Alimentation-stabilisee-a-decoupage - PDF - Farnell Element 14 - Revenir à l'accueil

 

 

Branding Farnell element14 (France)

 

Farnell Element 14 :

Miniature

Everything You Need To Know About Arduino

Miniature

Tutorial 01 for Arduino: Getting Acquainted with Arduino

Miniature

The Cube® 3D Printer

Miniature

What's easier- DIY Dentistry or our new our website features?

 

Miniature

Ben Heck's Getting Started with the BeagleBone Black Trailer

Miniature

Ben Heck's Home-Brew Solder Reflow Oven 2.0 Trailer

Miniature

Get Started with Pi Episode 3 - Online with Raspberry Pi

Miniature

Discover Simulink Promo -- Exclusive element14 Webinar

Miniature

Ben Heck's TV Proximity Sensor Trailer

Miniature

Ben Heck's PlayStation 4 Teardown Trailer

See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…

Miniature

Get Started with Pi Episode 4 - Your First Raspberry Pi Project

Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.

Miniature

Ben Heck Anti-Pickpocket Wallet Trailer

Miniature

Molex Earphones - The 14 Holiday Products of Newark element14 Promotion

Miniature

Tripp Lite Surge Protector - The 14 Holiday Products of Newark element14 Promotion

Miniature

Microchip ChipKIT Pi - The 14 Holiday Products of Newark element14 Promotion

Miniature

Beagle Bone Black - The 14 Holiday Products of Newark element14 Promotion

Miniature

3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

Miniature

3M Colored Duct Tape - The 14 Holiday Products of Newark element14 Promotion

Miniature

Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

Miniature

Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

Miniature

Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

Miniature

Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

Miniature

Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

Miniature

Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

Miniature

Dymo RHINO 6000 Label Printer - The 14 Holiday Products of Newark element14 Promotion

Miniature

3M LED Advanced Lights A-19 - The 14 Holiday Products of Newark element14 Promotion

Miniature

Innovative LPS Resistor Features Very High Power Dissipation

Miniature

Charge Injection Evaluation Board for DG508B Multiplexer Demo

Miniature

Ben Heck The Great Glue Gun Trailer Part 2

Miniature

Introducing element14 TV

Miniature

Ben Heck Time to Meet Your Maker Trailer

Miniature

Détecteur de composants

Miniature

Recherche intégrée

Miniature

Ben Builds an Accessibility Guitar Trailer Part 1

Miniature

Ben Builds an Accessibility Guitar - Part 2 Trailer

Miniature

PiFace Control and Display Introduction

Miniature

Flashmob Farnell

Miniature

Express Yourself in 3D with Cube 3D Printers from Newark element14

Miniature

Farnell YouTube Channel Move

Miniature

Farnell: Design with the best

Miniature

French Farnell Quest

Miniature

Altera - 3 Ways to Quickly Adapt to Changing Ethernet Protocols

Miniature

Cy-Net3 Network Module

Miniature

MC AT - Professional and Precision Series Thin Film Chip Resistors

Miniature

Solderless LED Connector

Miniature

PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701T

Miniature

3-axis Universal Motion Controller For Stepper Motor Drivers: TMC429

Miniature

Voltage Level Translation

Puce électronique / Microchip :

Miniature

Microchip - 8-bit Wireless Development Kit

Miniature

Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

Miniature

Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

Miniature

Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

Sans fil - Wireless :

Miniature

Microchip - 8-bit Wireless Development Kit

Miniature

Wireless Power Solutions - Wurth Electronics, Texas Instruments, CadSoft and element14

Miniature

Analog Devices - Remote Water Quality Monitoring via a Low Power, Wireless Network

Texas instrument :

Miniature

Texas Instruments - Automotive LED Headlights

Miniature

Texas Instruments - Digital Power Solutions

Miniature

Texas Instruments - Industrial Sensor Solutions

Miniature

Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

Miniature

Texas Instruments - Industrial Automation System Components

Miniature

Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

Miniature

Texas Instruments - TMS320C66x KeyStone Multicore Architecture

Miniature

Texas Instruments - Industrial Interfaces

Miniature

Texas Instruments - Concerto™ MCUs - Connectivity without compromise

Miniature

Texas Instruments - Stellaris Robot Chronos

Miniature

Texas Instruments - DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit

Ordinateurs :

Miniature

Ask Ben Heck - Connect Raspberry Pi to Car Computer

Miniature

Ben's Portable Raspberry Pi Computer Trailer

Miniature

Ben's Raspberry Pi Portable Computer Trailer 2

Miniature

Ben Heck's Pocket Computer Trailer

Miniature

Ask Ben Heck - Atari Computer

Miniature

Ask Ben Heck - Using Computer Monitors for External Displays

Miniature

Raspberry Pi Partnership with BBC Computer Literacy Project - Answers from co-founder Eben Upton

Miniature

Installing RaspBMC on your Raspberry Pi with the Farnell element14 Accessory kit

Miniature

Raspberry Pi Served - Joey Hudy

Miniature

Happy Birthday Raspberry Pi

Miniature

Raspberry Pi board B product overview

Logiciels :

Miniature

Ask Ben Heck - Best Opensource or Free CAD Software

Miniature

Tektronix FPGAView™ software makes debugging of FPGAs faster than ever!

Miniature

Ask Ben Heck - Best Open-Source Schematic Capture and PCB Layout Software

Miniature

Introduction to Cadsoft EAGLE PCB Design Software in Chinese

Miniature

Altera - Developing Software for Embedded Systems on FPGAs

Tutoriels :

Miniature

Ben Heck The Great Glue Gun Trailer Part 1

Miniature

the knode tutorial - element14

Miniature

Ben's Autodesk 123D Tutorial Trailer

Miniature

Ben's CadSoft EAGLE Tutorial Trailer

Miniature

Ben Heck's Soldering Tutorial Trailer

Miniature

Ben Heck's AVR Dev Board tutorial

Miniature

Ben Heck's Pinball Tutorial Trailer

Miniature

Ben Heck's Interface Tutorial Trailer

Miniature

First Stage with Python and PiFace Digital

Miniature

Cypress - Getting Started with PSoC® 3 - Part 2

Miniature

Energy Harvesting Challenge

Miniature

New Features of CadSoft EAGLE v6

Autres documentations :

[TXT]

 Farnell-06-6544-8-PD..> 26-Mar-2014 17:56  2.7M  

[TXT]

 Farnell-3M-Polyimide..> 21-Mar-2014 08:09  3.9M  

[TXT]

 Farnell-3M-VolitionT..> 25-Mar-2014 08:18  3.3M  

[TXT]

 Farnell-10BQ060-PDF.htm 13-Jun-2014 18:26  2.4M  

[TXT]

 Farnell-12mm-Size-In..> 13-Jun-2014 18:26  2.4M  

[TXT]

 Farnell-50A-High-Pow..> 20-Mar-2014 17:31  2.9M  

[TXT]

 Farnell-1907-2006-PD..> 26-Mar-2014 17:56  2.7M  

[TXT]

 Farnell-5910-PDF.htm    25-Mar-2014 08:15  3.0M  

[TXT]

 Farnell-6517b-Electr..> 29-Mar-2014 11:12  3.3M  

[TXT]

 Farnell-A-True-Syste..> 29-Mar-2014 11:13  3.3M  

[TXT]

 Farnell-AD524-PDF.htm   20-Mar-2014 17:33  2.8M  

[TXT]

 Farnell-ADSP-21362-A..> 20-Mar-2014 17:34  2.8M  

[TXT]

 Farnell-ALF1225-12-V..> 01-Apr-2014 07:40  3.4M  

[TXT]

 Farnell-ALF2412-24-V..> 01-Apr-2014 07:39  3.4M  

[TXT]

 Farnell-ARADUR-HY-13..> 26-Mar-2014 17:55  2.8M  

[TXT]

 Farnell-ARALDITE-201..> 21-Mar-2014 08:12  3.7M  

[TXT]

 Farnell-ARALDITE-CW-..> 26-Mar-2014 17:56  2.7M  

[TXT]

 Farnell-ATMEL-8-bit-..> 19-Mar-2014 18:04  2.1M  

[TXT]

 Farnell-ATMEL-8-bit-..> 11-Mar-2014 07:55  2.1M  

[TXT]

 Farnell-ATtiny20-PDF..> 25-Mar-2014 08:19  3.6M  

[TXT]

 Farnell-ATtiny26-L-A..> 13-Jun-2014 18:40  1.8M  

[TXT]

 Farnell-Alimentation..> 01-Apr-2014 07:42  3.4M  

[TXT]

 Farnell-Amplificateu..> 29-Mar-2014 11:11  3.3M  

[TXT]

 Farnell-Atmel-ATmega..> 19-Mar-2014 18:03  2.2M  

[TXT]

 Farnell-BC846DS-NXP-..> 13-Jun-2014 18:42  1.6M  

[TXT]

 Farnell-BK2650A-BK26..> 29-Mar-2014 11:10  3.3M  

[TXT]

 Farnell-BT151-650R-N..> 13-Jun-2014 18:40  1.7M  

[TXT]

 Farnell-BTA204-800C-..> 13-Jun-2014 18:42  1.6M  

[TXT]

 Farnell-BUJD203AX-NX..> 13-Jun-2014 18:41  1.7M  

[TXT]

 Farnell-BYV29F-600-N..> 13-Jun-2014 18:42  1.6M  

[TXT]

 Farnell-BYV79E-serie..> 10-Mar-2014 16:19  1.6M  

[TXT]

 Farnell-C.A 8332B-C...> 01-Apr-2014 07:40  3.4M  

[TXT]

 Farnell-CC2560-Bluet..> 29-Mar-2014 11:14  2.8M  

[TXT]

 Farnell-CIRRUS-LOGIC..> 10-Mar-2014 17:20  2.1M  

[TXT]

 Farnell-CS5532-34-BS..> 01-Apr-2014 07:39  3.5M  

[TXT]

 Farnell-Cannon-ZD-PD..> 11-Mar-2014 08:13  2.8M  

[TXT]

 Farnell-Circuit-Note..> 26-Mar-2014 18:00  2.8M  

[TXT]

 Farnell-Circuit-Note..> 26-Mar-2014 18:00  2.8M  

[TXT]

 Farnell-Cles-electro..> 21-Mar-2014 08:13  3.9M  

[TXT]

 Farnell-Conception-d..> 11-Mar-2014 07:49  2.4M  

[TXT]

 Farnell-Controle-de-..> 11-Mar-2014 08:16  2.8M  

[TXT]

 Farnell-Current-Tran..> 26-Mar-2014 17:58  2.7M  

[TXT]

 Farnell-Current-Tran..> 26-Mar-2014 17:58  2.7M  

[TXT]

 Farnell-Current-Tran..> 26-Mar-2014 17:59  2.7M  

[TXT]

 Farnell-Current-Tran..> 26-Mar-2014 17:59  2.7M  

[TXT]

 Farnell-DC-Fan-type-..> 13-Jun-2014 18:27  1.8M  

[TXT]

 Farnell-De-la-puissa..> 29-Mar-2014 11:10  3.3M  

[TXT]

 Farnell-Directive-re..> 25-Mar-2014 08:16  3.0M  

[TXT]

 Farnell-Download-dat..> 13-Jun-2014 18:40  1.8M  

[TXT]

 Farnell-ECO-Series-T..> 20-Mar-2014 08:14  2.5M  

[TXT]

 Farnell-ELMA-PDF.htm    29-Mar-2014 11:13  3.3M  

[TXT]

 Farnell-EMC1182-PDF.htm 25-Mar-2014 08:17  3.0M  

[TXT]

 Farnell-EPCOS-Sample..> 11-Mar-2014 07:53  2.2M  

[TXT]

 Farnell-ES2333-PDF.htm  11-Mar-2014 08:14  2.8M  

[TXT]

 Farnell-Ed.081002-DA..> 19-Mar-2014 18:02  2.5M  

[TXT]

 Farnell-F42202-PDF.htm  19-Mar-2014 18:00  2.5M  

[TXT]

 Farnell-FICHE-DE-DON..> 10-Mar-2014 16:17  1.6M  

[TXT]

 Farnell-Ferric-Chlor..> 29-Mar-2014 11:14  2.8M  

[TXT]

 Farnell-GALVA-A-FROI..> 26-Mar-2014 17:56  2.7M  

[TXT]

 Farnell-GALVA-MAT-Re..> 26-Mar-2014 17:57  2.7M  

[TXT]

 Farnell-GN-RELAYS-AG..> 20-Mar-2014 08:11  2.6M  

[TXT]

 Farnell-HUNTSMAN-Adv..> 10-Mar-2014 16:17  1.7M  

[TXT]

 Farnell-Haute-vitess..> 11-Mar-2014 08:17  2.4M  

[TXT]

 Farnell-IP4252CZ16-8..> 13-Jun-2014 18:41  1.7M  

[TXT]

 Farnell-Instructions..> 19-Mar-2014 18:01  2.5M  

[TXT]

 Farnell-L-efficacite..> 11-Mar-2014 07:52  2.3M  

[TXT]

 Farnell-LCW-CQ7P.CC-..> 25-Mar-2014 08:19  3.2M  

[TXT]

 Farnell-LOCTITE-542-..> 25-Mar-2014 08:15  3.0M  

[TXT]

 Farnell-LOCTITE-3463..> 25-Mar-2014 08:19  3.0M  

[TXT]

 Farnell-LUXEON-Guide..> 11-Mar-2014 07:52  2.3M  

[TXT]

 Farnell-Les-derniers..> 11-Mar-2014 07:50  2.3M  

[TXT]

 Farnell-Loctite3455-..> 25-Mar-2014 08:16  3.0M  

[TXT]

 Farnell-Low-cost-Enc..> 13-Jun-2014 18:42  1.7M  

[TXT]

 Farnell-Lubrifiant-a..> 26-Mar-2014 18:00  2.7M  

[TXT]

 Farnell-MC3510-PDF.htm  25-Mar-2014 08:17  3.0M  

[TXT]

 Farnell-MC21605-PDF.htm 11-Mar-2014 08:14  2.8M  

[TXT]

 Farnell-MCF532x-7x-E..> 29-Mar-2014 11:14  2.8M  

[TXT]

 Farnell-MICREL-KSZ88..> 11-Mar-2014 07:54  2.2M  

[TXT]

 Farnell-MICROCHIP-PI..> 19-Mar-2014 18:02  2.5M  

[TXT]

 Farnell-MOLEX-39-00-..> 10-Mar-2014 17:19  1.9M  

[TXT]

 Farnell-MOLEX-43020-..> 10-Mar-2014 17:21  1.9M  

[TXT]

 Farnell-MOLEX-43160-..> 10-Mar-2014 17:21  1.9M  

[TXT]

 Farnell-MOLEX-87439-..> 10-Mar-2014 17:21  1.9M  

[TXT]

 Farnell-MPXV7002-Rev..> 20-Mar-2014 17:33  2.8M  

[TXT]

 Farnell-Microchip-MC..> 13-Jun-2014 18:27  1.8M  

[TXT]

 Farnell-Microship-PI..> 11-Mar-2014 07:53  2.2M  

[TXT]

 Farnell-Miniature-Ci..> 26-Mar-2014 17:55  2.8M  

[TXT]

 Farnell-Molex-Crimp-..> 10-Mar-2014 16:27  1.7M  

[TXT]

 Farnell-Multi-Functi..> 20-Mar-2014 17:38  3.0M  

[TXT]

 Farnell-NTE_SEMICOND..> 11-Mar-2014 07:52  2.3M  

[TXT]

 Farnell-NXP-74VHC126..> 10-Mar-2014 16:17  1.6M  

[TXT]

 Farnell-NXP-BT136-60..> 11-Mar-2014 07:52  2.3M  

[TXT]

 Farnell-NXP-PBSS9110..> 10-Mar-2014 17:21  1.9M  

[TXT]

 Farnell-NXP-PCA9555 ..> 11-Mar-2014 07:54  2.2M  

[TXT]

 Farnell-NXP-PMBFJ620..> 10-Mar-2014 16:16  1.7M  

[TXT]

 Farnell-NXP-PSMN1R7-..> 10-Mar-2014 16:17  1.6M  

[TXT]

 Farnell-NXP-PSMN7R0-..> 10-Mar-2014 17:19  2.1M  

[TXT]

 Farnell-NXP-TEA1703T..> 11-Mar-2014 08:15  2.8M  

[TXT]

 Farnell-Novembre-201..> 20-Mar-2014 17:38  3.3M  

[TXT]

 Farnell-OMRON-Master..> 10-Mar-2014 16:26  1.8M  

[TXT]

 Farnell-OSLON-SSL-Ce..> 19-Mar-2014 18:03  2.1M  

[TXT]

 Farnell-OXPCIE958-FB..> 13-Jun-2014 18:40  1.8M  

[TXT]

 Farnell-PBSS5160T-60..> 19-Mar-2014 18:03  2.1M  

[TXT]

 Farnell-PDTA143X-ser..> 20-Mar-2014 08:12  2.6M  

[TXT]

 Farnell-PDTB123TT-NX..> 13-Jun-2014 18:43  1.5M  

[TXT]

 Farnell-PESD5V0F1BL-..> 13-Jun-2014 18:43  1.5M  

[TXT]

 Farnell-PESD9X5.0L-P..> 13-Jun-2014 18:43  1.6M  

[TXT]

 Farnell-PIC24FJ256GB..> 13-Jun-2014 18:26  2.4M  

[TXT]

 Farnell-PMBT3906-PNP..> 13-Jun-2014 18:44  1.5M  

[TXT]

 Farnell-PMEG4010CEH-..> 13-Jun-2014 18:43  1.6M  

[TXT]

 Farnell-Panasonic-EC..> 20-Mar-2014 17:36  2.6M  

[TXT]

 Farnell-Panasonic-EZ..> 20-Mar-2014 08:10  2.6M  

[TXT]

 Farnell-Panasonic-Id..> 20-Mar-2014 17:35  2.6M  

[TXT]

 Farnell-Panasonic-Ne..> 20-Mar-2014 17:36  2.6M  

[TXT]

 Farnell-Panasonic-Ra..> 20-Mar-2014 17:37  2.6M  

[TXT]

 Farnell-Panasonic-TS..> 20-Mar-2014 08:12  2.6M  

[TXT]

 Farnell-Panasonic-Y3..> 20-Mar-2014 08:11  2.6M  

[TXT]

 Farnell-Pico-Spox-Wi..> 10-Mar-2014 16:16  1.7M  

[TXT]

 Farnell-Pompes-Charg..> 24-Apr-2014 20:23  3.3M  

[TXT]

 Farnell-Portable-Ana..> 29-Mar-2014 11:16  2.8M  

[TXT]

 Farnell-Premier-Farn..> 21-Mar-2014 08:11  3.8M  

[TXT]

 Farnell-Proskit-SS-3..> 10-Mar-2014 16:26  1.8M  

[TXT]

 Farnell-Puissance-ut..> 11-Mar-2014 07:49  2.4M  

[TXT]

 Farnell-Radial-Lead-..> 20-Mar-2014 08:12  2.6M  

[TXT]

 Farnell-Realiser-un-..> 11-Mar-2014 07:51  2.3M  

[TXT]

 Farnell-Reglement-RE..> 21-Mar-2014 08:08  3.9M  

[TXT]

 Farnell-S-TRI-SWT860..> 21-Mar-2014 08:11  3.8M  

[TXT]

 Farnell-SB175-Connec..> 11-Mar-2014 08:14  2.8M  

[TXT]

 Farnell-SMBJ-Transil..> 29-Mar-2014 11:12  3.3M  

[TXT]

 Farnell-SOT-23-Multi..> 11-Mar-2014 07:51  2.3M  

[TXT]

 Farnell-Septembre-20..> 20-Mar-2014 17:46  3.7M  

[TXT]

 Farnell-Serie-PicoSc..> 19-Mar-2014 18:01  2.5M  

[TXT]

 Farnell-Series-2600B..> 20-Mar-2014 17:30  3.0M  

[TXT]

 Farnell-Strangkuhlko..> 21-Mar-2014 08:09  3.9M  

[TXT]

 Farnell-Supercapacit..> 26-Mar-2014 17:57  2.7M  

[TXT]

 Farnell-TEKTRONIX-DP..> 10-Mar-2014 17:20  2.0M  

[TXT]

 Farnell-Tektronix-AC..> 13-Jun-2014 18:44  1.5M  

[TXT]

 Farnell-Telemetres-l..> 20-Mar-2014 17:46  3.7M  

[TXT]

 Farnell-The-essentia..> 10-Mar-2014 16:27  1.7M  

[TXT]

 Farnell-USB1T11A-PDF..> 19-Mar-2014 18:03  2.1M  

[TXT]

 Farnell-WetTantalum-..> 11-Mar-2014 08:14  2.8M  

[TXT]

 Farnell-XPS-MC16-XPS..> 11-Mar-2014 08:15  2.8M  

[TXT]

 Farnell-YAGEO-DATA-S..> 11-Mar-2014 08:13  2.8M  

[TXT]

 Farnell-ZigBee-ou-le..> 11-Mar-2014 07:50  2.4M  

[TXT]

 Farnell-celpac-SUL84..> 21-Mar-2014 08:11  3.8M  

[TXT]

 Farnell-china_rohs_o..> 21-Mar-2014 10:04  3.9M  

[TXT]

 Farnell-cree-Xlamp-X..> 20-Mar-2014 17:34  2.8M  

[TXT]

 Farnell-cree-Xlamp-X..> 20-Mar-2014 17:35  2.7M  

[TXT]

 Farnell-cree-Xlamp-X..> 20-Mar-2014 17:31  2.9M  

[TXT]

 Farnell-cree-Xlamp-m..> 20-Mar-2014 17:32  2.9M  

[TXT]

 Farnell-cree-Xlamp-m..> 20-Mar-2014 17:32  2.9M  

[TXT]

 Farnell-ir1150s_fr.p..> 29-Mar-2014 11:11  3.3M  

[TXT]

 Farnell-manual-bus-p..> 10-Mar-2014 16:29  1.9M  

[TXT]

 Farnell-propose-plus..> 11-Mar-2014 08:19  2.8M  

[TXT]

 Farnell-techfirst_se..> 21-Mar-2014 08:08  3.9M  

[TXT]

 Farnell-testo-205-20..> 20-Mar-2014 17:37  3.0M  

[TXT]

 Farnell-testo-470-Fo..> 20-Mar-2014 17:38  3.0M  

[TXT]

 Farnell-uC-OS-III-Br..> 10-Mar-2014 17:20  2.0M  

[TXT]

 Sefram-7866HD.pdf-PD..> 29-Mar-2014 11:46  472K  

[TXT]

 Sefram-CAT_ENREGISTR..> 29-Mar-2014 11:46  461K  

[TXT]

 Sefram-CAT_MESUREURS..> 29-Mar-2014 11:46  435K  

[TXT]

 Sefram-GUIDE_SIMPLIF..> 29-Mar-2014 11:46  481K  

[TXT]

 Sefram-GUIDE_SIMPLIF..> 29-Mar-2014 11:46  442K  

[TXT]

 Sefram-GUIDE_SIMPLIF..> 29-Mar-2014 11:46  422K  

[TXT]

