserved
100 = Timer1
011 = Timer5
010 = Timer4
001 = Timer2
000 = Timer3
bit 9-7 Unimplemented: Read as ‘0’
bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4 ICOV: Input Capture x Overflow Status Flag bit (read-only)
1 = Input capture overflow occurred
0 = No input capture overflow occurred
bit 3 ICBNE: Input Capture x Buffer Empty Status bit (read-only)
1 = Input capture buffer is not empty, at least one more capture value can be read
0 = Input capture buffer is empty
bit 2-0 ICM<2:0>: Input Capture Mode Select bits(1)
111 = Interrupt mode: input capture functions as interrupt pin only when device is in Sleep or Idle mode
(rising edge detect only, all other control bits are not applicable)
110 = Unused (module disabled)
101 = Prescaler Capture mode: capture on every 16th rising edge
100 = Prescaler Capture mode: capture on every 4th rising edge
011 = Simple Capture mode: capture on every rising edge
010 = Simple Capture mode: capture on every falling edge
001 = Edge Detect Capture mode: capture on every edge (rising and falling), ICI<1:0> bits do not
control interrupt generation for this mode
000 = Input capture module turned off
Note 1: The ICx input must also be configured to an available RPn pin. For more information, see Section 10.4
“Peripheral Pin Select”.
PIC24FJ256GB110 FAMILY
DS39897C-page 172 2009 Microchip Technology Inc.
REGISTER 13-2: ICxCON2: INPUT CAPTURE x CONTROL REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — — IC32
bit 15 bit 8
R/W-0 R/W-0 HS U-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-1
ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0
bit 7 bit 0
Legend: HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-9 Unimplemented: Read as ‘0’
bit 8 IC32: Cascade Two IC Modules Enable bit (32-bit operation)
1 = ICx and ICy operate in cascade as a 32-bit module (this bit must be set in both modules)
0 = ICx functions independently as a 16-bit module
bit 7 ICTRIG: ICx Trigger/Sync Select bit
1 = Trigger ICx from source designated by SYNCSELx bits
0 = Synchronize ICx with source designated by SYNCSELx bits
bit 6 TRIGSTAT: Timer Trigger Status bit
1 = Timer source has been triggered and is running (set in hardware, can be set in software)
0 = Timer source has not been triggered and is being held clear
bit 5 Unimplemented: Read as ‘0’
bit 4-0 SYNCSEL<4:0>: Trigger/Synchronization Source Selection bits
11111 = Reserved
11110 = Input Capture 9
11101 = Input Capture 6
11100 = CTMU(1)
11011 = A/D(1)
11010 = Comparator 3(1)
11001 = Comparator 2(1)
11000 = Comparator 1(1)
10111 = Input Capture 4
10110 = Input Capture 3
10101 = Input Capture 2
10100 = Input Capture 1
10011 = Input Capture 8
10010 = Input Capture 7
1000x = reserved
01111 = Timer5
01110 = Timer4
01101 = Timer3
01100 = Timer2
01011 = Timer1
01010 = Input Capture 5
01001 = Output Compare 9
01000 = Output Compare 8
00111 = Output Compare 7
00110 = Output Compare 6
00101 = Output Compare 5
00100 = Output Compare 4
00011 = Output Compare 3
00010 = Output Compare 2
00001 = Output Compare 1
00000 = Not synchronized to any other module
Note 1: Use these inputs as trigger sources only and never as sync sources.
2009 Microchip Technology Inc. DS39897C-page 173
PIC24FJ256GB110 FAMILY
14.0 OUTPUT COMPARE WITH
DEDICATED TIMERS
Devices in the PIC24FJ256GB110 family all feature
9 independent output compare modules. Each of these
modules offers a wide range of configuration and operating
options for generating pulse trains on internal
device events, and can produce pulse-width modulated
waveforms for driving power applications.
Key features of the output compare module include:
• Hardware-configurable for 32-bit operation in all
modes by cascading two adjacent modules
• Synchronous and Trigger modes of output
compare operation, with up to 30 user-selectable
trigger/sync sources available
• Two separate period registers (a main register,
OCxR, and a secondary register, OCxRS) for
greater flexibility in generating pulses of varying
widths
• Configurable for single-pulse or continuous pulse
generation on an output event, or continuous
PWM waveform generation
• Up to 6 clock sources available for each module,
driving a separate internal 16-bit counter
14.1 General Operating Modes
14.1.1 SYNCHRONOUS AND TRIGGER
MODES
By default, the output compare module operates in a
free-running mode. The internal 16-bit counter,
OCxTMR, runs counts up continuously, wrapping
around from FFFFh to 0000h on each overflow, with its
period synchronized to the selected external clock
source. Compare or PWM events are generated each
time a match between the internal counter and one of
the period registers occurs.
In Synchronous mode, the module begins performing
its compare or PWM operation as soon as its selected
clock source is enabled. Whenever an event occurs on
the selected sync source, the module’s internal counter
is reset. In Trigger mode, the module waits for a sync
event from another internal module to occur before
allowing the counter to run.
Free-running mode is selected by default, or any time
that the SYNCSEL bits (OCxCON2<4:0>) are set to
‘00000’. Synchronous or Trigger modes are selected
any time the SYNCSEL bits are set to any value except
‘00000’. The OCTRIG bit (OCxCON2<7>) selects
either Synchronous or Trigger mode; setting the bit
selects Trigger mode operation. In both modes, the
SYNCSEL bits determine the sync/trigger source.
14.1.2 CASCADED (32-BIT) MODE
By default, each module operates independently with
its own set of 16-bit timer and duty cycle registers. To
increase resolution, adjacent even and odd modules
can be configured to function as a single 32-bit module.
(For example, modules 1 and 2 are paired, as are modules
3 and 4, and so on.) The odd numbered module
(OCx) provides the Least Significant 16 bits of the
32-bit register pairs, and the even module (OCy)
provides the Most Significant 16 bits. Wraparounds of
the OCx registers cause an increment of their
corresponding OCy registers.
Cascaded operation is configured in hardware by setting
the OC32 bits (OCxCON2<8>) for both modules.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 35. “Output Compare with
Dedicated Timers” (DS39723).
PIC24FJ256GB110 FAMILY
DS39897C-page 174 2009 Microchip Technology Inc.
14.2 Compare Operations
In Compare mode (Figure 14-1), the output compare
module can be configured for single-shot or continuous
pulse generation; it can also repeatedly toggle an
output pin on each timer event.
To set up the module for compare operations:
1. Configure the OCx output for one of the
available Peripheral Pin Select pins.
2. Calculate the required values for the OCxR and
(for Double Compare modes) OCxRS duty cycle
registers:
a) Determine the instruction clock cycle time.
Take into account the frequency of the
external clock to the timer source (if one is
used) and the timer prescaler settings.
b) Calculate time to the rising edge of the output
pulse relative to the timer start value
(0000h).
c) Calculate the time to the falling edge of the
pulse based on the desired pulse width and
the time to the rising edge of the pulse.
3. Write the rising edge value to OCxR, and the
falling edge value to OCxRS.
4. Set the Timer Period register, PRy, to a value
equal to or greater than the value in OCxRS.
5. Set the OCM<2:0> bits for the appropriate
compare operation (= 0xx).
6. For Trigger mode operations, set OCTRIG to
enable Trigger mode. Set or clear TRIGMODE to
configure trigger operation, and TRIGSTAT to
select a hardware or software trigger. For
Synchronous mode, clear OCTRIG.
7. Set the SYNCSEL<4:0> bits to configure the
trigger or synchronization source. If free-running
timer operation is required, set the SYNCSEL
bits to ‘00000’ (no sync/trigger source).
8. Select the time base source with the
OCTSEL<2:0> bits. If necessary, set the TON bit
for the selected timer which enables the compare
time base to count. Synchronous mode operation
starts as soon as the time base is enabled; Trigger
mode operation starts after a trigger source event
occurs.
FIGURE 14-1: OUTPUT COMPARE BLOCK DIAGRAM (16-BIT MODE)
OCxR
Comparator
OCxTMR
OCxCON1
OCxCON2
OC Output and
OCx Interrupt
OCx Pin(1)
OCxRS
Comparator
Fault Logic
Match Event
Match Event
Trigger and
Sync Logic
Clock
Select
Increment
Reset
OC Clock
Sources
Trigger and
Sync Sources
Reset
Match Event
OCFA/OCFB
OCTSELx
SYNCSELx
TRIGSTAT
TRIGMODE
OCTRIG
OCMx
OCINV
OCTRIS
FLTOUT
FLTTRIEN
FLTMD
ENFLT0
OCFLT0
Note 1: The OCx outputs must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral
Pin Select” for more information.
2009 Microchip Technology Inc. DS39897C-page 175
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For 32-bit cascaded operation, these steps are also
necessary:
1. Set the OC32 bits for both registers
(OCyCON2<8> and (OCxCON2<8>). Enable
the even numbered module first to ensure the
modules will start functioning in unison.
2. Clear the OCTRIG bit of the even module
(OCyCON2), so the module will run in
Synchronous mode.
3. Configure the desired output and Fault settings
for OCy.
4. Force the output pin for OCx to the output state
by clearing the OCTRIS bit.
5. If Trigger mode operation is required, configure
the trigger options in OCx by using the OCTRIG
(OCxCON2<7>), TRIGSTAT (OCxCON2<6>),
and SYNCSEL (OCxCON2<4:0>) bits.
6. Configure the desired compare or PWM mode of
operation (OCM<2:0>) for OCy first, then for
OCx.
Depending on the output mode selected, the module
holds the OCx pin in its default state, and forces a transition
to the opposite state when OCxR matches the
timer. In Double Compare modes, OCx is forced back
to its default state when a match with OCxRS occurs.
The OCxIF interrupt flag is set after an OCxR match in
Single Compare modes, and after each OCxRS match
in Double Compare modes.
Single-shot pulse events only occur once, but may be
repeated by simply rewriting the value of the
OCxCON1 register. Continuous pulse events continue
indefinitely until terminated.
14.3 Pulse-Width Modulation (PWM)
Mode
In PWM mode, the output compare module can be
configured for edge-aligned or center-aligned pulse
waveform generation. All PWM operations are
double-buffered (buffer registers are internal to the
module and are not mapped into SFR space).
To configure the output compare module for PWM
operation:
1. Configure the OCx output for one of the
available Peripheral Pin Select pins.
2. Calculate the desired duty cycles and load them
into the OCxR register.
3. Calculate the desired period and load it into the
OCxRS register.
4. Select the current OCx as the sync source by writing
0x1F to SYNCSEL<4:0> (OCxCON2<4:0>),
and clearing OCTRIG (OCxCON2<7>).
5. Select a clock source by writing the
OCTSEL<2:0> (OCxCON<12:10>) bits.
6. Enable interrupts, if required, for the timer and
output compare modules. The output compare
interrupt is required for PWM Fault pin utilization.
7. Select the desired PWM mode in the OCM<2:0>
(OCxCON1<2:0>) bits.
8. If a timer is selected as a clock source, set the
TMRy prescale value and enable the time base by
setting the TON (TxCON<15>) bit.
Note: This peripheral contains input and output
functions that may need to be configured
by the Peripheral Pin Select. See
Section 10.4 “Peripheral Pin Select” for
more information.
PIC24FJ256GB110 FAMILY
DS39897C-page 176 2009 Microchip Technology Inc.
FIGURE 14-2: OUTPUT COMPARE BLOCK DIAGRAM (DOUBLE-BUFFERED, 16-BIT PWM MODE)
14.3.1 PWM PERIOD
The PWM period is specified by writing to PRy, the
Timer Period register. The PWM period can be
calculated using Equation 14-1.
EQUATION 14-1: CALCULATING THE PWM
PERIOD(1)
14.3.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing to the
OCxRS and OCxR registers. The OCxRS and OCxR
registers can be written to at any time, but the duty
cycle value is not latched until a match between PRy
and TMRy occurs (i.e., the period is complete). This
provides a double buffer for the PWM duty cycle and is
essential for glitchless PWM operation.
Some important boundary parameters of the PWM duty
cycle include:
• If OCxR, OCxRS, and PRy are all loaded with
0000h, the OCx pin will remain low (0% duty
cycle).
• ·If OCxRS is greater than PRy, the pin will remain
high (100% duty cycle).
See Example 14-1 for PWM mode timing details.
Table 14-1 and Table 14-2 show example PWM
frequencies and resolutions for a device operating at
4 MIPS and 10 MIPS, respectively.
OCxR buffer
Comparator
OCxTMR
OCxCON1
OCxCON2
OC Output and
OCx Interrupt
OCx Pin
OCxRS buffer
Comparator
Fault Logic
Match
Match
Trigger and
Sync Logic
Clock
Select
Increment
Reset
OC Clock
Sources
Trigger and
Sync Sources
Reset
Match Event
OCFA/OCFB
OCTSELx
SYNCSELx
TRIGSTAT
TRIGMODE
OCTRIG
OCMx
OCINV
OCTRIS
FLTOUT
FLTTRIEN
FLTMD
ENFLT0
OCFLT0
OCxR
OCxRS
Event
Event
Rollover
Rollover/Reset
Rollover/Reset
Note 1: The OCx outputs must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral
Pin Select” for more information.
Note: A PRy value of N will produce a PWM
period of N + 1 time base count cycles. For
example, a value of 7 written into the PRy
register will yield a period consisting of
8 time base cycles.
PWM Period = [(PRy) + 1] • TCY • (Timer Prescale Value)
PWM Fr where: equency = 1/[PWM Period]
Note 1: Based on TCY = TOSC * 2, Doze mode
and PLL are disabled.
2009 Microchip Technology Inc. DS39897C-page 177
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EQUATION 14-2: CALCULATION FOR MAXIMUM PWM RESOLUTION(1)
EXAMPLE 14-1: PWM PERIOD AND DUTY CYCLE CALCULATIONS(1)
TABLE 14-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 4 MIPS (FCY = 4 MHz)(1)
TABLE 14-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 16 MIPS (FCY = 16 MHz)(1)
PWM Frequency 7.6 Hz 61 Hz 122 Hz 977 Hz 3.9 kHz 31.3 kHz 125 kHz
Timer Prescaler Ratio 8 1 1 1 1 1 1
Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh
Resolution (bits) 16 16 15 12 10 7 5
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
PWM Frequency 30.5 Hz 244 Hz 488 Hz 3.9 kHz 15.6 kHz 125 kHz 500 kHz
Timer Prescaler Ratio 8 1 1 1 1 1 1
Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh
Resolution (bits) 16 16 15 12 10 7 5
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
( )
Maximum PWM Resolution (bits) =
FCY
FPWM • (Timer Prescale Value)
log10
log10(2)
bits
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
1. Find the Timer Period register value for a desired PWM frequency of 52.08 kHz, where FOSC = 8 MHz with PLL (32 MHz
device clock rate) and a Timer2 prescaler setting of 1:1.
TCY = 2 * TOSC = 62.5 ns
PWM Period = 1/PWM Frequency = 1/52.08 kHz = 19.2 s
PWM Period = (PR2 + 1) • TCY • (Timer 2 Prescale Value)
19.2 s = (PR2 + 1) • 62.5 ns • 1
PR2 = 306
2. Find the maximum resolution of the duty cycle that can be used with a 52.08 kHz frequency and a 32 MHz device clock rate:
PWM Resolution = log10(FCY/FPWM)/log102) bits
= (log10(16 MHz/52.08 kHz)/log102) bits
= 8.3 bits
Note 1: Based on TCY = 2 * TOSC; Doze mode and PLL are disabled.
PIC24FJ256GB110 FAMILY
DS39897C-page 178 2009 Microchip Technology Inc.
REGISTER 14-1: OCxCON1: OUTPUT COMPARE x CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
— — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — —
bit 15 bit 8
R/W-0 U-0 U-0 R/W-0, HCS R/W-0 R/W-0 R/W-0 R/W-0
ENFLT0 — — OCFLT0 TRIGMODE OCM2(1) OCM1(1) OCM0(1)
bit 7 bit 0
Legend: HCS = Hardware Clearable/Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 OCSIDL: Stop Output Compare x in Idle Mode Control bit
1 = Output Compare x halts in CPU Idle mode
0 = Output Compare x continues to operate in CPU Idle mode
bit 12-10 OCTSEL<2:0>: Output Compare x Timer Select bits
111 = System Clock
110 = Reserved
101 = Reserved
100 = Timer1
011 = Timer5
010 = Timer4
001 = Timer3
000 = Timer2
bit 9-8 Unimplemented: Read as ‘0’
bit 7 ENFLT0: Fault 0 Input Enable bit
1 = Fault 0 input is enabled
0 = Fault 0 input is disabled
bit 6-5 Unimplemented: Read as ‘0’
bit 4 OCFLT0: PWM Fault Condition Status bit
1 = PWM Fault condition has occurred (cleared in HW only)
0 = No PWM Fault condition has occurred (this bit is only used when OCM<2:0> = 111)
bit 3 TRIGMODE: Trigger Status Mode Select bit
1 = TRIGSTAT (OCxCON2<6>) is cleared when OCxRS = OCxTMR or in software
0 = TRIGSTAT is only cleared by software
bit 2-0 OCM<2:0>: Output Compare x Mode Select bits(1)
111 = Center-aligned PWM mode on OCx(2)
110 = Edge-aligned PWM Mode on OCx(2)
101 = Double Compare Continuous Pulse mode: Initialize OCx pin low, toggle OCx state
continuously on alternate matches of OCxR and OCxRS
100 = Double Compare Single-Shot mode: Initialize OCx pin low, toggle OCx state on matches of
OCxR and OCxRS for one cycle
011 = Single Compare Continuous Pulse mode: Compare events continuously toggle OCx pin
010 = Single Compare Single-Shot mode: Initialize OCx pin high, compare event forces OCx pin low
001 = Single Compare Single-Shot mode: Initialize OCx pin low, compare event forces OCx pin high
000 = Output compare channel is disabled
Note 1: The OCx output must also be configured to an available RPn pin. For more information, see Section 10.4
“Peripheral Pin Select”.
2: OCFA pin controls the OC1-OC4 channels; OCFB pin controls the OC5-OC9 channels. OCxR and
OCxRS are double-buffered only in PWM modes.
2009 Microchip Technology Inc. DS39897C-page 179
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REGISTER 14-2: OCxCON2: OUTPUT COMPARE x CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0
FLTMD FLTOUT FLTTRIEN OCINV — — — OC32
bit 15 bit 8
R/W-0 R/W-0 HS R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0
OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0
bit 7 bit 0
Legend: HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FLTMD: Fault Mode Select bit
1 = Fault mode is maintained until the Fault source is removed and the corresponding OCFLT0 bit is
cleared in software
0 = Fault mode is maintained until the Fault source is removed and a new PWM period starts
bit 14 FLTOUT: Fault Out bit
1 = PWM output is driven high on a Fault
0 = PWM output is driven low on a Fault
bit 13 FLTTRIEN: Fault Output State Select bit
1 = Pin is forced to an output on a Fault condition
0 = Pin I/O condition is unaffected by a Fault
bit 12 OCINV: OCMP Invert bit
1 = OCx output is inverted
0 = OCx output is not inverted
bit 11-9 Unimplemented: Read as ‘0’
bit 8 OC32: Cascade Two OC Modules Enable bit (32-bit operation)
1 = Cascade module operation enabled
0 = Cascade module operation disabled
bit 7 OCTRIG: OCx Trigger/Sync Select bit
1 = Trigger OCx from source designated by the SYNCSELx bits
0 = Synchronize OCx with source designated by the SYNCSELx bits
bit 6 TRIGSTAT: Timer Trigger Status bit
1 = Timer source has been triggered and is running
0 = Timer source has not been triggered and is being held clear
bit 5 OCTRIS: OCx Output Pin Direction Select bit
1 = OCx pin is tristated
0 = Output compare peripheral x connected to OCx pin
Note 1: Never use an OC module as its own trigger source, either by selecting this mode or another equivalent
SYNCSEL setting.
2: Use these inputs as trigger sources only and never as sync sources.
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bit 4-0 SYNCSEL<4:0>: Trigger/Synchronization Source Selection bits
11111 = This OC module(1)
11110 = Input Capture 9(2)
11101 = Input Capture 6(2)
11100 = CTMU(2)
11011 = A/D(2)
11010 = Comparator 3(2)
11001 = Comparator 2(2)
11000 = Comparator 1(2)
10111 = Input Capture 4(2)
10110 = Input Capture 3(2)
10101 = Input Capture 2(2)
10100 = Input Capture 1(2)
10011 = Input Capture 8(2)
10010 = Input Capture 7(2)
1000x = reserved
01111 = Timer 5
01110 = Timer 4
01101 = Timer 3
01100 = Timer 2
01011 = Timer 1
01010 = Input Capture 5(2)
01001 = Output Compare 9(1)
01000 = Output Compare 8(1)
00111 = Output Compare 7(1)
00110 = Output Compare 6(1)
00101 = Output Compare 5(1)
00100 = Output Compare 4(1)
00011 = Output Compare 3(1)
00010 = Output Compare 2(1)
00001 = Output Compare 1(1)
00000 = Not synchronized to any other module
REGISTER 14-2: OCxCON2: OUTPUT COMPARE x CONTROL REGISTER 2
Note 1: Never use an OC module as its own trigger source, either by selecting this mode or another equivalent
SYNCSEL setting.
2: Use these inputs as trigger sources only and never as sync sources.
2009 Microchip Technology Inc. DS39897C-page 181
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15.0 SERIAL PERIPHERAL
INTERFACE (SPI)
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface useful for communicating
with other peripheral or microcontroller devices. These
peripheral devices may be serial EEPROMs, shift
registers, display drivers, A/D Converters, etc. The SPI
module is compatible with Motorola’s SPI and SIOP
interfaces. All devices of the PIC24FJ256GB110 family
include three SPI modules
The module supports operation in two buffer modes. In
Standard mode, data is shifted through a single serial
buffer. In Enhanced Buffer mode, data is shifted
through an 8-level FIFO buffer.
The module also supports a basic framed SPI protocol
while operating in either Master or Slave mode. A total
of four framed SPI configurations are supported.
The SPI serial interface consists of four pins:
• SDIx: Serial Data Input
• SDOx: Serial Data Output
• SCKx: Shift Clock Input or Output
• SSx: Active-Low Slave Select or Frame
Synchronization I/O Pulse
The SPI module can be configured to operate using
2, 3 or 4 pins. In the 3-pin mode, SSx is not used. In the
2-pin mode, both SDOx and SSx are not used.
Block diagrams of the module in Standard and
Enhanced modes are shown in Figure 15-1 and
Figure 15-2.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 23. “Serial Peripheral Interface
(SPI)” (DS39699).
Note: Do not perform read-modify-write operations
(such as bit-oriented instructions) on
the SPIxBUF register in either Standard or
Enhanced Buffer mode.
Note: In this section, the SPI modules are
referred to together as SPIx or separately
as SPI1, SPI2 or SPI3. Special Function
Registers will follow a similar notation. For
example, SPIxCON1 and SPIxCON2 refer
to the control registers for any of the 3 SPI
modules.
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To set up the SPI module for the Standard Master mode
of operation:
1. If using interrupts:
a) Clear the SPIxIF bit in the respective IFS
register.
b) Set the SPIxIE bit in the respective IEC
register.
c) Write the SPIxIP bits in the respective IPC
register to set the interrupt priority.
2. Write the desired settings to the SPIxCON1 and
SPIxCON2 registers with MSTEN
(SPIxCON1<5>) = 1.
3. Clear the SPIROV bit (SPIxSTAT<6>).
4. Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
5. Write the data to be transmitted to the SPIxBUF
register. Transmission (and reception) will start
as soon as data is written to the SPIxBUF
register.
To set up the SPI module for the Standard Slave mode
of operation:
1. Clear the SPIxBUF register.
2. If using interrupts:
a) Clear the SPIxIF bit in the respective IFS
register.
b) Set the SPIxIE bit in the respective IEC
register.
c) Write the SPIxIP bits in the respective IPC
register to set the interrupt priority.
3. Write the desired settings to the SPIxCON1
and SPIxCON2 registers with MSTEN
(SPIxCON1<5>) = 0.
4. Clear the SMP bit.
5. If the CKE bit (SPIxCON1<8>) is set, then the
SSEN bit (SPIxCON1<7>) must be set to enable
the SSx pin.
6. Clear the SPIROV bit (SPIxSTAT<6>).
7. Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
FIGURE 15-1: SPIx MODULE BLOCK DIAGRAM (STANDARD MODE)
Internal Data Bus
SDIx
SDOx
SSx/FSYNCx
SCKx
SPIxSR
bit 0
Shift Control
Edge
Select
Primary FCY
1:1/4/16/64
Enable
Prescaler
Sync
Clock
Control
SPIxBUF
Control
Transfer Transfer
Read SPIxBUF Write SPIxBUF
16
SPIxCON1<1:0>
SPIxCON1<4:2>
Master Clock
Secondary
Prescaler
1:1 to 1:8
2009 Microchip Technology Inc. DS39897C-page 183
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To set up the SPI module for the Enhanced Buffer
Master mode of operation:
1. If using interrupts:
a) Clear the SPIxIF bit in the respective IFS
register.
b) Set the SPIxIE bit in the respective IEC
register.
c) Write the SPIxIP bits in the respective IPC
register.
2. Write the desired settings to the SPIxCON1 and
SPIxCON2 registers with MSTEN
(SPIxCON1<5>) = 1.
3. Clear the SPIROV bit (SPIxSTAT<6>).
4. Select Enhanced Buffer mode by setting the
SPIBEN bit (SPIxCON2<0>).
5. Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
6. Write the data to be transmitted to the SPIxBUF
register. Transmission (and reception) will start
as soon as data is written to the SPIxBUF
register.
To set up the SPI module for the Enhanced Buffer
Slave mode of operation:
1. Clear the SPIxBUF register.
2. If using interrupts:
a) Clear the SPIxIF bit in the respective IFS
register.
b) Set the SPIxIE bit in the respective IEC
register.
c) Write the SPIxIP bits in the respective IPC
register to set the interrupt priority.
3. Write the desired settings to the SPIxCON1 and
SPIxCON2 registers with MSTEN
(SPIxCON1<5>) = 0.
4. Clear the SMP bit.
5. If the CKE bit is set, then the SSEN bit must be
set, thus enabling the SSx pin.
6. Clear the SPIROV bit (SPIxSTAT<6>).
7. Select Enhanced Buffer mode by setting the
SPIBEN bit (SPIxCON2<0>).
8. Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
FIGURE 15-2: SPIx MODULE BLOCK DIAGRAM (ENHANCED MODE)
Internal Data Bus
SDIx
SDOx
SSx/FSYNCx
SCKx
SPIxSR
bit0
Shift Control
Edge
Select
Primary FCY
1:1/4/16/64
Enable
Prescaler
Secondary
Prescaler
1:1 to 1:8
Sync
Clock
Control
SPIxBUF
Control
Transfer Transfer
Read SPIxBUF Write SPIxBUF
16
SPIxCON1<1:0>
SPIxCON1<4:2>
Master Clock
8-Level FIFO
Transmit Buffer
8-Level FIFO
Receive Buffer
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REGISTER 15-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 R-0 R-0 R-0
SPIEN(1) — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0
bit 15 bit 8
R-0 R/C-0 HS R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0
SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF
bit 7 bit 0
Legend: C = Clearable bit HS = Hardware settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 SPIEN: SPIx Enable bit(1)
1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables module
bit 14 Unimplemented: Read as ‘0’
bit 13 SPISIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-11 Unimplemented: Read as ‘0’
bit 10-8 SPIBEC<2:0>: SPIx Buffer Element Count bits (valid in Enhanced Buffer mode)
Master mode:
Number of SPI transfers pending.
Slave mode:
Number of SPI transfers unread.
bit 7 SRMPT: Shift Register (SPIxSR) Empty bit (valid in Enhanced Buffer mode)
1 = SPIx Shift register is empty and ready to send or receive
0 = SPIx Shift register is not empty
bit 6 SPIROV: Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded. The user software has not read the previous
data in the SPIxBUF register.
0 = No overflow has occurred
bit 5 SRXMPT: Receive FIFO Empty bit (valid in Enhanced Buffer mode)
1 = Receive FIFO is empty
0 = Receive FIFO is not empty
bit 4-2 SISEL<2:0>: SPIx Buffer Interrupt Mode bits (valid in Enhanced Buffer mode)
111 = Interrupt when SPIx transmit buffer is full (SPITBF bit is set)
110 = Interrupt when last bit is shifted into SPIxSR, as a result, the TX FIFO is empty
101 = Interrupt when the last bit is shifted out of SPIxSR, now the transmit is complete
100 = Interrupt when one data is shifted into the SPIxSR, as a result, the TX FIFO has one open spot
011 = Interrupt when SPIx receive buffer is full (SPIRBF bit set)
010 = Interrupt when SPIx receive buffer is 3/4 or more full
001 = Interrupt when data is available in receive buffer (SRMPT bit is set)
000 = Interrupt when the last data in the receive buffer is read, as a result, the buffer is empty
(SRXMPT bit set)
Note 1: If SPIEN = 1, these functions must be assigned to available RPn pins before use. See Section 10.4
“Peripheral Pin Select” for more information.
2009 Microchip Technology Inc. DS39897C-page 185
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bit 1 SPITBF: SPIx Transmit Buffer Full Status bit
1 = Transmit not yet started, SPIxTXB is full
0 = Transmit started, SPIxTXB is empty
In Standard Buffer mode:
Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB.
Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR.
In Enhanced Buffer mode:
Automatically set in hardware when CPU writes SPIxBUF location, loading the last available buffer location.
Automatically cleared in hardware when a buffer location is available for a CPU write.
bit 0 SPIRBF: SPIx Receive Buffer Full Status bit
1 = Receive complete, SPIxRXB is full
0 = Receive is not complete, SPIxRXB is empty
In Standard Buffer mode:
Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB.
Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB.
In Enhanced Buffer mode:
Automatically set in hardware when SPIx transfers data from SPIxSR to buffer, filling the last unread
buffer location.
Automatically cleared in hardware when a buffer location is available for a transfer from SPIxSR.
REGISTER 15-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER (CONTINUED)
Note 1: If SPIEN = 1, these functions must be assigned to available RPn pins before use. See Section 10.4
“Peripheral Pin Select” for more information.
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REGISTER 15-2: SPIXCON1: SPIx CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — DISSCK(1) DISSDO(2) MODE16 SMP CKE(3)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SSEN(4) CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0’
bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only)(1)
1 = Internal SPI clock is disabled; pin functions as I/O
0 = Internal SPI clock is enabled
bit 11 DISSDO: Disable SDOx pin bit(2)
1 = SDOx pin is not used by module; pin functions as I/O
0 = SDOx pin is controlled by the module
bit 10 MODE16: Word/Byte Communication Select bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
bit 9 SMP: SPIx Data Input Sample Phase bit
Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 8 CKE: SPIx Clock Edge Select bit(3)
1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)
bit 7 SSEN: Slave Select Enable (Slave mode) bit(4)
1 = SSx pin used for Slave mode
0 = SSx pin not used by module; pin controlled by port function
bit 6 CKP: Clock Polarity Select bit
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 5 MSTEN: Master Mode Enable bit
1 = Master mode
0 = Slave mode
Note 1: If DISSCK = 0, SCKx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin
Select” for more information.
2: If DISSDO = 0, SDOx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin
Select” for more information.
3: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed
SPI modes (FRMEN = 1).
4: If SSEN = 1, SSx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select”
for more information.
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bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
...
000 = Secondary prescale 8:1
bit 1-0 PPRE<1:0>: Primary Prescale bits (Master mode)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
REGISTER 15-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED)
Note 1: If DISSCK = 0, SCKx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin
Select” for more information.
2: If DISSDO = 0, SDOx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin
Select” for more information.
3: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed
SPI modes (FRMEN = 1).
4: If SSEN = 1, SSx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select”
for more information.
REGISTER 15-3: SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0
FRMEN SPIFSD SPIFPOL — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — SPIFE SPIBEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FRMEN: Framed SPIx Support bit
1 = Framed SPIx support enabled
0 = Framed SPIx support disabled
bit 14 SPIFSD: Frame Sync Pulse Direction Control on SSx pin bit
1 = Frame sync pulse input (slave)
0 = Frame sync pulse output (master)
bit 13 SPIFPOL: Frame Sync Pulse Polarity bit (Frame mode only)
1 = Frame sync pulse is active-high
0 = Frame sync pulse is active-low
bit 12-2 Unimplemented: Read as ‘0’
bit 1 SPIFE: Frame Sync Pulse Edge Select bit
1 = Frame sync pulse coincides with first bit clock
0 = Frame sync pulse precedes first bit clock
bit 0 SPIBEN: Enhanced Buffer Enable bit
1 = Enhanced Buffer enabled
0 = Enhanced Buffer disabled (Legacy mode)
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FIGURE 15-3: SPI MASTER/SLAVE CONNECTION (STANDARD MODE)
FIGURE 15-4: SPI MASTER/SLAVE CONNECTION (ENHANCED BUFFER MODES)
Serial Receive Buffer
(SPIxRXB)
Shift Register
(SPIxSR)
MSb LSb
SDIx
SDOx
PROCESSOR 2 (SPI Slave)
SCKx
SSx(1)
Serial Transmit Buffer
(SPIxTXB)
Serial Receive Buffer
(SPIxRXB)
Shift Register
(SPIxSR)
MSb LSb
SDOx
SDIx
PROCESSOR 1 (SPI Master)
Serial Clock
SSEN (SPIxCON1<7>) = 1 and MSTEN (SPIxCON1<5>) = 0
Note 1: Using the SSx pin in Slave mode of operation is optional.
2: User must write transmit data to read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers are memory
mapped to SPIxBUF.
SCKx
Serial Transmit Buffer
(SPIxTXB)
MSTEN (SPIxCON1<5>) = 1)
SPIx Buffer
(SPIxBUF)(2)
SPIx Buffer
(SPIxBUF)(2)
Shift Register
(SPIxSR)
MSb LSb
SDIx
SDOx
PROCESSOR 2 (SPI Enhanced Buffer Slave)
SCKx
SSx(1)
Shift Register
(SPIxSR)
MSb LSb
SDOx
SDIx
PROCESSOR 1 (SPI Enhanced Buffer Master)
Serial Clock
SSEN (SPIxCON1<7>) = 1,
Note 1: Using the SSx pin in Slave mode of operation is optional.
2: User must write transmit data to read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers are memory
mapped to SPIxBUF.
SSx(1)
SCKx
8-Level FIFO Buffer
MSTEN (SPIxCON1<5>) = 1 and
SPIx Buffer
(SPIxBUF)(2)
8-Level FIFO Buffer
SPIx Buffer
(SPIxBUF)(2)
SPIBEN (SPIxCON2<0>) = 1 MSTEN (SPIxCON1<5>) = 0 and
SPIBEN (SPIxCON2<0>) = 1
2009 Microchip Technology Inc. DS39897C-page 189
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FIGURE 15-5: SPI MASTER, FRAME MASTER CONNECTION DIAGRAM
FIGURE 15-6: SPI MASTER, FRAME SLAVE CONNECTION DIAGRAM
FIGURE 15-7: SPI SLAVE, FRAME MASTER CONNECTION DIAGRAM
FIGURE 15-8: SPI SLAVE, FRAME SLAVE CONNECTION DIAGRAM
SDOx
SDIx
PIC24F
Serial Clock
SSx
SCKx
Frame Sync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Master, Frame Master)
SDOx
SDIx
PIC24F
Serial Clock
SSx
SCKx
Frame Sync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Master, Frame Slave)
SDOx
SDIx
PIC24F
Serial Clock
SSx
SCKx
Frame Sync.
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Slave, Frame Master)
SDOx
SDIx
PIC24F
Serial Clock
SSx
SCKx
Frame Sync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Slave, Frame Slave)
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EQUATION 15-1: RELATIONSHIP BETWEEN DEVICE AND SPI CLOCK SPEED(1)
TABLE 15-1: SAMPLE SCK FREQUENCIES(1,2)
FCY = 16 MHz
Secondary Prescaler Settings
1:1 2:1 4:1 6:1 8:1
Primary Prescaler Settings 1:1 Invalid 8000 4000 2667 2000
4:1 4000 2000 1000 667 500
16:1 1000 500 250 167 125
64:1 250 125 63 42 31
FCY = 5 MHz
Primary Prescaler Settings 1:1 5000 2500 1250 833 625
4:1 1250 625 313 208 156
16:1 313 156 78 52 39
64:1 78 39 20 13 10
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
2: SCKx frequencies shown in kHz.
Primary Prescaler * Secondary Prescaler
FCY
FSCK =
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
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16.0 INTER-INTEGRATED CIRCUIT
(I2C™)
The Inter-Integrated Circuit (I2C) module is a serial
interface useful for communicating with other peripheral
or microcontroller devices. These peripheral
devices may be serial EEPROMs, display drivers, A/D
Converters, etc.
The I2C module supports these features:
• Independent master and slave logic
• 7-bit and 10-bit device addresses
• General call address, as defined in the I2C protocol
• Clock stretching to provide delays for the
processor to respond to a slave data request
• Both 100 kHz and 400 kHz bus specifications.
• Configurable address masking
• Multi-Master modes to prevent loss of messages
in arbitration
• Bus Repeater mode, allowing the acceptance of
all messages as a slave regardless of the address
• Automatic SCL
A block diagram of the module is shown in Figure 16-1.
16.1 Communicating as a Master in a
Single Master Environment
The details of sending a message in Master mode
depends on the communications protocol for the device
being communicated with. Typically, the sequence of
events is as follows:
1. Assert a Start condition on SDAx and SCLx.
2. Send the I2C device address byte to the slave
with a write indication.
3. Wait for and verify an Acknowledge from the
slave.
4. Send the first data byte (sometimes known as
the command) to the slave.
5. Wait for and verify an Acknowledge from the
slave.
6. Send the serial memory address low byte to the
slave.
7. Repeat steps 4 and 5 until all data bytes are
sent.
8. Assert a Repeated Start condition on SDAx and
SCLx.
9. Send the device address byte to the slave with
a read indication.
10. Wait for and verify an Acknowledge from the
slave.
11. Enable master reception to receive serial
memory data.
12. Generate an ACK or NACK condition at the end
of a received byte of data.
13. Generate a Stop condition on SDAx and SCLx.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 24. “Inter-Integrated Circuit
(I2C™)” (DS39702).
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FIGURE 16-1: I2C™ BLOCK DIAGRAM
I2CxRCV
Internal
Data Bus
SCLx
SDAx
Shift
Match Detect
I2CxADD
Start and Stop
Bit Detect
Clock
Address Match
Clock
Stretching
I2CxTRN
LSB
Shift Clock
BRG Down Counter
Reload
Control
TCY/2
Start and Stop
Bit Generation
Acknowledge
Generation
Collision
Detect
I2CxCON
I2CxSTAT
Control Logic
Read
LSB
Write
Read
I2CxBRG
I2CxRSR
Write
Read
Write
Read
Write
Read
Write
Read
Write
Read
I2CxMSK
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16.2 Setting Baud Rate When
Operating as a Bus Master
To compute the Baud Rate Generator reload value, use
Equation 16-1.
EQUATION 16-1: COMPUTING BAUD RATE
RELOAD VALUE(1,2)
16.3 Slave Address Masking
The I2CxMSK register (Register 16-3) designates
address bit positions as “don’t care” for both 7-Bit and
10-Bit Addressing modes. Setting a particular bit location
(= 1) in the I2CxMSK register causes the slave
module to respond whether the corresponding address
bit value is a ‘0’ or a ‘1’. For example, when I2CxMSK
is set to ‘00100000’, the slave module will detect both
addresses, ‘0000000’ and ‘0100000’.
To enable address masking, the IPMI (Intelligent
Peripheral Management Interface) must be disabled by
clearing the IPMIEN bit (I2CxCON<11>).
TABLE 16-1: I2C™ CLOCK RATES(1,2)
TABLE 16-2: I2C™ RESERVED ADDRESSES(1)
I2CxBRG FCY
FSCL
----------- FCY
– -1---0------0---0---0------0---0---0-
= – 1
FSCL FCY
I2CxBRG 1 FCY
+ + -1---0------0---0---0------0---0---0-
= ----------------------------------------------------------------------
or
Note 1: Based on FCY = FOSC/2; Doze mode and
PLL are disabled.
2: These clock rate values are for guidance
only. The actual clock rate can be affected
by various system level parameters. The
actual clock rate should be measured in
its intended application.
Note: As a result of changes in the I2C™
protocol, the addresses in Table 16-2 are
reserved and will not be Acknowledged in
Slave mode. This includes any address
mask settings that include any of these
addresses.
Required System FSCL FCY
I2CxBRG Value
Actual FSCL
(Decimal) (Hexadecimal)
100 kHz 16 MHz 157 9D 100 kHz
100 kHz 8 MHz 78 4E 100 kHz
100 kHz 4 MHz 39 27 99 kHz
400 kHz 16 MHz 37 25 404 kHz
400 kHz 8 MHz 18 12 404 kHz
400 kHz 4 MHz 9 9 385 kHz
400 kHz 2 MHz 4 4 385 kHz
1 MHz 16 MHz 13 D 1.026 MHz
1 MHz 8 MHz 6 6 1.026MHz
1 MHz 4 MHz 3 3 0.909MHz
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
2: These clock rate values are for guidance only. The actual clock rate can be affected by various system
level parameters. The actual clock rate should be measured in its intended application.
Slave Address R/W Bit Description
0000 000 0 General Call Address(2)
0000 000 1 Start Byte
0000 001 x Cbus Address
0000 010 x Reserved
0000 011 x Reserved
0000 1xx x HS Mode Master Code
1111 1xx x Reserved
1111 0xx x 10-Bit Slave Upper Byte(3)
Note 1: The address bits listed here will never cause an address match, independent of address mask settings.
2: Address will be Acknowledged only if GCEN = 1.
3: Match on this address can only occur on the upper byte in 10-Bit Addressing mode.
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REGISTER 16-1: I2CxCON: I2Cx CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-1, HC R/W-0 R/W-0 R/W-0 R/W-0
I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC
GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend: HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 I2CEN: I2Cx Enable bit
1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins
0 = Disables I2Cx module. All I2C pins are controlled by port functions.
bit 14 Unimplemented: Read as ‘0’
bit 13 I2CSIDL: Stop in Idle Mode bit
1 = Discontinues module operation when device enters an Idle mode
0 = Continues module operation in Idle mode
bit 12 SCLREL: SCLx Release Control bit (when operating as I2C Slave)
1 = Releases SCLx clock
0 = Holds SCLx clock low (clock stretch)
If STREN = 1:
Bit is R/W (i.e., software may write ‘0’ to initiate stretch and write ‘1’ to release clock).
Hardware clear at beginning of slave transmission.
Hardware clear at end of slave reception.
If STREN = 0:
Bit is R/S (i.e., software may only write ‘1’ to release clock).
Hardware clear at beginning of slave transmission.
bit 11 IPMIEN: Intelligent Platform Management Interface (IPMI) Enable bit
1 = IPMI Support mode is enabled; all addresses Acknowledged
0 = IPMI mode disabled
bit 10 A10M: 10-Bit Slave Addressing bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9 DISSLW: Disable Slew Rate Control bit
1 = Slew rate control disabled
0 = Slew rate control enabled
bit 8 SMEN: SMBus Input Levels bit
1 = Enables I/O pin thresholds compliant with SMBus specification
0 = Disables SMBus input thresholds
bit 7 GCEN: General Call Enable bit (when operating as I2C slave)
1 = Enables interrupt when a general call address is received in the I2CxRSR
(module is enabled for reception)
0 = General call address disabled
bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)
Used in conjunction with SCLREL bit.
1 = Enables software or receive clock stretching
0 = Disables software or receive clock stretching
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bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master. Applicable during master receive.)
Value that will be transmitted when the software initiates an Acknowledge sequence.
1 = Sends NACK during Acknowledge
0 = Sends ACK during Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit (When operating as I2C master. Applicable during master
receive.)
1 = Initiates Acknowledge sequence on SDAx and SCLx pins and transmits ACKDT data bit. Hardware
clear at end of master Acknowledge sequence.
0 = Acknowledge sequence not in progress
bit 3 RCEN: Receive Enable bit (when operating as I2C master)
1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte.
0 = Receives sequence not in progress
bit 2 PEN: Stop Condition Enable bit (when operating as I2C master)
1 = Initiates Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence.
0 = Stop condition not in progress
bit 1 RSEN: Repeated Start Condition Enabled bit (when operating as I2C master)
1 = Initiates Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master
Repeated Start sequence.
0 = Repeated Start condition not in progress
bit 0 SEN: Start Condition Enabled bit (when operating as I2C master)
1 = Initiates Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence.
0 = Start condition not in progress
REGISTER 16-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED)
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REGISTER 16-2: I2CxSTAT: I2Cx STATUS REGISTER
R-0, HSC R-0, HSC U-0 U-0 U-0 R/C-0, HS R-0, HSC R-0, HSC
ACKSTAT TRSTAT — — — BCL GCSTAT ADD10
bit 15 bit 8
R/C-0, HS R/C-0, HS R-0, HSC R/C-0, HSC R/C-0, HSC R-0, HSC R-0, HSC R-0, HSC
IWCOL I2COV D/A P S R/W RBF TBF
bit 7 bit 0
Legend: C = Clearable bit HS = Hardware Settable bit HSC = Hardware Settable/Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ACKSTAT: Acknowledge Status bit
1 = NACK was detected last
0 = ACK was detected last
Hardware set or clear at end of Acknowledge.
bit 14 TRSTAT: Transmit Status bit
(When operating as I2C master. Applicable to master transmit operation.)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.
bit 13-11 Unimplemented: Read as ‘0’
bit 10 BCL: Master Bus Collision Detect bit
1 = A bus collision has been detected during a master operation
0 = No collision
Hardware set at detection of bus collision.
bit 9 GCSTAT: General Call Status bit
1 = General call address was received
0 = General call address was not received
Hardware set when address matches general call address. Hardware clear at Stop detection.
bit 8 ADD10: 10-Bit Address Status bit
1 = 10-bit address was matched
0 = 10-bit address was not matched
Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.
bit 7 IWCOL: Write Collision Detect bit
1 = An attempt to write the I2CxTRN register failed because the I2C module is busy
0 = No collision
Hardware set at occurrence of write to I2CxTRN while busy (cleared by software).
bit 6 I2COV: Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holding the previous byte
0 = No overflow
Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
bit 5 D/A: Data/Address bit (when operating as I2C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was device address
Hardware clear at device address match. Hardware set by after transmission finishes, or by reception of
slave byte.
