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Farnell PDF
PIC12F609/615/617/12HV609/615 - Microchip - Farnell Element 14
PIC12F609/615/617/12HV609/615 - Microchip - Farnell Element 14
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Farnell Element 14 :
See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…
Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.
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2010 Microchip Technology Inc. DS41302D
PIC12F609/615/617
PIC12HV609/615
Data Sheet
8-Pin, Flash-Based 8-Bit
CMOS Microcontrollers
*8-bit, 8-pin Devices Protected by Microchip’s Low Pin Count Patent: U.S. Patent No. 5,847,450. Additional U.S. and
foreign patents and applications may be issued or pending.
DS41302D-page 2 2010 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2010 Microchip Technology Inc. DS41302D-page 3
PIC12F609/615/617/12HV609/615
High-Performance RISC CPU:
• Only 35 Instructions to Learn:
- All single-cycle instructions except branches
• Operating Speed:
- DC – 20 MHz oscillator/clock input
- DC – 200 ns instruction cycle
• Interrupt Capability
• 8-Level Deep Hardware Stack
• Direct, Indirect and Relative Addressing modes
Special Microcontroller Features:
• Precision Internal Oscillator:
- Factory calibrated to ±1%, typical
- Software selectable frequency: 4 MHz or
8 MHz
• Power-Saving Sleep mode
• Voltage Range:
- PIC12F609/615/617: 2.0V to 5.5V
- PIC12HV609/615: 2.0V to user defined
maximum (see note)
• Industrial and Extended Temperature Range
• Power-on Reset (POR)
• Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
• Brown-out Reset (BOR)
• Watchdog Timer (WDT) with independent
Oscillator for Reliable Operation
• Multiplexed Master Clear with Pull-up/Input Pin
• Programmable Code Protection
• High Endurance Flash:
- 100,000 write Flash endurance
- Flash retention: > 40 years
• Self Read/ Write Program Memory (PIC12F617
only)
Low-Power Features:
• Standby Current:
- 50 nA @ 2.0V, typical
• Operating Current:
- 11A @ 32 kHz, 2.0V, typical
- 260A @ 4 MHz, 2.0V, typical
• Watchdog Timer Current:
- 1A @ 2.0V, typical
Note: Voltage across the shunt regulator should
not exceed 5V.
Peripheral Features:
• Shunt Voltage Regulator (PIC12HV609/615 only):
- 5 volt regulation
- 4 mA to 50 mA shunt range
• 5 I/O Pins and 1 Input Only
• High Current Source/Sink for Direct LED Drive
- Interrupt-on-pin change or pins
- Individually programmable weak pull-ups
• Analog Comparator module with:
- One analog comparator
- Programmable on-chip voltage reference
(CVREF) module (% of VDD)
- Comparator inputs and output externally
accessible
- Built-In Hysteresis (software selectable)
• Timer0: 8-Bit Timer/Counter with 8-Bit
Programmable Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Timer1 Gate (count enable)
- Option to use OSC1 and OSC2 in LP mode
as Timer1 oscillator if INTOSC mode
selected
- Option to use system clock as Timer1
• In-Circuit Serial ProgrammingTM (ICSPTM) via Two
Pins
PIC12F615/617/HV615 ONLY:
• Enhanced Capture, Compare, PWM module:
- 16-bit Capture, max. resolution 12.5 ns
- Compare, max. resolution 200 ns
- 10-bit PWM with 1 or 2 output channels, 1
output channel programmable “dead time,”
max. frequency 20 kHz, auto-shutdown
• A/D Converter:
- 10-bit resolution and 4 channels, samples
internal voltage references
• Timer2: 8-Bit Timer/Counter with 8-Bit Period
Register, Prescaler and Postscaler
8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PIC12F609/615/617/12HV609/615
DS41302D-page 4 2010 Microchip Technology Inc.
8-Pin Diagram, PIC12F609/HV609 (PDIP, SOIC, MSOP, DFN)
TABLE 1: PIC12F609/HV609 PIN SUMMARY (PDIP, SOIC, MSOP, DFN)
Device
Program
Memory Data Memory
Self Read/
Self Write I/O 10-bit A/D
(ch) Comparators ECCP Timers
8/16-bit Voltage Range
Flash
(words) SRAM (bytes)
PIC12F609 1024 64 — 5 0 1 — 1/1 2.0V-5.5V
PIC12HV609 1024 64 — 5 0 1 — 1/1 2.0V-user defined
PIC12F615 1024 64 — 5 4 1 YES 2/1 2.0V-5.5V
PIC12HV615 1024 64 — 5 4 1 YES 2/1 2.0V-user defined
PIC12F617 2048 128 YES 5 4 1 YES 2/1 2.0V-5.5V
I/O Pin Comparators Timer Interrupts Pull-ups Basic
GP0 7 CIN+ — IOC Y ICSPDAT
GP1 6 CIN0- — IOC Y ICSPCLK
GP2 5 COUT T0CKI INT/IOC Y —
GP3(1) 4 — — IOC Y(2) MCLR/VPP
GP4 3 CIN1- T1G IOC Y OSC2/CLKOUT
GP5 2 — T1CKI IOC Y OSC1/CLKIN
— 1 — — — — VDD
— 8 — — — — VSS
Note 1: Input only.
2: Only when pin is configured for external MCLR.
1
2
3
4 5
6
7
8
PIC12F609/
HV609
VSS
GP0/CIN+/ICSPDAT
GP1/CIN0-/ICSPCLK
GP2/T0CKI/INT/COUT
VDD
GP5/T1CKI/OSC1/CLKIN
GP4/CIN1-/T1G/OSC2/CLKOUT
GP3/MCLR/VPP
2010 Microchip Technology Inc. DS41302D-page 5
PIC12F609/615/617/12HV609/615
8-Pin Diagram, PIC12F615/617/HV615 (PDIP, SOIC, MSOP, DFN)
TABLE 2: PIC12F615/617/HV615 PIN SUMMARY (PDIP, SOIC, MSOP, DFN)
I/O Pin Analog Comparator
s Timer CCP Interrupts Pull-ups Basic
GP0 7 AN0 CIN+ — P1B IOC Y ICSPDAT
GP1 6 AN1 CIN0- — — IOC Y ICSPCLK/VREF
GP2 5 AN2 COUT T0CKI CCP1/P1A INT/IOC Y —
GP3(1) 4 — — T1G* — IOC Y(2) MCLR/VPP
GP4 3 AN3 CIN1- T1G P1B* IOC Y OSC2/CLKOUT
GP5 2 — — T1CKI P1A* IOC Y OSC1/CLKIN
— 1 — — — — — — VDD
— 8 — — — — — — VSS
* Alternate pin function.
Note 1: Input only.
2: Only when pin is configured for external MCLR.
1
2
3
4 5
6
7
8
PIC12F615/
617/HV615
VSS
GP0/AN0/CIN+/P1B/ICSPDAT
GP1/AN1/CIN0-/VREF/ICSPCLK
GP2/AN2/T0CKI/INT/COUT/CCP1/P1A
VDD
GP5/T1CKI/P1A*/OSC1/CLKIN
GP4/AN3/CIN1-/T1G/P1B*/OSC2/CLKOUT
GP3/T1G*/MCLR/VPP
* Alternate pin function.
PIC12F609/615/617/12HV609/615
DS41302D-page 6 2010 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ......................................................................................................................................................................... 7
2.0 Memory Organization ................................................................................................................................................................ 11
3.0 Flash Program Memory Self Read/Self Write Control (PIC12F617 only).................................................................................. 27
4.0 Oscillator Module ....................................................................................................................................................................... 37
5.0 I/O Port ...................................................................................................................................................................................... 43
6.0 Timer0 Module .......................................................................................................................................................................... 53
7.0 Timer1 Module with Gate Control .............................................................................................................................................. 57
8.0 Timer2 Module (PIC12F615/617/HV615 only) .......................................................................................................................... 65
9.0 Comparator Module ................................................................................................................................................................... 67
10.0 Analog-to-Digital Converter (ADC) Module (PIC12F615/617/HV615 only) ............................................................................... 79
11.0 Enhanced Capture/Compare/PWM (With Auto-Shutdown and Dead Band) Module (PIC12F615/617/HV615 only) ............... 89
12.0 Special Features of the CPU ................................................................................................................................................... 107
13.0 Voltage Regulator .................................................................................................................................................................... 127
14.0 Instruction Set Summary ........................................................................................................................................................ 129
15.0 Development Support ............................................................................................................................................................. 139
16.0 Electrical Specifications ........................................................................................................................................................... 143
17.0 DC and AC Characteristics Graphs and Tables ...................................................................................................................... 171
18.0 Packaging Information ............................................................................................................................................................ 195
Appendix A: Data Sheet Revision History ......................................................................................................................................... 203
Appendix B: Migrating from other PIC® Devices ............................................................................................................................... 203
Index ................................................................................................................................................................................................. 205
The Microchip Web Site .................................................................................................................................................................... 209
Customer Change Notification Service ............................................................................................................................................. 209
Customer Support ............................................................................................................................................................................. 209
Reader Response ............................................................................................................................................................................. 210
Product Identification System ............................................................................................................................................................ 211
Worldwide Sales and Service ........................................................................................................................................................... 212
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2010 Microchip Technology Inc. DS41302D-page 7
PIC12F609/615/617/12HV609/615
1.0 DEVICE OVERVIEW
The PIC12F609/615/617/12HV609/615 devices are
covered by this data sheet. They are available in 8-pin
PDIP, SOIC, MSOP and DFN packages.
Block Diagrams and pinout descriptions of the devices
are as follows:
• PIC12F609/HV609 (Figure 1-1, Table 1-1)
• PIC12F615/617/HV615 (Figure 1-2, Table 1-2)
FIGURE 1-1: PIC12F609/HV609 BLOCK DIAGRAM
Flash
Program
Memory
13
Data Bus
8
Program 14
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
GPIO
8
8
8
3
8-Level Stack 64 Bytes
1K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
GP0
GP1
GP2
GP3
GP4
GP5
Analog Comparator
T0CKI
INT
T1CKI
Configuration
Internal
Oscillator
and Reference
T1G
VDD
Block
CIN+
CIN0-
CIN1-
COUT
Comparator Voltage Reference
Absolute Voltage Reference
Shunt Regulator
(PIC12HV609 only)
PIC12F609/615/617/12HV609/615
DS41302D-page 8 2010 Microchip Technology Inc.
FIGURE 1-2: PIC12F615/617/HV615 BLOCK DIAGRAM
Flash
Program
Memory
13
Data Bus
8
Program 14
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
GPIO
8
8
8
3
8-Level Stack 64 Bytes and
1K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
GP0
GP1
GP2
GP3
GP4
GP5
Analog Comparator
T0CKI
INT
T1CKI
Configuration
Internal
Oscillator
VREF
and Reference
T1G
VDD
Timer2
Block
Shunt Regulator
(PIC12HV615 only)
Analog-To-Digital Converter
AN0
AN1
AN2
AN3
CIN+
CIN0-
CIN1-
COUT
ECCP
CCP1/P1A
P1B
P1A*
P1B*
Comparator Voltage Reference
Absolute Voltage Reference
* Alternate pin function.
** For the PIC12F617 only.
T1G*
2K X 14**
and
128 Bytes**
2010 Microchip Technology Inc. DS41302D-page 9
PIC12F609/615/617/12HV609/615
TABLE 1-1: PIC12F609/HV609 PINOUT DESCRIPTION
Name Function Input
Type
Output
Type Description
GP0/CIN+/ICSPDAT GP0 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN+ AN — Comparator non-inverting input
ICSPDAT ST CMOS Serial Programming Data I/O
GP1/CIN0-/ICSPCLK GP1 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN0- AN — Comparator inverting input
ICSPCLK ST — Serial Programming Clock
GP2/T0CKI/INT/COUT GP2 ST CMOS General purpose I/O with prog. pull-up and interrupt-on-change
T0CKI ST — Timer0 clock input
INT ST — External Interrupt
COUT — CMOS Comparator output
GP3/MCLR/VPP GP3 TTL — General purpose input with interrupt-on-change
MCLR ST — Master Clear w/internal pull-up
VPP HV — Programming voltage
GP4/CIN1-/T1G/OSC2/
CLKOUT
GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN1- AN — Comparator inverting input
T1G ST — Timer1 gate (count enable)
OSC2 — XTAL Crystal/Resonator
CLKOUT — CMOS FOSC/4 output
GP5/T1CKI/OSC1/CLKIN GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
T1CKI ST — Timer1 clock input
OSC1 XTAL — Crystal/Resonator
CLKIN ST — External clock input/RC oscillator connection
VDD VDD Power — Positive supply
VSS VSS Power — Ground reference
Legend: AN=Analog input or output CMOS= CMOS compatible input or output HV= High Voltage
ST=Schmitt Trigger input with CMOS levels TTL = TTL compatible input XTAL=Crystal
PIC12F609/615/617/12HV609/615
DS41302D-page 10 2010 Microchip Technology Inc.
TABLE 1-2: PIC12F615/617/HV615 PINOUT DESCRIPTION
Name Function Input
Type
Output
Type Description
GP0/AN0/CIN+/P1B/ICSPDAT GP0 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange
AN0 AN — A/D Channel 0 input
CIN+ AN — Comparator non-inverting input
P1B — CMOS PWM output
ICSPDAT ST CMOS Serial Programming Data I/O
GP1/AN1/CIN0-/VREF/ICSPCLK GP1 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange
AN1 AN — A/D Channel 1 input
CIN0- AN — Comparator inverting input
VREF AN — External Voltage Reference for A/D
ICSPCLK ST — Serial Programming Clock
GP2/AN2/T0CKI/INT/COUT/CCP1/
P1A
GP2 ST CMOS General purpose I/O with prog. pull-up and interrupt-onchange
AN2 AN — A/D Channel 2 input
T0CKI ST — Timer0 clock input
INT ST — External Interrupt
COUT — CMOS Comparator output
CCP1 ST CMOS Capture input/Compare input/PWM output
P1A — CMOS PWM output
GP3/T1G*/MCLR/VPP GP3 TTL — General purpose input with interrupt-on-change
T1G* ST — Timer1 gate (count enable), alternate pin
MCLR ST — Master Clear w/internal pull-up
VPP HV — Programming voltage
GP4/AN3/CIN1-/T1G/P1B*/OSC2/
CLKOUT
GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange
AN3 AN — A/D Channel 3 input
CIN1- AN — Comparator inverting input
T1G ST — Timer1 gate (count enable)
P1B* — CMOS PWM output, alternate pin
OSC2 — XTAL Crystal/Resonator
CLKOUT — CMOS FOSC/4 output
GP5/T1CKI/P1A*/OSC1/CLKIN GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange
T1CKI ST — Timer1 clock input
P1A* — CMOS PWM output, alternate pin
OSC1 XTAL — Crystal/Resonator
CLKIN ST — External clock input/RC oscillator connection
VDD VDD Power — Positive supply
VSS VSS Power — Ground reference
* Alternate pin function.
Legend: AN=Analog input or output CMOS=CMOS compatible input or output HV= High Voltage
ST=Schmitt Trigger input with CMOS levels TTL = TTL compatible input XTAL=Crystal
2010 Microchip Technology Inc. DS41302D-page 11
PIC12F609/615/617/12HV609/615
2.0 MEMORY ORGANIZATION
2.1 Program Memory Organization
The PIC12F609/615/617/12HV609/615 has a 13-bit
program counter capable of addressing an 8K x 14
program memory space. Only the first 1K x 14 (0000h-
03FFh) for the PIC12F609/615/12HV609/615 is
physically implemented. For the PIC12F617, the first
2K x 14 (0000h-07FFh) is physically implemented.
Accessing a location above these boundaries will
cause a wrap-around within the first 1K x 14 space for
PIC12F609/615/12HV609/615 devices, and within the
first 2K x 14 space for the PIC12F617 device. The
Reset vector is at 0000h and the interrupt vector is at
0004h (see Figure 2-1).
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC12F609/615/12HV609/615
FIGURE 2-2: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC12F617
2.2 Data Memory Organization
The data memory (see Figure 2-3) is partitioned into two
banks, which contain the General Purpose Registers
(GPR) and the Special Function Registers (SFR). The
Special Function Registers are located in the first 32
locations of each bank. Register locations 40h-7Fh in
Bank 0 are General Purpose Registers, implemented as
static RAM. For the PIC12F617, the register locations
20h-7Fh in Bank 0 and A0h-EFh in Bank 1 are general
purpose registers implemented as Static RAM. Register
locations F0h-FFh in Bank 1 point to addresses 70h-7Fh
in Bank 0. All other RAM is unimplemented and returns
‘0’ when read. The RP0 bit of the STATUS register is the
bank select bit.
RP0
0 Bank 0 is selected
1 Bank 1 is selected
PC<12:0>
13
0000h
0004h
0005h
03FFh
0400h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Wraps to 0000h-03FFh
Note: The IRP and RP1 bits of the STATUS
register are reserved and should always be
maintained as ‘0’s.
PC<12:0>
13
0000h
0004h
0005h
07FFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
On-Chip
Program
Memory
Wraps to 0000h-07FFh
0800h
1FFFh
PIC12F609/615/617/12HV609/615
DS41302D-page 12 2010 Microchip Technology Inc.
2.2.1 GENERAL PURPOSE REGISTER
FILE
The register file is organized as 64 x 8 in the
PIC12F609/615/12HV609/615, and as 128 x 8 in the
PIC12F617. Each register is accessed, either directly
or indirectly, through the File Select Register (FSR)
(see Section 2.4 “Indirect Addressing, INDF and
FSR Registers”).
2.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1). These
registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
associated with the “core” are described in this section.
Those related to the operation of the peripheral features
are described in the section of that peripheral feature.
FIGURE 2-3: DATA MEMORY MAP OF
THE PIC12F609/HV609
Indirect Addr.(1)
TMR0
PCL
STATUS
FSR
GPIO
PCLATH
INTCON
PIR1
TMR1L
TMR1H
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
7Fh
Bank 0
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
General
File
Address
File
Address
WPU
IOC
Indirect Addr.(1)
OPTION_REG
PCL
STATUS
FSR
TRISIO
PCLATH
INTCON
PIE1
PCON
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
FFh
Bank 1
ANSEL
Accesses 70h-7Fh F0h
VRCON
CMCON0
OSCTUNE
40h
3Fh
CMCON1
EFh
T1CON
Purpose
Registers
64 Bytes
Accesses 70h-7Fh
6Fh
70h
2010 Microchip Technology Inc. DS41302D-page 13
PIC12F609/615/617/12HV609/615
FIGURE 2-4: DATA MEMORY MAP OF
THE PIC12F615/617/HV615
Indirect Addr.(1)
TMR0
PCL
STATUS
FSR
GPIO
PCLATH
INTCON
PIR1
TMR1L
TMR1H
T1CON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
7Fh
Bank 0
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
2: Used for the PIC12F617 only.
File
Address
File
Address
WPU
IOC
Indirect Addr.(1)
OPTION_REG
PCL
STATUS
FSR
TRISIO
PCLATH
INTCON
PIE1
PCON
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
FFh
Bank 1
ADRESH
ADCON0
ADRESL
ANSEL
Accesses 70h-7Fh F0h
TMR2
T2CON
CCPR1L
CCPR1H
CCP1CON
PWM1CON
ECCPAS
VRCON
CMCON0
OSCTUNE
PR2
40h
3Fh
CMCON1
EFh
APFCON
General
Purpose
Registers
64 Bytes
Accesses 70h-7Fh
6Fh
70h
PMCON1 (2)
PMCON2 (2)
PMADRL (2)
PMADRH (2)
PMDATL (2)
PMDATH (2)
General
Purpose
Registers
96 Bytes from
20h-7Fh(2) Unimplemented for
PIC12F615/HV615
General
Purpose
Registers
32 Bytes(2)
Unimplemented for
PIC12F615/HV615
BFh
C0h
PIC12F609/615/617/12HV609/615
DS41302D-page 14 2010 Microchip Technology Inc.
TABLE 2-1: PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 115
01h TMR0 Timer0 Module’s Register xxxx xxxx 53, 115
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 115
03h STATUS IRP(1) RP1(1) RP0 TO PD Z DC C 0001 1xxx 18, 115
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 115
05h GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 43, 115
06h — Unimplemented — —
07h — Unimplemented — —
08h — Unimplemented — —
09h — Unimplemented — —
0Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 115
0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 20, 115
0Ch PIR1 — — — — CMIF — — TMR1IF ---- 0--0 22, 115
0Dh — Unimplemented — —
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 115
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 115
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 62, 115
11h — Unimplemented — —
12h — Unimplemented — —
13h — Unimplemented — —
14h — Unimplemented — —
15h — Unimplemented — —
16h — Unimplemented — —
17h — Unimplemented — —
18h — Unimplemented — —
19h VRCON CMVREN — VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 76, 116
1Ah CMCON0 CMON COUT CMOE CMPOL — CMR — CMCH 0000 -0-0 72, 116
1Bh — — — — —
1Ch CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 73, 116
1Dh — Unimplemented — —
1Eh — Unimplemented — —
1Fh — Unimplemented — —
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: Read only register.
2010 Microchip Technology Inc. DS41302D-page 15
PIC12F609/615/617/12HV609/615
TABLE 2-2: PIC12F615/617/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116
01h TMR0 Timer0 Module’s Register xxxx xxxx 53, 116
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 116
03h STATUS IRP(1) RP1(1) RP0 TO PD Z DC C 0001 1xxx 18, 116
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 116
05h GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 43, 116
06h — Unimplemented — —
07h — Unimplemented — —
08h — Unimplemented — —
09h — Unimplemented — —
0Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 116
0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 20, 116
0Ch PIR1 — ADIF CCP1IF — CMIF — TMR2IF TMR1IF -00- 0-00 22, 116
0Dh — Unimplemented — —
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 116
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 116
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 62, 116
11h TMR2(3) Timer2 Module Register 0000 0000 65, 116
12h T2CON(3) — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 66, 116
13h CCPR1L(3) Capture/Compare/PWM Register 1 Low Byte XXXX XXXX 90, 116
14h CCPR1H(3) Capture/Compare/PWM Register 1 High Byte XXXX XXXX 90, 116
15h CCP1CON(3) P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 89, 116
16h PWM1CON(3) PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 105,
116
17h ECCPAS(3) ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 102,
116
18h — Unimplemented — —
19h VRCON CMVREN — VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 76, 116
1Ah CMCON0 CMON COUT CMOE CMPOL — CMR — CMCH 0000 -0-0 72, 116
1Bh — — — — —
1Ch CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 73, 116
1Dh — Unimplemented — —
1Eh ADRESH(2, 3) Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx 85, 116
1Fh ADCON0(3) ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 84, 116
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: Read only register.
3: PIC12F615/617/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 16 2010 Microchip Technology Inc.
TABLE 2-3: PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116
81h OPTION_RE
G GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 19, 116
82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 116
83h STATUS IRP(1) RP1(1) RP0 TO PD Z DC C 0001 1xxx 18, 116
84h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 116
85h TRISIO — — TRISIO5 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 44, 116
86h — Unimplemented — —
87h — Unimplemented — —
88h — Unimplemented — —
89h — Unimplemented — —
8Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 116
8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 20, 116
8Ch PIE1 — — — — CMIE — — TMR1IE ---- 0--0 21, 116
8Dh — Unimplemented — —
8Eh PCON — — — — — — POR BOR ---- --qq 23, 116
8Fh — Unimplemented — —
90h OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 41, 116
91h — Unimplemented — —
92h — Unimplemented — —
93h — Unimplemented — —
94h — Unimplemented — —
95h WPU(2) — — WPU5 WPU4 — WPU2 WPU1 WPU0 --11 -111 46, 116
96h IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 46, 116
97h — Unimplemented — —
98h — Unimplemented — —
99h — Unimplemented — —
9Ah — Unimplemented — —
9Bh — Unimplemented — —
9Ch — Unimplemented — —
9Dh — Unimplemented — —
9Eh — Unimplemented — —
9Fh ANSEL — — — — ANS3 — ANS1 ANS0 ---- 1-11 45, 117
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: GP3 pull-up is enabled when MCLRE is ‘1’ in the Configuration Word register.
3: MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch
exists.
4: TRISIO3 always reads as ‘1’ since it is an input only pin.
2010 Microchip Technology Inc. DS41302D-page 17
PIC12F609/615/617/12HV609/615
TABLE 2-4: PIC12F615/617/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116
81h OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 19, 116
82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 116
83h STATUS IRP(1) RP1(1) RP0 TO PD Z DC C 0001 1xxx 18, 116
84h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 116
85h TRISIO — — TRISIO5 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 44, 116
86h — Unimplemented — —
87h — Unimplemented — —
88h — Unimplemented — —
89h — Unimplemented — —
8Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 116
8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 20, 116
8Ch PIE1 — ADIE CCP1IE — CMIE — TMR2IE TMR1IE -00- 0-00 21, 116
8Dh — Unimplemented — —
8Eh PCON — — — — — — POR BOR ---- --qq 23, 116
8Fh — Unimplemented — —
90h OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 41, 116
91h — Unimplemented — —
92h PR2 Timer2 Module Period Register 1111 1111 65, 116
93h APFCON — — — T1GSEL — — P1BSEL P1ASEL ---0 --00 21, 116
94h — Unimplemented — —
95h WPU(2) — — WPU5 WPU4 — WPU2 WPU1 WPU0 --11 -111 46, 116
96h IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 46, 116
97h — Unimplemented — —
98h PMCON1(7) — — — — — WREN WR RD ---- -000 29
99h PMCON2(7) Program Memory Control Register 2 (not a physical register). ---- ---- —
9Ah PMADRL(7) PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 28
9Bh PMADRH(7) — — — — — PMADRH2 PMADRH1 PMADRH0 ---- -000 28
9Ch PMDATL(7) PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 28
9Dh PMDATH(7) — — Program Memory Data Register High Byte. --00 0000 28
9Eh ADRESL(5, 6) Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result xxxx xxxx 85, 117
9Fh ANSEL — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 45, 117
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: GP3 pull-up is enabled when MCLRE is ‘1’ in the Configuration Word register.
3: MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch
exists.
4: TRISIO3 always reads as ‘1’ since it is an input only pin.
5: Read only register.
6: PIC12F615/617/HV615 only.
7: PIC12F617 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 18 2010 Microchip Technology Inc.
2.2.2.1 STATUS Register
The STATUS register, shown in Register 2-1, contains:
• the arithmetic status of the ALU
• the Reset status
• the bank select bits for data memory (RAM)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS, will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits, see the Section 14.0
“Instruction Set Summary”.
Note 1: Bits IRP and RP1 of the STATUS register
are not used by the PIC12F609/615/617/
12HV609/615 and should be maintained
as clear. Use of these bits is not recommended,
since this may affect upward
compatibility with future products.
2: The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction. See the SUBLW and SUBWF
instructions for examples.
REGISTER 2-1: STATUS: STATUS REGISTER
Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD Z DC C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IRP: This bit is reserved and should be maintained as ‘0’
bit 6 RP1: This bit is reserved and should be maintained as ‘0’
bit 5 RP0: Register Bank Select bit (used for direct addressing)
1 = Bank 1 (80h – FFh)
0 = Bank 0 (00h – 7Fh)
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is
reversed.
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
2010 Microchip Technology Inc. DS41302D-page 19
PIC12F609/615/617/12HV609/615
2.2.2.2 OPTION Register
The OPTION register is a readable and writable
register, which contains various control bits to
configure:
• Timer0/WDT prescaler
• External GP2/INT interrupt
• Timer0
• Weak pull-ups on GPIO
Note: To achieve a 1:1 prescaler assignment for
Timer0, assign the prescaler to the WDT
by setting PSA bit to ‘1’ of the OPTION
register. See Section 6.1.3 “Software
Programmable Prescaler”.
REGISTER 2-2: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GPPU: GPIO Pull-up Enable bit
1 = GPIO pull-ups are disabled
0 = GPIO pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of GP2/INT pin
0 = Interrupt on falling edge of GP2/INT pin
bit 5 T0CS: Timer0 Clock Source Select bit
1 = Transition on GP2/T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on GP2/T0CKI pin
0 = Increment on low-to-high transition on GP2/T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TIMER0 RATE WDT RATE
PIC12F609/615/617/12HV609/615
DS41302D-page 20 2010 Microchip Technology Inc.
2.2.2.3 INTCON Register
The INTCON register is a readable and writable
register, which contains the various enable and flag bits
for TMR0 register overflow, GPIO change and external
GP2/INT pin interrupts.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GIE PEIE T0IE INTE GPIE T0IF INTF GPIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 T0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: GP2/INT External Interrupt Enable bit
1 = Enables the GP2/INT external interrupt
0 = Disables the GP2/INT external interrupt
bit 3 GPIE: GPIO Change Interrupt Enable bit(1)
1 = Enables the GPIO change interrupt
0 = Disables the GPIO change interrupt
bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2)
1 = Timer0 register has overflowed (must be cleared in software)
0 = Timer0 register did not overflow
bit 1 INTF: GP2/INT External Interrupt Flag bit
1 = The GP2/INT external interrupt occurred (must be cleared in software)
0 = The GP2/INT external interrupt did not occur
bit 0 GPIF: GPIO Change Interrupt Flag bit
1 = When at least one of the GPIO <5:0> pins changed state (must be cleared in software)
0 = None of the GPIO <5:0> pins have changed state
Note 1: IOC register must also be enabled.
2: T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before
clearing T0IF bit.
2010 Microchip Technology Inc. DS41302D-page 21
PIC12F609/615/617/12HV609/615
2.2.2.4 PIE1 Register
The PIE1 register contains the Peripheral Interrupt
Enable bits, as shown in Register 2-4.
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
— ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit(1)
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 CCP1IE: CCP1 Interrupt Enable bit(1)
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 4 Unimplemented: Read as ‘0’
bit 3 CMIE: Comparator Interrupt Enable bit
1 = Enables the Comparator interrupt
0 = Disables the Comparator interrupt
bit 2 Unimplemented: Read as ‘0’
bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit(1)
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note 1: PIC12F615/617/HV615 only. PIC12F609/HV609 unimplemented, read as ‘0’.
PIC12F609/615/617/12HV609/615
DS41302D-page 22 2010 Microchip Technology Inc.
2.2.2.5 PIR1 Register
The PIR1 register contains the Peripheral Interrupt flag
bits, as shown in Register 2-5.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
REGISTER 2-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
— ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIF: A/D Interrupt Flag bit(1)
1 = A/D conversion complete
0 = A/D conversion has not completed or has not been started
bit 5 CCP1IF: CCP1 Interrupt Flag bit(1)
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode
bit 4 Unimplemented: Read as ‘0’
bit 3 CMIF: Comparator Interrupt Flag bit
1 = Comparator output has changed (must be cleared in software)
0 = Comparator output has not changed
bit 2 Unimplemented: Read as ‘0’
bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag bit(1)
1 = Timer2 to PR2 match occurred (must be cleared in software)
0 = Timer2 to PR2 match has not occurred
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Timer1 register overflowed (must be cleared in software)
0 = Timer1 has not overflowed
Note 1: PIC12F615/617/HV615 only. PIC12F609/HV609 unimplemented, read as ‘0’.
2010 Microchip Technology Inc. DS41302D-page 23
PIC12F609/615/617/12HV609/615
2.2.2.6 PCON Register
The Power Control (PCON) register (see Table 12-2)
contains flag bits to differentiate between a:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Watchdog Timer Reset (WDT)
• External MCLR Reset
The PCON register also controls the software enable of
the BOR.
The PCON register bits are shown in Register 2-6.
REGISTER 2-6: PCON: POWER CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0(1)
— — — — — — POR BOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Unimplemented: Read as ‘0’
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: Reads as ‘0’ if Brown-out Reset is disabled.
PIC12F609/615/617/12HV609/615
DS41302D-page 24 2010 Microchip Technology Inc.
2.2.2.7 APFCON Register
(PIC12F615/617/HV615 only)
The Alternate Pin Function Control (APFCON) register
is used to steer specific peripheral input and output
functions between different pins. For this device, the
P1A, P1B and Timer1 Gate functions can be moved
between different pins.
The APFCON register bits are shown in Register 2-7.
REGISTER 2-7: APFCON:ALTERNATE PIN FUNCTION REGISTER(1)
U-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
— — — T1GSEL — — P1BSEL P1ASEL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4 T1GSEL: TMR1 Input Pin Select bit
1 = T1G function is on GP3/T1G(2)/MCLR/VPP
0 = T1G function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT
bit 3-2 Unimplemented: Read as ‘0’
bit 1 P1BSEL: P1B Output Pin Select bit
1 = P1B function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT
0 = P1B function is on GP0/AN0/CIN+/P1B/ICSPDAT
bit 0 P1ASEL: P1A Output Pin Select bit
1 = P1A function is on GP5/T1CKI/P1A(2)/OSC1/CLKIN
0 = P1A function is on GP2/AN2/T0CKI/INT/COUT/CCP1/P1A
Note 1: PIC12F615/617/HV615 only.
2: Alternate pin function.
2010 Microchip Technology Inc. DS41302D-page 25
PIC12F609/615/617/12HV609/615
2.3 PCL and PCLATH
The Program Counter (PC) is 13 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<12:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 2-5 shows the two
situations for the loading of the PC. The upper example
in Figure 2-5 shows how the PC is loaded on a write to
PCL (PCLATH<4:0> PCH). The lower example in
Figure 2-5 shows how the PC is loaded during a CALL or
GOTO instruction (PCLATH<4:3> PCH).
FIGURE 2-5: LOADING OF PC IN
DIFFERENT SITUATIONS
2.3.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<12:8> bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
contents of the program counter to be changed by
writing the desired upper 5 bits to the PCLATH register.
When the lower 8 bits are written to the PCL register,
all 13 bits of the program counter will change to the
values contained in the PCLATH register and those
being written to the PCL register.
A computed GOTO is accomplished by adding an offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address rolls over from 0xFF to 0x00 in the middle of
the table, then PCLATH must be incremented for each
address rollover that occurs between the table
beginning and the target location within the table.
For more information refer to Application Note AN556,
“Implementing a Table Read” (DS00556).
2.3.2 STACK
The PIC12F609/615/617/12HV609/615 Family has an
8-level x 13-bit wide hardware stack (see Figure 2-1).
The stack space is not part of either program or data
space and the Stack Pointer is not readable or writable.
The PC is PUSHed onto the stack when a CALL
instruction is executed or an interrupt causes a branch.
The stack is POPed in the event of a RETURN, RETLW
or a RETFIE instruction execution. PCLATH is not
affected by a PUSH or POP operation.
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
2.4 Indirect Addressing, INDF and
FSR Registers
The INDF register is not a physical register. Addressing
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register
actually accesses data pointed to by the File Select
Register (FSR). Reading INDF itself indirectly will
produce 00h. Writing to the INDF register indirectly
results in a no operation (although Status bits may be
affected). An effective 9-bit address is obtained by
concatenating the 8-bit FSR and the IRP bit of the
STATUS register, as shown in Figure 2-6.
A simple program to clear RAM location 40h-7Fh using
indirect addressing is shown in Example 2-1.
EXAMPLE 2-1: INDIRECT ADDRESSING
PC
12 8 7 0
5
PCLATH<4:0>
PCLATH
Instruction with
ALU Result
GOTO, CALL
OPCODE <10:0>
8
PC
12 11 10 0
PCLATH<4:3> 11
PCH PCL
8 7
2
PCLATH
PCH PCL
PCL as
Destination
Note 1: There are no Status bits to indicate stack
overflow or stack underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interrupt address.
MOVLW 0x40 ;initialize pointer
MOVWF FSR ;to RAM
NEXT CLRF INDF ;clear INDF register
INCF FSR ;inc pointer
BTFSS FSR,7 ;all done?
GOTO NEXT ;no clear next
CONTINUE ;yes continue
PIC12F609/615/617/12HV609/615
DS41302D-page 26 2010 Microchip Technology Inc.
FIGURE 2-6: DIRECT/INDIRECT ADDRESSING PIC12F609/615/617/12HV609/615
Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear.
2: Accesses in this area are mirrored back into Bank 0 and Bank 1.
Data
Memory
Direct Addressing Indirect Addressing
Bank Select Location Select
RP1(1) RP0 6 From Opcode 0 IRP(1) 7 File Select Register 0
Bank Select Location Select
00 01 10 11
180h
1FFh
00h
7Fh
Bank 0 Bank 1 Bank 2 Bank 3
NOT USED(2)
For memory map detail, see Figure 2-3.
2010 Microchip Technology Inc. DS41302D-page 27
PIC12F609/615/617/12HV609/615
3.0 FLASH PROGRAM MEMORY
SELF READ/SELF WRITE
CONTROL (FOR PIC12F617
ONLY)
The Flash program memory is readable and writable
during normal operation (full VDD range). This memory
is not directly mapped in the register file space.
Instead, it is indirectly addressed through the Special
Function Registers (see Registers 3-1 to 3-5). There
are six SFRs used to read and write this memory:
• PMCON1
• PMCON2
• PMDATL
• PMDATH
• PMADRL
• PMADRH
When interfacing the program memory block, the
PMDATL and PMDATH registers form a two-byte word
which holds the 14-bit data for read/write, and the
PMADRL and PMADRH registers form a two-byte
word which holds the 13-bit address of the Flash location
being accessed. These devices have 2K words of
program Flash with an address range from 0000h to
07FFh.
The program memory allows single word read and a
by four word write. A four word write automatically
erases the row of the location and writes the new data
(erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range
of the device for byte or word operations.
When the device is code-protected, the CPU may
continue to read and write the Flash program memory.
Depending on the settings of the Flash Program
Memory Enable (WRT<1:0>) bits, the device may or
may not be able to write certain blocks of the program
memory, however, reads of the program memory are
allowed.
When the Flash program memory Code Protection
(CP) bit in the Configuration Word register is enabled,
the program memory is code-protected, and the
device programmer (ICSP™) cannot access data or
program memory.
3.1 PMADRH and PMADRL Registers
The PMADRH and PMADRL registers can address up
to a maximum of 8K words of program memory.
When selecting a program address value, the Most
Significant Byte (MSB) of the address is written to the
PMADRH register and the Least Significant Byte
(LSB) is written to the PMADRL register.
3.2 PMCON1 and PMCON2 Registers
PMCON1 is the control register for the data program
memory accesses.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental premature
termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear.
PMCON2 is not a physical register. Reading PMCON2
will read all ‘0’s. The PMCON2 register is used
exclusively in the Flash memory write sequence.
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DS41302D-page 28 2010 Microchip Technology Inc.
REGISTER 3-1: PMDATL: PROGRAM MEMORY DATA REGISTER
REGISTER 3-2: PMADRL: PROGRAM MEMORY ADDRESS REGISTER
REGISTER 3-3: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER
REGISTER 3-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PMDATL<7:0>: 8 Least Significant Address bits to Write or Read from Program Memory
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 PMDATH<5:0>: 6 Most Significant Data bits from Program Memory
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
— — — — — PMADRH2 PMADRH1 PMADRH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 3 Unimplemented: Read as ‘0’
bit 2-0 PMADRH<2:0>: Specifies the 3 Most Significant Address bits or high bits for program memory reads.
2010 Microchip Technology Inc. DS41302D-page 29
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REGISTER 3-5: PMCON1 – PROGRAM MEMORY CONTROL REGISTER 1 (ADDRESS: 93h)
U-1 U-0 U-0 U-0 U-0 R/W-0 R/S-0 R/S-0
— — — — — WREN WR RD
bit 7 bit 0
bit 7 Unimplemented: Read as ‘1’
bit 6-3 Unimplemented: Read as ‘0’
bit 2 WREN: Program Memory Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the EEPROM
bit 1 WR: Write Control bit
1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete. The
WR bit can only be set (not cleared) in software.)
0 = Write cycle to the Flash memory is complete
bit 0 RD: Read Control bit
1 = Initiates a program memory read (The read takes one cycle. The RD is cleared in hardware; the RD bit
can only be set (not cleared) in software).
0 = Does not initiate a Flash memory read
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR 1 = bit is set 0 = bit is cleared x = bit is unknown
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3.3 Reading the Flash Program
Memory
To read a program memory location, the user must
write two bytes of the address to the PMADRL and
PMADRH registers, and then set control bit RD
(PMCON1<0>). Once the read control bit is set, the
program memory Flash controller will use the second
instruction cycle after to read the data. This causes the
second instruction immediately following the “BSF
PMCON1,RD” instruction to be ignored. The data is
available in the very next cycle in the PMDATL and
PMDATH registers; it can be read as two bytes in the
following instructions. PMDATL and PMDATH registers
will hold this value until another read or until it is
written to by the user (during a write operation).
EXAMPLE 3-1: FLASH PROGRAM READ
BANKSEL PM_ADR ; Change STATUS bits RP1:0 to select bank with PMADRL
MOVLW MS_PROG_PM_ADDR ;
MOVWF PMADRH ; MS Byte of Program Address to read
MOVLW LS_PROG_PM_ADDR ;
MOVWF PMADRL ; LS Byte of Program Address to read
BANKSEL PMCON1 ; Bank to containing PMCON1
BSF PMCON1, RD ; PM Read
NOP ; First instruction after BSF PMCON1,RD executes normally
NOP ; Any instructions here are ignored as program
; memory is read in second cycle after BSF PMCON1,RD
;
BANKSEL PMDATL ; Bank to containing PMADRL
MOVF PMDATL, W ; W = LS Byte of Program PMDATL
MOVF PMDATH, W ; W = MS Byte of Program PMDATL
2010 Microchip Technology Inc. DS41302D-page 31
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FIGURE 3-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF PMCON1,RD
Executed here
INSTR (PC + 1)
Executed here
NOP
Executed here
Flash ADDR PC PC + 1 PMADRH,PMADRL PC+3 PC + 5
RD bit
INSTR (PC) PMDATH,PMDATL INSTR (PC + 3)
PC + 3 PC + 4
INSTR (PC + 1) INSTR (PC + 4)
INSTR (PC - 1)
Executed here
INSTR (PC + 3)
Executed here
INSTR (PC + 4)
Executed here
Flash DATA
PMDATH
PMDATL
Register
PMRHLT
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3.4 Writing the Flash Program
Memory
A word of the Flash program memory may only be
written to if the word is in an unprotected segment of
memory.
Flash program memory must be written in four-word
blocks. See Figure 3-2 and Figure 3-3 for more details.
A block consists of four words with sequential
addresses, with a lower boundary defined by an
address, where PMADRL<1:0> = 00. All block writes to
program memory are done as 16-word erase by fourword
write operations. The write operation is edgealigned
and cannot occur across boundaries.
To write program data, it must first be loaded into the
buffer registers (see Figure 3-2). This is accomplished
by first writing the destination address to PMADRL and
PMADRH and then writing the data to PMDATL and
PMDATH. After the address and data have been set
up, then the following sequence of events must be
executed:
1. Write 55h, then AAh, to PMCON2 (Flash
programming sequence).
2. Set the WR control bit of the PMCON1 register.
All four buffer register locations should be written to
with correct data. If less than four words are being
written to in the block of four words, then a read from
the program memory location(s) not being written to
must be performed. This takes the data from the
program location(s) not being written and loads it into
the PMDATL and PMDATH registers. Then the
sequence of events to transfer data to the buffer
registers must be executed.
To transfer data from the buffer registers to the program
memory, the PMADRL and PMADRH must point to the
last location in the four-word block (PMADRL<1:0> =
11). Then the following sequence of events must be
executed:
1. Write 55h, then AAh, to PMCON2 (Flash programming
sequence).
2. Set control bit WR of the PMCON1 register to
begin the write operation.
The user must follow the same specific sequence to
initiate the write for each word in the program block,
writing each program word in sequence (000, 001,
010, 011). When the write is performed on the last
word (PMADRL<1:0> = 11), a block of sixteen words is
automatically erased and the content of the four-word
buffer registers are written into the program memory.
After the “BSF PMCON1,WR” instruction, the processor
requires two cycles to set up the erase/write operation.
The user must place two NOP instructions after the WR
bit is set. Since data is being written to buffer registers,
the writing of the first three words of the block appears
to occur immediately. The processor will halt internal
operations for the typical 4 ms, only during the cycle in
which the erase takes place (i.e., the last word of the
sixteen-word block erase). This is not Sleep mode as
the clocks and peripherals will continue to run. After
the four-word write cycle, the processor will resume
operation with the third instruction after the PMCON1
write instruction. The above sequence must be
repeated for the higher 12 words.
3.5 Protection Against Spurious Write
There are conditions when the device should not write
to the program memory. To protect against spurious
writes, various mechanisms have been built in. On
power-up, WREN is cleared. Also, the Power-up Timer
(64 ms duration) prevents program memory writes.
The write initiate sequence and the WREN bit help
prevent an accidental write during brown-out, power
glitch or software malfunction.
3.6 Operation During Code-Protect
When the device is code-protected, the CPU is able to
read and write unscrambled data to the program
memory. The test mode access is disabled.
3.7 Operation During Write Protect
When the program memory is write-protected, the
CPU can read and execute from the program memory.
The portions of program memory that are write protected
can be modified by the CPU using the PMCON
registers, but the protected program memory cannot
be modified using ICSP mode.
2010 Microchip Technology Inc. DS41302D-page 33
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FIGURE 3-2: BLOCK WRITES TO 2K FLASH PROGRAM MEMORY
FIGURE 3-3: FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION
14 14 14 14
Program Memory
Buffer Register
PMADRL<1:0> = 00
Buffer Register
PMADRL<1:0> = 01
Buffer Register
PMADRL<1:0> = 10
Buffer Register
PMADRL<1:0> = 11
PMDATH PMDATL
7 5 0 7 0
6 8
First word of block
to be written
If at a new row
to Flash
automatically
after this word
is written
are transferred
Flash are erased,
then four buffers
sixteen words of
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF PMCON1,WR
Executed here
INSTR (PC + 1)
Executed here
Flash PC + 1
INSTR INSTR PMDATH,PMDATL INSTR (PC+3)
NOP
Executed here
Flash
Flash
PMWHLT
WR bit
Processor halted
PM Write Time
PMADRH,PMADRL PC + 3 PC + 4
INSTR (PC + 3)
Executed here
ADDR
DATA
Memory
Location
ignored
read
PC + 2
INSTR (PC+2)
(INSTR (PC + 2)
NOP
Executed here
(PC) (PC + 1)
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DS41302D-page 34 2010 Microchip Technology Inc.
An example of the complete four-word write sequence
is shown in Example 3-2. The initial address is loaded
into the PMADRH and PMADRL register pair; the eight
words of data are loaded using indirect addressing.
EXAMPLE 3-2: WRITING TO FLASH PROGRAM MEMORY
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; This write routine assumes the following:
; A valid starting address (the least significant bits = '00')
; is loaded in ADDRH:ADDRL
; ADDRH, ADDRL and DATADDR are all located in data memory
;
BANKSEL PMADRH
MOVF ADDRH,W ; Load initial address
MOVWF PMADRH ;
MOVF ADDRL,W ;
MOVWF PMADRL ;
MOVF DATAADDR,W ; Load initial data address
MOVWF FSR ;
LOOP MOVF INDF,W ; Load first data byte into lower
MOVWF PMDATL ;
INCF FSR,F ; Next byte
MOVF INDF,W ; Load second data byte into upper
MOVWF PMDATH ;
INCF FSR,F ;
BANKSEL PMCON1
BSF PMCON1,WREN ; Enable writes
BCF INTCON,GIE ; Disable interrupts (if using)
BTFSC INTCON,GIE ; See AN576
GOTO $-2
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; Required Sequence
MOVLW 55h ; Start of required write sequence:
MOVWF PMCON2 ; Write 55h
MOVLW 0AAh ;
MOVWF PMCON2 ; Write 0AAh
BSF PMCON1,WR ; Set WR bit to begin write
NOP ; Required to transfer data to the buffer
NOP ; registers
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
BCF PMCON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts (comment out if not using interrupts)
BANKSEL PMADRL
MOVF PMADRL, W
INCF PMADRL,F ; Increment address
ANDLW 0x03 ; Indicates when sixteen words have been programmed
SUBLW 0x03 ; 0x0F = 16 words
; 0x0B = 12 words
; 0x07 = 8 words
; 0x03 = 4 words
BTFSS STATUS,Z ; Exit on a match,
GOTO LOOP ; Continue if more data needs to be written
2010 Microchip Technology Inc. DS41302D-page 35
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TABLE 3-1: SUMMARY OF REGISTERS ASSOCIATED WITH PROGRAM MEMORY
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
PMCON1 — — — — — WREN WR RD ---- -000 ---- -000
PMCON2 Program Memory Control Register 2 (not a physical register) ---- ---- ---- ----
PMADRL PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 0000 0000
PMADRH — — — — — PMADRH2 PMADRH1 PMADRH0 ---- -000 ---- -000
PMDATL PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 0000 0000
PMDATH — — PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by Program Memory module.
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DS41302D-page 36 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 37
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4.0 OSCILLATOR MODULE
4.1 Overview
The Oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing performance
and minimizing power consumption. Figure 4-1
illustrates a block diagram of the Oscillator module.
Clock sources can be configured from external
oscillators, quartz crystal resonators, ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured with a choice of
two selectable speeds: internal or external system clock
source.
The Oscillator module can be configured in one of eight
clock modes.
3. EC – External clock with I/O on OSC2/CLKOUT.
4. LP – 32 kHz Low-Power Crystal mode.
5. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode.
6. HS – High Gain Crystal or Ceramic Resonator
mode.
7. RC – External Resistor-Capacitor (RC) with
FOSC/4 output on OSC2/CLKOUT.
8. RCIO – External Resistor-Capacitor (RC) with
I/O on OSC2/CLKOUT.
9. INTOSC – Internal oscillator with FOSC/4 output
on OSC2 and I/O on OSC1/CLKIN.
10. INTOSCIO – Internal oscillator with I/O on
OSC1/CLKIN and OSC2/CLKOUT.
Clock Source modes are configured by the FOSC<2:0>
bits in the Configuration Word register (CONFIG). The
Internal Oscillator module provides a selectable
system clock mode of either 4 MHz (Postscaler) or
8 MHz (INTOSC).
FIGURE 4-1: PIC® MCU CLOCK SOURCE BLOCK DIAGRAM
(CPU and Peripherals)
OSC1
OSC2
Sleep
External Oscillator
LP, XT, HS, RC, RCIO, EC
System Clock
MUX
FOSC<2:0>
(Configuration Word Register)
Internal Oscillator
INTOSC
8 MHz
Postscaler
4 MHz
INTOSC
IOSCFS<7>
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DS41302D-page 38 2010 Microchip Technology Inc.
4.2 Clock Source Modes
Clock Source modes can be classified as external or
internal.
• External Clock modes rely on external circuitry for
the clock source. Examples are: Oscillator modules
(EC mode), quartz crystal resonators or
ceramic resonators (LP, XT and HS modes) and
Resistor-Capacitor (RC) mode circuits.
• Internal clock sources are contained internally
within the Oscillator module. The Oscillator
module has two selectable clock frequencies:
4 MHz and 8 MHz
The system clock can be selected between external or
internal clock sources via the FOSC<2:0> bits of the
Configuration Word register.
4.3 External Clock Modes
4.3.1 OSCILLATOR START-UP TIMER
(OST)
If the Oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the Oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 4-1.
TABLE 4-1: OSCILLATOR DELAY EXAMPLES
4.3.2 EC MODE
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 4-2 shows the pin
connections for EC mode.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 4-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Switch From Switch To Frequency Oscillator Delay
Sleep/POR INTOSC 125 kHz to 8 MHz Oscillator Warm-Up Delay (TWARM)
Sleep/POR EC, RC DC – 20 MHz 2 instruction cycles
Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST)
OSC1/CLKIN
I/O OSC2/CLKOUT(1)
Clock from
Ext. System
PIC® MCU
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview”.
2010 Microchip Technology Inc. DS41302D-page 39
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4.3.3 LP, XT, HS MODES
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 4-3). The mode selects a low,
medium or high gain setting of the internal inverteramplifier
to support various resonator types and speed.
LP Oscillator mode selects the lowest gain setting of
the internal inverter-amplifier. LP mode current
consumption is the least of the three modes. This mode
is designed to drive only 32.768 kHz tuning-fork type
crystals (watch crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of
the internal inverter-amplifier. HS mode current
consumption is the highest of the three modes. This
mode is best suited for resonators that require a high
drive setting.
Figure 4-3 and Figure 4-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
FIGURE 4-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 4-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: Quartz crystal characteristics vary according
to type, package and manufacturer. The
user should consult the manufacturer data
sheets for specifications and recommended
application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator
OSC2/CLKOUT
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DS41302D-page 40 2010 Microchip Technology Inc.
4.3.4 EXTERNAL RC MODES
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
In RC mode, the RC circuit connects to OSC1. OSC2/
CLKOUT outputs the RC oscillator frequency divided
by 4. This signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements. Figure 4-5 shows the
external RC mode connections.
FIGURE 4-5: EXTERNAL RC MODES
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes an additional general purpose I/O pin.
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
4.4 Internal Clock Modes
The Oscillator module provides a selectable system
clock source of either 4 MHz or 8 MHz. The selectable
frequency is configured through the IOSCFS bit of the
Configuration Word.
The frequency of the internal oscillator can be trimmed
with a calibration value in the OSCTUNE register.
4.4.1 INTOSC AND INTOSCIO MODES
The INTOSC and INTOSCIO modes configure the
internal oscillators as the system clock source when
the device is programmed using the oscillator selection
or the FOSC<2:0> bits in the Configuration Word
register (CONFIG). See Section 12.0 “Special
Features of the CPU” for more information.
In INTOSC mode, OSC1/CLKIN is available for general
purpose I/O. OSC2/CLKOUT outputs the selected
internal oscillator frequency divided by 4. The CLKOUT
signal may be used to provide a clock for external
circuitry, synchronization, calibration, test or other
application requirements.
In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT
are available for general purpose I/O.
OSC2/CLKOUT(1)
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k REXT 100 k, <3V
3 k REXT 100 k, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Alternate pin functions are listed in
Section 1.0 “Device Overview”.
2: Output depends upon RC or RCIO Clock
mode.
I/O(2)
2010 Microchip Technology Inc. DS41302D-page 41
PIC12F609/615/617/12HV609/615
4.4.1.1 OSCTUNE Register
The oscillator is factory calibrated but can be adjusted
in software by writing to the OSCTUNE register
(Register 4-1).
The default value of the OSCTUNE register is ‘0’. The
value is a 5-bit two’s complement number.
When the OSCTUNE register is modified, the frequency
will begin shifting to the new frequency. Code execution
continues during this shift. There is no indication that the
shift has occurred.
TABLE 4-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
REGISTER 4-1: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4-0 TUN<4:0>: Frequency Tuning bits
01111 = Maximum frequency
01110 =
•••
00001 =
00000 = Oscillator module is running at the calibrated frequency.
11111 =
•••
10000 = Minimum frequency
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets(1)
CONFIG(2) IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — —
OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by oscillators.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: See Configuration Word register (Register 12-1) for operation of all register bits.
PIC12F609/615/617/12HV609/615
DS41302D-page 42 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 43
PIC12F609/615/617/12HV609/615
5.0 I/O PORT
There are as many as six general purpose I/O pins
available. Depending on which peripherals are enabled,
some or all of the pins may not be available as general
purpose I/O. In general, when a peripheral is enabled,
the associated pin may not be used as a general
purpose I/O pin.
5.1 GPIO and the TRISIO Registers
GPIO is a 6-bit wide port with 5 bidirectional and 1 inputonly
pin. The corresponding data direction register is
TRISIO (Register 5-2). Setting a TRISIO bit (= 1) will
make the corresponding GPIO pin an input (i.e., disable
the output driver). Clearing a TRISIO bit (= 0) will make
the corresponding GPIO pin an output (i.e., enables
output driver and puts the contents of the output latch on
the selected pin). The exception is GP3, which is input
only and its TRIS bit will always read as ‘1’. Example 5-
1 shows how to initialize GPIO.
Reading the GPIO register (Register 5-1) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch. GP3 reads ‘0’ when
MCLRE = 1.
The TRISIO register controls the direction of the
GPIO pins, even when they are being used as analog
inputs. The user must ensure the bits in the TRISIO
register are maintained set when using them as analog
inputs. I/O pins configured as analog input always read
‘0’.
EXAMPLE 5-1: INITIALIZING GPIO
Note: GPIO = PORTA
TRISIO = TRISA
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pins configured as analog inputs will
read ‘0’ and cannot generate an interrupt.
BANKSEL GPIO ;
CLRF GPIO ;Init GPIO
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O, ADC clock
;setting ‘don’t care’
MOVLW 0Ch ;Set GP<3:2> as inputs
MOVWF TRISIO ;and set GP<5:4,1:0>
;as outputs
REGISTER 5-1: GPIO: GPIO REGISTER
U-0 U-0 R/W-x R/W-x R-x R/W-x R/W-x R/W-x
— — GP5 GP4 GP3 GP2 GP1 GP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 GP<5:0>: GPIO I/O Pin bit
1 = GPIO pin is > VIH
0 = GPIO pin is < VIL
PIC12F609/615/617/12HV609/615
DS41302D-page 44 2010 Microchip Technology Inc.
5.2 Additional Pin Functions
Every GPIO pin on the PIC12F609/615/617/12HV609/
615 has an interrupt-on-change option and a weak pullup
option. The next three sections describe these
functions.
5.2.1 ANSEL REGISTER
The ANSEL register is used to configure the Input
mode of an I/O pin to analog. Setting the appropriate
ANSEL bit high will cause all digital reads on the pin to
be read as ‘0’ and allow analog functions on the pin to
operate correctly.
The state of the ANSEL bits has no affect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affected port.
5.2.2 WEAK PULL-UPS
Each of the GPIO pins, except GP3, has an individually
configurable internal weak pull-up. Control bits WPUx
enable or disable each pull-up. Refer to Register 5-5.
Each weak pull-up is automatically turned off when the
port pin is configured as an output. The pull-ups are
disabled on a Power-on Reset by the GPPU bit of the
OPTION register). A weak pull-up is automatically
enabled for GP3 when configured as MCLR and
disabled when GP3 is an I/O. There is no software
control of the MCLR pull-up.
5.2.3 INTERRUPT-ON-CHANGE
Each GPIO pin is individually configurable as an
interrupt-on-change pin. Control bits IOCx enable or
disable the interrupt function for each pin. Refer to
Register 5-6. The interrupt-on-change is disabled on a
Power-on Reset.
For enabled interrupt-on-change pins, the values are
compared with the old value latched on the last read of
GPIO. The ‘mismatch’ outputs of the last read are OR’d
together to set the GPIO Change Interrupt Flag bit
(GPIF) in the INTCON register (Register 2-3).
This interrupt can wake the device from Sleep. The
user, in the Interrupt Service Routine, clears the
interrupt by:
a) Any read of GPIO AND Clear flag bit GPIF. This
will end the mismatch condition;
OR
b) Any write of GPIO AND Clear flag bit GPIF will
end the mismatch condition;
A mismatch condition will continue to set flag bit GPIF.
Reading GPIO will end the mismatch condition and
allow flag bit GPIF to be cleared. The latch holding the
last read value is not affected by a MCLR nor BOR
Reset. After these resets, the GPIF flag will continue to
be set if a mismatch is present.
REGISTER 5-2: TRISIO: GPIO TRI-STATE REGISTER
U-0 U-0 R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1
— — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 TRISIO<5:0>: GPIO Tri-State Control bit
1 = GPIO pin configured as an input (tri-stated)
0 = GPIO pin configured as an output
Note 1: TRISIO<3> always reads ‘1’.
2: TRISIO<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
Note: If a change on the I/O pin should occur
when any GPIO operation is being
executed, then the GPIF interrupt flag may
not get set.
2010 Microchip Technology Inc. DS41302D-page 45
PIC12F609/615/617/12HV609/615
REGISTER 5-3: ANSEL: ANALOG SELECT REGISTER (PIC12F609/HV609)
U-0 U-0 U-0 U-0 R/W-1 U-0 R/W-1 R/W-1
— — — — ANS3 — ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as ‘0’
bit 3 ANS3: Analog Select Between Analog or Digital Function on Pin GP4
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 2 Unimplemented: Read as ‘0’
bit 1 ANS1: Analog Select Between Analog or Digital Function on Pin GP1
1 = Analog input. Pin is assigned as analog input.(1)
0 = Digital I/O. Pin is assigned to port or special function.
bit 0 ANS0: Analog Select Between Analog or Digital Function on Pin GP0
0 = Digital I/O. Pin is assigned to port or special function.
1 = Analog input. Pin is assigned as analog input.(1)
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-onchange
if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of
the voltage on the pin.
REGISTER 5-4: ANSEL: ANALOG SELECT REGISTER (PIC12F615/617/HV615)
U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits
000 = FOSC/2
001 = FOSC/8
010 = FOSC/32
x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max)
100 = FOSC/4
101 = FOSC/16
110 = FOSC/64
bit 3-0 ANS<3:0>: Analog Select Between Analog or Digital Function on Pins GP4, GP2, GP1, GP0, respectively.
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-onchange
if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of
the voltage on the pin.
PIC12F609/615/617/12HV609/615
DS41302D-page 46 2010 Microchip Technology Inc.
REGISTER 5-5: WPU: WEAK PULL-UP GPIO REGISTER
U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1
— — WPU5 WPU4 — WPU2 WPU1 WPU0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 WPU<5:4>: Weak Pull-up Control bits
1 = Pull-up enabled
0 = Pull-up disabled
bit 3 WPU<3>: Weak Pull-up Register bit(3)
bit 2-0 WPU<2:0>: Weak Pull-up Control bits
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global GPPU must be enabled for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in Output mode (TRISIO = 0).
3: The GP3 pull-up is enabled when configured as MCLR in the Configuration Word, otherwise it is disabled
as an input and reads as ‘0’.
4: WPU<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
REGISTER 5-6: IOC: INTERRUPT-ON-CHANGE GPIO REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOC<5:0>: Interrupt-on-change GPIO Control bit
1 = Interrupt-on-change enabled
0 = Interrupt-on-change disabled
Note 1: Global Interrupt Enable (GIE) must be enabled for individual interrupts to be recognized.
2: IOC<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
2010 Microchip Technology Inc. DS41302D-page 47
PIC12F609/615/617/12HV609/615
5.2.4 PIN DESCRIPTIONS AND
DIAGRAMS
Each GPIO pin is multiplexed with other functions. The
pins and their combined functions are briefly described
here. For specific information about individual functions
such as the Comparator or the ADC, refer to the
appropriate section in this data sheet.
5.2.4.1 GP0/AN0(1)/CIN+/P1B(1)/ICSPDAT
Figure 5-1 shows the diagram for this pin. The GP0 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(1)
• an analog non-inverting input to the comparator
• a PWM output(1)
• In-Circuit Serial Programming data
5.2.4.2 GP1/AN1(1)/CIN0-/VREF(1)/ICSPCLK
Figure 5-1 shows the diagram for this pin. The GP1 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(1)
• an analog inverting input to the comparator
• a voltage reference input for the ADC(1)
• In-Circuit Serial Programming clock
FIGURE 5-1: BLOCK DIAGRAM OF GP<1:0>
Note 1: PIC12F615/617/HV615 only.
VDD
VSS
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
VDD
D
EN
Q
D
EN
Q
Weak
RD GPIO
RD
WR
WR
RD
WR
IOC
RD
IOC
Interrupt-on-
To Comparator
Analog(1)
Input Mode
GPPU
Analog(1)
Input Mode
Change
Q1
WR
RD
WPU
Data Bus
WPU
GPIO
TRISIO
TRISIO
GPIO
Note 1: Comparator mode and ANSEL determines Analog Input mode.
2: Set has priority over Reset.
3: PIC12F615/617/HV615 only.
To A/D Converter(3)
I/O Pin
S(2)
R
Q
From other
GP<5:0> pins (GP0)
Write ‘0’ to GBIF
GP<5:2, 0> pins (GP1)
PIC12F609/615/617/12HV609/615
DS41302D-page 48 2010 Microchip Technology Inc.
5.2.4.3 GP2/AN2(1)/T0CKI/INT/COUT/
CCP1(1)/P1A(1)
Figure 5-2 shows the diagram for this pin. The GP2 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(1)
• the clock input for TMR0
• an external edge triggered interrupt
• a digital output from Comparator
• a Capture input/Compare input/PWM output(1)
• a PWM output(1)
FIGURE 5-2: BLOCK DIAGRAM OF GP2
Note 1: PIC12F615/617/HV615 only.
VDD
VSS
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
VDD
D
EN
Q
D
EN
Q
Weak
RD GPIO
RD
WR
WR
RD
WR
IOC
RD
IOC
Interrupt-on-
To INT
Analog(1)
Input Mode
GPPU
Analog(1)
Input Mode
Change
Q1
WR
RD
WPU
Data Bus
WPU
GPIO
TRISIO
TRISIO
GPIO
Note 1: Comparator mode and ANSEL determines Analog Input mode.
2: Set has priority over Reset.
3: PIC12F615/617/HV615 only.
To A/D Converter(3)
I/O Pin
S(2)
R
Q
From other
GP<5:3, 1:0> pins
Write ‘0’ to GBIF
0
C1OE 1
C1OE
Enable
To Timer0
2010 Microchip Technology Inc. DS41302D-page 49
PIC12F609/615/617/12HV609/615
5.2.4.4 GP3/T1G(1, 2)/MCLR/VPP
Figure 5-3 shows the diagram for this pin. The GP3 pin
is configurable to function as one of the following:
• a general purpose input
• a Timer1 gate (count enable), alternate pin(1, 2)
• as Master Clear Reset with weak pull-up
FIGURE 5-3: BLOCK DIAGRAM OF GP3
Note 1: Alternate pin function.
2: PIC12F615/617/HV615 only.
VSS
D
CK Q
Q
D
EN
Q
Data Bus
RD GPIO
RD
GPIO
WR
IOC
RD
IOC
Reset MCLRE
RD
TRISIO
VSS
D
EN
Q
MCLRE
VDD
MCLRE Weak
Q1
Input
Pin
Interrupt-on-
Change
S(1)
R
Q
From other
Write ‘0’ to GBIF
Note 1: Set has priority over Reset
GP<5:4, 2:0> pins
PIC12F609/615/617/12HV609/615
DS41302D-page 50 2010 Microchip Technology Inc.
5.2.4.5 GP4/AN3(2)/CIN1-/T1G/
P1B(1, 2)/OSC2/CLKOUT
Figure 5-4 shows the diagram for this pin. The GP4 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(2)
• Comparator inverting input
• a Timer1 gate (count enable)
• PWM output, alternate pin(1, 2)
• a crystal/resonator connection
• a clock output
FIGURE 5-4: BLOCK DIAGRAM OF GP4
Note 1: Alternate pin function.
2: PIC12F615/617/HV615 only.
VDD
VSS
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
VDD
D
EN
Q
D
EN
Q
Weak
Analog
Input Mode
Data Bus
WR
WPU
RD
WPU
RD
GPIO
WR
GPIO
WR
TRISIO
RD
TRISIO
WR
IOC
RD
IOC
FOSC/4
To A/D Converter(5)
Oscillator
Circuit
OSC1
CLKOUT
0
1
CLKOUT
Enable
Enable
Analog(3)
Input Mode
GPPU
RD GPIO
To T1G
INTOSC/
RC/EC(2)
CLK(1)
Modes
CLKOUT
Enable
Note 1: CLK modes are XT, HS, LP, TMR1 LP and CLKOUT Enable.
2: With CLKOUT option.
3: Analog Input mode comes from ANSEL.
4: Set has priority over Reset.
5: PIC12F615/617/HV615 only.
Q1
I/O Pin
Interrupt-on-
Change
S(4)
R
Q
From other
Write ‘0’ to GBIF
GP<5, 3:0> pins
2010 Microchip Technology Inc. DS41302D-page 51
PIC12F609/615/617/12HV609/615
5.2.4.6 GP5/T1CKI/P1A(1, 2)/OSC1/CLKIN
Figure 5-5 shows the diagram for this pin. The GP5 pin
is configurable to function as one of the following:
• a general purpose I/O
• a Timer1 clock input
• PWM output, alternate pin(1, 2)
• a crystal/resonator connection
• a clock input
FIGURE 5-5: BLOCK DIAGRAM OF GP5
Note 1: Alternate pin function.
2: PIC12F615/617/HV615 only.
VDD
VSS
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
D
CK Q
Q
VDD
D
EN
Q
D
EN
Q
Weak
Data Bus
WR
WPU
RD
WPU
RD
GPIO
WR
GPIO
WR
TRISIO
RD
TRISIO
WR
IOC
RD
IOC
To Timer1
INTOSC
Mode
RD GPIO
INTOSC
Mode
GPPU
OSC2
Note 1: Timer1 LP Oscillator enabled.
2: Set has priority over Reset.
TMR1LPEN(1)
Oscillator
Circuit
Q1
I/O Pin
Interrupt-on-
Change
S(2)
R
Q
From other
GP<4:0> pins
Write ‘0’ to GBIF
PIC12F609/615/617/12HV609/615
DS41302D-page 52 2010 Microchip Technology Inc.
TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH GPIO
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSEL — ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
CMCON0 CMON COUT CMOE CMPOL — CMR — CMCH 0000 -0-0 0000 -0-0
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --u0 u000
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
WPU — — WPU5 WPU4 WPU3 WPU2 WPU1 WPU0 --11 1111 --11 -111
T1CON T1GINV TMR1GE TICKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
CCP1CON(1) P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
APFCON(1) — — — T1GSEL — — P1BSEL P1ASEL ---0 --00 ---0 --00
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by GPIO.
Note 1: PIC12F615/617/HV615 only.
2010 Microchip Technology Inc. DS41302D-page 53
PIC12F609/615/617/12HV609/615
6.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
• 8-bit timer/counter register (TMR0)
• 8-bit prescaler (shared with Watchdog Timer)
• Programmable internal or external clock source
• Programmable external clock edge selection
• Interrupt on overflow
Figure 6-1 is a block diagram of the Timer0 module.
6.1 Timer0 Operation
When used as a timer, the Timer0 module can be used
as either an 8-bit timer or an 8-bit counter.
6.1.1 8-BIT TIMER MODE
When used as a timer, the Timer0 module will
increment every instruction cycle (without prescaler).
Timer mode is selected by clearing the T0CS bit of the
OPTION register to ‘0’.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
6.1.2 8-BIT COUNTER MODE
When used as a counter, the Timer0 module will
increment on every rising or falling edge of the T0CKI
pin. The incrementing edge is determined by the T0SE
bit of the OPTION register. Counter mode is selected by
setting the T0CS bit of the OPTION register to ‘1’.
FIGURE 6-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
Note: The value written to the TMR0 register can
be adjusted, in order to account for the two
instruction cycle delay when TMR0 is
written.
T0CKI
T0SE
pin
TMR0
Watchdog
Timer
WDT
Time-out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
2: WDTE bit is in the Configuration Word register.
0
1
0
1
0
1
8
8
8-bit
Prescaler
0
1
FOSC/4
PSA
PSA
PSA
Sync
2 TCY
PIC12F609/615/617/12HV609/615
DS41302D-page 54 2010 Microchip Technology Inc.
6.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available
for use with either Timer0 or the Watchdog Timer
(WDT), but not both simultaneously. The prescaler
assignment is controlled by the PSA bit of the OPTION
register. To assign the prescaler to Timer0, the PSA bit
must be cleared to a ‘0’.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
selectable via the PS<2:0> bits of the OPTION register.
In order to have a 1:1 prescaler value for the Timer0
module, the prescaler must be assigned to the WDT
module.
The prescaler is not readable or writable. When
assigned to the Timer0 module, all instructions writing to
the TMR0 register will clear the prescaler.
When the prescaler is assigned to WDT, a CLRWDT
instruction will clear the prescaler along with the WDT.
6.1.3.1 Switching Prescaler Between
Timer0 and WDT Modules
As a result of having the prescaler assigned to either
Timer0 or the WDT, it is possible to generate an
unintended device Reset when switching prescaler
values. When changing the prescaler assignment from
Timer0 to the WDT module, the instruction sequence
shown in Example 6-1, must be executed.
EXAMPLE 6-1: CHANGING PRESCALER
(TIMER0 WDT)
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be executed (see Example 6-2).
EXAMPLE 6-2: CHANGING PRESCALER
(WDT TIMER0)
6.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit of the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit must be
cleared in software. The Timer0 interrupt enable is the
T0IE bit of the INTCON register.
6.1.5 USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer0 is in Counter mode, the synchronization
of the T0CKI input and the Timer0 register is
accomplished by sampling the prescaler output on the
Q2 and Q4 cycles of the internal phase clocks.
Therefore, the high and low periods of the external
clock source must meet the timing requirements as
shown in Section 16.0 “Electrical Specifications”.
BANKSEL TMR0 ;
CLRWDT ;Clear WDT
CLRF TMR0 ;Clear TMR0 and
;prescaler
BANKSEL OPTION_REG ;
BSF OPTION_REG,PSA ;Select WDT
CLRWDT ;
;
MOVLW b’11111000’ ;Mask prescaler
ANDWF OPTION_REG,W ;bits
IORLW b’00000101’ ;Set WDT prescaler
MOVWF OPTION_REG ;to 1:32
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
CLRWDT ;Clear WDT and
;prescaler
BANKSEL OPTION_REG ;
MOVLW b’11110000’ ;Mask TMR0 select and
ANDWF OPTION_REG,W ;prescaler bits
IORLW b’00000011’ ;Set prescale to 1:16
MOVWF OPTION_REG ;
2010 Microchip Technology Inc. DS41302D-page 55
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TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 6-1: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GPPU: GPIO Pull-up Enable bit
1 = GPIO pull-ups are disabled
0 = GPIO pull-ups are enabled by individual PORT latch values in WPU register
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: TMR0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TMR0 RATE WDT RATE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0
module.
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NOTES:
2010 Microchip Technology Inc. DS41302D-page 57
PIC12F609/615/617/12HV609/615
7.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
• 16-bit timer/counter register pair (TMR1H:TMR1L)
• Programmable internal or external clock source
• 3-bit prescaler
• Optional LP oscillator
• Synchronous or asynchronous operation
• Timer1 gate (count enable) via comparator or
T1G pin
• Interrupt on overflow
• Wake-up on overflow (external clock,
Asynchronous mode only)
• Time base for the Capture/Compare function
• Special Event Trigger (with ECCP)
• Comparator output synchronization to Timer1
clock
Figure 7-1 is a block diagram of the Timer1 module.
7.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an internal clock source, the module is
a timer. When used with an external clock source, the
module can be used as either a timer or counter.
7.2 Clock Source Selection
The TMR1CS bit of the T1CON register is used to select
the clock source. When TMR1CS = 0, the clock source
is FOSC/4. When TMR1CS = 1, the clock source is
supplied externally.
Clock Source TMR1CS T1ACS
FOSC/4 0 0
FOSC 0 1
T1CKI pin 1 x
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FIGURE 7-1: TIMER1 BLOCK DIAGRAM
TMR1H TMR1L
Oscillator T1SYNC
T1CKPS<1:0>
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
1
0
0
1
Synchronized
clock input
2
Set flag bit
TMR1IF on
Overflow TMR1(2)
TMR1GE
TMR1ON
T1OSCEN
1
COUT 0
T1GSS
T1GINV
To Comparator Module
Timer1 Clock
TMR1CS
OSC2/T1G
OSC1/T1CKI
Note 1: ST Buffer is low power type when using LP oscillator, or high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
4: Alternate pin function.