 Sefram-SP270.pdf-PDF..> 29-Mar-2014 11:46  464K
Construction A1 Joint&Fissure • Mastic de calfeutrement à base de résines acryliques en émulsion. • Compatibilité toutes peintures • Intérieur et extérieur • Excellente tenue au vieillissement • Joints et fissures murales, intérieures ou extérieures. • Joints de préfabrication légère. • Joints de calfeutrement avant recouvrement avec un revêtement d'imperméabilité. • Joints de calfeutrement entre éléments fractionnés de faible amplitude. • Joints de finition au droit des plinthes, murs, cloisons, escaliers, poutres, fenêtres # • Béton, brique, mortier hydraulique, fibre-ciment, bois, plâtre, aluminium • Autres supports, faire un essai préalable ou consulter notre Service Conseil Technique. • Conditionnement : cartouches de 300 ml • Coloris : blanc, gris, ton pierre. MODE D'EMPLOI Informations Complémentaires Caractéristiques Type de mastic Acrylique phase aqueuse Densité Environ 1.60 Mise en OEUVRE 1. Préparation des supports • Les supports doivent être sains, propres, secs et dégraissés. 2. Traitement des joints • Eliminer l'ancien mastic et fond de joint. Vérifier que la dimension du joint correspond aux mouvements attendus. (voir règles professionnelles Snjf). • Reconstituer les supports et les parties peu ou mal adhérentes et laisser sécher. Aviver si nécessaire les lèvres du joint au disque à béton. • Brosser, éliminer toutes les souillures et matières non adhérentes, puis effectuer un dépoussiérage. • Mettre en place un fond de joint si nécessaire pour régler Rubson.com - Fiche produit page 1 / 3Dureté Shore A Environ 25 Température d'application 5°C à 40°C Température de service -20°C à 80°C Perte de volume après séchage Environ 20% Allongement à la rupture Supérieur à 100% Temps de formation de peau Environ 20 minutes Temps de séchage Cordon de 5 mm en 72h. Nettoyage du matériel Immédiatement à l'eau Consommation (joint de 5mm) 12 mètres Observations Appliquer par temps sec et hors pluie et gel. • Un temps froid et humide peut ralentir ou même stopper le séchage du mastic. • Pour des joints ruisselants, immergés ou soumis à stagnation d'eau, utiliser Rubson FT 101 ou consulter notre Service Conseil Technique. • Pour une mise en peinture : attendre le séchage complet et vérifier éventuellement la compatibilité peinture. Stockage 12 mois, dans son emballage d'origine hermétiquement fermé dans un local frais à l'abri du gel. Sécurité - Hygiène - Environnement Consulter la fiche de données de sécurité de Rubson A1 disponible sur demande au 01 46 84 97 87 ou sur le site www.sdb.henkel.de. Ce produit est réservé à un usage professionnel. Ce document contient des informations données de bonne foi et fondées sur l'état actuel de la règlementation et de nos connaissances. Etant donné la diversité des matériaux et des méthodes de travail, ces informations ne peuvent constituer que des recommandations, et ne doivent pas se substituer aux essais préliminaires indispensables pour s'assurer de l'adéquation du produit à chaque usage envisagé. Par conséquent le présent document ne saurait engager la responsabilité de Henkel France notamment en cas d'atteinte à des tiers du fait de l'utilisation de nos produits. Il appartient aux utilisateurs de s'assurer du respect de la législation et règlementation locale. La société Henkel France garantit que l'épaisseur du cordon de mastic. • Remarque : Dégraisser les surfaces métalliques et effectuer un traitement anti-rouille sur les métaux ferreux. 3. Traitement des fissures • Ouvrir les fissures au grattoir triangulaire ou à la disqueuse au minimum sur 5 mm de largueur et 10 mm de profondeur. • Eliminer les souillures, brosser, dépoussiérer ; imprégner au besoin le support avec un fixateur, laisser sécher. • Garnir la fissure avec le mastic Rubson Joint et Fissure A1, sans déborder sur le support, araser, lisser. • Recouvrir (à l'exclusion des fixateurs solvantés) par un système d'imperméabilité de performance I2, I3 ou I4 adapté (cf DTU 42.1). 4. Application • Extruder en poussant le produit devant la buse. Le cordon de mastic doit être sans bulle d'air et suivre la fissure sans déborder. • Lisser à la spatule humidifiée et éliminer le surplus de mastic. • Laisser sécher 24 à 48h et compenser le retrait par une nouvelle application du mastic si nécessaire. 5. Matériel d'application • Pistolet manuel ou pneumatique. • Vous pouvez utiliser le Super Pistolet Mastic Pliable Rubson, compact, robuste et léger 6. Temps de prise • Lissage : 15 minutes maximum après application. • Recouvrable : 4 h minimum pour les peintures à l'eau et 24h minimum pour les peintures solvantées. • Séchage à coeur : 72 heures environ pour une section de joint de 5mm. Rubson.com - Fiche produit page 2 / 3ses produits respectent ses spécifications de vente. Les utilisateurs sont invités à vérifier qu'ils sont en possession de la dernière version du présent document, la société Henkel France étant à leur disposition pour fournir toute information complémentaire. Norme et certification • SNJF Façade • Mastic plastique F 12.5P • Conforme à ISO 11600 Rubson.com - Fiche produit page 3 / 3  Sunplus Technology Co., Ltd. 1 Rev.: 1.2 2000.05.05 SPLC780A1 16COM/40SEG CONTROLLER/DRIVER GENERAL DESCRIPTION The SPLC780A1, a dot-matrix LCD controller and driver from SUNPLUS, is a unique design for displaying alpha-numeric, Japanese-Kana characters and symbols. The SPLC780A1 provides two types of interfaces to MPU: 4-bit and 8-bit interfaces. The transferring speed of 8-bit is twice faster than 4-bit. A single SPLC780A1 is able to display up to two 8-character lines. By cascading with SPLC100 or SPLC063, the display capability can be extended. The CMOS technology ensures the power saves in the most efficient way and the performance keeps in the highest rank. FEATURES  Character generator ROM: 7200 bits  Character font 5 x 7 dots: 160 characters  Character font 5 x 10 dots: 32 characters  Character generator RAM: 512 bits  Character font 5 x 7 dots: 8 characters  Character font 5 x 10 dots: 4 characters  Provide connecting to 4-bit or 8-bit MPU  Direct driver for LCD: 16 COMs x 40 SEGs  Duty factor (selected by program):  1/8 duty: 1 line of 5 x 7 dots  1/11 duty: 1 line of 5 x 10 dots  1/16 duty: 2 lines of 5 x 7 dots / line  Built-in power on automatic reset circuit  Built-in oscillator circuit (with external resistor)  Support external clock operation BLOCK DIAGRAM CL1,CL2 M COM16-1 SEG40 - 1 D I / O Buffer Timing Generation Circuit 40 Segments x 16 Commons LCD Driver Character Generator ROM 40-bit Shift Register Latch Circuit 16-bit Shift Register Parallel to Serial Data Conversion Circuit Cursor Blink Control Circuit Character Generator RAM Display Data RAM 80 Bytes Address Counter Instruction Register Data Register Busy Flag Instruction Decorder      OSC1 OSC2 E RS R / W DB3-0 DB7-4 Power Supply for LCD Drive : (V5-1) VDD VSS Page : 1/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 37.0.1 SECTION 1: Identification de la substance/du mélange et de la société/l'entreprise · 1.1 Identificateur de produit · Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 · 1.2 Utilisations identifiées pertinentes de la substance ou du mélange et utilisations déconseillées usage professionnel et/ou industriel · Emploi de la substance / de la préparation: Réactif · 1.3 Renseignements concernant le fournisseur de la fiche de données de sécurité : · Producteur/fournisseur: CIF 240 rue Hélène Boucher 78530 BUC Tél : 01.39.66.96.83 – Fax 01.33.66.97.78 E-mail : cif@cif.fr – Web : www.cif.fr · 1.4 Numéro d'appel d'urgence: France (ORFILA 24h/24) - Tel : +33 (0)1 45 42 59 59 EU Tel : 112 Belgique - Tel : 32 070/245 245 Suisse : 145 SECTION 2: Identification des dangers · 2.1 Classification de la substance ou du mélange · Classification selon le règlement (CE) n° 1272/2008 : GHS05 Skin Corr. 1A H314 Provoque des brûlures de la peau et des lésions oculaires graves. · Classification selon la directive 67/548/CEE ou directive 1999/45/CE : C; Corrosif R35: Provoque de graves brûlures. · Indications particulières concernant les dangers pour l'homme et l'environnement: Le produit est à étiqueter, conformément au procédé de calcul de la "Directive générale de classification pour les préparations de la CE", dans la dernière version valable. · Système de classification: La classification correspond aux listes CEE actuelles, complétée par des indications tirées de publications spécialisées et des indications fournies par l'entreprise. · 2.2 Éléments d'étiquetage · Marquage selon les directives CEE: Le produit est classé et identifié suivant les directives de la Communauté Européenne/les lois respectives nationales. 2008/58/CE (30eme ATP) ; 2009/2/CE (31eme ATP) ; 2006/8/CE · Lettre d'identification et caractérisation de danger du produit: C Corrosif · Composants dangereux déterminants pour l'étiquetage: hydroxyde de sodium (suite page 2) FRPage : 2/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 1) 37.0.1 · Phrases R: 35 Provoque de graves brûlures. · Phrases S: 26 En cas de contact avec les yeux, laver immédiatement et abondamment avec de l'eau et consulter un spécialiste. 36/37/39 Porter un vêtement de protection approprié, des gants et un appareil de protection des yeux/du visage. 45 En cas d'accident ou de malaise, consulter immédiatement un médecin (si possible, lui montrer l'étiquette). 60 Éliminer le produit et son récipient comme un déchet dangereux. · 2.3 Autres dangers : · Résultats des évaluations PBT et vPvB : · PBT: Non applicable. · vPvB: Non applicable. SECTION 3: Composition/informations sur les composants · 3.2 Caractérisation chimique: Mélange · Description: Préparation: composée des substances indiquées ci-après. · Composants dangereux: CAS: 1310-73-2 EINECS: 215-185-5 Numéro index: 011-002-00-6 hydroxyde de sodium C R35 Skin Corr. 1A, H314 50-100% · Indications complémentaires: Pour le libellé des phrases de risque citées, se référer au chapitre 16. SECTION 4: Premiers secours · 4.1 Description des premiers secours : · Remarques générales: Enlever immédiatement les vêtements contaminés par le produit. · Après inhalation excessive: En cas d'inconscience, coucher et transporter la personne en position latérale stable. · Après contact avec la peau: Laver immédiatement à l'eau et au savon et bien rincer. · Après contact avec les yeux: Rincer les yeux, pendant plusieurs minutes, sous l'eau courante en écartant bien les paupières et consulter un médecin. · Après ingestion: Boire de l'eau en abondance et donner de l'air frais. Consulter immédiatement un médecin. · 4.2 Principaux symptômes et effets, aigus et différés : Pas d'autres informations importantes disponibles. · 4.3 Indication des éventuels soins médicaux immédiats et traitements particuliers nécessaires : Pas d'autres informations importantes disponibles. SECTION 5: Mesures de lutte contre l'incendie : · 5.1 Moyens d'extinction: CO2, poudre d'extinction ou eau pulvérisée. Combattre les foyers importants avec de l'eau pulvérisée ou de la mousse résistant à l'alcool. · 5.2 Dangers particuliers résultant de la substance ou du mélange : Formation de gaz toxiques en cas d'échauffement ou d'incendie. (suite page 3) FRPage : 3/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 2) 37.0.1 · 5.3 Conseils aux pompiers : · Equipement spécial de sécurité: Porter un appareil de respiration indépendant de l'air ambiant. SECTION 6: Mesures à prendre en cas de dispersion accidentelle : · 6.1 Précautions individuelles, équipement de protection et procédures d'urgence : Porter un équipement de sécurité. Eloigner les personnes non protégées. · 6.2 Précautions pour la protection de l'environnement: Ne pas rejeter dans les canalisations, dans les eaux de surface et dans les nappes d'eau souterraines. · 6.3 Méthodes et matériel de confinement et de nettoyage: Utiliser un neutralisant. Evacuer les matériaux contaminés en tant que déchets conformément au point 13. Assurer une aération suffisante. · 6.4 Référence à d'autres sections : Afin d'obtenir des informations pour une manipulation sûre, consulter le chapitre 7. Afin d'obtenir des informations sur les équipements de protection personnels, consulter le chapitre 8. Afin d'obtenir des informations sur l'élimination, consulter le chapitre 13. SECTION 7: Manipulation et stockage : · 7.1 Précautions à prendre pour une manipulation sans danger : Ouvrir et manipuler les récipients avec précaution. Eviter la formation de poussière. Tenir les récipients hermétiquement fermés. Bien dépoussiérer. · Préventions des incendies et des explosions: Aucune mesure particulière n'est requise. · 7.2 Conditions d'un stockage sûr, y compris d'éventuelles incompatibilités : · Stockage : · Exigences concernant les lieux et conteneurs de stockage: Aucune exigence particulière. · Indications concernant le stockage commun : Ne pas conserver avec des métaux. Ne pas stocker avec les aliments. Ne pas stocker avec des acides. Ne pas conserver avec de l'eau. · Autres indications sur les conditions de stockage: Conserver les emballages dans un lieu bien aéré. Protéger de la forte chaleur et du rayonnement direct du soleil. Le produit est hygroscopique. Protéger contre l'humidité de l'air et contre l'eau. Tenir les emballages hermétiquement fermés. · 7.3 Utilisation(s) finale(s) particulière(s) : Pas d'autres informations importantes disponibles. SECTION 8: Contrôles de l'exposition/protection individuelle : · Indications complémentaires pour l'agencement des installations techniques: Sans autre indication, voir point 7. (suite page 4) FRPage : 4/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 3) 37.0.1 · 8.1 Paramètres de contrôle : · Composants présentant des valeurs-seuil à surveiller par poste de travail: 1310-73-2 hydroxyde de sodium (50-100%) VME (France) Valeur à long terme: 2 mg/m³ VME (Suisse) Valeur momentanée: 2 e mg/m³ Valeur à long terme: 2 e mg/m³ SSc; · Remarques supplémentaires: Le présent document s'appuie sur les listes en vigueur au moment de son élaboration. · 8.2 Contrôles de l'exposition : · Equipement de protection individuel: · Mesures générales de protection et d'hygiène: Tenir à l'écart des produits alimentaires, des boissons et de la nourriture pour animaux. Retirer immédiatement les vêtements souillés ou humectés. Se laver les mains avant les pauses et en fin de travail. Eviter tout contact avec les yeux et avec la peau. · Protection respiratoire:N'est pas nécessaire. · Protection des mains: Gants de protection Le matériau des gants doit être imperméable et résistant au produit / à la substance / à la préparation. · Matériau des gants : Le choix de gants appropriés dépend non seulement du matériau, mais aussi d'autres critères de qualité qui peuvent varier d'un fabricant à l'autre. Puisque le produit représente une préparation composée de plusieurs substances, la résistance des matériaux des gants ne peut pas être calculée à l'avance et doit, alors, être contrôlée avant l'utilisation. · Protection des yeux: Lunettes de protection hermétiques SECTION 9: Propriétés physiques et chimiques · 9.1 Informations sur les propriétés physiques et chimiques essentielles · Indications générales · Aspect: Forme: Solide Couleur: Blanc · Odeur: Inodore · Seuil olfactif: Non déterminé. · valeur du pH (100 g/l) à 20 °C: >14 · Changement d'état Point de fusion: 319 °C Point d'ébullition: 1390 °C (suite page 5) FRPage : 5/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 4) 37.0.1 · Point éclair : Non applicable. · Inflammabilité (solide, gazeux): Non déterminé. · Température d'auto inflammation: Non applicable. · Température de décomposition: Non déterminé. · Auto-inflammation: Le produit ne s'enflamme pas spontanément. · Danger d'explosion: Le produit n'est pas explosif. · Limites d'explosion: Inférieure: Non déterminé. Supérieure: Non déterminé. · Pression de vapeur: Non applicable. · Densité à 20 °C: 2,13 g/cm³ · Densité relative Non déterminé. · Densité de vapeur. Non applicable. · Vitesse d'évaporation Non applicable. · Solubilité dans/miscibilité avec l'eau à 20 °C: 1260 g/l · Coefficient de partage (n-octanol/eau): Non déterminé. · Viscosité: Dynamique: Non applicable. Cinématique: Non applicable. · 9.2 Autres informations : Pas d'autres informations importantes disponibles. SECTION 10: Stabilité et réactivité · 10.1 Réactivité : · 10.2 Stabilité chimique : · Décomposition thermique/conditions à éviter: Pas de décomposition en cas d'usage conforme. · 10.3 Possibilité de réactions dangereuses : Réactions au contact de l'eau et des acides. Réagit au contact des métaux légers, en présence d'humidité, en formant de l'hydrogène. · 10.4 Conditions à éviter : Pas d'autres informations importantes disponibles. · 10.5 Matières incompatibles: Pas d'autres informations importantes disponibles. · 10.6 Produits de décomposition dangereux: Hydrogène SECTION 11: Informations toxicologiques · 11.1 Informations sur les effets toxicologiques · Toxicité aiguë : · Valeurs LD/LC50 déterminantes pour la classification: 1310-73-2 hydroxyde de sodium Oral LD50 2000 mg/kg (rat) · Effet primaire d'irritation : · de la peau: Effet fortement corrosif sur la peau et les muqueuses. · des yeux: Effet fortement corrosif. (suite page 6) FRPage : 6/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 5) 37.0.1 · Sensibilisation: Aucun effet de sensibilisation connu. · Indications toxicologiques complémentaires: Selon le procédé de calcul de la dernière version en vigueur de la directive générale CEE sur la classification des préparations, le produit présente les dangers suivants: Corrosif L'absorption orale du produit a un fort effet corrosif sur la cavité buccale et le pharynx et présente un danger de perforation du tube digestif et de l'estomac. SECTION 12: Informations écologiques · 12.1 Toxicité · Toxicité aquatique: Pas d'autres informations importantes disponibles. · 12.2 Persistance et dégradabilité : Pas d'autres informations importantes disponibles. · 12.3 Potentiel de bioaccumulation : Pas d'autres informations importantes disponibles. · 12.4 Mobilité dans le sol : Pas d'autres informations importantes disponibles. · Autres indications écologiques : · Indications générales: Catégorie de pollution des eaux 1 (D) (Classification propre): peu polluant Ne pas laisser le produit, non dilué ou en grande quantité, pénétrer la nappe phréatique, les eaux ou les canalisations. Ne doit pas pénétrer à l'état non dilué ou non neutralisé dans les eaux usées ou le collecteur. Jeter de plus grandes quantités dans la canalisation ou les eaux peut mener à une augmentation de la valeur du pH. Une valeur du pH élevée est nocive pour les organismes aquatiques. Dans la dilution de la concentration utilisée, la valeur du pH est réduite considérablement: après l'utilisation du produit, les eaux résiduaires arrivant dans la canalisation ne sont que faiblement polluantes pour l'eau. · 12.5 Résultats des évaluations PBT et VPVB · PBT: Non applicable. · vPvB: Non applicable. · 12.6 Autres effets néfastes : Pas d'autres informations importantes disponibles. SECTION 13: Considérations relatives à l'élimination : · 13.1 Méthodes de traitement des déchets : · Recommandation: Ne doit pas être évacué avec les ordures ménagères. Ne pas laisser pénétrer dans les égouts. · Emballages non nettoyés · Recommandation: Evacuation conformément aux prescriptions légales. · Produit de nettoyage recommandé: Eau, éventuellement avec des produits de nettoyage SECTION 14: Informations relatives au transport · 14.1 No ONU · ADR, IMDG, IATA UN1823 · 14.2 Nom d'expédition des Nations unies · ADR 1823 HYDROXYDE DE SODIUM SOLIDE · IMDG, IATA SODIUM HYDROXIDE, SOLID (suite page 7) FRPage : 7/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 6) 37.0.1 · 14.3 Classe(s) de danger pour le transport · ADR · Classe 8 (C6) Matières corrosives. · Étiquette 8 · IMDG, IATA · Class 8 Corrosive substances. · Label 8 · 14.4 Groupe d'emballage · ADR, IMDG, IATA II · 14.5 Dangers pour l'environnement: · Polluant marin: Non · 14.6 Précautions particulières à prendre par l'utilisateur Attention: Matières corrosives. · Code danger: 80 · No EMS: F-A,S-B · Segregation groups Alkalis · 14.7 Transport en vrac conformément à l'annexe II de la convention Marpol 73/78 et au recueil IBC Non applicable. · Indications complémentaires de transport: · ADR · Quantités limitées (LQ) 1 kg · Catégorie de transport 2 · Code de restriction en tunnels E · "Règlement type" de l'ONU: UN1823, HYDROXYDE DE SODIUM SOLIDE, 8, II SECTION 15: Informations réglementaires · 15.2 Évaluation de la sécurité chimique: Une évaluation de la sécurité chimique n'a pas été réalisée. SECTION 16: Autres informations Ces indications sont fondées sur l'état actuel de nos connaissances, mais ne constituent pas une garantie quant aux propriétés du produit et ne donnent pas lieu à un rapport juridique contractuel. · Phrases importantes H314 Provoque des brûlures de la peau et des lésions oculaires graves. R35 Provoque de graves brûlures. (suite page 8) FRPage : 8/8 Fiche de données de sécurité selon 1907/2006/CE, Article 31 Date d'édition : 02.10.2013 Révision: 02.10.2013 Numéro de version 1 Nom du produit: Révélateur positif, sachet 1 litre Réf : AR45 (suite de la page 7) 37.0.1 · Acronymes et abréviations: ADR: Accord européen sur le transport des marchandises dangereuses par Route IMDG: International Maritime Code for Dangerous Goods DOT: US Department of Transportation IATA: International Air Transport Association GHS: Globally Harmonized System of Classification and Labelling of Chemicals EINECS: European Inventory of Existing Commercial Chemical Substances ELINCS: European List of Notified Chemical Substances CAS: Chemical Abstracts Service (division of the American Chemical Society) VOC: Volatile Organic Compounds (USA, EU) LC50: Lethal concentration, 50 percent LD50: Lethal dose, 50 percent FR Large gamme de sondes (option) : Sonde IAQ pour l’évaluation de la qualité de l’air Sondes thermiques avec mesure intégrée de la température et de l’humidité de l’air Sondes à hélice et fil chaud Sonde de pression différentielle intégrée pour les mesures de Pitot (cf. variantes) Sondes radio pour la température et l’humidité (cf. variantes) Manipulation aisée grâce aux profils d’utilisateur Logiciel PC pour l’analyse, l’archivage et la documentation des données de mesure (cf. variantes) Appareil de mesure multifonctions testo 435 – Le multitalent pour la ventilation et la qualité de l’air ambiant °C %HR m/s hPa ppm CO2 Lux Toutes les grandeurs de mesure utiles pour le climat L’appareil de mesure multifonctions testo 435 est un partenaire fiable pour l’analyse de l’air ambiant. L’air ambiant influence notablement le bien-être des personnes sur leur lieu de travail et est, par ailleurs, un facteur décisif important pour les processus de stockage et de protection. La qualité de l’air ambiant indique également si l’installation de ventilation et de climatisation (CTA) utilisée est optimisée d’un point de vue énergétique ou doit être réglée au moyen du testo 435. Les paramètres « CO2 », « Humidité relative » et « Température de l’air ambiant » sont disponibles pour évaluer la qualité de l’air ambiant. La pression absolue, le tirage, l’intensité lumineuse, la valeur U et la température superficielle peuvent en outre être évalués. Le débit volumétrique peut quant à lui être déterminé en recourant à l’ensemble des possibilités de mesure d’écoulement – telles que les sondes thermiques, hélices et tubes Pitot. L’appareil idéal pour chaque application Le testo 435 existe dans 4 variantes : en fonction de vos applications, vous avez le choix entre différentes variantes permettant une mesure intégrée de la pression différentielle, ainsi que des variantes offrant des fonctions étendues, telles qu’une mémoire, un logiciel PC et une gamme de sondes étendues. www.testo.com Nous mesurons. testo-435-P01-098X-961X-ES-FR 10.12.2013 08:24 Seite 1testo 435 Caractéristiques techniques Les valeurs de température et d’humidité sans fil mesurent jusqu’à 20 m de distance à l’extérieur. 2 raccords pour sondes externes Nous mesurons. testo 435-1 testo 435-1, appareil de mesure multifonctions pour le climat, l’aération et la qualité de l’air ambiant, avec procès-verbal de calibrage et piles Réf. 0560 4351 testo 435-3 testo 435-3, appareil de mesure multifonctions avec mesure intégrée de la pression différentielle pour le climat, l’aération et la qualité de l’air ambiant, avec procès-verbal de calibrage et piles Réf. 0560 4353 testo 435-2 testo 435-2, appareil de mesure multifonctions pour le climat, l’aération et la qualité de l’air ambiant, avec mémoire pour les valeurs de mesure, logiciel PC, câble de données USB et procès-verbal de calibrage et piles Réf. 0563 4352 testo 435-4 testo 435-4, appareil de mesure multifonctions avec mesure intégrée de la pression différentielle pour le climat, l’aération et la qualité de l’air ambiant, avec mémoire pour les valeurs de mesure, logiciel PC, câble de données USB et procès-verbal de calibrage et piles Réf. 0563 4354 Confort de commande amélioré grâce aux profils d’utilisateur L’utilisation du testo 435 est simple et efficace : des profils d’utilisateur sont enregistrés dans l’appareil pour les applications typiques de mesure dans les canaux et de mesure IAQ. La programmation compliquée de l’appareil de mesure est donc inutile. Documentation sûre des données de mesure Les procès-verbaux de mesure fournissent au client les données des mesures des canaux, à long terme et du degré de turbulence. Le logo de l’entreprise peut être intégré au formulaire. Sur les testo 435-1 et testo 435-3, les valeurs de mesure peuvent être imprimées de manière cyclique sur l’imprimante rapide Testo. Flexibilité grâce aux sondes radio Outre les sondes câblées classiques, une mesure sans fil est également possible jusqu’à 20 m de distance (à l’extérieur). Plus aucun endommagement du câble ou aucune gêne lors des manipulations ne sont donc possibles. Jusqu’à trois sondes radio peuvent être utilisées et affichées avec le testo 435 ; les sondes radio sont disponibles pour les mesures de température et, selon le type d’appareil, d’humidité. Le module radio enfichable disponible en option peut être ajouté à tout moment. Caractéristiques techniques générales Temp. de service -20 ... +50 °C Temp. de stockage -30 ... +70 °C Dimensions 220 × 74 × 46 mm Type de piles Piles Mignon alcalines au manganèse, type AA Autonomie 200 h (mesure typique au moyen d’une hélice) Poids 428 g Matériau du boîtier ABS / TPE / Métal Classe de protection IP54 Garantie 2 ans testo-435-P02-098X-961X-ES-FR 10.12.2013 12:01 Seite 2Types de sondes testo 435-1/-2/-3/-4 NTC Plage de mesure -50 … +150 °C Précision ±1 digit ±0.2 °C (-25 … +74.9 °C) ± 0.4 °C (-50 … -25.1 °C) ± 0.4 °C (+75 … +99.9 °C) ±0.5 % v.m. (plage restante) Résolution 0.1 °C Type K (NiCr-Ni) -200 … +1370 °C ± 0.3 °C (-60 … +60 °C) ±(0.2 °C +0.5 % v.m.) (plage restante) 0.1 °C Type T (Cu-CuNi) -200 … +400 °C ± 0.3 °C (-60 … +60 °C) ±(0.2 °C +0.5 % v.m.) (plage restante) 0.1 °C Capteur d’humidité capacitif Testo 0 … +100 %HR Cf. données des sondes 0.1 %HR Hélice Plage de mesure 0 … +60 m/s Précision : ± 1 digit Cf. données des sondes Résolution 0.01 m/s (hélice de 60 + 100 mm) 0.1 m/s (hélice de 16 mm) Fil chaud 0 … +20 m/s Cf. données des sondes 0.01 m/s Sonde de pression absolue 0 … +2000 hPa Cf. données des sondes 0.1 hPa CO2 (sonde IAQ) 0 … +10000 ppm CO2 Cf. données des sondes 1 ppm CO2 Types de sondes testo 435-2/-4 testo 435-3/-4 Lux Plage de mesure 0 … +100000 Lux Précision ± 1 digit Cf. données des sondes Résolution / Surcharge 1 Lux ; 0.1 Hz Sonde interne de pression différentielle 0 … +25 hPa ±0.02 hPa (0 … +2 hPa) ±1 % v.m. (plage restante) 0.01 hPa / 200 hPa testo 435 Caractéristiques techniques testo 435-1 testo 435-2 testo 435-3 testo 435-4 XXXX XXXX X X X X X X X X X X X X XXX X X X X X X X X X X X X X X X X X XXXX Sonde IAQ pour la mesure du CO2, température de l’air, humidité de l’air ambiant et pression absolue Sonde d’écoulement thermique avec mesure intégrée de la température et de l’humidité de l’air Sondes à hélice et fil chaud Sonde de température pour mesures par immersion / pénétration, dans l’air et superficielles Sonde radio pour les mesures de température Sonde de CO ambiant Sonde de pression absolue Mesure intégré de la pression différentielle pour la mesure d’écoulement au moyen d’un tube de Pitot et le contrôle de la filtration (non extensible) Sonde de bien-être pour la mesure du degré de turbulence pour l’évaluation objective de la vitesse de l’air ambiant dans la pièce Sonde d’humidité pour les mesures de température et d’humidité ambiantes Sonde radio pour les mesures de température et d’humidité ambiantes Sonde Lux pour la mesure de l’intensité lumineuse Sonde de température pour l’évaluation de la valeur U Equipement de l’appareil Manipulation aisée grâce à des profils d’utilisateur Ecran éclairé XXXX Imprimante rapide Testo pour la documentation des données de mesure (option) XXXX Mémoire pour 10 000 valeurs de mesure (non extensible) X X Logiciel PC pour l’analyse, l’archivage et la documentation des données X X de mesure Sondes pouvant être raccordées (option) Aperçu des variantes du testo 435 Le tableau vous fournit un aperçu rapide des sondes pouvant être raccordées et des équipements de l’appareil, variante par variante. Nous mesurons. testo-435-P03-098X-961X-ES-FR 10.12.2013 12:02 Seite 3testo 435 Accessoires Transport et protection Réf. Autres accessoires et pièces de rechange Imprimantes & Accessoires Certificats d’étalonnage 0516 0035 0554 0549 0520 0071 0520 0006 0520 0005 0520 0024 0520 0004 0520 0034 0520 0010 0520 0033 Mallette de service pour équipement de base (appareil de mesure et sondes), dimensions : 400 × 310 × 96 mm Imprimante rapide testo IRDA avec interface infrarouge sans fil, 1 rouleau de papier thermique et 4 piles Mignon, pour l’impression des valeurs de mesure sur site Certificat d’étalonnage ISO pour la température Appareils de mesure avec capteurs superficiels, points d’étalonnage : +60 °C, +120 °C, +180 °C Certificat d’étalonnage ISO pour l’humidité Points d’étalonnage 11.3 %HR et 75.3 %HR à +25 °C Certificat d’étalonnage ISO pour la pression Pression différentielle : 5 points répartis sur la plage de mesure Certificat d’étalonnage ISO pour l’écoulement Anémomètre à fil chaud / hélice ; points d’étalonnage à 0.5, 0.8, 1 et 1.5 m/s Certificat d’étalonnage ISO pour l’écoulement Anémomètre à fil chaud / hélice, tube de Pitot ; points d’étalonnage à 1, 2, 5 et 10 m/s Certificat d’étalonnage ISO pour l’écoulement Anémomètre à fil chaud / hélice, tube de Pitot ; points d’étalonnage à 5, 10, 15 et 20 m/s Certificat d’étalonnage ISO pour l’intensité lumineuse Points d’étalonnage à 0, 500, 1000, 2000 et 4000 Lux Certificat d’étalonnage ISO pour le CO2 Sondes de CO2 ; points d’étalonnage à 0, 1000 et 5000 ppm 0516 0435 0515 0028 0554 0568 0554 0447 0554 0410 0554 0610 0554 0415 0563 4170 0554 0440 0554 0453 0554 0660 0554 0756 0554 0641 0554 0761 Mallette de service pour appareil de mesure, sondes et accessoires, dimensions : 520 × 380 × 120 mm Pile ronde au Lithium, piles Mignon CR 2032 pour poignée radio Papier thermique de rechange pour imprimante (6 rouleaux), qualité document, pour la documentation des données de mesure lisible jusqu’à 10 ans Bloc d’alimentation, 5 VDC, 500 mA, avec connecteur euro, 100-250 VAC, 50-60 Hz testovent 410, entonnoir de mesure pour le débit volumétrique, Ø 340 mm / 330 × 330 mm, avec sac de transport Chargeur rapide externe pour 1-4 accumulateurs AA, 4 accumulateurs Ni-MH incl., avec chargement de cellules individuelles et affichage du contrôle de chargement, charge de maintien, fonction de déchargement intégrée et connecteur international intégré, 100-240 V AC, 300 mA, 50/60 Hz testovent 415, entonnoir de mesure pour le débit volumétrique, Ø 210 mm / 190 × 190 mm, avec sac de transport testovent 417, kit d’entonnoirs composé d’entonnoirs pour soupapes à plateau (Ø 200 mm) et pour ventilateurs (330 × 330 mm) pour l’air frais et l’air d’échappement Tuyau de raccordement, silicone, longueur : 5 m, charge jusqu’à max. 700 hPa (mbar) Tuyau de raccordement, sans silicone pour les mesures de pression différentielle, longueur : 5 m, charge jusqu’à max. 700 hPa (mbar) Kit de contrôle et d’étalonnage pour sondes d’humidité testo, solution saline avec 11.3 %HR et 75.3 %HR, avec adaptateur pour sondes d’humidité testo, contrôle ou calibrage rapide des sondes d’humidité Filtre fritté en PTFE, Ø 12 mm, pour milieux agressifs, zones extrêmement humides (mesures permanentes) et vitesses d’écoulement élevées Filtre aggloméré en acier inoxydable, taille des pores : 100 μm, protection de la sonde pour les atmosphères poussiéreuses ou les vitesses d’écoulement élevées Pâte d’adhérence pour fixer et colmater Nous mesurons. testo-435-P04-098X-961X-ES-FR 10.12.2013 08:31 Seite 4testo 435 Sonde(s) Type de sonde Sonde IAQ pour l’évaluation de la qualité de l’air ambiant, mesures du CO2, de l’humidité, de la température et de la pression absolue, trépied de table compris Sonde de mesure à hélice, diamètre de 100 mm, pour les mesures avec le kit d’entonnoirs 0563 4170 Sonde de pression absolue 2000 hPa Sonde d’écoulement thermique avec mesure intégrée de la température et de l’humidité, Ø 12 mm, avec télescope (max. 745 mm) Sonde de CO ambiant, pour la détection du CO dans les bâtiments et locaux testovent 417, kit d’entonnoirs composé d’entonnoirs pour soupapes à plateau (Ø 200 mm) et pour ventilateurs (330 × 330 mm) pour l’air frais et l’air d’échappement Redresseur de débit volumétrique testovent 417 Redresseur de débit volumétrique testovent 417 composé d’un kit d’entonnoirs testovent 417 et d’un redresseur de débit volumétrique testovent 417 Sonde de mesure à hélice, diamètre de 16 mm, avec télescope de max. 890 mm, p.ex. pour les mesures dans les canaux, utilisation possible de 0 à +60 °C Sonde de mesure à hélice, diamètre de 60 mm, avec télescope de max. 910 mm, p.ex. pour les mesures sur la sortie des canaux, utilisation possible de 0 à +60 °C Sonde à fil chaud pour m/s et °C, Ø de la tête de sonde : 7,5 mm, télescope compris (max. 820 mm) Dimensions Tube de sonde / Pointe du tube de sonde Plage de mesure 0 ... +50 °C 0 ... +100 %HR 0 ... +10000 ppm CO2 +600 ... +1150 hPa +0.3 ... +20 m/s 0 ... +50 °C 0 ... +2000 hPa -20 ... +70 °C 0 ... +100 %HR 0 ... +20 m/s 0 ... +500 ppm CO +0.6 ... +40 m/s Température de service 0 ... +60 °C +0.25 ... +20 m/s Température de service 0 ... +60 °C 0 ... +20 m/s -20 ... +70 °C Précision ±0.3 °C ±2 %HR (+2 ... +98 %HR) ±(75 ppm CO2 ±3 % v.m.) (0 ... +5000 ppm CO2) ±(150 ppm CO2 ±5 % v.m.) (+5001 ... +10000 ppm CO2) ±10 hPa ±(0.1 m/s +1.5 % v.m.) ±0.5 °C ±5 hPa ±0.3 °C ±2 %HR (+2 ... +98 %HR) ±(0.03 m/s +4 % v.m.) ± 5 % v.m. (+100.1 ... +500 ppm CO) ±5 ppm CO (0 ... +100 ppm CO) ±(0.2 m/s +1.5 % v.m.) ±(0.1 m/s +1.5 % v.m.) ±(0.03 m/s +5 % v.m.) ± 0.3 °C (-20 ... +70 °C) t99 Réf. 0632 1535 0635 9435 0638 1835 0635 1535 0632 1235 0563 4170 0554 4172 0554 4173 0635 9535 0635 9335 0635 1025 Sondes IAQ (testo 435-1/-2/-3/-4) Mesure d’entonnoir (testo 435-1/-2/-3/-4) Sonde de pression absolue (testo 435-1/-2/-3/-4) Sondes d’écoulement (testo 435-1/-2/-3/-4) Nous mesurons. 2) Autres sondes de température disponibles sur Internet à l’adresse : www.testo.de Thermomètre globe, Ø 150 mm, TC de type K, pour la mesure de la chaleur rayonnante 0 ... +120 °C Classe 1 0602 0743 testo-435-P05-098X-961X-ES-FR 10.12.2013 12:51 Seite 5testo 435 Sonde(s) Type de sonde Sonde de contact à réaction très rapide, avec bande thermocouple à ressort, convient également pour les surfaces irrégulières, plage de mesure à court terme jusqu’à +500 °C, TC de type K, câble fixe étiré Sonde d’immersion / de pénétration étanche, TC de type K, câble fixe étiré de 1.2 m Sonde de bien-être pour la mesure du degré de turbulence, avec télescope (max. 820 mm) et trépied, satisfait aux exigences de la norme EN 13779 Sonde d’humidité / de température Tube de Pitot, longueur : 350 mm Tube de Pitot, longueur : 500 mm Tube de Pitot, longueur : 1000 mm Sonde Lux, sonde pour la mesure de l’intensité lumineuse Sonde pour tuyau d’un diamètre de 5... 65 mm, avec tête de mesure amovible,plage de mesure à court terme jusqu’à +280 °C, TC de type K, câble fixé étiré Sonde à pince pour des mesures sur les tuyaux d’un diamètre de 15 à 25 mm (max. 1"), plage de mesure à court terme jusqu’à +130 °C, TC de type K, câble fixe étiré Sonde de température pour l’évaluation de la valeur U, capteur triple permettant de déterminer la température des murs, avec masse de malaxage Dimensions Tube de sonde / Pointe du tube de sonde Plage de mesure -60 ... +300 °C -60 ... +400 °C 0 ... +50 °C 0 ... +5 m/s -20 ... +70 °C 0 ... +100 %HR 0 ... 100 000 Lux 0 ... 300 Hz -60 ... +130 °C -50 ... +100 °C -20 ... +70 °C Précision Classe 2 1) Classe 2 1) ±0.3 °C ±(0.03 m/s +4 % v.m.) ±0.3 °C ±2 %HR (+2 ... 98% HR) Température de service 0 ... +600 °C Précision selon la norme DIN 13032-1 : f1 = 6% = Adaptation V(Lambda) f2 = 5% = Evaluation selon cos, classe C Classe 2 1) Classe 2 1) Classe 11), Valeur U : ±0.1 ±2% v.m.* t99 3 sec. 7 sec. 5 sec. 5 sec. Réf. 0602 0393 0602 4592 0602 4692 0614 1635 0602 1293 0628 0109 0636 9735 0635 2145 0635 2045 0635 2345 0635 0545 Sonde de contact 2) (testo 435-1/-2/-3/-4) Sonde d’immersion / de pénétration 2) (testo 435-1/-2/-3/-4) Sonde IAQ (testo 435-2/-4) Sonde d’humidité (testo 435-2/-4) Sonde de contact 2) (testo 435-2/-4) Tubes de Pitot statique (testo 435-3/-4) 115 mm 114 mm max. 820 mm 350 mm / 500 mm / 1000 mm 50 mm Ø 5 mm Ø 5 mm Ø 12 mm Ø 7 mm Ø 12 mm Ø 3.7 mm 1) Selon la norme EN 60584-2, la précision de la classe 2 se rapporte à -40... +1200 °C. 2) Autres sondes de température disponibles sur Internet à l’adresse : www.testo.com Nous mesurons. Remarque : Pour pouvoir déterminer la valeur U, un sonde doit également être disponible pour déterminer la température extérieure, p.ex. 0602 1793 ou 0613 1001 ou 0613 1002. *En cas d’utilisation avec une sonde NTC ou radio pour l’humidité pour la mesure de la température extérieure et différence de 20 K entre l’air intérieur et l’air intérieur. Sonde d’ambiance NTC précise et robuste, câble fixe étiré de 1.2 m -50 ... +125 °C ±0.2 °C (-25 ... +80 °C) ±0.4 °C (plage restante) 60 sec. 0613 1712 Sonde d’ambiance 2) (testo 435-1/-2/-3/-4) 115 mm 50 mm Ø 5 mm Ø 4 mm testo-435-P06-098X-961X-ES-FR 10.12.2013 12:52 Seite 630 mm 30 mm testo 435 Sonde radio Dimensions Tube de sonde / Pointe du tube de sonde Dimensions Tube de sonde / Pointe du tube de sonde Illustration Plage de mesure Plage de mesure Plage de mesure -50 ... +350 °C A court terme jusqu’à +500 °C 0 ... +100 %HR -20 ... +70 °C -50 ... +1000 °C Précision Précision Précision Poignée radio : ±(0.5 °C +0.3 % v.m.) (-40 ... +500 °C) ±(0.7 °C +0.5 % v.m.) (plage restante) Tête de sonde TC : Classe 2 ± 2 %HR (2 ... +98 %HR) ±0.3 °C ±(0.7 °C +0.3 % v.m.) (-40 ... +900 °C) ±(0.9 °C +0.5 % v.m.) (plage restante) Résolution Résolution Résolution t99 0.1 °C (-50 ... +199.9 °C) 1.0 °C (plage restante) 0.1 %HR 0.1 °C 0.1 °C (-50 ... +199.9 °C) 1.0 °C (plage restante) 120 mm 40 mm 5 sec. Ø 5 mm Ø 12 mm Réf. Réf. Réf. 0554 0189 0554 0189 0554 0189 0554 0191 0554 0191 0554 0191 Poignée radio pour têtes de sondes enfichables, adaptateur TC compris pour les pays suivants : DE, FR, UK, BE, NL, ES, IT, SE, AT, DK, FI, HU, CZ, PL, GR, CH, PT, SI, MT, CY, SK, LU, EE, LT, IE, LV, NO ; fréquence radio de 869.85 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris pour les pays suivants : DE, FR, UK, BE, NL, ES, IT, SE, AT, DK, FI, HU, CZ, PL, GR, CH, PT, SI, MT, CY, SK, LU, EE, LT, IE, LV, NO ; fréquence radio de 869.85 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris pour les pays suivants : DE, FR, UK, BE, NL, ES, IT, SE, AT, DK, FI, HU, CZ, PL, GR, CH, PT, SI, MT, CY, SK, LU, EE, LT, IE, LV, NO ; fréquence radio de 869.85 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris, homologuée pour les pays suivants : USA, CA, CL ; fréquence radio de 915.00 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris, homologuée pour les pays suivants : USA, CA, CL ; fréquence radio de 915.00 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris, homologuée pour les pays suivants : USA, CA, CL ; fréquence radio de 915.00 MHz FSK 0602 0394 0636 9736 0602 0394 0636 9736 Tête de sonde TC pour les mesures superficielles (TC de type K), enfichable sur la poignée radio 0554 0189 Tête de sonde pour l’humidité, enfichable sur la poignée radio 0554 0189 Tête de sonde TC pour les mesures superficielles (TC de type K), enfichable sur la poignée radio 0554 0189 Tête de sonde pour l’humidité, enfichable sur la poignée radio 0554 0189 Poignées radio avec tête de sonde pour les mesures superficielles Poignées radio avec tête de sonde pour l’humidité Poignées radio pour sondes TC enfichables Nous mesurons. Sonde radio pour mesures par immersion / pénétration Dimensions Tube de sonde / Pointe du tube de sonde Dimensions Tube de sonde / Pointe du tube de sonde Plage de mesure Plage de mesure -50 ... +275 °C -50 ... +350 °C A court terme jusqu’à +500 °C Précision Précision ± 0.5 °C (-20 ... +80 °C) ±0.8 °C (-50 ... -20.1 °C) ±0.8 °C (+80.1 ... +200 °C) ±1.5 °C (plage restante) Poignée radio : ±(0.5 °C +0.3 % v.m.) (-40 ... +500 °C) ±(0.7 °C +0.5 % v.m.) (plage restante) Tête de sonde TC : Classe 2 Résolution Résolution t99 t99 0.1 °C 0.1 °C (-50 ... +199.9 °C) 1.0 °C (plage restante) t99 (dans l’eau) 12 sec. t99 (dans l’eau) 10 sec. 105 mm 100 mm Ø 5 mm Ø 5 mm Ø 3.4 mm Ø 3,4 mm Réf. Réf. 0613 1001 0554 0189 0554 0191 Sonde radio d’immersion / de pénétration, NTC, homologuée pour les pays suivants : DE, FR, UK, BE, NL, ES, IT, SE, AT, DK, FI, HU, CZ, PL, GR, CH, PT, SI, MT, CY, SK, LU, EE, LT, IE, LV, NO ; fréquence radio de 869.85 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris pour les pays suivants : DE, FR, UK, BE, NL, ES, IT, SE, AT, DK, FI, HU, CZ, PL, GR, CH, PT, SI, MT, CY, SK, LU, EE, LT, IE, LV, NO ; fréquence radio de 869.85 MHz FSK Poignée radio pour têtes de sondes enfichables, adaptateur TC compris, homologuée pour les pays suivants : USA, CA, CL ; fréquence radio de 915.00 MHz FSK 0613 1002 0602 0293 0602 0293 Sonde radio d’immersion / de pénétration, NTC, homologuée pour les pays suivants : USA, CA, CL ; fréquence radio de 915.00 MHz FSK Tête de sonde TC pour des mesures dans l’air / par immersion / par pénétration Tête de sonde TC pour des mesures dans l’air / par immersion / par pénétration Poignées radio avec tête de sonde pour les mesures dans l’air / par immersion / par pénétration testo-435-P07-098X-961X-ES-FR 10.12.2013 12:57 Seite 7Sous réserve de modifications, même techniques. testo 435 Nous mesurons. Sonde radio www.testo.com 0982 9614/cw/A/01.2014 Module radio pour ajout ultérieur sur l’appareil de mesure, avec option « radio » Réf. Module radio pour appareil de mesure, 869,85 MHz FSK, homologué pour les pays suivants : DE, FR, UK, BE, NL, ES, 0554 0188 IT, SE, AT, DK, FI, HU, CZ, PL, GR, CH, PT, SI, MT, CY, SK, LU, EE, LT, IE, LV, NO Module radio pour appareil de mesure, 915.00 MHz FSK, homologué pour les pays suivants : USA, CA, CL 0554 0190 Caractéristiques techniques communes Caractéristiques techniques de la sonde radio Cadence de mesure 0.5 sec. ou 10 sec., réglable sur la poignée Portée radio Jusqu’à 20 m (champ libre) Transmission par ondes radio Unidirectionnelle Temp. de service -20 ... +50 °C Temp. de stockage -40 ... +70 °C Classe de protection IP54 Sonde radio d’immersion / de pénétration, NTC Type de piles 2 piles rondes 3V (CR 2032) Autonomie 150 h (cadence de mesure de 0.5 sec.) 2 mois (cadence de mesure de 10 sec.) Poignée radio Type de piles 2 piles AAA Autonomie 215 h (cadence de mesure de 0.5 sec.) ½ année (cadence de mesure de 10 sec.) testo-435-P08-0980-961X-ES-FR 10.12.2013 13:02 Seite 8 Mai 2008 3 Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER M12 - Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 - 4 contacts/contacts/Kontakte + - Avec embase M23 (19 cts) - With receptacle M23 (19 cts) - Mit Gerätedose M23 (19 Kont.) • 4 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 • 6 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - PE : Performances élevées • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - Avec câble - With cable - Mit Kabel • 4 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 • 6 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 3 contacts/contacts/Kontakte + - Avec embase M23 (12 cts) - With receptacle M23 (12 cts) - Mit Gerätedose M23 (12 Kont.) • 4 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 • 6 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 - Avec câble - With cable - Mit Kabel • 4 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 • 6 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 - Accessoires - Accessories - Zubehörteile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 M8 - Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 - 3 contacts/contacts/Kontakte - Avec embase M23 (12 cts) - With receptacle M23 (12 cts) - Mit Gerätedose M23 (12 Kont.) • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 - Avec câble - With cable - Mit Kabel • 8 raccords/ways/Fach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Sommaire - Contents - Inhaltsangabe 4 Mai 2008 Caractéristiques des câbles PVC/PUR Ces câbles conviennent particulièrement pour les installations dynamiques utilisant des huiles de coupe, grâce à leur enveloppe, répondant aux nornes CNOMO E03.40.150N (07.85). Ceux-ci sont employés dans l’industrie automobile et de la machine-outil, de manière générale dans tous les domaines où les conditions d’utilisation et d’exploitation sont extrêmes. La constitution de l’âme en brins extra fins classe 6 ainsi que la conception du câble permettent le passage en chaîne portecâble. Caractéristiques des câbles robotiques Des câbles pour robots portiques, scaras, destinés à être soumis à des contraintes importantes de flexions, torsions, accélérations et vitesse (10 millions de cycles minimum). Ces câbles sont conçus pour répondre à des sollicitations mécaniques sévères. Ils résistent aux huiles de coupes et aux étincelles grâce à leur gaine extérieure en élastomère de polyuréthane haute résistance Characteristics of PVC/PUR cables These cables are suitable for dynamic installations using cutting oils, thanks to their PVC covering (according to E03.40.150N CNOMO Norms.) They are used in the automotive and machine tool industries, in robotics and in all environments where operating conditions are extreme. The cable-core has extra fine strands (Class 6). This design feature allows the cable to be very flexible in operation. Characteristics of robotic cables Cables for robots withstand bending, torsion, acceleration and speed (10 million cycles mini).These cables are designed for severe mechanical applications. They are resistant to cutting oils and sparks due to their covering (High resistance polyurethane elastomer). Eigenschaften der PVC/PUR Kabel Diese Kabel passen besonders für dynamische Anlagen mit Schneidöl dank ihrem PVCCNOMO Mantel. (Norm CNOMO E03.40.150N) Sie werden in Auto-und Werkzeugmaschinenindustrie, in Robotik und in allen Umgebungen mit hohen Anforderungen benutzt. Die Kabelseele aus extra feinen Litzendrähten (Klasse 6) und der Entwurf des Kabels machen es schleppkettentauglich. Eigenschaften der robotiken Kabel. Kabel für Roboter, die Biegungen, Drehungen, Beschleunigungen und Geschwindigkeit (10 Millionen Zyklen)erleiden. Diese Kabel entsprechen hohen mechanischen Anforderungen. Sie ertragen Schneidöl und Funken dank ihrem Polyurethan Elastomer Mantel. Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften Mai 2008 5 Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften 4, 6 et 8 raccords Sortie par embase mâle M23 ou par câble Plage de temperature: de -30°C à +70°C Indice de protection: IP 67 Caractéristiques générales Les répartiteurs permettent d’établir un flux bidirectionnel d’informations: • d’une part entre les capteurs et la partie commande associée • d’autre part entre la partie commande et les préactionneurs associés Les capteurs et pré-actionneurs sont reliés à des embases mâles M12 (4 ou 5 contacts Æ1mm). Les répartiteurs sont disponibles en deux versions: • entrée/sortie par câble repéré par un code couleur • entrée/sortie par embase mâle M23. Sur cette version, la protection des personnes est réalisée à l’aide du contact n°12 relié au corps métallique de l’embase. Ils peuvent également être equipés de Leds ou de bouchons. Ces répartiteurs ont été spécialement développés pour répondre aux contraintes des milieux sévères. Les versions avec sortie par câble peuvent être équipées de différents types de câble, chacun ayant des propriétés différentes. 4, 6 and 8 ways With male M23 receptacle or with cable Temperature range : -30°C to +70°C Protection class: IP 67 Main characteristics Splitter boxes allow the establishment of a two way information flow • On the one hand between sensors and control unit • On the other hand between control unit and actuators Sensors and actuators are connected to male M12 receptacles (4 or 5 contactsÆ1mm). 2 models of splitter boxes are available with : • Input/output by cable (With colour code) • Input/output by a male M23 receptacle.Contact M12 is connected to the metal body of the receptacle to accomodate applications utilizing shielded cables. Available with leds and protection caps too. These splitter boxes are specially designed for harsh industrial environments. Two cable jacket materials are available. Special materials are available per customer specifications. 4, 6 und 8 Fach Ausgang über M23 Gerätedose mit Stiftkontakten oder über Kabel. Betriebstemperatur:-30°C bis +70°C Schutztklasse: IP 67 Allgemeine Eigenschaften Die Verteiler erlauben einen zweiseitigen Informationsfluss. • Einerseits zwischen den Sensoren und dem Befehlgerät • Andererseits zwischen dem Befehlgerät und den Aktoren. Sensoren und Aktoren sind mit M12 Gerätedosen (mit 4 oder 5 Kontakten Æ1mm) verbunden. 2 Verteilertypen sind lieferbar mit : • Ein/ Ausgabe mit Kabel (mit Farbcode) • Ein/ Ausgabe mit M23 Gerätedose mit Stiftkontakten. Kontakt n°12 ist mit dem Metallgehäuse der Gerätedose verbunden. (Abschirmung). Auch mit Leds oder mit Schutzkappen lieferbar. Diese Verteiler entsprechen besonderen hohen Umgebungsanforderungen. Verteiler mit Kabel:mehrere Kabeltypen sind lieferbar. Jeder Typ hat seine Eigenschaften. 6 Mai 2008 Sans Led Avec Led Tension d’emploi - Nominal voltage - Betriebsspannung 60 V 10 - 30 V Intensité d’emploi - Current rating - Stromstärke Information 4 A 4 A Intensité d’alimentation - Power supply - Stromversorgung 12A max 12A max Tenue aux surintensités 20A pendant 10 s. sur 1 pôle 20A pendant 10 s. sur 1 pôle Maximum current rating for 10 s. on 1 pole 10 s. on 1 pole Maximale Stromstärkewährend 10 s. auf 1 Polig 10 s. auf 1 Polig Tension de claquage entre les contacts voisins / Flashover voltage 1000 V eff / 60s 1000 V eff / 60s E03.62.710.N between adjacent contacts / Durchschlagsspannung zwischen benachbarten Kontakten Résistance d’isolement - Insulation resistance - Isolationwiderstand ³109W ³109W Résistance de contact - Contact resistance - Kontaktübergangswiderstand £5 mW £5 mW Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER M12 Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften Ces répartiteurs ont été développés conformément aux spécifications de la norme CNOMO E03.62.710N. Ces matériels sont utilisés pour le raccordement des capteurs ou de pré-actionneurs équipés de connecteurs M12 mâles 4 ou 5 contacts Æ1mm tels qu’ils sont définis dans la norme CNOMO E03.62.710.N. Splitter boxes have been designed according to the CNOMO E03.62.710N norm. These boxes are used to connect sensors and actuators fitted with M12 male connectors (4 or 5cts) as defined in the CNOMO E03.62.710.N norm. Verteiler sind entsprechend der Norm CNOMO E03.62.710N entwickelt worden. Diese Geräte werden benutzt, um Sensoren und Aktoren mit M12 Steckverbindern (mit 4 oder 5 Stiftkontakten wie in CNOMO E03.62.710.N Norm beschrieben) zu verbinden. Caractéristiques électriques - Electrical characteristics - Elektrische Daten Normes - Norm Résistance interne (entre contacts de l’embase M23 et des embases M12) - Internal resistance - Innenwiderstand Normes - Norm Information - Information - Information 20 mW max Alimentation - Power supply - Stromversorgung 15 mW max E.03.62.710.N Corrosion - Spray - Atzung 48 heures brouillard salin - 48 hours Salt spray - 48 Stunden Salznebel E03.62.710.N Caractéristiques environnementales - Environmental conditions - Umweltdaten Normes - Norm Niveau d’étanchéité (connecteurs verrouillés) - Protection class - I.P. 67 Schutzklasse (I.P.) DIN EN 60529 Température d’utilisation - Temperature range - Betriebstemperatur -30° à /to /bis +70°C Tenue aux huiles de coupe - Cutting oils resistance - Schneidölbestandigkeit E03.40.150.N Mai 2008 7 Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER M12 Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften Caractéristiques mécaniques - Mechanical characteristics - Mechanische Eigenschaften Endurance mécanique - Mechanical life - Lebensdauer 10 000 cycles d’enfichages et désenfichages Locking cycles - Verriegelungszyklen Vibrations - Vibrations - Schwingungen F : 10 à/to/bis 2000 Hz V : 1 Octave/min Acc : 5g Couple de serrage fiche - Tightening torque plug - Anziehmoment- 0.5 N.m (M12 / M12) Stecker 2 N.m (M23 / M23) Matière - Material - Stoff & Trait. de surface - Plating - Schutzmittel Matière - Material - Stoff Trait. de surface - Plating - Schutzmittel Canon d’embase - Receptacle body - Gerätedosenkörper Laiton - Brass - Messing Nickel - Nickel - Nickel Contact - Contact - Kontakt Laiton - Brass - Messing Or sur Nickel - Gold over Nickel - Gold über Nickel Matière - Material - Stoff Isolant - Insulator - Isolierkörper M23 PBT UL94V0 Fibre de verre - PBT UL94V0 Glass fiber - PBT UL94V0 Glasfaser Isolant - Insulator - Isolierkörper M12 PA 6.6 fibre de verre UL94V0 - PBT Glass fiber UL94V0 - PBT Glasfaser UL94V0 Joint annulaire - O-ring - O-Ring Fluorocarbone - Fluorocarbon - Fluorokarbonat Boîtier - Chassis plug housing - Gehäuse PBT Fibre de verre UL94V0 - PBT Glass fiber UL94V0 - PBT Glasfaser UL94V0 Normes relatives aux câbles - Norms concerning cables - Normen für Kabel Conducteurs classe 6 selon - Conductors class 6 according to - Leiter Klasse 6 entsprechend : VDE 0295 Isolation selon - resistance according to - Widerstand entsprechend : VDE 0281 / VDE 0282 Comportement au feu selon - Burning behaviour according to - Brandverhalten entsprechend : VDE 482 Tenue au huile selon : CNOMO E03-40-150N / VDE 473 8 Mai 2008 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 4 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP4M2319AL REP4M2319SL Avec - With - Mit LED Sans - Without - Ohne LED Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1 : 19 (+) 2 : 1 (7) 2 (4) 3 (8) 4 (14) 3 : 6 (-) 4 : 1 (15) 2 (5) 3 (16) 4 (3) 5 : 12 Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 4 raccords - 4 ways - 4 Fach Ø1mm 16 de Ø1mm 3 de Ø1,5mm M12x1 M23x1 117.8 28 36 25.5 4.5 73 107 5 12 18 19 15 6 11 17 16 7 10 9 8 1 13 14 5 2 3 4 Mai 2008 9 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 6 raccords - 6 ways - 6 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 4 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP6M2319AL REP6M2319SL Avec - With - Mit LED Sans - Without - Ohne LED Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1 : 19 (+) 2 : 1 (7) 2 (4) 3 (8) 4 (14) 5 (9) 6 (13) 3 : 6 (-) 4 : 1 (15) 2 (5) 3 (16) 4 (3) 5 (17) 6 (2) 5 : 12 Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Ø1mm 16 de Ø1mm 3 de Ø1,5mm 12 18 19 15 6 11 17 16 7 10 9 8 1 13 14 5 2 3 4 M12x1 M23x1 127 27 34.8 25.5 4.5 73 107 5 27 10 Mai 2008 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 8 raccords - 8 ways - 8 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 4 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP8M2319AL REP8M2319SL Avec - With - Mit LED Sans - Without - Ohne LED Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1 : 19 (+) 2 : 1 (7) 2 (4) 3 (8) 4 (14) 5 (9) 6 (13) 7 (10) 8 (18) 3 : 6 (-) 4 : 1 (15) 2 (5) 3 (16) 4 (3) 5 (17) 6 (2) 7 (11) 8 (1) 5 : 12 Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Ø1mm 16 de Ø1mm 3 de Ø1,5mm 12 18 19 15 6 11 17 16 7 10 9 8 1 13 14 5 2 3 4 M12x1 M23x1 160 28 36 25.5 4.5 73 107 5 28 28 Mai 2008 11 JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 Répartiteurs I Splitter boxes - Verteiler M12 4 + 8 raccords - 8 ways - 8 Fach Corrosion - Spray - Atzung : <500 heures brouillard salin - <500 hours Salt spray - <500 Stunden Salznebel Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Cordons associés - Associed cable - Umspritze Kable* Cordon M23, 19 contacts, performances élevées : Cable M23, 19 contacts, high performance : Nous consulter Kabel M23, 19 Kontakte, Enhohte Anforderungen : Cordon M12, 3 ou 4 ou 5 contacts, performances élevées : Cable M12, 3 or 4 or 5 contacts, high performance : Nous consulter Kabel M12, 3 oder 4 oder 5 Kontakte, Enhohte Anforderungen : Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen Sans - Without - Ohne REP8M2319PE LED Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1 : 19 (+) 2 : 1 (7) 2 (4) 3 (8) 4 (14) 5 (9) 6 (13) 7 (10) 8 (18) 3 : 6 (-) 4 : 1 (15) 2 (5) 3 (16) 4 (3) 5 (17) 6 (2) 7 (11) 8 (1) 5 : 12 Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Ø1mm 16 de Ø1mm 3 de Ø1,5mm PE : Performances Elevées contre la corrosion/High performances against corrosion/Enhöhte Anforderungen PERFORMANCES ELEVEES 12 18 19 15 6 11 17 16 7 10 9 8 1 13 14 5 2 3 4 M12x1 M23x1 160 28 36 25.5 4.5 73 107 5 28 28 12 Mai 2008 Avec câble - With cable - Mit Kabel 4 raccords - 4 ways - 4 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 4 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP4C**19ALX REP4C**19SLX Avec - With - Mit LED Sans - Without - Ohne LED ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of poles Sheath Colours Ways Section ø von Kabel Polzahl Ummantelung M12 Farben Fach Querschnitt PVC CNOMO PUR CNOMO 1 Brun - Brown - Braun (+) 1 mm2 3 Bleu - Blue - Blau (-) 1 mm2 2 Gris/Rose - Grey/Pink - Grau/Rosa 1 Rouge/Bleu - Red/Blue - Rot/Blau 2 Blanc/Vert - White/Green - Weiss/Grün 3 Brun/Vert - Brown/Green - Braun/Grün 4 0,34 mm2 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 5 Vert/Jaune - Green/Yellow - Grün/Gelb 1 mm2 ø D10,9 mm 5 X : Type de câble - Type of cable - Kabeltyp : C : PVC CNOMO P : PUR CNOMO °R : Robotique - Robotic - Robotik ** L : 05 = 5 m ; 10 =10 m ; 15 =15 m Longueur à la demande possible - Also available in length specified by customer - Länge auch nach Kundenwunsch lieferbar °R : Pour la définition du câble robotique contacter notre Bureau d’Etude. Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Ø1mm M12x1 117.8 28 61.5 L 4.5 73 107 5 Vert Jaune Brun + Gris Brun Vert Blanc Vert Vert Blanc Gris Rose Bleu - Jaune Rouge Bleu Mai 2008 13 Avec câble - With cable - Mit Kabel 6 raccords - 6 ways - 6 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 4 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP6C**19ALX REP6C**19SLX Avec - With - Mit LED Sans - Without - Ohne LED X : Type de câble - Type of cable - Kabeltyp : C : PVC CNOMO P : PUR CNOMO °R : Robotique - Robotic - Robotik ** L : 05 = 5 m ; 10 =10 m ; 15 =15 m Longueur à la demande possible - Also available in length specified by customer - Länge auch nach Kundenwunsch lieferbar °R : Pour la définition du câble robotique contacter notre Bureau d’Etude. Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of poles Sheath Colours Ways Section ø von Kabel Polzahl Ummantelung M12 Farben Fach Querschnitt PVC CNOMO PUR CNOMO 1 Brun - Brown - Braun (+) 1 mm2 3 Bleu - Blue - Blau (-) 1 mm2 2 Gris/Rose - Grey/Pink - Grau/Rosa 1 Rouge/Bleu - Red/Blue - Rot/Blau 2 Blanc/Vert - White/Green - Weiss/Grün 3 Brun/Vert - Brown/Green - Braun/Grün 4 Blanc/Jaune - White/Yellow - Weiss/Gelb 5 Jaune/Brun - Yellow/Brown - Gelb/Braun 6 0,34 mm2 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 Rose - Pink - Rosa 5 Rouge - Red - Rot 6 5 Vert/Jaune - Green/Yellow - Grün/Gelb 1 mm2 ø D10,9 mm 5 Ø1mm M12x1 127 27 60.3 L 4.5 73 107 5 Vert Jaune Brun + Gris Brun Vert Blanc Vert Vert Blanc Gris Rose Bleu - Jaune Rouge Bleu 27 Blanc Jaune Jaune Brun Rose Rouge 14 Mai 2008 Avec câble - With cable - Mit Kabel 8 raccords - 8 ways - 8 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 4 + Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP8C**19ALX REP8C**19SLX Avec - With - Mit LED Sans - Without - Ohne LED X : Type de câble - Type of cable - Kabeltyp : C : PVC CNOMO P : PUR CNOMO °R : Robotique - Robotic - Robotik ** L : 05 = 5 m ; 10 =10 m ; 15 =15 m Longueur à la demande possible - Also available in length specified by customer - Länge auch nach Kundenwunsch lieferbar °R : Pour la définition du câble robotique contacter notre Bureau d’Etude. Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of poles Sheath Colours Ways Section ø von Kabel Polzahl Ummantelung M12 Farben Fach Querschnitt PVC CNOMO PUR CNOMO 1 Brun - Brown - Braun (+) 1 mm2 3 Bleu - Blue - Blau (-) 1 mm2 2 Gris/Rose - Grey/Pink - Grau/Rosa 1 Rouge/Bleu - Red/Blue - Rot/Blau 2 Blanc/Vert - White/Green - Weiss/Grün 3 Brun/Vert - Brown/Green - Braun/Grün 4 Blanc/Jaune - White/Yellow - Weiss/Gelb 5 Jaune/Brun - Yellow/Brown - Gelb/Braun 6 0,34 mm2 Blanc/Gris - White/Grey - Weiss/Grau 7 Gris/Brun - Grey/Brown - Grau/Braun 8 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 Rose - Pink - Rosa 5 Rouge - Red - Rot 6 Noir - Black - Schwarz 7 Violet - Purple - Violett 8 5 Vert/Jaune - Green/Yellow - Grün/Gelb 1 mm2 ø D11 mm 5 Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Ø1mm M12x1 160 28 61.5 L 4.5 73 107 5 Vert Jaune Brun + Gris Brun Vert Blanc Vert Vert Jaune Rouge Bleu 28 28 Blanc Gris Rose Bleu - Violet Blanc Jaune Gris Brun Noir Blanc Gris Rouge Jaune Brun Rose Mai 2008 15 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 4 raccords - 4 ways - 4 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 3 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP4M2312AL REP4M2312SL Avec - With - Mit LED Sans - Without - Ohne LED Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1: 11 (+) 3: 9/10 (-) 4: 1 (1) 2 (2) 3 (3) 4 (4) 5: 12 Ø1mm 12 de Ø1mm M12x1 M23x1 117.8 28 36 25.5 4.5 73 107 5 12 6 11 7 10 8 9 1 5 2 3 Non câblé 4 Not connected Nicht verbunden 16 Mai 2008 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 6 raccords - 6 ways - 6 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 3 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP6M2312AL REP6M2312SL Avec - With - Mit LED Sans - Without - Ohne LED Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1: 11 (+) 3: 9/10 (-) 4: 1 (1) 2 (2) 3 (3) 4 (4) 5 (5) 6 (6) 5: 12 Ø1mm 12 de Ø1mm M12x1 M23x1 127 27 34.8 25.5 4.5 73 107 5 Non câblé Not connected Nicht verbunden 12 6 11 7 10 8 9 1 5 2 3 4 27 Mai 2008 17 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 8 raccords - 8 ways - 8 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 3 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP8M2312AL REP8M2312SL Avec - With - Mit LED Sans - Without - Ohne LED Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Affectation des contacts - Contact identification - Kontaktnumerierung M12 M23 1: 11 (+) 3: 9/10 (-) 4: 1 (1) 2 (2) 3 (3) 4 (4) 5 (5) 6 (6) 7 (7) 8 (8) 5: 12 Ø1mm 12 de Ø1mm M12x1 M23x1 160 28 36 25.5 4.5 73 107 5 Non câblé Not connected Nicht verbunden 28 28 12 6 11 7 10 8 9 1 5 2 3 4 18 Mai 2008 Avec câble - With cable - Mit Kabel 4 raccords - 4 ways - 4 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 3 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP4C**12ALX REP4C**12SLX Avec - With - Mit LED Sans - Without - Ohne LED ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of poles Sheath Colours Ways Section ø von Kabel Polzahl Ummantelung M12 Farben Fach Querschnitt PVC CNOMO PUR CNOMO 1 Brun - Brown - Braun (+) 1 mm2 3 Bleu - Blue - Blau (-) 1 mm2 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 0,34 mm2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 5 Vert/Jaune - Green/Yellow - Grün/Gelb 1 mm2 ø D8,4 mm 4 X : Type de câble - Type of cable - Kabeltyp : C : PVC CNOMO P : PUR CNOMO °R : Robotique - Robotic - Robotik ** L : 05 = 5 m ; 10 =10 m ; 15 =15 m Longueur à la demande possible - Also available in length specified by customer - Länge auch nach Kundenwunsch lieferbar °R : Pour la définition du câble robotique contacter notre Bureau d’Etude. Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Ø1mm M12x1 117.8 28 61.5 L 4.5 73 107 5 Vert Jaune Brun + Gris Vert Blanc Bleu - Jaune Non câblé Not connected Nicht verbunden Mai 2008 19 Avec câble - With cable - Mit Kabel 6 raccords - 6 ways - 6 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 3 + Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP6C**12ALX REP6C**12SLX Avec - With - Mit LED Sans - Without - Ohne LED X : Type de câble - Type of cable - Kabeltyp : C : PVC CNOMO P : PUR CNOMO °R : Robotique - Robotic - Robotik ** L : 05 = 5 m ; 10 =10 m ; 15 =15 m Longueur à la demande possible - Also available in length specified by customer - Länge auch nach Kundenwunsch lieferbar °R : Pour la définition du câble robotique contacter notre Bureau d’Etude. Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of poles Sheath Colours Ways Section ø von Kabel Polzahl Ummantelung M12 Farben Fach Querschnitt PVC CNOMO PUR CNOMO 1 Brun - Brown - Braun (+) 1 mm2 3 Bleu - Blue - Blau (-) 1 mm2 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 0,34 mm2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 Rose - Pink - Rosa 5 Rouge - Red - Rot 6 5 Vert/Jaune - Green/Yellow - Grün/Gelb 1 mm2 ø D9,5 mm 4 Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Ø1mm M12x1 127 27 60.3 L 4.5 73 107 5 Vert Jaune Brun + Gris Vert Blanc Bleu - Jaune 27 Rose Rouge Non câblé Not connected Nicht verbunden 20 Mai 2008 Avec câble - With cable - Mit Kabel 8 raccords - 8 ways - 8 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M12 3 + Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen REP8C**12ALX REP8C**12SLX Avec - With - Mit LED Sans - Without - Ohne LED ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of poles Sheath Colours Ways Section ø von Kabel Polzahl Ummantelung M12 Farben Fach Querschnitt PVC CNOMO PUR CNOMO 1 Brun - Brown - Braun (+) 1 mm2 3 Bleu - Blue - Blau (-) 1 mm2 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 0,34 mm2 Rose - Pink - Rosa 5 Rouge - Red - Rot 6 Noir - Black - Schwarz 7 Violet - Purple - Violett 8 5 Vert/Jaune - Green/Yellow - Grün/Gelb 1 mm2 ø D10,9 mm 4 X : Type de câble - Type of cable - Kabeltyp : C : PVC CNOMO P : PUR CNOMO °R : Robotique - Robotic - Robotik ** L : 05 = 5 m ; 10 =10 m ; 15 =15 m Longueur à la demande possible - Also available in length specified by customer - Länge auch nach Kundenwunsch lieferbar °R : Pour la définition du câble robotique contacter notre Bureau d’Etude. Répartiteur avec led de tension générale (vert), led de commutation (jaune), et raccordement à la terre. Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 6-7 Ø1mm M12x1 160 28 61.5 L 4.5 73 107 5 Vert Jaune Brun + Gris Vert Jaune 28 28 Blanc Bleu - Violet Noir Rouge Rose Non câblé Not connected Nicht verbunden Mai 2008 21 Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Accessoires pour répartiteurs - Accessories for splitter boxes - Zubehörteile für Verteiler Références commerciales - Part numbers - Teil N° Bouchon femelle M12 (conditionnement 10 pièces) Caps female M12 (by 10 pieces) BEF864 Kappen mit Buchsenkontakten M12 (bei 10 Stück) Bouchon M23 métal avec joint d’étanchéité Caps female M23 486 417 106 Kappen M23 Bouchon M23 plastique (POM) Caps female M23 486 414 006 Kappen M23 Etiquette repère (conditionnement 100 pièces) répartiteur M12 Identification labels (by 100 pieces) ETI864 Beschriftungsschildern (bei 100 Stück) Bouchons M12 Caps M12 Kappen M12 Etiquette repère Identification labels Beschriftungsschildern 22 Mai 2008 Répartiteurs I Splitter boxes - Verteiler JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER M8 Caractéristiques électriques - Electrical characteristics - Elektrische Daten Normes - Norm Tension d’alimentation - Nominal voltage - Betriebsspannung 10 VDC £Ue £50VDC Intensité max. - Maximum current rating - Maximale Stromstärke 2A sur une voie on 1 channel auf 1 Kanal Tension de claquage entre les contacts voisins - Flashover voltage 1000 V eff / 60s between adjacent contacts - Durchschlagsspannung zwischen benachbarten Kontakten Résistance d’isolement - Insulation resistance - Isolationwiderstand ³109W Corrosion - Spray - Atzung Brouillard salin - Salt spray - Salznebel 48 heures/hours/Stunden Caractéristiques physico-chimiques - Environmental conditions - Umweltdaten Normes - Norm Niveau d’étanchéité (connecteurs assemblés) - Protection class I.P. 65 sur les embases M8 Schutzklasse (I.P.) I.P. 67 sur l’embase M23 DIN EN 60529 Température d’utilisation - Temperature range - Betriebstemperatur -20° à/ to/ bis +80°C Caractéristiques mécaniques - Mechanical characteristics - Mechanische Daten Endurance mécanique - Mechanical life - Lebensdauer M23/M23 10 000 cycles d’enfichages et désenfichages Locking cycles - Verriegelungszyklen Couple de serrage fiche - Tightening torque plug - Anziehmoment- 0.5 N.m Stecker M8/M8 Couple de serrage fiche - Tightening torque plug - Anziehmoment- 2 N.m Stecker M23/M23 Matière - Material - Stoff & Trait. de surface - Plating - Schutzmittel Matière - Material - Stoff Trait. de surface - Plating - Schutzmittel Canon d’embase - Receptacle body - Gerätedosenkörper Laiton - Brass - Messing Nickelé - Nickeled - Vernickelt Contact - Contact - Kontakt Laiton - Brass - Messing Prénickelage et dorure - Gold over Nickel - Gold über Nickel Matière - Material - Stoff Isolant - Moulded body - Isolierkörper M23 PBT UL94 V0 Fibre de verre - PBT Glass fiber V0 - PBT Glasfaser V0 Isolant - Moulded body - Isolierkörper M8 PA 6.6 UL94V0 Joint - O-ring - O-Ring Fluorocarbone - Fluorocarbon - Fluorokarbonat Boîtier - Chassis plug housing - Gehäuse PBT Fibre de verre V0 - PBT Glass fiber V0 - PBT Glasfaser V0 Caractéristiques générales - Main characteristics - Allgemeine Eigeschaften Normes relatives aux câbles - Norms concerning cables - Normen für Kabel Repérage conducteurs - Colour code of conductors according to - Farbcode der Leiter entsprechend : DIN 47 100 Conducteurs classe 6 selon - Conductors class 6 according to - Leiter Klasse 6 entsprechend : VDE 0295 Comportement au feu selon - Burning behaviour according to - Brandverhalten entsprechend : CEI 332/1 Flexions alternées selon - Flexation according to - Hin-und Herbiegungen : VDE 0472/603 Mai 2008 23 Avec embase M23 - With receptacle M23 - Mit Gerätedose M23 JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M8 3 pôles poles / Polig Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen Sans - Without - Ohne REP8M8M2312SL LED Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 22 8 raccords - 8 ways - 8 Fach Affectation des contacts - Contact identification - Kontaktnumerierung M8 M12 1: 11 (+) 3: 9/10 (-) 4: 1 (1) 2 (2) 3 (3) 4 (4) 5 (5) 6 (6) 7 (7) 8 (8) Ø1mm 12 de Ø1mm M8x1 M23x1 100 13.4 21.7 23.7 65.1 3.5 13.4 13.4 12 6 11 7 10 8 9 1 5 2 3 4 24 Mai 2008 Avec câble - With cable - Mit Kabel 8 raccords - 8 ways - 8 Fach JAEGER CONNECTEURS - CONNECTORS - STECKVERBINDER Répartiteurs I Splitter boxes - Verteiler M8 Références - Part numbers - Teil N° Sans bouchons - Without caps - Ohne Kappen Sans - Without - Ohne REP8M8**12SLP LED Type de câble - Type of cable - Kabeltyp : P : PUR ** L : 05 = 5 m ; 10 = 10 m ; 15 = 15 m Accessoires / Accessories / Zubehör p 21 Caractéristiques techniques p 22 ø du câble Nombre de pôles Gaine extérieure Couleurs Raccords Section ø of cable Number of contacts Sheath Colours Ways Section ø von Kabel Kontaktzahl Ummantelung M8 Farben Fach Querschnitt PUR 1 Brun - Brown - Braun (+) 0,75 mm2 3 Bleu - Blue - Blau (-) 0,75 mm2 4 Blanc - White - Weiss 1 Vert - Green - Grün 2 Jaune - Yellow - Gelb 3 Gris - Grey - Grau 4 0,34 mm2 Rose - Pink - Rosa 5 Rouge - Red - Rot 6 Noir - Black - Schwarz 7 Violet - Purple - Violett 8 Ø D9,1 mm 3 Caractéristiques dimensionnelles & raccordements électriques - Dimensional characteristics & electrical connection - Abmessungen & elektrische Verbindung 3 pôles poles / Polig Ø1mm M8x1 80 13.4 21 65.1 3.5 13.4 13.4 Gris Vert Jaune Blanc Bleu - Violet Noir Rouge Rose L Brun + http://www.farnell.com/datasheets/1697327.pdf ES1029E 152a Blast, ES1027E 152a Duster IDENTIFICATION DE LA SUBSTANCE/PRÉPARATION ET DE LA SOCIÉTÉ/ENTREPRISE Numéro de téléphone d'appel d'urgence (avec les heures d'ouverture) FICHE DE DONNÉES DE SÉCURITÉ Nom du produit ES1029E 152a Blast, ES1027E 152a Duster Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France 1. Numéro de téléphone d'appel d'urgence (avec les heures d'ouverture) : Nom chimique difluoroethane Synonymes 1,1 - difluoroethane ITW Chemtronics 8125 Cobb Center Drive Kennesaw, GA 30152 Tel. 770-424-4888 or toll free 800-645-5244 Producteur Distributeur : : : : : Identification de la substance ou de la préparation Identification de la société/entreprise ITW Contamination Control Skejby Nordlandsvej 307 DK-8200 Aarhus N Denmark Tel +45 87 400 220 Fax +45 87 400 222 Email: info@itw-cc.com Importateur : Type de produit : Aérosol. Adresse email de la personne responsable pour cette FDS : askchemtronics@chemtronics.com Nom du Produit dans REACH : difluoroethane - 152a 2. IDENTIFICATION DES DANGERS Classification : F+; R12 Le produit est classé dangereux selon la directive 1999/45/CE et ses amendements.Le liquide peut provoquer des brûlures comparables à des gelures.Le contact dermique avec le liquide en rapide évaporation peut causer des engelures aux tissus. Dangers physiques ou chimiques : Extrêmement inflammable. Pour plus de détails sur les conséquences en termes de santé et les symptômes, reportez-vous à la section 11. 3. COMPOSITION/INFORMATIONS SUR LES COMPOSANTS Substance/préparation : Substance mono-constituant Voir section 16 pour le texte intégral des phrases R mentionnées ci-dessus Dans l'état actuel des connaissances du fournisseur et dans les concentrations d'application, aucun ingrédient présent n'est classé comme dangereux pour la santé ou l'environnement, et donc nécessiterait de figurer dans cette section. L'ingestion du liquide peut provoquer des brûlures semblables à des gelures.Rincez la bouche avec de l'eau. Enlever les prothèses dentaires s'il y a lieu. Transporter la personne incommodée à l'air frais. Garder la personne au chaud et au repos. Si une personne a avalé de ce produit et est consciente, lui faire boire de petites quantités d’eau. Si la personne est indisposée, cesser de la faire boire car des vomissements pourraient entraîner un risque supplémentaire. Ne pas faire vomir sauf indication contraire émanant du personnel médical. En cas de vomissement, maintenez la tête vers le bas pour empêcher le passage des vomissures dans les poumons. Appelez un médecin en cas de persistance ou d'aggravation des effets néfastes sur la santé. Ne rien faire ingérer à une personne inconsciente. En cas d'évanouissement, placez la personne en position latérale de sécurité et appelez un médecin immédiatement. 4. Premiers secours Transporter la personne incommodée à l'air frais. Garder la personne au chaud et au repos. S'il ne respire pas, en cas de respiration irrégulière ou d'arrêt respiratoire, que le personnel qualifié pratique la respiration artificielle ou administre de l'oxygène. Il peut être dangereux pour la personne assistant une victime de pratiquer le bouche à bouche. Appelez un médecin en cas de persistance ou d'aggravation des effets néfastes sur la santé. En cas d'évanouissement, placez la personne en position latérale de sécurité et appelez un médecin immédiatement. Assurez-vous d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon. Ingestion Inhalation : : PREMIERS SECOURS Date d'édition/Date de révision : 12/18/2008. 1/5ES1029E 152a Blast, ES1027E 152a Duster 4. PREMIERS SECOURS Assurez-vous d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon. Contact avec la peau En cas de gelure, demander l'assistance d'un médecin.Rincer immédiatement les yeux à grande eau, en soulevant de temps en temps les paupières supérieures et inférieures. Vérifier si la victime porte des verres de contact et dans ce cas, les lui enlever. Continuez de rincer pendant 10 minutes au moins. En cas d'irritation, consulter un médecin. En cas de gelure, demander l'assistance d'un médecin.Rincer la peau contaminée à grande eau. Retirer les vêtements et les chaussures contaminés. Consulter un médecin si des symptômes se développent. Laver les vêtements avant de les réutiliser. Laver les chaussures à fond avant de les remettre. Note au médecin traitant Pas de traitement particulier. Traitement symptomatique requis. Contacter immédiatement un spécialiste pour le traitement des intoxications, si de grandes quantités ont été ingérées ou inhalées. Contact avec les yeux : : : Pour plus de détails sur les conséquences en termes de santé et les symptômes, reportez-vous à la section 11. Protection des sauveteurs : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Il peut être dangereux pour la personne assistant une victime de pratiquer le bouche à bouche. 5. MESURES DE LUTTE CONTRE L'INCENDIE En présence d'incendie, circonscrire rapidement le site en évacuant toute personne se trouvant près des lieux de l'accident. Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Déplacer les contenants à l'écart de la zone d'incendie si cela ne présente aucun risque. Refroidir les conteneurs exposés aux flammes avec un jet d'eau pulvérisée. Risque lié aux produits de décomposition thermique Risques particuliers liés à l’exposition au produit Aucune donnée spécifique. Aérosol inflammable. L’augmentation de pression résultant d’un incendie ou d’une exposition à des températures élevées peut provoquer l’explosion du conteneur, ce qui risque d’entraîner une nouvelle explosion. Le gaz peut s'accumuler dans les endroits bas ou confinés ou parcourir une distance considérable jusqu'à une source d'inflammation et provoquer un retour de flamme, causant un incendie ou une explosion. Les récipients d’aérosols qui explosent peuvent être propulsés à grande vitesse depuis le lieu de l’incendie. Les écoulements dans les égouts peuvent créer des risques de feu ou d'explosion. Les pompiers devront porter un équipement de protection approprié ainsi qu'un appareil de protection respiratoire autonome avec masque intégral fonctionnant en mode pression positive. Équipement de protection spécial pour le personnel préposé à la lutte contre l'incendie Utiliser un agent extincteur approprié pour étouffer l'incendie avoisinant. Moyens d'extinction : : : Aucun connu. Utilisables : Non utilisables : Précautions relatives à l'environnement Précautions individuelles Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone de déversement accidentel. S'approcher des émanations face au vent. Bloquer toute pénétration possible dans les égouts, les cours d’eau, les caves ou les zones confinées. Laver le produit répandu dans une installation de traitement des effluents ou procéder comme suit. Contenir les fuites et les ramasser à l'aide de matières absorbantes non combustibles telles que le sable, la terre, la vermiculite, la terre à diatomées. Les placer ensuite dans un récipient pour élimination conformément à la réglementation locale (voir section 13). Utilisez des outils anti-étincelles ou du matériel anti-déflagrant. Élimination par une entreprise autorisée de collecte des déchets. Les 6. MESURES À PRENDRE EN CAS DE REJET ACCIDENTEL : : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Évacuer les environs. Empêcher l'accès aux personnes non requises et ne portant pas de vêtements de protection. En cas de bris d’aérosols, il est recommandé de prendre les mesures nécessaires à cause de la rapidité d’échappement de leur contenu sous pression et du propulseur. En cas de rupture d'un grand nombre de conteneurs, traiter comme si un produit en vrac s'était déversé conformément aux instructions dans la section Nettoyage. NE PAS TOUCHER ni marcher dans le produit répandu. Éteindre toutes les sources d'inflammation. La zone de danger doit être exempte de cigarettes ou flammes. Éviter de respirer les vapeurs ou le brouillard. Assurer une ventilation adéquate. Porter un appareil de protection respiratoire approprié lorsque le système de ventilation est inadéquat. Revêtir un équipement de protection individuelle approprié (voir Section 8). Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Informez les autorités compétentes en cas de pollution de l'environnement (égouts, voies d'eau, sol et air) par le produit. Grand déversement accidentel : Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone de déversement accidentel. Diluer avec de l'eau et éponger si la matière est soluble dans l'eau ou absorber avec un matériau sec inerte et placer dans un contenant à déchets approprié. Utilisez des outils anti-étincelles ou du matériel anti-déflagrant. Élimination par une entreprise autorisée de collecte des déchets. Petit déversement accidentel : Méthodes de nettoyage Date d'édition/Date de révision : 12/18/2008. 2/5ES1029E 152a Blast, ES1027E 152a Duster 6. MESURES À PRENDRE EN CAS DE REJET ACCIDENTEL matériaux absorbants contaminés peuvent présenter les mêmes risques que le produit répandu. Nota : Voir section 1 pour le contact en cas d'urgence et voir section 13 pour l'élimination des déchets. Manipulation MANIPULATION ET STOCKAGE Stockage 7. Revêtir un équipement de protection individuelle approprié (voir Section 8). Il est interdit de manger, boire ou fumer dans les endroits où ce produit est manipulé, entreposé ou mis en oeuvre. Il est recommandé au personnel de se laver les mains et la figure avant de manger, boire ou fumer. Récipient sous pression. A protéger contre les rayons solaires et à ne pas exposer à une température supérieure à 50 °C. Ne pas percer ou brûler même après usage. Ne pas respirer les vapeurs ou le brouillard. Ne pas ingérer. Éviter le contact avec les yeux, la peau et les vêtements. Eviter de respirer du gaz. Utiliser uniquement dans un environnement bien aéré. Porter un appareil de protection respiratoire approprié lorsque le système de ventilation est inadéquat. Tenir éloigné de la chaleur, des étincelles, de la flamme nue, ou de toute autre source d'inflammation. Utiliser un équipement électrique (de ventilation, d'éclairage et de manipulation) anti-déflagrant. Utiliser des outils ne produisant pas d'étincelles. Les conteneurs vides retiennent des résidus de produit et peuvent présenter un danger. Matériaux d'emballage Stocker conformément à la réglementation locale. Entreposer dans un endroit isolé et approuvé. Conserver à l'abri de la lumière directe du soleil dans un endroit sec, frais et bien ventilé à l'écart des matériaux incompatibles (cf. la section 10), des aliments et des boissons. Éliminer toutes les sources d'inflammation. Utiliser un récipient approprié pour éviter toute contamination du milieu ambiant. : : Recommandé : Utiliser le récipient d'origine. Nom des composants Limites d'exposition professionnelle Procédures de surveillance recommandées Valeurs limites d'exposition Si ce produit contient des ingrédients présentant des limites d'exposition, il peut s'avérer nécessaire d'effectuer un examen suivi des personnes, de l'atmosphère sur le lieu de travail ou des organismes vivants pour déterminer l'efficacité de la ventilation ou d'autres mesures de contrôle ou évaluer le besoin d'utiliser du matériel de protection des voies respiratoires. Il importe de vous reporter à la norme européenne EN 689 concernant les méthodes pour évaluer l'exposition par inhalation aux agents chimiques et aux documents de politique générale nationaux relatifs aux méthodes pour déterminer les substances dangereuses. 8. CONTRÔLE DE L'EXPOSITION/PROTECTION INDIVIDUELLE Protection des mains Porter un appareil de protection respiratoire muni d'un purificateur d'air ou à adduction d' air, parfaitement ajusté et conforme à une norme en vigueur si une évaluation du risque indique que cela est nécessaire. Le choix de l'appareil de protection respiratoire doit être fondé sur les niveaux d'expositions prévus ou connus, les dangers du produit et les limites d'utilisation sans danger de l'appareil de protection respiratoire retenu. Le port de gants imperméables et résistants aux produits chimiques conformes à une norme approuvée, est obligatoire en tout temps lors de la manutention de produits chimiques si une évaluation des risques le préconise. Utiliser une protection oculaire conforme à une norme approuvée dès lors qu'une évaluation du risque indique qu'il est nécessaire d'éviter l'exposition aux projections de liquides, aux fines particules pulvérisées, aux gaz ou aux poussières. Protection des yeux Protection respiratoire Aucune valeur de limite d'exposition connue. : : : : Protection de la peau L'équipement de protection personnel pour le corps devra être choisi en fonction de la tâche à réaliser ainsi que des risques encourus, et il est recommandé de le faire valider par un spécialiste avant de procéder à la manipulation du produit. : Contrôle de l'exposition de l'environnement : Il importe de tester les émissions provenant des systèmes de ventilation ou du matériel de fabrication pour vous assurer qu'elles sont conformes aux exigences de la législation sur la protection de l'environnement. Dans certains cas, il sera nécessaire d'équiper le matériel de fabrication d'un épurateur de gaz ou d'un filtre ou de le modifier techniquement afin de réduire les émissions à des niveaux acceptables. Contrôle de l'exposition professionnelle : Utiliser uniquement dans un environnement bien aéré. Si les manipulations de l'utilisateur provoquent de la poussière, des fumées, des gaz, des vapeurs ou du brouillard, utiliser des enceintes fermées, une ventilation par aspiration à la source, ou d'autres systèmes de contrôle automatique intégrés afin de maintenir le seuil d'exposition du technicien aux contaminants en suspension dans l'air inférieur aux limites recommandées ou légales. Les moyens de contrôle automatiques intégrés devront permettre de maintenir les concentrations en gaz, en vapeur ou en poussière en dessous de tout seuil d'explosion. Utiliser un équipement de ventilation antidéflagrant. Se laver abondamment les mains, les avant-bras et le visage après avoir manipulé des produits chimiques, avant de manger, de fumer et d'aller aux toilettes ainsi qu'à la fin de la journée de travail. Il est recommandé d'utiliser les techniques appropriées pour retirer les vêtements potentiellement contaminés. Laver les vêtements contaminés avant de les réutiliser. S'assurer que les dispositifs rince-œil automatiques et les douches de sécurité se trouvent à proximité de l'emplacement des postes de travail. Contrôle de l'exposition Mesures d'hygiène : Date d'édition/Date de révision : 12/18/2008. 3/5ES1029E 152a Blast, ES1027E 152a Duster 9. PROPRIÉTÉS PHYSIQUES ET CHIMIQUES -25°C (-13°F) État physique Point d'ébullition Densité de vapeur Gaz. 2.4 (Air = 1) Odeur Inodore. Couleur Incolore. Point d'éclair Coupe fermée: Inférieure à -18 °C (0 °F). Limites d'explosivité Seuil minimal: 3.9% Seuil maximal: 16.9% : : : : : : : Informations générales Aspect Informations importantes relatives à la santé, à la sécurité et à l'environnement Produits de décomposition dangereux Conditions à éviter Éliminer toutes les sources possibles d'inflammation (étincelles ou flammes). STABILITÉ ET RÉACTIVITÉ Dans des conditions normales de stockage et d'utilisation, aucun produit de décomposition dangereux ne devrait apparaître. Le produit est stable. Dans les conditions normales de stockage et d'utilisation, aucune polymérisation dangereuse n'est censée se produire. Stabilité 10. Aucune donnée spécifique. : : : Matières à éviter : Effets chroniques potentiels pour la santé 11. INFORMATIONS TOXICOLOGIQUES Effets aigus potentiels sur la santé Inhalation : Aucun effet important ou danger critique connu. Ingestion : Aucun effet important ou danger critique connu. Contact avec la peau : Aucun effet important ou danger critique connu. Contact avec les yeux : Aucun effet important ou danger critique connu. Effets chroniques : Aucun effet important ou danger critique connu. Cancérogénicité : Aucun effet important ou danger critique connu. Mutagénicité : Aucun effet important ou danger critique connu. Tératogénicité : Aucun effet important ou danger critique connu. Toxicité aiguë Effets sur le développement : Aucun effet important ou danger critique connu. Effets sur la fertilité : Aucun effet important ou danger critique connu. Signes/symptômes de surexposition Peau Ingestion Inhalation Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: irritation des voies respiratoires toux Aucune donnée spécifique. Aucune donnée spécifique. : : : Yeux : Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: irritation rougeur 12. INFORMATIONS ÉCOLOGIQUES Autres effets nocifs : Aucun effet important ou danger critique connu. Écotoxicité en milieu aquatique Conclusion/Résumé : Non disponible. Biodégradabilité Conclusion/Résumé : Non disponible. Effets sur l'environnement : Aucun effet important ou danger critique connu. 13. CONSIDÉRATIONS RELATIVES À L'ÉLIMINATION Déchets Dangereux : Il se peut que la classification du produit satisfasse les critères de déchets dangereux. Il est recommandé d'éviter ou réduire autant que possible la production de déchets. Les conteneurs vides ou les saches internes peuvent retenir des restes de produit. Ne se débarrasser de ce produit et de son récipient qu'en prenant toutes précautions d'usage. Élimination des produits excédentaires et non recyclables par une entreprise autorisée de collecte des déchets. La mise au rebut de ce produit, des solutions et des sous-produits devra en permanence respecter les exigences légales en matière de protection de l'environnement et de mise au rebut des déchets ainsi que les exigences de toutes les autorités locales. Ne pas percer ni incinérer le récipient. Méthodes d'élimination des : déchets Date d'édition/Date de révision : 12/18/2008. 4/5ES1029E 152a Blast, ES1027E 152a Duster Classe ADR/RID 14. Réglementation internationale du transport AEROSOLS (difluoroethane - 152a) 2 - 2 Classe IMDG AEROSOLS (difluoroethane - 152a) 2.1 - 2 Aerosols, flammable (difluoroethane - 152a) Difluoréthane (R152a)UN1030 Classe IATA 2 2.1 INFORMATIONS RELATIVES AU TRANSPORT AEROSOLS 2 (difluoroethane - 152a) - 2 Difluoréthane (R152a)UN1030 Informations réglementaires Numéro ONU Nom d'expédition Classes GE* Étiquette - Difluoréthane (R152a)UN1030 Difluoréthane (R152a)UN1030 Classe ADNR GE* : Groupe d'emballage Autres informations - - - -Avion cargo uniquement INFORMATIONS RÉGLEMENTAIRES 15. Conseils de prudence S2- Conserver hors de la portée des enfants. S46- En cas d'ingestion, consulter immédiatement un médecin et lui montrer l'emballage ou l'étiquette. R12- Extrêmement inflammable. Symbole(s) de danger Phrases de risque Réglementations de l'Union Européenne Autres Réglementations UE : : : Phrases d'avertissement supplémentaire : Récipient sous pression. A protéger contre les rayons solaires et à ne pas exposer à une température supérieure à 50 °C. Ne pas percer ou brûler même après usage. Ne pas vaporiser vers une flamme ou un corps incandescent. Conserver à l'écart de toute flamme ou source d'étincelles - Ne pas fumer. Conserver hors de la portée des enfants. Utilisation du produit : Produit de consommation. Extrêmement inflammable Inventaire d'Europe : Inventaire d'Europe: Indéterminé. Déterminés en accord avec les directives de l'UE 67/548/EEC et 1999/45/EC (y compris les amendements), la classification et l'étiquetage prennent en compte l'usage prévu du produit. Surveillance médicale renforcée : Arrêté du 11 Juillet 1977 fixant la liste des travaux nécessitant une surveillance médicale renforcée: non concerné AUTRES DONNÉES 12/18/2008. Historique Non disponible. 16. Date d'impression Date d'édition/Date de révision Version Élaborée par 12/18/2008. Au meilleur de nos connaissances, l'information contenue dans ce document est exacte. Toutefois, ni le fournisseur ci-dessus mentionné, ni aucun de ses sous-traitants ne peut assumer quelque responsabilité que ce soit en ce qui a trait à l'exactitude ou à l'intégralité des renseignements contenus dans le présent document. Il revient exclusivement à l'utilisateur de déterminer l'appropriation des substances ou préparations. Toutes les substances ou préparations peuvent présenter des dangers inconnus et doivent être utilisées avec prudence. Bien que certains dangers soient décrits dans le présent document, nous ne pouvons garantir qu'il n'en existe pas d'autres. Avis au lecteur 4 Date de la précédente édition Aucune validation antérieure. : : : : : Texte complet des phrases : R12- Extrêmement inflammable. R citées dans les sections 2 et 3 - France Référence du texte complet des classifications se trouvant dans les Sections 2 et 3 - France : F+ - Extrêmement inflammable Indique quels renseignements ont été modifiés depuis la version précédente. Date d'édition/Date de révision : 12/18/2008. 5/5 Fiche de Données de Sécurité Mise en conformité REACH. Révision générale. Conforme à la Règlementaion( EC ) No. 1907/2006 Date de révision Motif de la révision HI 70300 01/12/2008 Conservation, solution pour électrodes pH et redox SECTION 1 IDENTIFICATION DE LA SUBSTANCE ET DE LA SOCIETE Nom du produit : HI 70300 Solution de conservation Autres codes possibles : HI 70300L HI 70300M HI 70300AN HI 70300L-0 HI 70300M-0 Application : Solution de maintenance pour électrodes pH et redox Identification de la société : HANNA Instruments France 67833 TANNERIES Cedex 1 rue du Tanin LINGOLSHEIM BP 133 Identification du Service Technique : 03 88 76 91 88 Numéro à contacter en cas d'urgence : + 1-703-527-3887 Adresse e-mail du Service Technique sav@hannafr.com SECTION 2 IDENTIFICATION DES DANGERS Produit non nocif selon directives 67/548/EEC et 1999/45/EC. Produit non nocif selon la régulation OSHA 29 CFR 1910.1200 Produit non nocif selon la régulation canadienne SOR/88-66, SECTION 3 COMPOSITION/INFORMATIONS SUR LES COMPOSANTS Substance : Solution aqueuse EC-No. : CAS-No. : Danger : Phrases : Contenance : SECTION 4 PREMIERS SECOURS Après Inhalation : Amener à l'air libre. Consulter un médecin en cas de difficulté respiratoire. Après contact avec la peau : Laver la surface infectée avec de l'eau et du savon Après contact avec les yeux : Rincer abondamment avec de l'eau pendant 15 minutes. Consulter un médecin si une gêne persiste. Après Ingestion : Rincer abondamment la bouche avec de l'eau. Consulter un médecin en cas de malaise. Informations générales : PAGE 1 SUR 4Fiche de Données de Sécurité Mise en conformité REACH. Révision générale. Conforme à la Règlementaion( EC ) No. 1907/2006 Date de révision Motif de la révision HI 70300 01/12/2008 Conservation, solution pour électrodes pH et redox SECTION 5 MESURE DE LUTTE CONTRE L'INCENDIE Agents d'extinction appropriés : Brumisateur, neige carbonique. Risques spécifiques : Non combustible. Equipements de protection spéciaux : Ne rester pas dans la zone à risque, sans porter des vêtements appropriés et un appareil respiratoire. Informations complémentaires : Contenir les vapeurs avec de l'eau. SECTION 6 MESURES A PRENDRE EN CAS DE DISPERSION ACCIDENTELLE Précautions individuelles : Aucune Précautions pour l'environnement : Aucune Notes complémentaires : Aucune SECTION 7 MANIPULATION ET STOCKAGE Manipulation : Pas de restrictions. Stockage : Maintenir le récipient clos. Protéger des rayons du soleil. Stocker à température ambiante ( +15 à + 25 °C) SECTION 8 CONTRÔLE DE L'EXPLOSION/PROTECTION INDIVIDUELLE Composants : Equipement à prévoir : Respecter les conseils d'hygiène généraux. Protection individuelle : Selon la quantité manipulée. Protection respiratoire : Nécessaire en cas de génération de vapeurs/aérosols. Vêtements de protection : Caoutchouc ou plastique. Lunettes de protection : Lunettes de protection et masque. Hygiène : Ôter les vêtements souillés. Laver les mains après utilisation du produit. SECTION 9 PROPRIETES PHYSIQUES ET CHIMIQUES Apparence : Liquide incolore Odeur : Inodore Densité à 20 °C : 1.02 g/cm³ Point de fusion : NA Point d'ébullition : > 100 °C Solubilité : Soluble pH à 20 °C : ~ 7 Limite d'explosion : NA Point éclair : NA Décomposition thermique : NA PAGE 2 SUR 4Fiche de Données de Sécurité Mise en conformité REACH. Révision générale. Conforme à la Règlementaion( EC ) No. 1907/2006 Date de révision Motif de la révision HI 70300 01/12/2008 Conservation, solution pour électrodes pH et redox SECTION 10 STABILITE ET REACTIVITE Conditions à éviter : Echauffement excessif. ( au-dessus du point d'ébullition) Stable en respectant les consignes de stockage. Produits de décomposition dangereux : En cas d'incendie voir section 5 Polymérisation dangereuse : Ne peut arriver. Substance à éviter : Les produits qui réagissent au contact de l'eau. Autres informations : Non disponible SECTION 11 INFORMATIONS TOXICOLOGIQUES Pas de données de toxicité disponibles pour ce produit. En cas d'inhalation : En cas de contact avec la peau : En cas d'ingestion : En cas de contact avec les yeux: Autres données : Des propriétés dangereuses ne peuvent être exclues, mais sont relativement peu probables, vu la très faible concentration. Ce produit doit être manipulé comme il est d'usage avec les produits chimiques. SECTION 12 INFORMATIONS ECOLOGIQUES Aucune donnée quantitative sur les effets écologiques de ce produit disponibles. Autres données écologiques : Pas de problèmes écologiques si le produit est manipulé avec prudence. SECTION 13 CONSIDERATIONS RELATIVES A L'ELIMINATION Généralités : Peut être éliminé comme un déchet classique. SECTION 14 INFORMATIONS RELATIVES AU TRANSPORT Terre : Mer : Air : Non soumis aux règles de transport. Non soumis aux règles de transport. Non soumis aux règles de transport. Etiquettage CE SECTION 15 INFORMATIONS REGLEMENTAIRES Symbole( s) : Non nocif selon les directives 67/548/EEC et 1999/45EC Phrase ( s) R : Phrase ( s) S : Contenu : PAGE 3 SUR 4Fiche de Données de Sécurité Mise en conformité REACH. Révision générale. Conforme à la Règlementaion( EC ) No. 1907/2006 Date de révision Motif de la révision HI 70300 01/12/2008 Conservation, solution pour électrodes pH et redox SECTION 16 AUTRES INFORMATIONS Texte des phrases R de la section 3 : Edition antérieure : Information sur la révision Date de révision : 10/06/2009 18/01/2008 Motif de révision : Mise en conformité REACH. Révision générale. Légende : NA : Non applicable ND : Non déterminé LES INFORMATIONS DONNEES DANS CE DOCUMENT SONT CONSIDEREES COMME EXACTES AU MOMENT DE SON IMPRESSION. MALGRE LE SOIN APPORTE A SA REDACTION, AUCUNE RESPONSABILITE NE SAURAIT ETRE ACCEPTEE EN CAS DE DOMMAGE OU ACCIDENT RESULTANT DE SON UTILISATION. PAGE 4 SUR 4 Un besoin, une solution, une pince : - maintenance électrique ou électrotechnique - installateurs électriques - distributeurs d’électricité - tertiaire Pinces multimètres Nouveau ! MX 670 et MX 675 les pinces bi-afficheur 10 000 points CAT IV 600 V MX 675 - MX 670 MX 655 - MX 650 MX 355 - MX 350 Une gamme de 6 pinces pour couvrir tous vos besoins Ergonomiques Les pinces ampèremétriques >> Dotées de toutes les fonctionnalités d’une pince ampèremétrique et d’un multimètre complet, ces modèles apportent les solutions de mesure nécessaires à tout électricien. MX 670 & MX 675 CAT IV 600 V, elles offrent une parfaite sécurité pour les interventions et contrôles sur les parties d’une installation ne bénéficiant pas de toutes les protections et 1000 A AC. AC/DC TRMS, la MX 675 permet des mesures d’intensité en continu jusqu’à 1400 A DC et 1000 A AC. AC TRMS, la MX 670 peut enserrer des conducteurs allant jusqu’à 42 mm de diamètre pour des intensités jusqu'à 1000 A AC. MX 650 & MX 655 Les MX 655 et MX 650 sont recommandées pour les mesures de tensions et de courants élevés (jusqu’à 1000 A et 750 V), complétées par un convertisseur RMS pour les signaux alternatifs (MX 655). Côté courant, la MX 655, qui utilise la mesure à effet Hall, mesure des courants AC ou DC. La MX 650 utilise le principe de mesure par transformateur et mesure des courants AC. MX 350 & MX 355 Compactes et ergonomiques, elles répondent parfaitement aux besoins domestiques, tertiaires et des petites industries. La MX 355 dispose d'un Zéro DC automatique pour les mesures d'intensités continues. Cette fonction permet aussi d'effectuer des mesures différentielles en courant, tension et résistance. L’ergonomie de ces pinces a été étudié afin d’offrir à l’utilisateur une parfaite maniabilité. Leur commutateur offre une sélection précise et franche des fonctions. La qualité des afficheurs permet une parfaite lisibilité. >> Les MX 670 & MX 675 permettent la mesure en simultanée de la tension et du courant. Leur double afficheur permet une visualisation instantanée de ces 2 mesures. MX 670 & MX 675 MX 650 & MX 655 MX 350 & MX 355 Afin d’assurer la protection de l’utilisateur et la fiabilité des produits, l’ensemble de la gamme répond aux normes de sécurité (IEC 61010) et de fabrication les plus strictes. Les nouvelles pinces MX 670 & MX 675 s’utilisent parfaitement dans un environnement de catégorie IV (en amont de sectionneur, disjoncteurs…). La gamme des pinces ampèremétriques MX, permet de couvrir un grand nombre d’application grâce à leur diamètre d’enserrage allant de 26 mm (MX 350) à 42 mm (MX 670). Comme les autres modèles, les pinces ampèremétriques MX 670 & MX 675 offrent de très larges plages de mesure, avec notamment des mesures de tension allant jusqu’à 1000 V. Afin d’améliorer la précision des mesures, les MX 670 & MX 675 offrent de nouvelles garanties : la mesure simultanée en courant et en tension. Ainsi les 2 valeurs sont mesurées au même instant dans le même contexte. Le bi-afficheur permet la visualisation de ces résultats de mesure, mesures TRMS dans les 2 cas. Leurs atouts majeurs La sécurité avant tout AD.COM - Code : 906210020 – Ed. 3 – 03/2008 - Document non contractuel. Caractéristiques sous réserve de modifications liées à l’évolution de la technologie. Pour informations et commandes FRANCE Chauvin-Arnoux 190, rue Championnet 75876 PARIS Cedex 18 Tél : +33 1 44 85 44 85 Fax : +33 1 46 27 73 89 info@metrix.fr www.metrix.fr SUISSE Chauvin Arnoux AG Einsiedlerstraße 535 8810 HORGEN Tél : +41 44 727 75 55 Fax : +41 44 727 75 56 info@chauvin-arnoux.ch www.chauvin-arnoux.ch MOYEN-ORIENT Chauvin Arnoux Middle East P.O. BOX 60-154 1241 2020 JAL EL DIB (Beyrouth) Tél : +961 1 890 425 Fax : +961 1 890 424 camie@chauvin-arnoux.com www.chauvin-arnoux.com MX 350 MX 355 MX 650 MX 655 MX 670 MX 675 MX0670 : Pince multimètre MX 670 livrée avec 1 pile alcaline 9 V, 1 notice de fonctionnement en 5 langues, 1 sacoche de transport souple, 1 jeu de cordons avec pointes de touche Ø 4 mm et capteur thermocouple K. MX0675 : Pince multimètre MX 675 livrée avec 1 pile alcaline 9 V, 1 notice de fonctionnement en 5 langues, 1 sacoche de transport souple, 1 jeu de cordons avec pointes de touche Ø 4 mm et 1 capteur thermocouple K. MX0655-Z : Pince multimètre MX 655 livrée avec 1 pile alcaline 9 V, 1 notice de fonctionnement en 5 langues, 1 sacoche de transport souple, 1 jeu de cordons de mesure avec pointes de touche Ø 4 mm. MX0650-Z : Pince multimètre MX 670 livrée avec 1 pile alcaline 9 V, 1 notice de fonctionnement en 5 langues, 1 sacoche de transport souple, 1 jeu de cordons de mesure avec pointes de touche Ø 4 mm. MX0355-Z : Pince multimètre MX 355 livrée avec 1 pile alcaline 9 V, 1 notice de fonctionnement en 5 langues, 1 sacoche de transport souple, 1 jeu de cordons de mesure avec pointes de touche Ø 4 mm. MX0350-Z : Pince multimètre MX 350 livrée avec 1 pile alcaline 9 V, 1 notice de fonctionnement en 5 langues, 1 sacoche de transport souple, 1 jeu de cordons de mesure avec pointes de touche Ø 4 mm. Références pour commander Les pinces ampèremétriques >> Toutes les pinces sont livrées avec leurs accessoires. Il suffit d’installer les piles fournies et l’appareil est prêt pour la mesure ! Ø enserrage 26 mm 30 mm 36 mm 40 mm 42 mm 40 mm Type de mesure AVG AVG RMS TRMS INTENSITÉ DC 0,1 A à 400 A 0,1 A à 1000 A - 0,05 A à 1400 A AC 0,05 A à 400 A 0,05 A à 1000 A 0,05 A à 1000 A TENSION Gamme DC 0,2 V à 1000 V 0,2 V à 1000 V 0,2 V à 1400 V Gamme AC 0,5 V à 600 V 0,5 V à 750 V 0,5 V à 1000 V RÉSISTANCE Gamme 0,2 Ω à 4000 Ω 0,2 Ω à 399,9 Ω 0,3 Ω à 9999 Ω Diode - - 0,6 mA 1,7 mA - - Continuité sonore Oui Oui Oui FRÉQUENCE Intensité 20 Hz à 10 kHz - 20 Hz à 10 kHz 0,2 Hz à 9999 Hz Tension 2 Hz à 1 MHz - 10 Hz à 10 kHz 0,2 Hz à 9999 Hz TEMPÉRATURE AVEC THERMOCOUPLE K °C - - - - -40 °C à +999,5 °C +1000 °C à +1200 °C °F - - - - -40 °F à +2192 °F Affichage 4000 points Double afficheur 10000 points Bargraphe 42 segments avec rétro-éclairage bleu Fonctions HOLD HOLD, HOLD, HOLD HOLD, AUTO-HOLD ∅ Zero, PEAK, PEAK, MIN, MAX Range MAX/MIN, MAX/MIN, PEAK ∅ Rel, Range ∅ Rel ∅ Zero, Sécurité électrique CAT II 600 V CAT III 600 V CAT IV 600 V IEC 61010 CAT III 300 V CAT III 1000 V Dimensions / 193 x 50 x 28 mm / 246 x 93 x 43 mm / 272 x 80 x 43 mm / 257 x 80 x 43 mm / Poids 230 g 400 g 480 g 440 g http://www.farnell.com/datasheets/499062.pdf Nilfi sk E 130.2, E 140.2 User Manual 3 Index 1 Safety precautions and warnings .............................................3 2 Description ...............................................................................4 3 Before you start using your pressure washer ...........................5 4 Operating your pressure washer ..............................................6 5 Fields of Application and Working Methods .............................................................10 6 After using your pressure washer ...........................................12 7 Maintenance ...........................................................................13 8 Trouble Shooting ....................................................................14 9 Further information .................................................................15 10 EC Declaration of Conformity .................................................17 1 Safety Precautions and Warnings Before starting up your high-pressure washer for the fi rst time, this instruction manual must be read through carefully. Save the instructions for later use. Safety instructions marked with this symbol must be observed to prevent danger to persons. This symbol is used to mark safety instructions that must be observed to prevent damage to the machine and its performance. This symbol indicates tips and instructions to simplify work and to ensure a safe operation. 