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bit 4 P: Stop bit
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 3 S: Start bit
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Start bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 2 R/W: Read/Write Information bit (when operating as I2C slave)
1 = Read – indicates data transfer is output from slave
0 = Write – indicates data transfer is input to slave
Hardware set or clear after reception of I2C device address byte.
bit 1 RBF: Receive Buffer Full Status bit
1 = Receive complete, I2CxRCV is full
0 = Receive not complete, I2CxRCV is empty
Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads I2CxRCV.
bit 0 TBF: Transmit Buffer Full Status bit
1 = Transmit in progress, I2CxTRN is full
0 = Transmit complete, I2CxTRN is empty
Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.
REGISTER 16-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)
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REGISTER 16-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — AMSK9 AMSK8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Unimplemented: Read as ‘0’
bit 9-0 AMSK<9:0>: Mask for Address Bit x Select bits
1 = Enable masking for bit x of incoming message address; bit match not required in this position
0 = Disable masking for bit x; bit match required in this position
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17.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules available
in the PIC24F device family. The UART is a full-duplex
asynchronous system that can communicate with
peripheral devices, such as personal computers, LIN,
RS-232 and RS-485 interfaces. The module also supports
a hardware flow control option with the UxCTS and
UxRTS pins and also includes an IrDA® encoder and
decoder.
The primary features of the UART module are:
• Full-Duplex, 8 or 9-Bit Data Transmission through
the UxTX and UxRX Pins
• Even, Odd or No Parity Options (for 8-bit data)
• One or two Stop bits
• Hardware Flow Control Option with UxCTS and
UxRTS Pins
• Fully Integrated Baud Rate Generator with 16-Bit
Prescaler
• Baud Rates Ranging from 1 Mbps to 15 bps at
16 MIPS
• 4-Deep, First-In-First-Out (FIFO) Transmit Data
Buffer
• 4-Deep FIFO Receive Data Buffer
• Parity, Framing and Buffer Overrun Error Detection
• Support for 9-bit mode with Address Detect
(9th bit = 1)
• Transmit and Receive Interrupts
• Loopback mode for Diagnostic Support
• Support for Sync and Break Characters
• Supports Automatic Baud Rate Detection
• IrDA Encoder and Decoder Logic
• 16x Baud Clock Output for IrDA® Support
A simplified block diagram of the UART is shown in
Figure 17-1. The UART module consists of these key
important hardware elements:
• Baud Rate Generator
• Asynchronous Transmitter
• Asynchronous Receiver
FIGURE 17-1: UART SIMPLIFIED BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 21. “UART” (DS39708).
UxRX
IrDA®
Hardware Flow Control
UARTx Receiver
UARTx Transmitter UxTX
UxCTS
UxRTS/BCLKx
Baud Rate Generator
Note: The UART inputs and outputs must all be assigned to available RPn pins before use. Please see
Section 10.4 “Peripheral Pin Select” for more information.
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17.1 UART Baud Rate Generator (BRG)
The UART module includes a dedicated 16-bit Baud
Rate Generator. The UxBRG register controls the
period of a free-running, 16-bit timer. Equation 17-1
shows the formula for computation of the baud rate
with BRGH = 0.
EQUATION 17-1: UART BAUD RATE WITH
BRGH = 0(1,2)
Example 17-1 shows the calculation of the baud rate
error for the following conditions:
• FCY = 4 MHz
• Desired Baud Rate = 9600
The maximum baud rate (BRGH = 0) possible is
FCY/16 (for UxBRG = 0) and the minimum baud rate
possible is FCY/(16 * 65536).
Equation 17-2 shows the formula for computation of
the baud rate with BRGH = 1.
EQUATION 17-2: UART BAUD RATE WITH
BRGH = 1(1,2)
The maximum baud rate (BRGH = 1) possible is FCY/4
(for UxBRG = 0) and the minimum baud rate possible
is FCY/(4 * 65536).
Writing a new value to the UxBRG register causes the
BRG timer to be reset (cleared). This ensures the BRG
does not wait for a timer overflow before generating the
new baud rate.
EXAMPLE 17-1: BAUD RATE ERROR CALCULATION (BRGH = 0)(1)
Note 1: FCY denotes the instruction cycle clock
frequency (FOSC/2).
2: Based on FCY = FOSC/2, Doze mode
and PLL are disabled.
Baud Rate = FCY
16 • (UxBRG + 1)
FCY
16 • Baud Rate
UxBRG = – 1
Baud Rate = FCY
4 • (UxBRG + 1)
FCY
4 • Baud Rate
UxBRG = – 1
Note 1: FCY denotes the instruction cycle clock
frequency.
2: Based on FCY = FOSC/2, Doze mode
and PLL are disabled.
Desired Baud Rate = FCY/(16 (UxBRG + 1))
Solving for UxBRG value:
UxBRG = ((FCY/Desired Baud Rate)/16) – 1
UxBRG = ((4000000/9600)/16) – 1
UxBRG = 25
Calculated Baud Rate= 4000000/(16 (25 + 1))
= 9615
Error = (Calculated Baud Rate – Desired Baud Rate)
Desired Baud Rate
= (9615 – 9600)/9600
= 0.16%
Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.
2009 Microchip Technology Inc. DS39897C-page 201
PIC24FJ256GB110 FAMILY
17.2 Transmitting in 8-Bit Data Mode
1. Set up the UART:
a) Write appropriate values for data, parity and
Stop bits.
b) Write appropriate baud rate value to the
UxBRG register.
c) Set up transmit and receive interrupt enable
and priority bits.
2. Enable the UART.
3. Set the UTXEN bit (causes a transmit interrupt
two cycles after being set).
4. Write data byte to lower byte of UxTXREG word.
The value will be immediately transferred to the
Transmit Shift Register (TSR), and the serial bit
stream will start shifting out with next rising edge
of the baud clock.
5. Alternately, the data byte may be transferred
while UTXEN = 0, and then the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
6. A transmit interrupt will be generated as per
interrupt control bit, UTXISELx.
17.3 Transmitting in 9-Bit Data Mode
1. Set up the UART (as described in Section 17.2
“Transmitting in 8-Bit Data Mode”).
2. Enable the UART.
3. Set the UTXEN bit (causes a transmit interrupt).
4. Write UxTXREG as a 16-bit value only.
5. A word write to UxTXREG triggers the transfer
of the 9-bit data to the TSR. Serial bit stream will
start shifting out with the first rising edge of the
baud clock.
6. A transmit interrupt will be generated as per the
setting of control bit, UTXISELx.
17.4 Break and Sync Transmit
Sequence
The following sequence will send a message frame
header made up of a Break, followed by an auto-baud
Sync byte.
1. Configure the UART for the desired mode.
2. Set UTXEN and UTXBRK to set up the Break
character.
3. Load the UxTXREG with a dummy character to
initiate transmission (value is ignored).
4. Write ‘55h’ to UxTXREG; this loads the Sync
character into the transmit FIFO.
5. After the Break has been sent, the UTXBRK bit
is reset by hardware. The Sync character now
transmits.
17.5 Receiving in 8-Bit or 9-Bit Data
Mode
1. Set up the UART (as described in Section 17.2
“Transmitting in 8-Bit Data Mode”).
2. Enable the UART.
3. A receive interrupt will be generated when one
or more data characters have been received as
per interrupt control bit, URXISELx.
4. Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
5. Read UxRXREG.
The act of reading the UxRXREG character will move
the next character to the top of the receive FIFO,
including a new set of PERR and FERR values.
17.6 Operation of UxCTS and UxRTS
Control Pins
UARTx Clear to Send (UxCTS) and Request to Send
(UxRTS) are the two hardware controlled pins that are
associated with the UART module. These two pins
allow the UART to operate in Simplex and Flow Control
mode. They are implemented to control the transmission
and reception between the Data Terminal
Equipment (DTE). The UEN<1:0> bits in the UxMODE
register configure these pins.
17.7 Infrared Support
The UART module provides two types of infrared UART
support: one is the IrDA clock output to support external
IrDA encoder and decoder device (legacy module
support) and the other is the full implementation of the
IrDA encoder and decoder. Note that because the IrDA
modes require a 16x baud clock, they will only work
when the BRGH bit (UxMODE<3>) is ‘0’.
17.7.1 IrDA CLOCK OUTPUT FOR
EXTERNAL IRDA SUPPORT
To support external IrDA encoder and decoder devices,
the BCLKx pin (same as the UxRTS pin) can be
configured to generate the 16x baud clock. With
UEN<1:0> = 11, the BCLKx pin will output the 16x
baud clock if the UART module is enabled. It can be
used to support the IrDA codec chip.
17.7.2 BUILT-IN IrDA ENCODER AND
DECODER
The UART has full implementation of the IrDA encoder
and decoder as part of the UART module. The built-in
IrDA encoder and decoder functionality is enabled
using the IREN bit (UxMODE<12>). When enabled
(IREN = 1), the receive pin (UxRX) acts as the input
from the infrared receiver. The transmit pin (UxTX) acts
as the output to the infrared transmitter.
PIC24FJ256GB110 FAMILY
DS39897C-page 202 2009 Microchip Technology Inc.
REGISTER 17-1: UxMODE: UARTx MODE REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
UARTEN(1) — USIDL IREN(2) RTSMD — UEN1 UEN0
bit 15 bit 8
R/C-0, HC R/W-0 R/W-0, HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL
bit 7 bit 0
Legend: C = Clearable bit HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 UARTEN: UARTx Enable bit(1)
1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>
0 = UARTx is disabled; all UARTx pins are controlled by PORT latches; UARTx power consumption
minimal
bit 14 Unimplemented: Read as ‘0’
bit 13 USIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 IREN: IrDA® Encoder and Decoder Enable bit(2)
1 = IrDA encoder and decoder enabled
0 = IrDA encoder and decoder disabled
bit 11 RTSMD: Mode Selection for UxRTS Pin bit
1 = UxRTS pin in Simplex mode
0 = UxRTS pin in Flow Control mode
bit 10 Unimplemented: Read as ‘0’
bit 9-8 UEN1:UEN0: UARTx Enable bits
11 = UxTX, UxRX and BCLKx pins are enabled and used; UxCTS pin controlled by port latches
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLKx pins controlled by port
latches
bit 7 WAKE: Wake-up on Start Bit Detect During Sleep Mode Enable bit
1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge, bit cleared in
hardware on following rising edge
0 = No wake-up enabled
bit 6 LPBACK: UARTx Loopback Mode Select bit
1 = Enable Loopback mode
0 = Loopback mode is disabled
bit 5 ABAUD: Auto-Baud Enable bit
1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h);
cleared in hardware upon completion
0 = Baud rate measurement disabled or completed
Note 1: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. See
Section 10.4 “Peripheral Pin Select” for more information.
2: This feature is only available for the 16x BRG mode (BRGH = 0).
2009 Microchip Technology Inc. DS39897C-page 203
PIC24FJ256GB110 FAMILY
bit 4 RXINV: Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0’
0 = UxRX Idle state is ‘1’
bit 3 BRGH: High Baud Rate Enable bit
1 = High-Speed mode (baud clock generated from FCY/4)
0 = Standard mode (baud clock generated from FCY/16)
bit 2-1 PDSEL<1:0>: Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0 STSEL: Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
REGISTER 17-1: UxMODE: UARTx MODE REGISTER (CONTINUED)
Note 1: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. See
Section 10.4 “Peripheral Pin Select” for more information.
2: This feature is only available for the 16x BRG mode (BRGH = 0).
PIC24FJ256GB110 FAMILY
DS39897C-page 204 2009 Microchip Technology Inc.
REGISTER 17-2: UxSTA: UARTx STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 R/W-0 HC R/W-0 R-0 R-1
UTXISEL1 UTXINV(1) UTXISEL0 — UTXBRK UTXEN(2) UTXBF TRMT
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0
URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA
bit 7 bit 0
Legend: C = Clearable bit HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits
11 = Reserved; do not use
10 = Interrupt when a character is transferred to the Transmit Shift Register (TSR), and as a result,
the transmit buffer becomes empty
01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit
operations are completed
00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at
least one character open in the transmit buffer)
bit 14 UTXINV: IrDA® Encoder Transmit Polarity Inversion bit(1)
IREN = 0:
1 = UxTX Idle ‘0’
0 = UxTX Idle ‘1’
IREN = 1:
1 = UxTX Idle ‘1’
0 = UxTX Idle ‘0’
bit 12 Unimplemented: Read as ‘0’
bit 11 UTXBRK: Transmit Break bit
1 = Send Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop bit;
cleared by hardware upon completion
0 = Sync Break transmission disabled or completed
bit 10 UTXEN: Transmit Enable bit(2)
1 = Transmit enabled, UxTX pin controlled by UARTx
0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by port.
bit 9 UTXBF: Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8 TRMT: Transmit Shift Register Empty bit (read-only)
1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed)
0 = Transmit Shift Register is not empty, a transmission is in progress or queued
bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits
11 = Interrupt is set on RSR transfer, making the receive buffer full (i.e., has 4 data characters)
10 = Interrupt is set on RSR transfer, making the receive buffer 3/4 full (i.e., has 3 data characters)
0x = Interrupt is set when any character is received and transferred from the RSR to the receive buffer.
Receive buffer has one or more characters.
Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled
(IREN = 1).
2: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin.
See Section 10.4 “Peripheral Pin Select” for more information.
2009 Microchip Technology Inc. DS39897C-page 205
PIC24FJ256GB110 FAMILY
bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect.
0 = Address Detect mode disabled
bit 4 RIDLE: Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Receiver is active
bit 3 PERR: Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character (character at the top of the receive FIFO)
0 = Parity error has not been detected
bit 2 FERR: Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character (character at the top of the receive FIFO)
0 = Framing error has not been detected
bit 1 OERR: Receive Buffer Overrun Error Status bit (clear/read-only)
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed (clearing a previously set OERR bit (1 0 transition) will reset
the receiver buffer and the RSR to the empty state
bit 0 URXDA: Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
REGISTER 17-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)
Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled
(IREN = 1).
2: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin.
See Section 10.4 “Peripheral Pin Select” for more information.
PIC24FJ256GB110 FAMILY
DS39897C-page 206 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 207
PIC24FJ256GB110 FAMILY
18.0 UNIVERSAL SERIAL BUS WITH
ON-THE-GO SUPPORT (USB
OTG)
PIC24FJ256GB110 family devices contain a full-speed
and low-speed compatible, On-The-Go (OTG) USB
Serial Interface Engine (SIE). The OTG capability
allows the device to act either as a USB peripheral
device or as a USB embedded host with limited host
capabilities. The OTG capability allows the device to
dynamically switch from device to host operation using
OTG’s Host Negotiation Protocol (HNP).
For more details on OTG operation, refer to the
“On-The-Go Supplement to the USB 2.0 Specification”,
published by the USB-IF. For more details on USB operation,
refer to the “Universal Serial Bus Specification”,
v2.0.
The USB OTG module offers these features:
• USB functionality in Device and Host modes, and
OTG capabilities for application-controlled mode
switching
• Software-selectable module speeds of full speed
(12 Mbps) or low speed (1.5 Mbps, available in
Host mode only)
• Support for all four USB transfer types: control,
interrupt, bulk and isochronous
• 16 bidirectional endpoints for a total of 32 unique
endpoints
• DMA interface for data RAM access
• Queues up to sixteen unique endpoint transfers
without servicing
• Integrated, on-chip USB transceiver, with support
for off-chip transceivers via a digital interface:
• Integrated VBUS generation with on-chip
comparators and boost generation, and support of
external VBUS comparators and regulators
through a digital interface
• Configurations for on-chip bus pull-up and
pull-down resistors
A simplified block diagram of the USB OTG module is
shown in Figure 18-1.
The USB OTG module can function as a USB peripheral
device or as a USB host, and may dynamically
switch between Device and Host modes under
software control. In either mode, the same data paths
and buffer descriptors are used for the transmission
and reception of data.
In discussing USB operation, this section will use a
controller-centric nomenclature for describing the direction
of the data transfer between the microcontroller and
the USB. Rx (Receive) will be used to describe transfers
that move data from the USB to the microcontroller, and
Tx (Transmit) will be used to describe transfers that
move data from the microcontroller to the USB.
Table 18-1 shows the relationship between data
direction in this nomenclature and the USB tokens
exchanged.
TABLE 18-1: CONTROLLER-CENTRIC
DATA DIRECTION FOR USB
HOST OR TARGET
This chapter presents the most basic operations
needed to implement USB OTG functionality in an
application. A complete and detailed discussion of the
USB protocol and its OTG supplement are beyond the
scope of this data sheet. It is assumed that the user
already has a basic understanding of USB architecture
and the latest version of the protocol.
Not all steps for proper USB operation (such as device
enumeration) are presented here. It is recommended
that application developers use an appropriate device
driver to implement all of the necessary features.
Microchip provides a number of application-specific
resources, such as USB firmware and driver support.
Refer to www.microchip.com for the latest firmware and
driver support.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 27. “USB On-The-Go (OTG)”.
USB Mode
Direction
Rx Tx
Device OUT or SETUP IN
Host IN OUT or SETUP
PIC24FJ256GB110 FAMILY
DS39897C-page 208 2009 Microchip Technology Inc.
FIGURE 18-1: USB OTG MODULE BLOCK DIAGRAM
48 MHz USB Clock
VUSB
D+(1)
D-(1)
USBID(1)
VBUS
Transceiver
VBUSON(1)
Comparators
USB
SRP Charge
SRP Discharge
Registers
and
Control
Interface
Transceiver Power 3.3V
Voltage
System
RAM
Full-Speed Pull-up
Host Pull-down
Host Pull-down
Note 1: Pins are multiplexed with digital I/O and other device features.
VMIO(1)
VPIO(1)
DMH(1)
DPH(1)
DMLN(1)
DPLN(1)
RCV(1)
VBUS
Boost
Assist
External Transceiver Interface
USBOEN(1)
USB 3.3V
Regulator
VCMPST1(1)
VCMPST2(1)
VBUSST(1)
VCPCON(1)
SIE
USB
2009 Microchip Technology Inc. DS39897C-page 209
PIC24FJ256GB110 FAMILY
18.1 Hardware Configuration
18.1.1 DEVICE MODE
18.1.1.1 D+ Pull-up Resistor
PIC24FJ256GB110 family devices have a built-in
1.5 k resistor on the D+ line that is available when the
microcontroller in operating in device mode. This is
used to signal an external Host that the device is
operating in Full Speed Device mode. It is engaged by
setting the DPPULUP bit (U1OTGCON<7>).
Alternatively, an external resistor may be used on D+,
as shown in Figure 18-2.
FIGURE 18-2: EXTERNAL PULL-UP FOR
FULL-SPEED DEVICE
MODE
18.1.1.2 Power Modes
Many USB applications will likely have several different
sets of power requirements and configuration. The
most common power modes encountered are:
• Bus Power Only,
• Self-Power Only and
• Dual Power with Self-Power Dominance.
Bus Power Only mode (Figure 18-3) is effectively the
simplest method. All power for the application is drawn
from the USB.
To meet the inrush current requirements of the USB 2.0
Specification, the total effective capacitance appearing
across VBUS and ground must be no more than 10 F.
In the USB Suspend mode, devices must consume no
more than 2.5 mA from the 5V VBUS line of the USB
cable. During the USB Suspend mode, the D+ or Dpull-
up resistor must remain active, which will consume
some of the allowed suspend current.
In Self-Power Only mode (Figure 18-4), the USB
application provides its own power, with very little
power being pulled from the USB. Note that an attach
indication is added to indicate when the USB has been
connected and the host is actively powering VBUS.
To meet compliance specifications, the USB module
(and the D+ or D- pull-up resistor) should not be enabled
until the host actively drives VBUS high. One of the 5.5V
tolerant I/O pins may be used for this purpose.
The application should never source any current onto
the 5V VBUS pin of the USB cable.
The Dual-power option with Self-Power Dominance
(Figure 18-5) allows the application to use internal
power primarily, but switch to power from the USB
when no internal power is available. Dual-power
devices must also meet all of the special requirements
for inrush current and Suspend mode current previously
described, and must not enable the USB module
until VBUS is driven high.
FIGURE 18-3: BUS POWER ONLY
FIGURE 18-4: SELF-POWER ONLY
FIGURE 18-5: DUAL POWER EXAMPLE
PIC®MCU
Host
Controller/HUB
VUSB
D+
D-
1.5 k
VDD
VUSB
VSS
VBUS
~5V
3.3V
Low IQ Regulator
Attach Sense
VBUS
100 k
VDD
VUSB
VSS
VSELF
~3.3V
Attach Sense
100 k
100 k
VBUS
~5V VBUS
VDD
VUSB
VBUS
VSS
Attach Sense
VBUS
VSELF
100 k
~3.3V
~5V
100 k
3.3V
Low IQ
Regulator
PIC24FJ256GB110 FAMILY
DS39897C-page 210 2009 Microchip Technology Inc.
18.1.2 HOST AND OTG MODES
18.1.2.1 D+ and D- Pull-down Resistors
PIC24FJ256GB110 family devices have built-in 15 k
pull-down resistor on the D+ and D- lines. These are
used in tandem to signal to the bus that the microcontroller
is operating in Host mode. They are engaged by
setting the DPPULDWN and DMPULDWN bits
(U1OTGCON<5,4>).
18.1.2.2 Power Configurations
In Host mode, as well as Host mode in On-the-Go
operation, the USB 2.0 specification requires that the
Host application supply power on VBUS. Since the
microcontroller is running below VBUS and is not able to
source sufficient current, a separate power supply must
be provided.
When the application is always operating in Host mode,
a simple circuit can be used to supply VBUS and
regulate current on the bus (Figure 18-6). For OTG
operation, it is necessary to be able to turn VBUS on or
off as needed, as the microcontroller switches between
Device and Host modes. A typical example using an
external charge pump is shown in Figure 18-7.
FIGURE 18-6: HOST INTERFACE EXAMPLE
FIGURE 18-7: OTG INTERFACE EXAMPLE
A/D pin
VUSB
VDD
VSS
D+
DVBUS
ID
D+
DVBUS
ID
GND
+3.3V +3.3V
Polymer PTC
Thermal Fuse
Micro A/B
Connector
150 μF
2 k
2 k
0.1 μF,
3.3V
+5V PIC® Microcontroller
I/O
I/O
VSS
D+
DVBUS
ID
D+
DVBUS
ID
GND
Micro A/B
Connector 4.7 μF 40 k
VDD
PIC® Microcontroller
10 μF
VIN
SELECT
SHND
PGOOD
MCP1253
VOUT
C+
CGND
1 μF
2009 Microchip Technology Inc. DS39897C-page 211
PIC24FJ256GB110 FAMILY
18.1.2.3 VBUS Voltage Generation with
External Devices
When operating as a USB host, either as an A-device
in an OTG configuration or as an embedded host, VBUS
must be supplied to the attached device.
PIC24FJ256GB110 family devices have an internal
VBUS boost assist to help generate the required 5V
VBUS from the available voltages on the board. This is
comprised of a simple PWM output to control a Switch
mode power supply, and built-in comparators to
monitor output voltage and limit current.
To enable voltage generation:
1. Verify that the USB module is powered
(U1PWRC<0> = 1) and that the VBUS discharge
is disabled (U1OTGCON<0> = 0).
2. Set the PWM period (U1PWMRRS<7:0>) and
duty cycle (U1PWMRRS<15:8>) as required.
3. Select the required polarity of the output signal
based on the configuration of the external circuit
with the PWMPOL bit (U1PWMCON<9>).
4. Select the desired target voltage using the
VBUSCHG bit (U1OTGCON<1>).
5. Enable the PWM counter by setting the CNTEN
bit to ‘1’ (U1PWMCON<8>).
6. Enable the PWM module by setting the PWMEN
bit to ‘1’ (U1PWMCON<15>).
7. Enable the VBUS generation circuit
(U1OTGCON<3> = 1).
18.1.3 USING AN EXTERNAL INTERFACE
Some applications may require the USB interface to be
isolated from the rest of the system.
PIC24FJ256GB110 family devices include a complete
interface to communicate with and control an external
USB transceiver, including the control of data line
pull-ups and pull-downs. The VBUS voltage generation
control circuit can also be configured for different VBUS
generation topologies.
Please refer to the “PIC24F Family Reference Manual”,
Section 27. “USB On-The-Go (OTG)” for information
on using the external interface.
18.1.4 CALCULATING TRANSCEIVER
POWER REQUIREMENTS
The USB transceiver consumes a variable amount of
current depending on the characteristic impedance of
the USB cable, the length of the cable, the VUSB supply
voltage and the actual data patterns moving across the
USB cable. Longer cables have larger capacitances
and consume more total energy when switching output
states. The total transceiver current consumption will
be application-specific. Equation 18-1 can help
estimate how much current actually may be required in
full-speed applications.
Please refer to the “PIC24F Family Reference Manual”,
Section 27. “USB On-The-Go (OTG)” for a complete
discussion on transceiver power consumption.
EQUATION 18-1: ESTIMATING USB TRANSCEIVER CURRENT CONSUMPTION
Note: This section describes the general
process for VBUS voltage generation and
control. Please refer to the “PIC24F
Family Reference Manual” for additional
examples.
IXCVR = + IPULLUP
(40 mA • VUSB • PZERO • PIN • LCABLE)
(3.3V • 5m)
Legend: VUSB – Voltage applied to the VUSB pin in volts (3.0V to 3.6V).
PZERO – Percentage (in decimal) of the IN traffic bits sent by the PIC® microcontroller that are a value
of ‘0’.
PIN – Percentage (in decimal) of total bus bandwidth that is used for IN traffic.
LCABLE – Length (in meters) of the USB cable. The USB 2.0 Specification requires that full-speed
applications use cables no longer than 5m.
IPULLUP – Current which the nominal, 1.5 k pull-up resistor (when enabled) must supply to the USB
cable.
PIC24FJ256GB110 FAMILY
DS39897C-page 212 2009 Microchip Technology Inc.
18.2 USB Buffer Descriptors and the
BDT
Endpoint buffer control is handled through a structure
called the Buffer Descriptor Table (BDT). This provides
a flexible method for users to construct and control
endpoint buffers of various lengths and configurations.
The BDT can be located in any available, 512-byte
aligned block of data RAM. The BDT Pointer
(U1BDTP1) contains the upper address byte of the
BDT, and sets the location of the BDT in RAM. The user
must set this pointer to indicate the table’s location.
The BDT is composed of Buffer Descriptors (BDs)
which are used to define and control the actual buffers
in the USB RAM space. Each BD consists of two, 16-bit
“soft” (non-fixed-address) registers, BDnSTAT and
BDnADR, where n represents one of the 64 possible
BDs (range of 0 to 63). BDnSTAT is the status register
for BDn, while BDnADR specifies the starting address
for the buffer associated with BDn.
Depending on the endpoint buffering configuration
used, there are up to 64 sets of buffer descriptors, for a
total of 256 bytes. At a minimum, the BDT must be at
least 8 bytes long. This is because the USB specification
mandates that every device must have Endpoint 0
with both input and output for initial setup.
Endpoint mapping in the BDT is dependent on three
variables:
• Endpoint number (0 to 15)
• Endpoint direction (Rx or Tx)
• Ping-pong settings (U1CNFG1<1:0>)
Figure 18-8 illustrates how these variables are used to
map endpoints in the BDT.
In Host mode, only Endpoint 0 buffer descriptors are
used. All transfers utilize the Endpoint 0 buffer descriptor
and Endpoint Control register (U1EP0). For received
packets, the attached device’s source endpoint is
indicated by the value of ENDPT<3:0> in the USB status
register (U1STAT<7:4>). For transmitted packet, the
attached device’s destination endpoint is indicated by
the value written to the Token register (U1TOK).
FIGURE 18-8: BDT MAPPING FOR ENDPOINT BUFFERING MODES
EP1 Tx Even
EP1 Rx Even
EP1 Rx Odd
EP1 Tx Odd
Descriptor
Descriptor
Descriptor
Descriptor
EP1 Tx
EP15 Tx
EP1 Rx
EP0 Rx
PPB<1:0> = 00
EP0 Tx
EP1 Tx
No Ping-Pong
EP15 Tx
EP0 Tx
EP0 Rx Even
PPB<1:0> = 01
EP0 Rx Odd
EP1 Rx
Ping-Pong Buffer
EP15 Tx Odd
EP0 Tx Even
EP0 Rx Even
PPB<1:0> = 10
EP0 Rx Odd
EP0 Tx Odd
Ping-Pong Buffers
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Descriptor
Note: Memory area not shown to scale.
Descriptor
Descriptor
Descriptor
Descriptor
Buffers on EP0 OUT on all EPs
EP1 Tx Even
EP1 Rx Even
EP1 Rx Odd
EP1 Tx Odd
Descriptor
Descriptor
Descriptor
Descriptor
EP15 Tx Odd
EP0 Rx
PPB<1:0> = 11
EP0 Tx
Ping-Pong Buffers
Descriptor
Descriptor
Descriptor
on all other EPs
except EP0
Total BDT Space: Total BDT Space: Total BDT Space: Total BDT Space:
128 bytes 132 bytes 256 bytes 248 bytes
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BDs have a fixed relationship to a particular endpoint,
depending on the buffering configuration. Table 18-2
provides the mapping of BDs to endpoints. This relationship
also means that gaps may occur in the BDT if
endpoints are not enabled contiguously. This theoretically
means that the BDs for disabled endpoints could
be used as buffer space. In practice, users should
avoid using such spaces in the BDT unless a method
of validating BD addresses is implemented.
18.2.1 BUFFER OWNERSHIP
Because the buffers and their BDs are shared between
the CPU and the USB module, a simple semaphore
mechanism is used to distinguish which is allowed to
update the BD and associated buffers in memory. This
is done by using the UOWN bit as a semaphore to
distinguish which is allowed to update the BD and
associated buffers in memory. UOWN is the only bit
that is shared between the two configurations of
BDnSTAT.
When UOWN is clear, the BD entry is “owned” by the
microcontroller core. When the UOWN bit is set, the BD
entry and the buffer memory are “owned” by the USB
peripheral. The core should not modify the BD or its
corresponding data buffer during this time. Note that
the microcontroller core can still read BDnSTAT while
the SIE owns the buffer and vice versa.
The buffer descriptors have a different meaning based
on the source of the register update. Register 18-1 and
Register 18-2 show the differences in BDnSTAT
depending on its current “ownership”.
When UOWN is set, the user can no longer depend on
the values that were written to the BDs. From this point,
the USB module updates the BDs as necessary, overwriting
the original BD values. The BDnSTAT register is
updated by the SIE with the token PID and the transfer
count is updated.
18.2.2 DMA INTERFACE
The USB OTG module uses a dedicated DMA to
access both the BDT and the endpoint data buffers.
Since part of the address space of the DMA is dedicated
to the Buffer Descriptors, a portion of the memory
connected to the DMA must comprise a contiguous
address space properly mapped for the access by the
module.
TABLE 18-2: ASSIGNMENT OF BUFFER DESCRIPTORS FOR THE DIFFERENT
BUFFERING MODES
Endpoint
BDs Assigned to Endpoint
Mode 0
(No Ping-Pong)
Mode 1
(Ping-Pong on EP0 Out)
Mode 2
(Ping-Pong on all EPs)
Mode 3
(Ping-Pong on all other EPs,
except EP0)
Out In Out In Out In Out In
0 0 1 0 (E), 1 (O) 2 0 (E), 1 (O) 2 (E), 3 (O) 0 1
1 2 3 3 4 4 (E), 5 (O) 6 (E), 7 (O) 2 (E), 3 (O) 4 (E), 5 (O)
2 4 5 5 6 8 (E), 9 (O) 10 (E), 11 (O) 6 (E), 7 (O) 8 (E), 9 (O)
3 6 7 7 8 12 (E), 13 (O) 14 (E), 15 (O) 10 (E), 11 (O) 12 (E), 13 (O)
4 8 9 9 10 16 (E), 17 (O) 18 (E), 19 (O) 14 (E), 15 (O) 16 (E), 17 (O)
5 10 11 11 12 20 (E), 21 (O) 22 (E), 23 (O) 18 (E), 19 (O) 20 (E), 21 (O)
6 12 13 13 14 24 (E), 25 (O) 26 (E), 27 (O) 22 (E), 23 (O) 24 (E), 25 (O)
7 14 15 15 16 28 (E), 29 (O) 30 (E), 31 (O) 26 (E), 27 (O) 28 (E), 29 (O)
8 16 17 17 18 32 (E), 33 (O) 34 (E), 35 (O) 30 (E), 31 (O) 32 (E), 33 (O)
9 18 19 19 20 36 (E), 37 (O) 38 (E), 39 (O) 34 (E), 35 (O) 36 (E), 37 (O)
10 20 21 21 22 40 (E), 41 (O) 42 (E), 43 (O) 38 (E), 39 (O) 40 (E), 41 (O)
11 22 23 23 24 44 (E), 45 (O) 46 (E), 47 (O) 42 (E), 43 (O) 44 (E), 45 (O)
12 24 25 25 26 48 (E), 49 (O) 50 (E), 51 (O) 46 (E), 47 (O) 48 (E), 49 (O)
13 26 27 27 28 52 (E), 53 (O) 54 (E), 55 (O) 50 (E), 51 (O) 52 (E), 53 (O)
14 28 29 29 30 56 (E), 57 (O) 58 (E), 59 (O) 54 (E), 55 (O) 56 (E), 57 (O)
15 30 31 31 32 60 (E), 61 (O) 62 (E), 63 (O) 58 (E), 59 (O) 60 (E), 61 (O)
Legend: (E) = Even transaction buffer, (O) = Odd transaction buffer
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REGISTER 18-1: BDnSTAT: BUFFER DESCRIPTOR n STATUS REGISTER PROTOTYPE,
USB MODE (BD0STAT THROUGH BD63STAT)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
UOWN DTS PID3 PID2 PID1 PID0 BC9 BC8
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
BC7 BC6 BC5 BC4 BC3 BC2 BC1 BC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 UOWN: USB Own bit
1 = The USB module owns the BD and its corresponding buffer; the CPU must not modify the BD or
the buffer
bit 14 DTS: Data Toggle Packet bit
1 = Data 1 packet
0 = Data 0 packet
bit 13-10 PID<3:0>: Packet Identifier bits (written by the USB module)
In Device mode:
Represents the PID of the received token during the last transfer.
In Host mode:
Represents the last returned PID or the transfer status indicator.
bit 9-0 BC<9:0>: Byte Count
This represents the number of bytes to be transmitted or the maximum number of bytes to be received
during a transfer. Upon completion, the byte count is updated by the USB module with the actual
number of bytes transmitted or received.
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REGISTER 18-2: BDnSTAT: BUFFER DESCRIPTOR n STATUS REGISTER PROTOTYPE,
CPU MODE (BD0STAT THROUGH BD63STAT)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
UOWN DTS(1) 0 0 DTSEN BSTALL BC9 BC8
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
BC7 BC6 BC5 BC4 BC3 BC2 BC1 BC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 UOWN: USB Own bit
0 = The microcontroller core owns the BD and its corresponding buffer. The USB module ignores all
other fields in the BD.
bit 14 DTS: Data Toggle Packet bit(1)
1 = Data 1 packet
0 = Data 0 packet
bit 13-12 Reserved Function: Maintain as ‘0’
bit 11 DTSEN: Data Toggle Synchronization Enable bit
1 = Data toggle synchronization is enabled; data packets with incorrect sync value will be ignored
0 = No data toggle synchronization is performed
bit 10 BSTALL: Buffer Stall Enable bit
1 = Buffer STALL enabled; STALL handshake issued if a token is received that would use the BD in
the given location (UOWN bit remains set, BD value is unchanged); corresponding EPSTALL bit
will get set on any STALL handshake
0 = Buffer STALL disabled
bit 9-0 BC<9:0>: Byte Count bits
This represents the number of bytes to be transmitted or the maximum number of bytes to be received
during a transfer. Upon completion, the byte count is updated by the USB module with the actual
number of bytes transmitted or received.
Note 1: This bit is ignored unless DTSEN = 1.
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18.3 USB Interrupts
The USB OTG module has many conditions that can
be configured to cause an interrupt. All interrupt
sources use the same interrupt vector.
Figure 18-9 shows the interrupt logic for the USB
module. There are two layers of interrupt registers in
the USB module. The top level consists of overall USB
status interrupts; these are enabled and flagged in the
U1IE and U1IR registers, respectively. The second
level consists of USB error conditions, which are
enabled and flagged in the U1EIR and U1EIE registers.
An interrupt condition in any of these triggers a USB
Error Interrupt Flag (UERRIF) in the top level.
Interrupts may be used to trap routine events in a USB
transaction. Figure 18-10 provides some common
events within a USB frame and their corresponding
interrupts.
FIGURE 18-9: USB OTG INTERRUPT FUNNEL
DMAEF
DMAEE
BTOEF
BTOEE
DFN8EF
DFN8EE
CRC16EF
CRC16EE
CRC5EF (EOFEF)
CRC5EE (EOFEE)
PIDEF
PIDEE
ATTACHIF
ATTACHIE
RESUMEIF
RESUMEIE
IDLEIF
IDLEIE
TRNIF
TRNIE
SOFIF
SOFIE
URSTIF (DETACHIF)
URSTIE (DETACHIE)
(UERRIF)
UERRIE
Set USB1IF
STALLIF
STALLIE
BTSEF
BTSEE
T1MSECIF
TIMSECIE
LSTATEIF
LSTATEIE
ACTVIF
ACTVIE
SESVDIF
SESVDIE
SESENDIF
SESENDIE
VBUSVDIF
VBUSVDIE
IDIF
IDIE
Second Level (USB Error) Interrupts
Top Level (USB Status) Interrupts
Top Level (USB OTG) Interrupts
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18.3.1 CLEARING USB OTG INTERRUPTS
Unlike device level interrupts, the USB OTG interrupt
status flags are not freely writable in software. All USB
OTG flag bits are implemented as hardware set only
bits. Additionally, these bits can only be cleared in
software by writing a ‘1’ to their locations (i.e., performing
a MOV type instruction). Writing a ‘0’ to a flag bit (i.e.,
a BCLR instruction) has no effect.
FIGURE 18-10: EXAMPLE OF A USB TRANSACTION AND INTERRUPT EVENTS
18.4 Device Mode Operation
The following section describes how to perform a common
Device mode task. In Device mode, USB transfers
are performed at the transfer level. The USB module
automatically performs the status phase of the transfer.
18.4.1 ENABLING DEVICE MODE
1. Reset the Ping-Pong Buffer Pointers by setting,
then clearing, the Ping-Pong Buffer Reset bit
PPBRST (U1CON<1>).
2. Disable all interrupts (U1IE and U1EIE = 00h).
3. Clear any existing interrupt flags by writing FFh
to U1IR and U1EIR.
4. Verify that VBUS is present (non OTG devices
only).
5. Enable the USB module by setting the USBEN
bit (U1CON<0>).
6. Set the OTGEN bit (U1OTGCON<2>) to enable
OTG operation.
7. Enable the endpoint zero buffer to receive the
first setup packet by setting the EPRXEN and
EPHSHK bits for Endpoint 0 (U1EP0<3,0> = 1).
8. Power up the USB module by setting the
USBPWR bit (U1PWRC<0>).
9. Enable the D+ pull-up resistor to signal an attach
by setting DPPULUP (U1OTGCON<7>).
Note: Throughout this data sheet, a bit that can
only be cleared by writing a ‘1’ to its location
is referred to as “Write ‘1’ to clear”. In
register descriptions, this function is
indicated by the descriptor “K”.
USB Reset
RESET SOF SETUP DATA STATUS SOF
SETUPToken Data ACK
OUT Token Empty Data ACK
Start-of-Frame (SOF)
IN Token Data ACK
SOFIF
URSTIF
1 ms Frame
Differential Data
From Host From Host To Host
From Host To Host From Host
From Host From Host To Host
Transaction
Control Transfer(1)
Transaction
Complete
Note 1: The control transfer shown here is only an example showing events that can occur for every transaction. Typical
control transfers will spread across multiple frames.
Set TRNIF
Set TRNIF
Set TRNIF
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18.4.2 RECEIVING AN IN TOKEN IN
DEVICE MODE
1. Attach to a USB host and enumerate as described
in Chapter 9 of the USB 2.0 specification.
2. Create a data buffer, and populate it with the
data to send to the host.
3. In the appropriate (EVEN or ODD) Tx BD for the
desired endpoint:
a) Set up the status register (BDnSTAT) with
the correct data toggle (DATA0/1) value and
the byte count of the data buffer.
b) Set up the address register (BDnADR) with
the starting address of the data buffer.
c) Set the UOWN bit of the status register to
‘1’.
4. When the USB module receives an IN token, it
automatically transmits the data in the buffer.
Upon completion, the module updates the status
register (BDnSTAT) and sets the Transfer
Complete Interrupt Flag, TRNIF (U1IR<3>).
18.4.3 RECEIVING AN OUT TOKEN IN
DEVICE MODE
1. Attach to a USB host and enumerate as described
in Chapter 9 of the USB 2.0 specification.
2. Create a data buffer with the amount of data you
are expecting from the host.
3. In the appropriate (EVEN or ODD) Tx BD for the
desired endpoint:
a) Set up the status register (BDnSTAT) with
the correct data toggle (DATA0/1) value and
the byte count of the data buffer.
b) Set up the address register (BDnADR) with
the starting address of the data buffer.
c) Set the UOWN bit of the status register to
‘1’.
4. When the USB module receives an OUT token,
it automatically receives the data sent by the
host to the buffer. Upon completion, the module
updates the status register (BDnSTAT) and sets
the Transfer Complete Interrupt Flag, TRNIF
(U1IR<3>).
18.5 Host Mode Operation
The following sections describe how to perform common
Host mode tasks. In Host mode, USB transfers are
invoked explicitly by the host software. The host software
is responsible for the Acknowledge portion of the
transfer. Also, all transfers are performed using the
Endpoint 0 control register (U1EP0) and buffer
descriptors.
18.5.1 ENABLE HOST MODE AND
DISCOVER A CONNECTED DEVICE
1. Enable Host mode by setting U1CON<3>
(HOSTEN). This causes the Host mode control
bits in other USB OTG registers to become
available.
2. Enable the D+ and D- pull-down resistors by setting
DPPULDWN and DMPULDWN
(U1OTGCON<5:4>). Disable the D+ and Dpull-
up resistors by clearing DPPULUP and
DMPULUP (U1OTGCON<7:6>).
3. At this point, SOF generation begins with the
SOF counter loaded with 12,000. Eliminate
noise on the USB by clearing the SOFEN bit
(U1CON<0>) to disable Start-Of-Frame packet
generation.
4. Enable the device attached interrupt by setting
ATTACHIE (U1IE<6>).
5. Wait for the device attached interrupt
(U1IR<6> = 1). This is signaled by the USB
device changing the state of D+ or D- from ‘0’
to ‘1’ (SE0 to J state). After it occurs, wait
100 ms for the device power to stabilize.
6. Check the state of the JSTATE and SE0 bits in
U1CON. If the JSTATE bit (U1CON<7>) is ‘0’,
the connecting device is low speed. If the
connecting device is low speed, set the low
LSPDEN and LSPD bits (U1ADDR<7> and
U1EP0<7>) to enable low-speed operation.
7. Reset the USB device by setting the USBRST
bit (U1CON<4>) for at least 50 ms, sending
Reset signaling on the bus. After 50 ms,
terminate the Reset by clearing USBRST.
8. To keep the connected device from going into
suspend, enable SOF packet generation to keep
by setting the SOFEN bit.
9. Wait 10 ms for the device to recover from Reset.
10. Perform enumeration as described by Chapter 9
of the USB 2.0 specification.
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18.5.2 COMPLETE A CONTROL
TRANSACTION TO A CONNECTED
DEVICE
1. Follow the procedure described in
Section 18.5.1 “Enable Host Mode and Discover
a Connected Device” to discover a
device.
2. Set up the Endpoint Control register for
bidirectional control transfers by writing 0Dh to
U1EP0 (this sets the EPCONDIS, EPTXEN, and
EPHSHK bits).
3. Place a copy of the device framework setup
command in a memory buffer. See Chapter 9 of
the USB 2.0 specification for information on the
device framework command set.
4. Initialize the buffer descriptor (BD) for the
current (EVEN or ODD) Tx EP0, to transfer the
eight bytes of command data for a device
framework command (i.e., a GET DEVICE
DESCRIPTOR):
a) Set the BD data buffer address (BD0ADR)
to the starting address of the 8-byte
memory buffer containing the command.
b) Write 8008h to BD0STAT (this sets the
UOWN bit, and sets a byte count of 8).
5. Set the USB device address of the target device
in the address register (U1ADDR<6:0>). After a
USB bus Reset, the device USB address will be
zero. After enumeration, it will be set to another
value between 1 and 127.
6. Write D0h to U1TOK; this is a SETUP token to
Endpoint 0, the target device’s default control
pipe. This initiates a SETUP token on the bus, followed
by a data packet. The device handshake is
returned in the PID field of BD0STAT after the
packets are complete. When the USB module
updates BD0STAT, a transfer done interrupt is
asserted (the TRNIF flag is set). This completes
the setup phase of the setup transaction as
referenced in chapter 9 of the USB specification.
7. To initiate the data phase of the setup transaction
(i.e., get the data for the GET DEVICE
descriptor command), set up a buffer in memory
to store the received data.
8. Initialize the current (EVEN or ODD) Rx or Tx
(Rx for IN, Tx for OUT) EP0 BD to transfer the
data.
a) Write C040h to BD0STAT. This sets the
UOWN, configures Data Toggle (DTS) to
DATA1, and sets the byte count to the
length of the data buffer (64 or 40h, in this
case).
b) Set BD0ADR to the starting address of the
data buffer.
9. Write the token register with the appropriate IN
or OUT token to Endpoint 0, the target device’s
default control pipe (e.g., write 90h to U1TOK for
an IN token for a GET DEVICE DESCRIPTOR
command). This initiates an IN token on the bus
followed by a data packet from the device to the
host. When the data packet completes, the
BD0STAT is written and a transfer done interrupt
is asserted (the TRNIF flag is set). For control
transfers with a single packet data phase, this
completes the data phase of the setup transaction
as referenced in chapter 9 of the USB
specification. If more data needs to be
transferred, return to step 8.
10. To initiate the status phase of the setup transaction,
set up a buffer in memory to receive or send
the zero length status phase data packet.
11. Initialize the current (even or odd) Tx EP0 BD to
transfer the status data.:
a) Set the BDT buffer address field to the start
address of the data buffer
b) Write 8000h to BD0STAT (set UOWN bit,
configure DTS to DATA0, and set byte
count to 0).