5: PIC12F615/617/HV615 only.
(1)
EN
INTOSC
Without CLKOUT 1
0
T1ACS
FOSC
0
1
T1GSEL(2)
GP3/T1G(4, 5)
Synchronize(3)
det
2010 Microchip Technology Inc. DS41302D-page 59
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7.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of TCY as determined by the Timer1 prescaler.
7.2.2 EXTERNAL CLOCK SOURCE
When the external clock source is selected, the Timer1
module may work as a timer or a counter.
When counting, Timer1 is incremented on the rising
edge of the external clock input T1CKI. In addition, the
Counter mode clock can be synchronized to the
microcontroller system clock or run asynchronously.
If an external clock oscillator is needed (and the
microcontroller is using the INTOSC without CLKOUT),
Timer1 can use the LP oscillator as a clock source.
In Counter mode, a falling edge must be registered by
the counter prior to the first incrementing rising edge
after one or more of the following conditions:
• Timer1 is enabled after POR or BOR Reset
• A write to TMR1H or TMR1L
• T1CKI is high when Timer1 is disabled and when
Timer1 is re-enabled T1CKI is low. See Figure 7-2.
7.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
7.4 Timer1 Oscillator
A low-power 32.768 kHz crystal oscillator is built-in
between pins OSC1 (input) and OSC2 (output). The
oscillator is enabled by setting the T1OSCEN control
bit of the T1CON register. The oscillator will continue to
run during Sleep.
The Timer1 oscillator is shared with the system LP
oscillator. Thus, Timer1 can use this mode only when
the primary system clock is derived from the internal
oscillator or when in LP oscillator mode. The user must
provide a software time delay to ensure proper
oscillator start-up.
TRISIO5 and TRISIO4 bits are set when the Timer1
oscillator is enabled. GP5 and GP4 bits read as ‘0’ and
TRISIO5 and TRISIO4 bits read as ‘1’.
7.5 Timer1 Operation in
Asynchronous Counter Mode
If control bit T1SYNC of the T1CON register is set, the
external clock input is not synchronized. The timer
continues to increment asynchronous to the internal
phase clocks. The timer will continue to run during
Sleep and can generate an interrupt on overflow,
which will wake-up the processor. However, special
precautions in software are needed to read/write the
timer (see Section 7.5.1 “Reading and Writing
Timer1 in Asynchronous Counter Mode”).
7.5.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself poses certain problems, since the
timer may overflow between the reads.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write
contention may occur by writing to the timer registers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TTMR1L register
pair.
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to enabling Timer1.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce a single spurious
increment.
Note: In asynchronous counter mode or when
using the internal oscillator and T1ACS=1,
Timer1 can not be used as a time base for
the capture or compare modes of the
ECCP module (for PIC12F615/617/
HV615 only).
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7.6 Timer1 Gate
Timer1 gate source is software configurable to be the
T1G pin (or the alternate T1G pin) or the output of the
Comparator. This allows the device to directly time
external events using T1G or analog events using the
Comparator. See the CMCON1 Register (Register 9-2)
for selecting the Timer1 gate source. This feature can
simplify the software for a Delta-Sigma A/D converter
and many other applications. For more information on
Delta-Sigma A/D converters, see the Microchip web site
(www.microchip.com).
Timer1 gate can be inverted using the T1GINV bit of
the T1CON register, whether it originates from the T1G
pin or the Comparator output. This configures Timer1
to measure either the active-high or active-low time
between events.
7.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
• Timer1 interrupt enable bit of the PIE1 register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
7.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynchronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
• TMR1ON bit of the T1CON register must be set
• TMR1IE bit of the PIE1 register must be set
• PEIE bit of the INTCON register must be set
The device will wake-up on an overflow and execute
the next instruction. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine (0004h).
7.9 ECCP Capture/Compare Time
Base (PIC12F615/617/HV615 only)
The ECCP module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPR1H:CCPR1L
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPR1H:CCPR1L register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Special Event Trigger.
For more information, see Section 11.0 “Enhanced
Capture/Compare/PWM (With Auto-Shutdown and
Dead Band) Module (PIC12F615/617/HV615 only)”.
Note: TMR1GE bit of the T1CON register must
be set to use either T1G or COUT as the
Timer1 gate source. See Register 9-2 for
more information on selecting the Timer1
gate source.
Note: The TMR1H:TTMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
2010 Microchip Technology Inc. DS41302D-page 61
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7.10 ECCP Special Event Trigger
(PIC12F615/617/HV615 only)
If a ECCP is configured to trigger a special event, the
trigger will clear the TMR1H:TMR1L register pair. This
special event does not cause a Timer1 interrupt. The
ECCP module may still be configured to generate a
ECCP interrupt.
In this mode of operation, the CCPR1H:CCPR1L
register pair effectively becomes the period register for
Timer1.
Timer1 should be synchronized to the FOSC to utilize
the Special Event Trigger. Asynchronous operation of
Timer1 can cause a Special Event Trigger to be
missed.
In the event that a write to TMR1H or TMR1L coincides
with a Special Event Trigger from the ECCP, the write
will take precedence.
For more information, see Section 11.0 “Enhanced
Capture/Compare/PWM (With Auto-Shutdown and
Dead Band) Module (PIC12F615/617/HV615 only)”.
7.11 Comparator Synchronization
The same clock used to increment Timer1 can also be
used to synchronize the comparator output. This
feature is enabled in the Comparator module.
When using the comparator for Timer1 gate, the
comparator output should be synchronized to Timer1.
This ensures Timer1 does not miss an increment if the
comparator changes.
For more information, see Section 9.0 “Comparator
Module”.
FIGURE 7-2: TIMER1 INCREMENTING EDGE
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of
the clock.
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7.12 Timer1 Control Register
The Timer1 Control register (T1CON), shown in
Register 7-1, is used to control Timer1 and select the
various features of the Timer1 module.
REGISTER 7-1: T1CON: TIMER 1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T1GINV(1) TMR1GE(2) T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 T1GINV: Timer1 Gate Invert bit(1)
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 6 TMR1GE: Timer1 Gate Enable bit(2)
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 is on if Timer1 gate is active
0 = Timer1 is on
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale Value
10 = 1:4 Prescale Value
01 = 1:2 Prescale Value
00 = 1:1 Prescale Value
bit 3 T1OSCEN: LP Oscillator Enable Control bit
If INTOSC without CLKOUT oscillator is active:
1 = LP oscillator is enabled for Timer1 clock
0 = LP oscillator is off
For all other system clock modes:
This bit is ignored. LP oscillator is disabled.
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit
TMR1CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock
bit 1 TMR1CS: Timer1 Clock Source Select bit
1 = External clock from T1CKI pin (on the rising edge)
0 = Internal clock (FOSC/4) or system clock (FOSC)(3)
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1
Note 1: T1GINV bit inverts the Timer1 gate logic, regardless of source.
2: TMR1GE bit must be set to use either T1G pin or COUT, as selected by the T1GSS bit of the CMCON1
register, as a Timer1 gate source.
3: See T1ACS bit in CMCON1 register.
2010 Microchip Technology Inc. DS41302D-page 63
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TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
APFCON(1) — — — T1GSEL — — P1BSEL P1ASEL ---0 --00 ---0 --00
CMCON0 CMON COUT CMOE CMPOL — CMR — CMCH 0000 -0-0 0000 -0-0
CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 ---0 0-10
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
Note 1: PIC12F615/617/HV615 only.
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NOTES:
2010 Microchip Technology Inc. DS41302D-page 65
PIC12F609/615/617/12HV609/615
8.0 TIMER2 MODULE
(PIC12F615/617/HV615 ONLY)
The Timer2 module is an 8-bit timer with the following
features:
• 8-bit timer register (TMR2)
• 8-bit period register (PR2)
• Interrupt on TMR2 match with PR2
• Software programmable prescaler (1:1, 1:4, 1:16)
• Software programmable postscaler (1:1 to 1:16)
See Figure 8-1 for a block diagram of Timer2.
8.1 Timer2 Operation
The clock input to the Timer2 module is the system
instruction clock (FOSC/4). The clock is fed into the
Timer2 prescaler, which has prescale options of 1:1,
1:4 or 1:16. The output of the prescaler is then used to
increment the TMR2 register.
The values of TMR2 and PR2 are constantly compared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, two things happen:
• TMR2 is reset to 00h on the next increment cycle.
• The Timer2 postscaler is incremented
The match output of the Timer2/PR2 comparator is
then fed into the Timer2 postscaler. The postscaler has
postscale options of 1:1 to 1:16 inclusive. The output of
the Timer2 postscaler is used to set the TMR2IF
interrupt flag bit in the PIR1 register.
The TMR2 and PR2 registers are both fully readable
and writable. On any Reset, the TMR2 register is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Timer2 is turned off by clearing
the TMR2ON bit to a ‘0’.
The Timer2 prescaler is controlled by the T2CKPS bits
in the T2CON register. The Timer2 postscaler is
controlled by the TOUTPS bits in the T2CON register.
The prescaler and postscaler counters are cleared
when:
• A write to TMR2 occurs.
• A write to T2CON occurs.
• Any device Reset occurs (Power-on Reset, MCLR
Reset, Watchdog Timer Reset, or Brown-out
Reset).
FIGURE 8-1: TIMER2 BLOCK DIAGRAM
Note: TMR2 is not cleared when T2CON is
written.
Comparator
TMR2
Sets Flag
TMR2
Output
Reset
Postscaler
Prescaler
PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
EQ
4
bit TMR2IF
TOUTPS<3:0>
T2CKPS<1:0>
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TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
REGISTER 8-1: T2CON: TIMER 2 CONTROL REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits
0000 =1:1 Postscaler
0001 =1:2 Postscaler
0010 =1:3 Postscaler
0011 =1:4 Postscaler
0100 =1:5 Postscaler
0101 =1:6 Postscaler
0110 =1:7 Postscaler
0111 =1:8 Postscaler
1000 =1:9 Postscaler
1001 =1:10 Postscaler
1010 =1:11 Postscaler
1011 =1:12 Postscaler
1100 =1:13 Postscaler
1101 =1:14 Postscaler
1110 =1:15 Postscaler
1111 =1:16 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 =Prescaler is 1
01 =Prescaler is 4
1x =Prescaler is 16
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
PR2(1) Timer2 Module Period Register 1111 1111 1111 1111
TMR2(1) Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000
T2CON(1) — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module.
Note 1: For PIC12F615/617/HV615 only.
2010 Microchip Technology Inc. DS41302D-page 67
PIC12F609/615/617/12HV609/615
9.0 COMPARATOR MODULE
The comparator can be used to interface analog
circuits to a digital circuit by comparing two analog
voltages and providing a digital indication of their
relative magnitudes. The comparator is a very useful
mixed signal building block because it provides analog
functionality independent of the program execution.
The Analog Comparator module includes the following
features:
• Programmable input section
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
• Wake-up from Sleep
• PWM shutdown
• Timer1 gate (count enable)
• Output synchronization to Timer1 clock input
• Programmable voltage reference
• User-enable Comparator Hysteresis
9.1 Comparator Overview
The comparator is shown in Figure 9-1 along with the
relationship between the analog input levels and the
digital output. When the analog voltage at VIN+ is less
than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
FIGURE 9-1:SINGLE COMPARATOR
FIGURE 9-2: COMPARATOR SIMPLIFIED BLOCK DIAGRAM
–
VIN+ +
VINOutput
Output
VIN+
VINNote:
The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
CMOE
MUX
CMPOL
0
1
CMON(1)
CMCH
From Timer1
Clock
Note 1: When CMON = 0, the comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
4: Output shown for reference only. See I/O port pin diagram for more details.
D Q
EN
D Q
EN
CL
D Q
RD_CMCON0
Q3*RD_CMCON0
Q1
Set CMIF
To
Reset
CMVINCMVIN+
GP1/CIN0-
GP4/CIN1-
0
1
CMSYNC
CMPOL
Data Bus
MUX COUT(4)
To PWM Auto-Shutdown
To Timer1 Gate
0
1
CMR
MUX
GP0/CIN+
0
1
MUX
CVREF
CMVREN
FixedRef
CMVREF SYNCCMOUT
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9.2 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 9-3. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
A maximum source impedance of 10 k is
recommended for the analog sources. Also, any
external component connected to an analog input pin,
such as a capacitor or a Zener diode, should have very
little leakage current to minimize inaccuracies
introduced.
FIGURE 9-3: ANALOG INPUT MODEL
Note 1: When reading a GPIO register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
VA
RS < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE
±500 nA
VSS
AIN
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS = Source Impedance
VA = Analog Voltage
VT = Threshold Voltage
To Comparator
2010 Microchip Technology Inc. DS41302D-page 69
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9.3 Comparator Control
The comparator has two control and Configuration
registers: CMCON0 and CMCON1. The CMCON1
register is used for controlling the interaction with
Timer1 and simultaneously reading the comparator
output.
The CMCON0 register (Register 9-1) contain the
control and Status bits for the following:
• Enable
• Input selection
• Reference selection
• Output selection
• Output polarity
9.3.1 COMPARATOR ENABLE
Setting the CMON bit of the CMCON0 register enables
the comparator for operation. Clearing the CMON bit
disables the comparator for minimum current
consumption.
9.3.2 COMPARATOR INPUT SELECTION
The CMCH bit of the CMCON0 register directs one of
four analog input pins to the comparator inverting input.
9.3.3 COMPARATOR REFERENCE
SELECTION
Setting the CMR bit of the CMxCON0 register directs
an internal voltage reference or an analog input pin to
the non-inverting input of the comparator. See
Section 9.10 “Comparator Voltage Reference” for
more information on the internal voltage reference
module.
9.3.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the COUT bit of the CMCON0 register. In
order to make the output available for an external
connection, the following conditions must be true:
• CMOE bit of the CMxCON0 register must be set
• Corresponding TRIS bit must be cleared
• CMON bit of the CMCON0 register must be set.
9.3.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CMPOL bit of the CMCON0 register. Clearing
CMPOL results in a non-inverted output. A complete
table showing the output state versus input
conditions and the polarity bit is shown in Table 9-1.
TABLE 9-1: OUTPUT STATE VS. INPUT
CONDITIONS
9.4 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the comparator
differs from the settling time of the voltage reference.
Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See Section 16.0
“Electrical Specifications” for more details.
Note: To use CIN+ and CIN- pins as analog
inputs, the appropriate bits must be set in
the ANSEL register and the corresponding
TRIS bits must also be set to disable the
output drivers.
Note 1: The CMOE bit overrides the PORT data
latch. Setting the CMON has no impact
on the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
Input Conditions CMPOL COUT
CMVIN- > CMVIN+ 0 0
CMVIN- < CMVIN+ 0 1
CMVIN- > CMVIN+ 1 1
CMVIN- < CMVIN+ 1 0
Note: COUT refers to both the register bit and
output pin.
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9.5 Comparator Interrupt Operation
The comparator interrupt flag can be set whenever
there is a change in the output value of the comparator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an exclusiveor
gate (see Figure 9-4 and Figure 9-5). One latch is
updated with the comparator output level when the
CMCON0 register is read. This latch retains the value
until the next read of the CMCON0 register or the
occurrence of a Reset. The other latch of the mismatch
circuit is updated on every Q1 system clock. A
mismatch condition will occur when a comparator
output change is clocked through the second latch on
the Q1 clock cycle. At this point the two mismatch
latches have opposite output levels which is detected
by the exclusive-or gate and fed to the interrupt
circuitry. The mismatch condition persists until either
the CMCON0 register is read or the comparator output
returns to the previous state.
The comparator interrupt is set by the mismatch edge
and not the mismatch level. This means that the
interrupt flag can be reset without the additional step of
reading or writing the CMCON0 register to clear the
mismatch registers. When the mismatch registers are
cleared, an interrupt will occur upon the comparator’s
return to the previous state, otherwise no interrupt will
be generated.
Software will need to maintain information about the
status of the comparator output, as read from the
CMCON1 register, to determine the actual change that
has occurred.
The CMIF bit of the PIR1 register is the Comparator
Interrupt flag. This bit must be reset in software by
clearing it to ‘0’. Since it is also possible to write a '1' to
this register, an interrupt can be generated.
The CMIE bit of the PIE1 register and the PEIE and GIE
bits of the INTCON register must all be set to enable
comparator interrupts. If any of these bits are cleared,
the interrupt is not enabled, although the CMIF bit of
the PIR1 register will still be set if an interrupt condition
occurs.
FIGURE 9-4: COMPARATOR
INTERRUPT TIMING W/O
CMCON0 READ
FIGURE 9-5: COMPARATOR
INTERRUPT TIMING WITH
CMCON0 READ
Note 1: A write operation to the CMCON0 register
will also clear the mismatch condition
because all writes include a read
operation at the beginning of the write
cycle.
2: Comparator interrupts will operate
correctly regardless of the state of
CMOE. Note 1: If a change in the CMCON0 register
(COUT) should occur when a read
operation is being executed (start of the
Q2 cycle), then the CMIF of the PIR1
register interrupt flag may not get set.
2: When a comparator is first enabled, bias
circuitry in the comparator module may
cause an invalid output from the
comparator until the bias circuitry is
stable. Allow about 1 s for bias settling
then clear the mismatch condition and
interrupt flags before enabling
comparator interrupts.
Q1
Q3
CIN+
COUT
Set CMIF (edge)
CMIF
TRT
reset by software
Q1
Q3
CIN+
COUT
Set CMIF (edge)
CMIF
TRT
cleared by CMCON0 read reset by software
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9.6 Operation During Sleep
The comparator, if enabled before entering Sleep
mode, remains active during Sleep. The additional
current consumed by the comparator is shown
separately in the Section 16.0 “Electrical
Specifications”. If the comparator is not used to wake
the device, power consumption can be minimized while
in Sleep mode by turning off the comparator. The
comparator is turned off by clearing the CMON bit of the
CMCON0 register.
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the device from Sleep, the CMIE bit of the PIE1 register
and the PEIE bit of the INTCON register must be set.
The instruction following the SLEEP instruction always
executes following a wake from Sleep. If the GIE bit of
the INTCON register is also set, the device will then
execute the Interrupt Service Routine.
9.7 Effects of a Reset
A device Reset forces the CMCON1 register to its
Reset state. This sets the comparator and the voltage
reference to the OFF state.
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REGISTER 9-1: CMCON0: COMPARATOR CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0
CMON COUT CMOE CMPOL — CMR — CMCH
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CMON: Comparator Enable bit
1 = Comparator is enabled
0 = Comparator is disabled
bit 6 COUT: Comparator Output bit
If C1POL = 1 (inverted polarity):
COUT = 0 when CMVIN+ > CMVINCOUT
= 1 when CMVIN+ < CMVINIf
C1POL = 0 (non-inverted polarity):
COUT = 1 when CMVIN+ > CMVINCOUT
= 0 when CMVIN+ < CMVINbit
5 CMOE: Comparator Output Enable bit
1 = COUT is present on the COUT pin(1)
0 = COUT is internal only
bit 4 CMPOL: Comparator Output Polarity Select bit
1 = COUT logic is inverted
0 = COUT logic is not inverted
bit 3 Unimplemented: Read as ‘0’
bit 2 CMR: Comparator Reference Select bit (non-inverting input)
1 = CMVIN+ connects to CMVREF output
0 = CMVIN+ connects to CIN+ pin
bit 1 Unimplemented: Read as ‘0’
bit 0 CMCH: Comparator C1 Channel Select bit
0 = CMVIN- pin of the Comparator connects to CIN0-
1 = CMVIN- pin of the Comparator connects to CIN1-
Note 1: Comparator output requires the following three conditions: CMOE = 1, CMON = 1 and corresponding port
TRIS bit = 0.
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9.8 Comparator Gating Timer1
This feature can be used to time the duration or interval
of analog events. Clearing the T1GSS bit of the
CMCON1 register will enable Timer1 to increment
based on the output of the comparator. This requires
that Timer1 is on and gating is enabled. See
Section 7.0 “Timer1 Module with Gate Control” for
details.
It is recommended to synchronize the comparator with
Timer1 by setting the CMSYNC bit when the
comparator is used as the Timer1 gate source. This
ensures Timer1 does not miss an increment if the
comparator changes during an increment.
9.9 Synchronizing Comparator Output
to Timer1
The comparator output can be synchronized with
Timer1 by setting the CMSYNC bit of the CMCON1
register. When enabled, the comparator output is
latched on the falling edge of the Timer1 clock source.
If a prescaler is used with Timer1, the comparator
output is latched after the prescaling function. To
prevent a race condition, the comparator output is
latched on the falling edge of the Timer1 clock source
and Timer1 increments on the rising edge of its clock
source. See the Comparator Block Diagram (Figure 9-
2) and the Timer1 Block Diagram (Figure 7-1) for more
information.
REGISTER 9-2: CMCON1: COMPARATOR CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-1 R/W-0
— — — T1ACS CMHYS — T1GSS CMSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4 T1ACS: Timer1 Alternate Clock Select bit
1 = Timer 1 Clock Source is System Clock (FOSC)
0 = Timer 1 Clock Source is Instruction Clock (FOSC\4)
bit 3 CMHYS: Comparator Hysteresis Select bit
1 = Comparator Hysteresis enabled
0 = Comparator Hysteresis disabled
bit 2 Unimplemented: Read as ‘0’
bit 1 T1GSS: Timer1 Gate Source Select bit(1)
1 = Timer 1 Gate Source is T1G pin (pin should be configured as digital input)
0 = Timer 1 Gate Source is comparator output
bit 0 CMSYNC: Comparator Output Synchronization bit(2)
1 = Output is synchronized with falling edge of Timer1 clock
0 = Output is asynchronous
Note 1: Refer to Section 7.6 “Timer1 Gate”.
2: Refer to Figure 9-2.
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9.10 Comparator Voltage Reference
The Comparator Voltage Reference module provides
an internally generated voltage reference for the
comparators. The following features are available:
• Independent from Comparator operation
• 16-level voltage range
• Output clamped to VSS
• Ratiometric with VDD
• Fixed Reference (0.6)
The VRCON register (Register 9-3) controls the
Voltage Reference module shown in Register 9-6.
9.10.1 INDEPENDENT OPERATION
The comparator voltage reference is independent of
the comparator configuration. Setting the VREN bit of
the VRCON register will enable the voltage reference.
9.10.2 OUTPUT VOLTAGE SELECTION
The CVREF voltage reference has 2 ranges with 16
voltage levels in each range. Range selection is
controlled by the VRR bit of the VRCON register. The
16 levels are set with the VR<3:0> bits of the VRCON
register.
The CVREF output voltage is determined by the
following equations:
EQUATION 9-1: CVREF OUTPUT VOLTAGE
The full range of VSS to VDD cannot be realized due to
the construction of the module. See Figure 9-6.
9.10.3 OUTPUT CLAMPED TO VSS
The CVREF output voltage can be set to Vss with no
power consumption by configuring VRCON as follows:
• FVREN = 0
This allows the comparator to detect a zero-crossing
while not consuming additional CVREF module current.
9.10.4 OUTPUT RATIOMETRIC TO VDD
The comparator voltage reference is VDD derived and
therefore, the CVREF output changes with fluctuations in
VDD. The tested absolute accuracy of the Comparator
Voltage Reference can be found in Section 16.0
“Electrical Specifications”.
9.10.5 FIXED VOLTAGE REFERENCE
The fixed voltage reference is independent of VDD, with
a nominal output voltage of 0.6V. This reference can be
enabled by setting the FVREN bit of the VRCON
register to ‘1’. This reference is always enabled when
the HFINTOSC oscillator is active.
9.10.6 FIXED VOLTAGE REFERENCE
STABILIZATION PERIOD
When the Fixed Voltage Reference module is enabled,
it will require some time for the reference and its
amplifier circuits to stabilize. The user program must
include a small delay routine to allow the module to
settle. See Section 16.0 “Electrical Specifications”
for the minimum delay requirement.
9.10.7 VOLTAGE REFERENCE
SELECTION
Multiplexers on the output of the Voltage Reference
module enable selection of either the CVREF or fixed
voltage reference for use by the comparators.
Setting the CMVREN bit of the VRCON register
enables current to flow in the CVREF voltage divider
and selects the CVREF voltage for use by the Comparator.
Clearing the CMVREN bit selects the fixed voltage
for use by the Comparator.
When the CMVREN bit is cleared, current flow in the
CVREF voltage divider is disabled minimizing the power
drain of the voltage reference peripheral.
VRR = 1 (low range):
VRR = 0 (high range):
CVREF = (VDD/4) +
CVREF = (VR<3:0>/24) VDD
(VR<3:0> VDD/32)
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FIGURE 9-6: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
8R VRR
VR<3:0>(1)
Analog
8R R R R R
16 Stages
VDD
MUX
Fixed Voltage
CMVREN
CVREF(1)
Reference
EN
FVREN
Sleep
HFINTOSC enable
FixedRef 0.6V
To Comparators
and ADC Module
To Comparators
and ADC Module
Note 1: Care should be taken to ensure CVREF remains within the comparator common mode input range. See
Section 16.0 “Electrical Specifications” for more detail.
15
0
4
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REGISTER 9-3: VRCON: VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CMVREN — VRR FVREN VR3 VR2 VR1 VR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CMVREN: Comparator Voltage Reference Enable bit(1, 2)
1 = CVREF circuit powered on and routed to CVREF input of the Comparator
0 = 0.6 Volt constant reference routed to CVREF input of the Comparator
bit 6 Unimplemented: Read as ‘0’
bit 5 VRR: CVREF Range Selection bit
1 = Low range
0 = High range
bit 4 FVREN: 0.6V Reference Enable bit(2)
1 = Enabled
0 = Disabled
bit 3-0 VR<3:0>: Comparator Voltage Reference CVREF Value Selection bits (0 VR<3:0> 15)
When VRR = 1: CVREF = (VR<3:0>/24) * VDD
When VRR = 0: CVREF = VDD/4 + (VR<3:0>/32) * VDD
Note 1: When CMVREN is low, the CVREF circuit is powered down and does not contribute to IDD current.
2: When CMVREN is low and the FVREN bit is low, the CVREF signal should provide Vss to the comparator.
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9.11 Comparator Hysteresis
Each comparator has built-in hysteresis that is user
enabled by setting the CMHYS bit of the CMCON1
register. The hysteresis feature can help filter noise and
reduce multiple comparator output transitions when the
output is changing state.
Figure 9-7 shows the relationship between the analog
input levels and digital output of a comparator with and
without hysteresis. The output of the comparator
changes from a low state to a high state only when the
analog voltage at VIN+ rises above the upper
hysteresis threshold (VH+). The output of the
comparator changes from a high state to a low state
only when the analog voltage at VIN+ falls below the
lower hysteresis threshold (VH-).
FIGURE 9-7: COMPARATOR HYSTERESIS
–
VIN+ +
VINOutput
Note: The black areas of the comparator output represents the uncertainty due to input offsets and response time.
VHVH+
VINV+
VIN+
Output
(Without Hysteresis)
Output
(With Hysteresis)
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TABLE 9-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND
VOLTAGE REFERENCE MODULES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSEL — ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
CMCON0 CMON COUT CMOE CMPOL — CMR — CMCH 0000 -000 0000 -000
CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
VRCON CMVREN — VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 0-00 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used for comparator.
Note 1: For PIC12F615/617/HV615 only.
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10.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
(PIC12F615/617/HV615 ONLY)
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESL and ADRESH).
The ADC voltage reference is software selectable to
either VDD or a voltage applied to the external reference
pins.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
Figure 10-1 shows the block diagram of the ADC.
FIGURE 10-1: ADC BLOCK DIAGRAM
Note: The ADRESL and ADRESH registers are
Read Only.
GP0/AN0
A/D
GP1/AN1/VREF
GP2/AN2
CVREF
VDD
VREF
ADON
GO/DONE
VCFG = 1
VCFG = 0
CHS
VSS
0.6V Reference
1.2V Reference
GP4/AN3
ADRESH ADRESL
10
10
ADFM 0 = Left Justify
1 = Right Justify
000
001
010
011
100
101
110
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10.1 ADC Configuration
When configuring and using the ADC the following
functions must be considered:
• Port configuration
• Channel selection
• ADC voltage reference selection
• ADC conversion clock source
• Interrupt control
• Results formatting
10.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and digital
signals. When converting analog signals, the I/O pin
should be configured for analog by setting the associated
TRIS and ANSEL bits. See the corresponding port
section for more information.
10.1.2 CHANNEL SELECTION
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 10.2
“ADC Operation” for more information.
10.1.3 ADC VOLTAGE REFERENCE
The VCFG bit of the ADCON0 register provides control
of the positive voltage reference. The positive voltage
reference can be either VDD or an external voltage
source. The negative voltage reference is always
connected to the ground reference.
10.1.4 CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits of the ANSEL register.
There are seven possible clock options:
• FOSC/2
• FOSC/4
• FOSC/8
• FOSC/16
• FOSC/32
• FOSC/64
• FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One full 10-bit conversion requires 11 TAD periods
as shown in Figure 10-3.
For correct conversion, the appropriate TAD specification
must be met. See A/D conversion requirements in
Section 16.0 “Electrical Specifications” for more
information. Table 10-1 gives examples of appropriate
ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
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TABLE 10-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
FIGURE 10-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
10.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt flag is the ADIF bit in the
PIR1 register. The ADC interrupt enable is the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interrupt Service Routine.
Please see Section 10.1.5 “Interrupts” for more
information.
ADC Clock Period (TAD) Device Frequency (FOSC)
ADC Clock Source ADCS<2:0> 20 MHz 8 MHz 4 MHz 1 MHz
FOSC/2 000 100 ns(2) 250 ns(2) 500 ns(2) 2.0 s
FOSC/4 100 200 ns(2) 500 ns(2) 1.0 s(2) 4.0 s
FOSC/8 001 400 ns(2) 1.0 s(2) 2.0 s 8.0 s(3)
FOSC/16 101 800 ns(2) 2.0 s 4.0 s 16.0 s(3)
FOSC/32 010 1.6 s 4.0 s 8.0 s(3) 32.0 s(3)
FOSC/64 110 3.2 s 8.0 s(3) 16.0 s(3) 64.0 s(3)
FRC x11 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 4 s for VDD > 3.0V.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be performed during Sleep.
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9
Set GO/DONE bit
Holding Capacitor is Disconnected from Analog Input (typically 100 ns)
b9 b8 b7 b6 b5 b4 b3 b2
TAD10 TAD11
b1 b0
TCY to TAD
Conversion Starts
ADRESH and ADRESL registers are loaded,
GO bit is cleared,
ADIF bit is set,
Holding capacitor is connected to analog input
Note: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
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10.1.6 RESULT FORMATTING
The 10-bit A/D conversion result can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON0 register controls the output format.
Figure 10-4 shows the two output formats.
FIGURE 10-3: 10-BIT A/D CONVERSION RESULT FORMAT
10.2 ADC Operation
10.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digital conversion.
10.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF flag bit
• Update the ADRESH:ADRESL registers with new
conversion result
10.2.3 TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion. Additionally,
a 2 TAD delay is required before another acquisition
can be initiated. Following this delay, an input
acquisition is automatically started on the selected
channel.
10.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present
conversion to be aborted and the ADC module is
turned off, although the ADON bit remains set.
10.2.5 SPECIAL EVENT TRIGGER
The ECCP Special Event Trigger allows periodic ADC
measurements without software intervention. When
this trigger occurs, the GO/DONE bit is set by hardware
and the Timer1 counter resets to zero.
Using the Special Event Trigger does not assure
proper ADC timing. It is the user’s responsibility to
ensure that the ADC timing requirements are met.
See Section 11.0 “Enhanced Capture/Compare/
PWM (With Auto-Shutdown and Dead Band)
Module (PIC12F615/617/HV615 only)” for more
information.
ADRESH ADRESL
(ADFM = 0) MSB LSB
bit 7 bit 0 bit 7 bit 0
10-bit A/D Result Unimplemented: Read as ‘0’
(ADFM = 1) MSB LSB
bit 7 bit 0 bit 7 bit 0
Unimplemented: Read as ‘0’ 10-bit A/D Result
Note: The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 10.2.6 “A/D Conversion
Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
2010 Microchip Technology Inc. DS41302D-page 83
PIC12F609/615/617/12HV609/615
10.2.6 A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1. Configure Port:
• Disable pin output driver (See TRIS register)
• Configure pin as analog
2. Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Select result format
• Turn on ADC module
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result
8. Clear the ADC interrupt flag (required if interrupt
is enabled).
EXAMPLE 10-1: A/D CONVERSION
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: See Section 10.3 “A/D Acquisition
Requirements”.
;This code block configures the ADC
;for polling, Vdd reference, Frc clock
;and GP0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL TRISIO ;
BSF TRISIO,0 ;Set GP0 to input
BANKSEL ANSEL ;
MOVLW B’01110001’ ;ADC Frc clock,
IORWF ANSEL ; and GP0 as analog
BANKSEL ADCON0 ;
MOVLW B’10000001’ ;Right justify,
MOVWF ADCON0 ;Vdd Vref, AN0, On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,GO ;Start conversion
BTFSC ADCON0,GO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;Store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
PIC12F609/615/617/12HV609/615
DS41302D-page 84 2010 Microchip Technology Inc.
10.2.7 ADC REGISTER DEFINITIONS
The following registers are used to control the operation of the ADC.
REGISTER 10-1: ADCON0: A/D CONTROL REGISTER 0
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Conversion Result Format Select bit
1 = Right justified
0 = Left justified
bit 6 VCFG: Voltage Reference bit
1 = VREF pin
0 = VDD
bit 5 Unimplemented: Read as ‘0’
bit 4-2 CHS<2:0>: Analog Channel Select bits
000 = Channel 00 (AN0)
001 = Channel 01 (AN1)
010 = Channel 02 (AN2)
011 = Channel 03 (AN3)
100 = CVREF
101 = 0.6V Reference
110 = 1.2V Reference
111 = Reserved. Do not use.
bit 1 GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1: When the CHS<2:0> bits change to select the 1.2V or 0.6V reference, the reference output voltage will
have a transient. If the Comparator module uses this 0.6V reference voltage, the comparator output may
momentarily change state due to the transient.
2010 Microchip Technology Inc. DS41302D-page 85
PIC12F609/615/617/12HV609/615
REGISTER 10-2: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper 8 bits of 10-bit conversion result
REGISTER 10-3: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 (READ-ONLY)
R-x R-x U-0 U-0 U-0 U-0 U-0 U-0
ADRES1 ADRES0 — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower 2 bits of 10-bit conversion result
bit 5-0 Unimplemented: Read as ‘0’
REGISTER 10-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 (READ-ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x
— — — — — — ADRES9 ADRES8
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Unimplemented: Read as ‘0’
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper 2 bits of 10-bit conversion result
REGISTER 10-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower 8 bits of 10-bit conversion result
PIC12F609/615/617/12HV609/615
DS41302D-page 86 2010 Microchip Technology Inc.
10.3 A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 10-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the
capacitor CHOLD. The sampling switch (RSS) impedance
varies over the device voltage (VDD), see Figure 10-4.
The maximum recommended impedance for analog
sources is 10 k. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 10-1 may be used. This equation
assumes that 1/2 LSb error is used (1024 steps for the
ADC). The 1/2 LSb error is the maximum error allowed
for the ADC to meet its specified resolution.
EQUATION 10-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Capacitor Charging = + Time + Temperature Coefficient
= TAMP + TC + TCOFF
= 2μs + TC + Temperature - 25°C0.05μs/°C
TC = –CHOLDRIC + RSS + RS ln(1/2047)
= –10pF1k + 7k + 10k ln(0.0004885)
= 1.37μs
TACQ = 2μs + 1.37μs + 50°C- 25°C0.05μs/°C
= 4.67μs
VAPPLIED 1 e
–Tc
-R----C----
–
VAPPLIED 1 1
– -2---0---4---7-
=
VAPPLIED 1 1
– -2---0---4---7-
= VCHOLD
VAPPLIED 1 e
–TC
--R----C---
–
= VCHOLD
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Assumptions: Temperature = 50°C and external impedance of 10k 5.0V VDD
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
2010 Microchip Technology Inc. DS41302D-page 87
PIC12F609/615/617/12HV609/615
FIGURE 10-4: ANALOG INPUT MODEL
FIGURE 10-5: ADC TRANSFER FUNCTION
VA CPIN
Rs ANx
5 pF
VDD
VT = 0.6V
VT = 0.6V I LEAKAGE
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 10 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
5 6 7 8 91011
(k)
VDD
± 500 nA
Legend: CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
3FFh
3FEh
ADC Output Code
3FDh
3FCh
004h
003h
002h
001h
000h
Full-Scale
3FBh
1 LSB ideal
VSS/VREF- Zero-Scale
Transition
VDD/VREF+
Transition
1 LSB ideal
Full-Scale Range
Analog Input Voltage
PIC12F609/615/617/12HV609/615
DS41302D-page 88 2010 Microchip Technology Inc.
TABLE 10-2: SUMMARY OF ASSOCIATED ADC REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ADCON0(1) ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 00-0 0000
ANSEL — ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
ADRESH(1,2) A/D Result Register High Byte xxxx xxxx uuuu uuuu
ADRESL(1,2) A/D Result Register Low Byte xxxx xxxx uuuu uuuu
GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 --x0 x000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for ADC module.
Note 1: For PIC12F615/617/HV615 only.
2: Read Only Register.
2010 Microchip Technology Inc. DS41302D-page 89
PIC12F609/615/617/12HV609/615
11.0 ENHANCED CAPTURE/
COMPARE/PWM (WITH AUTOSHUTDOWN
AND DEAD BAND)
MODULE (PIC12F615/617/
HV615 ONLY)
The Enhanced Capture/Compare/PWM module is a
peripheral which allows the user to time and control
different events. In Capture mode, the peripheral
allows the timing of the duration of an event.The
Compare mode allows the user to trigger an external
event when a predetermined amount of time has
expired. The PWM mode can generate a Pulse-Width
Modulated signal of varying frequency and duty cycle.
Table 11-1 shows the timer resources required by the
ECCP module.
TABLE 11-1: ECCP MODE – TIMER
RESOURCES REQUIRED
ECCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
REGISTER 11-1: CCP1CON: ENHANCED CCP1 CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 P1M: PWM Output Configuration bits
If CCP1M<3:2> = 00, 01, 10:
x = P1A assigned as Capture/Compare input; P1B assigned as port pins
If CCP1M<3:2> = 11:
0 = Single output; P1A modulated; P1B assigned as port pins
1 = Half-Bridge output; P1A, P1B modulated with dead-band control
bit 6 Unimplemented: Read as ‘0’
bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M<3:0>: ECCP Mode Select bits
0000 =Capture/Compare/PWM off (resets ECCP module)
0001 =Unused (reserved)
0010 =Compare mode, toggle output on match (CCP1IF bit is set)
0011 =Unused (reserved)
0100 =Capture mode, every falling edge
0101 =Capture mode, every rising edge
0110 =Capture mode, every 4th rising edge
0111 =Capture mode, every 16th rising edge
1000 =Compare mode, set output on match (CCP1IF bit is set)
1001 =Compare mode, clear output on match (CCP1IF bit is set)
1010 =Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected)
1011 =Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 or TMR2 and starts
an A/D conversion, if the ADC module is enabled)
1100 =PWM mode; P1A active-high; P1B active-high
1101 =PWM mode; P1A active-high; P1B active-low
1110 =PWM mode; P1A active-low; P1B active-high
1111 =PWM mode; P1A active-low; P1B active-low
PIC12F609/615/617/12HV609/615
DS41302D-page 90 2010 Microchip Technology Inc.
11.1 Capture Mode
In Capture mode, CCPR1H:CCPR1L captures the
16-bit value of the TMR1 register when an event occurs
on pin CCP1. An event is defined as one of the
following and is configured by the CCP1M<3:0> bits of
the CCP1CON register:
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
When a capture is made, the Interrupt Request Flag bit
CCP1IF of the PIR1 register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPR1H, CCPR1L register pair
is read, the old captured value is overwritten by the new
captured value (see Figure 11-1).
11.1.1 CCP1 PIN CONFIGURATION
In Capture mode, the CCP1 pin should be configured
as an input by setting the associated TRIS control bit.
FIGURE 11-1: CAPTURE MODE
OPERATION BLOCK
DIAGRAM
11.1.2 TIMER1 MODE SELECTION
Timer1 must be running in Timer mode or Synchronized
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
11.1.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCP1IE interrupt enable bit of the PIE1 register clear to
avoid false interrupts. Additionally, the user should
clear the CCP1IF interrupt flag bit of the PIR1 register
following any change in operating mode.
11.1.4 CCP PRESCALER
There are four prescaler settings specified by the
CCP1M<3:0> bits of the CCP1CON register.
Whenever the CCP module is turned off, or the CCP
module is not in Capture mode, the prescaler counter
is cleared. Any Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCP1CON register before changing the
prescaler (see Example 11-1).
EXAMPLE 11-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If the CCP1 pin is configured as an output,
a write to the port can cause a capture
condition.
CCPR1H CCPR1L
TMR1H TMR1L
Set Flag bit CCP1IF
(PIR1 register)
Capture
Enable
CCP1CON<3:0>
Prescaler
1, 4, 16
and
Edge Detect
pin
CCP1
System Clock (FOSC)
BANKSEL CCP1CON ;Set Bank bits to point
;to CCP1CON
CLRF CCP1CON ;Turn CCP module off
MOVLW NEW_CAPT_PS ;Load the W reg with
; the new prescaler
; move value and CCP ON
MOVWF CCP1CON ;Load CCP1CON with this
; value
2010 Microchip Technology Inc. DS41302D-page 91
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TABLE 11-2: SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Capture.
Note 1: For PIC12F615/617/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 92 2010 Microchip Technology Inc.
11.2 Compare Mode
In Compare mode, the 16-bit CCPR1 register value is
constantly compared against the TMR1 register pair
value. When a match occurs, the CCP1 module may:
• Toggle the CCP1 output.
• Set the CCP1 output.
• Clear the CCP1 output.
• Generate a Special Event Trigger.
• Generate a Software Interrupt.
The action on the pin is based on the value of the
CCP1M<3:0> control bits of the CCP1CON register.
All Compare modes can generate an interrupt.
FIGURE 11-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
11.2.1 CCP1 PIN CONFIGURATION
The user must configure the CCP1 pin as an output by
clearing the associated TRIS bit.
11.2.2 TIMER1 MODE SELECTION
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
11.2.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCP1M<3:0> = 1010), the CCP1 module does not
assert control of the CCP1 pin (see the CCP1CON
register).
11.2.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCP1M<3:0> = 1011), the CCP1 module does the
following:
• Resets Timer1
• Starts an ADC conversion if ADC is enabled
The CCP1 module does not assert control of the CCP1
pin in this mode (see the CCP1CON register).
The Special Event Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPR1H, CCPR1L
register pair. The TMR1H, TMR1L register pair is not
reset until the next rising edge of the Timer1 clock. This
allows the CCPR1H, CCPR1L register pair to
effectively provide a 16-bit programmable period
register for Timer1.
Note: Clearing the CCP1CON register will force
the CCP1 compare output latch to the
default low level. This is not the PORT I/O
data latch.
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
Q S
R
Output
Logic
Special Event Trigger
Set CCP1IF Interrupt Flag
(PIR1)
Match
TRIS
CCP1CON<3:0>
Mode Select
Output Enable
Pin
Special Event Trigger will:
• Clear TMR1H and TMR1L registers.
• NOT set interrupt flag bit TMR1IF of the PIR1 register.
• Set the GO/DONE bit to start the ADC conversion.
CCP1 4
Note 1: The Special Event Trigger from the CCP
module does not set interrupt flag bit
TMRxIF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPR1H
and CCPR1L register pair, between the
clock edge that generates the Special
Event Trigger and the clock edge that
generates the Timer1 Reset, will preclude
the Reset from occurring.
2010 Microchip Technology Inc. DS41302D-page 93
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TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR2 Timer2 Module Register 0000 0000 0000 0000
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Compare.
Note 1: For PIC12F615/617/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 94 2010 Microchip Technology Inc.
11.3 PWM Mode
The PWM mode generates a Pulse-Width Modulated
signal on the CCP1 pin. The duty cycle, period and
resolution are determined by the following registers:
• PR2
• T2CON
• CCPR1L
• CCP1CON
In Pulse-Width Modulation (PWM) mode, the CCP
module produces up to a 10-bit resolution PWM output
on the CCP1 pin. Since the CCP1 pin is multiplexed
with the PORT data latch, the TRIS for that pin must be
cleared to enable the CCP1 pin output driver.
Figure 11-3 shows a simplified block diagram of PWM
operation.
Figure 11-4 shows a typical waveform of the PWM
signal.
For a step-by-step procedure on how to set up the CCP
module for PWM operation, see Section 11.3.7
“Setup for PWM Operation”.
FIGURE 11-3: SIMPLIFIED PWM BLOCK
DIAGRAM
The PWM output (Figure 11-4) has a time base
(period) and a time that the output stays high (duty
cycle).
FIGURE 11-4: CCP PWM OUTPUT
Note: Clearing the CCP1CON register will
relinquish CCP1 control of the CCP1 pin.
CCPR1L
CCPR1H(2) (Slave)
Comparator
TMR2
PR2
(1)
R Q
S
Duty Cycle Registers
CCP1CON<5:4>
Clear Timer2,
toggle CCP1 pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler, to create the 10-bit time
base.
2: In PWM mode, CCPR1H is a read-only register.
TRIS
CCP1
Comparator
Period
Pulse Width
TMR2 = 0
TMR2 = CCPRxL:CCPxCON<5:4>
TMR2 = PR2
2010 Microchip Technology Inc. DS41302D-page 95
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11.3.1 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 11-1.
EQUATION 11-1: PWM PERIOD
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
• TMR2 is cleared
• The CCP1 pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
• The PWM duty cycle is latched from CCPR1L into
CCPR1H.
11.3.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPR1L register and
DC1B<1:0> bits of the CCP1CON register. The
CCPR1L contains the eight MSbs and the DC1B<1:0>
bits of the CCP1CON register contain the two LSbs.
CCPR1L and DC1B<1:0> bits of the CCP1CON
register can be written to at any time. The duty cycle
value is not latched into CCPR1H until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPR1H
register is read-only.
Equation 11-2 is used to calculate the PWM pulse
width.
Equation 11-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 11-2: PULSE WIDTH
EQUATION 11-3: DUTY CYCLE RATIO
The CCPR1H register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler, to create the 10-bit time base. The system
clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPR1H and
2-bit latch, then the CCP1 pin is cleared (see Figure 11-
3).
11.3.3 PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 11-4.
EQUATION 11-4: PWM RESOLUTION
TABLE 11-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 11-5: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: The Timer2 postscaler (see Section 8.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
PWM Period = PR2 + 1 4 TOSC
(TMR2 Prescale Value)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Pulse Width = CCPR1L:CCP1CON<5:4>
TOSC (TMR2 Prescale Value)
Duty Cycle Ratio CCPR1L:CCP1CON<5:4>
4PR2 + 1 = -----------------------------------------------------------------------
Resolution log4PR2 + 1
log2
= ------------------------------------------ bits
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
PIC12F609/615/617/12HV609/615
DS41302D-page 96 2010 Microchip Technology Inc.
11.3.4 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the CCP1
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMR2 will continue from its
previous state.
11.3.5 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 4.0 “Oscillator Module” for additional
details.
11.3.6 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
11.3.7 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Disable the PWM pin (CCP1) output drivers by
setting the associated TRIS bit.
2. Set the PWM period by loading the PR2 register.
3. Configure the CCP module for the PWM mode
by loading the CCP1CON register with the
appropriate values.
4. Set the PWM duty cycle by loading the CCPR1L
register and DC1B bits of the CCP1CON register.
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the PIR1
register.
• Set the Timer2 prescale value by loading the
T2CKPS bits of the T2CON register.
• Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
6. Enable PWM output after a new PWM cycle has
started:
• Wait until Timer2 overflows (TMR2IF bit of the
PIR1 register is set).
• Enable the CCP1 pin output driver by clearing
the associated TRIS bit.
2010 Microchip Technology Inc. DS41302D-page 97
PIC12F609/615/617/12HV609/615
11.4 PWM (Enhanced Mode)
The Enhanced PWM Mode can generate a PWM signal
on up to four different output pins with up to 10-bits of
resolution. It can do this through four different PWM
output modes:
• Single PWM
• Half-Bridge PWM
To select an Enhanced PWM mode, the P1M bits of the
CCP1CON register must be set appropriately.
The PWM outputs are multiplexed with I/O pins and are
designated P1A and P1B. The polarity of the PWM pins
is configurable and is selected by setting the CCP1M
bits in the CCP1CON register appropriately.
Table 11-6 shows the pin assignments for each
Enhanced PWM mode.
Figure 11-5 shows an example of a simplified block
diagram of the Enhanced PWM module.
FIGURE 11-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE
TABLE 11-6: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
Note: To prevent the generation of an
incomplete waveform when the PWM is
first enabled, the ECCP module waits until
the start of a new PWM period before
generating a PWM signal.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(1)
R Q
S
Duty Cycle Registers
CCP1<1:0>
Clear Timer2,
toggle PWM pin and
latch duty cycle
* Alternate pin function.
Note 1: The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base.
TRISIO2
CCP1/P1A
Output
Controller
P1M<1:0>
2
CCP1M<3:0>
4
PWM1CON
CCP1/P1A
P1B
0
1
TRISIO5
CCP1/P1A*
P1ASEL
(APFCON<0>)
TRISIO0
0 P1B
1
TRISIO4
P1B*
P1BSEL
(APFCON<1>)
Note 1: The TRIS register value for each PWM output must be configured appropriately.
2: Clearing the CCP1CON register will relinquish ECCP control of all PWM output pins.
3: Any pin not used by an Enhanced PWM mode is available for alternate pin functions.
ECCP Mode P1M<1:0> CCP1/P1A P1B
Single 00 Yes(1) Yes(1)
Half-Bridge 10 Yes Yes
PIC12F609/615/617/12HV609/615
DS41302D-page 98 2010 Microchip Technology Inc.
FIGURE 11-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
FIGURE 11-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
0
Period
00
10
Signal
PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inactive
P1D Modulated
Pulse
Width
(Single Output)
(Half-Bridge)
Delay(1) Delay(1)
Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.4.6 “Programmable Dead-Band Delay
mode”).
0
Period
00
10
Signal
PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inactive
P1D Modulated
Pulse
Width
(Single Output)
(Half-Bridge)
Delay(1) Delay(1)
Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.4.6 “Programmable Dead-Band Delay
mode”).
2010 Microchip Technology Inc. DS41302D-page 99
PIC12F609/615/617/12HV609/615
11.4.1 HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-pull loads. The PWM output signal is output
on the CCP1/P1A pin, while the complementary PWM
output signal is output on the P1B pin (see Figure 11-8).
This mode can be used for Half-Bridge applications, as
shown in Figure 11-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the PDC<6:0> bits of
the PWM1CON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 11.4.6 “Programmable Dead-Band Delay
mode” for more details of the dead-band delay
operations.
Since the P1A and P1B outputs are multiplexed with
the PORT data latches, the associated TRIS bits must
be cleared to configure P1A and P1B as outputs.
FIGURE 11-8: EXAMPLE OF HALFBRIDGE
PWM OUTPUT
FIGURE 11-9: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
Load
+
-
+
-
FET
Driver
FET
Driver
V+
Load
FET
Driver
FET
Driver
P1A
P1B
Standard Half-Bridge Circuit (“Push-Pull”)
Half-Bridge Output Driving a Full-Bridge Circuit
PIC12F609/615/617/12HV609/615
DS41302D-page 100 2010 Microchip Technology Inc.
11.4.2 START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCP1M<1:0> bits of the CCP1CON register allow
the user to choose whether the PWM output signals are
active-high or active-low for each PWM output pin (P1A
and P1B). The PWM output polarities must be selected
before the PWM pin output drivers are enabled.
Changing the polarity configuration while the PWM pin
output drivers are enable is not recommended since it
may result in damage to the application circuits.
The P1A and P1B output latches may not be in the proper
states when the PWM module is initialized. Enabling the
PWM pin output drivers at the same time as the
Enhanced PWM modes may cause damage to the
application circuit. The Enhanced PWM modes must be
enabled in the proper Output mode and complete a full
PWM cycle before configuring the PWM pin output
drivers. The completion of a full PWM cycle is indicated
by the TMR2IF bit of the PIR1 register being set as the
second PWM period begins.
11.4.3 OPERATION DURING SLEEP
When the device is placed in sleep, the allocated timer
will not increment and the state of the module will not
change. If the CCP1 pin is driving a value, it will
continue to drive that value. When the device wakes
up, it will continue from this state.
Note: When the microcontroller is released from
Reset, all of the I/O pins are in the highimpedance
state. The external circuits
must keep the power switch devices in the
OFF state until the microcontroller drives
the I/O pins with the proper signal levels or
activates the PWM output(s).
2010 Microchip Technology Inc. DS41302D-page 101
PIC12F609/615/617/12HV609/615
11.4.4 ENHANCED PWM AUTOSHUTDOWN
MODE
The PWM mode supports an Auto-Shutdown mode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
ECCPASx bits of the ECCPAS register. A shutdown
event may be generated by:
• A logic ‘0’ on the INT pin
• Comparator
• Setting the ECCPASE bit in firmware
A shutdown condition is indicated by the ECCPASE
(Auto-Shutdown Event Status) bit of the ECCPAS
register. If the bit is a ‘0’, the PWM pins are operating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state. Refer to Figure 1.
When a shutdown event occurs, two things happen:
The ECCPASE bit is set to ‘1’. The ECCPASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 11.4.5 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The state of P1A is determined by
the PSSAC bit. The state of P1B is determined by the
PSSBD bit. The PSSAC and PSSBD bits are located in
the ECCPAS register. Each pin may be placed into one
of three states:
• Drive logic ‘1’
• Drive logic ‘0’
• Tri-state (high-impedance)
FIGURE 11-10: AUTO-SHUTDOWN BLOCK DIAGRAM
PSSAC<1>
TRISx
P1A
0
1
P1A_DRV
PSSAC<0>
PSSBD<1>
TRISx
P1B
0
PSSBD<0> 1
P1B_DRV
000
001
010
011
100
101
110
111
From Comparator
ECCPAS<2:0>
R
D Q
S
From Data Bus ECCPASE
Write to ECCPASE
PRSEN
INT
PIC12F609/615/617/12HV609/615
DS41302D-page 102 2010 Microchip Technology Inc.
REGISTER 11-2: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN
CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit
1 = A shutdown event has occurred; ECCP outputs are in shutdown state
0 = ECCP outputs are operating
bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits
000 =Auto-Shutdown is disabled
001 =Comparator output change
010 =Auto-Shutdown is disabled
011 =Comparator output change(1)
100 =VIL on INT pin
101 =VIL on INT pin or Comparator change
110 =VIL on INT pin(1)
111 =VIL on INT pin or Comparator change
bit 3-2 PSSAC<1:0>: Pin P1A Shutdown State Control bits
00 = Drive pin P1A to ‘0’
01 = Drive pin P1A to ‘1’
1x = Pin P1A tri-state
bit 1-0 PSSBD<1:0>: Pin P1B Shutdown State Control bits
00 = Drive pin P1B to ‘0’
01 = Drive pin P1B to ‘1’
1x = Pin P1B tri-state
Note 1: If CMSYNC is enabled, the shutdown will be delayed by Timer1.
Note 1: The auto-shutdown condition is a levelbased
signal, not an edge-based signal.
As long as the level is present, the autoshutdown
will persist.
2: Writing to the ECCPASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
2010 Microchip Technology Inc. DS41302D-page 103
PIC12F609/615/617/12HV609/615
FIGURE 11-11: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0)
11.4.5 AUTO-RESTART MODE
The Enhanced PWM can be configured to automatically
restart the PWM signal once the auto-shutdown
condition has been removed. Auto-restart is enabled by
setting the PRSEN bit in the PWM1CON register.
If auto-restart is enabled, the ECCPASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
ECCPASE bit will be cleared via hardware and normal
operation will resume.
FIGURE 11-12: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1)
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs
Shutdown
Event Clears
PWM
Resumes
PWM Period
Start of
PWM Period
ECCPASE
Cleared by
Firmware
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs
Shutdown
Event Clears
PWM
Resumes
PWM Period
Start of
PWM Period
PIC12F609/615/617/12HV609/615
DS41302D-page 104 2010 Microchip Technology Inc.
11.4.6 PROGRAMMABLE DEAD-BAND
DELAY MODE
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If both the upper and lower power switches are
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shootthrough
current) will flow through both power switches,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
In Half-Bridge mode, a digitally programmable deadband
delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the signal transition from the non-active state
to the active state. See Figure 11-13 for illustration. The
lower seven bits of the associated PWMxCON register
(Register 11-3) sets the delay period in terms of
microcontroller instruction cycles (TCY or 4 TOSC).
FIGURE 11-13: EXAMPLE OF HALFBRIDGE
PWM OUTPUT
FIGURE 11-14: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
V+
VLoad
+
V-
+
VStandard
Half-Bridge Circuit (“Push-Pull”)
2010 Microchip Technology Inc. DS41302D-page 105
PIC12F609/615/617/12HV609/615
TABLE 11-7: SUMMARY OF REGISTERS ASSOCIATED WITH PWM
REGISTER 11-3: PWM1CON: ENHANCED PWM CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 PRSEN: PWM Restart Enable bit
1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM
bit 6-0 PDC<6:0>: PWM Delay Count bits
PDCn =Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should
transition active and the actual time it transitions active
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
APFCON — — — T1GSEL — — P1BSEL P1ASEL ---0 --00 ---0 --00
CCP1CON(1) P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L(1) Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H(1) Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
CMCON0 CMON COUT CMOE CMPOL — CMR — CMCH 0000 -0-0 0000 -0-0
CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 ---0 0-10
ECCPAS(1) ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 0000 0000
PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T2CON(1) — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
TMR2(1) Timer2 Module Register 0000 0000 0000 0000
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.
Note 1: For PIC12F615/617/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 106 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 107
PIC12F609/615/617/12HV609/615
12.0 SPECIAL FEATURES OF THE
CPU
The PIC12F609/615/617/12HV609/615 has a host of
features intended to maximize system reliability,
minimize cost through elimination of external
components, provide power-saving features and offer
code protection.
These features are:
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• Oscillator selection
• Sleep
• Code protection
• ID Locations
• In-Circuit Serial Programming
The PIC12F609/615/617/12HV609/615 has two timers
that offer necessary delays on power-up. One is the
Oscillator Start-up Timer (OST), intended to keep the
chip in Reset until the crystal oscillator is stable. The
other is the Power-up Timer (PWRT), which provides a
fixed delay of 64 ms (nominal) on power-up only,
designed to keep the part in Reset while the power
supply stabilizes. There is also circuitry to reset the
device if a brown-out occurs, which can use the Powerup
Timer to provide at least a 64 ms Reset. With these
three functions-on-chip, most applications need no
external Reset circuitry.
The Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through:
• External Reset
• Watchdog Timer Wake-up
• An interrupt
Several oscillator options are also made available to
allow the part to fit the application. The INTOSC option
saves system cost while the LP crystal option saves
power. A set of Configuration bits are used to select
various options (see Register 12-1).
12.1 Configuration Bits
The Configuration bits can be programmed (read as
‘0’), or left unprogrammed (read as ‘1’) to select various
device configurations as shown in Register 12-1.
These bits are mapped in program memory location
2007h.
Note: Address 2007h is beyond the user program
memory space. It belongs to the special
configuration memory space (2000h-
3FFFh), which can be accessed only during
programming. See Memory Programming
Specification (DS41204) for more
information.
PIC12F609/615/617/12HV609/615
DS41302D-page 108 2010 Microchip Technology Inc.
REGISTER 12-1: CONFIG: CONFIGURATION WORD REGISTER (ADDRESS: 2007h) FOR
PIC12F609/615/HV609/615 ONLY
U-1 U-1 U-1 U-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
— — — — BOREN1(1) BOREN0(1) IOSCFS CP(2) MCLRE(3) PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 13 bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
P = Programmable
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
bit 13-10 Unimplemented: Read as ‘1’
bit 9-8 BOREN<1:0>: Brown-out Reset Selection bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
0x = BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select bit
1 = 8 MHz
0 = 4 MHz
bit 6 CP: Code Protection bit(2)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 5 MCLRE: MCLR Pin Function Select bit(3)
1 = MCLR pin function is MCLR
0 = MCLR pin function is digital input, MCLR internally tied to VDD
bit 4 PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 =RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN
110 =RCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN
101 =INTOSC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, I/O function on
GP5/OSC1/CLKIN
100 = INTOSCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on
GP5/OSC1/CLKIN
011 =EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN
010 =HS oscillator: High-speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
001 = XT oscillator: Crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
000 = LP oscillator: Low-power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire program memory will be erased when the code protection is turned off.
3: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled.
2010 Microchip Technology Inc. DS41302D-page 109
PIC12F609/615/617/12HV609/615
REGISTER 12-2: CONFIG – CONFIGURATION WORD (ADDRESS: 2007h) FOR PIC12F617 ONLY
U-1 U-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
— — WRT1 WRT0 BOREN1 BOREN0 IOSCFS CP MCLRE PWRTE WDTE FOSC2 F0SC1 F0SC0
bit
13
bit 0
bit 13-12 Unimplemented: Read as ‘1’
bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bits
11 =Write protection off
10 = 000h to 1FFh write protected, 200h to 7FFh may be modified by PMCON1 control
01 = 000h to 3FFh write protected, 400h to 7FFh may be modified by PMCON1 control
00 = 000h to 7FFh write protected, entire program memory is write protected.
bit 9-8 BOREN<1:0>: Brown-out Reset Enable bits
11 = BOR enabled
10 = BOR disabled during Sleep and enabled during operation
0X = BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select
1 = 8 MHz
0 = 4 MHz
bit 6 CP: Code Protection
1 = Program memory is not code protected
0 = Program memory is external read and write protected
bit 5 MCLRE: MCLR Pin Function Select
1 = MCLR pin is MCLR function and weak internal pull-up is enabled
0 = MCLR pin is alternate function, MCLR function is internally disabled
bit 4 PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits
000 =LP oscillator: Low-power crystal on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT
001 =XT oscillator: Crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT
010 =HS oscillator: High-speed crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT
011 =EC: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, CLKIN on RA5/T1CKI/OSC1/CLKIN
100 =INTOSCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/CLKIN
101 =INTOSC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/
CLKIN
110 =EXTRCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN
111 =EXTRC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN
Note 1:Enabling Brown-out Reset does not automatically enable the Power-up Timer (PWRT).
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘1’ P = Programmable
-n = Value at POR 1 = bit is set 0 = bit is cleared x = bit is unknown
PIC12F609/615/617/12HV609/615
DS41302D-page 110 2010 Microchip Technology Inc.
12.2 Calibration Bits
The 8 MHz internal oscillator is factory calibrated.
These calibration values are stored in fuses located in
the Calibration Word (2008h). The Calibration Word is
not erased when using the specified bulk erase
sequence in the Memory Programming Specification
(DS41204) and thus, does not require reprogramming.
12.3 Reset
The PIC12F609/615/617/12HV609/615 device
differentiates between various kinds of Reset:
a) Power-on Reset (POR)
b) WDT Reset during normal operation
c) WDT Reset during Sleep
d) MCLR Reset during normal operation
e) MCLR Reset during Sleep
f) Brown-out Reset (BOR)
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on:
• Power-on Reset
• MCLR Reset
• MCLR Reset during Sleep
• WDT Reset
• Brown-out Reset (BOR)
WDT wake-up does not cause register resets in the
same manner as a WDT Reset since wake-up is
viewed as the resumption of normal operation. TO and
PD bits are set or cleared differently in different Reset
situations, as indicated in Table 12-2. Software can use
these bits to determine the nature of the Reset. See
Table 12-5 for a full description of Reset states of all
registers.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 12-1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. See Section 16.0 “Electrical
Specifications” for pulse-width specifications.
FIGURE 12-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
R Q
External
Reset
MCLR/VPP pin
VDD
OSC1/
WDT
Module
VDD Rise
Detect
OST/PWRT
On-Chip
WDT
Time-out
Power-on Reset
OST
10-bit Ripple Counter
PWRT
Chip_Reset
11-bit Ripple Counter
Reset
Enable OST
Enable PWRT
Sleep
Brown-out(1)
Reset
BOREN
CLKIN pin
Note 1: Refer to the Configuration Word register (Register 12-1).
RC OSC
2010 Microchip Technology Inc. DS41302D-page 111
PIC12F609/615/617/12HV609/615
12.3.1 POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper
operation. To take advantage of the POR, simply
connect the MCLR pin through a resistor to VDD. This
will eliminate external RC components usually needed
to create Power-on Reset. A maximum rise time for
VDD is required. See Section 16.0 “Electrical
Specifications” for details. If the BOR is enabled, the
maximum rise time specification does not apply. The
BOR circuitry will keep the device in Reset until VDD
reaches VBOR (see Section 12.3.4 “Brown-out Reset
(BOR)”).
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the
operating conditions are met.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
12.3.2 MCLR
PIC12F609/615/617/12HV609/615 has a noise filter in
the MCLR Reset path. The filter will detect and ignore
small pulses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
Voltages applied to the MCLR pin that exceed its
specification can result in both MCLR Resets and
excessive current beyond the device specification
during the ESD event. For this reason, Microchip
recommends that the MCLR pin no longer be tied
directly to VDD. The use of an RC network, as shown in
Figure 12-2, is suggested.
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word register. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the GP3/MCLR pin
becomes an external Reset input. In this mode, the
GP3/MCLR pin has a weak pull-up to VDD.
FIGURE 12-2: RECOMMENDED MCLR
CIRCUIT
12.3.3 POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates from an internal
RC oscillator. For more information, see Section 4.4
“Internal Clock Modes”. The chip is kept in Reset as
long as PWRT is active. The PWRT delay allows the
VDD to rise to an acceptable level. A Configuration bit,
PWRTE, can disable (if set) or enable (if cleared or
programmed) the Power-up Timer. The Power-up
Timer should be enabled when Brown-out Reset is
enabled, although it is not required.
The Power-up Timer delay will vary from chip-to-chip
due to:
• VDD variation
• Temperature variation
• Process variation
See DC parameters for details (Section 16.0
“Electrical Specifications”).
Note: The POR circuit does not produce an
internal Reset when VDD declines. To reenable
the POR, VDD must reach Vss for
a minimum of 100 s.
Note: Voltage spikes below VSS at the MCLR
pin, inducing currents greater than 80 mA,
may cause latch-up. Thus, a series resistor
of 50-100 should be used when
applying a “low” level to the MCLR pin,
rather than pulling this pin directly to VSS.
VDD
PIC®
MCLR
R1
1 kor greater)
C1
0.1 F
(optional, not critical)
R2
100
SW1 needed with capacitor)
(optional)
MCU
PIC12F609/615/617/12HV609/615
DS41302D-page 112 2010 Microchip Technology Inc.
12.3.4 BROWN-OUT RESET (BOR)
The BOREN0 and BOREN1 bits in the Configuration
Word register select one of three BOR modes. One
mode has been added to allow control of the BOR
enable for lower current during Sleep. By selecting
BOREN<1:0> = 10, the BOR is automatically disabled
in Sleep to conserve power and enabled on wake-up.
See Register 12-1 for the Configuration Word
definition.
A brown-out occurs when VDD falls below VBOR for
greater than parameter TBOR (see Section 16.0
“Electrical Specifications”). The brown-out condition
will reset the device. This will occur regardless of VDD
slew rate. A Brown-out Reset may not occur if VDD falls
below VBOR for less than parameter TBOR.
On any Reset (Power-on, Brown-out Reset, Watchdog
timer, etc.), the chip will remain in Reset until VDD rises
above VBOR (see Figure 12-3). If enabled, the Powerup
Timer will be invoked by the Reset and keep the chip
in Reset an additional 64 ms.
If VDD drops below VBOR while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-up Timer will be re-initialized. Once VDD
rises above VBOR, the Power-up Timer will execute a
64 ms Reset.
FIGURE 12-3: BROWN-OUT SITUATIONS
Note: The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
register.
64 ms(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset 64 ms < 64 ms (1)
64 ms(1)
VBOR
VDD
Internal
Reset
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
2010 Microchip Technology Inc. DS41302D-page 113
PIC12F609/615/617/12HV609/615
12.3.5 TIME-OUT SEQUENCE
On power-up, the time-out sequence is as follows:
• PWRT time-out is invoked after POR has expired.
• OST is activated after the PWRT time-out has
expired.
The total time-out will vary based on oscillator
configuration and PWRTE bit status. For example, in EC
mode with PWRTE bit erased (PWRT disabled), there
will be no time-out at all. Figure 12-4, Figure 12-5 and
Figure 12-6 depict time-out sequences.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(see Figure 12-5). This is useful for testing purposes or
to synchronize more than one PIC12F609/615/617/
12HV609/615 device operating in parallel.
Table 12-6 shows the Reset conditions for some
special registers, while Table 12-5 shows the Reset
conditions for all the registers.
12.3.6 POWER CONTROL (PCON)
REGISTER
The Power Control register PCON (address 8Eh) has
two Status bits to indicate what type of Reset occurred
last.
Bit 0 is BOR (Brown-out). BOR is unknown on Poweron
Reset. It must then be set by the user and checked
on subsequent Resets to see if BOR = 0, indicating that
a Brown-out has occurred. The BOR Status bit is a
“don’t care” and is not necessarily predictable if the
brown-out circuit is disabled (BOREN<1:0> = 00 in the
Configuration Word register).
Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on
Reset and unaffected otherwise. The user must write a
‘1’ to this bit following a Power-on Reset. On a subsequent
Reset, if POR is ‘0’, it will indicate that a Poweron
Reset has occurred (i.e., VDD may have gone too
low).
For more information, see Section 12.3.4 “Brown-out
Reset (BOR)”.
TABLE 12-1: TIME-OUT IN VARIOUS SITUATIONS
TABLE 12-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE
TABLE 12-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT RESET
Oscillator Configuration
Power-up Brown-out Reset Wake-up from
PWRTE = 0 PWRTE = 1 PWRTE = 0 PWRTE = 1 Sleep
XT, HS, LP TPWRT + 1024 •
TOSC
1024 • TOSC TPWRT + 1024 •
TOSC
1024 • TOSC 1024 • TOSC
RC, EC, INTOSC TPWRT — TPWRT — —
POR BOR TO PD Condition
0 x 1 1 Power-on Reset
u 0 1 1 Brown-out Reset
u u 0 u WDT Reset
u u 0 0 WDT Wake-up
u u u u MCLR Reset during normal operation
u u 1 0 MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets(1)
PCON — — — — — — POR BOR ---- --qq ---- --uu
STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Shaded cells are not used by BOR.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
PIC12F609/615/617/12HV609/615
DS41302D-page 114 2010 Microchip Technology Inc.
FIGURE 12-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
FIGURE 12-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
FIGURE 12-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
2010 Microchip Technology Inc. DS41302D-page 115
PIC12F609/615/617/12HV609/615
TABLE 12-4: INITIALIZATION CONDITION FOR REGISTERS (PIC12F609/HV609)
Register Address Power-on
Reset
MCLR Reset
WDT Reset
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out
W — xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu
GPIO 05h --x0 x000 --u0 u000 --uu uuuu
PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2)
PIR1 0Ch ----- 0--0 ---- 0--0 ---- u--u(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu
CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u
CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu
OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu
TRISIO 85h --11 1111 --11 1111 --uu uuuu
PIE1 8Ch ----- 0--0 ---- 0--0 ---- u--u
PCON 8Eh ---- --0x ---- --uu(1, 5) ---- --uu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
WPU 95h --11 -111 --11 -111 --uu -uuu
IOC 96h --00 0000 --00 0000 --uu uuuu
ANSEL 9Fh ---- 1-11 ---- 1-11 ---- q-qq
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 12-6 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
PIC12F609/615/617/12HV609/615
DS41302D-page 116 2010 Microchip Technology Inc.
TABLE 12-5: INITIALIZATION CONDITION FOR REGISTERS (PIC12F615/617/HV615)
Register Address Power-on Reset
MCLR Reset
WDT Reset
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out
W — xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu
GPIO 05h --x0 x000 --u0 u000 --uu uuuu
PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2)
PIR1 0Ch -000 0-00 -000 0-00 -uuu u-uu(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
TMR2(1) 11h 0000 0000 0000 0000 uuuu uuuu
T2CON(1) 12h -000 0000 -000 0000 -uuu uuuu
CCPR1L(1) 13h xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H(1) 14h xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON(1) 15h 0-00 0000 0-00 0000 u-uu uuuu
PWM1CON(1) 16h 0000 0000 0000 0000 uuuu uuuu
ECCPAS(1) 17h 0000 0000 0000 0000 uuuu uuuu
VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu
CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u
CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu
ADRESH(1) 1Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0(1) 1Fh 00-0 0000 00-0 0000 uu-u uuuu
OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu
TRISIO 85h --11 1111 --11 1111 --uu uuuu
PIE1 8Ch -00- 0-00 -00- 0-00 -uu- u-uu
PCON 8Eh ---- --0x ---- --uu(1, 5) ---- --uu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
PR2 92h 1111 1111 1111 1111 1111 1111
APFCON 93h ---0 --00 ---0 --00 ---u --uu
WPU 95h --11 -111 --11 -111 --uu -uuu
IOC 96h --00 0000 --00 0000 --uu uuuu
PMCON1(6) 98h ---- -000 ---- -000 ---- -uuu
PMCON2(6) 99h ---- ---- ---- ---- ---- ----
PMADRL(6) 9Ah 0000 0000 0000 0000 uuuu uuuu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
4: See Table 12-6 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: For PIC12F617 only.
2010 Microchip Technology Inc. DS41302D-page 117
PIC12F609/615/617/12HV609/615
TABLE 12-6: INITIALIZATION CONDITION FOR SPECIAL REGISTERS
PMADRH(6) 9Bh ---- -000 ---- -000 ---- -uuu
PMDATL(6) 9Ch 0000 0000 0000 0000 uuuu uuuu
PMDATH(6) 9Dh --00 0000 --00 0000 --uu uuuu
ADRESL(1) 9Eh xxxx xxxx uuuu uuuu uuuu uuuu
ANSEL 9Fh -000 1111 -000 1111 -uuu qqqq
Condition Program
Counter
Status
Register
PCON
Register
Power-on Reset 000h 0001 1xxx ---- --0x
MCLR Reset during normal operation 000h 000u uuuu ---- --uu
MCLR Reset during Sleep 000h 0001 0uuu ---- --uu
WDT Reset 000h 0000 uuuu ---- --uu
WDT Wake-up PC + 1 uuu0 0uuu ---- --uu
Brown-out Reset 000h 0001 1uuu ---- --10
Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and Global Interrupt Enable bit, GIE, is set, the PC is loaded with
the interrupt vector (0004h) after execution of PC + 1.