􀀬 Do not let children or people who have not read the instruction manual ope rate the machine. Before starting up your machine please check it carefully for any defects. If you fi nd any, do not start up your machine and contact your Nilfi sk distributor. Especially check: 􀁺 The insulation of the electric cable should be faultless and without any cracks. If the electric cable is damaged, an authorized Nilfi sk distributor should replace it. WARNING! 􀁺 High pressure jets can be dangerous. Never direct the water jet at persons, pets, live electrical equipment or the machine itself. 􀁺 Never try to clean clothes or footwear on yourself or other persons. 􀁺 Hold the spray lance fi rmly with both hands. The spray lance is affected by a thrust of up to 16.4 N during operation. 􀁺 The operator and anyone in the immediate vicinity of the site of cleaning should take action to protect themselves from being struck by debris dislodged during operation. Wear goggles during operation. 􀁺 Never use the machine in an environment where there could be a danger of explosion. If any doubt arises, please contact the local authorities. 􀁺 It is not allowed to clean asbestos- containing surfaces with high pressure. 􀁺 This high pressure washer must not be used at temperatures below 0°C. 􀁺 Never let any persons stay under the product when stored on the wall. WARNING! Inadequate extension cables can be dangerous. Cables on drums should always be completely unwinded to prevent the cable from overheating. Symbols used to mark instructions 4 Extension cables should be of a watertight construction and comply with the below-mentioned requirements for length and cable dimensions. 1.0 mm² max. 12.5 m 1.5 mm² max. 20 m 2.5 mm² max. 30 m 􀁺 Cable connections should be kept dry and off the ground. Mains power connection The following should be observed when connecting the high pressure washer to the electric installation: 􀁺 Only connect the machine to an installation with earth connection. 􀁺 The electric installation shall be made by a certifi ed electrician. 􀁺 It is strongly recommended that the electric supply to this machine should include a residual current device (GFCI). Water connection Connection to the public mains according to regulations. This high pressure washer is only allowed to be connected with the drinking water mains, when an appropriate backfl ow preventer has been installed, Type BA according to EN 1717. The backfl ow preventer can be ordered under number 106411177. The length of the hose between the backfl ow preventer and the high pressure washer must be at least 10 metres to absorb possible pressure peaks (min diameter ½ inch). Operation by suction (for example from a rainwater vessel) is carried out without backfl ow preventer. Recommended suction set: 126411387. As soon as water has fl own through the BA valve, this water is not considered to be drinking water any more. IMPORTANT! Only use water without any impurities. If there is a risk of running sands in the inlet water (i.e. from your own well), an additional fi lter should be mounted. Repair and maintenance WARNING! Always remove the electric plug from the socket before carrying out maintenance work on the machine. Safety devices Locking device on spray gun (7a) (see foldout at the end of this manual): The spray gun features a locking device. When the pawl is activated, the spray gun cannot be ope rated. Thermal sensor: A thermal sensor protects the motor against overloading. The machine will restart after a few minutes when the thermal sensor has cooled. Pressure safety device An integrated hydraulic safety valve protects the system from excessive pressure. 2 Description This high-pressure washer has been developed for domestic use within: - Car, motorbike, boat, caravan, trailer, patio/drive/fl agstones, woodwork, brickwork, barbecue, garden furniture, lawn mower Section 5 describes the use of the high-pressure washer for vaious cleaning jobs. Only use the high-pressure washer for purposes described in this manual. The safety precautions must be observed to prevent damage to the machine, the surface to be cleaned or severe personal injuries. 2.1 Application 5 2.2 Operation elements and model survey See illustration at the end of this manual. 1 Start/stop switch 2 Water inlet (with fi lter) 3 High pressure connection (only models without hose reel) 4 High pressure hose 5 Electric cable 6 Click & Clean spray lance 7 Spray gun with lock 8 Click & Clean Tornado® PR nozzle 9 Click & Clean Powerspeed® nozzle 10 Click & Clean foam sprayer 11 Nozzle cleaning tool 12 Trolley handle (telescopic handle) 13 Hose reel (not standard) 14 Hose hook 15 Model tag 16 Quick coupling 17 Button for telescopic handle 18 Turnable cable hook Specifi cations: See model tag (15) of machine. Sound pressure level measures in accordance with ISO 3744 EEC directive 2000/14/ EEC: LpA = 69,9 dB(A), LWA = 84 dB(A). We reserve the right to alter the specifi cations. 3 Before you start using your pressure washer 3.1 Mounting of trolley handle and hose hook (standard models) 1. Push down the trolley handle (12) over the two metal tubes. Make sure that the handle is mounted as illustrated. Mount screws with nuts (make sure that the screws go through handle as well as tube). 2. Mount the hose hook (14) on the machine (2 screws). Note: the hose hook can be mounted on the front as well as on the back. Front position is to be used if the product is used together with a special wall hook for wall storage. 3.2 Mounting of hose reel handle (models with hose reel) 1. Click the hose reel handle on to the trolley handle (no screws). 6 3.3 Mounting of quick coupling 1. Screw the quick coupling (16) tight on to the water inlet (2). Note: The inlet fi lter must always be fi tted in the water inlet pipe to fi lter out sand, lime stone and other impurities as these will damage the pump valves. Caution: Failure to fi t the fi lter will invalidate the 􀀬guarantee. 4 Operating your pressure washer 4.1 Connection of high pressure hose (models without hose reel) 1. Mount the high pressure hose on the outlet (3). 3.4 Mounting of high pressure hose Attach the high pressure hose (4) to the spray gun (7). De h the high pressure hose by pressing the pawl (A). 7 4.2 Mounting of spray lance and Click & Clean nozzles 􀀬 2. Attach the nozzle. Warning: When attaching the Click & Clean nozzles, the pawl on the side of the spray lance should come out again. Note: The Tornado ® PR nozzle and the foam sprayer feature a swivel lock, which must be positioned in the hole in the Click & Clean spray lance. Press the pawl to detach the Click & Clean nozzle. 1. Push the spray lance (6) into the spray gun (7) and screw it on. Note: The spray lance (6) has a built-in low pressure nozzle that can be used for fl ushing away dirt. 􀀖 􀀗 4.3 Water connection An ordinary 1/2" garden hose of min. 10 m and max. 25 m will be suitable. NOTE: Connection to the public mains according to regulations. IMPORTANT! Only use water without any impurities. If there is a risk of running sands in the inlet water (i.e. from your own well), an additional fi lter should be mounted. 1. Let the water run through the water hose before connecting it to the machine to prevent sand and dirt from penetrating the machine. Note: Check that the fi lter is fi tted in the water inlet pipe and that it is not clogged up. 2. Connect the water hose to the water supply by means of the quick connector (inlet water, max. pressure: 10 bar, max. temperature: 50°C). 3. Turn on the water. 8 4.5 Start and stop of the machine (when connected to a water supply) The spray lance is affected by a thrust during operation - therefore always hold it fi rmly with both hands. IMPORTANT: Point the nozzle at the ground. 1. Check that the machine is in upright position. NOTE: Do not place the machine in high grass! 2. Release the trigger lock. 3. Activate the trigger of the spray gun and let the water run until all air has escaped from the water hose. 4. Turn the start/stop switch (1) to position "I". 5. Activate the trigger of the spray gun. Always adjust the distance and thus the pressure of the nozzle to the surface, which is to be cleaned. Do not cover the machine during operation. Note: If the machine is left or not used for 5 minutes, it must be switched off on the start/stop switch "O" (1): 1. Turn the start/stop switch to position "O". 2. Disconnect the electrical plug from the socket. 3. Shut off the water supply and activate the trigger to relieve the machine of pressure. 4. Lock the spray gun. When releasing the trigger of the spray gun, the machine automatically stops. The machine will start again when you re-activate the spray gun. 4.4 Telescopic handle The machine features a telescopic handle. To raise or lower the handle, press the knob and move the handle upwards or downwards. When a click is heard, the handle is in right position. Use an external fi lter if the water contains impurities. 2. Turn the start/stop switch to position "I". 3. Activate the trigger of the spray gun and let the water run, until the air has escaped from the water hose and the pump. 4. Mount spray lance and nozzle. The washer can take in water from a rain water tank as an example. The hose for the water supply must not be too long, approx. 5 m. Make sure that the water tank is not placed on a lower level than the machine. 1. Place the other end of the water hose in the water tank. 4.6 Start the machine (when connected to open containers (suction mode)) 9 4.7 Pressure regulation on the TORNADO® PRnozzle The pressure can be regulated on the TORNADO® PR nozzle. 4.8 Stationary use If mounting a special wall hook (not standard), the pressure washer can be used as a stationary solution meaning that it can be operated while hanging on the wall. Only mount the wall hook on a sturdy wall. Adjust the length of the screws and size of rawlplugs to the type of wall. On the wall hook garden/rim brush (a) foam sprayer (b), Click & Clean brush (c) and Click & Clean nozzles (d) can be stored. Important: The bearing capacity of the wall hook is max. 30 kg. 􀁁 􀁃 􀁂 􀁄 􀀬 􀀬􀁁􀁖􀁔􀁒􀁙􀁋 􀀨􀂒􀁊􀁔􀁒􀁙􀁋 High pressure Low pressure 10 5 Fields of application and working methods 5.1 General Effi cient high presure cleaning is achieved by following a few guidelines, combined with your own personal experience of specifi c cleaning tasks. Accessories and detergents, when correctly chosen, can increase the effi ciency of your pressure washer. Here is some basic information about cleaning. 5.1.1 Detergent and foam Foam or detergent should be applied onto dry surfaces so that the chemical product is in direct contact with the dirt. Detergents are applied from bottom to top, for example on a car bodywork, in order to avoid "super clean" areas, where the detergent collects in higher concentration and streams downwards. Let the detergent work for several minutes before rinsing but never let it dry on the surface being cleaned. Note: It is important that the detergents do not dry up. Otherwise the surfac that has to be cleaned can be da maged. 5.1.2 Mechanical effect In order to break down tough layers of dirt, additional mechanical effect may be required. Special wash brushes offer this supplementary effect that cuts through dirt (especially by car washing). 11 5.2 Typical fi elds of application Below you will fi nd a description of a lot of cleaning tasks which can be solved by a pressure washer from Nilfi sk in association with accessories and detergents. Task Accessories ‘Click & Clean’ Cleaning method Car Car nozzle, auto brush, underchassis nozzle, Foam sprayer, Car Combi Cleaner 1. Apply Car Combi Cleaner with the foam sprayer. Always start from the bottom and work upwards. Let Car Combi Cleaner act for at least 5 min. 2. Wash the car with the car nozzle, which has been optimized for quick and gentle cleaning of enamelled surfaces (the jet is wider and not so sharp). Start at the front of the car and work backwards to avoid water from penetrating by the door mouldings. 3. Use the brush for removal of traffi c fi lm which is not removed by the nozzle. If the car is very dirty, apply Car Combi Clean er again. 4. Attach the undercarriage nozzle and clean undercarriage and wheel arches. 5. Remove water from the surface of the car with the scraper on the car brush. Make sure that all grains of sand etc. have been removed before using the scraper. Wipe with a wash leather where the scraper cannot reach. Rims, aluminium Rim brush, auto nozzle, atomizer, Alu Cleaner Apply Alu Cleaner with an automizer. Let it act for approx. 5 min. and wash with the rim brush. For steel rims, use Car Combi Cleaner. Use the foam sprayer and wash with rim brush. Be careful! The high pressure jet may damage the tyres. Flagstones, concrete fl oors and other hard surfaces Powerspeed® nozzle, Stone & Wood Cleaner, Patio Cleaner Wash towards outlets or the like. On surfaces with moss or algae you may start by applying Stone & Wood Cleaner with the foam sprayer. Wash before the soap dries. Another more effective and quicker method is to use the Patio Cleaner. Thus you will also avoid splashes. Garden furniture, wood Wood Cleaner Garden brush Apply Wood Cleaner and wash before the soap dries. NOTE: Use the garden brush to clean off the dirt. Brickwork, Wood work Powerspeed® nozzle, Stone & Wood Cleaner, Patio Cleaner Same method as for fl agstones, but be careful - bad joints and wood may be damaged by high pressure. You may choose only to use the Tornado® nozzle. Adjust the distance (pressure) to the quality of the joints and the wood. Patio Cleaner can also be used on vertical surfaces. Gutter Underchassis spray lance Wash the gutter with the nozzle. Always wash towards downpipes. Beware not to spray under the roofi ng. Cleaning of drain pipes, outlets, down pipes etc. Tube cleaner Push the tube cleaner approx. ½ m (to mark) into a tube or drain and activate the trigger of the spray handle. The nozzle opening turning backwards will pull the cleaner through the tube. The nozzle will break down the „plug“ and fl ush the dirt backwards. Rust, paint Water/sandblasting equipment Mount the water/sand blasting equipment and rust and paint is effi ciently and quickly removed. Beware not to damage the surface to be sandblasted. Greenhouse Tornado® PR nozzle brush, Stone & Wood Cleaner Wash with high pressure and maybe a brush. You may use Stone & Wood Cleaner to remove moss and algae. Garden tools, lawn mover Tornado® PR nozzle, Powerspeed ® nozzle, multiangle adaptor, Metal Cleaner Rinse the worst dirt off with the nozzle. Apply Metal Cleaner with the foam sprayer and let it act for approx. 5 min. Wash with the nozzle. You may use the multiangle adaptor for hard to get at areas to avoid splashing. 12 􀀬 6 After using your pressure washer 6.2 Winding up of electric cable and high pressure hose carefully up. 1. Wind up the electric cable on the appropriate hooks. Builtin clip for good holding (1). The lower hook can be turned to release the electric cable. 2. The high pressure washer comes in two models: A) with hook for storage of high pressure hose (14) - B) with a hose reel (13). 6.1 Storing the washer The machine should be stored in a frost-free room! Pump, hose and accessories should always be emptied of water prior to storing as follows: 1. Stop the machine (turn the start/stop switch (1) to position “O” and detach water hose and accessory. 2. Restart the machine and activate the trigger. Let the machine run until no more water runs through the spray gun. 3. Stop the machine, unplug and wind up hose and cable. 4. Place spray handle, nozzles and other accessories in the holders of the machine. Should the machine by mistake be frozen, it will be necessary to check it for damage. NEVER START-UP A FROZEN MACHINE. Frost damages are not covered by the guarantee! 6.3 Storage of accessories The standard accessories (spray gun (f), spray lance (a), nozzles (b) foam sprayer (c)) can be stored on the pressure washer. The nozzle cleaning tool (d) and a Click & Clean brush (e) can also be stored on the product. To avoid accidents, the electric cable and the high pressure hose should always be winded a b c d e f a + f 13 WARNING! Always disconnect the electrical plug from the socket prior to maintenance or cleaning. To ensure a long and problem free working life, please take the following advice: 􀁺 Wash out water hose, high pressure hose, spray lance and accessories before mounting. 􀁺 Clean the connectors of dust and sand. Make sure that no sand or dirt is blocking the movement of the pawl on the Click & Clean spray lance. 􀁺 Rinse the detergent spraying attachment after use. 􀁺 Clean the nozzles. Any repair should always be made in an authorized workshop with original spare parts. 7 Maintenance 7.1 Cleaning of water inlet fi lter Clean the water inlet fi lter regularly once a month or more frequently according to use. Carefully loosen the fi lter with a pair of pliers and clean it. Check that it is intact before re-mounting it. The inlet fi lter must always be fi tted inside the water inlet pipe to fi lter out sand, limestone and other impurities, as they will damage the pump valves. CAUTION: Failure to fi t the fi lter will invalidate the guarantee. 7.2 Cleaning of nozzle A clogging up in the nozzle causes a pump pressure which is too high. This is why cleaning is required immediately. 1. Stop the machine and disconnect the nozzle. 2. Clean the nozzle. IMPORTANT: The cleaning tool (11) should only be used when the nozzle is detached! 3. Flush the nozzle backwards with water. 7.3 Cleaning of machine vents The machine should be kept clean so as to let cooling air 7.4 Greasing of couplings To ensure an easy connection and that o-rings do not pass freely through the machine vents. dry up, the couplings should be greased regularly. 14 8 Trouble-shooting To avoid unnecessary disappointments, you should check the following before contacting the Nilfi sk service organization: Symptom Cause Recommended action Machine refuses to start Machine not plugged in Plug in machine. Defective socket Try another socket. Fuse has blown Replace fuse. Switch off other machines. Defective extension cable Try without the extension cable. Fluctuating pressure Pump sucking air Check that hoses and connections are airtight. Valves dirty, worn out Clean and replace or refer to local Nilfi sk or stuck distributor Pump seals worn out Clean and replace or refer to local Nilfi sk distributor. Motor busses Low voltage or Activate the trigger of the spray gun. low temperature Machine stops Fuse has blown Replace fuse. Switch off other machines. Incorrect mains voltage Check that the mains voltage corresponds to specifi cation on the model tag. Thermal sensor activated Leave the washer for 5 minutes to cool down. Nozzle partially blocked Clean the nozzle (see section 7.2) Fuse blows Fuse too small Change to an installation higher than the amp. consumption of the machine. You may try without the extension cable. Machine pulsating Air in inlet hose/pump Allow machine to run with open trigger until regular working pressure resumes. Inadequate supply of Check that the water supply corresponds to mains water specifi cations required (see model tag) NB! Avoid using long, thin hoses (min. 1/2") Nozzle partially blocked Clean the nozzle (see section 7.2) Water fi lter blocked Clean the fi lter (see section 7.1) Hose kinked Straighten out hose. Machine often starts Pump/spray gun is Contact your nearest Nilfi sk Service and stops by itself leaking Centre. Machine starts, but Pump/hoses or accessory Wait for pump/hoses or accessory to thaw. no water comes out frozen No water supply Connect inlet water. Water fi lter blocked Clean the fi lter (see section 7.1) Nozzle blocked Clean the nozzle (see section 7.2) In case problems other than the above occur, please contact your local Nilfi sk distributor. 15 9 Further information 9.1 Recycling the washer Make the old cleaner unusable immediately. 1. Unplug the cleaner and cut the electric cable. Do not discard electrical appliances with household waste. As specifi ed in European Directive 2002/96/EC on old electrical and electronic appliances, used electrical goods must be collected separately and recycled ecologically. Contact your local authorities or your nearest dealer for further information. 9.2 Warranty conditions Nilfi sk guarantees high pressure washers for domestic use for 2 years. If your high pressure washer or ac ces so ries are handed in for repair, a copy of the receipt must be enclosed. Guarantee repairs are being made on the following con dit ions: 􀁺 that defects are attributable to fl aws or defects in materials or workmanship. (wear and tear as well as misuse are not covered by the gu a ran tee). 􀁺 that the directions of this instruction manual have been thoroughly observed. 􀁺 that repair has not been carried out or attempted by other than Nilfi sk-trained service staff. 􀁺 that only original accessories have been applied. 􀁺 that the product has not been exposed to abuse such as knocks, bumps or frost. 􀁺 that only water without any impurities has been used. 􀁺 that the high pressure washer has not been used for rental nor used com mer cial ly in any other way. Repairs under this guarantee include replacement of defective parts, exclusive of packing and postage/carriage. Besides, we refer to your national law of sale. The machine should be forwarded to one of the service centres of the Nilfi sk organisation with description/spe ci fi ca - ti on of the fault. Repairs not covered by the guarantee conditions will be invoiced. (I.e. malfunctions due to Causes men ti o ned in section Troubleshooting Chart of the instruction manual). In order that Nilfi sk can render you optimum service, you should register your product on our web site www.nilfi sk-alto. com under “PRODUCT REGISTRATION”. 16 9.3 Accessories Only use original accessories. Click & Clean Car nozzle Special nozzle for enameled surfaces. Optimal distance: 30 - 50 cm. Click & Clean Undershassis nozzle 90° angled special nozzle for undercarriage and wheel arches. Integrated guide shoes. Click & Clean Multiangle adaptor Adjusted in angles from 0° - 90° for better working posture and cleaning of hard to get at places as for instance barrels or the underside of the lawn mower. Fits all nozzles. Click & Clean Brushes For cars and other surfaces. Available in more shapes. Extension hose 7 m extension hose increasing the working range. Underchassis spray lance Special spray lance for washing your car underneath. Drain & Tube cleaner 15 m long tube cleaner for the cleaning of tubes and drains. Water-sandblasting equipment For removal of paint and rust. Sand available from do-it-yourself shops. Patio Plus Equipment for quick cleaning of patio/drive/fl agstones. Garden brush Rotating brush for cleaning of wooden surfaces. Rim brush Rotating brush for cleaning of wheel rims. Wall hook For suspension of your high pressure washer on the wall. Rotary brush For cleaning vehicles and other surfaces. Water suction kit For removal of large amounts of water from e.g. garden pounds. 17 EU Declaration of Conformity Product: High Pressure Washer Type: Nilfi sk E 130.2, E 140.2 Description: 230 V 1~, 50 Hz - IP X5 The design of the unit corresponds to the following pertinent regulations: EC Machine Directive 98/37/EC EC Low-voltage Directive 73/23/EC EC EMV Directive 2004/108/EC Applied harmonised standards: EN 60335-2-79 Applied national standards and technical specifi cations: IEC 60335-2-79 Anton Sørensen V.P. Technical Operations Europe Nilfi sk Division of Nilfi sk-Advance A/S Industrivej 1 DK-9560 Hadsund Hadsund, 01.01.2008 Detergents Stone & Wood Cleaner For fl agstones, brick- and woodwork. Suitable for moss and algae. Plastic Cleaner For plastic and synthetic materials such as garden furniture. Metal Cleaner For cleaning of metal such as garden tools. Car Combi Cleaner For cars etc. With rinsing wax. Alu Cleaner For surfaces of aluminium. Applied with an atomizer. Oil & Grease Cleaner For cleaning of grease and oil on motors for instance. Applied with an atomizer. Wood Cleaner For cleaning of wooden surfaces incl. of wooden garden furniture. 10 EU Declaration of Conformity 128303203 a (02.2008) Nilfi sk, Division of Nilfi sk-Advance A/S, Industrivej 1, DK - 9560 Hadsund, tel.: (+45) 7218 2100 http://www.farnell.com/datasheets/655334.pdf Page : 1 FICHE DE DONNEES DE SECURITE BA Edition révisée n° : 1 ref ISO : 123456 Date : 26/6/2008 BACTONET Remplace la fiche : 0/0/0 103880www.lisam.com Producteur ITW Spraytec 99 Quai du Docteur Dervaux F-92600 Asnières sur Seine France Tel : 01.40.80.32.32 - Fax : 01.40.80.32.30 infofds@itwpc.com 1 IDENTIFICATION DE LA SUBSTANCE / PRÉPARATION ET DE LA SOCIÉTÉ / ENTREPRISE Nom commercial : BACTONET Identification du produit : Lingettes. Type de produit : Lingettes. Identification de la société : Voir producteur. N° de téléphone en cas d'urgence : INRS : 01.45.42.59.59 2 IDENTIFICATION DES DANGERS Symptômes liés à l'utilisation - Inhalation : Non considéré comme dangereux à l'inhalation dans des conditions normales d'utilisation. - Contact avec la peau : Non considéré comme particulièrement dangereux au contact de la peau dans des conditions normales d'utilisation. - Contact avec les yeux : Non considéré comme particulièrement dangereux pour les yeux dans des conditions normales d'utilisation. 3 COMPOSITION / INFORMATIONS SUR LES COMPOSANTS Ce produit n'est pas considéré comme dangereux mais contient des composants dangereux. Nom de la substance Contenance (%) No CAS / No CE / Numéro index Symbole(s) Phrase(s) R Ethanol : < 5 % 64-17-5 / 200-578-6 / 603-002-00-5 F 11 4 PREMIERS SECOURS Premiers secours - Inhalation : Amener la victime à l'air libre. Faire respirer de l'air frais. - Contact avec la peau : Laver abondamment la peau avec de l'eau savonneuse. - Contact avec les yeux : Rincer immédiatement et abondamment à l'eau. Consulter un médecin si la douleur ou la rougeur persistent. - Ingestion : Consulter un médecin. 5 MESURES DE LUTTE CONTRE L'INCENDIE - Agents d'extinction appropriés : Dioxyde de carbone. Poudre. Brouillard d'eau. Mousse résistant à l'alcool. Incendies avoisinants : Refroidir les conteneurs exposés par pulvérisation ou brouillard d'eau. Protection contre l'incendie : Porter un équipement de protection adéquat. 6 MESURES À PRENDRE EN CAS DE DISPERSION ACCIDENTELLE Précautions individuelles : Non requis. Précautions pour l'environnement : Eviter la pénétration dans les égouts et les eaux potables. Méthodes de nettoyage : Balayer ou recueillir le produit déversé et le mettre dans un récipient approprié pour élimination. 7 MANIPULATION ET STOCKAGE Stockage : Conserver dans un endroit sec, frais et bien ventilé. Conserver uniquement dans le récipient d'origine dans un endroit frais et bien ventilé. Manipulation : Aucune procédure spéciale n'est requise. ITW Spraytec 99 Quai du Docteur Dervaux F-92600 Asnières sur Seine FrancePage : 2 FICHE DE DONNEES DE SECURITE BA Edition révisée n° : 1 ref ISO : 123456 Date : 26/6/2008 BACTONET Remplace la fiche : 0/0/0 103880www.lisam.com 8 CONTRÔLE DE L'EXPOSITION / PROTECTION INDIVIDUELLE Protection individuelle - Protection respiratoire : Non requis. - Protection des mains : Non requis. - Protection des yeux : Non requis. Hygiène industrielle : Ne pas manger, ne pas boire et ne pas fumer pendant l'utilisation. Limites d'exposition professionnelle : Ethanol : VME (ppm) : 1000 Ethanol : VME (mg/m3) : 1900 Ethanol : VLE (ppm) : 5000 Ethanol : VLE (mg/m3) : 9500 9 PROPRIÉTÉS PHYSIQUES ET CHIMIQUES Etat physique à 20 °C : Lingettes imprégnées d'un liquide incolore. Couleur : Blanc(he). Odeur : Caractéristique. Solubilité dans : Eau. Point d'éclair [°C] : Aucun(e). 10 STABILITÉ ET RÉACTIVITÉ Stabilité et réactivité : Stable. Produits de décomposition dangereux : Aucun(es) dans des conditions normales. Chauffé jusqu'au point de décomposition, libère des fumées dangereuses. Dioxyde de carbone. Monoxyde de carbone. 11 INFORMATIONS TOXICOLOGIQUES Toxicité aiguë : Non considéré comme dangereux dans des conditions normales d'utilisation. Ethanol : DL50 po (rat) 7060 mg/Kg 12 INFORMATIONS ÉCOLOGIQUES Sur le produit : Aucune donnée disponible. Eviter le rejet dans l'environnement. Biodégradation [%] : Biodégradable. Potentiel de bio-accumulation : Coef de partage n-octanol/eau : Ethanol : log Poe : -0.32 CE50-48 Hrs - Daphnia magna [mg/l] : 9268 (éthanol) 13 CONSIDÉRATIONS RELATIVES À L'ÉLIMINATION Généralités :Détruire conformément aux règlements de sécurité locaux/nationaux en vigueur. Méthode d'élimination : Rincer/diluer le résidu à l'eau. 14 INFORMATIONS RELATIVES AU TRANSPORT Information générale : Non réglementé. Transport terrestre : Non réglementé. Transport par mer : Non réglementé. Transport aérien : Non réglementé. 15 INFORMATIONS RÉGLEMENTAIRES - Symbole(s) : Aucun(e). - Phrase(s) R : Aucun(e). - Phrase(s) S : Aucun(e). Conseils de sécurité : Utiliser ce produit uniquement pour les applications auxquelles il est destiné. ITW Spraytec 99 Quai du Docteur Dervaux F-92600 Asnières sur Seine FrancePage : 3 FICHE DE DONNEES DE SECURITE BA Edition révisée n° : 1 ref ISO : 123456 Date : 26/6/2008 BACTONET Remplace la fiche : 0/0/0 103880www.lisam.com 16 AUTRES INFORMATIONS Utilisations recommandées & restrictions: Voir fiche technique pour des informations détaillées. Texte des Phrases R du § 2 : R11 : Facilement inflammable. Le contenu et le format de cette fiche de données de sécurité sont conformes à la Directive 2004/73/CE de la Commission de la CEE. DENEGATION DE RESPONSABILITE Les informations contenues dans cette fiche proviennent de sources que nous considérons être dignes de foi. Néanmoins, elles sont fournies sans aucune garantie, expresse ou tacite, de leur exactitude. Les conditions ou méthodes de manutention, stockage, utilisation ou élimination du produit sont hors de notre contrôle et peuvent ne pas être du ressort de nos compétences. C'est pour ces raisons entre autres que nous déclinons toute responsabilité en cas de perte, dommage ou frais occasionnés par ou liés d'une manière quelconque à la manutention, au stockage, à l'utilisation ou à l'élimination du produit. Cette FDS a été rédigée et doit être utilisée uniquement pour ce produit. Si le produit est utilisé en tant que composant d'un autre produit, les informations s'y trouvant peuvent ne pas être applicables. Fin du document ITW Spraytec 99 Quai du Docteur Dervaux F-92600 Asnières sur Seine France April 3, 2008 LME49725 PowerWise® Dual High Performance, High Fidelity Audio Operational Amplifier General Description The LME49725 is part of the ultra-low distortion, low noise, high slew rate operational amplifier series optimized and fully specified for high performance, high fidelity applications. Combining advanced leading-edge process technology with state-of-the-art circuit design, the LME49725 audio operational amplifiers deliver superior audio signal amplification for outstanding audio performance. The LME49725 combines extremely low voltage noise density (3.3nV/√Hz) with vanishingly low THD+N (0.00004%) to easily satisfy the most demanding audio applications. To ensure that the most challenging loads are driven without compromise, the LME49725 has a high slew rate of ±15V/μs and an output current capability of ±22mA. Further, dynamic range is maximized by an output stage that drives 2kΩ loads to within 1V of either power supply voltage and to within 1.4V when driving 600Ω loads. Part of the PowerWise® family of energy efficient solutions, the LME49725 consumes only 3.0mA of supply current per amplifier while providing superior performance to high performance, high fidelity applications. The LME49725's outstanding CMRR (120dB), PSRR (120dB), and VOS (0.5mV) give the amplifier excellent operational amplifier DC performance. The LME49725 has a wide supply range of ±4.5V to ±18V. Over this supply range the LME49725’s input circuitry maintains excellent common-mode and power supply rejection, as well as maintaining its low input bias current. The LME49725 is unity gain stable. This audio operational amplifier achieves outstanding AC performance while driving complex loads with values as high as 100pF. The LME49725 is available in 8–lead narrow body SOIC. Key Specifications ■ Power Supply Voltage Range ±4.5V to ±18V ■ THD+N (AV = 1, VOUT = 3VRMS, fIN = 1kHz) RL = 2kΩ 0.00004% (typ) RL = 600Ω 0.00004% (typ) ■ Quiescent current per Amplifier 3.0mA (typ) ■ Input Noise Density 3.3nV/√Hz (typ) ■ Slew Rate ±15V/μs (typ) ■ Gain Bandwidth Product 40MHz (typ) ■ Open Loop Gain (RL = 600Ω) 135dB (typ) ■ Input Bias Current 15nA (typ) ■ Input Offset Voltage 0.5mV (typ) ■ DC Gain Linearity Error 0.000009% (typ) Features ■ Optimized for superior audio signal fidelity ■ Output short circuit protection ■ PSRR and CMRR exceed 120dB (typ) Applications ■ Audio amplification ■ Preamplifiers ■ Multimedia ■ Phono preamplifiers ■ Professional audio ■ Equalization and crossover networks ■ Line drivers ■ Line receivers ■ Active filters © 2008 National Semiconductor Corporation 300342 www.national.com LME49725 PowerWise® Dual High Performance, High Fidelity Audio Operational Amplifier Connection Diagrams 30034255 Order Number LME49725MA See NS Package Number — M08A LME49725 Top Mark 300342p0 N — National logo Z — Assembly plant code X — 1 Digit date code TT — Die traceability L49725 — LME49725 MA — Package code www.national.com 2 LME49725 Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Power Supply Voltage (VS = V+ - V-) 38V Storage Temperature −65°C to 150°C Input Voltage (V-)-0.7V to (V+)+0.7V Differential Input Voltage ±0.7V Output Short Circuit (Note 3) Continuous Power Dissipation Internally Limited ESD Rating (Note 4) 2000V ESD Rating (Note 5) Pins 1, 4, 7 and 8 200V Pins 2, 3, 5 and 6 100V Junction Temperature 150°C Thermal Resistance θJA (SO) 145°C/W Temperature Range TMIN ≤ TA ≤ TMAX –40°C ≤ TA ≤ 85°C Supply Voltage Range ±4.5V ≤ VS ≤ ±18V Electrical Characteristics for the LME49725 (Note 2) The specifications apply for VS = ±15V, RL = 2kΩ, fIN = 1kHz, TA = 25°C, unless otherwise specified. Symbol Parameter Conditions LME49725 Units (Limits) Typical Limit (Note 6) (Note 7) THD+N Total Harmonic Distortion + Noise AV = 1, VOUT = 3Vrms RL = 2kΩ RL = 600Ω 0.00004 0.00004 0.0002 % % IMD Intermodulation Distortion AV = 1, VOUT = 3VRMS Two-tone, 60Hz & 7kHz 4:1 0.00005 % GBWP Gain Bandwidth Product 40 30 MHz (min) SR Slew Rate ±15 ±10 V/μs (min) FPBW Full Power Bandwidth VOUT = 1VP-P, –3dB referenced to output magnitude at f = 1kHz 7 MHz ts Settling time AV = –1, 10V step, CL = 100pF 0.1% error range 1.6 μs en Equivalent Input Noise Voltage fBW = 20Hz to 20kHz 0.4 0.8 μVRMS (max) Equivalent Input Noise Density f = 1kHz f = 10Hz 3.3 20 5.2 nV/√Hz (max) in Current Noise Density f = 1kHz f = 10Hz 1.4 3.5 pA/√Hz pA/√Hz VOS Offset Voltage ±0.5 ±1.0 mV (max) ΔVOS/ΔTemp Average Input Offset Voltage Drift vs Temperature –40°C ≤ TA ≤ 85°C 0.2 μV/°C PSRR Average Input Offset Voltage Shift vs Power Supply Voltage ΔVS = 20V (Note 8) 120 100 dB (min) ISOCH-CH Channel-to-Channel Isolation fIN = 1kHz fIN = 20kHz 118 112 dB dB IB Input Bias Current VCM = 0V ±15 ±90 nA (max) ΔIOS/ΔTemp Input Bias Current Drift vs Temperature –40°C ≤ TA ≤ 85°C 0.1 nA/°C IOS Input Offset Current VCM = 0V 11 65 nA (max) VIN-CM Common-Mode Input Voltage Range ±13.9 (V+)-2.0 (V-)+2.0 V (min) V (min) CMRR Common-Mode Rejection –10V: CPU Interrupt Priority Level Status bits(1,2) 111 = CPU interrupt priority level is 7 (15); user interrupts disabled 110 = CPU interrupt priority level is 6 (14) 101 = CPU interrupt priority Level is 5 (13) 100 = CPU interrupt priority level is 4 (12) 011 = CPU interrupt priority level is 3 (11) 010 = CPU interrupt priority level is 2 (10) 001 = CPU interrupt priority level is 1 (9) 000 = CPU interrupt priority level is 0 (8) bit 4 RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress bit 3 N: ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) bit 2 OV: ALU Overflow bit 1 = Overflow occurred for signed (2’s complement) arithmetic in this arithmetic operation 0 = No overflow has occurred bit 1 Z: ALU Zero bit 1 = An operation which effects the Z bit has set it at some time in the past 0 = The most recent operation which effects the Z bit has cleared it (i.e., a non-zero result) bit 0 C: ALU Carry/Borrow bit 1 = A carry out from the Most Significant bit of the result occurred 0 = No carry out from the Most Significant bit of the result occurred Note 1: The IPL Status bits are read-only when NSTDIS (INTCON1<15>) = 1. 2: The IPL Status bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU Interrupt Priority Level (IPL). The value in parentheses indicates the IPL when IPL3 = 1.  2009 Microchip Technology Inc. DS39897C-page 37 PIC24FJ256GB110 FAMILY 3.3 Arithmetic Logic Unit (ALU) The PIC24F ALU is 16 bits wide and is capable of addition, subtraction, bit shifts and logic operations. Unless otherwise mentioned, arithmetic operations are 2’s complement in nature. Depending on the operation, the ALU may affect the values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) Status bits in the SR register. The C and DC Status bits operate as Borrow and Digit Borrow bits, respectively, for subtraction operations. The ALU can perform 8-bit or 16-bit operations, depending on the mode of the instruction that is used. Data for the ALU operation can come from the W register array, or data memory, depending on the addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array or a data memory location. The PIC24F CPU incorporates hardware support for both multiplication and division. This includes a dedicated hardware multiplier and support hardware for 16-bit divisor division. 3.3.1 MULTIPLIER The ALU contains a high-speed, 17-bit x 17-bit multiplier. It supports unsigned, signed or mixed sign operation in several multiplication modes: 1. 16-bit x 16-bit signed 2. 16-bit x 16-bit unsigned 3. 16-bit signed x 5-bit (literal) unsigned 4. 16-bit unsigned x 16-bit unsigned 5. 16-bit unsigned x 5-bit (literal) unsigned 6. 16-bit unsigned x 16-bit signed 7. 8-bit unsigned x 8-bit unsigned REGISTER 3-2: CORCON: CPU CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 R/C-0 R/W-0 U-0 U-0 — — — — IPL3(1) PSV — — bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-4 Unimplemented: Read as ‘0’ bit 3 IPL3: CPU Interrupt Priority Level Status bit(1) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less bit 2 PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space bit 1-0 Unimplemented: Read as ‘0’ Note 1: User interrupts are disabled when IPL3 = 1. PIC24FJ256GB110 FAMILY DS39897C-page 38  2009 Microchip Technology Inc. 3.3.2 DIVIDER The divide block supports signed and unsigned integer divide operations with the following data sizes: 1. 32-bit signed/16-bit signed divide 2. 32-bit unsigned/16-bit unsigned divide 3. 16-bit signed/16-bit signed divide 4. 16-bit unsigned/16-bit unsigned divide The quotient for all divide instructions ends up in W0 and the remainder in W1. Sixteen-bit signed and unsigned DIV instructions can specify any W register for both the 16-bit divisor (Wn), and any W register (aligned) pair (W(m + 1):Wm) for the 32-bit dividend. The divide algorithm takes one cycle per bit of divisor, so both 32-bit/16-bit and 16-bit/16-bit instructions take the same number of cycles to execute. 3.3.3 MULTI-BIT SHIFT SUPPORT The PIC24F ALU supports both single bit and single-cycle, multi-bit arithmetic and logic shifts. Multi-bit shifts are implemented using a shifter block, capable of performing up to a 15-bit arithmetic right shift, or up to a 15-bit left shift, in a single cycle. All multi-bit shift instructions only support Register Direct Addressing for both the operand source and result destination. A full summary of instructions that use the shift operation is provided below in Table 3-2. TABLE 3-2: INSTRUCTIONS THAT USE THE SINGLE AND MULTI-BIT SHIFT OPERATION Instruction Description ASR Arithmetic shift right source register by one or more bits. SL Shift left source register by one or more bits. LSR Logical shift right source register by one or more bits.  2009 Microchip Technology Inc. DS39897C-page 39 PIC24FJ256GB110 FAMILY 4.0 MEMORY ORGANIZATION As Harvard architecture devices, PIC24F microcontrollers feature separate program and data memory spaces and busses. This architecture also allows the direct access of program memory from the data space during code execution. 4.1 Program Address Space The program address memory space of the PIC24FJ256GB110 family devices is 4M instructions. The space is addressable by a 24-bit value derived from either the 23-bit Program Counter (PC) during program execution, or from table operation or data space remapping, as described in Section 4.3 “Interfacing Program and Data Memory Spaces”. User access to the program memory space is restricted to the lower half of the address range (000000h to 7FFFFFh). The exception is the use of TBLRD/TBLWT operations which use TBLPAG<7> to permit access to the Configuration bits and Device ID sections of the configuration memory space. Memory maps for the PIC24FJ256GB110 family of devices are shown in Figure 4-1. FIGURE 4-1: PROGRAM SPACE MEMORY MAP FOR PIC24FJ256GB110 FAMILY DEVICES 000000h 0000FEh 000002h 000100h F8000Eh F80010h FEFFFEh FFFFFFh 000004h 000200h 0001FEh 000104h Reset Address DEVID (2) GOTO Instruction Reserved Alternate Vector Table Reserved Interrupt Vector Table PIC24FJ128GB1XX Configuration Memory Space User Memory Space Flash Config Words Note: Memory areas are not shown to scale. Reset Address Device Config Registers DEVID (2) GOTO Instruction Reserved Alternate Vector Table Reserved Interrupt Vector Table PIC24FJ192GB1XX FF0000h F7FFFEh Device Config Registers F80000h 800000h 7FFFFFh Reserved Reserved Flash Config Words 02AC00h 02ABFEh Unimplemented Read ‘0’ Unimplemented Read ‘0’ Reset Address Device Config Registers User Flash Program Memory (87K instructions) DEVID (2) GOTO Instruction Reserved Alternate Vector Table Reserved Interrupt Vector Table PIC24FJ256GB1XX Reserved Flash Config Words Unimplemented Read ‘0’ Reset Address DEVID (2) GOTO Instruction Reserved Alternate Vector Table Reserved Interrupt Vector Table PIC24FJ64GB1XX Flash Config Words Device Config Registers Reserved Unimplemented Read ‘0’ 015800h 0157FEh 00AC00h 00ABFEh User Flash Program Memory (22K instructions) 020C00h 020BFEh User Flash Program Memory (67K instructions) User Flash Program Memory (44K instructions) PIC24FJ256GB110 FAMILY DS39897C-page 40  2009 Microchip Technology Inc. 4.1.1 PROGRAM MEMORY ORGANIZATION The program memory space is organized in word-addressable blocks. Although it is treated as 24 bits wide, it is more appropriate to think of each address of the program memory as a lower and upper word, with the upper byte of the upper word being unimplemented. The lower word always has an even address, while the upper word has an odd address (Figure 4-2). Program memory addresses are always word-aligned on the lower word and addresses are incremented or decremented by two during code execution. This arrangement also provides compatibility with data memory space addressing and makes it possible to access data in the program memory space. 4.1.2 HARD MEMORY VECTORS All PIC24F devices reserve the addresses between 00000h and 000200h for hard coded program execution vectors. A hardware Reset vector is provided to redirect code execution from the default value of the PC on device Reset to the actual start of code. A GOTO instruction is programmed by the user at 000000h, with the actual address for the start of code at 000002h. PIC24F devices also have two interrupt vector tables, located from 000004h to 0000FFh and 000100h to 0001FFh. These vector tables allow each of the many device interrupt sources to be handled by separate ISRs. A more detailed discussion of the interrupt vector tables is provided in Section 7.1 “Interrupt Vector Table”. 4.1.3 FLASH CONFIGURATION WORDS In PIC24FJ256GB110 family devices, the top three words of on-chip program memory are reserved for configuration information. On device Reset, the configuration information is copied into the appropriate Configuration registers. The addresses of the Flash Configuration Word for devices in the PIC24FJ256GB110 family are shown in Table 4-1. Their location in the memory map is shown with the other memory vectors in Figure 4-1. The Configuration Words in program memory are a compact format. The actual Configuration bits are mapped in several different registers in the configuration memory space. Their order in the Flash Configuration Words does not reflect a corresponding arrangement in the configuration space. Additional details on the device Configuration Words are provided in Section 26.1 “Configuration Bits”. TABLE 4-1: FLASH CONFIGURATION WORDS FOR PIC24FJ256GB110 FAMILY DEVICES FIGURE 4-2: PROGRAM MEMORY ORGANIZATION Device Program Memory (Words) Configuration Word Addresses PIC24FJ64GB 22,016 00ABFAh: 00ABFEh PIC24FJ128GB 44,032 0157FAh: 0157FEh PIC24FJ192GB 67,072 020BFAh: 020BFEh PIC24FJ256GB 87,552 02ABFAh: 02ABFEh 16 8 0 PC Address 000000h 000002h 000004h 000006h 23 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (read as ‘0’) most significant word least significant word Instruction Width 000001h 000003h 000005h 000007h MSW Address (LSW Address)  2009 Microchip Technology Inc. DS39897C-page 41 PIC24FJ256GB110 FAMILY 4.2 Data Address Space The PIC24F core has a separate, 16-bit wide data memory space, addressable as a single linear range. The data space is accessed using two Address Generation Units (AGUs), one each for read and write operations. The data space memory map is shown in Figure 4-3. All Effective Addresses (EAs) in the data memory space are 16 bits wide and point to bytes within the data space. This gives a data space address range of 64 Kbytes or 32K words. The lower half of the data memory space (that is, when EA<15> = 0) is used for implemented memory addresses, while the upper half (EA<15> = 1) is reserved for the program space visibility area (see Section 4.3.3 “Reading Data from Program Memory Using Program Space Visibility”). PIC24FJ256GB110 family devices implement a total of 16 Kbytes of data memory. Should an EA point to a location outside of this area, an all zero word or byte will be returned. 4.2.1 DATA SPACE WIDTH The data memory space is organized in byte-addressable, 16-bit wide blocks. Data is aligned in data memory and registers as 16-bit words, but all data space EAs resolve to bytes. The Least Significant Bytes of each word have even addresses, while the Most Significant Bytes have odd addresses. FIGURE 4-3: DATA SPACE MEMORY MAP FOR PIC24FJ256GB110 FAMILY DEVICES 0000h 07FEh FFFEh LSB MSB LSB Address MSB Address 0001h 07FFh 1FFFh FFFFh 8001h 8000h 7FFFh 0801h 0800h 2001h Near 1FFEh SFR Space SFR Data RAM 2000h 7FFFh Program Space Visibility Area Note: Data memory areas are not shown to scale. 47FEh 4800h 47FFh 4801h Space Data Space Implemented Data RAM Unimplemented Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 42  2009 Microchip Technology Inc. 4.2.2 DATA MEMORY ORGANIZATION AND ALIGNMENT To maintain backward compatibility with PIC® devices and improve data space memory usage efficiency, the PIC24F instruction set supports both word and byte operations. As a consequence of byte accessibility, all Effective Address calculations are internally scaled to step through word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws + 1 for byte operations and Ws + 2 for word operations. Data byte reads will read the complete word which contains the byte, using the LSb of any EA to determine which byte to select. The selected byte is placed onto the LSB of the data path. That is, data memory and registers are organized as two parallel, byte-wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register which matches the byte address. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. If a misaligned read or write is attempted, an address error trap will be generated. If the error occurred on a read, the instruction underway is completed; if it occurred on a write, the instruction will be executed but the write will not occur. In either case, a trap is then executed, allowing the system and/or user to examine the machine state prior to execution of the address Fault. All byte loads into any W register are loaded into the Least Significant Byte. The Most Significant Byte is not modified. A sign-extend instruction (SE) is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, users can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. Although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions operate only on words. 4.2.3 NEAR DATA SPACE The 8-Kbyte area between 0000h and 1FFFh is referred to as the near data space. Locations in this space are directly addressable via a 13-bit absolute address field within all memory direct instructions. The remainder of the data space is addressable indirectly. Additionally, the whole data space is addressable using MOV instructions, which support Memory Direct Addressing with a 16-bit address field. 4.2.4 SFR SPACE The first 2 Kbytes of the near data space, from 0000h to 07FFh, are primarily occupied with Special Function Registers (SFRs). These are used by the PIC24F core and peripheral modules for controlling the operation of the device. SFRs are distributed among the modules that they control and are generally grouped together by module. Much of the SFR space contains unused addresses; these are read as ‘0’. A diagram of the SFR space, showing where SFRs are actually implemented, is shown in Table 4-2. Each implemented area indicates a 32-byte region where at least one address is implemented as an SFR. A complete listing of implemented SFRs, including their addresses, is shown in Tables 4-3 through 4-30. TABLE 4-2: IMPLEMENTED REGIONS OF SFR DATA SPACE SFR Space Address xx00 xx20 xx40 xx60 xx80 xxA0 xxC0 xxE0 000h Core ICN Interrupts — 100h Timers Capture Compare 200h I2C™ UART SPI/UART SPI/I2C SPI UART I/O 300h A/D A/D/CTMU — — — — — — 400h — — — — USB — 500h — — — — — — — — 600h PMP RTC/Comp CRC — PPS — 700h — — System NVM/PMD — — — — Legend: — = No implemented SFRs in this block  2009 Microchip Technology Inc. DS39897C-page 43 PIC24FJ256GB110 FAMILY TABLE 4-3: CPU CORE REGISTERS MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets WREG0 0000 Working Register 0 0000 WREG1 0002 Working Register 1 0000 WREG2 0004 Working Register 2 0000 WREG3 0006 Working Register 3 0000 WREG4 0008 Working Register 4 0000 WREG5 000A Working Register 5 0000 WREG6 000C Working Register 6 0000 WREG7 000E Working Register 7 0000 WREG8 0010 Working Register 8 0000 WREG9 0012 Working Register 9 0000 WREG10 0014 Working Register 10 0000 WREG11 0016 Working Register 11 0000 WREG12 0018 Working Register 12 0000 WREG13 001A Working Register 13 0000 WREG14 001C Working Register 14 0000 WREG15 001E Working Register 15 0800 SPLIM 0020 Stack Pointer Limit Value Register xxxx PCL 002E Program Counter Low Word Register 0000 PCH 0030 — — — — — — — — Program Counter Register High Byte 0000 TBLPAG 0032 — — — — — — — — Table Memory Page Address Register 0000 PSVPAG 0034 — — — — — — — — Program Space Visibility Page Address Register 0000 RCOUNT 0036 Repeat Loop Counter Register xxxx SR 0042 — — — — — — — DC IPL2 IPL1 IPL0 RA N OV Z C 0000 CORCON 0044 — — — — — — — — — — — — IPL3 PSV — — 0000 DISICNT 0052 — — Disable Interrupts Counter Register xxxx Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. PIC24FJ256GB110 FAMILY DS39897C-page 44  2009 Microchip Technology Inc. TABLE 4-4: ICN REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets CNPD1 0054 CN15PDE CN14PDE CN13PDE CN12PDE CN11PDE CN10PDE CN9PDE CN8PDE CN7PDE CN6PDE CN5PDE CN4PDE CN3PDE CN2PDE CN1PDE CN0PDE 0000 CNPD2 0056 CN31PDE CN30PDE CN29PDE CN28PDE CN27PDE CN26PDE CN25PDE CN24PDE CN23PDE CN22PDE CN21PDE(1) CN20PDE(1) CN19PDE(1) CN18PDE CN17PDE CN16PDE 0000 CNPD3 0058 CN47PDE(1) CN46PDE(2) CN45PDE(1) CN44PDE(1) CN43PDE(1) CN42PDE(1) CN41PDE(1) CN40PDE(2) CN39PDE(2) CN38PDE(2) CN37PDE(2) CN36PDE(2) CN35PDE(2) CN34PDE(2) CN33PDE(2) CN32PDE 0000 CNPD4 005A CN63PDE CN62PDE CN61PDE CN60PDE CN59PDE CN58PDE CN57PDE(1) CN56PDE CN55PDE CN54PDE CN53PDE CN52PDE CN51PDE CN50PDE CN49PDE CN48PDE(2) 0000 CNPD5 005C CN79PDE(2) CN78PDE(1) CN77PDE(1) CN76PDE(2) CN75PDE(2) CN74PDE(1) — — CN71PDE CN70PDE(1) CN69PDE CN68PDE CN67PDE(1) CN66PDE(1) CN65PDE CN64PDE 0000 CNPD6(2) 005E — — — — — — — — — — — — — CN82PDE(2) CN81PDE(2) CN80PDE(2) 0000 CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 CNEN2 0062 CN31IE CN30IE CN29IE CN28IE CN27IE CN26IE CN25IE CN24IE CN23IE CN22IE CN21IE(1) CN20IE(1) CN19IE(1) CN18IE CN17IE CN16IE 0000 CNEN3 0064 CN47IE(1) CN46IE(2) CN45IE(1) CN44IE(1) CN43IE(1) CN42IE(1) CN41IE(1) CN40IE(2) CN39IE(2) CN38IE(2) CN37IE(2) CN36IE(2) CN35IE(2) CN34IE(2) CN33IE(2) CN32IE 0000 CNEN4 0066 CN63IE CN62IE CN61IE CN60IE CN59IE CN58IE CN57IE(1) CN56IE CN55IE CN54IE CN53IE CN52IE CN51IE CN50IE CN49IE CN48IE(2) 0000 CNEN5 0068 CN79IE(2) CN78IE(1) CN77IE(1) CN76IE(2) CN75IE(2) CN74IE(1) — — CN71IE CN70IE(1) CN69IE CN68IE CN67IE(1) CN66IE(1) CN65IE CN64IE 0000 CNEN6(2) 006A — — — — — — — — — — — — — CN82IE(2) CN81IE(2) CN80IE(2) 0000 CNPU1 006C CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 CNPU2 006E CN31PUE CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE(1) CN20PUE(1) CN19PUE(1) CN18PUE CN17PUE CN16PUE 0000 CNPU3 0070 CN47PUE(1) CN46PUE(2) CN45PUE(1) CN44PUE(1) CN43PUE(1) CN42PUE(1) CN41PUE(1) CN40PUE(2) CN39PUE(2) CN38PUE(2) CN37PUE(2) CN36PUE(2) CN35PUE(2) CN34PUE(2) CN33PUE(2) CN32PUE 0000 CNPU4 0072 CN63PUE CN62PUE CN61PUE CN60PUE CN59PUE CN58PUE CN57PUE(1) CN56PUE CN55PUE CN54PUE CN53PUE CN52PUE CN51PUE CN50PUE CN49PUE CN48PUE(2) 0000 CNPU5 0074 CN79PUE(2) CN78PUE(1) CN77PUE(1) CN76PUE(2) CN75PUE(2) CN74PUE(1) — — CN71PUE CN70PUE(1) CN69PUE CN68PUE CN67PUE(1) CN66PUE(1) CN65PUE CN64PUE 0000 CNPU6(2) 0076 — — — — — — — — — — — — — CN82PUE(2) CN81PUE(2) CN80PUE(2) 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: Unimplemented on 64-pin devices; read as ‘0’. 2: Unimplemented on 64-pin and 80-pin devices; read as ‘0’.  2009 Microchip Technology Inc. DS39897C-page 45 PIC24FJ256GB110 FAMILY TABLE 4-5: INTERRUPT CONTROLLER REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets INTCON1 0080 NSTDIS — — — — — — — — — — MATHERR ADDRERR STKERR OSCFAIL — 0000 INTCON2 0082 ALTIVT DISI — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 IFS0 0084 — — AD1IF U1TXIF U1RXIF SPI1IF SPF1IF T3IF T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF 0000 IFS1 0086 U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF — IC8IF IC7IF — INT1IF CNIF CMIF MI2C1IF SI2C1IF 0000 IFS2 0088 — — PMPIF OC8IF OC7IF OC6IF OC5IF IC6IF IC5IF IC4IF IC3IF — — — SPI2IF SPF2IF 0000 IFS3 008A — RTCIF — — — — — — — INT4IF INT3IF — — MI2C2IF SI2C2IF — 0000 IFS4 008C — — CTMUIF — — — — LVDIF — — — — CRCIF U2ERIF U1ERIF — 0000 IFS5 008E — — IC9IF OC9IF SPI3IF SPF3IF U4TXIF U4RXIF U4ERIF USB1IF MI2C3IF SI2C3IF U3TXIF U3RXIF U3ERIF — 0000 IEC0 0094 — — AD1IE U1TXIE U1RXIE SPI1IE SPF1IE T3IE T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE 0000 IEC1 0096 U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE — IC8IE IC7IE — INT1IE CNIE CMIE MI2C1IE SI2C1IE 0000 IEC2 0098 — — PMPIE OC8IE OC7IE OC6IE OC5IE IC6IE IC5IE IC4IE IC3IE — — — SPI2IE SPF2IE 0000 IEC3 009A — RTCIE — — — — — — — INT4IE INT3IE — — MI2C2IE SI2C2IE — 0000 IEC4 009C — — CTMUIE — — — — LVDIE — — — — CRCIE U2ERIE U1ERIE — 0000 IEC5 009E — — IC9IE OC9IE SPI3IE SPF3IE U4TXIE U4RXIE U4ERIE USB1IE MI2C3IE SI2C3IE U3TXIE U3RXIE U3ERIE — 0000 IPC0 00A4 — T1IP2 T1IP1 T1IP0 — OC1IP2 OC1IP1 OC1IP0 — IC1IP2 IC1IP1 IC1IP0 — INT0IP2 INT0IP1 INT0IP0 4444 IPC1 00A6 — T2IP2 T2IP1 T2IP0 — OC2IP2 OC2IP1 OC2IP0 — IC2IP2 IC2IP1 IC2IP0 — — — — 4440 IPC2 00A8 — U1RXIP2 U1RXIP1 U1RXIP0 — SPI1IP2 SPI1IP1 SPI1IP0 — SPF1IP2 SPF1IP1 SPF1IP0 — T3IP2 T3IP1 T3IP0 4444 IPC3 00AA — — — — — — — — — AD1IP2 AD1IP1 AD1IP0 — U1TXIP2 U1TXIP1 U1TXIP0 0044 IPC4 00AC — CNIP2 CNIP1 CNIP0 — CMIP2 CMIP1 CMIP0 — MI2C1P2 MI2C1P1 MI2C1P0 — SI2C1P2 SI2C1P1 SI2C1P0 4444 IPC5 00AE — IC8IP2 IC8IP1 IC8IP0 — IC7IP2 IC7IP1 IC7IP0 — — — — — INT1IP2 INT1IP1 INT1IP0 4404 IPC6 00B0 — T4IP2 T4IP1 T4IP0 — OC4IP2 OC4IP1 OC4IP0 — OC3IP2 OC3IP1 OC3IP0 — — — — 4440 IPC7 00B2 — U2TXIP2 U2TXIP1 U2TXIP0 — U2RXIP2 U2RXIP1 U2RXIP0 — INT2IP2 INT2IP1 INT2IP0 — T5IP2 T5IP1 T5IP0 4444 IPC8 00B4 — — — — — — — — — SPI2IP2 SPI2IP1 SPI2IP0 — SPF2IP2 SPF2IP1 SPF2IP0 0044 IPC9 00B6 — IC5IP2 IC5IP1 IC5IP0 — IC4IP2 IC4IP1 IC4IP0 — IC3IP2 IC3IP1 IC3IP0 — — — — 4440 IPC10 00B8 — OC7IP2 OC7IP1 OC7IP0 — OC6IP2 OC6IP1 OC6IP0 — OC5IP2 OC5IP1 OC5IP0 — IC6IP2 IC6IP1 IC6IP0 4444 IPC11 00BA — — — — — — — — — PMPIP2 PMPIP1 PMPIP0 — OC8IP2 OC8IP1 OC8IP0 0044 IPC12 00BC — — — — — MI2C2P2 MI2C2P1 MI2C2P0 — SI2C2P2 SI2C2P1 SI2C2P0 — — — — 0440 IPC13 00BE — — — — — INT4IP2 INT4IP1 INT4IP0 — INT3IP2 INT3IP1 INT3IP0 — — — — 0440 IPC15 00C2 — — — — — RTCIP2 RTCIP1 RTCIP0 — — — — — — — — 0400 IPC16 00C4 — CRCIP2 CRCIP1 CRCIP0 — U2ERIP2 U2ERIP1 U2ERIP0 — U1ERIP2 U1ERIP1 U1ERIP0 — — — — 4440 IPC18 00C8 — — — — — — — — — — — — — LVDIP2 LVDIP1 LVDIP0 0004 IPC19 00CA — — — — — — — — — CTMUIP2 CTMUIP1 CTMUIP0 — — — — 0040 IPC20 00CC — U3TXIP2 U3TXIP1 U3TXIP0 — U3RXIP2 U3RXIP1 U3RXIP0 — U3ERIP2 U3ERIP1 U3ERIP0 — — — — 4440 IPC21 00CE — U4ERIP2 U4ERIP1 U4ERIP0 — USB1IP2 USB1IP1 USB1IP0 — MI2C3P2 MI2C3P1 MI2C3P0 — SI2C3P2 SI2C3P1 SI2C3P0 4444 IPC22 00D0 — SPI3IP2 SPI3IP1 SPI3IP0 — SPF3IP2 SPF3IP1 SPF3IP0 — U4TXIP2 U4TXIP1 U4TXIP0 — U4RXIP2 U4RXIP1 U4RXIP0 4444 IPC23 00D2 — — — — — — — — — IC9IP2 IC9IP1 IC9IP0 — OC9IP2 OC9IP1 OC9IP0 0044 INTTREG 00E0 CPUIRQ — VHOLD — ILR3 ILR2 ILR1 ILR0 — VECNUM6 VECNUM5 VECNUM4 VECNUM3 VECNUM2 VECNUM1 VECNUM0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. PIC24FJ256GB110 FAMILY DS39897C-page 46  2009 Microchip Technology Inc. TABLE 4-6: TIMER REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TMR1 0100 Timer1 Register 0000 PR1 0102 Timer1 Period Register FFFF T1CON 0104 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS — 0000 TMR2 0106 Timer2 Register 0000 TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) 0000 TMR3 010A Timer3 Register 0000 PR2 010C Timer2 Period Register FFFF PR3 010E Timer3 Period Register FFFF T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 TMR4 0114 Timer4 Register 0000 TMR5HLD 0116 Timer5 Holding Register (for 32-bit operations only) 0000 TMR5 0118 Timer5 Register 0000 PR4 011A Timer4 Period Register FFFF PR5 011C Timer5 Period Register FFFF T4CON 011E TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 T5CON 0120 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.  2009 Microchip Technology Inc. DS39897C-page 47 PIC24FJ256GB110 FAMILY TABLE 4-7: INPUT CAPTURE REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets IC1CON1 0140 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC1CON2 0142 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC1BUF 0144 Input Capture 1 Buffer Register 0000 IC1TMR 0146 Timer Value 1 Register xxxx IC2CON1 0148 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC2CON2 014A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC2BUF 014C Input Capture 2 Buffer Register 0000 IC2TMR 014E Timer Value 2 Register xxxx IC3CON1 0150 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC3CON2 0152 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC3BUF 0154 Input Capture 3 Buffer Register 0000 IC3TMR 0156 Timer Value 3 Register xxxx IC4CON1 0158 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC4CON2 015A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC4BUF 015C Input Capture 4 Buffer Register 0000 IC4TMR 015E Timer Value 4 Register xxxx IC5CON1 0160 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC5CON2 0162 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC5BUF 0164 Input Capture 5 Buffer Register 0000 IC5TMR 0166 Timer Value 5 Register xxxx IC6CON1 0168 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC6CON2 016A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC6BUF 016C Input Capture 6 Buffer Register 0000 IC6TMR 016E Timer Value 6 Register xxxx IC7CON1 0170 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC7CON2 0172 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC7BUF 0174 Input Capture 7 Buffer Register 0000 IC7TMR 0176 Timer Value 7 Register xxxx IC8CON1 0178 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC8CON2 017A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC8BUF 017C Input Capture 8 Buffer Register 0000 IC8TMR 017E Timer Value 8 Register xxxx IC9CON1 0180 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000 IC9CON2 0182 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D IC9BUF 0184 Input Capture 9 Buffer Register 0000 IC9TMR 0186 Timer Value 9 Register xxxx Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. PIC24FJ256GB110 FAMILY DS39897C-page 48  2009 Microchip Technology Inc. TABLE 4-8: OUTPUT COMPARE REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets OC1CON1 0190 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC1CON2 0192 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC1RS 0194 Output Compare 1 Secondary Register 0000 OC1R 0196 Output Compare 1 Register 0000 OC1TMR 0198 Timer Value 1 Register xxxx OC2CON1 019A — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC2CON2 019C FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC2RS 019E Output Compare 2 Secondary Register 0000 OC2R 01A0 Output Compare 2 Register 0000 OC2TMR 01A2 Timer Value 2 Register xxxx OC3CON1 01A4 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC3CON2 01A6 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC3RS 01A8 Output Compare 3 Secondary Register 0000 OC3R 01AA Output Compare 3 Register 0000 OC3TMR 01AC Timer Value 3 Register xxxx OC4CON1 01AE — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC4CON2 01B0 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC4RS 01B2 Output Compare 4 Secondary Register 0000 OC4R 01B4 Output Compare 4 Register 0000 OC4TMR 01B6 Timer Value 4 Register xxxx OC5CON1 01B8 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC5CON2 01BA FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC5RS 01BC Output Compare 5 Secondary Register 0000 OC5R 01BE Output Compare 5 Register 0000 OC5TMR 01C0 Timer Value 5 Register xxxx OC6CON1 01C2 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC6CON2 01C4 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC6RS 01C6 Output Compare 6 Secondary Register 0000 OC6R 01C8 Output Compare 6 Register 0000 OC6TMR 01CA Timer Value 6 Register xxxx OC7CON1 01CC — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC7CON2 01CE FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC7RS 01D0 Output Compare 7 Secondary Register 0000 OC7R 01D2 Output Compare 7 Register 0000 OC7TMR 01D4 Timer Value 7 Register xxxx Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.  2009 Microchip Technology Inc. DS39897C-page 49 PIC24FJ256GB110 FAMILY OC8CON1 01D6 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC8CON2 01D8 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC8RS 01DA Output Compare 8 Secondary Register 0000 OC8R 01DC Output Compare 8 Register 0000 OC8TMR 01DE Timer Value 8 Register xxxx OC9CON1 01E0 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — ENFLT0 — — OCFLT0 TRIGMODE OCM2 OCM1 OCM0 0000 OC9CON2 01E2 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C OC9RS 01E4 Output Compare 9 Secondary Register 0000 OC9R 01E6 Output Compare 9 Register 0000 OC9TMR 01E8 Timer Value 9 Register xxxx TABLE 4-8: OUTPUT COMPARE REGISTER MAP (CONTINUED) File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-9: I2C™ REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets I2C1RCV 0200 — — — — — — — — Receive Register 0000 I2C1TRN 0202 — — — — — — — — Transmit Register 00FF I2C1BRG 0204 — — — — — — — Baud Rate Generator Register 0000 I2C1CON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 I2C1STAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000 I2C1ADD 020A — — — — — — Address Register 0000 I2C1MSK 020C — — — — — — Address Mask Register 0000 I2C2RCV 0210 — — — — — — — — Receive Register 0000 I2C2TRN 0212 — — — — — — — — Transmit Register 00FF I2C2BRG 0214 — — — — — — — Baud Rate Generator Register 0000 I2C2CON 0216 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 I2C2STAT 0218 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000 I2C2ADD 021A — — — — — — Address Register 0000 I2C2MSK 021C — — — — — — Address Mask Register 0000 I2C3RCV 0270 — — — — — — — — Receive Register 0000 I2C3TRN 0272 — — — — — — — — Transmit Register 00FF I2C3BRG 0274 — — — — — — — Baud Rate Generator Register 0000 I2C3CON 0276 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 I2C3STAT 0278 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000 I2C3ADD 027A — — — — — — Address Register 0000 I2C3MSK 027C — — — — — — Address Mask Register 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. PIC24FJ256GB110 FAMILY DS39897C-page 50  2009 Microchip Technology Inc. TABLE 4-10: UART REGISTER MAPS File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets U1MODE 0220 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000 U1STA 0222 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110 U1TXREG 0224 — — — — — — — Transmit Register xxxx U1RXREG 0226 — — — — — — — Receive Register 0000 U1BRG 0228 Baud Rate Generator Prescaler Register 0000 U2MODE 0230 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000 U2STA 0232 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110 U2TXREG 0234 — — — — — — — Transmit Register xxxx U2RXREG 0236 — — — — — — — Receive Register 0000 U2BRG 0238 Baud Rate Generator Prescaler Register 0000 U3MODE 0250 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000 U3STA 0252 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110 U3TXREG 0254 — — — — — — — Transmit Register xxxx U3RXREG 0256 — — — — — — — Receive Register 0000 U3BRG 0258 Baud Rate Generator Prescaler Register 0000 U4MODE 02B0 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL 0000 U4STA 02B2 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110 U4TXREG 02B4 — — — — — — — Transmit Register xxxx U4RXREG 02B6 — — — — — — — Receive Register 0000 U4BRG 02B8 Baud Rate Generator Prescaler Register 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-11: SPI REGISTER MAPS File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets SPI1STAT 0240 SPIEN — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000 SPI1CON1 0242 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 SPI1CON2 0244 FRMEN SPIFSD SPIFPOL — — — — — — — — — — — SPIFE SPIBEN 0000 SPI1BUF 0248 Transmit and Receive Buffer 0000 SPI2STAT 0260 SPIEN — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000 SPI2CON1 0262 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 SPI2CON2 0264 FRMEN SPIFSD SPIFPOL — — — — — — — — — — — SPIFE SPIBEN 0000 SPI2BUF 0268 Transmit and Receive Buffer 0000 SPI3STAT 0280 SPIEN — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000 SPI3CON1 0282 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 SPI3CON2 0284 FRMEN SPIFSD SPIFPOL — — — — — — — — — — — SPIFE SPIBEN 0000 SPI3BUF 0288 Transmit and Receive Buffer 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.  2009 Microchip Technology Inc. DS39897C-page 51 PIC24FJ256GB110 FAMILY TABLE 4-12: PORTA REGISTER MAP(1) File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7(2) Bit 6(2) Bit 5(2) Bit 4(2) Bit 3(2) Bit2(2) Bit 1(2) Bit 0(2) All Resets TRISA 02C0 TRISA15 TRISA14 — — — TRISA10 TRISA9 — TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 36FF PORTA 02C2 RA15 RA14 — — — RA10 RA9 — RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx LATA 02C4 LATA15 LATA14 — — — LATA10 LATA9 — LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 xxxx ODCA 02C6 ODA15 ODA14 — — — ODA10 ODA9 — ODA7 ODA6 ODA5 ODA4 ODA3 ODA2 ODA1 ODA0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices. Note 1: PORTA and all associated bits are unimplemented on 64-pin devices and read as ‘0’. Bits are available on 80-pin and 100-pin devices only, unless otherwise noted. 2: Bits are implemented on 100-pin devices only; otherwise read as ‘0’. TABLE 4-13: PORTB REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx ODCB 02CE ODB15 ODB14 ODB13 ODB12 ODB11 ODB10 ODB9 ODB8 ODB7 ODB6 ODB5 ODB4 ODB3 ODB2 ODB1 ODB0 0000 Legend: Reset values are shown in hexadecimal. TABLE 4-14: PORTC REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4(1) Bit 3(2) Bit 2(1) Bit 1(2) Bit 0 All Resets TRISC 02D0 TRISC15 TRISC14 TRISC13 TRISC12 — — — — — — — TRISC4 TRISC3 TRISC2 TRISC1 — F01E PORTC 02D2 RC15(3,4) RC14 RC13 RC12(3) — — — — — — — RC4 RC3 RC2 RC1 — xxxx LATC 02D4 LATC15 LATC14 LATC13 LATC12 — — — — — — — LATC4 LATC3 LATC2 LATC1 — xxxx ODCC 02D6 ODC15 ODC14 ODC13 ODC12 — — — — — — — ODC4 ODC3 ODC2 ODC1 — 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices. Note 1: Bits are unimplemented on 64-pin and 80-pin devices; read as ‘0’. 2: Bits are unimplemented on 64-pin devices; read as ‘0’. 3: RC12 and RC15 are only available when the Primary Oscillator is disabled or when EC mode is selected (POSCMD<1:0> Configuration bits = 11 or 00); otherwise read as ‘0’. 4: RC15 is only available when the POSCMD<1:0> Configuration bits = 11 or 00 and the OSCIOFN Configuration bit = 1. TABLE 4-15: PORTD REGISTER MAP File Name Addr Bit 15(1) Bit 14(1) Bit 13(1) Bit 12(1) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISD 02D8 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 FFFF PORTD 02DA RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx LATD 02DC LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 xxxx ODCD 02DE ODD15 ODD14 ODD13 ODD12 ODD11 ODD10 ODD9 ODD8 ODD7 ODD6 ODD5 ODD4 ODD3 ODD2 ODD1 ODD0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices. Note 1: Bits are unimplemented on 64-pin devices; read as ‘0’. PIC24FJ256GB110 FAMILY DS39897C-page 52  2009 Microchip Technology Inc. TABLE 4-16: PORTE REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9(1) Bit 8(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISE 02E0 — — — — — — TRISE9 TRISE8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 03FF PORTE 02E2 — — — — — — RE9 RE8 RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 xxxx LATE 02E4 — — — — — — LATE9 LATE8 LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 xxxx ODCE 02E6 — — — — — — ODE9 ODE8 ODE7 ODE6 ODE5 ODE4 ODE3 ODE2 ODE1 ODE0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices. Note 1: Bits are unimplemented on 64-pin devices; read as ‘0’. TABLE 4-17: PORTF REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13(1) Bit 12(1) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2(2) Bit 1 Bit 0 All Resets TRISF 02E8 — — TRISF13 TRISF12 — — — — — — TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 31FF PORTF 02EA — — RF13 RF12 — — — — — — RF5 RF4 RF3 RF2 RF1 RF0 xxxx LATF 02EC — — LATF13 LATF12 — — — — — — LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 xxxx ODCF 02EE — — ODF13 ODF12 — — — — — — ODF5 ODF4 ODF3 ODF2 ODF1 ODF0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices. Note 1: Bits are unimplemented on 64-pin and 80-pin devices; read as ‘0’. 2: Bits are unimplemented on 64-pin devices; read as ‘0’. TABLE 4-18: PORTG REGISTER MAP File Name Addr Bit 15(1) Bit 14(1) Bit 13(1) Bit 12(1) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1(2) Bit 0(2) All Resets TRISG 02F0 TRISG15 TRISG14 TRISG13 TRISG12 — — TRISG9 TRISG8 TRISG7 TRISG6 — — TRISG3 TRISG2 TRISG1 TRISG0 F3CF PORTG 02F2 RG15 RG14 RG13 RG12 — — RG9 RG8 RG7 RG6 — — RG3 RG2 RG1 RG0 xxxx LATG 02F4 LATG15 LATG14 LATG13 LATG12 — — LATG9 LATG8 LATG7 LATG6 — — LATG3 LATG2 LATG1 LATG0 xxxx ODCG 02F6 ODG15 ODG14 ODG13 ODG12 — — ODG9 ODG8 ODG7 ODG6 — — ODG3 ODG2 ODG1 ODG0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset values shown are for 100-pin devices. Note 1: Bits unimplemented on 64-pin and 80-pin devices; read as ‘0’. 2: Bits unimplemented on 64-pin devices; read as ‘0’. TABLE 4-19: PAD CONFIGURATION REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets PADCFG1 02FC — — — — — — — — — — — — — — RTSECSEL PMPTTL 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.  2009 Microchip Technology Inc. DS39897C-page 53 PIC24FJ256GB110 FAMILY TABLE 4-20: ADC REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets ADC1BUF0 0300 ADC Data Buffer 0 xxxx ADC1BUF1 0302 ADC Data Buffer 1 xxxx ADC1BUF2 0304 ADC Data Buffer 2 xxxx ADC1BUF3 0306 ADC Data Buffer 3 xxxx ADC1BUF4 0308 ADC Data Buffer 4 xxxx ADC1BUF5 030A ADC Data Buffer 5 xxxx ADC1BUF6 030C ADC Data Buffer 6 xxxx ADC1BUF7 030E ADC Data Buffer 7 xxxx ADC1BUF8 0310 ADC Data Buffer 8 xxxx ADC1BUF9 0312 ADC Data Buffer 9 xxxx ADC1BUFA 0314 ADC Data Buffer 10 xxxx ADC1BUFB 0316 ADC Data Buffer 11 xxxx ADC1BUFC 0318 ADC Data Buffer 12 xxxx ADC1BUFD 031A ADC Data Buffer 13 xxxx ADC1BUFE 031C ADC Data Buffer 14 xxxx ADC1BUFF 031E ADC Data Buffer 15 xxxx AD1CON1 0320 ADON — ADSIDL — — — FORM1 FORM0 SSRC2 SSRC1 SSRC0 — — ASAM SAMP DONE 0000 AD1CON2 0322 VCFG2 VCFG1 VCFG0 r — CSCNA — — BUFS — SMPI3 SMPI2 SMPI1 SMPI0 BUFM ALTS 0000 AD1CON3 0324 ADRC r r SAMC4 SAMC3 SAMC2 SAMC1 SAMC0 ADCS7 ADCS6 ADCS5 ADCS4 ADCS3 ADCS2 ADCS1 ADCS0 0000 AD1CHS 0328 CH0NB — — CH0SB4 CH0SB3 CH0SB2 CH0SB1 CH0SB0 CH0NA — — CH0SA4 CH0SA3 CH0SA2 CH0SA1 CH0SA0 0000 AD1PCFGH 032A — — — — — — — — — — — — — — PCFG17 PCFG16 0000 AD1PCFGL 032C PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 AD1CSSL 0330 CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 Legend: — = unimplemented, read as ‘0’, r = reserved, maintain as ‘0’. Reset values are shown in hexadecimal. TABLE 4-21: CTMU REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets CTMUCON 033C CTMUEN — CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT 0000 CTMUICON 033E ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0 — — — — — — — — 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. PIC24FJ256GB110 FAMILY DS39897C-page 54  2009 Microchip Technology Inc. TABLE 4-22: USB OTG REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets U1OTGIR 0480 — — — — — — — — IDIF T1MSECIF LSTATEIF ACTVIF SESVDIF SESENDIF — VBUSVDIF 0000 U1OTGIE 0482 — — — — — — — — IDIE T1MSECIE LSTATEIE ACTVIE SESVDIE SESENDIE — VBUSVDIE 0000 U1OTGSTAT 0484 — — — — — — — — ID — LSTATE — SESVD SESEND — VBUSVD 0000 U1OTGCON 0486 — — — — — — — — DPPULUP DMPULUP DPPULDWN DMPULDWN VBUSON OTGEN VBUSCHG VBUSDIS 0000 U1PWRC 0488 — — — — — — — — UACTPND — — USLPGRD — — USUSPND USBPWR 0000 U1IR 048A(1) — — — — — — — — STALLIF — RESUMEIF IDLEIF TRNIF SOFIF UERRIF URSTIF 0000 — — — — — — — — STALLIF ATTACHIF(1) RESUMEIF IDLEIF TRNIF SOFIF UERRIF DETACHIF(1) 0000 U1IE 048C(1) — — — — — — — — STALLIE — RESUMEIE IDLEIE TRNIE SOFIE UERRIE URSTIE 0000 — — — — — — — — STALLIE ATTACHIE(1) RESUMEIE IDLEIE TRNIE SOFIE UERRIE DETACHIE(1) 0000 U1EIR 048E(1) — — — — — — — — BTSEF — DMAEF BTOEF DFN8EF CRC16EF CRC5EF PIDEF 0000 — — — — — — — — BTSEF — DMAEF BTOEF DFN8EF CRC16EF EOFEF(1) PIDEF 0000 U1EIE 0490(1) — — — — — — — — BTSEE — DMAEE BTOEE DFN8EE CRC16EE CRC5EE PIDEE 0000 — — — — — — — — BTSEE — DMAEE BTOEE DFN8EE CRC16EE EOFEE(1) PIDEE 0000 U1STAT 0492 — — — — — — — — ENDPT3 ENDPT2 ENDPT1 ENDPT0 DIR PPBI — — 0000 U1CON 0494(1) — — — — — — — — — SE0 PKTDIS — HOSTEN RESUME PPBRST USBEN 0000 — — — — — — — — JSTATE(1) SE0 TOKBUSY RESET HOSTEN RESUME PPBRST SOFEN(1) 0000 U1ADDR 0496 — — — — — — — — LSPDEN(1) USB Device Address (DEVADDR) Register 0000 U1BDTP1 0498 — — — — — — — — Buffer Descriptor Table Base Address Register — 0000 U1FRML 049A — — — — — — — — Frame Count Register Low Byte 0000 U1FRMH 049C — — — — — — — — Frame Count Register High Byte 0000 U1TOK(2) 049E — — — — — — — — PID3 PID2 PID1 PID0 EP3 EP2 EP1 EP0 0000 U1SOF(2) 04A0 — — — — — — — — Start-Of-Frame Count Register 0000 U1CNFG1 04A6 — — — — — — — — UTEYE UOEMON — USBSIDL — — PPB1 PPB0 0000 U1CNFG2 04A8 — — — — — — — — — — — PUVBUS EXTI2CEN UVBUSDIS UVCMPDIS UTRDIS 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: Alternate register or bit definitions when the module is operating in Host mode. 2: This register is available in Host mode only.  2009 Microchip Technology Inc. DS39897C-page 55 PIC24FJ256GB110 FAMILY U1EP0 04AA — — — — — — — — LSPD(1) RETRYDIS(1) — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP1 04AC — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP2 04AE — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP3 04B0 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP4 04B2 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP5 04B4 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP6 04B6 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP7 04B8 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP8 04BA — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP9 04BC — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP10 04BE — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP11 04C0 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP12 04C2 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP13 04C4 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP14 04C6 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1EP15 04C8 — — — — — — — — — — — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000 U1PWMRRS 04CC USB Power Supply PWM Duty Cycle Register USB Power Supply PWM Period Register 0000 U1PWMCON 04CE PWMEN — — — — — PWMPOL CNTEN — — — — — — — — 0000 TABLE 4-23: PARALLEL MASTER/SLAVE PORT REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets PMCON 0600 PMPEN — PSIDL ADRMUX1 ADRMUX0 PTBEEN PTWREN PTRDEN CSF1 CSF0 ALP CS2P CS1P BEP WRSP RDSP 0000 PMMODE 0602 BUSY IRQM1 IRQM0 INCM1 INCM0 MODE16 MODE1 MODE0 WAITB1 WAITB0 WAITM3 WAITM2 WAITM1 WAITM0 WAITE1 WAITE0 0000 PMADDR 0604 CS2 CS1 ADDR13 ADDR12 ADDR11 ADDR10 ADDR9 ADDR8 ADDR7 ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 0000 PMDOUT1 Parallel Port Data Out Register 1 (Buffers 0 and 1) 0000 PMDOUT2 0606 Parallel Port Data Out Register 2 (Buffers 2 and 3) 0000 PMDIN1 0608 Parallel Port Data In Register 1 (Buffers 0 and 1) 0000 PMDIN2 060A Parallel Port Data In Register 2 (Buffers 2 and 3) 0000 PMAEN 060C PTEN15 PTEN14 PTEN13 PTEN12 PTEN11 PTEN10 PTEN9 PTEN8 PTEN7 PTEN6 PTEN5 PTEN4 PTEN3 PTEN2 PTEN1 PTEN0 0000 PMSTAT 060E IBF IBOV — — IB3F IB2F IB1F IB0F OBE OBUF — — OB3E OB2E OB1E OB0E 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-22: USB OTG REGISTER MAP (CONTINUED) File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: Alternate register or bit definitions when the module is operating in Host mode. 2: This register is available in Host mode only. PIC24FJ256GB110 FAMILY DS39897C-page 56  2009 Microchip Technology Inc. TABLE 4-24: REAL-TIME CLOCK AND CALENDAR REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets ALRMVAL 0620 Alarm Value Register Window Based on ALRMPTR<1:0> xxxx ALCFGRPT 0622 ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0 ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0 0000 RTCVAL 0624 RTCC Value Register Window Based on RTCPTR<1:0> xxxx RCFGCAL 0626 RTCEN — RTCWREN RTCSYNC HALFSEC RTCOE RTCPTR1 RTCPTR0 CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 xxxx Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-25: COMPARATORS REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets CMSTAT 0630 CMIDL — — — C3EVT C2EVT C1EVT — — — — — C3OUT C2OUT C1OUT 0000 CVRCON 0632 — — — — — — — — CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 CM1CON 0634 CEN COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 0000 CM2CON 0636 CEN COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 0000 CM3CON 0638 CEN COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-26: CRC REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets CRCCON 0640 — — CSIDL VWORD4 VWORD3 VWORD2 VWORD1 VWORD0 CRCFUL CRCMPT — CRCGO PLEN3 PLEN2 PLEN1 PLEN0 0040 CRCXOR 0642 X15 X14 X13 X12 X11 X10 X9 X8 X7 X6 X5 X4 X3 X2 X1 — 0000 CRCDAT 0644 CRC Data Input Register 0000 CRCWDAT 0646 CRC Result Register 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.  2009 Microchip Technology Inc. DS39897C-page 57 PIC24FJ256GB110 FAMILY TABLE 4-27: PERIPHERAL PIN SELECT REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets RPINR0 0680 — — INT1R5 INT1R4 INT1R3 INT1R2 INT1R1 INT1R0 — — — — — — — — 3F00 RPINR1 0682 — — INT3R5 INT3R4 INT3R3 INT3R2 INT3R1 INT3R0 — — INT2R5 INT2R4 INT2R3 INT2R2 INT2R1 INT2R0 3F3F RPINR2 0684 — — — — — — — — — — INT4R5 INT4R4 INT4R3 INT4R2 INT4R1 INT4R0 003F RPINR3 0686 — — T3CKR5 T3CKR4 T3CKR3 T3CKR2 T3CKR1 T3CKR0 — — T2CKR5 T2CKR4 T2CKR3 T2CKR2 T2CKR1 T2CKR0 3F3F RPINR4 0688 — — T5CKR5 T5CKR4 T5CKR3 T5CKR2 T5CKR1 T5CKR0 — — T4CKR5 T4CKR4 T4CKR3 T4CKR2 T4CKR1 T4CKR0 3F3F RPINR7 068E — — IC2R5 IC2R4 IC2R3 IC2R2 IC2R1 IC2R0 — — IC1R5 IC1R4 IC1R3 IC1R2 IC1R1 IC1R0 3F3F RPINR8 0690 — — IC4R5 IC4R4 IC4R3 IC4R2 IC4R1 IC4R0 — — IC3R5 IC3R4 IC3R3 IC3R2 IC3R1 IC3R0 3F3F RPINR9 0692 — — IC6R5 IC6R4 IC6R3 IC6R2 IC6R1 IC6R0 — — IC5R5 IC5R4 IC5R3 IC5R2 IC5R1 IC5R0 3F3F RPINR10 0694 — — IC8R5 IC8R4 IC8R3 IC8R2 IC8R1 IC8R0 — — IC7R5 IC7R4 IC7R3 IC7R2 IC7R1 IC7R0 3F3F RPINR11 0696 — — OCFBR5 OCFBR4 OCFBR3 OCFBR2 OCFBR1 OCFBR0 — — OCFAR5 OCFAR4 OCFAR3 OCFAR2 OCFAR1 OCFAR0 3F3F RPINR15 069E — — IC9R5 IC9R4 IC9R3 IC9R2 IC9R1 IC9R0 — — — — — — — — 3F00 RPINR17 06A2 — — U3RXR5 U3RXR4 U3RXR3 U3RXR2 U3RXR1 U3RXR0 — — — — — — — — 3F00 RPINR18 06A4 — — U1CTSR5 U1CTSR4 U1CTSR3 U1CTSR2 U1CTSR1 U1CTSR0 — — U1RXR5 U1RXR4 U1RXR3 U1RXR2 U1RXR1 U1RXR0 3F3F RPINR19 06A6 — — U2CTSR5 U2CTSR4 U2CTSR3 U2CTSR2 U2CTSR1 U2CTSR0 — — U2RXR5 U2RXR4 U2RXR3 U2RXR2 U2RXR1 U2RXR0 3F3F RPINR20 06A8 — — SCK1R5 SCK1R4 SCK1R3 SCK1R2 SCK1R1 SCK1R0 — — SDI1R5 SDI1R4 SDI1R3 SDI1R2 SDI1R1 SDI1R0 3F3F RPINR21 06AA — — U3CTSR5 U3CTSR4 U3CTSR3 U3CTSR2 U3CTSR1 U3CTSR0 — — SS1R5 SS1R4 SS1R3 SS1R2 SS1R1 SS1R0 3F3F RPINR22 06AC — — SCK2R5 SCK2R4 SCK2R3 SCK2R2 SCK2R1 SCK2R0 — — SDI2R5 SDI2R4 SDI2R3 SDI2R2 SDI2R1 SDI2R0 3F3F RPINR23 06AE — — — — — — — — — — SS2R5 SS2R4 SS2R3 SS2R2 SS2R1 SS2R0 003F RPINR27 06B6 — — U4CTSR5 U4CTSR4 U4CTSR3 U4CTSR2 U4CTSR1 U4CTSR0 — — U4RXR5 U4RXR4 U4RXR3 U4RXR2 U4RXR1 U4RXR0 3F3F RPINR28 06B8 — — SCK3R5 SCK3R4 SCK3R3 SCK3R2 SCK3R1 SCK3R0 — — SDI3R5 SDI3R4 SDI3R3 SDI3R2 SDI3R1 SDI3R0 3F3F RPINR29 06BA — — — — — — — — — — SS3R5 SS3R4 SS3R3 SS3R2 SS3R1 SS3R0 003F RPOR0 06C0 — — RP1R5 RP1R4 RP1R3 RP1R2 RP1R1 RP1R0 — — RP0R5 RP0R4 RP0R3 RP0R2 RP0R1 RP0R0 0000 RPOR1 06C2 — — RP3R5 RP3R4 RP3R3 RP3R2 RP3R1 RP3R0 — — RP2R5 RP2R4 RP2R3 RP2R2 RP2R1 RP2R0 0000 RPOR2 06C4 — — RP5R5(1) RP5R4(1) RP5R3(1) RP5R2(1) RP5R1(1) RP5R0(1) — — RP4R5 RP4R4 RP4R3 RP4R2 RP4R1 RP4R0 0000 RPOR3 06C6 — — RP7R5 RP7R4 RP7R3 RP7R2 RP7R1 RP7R0 — — RP6R5 RP6R4 RP6R3 RP6R2 RP6R1 RP6R0 0000 RPOR4 06C8 — — RP9R5 RP9R4 RP9R3 RP9R2 RP9R1 RP9R0 — — RP8R5 RP8R4 RP8R3 RP8R2 RP8R1 RP8R0 0000 RPOR5 06CA — — RP11R5 RP11R4 RP11R3 RP11R2 RP11R1 RP11R0 — — RP10R5 RP10R4 RP10R3 RP10R2 RP10R1 RP10R0 0000 RPOR6 06CC — — RP13R5 RP13R4 RP13R3 RP13R2 RP13R1 RP13R0 — — RP12R5 RP12R4 RP12R3 RP12R2 RP12R1 RP12R0 0000 RPOR7 06CE — — RP15R5(1) RP15R4(1) RP15R3(1) RP15R2(1) RP15R1(1) RP15R0(1) — — RP14R5 RP14R4 RP14R3 RP14R2 RP14R1 RP14R0 0000 RPOR8 06D0 — — RP17R5 RP17R4 RP17R3 RP17R2 RP17R1 RP17R0 — — RP16R5 RP16R4 RP16R3 RP16R2 RP16R1 RP16R0 0000 RPOR9 06D2 — — RP19R5 RP19R4 RP19R3 RP19R2 RP19R1 RP19R0 — — RP18R5 RP18R4 RP18R3 RP18R2 RP18R1 RP18R0 0000 RPOR10 06D4 — — RP21R5 RP21R4 RP21R3 RP21R2 RP21R1 RP21R0 — — RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0 0000 RPOR11 06D6 — — RP23R5 RP23R4 RP23R3 RP23R2 RP23R1 RP23R0 — — RP22R5 RP22R4 RP22R3 RP22R2 RP22R1 RP22R0 0000 RPOR12 06D8 — — RP25R5 RP25R4 RP25R3 RP25R2 RP25R1 RP25R0 — — RP24R5 RP24R4 RP24R3 RP24R2 RP24R1 RP24R0 0000 RPOR13 06DA — — RP27R5 RP27R4 RP27R3 RP27R2 RP27R1 RP27R0 — — RP26R5 RP26R4 RP26R3 RP26R2 RP26R1 RP26R0 0000 RPOR14 06DC — — RP29R5 RP29R4 RP29R3 RP29R2 RP29R1 RP29R0 — — RP28R5 RP28R4 RP28R3 RP28R2 RP28R1 RP28R0 0000 RPOR15 06DE — — RP31R5(2) RP31R4(2) RP31R3(2) RP31R2(2) RP31R1(2) RP31R0(2) — — RP30R5 RP30R4 RP30R3 RP30R2 RP30R1 RP30R0 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: Bits are unimplemented on 64-pin devices; read as ‘0’. 2: Bits are unimplemented on 64-pin and 80-pin devices; read as ‘0’. PIC24FJ256GB110 FAMILY DS39897C-page 58  2009 Microchip Technology Inc. TABLE 4-28: SYSTEM REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets RCON 0740 TRAPR IOPUWR — — — — CM PMSLP EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR Note 1 OSCCON 0742 — COSC2 COSC1 COSC0 — NOSC2 NOSC1 NOSC0 CLKLOCK IOLOCK LOCK — CF POSCEN SOSCEN OSWEN Note 2 CLKDIV 0744 ROI DOZE2 DOZE1 DOZE0 DOZEN RCDIV2 RCDIV1 RCDIV0 CPDIV1 CPDIV0 — — — — — — 0100 OSCTUN 0748 — — — — — — — — — — TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 0000 REFOCON 074E ROEN — ROSSLP ROSEL RODIV3 RODIV2 RODIV1 RODIV0 — — — — — — — — 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: The Reset value of the RCON register is dependent on the type of Reset event. See Section 6.0 “Resets” for more information. 2: The Reset value of the OSCCON register is dependent on both the type of Reset event and the device configuration. See Section 8.0 “Oscillator Configuration” for more information. TABLE 4-29: NVM REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets NVMCON 0760 WR WREN WRERR — — — — — — ERASE — — NVMOP3 NVMOP2 NVMOP1 NVMOP0 0000(1) NVMKEY 0766 — — — — — — — — NVMKEY Register<7:0> 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset. TABLE 4-30: PMD REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets PMD1 0770 T5MD T4MD T3MD T2MD T1MD — — — I2C1MD U2MD U1MD SPI2MD SPI1MD — — ADC1MD 0000 PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000 PMD3 0774 — — — — — CMPMD RTCCMD PMPMD CRCMD — — — U3MD I2C3MD I2C2MD — 0000 PMD4 0776 — — — — — — — — — UPWMMD U4MD — REFOMD CTMUMD LVDMD USB1MD 0000 PMD5 0778 — — — — — — — IC9MD — — — — — — — OC9MD 0000 PMD6 077A — — — — — — — — — — — — — — — SPI3MD 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.  2009 Microchip Technology Inc. DS39897C-page 59 PIC24FJ256GB110 FAMILY 4.2.5 SOFTWARE STACK In addition to its use as a working register, the W15 register in PIC24F devices is also used as a Software Stack Pointer. The pointer always points to the first available free word and grows from lower to higher addresses. It pre-decrements for stack pops and post-increments for stack pushes, as shown in Figure 4-4. Note that for a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. The Stack Pointer Limit Value register (SPLIM), associated with the Stack Pointer, sets an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM<0> is forced to ‘0’ because all stack operations must be word-aligned. Whenever an EA is generated using W15 as a source or destination pointer, the resulting address is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal, and a push operation is performed, a stack error trap will not occur. The stack error trap will occur on a subsequent push operation. Thus, for example, if it is desirable to cause a stack error trap when the stack grows beyond address 2000h in RAM, initialize the SPLIM with the value, 1FFEh. Similarly, a Stack Pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0800h. This prevents the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. FIGURE 4-4: CALL STACK FRAME 4.3 Interfacing Program and Data Memory Spaces The PIC24F architecture uses a 24-bit wide program space and 16-bit wide data space. The architecture is also a modified Harvard scheme, meaning that data can also be present in the program space. To use this data successfully, it must be accessed in a way that preserves the alignment of information in both spaces. Aside from normal execution, the PIC24F architecture provides two methods by which program space can be accessed during operation: • Using table instructions to access individual bytes or words anywhere in the program space • Remapping a portion of the program space into the data space (program space visibility) Table instructions allow an application to read or write to small areas of the program memory. This makes the method ideal for accessing data tables that need to be updated from time to time. It also allows access to all bytes of the program word. The remapping method allows an application to access a large block of data on a read-only basis, which is ideal for look ups from a large table of static data. It can only access the least significant word of the program word. 4.3.1 ADDRESSING PROGRAM SPACE Since the address ranges for the data and program spaces are 16 and 24 bits, respectively, a method is needed to create a 23-bit or 24-bit program address from 16-bit data registers. The solution depends on the interface method to be used. For table operations, the 8-bit Table Memory Page Address register (TBLPAG) is used to define a 32K word region within the program space. This is concatenated with a 16-bit EA to arrive at a full 24-bit program space address. In this format, the Most Significant bit of TBLPAG is used to determine if the operation occurs in the user memory (TBLPAG<7> = 0) or the configuration memory (TBLPAG<7> = 1). For remapping operations, the 8-bit Program Space Visibility Page Address register (PSVPAG) is used to define a 16K word page in the program space. When the Most Significant bit of the EA is ‘1’, PSVPAG is concatenated with the lower 15 bits of the EA to form a 23-bit program space address. Unlike table operations, this limits remapping operations strictly to the user memory area. Table 4-31 and Figure 4-5 show how the program EA is created for table operations and remapping accesses from the data EA. Here, P<23:0> refers to a program space word, whereas D<15:0> refers to a data space word. Note: A PC push during exception processing will concatenate the SRL register to the MSB of the PC prior to the push. PC<15:0> 000000000 15 0 W15 (before CALL) W15 (after CALL) Stack Grows Towards Higher Address 0000h PC<22:16> POP : [--W15] PUSH : [W15++] PIC24FJ256GB110 FAMILY DS39897C-page 60  2009 Microchip Technology Inc. TABLE 4-31: PROGRAM SPACE ADDRESS CONSTRUCTION FIGURE 4-5: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Access Type Access Space Program Space Address <23> <22:16> <15> <14:1> <0> Instruction Access (Code Execution) User 0 PC<22:1> 0 0xx xxxx xxxx xxxx xxxx xxx0 TBLRD/TBLWT (Byte/Word Read/Write) User TBLPAG<7:0> Data EA<15:0> 0xxx xxxx xxxx xxxx xxxx xxxx Configuration TBLPAG<7:0> Data EA<15:0> 1xxx xxxx xxxx xxxx xxxx xxxx Program Space Visibility (Block Remap/Read) User 0 PSVPAG<7:0> Data EA<14:0>(1) 0 xxxx xxxx xxx xxxx xxxx xxxx Note 1: Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of the address is PSVPAG<0>. Program Counter 0 23 Bits 1 PSVPAG 8 Bits EA 15 Bits Program Counter(1) Select TBLPAG 8 Bits EA 16 Bits Byte Select 0 0 1/0 User/Configuration Table Operations(2) Program Space Visibility(1) Space Select 24 Bits 23 Bits (Remapping) 1/0 0 Note 1: The LSb of program space addresses is always fixed as ‘0’ in order to maintain word alignment of data in the program and data spaces. 2: Table operations are not required to be word-aligned. Table read operations are permitted in the configuration memory space.  2009 Microchip Technology Inc. DS39897C-page 61 PIC24FJ256GB110 FAMILY 4.3.2 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lower word of any address within the program space without going through data space. The TBLRDH and TBLWTH instructions are the only method to read or write the upper 8 bits of a program space word as data. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two, 16-bit word-wide address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space which contains the least significant data word, and TBLRDH and TBLWTH access the space which contains the upper data byte. Two table instructions are provided to move byte or word-sized (16-bit) data to and from program space. Both function as either byte or word operations. 1. TBLRDL (Table Read Low): In Word mode, it maps the lower word of the program space location (P<15:0>) to a data address (D<15:0>). In Byte mode, either the upper or lower byte of the lower program word is mapped to the lower byte of a data address. The upper byte is selected when byte select is ‘1’; the lower byte is selected when it is ‘0’. 2. TBLRDH (Table Read High): In Word mode, it maps the entire upper word of a program address (P<23:16>) to a data address. Note that D<15:8>, the ‘phantom’ byte, will always be ‘0’. In Byte mode, it maps the upper or lower byte of the program word to D<7:0> of the data address, as above. Note that the data will always be ‘0’ when the upper ‘phantom’ byte is selected (byte select = 1). In a similar fashion, two table instructions, TBLWTH and TBLWTL, are used to write individual bytes or words to a program space address. The details of their operation are explained in Section 5.0 “Flash Program Memory”. For all table operations, the area of program memory space to be accessed is determined by the Table Memory Page Address register (TBLPAG). TBLPAG covers the entire program memory space of the device, including user and configuration spaces. When TBLPAG<7> = 0, the table page is located in the user memory space. When TBLPAG<7> = 1, the page is located in configuration space. FIGURE 4-6: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS Note: Only table read operations will execute in the configuration memory space, and only then, in implemented areas such as the Device ID. Table write operations are not allowed. 23 16 8 0 00000000 00000000 00000000 00000000 ‘Phantom’ Byte TBLRDH.B (Wn<0> = 0) TBLRDL.W TBLRDL.B (Wn<0> = 1) TBLRDL.B (Wn<0> = 0) 23 15 0 TBLPAG 02 000000h 800000h 020000h 030000h Program Space Data EA<15:0> The address for the table operation is determined by the data EA within the page defined by the TBLPAG register. Only read operations are shown; write operations are also valid in the user memory area. PIC24FJ256GB110 FAMILY DS39897C-page 62  2009 Microchip Technology Inc. 4.3.3 READING DATA FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word page of the program space. This provides transparent access of stored constant data from the data space without the need to use special instructions (i.e., TBLRDL/H). Program space access through the data space occurs if the Most Significant bit of the data space EA is ‘1’, and program space visibility is enabled by setting the PSV bit in the CPU Control register (CORCON<2>). The location of the program memory space to be mapped into the data space is determined by the Program Space Visibility Page Address register (PSVPAG). This 8-bit register defines any one of 256 possible pages of 16K words in program space. In effect, PSVPAG functions as the upper 8 bits of the program memory address, with the 15 bits of the EA functioning as the lower bits. Note that by incrementing the PC by 2 for each program memory word, the lower 15 bits of data space addresses directly map to the lower 15 bits in the corresponding program space addresses. Data reads to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. Although each data space address, 8000h and higher, maps directly into a corresponding program memory address (see Figure 4-7), only the lower 16 bits of the 24-bit program word are used to contain the data. The upper 8 bits of any program space locations used as data should be programmed with ‘1111 1111’ or ‘0000 0000’ to force a NOP. This prevents possible issues should the area of code ever be accidentally executed. For operations that use PSV and are executed outside a REPEAT loop, the MOV and MOV.D instructions will require one instruction cycle in addition to the specified execution time. All other instructions will require two instruction cycles in addition to the specified execution time. For operations that use PSV which are executed inside a REPEAT loop, there will be some instances that require two instruction cycles in addition to the specified execution time of the instruction: • Execution in the first iteration • Execution in the last iteration • Execution prior to exiting the loop due to an interrupt • Execution upon re-entering the loop after an interrupt is serviced Any other iteration of the REPEAT loop will allow the instruction accessing data, using PSV, to execute in a single cycle. FIGURE 4-7: PROGRAM SPACE VISIBILITY OPERATION Note: PSV access is temporarily disabled during table reads/writes. PSVPAG 23 15 0 Program Space Data Space 0000h 8000h FFFFh 02 000000h 800000h 010000h 018000h When CORCON<2> = 1 and EA<15> = 1: PSV Area The data in the page designated by PSVPAG is mapped into the upper half of the data memory space.... Data EA<14:0> ...while the lower 15 bits of the EA specify an exact address within the PSV area. This corresponds exactly to the same lower 15 bits of the actual program space address.  