12. Write the Token register with the appropriate IN or
OUT token to Endpoint 0, the target device’s
default control pipe (e.g., write 01h to U1TOK for
an OUT token for a GET DEVICE DESCRIPTOR
command). This initiates an OUT token on the
bus followed by a zero length data packet from
the host to the device. When the data packet
completes, the BD is updated with the handshake
from the device, and a transfer done interrupt is
asserted (the TRNIF flag is set). This completes
the status phase of the setup transaction as
described in Chapter 9 of the USB specification.
Note: Only one control transaction can be
performed per frame.
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18.5.3 SEND A FULL-SPEED BULK DATA
TRANSFER TO A TARGET DEVICE
1. Follow the procedure described in Section 18.5.1
“Enable Host Mode and Discover a Connected
Device” and Section 18.5.2 “Complete a Control
Transaction to a Connected Device” to
discover and configure a device.
2. To enable transmit and receive transfers with
handshaking enabled, write 1Dh to U1EP0. If
the target device is a low-speed device, also set
the LSPD bit (U1EP0<7>). If you want the hardware
to automatically retry indefinitely if the
target device asserts a NAK on the transfer,
clear the Retry Disable bit, RETRYDIS
(U1EP0<6>).
3. Set up the BD for the current (EVEN or ODD) Tx
EP0 to transfer up to 64 bytes.
4. Set the USB device address of the target device
in the address register (U1ADDR<6:0>).
5. Write an OUT token to the desired endpoint to
U1TOK. This triggers the module’s transmit
state machines to begin transmitting the token
and the data.
6. Wait for the Transfer Done Interrupt Flag,
TRNIF. This indicates that the BD has been
released back to the microprocessor, and the
transfer has completed. If the retry disable bit is
set, the handshake (ACK, NAK, STALL or
ERROR (0Fh)) is returned in the BD PID field. If
a STALL interrupt occurs, the pending packet
must be dequeued and the error condition in the
target device cleared. If a detach interrupt
occurs (SE0 for more than 2.5 μs), then the
target has detached (U1IR<0> is set).
7. Once the transfer done interrupt occurs (TRNIF
is set), the BD can be examined and the next
data packet queued by returning to step 2.
18.6 OTG Operation
18.6.1 SESSION REQUEST PROTOCOL
(SRP)
An OTG A-device may decide to power down the VBUS
supply when it is not using the USB link through the
Session Request Protocol (SRP). Software may do this
by clearing VBUSON (U1OTGCON<3>). When the VBUS
supply is powered down, the A-device is said to have
ended a USB session.
An OTG A-device or Embedded Host may repower the
VBUS supply at any time (initiate a new session). An
OTG B-device may also request that the OTG A-device
repower the VBUS supply (initiate a new session). This
is accomplished via Session Request Protocol (SRP).
Prior to requesting a new session, the B-device must
first check that the previous session has definitely
ended. To do this, the B-device must check for two
conditions:
1. VBUS supply is below the Session Valid voltage and
2. Both D+ and D- have been low for at least 2 ms.
The B-device will be notified of condition 1 by the
SESENDIF (U1OTGIR<2>) interrupt. Software will
have to manually check for condition 2.
The B-device may aid in achieving condition 1 by discharging
the VBUS supply through a resistor. Software
may do this by setting VBUSDIS (U1OTGCON<0>).
After these initial conditions are met, the B-device may
begin requesting the new session. The B-device begins
by pulsing the D+ data line. Software should do this by
setting DPPULUP (U1OTGCON<7>). The data line
should be held high for 5 to 10 ms.
The B-device then proceeds by pulsing the VBUS
supply. Software should do this by setting PUVBUS
(U1CNFG2<4>). When an A-device detects SRP signaling
(either via the ATTACHIF (U1IR<6>) interrupt or
via the SESVDIF (U1OTGIR<3>) interrupt), the
A-device must restore the VBUS supply by either setting
VBUSON (U1OTGCON<3>), or by setting the I/O port
controlling the external power source.
The B-device should not monitor the state of the VBUS
supply while performing VBUS supply pulsing. When the
B-device does detect that the VBUS supply has been
restored (via the SESVDIF (U1OTGIR<3>) interrupt),
the B-device must re-connect to the USB link by pulling
up D+ or D- (via the DPPULUP or DMPULUP).
The A-device must complete the SRP by driving USB
Reset signaling.
Note: USB speed, transceiver and pull-ups
should only be configured during the
module setup phase. It is not recommended
to change these settings while
the module is enabled.
Note: When the A-device powers down the VBUS
supply, the B-device must disconnect its
pull-up resistor from power. If the device is
self-powered, it can do this by clearing
DPPULUP (U1OTGCON<7>) and
DMPULUP (U1OTGCON<6>).
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18.6.2 HOST NEGOTIATION PROTOCOL
(HNP)
In USB OTG applications, a Dual Role Device (DRD) is
a device that is capable of being either a host or a
peripheral. Any OTG DRD must support Host
Negotiation Protocol (HNP).
HNP allows an OTG B-device to temporarily become
the USB host. The A-device must first enable the
B-device to follow HNP. Refer to the “On-The-Go
Supplement to the USB 2.0 Specification” for more
information regarding HNP. HNP may only be initiated
at full speed.
After being enabled for HNP by the A-device, the
B-device requests being the host any time that the USB
link is in Suspend state, by simply indicating a disconnect.
This can be done in software by clearing
DPPULUP and DMPULUP. When the A-device detects
the disconnect condition (via the URSTIF (U1IR<0>)
interrupt), the A-device may allow the B-device to take
over as Host. The A-device does this by signaling connect
as a full-speed function. Software may accomplish
this by setting DPPULUP.
If the A-device responds instead with resume signaling,
the A-device remains as host. When the B-device
detects the connect condition (via ATTACHIF
(U1IR<6>), the B-device becomes host. The B-device
drives Reset signaling prior to using the bus.
When the B-device has finished in its role as Host, it
stops all bus activity and turns on its D+ pull-up resistor
by setting DPPULUP. When the A-device detects a
suspend condition (Idle for 3 ms), the A-device turns off
its D+ pull-up. The A-device may also power-down
VBUS supply to end the session. When the A-device
detects the connect condition (via ATTACHIF), the
A-device resumes host operation, and drives Reset
signaling.
18.7 USB OTG Module Registers
There are a total of 37 memory mapped registers associated
with the USB OTG module. They can be divided
into four general categories:
• USB OTG Module Control (12)
• USB Interrupt (7)
• USB Endpoint Management (16)
• USB VBUS Power Control (2)
This total does not include the (up to) 128 BD registers
in the BDT. Their prototypes, described in
Register 18-1 and Register 18-2, are shown separately
in Section 18.2 “USB Buffer Descriptors and the
BDT”.
With the exception U1PWMCON and U1PWMRRS, all
USB OTG registers are implemented in the Least Significant
Byte of the register. Bits in the upper byte are
unimplemented, and have no function. Note that some
registers are instantiated only in Host mode, while
other registers have different bit instantiations and
functions in Device and Host modes.
Registers described in the following sections are those
that have bits with specific control and configuration
features. The following registers are used for data or
address values only:
• U1BDTP1: Specifies the 256-word page in data
RAM used for the BDT; 8-bit value with bit 0 fixed
as ‘0’ for boundary alignment
• U1FRML and U1FRMH: Contains the 11-bit byte
counter for the current data frame
• U1PWMRRS: Contains the 8-bit value for PWM
duty cycle (bits<15:8>) and PWM period
(bits<7:0>) for the VBUS boost assist PWM
module.
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DS39897C-page 222 2009 Microchip Technology Inc.
18.7.1 USB OTG MODULE CONTROL
REGISTERS
REGISTER 18-3: U1OTGSTAT: USB OTG STATUS REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R-0, HSC U-0 R-0, HSC U-0 R-0, HSC R-0, HSC U-0 R-0, HSC
ID — LSTATE — SESVD SESEND — VBUSVD
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 ID: ID Pin State Indicator bit
1 = No plug is attached, or a type B cable has been plugged into the USB receptacle
0 = A type A plug has been plugged into the USB receptacle
bit 6 Unimplemented: Read as ‘0’
bit 5 LSTATE: Line State Stable Indicator bit
1 = The USB line state (as defined by SE0 and JSTATE) has been stable for the previous 1 ms
0 = The USB line state has NOT been stable for the previous 1 ms
bit 4 Unimplemented: Read as ‘0’
bit 3 SESVD: Session Valid Indicator bit
1 = The VBUS voltage is above VA_SESS_VLD (as defined in the USB OTG Specification) on the A or
B-device
0 = The VBUS voltage is below VA_SESS_VLD on the A or B-device
bit 2 SESEND: B-Session End Indicator bit
1 = The VBUS voltage is below VB_SESS_END (as defined in the USB OTG Specification) on the
B-device
0 = The VBUS voltage is above VB_SESS_END on the B-device
bit 1 Unimplemented: Read as ‘0’
bit 0 VBUSVD: A-VBUS Valid Indicator bit
1 = The VBUS voltage is above VA_VBUS_VLD (as defined in the USB OTG Specification) on the
A-device
0 = The VBUS voltage is below VA_VBUS_VLD on the A-device
2009 Microchip Technology Inc. DS39897C-page 223
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REGISTER 18-4: U1OTGCON: USB ON-THE-GO CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DPPULUP DMPULUP DPPULDWN(1) DMPULDWN(1) VBUSON(1) OTGEN(1) VBUSCHG(1) VBUSDIS(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 DPPULUP: D+ Pull-Up Enable bit
1 = D+ data line pull-up resistor enabled
0 = D+ data line pull-up resistor disabled
bit 6 DMPULUP: D- Pull-Up Enable bit
1 = D- data line pull-up resistor enabled
0 = D- data line pull-up resistor disabled
bit 5 DPPULDWN: D+ Pull-Down Enable bit(1)
1 = D+ data line pull-down resistor enabled
0 = D+ data line pull-down resistor disabled
bit 4 DMPULDWN: D- Pull-Down Enable bit(1)
1 = D- data line pull-down resistor enabled
0 = D- data line pull-down resistor disabled
bit 3 VBUSON: VBUS Power-on bit(1)
1 = VBUS line powered
0 = VBUS line not powered
bit 2 OTGEN: OTG Features Enable bit(1)
1 = USB OTG enabled; all D+/D- pull-ups and pull-downs bits are enabled
0 = USB OTG disabled; D+/D- pull-ups and pull-downs are controlled in hardware by the settings of the
HOSTEN and USBEN bits (U1CON<3,0>)
bit 1 VBUSCHG: VBUS Charge Select bit(1)
1 = VBUS line set to charge to 3.3V
0 = VBUS line set to charge to 5V
bit 0 VBUSDIS: VBUS Discharge Enable bit(1)
1 = VBUS line discharged through a resistor
0 = VBUS line not discharged
Note 1: These bits are only used in Host mode; do not use in Device mode.
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REGISTER 18-5: U1PWRC: USB POWER CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0, HS U-0 U-0 R/W-0 U-0 U-0 R/W-0, HC R/W-0
UACTPND — — USLPGRD — — USUSPND USBPWR
bit 7 bit 0
Legend: HS = Hardware Settable bit HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 UACTPND: USB Activity Pending bit
1 = Module should not be suspended at the moment (requires USLPGRD bit to be set)
0 = Module may be suspended or powered down
bit 6-5 Unimplemented: Read as ‘0’
bit 4 USLPGRD: Sleep/Suspend Guard bit
1 = Indicate to the USB module that it is about to be suspended or powered down
0 = No suspend
bit 3-2 Unimplemented: Read as ‘0’
bit 1 USUSPND: USB Suspend Mode Enable bit
1 = USB OTG module is in Suspend mode; USB clock is gated and the transceiver is placed in a
low-power state
0 = Normal USB OTG operation
bit 0 USBPWR: USB Operation Enable bit
1 = USB OTG module is enabled
0 = USB OTG module is disabled(1)
Note 1: Do not clear this bit unless the HOSTEN, USBEN and OTGEN bits (U1CON<3,0> and U1OTGCON<2>)
are all cleared.
2009 Microchip Technology Inc. DS39897C-page 225
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REGISTER 18-6: U1STAT: USB STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R-0, HSC R-0, HSC R-0, HSC R-0, HSC R-0, HSC R-0, HSC U-0 U-0
ENDPT3 ENDPT2 ENDPT1 ENDPT0 DIR PPBI(1) — —
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-4 ENDPT<3:0>: Number of the Last Endpoint Activity bits
(Represents the number of the BDT updated by the last USB transfer).
1111 = Endpoint 15
1110 = Endpoint 14
....
0001 = Endpoint 1
0000 = Endpoint 0
bit 3 DIR: Last BD Direction Indicator bit
1 = The last transaction was a transmit transfer (Tx)
0 = The last transaction was a receive transfer (Rx)
bit 2 PPBI: Ping-Pong BD Pointer Indicator bit(1)
1 = The last transaction was to the ODD BD bank
0 = The last transaction was to the EVEN BD bank
bit 1-0 Unimplemented: Read as ‘0’
Note 1: This bit is only valid for endpoints with available EVEN and ODD BD registers.
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REGISTER 18-7: U1CON: USB CONTROL REGISTER (DEVICE MODE)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R-x, HSC R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— SE0 PKTDIS — HOSTEN RESUME PPBRST USBEN
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0’
bit 6 SE0: Live Single-Ended Zero Flag bit
1 = Single-ended zero active on the USB bus
0 = No single-ended zero detected
bit 5 PKTDIS: Packet Transfer Disable bit
1 = SIE token and packet processing disabled; automatically set when a SETUP token is received
0 = SIE token and packet processing enabled
bit 4 Unimplemented: Read as ‘0’
bit 3 HOSTEN: Host Mode Enable bit
1 = USB host capability enabled; pull-downs on D+ and D- are activated in hardware
0 = USB host capability disabled
bit 2 RESUME: Resume Signaling Enable bit
1 = Resume signaling activated
0 = Resume signaling disabled
bit 1 PPBRST: Ping-Pong Buffers Reset bit
1 = Reset all Ping-Pong Buffer Pointers to the EVEN BD banks
0 = Ping-Pong Buffer Pointers not reset
bit 0 USBEN: USB Module Enable bit
1 = USB module and supporting circuitry enabled (device attached); D+ pull-up is activated in hardware
0 = USB module and supporting circuitry disabled (device detached)
2009 Microchip Technology Inc. DS39897C-page 227
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REGISTER 18-8: U1CON: USB CONTROL REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R-x, HSC R-x, HSC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
JSTATE SE0 TOKBUSY USBRST HOSTEN RESUME PPBRST SOFEN
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 JSTATE: Live Differential Receiver J State Flag bit
1 = J state (differential ‘0’ in low speed, differential ‘1’ in full speed) detected on the USB
0 = No J state detected
bit 6 SE0: Live Single-Ended Zero Flag bit
1 = Single-ended zero active on the USB bus
0 = No single-ended zero detected
bit 5 TOKBUSY: Token Busy Status bit
1 = Token being executed by the USB module in On-The-Go state
0 = No token being executed
bit 4 USBRST: Module Reset bit
1 = USB Reset has been generated; for software Reset, application must set this bit for 50 ms, then
clear it
0 = USB Reset terminated
bit 3 HOSTEN: Host Mode Enable bit
1 = USB host capability enabled; pull-downs on D+ and D- are activated in hardware
0 = USB host capability disabled
bit 2 RESUME: Resume Signaling Enable bit
1 = Resume signaling activated; software must set bit for 10 ms and then clear to enable remote wake-up
0 = Resume signaling disabled
bit 1 PPBRST: Ping-Pong Buffers Reset bit
1 = Reset all Ping-Pong Buffer Pointers to the EVEN BD banks
0 = Ping-Pong Buffer Pointers not reset
bit 0 SOFEN: Start-Of-Frame Enable bit
1 = Start-Of-Frame token sent every one 1 millisecond
0 = Start-Of-Frame token disabled
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REGISTER 18-9: U1ADDR: USB ADDRESS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LSPDEN(1) ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 LSPDEN: Low-Speed Enable Indicator bit(1)
1 = USB module operates at low speed
0 = USB module operates at full speed
bit 6-0 ADDR<6:0>: USB Device Address bits
Note 1: Host mode only. In Device mode, this bit is unimplemented and read as ‘0’.
REGISTER 18-10: U1TOK: USB TOKEN REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PID3 PID2 PID1 PID0 EP3 EP2 EP1 EP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-4 PID<3:0>: Token Type Identifier bits
1101 = SETUP (TX) token type transaction(1)
1001 = IN (RX) token type transaction(1)
0001 = OUT (TX) token type transaction(1)
bit 3-0 EP<3:0>: Token Command Endpoint Address bits
This value must specify a valid endpoint on the attached device.
Note 1: All other combinations are reserved and are not to be used.
2009 Microchip Technology Inc. DS39897C-page 229
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REGISTER 18-11: U1SOF: USB OTG START-OF-TOKEN THRESHOLD REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CNT7 CNT6 CNT5 CNT4 CNT3 CNT2 CNT1 CNT0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 CNT<7:0>: Start-Of-Frame Size bits;
Value represents 10 + (packet size of n bytes). For example:
0100 1010 = 64-byte packet
0010 1010 = 32-byte packet
0001 0010 = 8-byte packet
REGISTER 18-12: U1CNFG1: USB CONFIGURATION REGISTER 1
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
UTEYE UOEMON(1) — USBSIDL — — PPB1 PPB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 UTEYE: USB Eye Pattern Test Enable bit
1 = Eye pattern test enabled
0 = Eye pattern test disabled
bit 6 UOEMON: USB OE Monitor Enable bit(1)
1 = OE signal active; it indicates intervals during which the D+/D- lines are driving
0 = OE signal inactive
bit 5 Unimplemented: Read as ‘0’
bit 4 USBSIDL: USB OTG Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 PPB<1:0>: Ping-Pong Buffers Configuration bit
11 = EVEN/ODD ping-pong buffers enabled for Endpoints 1 to 15
10 = EVEN/ODD ping-pong buffers enabled for all endpoints
01 = EVEN/ODD ping-pong buffer enabled for OUT Endpoint 0
00 = EVEN/ODD ping-pong buffers disabled
Note 1: This bit is only active when the UTRDIS bit (U1CNFG2<0>) is set.
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REGISTER 18-13: U1CNFG2: USB CONFIGURATION REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — PUVBUS EXTI2CEN UVBUSDIS(1) UVCMPDIS(1) UTRDIS(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5 Unimplemented: Read as ‘0’
bit 4 PUVBUS: VBUS Pull-up Enable bit
1 = Pull-up on VBUS pin enabled
0 = Pull-up on VBUS pin disabled
bit 3 EXTI2CEN: I2C™ Interface For External Module Control Enable bit
1 = External module(s) controlled via I2C interface
0 = External module(s) controller via dedicated pins
bit 2 UVBUSDIS: On-Chip 5V Boost Regulator Builder Disable bit(1)
1 = On-chip boost regulator builder disabled; digital output control interface enabled
0 = On-chip boost regulator builder active
bit 1 UVCMPDIS: On-Chip VBUS Comparator Disable bit(1)
1 = On-chip charge VBUS comparator disabled; digital input status interface enabled
0 = On-chip charge VBUS comparator active
bit 0 UTRDIS: On-Chip Transceiver Disable bit(1)
1 = On-chip transceiver disabled; digital transceiver interface enabled
0 = On-chip transceiver active
Note 1: Never change these bits while the USBPWR bit is set (U1PWRC<0> = 1).
2009 Microchip Technology Inc. DS39897C-page 231
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18.7.2 USB INTERRUPT REGISTERS
REGISTER 18-14: U1OTGIR: USB OTG INTERRUPT STATUS REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS U-0 R/K-0, HS
IDIF T1MSECIF LSTATEIF ACTVIF SESVDIF SESENDIF — VBUSVDIF
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 IDIF: ID State Change Indicator bit
1 = Change in ID state detected
0 = No ID state change
bit 6 T1MSECIF: 1 Millisecond Timer bit
1 = The 1 millisecond timer has expired
0 = The 1 millisecond timer has not expired
bit 5 LSTATEIF: Line State Stable Indicator bit
1 = USB line state (as defined by the SE0 and JSTATE bits) has been stable for 1 ms, but different from
last time
0 = USB line state has not been stable for 1 ms
bit 4 ACTVIF: Bus Activity Indicator bit
1 = Activity on the D+/D- lines or VBUS detected
0 = No activity on the D+/D- lines or VBUS detected
bit 3 SESVDIF: Session Valid Change Indicator bit
1 = VBUS has crossed VA_SESS_END (as defined in the USB OTG Specification)(1)
0 = VBUS has not crossed VA_SESS_END
bit 2 SESENDIF: B-Device VBUS Change Indicator bit
1 = VBUS change on B-device detected; VBUS has crossed VB_SESS_END (as defined in the USB OTG
Specification)(1)
0 = VBUS has not crossed VA_SESS_END
bit 1 Unimplemented: Read as ‘0’
bit 0 VBUSVDIF A-Device VBUS Change Indicator bit
1 = VBUS change on A-device detected; VBUS has crossed VA_VBUS_VLD (as defined in the USB OTG
Specification)(1)
0 = No VBUS change on A-device detected
Note 1: VBUS threshold crossings may be either rising or falling.
Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the
entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause
all set bits at the moment of the write to become cleared.
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REGISTER 18-15: U1OTGIE: USB OTG INTERRUPT ENABLE REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
IDIE T1MSECIE LSTATEIE ACTVIE SESVDIE SESENDIE — VBUSVDIE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 IDIE: ID Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 6 T1MSECIE: 1 Millisecond Timer Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 5 LSTATEIE: Line State Stable Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 4 ACTVIE: Bus Activity Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 3 SESVDIE: Session Valid Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 2 SESENDIE: B-Device Session End Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 1 Unimplemented: Read as ‘0’
bit 0 VBUSVDIE: A-Device VBUS Valid Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
2009 Microchip Technology Inc. DS39897C-page 233
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REGISTER 18-16: U1IR: USB INTERRUPT STATUS REGISTER (DEVICE MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/K-0, HS U-0 R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R-0 R/K-0, HS
STALLIF — RESUMEIF IDLEIF TRNIF SOFIF UERRIF URSTIF
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 STALLIF: STALL Handshake Interrupt bit
1 = A STALL handshake was sent by the peripheral during the handshake phase of the transaction in
Device mode
0 = A STALL handshake has not been sent
bit 6 Unimplemented: Read as ‘0’
bit 5 RESUMEIF: Resume Interrupt bit
1 = A K-state is observed on the D+ or D- pin for 2.5 s (differential ‘1’ for low speed, differential ‘0’ for
full speed)
0 = No K-state observed
bit 4 IDLEIF: Idle Detect Interrupt bit
1 = Idle condition detected (constant Idle state of 3 ms or more)
0 = No Idle condition detected
bit 3 TRNIF: Token Processing Complete Interrupt bit
1 = Processing of current token is complete; read U1STAT register for endpoint information
0 = Processing of current token not complete; clear U1STAT register or load next token from STAT
(clearing this bit causes the STAT FIFO to advance)
bit 2 SOFIF: Start-Of-Frame Token Interrupt bit
1 = A Start-Of-Frame token received by the peripheral or the Start-Of-Frame threshold reached by the
host
0 = No Start-Of-Frame token received or threshold reached
bit 1 UERRIF: USB Error Condition Interrupt bit (read-only)
1 = An unmasked error condition has occurred; only error states enabled in the U1EIE register can set
this bit
0 = No unmasked error condition has occurred
bit 0 URSTIF: USB Reset Interrupt bit
1 = Valid USB Reset has occurred for at least 2.5 s; Reset state must be cleared before this bit can
be reasserted
0 = No USB Reset has occurred. Individual bits can only be cleared by writing a ‘1’ to the bit position
as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations
to write to a single bit position will cause all set bits at the moment of the write to become
cleared.
Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the
entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause
all set bits at the moment of the write to become cleared.
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DS39897C-page 234 2009 Microchip Technology Inc.
REGISTER 18-17: U1IR: USB INTERRUPT STATUS REGISTER (HOST MODE ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R-0 R/K-0, HS
STALLIF ATTACHIF RESUMEIF IDLEIF TRNIF SOFIF UERRIF DETACHIF
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 STALLIF: STALL Handshake Interrupt bit
1 = A STALL handshake was sent by the peripheral device during the handshake phase of the
transaction in Device mode
0 = A STALL handshake has not been sent
bit 6 ATTACHIF: Peripheral Attach Interrupt bit
1 = A peripheral attachment has been detected by the module; set if the bus state is not SE0 and there
has been no bus activity for 2.5 s
0 = No peripheral attachement detected
bit 5 RESUMEIF: Resume Interrupt bit
1 = A K-state is observed on the D+ or D- pin for 2.5 s (differential ‘1’ for low speed, differential ‘0’ for
full speed)
0 = No K-state observed
bit 4 IDLEIF: Idle Detect Interrupt bit
1 = Idle condition detected (constant Idle state of 3 ms or more)
0 = No Idle condition detected
bit 3 TRNIF: Token Processing Complete Interrupt bit
1 = Processing of current token is complete; read U1STAT register for endpoint information
0 = Processing of current token not complete; clear U1STAT register or load next token from U1STAT
bit 2 SOFIF: Start-Of-Frame Token Interrupt bit
1 = A Start-Of-Frame token received by the peripheral or the Start-Of-Frame threshold reached by the
host
0 = No Start-Of-Frame token received or threshold reached
bit 1 UERRIF: USB Error Condition Interrupt bit
1 = An unmasked error condition has occurred; only error states enabled in the U1EIE register can set
this bit
0 = No unmasked error condition has occurred
bit 0 DETACHIF: Detach Interrupt bit
1 = A peripheral detachment has been detected by the module; Reset state must be cleared before
this bit can be reasserted
0 = No peripheral detachment detected. Individual bits can only be cleared by writing a ‘1’ to the bit
position as part of a word write operation on the entire register. Using Boolean instructions or bitwise
operations to write to a single bit position will cause all set bits at the moment of the write to
become cleared.
Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the
entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause
all set bits at the moment of the write to become cleared.
2009 Microchip Technology Inc. DS39897C-page 235
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REGISTER 18-18: U1IE: USB INTERRUPT ENABLE REGISTER (ALL USB MODES)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STALLIE ATTACHIE(1) RESUMEIE IDLEIE TRNIE SOFIE UERRIE URSTIE
DETACHIE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 STALLIE: STALL Handshake Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 6 ATTACHIE: Peripheral Attach Interrupt bit (Host mode only)(1)
1 = Interrupt enabled
0 = Interrupt disabled
bit 5 RESUMEIE: Resume Interrupt bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 4 IDLEIE: Idle Detect Interrupt bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 3 TRNIE: Token Processing Complete Interrupt bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 2 SOFIE: Start-of-Frame Token Interrupt bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 1 UERRIE: USB Error Condition Interrupt bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 0 URSTIE or DETACHIE: USB Reset Interrupt (Device mode) or USB Detach Interrupt (Host mode)
Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
Note 1: Unimplemented in Device mode, read as ‘0’.
PIC24FJ256GB110 FAMILY
DS39897C-page 236 2009 Microchip Technology Inc.
REGISTER 18-19: U1EIR: USB ERROR INTERRUPT STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/K-0, HS U-0 R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS
BTSEF — DMAEF BTOEF DFN8EF CRC16EF
CRC5EF
PIDEF
EOFEF
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 BTSEF: Bit Stuff Error Flag bit
1 = Bit stuff error has been detected
0 = No bit stuff error
bit 6 Unimplemented: Read as ‘0’
bit 5 DMAEF: DMA Error Flag bit
1 = A USB DMA error condition detected; the data size indicated by the BD byte count field is less than
the number of received bytes. The received data is truncated.
0 = No DMA error
bit 4 BTOEF: Bus Turnaround Time-out Error Flag bit
1 = Bus turnaround time-out has occurred
0 = No bus turnaround time-out
bit 3 DFN8EF: Data Field Size Error Flag bit
1 = Data field was not an integral number of bytes
0 = Data field was an integral number of bytes
bit 2 CRC16EF: CRC16 Failure Flag bit
1 = CRC16 failed
0 = CRC16 passed
bit 1 For Device mode:
CRC5EF: CRC5 Host Error Flag bit
1 = Token packet rejected due to CRC5 error
0 = Token packet accepted (no CRC5 error)
For Host mode:
EOFEF: End-Of-Frame Error Flag bit
1 = End-Of-Frame error has occurred
0 = End-Of-Frame interrupt disabled
bit 0 PIDEF: PID Check Failure Flag bit
1 = PID check failed
0 = PID check passed. Individual bits can only be cleared by writing a ‘1’ to the bit position as part of
a word write operation on the entire register. Using Boolean instructions or bitwise operations to
write to a single bit position will cause all set bits at the moment of the write to become cleared.
Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the
entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause
all set bits at the moment of the write to become cleared.
2009 Microchip Technology Inc. DS39897C-page 237
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REGISTER 18-20: U1EIE: USB ERROR INTERRUPT ENABLE REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BTSEE — DMAEE BTOEE DFN8EE CRC16EE
CRC5EE
PIDEE
EOFEE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 BTSEE: Bit Stuff Error Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 6 Unimplemented: Read as ‘0’
bit 5 DMAEE: DMA Error Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 4 BTOEE: Bus Turnaround Time-out Error Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 3 DFN8EE: Data Field Size Error Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 2 CRC16EE: CRC16 Failure Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 1 For Device mode:
CRC5EE: CRC5 Host Error Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
For Host mode:
EOFEE: End-of-Frame Error interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
bit 0 PIDEE: PID Check Failure Interrupt Enable bit
1 = Interrupt enabled
0 = Interrupt disabled
PIC24FJ256GB110 FAMILY
DS39897C-page 238 2009 Microchip Technology Inc.
18.7.3 USB ENDPOINT MANAGEMENT
REGISTERS
REGISTER 18-21: U1EPn: USB ENDPOINT CONTROL REGISTERS (n = 0 TO 15)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LSPD(1) RETRYDIS(1) — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 LSPD: Low-Speed Direct Connection Enable bit (U1EP0 only)(1)
1 = Direct connection to a low-speed device enabled
0 = Direct connection to a low-speed device disabled
bit 6 RETRYDIS: Retry Disable bit (U1EP0 only)(1)
1 = Retry NAK transactions disabled
0 = Retry NAK transactions enabled; retry done in hardware
bit 5 Unimplemented: Read as ‘0’
bit 4 EPCONDIS: Bidirectional Endpoint Control bit
If EPTXEN and EPRXEN = 1:
1 = Disable Endpoint n from Control transfers; only Tx and Rx transfers allowed
0 = Enable Endpoint n for Control (SETUP) transfers; Tx and Rx transfers also allowed.
For all other combinations of EPTXEN and EPRXEN:
This bit is ignored.
bit 3 EPRXEN: Endpoint Receive Enable bit
1 = Endpoint n receive enabled
0 = Endpoint n receive disabled
bit 2 EPTXEN: Endpoint Transmit Enable bit
1 = Endpoint n transmit enabled
0 = Endpoint n transmit disabled
bit 1 EPSTALL: Endpoint Stall Status bit
1 = Endpoint n was stalled
0 = Endpoint n was not stalled
bit 0 EPHSHK: Endpoint Handshake Enable bit
1 = Endpoint handshake enabled
0 = Endpoint handshake disabled (typically used for isochronous endpoints)
Note 1: These bits are available only for U1EP0, and only in Host mode. For all other U1EPn registers, these bits
are always unimplemented and read as ‘0’.
2009 Microchip Technology Inc. DS39897C-page 239
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18.7.4 USB VBUS POWER CONTROL
REGISTER
REGISTER 18-22: U1PWMCON: USB VBUS PWM GENERATOR CONTROL REGISTER
R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
PWMEN — — — — — PWMPOL CNTEN
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PWMEN: PWM Enable bit
1 = PWM generator is enabled
0 = PWM generator is disabled; output is held in Reset state specified by PWMPOL
bit 14-10 Unimplemented: Read as ‘0’
bit 9 PWMPOL: PWM Polarity bit
1 = PWM output is active-low and resets high
0 = PWM output is active-high and resets low
bit 8 CNTEN: PWM Counter Enable bit
1 = Counter is enabled
0 = Counter is disabled
bit 7-0 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 240 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 241
PIC24FJ256GB110 FAMILY
19.0 PARALLEL MASTER PORT
(PMP)
The Parallel Master Port (PMP) module is a parallel
8-bit I/O module, specifically designed to communicate
with a wide variety of parallel devices, such as communication
peripherals, LCDs, external memory devices
and microcontrollers. Because the interface to parallel
peripherals varies significantly, the PMP is highly
configurable.
Key features of the PMP module include:
• Up to 16 Programmable Address Lines
• Up to 2 Chip Select Lines
• Programmable Strobe Options:
- Individual Read and Write Strobes or;
- Read/Write Strobe with Enable Strobe
• Address Auto-Increment/Auto-Decrement
• Programmable Address/Data Multiplexing
• Programmable Polarity on Control Signals
• Legacy Parallel Slave Port Support
• Enhanced Parallel Slave Support:
- Address Support
- 4-Byte Deep Auto-Incrementing Buffer
• Programmable Wait States
• Selectable Input Voltage Levels
FIGURE 19-1: PMP MODULE OVERVIEW
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 13. “Parallel Master Port
(PMP)” (DS39713).
PMA<0>
PMBE
PMRD
PMWR
PMD<7:0>
PMENB
PMRD/PMWR
PMCS1
PMA<1>
PMA<13:2>
PMALL
PMALH
PMA<7:0>
PMA<15:8>
EEPROM
Address Bus
Data Bus
Control Lines
PIC24F
Microcontroller LCD FIFO
8-Bit Data
Up to 16-Bit Address
Parallel Master Port
Buffer
PMA<14>
PMCS2
PMA<15>
PIC24FJ256GB110 FAMILY
DS39897C-page 242 2009 Microchip Technology Inc.
REGISTER 19-1: PMCON: PARALLEL PORT CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0(1) R/W-0(1) R/W-0 R/W-0 R/W-0
PMPEN — PSIDL ADRMUX1 ADRMUX0 PTBEEN PTWREN PTRDEN
bit 15 bit 8
R/W-0 R/W-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0 R/W-0 R/W-0
CSF1 CSF0 ALP CS2P CS1P BEP WRSP RDSP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PMPEN: Parallel Master Port Enable bit
1 = PMP enabled
0 = PMP disabled, no off-chip access performed
bit 14 Unimplemented: Read as ‘0’
bit 13 PSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-11 ADRMUX<1:0>: Address/Data Multiplexing Selection bits(1)
11 = Reserved
10 = All 16 bits of address are multiplexed on PMD<7:0> pins
01 = Lower 8 bits of address are multiplexed on PMD<7:0> pins, upper 3 bits are multiplexed on
PMA<10:8>
00 = Address and data appear on separate pins
bit 10 PTBEEN: Byte Enable Port Enable bit (16-Bit Master mode)
1 = PMBE port enabled
0 = PMBE port disabled
bit 9 PTWREN: Write Enable Strobe Port Enable bit
1 = PMWR/PMENB port enabled
0 = PMWR/PMENB port disabled
bit 8 PTRDEN: Read/Write Strobe Port Enable bit
1 = PMRD/PMWR port enabled
0 = PMRD/PMWR port disabled
bit 7-6 CSF1:CSF0: Chip Select Function bits
11 = Reserved
10 = PMCS1 and PMCS2 function as chip select
01 = PMCS2 functions as chip select, PMCS1 functions as address bit 14
00 = PMCS1 and PMCS2 function as address bits 15 and 14
bit 5 ALP: Address Latch Polarity bit(1)
1 = Active-high (PMALL and PMALH)
0 = Active-low (PMALL and PMALH)
bit 4 CS2P: Chip Select 2 Polarity bit(1)
1 = Active-high (PMCS2/PMCS2)
0 = Active-low (PMCS2/PMCS2)
bit 3 CS1P: Chip Select 1 Polarity bit(1)
1 = Active-high (PMCS1/PMCS1)
0 = Active-low (PMCS1/PMCS1)
Note 1: These bits have no effect when their corresponding pins are used as address lines.
2009 Microchip Technology Inc. DS39897C-page 243
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bit 2 BEP: Byte Enable Polarity bit
1 = Byte enable active-high (PMBE)
0 = Byte enable active-low (PMBE)
bit 1 WRSP: Write Strobe Polarity bit
For Slave modes and Master mode 2 (PMMODE<9:8> = 00,01,10):
1 = Write strobe active-high (PMWR)
0 = Write strobe active-low (PMWR)
For Master mode 1 (PMMODE<9:8> = 11):
1 = Enable strobe active-high (PMENB)
0 = Enable strobe active-low (PMENB)
bit 0 RDSP: Read Strobe Polarity bit
For Slave modes and Master mode 2 (PMMODE<9:8> = 00,01,10):
1 = Read strobe active-high (PMRD)
0 = Read strobe active-low (PMRD)
For Master mode 1 (PMMODE<9:8> = 11):
1 = Read/write strobe active-high (PMRD/PMWR)
0 = Read/write strobe active-low (PMRD/PMWR)
REGISTER 19-1: PMCON: PARALLEL PORT CONTROL REGISTER (CONTINUED)
Note 1: These bits have no effect when their corresponding pins are used as address lines.
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DS39897C-page 244 2009 Microchip Technology Inc.
REGISTER 19-2: PMMODE: PARALLEL PORT MODE REGISTER
R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BUSY IRQM1 IRQM0 INCM1 INCM0 MODE16 MODE1 MODE0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAITB1(1) WAITB0(1) WAITM3 WAITM2 WAITM1 WAITM0 WAITE1(1) WAITE0(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 BUSY: Busy bit (Master mode only)
1 = Port is busy (not useful when the processor stall is active)
0 = Port is not busy
bit 14-13 IRQM<1:0>: Interrupt Request Mode bits
11 = Interrupt generated when Read Buffer 3 is read or Write Buffer 3 is written (Buffered PSP mode)
or on a read or write operation when PMA<1:0> = 11 (Addressable PSP mode only)
10 = No interrupt generated, processor stall activated
01 = Interrupt generated at the end of the read/write cycle
00 = No interrupt generated
bit 12-11 INCM<1:0>: Increment Mode bits
11 = PSP read and write buffers auto-increment (Legacy PSP mode only)
10 = Decrement ADDR<10:0> by 1 every read/write cycle
01 = Increment ADDR<10:0> by 1 every read/write cycle
00 = No increment or decrement of address
bit 10 MODE16: 8/16-Bit Mode bit
1 = 16-bit mode: Data register is 16 bits, a read or write to the Data register invokes two 8-bit transfers
0 = 8-bit mode: Data register is 8 bits, a read or write to the Data register invokes one 8-bit transfer
bit 9-8 MODE<1:0>: Parallel Port Mode Select bits
11 = Master mode 1 (PMCS1, PMRD/PMWR, PMENB, PMBE, PMA and PMD<7:0>)
10 = Master mode 2 (PMCS1, PMRD, PMWR, PMBE, PMA and PMD<7:0>)
01 = Enhanced PSP, control signals (PMRD, PMWR, PMCS1, PMD<7:0> and PMA<1:0>)
00 = Legacy Parallel Slave Port, control signals (PMRD, PMWR, PMCS1 and PMD<7:0>)
bit 7-6 WAITB<1:0>: Data Setup to Read/Write Wait State Configuration bits(1)
11 = Data wait of 4 TCY; multiplexed address phase of 4 TCY
10 = Data wait of 3 TCY; multiplexed address phase of 3 TCY
01 = Data wait of 2 TCY; multiplexed address phase of 2 TCY
00 = Data wait of 1 TCY; multiplexed address phase of 1 TCY
bit 5-2 WAITM<3:0>: Read to Byte Enable Strobe Wait State Configuration bits
1111 = Wait of additional 15 TCY
...
0001 = Wait of additional 1 TCY
0000 = No additional wait cycles (operation forced into one TCY)(2)
bit 1-0 WAITE<1:0>: Data Hold After Strobe Wait State Configuration bits(1)
11 = Wait of 4 TCY
10 = Wait of 3 TCY
01 = Wait of 2 TCY
00 = Wait of 1 TCY
Note 1: The WAITB and WAITE bits are ignored whenever WAITM<3:0> = 0000.
2: A single-cycle delay is required between consecutive read and/or write operations.
2009 Microchip Technology Inc. DS39897C-page 245
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REGISTER 19-3: PMADDR: PARALLEL PORT ADDRESS REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CS2 CS1 ADDR<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADDR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CS2: Chip Select 2 bit
1 = Chip select 2 is active
0 = Chip select 2 is inactive
bit 14 CS1: Chip Select 1 bit
1 = Chip select 1 is active
0 = Chip select 1 is inactive
bit 13-0 ADDR<13:0>: Parallel Port Destination Address bits
REGISTER 19-4: PMAEN: PARALLEL PORT ENABLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PTEN15 PTEN14 PTEN13 PTEN12 PTEN11 PTEN10 PTEN9 PTEN8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PTEN7 PTEN6 PTEN5 PTEN4 PTEN3 PTEN2 PTEN1 PTEN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 PTEN<15:14>: PMCSx Strobe Enable bit
1 = PMA15 and PMA14 function as either PMA<15:14> or PMCS2 and PMCS1
0 = PMA15 and PMA14 function as port I/O
bit 13-2 PTEN<13:2>: PMP Address Port Enable bits
1 = PMA<13:2> function as PMP address lines
0 = PMA<13:2> function as port I/O
bit 1-0 PTEN<1:0>: PMALH/PMALL Strobe Enable bits
1 = PMA1 and PMA0 function as either PMA<1:0> or PMALH and PMALL
0 = PMA1 and PMA0 pads functions as port I/O
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DS39897C-page 246 2009 Microchip Technology Inc.
REGISTER 19-5: PMSTAT: PARALLEL PORT STATUS REGISTER
R-0 R/W-0, HS U-0 U-0 R-0 R-0 R-0 R-0
IBF IBOV — — IB3F IB2F IB1F IB0F
bit 15 bit 8
R-1 R/W-0, HS U-0 U-0 R-1 R-1 R-1 R-1
OBE OBUF — — OB3E OB2E OB1E OB0E
bit 7 bit 0
Legend: HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IBF: Input Buffer Full Status bit
1 = All writable input buffer registers are full
0 = Some or all of the writable input buffer registers are empty
bit 14 IBOV: Input Buffer Overflow Status bit
1 = A write attempt to a full input byte register occurred (must be cleared in software)
0 = No overflow occurred
bit 13-12 Unimplemented: Read as ‘0’
bit 11-8 IB3F:IB0F Input Buffer x Status Full bits
1 = Input buffer contains data that has not been read (reading buffer will clear this bit)
0 = Input buffer does not contain any unread data
bit 7 OBE: Output Buffer Empty Status bit
1 = All readable output buffer registers are empty
0 = Some or all of the readable output buffer registers are full
bit 6 OBUF: Output Buffer Underflow Status bits
1 = A read occurred from an empty output byte register (must be cleared in software)
0 = No underflow occurred
bit 5-4 Unimplemented: Read as ‘0’
bit 3-0 OB3E:OB0E Output Buffer x Status Empty bit
1 = Output buffer is empty (writing data to the buffer will clear this bit)
0 = Output buffer contains data that has not been transmitted
2009 Microchip Technology Inc. DS39897C-page 247
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REGISTER 19-6: PADCFG1: PAD CONFIGURATION CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — RTSECSEL(1) PMPTTL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 Unimplemented: Read as ‘0’
bit 1 RTSECSEL: RTCC Seconds Clock Output Select bit(1)
1 = RTCC seconds clock is selected for the RTCC pin
0 = RTCC alarm pulse is selected for the RTCC pin
bit 0 PMPTTL: PMP Module TTL Input Buffer Select bit
1 = PMP module inputs (PMDx, PMCS1) use TTL input buffers
0 = PMP module inputs use Schmitt Trigger input buffers
Note 1: To enable the actual RTCC output, the RTCOE (RCFGCAL<10>)) bit must also be set.
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DS39897C-page 248 2009 Microchip Technology Inc.
FIGURE 19-2: LEGACY PARALLEL SLAVE PORT EXAMPLE
FIGURE 19-3: ADDRESSABLE PARALLEL SLAVE PORT EXAMPLE
TABLE 19-1: SLAVE MODE ADDRESS RESOLUTION
FIGURE 19-4: MASTER MODE, DEMULTIPLEXED ADDRESSING (SEPARATE READ AND
WRITE STROBES, TWO CHIP SELECTS)
PMA<1:0> Output Register (Buffer) Input Register (Buffer)
00 PMDOUT1<7:0> (0) PMDIN1<7:0> (0)
01 PMDOUT1<15:8> (1) PMDIN1<15:8> (1)
10 PMDOUT2<7:0> (2) PMDIN2<7:0> (2)
11 PMDOUT2<15:8> (3) PMDIN2<15:8> (3)
PMD<7:0>
PMRD
PMWR
Master Address Bus
Data Bus
Control Lines
PMCS1
PMD<7:0>
PMRD
PMWR
PIC24F Slave
PMCS1
PMD<7:0>
PMRD
PMWR
Master
PMCS1
PMA<1:0>
Address Bus
Data Bus
Control Lines
PMRD
PMWR
PIC24F Slave
PMCS1
PMDOUT1L (0)
PMDOUT1H (1)
PMDOUT2L (2)
PMDOUT2H (3)
PMDIN1L (0)
PMDIN1H (1)
PMDIN2L (2)
PMDIN2H (3)
PMD<7:0> Write
Address
Decode
Read
Address
Decode
PMA<1:0>
PMRD
PMWR
PMD<7:0>
PMCS1
PIC24F PMA<13:0>
Address Bus
Data Bus
Control Lines
PMCS2
2009 Microchip Technology Inc. DS39897C-page 249
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FIGURE 19-5: MASTER MODE, PARTIALLY MULTIPLEXED ADDRESSING (SEPARATE READ
AND WRITE STROBES, TWO CHIP SELECTS)
FIGURE 19-6: MASTER MODE, FULLY MULTIPLEXED ADDRESSING (SEPARATE READ AND
WRITE STROBES, TWO CHIP SELECTS)
FIGURE 19-7: EXAMPLE OF A MULTIPLEXED ADDRESSING APPLICATION
FIGURE 19-8: EXAMPLE OF A PARTIALLY MULTIPLEXED ADDRESSING APPLICATION
PMRD
PMWR
PMD<7:0>
PMCS1
PMA<13:8>
PMALL
PMA<7:0>
PIC24F
Address Bus
Multiplexed
Data and
Address Bus
Control Lines
PMCS2
PMRD
PMWR
PMD<7:0>
PMCS1
PMALH
PIC24F PMA<13:8>
Multiplexed
Data and
Address Bus
Control Lines
PMALL
PMCS2
PMD<7:0>
PMALH
D<7:0>
373 A<15:0>
D<7:0>
A<7:0>
373
PMRD
PMWR
OE WR
CE
PIC24F
Address Bus
Data Bus
Control Lines
PMCS1
PMALL
A<15:8>
PMA<10:8>
D<7:0>
373 A<10:0>
D<7:0>
A<7:0>
PMRD
PMWR
OE WR
CE
PIC24F
Address Bus
Data Bus
Control Lines
PMCS1
PMALL
A<10:8>
PMD<7:0>
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DS39897C-page 250 2009 Microchip Technology Inc.