TABLE 12-5: INITIALIZATION CONDITION FOR REGISTERS (CONTINUED)(PIC12F615/617/HV615)
Register Address Power-on Reset
MCLR Reset
WDT Reset (Continued)
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out (Continued)
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
4: See Table 12-6 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: For PIC12F617 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 118 2010 Microchip Technology Inc.
12.4 Interrupts
The PIC12F609/615/617/12HV609/615 has 8 sources
of interrupt:
• External Interrupt GP2/INT
• Timer0 Overflow Interrupt
• GPIO Change Interrupts
• Comparator Interrupt
• A/D Interrupt (PIC12F615/617/HV615 only)
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt (PIC12F615/617/HV615
only)
• Enhanced CCP Interrupt (PIC12F615/617/HV615
only)
• Flash Memory Self Write (PIC12F617 only)
The Interrupt Control register (INTCON) and Peripheral
Interrupt Request Register 1 (PIR1) record individual
interrupt requests in flag bits. The INTCON register
also has individual and global interrupt enable bits.
The Global Interrupt Enable bit, GIE of the INTCON
register, enables (if set) all unmasked interrupts, or
disables (if cleared) all interrupts. Individual interrupts
can be disabled through their corresponding enable
bits in the INTCON register and PIE1 register. GIE is
cleared on Reset.
When an interrupt is serviced, the following actions
occur automatically:
• The GIE is cleared to disable any further interrupt.
• The return address is pushed onto the stack.
• The PC is loaded with 0004h.
The Return from Interrupt instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enables unmasked interrupts.
The following interrupt flags are contained in the
INTCON register:
• INT Pin Interrupt
• GPIO Change Interrupt
• Timer0 Overflow Interrupt
The peripheral interrupt flags are contained in the
special register, PIR1. The corresponding interrupt
enable bit is contained in special register, PIE1.
The following interrupt flags are contained in the PIR1
register:
• A/D Interrupt
• Comparator Interrupt
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt
• Enhanced CCP Interrupt
For external interrupt events, such as the INT pin or
GPIO change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 12-8). The latency is the same for one or twocycle
instructions. Once in the Interrupt Service
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
For additional information on Timer1, Timer2,
comparators, ADC, Enhanced CCP modules, refer to
the respective peripheral section.
12.4.1 GP2/INT INTERRUPT
The external interrupt on the GP2/INT pin is edgetriggered;
either on the rising edge if the INTEDG bit of
the OPTION register is set, or the falling edge, if the
INTEDG bit is clear. When a valid edge appears on the
GP2/INT pin, the INTF bit of the INTCON register is set.
This interrupt can be disabled by clearing the INTE
control bit of the INTCON register. The INTF bit must
be cleared by software in the Interrupt Service Routine
before re-enabling this interrupt. The GP2/INT interrupt
can wake-up the processor from Sleep, if the INTE bit
was set prior to going into Sleep. See Section 12.7
“Power-Down Mode (Sleep)” for details on Sleep and
Figure 12-9 for timing of wake-up from Sleep through
GP2/INT interrupt.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts, which were
ignored, are still pending to be serviced
when the GIE bit is set again.
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pins configured as analog inputs will
read ‘0’ and cannot generate an interrupt.
2010 Microchip Technology Inc. DS41302D-page 119
PIC12F609/615/617/12HV609/615
12.4.2 TIMER0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
the T0IF bit of the INTCON register. The interrupt can
be enabled/disabled by setting/clearing T0IE bit of the
INTCON register. See Section 6.0 “Timer0 Module”
for operation of the Timer0 module.
12.4.3 GPIO INTERRUPT-ON-CHANGE
An input change on GPIO sets the GPIF bit of the
INTCON register. The interrupt can be enabled/
disabled by setting/clearing the GPIE bit of the
INTCON register. Plus, individual pins can be
configured through the IOC register.
FIGURE 12-7: INTERRUPT LOGIC
Note: If a change on the I/O pin should occur
when any GPIO operation is being
executed, then the GPIF interrupt flag may
not get set.
TMR1IF
TMR1IE
CMIF
CMIE
T0IF
T0IE
INTF
INTE
GPIF
GPIE
GIE
PEIE
Wake-up (If in Sleep mode)(1)
Interrupt to CPU
ADIF
ADIE
IOC-GP0
IOC0
IOC-GP1
IOC1
IOC-GP2
IOC2
IOC-GP3
IOC3
IOC-GP4
IOC4
IOC-GP5
IOC5
TMR2IF
TMR2IE
CCP1IF
CCP1IE
Note 1: Some peripherals depend upon the system clock for
operation. Since the system clock is suspended during Sleep, only
those peripherals which do not depend upon the system clock will wake
the part from Sleep. See Section 12.7.1 “Wake-up from Sleep”.
(615/617
(615/617 only)
(615/617 only)
only)
PIC12F609/615/617/12HV609/615
DS41302D-page 120 2010 Microchip Technology Inc.
FIGURE 12-8: INT PIN INTERRUPT TIMING
TABLE 12-7: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000
PIR1 — ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -000 0-00
PIE1 — ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -000 0-00
Legend: x = unknown, u = unchanged, – = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by the interrupt module.
Note 1: PIC12F615/617/HV615 only.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT
INT pin
INTF flag
(INTCON reg.)
GIE bit
(INTCON reg.)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (PC) Dummy Cycle Inst (0004h)
—
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency
is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in INTOSC and RC Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 16.0 “Electrical Specifications”.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1)
(2)
(3)
(4)
(1) (5)
2010 Microchip Technology Inc. DS41302D-page 121
PIC12F609/615/617/12HV609/615
12.5 Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Temporary holding registers W_TEMP and
STATUS_TEMP should be placed in the last 16 bytes
of GPR (see Figure 2-3). These 16 locations are
common to all banks and do not require banking. This
makes context save and restore operations simpler.
The code shown in Example 12-1 can be used to:
• Store the W register
• Store the STATUS register
• Execute the ISR code
• Restore the Status (and Bank Select Bit register)
• Restore the W register
EXAMPLE 12-1: SAVING STATUS AND W REGISTERS IN RAM
12.6 Watchdog Timer (WDT)
The Watchdog Timer is a free running, on-chip RC
oscillator, which requires no external components. This
RC oscillator is separate from the external RC oscillator
of the CLKIN pin and INTOSC. That means that the
WDT will run, even if the clock on the OSC1 and OSC2
pins of the device has been stopped (for example, by
execution of a SLEEP instruction). During normal operation,
a WDT time out generates a device Reset. If the
device is in Sleep mode, a WDT time out causes the
device to wake-up and continue with normal operation.
The WDT can be permanently disabled by programming
the Configuration bit, WDTE, as clear
(Section 12.1 “Configuration Bits”).
12.6.1 WDT PERIOD
The WDT has a nominal time-out period of 18 ms (with
no prescaler). The time-out periods vary with
temperature, VDD and process variations from part to
part (see DC specs). If longer time-out periods are
desired, a prescaler with a division ratio of up to 1:128
can be assigned to the WDT under software control by
writing to the OPTION register. Thus, time-out periods
up to 2.3 seconds can be realized.
The CLRWDT and SLEEP instructions clear the WDT
and the prescaler, if assigned to the WDT, and prevent
it from timing out and generating a device Reset.
The TO bit in the STATUS register will be cleared upon
a Watchdog Timer time out.
Note: The PIC12F609/615/617/12HV609/615
does not require saving the PCLATH.
However, if computed GOTOs are used in
both the ISR and the main code, the
PCLATH must be saved and restored in
the ISR.
MOVWF W_TEMP ;Copy W to TEMP register
SWAPF STATUS,W ;Swap status to be saved into W
;Swaps are used because they do not affect the status bits
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR) ;Insert user code here
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
PIC12F609/615/617/12HV609/615
DS41302D-page 122 2010 Microchip Technology Inc.
12.6.2 WDT PROGRAMMING
CONSIDERATIONS
It should also be taken in account that under worstcase
conditions (i.e., VDD = Min., Temperature = Max.,
Max. WDT prescaler) it may take several seconds
before a WDT time out occurs.
FIGURE 12-2: WATCHDOG TIMER BLOCK DIAGRAM
TABLE 12-9: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 12-8: WDT STATUS
Conditions WDT
WDTE = 0
Cleared
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTRC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
CONFIG IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — —
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Register 12-1 for operation of all Configuration Word register bits.
T0CKI
T0SE
pin
CLKOUT
TMR0
Watchdog
Timer
WDT
Time-Out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
0
1
0
1
0
1
SYNC 2
Cycles
8
8
8-bit
Prescaler
0
1
(= FOSC/4)
PSA
PSA
PSA
3
2010 Microchip Technology Inc. DS41302D-page 123
PIC12F609/615/617/12HV609/615
12.7 Power-Down Mode (Sleep)
The Power-Down mode is entered by executing a
SLEEP instruction.
If the Watchdog Timer is enabled:
• WDT will be cleared but keeps running.
• PD bit in the STATUS register is cleared.
• TO bit is set.
• Oscillator driver is turned off.
• I/O ports maintain the status they had before SLEEP
was executed (driving high, low or high-impedance).
For lowest current consumption in this mode, all I/O pins
should be either at VDD or VSS, with no external circuitry
drawing current from the I/O pin and the comparators
and CVREF should be disabled. I/O pins that are highimpedance
inputs should be pulled high or low externally
to avoid switching currents caused by floating inputs.
The T0CKI input should also be at VDD or VSS for lowest
current consumption. The contribution from on-chip pullups
on GPIO should be considered.
The MCLR pin must be at a logic high level.
12.7.1 WAKE-UP FROM SLEEP
The device can wake-up from Sleep through one of the
following events:
1. External Reset input on MCLR pin.
2. Watchdog Timer wake-up (if WDT was
enabled).
3. Interrupt from GP2/INT pin, GPIO change or a
peripheral interrupt.
The first event will cause a device Reset. The two latter
events are considered a continuation of program
execution. The TO and PD bits in the STATUS register
can be used to determine the cause of device Reset.
The PD bit, which is set on power-up, is cleared when
Sleep is invoked. TO bit is cleared if WDT wake-up
occurred.
The following peripheral interrupts can wake the device
from Sleep:
1. Timer1 interrupt. Timer1 must be operating as
an asynchronous counter.
2. ECCP Capture mode interrupt.
3. A/D conversion (when A/D clock source is RC).
4. Comparator output changes state.
5. Interrupt-on-change.
6. External Interrupt from INT pin.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction, then branches to the interrupt
address (0004h). In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
12.7.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will
complete as a NOP. Therefore, the WDT and WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
• If the interrupt occurs during or after the
execution of a SLEEP instruction, the device will
Immediately wake-up from Sleep. The SLEEP
instruction is executed. Therefore, the WDT and
WDT prescaler and postscaler (if enabled) will be
cleared, the TO bit will be set and the PD bit will
be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction. See
Figure 12-9 for more details.
Note: It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
Note: If the global interrupts are disabled (GIE is
cleared) and any interrupt source has both
its interrupt enable bit and the corresponding
interrupt flag bits set, the device will
immediately wake-up from Sleep.
PIC12F609/615/617/12HV609/615
DS41302D-page 124 2010 Microchip Technology Inc.
FIGURE 12-9: WAKE-UP FROM SLEEP THROUGH INTERRUPT
12.8 Code Protection
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out using ICSP™ for verification purposes.
12.9 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify mode.
Only the Least Significant 7 bits of the ID locations are
used.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON reg.)
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC – 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(3)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Dummy Cycle Inst(0004h)
PC + 2 0004h 0005h
Dummy Cycle
TOST(2)
PC + 2
Note 1: XT, HS or LP Oscillator mode assumed.
2: TOST = 1024 TOSC (drawing not to scale). This delay does not apply to EC, INTOSC and RC Oscillator modes.
3: GIE = ‘1’ assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = ‘0’, execution will continue in-line.
4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference.
Note: The entire Flash program memory will be
erased when the code protection is turned
off. See the MemoryProgramming
Specification (DS41204) for more
information.
2010 Microchip Technology Inc. DS41302D-page 125
PIC12F609/615/617/12HV609/615
12.10 In-Circuit Serial Programming™
ThePIC12F609/615/617/12HV609/615
microcontrollers can be serially programmed while in
the end application circuit. This is simply done with five
connections for:
• clock
• data
• power
• ground
• programming voltage
This allows customers to manufacture boards with
unprogrammed devices and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom
firmware to be programmed.
The device is placed into a Program/Verify mode by
holding the GP0 and GP1 pins low, while raising the
MCLR (VPP) pin from VIL to VIHH. See the Memory
Programming Specification (DS41284) for more
information. GP0 becomes the programming data and
GP1 becomes the programming clock. Both GP0 and
GP1 are Schmitt Trigger inputs in Program/Verify
mode.
A typical In-Circuit Serial Programming connection is
shown in Figure 12-10.
FIGURE 12-10: TYPICAL IN-CIRCUIT
SERIAL PROGRAMMING
CONNECTION
12.11 In-Circuit Debugger
Since in-circuit debugging requires access to three pins,
MPLAB® ICD 2 development with an 14-pin device is
not practical. A special 28-pin PIC12F609/615/617/
12HV609/615 ICD device is used with MPLAB ICD 2 to
provide separate clock, data and MCLR pins and frees
all normally available pins to the user.
A special debugging adapter allows the ICD device to
be used in place of a PIC12F609/615/617/12HV609/
615 device. The debugging adapter is the only source
of the ICD device.
When the ICD pin on the PIC12F609/615/617/
12HV609/615 ICD device is held low, the In-Circuit
Debugger functionality is enabled. This function allows
simple debugging functions when used with MPLAB
ICD 2. When the microcontroller has this feature
enabled, some of the resources are not available for
general use. Table 12-10 shows which features are
consumed by the background debugger.
TABLE 12-10: DEBUGGER RESOURCES
For more information, see “MPLAB® ICD 2 In-Circuit
Debugger User’s Guide” (DS51331), available on
Microchip’s web site (www.microchip.com).
FIGURE 12-11: 28 PIN ICD PINOUT
Note: To erase the device VDD must be above
the Bulk Erase VDD minimum given in the
Memory Programming Specification
(DS41284)
External
Connector
Signals
To Normal
Connections
To Normal
Connections
PIC12F615/12HV615
VDD
VSS
MCLR/VPP/GP3/RA3
GP1
GP0
+5V
0V
VPP
CLK
Data I/O
* * *
*
* Isolation devices (as required)
PIC12F609/12HV609
PIC12F617/
Resource Description
I/O pins ICDCLK, ICDDATA
Stack 1 level
Program Memory Address 0h must be NOP
700h-7FFh
28-Pin PDIP
In-Circuit Debug Device
VDD
CS0
CS1
CS2
RA5
RA4
GND
RA0
RA1
SHUNTEN
RC3 NC
RA2
RC0
RA3
RC5
RC4
RC1
RC2
NC
1
2
3
4
5
6
7
8
9
10
28
27
26
25
24
23
22
21
20
19
ICDDATA ICD
NC
ICDCLK
ICDMCLR
NC
NC
NC
11
12
13
14
18
17
16
15
PIC16F616-ICD
PIC12F609/615/617/12HV609/615
DS41302D-page 126 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 127
PIC12F609/615/617/12HV609/615
13.0 VOLTAGE REGULATOR
The PIC12HV609/HV615 devices include a permanent
internal 5 volt (nominal) shunt regulator in parallel with
the VDD pin. This eliminates the need for an external
voltage regulator in systems sourced by an
unregulated supply. All external devices connected
directly to the VDD pin will share the regulated supply
voltage and contribute to the total VDD supply current
(ILOAD).
13.1 Regulator Operation
A shunt regulator generates a specific supply voltage
by creating a voltage drop across a pass resistor RSER.
The voltage at the VDD pin of the microcontroller is
monitored and compared to an internal voltage reference.
The current through the resistor is then adjusted,
based on the result of the comparison, to produce a
voltage drop equal to the difference between the supply
voltage VUNREG and the VDD of the microcontroller.
See Figure 13-1 for voltage regulator schematic.
FIGURE 13-1: VOLTAGE REGULATOR
An external current limiting resistor, RSER, located
between the unregulated supply, VUNREG, and the VDD
pin, drops the difference in voltage between VUNREG
and VDD. RSER must be between RMAX and RMIN as
defined by Equation 13-1.
EQUATION 13-1: RSER LIMITING RESISTOR
13.2 Regulator Considerations
The supply voltage VUNREG and load current are not
constant. Therefore, the current range of the regulator
is limited. Selecting a value for RSER must take these
three factors into consideration.
Since the regulator uses the band gap voltage as the
regulated voltage reference, this voltage reference is
permanently enabled in the PIC12HV609/HV615
devices.
The shunt regulator will still consume current when
below operating voltage range for the shunt regulator.
13.3 Design Considerations
For more information on using the shunt regulator and
managing current load, see Application Note AN1035,
“Designing with HV Microcontrollers” (DS01035).
Feedback
VDD
VSS
CBYPASS
RSER
VUNREG
ISUPPLY
ISHUNT
ILOAD
Device
RMAX = (VUMIN - 5V)
1.05 • (4 MA + ILOAD)
RMIN = (VUMAX - 5V)
0.95 • (50 MA)
Where:
RMAX = maximum value of RSER (ohms)
RMIN = minimum value of RSER (ohms)
VUMIN = minimum value of VUNREG
VUMAX= maximum value of VUNREG
VDD = regulated voltage (5V nominal)
ILOAD = maximum expected load current in mA
including I/O pin currents and external
circuits connected to VDD.
1.05 = compensation for +5% tolerance of RSER
0.95 = compensation for -5% tolerance of RSER
PIC12F609/615/617/12HV609/615
DS41302D-page 128 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 129
PIC12F609/615/617/12HV609/615
14.0 INSTRUCTION SET SUMMARY
The PIC12F609/615/617/12HV609/615 instruction set
is highly orthogonal and is comprised of three basic
categories:
• Byte-oriented operations
• Bit-oriented operations
• Literal and control operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instruction type and one or
more operands, which further specify the operation of
the instruction. The formats for each of the categories
is presented in Figure 14-1, while the various opcode
fields are summarized in Table 14-1.
Table 14-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W register. If ‘d’ is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instruction cycle consists of four oscillator periods;
for an oscillator frequency of 4 MHz, this gives a normal
instruction execution time of 1 s. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
changed as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
14.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the instruction
or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a CLRF GPIO instruction will read GPIO,
clear all the data bits, then write the result back to
GPIO. This example would have the unintended
consequence of clearing the condition that set the
GPIF flag.
TABLE 14-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 14-1: GENERAL FORMAT FOR
INSTRUCTIONS
Field Description
f Register file address (0x00 to 0x7F)
W Working register (accumulator)
b Bit address within an 8-bit file register
k Literal field, constant data or label
x Don’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
d Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
C Carry bit
DC Digit carry bit
Z Zero bit
PD Power-down bit
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC12F609/615/617/12HV609/615
DS41302D-page 130 2010 Microchip Technology Inc.
TABLE 14-2: PIC12F609/615/617/12HV609/615 INSTRUCTION SET
Mnemonic,
Operands Description Cycles
14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f–
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f–
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
111111
1(2)
1
1(2)
111111111
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
ZZZZZ
Z
ZZ
CC
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
11
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
33
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
kkk–kkk–k––kk
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1121211222111
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external
device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
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14.2 Instruction Descriptions
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bit literal ‘k’
and the result is placed in the
W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If
‘d’ is ‘1’, the result is stored back
in register ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal
‘k’. The result is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register
‘f’. If ‘d’ is ‘0’, the result is stored in
the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is discarded, and a NOP
is executed instead, making this a
two-cycle instruction.
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BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next
instruction is discarded and a NOP
is executed instead, making this a
two-cycle instruction.
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call Subroutine. First, return
address (PC + 1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits <10:0>. The upper bits of
the PC are loaded from PCLATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register ‘f’ are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z)
is set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the
Watchdog Timer. It also resets
the prescaler of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’,
the result is stored back in
register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’,
the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
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DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
decremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, then a NOP is
executed instead, making it a
two-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Description: GOTO is an unconditional branch.
The eleven-bit immediate value is
loaded into PC bits <10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, a NOP is executed
instead, making it a two-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
OR’ed with the eight-bit literal ‘k’.
The result is placed in the
W register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with
register ‘f’. If ‘d’ is ‘0’, the result is
placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
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MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Description: The contents of register ‘f’ is
moved to a destination dependent
upon the status of ‘d’. If d = 0,
destination is W register. If d = 1,
the destination is file register ‘f’
itself. d = 1 is useful to test a file
register since Status flag Z is
affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W = value in FSR
register
Z = 1
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The eight-bit literal ‘k’ is loaded into
W register. The “don’t cares” will
assemble as ‘0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to
register ‘f’.
Words: 1
Cycles: 1
Example: MOVW
F
OPTION
Before Instruction
OPTION= 0xFF
W = 0x4F
After Instruction
OPTION= 0x4F
W = 0x4F
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
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RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is
POPed and Top-of-Stack (TOS)
is loaded in the PC. Interrupts are
enabled by setting Global
Interrupt Enable bit, GIE (INTCON<
7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the
eight-bit literal ‘k’. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
Words: 1
Cycles: 2
Example:
TABLE
DONE
CALL TABLE;W contains
;table offset
;value
GOTO DONE
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ;End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack
is POPed and the top of the stack
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
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RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the left through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C = 0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C = 1
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the right through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is placed
back in register ‘f’.
C Register f
C Register f
SLEEP Enter Sleep mode
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down Status bit, PD
is cleared. Time-out Status bit,
TO is set. Watchdog Timer and
its prescaler are cleared.
The processor is put into Sleep
mode with the oscillator stopped.
SUBLW Subtract W from literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s
complement method) from the
eight-bit literal ‘k’. The result is
placed in the W register.
Result Condition
C = 0 W k
C = 1 W k
DC = 0 W<3:0> k<3:0>
DC = 1 W<3:0> k<3:0>
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SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method)
W register from register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is
‘0’, the result is placed in the W
register. If ‘d’ is ‘1’, the result is
placed in register ‘f’.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register
are XOR’ed with the eight-bit
literal ‘k’. The result is placed in
the W register.
C = 0 W f
C = 1 W f
DC = 0 W<3:0> f<3:0>
DC = 1 W<3:0> f<3:0>
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Description: Exclusive OR the contents of the
W register with register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
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NOTES:
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15.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C for Various Device Families
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
15.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either C or assembly)
• One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
• Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
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15.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal controllers.
These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
15.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, preprocessor,
and one-step driver, and can run on multiple
platforms.
15.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
15.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
15.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility
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15.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulating
the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The software
simulator offers the flexibility to develop and
debug code outside of the hardware laboratory environment,
making it an excellent, economical software
development tool.
15.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with incircuit
debugger systems (RJ11) or with the new highspeed,
noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers significant
advantages over competitive emulators including
low-cost, full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, a ruggedized
probe interface and long (up to three meters) interconnection
cables.
15.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Microchip's
most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Signal
Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcontrollers
and dsPIC® DSCs with the powerful, yet easyto-
use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is connected
to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
15.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and programming
of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to implement
in-circuit debugging and In-Circuit Serial Programming
™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
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15.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use interface
for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcontrollers.
In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a breakpoint,
the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
15.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modular,
detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
15.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully functional
systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/
development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
2010 Microchip Technology Inc. DS41302D-page 143
PIC12F609/615/617/12HV609/615
16.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)
Total power dissipation(1) ...............................................................................................................................800 mW
Maximum current out of VSS pin ...................................................................................................................... 95 mA
Maximum current into VDD pin ......................................................................................................................... 95 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD)20 mA
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by GPIO...................................................................................................................... 90 mA
Maximum current sourced GPIO...................................................................................................................... 90 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x
IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
PIC12F609/615/617/12HV609/615
DS41302D-page 144 2010 Microchip Technology Inc.
FIGURE 16-1: PIC12F609/615/617 VOLTAGE-FREQUENCY GRAPH,
-40°C TA +125°C
FIGURE 16-2: PIC12HV609/615 VOLTAGE-FREQUENCY GRAPH,
-40°C TA +125°C
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
8 10 20
5.5
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
8 10 20
2010 Microchip Technology Inc. DS41302D-page 145
PIC12F609/615/617/12HV609/615
16.1 DC Characteristics: PIC12F609/615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VDD Supply Voltage
D001 PIC12F609/615/617 2.0 — 5.5 V FOSC < = 4 MHz
D001 PIC12HV609/615 2.0 — —(2) V FOSC < = 4 MHz
D001B PIC12F609/615/617 2.0 — 5.5 V FOSC < = 8 MHz
D001B PIC12HV609/615 2.0 — —(2) V FOSC < = 8 MHz
D001C PIC12F609/615/617 3.0 — 5.5 V FOSC < = 10 MHz
D001C PIC12HV609/615 3.0 — —(2) V FOSC < = 10 MHz
D001D PIC12F609/615/617 4.5 — 5.5 V FOSC < = 20 MHz
D001D PIC12HV609/615 4.5 — —(2) V FOSC < = 20 MHz
D002* VDR RAM Data Retention
Voltage(1)
1.5 — — V Device in Sleep mode
D003 VPOR VDD Start Voltage to
ensure internal Power-on
Reset signal
— VSS — V See Section 12.3.1 “Power-on Reset
(POR)” for details.
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 — — V/ms See Section 12.3.1 “Power-on Reset
(POR)” for details.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: User defined. Voltage across the shunt regulator should not exceed 5V.
PIC12F609/615/617/12HV609/615
DS41302D-page 146 2010 Microchip Technology Inc.
16.2 DC Characteristics: PIC12F609/615/617-I (Industrial)
PIC12F609/615/617-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min Typ† Max Units
Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) — 13 25 A 2.0 FOSC = 32 kHz
PIC12F609/615/617 — 19 29 A 3.0 LP Oscillator mode
— 32 51 A 5.0
D011* — 135 225 A 2.0 FOSC = 1 MHz
— 185 285 A 3.0 XT Oscillator mode
— 300 405 A 5.0
D012 — 240 360 A 2.0 FOSC = 4 MHz
— 360 505 A 3.0 XT Oscillator mode
— 0.66 1.0 mA 5.0
D013* — 75 110 A 2.0 FOSC = 1 MHz
— 155 255 A 3.0 EC Oscillator mode
— 345 530 A 5.0
D014 — 185 255 A 2.0 FOSC = 4 MHz
— 325 475 A 3.0 EC Oscillator mode
— 0.665 1.0 mA 5.0
D016* — 245 340 A 2.0 FOSC = 4 MHz
— 360 485 A 3.0 INTOSC mode
— 0.620 0.845 mA 5.0
D017 — 395 550 A 2.0 FOSC = 8 MHz
— 0.620 0.850 mA 3.0 INTOSC mode
— 1.2 1.6 mA 5.0
D018 — 175 235 A 2.0 FOSC = 4 MHz
EXTRC mode(3) — 285 390 A 3.0
— 530 750 A 5.0
D019 — 2.2 3.1 mA 4.5 FOSC = 20 MHz
HS Oscillator mode
— 2.8 3.35 mA 5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-torail;
all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in KOhms (K
2010 Microchip Technology Inc. DS41302D-page 147
PIC12F609/615/617/12HV609/615
16.3 DC Characteristics: PIC12HV609/615-I (Industrial)
PIC12HV609/615-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min Typ† Max Units
Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) — 160 230 A 2.0 FOSC = 32 kHz
PIC12HV609/615 — 240 310 A 3.0 LP Oscillator mode
— 280 400 A 4.5
D011* — 270 380 A 2.0 FOSC = 1 MHz
— 400 560 A 3.0 XT Oscillator mode
— 520 780 A 4.5
D012 — 380 540 A 2.0 FOSC = 4 MHz
— 575 810 A 3.0 XT Oscillator mode
— 0.875 1.3 mA 4.5
D013* — 215 310 A 2.0 FOSC = 1 MHz
— 375 565 A 3.0 EC Oscillator mode
— 570 870 A 4.5
D014 — 330 475 A 2.0 FOSC = 4 MHz
— 550 800 A 3.0 EC Oscillator mode
— 0.85 1.2 mA 4.5
D016* — 310 435 A 2.0 FOSC = 4 MHz
— 500 700 A 3.0 INTOSC mode
— 0.74 1.1 mA 4.5
D017 — 460 650 A 2.0 FOSC = 8 MHz
— 0.75 1.1 mA 3.0 INTOSC mode
— 1.2 1.6 mA 4.5
D018 — 320 465 A 2.0 FOSC = 4 MHz
EXTRC mode(3) — 510 750 A 3.0
— 0.770 1.0 mA 4.5
D019 — 2.5 3.4 mA 4.5 FOSC = 20 MHz
HS Oscillator mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 4.5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can
be extended by the formula IR = VDD/2REXT (mA) with REXT in k
PIC12F609/615/617/12HV609/615
DS41302D-page 148 2010 Microchip Technology Inc.
16.4 DC Characteristics: PIC12F609/615/617 - I (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Device Characteristics Min Typ† Max Units
Conditions
VDD Note
D020 Power-down Base
Current (IPD)(2)
— 0.05 0.9 A 2.0 WDT, BOR, Comparator, VREF and
T1OSC disabled
— 0.15 1.2 A 3.0
PIC12F609/615/617 — 0.35 1.5 A 5.0
150 500 nA 3.0 -40°C TA +25°C for industrial
D021 — 0.5 1.5 A 2.0 WDT Current(1)
— 2.5 4.0 A 3.0
— 9.5 17 A 5.0
D022 — 5.0 9 A 3.0 BOR Current(1)
— 6.0 12 A 5.0
D023 — 50 60 A 2.0 Comparator Current(1), single
— 55 65 A 3.0 comparator enabled
— 60 75 A 5.0
D024 — 30 40 A 2.0 CVREF Current(1) (high range)
— 45 60 A 3.0
— 75 105 A 5.0
D025* — 39 50 A 2.0 CVREF Current(1) (low range)
— 59 80 A 3.0
— 98 130 A 5.0
D026 — 5.5 10 A 2.0 T1OSC Current(1), 32.768 kHz
— 7.0 12 A 3.0
— 8.5 14 A 5.0
D027 — 0.2 1.6 A 3.0 A/D Current(1), no conversion in
— 0.36 1.9 A 5.0 progress
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
2010 Microchip Technology Inc. DS41302D-page 149
PIC12F609/615/617/12HV609/615
16.5 DC Characteristics: PIC12F609/615/617 - E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C for extended
Param
No. Device Characteristics Min Typ† Max Units
Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2)
PIC12F609/615/617
— 0.05 4.0 A 2.0 WDT, BOR, Comparator, VREF and
— 0.15 5.0 A 3.0 T1OSC disabled
— 0.35 8.5 A 5.0
D021E — 0.5 5.0 A 2.0 WDT Current(1)
— 2.5 8.0 A 3.0
— 9.5 19 A 5.0
D022E — 5.0 15 A 3.0 BOR Current(1)
— 6.0 19 A 5.0
D023E — 50 70 A 2.0 Comparator Current(1), single
— 55 75 A 3.0 comparator enabled
— 60 80 A 5.0
D024E — 30 40 A 2.0 CVREF Current(1) (high range)
— 45 60 A 3.0
— 75 105 A 5.0
D025E* — 39 50 A 2.0 CVREF Current(1) (low range)
— 59 80 A 3.0
— 98 130 A 5.0
D026E — 5.5 16 A 2.0 T1OSC Current(1), 32.768 kHz
— 7.0 18 A 3.0
— 8.5 22 A 5.0
D027E — 0.2 6.5 A 3.0 A/D Current(1), no conversion in
— 0.36 10 A 5.0 progress
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
PIC12F609/615/617/12HV609/615
DS41302D-page 150 2010 Microchip Technology Inc.
16.6 DC Characteristics: PIC12HV609/615 - I (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Device Characteristics Min Typ† Max Units
Conditions
VDD Note
D020 Power-down Base
Current (IPD)(2,3)
— 135 200 A 2.0 WDT, BOR, Comparator, VREF and
T1OSC disabled
— 210 280 A 3.0
PIC12HV609/615 — 260 350 A 4.5
D021 — 135 200 A 2.0 WDT Current(1)
— 210 285 A 3.0
— 265 360 A 4.5
D022 — 215 285 A 3.0 BOR Current(1)
— 265 360 A 4.5
D023 — 185 270 A 2.0 Comparator Current(1), single
— 265 350 A 3.0 comparator enabled
— 320 430 A 4.5
D024 — 165 235 A 2.0 CVREF Current(1) (high range)
— 255 330 A 3.0
— 330 430 A 4.5
D025* — 175 245 A 2.0 CVREF Current(1) (low range)
— 275 350 A 3.0
— 355 450 A 4.5
D026 — 140 205 A 2.0 T1OSC Current(1), 32.768 kHz
— 220 290 A 3.0
— 270 360 A 4.5
D027 — 210 280 A 3.0 A/D Current(1), no conversion in
— 260 350 A 4.5 progress
* These parameters are characterized but not tested.
† Data in “Typ” column is at 4.5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
3: Shunt regulator is always on and always draws operating current.
2010 Microchip Technology Inc. DS41302D-page 151
PIC12F609/615/617/12HV609/615
16.7 DC Characteristics: PIC12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C for extended
Param
No. Device Characteristics Min Typ† Max Units
Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2,3)
PIC12HV609/615
— 135 200 A 2.0 WDT, BOR, Comparator, VREF and
— 210 280 A 3.0 T1OSC disabled
— 260 350 A 4.5
D021E — 135 200 A 2.0 WDT Current(1)
— 210 285 A 3.0
— 265 360 A 4.5
D022E — 215 285 A 3.0 BOR Current(1)
— 265 360 A 4.5
D023E — 185 280 A 2.0 Comparator Current(1), single
— 265 360 A 3.0 comparator enabled
— 320 430 A 4.5
D024E — 165 235 A 2.0 CVREF Current(1) (high range)
— 255 330 A 3.0
— 330 430 A 4.5
D025E* — 175 245 A 2.0 CVREF Current(1) (low range)
— 275 350 A 3.0
— 355 450 A 4.5
D026E — 140 205 A 2.0 T1OSC Current(1), 32.768 kHz
— 220 290 A 3.0
— 270 360 A 4.5
D027E — 210 280 A 3.0 A/D Current(1), no conversion in
— 260 350 A 4.5 progress
* These parameters are characterized but not tested.
† Data in “Typ” column is at 4.5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
3: Shunt regulator is always on and always draws operating current.
PIC12F609/615/617/12HV609/615
DS41302D-page 152 2010 Microchip Technology Inc.
16.8 DC Characteristics: PIC12F609/615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VIL Input Low Voltage
I/O port:
D030 with TTL buffer Vss — 0.8 V 4.5V VDD 5.5V
D030A Vss — 0.15 VDD V 2.0V VDD 4.5V
D031 with Schmitt Trigger buffer Vss — 0.2 VDD V 2.0V VDD 5.5V
D032 MCLR, OSC1 (RC mode) VSS — 0.2 VDD V (NOTE 1)
D033 OSC1 (XT and LP modes) VSS — 0.3 V
D033A OSC1 (HS mode) VSS — 0.3 VDD V
VIH Input High Voltage
I/O ports: —
D040 with TTL buffer 2.0 — VDD V 4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 — VDD V 2.0V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD — VDD V 2.0V VDD 5.5V
D042 MCLR 0.8 VDD — VDD V
D043 OSC1 (XT and LP modes) 1.6 — VDD V
D043A OSC1 (HS mode) 0.7 VDD — VDD V
D043B OSC1 (RC mode) 0.9 VDD — VDD V (NOTE 1)
IIL Input Leakage Current(2,3)
D060 I/O ports — 0.1 1 A VSS VPIN VDD,
Pin at high-impedance
D061 GP3/MCLR(3,4) — 0.7 5 A VSS VPIN VDD
D063 OSC1 — 0.1 5 A VSS VPIN VDD, XT, HS and
LP oscillator configuration
D070* IPUR GPIO Weak Pull-up Current(5) 50 250 400 A VDD = 5.0V, VPIN = VSS
VOL Output Low Voltage — — 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40°C to +125°C
D080 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40°C to +85°C
VOH Output High Voltage VDD – 0.7 — — V IOH = -2.5mA, VDD = 4.5V,
-40°C to +125°C
D090 I/O ports(2) VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V,
-40°C to +85°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled.
5: This specification applies to all weak pull-up pins, including the weak pull-up found on GP3/MCLR. When GP3/MCLR is
configured as MCLR reset pin, the weak pull-up is always enabled.
6: Applies to PIC12F617 only.
2010 Microchip Technology Inc. DS41302D-page 153
PIC12F609/615/617/12HV609/615
D101* COSC2
Capacitive Loading Specs on
Output Pins
OSC2 pin
— — 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A* CIO All I/O pins — — 50 pF
Program Flash Memory
D130 EP Cell Endurance 10K 100K — E/W -40°C TA +85°C
D130A ED Cell Endurance 1K 10K — E/W +85°C TA +125°C
D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating
voltage
D132 VPEW VDD for Bulk Erase/Write 4.5 — 5.5 V
D132A VPEW VDD for Row Erase/Write(6) VMIN — 5.5 V
D133 TPEW Erase/Write cycle time — 2 2.5 ms
D134 TRETD Characteristic Retention 40 — — Year Provided no other specifications
are violated
16.8 DC Characteristics: PIC12F609/615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended) (Continued)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled.
5: This specification applies to all weak pull-up pins, including the weak pull-up found on GP3/MCLR. When GP3/MCLR is
configured as MCLR reset pin, the weak pull-up is always enabled.
6: Applies to PIC12F617 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 154 2010 Microchip Technology Inc.
16.9 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristic Typ Units Conditions
TH01 JA Thermal Resistance
Junction to Ambient
84.6* C/W 8-pin PDIP package
149.5* C/W 8-pin SOIC package
211* C/W 8-pin MSOP package
60* C/W 8-pin DFN 3x3mm package
44* C/W 8-pin DFN 4x4mm package
TH02 JC Thermal Resistance
Junction to Case
41.2* C/W 8-pin PDIP package
39.9* C/W 8-pin SOIC package
39* C/W 8-pin MSOP package
9* C/W 8-pin DFN 3x3mm package
3.0* C/W 8-pin DFN 4x4mm package
TH03 TDIE Die Temperature 150* C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD -
VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TDIE - TA)/JA
(NOTE 2)
* These parameters are characterized but not tested.
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient temperature.
2010 Microchip Technology Inc. DS41302D-page 155
PIC12F609/615/617/12HV609/615
16.10 Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 16-3: LOAD CONDITIONS
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O Port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
VSS
CL
Legend: CL=50 pF for all pins
15 pF for OSC2 output
Load Condition
Pin
PIC12F609/615/617/12HV609/615
DS41302D-page 156 2010 Microchip Technology Inc.
16.11 AC Characteristics: PIC12F609/615/617/12HV609/615 (Industrial, Extended)
FIGURE 16-4: CLOCK TIMING
TABLE 16-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC — 37 kHz LP Oscillator mode
DC — 4 MHz XT Oscillator mode
DC — 20 MHz HS Oscillator mode
DC — 20 MHz EC Oscillator mode
Oscillator Frequency(1) — 32.768 — kHz LP Oscillator mode
0.1 — 4 MHz XT Oscillator mode
1 — 20 MHz HS Oscillator mode
DC — 4 MHz RC Oscillator mode
OS02 TOSC External CLKIN Period(1) 27 — s LP Oscillator mode
250 — ns XT Oscillator mode
50 — ns HS Oscillator mode
50 — ns EC Oscillator mode
Oscillator Period(1) — 30.5 — s LP Oscillator mode
250 — 10,000 ns XT Oscillator mode
50 — 1,000 ns HS Oscillator mode
250 — — ns RC Oscillator mode
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TOSH,
TOSL
External CLKIN High,
External CLKIN Low
2 — — s LP oscillator
100 — — ns XT oscillator
20 — — ns HS oscillator
OS05* TOSR,
TOSF
External CLKIN Rise,
External CLKIN Fall
0 — ns LP oscillator
0 — ns XT oscillator
0 — ns HS oscillator
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected
current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When
an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03
OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
2010 Microchip Technology Inc. DS41302D-page 157
PIC12F609/615/617/12HV609/615
TABLE 16-2: OSCILLATOR PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Freq.
Tolerance Min Typ† Max Units Conditions
OS06 TWARM Internal Oscillator Switch
when running(3)
— — — 2 TOSC Slowest clock
OS07 INTOSC Internal Calibrated
INTOSC Frequency(2)
(4MHz)
1% 3.96 4.0 4.04 MHz VDD = 3.5V, TA = 25°C
2% 3.92 4.0 4.08 MHz 2.5V VDD 5.5V,
0°C TA +85°C
5% 3.80 4.0 4.2 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS08 INTOSC Internal Calibrated
INTOSC Frequency(2)
(8MHz)
1% 7.92 8.0 8.08 MHz VDD = 3.5V, TA = 25°C
2% 7.84 8.0 8.16 MHz 2.5V VDD 5.5V,
0°C TA +85°C
5% 7.60 8.0 8.40 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS10* TIOSC ST INTOSC Oscillator Wakeup
from Sleep
Start-up Time
— 5.5 12 24 s VDD = 2.0V, -40°C to +85°C
— 3.5 7 14 s VDD = 3.0V, -40°C to +85°C
— 3 6 11 s VDD = 5.0V, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected
current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
3: By design.
PIC12F609/615/617/12HV609/615
DS41302D-page 158 2010 Microchip Technology Inc.
FIGURE 16-5: CLKOUT AND I/O TIMING
FOSC
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17
OS16
OS14
OS12
OS18
Old Value New Value
Cycle Write Fetch Read Execute
TABLE 16-3: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
OS11 TOSH2CKL FOSC to CLKOUT (1) — — 70 ns VDD = 5.0V
OS12 TOSH2CKH FOSC to CLKOUT (1) — — 72 ns VDD = 5.0V
OS13 TCKL2IOV CLKOUT to Port out valid(1) — — 20 ns
OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns
OS15 TOSH2IOV FOSC (Q1 cycle) to Port out valid — 50 70* ns VDD = 5.0V
OS16 TOSH2IOI FOSC (Q2 cycle) to Port input invalid
(I/O in hold time)
50 — — ns VDD = 5.0V
OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle)
(I/O in setup time)
20 — — ns
OS18 TIOR Port output rise time(2) ——
15
40
72
32
ns VDD = 2.0V
VDD = 5.0V
OS19 TIOF Port output fall time(2) ——
28
15
55
30
ns VDD = 2.0V
VDD = 5.0V
OS20* TINP INT pin input high or low time 25 — — ns
OS21* TRAP GPIO interrupt-on-change new input
level time
TCY — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
2: Includes OSC2 in CLKOUT mode.
2010 Microchip Technology Inc. DS41302D-page 159
PIC12F609/615/617/12HV609/615
FIGURE 16-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 16-7: BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-Up Time
Internal Reset(1)
Watchdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33*
37
* 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.
Reset
(due to BOR)
VBOR + VHYST
PIC12F609/615/617/12HV609/615
DS41302D-page 160 2010 Microchip Technology Inc.
TABLE 16-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
30 TMCL MCLR Pulse Width (low) 2
5
——
——
s
s
VDD = 5V, -40°C to +85°C
VDD = 5V, -40°C to +125°C
31* TWDT Watchdog Timer Time-out
Period (No Prescaler)
10
10
20
20
30
35
ms
ms
VDD = 5V, -40°C to +85°C
VDD = 5V, -40°C to +125°C
32 TOST Oscillation Start-up Timer
Period(1, 2)
— 1024 — TOSC (NOTE 3)
33* TPWRT Power-up Timer Period 40 65 140 ms
34* TIOZ I/O High-impedance from
MCLR Low or Watchdog Timer
Reset
— — 2.0 s
35 VBOR Brown-out Reset Voltage 2.0 2.15 2.3 V (NOTE 4)
36* VHYST Brown-out Reset Hysteresis — 100 — mV
37* TBOR Brown-out Reset Minimum
Detection Period
100 — — s VDD VBOR
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation
and/or higher than expected current consumption. All devices are tested to operate at “min” values
with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time
limit is “DC” (no clock) for all devices.
2: By design.
3: Period of the slower clock.
4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device
as possible. 0.1 F and 0.01 F values in parallel are recommended.
2010 Microchip Technology Inc. DS41302D-page 161
PIC12F609/615/617/12HV609/615
FIGURE 16-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 16-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler
15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler
15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input
Period
Synchronous Greater of:
30 or TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
Asynchronous 60 — — ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN)
— 32.768 — kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment
2 TOSC — 7 TOSC — Timers in Sync
mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
PIC12F609/615/617/12HV609/615
DS41302D-page 162 2010 Microchip Technology Inc.
FIGURE 16-9: PIC12F615/617/HV615 CAPTURE/COMPARE/PWM TIMINGS (ECCP)
TABLE 16-6: PIC12F615/617/HV615 CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP)
TABLE 16-7: COMPARATOR SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
CC01* TccL CCP1 Input Low Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC02* TccH CCP1 Input High Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC03* TccP CCP1 Input Period 3TCY + 40
N
— — ns N = prescale
value (1, 4 or
16)
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristics Min Typ† Max Units Comments
CM01 VOS Input Offset Voltage(2) — 5.0 10 mV
CM02 VCM Input Common Mode Voltage 0 — VDD – 1.5 V
CM03* CMRR Common Mode Rejection Ratio +55 — — dB
CM04* TRT Response Time(1) Falling — 150 600 ns
Rising — 200 1000 ns
CM05* TMC2COV Comparator Mode Change to Output Valid — — 10 s
CM06* VHYS Input Hysteresis Voltage — 45 60 mV
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Response time is measured with one comparator input at (VDD - 1.5)/2 - 100 mV to (VDD - 1.5)/2 + 20mV.
The other input is at (VDD -1.5)/2.
2: Input offset voltage is measured with one comparator input at (VDD - 1.5V)/2.
Note: Refer to Figure 16-3 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCP1
2010 Microchip Technology Inc. DS41302D-page 163
PIC12F609/615/617/12HV609/615
TABLE 16-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS
TABLE 16-9: VOLTAGE REFERENCE SPECIFICATIONS
TABLE 16-10: SHUNT REGULATOR SPECIFICATIONS (PIC12HV609/615 only)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristics Min Typ† Max Units Comments
CV01* CLSB Step Size(2) ——
VDD/24
VDD/32
——
VV
Low Range (VRR = 1)
High Range (VRR = 0)
CV02* CACC Absolute Accuracy(3) ——
——
1/2
1/2
LSb
LSb
Low Range (VRR = 1)
High Range (VRR = 0)
CV03* CR Unit Resistor Value (R) — 2k —
CV04* CST Settling Time(1) — — 10 s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’.
2: See Section 9.10 “Comparator Voltage Reference” for more information.
3: Absolute Accuracy when CVREF output is (VDD -1.5).
VR Voltage Reference Specifications Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Symbol Characteristics Min Typ Max Units Comments
VR01 VP6OUT VP6 voltage output 0.5 0.6 0.7 V
VR02 V1P2OUT V1P2 voltage output 1.05 1.20 1.35 V
VR03* TSTABLE Settling Time — 10 — s
* These parameters are characterized but not tested.
SHUNT REGULATOR CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Symbol Characteristics Min Typ Max Units Comments
SR01 VSHUNT Shunt Voltage 4.75 5 5.4 V
SR02 ISHUNT Shunt Current 4 — 50 mA
SR03* TSETTLE Settling Time — — 150 ns To 1% of final value
SR04 CLOAD Load Capacitance 0.01 — 10 F Bypass capacitor on VDD
pin
SR05 ISNT Regulator operating current — 180 — A Includes band gap
reference current
* These parameters are characterized but not tested.
PIC12F609/615/617/12HV609/615
DS41302D-page 164 2010 Microchip Technology Inc.
TABLE 16-11: PIC12F615/617/HV615 A/D CONVERTER (ADC) CHARACTERISTICS:
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
AD01 NR Resolution — — 10 bits bit
AD02 EIL Integral Error — — 1 LSb VREF = 5.12V(5)
AD03 EDL Differential Error — — 1 LSb No missing codes to 10 bits
VREF = 5.12V(5)
AD04 EOFF Offset Error — +1.5 +2.0 LSb VREF = 5.12V(5)
AD07 EGN Gain Error — — 1 LSb VREF = 5.12V(5)
AD06
AD06A
VREF Reference Voltage(3) 2.2
2.5
— —
VDD
V
Absolute minimum to ensure 1 LSb
accuracy
AD07 VAIN Full-Scale Range VSS — VREF V
AD08 ZAIN Recommended
Impedance of Analog
Voltage Source
— — 10 k
AD09* IREF VREF Input Current(3) 10 — 1000 A During VAIN acquisition.
Based on differential of VHOLD to VAIN.
— — 50 A During A/D conversion cycle.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input.
4: When ADC is off, it will not consume any current other than leakage current. The power-down current
specification includes any such leakage from the ADC module.
5: VREF = 5V for PIC12HV615.
2010 Microchip Technology Inc. DS41302D-page 165
PIC12F609/615/617/12HV609/615
TABLE 16-12: PIC12F615/617/HV615 A/D CONVERSION REQUIREMENTS
FIGURE 16-10: PIC12F615/617/HV615 A/D CONVERSION TIMING (NORMAL MODE)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
AD130* TAD A/D Clock Period 1.6 — 9.0 s TOSC-based, VREF 3.0V
3.0 — 9.0 s TOSC-based, VREF full range(3)
A/D Internal RC
Oscillator Period 3.0 6.0 9.0 s
ADCS<1:0> = 11 (ADRC mode)
At VDD = 2.5V
1.6 4.0 6.0 s At VDD = 5.0V
AD131 TCNV Conversion Time
(not including
Acquisition Time)(1)
— 11 — TAD Set GO/DONE bit to new data in A/D
Result register
AD132* TACQ Acquisition Time 11.5 — s
AD133* TAMP Amplifier Settling Time — — 5 s
AD134 TGO Q4 to A/D Clock Start —
—
TOSC/2
TOSC/2 +
TCY
—
—
—
— If the A/D clock source is selected as
RC, a time of TCY is added before the
A/D clock starts. This allows the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
2: See Section 10.3 “A/D Acquisition Requirements” for minimum conditions.
3: Full range for PIC12HV609/HV615 powered by the shunt regulator is the 5V regulated voltage.
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 8 7 3 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 TCY
6
AD134 (TOSC/2(1))
1 TCY
AD132
PIC12F609/615/617/12HV609/615
DS41302D-page 166 2010 Microchip Technology Inc.
FIGURE 16-11: PIC12F615/617/HV615 A/D CONVERSION TIMING (SLEEP MODE)
AD132
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 7 3 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
AD134
8 6
(TOSC/2 + TCY(1)) 1 TCY
1 TCY
2010 Microchip Technology Inc. DS41302D-page 167
PIC12F609/615/617/12HV609/615
16.12 High Temperature Operation
This section outlines the specifications for the
PIC12F615 device operating in a temperature range
between -40°C and 150°C.(4) The specifications
between -40°C and 150°C(4) are identical to those
shown in DS41288 and DS80329.
TABLE 16-13: ABSOLUTE MAXIMUM RATINGS
Note 1: Writes are not allowed for Flash
Program Memory above 125°C.
2: All AC timing specifications are increased
by 30%. This derating factor will include
parameters such as TPWRT.
3: The temperature range indicator in the
part number is “H” for -40°C to 150°C.(4)
Example: PIC12F615T-H/ST indicates the
device is shipped in a TAPE and reel
configuration, in the MSOP package, and
is rated for operation from -40°C to
150°C.(4)
4: AEC-Q100 reliability testing for devices
intended to operate at 150°C is 1,000
hours. Any design in which the total operating
time from 125°C to 150°C will be
greater than 1,000 hours is not warranted
without prior written approval from
Microchip Technology Inc.
Parameter Source/Sink Value Units
Max. Current: VDD Source 20 mA
Max. Current: VSS Sink 50 mA
Max. Current: PIN Source 5 mA
Max. Current: PIN Sink 10 mA
Pin Current: at VOH Source 3 mA
Pin Current: at VOL Sink 8.5 mA
Port Current: GPIO Source 20 mA
Port Current: GPIO Sink 50 mA
Maximum Junction Temperature 155 °C
Note: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure above
maximum rating conditions for extended periods may affect device reliability.
PIC12F609/615/617/12HV609/615
DS41302D-page 168 2010 Microchip Technology Inc.
TABLE 16-14: DC CHARACTERISTICS FOR IDD SPECIFICATIONS FOR PIC12F615-H (High Temp.)
Param
No.
Device
Characteristics Units Min Typ Max
Condition
VDD Note
D010
Supply Current (IDD) A
— 13 58 2.0
— 19 67 3.0 IDD LP OSC (32 kHz)
— 32 92 5.0
D011
A
— 135 316 2.0
— 185 400 3.0 IDD XT OSC (1 MHz)
— 300 537 5.0
D012
A
— 240 495 2.0
— 360 680 3.0 IDD XT OSC (4 MHz)
mA — 0.660 1.20 5.0
D013
A
— 75 158 2.0
— 155 338 3.0 IDD EC OSC (1 MHz)
— 345 792 5.0
D014 A — 185 357 2.0
— 325 625 3.0 IDD EC OSC (4 MHz)
mA — 0.665 1.30 5.0
D016
A
— 245 476 2.0
— 360 672 3.0 IDD INTOSC (4 MHz)
— 620 1.10 5.0
D017 A — 395 757 2.0
mA — 0.620 1.20 3.0 IDD INTOSC (8 MHz)
— 1.20 2.20 5.0
D018
A
— 175 332 2.0
— 285 518 3.0 IDD EXTRC (4 MHz)
— 530 972 5.0
D019 mA — 2.20 4.10 4.5
IDD HS OSC (20 MHz)
— 2.80 4.80 5.0
2010 Microchip Technology Inc. DS41302D-page 169
PIC12F609/615/617/12HV609/615
TABLE 16-15: DC CHARACTERISTICS FOR IPD SPECIFICATIONS FOR PIC12F615-H (High Temp.)
TABLE 16-16: WATCHDOG TIMER SPECIFICATIONS FOR PIC12F615-H (High Temp.)
TABLE 16-17: LEAKAGE CURRENT SPECIFICATIONS FOR PIC12F615-H (High Temp.)
Param
No.
Device
Characteristics Units Min Typ Max
Condition
VDD Note
D020E
Power Down Base
Current
A
— 0.05 12 2.0
— 0.15 13 3.0 IPD Base
— 0.35 14 5.0
D021E
A
— 0.5 20 2.0
— 2.5 25 3.0 WDT Current
— 9.5 36 5.0
D022E
A
— 5.0 28 3.0
BOR Current
— 6.0 36 5.0
D023E
A
— 105 195 2.0
IPD Current (Both
Comparators Enabled)
— 110 210 3.0
— 116 220 5.0
A — 50 105 2.0
IPD Current (One Comparator
— 55 110 3.0 Enabled)
— 60 125 5.0
D024E
A
— 30 58 2.0
— 45 85 3.0 IPD (CVREF, High Range)
— 75 142 5.0
D025E
A
— 39 76 2.0
— 59 114 3.0 IPD (CVREF, Low Range)
— 98 190 5.0
D026E
A
— 5.5 30 2.0
— 7.0 35 3.0 IPD (T1 OSC, 32 kHz)
— 8.5 45 5.0
D027E A — 0.2 12 3.0 IPD (A2D on, not converting)
— 0.3 15 5.0
Param
No. Sym Characteristic Units Min Typ Max Conditions
31 TWDT Watchdog Timer Time-out Period
(No Prescaler)
ms 6 20 70 150°C Temperature
Param
No. Sym Characteristic Units Min Typ Max Conditions
D061 IIL Input Leakage Current(1)
(GP3/RA3/MCLR)
μA — ±0.5 ±5.0 VSS VPIN VDD
D062 IIL Input Leakage Current(2)
(GP3/RA3/MCLR)
μA 50 250 400 VDD = 5.0V
Note 1: This specification applies when GP3/RA3/MCLR is configured as an input with the pull-up disabled. The
leakage current for the GP3/RA3/MCLR pin is higher than for the standard I/O port pins.
2: This specification applies when GP3/RA3/MCLR is configured as the MCLR reset pin function with the
weak pull-up enabled.
PIC12F609/615/617/12HV609/615
DS41302D-page 170 2010 Microchip Technology Inc.
TABLE 16-18: OSCILLATOR PARAMETERS FOR PIC12F615-H (High Temp.)
TABLE 16-19: COMPARATOR SPECIFICATIONS FOR PIC12F615-H (High Temp.)
Param
No. Sym Characteristic Frequency
Tolerance Units Min Typ Max Conditions
OS08 INTOSC Int. Calibrated INTOSC
Freq.(1)
±10% MHz 7.2 8.0 8.8 2.0V VDD 5.5V
-40°C TA 150°C
Note 1: To ensure these oscillator frequency tolerances, Vdd and Vss must be capacitively decoupled as close to
the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended.
Param
No. Sym Characteristic Units Min Typ Max Conditions
CM01 VOS Input Offset Voltage mV — ±5 ±20 (VDD - 1.5)/2
2010 Microchip Technology Inc. DS41302D-page 171
PIC12F609/615/617/12HV609/615
17.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
“Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3) or (mean -
3) respectively, where s is a standard deviation, over each temperature range.
FIGURE 17-1: PIC12F609/615/617 IDD LP (32 kHz) vs. VDD
FIGURE 17-2: PIC12F609/615/617 IDD EC (1 MHz) vs. VDD
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
0
10
20
30
40
50
60
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
IDD LP (μA)
Maximum
VDD (V)
Typical
1 2 3 4 5 6
0
100
200
300
400
500
600
1 2 3 4 5 6
Typical
Maximum
VDD (V)
IDD EC (μA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 172 2010 Microchip Technology Inc.
FIGURE 17-3: PIC12F609/615/617 IDD EC (4 MHz) vs. VDD
FIGURE 17-4: PIC12F609/615/617 IDD XT (1 MHz) vs. VDD
FIGURE 17-5: PIC12F609/615/617 IDD XT (4 MHz) vs. VDD
0
200
400
600
800
1000
1200
Typical
VDD (V)
IDD EC (μA)
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
0
200
400
600
800
1000
1200
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
Typical
Maximum
VDD (V)
IDD XT (μA)
0
200
400
600
800
1000
1200
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
Typical
Maximum
VDD (V) IDD XT (
μA)
2010 Microchip Technology Inc. DS41302D-page 173
PIC12F609/615/617/12HV609/615
FIGURE 17-6: PIC12F609/615/617 IDD INTOSC (4 MHz) vs. VDD
FIGURE 17-7: PIC12F609/615/617 IDD INTOSC (8 MHz) vs. VDD
0
100
200
300
400
500
600
700
800
900
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
Typical
Maximum
VDD (V)
IDD INTOSC (μA)
0
200
400
600
800
1000
1200
1400
1600
1800
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
Typical
Maximum
VDD (V)
IDD INTOSC (μA)
PIC12F609/615/617/12HV609/615
DS41302D-page 174 2010 Microchip Technology Inc.
FIGURE 17-8: PIC12F609/615617 IDD EXTRC (4 MHz) vs. VDD
FIGURE 17-9: PIC12F609/615/617 IDD HS (20 MHz) vs. VDD
0
100
200
300
400
500
600
700
800
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
Typical
Maximum
VDD (V)
IDD EXTRC (μA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
1
2
3
4
VDD (V)
IDD HS (mA)
4 5 6
Maximum
Typical
2010 Microchip Technology Inc. DS41302D-page 175
PIC12F609/615/617/12HV609/615
FIGURE 17-10: PIC12F609/615/617 IPD BASE vs. VDD
FIGURE 17-11: PIC12F609/615/617 IPD COMPARATOR (SINGLE ON) vs. VDD
0
1
2
3
4
5
6
7
8
9
IPD BASE (μA)
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
1 2 3 4 5 6
Industrial
Typical
Extended
VDD (V)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
30
40
50
60
70
80
90
VDD (V)
IPD CMP (μA)
1 2 3 4 5 6
Industrial
Typical
Extended
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 176 2010 Microchip Technology Inc.
FIGURE 17-12: PIC12F609/615/617 IPD WDT vs. VDD
FIGURE 17-13: PIC12F609/615/617 IPD BOR vs. VDD
0
2
4
6
8
10
12
14
16
18
20
VDD (V)
IPD WDT (μA)
1 2 3 4 5 6
Industrial
Typical
Extended
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
0
2
4
6
8
10
12
14
16
18
20
VDD (V)
IPD BOR (μA)
1 2 3 4 5 6
Industrial
Typical
Typical: Statistical Mean @25°C Extended
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
2010 Microchip Technology Inc. DS41302D-page 177
PIC12F609/615/617/12HV609/615
FIGURE 17-14: PIC12F609/615/617 IPD CVREF (LOW RANGE) vs. VDD
FIGURE 17-15: PIC12F609/615/617 IPD CVREF (HI RANGE) vs. VDD
0
20
40
60
80
100
120
140
VDD (V)
IPD CVREF (μA)
1 2 3 4 5 6
Maximum
Typical
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
0
20
40
60
80
100
120
1 3 5
VDD (V)
IPD CVREF (μA)
2 4 6
Maximum
Typical
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 178 2010 Microchip Technology Inc.
FIGURE 17-16: PIC12F609/615/617 IPD T1OSC vs. VDD
FIGURE 17-17: PIC12F615/617 IPD A/D vs. VDD
0
5
10
15
20
25
VDD (V)
IPD T1OSC (μA)
Industrial
Typical
Extended
1 2 3 4 5 6
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
0
2
4
6
8
10
12
14
VDD (V)
IPD A2D (μA)
Industrial
Typical
Extended
1 2 3 4 5 6
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
2010 Microchip Technology Inc. DS41302D-page 179
PIC12F609/615/617/12HV609/615
FIGURE 17-18: PIC12HV609/615 IDD LP (32 kHz) vs. VDD
FIGURE 17-19: PIC12HV609/615 IDD EC (1 MHz) vs. VDD
FIGURE 17-20: PIC12HV609/615 IDD EC (4 MHz) vs. VDD
0
50
100
150
200
250
300
350
400
450
VDD (V)
IDD LP (μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
100
200
300
400
500
600
700
800
900
1000
VDD (V)
IDD EC (μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
1400
VDD (V)
IDD EC (μA) 5
1
3
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 180 2010 Microchip Technology Inc.
FIGURE 17-21: PIC12HV609/615 IDD XT (1 MHz) vs. VDD
FIGURE 17-22: PIC12HV609/615 IDD XT (4 MHz) vs. VDD
FIGURE 17-23: PIC12HV609/615 IDD INTOSC (4 MHz) vs. VDD
0
100
200
300
400
500
600
700
800
900
VDD (V)
IDD XT (μA)
1 2 3 4 5
Typical
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
1400
VDD (V)
IDD XT (μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
VDD (V) IDD INTOSC (
μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 181
PIC12F609/615/617/12HV609/615
FIGURE 17-24: PIC12HV609/615 IDD INTOSC (8 MHz) vs. VDD
FIGURE 17-25: PIC12HV609/615 IDD EXTRC (4 MHz) vs. VDD
FIGURE 17-26: PIC12HV609/615 IPD BASE vs. VDD
0
500
1000
1500
2000
VDD (V)
IDD INTOSC (μA)
1 2 3 4 5
Typical
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
VDD (V)
IDD EXTRC (μA)
1 2 3 4 5
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C) Typical
0
50
100
150
200
250
300
350
400
VDD (V)
IPD BASE (μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 182 2010 Microchip Technology Inc.
FIGURE 17-27: PIC12HV609/615 IPD COMPARATOR (SINGLE ON) vs. VDD
FIGURE 17-28: PIC12HV609/615 IPD WDT vs. VDD
FIGURE 17-29: PIC12HV609/615 IPD BOR vs. VDD
0
100
200
300
400
500
VDD (V)
IPD CMP (μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
50
100
150
200
250
300
350
400
VDD (V)
IPD WDT (μA)
1 2 3 4 5
Typical
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
100
150
200
250
300
350
400
VDD (V)
IPD BOR (μA)
2 3 4 5
Typical
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 183
PIC12F609/615/617/12HV609/615
FIGURE 17-30: PIC12HV609/615 IPD CVREF (LOW RANGE) vs. VDD
FIGURE 17-31: PIC12HV609/615 IPD CVREF (HI RANGE) vs. VDD
FIGURE 17-32: PIC12HV609/615 IPD T1OSC vs. VDD
0
100
200
300
400
500
VDD (V)
IPD CVREF (μA)
1 2 3 4 5
Typical
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
VDD (V)
IPD CVREF (μA)
0
100
200
300
400
500
1 2 3 4 5
Typical
Typical: Statistical Mean @25°C Maximum
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
50
100
150
200
250
300
350
400
VDD (V)
IPD T1OSC (μA)
1 2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 184 2010 Microchip Technology Inc.
FIGURE 17-33: PIC12HV615 IPD A/D vs. VDD
FIGURE 17-34: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V)
0
50
100
150
200
250
300
350
400
VDD (V)
IPD A2D (μA)
2 3 4 5
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Max. 125°C
Min. -40°C
Max. 85°C
Typical 25°C
2010 Microchip Technology Inc. DS41302D-page 185
PIC12F609/615/617/12HV609/615
FIGURE 17-35: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V)
FIGURE 17-36: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Max. 85°C
Typ. 25°C
Min. -40°C
Max. 125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0
IOH (mA)
VOH (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 186 2010 Microchip Technology Inc.
FIGURE 17-37: VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V)
FIGURE 17-38: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
3.0
3.5
4.0
4.5
5.0
5.5
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0
IOH (mA)
VOH (V)
Max. -40°C
Typ. 25°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Min. 125°C
0.5
0.7
0.9
1.1
1.3
1.5
1.7
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 187
PIC12F609/615/617/12HV609/615
FIGURE 17-39: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
FIGURE 17-40: TYPICAL HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VIH Max. 125°C
VIH Min. -40°C
VIL Min. 125°C
VIL Max. -40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
2
4
6
8
10
12
14
16
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (μs)
85°C
25°C
-40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 188 2010 Microchip Technology Inc.
FIGURE 17-41: MAXIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
FIGURE 17-42: MINIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
0
5
10
15
20
25
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (μs)
-40°C
85°C
25°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
1
2
3
4
5
6
7
8
9
10
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (s)
-40°C
25°C
85°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 189
PIC12F609/615/617/12HV609/615
FIGURE 17-43: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (25°C)
FIGURE 17-44: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (85°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
PIC12F609/615/617/12HV609/615
DS41302D-page 190 2010 Microchip Technology Inc.
FIGURE 17-45: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (125°C)
FIGURE 17-46: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (-40°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
2010 Microchip Technology Inc. DS41302D-page 191
PIC12F609/615/617/12HV609/615
FIGURE 17-47: 0.6V REFERENCE VOLTAGE vs. TEMP (TYPICAL)
FIGURE 17-48: 1.2V REFERENCE VOLTAGE vs. TEMP (TYPICAL)
FIGURE 17-49: SHUNT REGULATOR VOLTAGE vs. INPUT CURRENT (TYPICAL)
0.56
0.57
0.58
0.59
0.6
0.61
-60 -40 -20 0 20 40 60 80 100 120 140
Temp (C)
Reference Voltage (V)
2.5V
4V
5V
5.5V
3V
1.2
1.21
1.22
1.23
1.24
1.25
1.26
-60 -40 -20 0 20 40 60 80 100 120 140
Temp (C)
Reference Voltage (V)
2.5V
3V
4V
5V
5.5V
4.96
4.98
5
5.02
5.04
5.06
5.08
5.1
5.12
5.14
5.16
0 10 20 30 40 50 60
Input Current (mA)
Shunt Regulator Voltage (V)
25°C
85°C
125°C
-40°C
PIC12F609/615/617/12HV609/615
DS41302D-page 192 2010 Microchip Technology Inc.
FIGURE 17-50: SHUNT REGULATOR VOLTAGE vs. TEMP (TYPICAL)
FIGURE 17-51: COMPARATOR RESPONSE TIME (RISING EDGE)
4.96
4.98
5
5.02
5.04
5.06
5.08
5.1
5.12
5.14
5.16
-60 -40 -20 0 20 40 60 80 100 120 140
Temp (C)
Shunt Regulator Voltage (V)
50 mA
40 mA
20 mA
15 mA
10 mA
4 mA
0
100
200
300
400
500
600
700
800
900
1000
2.0 2.5 4.0 5.5
VDD (V)
Response Time (nS)
Note:
V- input = Transition from VCM + 100mV to VCM - 20mV
V+ input = VCM
VCM = (VDD - 1.5V)/2
Min. -40°C
Typ. 25°C
Max. 85°C
Max. 125°C
2010 Microchip Technology Inc. DS41302D-page 193
PIC12F609/615/617/12HV609/615
FIGURE 17-52: COMPARATOR RESPONSE TIME (FALLING EDGE)
FIGURE 17-53: WDT TIME-OUT PERIOD vs. VDD OVER TEMPERATURE
0
100
200
300
400
500
600
700
800
900
1000
2.0 2.5 4.0 5.5
VDD (V)
Response Time (nS)
Max. 85°C
Typ. 25°C
Min. -40°C
Max. 125°C
Note:
V- input = Transition from VCM - 100mV to VCM + 20MV
V+ input = VCM
VCM = (VDD - 1.5V)/2
5
10
15
20
25
30
35
40
45
50
55
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VDD (V)
Time (ms)
-40°C
25°C
85°C
125°C
PIC12F609/615/617/12HV609/615
DS41302D-page 194 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 195
PIC12F609/615/617/12HV609/615
18.0 PACKAGING INFORMATION
18.1 Package Marking Information
* Standard PIC device marking consists of Microchip part number, year code, week code, and traceability code. For
PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP
devices, any special marking adders are included in QTP price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line, thus limiting the number of available characters for
customer-specific information.
e3
e3
XXXXXNNN
8-Lead PDIP (.300”)
XXXXXXXX
YYWW
017
Example
XXFXXX/P
0610
8-Lead SOIC (.150”)
XXXXXXXX
XXXXYYWW
NNN
Example
PICXXCXX
/SN0610
017
XXXXXX
8-Lead DFN (4x4 mm) (for PIC12F609/615/HV609/615
YYWW
NNN
Example
XXXXXX
XXXXXX
0610
017
XXXX e3
e3
e3
8-Lead MSOP
XXXXXX
YWWNNN
Example
602/MS
610017
XXXX
8-Lead DFN (3x3 mm)
YYWW
NNN
Example
0610
017
XXXX
devices only)
PIC12F609/615/617/12HV609/615
DS41302D-page 196 2010 Microchip Technology Inc.
18.2 Package Details
The following sections give the technical details of the packages.
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2010 Microchip Technology Inc. DS41302D-page 197
PIC12F609/615/617/12HV609/615
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b
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PIC12F609/615/617/12HV609/615
DS41302D-page 198 2010 Microchip Technology Inc.
!
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2010 Microchip Technology Inc. DS41302D-page 199
PIC12F609/615/617/12HV609/615
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PIC12F609/615/617/12HV609/615
DS41302D-page 200 2010 Microchip Technology Inc.
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2010 Microchip Technology Inc. DS41302D-page 201
PIC12F609/615/617/12HV609/615
+
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PIC12F609/615/617/12HV609/615
DS41302D-page 202 2010 Microchip Technology Inc.
+
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2010 Microchip Technology Inc. DS41302D-page 203
PIC12F609/615/617/12HV609/615
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A
This is a new data sheet.
Revision B (05/2008)
Added Graphs. Revised 28-Pin ICD Pinout, Electrical
Specifications Section, Package Details.
Revision C (09/2009)
Updated adding the PIC12F617 device throughout the
entire data sheet; Added Figure 2-2 to Memory
Organization section; Added section 3 ”FLASH
PROGRAM MEMORY SELF READ/SELF WRITE
CONTROL (FOR PIC12F617 ONLY)”; Updated
Register 12-1; Updated Table12-5 adding PMCON1,
PMCON2, PMADRL, PMADRH, PMDATL, PMDATH;
Added section 16-12 in the Electrical Specification
section; Other minor edits.
Revision D (01/2010)
Updated Figure 17-50; Revised 16.8 DC
Characteristics; Removed Preliminary Status.
APPENDIX B: MIGRATING FROM
OTHER PIC®
DEVICES
This discusses some of the issues in migrating from
other PIC devices to the PIC12F6XX Family of devices.