2009 Microchip Technology Inc. DS39897C-page 63 PIC24FJ256GB110 FAMILY 5.0 FLASH PROGRAM MEMORY The PIC24FJ256GB110 family of devices contains internal Flash program memory for storing and executing application code. It can be programmed in four ways: • In-Circuit Serial Programming™ (ICSP™) • Run-Time Self-Programming (RTSP) • JTAG • Enhanced In-Circuit Serial Programming (Enhanced ICSP) ICSP allows a PIC24FJ256GB110 family device to be serially programmed while in the end application circuit. This is simply done with two lines for the programming clock and programming data (which are named PGECx and PGEDx, respectively), and three other lines for power (VDD), ground (VSS) and Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user may write program memory data in blocks of 64 instructions (192 bytes) at a time, and erase program memory in blocks of 512 instructions (1536 bytes) at a time. 5.1 Table Instructions and Flash Programming Regardless of the method used, all programming of Flash memory is done with the table read and table write instructions. These allow direct read and write access to the program memory space from the data memory while the device is in normal operating mode. The 24-bit target address in the program memory is formed using the TBLPAG<7:0> bits and the Effective Address (EA) from a W register specified in the table instruction, as shown in Figure 5-1. The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in both Word and Byte modes. The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can also access program memory in Word or Byte mode. FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 4. “Program Memory” (DS39715). Program Counter 0 24 Bits Program TBLPAG Reg 8 Bits Working Reg EA 16 Bits Using Byte 24-Bit EA 0 1/0 Select Table Instruction Counter Using User/Configuration Space Select PIC24FJ256GB110 FAMILY DS39897C-page 64  2009 Microchip Technology Inc. 5.2 RTSP Operation The PIC24F Flash program memory array is organized into rows of 64 instructions or 192 bytes. RTSP allows the user to erase blocks of eight rows (512 instructions) at a time and to program one row at a time. It is also possible to program single words. The 8-row erase blocks and single row write blocks are edge-aligned, from the beginning of program memory, on boundaries of 1536 bytes and 192 bytes, respectively. When data is written to program memory using TBLWT instructions, the data is not written directly to memory. Instead, data written using table writes is stored in holding latches until the programming sequence is executed. Any number of TBLWT instructions can be executed and a write will be successfully performed. However, 64 TBLWT instructions are required to write the full row of memory. To ensure that no data is corrupted during a write, any unused addresses should be programmed with FFFFFFh. This is because the holding latches reset to an unknown state, so if the addresses are left in the Reset state, they may overwrite the locations on rows which were not rewritten. The basic sequence for RTSP programming is to set up a Table Pointer, then do a series of TBLWT instructions to load the buffers. Programming is performed by setting the control bits in the NVMCON register. Data can be loaded in any order and the holding registers can be written to multiple times before performing a write operation. Subsequent writes, however, will wipe out any previous writes. All of the table write operations are single-word writes (2 instruction cycles), because only the buffers are written. A programming cycle is required for programming each row. 5.3 JTAG Operation The PIC24F family supports JTAG boundary scan. Boundary scan can improve the manufacturing process by verifying pin-to-PCB connectivity. 5.4 Enhanced In-Circuit Serial Programming Enhanced In-Circuit Serial Programming uses an on-board bootloader, known as the program executive, to manage the programming process. Using an SPI data frame format, the program executive can erase, program and verify program memory. For more information on Enhanced ICSP, see the device programming specification. 5.5 Control Registers There are two SFRs used to read and write the program Flash memory: NVMCON and NVMKEY. The NVMCON register (Register 5-1) controls which blocks are to be erased, which memory type is to be programmed and when the programming cycle starts. NVMKEY is a write-only register that is used for write protection. To start a programming or erase sequence, the user must consecutively write 55h and AAh to the NVMKEY register. Refer to Section 5.6 “Programming Operations” for further details. 5.6 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. During a programming or erase operation, the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>) starts the operation and the WR bit is automatically cleared when the operation is finished. Note: Writing to a location multiple times without erasing is not recommended.  2009 Microchip Technology Inc. DS39897C-page 65 PIC24FJ256GB110 FAMILY REGISTER 5-1: NVMCON: FLASH MEMORY CONTROL REGISTER R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0 WR WREN WRERR — — — — — bit 15 bit 8 U-0 R/W-0(1) U-0 U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1) — ERASE — — NVMOP3(2) NVMOP2(2) NVMOP1(2) NVMOP0(2) bit 7 bit 0 Legend: SO = Settable Only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 WR: Write Control bit(1) 1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. 0 = Program or erase operation is complete and inactive bit 14 WREN: Write Enable bit(1) 1 = Enable Flash program/erase operations 0 = Inhibit Flash program/erase operations bit 13 WRERR: Write Sequence Error Flag bit(1) 1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically on any set attempt of the WR bit) 0 = The program or erase operation completed normally bit 12-7 Unimplemented: Read as ‘0’ bit 6 ERASE: Erase/Program Enable bit(1) 1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command 0 = Perform the program operation specified by NVMOP<3:0> on the next WR command bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 NVMOP<3:0>: NVM Operation Select bits(1,2) 1111 = Memory bulk erase operation (ERASE = 1) or no operation (ERASE = 0)(3) 0011 = Memory word program operation (ERASE = 0) or no operation (ERASE = 1) 0010 = Memory page erase operation (ERASE = 1) or no operation (ERASE = 0) 0001 = Memory row program operation (ERASE = 0) or no operation (ERASE = 1) Note 1: These bits can only be reset on POR. 2: All other combinations of NVMOP<3:0> are unimplemented. 3: Available in ICSP™ mode only. Refer to device programming specification. PIC24FJ256GB110 FAMILY DS39897C-page 66  2009 Microchip Technology Inc. 5.6.1 PROGRAMMING ALGORITHM FOR FLASH PROGRAM MEMORY The user can program one row of Flash program memory at a time. To do this, it is necessary to erase the 8-row erase block containing the desired row. The general process is: 1. Read eight rows of program memory (512 instructions) and store in data RAM. 2. Update the program data in RAM with the desired new data. 3. Erase the block (see Example 5-1 for an implementation in assembler): a) Set the NVMOP bits (NVMCON<3:0>) to ‘0010’ to configure for block erase. Set the ERASE (NVMCON<6>) and WREN (NVMCON<14>) bits. b) Write the starting address of the block to be erased into the TBLPAG and W registers. c) Write 55h to NVMKEY. d) Write AAh to NVMKEY. e) Set the WR bit (NVMCON<15>). The erase cycle begins and the CPU stalls for the duration of the erase cycle. When the erase is done, the WR bit is cleared automatically. 4. Write the first 64 instructions from data RAM into the program memory buffers (see Example 5-3 for the implementation in assembler). 5. Write the program block to Flash memory: a) Set the NVMOP bits to ‘0001’ to configure for row programming. Clear the ERASE bit and set the WREN bit. b) Write 55h to NVMKEY. c) Write AAh to NVMKEY. d) Set the WR bit. The programming cycle begins and the CPU stalls for the duration of the write cycle. When the write to Flash memory is done, the WR bit is cleared automatically. 6. Repeat steps 4 and 5, using the next available 64 instructions from the block in data RAM by incrementing the value in TBLPAG, until all 512 instructions are written back to Flash memory. For protection against accidental operations, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs, as shown in Example 5-5. EXAMPLE 5-1: ERASING A PROGRAM MEMORY BLOCK (ASSEMBLY LANGUAGE CODE) Note: The equivalent C code for these steps, prepared using Microchip’s MPLAB C30 compiler and specific library of built-in hardware functions, is shown in Examples 5-2, 5-4 and 5-6. ; Set up NVMCON for block erase operation MOV #0x4042, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR), W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #tbloffset(PROG_ADDR), W0 ; Initialize in-page EA[15:0] pointer TBLWTL W0, [W0] ; Set base address of erase block DISI #5 ; Block all interrupts with priority <7 ; for next 5 instructions MOV #0x55, W0 MOV W0, NVMKEY ; Write the 55 key MOV #0xAA, W1 ; MOV W1, NVMKEY ; Write the AA key BSET NVMCON, #WR ; Start the erase sequence NOP ; Insert two NOPs after the erase NOP ; command is asserted  2009 Microchip Technology Inc. DS39897C-page 67 PIC24FJ256GB110 FAMILY EXAMPLE 5-2: ERASING A PROGRAM MEMORY BLOCK (C LANGUAGE CODE) EXAMPLE 5-3: LOADING THE WRITE BUFFERS (ASSEMBLY LANGUAGE CODE) // C example using MPLAB C30 unsigned long progAddr = 0xXXXXXX; // Address of row to write unsigned int offset; //Set up pointer to the first memory location to be written TBLPAG = progAddr>>16; // Initialize PM Page Boundary SFR offset = progAddr & 0xFFFF; // Initialize lower word of address __builtin_tblwtl(offset, 0x0000); // Set base address of erase block // with dummy latch write NVMCON = 0x4042; // Initialize NVMCON asm("DISI #5"); // Block all interrupts with priority <7 // for next 5 instructions __builtin_write_NVM(); // C30 function to perform unlock // sequence and set WR ; Set up NVMCON for row programming operations MOV #0x4001, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000, W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #0x6000, W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0, W2 ; MOV #HIGH_BYTE_0, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 1st_program_word MOV #LOW_WORD_1, W2 ; MOV #HIGH_BYTE_1, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2, W2 ; MOV #HIGH_BYTE_2, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch • • • ; 63rd_program_word MOV #LOW_WORD_31, W2 ; MOV #HIGH_BYTE_31, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0] ; Write PM high byte into program latch PIC24FJ256GB110 FAMILY DS39897C-page 68  2009 Microchip Technology Inc. EXAMPLE 5-4: LOADING THE WRITE BUFFERS (C LANGUAGE CODE) EXAMPLE 5-5: INITIATING A PROGRAMMING SEQUENCE (ASSEMBLY LANGUAGE CODE) EXAMPLE 5-6: INITIATING A PROGRAMMING SEQUENCE (C LANGUAGE CODE) // C example using MPLAB C30 #define NUM_INSTRUCTION_PER_ROW 64 unsigned int offset; unsigned int i; unsigned long progAddr = 0xXXXXXX; // Address of row to write unsigned int progData[2*NUM_INSTRUCTION_PER_ROW]; // Buffer of data to write //Set up NVMCON for row programming NVMCON = 0x4001; // Initialize NVMCON //Set up pointer to the first memory location to be written TBLPAG = progAddr>>16; // Initialize PM Page Boundary SFR offset = progAddr & 0xFFFF; // Initialize lower word of address //Perform TBLWT instructions to write necessary number of latches for(i=0; i < 2*NUM_INSTRUCTION_PER_ROW; i++) { __builtin_tblwtl(offset, progData[i++]); // Write to address low word __builtin_tblwth(offset, progData[i]); // Write to upper byte offset = offset + 2; // Increment address } DISI #5 ; Block all interrupts with priority <7 ; for next 5 instructions MOV #0x55, W0 MOV W0, NVMKEY ; Write the 55 key MOV #0xAA, W1 ; MOV W1, NVMKEY ; Write the AA key BSET NVMCON, #WR ; Start the erase sequence NOP ; NOP ; BTSC NVMCON, #15 ; and wait for it to be BRA $-2 ; completed // C example using MPLAB C30 asm("DISI #5"); // Block all interrupts with priority < 7 // for next 5 instructions __builtin_write_NVM(); // Perform unlock sequence and set WR  2009 Microchip Technology Inc. DS39897C-page 69 PIC24FJ256GB110 FAMILY 5.6.2 PROGRAMMING A SINGLE WORD OF FLASH PROGRAM MEMORY If a Flash location has been erased, it can be programmed using table write instructions to write an instruction word (24-bit) into the write latch. The TBLPAG register is loaded with the 8 Most Significant Bytes of the Flash address. The TBLWTL and TBLWTH instructions write the desired data into the write latches and specify the lower 16 bits of the program memory address to write to. To configure the NVMCON register for a word write, set the NVMOP bits (NVMCON<3:0>) to ‘0011’. The write is performed by executing the unlock sequence and setting the WR bit, as shown in Example 5-7. An equivalent procedure in C, using the MPLAB C30 compiler and built-in hardware functions, is shown in Example 5-8. EXAMPLE 5-7: PROGRAMMING A SINGLE WORD OF FLASH PROGRAM MEMORY (ASSEMBLY LANGUAGE CODE) EXAMPLE 5-8: PROGRAMMING A SINGLE WORD OF FLASH PROGRAM MEMORY (C LANGUAGE CODE) ; Setup a pointer to data Program Memory MOV #tblpage(PROG_ADDR), W0 ; MOV W0, TBLPAG ;Initialize PM Page Boundary SFR MOV #tbloffset(PROG_ADDR), W0 ;Initialize a register with program memory address MOV #LOW_WORD, W2 ; MOV #HIGH_BYTE, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; Setup NVMCON for programming one word to data Program Memory MOV #0x4003, W0 ; MOV W0, NVMCON ; Set NVMOP bits to 0011 DISI #5 ; Disable interrupts while the KEY sequence is written MOV #0x55, W0 ; Write the key sequence MOV W0, NVMKEY MOV #0xAA, W0 MOV W0, NVMKEY BSET NVMCON, #WR ; Start the write cycle NOP ; Insert two NOPs after the erase NOP ; Command is asserted // C example using MPLAB C30 unsigned int offset; unsigned long progAddr = 0xXXXXXX; // Address of word to program unsigned int progDataL = 0xXXXX; // Data to program lower word unsigned char progDataH = 0xXX; // Data to program upper byte //Set up NVMCON for word programming NVMCON = 0x4003; // Initialize NVMCON //Set up pointer to the first memory location to be written TBLPAG = progAddr>>16; // Initialize PM Page Boundary SFR offset = progAddr & 0xFFFF; // Initialize lower word of address //Perform TBLWT instructions to write latches __builtin_tblwtl(offset, progDataL); // Write to address low word __builtin_tblwth(offset, progDataH); // Write to upper byte asm(“DISI #5”); // Block interrupts with priority < 7 // for next 5 instructions __builtin_write_NVM(); // C30 function to perform unlock // sequence and set WR PIC24FJ256GB110 FAMILY DS39897C-page 70  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 71 PIC24FJ256GB110 FAMILY 6.0 RESETS The Reset module combines all Reset sources and controls the device Master Reset Signal, SYSRST. The following is a list of device Reset sources: • POR: Power-on Reset • MCLR: Pin Reset • SWR: RESET Instruction • WDT: Watchdog Timer Reset • BOR: Brown-out Reset • CM: Configuration Mismatch Reset • TRAPR: Trap Conflict Reset • IOPUWR: Illegal Opcode Reset • UWR: Uninitialized W Register Reset A simplified block diagram of the Reset module is shown in Figure 6-1. Any active source of Reset will make the SYSRST signal active. Many registers associated with the CPU and peripherals are forced to a known Reset state. Most registers are unaffected by a Reset; their status is unknown on POR and unchanged by all other Resets. All types of device Reset will set a corresponding status bit in the RCON register to indicate the type of Reset (see Register 6-1). A Power-on Reset will clear all bits, except for the BOR and POR bits (RCON<1:0>), which are set. The user may set or clear any bit at any time during code execution. The RCON bits only serve as status bits. Setting a particular Reset status bit in software will not cause a device Reset to occur. The RCON register also has other bits associated with the Watchdog Timer and device power-saving states. The function of these bits is discussed in other sections of this manual. FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 7. “Reset” (DS39712). Note: Refer to the specific peripheral or CPU section of this manual for register Reset states. Note: The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset will be meaningful. MCLR VDD VDD Rise Detect POR Sleep or Idle Brown-out Reset Enable Voltage Regulator RESET Instruction WDT Module Glitch Filter BOR Trap Conflict Illegal Opcode Uninitialized W Register SYSRST Configuration Mismatch PIC24FJ256GB110 FAMILY DS39897C-page 72  2009 Microchip Technology Inc. REGISTER 6-1: RCON: RESET CONTROL REGISTER(1) R/W-0, HS R/W-0, HS U-0 U-0 U-0 U-0 R/W-0, HS R/W-0 TRAPR IOPUWR — — — — CM PMSLP bit 15 bit 8 R/W-0, HS R/W-0, HS R/W-0 R/W-0, HS R/W-0, HS R/W-0, HS R/W-1, HS R/W-1, HS EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR bit 7 bit 0 Legend: HS = Hardware settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TRAPR: Trap Reset Flag bit 1 = A Trap Conflict Reset has occurred 0 = A Trap Conflict Reset has not occurred bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit 1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an Address Pointer caused a Reset 0 = An illegal opcode or uninitialized W Reset has not occurred bit 13-10 Unimplemented: Read as ‘0’ bit 9 CM: Configuration Word Mismatch Reset Flag bit 1 = A Configuration Word Mismatch Reset has occurred 0 = A Configuration Word Mismatch Reset has not occurred bit 8 PMSLP: Program Memory Power During Sleep bit 1 = Program memory bias voltage remains powered during Sleep. 0 = Program memory bias voltage is powered down during Sleep and voltage regulator enters Standby mode. bit 7 EXTR: External Reset (MCLR) Pin bit 1 = A Master Clear (pin) Reset has occurred 0 = A Master Clear (pin) Reset has not occurred bit 6 SWR: Software Reset (Instruction) Flag bit 1 = A RESET instruction has been executed 0 = A RESET instruction has not been executed bit 5 SWDTEN: Software Enable/Disable of WDT bit(2) 1 = WDT is enabled 0 = WDT is disabled bit 4 WDTO: Watchdog Timer Time-out Flag bit 1 = WDT time-out has occurred 0 = WDT time-out has not occurred bit 3 SLEEP: Wake From Sleep Flag bit 1 = Device has been in Sleep mode 0 = Device has not been in Sleep mode bit 2 IDLE: Wake-up From Idle Flag bit 1 = Device has been in Idle mode 0 = Device has not been in Idle mode bit 1 BOR: Brown-out Reset Flag bit 1 = A Brown-out Reset has occurred. Note that BOR is also set after a Power-on Reset. 0 = A Brown-out Reset has not occurred bit 0 POR: Power-on Reset Flag bit 1 = A Power-up Reset has occurred 0 = A Power-up Reset has not occurred Note 1: All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not cause a device Reset. 2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting.  2009 Microchip Technology Inc. DS39897C-page 73 PIC24FJ256GB110 FAMILY TABLE 6-1: RESET FLAG BIT OPERATION 6.1 Clock Source Selection at Reset If clock switching is enabled, the system clock source at device Reset is chosen as shown in Table 6-2. If clock switching is disabled, the system clock source is always selected according to the oscillator Configuration bits. Refer to Section 8.0 “Oscillator Configuration” for further details. TABLE 6-2: OSCILLATOR SELECTION vs. TYPE OF RESET (CLOCK SWITCHING ENABLED) 6.2 Device Reset Times The Reset times for various types of device Reset are summarized in Table 6-3. Note that the system Reset signal, SYSRST, is released after the POR and PWRT delay times expire. The time at which the device actually begins to execute code will also depend on the system oscillator delays, which include the Oscillator Start-up Timer (OST) and the PLL lock time. The OST and PLL lock times occur in parallel with the applicable SYSRST delay times. The FSCM delay determines the time at which the FSCM begins to monitor the system clock source after the SYSRST signal is released. Flag Bit Setting Event Clearing Event TRAPR (RCON<15>) Trap Conflict Event POR IOPUWR (RCON<14>) Illegal Opcode or Uninitialized W Register Access POR CM (RCON<9>) Configuration Mismatch Reset POR EXTR (RCON<7>) MCLR Reset POR SWR (RCON<6>) RESET Instruction POR WDTO (RCON<4>) WDT Time-out PWRSAV Instruction, POR SLEEP (RCON<3>) PWRSAV #SLEEP Instruction POR IDLE (RCON<2>) PWRSAV #IDLE Instruction POR BOR (RCON<1>) POR, BOR — POR (RCON<0>) POR — Note: All Reset flag bits may be set or cleared by the user software. Reset Type Clock Source Determinant POR FNOSC Configuration bits BOR (CW2<10:8>) MCLR COSC Control bits WDTO (OSCCON<14:12>) SWR PIC24FJ256GB110 FAMILY DS39897C-page 74  2009 Microchip Technology Inc. TABLE 6-3: RESET DELAY TIMES FOR VARIOUS DEVICE RESETS Reset Type Clock Source SYSRST Delay System Clock Delay Notes POR(6) EC TPOR + TPWRT — 1, 2 FRC, FRCDIV TPOR + TPWRT TFRC 1, 2, 3, 6 LPRC TPOR + TPWRT TLPRC 1, 2, 3 ECPLL TPOR + TPWRT TLOCK 1, 2, 4 FRCPLL TPOR + TPWRT TFRC + TLOCK 1, 2, 3, 4 XT, HS, SOSC TPOR+ TPWRT TOST 1, 2, 5 XTPLL, HSPLL TPOR + TPWRT TOST + TLOCK 1, 2, 4, 5 BOR EC TPWRT — 2 FRC, FRCDIV TPWRT TFRC 2, 3, 6 LPRC TPWRT TLPRC 2, 3 ECPLL TPWRT TLOCK 2, 4 FRCPLL TPWRT TFRC + TLOCK 2, 3, 4 XT, HS, SOSC TPWRT TOST 2, 5 XTPLL, HSPLL TPWRT TFRC + TLOCK 2, 3, 4 All Others Any Clock — — — Note 1: TPOR = Power-on Reset delay. 2: TPWRT = 64 ms nominal if regulator is disabled (ENVREG tied to VSS). 3: TFRC and TLPRC = RC Oscillator start-up times. 4: TLOCK = PLL lock time. 5: TOST = Oscillator Start-up Timer (OST). A 10-bit counter waits 1024 oscillator periods before releasing oscillator clock to the system. 6: If Two-Speed Start-up is enabled, regardless of the Primary Oscillator selected, the device starts with FRC, and in such cases, FRC start-up time is valid. Note: For detailed operating frequency and timing specifications, see Section 29.0 “Electrical Characteristics”.  2009 Microchip Technology Inc. DS39897C-page 75 PIC24FJ256GB110 FAMILY 6.2.1 POR AND LONG OSCILLATOR START-UP TIMES The oscillator start-up circuitry and its associated delay timers are not linked to the device Reset delays that occur at power-up. Some crystal circuits (especially low-frequency crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible after SYSRST is released: • The oscillator circuit has not begun to oscillate. • The Oscillator Start-up Timer has not expired (if a crystal oscillator is used). • The PLL has not achieved a lock (if PLL is used). The device will not begin to execute code until a valid clock source has been released to the system. Therefore, the oscillator and PLL start-up delays must be considered when the Reset delay time must be known. 6.2.2 FAIL-SAFE CLOCK MONITOR (FSCM) AND DEVICE RESETS If the FSCM is enabled, it will begin to monitor the system clock source when SYSRST is released. If a valid clock source is not available at this time, the device will automatically switch to the FRC Oscillator and the user can switch to the desired crystal oscillator in the Trap Service Routine. 6.3 Special Function Register Reset States Most of the Special Function Registers (SFRs) associated with the PIC24F CPU and peripherals are reset to a particular value at a device Reset. The SFRs are grouped by their peripheral or CPU function and their Reset values are specified in each section of this manual. The Reset value for each SFR does not depend on the type of Reset, with the exception of four registers. The Reset value for the Reset Control register, RCON, will depend on the type of device Reset. The Reset value for the Oscillator Control register, OSCCON, will depend on the type of Reset and the programmed values of the FNOSC bits in Flash Configuration Word 2 (CW2) (see Table 6-2). The RCFGCAL and NVMCON registers are only affected by a POR. PIC24FJ256GB110 FAMILY DS39897C-page 76  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 77 PIC24FJ256GB110 FAMILY 7.0 INTERRUPT CONTROLLER The PIC24F interrupt controller reduces the numerous peripheral interrupt request signals to a single interrupt request signal to the PIC24F CPU. It has the following features: • Up to 8 processor exceptions and software traps • 7 user-selectable priority levels • Interrupt Vector Table (IVT) with up to 118 vectors • A unique vector for each interrupt or exception source • Fixed priority within a specified user priority level • Alternate Interrupt Vector Table (AIVT) for debug support • Fixed interrupt entry and return latencies 7.1 Interrupt Vector Table The Interrupt Vector Table (IVT) is shown in Figure 7-1. The IVT resides in program memory, starting at location 000004h. The IVT contains 126 vectors, consisting of 8 non-maskable trap vectors, plus up to 118 sources of interrupt. In general, each interrupt source has its own vector. Each interrupt vector contains a 24-bit wide address. The value programmed into each interrupt vector location is the starting address of the associated Interrupt Service Routine (ISR). Interrupt vectors are prioritized in terms of their natural priority; this is linked to their position in the vector table. All other things being equal, lower addresses have a higher natural priority. For example, the interrupt associated with vector 0 will take priority over interrupts at any other vector address. PIC24FJ256GB110 family devices implement non-maskable traps and unique interrupts. These are summarized in Table 7-1 and Table 7-2. 7.1.1 ALTERNATE INTERRUPT VECTOR TABLE The Alternate Interrupt Vector Table (AIVT) is located after the IVT, as shown in Figure 7-1. Access to the AIVT is provided by the ALTIVT control bit (INTCON2<15>). If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not needed, the AIVT should be programmed with the same addresses used in the IVT. 7.2 Reset Sequence A device Reset is not a true exception because the interrupt controller is not involved in the Reset process. The PIC24F devices clear their registers in response to a Reset which forces the PC to zero. The microcontroller then begins program execution at location 000000h. The user programs a GOTO instruction at the Reset address, which redirects program execution to the appropriate start-up routine. Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 8. “Interrupts” (DS39707). Note: Any unimplemented or unused vector locations in the IVT and AIVT should be programmed with the address of a default interrupt handler routine that contains a RESET instruction. PIC24FJ256GB110 FAMILY DS39897C-page 78  2009 Microchip Technology Inc. FIGURE 7-1: PIC24F INTERRUPT VECTOR TABLE TABLE 7-1: TRAP VECTOR DETAILS Vector Number IVT Address AIVT Address Trap Source 0 000004h 000104h Reserved 1 000006h 000106h Oscillator Failure 2 000008h 000108h Address Error 3 00000Ah 00010Ah Stack Error 4 00000Ch 00010Ch Math Error 5 00000Eh 00010Eh Reserved 6 000010h 000110h Reserved 7 000012h 000112h Reserved Reset – GOTO Instruction 000000h Reset – GOTO Address 000002h Reserved 000004h Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 000014h Interrupt Vector 1 ——— Interrupt Vector 52 00007Ch Interrupt Vector 53 00007Eh Interrupt Vector 54 000080h ——— Interrupt Vector 116 0000FCh Interrupt Vector 117 0000FEh Reserved 000100h Reserved 000102h Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 000114h Interrupt Vector 1 ——— Interrupt Vector 52 00017Ch Interrupt Vector 53 00017Eh Interrupt Vector 54 000180h ——— Interrupt Vector 116 Interrupt Vector 117 0001FEh Start of Code 000200h Decreasing Natural Order Priority Interrupt Vector Table (IVT)(1) Alternate Interrupt Vector Table (AIVT)(1) Note 1: See Table 7-2 for the interrupt vector list.  2009 Microchip Technology Inc. DS39897C-page 79 PIC24FJ256GB110 FAMILY TABLE 7-2: IMPLEMENTED INTERRUPT VECTORS Interrupt Source Vector Number IVT Address AIVT Address Interrupt Bit Locations Flag Enable Priority ADC1 Conversion Done 13 00002Eh 00012Eh IFS0<13> IEC0<13> IPC3<6:4> Comparator Event 18 000038h 000138h IFS1<2> IEC1<2> IPC4<10:8> CRC Generator 67 00009Ah 00019Ah IFS4<3> IEC4<3> IPC16<14:12> CTMU Event 77 0000AEh 0001AEh IFS4<13> IEC4<13> IPC19<6:4> External Interrupt 0 0 000014h 000114h IFS0<0> IEC0<0> IPC0<2:0> External Interrupt 1 20 00003Ch 00013Ch IFS1<4> IEC1<4> IPC5<2:0> External Interrupt 2 29 00004Eh 00014Eh IFS1<13> IEC1<13> IPC7<6:4> External Interrupt 3 53 00007Eh 00017Eh IFS3<5> IEC3<5> IPC13<6:4> External Interrupt 4 54 000080h 000180h IFS3<6> IEC3<6> IPC13<10:8> I2C1 Master Event 17 000036h 000136h IFS1<1> IEC1<1> IPC4<6:4> I2C1 Slave Event 16 000034h 000134h IFS1<0> IEC1<0> IPC4<2:0> I2C2 Master Event 50 000078h 000178h IFS3<2> IEC3<2> IPC12<10:8> I2C2 Slave Event 49 000076h 000176h IFS3<1> IEC3<1> IPC12<6:4> I2C3 Master Event 85 0000BEh 0001BEh IFS5<5> IEC5<5> IPC21<6:4> I2C3 Slave Event 84 0000BCh 0001BCh IFS5<4> IEC5<4> IPC21<2:0> Input Capture 1 1 000016h 000116h IFS0<1> IEC0<1> IPC0<6:4> Input Capture 2 5 00001Eh 00011Eh IFS0<5> IEC0<5> IPC1<6:4> Input Capture 3 37 00005Eh 00015Eh IFS2<5> IEC2<5> IPC9<6:4> Input Capture 4 38 000060h 000160h IFS2<6> IEC2<6> IPC9<10:8> Input Capture 5 39 000062h 000162h IFS2<7> IEC2<7> IPC9<14:12> Input Capture 6 40 000064h 000164h IFS2<8> IEC2<8> IPC10<2:0> Input Capture 7 22 000040h 000140h IFS1<6> IEC1<6> IPC5<10:8> Input Capture 8 23 000042h 000142h IFS1<7> IEC1<7> IPC5<14:12> Input Capture 9 93 0000CEh 0001CEh IFS5<13> IEC5<13> IPC23<6:4> Input Change Notification 19 00003Ah 00013Ah IFS1<3> IEC1<3> IPC4<14:12> LVD Low-Voltage Detect 72 0000A4h 0001A4h IFS4<8> IEC4<8> IPC18<2:0> Output Compare 1 2 000018h 000118h IFS0<2> IEC0<2> IPC0<10:8> Output Compare 2 6 000020h 000120h IFS0<6> IEC0<6> IPC1<10:8> Output Compare 3 25 000046h 000146h IFS1<9> IEC1<9> IPC6<6:4> Output Compare 4 26 000048h 000148h IFS1<10> IEC1<10> IPC6<10:8> Output Compare 5 41 000066h 000166h IFS2<9> IEC2<9> IPC10<6:4> Output Compare 6 42 000068h 000168h IFS2<10> IEC2<10> IPC10<10:8> Output Compare 7 43 00006Ah 00016Ah IFS2<11> IEC2<11> IPC10<14:12> Output Compare 8 44 00006Ch 00016Ch IFS2<12> IEC2<12> IPC11<2:0> Output Compare 9 92 0000CCh 0001CCh IFS5<12> IEC5<12> IPC23<2:0> Parallel Master Port 45 00006Eh 00016Eh IFS2<13> IEC2<13> IPC11<6:4> Real-Time Clock/Calendar 62 000090h 000190h IFS3<14> IEC3<14> IPC15<10:8> SPI1 Error 9 000026h 000126h IFS0<9> IEC0<9> IPC2<6:4> SPI1 Event 10 000028h 000128h IFS0<10> IEC0<10> IPC2<10:8> SPI2 Error 32 000054h 000154h IFS2<0> IEC2<0> IPC8<2:0> SPI2 Event 33 000056h 000156h IFS2<1> IEC2<1> IPC8<6:4> SPI3 Error 90 0000C8h 0001C8h IFS5<10> IEC5<10> IPC22<10:8> SPI3 Event 91 0000CAh 0001CAh IFS5<11> IEC5<11> IPC22<14:12> PIC24FJ256GB110 FAMILY DS39897C-page 80  2009 Microchip Technology Inc. 7.3 Interrupt Control and Status Registers The PIC24FJ256GB110 family of devices implements a total of 37 registers for the interrupt controller: • INTCON1 • INTCON2 • IFS0 through IFS5 • IEC0 through IEC5 • IPC0 through IPC23 (except IPC14 and IPC17) • INTTREG Global interrupt control functions are controlled from INTCON1 and INTCON2. INTCON1 contains the Interrupt Nesting Disable (NSTDIS) bit, as well as the control and status flags for the processor trap sources. The INTCON2 register controls the external interrupt request signal behavior and the use of the Alternate Interrupt Vector Table. The IFSx registers maintain all of the interrupt request flags. Each source of interrupt has a status bit which is set by the respective peripherals, or an external signal, and is cleared via software. The IECx registers maintain all of the interrupt enable bits. These control bits are used to individually enable interrupts from the peripherals or external signals. The IPCx registers are used to set the interrupt priority level for each source of interrupt. Each user interrupt source can be assigned to one of eight priority levels. The INTTREG register contains the associated interrupt vector number and the new CPU interrupt priority level, which are latched into the Vector Number (VECNUM<6:0>) and the Interrupt Level (ILR<3:0>) bit fields in the INTTREG register. The new interrupt priority level is the priority of the pending interrupt. The interrupt sources are assigned to the IFSx, IECx and IPCx registers in the order of their vector numbers, as shown in Table 7-2. For example, the INT0 (External Interrupt 0) is shown as having a vector number and a natural order priority of 0. Thus, the INT0IF status bit is found in IFS0<0>, the INT0IE enable bit in IEC0<0> and the INT0IP<2:0> priority bits in the first position of IPC0 (IPC0<2:0>). Although they are not specifically part of the interrupt control hardware, two of the CPU Control registers contain bits that control interrupt functionality. The ALU STATUS register (SR) contains the IPL<2:0> bits (SR<7:5>). These indicate the current CPU interrupt priority level. The user may change the current CPU priority level by writing to the IPL bits. The CORCON register contains the IPL3 bit, which together with IPL<2:0>, indicates the current CPU priority level. IPL3 is a read-only bit so that trap events cannot be masked by the user software. All interrupt registers are described in Register 7-1 through Register 7-39, in the following pages. Timer1 3 00001Ah 00011Ah IFS0<3> IEC0<3> IPC0<14:12> Timer2 7 000022h 000122h IFS0<7> IEC0<7> IPC1<14:12> Timer3 8 000024h 000124h IFS0<8> IEC0<8> IPC2<2:0> Timer4 27 00004Ah 00014Ah IFS1<11> IEC1<11> IPC6<14:12> Timer5 28 00004Ch 00014Ch IFS1<12> IEC1<12> IPC7<2:0> UART1 Error 65 000096h 000196h IFS4<1> IEC4<1> IPC16<6:4> UART1 Receiver 11 00002Ah 00012Ah IFS0<11> IEC0<11> IPC2<14:12> UART1 Transmitter 12 00002Ch 00012Ch IFS0<12> IEC0<12> IPC3<2:0> UART2 Error 66 000098h 000198h IFS4<2> IEC4<2> IPC16<10:8> UART2 Receiver 30 000050h 000150h IFS1<14> IEC1<14> IPC7<10:8> UART2 Transmitter 31 000052h 000152h IFS1<15> IEC1<15> IPC7<14:12> UART3 Error 81 0000B6h 0001B6h IFS5<1> IEC5<1> IPC20<6:4> UART3 Receiver 82 0000B8h 0001B8h IFS5<2> IEC5<2> IPC20<10:8> UART3 Transmitter 83 0000BAh 0001BAh IFS5<3> IEC5<3> IPC20<14:12> UART4 Error 87 0000C2h 0001C2h IFS5<7> IEC5<7> IPC21<14:12> UART4 Receiver 88 0000C4h 0001C4h IFS5<8> IEC5<8> IPC22<2:0> UART4 Transmitter 89 0000C6h 0001C6h IFS5<9> IEC5<9> IPC22<6:4> USB Interrupt 86 0000C0h 0001C0h IFS5<6> IEC5<6> IPC21<10:8> TABLE 7-2: IMPLEMENTED INTERRUPT VECTORS (CONTINUED) Interrupt Source Vector Number IVT Address AIVT Address Interrupt Bit Locations Flag Enable Priority  2009 Microchip Technology Inc. DS39897C-page 81 PIC24FJ256GB110 FAMILY REGISTER 7-1: SR: ALU STATUS REGISTER (IN CPU) U-0 U-0 U-0 U-0 U-0 U-0 U-0 R-0 — — — — — — — DC(1) bit 15 bit 8 R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL2(2,3) IPL1(2,3) IPL0(2,3) RA(1) N(1) OV(1) Z(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2,3) 111 = CPU interrupt priority level is 7 (15). User interrupts disabled. 110 = CPU interrupt priority level is 6 (14) 101 = CPU interrupt priority level is 5 (13) 100 = CPU interrupt priority level is 4 (12) 011 = CPU interrupt priority level is 3 (11) 010 = CPU interrupt priority level is 2 (10) 001 = CPU interrupt priority level is 1 (9) 000 = CPU interrupt priority level is 0 (8) Note 1: See Register 3-1 for the description of the remaining bit(s) that are not dedicated to interrupt control functions. 2: The IPL bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU interrupt priority level. The value in parentheses indicates the interrupt priority level if IPL3 = 1. 3: The IPL Status bits are read-only when NSTDIS (INTCON1<15>) = 1. REGISTER 7-2: CORCON: CPU CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 R/C-0 R/W-0 U-0 U-0 — — — — IPL3(2) PSV(1) — — bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 3 IPL3: CPU Interrupt Priority Level Status bit(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less Note 1: See Register 3-2 for the description of the remaining bit(s) that are not dedicated to interrupt control functions. 2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level. PIC24FJ256GB110 FAMILY DS39897C-page 82  2009 Microchip Technology Inc. REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 NSTDIS — — — — — — — bit 15 bit 8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 — — — MATHERR ADDRERR STKERR OSCFAIL — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 NSTDIS: Interrupt Nesting Disable bit 1 = Interrupt nesting is disabled 0 = Interrupt nesting is enabled bit 14-5 Unimplemented: Read as ‘0’ bit 4 MATHERR: Arithmetic Error Trap Status bit 1 = Overflow trap has occurred 0 = Overflow trap has not occurred bit 3 ADDRERR: Address Error Trap Status bit 1 = Address error trap has occurred 0 = Address error trap has not occurred bit 2 STKERR: Stack Error Trap Status bit 1 = Stack error trap has occurred 0 = Stack error trap has not occurred bit 1 OSCFAIL: Oscillator Failure Trap Status bit 1 = Oscillator failure trap has occurred 0 = Oscillator failure trap has not occurred bit 0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 83 PIC24FJ256GB110 FAMILY REGISTER 7-4: INTCON2: INTERRUPT CONTROL REGISTER 2 R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0 ALTIVT DISI — — — — — — bit 15 bit 8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — INT4EP INT3EP INT2EP INT1EP INT0EP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit 1 = Use Alternate Interrupt Vector Table 0 = Use standard (default) vector table bit 14 DISI: DISI Instruction Status bit 1 = DISI instruction is active 0 = DISI instruction is not active bit 13-5 Unimplemented: Read as ‘0’ bit 4 INT4EP: External Interrupt 4 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 3 INT3EP: External Interrupt 3 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge PIC24FJ256GB110 FAMILY DS39897C-page 84  2009 Microchip Technology Inc. REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — AD1IF U1TXIF U1RXIF SPI1IF SPF1IF T3IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 AD1IF: A/D Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 SPF1IF: SPI1 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 T3IF: Timer3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 T2IF: Timer2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 Unimplemented: Read as ‘0’ bit 3 T1IF: Timer1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 INT0IF: External Interrupt 0 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred  2009 Microchip Technology Inc. DS39897C-page 85 PIC24FJ256GB110 FAMILY REGISTER 7-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF — bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC8IF IC7IF — INT1IF CNIF CMIF MI2C1IF SI2C1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 U2TXIF: UART2 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 14 U2RXIF: UART2 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13 INT2IF: External Interrupt 2 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 T5IF: Timer5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 T4IF: Timer4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 OC4IF: Output Compare Channel 4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 OC3IF: Output Compare Channel 3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 Unimplemented: Read as ‘0’ bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 Unimplemented: Read as ‘0’ bit 4 INT1IF: External Interrupt 1 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 CNIF: Input Change Notification Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 CMIF: Comparator Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 MI2C1IF: Master I2C1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 SI2C1IF: Slave I2C1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred PIC24FJ256GB110 FAMILY DS39897C-page 86  2009 Microchip Technology Inc. REGISTER 7-7: IFS2: INTERRUPT FLAG STATUS REGISTER 2 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — PMPIF OC8IF OC7IF OC6IF OC5IF IC6IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 IC5IF IC4IF IC3IF — — — SPI2IF SPF2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 PMPIF: Parallel Master Port Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 OC8IF: Output Compare Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 OC7IF: Output Compare Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 OC6IF: Output Compare Channel 6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 OC5IF: Output Compare Channel 5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 IC6IF: Input Capture Channel 6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 IC5IF: Input Capture Channel 5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 IC4IF: Input Capture Channel 4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 IC3IF: Input Capture Channel 3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4-2 Unimplemented: Read as ‘0’ bit 1 SPI2IF: SPI2 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 SPF2IF: SPI2 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred  2009 Microchip Technology Inc. DS39897C-page 87 PIC24FJ256GB110 FAMILY REGISTER 7-8: IFS3: INTERRUPT FLAG STATUS REGISTER 3 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 — RTCIF — — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0 — INT4IF INT3IF — — MI2C2IF SI2C2IF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14 RTCIF: Real-Time Clock/Calendar Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13-7 Unimplemented: Read as ‘0’ bit 6 INT4IF: External Interrupt 4 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 INT3IF: External Interrupt 3 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4-3 Unimplemented: Read as ‘0’ bit 2 MI2C2IF: Master I2C2 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 SI2C2IF: Slave I2C2 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 88  2009 Microchip Technology Inc. REGISTER 7-9: IFS4: INTERRUPT FLAG STATUS REGISTER 4 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 — — CTMUIF — — — — LVDIF bit 15 bit 8 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 — — — — CRCIF U2ERIF U1ERIF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 CTMUIF: CTMU Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12-9 Unimplemented: Read as ‘0’ bit 8 LVDIF: Low-Voltage Detect Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7-4 Unimplemented: Read as ‘0’ bit 3 CRCIF: CRC Generator Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 U2ERIF: UART2 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 U1ERIF: UART1 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 89 PIC24FJ256GB110 FAMILY REGISTER 7-10: IFS5: INTERRUPT FLAG STATUS REGISTER 5 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — IC9IF OC9IF SPI3IF SPF3IF U4TXIF U4RXIF bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U4ERIF USB1IF MI2C3IF SI2C3IF U3TXIF U3RXIF U3ERIF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 IC9IF: Input Capture Channel 9 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 OC9IF: Output Compare Channel 9 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 SPI3IF: SPI3 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 SPF3IF: SPI3 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 U4TXIF: UART4 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 U4RXIF: UART4 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 U4ERIF: UART4 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 USB1IF: USB1 (USB OTG) Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 MI2C3IF: Master I2C3 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 SI2C3IF: Slave I2C3 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 U3TXIF: UART3 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 U3RXIF: UART3 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 U3ERIF: UART3 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 90  2009 Microchip Technology Inc. REGISTER 7-11: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — AD1IE U1TXIE U1RXIE SPI1IE SPF1IE T3IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 AD1IE: A/D Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 SPI1IE: SPI1 Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 SPF1IE: SPI1 Fault Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 T3IE: Timer3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 T2IE: Timer2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 Unimplemented: Read as ‘0’ bit 3 T1IE: Timer1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 INT0IE: External Interrupt 0 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled  2009 Microchip Technology Inc. DS39897C-page 91 PIC24FJ256GB110 FAMILY REGISTER 7-12: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U2TXIE U2RXIE INT2IE(1) T5IE T4IE OC4IE OC3IE — bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC8IE IC7IE — INT1IE(1) CNIE CMIE MI2C1IE SI2C1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 U2TXIE: UART2 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 14 U2RXIE: UART2 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13 INT2IE: External Interrupt 2 Enable bit(1) 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 T5IE: Timer5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 T4IE: Timer4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 OC4IE: Output Compare Channel 4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 OC3IE: Output Compare Channel 3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 Unimplemented: Read as ‘0’ bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 Unimplemented: Read as ‘0’ bit 4 INT1IE: External Interrupt 1 Enable bit(1) 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 CNIE: Input Change Notification Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 CMIE: Comparator Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Note 1: If an external interrupt is enabled, the interrupt input must also be configured to an available RPn or RPIn pin. See Section 10.4 “Peripheral Pin Select” for more information. PIC24FJ256GB110 FAMILY DS39897C-page 92  2009 Microchip Technology Inc. bit 1 MI2C1IE: Master I2C1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 SI2C1IE: Slave I2C1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled REGISTER 7-12: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 (CONTINUED) Note 1: If an external interrupt is enabled, the interrupt input must also be configured to an available RPn or RPIn pin. See Section 10.4 “Peripheral Pin Select” for more information.  2009 Microchip Technology Inc. DS39897C-page 93 PIC24FJ256GB110 FAMILY REGISTER 7-13: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — PMPIE OC8IE OC7IE OC6IE OC5IE IC6IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 IC5IE IC4IE IC3IE — — — SPI2IE SPF2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 PMPIE: Parallel Master Port Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 OC8IE: Output Compare Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 OC7IE: Output Compare Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 OC6IE: Output Compare Channel 6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 OC5IE: Output Compare Channel 5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 IC6IE: Input Capture Channel 6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 IC5IE: Input Capture Channel 5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 IC4IE: Input Capture Channel 4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 IC3IE: Input Capture Channel 3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4-2 Unimplemented: Read as ‘0’ bit 1 SPI2IE: SPI2 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 SPF2IE: SPI2 Fault Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled PIC24FJ256GB110 FAMILY DS39897C-page 94  2009 Microchip Technology Inc. REGISTER 7-14: IEC3: INTERRUPT ENABLE CONTROL REGISTER 3 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 — RTCIE — — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0 — INT4IE(1) INT3IE(1) — — MI2C2IE SI2C2IE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14 RTCIE: Real-Time Clock/Calendar Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13-7 Unimplemented: Read as ‘0’ bit 6 INT4IE: External Interrupt 4 Enable bit(1) 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 INT3IE: External Interrupt 3 Enable bit(1) 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4-3 Unimplemented: Read as ‘0’ bit 2 MI2C2IE: Master I2C2 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 SI2C2IE: Slave I2C2 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 Unimplemented: Read as ‘0’ Note 1: If an external interrupt is enabled, the interrupt input must also be configured to an available RPn or RPIn pin. See Section 10.4 “Peripheral Pin Select” for more information.  2009 Microchip Technology Inc. DS39897C-page 95 PIC24FJ256GB110 FAMILY REGISTER 7-15: IEC4: INTERRUPT ENABLE CONTROL REGISTER 4 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 — — CTMUIE — — — — LVDIE bit 15 bit 8 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 — — — — CRCIE U2ERIE U1ERIE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 CTMUIE: CTMU Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12-9 Unimplemented: Read as ‘0’ bit 8 LVDIE: Low-Voltage Detect Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7-4 Unimplemented: Read as ‘0’ bit 3 CRCIE: CRC Generator Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 U2ERIE: UART2 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 U1ERIE: UART1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 96  2009 Microchip Technology Inc. REGISTER 7-16: IEC5: INTERRUPT ENABLE CONTROL REGISTER 5 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — IC9IE OC9IE SPI3IE SPF3IE U4TXIE U4RXIE bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U4ERIE USB1IE MI2C3IE SI2C3IE U3TXIE U3RXIE U3ERIE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 IC9IE: Input Capture Channel 9 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 OC9IE: Output Compare Channel 9 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 SPI3IE: SPI3 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 SPF3IE: SPI3 Fault Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 U4TXIE: UART4 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 U4RXIE: UART4 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 U4ERIE: UART4 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 USB1IE: USB1 (USB OTG) Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 MI2C3IE: Master I2C3 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 SI2C3IE: Slave I2C3 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 U3TXIE: UART3 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 U3RXIE: UART3 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 U3ERIE: UART3 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 97 PIC24FJ256GB110 FAMILY REGISTER 7-17: IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T1IP2 T1IP1 T1IP0 — OC1IP2 OC1IP1 OC1IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC1IP2 IC1IP1 IC1IP0 — INT0IP2 INT0IP1 INT0IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 98  2009 Microchip Technology Inc. REGISTER 7-18: IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T2IP2 T2IP1 T2IP0 — OC2IP2 OC2IP1 OC2IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — IC2IP2 IC2IP1 IC2IP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 99 PIC24FJ256GB110 FAMILY REGISTER 7-19: IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U1RXIP2 U1RXIP1 U1RXIP0 — SPI1IP2 SPI1IP1 SPI1IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SPF1IP2 SPF1IP1 SPF1IP0 — T3IP2 T3IP1 T3IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SPF1IP<2:0>: SPI1 Fault Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 100  2009 Microchip Technology Inc. REGISTER 7-20: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — AD1IP2 AD1IP1 AD1IP0 — U1TXIP2 U1TXIP1 U1TXIP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 AD1IP<2:0>: A/D Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled  2009 Microchip Technology Inc. DS39897C-page 101 PIC24FJ256GB110 FAMILY REGISTER 7-21: IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — CNIP2 CNIP1 CNIP0 — CMIP2 CMIP1 CMIP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — MI2C1P2 MI2C1P1 MI2C1P0 — SI2C1P2 SI2C1P1 SI2C1P0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 CNIP<2:0>: Input Change Notification Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 CMIP<2:0>: Comparator Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 MI2C1P<2:0>: Master I2C1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SI2C1P<2:0>: Slave I2C1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 102  2009 Microchip Technology Inc. REGISTER 7-22: IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC8IP2 IC8IP1 IC8IP0 — IC7IP2 IC7IP1 IC7IP0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — INT1IP2 INT1IP1 INT1IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled  2009 Microchip Technology Inc. DS39897C-page 103 PIC24FJ256GB110 FAMILY REGISTER 7-23: IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T4IP2 T4IP1 T4IP0 — OC4IP2 OC4IP1 OC4IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — OC3IP2 OC3IP1 OC3IP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T4IP<2:0>: Timer4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC4IP<2:0>: Output Compare Channel 4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 OC3IP<2:0>: Output Compare Channel 3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 104  2009 Microchip Technology Inc. REGISTER 7-24: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U2TXIP2 U2TXIP1 U2TXIP0 — U2RXIP2 U2RXIP1 U2RXIP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — INT2IP2 INT2IP1 INT2IP0 — T5IP2 T5IP1 T5IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 U2TXIP<2:0>: UART2 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 U2RXIP<2:0>: UART2 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T5IP<2:0>: Timer5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled  2009 Microchip Technology Inc. DS39897C-page 105 PIC24FJ256GB110 FAMILY REGISTER 7-25: IPC8: INTERRUPT PRIORITY CONTROL REGISTER 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SPI2IP2 SPI2IP1 SPI2IP0 — SPF2IP2 SPF2IP1 SPF2IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 SPI2IP<2:0>: SPI2 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SPF2IP<2:0>: SPI2 Fault Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 106  2009 Microchip Technology Inc. REGISTER 7-26: IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC5IP2 IC5IP1 IC5IP0 — IC4IP2 IC4IP1 IC4IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — IC3IP2 IC3IP1 IC3IP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 IC5IP<2:0>: Input Capture Channel 5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC4IP<2:0>: Input Capture Channel 4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC3IP<2:0>: Input Capture Channel 3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 107 PIC24FJ256GB110 FAMILY REGISTER 7-27: IPC10: INTERRUPT PRIORITY CONTROL REGISTER 10 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC7IP2 OC7IP1 OC7IP0 — OC6IP2 OC6IP1 OC6IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC5IP2 OC5IP1 OC5IP0 — IC6IP2 IC6IP1 IC6IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 OC7IP<2:0>: Output Compare Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC6IP<2:0>: Output Compare Channel 6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 OC5IP<2:0>: Output Compare Channel 5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 IC6IP<2:0>: Input Capture Channel 6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 108  2009 Microchip Technology Inc. REGISTER 7-28: IPC11: INTERRUPT PRIORITY CONTROL REGISTER 11 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — PMPIP2 PMPIP1 PMPIP0 — OC8IP2 OC8IP1 OC8IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 PMPIP<2:0>: Parallel Master Port Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 OC8IP<2:0>: Output Compare Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled  2009 Microchip Technology Inc. DS39897C-page 109 PIC24FJ256GB110 FAMILY REGISTER 7-29: IPC12: INTERRUPT PRIORITY CONTROL REGISTER 12 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — MI2C2P2 MI2C2P1 MI2C2P0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — SI2C2P2 SI2C2P1 SI2C2P0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 MI2C2P<2:0>: Master I2C2 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SI2C2P<2:0>: Slave I2C2 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 110  2009 Microchip Technology Inc. REGISTER 7-30: IPC13: INTERRUPT PRIORITY CONTROL REGISTER 13 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — INT4IP2 INT4IP1 INT4IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — INT3IP2 INT3IP1 INT3IP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 INT4IP<2:0>: External Interrupt 4 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 INT3IP<2:0>: External Interrupt 3 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 111 PIC24FJ256GB110 FAMILY REGISTER 7-31: IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — RTCIP2 RTCIP1 RTCIP0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 RTCIP<2:0>: Real-Time Clock/Calendar Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7-0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 112  2009 Microchip Technology Inc. REGISTER 7-32: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — CRCIP2 CRCIP1 CRCIP0 — U2ERIP2 U2ERIP1 U2ERIP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — U1ERIP2 U1ERIP1 U1ERIP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 CRCIP<2:0>: CRC Generator Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 U2ERIP<2:0>: UART2 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 U1ERIP<2:0>: UART1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 113 PIC24FJ256GB110 FAMILY REGISTER 7-33: IPC18: INTERRUPT PRIORITY CONTROL REGISTER 18 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — LVDIP2 LVDIP1 LVDIP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-3 Unimplemented: Read as ‘0’ bit 2-0 LVDIP<2:0>: Low-Voltage Detect Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled REGISTER 7-34: IPC19: INTERRUPT PRIORITY CONTROL REGISTER 19 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — CTMUIP2 CTMUIP1 CTMUIP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 CTMUIP<2:0>: CTMU Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 114  2009 Microchip Technology Inc. REGISTER 7-35: IPC20: INTERRUPT PRIORITY CONTROL REGISTER 20 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U3TXIP2 U3TXIP1 U3TXIP0 — U3RXIP2 U3RXIP1 U3RXIP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — U3ERIP2 U3ERIP1 U3ERIP0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 U3TXIP<2:0>: UART3 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 U3RXIP<2:0>: UART3 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 U3ERIP<2:0>: UART3 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 115 PIC24FJ256GB110 FAMILY REGISTER 7-36: IPC21: INTERRUPT PRIORITY CONTROL REGISTER 21 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U4ERIP2 U4ERIP1 U4ERIP0 — USB1IP2 USB1IP1 USB1IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — MI2C3P2 MI2C3P1 MI2C3P0 — SI2C3P2 SI2C3P1 SI2C3P0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 U4ERIP<2:0>: UART4 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 USB1IP<2:0>: USB1 (USB OTG) Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 MI2C3P<2:0>: Master I2C3 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SI2C3P<2:0>: Slave I2C3 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 116  2009 Microchip Technology Inc. REGISTER 7-37: IPC22: INTERRUPT PRIORITY CONTROL REGISTER 22 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SPI3IP2 SPI3IP1 SPI3IP0 — SPF3IP2 SPF3IP1 SPF3IP0 bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U4TXIP2 U4TXIP1 U4TXIP0 — U4RXIP2 U4RXIP1 U4RXIP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 SPI3IP<2:0>: SPI3 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 SPF3IP<2:0>: SPI3 Fault Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 U4TXIP<2:0>: UART4 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 U4RXIP<2:0>: UART4 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled  2009 Microchip Technology Inc. DS39897C-page 117 PIC24FJ256GB110 FAMILY REGISTER 7-38: IPC23: INTERRUPT PRIORITY CONTROL REGISTER 23 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC9IP2 IC9IP1 IC9IP0 — OC9IP2 OC9IP1 OC9IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 IC9IP<2:0>: Input Capture Channel 9 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 OC9IP<2:0>: Output Compare Channel 9 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) ••• 001 = Interrupt is priority 1 000 = Interrupt source is disabled PIC24FJ256GB110 FAMILY DS39897C-page 118  2009 Microchip Technology Inc. REGISTER 7-39: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER R-0 U-0 R/W-0 U-0 R-0 R-0 R-0 R-0 CPUIRQ — VHOLD — ILR3 ILR2 ILR1 ILR0 bit 15 bit 8 U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 — VECNUM6 VECNUM5 VECNUM4 VECNUM3 VECNUM2 VECNUM1 VECNUM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CPUIRQ: Interrupt Request from Interrupt Controller CPU bit 1 = An interrupt request has occurred but has not yet been Acknowledged by the CPU; this happens when the CPU priority is higher than the interrupt priority 0 = No interrupt request is unacknowledged bit 14 Unimplemented: Read as ‘0’ bit 13 VHOLD: Vector Number Capture Configuration bit 1 = VECNUM contains the value of the highest priority pending interrupt 0 = VECNUM contains the value of the last Acknowledged interrupt (i.e., the last interrupt that has occurred with higher priority than the CPU, even if other interrupts are pending) bit 12 Unimplemented: Read as ‘0’ bit 11-8 ILR<3:0>: New CPU Interrupt Priority Level bits 1111 = CPU Interrupt Priority Level is 15 ••• 0001 = CPU Interrupt Priority Level is 1 0000 = CPU Interrupt Priority Level is 0 bit 7 Unimplemented: Read as ‘0’ bit 6-0 VECNUM<6:0>: Pending Interrupt Vector ID bits (pending vector number is VECNUM + 8) 0111111 = Interrupt vector pending is number 135 ••• 0000001 = Interrupt vector pending is number 9 0000000 = Interrupt vector pending is number 8  2009 Microchip Technology Inc. DS39897C-page 119 PIC24FJ256GB110 FAMILY 7.4 Interrupt Setup Procedures 7.4.1 INITIALIZATION To configure an interrupt source: 1. Set the NSTDIS Control bit (INTCON1<15>) if nested interrupts are not desired. 2. Select the user-assigned priority level for the interrupt source by writing the control bits in the appropriate IPCx register. The priority level will depend on the specific application and type of interrupt source. If multiple priority levels are not desired, the IPCx register control bits for all enabled interrupt sources may be programmed to the same non-zero value. 3. Clear the interrupt flag status bit associated with the peripheral in the associated IFSx register. 4. Enable the interrupt source by setting the interrupt enable control bit associated with the source in the appropriate IECx register. 7.4.2 INTERRUPT SERVICE ROUTINE The method that is used to declare an ISR and initialize the IVT with the correct vector address will depend on the programming language (i.e., ‘C’ or assembler) and the language development toolsuite that is used to develop the application. In general, the user must clear the interrupt flag in the appropriate IFSx register for the source of the interrupt that the ISR handles. Otherwise, the ISR will be re-entered immediately after exiting the routine. If the ISR is coded in assembly language, it must be terminated using a RETFIE instruction to unstack the saved PC value, SRL value and old CPU priority level. 7.4.3 TRAP SERVICE ROUTINE A Trap Service Routine (TSR) is coded like an ISR, except that the appropriate trap status flag in the INTCON1 register must be cleared to avoid re-entry into the TSR. 7.4.4 INTERRUPT DISABLE All user interrupts can be disabled using the following procedure: 1. Push the current SR value onto the software stack using the PUSH instruction. 2. Force the CPU to priority level 7 by inclusive ORing the value E0h with SRL. To enable user interrupts, the POP instruction may be used to restore the previous SR value. Note that only user interrupts with a priority level of 7 or less can be disabled. Trap sources (level 8-15) cannot be disabled. The DISI instruction provides a convenient way to disable interrupts of priority levels 1-6 for a fixed period of time. Level 7 interrupt sources are not disabled by the DISI instruction. Note: At a device Reset, the IPCx registers are initialized, such that all user interrupt sources are assigned to priority level 4. PIC24FJ256GB110 FAMILY DS39897C-page 120  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 121 PIC24FJ256GB110 FAMILY 8.0 OSCILLATOR CONFIGURATION The oscillator system for PIC24FJ256GB110 family devices has the following features: • A total of four external and internal oscillator options as clock sources, providing 11 different clock modes • An on-chip USB PLL block to provide a stable, 48 MHz clock for the USB module as well as a range of frequency options for the system clock • Software-controllable switching between various clock sources • Software-controllable postscaler for selective clocking of CPU for system power savings • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and permits safe application recovery or shutdown • A separate and independently configurable system clock output for synchronizing external hardware A simplified diagram of the oscillator system is shown in Figure 8-1. FIGURE 8-1: PIC24FJ256GB110 FAMILY CLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 6. “Oscillator” (DS39700). PIC24FJ256GB110 Family Secondary Oscillator SOSCEN Enable Oscillator SOSCO SOSCI Clock Source Option for Other Modules OSCI OSCO Primary Oscillator XT, HS, EC CPU Peripherals Postscaler CLKDIV<10:8> WDT, PWRT 8 MHz FRCDIV 31 kHz (nominal) FRC Oscillator LPRC Oscillator SOSC LPRC Postscaler Clock Control Logic Fail-Safe Clock Monitor CLKDIV<14:12> FRC CLKO (nominal) XTPLL, HSPLL ECPLL,FRCPLL 8 MHz 4 MHz PLL & DIV PLLDIV<2:0> CPDIV<1:0> 48 MHz USB Clock USB PLL Reference Clock Generator REFO REFOCON<15:8> PIC24FJ256GB110 FAMILY DS39897C-page 122  2009 Microchip Technology Inc. 8.1 CPU Clocking Scheme The system clock source can be provided by one of four sources: • Primary Oscillator (POSC) on the OSCI and OSCO pins • Secondary Oscillator (SOSC) on the SOSCI and SOSCO pins • Fast Internal RC (FRC) Oscillator • Low-Power Internal RC (LPRC) Oscillator The Primary Oscillator and FRC sources have the option of using the internal USB PLL block, which generates both the USB module clock and a separate system clock from the 96 MHZ PLL. Refer to Section 8.5 “Oscillator Modes and USB Operation” for additional information. The Fast Internal FRC provides an 8 MHz clock source. It can optionally be reduced by the programmable clock divider to provide a range of system clock frequencies. The selected clock source generates the processor and peripheral clock sources. The processor clock source is divided by two to produce the internal instruction cycle clock, FCY. In this document, the instruction cycle clock is also denoted by FOSC/2. The internal instruction cycle clock, FOSC/2, can be provided on the OSCO I/O pin for some operating modes of the Primary Oscillator. 8.2 Initial Configuration on POR The oscillator source (and operating mode) that is used at a device Power-on Reset event is selected using Configuration bit settings. The oscillator Configuration bit settings are located in the Configuration registers in the program memory (refer to Section 26.1 “Configuration Bits” for further details). The Primary Oscillator Configuration bits, POSCMD<1:0> (Configuration Word 2<1:0>), and the Initial Oscillator Select Configuration bits, FNOSC<2:0> (Configuration Word 2<10:8>), select the oscillator source that is used at a Power-on Reset. The FRC Primary Oscillator with Postscaler (FRCDIV) is the default (unprogrammed) selection. The Secondary Oscillator, or one of the internal oscillators, may be chosen by programming these bit locations. The Configuration bits allow users to choose between the various clock modes, shown in Table 8-1. 8.2.1 CLOCK SWITCHING MODE CONFIGURATION BITS The FCKSM Configuration bits (Configuration Word 2<7:6>) are used to jointly configure device clock switching and the Fail-Safe Clock Monitor (FSCM). Clock switching is enabled only when FCKSM1 is programmed (‘0’). The FSCM is enabled only when FCKSM<1:0> are both programmed (‘00’). TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source POSCMD<1:0> FNOSC<2:0> Note Fast RC Oscillator with Postscaler (FRCDIV) Internal 11 111 1, 2 (Reserved) Internal xx 110 1 Low-Power RC Oscillator (LPRC) Internal 11 101 1 Secondary (Timer1) Oscillator (SOSC) Secondary 11 100 1 Primary Oscillator (XT) with PLL Module (XTPLL) Primary 01 011 Primary Oscillator (EC) with PLL Module (ECPLL) Primary 00 011 Primary Oscillator (HS) Primary 10 010 Primary Oscillator (XT) Primary 01 010 Primary Oscillator (EC) Primary 00 010 Fast RC Oscillator with PLL Module (FRCPLL) Internal 11 001 1 Fast RC Oscillator (FRC) Internal 11 000 1 Note 1: OSCO pin function is determined by the OSCIOFCN Configuration bit. 2: This is the default oscillator mode for an unprogrammed (erased) device.  2009 Microchip Technology Inc. DS39897C-page 123 PIC24FJ256GB110 FAMILY 8.3 Control Registers The operation of the oscillator is controlled by three Special Function Registers: • OSCCON • CLKDIV • OSCTUN The OSCCON register (Register 8-1) is the main control register for the oscillator. It controls clock source switching and allows the monitoring of clock sources. The CLKDIV register (Register 8-2) controls the features associated with Doze mode, as well as the postscaler for the FRC Oscillator. The OSCTUN register (Register 8-3) allows the user to fine tune the FRC Oscillator over a range of approximately ±12%. REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER U-0 R-0 R-0 R-0 U-0 R/W-x(1) R/W-x(1) R/W-x(1) — COSC2 COSC1 COSC0 — NOSC2 NOSC1 NOSC0 bit 15 bit 8 R/SO-0 R/W-0 R-0(3) U-0 R/CO-0 R/W-0 R/W-0 R/W-0 CLKLOCK IOLOCK(2) LOCK — CF POSCEN SOSCEN OSWEN bit 7 bit 0 Legend: CO = Clear Only bit SO = Set Only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 COSC<2:0>: Current Oscillator Selection bits 111 = Fast RC Oscillator with Postscaler (FRCDIV) 110 = Reserved 101 = Low-Power RC Oscillator (LPRC) 100 = Secondary Oscillator (SOSC) 011 = Primary Oscillator with PLL module (XTPLL, HSPLL, ECPLL) 010 = Primary Oscillator (XT, HS, EC) 001 = Fast RC Oscillator with Postscaler and PLL module (FRCPLL) 000 = Fast RC Oscillator (FRC) bit 11 Unimplemented: Read as ‘0’ bit 10-8 NOSC<2:0>: New Oscillator Selection bits(1) 111 = Fast RC Oscillator with Postscaler (FRCDIV) 110 = Reserved 101 = Low-Power RC Oscillator (LPRC) 100 = Secondary Oscillator (SOSC) 011 = Primary Oscillator with PLL module (XTPLL, HSPLL, ECPLL) 010 = Primary Oscillator (XT, HS, EC) 001 = Fast RC Oscillator with Postscaler and PLL module (FRCPLL) 000 = Fast RC Oscillator (FRC) Note 1: Reset values for these bits are determined by the FNOSC Configuration bits. 2: The state of the IOLOCK bit can only be changed once an unlocking sequence has been executed. In addition, if the IOL1WAY Configuration bit is ‘1’, once the IOLOCK bit is set, it cannot be cleared. 3: Also resets to ‘0’ during any valid clock switch or whenever a non PLL clock mode is selected. PIC24FJ256GB110 FAMILY DS39897C-page 124  2009 Microchip Technology Inc. bit 7 CLKLOCK: Clock Selection Lock Enabled bit If FSCM is enabled (FCKSM1 = 1): 1 = Clock and PLL selections are locked 0 = Clock and PLL selections are not locked and may be modified by setting the OSWEN bit If FSCM is disabled (FCKSM1 = 0): Clock and PLL selections are never locked and may be modified by setting the OSWEN bit. bit 6 IOLOCK: I/O Lock Enable bit(2) 1 = I/O lock is active 0 = I/O lock is not active bit 5 LOCK: PLL Lock Status bit(3) 1 = PLL module is in lock or PLL module start-up timer is satisfied 0 = PLL module is out of lock, PLL start-up timer is running or PLL is disabled bit 4 Unimplemented: Read as ‘0’ bit 3 CF: Clock Fail Detect bit 1 = FSCM has detected a clock failure 0 = No clock failure has been detected bit 2 POSCEN: Primary Oscillator Sleep Enable bit 1 = Primary Oscillator continues to operate during Sleep mode 0 = Primary Oscillator disabled during Sleep mode bit 1 SOSCEN: 32 kHz Secondary Oscillator (SOSC) Enable bit 1 = Enable Secondary Oscillator 0 = Disable Secondary Oscillator bit 0 OSWEN: Oscillator Switch Enable bit 1 = Initiate an oscillator switch to clock source specified by the NOSC<2:0> bits 0 = Oscillator switch is complete REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER (CONTINUED) Note 1: Reset values for these bits are determined by the FNOSC Configuration bits. 2: The state of the IOLOCK bit can only be changed once an unlocking sequence has been executed. In addition, if the IOL1WAY Configuration bit is ‘1’, once the IOLOCK bit is set, it cannot be cleared. 3: Also resets to ‘0’ during any valid clock switch or whenever a non PLL clock mode is selected.  2009 Microchip Technology Inc. DS39897C-page 125 PIC24FJ256GB110 FAMILY REGISTER 8-2: CLKDIV: CLOCK DIVIDER REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 ROI DOZE2 DOZE1 DOZE0 DOZEN(1) RCDIV2 RCDIV1 RCDIV0 bit 15 bit 8 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 CPDIV1 CPDIV0 — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ROI: Recover on Interrupt bit 1 = Interrupts clear the DOZEN bit and reset the CPU peripheral clock ratio to 1:1 0 = Interrupts have no effect on the DOZEN bit bit 14-12 DOZE<2:0>: CPU Peripheral Clock Ratio Select bits 111 = 1:128 110 = 1:64 101 = 1:32 100 = 1:16 011 = 1:8 010 = 1:4 001 = 1:2 000 = 1:1 bit 11 DOZEN: DOZE Enable bit(1) 1 = DOZE<2:0> bits specify the CPU peripheral clock ratio 0 = CPU peripheral clock ratio is set to 1:1 bit 10-8 RCDIV<2:0>: FRC Postscaler Select bits 111 = 31.25 kHz (divide-by-256) 110 = 125 kHz (divide-by-64) 101 = 250 kHz (divide-by-32) 100 = 500 kHz (divide-by-16) 011 = 1 MHz (divide-by-8) 010 = 2 MHz (divide-by-4) 001 = 4 MHz (divide-by-2) 000 = 8 MHz (divide-by-1) bit 7-6 CPDIV<1:0>: USB System Clock Select bits (postscaler select from 32 MHz clock branch) 11 = 4 MHz (divide-by-8)(2) 10 = 8 MHz (divide-by-4)(2) 01 = 16 MHz (divide-by-2) 00 = 32 MHz (divide-by-1) bit 5-0 Unimplemented: Read as ‘0’ Note 1: This bit is automatically cleared when the ROI bit is set and an interrupt occurs. 2: This setting is not allowed while the USB module is enabled. PIC24FJ256GB110 FAMILY DS39897C-page 126  2009 Microchip Technology Inc. 8.4 Clock Switching Operation With few limitations, applications are free to switch between any of the four clock sources (POSC, SOSC, FRC and LPRC) under software control and at any time. To limit the possible side effects that could result from this flexibility, PIC24F devices have a safeguard lock built into the switching process. 8.4.1 ENABLING CLOCK SWITCHING To enable clock switching, the FCKSM1 Configuration bit in CW2 must be programmed to ‘0’. (Refer to Section 26.1 “Configuration Bits” for further details.) If the FCKSM1 Configuration bit is unprogrammed (‘1’), the clock switching function and Fail-Safe Clock Monitor function are disabled. This is the default setting. The NOSCx control bits (OSCCON<10:8>) do not control the clock selection when clock switching is disabled. However, the COSCx bits (OSCCON<14:12>) will reflect the clock source selected by the FNOSCx Configuration bits. The OSWEN control bit (OSCCON<0>) has no effect when clock switching is disabled; it is held at ‘0’ at all times. REGISTER 8-3: OSCTUN: FRC OSCILLATOR TUNE REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — TUN5(1) TUN4(1) TUN3(1) TUN2(1) TUN1(1) TUN0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1) 011111 = Maximum frequency deviation 011110 =    000001 = 000000 = Center frequency, oscillator is running at factory calibrated frequency 111111 =    100001 = 100000 = Minimum frequency deviation Note 1: Increments or decrements of TUN<5:0> may not change the FRC frequency in equal steps over the FRC tuning range, and may not be monotonic. Note: The Primary Oscillator mode has three different submodes (XT, HS and EC) which are determined by the POSCMDx Configuration bits. While an application can switch to and from Primary Oscillator mode in software, it cannot switch between the different primary submodes without reprogramming the device.  2009 Microchip Technology Inc. DS39897C-page 127 PIC24FJ256GB110 FAMILY 8.4.2 OSCILLATOR SWITCHING SEQUENCE At a minimum, performing a clock switch requires this basic sequence: 1. If desired, read the COSCx bits (OSCCON<14:12>) to determine the current oscillator source. 2. Perform the unlock sequence to allow a write to the OSCCON register high byte. 3. Write the appropriate value to the NOSCx bits (OSCCON<10:8>) for the new oscillator source. 4. Perform the unlock sequence to allow a write to the OSCCON register low byte. 5. Set the OSWEN bit to initiate the oscillator switch. Once the basic sequence is completed, the system clock hardware responds automatically as follows: 1. The clock switching hardware compares the COSCx bits with the new value of the NOSCx bits. If they are the same, then the clock switch is a redundant operation. In this case, the OSWEN bit is cleared automatically and the clock switch is aborted. 2. If a valid clock switch has been initiated, the LOCK (OSCCON<5>) and CF (OSCCON<3>) bits are cleared. 3. The new oscillator is turned on by the hardware if it is not currently running. If a crystal oscillator must be turned on, the hardware will wait until the Oscillator Start-up Timer (OST) expires. If the new source is using the PLL, then the hardware waits until a PLL lock is detected (LOCK = 1). 4. The hardware waits for 10 clock cycles from the new clock source and then performs the clock switch. 5. The hardware clears the OSWEN bit to indicate a successful clock transition. In addition, the NOSCx bit values are transferred to the COSCx bits. 6. The old clock source is turned off at this time, with the exception of LPRC (if WDT or FSCM is enabled) or SOSC (if SOSCEN remains set). A recommended code sequence for a clock switch includes the following: 1. Disable interrupts during the OSCCON register unlock and write sequence. 2. Execute the unlock sequence for the OSCCON high byte by writing 78h and 9Ah to OSCCON<15:8> in two back-to-back instructions. 3. Write new oscillator source to the NOSCx bits in the instruction immediately following the unlock sequence. 4. Execute the unlock sequence for the OSCCON low byte by writing 46h and 57h to OSCCON<7:0> in two back-to-back instructions. 5. Set the OSWEN bit in the instruction immediately following the unlock sequence. 6. Continue to execute code that is not clock-sensitive (optional). 7. Invoke an appropriate amount of software delay (cycle counting) to allow the selected oscillator and/or PLL to start and stabilize. 8. Check to see if OSWEN is ‘0’. If it is, the switch was successful. If OSWEN is still set, then check the LOCK bit to determine the cause of the failure. The core sequence for unlocking the OSCCON register and initiating a clock switch is shown in Example 8-1. EXAMPLE 8-1: BASIC CODE SEQUENCE FOR CLOCK SWITCHING Note 1: The processor will continue to execute code throughout the clock switching sequence. Timing-sensitive code should not be executed during this time. 2: Direct clock switches between any Primary Oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. ;Place the new oscillator selection in W0 ;OSCCONH (high byte) Unlock Sequence MOV #OSCCONH, w1 MOV #0x78, w2 MOV #0x9A, w3 MOV.b w2, [w1] MOV.b w3, [w1] ;Set new oscillator selection MOV.b WREG, OSCCONH ;OSCCONL (low byte) unlock sequence MOV #OSCCONL, w1 MOV #0x46, w2 MOV #0x57, w3 MOV.b w2, [w1] MOV.b w3, [w1] ;Start oscillator switch operation BSET OSCCON,#0 PIC24FJ256GB110 FAMILY DS39897C-page 128  2009 Microchip Technology Inc. 8.5 Oscillator Modes and USB Operation Because of the timing requirements imposed by USB, an internal clock of 48 MHz is required at all times while the USB module is enabled. Since this is well beyond the maximum CPU clock speed, a method is provided to internally generate both the USB and system clocks from a single oscillator source. PIC24FJ256GB110 family devices use the same clock structure as other PIC24FJ devices, but include a two-branch PLL system to generate the two clock signals. The USB PLL block is shown in Figure 8-2. In this system, the input from the Primary Oscillator is divided down by a PLL prescaler to generate a 4 MHz output. This is used to drive an on-chip 96 MHz PLL frequency multiplier to drive the two clock branches. One branch uses a fixed divide-by-2 frequency divider to generate the 48 MHz USB clock. The other branch uses a fixed divide-by-3 frequency divider and configurable PLL prescaler/divider to generate a range of system clock frequencies. The CPDIV bits select the system clock speed; available clock options are listed in Table 8-2. The USB PLL prescaler does not automatically sense the incoming oscillator frequency. The user must manually configure the PLL divider to generate the required 4 MHz output, using the PLLDIV<2:0> Configuration bits. This limits the choices for Primary Oscillator frequency to a total of 8 possibilities, shown in Table 8-3. TABLE 8-2: SYSTEM CLOCK OPTIONS DURING USB OPERATION TABLE 8-3: VALID PRIMARY OSCILLATOR CONFIGURATIONS FOR USB OPERATIONS FIGURE 8-2: USB PLL BLOCK MCU Clock Division (CPDIV<1:0>) Microcontroller Clock Frequency None (00) 32 MHz 2 (01) 16 MHz 4 (10) 8MHz 8 (11) 4MHz Input Oscillator Frequency Clock Mode PLL Division (PLLDIV<2:0>) 48 MHz ECPLL 12 (111) 40 MHz ECPLL 10 (110) 24 MHz HSPLL, ECPLL 6 (101) 20 MHz HSPLL, ECPLL 5 (100) 16 MHz HSPLL, ECPLL 4 (011) 12 MHz HSPLL, ECPLL 3 (010) 8 MHz ECPLL, XTPLL 2 (001) 4 MHz ECPLL, XTPLL 1 (000) PLL 96 MHz PLL  3  2 Prescaler 4 MHz PLL Prescaler 48 MHz Clock for USB Module PLL Output for System Clock CPDIV<1:0> PLLDIV<2:0> Input from POSC Input from FRC FNOSC<2:0> (4 MHz or 8 MHz) 00 01 10 11 32 MHz 111 110 101 100 011 010 001 000  12  8  10  6  5  4  3  2  1  4  2  1 PLLDIS  2009 Microchip Technology Inc. DS39897C-page 129 PIC24FJ256GB110 FAMILY 8.5.1 CONSIDERATIONS FOR USB OPERATION When using the USB On-The-Go module in PIC24FJ256GB110 family devices, users must always observe these rules in configuring the system clock: • For USB operation, the selected clock source (EC, HS or XT) must meet the USB clock tolerance requirements. • The Primary Oscillator/PLL modes are the only oscillator configurations that permit USB operation. There is no provision to provide a separate external clock source to the USB module. • While the FRCPLL Oscillator mode is available in these devices, it should never be used for USB applications. FRCPLL mode is still available when the application is not using the USB module. However, the user must always ensure that the FRC source is configured to provide a frequency of 4 MHz or 8 MHz (RCDIV<2:0> = 001 or 000) and that the USB PLL prescaler is configured appropriately. • All other oscillator modes are available; however, USB operation is not possible when these modes are selected. They may still be useful in cases where other power levels of operation are desirable and the USB module is not needed (e.g., the application is in Sleep and waiting for bus attachment). 8.6 Reference Clock Output In addition to the CLKO output (FOSC/2) available in certain oscillator modes, the device clock in the PIC24FJ256GB110 family devices can also be configured to provide a reference clock output signal to a port pin. This feature is available in all oscillator configurations and allows the user to select a greater range of clock submultiples to drive external devices in the application. This reference clock output is controlled by the REFOCON register (Register 8-4). Setting the ROEN bit (REFOCON<15>) makes the clock signal available on the REFO pin. The RODIV bits (REFOCON<11:8>) enable the selection of 16 different clock divider options. The ROSSLP and ROSEL bits (REFOCON<13:12>) control the availability of the reference output during Sleep mode. The ROSEL bit determines if the oscillator on OSC1 and OSC2, or the current system clock source, is used for the reference clock output. The ROSSLP bit determines if the reference source is available on REFO when the device is in Sleep mode. To use the reference clock output in Sleep mode, both the ROSSLP and ROSEL bits must be set. The device clock must also be configured for one of the primary modes (EC, HS or XT); otherwise, if the POSCEN bit is not also set, the oscillator on OSC1 and OSC2 will be powered down when the device enters Sleep mode. Clearing the ROSEL bit allows the reference output frequency to change as the system clock changes during any clock switches. PIC24FJ256GB110 FAMILY DS39897C-page 130  2009 Microchip Technology Inc. REGISTER 8-4: REFOCON: REFERENCE OSCILLATOR CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ROEN — ROSSLP ROSEL RODIV3 RODIV2 RODIV1 RODIV0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ROEN: Reference Oscillator Output Enable bit 1 = Reference oscillator enabled on REFO pin 0 = Reference oscillator disabled bit 14 Unimplemented: Read as ‘0’ bit 13 ROSSLP: Reference Oscillator Output Stop in Sleep bit 1 = Reference oscillator continues to run in Sleep 0 = Reference oscillator is disabled in Sleep bit 12 ROSEL: Reference Oscillator Source Select bit 1 = Primary Oscillator used as the base clock. Note that the crystal oscillator must be enabled using the FOSC<2:0> bits; crystal maintains the operation in Sleep mode. 0 = System clock used as the base clock; base clock reflects any clock switching of the device bit 11-8 RODIV<3:0>: Reference Oscillator Divisor Select bits 1111 = Base clock value divided by 32,768 1110 = Base clock value divided by 16,384 1101 = Base clock value divided by 8,192 1100 = Base clock value divided by 4,096 1011 = Base clock value divided by 2,048 1010 = Base clock value divided by 1,024 1001 = Base clock value divided by 512 1000 = Base clock value divided by 256 0111 = Base clock value divided by 128 0110 = Base clock value divided by 64 0101 = Base clock value divided by 32 0100 = Base clock value divided by 16 0011 = Base clock value divided by 8 0010 = Base clock value divided by 4 0001 = Base clock value divided by 2 0000 = Base clock value bit 7-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 131 PIC24FJ256GB110 FAMILY 9.0 POWER-SAVING FEATURES The PIC24FJ256GB110 family of devices provides the ability to manage power consumption by selectively managing clocking to the CPU and the peripherals. In general, a lower clock frequency and a reduction in the number of circuits being clocked constitutes lower consumed power. All PIC24F devices manage power consumption in four different ways: • Clock frequency • Instruction-based Sleep and Idle modes • Software controlled Doze mode • Selective peripheral control in software Combinations of these methods can be used to selectively tailor an application’s power consumption, while still maintaining critical application features, such as timing-sensitive communications. 9.1 Clock Frequency and Clock Switching PIC24F devices allow for a wide range of clock frequencies to be selected under application control. If the system clock configuration is not locked, users can choose low-power or high-precision oscillators by simply changing the NOSC bits. The process of changing a system clock during operation, as well as limitations to the process, are discussed in more detail in Section 8.0 “Oscillator Configuration”. 9.2 Instruction-Based Power-Saving Modes PIC24F devices have two special power-saving modes that are entered through the execution of a special PWRSAV instruction. Sleep mode stops clock operation and halts all code execution; Idle mode halts the CPU and code execution, but allows peripheral modules to continue operation. The assembly syntax of the PWRSAV instruction is shown in Example 9-1. Sleep and Idle modes can be exited as a result of an enabled interrupt, WDT time-out or a device Reset. When the device exits these modes, it is said to “wake-up”. 9.2.1 SLEEP MODE Sleep mode has these features: • The system clock source is shut down. If an on-chip oscillator is used, it is turned off. • The device current consumption will be reduced to a minimum provided that no I/O pin is sourcing current. • The Fail-Safe Clock Monitor does not operate during Sleep mode since the system clock source is disabled. • The LPRC clock will continue to run in Sleep mode if the WDT is enabled. • The WDT, if enabled, is automatically cleared prior to entering Sleep mode. • Some device features or peripherals may continue to operate in Sleep mode. This includes items such as the input change notification on the I/O ports, or peripherals that use an external clock input. Any peripheral that requires the system clock source for its operation will be disabled in Sleep mode. The device will wake-up from Sleep mode on any of the these events: • On any interrupt source that is individually enabled • On any form of device Reset • On a WDT time-out On wake-up from Sleep, the processor will restart with the same clock source that was active when Sleep mode was entered. EXAMPLE 9-1: PWRSAV INSTRUCTION SYNTAX Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 10. “Power-Saving Features” (DS39698). Note: SLEEP_MODE and IDLE_MODE are constants defined in the assembler include file for the selected device. PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode PWRSAV #IDLE_MODE ; Put the device into IDLE mode PIC24FJ256GB110 FAMILY DS39897C-page 132  2009 Microchip Technology Inc. 9.2.2 IDLE MODE Idle mode has these features: • The CPU will stop executing instructions. • The WDT is automatically cleared. • The system clock source remains active. By default, all peripheral modules continue to operate normally from the system clock source, but can also be selectively disabled (see Section 9.4 “Selective Peripheral Module Control”). • If the WDT or FSCM is enabled, the LPRC will also remain active. The device will wake from Idle mode on any of these events: • Any interrupt that is individually enabled. • Any device Reset. • A WDT time-out. On wake-up from Idle, the clock is reapplied to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV instruction or the first instruction in the ISR. 9.2.3 INTERRUPTS COINCIDENT WITH POWER SAVE INSTRUCTIONS Any interrupt that coincides with the execution of a PWRSAV instruction will be held off until entry into Sleep or Idle mode has completed. The device will then wake-up from Sleep or Idle mode. 9.3 Doze Mode Generally, changing clock speed and invoking one of the power-saving modes are the preferred strategies for reducing power consumption. There may be circumstances, however, where this is not practical. For example, it may be necessary for an application to maintain uninterrupted synchronous communication, even while it is doing nothing else. Reducing system clock speed may introduce communication errors, while using a power-saving mode may stop communications completely. Doze mode is a simple and effective alternative method to reduce power consumption while the device is still executing code. In this mode, the system clock continues to operate from the same source and at the same speed. Peripheral modules continue to be clocked at the same speed while the CPU clock speed is reduced. Synchronization between the two clock domains is maintained, allowing the peripherals to access the SFRs while the CPU executes code at a slower rate. Doze mode is enabled by setting the DOZEN bit (CLKDIV<11>). The ratio between peripheral and core clock speed is determined by the DOZE<2:0> bits (CLKDIV<14:12>). There are eight possible configurations, from 1:1 to 1:256, with 1:1 being the default. It is also possible to use Doze mode to selectively reduce power consumption in event driven applications. This allows clock-sensitive functions, such as synchronous communications, to continue without interruption while the CPU Idles, waiting for something to invoke an interrupt routine. Enabling the automatic return to full-speed CPU operation on interrupts is enabled by setting the ROI bit (CLKDIV<15>). By default, interrupt events have no effect on Doze mode operation. 9.4 Selective Peripheral Module Control Idle and Doze modes allow users to substantially reduce power consumption by slowing or stopping the CPU clock. Even so, peripheral modules still remain clocked, and thus, consume power. There may be cases where the application needs what these modes do not provide: the allocation of power resources to CPU processing with minimal power consumption from the peripherals. PIC24F devices address this requirement by allowing peripheral modules to be selectively disabled, reducing or eliminating their power consumption. This can be done with two control bits: • The Peripheral Enable bit, generically named, “XXXEN”, located in the module’s main control SFR. • The Peripheral Module Disable (PMD) bit, generically named, “XXXMD”, located in one of the PMD Control registers. Both bits have similar functions in enabling or disabling their associated module. Setting the PMD bit for a module disables all clock sources to that module, reducing its power consumption to an absolute minimum. In this state, the control and status registers associated with the peripheral will also be disabled, so writes to those registers will have no effect and read values will be invalid. Many peripheral modules have a corresponding PMD bit. In contrast, disabling a module by clearing its XXXEN bit disables its functionality, but leaves its registers available to be read and written to. This reduces power consumption, but not by as much as setting the PMD bit does. Most peripheral modules have an enable bit; exceptions include input capture, output compare and RTCC. To achieve more selective power savings, peripheral modules can also be selectively disabled when the device enters Idle mode. This is done through the control bit of the generic name format, “XXXIDL”. By default, all modules that can operate during Idle mode will do so. Using the disable on Idle feature allows further reduction of power consumption during Idle mode, enhancing power savings for extremely critical power applications.  2009 Microchip Technology Inc. DS39897C-page 133 PIC24FJ256GB110 FAMILY 10.0 I/O PORTS All of the device pins (except VDD, VSS, MCLR and OSCI/CLKI) are shared between the peripherals and the parallel I/O ports. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 10.1 Parallel I/O (PIO) Ports A parallel I/O port that shares a pin with a peripheral is, in general, subservient to the peripheral. The peripheral’s output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the I/O pin. The logic also prevents “loop through”, in which a port’s digital output can drive the input of a peripheral that shares the same pin. Figure 10-1 shows how ports are shared with other peripherals and the associated I/O pin to which they are connected. When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin may be read, but the output driver for the parallel port bit will be disabled. If a peripheral is enabled, but the peripheral is not actively driving a pin, that pin may be driven by a port. All port pins have three registers directly associated with their operation as digital I/O. The Data Direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a ‘1’, then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the Output Latch register (LATx), read the latch. Writes to the latch, write the latch. Reads from the port (PORTx), read the port pins, while writes to the port pins, write the latch. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers, and the port pin, will read as zeros. When a pin is shared with another peripheral or function that is defined as an input only, it is regarded as a dedicated port because there is no other competing source of outputs. FIGURE 10-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 12. “I/O Ports with Peripheral Pin Select (PPS)” (DS39711). D Q CK WR LAT + TRIS Latch I/O Pin WR PORT Data Bus D Q CK Data Latch Read PORT Read TRIS 1 0 1 0 WR TRIS Peripheral Output Data Output Enable Peripheral Input Data I/O Peripheral Module Peripheral Output Enable PIO Module Output Multiplexers Output Data Input Data Peripheral Module Enable Read LAT PIC24FJ256GB110 FAMILY DS39897C-page 134  2009 Microchip Technology Inc. 10.1.1 OPEN-DRAIN CONFIGURATION In addition to the PORT, LAT and TRIS registers for data control, each port pin can also be individually configured for either digital or open-drain output. This is controlled by the Open-Drain Control register, ODCx, associated with each port. Setting any of the bits configures the corresponding pin to act as an open-drain output. The open-drain feature allows the generation of outputs higher than VDD (e.g., 5V) on any desired digital only pins by using external pull-up resistors. The maximum open-drain voltage allowed is the same as the maximum VIH specification. 10.2 Configuring Analog Port Pins The AD1PCFGL and TRIS registers control the operation of the A/D port pins. Setting a port pin as an analog input also requires that the corresponding TRIS bit be set. If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. When reading the PORT register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. 10.2.1 I/O PORT WRITE/READ TIMING One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically, this instruction would be a NOP. 10.2.2 ANALOG INPUT PINS AND VOLTAGE CONSIDERATIONS The voltage tolerance of pins used as device inputs is dependent on the pin’s input function. Pins that are used as digital only inputs are able to handle DC voltages up to 5.5V, a level typical for digital logic circuits. In contrast, pins that also have analog input functions of any kind can only tolerate voltages up to VDD. Voltage excursions beyond VDD on these pins are always to be avoided. Table 10-1 summarizes the input capabilities. Refer to Section 29.1 “DC Characteristics” for more details. TABLE 10-1: INPUT VOLTAGE LEVELS(1) EXAMPLE 10-1: PORT WRITE/READ EXAMPLE Note: For easy identification, the pin diagrams at the beginning of the data sheet also indicate 5.5V tolerant pins with dark grey shading. Port or Pin Tolerated Input Description PORTA<10:9> VDD Only VDD input PORTB<15:0> levels tolerated. PORTC<15:12> PORTD<7:6> PORTF<0> PORTG<9:6>, PORTG<3:2> PORTA<15:14>, PORTA<7:0> 5.5V Tolerates input levels above VDD, useful for most standard logic. PORTC<4:1> PORTD<15:8>, PORTD<5:0> PORTE<9:0> PORTF<13:12>, PORTF<8>, PORTF<5:1> PORTG<15:12>, PORTG<1:0> Note 1: Not all port pins shown here are implemented on 64-pin and 80-pin devices. Refer to Section 1.0 “Device Overview” to confirm which ports are available in specific devices. MOV 0xFF00, W0 ; Configure PORTB<15:8> as inputs MOV W0, TRISBB ; and PORTB<7:0> as outputs NOP ; Delay 1 cycle BTSS PORTB, #13 ; Next Instruction  2009 Microchip Technology Inc. DS39897C-page 135 PIC24FJ256GB110 FAMILY 10.3 Input Change Notification The input change notification function of the I/O ports allows the PIC24FJ256GB110 family of devices to generate interrupt requests to the processor in response to a Change-Of-State (COS) on selected input pins. This feature is capable of detecting input Change-Of-States even in Sleep mode, when the clocks are disabled. Depending on the device pin count, there are up to 81 external inputs that may be selected (enabled) for generating an interrupt request on a Change-Of-State. Registers, CNEN1 through CNEN6, contain the interrupt enable control bits for each of the CN input pins. Setting any of these bits enables a CN interrupt for the corresponding pins. Each CN pin has a both a weak pull-up and a weak pull-down connected to it. The pull-ups act as a current source that is connected to the pin, while the pull-downs act as a current sink that is connected to the pin. These eliminate the need for external resistors when push button or keypad devices are connected. The pull-ups and pull-downs are separately enabled using the CNPU1 through CNPU6 registers (for pull-ups) and the CNPD1 through CNPD6 registers (for pull-downs). Each CN pin has individual control bits for its pull-up and pull-down. Setting a control bit enables the weak pull-up or pull-down for the corresponding pin. When the internal pull-up is selected, the pin pulls up to VDD – 0.7V (typical). Make sure that there is no external pull-up source when the internal pull-ups are enabled, as the voltage difference can cause a current path. 10.4 Peripheral Pin Select A major challenge in general purpose devices is providing the largest possible set of peripheral features while minimizing the conflict of features on I/O pins. In an application that needs to use more than one peripheral multiplexed on a single pin, inconvenient workarounds in application code or a complete redesign may be the only option. The Peripheral Pin Select (PPS) feature provides an alternative to these choices by enabling the user’s peripheral set selection and their placement on a wide range of I/O pins. By increasing the pinout options available on a particular device, users can better tailor the microcontroller to their entire application, rather than trimming the application to fit the device. The Peripheral Pin Select feature operates over a fixed subset of digital I/O pins. Users may independently map the input and/or output of any one of many digital peripherals to any one of these I/O pins. Peripheral Pin Select is performed in software and generally does not require the device to be reprogrammed. Hardware safeguards are included that prevent accidental or spurious changes to the peripheral mapping once it has been established. 