FIGURE 19-9: EXAMPLE OF AN 8-BIT MULTIPLEXED ADDRESS AND DATA APPLICATION
FIGURE 19-10: PARALLEL EEPROM EXAMPLE (UP TO 15-BIT ADDRESS, 8-BIT DATA)
FIGURE 19-11: PARALLEL EEPROM EXAMPLE (UP TO 15-BIT ADDRESS, 16-BIT DATA)
FIGURE 19-12: LCD CONTROL EXAMPLE (BYTE MODE OPERATION)
ALE
PMRD
PMWR
RD
WR
CS
PIC24F
Address Bus
Data Bus
Control Lines
PMCS1
PMALL
AD<7:0>
Parallel Peripheral
PMD<7:0>
PMA A
D<7:0>
PMRD
PMWR
OE
WR
CE
PIC24F
Address Bus
Data Bus
Control Lines
PMCS1
PMD<7:0>
Parallel EEPROM
PMA A
D<7:0>
PMRD
PMWR
OE
WR
CE
PIC24F
Address Bus
Data Bus
Control Lines
PMCS1
PMD<7:0>
Parallel EEPROM
PMBE A0
PMRD/PMWR
D<7:0>
PIC24F
Address Bus
Data Bus
Control Lines
PMA0
R/W
RS
E
LCD Controller
PMCS1
PM<7:0>
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20.0 REAL-TIME CLOCK AND
CALENDAR (RTCC)
The Real-Time Clock and Calendar (RTCC) provides
on-chip, hardware-based clock and calendar functionality
with little or no CPU overhead. It is intended for
applications where accurate time must be maintained
for extended periods with minimal CPU activity and
with limited power resources, such as battery-powered
applications.
Key features include:
• Time data in hours, minutes and seconds, with a
granularity of one-half second
• 24-hour format (Military Time) display option
• Calendar data as date, month and year
• Automatic, hardware-based day of the week and
leap year calculations for dates from 2000
through 2099
• Time and calendar data in BCD format for
_compact firmware
• Highly configurable alarm function
• External output pin with selectable alarm signal or
seconds “tick” signal output
• User calibration feature with auto-adjust
A simplified block diagram of the module is shown in
Figure 20-1. The SOSC and RTCC will both remain
running while the device is held in Reset with MCLR
and will continue running after MCLR is released.
FIGURE 20-1: RTCC BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 29. “Real-Time Clock and
Calendar (RTCC)” (DS39696).
RTCC Prescalers
RTCC Timer
Comparator
Compare Registers
Repeat Counter
YEAR
MTHDY
WKDYHR
MINSEC
ALMTHDY
ALWDHR
ALMINSEC
with Masks
RTCC Interrupt Logic
RCFGCAL
ALCFGRPT
Alarm
Event
32.768 kHz Input
from SOSC Oscillator
0.5s
RTCC Clock Domain
Alarm Pulse
RTCC Interrupt
CPU Clock Domain
RTCVAL
ALRMVAL
RTCC Pin
RTCOE
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20.1 RTCC Module Registers
The RTCC module registers are organized into three
categories:
• RTCC Control Registers
• RTCC Value Registers
• Alarm Value Registers
20.1.1 REGISTER MAPPING
To limit the register interface, the RTCC Timer and
Alarm Time registers are accessed through
corresponding register pointers. The RTCC Value register
window (RTCVALH and RTCVALL) uses the
RTCPTR bits (RCFGCAL<9:8>) to select the desired
Timer register pair (see Table 20-1).
By writing the RTCVALH byte, the RTCC Pointer value,
RTCPTR<1:0> bits, decrement by one until they reach
‘00’. Once they reach ‘00’, the MINUTES and
SECONDS value will be accessible through RTCVALH
and RTCVALL until the pointer value is manually
changed.
TABLE 20-1: RTCVAL REGISTER MAPPING
The Alarm Value register window (ALRMVALH and
ALRMVALL) uses the ALRMPTR bits
(ALCFGRPT<9:8>) to select the desired Alarm register
pair (see Table 20-2).
By writing the ALRMVALH byte, the Alarm Pointer
value, ALRMPTR<1:0> bits, decrement by one until
they reach ‘00’. Once they reach ‘00’, the ALRMMIN
and ALRMSEC value will be accessible through
ALRMVALH and ALRMVALL until the pointer value is
manually changed.
TABLE 20-2: ALRMVAL REGISTER
MAPPING
Considering that the 16-bit core does not distinguish
between 8-bit and 16-bit read operations, the user must
be aware that when reading either the ALRMVALH or
ALRMVALL bytes will decrement the ALRMPTR<1:0>
value. The same applies to the RTCVALH or RTCVALL
bytes with the RTCPTR<1:0> being decremented.
20.1.2 WRITE LOCK
In order to perform a write to any of the RTCC Timer
registers, the RTCWREN bit (RCFGCAL<13>) must be
set (refer to Example 20-1).
EXAMPLE 20-1: SETTING THE RTCWREN BIT
RTCPTR
<1:0>
RTCC Value Register Window
RTCVAL<15:8> RTCVAL<7:0>
00 MINUTES SECONDS
01 WEEKDAY HOURS
10 MONTH DAY
11 — YEAR
ALRMPTR
<1:0>
Alarm Value Register Window
ALRMVAL<15:8> ALRMVAL<7:0>
00 ALRMMIN ALRMSEC
01 ALRMWD ALRMHR
10 ALRMMNTH ALRMDAY
11 — —
Note: This only applies to read operations and
not write operations.
Note: To avoid accidental writes to the timer, it is
recommended that the RTCWREN bit
(RCFGCAL<13>) is kept clear at any
other time. For the RTCWREN bit to be
set, there is only 1 instruction cycle time
window allowed between the unlock
sequence and the setting of RTCWREN;
therefore, it is recommended that code
follow the procedure in Example 20-1.
For applications written in C, the unlock
sequence should be implemented using
in-line assembly.
__builtin_write_RTCWEN(); //set the RTCWREN bit
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20.1.3 RTCC CONTROL REGISTERS
REGISTER 20-1: RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1)
R/W-0 U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0
RTCEN(2) — RTCWREN RTCSYNC HALFSEC(3) RTCOE RTCPTR1 RTCPTR0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 RTCEN: RTCC Enable bit(2)
1 = RTCC module is enabled
0 = RTCC module is disabled
bit 14 Unimplemented: Read as ‘0’
bit 13 RTCWREN: RTCC Value Registers Write Enable bit
1 = RTCVALH and RTCVALL registers can be written to by the user
0 = RTCVALH and RTCVALL registers are locked out from being written to by the user
bit 12 RTCSYNC: RTCC Value Registers Read Synchronization bit
1 = RTCVALH, RTCVALL and ALCFGRPT registers can change while reading due to a rollover ripple
resulting in an invalid data read. If the register is read twice and results in the same data, the data
can be assumed to be valid.
0 = RTCVALH, RTCVALL or ALCFGRPT registers can be read without concern over a rollover ripple
bit 11 HALFSEC: Half-Second Status bit(3)
1 = Second half period of a second
0 = First half period of a second
bit 10 RTCOE: RTCC Output Enable bit
1 = RTCC output enabled
0 = RTCC output disabled
bit 9-8 RTCPTR<1:0>: RTCC Value Register Window Pointer bits
Points to the corresponding RTCC Value registers when reading RTCVALH and RTCVALL registers;
the RTCPTR<1:0> value decrements on every read or write of RTCVALH until it reaches ‘00’.
RTCVAL<15:8>:
00 = MINUTES
01 = WEEKDAY
10 = MONTH
11 = Reserved
RTCVAL<7:0>:
00 = SECONDS
01 = HOURS
10 = DAY
11 = YEAR
Note 1: The RCFGCAL register is only affected by a POR.
2: A write to the RTCEN bit is only allowed when RTCWREN = 1.
3: This bit is read-only. It is cleared to ‘0’ on a write to the lower half of the MINSEC register.
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bit 7-0 CAL<7:0>: RTC Drift Calibration bits
01111111 = Maximum positive adjustment; adds 508 RTC clock pulses every one minute
...
00000001 = Minimum positive adjustment; adds 4 RTC clock pulses every one minute
00000000 = No adjustment
11111111 = Minimum negative adjustment; subtracts 4 RTC clock pulses every one minute
...
10000000 = Maximum negative adjustment; subtracts 512 RTC clock pulses every one minute
REGISTER 20-1: RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1) (CONTINUED)
Note 1: The RCFGCAL register is only affected by a POR.
2: A write to the RTCEN bit is only allowed when RTCWREN = 1.
3: This bit is read-only. It is cleared to ‘0’ on a write to the lower half of the MINSEC register.
REGISTER 20-2: PADCFG1: PAD CONFIGURATION CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — RTSECSEL(1) PMPTTL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 Unimplemented: Read as ‘0’
bit 1 RTSECSEL: RTCC Seconds Clock Output Select bit(1)
1 = RTCC seconds clock is selected for the RTCC pin
0 = RTCC alarm pulse is selected for the RTCC pin
bit 0 PMPTTL: PMP Module TTL Input Buffer Select bit
1 = PMP module inputs (PMDx, PMCS1) use TTL input buffers
0 = PMP module inputs use Schmitt Trigger input buffers
Note 1: To enable the actual RTCC output, the RTCOE (RCFGCAL<10>)) bit must also be set.
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REGISTER 20-3: ALCFGRPT: ALARM CONFIGURATION REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ALRMEN: Alarm Enable bit
1 = Alarm is enabled (cleared automatically after an alarm event whenever ARPT<7:0> = 00h and
CHIME = 0)
0 = Alarm is disabled
bit 14 CHIME: Chime Enable bit
1 = Chime is enabled; ARPT<7:0> bits are allowed to roll over from 00h to FFh
0 = Chime is disabled; ARPT<7:0> bits stop once they reach 00h
bit 13-10 AMASK<3:0>: Alarm Mask Configuration bits
0000 = Every half second
0001 = Every second
0010 = Every 10 seconds
0011 = Every minute
0100 = Every 10 minutes
0101 = Every hour
0110 = Once a day
0111 = Once a week
1000 = Once a month
1001 = Once a year (except when configured for February 29th, once every 4 years)
101x = Reserved – do not use
11xx = Reserved – do not use
bit 9-8 ALRMPTR<1:0>: Alarm Value Register Window Pointer bits
Points to the corresponding Alarm Value registers when reading ALRMVALH and ALRMVALL registers;
the ALRMPTR<1:0> value decrements on every read or write of ALRMVALH until it reaches ‘00’.
ALRMVAL<15:8>:
00 = ALRMMIN
01 = ALRMWD
10 = ALRMMNTH
11 = Unimplemented
ALRMVAL<7:0>:
00 = ALRMSEC
01 = ALRMHR
10 = ALRMDAY
11 = Unimplemented
bit 7-0 ARPT<7:0>: Alarm Repeat Counter Value bits
11111111 = Alarm will repeat 255 more times
...
00000000 = Alarm will not repeat
The counter decrements on any alarm event. The counter is prevented from rolling over from 00h to
FFh unless CHIME = 1.
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20.1.4 RTCVAL REGISTER MAPPINGS
REGISTER 20-4: YEAR: YEAR VALUE REGISTER(1)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
YRTEN3 YRTEN2 YRTEN1 YRTEN0 YRONE3 YRONE2 YRONE1 YRONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-4 YRTEN<3:0>: Binary Coded Decimal Value of Year’s Tens Digit bits
Contains a value from 0 to 9.
bit 3-0 YRONE<3:0>: Binary Coded Decimal Value of Year’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to the YEAR register is only allowed when RTCWREN = 1.
REGISTER 20-5: MTHDY: MONTH AND DAY VALUE REGISTER(1)
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
— — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 15 bit 8
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— — DAYTEN1 DAYTEN0 DAYONE3 DAYONE2 DAYONE1 DAYONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0’
bit 12 MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bit
Contains a value of 0 or 1.
bit 11-8 MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits
Contains a value from 0 to 9.
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits
Contains a value from 0 to 3.
bit 3-0 DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
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REGISTER 20-6: WKDYHR: WEEKDAY AND HOURS VALUE REGISTER(1)
U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x
— — — — — WDAY2 WDAY1 WDAY0
bit 15 bit 8
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— — HRTEN1 HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits
Contains a value from 0 to 6.
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 20-7: MINSEC: MINUTES AND SECONDS VALUE REGISTER
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 15 bit 8
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits
Contains a value from 0 to 5.
bit 11-8 MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits
Contains a value from 0 to 9.
bit 7 Unimplemented: Read as ‘0’
bit 6-4 SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0 SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits
Contains a value from 0 to 9.
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20.1.5 ALRMVAL REGISTER MAPPINGS
REGISTER 20-8: ALMTHDY: ALARM MONTH AND DAY VALUE REGISTER(1)
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
— — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0
bit 15 bit 8
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— — DAYTEN1 DAYTEN0 DAYONE3 DAYONE2 DAYONE1 DAYONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0’
bit 12 MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bit
Contains a value of 0 or 1.
bit 11-8 MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits
Contains a value from 0 to 9.
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits
Contains a value from 0 to 3.
bit 3-0 DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
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REGISTER 20-9: ALWDHR: ALARM WEEKDAY AND HOURS VALUE REGISTER(1)
U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x
— — — — — WDAY2 WDAY1 WDAY0
bit 15 bit 8
U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— — HRTEN1 HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits
Contains a value from 0 to 6.
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits
Contains a value from 0 to 2.
bit 3-0 HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits
Contains a value from 0 to 9.
Note 1: A write to this register is only allowed when RTCWREN = 1.
REGISTER 20-10: ALMINSEC: ALARM MINUTES AND SECONDS VALUE REGISTER
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0
bit 15 bit 8
U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits
Contains a value from 0 to 5.
bit 11-8 MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits
Contains a value from 0 to 9.
bit 7 Unimplemented: Read as ‘0’
bit 6-4 SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0 SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits
Contains a value from 0 to 9.
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20.2 Calibration
The real-time crystal input can be calibrated using the
periodic auto-adjust feature. When properly calibrated,
the RTCC can provide an error of less than 3 seconds
per month. This is accomplished by finding the number
of error clock pulses for one minute and storing the
value into the lower half of the RCFGCAL register. The
8-bit signed value loaded into the lower half of
RCFGCAL is multiplied by four and will either be added
or subtracted from the RTCC timer, once every minute.
Refer to the steps below for RTCC calibration:
1. Using another timer resource on the device, the
user must find the error of the 32.768 kHz
crystal.
2. Once the error is known, it must be converted to
the number of error clock pulses per minute and
loaded into the RCFGCAL register.
EQUATION 20-1: RTCC CALIBRATION
3. a) If the oscillator is faster then ideal (negative
result form step 2), the RCFGCAL register value
needs to be negative. This causes the specified
number of clock pulses to be substract from the
timer counter once every minute.
b) If the oscillator is slower then ideal (positive
result from step 2) the RCFGCAL register value
needs to be positive. This causes the specified
number of clock pulses to be added to the timer
counter once every minute.
4. Divide the number of error clocks per minute by
4 to get the correct CAL value and load the
RCFGCAL register with the correct value.
(Each 1-bit increment in CAL adds or subtracts
4 pulses).
Writes to the lower half of the RCFGCAL register
should only occur when the timer is turned off, or
immediately after the rising edge of the seconds pulse.
20.3 Alarm
• Configurable from half second to one year
• Enabled using the ALRMEN bit
(ALCFGRPT<15>, Register 20-3)
• One-time alarm and repeat alarm options
available
20.3.1 CONFIGURING THE ALARM
The alarm feature is enabled using the ALRMEN bit.
This bit is cleared when an alarm is issued. Writes to
ALRMVAL should only take place when ALRMEN = 0.
As shown in Figure 20-2, the interval selection of the
alarm is configured through the AMASK bits
(ALCFGRPT<13:10>). These bits determine which and
how many digits of the alarm must match the clock
value for the alarm to occur.
The alarm can also be configured to repeat based on a
preconfigured interval. The amount of times this occurs
once the alarm is enabled is stored in the ARPT bits,
ARPT<7:0> (ALCFGRPT<7:0>). When the value of the
ARPT bits equals 00h and the CHIME bit
(ALCFGRPT<14>) is cleared, the repeat function is
disabled and only a single alarm will occur. The alarm
can be repeated up to 255 times by loading
ARPT<7:0> with FFh.
After each alarm is issued, the value of the ARPT bits
is decremented by one. Once the value has reached
00h, the alarm will be issued one last time, after which
the ALRMEN bit will be cleared automatically and the
alarm will turn off.
Indefinite repetition of the alarm can occur if the CHIME
bit = 1. Instead of the alarm being disabled when the
value of the ARPT bits reaches 00h, it rolls over to FFh
and continues counting indefinitely while CHIME is set.
20.3.2 ALARM INTERRUPT
At every alarm event, an interrupt is generated. In addition,
an alarm pulse output is provided that operates at
half the frequency of the alarm. This output is
completely synchronous to the RTCC clock and can be
used as a trigger clock to other peripherals.
Error (clocks per minute) =(Ideal Frequency† –
Measured Frequency) * 60
† Ideal frequency = 32,768 Hz
Note: It is up to the user to include, in the error
value, the initial error of the crystal, drift
due to temperature and drift due to crystal
aging.
Note: Changing any of the registers, other then
the RCFGCAL and ALCFGRPT registers
and the CHIME bit while the alarm is
enabled (ALRMEN = 1), can result in a
false alarm event leading to a false alarm
interrupt. To avoid a false alarm event, the
timer and alarm values should only be
changed while the alarm is disabled
(ALRMEN = 0). It is recommended that the
ALCFGRPT register and CHIME bit be
changed when RTCSYNC = 0.
2009 Microchip Technology Inc. DS39897C-page 261
PIC24FJ256GB110 FAMILY
FIGURE 20-2: ALARM MASK SETTINGS
Note 1: Annually, except when configured for February 29.
s
s s
m s s
m m s s
h h m m s s
d hh m m s s
d d h h m m s s
m m d d h h m m s s
Day of
the
Week Month Day Hours Minutes Seconds
Alarm Mask Setting
(AMASK<3:0>)
0000 – Every half second
0001 – Every second
0010 – Every 10 seconds
0011 – Every minute
0100 – Every 10 minutes
0101 – Every hour
0110 – Every day
0111 – Every week
1000 – Every month
1001 – Every year(1)
PIC24FJ256GB110 FAMILY
DS39897C-page 262 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 263
PIC24FJ256GB110 FAMILY
21.0 PROGRAMMABLE CYCLIC
REDUNDANCY CHECK (CRC)
GENERATOR
The programmable CRC generator offers the following
features:
• User-programmable polynomial CRC equation
• Interrupt output
• Data FIFO
The module implements a software configurable CRC
generator. The terms of the polynomial and its length
can be programmed using the X<15:1> bits
(CRCXOR<15:1>) and the PLEN<3:0> bits
(CRCCON<3:0>), respectively.
Consider the CRC equation:
x16 + x12 + x5 + 1
To program this polynomial into the CRC generator,
the CRC register bits should be set as shown in
Table 21-1.
TABLE 21-1: EXAMPLE CRC SETUP
Note that for the value of X<15:1>, the 12th bit and the
5th bit are set to ‘1’, as required by the equation. The
0 bit required by the equation is always XORed. For a
16-bit polynomial, the 16th bit is also always assumed
to be XORed; therefore, the X<15:1> bits do not have
the 0 bit or the 16th bit.
A simplified block diagram of the module is shown in
Figure 21-1. The general topology of the shift engine is
shown in Figure 21-2.
FIGURE 21-1: CRC BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 30. “Programmable Cyclic
Redundancy Check (CRC)” (DS39714).
Bit Name Bit Value
PLEN<3:0> 1111
X<15:1> 000100000010000
Variable FIFO
(8x16 or 16x8)
CRCDAT
CRC Shift Engine
CRCWDAT
FIFO Empty Event
Set CRCIF
Shift Clock (2FCY)
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DS39897C-page 264 2009 Microchip Technology Inc.
FIGURE 21-2: CRC SHIFT ENGINE DETAIL
21.1 User Interface
21.1.1 DATA INTERFACE
To start serial shifting, a ‘1’ must be written to the
CRCGO bit.
The module incorporates a FIFO that is 8 deep when
PLEN (CRCCON<3:0>) > 7, and 16 deep, otherwise.
The data for which the CRC is to be calculated must
first be written into the FIFO. The smallest data element
that can be written into the FIFO is one byte. For
example, if PLEN = 5, then the size of the data is
PLEN + 1 = 6. When loading data, the two MSbs of the
data byte are ignored.
Once data is written into the CRCWDAT MSb (as
defined by PLEN), the value of VWORD
(CRCCON<12:8>) increments by one. When
CRCGO = 1 and VWORD > 0, a word of data to be
shifted is moved from the FIFO into the shift engine.
When the data word moves from the FIFO to the shift
engine, VWORD decrements by one. The serial shifter
continues to receive data from the FIFO, shifting until
the VWORD reaches 0. The last bit of data will be
shifted through the CRC module (PLEN + 1)/2 clock
cycles after VWORD reaches 0. This is when the
module is completed with the CRC calculation.
Therefore, for a given value of PLEN, it will take
(PLEN + 1)/2 * VWORD number of clock cycles to
complete the CRC calculations.
When VWORD reaches 8 (or 16), the CRCFUL bit will
be set. When VWORD reaches 0, the CRCMPT bit will
be set.
To continually feed data into the CRC engine, the recommended
mode of operation is to initially “prime” the
FIFO with a sufficient number of words so no interrupt
is generated before the next word can be written. Once
that is done, start the CRC by setting the CRCGO bit to
‘1’. From that point onward, the VWORD bits should be
polled. If they read less than 8 or 16, another word can
be written into the FIFO.
To empty words already written into a FIFO, the
CRCGO bit must be set to ‘1’ and the CRC shifter
allowed to run until the CRCMPT bit is set.
Also, to get the correct CRC reading, it will be
necessary to wait for the CRCMPT bit to go high before
reading the CRCWDAT register.
If a word is written when the CRCFUL bit is set, the
VWORD Pointer will roll over to 0. The hardware will
then behave as if the FIFO is empty. However, the condition
to generate an interrupt will not be met; therefore,
no interrupt will be generated (See Section 21.1.2
“Interrupt Operation”).
At least one instruction cycle must pass after a write to
CRCWDAT before a read of the VWORD bits is done.
21.1.2 INTERRUPT OPERATION
When the VWORD<4:0> bits make a transition from a
value of ‘1’ to ‘0’, an interrupt will be generated. Note
that the CRC calculation is not complete at this point;
an additional time of (PLEN + 1)/2 clock cycles is
required before the output can be read.
21.2 Operation in Power-Saving Modes
21.2.1 SLEEP MODE
If Sleep mode is entered while the module is operating,
the module will be suspended in its current state until
clock execution resumes.
21.2.2 IDLE MODE
To continue full module operation in Idle mode, the
CSIDL bit must be cleared prior to entry into the mode.
If CSIDL = 1, the module will behave the same way as
it does in Sleep mode; pending interrupt events will be
passed on, even though the module clocks are not
available.
CRCWDAT
Bit 0 Bit 1 Bit n(2)
X(1)(1)
Read/Write Bus
Shift Buffer
Data Bit 2
X(2)(1) X(n)(1)
Note 1: Each XOR stage of the shift engine is programmable. See text for details.
2: Polynomial length n is determined by ([PLEN<3:0>] + 1)
2009 Microchip Technology Inc. DS39897C-page 265
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21.3 Registers
There are four registers used to control programmable
CRC operation:
• CRCCON
• CRCXOR
• CRCDAT
• CRCWDAT
REGISTER 21-1: CRCCON: CRC CONTROL REGISTER
U-0 U-0 R/W-0 R-0 R-0 R-0 R-0 R-0
— — CSIDL VWORD4 VWORD3 VWORD2 VWORD1 VWORD0
bit 15 bit 8
R-0 R-1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CRCFUL CRCMPT — CRCGO PLEN3 PLEN2 PLEN1 PLEN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13 CSIDL: CRC Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-8 VWORD<4:0>: Pointer Value bits
Indicates the number of valid words in the FIFO. Has a maximum value of 8 when PLEN<3:0> > 7,
or 16 when PLEN<3:0> 7.
bit 7 CRCFUL: FIFO Full bit
1 = FIFO is full
0 = FIFO is not full
bit 6 CRCMPT: FIFO Empty Bit
1 = FIFO is empty
0 = FIFO is not empty
bit 5 Unimplemented: Read as ‘0’
bit 4 CRCGO: Start CRC bit
1 = Start CRC serial shifter
0 = CRC serial shifter turned off
bit 3-0 PLEN<3:0>: Polynomial Length bits
Denotes the length of the polynomial to be generated minus 1.
PIC24FJ256GB110 FAMILY
DS39897C-page 266 2009 Microchip Technology Inc.
REGISTER 21-2: CRCXOR: CRC XOR POLYNOMIAL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
X15 X14 X13 X12 X11 X10 X9 X8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
X7 X6 X5 X4 X3 X2 X1 —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-1 X<15:1>: XOR of Polynomial Term Xn Enable bits
bit 0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 267
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22.0 10-BIT HIGH-SPEED A/D
CONVERTER
The 10-bit A/D Converter has the following key
features:
• Successive Approximation (SAR) conversion
• Conversion speeds of up to 500 ksps
• 16 analog input pins
• External voltage reference input pins
• Internal band gap reference inputs
• Automatic Channel Scan mode
• Selectable conversion trigger source
• 16-word conversion result buffer
• Selectable Buffer Fill modes
• Four result alignment options
• Operation during CPU Sleep and Idle modes
On all PIC24FJ256GB110 family devices, the 10-bit
A/D Converter has 16 analog input pins, designated
AN0 through AN15. In addition, there are two analog
input pins for external voltage reference connections
(VREF+ and VREF-). These voltage reference inputs
may be shared with other analog input pins.
A block diagram of the A/D Converter is shown in
Figure 22-1.
To perform an A/D conversion:
1. Configure the A/D module:
a) Configure port pins as analog inputs and/or
select band gap reference inputs
(AD1PCFGL<15:0> and AD1PCFGH<1:0>).
b) Select voltage reference source to match
expected range on analog inputs
(AD1CON2<15:13>).
c) Select the analog conversion clock to
match desired data rate with processor
clock (AD1CON3<7:0>).
d) Select the appropriate sample/conversion
sequence (AD1CON1<7:5> and
AD1CON3<12:8>).
e) Select how conversion results are
presented in the buffer (AD1CON1<9:8>).
f) Select interrupt rate (AD1CON2<5:2>).
g) Turn on A/D module (AD1CON1<15>).
2. Configure A/D interrupt (if required):
a) Clear the AD1IF bit.
b) Select A/D interrupt priority.
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
Section 17. “10-Bit A/D Converter”
(DS39705).
PIC24FJ256GB110 FAMILY
DS39897C-page 268 2009 Microchip Technology Inc.
FIGURE 22-1: 10-BIT HIGH-SPEED A/D CONVERTER BLOCK DIAGRAM
Comparator
10-Bit SAR Conversion Logic
VREF+
DAC
AN12
AN13
AN14
AN15
AN8
AN9
AN10
AN11
AN4
AN5
AN6
AN7
AN0
AN1
AN2
AN3
VREFSample
Control
S/H
AVSS
AVDD
ADC1BUF0:
ADC1BUFF
AD1CON1
AD1CON2
AD1CON3
AD1CHS
AD1PCFGL
AD1PCFGH
Control Logic
Data Formatting
Input MUX Control
Conversion Control
Pin Config Control
Internal Data Bus
16
VR- VR+
MUX B MUX A
VINH
VINL
VINH
VINH
VINL
VINL
VR+
VRVR
Select
VBG
VBG/2
AD1CSSL
2009 Microchip Technology Inc. DS39897C-page 269
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REGISTER 22-1: AD1CON1: A/D CONTROL REGISTER 1
R/W-0 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0
ADON(1) — ADSIDL — — — FORM1 FORM0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0, HCS R/W-0, HCS
SSRC2 SSRC1 SSRC0 — — ASAM SAMP DONE
bit 7 bit 0
Legend: HCS = Hardware Clearable/Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ADON: A/D Operating Mode bit(1)
1 = A/D Converter module is operating
0 = A/D Converter is off
bit 14 Unimplemented: Read as ‘0’
bit 13 ADSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-10 Unimplemented: Read as ‘0’
bit 9-8 FORM<1:0>: Data Output Format bits
11 = Signed fractional (sddd dddd dd00 0000)
10 = Fractional (dddd dddd dd00 0000)
01 = Signed integer (ssss sssd dddd dddd)
00 = Integer (0000 00dd dddd dddd)
bit 7-5 SSRC<2:0>: Conversion Trigger Source Select bits
111 = Internal counter ends sampling and starts conversion (auto-convert)
110 = CTMU event ends sampling and starts conversion
101 = Reserved
100 = Timer5 compare ends sampling and starts conversion
011 = Reserved
010 = Timer3 compare ends sampling and starts conversion
001 = Active transition on INT0 pin ends sampling and starts conversion
000 = Clearing SAMP bit ends sampling and starts conversion
bit 4-3 Unimplemented: Read as ‘0’
bit 2 ASAM: A/D Sample Auto-Start bit
1 = Sampling begins immediately after last conversion completes. SAMP bit is auto-set.
0 = Sampling begins when SAMP bit is set
bit 1 SAMP: A/D Sample Enable bit
1 = A/D sample/hold amplifier is sampling input
0 = A/D sample/hold amplifier is holding
bit 0 DONE: A/D Conversion Status bit
1 = A/D conversion is done
0 = A/D conversion is NOT done
Note 1: Values of ADC1BUFx registers will not retain their values once the ADON bit is cleared. Read out the
conversion values from the buffer before disabling the module.
PIC24FJ256GB110 FAMILY
DS39897C-page 270 2009 Microchip Technology Inc.
REGISTER 22-2: AD1CON2: A/D CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 r-0 U-0 R/W-0 U-0 U-0
VCFG2 VCFG1 VCFG0 r — CSCNA — —
bit 15 bit 8
R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BUFS — SMPI3 SMPI2 SMPI1 SMPI0 BUFM ALTS
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit r = Reserved bit’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 VCFG<2:0>: Voltage Reference Configuration bits
bit 12 Reserved: Maintain as ‘0’
bit 11 Unimplemented: Read as ‘0’
bit 10 CSCNA: Scan Input Selections for CH0+ S/H Input for MUX A Input Multiplexer Setting bit
1 = Scan inputs
0 = Do not scan inputs
bit 9-8 Unimplemented: Read as ‘0’
bit 7 BUFS: Buffer Fill Status bit (valid only when BUFM = 1)
1 = A/D is currently filling buffer, 08-0F, user should access data in 00-07
0 = A/D is currently filling buffer, 00-07, user should access data in 08-0F
bit 6 Unimplemented: Read as ‘0’
bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits
1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence
1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence
.....
0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence
0000 = Interrupts at the completion of conversion for each sample/convert sequence
bit 1 BUFM: Buffer Mode Select bit
1 = Buffer configured as two 8-word buffers (ADC1BUFn<15:8> and ADC1BUFn<7:0>)
0 = Buffer configured as one 16-word buffer (ADC1BUFn<15:0>)
bit 0 ALTS: Alternate Input Sample Mode Select bit
1 = Uses MUX A input multiplexer settings for first sample, then alternates between MUX B and
MUX A input multiplexer settings for all subsequent samples
0 = Always uses MUX A input multiplexer settings
VCFG<2:0> VR+ VR-
000 AVDD AVSS
001 External VREF+ pin AVSS
010 AVDD External VREF- pin
011 External VREF+ pin External VREF- pin
1xx AVDD AVSS
2009 Microchip Technology Inc. DS39897C-page 271
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REGISTER 22-3: AD1CON3: A/D CONTROL REGISTER 3
R/W-0 r-0 r-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADRC r r SAMC4 SAMC3 SAMC2 SAMC1 SAMC0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCS7 ADCS6 ADCS5 ADCS4 ADCS3 ADCS2 ADCS1 ADCS0
bit 7 bit 0
Legend: r = Reserved bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ADRC: A/D Conversion Clock Source bit
1 = A/D internal RC clock
0 = Clock derived from system clock
bit 14-13 Reserved: Maintain as ‘0’
bit 12-8 SAMC<4:0>: Auto-Sample Time bits
11111 = 31 TAD
·····
00001 = 1 TAD
00000 = 0 TAD (not recommended)
bit 7-0 ADCS<7:0>: A/D Conversion Clock Select bits
11111111
······ = Reserved, do not use
01000000
00111111 = 64 TCY
00111110 = 63 TCY
······
00000001 = 2*TCY
00000000 = TCY
PIC24FJ256GB110 FAMILY
DS39897C-page 272 2009 Microchip Technology Inc.
REGISTER 22-4: AD1CHS: A/D INPUT SELECT REGISTER
R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CH0NB — — CH0SB4(1) CH0SB3(1) CH0SB2(1) CH0SB1(1) CH0SB0(1)
bit 15 bit 8
R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CH0NA — — CH0SA4 CH0SA3 CH0SA2 CH0SA1 CH0SA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CH0NB: Channel 0 Negative Input Select for MUX B Multiplexer Setting bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VRbit
14-13 Unimplemented: Read as ‘0’
bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for MUX B Multiplexer Setting bits(1)
10001 = Channel 0 positive input is internal band gap reference (VBG)(2)
10000 = Channel 0 positive input is VBG/2(2)
01111 = Channel 0 positive input is AN15
01110 = Channel 0 positive input is AN14
01101 = Channel 0 positive input is AN13
01100 = Channel 0 positive input is AN12
01011 = Channel 0 positive input is AN11
01010 = Channel 0 positive input is AN10
01001 = Channel 0 positive input is AN9
01000 = Channel 0 positive input is AN8
00111 = Channel 0 positive input is AN7
00110 = Channel 0 positive input is AN6
00101 = Channel 0 positive input is AN5
00100 = Channel 0 positive input is AN4
00011 = Channel 0 positive input is AN3
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
bit 7 CH0NA: Channel 0 Negative Input Select for MUX A Multiplexer Setting bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VRbit
6-5 Unimplemented: Read as ‘0’
bit 4-0 CH0SA<4:0>: Channel 0 Positive Input Select for MUX A Multiplexer Setting bits
Implemented combinations are identical to those for CHOSB<4:0> (above).
Note 1: Combinations, ‘10010’ through ‘11111’, are unimplemented; do not use.
2: Band gap reference must be allowed to stabilize (parameter TBG) before using these channels for a
conversion. See Section 29.1 “DC Characteristics” for more information.
2009 Microchip Technology Inc. DS39897C-page 273
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REGISTER 22-5: AD1PCFGL: A/D PORT CONFIGURATION REGISTER (LOW)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 PCFG<15:0>: Analog Input Pin Configuration Control bits
1 = Pin for corresponding analog channel is configured in Digital mode; I/O port read enabled
0 = Pin configured in Analog mode; I/O port read disabled, A/D samples pin voltage
REGISTER 22-6: AD1PCFGH: A/D PORT CONFIGURATION REGISTER (HIGH)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — PCFG17 PCFG16
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 Unimplemented: Read as ‘0’
bit 1 PCFG17: A/D Input Configuration Control bit
1 = Analog channel disabled from input scan
0 = Internal band gap (VBG) channel enabled for input scan
bit 0 PCFG16: A/D Input Configuration Control bit
1 = Analog channel disabled from input scan
0 = Internal VBG/2 channel enabled for input scan
PIC24FJ256GB110 FAMILY
DS39897C-page 274 2009 Microchip Technology Inc.
EQUATION 22-1: A/D CONVERSION CLOCK PERIOD(1)
REGISTER 22-7: AD1CSSL: A/D INPUT SCAN SELECT REGISTER (LOW)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 CSSL<15:0>: A/D Input Pin Scan Selection bits
1 = Corresponding analog channel selected for input scan
0 = Analog channel omitted from input scan
Note 1: Based on TCY = 2 * TOSC; Doze mode and PLL are disabled.
TAD = TCY • (ADCS + 1)
TAD
TCY
ADCS = – 1
2009 Microchip Technology Inc. DS39897C-page 275
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FIGURE 22-2: 10-BIT A/D CONVERTER ANALOG INPUT MODEL
FIGURE 22-3: A/D TRANSFER FUNCTION
VA CPIN
Rs ANx
VT = 0.6V
VT = 0.6V ILEAKAGE
RIC 250 Sampling
Switch
RSS
CHOLD
= DAC capacitance
VSS
VDD
500 nA = 4.4 pF (Typical)
Legend: CPIN
VT
ILEAKAGE
RIC
RSS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage Current at the pin due to
= Interconnect Resistance
= Sampling Switch Resistance
= Sample/Hold Capacitance (from DAC)
various junctions
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs 5 k.
RSS 5 k(Typical)
6-11 pF
(Typical)
10 0000 0001 (513)
10 0000 0010 (514)
10 0000 0011 (515)
01 1111 1101 (509)
01 1111 1110 (510)
01 1111 1111 (511)
11 1111 1110 (1022)
11 1111 1111 (1023)
00 0000 0000 (0)
00 0000 0001 (1)
Output Code
10 0000 0000 (512)
(VINH – VINL)
VRVR+
– VR-
1024
512*(VR+ – VR-)
1024
VR+
VR- +
VR- +
1023*(VR+ – VR-)
1024
VR- +
0
(Binary (Decimal))
Voltage Level
PIC24FJ256GB110 FAMILY
DS39897C-page 276 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 277
PIC24FJ256GB110 FAMILY
23.0 TRIPLE COMPARATOR
MODULE
The triple comparator module provides three dual input
comparators. The inputs to the comparator can be configured
to use any one of four external analog inputs as
well, as a voltage reference input from either the
internal band gap reference divided by two (VBG/2) or
the comparator voltage reference generator.
The comparator outputs may be directly connected to
the CxOUT pins. When the respective COE equals ‘1’,
the I/O pad logic makes the unsynchronized output of
the comparator available on the pin.
A simplified block diagram of the module in shown in
Figure 23-1. Diagrams of the possible individual
comparator configurations are shown in Figure 23-2.
Each comparator has its own control register,
CMxCON (Register 23-1), for enabling and configuring
its operation. The output and event status of all three
comparators is provided in the CMSTAT register
(Register 23-2).
FIGURE 23-1: TRIPLE COMPARATOR MODULE BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
associated “PIC24F Family Reference
Manual” chapter.
C1
VINCXINB
VIN+
CXINC
CXINA
CXIND
CVREF
VBG/2
C2
VINVIN+
C3
VINVIN+
COE
C1OUT
Pin
CPOL
Trigger/Interrupt
Logic
CEVT
EVPOL<1:0>
COUT
Input
Select
Logic
CCH<1:0>
CREF
COE
C2OUT
Pin
CPOL
Trigger/Interrupt
Logic
CEVT
EVPOL<1:0>
COUT
COE
C3OUT
Pin
CPOL
Trigger/Interrupt
Logic
CEVT
EVPOL<1:0>
COUT
PIC24FJ256GB110 FAMILY
DS39897C-page 278 2009 Microchip Technology Inc.
FIGURE 23-2: INDIVIDUAL COMPARATOR CONFIGURATIONS
Cx
VINVIN+
Off (Read as ‘0’)
Comparator Off
CEN = 0, CREF = x, CCH<1:0> = xx
Comparator CxINB > CxINA Compare
CEN = 1, CREF = 0, CCH<1:0> = 00
COE
CxOUT
Cx
VINVIN+
COE
CXINB
CXINA
Comparator CxIND > CxINA Compare
CEN = 1, CREF = 0, CCH<1:0> = 10
Cx
VINVIN+
COE
CxOUT
CXIND
CXINA
Comparator CxINC > CxINA Compare
CEN = 1, CREF = 0, CCH<1:0> = 01
Cx
VINVIN+
COE
CXINC
CXINA
Comparator VBG > CxINA Compare
CEN = 1, CREF = 0, CCH<1:0> = 11
Cx
VINVIN+
COE
VBG/2
CXINA
Comparator CxINB > CVREF Compare
CEN = 1, CREF = 1, CCH<1:0> = 00
Cx
VINVIN+
COE
CXINB
CVREF
Comparator CxIND > CVREF Compare
CEN = 1, CREF = 1, CCH<1:0> = 10
Cx
VINVIN+
COE
CXIND
CVREF
Comparator CxINC > CVREF Compare
CEN = 1, CREF = 1, CCH<1:0> = 01
Cx
VINVIN+
COE
CXINC
CVREF
Comparator VBG > CVREF Compare
CEN = 1, CREF = 1, CCH<1:0> = 11
Cx
VINVIN+
COE
VBG/2
CVREF
Pin
Pin
CxOUT
Pin
CxOUT
Pin
CxOUT
Pin
CxOUT
Pin
CxOUT
Pin
CxOUT
Pin
CxOUT
Pin
2009 Microchip Technology Inc. DS39897C-page 279
PIC24FJ256GB110 FAMILY
REGISTER 23-1: CMxCON: COMPARATOR x CONTROL REGISTERS (COMPARATORS 1
THROUGH 3)
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R-0
CEN COE CPOL — — — CEVT COUT
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
EVPOL1 EVPOL0 — CREF — — CCH1 CCH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CEN: Comparator Enable bit
1 = Comparator is enabled
0 = Comparator is disabled
bit 14 COE: Comparator Output Enable bit
1 = Comparator output is present on the CxOUT pin.
0 = Comparator output is internal only
bit 13 CPOL: Comparator Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 12-10 Unimplemented: Read as ‘0’
bit 9 CEVT: Comparator Event bit
1 = Comparator event defined by EVPOL<1:0> has occurred; subsequent triggers and interrupts are
disabled until the bit is cleared
0 = Comparator event has not occurred
bit 8 COUT: Comparator Output bit
When CPOL = 0:
1 = VIN+ > VIN-
0 = VIN+ < VINWhen
CPOL = 1:
1 = VIN+ < VIN-
0 = VIN+ > VINbit
7-6 EVPOL<1:0>: Trigger/Event/Interrupt Polarity Select bits
11 = Trigger/event/interrupt generated on any change of the comparator output (while CEVT = 0)
10 = Trigger/event/interrupt generated on transition of the comparator output:
If CPOL = 0 (non-inverted polarity):
High-to-low transition only.
If CPOL = 1 (inverted polarity):
Low-to-high transition only.
01 = Trigger/event/interrupt generated on transition of comparator output:
If CPOL = 0 (non-inverted polarity):
Low-to-high transition only.
If CPOL = 1 (inverted polarity):
High-to-low transition only.
00 = Trigger/event/interrupt generation is disabled
bit 5 Unimplemented: Read as ‘0’
PIC24FJ256GB110 FAMILY
DS39897C-page 280 2009 Microchip Technology Inc.
bit 4 CREF: Comparator Reference Select bits (non-inverting input)
1 = Non-inverting input connects to internal CVREF voltage
0 = Non-inverting input connects to CXINA pin
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 CCH<1:0>: Comparator Channel Select bits
11 = Inverting input of comparator connects to VBG/2
10 = Inverting input of comparator connects to CXIND pin
01 = Inverting input of comparator connects to CXINC pin
00 = Inverting input of comparator connects to CXINB pin
REGISTER 23-1: CMxCON: COMPARATOR x CONTROL REGISTERS (COMPARATORS 1
THROUGH 3) (CONTINUED)
REGISTER 23-2: CMSTAT: COMPARATOR MODULE STATUS REGISTER
R/W-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0
CMIDL — — — — C3EVT C2EVT C1EVT
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0
— — — — — C3OUT C2OUT C1OUT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CMIDL: Comparator Stop in Idle Mode bit
1 = Module does not generate interrupts in Idle mode, but is otherwise operational
0 = Module continues normal operation in Idle mode
bit 14-11 Unimplemented: Read as ‘0’
bit 10 C3EVT: Comparator 3 Event Status bit (read-only)
Shows the current event status of Comparator 3 (CM3CON<9>).
bit 9 C2EVT: Comparator 2 Event Status bit (read-only)
Shows the current event status of Comparator 2 (CM2CON<9>).
bit 8 C1EVT: Comparator 1 Event Status bit (read-only)
Shows the current event status of Comparator 1 (CM1CON<9>).
bit 7-3 Unimplemented: Read as ‘0’
bit 2 C3OUT: Comparator 3 Output Status bit (read-only)
Shows the current output of Comparator 3 (CM3CON<8>).
bit 1 C2OUT: Comparator 2 Output Status bit (read-only)
Shows the current output of Comparator 2 (CM2CON<8>).
bit 0 C1OUT: Comparator 1 Output Status bit (read-only)
Shows the current output of Comparator 1 (CM1CON<8>).
2009 Microchip Technology Inc. DS39897C-page 281
PIC24FJ256GB110 FAMILY
24.0 COMPARATOR VOLTAGE
REFERENCE
24.1 Configuring the Comparator
Voltage Reference
The voltage reference module is controlled through the
CVRCON register (Register 24-1). The comparator
voltage reference provides two ranges of output
voltage, each with 16 distinct levels. The range to be
used is selected by the CVRR bit (CVRCON<5>). The
primary difference between the ranges is the size of the
steps selected by the CVREF Selection bits
(CVR<3:0>), with one range offering finer resolution.
The comparator reference supply voltage can come
from either VDD and VSS, or the external VREF+ and
VREF-. The voltage source is selected by the CVRSS
bit (CVRCON<4>).
The settling time of the comparator voltage reference
must be considered when changing the CVREF
output.
FIGURE 24-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
“PIC24F Family Reference Manual”,
”Section 20. Comparator Voltage
Reference Module” (DS39709).
16-to-1 MUX
CVR<3:0>
8R
CVREN R
CVRSS = 0
AVDD
VREF+
CVRSS = 1
8R
CVRSS = 0
VREFCVRSS
= 1
R
R
R
R
R
R
16 Steps
CVRR
CVREF
AVSS
PIC24FJ256GB110 FAMILY
DS39897C-page 282 2009 Microchip Technology Inc.