B.1 PIC12F675 to PIC12F609/615/
12HV609/615
TABLE B-1: FEATURE COMPARISON
Feature PIC12F675
PIC12F609/
615/
12HV609/615
Max Operating Speed 20 MHz 20 MHz
Max Program
Memory (Words)
1024 1024
SRAM (bytes) 64 64
A/D Resolution 10-bit 10-bit (615
only)
Timers (8/16-bit) 1/1 2/1 (615)
1/1 (609)
Oscillator Modes 8 8
Brown-out Reset Y Y
Internal Pull-ups RA0/1/2/4/5 GP0/1/2/4/5,
MCLR
Interrupt-on-change RA0/1/2/3/4/5 GP0/1/2/3/4/5
Comparator 1 1
ECCP N Y (615)
INTOSC Frequencies 4 MHz 4/8 MHz
Internal Shunt
Regulator
N Y
(PIC12HV609/
615)
Note: This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performance characteristics than its earlier
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
PIC12F609/615/617/12HV609/615
DS41302D-page 204 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 205
PIC12F609/615/617/12HV609/615
INDEX
A
A/D
Specifications.................................................... 164, 165
Absolute Maximum Ratings .............................................. 143
AC Characteristics
Industrial and Extended ............................................ 156
Load Conditions ........................................................ 155
ADC
Acquisition Requirements ........................................... 86
Associated registers.................................................... 88
Block Diagram............................................................. 79
Calculating Acquisition Time....................................... 86
Channel Selection....................................................... 80
Configuration............................................................... 80
Configuring Interrupt ................................................... 83
Conversion Clock........................................................ 80
Conversion Procedure ................................................ 83
Internal Sampling Switch (RSS) Impedance................ 86
Interrupts..................................................................... 81
Operation .................................................................... 82
Operation During Sleep .............................................. 82
Port Configuration....................................................... 80
Reference Voltage (VREF)........................................... 80
Result Formatting........................................................ 82
Source Impedance...................................................... 86
Special Event Trigger.................................................. 82
Starting an A/D Conversion ........................................ 82
ADC (PIC12F615/617/HV615 Only) ................................... 79
ADCON0 Register............................................................... 84
ADRESH Register (ADFM = 0) ........................................... 85
ADRESH Register (ADFM = 1) ........................................... 85
ADRESL Register (ADFM = 0)............................................ 85
ADRESL Register (ADFM = 1)............................................ 85
Analog Input Connection Considerations............................ 68
Analog-to-Digital Converter. See ADC
ANSEL Register (PIC12F609/HV609) ................................ 45
ANSEL Register (PIC12F615/617/HV615) ......................... 45
APFCON Register............................................................... 24
Assembler
MPASM Assembler................................................... 140
B
Block Diagrams
(CCP) Capture Mode Operation ................................. 90
ADC ............................................................................ 79
ADC Transfer Function ............................................... 87
Analog Input Model ............................................... 68, 87
Auto-Shutdown ......................................................... 101
CCP PWM................................................................... 94
Clock Source............................................................... 37
Comparator ................................................................. 67
Compare ..................................................................... 92
Crystal Operation........................................................ 39
External RC Mode....................................................... 40
GP0 and GP1 Pins...................................................... 47
GP2 Pins..................................................................... 48
GP3 Pin....................................................................... 49
GP4 Pin....................................................................... 50
GP5 Pin....................................................................... 51
In-Circuit Serial Programming Connections.............. 125
Interrupt Logic ........................................................... 119
MCLR Circuit............................................................. 111
On-Chip Reset Circuit ............................................... 110
PIC12F609/12HV609 ................................................... 7
PIC12F615/617/12HV615 ............................................ 8
PWM (Enhanced) ....................................................... 97
Resonator Operation .................................................. 39
Timer1 .................................................................. 57, 58
Timer2 ........................................................................ 65
TMR0/WDT Prescaler ................................................ 53
Watchdog Timer ....................................................... 122
Brown-out Reset (BOR).................................................... 112
Associated Registers................................................ 113
Specifications ........................................................... 160
Timing and Characteristics ....................................... 159
C
C Compilers
MPLAB C18.............................................................. 140
MPLAB C30.............................................................. 140
Calibration Bits.................................................................. 109
Capture Module. See Enhanced Capture/Compare/
PWM (ECCP)
Capture/Compare/PWM (CCP)
Associated registers w/ Capture................................. 91
Associated registers w/ Compare............................... 93
Associated registers w/ PWM................................... 105
Capture Mode............................................................. 90
CCP1 Pin Configuration ............................................. 90
Compare Mode........................................................... 92
CCP1 Pin Configuration ..................................... 92
Software Interrupt Mode............................... 90, 92
Special Event Trigger ......................................... 92
Timer1 Mode Selection................................. 90, 92
Prescaler .................................................................... 90
PWM Mode................................................................. 94
Duty Cycle .......................................................... 95
Effects of Reset .................................................. 96
Example PWM Frequencies and
Resolutions, 20 MHZ.................................. 95
Example PWM Frequencies and
Resolutions, 8 MHz .................................... 95
Operation in Sleep Mode.................................... 96
Setup for Operation ............................................ 96
System Clock Frequency Changes .................... 96
PWM Period ............................................................... 95
Setup for PWM Operation .......................................... 96
CCP1CON (Enhanced) Register ........................................ 89
Clock Sources
External Modes........................................................... 38
EC ...................................................................... 38
HS ...................................................................... 39
LP....................................................................... 39
OST .................................................................... 38
RC ...................................................................... 40
XT....................................................................... 39
Internal Modes............................................................ 40
INTOSC.............................................................. 40
INTOSCIO.......................................................... 40
CMCON0 Register.............................................................. 72
CMCON1 Register.............................................................. 73
Code Examples
A/D Conversion .......................................................... 83
Assigning Prescaler to Timer0.................................... 54
Assigning Prescaler to WDT....................................... 54
Changing Between Capture Prescalers ..................... 90
Indirect Addressing..................................................... 25
PIC12F609/615/617/12HV609/615
DS41302D-page 206 2010 Microchip Technology Inc.
Initializing GPIO .......................................................... 43
Saving Status and W Registers in RAM ................... 121
Writing to Flash Program Memory ..............................34
Code Protection ................................................................ 124
Comparator ......................................................................... 67
Associated registers.................................................... 78
Control ........................................................................69
Gating Timer1 ............................................................. 73
Operation During Sleep .............................................. 71
Overview..................................................................... 67
Response Time........................................................... 69
Synchronizing COUT w/Timer1 .................................. 73
Comparator Hysteresis ....................................................... 77
Comparator Voltage Reference (CVREF) ............................74
Effects of a Reset........................................................ 71
Comparator Voltage Reference (CVREF)
Response Time........................................................... 69
Comparator Voltage Reference (CVREF)
Specifications............................................................ 163
Comparators
C2OUT as T1 Gate .....................................................60
Effects of a Reset........................................................ 71
Specifications............................................................ 162
Compare Module. See Enhanced Capture/Compare/
PWM (ECCP) (PIC12F615/617/HV615 only)
CONFIG Register.............................................................. 108
Configuration Bits.............................................................. 107
CPU Features ................................................................... 107
Customer Change Notification Service ............................. 209
Customer Notification Service........................................... 209
Customer Support ............................................................. 209
D
Data EEPROM Memory
Associated Registers .................................................. 35
Data Memory....................................................................... 11
DC and AC Characteristics
Graphs and Tables ...................................................171
DC Characteristics
Extended and Industrial ............................................ 152
Industrial and Extended ............................................ 145
Development Support ....................................................... 139
Device Overview ................................................................... 7
E
ECCP. See Enhanced Capture/Compare/PWM
ECCPAS Register ............................................................. 102
EEDAT Register.................................................................. 28
EEDATH Register ............................................................... 28
Effects of Reset
PWM mode ................................................................. 96
Electrical Specifications .................................................... 143
Enhanced Capture/Compare/PWM (ECCP)
Enhanced PWM Mode ................................................ 97
Auto-Restart...................................................... 103
Auto-shutdown.................................................. 101
Half-Bridge Application ....................................... 99
Half-Bridge Application Examples..................... 104
Half-Bridge Mode ................................................ 99
Output Relationships (Active-High and
Active-Low) .................................................98
Output Relationships Diagram............................98
Programmable Dead Band Delay ..................... 104
Shoot-through Current ...................................... 104
Start-up Considerations .................................... 100
Specifications............................................................ 162
Timer Resources ........................................................ 89
Enhanced Capture/Compare/PWM
(PIC12F615/617/HV615 Only).................................... 89
Errata .................................................................................... 6
F
Firmware Instructions ....................................................... 129
Flash Program Memory Self Read/Self Write
Control (For PIC12F617 only)..................................... 27
Fuses. See Configuration Bits
G
General Purpose Register File ........................................... 12
GPIO................................................................................... 43
Additional Pin Functions ............................................. 44
ANSEL Register ................................................. 44
Interrupt-on-Change ........................................... 44
Weak Pull-Ups.................................................... 44
Associated registers ................................................... 52
GP0 ............................................................................ 47
GP1 ............................................................................ 47
GP2 ............................................................................ 48
GP3 ............................................................................ 49
GP4 ............................................................................ 50
GP5 ............................................................................ 51
Pin Descriptions and Diagrams .................................. 47
Specifications ........................................................... 158
GPIO Register .................................................................... 43
H
High Temperature Operation............................................ 167
I
ID Locations...................................................................... 124
In-Circuit Debugger........................................................... 125
In-Circuit Serial Programming (ICSP)............................... 125
Indirect Addressing, INDF and FSR registers..................... 25
Instruction Format............................................................. 129
Instruction Set................................................................... 129
ADDLW..................................................................... 131
ADDWF..................................................................... 131
ANDLW..................................................................... 131
ANDWF..................................................................... 131
MOVF ....................................................................... 134
BCF .......................................................................... 131
BSF........................................................................... 131
BTFSC...................................................................... 131
BTFSS ...................................................................... 132
CALL......................................................................... 132
CLRF ........................................................................ 132
CLRW....................................................................... 132
CLRWDT .................................................................. 132
COMF ....................................................................... 132
DECF........................................................................ 132
DECFSZ ................................................................... 133
GOTO....................................................................... 133
INCF ......................................................................... 133
INCFSZ..................................................................... 133
IORLW...................................................................... 133
IORWF...................................................................... 133
MOVLW.................................................................... 134
MOVWF.................................................................... 134
NOP.......................................................................... 134
RETFIE..................................................................... 135
RETLW..................................................................... 135
RETURN................................................................... 135
2010 Microchip Technology Inc. DS41302D-page 207
PIC12F609/615/617/12HV609/615
RLF ........................................................................... 136
RRF........................................................................... 136
SLEEP ...................................................................... 136
SUBLW..................................................................... 136
SUBWF..................................................................... 137
SWAPF ..................................................................... 137
XORLW..................................................................... 137
XORWF..................................................................... 137
Summary Table......................................................... 130
INTCON Register................................................................ 20
Internal Oscillator Block
INTOSC
Specifications............................................ 157, 158
Internal Sampling Switch (RSS) Impedance........................ 86
Internet Address................................................................ 209
Interrupts........................................................................... 118
ADC ............................................................................ 83
Associated Registers ................................................ 120
Context Saving.......................................................... 121
GP2/INT.................................................................... 118
GPIO Interrupt-on-Change........................................ 119
Interrupt-on-Change.................................................... 44
Timer0....................................................................... 119
TMR1 .......................................................................... 60
INTOSC Specifications ............................................. 157, 158
IOC Register ....................................................................... 46
L
Load Conditions ................................................................ 155
M
MCLR................................................................................ 111
Internal ...................................................................... 111
Memory Organization.......................................................... 11
Data ............................................................................ 11
Program...................................................................... 11
Microchip Internet Web Site.............................................. 209
Migrating from other PICmicro Devices ............................ 203
MPLAB ASM30 Assembler, Linker, Librarian ................... 140
MPLAB ICD 2 In-Circuit Debugger ................................... 141
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator .................................................... 141
MPLAB Integrated Development Environment Software .. 139
MPLAB PM3 Device Programmer .................................... 141
MPLAB REAL ICE In-Circuit Emulator System................. 141
MPLINK Object Linker/MPLIB Object Librarian ................ 140
O
OPCODE Field Descriptions............................................. 129
Operation During Code Protect........................................... 32
Operation During Write Protect ........................................... 32
Operational Amplifier (OPA) Module
AC Specifications...................................................... 163
OPTION Register................................................................ 19
OPTION_REG Register ...................................................... 55
Oscillator
Associated registers.............................................. 41, 63
Oscillator Module .......................................................... 27, 37
EC............................................................................... 37
HS............................................................................... 37
INTOSC ...................................................................... 37
INTOSCIO................................................................... 37
LP................................................................................ 37
RC............................................................................... 37
RCIO........................................................................... 37
XT ............................................................................... 37
Oscillator Parameters ....................................................... 157
Oscillator Specifications.................................................... 156
Oscillator Start-up Timer (OST)
Specifications ........................................................... 160
OSCTUNE Register............................................................ 41
P
P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/
PWM (ECCP) ............................................................. 97
Packaging......................................................................... 195
Marking..................................................................... 195
PDIP Details ............................................................. 196
PCL and PCLATH............................................................... 25
Stack........................................................................... 25
PCON Register ........................................................... 23, 113
PICSTART Plus Development Programmer..................... 142
PIE1 Register ..................................................................... 21
Pin Diagram
PIC12F609/HV609 (PDIP, SOIC, MSOP, DFN)........... 4
PIC12F615/617/HV615 (PDIP, SOIC, MSOP, DFN).... 5
Pinout Descriptions
PIC12F609/12HV609 ................................................... 9
PIC12F615/617/12HV615 .......................................... 10
PIR1 Register ..................................................................... 22
PMADRH and PMADRL Registers ..................................... 27
PMCON1 and PMCON2 Registers..................................... 27
Power-Down Mode (Sleep)............................................... 123
Power-on Reset (POR)..................................................... 111
Power-up Timer (PWRT) .................................................. 111
Specifications ........................................................... 160
Precision Internal Oscillator Parameters .......................... 158
Prescaler
Shared WDT/Timer0................................................... 54
Switching Prescaler Assignment ................................ 54
Program Memory................................................................ 11
Map and Stack............................................................ 11
Programming, Device Instructions.................................... 129
Protection Against Spurious Write...................................... 32
PWM Mode. See Enhanced Capture/Compare/PWM........ 97
PWM1CON Register......................................................... 105
R
Reader Response............................................................. 210
Reading the Flash Program Memory.................................. 30
Read-Modify-Write Operations ......................................... 129
Registers
ADCON0 (ADC Control 0) .......................................... 84
ADRESH (ADC Result High) with ADFM = 0) ............ 85
ADRESH (ADC Result High) with ADFM = 1) ............ 85
ADRESL (ADC Result Low) with ADFM = 0).............. 85
ADRESL (ADC Result Low) with ADFM = 1).............. 85
ANSEL (Analog Select) .............................................. 45
APFCON (Alternate Pin Function Register) ............... 24
CCP1CON (Enhanced CCP1 Control) ....................... 89
CMCON0 (Comparator Control 0) .............................. 72
CMCON1 (Comparator Control 1) .............................. 73
CONFIG (Configuration Word) ................................. 108
Data Memory Map (PIC12F609/HV609) .................... 12
Data Memory Map (PIC12F615/617/HV615) ............. 13
ECCPAS (Enhanced CCP Auto-shutdown Control) . 102
EEDAT (EEPROM Data) ............................................ 28
EEDATH (EEPROM Data) ......................................... 28
GPIO........................................................................... 43
INTCON (Interrupt Control) ........................................ 20
IOC (Interrupt-on-Change GPIO) ............................... 46
OPTION_REG (OPTION)........................................... 19
PIC12F609/615/617/12HV609/615
DS41302D-page 208 2010 Microchip Technology Inc.
OPTION_REG (Option) .............................................. 55
OSCTUNE (Oscillator Tuning) .................................... 41
PCON (Power Control Register) ................................. 23
PCON (Power Control) ............................................. 113
PIE1 (Peripheral Interrupt Enable 1)........................... 21
PIR1 (Peripheral Interrupt Register 1) ........................ 22
PWM1CON (Enhanced PWM Control) ..................... 105
Reset Values (PIC12F609/HV609) ........................... 115
Reset Values (PIC12F615/617/HV615) .................... 116
Reset Values (special registers) ............................... 117
Special Function Registers ......................................... 12
Special Register Summary (PIC12F609/HV609).. 14, 16
Special Register Summary
(PIC12F615/617/HV615) .............................. 15, 17
STATUS......................................................................18
T1CON........................................................................62
T2CON........................................................................66
TRISIO (Tri-State GPIO) ............................................. 44
VRCON (Voltage Reference Control) ......................... 76
WPU (Weak Pull-Up GPIO) ........................................ 46
Reset................................................................................. 110
Revision History ................................................................ 203
S
Shoot-through Current ...................................................... 104
Sleep
Power-Down Mode ...................................................123
Wake-up....................................................................123
Wake-up using Interrupts.......................................... 123
Software Simulator (MPLAB SIM)..................................... 140
Special Event Trigger.......................................................... 82
Special Function Registers .................................................12
STATUS Register................................................................ 18
T
T1CON Register.................................................................. 62
T2CON Register.................................................................. 66
Thermal Considerations .................................................... 154
Time-out Sequence........................................................... 113
Timer0................................................................................. 53
Associated Registers .................................................. 55
External Clock............................................................. 54
Interrupt....................................................................... 55
Operation .............................................................. 53, 57
Specifications............................................................ 161
T0CKI ..........................................................................54
Timer1................................................................................. 57
Associated registers.................................................... 63
Asynchronous Counter Mode ..................................... 59
Reading and Writing ........................................... 59
Comparator Synchronization ...................................... 61
ECCP Special Event Trigger
(PIC12F615/617/HV615 Only) ............................61
ECCP Time Base (PIC12F615/617/HV615 Only) .......60
Interrupt....................................................................... 60
Modes of Operation .................................................... 57
Operation During Sleep .............................................. 60
Oscillator ..................................................................... 59
Prescaler..................................................................... 59
Specifications............................................................ 161
Timer1 Gate
Inverting Gate .....................................................60
Selecting Source........................................... 60, 73
Synchronizing COUT w/Timer1 .......................... 73
TMR1H Register ......................................................... 57
TMR1L Register.......................................................... 57
Timer2 (PIC12F615/617/HV615 Only)
Associated registers ................................................... 66
Timers
Timer1
T1CON ............................................................... 62
Timer2
T2CON ............................................................... 66
Timing Diagrams
A/D Conversion......................................................... 165
A/D Conversion (Sleep Mode).................................. 166
Brown-out Reset (BOR)............................................ 159
Brown-out Reset Situations ...................................... 112
CLKOUT and I/O ...................................................... 158
Clock Timing............................................................. 156
Comparator Output ..................................................... 67
Enhanced Capture/Compare/PWM (ECCP)............. 162
Half-Bridge PWM Output .................................... 99, 104
INT Pin Interrupt ....................................................... 120
PWM Auto-shutdown
Auto-restart Enabled......................................... 103
Firmware Restart .............................................. 103
PWM Output (Active-High) ......................................... 98
PWM Output (Active-Low) .......................................... 98
Reset, WDT, OST and Power-up Timer ................... 159
Time-out Sequence
Case 1 .............................................................. 114
Case 2 .............................................................. 114
Case 3 .............................................................. 114
Timer0 and Timer1 External Clock ........................... 161
Timer1 Incrementing Edge ......................................... 61
Wake-up from Interrupt............................................. 124
Timing Parameter Symbology .......................................... 155
TRISIO................................................................................ 43
TRISIO Register ................................................................. 44
V
Voltage Reference (VR)
Specifications ........................................................... 163
Voltage Reference. See Comparator Voltage
Reference (CVREF)
Voltage References
Associated registers ................................................... 78
VP6 Stabilization ........................................................ 74
VREF. SEE ADC Reference Voltage
W
Wake-up Using Interrupts ................................................. 123
Watchdog Timer (WDT).................................................... 121
Associated registers ................................................. 122
Specifications ........................................................... 160
WPU Register ..................................................................... 46
Writing the Flash Program Memory .................................... 32
WWW Address ................................................................. 209
WWW, On-Line Support ....................................................... 6
2010 Microchip Technology Inc. DS41302D-page 209
PIC12F609/615/617/12HV609/615
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
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Technical support is available through the web site
at: http://support.microchip.com
PIC12F609/615/617/12HV609/615
DS41302D-page 210 2010 Microchip Technology Inc.
READER RESPONSE
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PIC12F609/615/617/12HV609/615 DS41302D
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2010 Microchip Technology Inc. DS41302D-page 211
PIC12F609/615/617/12HV609/615
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX XXX
Temperature Package Pattern
Range
Device
Device: PIC12F609, PIC12F609T(1), PIC12HV609, PIC12HV609T(1),
PIC12F615, PIC12F615T(1), PIC12HV615, PIC12HV615T(1),
PIC12F617, PIC12F617T(1)
Temperature
Range:
H = -40C to +150C (High Temp)(3)
I = -40C to +85C (Industrial)
E = -40C to +125C (Extended)
Package: P = Plastic DIP (PDIP)
SN = 8-lead Small Outline (150 mil) (SOIC)
MS = Micro Small Outline (MSOP)
MF = 8-lead Plastic Dual Flat, No Lead (3x3) (DFN)
MD = 8-lead Plastic Dual Flat, No Lead
(4x4)(DFN)(1,2)
Pattern: QTP, SQTP or ROM Code; Special Requirements
(blank otherwise)
Examples:
a) PIC12F615-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
b) PIC12F615-I/SN = Industrial Temp., SOIC
package, 20 MHz
c) PIC12F615T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
d) PIC12F609T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
e) PIC12HV615T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
f) PIC12HV609T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
g) PIC12F617T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
h) PIC12F617-I/P = Industrial Temp., PDIP package,
20 MHz
i) PIC12F615-H/SN = High Temp., SOIC package,
20 MHz
Note 1: T = in tape and reel for MSOP, SOIC and
DFN packages only.
2: Not available for PIC12F617.
3: High Temp. available for PIC12F615 only.
DS41302D-page 212 2010 Microchip Technology Inc.
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01/05/10
Passive Voltage Probes
TPP1000 · TPP0500B · TPP0502 · TPP0250 Datasheet
The TPP1000, TPP0500B, TPP0502 and TPP0250 models are highbandwidth,
general-purpose probes from Tektronix that offer breakthrough
specifications previously unrealized in this product class. Designed for use
with Tektronix MDO3000, MDO4000B, MSO/DPO4000B and MSO/
DPO5000B Series oscilloscopes, these probes provide up to 1 GHz of
analog bandwidth with less than 3.9 pF of capacitive loading.
Key performance specs
1 GHz, 500 MHz and 250 MHz probe bandwidth models
<4 pF input capacitance
10X and 2X attenuation factor
300 V CAT II input voltage
Designed for use with the MDO3000, MDO4000B, MSO/DPO4000B
and MSO/DPO5000B series oscilloscopes
Key features
Compact probe head for probing small-geometry circuit elements
Small probe body for enhanced visibility to the device-under-test
Rigid tip for secure device-under-test connectivity
Replaceable probe tip cartridges
Large accessory set for versatile connectivity
Connectivity
Integrated oscilloscope and probe measurement system provides
intelligent communication that automatically scales and adjusts units on
the oscilloscope display to match the probe attenuation
Built-in AC compensation optimizes signal path across the entire
frequency range
Applications
Low-power devices
Service
Manufacturing engineering test
Research and development
Accurate high-speed passive probing
The extremely low capacitive loading limits adverse affects on your circuits
and is more forgiving of longer ground leads. And with the probe's wide
bandwidth, you can see the high-frequency components in your signal
which is critical for high-speed applications. The TPP1000, TPP0500B and
TPP0250 passive voltage probes offer all the benefits of general-purpose
probes like high dynamic range, flexible connection options, and robust
mechanical design, while providing the performance of active probes.
Accurate low voltage
The TPP0502 offers the industry's highest bandwidth (500 MHz) and lowest
attenuation factor (2X) for making low-voltage measurements such as
ripple, a common measurement on the output of power supplies. The low
capacitive loading of the TPP0502 means long ground leads can also be
used on this probe with minimal impact on measurement quality, providing
today's engineer with the flexibility to move around their design without
worrying about ground lead length.
www.tektronix.com 1
Specifications
All specifications apply to all models unless noted otherwise.
Model overview
TPP1000 TPP0500B TPP0502 TPP0250
Attenuation 10X 10X 2X 10X
Dynamic range 300 V Cat II 300 V Cat II 300 V Cat II 300 V Cat II
Bandwidth 1 GHz 500 MHz 500 MHz 250 MHz
Input impedance at the probe tip 10 MΩ, <4 pF 10 MΩ, <4 pF 2 MΩ, 12.7 pF 10 MΩ, <4 pF
Cable length 1.3 m 1.3 m 1.3 m 1.3 m
Ordering information
Models
TPP1000 1 GHz, 10X attenuation passive probe with TekVPI™ interface.
TPP0500B 500 MHz, 10X attenuation passive probe with TekVPI™ interface.
TPP0502 500 MHz, 2X attenuation passive probe with TekVPI™ interface.
TPP0250 250 MHz, 10X attenuation passive probe with TekVPI™ interface.
Standard accessories
Description Quantity included Reorder part number
Rigid tip 3.8 mm 1 206-0610-00
Flex ground spring SHORT 3.8 mm 2 016-2034-00
Long ground spring 2 016-2028-00
Alligator ground (6 in.) 1 196-3521-00
Hook tip (regular) 1 013-0362-00
Hook tip (micro) 1 013-0363-00
IC cap (universal) 3.8 mm 1 013-0366-00
Datasheet
2 www.tektronix.com
Recommended accessories
Description Quantity included Reorder part number
Alligator ground (12 in.) 1 196-3512-00
6 in. clip-on ground lead (with 0.025 in. pin receptacle) 1 196-3198-01
Microcircuit test tip 1 206-0569-00
Wire, 32 AWG (spool) 1 020-3045-00
BNC to probe tip adapter 1 013-0367-00
PCB to probe tip adapter, pack of 10 1 016-2016-00
Compact probe tip chassis mount test jack 1 131-4210-00
Color bands (set of 4 color-coded bands) 1 016-0633-00
Tweaker tool 1 003-1433-02
Options
Service options
Opt. SILV100 Standard warranty extended to 5 years
Opt. SILV200 Standard warranty extended to 5 years
Probes and accessories are not covered by the oscilloscope warranty and Service Offerings. Refer to the datasheet of each probe and accessory model for its unique warranty
and calibration terms.
Tektronix is registered to ISO 9001 and ISO 14001 by SRI Quality System Registrar.
Product(s) complies with IEEE Standard 488.1-1987, RS-232-C, and with Tektronix Standard Codes and Formats.
TPP1000, TPP0500B, TPP0502, TPP0250 Passive Voltage Probes
www.tektronix.com 3
Datasheet
ASEAN / Australasia (65) 6356 3900 Austria 00800 2255 4835* Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777
Belgium 00800 2255 4835* Brazil +55 (11) 3759 7627 Canada 1 800 833 9200
Central East Europe and the Baltics +41 52 675 3777 Central Europe & Greece +41 52 675 3777 Denmark +45 80 88 1401
Finland +41 52 675 3777 France 00800 2255 4835* Germany 00800 2255 4835*
Hong Kong 400 820 5835 India 000 800 650 1835 Italy 00800 2255 4835*
Japan 81 (3) 6714 3010 Luxembourg +41 52 675 3777 Mexico, Central/South America & Caribbean 52 (55) 56 04 50 90
Middle East, Asia, and North Africa +41 52 675 3777 The Netherlands 00800 2255 4835* Norway 800 16098
People's Republic of China 400 820 5835 Poland +41 52 675 3777 Portugal 80 08 12370
Republic of Korea 001 800 8255 2835 Russia & CIS +7 (495) 6647564 South Africa +41 52 675 3777
Spain 00800 2255 4835* Sweden 00800 2255 4835* Switzerland 00800 2255 4835*
Taiwan 886 (2) 2722 9622 United Kingdom & Ireland 00800 2255 4835* USA 1 800 833 9200
* European toll-free number. If not accessible, call: +41 52 675 3777 Updated 10 April 2013
For Further Information. Tektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit www.tektronix.com.
Copyright © Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specification and
price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks, or registered trademarks of their respective companies.
10 Feb 2014 51W-26151-5
www.tektronix.com
http://www.farnell.com/datasheets/1807245.pdf
AVR172: Sensorless Commutation of Brushless
DC Motor (BLDC) using ATmega32M1 and
ATAVRMC320
Features
• Robust sensorless commutation control
• Ramp-up sequence
References
[1] ATmega32M1 Data sheet
[2] AVR194: Brushless DC Motor Control using ATmega32M1
[3] AVR430: MC300 Hardware User Guide
[4] AVR470: MC310 User Guide
[5] AVR471: MC320 Getting Started Guide
[6] AVR928: Sensorless methods to drive BLDC motors
1 Introduction
This application note describes how to implement a sensorless commutation of
BLDC motors with the ATAVRMC320 development kit.
The ATmega32M1 is equipped with integrated peripherals that reduce the number
of external components required in a BLDC application. The ATmega32M1 is
suitable for sensorless commutation and for commutation with Hall sensors as well,
but this application note focuses on the sensorless commutation.
The AVR928 Application Note describes the theory of the sensorless control
method and must be carefully read first.
8-bit
Microcontrollers
Application Note
Rev. 8306B-AVR-05/10
2 AVR172
8306B-AVR-05/10
2 Hardware
The hardware includes the ATAVRMC310 and ATAVRMC300 boards which are the
two parts of the ATAVRMC320 Starter kit.
Please refer to the ATAVRMC300 and ATAVRMC310 user guides :
- AVR430: MC300 Hardware User Guide
- AVR470: MC310 Hardware User Guide
2.1 MC310 jumpers setting
The AVR172 firmware has been developed with the following jumper settings:
Table 2-1.ATAVRMC310 jumpers setting for sensorless control
Designator Setting Function
J5 Vm connect PB4 to Vm’ (motor voltage measurement if necessary)
J6 PFC OC Connect to overcurrent signal
J7 none used by CAN applications
J8 ShCo connect PC5 to ShCo for current measurement
J9 GNDm connect PC4 to GNDm for current measurement
J12 TxD connect PD3 to the RS232 driver
MOSI A Connect PD3 to ISP connector (for ISP use)
RxDUSB Connect PD3 to RxD1 (for USB interface use)
J13 RxD connect PD4 to the RS232 driver
SCK Connect PD3 to ISP connector (for ISP use)
TxDUSB Connect PD3 to RxD1 (for USB interface use)
J15 none used by CAN application to add a termination resistor
J21 Cmp- connect ACMP0- to V+W bemf conditioning
J22 Cmp+ connect ACMP0+ to U bemf conditioning
J23 Cmp- connect ACMP1- to U+W bemf conditioning
J24 Cmp+ connect ACMP1+ to V bemf conditioning
J25 Cmp- connect ACMP2- to U+V bemf conditioning
J26 Cmp+ connect ACMP2+ to W bemf conditioning
J28 VCC supply the on board USB dongle from the board power supply
See also following picture of MC310 Jumpers configurations :
AVR172
3
8306B-AVR-05/10
Figure 1. MC310 Jumpers configuration
2.2 MC300 jumper settings
Table 2-1. ATAVRMC300 jumpers setting for sensorless control
Designator Setting Function
J2 none provide +5V to supply the ATAVRMC310 board
On ATAVRMC300, Vm and Vin connectors can be supplied from the same +12V/7A
power supply. Nevertheless a separate +12V/1A can also be used to supply the Vin
(processor supply voltage).
2.3 Power-supply
This firmware example has been configured according to a power-supply Vm=12V.
This power-supply must be able to provide up to 4A output current.
2.4 Motor
The BLDC motor provided inside MC320 and MC300 Motor Control Kit has the
following characteristics:
Manufacturer : TECMOTION
Number of phases : 3
Number of poles : 8 (4 pairs)
Rated voltage : 24V
Rated speed : 4000 rpm
Rated torque : 62.5 Nm
Torque constant : 35 Nm/A = k_tau
4 AVR172
8306B-AVR-05/10
Line to Line Resistance : 1.8 ohm = R
Back EMF : 3.66 V/Krpm = k_e
Peak current : 5.4A
As Vm=12V, the rated speed will be 2000 rpm.
2.5 ATmega32M1 Configuration
ATmega32M1 must be programmed to run at 16MHz using PLL (set corresponding
Fuse bits).
The CKDIV8 fuse must be disabled.
Extended/High/Low Fuses configurations are : FF/DF/F3
2.6 Technical Advices
2.6.1 Disconnecting the BLDC Motor
The BLDC motor must not be disconnected while it is running or while its coils carry
current. It is allowed to disconnect a BLDC motor if the PWM duty cycle is 0% and the
rotor is at rest so that no current is driven through the coils. Be careful, when stopping
the power supply or PWM, a BLDC motor with a high moment of inertia is able to run
for a relatively long time.
2.6.2 Ground and Power Wirings
One design its own board has to take care of the ground wiring and power wiring. The
power supply of the processor and additional signal conditioning components (e.g.
additional fast comparators, operational amplifiers, …) has to be decoupled from the
motor power supply. The ground connection has to be of low resistance and low
inductance to prevent against voltage drop and noise due to high currents. A ground
plane within a multi layer PCB is recommended for proper operation.
3 Firmware
The example firmware is based on the Sensorless method described in AVR928
Application Note.
It is operating in sensorless mode using the ATmega32M1 internal comparators. Hall
sensor wires of the BLDC motor of the kit can remain unconnected.
The source file directory embeds an html documentation which can be opened
through the readme.html file.
The theory of the different tasks has been detailed in AVR928. The application to
ATmega32M1 is detailed in following sections.
3.1 Main Flow chart
The firmware main flowchart is described below :
AVR172
5
8306B-AVR-05/10
Figure 2. Main flow chart
The tasks are scheduled thanks to the g_tick produced each 1.024ms with Timer0.
6 AVR172
8306B-AVR-05/10
3.2 MS_ALIGN phase
The ALIGN phase forces the motor at a specific position. The time of this phase is
controlled with ALIGN_TIME constant which is the ru_period_counter initial value
(200 for MC310 motor).
3.3 RAMP_UP phase
The ramp-up charateristics (duty-cycles and times) are stored in two tables:
• ramp_up_duty_table[] : which provides the duty_cycle of the step
• ramp_up_time_table[] : which provides the length of the step (ru_step_length)
These two tables are specific to the motor and the application.
The scanning of the step sequences and the monitoring of the step length are
achieved thanks to three independant counters :
- ru_step_length_cntr : which counts the commutation time (up to ru_step_length
variable)
- ru_period_counter : which counts the step length (up to RAMP_UP_PERIOD
constant)
- ramp_up_index : which counts the step numbers (up to
RAMP_UP_INDEX_MAX constant)
The figure below provides a waveform of steps timing :
Figure 3. Steps timing
AVR172
7
8306B-AVR-05/10
3.3.1 Time of steps
The step time is RAMP_UP_PERIOD = 50ms.
3.3.2 Number of steps
The parameter : RAMP_UP_INDEX_MAX = 9, defines 10 steps ramp up.
3.3.3 Parameters tables
In firmware example, the tables have been defined according to the characteristics of
the motor provided in the kit (see parameters in 2.4 Motor section) :
ramp_up_time_table[] = {26,23,20,17,14,11,8,5,3,2,2};
ramp_up_duty_table[] = {122,124,126,129,131,133,135,137,140,143,145};
3.3.4 Sp1/pwm1
The usual parameters described in AVR928 Application Note are:
• Pwm1 = 50%
• Sp1 = Sp_max/60
The parameters defined with MC310 Tecmotion motor are:
• Pwm1 = 48% (= 122/256)
• Sp1 :
Sp1 is defined thanks to the initialization value of ru_step_length :
ru_step_length = RAMP_UP_STEP_MAX = 40
This variable determines one commutation each 40ms.
So an electrical rotation time is 120ms. As the motor has 4 pairs of poles, the
mechanical rotation time is 480ms. So the rotation speed is 60/0.48 = 125 rpm.
So Sp1 = Sp_max/32.
The second value of ru_step_length is 26 in the time table. It defines the following
commutation time.
3.3.5 Sp2/pwm2
The theorical parameters described in AVR928 Application Note are:
• Pwm2 = 60%
• Sp2 = Sp_max/6 = Sp1 / 10
The parameters defined with Tecmotion motor are:
• Pwm2 = 57% (= 145/256)
• Sp2 :
Sp2 is defined thanks to the last value of ru_step_length : 2
This variable determines one commutation each 4ms.
So an electrical rotation time is 12ms. As the motor has 4 pairs of poles, the
mechanical rotation time is 48ms. So the rotation speed is 60/0.048 = 1250 rpm.
So Sp2 = Sp_max/3.2.
8 AVR172
8306B-AVR-05/10
This confirms also the usual ratio = 10 between Sp1 and Sp2 which is defined in
AVR498 Application Note.
3.4 LAST_RAMP_UP phase
To avoid a shorten last step, this phase monitors the last ramp-up step to guarantee it
is ended properly before running in closed loop.
3.5 RUNNING Phase
3.5.1 Closed-loop block diagram
The Running phase is a sensorless closed loop which block diagram is following :
Figure 4. Closed-loop block diagram
AVR172
9
8306B-AVR-05/10
3.5.2 Running flowchart
The flowchart is following :
Figure 5. Closed-loop flowchart
•
Motor_state is kept equal to MS_RUNNING
mci_set_ref_speed() function updates the speed setpoint according to the
potentiometer adjustment or the speed command received on serial transmission.
In mc_regulation_loop() function, duty_cycle_reference is the duty_cycle variable
which controls the PWM generator. This variable is the result of following functions :
• In OPEN_LOOP:
mci_set_ref_speed() function
• In SPEED_LOOP:
10 AVR172
8306B-AVR-05/10
mc_control_speed(2*mci_get_ref_speed())
duty-cycle_reference is calculated from ref_speed and from
monitored mci_get_measured_speed()
measured_speed = (KSPEED * 4) / mci_measured_period
with mci_measured_period calculated in the Interrupt vector of
Analog Comparator 1. This interrupt uses Timer 0 to compute the
period.
• In CURRENT_LOOP :
mc_control_current(mc_get_potentiometer_value()
3.5.3 Sensorless Detection and Commutation Management
The analog comparators 0, 1 and 2 are used to detect the zero crossing of the U, V
and W phases.
The timer 1 is used to monitor the time between two consecutive zero crossings. This
time corresponds to one sector of the electrical rotation of the motor. It equals 60° of
the entire electrical period of the motor.
When a zero crossing event occurs, the timer 1 value is stored. Then this value is
divided by 2 (providing the 30° time) and loaded into the Compare A register of timer
1. Then this value is added to the half of itself to provide the 45° time and loaded into
the Compare B register of timer 1.
The timer 1 compare A event occurs 30° after the zero crossing. It activates the next
commutation state and masks the zero crossing to avoid the discharge of the
inductance (demagnetization) pulse generated at the end of a step when the active
switches are released.
Due to the inductance of the motor coils, a voltage equals to -Ldi/dt is generated, the
demagnetization is done through the diodes of the power bridge.
The timer 1 compare B event releases the zero crossing mask : enables the
comparator n interrupt according to the motor_step variable. This Timer1 interrupt
provides the demagnetization mask delay.
AVR172
11
8306B-AVR-05/10
4 RS232 Communication with firmware
4.1 Connecting ATAVRMC310 to use the RS232 interface
Connect PC com port to the ATAVRMC310 RS232 connector through a direct cable.
The serial configuration is:
• 38400 bauds,
• 8 bit data bit,
• 1 stop bit,
• no handshake,
4.2 PC applications
User can communicate with firmware through RS232 with usual PC serial
communication applications (i.e. Hyperterminal) or the Atmel “Motor Control Center”
application which can be downloaded from Atmel web at url : http://www.atmel.com
4.2.1 PC Terminal : RS232 Messages and Commands
At power up the following welcome message is received on terminal :
“ATMEL Motor Control Interface”.
The following commands can be sent to the firmware:
Table 2-1. List of commands
Command Action
ru Run motor
st Stop Motor
help Gives help
fw Set direction to Forward
bw Set direction to Backward
ss Set Speed (followed with speed value)
gi Get ID
g0 Get Status 0
g1 Get Status 1
4.2.2 Motor Control Center
The User Guide is available in Install directory at URL :
C:\Program Files\Atmel\Motor Control Center\help\Overview.htm
The AVR172 Target must be selected first to get the right configuration :
To select a target, execute the File > Select Target command or click the
button in the toolbar. The following dialog pops up:
12 AVR172
8306B-AVR-05/10
Figure 6. Motor Control Center Interface
5 USB communication
Communication can be achieved from PC to USB connector of MC310 board.
The AVR470, MC310 Hardware User Guide details the configuration to be achieved.
Communication port becomes a Virtual Com port. Same tools as described in section
4 (RS232 Communication with firmware), can be used through this Virtual Com port.
8306B-AVR-05/10
Disclaimer
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http://www.farnell.com/datasheets/1734386.pdf
1. Product profile
1.1 General description
NPN/NPN general-purpose transistor pair in a small SOT457 (SC-74) Surface-Mounted
Device (SMD) plastic package.
1.2 Features
■ Low collector capacitance
■ Low collector-emitter saturation voltage
■ Closely matched current gain
■ Reduces number of components and board space
■ No mutual interference between the transistors
■ AEC-Q101 qualified
1.3 Applications
■ General-purpose switching and amplification
1.4 Quick reference data
BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
Rev. 01 — 25 August 2009 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
VCEO collector-emitter voltage open base - - 45 V
IC collector current - - 100 mA
hFE DC current gain VCE = 5 V; IC = 2 mA 200 300 450BC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 2 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 emitter TR1
2 base TR1
3 collector TR2
4 emitter TR2
5 base TR2
6 collector TR1
1 3 2
6 5 4
sym020
1 2 3
6 5
TR1
TR2
4
Table 3. Ordering information
Type number Package
Name Description Version
BC847DS SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 4. Marking codes
Type number Marking code
BC847DS ZL
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 45 V
VEBO emitter-base voltage open collector - 6 V
IC collector current - 100 mA
ICM peak collector current single pulse;
tp ≤ 1 ms
- 200 mA
IBM peak base current single pulse;
tp ≤ 1 ms
- 200 mA
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW
Per device
Ptot total power dissipation Tamb ≤ 25 °C [1] - 380 mWBC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 3 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve SOT457 (SC-74)
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Tamb (°C)
−75 175 −25 25 75 125
006aab621
200
300
100
400
500
Ptot
(mW)
0
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point
- - 250 K/W
Per device
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 328 K/WBC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 4 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
7. Characteristics
FR4 PCB, standard footprint
Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
006aab622
10−5 10 10 −2 10−4 102 10−1
tp (s)
10−3 103 1
102
10
103
Zth(j-a)
(K/W)
1
δ = 1
0.75
0.50
0.33
0.10
0.05
0.02
0.01
0
0.20
Table 7. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
ICBO collector-base cut-off
current
VCB = 30 V; IE = 0 A - - 15 nA
VCB = 30 V; IE = 0 A;
Tj = 150 °C
--5 µA
IEBO emitter-base cut-off
current
VEB = 6 V; IC = 0 A - - 100 nA
hFE DC current gain VCE =5V
IC = 10 µA - 280 -
IC = 2 mA 200 300 450
VCEsat collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA - 55 100 mV
IC = 100 mA; IB = 5 mA - 200 300 mV
VBEsat base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA - 755 850 mV
IC = 100 mA; IB = 5 mA - 1000 - mV
VBE base-emitter voltage VCE =5V
IC = 2 mA 580 650 700 mV
IC = 10 mA - - 770 mVBC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 5 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
Cc collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
- 1.9 - pF
Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A;
f = 1 MHz
- 11 - pF
fT transition frequency VCE = 5 V; IC = 10 mA;
f = 100 MHz
100 - - MHz
NF noise figure VCE = 5 V; IC = 0.2 mA;
RS =2kΩ;
f = 10 Hz to 15.7 kHz
- 1.9 - dB
VCE = 5 V; IC = 0.2 mA;
RS =2kΩ; f = 1 kHz;
B = 200 Hz
- 3.1 - dB
Table 7. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCE =5V
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Tamb = 25 °C
Fig 3. Per transistor: DC current gain as a function of
collector current; typical values
Fig 4. Per transistor: Collector current as a function
of collector-emitter voltage; typical values
006aaa533
200
400
600
hFE
0
IC (mA)
10−2 103 102 10−1 1 10
(3)
(1)
(2)
006aaa532
VCE (V)
0 10 2 4 6 8
0.08
0.12
0.04
0.16
0.20
IC
(A)
0
IB (mA) = 4.50
2.70
3.15
4.05
3.60
0.45
0.90
1.35
1.80
2.25BC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 6 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
VCE = 5 V; Tamb = 25 °C IC/IB = 20
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 5. Per transistor: Base-emitter voltage as a
function of collector current; typical values
Fig 6. Per transistor: Base-emitter saturation voltage
as a function of collector current;
typical values
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
VCE = 5 V; Tamb = 25 °C
Fig 7. Per transistor: Collector-emitter saturation
voltage as a function of collector current;
typical values
Fig 8. Per transistor: Transition frequency as a
function of collector current; typical values
006aaa536
0.6
0.8
1
VBE
(V)
0.4
IC (mA)
10−1 103 102 1 10
006aaa534
IC (mA)
10−1 103 102 1 10
0.5
0.9
1.3
0.3
0.7
1.1
VBEsat
(V)
0.1
(1)
(2)
(3)
006aaa535
1
10−1
10
VCEsat
(V)
10−2
IC (mA)
10−1 103 102 1 10
(1)
(2)
(3)
006aaa537
IC (mA)
1 102 10
102
103
fT
(MHz)
10BC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 7 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
f = 1 MHz; Tamb = 25 °C f = 1 MHz; Tamb = 25 °C
Fig 9. Per transistor: Collector capacitance as a
function of collector-base voltage;
typical values
Fig 10. Per transistor: Emitter capacitance as a
function of emitter-base voltage; typical values
VCB (V)
0 10 2 4 6 8
006aab620
2
4
6
Cc
(pF)
0
006aaa539
VEB (V)
0 6 2 4
9
11
7
13
15
Ce
(pF)
5BC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 8 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
Fig 11. Package outline SOT457 (SC-74)
Dimensions in mm 04-11-08
3.0
2.5
1.7
1.3
3.1
2.7
pin 1 index
1.9
0.26
0.10
0.40
0.25 0.95
1.1
0.9
0.6
0.2
1 3 2
6 5 4
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BC847DS SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165BC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 9 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
11. Soldering
Fig 12. Reflow soldering footprint SOT457 (SC-74)
Fig 13. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
sot457_fr
3.45
1.95
3.3 2.825
0.45
(6×)
0.55
(6×)
0.7
(6×)
0.8
(6×)
2.4
0.95
0.95
Dimensions in mm
sot457_fw
5.3
5.05
1.45
(6×)
0.45
(2×)
1.5
(4×)
2.85
1.475
1.475
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mmBC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 10 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BC847DS_1 20090825 Product data sheet - -BC847DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 25 August 2009 11 of 12
NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BC847DS
45 V, 100 mA NPN/NPN general-purpose transistor
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 August 2009
Document identifier: BC847DS_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 8
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information. . . . . . . . . . . . . . . . . . . . . 11
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
http://www.farnell.com/datasheets/480916.pdf
Plug and Play Wireless CPU®
Fastrack Supreme
User Guide
Revision: 003
Date: November 2007
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Plug and Play Wireless CPU®
Fastrack Supreme
User Guide
Reference: WA_DEV_Fastrk_UGD_001
Revision: 003
Date: November 5, 2007
Supports Open AT® embedded ANSI C applications
Fastrack Supreme User Guide
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Document History
Revision Date List of revisions
001 June 5, 2007 First Issue
002 September 6, 2007 Update
003 November 5, 2007 Update
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Overview
The Fastrack Supreme 10 and Fastrack Supreme 20 are discrete, rugged cellular Plug
& Play Wireless CPU® offering state-of-the-art GSM/GPRS (and EGPRS for Fastrack
Supreme 20) connectivity for machine to machine applications.
Proven for reliable, stable performance on wireless networks worldwide, Wavecom’s
latest generation of Fastrack Supreme continues to deliver rapid time to market and
painless integration.
Having comparable size with the previous M1306B generation, and updated with
new features, the Fastrack Supreme offers an Internal Expansion Socket (IES)
interface accessible for customer use. Expanding application features is easy without
voiding the warrantee of the Fastrack Supreme by simply plugging in of an Internal
Expansion Socket Module (IESM) board.
Fully certified, the quad band 850/900/1800/1900 MHz Fastrack Supreme 10 offers
GPRS Class 10 capability and Fastrack Supreme 20 offers GPRS/EGPRS Class 10
capability. Both support a powerful open software platform (Open AT®). Open AT® is
the world’s most comprehensive cellular development environment, which allows
embedded standard ANSI C applications to be natively executed directly on the
Wireless CPU®.
Fastrack Supreme is controlled by firmware through a set of AT commands.
This document describes the Fastrack Supreme and gives information on the
following topics:
• general presentation,
• functional description,
• basic services available,
• technical characteristics,
• installing and using the Fastrack Supreme,
• user-level troubleshooting.
• recommended accessories to be used with the product.
Note:
This document covers the Fastrack Supreme Plug & Play alone and does not include
The programmable capabilities provided via the use of Open AT® Software
Suites.
The development guide for IESM for expanding the application feature through
the IES interface.
For detailed, please refer to the documents shown in the "Reference Documents"
section.
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RoHS Directive
The Fastrack Supreme is now compliant with RoHS Directive 2002/95/EC, which sets
limits for the use of certain restricted hazardous substances. This directive states that
"from 1st July 2006, new electrical and electronic equipment put on the market does
not contain lead, mercury, cadmium, hexavalent chromium, polybrominated
biphenyls (PBB), and polybrominated diphenyl ethers (PBDE)".
Plug & Plays which are compliant with this directive are
identified by the RoHS logo on their label.
Disposing of the product
This electronic product is subject to the EU Directive
2002/96/EC for Waste Electrical and Electronic Equipment
(WEEE). As such, this product must not be disposed off at a
municipal waste collection point. Please refer to local
regulations for directions on how to dispose off this product
in an environmental friendly manner.
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Cautions
Information furnished herein by WAVECOM is accurate and reliable. However, no
responsibility is assumed for its use. Please read carefully the safety
recommendations given in Section 9 for an application based on Fastrack Supreme
Plug & Play.
Trademarks
®, WAVECOM®, Wireless CPU®, Open AT® and certain other trademarks and logos
appearing on this document, are filed or registered trademarks of Wavecom S.A. in
France or in other countries. All other company and/or product names mentioned may
be filed or registered trademarks of their respective owners.
Copyright
This manual is copyrighted by WAVECOM with all rights reserved. No part of this
manual may be reproduced in any form without the prior written permission of
WAVECOM. No patent liability is assumed with respect to the use of their respective
owners.
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Web Site Support
General information about Wavecom and its
range of products:
www.wavecom.com
Specific support is available for the Fastrack
Supreme Plug & Play Wireless CPU®:
www.wavecom.com/fastracksupreme
Open AT® Introduction: www.wavecom.com/OpenAT
Developer community for software and
hardware:
www.wavecom.com/forum
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Contents
DOCUMENT HISTORY ...............................................................................................2
OVERVIEW................................................................................................................3
CAUTIONS ................................................................................................................5
TRADEMARKS ..........................................................................................................5
COPYRIGHT ..............................................................................................................5
WEB SITE SUPPORT .................................................................................................6
CONTENTS ...............................................................................................................7
LIST OF FIGURES ....................................................................................................11
LIST OF TABLES......................................................................................................12
1 REFERENCES.....................................................................................................14
1.1 Reference Documents..................................................................................... 14
1.1.1 Open AT® Software Documentation ........................................................ 14
1.1.2 AT Software Documentation................................................................... 14
1.1.3 Delta between M1306B Documents ....................................................... 14
1.1.4 IESM Related Documents ....................................................................... 14
1.2 Abbreviations ................................................................................................. 15
2 PACKAGING ......................................................................................................18
2.1 Contents......................................................................................................... 18
2.2 Packaging Box................................................................................................ 19
2.3 Production Labelling ....................................................................................... 20
3 GENERAL PRESENTATION.................................................................................21
3.1 Description ..................................................................................................... 21
3.2 External Connections...................................................................................... 23
3.2.1 Connectors ............................................................................................. 23
3.2.1.1 Antenna Connector ........................................................................... 23
3.2.1.2 Power Supply Connector................................................................... 23
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3.2.1.3 Sub HD 15-pin Connector ................................................................. 24
3.2.1.4 IES Connector ................................................................................... 26
3.2.2 Power Supply Cable................................................................................ 30
4 FEATURES AND SERVICES................................................................................31
4.1 Basic Features and Services ........................................................................... 31
4.2 Additional NEW Features................................................................................ 33
4.2.1 Support Additional GSM850/PCS1900 Bands......................................... 33
4.2.2 IES Interface for Easy Expansion of Application Features ........................ 33
4.2.3 Serial Port Auto Shut Down or Improving Power Consumption .............. 33
4.2.4 Real Time Clock (RTC) for Saving Date and Time .................................... 34
4.2.5 SIM Card Lock Feature............................................................................ 34
5 USING THE FASTRACK SUPREME PLUG & PLAY...............................................35
5.1 Getting Started ............................................................................................... 35
5.1.1 Mount the Fastrack Supreme.................................................................. 35
5.1.2 Insert/extract the SIM card to/from the Fastrack Supreme....................... 35
5.1.3 Set up the Fastrack Supreme .................................................................. 37
5.1.4 Check the communication with the Fastrack Supreme............................ 38
5.1.5 Reset the Fastrack Supreme.................................................................... 39
5.2 Specific Recommendations when Using the Fastrack Supreme on Trucks...... 39
5.2.1 Recommended Power Supply Connection on Trucks .............................. 39
5.2.2 Technical Constraints on Trucks ............................................................. 40
5.3 Fastrack Supreme Operational Status............................................................. 41
5.4 Echo Function Disabled .................................................................................. 42
5.5 Verify the Received Signal Strength ................................................................ 43
5.6 Check the Pin Code Status.............................................................................. 43
5.7 Switch between EU/US Band(s) ...................................................................... 44
5.8 Check the Band(s) Selection ........................................................................... 44
5.9 Verify the Fastrack Supreme Network Registration ......................................... 45
5.10 Main AT Commands for the Plug & Play ........................................................ 46
5.11 Firmware Upgrade Procedure ......................................................................... 48
6 TROUBLESHOOTING.........................................................................................49
6.1 No Communication with the Fastrack Supreme through the Serial Link.......... 49
6.2 Receiving "ERROR" Message ........................................................................... 50
6.3 Receiving "NO CARRIER" Message .................................................................. 50
7 FUNCTIONAL DESCRIPTION..............................................................................53
7.1 Architecture.................................................................................................... 53
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7.2 EU and US Bands ........................................................................................... 54
7.2.1 General Presentation............................................................................... 54
7.2.2 AT COMMAND for Bands Switch ........................................................... 54
7.3 Power Supply ................................................................................................. 54
7.3.1 General Presentation............................................................................... 54
7.3.2 Protections.............................................................................................. 54
7.4 RS232 Serial Link............................................................................................ 55
7.4.1 General Presentation............................................................................... 55
7.4.2 Autobauding Mode................................................................................. 56
7.4.3 Pin Description........................................................................................ 56
7.4.4 Serial Port Auto shut down Feature ........................................................ 56
7.5 General Purpose Input/Output (GPIO) ............................................................. 57
7.6 BOOT ............................................................................................................. 57
7.7 RESET ............................................................................................................ 58
7.7.1 General Presentation............................................................................... 58
7.7.2 Reset Sequence ...................................................................................... 58
7.8 Audio.............................................................................................................. 59
7.8.1 Microphone Inputs.................................................................................. 59
7.8.2 Speaker Outputs ..................................................................................... 60
7.9 Real Time Clock (RTC)..................................................................................... 60
7.10 FLASH LED 61
8 TECHNICAL CHARACTERISTICS ........................................................................62
8.1 Mechanical Characteristics ............................................................................. 62
8.2 Electrical Characteristics ................................................................................. 64
8.2.1 Power Supply ......................................................................................... 64
8.2.2 Power Consumption ............................................................................... 65
8.2.3 Audio Interface ....................................................................................... 68
8.2.4 General Purpose Input/Output................................................................. 69
8.2.5 SIM Interface .......................................................................................... 69
8.2.6 RESET Signal .......................................................................................... 69
8.2.7 RF Characteristics ................................................................................... 70
8.2.7.1 Frequency Ranges ............................................................................ 70
8.2.7.2 RF Performances............................................................................... 71
8.2.7.3 External Antenna .............................................................................. 71
8.3 Environmental Characteristics ........................................................................ 72
8.4 Conformity...................................................................................................... 75
8.5 Protections ..................................................................................................... 75
8.5.1 Power Supply ......................................................................................... 75
8.5.2 Overvoltage............................................................................................. 76
8.5.3 Electrostatic Discharge............................................................................ 76
8.5.4 Miscellaneous......................................................................................... 76
9 SAFETY RECOMMENDATIONS..........................................................................77
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9.1 General Safety ................................................................................................ 77
9.2 Vehicle Safety ................................................................................................. 78
9.3 Care and Maintenance.................................................................................... 78
9.4 Your Responsibility ......................................................................................... 79
10 RECOMMENDED ACCESSORIES........................................................................80
11 ONLINE SUPPORT .............................................................................................82
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List of Figures
Figure 1: Complete package contents ....................................................................... 18
Figure 2: Packaging box ........................................................................................... 19
Figure 3: Production Label ........................................................................................ 20
Figure 4: Fastrack Supreme general description........................................................ 21
Figure 5: Fastrack Supreme holding bridles .............................................................. 22
Figure 6: SMA connector for antenna connection ..................................................... 23
Figure 7: Power supply connector ............................................................................ 24
Figure 8: Sub HD 15-pin connector .......................................................................... 25
Figure 9: IES connector for feature expansion........................................................... 27
Figure 10: Power supply cable.................................................................................. 30
Figure 11: SIM card lock feature ............................................................................... 34
Figure 12: Fastrack Supreme mounting .................................................................... 35
Figure 13: Procedure for SIM card insertion.............................................................. 36
Figure 14: Procedure for SIM card extraction............................................................ 37
Figure 15: Recommended power supply connection on trucks ................................. 40
Figure 16: Example of electrical connection which may dramatically damage the
Fastrack Supreme................................................................................... 41
Figure 17: Functional architecture ............................................................................ 53
Figure 18: RS232 Serial Link signals......................................................................... 55
Figure 19: Reset sequence diagram.......................................................................... 59
Figure 20: Dimensioning diagram............................................................................. 63
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List of Tables
.
Table 1: Power supply connector pin description...................................................... 24
Table 2: Sub HD 15-pin connector description.......................................................... 25
Table 3: IES Connector Description........................................................................... 27
Table 4: Basic features of the Fastrack Supreme....................................................... 31
Table 5: Fastrack Supreme operational status .......................................................... 42
Table 6: Values of received signal strength............................................................... 43
Table 7: AT+CPIN Responses ................................................................................... 43
Table 8: AT+WMBS Band Selection ......................................................................... 44
Table 9: AT+WMBS Responses................................................................................ 44
Table 10: Values of network registration................................................................... 45
Table 11: Main usual AT commands for the Plug & Play .......................................... 46
Table 12: Solutions for no connection with Fastrack Supreme through serial link..... 49
Table 13: Solutions for "NO CARRIER" message ........................................................ 51
Table 14: Interpretation of extended error code ........................................................ 52
Table 15: Mechanical characteristics ........................................................................ 62
Table 16: Electrical characteristics ............................................................................ 64
Table 17: Effects of power supply defect .................................................................. 64
Table 18: Power consumption in connected modes (1*)........................................... 65
Table 19: Power consumption in non-connected modes(1*)..................................... 66
Table 20: Audio parameters caracteristics ................................................................ 68
Table 21: Microphone inputs internal audio filter characteristics .............................. 68
Table 22: Recommended characteristics for the microphone: ................................... 68
Table 23: Recommended characteristics for the speaker: ......................................... 69
Table 24: Operating conditions................................................................................. 69
Table 25: SIM card characteristics............................................................................ 69
Table 26: Electrical characteristics ............................................................................ 69
Table 27: Operating conditions................................................................................. 70
Table 28: Frequency ranges...................................................................................... 70
Table 29: Receiver and transmitter RF performances................................................ 71
Table 30: External antenna characteristics................................................................ 71
Table 31: Ranges of temperature.............................................................................. 72
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Table 32: Environmental standard constraints.......................................................... 73
Table 33: List of recommended accessories.............................................................. 80
Table 34: Fastrack Supreme Family .......................................................................... 81
Fastrack Supreme User Guide
References
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1 References
1.1 Reference Documents
For more details, several reference documents may be consulted. The Wavecom
reference documents are provided in the Wavecom documents package contrary to
the general reference documents, which are not Wavecom owned.
1.1.1 Open AT® Software Documentation
[1] Getting started with Open AT® SDK v4.22 (Ref.WM_DEV_OAT_UGD_048)
[2] Tutorial for Open AT® IDE V1.04 (Ref. WM_DEV_OAT_UGD_044)
[3] Tools Manual for Open AT® IDE V1.04 (Ref. WM_DEV_OAT_UGD_045)
[4] Basic Development Guide for Open AT®V4.21 (Ref. WM_DEV_OAT_UGD_050)
[5] ADL User Guide for Open AT®V4.21 (Ref. WM_DEV_OAT_UGD_051)
[6] Open AT® v4.22 Official Release Note (Ref. WM_DEV_OAT_DVD_338)
1.1.2 AT Software Documentation
[7] AT commands interface Guide for FW v6.63 (Ref. WM_DEV_OAT_UGD_049)
[8] Open AT® Firmware v6.63 Customer Release Note
(Ref.WM_PGM_OAT_CRN_001)
1.1.3 Delta between M1306B Documents
[9] Delta between M1306B and Fastrack Supreme (Ref. WA_DEV_Fastrk_UGD_004)
1.1.4 IESM Related Documents
[10] IESM Product Technical Specification (Ref. WA_DEV_Fastrk_PTS_001)
[11] IESM-GPS+USB User Guide (Ref. WA_DEV_Fastrk_UGD_002)
[12] IESM-GPS+USB Installation Guide (Ref. WA_DEV_Fastrk_UGD_003)
[13] IESM-IO+USB Installation Guide (Ref. WA_DEV_Fastrk_UGD_005)
[14] IESM-IO+USB User Guide (Ref. WA_DEV_Fastrk_UGD_006)
[15] IESM-IO+USB+GPS Installation Guide (Ref. WA_DEV_Fastrk_UGD_007)
[16] IESM-IO+USB+GPS User Guide (Ref. WA_DEV_Fastrk_UGD_008)
Note:
New versions of software may be available. Wavecom recommends customers to
check the web site for the latest documentation.
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1.2 Abbreviations
Abbreviation Definition
AC Alternating Current
ACM Accumulated Call Meter
AMR Adaptive Multi-Rate
AT ATtention (prefix for Wireless CPU® commands)
CLK CLocK
CMOS Complementary Metal Oxide Semiconductor
CS Coding Scheme
CTS Clear To Send
dB Decibel
dBc Decibel relative to the Carrier power
dBi Decibel relative to an Isotropic radiator
dBm Decibel relative to one milliwatt
DC Direct Current
DCD Data Carrier Detect
DCE Data Communication Equipment
DCS Digital Cellular System
DSR Data Set Ready
DTE Data Terminal Equipment
DTMF Dual Tone Multi-Frequency
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Only Memory
EFR Enhanced Full Rate
E-GSM Extended GSM
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
ESD ElectroStatic Discharges
ETSI European Telecommunications Standards Institute
FIT Series of connectors (micro-FIT)
FR Full Rate
FTA Full Type Approval
GCF Global Certification Forum
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Abbreviation Definition
GND GrouND
GPIO General Purpose Input Output
GPRS General Packet Radio Service
GSM Global System for Mobile communications
HR Half Rate
I Input
IEC International Electrotechnical Commission
IES Internal Expansion Socket
IESM Internal Expansion Socket Module
IMEI International Mobile Equipment Identification
I/O Input / Output
LED Light Emitting Diode
MAX MAXimum
ME Mobile Equipment
MIC MICrophone
Micro-Fit Family of connectors from Molex
MIN MINimum
MNP Microcom Networking Protocol
MO Mobile Originated
MS Mobile Station
MT Mobile Terminated
NOM NOMinal
O Output
Pa Pascal (for speaker sound pressure measurements)
PBCCH Packet Broadcast Control CHannel
PC Personal Computer
PCL Power Control Level
PDP Packet Data Protocol
PIN Personal Identity Number
PLMN Public Land Mobile Network
PUK Personal Unblocking Key
RF Radio Frequency
RFI Radio Frequency Interference
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Abbreviation Definition
RI Ring Indicator
RMS Root Mean Square
RTS Request To Send
RX Receive
SIM Subscriber Identification Module
SMA SubMiniature version A RF connector
SMS Short Message Service
SNR Signal-to-Noise Ratio
SPL Sound Pressure Level
SPK SpeaKer
SRAM Static RAM
TCP/IP Transmission Control Protocol / Internet Protocol
TDMA Time Division Multiple Access
TU Typical Urban fading profile
TUHigh Typical Urban, High speed fading profile
TX Transmit
TYP TYPical
VSWR Voltage Stationary Wave Ratio
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2 Packaging
2.1 Contents
The complete package content of the Fastrack Supreme consists of (see):
• one packaging box (A),
• one Fastrack Supreme (B),
• two holding bridles (C),
• one power supply cable with fuse integrated (D)
• a mini notice (E) with:
a summary of the main technical features,
safety recommendations,
EC declaration of conformity.
Figure 1: Complete package contents
A
D
E C
B
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2.2 Packaging Box
The packaging box is a carton box (see) with the following external dimensions:
• width: 54.5 mm,
• height: 68 mm,
• length: 108 mm.
A packaging label is slicked on the packaging box cover and supports the:
• WAVECOM logo,
• Product reference (Fastrack Supreme 20 or Fastrack Supreme 10),
• CE marking
• 15-digit IMEI code
• Open AT® Logo
• WEEE logo
Figure 2: Packaging box
The packaging label dimensions are:
• height: 40 mm,
• length: 65 mm.
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2.3 Production Labelling
A production label (see Figure 3) located at the Fastrack Supreme back side gives the
following information:
• product reference (Fastrack Supreme 10 or Fastrack Supreme 20),
• part number (WM20230),
• CE marking,
• 15-digit IMEI code,
• Open AT® logo
• Made by Wavecom
Figure 3: Production Label
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3 General Presentation
3.1 Description
The Fastrack Supreme description is given in the Figure 4 below.
IES connector for
expanding feature, like
GPS, USB, I/O
expander…
Refer to Section
3.2.1.4
Removed Screw
for Back Plate
Sub HD
connector
Micro- Fit
connector
Back Plate
SIM card inside Back Cap
SIM connector
Lock switch of
SIM connector
SMA
connector
GSM LED
Indicator
Screw for Back
Plate
Removed Back
Plate
Back Cap with 5
screws
Figure 4: Fastrack Supreme general description
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CAUTION: Users are free to remove the back plate for IESM board plug in/unplug
without voiding the warrantee of the Fastrack Supreme. However, the warrantee will
be voided if unscrewing any screw of the back cap.
In addition, two holding bridles are provided to tighten the Fastrack Supreme on a
support.
Figure 5: Fastrack Supreme holding bridles
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3.2 External Connections
3.2.1 Connectors
3.2.1.1 Antenna Connector
The antenna connector is a SMA type connector for a 50 Ω RF connection.
Figure 6: SMA connector for antenna connection
3.2.1.2 Power Supply Connector
The power supply connector is a 4-pin Micro FIT connector for:
• external DC Power Supply connection,
• GPIOs connection (two General Purpose Input/Output signals available).
SMA connector
for antenna
connection
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1 2
3 4
Figure 7: Power supply connector
Table 1: Power supply connector pin description
Pin
#
Signal I/O I/O type Description Reset
State
Comment
1 V+BATTERY I Power
supply
Battery voltage input:
5.5 V Min.
13.2 V Typ.
32 V Max.
High current
2 GND Power
supply
Ground
3 GPIO21 I/O 2V8 General Purpose
Input/output
Undefined Not mux
4 GPIO25 I/O 2V8 General Purpose
Input/output
Z Multiplex with
INT1
Warning:
Both pin 3 and pin 4 are used by GPIO interface. It is strictly prohibited to connect
them to any power supply at the risk of damage to the Fastrack Supreme.
3.2.1.3 Sub HD 15-pin Connector
The Sub D high density 15-pin connector is used for:
• RS232 serial link connection,
• Audio lines (microphone and speaker) connection,
• BOOT and RESET signal connection.
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5 4 3 2 1
10 9 8 7 6
15 14 13 12 11
Figure 8: Sub HD 15-pin connector
Table 2: Sub HD 15-pin connector description
Pin # Signal
(CCITT / EIA)
I/O I/O type Description Comment
1 CDCD/CT109 O STANDARD
RS232
RS232
Data Carrier Detect
2 CTXD/CT103 I STANDARD
RS232
RS232
Transmit serial data
3 BOOT I CMOS Boot This signal must
not be
connected. Its
use is strictly
reserved to
Wavecom or
competent
retailers.
4 CMIC2P I Analog Microphone
positive line
5 CMIC2N I Analog Microphone
negative line
6 CRXD/CT104 O STANDARD
RS232
RS232
Receive serial data
7 CDSR/CT107 O STANDARD
RS232
RS232
Data Set Ready
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Pin # Signal
(CCITT / EIA)
I/O I/O type Description Comment
8 CDTR/CT108-2 I STANDARD
RS232
RS232
Data Terminal Ready
9 GND - GND Ground
10 CSPK2P O Analog Speaker
positive line
11 CCTS/CT106 O STANDARD
RS232
RS232
Clear To Send
12 CRTS/CT105 I STANDARD
RS232
RS232
Request To Send
13 CRI/CT125 O STANDARD
RS232
RS232
Ring Indicator
14 RESET I/O Schmitt Supreme Plug & Play
reset
Active low
15 CSPK2N O Analog Speaker
negative line
3.2.1.4 IES Connector
The IES connector is a 50 pins board-to-board connector for expanding application
features like GPS, USB, I/O expander… Currently there are already 3 IESM boards
available for customer to expand the Fastrack Supreme features immediately. They
are:
IESM GPS+USB
IESM I/O+USB
IESM I/O+USB+GPS
For detail, please refer to Document in Section 1.1.4.
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For sales and support, please contact Wavecom sales/FAE or your distributor.
Figure 9: IES connector for feature expansion
Table 3: IES Connector Description
Pin Signal Name
Number Nominal Mux
I/O
type Voltage I/O* Reset
State Description Dealing with
unused pins
1 GND Ground
2 GND Ground
3 GPIO4 COL0 C8 GSM-1V8 I/O Pull-up Keypad column 0 NC
4 GPIO5 COL1 C8 GSM-1V8 I/O Pull-up Keypad column 1 NC
5 GPIO6 COL2 C8 GSM-1V8 I/O Pull-up Keypad column 2 NC
6 GPIO7 COL3 C8 GSM-1V8 I/O Pull-up Keypad column 3 NC
7 VPADUSB
VPAD-USB I USB Power supply
input
NC
8 USB-DP VPAD-USB I/O USB Data NC
9 USB-DM VPAD-USB I/O USB Data NC
10 GSM-
1V8*
GSM-1V8 O
1.8V Supply Output
(for GPIO pull-up
only)
NC
11 GSM-
2V8*
GSM-1V8 O
2.8V Supply Output
(for GPIO pull-up
only)
NC
12 BOOT
GSM-1V8 I Not Used
Add a test point / a
jumper/ a switch to
VCC_1V8 (Pin 10) in
case Download
Specific mode is
used (See product
specification for
details)
Pin 2
Pin 1
Pin 50
Pin 49
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Pin Signal Name
Number Nominal Mux
I/O
type Voltage I/O* Reset
State Description Dealing with
unused pins
13 ~RESET C4 GSM-1V8 I/O RESET Input NC or add a test
point
14 AUX-ADC A2 Analog I Analog to Digital
Input
Pull to GND
15 ~SPI1-CS GPIO31 C1 GSM-2V8 O Z SPI1 Chip Select NC
16 SPI1-CLK GPIO32 C1 GSM-2V8 O Z SPI1 Clock NC
17 SPI1-I GPIO30 C1 GSM-2V8 I Z SPI1 Data Input NC
18 SPI1-IO GPIO29 C1 GSM-2V8 I/O Z SPI1 Data Input /
Output
NC
19 SPI2-CLK GPIO32 C1 GSM-2V8 O Z SPI2 Clock NC
20 SPI2-IO GPIO33 C1 GSM-2V8 I/O Z SPI2 Data Input /
Output
NC
21 ~SPI2-CS GPIO35 C1 GSM-2V8 O Z SPI2 Chip Select NC
22 SPI2-I GPIO34 C1 GSM-2V8 I Z SPI2 Data Input NC
23 CT104-
RXD2
GPIO15 C1 GSM-1V8 O Z Auxiliary RS232
Receive
Add a test point for
firmware upgrade
24 CT103-
TXD2 GPIO14
C1
GSM-1V8 I Z
Auxiliary RS232
Transmit
(TXD2) Pull-up to
VCC_1V8 with
100k and add a
test point for
firmware update
25 ~CT106-
CTS2 GPIO16
C1
GSM-1V8 O Z
Auxiliary RS232
Clear To Send
(CTS2) Add a test
point for firmware
update
26 ~CT105-
RTS2
GPIO17
C1
GSM-1V8 I Z
Auxiliary RS232
Request To Send
(RTS2) Pull-up to
VCC_1V8 with
100k and add a
test point for
firmware update
27 GPIO8 COL4 C8 GSM-1V8 I/O Pull-up Keypad column 4 NC
28 GPIO26 SCL A1 Open Drain O Z I²C Clock NC
29 GPIO19 C1 GSM-2V8 I/O Z NC
30 GPIO27 SDA A1 Open Drain I/O Z I²C Data NC
31 GPIO20 C1 GSM-2V8 I/O Undefine
d
NC
32 INT0 GPIO3
C1
GSM-1V8 I Z Interruption 0 Input
If INT0 is not used,
it should be
configured as GPIO
33 GPIO23 ** C1 GSM-2V8 I/O Z NC
34 GPIO22 ** C1 GSM-2V8 I/O Z NC
35 ~CT108-
2-DTR1 GPIO41
C1
GSM-2V8 I Z
Main RS232 Data
Terminal Ready
(DTR1) Pull-up to
VCC_2V8 with
100k
36 PCMSYNC
GSM-1V8 O Pulldown
PCM Frame
Synchro
NC
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Pin Signal Name
Number Nominal Mux
I/O
type Voltage I/O* Reset
State Description Dealing with
unused pins
37 PCM-IN C5 GSM-1V8 I Pull-up PCM Data Input NC
38 PCM-CLK GSM-1V8 O Pulldown
PCM Clock NC
39 PCM-OUT GSM-1V8 O Pull-up PCM Data Output NC
40 AUX-DAC Analog O Digital to Analog
Output
NC
41 VCC-2V8 VCC_2V8 O LDO 2.8V Supply
Output
NC
42 GND Ground
43 DC-IN
DC-IN from
5.5V~32V
DC
O
DC voltage input
through Micro-Fit
connector
NC
44 DC-IN
DC-IN from
5.5V~32V
DC
O
DC voltage input
through Micro-Fit
connector
NC
45 GND Ground
46 4V 4V O 4V DC/DC converter
Output
NC
47 4V 4V O 4V DC/DC converter
Output
NC
48 GND Ground
49 GND Ground
50 GND Ground
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3.2.2 Power Supply Cable
Figure 10: Power supply cable
Component Characteristics
Micro-Fit connector
4-pin
Part number: MOLEX 43025-0400
Cable Cable length: ∼1.5 m
Wire Core: tinned copper 24 x 0.2 mm
Section: 0.75 mm2
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4 Features and Services
4.1 Basic Features and Services
Basic features of the Fastrack Supreme and available services are summarized in the
table below.
Table 4: Basic features of the Fastrack Supreme
Features GSM850 / GSM900 DCS1800 / PCS1900
Open AT® Open AT® programmable:
Native execution of embedded standard ANSI C applications,
Custom AT command creation,
Custom application library creation,
Standalone operation.
Standard 850MHz / 900 MHz.
E-GSM compliant.
Output power: class 4 (2W).
Fully compliant with ETSI GSM
phase 2 + small MS.
1800 MHz / 1900MHz
Output power: class 1 (1W).
Fully compliant with ETSI GSM
phase 2 + small MS.
GPRS Class 10.
PBCCH support.
Coding schemes: CS1 to CS4.
Compliant with SMG31bis.
Embedded TCP/IP stack.
EGPRS Output power: 0.5W Output power: 0.4W
(for
Fastrack
Supreme
20 only)
Class 10.
PBCCH support.
Coding schemes: MCS1 to MCS9.
Compliant with SMG31bis.
Embedded TCP/IP stack.
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Features GSM850 / GSM900 DCS1800 / PCS1900
Interfaces RS232 (V.24/V.28) Serial interface supporting:
Baud rate (bits/s): 300, 600, 1200, 2400, 4800, 9600, 19200,
38400, 57600, 115200, 230400, 460800 and 921600.
Autobauding (bits/s): from 1200 to 921600.
2 General Purpose Input/Output gates (GPIOs) available.
1.8 V / 3 V SIM interface.
AT command set based on V.25ter and GSM 07.05 & 07.07.