10.4.1 AVAILABLE PINS The Peripheral Pin Select feature is used with a range of up to 44 pins, depending on the particular device and its pin count. Pins that support the Peripheral Pin Select feature include the designation, “RPn” or “RPIn”, in their full pin designation, where “n” is the remappable pin number. “RP” is used to designate pins that support both remappable input and output functions, while “RPI” indicates pins that support remappable input functions only. PIC24FJ256GB110 family devices support a larger number of remappable input only pins than remappable input/output pins. In this device family, there are up to 32 remappable input/output pins, depending on the pin count of the particular device selected; these are numbered, RP0 through RP31. Remappable input only pins are numbered above this range, from RPI32 to RPI43 (or the upper limit for that particular device). See Table 1-4 for a summary of pinout options in each package offering. Note: Pull-ups on change notification pins should always be disabled whenever the port pin is configured as a digital output. PIC24FJ256GB110 FAMILY DS39897C-page 136  2009 Microchip Technology Inc. 10.4.2 AVAILABLE PERIPHERALS The peripherals managed by the Peripheral Pin Select are all digital only peripherals. These include general serial communications (UART and SPI), general purpose timer clock inputs, timer related peripherals (input capture and output compare) and external interrupt inputs. Also included are the outputs of the comparator module, since these are discrete digital signals. Peripheral Pin Select is not available for I2C™ change notification inputs, RTCC alarm outputs or peripherals with analog inputs. A key difference between pin select and non pin select peripherals is that pin select peripherals are not associated with a default I/O pin. The peripheral must always be assigned to a specific I/O pin before it can be used. In contrast, non pin select peripherals are always available on a default pin, assuming that the peripheral is active and not conflicting with another peripheral. 10.4.2.1 Peripheral Pin Select Function Priority Pin-selectable peripheral outputs (e.g., OC, UART Transmit) take priority over general purpose digital functions on a pin, such as PMP and port I/O. Specialized digital outputs, such as USB functionality, will take priority over PPS outputs on the same pin. The pin diagrams provided at the beginning of this data sheet list peripheral outputs in the order of priority. Refer to them for priority concerns on a particular pin. Unlike PIC24F devices with fixed peripherals, pin-selectable peripheral inputs never take ownership of a pin. The pin’s output buffer is controlled by the TRISx setting or by a fixed peripheral on the pin. If the pin is configured in Digital mode, the PPS input will operate correctly. If an analog function is enabled on the pin, the PPS input will be disabled. 10.4.3 CONTROLLING PERIPHERAL PIN SELECT Peripheral Pin Select features are controlled through two sets of Special Function Registers: one to map peripheral inputs and one to map outputs. Because they are separately controlled, a particular peripheral’s input and output (if the peripheral has both) can be placed on any selectable function pin without constraint. The association of a peripheral to a peripheral-selectable pin is handled in two different ways, depending on if an input or an output is being mapped. 10.4.3.1 Input Mapping The inputs of the Peripheral Pin Select options are mapped on the basis of the peripheral; that is, a control register associated with a peripheral dictates which pin it will be mapped to. The RPINRx registers are used to configure peripheral input mapping (see Register 10-1 through Register 10-21). Each register contains two sets of 6-bit fields, with each set associated with one of the pin-selectable peripherals. Programming a given peripheral’s bit field with an appropriate 6-bit value maps the RPn pin with that value to that peripheral. For any given device, the valid range of values for any of the bit fields corresponds to the maximum number of peripheral pin selections supported by the device. 10.4.3.2 Output Mapping In contrast to inputs, the outputs of the Peripheral Pin Select options are mapped on the basis of the pin. In this case, a control register associated with a particular pin dictates the peripheral output to be mapped. The RPORx registers are used to control output mapping. Each register contains two 6-bit fields, with each field being associated with one RPn pin (see Register 10-22 through Register 10-37). The value of the bit field corresponds to one of the peripherals and that peripheral’s output is mapped to the pin (see Table 10-3). Because of the mapping technique, the list of peripherals for output mapping also includes a null value of ‘000000’. This permits any given pin to remain disconnected from the output of any of the pin-selectable peripherals.  2009 Microchip Technology Inc. DS39897C-page 137 PIC24FJ256GB110 FAMILY TABLE 10-2: SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)(1) Input Name Function Name Register Function Mapping Bits External Interrupt 1 INT1 RPINR0 INT1R<5:0> External Interrupt 2 INT2 RPINR1 INT2R<5:0> External Interrupt 3 INT3 RPINR1 INT3R<5:0> External Interrupt 4 INT4 RPINR2 INT4R<5:0> Input Capture 1 IC1 RPINR7 IC1R<5:0> Input Capture 2 IC2 RPINR7 IC2R<5:0> Input Capture 3 IC3 RPINR8 IC3R<5:0> Input Capture 4 IC4 RPINR8 IC4R<5:0> Input Capture 5 IC5 RPINR9 IC5R<5:0> Input Capture 6 IC6 RPINR9 IC6R<5:0> Input Capture 7 IC7 RPINR10 IC7R<5:0> Input Capture 8 IC8 RPINR10 IC8R<5:0> Input Capture 9 IC9 RPINR15 IC9R<5:0> Output Compare Fault A OCFA RPINR11 OCFAR<5:0> Output Compare Fault B OCFB RPINR11 OCFBR<5:0> SPI1 Clock Input SCK1IN RPINR20 SCK1R<5:0> SPI1 Data Input SDI1 RPINR20 SDI1R<5:0> SPI1 Slave Select Input SS1IN RPINR21 SS1R<5:0> SPI2 Clock Input SCK2IN RPINR22 SCK2R<5:0> SPI2 Data Input SDI2 RPINR22 SDI2R<5:0> SPI2 Slave Select Input SS2IN RPINR23 SS2R<5:0> SPI3 Clock Input SCK3IN RPINR23 SCK3R<5:0> SPI3 Data Input SDI3 RPINR28 SDI3R<5:0> SPI3 Slave Select Input SS3IN RPINR29 SS3R<5:0> Timer2 External Clock T2CK RPINR3 T2CKR<5:0> Timer3 External Clock T3CK RPINR3 T3CKR<5:0> Timer4 External Clock T4CK RPINR4 T4CKR<5:0> Timer5 External Clock T5CK RPINR4 T5CKR<5:0> UART1 Clear To Send U1CTS RPINR18 U1CTSR<5:0> UART1 Receive U1RX RPINR18 U1RXR<5:0> UART2 Clear To Send U2CTS RPINR19 U2CTSR<5:0> UART2 Receive U2RX RPINR19 U2RXR<5:0> UART3 Clear To Send U3CTS RPINR21 U3CTSR<5:0> UART3 Receive U3RX RPINR17 U3RXR<5:0> UART4 Clear To Send U4CTS RPINR27 U4CTSR<5:0> UART4 Receive U4RX RPINR27 U4RXR<5:0> Note 1: Unless otherwise noted, all inputs use the Schmitt Trigger input buffers. PIC24FJ256GB110 FAMILY DS39897C-page 138  2009 Microchip Technology Inc. TABLE 10-3: SELECTABLE OUTPUT SOURCES (MAPS FUNCTION TO OUTPUT) Output Function Number(1) Function Output Name 0 NULL(2) Null 1 C1OUT Comparator 1 Output 2 C2OUT Comparator 2 Output 3 U1TX UART1 Transmit 4 U1RTS(3) UART1 Request To Send 5 U2TX UART2 Transmit 6 U2RTS(3) UART2 Request To Send 7 SDO1 SPI1 Data Output 8 SCK1OUT SPI1 Clock Output 9 SS1OUT SPI1 Slave Select Output 10 SDO2 SPI2 Data Output 11 SCK2OUT SPI2 Clock Output 12 SS2OUT SPI2 Slave Select Output 18 OC1 Output Compare 1 19 OC2 Output Compare 2 20 OC3 Output Compare 3 21 OC4 Output Compare 4 22 OC5 Output Compare 5 23 OC6 Output Compare 6 24 OC7 Output Compare 7 25 OC8 Output Compare 8 28 U3TX UART3 Transmit 29 U3RTS(3) UART3 Request To Send 30 U4TX UART4 Transmit 31 U4RTS(3) UART4 Request To Send 32 SDO3 SPI3 Data Output 33 SCK3OUT SPI3 Clock Output 34 SS3OUT SPI3 Slave Select Output 35 OC9 Output Compare 9 36 C3OUT Comparator 3 Output 37-63 (unused) NC Note 1: Setting the RPORx register with the listed value assigns that output function to the associated RPn pin. 2: The NULL function is assigned to all RPn outputs at device Reset and disables the RPn output function. 3: IrDA® BCLK functionality uses this output.  2009 Microchip Technology Inc. DS39897C-page 139 PIC24FJ256GB110 FAMILY 10.4.3.3 Mapping Limitations The control schema of the Peripheral Pin Select is extremely flexible. Other than systematic blocks that prevent signal contention caused by two physical pins being configured as the same functional input, or two functional outputs configured as the same pin, there are no hardware enforced lockouts. The flexibility extends to the point of allowing a single input to drive multiple peripherals or a single functional output to drive multiple output pins. 10.4.3.4 Mapping Exceptions for PIC24FJ256GB110 Family Devices Although the PPS registers theoretically allow for up to 64 remappable I/O pins, not all of these are implemented in all devices. For PIC24FJ256GB110 family devices, the maximum number of remappable pins available are 44, which includes 12 input only pins. In addition, some pins in the RP and RPI sequences are unimplemented in lower pin count devices. The differences in available remappable pins are summarized in Table 10-4. When developing applications that use remappable pins, users should also keep these things in mind: • For the RPINRx registers, bit combinations corresponding to an unimplemented pin for a particular device are treated as invalid; the corresponding module will not have an input mapped to it. For all PIC24FJ256GB110 family devices, this includes all values greater than 43 (‘101011’). • For RPORx registers, the bit fields corresponding to an unimplemented pin will also be unimplemented. Writing to these fields will have no effect. 10.4.4 CONTROLLING CONFIGURATION CHANGES Because peripheral remapping can be changed during run time, some restrictions on peripheral remapping are needed to prevent accidental configuration changes. PIC24F devices include three features to prevent alterations to the peripheral map: • Control register lock sequence • Continuous state monitoring • Configuration bit remapping lock 10.4.4.1 Control Register Lock Under normal operation, writes to the RPINRx and RPORx registers are not allowed. Attempted writes will appear to execute normally, but the contents of the registers will remain unchanged. To change these registers, they must be unlocked in hardware. The register lock is controlled by the IOLOCK bit (OSCCON<6>). Setting IOLOCK prevents writes to the control registers; clearing IOLOCK allows writes. To set or clear IOLOCK, a specific command sequence must be executed: 1. Write 46h to OSCCON<7:0>. 2. Write 57h to OSCCON<7:0>. 3. Clear (or set) IOLOCK as a single operation. Unlike the similar sequence with the oscillator’s LOCK bit, IOLOCK remains in one state until changed. This allows all of the Peripheral Pin Selects to be configured with a single unlock sequence, followed by an update to all control registers, then locked with a second lock sequence. 10.4.4.2 Continuous State Monitoring In addition to being protected from direct writes, the contents of the RPINRx and RPORx registers are constantly monitored in hardware by shadow registers. If an unexpected change in any of the registers occurs (such as cell disturbances caused by ESD or other external events), a Configuration Mismatch Reset will be triggered. 10.4.4.3 Configuration Bit Pin Select Lock As an additional level of safety, the device can be configured to prevent more than one write session to the RPINRx and RPORx registers. The IOL1WAY (CW2<4>) Configuration bit blocks the IOLOCK bit from being cleared after it has been set once. If IOLOCK remains set, the register unlock procedure will not execute and the Peripheral Pin Select Control registers cannot be written to. The only way to clear the bit and re-enable peripheral remapping is to perform a device Reset. In the default (unprogrammed) state, IOL1WAY is set, restricting users to one write session. Programming IOL1WAY allows users unlimited access (with the proper use of the unlock sequence) to the Peripheral Pin Select registers. TABLE 10-4: REMAPPABLE PIN EXCEPTIONS FOR PIC24FJ256GB110 FAMILY DEVICES Device Pin Count RP Pins (I/O) RPI Pins Total Unimplemented Total Unimplemented 64-pin 28 RP5, RP15, RP30, RP31 1 RPI32-36, RPI38-43 80-pin 31 RP31 9 RPI32, RPI39, RPI41 100-pin 32 — 12 — PIC24FJ256GB110 FAMILY DS39897C-page 140  2009 Microchip Technology Inc. 10.4.5 CONSIDERATIONS FOR PERIPHERAL PIN SELECTION The ability to control peripheral pin selection introduces several considerations into application design that could be overlooked. This is particularly true for several common peripherals that are available only as remappable peripherals. The main consideration is that the Peripheral Pin Selects are not available on default pins in the device’s default (Reset) state. Since all RPINRx registers reset to ‘111111’ and all RPORx registers reset to ‘000000’, all Peripheral Pin Select inputs are tied to VSS, and all Peripheral Pin Select outputs are disconnected. This situation requires the user to initialize the device with the proper peripheral configuration before any other application code is executed. Since the IOLOCK bit resets in the unlocked state, it is not necessary to execute the unlock sequence after the device has come out of Reset. For application safety, however, it is best to set IOLOCK and lock the configuration after writing to the control registers. Because the unlock sequence is timing-critical, it must be executed as an assembly language routine in the same manner as changes to the oscillator configuration. If the bulk of the application is written in C or another high-level language, the unlock sequence should be performed by writing in-line assembly. Choosing the configuration requires the review of all Peripheral Pin Selects and their pin assignments, especially those that will not be used in the application. In all cases, unused pin-selectable peripherals should be disabled completely. Unused peripherals should have their inputs assigned to an unused RPn pin function. I/O pins with unused RPn functions should be configured with the null peripheral output. The assignment of a peripheral to a particular pin does not automatically perform any other configuration of the pin’s I/O circuitry. In theory, this means adding a pin-selectable output to a pin may mean inadvertently driving an existing peripheral input when the output is driven. Users must be familiar with the behavior of other fixed peripherals that share a remappable pin and know when to enable or disable them. To be safe, fixed digital peripherals that share the same pin should be disabled when not in use. Along these lines, configuring a remappable pin for a specific peripheral does not automatically turn that feature on. The peripheral must be specifically configured for operation and enabled, as if it were tied to a fixed pin. Where this happens in the application code (immediately following device Reset and peripheral configuration or inside the main application routine) depends on the peripheral and its use in the application. A final consideration is that Peripheral Pin Select functions neither override analog inputs, nor reconfigure pins with analog functions for digital I/O. If a pin is configured as an analog input on device Reset, it must be explicitly reconfigured as digital I/O when used with a Peripheral Pin Select. Example 10-2 shows a configuration for bidirectional communication with flow control using UART1. The following input and output functions are used: • Input Functions: U1RX, U1CTS • Output Functions: U1TX, U1RTS EXAMPLE 10-2: CONFIGURING UART1 INPUT AND OUTPUT FUNCTIONS Note: In tying Peripheral Pin Select inputs to RP63, RP63 does not have to exist on a device for the registers to be reset to it. // Unlock Registers __builtin_write_OSCCONL(OSCCON & 0xBF); // Configure Input Functions (Table 9-1)) // Assign U1RX To Pin RP0 RPINR18bits.U1RXR = 0; // Assign U1CTS To Pin RP1 RPINR18bits.U1CTSR = 1; // Configure Output Functions (Table 9-2) // Assign U1TX To Pin RP2 RPOR1bits.RP2R = 3; // Assign U1RTS To Pin RP3 RPOR1bits.RP3R = 4; // Lock Registers __builtin_write_OSCCONL(OSCCON | 0x40);  2009 Microchip Technology Inc. DS39897C-page 141 PIC24FJ256GB110 FAMILY 10.4.6 PERIPHERAL PIN SELECT REGISTERS The PIC24FJ256GB110 family of devices implements a total of 37 registers for remappable peripheral configuration: • Input Remappable Peripheral Registers (21) • Output Remappable Peripheral Registers (16) Note: Input and output register values can only be changed if IOLOCK (OSCCON<6>) = 0. See Section 10.4.4.1 “Control Register Lock” for a specific command sequence. REGISTER 10-1: RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — INT1R5 INT1R4 INT1R3 INT1R2 INT1R1 INT1R0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 INT1R<5:0>: Assign External Interrupt 1 (INT1) to Corresponding RPn or RPIn Pin bits bit 7-0 Unimplemented: Read as ‘0’ REGISTER 10-2: RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — INT3R5 INT3R4 INT3R3 INT3R2 INT3R1 INT3R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — INT2R5 INT2R4 INT2R3 INT2R2 INT2R1 INT2R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 INT3R<5:0>: Assign External Interrupt 3 (INT3) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 INT2R<5:0>: Assign External Interrupt 2 (INT2) to Corresponding RPn or RPIn Pin bits PIC24FJ256GB110 FAMILY DS39897C-page 142  2009 Microchip Technology Inc. REGISTER 10-3: RPINR2: PERIPHERAL PIN SELECT INPUT REGISTER 2 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — INT4R5 INT4R4 INT4R3 INT4R2 INT4R1 INT4R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-6 Unimplemented: Read as ‘0’ bit 5-0 INT4R<5:0>: Assign External Interrupt 4 (INT4) to Corresponding RPn or RPIn Pin bits REGISTER 10-4: RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — T3CKR5 T3CKR4 T3CKR3 T3CKR2 T3CKR1 T3CKR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — T2CKR5 T2CKR4 T2CKR3 T2CKR2 T2CKR1 T2CKR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 T3CKR<5:0>: Assign Timer3 External Clock (T3CK) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 T2CKR<5:0>: Assign Timer2 External Clock (T2CK) to Corresponding RPn or RPIn Pin bits  2009 Microchip Technology Inc. DS39897C-page 143 PIC24FJ256GB110 FAMILY REGISTER 10-5: RPINR4: PERIPHERAL PIN SELECT INPUT REGISTER 4 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — T5CKR5 T5CKR4 T5CKR3 T5CKR2 T5CKR1 T5CKR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — T4CKR5 T4CKR4 T4CKR3 T4CKR2 T4CKR1 T4CKR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 T5CKR<5:0>: Assign Timer5 External Clock (T5CK) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 T4CKR<5:0>: Assign Timer4 External Clock (T4CK) to Corresponding RPn or RPIn Pin bits REGISTER 10-6: RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC2R5 IC2R4 IC2R3 IC2R2 IC2R1 IC2R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC1R5 IC1R4 IC1R3 IC1R2 IC1R1 IC1R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 IC2R<5:0>: Assign Input Capture 2 (IC2) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IC1R<5:0>: Assign Input Capture 1 (IC1) to Corresponding RPn or RPIn Pin bits PIC24FJ256GB110 FAMILY DS39897C-page 144  2009 Microchip Technology Inc. REGISTER 10-7: RPINR8: PERIPHERAL PIN SELECT INPUT REGISTER 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC4R5 IC4R4 IC4R3 IC4R2 IC4R1 IC4R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC3R5 IC3R4 IC3R3 IC3R2 IC3R1 IC3R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 IC4R<5:0>: Assign Input Capture 4 (IC4) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IC3R<5:0>: Assign Input Capture 3 (IC3) to Corresponding RPn or RPIn Pin bits REGISTER 10-8: RPINR9: PERIPHERAL PIN SELECT INPUT REGISTER 9 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC6R5 IC6R4 IC6R3 IC6R2 IC6R1 IC6R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC5R5 IC5R4 IC5R3 IC5R2 IC5R1 IC5R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 IC6R<5:0>: Assign Input Capture 6 (IC6) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IC5R<5:0>: Assign Input Capture 5 (IC5) to Corresponding RPn or RPIn Pin bits  2009 Microchip Technology Inc. DS39897C-page 145 PIC24FJ256GB110 FAMILY REGISTER 10-9: RPINR10: PERIPHERAL PIN SELECT INPUT REGISTER 10 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC8R5 IC8R4 IC8R3 IC8R2 IC8R1 IC8R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC7R5 IC7R4 IC7R3 IC7R2 IC7R1 IC7R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 IC8R<5:0>: Assign Input Capture 8 (IC8) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IC7R<5:0>: Assign Input Capture 7 (IC7) to Corresponding RPn or RPIn Pin bits REGISTER 10-10: RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — OCFBR5 OCFBR4 OCFBR3 OCFBR2 OCFBR1 OCFBR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — OCFAR5 OCFAR4 OCFAR3 OCFAR2 OCFAR1 OCFAR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 OCFBR<5:0>: Assign Output Compare Fault B (OCFB) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 OCFAR<5:0>: Assign Output Compare Fault A (OCFA) to Corresponding RPn or RPIn Pin bits PIC24FJ256GB110 FAMILY DS39897C-page 146  2009 Microchip Technology Inc. REGISTER 10-11: RPINR15: PERIPHERAL PIN SELECT INPUT REGISTER 15 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — IC9R5 IC9R4 IC9R3 IC9R2 IC9R1 IC9R0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 IC9R<5:0>: Assign Input Capture 9 (IC9) to Corresponding RPn or RPIn Pin bits bit 7-0 Unimplemented: Read as ‘0’ REGISTER 10-12: RPINR17: PERIPHERAL PIN SELECT INPUT REGISTER 17 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U3RXR5 U3RXR4 U3RXR3 U3RXR2 U3RXR1 U3RXR0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 U3RXR<5:0>: Assign UART3 Receive (U3RX) to Corresponding RPn or RPIn Pin bits bit 7-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 147 PIC24FJ256GB110 FAMILY REGISTER 10-13: RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U1CTSR5 U1CTSR4 U1CTSR3 U1CTSR2 U1CTSR1 U1CTSR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U1RXR5 U1RXR4 U1RXR3 U1RXR2 U1RXR1 U1RXR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 U1CTSR<5:0>: Assign UART1 Clear to Send (U1CTS) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 U1RXR<5:0>: Assign UART1 Receive (U1RX) to Corresponding RPn or RPIn Pin bits REGISTER 10-14: RPINR19: PERIPHERAL PIN SELECT INPUT REGISTER 19 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U2CTSR5 U2CTSR4 U2CTSR3 U2CTSR2 U2CTSR1 U2CTSR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U2RXR5 U2RXR4 U2RXR3 U2RXR2 U2RXR1 U2RXR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 U2CTSR<5:0>: Assign UART2 Clear to Send (U2CTS) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 U2RXR<5:0>: Assign UART2 Receive (U2RX) to Corresponding RPn or RPIn Pin bits PIC24FJ256GB110 FAMILY DS39897C-page 148  2009 Microchip Technology Inc. REGISTER 10-15: RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SCK1R5 SCK1R4 SCK1R3 SCK1R2 SCK1R1 SCK1R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SDI1R5 SDI1R4 SDI1R3 SDI1R2 SDI1R1 SDI1R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 SCK1R<5:0>: Assign SPI1 Clock Input (SCK1IN) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 SDI1R<5:0>: Assign SPI1 Data Input (SDI1) to Corresponding RPn or RPIn Pin bits REGISTER 10-16: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U3CTSR5 U3CTSR4 U3CTSR3 U3CTSR2 U3CTSR1 U3CTSR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SS1R5 SS1R4 SS1R3 SS1R2 SS1R1 SS1R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 U3CTSR<5:0>: Assign UART3 Clear to Send (U3CTS) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 SS1R<5:0>: Assign SPI1 Slave Select Input (SS1IN) to Corresponding RPn or RPIn Pin bits  2009 Microchip Technology Inc. DS39897C-page 149 PIC24FJ256GB110 FAMILY REGISTER 10-17: RPINR22: PERIPHERAL PIN SELECT INPUT REGISTER 22 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SCK2R5 SCK2R4 SCK2R3 SCK2R2 SCK2R1 SCK2R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SDI2R5 SDI2R4 SDI2R3 SDI2R2 SDI2R1 SDI2R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 SCK2R<5:0>: Assign SPI2 Clock Input (SCK2IN) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 SDI2R<5:0>: Assign SPI2 Data Input (SDI2) to Corresponding RPn or RPIn Pin bits REGISTER 10-18: RPINR23: PERIPHERAL PIN SELECT INPUT REGISTER 23 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SS2R5 SS2R4 SS2R3 SS2R2 SS2R1 SS2R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-6 Unimplemented: Read as ‘0’ bit 5-0 SS2R<5:0>: Assign SPI2 Slave Select Input (SS2IN) to Corresponding RPn or RPIn Pin bits PIC24FJ256GB110 FAMILY DS39897C-page 150  2009 Microchip Technology Inc. REGISTER 10-19: RPINR27: PERIPHERAL PIN SELECT INPUT REGISTER 27 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U4CTSR5 U4CTSR4 U4CTSR3 U4CTSR2 U4CTSR1 U4CTSR0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — U4RXR5 U4RXR4 U4RXR3 U4RXR2 U4RXR1 U4RXR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 U4CTSR<5:0>: Assign UART4 Clear to Send (U4CTS) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 U4RXR<5:0>: Assign UART4 Receive (U4RX) to Corresponding RPn or RPIn Pin bits REGISTER 10-20: RPINR28: PERIPHERAL PIN SELECT INPUT REGISTER 28 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SCK3R5 SCK3R4 SCK3R3 SCK3R2 SCK3R1 SCK3R0 bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SDI3R5 SDI3R4 SDI3R3 SDI3R2 SDI3R1 SDI3R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 SCK3R<5:0>: Assign SPI3 Clock Input (SCK3IN) to Corresponding RPn or RPIn Pin bits bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 SDI3R<5:0>: Assign SPI3 Data Input (SDI3) to Corresponding RPn or RPIn Pin bits  2009 Microchip Technology Inc. DS39897C-page 151 PIC24FJ256GB110 FAMILY REGISTER 10-21: RPINR29: PERIPHERAL PIN SELECT INPUT REGISTER 29 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — SS3R5 SS3R4 SS3R3 SS3R2 SS3R1 SS3R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-6 Unimplemented: Read as ‘0’ bit 5-0 SS3R<5:0>: Assign SPI3 Slave Select Input (SS31IN) to Corresponding RPn or RPIn Pin bits REGISTER 10-22: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP1R5 RP1R4 RP1R3 RP1R2 RP1R1 RP1R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP0R5 RP0R4 RP0R3 RP0R2 RP0R1 RP0R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP1R<5:0>: RP1 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP1 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP0R<5:0>: RP0 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP0 (see Table 10-3 for peripheral function numbers) PIC24FJ256GB110 FAMILY DS39897C-page 152  2009 Microchip Technology Inc. REGISTER 10-23: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP3R5 RP3R4 RP3R3 RP3R2 RP3R1 RP3R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP2R5 RP2R4 RP2R3 RP2R2 RP2R1 RP2R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP3R<5:0>: RP3 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP3 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP2R<5:0>: RP2 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP2 (see Table 10-3 for peripheral function numbers) REGISTER 10-24: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP5R5(1) RP5R4(1) RP5R3(1) RP5R2(1) RP5R1(1) RP5R0(1) bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP4R5 RP4R4 RP4R3 RP4R2 RP4R1 RP4R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP5R<5:0>: RP5 Output Pin Mapping bits(1) Peripheral output number n is assigned to pin, RP5 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP4R<5:0>: RP4 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP4 (see Table 10-3 for peripheral function numbers) Note 1: Unimplemented on 64-pin devices; read as ‘0’.  2009 Microchip Technology Inc. DS39897C-page 153 PIC24FJ256GB110 FAMILY REGISTER 10-25: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP7R5 RP7R4 RP7R3 RP7R2 RP7R1 RP7R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP6R5 RP6R4 RP6R3 RP6R2 RP6R1 RP6R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP7R<5:0>: RP7 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP7 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP6R<5:0>: RP6 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP6 (see Table 10-3 for peripheral function numbers) REGISTER 10-26: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP9R5 RP9R4 RP9R3 RP9R2 RP9R1 RP9R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP8R5 RP8R4 RP8R3 RP8R2 RP8R1 RP8R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP9R<5:0>: RP9 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP9 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP8R<5:0>: RP8 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP8 (see Table 10-3 for peripheral function numbers) PIC24FJ256GB110 FAMILY DS39897C-page 154  2009 Microchip Technology Inc. REGISTER 10-27: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP11R5 RP11R4 RP11R3 RP11R2 RP11R1 RP11R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP10R5 RP10R4 RP10R3 RP10R2 RP10R1 RP10R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP11R<5:0>: RP11 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP11 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP10R<5:0>: RP10 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP10 (see Table 10-3 for peripheral function numbers) REGISTER 10-28: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP13R5 RP13R4 RP13R3 RP13R2 RP13R1 RP13R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP12R5 RP12R4 RP12R3 RP12R2 RP12R1 RP12R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP13R<5:0>: RP13 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP13 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP12R<5:0>: RP12 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP12 (see Table 10-3 for peripheral function numbers)  2009 Microchip Technology Inc. DS39897C-page 155 PIC24FJ256GB110 FAMILY REGISTER 10-29: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP15R5(1) RP15R4(1) RP15R3(1) RP15R2(1) RP15R1(1) RP15R0(1) bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP14R5 RP14R4 RP14R3 RP14R2 RP14R1 RP14R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP15R<5:0>: RP15 Output Pin Mapping bits(1) Peripheral output number n is assigned to pin, RP0 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP14R<5:0>: RP14 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP14 (see Table 10-3 for peripheral function numbers) Note 1: Unimplemented on 64-pin devices; read as ‘0’. REGISTER 10-30: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP17R5 RP17R4 RP17R3 RP17R2 RP17R1 RP17R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP16R5 RP16R4 RP16R3 RP16R2 RP16R1 RP16R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP17R<5:0>: RP17 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP17 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP16R<5:0>: RP16 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP16 (see Table 10-3 for peripheral function numbers) PIC24FJ256GB110 FAMILY DS39897C-page 156  2009 Microchip Technology Inc. REGISTER 10-31: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP19R5 RP19R4 RP19R3 RP19R2 RP19R1 RP19R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP18R5 RP18R4 RP18R3 RP18R2 RP18R1 RP18R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP19R<5:0>: RP19 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP19 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP18R<5:0>: RP18 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP18 (see Table 10-3 for peripheral function numbers) REGISTER 10-32: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP21R5 RP21R4 RP21R3 RP21R2 RP21R1 RP21R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP21R<5:0>: RP21 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP21 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP20R<5:0>: RP20 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP20 (see Table 10-3 for peripheral function numbers)  2009 Microchip Technology Inc. DS39897C-page 157 PIC24FJ256GB110 FAMILY REGISTER 10-33: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP23R5 RP23R4 RP23R3 RP23R2 RP23R1 RP23R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP22R5 RP22R4 RP22R3 RP22R2 RP22R1 RP22R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP23R<5:0>: RP23 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP23 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP22R<5:0>: RP22 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP22 (see Table 10-3 for peripheral function numbers) REGISTER 10-34: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP25R5 RP25R4 RP25R3 RP25R2 RP25R1 RP25R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP24R5 RP24R4 RP24R3 RP24R2 RP24R1 RP24R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP25R<5:0>: RP25 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP25 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP24R<5:0>: RP24 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP24 (see Table 10-3 for peripheral function numbers) PIC24FJ256GB110 FAMILY DS39897C-page 158  2009 Microchip Technology Inc. REGISTER 10-35: RPOR13: PERIPHERAL PIN SELECT OUTPUT REGISTER 13 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP27R5 RP27R4 RP27R3 RP27R2 RP27R1 RP27R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP26R5 RP26R4 RP26R3 RP26R2 RP26R1 RP26R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP27R<5:0>: RP27 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP27 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP26R<5:0>: RP26 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP26 (see Table 10-3 for peripheral function numbers) REGISTER 10-36: RPOR14: PERIPHERAL PIN SELECT OUTPUT REGISTER 14 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP29R5 RP29R4 RP29R3 RP29R2 RP29R1 RP29R0 bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP28R5 RP28R4 RP28R3 RP28R2 RP28R1 RP28R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP29R<5:0>: RP29 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP29 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP28R<5:0>: RP28 Output Pin Mapping bits Peripheral output number n is assigned to pin, RP28 (see Table 10-3 for peripheral function numbers)  2009 Microchip Technology Inc. DS39897C-page 159 PIC24FJ256GB110 FAMILY REGISTER 10-37: RPOR15: PERIPHERAL PIN SELECT OUTPUT REGISTER 15 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP31R5(1) RP31R4(1) RP31R3(1) RP31R2(1) RP31R1(1) RP31R0(1) bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — RP30R5 RP30R4 RP30R3 RP30R2 RP30R1 RP30R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 RP31R<5:0>: RP31 Output Pin Mapping bits(1) Peripheral output number n is assigned to pin, RP31 (see Table 10-3 for peripheral function numbers) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RP30R<5:0>: RP30 Output Pin Mapping bits(2) Peripheral output number n is assigned to pin, RP30 (see Table 10-3 for peripheral function numbers) Note 1: Unimplemented on 64-pin and 80-pin devices; read as ‘0’. 2: Unimplemented on 64-pin devices; read as ‘0’. PIC24FJ256GB110 FAMILY DS39897C-page 160  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 161 PIC24FJ256GB110 FAMILY 11.0 TIMER1 The Timer1 module is a 16-bit timer which can serve as the time counter for the Real-Time Clock (RTC), or operate as a free-running, interval timer/counter. Timer1 can operate in three modes: • 16-Bit Timer • 16-Bit Synchronous Counter • 16-Bit Asynchronous Counter Timer1 also supports these features: • Timer Gate Operation • Selectable Prescaler Settings • Timer Operation during CPU Idle and Sleep modes • Interrupt on 16-Bit Period Register Match or Falling Edge of External Gate Signal Figure 11-1 presents a block diagram of the 16-bit timer module. To configure Timer1 for operation: 1. Set the TON bit (= 1). 2. Select the timer prescaler ratio using the TCKPS<1:0> bits. 3. Set the Clock and Gating modes using the TCS and TGATE bits. 4. Set or clear the TSYNC bit to configure synchronous or asynchronous operation. 5. Load the timer period value into the PR1 register. 6. If interrupts are required, set the interrupt enable bit, T1IE. Use the priority bits, T1IP<2:0>, to set the interrupt priority. FIGURE 11-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 14. “Timers” (DS39704). TON Sync SOSCI SOSCO/ PR1 Set T1IF Equal Comparator TMR1 Reset SOSCEN 1 0 TSYNC Q Q D CK TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TGATE TCY 1 0 T1CK TCS 1x 01 TGATE 00 Gate Sync PIC24FJ256GB110 FAMILY DS39897C-page 162  2009 Microchip Technology Inc. REGISTER 11-1: T1CON: TIMER1 CONTROL REGISTER(1) R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 — TGATE TCKPS1 TCKPS0 — TSYNC TCS — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TON: Timer1 On bit 1 = Starts 16-bit Timer1 0 = Stops 16-bit Timer1 bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 Unimplemented: Read as ‘0’ bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit When TCS = 1: 1 = Synchronize external clock input 0 = Do not synchronize external clock input When TCS = 0: This bit is ignored. bit 1 TCS: Timer1 Clock Source Select bit 1 = External clock from T1CK pin (on the rising edge) 0 = Internal clock (FOSC/2) bit 0 Unimplemented: Read as ‘0’ Note 1: Changing the value of TxCON while the timer is running (TON = 1) causes the timer prescale counter to reset and is not recommended.  2009 Microchip Technology Inc. DS39897C-page 163 PIC24FJ256GB110 FAMILY 12.0 TIMER2/3 AND TIMER4/5 The Timer2/3 and Timer4/5 modules are 32-bit timers, which can also be configured as four independent, 16-bit timers with selectable operating modes. As 32-bit timers, Timer2/3 and Timer4/5 can each operate in three modes: • Two independent 16-bit timers with all 16-bit operating modes (except Asynchronous Counter mode) • Single 32-bit timer • Single 32-bit synchronous counter They also support these features: • Timer Gate Operation • Selectable Prescaler Settings • Timer Operation during Idle and Sleep modes • Interrupt on a 32-Bit Period Register Match • ADC Event Trigger (Timer4/5 only) Individually, all four of the 16-bit timers can function as synchronous timers or counters. They also offer the features listed above, except for the ADC Event Trigger; this is implemented only with Timer3. The operating modes and enabled features are determined by setting the appropriate bit(s) in the T2CON, T3CON, T4CON and T5CON registers. T2CON and T4CON are shown in generic form in Register 12-1; T3CON and T5CON are shown in Register 12-2. For 32-bit timer/counter operation, Timer2 and Timer4 are the least significant word; Timer3 and Timer4 are the most significant word of the 32-bit timers. To configure Timer2/3 or Timer4/5 for 32-bit operation: 1. Set the T32 bit (T2CON<3> or T4CON<3> = 1). 2. Select the prescaler ratio for Timer2 or Timer4 using the TCKPS<1:0> bits. 3. Set the Clock and Gating modes using the TCS and TGATE bits. If TCS is set to external clock, RPINRx (TxCK) must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 4. Load the timer period value. PR3 (or PR5) will contain the most significant word of the value while PR2 (or PR4) contains the least significant word. 5. If interrupts are required, set the interrupt enable bit, T3IE or T5IE; use the priority bits, T3IP<2:0> or T5IP<2:0>, to set the interrupt priority. Note that while Timer2 or Timer4 controls the timer, the interrupt appears as a Timer3 or Timer5 interrupt. 6. Set the TON bit (= 1). The timer value, at any point, is stored in the register pair, TMR3:TMR2 (or TMR5:TMR4). TMR3 (TMR5) always contains the most significant word of the count, while TMR2 (TMR4) contains the least significant word. To configure any of the timers for individual 16-bit operation: 1. Clear the T32 bit corresponding to that timer (T2CON<3> for Timer2 and Timer3 or T4CON<3> for Timer4 and Timer5). 2. Select the timer prescaler ratio using the TCKPS<1:0> bits. 3. Set the Clock and Gating modes using the TCS and TGATE bits. See Section 10.4 “Peripheral Pin Select” for more information. 4. Load the timer period value into the PRx register. 5. If interrupts are required, set the interrupt enable bit, TxIE; use the priority bits, TxIP<2:0>, to set the interrupt priority. 6. Set the TON bit (TxCON<15> = 1). Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 14. “Timers” (DS39704). Note: For 32-bit operation, T3CON and T5CON control bits are ignored. Only T2CON and T4CON control bits are used for setup and control. Timer2 and Timer4 clock and gate inputs are utilized for the 32-bit timer modules, but an interrupt is generated with the Timer3 or Timer5 interrupt flags. PIC24FJ256GB110 FAMILY DS39897C-page 164  2009 Microchip Technology Inc. FIGURE 12-1: TIMER2/3 AND TIMER4/5 (32-BIT) BLOCK DIAGRAM TMR3 TMR2 Set T3IF (T5IF) Equal Comparator PR3 PR2 Reset MSB LSB Note 1: The 32-Bit Timer Configuration bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective to the T2CON and T4CON registers. 2: The timer clock input must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral Pin Select” for more information. 3: The ADC Event Trigger is available only on Timer 2/3 in 32-bit mode and Timer 3 in 16-bit mode. Data Bus<15:0> TMR3HLD Read TMR2 (TMR4)(1) Write TMR2 (TMR4)(1) 16 16 16 Q Q D CK TGATE 0 1 TON TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TCY TCS(2) TGATE(2) Gate T2CK Sync ADC Event Trigger(3) Sync (T4CK) (PR5) (PR4) (TMR5HLD) (TMR5) (TMR4) 1x 01 00  2009 Microchip Technology Inc. DS39897C-page 165 PIC24FJ256GB110 FAMILY FIGURE 12-2: TIMER2 AND TIMER4 (16-BIT SYNCHRONOUS) BLOCK DIAGRAM FIGURE 12-3: TIMER3 AND TIMER5 (16-BIT ASYNCHRONOUS) BLOCK DIAGRAM TON TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TCY TCS(1) 1x 01 TGATE(1) 00 Gate T2CK Sync PR2 (PR4) Set T2IF (T4IF) Equal Comparator TMR2 (TMR4) Reset Q Q D CK TGATE 1 0 (T4CK) Sync Note 1: The timer clock input must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral Pin Select” for more information. TON TCKPS<1:0> 2 TCY TCS(1) 1x 01 TGATE(1) 00 T3CK PR3 (PR5) Set T3IF (T5IF) Equal Comparator TMR3 (TMR5) Reset Q Q D CK TGATE 1 0 ADC Event Trigger(2) (T5CK) Prescaler 1, 8, 64, 256 Sync Note 1: The timer clock input must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral Pin Select” for more information. 2: The ADC Event Trigger is available only on Timer3. PIC24FJ256GB110 FAMILY DS39897C-page 166  2009 Microchip Technology Inc. REGISTER 12-1: TxCON: TIMER2 AND TIMER4 CONTROL REGISTER(3) R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 — TGATE TCKPS1 TCKPS0 T32(1) — TCS(2) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TON: Timerx On bit When TxCON<3> = 1: 1 = Starts 32-bit Timerx/y 0 = Stops 32-bit Timerx/y When TxCON<3> = 0: 1 = Starts 16-bit Timerx 0 = Stops 16-bit Timerx bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timerx Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timerx Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 T32: 32-Bit Timer Mode Select bit(1) 1 = Timerx and Timery form a single 32-bit timer 0 = Timerx and Timery act as two 16-bit timers In 32-bit mode, T3CON control bits do not affect 32-bit timer operation. bit 2 Unimplemented: Read as ‘0’ bit 1 TCS: Timerx Clock Source Select bit(2) 1 = External clock from pin, TxCK (on the rising edge) 0 = Internal clock (FOSC/2) bit 0 Unimplemented: Read as ‘0’ Note 1: In 32-bit mode, the T3CON or T5CON control bits do not affect 32-bit timer operation. 2: If TCS = 1, RPINRx (TxCK) must be configured to an available RPn pin. For more information, see Section 10.4 “Peripheral Pin Select”. 3: Changing the value of TxCON while the timer is running (TON = 1) causes the timer prescale counter to reset and is not recommended.  2009 Microchip Technology Inc. DS39897C-page 167 PIC24FJ256GB110 FAMILY REGISTER 12-2: TyCON: TIMER3 AND TIMER5 CONTROL REGISTER(3) R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON(1) — TSIDL(1) — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 — TGATE(1) TCKPS1(1) TCKPS0(1) — — TCS(1,2) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TON: Timery On bit(1) 1 = Starts 16-bit Timery 0 = Stops 16-bit Timery bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit(1) 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timery Gated Time Accumulation Enable bit(1) When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timery Input Clock Prescale Select bits(1) 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3-2 Unimplemented: Read as ‘0’ bit 1 TCS: Timery Clock Source Select bit(1,2) 1 = External clock from pin TyCK (on the rising edge) 0 = Internal clock (FOSC/2) bit 0 Unimplemented: Read as ‘0’ Note 1: When 32-bit operation is enabled (T2CON<3> or T4CON<3> = 1), these bits have no effect on Timery operation; all timer functions are set through T2CON and T4CON. 2: If TCS = 1, RPINRx (TxCK) must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 3: Changing the value of TyCON while the timer is running (TON = 1) causes the timer prescale counter to reset and is not recommended. PIC24FJ256GB110 FAMILY DS39897C-page 168  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 169 PIC24FJ256GB110 FAMILY 13.0 INPUT CAPTURE WITH DEDICATED TIMERS Devices in the PIC24FJ256GB110 family all feature 9 independent input capture modules. Each of the modules offers a wide range of configuration and operating options for capturing external pulse events and generating interrupts. Key features of the input capture module include: • Hardware-configurable for 32-bit operation in all modes by cascading two adjacent modules • Synchronous and Trigger modes of output compare operation, with up to 30 user-selectable trigger/sync sources available • A 4-level FIFO buffer for capturing and holding timer values for several events • Configurable interrupt generation • Up to 6 clock sources available for each module, driving a separate internal 16-bit counter The module is controlled through two registers, ICxCON1 (Register 13-1) and ICxCON2 (Register 13-2). A general block diagram of the module is shown in Figure 13-1. 13.1 General Operating Modes 13.1.1 SYNCHRONOUS AND TRIGGER MODES By default, the input capture module operates in a free-running mode. The internal 16-bit counter, ICxTMR, counts up continuously, wrapping around from FFFFh to 0000h on each overflow, with its period synchronized to the selected external clock source. When a capture event occurs, the current 16-bit value of the internal counter is written to the FIFO buffer. In Synchronous mode, the module begins capturing events on the ICx pin as soon as its selected clock source is enabled. Whenever an event occurs on the selected sync source, the internal counter is reset. In Trigger mode, the module waits for a Sync event from another internal module to occur before allowing the internal counter to run. Standard, free-running operation is selected by setting the SYNCSEL bits to ‘00000’, and clearing the ICTRIG bit (ICxCON2<7>). Synchronous and Trigger modes are selected any time the SYNCSEL bits are set to any value except ‘00000’. The ICTRIG bit selects either Synchronous or Trigger mode; setting the bit selects Trigger mode operation. In both modes, the SYNCSEL bits determine the sync/trigger source. When the SYNCSEL bits are set to ‘00000’ and ICTRIG is set, the module operates in Software Trigger mode. In this case, capture operations are started by manually setting the TRIGSTAT bit (ICxCON2<6>). FIGURE 13-1: INPUT CAPTURE BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 34. “Input Capture with Dedicated Timer” (DS39722). ICxBUF 4-Level FIFO Buffer ICx Pin(1) ICM<2:0> Edge Detect Logic Set ICxIF ICI<1:0> ICOV, ICBNE Interrupt Logic System Bus Prescaler Counter 1:1/4/16 and Clock Synchronizer Note 1: The ICx inputs must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral Pin Select” for more information. Event and Trigger and Sync Logic Clock IC Clock Select Sources Trigger and Sync Sources ICTSEL<2:0> SYNCSEL<4:0> TRIGGER 16 16 16 ICxTMR Increment Reset PIC24FJ256GB110 FAMILY DS39897C-page 170  2009 Microchip Technology Inc. 13.1.2 CASCADED (32-BIT) MODE By default, each module operates independently with its own 16-bit timer. To increase resolution, adjacent even and odd modules can be configured to function as a single 32-bit module. (For example, modules 1 and 2 are paired, as are modules 3 and 4, and so on.) The odd numbered module (ICx) provides the Least Significant 16 bits of the 32-bit register pairs, and the even module (ICy) provides the Most Significant 16 bits. Wraparounds of the ICx registers cause an increment of their corresponding ICy registers. Cascaded operation is configured in hardware by setting the IC32 bits (ICxCON2<8>) for both modules. 13.2 Capture Operations The input capture module can be configured to capture timer values and generate interrupts on rising edges on ICx, or all transitions on ICx. Captures can be configured to occur on all rising edges, or just some (every 4th or 16th). Interrupts can be independently configured to generate on each event, or a subset of events. To set up the module for capture operations: 1. Configure the ICx input for one of the available Peripheral Pin Select pins. 2. If Synchronous mode is to be used, disable the sync source before proceeding. 3. Make sure that any previous data has been removed from the FIFO by reading ICxBUF until the ICBNE bit (ICxCON1<3>) is cleared. 4. Set the SYNCSEL bits (ICxCON2<4:0>) to the desired sync/trigger source. 5. Set the ICTSEL bits (ICxCON1<12:10>) for the desired clock source. 6. Set the ICI bits (ICxCON1<6:5>) to the desired interrupt frequency 7. Select Synchronous or Trigger mode operation: a) Check that the SYNCSEL bits are not set to ‘00000’. b) For Synchronous mode, clear the ICTRIG bit (ICxCON2<7>). c) For Trigger mode, set ICTRIG, and clear the TRIGSTAT bit (ICxCON2<6>). 8. Set the ICM bits (ICxCON1<2:0>) to the desired operational mode. 9. Enable the selected trigger/sync source. For 32-bit cascaded operations, the setup procedure is slightly different: 1. Set the IC32 bits for both modules (ICyCON2<8> and (ICxCON2<8>), enabling the even numbered module first. This ensures the modules will start functioning in unison. 2. Set the ICTSEL and SYNCSEL bits for both modules to select the same sync/trigger and time base source. Set the even module first, then the odd module. Both modules must use the same ICTSEL and SYNCSEL settings. 3. Clear the ICTRIG bit of the even module (ICyCON2<7>); this forces the module to run in Synchronous mode with the odd module, regardless of its trigger setting. 4. Use the odd module’s ICI bits (ICxCON1<6:5>) to the desired interrupt frequency. 5. Use the ICTRIG bit of the odd module (ICxCON2<7>) to configure Trigger or Synchronous mode operation. 6. Use the ICM bits of the odd module (ICxCON1<2:0>) to set the desired capture mode. The module is ready to capture events when the time base and the trigger/sync source are enabled. When the ICBNE bit (ICxCON1<3>) becomes set, at least one capture value is available in the FIFO. Read input capture values from the FIFO until the ICBNE clears to ‘0’. For 32-bit operation, read both the ICxBUF and ICyBUF for the full 32-bit timer value (ICxBUF for the lsw, ICyBUF for the msw). At least one capture value is available in the FIFO buffer when the odd module’s ICBNE bit (ICxCON1<3>) becomes set. Continue to read the buffer registers until ICBNE is cleared (perform automatically by hardware). Note: For Synchronous mode operation, enable the sync source as the last step. Both input capture modules are held in Reset until the sync source is enabled.  2009 Microchip Technology Inc. DS39897C-page 171 PIC24FJ256GB110 FAMILY REGISTER 13-1: ICxCON1: INPUT CAPTURE x CONTROL REGISTER 1 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 — — ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — bit 15 bit 8 U-0 R/W-0 R/W-0 R-0, HC R-0, HC R/W-0 R/W-0 R/W-0 — ICI1 ICI0 ICOV ICBNE ICM2(1) ICM1(1) ICM0(1) bit 7 bit 0 Legend: HC = Hardware Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 ICSIDL: Input Capture x Module Stop in Idle Control bit 1 = Input capture module halts in CPU Idle mode 0 = Input capture module continues to operate in CPU Idle mode bit 12-10 ICTSEL<2:0>: Input Capture Timer Select bits 111 = System clock (FOSC/2) 110 = Reserved 101 = Reserved 100 = Timer1 011 = Timer5 010 = Timer4 001 = Timer2 000 = Timer3 bit 9-7 Unimplemented: Read as ‘0’ bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits 11 = Interrupt on every fourth capture event 10 = Interrupt on every third capture event 01 = Interrupt on every second capture event 00 = Interrupt on every capture event bit 4 ICOV: Input Capture x Overflow Status Flag bit (read-only) 1 = Input capture overflow occurred 0 = No input capture overflow occurred bit 3 ICBNE: Input Capture x Buffer Empty Status bit (read-only) 1 = Input capture buffer is not empty, at least one more capture value can be read 0 = Input capture buffer is empty bit 2-0 ICM<2:0>: Input Capture Mode Select bits(1) 111 = Interrupt mode: input capture functions as interrupt pin only when device is in Sleep or Idle mode (rising edge detect only, all other control bits are not applicable) 110 = Unused (module disabled) 101 = Prescaler Capture mode: capture on every 16th rising edge 100 = Prescaler Capture mode: capture on every 4th rising edge 011 = Simple Capture mode: capture on every rising edge 010 = Simple Capture mode: capture on every falling edge 001 = Edge Detect Capture mode: capture on every edge (rising and falling), ICI<1:0> bits do not control interrupt generation for this mode 000 = Input capture module turned off Note 1: The ICx input must also be configured to an available RPn pin. For more information, see Section 10.4 “Peripheral Pin Select”. PIC24FJ256GB110 FAMILY DS39897C-page 172  2009 Microchip Technology Inc. REGISTER 13-2: ICxCON2: INPUT CAPTURE x CONTROL REGISTER 2 U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — IC32 bit 15 bit 8 R/W-0 R/W-0 HS U-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-1 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 bit 7 bit 0 Legend: HS = Hardware Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-9 Unimplemented: Read as ‘0’ bit 8 IC32: Cascade Two IC Modules Enable bit (32-bit operation) 1 = ICx and ICy operate in cascade as a 32-bit module (this bit must be set in both modules) 0 = ICx functions independently as a 16-bit module bit 7 ICTRIG: ICx Trigger/Sync Select bit 1 = Trigger ICx from source designated by SYNCSELx bits 0 = Synchronize ICx with source designated by SYNCSELx bits bit 6 TRIGSTAT: Timer Trigger Status bit 1 = Timer source has been triggered and is running (set in hardware, can be set in software) 0 = Timer source has not been triggered and is being held clear bit 5 Unimplemented: Read as ‘0’ bit 4-0 SYNCSEL<4:0>: Trigger/Synchronization Source Selection bits 11111 = Reserved 11110 = Input Capture 9 11101 = Input Capture 6 11100 = CTMU(1) 11011 = A/D(1) 11010 = Comparator 3(1) 11001 = Comparator 2(1) 11000 = Comparator 1(1) 10111 = Input Capture 4 10110 = Input Capture 3 10101 = Input Capture 2 10100 = Input Capture 1 10011 = Input Capture 8 10010 = Input Capture 7 1000x = reserved 01111 = Timer5 01110 = Timer4 01101 = Timer3 01100 = Timer2 01011 = Timer1 01010 = Input Capture 5 01001 = Output Compare 9 01000 = Output Compare 8 00111 = Output Compare 7 00110 = Output Compare 6 00101 = Output Compare 5 00100 = Output Compare 4 00011 = Output Compare 3 00010 = Output Compare 2 00001 = Output Compare 1 00000 = Not synchronized to any other module Note 1: Use these inputs as trigger sources only and never as sync sources.  2009 Microchip Technology Inc. DS39897C-page 173 PIC24FJ256GB110 FAMILY 14.0 OUTPUT COMPARE WITH DEDICATED TIMERS Devices in the PIC24FJ256GB110 family all feature 9 independent output compare modules. Each of these modules offers a wide range of configuration and operating options for generating pulse trains on internal device events, and can produce pulse-width modulated waveforms for driving power applications. Key features of the output compare module include: • Hardware-configurable for 32-bit operation in all modes by cascading two adjacent modules • Synchronous and Trigger modes of output compare operation, with up to 30 user-selectable trigger/sync sources available • Two separate period registers (a main register, OCxR, and a secondary register, OCxRS) for greater flexibility in generating pulses of varying widths • Configurable for single-pulse or continuous pulse generation on an output event, or continuous PWM waveform generation • Up to 6 clock sources available for each module, driving a separate internal 16-bit counter 14.1 General Operating Modes 14.1.1 SYNCHRONOUS AND TRIGGER MODES By default, the output compare module operates in a free-running mode. The internal 16-bit counter, OCxTMR, runs counts up continuously, wrapping around from FFFFh to 0000h on each overflow, with its period synchronized to the selected external clock source. Compare or PWM events are generated each time a match between the internal counter and one of the period registers occurs. In Synchronous mode, the module begins performing its compare or PWM operation as soon as its selected clock source is enabled. Whenever an event occurs on the selected sync source, the module’s internal counter is reset. In Trigger mode, the module waits for a sync event from another internal module to occur before allowing the counter to run. Free-running mode is selected by default, or any time that the SYNCSEL bits (OCxCON2<4:0>) are set to ‘00000’. Synchronous or Trigger modes are selected any time the SYNCSEL bits are set to any value except ‘00000’. The OCTRIG bit (OCxCON2<7>) selects either Synchronous or Trigger mode; setting the bit selects Trigger mode operation. In both modes, the SYNCSEL bits determine the sync/trigger source. 14.1.2 CASCADED (32-BIT) MODE By default, each module operates independently with its own set of 16-bit timer and duty cycle registers. To increase resolution, adjacent even and odd modules can be configured to function as a single 32-bit module. (For example, modules 1 and 2 are paired, as are modules 3 and 4, and so on.) The odd numbered module (OCx) provides the Least Significant 16 bits of the 32-bit register pairs, and the even module (OCy) provides the Most Significant 16 bits. Wraparounds of the OCx registers cause an increment of their corresponding OCy registers. Cascaded operation is configured in hardware by setting the OC32 bits (OCxCON2<8>) for both modules. Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 35. “Output Compare with Dedicated Timers” (DS39723). PIC24FJ256GB110 FAMILY DS39897C-page 174  2009 Microchip Technology Inc. 14.2 Compare Operations In Compare mode (Figure 14-1), the output compare module can be configured for single-shot or continuous pulse generation; it can also repeatedly toggle an output pin on each timer event. To set up the module for compare operations: 1. Configure the OCx output for one of the available Peripheral Pin Select pins. 2. Calculate the required values for the OCxR and (for Double Compare modes) OCxRS duty cycle registers: a) Determine the instruction clock cycle time. Take into account the frequency of the external clock to the timer source (if one is used) and the timer prescaler settings. b) Calculate time to the rising edge of the output pulse relative to the timer start value (0000h). c) Calculate the time to the falling edge of the pulse based on the desired pulse width and the time to the rising edge of the pulse. 3. Write the rising edge value to OCxR, and the falling edge value to OCxRS. 4. Set the Timer Period register, PRy, to a value equal to or greater than the value in OCxRS. 5. Set the OCM<2:0> bits for the appropriate compare operation (= 0xx). 6. For Trigger mode operations, set OCTRIG to enable Trigger mode. Set or clear TRIGMODE to configure trigger operation, and TRIGSTAT to select a hardware or software trigger. For Synchronous mode, clear OCTRIG. 7. Set the SYNCSEL<4:0> bits to configure the trigger or synchronization source. If free-running timer operation is required, set the SYNCSEL bits to ‘00000’ (no sync/trigger source). 8. Select the time base source with the OCTSEL<2:0> bits. If necessary, set the TON bit for the selected timer which enables the compare time base to count. Synchronous mode operation starts as soon as the time base is enabled; Trigger mode operation starts after a trigger source event occurs. FIGURE 14-1: OUTPUT COMPARE BLOCK DIAGRAM (16-BIT MODE) OCxR Comparator OCxTMR OCxCON1 OCxCON2 OC Output and OCx Interrupt OCx Pin(1) OCxRS Comparator Fault Logic Match Event Match Event Trigger and Sync Logic Clock Select Increment Reset OC Clock Sources Trigger and Sync Sources Reset Match Event OCFA/OCFB OCTSELx SYNCSELx TRIGSTAT TRIGMODE OCTRIG OCMx OCINV OCTRIS FLTOUT FLTTRIEN FLTMD ENFLT0 OCFLT0 Note 1: The OCx outputs must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral Pin Select” for more information.  2009 Microchip Technology Inc. DS39897C-page 175 PIC24FJ256GB110 FAMILY For 32-bit cascaded operation, these steps are also necessary: 1. Set the OC32 bits for both registers (OCyCON2<8> and (OCxCON2<8>). Enable the even numbered module first to ensure the modules will start functioning in unison. 2. Clear the OCTRIG bit of the even module (OCyCON2), so the module will run in Synchronous mode. 3. Configure the desired output and Fault settings for OCy. 4. Force the output pin for OCx to the output state by clearing the OCTRIS bit. 5. If Trigger mode operation is required, configure the trigger options in OCx by using the OCTRIG (OCxCON2<7>), TRIGSTAT (OCxCON2<6>), and SYNCSEL (OCxCON2<4:0>) bits. 6. Configure the desired compare or PWM mode of operation (OCM<2:0>) for OCy first, then for OCx. Depending on the output mode selected, the module holds the OCx pin in its default state, and forces a transition to the opposite state when OCxR matches the timer. In Double Compare modes, OCx is forced back to its default state when a match with OCxRS occurs. The OCxIF interrupt flag is set after an OCxR match in Single Compare modes, and after each OCxRS match in Double Compare modes. Single-shot pulse events only occur once, but may be repeated by simply rewriting the value of the OCxCON1 register. Continuous pulse events continue indefinitely until terminated. 14.3 Pulse-Width Modulation (PWM) Mode In PWM mode, the output compare module can be configured for edge-aligned or center-aligned pulse waveform generation. All PWM operations are double-buffered (buffer registers are internal to the module and are not mapped into SFR space). To configure the output compare module for PWM operation: 1. Configure the OCx output for one of the available Peripheral Pin Select pins. 2. Calculate the desired duty cycles and load them into the OCxR register. 3. Calculate the desired period and load it into the OCxRS register. 4. Select the current OCx as the sync source by writing 0x1F to SYNCSEL<4:0> (OCxCON2<4:0>), and clearing OCTRIG (OCxCON2<7>). 5. Select a clock source by writing the OCTSEL<2:0> (OCxCON<12:10>) bits. 6. Enable interrupts, if required, for the timer and output compare modules. The output compare interrupt is required for PWM Fault pin utilization. 7. Select the desired PWM mode in the OCM<2:0> (OCxCON1<2:0>) bits. 8. If a timer is selected as a clock source, set the TMRy prescale value and enable the time base by setting the TON (TxCON<15>) bit. Note: This peripheral contains input and output functions that may need to be configured by the Peripheral Pin Select. See Section 10.4 “Peripheral Pin Select” for more information. PIC24FJ256GB110 FAMILY DS39897C-page 176  2009 Microchip Technology Inc. FIGURE 14-2: OUTPUT COMPARE BLOCK DIAGRAM (DOUBLE-BUFFERED, 16-BIT PWM MODE) 14.3.1 PWM PERIOD The PWM period is specified by writing to PRy, the Timer Period register. The PWM period can be calculated using Equation 14-1. EQUATION 14-1: CALCULATING THE PWM PERIOD(1) 14.3.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the OCxRS and OCxR registers. The OCxRS and OCxR registers can be written to at any time, but the duty cycle value is not latched until a match between PRy and TMRy occurs (i.e., the period is complete). This provides a double buffer for the PWM duty cycle and is essential for glitchless PWM operation. Some important boundary parameters of the PWM duty cycle include: • If OCxR, OCxRS, and PRy are all loaded with 0000h, the OCx pin will remain low (0% duty cycle). • ·If OCxRS is greater than PRy, the pin will remain high (100% duty cycle). See Example 14-1 for PWM mode timing details. Table 14-1 and Table 14-2 show example PWM frequencies and resolutions for a device operating at 4 MIPS and 10 MIPS, respectively. OCxR buffer Comparator OCxTMR OCxCON1 OCxCON2 OC Output and OCx Interrupt OCx Pin OCxRS buffer Comparator Fault Logic Match Match Trigger and Sync Logic Clock Select Increment Reset OC Clock Sources Trigger and Sync Sources Reset Match Event OCFA/OCFB OCTSELx SYNCSELx TRIGSTAT TRIGMODE OCTRIG OCMx OCINV OCTRIS FLTOUT FLTTRIEN FLTMD ENFLT0 OCFLT0 OCxR OCxRS Event Event Rollover Rollover/Reset Rollover/Reset Note 1: The OCx outputs must be assigned to an available RPn pin before use. Please see Section 10.4 “Peripheral Pin Select” for more information. Note: A PRy value of N will produce a PWM period of N + 1 time base count cycles. For example, a value of 7 written into the PRy register will yield a period consisting of 8 time base cycles. PWM Period = [(PRy) + 1] • TCY • (Timer Prescale Value) PWM Fr where: equency = 1/[PWM Period] Note 1: Based on TCY = TOSC * 2, Doze mode and PLL are disabled.  2009 Microchip Technology Inc. DS39897C-page 177 PIC24FJ256GB110 FAMILY EQUATION 14-2: CALCULATION FOR MAXIMUM PWM RESOLUTION(1) EXAMPLE 14-1: PWM PERIOD AND DUTY CYCLE CALCULATIONS(1) TABLE 14-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 4 MIPS (FCY = 4 MHz)(1) TABLE 14-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 16 MIPS (FCY = 16 MHz)(1) PWM Frequency 7.6 Hz 61 Hz 122 Hz 977 Hz 3.9 kHz 31.3 kHz 125 kHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh Resolution (bits) 16 16 15 12 10 7 5 Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled. PWM Frequency 30.5 Hz 244 Hz 488 Hz 3.9 kHz 15.6 kHz 125 kHz 500 kHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh Resolution (bits) 16 16 15 12 10 7 5 Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled. ( ) Maximum PWM Resolution (bits) = FCY FPWM • (Timer Prescale Value) log10 log10(2) bits Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled. 1. Find the Timer Period register value for a desired PWM frequency of 52.08 kHz, where FOSC = 8 MHz with PLL (32 MHz device clock rate) and a Timer2 prescaler setting of 1:1. TCY = 2 * TOSC = 62.5 ns PWM Period = 1/PWM Frequency = 1/52.08 kHz = 19.2 s PWM Period = (PR2 + 1) • TCY • (Timer 2 Prescale Value) 19.2 s = (PR2 + 1) • 62.5 ns • 1 PR2 = 306 2. Find the maximum resolution of the duty cycle that can be used with a 52.08 kHz frequency and a 32 MHz device clock rate: PWM Resolution = log10(FCY/FPWM)/log102) bits = (log10(16 MHz/52.08 kHz)/log102) bits = 8.3 bits Note 1: Based on TCY = 2 * TOSC; Doze mode and PLL are disabled. PIC24FJ256GB110 FAMILY DS39897C-page 178  2009 Microchip Technology Inc. REGISTER 14-1: OCxCON1: OUTPUT COMPARE x CONTROL REGISTER 1 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 — — OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — — bit 15 bit 8 R/W-0 U-0 U-0 R/W-0, HCS R/W-0 R/W-0 R/W-0 R/W-0 ENFLT0 — — OCFLT0 TRIGMODE OCM2(1) OCM1(1) OCM0(1) bit 7 bit 0 Legend: HCS = Hardware Clearable/Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 OCSIDL: Stop Output Compare x in Idle Mode Control bit 1 = Output Compare x halts in CPU Idle mode 0 = Output Compare x continues to operate in CPU Idle mode bit 12-10 OCTSEL<2:0>: Output Compare x Timer Select bits 111 = System Clock 110 = Reserved 101 = Reserved 100 = Timer1 011 = Timer5 010 = Timer4 001 = Timer3 000 = Timer2 bit 9-8 Unimplemented: Read as ‘0’ bit 7 ENFLT0: Fault 0 Input Enable bit 1 = Fault 0 input is enabled 0 = Fault 0 input is disabled bit 6-5 Unimplemented: Read as ‘0’ bit 4 OCFLT0: PWM Fault Condition Status bit 1 = PWM Fault condition has occurred (cleared in HW only) 0 = No PWM Fault condition has occurred (this bit is only used when OCM<2:0> = 111) bit 3 TRIGMODE: Trigger Status Mode Select bit 1 = TRIGSTAT (OCxCON2<6>) is cleared when OCxRS = OCxTMR or in software 0 = TRIGSTAT is only cleared by software bit 2-0 OCM<2:0>: Output Compare x Mode Select bits(1) 111 = Center-aligned PWM mode on OCx(2) 110 = Edge-aligned PWM Mode on OCx(2) 101 = Double Compare Continuous Pulse mode: Initialize OCx pin low, toggle OCx state continuously on alternate matches of OCxR and OCxRS 100 = Double Compare Single-Shot mode: Initialize OCx pin low, toggle OCx state on matches of OCxR and OCxRS for one cycle 011 = Single Compare Continuous Pulse mode: Compare events continuously toggle OCx pin 010 = Single Compare Single-Shot mode: Initialize OCx pin high, compare event forces OCx pin low 001 = Single Compare Single-Shot mode: Initialize OCx pin low, compare event forces OCx pin high 000 = Output compare channel is disabled Note 1: The OCx output must also be configured to an available RPn pin. For more information, see Section 10.4 “Peripheral Pin Select”. 2: OCFA pin controls the OC1-OC4 channels; OCFB pin controls the OC5-OC9 channels. OCxR and OCxRS are double-buffered only in PWM modes.  2009 Microchip Technology Inc. DS39897C-page 179 PIC24FJ256GB110 FAMILY REGISTER 14-2: OCxCON2: OUTPUT COMPARE x CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 bit 15 bit 8 R/W-0 R/W-0 HS R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 bit 7 bit 0 Legend: HS = Hardware Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 FLTMD: Fault Mode Select bit 1 = Fault mode is maintained until the Fault source is removed and the corresponding OCFLT0 bit is cleared in software 0 = Fault mode is maintained until the Fault source is removed and a new PWM period starts bit 14 FLTOUT: Fault Out bit 1 = PWM output is driven high on a Fault 0 = PWM output is driven low on a Fault bit 13 FLTTRIEN: Fault Output State Select bit 1 = Pin is forced to an output on a Fault condition 0 = Pin I/O condition is unaffected by a Fault bit 12 OCINV: OCMP Invert bit 1 = OCx output is inverted 0 = OCx output is not inverted bit 11-9 Unimplemented: Read as ‘0’ bit 8 OC32: Cascade Two OC Modules Enable bit (32-bit operation) 1 = Cascade module operation enabled 0 = Cascade module operation disabled bit 7 OCTRIG: OCx Trigger/Sync Select bit 1 = Trigger OCx from source designated by the SYNCSELx bits 0 = Synchronize OCx with source designated by the SYNCSELx bits bit 6 TRIGSTAT: Timer Trigger Status bit 1 = Timer source has been triggered and is running 0 = Timer source has not been triggered and is being held clear bit 5 OCTRIS: OCx Output Pin Direction Select bit 1 = OCx pin is tristated 0 = Output compare peripheral x connected to OCx pin Note 1: Never use an OC module as its own trigger source, either by selecting this mode or another equivalent SYNCSEL setting. 2: Use these inputs as trigger sources only and never as sync sources. PIC24FJ256GB110 FAMILY DS39897C-page 180  2009 Microchip Technology Inc. bit 4-0 SYNCSEL<4:0>: Trigger/Synchronization Source Selection bits 11111 = This OC module(1) 11110 = Input Capture 9(2) 11101 = Input Capture 6(2) 11100 = CTMU(2) 11011 = A/D(2) 11010 = Comparator 3(2) 11001 = Comparator 2(2) 11000 = Comparator 1(2) 10111 = Input Capture 4(2) 10110 = Input Capture 3(2) 10101 = Input Capture 2(2) 10100 = Input Capture 1(2) 10011 = Input Capture 8(2) 10010 = Input Capture 7(2) 1000x = reserved 01111 = Timer 5 01110 = Timer 4 01101 = Timer 3 01100 = Timer 2 01011 = Timer 1 01010 = Input Capture 5(2) 01001 = Output Compare 9(1) 01000 = Output Compare 8(1) 00111 = Output Compare 7(1) 00110 = Output Compare 6(1) 00101 = Output Compare 5(1) 00100 = Output Compare 4(1) 00011 = Output Compare 3(1) 00010 = Output Compare 2(1) 00001 = Output Compare 1(1) 00000 = Not synchronized to any other module REGISTER 14-2: OCxCON2: OUTPUT COMPARE x CONTROL REGISTER 2 Note 1: Never use an OC module as its own trigger source, either by selecting this mode or another equivalent SYNCSEL setting. 2: Use these inputs as trigger sources only and never as sync sources.  2009 Microchip Technology Inc. DS39897C-page 181 PIC24FJ256GB110 FAMILY 15.0 SERIAL PERIPHERAL INTERFACE (SPI) The Serial Peripheral Interface (SPI) module is a synchronous serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D Converters, etc. The SPI module is compatible with Motorola’s SPI and SIOP interfaces. All devices of the PIC24FJ256GB110 family include three SPI modules The module supports operation in two buffer modes. In Standard mode, data is shifted through a single serial buffer. In Enhanced Buffer mode, data is shifted through an 8-level FIFO buffer. The module also supports a basic framed SPI protocol while operating in either Master or Slave mode. A total of four framed SPI configurations are supported. The SPI serial interface consists of four pins: • SDIx: Serial Data Input • SDOx: Serial Data Output • SCKx: Shift Clock Input or Output • SSx: Active-Low Slave Select or Frame Synchronization I/O Pulse The SPI module can be configured to operate using 2, 3 or 4 pins. In the 3-pin mode, SSx is not used. In the 2-pin mode, both SDOx and SSx are not used. Block diagrams of the module in Standard and Enhanced modes are shown in Figure 15-1 and Figure 15-2. Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 23. “Serial Peripheral Interface (SPI)” (DS39699). Note: Do not perform read-modify-write operations (such as bit-oriented instructions) on the SPIxBUF register in either Standard or Enhanced Buffer mode. Note: In this section, the SPI modules are referred to together as SPIx or separately as SPI1, SPI2 or SPI3. Special Function Registers will follow a similar notation. For example, SPIxCON1 and SPIxCON2 refer to the control registers for any of the 3 SPI modules. PIC24FJ256GB110 FAMILY DS39897C-page 182  2009 Microchip Technology Inc. To set up the SPI module for the Standard Master mode of operation: 1. If using interrupts: a) Clear the SPIxIF bit in the respective IFS register. b) Set the SPIxIE bit in the respective IEC register. c) Write the SPIxIP bits in the respective IPC register to set the interrupt priority. 2. Write the desired settings to the SPIxCON1 and SPIxCON2 registers with MSTEN (SPIxCON1<5>) = 1. 3. Clear the SPIROV bit (SPIxSTAT<6>). 4. Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). 5. Write the data to be transmitted to the SPIxBUF register. Transmission (and reception) will start as soon as data is written to the SPIxBUF register. To set up the SPI module for the Standard Slave mode of operation: 1. Clear the SPIxBUF register. 2. If using interrupts: a) Clear the SPIxIF bit in the respective IFS register. b) Set the SPIxIE bit in the respective IEC register. c) Write the SPIxIP bits in the respective IPC register to set the interrupt priority. 3. Write the desired settings to the SPIxCON1 and SPIxCON2 registers with MSTEN (SPIxCON1<5>) = 0. 4. Clear the SMP bit. 5. If the CKE bit (SPIxCON1<8>) is set, then the SSEN bit (SPIxCON1<7>) must be set to enable the SSx pin. 6. Clear the SPIROV bit (SPIxSTAT<6>). 7. Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). FIGURE 15-1: SPIx MODULE BLOCK DIAGRAM (STANDARD MODE) Internal Data Bus SDIx SDOx SSx/FSYNCx SCKx SPIxSR bit 0 Shift Control Edge Select Primary FCY 1:1/4/16/64 Enable Prescaler Sync Clock Control SPIxBUF Control Transfer Transfer Read SPIxBUF Write SPIxBUF 16 SPIxCON1<1:0> SPIxCON1<4:2> Master Clock Secondary Prescaler 1:1 to 1:8  2009 Microchip Technology Inc. DS39897C-page 183 PIC24FJ256GB110 FAMILY To set up the SPI module for the Enhanced Buffer Master mode of operation: 1. If using interrupts: a) Clear the SPIxIF bit in the respective IFS register. b) Set the SPIxIE bit in the respective IEC register. c) Write the SPIxIP bits in the respective IPC register. 2. Write the desired settings to the SPIxCON1 and SPIxCON2 registers with MSTEN (SPIxCON1<5>) = 1. 3. Clear the SPIROV bit (SPIxSTAT<6>). 4. Select Enhanced Buffer mode by setting the SPIBEN bit (SPIxCON2<0>). 5. Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). 6. Write the data to be transmitted to the SPIxBUF register. Transmission (and reception) will start as soon as data is written to the SPIxBUF register. To set up the SPI module for the Enhanced Buffer Slave mode of operation: 1. Clear the SPIxBUF register. 2. If using interrupts: a) Clear the SPIxIF bit in the respective IFS register. b) Set the SPIxIE bit in the respective IEC register. c) Write the SPIxIP bits in the respective IPC register to set the interrupt priority. 3. Write the desired settings to the SPIxCON1 and SPIxCON2 registers with MSTEN (SPIxCON1<5>) = 0. 4. Clear the SMP bit. 5. If the CKE bit is set, then the SSEN bit must be set, thus enabling the SSx pin. 6. Clear the SPIROV bit (SPIxSTAT<6>). 7. Select Enhanced Buffer mode by setting the SPIBEN bit (SPIxCON2<0>). 8. Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). FIGURE 15-2: SPIx MODULE BLOCK DIAGRAM (ENHANCED MODE) Internal Data Bus SDIx SDOx SSx/FSYNCx SCKx SPIxSR bit0 Shift Control Edge Select Primary FCY 1:1/4/16/64 Enable Prescaler Secondary Prescaler 1:1 to 1:8 Sync Clock Control SPIxBUF Control Transfer Transfer Read SPIxBUF Write SPIxBUF 16 SPIxCON1<1:0> SPIxCON1<4:2> Master Clock 8-Level FIFO Transmit Buffer 8-Level FIFO Receive Buffer PIC24FJ256GB110 FAMILY DS39897C-page 184  2009 Microchip Technology Inc. REGISTER 15-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 R-0 R-0 R-0 SPIEN(1) — SPISIDL — — SPIBEC2 SPIBEC1 SPIBEC0 bit 15 bit 8 R-0 R/C-0 HS R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF bit 7 bit 0 Legend: C = Clearable bit HS = Hardware settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 SPIEN: SPIx Enable bit(1) 1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins 0 = Disables module bit 14 Unimplemented: Read as ‘0’ bit 13 SPISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-11 Unimplemented: Read as ‘0’ bit 10-8 SPIBEC<2:0>: SPIx Buffer Element Count bits (valid in Enhanced Buffer mode) Master mode: Number of SPI transfers pending. Slave mode: Number of SPI transfers unread. bit 7 SRMPT: Shift Register (SPIxSR) Empty bit (valid in Enhanced Buffer mode) 1 = SPIx Shift register is empty and ready to send or receive 0 = SPIx Shift register is not empty bit 6 SPIROV: Receive Overflow Flag bit 1 = A new byte/word is completely received and discarded. The user software has not read the previous data in the SPIxBUF register. 0 = No overflow has occurred bit 5 SRXMPT: Receive FIFO Empty bit (valid in Enhanced Buffer mode) 1 = Receive FIFO is empty 0 = Receive FIFO is not empty bit 4-2 SISEL<2:0>: SPIx Buffer Interrupt Mode bits (valid in Enhanced Buffer mode) 111 = Interrupt when SPIx transmit buffer is full (SPITBF bit is set) 110 = Interrupt when last bit is shifted into SPIxSR, as a result, the TX FIFO is empty 101 = Interrupt when the last bit is shifted out of SPIxSR, now the transmit is complete 100 = Interrupt when one data is shifted into the SPIxSR, as a result, the TX FIFO has one open spot 011 = Interrupt when SPIx receive buffer is full (SPIRBF bit set) 010 = Interrupt when SPIx receive buffer is 3/4 or more full 001 = Interrupt when data is available in receive buffer (SRMPT bit is set) 000 = Interrupt when the last data in the receive buffer is read, as a result, the buffer is empty (SRXMPT bit set) Note 1: If SPIEN = 1, these functions must be assigned to available RPn pins before use. See Section 10.4 “Peripheral Pin Select” for more information.  2009 Microchip Technology Inc. DS39897C-page 185 PIC24FJ256GB110 FAMILY bit 1 SPITBF: SPIx Transmit Buffer Full Status bit 1 = Transmit not yet started, SPIxTXB is full 0 = Transmit started, SPIxTXB is empty In Standard Buffer mode: Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB. Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR. In Enhanced Buffer mode: Automatically set in hardware when CPU writes SPIxBUF location, loading the last available buffer location. Automatically cleared in hardware when a buffer location is available for a CPU write. bit 0 SPIRBF: SPIx Receive Buffer Full Status bit 1 = Receive complete, SPIxRXB is full 0 = Receive is not complete, SPIxRXB is empty In Standard Buffer mode: Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB. In Enhanced Buffer mode: Automatically set in hardware when SPIx transfers data from SPIxSR to buffer, filling the last unread buffer location. Automatically cleared in hardware when a buffer location is available for a transfer from SPIxSR. REGISTER 15-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER (CONTINUED) Note 1: If SPIEN = 1, these functions must be assigned to available RPn pins before use. See Section 10.4 “Peripheral Pin Select” for more information. PIC24FJ256GB110 FAMILY DS39897C-page 186  2009 Microchip Technology Inc. REGISTER 15-2: SPIXCON1: SPIx CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — DISSCK(1) DISSDO(2) MODE16 SMP CKE(3) bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SSEN(4) CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only)(1) 1 = Internal SPI clock is disabled; pin functions as I/O 0 = Internal SPI clock is enabled bit 11 DISSDO: Disable SDOx pin bit(2) 1 = SDOx pin is not used by module; pin functions as I/O 0 = SDOx pin is controlled by the module bit 10 MODE16: Word/Byte Communication Select bit 1 = Communication is word-wide (16 bits) 0 = Communication is byte-wide (8 bits) bit 9 SMP: SPIx Data Input Sample Phase bit Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time Slave mode: SMP must be cleared when SPIx is used in Slave mode. bit 8 CKE: SPIx Clock Edge Select bit(3) 1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6) 0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6) bit 7 SSEN: Slave Select Enable (Slave mode) bit(4) 1 = SSx pin used for Slave mode 0 = SSx pin not used by module; pin controlled by port function bit 6 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level; active state is a low level 0 = Idle state for clock is a low level; active state is a high level bit 5 MSTEN: Master Mode Enable bit 1 = Master mode 0 = Slave mode Note 1: If DISSCK = 0, SCKx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 2: If DISSDO = 0, SDOx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 3: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). 4: If SSEN = 1, SSx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information.  2009 Microchip Technology Inc. DS39897C-page 187 PIC24FJ256GB110 FAMILY bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode) 111 = Secondary prescale 1:1 110 = Secondary prescale 2:1 ... 000 = Secondary prescale 8:1 bit 1-0 PPRE<1:0>: Primary Prescale bits (Master mode) 11 = Primary prescale 1:1 10 = Primary prescale 4:1 01 = Primary prescale 16:1 00 = Primary prescale 64:1 REGISTER 15-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED) Note 1: If DISSCK = 0, SCKx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 2: If DISSDO = 0, SDOx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 3: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). 4: If SSEN = 1, SSx must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. REGISTER 15-3: SPIxCON2: SPIx CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 FRMEN SPIFSD SPIFPOL — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — SPIFE SPIBEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 FRMEN: Framed SPIx Support bit 1 = Framed SPIx support enabled 0 = Framed SPIx support disabled bit 14 SPIFSD: Frame Sync Pulse Direction Control on SSx pin bit 1 = Frame sync pulse input (slave) 0 = Frame sync pulse output (master) bit 13 SPIFPOL: Frame Sync Pulse Polarity bit (Frame mode only) 1 = Frame sync pulse is active-high 0 = Frame sync pulse is active-low bit 12-2 Unimplemented: Read as ‘0’ bit 1 SPIFE: Frame Sync Pulse Edge Select bit 1 = Frame sync pulse coincides with first bit clock 0 = Frame sync pulse precedes first bit clock bit 0 SPIBEN: Enhanced Buffer Enable bit 1 = Enhanced Buffer enabled 0 = Enhanced Buffer disabled (Legacy mode) PIC24FJ256GB110 FAMILY DS39897C-page 188  2009 Microchip Technology Inc. FIGURE 15-3: SPI MASTER/SLAVE CONNECTION (STANDARD MODE) FIGURE 15-4: SPI MASTER/SLAVE CONNECTION (ENHANCED BUFFER MODES) Serial Receive Buffer (SPIxRXB) Shift Register (SPIxSR) MSb LSb SDIx SDOx PROCESSOR 2 (SPI Slave) SCKx SSx(1) Serial Transmit Buffer (SPIxTXB) Serial Receive Buffer (SPIxRXB) Shift Register (SPIxSR) MSb LSb SDOx SDIx PROCESSOR 1 (SPI Master) Serial Clock SSEN (SPIxCON1<7>) = 1 and MSTEN (SPIxCON1<5>) = 0 Note 1: Using the SSx pin in Slave mode of operation is optional. 2: User must write transmit data to read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers are memory mapped to SPIxBUF. SCKx Serial Transmit Buffer (SPIxTXB) MSTEN (SPIxCON1<5>) = 1) SPIx Buffer (SPIxBUF)(2) SPIx Buffer (SPIxBUF)(2) Shift Register (SPIxSR) MSb LSb SDIx SDOx PROCESSOR 2 (SPI Enhanced Buffer Slave) SCKx SSx(1) Shift Register (SPIxSR) MSb LSb SDOx SDIx PROCESSOR 1 (SPI Enhanced Buffer Master) Serial Clock SSEN (SPIxCON1<7>) = 1, Note 1: Using the SSx pin in Slave mode of operation is optional. 2: User must write transmit data to read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers are memory mapped to SPIxBUF. SSx(1) SCKx 8-Level FIFO Buffer MSTEN (SPIxCON1<5>) = 1 and SPIx Buffer (SPIxBUF)(2) 8-Level FIFO Buffer SPIx Buffer (SPIxBUF)(2) SPIBEN (SPIxCON2<0>) = 1 MSTEN (SPIxCON1<5>) = 0 and SPIBEN (SPIxCON2<0>) = 1  2009 Microchip Technology Inc. DS39897C-page 189 PIC24FJ256GB110 FAMILY FIGURE 15-5: SPI MASTER, FRAME MASTER CONNECTION DIAGRAM FIGURE 15-6: SPI MASTER, FRAME SLAVE CONNECTION DIAGRAM FIGURE 15-7: SPI SLAVE, FRAME MASTER CONNECTION DIAGRAM FIGURE 15-8: SPI SLAVE, FRAME SLAVE CONNECTION DIAGRAM SDOx SDIx PIC24F Serial Clock SSx SCKx Frame Sync Pulse SDIx SDOx PROCESSOR 2 SSx SCKx (SPI Master, Frame Master) SDOx SDIx PIC24F Serial Clock SSx SCKx Frame Sync Pulse SDIx SDOx PROCESSOR 2 SSx SCKx (SPI Master, Frame Slave) SDOx SDIx PIC24F Serial Clock SSx SCKx Frame Sync. Pulse SDIx SDOx PROCESSOR 2 SSx SCKx (SPI Slave, Frame Master) SDOx SDIx PIC24F Serial Clock SSx SCKx Frame Sync Pulse SDIx SDOx PROCESSOR 2 SSx SCKx (SPI Slave, Frame Slave) PIC24FJ256GB110 FAMILY DS39897C-page 190  2009 Microchip Technology Inc. EQUATION 15-1: RELATIONSHIP BETWEEN DEVICE AND SPI CLOCK SPEED(1) TABLE 15-1: SAMPLE SCK FREQUENCIES(1,2) FCY = 16 MHz Secondary Prescaler Settings 1:1 2:1 4:1 6:1 8:1 Primary Prescaler Settings 1:1 Invalid 8000 4000 2667 2000 4:1 4000 2000 1000 667 500 16:1 1000 500 250 167 125 64:1 250 125 63 42 31 FCY = 5 MHz Primary Prescaler Settings 1:1 5000 2500 1250 833 625 4:1 1250 625 313 208 156 16:1 313 156 78 52 39 64:1 78 39 20 13 10 Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled. 2: SCKx frequencies shown in kHz. Primary Prescaler * Secondary Prescaler FCY FSCK = Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.  2009 Microchip Technology Inc. DS39897C-page 191 PIC24FJ256GB110 FAMILY 16.0 INTER-INTEGRATED CIRCUIT (I2C™) The Inter-Integrated Circuit (I2C) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, display drivers, A/D Converters, etc. The I2C module supports these features: • Independent master and slave logic • 7-bit and 10-bit device addresses • General call address, as defined in the I2C protocol • Clock stretching to provide delays for the processor to respond to a slave data request • Both 100 kHz and 400 kHz bus specifications. • Configurable address masking • Multi-Master modes to prevent loss of messages in arbitration • Bus Repeater mode, allowing the acceptance of all messages as a slave regardless of the address • Automatic SCL A block diagram of the module is shown in Figure 16-1. 16.1 Communicating as a Master in a Single Master Environment The details of sending a message in Master mode depends on the communications protocol for the device being communicated with. Typically, the sequence of events is as follows: 1. Assert a Start condition on SDAx and SCLx. 2. Send the I2C device address byte to the slave with a write indication. 3. Wait for and verify an Acknowledge from the slave. 4. Send the first data byte (sometimes known as the command) to the slave. 5. Wait for and verify an Acknowledge from the slave. 6. Send the serial memory address low byte to the slave. 7. Repeat steps 4 and 5 until all data bytes are sent. 8. Assert a Repeated Start condition on SDAx and SCLx. 9. Send the device address byte to the slave with a read indication. 10. Wait for and verify an Acknowledge from the slave. 11. Enable master reception to receive serial memory data. 12. Generate an ACK or NACK condition at the end of a received byte of data. 13. Generate a Stop condition on SDAx and SCLx. Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 24. “Inter-Integrated Circuit (I2C™)” (DS39702). PIC24FJ256GB110 FAMILY DS39897C-page 192  2009 Microchip Technology Inc. FIGURE 16-1: I2C™ BLOCK DIAGRAM I2CxRCV Internal Data Bus SCLx SDAx Shift Match Detect I2CxADD Start and Stop Bit Detect Clock Address Match Clock Stretching I2CxTRN LSB Shift Clock BRG Down Counter Reload Control TCY/2 Start and Stop Bit Generation Acknowledge Generation Collision Detect I2CxCON I2CxSTAT Control Logic Read LSB Write Read I2CxBRG I2CxRSR Write Read Write Read Write Read Write Read Write Read I2CxMSK  2009 Microchip Technology Inc. DS39897C-page 193 PIC24FJ256GB110 FAMILY 16.2 Setting Baud Rate When Operating as a Bus Master To compute the Baud Rate Generator reload value, use Equation 16-1. EQUATION 16-1: COMPUTING BAUD RATE RELOAD VALUE(1,2) 16.3 Slave Address Masking The I2CxMSK register (Register 16-3) designates address bit positions as “don’t care” for both 7-Bit and 10-Bit Addressing modes. Setting a particular bit location (= 1) in the I2CxMSK register causes the slave module to respond whether the corresponding address bit value is a ‘0’ or a ‘1’. For example, when I2CxMSK is set to ‘00100000’, the slave module will detect both addresses, ‘0000000’ and ‘0100000’. To enable address masking, the IPMI (Intelligent Peripheral Management Interface) must be disabled by clearing the IPMIEN bit (I2CxCON<11>). TABLE 16-1: I2C™ CLOCK RATES(1,2) TABLE 16-2: I2C™ RESERVED ADDRESSES(1) I2CxBRG FCY FSCL ----------- FCY  – -1---0------0---0---0------0---0---0- =   – 1 FSCL FCY I2CxBRG 1 FCY + + -1---0------0---0---0------0---0---0- = ---------------------------------------------------------------------- or Note 1: Based on FCY = FOSC/2; Doze mode and PLL are disabled. 2: These clock rate values are for guidance only. The actual clock rate can be affected by various system level parameters. The actual clock rate should be measured in its intended application. Note: As a result of changes in the I2C™ protocol, the addresses in Table 16-2 are reserved and will not be Acknowledged in Slave mode. This includes any address mask settings that include any of these addresses. Required System FSCL FCY I2CxBRG Value Actual FSCL (Decimal) (Hexadecimal) 100 kHz 16 MHz 157 9D 100 kHz 100 kHz 8 MHz 78 4E 100 kHz 100 kHz 4 MHz 39 27 99 kHz 400 kHz 16 MHz 37 25 404 kHz 400 kHz 8 MHz 18 12 404 kHz 400 kHz 4 MHz 9 9 385 kHz 400 kHz 2 MHz 4 4 385 kHz 1 MHz 16 MHz 13 D 1.026 MHz 1 MHz 8 MHz 6 6 1.026MHz 1 MHz 4 MHz 3 3 0.909MHz Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled. 2: These clock rate values are for guidance only. The actual clock rate can be affected by various system level parameters. The actual clock rate should be measured in its intended application. Slave Address R/W Bit Description 0000 000 0 General Call Address(2) 0000 000 1 Start Byte 0000 001 x Cbus Address 0000 010 x Reserved 0000 011 x Reserved 0000 1xx x HS Mode Master Code 1111 1xx x Reserved 1111 0xx x 10-Bit Slave Upper Byte(3) Note 1: The address bits listed here will never cause an address match, independent of address mask settings. 2: Address will be Acknowledged only if GCEN = 1. 3: Match on this address can only occur on the upper byte in 10-Bit Addressing mode. PIC24FJ256GB110 FAMILY DS39897C-page 194  2009 Microchip Technology Inc. REGISTER 16-1: I2CxCON: I2Cx CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-1, HC R/W-0 R/W-0 R/W-0 R/W-0 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: HC = Hardware Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 I2CEN: I2Cx Enable bit 1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins 0 = Disables I2Cx module. All I2C pins are controlled by port functions. bit 14 Unimplemented: Read as ‘0’ bit 13 I2CSIDL: Stop in Idle Mode bit 1 = Discontinues module operation when device enters an Idle mode 0 = Continues module operation in Idle mode bit 12 SCLREL: SCLx Release Control bit (when operating as I2C Slave) 1 = Releases SCLx clock 0 = Holds SCLx clock low (clock stretch) If STREN = 1: Bit is R/W (i.e., software may write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear at beginning of slave transmission. Hardware clear at end of slave reception. If STREN = 0: Bit is R/S (i.e., software may only write ‘1’ to release clock). Hardware clear at beginning of slave transmission. bit 11 IPMIEN: Intelligent Platform Management Interface (IPMI) Enable bit 1 = IPMI Support mode is enabled; all addresses Acknowledged 0 = IPMI mode disabled bit 10 A10M: 10-Bit Slave Addressing bit 1 = I2CxADD is a 10-bit slave address 0 = I2CxADD is a 7-bit slave address bit 9 DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 = Slew rate control enabled bit 8 SMEN: SMBus Input Levels bit 1 = Enables I/O pin thresholds compliant with SMBus specification 0 = Disables SMBus input thresholds bit 7 GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enables interrupt when a general call address is received in the I2CxRSR (module is enabled for reception) 0 = General call address disabled bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave) Used in conjunction with SCLREL bit. 1 = Enables software or receive clock stretching 0 = Disables software or receive clock stretching  2009 Microchip Technology Inc. DS39897C-page 195 PIC24FJ256GB110 FAMILY bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master. Applicable during master receive.) Value that will be transmitted when the software initiates an Acknowledge sequence. 1 = Sends NACK during Acknowledge 0 = Sends ACK during Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (When operating as I2C master. Applicable during master receive.) 1 = Initiates Acknowledge sequence on SDAx and SCLx pins and transmits ACKDT data bit. Hardware clear at end of master Acknowledge sequence. 0 = Acknowledge sequence not in progress bit 3 RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte. 0 = Receives sequence not in progress bit 2 PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiates Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence. 0 = Stop condition not in progress bit 1 RSEN: Repeated Start Condition Enabled bit (when operating as I2C master) 1 = Initiates Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master Repeated Start sequence. 0 = Repeated Start condition not in progress bit 0 SEN: Start Condition Enabled bit (when operating as I2C master) 1 = Initiates Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence. 0 = Start condition not in progress REGISTER 16-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED) PIC24FJ256GB110 FAMILY DS39897C-page 196  2009 Microchip Technology Inc. REGISTER 16-2: I2CxSTAT: I2Cx STATUS REGISTER R-0, HSC R-0, HSC U-0 U-0 U-0 R/C-0, HS R-0, HSC R-0, HSC ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 bit 15 bit 8 R/C-0, HS R/C-0, HS R-0, HSC R/C-0, HSC R/C-0, HSC R-0, HSC R-0, HSC R-0, HSC IWCOL I2COV D/A P S R/W RBF TBF bit 7 bit 0 Legend: C = Clearable bit HS = Hardware Settable bit HSC = Hardware Settable/Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ACKSTAT: Acknowledge Status bit 1 = NACK was detected last 0 = ACK was detected last Hardware set or clear at end of Acknowledge. bit 14 TRSTAT: Transmit Status bit (When operating as I2C master. Applicable to master transmit operation.) 1 = Master transmit is in progress (8 bits + ACK) 0 = Master transmit is not in progress Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge. bit 13-11 Unimplemented: Read as ‘0’ bit 10 BCL: Master Bus Collision Detect bit 1 = A bus collision has been detected during a master operation 0 = No collision Hardware set at detection of bus collision. bit 9 GCSTAT: General Call Status bit 1 = General call address was received 0 = General call address was not received Hardware set when address matches general call address. Hardware clear at Stop detection. bit 8 ADD10: 10-Bit Address Status bit 1 = 10-bit address was matched 0 = 10-bit address was not matched Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection. bit 7 IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CxTRN register failed because the I2C module is busy 0 = No collision Hardware set at occurrence of write to I2CxTRN while busy (cleared by software). bit 6 I2COV: Receive Overflow Flag bit 1 = A byte was received while the I2CxRCV register is still holding the previous byte 0 = No overflow Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software). bit 5 D/A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the last byte received was data 0 = Indicates that the last byte received was device address Hardware clear at device address match. Hardware set by after transmission finishes, or by reception of slave byte.  2009 Microchip Technology Inc. DS39897C-page 197 PIC24FJ256GB110 FAMILY bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 3 S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been detected last 0 = Start bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 2 R/W: Read/Write Information bit (when operating as I2C slave) 1 = Read – indicates data transfer is output from slave 0 = Write – indicates data transfer is input to slave Hardware set or clear after reception of I2C device address byte. bit 1 RBF: Receive Buffer Full Status bit 1 = Receive complete, I2CxRCV is full 0 = Receive not complete, I2CxRCV is empty Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads I2CxRCV. bit 0 TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CxTRN is full 0 = Transmit complete, I2CxTRN is empty Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission. REGISTER 16-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED) PIC24FJ256GB110 FAMILY DS39897C-page 198  2009 Microchip Technology Inc. REGISTER 16-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — AMSK9 AMSK8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-10 Unimplemented: Read as ‘0’ bit 9-0 AMSK<9:0>: Mask for Address Bit x Select bits 1 = Enable masking for bit x of incoming message address; bit match not required in this position 0 = Disable masking for bit x; bit match required in this position  2009 Microchip Technology Inc. DS39897C-page 199 PIC24FJ256GB110 FAMILY 17.