REGISTER 24-1: CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 CVREN: Comparator Voltage Reference Enable bit
1 = CVREF circuit powered on
0 = CVREF circuit powered down
bit 6 CVROE: Comparator VREF Output Enable bit
1 = CVREF voltage level is output on CVREF pin
0 = CVREF voltage level is disconnected from CVREF pin
bit 5 CVRR: Comparator VREF Range Selection bit
1 = CVRSRC range should be 0 to 0.625 CVRSRC with CVRSRC/24 step size
0 = CVRSRC range should be 0.25 to 0.719 CVRSRC with CVRSRC/32 step size
bit 4 CVRSS: Comparator VREF Source Selection bit
1 = Comparator reference source CVRSRC = VREF+ – VREF-
0 = Comparator reference source CVRSRC = AVDD – AVSS
bit 3-0 CVR<3:0>: Comparator VREF Value Selection 0 CVR3:CVR0 15 bits
When CVRR = 1:
CVREF = (CVR<3:0>/24) (CVRSRC)
When CVRR = 0:
CVREF = 1/4 (CVRSRC) + (CVR<3:0>/32) (CVRSRC)
2009 Microchip Technology Inc. DS39897C-page 283
PIC24FJ256GB110 FAMILY
25.0 CHARGE TIME
MEASUREMENT UNIT (CTMU)
The Charge Time Measurement Unit is a flexible
analog module that provides accurate differential time
measurement between pulse sources, as well as
asynchronous pulse generation. Its key features
include:
• Four edge input trigger sources
• Polarity control for each edge source
• Control of edge sequence
• Control of response to edges
• Time measurement resolution of 1 nanosecond
• Accurate current source suitable for capacitive
measurement
Together with other on-chip analog modules, the CTMU
can be used to precisely measure time, measure
capacitance, measure relative changes in capacitance,
or generate output pulses that are independent of the
system clock. The CTMU module is ideal for interfacing
with capacitive-based sensors.
The CTMU is controlled through two registers,
CTMUCON and CTMUICON. CTMUCON enables the
module, and controls edge source selection, edge
source polarity selection, and edge sequencing. The
CTMUICON register has controls the selection and trim
of the current source.
25.1 Measuring Capacitance
The CTMU module measures capacitance by generating
an output pulse with a width equal to the time
between edge events on two separate input channels.
The pulse edge events to both input channels can be
selected from four sources: two internal peripheral
modules (OC1 and Timer1) and two external pins
(CTEDG1 and CTEDG2). This pulse is used with the
module’s precision current source to calculate
capacitance according to the relationship:
For capacitance measurements, the A/D Converter
samples an external capacitor (CAPP) on one of its
input channels after the CTMU output’s pulse. A precision
resistor (RPR) provides current source calibration
on a second A/D channel. After the pulse ends, the
converter determines the voltage on the capacitor. The
actual calculation of capacitance is performed in
software by the application.
Figure 25-1 shows the external connections used for
capacitance measurements, and how the CTMU and
A/D modules are related in this application. This
example also shows the edge events coming from
Timer1, but other configurations using external edge
sources are possible. A detailed discussion on measuring
capacitance and time with the CTMU module is
provided in the “PIC24F Family Reference Manual”.
FIGURE 25-1: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR
CAPACITANCE MEASUREMENT
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
associated “PIC24F Family Reference
Manual” chapter.
I C dV
-d---T-- =
PIC24F Device
A/D Converter
CTMU
ANx
CAPP
Output Pulse
EDG1
EDG2
RPR
ANY
Timer1
Current Source
PIC24FJ256GB110 FAMILY
DS39897C-page 284 2009 Microchip Technology Inc.
25.2 Measuring Time
Time measurements on the pulse width can be similarly
performed, using the A/D module’s internal capacitor
(CAD) and a precision resistor for current calibration.
Figure 25-2 shows the external connections used for
time measurements, and how the CTMU and A/D modules
are related in this application. This example also
shows both edge events coming from the external
CTEDG pins, but other configurations using internal
edge sources are possible. A detailed discussion on
measuring capacitance and time with the CTMU module
is provided in the “PIC24F Family Reference Manual”.
25.3 Pulse Generation and Delay
The CTMU module can also generate an output pulse
with edges that are not synchronous with the device’s
system clock. More specifically, it can generate a pulse
with a programmable delay from an edge event input to
the module.
When the module is configured for pulse generation
delay by setting the TGEN bit (CTMUCON<12>), the
internal current source is connected to the B input of
Comparator 2. A capacitor (CDELAY) is connected to
the Comparator 2 pin, C2INB, and the comparator voltage
reference, CVREF, is connected to C2INA. CVREF
is then configured for a specific trip point. The module
begins to charge CDELAY when an edge event is
detected. When CDELAY charges above the CVREF trip
point, a pulse is output on CTPLS. The length of the
pulse delay is determined by the value of CDELAY and
the CVREF trip point.
Figure 25-3 shows the external connections for pulse
generation, as well as the relationship of the different
analog modules required. While CTEDG1 is shown as
the input pulse source, other options are available. A
detailed discussion on pulse generation with the CTMU
module is provided in the “PIC24F Family Reference
Manual”.
FIGURE 25-2: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR TIME
MEASUREMENT
FIGURE 25-3: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR PULSE
DELAY GENERATION
PIC24F Device
A/D Converter
CTMU
CTEDG1
CTEDG2
ANx
Output Pulse
EDG1
EDG2
CAD
RPR
Current Source
C2
CVREF
CTPLS
PIC24F Device
Current Source
Comparator
CTMU
CTEDG1
C2INB
CDELAY
EDG1
2009 Microchip Technology Inc. DS39897C-page 285
PIC24FJ256GB110 FAMILY
REGISTER 25-1: CTMUCON: CTMU CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CTMUEN — CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CTMUEN: CTMU Enable bit
1 = Module is enabled
0 = Module is disabled
bit 14 Unimplemented: Read as ‘0’
bit 13 CTMUSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 TGEN: Time Generation Enable bit(1)
1 = Enables edge delay generation
0 = Disables edge delay generation
bit 10 EDGEN: Edge Enable bit
1 = Edges are not blocked
0 = Edges are blocked
bit 10 EDGSEQEN: Edge Sequence Enable bit
1 = Edge 1 event must occur before Edge 2 event can occur
0 = No edge sequence is needed
bit 9 IDISSEN: Analog Current Source Control bit
1 = Analog current source output is grounded
0 = Analog current source output is not grounded
bit 8 CTTRIG: Trigger Control bit
1 = Trigger output is enabled
0 = Trigger output is disabled
bit 7 EDG2POL: Edge 2 Polarity Select bit
1 = Edge 2 programmed for a positive edge response
0 = Edge 2 programmed for a negative edge response
bit 6-5 EDG2SEL<1:0>: Edge 2 Source Select bits
11 = CTED1 pin
10 = CTED2 pin
01 = OC1 module
00 = Timer1 module
bit 4 EDG1POL: Edge 1 Polarity Select bit
1 = Edge 1 programmed for a positive edge response
0 = Edge 1 programmed for a negative edge response
Note 1: If TGEN = 1, the CTEDGx inputs and CTPLS outputs must be assigned to available RPn pins before use.
See Section 10.4 “Peripheral Pin Select” for more information.
PIC24FJ256GB110 FAMILY
DS39897C-page 286 2009 Microchip Technology Inc.
bit 3-2 EDG1SEL<1:0>: Edge 1 Source Select bits
11 = CTED1 pin
10 = CTED2 pin
01 = OC1 module
00 = Timer1 module
bit 1 EDG2STAT: Edge 2 Status bit
1 = Edge 2 event has occurred
0 = Edge 2 event has not occurred
bit 0 EDG1STAT: Edge 1 Status bit
1 = Edge 1 event has occurred
0 = Edge 1 event has not occurred
REGISTER 25-1: CTMUCON: CTMU CONTROL REGISTER (CONTINUED)
Note 1: If TGEN = 1, the CTEDGx inputs and CTPLS outputs must be assigned to available RPn pins before use.
See Section 10.4 “Peripheral Pin Select” for more information.
REGISTER 25-2: CTMUICON: CTMU CURRENT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 ITRIM<5:0>: Current Source Trim bits
011111 = Maximum positive change from nominal current
011110
. . . . .
000001 = Minimum positive change from nominal current
000000 = Nominal current output specified by IRNG<1:0>
111111 = Minimum negative change from nominal current
. . . . .
100010
100001 = Maximum negative change from nominal current
bit 9-8 IRNG<1:0>: Current Source Range Select bits
11 = 100 Base current
10 = 10 Base current
01 = Base current level (0.55 A nominal)
00 = Current source disabled
bit 7-0 Unimplemented: Read as ‘0’
2009 Microchip Technology Inc. DS39897C-page 287
PIC24FJ256GB110 FAMILY
26.0 SPECIAL FEATURES
PIC24FJ256GB110 family devices include several
features intended to maximize application flexibility and
reliability, and minimize cost through elimination of
external components. These are:
• Flexible Configuration
• Watchdog Timer (WDT)
• Code Protection
• JTAG Boundary Scan Interface
• In-Circuit Serial Programming
• In-Circuit Emulation
26.1 Configuration Bits
The Configuration bits can be programmed (read as ‘0’),
or left unprogrammed (read as ‘1’), to select various
device configurations. These bits are mapped starting at
program memory location F80000h. A detailed explanation
of the various bit functions is provided in
Register 26-1 through Register 26-5.
Note that address F80000h is beyond the user program
memory space. In fact, it belongs to the configuration
memory space (800000h-FFFFFFh) which can only be
accessed using table reads and table writes.
26.1.1 CONSIDERATIONS FOR
CONFIGURING PIC24FJ256GB110
FAMILY DEVICES
In PIC24FJ256GB110 family devices, the configuration
bytes are implemented as volatile memory. This means
that configuration data must be programmed each time
the device is powered up. Configuration data is stored
in the three words at the top of the on-chip program
memory space, known as the Flash Configuration
Words. Their specific locations are shown in
Table 26-1. These are packed representations of the
actual device Configuration bits, whose actual
locations are distributed among several locations in
configuration space. The configuration data is automatically
loaded from the Flash Configuration Words to the
proper Configuration registers during device Resets.
When creating applications for these devices, users
should always specifically allocate the location of the
Flash Configuration Word for configuration data. This is
to make certain that program code is not stored in this
address when the code is compiled.
The upper byte of all Flash Configuration Words in program
memory should always be ‘1111 1111’. This
makes them appear to be NOP instructions in the
remote event that their locations are ever executed by
accident. Since Configuration bits are not implemented
in the corresponding locations, writing ‘1’s to these
locations has no effect on device operation.
TABLE 26-1: FLASH CONFIGURATION WORD LOCATIONS FOR PIC24FJ256GB110 FAMILY
DEVICES
Note: This data sheet summarizes the features
of this group of PIC24F devices. It is not
intended to be a comprehensive reference
source. For more information, refer to the
following sections of the “PIC24F Family
Reference Manual”:
• Section 9. “Watchdog Timer (WDT)”
(DS39697)
• Section 32. “High-Level Device
Integration” (DS39719)
• Section 33. “Programming and
Diagnostics” (DS39716)
Note: Configuration data is reloaded on all types
of device Resets.
Note: Performing a page erase operation on the
last page of program memory clears the
Flash Configuration Words, enabling code
protection as a result. Therefore, users
should avoid performing page erase
operations on the last page of program
memory.
Device
Configuration Word Addresses
1 2 3
PIC24FJ64GB1 ABFEh ABFCh ABFAh
PIC24FJ128GB1 157FEh 157FC 157FA
PIC24FJ192GB1 20BFEh 20BFC 20BFA
PIC24FJ256GB1 2ABFEh 2ABFC 2ABFA
PIC24FJ256GB110 FAMILY
DS39897C-page 288 2009 Microchip Technology Inc.
REGISTER 26-1: CW1: FLASH CONFIGURATION WORD 1
U-1 U-1 U-1 U-1 U-1 U-1 U-1 U-1
— — — — — — — —
bit 23 bit 16
r-x R/PO-1 R/PO-1 R/PO-1 R/PO-1 r-1 R/PO-1 R/PO-1
r JTAGEN(1) GCP GWRP DEBUG r ICS1 ICS0
bit 15 bit 8
R/PO-1 R/PO-1 U-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1
FWDTEN WINDIS — FWPSA WDTPS3 WDTPS2 WDTPS1 WDTPS0
bit 7 bit 0
Legend: r = Reserved bit
R = Readable bit PO = Program Once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 23-16 Unimplemented: Read as ‘1’
bit 15 Reserved: The value is unknown; program as ‘0’
bit 14 JTAGEN: JTAG Port Enable bit(1)
1 = JTAG port is enabled
0 = JTAG port is disabled
bit 13 GCP: General Segment Program Memory Code Protection bit
1 = Code protection is disabled
0 = Code protection is enabled for the entire program memory space
bit 12 GWRP: General Segment Code Flash Write Protection bit
1 = Writes to program memory are allowed
0 = Writes to program memory are disabled
bit 11 DEBUG: Background Debugger Enable bit
1 = Device resets into Operational mode
0 = Device resets into Debug mode
bit 10 Reserved: Always maintain as ‘1’
bit 9-8 ICS1:ICS0: Emulator Pin Placement Select bits
11 = Emulator functions are shared with PGEC1/PGED1
10 = Emulator functions are shared with PGEC2/PGED2
01 = Emulator functions are shared with PGEC3/PGED3
00 = Reserved; do not use
bit 7 FWDTEN: Watchdog Timer Enable bit
1 = Watchdog Timer is enabled
0 = Watchdog Timer is disabled
bit 6 WINDIS: Windowed Watchdog Timer Disable bit
1 = Standard Watchdog Timer enabled
0 = Windowed Watchdog Timer enabled; FWDTEN must be ‘1’
bit 5 Unimplemented: Read as ‘1’
bit 4 FWPSA: WDT Prescaler Ratio Select bit
1 = Prescaler ratio of 1:128
0 = Prescaler ratio of 1:32
Note 1: The JTAGEN bit can only be modified using In-Circuit Serial Programming™ (ICSP™). It cannot be
modified while programming the device through the JTAG interface.
2009 Microchip Technology Inc. DS39897C-page 289
PIC24FJ256GB110 FAMILY
bit 3-0 WDTPS<3:0>: Watchdog Timer Postscaler Select bits
1111 = 1:32,768
1110 = 1:16,384
1101 = 1:8,192
1100 = 1:4,096
1011 = 1:2,048
1010 = 1:1,024
1001 = 1:512
1000 = 1:256
0111 = 1:128
0110 = 1:64
0101 = 1:32
0100 = 1:16
0011 = 1:8
0010 = 1:4
0001 = 1:2
0000 = 1:1
REGISTER 26-1: CW1: FLASH CONFIGURATION WORD 1 (CONTINUED)
Note 1: The JTAGEN bit can only be modified using In-Circuit Serial Programming™ (ICSP™). It cannot be
modified while programming the device through the JTAG interface.
PIC24FJ256GB110 FAMILY
DS39897C-page 290 2009 Microchip Technology Inc.
REGISTER 26-2: CW2: FLASH CONFIGURATION WORD 2
U-1 U-1 U-1 U-1 U-1 U-1 U-1 U-1
— — — — — — — —
bit 23 bit 16
R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1
IESO PLLDIV2 PLLDIV1 PLLDIV0 PLLDIS FNOSC2 FNOSC1 FNOSC0
bit 15 bit 8
R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 r-1 R/PO-1 R/PO-1
FCKSM1 FCKSM0 OSCIOFCN IOL1WAY DISUVREG r POSCMD1 POSCMD0
bit 7 bit 0
Legend: r = Reserved bit
R = Readable bit PO = Program-once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 23-16 Unimplemented: Read as ‘1’
bit 15 IESO: Internal External Switchover bit
1 = IESO mode (Two-Speed Start-up) enabled
0 = IESO mode (Two-Speed Start-up) disabled
bit 14-12 PLLDIV<2:0>: USB 96 MHz PLL Prescaler Select bits
111 = Oscillator input divided by 12 (48 MHz input)
110 = Oscillator input divided by 10 (40 MHz input)
101 = Oscillator input divided by 6 (24 MHz input)
100 = Oscillator input divided by 5 (20 MHz input)
011 = Oscillator input divided by 4 (16 MHz input)
010 = Oscillator input divided by 3 (12 MHz input)
001 = Oscillator input divided by 2 (8 MHz input)
000 = Oscillator input used directly (4 MHz input)
bit 11 PLLDIS: USB 96 MHz PLL Disable bit
1 = PLL disabled
0 = PLL enabled (required for all USB operations)
bit 10-8 FNOSC<2:0>: Initial Oscillator Select bits
111 = Fast RC Oscillator with Postscaler (FRCDIV)
110 = Reserved
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator with PLL module (XTPLL, HSPLL, ECPLL)
010 = Primary Oscillator (XT, HS, EC)
001 = Fast RC Oscillator with postscaler and PLL module (FRCPLL)
000 = Fast RC Oscillator (FRC)
bit 7-6 FCKSM<1:0>: Clock Switching and Fail-Safe Clock Monitor Configuration bits
1x = Clock switching and Fail-Safe Clock Monitor are disabled
01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled
00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled
bit 5 OSCIOFCN: OSCO Pin Configuration bit
If POSCMD<1:0> = 11 or 00:
1 = OSCO/CLKO/RC15 functions as CLKO (FOSC/2)
0 = OSCO/CLKO/RC15 functions as port I/O (RC15)
If POSCMD<1:0> = 10 or 01:
OSCIOFCN has no effect on OSCO/CLKO/RC15.
2009 Microchip Technology Inc. DS39897C-page 291
PIC24FJ256GB110 FAMILY
bit 4 IOL1WAY: IOLOCK One-Way Set Enable bit
1 = The IOLOCK bit (OSCCON<6>)can be set once, provided the unlock sequence has been
completed. Once set, the Peripheral Pin Select registers cannot be written to a second time.
0 = The IOLOCK bit can be set and cleared as needed, provided the unlock sequence has been
completed
bit 3 DISUVREG: Internal USB 3.3V Regulator Disable bit
1 = Regulator is disabled
0 = Regulator is enabled
bit 2 Reserved: Always maintain as ‘1’
bit 1-0 POSCMD<1:0>: Primary Oscillator Configuration bits
11 = Primary Oscillator disabled
10 = HS Oscillator mode selected
01 = XT Oscillator mode selected
00 = EC Oscillator mode selected
REGISTER 26-2: CW2: FLASH CONFIGURATION WORD 2 (CONTINUED)
REGISTER 26-3: CW3: FLASH CONFIGURATION WORD 3
U-1 U-1 U-1 U-1 U-1 U-1 U-1 U-1
— — — — — — — —
bit 23 bit 16
R/PO-1 R/PO-1 R/PO-1 U-1 U-1 U-1 U-1 U-1
WPEND WPCFG WPDIS — — — — —
bit 15 bit 8
R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1
WPFP7 WPFP6 WPFP5 WPFP4 WPFP3 WPFP2 WPFP1 WPFP0
bit 7 bit 0
Legend:
R = Readable bit PO = Program-once bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 23-16 Unimplemented: Read as ‘1’
bit 15 WPEND: Segment Write Protection End Page Select bit
1 = Protected code segment lower boundary is at the bottom of program memory (000000h); upper
boundary is the code page specified by WPFP<7:0>
0 = Protected code segment upper boundary is at the last page of program memory; lower boundary
is the code page specified by WPFP<7:0>
bit 14 WPCFG: Configuration Word Code Page Protection Select bit
1 = Last page (at the top of program memory) and Flash Configuration Words are not protected
0 = Last page and Flash Configuration Words are code protected
bit 13 WPDIS: Segment Write Protection Disable bit
1 = Segmented code protection disabled
0 = Segmented code protection enabled; protected segment defined by WPEND, WPCFG and
WPFPx Configuration bits
bit 12-8 Unimplemented: Read as ‘1’
bit 7-0 WPFP<7:0>: Protected Code Segment Boundary Page bits
Designates the 512-word program code page that is the boundary of the protected code segment,
starting with Page 0 at the bottom of program memory.
If WPEND = 1:
Last address of designated code page is the upper boundary of the segment.
If WPEND = ‘0’:
First address of designated code page is the lower boundary of the segment.
PIC24FJ256GB110 FAMILY
DS39897C-page 292 2009 Microchip Technology Inc.
REGISTER 26-4: DEVID: DEVICE ID REGISTER
U U U U U U U U
— — — — — — — —
bit 23 bit 16
U U R R R R R R
— — FAMID7 FAMID6 FAMID5 FAMID4 FAMID3 FAMID2
bit 15 bit 8
R R R R R R R R
FAMID1 FAMID0 DEV5 DEV4 DEV3 DEV2 DEV1 DEV0
bit 7 bit 0
Legend: R = Read-only bit U = Unimplemented bit
bit 23-14 Unimplemented: Read as ‘1’
bit 13-6 FAMID<7:0>: Device Family Identifier bits
01000000 = PIC24FJ256GB110 family
bit 5-0 DEV<5:0>: Individual Device Identifier bits
000001 = PIC24FJ64GB106
000011 = PIC24FJ64GB108
000111 = PIC24FJ64GB110
001001 = PIC24FJ128GB106
001011 = PIC24FJ128GB108
001111 = PIC24FJ128GB110
010001 = PIC24FJ192GB106
010011 = PIC24FJ192GB108
010111 = PIC24FJ192GB110
011001 = PIC24FJ256GB106
011011 = PIC24FJ256GB108
011111 = PIC24FJ256GB110
REGISTER 26-5: DEVREV: DEVICE REVISION REGISTER
U U U U U U U U
— — — — — — — —
bit 23 bit 16
U U U U U U U R
— — — — — — — MAJRV2
bit 15 bit 8
R R U U U R R R
MAJRV1 MAJRV0 — — — DOT2 DOT1 DOT0
bit 7 bit 0
Legend: R = Read-only bit U = Unimplemented bit
bit 23-9 Unimplemented: Read as ‘0’
bit 8-6 MAJRV<2:0>: Major Revision Identifier bits
bit 5-3 Unimplemented: Read as ‘0’
bit 2-0 DOT<2:0>: Minor Revision Identifier bits
2009 Microchip Technology Inc. DS39897C-page 293
PIC24FJ256GB110 FAMILY
26.2 On-Chip Voltage Regulator
All PIC24FJ256GB110 family devices power their core
digital logic at a nominal 2.5V. This may create an issue
for designs that are required to operate at a higher
typical voltage, such as 3.3V. To simplify system
design, all devices in the PIC24FJ256GB110 family
incorporate an on-chip regulator that allows the device
to run its core logic from VDD.
The regulator is controlled by the ENVREG pin. Tying VDD
to the pin enables the regulator, which in turn, provides
power to the core from the other VDD pins. When the regulator
is enabled, a low-ESR capacitor (such as ceramic)
must be connected to the VDDCORE/VCAP pin
(Figure 26-1). This helps to maintain the stability of the
regulator. The recommended value for the filter capacitor
(CEFC) is provided in Section 29.1 “DC Characteristics”.
If ENVREG is tied to VSS, the regulator is disabled. In
this case, separate power for the core logic, at a nominal
2.5V, must be supplied to the device on the
VDDCORE/VCAP pin to run the I/O pins at higher voltage
levels, typically 3.3V. Alternatively, the VDDCORE/VCAP
and VDD pins can be tied together to operate at a lower
nominal voltage. Refer to Figure 26-1 for possible
configurations.
26.2.1 VOLTAGE REGULATOR TRACKING
MODE AND LOW-VOLTAGE
DETECTION
When it is enabled, the on-chip regulator provides a
constant voltage of 2.5V nominal to the digital core
logic.
The regulator can provide this level from a VDD of about
2.5V, all the way up to the device’s VDDMAX. It does not
have the capability to boost VDD levels below 2.5V. In
order to prevent “brown out” conditions when the voltage
drops too low for the regulator, the regulator enters
Tracking mode. In Tracking mode, the regulator output
follows VDD, with a typical voltage drop of 100 mV.
When the device enters Tracking mode, it is no longer
possible to operate at full speed. To provide information
about when the device enters Tracking mode, the
on-chip regulator includes a simple, Low-Voltage
Detect circuit. When VDD drops below full-speed operating
voltage, the circuit sets the Low-Voltage Detect
Interrupt Flag, LVDIF (IFS4<8>). This can be used to
generate an interrupt and put the application into a
low-power operational mode, or trigger an orderly
shutdown.
Low-Voltage Detection (LVD) is only available when the
regulator is enabled.
FIGURE 26-1: CONNECTIONS FOR THE
ON-CHIP REGULATOR
VDD
ENVREG
VDDCORE/VCAP
VSS
PIC24FJ256GB
2.5V(1) 3.3V(1)
VDD
ENVREG
VDDCORE/VCAP
VSS
PIC24FJ256GB
CEFC
3.3V
Regulator Enabled (ENVREG tied to VDD):
Regulator Disabled (ENVREG tied to ground):
VDD
ENVREG
VDDCORE/VCAP
VSS
PIC24FJ256GB
2.5V(1)
Regulator Disabled (VDD tied to VDDCORE):
Note 1: These are typical operating voltages. Refer
to Section 29.1 “DC Characteristics” for
the full operating ranges of VDD and
VDDCORE.
(10 F typ)
PIC24FJ256GB110 FAMILY
DS39897C-page 294 2009 Microchip Technology Inc.
26.2.2 ON-CHIP REGULATOR AND POR
When the voltage regulator is enabled, it takes approximately
10 s for it to generate output. During this time,
designated as TVREG, code execution is disabled. TVREG
is applied every time the device resumes operation after
any power-down, including Sleep mode. The length of
TVREG is determined by the PMSLP bit (RCON<8>), as
described in Section 26.2.5 “Voltage Regulator
Standby Mode”.
If the regulator is disabled, a separate Power-up Timer
(PWRT) is automatically enabled. The PWRT adds a
fixed delay of 64 ms nominal delay at device start-up
(POR or BOR only). When waking up from Sleep with
the regulator disabled, the PMSLP bit determines the
wake-up time. When operating with the regulator
disabled, setting PMSLP can decrease the device
wake-up time.
26.2.3 ON-CHIP REGULATOR AND BOR
When the on-chip regulator is enabled,
PIC24FJ256GB110 family devices also have a simple
brown-out capability. If the voltage supplied to the regulator
is inadequate to maintain the tracking level, the
regulator Reset circuitry will generate a Brown-out
Reset. This event is captured by the BOR flag bit
(RCON<1>). The brown-out voltage specifications are
provided in the “PIC24FJ Family Reference Manual”,
Section 7. “Reset” (DS39712).
26.2.4 POWER-UP REQUIREMENTS
The on-chip regulator is designed to meet the power-up
requirements for the device. If the application does not
use the regulator, then strict power-up conditions must
be adhered to. While powering up, VDDCORE must
never exceed VDD by 0.3 volts.
26.2.5 VOLTAGE REGULATOR STANDBY
MODE
When enabled, the on-chip regulator always consumes
a small incremental amount of current over IDD/IPD,
including when the device is in Sleep mode, even
though the core digital logic does not require power. To
provide additional savings in applications where power
resources are critical, the regulator automatically
disables itself whenever the device goes into Sleep
mode. This feature is controlled by the PMSLP bit
(RCON<8>). By default, the bit is cleared, which
removes power from the Flash program memory and
thus enables Standby mode. When waking up from
Standby mode, the regulator must wait for TVREG to
expire before wake-up. This extra time is needed to
ensure that the regulator can source enough current to
power the Flash memory.
For applications which require a faster wake-up time, it
is possible to disable regulator Standby mode. The
PMSLP bit can be set to turn off Standby mode so that
the Flash stays powered when in Sleep mode and the
device can wake-up without waiting for TVREG. When
PMSLP is set, the power consumption while in Sleep
mode, will be approximately 40 A higher than power
consumption when the regulator is allowed to enter
Standby mode.
26.3 Watchdog Timer (WDT)
For PIC24FJ256GB110 family devices, the WDT is
driven by the LPRC Oscillator. When the WDT is
enabled, the clock source is also enabled.
The nominal WDT clock source from LPRC is 31 kHz.
This feeds a prescaler that can be configured for either
5-bit (divide-by-32) or 7-bit (divide-by-128) operation.
The prescaler is set by the FWPSA Configuration bit.
With a 31 kHz input, the prescaler yields a nominal
WDT time-out period (TWDT) of 1 ms in 5-bit mode, or
4 ms in 7-bit mode.
A variable postscaler divides down the WDT prescaler
output and allows for a wide range of time-out periods.
The postscaler is controlled by the WDTPS<3:0> Configuration
bits (CW1<3:0>), which allow the selection of
a total of 16 settings, from 1:1 to 1:32,768. Using the
prescaler and postscaler, time-out periods ranging from
1 ms to 131 seconds can be achieved.
The WDT, prescaler and postscaler are reset:
• On any device Reset
• On the completion of a clock switch, whether
invoked by software (i.e., setting the OSWEN bit
after changing the NOSC bits) or by hardware
(i.e., Fail-Safe Clock Monitor)
• When a PWRSAV instruction is executed
(i.e., Sleep or Idle mode is entered)
• When the device exits Sleep or Idle mode to
resume normal operation
• By a CLRWDT instruction during normal execution
If the WDT is enabled, it will continue to run during
Sleep or Idle modes. When the WDT time-out occurs,
the device will wake the device and code execution will
continue from where the PWRSAV instruction was executed.
The corresponding SLEEP or IDLE bits
(RCON<3:2>) will need to be cleared in software after
the device wakes up.
The WDT Flag bit, WDTO (RCON<4>), is not automatically
cleared following a WDT time-out. To detect
subsequent WDT events, the flag must be cleared in
software.
Note: For more information, see Section 29.0
“Electrical Characteristics”.
Note: The CLRWDT and PWRSAV instructions
clear the prescaler and postscaler counts
when executed.
2009 Microchip Technology Inc. DS39897C-page 295
PIC24FJ256GB110 FAMILY
26.3.1 WINDOWED OPERATION
The Watchdog Timer has an optional Fixed Window
mode of operation. In this Windowed mode, CLRWDT
instructions can only reset the WDT during the last 1/4
of the programmed WDT period. A CLRWDT instruction
executed before that window causes a WDT Reset,
similar to a WDT time-out.
Windowed WDT mode is enabled by programming the
WINDIS Configuration bit (CW1<6>) to ‘0’.
26.3.2 CONTROL REGISTER
The WDT is enabled or disabled by the FWDTEN
Configuration bit. When the FWDTEN Configuration bit
is set, the WDT is always enabled.
The WDT can be optionally controlled in software when
the FWDTEN Configuration bit has been programmed
to ‘0’. The WDT is enabled in software by setting the
SWDTEN control bit (RCON<5>). The SWDTEN
control bit is cleared on any device Reset. The software
WDT option allows the user to enable the WDT for
critical code segments and disable the WDT during
non-critical segments for maximum power savings.
FIGURE 26-2: WDT BLOCK DIAGRAM
26.4 Program Verification and
Code Protection
PIC24FJ256GB110 family devices provide two complimentary
methods to protect application code from
overwrites and erasures. These also help to protect the
device from inadvertent configuration changes during
run time.
26.4.1 GENERAL SEGMENT PROTECTION
For all devices in the PIC24FJ256GB110 family, the
on-chip program memory space is treated as a single
block, known as the General Segment (GS). Code protection
for this block is controlled by one Configuration
bit, GCP. This bit inhibits external reads and writes to
the program memory space. It has no direct effect in
normal execution mode.
Write protection is controlled by the GWRP bit in the
Configuration Word. When GWRP is programmed to
‘0’, internal write and erase operations to program
memory are blocked.
26.4.2 CODE SEGMENT PROTECTION
In addition to global General Segment protection, a
separate subrange of the program memory space can
be individually protected against writes and erases.
This area can be used for many purposes where a separate
block of write and erase protected code is
needed, such as bootloader applications. Unlike
common boot block implementations, the specially
protected segment in PIC24FJ256GB110 family
devices can be located by the user anywhere in the
program space, and configured in a wide range of
sizes.
Code segment protection provides an added level of
protection to a designated area of program memory, by
disabling the NVM safety interlock whenever a write or
erase address falls within a specified range. They do
not override General Segment protection controlled by
the GCP or GWRP bits. For example, if GCP and
GWRP are enabled, enabling segmented code protection
for the bottom half of program memory does not
undo General Segment protection for the top half.
LPRC Input WDT Overflow
Wake from Sleep
31 kHz
Prescaler Postscaler
FWPSA
SWDTEN
FWDTEN
Reset
All Device Resets
Sleep or Idle Mode
LPRC Control
CLRWDT Instr.
PWRSAV Instr.
(5-bit/7-bit) 1:1 to 1:32.768
WDTPS<3:0>
1 ms/4 ms
Exit Sleep or
Idle Mode
WDT
Counter
Transition to
New Clock Source
PIC24FJ256GB110 FAMILY
DS39897C-page 296 2009 Microchip Technology Inc.
The size and type of protection for the segmented code
range are configured by the WPFPx, WPEND, WPCFG
and WPDIS bits in Configuration Word 3. Code segment
protection is enabled by programming the WPDIS
bit (= 0). The WPFP bits specify the size of the segment
to be protected, by specifying the 512-word code page
that is the start or end of the protected segment. The
specified region is inclusive, therefore, this page will
also be protected.
The WPEND bit determines if the protected segment
uses the top or bottom of the program space as a
boundary. Programming WPEND (= 0) sets the bottom
of program memory (000000h) as the lower boundary
of the protected segment. Leaving WPEND unprogrammed
(= 1) protects the specified page through the
last page of implemented program memory, including
the Configuration Word locations.
A separate bit, WPCFG, is used to independently protect
the last page of program space, including the Flash Configuration
Words. Programming WPCFG (= 0) protects
the last page regardless of the other bit settings. This
may be useful in circumstances where write protection is
needed for both a code segment in the bottom of
memory, as well as the Flash Configuration Words.
The various options for segment code protection are
shown in Table 26-2.
26.4.3 CONFIGURATION REGISTER
PROTECTION
The Configuration registers are protected against
inadvertent or unwanted changes or reads in two ways.
The primary protection method is the same as that of
the RP registers – shadow registers contain a complimentary
value which is constantly compared with the
actual value.
To safeguard against unpredictable events, Configuration
bit changes resulting from individual cell level
disruptions (such as ESD events) will cause a parity
error and trigger a device Reset.
The data for the Configuration registers is derived from
the Flash Configuration Words in program memory.
When the GCP bit is set, the source data for device
configuration is also protected as a consequence. Even
if General Segment protection is not enabled, the
device configuration can be protected by using the
appropriate code cement protection setting.
TABLE 26-2: SEGMENT CODE PROTECTION CONFIGURATION OPTIONS
Segment Configuration Bits
Write/Erase Protection of Code Segment
WPDIS WPEND WPCFG
1 X x No additional protection enabled; all program memory protection configured by
GCP and GWRP
0 1 x Addresses from first address of code page defined by WPFP<7:0> through end
of implemented program memory (inclusive) write/erase protected, including
Flash Configuration Words
0 0 1 Address 000000h through last address of code page defined by WPFP<7:0>
(inclusive) write/erase protected
0 0 0 Address 000000h through last address of code page defined by WPFP<7:0>
(inclusive) write/erase protected, and the last page is also write/erase protected.
2009 Microchip Technology Inc. DS39897C-page 297
PIC24FJ256GB110 FAMILY
26.5 JTAG Interface
PIC24FJ256GB110 family devices implement a JTAG
interface, which supports boundary scan device
testing.
26.6 In-Circuit Serial Programming
PIC24FJ256GB110 family microcontrollers can be serially
programmed while in the end application circuit.
This is simply done with two lines for clock (PGECx)
and data (PGEDx) and three other lines for power,
ground and the programming voltage. This allows customers
to manufacture boards with unprogrammed
devices and then program the microcontroller just
before shipping the product. This also allows the most
recent firmware or a custom firmware to be
programmed.
26.7 In-Circuit Debugger
When MPLAB® ICD 2 is selected as a debugger, the
in-circuit debugging functionality is enabled. This function
allows simple debugging functions when used with
MPLAB IDE. Debugging functionality is controlled
through the PGECx (Emulation/Debug Clock) and
PGEDx (Emulation/Debug Data) pins.
To use the in-circuit debugger function of the device,
the design must implement ICSP connections to
MCLR, VDD, VSS and the PGECx/PGEDx pin pair designated
by the ICS Configuration bits. In addition, when
the feature is enabled, some of the resources are not
available for general use. These resources include the
first 80 bytes of data RAM and two I/O pins.
PIC24FJ256GB110 FAMILY
DS39897C-page 298 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 299
PIC24FJ256GB110 FAMILY
27.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C for Various Device Families
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
27.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either C or assembly)
• One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
• Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
PIC24FJ256GB110 FAMILY
DS39897C-page 300 2009 Microchip Technology Inc.
27.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal controllers.
These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
27.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, preprocessor,
and one-step driver, and can run on multiple
platforms.
27.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
27.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
27.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility
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27.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulating
the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The software
simulator offers the flexibility to develop and
debug code outside of the hardware laboratory environment,
making it an excellent, economical software
development tool.
27.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with incircuit
debugger systems (RJ11) or with the new highspeed,
noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers significant
advantages over competitive emulators including
low-cost, full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, a ruggedized
probe interface and long (up to three meters) interconnection
cables.
27.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Microchip's
most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Signal
Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcontrollers
and dsPIC® DSCs with the powerful, yet easyto-
use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is connected
to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
27.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and programming
of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to implement
in-circuit debugging and In-Circuit Serial Programming
™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
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27.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use interface
for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcontrollers.
In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a breakpoint,
the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
27.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modular,
detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
27.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully functional
systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/
development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
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28.0 INSTRUCTION SET SUMMARY
The PIC24F instruction set adds many enhancements
to the previous PIC® MCU instruction sets, while maintaining
an easy migration from previous PIC MCU
instruction sets. Most instructions are a single program
memory word. Only three instructions require two
program memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode, which specifies the instruction
type and one or more operands, which further specify
the operation of the instruction. The instruction set is
highly orthogonal and is grouped into four basic
categories:
• Word or byte-oriented operations
• Bit-oriented operations
• Literal operations
• Control operations
Table 28-1 shows the general symbols used in
describing the instructions. The PIC24F instruction set
summary in Table 28-2 lists all the instructions, along
with the status flags affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand which is typically a
register ‘Wb’ without any address modifier
• The second source operand which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value, ‘f’
• The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
Most bit-oriented instructions (including simple
rotate/shift instructions) have two operands:
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register
(specified by a literal value or indirectly by the
contents of register, ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand which is a register ‘Wb’
without any address modifier
• The second source operand which is a literal
value
• The destination of the result (only if not the same
as the first source operand) which is typically a
register ‘Wd’ with or without an address modifier
The control instructions may use some of the following
operands:
• A program memory address
• The mode of the table read and table write
instructions
All instructions are a single word, except for certain
double-word instructions, which were made double-
word instructions so that all the required information
is available in these 48 bits. In the second word, the
8 MSbs are ‘0’s. If this second word is executed as an
instruction (by itself), it will execute as a NOP.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruction.
In these cases, the execution takes two instruction
cycles, with the additional instruction cycle(s) executed
as a NOP. Notable exceptions are the BRA (unconditional/
computed branch), indirect CALL/GOTO, all table
reads and writes, and RETURN/RETFIE instructions,
which are single-word instructions but take two or three
cycles.
Certain instructions that involve skipping over the subsequent
instruction require either two or three cycles if
the skip is performed, depending on whether the
instruction being skipped is a single-word or two-word
instruction. Moreover, double-word moves require two
cycles. The double-word instructions execute in two
instruction cycles.
Note: This chapter is a brief summary of the
PIC24F instruction set architecture, and is
not intended to be a comprehensive
reference source.
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DS39897C-page 304 2009 Microchip Technology Inc.
TABLE 28-1: SYMBOLS USED IN OPCODE DESCRIPTIONS
Field Description
#text Means literal defined by “text”
(text) Means “content of text”
[text] Means “the location addressed by text”
{ } Optional field or operation
Register bit field
.b Byte mode selection
.d Double-Word mode selection
.S Shadow register select
.w Word mode selection (default)
bit4 4-bit bit selection field (used in word addressed instructions) {0...15}
C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr Absolute address, label or expression (resolved by the linker)
f File register address {0000h...1FFFh}
lit1 1-bit unsigned literal {0,1}
lit4 4-bit unsigned literal {0...15}
lit5 5-bit unsigned literal {0...31}
lit8 8-bit unsigned literal {0...255}
lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal {0...16383}
lit16 16-bit unsigned literal {0...65535}
lit23 23-bit unsigned literal {0...8388607}; LSB must be ‘0’
None Field does not require an entry, may be blank
PC Program Counter
Slit10 10-bit signed literal {-512...511}
Slit16 16-bit signed literal {-32768...32767}
Slit6 6-bit signed literal {-16...16}
Wb Base W register {W0..W15}
Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor working register pair (direct addressing)
Wn One of 16 working registers {W0..W15}
Wnd One of 16 destination working registers {W0..W15}
Wns One of 16 source working registers {W0..W15}
WREG W0 (working register used in file register instructions)
Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
2009 Microchip Technology Inc. DS39897C-page 305
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TABLE 28-2: INSTRUCTION SET OVERVIEW
Assembly
Mnemonic Assembly Syntax Description # of
Words
# of
Cycles
Status Flags
Affected
ADD ADD f f = f + WREG 1 1 C, DC, N, OV, Z
ADD f,WREG WREG = f + WREG 1 1 C, DC, N, OV, Z
ADD #lit10,Wn Wd = lit10 + Wd 1 1 C, DC, N, OV, Z
ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C, DC, N, OV, Z
ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C, DC, N, OV, Z
ADDC ADDC f f = f + WREG + (C) 1 1 C, DC, N, OV, Z
ADDC f,WREG WREG = f + WREG + (C) 1 1 C, DC, N, OV, Z
ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C, DC, N, OV, Z
ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C, DC, N, OV, Z
ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C, DC, N, OV, Z
AND AND f f = f .AND. WREG 1 1 N, Z
AND f,WREG WREG = f .AND. WREG 1 1 N, Z
AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N, Z
AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N, Z
AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N, Z
ASR ASR f f = Arithmetic Right Shift f 1 1 C, N, OV, Z
ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C, N, OV, Z
ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C, N, OV, Z
ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N, Z
ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N, Z
BCLR BCLR f,#bit4 Bit Clear f 1 1 None
BCLR Ws,#bit4 Bit Clear Ws 1 1 None
BRA BRA C,Expr Branch if Carry 1 1 (2) None
BRA GE,Expr Branch if Greater than or Equal 1 1 (2) None
BRA GEU,Expr Branch if Unsigned Greater than or Equal 1 1 (2) None
BRA GT,Expr Branch if Greater than 1 1 (2) None
BRA GTU,Expr Branch if Unsigned Greater than 1 1 (2) None
BRA LE,Expr Branch if Less than or Equal 1 1 (2) None
BRA LEU,Expr Branch if Unsigned Less than or Equal 1 1 (2) None
BRA LT,Expr Branch if Less than 1 1 (2) None
BRA LTU,Expr Branch if Unsigned Less than 1 1 (2) None
BRA N,Expr Branch if Negative 1 1 (2) None
BRA NC,Expr Branch if Not Carry 1 1 (2) None
BRA NN,Expr Branch if Not Negative 1 1 (2) None
BRA NOV,Expr Branch if Not Overflow 1 1 (2) None
BRA NZ,Expr Branch if Not Zero 1 1 (2) None
BRA OV,Expr Branch if Overflow 1 1 (2) None
BRA Expr Branch Unconditionally 1 2 None
BRA Z,Expr Branch if Zero 1 1 (2) None
BRA Wn Computed Branch 1 2 None
BSET BSET f,#bit4 Bit Set f 1 1 None
BSET Ws,#bit4 Bit Set Ws 1 1 None
BSW BSW.C Ws,Wb Write C bit to Ws 1 1 None
BSW.Z Ws,Wb Write Z bit to Ws 1 1 None
BTG BTG f,#bit4 Bit Toggle f 1 1 None
BTG Ws,#bit4 Bit Toggle Ws 1 1 None
BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1
(2 or 3)
None
BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1
(2 or 3)
None
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DS39897C-page 306 2009 Microchip Technology Inc.
BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1
(2 or 3)
None
BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1
(2 or 3)
None
BTST BTST f,#bit4 Bit Test f 1 1 Z
BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb Bit Test Ws to C 1 1 C
BTST.Z Ws,Wb Bit Test Ws to Z 1 1 Z
BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z
CALL CALL lit23 Call Subroutine 2 2 None
CALL Wn Call Indirect Subroutine 1 2 None
CLR CLR f f = 0x0000 1 1 None
CLR WREG WREG = 0x0000 1 1 None
CLR Ws Ws = 0x0000 1 1 None
CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO, Sleep
COM COM f f = f 1 1 N, Z
COM f,WREG WREG = f 1 1 N, Z
COM Ws,Wd Wd = Ws 1 1 N, Z
CP CP f Compare f with WREG 1 1 C, DC, N, OV, Z
CP Wb,#lit5 Compare Wb with lit5 1 1 C, DC, N, OV, Z
CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C, DC, N, OV, Z
CP0 CP0 f Compare f with 0x0000 1 1 C, DC, N, OV, Z
CP0 Ws Compare Ws with 0x0000 1 1 C, DC, N, OV, Z
CPB CPB f Compare f with WREG, with Borrow 1 1 C, DC, N, OV, Z
CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C, DC, N, OV, Z
CPB Wb,Ws Compare Wb with Ws, with Borrow
(Wb – Ws – C)
1 1 C, DC, N, OV, Z
CPSEQ CPSEQ Wb,Wn Compare Wb with Wn, Skip if = 1 1
(2 or 3)
None
CPSGT CPSGT Wb,Wn Compare Wb with Wn, Skip if > 1 1
(2 or 3)
None
CPSLT CPSLT Wb,Wn Compare Wb with Wn, Skip if < 1 1
(2 or 3)
None
CPSNE CPSNE Wb,Wn Compare Wb with Wn, Skip if 1 1
(2 or 3)
None
DAW DAW.b Wn Wn = Decimal Adjust Wn 1 1 C
DEC DEC f f = f –1 1 1 C, DC, N, OV, Z
DEC f,WREG WREG = f –1 1 1 C, DC, N, OV, Z
DEC Ws,Wd Wd = Ws – 1 1 1 C, DC, N, OV, Z
DEC2 DEC2 f f = f – 2 1 1 C, DC, N, OV, Z
DEC2 f,WREG WREG = f – 2 1 1 C, DC, N, OV, Z
DEC2 Ws,Wd Wd = Ws – 2 1 1 C, DC, N, OV, Z
DISI DISI #lit14 Disable Interrupts for k Instruction Cycles 1 1 None
DIV DIV.SW Wm,Wn Signed 16/16-bit Integer Divide 1 18 N, Z, C, OV
DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N, Z, C, OV
DIV.UW Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N, Z, C, OV
DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N, Z, C, OV
EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None
FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C
FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic Assembly Syntax Description # of
Words
# of
Cycles
Status Flags
Affected
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GOTO GOTO Expr Go to Address 2 2 None
GOTO Wn Go to Indirect 1 2 None
INC INC f f = f + 1 1 1 C, DC, N, OV, Z
INC f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z
INC Ws,Wd Wd = Ws + 1 1 1 C, DC, N, OV, Z
INC2 INC2 f f = f + 2 1 1 C, DC, N, OV, Z
INC2 f,WREG WREG = f + 2 1 1 C, DC, N, OV, Z
INC2 Ws,Wd Wd = Ws + 2 1 1 C, DC, N, OV, Z
IOR IOR f f = f .IOR. WREG 1 1 N, Z
IOR f,WREG WREG = f .IOR. WREG 1 1 N, Z
IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N, Z
IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N, Z
IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N, Z
LNK LNK #lit14 Link Frame Pointer 1 1 None
LSR LSR f f = Logical Right Shift f 1 1 C, N, OV, Z
LSR f,WREG WREG = Logical Right Shift f 1 1 C, N, OV, Z
LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C, N, OV, Z
LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N, Z
LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N, Z
MOV MOV f,Wn Move f to Wn 1 1 None
MOV [Wns+Slit10],Wnd Move [Wns+Slit10] to Wnd 1 1 None
MOV f Move f to f 1 1 N, Z
MOV f,WREG Move f to WREG 1 1 N, Z
MOV #lit16,Wn Move 16-bit Literal to Wn 1 1 None
MOV.b #lit8,Wn Move 8-bit Literal to Wn 1 1 None
MOV Wn,f Move Wn to f 1 1 None
MOV Wns,[Wns+Slit10] Move Wns to [Wns+Slit10] 1 1
MOV Wso,Wdo Move Ws to Wd 1 1 None
MOV WREG,f Move WREG to f 1 1 N, Z
MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None
MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None
MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = Signed(Wb) * Signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = Signed(Wb) * Unsigned(Ws) 1 1 None
MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = Unsigned(Wb) * Signed(Ws) 1 1 None
MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = Unsigned(Wb) * Unsigned(Ws) 1 1 None
MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = Signed(Wb) * Unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = Unsigned(Wb) * Unsigned(lit5) 1 1 None
MUL f W3:W2 = f * WREG 1 1 None
NEG NEG f f = f + 1 1 1 C, DC, N, OV, Z
NEG f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z
NEG Ws,Wd Wd = Ws + 1 1 1 C, DC, N, OV, Z
NOP NOP No Operation 1 1 None
NOPR No Operation 1 1 None
POP POP f Pop f from Top-of-Stack (TOS) 1 1 None
POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None
POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd+1) 1 2 None
POP.S Pop Shadow Registers 1 1 All
PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None
PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None
PUSH.D Wns Push W(ns):W(ns+1) to Top-of-Stack (TOS) 1 2 None
PUSH.S Push Shadow Registers 1 1 None
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic Assembly Syntax Description # of
Words
# of
Cycles
Status Flags
Affected
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PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO, Sleep
RCALL RCALL Expr Relative Call 1 2 None
RCALL Wn Computed Call 1 2 None
REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None
REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None
RESET RESET Software Device Reset 1 1 None
RETFIE RETFIE Return from Interrupt 1 3 (2) None
RETLW RETLW #lit10,Wn Return with Literal in Wn 1 3 (2) None
RETURN RETURN Return from Subroutine 1 3 (2) None
RLC RLC f f = Rotate Left through Carry f 1 1 C, N, Z
RLC f,WREG WREG = Rotate Left through Carry f 1 1 C, N, Z
RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C, N, Z
RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N, Z
RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N, Z
RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N, Z
RRC RRC f f = Rotate Right through Carry f 1 1 C, N, Z
RRC f,WREG WREG = Rotate Right through Carry f 1 1 C, N, Z
RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C, N, Z
RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N, Z
RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N, Z
RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N, Z
SE SE Ws,Wnd Wnd = Sign-Extended Ws 1 1 C, N, Z
SETM SETM f f = FFFFh 1 1 None
SETM WREG WREG = FFFFh 1 1 None
SETM Ws Ws = FFFFh 1 1 None
SL SL f f = Left Shift f 1 1 C, N, OV, Z
SL f,WREG WREG = Left Shift f 1 1 C, N, OV, Z
SL Ws,Wd Wd = Left Shift Ws 1 1 C, N, OV, Z
SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N, Z
SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N, Z
SUB SUB f f = f – WREG 1 1 C, DC, N, OV, Z
SUB f,WREG WREG = f – WREG 1 1 C, DC, N, OV, Z
SUB #lit10,Wn Wn = Wn – lit10 1 1 C, DC, N, OV, Z
SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C, DC, N, OV, Z
SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C, DC, N, OV, Z
SUBB SUBB f f = f – WREG – (C) 1 1 C, DC, N, OV, Z
SUBB f,WREG WREG = f – WREG – (C) 1 1 C, DC, N, OV, Z
SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C, DC, N, OV, Z
SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C, DC, N, OV, Z
SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C, DC, N, OV, Z
SUBR SUBR f f = WREG – f 1 1 C, DC, N, OV, Z
SUBR f,WREG WREG = WREG – f 1 1 C, DC, N, OV, Z
SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C, DC, N, OV, Z
SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C, DC, N, OV, Z
SUBBR SUBBR f f = WREG – f – (C) 1 1 C, DC, N, OV, Z
SUBBR f,WREG WREG = WREG – f – (C) 1 1 C, DC, N, OV, Z
SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C, DC, N, OV, Z
SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C, DC, N, OV, Z
SWAP SWAP.b Wn Wn = Nibble Swap Wn 1 1 None
SWAP Wn Wn = Byte Swap Wn 1 1 None
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic Assembly Syntax Description # of
Words
# of
Cycles
Status Flags
Affected
2009 Microchip Technology Inc. DS39897C-page 309
PIC24FJ256GB110 FAMILY
TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None
TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None
TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None
TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None
ULNK ULNK Unlink Frame Pointer 1 1 None
XOR XOR f f = f .XOR. WREG 1 1 N, Z
XOR f,WREG WREG = f .XOR. WREG 1 1 N, Z
XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N, Z
XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N, Z
XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N, Z
ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C, Z, N
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic Assembly Syntax Description # of
Words
# of
Cycles
Status Flags
Affected
PIC24FJ256GB110 FAMILY
DS39897C-page 310 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 311
PIC24FJ256GB110 FAMILY
29.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of the PIC24FJ256GB110 family electrical characteristics. Additional information will
be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the PIC24FJ256GB110 family are listed below. Exposure to these maximum rating
conditions for extended periods may affect device reliability. Functional operation of the device at these, or any other
conditions above the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +100°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)
Voltage on any digital only pin with respect to VSS .................................................................................. -0.3V to +6.0V
Voltage on VDDCORE with respect to VSS ................................................................................................. -0.3V to +3.0V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin (Note 1)................................................................................................................250 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 1)....................................................................................................200 mA
Note 1: Maximum allowable current is a function of device maximum power dissipation (see Table 29-1).
†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
PIC24FJ256GB110 FAMILY
DS39897C-page 312 2009 Microchip Technology Inc.
29.1 DC Characteristics
FIGURE 29-1: PIC24FJ256GB110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 29-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ256GB110 Family:
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – IOH) PD PINT + PI/O W
I/O Pin Power Dissipation:
PI/O = ({VDD – VOH} x IOH) + (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
Frequency
Voltage (VDDCORE)(1)
3.00V
2.00V
32 MHz
2.75V
2.50V
2.25V
2.75V
16 MHz
2.25V
For frequencies between 16 MHz and 32 MHz, FMAX = (64 MHz/V) * (VDDCORE – 2V) + 16 MHz.
Note 1: When the voltage regulator is disabled, VDD and VDDCORE must be maintained so that
VDDCOREVDD3.6V.
PIC24FJXXXGB1XX
TABLE 29-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 14x14x1 mm TQFP JA 50.0 — °C/W (Note 1)
Package Thermal Resistance, 12x12x1 mm TQFP JA 69.4 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP JA 76.6 — °C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm QFN JA 28.0 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
2009 Microchip Technology Inc. DS39897C-page 313
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TABLE 29-3: DC CHARACTERISTICS: TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Operating Voltage
DC10 Supply Voltage
VDD 2.2 — 3.6 V Regulator enabled
VDD VDDCORE — 3.6 V Regulator disabled
VDDCORE 2.0 — 2.75 V Regulator disabled
DC12 VDR RAM Data Retention
Voltage(2)
1.5 — — V
DC16 VPOR VDD Start Voltage
To Ensure Internal
Power-on Reset Signal
VSS — — V
DC17 SVDD VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.05 — — V/ms 0-3.3V in 0.1s
0-2.5V in 60 ms
DC18 VBOR BOR Voltage on VDD
Transition. High-to-Low
— 2.05 — V Voltage regulator enabled
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: This is the limit to which VDD can be lowered without losing RAM data.
PIC24FJ256GB110 FAMILY
DS39897C-page 314 2009 Microchip Technology Inc.
TABLE 29-4: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC20 0.83 1.2 mA -40°C
2.0V(3)
1 MIPS
DC20a 0.83 1.2 mA +25°C
DC20b 0.83 1.2 mA +85°C
DC20d 1.1 1.7 mA -40°C
DC20e 1.1 1.7 mA +25°C 3.3V(4)
DC20f 1.1 1.7 mA +85°C
DC23 3.3 4.5 mA -40°C
2.0V(3)
4 MIPS
DC23a 3.3 4.5 mA +25°C
DC23b 3.3 4.5 mA +85°C
DC23d 4.3 6 mA -40°C
DC23e 4.3 6 mA +25°C 3.3V(4)
DC23f 4.3 6 mA +85°C
DC24 18.2 24 mA -40°C
2.5V(3)
16 MIPS
DC24a 18.2 24 mA +25°C
DC24b 18.2 24 mA +85°C
DC24d 18.2 24 mA -40°C
DC24e 18.2 24 mA +25°C 3.3V(4)
DC24f 18.2 24 mA +85°C
DC31 15.0 54 A -40°C
2.0V(3)
LPRC (31 kHz)
DC31a 15.0 54 A +25°C
DC31b 20.0 69 A +85°C
DC31d 57.0 96 A -40°C
DC31e 57.0 96 A +25°C 3.3V(4)
DC31f 95.0 145 A +85°C
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption. The test conditions for all IDD measurements are as follows: OSCI driven
with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.
MCLR = VDD; WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are
operational. No peripheral modules are operating and all of the Peripheral Module Disable (PMD) bits are set.
3: On-chip voltage regulator disabled (ENVREG tied to VSS).
4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out
Detect (BOD) are enabled.
2009 Microchip Technology Inc. DS39897C-page 315
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TABLE 29-5: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical(1) Max Units Conditions
Idle Current (IIDLE)(2)
DC40 220 310 A -40°C
2.0V(3)
1 MIPS
DC40a 220 310 A +25°C
DC40b 220 310 A +85°C
DC40d 300 390 A -40°C
DC40e 300 390 A +25°C 3.3V(4)
DC40f 300 420 A +85°C
DC43 0.85 1.1 mA -40°C
2.0V(3)
4 MIPS
DC43a 0.85 1.1 mA +25°C
DC43b 0.87 1.2 mA +85°C
DC43d 1.1 1.4 mA -40°C
DC43e 1.1 1.4 mA +25°C 3.3V(4)
DC43f 1.1 1.4 mA +85°C
DC47 4.4 5.6 mA -40°C
2.5V(3)
16 MIPS
DC47a 4.4 5.6 mA +25°C
DC47b 4.4 5.6 mA +85°C
DC47c 4.4 5.6 mA -40°C
DC47d 4.4 5.6 mA +25°C 3.3V(4)
DC47e 4.4 5.6 mA +85°C
DC50 1.1 1.4 mA -40°C
2.0V(3)
FRC (4 MIPS)
DC50a 1.1 1.4 mA +25°C
DC50b 1.1 1.4 mA +85°C
DC50d 1.4 1.8 mA -40°C
DC50e 1.4 1.8 mA +25°C 3.3V(4)
DC50f 1.4 1.8 mA +85°C
DC51 4.3 13 A -40°C
2.0V(3)
LPRC (31 kHz)
DC51a 4.5 13 A +25°C
DC51b 10 32 A +85°C
DC51d 44 77 A -40°C
DC51e 44 77 A +25°C 3.3V(4)
DC51f 70 132 A +85°C
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: Base IIDLE current is measured with the core off, OSCI driven with external square wave from rail to rail.
All I/O pins are configured as inputs and pulled to VDD. MCLR = VDD; WDT and FSCM are disabled. No
peripheral modules are operating and all of the Peripheral Module Disable (PMD) bits are set.
3: On-chip voltage regulator disabled (ENVREG tied to VSS).
4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out
Detect (BOD) are enabled.
PIC24FJ256GB110 FAMILY
DS39897C-page 316 2009 Microchip Technology Inc.
TABLE 29-6: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical(1) Max Units Conditions
Power-Down Current (IPD)(2)
DC60 0.1 1 A -40°C
2.0V(3)
Base Power-Down Current(5)
DC60a 0.15 1 A +25°C
DC60m 2.25 11 A +60°C
DC60b 3.7 18 A +85°C
DC60c 0.2 1.4 A -40°C
2.5V DC60d 0.25 1.4 A +25°C (3)
DC60n 2.6 16.5 A +60°C
DC60e 4.2 27 A +85°C
DC60f 3.6 10 A -40°C
3.3V(4) DC60g 4.0 10 A +25°C
DC60p 8.1 25.2 A +60°C
DC60h 11.0 36 A +85°C
DC61 1.75 3 A -40°C
2.0V(3)
Watchdog Timer Current: IWDT(5)
DC61a 1.75 3 A +25°C
DC61m 1.75 3 A +60°C
DC61b 1.75 3 A +85°C
DC61c 2.4 4 A -40°C
2.5V(3) DC61d 2.4 4 A +25°C
DC61n 2.4 4 A +60°C
DC61e 2.4 4 A +85°C
DC61f 2.8 5 A -40°C
3.3V(4) DC61g 2.8 5 A +25°C
DC61p 2.8 5 A +60°C
DC61b 2.8 5 A +85°C
Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. WDT, etc., are all switched off, PMSLP bit is clear, and the Peripheral Module Disable (PMD)
bits for all unused peripherals are set.
3: On-chip voltage regulator disabled (ENVREG tied to VSS).
4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out
Detect (BOD) are enabled.
5: The current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
2009 Microchip Technology Inc. DS39897C-page 317
PIC24FJ256GB110 FAMILY
DC62 2.5 7 A -40°C
2.0V(3)
RTCC + Timer1 w/32 kHz Crystal:
RTCC + ITI32(5)
DC62a 2.5 7 A +25°C
DC62m 3.0 7 A +60°C
DC62b 3.0 7 A +85°C
DC62c 2.8 7 A -40°C
2.5V DC62d 3.0 7 A +25°C (3)
DC62n 3.0 7 A +60°C
DC62e 3.0 7 A +85°C
DC62f 3.5 10 A -40°C
3.3V(4) DC62g 3.5 10 A +25°C
DC62p 4.0 10 A +60°C
DC62h 4.0 10 A +85°C
TABLE 29-6: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED)
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical(1) Max Units Conditions
Power-Down Current (IPD)(2)
Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. WDT, etc., are all switched off, PMSLP bit is clear, and the Peripheral Module Disable (PMD)
bits for all unused peripherals are set.
3: On-chip voltage regulator disabled (ENVREG tied to VSS).
4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out
Detect (BOD) are enabled.
5: The current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
PIC24FJ256GB110 FAMILY
DS39897C-page 318 2009 Microchip Technology Inc.
TABLE 29-7: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise
stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic Min Typ(1) Max Units Conditions
VIL Input Low Voltage(4)
DI10 I/O Pins with ST Buffer VSS — 0.2VDD V
DI11 I/O Pins with TTL Buffer VSS — 0.15 VDD V
DI15 MCLR VSS — 0.2VDD V
DI16 OSC1 (XT mode) VSS — 0.2VDD V
DI17 OSC1 (HS mode) VSS — 0.2VDD V
DI18 I/O Pins with I2C™ Buffer: VSS — 0.3VDD V
DI19 I/O Pins with SMBus Buffer: VSS — 0.8 V SMBus enabled
VIH Input High Voltage(4)
DI20 I/O Pins with ST Buffer:
with Analog Functions,
Digital Only
0.8 VDD
0.8 VDD
——
VDD
5.5
VV
DI21 I/O Pins with TTL Buffer:
with Analog Functions,
Digital Only
0.25 VDD + 0.8
0.25 VDD + 0.8
——
VDD
5.5
VV
DI25 MCLR 0.8 VDD — VDD V
DI26 OSC1 (XT mode) 0.7 VDD — VDD V
DI27 OSC1 (HS mode) 0.7 VDD — VDD V
DI28 I/O Pins with I2C Buffer:
with Analog Functions,
Digital Only
0.7 VDD
0.7 VDD
——
VDD
5.5
VV
DI29 I/O Pins with SMBus Buffer:
with Analog Functions,
Digital Only
2.1
2.1
VDD
5.5
VV
2.5V VPIN VDD
DI30 ICNPU CNxx Pull-up Current 50 250 400 A VDD = 3.3V, VPIN = VSS
DI30A ICNPD CNxx Pull-Down Current — 80 — A VDD = 3.3V, VPIN = VDD
IIL Input Leakage Current(2,3)
DI50 I/O Ports — — +1 A VSS VPIN VDD,
Pin at high-impedance
DI51 Analog Input Pins — — +1 A VSS VPIN VDD,
Pin at high-impedance
DI52 USB Differential Pins
(D+, D-)
— — +1 A VUSB VDD
DI55 MCLR — — +1 A VSS VPIN VDD
DI56 OSC1 — — +1 A VSS VPIN VDD,
XT and HS modes
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: Refer to Table 1-4 for I/O pins buffer types.
2009 Microchip Technology Inc. DS39897C-page 319
PIC24FJ256GB110 FAMILY
TABLE 29-8: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic Min Typ(1) Max Units Conditions
VOL Output Low Voltage
DO10 I/O Ports — — 0.4 V IOL = 8.5 mA, VDD = 3.6V
— — 0.4 V IOL = 6.0 mA, VDD = 2.0V
DO16 OSC2/CLKO — — 0.4 V IOL = 8.5 mA, VDD = 3.6V
— — 0.4 V IOL = 6.0 mA, VDD = 2.0V
VOH Output High Voltage
DO20 I/O Ports 3.0 — — V IOH = -3.0 mA, VDD = 3.6V
2.4 — — V IOH = -6.0 mA, VDD = 3.6V
1.65 — — V IOH = -1.0 mA, VDD = 2.0V
1.4 — — V IOH = -3.0 mA, VDD = 2.0V
DO26 OSC2/CLKO 2.4 — — V IOH = -6.0 mA, VDD = 3.6V
1.4 — — V IOH = -3.0 mA, VDD = 2.0V
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
TABLE 29-9: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS
Standard Operating Conditions: 2.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Sym Characteristic Min Typ(1) Max Units Conditions
D130 EP Cell Endurance 10000 — — E/W -40C to +85C
D131 VPR VDD for Read VMIN — 3.6 V VMIN = Minimum operating
voltage
VPEW Supply Voltage for Self-Timed Writes
D132A VDDCORE 2.25 — 3.6 V
D132B VDD 2.35 — 3.6 V
D133A TIW Self-Timed Write Cycle Time — 3 — ms
D133B TIE Self-Timed Page Erase Time 40 — — ms
D134 TRETD Characteristic Retention 20 — — Year Provided no other
specifications are violated
D135 IDDP Supply Current during Programming — 7 — mA
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
PIC24FJ256GB110 FAMILY
DS39897C-page 320 2009 Microchip Technology Inc.
TABLE 29-10: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
Operating Conditions: -40°C < TA < +125°C (unless otherwise stated)
Param
No. Symbol Characteristics Min Typ Max Units Comments
VRGOUT Regulator Output Voltage — 2.5 — V
VBG Internal Band Gap Reference — 1.2 — V
CEFC External Filter Capacitor Value 4.7 10 — F Series resistance < 3 Ohm
recommended; < 5 Ohm required.
TVREG Regulator Start-up Time
— 10 — s PMSLP = 1, or any POR or BOR
— 190 — s Wake for sleep when PMSLP = 0
TBG Band Gap Reference Start-up
Time
— — 1 ms
2009 Microchip Technology Inc. DS39897C-page 321
PIC24FJ256GB110 FAMILY
29.2 AC Characteristics and Timing Parameters
The information contained in this section defines the PIC24FJ256GB110 family AC characteristics and timing parameters.
TABLE 29-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGURE 29-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
TABLE 29-12: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Operating voltage VDD range as described in Section 29.1 “DC Characteristics”.
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
DO50 COSC2 OSCO/CLKO pin — — 15 pF In XT and HS modes when
external clock is used to drive
OSCI.
DO56 CIO All I/O pins and OSCO — — 50 pF EC mode.
DO58 CB SCLx, SDAx — — 400 pF In I2C™ mode.
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL = 464
CL = 50 pF for all pins except OSCO
15 pF for OSCO output
Load Condition 1 – for all pins except OSCO Load Condition 2 – for OSCO
PIC24FJ256GB110 FAMILY
DS39897C-page 322 2009 Microchip Technology Inc.
FIGURE 29-3: EXTERNAL CLOCK TIMING
OSCI
CLKO
Q4 Q1 Q2 Q3 Q4 Q1
OS20
OS25
OS30 OS30
OS40 OS41
OS31 OS31
Q1 Q2 Q3 Q4 Q2 Q3
TABLE 29-13: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 2.50 to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic Min Typ(1) Max Units Conditions
OS10 FOSC External CLKI Frequency
(External clocks allowed
only in EC mode)
DC
4
——
32
48
MHz
MHz
EC
ECPLL
Oscillator Frequency 3
4
10
12
31
—————
10
8
32
32
33
MHz
MHz
MHz
MHz
kHz
XT
XTPLL
HS
HSPLL
SOSC
OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10
for FOSC value
OS25 TCY Instruction Cycle Time(2) 62.5 — DC ns
OS30 TosL,
TosH
External Clock in (OSCI)
High or Low Time
0.45 x TOSC — — ns EC
OS31 TosR,
TosF
External Clock in (OSCI)
Rise or Fall Time
— — 20 ns EC
OS40 TckR CLKO Rise Time(3) — 6 10 ns
OS41 TckF CLKO Fall Time(3) — 6 10 ns
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Instruction cycle period (TCY) equals two times the input oscillator time base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with
the device executing code. Exceeding these specified limits may result in an unstable oscillator operation
and/or higher than expected current consumption. All devices are tested to operate at “Min.” values with an
external clock applied to the OSCI/CLKI pin. When an external clock input is used, the “Max.” cycle time
limit is “DC” (no clock) for all devices.
3: Measurements are taken in EC mode. The CLKO signal is measured on the OSCO pin. CLKO is low for
the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
2009 Microchip Technology Inc. DS39897C-page 323
PIC24FJ256GB110 FAMILY
TABLE 29-14: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.0V TO 3.6V)
AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic(1) Min Typ(2) Max Units Conditions
OS50 FPLLI PLL Input Frequency
Range(2)
4 — 32 MHz ECPLL, HSPLL, XTPLL
modes
OS51 FSYS PLL Output Frequency
Range
95.76 — 96.24 MHz
OS52 TLOCK PLL Start-up Time
(Lock Time)
— — 200 s
OS53 DCLK CLKO Stability (Jitter) -0.25 — 0.25 %
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
TABLE 29-15: INTERNAL RC OSCILLATOR SPECIFICATIONS
AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic Min Typ Max Units Conditions
TFRC FRC Start-up Time — 15 — s
TLPRC LPRC Start-up Time — 40 — s
TABLE 29-16: INTERNAL RC OSCILLATOR ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise
stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Characteristic Min Typ Max Units Conditions
F20 FRC Accuracy@ 8 MHz(1) -2 — 2 % +25°C, 3.0V VDD 3.6V
-5 — 5 % -40°C TA +85°C,
3.0V VDD 3.6V
F21 LPRC Accuracy @ 31 kHz(2) -20 — 20 % -40°C TA +85°C,
3.0V VDD 3.6V
Note 1: Frequency calibrated at 25°C and 3.3V. OSCTUN bits can be used to compensate for temperature drift.
2: Change of LPRC frequency as VDD changes.
PIC24FJ256GB110 FAMILY
DS39897C-page 324 2009 Microchip Technology Inc.
FIGURE 29-4: CLKO AND I/O TIMING CHARACTERISTICS
Note: Refer to Figure 29-2 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
Old Value New Value
DI40
DO31
DO32
TABLE 29-17: CLKO AND I/O TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Sym Characteristic Min Typ(1) Max Units Conditions
DO31 TIOR Port Output Rise Time — 10 25 ns
DO32 TIOF Port Output Fall Time — 10 25 ns
DI35 TINP INTx pin High or Low
Time (output)
20 — — ns
DI40 TRBP CNx High or Low Time
(input)
2 — — TCY
Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
2009 Microchip Technology Inc. DS39897C-page 325
PIC24FJ256GB110 FAMILY
TABLE 29-18: ADC MODULE SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions: 2.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Device Supply
AD01 AVDD Module VDD Supply Greater of
VDD – 0.3
or 2.0
— Lesser of
VDD + 0.3
or 3.6
V
AD02 AVSS Module VSS Supply VSS – 0.3 — VSS + 0.3 V
Reference Inputs
AD05 VREFH Reference Voltage High AVSS + 1.7 — AVDD V
AD06 VREFL Reference Voltage Low AVSS — AVDD – 1.7 V
AD07 VREF Absolute Reference
Voltage
AVSS – 0.3 — AVDD + 0.3 V
Analog Input
AD10 VINH-VINL Full-Scale Input Span VREFL — VREFH V (Note 2)
AD11 VIN Absolute Input Voltage AVSS – 0.3 — AVDD + 0.3 V
AD12 VINL Absolute VINL Input
Voltage
AVSS – 0.3 AVDD/2 V
AD13 — Leakage Current — ±0.00
1
±0.610 A VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V,
Source Impedance = 2.5 k
AD17 RIN Recommended Impedance
of Analog Voltage Source
— — 2.5K 10-bit
ADC Accuracy
AD20b Nr Resolution — 10 — bits
AD21b INL Integral Nonlinearity — ±1 <±2 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD22b DNL Differential Nonlinearity — ±0.5 <±1 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD23b GERR Gain Error — ±1 ±3 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD24b EOFF Offset Error — ±1 ±2 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD25b — Monotonicity(1) — — — — Guaranteed
Note 1: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes.
2: Measurements taken with external VREF+ and VREF- used as the ADC voltage reference.
PIC24FJ256GB110 FAMILY
DS39897C-page 326 2009 Microchip Technology Inc.
TABLE 29-19: ADC CONVERSION TIMING REQUIREMENTS(1)
AC CHARACTERISTICS
Standard Operating Conditions: 2.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Clock Parameters
AD50 TAD ADC Clock Period 75 — — ns TCY = 75 ns, AD1CON3
in default state
AD51 tRC ADC Internal RC Oscillator
Period
— 250 — ns
Conversion Rate
AD55 tCONV Conversion Time — 12 — TAD
AD56 FCNV Throughput Rate — — 500 ksps AVDD > 2.7V
AD57 tSAMP Sample Time — 1 — TAD
Clock Parameters
AD61 tPSS Sample Start Delay from setting
Sample bit (SAMP)
2 — 3 TAD
Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
2009 Microchip Technology Inc. DS39897C-page 327
PIC24FJ256GB110 FAMILY
30.0 PACKAGING INFORMATION
30.1 Package Marking Information
64-Lead TQFP (10x10x1 mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
PIC24FJ256
GB106-I/
0920017
80-Lead TQFP (12x12x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC24FJ256GB
108-I/PT
0920017
PT e3
e3
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
e3
e3
XXXXXXXXXXX
64-Lead QFN (9x9x0.9 mm)
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
PIC24FJ256G
Example
B106-I/M4
0910017
e3
PIC24FJ256GB110 FAMILY
DS39897C-page 328 2009 Microchip Technology Inc.
100-Lead TQFP (12x12x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC24FJ256GB
110-I/PT
0920017
e3
100-Lead TQFP (14x14x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC24FJ256GB
110-I/PF
0920017
e3
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
e3
e3
2009 Microchip Technology Inc. DS39897C-page 329
PIC24FJ256GB110 FAMILY
30.2 Package Details
The following sections give the technical details of the packages.
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC24FJ256GB110 FAMILY
DS39897C-page 332 2009 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009 Microchip Technology Inc. DS39897C-page 333
PIC24FJ256GB110 FAMILY
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC24FJ256GB110 FAMILY
DS39897C-page 334 2009 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009 Microchip Technology Inc. DS39897C-page 335
PIC24FJ256GB110 FAMILY
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DS39897C-page 336 2009 Microchip Technology Inc.
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DS39897C-page 338 2009 Microchip Technology Inc.
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DS39897C-page 340 2009 Microchip Technology Inc.
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2009 Microchip Technology Inc. DS39897C-page 341
PIC24FJ256GB110 FAMILY
APPENDIX A: REVISION HISTORY
Revision A (October 2007)
Original data sheet for the PIC24FJ256GB110 family of
devices.
Revision B (March 2008)
Changes to Section 29.0 “Electrical Characteristics”
and minor edits to text throughout document.
Revision C (December 2009)
Updates all Pin Diagrams to reflect the correct order of
priority for multiplexed peripherals.
Adds packaging information for the new 64-pin QFN
package to Section 30.0 “Packaging Information”
and the Product Information System.
Updates Section 5.0 “Flash Program Memory” with
revised code examples in assembler, and new code
examples in C.
Updates Section 6.2 “Device Reset Times” with
revised information, particularly Table 6-3.
Adds the INTTREG register to Section 4.0 “Memory
Organization” and Section 7.0 “Interrupt
Controller”.
Makes several additions and changes to Section 10.0
“I/O Ports”, including:
• revision of Section 10.4.2.1 “Peripheral Pin
Select Function Priority”
• revisions to Table 10-3, “Selectable Output
Sources”
Makes several changes and additions to Section 18.0
“Universal Serial Bus with On-The-Go Support
(USB OTG)”, including:
• changes the name of the bit U1CON from
RESET to USBRST
• replaces the former Section 18.3 with
Section 18.1 “Hardware Configuration”, including
an expanded discussion of how to interface
the microcontroller to application in different USB
modes
Updates Section 21.0 “Programmable Cyclic Redundancy
Check (CRC) Generator” with new illustrations,
and a revised Section 21.1 “User Interface”.
Updates Section 22.0 “10-Bit High-Speed A/D Converter”
by changing all references to AD1CHS0, to
AD1CHS (as well as other locations in the document).
Also revises bit field descriptions in registers,
AD1CON3 (bits 7:0) and AD1CHS (bits 12:8).
Makes minor text edits to bit descriptions in Section 23.0
“Triple Comparator Module” (Register 23-1) and
Section 25.0 “Charge Time Measurement Unit
(CTMU)” (Register 25-1).
Updates Section 26.0 “Special Features” with
revised text on the operation of the regulator during
POR and Standby mode.
Updates Section 26.5 “JTAG Interface” to remove
references to programming via the interface.
Makes multiple additions and changes to Section 29.0
“Electrical Characteristics”, including:
• Addition of IPD specifications for operation at 60°C
• New DC characteristics of VBOR, VBG, TBG and
ICNPD
• Addition of new VPEW specification for VDDCORE
• New AC characteristics for internal oscillator
start-up time (TLPRC)
• Combination of all Internal RC accuracy
information into a single table
Makes other minor typographic corrections throughout
the text.
PIC24FJ256GB110 FAMILY
DS39897C-page 342 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 343
PIC24FJ256GB110 FAMILY
INDEX
A
A/D Converter
Analog Input Model ................................................... 275
Transfer Function...................................................... 275
AC Characteristics
ADC Conversion Timing ........................................... 326
CLKO and I/O Timing................................................ 324
Alternate Interrupt Vector Table (AIVT) .............................. 77
Assembler
MPASM Assembler................................................... 300
B
Block Diagrams
10-Bit High-Speed A/D Converter............................. 268
16-Bit Asynchronous Timer3 and Timer5 ................. 165
16-Bit Synchronous Timer2 and Timer4 ................... 165
16-Bit Timer1 Module................................................ 161
32-Bit Timer2/3 and Timer4/5 ................................... 164
Accessing Program Space Using Table
Operations .......................................................... 61
Addressable PMP Example ...................................... 248
Addressing for Table Registers................................... 63
BDT Mapping for Endpoint Buffering Modes ............ 212
CALL Stack Frame...................................................... 59
Comparator Voltage Reference ................................ 281
CPU Programmer’s Model .......................................... 35
CRC Module ............................................................. 263
CRC Shift Engine...................................................... 264
CTMU Connections and Internal Configuration
for Capacitance Measurement.......................... 283
CTMU Typical Connections and Internal
Configuration for Pulse Delay Generation ........ 284
CTMU Typical Connections and Internal
Configuration for Time Measurement ............... 284
Data Access From Program Space Address
Generation .......................................................... 60
I2C Module ................................................................ 192
Individual Comparator Configurations....................... 278
Input Capture ............................................................ 169
LCD Control .............................................................. 250
Legacy PMP Example............................................... 248
On-Chip Regulator Connections ............................... 293
Output Compare (16-Bit Mode)................................. 174
Output Compare (Double-Buffered
16-Bit PWM Mode) ........................................... 176
PCI24FJ256GB110 Family (General) ......................... 16
PIC24F CPU Core ...................................................... 34
PMP 8-Bit Multiplexed Address and
Data Application................................................ 250
PMP EEPROM (8-Bit Data) ...................................... 250
PMP Master Mode, Demultiplexed Addressing ........ 248
PMP Master Mode, Fully Multiplexed
Addressing........................................................ 249
PMP Master Mode, Partially Multiplexed
Addressing........................................................ 249
PMP Module Overview ............................................. 241
PMP Multiplexed Addressing .................................... 249
PMP Parallel EEPROM (16-Bit Data) ....................... 250
PMP Partially Multiplexed Addressing ...................... 249
PSV Operation............................................................ 62
Reset System.............................................................. 71
RTCC........................................................................ 251
Shared I/O Port Structure ......................................... 133
SPI Master, Frame Master Connection .................... 189
SPI Master, Frame Slave Connection ...................... 189
SPI Master/Slave Connection
(Enhanced Buffer Modes)................................. 188
SPI Master/Slave Connection (Standard Mode)....... 188
SPI Slave, Frame Master Connection ...................... 189
SPI Slave, Frame Slave Connection ........................ 189
SPIx Module (Enhanced Mode)................................ 183
SPIx Module (Standard Mode) ................................. 182
System Clock Diagram............................................. 121
Triple Comparator Module........................................ 277
UART (Simplified)..................................................... 199
USB OTG
Device Mode Power Modes.............................. 209
USB OTG Interrupt Funnel ....................................... 216
USB OTG Module..................................................... 208
USB PLL................................................................... 128
Watchdog Timer (WDT)............................................ 295
C
C Compilers
MPLAB C18.............................................................. 300
Charge Time Measurement Unit. See CTMU.
Code Examples
Basic Clock Switching Example ............................... 127
Configuring UART1 Input and Output
Functions (PPS) ............................................... 140
Erasing a Program Memory Block, ‘C’........................ 67
Erasing a Program Memory Block, Assembly ............ 66
Initiating a Programming Sequence, ‘C’ ..................... 68
Initiating a Programming Sequence, Assembly.......... 68
Loading the Write Buffers, ‘C’..................................... 68
Loading the Write Buffers, Assembly ......................... 67
Port Write/Read........................................................ 134
PWRSAV Instruction Syntax .................................... 131
Single-Word Flash Programming, ‘C’ ......................... 69
Single-Word Flash Programming, Assembly.............. 69
Code Protection................................................................ 295
Code Segment Protection ........................................ 295
Configuration Options....................................... 296
Configuration Protection........................................... 296
Configuration Bits ............................................................. 287
Core Features..................................................................... 11
CPU
Arithmetic Logic Unit (ALU) ........................................ 37
Control Registers........................................................ 36
Core Registers............................................................ 35
Programmer’s Model .................................................. 33
CRC
Setup Example ......................................................... 263
User Interface ........................................................... 264
CTMU
Measuring Capacitance............................................ 283
Measuring Time........................................................ 284
Pulse Delay and Generation..................................... 284
Customer Change Notification Service............................. 348
Customer Notification Service .......................................... 348
Customer Support............................................................. 348
PIC24FJ256GB110 FAMILY
DS39897C-page 344 2009 Microchip Technology Inc.
D
Data Memory
Address Space............................................................ 41
Memory Map ............................................................... 41
Near Data Space ........................................................ 42
SFR Space.................................................................. 42
Software Stack............................................................ 59
Space Organization .................................................... 42
DC Characteristics
I/O Pin Input Specifications....................................... 318
I/O Pin Output Specifications .................................... 319
Idle Current ............................................................... 315
Operating Current ..................................................... 314
Power-Down Current ................................................ 316
Program Memory Specifications ............................... 319
Development Support ....................................................... 299
Device Features (Summary)
100-Pin........................................................................15
64-Pin..........................................................................13
80-Pin..........................................................................14
Doze Mode........................................................................132
E
Electrical Characteristics
A/D Specifications..................................................... 325
Absolute Maximum Ratings ...................................... 311
External Clock........................................................... 322
Internal Voltage Regulator Specifications ................. 320
Load Conditions and Requirements for
Specifications.................................................... 321
PLL Clock Specifications .......................................... 323
Temperature and Voltage Specifications .................. 313
Thermal Conditions...................................................312
V/F Graph ................................................................. 312
ENVREG Pin..................................................................... 293
Equations
A/D Conversion Clock Period ................................... 274
Baud Rate Reload Calculation.................................. 193
Calculating the PWM Period ..................................... 176
Calculation for Maximum PWM Resolution............... 177
Estimating USB Transceiver Current
Consumption..................................................... 211
Relationship Between Device and SPI
Clock Speed...................................................... 190
RTCC Calibration...................................................... 260
UART Baud Rate with BRGH = 0 ............................. 200
UART Baud Rate with BRGH = 1 ............................. 200
Errata .................................................................................... 9
F
Flash Configuration Words.................................. 40, 287–291
Flash Program Memory....................................................... 63
and Table Instructions.................................................63
Enhanced ICSP Operation.......................................... 64
JTAG Operation .......................................................... 64
Programming Algorithm .............................................. 66
RTSP Operation.......................................................... 64
Single-Word Programming.......................................... 69
I
I/O Ports
Analog Port Pins Configuration................................. 134
Input Change Notification.......................................... 135
Open-Drain Configuration ......................................... 134
Parallel (PIO) ............................................................ 133
Peripheral Pin Select ................................................ 135
Pull-ups and Pull-downs ........................................... 135
I2C
Clock Rates .............................................................. 193
Reserved Addresses ................................................ 193
Setting Baud Rate as Bus Master............................. 193
Slave Address Masking ............................................ 193
Input Capture
32-Bit Mode .............................................................. 170
Capture Operations .................................................. 170
Synchronous and Trigger Modes.............................. 169
Input Capture with Dedicated Timers ............................... 169
Instruction Set
Overview................................................................... 305
Summary .................................................................. 303
Inter-Integrated Circuit. See I2C. ...................................... 191
Internet Address ............................................................... 348
Interrupt Vector Table (IVT) ................................................ 77
Interrupts
and Reset Sequence .................................................. 77
Control and Status Registers...................................... 80
Implemented Vectors.................................................. 79
Setup and Service Procedures................................. 119
Trap Vectors ............................................................... 78
Vector Table ............................................................... 78
IrDA Support ..................................................................... 201
J
JTAG Interface.................................................................. 297
M
Microchip Internet Web Site.............................................. 348
MPLAB ASM30 Assembler, Linker, Librarian ................... 300
MPLAB Integrated Development Environment
Software ................................................................... 299
MPLAB PM3 Device Programmer .................................... 302
MPLAB REAL ICE In-Circuit Emulator System ................ 301
MPLINK Object Linker/MPLIB Object Librarian ................ 300
N
Near Data Space ................................................................ 42
O
Oscillator Configuration
Clock Selection......................................................... 122
Clock Switching ........................................................ 126
Sequence ......................................................... 127
CPU Clocking Scheme ............................................. 122
Initial Configuration on POR..................................... 122
USB Operation ......................................................... 128
Special Considerations..................................... 129
Output Compare
32-Bit Mode .............................................................. 173
Synchronous and Trigger Modes.............................. 173
Output Compare with Dedicated Timers........................... 173
P
Packaging......................................................................... 327
Details....................................................................... 329
Marking..................................................................... 327
Parallel Master Port. See PMP. ........................................ 241
Peripheral Enable Bits ...................................................... 132
Peripheral Module Disable Bits......................................... 132
2009 Microchip Technology Inc. DS39897C-page 345
PIC24FJ256GB110 FAMILY
Peripheral Pin Select (PPS).............................................. 135
Available Peripherals and Pins ................................. 136
Configuration Control ................................................ 139
Considerations for Use ............................................. 140
Input Mapping ........................................................... 136
Mapping Exceptions.................................................. 139
Output Mapping ........................................................ 136
Peripheral Priority ..................................................... 136
Registers........................................................... 141–159
Pinout Descriptions ....................................................... 17–25
PMSLP Bit
and Wake-up Time.................................................... 294
POR
and On-Chip Voltage Regulator................................ 294
Power-Saving Features .................................................... 131
Clock Frequency and Clock Switching...................... 131
Instruction-Based Modes .......................................... 131
Idle .................................................................... 132
Sleep................................................................. 131
Power-up Requirements ................................................... 294
Product Identification System ........................................... 350
Program Memory
Access Using Table Instructions................................. 61
Address Construction.................................................. 59
Address Space............................................................ 39
Flash Configuration Words ......................................... 40
Memory Maps ............................................................. 39
Organization................................................................ 40
Program Space Visibility ............................................. 62
Program Space Visibility (PSV) .......................................... 62
Pulse-Width Modulation (PWM) Mode.............................. 175
Pulse-Width Modulation. See PWM.
PWM
Duty Cycle and Period .............................................. 176
R
Reader Response ............................................................. 349
Reference Clock Output.................................................... 129
Register Maps
A/D Converter ............................................................. 53
Comparators ............................................................... 56
CPU Core.................................................................... 43
CRC ............................................................................ 56
CTMU.......................................................................... 53
I2C............................................................................... 49
ICN.............................................................................. 44
Input Capture .............................................................. 47
Interrupt Controller ...................................................... 45
NVM............................................................................ 58
Output Compare ......................................................... 48
Pad Configuration ....................................................... 52
Parallel Master/Slave Port .......................................... 55
Peripheral Pin Select .................................................. 57
PMD............................................................................ 58
PORTA........................................................................ 51
PORTB........................................................................ 51
PORTC ....................................................................... 51
PORTD ....................................................................... 51
PORTE........................................................................ 52
PORTF........................................................................ 52
PORTG ....................................................................... 52
RTCC.......................................................................... 56
SPI .............................................................................. 50
System........................................................................ 58
Timers ......................................................................... 46
UART .......................................................................... 50
USB OTG.................................................................... 54
Registers
AD1CHS (A/D Input Select)...................................... 272
AD1CON1 (A/D Control 1)........................................ 269
AD1CON2 (A/D Control 2)........................................ 270
AD1CON3 (A/D Control 3)........................................ 271
AD1CSSL (A/D Input Scan Select, Low) .................. 274
AD1PCFGH (A/D Port Configuration, High) ............. 273
AD1PCFGL (A/D Port Configuration, Low)............... 273
ALCFGRPT (Alarm Configuration) ........................... 255
ALMINSEC (Alarm Minutes and Seconds Value)..... 259
ALMTHDY (Alarm Month and Day Value) ................ 258
ALWDHR (Alarm Weekday and Hours Value) ......... 259
BDnSTAT Prototype (Buffer Descriptor n
Status, CPU Mode)........................................... 215
BDnSTAT Prototype (Buffer Descriptor n
Status, USB Mode)........................................... 214
CLKDIV (Clock Divider) ............................................ 125
CMSTAT (Comparator Status) ................................. 280
CMxCON (Comparator x Control) ............................ 279
CORCON (CPU Control) ............................................ 37
CORCON (CPU Core Control) ................................... 81
CRCCON (CRC Control) .......................................... 265
CRCXOR (CRC XOR Polynomial) ........................... 266
CTMUCON (CTMU Control)..................................... 285
CTMUICON (CTMU Current Control)....................... 286
CVRCON (Comparator Voltage
Reference Control) ........................................... 282
CW1 (Flash Configuration Word 1) .......................... 288
CW2 (Flash Configuration Word 2) .......................... 290
CW3 (Flash Configuration Word 3) .......................... 291
DEVID (Device ID).................................................... 292
DEVREV (Device Revision)...................................... 292
I2CxCON (I2Cx Control)........................................... 194
I2CxMSK (I2Cx Slave Mode Address Mask)............ 198
I2CxSTAT (I2Cx Status) ........................................... 196
ICxCON1 (Input Capture x Control 1)....................... 171
ICxCON2 (Input Capture x Control 2)....................... 172
IEC0 (Interrupt Enable Control 0) ............................... 90
IEC1 (Interrupt Enable Control 1) ............................... 91
IEC2 (Interrupt Enable Control 2) ............................... 93
IEC3 (Interrupt Enable Control 3) ............................... 94
IEC4 (Interrupt Enable Control 4) ............................... 95
IEC5 (Interrupt Enable Control 5) ............................... 96
IFS0 (Interrupt Flag Status 0) ..................................... 84
IFS1 (Interrupt Flag Status 1) ..................................... 85
IFS2 (Interrupt Flag Status 2) ..................................... 86
IFS3 (Interrupt Flag Status 3) ..................................... 87
IFS4 (Interrupt Flag Status 4) ..................................... 88
IFS5 (Interrupt Flag Status 5) ..................................... 89
INTCON1 (Interrupt Control 1) ................................... 82
INTCON2 (Interrupt Control 2) ................................... 83
INTTREG (Interrupt Control and Status) .................. 118
IPC0 (Interrupt Priority Control 0) ............................... 97
IPC1 (Interrupt Priority Control 1) ............................... 98
IPC10 (Interrupt Priority Control 10) ......................... 107
IPC11 (Interrupt Priority Control 11) ......................... 108
IPC12 (Interrupt Priority Control 12) ......................... 109
IPC13 (Interrupt Priority Control 13) ......................... 110
IPC15 (Interrupt Priority Control 15) ......................... 111
IPC16 (Interrupt Priority Control 16) ......................... 112
IPC18 (Interrupt Priority Control 18) ......................... 113
IPC19 (Interrupt Priority Control 19) ......................... 113
IPC2 (Interrupt Priority Control 2) ............................... 99
IPC20 (Interrupt Priority Control 20) ......................... 114
IPC21 (Interrupt Priority Control 21) ......................... 115
IPC22 (Interrupt Priority Control 22) ......................... 116
IPC23 (Interrupt Priority Control 23) ......................... 117
PIC24FJ256GB110 FAMILY
DS39897C-page 346 2009 Microchip Technology Inc.