Open AT® interface for embedded application.
Open AT® Plug-In Compatible.
SMS Text & PDU.
Point to point (MT/MO).
Cell broadcast.
Data Data circuit asynchronous.
Transparent and Non Transparent modes.
Up to 14.400 bits/s.
MNP Class 2 error correction.
V42.bis data compression.
Fax Automatic fax group 3 (class 1 and Class 2).
Audio Echo cancellation
Noise reduction
Telephony.
Emergency calls.
Full Rate, Enhanced Full Rate, Half Rate operation and Adaptive
Multi-Rate (FR/EFR/HR/AMR).
Dual Tone Multi Frequency function (DTMF).
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Features GSM850 / GSM900 DCS1800 / PCS1900
GSM
supplement
services
Call forwarding.
Call barring.
Multiparty.
Call waiting and call hold.
Calling line identity.
Advice of charge.
USSD
Other DC power supply
Real Time Clock with calendar
Complete shielding
For other detailed technical characteristics, refer to Section 8.
4.2 Additional NEW Features
4.2.1 Support Additional GSM850/PCS1900 Bands
Apart from GSM900/DCS1800, the Fastrack Supreme Plug & Play now supports also
the GSM850/PCS1900 bands. Fastrack Supreme is fully compliant to PTCRB and
FCC also.
4.2.2 IES Interface for Easy Expansion of Application Features
The Fastrack Supreme Plug & Play offers a 50 pin Internal Expansion Socket (IES)
Interface accessible for customer use. It is the additional interface which is easy for
customers to expand their application features without voiding the warrantee of the
Fastrack Supreme, by simply plugging in an Internal Expansion Socket Module (IESM)
board through the matting connector of the IES interface.
Thanks to the flexible IES interface, customers are ready to expand the application
features by plugging in the corresponding Internal Expansion Socket Module (IESM)
of GPS, I/O expander…, etc.
For brief description of the interface, please refer to Section 3.2.1.4.
For technical detail, please refer to Document [10] or contact your Wavecom
distributor or Wavecom FAE.
4.2.3 Serial Port Auto Shut Down or Improving Power Consumption
In order to save power consumption when there is no data communication between
the Plug & Play and the DTE, Fastrack Supreme has now implement the Serial Port
Auto Shut Down feature. User can activate or deactivate the Serial Port Auto Shut
Down mode by simple AT-command.
For detail, please refer to Section 7.4.4.
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4.2.4 Real Time Clock (RTC) for Saving Date and Time
The Fastrack Supreme has now implemented the Real Time Clock for saving date and
time when the Plug & Play is unplugged from the DC power supply through the DC
power cable.
For detail, please refer to Section 7.9.
4.2.5 SIM Card Lock Feature
The Fastrack Supreme has now implemented a SIM connector having a carrier with
lock. This helps ensuring the user to have proper SIM card insertion and locked
before proper use of GSM network.
SIM card is inserted but not locked. GSM
network is not ready for use. Only
emergency call 112 is possible.
SIM card is inserted and being locked
properly. GSM network is ready for use.
Figure 11: SIM card lock feature
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5 Using the Fastrack Supreme Plug & Play
5.1 Getting Started
5.1.1 Mount the Fastrack Supreme
To mount the Fastrack Supreme on its support, bind it using the holding bridles as
shown in the Figure 12 below.
Figure 12: Fastrack Supreme mounting
For the drill template, refer to Figure 20.
5.1.2 Insert/extract the SIM card to/from the Fastrack Supreme
In order to insert the SIM card to the Fastrack Supreme, please follow the procedure
in Figure 13.
Step 1: Ready the SIM card in the
orientation as shown.
Step 2: Slide in the SIM card inside the SIM
holder.
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Step 3: Use a tool to help pushing the SIM
card inside the SIM holder.
Step 4: Push until you hear a “click” sound.
Step 5: Release the tool. The SIM card is
now put inside the SIM holder.
Step 6: Move the carrier toward center to
lock properly the SIM card. GSM network
is ready for use.
Figure 13: Procedure for SIM card insertion
Caution: Please make sure the SIM card is horizontally inserted into the SIM holder.
Otherwise, the SIM card may be blocked inside the Fastrack Supreme.
In order to extract the SIM card from the Fastrack Supreme, please follow the
procedure in Figure 14.
Step 1: SIM card is put inside the SIM
holder and locked properly before
extraction.
Step 2: Move the carrier toward the edge
to unlock the SIM card.
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Step 3: Use a tool to help pushing the SIM
card a little bit inside the SIM holder until
you hear a “click” sound.
Step 4: The SIM card spring out a little bit.
Step 5: You can easily extract the SIM card
by hand now.
Step 6: SIM card is extracted.
Figure 14: Procedure for SIM card extraction
5.1.3 Set up the Fastrack Supreme
To set up the Fastrack Supreme, perform the following operations:
• Insert the SIM card into the SIM card holder of the Fastrack Supreme.
• Lock the SIM card by sliding the lever towards the SIM card.
• Connect the antenna to the SMA connector.
• Connect both sides of the serial and control cable (15-pin Sub HD connector on
the Fastrack Supreme side).
• Connect the power supply cable to the external power supply source.
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Note:
For automotive application, it is recommended to connect the V+BATTERY line of the
Fastrack Supreme directly to the battery positive terminal.
• Plug the power supply cable into the Fastrack Supreme and switch on the
external power supply source.
• The Fastrack Supreme is ready to work. Refer to Section 5.10 for the
description of AT commands used to configure the Fastrack Supreme.
5.1.4 Check the communication with the Fastrack Supreme
To check the communication with the Fastrack Supreme, do the following operations:
• Connect the RS232 link between the DTE (port COM) and the Fastrack
Supreme (DCE).
• Configure the RS232 port of the DTE as follows:
Bits per second: 115.200 bps,
Data bits: 8,
Parity: None,
Stop bits: 1,
Flow control: hardware.
• Using a communication software such as a HyperTerminal, enter the AT↵
command. The response of the Fastrack Supreme must be OK displayed in
the HyperTerminal window.
• If the communication cannot be established with the Fastrack Supreme, do
the following:
Check the RS232 connection between the DTE and the Fastrack
Supreme (DCE),
Check the configuration of the port COM used on the DTE.
• Example of AT commands which can be used after getting started the
Fastrack Supreme:
AT+CGMI: Fastrack Supreme answer is "WAVECOM MODEM"
when serial link is OK.
AT+CPIN=xxxx: to enter a PIN code xxxx (if activated).
AT+CSQ: to verify the received signal strength.
AT+CREG?: to verify the registration of the Fastrack Supreme Plug
& Play on the network.
ATD: to initiate a voice call.
ATH: to hang up (end of call).
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For further information on these AT commands and their associated parameters,
refer to "AT Commands Interface Guide" [7].
5.1.5 Reset the Fastrack Supreme
To reset the Fastrack Supreme, a hardware reset signal is available on pin 14 of the
Sub HD 15-pin connector (RESET).
The Fastrack Supreme reset is carried out when this pin is low for at least 200 μs.
Warning This signal has to be considered as an emergency reset only. For further
details on the Fastrack Supreme reset, refer to Section 7.7.
5.2 Specific Recommendations when Using the Fastrack
Supreme on Trucks
Warning: The power supply connection of the Fastrack Supreme must NEVER be
directly connected to the truck battery.
5.2.1 Recommended Power Supply Connection on Trucks
All trucks have a circuit breaker on the exterior of the cabin. The circuit breaker is
used for safety reasons: if a fire blazes in the trucks, (for example, on the wiring
trunk) the driver may cut the current source to avoid any damage (explosion). The
circuit breaker is connected to the truck ground, most often associated with the fuse
box.
Most of truck circuit breakers do not cut the Positive Supply line of the battery, but
cut the ground line of the later.
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FASTRACK
Supreme
Figure 15: Recommended power supply connection on trucks
Figure 15 gives the recommended power supply connection where the ground
connection of the Fastrack Supreme is not directly connected to the battery but is
connected after the Circuit Breaker (on the truck ground or the fuse box).
5.2.2 Technical Constraints on Trucks
It is highly not recommended to connect directly the power supply on the battery
rather than on the circuit breaker. The Fastrack Supreme may be damaged when
starting the truck if the circuit breaker is switched OFF (in this case, the truck ground
and the battery ground will be connected through the Fastrack Supreme as shown in
the Figure 16).
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FASTRACK
Supreme
Figure 16: Example of electrical connection which may dramatically damage the
Fastrack Supreme
Figure 16 gives an example of electrical connection which may dramatically damage
the Fastrack Supreme when its ground connection is directly connected to the battery
ground.
In this example, when the circuit breaker is switched OFF, the current flows through
the Fastrack Supreme and powers the electrical circuit of the truck (for example,
dashboard).
Furthermore, when the Starter Engine command will be used, it will destroy the
cables or the Fastrack Supreme.
Since the internal tracks are not designed to support high current (up to 60 A when
starting the truck), they will be destroyed.
5.3 Fastrack Supreme Operational Status
The Fastrack Supreme operational status is given by the red LED status located next
to the SIM connector on the Fastrack Supreme panel.
The Table 5 below gives the meaning of the various statuses available.
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Table 5: Fastrack Supreme operational status
LED Status LED light activity Fastrack Supreme Plug & Play status
LED ON permanent Fastrack Supreme is switched ON but
not registered on the network
LED Flashing slowly Fastrack Supreme is switched ON and
registered on the network, but no
communication is in progress (Idle mode)
ON
LED Flashing rapidly Fastrack Supreme is switched ON and
registered on the network, and a
communication is in progress
OFF LED OFF Fastrack Supreme is switched OFF, or
Flash LED is disabled* by the user.
*: Flash LED can be disabled by user when in Slow Standby mode in order to save
power consumption. For detail, please refer to Section 7.10.
5.4 Echo Function Disabled
If no echo is displayed when entering an AT command, that means:
• The "local echo" parameter of your communication software (such as
HyperTerminal) is disabled.
• The Fastrack Supreme echo function is disabled.
To enable the Fastrack Supreme echo function, enter the ATE1.
When sending AT commands to the Fastrack Supreme by using a communication
software, it is recommended:
• to disable the "local echo" parameter of your communication software (such as
HyperTerminal),
• to enable the Fastrack Supreme echo function (ATE1 command).
In a Machine To Machine communication with the Fastrack Supreme, it is
recommended to disable the Fastrack Supreme echo function (ATE0 command) in
order to avoid useless CPU processing.
For further information on ATE0 and ATE1 commands, refer to "AT Commands
Interface Guide" [7].
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5.5 Verify the Received Signal Strength
The Fastrack Supreme establishes a call only if the received signal is sufficiently
strong.
To verify the received signal strength, do the following operations:
• Using a communication software such as HyperTerminal, enter the AT
command AT+CSQ.
The response returned has the following format:
+CSQ: , with:
• = received signal strength indication,
• = channel bit error rate.
• Verify the value returned using the Table 6 below.
Table 6: Values of received signal strength
Value of received signal
strength indication ()
Interpretation of the
received signal strength
0 - 10 Insufficient(*)
11 - 31 Sufficient(*)
32 - 98 Not defined
99 No measure available
(*) Based on general observations.
For further information on AT commands, refer to "AT Commands Interface Guide" [7].
5.6 Check the Pin Code Status
To check that the pin code has been entered, use a communication software such as
a HyperTerminal, then enter AT+CPIN? command.
The table below gives the main responses returned:
Table 7: AT+CPIN Responses
AT+CPIN response (*) Interpretation
+CPIN: READY Code PIN has been entered
+CPIN: SIM PIN Code PIN has not been entered
(*)For further information on the other possible responses and their meaning, refer to
"AT Commands Interface Guide" [7].
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5.7 Switch between EU/US Band(s)
To switch between EU/US band(s) for the Fastrack Supreme, use a communication
software such as a HyperTerminal, then enter AT+WMBS=[,]
command.
The table below gives the commands for various band(s) selection:
Table 8: AT+WMBS Band Selection
AT+WMBS response (*) Interpretation
AT+WMBS=0,x Select mono band mode 850MHz.
AT+WMBS=1,x Select mono band mode extended 900MHz
AT+WMBS=2,x Select mono band mode 1800MHz
AT+WMBS=3,x Select mono band mode 1900MHz
AT+WMBS=4,x Select dual band mode 850/1900MHz
AT+WMBS=5,x Select dual band mode extended
900MHz/1800MHz
AT+WMBS=6,x Select dual band mode extended
900MHz/1900MHz
(*)For further information on the other possible responses and their meaning, refer to
"AT Commands Interface Guide" [7].
Remark:
x=0 : The Plug & Play will have to be reset to start on specified band(s).
x=1 : The change is effective immediately. This mode is forbidden while in
communication and during Plug & Play initialization.
Refer to "AT Commands Interface Guide" [7] for further information on AT commands.
5.8 Check the Band(s) Selection
To check the band selection for the Fastrack Supreme, use a communication software
such as a HyperTerminal, then enter AT+WMBS? command.
The table below gives the main responses returned:
Table 9: AT+WMBS Responses
AT+WMBS response (*) Interpretation
+WMBS: 0,x Mono band mode 850MHz is selected
+WMBS: 1,x Mono band mode extended 900MHz is selected
+WMBS: 2,x Mono band mode 1800MHz is selected
+WMBS: 3,x Mono band mode 1900MHz is selected
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AT+WMBS response (*) Interpretation
+WMBS: 4,x Dual band mode 850/1900MHz are selected
+WMBS: 5,x Dual band mode extended 900MHz/1800MHz
are selected
+WMBS: 6,x Dual band mode extended 900MHz/1900MHz
are selected
(*)For further information on the other possible responses and their meaning, refer to
"AT Commands Interface Guide" [7].
5.9 Verify the Fastrack Supreme Network Registration
1. Make sure a valid SIM card has been previously inserted and locked in the
Fastrack Supreme SIM card holder.
2. Using a communication software such as a HyperTerminal, enter the following
AT commands:
a. AT+CPIN=xxxx to enter PIN code xxxx.
b. AT+WMBS? To check the current band setting in the Plug & Play
c. AT+WMBS=[,] To switch band/mode when needed
d. AT+CREG?. To ascertain the registration status.
The format of the returned response is as follows:
+CREG: , with:
• = unsolicited registration message configuration,
• = registration state.
3. Verify the state of registration according the returned value given in the table
below.
Table 10: Values of network registration
Returned Value (*)
,
Network registration
+CREG: 0,0 No (not registered)
+CREG: 0,1 Yes (registered, home network)
+CREG: 0,5 Yes (registered, roaming)
(*)For further information on the other returned values and their meaning, refer to "AT
Commands Interface Guide" [7].
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If the Fastrack Supreme is not registered, perform the following procedure:
• Check the connection between the Fastrack Supreme and the antenna.
• Verify the signal strength to determine the received signal strength (refer to
Section 5.5).
Note: For information on AT command relating to the network registration in GPRS
mode, and in particular: CGREG, CGCLASS, CGATT, refer to "AT Commands Interface
Guide" [7].
5.10 Main AT Commands for the Plug & Play
The table below lists the main AT commands required for starting the Plug & Play.
For other AT commands available or further information on the AT commands, refer
to "AT Commands Interface Guide" [7].
Table 11: Main usual AT commands for the Plug & Play
Description AT commands Fastrack Supreme Plug & Play
response
Comment
Check for
selected
band(s)
AT+WMBS? +WMBS:,
OK
Current
selected band
mode is return
AT+WMBS= OK Band switch is
accepted, Plug
& Play has to
be reset for
change to be
effective
AT+WMBS=,0 OK Band switch is
accepted, Plug
& Play has to
be reset for
change to be
effective
AT+WMBS=,1 OK Band switch is
accepted and
GSMS stack
restarted
Band(s) switch
AT+WMBS= +CME ERROR: 3 Band not
allowed
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Description AT commands Fastrack Supreme Plug & Play
response
Comment
OK PIN Code
accepted.
+CME ERROR: 16 Incorrect PIN
Code
(with +CMEE =
1 mode) (1*)
Enter PIN Code AT+CPIN=xxxx
(xxxx = PIN code)
+CME ERROR: 3 PIN code already
entered
(with +CMEE =
1 mode) (1*)
+CREG: 0,1 Fastrack
Supreme Plug
& Play
registered on
the network.
+CREG: 0,2 Fastrack
Supreme Plug
& Play not
registered
on the
network,
registration
attempt.
Network
registration
checking
AT+CREG?
+CREG: 0,0 Fastrack
Supreme Plug
& Play not
registered
on the
network, no
registration
attempt.
Receiving an
incoming call
ATA OK Answer the
call.
OK Communication
established.
+CME ERROR: 11 PIN code not
entered (with
+CMEE =
1 mode).
Initiate a call ATD;
(Don’t forget the « ; »
at the end for « voice »
call)
+CME ERROR: 3 AOC credit
exceeded or a
communication
is already
established.
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Description AT commands Fastrack Supreme Plug & Play
response
Comment
Initiate an
emergency call
ATD112;
(Don’t forget the « ; »
at the end for « voice »
call)
OK Communication
established.
Communication
loss
NO CARRIER
Hang up ATH OK
Store the
parameters in
EEPROM
AT&W OK The
configuration
settings are
stored in
EEPROM.
(1*) The command "AT+CMEE=1" switch to a mode enabling more complete error diagnostics.
5.11 Firmware Upgrade Procedure
The firmware upgrade procedure is used to update the firmware embedded into the
Fastrack Supreme.
That procedure consists in downloading the firmware into internal memories through
the RS232 serial link available on the SUB-D 15-pin connector.
Refer to "Firmware upgrade procedure" document for a detailed description of this
procedure.
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6 Troubleshooting
This section of the document describes possible problems encountered when using
the Fastrack Supreme and their solutions.
To review other troubleshooting information, refer the ‘FAQs’ (Frequently Asked
Questions) page at www.wavecom.com/fastracksupreme.
6.1 No Communication with the Fastrack Supreme through the
Serial Link
If the Fastrack Supreme does not answer to AT commands through the serial link,
refer to the table below for possible causes and solutions.
Table 12: Solutions for no connection with Fastrack Supreme through serial link
If the Supreme
returns
then ask Action
Is the Fastrack Supreme
powered correctly?
Make sure the external power
supply is connected to the Fastrack
Supreme and provides a voltage in
the range of 5.5 V to 32 V.
Is the serial cable connected at
both sides?
Check the serial cable connection
Nothing
Does the serial cable follow
correctly pin assignment
shown in paragraph 3.2.1.2.
Connect the cable by following pin
assignment given in paragraph
3.2.1.1.
Is the communication program
properly configured on PC?
Ensure the setting of the
communication program is fit to
setting of Fastrack Supreme.
Fastrack Supreme factory setting
is:
Data bits = 8
Parity = none
Stop bits = 1
Baud = 115 200 bps.
Flow control = hardware
Nothing or nonsignificant
characters
Is there another program
interfering with the
communication program (i.e.
Conflict on communication
port access)
Close the interfering program.
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6.2 Receiving "ERROR" Message
The Fastrack Supreme returns an "ERROR" message (in reply to an AT command) in
the following cases:
• AT command syntax is incorrect: check the command syntax (refer to "AT
Commands Interface Guide" [7]),
• AT command syntax is correct, but transmitted with wrong parameters:
• Enter the AT+CMEE=1 command in order to change the error report method to
the verbose method, which includes the error codes.
• Enter again the AT command which previously caused the reception of
"ERROR" message in order to get the Mobile Equipment error code.
When the verbose error report method is enabled, the response of the Fastrack
Supreme in case of error is as follows:
• Either +CME ERROR: ,
• Or +CMS ERROR: .
Refer to "AT Commands Interface Guide" [7] for error result code description and
further details on the AT +CMEE command.
Note: It is strongly recommended to always enable the verbose error report method to
get the Mobile Equipment error code (enter AT +CMEE=1 command).
6.3 Receiving "NO CARRIER" Message
If the Fastrack Supreme returns a "NO CARRIER" message upon an attempted call
(voice or data), then refer to the table below for possible causes and solutions.
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Table 13: Solutions for "NO CARRIER" message
If the Supreme
returns…
Then ask… Action…
Is the received signal strong
enough?
Refer to section 5.5 to verify
the strength of the received
signal.
Is the Fastrack Supreme registered
on the network?
Refer to section 5.9 to verify
the registration.
Is the antenna properly
connected?
Refer to section 8.2.7.3 for
antenna requirements.
"NO CARRIER"
Is the band selection correction? Refer to Section 7.2 for band
switch
"NO CARRIER"
(when trying to
issue a voice
communication)
Is the semicolon (;) entered
immediately after the phone
number in the AT command?
Ensure that the semicolon (;)
is entered immediately after
the phone number in the AT
command.
e.g. ATD######;
Is the SIM card configured for data
/ fax calls?
Configure the SIM card for
data / fax calls (Ask your
network provider if
necessary).
Is the selected bearer type
supported by the called party?
Ensure that the selected
bearer type is supported by
the called party.
"NO CARRIER"
(when trying to
issue a data
communication)
Is the selected bearer type
supported by the network?
Ensure that the selected
bearer type is supported by
the network.
If no success, try bearer
selection type by AT
command: AT+CBST=0,0,3
If the Fastrack Supreme returns a "NO CARRIER" message, you may have the
extended error code by using AT command AT+CEER. Refer to the table below for
interpretation of extended error code.
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Table 14: Interpretation of extended error code
Error Code Diagnostic Hint
1 Unallocated phone number
16 Normal call clearing
17 User busy
18 No user responding
19 User alerting, no answer
21 Call rejected
22 Number changed
31 Normal, unspecified
50 Requested facility not subscribed Check your subscription (data
subscription available?).
68 ACM equal or greater than
ACMmax
Credit of your pre-paid SIM card
expired.
252 Call barring on outgoing calls
253 Call barring on incoming calls
3, 6, 8, 29, 34,
38, 41, 42, 43,
44, 47, 49, 57,
58, 63, 65, 69,
70, 79, 254
Network causes
See "AT Commands Interface
Guide" [7] for further details or
call network provider.
Note: For all other codes, and/or details, see AT commands documentation [7].
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7 Functional Description
7.1 Architecture
Internal Quik
Q26 series
RS232
Interface
SMA
Audio
Interface
DC / DC
Power
Supply
BOOT
RESET
V+BATT
GROUND
Micro-FIT
4 pins
SUB HD 15
pins
VCC
Microphone Microphone
Speaker Speaker
VCC
VCC
SIM card
Holder
Operating
Status
FASTRACK Supreme Plug & Play
GPIO-21
GPIO-25
50 pin IES Interface
Figure 17: Functional architecture
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7.2 EU and US Bands
7.2.1 General Presentation
The Fastrack Supreme is a quad band Plug & Play. It supports either EU bands
(EGSM900/DCS1800) or US bands (GSM850/ PCS1900), depending on the band
setting within the Plug & Play. Users are free to switch between EU bands and US
bands by simple AT commands when the selected bands are supported.
7.2.2 AT COMMAND for Bands Switch
EU/US band is easily switched/checked by AT command AT+WMBS.
For detail, please refer to Section 5.7 and 5.8.
7.3 Power Supply
7.3.1 General Presentation
The Fastrack Supreme is supplied by an external DC voltage (V+BATTERY) from +5.5
V to +32 V at 2.2 A.
Main regulation is made with an internal DC/DC converter in order to supply all the
internal functions with a DC voltage.
Correct operation of the Fastrack Supreme in communication mode is not guaranteed
if input voltage (V+BATTERY) falls below 5.5 V.
Note: The minimum input voltage specified here is at the Fastrack Supreme input. Be
careful of the input voltage decrease caused by the power cable. See paragraph 8.2.1
for more information.
7.3.2 Protections
The Fastrack Supreme is protected by a 800 mA / 250 V fuse directly bonded on the
power supply cable.
The Fastrack Supreme is also protected against voltage over +32 V.
Filtering guarantees:
• EMI/RFI protection in input and output,
• Signal smoothing.
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7.4 RS232 Serial Link
7.4.1 General Presentation
The RS232 interface performs the voltage level adaptation (V24/CMOS ⇔ V24/V28)
between the internal Fastrack Supreme Plug & Play (DCE) and the external world
(DTE).
The RS232 interface is internally protected (by ESD protection) against electrostatic
surges on the RS232 lines.
Filtering guarantees:
• EMI/RFI protection in input and output,
• Signal smoothing.
Signals available on the RS232 serial link are:
• TX data (CT103/TX),
• RX data (CT104/RX),
• Request To Send (CT105/RTS),
• Clear To Send (CT106/CTS),
• Data Terminal Ready (CT108-2/DTR),
• Data Set Ready (CT107/DSR),
• Data Carrier Detect (CT109/DCD),
• Ring Indicator (CT125/RI).
FASTRACK
Supreme
(DCE)
DTE
CT103 / TX
CT108-2 / DTR
CT105 / RTS
CT104 / RX
CT106 / CTS
CT107 / DSR
CT109 / DCD
CT125 / RI
Figure 18: RS232 Serial Link signals
RS232 interface has been designed to allow flexibility in the use of the serial interface
signals. However, the use of TX, RX, CTS and RTS signals is mandatory, which is not
the case for DTR, DSR, DCD and RI signals which can be not used.
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7.4.2 Autobauding Mode
The autobauding mode allows the Fastrack Supreme to detect the baud rate used by
the DTE connected to the RS232 serial link.
Autobauding mode is controlled by AT commands. See "AT Commands Interface
Guide" [7] for details on this function.
7.4.3 Pin Description
Signal Sub HD connector
Pin number
I/O I/O type
RS232
STANDARD
Description
CTXD/CT103 2 I TX Transmit serial data
CRXD/CT104 6 O RX Receive serial data
CRTS/CT105 12 I RTS Request To Send
CCTS/CT106 11 O CTS Clear To Send
CDSR/CT107 7 O DSR Data Set Ready
CDTR/CT108-2 8 I DTR Data Terminal Ready
CDCD/CT109 1 O DCD Data Carrier Detect
CRI/CT125 13 O RI Ring Indicator
CT102/GND 9 GND Ground
7.4.4 Serial Port Auto shut down Feature
The UART1 can be shut down when there is no activity between the DTE and the
Fastrack Supreme Plug & Play. This can help for improving power consumption
performance.
Serial Port Auto shut down feature is easily controlled by AT command AT+WASR.
AT+WASR=1 for entering the serial port auto shut down mode
AT+WASR=0 for exiting the serial port auto shut down mode
Refer to "AT Commands Interface Guide" [7] for further information on AT commands.
CAUTION: GPIO24 is reserved for serial port auto shut down feature. It is prohibited
for customer use. Improper access to GPIO24 by customer may lead to unexpected
behavior on UART1 performance.
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7.5 General Purpose Input/Output (GPIO)
The Fastrack Supreme provides two General Purpose Input / Output lines available for
external use: GPIO21 and GPIO25.
These GPIOs may be controlled by AT commands:
• AT+WIOW for a write access to the GPIO value, when the GPIO is used as an
output,
• AT+WIOR for a read access to the GPIO value, when the GPIO is used as an
input.
Refer to "AT Commands Interface Guide" [7] for further information on AT commands.
After reset, both GPIOs are configured as inputs. The AT+WIOM command has to be
used to change this configuration (refer to "AT Commands Interface Guide" [7] for
further details).
Pin description
Signal
Power Supply
connector
(4-pin Micro-Fit)
I/O I/O
Voltage
Reset
state Description Mulitplex
with
GPIO21 3 I/O 2V8 Undefine
d
General Purpose
I/O
No mux
GPIO25 4 I/O 2V8 Z General Purpose
I/O
INT1
Notes:
• The power supply cable may need to be modified due to the GPIO signals
(GPIO21 & GPIO25) available on the 4-pin Micro-FIT connector of the Fastrack
Supreme.
• The previous generation M1306B have GPIO4 and GPIO5 being replaced by
GPIO21 and GPIO25 respectively, for which both are of LOW level at reset
state.
7.6 BOOT
This signal must not be connected. Its use is strictly reserved to Wavecom or
competent retailers.
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7.7 RESET
7.7.1 General Presentation
This signal is used to force a reset procedure by providing low level during at least
200 μs.
This signal must be considered as an emergency reset only. A reset procedure is
automatically driven by an internal hardware during the power-up sequence.
This signal may also be used to provide a reset to an external device. It then behaves
as an output. If no external reset is necessary, this input may be left open, if used
(emergency reset), it has to be driven either by an open collector or an open drain
output:
• RESET pin 14 = 0, for Fastrack Supreme Reset,
• RESET pin 14 = 1, for normal mode.
Pin description
Signal
Sub HD 15-Pin
connector
Pin number
I/O I/O type Voltage Description
RESET 14 I/O Open Drain 1V8 Fastrack
Supreme Reset
Additional comments on RESET:
The RESET process is activated either by the external RESET signal or by an internal
signal (coming from a RESET generator). This automatic reset is activated at Powerup.
The Fastrack Supreme remains in RESET mode as long as the RESET signal is held
low.
Caution: This signal should be used only for "emergency" reset.
A software reset is always preferred to a hardware reset.
Note: See "AT Commands Interface Guide" [7] for further information on software
reset.
7.7.2 Reset Sequence
To activate the "emergency" reset sequence, the RESET signal has to be set to low for
200 μs minimum.
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As soon as the reset is done, the AT interface answers "OK" to the application. For
this, the application must send AT↵.
If the application manages hardware flow control, the AT command may be sent
during the initialization phase. Another solution is to use the AT+WIND command to
get an unsolicited status from the Fastrack Supreme.
For further details, refer to AT commands "AT Commands Interface Guide" [7].
RESET mode
IBB+RF=20 to
40mA
~RESET
STATE OF THE
Wireless CPU®
Wireless
CPU®
READY
Rt = Min1:200μs
or Typ2 = 40ms
AT answers “OK”
Wireless
CPU® READY
SIM and network
dependent
Wireless CPU®
ON
IBB+RF<120mA
without loc update
Ct = Typ:34ms
Figure 19: Reset sequence diagram
7.8 Audio
Audio interface is a standard one for connecting a phone handset.
Echo cancellation and noise reduction features are also available to improve the audio
quality in case of hand-free application.
7.8.1 Microphone Inputs
The microphone inputs are differential ones in order to reject common mode noise
and TDMA noise.
They already include the convenient biasing for an electret microphone (0.5 mA and 2
Volts) and are ESD protected.
This electret microphone may be directly connected to these inputs allowing an easy
connection to a handset.
The microphone impedance must be around 2 kΩ.
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AC coupling is already embedded in the Wireless CPU®.
The gain of the microphone inputs is internally adjusted and may be tuned from 7 dB
to 35 dB using an AT +VGT command (refer to AT commands documentation [7]).
Pin description
Signal Sub D 15-pin
Pin #
I/O I/O type Description
CMIC2P 4 I Analog Microphone positive input
CMIC2N 5 I Analog Microphone negative input
7.8.2 Speaker Outputs
This connection is differential to reject common mode noise and TDMA noise.
Speaker outputs are connected to internal push-pull amplifiers and may be loaded
down between 32 to 150 Ohms and up to 1 nF (see details in table Speaker gain vs
Max output voltage, in "AT Commands Interface Guide" [7]). These outputs may be
directly connected to a speaker.
The output power may be adjusted by step of 2 dB. The gain of the speaker outputs
is internally adjusted and may be tuned using an AT +VGR command (refer to AT
commands documentation [7]).
Pin description
Signal Sub D 15-pin Pin # I/O I/O type Description
CSPK2P 10 O Analog Speaker positive output
CSPK2N 15 O Analog Speaker negative output
7.9 Real Time Clock (RTC)
The Fastrack Supreme has now implemented the Real Time Clock for saving date and
time when the Plug & Play is unplugged from the DC power supply through the DC
power cable.
Item Min Typical Max
Charging Time start from fully discharged to fully
charged
940 min
Guarantee 2475 min
RTC Time Period* Nonguarantee
5225 min
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Remark:
1. This RTC time period is measured when the RTC battery is fully charged
before the Fastrack Supreme is being unplugged from the DC power
source.
2. This RTC time period is for temperature from -20°C to +60°C. Once the
operating/storage temperature is beyond this range, this time period is not
guaranteed.
Caution: When the Fastrack Supreme is shipped out, the charging voltage of the RTC
battery is not guaranteed. Once the Fastrack Supreme is on power, the RTC battery
will start charging and the RTC feature can then be resumed.
7.10 FLASH LED
The Fastrack Supreme has a red LED indicator to show the status of the GSM
network. For detail description of the various status, please refer to Section 5.3.
However, during operation mode of Slow Standby, there will be no network
registration and so the red LED indicator will always be ON. It is possible for user to
deactivate the LED indication during Slow Standby mode, in order to reduce power
consumption.
The Flash LED can be deactivated by AT command at+whcnf=1,0
The Flash LED can be activated by AT command at+whcnf=1,1
However, the new setting will be taken into account only after a restart. For detail,
please refer to Document [7].
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8 Technical Characteristics
8.1 Mechanical Characteristics
Table 15: Mechanical characteristics
Dimensions 73 x 54.5 x 25.5 mm (excluding connectors)
Overall Dimension 88 x 54.5 x 25.5 mm
Weight ≈ 89 grams (Fastrack Supreme only)
≈ 126 grams (Fastrack Supreme + bridles + power supply
cable)
Volume 101.5 cm3
Housing Aluminum profiled
The next page gives the dimensioning diagram of the Fastrack Supreme including the
clearance areas to take into account for the Fastrack Supreme installation.
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Figure 20: Dimensioning diagram
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8.2 Electrical Characteristics
8.2.1 Power Supply
Table 16: Electrical characteristics
Operating Voltage
ranges
5.5 V to 32 V DC, nominal at 13.2V DC.
Maximum current 500 mA Average at 5.5V.
2.5 A Peak at 5.5 V.
Note:
The Fastrack Supreme is permanently powered once the power supply is connected.
The following table describes the consequences of over-voltage and under-voltage
with the Fastrack Supreme.
Warning:
All the input voltages specification described in this Section are at the Fastrack
Supreme input. While powering the Fastrack Supreme, take into account the input
drop caused by the power cable. With the delivered cable, this input drop is around
700 mV at 5.5 V and 220 mV at 32V.
Table 17: Effects of power supply defect
If the voltage then
falls below 5.5 V, the GSM communication is not guaranteed.
is over 32 V
(Transient peaks),
the Fastrack Supreme guarantees its own
protection.
Is over 32 V
(continuous overvoltage)
the protection of the Fastrack Supreme is done
by the fuse (the supply voltage is
disconnected).
The fuse is a 800 mA / 250 V FAST-ACTING 5*20mm. See Section 10 for
recommended references.
The following table provides information on power consumption of the Fastrack
Supreme, assuming an operating temperature of +25 °C and using a 3 V SIM card.
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8.2.2 Power Consumption
The following table provides information on power consumption of the Fastrack
Supreme, assuming an operating temperature of +25 °C and using a 3 V SIM card.
Table 18: Power consumption in connected modes (1*)
Power Consumption in
E-GSM 900/DCS 1800 MHz - GPRS class 10 (Serial Port ON)
GSM 850 E-GSM
900
DCS 1800 PCS 1900
@ 5.5V 2500 / 309 2338 / 328 2224 / 325 2210 / 334
I peak
GSM850 / E-GSM900:
During TX bursts @ PCL5 / PCL19
DCS1800 / PCS1900 :
During TX bursts @ PCL0 / PCL15 @ 13.2V 953 / 133 794 / 100 755 / 137 722 / 139
@ 5.5V 267 / 98 237 / 100 227 / 100 226 / 100
@ 13.2V 117 / 50 106 / 52 111 / 52 102 / 51
GSM
I avg
GSM850 / E-GSM900:
Average @ PCL5 / PCL19
DCS1800 / PCS1900 :
Average @ PCL0 / PCL15 @ 32V 52 / 23 47 / 23 45 / 23 45 / 23
@ 5.5V 2485 / 288 2314 / 307 2195 / 307 2211 / 311
I peak
GSM850 / E-GSM900:
During 1TX bursts @ PCL5(Gamma 3) /
PCL19(Gamma 17)
DCS1800 / PCS1900 :
During 1TX bursts @ PCL0(Gamma 2) /
PCL15(Gamma 18)
@ 13.2V 943 / 124 784 / 132 737 / 139 724 / 131
@ 5.5V 255 / 94 228 / 96 218 / 96 219 / 97
@ 13.2V 112 / 48 102 / 50 99 / 50 99 / 51
GPRS Class 2
I avg
GSM850 / E-GSM900 :
Average 1TX/1RX @PCL5(Gamma 3) /
PCL19(Gamma 17)
DCS1800 / PCS1900:
Average 1TX/1RX @PCL0(Gamma 2) /
PCL15(Gamma 18) @ 32V 49 / 22 45 / 23 44 / 23 44 / 23
@ 5.5V 2418 / 294 1269 / 315 2215 / 317 2240 / 320
I peak
GSM850 / E-GSM900:
During 2TX bursts @ PCL5(Gamma 3) /
PCL19(Gamma 17)
DCS1800 / PCS1900:
During 2TX bursts @ PCL0(Gamma 2) /
PCL15(Gamma 18)
@ 13.2V 950 / 125 790 / 135 750 / 142 733 / 131
@ 5.5V 459 / 126 396 / 129 375 / 129 377 / 130
@ 13.2V 191 / 62 170 / 65 163 / 65 163 / 64
GPRS Class 10
I avg
GSM850 / E-GSM900 :
Average 2TX/3RX @ PCL5 (Gamma 3) /
PCL19(Gamma 17)
DCS1800 / PCS1900:
Average 2TX/3RX @ PCL0 (Gamma 2) /
PCL15(Gamma 18) @ 32V 84 / 29 75 / 30 71 / 29 71 / 30
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Power Consumption in
E-GSM 900/DCS 1800 MHz - GPRS class 10 (Serial Port ON)
GSM 850 E-GSM
900
DCS 1800 PCS 1900
@ 5.5V 2493 / 361 2334 / 391 2211 / 387 2225 / 389
I peak
GSM850 / E-GSM900:
During 1TX bursts @ PCL8 (Gamma 6) /
PCL19(Gamma 17)
DCS1800 / PCS1900:
During 1TX bursts @ PCL2 (Gamma 5) /
PCL15(Gamma 18)
@ 13.2V 958 / 150 801 / 161 744 / 162 743 / 158
@ 5.5V 170 / 100 163 / 102 173 / 103 176 / 103
@ 13.2V 79 / 51 77 / 53 82 / 53 82 / 52
EGPRS Class 2
I avg
GSM850 / E-GSM900 :
Average 1TX/1RX @ PCL8 (Gamma 6) / PCL
19(Gamma 17)
DCS1800 / PCS1900:
Average 1TX/1RX @ PCL2 (Gamma 5) / PCL
15(Gamma 18) @ 32V 36 / 23 34 / 24 36 / 24 36 / 24
@ 5.5V 2492 / 367 2328 / 395 2206 / 390 2218 / 394
I peak
GSM850 / E-GSM900:
During 2TX bursts @ PCL8 (Gamma 6) / PCL
19(Gamma 17)
DCS1800 / PCS1900:
During 2TX bursts @ PCL2 (Gamma 5) / PCL
15(Gamma 18)
@ 13.2V 961 / 568 802 / 162 735 / 166 743 / 160
@ 5.5V 280 / 137 264 / 142 287 / 142 295 / 143
@ 13.2V 125 / 73 119 / 69 129 / 70 130 / 70
EGPRS Class 10
I avg
GSM 850 / E-GSM900 :
Average 2TX/3RX @ PCL8 (Gamma 6) / PCL
19(Gamma 17)
DCS1800 / PCS1900:
Average 2TX/3RX @ PCL2 (Gamma 5) / PCL
15(Gamma 18)
@ 32V 55 / 31 52 / 32 58 / 32 57 / 32
Table 19: Power consumption in non-connected modes(1*)
Non-connected mode Serial Port status Voltage Current (mA)
@ 5.5V 34.3
ON @ 13.2V 17.8
@ 32V 9.2
@ 5.5V 16.5
@ 13.2V 9.4
I avg in Fast Idle mode Page 9
(2*)
OFF
@ 32V 5.2
@ 5.5V 23.5
ON @ 13.2V 13.4
@ 32V 6.9
@ 5.5V 5.1
@ 13.2V 3.5
I avg in Slow Idle mode Page 9
(3*)
OFF
@ 32V 2.8
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Non-connected mode Serial Port status Voltage Current (mA)
@ 5.5V 51.4
ON @ 13.2V 25.9
@ 32V 13.2
@ 5.5V 33.9
@ 13.2V 18.0
I avg in Fast Standby mode
(4*)
OFF
@ 32V 9.3
@ 5.5V 24.2
ON @ 13.2V 13.8
@ 32V 7.0
@ 5.5V 6.6
@ 13.2V 3.9
I avg in Slow Standby mode
(with FLASH LED activated)
(4*)
OFF
@ 32V 3.0
@ 5.5V 22.8
ON @ 13.2V 13.0
@ 32V 6.7
@ 5.5V 4.1
@ 13.2V 3.1
I avg in Slow Standby mode
(with FLASH LED deactivated)
(4*)
OFF
@ 32V 2.7
(1*):The power consumption might vary by 5 % over the whole operating temperature range (-
20 °C to +55 °C).
(2*): In this Mode, the RF function is active and the Fastrack Supreme synchronized with the
network, but there is no communication.
(3*): In this Mode, the RF function is disabled, but regularly activated to keep the
synchronization with the network. This Mode works only when the DTE send AT command to
shut down the serial link by software approach (DTE turns DTR in inactive state).
(4*): In this Mode, the RF function is disabled, and there is no synchronization with the
network.
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8.2.3 Audio Interface
The audio interface is available through the Sub HD 15-pin connector.
Table 20: Audio parameters caracteristics
Audio parameters Min Typ Max Unit Comments
Microphone input current @2 V/2 kΩ 0.5 mA
Absolute microphone input voltage 100 mVpp AC voltage
Speaker output current 150 Ω //1 nF 16 mA
Absolute speaker impedance 32 50 Ω
Impedance of the speaker amplifier
output in differential mode
1 Ω +/-10 %
Table 21: Microphone inputs internal audio filter characteristics
Frequency Gain
0-150 Hz < -22 dB
150-180 Hz < -11 dB
180-200 Hz < -3 dB
200-3700 Hz 0 dB
>4000 Hz < -60 dB
Table 22: Recommended characteristics for the microphone:
Feature Value
Type Electret 2 V / 0.5 mA
Impedance Z = 2 kΩ
Sensitivity -40 dB to –50 dB
SNR > 50 dB
Frequency response compatible with the GSM specifications
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Table 23: Recommended characteristics for the speaker:
Feature Value
Type 10 mW, electro-magnetic
Impedance Z = 32 to 50 Ω
Sensitivity 110 dB SPL min. (0 dB = 20 μPa)
Frequency response compatible with the GSM specifications
8.2.4 General Purpose Input/Output
Both GPIO21 and GPIO25 may be interfaced with a component that comply with 3
Volts CMOS levels.
Table 24: Operating conditions
Parameter I/O type Min Typ Max Condition
VIL CMOS 0.84 V
VIH CMOS 1.96 V
VOL CMOS 0.4 V IOL = -4 mA
VOH CMOS 2.4 V IOH = 4 mA
IOH 4mA
IOL -4mA
Clamping diodes are present on I/O pads.
8.2.5 SIM Interface
Table 25: SIM card characteristics
SIM card 1.8V / 3 V
8.2.6 RESET Signal
Table 26: Electrical characteristics
Parameter Min Typ Max Unit
Input Impedance ( R )* 330K kΩ
Input Impedance ( C ) 10n nF
*Internal pull-up
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Table 27: Operating conditions
Parameter Minimum Typ Maximum Unit
~RESET time (Rt) 1 200 μs
~RESET time (Rt) 2 at power up
only
20 40 100 ms
Cancellation time (Ct) 34 ms
VH 0.57 V
VIL 0 0.57 V
VIH 1.33 V
* VH: Hysterisis Voltage
1 This reset time is the minimum to be carried out on the ~RESET signal when the power supply is
already stabilized.
2 This reset time is internally carried out by the Wireless CPU® power supply supervisor only when
the Wireless CPU® power supplies are powered ON.
8.2.7 RF Characteristics
8.2.7.1 Frequency Ranges
Table 28: Frequency ranges
Characteristic GSM 850 E-GSM 900 DCS 1800 PCS 1900
Frequency TX 824 to 849
MHz
880 to 915
MHz
1710 to 1785
MHz
1850 to 1910
MHz
Frequency RX 869 to 894
MHz
925 to 960
MHz
1805 to 1880
MHz
1930 to 1990
MHz
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8.2.7.2 RF Performances
RF performances are compliant with the ETSI recommendation GSM 05.05.
The RF performances for receiver and transmitter are given in the table below.
Table 29: Receiver and transmitter RF performances
Receiver
E-GSM900/GSM850 Reference Sensitivity -104 dBm Static & TUHigh
DCS1800/PCS1900 Reference Sensitivity -102 dBm Static & TUHigh
Selectivity @ 200 kHz > +9 dBc
Selectivity @ 400 kHz > +41 dBc
Linear dynamic range 63 dB
Co-channel rejection >= 9 dBc
Transmitter
Maximum output power (E-GSM
900/GSM850)
at ambient temperature
33 dBm +/- 2 dB
Maximum output power
(DCS1800/PCS1900)
at ambient temperature
30 dBm +/- 2 dB
Minimum output power (E-GSM
900/GSM850)
at ambient temperature
5 dBm +/- 5 dB
Minimum output power
(DCS1800/PCS1900)
at ambient temperature
0 dBm +/- 5 dB
8.2.7.3 External Antenna
The external antenna is connected to the Fastrack Supreme via the SMA connector.
The external antenna must fulfill the characteristics listed in the table below.
Table 30: External antenna characteristics
Antenna frequency range Quad-band GSM 850/GSM900/DCS1800/PCS1900 MHz
Impedance 50 Ohms nominal
DC impedance 0 Ohm
Gain (antenna + cable) 0 dBi
VSWR (antenna + cable) 2
Note: Refer to Section 10 for recommended antenna.
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8.3 Environmental Characteristics
The Fastrack Supreme Plug & Play is compliant with the following operating class.
To ensure the proper operation of the Fastrack Supreme, the temperature of the
environment must be within a specific range as described in the table below.
Table 31: Ranges of temperature
No IESM Current Drain
Conditions Temperature Range
Operating / Class A -20°C ~ +55°C
Operating / Class B Note1 -30°C ~ +75°C
Operating / Class C Note1 -30°C ~ +85°C
Storage Note1 -40°C ~ +85°C
Note1: Please refer to the Remark in Section 7.9 for RTC battery related issue.
Function Status Classification:
Class A:
The Fastrack Supreme remains fully functional, meeting GSM performance criteria in
accordance with ETSI requirements, across the specified temperature range.
Class B:
The Fastrack Supreme remains fully functional, across the specified temperature
range. Some GSM parameters may occasionally deviate from the ETSI/PTCRB
specified requirements and this deviation does not affect the ability of the Fastrack
Supreme to connect to the cellular network and function fully, as it does within the
Class A range.
Class C:
The functional requirements will not be fulfilled during external influence, but will
return to fully functional automatically, after the external influence has been removed.
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The detailed climatic and mechanics standard environmental constraints applicable to
the Fastrack Supreme are listed in the table below:
Table 32: Environmental standard constraints
Environmental Tests
(IEC TR 60721-4)
Environmental Classes
(IEC 60721-3)
Operation
Tests Standards
Storage
(IEC 60721-
3-1)
Class IE13
Transportation
(IEC 60721-3-2)
Class IE23
Stationary
(IEC 60721-3-
3)
Class IE35
Non-Stationary
(IEC 60721-3-7)
Class IE73
Cold IEC 60068-2-1 :
Ab/Ad
-25°C, 16 h -40°C, 16 h -5°C, 16 h -5°C, 16 h
Dry heat IEC 60068-2-2 :
Bb/Bd
+70°C, 16 h +70°C, 16 h +55°C, 16 h +55°C, 16 h
Change of
temperature
IEC 60068-2-14
: Na/Nb
-33°C to
ambient
2 cycles, t1=3
h
1 °C.min-1
-40°C to ambient
5 cycles, t1=3 h
t2<3 min
-5°C to ambient
2 cycles, t1=3 h
0,5 °C.min-1
-5°C to ambient
5 cycles, t1=3 h
t2<3 min
Damp heat IEC 60068-2-56
: Cb
+30°C, 93% RH
96 h
+40°C, 93% RH
96 h minimum
+30°C, 93% RH,
96 h
+30°C, 93% RH, 96 h
Damp heat,
cyclic
60068-2-30 : Db
Variant 1 or 2
+40°C, 90% to
100% RH
One cycle
Variant 2
+55°C, 90% to 100% RH
Two cycles
Variant 2
+30°C, 90% to
100% RH
Two cycles
Variant 2
+40°C, 90% to 100%
RH
Two cycles
Variant 1
Vibration
(sinusoidal)
IEC 60068-2-6 :
Fc
1-200 Hz
2 m.s-2
0,75 mm
3 axes
10 sweep
cycles
1-500 Hz
10 m.s-2
3,5 mm
3 axes
10 sweep cycles
1-150 Hz
2 m.s-2
0,75 mm
3 axes
5 sweep cycles
1-500 Hz
10 m.s-2
3,5 mm
3 axes
10 sweep cycles
Vibration
(random)
IEC 60068-2-64
: Fh
- 10-100 Hz / 1,0 m2.s-3
100-200 Hz / -3
dB.octave-1
200-2000 Hz / 0,5 m2.s-3
3 axes
30 min
-
-
Shock
(half-sine)
IEC 60068-2-27
: Ea
- - 50 m.s-2
6 ms
3 shocks
6 directions
150 m.s-2
11 ms
3 shocks
6 directions
Bump
IEC 60068-2-29
: Eb
- 250 m.s-2
6 ms
50 bumps
vertical direction
-
-
Free fall ISO 4180-2 - Two falls in each
specified attitude
- 2 falls in each
specified attitude
0,025 m (<1kg)
Drop and topple
IEC 60068-2-31
: Ec
-
One drop on relevant
corner
One topple about each
bottom edge
-
One drop on each
relevant corner
One topple on each of
4 bottom edges
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Notes:
Short description of Class IE13 (For more information see standard IEC 60721-3-1)
"Locations without controlled temperature and humidity, where heating may be used
to raise low temperatures, locations in buildings providing minimal protection against
daily variations of external climate, prone to receiving rainfall from carrying wind".
Short description of Class IE23 (For more information, see standard IEC 60721-3-2)
"Transportation in unventilated compartments and in conditions without protection
against bad weather, in all sorts of trucks and trailers in areas of well developed road
network, in trains equipped with buffers specially designed to reduce shocks and by
boat".
Short description of Class IE35 (For more information see standard IEC 60721-3-3)
"Locations with no control on heat or humidity where heating may be used to raise
low temperatures, to places inside a building to avoid extremely high temperatures,
to places such as hallways, building staircases, cellars, certain workshops,
equipment stations without surveillance".
Short description of Class IE73 (For more information see standard IEC 60721-3-7)
"Transfer to places where neither temperature nor humidity are controlled but where
heating may be used to raise low temperatures, to places exposed to water droplets,
products can be subjected to ice formation, these conditions are found in hallways
and building staircases, garages, certain workshops, factory building and places for
industrial processes and hardware stations without surveillance".
Warning: The specification in the above table applies to the Fastrack Supreme
product only. Customers are advised to verify that the environmental specification of
the SIM Card used is compliant with the Fastrack Supreme environmental
specifications. Any application must be qualified by the customer with the SIM Card
in storage, transportation and operation.
The use of standard SIM cards may drastically reduce the environmental conditions in
which the Product can be used. These cards are particularly sensible to humidity and
temperature changes. These conditions may produce oxidation of the SIM card
metallic layers and cause, in the long term, electrical discontinuities. This is
particularly true in left alone applications, where no frequent extraction/insertion of
the SIM card is performed.
In case of mobility when the application is moved through different environments
with temperature variations, some condensation may appear. These events have a
negative impact on the SIM and may favor oxidation.
If the use of standard SIM card, with exposition to the environmental conditions
described above, can not be avoided, special care must be taken in the integration of
the final application in order to minimize the impact of these conditions. The solutions
that may be proposed are:
• Lubrication of the SIM card to protect the SIM Contact from oxidation.
• Putting the Fastrack Supreme Plug & Play in a waterproof enclosure with
desiccant bags.
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Lubrication of the SIM card had been tested by Wavecom (using Tutela Fluid 43EM
from MOLYDUVAL) and gives very good results.
If waterproof enclosure with a desiccant solution is used, check with your desiccant
retailer the quantity that must be used according to the enclosure dimensions. Ensure
humidity has been removed before sealing the enclosure.
Any solution selected must be qualified by the customer on the final application.
To minimize oxidation problem on the SIM card, its manipulation must be done with
the greatest precautions. In particular, the metallic contacts of the card must never be
touched with bare fingers or any matter which may contain polluted materials liable
to produce oxidation (such as, e.g. substances including chlorine). In case a cleaning
of the Card is necessary, a dry cloth must be used (never use any chemical
substance).
8.4 Conformity
The complete product complies with the essential requirements of article 3 of R&TTE
1999/5/EC Directive and satisfied the following standards:
Domain Applicable standard
Safety standard EN 60950 (ed.1999)
Efficient use of the radio
frequency spectrum
EN 301 419-(v 4.1.1)
EN 301 511 (V 9.0.2)
EMC EN 301 489–1 (edition 2002)
EN 301 489-7 (edition 2002)
Global Certification Forum –
Certification Criteria
GCF-CC V3.26.0
PTCRB NAPRD.03 V3.11.0
FCC FCC Part 15
FCC Part 22, 24
IC RSS-132 Issue 2
RSS-133 Issue 3
8.5 Protections
8.5.1 Power Supply
The Fastrack Supreme is protected by a 800 mA / 250 V fuse directly bonded on the
power supply cable.
The model of fuse used is: FSD 800 mA / 250 V FAST-ACTING.
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8.5.2 Overvoltage
The Fastrack Supreme is protected against voltage over +32 V.
When input voltages exceed +32 V, the supply voltage is disconnected in order to
protect the internal electronic components from an overvoltage.
8.5.3 Electrostatic Discharge
The Fastrack Supreme withstands ESD according to IEC 1000-4-2 requirements for all
accessible parts of the Fastrack Supreme except the RF part:
• 8 kV of air discharge,
• 4 kV of contact discharge.
8.5.4 Miscellaneous
Filtering guarantees:
• EMI/RFI protection in input and output,
• Signal smoothing.
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9 Safety Recommendations
9.1 General Safety
It is important to follow any special regulations regarding the use of radio equipment
due in particular to the possibility of radio frequency (RF) interference. Please follow
the safety advice given below carefully.
Switch OFF your Wireless CPU®:
• When in an aircraft. The use of cellular telephones in an aircraft may endanger
the operation of the aircraft, disrupt the cellular network and is illegal. Failure to
observe this instruction may lead to suspension or denial of cellular telephone
services to the offender, or legal action or both,
• When at a refueling point,
• When in any area with a potentially explosive atmosphere which could cause
an explosion or fire,
• In hospitals and any other place where medical equipment may be in use.
Respect restrictions on the use of radio equipment in:
• Fuel depots,
• Chemical plants,
• Places where blasting operations are in progress,
• Any other area where signalization reminds that the use of cellular telephone is
forbidden or dangerous.
• Any other area where you would normally be advised to turn off your vehicle
engine.
There may be a hazard associated with the operation of your Fastrack Supreme Plug
& Play close to inadequately protected personal medical devices such as hearing aids
and pacemakers. Consult the manufacturers of the medical device to determine if it is
adequately protected.
Operation of your Fastrack Supreme Plug & Play close to other electronic equipment
may also cause interference if the equipment is inadequately protected. Observe any
warning signs and manufacturers’ recommendations.
The Fastrack Supreme Plug & Play is designed for and intended to be used in "fixed"
and "mobile" applications:
"Fixed" means that the device is physically secured at one location and is not able
to be easily moved to another location.
"Mobile" means that the device is designed to be used in other than fixed locations
and generally in such a way that a separation distance of at least 20 cm (8
inches) is normally maintained between the transmitter’s antenna and the body of
the user or nearby persons.
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The Fastrack Supreme Plug & Play is not designed for and intended to be used in
portable applications (within 20 cm or 8 inches of the body of the user) and such
uses are strictly prohibited.
9.2 Vehicle Safety
Do not use your Fastrack Supreme Plug & Play while driving, unless equipped with a
correctly installed vehicle kit allowing ’Hands-Free’ Operation.
Respect national regulations on the use of cellular telephones in vehicles. Road safety
always comes first.
If incorrectly installed in a vehicle, the operation of Fastrack Supreme Plug & Play
telephone could interfere with the correct functioning of vehicle electronics. To avoid
such problems, make sure that the installation has been performed by a qualified
personnel. Verification of the protection of vehicle electronics should form part of the
installation.
The use of an alert device to operate a vehicle’s lights or horn on public roads is not
permitted.
9.3 Care and Maintenance
Your Fastrack Supreme Plug & Play is the product of advanced engineering, design
and craftsmanship and should be treated with care. The suggestion below will help
you to enjoy this product for many years.
Do not expose the Fastrack Supreme Plug & Play to any extreme environment where
the temperature or humidity is high.
Do not use or store the Fastrack Supreme Plug & Play in dusty or dirty areas. Its
moving parts (SIM holder for example) can be damaged.
Do not attempt to disassemble the Wireless CPU®. There are no user serviceable parts
inside.
Do not expose the Fastrack Supreme Plug & Play to water, rain or spilt beverages. It
is not waterproof.
Do not abuse your Fastrack Supreme Plug & Play by dropping, knocking, or violently
shaking it. Rough handling can damage it.
Do not place the Fastrack Supreme Plug & Play alongside computer discs, credit or
travel cards or other magnetic media. The information contained on discs or cards
may be affected by the Wireless CPU®.
The use of third party equipment or accessories, not made or authorized by Wavecom
may invalidate the warranty of the Wireless CPU®.
Do contact an authorized Service Center in the unlikely event of a fault in the Wireless
CPU®.
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9.4 Your Responsibility
This Fastrack Supreme Plug & Play is under your responsibility. Please treat it with
care respecting all local regulations. It is not a toy. Therefore, keep it in a safe place at
all times and out of the reach of children.
Try to remember your Unlock and PIN codes. Become familiar with and use the
security features to block unauthorized use and theft.
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10 Recommended Accessories
Accessories recommended by Wavecom for the Fastrack Supreme are given in the
table below.
Table 33: List of recommended accessories
Designation Part number Supplier
1140.26 ALLGON
Quad-band antenna MA112VX00 MAT Equipment
MCA1890 MH/PB/SMA m HIRSCHMANN
SMA/FME Antenna
adaptor
PROCOM
Power adaptor
(Europe)
EGSTDW P2 EF9W3 24W
Out:12 V - 2A
In: 100 to 240 V – 50/60 Hz – 550 mA
Mounted with micro-fit connector
EGSTDW (for power
adaptor)
MOLEX (for micro-fit
connector)*
Fuse F800L250V Shanghai Fullness
IESM GPS + USB FSUE01 WAVECOM
IESM IO + USB FSUE02 WAVECOM
IESM IO + USB +
GPS
FSUE03 WAVECOM
IESM Ethernet FSUE04 WAVECOM
* Information not available for this preliminary version.
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Table 34: Fastrack Supreme Family
Designation Part number Supplier
Fastrack Supreme 10 FSU001 WAVECOM
Fastrack Supreme 20 FSU002 WAVECOM
IESM GPS + USB FSUE01 WAVECOM
IESM IO + USB FSUE02 WAVECOM
IESM IO + USB + GPS FSUE03 WAVECOM
IESM Ethernet FSUE04 WAVECOM
FSU 10 IESM GPS+USB FSUP01 WAVECOM
FSU 20 IESM GPS+USB FSUP02 WAVECOM
FSU 10 IESM IO+USB FSUP03 WAVECOM
FSU 20 IESM IO+USB FSUP04 WAVECOM
FSU 10 IESM IO+USB+GPS FSUP05 WAVECOM
FSU 20 IESM IO+USB+GPS FSUP06 WAVECOM
FSU 10 IESM Ethernet FSUP07 WAVECOM
FSU 20 IESM Ethernet FSUP08 WAVECOM
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2014 Microchip Technology Inc. DS00001658B-page 1
Product Features
• High Performance 32-bit Embedded Controller
• Low power ~4mA in active mode
• System in deep sleep consumes 0.26mA
• 3.3-Volt I/O
• Package
- 6mm x 6mm body, 84-TFBGA
Sensor Firmware
• Sensor fusion firmware is licensed from Bosch or
Movea. Common features include:
- Self-contained 9-axis sensor fusion
- Sensor data pass-through
- Fast in-use background calibration of all sensors
and calibration monitor
- Magnetic immunity: Enhanced magnetic distortion,
detection and suppression
- Gyroscope drift cancellation
- Ambient Light Sensor Support
• Windows 8/8.1 certification (HID over I2C)
• Easy to implement complete turnkey sensor
fusion solution
• Sensor power management
• Sensor agnostic
• Refer to Bosch and Movea sensor fusion firmware
addendums for additional sensor fusion details
and supported sensors
Hardware Features
The hardware features in the SSC7102 device include
the following:
• Two SMB/I2C Controllers
- Supports I2C bus speeds to 400kHz
- Multi-master Capable
- Supports Clock Stretching
• Windows 8 HID over I2C Support
• LPC Interface
- HID over LPC Support
• Low Power Modes
Target Markets
• PCs: Ultrabooks and 2-in-1 Convertibles
• Mobile: Tablets, Smartphones
• Remote Controls, Gaming
• Fitness Monitoring
Description
The SSC7102 sensor fusion hub is a Windows 8.1 certified,
HID over I2C, low-power, flexible, turnkey solution.
SSC7102 makes implementing sensor fusion
easy for ultrabooks, tablets, and smartphones. Microchip
partnered with multiple industry-leading sensor
manufacturers and sensor-fusion specialists to create
this solution, enabling faster time to market without the
need for sensor-fusion expertise. The SSC7102 is
extremely efficient. It consumes ~4mA while running
complex sensor-fusion algorithms, resulting in longer
battery life for Windows 8.1 tablet, laptop, ultrabook,
and smart phone applications.
SSC7102
Sensor Hub Product Brief
SSC7102
DS00001658B-page 2 2014 Microchip Technology Inc.
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
2014 Microchip Technology Inc. DS00001658B-page 3
SSC7102
PACKAGE OUTLINE
84-pin TFBGA Package Outline
Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging.
SSC7102
DS00001658B-page 4 2014 Microchip Technology Inc.
SYSTEM BLOCK DIAGRAM
2014 Microchip Technology Inc. DS00001658B-page 5
SSC7102
APPENDIX A: REVISION HISTORY
Revision Section/Figure/Entry Correction
REV B Features
Product Identification System
Wording of first bullet under Product Features modified
for clarity.
URL in Note 2 modified.
REV A Document release
SSC7102
DS00001658B-page 6 2014 Microchip Technology Inc.
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains
the following information:
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and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification”
and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://microchip.com/support
2014 Microchip Technology Inc. DS00001658B-page 7
SSC7102
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.(1) XXX(2) XXX
Package Sensor
Fusion
Device
Device: SSC7102(1)
Package: GQ = 84 pin TFBGA(2)
Sensor Fusion
Firmware:
AA0 = Bosch 9-axis Sensor Fusion
BA0 = Movea 9-axis Sensor Fusion
Tape and Reel
Option:
Blank = Tray packaging
TR = Tape and Reel(3)
Examples:
a) SSC7102-GQ-AA0 = 84-TFBGA, Bosch 9-axis
sensor fusion.
b) SSC7102-GQ-BA0 = 84-TFBGA, Movea 9-axis
sensor fusion.
Note 3: Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](3)
Tape and Reel
Option
Firmware
- - -
Series
Note 2: All package options are RoHS compliant.
For RoHS compliance and environmental
information, please visit http://www.microchip.
com/pagehandler/en-us/aboutus/
Note 1: These products meet the halogen maximum
concentration values per IEC61249-2-21.
SSC7102
DS00001658B-page 8 2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of
Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly
or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32
logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM,
MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and ZScale
are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
A more complete list of registered trademarks and common law trademarks owned by Standard Microsystems Corporation (“SMSC”)
is available at: www.smsc.com. The absence of a trademark (name, logo, etc.) from the list does not constitute a waiver of any
intellectual property rights that SMSC has established in any of its trademarks.
All other trademarks mentioned herein are property of their respective companies.
© 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781620778326
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2014 Microchip Technology Inc. DS00001658B-page 9
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10/28/13
http://www.farnell.com/datasheets/1793972.pdf
www.epcos.com
EPCOS
Leaded Transient Voltage/RFI Suppressors (SHCVs)
2011
© EPCOS AG · A Member of TDK-EPC Corporation
4th Edition 08/2011 · Ordering No. B72482S9999X2 · Printed in Germany · SO 0811.5
Sample Kit 2011
Leaded Transient Voltage/
RFI Suppressors (SHCVs)
for Combined Overvoltage and RFI Suppression in Electric Motors,
SR6
K20M105X
SR6
K35M474X
SR1
K20M474X
SR1
K20M105X
SR1
K20M155X
SR1
K20M225X
SR2
S14BM475X
SR2
K20M474X
SR2
K20M105X
Product Range
Electrical parameters of leaded transient voltage / RFI suppressors in the sample kit
What are leaded transient voltage/
RFI suppressors (SHCVs)?
� Leaded transient voltage / RFI suppressors (also called SHCV varistors) are leaded devices in a
single component for combined overvoltage protection and RFI noise suppression on DC lines
of small electric motors in industrial and automotive applications
� SHVC varistors are a combination of high capacitance multilayer capacitor with X7R characteristic
for RF filtering and a multilayer varistor for transient protection
Construction of
leaded transient voltage /
RFI suppressors (SHCVs)
Benefits for customer applications
� Combined protection against overvoltage transients and RFI suppression in a bidirectional
single component
� Reliable protection against automotive transients such as load dump and jump start
� Maximum surge current capability (8/20 µs) up to 1200 A
� High capacitance of up to 4.7 µF
� Automotive series approval based on AEC-Q200 Rev-C
� No temperature derating up to 125 °C
Important information: Some parts of this publication contain statements about the suitability of our products for certain areas of application. These
statements are based on our knowledge of typical requirements that are often placed on our products. We expressly point out that these statements
cannot be regarded as binding statements about the suitability of our products for a particular customer application. It is incumbent on the customer
to check and decide whether a product is suitable for use in a particular application. This publication is only a brief product survey which may be
changed from time to time. Our products are described in detail in our data sheets. The Important notes (www.epcos.com /ImportantNotes) and the
product-specific Cautions and warnings must be observed. All relevant information is available through our sales offices.
Ordering code EPCOS type VDC. max l
surge, max WLD Vjump VV Vclamp, max l
clamp Cnom
@ 8/20 µs 10 pulses @ 5 min @ 1 mA @ 8/20 µs
[V] [A] [J] [V] [V] [V] [A] [nF]
Automotive series
B72527G3200K000 SR6K20M105X 26 200 1.5 – 33 ±10% 54 1 1000 ±20%
B72527E3350K000 SR6K35M474X 45 100 1.5 – 56 ±10% 90 1 470 ±20%
B72587E3200K000 SR1K20M474X 26 800 6 26 33±10% 58 10 470 ±20%
B72587G3200K000 SR1K20M105X 26 800 6 26 33 ±10% 58 5 1000 ±20%
B72587H3200K000 SR1K20M155X 26 800 6 26 33 ±10% 58 5 1500 ±20%
B72587J3200K000 SR1K20M225X 26 800 6 26 33 ±10% 58 5 2200 ±20%
B72547L3140S200 SR2S14BM475X 16 1200 12 24.5 22 +23/-0% 40 10 4700 ±20%
B72547E3200K000 SR2K20M474X 26 1200 12 26 33 ±10% 58 10 470 ±20%
B72547G3200K000 SR2K20M105X 26 1200 12 26 33 ±10% 58 10 1000 ±20%
Leaded Transient Voltage/
RFI Suppressors (SHCVs)
for Combined Overvoltage and
RFI Suppression in Electric Motors
www.epcos.com
© EPCOS AG 2011,
SR6
K20M105X
SR6
K35M474X
SR1
K20M474X
SR1
K20M105X
SR1
K20M155X
SR1
K20M225X
SR2
S14BM475X
SR2
K20M474X
SR2
K20M105X
Product Range
Electrical parameters of leaded transient voltage / RFI suppressors in the sample kit
What are leaded transient voltage/
RFI suppressors (SHCVs)?
� Leaded transient voltage / RFI suppressors (also called SHCV varistors) are leaded devices in a
single component for combined overvoltage protection and RFI noise suppression on DC lines
of small electric motors in industrial and automotive applications
� SHVC varistors are a combination of high capacitance multilayer capacitor with X7R characteristic
for RF filtering and a multilayer varistor for transient protection
Construction of
leaded transient voltage /
RFI suppressors (SHCVs)
Benefits for customer applications
� Combined protection against overvoltage transients and RFI suppression in a bidirectional
single component
� Reliable protection against automotive transients such as load dump and jump start
� Maximum surge current capability (8/20 µs) up to 1200 A
� High capacitance of up to 4.7 µF
� Automotive series approval based on AEC-Q200 Rev-C
� No temperature derating up to 125 °C
Important information: Some parts of this publication contain statements about the suitability of our products for certain areas of application. These
statements are based on our knowledge of typical requirements that are often placed on our products. We expressly point out that these statements
cannot be regarded as binding statements about the suitability of our products for a particular customer application. It is incumbent on the customer
to check and decide whether a product is suitable for use in a particular application. This publication is only a brief product survey which may be
changed from time to time. Our products are described in detail in our data sheets. The Important notes (www.epcos.com /ImportantNotes) and the
product-specific Cautions and warnings must be observed. All relevant information is available through our sales offices.
Ordering code EPCOS type VDC. max l
surge, max WLD Vjump VV Vclamp, max l
clamp Cnom
@ 8/20 µs 10 pulses @ 5 min @ 1 mA @ 8/20 µs
[V] [A] [J] [V] [V] [V] [A] [nF]
Automotive series
B72527G3200K000 SR6K20M105X 26 200 1.5 – 33 ±10% 54 1 1000 ±20%
B72527E3350K000 SR6K35M474X 45 100 1.5 – 56 ±10% 90 1 470 ±20%
B72587E3200K000 SR1K20M474X 26 800 6 26 33±10% 58 10 470 ±20%
B72587G3200K000 SR1K20M105X 26 800 6 26 33 ±10% 58 5 1000 ±20%
B72587H3200K000 SR1K20M155X 26 800 6 26 33 ±10% 58 5 1500 ±20%
B72587J3200K000 SR1K20M225X 26 800 6 26 33 ±10% 58 5 2200 ±20%
B72547L3140S200 SR2S14BM475X 16 1200 12 24.5 22 +23/-0% 40 10 4700 ±20%
B72547E3200K000 SR2K20M474X 26 1200 12 26 33 ±10% 58 10 470 ±20%
B72547G3200K000 SR2K20M105X 26 1200 12 26 33 ±10% 58 10 1000 ±20%www.epcos.com
EPCOS
Leaded Transient Voltage/RFI Suppressors (SHCVs)
2011
© EPCOS AG · A Member of TDK-EPC Corporation
4th Edition 08/2011 · Ordering No. B72482S9999X2 · Printed in Germany · SO 0811.5
Sample Kit 2011
Leaded Transient Voltage/
RFI Suppressors (SHCVs)
for Combined Overvoltage and RFI Suppression in Electric Motors
© 2009 Microchip Technology Inc. DS21210N-page 1
24AA024/24LC024/24AA025/24LC025
Device Selection Table
Features:
• Single Supply with Operation from 1.7V to 5.5V
for 24AA024/24AA025 Devices, 2.5V for
24LC024/24LC025 Devices
• Low-Power CMOS Technology:
- Read current 1 mA, typical
- Standby current 1 μA, typical
• 2-Wire Serial Interface, I2C™ Compatible
• Cascadable up to Eight Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 5 ms Maximum
• Self-timed Erase/Write Cycle
• 16-Byte Page Write Buffer
• Hardware Write-Protect on 24XX024 Devices
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, TDFN and MSOP
• 6-Lead SOT-23 Package, 24XX025 only
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24AA024/24LC024/
24AA025/24LC025 is a 2 Kbit Serial Electrically
Erasable PROM with a voltage range of 1.7V to 5.5V.
The device is organized as a single block of 256 x 8-bit
memory with a 2-wire serial interface. Low current
design permits operation with typical standby and
active currents of only 1 μA and 1 mA, respectively.
The device has a page write capability for up to 16
bytes of data. Functional address lines allow the
connection of up to eight 24AA024/24LC024/
24AA025/24LC025 devices on the same bus for up to
16K bits of contiguous EEPROM memory. The device
is available in the standard 8-pin PDIP, 8-pin SOIC
(3.90 mm), TSSOP, 2x3 DFN and TDFN and MSOP
packages. The 24AA025/24LC025 is also available in
the 6-lead SOT-23 package.
Package Types
Block Diagram
Part
Number
VCC
Range
Max
Clock
Temp.
Range
Write
Protect
24AA024 1.7V-5.5V 400 kHz(1) I Yes
24AA025 1.7V-5.5V 400 kHz(1) I No
24LC024 2.5V-5.5V 400 kHz I, E Yes
24LC025 2.5V-5.5V 400 kHz I, E No
Note 1: 100 kHz for VCC < 2.5V
Note: WP pin is not internally connected on the
24XX025.
A0
A1
A2
VSS
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
PDIP/SOIC/TSSOP/MSOP
A0
A1
A2
VSS
WP
SCL
SDA
8 VCC
7
6
5
1
2
3
4
SOT-23
SCL VCC
SDA
VSS A0
A1
DFN/TDFN
1
2
3 4
5
6
I/O
Control
Logic
Memory
Control
Logic XDEC
HV Generator
EEPROM
Array
Write-Protect
Circuitry
YDEC
VCC
VSS
Sense Amp.