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) The Universal Asynchronous Receiver Transmitter (UART) module is one of the serial I/O modules available in the PIC24F device family. The UART is a full-duplex asynchronous system that can communicate with peripheral devices, such as personal computers, LIN, RS-232 and RS-485 interfaces. The module also supports a hardware flow control option with the UxCTS and UxRTS pins and also includes an IrDA® encoder and decoder. The primary features of the UART module are: • Full-Duplex, 8 or 9-Bit Data Transmission through the UxTX and UxRX Pins • Even, Odd or No Parity Options (for 8-bit data) • One or two Stop bits • Hardware Flow Control Option with UxCTS and UxRTS Pins • Fully Integrated Baud Rate Generator with 16-Bit Prescaler • Baud Rates Ranging from 1 Mbps to 15 bps at 16 MIPS • 4-Deep, First-In-First-Out (FIFO) Transmit Data Buffer • 4-Deep FIFO Receive Data Buffer • Parity, Framing and Buffer Overrun Error Detection • Support for 9-bit mode with Address Detect (9th bit = 1) • Transmit and Receive Interrupts • Loopback mode for Diagnostic Support • Support for Sync and Break Characters • Supports Automatic Baud Rate Detection • IrDA Encoder and Decoder Logic • 16x Baud Clock Output for IrDA® Support A simplified block diagram of the UART is shown in Figure 17-1. The UART module consists of these key important hardware elements: • Baud Rate Generator • Asynchronous Transmitter • Asynchronous Receiver FIGURE 17-1: UART SIMPLIFIED BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 21. “UART” (DS39708). UxRX IrDA® Hardware Flow Control UARTx Receiver UARTx Transmitter UxTX UxCTS UxRTS/BCLKx Baud Rate Generator Note: The UART inputs and outputs must all be assigned to available RPn pins before use. Please see Section 10.4 “Peripheral Pin Select” for more information. PIC24FJ256GB110 FAMILY DS39897C-page 200  2009 Microchip Technology Inc. 17.1 UART Baud Rate Generator (BRG) The UART module includes a dedicated 16-bit Baud Rate Generator. The UxBRG register controls the period of a free-running, 16-bit timer. Equation 17-1 shows the formula for computation of the baud rate with BRGH = 0. EQUATION 17-1: UART BAUD RATE WITH BRGH = 0(1,2) Example 17-1 shows the calculation of the baud rate error for the following conditions: • FCY = 4 MHz • Desired Baud Rate = 9600 The maximum baud rate (BRGH = 0) possible is FCY/16 (for UxBRG = 0) and the minimum baud rate possible is FCY/(16 * 65536). Equation 17-2 shows the formula for computation of the baud rate with BRGH = 1. EQUATION 17-2: UART BAUD RATE WITH BRGH = 1(1,2) The maximum baud rate (BRGH = 1) possible is FCY/4 (for UxBRG = 0) and the minimum baud rate possible is FCY/(4 * 65536). Writing a new value to the UxBRG register causes the BRG timer to be reset (cleared). This ensures the BRG does not wait for a timer overflow before generating the new baud rate. EXAMPLE 17-1: BAUD RATE ERROR CALCULATION (BRGH = 0)(1) Note 1: FCY denotes the instruction cycle clock frequency (FOSC/2). 2: Based on FCY = FOSC/2, Doze mode and PLL are disabled. Baud Rate = FCY 16 • (UxBRG + 1) FCY 16 • Baud Rate UxBRG = – 1 Baud Rate = FCY 4 • (UxBRG + 1) FCY 4 • Baud Rate UxBRG = – 1 Note 1: FCY denotes the instruction cycle clock frequency. 2: Based on FCY = FOSC/2, Doze mode and PLL are disabled. Desired Baud Rate = FCY/(16 (UxBRG + 1)) Solving for UxBRG value: UxBRG = ((FCY/Desired Baud Rate)/16) – 1 UxBRG = ((4000000/9600)/16) – 1 UxBRG = 25 Calculated Baud Rate= 4000000/(16 (25 + 1)) = 9615 Error = (Calculated Baud Rate – Desired Baud Rate) Desired Baud Rate = (9615 – 9600)/9600 = 0.16% Note 1: Based on FCY = FOSC/2, Doze mode and PLL are disabled.  2009 Microchip Technology Inc. DS39897C-page 201 PIC24FJ256GB110 FAMILY 17.2 Transmitting in 8-Bit Data Mode 1. Set up the UART: a) Write appropriate values for data, parity and Stop bits. b) Write appropriate baud rate value to the UxBRG register. c) Set up transmit and receive interrupt enable and priority bits. 2. Enable the UART. 3. Set the UTXEN bit (causes a transmit interrupt two cycles after being set). 4. Write data byte to lower byte of UxTXREG word. The value will be immediately transferred to the Transmit Shift Register (TSR), and the serial bit stream will start shifting out with next rising edge of the baud clock. 5. Alternately, the data byte may be transferred while UTXEN = 0, and then the user may set UTXEN. This will cause the serial bit stream to begin immediately because the baud clock will start from a cleared state. 6. A transmit interrupt will be generated as per interrupt control bit, UTXISELx. 17.3 Transmitting in 9-Bit Data Mode 1. Set up the UART (as described in Section 17.2 “Transmitting in 8-Bit Data Mode”). 2. Enable the UART. 3. Set the UTXEN bit (causes a transmit interrupt). 4. Write UxTXREG as a 16-bit value only. 5. A word write to UxTXREG triggers the transfer of the 9-bit data to the TSR. Serial bit stream will start shifting out with the first rising edge of the baud clock. 6. A transmit interrupt will be generated as per the setting of control bit, UTXISELx. 17.4 Break and Sync Transmit Sequence The following sequence will send a message frame header made up of a Break, followed by an auto-baud Sync byte. 1. Configure the UART for the desired mode. 2. Set UTXEN and UTXBRK to set up the Break character. 3. Load the UxTXREG with a dummy character to initiate transmission (value is ignored). 4. Write ‘55h’ to UxTXREG; this loads the Sync character into the transmit FIFO. 5. After the Break has been sent, the UTXBRK bit is reset by hardware. The Sync character now transmits. 17.5 Receiving in 8-Bit or 9-Bit Data Mode 1. Set up the UART (as described in Section 17.2 “Transmitting in 8-Bit Data Mode”). 2. Enable the UART. 3. A receive interrupt will be generated when one or more data characters have been received as per interrupt control bit, URXISELx. 4. Read the OERR bit to determine if an overrun error has occurred. The OERR bit must be reset in software. 5. Read UxRXREG. The act of reading the UxRXREG character will move the next character to the top of the receive FIFO, including a new set of PERR and FERR values. 17.6 Operation of UxCTS and UxRTS Control Pins UARTx Clear to Send (UxCTS) and Request to Send (UxRTS) are the two hardware controlled pins that are associated with the UART module. These two pins allow the UART to operate in Simplex and Flow Control mode. They are implemented to control the transmission and reception between the Data Terminal Equipment (DTE). The UEN<1:0> bits in the UxMODE register configure these pins. 17.7 Infrared Support The UART module provides two types of infrared UART support: one is the IrDA clock output to support external IrDA encoder and decoder device (legacy module support) and the other is the full implementation of the IrDA encoder and decoder. Note that because the IrDA modes require a 16x baud clock, they will only work when the BRGH bit (UxMODE<3>) is ‘0’. 17.7.1 IrDA CLOCK OUTPUT FOR EXTERNAL IRDA SUPPORT To support external IrDA encoder and decoder devices, the BCLKx pin (same as the UxRTS pin) can be configured to generate the 16x baud clock. With UEN<1:0> = 11, the BCLKx pin will output the 16x baud clock if the UART module is enabled. It can be used to support the IrDA codec chip. 17.7.2 BUILT-IN IrDA ENCODER AND DECODER The UART has full implementation of the IrDA encoder and decoder as part of the UART module. The built-in IrDA encoder and decoder functionality is enabled using the IREN bit (UxMODE<12>). When enabled (IREN = 1), the receive pin (UxRX) acts as the input from the infrared receiver. The transmit pin (UxTX) acts as the output to the infrared transmitter. PIC24FJ256GB110 FAMILY DS39897C-page 202  2009 Microchip Technology Inc. REGISTER 17-1: UxMODE: UARTx MODE REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 UARTEN(1) — USIDL IREN(2) RTSMD — UEN1 UEN0 bit 15 bit 8 R/C-0, HC R/W-0 R/W-0, HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL bit 7 bit 0 Legend: C = Clearable bit HC = Hardware Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 UARTEN: UARTx Enable bit(1) 1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0> 0 = UARTx is disabled; all UARTx pins are controlled by PORT latches; UARTx power consumption minimal bit 14 Unimplemented: Read as ‘0’ bit 13 USIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 IREN: IrDA® Encoder and Decoder Enable bit(2) 1 = IrDA encoder and decoder enabled 0 = IrDA encoder and decoder disabled bit 11 RTSMD: Mode Selection for UxRTS Pin bit 1 = UxRTS pin in Simplex mode 0 = UxRTS pin in Flow Control mode bit 10 Unimplemented: Read as ‘0’ bit 9-8 UEN1:UEN0: UARTx Enable bits 11 = UxTX, UxRX and BCLKx pins are enabled and used; UxCTS pin controlled by port latches 10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used 01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches 00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLKx pins controlled by port latches bit 7 WAKE: Wake-up on Start Bit Detect During Sleep Mode Enable bit 1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge, bit cleared in hardware on following rising edge 0 = No wake-up enabled bit 6 LPBACK: UARTx Loopback Mode Select bit 1 = Enable Loopback mode 0 = Loopback mode is disabled bit 5 ABAUD: Auto-Baud Enable bit 1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h); cleared in hardware upon completion 0 = Baud rate measurement disabled or completed Note 1: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 2: This feature is only available for the 16x BRG mode (BRGH = 0).  2009 Microchip Technology Inc. DS39897C-page 203 PIC24FJ256GB110 FAMILY bit 4 RXINV: Receive Polarity Inversion bit 1 = UxRX Idle state is ‘0’ 0 = UxRX Idle state is ‘1’ bit 3 BRGH: High Baud Rate Enable bit 1 = High-Speed mode (baud clock generated from FCY/4) 0 = Standard mode (baud clock generated from FCY/16) bit 2-1 PDSEL<1:0>: Parity and Data Selection bits 11 = 9-bit data, no parity 10 = 8-bit data, odd parity 01 = 8-bit data, even parity 00 = 8-bit data, no parity bit 0 STSEL: Stop Bit Selection bit 1 = Two Stop bits 0 = One Stop bit REGISTER 17-1: UxMODE: UARTx MODE REGISTER (CONTINUED) Note 1: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. 2: This feature is only available for the 16x BRG mode (BRGH = 0). PIC24FJ256GB110 FAMILY DS39897C-page 204  2009 Microchip Technology Inc. REGISTER 17-2: UxSTA: UARTx STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 HC R/W-0 R-0 R-1 UTXISEL1 UTXINV(1) UTXISEL0 — UTXBRK UTXEN(2) UTXBF TRMT bit 15 bit 8 R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0 URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA bit 7 bit 0 Legend: C = Clearable bit HC = Hardware Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits 11 = Reserved; do not use 10 = Interrupt when a character is transferred to the Transmit Shift Register (TSR), and as a result, the transmit buffer becomes empty 01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit operations are completed 00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at least one character open in the transmit buffer) bit 14 UTXINV: IrDA® Encoder Transmit Polarity Inversion bit(1) IREN = 0: 1 = UxTX Idle ‘0’ 0 = UxTX Idle ‘1’ IREN = 1: 1 = UxTX Idle ‘1’ 0 = UxTX Idle ‘0’ bit 12 Unimplemented: Read as ‘0’ bit 11 UTXBRK: Transmit Break bit 1 = Send Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop bit; cleared by hardware upon completion 0 = Sync Break transmission disabled or completed bit 10 UTXEN: Transmit Enable bit(2) 1 = Transmit enabled, UxTX pin controlled by UARTx 0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by port. bit 9 UTXBF: Transmit Buffer Full Status bit (read-only) 1 = Transmit buffer is full 0 = Transmit buffer is not full, at least one more character can be written bit 8 TRMT: Transmit Shift Register Empty bit (read-only) 1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed) 0 = Transmit Shift Register is not empty, a transmission is in progress or queued bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits 11 = Interrupt is set on RSR transfer, making the receive buffer full (i.e., has 4 data characters) 10 = Interrupt is set on RSR transfer, making the receive buffer 3/4 full (i.e., has 3 data characters) 0x = Interrupt is set when any character is received and transferred from the RSR to the receive buffer. Receive buffer has one or more characters. Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled (IREN = 1). 2: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information.  2009 Microchip Technology Inc. DS39897C-page 205 PIC24FJ256GB110 FAMILY bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1) 1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect. 0 = Address Detect mode disabled bit 4 RIDLE: Receiver Idle bit (read-only) 1 = Receiver is Idle 0 = Receiver is active bit 3 PERR: Parity Error Status bit (read-only) 1 = Parity error has been detected for the current character (character at the top of the receive FIFO) 0 = Parity error has not been detected bit 2 FERR: Framing Error Status bit (read-only) 1 = Framing error has been detected for the current character (character at the top of the receive FIFO) 0 = Framing error has not been detected bit 1 OERR: Receive Buffer Overrun Error Status bit (clear/read-only) 1 = Receive buffer has overflowed 0 = Receive buffer has not overflowed (clearing a previously set OERR bit (1  0 transition) will reset the receiver buffer and the RSR to the empty state bit 0 URXDA: Receive Buffer Data Available bit (read-only) 1 = Receive buffer has data, at least one more character can be read 0 = Receive buffer is empty REGISTER 17-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED) Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled (IREN = 1). 2: If UARTEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. See Section 10.4 “Peripheral Pin Select” for more information. PIC24FJ256GB110 FAMILY DS39897C-page 206  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 207 PIC24FJ256GB110 FAMILY 18.0 UNIVERSAL SERIAL BUS WITH ON-THE-GO SUPPORT (USB OTG) PIC24FJ256GB110 family devices contain a full-speed and low-speed compatible, On-The-Go (OTG) USB Serial Interface Engine (SIE). The OTG capability allows the device to act either as a USB peripheral device or as a USB embedded host with limited host capabilities. The OTG capability allows the device to dynamically switch from device to host operation using OTG’s Host Negotiation Protocol (HNP). For more details on OTG operation, refer to the “On-The-Go Supplement to the USB 2.0 Specification”, published by the USB-IF. For more details on USB operation, refer to the “Universal Serial Bus Specification”, v2.0. The USB OTG module offers these features: • USB functionality in Device and Host modes, and OTG capabilities for application-controlled mode switching • Software-selectable module speeds of full speed (12 Mbps) or low speed (1.5 Mbps, available in Host mode only) • Support for all four USB transfer types: control, interrupt, bulk and isochronous • 16 bidirectional endpoints for a total of 32 unique endpoints • DMA interface for data RAM access • Queues up to sixteen unique endpoint transfers without servicing • Integrated, on-chip USB transceiver, with support for off-chip transceivers via a digital interface: • Integrated VBUS generation with on-chip comparators and boost generation, and support of external VBUS comparators and regulators through a digital interface • Configurations for on-chip bus pull-up and pull-down resistors A simplified block diagram of the USB OTG module is shown in Figure 18-1. The USB OTG module can function as a USB peripheral device or as a USB host, and may dynamically switch between Device and Host modes under software control. In either mode, the same data paths and buffer descriptors are used for the transmission and reception of data. In discussing USB operation, this section will use a controller-centric nomenclature for describing the direction of the data transfer between the microcontroller and the USB. Rx (Receive) will be used to describe transfers that move data from the USB to the microcontroller, and Tx (Transmit) will be used to describe transfers that move data from the microcontroller to the USB. Table 18-1 shows the relationship between data direction in this nomenclature and the USB tokens exchanged. TABLE 18-1: CONTROLLER-CENTRIC DATA DIRECTION FOR USB HOST OR TARGET This chapter presents the most basic operations needed to implement USB OTG functionality in an application. A complete and detailed discussion of the USB protocol and its OTG supplement are beyond the scope of this data sheet. It is assumed that the user already has a basic understanding of USB architecture and the latest version of the protocol. Not all steps for proper USB operation (such as device enumeration) are presented here. It is recommended that application developers use an appropriate device driver to implement all of the necessary features. Microchip provides a number of application-specific resources, such as USB firmware and driver support. Refer to www.microchip.com for the latest firmware and driver support. Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 27. “USB On-The-Go (OTG)”. USB Mode Direction Rx Tx Device OUT or SETUP IN Host IN OUT or SETUP PIC24FJ256GB110 FAMILY DS39897C-page 208  2009 Microchip Technology Inc. FIGURE 18-1: USB OTG MODULE BLOCK DIAGRAM 48 MHz USB Clock VUSB D+(1) D-(1) USBID(1) VBUS Transceiver VBUSON(1) Comparators USB SRP Charge SRP Discharge Registers and Control Interface Transceiver Power 3.3V Voltage System RAM Full-Speed Pull-up Host Pull-down Host Pull-down Note 1: Pins are multiplexed with digital I/O and other device features. VMIO(1) VPIO(1) DMH(1) DPH(1) DMLN(1) DPLN(1) RCV(1) VBUS Boost Assist External Transceiver Interface USBOEN(1) USB 3.3V Regulator VCMPST1(1) VCMPST2(1) VBUSST(1) VCPCON(1) SIE USB  2009 Microchip Technology Inc. DS39897C-page 209 PIC24FJ256GB110 FAMILY 18.1 Hardware Configuration 18.1.1 DEVICE MODE 18.1.1.1 D+ Pull-up Resistor PIC24FJ256GB110 family devices have a built-in 1.5 k resistor on the D+ line that is available when the microcontroller in operating in device mode. This is used to signal an external Host that the device is operating in Full Speed Device mode. It is engaged by setting the DPPULUP bit (U1OTGCON<7>). Alternatively, an external resistor may be used on D+, as shown in Figure 18-2. FIGURE 18-2: EXTERNAL PULL-UP FOR FULL-SPEED DEVICE MODE 18.1.1.2 Power Modes Many USB applications will likely have several different sets of power requirements and configuration. The most common power modes encountered are: • Bus Power Only, • Self-Power Only and • Dual Power with Self-Power Dominance. Bus Power Only mode (Figure 18-3) is effectively the simplest method. All power for the application is drawn from the USB. To meet the inrush current requirements of the USB 2.0 Specification, the total effective capacitance appearing across VBUS and ground must be no more than 10 F. In the USB Suspend mode, devices must consume no more than 2.5 mA from the 5V VBUS line of the USB cable. During the USB Suspend mode, the D+ or Dpull- up resistor must remain active, which will consume some of the allowed suspend current. In Self-Power Only mode (Figure 18-4), the USB application provides its own power, with very little power being pulled from the USB. Note that an attach indication is added to indicate when the USB has been connected and the host is actively powering VBUS. To meet compliance specifications, the USB module (and the D+ or D- pull-up resistor) should not be enabled until the host actively drives VBUS high. One of the 5.5V tolerant I/O pins may be used for this purpose. The application should never source any current onto the 5V VBUS pin of the USB cable. The Dual-power option with Self-Power Dominance (Figure 18-5) allows the application to use internal power primarily, but switch to power from the USB when no internal power is available. Dual-power devices must also meet all of the special requirements for inrush current and Suspend mode current previously described, and must not enable the USB module until VBUS is driven high. FIGURE 18-3: BUS POWER ONLY FIGURE 18-4: SELF-POWER ONLY FIGURE 18-5: DUAL POWER EXAMPLE PIC®MCU Host Controller/HUB VUSB D+ D- 1.5 k VDD VUSB VSS VBUS ~5V 3.3V Low IQ Regulator Attach Sense VBUS 100 k VDD VUSB VSS VSELF ~3.3V Attach Sense 100 k 100 k VBUS ~5V VBUS VDD VUSB VBUS VSS Attach Sense VBUS VSELF 100 k ~3.3V ~5V 100 k 3.3V Low IQ Regulator PIC24FJ256GB110 FAMILY DS39897C-page 210  2009 Microchip Technology Inc. 18.1.2 HOST AND OTG MODES 18.1.2.1 D+ and D- Pull-down Resistors PIC24FJ256GB110 family devices have built-in 15 k pull-down resistor on the D+ and D- lines. These are used in tandem to signal to the bus that the microcontroller is operating in Host mode. They are engaged by setting the DPPULDWN and DMPULDWN bits (U1OTGCON<5,4>). 18.1.2.2 Power Configurations In Host mode, as well as Host mode in On-the-Go operation, the USB 2.0 specification requires that the Host application supply power on VBUS. Since the microcontroller is running below VBUS and is not able to source sufficient current, a separate power supply must be provided. When the application is always operating in Host mode, a simple circuit can be used to supply VBUS and regulate current on the bus (Figure 18-6). For OTG operation, it is necessary to be able to turn VBUS on or off as needed, as the microcontroller switches between Device and Host modes. A typical example using an external charge pump is shown in Figure 18-7. FIGURE 18-6: HOST INTERFACE EXAMPLE FIGURE 18-7: OTG INTERFACE EXAMPLE A/D pin VUSB VDD VSS D+ DVBUS ID D+ DVBUS ID GND +3.3V +3.3V Polymer PTC Thermal Fuse Micro A/B Connector 150 μF 2 k 2 k 0.1 μF, 3.3V +5V PIC® Microcontroller I/O I/O VSS D+ DVBUS ID D+ DVBUS ID GND Micro A/B Connector 4.7 μF 40 k VDD PIC® Microcontroller 10 μF VIN SELECT SHND PGOOD MCP1253 VOUT C+ CGND 1 μF  2009 Microchip Technology Inc. DS39897C-page 211 PIC24FJ256GB110 FAMILY 18.1.2.3 VBUS Voltage Generation with External Devices When operating as a USB host, either as an A-device in an OTG configuration or as an embedded host, VBUS must be supplied to the attached device. PIC24FJ256GB110 family devices have an internal VBUS boost assist to help generate the required 5V VBUS from the available voltages on the board. This is comprised of a simple PWM output to control a Switch mode power supply, and built-in comparators to monitor output voltage and limit current. To enable voltage generation: 1. Verify that the USB module is powered (U1PWRC<0> = 1) and that the VBUS discharge is disabled (U1OTGCON<0> = 0). 2. Set the PWM period (U1PWMRRS<7:0>) and duty cycle (U1PWMRRS<15:8>) as required. 3. Select the required polarity of the output signal based on the configuration of the external circuit with the PWMPOL bit (U1PWMCON<9>). 4. Select the desired target voltage using the VBUSCHG bit (U1OTGCON<1>). 5. Enable the PWM counter by setting the CNTEN bit to ‘1’ (U1PWMCON<8>). 6. Enable the PWM module by setting the PWMEN bit to ‘1’ (U1PWMCON<15>). 7. Enable the VBUS generation circuit (U1OTGCON<3> = 1). 18.1.3 USING AN EXTERNAL INTERFACE Some applications may require the USB interface to be isolated from the rest of the system. PIC24FJ256GB110 family devices include a complete interface to communicate with and control an external USB transceiver, including the control of data line pull-ups and pull-downs. The VBUS voltage generation control circuit can also be configured for different VBUS generation topologies. Please refer to the “PIC24F Family Reference Manual”, Section 27. “USB On-The-Go (OTG)” for information on using the external interface. 18.1.4 CALCULATING TRANSCEIVER POWER REQUIREMENTS The USB transceiver consumes a variable amount of current depending on the characteristic impedance of the USB cable, the length of the cable, the VUSB supply voltage and the actual data patterns moving across the USB cable. Longer cables have larger capacitances and consume more total energy when switching output states. The total transceiver current consumption will be application-specific. Equation 18-1 can help estimate how much current actually may be required in full-speed applications. Please refer to the “PIC24F Family Reference Manual”, Section 27. “USB On-The-Go (OTG)” for a complete discussion on transceiver power consumption. EQUATION 18-1: ESTIMATING USB TRANSCEIVER CURRENT CONSUMPTION Note: This section describes the general process for VBUS voltage generation and control. Please refer to the “PIC24F Family Reference Manual” for additional examples. IXCVR = + IPULLUP (40 mA • VUSB • PZERO • PIN • LCABLE) (3.3V • 5m) Legend: VUSB – Voltage applied to the VUSB pin in volts (3.0V to 3.6V). PZERO – Percentage (in decimal) of the IN traffic bits sent by the PIC® microcontroller that are a value of ‘0’. PIN – Percentage (in decimal) of total bus bandwidth that is used for IN traffic. LCABLE – Length (in meters) of the USB cable. The USB 2.0 Specification requires that full-speed applications use cables no longer than 5m. IPULLUP – Current which the nominal, 1.5 k pull-up resistor (when enabled) must supply to the USB cable. PIC24FJ256GB110 FAMILY DS39897C-page 212  2009 Microchip Technology Inc. 18.2 USB Buffer Descriptors and the BDT Endpoint buffer control is handled through a structure called the Buffer Descriptor Table (BDT). This provides a flexible method for users to construct and control endpoint buffers of various lengths and configurations. The BDT can be located in any available, 512-byte aligned block of data RAM. The BDT Pointer (U1BDTP1) contains the upper address byte of the BDT, and sets the location of the BDT in RAM. The user must set this pointer to indicate the table’s location. The BDT is composed of Buffer Descriptors (BDs) which are used to define and control the actual buffers in the USB RAM space. Each BD consists of two, 16-bit “soft” (non-fixed-address) registers, BDnSTAT and BDnADR, where n represents one of the 64 possible BDs (range of 0 to 63). BDnSTAT is the status register for BDn, while BDnADR specifies the starting address for the buffer associated with BDn. Depending on the endpoint buffering configuration used, there are up to 64 sets of buffer descriptors, for a total of 256 bytes. At a minimum, the BDT must be at least 8 bytes long. This is because the USB specification mandates that every device must have Endpoint 0 with both input and output for initial setup. Endpoint mapping in the BDT is dependent on three variables: • Endpoint number (0 to 15) • Endpoint direction (Rx or Tx) • Ping-pong settings (U1CNFG1<1:0>) Figure 18-8 illustrates how these variables are used to map endpoints in the BDT. In Host mode, only Endpoint 0 buffer descriptors are used. All transfers utilize the Endpoint 0 buffer descriptor and Endpoint Control register (U1EP0). For received packets, the attached device’s source endpoint is indicated by the value of ENDPT<3:0> in the USB status register (U1STAT<7:4>). For transmitted packet, the attached device’s destination endpoint is indicated by the value written to the Token register (U1TOK). FIGURE 18-8: BDT MAPPING FOR ENDPOINT BUFFERING MODES EP1 Tx Even EP1 Rx Even EP1 Rx Odd EP1 Tx Odd Descriptor Descriptor Descriptor Descriptor EP1 Tx EP15 Tx EP1 Rx EP0 Rx PPB<1:0> = 00 EP0 Tx EP1 Tx No Ping-Pong EP15 Tx EP0 Tx EP0 Rx Even PPB<1:0> = 01 EP0 Rx Odd EP1 Rx Ping-Pong Buffer EP15 Tx Odd EP0 Tx Even EP0 Rx Even PPB<1:0> = 10 EP0 Rx Odd EP0 Tx Odd Ping-Pong Buffers Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Note: Memory area not shown to scale. Descriptor Descriptor Descriptor Descriptor Buffers on EP0 OUT on all EPs EP1 Tx Even EP1 Rx Even EP1 Rx Odd EP1 Tx Odd Descriptor Descriptor Descriptor Descriptor EP15 Tx Odd EP0 Rx PPB<1:0> = 11 EP0 Tx Ping-Pong Buffers Descriptor Descriptor Descriptor on all other EPs except EP0 Total BDT Space: Total BDT Space: Total BDT Space: Total BDT Space: 128 bytes 132 bytes 256 bytes 248 bytes  2009 Microchip Technology Inc. DS39897C-page 213 PIC24FJ256GB110 FAMILY BDs have a fixed relationship to a particular endpoint, depending on the buffering configuration. Table 18-2 provides the mapping of BDs to endpoints. This relationship also means that gaps may occur in the BDT if endpoints are not enabled contiguously. This theoretically means that the BDs for disabled endpoints could be used as buffer space. In practice, users should avoid using such spaces in the BDT unless a method of validating BD addresses is implemented. 18.2.1 BUFFER OWNERSHIP Because the buffers and their BDs are shared between the CPU and the USB module, a simple semaphore mechanism is used to distinguish which is allowed to update the BD and associated buffers in memory. This is done by using the UOWN bit as a semaphore to distinguish which is allowed to update the BD and associated buffers in memory. UOWN is the only bit that is shared between the two configurations of BDnSTAT. When UOWN is clear, the BD entry is “owned” by the microcontroller core. When the UOWN bit is set, the BD entry and the buffer memory are “owned” by the USB peripheral. The core should not modify the BD or its corresponding data buffer during this time. Note that the microcontroller core can still read BDnSTAT while the SIE owns the buffer and vice versa. The buffer descriptors have a different meaning based on the source of the register update. Register 18-1 and Register 18-2 show the differences in BDnSTAT depending on its current “ownership”. When UOWN is set, the user can no longer depend on the values that were written to the BDs. From this point, the USB module updates the BDs as necessary, overwriting the original BD values. The BDnSTAT register is updated by the SIE with the token PID and the transfer count is updated. 18.2.2 DMA INTERFACE The USB OTG module uses a dedicated DMA to access both the BDT and the endpoint data buffers. Since part of the address space of the DMA is dedicated to the Buffer Descriptors, a portion of the memory connected to the DMA must comprise a contiguous address space properly mapped for the access by the module. TABLE 18-2: ASSIGNMENT OF BUFFER DESCRIPTORS FOR THE DIFFERENT BUFFERING MODES Endpoint BDs Assigned to Endpoint Mode 0 (No Ping-Pong) Mode 1 (Ping-Pong on EP0 Out) Mode 2 (Ping-Pong on all EPs) Mode 3 (Ping-Pong on all other EPs, except EP0) Out In Out In Out In Out In 0 0 1 0 (E), 1 (O) 2 0 (E), 1 (O) 2 (E), 3 (O) 0 1 1 2 3 3 4 4 (E), 5 (O) 6 (E), 7 (O) 2 (E), 3 (O) 4 (E), 5 (O) 2 4 5 5 6 8 (E), 9 (O) 10 (E), 11 (O) 6 (E), 7 (O) 8 (E), 9 (O) 3 6 7 7 8 12 (E), 13 (O) 14 (E), 15 (O) 10 (E), 11 (O) 12 (E), 13 (O) 4 8 9 9 10 16 (E), 17 (O) 18 (E), 19 (O) 14 (E), 15 (O) 16 (E), 17 (O) 5 10 11 11 12 20 (E), 21 (O) 22 (E), 23 (O) 18 (E), 19 (O) 20 (E), 21 (O) 6 12 13 13 14 24 (E), 25 (O) 26 (E), 27 (O) 22 (E), 23 (O) 24 (E), 25 (O) 7 14 15 15 16 28 (E), 29 (O) 30 (E), 31 (O) 26 (E), 27 (O) 28 (E), 29 (O) 8 16 17 17 18 32 (E), 33 (O) 34 (E), 35 (O) 30 (E), 31 (O) 32 (E), 33 (O) 9 18 19 19 20 36 (E), 37 (O) 38 (E), 39 (O) 34 (E), 35 (O) 36 (E), 37 (O) 10 20 21 21 22 40 (E), 41 (O) 42 (E), 43 (O) 38 (E), 39 (O) 40 (E), 41 (O) 11 22 23 23 24 44 (E), 45 (O) 46 (E), 47 (O) 42 (E), 43 (O) 44 (E), 45 (O) 12 24 25 25 26 48 (E), 49 (O) 50 (E), 51 (O) 46 (E), 47 (O) 48 (E), 49 (O) 13 26 27 27 28 52 (E), 53 (O) 54 (E), 55 (O) 50 (E), 51 (O) 52 (E), 53 (O) 14 28 29 29 30 56 (E), 57 (O) 58 (E), 59 (O) 54 (E), 55 (O) 56 (E), 57 (O) 15 30 31 31 32 60 (E), 61 (O) 62 (E), 63 (O) 58 (E), 59 (O) 60 (E), 61 (O) Legend: (E) = Even transaction buffer, (O) = Odd transaction buffer PIC24FJ256GB110 FAMILY DS39897C-page 214  2009 Microchip Technology Inc. REGISTER 18-1: BDnSTAT: BUFFER DESCRIPTOR n STATUS REGISTER PROTOTYPE, USB MODE (BD0STAT THROUGH BD63STAT) R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x UOWN DTS PID3 PID2 PID1 PID0 BC9 BC8 bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x BC7 BC6 BC5 BC4 BC3 BC2 BC1 BC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 UOWN: USB Own bit 1 = The USB module owns the BD and its corresponding buffer; the CPU must not modify the BD or the buffer bit 14 DTS: Data Toggle Packet bit 1 = Data 1 packet 0 = Data 0 packet bit 13-10 PID<3:0>: Packet Identifier bits (written by the USB module) In Device mode: Represents the PID of the received token during the last transfer. In Host mode: Represents the last returned PID or the transfer status indicator. bit 9-0 BC<9:0>: Byte Count This represents the number of bytes to be transmitted or the maximum number of bytes to be received during a transfer. Upon completion, the byte count is updated by the USB module with the actual number of bytes transmitted or received.  2009 Microchip Technology Inc. DS39897C-page 215 PIC24FJ256GB110 FAMILY REGISTER 18-2: BDnSTAT: BUFFER DESCRIPTOR n STATUS REGISTER PROTOTYPE, CPU MODE (BD0STAT THROUGH BD63STAT) R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x UOWN DTS(1) 0 0 DTSEN BSTALL BC9 BC8 bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x BC7 BC6 BC5 BC4 BC3 BC2 BC1 BC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 UOWN: USB Own bit 0 = The microcontroller core owns the BD and its corresponding buffer. The USB module ignores all other fields in the BD. bit 14 DTS: Data Toggle Packet bit(1) 1 = Data 1 packet 0 = Data 0 packet bit 13-12 Reserved Function: Maintain as ‘0’ bit 11 DTSEN: Data Toggle Synchronization Enable bit 1 = Data toggle synchronization is enabled; data packets with incorrect sync value will be ignored 0 = No data toggle synchronization is performed bit 10 BSTALL: Buffer Stall Enable bit 1 = Buffer STALL enabled; STALL handshake issued if a token is received that would use the BD in the given location (UOWN bit remains set, BD value is unchanged); corresponding EPSTALL bit will get set on any STALL handshake 0 = Buffer STALL disabled bit 9-0 BC<9:0>: Byte Count bits This represents the number of bytes to be transmitted or the maximum number of bytes to be received during a transfer. Upon completion, the byte count is updated by the USB module with the actual number of bytes transmitted or received. Note 1: This bit is ignored unless DTSEN = 1. PIC24FJ256GB110 FAMILY DS39897C-page 216  2009 Microchip Technology Inc. 18.3 USB Interrupts The USB OTG module has many conditions that can be configured to cause an interrupt. All interrupt sources use the same interrupt vector. Figure 18-9 shows the interrupt logic for the USB module. There are two layers of interrupt registers in the USB module. The top level consists of overall USB status interrupts; these are enabled and flagged in the U1IE and U1IR registers, respectively. The second level consists of USB error conditions, which are enabled and flagged in the U1EIR and U1EIE registers. An interrupt condition in any of these triggers a USB Error Interrupt Flag (UERRIF) in the top level. Interrupts may be used to trap routine events in a USB transaction. Figure 18-10 provides some common events within a USB frame and their corresponding interrupts. FIGURE 18-9: USB OTG INTERRUPT FUNNEL DMAEF DMAEE BTOEF BTOEE DFN8EF DFN8EE CRC16EF CRC16EE CRC5EF (EOFEF) CRC5EE (EOFEE) PIDEF PIDEE ATTACHIF ATTACHIE RESUMEIF RESUMEIE IDLEIF IDLEIE TRNIF TRNIE SOFIF SOFIE URSTIF (DETACHIF) URSTIE (DETACHIE) (UERRIF) UERRIE Set USB1IF STALLIF STALLIE BTSEF BTSEE T1MSECIF TIMSECIE LSTATEIF LSTATEIE ACTVIF ACTVIE SESVDIF SESVDIE SESENDIF SESENDIE VBUSVDIF VBUSVDIE IDIF IDIE Second Level (USB Error) Interrupts Top Level (USB Status) Interrupts Top Level (USB OTG) Interrupts  2009 Microchip Technology Inc. DS39897C-page 217 PIC24FJ256GB110 FAMILY 18.3.1 CLEARING USB OTG INTERRUPTS Unlike device level interrupts, the USB OTG interrupt status flags are not freely writable in software. All USB OTG flag bits are implemented as hardware set only bits. Additionally, these bits can only be cleared in software by writing a ‘1’ to their locations (i.e., performing a MOV type instruction). Writing a ‘0’ to a flag bit (i.e., a BCLR instruction) has no effect. FIGURE 18-10: EXAMPLE OF A USB TRANSACTION AND INTERRUPT EVENTS 18.4 Device Mode Operation The following section describes how to perform a common Device mode task. In Device mode, USB transfers are performed at the transfer level. The USB module automatically performs the status phase of the transfer. 18.4.1 ENABLING DEVICE MODE 1. Reset the Ping-Pong Buffer Pointers by setting, then clearing, the Ping-Pong Buffer Reset bit PPBRST (U1CON<1>). 2. Disable all interrupts (U1IE and U1EIE = 00h). 3. Clear any existing interrupt flags by writing FFh to U1IR and U1EIR. 4. Verify that VBUS is present (non OTG devices only). 5. Enable the USB module by setting the USBEN bit (U1CON<0>). 6. Set the OTGEN bit (U1OTGCON<2>) to enable OTG operation. 7. Enable the endpoint zero buffer to receive the first setup packet by setting the EPRXEN and EPHSHK bits for Endpoint 0 (U1EP0<3,0> = 1). 8. Power up the USB module by setting the USBPWR bit (U1PWRC<0>). 9. Enable the D+ pull-up resistor to signal an attach by setting DPPULUP (U1OTGCON<7>). Note: Throughout this data sheet, a bit that can only be cleared by writing a ‘1’ to its location is referred to as “Write ‘1’ to clear”. In register descriptions, this function is indicated by the descriptor “K”. USB Reset RESET SOF SETUP DATA STATUS SOF SETUPToken Data ACK OUT Token Empty Data ACK Start-of-Frame (SOF) IN Token Data ACK SOFIF URSTIF 1 ms Frame Differential Data From Host From Host To Host From Host To Host From Host From Host From Host To Host Transaction Control Transfer(1) Transaction Complete Note 1: The control transfer shown here is only an example showing events that can occur for every transaction. Typical control transfers will spread across multiple frames. Set TRNIF Set TRNIF Set TRNIF PIC24FJ256GB110 FAMILY DS39897C-page 218  2009 Microchip Technology Inc. 18.4.2 RECEIVING AN IN TOKEN IN DEVICE MODE 1. Attach to a USB host and enumerate as described in Chapter 9 of the USB 2.0 specification. 2. Create a data buffer, and populate it with the data to send to the host. 3. In the appropriate (EVEN or ODD) Tx BD for the desired endpoint: a) Set up the status register (BDnSTAT) with the correct data toggle (DATA0/1) value and the byte count of the data buffer. b) Set up the address register (BDnADR) with the starting address of the data buffer. c) Set the UOWN bit of the status register to ‘1’. 4. When the USB module receives an IN token, it automatically transmits the data in the buffer. Upon completion, the module updates the status register (BDnSTAT) and sets the Transfer Complete Interrupt Flag, TRNIF (U1IR<3>). 18.4.3 RECEIVING AN OUT TOKEN IN DEVICE MODE 1. Attach to a USB host and enumerate as described in Chapter 9 of the USB 2.0 specification. 2. Create a data buffer with the amount of data you are expecting from the host. 3. In the appropriate (EVEN or ODD) Tx BD for the desired endpoint: a) Set up the status register (BDnSTAT) with the correct data toggle (DATA0/1) value and the byte count of the data buffer. b) Set up the address register (BDnADR) with the starting address of the data buffer. c) Set the UOWN bit of the status register to ‘1’. 4. When the USB module receives an OUT token, it automatically receives the data sent by the host to the buffer. Upon completion, the module updates the status register (BDnSTAT) and sets the Transfer Complete Interrupt Flag, TRNIF (U1IR<3>). 18.5 Host Mode Operation The following sections describe how to perform common Host mode tasks. In Host mode, USB transfers are invoked explicitly by the host software. The host software is responsible for the Acknowledge portion of the transfer. Also, all transfers are performed using the Endpoint 0 control register (U1EP0) and buffer descriptors. 18.5.1 ENABLE HOST MODE AND DISCOVER A CONNECTED DEVICE 1. Enable Host mode by setting U1CON<3> (HOSTEN). This causes the Host mode control bits in other USB OTG registers to become available. 2. Enable the D+ and D- pull-down resistors by setting DPPULDWN and DMPULDWN (U1OTGCON<5:4>). Disable the D+ and Dpull- up resistors by clearing DPPULUP and DMPULUP (U1OTGCON<7:6>). 3. At this point, SOF generation begins with the SOF counter loaded with 12,000. Eliminate noise on the USB by clearing the SOFEN bit (U1CON<0>) to disable Start-Of-Frame packet generation. 4. Enable the device attached interrupt by setting ATTACHIE (U1IE<6>). 5. Wait for the device attached interrupt (U1IR<6> = 1). This is signaled by the USB device changing the state of D+ or D- from ‘0’ to ‘1’ (SE0 to J state). After it occurs, wait 100 ms for the device power to stabilize. 6. Check the state of the JSTATE and SE0 bits in U1CON. If the JSTATE bit (U1CON<7>) is ‘0’, the connecting device is low speed. If the connecting device is low speed, set the low LSPDEN and LSPD bits (U1ADDR<7> and U1EP0<7>) to enable low-speed operation. 7. Reset the USB device by setting the USBRST bit (U1CON<4>) for at least 50 ms, sending Reset signaling on the bus. After 50 ms, terminate the Reset by clearing USBRST. 8. To keep the connected device from going into suspend, enable SOF packet generation to keep by setting the SOFEN bit. 9. Wait 10 ms for the device to recover from Reset. 10. Perform enumeration as described by Chapter 9 of the USB 2.0 specification.  2009 Microchip Technology Inc. DS39897C-page 219 PIC24FJ256GB110 FAMILY 18.5.2 COMPLETE A CONTROL TRANSACTION TO A CONNECTED DEVICE 1. Follow the procedure described in Section 18.5.1 “Enable Host Mode and Discover a Connected Device” to discover a device. 2. Set up the Endpoint Control register for bidirectional control transfers by writing 0Dh to U1EP0 (this sets the EPCONDIS, EPTXEN, and EPHSHK bits). 3. Place a copy of the device framework setup command in a memory buffer. See Chapter 9 of the USB 2.0 specification for information on the device framework command set. 4. Initialize the buffer descriptor (BD) for the current (EVEN or ODD) Tx EP0, to transfer the eight bytes of command data for a device framework command (i.e., a GET DEVICE DESCRIPTOR): a) Set the BD data buffer address (BD0ADR) to the starting address of the 8-byte memory buffer containing the command. b) Write 8008h to BD0STAT (this sets the UOWN bit, and sets a byte count of 8). 5. Set the USB device address of the target device in the address register (U1ADDR<6:0>). After a USB bus Reset, the device USB address will be zero. After enumeration, it will be set to another value between 1 and 127. 6. Write D0h to U1TOK; this is a SETUP token to Endpoint 0, the target device’s default control pipe. This initiates a SETUP token on the bus, followed by a data packet. The device handshake is returned in the PID field of BD0STAT after the packets are complete. When the USB module updates BD0STAT, a transfer done interrupt is asserted (the TRNIF flag is set). This completes the setup phase of the setup transaction as referenced in chapter 9 of the USB specification. 7. To initiate the data phase of the setup transaction (i.e., get the data for the GET DEVICE descriptor command), set up a buffer in memory to store the received data. 8. Initialize the current (EVEN or ODD) Rx or Tx (Rx for IN, Tx for OUT) EP0 BD to transfer the data. a) Write C040h to BD0STAT. This sets the UOWN, configures Data Toggle (DTS) to DATA1, and sets the byte count to the length of the data buffer (64 or 40h, in this case). b) Set BD0ADR to the starting address of the data buffer. 9. Write the token register with the appropriate IN or OUT token to Endpoint 0, the target device’s default control pipe (e.g., write 90h to U1TOK for an IN token for a GET DEVICE DESCRIPTOR command). This initiates an IN token on the bus followed by a data packet from the device to the host. When the data packet completes, the BD0STAT is written and a transfer done interrupt is asserted (the TRNIF flag is set). For control transfers with a single packet data phase, this completes the data phase of the setup transaction as referenced in chapter 9 of the USB specification. If more data needs to be transferred, return to step 8. 10. To initiate the status phase of the setup transaction, set up a buffer in memory to receive or send the zero length status phase data packet. 11. Initialize the current (even or odd) Tx EP0 BD to transfer the status data.: a) Set the BDT buffer address field to the start address of the data buffer b) Write 8000h to BD0STAT (set UOWN bit, configure DTS to DATA0, and set byte count to 0). 12. Write the Token register with the appropriate IN or OUT token to Endpoint 0, the target device’s default control pipe (e.g., write 01h to U1TOK for an OUT token for a GET DEVICE DESCRIPTOR command). This initiates an OUT token on the bus followed by a zero length data packet from the host to the device. When the data packet completes, the BD is updated with the handshake from the device, and a transfer done interrupt is asserted (the TRNIF flag is set). This completes the status phase of the setup transaction as described in Chapter 9 of the USB specification. Note: Only one control transaction can be performed per frame. PIC24FJ256GB110 FAMILY DS39897C-page 220  2009 Microchip Technology Inc. 18.5.3 SEND A FULL-SPEED BULK DATA TRANSFER TO A TARGET DEVICE 1. Follow the procedure described in Section 18.5.1 “Enable Host Mode and Discover a Connected Device” and Section 18.5.2 “Complete a Control Transaction to a Connected Device” to discover and configure a device. 2. To enable transmit and receive transfers with handshaking enabled, write 1Dh to U1EP0. If the target device is a low-speed device, also set the LSPD bit (U1EP0<7>). If you want the hardware to automatically retry indefinitely if the target device asserts a NAK on the transfer, clear the Retry Disable bit, RETRYDIS (U1EP0<6>). 3. Set up the BD for the current (EVEN or ODD) Tx EP0 to transfer up to 64 bytes. 4. Set the USB device address of the target device in the address register (U1ADDR<6:0>). 5. Write an OUT token to the desired endpoint to U1TOK. This triggers the module’s transmit state machines to begin transmitting the token and the data. 6. Wait for the Transfer Done Interrupt Flag, TRNIF. This indicates that the BD has been released back to the microprocessor, and the transfer has completed. If the retry disable bit is set, the handshake (ACK, NAK, STALL or ERROR (0Fh)) is returned in the BD PID field. If a STALL interrupt occurs, the pending packet must be dequeued and the error condition in the target device cleared. If a detach interrupt occurs (SE0 for more than 2.5 μs), then the target has detached (U1IR<0> is set). 7. Once the transfer done interrupt occurs (TRNIF is set), the BD can be examined and the next data packet queued by returning to step 2. 18.6 OTG Operation 18.6.1 SESSION REQUEST PROTOCOL (SRP) An OTG A-device may decide to power down the VBUS supply when it is not using the USB link through the Session Request Protocol (SRP). Software may do this by clearing VBUSON (U1OTGCON<3>). When the VBUS supply is powered down, the A-device is said to have ended a USB session. An OTG A-device or Embedded Host may repower the VBUS supply at any time (initiate a new session). An OTG B-device may also request that the OTG A-device repower the VBUS supply (initiate a new session). This is accomplished via Session Request Protocol (SRP). Prior to requesting a new session, the B-device must first check that the previous session has definitely ended. To do this, the B-device must check for two conditions: 1. VBUS supply is below the Session Valid voltage and 2. Both D+ and D- have been low for at least 2 ms. The B-device will be notified of condition 1 by the SESENDIF (U1OTGIR<2>) interrupt. Software will have to manually check for condition 2. The B-device may aid in achieving condition 1 by discharging the VBUS supply through a resistor. Software may do this by setting VBUSDIS (U1OTGCON<0>). After these initial conditions are met, the B-device may begin requesting the new session. The B-device begins by pulsing the D+ data line. Software should do this by setting DPPULUP (U1OTGCON<7>). The data line should be held high for 5 to 10 ms. The B-device then proceeds by pulsing the VBUS supply. Software should do this by setting PUVBUS (U1CNFG2<4>). When an A-device detects SRP signaling (either via the ATTACHIF (U1IR<6>) interrupt or via the SESVDIF (U1OTGIR<3>) interrupt), the A-device must restore the VBUS supply by either setting VBUSON (U1OTGCON<3>), or by setting the I/O port controlling the external power source. The B-device should not monitor the state of the VBUS supply while performing VBUS supply pulsing. When the B-device does detect that the VBUS supply has been restored (via the SESVDIF (U1OTGIR<3>) interrupt), the B-device must re-connect to the USB link by pulling up D+ or D- (via the DPPULUP or DMPULUP). The A-device must complete the SRP by driving USB Reset signaling. Note: USB speed, transceiver and pull-ups should only be configured during the module setup phase. It is not recommended to change these settings while the module is enabled. Note: When the A-device powers down the VBUS supply, the B-device must disconnect its pull-up resistor from power. If the device is self-powered, it can do this by clearing DPPULUP (U1OTGCON<7>) and DMPULUP (U1OTGCON<6>).  2009 Microchip Technology Inc. DS39897C-page 221 PIC24FJ256GB110 FAMILY 18.6.2 HOST NEGOTIATION PROTOCOL (HNP) In USB OTG applications, a Dual Role Device (DRD) is a device that is capable of being either a host or a peripheral. Any OTG DRD must support Host Negotiation Protocol (HNP). HNP allows an OTG B-device to temporarily become the USB host. The A-device must first enable the B-device to follow HNP. Refer to the “On-The-Go Supplement to the USB 2.0 Specification” for more information regarding HNP. HNP may only be initiated at full speed. After being enabled for HNP by the A-device, the B-device requests being the host any time that the USB link is in Suspend state, by simply indicating a disconnect. This can be done in software by clearing DPPULUP and DMPULUP. When the A-device detects the disconnect condition (via the URSTIF (U1IR<0>) interrupt), the A-device may allow the B-device to take over as Host. The A-device does this by signaling connect as a full-speed function. Software may accomplish this by setting DPPULUP. If the A-device responds instead with resume signaling, the A-device remains as host. When the B-device detects the connect condition (via ATTACHIF (U1IR<6>), the B-device becomes host. The B-device drives Reset signaling prior to using the bus. When the B-device has finished in its role as Host, it stops all bus activity and turns on its D+ pull-up resistor by setting DPPULUP. When the A-device detects a suspend condition (Idle for 3 ms), the A-device turns off its D+ pull-up. The A-device may also power-down VBUS supply to end the session. When the A-device detects the connect condition (via ATTACHIF), the A-device resumes host operation, and drives Reset signaling. 18.7 USB OTG Module Registers There are a total of 37 memory mapped registers associated with the USB OTG module. They can be divided into four general categories: • USB OTG Module Control (12) • USB Interrupt (7) • USB Endpoint Management (16) • USB VBUS Power Control (2) This total does not include the (up to) 128 BD registers in the BDT. Their prototypes, described in Register 18-1 and Register 18-2, are shown separately in Section 18.2 “USB Buffer Descriptors and the BDT”. With the exception U1PWMCON and U1PWMRRS, all USB OTG registers are implemented in the Least Significant Byte of the register. Bits in the upper byte are unimplemented, and have no function. Note that some registers are instantiated only in Host mode, while other registers have different bit instantiations and functions in Device and Host modes. Registers described in the following sections are those that have bits with specific control and configuration features. The following registers are used for data or address values only: • U1BDTP1: Specifies the 256-word page in data RAM used for the BDT; 8-bit value with bit 0 fixed as ‘0’ for boundary alignment • U1FRML and U1FRMH: Contains the 11-bit byte counter for the current data frame • U1PWMRRS: Contains the 8-bit value for PWM duty cycle (bits<15:8>) and PWM period (bits<7:0>) for the VBUS boost assist PWM module. PIC24FJ256GB110 FAMILY DS39897C-page 222  2009 Microchip Technology Inc. 18.7.1 USB OTG MODULE CONTROL REGISTERS REGISTER 18-3: U1OTGSTAT: USB OTG STATUS REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R-0, HSC U-0 R-0, HSC U-0 R-0, HSC R-0, HSC U-0 R-0, HSC ID — LSTATE — SESVD SESEND — VBUSVD bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 ID: ID Pin State Indicator bit 1 = No plug is attached, or a type B cable has been plugged into the USB receptacle 0 = A type A plug has been plugged into the USB receptacle bit 6 Unimplemented: Read as ‘0’ bit 5 LSTATE: Line State Stable Indicator bit 1 = The USB line state (as defined by SE0 and JSTATE) has been stable for the previous 1 ms 0 = The USB line state has NOT been stable for the previous 1 ms bit 4 Unimplemented: Read as ‘0’ bit 3 SESVD: Session Valid Indicator bit 1 = The VBUS voltage is above VA_SESS_VLD (as defined in the USB OTG Specification) on the A or B-device 0 = The VBUS voltage is below VA_SESS_VLD on the A or B-device bit 2 SESEND: B-Session End Indicator bit 1 = The VBUS voltage is below VB_SESS_END (as defined in the USB OTG Specification) on the B-device 0 = The VBUS voltage is above VB_SESS_END on the B-device bit 1 Unimplemented: Read as ‘0’ bit 0 VBUSVD: A-VBUS Valid Indicator bit 1 = The VBUS voltage is above VA_VBUS_VLD (as defined in the USB OTG Specification) on the A-device 0 = The VBUS voltage is below VA_VBUS_VLD on the A-device  2009 Microchip Technology Inc. DS39897C-page 223 PIC24FJ256GB110 FAMILY REGISTER 18-4: U1OTGCON: USB ON-THE-GO CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DPPULUP DMPULUP DPPULDWN(1) DMPULDWN(1) VBUSON(1) OTGEN(1) VBUSCHG(1) VBUSDIS(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 DPPULUP: D+ Pull-Up Enable bit 1 = D+ data line pull-up resistor enabled 0 = D+ data line pull-up resistor disabled bit 6 DMPULUP: D- Pull-Up Enable bit 1 = D- data line pull-up resistor enabled 0 = D- data line pull-up resistor disabled bit 5 DPPULDWN: D+ Pull-Down Enable bit(1) 1 = D+ data line pull-down resistor enabled 0 = D+ data line pull-down resistor disabled bit 4 DMPULDWN: D- Pull-Down Enable bit(1) 1 = D- data line pull-down resistor enabled 0 = D- data line pull-down resistor disabled bit 3 VBUSON: VBUS Power-on bit(1) 1 = VBUS line powered 0 = VBUS line not powered bit 2 OTGEN: OTG Features Enable bit(1) 1 = USB OTG enabled; all D+/D- pull-ups and pull-downs bits are enabled 0 = USB OTG disabled; D+/D- pull-ups and pull-downs are controlled in hardware by the settings of the HOSTEN and USBEN bits (U1CON<3,0>) bit 1 VBUSCHG: VBUS Charge Select bit(1) 1 = VBUS line set to charge to 3.3V 0 = VBUS line set to charge to 5V bit 0 VBUSDIS: VBUS Discharge Enable bit(1) 1 = VBUS line discharged through a resistor 0 = VBUS line not discharged Note 1: These bits are only used in Host mode; do not use in Device mode. PIC24FJ256GB110 FAMILY DS39897C-page 224  2009 Microchip Technology Inc. REGISTER 18-5: U1PWRC: USB POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0, HS U-0 U-0 R/W-0 U-0 U-0 R/W-0, HC R/W-0 UACTPND — — USLPGRD — — USUSPND USBPWR bit 7 bit 0 Legend: HS = Hardware Settable bit HC = Hardware Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 UACTPND: USB Activity Pending bit 1 = Module should not be suspended at the moment (requires USLPGRD bit to be set) 0 = Module may be suspended or powered down bit 6-5 Unimplemented: Read as ‘0’ bit 4 USLPGRD: Sleep/Suspend Guard bit 1 = Indicate to the USB module that it is about to be suspended or powered down 0 = No suspend bit 3-2 Unimplemented: Read as ‘0’ bit 1 USUSPND: USB Suspend Mode Enable bit 1 = USB OTG module is in Suspend mode; USB clock is gated and the transceiver is placed in a low-power state 0 = Normal USB OTG operation bit 0 USBPWR: USB Operation Enable bit 1 = USB OTG module is enabled 0 = USB OTG module is disabled(1) Note 1: Do not clear this bit unless the HOSTEN, USBEN and OTGEN bits (U1CON<3,0> and U1OTGCON<2>) are all cleared.  2009 Microchip Technology Inc. DS39897C-page 225 PIC24FJ256GB110 FAMILY REGISTER 18-6: U1STAT: USB STATUS REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R-0, HSC R-0, HSC R-0, HSC R-0, HSC R-0, HSC R-0, HSC U-0 U-0 ENDPT3 ENDPT2 ENDPT1 ENDPT0 DIR PPBI(1) — — bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7-4 ENDPT<3:0>: Number of the Last Endpoint Activity bits (Represents the number of the BDT updated by the last USB transfer). 1111 = Endpoint 15 1110 = Endpoint 14 .... 0001 = Endpoint 1 0000 = Endpoint 0 bit 3 DIR: Last BD Direction Indicator bit 1 = The last transaction was a transmit transfer (Tx) 0 = The last transaction was a receive transfer (Rx) bit 2 PPBI: Ping-Pong BD Pointer Indicator bit(1) 1 = The last transaction was to the ODD BD bank 0 = The last transaction was to the EVEN BD bank bit 1-0 Unimplemented: Read as ‘0’ Note 1: This bit is only valid for endpoints with available EVEN and ODD BD registers. PIC24FJ256GB110 FAMILY DS39897C-page 226  2009 Microchip Technology Inc. REGISTER 18-7: U1CON: USB CONTROL REGISTER (DEVICE MODE) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R-x, HSC R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — SE0 PKTDIS — HOSTEN RESUME PPBRST USBEN bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6 SE0: Live Single-Ended Zero Flag bit 1 = Single-ended zero active on the USB bus 0 = No single-ended zero detected bit 5 PKTDIS: Packet Transfer Disable bit 1 = SIE token and packet processing disabled; automatically set when a SETUP token is received 0 = SIE token and packet processing enabled bit 4 Unimplemented: Read as ‘0’ bit 3 HOSTEN: Host Mode Enable bit 1 = USB host capability enabled; pull-downs on D+ and D- are activated in hardware 0 = USB host capability disabled bit 2 RESUME: Resume Signaling Enable bit 1 = Resume signaling activated 0 = Resume signaling disabled bit 1 PPBRST: Ping-Pong Buffers Reset bit 1 = Reset all Ping-Pong Buffer Pointers to the EVEN BD banks 0 = Ping-Pong Buffer Pointers not reset bit 0 USBEN: USB Module Enable bit 1 = USB module and supporting circuitry enabled (device attached); D+ pull-up is activated in hardware 0 = USB module and supporting circuitry disabled (device detached)  2009 Microchip Technology Inc. DS39897C-page 227 PIC24FJ256GB110 FAMILY REGISTER 18-8: U1CON: USB CONTROL REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R-x, HSC R-x, HSC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 JSTATE SE0 TOKBUSY USBRST HOSTEN RESUME PPBRST SOFEN bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HSC = Hardware Settable/Clearable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 JSTATE: Live Differential Receiver J State Flag bit 1 = J state (differential ‘0’ in low speed, differential ‘1’ in full speed) detected on the USB 0 = No J state detected bit 6 SE0: Live Single-Ended Zero Flag bit 1 = Single-ended zero active on the USB bus 0 = No single-ended zero detected bit 5 TOKBUSY: Token Busy Status bit 1 = Token being executed by the USB module in On-The-Go state 0 = No token being executed bit 4 USBRST: Module Reset bit 1 = USB Reset has been generated; for software Reset, application must set this bit for 50 ms, then clear it 0 = USB Reset terminated bit 3 HOSTEN: Host Mode Enable bit 1 = USB host capability enabled; pull-downs on D+ and D- are activated in hardware 0 = USB host capability disabled bit 2 RESUME: Resume Signaling Enable bit 1 = Resume signaling activated; software must set bit for 10 ms and then clear to enable remote wake-up 0 = Resume signaling disabled bit 1 PPBRST: Ping-Pong Buffers Reset bit 1 = Reset all Ping-Pong Buffer Pointers to the EVEN BD banks 0 = Ping-Pong Buffer Pointers not reset bit 0 SOFEN: Start-Of-Frame Enable bit 1 = Start-Of-Frame token sent every one 1 millisecond 0 = Start-Of-Frame token disabled PIC24FJ256GB110 FAMILY DS39897C-page 228  2009 Microchip Technology Inc. REGISTER 18-9: U1ADDR: USB ADDRESS REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 LSPDEN(1) ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 LSPDEN: Low-Speed Enable Indicator bit(1) 1 = USB module operates at low speed 0 = USB module operates at full speed bit 6-0 ADDR<6:0>: USB Device Address bits Note 1: Host mode only. In Device mode, this bit is unimplemented and read as ‘0’. REGISTER 18-10: U1TOK: USB TOKEN REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PID3 PID2 PID1 PID0 EP3 EP2 EP1 EP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7-4 PID<3:0>: Token Type Identifier bits 1101 = SETUP (TX) token type transaction(1) 1001 = IN (RX) token type transaction(1) 0001 = OUT (TX) token type transaction(1) bit 3-0 EP<3:0>: Token Command Endpoint Address bits This value must specify a valid endpoint on the attached device. Note 1: All other combinations are reserved and are not to be used.  2009 Microchip Technology Inc. DS39897C-page 229 PIC24FJ256GB110 FAMILY REGISTER 18-11: U1SOF: USB OTG START-OF-TOKEN THRESHOLD REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CNT7 CNT6 CNT5 CNT4 CNT3 CNT2 CNT1 CNT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 CNT<7:0>: Start-Of-Frame Size bits; Value represents 10 + (packet size of n bytes). For example: 0100 1010 = 64-byte packet 0010 1010 = 32-byte packet 0001 0010 = 8-byte packet REGISTER 18-12: U1CNFG1: USB CONFIGURATION REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 UTEYE UOEMON(1) — USBSIDL — — PPB1 PPB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 UTEYE: USB Eye Pattern Test Enable bit 1 = Eye pattern test enabled 0 = Eye pattern test disabled bit 6 UOEMON: USB OE Monitor Enable bit(1) 1 = OE signal active; it indicates intervals during which the D+/D- lines are driving 0 = OE signal inactive bit 5 Unimplemented: Read as ‘0’ bit 4 USBSIDL: USB OTG Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 PPB<1:0>: Ping-Pong Buffers Configuration bit 11 = EVEN/ODD ping-pong buffers enabled for Endpoints 1 to 15 10 = EVEN/ODD ping-pong buffers enabled for all endpoints 01 = EVEN/ODD ping-pong buffer enabled for OUT Endpoint 0 00 = EVEN/ODD ping-pong buffers disabled Note 1: This bit is only active when the UTRDIS bit (U1CNFG2<0>) is set. PIC24FJ256GB110 FAMILY DS39897C-page 230  2009 Microchip Technology Inc. REGISTER 18-13: U1CNFG2: USB CONFIGURATION REGISTER 2 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — PUVBUS EXTI2CEN UVBUSDIS(1) UVCMPDIS(1) UTRDIS(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as ‘0’ bit 4 PUVBUS: VBUS Pull-up Enable bit 1 = Pull-up on VBUS pin enabled 0 = Pull-up on VBUS pin disabled bit 3 EXTI2CEN: I2C™ Interface For External Module Control Enable bit 1 = External module(s) controlled via I2C interface 0 = External module(s) controller via dedicated pins bit 2 UVBUSDIS: On-Chip 5V Boost Regulator Builder Disable bit(1) 1 = On-chip boost regulator builder disabled; digital output control interface enabled 0 = On-chip boost regulator builder active bit 1 UVCMPDIS: On-Chip VBUS Comparator Disable bit(1) 1 = On-chip charge VBUS comparator disabled; digital input status interface enabled 0 = On-chip charge VBUS comparator active bit 0 UTRDIS: On-Chip Transceiver Disable bit(1) 1 = On-chip transceiver disabled; digital transceiver interface enabled 0 = On-chip transceiver active Note 1: Never change these bits while the USBPWR bit is set (U1PWRC<0> = 1).  2009 Microchip Technology Inc. DS39897C-page 231 PIC24FJ256GB110 FAMILY 18.7.2 USB INTERRUPT REGISTERS REGISTER 18-14: U1OTGIR: USB OTG INTERRUPT STATUS REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS U-0 R/K-0, HS IDIF T1MSECIF LSTATEIF ACTVIF SESVDIF SESENDIF — VBUSVDIF bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 IDIF: ID State Change Indicator bit 1 = Change in ID state detected 0 = No ID state change bit 6 T1MSECIF: 1 Millisecond Timer bit 1 = The 1 millisecond timer has expired 0 = The 1 millisecond timer has not expired bit 5 LSTATEIF: Line State Stable Indicator bit 1 = USB line state (as defined by the SE0 and JSTATE bits) has been stable for 1 ms, but different from last time 0 = USB line state has not been stable for 1 ms bit 4 ACTVIF: Bus Activity Indicator bit 1 = Activity on the D+/D- lines or VBUS detected 0 = No activity on the D+/D- lines or VBUS detected bit 3 SESVDIF: Session Valid Change Indicator bit 1 = VBUS has crossed VA_SESS_END (as defined in the USB OTG Specification)(1) 0 = VBUS has not crossed VA_SESS_END bit 2 SESENDIF: B-Device VBUS Change Indicator bit 1 = VBUS change on B-device detected; VBUS has crossed VB_SESS_END (as defined in the USB OTG Specification)(1) 0 = VBUS has not crossed VA_SESS_END bit 1 Unimplemented: Read as ‘0’ bit 0 VBUSVDIF A-Device VBUS Change Indicator bit 1 = VBUS change on A-device detected; VBUS has crossed VA_VBUS_VLD (as defined in the USB OTG Specification)(1) 0 = No VBUS change on A-device detected Note 1: VBUS threshold crossings may be either rising or falling. Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared. PIC24FJ256GB110 FAMILY DS39897C-page 232  2009 Microchip Technology Inc. REGISTER 18-15: U1OTGIE: USB OTG INTERRUPT ENABLE REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 IDIE T1MSECIE LSTATEIE ACTVIE SESVDIE SESENDIE — VBUSVDIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 IDIE: ID Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 6 T1MSECIE: 1 Millisecond Timer Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 5 LSTATEIE: Line State Stable Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 4 ACTVIE: Bus Activity Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 3 SESVDIE: Session Valid Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 2 SESENDIE: B-Device Session End Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 1 Unimplemented: Read as ‘0’ bit 0 VBUSVDIE: A-Device VBUS Valid Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled  2009 Microchip Technology Inc. DS39897C-page 233 PIC24FJ256GB110 FAMILY REGISTER 18-16: U1IR: USB INTERRUPT STATUS REGISTER (DEVICE MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/K-0, HS U-0 R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R-0 R/K-0, HS STALLIF — RESUMEIF IDLEIF TRNIF SOFIF UERRIF URSTIF bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 STALLIF: STALL Handshake Interrupt bit 1 = A STALL handshake was sent by the peripheral during the handshake phase of the transaction in Device mode 0 = A STALL handshake has not been sent bit 6 Unimplemented: Read as ‘0’ bit 5 RESUMEIF: Resume Interrupt bit 1 = A K-state is observed on the D+ or D- pin for 2.5 s (differential ‘1’ for low speed, differential ‘0’ for full speed) 0 = No K-state observed bit 4 IDLEIF: Idle Detect Interrupt bit 1 = Idle condition detected (constant Idle state of 3 ms or more) 0 = No Idle condition detected bit 3 TRNIF: Token Processing Complete Interrupt bit 1 = Processing of current token is complete; read U1STAT register for endpoint information 0 = Processing of current token not complete; clear U1STAT register or load next token from STAT (clearing this bit causes the STAT FIFO to advance) bit 2 SOFIF: Start-Of-Frame Token Interrupt bit 1 = A Start-Of-Frame token received by the peripheral or the Start-Of-Frame threshold reached by the host 0 = No Start-Of-Frame token received or threshold reached bit 1 UERRIF: USB Error Condition Interrupt bit (read-only) 1 = An unmasked error condition has occurred; only error states enabled in the U1EIE register can set this bit 0 = No unmasked error condition has occurred bit 0 URSTIF: USB Reset Interrupt bit 1 = Valid USB Reset has occurred for at least 2.5 s; Reset state must be cleared before this bit can be reasserted 0 = No USB Reset has occurred. Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared. Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared. PIC24FJ256GB110 FAMILY DS39897C-page 234  2009 Microchip Technology Inc. REGISTER 18-17: U1IR: USB INTERRUPT STATUS REGISTER (HOST MODE ONLY) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R-0 R/K-0, HS STALLIF ATTACHIF RESUMEIF IDLEIF TRNIF SOFIF UERRIF DETACHIF bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 STALLIF: STALL Handshake Interrupt bit 1 = A STALL handshake was sent by the peripheral device during the handshake phase of the transaction in Device mode 0 = A STALL handshake has not been sent bit 6 ATTACHIF: Peripheral Attach Interrupt bit 1 = A peripheral attachment has been detected by the module; set if the bus state is not SE0 and there has been no bus activity for 2.5 s 0 = No peripheral attachement detected bit 5 RESUMEIF: Resume Interrupt bit 1 = A K-state is observed on the D+ or D- pin for 2.5 s (differential ‘1’ for low speed, differential ‘0’ for full speed) 0 = No K-state observed bit 4 IDLEIF: Idle Detect Interrupt bit 1 = Idle condition detected (constant Idle state of 3 ms or more) 0 = No Idle condition detected bit 3 TRNIF: Token Processing Complete Interrupt bit 1 = Processing of current token is complete; read U1STAT register for endpoint information 0 = Processing of current token not complete; clear U1STAT register or load next token from U1STAT bit 2 SOFIF: Start-Of-Frame Token Interrupt bit 1 = A Start-Of-Frame token received by the peripheral or the Start-Of-Frame threshold reached by the host 0 = No Start-Of-Frame token received or threshold reached bit 1 UERRIF: USB Error Condition Interrupt bit 1 = An unmasked error condition has occurred; only error states enabled in the U1EIE register can set this bit 0 = No unmasked error condition has occurred bit 0 DETACHIF: Detach Interrupt bit 1 = A peripheral detachment has been detected by the module; Reset state must be cleared before this bit can be reasserted 0 = No peripheral detachment detected. Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared. Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared.  2009 Microchip Technology Inc. DS39897C-page 235 PIC24FJ256GB110 FAMILY REGISTER 18-18: U1IE: USB INTERRUPT ENABLE REGISTER (ALL USB MODES) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STALLIE ATTACHIE(1) RESUMEIE IDLEIE TRNIE SOFIE UERRIE URSTIE DETACHIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 STALLIE: STALL Handshake Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 6 ATTACHIE: Peripheral Attach Interrupt bit (Host mode only)(1) 1 = Interrupt enabled 0 = Interrupt disabled bit 5 RESUMEIE: Resume Interrupt bit 1 = Interrupt enabled 0 = Interrupt disabled bit 4 IDLEIE: Idle Detect Interrupt bit 1 = Interrupt enabled 0 = Interrupt disabled bit 3 TRNIE: Token Processing Complete Interrupt bit 1 = Interrupt enabled 0 = Interrupt disabled bit 2 SOFIE: Start-of-Frame Token Interrupt bit 1 = Interrupt enabled 0 = Interrupt disabled bit 1 UERRIE: USB Error Condition Interrupt bit 1 = Interrupt enabled 0 = Interrupt disabled bit 0 URSTIE or DETACHIE: USB Reset Interrupt (Device mode) or USB Detach Interrupt (Host mode) Enable bit 1 = Interrupt enabled 0 = Interrupt disabled Note 1: Unimplemented in Device mode, read as ‘0’. PIC24FJ256GB110 FAMILY DS39897C-page 236  2009 Microchip Technology Inc. REGISTER 18-19: U1EIR: USB ERROR INTERRUPT STATUS REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/K-0, HS U-0 R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS R/K-0, HS BTSEF — DMAEF BTOEF DFN8EF CRC16EF CRC5EF PIDEF EOFEF bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit K = Write ‘1’ to clear bit HS = Hardware Settable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 BTSEF: Bit Stuff Error Flag bit 1 = Bit stuff error has been detected 0 = No bit stuff error bit 6 Unimplemented: Read as ‘0’ bit 5 DMAEF: DMA Error Flag bit 1 = A USB DMA error condition detected; the data size indicated by the BD byte count field is less than the number of received bytes. The received data is truncated. 0 = No DMA error bit 4 BTOEF: Bus Turnaround Time-out Error Flag bit 1 = Bus turnaround time-out has occurred 0 = No bus turnaround time-out bit 3 DFN8EF: Data Field Size Error Flag bit 1 = Data field was not an integral number of bytes 0 = Data field was an integral number of bytes bit 2 CRC16EF: CRC16 Failure Flag bit 1 = CRC16 failed 0 = CRC16 passed bit 1 For Device mode: CRC5EF: CRC5 Host Error Flag bit 1 = Token packet rejected due to CRC5 error 0 = Token packet accepted (no CRC5 error) For Host mode: EOFEF: End-Of-Frame Error Flag bit 1 = End-Of-Frame error has occurred 0 = End-Of-Frame interrupt disabled bit 0 PIDEF: PID Check Failure Flag bit 1 = PID check failed 0 = PID check passed. Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared. Note: Individual bits can only be cleared by writing a ‘1’ to the bit position as part of a word write operation on the entire register. Using Boolean instructions or bitwise operations to write to a single bit position will cause all set bits at the moment of the write to become cleared.  2009 Microchip Technology Inc. DS39897C-page 237 PIC24FJ256GB110 FAMILY REGISTER 18-20: U1EIE: USB ERROR INTERRUPT ENABLE REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BTSEE — DMAEE BTOEE DFN8EE CRC16EE CRC5EE PIDEE EOFEE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 BTSEE: Bit Stuff Error Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 6 Unimplemented: Read as ‘0’ bit 5 DMAEE: DMA Error Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 4 BTOEE: Bus Turnaround Time-out Error Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 3 DFN8EE: Data Field Size Error Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 2 CRC16EE: CRC16 Failure Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 1 For Device mode: CRC5EE: CRC5 Host Error Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled For Host mode: EOFEE: End-of-Frame Error interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled bit 0 PIDEE: PID Check Failure Interrupt Enable bit 1 = Interrupt enabled 0 = Interrupt disabled PIC24FJ256GB110 FAMILY DS39897C-page 238  2009 Microchip Technology Inc. 18.7.3 USB ENDPOINT MANAGEMENT REGISTERS REGISTER 18-21: U1EPn: USB ENDPOINT CONTROL REGISTERS (n = 0 TO 15) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 LSPD(1) RETRYDIS(1) — EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 LSPD: Low-Speed Direct Connection Enable bit (U1EP0 only)(1) 1 = Direct connection to a low-speed device enabled 0 = Direct connection to a low-speed device disabled bit 6 RETRYDIS: Retry Disable bit (U1EP0 only)(1) 1 = Retry NAK transactions disabled 0 = Retry NAK transactions enabled; retry done in hardware bit 5 Unimplemented: Read as ‘0’ bit 4 EPCONDIS: Bidirectional Endpoint Control bit If EPTXEN and EPRXEN = 1: 1 = Disable Endpoint n from Control transfers; only Tx and Rx transfers allowed 0 = Enable Endpoint n for Control (SETUP) transfers; Tx and Rx transfers also allowed. For all other combinations of EPTXEN and EPRXEN: This bit is ignored. bit 3 EPRXEN: Endpoint Receive Enable bit 1 = Endpoint n receive enabled 0 = Endpoint n receive disabled bit 2 EPTXEN: Endpoint Transmit Enable bit 1 = Endpoint n transmit enabled 0 = Endpoint n transmit disabled bit 1 EPSTALL: Endpoint Stall Status bit 1 = Endpoint n was stalled 0 = Endpoint n was not stalled bit 0 EPHSHK: Endpoint Handshake Enable bit 1 = Endpoint handshake enabled 0 = Endpoint handshake disabled (typically used for isochronous endpoints) Note 1: These bits are available only for U1EP0, and only in Host mode. For all other U1EPn registers, these bits are always unimplemented and read as ‘0’.  2009 Microchip Technology Inc. DS39897C-page 239 PIC24FJ256GB110 FAMILY 18.7.4 USB VBUS POWER CONTROL REGISTER REGISTER 18-22: U1PWMCON: USB VBUS PWM GENERATOR CONTROL REGISTER R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 PWMEN — — — — — PWMPOL CNTEN bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 PWMEN: PWM Enable bit 1 = PWM generator is enabled 0 = PWM generator is disabled; output is held in Reset state specified by PWMPOL bit 14-10 Unimplemented: Read as ‘0’ bit 9 PWMPOL: PWM Polarity bit 1 = PWM output is active-low and resets high 0 = PWM output is active-high and resets low bit 8 CNTEN: PWM Counter Enable bit 1 = Counter is enabled 0 = Counter is disabled bit 7-0 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 240  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 241 PIC24FJ256GB110 FAMILY 19.0 PARALLEL MASTER PORT (PMP) The Parallel Master Port (PMP) module is a parallel 8-bit I/O module, specifically designed to communicate with a wide variety of parallel devices, such as communication peripherals, LCDs, external memory devices and microcontrollers. Because the interface to parallel peripherals varies significantly, the PMP is highly configurable. Key features of the PMP module include: • Up to 16 Programmable Address Lines • Up to 2 Chip Select Lines • Programmable Strobe Options: - Individual Read and Write Strobes or; - Read/Write Strobe with Enable Strobe • Address Auto-Increment/Auto-Decrement • Programmable Address/Data Multiplexing • Programmable Polarity on Control Signals • Legacy Parallel Slave Port Support • Enhanced Parallel Slave Support: - Address Support - 4-Byte Deep Auto-Incrementing Buffer • Programmable Wait States • Selectable Input Voltage Levels FIGURE 19-1: PMP MODULE OVERVIEW Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 13. “Parallel Master Port (PMP)” (DS39713). PMA<0> PMBE PMRD PMWR PMD<7:0> PMENB PMRD/PMWR PMCS1 PMA<1> PMA<13:2> PMALL PMALH PMA<7:0> PMA<15:8> EEPROM Address Bus Data Bus Control Lines PIC24F Microcontroller LCD FIFO 8-Bit Data Up to 16-Bit Address Parallel Master Port Buffer PMA<14> PMCS2 PMA<15> PIC24FJ256GB110 FAMILY DS39897C-page 242  2009 Microchip Technology Inc. REGISTER 19-1: PMCON: PARALLEL PORT CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-0(1) R/W-0(1) R/W-0 R/W-0 R/W-0 PMPEN — PSIDL ADRMUX1 ADRMUX0 PTBEEN PTWREN PTRDEN bit 15 bit 8 R/W-0 R/W-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0 R/W-0 R/W-0 CSF1 CSF0 ALP CS2P CS1P BEP WRSP RDSP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 PMPEN: Parallel Master Port Enable bit 1 = PMP enabled 0 = PMP disabled, no off-chip access performed bit 14 Unimplemented: Read as ‘0’ bit 13 PSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-11 ADRMUX<1:0>: Address/Data Multiplexing Selection bits(1) 11 = Reserved 10 = All 16 bits of address are multiplexed on PMD<7:0> pins 01 = Lower 8 bits of address are multiplexed on PMD<7:0> pins, upper 3 bits are multiplexed on PMA<10:8> 00 = Address and data appear on separate pins bit 10 PTBEEN: Byte Enable Port Enable bit (16-Bit Master mode) 1 = PMBE port enabled 0 = PMBE port disabled bit 9 PTWREN: Write Enable Strobe Port Enable bit 1 = PMWR/PMENB port enabled 0 = PMWR/PMENB port disabled bit 8 PTRDEN: Read/Write Strobe Port Enable bit 1 = PMRD/PMWR port enabled 0 = PMRD/PMWR port disabled bit 7-6 CSF1:CSF0: Chip Select Function bits 11 = Reserved 10 = PMCS1 and PMCS2 function as chip select 01 = PMCS2 functions as chip select, PMCS1 functions as address bit 14 00 = PMCS1 and PMCS2 function as address bits 15 and 14 bit 5 ALP: Address Latch Polarity bit(1) 1 = Active-high (PMALL and PMALH) 0 = Active-low (PMALL and PMALH) bit 4 CS2P: Chip Select 2 Polarity bit(1) 1 = Active-high (PMCS2/PMCS2) 0 = Active-low (PMCS2/PMCS2) bit 3 CS1P: Chip Select 1 Polarity bit(1) 1 = Active-high (PMCS1/PMCS1) 0 = Active-low (PMCS1/PMCS1) Note 1: These bits have no effect when their corresponding pins are used as address lines.  2009 Microchip Technology Inc. DS39897C-page 243 PIC24FJ256GB110 FAMILY bit 2 BEP: Byte Enable Polarity bit 1 = Byte enable active-high (PMBE) 0 = Byte enable active-low (PMBE) bit 1 WRSP: Write Strobe Polarity bit For Slave modes and Master mode 2 (PMMODE<9:8> = 00,01,10): 1 = Write strobe active-high (PMWR) 0 = Write strobe active-low (PMWR) For Master mode 1 (PMMODE<9:8> = 11): 1 = Enable strobe active-high (PMENB) 0 = Enable strobe active-low (PMENB) bit 0 RDSP: Read Strobe Polarity bit For Slave modes and Master mode 2 (PMMODE<9:8> = 00,01,10): 1 = Read strobe active-high (PMRD) 0 = Read strobe active-low (PMRD) For Master mode 1 (PMMODE<9:8> = 11): 1 = Read/write strobe active-high (PMRD/PMWR) 0 = Read/write strobe active-low (PMRD/PMWR) REGISTER 19-1: PMCON: PARALLEL PORT CONTROL REGISTER (CONTINUED) Note 1: These bits have no effect when their corresponding pins are used as address lines. PIC24FJ256GB110 FAMILY DS39897C-page 244  2009 Microchip Technology Inc. REGISTER 19-2: PMMODE: PARALLEL PORT MODE REGISTER R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BUSY IRQM1 IRQM0 INCM1 INCM0 MODE16 MODE1 MODE0 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WAITB1(1) WAITB0(1) WAITM3 WAITM2 WAITM1 WAITM0 WAITE1(1) WAITE0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 BUSY: Busy bit (Master mode only) 1 = Port is busy (not useful when the processor stall is active) 0 = Port is not busy bit 14-13 IRQM<1:0>: Interrupt Request Mode bits 11 = Interrupt generated when Read Buffer 3 is read or Write Buffer 3 is written (Buffered PSP mode) or on a read or write operation when PMA<1:0> = 11 (Addressable PSP mode only) 10 = No interrupt generated, processor stall activated 01 = Interrupt generated at the end of the read/write cycle 00 = No interrupt generated bit 12-11 INCM<1:0>: Increment Mode bits 11 = PSP read and write buffers auto-increment (Legacy PSP mode only) 10 = Decrement ADDR<10:0> by 1 every read/write cycle 01 = Increment ADDR<10:0> by 1 every read/write cycle 00 = No increment or decrement of address bit 10 MODE16: 8/16-Bit Mode bit 1 = 16-bit mode: Data register is 16 bits, a read or write to the Data register invokes two 8-bit transfers 0 = 8-bit mode: Data register is 8 bits, a read or write to the Data register invokes one 8-bit transfer bit 9-8 MODE<1:0>: Parallel Port Mode Select bits 11 = Master mode 1 (PMCS1, PMRD/PMWR, PMENB, PMBE, PMA and PMD<7:0>) 10 = Master mode 2 (PMCS1, PMRD, PMWR, PMBE, PMA and PMD<7:0>) 01 = Enhanced PSP, control signals (PMRD, PMWR, PMCS1, PMD<7:0> and PMA<1:0>) 00 = Legacy Parallel Slave Port, control signals (PMRD, PMWR, PMCS1 and PMD<7:0>) bit 7-6 WAITB<1:0>: Data Setup to Read/Write Wait State Configuration bits(1) 11 = Data wait of 4 TCY; multiplexed address phase of 4 TCY 10 = Data wait of 3 TCY; multiplexed address phase of 3 TCY 01 = Data wait of 2 TCY; multiplexed address phase of 2 TCY 00 = Data wait of 1 TCY; multiplexed address phase of 1 TCY bit 5-2 WAITM<3:0>: Read to Byte Enable Strobe Wait State Configuration bits 1111 = Wait of additional 15 TCY ... 0001 = Wait of additional 1 TCY 0000 = No additional wait cycles (operation forced into one TCY)(2) bit 1-0 WAITE<1:0>: Data Hold After Strobe Wait State Configuration bits(1) 11 = Wait of 4 TCY 10 = Wait of 3 TCY 01 = Wait of 2 TCY 00 = Wait of 1 TCY Note 1: The WAITB and WAITE bits are ignored whenever WAITM<3:0> = 0000. 2: A single-cycle delay is required between consecutive read and/or write operations.  2009 Microchip Technology Inc. DS39897C-page 245 PIC24FJ256GB110 FAMILY REGISTER 19-3: PMADDR: PARALLEL PORT ADDRESS REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CS2 CS1 ADDR<13:8> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADDR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CS2: Chip Select 2 bit 1 = Chip select 2 is active 0 = Chip select 2 is inactive bit 14 CS1: Chip Select 1 bit 1 = Chip select 1 is active 0 = Chip select 1 is inactive bit 13-0 ADDR<13:0>: Parallel Port Destination Address bits REGISTER 19-4: PMAEN: PARALLEL PORT ENABLE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PTEN15 PTEN14 PTEN13 PTEN12 PTEN11 PTEN10 PTEN9 PTEN8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PTEN7 PTEN6 PTEN5 PTEN4 PTEN3 PTEN2 PTEN1 PTEN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 PTEN<15:14>: PMCSx Strobe Enable bit 1 = PMA15 and PMA14 function as either PMA<15:14> or PMCS2 and PMCS1 0 = PMA15 and PMA14 function as port I/O bit 13-2 PTEN<13:2>: PMP Address Port Enable bits 1 = PMA<13:2> function as PMP address lines 0 = PMA<13:2> function as port I/O bit 1-0 PTEN<1:0>: PMALH/PMALL Strobe Enable bits 1 = PMA1 and PMA0 function as either PMA<1:0> or PMALH and PMALL 0 = PMA1 and PMA0 pads functions as port I/O PIC24FJ256GB110 FAMILY DS39897C-page 246  2009 Microchip Technology Inc. REGISTER 19-5: PMSTAT: PARALLEL PORT STATUS REGISTER R-0 R/W-0, HS U-0 U-0 R-0 R-0 R-0 R-0 IBF IBOV — — IB3F IB2F IB1F IB0F bit 15 bit 8 R-1 R/W-0, HS U-0 U-0 R-1 R-1 R-1 R-1 OBE OBUF — — OB3E OB2E OB1E OB0E bit 7 bit 0 Legend: HS = Hardware Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 IBF: Input Buffer Full Status bit 1 = All writable input buffer registers are full 0 = Some or all of the writable input buffer registers are empty bit 14 IBOV: Input Buffer Overflow Status bit 1 = A write attempt to a full input byte register occurred (must be cleared in software) 0 = No overflow occurred bit 13-12 Unimplemented: Read as ‘0’ bit 11-8 IB3F:IB0F Input Buffer x Status Full bits 1 = Input buffer contains data that has not been read (reading buffer will clear this bit) 0 = Input buffer does not contain any unread data bit 7 OBE: Output Buffer Empty Status bit 1 = All readable output buffer registers are empty 0 = Some or all of the readable output buffer registers are full bit 6 OBUF: Output Buffer Underflow Status bits 1 = A read occurred from an empty output byte register (must be cleared in software) 0 = No underflow occurred bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 OB3E:OB0E Output Buffer x Status Empty bit 1 = Output buffer is empty (writing data to the buffer will clear this bit) 0 = Output buffer contains data that has not been transmitted  2009 Microchip Technology Inc. DS39897C-page 247 PIC24FJ256GB110 FAMILY REGISTER 19-6: PADCFG1: PAD CONFIGURATION CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — RTSECSEL(1) PMPTTL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-2 Unimplemented: Read as ‘0’ bit 1 RTSECSEL: RTCC Seconds Clock Output Select bit(1) 1 = RTCC seconds clock is selected for the RTCC pin 0 = RTCC alarm pulse is selected for the RTCC pin bit 0 PMPTTL: PMP Module TTL Input Buffer Select bit 1 = PMP module inputs (PMDx, PMCS1) use TTL input buffers 0 = PMP module inputs use Schmitt Trigger input buffers Note 1: To enable the actual RTCC output, the RTCOE (RCFGCAL<10>)) bit must also be set. PIC24FJ256GB110 FAMILY DS39897C-page 248  2009 Microchip Technology Inc. FIGURE 19-2: LEGACY PARALLEL SLAVE PORT EXAMPLE FIGURE 19-3: ADDRESSABLE PARALLEL SLAVE PORT EXAMPLE TABLE 19-1: SLAVE MODE ADDRESS RESOLUTION FIGURE 19-4: MASTER MODE, DEMULTIPLEXED ADDRESSING (SEPARATE READ AND WRITE STROBES, TWO CHIP SELECTS) PMA<1:0> Output Register (Buffer) Input Register (Buffer) 00 PMDOUT1<7:0> (0) PMDIN1<7:0> (0) 01 PMDOUT1<15:8> (1) PMDIN1<15:8> (1) 10 PMDOUT2<7:0> (2) PMDIN2<7:0> (2) 11 PMDOUT2<15:8> (3) PMDIN2<15:8> (3) PMD<7:0> PMRD PMWR Master Address Bus Data Bus Control Lines PMCS1 PMD<7:0> PMRD PMWR PIC24F Slave PMCS1 PMD<7:0> PMRD PMWR Master PMCS1 PMA<1:0> Address Bus Data Bus Control Lines PMRD PMWR PIC24F Slave PMCS1 PMDOUT1L (0) PMDOUT1H (1) PMDOUT2L (2) PMDOUT2H (3) PMDIN1L (0) PMDIN1H (1) PMDIN2L (2) PMDIN2H (3) PMD<7:0> Write Address Decode Read Address Decode PMA<1:0> PMRD PMWR PMD<7:0> PMCS1 PIC24F PMA<13:0> Address Bus Data Bus Control Lines PMCS2  2009 Microchip Technology Inc. DS39897C-page 249 PIC24FJ256GB110 FAMILY FIGURE 19-5: MASTER MODE, PARTIALLY MULTIPLEXED ADDRESSING (SEPARATE READ AND WRITE STROBES, TWO CHIP SELECTS) FIGURE 19-6: MASTER MODE, FULLY MULTIPLEXED ADDRESSING (SEPARATE READ AND WRITE STROBES, TWO CHIP SELECTS) FIGURE 19-7: EXAMPLE OF A MULTIPLEXED ADDRESSING APPLICATION FIGURE 19-8: EXAMPLE OF A PARTIALLY MULTIPLEXED ADDRESSING APPLICATION PMRD PMWR PMD<7:0> PMCS1 PMA<13:8> PMALL PMA<7:0> PIC24F Address Bus Multiplexed Data and Address Bus Control Lines PMCS2 PMRD PMWR PMD<7:0> PMCS1 PMALH PIC24F PMA<13:8> Multiplexed Data and Address Bus Control Lines PMALL PMCS2 PMD<7:0> PMALH D<7:0> 373 A<15:0> D<7:0> A<7:0> 373 PMRD PMWR OE WR CE PIC24F Address Bus Data Bus Control Lines PMCS1 PMALL A<15:8> PMA<10:8> D<7:0> 373 A<10:0> D<7:0> A<7:0> PMRD PMWR OE WR CE PIC24F Address Bus Data Bus Control Lines PMCS1 PMALL A<10:8> PMD<7:0> PIC24FJ256GB110 FAMILY DS39897C-page 250  2009 Microchip Technology Inc. FIGURE 19-9: EXAMPLE OF AN 8-BIT MULTIPLEXED ADDRESS AND DATA APPLICATION FIGURE 19-10: PARALLEL EEPROM EXAMPLE (UP TO 15-BIT ADDRESS, 8-BIT DATA) FIGURE 19-11: PARALLEL EEPROM EXAMPLE (UP TO 15-BIT ADDRESS, 16-BIT DATA) FIGURE 19-12: LCD CONTROL EXAMPLE (BYTE MODE OPERATION) ALE PMRD PMWR RD WR CS PIC24F Address Bus Data Bus Control Lines PMCS1 PMALL AD<7:0> Parallel Peripheral PMD<7:0> PMA A D<7:0> PMRD PMWR OE WR CE PIC24F Address Bus Data Bus Control Lines PMCS1 PMD<7:0> Parallel EEPROM PMA A D<7:0> PMRD PMWR OE WR CE PIC24F Address Bus Data Bus Control Lines PMCS1 PMD<7:0> Parallel EEPROM PMBE A0 PMRD/PMWR D<7:0> PIC24F Address Bus Data Bus Control Lines PMA0 R/W RS E LCD Controller PMCS1 PM<7:0>  2009 Microchip Technology Inc. DS39897C-page 251 PIC24FJ256GB110 FAMILY 20.0 REAL-TIME CLOCK AND CALENDAR (RTCC) The Real-Time Clock and Calendar (RTCC) provides on-chip, hardware-based clock and calendar functionality with little or no CPU overhead. It is intended for applications where accurate time must be maintained for extended periods with minimal CPU activity and with limited power resources, such as battery-powered applications. Key features include: • Time data in hours, minutes and seconds, with a granularity of one-half second • 24-hour format (Military Time) display option • Calendar data as date, month and year • Automatic, hardware-based day of the week and leap year calculations for dates from 2000 through 2099 • Time and calendar data in BCD format for _compact firmware • Highly configurable alarm function • External output pin with selectable alarm signal or seconds “tick” signal output • User calibration feature with auto-adjust A simplified block diagram of the module is shown in Figure 20-1. The SOSC and RTCC will both remain running while the device is held in Reset with MCLR and will continue running after MCLR is released. FIGURE 20-1: RTCC BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 29. “Real-Time Clock and Calendar (RTCC)” (DS39696). RTCC Prescalers RTCC Timer Comparator Compare Registers Repeat Counter YEAR MTHDY WKDYHR MINSEC ALMTHDY ALWDHR ALMINSEC with Masks RTCC Interrupt Logic RCFGCAL ALCFGRPT Alarm Event 32.768 kHz Input from SOSC Oscillator 0.5s RTCC Clock Domain Alarm Pulse RTCC Interrupt CPU Clock Domain RTCVAL ALRMVAL RTCC Pin RTCOE PIC24FJ256GB110 FAMILY DS39897C-page 252  2009 Microchip Technology Inc. 20.1 RTCC Module Registers The RTCC module registers are organized into three categories: • RTCC Control Registers • RTCC Value Registers • Alarm Value Registers 20.1.1 REGISTER MAPPING To limit the register interface, the RTCC Timer and Alarm Time registers are accessed through corresponding register pointers. The RTCC Value register window (RTCVALH and RTCVALL) uses the RTCPTR bits (RCFGCAL<9:8>) to select the desired Timer register pair (see Table 20-1). By writing the RTCVALH byte, the RTCC Pointer value, RTCPTR<1:0> bits, decrement by one until they reach ‘00’. Once they reach ‘00’, the MINUTES and SECONDS value will be accessible through RTCVALH and RTCVALL until the pointer value is manually changed. TABLE 20-1: RTCVAL REGISTER MAPPING The Alarm Value register window (ALRMVALH and ALRMVALL) uses the ALRMPTR bits (ALCFGRPT<9:8>) to select the desired Alarm register pair (see Table 20-2). By writing the ALRMVALH byte, the Alarm Pointer value, ALRMPTR<1:0> bits, decrement by one until they reach ‘00’. Once they reach ‘00’, the ALRMMIN and ALRMSEC value will be accessible through ALRMVALH and ALRMVALL until the pointer value is manually changed. TABLE 20-2: ALRMVAL REGISTER MAPPING Considering that the 16-bit core does not distinguish between 8-bit and 16-bit read operations, the user must be aware that when reading either the ALRMVALH or ALRMVALL bytes will decrement the ALRMPTR<1:0> value. The same applies to the RTCVALH or RTCVALL bytes with the RTCPTR<1:0> being decremented. 20.1.2 WRITE LOCK In order to perform a write to any of the RTCC Timer registers, the RTCWREN bit (RCFGCAL<13>) must be set (refer to Example 20-1). EXAMPLE 20-1: SETTING THE RTCWREN BIT RTCPTR <1:0> RTCC Value Register Window RTCVAL<15:8> RTCVAL<7:0> 00 MINUTES SECONDS 01 WEEKDAY HOURS 10 MONTH DAY 11 — YEAR ALRMPTR <1:0> Alarm Value Register Window ALRMVAL<15:8> ALRMVAL<7:0> 00 ALRMMIN ALRMSEC 01 ALRMWD ALRMHR 10 ALRMMNTH ALRMDAY 11 — — Note: This only applies to read operations and not write operations. Note: To avoid accidental writes to the timer, it is recommended that the RTCWREN bit (RCFGCAL<13>) is kept clear at any other time. For the RTCWREN bit to be set, there is only 1 instruction cycle time window allowed between the unlock sequence and the setting of RTCWREN; therefore, it is recommended that code follow the procedure in Example 20-1. For applications written in C, the unlock sequence should be implemented using in-line assembly. __builtin_write_RTCWEN(); //set the RTCWREN bit  2009 Microchip Technology Inc. DS39897C-page 253 PIC24FJ256GB110 FAMILY 20.1.3 RTCC CONTROL REGISTERS REGISTER 20-1: RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1) R/W-0 U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 RTCEN(2) — RTCWREN RTCSYNC HALFSEC(3) RTCOE RTCPTR1 RTCPTR0 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 RTCEN: RTCC Enable bit(2) 1 = RTCC module is enabled 0 = RTCC module is disabled bit 14 Unimplemented: Read as ‘0’ bit 13 RTCWREN: RTCC Value Registers Write Enable bit 1 = RTCVALH and RTCVALL registers can be written to by the user 0 = RTCVALH and RTCVALL registers are locked out from being written to by the user bit 12 RTCSYNC: RTCC Value Registers Read Synchronization bit 1 = RTCVALH, RTCVALL and ALCFGRPT registers can change while reading due to a rollover ripple resulting in an invalid data read. If the register is read twice and results in the same data, the data can be assumed to be valid. 0 = RTCVALH, RTCVALL or ALCFGRPT registers can be read without concern over a rollover ripple bit 11 HALFSEC: Half-Second Status bit(3) 1 = Second half period of a second 0 = First half period of a second bit 10 RTCOE: RTCC Output Enable bit 1 = RTCC output enabled 0 = RTCC output disabled bit 9-8 RTCPTR<1:0>: RTCC Value Register Window Pointer bits Points to the corresponding RTCC Value registers when reading RTCVALH and RTCVALL registers; the RTCPTR<1:0> value decrements on every read or write of RTCVALH until it reaches ‘00’. RTCVAL<15:8>: 00 = MINUTES 01 = WEEKDAY 10 = MONTH 11 = Reserved RTCVAL<7:0>: 00 = SECONDS 01 = HOURS 10 = DAY 11 = YEAR Note 1: The RCFGCAL register is only affected by a POR. 2: A write to the RTCEN bit is only allowed when RTCWREN = 1. 3: This bit is read-only. It is cleared to ‘0’ on a write to the lower half of the MINSEC register. PIC24FJ256GB110 FAMILY DS39897C-page 254  2009 Microchip Technology Inc. bit 7-0 CAL<7:0>: RTC Drift Calibration bits 01111111 = Maximum positive adjustment; adds 508 RTC clock pulses every one minute ... 00000001 = Minimum positive adjustment; adds 4 RTC clock pulses every one minute 00000000 = No adjustment 11111111 = Minimum negative adjustment; subtracts 4 RTC clock pulses every one minute ... 10000000 = Maximum negative adjustment; subtracts 512 RTC clock pulses every one minute REGISTER 20-1: RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1) (CONTINUED) Note 1: The RCFGCAL register is only affected by a POR. 2: A write to the RTCEN bit is only allowed when RTCWREN = 1. 3: This bit is read-only. It is cleared to ‘0’ on a write to the lower half of the MINSEC register. REGISTER 20-2: PADCFG1: PAD CONFIGURATION CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — RTSECSEL(1) PMPTTL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-2 Unimplemented: Read as ‘0’ bit 1 RTSECSEL: RTCC Seconds Clock Output Select bit(1) 1 = RTCC seconds clock is selected for the RTCC pin 0 = RTCC alarm pulse is selected for the RTCC pin bit 0 PMPTTL: PMP Module TTL Input Buffer Select bit 1 = PMP module inputs (PMDx, PMCS1) use TTL input buffers 0 = PMP module inputs use Schmitt Trigger input buffers Note 1: To enable the actual RTCC output, the RTCOE (RCFGCAL<10>)) bit must also be set.  2009 Microchip Technology Inc. DS39897C-page 255 PIC24FJ256GB110 FAMILY REGISTER 20-3: ALCFGRPT: ALARM CONFIGURATION REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ALRMEN CHIME AMASK3 AMASK2 AMASK1 AMASK0 ALRMPTR1 ALRMPTR0 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ARPT7 ARPT6 ARPT5 ARPT4 ARPT3 ARPT2 ARPT1 ARPT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ALRMEN: Alarm Enable bit 1 = Alarm is enabled (cleared automatically after an alarm event whenever ARPT<7:0> = 00h and CHIME = 0) 0 = Alarm is disabled bit 14 CHIME: Chime Enable bit 1 = Chime is enabled; ARPT<7:0> bits are allowed to roll over from 00h to FFh 0 = Chime is disabled; ARPT<7:0> bits stop once they reach 00h bit 13-10 AMASK<3:0>: Alarm Mask Configuration bits 0000 = Every half second 0001 = Every second 0010 = Every 10 seconds 0011 = Every minute 0100 = Every 10 minutes 0101 = Every hour 0110 = Once a day 0111 = Once a week 1000 = Once a month 1001 = Once a year (except when configured for February 29th, once every 4 years) 101x = Reserved – do not use 11xx = Reserved – do not use bit 9-8 ALRMPTR<1:0>: Alarm Value Register Window Pointer bits Points to the corresponding Alarm Value registers when reading ALRMVALH and ALRMVALL registers; the ALRMPTR<1:0> value decrements on every read or write of ALRMVALH until it reaches ‘00’. ALRMVAL<15:8>: 00 = ALRMMIN 01 = ALRMWD 10 = ALRMMNTH 11 = Unimplemented ALRMVAL<7:0>: 00 = ALRMSEC 01 = ALRMHR 10 = ALRMDAY 11 = Unimplemented bit 7-0 ARPT<7:0>: Alarm Repeat Counter Value bits 11111111 = Alarm will repeat 255 more times ... 00000000 = Alarm will not repeat The counter decrements on any alarm event. The counter is prevented from rolling over from 00h to FFh unless CHIME = 1. PIC24FJ256GB110 FAMILY DS39897C-page 256  2009 Microchip Technology Inc. 20.1.4 RTCVAL REGISTER MAPPINGS REGISTER 20-4: YEAR: YEAR VALUE REGISTER(1) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x YRTEN3 YRTEN2 YRTEN1 YRTEN0 YRONE3 YRONE2 YRONE1 YRONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7-4 YRTEN<3:0>: Binary Coded Decimal Value of Year’s Tens Digit bits Contains a value from 0 to 9. bit 3-0 YRONE<3:0>: Binary Coded Decimal Value of Year’s Ones Digit bits Contains a value from 0 to 9. Note 1: A write to the YEAR register is only allowed when RTCWREN = 1. REGISTER 20-5: MTHDY: MONTH AND DAY VALUE REGISTER(1) U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 bit 15 bit 8 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — DAYTEN1 DAYTEN0 DAYONE3 DAYONE2 DAYONE1 DAYONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12 MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bit Contains a value of 0 or 1. bit 11-8 MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits Contains a value from 0 to 9. bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits Contains a value from 0 to 3. bit 3-0 DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits Contains a value from 0 to 9. Note 1: A write to this register is only allowed when RTCWREN = 1.  2009 Microchip Technology Inc. DS39897C-page 257 PIC24FJ256GB110 FAMILY REGISTER 20-6: WKDYHR: WEEKDAY AND HOURS VALUE REGISTER(1) U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x — — — — — WDAY2 WDAY1 WDAY0 bit 15 bit 8 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — HRTEN1 HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits Contains a value from 0 to 6. bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits Contains a value from 0 to 2. bit 3-0 HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits Contains a value from 0 to 9. Note 1: A write to this register is only allowed when RTCWREN = 1. REGISTER 20-7: MINSEC: MINUTES AND SECONDS VALUE REGISTER U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 bit 15 bit 8 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits Contains a value from 0 to 5. bit 11-8 MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits Contains a value from 0 to 9. bit 7 Unimplemented: Read as ‘0’ bit 6-4 SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits Contains a value from 0 to 5. bit 3-0 SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits Contains a value from 0 to 9. PIC24FJ256GB110 FAMILY DS39897C-page 258  2009 Microchip Technology Inc. 20.1.5 ALRMVAL REGISTER MAPPINGS REGISTER 20-8: ALMTHDY: ALARM MONTH AND DAY VALUE REGISTER(1) U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — MTHTEN0 MTHONE3 MTHONE2 MTHONE1 MTHONE0 bit 15 bit 8 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — DAYTEN1 DAYTEN0 DAYONE3 DAYONE2 DAYONE1 DAYONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12 MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bit Contains a value of 0 or 1. bit 11-8 MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits Contains a value from 0 to 9. bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits Contains a value from 0 to 3. bit 3-0 DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits Contains a value from 0 to 9. Note 1: A write to this register is only allowed when RTCWREN = 1.  