IPC3 (Interrupt Priority Control 3) ............................. 100
IPC4 (Interrupt Priority Control 4) ............................. 101
IPC5 (Interrupt Priority Control 5) ............................. 102
IPC6 (Interrupt Priority Control 6) ............................. 103
IPC7 (Interrupt Priority Control 7) ............................. 104
IPC8 (Interrupt Priority Control 8) ............................. 105
IPC9 (Interrupt Priority Control 9) ............................. 106
MINSEC (RTCC Minutes and Seconds Value) .........257
MTHDY (RTCC Month and Day Value) .................... 256
NVMCON (Flash Memory Control) ............................. 65
OCxCON1 (Output Compare x Control 1) ................ 178
OCxCON2 (Output Compare x Control 2) ................ 179
OSCCON (Oscillator Control) ................................... 123
OSCTUN (FRC Oscillator Tune)............................... 126
PADCFG1 (Pad Configuration Control) .................... 247
PADCFG1 (Pad Configuration)................................. 254
PMADDR (PMP Address) ......................................... 245
PMAEN (PMP Enable).............................................. 245
PMCON (PMP Control) ............................................. 242
PMMODE (Parallel Port Mode)................................. 244
PMSTAT (PMP Status) ............................................. 246
RCFGCAL (RTCC Calibration
and Configuration) ............................................ 253
RCON (Reset Control) ................................................ 72
REFOCON (Reference Oscillator Control)................ 130
RPINR0 (PPS Input 0) .............................................. 141
RPINR1 (PPS Input 1) .............................................. 141
RPINR10 (PPS Input 10) .......................................... 145
RPINR11 (PPS Input 11) .......................................... 145
RPINR15 (PPS Input 15) .......................................... 146
RPINR17 (PPS Input 17) .......................................... 146
RPINR18 (PPS Input 18) .......................................... 147
RPINR19 (PPS Input 19) .......................................... 147
RPINR2 (PPS Input 2) .............................................. 142
RPINR20 (PPS Input 20) .......................................... 148
RPINR21 (PPS Input 21) .......................................... 148
RPINR22 (PPS Input 22) .......................................... 149
RPINR23 (PPS Input 23) .......................................... 149
RPINR27 (PPS Input 27) .......................................... 150
RPINR28 (PPS Input 28) .......................................... 150
RPINR29 (PPS Input 29) .......................................... 151
RPINR3 (PPS Input 3) ...................................... 142, 143
RPINR7 (PPS Input 7) .............................................. 143
RPINR8 (PPS Input 8) .............................................. 144
RPINR9 (PPS Input 9) .............................................. 144
RPOR0 (PPS Output 0) ............................................ 151
RPOR1 (PPS Output 1) ............................................ 152
RPOR10 (PPS Output 10) ........................................ 156
RPOR11 (PPS Output 11) ........................................ 157
RPOR12 (PPS Output 12) ........................................ 157
RPOR13 (PPS Output 13) ........................................ 158
RPOR14 (PPS Output 14) ........................................ 158
RPOR15 (PPS Output 15) ........................................ 159
RPOR2 (PPS Output 2) ............................................ 152
RPOR3 (PPS Output 3) ............................................ 153
RPOR5 (PPS Output 5) ............................................ 154
RPOR6 (PPS Output 6) ............................................ 154
RPOR7 (PPS Output 7) ............................................ 155
RPOR8 (PPS Output 8) ............................................ 155
RPOR9 (PPS Output 9) ............................................ 156
SPIxCON1 (SPIx Control 1)...................................... 186
SPIxCON2 (SPIx Control 2)...................................... 187
SPIxSTAT (SPIx Status) ........................................... 184
SR (ALU STATUS) ............................................... 36, 81
T1CON (Timer1 Control)........................................... 162
TxCON (Timer2 and Timer4 Control) ....................... 166
TyCON (Timer3 and Timer5 Control) ....................... 167
U1ADDR (USB Address) .......................................... 228
U1CNFG1 (USB Configuration 1)............................. 229
U1CNFG2 (USB Configuration 2)............................. 230
U1CON (USB Control, Device Mode)....................... 226
U1CON (USB Control, Host Mode) .......................... 227
U1EIE (USB Error Interrupt Enable) ......................... 237
U1EIR (USB Error Interrupt Status).......................... 236
U1EPn (USB Endpoint n Control)............................. 238
U1IE (USB Interrupt Enable) .................................... 235
U1IR (USB Interrupt Status, Device Mode) .............. 233
U1IR (USB Interrupt Status, Host Mode).................. 234
U1OTGCON (USB OTG Control) ............................. 223
U1OTGIE (USB OTG Interrupt Enable).................... 232
U1OTGIR (USB OTG Interrupt Status)..................... 231
U1OTGSTAT (USB OTG Status) ............................. 222
U1PWMCON USB (VBUS PWM
Generator Control)............................................ 239
U1PWRC (USB Power Control)................................ 224
U1SOF (USB OTG Start-Of-Token Threshold) ........ 229
U1STAT (USB Status) .............................................. 225
U1TOK (USB Token) ................................................ 228
UxMODE (UARTx Mode).......................................... 202
UxSTA (UARTx Status and Control)......................... 204
WKDYHR (RTCC Weekday and Hours Value)......... 257
YEAR (RTCC Year Value)........................................ 256
Resets
BOR (Brown-out Reset).............................................. 71
Clock Source Selection............................................... 73
CM (Configuration Mismatch Reset)........................... 71
Delay Times................................................................ 74
Device Times.............................................................. 73
IOPUWR (Illegal Opcode Reset) ................................ 71
MCLR (Pin Reset)....................................................... 71
POR (Power-on Reset)............................................... 71
RCON Flags Operation............................................... 73
SFR States ................................................................. 75
SWR (RESET Instruction) .......................................... 71
TRAPR (Trap Conflict Reset) ..................................... 71
UWR (Uninitialized W Register Reset) ....................... 71
WDT (Watchdog Timer Reset) ................................... 71
Revision History................................................................ 341
RTCC
Alarm Configuration.................................................. 260
Calibration ................................................................ 260
Register Mapping...................................................... 252
S
Selective Peripheral Power Control .................................. 132
Serial Peripheral Interface. See SPI.
SFR Space ......................................................................... 42
Software Simulator (MPLAB SIM) .................................... 301
Software Stack.................................................................... 59
Special Features................................................................. 12
SPI
T
Timer1............................................................................... 161
Timer2/3 and Timer4/5 ..................................................... 163
Timing Diagrams
External Clock........................................................... 322
2009 Microchip Technology Inc. DS39897C-page 347
PIC24FJ256GB110 FAMILY
U
UART ................................................................................ 199
Baud Rate Generator (BRG)..................................... 200
Operation of UxCTS and UxRTS Pins ...................... 201
Receiving .................................................................. 201
Transmitting
8-Bit Data Mode................................................ 201
9-Bit Data Mode................................................ 201
Break and Sync Sequence ............................... 201
Universal Asynchronous Receiver Transmitter. See UART.
Universal Serial Bus
Buffer Descriptors
Assignment in Different Buffering Modes ......... 213
Interrupts
and USB Transactions...................................... 217
Universal Serial Bus. See USB OTG.
USB On-The-Go (OTG) ...................................................... 12
USB OTG
Buffer Descriptors and BDT...................................... 212
Device Mode Operation ............................................ 217
DMA Interface........................................................... 213
Hardware Configuration............................................ 209
Device Mode..................................................... 209
External Interface.............................................. 211
Host and OTG Modes....................................... 210
Transceiver Power Requirements .................... 211
VBUS Voltage Generation.................................. 211
Host Mode Operation................................................ 218
Interrupts................................................................... 216
OTG Operation ......................................................... 220
Registers........................................................... 221–239
VBUS Voltage Generation.......................................... 211
V
VDDCORE/VCAP Pin ........................................................... 293
Voltage Regulator (On-Chip) ............................................ 293
and BOR................................................................... 294
Standby Mode .......................................................... 294
Tracking Mode.......................................................... 293
W
Watchdog Timer (WDT).................................................... 294
Control Register........................................................ 295
Windowed Operation ................................................ 295
WWW Address ................................................................. 348
WWW, On-Line Support ....................................................... 9
PIC24FJ256GB110 FAMILY
DS39897C-page 348 2009 Microchip Technology Inc.
NOTES:
2009 Microchip Technology Inc. DS39897C-page 349
PIC24FJ256GB110 FAMILY
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
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information:
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CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
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• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
PIC24FJ256GB110 FAMILY
DS39897C-page 350 2009 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product.
If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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PIC24FJ256GB110 Family DS39897C
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2009 Microchip Technology Inc. DS39897C-page 351
PIC24FJ256GB110 FAMILY
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Architecture 24 = 16-bit modified Harvard without DSP
Flash Memory Family FJ = Flash program memory
Product Group GB1 = General purpose microcontrollers with
USB On-The-Go
Pin Count 06 = 64-pin
08 = 80-pin
10 = 100-pin
Temperature Range I = -40C to +85C (Industrial)
Package PF = 100-lead (14x14x1 mm) TQFP (Thin Quad Flatpack)
PT = 64-lead, 80-lead, 100-lead (12x12x1 mm)
TQFP (Thin Quad Flatpack)
MR = 64-lead (9x9x0.9 mm) QFN (Quad Flatpack No Leads)
Pattern Three-digit QTP, SQTP, Code or Special Requirements
(blank otherwise)
ES = Engineering Sample
Examples:
a) PIC24FJ64GB106-I/PT:
PIC24F device with USB On-The-Go, 64-Kbyte
program memory, 64-pin, Industrial
temp.,TQFP package.
b) PIC24FJ256GB110-I/PT:
PIC24F device with USB On-The-Go,
256-Kbyte program memory, 100-pin, Industrial
temp.,TQFP package.
Microchip Trademark
Architecture
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Temperature Range
Package
Pattern
PIC 24 FJ 256 GB1 10 T - I / PT - XXX
Tape and Reel Flag (if applicable)
DS39897C-page 352 2009 Microchip Technology Inc.
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http://www.farnell.com/datasheets/1626931.pdf
OXPCIe958, PCI Express to Octal Serial Port
Highlights
General Features
o Octal UART with port expansion interface
o PCIe x1 end-point
- Integrated 2.5 GT/s SerDes
o 13 x 13mm2
, 176-pin TFBGA package
o Typical Power: 200 mWatts
Key Features
o Standards Compliant
- PCI Express Base Specification, r1.1 (backwards
compatible with PCIe r1.0a)
- PCI Power Management Spec, r1.2
- ExpressCard, Mini Card & AIC compatible
- MSI/MSI-X compatible
- ASPM (L0S, L1) Link power management
o High Performance
- PLX’s Oxford 950 UART
- DMA/bus mastering of both UARTs
- Asynchronous baud rates up to 15 Mbps
- 128-byte deep transmit/receive FIFO
- 9, 8, 7, 6 & 5-bit data framing
- Automated in & out-of-band flow control
- Advanced FIFO fill management
- Seamless port expansion interface to a second
OXPCIe954/8 for 12/16 port solution
o Flexibility
- RS232, RS422, RS485 and IrDA operation
- Flexible clock pre-scaler from 1 to 31.875
- Programmable RS485 Turn-around delay
- 450 through 950 software compatibility
- 8 user-configurable GPIOs/PWMs
- Device parameters configurable via EEPROM
- 1.8V, 2.5V or 3.3V UART & GPIO I/O voltage
o Robust Operation
- Operation from a single 3.3 V supply
- Industrial temperature range -40°C to 85°C
o Broad Device Driver Support
- Windows Vista/XP/2K
- WinCE 4.2/5.0/6.0
- Linux 2.4/2.6
Part of the Expresso family of high performance PCI
Express devices, the OXPCIe958 is a single chip octal
serial port device with port expansion interface in a
range of 2, 4 & 8 port solutions, that includes the
OXPCIe952 & OXPCIe954.
Incorporating PLX Technology’s ultra high
performance Oxford 950 UART technology, the
device combines outstanding system performance
with unrivalled flexibility for even the most
demanding of serial applications.
Complete with the Oxide development tools and
certified device drivers, the OXPCIe958 is easy to
design-in and the ideal connectivity solution for a
diverse range of products including: PC Add-on
Cards, Industrial PC, Point of Sale Terminals,
Industrial Control, Building Automation and Network
Management.
Accelerate your product development and time to
market with Oxide and PLX Technology’s easy to
design-in, high performance serial connectivity
solutions that just work.
© PLX Technology, www.plxtech.com Page 1 of 2 4/29/2009, Version 1.00 OXPCIe958, PCI Express to Octal Serial Port
Outstanding Performance
The OXPCIe958 achieves ultra high performance by
combining the class leading 15Mbps asynchronous
data rates and deep FIFOs of PLX’s Oxford 950
UART, with advanced MSI interrupt handling and
bus master DMA for maximum throughput, minimum
CPU overhead and optimal system performance.
Configurable octal ports the OXPCIe958 includes a
host of advanced features such as, automated in-band
flow control, readable FIFO levels and RS485
turnaround delay, that provides further scope to fine
tune performance, while its flexible clock pre-scaler
provides for a wide range of baud rates.
With its high performance port expansion interface,
providing seamless expansion to 12 or 16 ports
without a PCIe switch, its comprehensive power
management and industrial temperature range the
OXPCIe958 is the perfect choice for high
performance systems.
To support these advanced features the OXPCIe958 is
backed by a dedicated PLX device driver that is
quality assured, exhaustively tested and WHQL
approved; saving development time and providing
peace of mind.
OXPCIe958
Development Support
Design and evaluation of the OXPCIe958 couldn’t be
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(RDK). The RDK includes everything you need for
PC installation and evaluation including Hardware,
Oxide Development Tools and software device
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software and its ready to go.
Changing the dynamics of device customization,
Oxide development tools enable customization of the
OXPCIe958 in minutes. No more complex, time
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Check the PLX website for details.
Ordering Information
Part Number Description
OXPCIe958-FBAG Octal Serial Port to PCIe Bridge
EK-OXPCIe958 Reference Design Kit
© PLX Technology, www.plxtech.com Page 2 of 2 4/29/2009, Version 1.00
1. Product profile
1.1 General description
Unidirectional double ElectroStatic Discharge (ESD) protection diodes in a common
cathode configuration, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted
Device (SMD) plastic package. The devices are designed for ESD and transient
overvoltage protection of up to two signal lines.
[1] All types available as /DG halogen-free version.
1.2 Features
1.3 Applications
MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage
suppression
Rev. 01 — 3 September 2008 Product data sheet
Table 1. Product overview
Type number[1] Package Configuration
NXP JEDEC
MMBZ12VDL SOT23 TO-236AB dual common cathode
MMBZ15VDL
MMBZ18VCL
MMBZ20VCL
MMBZ27VCL
MMBZ33VCL
■ Unidirectional ESD protection of
two lines
■ ESD protection up to 30 kV (contact
discharge)
■ Bidirectional ESD protection of one line ■ IEC 61000-4-2; level 4 (ESD)
■ Low diode capacitance: Cd ≤ 140 pF ■ IEC 61643-321
■ Rated peak pulse power: PPPM ≤ 40 W ■ AEC-Q101 qualified
■ Ultra low leakage current: IRM ≤ 5 nA
■ Computers and peripherals ■ Automotive electronic control units
■ Audio and video equipment ■ Portable electronics
■ Cellular handsets and accessoriesMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 2 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
1.4 Quick reference data
2. Pinning information
Table 2. Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse standoff voltage
MMBZ12VDL
MMBZ12VDL/DG
- - 8.5 V
MMBZ15VDL
MMBZ15VDL/DG
- - 12.8 V
MMBZ18VCL
MMBZ18VCL/DG
- - 14.5 V
MMBZ20VCL
MMBZ20VCL/DG
- - 17 V
MMBZ27VCL
MMBZ27VCL/DG
- - 22 V
MMBZ33VCL
MMBZ33VCL/DG
- - 26 V
Cd diode capacitance f = 1 MHz; VR =0V
MMBZ12VDL
MMBZ12VDL/DG
- 110 140 pF
MMBZ15VDL
MMBZ15VDL/DG
- 85 105 pF
MMBZ18VCL
MMBZ18VCL/DG
- 70 90 pF
MMBZ20VCL
MMBZ20VCL/DG
- 65 80 pF
MMBZ27VCL
MMBZ27VCL/DG
- 48 60 pF
MMBZ33VCL
MMBZ33VCL/DG
- 45 55 pF
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 anode (diode 1)
2 anode (diode 2)
3 common cathode
1 2
3
006aaa150
1 2
3MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 3 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 4. Ordering information
Type number Package
Name Description Version
MMBZ12VDL - plastic surface-mounted package; 3 leads SOT23
MMBZ15VDL
MMBZ18VCL
MMBZ20VCL
MMBZ27VCL
MMBZ33VCL
MMBZ12VDL/DG - plastic surface-mounted package; 3 leads SOT23
MMBZ15VDL/DG
MMBZ18VCL/DG
MMBZ20VCL/DG
MMBZ27VCL/DG
MMBZ33VCL/DG
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
MMBZ12VDL *MA MMBZ12VDL/DG TJ*
MMBZ15VDL *MB MMBZ15VDL/DG TL*
MMBZ18VCL *MC MMBZ18VCL/DG TN*
MMBZ20VCL *MD MMBZ20VCL/DG TQ*
MMBZ27VCL *ME MMBZ27VCL/DG TS*
MMBZ33VCL *MF MMBZ33VCL/DG TU*MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 4 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
5. Limiting values
[1] In accordance with IEC 61643-321 (10/1000 µs current waveform).
[2] Measured from pin 1 or 2 to pin 3.
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 or 2 to pin 3.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
PPPM rated peak pulse power tp = 10/1000 µs [1][2] - 40 W
IPPM rated peak pulse current tp = 10/1000 µs [1][2]
MMBZ12VDL
MMBZ12VDL/DG
- 2.35 A
MMBZ15VDL
MMBZ15VDL/DG
- 1.9 A
MMBZ18VCL
MMBZ18VCL/DG
- 1.6 A
MMBZ20VCL
MMBZ20VCL/DG
- 1.4 A
MMBZ27VCL
MMBZ27VCL/DG
- 1A
MMBZ33VCL
MMBZ33VCL/DG
- 0.87 A
Per device
Ptot total power dissipation Tamb ≤ 25 °C [3] - 350 mW
[4] - 440 mW
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. ESD maximum ratings
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
Per diode
VESD electrostatic discharge voltage [1][2]
IEC 61000-4-2
(contact discharge)
- 30 kV
machine model - 2 kVMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 5 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Soldering point at pin 3.
Table 8. ESD standards compliance
Standard Conditions
Per diode
IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model) > 8 kV
Fig 1. 10/1000 µs pulse waveform according to
IEC 61643-321
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
tp (ms)
0 4.0 1.0 2.0 3.0
006aab319
50
100
150
IPP
(%)
0
50 % IPP; 1000 µs
100 % IPP; 10 µs
001aaa631
IPP
100 %
90 %
t
30 ns
60 ns
10 %
tr = 0.7 ns to 1 ns
Table 9. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from junction
to ambient
in free air [1] - - 350 K/W
[2] - - 280 K/W
Rth(j-sp) thermal resistance from junction
to solder point
[3] - - 60 K/WMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 6 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
7. Characteristics
Table 10. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VF forward voltage
MMBZ12VDL
MMBZ12VDL/DG
IF = 10 mA - - 0.9 V
MMBZ15VDL
MMBZ15VDL/DG
IF = 10 mA - - 0.9 V
MMBZ18VCL
MMBZ18VCL/DG
IF = 10 mA - - 0.9 V
MMBZ20VCL
MMBZ20VCL/DG
IF = 10 mA - - 0.9 V
MMBZ27VCL
MMBZ27VCL/DG
IF = 200 mA - - 1.1 V
MMBZ33VCL
MMBZ33VCL/DG
IF = 10 mA - - 0.9 V
VRWM reverse standoff
voltage
MMBZ12VDL
MMBZ12VDL/DG
- - 8.5 V
MMBZ15VDL
MMBZ15VDL/DG
- - 12.8 V
MMBZ18VCL
MMBZ18VCL/DG
- - 14.5 V
MMBZ20VCL
MMBZ20VCL/DG
- - 17 V
MMBZ27VCL
MMBZ27VCL/DG
- - 22 V
MMBZ33VCL
MMBZ33VCL/DG
- - 26 V
IRM reverse leakage current
MMBZ12VDL
MMBZ12VDL/DG
VRWM = 8.5 V - 0.1 5 nA
MMBZ15VDL
MMBZ15VDL/DG
VRWM = 12.8 V - 0.1 5 nA
MMBZ18VCL
MMBZ18VCL/DG
VRWM = 14.5 V - 0.1 5 nA
MMBZ20VCL
MMBZ20VCL/DG
VRWM = 17 V - 0.1 5 nA
MMBZ27VCL
MMBZ27VCL/DG
VRWM = 22 V - 0.1 5 nA
MMBZ33VCL
MMBZ33VCL/DG
VRWM = 26 V - 0.1 5 nAMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 7 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
VBR breakdown voltage IR = 1 mA
MMBZ12VDL
MMBZ12VDL/DG
11.4 12 12.6 V
MMBZ15VDL
MMBZ15VDL/DG
14.3 15 15.8 V
MMBZ18VCL
MMBZ18VCL/DG
17.1 18 18.9 V
MMBZ20VCL
MMBZ20VCL/DG
19 20 21 V
MMBZ27VCL
MMBZ27VCL/DG
25.65 27 28.35 V
MMBZ33VCL
MMBZ33VCL/DG
31.35 33 34.65 V
Cd diode capacitance f = 1 MHz; VR =0V
MMBZ12VDL
MMBZ12VDL/DG
- 110 140 pF
MMBZ15VDL
MMBZ15VDL/DG
- 85 105 pF
MMBZ18VCL
MMBZ18VCL/DG
- 70 90 pF
MMBZ20VCL
MMBZ20VCL/DG
- 65 80 pF
MMBZ27VCL
MMBZ27VCL/DG
- 48 60 pF
MMBZ33VCL
MMBZ33VCL/DG
- 45 55 pF
VCL clamping voltage [1][2]
MMBZ12VDL
MMBZ12VDL/DG
IPPM = 2.35 A - - 17 V
MMBZ15VDL
MMBZ15VDL/DG
IPPM = 1.9 A - - 21.2 V
MMBZ18VCL
MMBZ18VCL/DG
IPPM = 1.6 A - - 25 V
MMBZ20VCL
MMBZ20VCL/DG
IPPM = 1.4 A - - 28 V
MMBZ27VCL
MMBZ27VCL/DG
IPPM = 1 A - - 38 V
MMBZ33VCL
MMBZ33VCL/DG
IPPM = 0.87 A - - 46 V
Table 10. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max UnitMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 8 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
[1] In accordance with IEC 61643-321 (10/1000 µs current waveform).
[2] Measured from pin 1 or 2 to pin 3.
SZ temperature coefficient IZ = 1 mA
MMBZ12VDL
MMBZ12VDL/DG
- 8.1 - mV/K
MMBZ15VDL
MMBZ15VDL/DG
- 11 - mV/K
MMBZ18VCL
MMBZ18VCL/DG
- 14 - mV/K
MMBZ20VCL
MMBZ20VCL/DG
- 15.8 - mV/K
MMBZ27VCL
MMBZ27VCL/DG
- 23 - mV/K
MMBZ33VCL
MMBZ33VCL/DG
- 29.4 - mV/K
Table 10. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
MMBZ27VCL: unidirectional and bidirectional
Tamb = 25 °C
Fig 3. Rated peak pulse power as a function of
exponential pulse duration (rectangular
waveform); typical values
Fig 4. Relative variation of rated peak pulse power as
a function of junction temperature; typical
values
006aab327
102
10
103
PPPM
(W)
1
tp (ms)
10−2 103 102 10−1 1 10
Tj
(°C)
0 200 50 100 150
006aab321
0.4
0.8
1.2
PPPM
0
PPPM(25°C)MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 9 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
f = 1 MHz; Tamb = 25 °C
(1) MMBZ15VDL: unidirectional
(2) MMBZ15VDL: bidirectional
(3) MMBZ27VCL: unidirectional
(4) MMBZ27VCL: bidirectional
MMBZ27VCL: VRWM = 22 V
Fig 5. Diode capacitance as a function of reverse
voltage; typical values
Fig 6. Reverse leakage current as a function of
junction temperature; typical values
Fig 7. V-I characteristics for a unidirectional
ESD protection diode
Fig 8. V-I characteristics for a bidirectional
ESD protection diode
VR (V)
0 25 5 10 15 20
006aab328
40
60
20
80
100
Cd
(pF)
0
(1)
(2)
(3)
(4)
006aab329
10−1
10−2
10
1
102
IRM
(nA)
10−3
Tamb (°C)
−75 175 −25 25 75 125
006aab324
−VCL −VBR −VRWM
−IRM
−IR
−IPP
V
I
P-N
− +
−IPPM 006aab325
−VCL −VBR −VRWM
−IRM VRWM VBR VCL
IRM
−IR
IR
−IPP
IPP
− +
IPPM
−IPPMMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 10 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
8. Application information
The MMBZxVCL series and the MMBZxVDL series are designed for the protection of up
to two unidirectional data or signal lines from the damage caused by ESD and surge
pulses. The devices may be used on lines where the signal polarities are either positive or
negative with respect to ground. The devices provide a surge capability of 40 W per line
for a 10/1000 µs waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the devices as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 9. Typical application: ESD and transient voltage protection of data lines
006aab330
MMBZxVCL/VDL
line 1 to be protected
unidirectional protection of two lines bidirectional protection of one line
line 2 to be protected
GND
MMBZxVCL/VDL
line 1 to be protected
GNDMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 11 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
10. Package outline
11. Packing information
[1] For further information and the availability of packing methods, see Section 15.
Fig 10. Package outline SOT23 (TO-236AB)
Dimensions in mm 04-11-04
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
1 2
3
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
MMBZ12VDL SOT23 4 mm pitch, 8 mm tape and reel -215 -235
MMBZ15VDL
MMBZ18VCL
MMBZ20VCL
MMBZ27VCL
MMBZ33VCL
MMBZ12VDL/DG SOT23 4 mm pitch, 8 mm tape and reel -215 -235
MMBZ15VDL/DG
MMBZ18VCL/DG
MMBZ20VCL/DG
MMBZ27VCL/DG
MMBZ33VCL/DGMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 12 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
12. Soldering
Fig 11. Reflow soldering footprint SOT23 (TO-236AB)
Fig 12. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mmMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 13 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
13. Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
MMBZXVCL_MMBZXVDL_SER_1 20080903 Product data sheet - -MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 14 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
ESD protection devices — These products are only intended for protection
against ElectroStatic Discharge (ESD) pulses and are not intended for any
other usage including, without limitation, voltage regulation applications. NXP
Semiconductors accepts no liability for use in such applications and therefore
such use is at the customer’s own risk.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 September 2008
Document identifier: MMBZXVCL_MMBZXVDL_SER_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Application information. . . . . . . . . . . . . . . . . . 10
9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
9.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10
10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Packing information. . . . . . . . . . . . . . . . . . . . . 11
12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15 Contact information. . . . . . . . . . . . . . . . . . . . . 14
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
Rev. 05 — 27 February 2009 Product data sheet
1. Product profile
1.1 General description
Planar passivated SCR (Silicon Controlled Rectifier) in a SOT78 plastic package.
1.2 Features and benefits
High reliability
High surge current capability
High thermal cycling performance
1.3 Applications
Ignition circuits
Motor control
Protection Circuits
Static switching
1.4 Quick reference data
Table 1. Quick reference
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak
off-state voltage
- - 650 V
IT(AV) average on-state
current
half sine wave;
Tmb ≤ 109 °C; see Figure 3
- - 7.5 A
IT(RMS) RMS on-state
current
half sine wave;
Tmb ≤ 109 °C; see Figure 1;
see Figure 2
- - 12 A
Static characteristics
IGT gate trigger current VD = 12 V; Tj = 25 °C;
IT = 100 mA; see Figure 8
- 2 15 mABT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 2 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
2. Pinning information
3. Ordering information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode
SOT78
(TO-220AB; SC-46)
2 A anode
3 G gate
mb mb anode
1 2
mb
3
sym037
A K
G
Table 3. Ordering information
Type number Package
Name Description Version
BT151-650R TO-220AB;
SC-46
plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead
TO-220AB
SOT78BT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 3 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state
voltage
- 650 V
VRRM repetitive peak reverse
voltage
- 650 V
IT(AV) average on-state
current
half sine wave; Tmb ≤ 109 °C; see Figure 3 - 7.5 A
IT(RMS) RMS on-state current half sine wave; Tmb ≤ 109 °C; see Figure 1; see
Figure 2
- 12 A
dIT/dt rate of rise of on-state
current
IT = 20 A; IG = 50 mA; dIG/dt = 50 mA/µs - 50 A/µs
IGM peak gate current - 2 A
PGM peak gate power - 5 W
Tstg storage temperature -40 150 °C
Tj junction temperature - 125 °C
ITSM non-repetitive peak
on-state current
half sine wave; tp = 8.3 ms; Tj(init) = 25 °C - 132 A
half sine wave; tp = 10 ms; Tj(init) = 25 °C; see
Figure 4; see Figure 5
- 120 A
I
2t I2t for fusing tp = 10 ms; sine-wave pulse - 72 A2s
PG(AV) average gate power over any 20 ms period - 0.5 W
VRGM peak reverse gate
voltage
- 5V
Fig 1. RMS on-state current as a function of surge
duration; maximum values
Fig 2. RMS on-state current as a function of mounting
base temperature; maximum values
surge duration (s)
10−2 10 1 10 −1
001aaa954
10
15
5
20
25
IT(RMS)
(A)
0
Tmb (°C)
−50 150 0 50 100
001aaa999
8
4
12
16
IT(RMS)
(A)
0BT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 4 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
Fig 3. Total power dissipation as a function of average on-state current; maximum values
Fig 4. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values
IT(AV) (A)
0 2 4 6 8
003aab830
5
10
15
Ptot
(W)
0
4
2.8
2.2
1.9
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
α
a = 1.57
001aaa956
tp (s)
10−5 10−2 10−3 10−4
102
103
ITSM
(A)
10
dlT/dt limit
tp
Tj
initial = 25 °C max
IT ITSM
tBT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 5 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
5. Thermal characteristics
Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
003aab829
80
40
120
160
ITSM
(A)
0
number of cycles 1 103 102 10
tp
Tj
initial = 25 °C max
IT ITSM
t
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from
junction to mounting
base
see Figure 6 - - 1.3 K/W
Rth(j-a) thermal resistance from
junction to ambient free
air
- 60 - K/W
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
001aaa962
10−1
10−2
1
10
Zth(j-mb)
(K/W)
10−3
tp (s)
10−5 10 1 10 −1 10−2 10−4 10−3
tp
tp
T
P
t
T
δ =BT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 6 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD = 12 V; Tj = 25 °C; IT = 100 mA; see
Figure 8
- 2 15 mA
IL latching current VD = 12 V; Tj = 25 °C; see Figure 9 - 10 40 mA
IH holding current VD = 12 V; Tj = 25 °C; see Figure 10 - 7 20 mA
VT on-state voltage IT = 23 A; Tj = 25 °C; see Figure 11 - 1.4 1.75 V
VGT gate trigger voltage IT = 100 mA; VD = 12 V; Tj = 25 °C; see
Figure 12
- 0.6 1.5 V
IT = 100 mA; VD = 650 V; Tj = 125 °C 0.25 0.4 - V
ID off-state current VD = 650 V; Tj = 125 °C - 0.1 0.5 mA
IR reverse current VR = 650 V; Tj = 125 °C - 0.1 0.5 mA
Dynamic characteristics
dVD/dt rate of rise of off-state
voltage
VDM = 435 V; Tj = 125 °C; exponential
waveform; gate open circuit
50 130 - V/µs
VDM = 435 V; Tj = 125 °C; RGK = 100 Ω;
exponential waveform; see Figure 7
200 1000 - V/µs
tgt gate-controlled turn-on
time
ITM = 40 A; VD = 650 V; IG = 100 mA;
dIG/dt = 5 A/µs; Tj = 25 °C
- 2 - µs
tq commutated turn-off
time
VDM = 435 V; Tj = 125 °C; ITM = 20 A;
VR = 25 V; (dIT/dt)M = 30 A/µs;
dVD/dt = 50 V/µs; RGK = 100 Ω
- 70 - µs
Fig 7. Critical rate of rise of off-state voltage as a
function of junction temperature; minimum
values
Fig 8. Normalized gate trigger current as a function of
junction temperature
001aaa949
103
102
104
dVD/dt
(V/μs)
10
Tj
(°C)
0 150 50 100
(2)
(1)
Tj
(°C)
−50 150 0 50 100
001aaa952
1
2
3
0
IGT
IGT(25°C)BT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 7 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
Fig 9. Normalized latching current as a function of
junction temperature
Fig 10. Normalized holding current as a function of
junction temperature
Fig 11. On-state current as a function of on-state
voltage
Fig 12. Normalized gate trigger voltage as a function of
junction temperature
Tj
(°C)
−50 150 0 50 100
001aaa951
1
2
3
0
IL
IL(25°C)
Tj
(°C)
−50 150 0 50 100
001aaa950
1
2
3
IH
IH(25°C)
0
VT (V)
0 2 0.5 1 1.5
001aaa959
10
20
30
IT
(A)
0
(1) (2) (3)
Tj
(°C)
−50 150 0 50 100
001aaa953
0.8
1.2
1.6
0.4
VGT
VGT(25°C)BT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 8 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
7. Package outline
Fig 13. Package outline SOT78 (TO-220AB)
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT78 SC-46 3-lead TO-220AB
SOT78
08-04-23
08-06-13
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
UNIT A
mm 4.7
4.1
1.40
1.25
0.9
0.6
0.7
0.4
16.0
15.2
6.6
5.9
10.3
9.7
15.0
12.8
3.30
2.79
3.8
3.5
A1
DIMENSIONS (mm are the original dimensions)
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
0 5 10 mm
scale
b b1
(2)
1.6
1.0
c D
1.3
1.0
b2
(2) D1 E e
2.54
L L1
(1) L2
(1)
max.
3.0
p q
3.0
2.7
Q
2.6
2.2
D
D1
q
p
L
123
L1
(1)
b1
(2)
(3×)
b2
(2)
(2×)
e e
b(3×)
E A
A1
c
Q
L2
(1)
mounting
baseBT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 9 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BT151-650R_5 20090227 Product data sheet - BT151_SER_L_R_4
Modifications: • Package outline updated.
• Type number BT151-650R separated from data sheet BT151_SER_L_R_4.
BT151_SER_L_R_4 20061023 Product data sheet - BT151_SERIES_3
BT151_SERIES_3 (9397
750 13159)
20040607 Product specification - BT151_SERIES_2
BT151_SERIES_2 19990601 Product specification - BT151_SERIES_1
BT151_SERIES_1 19970901 Product specification - -BT151-650R_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 27 February 2009 10 of 11
NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status [1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BT151-650R
SCR, 12 A, 15mA, 650 V, SOT78
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 February 2009
Document identifier: BT151-650R_5
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .9
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .10
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10
10 Contact information. . . . . . . . . . . . . . . . . . . . . .10
1. Product profile
1.1 General description
The devices are 4-, 6- and 8-channel RC low-pass filter arrays which are designed to
provide filtering of undesired RF signals on the I/O ports of portable communication or
computing devices. In addition, the devices incorporate diodes to provide protection to
downstream components from ElectroStatic Discharge (ESD) voltages as high as ±30 kV.
The devices are fabricated using monolithic silicon technology and integrate up to eight
resistors and sixteen diodes in a 0.4 mm pitch 8-, 12- or 16-pin ultra-thin leadless Quad
Flat No-leads (QFN) plastic package with a height of 0.55 mm only.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
4-, 6- and 8-channel integrated π-type RC filter network
ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 far exceeding
level 4
QFN plastic package with 0.4 mm pitch and 0.55 mm height
1.3 Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
Cellular phone and Personal Communication System (PCS) mobile handsets
Cordless telephones
Wireless data (WAN/LAN) systems
Mobile Internet Devices (MID)
Portable Media Players (PMP)
IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
with ESD protection
Rev. 2 — 5 May 2011 Product data sheetIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 2 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
1.4 Quick reference data
[1] For the total channel.
2. Pinning information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 10 - pF
Rs(ch) channel series resistance 80 100 120 Ω
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 12 - pF
Rs(ch) channel series resistance 32 40 48 Ω
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 30 - pF
Rs(ch) channel series resistance 160 200 240 Ω
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 30 - pF
Rs(ch) channel series resistance 80 100 120 Ω
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
IP4251CZ8-4-TTL; IP4252CZ8-4-TTL; IP4253CZ8-4-TTL; IP4254CZ8-4-TTL (SOT1166-1)
1 and 8 filter channel 1
2 and 7 filter channel 2
3 and 6 filter channel 3
4 and 5 filter channel 4
ground pad ground
IP4251CZ12-6-TTL; IP4252CZ12-6-TTL; IP4253CZ12-6-TTL; IP4254CZ12-6-TTL (SOT1167-1)
1 and 12 filter channel 1
2 and 11 filter channel 2
3 and 10 filter channel 3
4 and 9 filter channel 4
5 and 8 filter channel 5
6 and 7 filter channel 6
ground pad ground
Transparent
top view
8
1
5
4
018aaa071
Rs(ch)
Cch
1 to 4 5 to 8
GND
2
Cch
2
Transparent
top view
12
1
7
6
018aaa072
Rs(ch)
1 to 6 7 to 12
GND
Cch
2
Cch
2IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 3 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
3. Ordering information
IP4251CZ16-8-TTL; IP4252CZ16-8-TTL; IP4253CZ16-8-TTL; IP4254CZ16-8-TTL (SOT1168-1)
1 and 16 filter channel 1
2 and 15 filter channel 2
3 and 14 filter channel 3
4 and 13 filter channel 4
5 and 12 filter channel 5
6 and 11 filter channel 6
7 and 10 filter channel 7
8 and 9 filter channel 8
ground pad ground
Table 2. Pinning …continued
Pin Description Simplified outline Graphic symbol
Transparent
top view
16
1
9
8
018aaa073
Rs(ch)
1 to 8 9 to 16
GND
Cch
2
Cch
2
Table 3. Ordering information
Type number Package
Name Description Version
IP4251CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4251CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4251CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP4252CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4252CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4252CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP4253CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4253CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4253CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP4254CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4254CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4254CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 4 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
4. Limiting values
[1] Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
[2] Device tested with 1000 pulses of ±30 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground;
contact discharge
[1] - ±15 kV
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground;
contact discharge
[1] - ±15 kV
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground [2]
contact discharge - ±30 kV
air discharge - ±30 kV
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground [2]
contact discharge - ±30 kV
air discharge - ±30 kV
Per device
VESD electrostatic discharge
voltage
IEC 61000-4-2, level 4;
all pins to ground
contact discharge - ±8 kV
air discharge - ±15 kV
VCC supply voltage −0.5 +5.6 V
Pch channel power dissipation Tamb = 85 °C - 60 mW
Ptot total power dissipation Tamb = 85 °C - 200 mW
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °CIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 5 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
5. Characteristics
[1] For the total channel.
[2] Guaranteed by design.
Table 5. Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 10 - pF
Vbias(DC) =0V [2] - 15 - pF
Rs(ch) channel series resistance 80 100 120 Ω
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 12 - pF
Vbias(DC) =0V [2] - 18 - pF
Rs(ch) channel series resistance 32 40 48 Ω
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 30 - pF
Vbias(DC) =0V [2] - 45 - pF
Rs(ch) channel series resistance 160 200 240 Ω
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 30 - pF
Vbias(DC) =0V [2] - 45 - pF
Rs(ch) channel series resistance 80 100 120 Ω
Per device
ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 μA
VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 9 V
VF forward voltage negative clamp; IF = 1 mA 0.4 - 1.5 VIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 6 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Table 6. Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 16 - dB
f = 1 GHz - 20 - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 30 - dB
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 12 - dB
f = 1 GHz - 14 - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 40 - dB
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 33 - dB
f = 1 GHz 35 - - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 30 - dB
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 28 - dB
f = 1 GHz 30 - - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 30 - dBIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 7 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
6. Application information
6.1 Insertion loss
The devices are designed as EMI/RFI filters for multichannel interfaces.
The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1.
Typical measurements results are shown in Figure 2 to Figure 6 for the different devices.
(1) IP4252CZ16-8-TTL - channel 1 to channel 16
(2) IP4251CZ16-8-TTL - channel 1 to channel 16
(3) IP4254CZ16-8-TTL - channel 1 to channel 16
(4) IP4253CZ16-8-TTL - channel 1 to channel 16
Fig 1. Frequency response setup Fig 2. Frequency response curves overview
018aaa074
50 Ω
Vgen
50 Ω
DUT
IN OUT
001aaj308
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
(3)
(4)IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 8 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Due to the optimized silicon dice and package design, all channels in a single package
show a very good matching performance as the insertion loss for a channel at the
package side (e.g. channel 1 to channel 16) is nearly identical with the center channels
(e.g. channel 4 to channel 13).
(1) Channel 1 to channel 16
(2) Channel 4 to channel 13
(1) Channel 1 to channel 16
(2) Channel 4 to channel 13
Fig 3. IP4251CZ16-8-TTL: frequency response
curves
Fig 4. IP4252CZ16-8-TTL: frequency response
curves
(1) Channel 1 to channel 16
(2) Channel 4 to channel 13
(1) Channel 4 to channel 13
(2) Channel 1 to channel 16
Fig 5. IP4253CZ16-8-TTL: frequency response
curves
Fig 6. IP4254CZ16-8-TTL: frequency response
curves
001aaj608
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
001aaj609
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
001aaj610
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
001aaj611
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 9 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
6.2 Selection
The selection of one of the filter devices has to be performed depending on the maximum
clock frequency, driver strength, capacitive load of the sink, and also the maximum
applicable rise and fall times.
6.2.1 SDHC and MMC memory interface
The Secure Digital High Capacity (SDHC) memory card interface standard specification
and the Multi Media Card (MMC) (JESD 84A43) standard specification recommend a rise
and fall time of 25 % to 62.5 % (62.5 % to 25 % respectively) of 3 ns or less for the input
signal of the receiving interface side.
Assuming a typical capacitance of about 20 pF for the SDHC memory card itself, and
approximately 4 pF to 7 pF for the Printed-Circuit Board (PCB) and the card holder,
IP4252CZ12-6-TTL (6 channels, Rs(ch) = 40 Ω, Cch = 12 pF at Vbias(DC) = 2.5 V) is a
matching selection to filter and protect all relevant interface pins such as CLK, CMD, and
DAT0 to DAT3/CD. Please refer to Figure 7 for a general example of the implementation
of the device in an SDHC card interface.
In case additional channels such as write-protect or a mechanical card-detection switch
are used, the IP4252CZ16-8-TTL (8 channels, Rs(ch) = 40 Ω, Cch = 12 pF at
Vbias(DC) = 2.5 V) offers two additional channels.IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 10 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
The capacitance values specified for the signal channels of the MMC interface differ from
the SDHC specification. The MMC card-side interface is specified to have an intrinsic
capacitance of 12 pF to 18 pF and the total channel is limited according to the
specification to 30 pF only. Therefore, any filter device capacitance is limited to a
maximum of up to 18 pF, including the card holder and PCB traces.
Please refer to Figure 8 for a general example of the implementation of the IP4252 in an
MMC interface application.
Fig 7. Example of IP4252 in an SDHC card interface
018aaa075
IP4252CZ12-6-TTL
(IP4252CZ16-8-TTL)
DAT1
pull-up resistors
10 kΩ − 100 kΩ
10 kΩ − 90 kΩ
DAT3/CD pull-up
10 kΩ − 100 kΩ
DAT3/CD pull-up
>270 kΩ
exact value
depends on
required
logic levels
DAT1 SD MEMORY
CARD
SET_CLR_
CARD_DETECT
(ACMD42)
to HOST
INTERFACE
DAT0
GND
CLK
VCC(VSD)
VCC(VSD)
DAT3/CD
CMD
DAT2
optional:
2-additional channels
of IP4252CZ16-8-TTL
optional:
write protect switch
optional:
electrical card detect
WP
DAT0
CLK
CMD
DAT3/CD
DAT2
CD
WP
optional:
card detect switch
CDIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 11 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
To generate SDHC and MMC-compliant digital signals, the driver strength should not
significantly undercut 8 mA.
6.2.2 LCD interfaces, medium-speed interfaces
For digital interfaces such as LCD interfaces running at clock speeds between 10 MHz
and 25 MHz or more, IP4251, IP4252 or IP4254 can be used depending on the sink load,
clock speed, driver strength and rise and fall time requirements. Also the minimum
EMI filter requirements may be a decision-making factor.
6.2.3 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces
(e.g. Recommended Standard (RS) 232) and low-speed control signals,
IP4253 (Rs(ch) = 200 Ω, Cch = 30 pF at Vbias(DC) = 2.5 V) offers a very robust
ESD protection and strong suppression of unwanted frequencies (EMI filtering).
Fig 8. Example of IP4252 in an MMC interface
018aaa076
IP4252CZ12-6-TTL
IP4252CZ8-4-TTL
DAT1
pull-up resistors
50 kΩ - 100 kΩ
CMD pull-up
4.7 kΩ - 100 kΩ
DAT1 C8
e.g.