R/W Control
SDA SCL
A0 A1 A2 WP*
2K I2C™ Serial EEPROM
24AA024/24LC024/24AA025/24LC025
DS21210N-page 2 © 2009 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
TABLE 1-1: DC SPECIFICATIONS
DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
— A0, A1, A2, SCL, SDA
and WP pins
— — — — —
D1 VIH High-level input voltage 0.7 VCC — — V —
D2 VIL Low-level input voltage — — 0.3 VCC V 0.2 VCC for VCC < 2.5V
D3 VHYS Hysteresis of Schmitt
Trigger inputs
0.05 VCC — — V (Note)
D4 VOL Low-level output voltage — — 0.40 V IOL = 3.0 mA, VCC = 2.5V
D5 ILI Input leakage current — — ±1 μA VIN = VSS or VCC
D6 ILO Output leakage current — — ±1 μA VOUT = VSS or VCC
D7 CIN,
COUT
Pin capacitance
(all inputs/outputs)
— — 10 pF VCC = 5.5V (Note)
TA = 25°C, FCLK = 1 MHz
D8 ICC write Operating current — 0.1 3 mA VCC = 5.5V, SCL = 400 kHz
D9 ICC read — 0.05 1 mA —
D10 ICCS Standby current ——
0.01
—
15
μA
μA
Industrial
Automotive
SDA = SCL = VCC
A0, A1, A2, WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
© 2009 Microchip Technology Inc. DS21210N-page 3
24AA024/24LC024/24AA025/24LC025
TABLE 1-2: AC CHARACTERISTICS
AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No. Symbol Characteristic Min. Max. Units Conditions
1 FCLK Clock frequency —
—
100
400
kHz 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
2 THIGH Clock high time 4000
600
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
3 TLOW Clock low time 4700
1300
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
4 TR SDA and SCL rise time (Note 1) ——
1000
300
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
5 TF SDA and SCL fall time (Note 1) ——
1000
300
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
6 THD:STA Start condition hold time 4000
600
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
7 TSU:STA Start condition setup time 4700
600
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
8 THD:DAT Data input hold time 0 — ns (Note 2)
9 TSU:DAT Data input setup time 250
100
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
10 TSU:STO Stop condition setup time 4000
600
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
11 TSU:WP WP setup time 4000
600
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
12 THD:WP WP hold time 4700
600
——
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
13 TAA Output valid from clock (Note 2) ——
3500
900
ns 1.7V ≤ VCC < 1.8V
1.8V ≤ VCC ≤ 5.5V
14 TBUF Bus free time: Time the bus must
be free before a new transmission
can start
1300
4700
——ns 1.7V ≤
VCC <
1.8V
1.8V ≤ VCC ≤ 5.5V
16 TSP Input filter spike suppression
(SDA and SCL pins)
— 50 ns (Note 1 and Note 3)
17 TWC Write cycle time (byte or page) — 5 ms —
18 — Endurance 1M — cycles 25°C, VCC = 5.5V, Block mode
(Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike
suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please
consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
24AA024/24LC024/24AA025/24LC025
DS21210N-page 4 © 2009 Microchip Technology Inc.
FIGURE 1-1: BUS TIMING DATA
(unprotected)
(protected)
SCL
SDA
In
SDA
Out
WP
5
7
6
16
3
2
8 9
13
D4 4
10
11 12
14
© 2009 Microchip Technology Inc. DS21210N-page 5
24AA024/24LC024/24AA025/24LC025
2.0 PIN DESCRIPTIONS
Pin Function Table
2.1 SDA Serial Data
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal; therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.2 SCL Serial Clock
The SCL input is used to synchronize the data transfer
from and to the device.
2.3 A0, A1, A2
The levels on the A0, A1 and A2 inputs are compared
with the corresponding bits in the slave address. The
chip is selected if the compare is true. For the SOT-23
package only, pin A2 is not connected.
Up to eight 24AA024/24LC024/24AA025/24LC025
devices (four for the SOT-23 package) may be connected
to the same bus by using different Chip Select
bit combinations. These inputs must be connected to
either VCC or VSS.
2.4 WP (24XX024 Only)
WP is the hardware write-protect pin. It must be tied to
VCC or VSS. If tied to Vcc, hardware write protection is
enabled. If WP is tied to Vss, the hardware write
protection is disabled. Note that the WP pin is available
only on the 24XX024. This pin is not internally
connected on the 24LC025.
2.5 Noise Protection
The 24AA024/24LC024/24AA025/24LC025 employs a
VCC threshold detector circuit which disables the
internal erase/write logic if the VCC is below 1.5V at
nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
3.0 FUNCTIONAL DESCRIPTION
The 24AA024/24LC024/24AA025/24LC025 supports
a bidirectional, 2-wire bus and data transmission
protocol. A device that sends data onto the bus is
defined as transmitter, while a device receiving data
is defined as receiver. The bus has to be controlled
by a master device that generates the Serial Clock
(SCL), controls the bus access and generates the
Start and Stop conditions, while the 24AA024/
24LC024/24AA025/24LC025 works as slave. Both
master and slave can operate as transmitter or
receiver, but the master device determines which
mode is activated.
Name PDIP SOIC TSSOP DFN/TDFN MSOP SOT-23 Description
A0 1 1 1 1 1 5 Address Pin AO
A1 2 2 2 2 2 4 Address Pin A1
A2 3 3 3 3 3 — Address Pin A2
VSS 4 4 4 4 4 2 Ground
SDA 5 5 5 5 5 3 Serial Address/Data I/O
SCL 6 6 6 6 6 1 Serial Clock
WP 7 7 7 7 7 — Write-Protect Input
VCC 8 8 8 8 8 6 +1.7 to 5.5V Power Supply
24AA024/24LC024/24AA025/24LC025
DS21210N-page 6 © 2009 Microchip Technology Inc.
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1 Bus Not Busy (A)
Both data and clock lines remain high.
4.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3 Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited (though only the last sixteen will
be stored when performing a write operation). When an
overwrite does occur, it will replace data in a first-in
first-out fashion.
4.5 Acknowledge
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse, which is associated with this Acknowledge bit.
The device that acknowledges has to pull down the SDA
line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of
the acknowledge-related clock pulse. Of course, setup
and hold times must be taken into account. A master
must signal an end of data to the slave by not generating
an Acknowledge bit on the last byte that has been
clocked out of the slave. In this case, the slave must
leave the data line high to enable the master to generate
the Stop condition (Figure 4-2).
FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
FIGURE 4-2: ACKNOWLEDGE TIMING
Note: The 24AA024/24LC024/24AA025/24LC025
does not generate any Acknowledge bits if
an internal programming cycle is in progress.
SCL (A) (B) (C) (D) (C) (A)
SDA
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
SCL 1 2 3 4 5 6 7 8 9 1 2 3
Transmitter must release the SDA line at this point allowing
the Receiver to pull the SDA line low to acknowledge the
previous eight bits of data.
Receiver must release the SDA line at this
point so the Transmitter can continue
sending data.
SDA
Acknowledge
Bit
Data from transmitter Data from transmitter
© 2009 Microchip Technology Inc. DS21210N-page 7
24AA024/24LC024/24AA025/24LC025
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24AA024/24LC024/24AA025/24LC025, this is set
as ‘1010’ binary for read and write operations. The next
three bits of the control byte are the Chip Select bits
(A2, A1, A0). The Chip Select bits allow the use of up
to eight 24AA024/24LC024/24AA025/24LC025
devices on the same bus and are used to select which
device is accessed. The Chip Select bits in the control
byte must correspond to the logic levels on the corresponding
A2, A1 and A0 pins for the device to respond.
These bits are in effect the three Most Significant bits of
the word address.
For the SOT-23 package, the A2 address pin is not
available. During device addressing, the A2 Chip
Select bit should be set to ‘0’.
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected. Following the Start condition, the 24AA024/
24LC024/24AA025/24LC025 monitors the SDA bus
checking the control byte being transmitted. Upon
receiving a ‘1010’ code and appropriate Chip Select
bits, the slave device outputs an Acknowledge signal
on the SDA line. Depending on the state of the R/W bit,
the 24AA024/24LC024/24AA025/24LC025 will select a
read or write operation.
FIGURE 5-1: CONTROL BYTE FORMAT
5.1 Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 16K bits
by adding up to eight 24AA024/24LC024/24AA025/
24LC025 devices on the same bus. In this case, software
can use A0 of the control byte as address bit A8,
A1 as address bit A9 and A2 as address bit A10. It is
not possible to sequentially read across device
boundaries.
For the SOT-23 package, up to four 24AA025/24LC025
devices can be added for up to 8K bits of address
space. In this case, software can use A0 of the control
byte as address bit A8, and A1 as address bit A9. It is
not possible to sequentially read across device boundaries.
S 1 0 1 0 A2 A1 A0 R/W ACK
Control Code
Chip Select
Bits
Slave Address
Start Bit Acknowledge Bit
Read/Write Bit
24AA024/24LC024/24AA025/24LC025
DS21210N-page 8 © 2009 Microchip Technology Inc.
6.0 WRITE OPERATIONS
6.1 Byte Write
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit (which is a logic-low) is placed onto the bus by the
master transmitter. The device will acknowledge this
control byte during the ninth clock pulse. The next byte
transmitted by the master is the word address and will
be written into the Address Pointer of the 24AA024/
24LC024/24AA025/24LC025. After receiving another
Acknowledge signal from the 24AA024/24LC024/
24AA025/24LC025, the master device will transmit the
data word to be written into the addressed memory
location. The 24AA024/24LC024/24AA025/24LC025
acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle and, during
this time, the 24AA024/24LC024/24AA025/
24LC025 will not generate Acknowledge signals
(Figure 6-1). If an attempt is made to write to the
protected portion of the array when the hardware write
protection (24XX024 only) has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
6.2 Page Write
The write control byte, word address and the first data
byte are transmitted to the 24AA024/24LC024/
24AA025/24LC025 in the same way as in a byte write.
However, instead of generating a Stop condition, the
master transmits up to 15 additional data bytes to the
24AA024/24LC024/24AA025/24LC025, which are
temporarily stored in the on-chip page buffer and will be
written into the memory once the master has transmitted
a Stop condition. Upon receipt of each word, the
four lower-order Address Pointer bits are internally
incremented by one.
The higher-order four bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte-write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 6-2). If an attempt
is made to write to the protected portion of the array
when the hardware write protection has been enabled,
the device will acknowledge the command, but no data
will be written. The write cycle time must be observed
even if write protection is enabled.
6.3 Write Protection
The WP pin (available on 24XX024 only) must be tied
to VCC or VSS. If tied to VCC, the entire array will be
write-protected. If the WP pin is tied to VSS, write
operations to all address locations are allowed.
The WP pin is not available on the SOT-23 package.
FIGURE 6-1: BYTE WRITE
FIGURE 6-2: PAGE WRITE
Note: Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
S P
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
ST
A
RT
ST
OP
Control
Byte
Word
Address Data
A
CK
A
CK
A
CK
S P
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
ST
A
RT
Control
Byte
Word
Address (n) Data (n) Data (n + 15)
ST
OP
A
CK
A
CK
A
CK
A
CK
A
CK
Data (n +1)
© 2009 Microchip Technology Inc. DS21210N-page 9
24AA024/24LC024/24AA025/24LC025
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle, with ACK
polling being initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If no
ACK is returned, the Start bit and control byte must be
re-sent. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for a flow
diagram of this operation.
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
No
Yes
24AA024/24LC024/24AA025/24LC025
DS21210N-page 10 © 2009 Microchip Technology Inc.
8.0 READ OPERATIONS
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1 Current Address Read
The 24AA024/24LC024/24AA025/24LC025 contains
an address counter that maintains the address of the
last word accessed, internally incremented by one.
Therefore, if the previous read access was to address
n, the next current address read operation would
access data from address n + 1. Upon receipt of the
slave address with the R/W bit set to ‘1’, the 24AA024/
24LC024/24AA025/24LC025 issues an acknowledge
and transmits the 8-bit data word. The master will not
acknowledge the transfer, but does generate a Stop
condition and the 24AA024/24LC024/24AA025/
24LC025 discontinues transmission (Figure 8-1).
8.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24AA024/24LC024/24AA025/24LC025
as part of a write operation. Once the word address is
sent, the master generates a Start condition following
the acknowledge. This terminates the write operation,
but not before the internal Address Pointer is set. The
master then issues the control byte again, but with the
R/W bit set to a ‘1’. The 24AA024/24LC024/24AA025/
24LC025 will then issue an acknowledge and transmits
the eight bit data word. The master will not acknowledge
the transfer but does generate a Stop condition
and the 24AA024/24LC024/24AA025/24LC025
discontinues transmission (Figure 8-2). After this
command, the internal address counter will point to the
address location following the one that was just read.
8.3 Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24AA024/24LC024/
24AA025/24LC025 transmits the first data byte, the
master issues an acknowledge (as opposed to a Stop
condition in a random read). This directs the 24AA024/
24LC024/24AA025/24LC025 to transmit the next
sequentially-addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 24AA024/24LC024/
24AA025/24LC025 contains an internal Address
Pointer that is incremented by one upon completion of
each operation. This Address Pointer allows the entire
memory contents to be serially read during one
operation. The internal Address Pointer will
automatically roll over from address 0FFh to address
000h.
FIGURE 8-1: CURRENT ADDRESS
READ
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
S P
STOP
Control
Byte
START
Data
A
C
K
NOACK
© 2009 Microchip Technology Inc. DS21210N-page 11
24AA024/24LC024/24AA025/24LC025
FIGURE 8-2: RANDOM READ
FIGURE 8-3: SEQUENTIAL READ
S S P
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
ST
A
RT
STOP
Control
Byte
ACK
Word
Address (n)
Control
Byte
START
Data (n)
ACK
ACK
NO
ACK
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
Control
Byte Data (n) Data (n + 1) Data (n + 2) Data (n + x)
N
OA
CK
A
CK
A
CK
A
CK
A
CK
STOP
P
24AA024/24LC024/24AA025/24LC025
DS21210N-page 12 © 2009 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIC (3.90 mm) Example:
8-Lead TSSOP Example:
24LC024
I/P 13F
0519
24LC024I
SN 0519
13F
8-Lead MSOP Example:
XXXX
TYWW
NNN
XXXXT
YWWNNN
4L24
I519
13F
4L24I
51913F
XXXXXXXT
XXXXYYWW
NNN
8-Lead 2x3 DFN Example:
e3
e3
XXX
YWW
NN
2P4
519
13
8-Lead 2x3 TDFN Example:
XXX
YWW
NN
AP4
519
13
© 2009 Microchip Technology Inc. DS21210N-page 13
24AA024/24LC024/24AA025/24LC025
Part Number
1st Line Marking Codes
TSSOP MSOP
DFN TDFN SOT-23
I-TEMP E-TEMP I-TEMP E-TEMP I-TEMP E-TEMP
24AA024 4A24 4A24T 2P1 — AP1 — — —
24LC024 4L24 4L24T 2P4 AP5 AP4 2P5 — —
24AA025 4A25 4A25T 2R1 — AR1 — HQNN HRNN
24LC025 4L25 4L25T 2R4 AR5 AR4 2R5 HMNN HPNN
Note: T = Temperature grade (I, E)
6-Lead SOT-23
XXNN HQEC
Example:
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
e3
e3
Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
24AA024/24LC024/24AA025/24LC025
DS21210N-page 14 © 2009 Microchip Technology Inc.
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© 2009 Microchip Technology Inc. DS21210N-page 15
24AA024/24LC024/24AA025/24LC025
!
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24AA024/24LC024/24AA025/24LC025
DS21210N-page 16 © 2009 Microchip Technology Inc.
!
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© 2009 Microchip Technology Inc. DS21210N-page 17
24AA024/24LC024/24AA025/24LC025
() )"*
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© 2009 Microchip Technology Inc. DS21210N-page 19
24AA024/24LC024/24AA025/24LC025
.
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24AA024/24LC024/24AA025/24LC025
DS21210N-page 20 © 2009 Microchip Technology Inc.
.
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© 2009 Microchip Technology Inc. DS21210N-page 21
24AA024/24LC024/24AA025/24LC025
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DS21210N-page 22 © 2009 Microchip Technology Inc.
.
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© 2009 Microchip Technology Inc. DS21210N-page 23
24AA024/24LC024/24AA025/24LC025
3
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24AA024/24LC024/24AA025/24LC025
DS21210N-page 24 © 2009 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision F
Corrections to Section 1.0, Electrical Characteristics.
Revision G
Added part number 24AA025 to document.
Correction to Section 1.0, Ambient Temperature.
Revision H
Added DFN package.
Revision J (02/2007)
Revised Features section; Revised Pin Function Table;
Changed 1.8V to 1.7V, Table 1-1 and Table 1-2;
Replaced Package Drawings; Replaced On-line
Support page; Revised Product ID section.
Revision K (03/2007)
Replaced Package Drawings (Rev. AM).
Revision L (04/2008)
Replaced Package Drawings; Added TDFN package;
Revised Product ID section.
Revision M (10/2009)
Added E-temp; Revised Section 1.0; Table 1-2; Figure
1-1; 1st Line Marking Codes table in Section 9.1;
Product ID section.
Revision N (10/2009)
Added 6-lead SOT-23 Package. Revised Sections 5.0,
5.1 and 6.3.
© 2009 Microchip Technology Inc. DS21210N-page 25
24AA024/24LC024/24AA025/24LC025
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
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• General Technical Support – Frequently Asked
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CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
24AA024/24LC024/24AA025/24LC025
DS21210N-page 26 © 2009 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product.
If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
24AA024/24LC024/24AA025/24LC025 DS21210N
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
© 2009 Microchip Technology Inc. DS21210N-page 27
24AA024/24LC024/24AA025/24LC025
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: 24AA024: 1.7V, 2 Kbit Addressable Serial EEPROM with
WP pin.
24AA024T:1.7V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with WP pin.
24LC024: 2.5V, 2 Kbit Addressable Serial EEPROM with
WP pin.
24LC024T:2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with WP pin.
24AA025: 1.7V, 2 Kbit Addressable Serial EEPROM with
no WP pin.
24AA025T:1.7V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
24LC025: 2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
24LC025T:2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
Temperature Range: I = -40°C to +85°C
E = -40°C to +125°C
Package: OT = Plastic Small Outline (SOT-23), (Tape and Reel
only), (24XX025 only), 6-lead
P = Plastic DIP, (300 mil Body), 8-lead
SN = Plastic SOIC, (3.90 mm Body)
ST = TSSOP, 8-lead
MS = MSOP, 8-lead
MC = 2x3 DFN, 8-lead
MNY(1) = Plastic Dual Flat (TDFN), No lead package,
2x3 mm body, 8-lead
PART NO. X /XX
Temperature Package
Range
Device
Examples:
a) 24AA024-I/P: Industrial Temperature,
1.7V, PDIP Package
b) 24AA024-I/SN: Industrial Temperature,
1.7V, SOIC Package
c) 24AA025T-I/ST: Industrial Temperature,
1.7V, TSSOP Package, Tape and Reel
d) 24LC024-I/P: Industrial Temperature,
2.5V, PDIP Package
e) 24LC024-E/MS: Automotive Temperature,
2.5V, MSOP Package, Tape and
Reel
f) 24LC025T-I/OT: Industrial Temperature,
2.5V, SOT-23 Package, Tape and Reel
Note 1: “Y” indicates a Nickel, Palladium, Gold (NiPdAu) finish.
24AA024/24LC024/24AA025/24LC025
DS21210N-page 28 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS21210N-page 29
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21210N-page 30 © 2009 Microchip Technology Inc.
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WORLDWIDE SALES AND SERVICE
03/26/09
DATA SHEET
Product data sheet
Supersedes data of 1999 Apr 15
2004 Jan 21
DISCRETE SEMICONDUCTORS
PMBT4403
PNP switching transistor
dbook, halfpage
M3D088
2004 Jan 21 2
NXP Semiconductors Product data sheet
PNP switching transistor PMBT4403
FEATURES
•High current (max. 600 mA)
•Low voltage (max. 40 V).
APPLICATIONS
•Industrial and consumer switching applications.
DESCRIPTION
PNP switching transistor in a SOT23 plastic package. NPN complement: PMBT4401.
MARKING
Note
1.* = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.
PINNING
TYPE NUMBER
MARKING CODE(1)
PMBT4403
*2T
PIN
DESCRIPTION
1
base
2
emitter
3
collector
Fig.1 Simplified outline (SOT23) and symbol.handbook, halfpage213MAM256Top view231
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1.Transistor mounted on an FR4 printed-circuit board.
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
PMBT4403
−
plastic surface mounted package; 3 leads
SOT23
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
−40
V
VCEO
collector-emitter voltage
open base
−
−40
V
VEBO
emitter-base voltage
open collector
−
−5
V
IC
collector current (DC)
−
−600
mA
ICM
peak collector current
−
−800
mA
IBM
peak base current
−
−200
mA
Ptot
total power dissipation
Tamb ≤ 25 °C; note 1
−
250
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
2004 Jan 21 3
NXP Semiconductors Product data sheet
PNP switching transistor PMBT4403
THERMAL CHARACTERISTICS
Note
1.Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
note 1
500
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
ICBO
collector-base cut-off current
IE = 0; VCB = −40 V
−
−50
nA
IEBO
emitter-base cut-off current
IC = 0; VEB = −5 V
−
−50
nA
hFE
DC current gain
VCE = −1 V; (see Fig.2)
IC = −0.1 mA
30
−
IC = −1 mA
60
−
IC = −10 mA
100
−
VCE = −2 V
IC = −150 mA
100
300
IC = −500 mA
20
−
VCEsat
collector-emitter saturation voltage
IC = −150 mA; IB = −15 mA
−
−400
mV
IC = −500 mA; IB = −50 mA
−
−750
mV
VBEsat
base-emitter saturation voltage
IC = −150 mA; IB = −15 mA
−
−950
mV
IC = −500 mA; IB = −50 mA
−
−1.3
V
Cc
collector capacitance
IE = Ie = 0; VCB = −10 V; f = 1 MHz
−
8.5
pF
Ce
emitter capacitance
IC = Ic = 0; VEB = −500 mV; f = 1 MHz
−
35
pF
fT
transition frequency
IC = −20 mA; VCE = −10 V; f = 100 MHz
200
−
MHz
Switching times (between 10% and 90% levels); (see Fig.3)
ton
turn-on time
ICon = −150 mA; IBon = −15 mA; IBoff = 15 mA
−
40
ns
td
delay time
−
15
ns
tr
rise time
−
30
ns
toff
turn-off time
−
350
ns
ts
storage time
−
300
ns
tf
fall time
−
50
ns
2004 Jan 21 4
NXP Semiconductors Product data sheet
PNP switching transistor PMBT4403
Fig.2 DC current gain; typical values.ndbook, full pagewidth0300100200MGD812−10−1−1−10−102−103hFEIC mAVCE = −1 V
Fig.3 Test circuit for switching times.handbook, full pagewidthRCR2R1DUTMGD624VoRB(probe)450 Ω(probe)450 ΩoscilloscopeoscilloscopeVBBViVCCVi = −9.5 V; T = 500 μs; tp = 10 μs; tr = tf ≤ 3 ns.R1 = 68 Ω; R2 = 325 Ω; RB = 325 Ω; RC = 160 Ω.VBB = 3.5 V; VCC = −29.5 V.Oscilloscope: input impedance Zi = 50 Ω.
2004 Jan 21 5
NXP Semiconductors Product data sheet
PNP switching transistor PMBT4403
PACKAGE OUTLINEUNITA1max.bpcDE e1HELpQwv REFERENCESOUTLINEVERSIONEUROPEANPROJECTIONISSUE DATE04-11-0406-03-16 IEC JEDEC JEITAmm0.10.480.380.150.093.02.81.41.20.95e1.92.52.10.550.450.10.2DIMENSIONS (mm are the original dimensions)0.450.15 SOT23TO-236ABbpDe1eAA1LpQdetail XHEEwMvMABAB012 mmscaleA1.10.9cX123Plastic surface-mounted package; 3 leadsSOT23
2004 Jan 21 6
NXP Semiconductors Product data sheet
PNP switching transistor PMBT4403
DATA SHEET STATUS
Notes
1.Please consult the most recently issued document before initiating or completing a design.
2.The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
DOCUMENTSTATUS(1)
PRODUCT STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
DISCLAIMERS
General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
NXP Semiconductors
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R75/04/pp7 Date of release: 2004 Jan 21 Document order number: 9397 750 12501
© 2009 Microchip Technology Inc. DS39632E
PIC18F2455/2550/4455/4550
Data Sheet
28/40/44-Pin, High-Performance,
Enhanced Flash, USB Microcontrollers
with nanoWatt Technology
DS39632E-page ii © 2009 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc. DS39632E-page 1
PIC18F2455/2550/4455/4550
Universal Serial Bus Features:
• USB V2.0 Compliant
• Low Speed (1.5 Mb/s) and Full Speed (12 Mb/s)
• Supports Control, Interrupt, Isochronous and Bulk
Transfers
• Supports up to 32 Endpoints (16 bidirectional)
• 1 Kbyte Dual Access RAM for USB
• On-Chip USB Transceiver with On-Chip Voltage
Regulator
• Interface for Off-Chip USB Transceiver
• Streaming Parallel Port (SPP) for USB streaming
transfers (40/44-pin devices only)
Power-Managed Modes:
• Run: CPU on, Peripherals on
• Idle: CPU off, Peripherals on
• Sleep: CPU off, Peripherals off
• Idle mode Currents Down to 5.8 μA Typical
• Sleep mode Currents Down to 0.1 μA Typical
• Timer1 Oscillator: 1.1 μA Typical, 32 kHz, 2V
• Watchdog Timer: 2.1 μA Typical
• Two-Speed Oscillator Start-up
Flexible Oscillator Structure:
• Four Crystal modes, including High-Precision PLL
for USB
• Two External Clock modes, Up to 48 MHz
• Internal Oscillator Block:
- 8 user-selectable frequencies, from 31 kHz
to 8 MHz
- User-tunable to compensate for frequency drift
• Secondary Oscillator using Timer1 @ 32 kHz
• Dual Oscillator Options allow Microcontroller and
USB module to Run at Different Clock Speeds
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if any clock stops
Peripheral Highlights:
• High-Current Sink/Source: 25 mA/25 mA
• Three External Interrupts
• Four Timer modules (Timer0 to Timer3)
• Up to 2 Capture/Compare/PWM (CCP) modules:
- Capture is 16-bit, max. resolution 5.2 ns (TCY/16)
- Compare is 16-bit, max. resolution 83.3 ns (TCY)
- PWM output: PWM resolution is 1 to 10-bit
• Enhanced Capture/Compare/PWM (ECCP) module:
- Multiple output modes
- Selectable polarity
- Programmable dead time
- Auto-shutdown and auto-restart
• Enhanced USART module:
- LIN bus support
• Master Synchronous Serial Port (MSSP) module
Supporting 3-Wire SPI (all 4 modes) and I2C™
Master and Slave modes
• 10-Bit, Up to 13-Channel Analog-to-Digital Converter
(A/D) module with Programmable Acquisition Time
• Dual Analog Comparators with Input Multiplexing
Special Microcontroller Features:
• C Compiler Optimized Architecture with Optional
Extended Instruction Set
• 100,000 Erase/Write Cycle Enhanced Flash
Program Memory Typical
• 1,000,000 Erase/Write Cycle Data EEPROM
Memory Typical
• Flash/Data EEPROM Retention: > 40 Years
• Self-Programmable under Software Control
• Priority Levels for Interrupts
• 8 x 8 Single-Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):
- Programmable period from 41 ms to 131s
• Programmable Code Protection
• Single-Supply 5V In-Circuit Serial
Programming™ (ICSP™) via Two Pins
• In-Circuit Debug (ICD) via Two Pins
• Optional Dedicated ICD/ICSP Port (44-pin, TQFP
package only)
• Wide Operating Voltage Range (2.0V to 5.5V)
Device
Program Memory Data Memory
I/O 10-Bit
A/D (ch)
CCP/ECCP
(PWM) SPP
MSSP
EUSART
Comparators
Timers
Flash 8/16-Bit
(bytes)
# Single-Word
Instructions
SRAM
(bytes)
EEPROM
(bytes) SPI Master
I2C™
PIC18F2455 24K 12288 2048 256 24 10 2/0 No Y Y 1 2 1/3
PIC18F2550 32K 16384 2048 256 24 10 2/0 No Y Y 1 2 1/3
PIC18F4455 24K 12288 2048 256 35 13 1/1 Yes Y Y 1 2 1/3
PIC18F4550 32K 16384 2048 256 35 13 1/1 Yes Y Y 1 2 1/3
28/40/44-Pin, High-Performance, Enhanced Flash,
USB Microcontrollers with nanoWatt Technology
PIC18F2455/2550/4455/4550
DS39632E-page 2 © 2009 Microchip Technology Inc.
Pin Diagrams
40-Pin PDIP
PIC18F2455
28-Pin PDIP, SOIC
PIC18F2550
10
11
2
345
6
1
8
7
9
12
13
14 15
16
17
18
19
20
23
24
25
26
27
28
22
21
MCLR/VPP/RE3
RA0/AN0
RA1/AN1
RA2/AN2/VREF-/CVREF
RA3/AN3/VREF+
RA4/T0CKI/C1OUT/RCV
RA5/AN4/SS/HLVDIN/C2OUT
VSS
OSC1/CLKI
OSC2/CLKO/RA6
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2(1)/UOE
RC2/CCP1
VUSB
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/AN11/KBI0
RB3/AN9/CCP2(1)/VPO
RB2/AN8/INT2/VMO
RB1/AN10/INT1/SCK/SCL
RB0/AN12/INT0/FLT0/SDI/SDA
VDD
VSS
RC7/RX/DT/SDO
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/AN11/KBI0/CSSPP
RB3/AN9/CCP2(1)/VPO
RB2/AN8/INT2/VMO
RB1/AN10/INT1/SCK/SCL
RB0/AN12/INT0/FLT0/SDI/SDA
VDD
VSS
RD7/SPP7/P1D
RD6/SPP6/P1C
RD5/SPP5/P1B
RD4/SPP4
RC7/RX/DT/SDO
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
RD2/SPP2
MCLR/VPP/RE3
RA0/AN0
RA1/AN1
RA2/AN2/VREF-/CVREF
RA3/AN3/VREF+
RA4/T0CKI/C1OUT/RCV
RA5/AN4/SS/HLVDIN/C2OUT
RE0/AN5/CK1SPP
RE1/AN6/CK2SPP
RE2/AN7/OESPP
VDD
VSS
OSC1/CLKI
OSC2/CLKO/RA6
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2(1)/UOE
RC2/CCP1/P1A
VUSB
RD0/SPP0
RD1/SPP1
12
34
56789
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
PIC18F4455
PIC18F4550
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
© 2009 Microchip Technology Inc. DS39632E-page 3
PIC18F2455/2550/4455/4550
Pin Diagrams (Continued)
PIC18F4455
44-Pin TQFP
44-Pin QFN
PIC18F4455
PIC18F4550
PIC18F4550
10
11
23
6
1
18
19
20
21
22
12
13
14
15
38
8 7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
RA3/AN3/VREF+
RA2/AN2/VREF-/CVREF
RA1/AN1
RA0/AN0
MCLR/VPP/RE3
NC/ICCK(2)/ICPGC(2)
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/AN11/KBI0/CSSPP
NC/ICDT(2)/ICPGD(2)
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
RD2/SPP2
RD1/SPP1
RD0/SPP0
VUSB
RC2/CCP1/P1A
RC1/T1OSI/CCP2(1)/UOE
NC/ICPORTS(2)
NC/ICRST(2)/ICVPP(2)
RC0/T1OSO/T13CKI
OSC2/CLKO/RA6
OSC1/CLKI
VSS
VDD
RE2/AN7/OESPP
RE1/AN6/CK2SPP
RE0/AN5/CK1SPP
RA5/AN4/SS/HLVDIN/C2OUT
RA4/T0CKI/C1OUT/RCV
RC7/RX/DT/SDO
RD4/SPP4
RD5/SPP5/P1B
RD6/SPP6/P1C
VSS
VDD
RB0/AN12/INT0/FLT0/SDI/SDA
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
RB3/AN9/CCP2(1)/VPO
RD7/SPP7/P1D 5
4
10
11
23
6
1
18
19
20
21
22
12
13
14
15
38
8 7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
RA3/AN3/VREF+
RA2/AN2/VREF-/CVREF
RA1/AN1
RA0/AN0
MCLR/VPP/RE3
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/AN11/KBI0/CSSPP
NC
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
RD2/SPP2
RD1/SPP1
RD0/SPP0
VUSB
RC2/CCP1/P1A
RC1/T1OSI/CCP2(1)/UOE
RC0/T1OSO/T13CKI
OSC2/CLKO/RA6
OSC1/CLKI
VSS
VDD
RE2/AN7/OESPP
RE1/AN6/CK2SPP
RE0/AN5/CK1SPP
RA5/AN4/SS/HLVDIN/C2OUT
RA4/T0CKI/C1OUT/RCV
RC7/RX/DT/SDO
RD4/SPP4
RD5/SPP5/P1B
RD6/SPP6/P1C
VSS
VDD
RB0/AN12/INT0/FLT0/SDI/SDA
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
RB3/AN9/CCP2(1)/VPO
RD7/SPP7/P1D 5
4 VSS
VDD
VDD
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
2: Special ICPORT features available in select circumstances. See Section 25.9 “Special ICPORT Features (44-Pin TQFP
Package Only)” for more information.
PIC18F2455/2550/4455/4550
DS39632E-page 4 © 2009 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 23
3.0 Power-Managed Modes ............................................................................................................................................................. 35
4.0 Reset .......................................................................................................................................................................................... 45
5.0 Memory Organization ................................................................................................................................................................. 59
6.0 Flash Program Memory.............................................................................................................................................................. 81
7.0 Data EEPROM Memory ............................................................................................................................................................. 91
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 97
9.0 Interrupts .................................................................................................................................................................................... 99
10.0 I/O Ports ................................................................................................................................................................................... 113
11.0 Timer0 Module ......................................................................................................................................................................... 127
12.0 Timer1 Module ......................................................................................................................................................................... 131
13.0 Timer2 Module ......................................................................................................................................................................... 137
14.0 Timer3 Module ......................................................................................................................................................................... 139
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 143
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 151
17.0 Universal Serial Bus (USB) ...................................................................................................................................................... 165
18.0 Streaming Parallel Port ............................................................................................................................................................ 191
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 197
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 243
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 265
22.0 Comparator Module.................................................................................................................................................................. 275
23.0 Comparator Voltage Reference Module................................................................................................................................... 281
24.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 285
25.0 Special Features of the CPU.................................................................................................................................................... 291
26.0 Instruction Set Summary .......................................................................................................................................................... 313
27.0 Development Support............................................................................................................................................................... 363
28.0 Electrical Characteristics .......................................................................................................................................................... 367
29.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 407
30.0 Packaging Information.............................................................................................................................................................. 409
Appendix A: Revision History............................................................................................................................................................. 419
Appendix B: Device Differences......................................................................................................................................................... 419
Appendix C: Conversion Considerations ........................................................................................................................................... 420
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 420
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 421
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 421
Index .................................................................................................................................................................................................. 423
The Microchip Web Site ..................................................................................................................................................................... 433
Customer Change Notification Service .............................................................................................................................................. 433
Customer Support .............................................................................................................................................................................. 433
Reader Response .............................................................................................................................................................................. 434
PIC18F2455/2550/4455/4550 Product Identification System ............................................................................................................ 435
© 2009 Microchip Technology Inc. DS39632E-page 5
PIC18F2455/2550/4455/4550
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
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welcome your feedback.
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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PIC18F2455/2550/4455/4550
DS39632E-page 6 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS39632E-page 7
PIC18F2455/2550/4455/4550
1.0 DEVICE OVERVIEW
This document contains device-specific information for
the following devices:
This family of devices offers the advantages of all
PIC18 microcontrollers – namely, high computational
performance at an economical price – with the addition
of high-endurance, Enhanced Flash program
memory. In addition to these features, the
PIC18F2455/2550/4455/4550 family introduces design
enhancements that make these microcontrollers a logical
choice for many high-performance, power sensitive
applications.
1.1 New Core Features
1.1.1 nanoWatt TECHNOLOGY
All of the devices in the PIC18F2455/2550/4455/4550
family incorporate a range of features that can significantly
reduce power consumption during operation.
Key items include:
• Alternate Run Modes: By clocking the controller
from the Timer1 source or the internal oscillator
block, power consumption during code execution
can be reduced by as much as 90%.
• Multiple Idle Modes: The controller can also run
with its CPU core disabled but the peripherals still
active. In these states, power consumption can be
reduced even further, to as little as 4%, of normal
operation requirements.
• On-the-Fly Mode Switching: The
power-managed modes are invoked by user code
during operation, allowing the user to incorporate
power-saving ideas into their application’s
software design.
• Low Consumption in Key Modules: The power
requirements for both Timer1 and the Watchdog
Timer are minimized. See Section 28.0
“Electrical Characteristics” for values.
1.1.2 UNIVERSAL SERIAL BUS (USB)
Devices in the PIC18F2455/2550/4455/4550 family
incorporate a fully featured Universal Serial Bus
communications module that is compliant with the USB
Specification Revision 2.0. The module supports both
low-speed and full-speed communication for all supported
data transfer types. It also incorporates its own
on-chip transceiver and 3.3V regulator and supports
the use of external transceivers and voltage regulators.
1.1.3 MULTIPLE OSCILLATOR OPTIONS
AND FEATURES
All of the devices in the PIC18F2455/2550/4455/4550
family offer twelve different oscillator options, allowing
users a wide range of choices in developing application
hardware. These include:
• Four Crystal modes using crystals or ceramic
resonators.
• Four External Clock modes, offering the option of
using two pins (oscillator input and a divide-by-4
clock output) or one pin (oscillator input, with the
second pin reassigned as general I/O).
• An internal oscillator block which provides an
8 MHz clock (±2% accuracy) and an INTRC
source (approximately 31 kHz, stable over
temperature and VDD), as well as a range of
6 user-selectable clock frequencies, between
125 kHz to 4 MHz, for a total of 8 clock
frequencies. This option frees an oscillator pin for
use as an additional general purpose I/O.
• A Phase Lock Loop (PLL) frequency multiplier,
available to both the High-Speed Crystal and
External Oscillator modes, which allows a wide
range of clock speeds from 4 MHz to 48 MHz.
• Asynchronous dual clock operation, allowing the
USB module to run from a high-frequency
oscillator while the rest of the microcontroller is
clocked from an internal low-power oscillator.
Besides its availability as a clock source, the internal
oscillator block provides a stable reference source that
gives the family additional features for robust
operation:
• Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a
reference signal provided by the internal
oscillator. If a clock failure occurs, the controller is
switched to the internal oscillator block, allowing
for continued low-speed operation or a safe
application shutdown.
• Two-Speed Start-up: This option allows the
internal oscillator to serve as the clock source
from Power-on Reset, or wake-up from Sleep
mode, until the primary clock source is available.
• PIC18F2455 • PIC18LF2455
• PIC18F2550 • PIC18LF2550
• PIC18F4455 • PIC18LF4455
• PIC18F4550 • PIC18LF4550
PIC18F2455/2550/4455/4550
DS39632E-page 8 © 2009 Microchip Technology Inc.
1.2 Other Special Features
• Memory Endurance: The Enhanced Flash cells
for both program memory and data EEPROM are
rated to last for many thousands of erase/write
cycles – up to 100,000 for program memory and
1,000,000 for EEPROM. Data retention without
refresh is conservatively estimated to be greater
than 40 years.
• Self-Programmability: These devices can write to
their own program memory spaces under internal
software control. By using a bootloader routine,
located in the protected Boot Block at the top of
program memory, it becomes possible to create an
application that can update itself in the field.
• Extended Instruction Set: The
PIC18F2455/2550/4455/4550 family introduces
an optional extension to the PIC18 instruction set,
which adds 8 new instructions and an Indexed
Literal Offset Addressing mode. This extension,
enabled as a device configuration option, has
been specifically designed to optimize re-entrant
application code originally developed in high-level
languages such as C.
• Enhanced CCP Module: In PWM mode, this
module provides 1, 2 or 4 modulated outputs for
controlling half-bridge and full-bridge drivers.
Other features include auto-shutdown for
disabling PWM outputs on interrupt or other select
conditions, and auto-restart to reactivate outputs
once the condition has cleared.
• Enhanced Addressable USART: This serial
communication module is capable of standard
RS-232 operation and provides support for the LIN
bus protocol. The TX/CK and RX/DT signals can
be inverted, eliminating the need for inverting
buffers. Other enhancements include Automatic
Baud Rate Detection and a 16-bit Baud Rate
Generator for improved resolution. When the
microcontroller is using the internal oscillator
block, the EUSART provides stable operation for
applications that talk to the outside world without
using an external crystal (or its accompanying
power requirement).
• 10-Bit A/D Converter: This module incorporates
programmable acquisition time, allowing for a
channel to be selected and a conversion to be
initiated, without waiting for a sampling period and
thus, reducing code overhead.
• Dedicated ICD/ICSP Port: These devices
introduce the use of debugger and programming
pins that are not multiplexed with other microcontroller
features. Offered as an option in select
packages, this feature allows users to develop I/O
intensive applications while retaining the ability to
program and debug in the circuit.
1.3 Details on Individual Family
Members
Devices in the PIC18F2455/2550/4455/4550 family are
available in 28-pin and 40/44-pin packages. Block
diagrams for the two groups are shown in Figure 1-1
and Figure 1-2.
The devices are differentiated from each other in six
ways:
1. Flash program memory (24 Kbytes for
PIC18FX455 devices, 32 Kbytes for
PIC18FX550 devices).
2. A/D channels (10 for 28-pin devices, 13 for
40/44-pin devices).
3. I/O ports (3 bidirectional ports and 1 input only
port on 28-pin devices, 5 bidirectional ports on
40/44-pin devices).
4. CCP and Enhanced CCP implementation
(28-pin devices have two standard CCP
modules, 40/44-pin devices have one standard
CCP module and one ECCP module).
5. Streaming Parallel Port (present only on
40/44-pin devices).
All other features for devices in this family are identical.
These are summarized in Table 1-1.
The pinouts for all devices are listed in Table 1-2 and
Table 1-3.
Like all Microchip PIC18 devices, members of the
PIC18F2455/2550/4455/4550 family are available as
both standard and low-voltage devices. Standard
devices with Enhanced Flash memory, designated with
an “F” in the part number (such as PIC18F2550),
accommodate an operating VDD range of 4.2V to 5.5V.
Low-voltage parts, designated by “LF” (such as
PIC18LF2550), function over an extended VDD range
of 2.0V to 5.5V.
© 2009 Microchip Technology Inc. DS39632E-page 9
PIC18F2455/2550/4455/4550
TABLE 1-1: DEVICE FEATURES
Features PIC18F2455 PIC18F2550 PIC18F4455 PIC18F4550
Operating Frequency DC – 48 MHz DC – 48 MHz DC – 48 MHz DC – 48 MHz
Program Memory (Bytes) 24576 32768 24576 32768
Program Memory (Instructions) 12288 16384 12288 16384
Data Memory (Bytes) 2048 2048 2048 2048
Data EEPROM Memory (Bytes) 256 256 256 256
Interrupt Sources 19 19 20 20
I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E
Timers 4 4 4 4
Capture/Compare/PWM Modules 2 2 1 1
Enhanced Capture/
Compare/PWM Modules
0 0 1 1
Serial Communications MSSP,
Enhanced USART
MSSP,
Enhanced USART
MSSP,
Enhanced USART
MSSP,
Enhanced USART
Universal Serial Bus (USB)
Module
1 1 1 1
Streaming Parallel Port (SPP) No No Yes Yes
10-Bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels
Comparators 2 2 2 2
Resets (and Delays) POR, BOR,
RESET Instruction,
Stack Full,
Stack Underflow
(PWRT, OST),
MCLR (optional),
WDT
POR, BOR,
RESET Instruction,
Stack Full,
Stack Underflow
(PWRT, OST),
MCLR (optional),
WDT
POR, BOR,
RESET Instruction,
Stack Full,
Stack Underflow
(PWRT, OST),
MCLR (optional),
WDT
POR, BOR,
RESET Instruction,
Stack Full,
Stack Underflow
(PWRT, OST),
MCLR (optional),
WDT
Programmable Low-Voltage
Detect
Yes Yes Yes Yes
Programmable Brown-out Reset Yes Yes Yes Yes
Instruction Set 75 Instructions;
83 with Extended
Instruction Set
enabled
75 Instructions;
83 with Extended
Instruction Set
enabled
75 Instructions;
83 with Extended
Instruction Set
enabled
75 Instructions;
83 with Extended
Instruction Set
enabled
Packages 28-Pin PDIP
28-Pin SOIC
28-Pin PDIP
28-Pin SOIC
40-Pin PDIP
44-Pin QFN
44-Pin TQFP
40-Pin PDIP
44-Pin QFN
44-Pin TQFP
PIC18F2455/2550/4455/4550
DS39632E-page 10 © 2009 Microchip Technology Inc.
FIGURE 1-1: PIC18F2455/2550 (28-PIN) BLOCK DIAGRAM
Data Latch
Data Memory
(2 Kbytes)
Address Latch
Data Address<12>
12
BSR Access
4 4
PCH PCL
PCLATH
8
31 Level Stack
Program Counter
PRODH PRODL
8 x 8 Multiply
8
8 8
ALU<8>
Address Latch
Program Memory
(24/32 Kbytes)
Data Latch
20
8
8
Table Pointer<21>
inc/dec logic
21
8
Data Bus<8>
Table Latch
8
IR
12
3
ROM Latch
PCLATU
PCU
PORTE
MCLR/VPP/RE3(1)
Note 1: RE3 is multiplexed with MCLR and is only available when the MCLR Resets are disabled.
2: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer
to Section 2.0 “Oscillator Configurations” for additional information.
3: RB3 is the alternate pin for CCP2 multiplexing.
W
Instruction Bus <16>
STKPTR Bank
8
8
8
BITOP
FSR0
FSR1
FSR2
inc/dec
Address
12
Decode
logic
Comparator MSSP EUSART 10-Bit
ADC
HLVD Timer0 Timer1 Timer2 Timer3
CCP2
BOR Data
EEPROM
USB
Instruction
Decode &
Control
State Machine
Control Signals
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
OSC1(2)
OSC2(2)
VDD,
Brown-out
Reset
Internal
Oscillator
Fail-Safe
Clock Monitor
Reference
Band Gap
VSS
MCLR(1)
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
T1OSI
T1OSO
USB Voltage
VUSB Regulator
PORTB
PORTC
RB0/AN12/INT0/FLT0/SDI/SDA
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2(3)/UOE
RC2/CCP1
RC4/D-/VM
RC5/D+/VP
RC6/TX/CK
RC7/RX/DT/SDO
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
RB3/AN9/CCP2(3)/VPO
RB4/AN11/KBI0
RB5/KBI1/PGM
RB6/KBI2/PGC
RB7/KBI3/PGD
PORTA
RA4/T0CKI/C1OUT/RCV
RA5/AN4/SS/HLVDIN/C2OUT
RA3/AN3/VREF+
RA2/AN2/VREF-/CVREF
RA1/AN1
RA0/AN0
OSC2/CLKO/RA6
CCP1
© 2009 Microchip Technology Inc. DS39632E-page 11
PIC18F2455/2550/4455/4550
FIGURE 1-2: PIC18F4455/4550 (40/44-PIN) BLOCK DIAGRAM
Instruction
Decode &
Control
Data Latch
Data Memory
(2 Kbytes)
Address Latch
Data Address<12>
12
BSR Access
4 4
PCH PCL
PCLATH
8
31 Level Stack
Program Counter
PRODH PRODL
8 x 8 Multiply
8
BITOP
8 8
ALU<8>
Address Latch
Program Memory
(24/32 Kbytes)
Data Latch
20
8
8
Table Pointer<21>
inc/dec logic
21
8
Data Bus<8>
Table Latch
8
IR
12
3
ROM Latch
PORTD
RD0/SPP0:RD4/SPP4
PCLATU
PCU
PORTE
MCLR/VPP/RE3(1)
RE2/AN7/OESPP
RE0/AN5/CK1SPP
RE1/AN6/CK2SPP
Note 1: RE3 is multiplexed with MCLR and is only available when the MCLR Resets are disabled.
2: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer
to Section 2.0 “Oscillator Configurations” for additional information.
3: These pins are only available on 44-pin TQFP packages under certain conditions. Refer to Section 25.9 “Special ICPORT Features
(44-Pin TQFP Package Only)” for additional information.
4: RB3 is the alternate pin for CCP2 multiplexing.
Comparator MSSP EUSART 10-Bit
ADC
Timer0 Timer1 Timer2 Timer3
CCP2
HLVD
ECCP1
BOR Data
EEPROM
W
Instruction Bus <16>
STKPTR Bank
8
State Machine
Control Signals
8
8
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
OSC1(2)
OSC2(2)
VDD, VSS
Brown-out
Reset
Internal
Oscillator
Fail-Safe
Clock Monitor
Reference
Band Gap
MCLR(1)
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
T1OSI
T1OSO
RD5/SPP5/P1B
RD6/SPP6/P1C
RD7/SPP7/P1D
PORTA
PORTB
PORTC
RA4/T0CKI/C1OUT/RCV
RA5/AN4/SS/HLVDIN/C2OUT
RB0/AN12/INT0/FLT0/SDI/SDA
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2(4)/UOE
RC2/CCP1/P1A
RC4/D-/VM
RC5/D+/VP
RC6/TX/CK
RC7/RX/DT/SDO
RA3/AN3/VREF+
RA2/AN2/VREF-/CVREF
RA1/AN1
RA0/AN0
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
RB3/AN9/CCP2(4)/VPO
OSC2/CLKO/RA6
RB4/AN11/KBI0/CSSPP
RB5/KBI1/PGM
RB6/KBI2/PGC
RB7/KBI3/PGD
USB
FSR0
FSR1
FSR2
inc/dec
Address
12
Decode
logic
USB Voltage
Regulator
VUSB
ICRST(3)
ICPGC(3)
ICPGD(3)
ICPORTS(3)
PIC18F2455/2550/4455/4550
DS39632E-page 12 © 2009 Microchip Technology Inc.
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS
Pin Name
Pin
Number Pin
Type
Buffer
Type Description
PDIP,
SOIC
MCLR/VPP/RE3
MCLR
VPP
RE3
1
I
PI
ST
ST
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low
Reset to the device.
Programming voltage input.
Digital input.
OSC1/CLKI
OSC1
CLKI
9
II
Analog
Analog
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input.
External clock source input. Always associated with pin
function OSC1. (See OSC2/CLKO pin.)
OSC2/CLKO/RA6
OSC2
CLKO
RA6
10
O
O
I/O
—
—
TTL
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode.
In select modes, OSC2 pin outputs CLKO which has 1/4 the
frequency of OSC1 and denotes the instruction cycle rate.
General purpose I/O pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
© 2009 Microchip Technology Inc. DS39632E-page 13
PIC18F2455/2550/4455/4550
PORTA is a bidirectional I/O port.
RA0/AN0
RA0
AN0
2
I/O
I
TTL
Analog
Digital I/O.
Analog input 0.
RA1/AN1
RA1
AN1
3
I/O
I
TTL
Analog
Digital I/O.
Analog input 1.
RA2/AN2/VREF-/CVREF
RA2
AN2
VREFCVREF
4
I/O
IIO
TTL
Analog
Analog
Analog
Digital I/O.
Analog input 2.
A/D reference voltage (low) input.
Analog comparator reference output.
RA3/AN3/VREF+
RA3
AN3
VREF+
5
I/O
II
TTL
Analog
Analog
Digital I/O.
Analog input 3.
A/D reference voltage (high) input.
RA4/T0CKI/C1OUT/RCV
RA4
T0CKI
C1OUT
RCV
6
I/O
IOI
ST
ST
—
TTL
Digital I/O.
Timer0 external clock input.
Comparator 1 output.
External USB transceiver RCV input.
RA5/AN4/SS/
HLVDIN/C2OUT
RA5
AN4
SS
HLVDIN
C2OUT
7
I/O
IIIO
TTL
Analog
TTL
Analog
—
Digital I/O.
Analog input 4.
SPI slave select input.
High/Low-Voltage Detect input.
Comparator 2 output.
RA6 — — — See the OSC2/CLKO/RA6 pin.
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin
Number Pin
Type
Buffer
Type Description
PDIP,
SOIC
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
PIC18F2455/2550/4455/4550
DS39632E-page 14 © 2009 Microchip Technology Inc.
PORTB is a bidirectional I/O port. PORTB can be software
programmed for internal weak pull-ups on all inputs.
RB0/AN12/INT0/FLT0/
SDI/SDA
RB0
AN12
INT0
FLT0
SDI
SDA
21
I/O
IIII
I/O
TTL
Analog
ST
ST
ST
ST
Digital I/O.
Analog input 12.
External interrupt 0.
PWM Fault input (CCP1 module).
SPI data in.
I2C™ data I/O.
RB1/AN10/INT1/SCK/
SCL
RB1
AN10
INT1
SCK
SCL
22
I/O
II
I/O
I/O
TTL
Analog
ST
ST
ST
Digital I/O.
Analog input 10.
External interrupt 1.
Synchronous serial clock input/output for SPI mode.
Synchronous serial clock input/output for I2C mode.
RB2/AN8/INT2/VMO
RB2
AN8
INT2
VMO
23
I/O
IIO
TTL
Analog
ST
—
Digital I/O.
Analog input 8.
External interrupt 2.
External USB transceiver VMO output.
RB3/AN9/CCP2/VPO
RB3
AN9
CCP2(1)
VPO
24
I/O
I
I/O
O
TTL
Analog
ST
—
Digital I/O.
Analog input 9.
Capture 2 input/Compare 2 output/PWM2 output.
External USB transceiver VPO output.
RB4/AN11/KBI0
RB4
AN11
KBI0
25
I/O
II
TTL
Analog
TTL
Digital I/O.
Analog input 11.
Interrupt-on-change pin.
RB5/KBI1/PGM
RB5
KBI1
PGM
26
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
Low-Voltage ICSP™ Programming enable pin.
RB6/KBI2/PGC
RB6
KBI2
PGC
27
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming clock pin.
RB7/KBI3/PGD
RB7
KBI3
PGD
28
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming data pin.
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin
Number Pin
Type
Buffer
Type Description
PDIP,
SOIC
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
© 2009 Microchip Technology Inc. DS39632E-page 15
PIC18F2455/2550/4455/4550
PORTC is a bidirectional I/O port.
RC0/T1OSO/T13CKI
RC0
T1OSO
T13CKI
11
I/O
OI
ST
—
ST
Digital I/O.
Timer1 oscillator output.
Timer1/Timer3 external clock input.
RC1/T1OSI/CCP2/UOE
RC1
T1OSI
CCP2(2)
UOE
12
I/O
I
I/O
O
ST
CMOS
ST
—
Digital I/O.
Timer1 oscillator input.
Capture 2 input/Compare 2 output/PWM2 output.
External USB transceiver OE output.
RC2/CCP1
RC2
CCP1
13
I/O
I/O
ST
ST
Digital I/O.
Capture 1 input/Compare 1 output/PWM1 output.
RC4/D-/VM
RC4
DVM
15
I
I/O
I
TTL
—
TTL
Digital input.
USB differential minus line (input/output).
External USB transceiver VM input.
RC5/D+/VP
RC5
D+
VP
16
I
I/O
O
TTL
—
TTL
Digital input.
USB differential plus line (input/output).
External USB transceiver VP input.
RC6/TX/CK
RC6
TX
CK
17
I/O
O
I/O
ST
—
ST
Digital I/O.
EUSART asynchronous transmit.
EUSART synchronous clock (see RX/DT).
RC7/RX/DT/SDO
RC7
RX
DT
SDO
18
I/O
I
I/O
O
ST
ST
ST
—
Digital I/O.
EUSART asynchronous receive.
EUSART synchronous data (see TX/CK).
SPI data out.
RE3 — — — See MCLR/VPP/RE3 pin.
VUSB 14 P — Internal USB 3.3V voltage regulator output, positive supply for
internal USB transceiver.
VSS 8, 19 P — Ground reference for logic and I/O pins.
VDD 20 P — Positive supply for logic and I/O pins.
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin
Number Pin
Type
Buffer
Type Description
PDIP,
SOIC
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
PIC18F2455/2550/4455/4550
DS39632E-page 16 © 2009 Microchip Technology Inc.
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS
Pin Name
Pin Number Pin
Type
Buffer
Type Description
PDIP QFN TQFP
MCLR/VPP/RE3
MCLR
VPP
RE3
1 18 18
I
PI
ST
ST
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low
Reset to the device.
Programming voltage input.
Digital input.
OSC1/CLKI
OSC1
CLKI
13 32 30
II
Analog
Analog
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input.
External clock source input. Always associated with
pin function OSC1. (See OSC2/CLKO pin.)
OSC2/CLKO/RA6
OSC2
CLKO
RA6
14 33 31
O
O
I/O
—
—
TTL
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
In RC mode, OSC2 pin outputs CLKO which has 1/4
the frequency of OSC1 and denotes the instruction
cycle rate.
General purpose I/O pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG Configuration bit is cleared.
© 2009 Microchip Technology Inc. DS39632E-page 17
PIC18F2455/2550/4455/4550
PORTA is a bidirectional I/O port.
RA0/AN0
RA0
AN0
2 19 19
I/O
I
TTL
Analog
Digital I/O.
Analog input 0.
RA1/AN1
RA1
AN1
3 20 20
I/O
I
TTL
Analog
Digital I/O.
Analog input 1.
RA2/AN2/VREF-/
CVREF
RA2
AN2
VREFCVREF
4 21 21
I/O
IIO
TTL
Analog
Analog
Analog
Digital I/O.
Analog input 2.
A/D reference voltage (low) input.
Analog comparator reference output.
RA3/AN3/VREF+
RA3
AN3
VREF+
5 22 22
I/O
II
TTL
Analog
Analog
Digital I/O.
Analog input 3.
A/D reference voltage (high) input.
RA4/T0CKI/C1OUT/
RCV
RA4
T0CKI
C1OUT
RCV
6 23 23
I/O
IOI
ST
ST
—
TTL
Digital I/O.
Timer0 external clock input.
Comparator 1 output.
External USB transceiver RCV input.
RA5/AN4/SS/
HLVDIN/C2OUT
RA5
AN4
SS
HLVDIN
C2OUT
7 24 24
I/O
IIIO
TTL
Analog
TTL
Analog
—
Digital I/O.
Analog input 4.
SPI slave select input.
High/Low-Voltage Detect input.
Comparator 2 output.
RA6 — — — — — See the OSC2/CLKO/RA6 pin.
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
PDIP QFN TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG Configuration bit is cleared.
PIC18F2455/2550/4455/4550
DS39632E-page 18 © 2009 Microchip Technology Inc.
PORTB is a bidirectional I/O port. PORTB can be software
programmed for internal weak pull-ups on all inputs.
RB0/AN12/INT0/
FLT0/SDI/SDA
RB0
AN12
INT0
FLT0
SDI
SDA
33 9 8
I/O
IIII
I/O
TTL
Analog
ST
ST
ST
ST
Digital I/O.
Analog input 12.
External interrupt 0.
Enhanced PWM Fault input (ECCP1 module).
SPI data in.
I2C™ data I/O.
RB1/AN10/INT1/SCK/
SCL
RB1
AN10
INT1
SCK
SCL
34 10 9
I/O
II
I/O
I/O
TTL
Analog
ST
ST
ST
Digital I/O.
Analog input 10.
External interrupt 1.
Synchronous serial clock input/output for SPI mode.
Synchronous serial clock input/output for I2C mode.
RB2/AN8/INT2/VMO
RB2
AN8
INT2
VMO
35 11 10
I/O
IIO
TTL
Analog
ST
—
Digital I/O.
Analog input 8.
External interrupt 2.
External USB transceiver VMO output.
RB3/AN9/CCP2/VPO
RB3
AN9
CCP2(1)
VPO
36 12 11
I/O
I
I/O
O
TTL
Analog
ST
—
Digital I/O.
Analog input 9.
Capture 2 input/Compare 2 output/PWM2 output.
External USB transceiver VPO output.
RB4/AN11/KBI0/CSSPP
RB4
AN11
KBI0
CSSPP
37 14 14
I/O
IIO
TTL
Analog
TTL
—
Digital I/O.
Analog input 11.
Interrupt-on-change pin.
SPP chip select control output.
RB5/KBI1/PGM
RB5
KBI1
PGM
38 15 15
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
Low-Voltage ICSP™ Programming enable pin.
RB6/KBI2/PGC
RB6
KBI2
PGC
39 16 16
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming clock pin.
RB7/KBI3/PGD
RB7
KBI3
PGD
40 17 17
I/O
I
I/O
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming data pin.
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
PDIP QFN TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG Configuration bit is cleared.
© 2009 Microchip Technology Inc. DS39632E-page 19
PIC18F2455/2550/4455/4550
PORTC is a bidirectional I/O port.
RC0/T1OSO/T13CKI
RC0
T1OSO
T13CKI
15 34 32
I/O
OI
ST
—
ST
Digital I/O.
Timer1 oscillator output.
Timer1/Timer3 external clock input.
RC1/T1OSI/CCP2/
UOE
RC1
T1OSI
CCP2(2)
UOE
16 35 35
I/O
I
I/O
O
ST
CMOS
ST
—
Digital I/O.
Timer1 oscillator input.
Capture 2 input/Compare 2 output/PWM2 output.
External USB transceiver OE output.
RC2/CCP1/P1A
RC2
CCP1
P1A
17 36 36
I/O
I/O
O
ST
ST
TTL
Digital I/O.
Capture 1 input/Compare 1 output/PWM1 output.
Enhanced CCP1 PWM output, channel A.
RC4/D-/VM
RC4
DVM
23 42 42
I
I/O
I
TTL
—
TTL
Digital input.
USB differential minus line (input/output).
External USB transceiver VM input.
RC5/D+/VP
RC5
D+
VP
24 43 43
I
I/O
I
TTL
—
TTL
Digital input.
USB differential plus line (input/output).
External USB transceiver VP input.
RC6/TX/CK
RC6
TX
CK
25 44 44
I/O
O
I/O
ST
—
ST
Digital I/O.
EUSART asynchronous transmit.
EUSART synchronous clock (see RX/DT).
RC7/RX/DT/SDO
RC7
RX
DT
SDO
26 1 1
I/O
I
I/O
O
ST
ST
ST
—
Digital I/O.
EUSART asynchronous receive.
EUSART synchronous data (see TX/CK).
SPI data out.
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
PDIP QFN TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG Configuration bit is cleared.
PIC18F2455/2550/4455/4550
DS39632E-page 20 © 2009 Microchip Technology Inc.
PORTD is a bidirectional I/O port or a Streaming
Parallel Port (SPP). These pins have TTL input buffers
when the SPP module is enabled.
RD0/SPP0
RD0
SPP0
19 38 38
I/O
I/O
ST
TTL
Digital I/O.
Streaming Parallel Port data.
RD1/SPP1
RD1
SPP1
20 39 39
I/O
I/O
ST
TTL
Digital I/O.
Streaming Parallel Port data.
RD2/SPP2
RD2
SPP2
21 40 40
I/O
I/O
ST
TTL
Digital I/O.
Streaming Parallel Port data.
RD3/SPP3
RD3
SPP3
22 41 41
I/O
I/O
ST
TTL
Digital I/O.
Streaming Parallel Port data.
RD4/SPP4
RD4
SPP4
27 2 2
I/O
I/O
ST
TTL
Digital I/O.
Streaming Parallel Port data.
RD5/SPP5/P1B
RD5
SPP5
P1B
28 3 3
I/O
I/O
O
ST
TTL
—
Digital I/O.
Streaming Parallel Port data.
Enhanced CCP1 PWM output, channel B.
RD6/SPP6/P1C
RD6
SPP6
P1C
29 4 4
I/O
I/O
O
ST
TTL
—
Digital I/O.
Streaming Parallel Port data.
Enhanced CCP1 PWM output, channel C.
RD7/SPP7/P1D
RD7
SPP7
P1D
30 5 5
I/O
I/O
O
ST
TTL
—
Digital I/O.
Streaming Parallel Port data.
Enhanced CCP1 PWM output, channel D.
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
PDIP QFN TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG Configuration bit is cleared.
© 2009 Microchip Technology Inc. DS39632E-page 21
PIC18F2455/2550/4455/4550
PORTE is a bidirectional I/O port.
RE0/AN5/CK1SPP
RE0
AN5
CK1SPP
8 25 25
I/O
IO
ST
Analog
—
Digital I/O.
Analog input 5.
SPP clock 1 output.
RE1/AN6/CK2SPP
RE1
AN6
CK2SPP
9 26 26
I/O
IO
ST
Analog
—
Digital I/O.
Analog input 6.
SPP clock 2 output.
RE2/AN7/OESPP
RE2
AN7
OESPP
10 27 27
I/O
IO
ST
Analog
—
Digital I/O.
Analog input 7.
SPP output enable output.
RE3 — — — — — See MCLR/VPP/RE3 pin.
VSS 12, 31 6, 30,
31
6, 29 P — Ground reference for logic and I/O pins.
VDD 11, 32 7, 8,
28, 29
7, 28 P — Positive supply for logic and I/O pins.
VUSB 18 37 37 P — Internal USB 3.3V voltage regulator output, positive
supply for the USB transceiver.
NC/ICCK/ICPGC(3)
ICCK
ICPGC
— — 12
I/O
I/O
ST
ST
No Connect or dedicated ICD/ICSP™ port clock.
In-Circuit Debugger clock.
ICSP programming clock.
NC/ICDT/ICPGD(3)
ICDT
ICPGD
— — 13
I/O
I/O
ST
ST
No Connect or dedicated ICD/ICSP port clock.
In-Circuit Debugger data.
ICSP programming data.
NC/ICRST/ICVPP(3)
ICRST
ICVPP
— — 33
IP
——
No Connect or dedicated ICD/ICSP port Reset.
Master Clear (Reset) input.
Programming voltage input.
NC/ICPORTS(3)
ICPORTS
— — 34 P — No Connect or 28-pin device emulation.
Enable 28-pin device emulation when connected
to VSS.
NC — 13 — — — No Connect.
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number Pin
Type
Buffer
Type Description
PDIP QFN TQFP
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG Configuration bit is cleared.
PIC18F2455/2550/4455/4550
DS39632E-page 22 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS39632E-page 23
PIC18F2455/2550/4455/4550
2.0 OSCILLATOR
CONFIGURATIONS
2.1 Overview
Devices in the PIC18F2455/2550/4455/4550 family
incorporate a different oscillator and microcontroller
clock system than previous PIC18F devices. The addition
of the USB module, with its unique requirements
for a stable clock source, make it necessary to provide
a separate clock source that is compliant with both
USB low-speed and full-speed specifications.
To accommodate these requirements, PIC18F2455/
2550/4455/4550 devices include a new clock branch to
provide a 48 MHz clock for full-speed USB operation.
Since it is driven from the primary clock source, an
additional system of prescalers and postscalers has
been added to accommodate a wide range of oscillator
frequencies. An overview of the oscillator structure is
shown in Figure 2-1.
Other oscillator features used in PIC18 enhanced
microcontrollers, such as the internal oscillator block
and clock switching, remain the same. They are
discussed later in this chapter.
2.1.1 OSCILLATOR CONTROL
The operation of the oscillator in PIC18F2455/2550/
4455/4550 devices is controlled through two Configuration
registers and two control registers. Configuration
registers, CONFIG1L and CONFIG1H, select the
oscillator mode and USB prescaler/postscaler options.
As Configuration bits, these are set when the device is
programmed and left in that configuration until the
device is reprogrammed.
The OSCCON register (Register 2-2) selects the Active
Clock mode; it is primarily used in controlling clock
switching in power-managed modes. Its use is
discussed in Section 2.4.1 “Oscillator Control
Register”.
The OSCTUNE register (Register 2-1) is used to trim
the INTRC frequency source, as well as select the
low-frequency clock source that drives several special
features. Its use is described in Section 2.2.5.2
“OSCTUNE Register”.
2.2 Oscillator Types
PIC18F2455/2550/4455/4550 devices can be operated
in twelve distinct oscillator modes. In contrast with previous
PIC18 enhanced microcontrollers, four of these
modes involve the use of two oscillator types at once.
Users can program the FOSC3:FOSC0 Configuration
bits to select one of these modes:
1. XT Crystal/Resonator
2. HS High-Speed Crystal/Resonator
3. HSPLL High-Speed Crystal/Resonator
with PLL Enabled
4. EC External Clock with FOSC/4 Output
5. ECIO External Clock with I/O on RA6
6. ECPLL External Clock with PLL Enabled
and FOSC/4 Output on RA6
7. ECPIO External Clock with PLL Enabled,
I/O on RA6
8. INTHS Internal Oscillator used as
Microcontroller Clock Source, HS
Oscillator used as USB Clock Source
9. INTIO Internal Oscillator used as
Microcontroller Clock Source, EC
Oscillator used as USB Clock Source,
Digital I/O on RA6
10. INTCKO Internal Oscillator used as
Microcontroller Clock Source, EC
Oscillator used as USB Clock Source,
FOSC/4 Output on RA6
2.2.1 OSCILLATOR MODES AND
USB OPERATION
Because of the unique requirements of the USB module,
a different approach to clock operation is necessary. In
previous PIC® devices, all core and peripheral clocks
were driven by a single oscillator source; the usual
sources were primary, secondary or the internal oscillator.
With PIC18F2455/2550/4455/4550 devices, the primary
oscillator becomes part of the USB module and
cannot be associated to any other clock source. Thus,
the USB module must be clocked from the primary clock
source; however, the microcontroller core and other
peripherals can be separately clocked from the
secondary or internal oscillators as before.
Because of the timing requirements imposed by USB,
an internal clock of either 6 MHz or 48 MHz is required
while the USB module is enabled. Fortunately, the
microcontroller and other peripherals are not required
to run at this clock speed when using the primary
oscillator. There are numerous options to achieve the
USB module clock requirement and still provide flexibility
for clocking the rest of the device from the primary
oscillator source. These are detailed in Section 2.3
“Oscillator Settings for USB”.
PIC18F2455/2550/4455/4550
DS39632E-page 24 © 2009 Microchip Technology Inc.
FIGURE 2-1: PIC18F2455/2550/4455/4550 CLOCK DIAGRAM
PIC18F2455/2550/4455/4550
FOSC3:FOS C0
Secondary Oscillator
T1OSCEN
Enable
Oscillator
T1OSO
T1OSI
Clock Source Option
for Other Modules
OSC1
OSC2
Sleep
Primary Oscillator
XT, HS, EC, ECIO
T1OSC
CPU
Peripherals
IDLEN
INTOSC Postscaler
MUX
MUX
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
250 kHz
OSCCON<6:4>
111
110
101
100
011
010
001
31 kHz 000
INTRC
Source
Internal
Oscillator
Block
WDT, PWRT, FSCM
8 MHz
Internal Oscillator
(INTOSC)
Clock
Control
Source OSCCON< 1:0>
8 MHz
31 kHz (INTRC)
0
1
OSCTUNE<7>
and Two-Speed Start-up
96 MHz
PLL
PLLDIV
CPUDIV
0
1
0
÷ 2 1
PLL Prescaler
MUX
111
110
101
100
011
010
001
000 ÷ 1
÷ 2
÷ 3
÷ 4
÷ 5
÷ 6
÷ 10
÷ 12
11
10
01
00
PLL Postscaler
÷ 2
÷ 3
÷ 4
÷ 6
USB
USBDIV
FOSC3:FOSC0
HSPLL, ECPLL,
11
10
01
00
Oscillator Postscaler
÷ 1
÷ 2
÷ 3
÷ 4
CPUDIV
1
0
Peripheral
FSEN
÷ 4
USB Clock Source
XTPLL, ECPIO
Primary
Clock
(4 MHz Input Only)
© 2009 Microchip Technology Inc. DS39632E-page 25
PIC18F2455/2550/4455/4550
2.2.2 CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
In HS, HSPLL, XT and XTPLL Oscillator modes, a
crystal or ceramic resonator is connected to the OSC1
and OSC2 pins to establish oscillation. Figure 2-2
shows the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
FIGURE 2-2: CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, HS OR HSPLL
CONFIGURATION)
TABLE 2-1: CAPACITOR SELECTION FOR
CERAMIC RESONATORS
Note: Use of a series cut crystal may give a frequency
out of the crystal manufacturer’s
specifications.
Note 1: See Table 2-1 and Table 2-2 for initial values of
C1 and C2.
2: A series resistor (RS) may be required for AT
strip cut crystals.
3: RF varies with the oscillator mode chosen.
C1(1)
C2(1)
XTAL
OSC2
OSC1
RF(3)
Sleep
To
Logic
PIC18FXXXX
RS(2)
Internal
Typical Capacitor Values Used:
Mode Freq OSC1 OSC2
XT 4.0 MHz 33 pF 33 pF
HS 8.0 MHz
16.0 MHz
27 pF
22 pF
27 pF
22 pF
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values are not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application.
See the notes following Table 2-2 for additional
information.
Resonators Used:
4.0 MHz
8.0 MHz
16.0 MHz
When using ceramic resonators with frequencies
above 3.5 MHz, HS mode is recommended over XT
mode. HS mode may be used at any VDD for which
the controller is rated. If HS is selected, the gain of the
oscillator may overdrive the resonator. Therefore, a
series resistor should be placed between the OSC2
pin and the resonator. As a good starting point, the
recommended value of RS is 330 Ω.
PIC18F2455/2550/4455/4550
DS39632E-page 26 © 2009 Microchip Technology Inc.
TABLE 2-2: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR
An internal postscaler allows users to select a clock
frequency other than that of the crystal or resonator.
Frequency division is determined by the CPUDIV
Configuration bits. Users may select a clock frequency
of the oscillator frequency, or 1/2, 1/3 or 1/4 of the
frequency.
An external clock may also be used when the microcontroller
is in HS Oscillator mode. In this case, the
OSC2/CLKO pin is left open (Figure 2-3).
FIGURE 2-3: EXTERNAL CLOCK INPUT
OPERATION (HS OSC
CONFIGURATION)
2.2.3 EXTERNAL CLOCK INPUT
The EC, ECIO, ECPLL and ECPIO Oscillator modes
require an external clock source to be connected to the
OSC1 pin. There is no oscillator start-up time required
after a Power-on Reset or after an exit from Sleep
mode.
In the EC and ECPLL Oscillator modes, the oscillator
frequency divided by 4 is available on the OSC2 pin.
This signal may be used for test purposes or to
synchronize other logic. Figure 2-4 shows the pin
connections for the EC Oscillator mode.
FIGURE 2-4: EXTERNAL CLOCK
INPUT OPERATION
(EC AND ECPLL
CONFIGURATION)
The ECIO and ECPIO Oscillator modes function like the
EC and ECPLL modes, except that the OSC2 pin
becomes an additional general purpose I/O pin. The I/O
pin becomes bit 6 of PORTA (RA6). Figure 2-5 shows
the pin connections for the ECIO Oscillator mode.
FIGURE 2-5: EXTERNAL CLOCK
INPUT OPERATION
(ECIO AND ECPIO
CONFIGURATION)
The internal postscaler for reducing clock frequency in
XT and HS modes is also available in EC and ECIO
modes.
Osc Type Crystal
Freq
Typical Capacitor Values
Tested:
C1 C2
XT 4 MHz 27 pF 27 pF
HS 4 MHz 27 pF 27 pF
8 MHz 22 pF 22 pF
20 MHz 15 pF 15 pF
Capacitor values are for design guidance only.
These capacitors were tested with the crystals listed
below for basic start-up and operation. These values
are not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application.
See the notes following this table for additional
information.
Crystals Used:
4 MHz
8 MHz
20 MHz
Note 1: Higher capacitance increases the stability
of oscillator but also increases the
start-up time.
2: When operating below 3V VDD, or when
using certain ceramic resonators at any
voltage, it may be necessary to use the
HS mode or switch to a crystal oscillator.
3: Since each resonator/crystal has its own
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate values of external
components.
4: Rs may be required to avoid overdriving
crystals with low drive level specification.