2009 Microchip Technology Inc. DS39897C-page 259 PIC24FJ256GB110 FAMILY REGISTER 20-9: ALWDHR: ALARM WEEKDAY AND HOURS VALUE REGISTER(1) U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x — — — — — WDAY2 WDAY1 WDAY0 bit 15 bit 8 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — HRTEN1 HRTEN0 HRONE3 HRONE2 HRONE1 HRONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits Contains a value from 0 to 6. bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits Contains a value from 0 to 2. bit 3-0 HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits Contains a value from 0 to 9. Note 1: A write to this register is only allowed when RTCWREN = 1. REGISTER 20-10: ALMINSEC: ALARM MINUTES AND SECONDS VALUE REGISTER U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — MINTEN2 MINTEN1 MINTEN0 MINONE3 MINONE2 MINONE1 MINONE0 bit 15 bit 8 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — SECTEN2 SECTEN1 SECTEN0 SECONE3 SECONE2 SECONE1 SECONE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits Contains a value from 0 to 5. bit 11-8 MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits Contains a value from 0 to 9. bit 7 Unimplemented: Read as ‘0’ bit 6-4 SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits Contains a value from 0 to 5. bit 3-0 SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits Contains a value from 0 to 9. PIC24FJ256GB110 FAMILY DS39897C-page 260  2009 Microchip Technology Inc. 20.2 Calibration The real-time crystal input can be calibrated using the periodic auto-adjust feature. When properly calibrated, the RTCC can provide an error of less than 3 seconds per month. This is accomplished by finding the number of error clock pulses for one minute and storing the value into the lower half of the RCFGCAL register. The 8-bit signed value loaded into the lower half of RCFGCAL is multiplied by four and will either be added or subtracted from the RTCC timer, once every minute. Refer to the steps below for RTCC calibration: 1. Using another timer resource on the device, the user must find the error of the 32.768 kHz crystal. 2. Once the error is known, it must be converted to the number of error clock pulses per minute and loaded into the RCFGCAL register. EQUATION 20-1: RTCC CALIBRATION 3. a) If the oscillator is faster then ideal (negative result form step 2), the RCFGCAL register value needs to be negative. This causes the specified number of clock pulses to be substract from the timer counter once every minute. b) If the oscillator is slower then ideal (positive result from step 2) the RCFGCAL register value needs to be positive. This causes the specified number of clock pulses to be added to the timer counter once every minute. 4. Divide the number of error clocks per minute by 4 to get the correct CAL value and load the RCFGCAL register with the correct value. (Each 1-bit increment in CAL adds or subtracts 4 pulses). Writes to the lower half of the RCFGCAL register should only occur when the timer is turned off, or immediately after the rising edge of the seconds pulse. 20.3 Alarm • Configurable from half second to one year • Enabled using the ALRMEN bit (ALCFGRPT<15>, Register 20-3) • One-time alarm and repeat alarm options available 20.3.1 CONFIGURING THE ALARM The alarm feature is enabled using the ALRMEN bit. This bit is cleared when an alarm is issued. Writes to ALRMVAL should only take place when ALRMEN = 0. As shown in Figure 20-2, the interval selection of the alarm is configured through the AMASK bits (ALCFGRPT<13:10>). These bits determine which and how many digits of the alarm must match the clock value for the alarm to occur. The alarm can also be configured to repeat based on a preconfigured interval. The amount of times this occurs once the alarm is enabled is stored in the ARPT bits, ARPT<7:0> (ALCFGRPT<7:0>). When the value of the ARPT bits equals 00h and the CHIME bit (ALCFGRPT<14>) is cleared, the repeat function is disabled and only a single alarm will occur. The alarm can be repeated up to 255 times by loading ARPT<7:0> with FFh. After each alarm is issued, the value of the ARPT bits is decremented by one. Once the value has reached 00h, the alarm will be issued one last time, after which the ALRMEN bit will be cleared automatically and the alarm will turn off. Indefinite repetition of the alarm can occur if the CHIME bit = 1. Instead of the alarm being disabled when the value of the ARPT bits reaches 00h, it rolls over to FFh and continues counting indefinitely while CHIME is set. 20.3.2 ALARM INTERRUPT At every alarm event, an interrupt is generated. In addition, an alarm pulse output is provided that operates at half the frequency of the alarm. This output is completely synchronous to the RTCC clock and can be used as a trigger clock to other peripherals. Error (clocks per minute) =(Ideal Frequency† – Measured Frequency) * 60 † Ideal frequency = 32,768 Hz Note: It is up to the user to include, in the error value, the initial error of the crystal, drift due to temperature and drift due to crystal aging. Note: Changing any of the registers, other then the RCFGCAL and ALCFGRPT registers and the CHIME bit while the alarm is enabled (ALRMEN = 1), can result in a false alarm event leading to a false alarm interrupt. To avoid a false alarm event, the timer and alarm values should only be changed while the alarm is disabled (ALRMEN = 0). It is recommended that the ALCFGRPT register and CHIME bit be changed when RTCSYNC = 0.  2009 Microchip Technology Inc. DS39897C-page 261 PIC24FJ256GB110 FAMILY FIGURE 20-2: ALARM MASK SETTINGS Note 1: Annually, except when configured for February 29. s s s m s s m m s s h h m m s s d hh m m s s d d h h m m s s m m d d h h m m s s Day of the Week Month Day Hours Minutes Seconds Alarm Mask Setting (AMASK<3:0>) 0000 – Every half second 0001 – Every second 0010 – Every 10 seconds 0011 – Every minute 0100 – Every 10 minutes 0101 – Every hour 0110 – Every day 0111 – Every week 1000 – Every month 1001 – Every year(1) PIC24FJ256GB110 FAMILY DS39897C-page 262  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 263 PIC24FJ256GB110 FAMILY 21.0 PROGRAMMABLE CYCLIC REDUNDANCY CHECK (CRC) GENERATOR The programmable CRC generator offers the following features: • User-programmable polynomial CRC equation • Interrupt output • Data FIFO The module implements a software configurable CRC generator. The terms of the polynomial and its length can be programmed using the X<15:1> bits (CRCXOR<15:1>) and the PLEN<3:0> bits (CRCCON<3:0>), respectively. Consider the CRC equation: x16 + x12 + x5 + 1 To program this polynomial into the CRC generator, the CRC register bits should be set as shown in Table 21-1. TABLE 21-1: EXAMPLE CRC SETUP Note that for the value of X<15:1>, the 12th bit and the 5th bit are set to ‘1’, as required by the equation. The 0 bit required by the equation is always XORed. For a 16-bit polynomial, the 16th bit is also always assumed to be XORed; therefore, the X<15:1> bits do not have the 0 bit or the 16th bit. A simplified block diagram of the module is shown in Figure 21-1. The general topology of the shift engine is shown in Figure 21-2. FIGURE 21-1: CRC BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 30. “Programmable Cyclic Redundancy Check (CRC)” (DS39714). Bit Name Bit Value PLEN<3:0> 1111 X<15:1> 000100000010000 Variable FIFO (8x16 or 16x8) CRCDAT CRC Shift Engine CRCWDAT FIFO Empty Event Set CRCIF Shift Clock (2FCY) PIC24FJ256GB110 FAMILY DS39897C-page 264  2009 Microchip Technology Inc. FIGURE 21-2: CRC SHIFT ENGINE DETAIL 21.1 User Interface 21.1.1 DATA INTERFACE To start serial shifting, a ‘1’ must be written to the CRCGO bit. The module incorporates a FIFO that is 8 deep when PLEN (CRCCON<3:0>) > 7, and 16 deep, otherwise. The data for which the CRC is to be calculated must first be written into the FIFO. The smallest data element that can be written into the FIFO is one byte. For example, if PLEN = 5, then the size of the data is PLEN + 1 = 6. When loading data, the two MSbs of the data byte are ignored. Once data is written into the CRCWDAT MSb (as defined by PLEN), the value of VWORD (CRCCON<12:8>) increments by one. When CRCGO = 1 and VWORD > 0, a word of data to be shifted is moved from the FIFO into the shift engine. When the data word moves from the FIFO to the shift engine, VWORD decrements by one. The serial shifter continues to receive data from the FIFO, shifting until the VWORD reaches 0. The last bit of data will be shifted through the CRC module (PLEN + 1)/2 clock cycles after VWORD reaches 0. This is when the module is completed with the CRC calculation. Therefore, for a given value of PLEN, it will take (PLEN + 1)/2 * VWORD number of clock cycles to complete the CRC calculations. When VWORD reaches 8 (or 16), the CRCFUL bit will be set. When VWORD reaches 0, the CRCMPT bit will be set. To continually feed data into the CRC engine, the recommended mode of operation is to initially “prime” the FIFO with a sufficient number of words so no interrupt is generated before the next word can be written. Once that is done, start the CRC by setting the CRCGO bit to ‘1’. From that point onward, the VWORD bits should be polled. If they read less than 8 or 16, another word can be written into the FIFO. To empty words already written into a FIFO, the CRCGO bit must be set to ‘1’ and the CRC shifter allowed to run until the CRCMPT bit is set. Also, to get the correct CRC reading, it will be necessary to wait for the CRCMPT bit to go high before reading the CRCWDAT register. If a word is written when the CRCFUL bit is set, the VWORD Pointer will roll over to 0. The hardware will then behave as if the FIFO is empty. However, the condition to generate an interrupt will not be met; therefore, no interrupt will be generated (See Section 21.1.2 “Interrupt Operation”). At least one instruction cycle must pass after a write to CRCWDAT before a read of the VWORD bits is done. 21.1.2 INTERRUPT OPERATION When the VWORD<4:0> bits make a transition from a value of ‘1’ to ‘0’, an interrupt will be generated. Note that the CRC calculation is not complete at this point; an additional time of (PLEN + 1)/2 clock cycles is required before the output can be read. 21.2 Operation in Power-Saving Modes 21.2.1 SLEEP MODE If Sleep mode is entered while the module is operating, the module will be suspended in its current state until clock execution resumes. 21.2.2 IDLE MODE To continue full module operation in Idle mode, the CSIDL bit must be cleared prior to entry into the mode. If CSIDL = 1, the module will behave the same way as it does in Sleep mode; pending interrupt events will be passed on, even though the module clocks are not available. CRCWDAT Bit 0 Bit 1 Bit n(2) X(1)(1) Read/Write Bus Shift Buffer Data Bit 2 X(2)(1) X(n)(1) Note 1: Each XOR stage of the shift engine is programmable. See text for details. 2: Polynomial length n is determined by ([PLEN<3:0>] + 1)  2009 Microchip Technology Inc. DS39897C-page 265 PIC24FJ256GB110 FAMILY 21.3 Registers There are four registers used to control programmable CRC operation: • CRCCON • CRCXOR • CRCDAT • CRCWDAT REGISTER 21-1: CRCCON: CRC CONTROL REGISTER U-0 U-0 R/W-0 R-0 R-0 R-0 R-0 R-0 — — CSIDL VWORD4 VWORD3 VWORD2 VWORD1 VWORD0 bit 15 bit 8 R-0 R-1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CRCFUL CRCMPT — CRCGO PLEN3 PLEN2 PLEN1 PLEN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 CSIDL: CRC Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-8 VWORD<4:0>: Pointer Value bits Indicates the number of valid words in the FIFO. Has a maximum value of 8 when PLEN<3:0> > 7, or 16 when PLEN<3:0> 7. bit 7 CRCFUL: FIFO Full bit 1 = FIFO is full 0 = FIFO is not full bit 6 CRCMPT: FIFO Empty Bit 1 = FIFO is empty 0 = FIFO is not empty bit 5 Unimplemented: Read as ‘0’ bit 4 CRCGO: Start CRC bit 1 = Start CRC serial shifter 0 = CRC serial shifter turned off bit 3-0 PLEN<3:0>: Polynomial Length bits Denotes the length of the polynomial to be generated minus 1. PIC24FJ256GB110 FAMILY DS39897C-page 266  2009 Microchip Technology Inc. REGISTER 21-2: CRCXOR: CRC XOR POLYNOMIAL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 X15 X14 X13 X12 X11 X10 X9 X8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 X7 X6 X5 X4 X3 X2 X1 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-1 X<15:1>: XOR of Polynomial Term Xn Enable bits bit 0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 267 PIC24FJ256GB110 FAMILY 22.0 10-BIT HIGH-SPEED A/D CONVERTER The 10-bit A/D Converter has the following key features: • Successive Approximation (SAR) conversion • Conversion speeds of up to 500 ksps • 16 analog input pins • External voltage reference input pins • Internal band gap reference inputs • Automatic Channel Scan mode • Selectable conversion trigger source • 16-word conversion result buffer • Selectable Buffer Fill modes • Four result alignment options • Operation during CPU Sleep and Idle modes On all PIC24FJ256GB110 family devices, the 10-bit A/D Converter has 16 analog input pins, designated AN0 through AN15. In addition, there are two analog input pins for external voltage reference connections (VREF+ and VREF-). These voltage reference inputs may be shared with other analog input pins. A block diagram of the A/D Converter is shown in Figure 22-1. To perform an A/D conversion: 1. Configure the A/D module: a) Configure port pins as analog inputs and/or select band gap reference inputs (AD1PCFGL<15:0> and AD1PCFGH<1:0>). b) Select voltage reference source to match expected range on analog inputs (AD1CON2<15:13>). c) Select the analog conversion clock to match desired data rate with processor clock (AD1CON3<7:0>). d) Select the appropriate sample/conversion sequence (AD1CON1<7:5> and AD1CON3<12:8>). e) Select how conversion results are presented in the buffer (AD1CON1<9:8>). f) Select interrupt rate (AD1CON2<5:2>). g) Turn on A/D module (AD1CON1<15>). 2. Configure A/D interrupt (if required): a) Clear the AD1IF bit. b) Select A/D interrupt priority. Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, Section 17. “10-Bit A/D Converter” (DS39705). PIC24FJ256GB110 FAMILY DS39897C-page 268  2009 Microchip Technology Inc. FIGURE 22-1: 10-BIT HIGH-SPEED A/D CONVERTER BLOCK DIAGRAM Comparator 10-Bit SAR Conversion Logic VREF+ DAC AN12 AN13 AN14 AN15 AN8 AN9 AN10 AN11 AN4 AN5 AN6 AN7 AN0 AN1 AN2 AN3 VREFSample Control S/H AVSS AVDD ADC1BUF0: ADC1BUFF AD1CON1 AD1CON2 AD1CON3 AD1CHS AD1PCFGL AD1PCFGH Control Logic Data Formatting Input MUX Control Conversion Control Pin Config Control Internal Data Bus 16 VR- VR+ MUX B MUX A VINH VINL VINH VINH VINL VINL VR+ VRVR Select VBG VBG/2 AD1CSSL  2009 Microchip Technology Inc. DS39897C-page 269 PIC24FJ256GB110 FAMILY REGISTER 22-1: AD1CON1: A/D CONTROL REGISTER 1 R/W-0 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 ADON(1) — ADSIDL — — — FORM1 FORM0 bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0, HCS R/W-0, HCS SSRC2 SSRC1 SSRC0 — — ASAM SAMP DONE bit 7 bit 0 Legend: HCS = Hardware Clearable/Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ADON: A/D Operating Mode bit(1) 1 = A/D Converter module is operating 0 = A/D Converter is off bit 14 Unimplemented: Read as ‘0’ bit 13 ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-10 Unimplemented: Read as ‘0’ bit 9-8 FORM<1:0>: Data Output Format bits 11 = Signed fractional (sddd dddd dd00 0000) 10 = Fractional (dddd dddd dd00 0000) 01 = Signed integer (ssss sssd dddd dddd) 00 = Integer (0000 00dd dddd dddd) bit 7-5 SSRC<2:0>: Conversion Trigger Source Select bits 111 = Internal counter ends sampling and starts conversion (auto-convert) 110 = CTMU event ends sampling and starts conversion 101 = Reserved 100 = Timer5 compare ends sampling and starts conversion 011 = Reserved 010 = Timer3 compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing SAMP bit ends sampling and starts conversion bit 4-3 Unimplemented: Read as ‘0’ bit 2 ASAM: A/D Sample Auto-Start bit 1 = Sampling begins immediately after last conversion completes. SAMP bit is auto-set. 0 = Sampling begins when SAMP bit is set bit 1 SAMP: A/D Sample Enable bit 1 = A/D sample/hold amplifier is sampling input 0 = A/D sample/hold amplifier is holding bit 0 DONE: A/D Conversion Status bit 1 = A/D conversion is done 0 = A/D conversion is NOT done Note 1: Values of ADC1BUFx registers will not retain their values once the ADON bit is cleared. Read out the conversion values from the buffer before disabling the module. PIC24FJ256GB110 FAMILY DS39897C-page 270  2009 Microchip Technology Inc. REGISTER 22-2: AD1CON2: A/D CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 r-0 U-0 R/W-0 U-0 U-0 VCFG2 VCFG1 VCFG0 r — CSCNA — — bit 15 bit 8 R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BUFS — SMPI3 SMPI2 SMPI1 SMPI0 BUFM ALTS bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit r = Reserved bit’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 VCFG<2:0>: Voltage Reference Configuration bits bit 12 Reserved: Maintain as ‘0’ bit 11 Unimplemented: Read as ‘0’ bit 10 CSCNA: Scan Input Selections for CH0+ S/H Input for MUX A Input Multiplexer Setting bit 1 = Scan inputs 0 = Do not scan inputs bit 9-8 Unimplemented: Read as ‘0’ bit 7 BUFS: Buffer Fill Status bit (valid only when BUFM = 1) 1 = A/D is currently filling buffer, 08-0F, user should access data in 00-07 0 = A/D is currently filling buffer, 00-07, user should access data in 08-0F bit 6 Unimplemented: Read as ‘0’ bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits 1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence 1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence ..... 0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence 0000 = Interrupts at the completion of conversion for each sample/convert sequence bit 1 BUFM: Buffer Mode Select bit 1 = Buffer configured as two 8-word buffers (ADC1BUFn<15:8> and ADC1BUFn<7:0>) 0 = Buffer configured as one 16-word buffer (ADC1BUFn<15:0>) bit 0 ALTS: Alternate Input Sample Mode Select bit 1 = Uses MUX A input multiplexer settings for first sample, then alternates between MUX B and MUX A input multiplexer settings for all subsequent samples 0 = Always uses MUX A input multiplexer settings VCFG<2:0> VR+ VR- 000 AVDD AVSS 001 External VREF+ pin AVSS 010 AVDD External VREF- pin 011 External VREF+ pin External VREF- pin 1xx AVDD AVSS  2009 Microchip Technology Inc. DS39897C-page 271 PIC24FJ256GB110 FAMILY REGISTER 22-3: AD1CON3: A/D CONTROL REGISTER 3 R/W-0 r-0 r-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADRC r r SAMC4 SAMC3 SAMC2 SAMC1 SAMC0 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADCS7 ADCS6 ADCS5 ADCS4 ADCS3 ADCS2 ADCS1 ADCS0 bit 7 bit 0 Legend: r = Reserved bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ADRC: A/D Conversion Clock Source bit 1 = A/D internal RC clock 0 = Clock derived from system clock bit 14-13 Reserved: Maintain as ‘0’ bit 12-8 SAMC<4:0>: Auto-Sample Time bits 11111 = 31 TAD ····· 00001 = 1 TAD 00000 = 0 TAD (not recommended) bit 7-0 ADCS<7:0>: A/D Conversion Clock Select bits 11111111 ······ = Reserved, do not use 01000000 00111111 = 64 TCY 00111110 = 63 TCY ······ 00000001 = 2*TCY 00000000 = TCY PIC24FJ256GB110 FAMILY DS39897C-page 272  2009 Microchip Technology Inc. REGISTER 22-4: AD1CHS: A/D INPUT SELECT REGISTER R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0NB — — CH0SB4(1) CH0SB3(1) CH0SB2(1) CH0SB1(1) CH0SB0(1) bit 15 bit 8 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0NA — — CH0SA4 CH0SA3 CH0SA2 CH0SA1 CH0SA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CH0NB: Channel 0 Negative Input Select for MUX B Multiplexer Setting bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VRbit 14-13 Unimplemented: Read as ‘0’ bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for MUX B Multiplexer Setting bits(1) 10001 = Channel 0 positive input is internal band gap reference (VBG)(2) 10000 = Channel 0 positive input is VBG/2(2) 01111 = Channel 0 positive input is AN15 01110 = Channel 0 positive input is AN14 01101 = Channel 0 positive input is AN13 01100 = Channel 0 positive input is AN12 01011 = Channel 0 positive input is AN11 01010 = Channel 0 positive input is AN10 01001 = Channel 0 positive input is AN9 01000 = Channel 0 positive input is AN8 00111 = Channel 0 positive input is AN7 00110 = Channel 0 positive input is AN6 00101 = Channel 0 positive input is AN5 00100 = Channel 0 positive input is AN4 00011 = Channel 0 positive input is AN3 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 bit 7 CH0NA: Channel 0 Negative Input Select for MUX A Multiplexer Setting bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VRbit 6-5 Unimplemented: Read as ‘0’ bit 4-0 CH0SA<4:0>: Channel 0 Positive Input Select for MUX A Multiplexer Setting bits Implemented combinations are identical to those for CHOSB<4:0> (above). Note 1: Combinations, ‘10010’ through ‘11111’, are unimplemented; do not use. 2: Band gap reference must be allowed to stabilize (parameter TBG) before using these channels for a conversion. See Section 29.1 “DC Characteristics” for more information.  2009 Microchip Technology Inc. DS39897C-page 273 PIC24FJ256GB110 FAMILY REGISTER 22-5: AD1PCFGL: A/D PORT CONFIGURATION REGISTER (LOW) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 PCFG<15:0>: Analog Input Pin Configuration Control bits 1 = Pin for corresponding analog channel is configured in Digital mode; I/O port read enabled 0 = Pin configured in Analog mode; I/O port read disabled, A/D samples pin voltage REGISTER 22-6: AD1PCFGH: A/D PORT CONFIGURATION REGISTER (HIGH) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — PCFG17 PCFG16 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-2 Unimplemented: Read as ‘0’ bit 1 PCFG17: A/D Input Configuration Control bit 1 = Analog channel disabled from input scan 0 = Internal band gap (VBG) channel enabled for input scan bit 0 PCFG16: A/D Input Configuration Control bit 1 = Analog channel disabled from input scan 0 = Internal VBG/2 channel enabled for input scan PIC24FJ256GB110 FAMILY DS39897C-page 274  2009 Microchip Technology Inc. EQUATION 22-1: A/D CONVERSION CLOCK PERIOD(1) REGISTER 22-7: AD1CSSL: A/D INPUT SCAN SELECT REGISTER (LOW) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 CSSL<15:0>: A/D Input Pin Scan Selection bits 1 = Corresponding analog channel selected for input scan 0 = Analog channel omitted from input scan Note 1: Based on TCY = 2 * TOSC; Doze mode and PLL are disabled. TAD = TCY • (ADCS + 1) TAD TCY ADCS = – 1  2009 Microchip Technology Inc. DS39897C-page 275 PIC24FJ256GB110 FAMILY FIGURE 22-2: 10-BIT A/D CONVERTER ANALOG INPUT MODEL FIGURE 22-3: A/D TRANSFER FUNCTION VA CPIN Rs ANx VT = 0.6V VT = 0.6V ILEAKAGE RIC  250 Sampling Switch RSS CHOLD = DAC capacitance VSS VDD 500 nA = 4.4 pF (Typical) Legend: CPIN VT ILEAKAGE RIC RSS CHOLD = Input Capacitance = Threshold Voltage = Leakage Current at the pin due to = Interconnect Resistance = Sampling Switch Resistance = Sample/Hold Capacitance (from DAC) various junctions Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs  5 k. RSS  5 k(Typical) 6-11 pF (Typical) 10 0000 0001 (513) 10 0000 0010 (514) 10 0000 0011 (515) 01 1111 1101 (509) 01 1111 1110 (510) 01 1111 1111 (511) 11 1111 1110 (1022) 11 1111 1111 (1023) 00 0000 0000 (0) 00 0000 0001 (1) Output Code 10 0000 0000 (512) (VINH – VINL) VRVR+ – VR- 1024 512*(VR+ – VR-) 1024 VR+ VR- + VR- + 1023*(VR+ – VR-) 1024 VR- + 0 (Binary (Decimal)) Voltage Level PIC24FJ256GB110 FAMILY DS39897C-page 276  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 277 PIC24FJ256GB110 FAMILY 23.0 TRIPLE COMPARATOR MODULE The triple comparator module provides three dual input comparators. The inputs to the comparator can be configured to use any one of four external analog inputs as well, as a voltage reference input from either the internal band gap reference divided by two (VBG/2) or the comparator voltage reference generator. The comparator outputs may be directly connected to the CxOUT pins. When the respective COE equals ‘1’, the I/O pad logic makes the unsynchronized output of the comparator available on the pin. A simplified block diagram of the module in shown in Figure 23-1. Diagrams of the possible individual comparator configurations are shown in Figure 23-2. Each comparator has its own control register, CMxCON (Register 23-1), for enabling and configuring its operation. The output and event status of all three comparators is provided in the CMSTAT register (Register 23-2). FIGURE 23-1: TRIPLE COMPARATOR MODULE BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the associated “PIC24F Family Reference Manual” chapter. C1 VINCXINB VIN+ CXINC CXINA CXIND CVREF VBG/2 C2 VINVIN+ C3 VINVIN+ COE C1OUT Pin CPOL Trigger/Interrupt Logic CEVT EVPOL<1:0> COUT Input Select Logic CCH<1:0> CREF COE C2OUT Pin CPOL Trigger/Interrupt Logic CEVT EVPOL<1:0> COUT COE C3OUT Pin CPOL Trigger/Interrupt Logic CEVT EVPOL<1:0> COUT PIC24FJ256GB110 FAMILY DS39897C-page 278  2009 Microchip Technology Inc. FIGURE 23-2: INDIVIDUAL COMPARATOR CONFIGURATIONS Cx VINVIN+ Off (Read as ‘0’) Comparator Off CEN = 0, CREF = x, CCH<1:0> = xx Comparator CxINB > CxINA Compare CEN = 1, CREF = 0, CCH<1:0> = 00 COE CxOUT Cx VINVIN+ COE CXINB CXINA Comparator CxIND > CxINA Compare CEN = 1, CREF = 0, CCH<1:0> = 10 Cx VINVIN+ COE CxOUT CXIND CXINA Comparator CxINC > CxINA Compare CEN = 1, CREF = 0, CCH<1:0> = 01 Cx VINVIN+ COE CXINC CXINA Comparator VBG > CxINA Compare CEN = 1, CREF = 0, CCH<1:0> = 11 Cx VINVIN+ COE VBG/2 CXINA Comparator CxINB > CVREF Compare CEN = 1, CREF = 1, CCH<1:0> = 00 Cx VINVIN+ COE CXINB CVREF Comparator CxIND > CVREF Compare CEN = 1, CREF = 1, CCH<1:0> = 10 Cx VINVIN+ COE CXIND CVREF Comparator CxINC > CVREF Compare CEN = 1, CREF = 1, CCH<1:0> = 01 Cx VINVIN+ COE CXINC CVREF Comparator VBG > CVREF Compare CEN = 1, CREF = 1, CCH<1:0> = 11 Cx VINVIN+ COE VBG/2 CVREF Pin Pin CxOUT Pin CxOUT Pin CxOUT Pin CxOUT Pin CxOUT Pin CxOUT Pin CxOUT Pin  2009 Microchip Technology Inc. DS39897C-page 279 PIC24FJ256GB110 FAMILY REGISTER 23-1: CMxCON: COMPARATOR x CONTROL REGISTERS (COMPARATORS 1 THROUGH 3) R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R-0 CEN COE CPOL — — — CEVT COUT bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 EVPOL1 EVPOL0 — CREF — — CCH1 CCH0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CEN: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled bit 14 COE: Comparator Output Enable bit 1 = Comparator output is present on the CxOUT pin. 0 = Comparator output is internal only bit 13 CPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 12-10 Unimplemented: Read as ‘0’ bit 9 CEVT: Comparator Event bit 1 = Comparator event defined by EVPOL<1:0> has occurred; subsequent triggers and interrupts are disabled until the bit is cleared 0 = Comparator event has not occurred bit 8 COUT: Comparator Output bit When CPOL = 0: 1 = VIN+ > VIN- 0 = VIN+ < VINWhen CPOL = 1: 1 = VIN+ < VIN- 0 = VIN+ > VINbit 7-6 EVPOL<1:0>: Trigger/Event/Interrupt Polarity Select bits 11 = Trigger/event/interrupt generated on any change of the comparator output (while CEVT = 0) 10 = Trigger/event/interrupt generated on transition of the comparator output: If CPOL = 0 (non-inverted polarity): High-to-low transition only. If CPOL = 1 (inverted polarity): Low-to-high transition only. 01 = Trigger/event/interrupt generated on transition of comparator output: If CPOL = 0 (non-inverted polarity): Low-to-high transition only. If CPOL = 1 (inverted polarity): High-to-low transition only. 00 = Trigger/event/interrupt generation is disabled bit 5 Unimplemented: Read as ‘0’ PIC24FJ256GB110 FAMILY DS39897C-page 280  2009 Microchip Technology Inc. bit 4 CREF: Comparator Reference Select bits (non-inverting input) 1 = Non-inverting input connects to internal CVREF voltage 0 = Non-inverting input connects to CXINA pin bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 CCH<1:0>: Comparator Channel Select bits 11 = Inverting input of comparator connects to VBG/2 10 = Inverting input of comparator connects to CXIND pin 01 = Inverting input of comparator connects to CXINC pin 00 = Inverting input of comparator connects to CXINB pin REGISTER 23-1: CMxCON: COMPARATOR x CONTROL REGISTERS (COMPARATORS 1 THROUGH 3) (CONTINUED) REGISTER 23-2: CMSTAT: COMPARATOR MODULE STATUS REGISTER R/W-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0 CMIDL — — — — C3EVT C2EVT C1EVT bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0 — — — — — C3OUT C2OUT C1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CMIDL: Comparator Stop in Idle Mode bit 1 = Module does not generate interrupts in Idle mode, but is otherwise operational 0 = Module continues normal operation in Idle mode bit 14-11 Unimplemented: Read as ‘0’ bit 10 C3EVT: Comparator 3 Event Status bit (read-only) Shows the current event status of Comparator 3 (CM3CON<9>). bit 9 C2EVT: Comparator 2 Event Status bit (read-only) Shows the current event status of Comparator 2 (CM2CON<9>). bit 8 C1EVT: Comparator 1 Event Status bit (read-only) Shows the current event status of Comparator 1 (CM1CON<9>). bit 7-3 Unimplemented: Read as ‘0’ bit 2 C3OUT: Comparator 3 Output Status bit (read-only) Shows the current output of Comparator 3 (CM3CON<8>). bit 1 C2OUT: Comparator 2 Output Status bit (read-only) Shows the current output of Comparator 2 (CM2CON<8>). bit 0 C1OUT: Comparator 1 Output Status bit (read-only) Shows the current output of Comparator 1 (CM1CON<8>).  2009 Microchip Technology Inc. DS39897C-page 281 PIC24FJ256GB110 FAMILY 24.0 COMPARATOR VOLTAGE REFERENCE 24.1 Configuring the Comparator Voltage Reference The voltage reference module is controlled through the CVRCON register (Register 24-1). The comparator voltage reference provides two ranges of output voltage, each with 16 distinct levels. The range to be used is selected by the CVRR bit (CVRCON<5>). The primary difference between the ranges is the size of the steps selected by the CVREF Selection bits (CVR<3:0>), with one range offering finer resolution. The comparator reference supply voltage can come from either VDD and VSS, or the external VREF+ and VREF-. The voltage source is selected by the CVRSS bit (CVRCON<4>). The settling time of the comparator voltage reference must be considered when changing the CVREF output. FIGURE 24-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the “PIC24F Family Reference Manual”, ”Section 20. Comparator Voltage Reference Module” (DS39709). 16-to-1 MUX CVR<3:0> 8R CVREN R CVRSS = 0 AVDD VREF+ CVRSS = 1 8R CVRSS = 0 VREFCVRSS = 1 R R R R R R 16 Steps CVRR CVREF AVSS PIC24FJ256GB110 FAMILY DS39897C-page 282  2009 Microchip Technology Inc. REGISTER 24-1: CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down bit 6 CVROE: Comparator VREF Output Enable bit 1 = CVREF voltage level is output on CVREF pin 0 = CVREF voltage level is disconnected from CVREF pin bit 5 CVRR: Comparator VREF Range Selection bit 1 = CVRSRC range should be 0 to 0.625 CVRSRC with CVRSRC/24 step size 0 = CVRSRC range should be 0.25 to 0.719 CVRSRC with CVRSRC/32 step size bit 4 CVRSS: Comparator VREF Source Selection bit 1 = Comparator reference source CVRSRC = VREF+ – VREF- 0 = Comparator reference source CVRSRC = AVDD – AVSS bit 3-0 CVR<3:0>: Comparator VREF Value Selection 0  CVR3:CVR0  15 bits When CVRR = 1: CVREF = (CVR<3:0>/24)  (CVRSRC) When CVRR = 0: CVREF = 1/4  (CVRSRC) + (CVR<3:0>/32)  (CVRSRC)  2009 Microchip Technology Inc. DS39897C-page 283 PIC24FJ256GB110 FAMILY 25.0 CHARGE TIME MEASUREMENT UNIT (CTMU) The Charge Time Measurement Unit is a flexible analog module that provides accurate differential time measurement between pulse sources, as well as asynchronous pulse generation. Its key features include: • Four edge input trigger sources • Polarity control for each edge source • Control of edge sequence • Control of response to edges • Time measurement resolution of 1 nanosecond • Accurate current source suitable for capacitive measurement Together with other on-chip analog modules, the CTMU can be used to precisely measure time, measure capacitance, measure relative changes in capacitance, or generate output pulses that are independent of the system clock. The CTMU module is ideal for interfacing with capacitive-based sensors. The CTMU is controlled through two registers, CTMUCON and CTMUICON. CTMUCON enables the module, and controls edge source selection, edge source polarity selection, and edge sequencing. The CTMUICON register has controls the selection and trim of the current source. 25.1 Measuring Capacitance The CTMU module measures capacitance by generating an output pulse with a width equal to the time between edge events on two separate input channels. The pulse edge events to both input channels can be selected from four sources: two internal peripheral modules (OC1 and Timer1) and two external pins (CTEDG1 and CTEDG2). This pulse is used with the module’s precision current source to calculate capacitance according to the relationship: For capacitance measurements, the A/D Converter samples an external capacitor (CAPP) on one of its input channels after the CTMU output’s pulse. A precision resistor (RPR) provides current source calibration on a second A/D channel. After the pulse ends, the converter determines the voltage on the capacitor. The actual calculation of capacitance is performed in software by the application. Figure 25-1 shows the external connections used for capacitance measurements, and how the CTMU and A/D modules are related in this application. This example also shows the edge events coming from Timer1, but other configurations using external edge sources are possible. A detailed discussion on measuring capacitance and time with the CTMU module is provided in the “PIC24F Family Reference Manual”. FIGURE 25-1: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR CAPACITANCE MEASUREMENT Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the associated “PIC24F Family Reference Manual” chapter. I C dV -d---T-- =  PIC24F Device A/D Converter CTMU ANx CAPP Output Pulse EDG1 EDG2 RPR ANY Timer1 Current Source PIC24FJ256GB110 FAMILY DS39897C-page 284  2009 Microchip Technology Inc. 25.2 Measuring Time Time measurements on the pulse width can be similarly performed, using the A/D module’s internal capacitor (CAD) and a precision resistor for current calibration. Figure 25-2 shows the external connections used for time measurements, and how the CTMU and A/D modules are related in this application. This example also shows both edge events coming from the external CTEDG pins, but other configurations using internal edge sources are possible. A detailed discussion on measuring capacitance and time with the CTMU module is provided in the “PIC24F Family Reference Manual”. 25.3 Pulse Generation and Delay The CTMU module can also generate an output pulse with edges that are not synchronous with the device’s system clock. More specifically, it can generate a pulse with a programmable delay from an edge event input to the module. When the module is configured for pulse generation delay by setting the TGEN bit (CTMUCON<12>), the internal current source is connected to the B input of Comparator 2. A capacitor (CDELAY) is connected to the Comparator 2 pin, C2INB, and the comparator voltage reference, CVREF, is connected to C2INA. CVREF is then configured for a specific trip point. The module begins to charge CDELAY when an edge event is detected. When CDELAY charges above the CVREF trip point, a pulse is output on CTPLS. The length of the pulse delay is determined by the value of CDELAY and the CVREF trip point. Figure 25-3 shows the external connections for pulse generation, as well as the relationship of the different analog modules required. While CTEDG1 is shown as the input pulse source, other options are available. A detailed discussion on pulse generation with the CTMU module is provided in the “PIC24F Family Reference Manual”. FIGURE 25-2: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR TIME MEASUREMENT FIGURE 25-3: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR PULSE DELAY GENERATION PIC24F Device A/D Converter CTMU CTEDG1 CTEDG2 ANx Output Pulse EDG1 EDG2 CAD RPR Current Source C2 CVREF CTPLS PIC24F Device Current Source Comparator CTMU CTEDG1 C2INB CDELAY EDG1  2009 Microchip Technology Inc. DS39897C-page 285 PIC24FJ256GB110 FAMILY REGISTER 25-1: CTMUCON: CTMU CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CTMUEN — CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EDG2POL EDG2SEL1 EDG2SEL0 EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CTMUEN: CTMU Enable bit 1 = Module is enabled 0 = Module is disabled bit 14 Unimplemented: Read as ‘0’ bit 13 CTMUSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 TGEN: Time Generation Enable bit(1) 1 = Enables edge delay generation 0 = Disables edge delay generation bit 10 EDGEN: Edge Enable bit 1 = Edges are not blocked 0 = Edges are blocked bit 10 EDGSEQEN: Edge Sequence Enable bit 1 = Edge 1 event must occur before Edge 2 event can occur 0 = No edge sequence is needed bit 9 IDISSEN: Analog Current Source Control bit 1 = Analog current source output is grounded 0 = Analog current source output is not grounded bit 8 CTTRIG: Trigger Control bit 1 = Trigger output is enabled 0 = Trigger output is disabled bit 7 EDG2POL: Edge 2 Polarity Select bit 1 = Edge 2 programmed for a positive edge response 0 = Edge 2 programmed for a negative edge response bit 6-5 EDG2SEL<1:0>: Edge 2 Source Select bits 11 = CTED1 pin 10 = CTED2 pin 01 = OC1 module 00 = Timer1 module bit 4 EDG1POL: Edge 1 Polarity Select bit 1 = Edge 1 programmed for a positive edge response 0 = Edge 1 programmed for a negative edge response Note 1: If TGEN = 1, the CTEDGx inputs and CTPLS outputs must be assigned to available RPn pins before use. See Section 10.4 “Peripheral Pin Select” for more information. PIC24FJ256GB110 FAMILY DS39897C-page 286  2009 Microchip Technology Inc. bit 3-2 EDG1SEL<1:0>: Edge 1 Source Select bits 11 = CTED1 pin 10 = CTED2 pin 01 = OC1 module 00 = Timer1 module bit 1 EDG2STAT: Edge 2 Status bit 1 = Edge 2 event has occurred 0 = Edge 2 event has not occurred bit 0 EDG1STAT: Edge 1 Status bit 1 = Edge 1 event has occurred 0 = Edge 1 event has not occurred REGISTER 25-1: CTMUCON: CTMU CONTROL REGISTER (CONTINUED) Note 1: If TGEN = 1, the CTEDGx inputs and CTPLS outputs must be assigned to available RPn pins before use. See Section 10.4 “Peripheral Pin Select” for more information. REGISTER 25-2: CTMUICON: CTMU CURRENT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0 bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-10 ITRIM<5:0>: Current Source Trim bits 011111 = Maximum positive change from nominal current 011110 . . . . . 000001 = Minimum positive change from nominal current 000000 = Nominal current output specified by IRNG<1:0> 111111 = Minimum negative change from nominal current . . . . . 100010 100001 = Maximum negative change from nominal current bit 9-8 IRNG<1:0>: Current Source Range Select bits 11 = 100  Base current 10 = 10  Base current 01 = Base current level (0.55 A nominal) 00 = Current source disabled bit 7-0 Unimplemented: Read as ‘0’  2009 Microchip Technology Inc. DS39897C-page 287 PIC24FJ256GB110 FAMILY 26.0 SPECIAL FEATURES PIC24FJ256GB110 family devices include several features intended to maximize application flexibility and reliability, and minimize cost through elimination of external components. These are: • Flexible Configuration • Watchdog Timer (WDT) • Code Protection • JTAG Boundary Scan Interface • In-Circuit Serial Programming • In-Circuit Emulation 26.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’), to select various device configurations. These bits are mapped starting at program memory location F80000h. A detailed explanation of the various bit functions is provided in Register 26-1 through Register 26-5. Note that address F80000h is beyond the user program memory space. In fact, it belongs to the configuration memory space (800000h-FFFFFFh) which can only be accessed using table reads and table writes. 26.1.1 CONSIDERATIONS FOR CONFIGURING PIC24FJ256GB110 FAMILY DEVICES In PIC24FJ256GB110 family devices, the configuration bytes are implemented as volatile memory. This means that configuration data must be programmed each time the device is powered up. Configuration data is stored in the three words at the top of the on-chip program memory space, known as the Flash Configuration Words. Their specific locations are shown in Table 26-1. These are packed representations of the actual device Configuration bits, whose actual locations are distributed among several locations in configuration space. The configuration data is automatically loaded from the Flash Configuration Words to the proper Configuration registers during device Resets. When creating applications for these devices, users should always specifically allocate the location of the Flash Configuration Word for configuration data. This is to make certain that program code is not stored in this address when the code is compiled. The upper byte of all Flash Configuration Words in program memory should always be ‘1111 1111’. This makes them appear to be NOP instructions in the remote event that their locations are ever executed by accident. Since Configuration bits are not implemented in the corresponding locations, writing ‘1’s to these locations has no effect on device operation. TABLE 26-1: FLASH CONFIGURATION WORD LOCATIONS FOR PIC24FJ256GB110 FAMILY DEVICES Note: This data sheet summarizes the features of this group of PIC24F devices. It is not intended to be a comprehensive reference source. For more information, refer to the following sections of the “PIC24F Family Reference Manual”: • Section 9. “Watchdog Timer (WDT)” (DS39697) • Section 32. “High-Level Device Integration” (DS39719) • Section 33. “Programming and Diagnostics” (DS39716) Note: Configuration data is reloaded on all types of device Resets. Note: Performing a page erase operation on the last page of program memory clears the Flash Configuration Words, enabling code protection as a result. Therefore, users should avoid performing page erase operations on the last page of program memory. Device Configuration Word Addresses 1 2 3 PIC24FJ64GB1 ABFEh ABFCh ABFAh PIC24FJ128GB1 157FEh 157FC 157FA PIC24FJ192GB1 20BFEh 20BFC 20BFA PIC24FJ256GB1 2ABFEh 2ABFC 2ABFA PIC24FJ256GB110 FAMILY DS39897C-page 288  2009 Microchip Technology Inc. REGISTER 26-1: CW1: FLASH CONFIGURATION WORD 1 U-1 U-1 U-1 U-1 U-1 U-1 U-1 U-1 — — — — — — — — bit 23 bit 16 r-x R/PO-1 R/PO-1 R/PO-1 R/PO-1 r-1 R/PO-1 R/PO-1 r JTAGEN(1) GCP GWRP DEBUG r ICS1 ICS0 bit 15 bit 8 R/PO-1 R/PO-1 U-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 FWDTEN WINDIS — FWPSA WDTPS3 WDTPS2 WDTPS1 WDTPS0 bit 7 bit 0 Legend: r = Reserved bit R = Readable bit PO = Program Once bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared bit 23-16 Unimplemented: Read as ‘1’ bit 15 Reserved: The value is unknown; program as ‘0’ bit 14 JTAGEN: JTAG Port Enable bit(1) 1 = JTAG port is enabled 0 = JTAG port is disabled bit 13 GCP: General Segment Program Memory Code Protection bit 1 = Code protection is disabled 0 = Code protection is enabled for the entire program memory space bit 12 GWRP: General Segment Code Flash Write Protection bit 1 = Writes to program memory are allowed 0 = Writes to program memory are disabled bit 11 DEBUG: Background Debugger Enable bit 1 = Device resets into Operational mode 0 = Device resets into Debug mode bit 10 Reserved: Always maintain as ‘1’ bit 9-8 ICS1:ICS0: Emulator Pin Placement Select bits 11 = Emulator functions are shared with PGEC1/PGED1 10 = Emulator functions are shared with PGEC2/PGED2 01 = Emulator functions are shared with PGEC3/PGED3 00 = Reserved; do not use bit 7 FWDTEN: Watchdog Timer Enable bit 1 = Watchdog Timer is enabled 0 = Watchdog Timer is disabled bit 6 WINDIS: Windowed Watchdog Timer Disable bit 1 = Standard Watchdog Timer enabled 0 = Windowed Watchdog Timer enabled; FWDTEN must be ‘1’ bit 5 Unimplemented: Read as ‘1’ bit 4 FWPSA: WDT Prescaler Ratio Select bit 1 = Prescaler ratio of 1:128 0 = Prescaler ratio of 1:32 Note 1: The JTAGEN bit can only be modified using In-Circuit Serial Programming™ (ICSP™). It cannot be modified while programming the device through the JTAG interface.  2009 Microchip Technology Inc. DS39897C-page 289 PIC24FJ256GB110 FAMILY bit 3-0 WDTPS<3:0>: Watchdog Timer Postscaler Select bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 REGISTER 26-1: CW1: FLASH CONFIGURATION WORD 1 (CONTINUED) Note 1: The JTAGEN bit can only be modified using In-Circuit Serial Programming™ (ICSP™). It cannot be modified while programming the device through the JTAG interface. PIC24FJ256GB110 FAMILY DS39897C-page 290  2009 Microchip Technology Inc. REGISTER 26-2: CW2: FLASH CONFIGURATION WORD 2 U-1 U-1 U-1 U-1 U-1 U-1 U-1 U-1 — — — — — — — — bit 23 bit 16 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 IESO PLLDIV2 PLLDIV1 PLLDIV0 PLLDIS FNOSC2 FNOSC1 FNOSC0 bit 15 bit 8 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 r-1 R/PO-1 R/PO-1 FCKSM1 FCKSM0 OSCIOFCN IOL1WAY DISUVREG r POSCMD1 POSCMD0 bit 7 bit 0 Legend: r = Reserved bit R = Readable bit PO = Program-once bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared bit 23-16 Unimplemented: Read as ‘1’ bit 15 IESO: Internal External Switchover bit 1 = IESO mode (Two-Speed Start-up) enabled 0 = IESO mode (Two-Speed Start-up) disabled bit 14-12 PLLDIV<2:0>: USB 96 MHz PLL Prescaler Select bits 111 = Oscillator input divided by 12 (48 MHz input) 110 = Oscillator input divided by 10 (40 MHz input) 101 = Oscillator input divided by 6 (24 MHz input) 100 = Oscillator input divided by 5 (20 MHz input) 011 = Oscillator input divided by 4 (16 MHz input) 010 = Oscillator input divided by 3 (12 MHz input) 001 = Oscillator input divided by 2 (8 MHz input) 000 = Oscillator input used directly (4 MHz input) bit 11 PLLDIS: USB 96 MHz PLL Disable bit 1 = PLL disabled 0 = PLL enabled (required for all USB operations) bit 10-8 FNOSC<2:0>: Initial Oscillator Select bits 111 = Fast RC Oscillator with Postscaler (FRCDIV) 110 = Reserved 101 = Low-Power RC Oscillator (LPRC) 100 = Secondary Oscillator (SOSC) 011 = Primary Oscillator with PLL module (XTPLL, HSPLL, ECPLL) 010 = Primary Oscillator (XT, HS, EC) 001 = Fast RC Oscillator with postscaler and PLL module (FRCPLL) 000 = Fast RC Oscillator (FRC) bit 7-6 FCKSM<1:0>: Clock Switching and Fail-Safe Clock Monitor Configuration bits 1x = Clock switching and Fail-Safe Clock Monitor are disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled bit 5 OSCIOFCN: OSCO Pin Configuration bit If POSCMD<1:0> = 11 or 00: 1 = OSCO/CLKO/RC15 functions as CLKO (FOSC/2) 0 = OSCO/CLKO/RC15 functions as port I/O (RC15) If POSCMD<1:0> = 10 or 01: OSCIOFCN has no effect on OSCO/CLKO/RC15.  2009 Microchip Technology Inc. DS39897C-page 291 PIC24FJ256GB110 FAMILY bit 4 IOL1WAY: IOLOCK One-Way Set Enable bit 1 = The IOLOCK bit (OSCCON<6>)can be set once, provided the unlock sequence has been completed. Once set, the Peripheral Pin Select registers cannot be written to a second time. 0 = The IOLOCK bit can be set and cleared as needed, provided the unlock sequence has been completed bit 3 DISUVREG: Internal USB 3.3V Regulator Disable bit 1 = Regulator is disabled 0 = Regulator is enabled bit 2 Reserved: Always maintain as ‘1’ bit 1-0 POSCMD<1:0>: Primary Oscillator Configuration bits 11 = Primary Oscillator disabled 10 = HS Oscillator mode selected 01 = XT Oscillator mode selected 00 = EC Oscillator mode selected REGISTER 26-2: CW2: FLASH CONFIGURATION WORD 2 (CONTINUED) REGISTER 26-3: CW3: FLASH CONFIGURATION WORD 3 U-1 U-1 U-1 U-1 U-1 U-1 U-1 U-1 — — — — — — — — bit 23 bit 16 R/PO-1 R/PO-1 R/PO-1 U-1 U-1 U-1 U-1 U-1 WPEND WPCFG WPDIS — — — — — bit 15 bit 8 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 R/PO-1 WPFP7 WPFP6 WPFP5 WPFP4 WPFP3 WPFP2 WPFP1 WPFP0 bit 7 bit 0 Legend: R = Readable bit PO = Program-once bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed ‘1’ = Bit is set ‘0’ = Bit is cleared bit 23-16 Unimplemented: Read as ‘1’ bit 15 WPEND: Segment Write Protection End Page Select bit 1 = Protected code segment lower boundary is at the bottom of program memory (000000h); upper boundary is the code page specified by WPFP<7:0> 0 = Protected code segment upper boundary is at the last page of program memory; lower boundary is the code page specified by WPFP<7:0> bit 14 WPCFG: Configuration Word Code Page Protection Select bit 1 = Last page (at the top of program memory) and Flash Configuration Words are not protected 0 = Last page and Flash Configuration Words are code protected bit 13 WPDIS: Segment Write Protection Disable bit 1 = Segmented code protection disabled 0 = Segmented code protection enabled; protected segment defined by WPEND, WPCFG and WPFPx Configuration bits bit 12-8 Unimplemented: Read as ‘1’ bit 7-0 WPFP<7:0>: Protected Code Segment Boundary Page bits Designates the 512-word program code page that is the boundary of the protected code segment, starting with Page 0 at the bottom of program memory. If WPEND = 1: Last address of designated code page is the upper boundary of the segment. If WPEND = ‘0’: First address of designated code page is the lower boundary of the segment. PIC24FJ256GB110 FAMILY DS39897C-page 292  2009 Microchip Technology Inc. REGISTER 26-4: DEVID: DEVICE ID REGISTER U U U U U U U U — — — — — — — — bit 23 bit 16 U U R R R R R R — — FAMID7 FAMID6 FAMID5 FAMID4 FAMID3 FAMID2 bit 15 bit 8 R R R R R R R R FAMID1 FAMID0 DEV5 DEV4 DEV3 DEV2 DEV1 DEV0 bit 7 bit 0 Legend: R = Read-only bit U = Unimplemented bit bit 23-14 Unimplemented: Read as ‘1’ bit 13-6 FAMID<7:0>: Device Family Identifier bits 01000000 = PIC24FJ256GB110 family bit 5-0 DEV<5:0>: Individual Device Identifier bits 000001 = PIC24FJ64GB106 000011 = PIC24FJ64GB108 000111 = PIC24FJ64GB110 001001 = PIC24FJ128GB106 001011 = PIC24FJ128GB108 001111 = PIC24FJ128GB110 010001 = PIC24FJ192GB106 010011 = PIC24FJ192GB108 010111 = PIC24FJ192GB110 011001 = PIC24FJ256GB106 011011 = PIC24FJ256GB108 011111 = PIC24FJ256GB110 REGISTER 26-5: DEVREV: DEVICE REVISION REGISTER U U U U U U U U — — — — — — — — bit 23 bit 16 U U U U U U U R — — — — — — — MAJRV2 bit 15 bit 8 R R U U U R R R MAJRV1 MAJRV0 — — — DOT2 DOT1 DOT0 bit 7 bit 0 Legend: R = Read-only bit U = Unimplemented bit bit 23-9 Unimplemented: Read as ‘0’ bit 8-6 MAJRV<2:0>: Major Revision Identifier bits bit 5-3 Unimplemented: Read as ‘0’ bit 2-0 DOT<2:0>: Minor Revision Identifier bits  2009 Microchip Technology Inc. DS39897C-page 293 PIC24FJ256GB110 FAMILY 26.2 On-Chip Voltage Regulator All PIC24FJ256GB110 family devices power their core digital logic at a nominal 2.5V. This may create an issue for designs that are required to operate at a higher typical voltage, such as 3.3V. To simplify system design, all devices in the PIC24FJ256GB110 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator is controlled by the ENVREG pin. Tying VDD to the pin enables the regulator, which in turn, provides power to the core from the other VDD pins. When the regulator is enabled, a low-ESR capacitor (such as ceramic) must be connected to the VDDCORE/VCAP pin (Figure 26-1). This helps to maintain the stability of the regulator. The recommended value for the filter capacitor (CEFC) is provided in Section 29.1 “DC Characteristics”. If ENVREG is tied to VSS, the regulator is disabled. In this case, separate power for the core logic, at a nominal 2.5V, must be supplied to the device on the VDDCORE/VCAP pin to run the I/O pins at higher voltage levels, typically 3.3V. Alternatively, the VDDCORE/VCAP and VDD pins can be tied together to operate at a lower nominal voltage. Refer to Figure 26-1 for possible configurations. 26.2.1 VOLTAGE REGULATOR TRACKING MODE AND LOW-VOLTAGE DETECTION When it is enabled, the on-chip regulator provides a constant voltage of 2.5V nominal to the digital core logic. The regulator can provide this level from a VDD of about 2.5V, all the way up to the device’s VDDMAX. It does not have the capability to boost VDD levels below 2.5V. In order to prevent “brown out” conditions when the voltage drops too low for the regulator, the regulator enters Tracking mode. In Tracking mode, the regulator output follows VDD, with a typical voltage drop of 100 mV. When the device enters Tracking mode, it is no longer possible to operate at full speed. To provide information about when the device enters Tracking mode, the on-chip regulator includes a simple, Low-Voltage Detect circuit. When VDD drops below full-speed operating voltage, the circuit sets the Low-Voltage Detect Interrupt Flag, LVDIF (IFS4<8>). This can be used to generate an interrupt and put the application into a low-power operational mode, or trigger an orderly shutdown. Low-Voltage Detection (LVD) is only available when the regulator is enabled. FIGURE 26-1: CONNECTIONS FOR THE ON-CHIP REGULATOR VDD ENVREG VDDCORE/VCAP VSS PIC24FJ256GB 2.5V(1) 3.3V(1) VDD ENVREG VDDCORE/VCAP VSS PIC24FJ256GB CEFC 3.3V Regulator Enabled (ENVREG tied to VDD): Regulator Disabled (ENVREG tied to ground): VDD ENVREG VDDCORE/VCAP VSS PIC24FJ256GB 2.5V(1) Regulator Disabled (VDD tied to VDDCORE): Note 1: These are typical operating voltages. Refer to Section 29.1 “DC Characteristics” for the full operating ranges of VDD and VDDCORE. (10 F typ) PIC24FJ256GB110 FAMILY DS39897C-page 294  2009 Microchip Technology Inc. 26.2.2 ON-CHIP REGULATOR AND POR When the voltage regulator is enabled, it takes approximately 10 s for it to generate output. During this time, designated as TVREG, code execution is disabled. TVREG is applied every time the device resumes operation after any power-down, including Sleep mode. The length of TVREG is determined by the PMSLP bit (RCON<8>), as described in Section 26.2.5 “Voltage Regulator Standby Mode”. If the regulator is disabled, a separate Power-up Timer (PWRT) is automatically enabled. The PWRT adds a fixed delay of 64 ms nominal delay at device start-up (POR or BOR only). When waking up from Sleep with the regulator disabled, the PMSLP bit determines the wake-up time. When operating with the regulator disabled, setting PMSLP can decrease the device wake-up time. 26.2.3 ON-CHIP REGULATOR AND BOR When the on-chip regulator is enabled, PIC24FJ256GB110 family devices also have a simple brown-out capability. If the voltage supplied to the regulator is inadequate to maintain the tracking level, the regulator Reset circuitry will generate a Brown-out Reset. This event is captured by the BOR flag bit (RCON<1>). The brown-out voltage specifications are provided in the “PIC24FJ Family Reference Manual”, Section 7. “Reset” (DS39712). 26.2.4 POWER-UP REQUIREMENTS The on-chip regulator is designed to meet the power-up requirements for the device. If the application does not use the regulator, then strict power-up conditions must be adhered to. While powering up, VDDCORE must never exceed VDD by 0.3 volts. 26.2.5 VOLTAGE REGULATOR STANDBY MODE When enabled, the on-chip regulator always consumes a small incremental amount of current over IDD/IPD, including when the device is in Sleep mode, even though the core digital logic does not require power. To provide additional savings in applications where power resources are critical, the regulator automatically disables itself whenever the device goes into Sleep mode. This feature is controlled by the PMSLP bit (RCON<8>). By default, the bit is cleared, which removes power from the Flash program memory and thus enables Standby mode. When waking up from Standby mode, the regulator must wait for TVREG to expire before wake-up. This extra time is needed to ensure that the regulator can source enough current to power the Flash memory. For applications which require a faster wake-up time, it is possible to disable regulator Standby mode. The PMSLP bit can be set to turn off Standby mode so that the Flash stays powered when in Sleep mode and the device can wake-up without waiting for TVREG. When PMSLP is set, the power consumption while in Sleep mode, will be approximately 40 A higher than power consumption when the regulator is allowed to enter Standby mode. 26.3 Watchdog Timer (WDT) For PIC24FJ256GB110 family devices, the WDT is driven by the LPRC Oscillator. When the WDT is enabled, the clock source is also enabled. The nominal WDT clock source from LPRC is 31 kHz. This feeds a prescaler that can be configured for either 5-bit (divide-by-32) or 7-bit (divide-by-128) operation. The prescaler is set by the FWPSA Configuration bit. With a 31 kHz input, the prescaler yields a nominal WDT time-out period (TWDT) of 1 ms in 5-bit mode, or 4 ms in 7-bit mode. A variable postscaler divides down the WDT prescaler output and allows for a wide range of time-out periods. The postscaler is controlled by the WDTPS<3:0> Configuration bits (CW1<3:0>), which allow the selection of a total of 16 settings, from 1:1 to 1:32,768. Using the prescaler and postscaler, time-out periods ranging from 1 ms to 131 seconds can be achieved. The WDT, prescaler and postscaler are reset: • On any device Reset • On the completion of a clock switch, whether invoked by software (i.e., setting the OSWEN bit after changing the NOSC bits) or by hardware (i.e., Fail-Safe Clock Monitor) • When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) • When the device exits Sleep or Idle mode to resume normal operation • By a CLRWDT instruction during normal execution If the WDT is enabled, it will continue to run during Sleep or Idle modes. When the WDT time-out occurs, the device will wake the device and code execution will continue from where the PWRSAV instruction was executed. The corresponding SLEEP or IDLE bits (RCON<3:2>) will need to be cleared in software after the device wakes up. The WDT Flag bit, WDTO (RCON<4>), is not automatically cleared following a WDT time-out. To detect subsequent WDT events, the flag must be cleared in software. Note: For more information, see Section 29.0 “Electrical Characteristics”. Note: The CLRWDT and PWRSAV instructions clear the prescaler and postscaler counts when executed.  2009 Microchip Technology Inc. DS39897C-page 295 PIC24FJ256GB110 FAMILY 26.3.1 WINDOWED OPERATION The Watchdog Timer has an optional Fixed Window mode of operation. In this Windowed mode, CLRWDT instructions can only reset the WDT during the last 1/4 of the programmed WDT period. A CLRWDT instruction executed before that window causes a WDT Reset, similar to a WDT time-out. Windowed WDT mode is enabled by programming the WINDIS Configuration bit (CW1<6>) to ‘0’. 26.3.2 CONTROL REGISTER The WDT is enabled or disabled by the FWDTEN Configuration bit. When the FWDTEN Configuration bit is set, the WDT is always enabled. The WDT can be optionally controlled in software when the FWDTEN Configuration bit has been programmed to ‘0’. The WDT is enabled in software by setting the SWDTEN control bit (RCON<5>). The SWDTEN control bit is cleared on any device Reset. The software WDT option allows the user to enable the WDT for critical code segments and disable the WDT during non-critical segments for maximum power savings. FIGURE 26-2: WDT BLOCK DIAGRAM 26.4 Program Verification and Code Protection PIC24FJ256GB110 family devices provide two complimentary methods to protect application code from overwrites and erasures. These also help to protect the device from inadvertent configuration changes during run time. 26.4.1 GENERAL SEGMENT PROTECTION For all devices in the PIC24FJ256GB110 family, the on-chip program memory space is treated as a single block, known as the General Segment (GS). Code protection for this block is controlled by one Configuration bit, GCP. This bit inhibits external reads and writes to the program memory space. It has no direct effect in normal execution mode. Write protection is controlled by the GWRP bit in the Configuration Word. When GWRP is programmed to ‘0’, internal write and erase operations to program memory are blocked. 26.4.2 CODE SEGMENT PROTECTION In addition to global General Segment protection, a separate subrange of the program memory space can be individually protected against writes and erases. This area can be used for many purposes where a separate block of write and erase protected code is needed, such as bootloader applications. Unlike common boot block implementations, the specially protected segment in PIC24FJ256GB110 family devices can be located by the user anywhere in the program space, and configured in a wide range of sizes. Code segment protection provides an added level of protection to a designated area of program memory, by disabling the NVM safety interlock whenever a write or erase address falls within a specified range. They do not override General Segment protection controlled by the GCP or GWRP bits. For example, if GCP and GWRP are enabled, enabling segmented code protection for the bottom half of program memory does not undo General Segment protection for the top half. LPRC Input WDT Overflow Wake from Sleep 31 kHz Prescaler Postscaler FWPSA SWDTEN FWDTEN Reset All Device Resets Sleep or Idle Mode LPRC Control CLRWDT Instr. PWRSAV Instr. (5-bit/7-bit) 1:1 to 1:32.768 WDTPS<3:0> 1 ms/4 ms Exit Sleep or Idle Mode WDT Counter Transition to New Clock Source PIC24FJ256GB110 FAMILY DS39897C-page 296  2009 Microchip Technology Inc. The size and type of protection for the segmented code range are configured by the WPFPx, WPEND, WPCFG and WPDIS bits in Configuration Word 3. Code segment protection is enabled by programming the WPDIS bit (= 0). The WPFP bits specify the size of the segment to be protected, by specifying the 512-word code page that is the start or end of the protected segment. The specified region is inclusive, therefore, this page will also be protected. The WPEND bit determines if the protected segment uses the top or bottom of the program space as a boundary. Programming WPEND (= 0) sets the bottom of program memory (000000h) as the lower boundary of the protected segment. Leaving WPEND unprogrammed (= 1) protects the specified page through the last page of implemented program memory, including the Configuration Word locations. A separate bit, WPCFG, is used to independently protect the last page of program space, including the Flash Configuration Words. Programming WPCFG (= 0) protects the last page regardless of the other bit settings. This may be useful in circumstances where write protection is needed for both a code segment in the bottom of memory, as well as the Flash Configuration Words. The various options for segment code protection are shown in Table 26-2. 26.4.3 CONFIGURATION REGISTER PROTECTION The Configuration registers are protected against inadvertent or unwanted changes or reads in two ways. The primary protection method is the same as that of the RP registers – shadow registers contain a complimentary value which is constantly compared with the actual value. To safeguard against unpredictable events, Configuration bit changes resulting from individual cell level disruptions (such as ESD events) will cause a parity error and trigger a device Reset. The data for the Configuration registers is derived from the Flash Configuration Words in program memory. When the GCP bit is set, the source data for device configuration is also protected as a consequence. Even if General Segment protection is not enabled, the device configuration can be protected by using the appropriate code cement protection setting. TABLE 26-2: SEGMENT CODE PROTECTION CONFIGURATION OPTIONS Segment Configuration Bits Write/Erase Protection of Code Segment WPDIS WPEND WPCFG 1 X x No additional protection enabled; all program memory protection configured by GCP and GWRP 0 1 x Addresses from first address of code page defined by WPFP<7:0> through end of implemented program memory (inclusive) write/erase protected, including Flash Configuration Words 0 0 1 Address 000000h through last address of code page defined by WPFP<7:0> (inclusive) write/erase protected 0 0 0 Address 000000h through last address of code page defined by WPFP<7:0> (inclusive) write/erase protected, and the last page is also write/erase protected.  2009 Microchip Technology Inc. DS39897C-page 297 PIC24FJ256GB110 FAMILY 26.5 JTAG Interface PIC24FJ256GB110 family devices implement a JTAG interface, which supports boundary scan device testing. 26.6 In-Circuit Serial Programming PIC24FJ256GB110 family microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock (PGECx) and data (PGEDx) and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. 26.7 In-Circuit Debugger When MPLAB® ICD 2 is selected as a debugger, the in-circuit debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. Debugging functionality is controlled through the PGECx (Emulation/Debug Clock) and PGEDx (Emulation/Debug Data) pins. To use the in-circuit debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS and the PGECx/PGEDx pin pair designated by the ICS Configuration bits. In addition, when the feature is enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. PIC24FJ256GB110 FAMILY DS39897C-page 298  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 299 PIC24FJ256GB110 FAMILY 27.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 27.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. PIC24FJ256GB110 FAMILY DS39897C-page 300  2009 Microchip Technology Inc. 27.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 27.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 27.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 27.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 27.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire device instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility  2009 Microchip Technology Inc. DS39897C-page 301 PIC24FJ256GB110 FAMILY 27.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 27.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 27.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto- use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 27.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming ™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. PIC24FJ256GB110 FAMILY DS39897C-page 302  2009 Microchip Technology Inc. 27.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 27.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. 27.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/ development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.  2009 Microchip Technology Inc. DS39897C-page 303 PIC24FJ256GB110 FAMILY 28.0 INSTRUCTION SET SUMMARY The PIC24F instruction set adds many enhancements to the previous PIC® MCU instruction sets, while maintaining an easy migration from previous PIC MCU instruction sets. Most instructions are a single program memory word. Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word divided into an 8-bit opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into four basic categories: • Word or byte-oriented operations • Bit-oriented operations • Literal operations • Control operations Table 28-1 shows the general symbols used in describing the instructions. The PIC24F instruction set summary in Table 28-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: • The first source operand which is typically a register ‘Wb’ without any address modifier • The second source operand which is typically a register ‘Ws’ with or without an address modifier • The destination of the result which is typically a register ‘Wd’ with or without an address modifier However, word or byte-oriented file register instructions have two operands: • The file register specified by the value, ‘f’ • The destination, which could either be the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ Most bit-oriented instructions (including simple rotate/shift instructions) have two operands: • The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’ or ‘f’) • The bit in the W register or file register (specified by a literal value or indirectly by the contents of register, ‘Wb’) The literal instructions that involve data movement may use some of the following operands: • A literal value to be loaded into a W register or file register (specified by the value of ‘k’) • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) However, literal instructions that involve arithmetic or logical operations use some of the following operands: • The first source operand which is a register ‘Wb’ without any address modifier • The second source operand which is a literal value • The destination of the result (only if not the same as the first source operand) which is typically a register ‘Wd’ with or without an address modifier The control instructions may use some of the following operands: • A program memory address • The mode of the table read and table write instructions All instructions are a single word, except for certain double-word instructions, which were made double- word instructions so that all the required information is available in these 48 bits. In the second word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles, with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/ computed branch), indirect CALL/GOTO, all table reads and writes, and RETURN/RETFIE instructions, which are single-word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. Moreover, double-word moves require two cycles. The double-word instructions execute in two instruction cycles. Note: This chapter is a brief summary of the PIC24F instruction set architecture, and is not intended to be a comprehensive reference source. PIC24FJ256GB110 FAMILY DS39897C-page 304  2009 Microchip Technology Inc. TABLE 28-1: SYMBOLS USED IN OPCODE DESCRIPTIONS Field Description #text Means literal defined by “text” (text) Means “content of text” [text] Means “the location addressed by text” { } Optional field or operation Register bit field .b Byte mode selection .d Double-Word mode selection .S Shadow register select .w Word mode selection (default) bit4 4-bit bit selection field (used in word addressed instructions) {0...15} C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address {0000h...1FFFh} lit1 1-bit unsigned literal {0,1} lit4 4-bit unsigned literal {0...15} lit5 5-bit unsigned literal {0...31} lit8 8-bit unsigned literal {0...255} lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal {0...16383} lit16 16-bit unsigned literal {0...65535} lit23 23-bit unsigned literal {0...8388607}; LSB must be ‘0’ None Field does not require an entry, may be blank PC Program Counter Slit10 10-bit signed literal {-512...511} Slit16 16-bit signed literal {-32768...32767} Slit6 6-bit signed literal {-16...16} Wb Base W register {W0..W15} Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register  { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) Wn One of 16 working registers {W0..W15} Wnd One of 16 destination working registers {W0..W15} Wns One of 16 source working registers {W0..W15} WREG W0 (working register used in file register instructions) Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }  2009 Microchip Technology Inc. DS39897C-page 305 PIC24FJ256GB110 FAMILY TABLE 28-2: INSTRUCTION SET OVERVIEW Assembly Mnemonic Assembly Syntax Description # of Words # of Cycles Status Flags Affected ADD ADD f f = f + WREG 1 1 C, DC, N, OV, Z ADD f,WREG WREG = f + WREG 1 1 C, DC, N, OV, Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C, DC, N, OV, Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C, DC, N, OV, Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C, DC, N, OV, Z ADDC ADDC f f = f + WREG + (C) 1 1 C, DC, N, OV, Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C, DC, N, OV, Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C, DC, N, OV, Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C, DC, N, OV, Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C, DC, N, OV, Z AND AND f f = f .AND. WREG 1 1 N, Z AND f,WREG WREG = f .AND. WREG 1 1 N, Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N, Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N, Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N, Z ASR ASR f f = Arithmetic Right Shift f 1 1 C, N, OV, Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C, N, OV, Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C, N, OV, Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N, Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N, Z BCLR BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None BRA BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if Greater than or Equal 1 1 (2) None BRA GEU,Expr Branch if Unsigned Greater than or Equal 1 1 (2) None BRA GT,Expr Branch if Greater than 1 1 (2) None BRA GTU,Expr Branch if Unsigned Greater than 1 1 (2) None BRA LE,Expr Branch if Less than or Equal 1 1 (2) None BRA LEU,Expr Branch if Unsigned Less than or Equal 1 1 (2) None BRA LT,Expr Branch if Less than 1 1 (2) None BRA LTU,Expr Branch if Unsigned Less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None BSET BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None BSW BSW.C Ws,Wb Write C bit to Ws 1 1 None BSW.Z Ws,Wb Write Z bit to Ws 1 1 None BTG BTG f,#bit4 Bit Toggle f 1 1 None BTG Ws,#bit4 Bit Toggle Ws 1 1 None BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None PIC24FJ256GB110 FAMILY DS39897C-page 306  2009 Microchip Technology Inc. BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws to C 1 1 C BTST.Z Ws,Wb Bit Test Ws to Z 1 1 Z BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z CALL CALL lit23 Call Subroutine 2 2 None CALL Wn Call Indirect Subroutine 1 2 None CLR CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO, Sleep COM COM f f = f 1 1 N, Z COM f,WREG WREG = f 1 1 N, Z COM Ws,Wd Wd = Ws 1 1 N, Z CP CP f Compare f with WREG 1 1 C, DC, N, OV, Z CP Wb,#lit5 Compare Wb with lit5 1 1 C, DC, N, OV, Z CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C, DC, N, OV, Z CP0 CP0 f Compare f with 0x0000 1 1 C, DC, N, OV, Z CP0 Ws Compare Ws with 0x0000 1 1 C, DC, N, OV, Z CPB CPB f Compare f with WREG, with Borrow 1 1 C, DC, N, OV, Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C, DC, N, OV, Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb – Ws – C) 1 1 C, DC, N, OV, Z CPSEQ CPSEQ Wb,Wn Compare Wb with Wn, Skip if = 1 1 (2 or 3) None CPSGT CPSGT Wb,Wn Compare Wb with Wn, Skip if > 1 1 (2 or 3) None CPSLT CPSLT Wb,Wn Compare Wb with Wn, Skip if < 1 1 (2 or 3) None CPSNE CPSNE Wb,Wn Compare Wb with Wn, Skip if  1 1 (2 or 3) None DAW DAW.b Wn Wn = Decimal Adjust Wn 1 1 C DEC DEC f f = f –1 1 1 C, DC, N, OV, Z DEC f,WREG WREG = f –1 1 1 C, DC, N, OV, Z DEC Ws,Wd Wd = Ws – 1 1 1 C, DC, N, OV, Z DEC2 DEC2 f f = f – 2 1 1 C, DC, N, OV, Z DEC2 f,WREG WREG = f – 2 1 1 C, DC, N, OV, Z DEC2 Ws,Wd Wd = Ws – 2 1 1 C, DC, N, OV, Z DISI DISI #lit14 Disable Interrupts for k Instruction Cycles 1 1 None DIV DIV.SW Wm,Wn Signed 16/16-bit Integer Divide 1 18 N, Z, C, OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N, Z, C, OV DIV.UW Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N, Z, C, OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N, Z, C, OV EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of Words # of Cycles Status Flags Affected  2009 Microchip Technology Inc. DS39897C-page 307 PIC24FJ256GB110 FAMILY GOTO GOTO Expr Go to Address 2 2 None GOTO Wn Go to Indirect 1 2 None INC INC f f = f + 1 1 1 C, DC, N, OV, Z INC f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z INC Ws,Wd Wd = Ws + 1 1 1 C, DC, N, OV, Z INC2 INC2 f f = f + 2 1 1 C, DC, N, OV, Z INC2 f,WREG WREG = f + 2 1 1 C, DC, N, OV, Z INC2 Ws,Wd Wd = Ws + 2 1 1 C, DC, N, OV, Z IOR IOR f f = f .IOR. WREG 1 1 N, Z IOR f,WREG WREG = f .IOR. WREG 1 1 N, Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N, Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N, Z IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N, Z LNK LNK #lit14 Link Frame Pointer 1 1 None LSR LSR f f = Logical Right Shift f 1 1 C, N, OV, Z LSR f,WREG WREG = Logical Right Shift f 1 1 C, N, OV, Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C, N, OV, Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N, Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N, Z MOV MOV f,Wn Move f to Wn 1 1 None MOV [Wns+Slit10],Wnd Move [Wns+Slit10] to Wnd 1 1 None MOV f Move f to f 1 1 N, Z MOV f,WREG Move f to WREG 1 1 N, Z MOV #lit16,Wn Move 16-bit Literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit Literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wns,[Wns+Slit10] Move Wns to [Wns+Slit10] 1 1 MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 N, Z MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = Signed(Wb) * Signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = Signed(Wb) * Unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = Unsigned(Wb) * Signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = Unsigned(Wb) * Unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = Signed(Wb) * Unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = Unsigned(Wb) * Unsigned(lit5) 1 1 None MUL f W3:W2 = f * WREG 1 1 None NEG NEG f f = f + 1 1 1 C, DC, N, OV, Z NEG f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z NEG Ws,Wd Wd = Ws + 1 1 1 C, DC, N, OV, Z NOP NOP No Operation 1 1 None NOPR No Operation 1 1 None POP POP f Pop f from Top-of-Stack (TOS) 1 1 None POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd+1) 1 2 None POP.S Pop Shadow Registers 1 1 All PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None PUSH.D Wns Push W(ns):W(ns+1) to Top-of-Stack (TOS) 1 2 None PUSH.S Push Shadow Registers 1 1 None TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of Words # of Cycles Status Flags Affected PIC24FJ256GB110 FAMILY DS39897C-page 308  2009 Microchip Technology Inc. PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO, Sleep RCALL RCALL Expr Relative Call 1 2 None RCALL Wn Computed Call 1 2 None REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None RESET RESET Software Device Reset 1 1 None RETFIE RETFIE Return from Interrupt 1 3 (2) None RETLW RETLW #lit10,Wn Return with Literal in Wn 1 3 (2) None RETURN RETURN Return from Subroutine 1 3 (2) None RLC RLC f f = Rotate Left through Carry f 1 1 C, N, Z RLC f,WREG WREG = Rotate Left through Carry f 1 1 C, N, Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C, N, Z RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N, Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N, Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N, Z RRC RRC f f = Rotate Right through Carry f 1 1 C, N, Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C, N, Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C, N, Z RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N, Z RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N, Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N, Z SE SE Ws,Wnd Wnd = Sign-Extended Ws 1 1 C, N, Z SETM SETM f f = FFFFh 1 1 None SETM WREG WREG = FFFFh 1 1 None SETM Ws Ws = FFFFh 1 1 None SL SL f f = Left Shift f 1 1 C, N, OV, Z SL f,WREG WREG = Left Shift f 1 1 C, N, OV, Z SL Ws,Wd Wd = Left Shift Ws 1 1 C, N, OV, Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N, Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N, Z SUB SUB f f = f – WREG 1 1 C, DC, N, OV, Z SUB f,WREG WREG = f – WREG 1 1 C, DC, N, OV, Z SUB #lit10,Wn Wn = Wn – lit10 1 1 C, DC, N, OV, Z SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C, DC, N, OV, Z SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C, DC, N, OV, Z SUBB SUBB f f = f – WREG – (C) 1 1 C, DC, N, OV, Z SUBB f,WREG WREG = f – WREG – (C) 1 1 C, DC, N, OV, Z SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C, DC, N, OV, Z SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C, DC, N, OV, Z SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C, DC, N, OV, Z SUBR SUBR f f = WREG – f 1 1 C, DC, N, OV, Z SUBR f,WREG WREG = WREG – f 1 1 C, DC, N, OV, Z SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C, DC, N, OV, Z SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C, DC, N, OV, Z SUBBR SUBBR f f = WREG – f – (C) 1 1 C, DC, N, OV, Z SUBBR f,WREG WREG = WREG – f – (C) 1 1 C, DC, N, OV, Z SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C, DC, N, OV, Z SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C, DC, N, OV, Z SWAP SWAP.b Wn Wn = Nibble Swap Wn 1 1 None SWAP Wn Wn = Byte Swap Wn 1 1 None TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of Words # of Cycles Status Flags Affected  2009 Microchip Technology Inc. DS39897C-page 309 PIC24FJ256GB110 FAMILY TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None ULNK ULNK Unlink Frame Pointer 1 1 None XOR XOR f f = f .XOR. WREG 1 1 N, Z XOR f,WREG WREG = f .XOR. WREG 1 1 N, Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N, Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N, Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N, Z ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C, Z, N TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of Words # of Cycles Status Flags Affected PIC24FJ256GB110 FAMILY DS39897C-page 310  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 311 PIC24FJ256GB110 FAMILY 29.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the PIC24FJ256GB110 family electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the PIC24FJ256GB110 family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these, or any other conditions above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +100°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V) Voltage on any digital only pin with respect to VSS .................................................................................. -0.3V to +6.0V Voltage on VDDCORE with respect to VSS ................................................................................................. -0.3V to +3.0V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin (Note 1)................................................................................................................250 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports (Note 1)....................................................................................................200 mA Note 1: Maximum allowable current is a function of device maximum power dissipation (see Table 29-1). †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIC24FJ256GB110 FAMILY DS39897C-page 312  2009 Microchip Technology Inc. 29.1 DC Characteristics FIGURE 29-1: PIC24FJ256GB110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) TABLE 29-1: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit PIC24FJ256GB110 Family: Operating Junction Temperature Range TJ -40 — +125 °C Operating Ambient Temperature Range TA -40 — +85 °C Power Dissipation: Internal Chip Power Dissipation: PINT = VDD x (IDD –  IOH) PD PINT + PI/O W I/O Pin Power Dissipation: PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W Frequency Voltage (VDDCORE)(1) 3.00V 2.00V 32 MHz 2.75V 2.50V 2.25V 2.75V 16 MHz 2.25V For frequencies between 16 MHz and 32 MHz, FMAX = (64 MHz/V) * (VDDCORE – 2V) + 16 MHz. Note 1: When the voltage regulator is disabled, VDD and VDDCORE must be maintained so that VDDCOREVDD3.6V. PIC24FJXXXGB1XX TABLE 29-2: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ Max Unit Notes Package Thermal Resistance, 14x14x1 mm TQFP JA 50.0 — °C/W (Note 1) Package Thermal Resistance, 12x12x1 mm TQFP JA 69.4 — °C/W (Note 1) Package Thermal Resistance, 10x10x1 mm TQFP JA 76.6 — °C/W (Note 1) Package Thermal Resistance, 9x9x0.9 mm QFN JA 28.0 — °C/W (Note 1) Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.  2009 Microchip Technology Inc. DS39897C-page 313 PIC24FJ256GB110 FAMILY TABLE 29-3: DC CHARACTERISTICS: TEMPERATURE AND VOLTAGE SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Param No. Symbol Characteristic Min Typ(1) Max Units Conditions Operating Voltage DC10 Supply Voltage VDD 2.2 — 3.6 V Regulator enabled VDD VDDCORE — 3.6 V Regulator disabled VDDCORE 2.0 — 2.75 V Regulator disabled DC12 VDR RAM Data Retention Voltage(2) 1.5 — — V DC16 VPOR VDD Start Voltage To Ensure Internal Power-on Reset Signal VSS — — V DC17 SVDD VDD Rise Rate to Ensure Internal Power-on Reset Signal 0.05 — — V/ms 0-3.3V in 0.1s 0-2.5V in 60 ms DC18 VBOR BOR Voltage on VDD Transition. High-to-Low — 2.05 — V Voltage regulator enabled Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: This is the limit to which VDD can be lowered without losing RAM data. PIC24FJ256GB110 FAMILY DS39897C-page 314  2009 Microchip Technology Inc. TABLE 29-4: DC CHARACTERISTICS: OPERATING CURRENT (IDD) DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Parameter No. Typical(1) Max Units Conditions Operating Current (IDD)(2) DC20 0.83 1.2 mA -40°C 2.0V(3) 1 MIPS DC20a 0.83 1.2 mA +25°C DC20b 0.83 1.2 mA +85°C DC20d 1.1 1.7 mA -40°C DC20e 1.1 1.7 mA +25°C 3.3V(4) DC20f 1.1 1.7 mA +85°C DC23 3.3 4.5 mA -40°C 2.0V(3) 4 MIPS DC23a 3.3 4.5 mA +25°C DC23b 3.3 4.5 mA +85°C DC23d 4.3 6 mA -40°C DC23e 4.3 6 mA +25°C 3.3V(4) DC23f 4.3 6 mA +85°C DC24 18.2 24 mA -40°C 2.5V(3) 16 MIPS DC24a 18.2 24 mA +25°C DC24b 18.2 24 mA +85°C DC24d 18.2 24 mA -40°C DC24e 18.2 24 mA +25°C 3.3V(4) DC24f 18.2 24 mA +85°C DC31 15.0 54 A -40°C 2.0V(3) LPRC (31 kHz) DC31a 15.0 54 A +25°C DC31b 20.0 69 A +85°C DC31d 57.0 96 A -40°C DC31e 57.0 96 A +25°C 3.3V(4) DC31f 95.0 145 A +85°C Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSCI driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD. MCLR = VDD; WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are operational. No peripheral modules are operating and all of the Peripheral Module Disable (PMD) bits are set. 3: On-chip voltage regulator disabled (ENVREG tied to VSS). 4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out Detect (BOD) are enabled.  2009 Microchip Technology Inc. DS39897C-page 315 PIC24FJ256GB110 FAMILY TABLE 29-5: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE)(2) DC40 220 310 A -40°C 2.0V(3) 1 MIPS DC40a 220 310 A +25°C DC40b 220 310 A +85°C DC40d 300 390 A -40°C DC40e 300 390 A +25°C 3.3V(4) DC40f 300 420 A +85°C DC43 0.85 1.1 mA -40°C 2.0V(3) 4 MIPS DC43a 0.85 1.1 mA +25°C DC43b 0.87 1.2 mA +85°C DC43d 1.1 1.4 mA -40°C DC43e 1.1 1.4 mA +25°C 3.3V(4) DC43f 1.1 1.4 mA +85°C DC47 4.4 5.6 mA -40°C 2.5V(3) 16 MIPS DC47a 4.4 5.6 mA +25°C DC47b 4.4 5.6 mA +85°C DC47c 4.4 5.6 mA -40°C DC47d 4.4 5.6 mA +25°C 3.3V(4) DC47e 4.4 5.6 mA +85°C DC50 1.1 1.4 mA -40°C 2.0V(3) FRC (4 MIPS) DC50a 1.1 1.4 mA +25°C DC50b 1.1 1.4 mA +85°C DC50d 1.4 1.8 mA -40°C DC50e 1.4 1.8 mA +25°C 3.3V(4) DC50f 1.4 1.8 mA +85°C DC51 4.3 13 A -40°C 2.0V(3) LPRC (31 kHz) DC51a 4.5 13 A +25°C DC51b 10 32 A +85°C DC51d 44 77 A -40°C DC51e 44 77 A +25°C 3.3V(4) DC51f 70 132 A +85°C Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: Base IIDLE current is measured with the core off, OSCI driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD. MCLR = VDD; WDT and FSCM are disabled. No peripheral modules are operating and all of the Peripheral Module Disable (PMD) bits are set. 3: On-chip voltage regulator disabled (ENVREG tied to VSS). 4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out Detect (BOD) are enabled. PIC24FJ256GB110 FAMILY DS39897C-page 316  2009 Microchip Technology Inc. TABLE 29-6: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Parameter No. Typical(1) Max Units Conditions Power-Down Current (IPD)(2) DC60 0.1 1 A -40°C 2.0V(3) Base Power-Down Current(5) DC60a 0.15 1 A +25°C DC60m 2.25 11 A +60°C DC60b 3.7 18 A +85°C DC60c 0.2 1.4 A -40°C 2.5V DC60d 0.25 1.4 A +25°C (3) DC60n 2.6 16.5 A +60°C DC60e 4.2 27 A +85°C DC60f 3.6 10 A -40°C 3.3V(4) DC60g 4.0 10 A +25°C DC60p 8.1 25.2 A +60°C DC60h 11.0 36 A +85°C DC61 1.75 3 A -40°C 2.0V(3) Watchdog Timer Current: IWDT(5) DC61a 1.75 3 A +25°C DC61m 1.75 3 A +60°C DC61b 1.75 3 A +85°C DC61c 2.4 4 A -40°C 2.5V(3) DC61d 2.4 4 A +25°C DC61n 2.4 4 A +60°C DC61e 2.4 4 A +85°C DC61f 2.8 5 A -40°C 3.3V(4) DC61g 2.8 5 A +25°C DC61p 2.8 5 A +60°C DC61b 2.8 5 A +85°C Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. WDT, etc., are all switched off, PMSLP bit is clear, and the Peripheral Module Disable (PMD) bits for all unused peripherals are set. 3: On-chip voltage regulator disabled (ENVREG tied to VSS). 4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out Detect (BOD) are enabled. 5: The  current is the additional current consumed when the module is enabled. This current should be added to the base IPD current.  2009 Microchip Technology Inc. DS39897C-page 317 PIC24FJ256GB110 FAMILY DC62 2.5 7 A -40°C 2.0V(3) RTCC + Timer1 w/32 kHz Crystal: RTCC + ITI32(5) DC62a 2.5 7 A +25°C DC62m 3.0 7 A +60°C DC62b 3.0 7 A +85°C DC62c 2.8 7 A -40°C 2.5V DC62d 3.0 7 A +25°C (3) DC62n 3.0 7 A +60°C DC62e 3.0 7 A +85°C DC62f 3.5 10 A -40°C 3.3V(4) DC62g 3.5 10 A +25°C DC62p 4.0 10 A +60°C DC62h 4.0 10 A +85°C TABLE 29-6: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED) DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Parameter No. Typical(1) Max Units Conditions Power-Down Current (IPD)(2) Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. WDT, etc., are all switched off, PMSLP bit is clear, and the Peripheral Module Disable (PMD) bits for all unused peripherals are set. 3: On-chip voltage regulator disabled (ENVREG tied to VSS). 4: On-chip voltage regulator enabled (ENVREG tied to VDD). Low-Voltage Detect (LVD) and Brown-out Detect (BOD) are enabled. 5: The  current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. PIC24FJ256GB110 FAMILY DS39897C-page 318  2009 Microchip Technology Inc. TABLE 29-7: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Param No. Sym Characteristic Min Typ(1) Max Units Conditions VIL Input Low Voltage(4) DI10 I/O Pins with ST Buffer VSS — 0.2VDD V DI11 I/O Pins with TTL Buffer VSS — 0.15 VDD V DI15 MCLR VSS — 0.2VDD V DI16 OSC1 (XT mode) VSS — 0.2VDD V DI17 OSC1 (HS mode) VSS — 0.2VDD V DI18 I/O Pins with I2C™ Buffer: VSS — 0.3VDD V DI19 I/O Pins with SMBus Buffer: VSS — 0.8 V SMBus enabled VIH Input High Voltage(4) DI20 I/O Pins with ST Buffer: with Analog Functions, Digital Only 0.8 VDD 0.8 VDD —— VDD 5.5 VV DI21 I/O Pins with TTL Buffer: with Analog Functions, Digital Only 0.25 VDD + 0.8 0.25 VDD + 0.8 —— VDD 5.5 VV DI25 MCLR 0.8 VDD — VDD V DI26 OSC1 (XT mode) 0.7 VDD — VDD V DI27 OSC1 (HS mode) 0.7 VDD — VDD V DI28 I/O Pins with I2C Buffer: with Analog Functions, Digital Only 0.7 VDD 0.7 VDD —— VDD 5.5 VV DI29 I/O Pins with SMBus Buffer: with Analog Functions, Digital Only 2.1 2.1 VDD 5.5 VV 2.5V  VPIN  VDD DI30 ICNPU CNxx Pull-up Current 50 250 400 A VDD = 3.3V, VPIN = VSS DI30A ICNPD CNxx Pull-Down Current — 80 — A VDD = 3.3V, VPIN = VDD IIL Input Leakage Current(2,3) DI50 I/O Ports — — +1 A VSS  VPIN  VDD, Pin at high-impedance DI51 Analog Input Pins — — +1 A VSS  VPIN  VDD, Pin at high-impedance DI52 USB Differential Pins (D+, D-) — — +1 A VUSB VDD DI55 MCLR — — +1 A VSS VPIN VDD DI56 OSC1 — — +1 A VSS VPIN VDD, XT and HS modes Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. 4: Refer to Table 1-4 for I/O pins buffer types.  2009 Microchip Technology Inc. DS39897C-page 319 PIC24FJ256GB110 FAMILY TABLE 29-8: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Param No. Sym Characteristic Min Typ(1) Max Units Conditions VOL Output Low Voltage DO10 I/O Ports — — 0.4 V IOL = 8.5 mA, VDD = 3.6V — — 0.4 V IOL = 6.0 mA, VDD = 2.0V DO16 OSC2/CLKO — — 0.4 V IOL = 8.5 mA, VDD = 3.6V — — 0.4 V IOL = 6.0 mA, VDD = 2.0V VOH Output High Voltage DO20 I/O Ports 3.0 — — V IOH = -3.0 mA, VDD = 3.6V 2.4 — — V IOH = -6.0 mA, VDD = 3.6V 1.65 — — V IOH = -1.0 mA, VDD = 2.0V 1.4 — — V IOH = -3.0 mA, VDD = 2.0V DO26 OSC2/CLKO 2.4 — — V IOH = -6.0 mA, VDD = 3.6V 1.4 — — V IOH = -3.0 mA, VDD = 2.0V Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. TABLE 29-9: DC CHARACTERISTICS: PROGRAM MEMORY DC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial -40°C  TA  +125°C for Extended Param No. Sym Characteristic Min Typ(1) Max Units Conditions D130 EP Cell Endurance 10000 — — E/W -40C to +85C D131 VPR VDD for Read VMIN — 3.6 V VMIN = Minimum operating voltage VPEW Supply Voltage for Self-Timed Writes D132A VDDCORE 2.25 — 3.6 V D132B VDD 2.35 — 3.6 V D133A TIW Self-Timed Write Cycle Time — 3 — ms D133B TIE Self-Timed Page Erase Time 40 — — ms D134 TRETD Characteristic Retention 20 — — Year Provided no other specifications are violated D135 IDDP Supply Current during Programming — 7 — mA Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. PIC24FJ256GB110 FAMILY DS39897C-page 320  2009 Microchip Technology Inc. TABLE 29-10: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Operating Conditions: -40°C < TA < +125°C (unless otherwise stated) Param No. Symbol Characteristics Min Typ Max Units Comments VRGOUT Regulator Output Voltage — 2.5 — V VBG Internal Band Gap Reference — 1.2 — V CEFC External Filter Capacitor Value 4.7 10 — F Series resistance < 3 Ohm recommended; < 5 Ohm required. TVREG Regulator Start-up Time — 10 — s PMSLP = 1, or any POR or BOR — 190 — s Wake for sleep when PMSLP = 0 TBG Band Gap Reference Start-up Time — — 1 ms  2009 Microchip Technology Inc. DS39897C-page 321 PIC24FJ256GB110 FAMILY 29.2 AC Characteristics and Timing Parameters The information contained in this section defines the PIC24FJ256GB110 family AC characteristics and timing parameters. TABLE 29-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC FIGURE 29-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS TABLE 29-12: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Operating voltage VDD range as described in Section 29.1 “DC Characteristics”. Param No. Symbol Characteristic Min Typ(1) Max Units Conditions DO50 COSC2 OSCO/CLKO pin — — 15 pF In XT and HS modes when external clock is used to drive OSCI. DO56 CIO All I/O pins and OSCO — — 50 pF EC mode. DO58 CB SCLx, SDAx — — 400 pF In I2C™ mode. Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. VDD/2 CL RL Pin Pin VSS VSS CL RL = 464 CL = 50 pF for all pins except OSCO 15 pF for OSCO output Load Condition 1 – for all pins except OSCO Load Condition 2 – for OSCO PIC24FJ256GB110 FAMILY DS39897C-page 322  2009 Microchip Technology Inc. FIGURE 29-3: EXTERNAL CLOCK TIMING OSCI CLKO Q4 Q1 Q2 Q3 Q4 Q1 OS20 OS25 OS30 OS30 OS40 OS41 OS31 OS31 Q1 Q2 Q3 Q4 Q2 Q3 TABLE 29-13: EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 2.50 to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Param No. Sym Characteristic Min Typ(1) Max Units Conditions OS10 FOSC External CLKI Frequency (External clocks allowed only in EC mode) DC 4 —— 32 48 MHz MHz EC ECPLL Oscillator Frequency 3 4 10 12 31 ————— 10 8 32 32 33 MHz MHz MHz MHz kHz XT XTPLL HS HSPLL SOSC OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10 for FOSC value OS25 TCY Instruction Cycle Time(2) 62.5 — DC ns OS30 TosL, TosH External Clock in (OSCI) High or Low Time 0.45 x TOSC — — ns EC OS31 TosR, TosF External Clock in (OSCI) Rise or Fall Time — — 20 ns EC OS40 TckR CLKO Rise Time(3) — 6 10 ns OS41 TckF CLKO Fall Time(3) — 6 10 ns Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 2: Instruction cycle period (TCY) equals two times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “Min.” values with an external clock applied to the OSCI/CLKI pin. When an external clock input is used, the “Max.” cycle time limit is “DC” (no clock) for all devices. 3: Measurements are taken in EC mode. The CLKO signal is measured on the OSCO pin. CLKO is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).  2009 Microchip Technology Inc. DS39897C-page 323 PIC24FJ256GB110 FAMILY TABLE 29-14: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.0V TO 3.6V) AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Param No. Sym Characteristic(1) Min Typ(2) Max Units Conditions OS50 FPLLI PLL Input Frequency Range(2) 4 — 32 MHz ECPLL, HSPLL, XTPLL modes OS51 FSYS PLL Output Frequency Range 95.76 — 96.24 MHz OS52 TLOCK PLL Start-up Time (Lock Time) — — 200 s OS53 DCLK CLKO Stability (Jitter) -0.25 — 0.25 % Note 1: These parameters are characterized but not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. TABLE 29-15: INTERNAL RC OSCILLATOR SPECIFICATIONS AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA +85°C for Industrial Param No. Sym Characteristic Min Typ Max Units Conditions TFRC FRC Start-up Time — 15 — s TLPRC LPRC Start-up Time — 40 — s TABLE 29-16: INTERNAL RC OSCILLATOR ACCURACY AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA +85°C for Industrial Param No. Characteristic Min Typ Max Units Conditions F20 FRC Accuracy@ 8 MHz(1) -2 — 2 % +25°C, 3.0V  VDD 3.6V -5 — 5 % -40°C  TA +85°C, 3.0V  VDD 3.6V F21 LPRC Accuracy @ 31 kHz(2) -20 — 20 % -40°C  TA +85°C, 3.0V  VDD 3.6V Note 1: Frequency calibrated at 25°C and 3.3V. OSCTUN bits can be used to compensate for temperature drift. 2: Change of LPRC frequency as VDD changes. PIC24FJ256GB110 FAMILY DS39897C-page 324  2009 Microchip Technology Inc. FIGURE 29-4: CLKO AND I/O TIMING CHARACTERISTICS Note: Refer to Figure 29-2 for load conditions. I/O Pin (Input) I/O Pin (Output) DI35 Old Value New Value DI40 DO31 DO32 TABLE 29-17: CLKO AND I/O TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C for Industrial Param No. Sym Characteristic Min Typ(1) Max Units Conditions DO31 TIOR Port Output Rise Time — 10 25 ns DO32 TIOF Port Output Fall Time — 10 25 ns DI35 TINP INTx pin High or Low Time (output) 20 — — ns DI40 TRBP CNx High or Low Time (input) 2 — — TCY Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.  2009 Microchip Technology Inc. DS39897C-page 325 PIC24FJ256GB110 FAMILY TABLE 29-18: ADC MODULE SPECIFICATIONS AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C Param No. Symbol Characteristic Min. Typ Max. Units Conditions Device Supply AD01 AVDD Module VDD Supply Greater of VDD – 0.3 or 2.0 — Lesser of VDD + 0.3 or 3.6 V AD02 AVSS Module VSS Supply VSS – 0.3 — VSS + 0.3 V Reference Inputs AD05 VREFH Reference Voltage High AVSS + 1.7 — AVDD V AD06 VREFL Reference Voltage Low AVSS — AVDD – 1.7 V AD07 VREF Absolute Reference Voltage AVSS – 0.3 — AVDD + 0.3 V Analog Input AD10 VINH-VINL Full-Scale Input Span VREFL — VREFH V (Note 2) AD11 VIN Absolute Input Voltage AVSS – 0.3 — AVDD + 0.3 V AD12 VINL Absolute VINL Input Voltage AVSS – 0.3 AVDD/2 V AD13 — Leakage Current — ±0.00 1 ±0.610 A VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V, Source Impedance = 2.5 k AD17 RIN Recommended Impedance of Analog Voltage Source — — 2.5K  10-bit ADC Accuracy AD20b Nr Resolution — 10 — bits AD21b INL Integral Nonlinearity — ±1 <±2 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD22b DNL Differential Nonlinearity — ±0.5 <±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD23b GERR Gain Error — ±1 ±3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD24b EOFF Offset Error — ±1 ±2 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD25b — Monotonicity(1) — — — — Guaranteed Note 1: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes. 2: Measurements taken with external VREF+ and VREF- used as the ADC voltage reference. PIC24FJ256GB110 FAMILY DS39897C-page 326  2009 Microchip Technology Inc. TABLE 29-19: ADC CONVERSION TIMING REQUIREMENTS(1) AC CHARACTERISTICS Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40°C  TA  +85°C Param No. Symbol Characteristic Min. Typ Max. Units Conditions Clock Parameters AD50 TAD ADC Clock Period 75 — — ns TCY = 75 ns, AD1CON3 in default state AD51 tRC ADC Internal RC Oscillator Period — 250 — ns Conversion Rate AD55 tCONV Conversion Time — 12 — TAD AD56 FCNV Throughput Rate — — 500 ksps AVDD > 2.7V AD57 tSAMP Sample Time — 1 — TAD Clock Parameters AD61 tPSS Sample Start Delay from setting Sample bit (SAMP) 2 — 3 TAD Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures.  2009 Microchip Technology Inc. DS39897C-page 327 PIC24FJ256GB110 FAMILY 30.0 PACKAGING INFORMATION 30.1 Package Marking Information 64-Lead TQFP (10x10x1 mm) XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Example PIC24FJ256 GB106-I/ 0920017 80-Lead TQFP (12x12x1 mm) XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example PIC24FJ256GB 108-I/PT 0920017 PT e3 e3 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 XXXXXXXXXXX 64-Lead QFN (9x9x0.9 mm) XXXXXXXXXXX XXXXXXXXXXX YYWWNNN PIC24FJ256G Example B106-I/M4 0910017 e3 PIC24FJ256GB110 FAMILY DS39897C-page 328  2009 Microchip Technology Inc. 100-Lead TQFP (12x12x1 mm) XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example PIC24FJ256GB 110-I/PT 0920017 e3 100-Lead TQFP (14x14x1 mm) XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example PIC24FJ256GB 110-I/PF 0920017 e3 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3  2009 Microchip Technology Inc. DS39897C-page 329 PIC24FJ256GB110 FAMILY 30.2 Package Details The following sections give the technical details of the packages.              !" #$  % & '  (   !" #$% &"'  ()"&'"!&) &#*&& &#    + '%! &!  & ,!-'    '!! #.#&"#'#% ! &"!!#% ! &"!!! &$#/'' !#  '!  #&   .0/ 1+2 1 !'!& $ & "!**&"&& ! .32 %'!("!" *&"&& (%%' & " !! ' ( 3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4  6&! 77.. '!7'&! 8 89 : 8"')%7 #! 8 ; 7 #& /1+ 9  < &  = =  ## 4 4!!  /  / & #%%  / = / 3&7 & 7 / ; / 3& & 7 .3 3&   > /> > 9  ?#& . 1+ 9  7 &  1+ ## 4 ?#& . 1+ ## 4 7 &  1+ 7 #4!!   =  7 #?#& )    # %&   > > > # %& 1&&'  > > > D D1 E E1 e b N NOTE 1 1 2 3 NOTE 2 c L A1 L1 A2 A φ β α     * + @/1 PIC24FJ256GB110 FAMILY DS39897C-page 330  2009 Microchip Technology Inc.              !" #$  % & ' ( 3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4   2009 Microchip Technology Inc. DS39897C-page 331 PIC24FJ256GB110 FAMILY Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC24FJ256GB110 FAMILY DS39897C-page 332  2009 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009 Microchip Technology Inc. DS39897C-page 333 PIC24FJ256GB110 FAMILY Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC24FJ256GB110 FAMILY DS39897C-page 334  2009 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009 Microchip Technology Inc. DS39897C-page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e b N NOTE 1 123 NOTE 2 A A2 L1 A1 L c α β φ     * + 1 PIC24FJ256GB110 FAMILY DS39897C-page 336  2009 Microchip Technology Inc.           ##   !" #$  % & ' ( 3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4   2009 Microchip Technology Inc. DS39897C-page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e b N NOTE 1 123 NOTE 2 c L A1 L1 A A2 α β φ     * + 1 PIC24FJ256GB110 FAMILY DS39897C-page 338  2009 Microchip Technology Inc.           ##   !" #$  % & ' ( 3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4   2009 Microchip Technology Inc. DS39897C-page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e b E1 E N NOTE 1 1 23 NOTE 2 c L A1 L1 A2 A φ β α     * + 1 PIC24FJ256GB110 FAMILY DS39897C-page 340  2009 Microchip Technology Inc.              !" #$  % & ' ( 3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4   2009 Microchip Technology Inc. DS39897C-page 341 PIC24FJ256GB110 FAMILY APPENDIX A: REVISION HISTORY Revision A (October 2007) Original data sheet for the PIC24FJ256GB110 family of devices. Revision B (March 2008) Changes to Section 29.0 “Electrical Characteristics” and minor edits to text throughout document. Revision C (December 2009) Updates all Pin Diagrams to reflect the correct order of priority for multiplexed peripherals. Adds packaging information for the new 64-pin QFN package to Section 30.0 “Packaging Information” and the Product Information System. Updates Section 5.0 “Flash Program Memory” with revised code examples in assembler, and new code examples in C. Updates Section 6.2 “Device Reset Times” with revised information, particularly Table 6-3. Adds the INTTREG register to Section 4.0 “Memory Organization” and Section 7.0 “Interrupt Controller”. Makes several additions and changes to Section 10.0 “I/O Ports”, including: • revision of Section 10.4.2.1 “Peripheral Pin Select Function Priority” • revisions to Table 10-3, “Selectable Output Sources” Makes several changes and additions to Section 18.0 “Universal Serial Bus with On-The-Go Support (USB OTG)”, including: • changes the name of the bit U1CON from RESET to USBRST • replaces the former Section 18.3 with Section 18.1 “Hardware Configuration”, including an expanded discussion of how to interface the microcontroller to application in different USB modes Updates Section 21.0 “Programmable Cyclic Redundancy Check (CRC) Generator” with new illustrations, and a revised Section 21.1 “User Interface”. Updates Section 22.0 “10-Bit High-Speed A/D Converter” by changing all references to AD1CHS0, to AD1CHS (as well as other locations in the document). Also revises bit field descriptions in registers, AD1CON3 (bits 7:0) and AD1CHS (bits 12:8). Makes minor text edits to bit descriptions in Section 23.0 “Triple Comparator Module” (Register 23-1) and Section 25.0 “Charge Time Measurement Unit (CTMU)” (Register 25-1). Updates Section 26.0 “Special Features” with revised text on the operation of the regulator during POR and Standby mode. Updates Section 26.5 “JTAG Interface” to remove references to programming via the interface. Makes multiple additions and changes to Section 29.0 “Electrical Characteristics”, including: • Addition of IPD specifications for operation at 60°C • New DC characteristics of VBOR, VBG, TBG and ICNPD • Addition of new VPEW specification for VDDCORE • New AC characteristics for internal oscillator start-up time (TLPRC) • Combination of all Internal RC accuracy information into a single table Makes other minor typographic corrections throughout the text. PIC24FJ256GB110 FAMILY DS39897C-page 342  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 343 PIC24FJ256GB110 FAMILY INDEX A A/D Converter Analog Input Model ................................................... 275 Transfer Function...................................................... 275 AC Characteristics ADC Conversion Timing ........................................... 326 CLKO and I/O Timing................................................ 324 Alternate Interrupt Vector Table (AIVT) .............................. 77 Assembler MPASM Assembler................................................... 300 B Block Diagrams 10-Bit High-Speed A/D Converter............................. 268 16-Bit Asynchronous Timer3 and Timer5 ................. 165 16-Bit Synchronous Timer2 and Timer4 ................... 165 16-Bit Timer1 Module................................................ 161 32-Bit Timer2/3 and Timer4/5 ................................... 164 Accessing Program Space Using Table Operations .......................................................... 61 Addressable PMP Example ...................................... 248 Addressing for Table Registers................................... 63 BDT Mapping for Endpoint Buffering Modes ............ 212 CALL Stack Frame...................................................... 59 Comparator Voltage Reference ................................ 281 CPU Programmer’s Model .......................................... 35 CRC Module ............................................................. 263 CRC Shift Engine...................................................... 264 CTMU Connections and Internal Configuration for Capacitance Measurement.......................... 283 CTMU Typical Connections and Internal Configuration for Pulse Delay Generation ........ 284 CTMU Typical Connections and Internal Configuration for Time Measurement ............... 284 Data Access From Program Space Address Generation .......................................................... 60 I2C Module ................................................................ 192 Individual Comparator Configurations....................... 278 Input Capture ............................................................ 169 LCD Control .............................................................. 250 Legacy PMP Example............................................... 248 On-Chip Regulator Connections ............................... 293 Output Compare (16-Bit Mode)................................. 174 Output Compare (Double-Buffered 16-Bit PWM Mode) ........................................... 176 PCI24FJ256GB110 Family (General) ......................... 16 PIC24F CPU Core ...................................................... 34 PMP 8-Bit Multiplexed Address and Data Application................................................ 250 PMP EEPROM (8-Bit Data) ...................................... 250 PMP Master Mode, Demultiplexed Addressing ........ 248 PMP Master Mode, Fully Multiplexed Addressing........................................................ 249 PMP Master Mode, Partially Multiplexed Addressing........................................................ 249 PMP Module Overview ............................................. 241 PMP Multiplexed Addressing .................................... 249 PMP Parallel EEPROM (16-Bit Data) ....................... 250 PMP Partially Multiplexed Addressing ...................... 249 PSV Operation............................................................ 62 Reset System.............................................................. 71 RTCC........................................................................ 251 Shared I/O Port Structure ......................................... 133 SPI Master, Frame Master Connection .................... 189 SPI Master, Frame Slave Connection ...................... 189 SPI Master/Slave Connection (Enhanced Buffer Modes)................................. 188 SPI Master/Slave Connection (Standard Mode)....... 188 SPI Slave, Frame Master Connection ...................... 189 SPI Slave, Frame Slave Connection ........................ 189 SPIx Module (Enhanced Mode)................................ 183 SPIx Module (Standard Mode) ................................. 182 System Clock Diagram............................................. 121 Triple Comparator Module........................................ 277 UART (Simplified)..................................................... 199 USB OTG Device Mode Power Modes.............................. 209 USB OTG Interrupt Funnel ....................................... 216 USB OTG Module..................................................... 208 USB PLL................................................................... 128 Watchdog Timer (WDT)............................................ 295 C C Compilers MPLAB C18.............................................................. 300 Charge Time Measurement Unit. See CTMU. Code Examples Basic Clock Switching Example ............................... 127 Configuring UART1 Input and Output Functions (PPS) ............................................... 140 Erasing a Program Memory Block, ‘C’........................ 67 Erasing a Program Memory Block, Assembly ............ 66 Initiating a Programming Sequence, ‘C’ ..................... 68 Initiating a Programming Sequence, Assembly.......... 68 Loading the Write Buffers, ‘C’..................................... 68 Loading the Write Buffers, Assembly ......................... 67 Port Write/Read........................................................ 134 PWRSAV Instruction Syntax .................................... 131 Single-Word Flash Programming, ‘C’ ......................... 69 Single-Word Flash Programming, Assembly.............. 69 Code Protection................................................................ 295 Code Segment Protection ........................................ 295 Configuration Options....................................... 296 Configuration Protection........................................... 296 Configuration Bits ............................................................. 287 Core Features..................................................................... 11 CPU Arithmetic Logic Unit (ALU) ........................................ 37 Control Registers........................................................ 36 Core Registers............................................................ 35 Programmer’s Model .................................................. 33 CRC Setup Example ......................................................... 263 User Interface ........................................................... 264 CTMU Measuring Capacitance............................................ 283 Measuring Time........................................................ 284 Pulse Delay and Generation..................................... 284 Customer Change Notification Service............................. 348 Customer Notification Service .......................................... 348 Customer Support............................................................. 348 PIC24FJ256GB110 FAMILY DS39897C-page 344  2009 Microchip Technology Inc. D Data Memory Address Space............................................................ 41 Memory Map ............................................................... 41 Near Data Space ........................................................ 42 SFR Space.................................................................. 42 Software Stack............................................................ 59 Space Organization .................................................... 42 DC Characteristics I/O Pin Input Specifications....................................... 318 I/O Pin Output Specifications .................................... 319 Idle Current ............................................................... 315 Operating Current ..................................................... 314 Power-Down Current ................................................ 316 Program Memory Specifications ............................... 319 Development Support ....................................................... 299 Device Features (Summary) 100-Pin........................................................................15 64-Pin..........................................................................13 80-Pin..........................................................................14 Doze Mode........................................................................132 E Electrical Characteristics A/D Specifications..................................................... 325 Absolute Maximum Ratings ...................................... 311 External Clock........................................................... 322 Internal Voltage Regulator Specifications ................. 320 Load Conditions and Requirements for Specifications.................................................... 321 PLL Clock Specifications .......................................... 323 Temperature and Voltage Specifications .................. 313 Thermal Conditions...................................................312 V/F Graph ................................................................. 312 ENVREG Pin..................................................................... 293 Equations A/D Conversion Clock Period ................................... 274 Baud Rate Reload Calculation.................................. 193 Calculating the PWM Period ..................................... 176 Calculation for Maximum PWM Resolution............... 177 Estimating USB Transceiver Current Consumption..................................................... 211 Relationship Between Device and SPI Clock Speed...................................................... 190 RTCC Calibration...................................................... 260 UART Baud Rate with BRGH = 0 ............................. 200 UART Baud Rate with BRGH = 1 ............................. 200 Errata .................................................................................... 9 F Flash Configuration Words.................................. 40, 287–291 Flash Program Memory....................................................... 63 and Table Instructions.................................................63 Enhanced ICSP Operation.......................................... 64 JTAG Operation .......................................................... 64 Programming Algorithm .............................................. 66 RTSP Operation.......................................................... 64 Single-Word Programming.......................................... 69 I I/O Ports Analog Port Pins Configuration................................. 134 Input Change Notification.......................................... 135 Open-Drain Configuration ......................................... 134 Parallel (PIO) ............................................................ 133 Peripheral Pin Select ................................................ 135 Pull-ups and Pull-downs ........................................... 135 I2C Clock Rates .............................................................. 193 Reserved Addresses ................................................ 193 Setting Baud Rate as Bus Master............................. 193 Slave Address Masking ............................................ 193 Input Capture 32-Bit Mode .............................................................. 170 Capture Operations .................................................. 170 Synchronous and Trigger Modes.............................. 169 Input Capture with Dedicated Timers ............................... 169 Instruction Set Overview................................................................... 305 Summary .................................................................. 303 Inter-Integrated Circuit. See I2C. ...................................... 191 Internet Address ............................................................... 348 Interrupt Vector Table (IVT) ................................................ 77 Interrupts and Reset Sequence .................................................. 77 Control and Status Registers...................................... 80 Implemented Vectors.................................................. 79 Setup and Service Procedures................................. 119 Trap Vectors ............................................................... 78 Vector Table ............................................................... 78 IrDA Support ..................................................................... 201 J JTAG Interface.................................................................. 297 M Microchip Internet Web Site.............................................. 348 MPLAB ASM30 Assembler, Linker, Librarian ................... 300 MPLAB Integrated Development Environment Software ................................................................... 299 MPLAB PM3 Device Programmer .................................... 302 MPLAB REAL ICE In-Circuit Emulator System ................ 301 MPLINK Object Linker/MPLIB Object Librarian ................ 300 N Near Data Space ................................................................ 42 O Oscillator Configuration Clock Selection......................................................... 122 Clock Switching ........................................................ 126 Sequence ......................................................... 127 CPU Clocking Scheme ............................................. 122 Initial Configuration on POR..................................... 122 USB Operation ......................................................... 128 Special Considerations..................................... 129 Output Compare 32-Bit Mode .............................................................. 173 Synchronous and Trigger Modes.............................. 173 Output Compare with Dedicated Timers........................... 173 P Packaging......................................................................... 327 Details....................................................................... 329 Marking..................................................................... 327 Parallel Master Port. See PMP. ........................................ 241 Peripheral Enable Bits ...................................................... 132 Peripheral Module Disable Bits......................................... 132  2009 Microchip Technology Inc. DS39897C-page 345 PIC24FJ256GB110 FAMILY Peripheral Pin Select (PPS).............................................. 135 Available Peripherals and Pins ................................. 136 Configuration Control ................................................ 139 Considerations for Use ............................................. 140 Input Mapping ........................................................... 136 Mapping Exceptions.................................................. 139 Output Mapping ........................................................ 136 Peripheral Priority ..................................................... 136 Registers........................................................... 141–159 Pinout Descriptions ....................................................... 17–25 PMSLP Bit and Wake-up Time.................................................... 294 POR and On-Chip Voltage Regulator................................ 294 Power-Saving Features .................................................... 131 Clock Frequency and Clock Switching...................... 131 Instruction-Based Modes .......................................... 131 Idle .................................................................... 132 Sleep................................................................. 131 Power-up Requirements ................................................... 294 Product Identification System ........................................... 350 Program Memory Access Using Table Instructions................................. 61 Address Construction.................................................. 59 Address Space............................................................ 39 Flash Configuration Words ......................................... 40 Memory Maps ............................................................. 39 Organization................................................................ 40 Program Space Visibility ............................................. 62 Program Space Visibility (PSV) .......................................... 62 Pulse-Width Modulation (PWM) Mode.............................. 175 Pulse-Width Modulation. See PWM. PWM Duty Cycle and Period .............................................. 176 R Reader Response ............................................................. 349 Reference Clock Output.................................................... 129 Register Maps A/D Converter ............................................................. 53 Comparators ............................................................... 56 CPU Core.................................................................... 43 CRC ............................................................................ 56 CTMU.......................................................................... 53 I2C............................................................................... 49 ICN.............................................................................. 44 Input Capture .............................................................. 47 Interrupt Controller ...................................................... 45 NVM............................................................................ 58 Output Compare ......................................................... 48 Pad Configuration ....................................................... 52 Parallel Master/Slave Port .......................................... 55 Peripheral Pin Select .................................................. 57 PMD............................................................................ 58 PORTA........................................................................ 51 PORTB........................................................................ 51 PORTC ....................................................................... 51 PORTD ....................................................................... 51 PORTE........................................................................ 52 PORTF........................................................................ 52 PORTG ....................................................................... 52 RTCC.......................................................................... 56 SPI .............................................................................. 50 System........................................................................ 58 Timers ......................................................................... 46 UART .......................................................................... 50 USB OTG.................................................................... 54 Registers AD1CHS (A/D Input Select)...................................... 272 AD1CON1 (A/D Control 1)........................................ 269 AD1CON2 (A/D Control 2)........................................ 270 AD1CON3 (A/D Control 3)........................................ 271 AD1CSSL (A/D Input Scan Select, Low) .................. 274 AD1PCFGH (A/D Port Configuration, High) ............. 273 AD1PCFGL (A/D Port Configuration, Low)............... 273 ALCFGRPT (Alarm Configuration) ........................... 255 ALMINSEC (Alarm Minutes and Seconds Value)..... 259 ALMTHDY (Alarm Month and Day Value) ................ 258 ALWDHR (Alarm Weekday and Hours Value) ......... 259 BDnSTAT Prototype (Buffer Descriptor n Status, CPU Mode)........................................... 215 BDnSTAT Prototype (Buffer Descriptor n Status, USB Mode)........................................... 214 CLKDIV (Clock Divider) ............................................ 125 CMSTAT (Comparator Status) ................................. 280 CMxCON (Comparator x Control) ............................ 279 CORCON (CPU Control) ............................................ 37 CORCON (CPU Core Control) ................................... 81 CRCCON (CRC Control) .......................................... 265 CRCXOR (CRC XOR Polynomial) ........................... 266 CTMUCON (CTMU Control)..................................... 285 CTMUICON (CTMU Current Control)....................... 286 CVRCON (Comparator Voltage Reference Control) ........................................... 282 CW1 (Flash Configuration Word 1) .......................... 288 CW2 (Flash Configuration Word 2) .......................... 290 CW3 (Flash Configuration Word 3) .......................... 291 DEVID (Device ID).................................................... 292 DEVREV (Device Revision)...................................... 292 I2CxCON (I2Cx Control)........................................... 194 I2CxMSK (I2Cx Slave Mode Address Mask)............ 198 I2CxSTAT (I2Cx Status) ........................................... 196 ICxCON1 (Input Capture x Control 1)....................... 171 ICxCON2 (Input Capture x Control 2)....................... 172 IEC0 (Interrupt Enable Control 0) ............................... 90 IEC1 (Interrupt Enable Control 1) ............................... 91 IEC2 (Interrupt Enable Control 2) ............................... 93 IEC3 (Interrupt Enable Control 3) ............................... 94 IEC4 (Interrupt Enable Control 4) ............................... 95 IEC5 (Interrupt Enable Control 5) ............................... 96 IFS0 (Interrupt Flag Status 0) ..................................... 84 IFS1 (Interrupt Flag Status 1) ..................................... 85 IFS2 (Interrupt Flag Status 2) ..................................... 86 IFS3 (Interrupt Flag Status 3) ..................................... 87 IFS4 (Interrupt Flag Status 4) ..................................... 88 IFS5 (Interrupt Flag Status 5) ..................................... 89 INTCON1 (Interrupt Control 1) ................................... 82 INTCON2 (Interrupt Control 2) ................................... 83 INTTREG (Interrupt Control and Status) .................. 118 IPC0 (Interrupt Priority Control 0) ............................... 97 IPC1 (Interrupt Priority Control 1) ............................... 98 IPC10 (Interrupt Priority Control 10) ......................... 107 IPC11 (Interrupt Priority Control 11) ......................... 108 IPC12 (Interrupt Priority Control 12) ......................... 109 IPC13 (Interrupt Priority Control 13) ......................... 110 IPC15 (Interrupt Priority Control 15) ......................... 111 IPC16 (Interrupt Priority Control 16) ......................... 112 IPC18 (Interrupt Priority Control 18) ......................... 113 IPC19 (Interrupt Priority Control 19) ......................... 113 IPC2 (Interrupt Priority Control 2) ............................... 99 IPC20 (Interrupt Priority Control 20) ......................... 114 IPC21 (Interrupt Priority Control 21) ......................... 115 IPC22 (Interrupt Priority Control 22) ......................... 116 IPC23 (Interrupt Priority Control 23) ......................... 117 PIC24FJ256GB110 FAMILY DS39897C-page 346  2009 Microchip Technology Inc. IPC3 (Interrupt Priority Control 3) ............................. 100 IPC4 (Interrupt Priority Control 4) ............................. 101 IPC5 (Interrupt Priority Control 5) ............................. 102 IPC6 (Interrupt Priority Control 6) ............................. 103 IPC7 (Interrupt Priority Control 7) ............................. 104 IPC8 (Interrupt Priority Control 8) ............................. 105 IPC9 (Interrupt Priority Control 9) ............................. 106 MINSEC (RTCC Minutes and Seconds Value) .........257 MTHDY (RTCC Month and Day Value) .................... 256 NVMCON (Flash Memory Control) ............................. 65 OCxCON1 (Output Compare x Control 1) ................ 178 OCxCON2 (Output Compare x Control 2) ................ 179 OSCCON (Oscillator Control) ................................... 123 OSCTUN (FRC Oscillator Tune)............................... 126 PADCFG1 (Pad Configuration Control) .................... 247 PADCFG1 (Pad Configuration)................................. 254 PMADDR (PMP Address) ......................................... 245 PMAEN (PMP Enable).............................................. 245 PMCON (PMP Control) ............................................. 242 PMMODE (Parallel Port Mode)................................. 244 PMSTAT (PMP Status) ............................................. 246 RCFGCAL (RTCC Calibration and Configuration) ............................................ 253 RCON (Reset Control) ................................................ 72 REFOCON (Reference Oscillator Control)................ 130 RPINR0 (PPS Input 0) .............................................. 141 RPINR1 (PPS Input 1) .............................................. 141 RPINR10 (PPS Input 10) .......................................... 145 RPINR11 (PPS Input 11) .......................................... 145 RPINR15 (PPS Input 15) .......................................... 146 RPINR17 (PPS Input 17) .......................................... 146 RPINR18 (PPS Input 18) .......................................... 147 RPINR19 (PPS Input 19) .......................................... 147 RPINR2 (PPS Input 2) .............................................. 142 RPINR20 (PPS Input 20) .......................................... 148 RPINR21 (PPS Input 21) .......................................... 148 RPINR22 (PPS Input 22) .......................................... 149 RPINR23 (PPS Input 23) .......................................... 149 RPINR27 (PPS Input 27) .......................................... 150 RPINR28 (PPS Input 28) .......................................... 150 RPINR29 (PPS Input 29) .......................................... 151 RPINR3 (PPS Input 3) ...................................... 142, 143 RPINR7 (PPS Input 7) .............................................. 143 RPINR8 (PPS Input 8) .............................................. 144 RPINR9 (PPS Input 9) .............................................. 144 RPOR0 (PPS Output 0) ............................................ 151 RPOR1 (PPS Output 1) ............................................ 152 RPOR10 (PPS Output 10) ........................................ 156 RPOR11 (PPS Output 11) ........................................ 157 RPOR12 (PPS Output 12) ........................................ 157 RPOR13 (PPS Output 13) ........................................ 158 RPOR14 (PPS Output 14) ........................................ 158 RPOR15 (PPS Output 15) ........................................ 159 RPOR2 (PPS Output 2) ............................................ 152 RPOR3 (PPS Output 3) ............................................ 153 RPOR5 (PPS Output 5) ............................................ 154 RPOR6 (PPS Output 6) ............................................ 154 RPOR7 (PPS Output 7) ............................................ 155 RPOR8 (PPS Output 8) ............................................ 155 RPOR9 (PPS Output 9) ............................................ 156 SPIxCON1 (SPIx Control 1)...................................... 186 SPIxCON2 (SPIx Control 2)...................................... 187 SPIxSTAT (SPIx Status) ........................................... 184 SR (ALU STATUS) ............................................... 36, 81 T1CON (Timer1 Control)........................................... 162 TxCON (Timer2 and Timer4 Control) ....................... 166 TyCON (Timer3 and Timer5 Control) ....................... 167 U1ADDR (USB Address) .......................................... 228 U1CNFG1 (USB Configuration 1)............................. 229 U1CNFG2 (USB Configuration 2)............................. 230 U1CON (USB Control, Device Mode)....................... 226 U1CON (USB Control, Host Mode) .......................... 227 U1EIE (USB Error Interrupt Enable) ......................... 237 U1EIR (USB Error Interrupt Status).......................... 236 U1EPn (USB Endpoint n Control)............................. 238 U1IE (USB Interrupt Enable) .................................... 235 U1IR (USB Interrupt Status, Device Mode) .............. 233 U1IR (USB Interrupt Status, Host Mode).................. 234 U1OTGCON (USB OTG Control) ............................. 223 U1OTGIE (USB OTG Interrupt Enable).................... 232 U1OTGIR (USB OTG Interrupt Status)..................... 231 U1OTGSTAT (USB OTG Status) ............................. 222 U1PWMCON USB (VBUS PWM Generator Control)............................................ 239 U1PWRC (USB Power Control)................................ 224 U1SOF (USB OTG Start-Of-Token Threshold) ........ 229 U1STAT (USB Status) .............................................. 225 U1TOK (USB Token) ................................................ 228 UxMODE (UARTx Mode).......................................... 202 UxSTA (UARTx Status and Control)......................... 204 WKDYHR (RTCC Weekday and Hours Value)......... 257 YEAR (RTCC Year Value)........................................ 256 Resets BOR (Brown-out Reset).............................................. 71 Clock Source Selection............................................... 73 CM (Configuration Mismatch Reset)........................... 71 Delay Times................................................................ 74 Device Times.............................................................. 73 IOPUWR (Illegal Opcode Reset) ................................ 71 MCLR (Pin Reset)....................................................... 71 POR (Power-on Reset)............................................... 71 RCON Flags Operation............................................... 73 SFR States ................................................................. 75 SWR (RESET Instruction) .......................................... 71 TRAPR (Trap Conflict Reset) ..................................... 71 UWR (Uninitialized W Register Reset) ....................... 71 WDT (Watchdog Timer Reset) ................................... 71 Revision History................................................................ 341 RTCC Alarm Configuration.................................................. 260 Calibration ................................................................ 260 Register Mapping...................................................... 252 S Selective Peripheral Power Control .................................. 132 Serial Peripheral Interface. See SPI. SFR Space ......................................................................... 42 Software Simulator (MPLAB SIM) .................................... 301 Software Stack.................................................................... 59 Special Features................................................................. 12 SPI T Timer1............................................................................... 161 Timer2/3 and Timer4/5 ..................................................... 163 Timing Diagrams External Clock........................................................... 322  2009 Microchip Technology Inc. DS39897C-page 347 PIC24FJ256GB110 FAMILY U UART ................................................................................ 199 Baud Rate Generator (BRG)..................................... 200 Operation of UxCTS and UxRTS Pins ...................... 201 Receiving .................................................................. 201 Transmitting 8-Bit Data Mode................................................ 201 9-Bit Data Mode................................................ 201 Break and Sync Sequence ............................... 201 Universal Asynchronous Receiver Transmitter. See UART. Universal Serial Bus Buffer Descriptors Assignment in Different Buffering Modes ......... 213 Interrupts and USB Transactions...................................... 217 Universal Serial Bus. See USB OTG. USB On-The-Go (OTG) ...................................................... 12 USB OTG Buffer Descriptors and BDT...................................... 212 Device Mode Operation ............................................ 217 DMA Interface........................................................... 213 Hardware Configuration............................................ 209 Device Mode..................................................... 209 External Interface.............................................. 211 Host and OTG Modes....................................... 210 Transceiver Power Requirements .................... 211 VBUS Voltage Generation.................................. 211 Host Mode Operation................................................ 218 Interrupts................................................................... 216 OTG Operation ......................................................... 220 Registers........................................................... 221–239 VBUS Voltage Generation.......................................... 211 V VDDCORE/VCAP Pin ........................................................... 293 Voltage Regulator (On-Chip) ............................................ 293 and BOR................................................................... 294 Standby Mode .......................................................... 294 Tracking Mode.......................................................... 293 W Watchdog Timer (WDT).................................................... 294 Control Register........................................................ 295 Windowed Operation ................................................ 295 WWW Address ................................................................. 348 WWW, On-Line Support ....................................................... 9 PIC24FJ256GB110 FAMILY DS39897C-page 348  2009 Microchip Technology Inc. NOTES:  2009 Microchip Technology Inc. DS39897C-page 349 PIC24FJ256GB110 FAMILY THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com PIC24FJ256GB110 FAMILY DS39897C-page 350  2009 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC24FJ256GB110 Family DS39897C 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?  2009 Microchip Technology Inc. DS39897C-page 351 PIC24FJ256GB110 FAMILY PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Architecture 24 = 16-bit modified Harvard without DSP Flash Memory Family FJ = Flash program memory Product Group GB1 = General purpose microcontrollers with USB On-The-Go Pin Count 06 = 64-pin 08 = 80-pin 10 = 100-pin Temperature Range I = -40C to +85C (Industrial) Package PF = 100-lead (14x14x1 mm) TQFP (Thin Quad Flatpack) PT = 64-lead, 80-lead, 100-lead (12x12x1 mm) TQFP (Thin Quad Flatpack) MR = 64-lead (9x9x0.9 mm) QFN (Quad Flatpack No Leads) Pattern Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise) ES = Engineering Sample Examples: a) PIC24FJ64GB106-I/PT: PIC24F device with USB On-The-Go, 64-Kbyte program memory, 64-pin, Industrial temp.,TQFP package. b) PIC24FJ256GB110-I/PT: PIC24F device with USB On-The-Go, 256-Kbyte program memory, 100-pin, Industrial temp.,TQFP package. Microchip Trademark Architecture Flash Memory Family Program Memory Size (KB) Product Group Pin Count Temperature Range Package Pattern PIC 24 FJ 256 GB1 10 T - I / PT - XXX Tape and Reel Flag (if applicable) DS39897C-page 352  2009 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 http://www.farnell.com/datasheets/1626931.pdf OXPCIe958, PCI Express to Octal Serial Port Highlights ƒ General Features o Octal UART with port expansion interface o PCIe x1 end-point - Integrated 2.5 GT/s SerDes o 13 x 13mm2 , 176-pin TFBGA package o Typical Power: 200 mWatts ƒ Key Features o Standards Compliant - PCI Express Base Specification, r1.1 (backwards compatible with PCIe r1.0a) - PCI Power Management Spec, r1.2 - ExpressCard, Mini Card & AIC compatible - MSI/MSI-X compatible - ASPM (L0S, L1) Link power management o High Performance - PLX’s Oxford 950 UART - DMA/bus mastering of both UARTs - Asynchronous baud rates up to 15 Mbps - 128-byte deep transmit/receive FIFO - 9, 8, 7, 6 & 5-bit data framing - Automated in & out-of-band flow control - Advanced FIFO fill management - Seamless port expansion interface to a second OXPCIe954/8 for 12/16 port solution o Flexibility - RS232, RS422, RS485 and IrDA operation - Flexible clock pre-scaler from 1 to 31.875 - Programmable RS485 Turn-around delay - 450 through 950 software compatibility - 8 user-configurable GPIOs/PWMs - Device parameters configurable via EEPROM - 1.8V, 2.5V or 3.3V UART & GPIO I/O voltage o Robust Operation - Operation from a single 3.3 V supply - Industrial temperature range -40°C to 85°C o Broad Device Driver Support - Windows Vista/XP/2K - WinCE 4.2/5.0/6.0 - Linux 2.4/2.6 Part of the Expresso family of high performance PCI Express devices, the OXPCIe958 is a single chip octal serial port device with port expansion interface in a range of 2, 4 & 8 port solutions, that includes the OXPCIe952 & OXPCIe954. Incorporating PLX Technology’s ultra high performance Oxford 950 UART technology, the device combines outstanding system performance with unrivalled flexibility for even the most demanding of serial applications. Complete with the Oxide development tools and certified device drivers, the OXPCIe958 is easy to design-in and the ideal connectivity solution for a diverse range of products including: PC Add-on Cards, Industrial PC, Point of Sale Terminals, Industrial Control, Building Automation and Network Management. Accelerate your product development and time to market with Oxide and PLX Technology’s easy to design-in, high performance serial connectivity solutions that just work. © PLX Technology, www.plxtech.com Page 1 of 2 4/29/2009, Version 1.00 OXPCIe958, PCI Express to Octal Serial Port Outstanding Performance The OXPCIe958 achieves ultra high performance by combining the class leading 15Mbps asynchronous data rates and deep FIFOs of PLX’s Oxford 950 UART, with advanced MSI interrupt handling and bus master DMA for maximum throughput, minimum CPU overhead and optimal system performance. Configurable octal ports the OXPCIe958 includes a host of advanced features such as, automated in-band flow control, readable FIFO levels and RS485 turnaround delay, that provides further scope to fine tune performance, while its flexible clock pre-scaler provides for a wide range of baud rates. With its high performance port expansion interface, providing seamless expansion to 12 or 16 ports without a PCIe switch, its comprehensive power management and industrial temperature range the OXPCIe958 is the perfect choice for high performance systems. To support these advanced features the OXPCIe958 is backed by a dedicated PLX device driver that is quality assured, exhaustively tested and WHQL approved; saving development time and providing peace of mind. OXPCIe958 Development Support Design and evaluation of the OXPCIe958 couldn’t be easier with this comprehensive reference design kit (RDK). The RDK includes everything you need for PC installation and evaluation including Hardware, Oxide Development Tools and software device drivers. Simply plug the half length PCI Express evaluation board into any PCI Express slot, install the software and its ready to go. Changing the dynamics of device customization, Oxide development tools enable customization of the OXPCIe958 in minutes. No more complex, time consuming, error prone manual editing of programming files and driver source code; Oxide’s intuitive graphical user interface provides simple ‘point and click’ feature selection and text box entry for fast, error free customization with minimal software expertise as well as instant access to up to date documentation, software and reference designs. Check the PLX website for details. Ordering Information Part Number Description OXPCIe958-FBAG Octal Serial Port to PCIe Bridge EK-OXPCIe958 Reference Design Kit © PLX Technology, www.plxtech.com Page 2 of 2 4/29/2009, Version 1.00 1. Product profile 1.1 General description Unidirectional double ElectroStatic Discharge (ESD) protection diodes in a common cathode configuration, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package. The devices are designed for ESD and transient overvoltage protection of up to two signal lines. [1] All types available as /DG halogen-free version. 1.2 Features 1.3 Applications MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression Rev. 01 — 3 September 2008 Product data sheet Table 1. Product overview Type number[1] Package Configuration NXP JEDEC MMBZ12VDL SOT23 TO-236AB dual common cathode MMBZ15VDL MMBZ18VCL MMBZ20VCL MMBZ27VCL MMBZ33VCL ■ Unidirectional ESD protection of two lines ■ ESD protection up to 30 kV (contact discharge) ■ Bidirectional ESD protection of one line ■ IEC 61000-4-2; level 4 (ESD) ■ Low diode capacitance: Cd ≤ 140 pF ■ IEC 61643-321 ■ Rated peak pulse power: PPPM ≤ 40 W ■ AEC-Q101 qualified ■ Ultra low leakage current: IRM ≤ 5 nA ■ Computers and peripherals ■ Automotive electronic control units ■ Audio and video equipment ■ Portable electronics ■ Cellular handsets and accessoriesMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 2 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 1.4 Quick reference data 2. Pinning information Table 2. Quick reference data Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode VRWM reverse standoff voltage MMBZ12VDL MMBZ12VDL/DG - - 8.5 V MMBZ15VDL MMBZ15VDL/DG - - 12.8 V MMBZ18VCL MMBZ18VCL/DG - - 14.5 V MMBZ20VCL MMBZ20VCL/DG - - 17 V MMBZ27VCL MMBZ27VCL/DG - - 22 V MMBZ33VCL MMBZ33VCL/DG - - 26 V Cd diode capacitance f = 1 MHz; VR =0V MMBZ12VDL MMBZ12VDL/DG - 110 140 pF MMBZ15VDL MMBZ15VDL/DG - 85 105 pF MMBZ18VCL MMBZ18VCL/DG - 70 90 pF MMBZ20VCL MMBZ20VCL/DG - 65 80 pF MMBZ27VCL MMBZ27VCL/DG - 48 60 pF MMBZ33VCL MMBZ33VCL/DG - 45 55 pF Table 3. Pinning Pin Description Simplified outline Graphic symbol 1 anode (diode 1) 2 anode (diode 2) 3 common cathode 1 2 3 006aaa150 1 2 3MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 3 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 3. Ordering information 4. Marking [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Table 4. Ordering information Type number Package Name Description Version MMBZ12VDL - plastic surface-mounted package; 3 leads SOT23 MMBZ15VDL MMBZ18VCL MMBZ20VCL MMBZ27VCL MMBZ33VCL MMBZ12VDL/DG - plastic surface-mounted package; 3 leads SOT23 MMBZ15VDL/DG MMBZ18VCL/DG MMBZ20VCL/DG MMBZ27VCL/DG MMBZ33VCL/DG Table 5. Marking codes Type number Marking code[1] Type number Marking code[1] MMBZ12VDL *MA MMBZ12VDL/DG TJ* MMBZ15VDL *MB MMBZ15VDL/DG TL* MMBZ18VCL *MC MMBZ18VCL/DG TN* MMBZ20VCL *MD MMBZ20VCL/DG TQ* MMBZ27VCL *ME MMBZ27VCL/DG TS* MMBZ33VCL *MF MMBZ33VCL/DG TU*MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 4 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 5. Limiting values [1] In accordance with IEC 61643-321 (10/1000 µs current waveform). [2] Measured from pin 1 or 2 to pin 3. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [1] Device stressed with ten non-repetitive ESD pulses. [2] Measured from pin 1 or 2 to pin 3. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode PPPM rated peak pulse power tp = 10/1000 µs [1][2] - 40 W IPPM rated peak pulse current tp = 10/1000 µs [1][2] MMBZ12VDL MMBZ12VDL/DG - 2.35 A MMBZ15VDL MMBZ15VDL/DG - 1.9 A MMBZ18VCL MMBZ18VCL/DG - 1.6 A MMBZ20VCL MMBZ20VCL/DG - 1.4 A MMBZ27VCL MMBZ27VCL/DG - 1A MMBZ33VCL MMBZ33VCL/DG - 0.87 A Per device Ptot total power dissipation Tamb ≤ 25 °C [3] - 350 mW [4] - 440 mW Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C Table 7. ESD maximum ratings Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Max Unit Per diode VESD electrostatic discharge voltage [1][2] IEC 61000-4-2 (contact discharge) - 30 kV machine model - 2 kVMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 5 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Soldering point at pin 3. Table 8. ESD standards compliance Standard Conditions Per diode IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact) MIL-STD-883; class 3 (human body model) > 8 kV Fig 1. 10/1000 µs pulse waveform according to IEC 61643-321 Fig 2. ESD pulse waveform according to IEC 61000-4-2 tp (ms) 0 4.0 1.0 2.0 3.0 006aab319 50 100 150 IPP (%) 0 50 % IPP; 1000 µs 100 % IPP; 10 µs 001aaa631 IPP 100 % 90 % t 30 ns 60 ns 10 % tr = 0.7 ns to 1 ns Table 9. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per device Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 350 K/W [2] - - 280 K/W Rth(j-sp) thermal resistance from junction to solder point [3] - - 60 K/WMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 6 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 7. Characteristics Table 10. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode VF forward voltage MMBZ12VDL MMBZ12VDL/DG IF = 10 mA - - 0.9 V MMBZ15VDL MMBZ15VDL/DG IF = 10 mA - - 0.9 V MMBZ18VCL MMBZ18VCL/DG IF = 10 mA - - 0.9 V MMBZ20VCL MMBZ20VCL/DG IF = 10 mA - - 0.9 V MMBZ27VCL MMBZ27VCL/DG IF = 200 mA - - 1.1 V MMBZ33VCL MMBZ33VCL/DG IF = 10 mA - - 0.9 V VRWM reverse standoff voltage MMBZ12VDL MMBZ12VDL/DG - - 8.5 V MMBZ15VDL MMBZ15VDL/DG - - 12.8 V MMBZ18VCL MMBZ18VCL/DG - - 14.5 V MMBZ20VCL MMBZ20VCL/DG - - 17 V MMBZ27VCL MMBZ27VCL/DG - - 22 V MMBZ33VCL MMBZ33VCL/DG - - 26 V IRM reverse leakage current MMBZ12VDL MMBZ12VDL/DG VRWM = 8.5 V - 0.1 5 nA MMBZ15VDL MMBZ15VDL/DG VRWM = 12.8 V - 0.1 5 nA MMBZ18VCL MMBZ18VCL/DG VRWM = 14.5 V - 0.1 5 nA MMBZ20VCL MMBZ20VCL/DG VRWM = 17 V - 0.1 5 nA MMBZ27VCL MMBZ27VCL/DG VRWM = 22 V - 0.1 5 nA MMBZ33VCL MMBZ33VCL/DG VRWM = 26 V - 0.1 5 nAMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 7 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression VBR breakdown voltage IR = 1 mA MMBZ12VDL MMBZ12VDL/DG 11.4 12 12.6 V MMBZ15VDL MMBZ15VDL/DG 14.3 15 15.8 V MMBZ18VCL MMBZ18VCL/DG 17.1 18 18.9 V MMBZ20VCL MMBZ20VCL/DG 19 20 21 V MMBZ27VCL MMBZ27VCL/DG 25.65 27 28.35 V MMBZ33VCL MMBZ33VCL/DG 31.35 33 34.65 V Cd diode capacitance f = 1 MHz; VR =0V MMBZ12VDL MMBZ12VDL/DG - 110 140 pF MMBZ15VDL MMBZ15VDL/DG - 85 105 pF MMBZ18VCL MMBZ18VCL/DG - 70 90 pF MMBZ20VCL MMBZ20VCL/DG - 65 80 pF MMBZ27VCL MMBZ27VCL/DG - 48 60 pF MMBZ33VCL MMBZ33VCL/DG - 45 55 pF VCL clamping voltage [1][2] MMBZ12VDL MMBZ12VDL/DG IPPM = 2.35 A - - 17 V MMBZ15VDL MMBZ15VDL/DG IPPM = 1.9 A - - 21.2 V MMBZ18VCL MMBZ18VCL/DG IPPM = 1.6 A - - 25 V MMBZ20VCL MMBZ20VCL/DG IPPM = 1.4 A - - 28 V MMBZ27VCL MMBZ27VCL/DG IPPM = 1 A - - 38 V MMBZ33VCL MMBZ33VCL/DG IPPM = 0.87 A - - 46 V Table 10. Characteristics …continued Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max UnitMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 8 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression [1] In accordance with IEC 61643-321 (10/1000 µs current waveform). [2] Measured from pin 1 or 2 to pin 3. SZ temperature coefficient IZ = 1 mA MMBZ12VDL MMBZ12VDL/DG - 8.1 - mV/K MMBZ15VDL MMBZ15VDL/DG - 11 - mV/K MMBZ18VCL MMBZ18VCL/DG - 14 - mV/K MMBZ20VCL MMBZ20VCL/DG - 15.8 - mV/K MMBZ27VCL MMBZ27VCL/DG - 23 - mV/K MMBZ33VCL MMBZ33VCL/DG - 29.4 - mV/K Table 10. Characteristics …continued Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit MMBZ27VCL: unidirectional and bidirectional Tamb = 25 °C Fig 3. Rated peak pulse power as a function of exponential pulse duration (rectangular waveform); typical values Fig 4. Relative variation of rated peak pulse power as a function of junction temperature; typical values 006aab327 102 10 103 PPPM (W) 1 tp (ms) 10−2 103 102 10−1 1 10 Tj (°C) 0 200 50 100 150 006aab321 0.4 0.8 1.2 PPPM 0 PPPM(25°C)MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 9 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression f = 1 MHz; Tamb = 25 °C (1) MMBZ15VDL: unidirectional (2) MMBZ15VDL: bidirectional (3) MMBZ27VCL: unidirectional (4) MMBZ27VCL: bidirectional MMBZ27VCL: VRWM = 22 V Fig 5. Diode capacitance as a function of reverse voltage; typical values Fig 6. Reverse leakage current as a function of junction temperature; typical values Fig 7. V-I characteristics for a unidirectional ESD protection diode Fig 8. V-I characteristics for a bidirectional ESD protection diode VR (V) 0 25 5 10 15 20 006aab328 40 60 20 80 100 Cd (pF) 0 (1) (2) (3) (4) 006aab329 10−1 10−2 10 1 102 IRM (nA) 10−3 Tamb (°C) −75 175 −25 25 75 125 006aab324 −VCL −VBR −VRWM −IRM −IR −IPP V I P-N − + −IPPM 006aab325 −VCL −VBR −VRWM −IRM VRWM VBR VCL IRM −IR IR −IPP IPP − + IPPM −IPPMMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 10 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 8. Application information The MMBZxVCL series and the MMBZxVDL series are designed for the protection of up to two unidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are either positive or negative with respect to ground. The devices provide a surge capability of 40 W per line for a 10/1000 µs waveform. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the devices as close to the input terminal or connector as possible. 2. The path length between the device and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 9. Test information 9.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. Fig 9. Typical application: ESD and transient voltage protection of data lines 006aab330 MMBZxVCL/VDL line 1 to be protected unidirectional protection of two lines bidirectional protection of one line line 2 to be protected GND MMBZxVCL/VDL line 1 to be protected GNDMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 11 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 10. Package outline 11. Packing information [1] For further information and the availability of packing methods, see Section 15. Fig 10. Package outline SOT23 (TO-236AB) Dimensions in mm 04-11-04 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 1 2 3 Table 11. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 MMBZ12VDL SOT23 4 mm pitch, 8 mm tape and reel -215 -235 MMBZ15VDL MMBZ18VCL MMBZ20VCL MMBZ27VCL MMBZ33VCL MMBZ12VDL/DG SOT23 4 mm pitch, 8 mm tape and reel -215 -235 MMBZ15VDL/DG MMBZ18VCL/DG MMBZ20VCL/DG MMBZ27VCL/DG MMBZ33VCL/DGMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 12 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 12. Soldering Fig 11. Reflow soldering footprint SOT23 (TO-236AB) Fig 12. Wave soldering footprint SOT23 (TO-236AB) solder lands solder resist occupied area solder paste sot023_fr 0.5 (3×) 0.6 (3×) 0.6 (3×) 0.7 (3×) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm solder lands solder resist occupied area preferred transport direction during soldering sot023_fw 2.8 4.5 1.4 4.6 1.4 (2×) 1.2 (2×) 2.2 2.6 Dimensions in mmMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 13 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 13. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes MMBZXVCL_MMBZXVDL_SER_1 20080903 Product data sheet - -MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 September 2008 14 of 15 NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression 14. Legal information 14.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. ESD protection devices — These products are only intended for protection against ElectroStatic Discharge (ESD) pulses and are not intended for any other usage including, without limitation, voltage regulation applications. NXP Semiconductors accepts no liability for use in such applications and therefore such use is at the customer’s own risk. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.NXP Semiconductors MMBZxVCL; MMBZxVDL series Double ESD protection diodes for transient overvoltage suppression © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 September 2008 Document identifier: MMBZXVCL_MMBZXVDL_SER_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 16. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Application information. . . . . . . . . . . . . . . . . . 10 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 11 Packing information. . . . . . . . . . . . . . . . . . . . . 11 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 Contact information. . . . . . . . . . . . . . . . . . . . . 14 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 Rev. 05 — 27 February 2009 Product data sheet 1. Product profile 1.1 General description Planar passivated SCR (Silicon Controlled Rectifier) in a SOT78 plastic package. 1.2 Features and benefits „ High reliability „ High surge current capability „ High thermal cycling performance 1.3 Applications „ Ignition circuits „ Motor control „ Protection Circuits „ Static switching 1.4 Quick reference data Table 1. Quick reference Symbol Parameter Conditions Min Typ Max Unit VDRM repetitive peak off-state voltage - - 650 V IT(AV) average on-state current half sine wave; Tmb ≤ 109 °C; see Figure 3 - - 7.5 A IT(RMS) RMS on-state current half sine wave; Tmb ≤ 109 °C; see Figure 1; see Figure 2 - - 12 A Static characteristics IGT gate trigger current VD = 12 V; Tj = 25 °C; IT = 100 mA; see Figure 8 - 2 15 mABT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 2 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 2. Pinning information 3. Ordering information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode SOT78 (TO-220AB; SC-46) 2 A anode 3 G gate mb mb anode 1 2 mb 3 sym037 A K G Table 3. Ordering information Type number Package Name Description Version BT151-650R TO-220AB; SC-46 plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78BT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 3 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDRM repetitive peak off-state voltage - 650 V VRRM repetitive peak reverse voltage - 650 V IT(AV) average on-state current half sine wave; Tmb ≤ 109 °C; see Figure 3 - 7.5 A IT(RMS) RMS on-state current half sine wave; Tmb ≤ 109 °C; see Figure 1; see Figure 2 - 12 A dIT/dt rate of rise of on-state current IT = 20 A; IG = 50 mA; dIG/dt = 50 mA/µs - 50 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C ITSM non-repetitive peak on-state current half sine wave; tp = 8.3 ms; Tj(init) = 25 °C - 132 A half sine wave; tp = 10 ms; Tj(init) = 25 °C; see Figure 4; see Figure 5 - 120 A I 2t I2t for fusing tp = 10 ms; sine-wave pulse - 72 A2s PG(AV) average gate power over any 20 ms period - 0.5 W VRGM peak reverse gate voltage - 5V Fig 1. RMS on-state current as a function of surge duration; maximum values Fig 2. RMS on-state current as a function of mounting base temperature; maximum values surge duration (s) 10−2 10 1 10 −1 001aaa954 10 15 5 20 25 IT(RMS) (A) 0 Tmb (°C) −50 150 0 50 100 001aaa999 8 4 12 16 IT(RMS) (A) 0BT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 4 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 Fig 3. Total power dissipation as a function of average on-state current; maximum values Fig 4. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values IT(AV) (A) 0 2 4 6 8 003aab830 5 10 15 Ptot (W) 0 4 2.8 2.2 1.9 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α a = 1.57 001aaa956 tp (s) 10−5 10−2 10−3 10−4 102 103 ITSM (A) 10 dlT/dt limit tp Tj initial = 25 °C max IT ITSM tBT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 5 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 5. Thermal characteristics Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aab829 80 40 120 160 ITSM (A) 0 number of cycles 1 103 102 10 tp Tj initial = 25 °C max IT ITSM t Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 6 - - 1.3 K/W Rth(j-a) thermal resistance from junction to ambient free air - 60 - K/W Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width 001aaa962 10−1 10−2 1 10 Zth(j-mb) (K/W) 10−3 tp (s) 10−5 10 1 10 −1 10−2 10−4 10−3 tp tp T P t T δ =BT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 6 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics IGT gate trigger current VD = 12 V; Tj = 25 °C; IT = 100 mA; see Figure 8 - 2 15 mA IL latching current VD = 12 V; Tj = 25 °C; see Figure 9 - 10 40 mA IH holding current VD = 12 V; Tj = 25 °C; see Figure 10 - 7 20 mA VT on-state voltage IT = 23 A; Tj = 25 °C; see Figure 11 - 1.4 1.75 V VGT gate trigger voltage IT = 100 mA; VD = 12 V; Tj = 25 °C; see Figure 12 - 0.6 1.5 V IT = 100 mA; VD = 650 V; Tj = 125 °C 0.25 0.4 - V ID off-state current VD = 650 V; Tj = 125 °C - 0.1 0.5 mA IR reverse current VR = 650 V; Tj = 125 °C - 0.1 0.5 mA Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 435 V; Tj = 125 °C; exponential waveform; gate open circuit 50 130 - V/µs VDM = 435 V; Tj = 125 °C; RGK = 100 Ω; exponential waveform; see Figure 7 200 1000 - V/µs tgt gate-controlled turn-on time ITM = 40 A; VD = 650 V; IG = 100 mA; dIG/dt = 5 A/µs; Tj = 25 °C - 2 - µs tq commutated turn-off time VDM = 435 V; Tj = 125 °C; ITM = 20 A; VR = 25 V; (dIT/dt)M = 30 A/µs; dVD/dt = 50 V/µs; RGK = 100 Ω - 70 - µs Fig 7. Critical rate of rise of off-state voltage as a function of junction temperature; minimum values Fig 8. Normalized gate trigger current as a function of junction temperature 001aaa949 103 102 104 dVD/dt (V/μs) 10 Tj (°C) 0 150 50 100 (2) (1) Tj (°C) −50 150 0 50 100 001aaa952 1 2 3 0 IGT IGT(25°C)BT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 7 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 Fig 9. Normalized latching current as a function of junction temperature Fig 10. Normalized holding current as a function of junction temperature Fig 11. On-state current as a function of on-state voltage Fig 12. Normalized gate trigger voltage as a function of junction temperature Tj (°C) −50 150 0 50 100 001aaa951 1 2 3 0 IL IL(25°C) Tj (°C) −50 150 0 50 100 001aaa950 1 2 3 IH IH(25°C) 0 VT (V) 0 2 0.5 1 1.5 001aaa959 10 20 30 IT (A) 0 (1) (2) (3) Tj (°C) −50 150 0 50 100 001aaa953 0.8 1.2 1.6 0.4 VGT VGT(25°C)BT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 8 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 7. Package outline Fig 13. Package outline SOT78 (TO-220AB) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT78 SC-46 3-lead TO-220AB SOT78 08-04-23 08-06-13 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. UNIT A mm 4.7 4.1 1.40 1.25 0.9 0.6 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 15.0 12.8 3.30 2.79 3.8 3.5 A1 DIMENSIONS (mm are the original dimensions) Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB 0 5 10 mm scale b b1 (2) 1.6 1.0 c D 1.3 1.0 b2 (2) D1 E e 2.54 L L1 (1) L2 (1) max. 3.0 p q 3.0 2.7 Q 2.6 2.2 D D1 q p L 123 L1 (1) b1 (2) (3×) b2 (2) (2×) e e b(3×) E A A1 c Q L2 (1) mounting baseBT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 9 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BT151-650R_5 20090227 Product data sheet - BT151_SER_L_R_4 Modifications: • Package outline updated. • Type number BT151-650R separated from data sheet BT151_SER_L_R_4. BT151_SER_L_R_4 20061023 Product data sheet - BT151_SERIES_3 BT151_SERIES_3 (9397 750 13159) 20040607 Product specification - BT151_SERIES_2 BT151_SERIES_2 19990601 Product specification - BT151_SERIES_1 BT151_SERIES_1 19970901 Product specification - -BT151-650R_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 27 February 2009 10 of 11 NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 9. Legal information 9.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 9.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status [1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BT151-650R SCR, 12 A, 15mA, 650 V, SOT78 © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 February 2009 Document identifier: BT151-650R_5 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8 8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .9 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .10 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10 9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10 10 Contact information. . . . . . . . . . . . . . . . . . . . . .10 1. Product profile 1.1 General description The devices are 4-, 6- and 8-channel RC low-pass filter arrays which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition, the devices incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as ±30 kV. The devices are fabricated using monolithic silicon technology and integrate up to eight resistors and sixteen diodes in a 0.4 mm pitch 8-, 12- or 16-pin ultra-thin leadless Quad Flat No-leads (QFN) plastic package with a height of 0.55 mm only. 1.2 Features and benefits „ Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) „ 4-, 6- and 8-channel integrated π-type RC filter network „ ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 far exceeding level 4 „ QFN plastic package with 0.4 mm pitch and 0.55 mm height 1.3 Applications General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: „ Cellular phone and Personal Communication System (PCS) mobile handsets „ Cordless telephones „ Wireless data (WAN/LAN) systems „ Mobile Internet Devices (MID) „ Portable Media Players (PMP) IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network with ESD protection Rev. 2 — 5 May 2011 Product data sheetIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 2 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 1.4 Quick reference data [1] For the total channel. 2. Pinning information Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL Cch channel capacitance f = 100 kHz; Vbias(DC) = 2.5 V [1] - 10 - pF Rs(ch) channel series resistance 80 100 120 Ω IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL Cch channel capacitance f = 100 kHz; Vbias(DC) = 2.5 V [1] - 12 - pF Rs(ch) channel series resistance 32 40 48 Ω IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL Cch channel capacitance f = 100 kHz; Vbias(DC) = 2.5 V [1] - 30 - pF Rs(ch) channel series resistance 160 200 240 Ω IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL Cch channel capacitance f = 100 kHz; Vbias(DC) = 2.5 V [1] - 30 - pF Rs(ch) channel series resistance 80 100 120 Ω Table 2. Pinning Pin Description Simplified outline Graphic symbol IP4251CZ8-4-TTL; IP4252CZ8-4-TTL; IP4253CZ8-4-TTL; IP4254CZ8-4-TTL (SOT1166-1) 1 and 8 filter channel 1 2 and 7 filter channel 2 3 and 6 filter channel 3 4 and 5 filter channel 4 ground pad ground IP4251CZ12-6-TTL; IP4252CZ12-6-TTL; IP4253CZ12-6-TTL; IP4254CZ12-6-TTL (SOT1167-1) 1 and 12 filter channel 1 2 and 11 filter channel 2 3 and 10 filter channel 3 4 and 9 filter channel 4 5 and 8 filter channel 5 6 and 7 filter channel 6 ground pad ground Transparent top view 8 1 5 4 018aaa071 Rs(ch) Cch 1 to 4 5 to 8 GND 2 Cch 2 Transparent top view 12 1 7 6 018aaa072 Rs(ch) 1 to 6 7 to 12 GND Cch 2 Cch 2IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 3 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 3. Ordering information IP4251CZ16-8-TTL; IP4252CZ16-8-TTL; IP4253CZ16-8-TTL; IP4254CZ16-8-TTL (SOT1168-1) 1 and 16 filter channel 1 2 and 15 filter channel 2 3 and 14 filter channel 3 4 and 13 filter channel 4 5 and 12 filter channel 5 6 and 11 filter channel 6 7 and 10 filter channel 7 8 and 9 filter channel 8 ground pad ground Table 2. Pinning …continued Pin Description Simplified outline Graphic symbol Transparent top view 16 1 9 8 018aaa073 Rs(ch) 1 to 8 9 to 16 GND Cch 2 Cch 2 Table 3. Ordering information Type number Package Name Description Version IP4251CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.55 mm SOT1166-1 IP4251CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.55 mm SOT1167-1 IP4251CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.55 mm SOT1168-1 IP4252CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.55 mm SOT1166-1 IP4252CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.55 mm SOT1167-1 IP4252CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.55 mm SOT1168-1 IP4253CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.55 mm SOT1166-1 IP4253CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.55 mm SOT1167-1 IP4253CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.55 mm SOT1168-1 IP4254CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.55 mm SOT1166-1 IP4254CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.55 mm SOT1167-1 IP4254CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.55 mm SOT1168-1IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 4 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 4. Limiting values [1] Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model, far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge). [2] Device tested with 1000 pulses of ±30 kV contact discharges, according to the IEC 61000-4-2 model, far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge). Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL VESD electrostatic discharge voltage all pins to ground; contact discharge [1] - ±15 kV IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL VESD electrostatic discharge voltage all pins to ground; contact discharge [1] - ±15 kV IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL VESD electrostatic discharge voltage all pins to ground [2] contact discharge - ±30 kV air discharge - ±30 kV IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL VESD electrostatic discharge voltage all pins to ground [2] contact discharge - ±30 kV air discharge - ±30 kV Per device VESD electrostatic discharge voltage IEC 61000-4-2, level 4; all pins to ground contact discharge - ±8 kV air discharge - ±15 kV VCC supply voltage −0.5 +5.6 V Pch channel power dissipation Tamb = 85 °C - 60 mW Ptot total power dissipation Tamb = 85 °C - 200 mW Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °CIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 5 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 5. Characteristics [1] For the total channel. [2] Guaranteed by design. Table 5. Channel characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL Cch channel capacitance f = 100 kHz [1] Vbias(DC) = 2.5 V - 10 - pF Vbias(DC) =0V [2] - 15 - pF Rs(ch) channel series resistance 80 100 120 Ω IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL Cch channel capacitance f = 100 kHz [1] Vbias(DC) = 2.5 V - 12 - pF Vbias(DC) =0V [2] - 18 - pF Rs(ch) channel series resistance 32 40 48 Ω IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL Cch channel capacitance f = 100 kHz [1] Vbias(DC) = 2.5 V - 30 - pF Vbias(DC) =0V [2] - 45 - pF Rs(ch) channel series resistance 160 200 240 Ω IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL Cch channel capacitance f = 100 kHz [1] Vbias(DC) = 2.5 V - 30 - pF Vbias(DC) =0V [2] - 45 - pF Rs(ch) channel series resistance 80 100 120 Ω Per device ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 μA VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 9 V VF forward voltage negative clamp; IF = 1 mA 0.4 - 1.5 VIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 6 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network Table 6. Frequency characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL αil insertion loss Rsource = 50 Ω; RL = 50 Ω 800 MHz < f < 3 GHz - 16 - dB f = 1 GHz - 20 - dB αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz - 30 - dB IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL αil insertion loss Rsource = 50 Ω; RL = 50 Ω 800 MHz < f < 3 GHz - 12 - dB f = 1 GHz - 14 - dB αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz - 40 - dB IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL αil insertion loss Rsource = 50 Ω; RL = 50 Ω 800 MHz < f < 3 GHz - 33 - dB f = 1 GHz 35 - - dB αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz - 30 - dB IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL αil insertion loss Rsource = 50 Ω; RL = 50 Ω 800 MHz < f < 3 GHz - 28 - dB f = 1 GHz 30 - - dB αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz - 30 - dBIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 7 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 6. Application information 6.1 Insertion loss The devices are designed as EMI/RFI filters for multichannel interfaces. The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1. Typical measurements results are shown in Figure 2 to Figure 6 for the different devices. (1) IP4252CZ16-8-TTL - channel 1 to channel 16 (2) IP4251CZ16-8-TTL - channel 1 to channel 16 (3) IP4254CZ16-8-TTL - channel 1 to channel 16 (4) IP4253CZ16-8-TTL - channel 1 to channel 16 Fig 1. Frequency response setup Fig 2. Frequency response curves overview 018aaa074 50 Ω Vgen 50 Ω DUT IN OUT 001aaj308 −30 −20 −40 −10 0 S21 (dB) −50 f (MHz) 10−1 104 103 1 102 10 (1) (2) (3) (4)IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 8 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network Due to the optimized silicon dice and package design, all channels in a single package show a very good matching performance as the insertion loss for a channel at the package side (e.g. channel 1 to channel 16) is nearly identical with the center channels (e.g. channel 4 to channel 13). (1) Channel 1 to channel 16 (2) Channel 4 to channel 13 (1) Channel 1 to channel 16 (2) Channel 4 to channel 13 Fig 3. IP4251CZ16-8-TTL: frequency response curves Fig 4. IP4252CZ16-8-TTL: frequency response curves (1) Channel 1 to channel 16 (2) Channel 4 to channel 13 (1) Channel 4 to channel 13 (2) Channel 1 to channel 16 Fig 5. IP4253CZ16-8-TTL: frequency response curves Fig 6. IP4254CZ16-8-TTL: frequency response curves 001aaj608 −30 −20 −40 −10 0 S21 (dB) −50 f (MHz) 10−1 104 103 1 102 10 (1) (2) 001aaj609 −30 −20 −40 −10 0 S21 (dB) −50 f (MHz) 10−1 104 103 1 102 10 (1) (2) 001aaj610 −30 −20 −40 −10 0 S21 (dB) −50 f (MHz) 10−1 104 103 1 102 10 (1) (2) 001aaj611 −30 −20 −40 −10 0 S21 (dB) −50 f (MHz) 10−1 104 103 1 102 10 (1) (2)IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 9 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 6.2 Selection The selection of one of the filter devices has to be performed depending on the maximum clock frequency, driver strength, capacitive load of the sink, and also the maximum applicable rise and fall times. 6.2.1 SDHC and MMC memory interface The Secure Digital High Capacity (SDHC) memory card interface standard specification and the Multi Media Card (MMC) (JESD 84A43) standard specification recommend a rise and fall time of 25 % to 62.5 % (62.5 % to 25 % respectively) of 3 ns or less for the input signal of the receiving interface side. Assuming a typical capacitance of about 20 pF for the SDHC memory card itself, and approximately 4 pF to 7 pF for the Printed-Circuit Board (PCB) and the card holder, IP4252CZ12-6-TTL (6 channels, Rs(ch) = 40 Ω, Cch = 12 pF at Vbias(DC) = 2.5 V) is a matching selection to filter and protect all relevant interface pins such as CLK, CMD, and DAT0 to DAT3/CD. Please refer to Figure 7 for a general example of the implementation of the device in an SDHC card interface. In case additional channels such as write-protect or a mechanical card-detection switch are used, the IP4252CZ16-8-TTL (8 channels, Rs(ch) = 40 Ω, Cch = 12 pF at Vbias(DC) = 2.5 V) offers two additional channels.IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 10 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network The capacitance values specified for the signal channels of the MMC interface differ from the SDHC specification. The MMC card-side interface is specified to have an intrinsic capacitance of 12 pF to 18 pF and the total channel is limited according to the specification to 30 pF only. Therefore, any filter device capacitance is limited to a maximum of up to 18 pF, including the card holder and PCB traces. Please refer to Figure 8 for a general example of the implementation of the IP4252 in an MMC interface application. Fig 7. Example of IP4252 in an SDHC card interface 018aaa075 IP4252CZ12-6-TTL (IP4252CZ16-8-TTL) DAT1 pull-up resistors 10 kΩ − 100 kΩ 10 kΩ − 90 kΩ DAT3/CD pull-up 10 kΩ − 100 kΩ DAT3/CD pull-up >270 kΩ exact value depends on required logic levels DAT1 SD MEMORY CARD SET_CLR_ CARD_DETECT (ACMD42) to HOST INTERFACE DAT0 GND CLK VCC(VSD) VCC(VSD) DAT3/CD CMD DAT2 optional: 2-additional channels of IP4252CZ16-8-TTL optional: write protect switch optional: electrical card detect WP DAT0 CLK CMD DAT3/CD DAT2 CD WP optional: card detect switch CDIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 11 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network To generate SDHC and MMC-compliant digital signals, the driver strength should not significantly undercut 8 mA. 6.2.2 LCD interfaces, medium-speed interfaces For digital interfaces such as LCD interfaces running at clock speeds between 10 MHz and 25 MHz or more, IP4251, IP4252 or IP4254 can be used depending on the sink load, clock speed, driver strength and rise and fall time requirements. Also the minimum EMI filter requirements may be a decision-making factor. 6.2.3 Keypad, low-speed interfaces Especially for lower-speed interfaces such as keypads, low-speed serial interfaces (e.g. Recommended Standard (RS) 232) and low-speed control signals, IP4253 (Rs(ch) = 200 Ω, Cch = 30 pF at Vbias(DC) = 2.5 V) offers a very robust ESD protection and strong suppression of unwanted frequencies (EMI filtering). Fig 8. Example of IP4252 in an MMC interface 018aaa076 IP4252CZ12-6-TTL IP4252CZ8-4-TTL DAT1 pull-up resistors 50 kΩ - 100 kΩ CMD pull-up 4.7 kΩ - 100 kΩ DAT1 C8 e.g. RSMMC HOST INTERFACE DAT0 C7 DAT7 C13 VSS2 C6 DAT6 C12 CLK C5 VCC(VMMC) VCC(VMMC) C4 VSS1 C3 DAT5 C11 CMD C2 DAT4 C10 DAT3 C1 DAT2 CMD DAT4 DAT3 DAT2 C9 DAT0 DAT7 DAT6 CLK DAT5IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 12 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 7. Package outline Fig 9. Package outline SOT1166-1 (HUSON8) Outline References version European projection Issue date IEC JEDEC JEITA SOT1166-1 - - - - - - - - - sot1166-1_po 10-03-18 10-03-22 Unit(1) mm max nom min 0.55 0.05 0.00 0.25 0.20 0.15 1.8 1.7 1.6 1.3 1.2 1.1 1.45 1.35 1.25 0.4 1.2 0.30 0.25 0.20 0.05 A Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1 A1 c 0.127 b DDh E Eh 0.45 0.40 0.35 e e1 k 0.2 L v 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y1 C y tiebars are indicated on arbitrary location and size detail X A A1 c terminal 1 index area D B A E b terminal 1 index area e1 e v C A B w C L k Eh Dh 1 8 4 5IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 13 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network Fig 10. Package outline SOT1167-1 (HUSON12) Outline References version European projection Issue date IEC JEDEC JEITA SOT1167-1 - - - - - - - - - sot1167-1_po 10-03-18 10-03-22 Unit(1) mm max nom min 0.55 0.05 0.00 0.25 0.20 0.15 2.6 2.5 2.4 2.1 2.0 1.9 1.45 1.35 1.25 0.4 2.0 0.30 0.25 0.20 0.05 A Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HUSON12: plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.55 mm SOT1167-1 A1 c 0.127 b DDh E Eh 0.45 0.40 0.35 e e1 k 0.2 L v 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y1 C y tiebars are indicated on arbitrary location and size detail X A A1 c terminal 1 index area D B A E b terminal 1 index area e1 e v C A B w C L k Eh Dh 1 12 6 7IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 14 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network Fig 11. Package outline SOT1168-1 (HUSON16) Outline References version European projection Issue date IEC JEDEC JEITA SOT1168-1 - - - - - - - - - sot1168-1_po 10-03-18 10-03-22 Unit(1) mm max nom min 0.55 0.05 0.00 0.25 0.20 0.15 3.4 3.3 3.2 2.9 2.8 2.7 1.45 1.35 1.25 0.4 2.8 0.30 0.25 0.20 0.05 A Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1 A1 c 0.127 b DDh E Eh 0.45 0.40 0.35 e e1 k 0.2 L v 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y1 C y tiebars are indicated on arbitrary location and size detail X A A1 c terminal 1 index area D B A E b terminal 1 index area e1 e v C A B w C L k Eh Dh 1 16 8 9IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 15 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4251_52_53_54-TTL v.2 20110505 Product data sheet - IP4251_52_53_54-TTL v.1 Modifications: • Section 1 “Product profile”: updated. • Table 2 “Pinning”: updated. • Deleted section “Thermal characteristics”. IP4251_52_53_54-TTL v.1 20110131 Objective data sheet - -IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 16 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network 9. Legal information 9.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 May 2011 17 of 18 NXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors IP4251/52/53/54-TTL Integrated 4-, 6- and 8-channel passive filter network © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 May 2011 Document identifier: IP4251_52_53_54-TTL Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Application information. . . . . . . . . . . . . . . . . . . 7 6.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.2 Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6.2.1 SDHC and MMC memory interface . . . . . . . . . 9 6.2.2 LCD interfaces, medium-speed interfaces . . . 11 6.2.3 Keypad, low-speed interfaces. . . . . . . . . . . . . 11 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10 Contact information. . . . . . . . . . . . . . . . . . . . . 17 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 1. Product profile 1.1 General description High voltage, high speed, planar passivated NPN power switching transistor with integrated anti-parallel E-C diode in a SOT186A (TO220F) full pack plastic package. 1.2 Features and benefits „ Fast switching „ High voltage capability „ Integrated anti-parallel E-C diode „ Isolated package „ Very low switching and conduction losses 1.3 Applications „ DC-to-DC converters „ Electronic lighting ballasts „ Inverters „ Motor control systems 1.4 Quick reference data BUJD203AX NPN power transistor with integrated diode Rev. 01 — 27 September 2010 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit IC collector current see Figure 1; see Figure 2; DC; see Figure 4 - - 4A Ptot total power dissipation Th ≤ 25 °C; see Figure 3 - - 26 W VCESM collector-emitter peak voltage VBE = 0 V - - 850 V Static characteristics hFE DC current gain IC = 500 mA; VCE = 5 V; see Figure 11; Th = 25 °C 13 21 32 VCE = 5 V; IC = 3 A; see Figure 11; Th = 25 °C - 12.5 - VCEOsus collector-emitter sustaining voltage IB = 0 A; LC = 25 mH; IC = 10 mA; see Figure 6; see Figure 7 400 450 - VBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 2 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 2. Pinning information 3. Ordering information 4. Limiting values Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 B base SOT186A (TO-220F) 2 C collector 3 E emitter mb n.c. mounting base; isolated 1 2 3 mb sym131 C E B Table 3. Ordering information Type number Package Name Description Version BUJD203AX TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 "full pack" SOT186A Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCESM collector-emitter peak voltage VBE = 0 V - 850 V VCBO collector-base voltage IE = 0 A - 850 V VCEO collector-emitter voltage IB = 0 A - 425 V IC collector current DC; see Figure 1; see Figure 2; see Figure 4 - 4A ICM peak collector current see Figure 1; see Figure 2; see Figure 4 - 8A IB base current DC - 2 A IBM peak base current - 4 A Ptot total power dissipation Th ≤ 25 °C; see Figure 3 - 26 W Tstg storage temperature -65 150 °C Tj junction temperature - 150 °CBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 3 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode Fig 1. Reverse bias safe operating area Fig 2. Test circuit for reverse bias safe operating area Fig 3. Normalized total power dissipation as a function of heatsink temperature VCEclamp (V) 0 1000 200 400 600 800 001aac000 4 6 2 8 10 IC (A) 0 001aab999 DUT LC I LB Bon VBB VCC VCL(CE) probe point 03aa13 0 40 80 120 0 50 100 150 200 Th (°C) Pder (%)BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 4 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 1)Ptot maximum and Ptot peak maximum lines 2)Second breakdown limits 3) I = Region of permissable DC operation II = Extension for repetitive pulse operation III = Extension during turn-on in single transistor converters provided that RBE ≤ 100 Ω and tp ≤ 0.6 μs Fig 4. Forward bias safe operating area for Tmb ≤ 25 °C 001aac001 10−1 10−2 10 1 102 IC (A) 10−3 VCEclamp (V) 1 103 102 10 (1) 100 μs 200 μs I(3) tp = 20 μs duty cycle = 0.01 50 μs 500 μs DC II(3) III(3) (2) ICM(max) IC(max)BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 5 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 5. Thermal characteristics 6. Isolation characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-h) thermal resistance from junction to heatsink with heatsink compound; see Figure 5 - - 4.8 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 55 - K/W Fig 5. Transient thermal impedance from junction to heatsink as a function of pulse duration 001aag169 10−2 10−1 1 10 Zth(j-h) (K/W) 10−3 tp (s) 10−6 102 10 10 −3 10−5 10 1 −1 10−2 10−4 tp tp 1/f P t 1/f δ = δ = 0.5 0.2 0.1 0.05 0.02 0 Table 6. Isolation characteristics Symbol Parameter Conditions Min Typ Max Unit Visol(RMS) RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C; from all terminals to external heatsink; clean and dust free - - 2500 V Cisol isolation capacitance Th = 25 °C; f = 1 MHz; from collector to external heatsink - 10 - pFBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 6 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 7. Characteristics [1] Measured with half-sine wave voltage (curve tracer) Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics ICES collector-emitter cut-off current VBE = 0 V; VCE = 850 V; Tj = 125 °C [1] - - 2 mA VBE = 0 V; VCE = 850 V; Tj = 25 °C [1] - - 1 mA ICBO collector-base cut-off current VCB = 850 V; IE =0A [1] - - 1 mA ICEO collector-emitter cut-off current VCE = 425 V; IB =0A [1] - - 0.1 mA IEBO emitter-base cut-off current VEB = 7 V; IC = 0 A - - 10 mA VCEOsus collector-emitter sustaining voltage IB = 0 A; IC = 10 mA; LC = 25 mH; see Figure 6; see Figure 7 400 450 - V VCEsat collector-emitter saturation voltage IC = 3 A; IB = 0.6 A; see Figure 8; see Figure 9 - 0.29 1 V VBEsat base-emitter saturation voltage IC = 3 A; IB = 0.6 A; see Figure 10 - 0.99 1.5 V VF forward voltage IF = 2 A; Tj = 25 °C - 1.04 1.5 V hFE DC current gain IC = 1 mA; VCE = 5 V; Th = 25 °C; see Figure 11 10 15 32 IC = 500 mA; VCE = 5 V; Th = 25 °C; see Figure 11 13 21 32 IC = 2 A; VCE = 5 V; Th = 25 °C; see Figure 11 11 16 22 IC = 3 A; VCE = 5 V; Th = 25 °C; see Figure 11 - 12.5 - Dynamic characteristics ton turn-on time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A; RL = 75 Ω; Tj = 25 °C; resistive load; see Figure 12; see Figure 13 - 0.52 0.6 µs ts storage time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A; RL = 75 Ω; Tj = 25 °C; resistive load; see Figure 12; see Figure 13 - 2.7 3.3 µs IC = 2 A; IBon = 0.4 A; VBB = -5 V; LB = 1 µH; Tj = 25 °C; inductive load; see Figure 14; see Figure 15 - 1.2 1.4 µs IC = 2 A; IBon = 0.4 A; VBB = -5 V; LB = 1 µH; Tj = 100 °C; inductive load; see Figure 14; see Figure 15 - - 1.8 µs tf fall time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A; RL = 75 Ω; Tj = 25 °C; resistive load; see Figure 12; see Figure 13 - 0.3 0.35 µs IC = 2 A; IBon = 0.4 A; VBB = -5 V; LB = 1 µH; Tj = 100 °C; inductive load; see Figure 14; see Figure 15 - - 0.12 µs IC = 2 A; IBon = 0.4 A; VBB = -5 V; LB = 1 µH; Tj = 25 °C; inductive load; see Figure 14; see Figure 15 - 0.03 0.06 µsBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 7 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode Fig 6. Test circuit for collector-emitter sustaining voltage Fig 7. Oscilloscope display for collector-emitter sustaining voltage test waveform Fig 8. Collector-emitter saturation voltage as a function of base current; typical values Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values 001aab987 horizontal 300 Ω 1 Ω 6 V vertical oscilloscope 50 V 100 Ω to 200 Ω 30 Hz to 60 Hz 001aab988 min VCE (V) VCEOsus IC (mA) 10 100 250 0 IB (A) 10−2 10 1 10 −1 001aab995 0.8 1.2 0.4 1.6 2.0 VCEsat (V) 0 IC = 1 A 2 A 3 A 4 A 001aab997 VCEsat (V) IC (A) 10−1 1 10 0.2 0.1 0.3 0.4 0.5 0BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 8 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode Fig 10. Base-emitter saturation voltage as a function of collector current; typical values Fig 11. DC current gain as a function of collector current; typical values Fig 12. Test circuit for resistive load switching Fig 13. Switching times waveforms for resistive load 001aab996 VBEsat (V) IC (A) 10−1 1 10 0.6 0.8 0.2 0.4 1.0 1.2 1.4 0 001aab994 IC (A) 10−2 10 1 10 −1 10 102 hFE 1 VCE = 5 V 1 V Tj = 25 °C 001aab989 tp RB VIM 0 RL DUT VCC T 001aab990 IC IB 10 % 10 % 90 % 90 % ton toff ts tf t t IBon −IBoff ICon tr ≤ 30 nsBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 9 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode Fig 14. Test circuit for inductive load switching Fig 15. Switching times waveforms for inductive load 001aab991 VCC LC DUT I LB Bon VBB 001aab992 IC IB 90 % toff IBon ts tf t t −IBoff ICon 10 %BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 10 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 8. Package outline Fig 16. Package outline SOT186A (TO-220F) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT186A 3-lead TO-220F 0 5 10 mm scale Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 'full pack' SOT186A A A1 Q c K j Notes 1. Terminal dimensions within this zone are uncontrolled. 2. Both recesses are ∅ 2.5 × 0.8 max. depth D D1 L L2 L1 b1 b2 e1 e b w M 1 2 3 q E P T UNIT b1 D D1 c e L L2 P Q q (1) max. e A 1 mm 5.08 3 4.6 4.0 A1 2.9 2.5 b 0.9 0.7 1.1 0.9 b2 1.4 1.0 0.7 0.4 15.8 15.2 6.5 6.3 E 10.3 9.7 2.54 14.4 13.5 T (2) 2.5 0.4 L1 3.30 2.79 j 2.7 1.7 K 0.6 0.4 2.6 2.3 3.0 2.6 w 3.2 3.0 DIMENSIONS (mm are the original dimensions) 02-04-09 06-02-14 mounting baseBUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 11 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 9. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BUJD203AX v.1 20100927 Product data sheet - -BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 12 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode 10. Legal information 10.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.BUJD203AX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 September 2010 13 of 14 NXP Semiconductors BUJD203AX NPN power transistor with integrated diode agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors BUJD203AX NPN power transistor with integrated diode © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 September 2010 Document identifier: BUJD203AX Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 12. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 6 Isolation characteristics . . . . . . . . . . . . . . . . . . .5 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 11 Contact information. . . . . . . . . . . . . . . . . . . . . .13 http://www.farnell.com/datasheets/1792649.pdf 1. Product profile 1.1 General description NPN/NPN general-purpose transistor pair in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. 1.2 Features ■ Low collector capacitance ■ Low collector-emitter saturation voltage ■ Closely matched current gain ■ Reduces number of components and board space ■ No mutual interference between the transistors ■ AEC-Q101 qualified 1.3 Applications ■ General-purpose switching and amplification 1.4 Quick reference data BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor Rev. 01 — 17 July 2009 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per transistor VCEO collector-emitter voltage open base - - 65 V IC collector current - - 100 mA hFE DC current gain VCE = 5 V; IC = 2 mA 200 300 450BC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 2 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 emitter TR1 2 base TR1 3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1 1 3 2 6 5 4 sym020 1 2 3 6 5 TR1 TR2 4 Table 3. Ordering information Type number Package Name Description Version BC846DS SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457 Table 4. Marking codes Type number Marking code BC846DS ZK Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor VCBO collector-base voltage open emitter - 80 V VCEO collector-emitter voltage open base - 65 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; tp ≤ 1 ms - 200 mA IBM peak base current single pulse; tp ≤ 1 ms - 200 mA Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW Per device Ptot total power dissipation Tamb ≤ 25 °C [1] - 380 mWBC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 3 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C FR4 PCB, standard footprint Fig 1. Per device: Power derating curve SOT457 (SC-74) Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tamb (°C) −75 175 −25 25 75 125 006aab621 200 300 100 400 500 Ptot (mW) 0 Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 500 K/W Rth(j-sp) thermal resistance from junction to solder point - - 250 K/W Per device Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 328 K/WBC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 4 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 7. Characteristics FR4 PCB, standard footprint Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab622 10−5 10 10 −2 10−4 102 10−1 tp (s) 10−3 103 1 102 10 103 Zth(j-a) (K/W) 1 δ = 1 0.75 0.50 0.33 0.10 0.05 0.02 0.01 0 0.20 Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per transistor ICBO collector-base cut-off current VCB = 50 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 °C --5 µA IEBO emitter-base cut-off current VEB = 6 V; IC = 0 A - - 100 nA hFE DC current gain VCE =5V IC = 10 µA - 280 - IC = 2 mA 200 300 450 VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - 55 100 mV IC = 100 mA; IB = 5 mA - 200 300 mV VBEsat base-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - 755 850 mV IC = 100 mA; IB = 5 mA - 1000 - mV VBE base-emitter voltage VCE =5V IC = 2 mA 580 650 700 mV IC = 10 mA - - 770 mVBC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 5 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - 1.9 - pF Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz - 11 - pF fT transition frequency VCE = 5 V; IC = 10 mA; f = 100 MHz 100 - - MHz NF noise figure VCE = 5 V; IC = 0.2 mA; RS =2kΩ; f = 10 Hz to 15.7 kHz - 1.9 - dB VCE = 5 V; IC = 0.2 mA; RS =2kΩ; f = 1 kHz; B = 200 Hz - 3.1 - dB Table 7. Characteristics …continued Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCE =5V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C Fig 3. Per transistor: DC current gain as a function of collector current; typical values Fig 4. Per transistor: Collector current as a function of collector-emitter voltage; typical values 006aaa533 200 400 600 hFE 0 IC (mA) 10−2 103 102 10−1 1 10 (3) (1) (2) 006aaa532 VCE (V) 0 10 2 4 6 8 0.08 0.12 0.04 0.16 0.20 IC (A) 0 IB (mA) = 4.50 2.70 3.15 4.05 3.60 0.45 0.90 1.35 1.80 2.25BC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 6 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor VCE = 5 V; Tamb = 25 °C IC/IB = 20 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig 5. Per transistor: Base-emitter voltage as a function of collector current; typical values Fig 6. Per transistor: Base-emitter saturation voltage as a function of collector current; typical values IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C VCE = 5 V; Tamb = 25 °C Fig 7. Per transistor: Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. Per transistor: Transition frequency as a function of collector current; typical values 006aaa536 0.6 0.8 1 VBE (V) 0.4 IC (mA) 10−1 103 102 1 10 006aaa534 IC (mA) 10−1 103 102 1 10 0.5 0.9 1.3 0.3 0.7 1.1 VBEsat (V) 0.1 (1) (2) (3) 006aaa535 1 10−1 10 VCEsat (V) 10−2 IC (mA) 10−1 103 102 1 10 (1) (2) (3) 006aaa537 IC (mA) 1 102 10 102 103 fT (MHz) 10BC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 7 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor f = 1 MHz; Tamb = 25 °C f = 1 MHz; Tamb = 25 °C Fig 9. Per transistor: Collector capacitance as a function of collector-base voltage; typical values Fig 10. Per transistor: Emitter capacitance as a function of emitter-base voltage; typical values VCB (V) 0 10 2 4 6 8 006aab620 2 4 6 Cc (pF) 0 006aaa539 VEB (V) 0 6 2 4 9 11 7 13 15 Ce (pF) 5BC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 8 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping Fig 11. Package outline SOT457 (SC-74) Dimensions in mm 04-11-08 3.0 2.5 1.7 1.3 3.1 2.7 pin 1 index 1.9 0.26 0.10 0.40 0.25 0.95 1.1 0.9 0.6 0.2 1 3 2 6 5 4 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BC846DS SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165BC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 9 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 11. Soldering Fig 12. Reflow soldering footprint SOT457 (SC-74) Fig 13. Wave soldering footprint SOT457 (SC-74) solder lands solder resist occupied area solder paste sot457_fr 3.45 1.95 3.3 2.825 0.45 (6×) 0.55 (6×) 0.7 (6×) 0.8 (6×) 2.4 0.95 0.95 Dimensions in mm sot457_fw 5.3 5.05 1.45 (6×) 0.45 (2×) 1.5 (4×) 2.85 1.475 1.475 solder lands solder resist occupied area preferred transport direction during soldering Dimensions in mmBC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 10 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BC846DS_1 20090717 Product data sheet - -BC846DS_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 17 July 2009 11 of 12 NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 July 2009 Document identifier: BC846DS_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Contact information. . . . . . . . . . . . . . . . . . . . . 11 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 1. Product profile 1.1 General description Enhanced ultrafast power diode in a SOD59 (2-lead TO-220AC) plastic package. 1.2 Features and benefits „ High thermal cycling performance „ Low on-state losses „ Low thermal resistance „ Soft recovery characteristic 1.3 Applications „ Dual Mode (DCM and CCM) PFC „ Power Factor Correction (PFC) for Interleaved Topology 1.4 Quick reference data BYV29F-600 Enhanced ultrafast power diode Rev. 02 — 7 March 2011 Product data sheet TO-220AC Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VRRM repetitive peak reverse voltage - - 600 V IF(AV) average forward current square-wave pulse; δ = 0.5 ; Tmb ≤ 115 °C; see Figure 1; see Figure 2 - - 9A Static characteristics VF forward voltage IF = 8 A; Tj = 25 °C; see Figure 5 - 1.45 1.9 V IF = 8 A; Tj = 150 °C; see Figure 5 - 1.25 1.7 V Dynamic characteristics trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 100 A/µs; Tj = 25 °C; see Figure 6 - 17.5 35 nsBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 — 7 March 2011 2 of 11 NXP Semiconductors BYV29F-600 Enhanced ultrafast power diode 2. Pinning information 3. Ordering information 4. Limiting values Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode SOD59 (TO-220AC) 2 A anode mb mb mounting base; cathode mb 1 2 A 001aaa020 K Table 3. Ordering information Type number Package Name Description Version BYV29F-600 TO-220AC plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59 Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VRRM repetitive peak reverse voltage - 600 V VRWM crest working reverse voltage - 600 V VR reverse voltage DC - 600 V IF(AV) average forward current square-wave pulse; δ = 0.5 ; Tmb ≤ 115 °C; see Figure 1; see Figure 2 - 9A IFRM repetitive peak forward current square-wave pulse; δ = 0.5 ; tp = 25 µs; Tmb ≤ 115 °C - 18 A IFSM non-repetitive peak forward current tp = 10 ms; sine-wave pulse; Tj(init) = 25 °C; see Figure 3 - 91 A tp = 8.3 ms; sine-wave pulse; Tj(init) = 25 °C; see Figure 3 - 100 A Tstg storage temperature -40 150 °C Tj junction temperature - 150 °CBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 — 7 March 2011 3 of 11 NXP Semiconductors BYV29F-600 Enhanced ultrafast power diode Fig 1. Forward power dissipation as a function of average forward current; square waveform; maximum values Fig 2. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values Fig 3. Non-repetitive peak forward current as a function of pulse width; square waveform; maximum values 003aae718 0 4 8 12 16 20 0 5 10 15 IF(AV) (A) Ptot (W) δ = 1 0.5 0.2 0.1 003aae719 0 4 8 12 16 0369 IF(AV) (A) Ptot (W) a = 1.57 1.9 2.2 2.8 4.0 003aae705 tp (s) 10-5 10-2 10-3 10-4 102 103 IFSM (A) 101 tp P tBYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 — 7 March 2011 4 of 11 NXP Semiconductors BYV29F-600 Enhanced ultrafast power diode 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 2.5 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse width 001aag913 1 10−1 10 Zth(j-mb) (K/W) 10−3 10−2 tp (s) 10−6 10 1 10 −1 10−5 10−3 10−2 10−4 tp tp T P t T δ =BYV29F-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 — 7 March 2011 5 of 11 NXP Semiconductors BYV29F-600 Enhanced ultrafast power diode 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics VF forward voltage IF = 8 A; Tj = 25 °C; see Figure 5 - 1.45 1.9 V IF = 8 A; Tj = 150 °C; see Figure 5 - 1.25 1.7 V IR re