RSMMC
HOST
INTERFACE
DAT0 C7
DAT7 C13
VSS2 C6
DAT6 C12
CLK C5
VCC(VMMC)
VCC(VMMC)
C4
VSS1 C3
DAT5 C11
CMD C2
DAT4 C10
DAT3 C1
DAT2
CMD
DAT4
DAT3
DAT2 C9
DAT0
DAT7
DAT6
CLK
DAT5IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 12 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
7. Package outline
Fig 9. Package outline SOT1166-1 (HUSON8)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOT1166-1 - - - - - - - - -
sot1166-1_po
10-03-18
10-03-22
Unit(1)
mm
max
nom
min
0.55 0.05
0.00
0.25
0.20
0.15
1.8
1.7
1.6
1.3
1.2
1.1
1.45
1.35
1.25
0.4 1.2
0.30
0.25
0.20
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1
A1 c
0.127
b DDh E Eh
0.45
0.40
0.35
e e1 k
0.2
L v
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y1 C y
tiebars are indicated on
arbitrary location and size
detail X
A
A1
c
terminal 1
index area
D B A
E
b
terminal 1
index area
e1
e v C A B
w C
L
k
Eh
Dh
1
8
4
5IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 13 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Fig 10. Package outline SOT1167-1 (HUSON12)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOT1167-1 - - - - - - - - -
sot1167-1_po
10-03-18
10-03-22
Unit(1)
mm
max
nom
min
0.55 0.05
0.00
0.25
0.20
0.15
2.6
2.5
2.4
2.1
2.0
1.9
1.45
1.35
1.25
0.4 2.0
0.30
0.25
0.20
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HUSON12: plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 x 2.5 x 0.55 mm SOT1167-1
A1 c
0.127
b DDh E Eh
0.45
0.40
0.35
e e1 k
0.2
L v
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y1 C y
tiebars are indicated on
arbitrary location and size
detail X
A
A1
c
terminal 1
index area
D B A
E
b
terminal 1
index area
e1
e v C A B
w C
L
k
Eh
Dh
1
12
6
7IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 14 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Fig 11. Package outline SOT1168-1 (HUSON16)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOT1168-1 - - - - - - - - -
sot1168-1_po
10-03-18
10-03-22
Unit(1)
mm
max
nom
min
0.55 0.05
0.00
0.25
0.20
0.15
3.4
3.3
3.2
2.9
2.8
2.7
1.45
1.35
1.25
0.4 2.8
0.30
0.25
0.20
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1
A1 c
0.127
b DDh E Eh
0.45
0.40
0.35
e e1 k
0.2
L v
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y1 C y
tiebars are indicated on
arbitrary location and size
detail X
A
A1
c
terminal 1
index area
D B A
E
b
terminal 1
index area
e1
e v C A B
w C
L
k
Eh
Dh
1
16
8
9IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 15 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
IP4251_52_53_54-TTL v.2 20110505 Product data sheet - IP4251_52_53_54-TTL v.1
Modifications: • Section 1 “Product profile”: updated.
• Table 2 “Pinning”: updated.
• Deleted section “Thermal characteristics”.
IP4251_52_53_54-TTL v.1 20110131 Objective data sheet - -IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 16 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 17 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 May 2011
Document identifier: IP4251_52_53_54-TTL
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Application information. . . . . . . . . . . . . . . . . . . 7
6.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.2 Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.2.1 SDHC and MMC memory interface . . . . . . . . . 9
6.2.2 LCD interfaces, medium-speed interfaces . . . 11
6.2.3 Keypad, low-speed interfaces. . . . . . . . . . . . . 11
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
10 Contact information. . . . . . . . . . . . . . . . . . . . . 17
11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1. Product profile
1.1 General description
High voltage, high speed, planar passivated NPN power switching transistor with
integrated anti-parallel E-C diode in a SOT186A (TO220F) full pack plastic package.
1.2 Features and benefits
Fast switching
High voltage capability
Integrated anti-parallel E-C diode
Isolated package
Very low switching and conduction
losses
1.3 Applications
DC-to-DC converters
Electronic lighting ballasts
Inverters
Motor control systems
1.4 Quick reference data
BUJD203AX
NPN power transistor with integrated diode
Rev. 01 — 27 September 2010 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IC collector current see Figure 1; see Figure 2; DC;
see Figure 4
- - 4A
Ptot total power
dissipation
Th ≤ 25 °C; see Figure 3 - - 26 W
VCESM collector-emitter
peak voltage
VBE = 0 V - - 850 V
Static characteristics
hFE DC current gain IC = 500 mA; VCE = 5 V;
see Figure 11; Th = 25 °C
13 21 32
VCE = 5 V; IC = 3 A; see Figure 11;
Th = 25 °C
- 12.5 -
VCEOsus collector-emitter
sustaining voltage
IB = 0 A; LC = 25 mH; IC = 10 mA;
see Figure 6; see Figure 7
400 450 - VBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 2 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
2. Pinning information
3. Ordering information
4. Limiting values
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 B base
SOT186A (TO-220F)
2 C collector
3 E emitter
mb n.c. mounting base; isolated
1 2 3
mb
sym131
C
E
B
Table 3. Ordering information
Type number Package
Name Description Version
BUJD203AX TO-220F plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 "full pack"
SOT186A
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCESM collector-emitter peak voltage VBE = 0 V - 850 V
VCBO collector-base voltage IE = 0 A - 850 V
VCEO collector-emitter voltage IB = 0 A - 425 V
IC collector current DC; see Figure 1; see Figure 2;
see Figure 4
- 4A
ICM peak collector current see Figure 1; see Figure 2; see Figure 4 - 8A
IB base current DC - 2 A
IBM peak base current - 4 A
Ptot total power dissipation Th ≤ 25 °C; see Figure 3 - 26 W
Tstg storage temperature -65 150 °C
Tj junction temperature - 150 °CBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 3 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
Fig 1. Reverse bias safe operating area Fig 2. Test circuit for reverse bias safe operating area
Fig 3. Normalized total power dissipation as a function of heatsink temperature
VCEclamp (V)
0 1000 200 400 600 800
001aac000
4
6
2
8
10
IC
(A)
0
001aab999
DUT
LC
I LB Bon
VBB
VCC
VCL(CE)
probe point
03aa13
0
40
80
120
0 50 100 150 200
Th (°C)
Pder
(%)BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 4 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
1)Ptot maximum and Ptot peak maximum lines
2)Second breakdown limits
3) I = Region of permissable DC operation
II = Extension for repetitive pulse operation
III = Extension during turn-on in single transistor converters
provided that RBE ≤ 100 Ω and tp ≤ 0.6 μs
Fig 4. Forward bias safe operating area for Tmb ≤ 25 °C
001aac001
10−1
10−2
10
1
102
IC
(A)
10−3
VCEclamp (V)
1 103 102 10
(1)
100 μs
200 μs
I(3)
tp = 20 μs
duty cycle = 0.01
50 μs
500 μs
DC
II(3)
III(3)
(2)
ICM(max)
IC(max)BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 5 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
5. Thermal characteristics
6. Isolation characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-h) thermal resistance from
junction to heatsink
with heatsink compound; see Figure 5 - - 4.8 K/W
Rth(j-a) thermal resistance from
junction to ambient
in free air - 55 - K/W
Fig 5. Transient thermal impedance from junction to heatsink as a function of pulse duration
001aag169
10−2
10−1
1
10
Zth(j-h)
(K/W)
10−3
tp (s)
10−6 102 10 10 −3 10−5 10 1 −1 10−2 10−4
tp
tp
1/f
P
t
1/f δ =
δ = 0.5
0.2
0.1
0.05
0.02
0
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
Visol(RMS) RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C;
from all terminals to external heatsink; clean
and dust free
- - 2500 V
Cisol isolation capacitance Th = 25 °C; f = 1 MHz; from collector to
external heatsink
- 10 - pFBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 6 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
7. Characteristics
[1] Measured with half-sine wave voltage (curve tracer)
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
ICES collector-emitter cut-off current VBE = 0 V; VCE = 850 V; Tj = 125 °C [1] - - 2 mA
VBE = 0 V; VCE = 850 V; Tj = 25 °C [1] - - 1 mA
ICBO collector-base cut-off current VCB = 850 V; IE =0A [1] - - 1 mA
ICEO collector-emitter cut-off current VCE = 425 V; IB =0A [1] - - 0.1 mA
IEBO emitter-base cut-off current VEB = 7 V; IC = 0 A - - 10 mA
VCEOsus collector-emitter sustaining
voltage
IB = 0 A; IC = 10 mA; LC = 25 mH;
see Figure 6; see Figure 7
400 450 - V
VCEsat collector-emitter saturation
voltage
IC = 3 A; IB = 0.6 A; see Figure 8;
see Figure 9
- 0.29 1 V
VBEsat base-emitter saturation voltage IC = 3 A; IB = 0.6 A; see Figure 10 - 0.99 1.5 V
VF forward voltage IF = 2 A; Tj = 25 °C - 1.04 1.5 V
hFE DC current gain IC = 1 mA; VCE = 5 V; Th = 25 °C;
see Figure 11
10 15 32
IC = 500 mA; VCE = 5 V; Th = 25 °C;
see Figure 11
13 21 32
IC = 2 A; VCE = 5 V; Th = 25 °C;
see Figure 11
11 16 22
IC = 3 A; VCE = 5 V; Th = 25 °C;
see Figure 11
- 12.5 -
Dynamic characteristics
ton turn-on time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A;
RL = 75 Ω; Tj = 25 °C; resistive load;
see Figure 12; see Figure 13
- 0.52 0.6 µs
ts storage time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A;
RL = 75 Ω; Tj = 25 °C; resistive load;
see Figure 12; see Figure 13
- 2.7 3.3 µs
IC = 2 A; IBon = 0.4 A; VBB = -5 V;
LB = 1 µH; Tj = 25 °C; inductive load;
see Figure 14; see Figure 15
- 1.2 1.4 µs
IC = 2 A; IBon = 0.4 A; VBB = -5 V;
LB = 1 µH; Tj = 100 °C; inductive load;
see Figure 14; see Figure 15
- - 1.8 µs
tf fall time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A;
RL = 75 Ω; Tj = 25 °C; resistive load;
see Figure 12; see Figure 13
- 0.3 0.35 µs
IC = 2 A; IBon = 0.4 A; VBB = -5 V;
LB = 1 µH; Tj = 100 °C; inductive load;
see Figure 14; see Figure 15
- - 0.12 µs
IC = 2 A; IBon = 0.4 A; VBB = -5 V;
LB = 1 µH; Tj = 25 °C; inductive load;
see Figure 14; see Figure 15
- 0.03 0.06 µsBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 7 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
Fig 6. Test circuit for collector-emitter sustaining
voltage
Fig 7. Oscilloscope display for collector-emitter
sustaining voltage test waveform
Fig 8. Collector-emitter saturation voltage as a
function of base current; typical values
Fig 9. Collector-emitter saturation voltage as a
function of collector current; typical values
001aab987
horizontal
300 Ω 1 Ω
6 V
vertical
oscilloscope
50 V
100 Ω to 200 Ω
30 Hz to 60 Hz
001aab988
min VCE (V)
VCEOsus
IC
(mA)
10
100
250
0
IB (A)
10−2 10 1 10 −1
001aab995
0.8
1.2
0.4
1.6
2.0
VCEsat
(V)
0
IC = 1 A 2 A 3 A 4 A
001aab997
VCEsat
(V)
IC (A)
10−1 1 10
0.2
0.1
0.3
0.4
0.5
0BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 8 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
Fig 10. Base-emitter saturation voltage as a function of
collector current; typical values
Fig 11. DC current gain as a function of collector
current; typical values
Fig 12. Test circuit for resistive load switching Fig 13. Switching times waveforms for resistive load
001aab996
VBEsat
(V)
IC (A)
10−1 1 10
0.6
0.8
0.2
0.4
1.0
1.2
1.4
0
001aab994
IC (A)
10−2 10 1 10 −1
10
102
hFE
1
VCE = 5 V
1 V
Tj
= 25 °C
001aab989
tp
RB VIM
0
RL
DUT
VCC
T
001aab990
IC
IB
10 %
10 %
90 % 90 %
ton toff
ts
tf
t
t
IBon
−IBoff
ICon
tr ≤ 30 nsBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 9 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
Fig 14. Test circuit for inductive load switching Fig 15. Switching times waveforms for inductive load
001aab991
VCC
LC
DUT
I LB Bon
VBB
001aab992
IC
IB
90 %
toff
IBon
ts
tf
t
t
−IBoff
ICon
10 %BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 10 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
8. Package outline
Fig 16. Package outline SOT186A (TO-220F)
REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT186A 3-lead TO-220F
0 5 10 mm
scale
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 'full pack' SOT186A
A
A1
Q
c
K
j
Notes
1. Terminal dimensions within this zone are uncontrolled.
2. Both recesses are ∅ 2.5 × 0.8 max. depth
D
D1
L
L2 L1
b1
b2
e1
e
b w M
1 2 3
q
E
P
T
UNIT b1 D D1 c e L L2 P Q q (1)
max. e A 1
mm 5.08 3 4.6
4.0
A1
2.9
2.5
b
0.9
0.7
1.1
0.9
b2
1.4
1.0
0.7
0.4
15.8
15.2
6.5
6.3
E
10.3
9.7 2.54 14.4
13.5
T
(2)
2.5 0.4
L1
3.30
2.79
j
2.7
1.7
K
0.6
0.4
2.6
2.3
3.0
2.6
w
3.2
3.0
DIMENSIONS (mm are the original dimensions)
02-04-09
06-02-14
mounting
baseBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 11 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
9. Revision history
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BUJD203AX v.1 20100927 Product data sheet - -BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 12 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 27 September 2010 13 of 14
NXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors BUJD203AX
NPN power transistor with integrated diode
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 September 2010
Document identifier: BUJD203AX
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6 Isolation characteristics . . . . . . . . . . . . . . . . . . .5
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
11 Contact information. . . . . . . . . . . . . . . . . . . . . .13
http://www.farnell.com/datasheets/1792649.pdf
1. Product profile
1.1 General description
NPN/NPN general-purpose transistor pair in a small SOT457 (SC-74) Surface-Mounted
Device (SMD) plastic package.
1.2 Features
■ Low collector capacitance
■ Low collector-emitter saturation voltage
■ Closely matched current gain
■ Reduces number of components and board space
■ No mutual interference between the transistors
■ AEC-Q101 qualified
1.3 Applications
■ General-purpose switching and amplification
1.4 Quick reference data
BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
Rev. 01 — 17 July 2009 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
VCEO collector-emitter voltage open base - - 65 V
IC collector current - - 100 mA
hFE DC current gain VCE = 5 V; IC = 2 mA 200 300 450BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 2 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 emitter TR1
2 base TR1
3 collector TR2
4 emitter TR2
5 base TR2
6 collector TR1
1 3 2
6 5 4
sym020
1 2 3
6 5
TR1
TR2
4
Table 3. Ordering information
Type number Package
Name Description Version
BC846DS SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 4. Marking codes
Type number Marking code
BC846DS ZK
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
VCBO collector-base voltage open emitter - 80 V
VCEO collector-emitter voltage open base - 65 V
VEBO emitter-base voltage open collector - 6 V
IC collector current - 100 mA
ICM peak collector current single pulse;
tp ≤ 1 ms
- 200 mA
IBM peak base current single pulse;
tp ≤ 1 ms
- 200 mA
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW
Per device
Ptot total power dissipation Tamb ≤ 25 °C [1] - 380 mWBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 3 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve SOT457 (SC-74)
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Tamb (°C)
−75 175 −25 25 75 125
006aab621
200
300
100
400
500
Ptot
(mW)
0
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point
- - 250 K/W
Per device
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 328 K/WBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 4 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
7. Characteristics
FR4 PCB, standard footprint
Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
006aab622
10−5 10 10 −2 10−4 102 10−1
tp (s)
10−3 103 1
102
10
103
Zth(j-a)
(K/W)
1
δ = 1
0.75
0.50
0.33
0.10
0.05
0.02
0.01
0
0.20
Table 7. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
ICBO collector-base cut-off
current
VCB = 50 V; IE = 0 A - - 15 nA
VCB = 30 V; IE = 0 A;
Tj = 150 °C
--5 µA
IEBO emitter-base cut-off
current
VEB = 6 V; IC = 0 A - - 100 nA
hFE DC current gain VCE =5V
IC = 10 µA - 280 -
IC = 2 mA 200 300 450
VCEsat collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA - 55 100 mV
IC = 100 mA; IB = 5 mA - 200 300 mV
VBEsat base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA - 755 850 mV
IC = 100 mA; IB = 5 mA - 1000 - mV
VBE base-emitter voltage VCE =5V
IC = 2 mA 580 650 700 mV
IC = 10 mA - - 770 mVBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 5 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
Cc collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
- 1.9 - pF
Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A;
f = 1 MHz
- 11 - pF
fT transition frequency VCE = 5 V; IC = 10 mA;
f = 100 MHz
100 - - MHz
NF noise figure VCE = 5 V; IC = 0.2 mA;
RS =2kΩ;
f = 10 Hz to 15.7 kHz
- 1.9 - dB
VCE = 5 V; IC = 0.2 mA;
RS =2kΩ; f = 1 kHz;
B = 200 Hz
- 3.1 - dB
Table 7. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCE =5V
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Tamb = 25 °C
Fig 3. Per transistor: DC current gain as a function of
collector current; typical values
Fig 4. Per transistor: Collector current as a function
of collector-emitter voltage; typical values
006aaa533
200
400
600
hFE
0
IC (mA)
10−2 103 102 10−1 1 10
(3)
(1)
(2)
006aaa532
VCE (V)
0 10 2 4 6 8
0.08
0.12
0.04
0.16
0.20
IC
(A)
0
IB (mA) = 4.50
2.70
3.15
4.05
3.60
0.45
0.90
1.35
1.80
2.25BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 6 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
VCE = 5 V; Tamb = 25 °C IC/IB = 20
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 5. Per transistor: Base-emitter voltage as a
function of collector current; typical values
Fig 6. Per transistor: Base-emitter saturation voltage
as a function of collector current; typical
values
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
VCE = 5 V; Tamb = 25 °C
Fig 7. Per transistor: Collector-emitter saturation
voltage as a function of collector current;
typical values
Fig 8. Per transistor: Transition frequency as a
function of collector current; typical values
006aaa536
0.6
0.8
1
VBE
(V)
0.4
IC (mA)
10−1 103 102 1 10
006aaa534
IC (mA)
10−1 103 102 1 10
0.5
0.9
1.3
0.3
0.7
1.1
VBEsat
(V)
0.1
(1)
(2)
(3)
006aaa535
1
10−1
10
VCEsat
(V)
10−2
IC (mA)
10−1 103 102 1 10
(1)
(2)
(3)
006aaa537
IC (mA)
1 102 10
102
103
fT
(MHz)
10BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 7 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
f = 1 MHz; Tamb = 25 °C f = 1 MHz; Tamb = 25 °C
Fig 9. Per transistor: Collector capacitance as a
function of collector-base voltage; typical
values
Fig 10. Per transistor: Emitter capacitance as a
function of emitter-base voltage; typical values
VCB (V)
0 10 2 4 6 8
006aab620
2
4
6
Cc
(pF)
0
006aaa539
VEB (V)
0 6 2 4
9
11
7
13
15
Ce
(pF)
5BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 8 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
Fig 11. Package outline SOT457 (SC-74)
Dimensions in mm 04-11-08
3.0
2.5
1.7
1.3
3.1
2.7
pin 1 index
1.9
0.26
0.10
0.40
0.25 0.95
1.1
0.9
0.6
0.2
1 3 2
6 5 4
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BC846DS SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 9 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
11. Soldering
Fig 12. Reflow soldering footprint SOT457 (SC-74)
Fig 13. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
sot457_fr
3.45
1.95
3.3 2.825
0.45
(6×)
0.55
(6×)
0.7
(6×)
0.8
(6×)
2.4
0.95
0.95
Dimensions in mm
sot457_fw
5.3
5.05
1.45
(6×)
0.45
(2×)
1.5
(4×)
2.85
1.475
1.475
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mmBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 10 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BC846DS_1 20090717 Product data sheet - -BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 11 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 July 2009
Document identifier: BC846DS_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 8
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information. . . . . . . . . . . . . . . . . . . . . 11
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1. Product profile
1.1 General description
Enhanced ultrafast power diode in a SOD59 (2-lead TO-220AC) plastic package.
1.2 Features and benefits
High thermal cycling performance
Low on-state losses
Low thermal resistance
Soft recovery characteristic
1.3 Applications
Dual Mode (DCM and CCM) PFC Power Factor Correction (PFC) for
Interleaved Topology
1.4 Quick reference data
BYV29F-600
Enhanced ultrafast power diode
Rev. 02 — 7 March 2011 Product data sheet
TO-220AC
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRRM repetitive peak reverse
voltage
- - 600 V
IF(AV) average forward current square-wave pulse; δ = 0.5 ;
Tmb ≤ 115 °C; see Figure 1;
see Figure 2
- - 9A
Static characteristics
VF forward voltage IF = 8 A; Tj = 25 °C;
see Figure 5
- 1.45 1.9 V
IF = 8 A; Tj = 150 °C;
see Figure 5
- 1.25 1.7 V
Dynamic characteristics
trr reverse recovery time IF = 1 A; VR = 30 V;
dIF/dt = 100 A/µs;
Tj = 25 °C; see Figure 6
- 17.5 35 nsBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 2 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
2. Pinning information
3. Ordering information
4. Limiting values
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode
SOD59 (TO-220AC)
2 A anode
mb mb mounting base; cathode
mb
1 2
A
001aaa020
K
Table 3. Ordering information
Type number Package
Name Description Version
BYV29F-600 TO-220AC plastic single-ended package; heatsink mounted; 1 mounting
hole; 2-lead TO-220AC
SOD59
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse voltage - 600 V
VRWM crest working reverse voltage - 600 V
VR reverse voltage DC - 600 V
IF(AV) average forward current square-wave pulse; δ = 0.5 ; Tmb ≤ 115 °C;
see Figure 1; see Figure 2
- 9A
IFRM repetitive peak forward current square-wave pulse; δ = 0.5 ; tp = 25 µs;
Tmb ≤ 115 °C
- 18 A
IFSM non-repetitive peak forward
current
tp = 10 ms; sine-wave pulse; Tj(init) = 25 °C;
see Figure 3
- 91 A
tp = 8.3 ms; sine-wave pulse; Tj(init) = 25 °C;
see Figure 3
- 100 A
Tstg storage temperature -40 150 °C
Tj junction temperature - 150 °CBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 3 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
Fig 1. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
Fig 2. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
Fig 3. Non-repetitive peak forward current as a function of pulse width; square waveform; maximum values
003aae718
0
4
8
12
16
20
0 5 10 15
IF(AV) (A)
Ptot
(W)
δ = 1
0.5
0.2
0.1
003aae719
0
4
8
12
16
0369
IF(AV) (A)
Ptot
(W) a = 1.57
1.9
2.2
2.8
4.0
003aae705
tp (s)
10-5 10-2 10-3 10-4
102
103
IFSM
(A)
101
tp
P
tBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 4 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 2.5 K/W
Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse width
001aag913
1
10−1
10
Zth(j-mb)
(K/W)
10−3
10−2
tp (s)
10−6 10 1 10 −1 10−5 10−3 10−2 10−4
tp
tp
T
P
t
T
δ =BYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 5 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
VF forward voltage IF = 8 A; Tj = 25 °C; see Figure 5 - 1.45 1.9 V
IF = 8 A; Tj = 150 °C; see Figure 5 - 1.25 1.7 V
IR reverse current VR = 600 V; Tj = 100 °C - - 1.5 mA
VR = 600 V; Tj = 25 °C - - 50 µA
Dynamic characteristics
Qr recovered charge IF = 1 A; VR = 30 V; dIF/dt = 100 A/µs;
see Figure 6
- 13 - nC
trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 100 A/µs;
Tj = 25 °C; see Figure 6
- 17.5 35 ns
IRM peak reverse recovery
current
IF = 1 A; VR = 30 V; dIF/dt = 100 A/µs;
see Figure 6
- 1.5 - A
VFR forward recovery voltage IF = 1 A; dIF/dt = 100 A/µs; see Figure 7 - 3.2 - V
Fig 5. Forward current as a function of forward
voltage
Fig 6. Reverse recovery definitions; ramp recovery
003aad323
0
4
8
12
16
20
0123
VF (V)
IF (A)
(1) (2) (3)
003aac562
trr
time
100 %
25 %
IF
dlF
dt
IR IRM
QrBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 6 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
Fig 7. Forward recovery definitions
001aab912
time
time
VFRM
VF
IF
VFBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 7 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
7. Package outline
Fig 8. Package outline SOD59 (TO-220AC)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOD59 2-lead TO-220AC
sod059_po
09-08-17
09-08-25
Unit
mm
max
nom
min
4.7
4.3
1.40
1.15
1.7
1.3
0.65
0.45
15.8
15.6
6.8
6.4
5.08
(REF)
16.25
15.70
3.7
3.5
A
Dimensions
Note
1. Protruded dambar are included in the dimension.
Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59
A1 b
0.95
0.70
b1
(1) c DD1 E
10.30
9.65
eHL
15.0
12.5
P Q
2.6
2.2
q
2.9
2.7
0 5 10 mm
scale
c
A1
A
Q
e
q
H
b1
b
1 2
D1
D
P
E
LBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 8 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BYV29F-600 v.2 20110307 Product data sheet - BYV29F-600 v.1
Modifications: • Various changes to content.
BYV29F-600 v.1 20100907 Product data sheet - -BYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 9 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
Document status [1]
[2] Product status [3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. BYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 10 of 11
NXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors BYV29F-600
Enhanced ultrafast power diode
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 March 2011
Document identifier: BYV29F-600
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .8
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10
10 Contact information. . . . . . . . . . . . . . . . . . . . . .10
1. Product profile
1.1 General description
Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plastic
package intended for use in circuits where high static and dynamic dV/dt and high dI/dt
can occur. This "series C" triac will commutate the full rated RMS current at the maximum
rated junction temperature without the aid of a snubber.
1.2 Features and benefits
3Q technology for improved noise
immunity
High blocking voltage capability
High commutation capability with
maximum false trigger immunity
High immunity to false turn-on by dV/dt
Less sensitive gate for high noise
immunity
Planar passivated for voltage
ruggedness and reliability
Triggering in three quadrants only
1.3 Applications
General purpose motor control circuits
Home appliances
Rectifier-fed DC inductive loads e.g.
DC motors and solenoids
1.4 Quick reference data
BTA204-800C
3Q Hi-Com Triac
Rev. 3 — 9 May 2011 Product data sheet
TO-220AB
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off-state
voltage
- - 800 V
ITSM non-repetitive peak
on-state current
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; see Figure 4;
see Figure 5
- - 25 A
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C;
see Figure 1; see Figure 2;
see Figure 3
- - 4ABTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 2 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
2. Pinning information
3. Ordering information
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 7
- - 35 mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 7
- - 35 mA
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 7
- - 35 mA
Table 1. Quick reference data …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1
SOT78 (TO-220AB)
2 T2 main terminal 2
3 G gate
mb T2 mounting base; main terminal 2
1 2
mb
3
sym051
T1
G
T2
Table 3. Ordering information
Type number Package
Name Description Version
BTA204-800C TO-220AB plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78
BTA204-800C/DG TO-220AB plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 3 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 800 V
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; see Figure 1;
see Figure 2; see Figure 3
- 4A
ITSM non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
see Figure 4; see Figure 5
- 25 A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 27 A
I
2t I2t for fusing tp = 10 ms; sine-wave pulse - 3.1 A2s
dIT/dt rate of rise of on-state current IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs
IGM peak gate current - 2 A
PGM peak gate power - 5 W
PG(AV) average gate power over any 20 ms period - 0.5 W
Tstg storage temperature -40 150 °C
Tj junction temperature - 125 °C
Fig 1. RMS on-state current as a function of mounting
base temperature; maximum values
Fig 2. RMS on-state current as a function of surge
duration; maximum values
Tmb (°C)
-50 150 0 50 100
003aad615
2
3
1
4
5
IT(RMS)
(A)
0
107 °C
003aag083
0
2
4
6
8
10
12
10-2 10-1 1 10
surge duration (s)
IT(RMS)
(A)BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 4 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values
003aag081
4
2
6
8
Ptot
(W)
0
IT(RMS) (A)
120
90
60
30
a = 180
0 4 5
125
122
119
116
113
110
107
104
101
1 2 3
Tmb(max)
(°C)
°
°
°
°
°
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
a
003aag085
10
102
103
10-5 10-4 10-3 10-2 10-1
tp (s)
ITSM
(A)
(1)
ITSM
t
IT
Tj(init) = 25 °C max
tpBTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 5 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
f = 50 Hz
Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
003aag086
10
20
30
ITSM
(A)
0
number of cycles
1 103 102 10
ITSM
t
IT
Tj(init) = 25 °C max
1/f BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 6 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from junction to
mounting base
full cycle; see Figure 6 - - 3 K/W
half cycle; see Figure 6 - - 3.7 K/W
Rth(j-a) thermal resistance from junction to
ambient
in free air - 60 - K/W
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
003aag087
tp (s) 10-5 10 1 10 -1 10-2 10-4 10-3
1
10-1
10
Zth(j-mb)
(K/W)
10-2
(1)
(2)
tp
P
tBTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 7 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C;
see Figure 7
- - 35 mA
VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C;
see Figure 7
- - 35 mA
VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C;
see Figure 7
- - 35 mA
IL latching current VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 8
- - 20 mA
VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C;
see Figure 8
- - 30 mA
VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C;
see Figure 8
- - 20 mA
IH holding current VD = 12 V; Tj = 25 °C; see Figure 9 - - 20 mA
VT on-state voltage IT = 5 A; Tj = 25 °C; see Figure 10 - 1.4 1.7 V
VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C;
see Figure 11
- 0.7 1.5 V
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
see Figure 11
0.25 0.4 - V
ID off-state current VD = 800 V; Tj = 125 °C - 0.1 0.5 mA
Dynamic characteristics
dVD/dt rate of rise of off-state voltage VDM = 536 V; Tj = 125 °C; exponential
waveform; gate open circuit
1000 - - V/µs
dIcom/dt rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 4 A;
dVcom/dt = 20 V/µs; snubberless
condition; gate open circuit
3 - - A/ms
tgt gate-controlled turn-on time ITM = 12 A; VD = 800 V; IG = 0.1 A;
dIG/dt = 5 A/µs
- 2 - µsBTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 8 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
(1) T2- G-
(2) T2+ G-
(3) T2+ G+
Fig 7. Normalized gate trigger current as a function of
junction temperature
Fig 8. Normalized latching current as a function of
junction temperature
Vo = 1.27 V; Rs = 0.091 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. Normalized holding current as a function of
junction temperature
Fig 10. On-state current as a function of on-state
voltage
Tj
(°C)
-50 150 0 50 100
003aad600
1
2
3
IGT
0
(1)
(2)
(3)
IGT(25°C)
Tj
(°C)
-50 150 0 50 100
003aad604
1
2
3
IL
0
IL(25°C)
Tj
(°C)
-50 150 0 50 100
003aad606
1
2
3
IH
0
IH(25°C)
VT (V)
0 3 1 2
003aad611
4
8
12
IT
(A)
0
(1) (2) (3)BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 9 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
Fig 11. Normalized gate trigger voltage as a function of junction temperature
Tj
(°C)
-50 150 0 50 100
003aad596
0.8
1.2
1.6
VGT
0.4
VGT(25°C)BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 10 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
7. Package outline
Fig 12. Package outline SOT78 (TO-220AB)
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT78 SC-46 3-lead TO-220AB
SOT78
08-04-23
08-06-13
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
UNIT A
mm 4.7
4.1
1.40
1.25
0.9
0.6
0.7
0.4
16.0
15.2
6.6
5.9
10.3
9.7
15.0
12.8
3.30
2.79
3.8
3.5
A1
DIMENSIONS (mm are the original dimensions)
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
0 5 10 mm
scale
b b1
(2)
1.6
1.0
c D
1.3
1.0
b2
(2) D1 E e
2.54
L L1
(1) L2
(1)
max.
3.0
p q
3.0
2.7
Q
2.6
2.2
D
D1
q
p
L
123
L1
(1)
b1
(2)
(3×)
b2
(2)
(2×)
e e
b(3×)
E A
A1
c
Q
L2
(1)
mounting
baseBTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 11 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BTA204-800C v.3 20110509 Product data sheet - BTA204_SERIES_B_C v.2
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Type number BTA204-800C separated from data sheet BTA204_SERIES_B_C v.2.
BTA204_SERIES_B_C v.2 19981201 Product specification - BTA204_SERIES_B_C v.1BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 12 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Document status [1]
[2] Product status [3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. BTA204-800C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 9 May 2011 13 of 14
NXP Semiconductors BTA204-800C
3Q Hi-Com Triac
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors BTA204-800C
3Q Hi-Com Triac
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 May 2011
Document identifier: BTA204-800C
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .6
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
10 Contact information. . . . . . . . . . . . . . . . . . . . . .13
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection, encapsulated in small and flat lead
Surface-Mounted Device (SMD) plastic packages.
1.2 Features
■ Forward current: IF ≤ 1 A
■ Reverse voltage: VR ≤ 40 V
■ Very low forward voltage
■ Small and flat lead SMD plastic packages
1.3 Applications
■ Low voltage rectification
■ High efficiency DC-to-DC conversion
■ Switch mode power supply
■ Reverse polarity protection
■ Low power consumption applications
1.4 Quick reference data
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
Rev. 02 — 22 March 2007 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
PMEG4010CEH SOD123F - single
PMEG4010CEJ SOD323F SC-90 single
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IF forward current Tsp ≤ 55 °C - - 1A
VR reverse voltage - - 40 V
VF forward voltage IF =1A [1] - 490 570 mVPMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 2 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
Table 3. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode
001aab540
1 2
sym001
1 2
Table 4. Ordering information
Type number Package
Name Description Version
PMEG4010CEH - plastic surface-mounted package; 2 leads SOD123F
PMEG4010CEJ SC-90 plastic surface-mounted package; 2 leads SOD323F
Table 5. Marking codes
Type number Marking code
PMEG4010CEH C9
PMEG4010CEJ EPPMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 3 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Soldering point of cathode tab.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VR reverse voltage - 40 V
IF forward current Tsp ≤ 55 °C - 1A
IFRM repetitive peak forward current tp ≤ 1 ms;
δ ≤ 0.25
- 7A
IFSM non-repetitive peak forward
current
square wave;
tp = 8 ms
PMEG4010CEH - 9 A
PMEG4010CEJ - 10 A
Ptot total power dissipation Tamb ≤ 25 °C
PMEG4010CEH [1] - 375 mW
[2] - 830 mW
PMEG4010CEJ [1] - 350 mW
[2] - 830 mW
Tj junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
in free air [1]
PMEG4010CEH [2] - - 330 K/W
[3] - - 150 K/W
PMEG4010CEJ [2] - - 350 K/W
[3] - - 150 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[4]
PMEG4010CEH - - 60 K/W
PMEG4010CEJ - - 55 K/WPMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 4 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
7. Characteristics
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VF forward voltage [1]
IF = 1 mA - 210 240 mV
IF = 10 mA - 270 310 mV
IF = 100 mA - 340 390 mV
IF = 500 mA - 420 490 mV
IF = 700 mA - 450 520 mV
IF = 1 A - 490 570 mV
IR reverse current VR = 5 V - 0.8 - µA
VR = 10 V - 1.1 - µA
VR = 40 V - 6 50 µA
Cd diode capacitance VR = 1 V; f = 1 MHz - 69 77 pFPMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 5 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
006aaa755
10
1
103
102
104
IF
(mA)
10−1
VF (V)
0.0 0.8 0.2 0.4 0.6
(1)
(2)
(3)
(4)
(5)
006aaa756
VR (V)
0 40 10 20 30
10−1
10−3
103
10
105
IR
(µA)
10−4
(1)
(2)
(3)
(4)
(5)
10−2
102
104
1
VR (V)
0 40 10 20 30
006aaa757
80
40
120
160
Cd
(pF)
0PMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 6 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
8. Test information
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 4. Duty cycle definition
t1
t2
P
t
006aaa812
duty cycle δ =
t1
t2
Fig 5. Package outline SOD123F Fig 6. Package outline SOD323F (SC-90)
Dimensions in mm 04-11-29
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
Dimensions in mm 04-09-13
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
PMEG4010CEH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
PMEG4010CEJ SOD323FPMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 7 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
11. Soldering
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD323F (SC-90)
1.6
1.6
2.9
4
4.4
2.1 1.1 1.2
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
001aab169
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.95 0.50
solder lands
solder resist
occupied area
solder pastePMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 8 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMEG4010CEH_PMEG4010CEJ_2 20070322 Product data sheet - PMEG4010CEJ_1
Modifications: • The format of this data sheet has been redesigned to comply with the new
identity guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Type number PMEG4010CEH added
• Section 1.1 “General description”: amended
• Table 1 “Product overview”: added
• Table 7 “Thermal characteristics”: Table note 1 amended
• Section 8 “Test information”: added
PMEG4010CEJ_1 20060413 Product data sheet - -PMEG4010CEH_PMEG4010CEJ_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 22 March 2007 9 of 10
NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors PMEG4010CEH; PMEG4010CEJ
1 A very low VF MEGA Schottky barrier rectifiers
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 22 March 2007
Document identifier: PMEG4010CEH_PMEG4010CEJ_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1. Product profile
1.1 General description
Single unidirectional ElectroStatic Discharge (ESD) protection diodes in a SOD882
leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect
one signal line from the damage caused by ESD and other transients.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
Rev. 1 — 16 December 2010 Product data sheet
ESD protection of one line ESD protection up to 30 kV
Max. peak pulse power: PPP = 150 W IEC 61000-4-2; level 4 (ESD)
Low clamping voltage: VCL = 10 V IEC 61000-4-5 (surge); IPP = 10 A
Ultra low leakage current: IRM = 3 nA Ultra small SMD plastic package
AEC-Q101 qualified
Computers and peripherals Portable electronics
Audio and video equipment Communication systems
Cellular handsets and accessories
Table 1. Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff voltage
PESD9X5.0L - - 5.0 V
PESD9X7.0L - - 7.0 V
Cd diode capacitance f = 1 MHz; VR =0V
PESD9X5.0L - 68 100 pF
PESD9X7.0L - 62 100 pFPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 2 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
5. Limiting values
[1] Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to pin 2.
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode [1]
2 anode 1 2
Transparent
top view
006aaa152
1 2
Table 3. Ordering information
Type number Package
Name Description Version
PESD9X5.0L - leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
PESD9X7.0L
Table 4. Marking codes
Type number Marking code
PESD9X5.0L AS
PESD9X7.0L AT
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
PPP peak pulse power tp = 8/20 μs [1][2] - 150 W
IPP peak pulse current tp = 8/20 μs [1][2] - 10 A
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °CPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 3 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 to pin 2.
Table 6. ESD maximum ratings
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
VESD electrostatic discharge voltage IEC 61000-4-2
(contact discharge)
[1][2] - 30 kV
machine model - 400 V
MIL-STD-883
(human body model)
- 10 kV
Table 7. ESD standards compliance
Standard Conditions
IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model) > 4 kV
Fig 1. 8/20 μs pulse waveform according to
IEC 61000-4-5
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
t (μs)
0 40 10 20 30
001aaa630
40
80
120
IPP
(%)
0
e−t
100 % IPP; 8 μs
50 % IPP; 20 μs
001aaa631
IPP
100 %
90 %
t
30 ns
60 ns
10 %
tr = 0.7 ns to 1 nsPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 4 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
6. Characteristics
[1] Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to pin 2.
[3] Non-repetitive current pulse; Transmission Line Pulse (TLP) tp = 100 ns; square pulse;
ANSI/ESD STM5.1-2008.
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff voltage
PESD9X5.0L - - 5.0 V
PESD9X7.0L - - 7.0 V
IRM reverse leakage current
PESD9X5.0L VRWM = 5.0 V - 3 100 nA
PESD9X7.0L VRWM = 7.0 V - 35 500 nA
VBR breakdown voltage IR = 1 mA
PESD9X5.0L 6.2 - - V
PESD9X7.0L 7.5 - - V
Cd diode capacitance f = 1 MHz;
VR =0V
PESD9X5.0L - 68 100 pF
PESD9X7.0L - 62 100 pF
VCL clamping voltage [1][2]
PESD9X5.0L IPP = 10 A - - 18 V
IPP = 1 A - - 10 V
PESD9X7.0L IPP = 10 A - - 18 V
IPP = 1 A - - 11 V
rdyn dynamic resistance IR = 10 A [2][3] - 0.4 - ΩPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 5 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
(1) PESD9X5.0L; VRWM = 5.0 V
(2) PESD9X7.0L; VRWM = 7.0 V
Fig 3. Relative variation of peak pulse power as a
function of junction temperature; typical
values
Fig 4. Relative variation of reverse leakage current
as a function of junction temperature; typical
values
f = 1 MHz; Tamb = 25 °C
(1) PESD9X5.0L
(2) PESD9X7.0L
Fig 5. Diode capacitance as a function of reverse
voltage; typical values
Fig 6. V-I characteristics for a unidirectional
ESD protection diode
Tj
(°C)
0 200 50 100 150
001aaa633
0.4
0.8
1.2
PPP
0
PPP(25°C)
006aac494
1
10
10−1
Tj (°C)
−100 150 −50 0 50 100
IRM
IRM(25°C)
(1)
(2)
VR (V)
0 8 2 4 6
006aac495
40
20
60
80
Cd
(pF)
0
(1)
(2)
006aaa407
−VCL −VBR −VRWM
−IRM
−IR
−IPP
V
I
P-N
− +PESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 6 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
Fig 7. PESD9X5.0L: ESD clamping test setup and waveforms
50 Ω
RZ
CZ
DUT
(DEVICE
UNDER
TEST)
GND
GND
450 Ω
RG 223/U
50 Ω coax
ESD TESTER
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
006aac496
GND
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network) pin 1 to 2
vertical scale = 20 V/div
horizontal scale = 10 ns/div
GND
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network) pin 1 to 2
vertical scale = 20 V/div
horizontal scale = 10 ns/divPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 7 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
Fig 8. PESD9X7.0L: ESD clamping test setup and waveforms
50 Ω
RZ
CZ
DUT
(DEVICE
UNDER
TEST)
GND
GND
450 Ω
RG 223/U
50 Ω coax
ESD TESTER
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
006aac497
GND
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network) pin 1 to 2
vertical scale = 20 V/div
horizontal scale = 10 ns/div
GND
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network) pin 1 to 2
vertical scale = 20 V/div
horizontal scale = 10 ns/divPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 8 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
7. Application information
The PESD9X5.0L and the PESD9X7.0L are designed for the protection of one
unidirectional data or signal line from the damage caused by ESD and surge pulses.
Both devices may be used on lines where the signal polarities are either positive or
negative with respect to ground. The devices provide a surge capability of 150 W
per line for an 8/20 μs waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 9. Application diagram
006aac498
GND
line to be protected
(positive signal polarity)
PESD9X5.0/7.0L
unidirectional protection of one line
GND
line to be protected
(negative signal polarity)
PESD9X5.0/7.0LPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 9 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 10. Package outline SOD882
Dimensions in mm 03-04-17
0.55
0.47
0.65
0.62
0.55
0.50
0.46
cathode marking on top side
1.02
0.95
0.30
0.22
0.30
0.22
2
1
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
10000
PESD9X5.0L SOD882 2 mm pitch, 8 mm tape and reel -315
PESD9X7.0LPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 10 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
11. Soldering
Reflow soldering is the only recommended soldering method.
Fig 11. Reflow soldering footprint SOD882
solder lands
solder resist
occupied area
solder paste
sod882_fr
0.9
0.3
(2×)
R0.05 (8×)
0.6
(2×)
0.7
(2×)
0.4
(2×)
1.3
0.5
(2×)
0.8
(2×)
0.7
Dimensions in mmPESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 11 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PESD9XXL_SER v.1 20101216 Product data sheet - -PESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 12 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. PESD9XXL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 16 December 2010 13 of 14
NXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PESD9X5.0L; PESD9X7.0L
Unidirectional ESD protection diodes
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 December 2010
Document identifier: PESD9XXL_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 8
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Packing information . . . . . . . . . . . . . . . . . . . . . 9
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Contact information. . . . . . . . . . . . . . . . . . . . . 13
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AC Current Probes
P6021A & P6022
The P6021 and P6022 Current Probes provide versatile AC current
measurements. Both probes provide accurate current measurements over a
wide range of frequencies. The P6021 and P6022 allow current
measurements without breaking the circuit by clipping onto the current
carrying conductor. Shielded probe heads are not grounded when the slides
are in their open positions, eliminating accidental grounding of the circuit
under test.
Key performance specifications
P6021A
120 Hz to 60 MHz
10.6 A RMS, 250 A peak, 10 mA sensitivity
P6022
935 Hz to 120 MHz
4 A RMS, 100 A peak, 1 mA sensitivity
Key features
For 1 MΩ inputs
Shielded probe head
AC only
Split core construction allows easy circuit connection
1.5 m (5 ft) cable
Applications
Motor drives
Power inverters/converters
Power supplies
Avionics
P6021A
For general purpose applications, the P6021A provides wide-band
performance with excellent low-frequency characteristics. Bandwidth is
120 Hz to 60 MHz. The probe range is switchable between 2 mA/mV and
10 mA/mV.
P6022
With a head size of 0.47 in. x 0.25 in. (10 mm x 6 mm, about half the size of
the P6021A) and a bandwidth of 935 Hz to 120 MHz, the P6022 is ideal for
measuring currents in compact, high-performance circuits. Passive
termination output is switchable between 1 mA/mV and 10 mA/mV.Specifications
All specifications apply to all models unless noted otherwise.
Physical characteristics
Cable length 1.5 m (59 in)
P6021A probe head
Length 20 cm (7.77 in)
Width 16 mm (0.625 in)
Height 32 mm (1.25 in)
Maximum conductor diameter 5 mm (0.197 in)
P6022 probe head
Length 152 mm (6.0 in)
Width 6.4 mm (0.25 in)
Height 12 mm (0.47 in)
Maximum conductor diameter 2.8 mm (0.11 in)
EMC environment and safety
Compliance CAN/CSA-C22.2 No. 61010-1
CAN/CSA-C22.2 No. 61010-2-032
UL 61010-1
UL61010B-2-032
EN 61010-1
EN 61010-2-032
Datasheet
2 www.tektronix.comOrdering information
Models
P6021A Current Probe
P6022 Current Probe with termination
Standard accessories
6 in. ground lead 196-3521-00
Instruction manual 071-3004-00 (P6021A), 070-0948-03 (P6022)
Termination 011-0106-00 (P6022 only)
Recommended accessories
Nylon carrying case 016-1952-xx
Current loop, 1 turn, 50 Ω with
BNC connector, used for
Performance Verification
067-2396-xx
Deskew/calibration fixture 067-1686-xx
Warranty
One year parts and labor.
Service options
Opt. C3 Calibration Service 3 Years
Opt. C5 Calibrati