5: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
OSC1
Open OSC2
Clock from
Ext. System PIC18FXXXX
(HS Mode)
OSC1/CLKI
FOSC/4 OSC2/CLKO
Clock from
Ext. System PIC18FXXXX
OSC1/CLKI
RA6 I/O (OSC2)
Clock from
Ext. System PIC18FXXXX
© 2009 Microchip Technology Inc. DS39632E-page 27
PIC18F2455/2550/4455/4550
2.2.4 PLL FREQUENCY MULTIPLIER
PIC18F2455/2550/4255/4550 devices include a Phase
Locked Loop (PLL) circuit. This is provided specifically
for USB applications with lower speed oscillators and
can also be used as a microcontroller clock source.
The PLL is enabled in HSPLL, XTPLL, ECPLL and
ECPIO Oscillator modes. It is designed to produce a
fixed 96 MHz reference clock from a fixed 4 MHz input.
The output can then be divided and used for both the
USB and the microcontroller core clock. Because the
PLL has a fixed frequency input and output, there are
eight prescaling options to match the oscillator input
frequency to the PLL.
There is also a separate postscaler option for deriving
the microcontroller clock from the PLL. This allows the
USB peripheral and microcontroller to use the same
oscillator input and still operate at different clock
speeds. In contrast to the postscaler for XT, HS and EC
modes, the available options are 1/2, 1/3, 1/4 and 1/6
of the PLL output.
The HSPLL, ECPLL and ECPIO modes make use of
the HS mode oscillator for frequencies up to 48 MHz.
The prescaler divides the oscillator input by up to 12 to
produce the 4 MHz drive for the PLL. The XTPLL mode
can only use an input frequency of 4 MHz which drives
the PLL directly.
FIGURE 2-6: PLL BLOCK DIAGRAM
(HS MODE)
2.2.5 INTERNAL OSCILLATOR BLOCK
The PIC18F2455/2550/4455/4550 devices include an
internal oscillator block which generates two different
clock signals; either can be used as the microcontroller’s
clock source. If the USB peripheral is not used, the
internal oscillator may eliminate the need for external
oscillator circuits on the OSC1 and/or OSC2 pins.
The main output (INTOSC) is an 8 MHz clock source
which can be used to directly drive the device clock. It
also drives the INTOSC postscaler which can provide a
range of clock frequencies from 31 kHz to 4 MHz. The
INTOSC output is enabled when a clock frequency
from 125 kHz to 8 MHz is selected.
The other clock source is the internal RC oscillator
(INTRC) which provides a nominal 31 kHz output.
INTRC is enabled if it is selected as the device clock
source; it is also enabled automatically when any of the
following are enabled:
• Power-up Timer
• Fail-Safe Clock Monitor
• Watchdog Timer
• Two-Speed Start-up
These features are discussed in greater detail in
Section 25.0 “Special Features of the CPU”.
The clock source frequency (INTOSC direct, INTRC
direct or INTOSC postscaler) is selected by configuring
the IRCF bits of the OSCCON register (page 33).
2.2.5.1 Internal Oscillator Modes
When the internal oscillator is used as the microcontroller
clock source, one of the other oscillator
modes (External Clock or External Crystal/Resonator)
must be used as the USB clock source. The choice of
the USB clock source is determined by the particular
internal oscillator mode.
There are four distinct modes available:
1. INTHS mode: The USB clock is provided by the
oscillator in HS mode.
2. INTXT mode: The USB clock is provided by the
oscillator in XT mode.
3. INTCKO mode: The USB clock is provided by an
external clock input on OSC1/CLKI; the OSC2/
CLKO pin outputs FOSC/4.
4. INTIO mode: The USB clock is provided by an
external clock input on OSC1/CLKI; the OSC2/
CLKO pin functions as a digital I/O (RA6).
Of these four modes, only INTIO mode frees up an
additional pin (OSC2/CLKO/RA6) for port I/O use.
MUX
VCO
Loop
Filter
and
Prescaler
OSC2
OSC1
PLL Enable
FIN
FOUT
SYSCLK
Phase
Comparator
HS/EC/ECIO/XT Oscillator Enable
÷24
(from CONFIG1H Register)
Oscillator
PIC18F2455/2550/4455/4550
DS39632E-page 28 © 2009 Microchip Technology Inc.
2.2.5.2 OSCTUNE Register
The internal oscillator’s output has been calibrated at
the factory but can be adjusted in the user’s application.
This is done by writing to the OSCTUNE register
(Register 2-1). The tuning sensitivity is constant
throughout the tuning range.
The INTOSC clock will stabilize within 1 ms. Code execution
continues during this shift. There is no indication
that the shift has occurred.
The OSCTUNE register also contains the INTSRC bit.
The INTSRC bit allows users to select which internal
oscillator provides the clock source when the 31 kHz
frequency option is selected. This is covered in greater
detail in Section 2.4.1 “Oscillator Control Register”.
2.2.5.3 Internal Oscillator Output Frequency
and Drift
The internal oscillator block is calibrated at the factory
to produce an INTOSC output frequency of 8.0 MHz.
However, this frequency may drift as VDD or temperature
changes, which can affect the controller operation
in a variety of ways.
The low-frequency INTRC oscillator operates independently
of the INTOSC source. Any changes in INTOSC
across voltage and temperature are not necessarily
reflected by changes in INTRC and vice versa.
REGISTER 2-1: OSCTUNE: OSCILLATOR TUNING REGISTER
R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INTSRC — — TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit
1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled)
0 = 31 kHz device clock derived directly from INTRC internal oscillator
bit 6-5 Unimplemented: Read as ‘0’
bit 4-0 TUN4:TUN0: Frequency Tuning bits
01111 = Maximum frequency
• •
• •
00001
00000 = Center frequency. Oscillator module is running at the calibrated frequency.
11111
• •
• •
10000 = Minimum frequency
© 2009 Microchip Technology Inc. DS39632E-page 29
PIC18F2455/2550/4455/4550
2.2.5.4 Compensating for INTOSC Drift
It is possible to adjust the INTOSC frequency by
modifying the value in the OSCTUNE register. This has
no effect on the INTRC clock source frequency.
Tuning the INTOSC source requires knowing when to
make the adjustment, in which direction it should be
made and in some cases, how large a change is
needed. When using the EUSART, for example, an
adjustment may be required when it begins to generate
framing errors or receives data with errors while in
Asynchronous mode. Framing errors indicate that the
device clock frequency is too high; to adjust for this,
decrement the value in OSCTUNE to reduce the clock
frequency. On the other hand, errors in data may suggest
that the clock speed is too low; to compensate,
increment OSCTUNE to increase the clock frequency.
It is also possible to verify device clock speed against
a reference clock. Two timers may be used: one timer
is clocked by the peripheral clock, while the other is
clocked by a fixed reference source, such as the
Timer1 oscillator. Both timers are cleared but the timer
clocked by the reference generates interrupts. When
an interrupt occurs, the internally clocked timer is read
and both timers are cleared. If the internally clocked
timer value is greater than expected, then the internal
oscillator block is running too fast. To adjust for this,
decrement the OSCTUNE register.
Finally, a CCP module can use free-running Timer1 (or
Timer3), clocked by the internal oscillator block and an
external event with a known period (i.e., AC power
frequency). The time of the first event is captured in the
CCPRxH:CCPRxL registers and is recorded for use
later. When the second event causes a capture, the
time of the first event is subtracted from the time of the
second event. Since the period of the external event is
known, the time difference between events can be
calculated.
If the measured time is much greater than the calculated
time, the internal oscillator block is running too
fast; to compensate, decrement the OSCTUNE register.
If the measured time is much less than the calculated
time, the internal oscillator block is running too slow; to
compensate, increment the OSCTUNE register.
PIC18F2455/2550/4455/4550
DS39632E-page 30 © 2009 Microchip Technology Inc.
2.3 Oscillator Settings for USB
When these devices are used for USB connectivity,
they must have either a 6 MHz or 48 MHz clock for
USB operation, depending on whether Low-Speed or
Full-Speed mode is being used. This may require some
forethought in selecting an oscillator frequency and
programming the device.
The full range of possible oscillator configurations
compatible with USB operation is shown in Table 2-3.
2.3.1 LOW-SPEED OPERATION
The USB clock for Low-Speed mode is derived from the
primary oscillator chain and not directly from the PLL. It
is divided by 4 to produce the actual 6 MHz clock.
Because of this, the microcontroller can only use a
clock frequency of 24 MHz when the USB module is
active and the controller clock source is one of the
primary oscillator modes (XT, HS or EC, with or without
the PLL).
This restriction does not apply if the microcontroller
clock source is the secondary oscillator or internal
oscillator block.
2.3.2 RUNNING DIFFERENT USB AND
MICROCONTROLLER CLOCKS
The USB module, in either mode, can run asynchronously
with respect to the microcontroller core and
other peripherals. This means that applications can use
the primary oscillator for the USB clock while the microcontroller
runs from a separate clock source at a lower
speed. If it is necessary to run the entire application
from only one clock source, full-speed operation
provides a greater selection of microcontroller clock
frequencies.
TABLE 2-3: OSCILLATOR CONFIGURATION OPTIONS FOR USB OPERATION
Input Oscillator
Frequency
PLL Division
(PLLDIV2:PLLDIV0)
Clock Mode
(FOSC3:FOSC0)
MCU Clock Division
(CPUDIV1:CPUDIV0)
Microcontroller
Clock Frequency
48 MHz N/A(1) EC, ECIO None (00) 48 MHz
÷2 (01) 24 MHz
÷3 (10) 16 MHz
÷4 (11) 12 MHz
48 MHz ÷12 (111) EC, ECIO None (00) 48 MHz
÷2 (01) 24 MHz
÷3 (10) 16 MHz
÷4 (11) 12 MHz
ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
40 MHz ÷10 (110) EC, ECIO None (00) 40 MHz
÷2 (01) 20 MHz
÷3 (10) 13.33 MHz
÷4 (11) 10 MHz
ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
24 MHz ÷6 (101) HS, EC, ECIO None (00) 24 MHz
÷2 (01) 12 MHz
÷3 (10) 8MHz
÷4 (11) 6MHz
HSPLL, ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
Legend: All clock frequencies, except 24 MHz, are exclusively associated with full-speed USB operation (USB clock of 48 MHz).
Bold is used to highlight clock selections that are compatible with low-speed USB operation (system clock of 24 MHz,
USB clock of 6 MHz).
Note 1: Only valid when the USBDIV Configuration bit is cleared.
© 2009 Microchip Technology Inc. DS39632E-page 31
PIC18F2455/2550/4455/4550
20 MHz ÷5 (100) HS, EC, ECIO None (00) 20 MHz
÷2 (01) 10 MHz
÷3 (10) 6.67 MHz
÷4 (11) 5MHz
HSPLL, ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
16 MHz ÷4 (011) HS, EC, ECIO None (00) 16 MHz
÷2 (01) 8MHz
÷3 (10) 5.33 MHz
÷4 (11) 4MHz
HSPLL, ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
12 MHz ÷3 (010) HS, EC, ECIO None (00) 12 MHz
÷2 (01) 6MHz
÷3 (10) 4MHz
÷4 (11) 3MHz
HSPLL, ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
8 MHz ÷2 (001) HS, EC, ECIO None (00) 8MHz
÷2 (01) 4MHz
÷3 (10) 2.67 MHz
÷4 (11) 2MHz
HSPLL, ECPLL, ECPIO ÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
4 MHz ÷1 (000) XT, HS, EC, ECIO None (00) 4MHz
÷2 (01) 2MHz
÷3 (10) 1.33 MHz
÷4 (11) 1MHz
HSPLL, ECPLL, XTPLL,
ECPIO
÷2 (00) 48 MHz
÷3 (01) 32 MHz
÷4 (10) 24 MHz
÷6 (11) 16 MHz
TABLE 2-3: OSCILLATOR CONFIGURATION OPTIONS FOR USB OPERATION (CONTINUED)
Input Oscillator
Frequency
PLL Division
(PLLDIV2:PLLDIV0)
Clock Mode
(FOSC3:FOSC0)
MCU Clock Division
(CPUDIV1:CPUDIV0)
Microcontroller
Clock Frequency
Legend: All clock frequencies, except 24 MHz, are exclusively associated with full-speed USB operation (USB clock of 48 MHz).
Bold is used to highlight clock selections that are compatible with low-speed USB operation (system clock of 24 MHz,
USB clock of 6 MHz).
Note 1: Only valid when the USBDIV Configuration bit is cleared.
PIC18F2455/2550/4455/4550
DS39632E-page 32 © 2009 Microchip Technology Inc.
2.4 Clock Sources and Oscillator
Switching
Like previous PIC18 enhanced devices, the
PIC18F2455/2550/4455/4550 family includes a feature
that allows the device clock source to be switched from
the main oscillator to an alternate, low-frequency clock
source. These devices offer two alternate clock
sources. When an alternate clock source is enabled,
the various power-managed operating modes are
available.
Essentially, there are three clock sources for these
devices:
• Primary oscillators
• Secondary oscillators
• Internal oscillator block
The primary oscillators include the External Crystal
and Resonator modes, the External Clock modes and
the internal oscillator block. The particular mode is
defined by the FOSC3:FOSC0 Configuration bits. The
details of these modes are covered earlier in this
chapter.
The secondary oscillators are those external sources
not connected to the OSC1 or OSC2 pins. These
sources may continue to operate even after the
controller is placed in a power-managed mode.
PIC18F2455/2550/4455/4550 devices offer the Timer1
oscillator as a secondary oscillator. This oscillator, in all
power-managed modes, is often the time base for
functions such as a Real-Time Clock (RTC). Most
often, a 32.768 kHz watch crystal is connected
between the RC0/T1OSO/T13CKI and RC1/T1OSI/
UOE pins. Like the XT and HS Oscillator mode circuits,
loading capacitors are also connected from each pin to
ground. The Timer1 oscillator is discussed in greater
detail in Section 12.3 “Timer1 Oscillator”.
In addition to being a primary clock source, the internal
oscillator block is available as a power-managed
mode clock source. The INTRC source is also used as
the clock source for several special features, such as
the WDT and Fail-Safe Clock Monitor.
2.4.1 OSCILLATOR CONTROL REGISTER
The OSCCON register (Register 2-2) controls several
aspects of the device clock’s operation, both in
full-power operation and in power-managed modes.
The System Clock Select bits, SCS1:SCS0, select the
clock source. The available clock sources are the
primary clock (defined by the FOSC3:FOSC0 Configuration
bits), the secondary clock (Timer1 oscillator) and
the internal oscillator block. The clock source changes
immediately after one or more of the bits is written to,
following a brief clock transition interval. The SCS bits
are cleared on all forms of Reset.
The Internal Oscillator Frequency Select bits,
IRCF2:IRCF0, select the frequency output of the internal
oscillator block to drive the device clock. The choices are
the INTRC source, the INTOSC source (8 MHz) or one
of the frequencies derived from the INTOSC postscaler
(31 kHz to 4 MHz). If the internal oscillator block is
supplying the device clock, changing the states of these
bits will have an immediate change on the internal oscillator’s
output. On device Resets, the default output
frequency of the internal oscillator block is set at 1 MHz.
When an output frequency of 31 kHz is selected
(IRCF2:IRCF0 = 000), users may choose which internal
oscillator acts as the source. This is done with the
INTSRC bit in the OSCTUNE register (OSCTUNE<7>).
Setting this bit selects INTOSC as a 31.25 kHz clock
source by enabling the divide-by-256 output of the
INTOSC postscaler. Clearing INTSRC selects INTRC
(nominally 31 kHz) as the clock source.
This option allows users to select the tunable and more
precise INTOSC as a clock source, while maintaining
power savings with a very low clock speed. Regardless
of the setting of INTSRC, INTRC always remains the
clock source for features such as the Watchdog Timer
and the Fail-Safe Clock Monitor.
The OSTS, IOFS and T1RUN bits indicate which clock
source is currently providing the device clock. The OSTS
bit indicates that the Oscillator Start-up Timer (OST) has
timed out and the primary clock is providing the device
clock in primary clock modes. The IOFS bit indicates
when the internal oscillator block has stabilized and is
providing the device clock in RC Clock modes. The
T1RUN bit (T1CON<6>) indicates when the Timer1 oscillator
is providing the device clock in secondary clock
modes. In power-managed modes, only one of these
three bits will be set at any time. If none of these bits are
set, the INTRC is providing the clock or the internal
oscillator block has just started and is not yet stable.
The IDLEN bit determines if the device goes into Sleep
mode, or one of the Idle modes, when the SLEEP
instruction is executed.
The use of the flag and control bits in the OSCCON
register is discussed in more detail in Section 3.0
“Power-Managed Modes”.
Note 1: The Timer1 oscillator must be enabled to
select the secondary clock source. The
Timer1 oscillator is enabled by setting the
T1OSCEN bit in the Timer1 Control register
(T1CON<3>). If the Timer1 oscillator is
not enabled, then any attempt to select a
secondary clock source will be ignored.
2: It is recommended that the Timer1
oscillator be operating and stable prior to
switching to it as the clock source; otherwise,
a very long delay may occur while
the Timer1 oscillator starts.
© 2009 Microchip Technology Inc. DS39632E-page 33
PIC18F2455/2550/4455/4550
2.4.2 OSCILLATOR TRANSITIONS
PIC18F2455/2550/4455/4550 devices contain circuitry
to prevent clock “glitches” when switching between
clock sources. A short pause in the device clock occurs
during the clock switch. The length of this pause is the
sum of two cycles of the old clock source and three to
four cycles of the new clock source. This formula
assumes that the new clock source is stable.
Clock transitions are discussed in greater detail in
Section 3.1.2 “Entering Power-Managed Modes”.
REGISTER 2-2: OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0 R/W-1 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0
IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IDLEN: Idle Enable bit
1 = Device enters Idle mode on SLEEP instruction
0 = Device enters Sleep mode on SLEEP instruction
bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits
111 = 8 MHz (INTOSC drives clock directly)
110 = 4 MHz
101 = 2 MHz
100 = 1 MHz(3)
011 = 500 kHz
010 = 250 kHz
001 = 125 kHz
000 = 31 kHz (from either INTOSC/256 or INTRC directly)(2)
bit 3 OSTS: Oscillator Start-up Time-out Status bit(1)
1 = Oscillator Start-up Timer time-out has expired; primary oscillator is running
0 = Oscillator Start-up Timer time-out is running; primary oscillator is not ready
bit 2 IOFS: INTOSC Frequency Stable bit
1 = INTOSC frequency is stable
0 = INTOSC frequency is not stable
bit 1-0 SCS1:SCS0: System Clock Select bits
1x = Internal oscillator
01 = Timer1 oscillator
00 = Primary oscillator
Note 1: Depends on the state of the IESO Configuration bit.
2: Source selected by the INTSRC bit (OSCTUNE<7>), see text.
3: Default output frequency of INTOSC on Reset.
PIC18F2455/2550/4455/4550
DS39632E-page 34 © 2009 Microchip Technology Inc.
2.5 Effects of Power-Managed Modes
on the Various Clock Sources
When PRI_IDLE mode is selected, the designated
primary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. Unless the USB
module is enabled, the OSC1 pin (and OSC2 pin if
used by the oscillator) will stop oscillating.
In secondary clock modes (SEC_RUN and
SEC_IDLE), the Timer1 oscillator is operating and
providing the device clock. The Timer1 oscillator may
also run in all power-managed modes if required to
clock Timer1 or Timer3.
In internal oscillator modes (RC_RUN and RC_IDLE),
the internal oscillator block provides the device clock
source. The 31 kHz INTRC output can be used directly
to provide the clock and may be enabled to support
various special features regardless of the
power-managed mode (see Section 25.2 “Watchdog
Timer (WDT)”, Section 25.3 “Two-Speed Start-up”
and Section 25.4 “Fail-Safe Clock Monitor” for more
information on WDT, Fail-Safe Clock Monitor and
Two-Speed Start-up). The INTOSC output at 8 MHz
may be used directly to clock the device or may be
divided down by the postscaler. The INTOSC output is
disabled if the clock is provided directly from the INTRC
output.
Regardless of the Run or Idle mode selected, the USB
clock source will continue to operate. If the device is
operating from a crystal or resonator-based oscillator,
that oscillator will continue to clock the USB module.
The core and all other modules will switch to the new
clock source.
If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Sleep mode should never be invoked while the USB
module is operating and connected. The only exception
is when the device has been issued a “Suspend”
command over the USB. Once the module has suspended
operation and shifted to a low-power state, the
microcontroller may be safely put into Sleep mode.
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The INTRC is required to support WDT operation. The
Timer1 oscillator may be operating to support a
Real-Time Clock. Other features may be operating that
do not require a device clock source (i.e., MSSP slave,
PSP, INTx pins and others). Peripherals that may add
significant current consumption are listed in
Section 28.2 “DC Characteristics: Power-Down and
Supply Current”.
2.6 Power-up Delays
Power-up delays are controlled by two timers so that no
external Reset circuitry is required for most applications.
The delays ensure that the device is kept in Reset until
the device power supply is stable under normal circumstances
and the primary clock is operating and stable.
For additional information on power-up delays, see
Section 4.5 “Device Reset Timers”.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up (parameter 33,
Table 28-12). It is enabled by clearing (= 0) the
PWRTEN Configuration bit.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (XT and HS modes). The
OST does this by counting 1024 oscillator cycles
before allowing the oscillator to clock the device.
When the HSPLL Oscillator mode is selected, the
device is kept in Reset for an additional 2 ms following
the HS mode OST delay, so the PLL can lock to the
incoming clock frequency.
There is a delay of interval, TCSD (parameter 38,
Table 28-12), following POR, while the controller
becomes ready to execute instructions. This delay runs
concurrently with any other delays. This may be the
only delay that occurs when any of the EC or internal
oscillator modes are used as the primary clock source.
TABLE 2-4: OSC1 AND OSC2 PIN STATES IN SLEEP MODE
Oscillator Mode OSC1 Pin OSC2 Pin
INTCKO Floating, pulled by external clock At logic low (clock/4 output)
INTIO Floating, pulled by external clock Configured as PORTA, bit 6
ECIO, ECPIO Floating, pulled by external clock Configured as PORTA, bit 6
EC Floating, pulled by external clock At logic low (clock/4 output)
XT and HS Feedback inverter disabled at quiescent
voltage level
Feedback inverter disabled at quiescent
voltage level
Note: See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.
© 2009 Microchip Technology Inc. DS39632E-page 35
PIC18F2455/2550/4455/4550
3.0 POWER-MANAGED MODES
PIC18F2455/2550/4455/4550 devices offer a total of
seven operating modes for more efficient power
management. These modes provide a variety of
options for selective power conservation in applications
where resources may be limited (i.e., battery-powered
devices).
There are three categories of power-managed modes:
• Run modes
• Idle modes
• Sleep mode
These categories define which portions of the device
are clocked and sometimes, what speed. The Run and
Idle modes may use any of the three available clock
sources (primary, secondary or internal oscillator
block); the Sleep mode does not use a clock source.
The power-managed modes include several
power-saving features offered on previous PIC®
devices. One is the clock switching feature, offered in
other PIC18 devices, allowing the controller to use the
Timer1 oscillator in place of the primary oscillator. Also
included is the Sleep mode, offered by all PIC devices,
where all device clocks are stopped.
3.1 Selecting Power-Managed Modes
Selecting a power-managed mode requires two
decisions: if the CPU is to be clocked or not and the
selection of a clock source. The IDLEN bit
(OSCCON<7>) controls CPU clocking, while the
SCS1:SCS0 bits (OSCCON<1:0>) select the clock
source. The individual modes, bit settings, clock sources
and affected modules are summarized in Table 3-1.
3.1.1 CLOCK SOURCES
The SCS1:SCS0 bits allow the selection of one of three
clock sources for power-managed modes. They are:
• The primary clock, as defined by the
FOSC3:FOSC0 Configuration bits
• The secondary clock (the Timer1 oscillator)
• The internal oscillator block (for RC modes)
3.1.2 ENTERING POWER-MANAGED
MODES
Switching from one power-managed mode to another
begins by loading the OSCCON register. The
SCS1:SCS0 bits select the clock source and determine
which Run or Idle mode is to be used. Changing these
bits causes an immediate switch to the new clock
source, assuming that it is running. The switch may
also be subject to clock transition delays. These are
discussed in Section 3.1.3 “Clock Transitions and
Status Indicators” and subsequent sections.
Entry to the power-managed Idle or Sleep modes is
triggered by the execution of a SLEEP instruction. The
actual mode that results depends on the status of the
IDLEN bit.
Depending on the current mode and the mode being
switched to, a change to a power-managed mode does
not always require setting all of these bits. Many
transitions may be done by changing the oscillator
select bits, or changing the IDLEN bit, prior to issuing a
SLEEP instruction. If the IDLEN bit is already
configured correctly, it may only be necessary to
perform a SLEEP instruction to switch to the desired
mode.
TABLE 3-1: POWER-MANAGED MODES
Mode
OSCCON<7,1:0> Module Clocking
Available Clock and Oscillator Source
IDLEN(1) SCS1:SCS0 CPU Peripherals
Sleep 0 N/A Off Off None – all clocks are disabled
PRI_RUN N/A 00 Clocked Clocked Primary – all oscillator modes.
This is the normal full-power execution mode.
SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 oscillator
RC_RUN N/A 1x Clocked Clocked Internal oscillator block(2)
PRI_IDLE 1 00 Off Clocked Primary – all oscillator modes
SEC_IDLE 1 01 Off Clocked Secondary – Timer1 oscillator
RC_IDLE 1 1x Off Clocked Internal oscillator block(2)
Note 1: IDLEN reflects its value when the SLEEP instruction is executed.
2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.
PIC18F2455/2550/4455/4550
DS39632E-page 36 © 2009 Microchip Technology Inc.
3.1.3 CLOCK TRANSITIONS AND
STATUS INDICATORS
The length of the transition between clock sources is
the sum of two cycles of the old clock source and three
to four cycles of the new clock source. This formula
assumes that the new clock source is stable.
Three bits indicate the current clock source and its
status. They are:
• OSTS (OSCCON<3>)
• IOFS (OSCCON<2>)
• T1RUN (T1CON<6>)
In general, only one of these bits will be set while in a
given power-managed mode. When the OSTS bit is
set, the primary clock is providing the device clock.
When the IOFS bit is set, the INTOSC output is providing
a stable, 8 MHz clock source to a divider that
actually drives the device clock. When the T1RUN bit is
set, the Timer1 oscillator is providing the clock. If none
of these bits are set, then either the INTRC clock
source is clocking the device, or the INTOSC source is
not yet stable.
If the internal oscillator block is configured as the
primary clock source by the FOSC3:FOSC0 Configuration
bits, then both the OSTS and IOFS bits may
be set when in PRI_RUN or PRI_IDLE modes. This
indicates that the primary clock (INTOSC output) is
generating a stable 8 MHz output. Entering another
power-managed RC mode at the same frequency
would clear the OSTS bit.
3.1.4 MULTIPLE SLEEP COMMANDS
The power-managed mode that is invoked with the
SLEEP instruction is determined by the setting of the
IDLEN bit at the time the instruction is executed. If
another SLEEP instruction is executed, the device will
enter the power-managed mode specified by IDLEN at
that time. If IDLEN has changed, the device will enter
the new power-managed mode specified by the new
setting.
Upon resuming normal operation after waking from
Sleep or Idle, the internal state machines require at
least one TCY delay before another SLEEP instruction
can be executed. If two back to back SLEEP instructions
will be executed, the process shown in
Example 3-1 should be used.
EXAMPLE 3-1: EXECUTING BACK TO BACK SLEEP INSTRUCTIONS
3.2 Run Modes
In the Run modes, clocks to both the core and
peripherals are active. The difference between these
modes is the clock source.
3.2.1 PRI_RUN MODE
The PRI_RUN mode is the normal, full-power execution
mode of the microcontroller. This is also the default
mode upon a device Reset unless Two-Speed Start-up
is enabled (see Section 25.3 “Two-Speed Start-up”
for details). In this mode, the OSTS bit is set. The IOFS
bit may be set if the internal oscillator block is the
primary clock source (see Section 2.4.1 “Oscillator
Control Register”).
3.2.2 SEC_RUN MODE
The SEC_RUN mode is the compatible mode to the
“clock switching” feature offered in other PIC18
devices. In this mode, the CPU and peripherals are
clocked from the Timer1 oscillator. This gives users the
option of lower power consumption while still using a
high-accuracy clock source.
Note 1: Caution should be used when modifying a
single IRCF bit. If VDD is less than 3V, it is
possible to select a higher clock speed
than is supported by the low VDD.
Improper device operation may result if
the VDD/FOSC specifications are violated.
2: Executing a SLEEP instruction does not
necessarily place the device into Sleep
mode. It acts as the trigger to place the
controller into either the Sleep mode, or
one of the Idle modes, depending on the
setting of the IDLEN bit.
SLEEP
NOP ;Wait at least 1 Tcy before executing another sleep instruction
SLEEP
© 2009 Microchip Technology Inc. DS39632E-page 37
PIC18F2455/2550/4455/4550
SEC_RUN mode is entered by setting the SCS1:SCS0
bits to ‘01’. The device clock source is switched to the
Timer1 oscillator (see Figure 3-1), the primary
oscillator is shut down, the T1RUN bit (T1CON<6>) is
set and the OSTS bit is cleared.
On transitions from SEC_RUN mode to PRI_RUN, the
peripherals and CPU continue to be clocked from the
Timer1 oscillator while the primary clock is started.
When the primary clock becomes ready, a clock switch
back to the primary clock occurs (see Figure 3-2).
When the clock switch is complete, the T1RUN bit is
cleared, the OSTS bit is set and the primary clock is
providing the clock. The IDLEN and SCS bits are not
affected by the wake-up; the Timer1 oscillator
continues to run.
FIGURE 3-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE
FIGURE 3-2: TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)
Note: The Timer1 oscillator should already be
running prior to entering SEC_RUN mode.
If the T1OSCEN bit is not set when the
SCS1:SCS0 bits are set to ‘01’, entry to
SEC_RUN mode will not occur. If the
Timer1 oscillator is enabled but not yet
running, device clocks will be delayed until
the oscillator has started. In such
situations, initial oscillator operation is far
from stable and unpredictable operation
may result.
Q2 Q3 Q4
OSC1
Peripheral
Program
Q1
T1OSI
Q1
Counter
Clock
CPU
Clock
PC PC + 2
1 2 3 n-1 n
Clock Transition(1)
Q2 Q3 Q4 Q1 Q2 Q3
PC + 4
Note 1: Clock transition typically occurs within 2-4 TOSC.
Q1 Q3 Q4
OSC1
Peripheral
Program PC
T1OSI
PLL Clock
Q1
PC + 4
Q2
Output
Q3 Q4 Q1
CPU Clock
PC + 2
Clock
Counter
Q2 Q2 Q3
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
2: Clock transition typically occurs within 2-4 TOSC.
SCS1:SCS0 bits Changed
TPLL(1)
1 2 n-1 n
Clock(2)
OSTS bit Set
Transition
TOST(1)
PIC18F2455/2550/4455/4550
DS39632E-page 38 © 2009 Microchip Technology Inc.
3.2.3 RC_RUN MODE
In RC_RUN mode, the CPU and peripherals are
clocked from the internal oscillator block using the
INTOSC multiplexer; the primary clock is shut down.
When using the INTRC source, this mode provides the
best power conservation of all the Run modes while still
executing code. It works well for user applications
which are not highly timing sensitive or do not require
high-speed clocks at all times.
If the primary clock source is the internal oscillator
block (either INTRC or INTOSC), there are no distinguishable
differences between the PRI_RUN and
RC_RUN modes during execution. However, a clock
switch delay will occur during entry to and exit from
RC_RUN mode. Therefore, if the primary clock source
is the internal oscillator block, the use of RC_RUN
mode is not recommended.
This mode is entered by setting SCS1 to ‘1’. Although
it is ignored, it is recommended that SCS0 also be
cleared; this is to maintain software compatibility with
future devices. When the clock source is switched to
the INTOSC multiplexer (see Figure 3-3), the primary
oscillator is shut down and the OSTS bit is cleared. The
IRCF bits may be modified at any time to immediately
change the clock speed.
If the IRCF bits and the INTSRC bit are all clear, the
INTOSC output is not enabled and the IOFS bit will
remain clear; there will be no indication of the current
clock source. The INTRC source is providing the
device clocks.
If the IRCF bits are changed from all clear (thus,
enabling the INTOSC output), or if INTSRC is set, the
IOFS bit becomes set after the INTOSC output
becomes stable. Clocks to the device continue while
the INTOSC source stabilizes after an interval of
TIOBST.
If the IRCF bits were previously at a non-zero value or
if INTSRC was set before setting SCS1 and the
INTOSC source was already stable, the IOFS bit will
remain set.
On transitions from RC_RUN mode to PRI_RUN mode,
the device continues to be clocked from the INTOSC
multiplexer while the primary clock is started. When the
primary clock becomes ready, a clock switch to the
primary clock occurs (see Figure 3-4). When the clock
switch is complete, the IOFS bit is cleared, the OSTS
bit is set and the primary clock is providing the device
clock. The IDLEN and SCS bits are not affected by the
switch. The INTRC source will continue to run if either
the WDT or the Fail-Safe Clock Monitor is enabled.
Note: Caution should be used when modifying a
single IRCF bit. If VDD is less than 3V, it is
possible to select a higher clock speed
than is supported by the low VDD.
Improper device operation may result if
the VDD/FOSC specifications are violated.
© 2009 Microchip Technology Inc. DS39632E-page 39
PIC18F2455/2550/4455/4550
FIGURE 3-3: TRANSITION TIMING TO RC_RUN MODE
FIGURE 3-4: TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE
Q2 Q3 Q4
OSC1
Peripheral
Program
Q1
INTRC
Q1
Counter
Clock
CPU
Clock
PC PC + 2
1 2 3 n-1 n
Clock Transition(1)
Q2 Q3 Q4 Q1 Q2 Q3
PC + 4
Note 1: Clock transition typically occurs within 2-4 TOSC.
Q1 Q3 Q4
OSC1
Peripheral
Program PC
INTOSC
PLL Clock
Q1
PC + 4
Q2
Output
Q3 Q4 Q1
CPU Clock
PC + 2
Clock
Counter
Q2 Q2 Q3
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
2: Clock transition typically occurs within 2-4 TOSC.
SCS1:SCS0 bits Changed
TPLL(1)
1 2 n-1 n
Clock(2)
OSTS bit Set
Transition
Multiplexer
TOST(1)
PIC18F2455/2550/4455/4550
DS39632E-page 40 © 2009 Microchip Technology Inc.
3.3 Sleep Mode
The power-managed Sleep mode in the
PIC18F2455/2550/4455/4550 devices is identical to
the legacy Sleep mode offered in all other PIC devices.
It is entered by clearing the IDLEN bit (the default state
on device Reset) and executing the SLEEP instruction.
This shuts down the selected oscillator (Figure 3-5). All
clock source status bits are cleared.
Entering the Sleep mode from any other mode does not
require a clock switch. This is because no clocks are
needed once the controller has entered Sleep. If the
WDT is selected, the INTRC source will continue to
operate. If the Timer1 oscillator is enabled, it will also
continue to run.
When a wake event occurs in Sleep mode (by interrupt,
Reset or WDT time-out), the device will not be clocked
until the clock source selected by the SCS1:SCS0 bits
becomes ready (see Figure 3-6), or it will be clocked
from the internal oscillator block if either the Two-Speed
Start-up or the Fail-Safe Clock Monitor are enabled
(see Section 25.0 “Special Features of the CPU”). In
either case, the OSTS bit is set when the primary clock
is providing the device clocks. The IDLEN and SCS bits
are not affected by the wake-up.
3.4 Idle Modes
The Idle modes allow the controller’s CPU to be
selectively shut down while the peripherals continue to
operate. Selecting a particular Idle mode allows users
to further manage power consumption.
If the IDLEN bit is set to ‘1’ when a SLEEP instruction is
executed, the peripherals will be clocked from the clock
source selected using the SCS1:SCS0 bits; however, the
CPU will not be clocked. The clock source status bits are
not affected. Setting IDLEN and executing a SLEEP
instruction provides a quick method of switching from a
given Run mode to its corresponding Idle mode.
If the WDT is selected, the INTRC source will continue
to operate. If the Timer1 oscillator is enabled, it will also
continue to run.
Since the CPU is not executing instructions, the only
exits from any of the Idle modes are by interrupt, WDT
time-out or a Reset. When a wake event occurs, CPU
execution is delayed by an interval of TCSD
(parameter 38, Table 28-12) while it becomes ready to
execute code. When the CPU begins executing code,
it resumes with the same clock source for the current
Idle mode. For example, when waking from RC_IDLE
mode, the internal oscillator block will clock the CPU
and peripherals (in other words, RC_RUN mode). The
IDLEN and SCS bits are not affected by the wake-up.
While in any Idle mode or Sleep mode, a WDT time-out
will result in a WDT wake-up to the Run mode currently
specified by the SCS1:SCS0 bits.
FIGURE 3-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE
FIGURE 3-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)
Q2 Q3 Q4
OSC1
Peripheral
Sleep
Program
Q1 Q1
Counter
Clock
CPU
Clock
PC PC + 2
Q3 Q4 Q1 Q2
OSC1
Peripheral
Program PC
PLL Clock
Q3 Q4
Output
CPU Clock
Q1 Q2 Q3 Q4 Q1 Q2
Clock
Counter PC + 4 PC + 6
Q1 Q2 Q3 Q4
Wake Event
Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
TOST(1) TPLL(1)
OSTS bit Set
PC + 2
© 2009 Microchip Technology Inc. DS39632E-page 41
PIC18F2455/2550/4455/4550
3.4.1 PRI_IDLE MODE
This mode is unique among the three low-power Idle
modes in that it does not disable the primary device
clock. For timing sensitive applications, this allows for
the fastest resumption of device operation, with its
more accurate primary clock source, since the clock
source does not have to “warm up” or transition from
another oscillator.
PRI_IDLE mode is entered from PRI_RUN mode by
setting the IDLEN bit and executing a SLEEP instruction.
If the device is in another Run mode, set IDLEN
first, then clear the SCS bits and execute SLEEP.
Although the CPU is disabled, the peripherals continue
to be clocked from the primary clock source specified
by the FOSC3:FOSC0 Configuration bits. The OSTS
bit remains set (see Figure 3-7).
When a wake event occurs, the CPU is clocked from the
primary clock source. A delay of interval TCSD is
required between the wake event and when code
execution starts. This is required to allow the CPU to
become ready to execute instructions. After the
wake-up, the OSTS bit remains set. The IDLEN and
SCS bits are not affected by the wake-up (see
Figure 3-8).
3.4.2 SEC_IDLE MODE
In SEC_IDLE mode, the CPU is disabled but the
peripherals continue to be clocked from the Timer1
oscillator. This mode is entered from SEC_RUN by setting
the IDLEN bit and executing a SLEEP instruction. If
the device is in another Run mode, set IDLEN first, then
set SCS1:SCS0 to ‘01’ and execute SLEEP. When the
clock source is switched to the Timer1 oscillator, the
primary oscillator is shut down, the OSTS bit is cleared
and the T1RUN bit is set.
When a wake event occurs, the peripherals continue to
be clocked from the Timer1 oscillator. After an interval
of TCSD following the wake event, the CPU begins executing
code being clocked by the Timer1 oscillator. The
IDLEN and SCS bits are not affected by the wake-up;
the Timer1 oscillator continues to run (see Figure 3-8).
FIGURE 3-7: TRANSITION TIMING FOR ENTRY TO IDLE MODE
FIGURE 3-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE
Note: The Timer1 oscillator should already be
running prior to entering SEC_IDLE mode.
If the T1OSCEN bit is not set when the
SLEEP instruction is executed, the SLEEP
instruction will be ignored and entry to
SEC_IDLE mode will not occur. If the
Timer1 oscillator is enabled but not yet
running, peripheral clocks will be delayed
until the oscillator has started. In such
situations, initial oscillator operation is far
from stable and unpredictable operation
may result.
Q1
Peripheral
Program PC PC + 2
OSC1
Q3 Q4 Q1
CPU Clock
Clock
Counter
Q2
OSC1
Peripheral
Program PC
CPU Clock
Q1 Q3 Q4
Clock
Counter
Q2
Wake Event
TCSD
PIC18F2455/2550/4455/4550
DS39632E-page 42 © 2009 Microchip Technology Inc.
3.4.3 RC_IDLE MODE
In RC_IDLE mode, the CPU is disabled but the peripherals
continue to be clocked from the internal oscillator
block using the INTOSC multiplexer. This mode allows
for controllable power conservation during Idle periods.
From RC_RUN, this mode is entered by setting the
IDLEN bit and executing a SLEEP instruction. If the
device is in another Run mode, first set IDLEN, then set
the SCS1 bit and execute SLEEP. Although its value is
ignored, it is recommended that SCS0 also be cleared;
this is to maintain software compatibility with future
devices. The INTOSC multiplexer may be used to
select a higher clock frequency by modifying the IRCF
bits before executing the SLEEP instruction. When the
clock source is switched to the INTOSC multiplexer, the
primary oscillator is shut down and the OSTS bit is
cleared.
If the IRCF bits are set to any non-zero value, or the
INTSRC bit is set, the INTOSC output is enabled. The
IOFS bit becomes set after the INTOSC output
becomes stable, after an interval of TIOBST
(parameter 39, Table 28-12). Clocks to the peripherals
continue while the INTOSC source stabilizes. If the
IRCF bits were previously at a non-zero value, or
INTSRC was set before the SLEEP instruction was
executed and the INTOSC source was already stable,
the IOFS bit will remain set. If the IRCF bits and
INTSRC are all clear, the INTOSC output will not be
enabled, the IOFS bit will remain clear and there will be
no indication of the current clock source.
When a wake event occurs, the peripherals continue to
be clocked from the INTOSC multiplexer. After a delay
of TCSD following the wake event, the CPU begins
executing code being clocked by the INTOSC multiplexer.
The IDLEN and SCS bits are not affected by the
wake-up. The INTRC source will continue to run if
either the WDT or the Fail-Safe Clock Monitor is
enabled.
3.5 Exiting Idle and Sleep Modes
An exit from Sleep mode or any of the Idle modes is
triggered by an interrupt, a Reset or a WDT time-out.
This section discusses the triggers that cause exits
from power-managed modes. The clocking subsystem
actions are discussed in each of the power-managed
modes (see Section 3.2 “Run Modes”, Section 3.3
“Sleep Mode” and Section 3.4 “Idle Modes”).
3.5.1 EXIT BY INTERRUPT
Any of the available interrupt sources can cause the
device to exit from an Idle mode or Sleep mode to a
Run mode. To enable this functionality, an interrupt
source must be enabled by setting its enable bit in one
of the INTCON or PIE registers. The exit sequence is
initiated when the corresponding interrupt flag bit is set.
On all exits from Idle or Sleep modes by interrupt, code
execution branches to the interrupt vector if the
GIE/GIEH bit (INTCON<7>) is set. Otherwise, code
execution continues or resumes without branching
(see Section 9.0 “Interrupts”).
A fixed delay of interval TCSD following the wake event
is required when leaving Sleep and Idle modes. This
delay is required for the CPU to prepare for execution.
Instruction execution resumes on the first clock cycle
following this delay.
3.5.2 EXIT BY WDT TIME-OUT
A WDT time-out will cause different actions depending
on which power-managed mode the device is in when
the time-out occurs.
If the device is not executing code (all Idle modes and
Sleep mode), the time-out will result in an exit from the
power-managed mode (see Section 3.2 “Run
Modes” and Section 3.3 “Sleep Mode”). If the device
is executing code (all Run modes), the time-out will
result in a WDT Reset (see Section 25.2 “Watchdog
Timer (WDT)”).
The WDT timer and postscaler are cleared by executing
a SLEEP or CLRWDT instruction, the loss of a
currently selected clock source (if the Fail-Safe Clock
Monitor is enabled) and modifying the IRCF bits in the
OSCCON register if the internal oscillator block is the
device clock source.
3.5.3 EXIT BY RESET
Normally, the device is held in Reset by the Oscillator
Start-up Timer (OST) until the primary clock becomes
ready. At that time, the OSTS bit is set and the device
begins executing code. If the internal oscillator block is
the new clock source, the IOFS bit is set instead.
The exit delay time from Reset to the start of code
execution depends on both the clock sources before
and after the wake-up and the type of oscillator if the
new clock source is the primary clock. Exit delays are
summarized in Table 3-2.
Code execution can begin before the primary clock
becomes ready. If either the Two-Speed Start-up (see
Section 25.3 “Two-Speed Start-up”) or Fail-Safe
Clock Monitor (see Section 25.4 “Fail-Safe Clock
Monitor”) is enabled, the device may begin execution
as soon as the Reset source has cleared. Execution is
clocked by the INTOSC multiplexer driven by the
internal oscillator block. Execution is clocked by the
internal oscillator block until either the primary clock
becomes ready or a power-managed mode is entered
before the primary clock becomes ready; the primary
clock is then shut down.
© 2009 Microchip Technology Inc. DS39632E-page 43
PIC18F2455/2550/4455/4550
3.5.4 EXIT WITHOUT AN OSCILLATOR
START-UP DELAY
Certain exits from power-managed modes do not
invoke the OST at all. There are two cases:
• PRI_IDLE mode, where the primary clock source
is not stopped; and
• the primary clock source is not any of the XT or
HS modes.
In these instances, the primary clock source either
does not require an oscillator start-up delay, since it is
already running (PRI_IDLE), or normally does not
require an oscillator start-up delay (EC and any internal
oscillator modes). However, a fixed delay of interval
TCSD following the wake event is still required when
leaving Sleep and Idle modes to allow the CPU to
prepare for execution. Instruction execution resumes
on the first clock cycle following this delay.
TABLE 3-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE
(BY CLOCK SOURCES)
Microcontroller Clock Source
Exit Delay Clock Ready Status
Before Wake-up After Wake-up Bit (OSCCON)
Primary Device Clock
(PRI_IDLE mode)
XT, HS
None
XTPLL, HSPLL OSTS
EC
INTOSC(3) IOFS
T1OSC or INTRC(1)
XT, HS TOST(4)
XTPLL, HSPLL TOST + trc OSTS
(4)
EC TCSD(2)
INTOSC(3) TIOBST(5) IOFS
INTOSC(3)
XT, HS TOST(4)
XTPLL, HSPLL TOST + trc OSTS
(4)
EC TCSD(2)
INTOSC(3) None IOFS
None
(Sleep mode)
XT, HS TOST(4)
XTPLL, HSPLL TOST + trc OSTS
(4)
EC TCSD(2)
INTOSC(3) TIOBST(5) IOFS
Note 1: In this instance, refers specifically to the 31 kHz INTRC clock source.
2: TCSD (parameter 38, Table 28-12) is a required delay when waking from Sleep and all Idle modes and runs
concurrently with any other required delays (see Section 3.4 “Idle Modes”).
3: Includes both the INTOSC 8 MHz source and postscaler derived frequencies.
4: TOST is the Oscillator Start-up Timer period (parameter 32, Table 28-12). trc is the PLL lock time-out
(parameter F12, Table 28-9); it is also designated as TPLL.
5: Execution continues during TIOBST (parameter 39, Table 28-12), the INTOSC stabilization period.
PIC18F2455/2550/4455/4550
DS39632E-page 44 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS39632E-page 45
PIC18F2455/2550/4455/4550
4.0 RESET
The PIC18F2455/2550/4455/4550 devices differentiate
between various kinds of Reset:
a) Power-on Reset (POR)
b) MCLR Reset during normal operation
c) MCLR Reset during power-managed modes
d) Watchdog Timer (WDT) Reset (during
execution)
e) Programmable Brown-out Reset (BOR)
f) RESET Instruction
g) Stack Full Reset
h) Stack Underflow Reset
This section discusses Resets generated by MCLR,
POR and BOR and covers the operation of the various
start-up timers. Stack Reset events are covered in
Section 5.1.2.4 “Stack Full and Underflow Resets”.
WDT Resets are covered in Section 25.2 “Watchdog
Timer (WDT)”.
A simplified block diagram of the on-chip Reset circuit
is shown in Figure 4-1.
4.1 RCON Register
Device Reset events are tracked through the RCON
register (Register 4-1). The lower five bits of the register
indicate that a specific Reset event has occurred. In
most cases, these bits can only be cleared by the event
and must be set by the application after the event. The
state of these flag bits, taken together, can be read to
indicate the type of Reset that just occurred. This is
described in more detail in Section 4.6 “Reset State
of Registers”.
The RCON register also has control bits for setting
interrupt priority (IPEN) and software control of the
BOR (SBOREN). Interrupt priority is discussed in
Section 9.0 “Interrupts”. BOR is covered in
Section 4.4 “Brown-out Reset (BOR)”.
FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
R Q
External Reset
MCLR
VDD
OSC1
WDT
Time-out
VDD Rise
Detect
OST/PWRT
INTRC(1)
POR Pulse
OST
10-Bit Ripple Counter
PWRT
Chip_Reset
11-Bit Ripple Counter
Enable OST(2)
Enable PWRT
Note 1: This is the low-frequency INTRC source from the internal oscillator block.
2: See Table 4-2 for time-out situations.
Brown-out
Reset
BOREN
RESET
Instruction
Stack
Pointer
Stack Full/Underflow Reset
Sleep
( )_IDLE
1024 Cycles
32 μs 65.5 ms
MCLRE
PIC18F2455/2550/4455/4550
DS39632E-page 46 © 2009 Microchip Technology Inc.
REGISTER 4-1: RCON: RESET CONTROL REGISTER
R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(2) R/W-0
IPEN SBOREN — RI TO PD POR BOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IPEN: Interrupt Priority Enable bit
1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
bit 6 SBOREN: BOR Software Enable bit(1)
If BOREN1:BOREN0 = 01:
1 = BOR is enabled
0 = BOR is disabled
If BOREN1:BOREN0 = 00, 10 or 11:
Bit is disabled and read as ‘0’.
bit 5 Unimplemented: Read as ‘0’
bit 4 RI: RESET Instruction Flag bit
1 = The RESET instruction was not executed (set by firmware only)
0 = The RESET instruction was executed causing a device Reset (must be set in software after a
Brown-out Reset occurs)
bit 3 TO: Watchdog Time-out Flag bit
1 = Set by power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 2 PD: Power-Down Detection Flag bit
1 = Set by power-up or by the CLRWDT instruction
0 = Set by execution of the SLEEP instruction
bit 1 POR: Power-on Reset Status bit(2)
1 = A Power-on Reset has not occurred (set by firmware only)
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = A Brown-out Reset has not occurred (set by firmware only)
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’.
2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this
register and Section 4.6 “Reset State of Registers” for additional information.
Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent
Power-on Resets may be detected.
2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming that POR was set to
‘1’ by software immediately after POR).
© 2009 Microchip Technology Inc. DS39632E-page 47
PIC18F2455/2550/4455/4550
4.2 Master Clear Reset (MCLR)
The MCLR pin provides a method for triggering an
external Reset of the device. A Reset is generated by
holding the pin low. These devices have a noise filter in
the MCLR Reset path which detects and ignores small
pulses.
The MCLR pin is not driven low by any internal Resets,
including the WDT.
In PIC18F2455/2550/4455/4550 devices, the MCLR
input can be disabled with the MCLRE Configuration
bit. When MCLR is disabled, the pin becomes a digital
input. See Section 10.5 “PORTE, TRISE and LATE
Registers” for more information.
4.3 Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip
whenever VDD rises above a certain threshold. This
allows the device to start in the initialized state when
VDD is adequate for operation.
To take advantage of the POR circuitry, tie the MCLR pin
through a resistor (1 kΩ to 10 kΩ) to VDD. This will
eliminate external RC components usually needed to
create a Power-on Reset delay. A minimum rise rate for
VDD is specified (parameter D004, Section 28.1 “DC
Characteristics”). For a slow rise time, see Figure 4-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters (voltage,
frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
POR events are captured by the POR bit (RCON<1>).
The state of the bit is set to ‘0’ whenever a POR occurs;
it does not change for any other Reset event. POR is
not reset to ‘1’ by any hardware event. To capture
multiple events, the user manually resets the bit to ‘1’
in software following any POR.
FIGURE 4-2: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
Note 1: External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when VDD powers down.
2: R < 40 kΩ is recommended to make sure that
the voltage drop across R does not violate
the device’s electrical specification.
3: R1 ≥ 1 kΩ will limit any current flowing into
MCLR from external capacitor C, in the event
of MCLR/VPP pin breakdown, due to Electrostatic
Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
D R
VDD
MCLR
PIC18FXXXX
VDD
PIC18F2455/2550/4455/4550
DS39632E-page 48 © 2009 Microchip Technology Inc.
4.4 Brown-out Reset (BOR)
PIC18F2455/2550/4455/4550 devices implement a
BOR circuit that provides the user with a number of
configuration and power-saving options. The BOR
is controlled by the BORV1:BORV0 and
BOREN1:BOREN0 Configuration bits. There are a total
of four BOR configurations which are summarized in
Table 4-1.
The BOR threshold is set by the BORV1:BORV0 bits. If
BOR is enabled (any values of BOREN1:BOREN0
except ‘00’), any drop of VDD below VBOR (parameter
D005, Section 28.1 “DC Characteristics”) for
greater than TBOR (parameter 35, Table 28-12) will
reset the device. A Reset may or may not occur if VDD
falls below VBOR for less than TBOR. The chip will
remain in Brown-out Reset until VDD rises above VBOR.
If the Power-up Timer is enabled, it will be invoked after
VDD rises above VBOR; it then will keep the chip in
Reset for an additional time delay, TPWRT
(parameter 33, Table 28-12). If VDD drops below VBOR
while the Power-up Timer is running, the chip will go
back into a Brown-out Reset and the Power-up Timer
will be initialized. Once VDD rises above VBOR, the
Power-up Timer will execute the additional time delay.
BOR and the Power-on Timer (PWRT) are
independently configured. Enabling BOR Reset does
not automatically enable the PWRT.
4.4.1 SOFTWARE ENABLED BOR
When BOREN1:BOREN0 = 01, the BOR can be
enabled or disabled by the user in software. This is
done with the control bit, SBOREN (RCON<6>).
Setting SBOREN enables the BOR to function as
previously described. Clearing SBOREN disables the
BOR entirely. The SBOREN bit operates only in this
mode; otherwise, it is read as ‘0’.
Placing the BOR under software control gives the user
the additional flexibility of tailoring the application to its
environment without having to reprogram the device to
change BOR configuration. It also allows the user to
tailor device power consumption in software by eliminating
the incremental current that the BOR consumes.
While the BOR current is typically very small, it may
have some impact in low-power applications.
4.4.2 DETECTING BOR
When BOR is enabled, the BOR bit always resets to ‘0’
on any BOR or POR event. This makes it difficult to
determine if a BOR event has occurred just by reading
the state of BOR alone. A more reliable method is to
simultaneously check the state of both POR and BOR.
This assumes that the POR bit is reset to ‘1’ in software
immediately after any POR event. IF BOR is ‘0’ while
POR is ‘1’, it can be reliably assumed that a BOR event
has occurred.
4.4.3 DISABLING BOR IN SLEEP MODE
When BOREN1:BOREN0 = 10, the BOR remains
under hardware control and operates as previously
described. Whenever the device enters Sleep mode,
however, the BOR is automatically disabled. When the
device returns to any other operating mode, BOR is
automatically re-enabled.
This mode allows for applications to recover from
brown-out situations, while actively executing code,
when the device requires BOR protection the most. At
the same time, it saves additional power in Sleep mode
by eliminating the small incremental BOR current.
TABLE 4-1: BOR CONFIGURATIONS
Note: Even when BOR is under software control,
the BOR Reset voltage level is still set by
the BORV1:BORV0 Configuration bits. It
cannot be changed in software.
BOR Configuration Status of
SBOREN
(RCON<6>)
BOR Operation
BOREN1 BOREN0
0 0 Unavailable BOR disabled; must be enabled by reprogramming the Configuration bits.
0 1 Available BOR enabled in software; operation controlled by SBOREN.
1 0 Unavailable BOR enabled in hardware in Run and Idle modes, disabled during Sleep
mode.
1 1 Unavailable BOR enabled in hardware; must be disabled by reprogramming the
Configuration bits.
© 2009 Microchip Technology Inc. DS39632E-page 49
PIC18F2455/2550/4455/4550
4.5 Device Reset Timers
PIC18F2455/2550/4455/4550 devices incorporate
three separate on-chip timers that help regulate the
Power-on Reset process. Their main function is to
ensure that the device clock is stable before code is
executed. These timers are:
• Power-up Timer (PWRT)
• Oscillator Start-up Timer (OST)
• PLL Lock Time-out
4.5.1 POWER-UP TIMER (PWRT)
The Power-up Timer (PWRT) of the PIC18F2455/2550/
4455/4550 devices is an 11-bit counter which uses the
INTRC source as the clock input. This yields an
approximate time interval of 2048 x 32 μs = 65.6ms.
While the PWRT is counting, the device is held in
Reset.
The power-up time delay depends on the INTRC clock
and will vary from chip to chip due to temperature and
process variation. See DC parameter 33 (Table 28-12)
for details.
The PWRT is enabled by clearing the PWRTEN
Configuration bit.
4.5.2 OSCILLATOR START-UP
TIMER (OST)
The Oscillator Start-up Timer (OST) provides a
1024 oscillator cycle (from OSC1 input) delay after the
PWRT delay is over (parameter 33, Table 28-12). This
ensures that the crystal oscillator or resonator has
started and stabilized.
The OST time-out is invoked only for XT, HS and
HSPLL modes and only on Power-on Reset or on exit
from most power-managed modes.
4.5.3 PLL LOCK TIME-OUT
With the PLL enabled in its PLL mode, the time-out
sequence following a Power-on Reset is slightly different
from other oscillator modes. A separate timer is
used to provide a fixed time-out that is sufficient for the
PLL to lock to the main oscillator frequency. This PLL
lock time-out (TPLL) is typically 2 ms and follows the
oscillator start-up time-out.
4.5.4 TIME-OUT SEQUENCE
On power-up, the time-out sequence is as follows:
1. After the POR condition has cleared, PWRT
time-out is invoked (if enabled).
2. Then, the OST is activated.
The total time-out will vary based on oscillator configuration
and the status of the PWRT. Figure 4-3,
Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all
depict time-out sequences on power-up, with the
Power-up Timer enabled and the device operating in
HS Oscillator mode. Figures 4-3 through 4-6 also apply
to devices operating in XT mode. For devices in RC
mode and with the PWRT disabled, on the other hand,
there will be no time-out at all.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, all time-outs will expire. Bringing
MCLR high will begin execution immediately
(Figure 4-5). This is useful for testing purposes or to
synchronize more than one PIC18FXXXX device
operating in parallel.
TABLE 4-2: TIME-OUT IN VARIOUS SITUATIONS
Oscillator
Configuration
Power-up(2) and Brown-out Exit from
PWRTEN = 0 PWRTEN = 1 Power-Managed Mode
HS, XT 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC
HSPLL, XTPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2)
EC, ECIO 66 ms(1) — —
ECPLL, ECPIO 66 ms(1) + 2 ms(2) 2 ms(2) 2 ms(2)
INTIO, INTCKO 66 ms(1) — —
INTHS, INTXT 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC
Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.
2: 2 ms is the nominal time required for the PLL to lock.
PIC18F2455/2550/4455/4550
DS39632E-page 50 © 2009 Microchip Technology Inc.
FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)
FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
TOST
© 2009 Microchip Technology Inc. DS39632E-page 51
PIC18F2455/2550/4455/4550
FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)
FIGURE 4-7: TIME-OUT SEQUENCE ON POR w/PLL ENABLED (MCLR TIED TO VDD)
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
0V 1V
5V
TPWRT
TOST
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
PLL TIME-OUT
TPLL
Note: TOST = 1024 clock cycles.
TPLL ≈ 2 ms max. First three stages of the Power-up Timer.
PIC18F2455/2550/4455/4550
DS39632E-page 52 © 2009 Microchip Technology Inc.
4.6 Reset State of Registers
Most registers are unaffected by a Reset. Their status
is unknown on POR and unchanged by all other
Resets. The other registers are forced to a “Reset
state” depending on the type of Reset that occurred.
Most registers are not affected by a WDT wake-up,
since this is viewed as the resumption of normal operation.
Status bits from the RCON register, RI, TO, PD,
POR and BOR, are set or cleared differently in different
Reset situations as indicated in Table 4-3. These bits
are used in software to determine the nature of the
Reset.
Table 4-4 describes the Reset states for all of the
Special Function Registers. These are categorized by
Power-on and Brown-out Resets, Master Clear and
WDT Resets and WDT wake-ups.
TABLE 4-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION
FOR RCON REGISTER
Condition Program
Counter
RCON Register STKPTR Register
RI TO PD POR BOR STKFUL STKUNF
Power-on Reset 0000h 1 1 1 0 0 0 0
RESET instruction 0000h 0 u u u u u u
Brown-out Reset 0000h 1 1 1 u 0 u u
MCLR Reset during power-managed Run
modes
0000h u 1 u u u u u
MCLR Reset during power-managed Idle
modes and Sleep mode
0000h u 1 0 u u u u
WDT time-out during full power or
power-managed Run modes
0000h u 0 u u u u u
MCLR Reset during full-power execution 0000h u u u u u u u
Stack Full Reset (STVREN = 1) 0000h u u u u u 1 u
Stack Underflow Reset (STVREN = 1) 0000h u u u u u u 1
Stack Underflow Error (not an actual Reset,
STVREN = 0)
0000h u u u u u u 1
WDT time-out during power-managed Idle or
Sleep modes
PC + 2 u 0 0 u u u u
Interrupt exit from power-managed modes PC + 2(1) u u 0 u u u u
Legend: u = unchanged
Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the
interrupt vector (008h or 0018h).
2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled
(BOREN1:BOREN0 Configuration bits = 01 and SBOREN = 1); otherwise, the Reset state is ‘0’.
© 2009 Microchip Technology Inc. DS39632E-page 53
PIC18F2455/2550/4455/4550
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS
Register Applicable Devices Power-on Reset,
Brown-out Reset
MCLR Resets,
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
TOSU 2455 2550 4455 4550 ---0 0000 ---0 0000 ---0 uuuu(1)
TOSH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu(1)
TOSL 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu(1)
STKPTR 2455 2550 4455 4550 00-0 0000 uu-0 0000 uu-u uuuu(1)
PCLATU 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
PCLATH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PCL 2455 2550 4455 4550 0000 0000 0000 0000 PC + 2(3)
TBLPTRU 2455 2550 4455 4550 --00 0000 --00 0000 --uu uuuu
TBLPTRH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TBLPTRL 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TABLAT 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PRODH 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
PRODL 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
INTCON 2455 2550 4455 4550 0000 000x 0000 000u uuuu uuuu(2)
INTCON2 2455 2550 4455 4550 1111 -1-1 1111 -1-1 uuuu -u-u(2)
INTCON3 2455 2550 4455 4550 11-0 0-00 11-0 0-00 uu-u u-uu(2)
INDF0 2455 2550 4455 4550 N/A N/A N/A
POSTINC0 2455 2550 4455 4550 N/A N/A N/A
POSTDEC0 2455 2550 4455 4550 N/A N/A N/A
PREINC0 2455 2550 4455 4550 N/A N/A N/A
PLUSW0 2455 2550 4455 4550 N/A N/A N/A
FSR0H 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
FSR0L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
WREG 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
INDF1 2455 2550 4455 4550 N/A N/A N/A
POSTINC1 2455 2550 4455 4550 N/A N/A N/A
POSTDEC1 2455 2550 4455 4550 N/A N/A N/A
PREINC1 2455 2550 4455 4550 N/A N/A N/A
PLUSW1 2455 2550 4455 4550 N/A N/A N/A
FSR1H 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
FSR1L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
BSR 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition.
5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
PIC18F2455/2550/4455/4550
DS39632E-page 54 © 2009 Microchip Technology Inc.
INDF2 2455 2550 4455 4550 N/A N/A N/A
POSTINC2 2455 2550 4455 4550 N/A N/A N/A
POSTDEC2 2455 2550 4455 4550 N/A N/A N/A
PREINC2 2455 2550 4455 4550 N/A N/A N/A
PLUSW2 2455 2550 4455 4550 N/A N/A N/A
FSR2H 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
FSR2L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
STATUS 2455 2550 4455 4550 ---x xxxx ---u uuuu ---u uuuu
TMR0H 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TMR0L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
T0CON 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
OSCCON 2455 2550 4455 4550 0100 q000 0100 00q0 uuuu uuqu
HLVDCON 2455 2550 4455 4550 0-00 0101 0-00 0101 u-uu uuuu
WDTCON 2455 2550 4455 4550 ---- ---0 ---- ---0 ---- ---u
RCON(4) 2455 2550 4455 4550 0q-1 11q0 0q-q qquu uq-u qquu
TMR1H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
TMR1L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 2455 2550 4455 4550 0000 0000 u0uu uuuu uuuu uuuu
TMR2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PR2 2455 2550 4455 4550 1111 1111 1111 1111 1111 1111
T2CON 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
SSPBUF 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
SSPADD 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SSPSTAT 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SSPCON1 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SSPCON2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
ADRESH 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
ADRESL 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 2455 2550 4455 4550 --00 0000 --00 0000 --uu uuuu
ADCON1 2455 2550 4455 4550 --00 0qqq --00 0qqq --uu uuuu
ADCON2 2455 2550 4455 4550 0-00 0000 0-00 0000 u-uu uuuu
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable Devices Power-on Reset,
Brown-out Reset
MCLR Resets,
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition.
5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
© 2009 Microchip Technology Inc. DS39632E-page 55
PIC18F2455/2550/4455/4550
CCPR1H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 2455 2550 4455 4550 --00 0000 --00 0000 --uu uuuu
2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
CCPR2H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR2L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCP2CON 2455 2550 4455 4550 --00 0000 --00 0000 --uu uuuu
BAUDCON 2455 2550 4455 4550 0100 0-00 0100 0-00 uuuu u-uu
ECCP1DEL 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
ECCP1AS 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
CVRCON 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
CMCON 2455 2550 4455 4550 0000 0111 0000 0111 uuuu uuuu
TMR3H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
TMR3L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
T3CON 2455 2550 4455 4550 0000 0000 uuuu uuuu uuuu uuuu
SPBRGH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SPBRG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
RCREG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TXREG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TXSTA 2455 2550 4455 4550 0000 0010 0000 0010 uuuu uuuu
RCSTA 2455 2550 4455 4550 0000 000x 0000 000x uuuu uuuu
EEADR 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
EEDATA 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
EECON2 2455 2550 4455 4550 0000 0000 0000 0000 0000 0000
EECON1 2455 2550 4455 4550 xx-0 x000 uu-0 u000 uu-0 u000
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable Devices Power-on Reset,
Brown-out Reset
MCLR Resets,
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition.
5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
PIC18F2455/2550/4455/4550
DS39632E-page 56 © 2009 Microchip Technology Inc.
IPR2 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
PIR2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu(2)
PIE2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
IPR1 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
2455 2550 4455 4550 -111 1111 -111 1111 -uuu uuuu
PIR1 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu(2)
2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
PIE1 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
OSCTUNE 2455 2550 4455 4550 0--0 0000 0--0 0000 u--u uuuu
TRISE 2455 2550 4455 4550 ---- -111 ---- -111 ---- -uuu
TRISD 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
TRISC 2455 2550 4455 4550 11-- -111 11-- -111 uu-- -uuu
TRISB 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
TRISA(5) 2455 2550 4455 4550 -111 1111(5) -111 1111(5) -uuu uuuu(5)
LATE 2455 2550 4455 4550 ---- -xxx ---- -uuu ---- -uuu
LATD 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
LATC 2455 2550 4455 4550 xx-- -xxx uu-- -uuu uu-- -uuu
LATB 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
LATA(5) 2455 2550 4455 4550 -xxx xxxx(5) -uuu uuuu(5) -uuu uuuu(5)
PORTE 2455 2550 4455 4550 0--- x000 0--- x000 u--- uuuu
PORTD 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
PORTC 2455 2550 4455 4550 xxxx -xxx uuuu -uuu uuuu -uuu
PORTB 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
PORTA(5) 2455 2550 4455 4550 -x0x 0000(5) -u0u 0000(5) -uuu uuuu(5)
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable Devices Power-on Reset,
Brown-out Reset
MCLR Resets,
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition.
5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
© 2009 Microchip Technology Inc. DS39632E-page 57
PIC18F2455/2550/4455/4550
UEP15 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP14 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP13 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP12 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP11 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP10 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP9 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP8 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP7 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP6 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP5 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP4 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP3 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP2 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP1 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP0 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UCFG 2455 2550 4455 4550 00-0 0000 00-0 0000 uu-u uuuu
UADDR 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
UCON 2455 2550 4455 4550 -0x0 000- -0x0 000- -uuu uuu-
USTAT 2455 2550 4455 4550 -xxx xxx- -xxx xxx- -uuu uuu-
UEIE 2455 2550 4455 4550 0--0 0000 0--0 0000 u--u uuuu
UEIR 2455 2550 4455 4550 0--0 0000 0--0 0000 u--u uuuu
UIE 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
UIR 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
UFRMH 2455 2550 4455 4550 ---- -xxx ---- -xxx ---- -uuu
UFRML 2455 2550 4455 4550 xxxx xxxx xxxx xxxx uuuu uuuu
SPPCON 2455 2550 4455 4550 ---- --00 ---- --00 ---- --uu
SPPEPS 2455 2550 4455 4550 00-0 0000 00-0 0000 uu-u uuuu
SPPCFG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SPPDATA 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Register Applicable Devices Power-on Reset,
Brown-out Reset
MCLR Resets,
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition.
5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
PIC18F2455/2550/4455/4550
DS39632E-page 58 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS39632E-page 59
PIC18F2455/2550/4455/4550
5.0 MEMORY ORGANIZATION
There are three types of memory in PIC18 enhanced
microcontroller devices:
• Program Memory
• Data RAM
• Data EEPROM
As Harvard architecture devices, the data and program
memories use separate busses; this allows for concurrent
access of the two memory spaces. The data
EEPROM, for practical purposes, can be regarded as
a peripheral device, since it is addressed and accessed
through a set of control registers.
Additional detailed information on the operation of the
Flash program memory is provided in Section 6.0
“Flash Program Memory”. Data EEPROM is
discussed separately in Section 7.0 “Data EEPROM
Memory”.
5.1 Program Memory Organization
PIC18 microcontrollers implement a 21-bit program
counter which is capable of addressing a 2-Mbyte
program memory space. Accessing a location between
the upper boundary of the physically implemented
memory and the 2-Mbyte address will return all ‘0’s (a
NOP instruction).
The PIC18F2455 and PIC18F4455 each have 24 Kbytes
of Flash memory and can store up to 12,288 single-word
instructions. The PIC18F2550 and PIC18F4550 each
have 32 Kbytes of Flash memory and can store up to
16,384 single-word instructions.
PIC18 devices have two interrupt vectors. The Reset
vector address is at 0000h and the interrupt vector
addresses are at 0008h and 0018h.
The program memory maps for PIC18FX455 and
PIC18FX550 devices are shown in Figure 5-1.
FIGURE 5-1: PROGRAM MEMORY MAP AND STACK
PC<20:0>
Stack Level 1
•
Stack Level 31
Reset Vector
Low-Priority Interrupt Vector
••
CALL, RCALL, RETURN,
RETFIE, RETLW, CALLW,
21
0000h
0018h
On-Chip
Program Memory
High-Priority Interrupt Vector 0008h
User Memory Space
1FFFFFh
6000h
5FFFh
Read ‘0’
200000h
PC<20:0>
Stack Level 1
•
Stack Level 31
Reset Vector
Low-Priority Interrupt Vector
••
CALL, RCALL, RETURN,
RETFIE, RETLW, CALLW,
21
0000h
0018h
8000h
7FFFh
On-Chip
Program Memory
High-Priority Interrupt Vector 0008h
User Memory Space
Read ‘0’
1FFFFFh
200000h
24 Kbyte Devices 32 Kbyte Device
ADDULNK, SUBULNK ADDULNK, SUBULNK
PIC18F2455/2550/4455/4550
DS39632E-page 60 © 2009 Microchip Technology Inc.
5.1.1 PROGRAM COUNTER
The Program Counter (PC) specifies the address of the
instruction to fetch for execution. The PC is 21 bits wide
and is contained in three separate 8-bit registers. The
low byte, known as the PCL register, is both readable
and writable. The high byte, or PCH register, contains
the PC<15:8> bits; it is not directly readable or writable.
Updates to the PCH register are performed through the
PCLATH register. The upper byte is called PCU. This
register contains the PC<20:16> bits; it is also not
directly readable or writable. Updates to the PCU
register are performed through the PCLATU register.
The contents of PCLATH and PCLATU are transferred
to the program counter by any operation that writes
PCL. Similarly, the upper two bytes of the program
counter are transferred to PCLATH and PCLATU by an
operation that reads PCL. This is useful for computed
offsets to the PC (see Section 5.1.4.1 “Computed
GOTO”).
The PC addresses bytes in the program memory. To
prevent the PC from becoming misaligned with word
instructions, the Least Significant bit of PCL is fixed to
a value of ‘0’. The PC increments by 2 to address
sequential instructions in the program memory.
The CALL, RCALL and GOTO program branch
instructions write to the program counter directly. For
these instructions, the contents of PCLATH and
PCLATU are not transferred to the program counter.
5.1.2 RETURN ADDRESS STACK
The return address stack allows any combination of up
to 31 program calls and interrupts to occur. The PC is
pushed onto the stack when a CALL or RCALL instruction
is executed or an interrupt is Acknowledged. The
PC value is pulled off the stack on a RETURN, RETLW or
a RETFIE instruction. PCLATU and PCLATH are not
affected by any of the RETURN or CALL instructions.
The stack operates as a 31-word by 21-bit RAM and a
5-bit Stack Pointer, STKPTR. The stack space is not
part of either program or data space. The Stack Pointer
is readable and writable and the address on the top of
the stack is readable and writable through the
Top-of-Stack Special Function Registers. Data can also
be pushed to, or popped from the stack, using these
registers.
A CALL type instruction causes a push onto the stack.
The Stack Pointer is first incremented and the location
pointed to by the Stack Pointer is written with the
contents of the PC (already pointing to the instruction
following the CALL). A RETURN type instruction causes
a pop from the stack. The contents of the location
pointed to by the STKPTR are transferred to the PC
and then the Stack Pointer is decremented.
The Stack Pointer is initialized to ‘00000’ after all
Resets. There is no RAM associated with the location
corresponding to a Stack Pointer value of ‘00000’; this
is only a Reset value. Status bits indicate if the stack is
full, has overflowed or has underflowed.
5.1.2.1 Top-of-Stack Access
Only the top of the return address stack (TOS) is
readable and writable. A set of three registers,
TOSU:TOSH:TOSL, hold the contents of the stack location
pointed to by the STKPTR register (Figure 5-2). This
allows users to implement a software stack if necessary.
After a CALL, RCALL or interrupt, the software can read
the pushed value by reading the TOSU:TOSH:TOSL
registers. These values can be placed on a user-defined
software stack. At return time, the software can return
these values to TOSU:TOSH:TOSL and do a return.
The user must disable the global interrupt enable bits
while accessing the stack to prevent inadvertent stack
corruption.
FIGURE 5-2: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS
00011
001A34h
11111
11110
11101
00010
00001
00000
00010
Return Address Stack<20:0>
Top-of-Stack
000D58h
TOSU TOSH TOSL
00h 1Ah 34h
STKPTR<4:0>
Top-of-Stack Registers Stack Pointer
© 2009 Microchip Technology Inc. DS39632E-page 61
PIC18F2455/2550/4455/4550
5.1.2.2 Return Stack Pointer (STKPTR)
The STKPTR register (Register 5-1) contains the Stack
Pointer value, the STKFUL (Stack Full) status bit and
the STKUNF (Stack Underflow) status bit. The value of
the Stack Pointer can be 0 through 31. The Stack
Pointer increments before values are pushed onto the
stack and decrements after values are popped off the
stack. On Reset, the Stack Pointer value will be zero.
The user may read and write the Stack Pointer value.
This feature can be used by a Real-Time Operating
System (RTOS) for return stack maintenance.
After the PC is pushed onto the stack 31 times (without
popping any values off the stack), the STKFUL bit is
set. The STKFUL bit is cleared by software or by a
POR.
The action that takes place when the stack becomes
full depends on the state of the STVREN (Stack
Overflow Reset Enable) Configuration bit. (Refer to
Section 25.1 “Configuration Bits” for a description of
the device Configuration bits.) If STVREN is set
(default), the 31st push will push the (PC + 2) value
onto the stack, set the STKFUL bit and reset the
device. The STKFUL bit will remain set and the Stack
Pointer will be set to zero.
If STVREN is cleared, the STKFUL bit will be set on the
31st push and the Stack Pointer will increment to 31.
Any additional pushes will not overwrite the 31st push
and the STKPTR will remain at 31.
When the stack has been popped enough times to
unload the stack, the next pop will return a value of zero
to the PC and sets the STKUNF bit, while the Stack
Pointer remains at zero. The STKUNF bit will remain
set until cleared by software or until a POR occurs.
5.1.2.3 PUSH and POP Instructions
Since the Top-of-Stack is readable and writable, the
ability to push values onto the stack and pull values off
the stack, without disturbing normal program execution,
is a desirable feature. The PIC18 instruction set
includes two instructions, PUSH and POP, that permit
the TOS to be manipulated under software control.
TOSU, TOSH and TOSL can be modified to place data
or a return address on the stack.
The PUSH instruction places the current PC value onto
the stack. This increments the Stack Pointer and loads
the current PC value onto the stack.
The POP instruction discards the current TOS by decrementing
the Stack Pointer. The previous value pushed
onto the stack then becomes the TOS value.
Note: Returning a value of zero to the PC on an
underflow has the effect of vectoring the
program to the Reset vector, where the
stack conditions can be verified and
appropriate actions can be taken. This is
not the same as a Reset, as the contents
of the SFRs are not affected.
REGISTER 5-1: STKPTR: STACK POINTER REGISTER
R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STKFUL(1) STKUNF(1) — SP4 SP3 SP2 SP1 SP0
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 STKFUL: Stack Full Flag bit(1)
1 = Stack became full or overflowed
0 = Stack has not become full or overflowed
bit 6 STKUNF: Stack Underflow Flag bit(1)
1 = Stack underflow occurred
0 = Stack underflow did not occur
bit 5 Unimplemented: Read as ‘0’
bit 4-0 SP4:SP0: Stack Pointer Location bits
Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.
PIC18F2455/2550/4455/4550
DS39632E-page 62 © 2009 Microchip Technology Inc.
5.1.2.4 Stack Full and Underflow Resets
Device Resets on stack overflow and stack underflow
conditions are enabled by setting the STVREN bit in
Configuration Register 4L. When STVREN is set, a full
or underflow condition will set the appropriate STKFUL
or STKUNF bit and then cause a device Reset. When
STVREN is cleared, a full or underflow condition will set
the appropriate STKFUL or STKUNF bit but not cause
a device Reset. The STKFUL or STKUNF bits are
cleared by user software or a Power-on Reset.
5.1.3 FAST REGISTER STACK
A Fast Register Stack is provided for the STATUS,
WREG and BSR registers to provide a “fast return”
option for interrupts. Each stack is only one level deep
and is neither readable nor writable. It is loaded with the
current value of the corresponding register when the
processor vectors for an interrupt. All interrupt sources
will push values into the stack registers. The values in
the registers are then loaded back into their associated
registers if the RETFIE, FAST instruction is used to
return from the interrupt.
If both low and high-priority interrupts are enabled, the
stack registers cannot be used reliably to return from
low-priority interrupts. If a high-priority interrupt occurs
while servicing a low-priority interrupt, the stack
register values stored by the low-priority interrupt will
be overwritten. In these cases, users must save the key
registers in software during a low-priority interrupt.
If interrupt priority is not used, all interrupts may use the
Fast Register Stack for returns from interrupt. If no
interrupts are used, the Fast Register Stack can be
used to restore the STATUS, WREG and BSR registers
at the end of a subroutine call. To use the Fast Register
Stack for a subroutine call, a CALL label, FAST
instruction must be executed to save the STATUS,
WREG and BSR registers to the Fast Register Stack. A
RETURN, FAST instruction is then executed to restore
these registers from the Fast Register Stack.
Example 5-1 shows a source code example that uses
the Fast Register Stack during a subroutine call and
return.
EXAMPLE 5-1: FAST REGISTER STACK
CODE EXAMPLE
5.1.4 LOOK-UP TABLES IN PROGRAM
MEMORY
There may be programming situations that require the
creation of data structures, or look-up tables, in
program memory. For PIC18 devices, look-up tables
can be implemented in two ways:
• Computed GOTO
• Table Reads
5.1.4.1 Computed GOTO
A computed GOTO is accomplished by adding an offset
to the program counter. An example is shown in
Example 5-2.
A look-up table can be formed with an ADDWF PCL
instruction and a group of RETLW nn instructions. The
W register is loaded with an offset into the table before
executing a call to that table. The first instruction of the
called routine is the ADDWF PCL instruction. The next
instruction executed will be one of the RETLW nn
instructions that returns the value ‘nn’ to the calling
function.
The offset value (in WREG) specifies the number of
bytes that the program counter should advance and
should be multiples of 2 (LSb = 0).
In this method, only one data byte may be stored in
each instruction location and room on the return
address stack is required.
EXAMPLE 5-2: COMPUTED GOTO USING
AN OFFSET VALUE
5.1.4.2 Table Reads and Table Writes
A better method of storing data in program memory
allows two bytes of data to be stored in each instruction
location.
Look-up table data may be stored two bytes per
program word by using table reads and writes. The
Table Pointer (TBLPTR) register specifies the byte
address and the Table Latch (TABLAT) register
contains the data that is read from or written to program
memory. Data is transferred to or from program
memory one byte at a time.
Table read and table write operations are discussed
further in Section 6.1 “Table Reads and Table
Writes”.
CALL SUB1, FAST ;STATUS, WREG, BSR
;SAVED IN FAST REGISTER
;STACK
•
•
SUB1 •
•
RETURN, FAST ;RESTORE VALUES SAVED
;IN FAST REGISTER STACK
MOVF OFFSET, W
CALL TABLE
ORG nn00h
TABLE ADDWF PCL
RETLW nnh
RETLW nnh
RETLW nnh
.
.
.
© 2009 Microchip Technology Inc. DS39632E-page 63
PIC18F2455/2550/4455/4550
5.2 PIC18 Instruction Cycle
5.2.1 CLOCKING SCHEME
The microcontroller clock input, whether from an
internal or external source, is internally divided by four
to generate four non-overlapping quadrature clocks
(Q1, Q2, Q3 and Q4). Internally, the program counter is
incremented on every Q1; the instruction is fetched
from the program memory and latched into the Instruction
Register (IR) during Q4. The instruction is decoded
and executed during the following Q1 through Q4. The
clocks and instruction execution flow are shown in
Figure 5-3.
5.2.2 INSTRUCTION FLOW/PIPELINING
An “Instruction Cycle” consists of four Q cycles: Q1
through Q4. The instruction fetch and execute are pipelined
in such a manner that a fetch takes one instruction
cycle, while the decode and execute takes another
instruction cycle. However, due to the pipelining, each
instruction effectively executes in one cycle. If an
instruction causes the program counter to change (e.g.,
GOTO), then two cycles are required to complete the
instruction (Example 5-3).
A fetch cycle begins with the Program Counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the Instruction Register (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3 and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
FIGURE 5-3: CLOCK/INSTRUCTION CYCLE
EXAMPLE 5-3: INSTRUCTION PIPELINE FLOW
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2
Q3
Q4
PC
OSC2/CLKO
(RC mode)
PC PC + 2 PC + 4
Fetch INST (PC)
Execute INST (PC – 2)
Fetch INST (PC + 2)
Execute INST (PC)
Fetch INST (PC + 4)
Execute INST (PC + 2)
Internal
Phase
Clock
Note: All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.
TCY0 TCY1 TCY2 TCY3 TCY4 TCY5
1. MOVLW 55h Fetch 1 Execute 1
2. MOVWF PORTB Fetch 2 Execute 2
3. BRA SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)
5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1
PIC18F2455/2550/4455/4550
DS39632E-page 64 © 2009 Microchip Technology Inc.
5.2.3 INSTRUCTIONS IN PROGRAM
MEMORY
The program memory is addressed in bytes. Instructions
are stored as two bytes or four bytes in program
memory. The Least Significant Byte of an instruction
word is always stored in a program memory location
with an even address (LSb = 0). To maintain alignment
with instruction boundaries, the PC increments in steps
of 2 and the LSb will always read ‘0’ (see Section 5.1.1
“Program Counter”).
Figure 5-4 shows an example of how instruction words
are stored in the program memory.
The CALL and GOTO instructions have the absolute
program memory address embedded into the instruction.
Since instructions are always stored on word
boundaries, the data contained in the instruction is a
word address. The word address is written to PC<20:1>,
which accesses the desired byte address in program
memory. Instruction #2 in Figure 5-4 shows how the
instruction, GOTO 0006h, is encoded in the program
memory. Program branch instructions, which encode a
relative address offset, operate in the same manner. The
offset value stored in a branch instruction represents the
number of single-word instructions that the PC will be
offset by. Section 26.0 “Instruction Set Summary”
provides further details of the instruction set.
FIGURE 5-4: INSTRUCTIONS IN PROGRAM MEMORY
5.2.4 TWO-WORD INSTRUCTIONS
The standard PIC18 instruction set has four two-word
instructions: CALL, MOVFF, GOTO and LSFR. In all
cases, the second word of the instructions always has
‘1111’ as its four Most Significant bits; the other 12 bits
are literal data, usually a data memory address.
The use of ‘1111’ in the 4 MSbs of an instruction
specifies a special form of NOP. If the instruction is
executed in proper sequence, immediately after the
first word, the data in the second word is accessed and
used by the instruction sequence. If the first word is
skipped for some reason and the second word is
executed by itself, a NOP is executed instead. This is
necessary for cases when the two-word instruction is
preceded by a conditional instruction that changes the
PC. Example 5-4 shows how this works.
EXAMPLE 5-4: TWO-WORD INSTRUCTIONS
Word Address
LSB = 1 LSB = 0 ↓
Program Memory
Byte Locations →
000000h
000002h
000004h
000006h
Instruction 1: MOVLW 055h 0Fh 55h 000008h
Instruction 2: GOTO 0006h EFh 03h 00000Ah
F0h 00h 00000Ch
Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh
F4h 56h 000010h
000012h
000014h
Note: See Section 5.5 “Program Memory and
the Extended Instruction Set” for
information on two-word instruction in the
extended instruction set.
CASE 1:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word
1111 0100 0101 0110 ; Execute this word as a NOP
0010 0100 0000 0000 ADDWF REG3 ; continue code
CASE 2:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word
1111 0100 0101 0110 ; 2nd word of instruction
0010 0100 0000 0000 ADDWF REG3 ; continue code
© 2009 Microchip Technology Inc. DS39632E-page 65
PIC18F2455/2550/4455/4550
5.3 Data Memory Organization
The data memory in PIC18 devices is implemented as
static RAM. Each register in the data memory has a
12-bit address, allowing up to 4096 bytes of data
memory. The memory space is divided into as many as
16 banks that contain 256 bytes each.
PIC18F2455/2550/4455/4550 devices implement eight
complete banks, for a total of 2048 bytes. Figure 5-5
shows the data memory organization for the devices.
The data memory contains Special Function Registers
(SFRs) and General Purpose Registers (GPRs). The
SFRs are used for control and status of the controller
and peripheral functions, while GPRs are used for data
storage and scratchpad operations in the user’s
application. Any read of an unimplemented location will
read as ‘0’s.
The instruction set and architecture allow operations
across all banks. The entire data memory may be
accessed by Direct, Indirect or Indexed Addressing
modes. Addressing modes are discussed later in this
subsection.
To ensure that commonly used registers (SFRs and
select GPRs) can be accessed in a single cycle, PIC18
devices implement an Access Bank. This is a 256-byte
memory space that provides fast access to SFRs and
the lower portion of GPR Bank 0 without using the
BSR. Section 5.3.3 “Access Bank” provides a
detailed description of the Access RAM.
5.3.1 USB RAM
Banks 4 through 7 of the data memory are actually
mapped to special dual port RAM. When the USB
module is disabled, the GPRs in these banks are used
like any other GPR in the data memory space.
When the USB module is enabled, the memory in these
banks is allocated as buffer RAM for USB operation.
This area is shared between the microcontroller core
and the USB Serial Interface Engine (SIE) and is used
to transfer data directly between the two.
It is theoretically possible to use the areas of USB RAM
that are not allocated as USB buffers for normal
scratchpad memory or other variable storage. In practice,
the dynamic nature of buffer allocation makes this
risky at best. Additionally, Bank 4 is used for USB buffer
management when the module is enabled and should
not be used for any other purposes during that time.
Additional information on USB RAM and buffer
operation is provided in Section 17.0 “Universal
Serial Bus (USB)”.
5.3.2 BANK SELECT REGISTER (BSR)
Large areas of data memory require an efficient
addressing scheme to make rapid access to any
address possible. Ideally, this means that an entire
address does not need to be provided for each read or
write operation. For PIC18 devices, this is accomplished
with a RAM banking scheme. This divides the
memory space into 16 contiguous banks of 256 bytes.
Depending on the instruction, each location can be
addressed directly by its full 12-bit address, or an 8-bit
low-order address and a 4-bit Bank Pointer.
Most instructions in the PIC18 instruction set make use
of the Bank Pointer, known as the Bank Select Register
(BSR). This SFR holds the 4 Most Significant bits of a
location’s address; the instruction itself includes the
eight Least Significant bits. Only the four lower bits of
the BSR are implemented (BSR3:BSR0). The upper
four bits are unused; they will always read ‘0’ and cannot
be written to. The BSR can be loaded directly by
using the MOVLB instruction.
The value of the BSR indicates the bank in data
memory. The eight bits in the instruction show the location
in the bank and can be thought of as an offset from
the bank’s lower boundary. The relationship between
the BSR’s value and the bank division in data memory
is shown in Figure 5-6.
Since up to sixteen registers may share the same
low-order address, the user must always be careful to
ensure that the proper bank is selected before performing
a data read or write. For example, writing what
should be program data to an 8-bit address of F9h,
while the BSR is 0Fh, will end up resetting the program
counter.
While any bank can be selected, only those banks that
are actually implemented can be read or written to.
Writes to unimplemented banks are ignored, while
reads from unimplemented banks will return ‘0’s. Even
so, the STATUS register will still be affected as if the
operation was successful. The data memory map in
Figure 5-5 indicates which banks are implemented.
In the core PIC18 instruction set, only the MOVFF
instruction fully specifies the 12-bit address of the
source and target registers. This instruction ignores the
BSR completely when it executes. All other instructions
include only the low-order address as an operand and
must use either the BSR or the Access Bank to locate
their target registers.
Note: The operation of some aspects of data
memory are changed when the PIC18
extended instruction set is enabled. See
Section 5.6 “Data Memory and the
Extended Instruction Set” for more
information.
PIC18F2455/2550/4455/4550
DS39632E-page 66 © 2009 Microchip Technology Inc.
FIGURE 5-5: DATA MEMORY MAP
Bank 0
Bank 1
Bank 14
Bank 15
BSR<3:0> Data Memory Map
= 0000
= 0001
= 1111
060h
05Fh
F60h
FFFh
00h
5Fh
60h
FFh
Access Bank
When a = 0:
The BSR is ignored and the
Access Bank is used.
The first 96 bytes are
general purpose RAM
(from Bank 0).
The remaining 160 bytes are
Special Function Registers
(from Bank 15).
When a = 1:
The BSR specifies the bank
used by the instruction.
F5Fh
F00h
EFFh
1FFh
100h
0FFh
Access RAM 000h
FFh
00h
FFh
00h
FFh
00h
GPR
GPR
SFR
Access RAM High
Access RAM Low
Bank 2
= 0110
= 0010
(SFRs)
2FFh
200h
3FFh
300h
4FFh
400h
5FFh
500h
6FFh
600h
7FFh
700h
800h
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
Bank 8
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
00h
GPR
GPR(1)
GPR
GPR(1)
GPR(1)
GPR(1)
FFh
= 0011
= 0100
= 0101
= 0111
= 1000
Unused
to Read as 00h
= 1110
Note 1: These banks also serve as RAM buffer for USB operation. See Section 5.3.1 “USB RAM” for more
information.
Unused
© 2009 Microchip Technology Inc. DS39632E-page 67
PIC18F2455/2550/4455/4550
FIGURE 5-6: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)
5.3.3 ACCESS BANK
While the use of the BSR, with an embedded 8-bit
address, allows users to address the entire range of
data memory, it also means that the user must always
ensure that the correct bank is selected. Otherwise,
data may be read from or written to the wrong location.
This can be disastrous if a GPR is the intended target
of an operation but an SFR is written to instead.
Verifying and/or changing the BSR for each read or
write to data memory can become very inefficient.
To streamline access for the most commonly used data
memory locations, the data memory is configured with
an Access Bank, which allows users to access a
mapped block of memory without specifying a BSR.
The Access Bank consists of the first 96 bytes of
memory (00h-5Fh) in Bank 0 and the last 160 bytes of
memory (60h-FFh) in Block 15. The lower half is known
as the “Access RAM” and is composed of GPRs. The
upper half is where the device’s SFRs are mapped.
These two areas are mapped contiguously in the
Access Bank and can be addressed in a linear fashion
by an 8-bit address (Figure 5-5).
The Access Bank is used by core PIC18 instructions
that include the Access RAM bit (the ‘a’ parameter in
the instruction). When ‘a’ is equal to ‘1’, the instruction
uses the BSR and the 8-bit address included in the
opcode for the data memory address. When ‘a’ is ‘0’,
however, the instruction is forced to use the Access
Bank address map; the current value of the BSR is
ignored entirely.
Using this “forced” addressing allows the instruction to
operate on a data address in a single cycle without
updating the BSR first. For 8-bit addresses of 60h and
above, this means that users can evaluate and operate
on SFRs more efficiently. The Access RAM below 60h
is a good place for data values that the user might need
to access rapidly, such as immediate computational
results or common program variables. Access RAM
also allows for faster and more code efficient context
saving and switching of variables.
The mapping of the Access Bank is slightly different
when the extended instruction set is enabled (XINST
Configuration bit = 1). This is discussed in more detail
in Section 5.6.3 “Mapping the Access Bank in
Indexed Literal Offset Mode”.
5.3.4 GENERAL PURPOSE
REGISTER FILE
PIC18 devices may have banked memory in the GPR
area. This is data RAM which is available for use by all
instructions. GPRs start at the bottom of Bank 0
(address 000h) and grow upwards towards the bottom
of the SFR area. GPRs are not initialized by a
Power-on Reset and are unchanged on all other
Resets.
Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to
the registers of the Access Bank.
2: The MOVFF instruction embeds the entire 12-bit address in the instruction.
Data Memory
Bank Select(2)
7 0
From Opcode(2)
0 0 0 0
000h
100h
200h
300h
F00h
E00h
FFFh
Bank 0
Bank 1
Bank 2
Bank 14
Bank 15
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
Bank 3
through
Bank 13
0 0 1 1 1 1 1 1 1 1 1 1
7 0
BSR(1)
PIC18F2455/2550/4455/4550
DS39632E-page 68 © 2009 Microchip Technology Inc.
5.3.5 SPECIAL FUNCTION REGISTERS
The Special Function Registers (SFRs) are registers
used by the CPU and peripheral modules for controlling
the desired operation of the device. These registers are
implemented as static RAM in the data memory space.
SFRs start at the top of data memory and extend downward
to occupy the top segment of Bank 15, from F60h
to FFFh. A list of these registers is given in Table 5-1
and Table 5-2.
The SFRs can be classified into two sets: those
associated with the “core” device functionality (ALU,
Resets and interrupts) and those related to the
peripheral functions. The Reset and interrupt registers
are described in their respective chapters, while the
ALU’s STATUS register is described later in this
section. Registers related to the operation of a
peripheral feature are described in the chapter for that
peripheral.
The SFRs are typically distributed among the
peripherals whose functions they control. Unused SFR
locations are unimplemented and read as ‘0’s.
TABLE 5-1: SPECIAL FUNCTION REGISTER MAP
Address Name Address Name Address Name Address Name Address Name
FFFh TOSU FDFh INDF2(1) FBFh CCPR1H F9Fh IPR1 F7Fh UEP15
FFEh TOSH FDEh POSTINC2(1) FBEh CCPR1L F9Eh PIR1 F7Eh UEP14
FFDh TOSL FDDh POSTDEC2(1) FBDh CCP1CON F9Dh PIE1 F7Dh UEP13
FFCh STKPTR FDCh PREINC2(1) FBCh CCPR2H F9Ch —(2) F7Ch UEP12
FFBh PCLATU FDBh PLUSW2(1) FBBh CCPR2L F9Bh OSCTUNE F7Bh UEP11
FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah —(2) F7Ah UEP10
FF9h PCL FD9h FSR2L FB9h —(2) F99h —(2) F79h UEP9
FF8h TBLPTRU FD8h STATUS FB8h BAUDCON F98h —(2) F78h UEP8
FF7h TBLPTRH FD7h TMR0H FB7h ECCP1DEL F97h —(2) F77h UEP7
FF6h TBLPTRL FD6h TMR0L FB6h ECCP1AS F96h TRISE(3) F76h UEP6
FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD(3) F75h UEP5
FF4h PRODH FD4h —(2) FB4h CMCON F94h TRISC F74h UEP4
FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB F73h UEP3
FF2h INTCON FD2h HLVDCON FB2h TMR3L F92h TRISA F72h UEP2
FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h —(2) F71h UEP1
FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h —(2) F70h UEP0
FEFh INDF0(1) FCFh TMR1H FAFh SPBRG F8Fh —(2) F6Fh UCFG
FEEh POSTINC0(1) FCEh TMR1L FAEh RCREG F8Eh —(2) F6Eh UADDR
FEDh POSTDEC0(1) FCDh T1CON FADh TXREG F8Dh LATE(3) F6Dh UCON
FECh PREINC0(1) FCCh TMR2 FACh TXSTA F8Ch LATD(3) F6Ch USTAT
FEBh PLUSW0(1) FCBh PR2 FABh RCSTA F8Bh LATC F6Bh UEIE
FEAh FSR0H FCAh T2CON FAAh —(2) F8Ah LATB F6Ah UEIR
FE9h FSR0L FC9h SSPBUF FA9h EEADR F89h LATA F69h UIE
FE8h WREG FC8h SSPADD FA8h EEDATA F88h —(2) F68h UIR
FE7h INDF1(1) FC7h SSPSTAT FA7h EECON2(1) F87h —(2) F67h UFRMH
FE6h POSTINC1(1) FC6h SSPCON1 FA6h EECON1 F86h —(2) F66h UFRML
FE5h POSTDEC1(1) FC5h SSPCON2 FA5h —(2) F85h —(2) F65h SPPCON(3)
FE4h PREINC1(1) FC4h ADRESH FA4h —(2) F84h PORTE F64h SPPEPS(3)
FE3h PLUSW1(1) FC3h ADRESL FA3h —(2) F83h PORTD(3) F63h SPPCFG(3)
FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC F62h SPPDATA(3)
FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB F61h —(2)
FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA F60h —(2)
Note 1: Not a physical register.
2: Unimplemented registers are read as ‘0’.
3: These registers are implemented only on 40/44-pin devices.
© 2009 Microchip Technology Inc. DS39632E-page 69
PIC18F2455/2550/4455/4550
TABLE 5-2: REGISTER FILE SUMMARY
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details
on page
TOSU — — — Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000 53, 60
TOSH Top-of-Stack High Byte (TOS<15:8>) 0000 0000 53, 60
TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000 53, 60
STKPTR STKFUL STKUNF — SP4 SP3 SP2 SP1 SP0 00-0 0000 53, 61
PCLATU — — — Holding Register for PC<20:16> ---0 0000 53, 60
PCLATH Holding Register for PC<15:8> 0000 0000 53, 60
PCL PC Low Byte (PC<7:0>) 0000 0000 53, 60
TBLPTRU — — bit 21(1) Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 53, 84
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 53, 84
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 53, 84
TABLAT Program Memory Table Latch 0000 0000 53, 84
PRODH Product Register High Byte xxxx xxxx 53, 97
PRODL Product Register Low Byte xxxx xxxx 53, 97
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 53, 101
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 1111 -1-1 53, 102
INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00 53, 103
INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 53, 75
POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 53, 76
POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 53, 76
PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 53, 76
PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) –
value of FSR0 offset by W
N/A 53, 76
FSR0H — — — — Indirect Data Memory Address Pointer 0 High Byte ---- 0000 53, 75
FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx 53, 75
WREG Working Register xxxx xxxx 53
INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 53, 75
POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 53, 76
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 53, 76
PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 53, 76
PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) –
value of FSR1 offset by W
N/A 53, 76
FSR1H — — — — Indirect Data Memory Address Pointer 1 High Byte ---- 0000 53, 75
FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx 53, 75
BSR — — — — Bank Select Register ---- 0000 54, 65
INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 54, 75
POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 54, 76
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 54, 76
PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 54, 76
PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) –
value of FSR2 offset by W
N/A 54, 76
FSR2H — — — — Indirect Data Memory Address Pointer 2 High Byte ---- 0000 54, 75
FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx 54, 75
STATUS — — — N OV Z DC C ---x xxxx 54, 73
TMR0H Timer0 Register High Byte 0000 0000 54, 129
TMR0L Timer0 Register Low Byte xxxx xxxx 54, 129
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 54, 127
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’.
Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’.
3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
individual unimplemented bits should be interpreted as ‘-’.
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’.
5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’.
6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0).
7: I2C™ Slave mode only.
PIC18F2455/2550/4455/4550
DS39632E-page 70 © 2009 Microchip Technology Inc.
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0100 q000 54, 33
HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 0-00 0101 54, 285
WDTCON — — — — — — — SWDTEN --- ---0 54, 304
RCON IPEN SBOREN(2) — RI TO PD POR BOR 0q-1 11q0 54, 46
TMR1H Timer1 Register High Byte xxxx xxxx 54, 136
TMR1L Timer1 Register Low Byte xxxx xxxx 54, 136
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 54, 131
TMR2 Timer2 Register 0000 0000 54, 138
PR2 Timer2 Period Register 1111 1111 54, 138
T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 54, 137
SSPBUF MSSP Receive Buffer/Transmit Register xxxx xxxx 54, 198,
207
SSPADD MSSP Address Register in I2C™ Slave mode. MSSP Baud Rate Reload Register in I2C™ Master mode. 0000 0000 54, 207
SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 54, 198,
208
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 54, 199,
209
SSPCON2 GCEN ACKSTAT ACKDT/
ADMSK5(7)
ACKEN/
ADMSK4(7)
RCEN/
ADMSK3(7)
PEN/
ADMSK2(7)
RSEN/
ADMSK1(7)
SEN 0000 0000 54, 210
ADRESH A/D Result Register High Byte xxxx xxxx 54, 274
ADRESL A/D Result Register Low Byte xxxx xxxx 54, 274
ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 54, 265
ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0qqq 54, 266
ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 54, 267
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 55, 144
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 55, 144
CCP1CON P1M1(3) P1M0(3) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 55, 143,
151
CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx 55, 144
CCPR2L Capture/Compare/PWM Register 2 Low Byte xxxx xxxx 55, 144
CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 55, 143
BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 0100 0-00 55, 246
ECCP1DEL PRSEN PDC6(3) PDC5(3) PDC4(3) PDC3(3) PDC2(3) PDC1(3) PDC0(3) 0000 0000 55, 160
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(3) PSSBD0(3) 0000 0000 55, 161
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 0000 55, 281
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 55, 275
TMR3H Timer3 Register High Byte xxxx xxxx 55, 141
TMR3L Timer3 Register Low Byte xxxx xxxx 55, 141
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 55, 139
SPBRGH EUSART Baud Rate Generator Register High Byte 0000 0000 55, 247
SPBRG EUSART Baud Rate Generator Register Low Byte 0000 0000 55, 247
RCREG EUSART Receive Register 0000 0000 55, 256
TXREG EUSART Transmit Register 0000 0000 55, 253
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 55, 244
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 55, 245
TABLE 5-2: REGISTER FILE SUMMARY (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details
on page
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’.
Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’.
3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
individual unimplemented bits should be interpreted as ‘-’.
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’.
5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’.
6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0).
7: I2C™ Slave mode only.
© 2009 Microchip Technology Inc. DS39632E-page 71
PIC18F2455/2550/4455/4550
EEADR EEPROM Address Register 0000 0000 55, 91
EEDATA EEPROM Data Register 0000 0000 55, 91
EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000 55, 82
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 55, 83
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP 1111 1111 56, 109
PIR2 OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF 0000 0000 56, 105
PIE2 OSCFIE CMIE USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE 0000 0000 56, 107
IPR1 SPPIP(3) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 56, 108
PIR1 SPPIF(3) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 56, 104
PIE1 SPPIE(3) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 56, 106
OSCTUNE INTSRC — — TUN4 TUN3 TUN2 TUN1 TUN0 0--0 0000 56, 28
TRISE(3) — — — — — TRISE2 TRISE1 TRISE0 ---- -111 56, 126
TRISD(3) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 56, 124
TRISC TRISC7 TRISC6 — — — TRISC2 TRISC1 TRISC0 11-- -111 56, 121
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 56, 118
TRISA — TRISA6(4) TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 -111 1111 56, 115
LATE(3) — — — — — LATE2 LATE1 LATE0 ---- -xxx 56, 126
LATD(3) LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 xxxx xxxx 56, 124
LATC LATC7 LATC6 — — — LATC2 LATC1 LATC0 xx-- -xxx 56, 121
LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx xxxx 56, 118
LATA — LATA6(4) LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 -xxx xxxx 56, 115
PORTE RDPU(3) — — — RE3(5) RE2(3) RE1(3) RE0(3) 0--- x000 56, 125
PORTD(3) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 56, 124
PORTC RC7 RC6 RC5(6) RC4(6) — RC2 RC1 RC0 xxxx -xxx 56, 121
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 56, 118
PORTA — RA6(4) RA5 RA4 RA3 RA2 RA1 RA0 -x0x 0000 56, 115
UEP15 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP14 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP13 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP12 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP11 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP10 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP9 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP8 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP7 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP6 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP5 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP4 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP3 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP2 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP1 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
UEP0 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 57, 172
TABLE 5-2: REGISTER FILE SUMMARY (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details
on page
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’.
Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’.
3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
individual unimplemented bits should be interpreted as ‘-’.
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’.
5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’.
6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0).
7: I2C™ Slave mode only.
PIC18F2455/2550/4455/4550
DS39632E-page 72 © 2009 Microchip Technology Inc.
UCFG UTEYE UOEMON — UPUEN UTRDIS FSEN PPB1 PPB0 00-0 0000 57, 168
UADDR — ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 -000 0000 57, 173
UCON — PPBRST SE0 PKTDIS USBEN RESUME SUSPND — -0x0 000- 57, 166
USTAT — ENDP3 ENDP2 ENDP1 ENDP0 DIR PPBI — -xxx xxx- 57, 171
UEIE BTSEE — — BTOEE DFN8EE CRC16EE CRC5EE PIDEE 0--0 0000 57, 185
UEIR BTSEF — — BTOEF DFN8EF CRC16EF CRC5EF PIDEF 0--0 0000 57, 184
UIE — SOFIE STALLIE IDLEIE TRNIE ACTVIE UERRIE URSTIE -000 0000 57, 183
UIR — SOFIF STALLIF IDLEIF TRNIF ACTVIF UERRIF URSTIF -000 0000 57, 181
UFRMH — — — — — FRM10 FRM9 FRM8 ---- -xxx 57, 173
UFRML FRM7 FRM6 FRM5 FRM4 FRM3 FRM2 FRM1 FRM0 xxxx xxxx 57, 173
SPPCON(3) — — — — — — SPPOWN SPPEN ---- --00 57, 191
SPPEPS(3) RDSPP WRSPP — SPPBUSY ADDR3 ADDR2 ADDR1 ADDR0 00-0 0000 57, 195
SPPCFG(3) CLKCFG1 CLKCFG0 CSEN CLK1EN WS3 WS2 WS1 WS0 0000 0000 57, 192
SPPDATA(3) DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0 0000 0000 57, 196
TABLE 5-2: REGISTER FILE SUMMARY (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Details
on page
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’.
Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’.
3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
individual unimplemented bits should be interpreted as ‘-’.
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’.
5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’.
6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0).
7: I2C™ Slave mode only.
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5.3.6 STATUS REGISTER
The STATUS register, shown in Register 5-2, contains
the arithmetic status of the ALU. As with any other SFR,
it can be the operand for any instruction.
If the STATUS register is the destination for an instruction
that affects the Z, DC, C, OV or N bits, the results
of the instruction are not written; instead, the STATUS
register is updated according to the instruction
performed. Therefore, the result of an instruction with
the STATUS register as its destination may be different
than intended. As an example, CLRF STATUS will set
the Z bit and leave the remaining Status bits
unchanged (‘000u u1uu’).
It is recommended that only BCF, BSF, SWAPF, MOVFF
and MOVWF instructions are used to alter the STATUS
register because these instructions do not affect the Z,
C, DC, OV or N bits in the STATUS register.
For other instructions that do not affect Status bits, see
the instruction set summaries in Table 26-2 and
Table 26-3.
Note: The C and DC bits operate as the Borrow
and Digit Borrow bits, respectively, in
subtraction.
REGISTER 5-2: STATUS REGISTER
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
— — — N OV Z DC(1) C(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4 N: Negative bit
This bit is used for signed arithmetic (2’s complement). It indicates whether the result was negative
(ALU MSB = 1).
1 = Result was negative
0 = Result was positive
bit 3 OV: Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit magnitude
which causes the sign bit (bit 7 of the result) to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit(1)
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(2)
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register.
2: For Borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the
source register.
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5.4 Data Addressing Modes
While the program memory can be addressed in only
one way – through the program counter – information
in the data memory space can be addressed in several
ways. For most instructions, the addressing mode is
fixed. Other instructions may use up to three modes,
depending on which operands are used and whether or
not the extended instruction set is enabled.
The addressing modes are:
• Inherent
• Literal
• Direct
• Indirect
An additional addressing mode, Indexed Literal Offset,
is available when the extended instruction set is
enabled (XINST Configuration bit = 1). Its operation is
discussed in greater detail in Section 5.6.1 “Indexed
Addressing with Literal Offset”.
5.4.1 INHERENT AND LITERAL
ADDRESSING
Many PIC18 control instructions do not need any
argument at all; they either perform an operation that
globally affects the device or they operate implicitly on
one register. This addressing mode is known as
Inherent Addressing. Examples include SLEEP, RESET
and DAW.
Other instructions work in a similar way but require an
additional explicit argument in the opcode. This is
known as Literal Addressing mode because they
require some literal value as an argument. Examples
include ADDLW and MOVLW, which respectively, add or
move a literal value to the W register. Other examples
include CALL and GOTO, which include a 20-bit
program memory address.
5.4.2 DIRECT ADDRESSING
Direct Addressing mode specifies all or part of the
source and/or destination address of the operation
within the opcode itself. The options are specified by
the arguments accompanying the instruction.
In the core PIC18 instruction set, bit-oriented and
byte-oriented instructions use some version of Direct
Addressing by default. All of these instructions include
some 8-bit literal address as their Least Significant
Byte. This address specifies either a register address in
one of the banks of data RAM (Section 5.3.4 “General
Purpose Register File”) or a location in the Access
Bank (Section 5.3.3 “Access Bank”) as the data
source for the instruction.
The Access RAM bit ‘a’ determines how the address is
interpreted. When ‘a’ is ‘1’, the contents of the BSR
(Section 5.3.2 “Bank Select Register (BSR)”) are
used with the address to determine the complete 12-bit
address of the register. When ‘a’ is ‘0’, the address is
interpreted as being a register in the Access Bank.
Addressing that uses the Access RAM is sometimes
also known as Direct Forced Addressing mode.
A few instructions, such as MOVFF, include the entire
12-bit address (either source or destination) in their
opcodes. In these cases, the BSR is ignored entirely.
The destination of the operation’s results is determined
by the destination bit ‘d’. When ‘d’ is ‘1’, the results are
stored back in the source register, overwriting its original
contents. When ‘d’ is ‘0’, the results are stored in
the W register. Instructions without the ‘d’ argument
have a destination that is implicit in the instruction; their
destination is either the target register being operated
on or the W register.
5.4.3 INDIRECT ADDRESSING
Indirect Addressing allows the user to access a location
in data memory without giving a fixed address in the
instruction. This is done by using File Select Registers
(FSRs) as pointers to the locations to be read or written
to. Since the FSRs are themselves located in RAM as
Special Function Registers, they can also be directly
manipulated under program control. This makes FSRs
very useful in implementing data structures, such as
tables and arrays in data memory.
The registers for Indirect Addressing are also
implemented with Indirect File Operands (INDFs) that
permit automatic manipulation of the pointer value with
auto-incrementing, auto-decrementing or offsetting
with another value. This allows for efficient code, using
loops, such as the example of clearing an entire RAM
bank in Example 5-5.
EXAMPLE 5-5: HOW TO CLEAR RAM
(BANK 1) USING
INDIRECT ADDRESSING
Note: The execution of some instructions in the
core PIC18 instruction set are changed
when the PIC18 extended instruction
set is enabled. See Section 5.6 “Data
Memory and the Extended Instruction
Set” for more information.
LFSR FSR0, 100h ;
NEXT CLRF POSTINC0 ; Clear INDF
; register then
; inc pointer
BTFSS FSR0H, 1 ; All done with
; Bank1?
BRA NEXT ; NO, clear next
CONTINUE ; YES, continue
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5.4.3.1 FSR Registers and the
INDF Operand
At the core of Indirect Addressing are three sets of
registers: FSR0, FSR1 and FSR2. Each represents a
pair of 8-bit registers: FSRnH and FSRnL. The four
upper bits of the FSRnH register are not used, so each
FSR pair holds a 12-bit value. This represents a value
that can address the entire range of the data memory
in a linear fashion. The FSR register pairs, then, serve
as pointers to data memory locations.
Indirect Addressing is accomplished with a set of
Indirect File Operands, INDF0 through INDF2. These
can be thought of as “virtual” registers; they are
mapped in the SFR space but are not physically implemented.
Reading or writing to a particular INDF register
actually accesses its corresponding FSR register pair.
A read from INDF1, for example, reads the data at the
address indicated by FSR1H:FSR1L. Instructions that
use the INDF registers as operands actually use the
contents of their corresponding FSR as a pointer to the
instruction’s target. The INDF operand is just a
convenient way of using the pointer.
Because Indirect Addressing uses a full 12-bit address,
data RAM banking is not necessary. Thus, the current
contents of the BSR and the Access RAM bit have no
effect on determining the target address.
FIGURE 5-7: INDIRECT ADDRESSING
FSR1H:FSR1L
7 0
Data Memory
000h
100h
200h
300h
F00h
E00h
FFFh
Bank 0
Bank 1
Bank 2
Bank 14
Bank 15
Bank 3
through
Bank 13
ADDWF, INDF1, 1
7 0
Using an instruction with one of the
indirect addressing registers as the
operand....
...uses the 12-bit address stored in
the FSR pair associated with that
register....
...to determine the data memory
location to be used in that operation.
In this case, the FSR1 pair contains
ECCh. This means the contents of
location ECCh will be added to that
of the W register and stored back in
ECCh.
x x x x 1 1 1 0 1 1 0 0 1 1 0 0
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5.4.3.2 FSR Registers and POSTINC,
POSTDEC, PREINC and PLUSW
In addition to the INDF operand, each FSR register pair
also has four additional indirect operands. Like INDF,
these are “virtual” registers that cannot be indirectly
read or written to. Accessing these registers actually
accesses the associated FSR register pair, but also
performs a specific action on it stored value. They are:
• POSTDEC: accesses the FSR value, then
automatically decrements it by ‘1’ afterwards
• POSTINC: accesses the FSR value, then
automatically increments it by ‘1’ afterwards
• PREINC: increments the FSR value by ‘1’, then
uses it in the operation
• PLUSW: adds the signed value of the W register
(range of -127 to 128) to that of the FSR and uses
the new value in the operation.
In this context, accessing an INDF register uses the
value in the FSR registers without changing them. Similarly,
accessing a PLUSW register gives the FSR value
offset by that in the W register; neither value is actually
changed in the operation. Accessing the other virtual
registers changes the value of the FSR registers.
Operations on the FSRs with POSTDEC, POSTINC
and PREINC affect the entire register pair; that is,
rollovers of the FSRnL register, from FFh to 00h, carry
over to the FSRnH register. On the other hand, results
of these operations do not change the value of any
flags in the STATUS register (e.g., Z, N, OV, etc.).
The PLUSW register can be used to implement a form
of Indexed Addressing in the data memory space. By
manipulating the value in the W register, users can
reach addresses that are fixed offsets from pointer
addresses. In some applications, this can be used to
implement some powerful program control structure,
such as software stacks, inside of data memory.
5.4.3.3 Operations by FSRs on FSRs
Indirect Addressing operations that target other FSRs
or virtual registers represent special cases. For example,
using an FSR to point to one of the virtual registers
will not result in successful operations. As a specific
case, assume that FSR0H:FSR0L contains FE7h, the
address of INDF1. Attempts to read the value of INDF1,
using INDF0 as an operand, will return 00h. Attempts
to write to INDF1, using INDF0 as the operand, will
result in a NOP.
On the other hand, using the virtual registers to write to
an FSR pair may not occur as planned. In these cases,
the value will be written to the FSR pair but without any
incrementing or decrementing. Thus, writing to INDF2
or POSTDEC2 will write the same value to the
FSR2H:FSR2L.
Since the FSRs are physical registers mapped in the
SFR space, they can be manipulated through all direct
operations. Users should proceed cautiously when
working on these registers, particularly if their code
uses Indirect Addressing.
Similarly, operations by Indirect Addressing are generally
permitted on all other SFRs. Users should exercise
the appropriate caution that they do not inadvertently
change settings that might affect the operation of the
device.
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5.5 Program Memory and the
Extended Instruction Set
The operation of program memory is unaffected by the
use of the extended instruction set.
Enabling the extended instruction set adds eight
additional two-word commands to the existing
PIC18 instruction set: ADDFSR, ADDULNK, CALLW,
MOVSF, MOVSS, PUSHL, SUBFSR and SUBULNK. These
instructions are executed as described in
Section 5.2.4 “Two-Word Instructions”.
5.6 Data Memory and the Extended
Instruction Set
Enabling the PIC18 extended instruction set (XINST
Configuration bit = 1) significantly changes certain
aspects of data memory and its addressing.
Specifically, the use of the Access Bank for many of the
core PIC18 instructions is different. This is due to the
introduction of a new addressing mode for the data
memory space. This mode also alters the behavior of
Indirect Addressing using FSR2 and its associated
operands.
What does not change is just as important. The size of
the data memory space is unchanged, as well as its
linear addressing. The SFR map remains the same.
Core PIC18 instructions can still operate in both Direct
and Indirect Addressing mode; inherent and literal
instructions do not change at all. Indirect Addressing
with FSR0 and FSR1 also remains unchanged.
5.6.1 INDEXED ADDRESSING WITH
LITERAL OFFSET
Enabling the PIC18 extended instruction set changes
the behavior of Indirect Addressing using the FSR2
register pair and its associated file operands. Under the
proper conditions, instructions that use the Access
Bank – that is, most bit-oriented and byte-oriented
instructions – can invoke a form of Indexed Addressing
using an offset specified in the instruction. This special
addressing mode is known as Indexed Addressing with
Literal Offset or Indexed Literal Offset mode.
When using the extended instruction set, this
addressing mode requires the following:
• The use of the Access Bank is forced (‘a’ = 0);
and
• The file address argument is less than or equal
to 5Fh.
Under these conditions, the file address of the instruction
is not interpreted as the lower byte of an address
(used with the BSR in Direct Addressing), or as an 8-bit
address in the Access Bank. Instead, the value is
interpreted as an offset value to an Address Pointer
specified by FSR2. The offset and the contents of
FSR2 are added to obtain the target address of the
operation.
5.6.2 INSTRUCTIONS AFFECTED BY
INDEXED LITERAL OFFSET MODE
Any of the core PIC18 instructions that can use Direct
Addressing are potentially affected by the Indexed
Literal Offset Addressing mode. This includes all
byte-oriented and bit-oriented instructions, or almost
one-half of the standard PIC18 instruction set. Instructions
that only use Inherent or Literal Addressing
modes are unaffected.
Additionally, byte-oriented and bit-oriented instructions
are not affected if they do not use the Access Bank
(Access RAM bit is ‘1’) or include a file address of 60h
or above. Instructions meeting these criteria will
continue to execute as before. A comparison of the
different possible addressing modes when the
extended instruction set is enabled in shown in
Figure 5-8.
Those who desire to use byte-oriented or bit-oriented
instructions in the Indexed Literal Offset mode should
note the changes to assembler syntax for this mode.
This is described in more detail in Section 26.2.1
“Extended Instruction Syntax”.
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FIGURE 5-8: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND
BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)
EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)
When a = 0 and f ≥ 60h:
The instruction executes in
Direct Forced mode. ‘f’ is interpreted
as a location in the
Access RAM between 060h
and 0FFh. This is the same as
the SFRs or locations F60h to
0FFh (Bank 15) of data
memory.
Locations below 60h are not
available in this addressing
mode.
When a = 0 and f ≤ 5Fh:
The instruction executes in
Indexed Literal Offset mode. ‘f’
is interpreted as an offset to the
address value in FSR2. The
two are added together to
obtain the address of the target
register for the instruction. The
address can be anywhere in
the data memory space.
Note that in this mode, the
correct syntax is now:
ADDWF [k], d
where ‘k’ is the same as ‘f’.
When a = 1 (all values of f):
The instruction executes in
Direct mode (also known as
Direct Long mode). ‘f’ is interpreted
as a location in one of
the 16 banks of the data
memory space. The bank is
designated by the Bank Select
Register (BSR). The address
can be in any implemented
bank in the data memory
space.
000h
060h
100h
F00h
F60h
FFFh
Valid range
00h
60h
FFh
Data Memory
Access RAM
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
000h
080h
100h
F00h
F60h
FFFh
Data Memory
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
FSR2H FSR2L
001001da ffffffff
001001da ffffffff
000h
080h
100h
F00h
F60h
FFFh
Data Memory
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
for ‘f’
BSR
00000000
080h
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5.6.3 MAPPING THE ACCESS BANK IN
INDEXED LITERAL OFFSET MODE
The use of Indexed Literal Offset Addressing mode
effectively changes how the lower portion of Access
RAM (00h to 5Fh) is mapped. Rather than containing
just the contents of the bottom half of Bank 0, this mode
maps the contents from Bank 0 and a user-defined
“window” that can be located anywhere in the data
memory space. The value of FSR2 establishes the
lower boundary of the addresses mapped into the
window, while the upper boundary is defined by FSR2
plus 95 (5Fh). Addresses in the Access RAM above
5Fh are mapped as previously described (see
Section 5.3.3 “Access Bank”). An example of Access
Bank remapping in this addressing mode is shown in
Figure 5-9.
Remapping of the Access Bank applies only to operations
using the Indexed Literal Offset mode. Operations
that use the BSR (Access RAM bit is ‘1’) will continue
to use Direct Addressing as before. Any indirect or
indexed operation that explicitly uses any of the indirect
file operands (including FSR2) will continue to operate
as standard Indirect Addressing. Any instruction that
uses the Access Bank, but includes a register address
of greater than 05Fh, will use Direct Addressing and
the normal Access Bank map.
5.6.4 BSR IN INDEXED LITERAL
OFFSET MODE
Although the Access Bank is remapped when the
extended instruction set is enabled, the operation of the
BSR remains unchanged. Direct Addressing, using the
BSR to select the data memory bank, operates in the
same manner as previously described.
FIGURE 5-9: REMAPPING THE ACCESS BANK WITH INDEXED LITERAL
OFFSET ADDRESSING
Data Memory
000h
100h
200h
F60h
F00h
FFFh
Bank 1
Bank 15
Bank 2
through
Bank 14
SFRs
ADDWF f, d, a
FSR2H:FSR2L = 120h
Locations in the region
from the FSR2 Pointer
(120h) to the pointer plus
05Fh (17Fh) are mapped
to the bottom of the
Access RAM (000h-05Fh).
Special Function Registers
at F60h through FFFh are
mapped to 60h through
FFh as usual.
Bank 0 addresses below
5Fh are not available in
this mode. They can still
be addressed by using the
BSR.
Access Bank
00h
60h
FFh
Bank 0
SFRs
Bank 1 “Window”
Window
Example Situation:
120h
17Fh
5Fh
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NOTES:
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6.0 FLASH PROGRAM MEMORY
The Flash program memory is readable, writable and
erasable, during normal operation over the entire VDD
range.
A read from program memory is executed on one byte
at a time. A write to program memory is executed on
blocks of 32 bytes at a time. Program memory is
erased in blocks of 64 bytes at a time. A Bulk Erase
operation may not be issued from user code.
Writing or erasing program memory will cease
instruction fetches until the operation is complete. The
program memory cannot be accessed during the write
or erase, therefore, code cannot execute. An internal
programming timer terminates program memory writes
and erases.
A value written to program memory does not need to be
a valid instruction. Executing a program memory
location that forms an invalid instruction results in a
NOP.
6.1 Table Reads and Table Writes
In order to read and write program memory, there are
two operations that allow the processor to move bytes
between the program memory space and the data RAM:
• Table Read (TBLRD)
• Table Write (TBLWT)
The program memory space is 16 bits wide, while the
data RAM space is 8 bits wide. Table reads and table
writes move data between these two memory spaces
through an 8-bit register (TABLAT).
Table read operations retrieve data from program
memory and place it into the data RAM space.
Figure 6-1 shows the operation of a table read with
program memory and data RAM.
Table write operations store data from the data memory
space into holding registers in program memory. The
procedure to write the contents of the holding registers
into program memory is detailed in Section 6.5 “Writing
to Flash Program Memory”. Figure 6-2 shows the
operation of a table write with program memory and data
RAM.
Table operations work with byte entities. A table block
containing data, rather than program instructions, is not
required to be word-aligned. Therefore, a table block can
start and end at any byte address. If a table write is being
used to write executable code into program memory,
program instructions will need to be word-aligned.
FIGURE 6-1: TABLE READ OPERATION
Table Pointer(1)
Table Latch (8-bit)
Program Memory
TBLPTRH TBLPTRL
TABLAT
TBLPTRU
Instruction: TBLRD*
Note 1: Table Pointer register points to a byte in program memory.
Program Memory
(TBLPTR)
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FIGURE 6-2: TABLE WRITE OPERATION
6.2 Control Registers
Several control registers are used in conjunction with
the TBLRD and TBLWT instructions. These include the:
• EECON1 register
• EECON2 register
• TABLAT register
• TBLPTR registers
6.2.1 EECON1 AND EECON2 REGISTERS
The EECON1 register (Register 6-1) is the control
register for memory accesses. The EECON2 register is
not a physical register; it is used exclusively in the
memory write and erase sequences. Reading
EECON2 will read all ‘0’s.
The EEPGD control bit determines if the access will be
a program or data EEPROM memory access. When
clear, any subsequent operations will operate on the
data EEPROM memory. When set, any subsequent
operations will operate on the program memory.
The CFGS control bit determines if the access will be
to the Configuration/Calibration registers or to program
memory/data EEPROM memory. When set,
subsequent operations will operate on Configuration
registers regardless of EEPGD (see Section 25.0
“Special Features of the CPU”). When clear, memory
selection access is determined by EEPGD.
The FREE bit, when set, will allow a program memory
erase operation. When FREE is set, the erase
operation is initiated on the next WR command. When
FREE is clear, only writes are enabled.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set in hardware when the WREN bit is set and cleared
when the internal programming timer expires and the
write operation is complete.
The WR control bit initiates write operations. The bit
cannot be cleared, only set, in software; it is cleared in
hardware at the completion of the write operation.
Table Pointer(1) Table Latch (8-bit)
TBLPTRH TBLPTRL TABLAT
Program Memory
(TBLPTR)
TBLPTRU
Instruction: TBLWT*
Note 1: Table Pointer actually points to one of 32 holding registers, the address of which is determined by
TBLPTRL<4:0>. The process for physically writing data to the program memory array is discussed in
Section 6.5 “Writing to Flash Program Memory”.
Holding Registers
Program Memory
Note: During normal operation, the WRERR is
read as ‘1’. This can indicate that a write
operation was prematurely terminated by
a Reset or a write operation was
attempted improperly.
Note: The EEIF interrupt flag bit (PIR2<4>) is set
when the write is complete. It must be
cleared in software.
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REGISTER 6-1: EECON1: DATA EEPROM CONTROL REGISTER 1
R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD CFGS — FREE WRERR(1) WREN WR RD
bit 7 bit 0
Legend: S = Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit
1 = Access Flash program memory
0 = Access data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Access Configuration registers
0 = Access Flash program or data EEPROM memory
bit 5 Unimplemented: Read as ‘0’
bit 4 FREE: Flash Row Erase Enable bit
1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by
completion of erase operation)
0 = Perform write-only
bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit(1)
1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation or an improper write attempt)
0 = The write operation completed
bit 2 WREN: Flash Program/Data EEPROM Write Enable bit
1 = Allows write cycles to Flash program/data EEPROM
0 = Inhibits write cycles to Flash program/data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle
(The operation is self-timed and the bit is cleared by hardware once write is complete.
The WR bit can only be set (not cleared) in software.)
0 = Write cycle to the EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only
be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.)
0 = Does not initiate an EEPROM read
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error
condition.
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6.2.2 TABLE LATCH REGISTER (TABLAT)
The Table Latch (TABLAT) is an 8-bit register mapped
into the SFR space. The Table Latch register is used to
hold 8-bit data during data transfers between program
memory and data RAM.
6.2.3 TABLE POINTER REGISTER
(TBLPTR)
The Table Pointer (TBLPTR) register addresses a byte
within the program memory. The TBLPTR is comprised
of three SFR registers: Table Pointer Upper Byte, Table
Pointer High Byte and Table Pointer Low Byte
(TBLPTRU:TBLPTRH:TBLPTRL). These three registers
join to form a 22-bit wide pointer. The low-order
21 bits allow the device to address up to 2 Mbytes of
program memory space. The 22nd bit allows access to
the Device ID, the user ID and the Configuration bits.
The Table Pointer, TBLPTR, is used by the TBLRD and
TBLWT instructions. These instructions can update the
TBLPTR in one of four ways based on the table operation.
These operations are shown in Table 6-1. These
operations on the TBLPTR only affect the low-order
21 bits.
6.2.4 TABLE POINTER BOUNDARIES
TBLPTR is used in reads, writes and erases of the
Flash program memory.
When a TBLRD is executed, all 22 bits of the TBLPTR
determine which byte is read from program memory
into TABLAT.
When a TBLWT is executed, the five LSbs of the Table
Pointer register (TBLPTR<4:0>) determine which of
the 32 program memory holding registers is written to.
When the timed write to program memory begins (via
the WR bit), the 16 MSbs of the TBLPTR
(TBLPTR<21:6>) determine which program memory
block of 32 bytes is written to. For more detail, see
Section 6.5 “Writing to Flash Program Memory”.
When an erase of program memory is executed, the
16 MSbs of the Table Pointer register (TBLPTR<21:6>)
point to the 64-byte block that will be erased. The Least
Significant bits (TBLPTR<5:0>) are ignored.
Figure 6-3 describes the relevant boundaries of the
TBLPTR based on Flash program memory operations.
TABLE 6-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS
FIGURE 6-3: TABLE POINTER BOUNDARIES BASED ON OPERATION
Example Operation on Table Pointer
TBLRD*
TBLWT*
TBLPTR is not modified
TBLRD*+
TBLWT*+
TBLPTR is incremented after the read/write
TBLRD*-
TBLWT*-
TBLPTR is decremented after the read/write
TBLRD+*
TBLWT+*
TBLPTR is incremented before the read/write
21 16 15 8 7 0
TABLE ERASE
TABLE READ – TBLPTR<21:0>
TBLPTRU TBLPTRH TBLPTRL
TBLPTR<21:6>
TABLE WRITE – TBLPTR<21:5>
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6.3 Reading the Flash Program
Memory
The TBLRD instruction is used to retrieve data from
program memory and places it into data RAM. Table
reads from program memory are performed one byte at
a time.
TBLPTR points to a byte address in program space.
Executing TBLRD places the byte pointed to into
TABLAT. In addition, TBLPTR can be modified
automatically for the next table read operation.
The internal program memory is typically organized by
words. The Least Significant bit of the address selects
between the high and low bytes of the word. Figure 6-4
shows the interface between the internal program
memory and the TABLAT.
FIGURE 6-4: READS FROM FLASH PROGRAM MEMORY
EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD
(Even Byte Address)
Program Memory
(Odd Byte Address)
TBLRD TABLAT
TBLPTR = xxxxx1
FETCH Instruction Register
(IR) Read Register
TBLPTR = xxxxx0
MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base
MOVWF TBLPTRU ; address of the word
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
READ_WORD
TBLRD*+ ; read into TABLAT and increment
MOVF TABLAT, W ; get data
MOVWF WORD_EVEN
TBLRD*+ ; read into TABLAT and increment
MOVF TABLAT, W ; get data
MOVF WORD_ODD
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6.4 Erasing Flash Program Memory
The minimum erase block is 32 words or 64 bytes. Only
through the use of an external programmer, or through
ICSP control, can larger blocks of program memory be
Bulk Erased. Word Erase in the Flash array is not
supported.
When initiating an erase sequence from the microcontroller
itself, a block of 64 bytes of program memory
is erased. The Most Significant 16 bits of the
TBLPTR<21:6> point to the block being erased.
TBLPTR<5:0> are ignored.
The EECON1 register commands the erase operation.
The EEPGD bit must be set to point to the Flash
program memory. The WREN bit must be set to enable
write operations. The FREE bit is set to select an erase
operation.
For protection, the write initiate sequence for EECON2
must be used.
A long write is necessary for erasing the internal Flash.
Instruction execution is halted while in a long write
cycle. The long write will be terminated by the internal
programming timer.
6.4.1 FLASH PROGRAM MEMORY
ERASE SEQUENCE
The sequence of events for erasing a block of internal
program memory is:
1. Load Table Pointer register with address of row
being erased.
2. Set the EECON1 register for the erase operation:
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program memory;
• set WREN bit to enable writes;
• set FREE bit to enable the erase.
3. Disable interrupts.
4. Write 55h to EECON2.
5. Write 0AAh to EECON2.
6. Set the WR bit. This will begin the Row Erase
cycle.
7. The CPU will stall for duration of the erase
(about 2 ms using internal timer).
8. Re-enable interrupts.
EXAMPLE 6-2: ERASING A FLASH PROGRAM MEMORY ROW
MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
ERASE_ROW
BSF EECON1, EEPGD ; point to Flash program memory
BCF EECON1, CFGS ; access Flash program memory
BSF EECON1, WREN ; enable write to memory
BSF EECON1, FREE ; enable Row Erase operation
BCF INTCON, GIE ; disable interrupts
Required MOVLW 55h
Sequence MOVWF EECON2 ; write 55h
MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start erase (CPU stall)
BSF INTCON, GIE ; re-enable interrupts
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6.5 Writing to Flash Program Memory
The minimum programming block is 16 words or
32 bytes. Word or byte programming is not supported.
Table writes are used internally to load the holding
registers needed to program the Flash memory. There
are 32 holding registers used by the table writes for
programming.
Since the Table Latch (TABLAT) is only a single byte, the
TBLWT instruction may need to be executed 32 times for
each programming operation. All of the table write operations
will essentially be short writes because only the
holding registers are written. At the end of updating the
32 holding registers, the EECON1 register must be
written to in order to start the programming operation
with a long write.
The long write is necessary for programming the
internal Flash. Instruction execution is halted while in a
long write cycle. The long write will be terminated by
the internal programming timer.
The EEPROM on-chip timer controls the write time.
The write/erase voltages are generated by an on-chip
charge pump, rated to operate over the voltage range
of the device.
FIGURE 6-5: TABLE WRITES TO FLASH PROGRAM MEMORY
6.5.1 FLASH PROGRAM MEMORY WRITE
SEQUENCE
The sequence of events for programming an internal
program memory location should be:
1. Read 64 bytes into RAM.
2. Update data values in RAM as necessary.
3. Load Table Pointer register with address being
erased.
4. Execute the Row Erase procedure.
5. Load Table Pointer register with address of first
byte being written.
6. Write 32 bytes into the holding registers with
auto-increment.
7. Set the EECON1 register for the write operation:
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program memory;
• set WREN to enable byte writes.
8. Disable interrupts.
9. Write 55h to EECON2.
10. Write 0AAh to EECON2.
11. Set the WR bit. This will begin the write cycle.
12. The CPU will stall for duration of the write (about
2 ms using internal timer).
13. Re-enable interrupts.
14. Repeat steps 6 through 14 once more to write
64 bytes.
15. Verify the memory (table read).
This procedure will require about 8 ms to update one
row of 64 bytes of memory. An example of the required
code is given in Example 6-3.
Note: The default value of the holding registers on
device Resets and after write operations is
FFh. A write of FFh to a holding register
does not modify that byte. This means that
individual bytes of program memory may be
modified, provided that the change does not
attempt to change any bit from a ‘0’ to a ‘1’.
When modifying individual bytes, it is not
necessary to load all 32 holding registers
before executing a write operation.
TBLPTR = xxxx00 TBLPTR = xxxx01 TBLPTR = xxxx02 TBLPTR = xxxx1F
Program Memory
Holding Register Holding Register Holding Register Holding Register
8 8 8 8
TABLAT
Write Register
Note: Before setting the WR bit, the Table
Pointer address needs to be within the
intended address range of the 32 bytes in
the holding register.
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EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY
MOVLW D'64’ ; number of bytes in erase block
MOVWF COUNTER
MOVLW BUFFER_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW BUFFER_ADDR_LOW
MOVWF FSR0L
MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
READ_BLOCK
TBLRD*+ ; read into TABLAT, and inc
MOVF TABLAT, W ; get data
MOVWF POSTINC0 ; store data
DECFSZ COUNTER ; done?
BRA READ_BLOCK ; repeat
MODIFY_WORD
MOVLW DATA_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW DATA_ADDR_LOW
MOVWF FSR0L
MOVLW NEW_DATA_LOW ; update buffer word
MOVWF POSTINC0
MOVLW NEW_DATA_HIGH
MOVWF INDF0
ERASE_BLOCK
MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
BSF EECON1, EEPGD ; point to Flash program memory
BCF EECON1, CFGS ; access Flash program memory
BSF EECON1, WREN ; enable write to memory
BSF EECON1, FREE ; enable Row Erase operation
BCF INTCON, GIE ; disable interrupts
MOVLW 55h
Required MOVWF EECON2 ; write 55h
Sequence MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start erase (CPU stall)
BSF INTCON, GIE ; re-enable interrupts
TBLRD*- ; dummy read decrement
MOVLW BUFFER_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW BUFFER_ADDR_LOW
MOVWF FSR0L
MOVLW D’2’
MOVWF COUNTER1
WRITE_BUFFER_BACK
MOVLW D’32’ ; number of bytes in holding register
MOVWF COUNTER
WRITE_BYTE_TO_HREGS
MOVF POSTINC0, W ; get low byte of buffer data
MOVWF TABLAT ; present data to table latch
TBLWT+* ; write data, perform a short write
; to internal TBLWT holding register.
DECFSZ COUNTER ; loop until buffers are full
BRA WRITE_WORD_TO_HREGS
© 2009 Microchip Technology Inc. DS39632E-page 89
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EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED)
6.5.2 WRITE VERIFY
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
6.5.3 UNEXPECTED TERMINATION OF
WRITE OPERATION
If a write is terminated by an unplanned event, such as
loss of power or an unexpected Reset, the memory
location just programmed should be verified and reprogrammed
if needed. If the write operation is interrupted
by a MCLR Reset or a WDT Time-out Reset during
normal operation, the user can check the WRERR bit
and rewrite the location(s) as needed.
6.5.4 PROTECTION AGAINST SPURIOUS
WRITES
To protect against spurious writes to Flash program
memory, the write initiate sequence must also be
followed. See Section 25.0 “Special Features of the
CPU” for more detail.
6.6 Flash Program Operation During
Code Protection
See Section 25.5 “Program Verification and Code
Protection” for details on code protection of Flash
program memory.
TABLE 6-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY
PROGRAM_MEMORY
BSF EECON1, EEPGD ; point to Flash program memory
BCF EECON1, CFGS ; access Flash program memory
BSF EECON1, WREN ; enable write to memory
BCF INTCON, GIE ; disable interrupts
MOVLW 55h
Required MOVWF EECON2 ; write 55h
Sequence MOVLW 0AAh
MOVWF EECON2 ; write 0AAh
BSF EECON1, WR ; start program (CPU stall)
DECFSZ COUNTER1
BRA WRITE_BUFFER_BACK
BSF INTCON, GIE ; re-enable interrupts
BCF EECON1, WREN ; disable write to memory
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
TBLPTRU — — bit 21(1) Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) 53
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 53
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 53
TABLAT Program Memory Table Latch 53
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 53
EECON2 EEPROM Control Register 2 (not a physical register) 55
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 55
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP 56
PIR2 OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF 56
PIE2 OSCFIE CMIE USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE 56
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.
Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
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NOTES:
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7.0 DATA EEPROM MEMORY
The data EEPROM is a nonvolatile memory array,
separate from the data RAM and program memory, that
is used for long-term storage of program data. It is not
directly mapped in either the register file or program
memory space, but is indirectly addressed through the
Special Function Registers (SFRs). The EEPROM is
readable and writable during normal operation over the
entire VDD range.
Four SFRs are used to read and write to the data
EEPROM as well as the program memory. They are:
• EECON1
• EECON2
• EEDATA
• EEADR
The data EEPROM allows byte read and write. When
interfacing to the data memory block, EEDATA holds
the 8-bit data for read/write and the EEADR register
holds the address of the EEPROM location being
accessed.
The EEPROM data memory is rated for high erase/write
cycle endurance. A byte write automatically erases the
location and writes the new data (erase-before-write).
The write time is controlled by an on-chip timer; it will
vary with voltage and temperature as well as from chip
to chip. Please refer to parameter D122 (Table 28-1 in
Section 28.0 “Electrical Characteristics”) for exact
limits.
7.1 EECON1 and EECON2 Registers
Access to the data EEPROM is controlled by two
registers: EECON1 and EECON2. These are the same
registers which control access to the program memory
and are used in a similar manner for the data
EEPROM.
The EECON1 register (Register 7-1) is the control
register for data and program memory access. Control
bit, EEPGD, determines if the access will be to program
or data EEPROM memory. When clear, operations will
access the data EEPROM memory. When set, program
memory is accessed.
Control bit, CFGS, determines if the access will be to
the Configuration registers or to program memory/data
EEPROM memory. When set, subsequent operations
access Configuration registers. When CFGS is clear,
the EEPGD bit selects either Flash program or data
EEPROM memory.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set in hardware when the WREN bit is set and cleared
when the internal programming timer expires and the
write operation is complete.
The WR control bit initiates write operations. The bit
cannot be cleared, only set, in software; it is cleared in
hardware at the completion of the write operation.
Control bits, RD and WR, start read and erase/write
operations, respectively. These bits are set by firmware
and cleared by hardware at the completion of the
operation.
The RD bit cannot be set when accessing program
memory (EEPGD = 1). Program memory is read using
table read instructions. See Section 6.1 “Table Reads
and Table Writes” regarding table reads.
The EECON2 register is not a physical register. It is
used exclusively in the memory write and erase
sequences. Reading EECON2 will read all ‘0’s.
Note: During normal operation, the WRERR is
read as ‘1’. This can indicate that a write
operation was prematurely terminated by
a Reset or a write operation was
attempted improperly.
Note: The EEIF interrupt flag bit (PIR2<4>) is set
when the write is complete. It must be
cleared in software.
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REGISTER 7-1: EECON1: DATA EEPROM CONTROL REGISTER 1
R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD CFGS — FREE WRERR(1) WREN WR RD
bit 7 bit 0
Legend: S = Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit
1 = Access Flash program memory
0 = Access data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Access Configuration registers
0 = Access Flash program or data EEPROM memory
bit 5 Unimplemented: Read as ‘0’
bit 4 FREE: Flash Row Erase Enable bit
1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by
completion of erase operation)
0 = Perform write-only
bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit(1)
1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation or an improper write attempt)
0 = The write operation completed
bit 2 WREN: Flash Program/Data EEPROM Write Enable bit
1 = Allows write cycles to Flash program/data EEPROM
0 = Inhibits write cycles to Flash program/data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle
(The operation is self-timed and the bit is cleared by hardware once write is complete.
The WR bit can only be set (not cleared) in software.)
0 = Write cycle to the EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only
be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.)
0 = Does not initiate an EEPROM read
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error
condition.
© 2009 Microchip Technology Inc. DS39632E-page 93
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7.2 Reading the Data EEPROM
Memory
To read a data memory location, the user must write the
address to the EEADR register, clear the EEPGD
control bit (EECON1<7>) and then set control bit, RD
(EECON1<0>). The data is available on the very next
instruction cycle; therefore, the EEDATA register can
be read by the next instruction. EEDATA will hold this
value until another read operation or until it is written to
by the user (during a write operation).
The basic process is shown in Example 7-1.
7.3 Writing to the Data EEPROM
Memory
To write an EEPROM data location, the address must
first be written to the EEADR register and the data
written to the EEDATA register. The sequence in
Example 7-2 must be followed to initiate the write cycle.
The write will not begin if this sequence is not exactly
followed (write 55h to EECON2, write 0AAh to
EECON2, then set WR bit) for each byte. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in EECON1 must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM due to unexpected code execution
(i.e., runaway programs). The WREN bit should
be kept clear at all times except when updating the
EEPROM. The WREN bit is not cleared by hardware.
After a write sequence has been initiated, EECON1,
EEADR and EEDATA cannot be modified. The WR bit
will be inhibited from being set unless the WREN bit is
set. The WREN bit must be set on a previous instruction.
Both WR and WREN cannot be set with the same
instruction.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EEPROM Interrupt Flag bit
(EEIF) is set. The user may either enable this interrupt,
or poll this bit. EEIF must be cleared by software.
7.4 Write Verify
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
EXAMPLE 7-1: DATA EEPROM READ
EXAMPLE 7-2: DATA EEPROM WRITE
MOVLW DATA_EE_ADDR ;
MOVWF EEADR ; Lower bits of Data Memory Address to read
BCF EECON1, EEPGD ; Point to DATA memory
BCF EECON1, CFGS ; Access EEPROM
BSF EECON1, RD ; EEPROM Read
MOVF EEDATA, W ; W = EEDATA
MOVLW DATA_EE_ADDR ;
MOVWF EEADR ; Lower bits of Data Memory Address to write
MOVLW DATA_EE_DATA ;
MOVWF EEDATA ; Data Memory Value to write
BCF EECON1, EEPGD ; Point to DATA memory
BCF EECON1, CFGS ; Access EEPROM
BSF EECON1, WREN ; Enable writes
BCF INTCON, GIE ; Disable Interrupts
MOVLW 55h ;
Required MOVWF EECON2 ; Write 55h
Sequence MOVLW 0AAh ;
MOVWF EECON2 ; Write 0AAh
BSF EECON1, WR ; Set WR bit to begin write
BSF INTCON, GIE ; Enable Interrupts
; User code execution
BCF EECON1, WREN ; Disable writes on write complete (EEIF set)
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7.5 Operation During Code-Protect
Data EEPROM memory has its own code-protect bits in
Configuration Words. External read and write
operations are disabled if code protection is enabled.
The microcontroller itself can both read and write to the
internal data EEPROM regardless of the state of the
code-protect Configuration bit. Refer to Section 25.0
“Special Features of the CPU” for additional
information.
7.6 Protection Against Spurious Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been implemented. On power-up, the WREN bit is
cleared. In addition, writes to the EEPROM are blocked
during the Power-up Timer period (TPWRT,
parameter 33, Table 28-12).
The write initiate sequence and the WREN bit together
help prevent an accidental write during brown-out,
power glitch or software malfunction.
7.7 Using the Data EEPROM
The data EEPROM is a high-endurance, byteaddressable
array that has been optimized for the
storage of frequently changing information (e.g.,
program variables or other data that are updated
often). Frequently changing values will typically be
updated more often than specification D124 or D124A.
If this is not the case, an array refresh must be
performed. For this reason, variables that change
infrequently (such as constants, IDs, calibration, etc.)
should be stored in Flash program memory.
A simple data EEPROM refresh routine is shown in
Example 7-3.
EXAMPLE 7-3: DATA EEPROM REFRESH ROUTINE
Note: If data EEPROM is only used to store
constants and/or data that changes rarely,
an array refresh is likely not required. See
specification D124 or D124A.
CLRF EEADR ; Start at address 0
BCF EECON1, CFGS ; Set for memory
BCF EECON1, EEPGD ; Set for Data EEPROM
BCF INTCON, GIE ; Disable interrupts
BSF EECON1, WREN ; Enable writes
Loop ; Loop to refresh array
BSF EECON1, RD ; Read current address
MOVLW 55h ;
Required MOVWF EECON2 ; Write 55h
Sequence MOVLW 0AAh ;
MOVWF EECON2 ; Write 0AAh
BSF EECON1, WR ; Set WR bit to begin write
BTFSC EECON1, WR ; Wait for write to complete
BRA $-2
INCFSZ EEADR, F ; Increment address
BRA LOOP ; Not zero, do it again
BCF EECON1, WREN ; Disable writes
BSF INTCON, GIE ; Enable interrupts
© 2009 Microchip Technology Inc. DS39632E-page 95
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TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 53
EEADR EEPROM Address Register 55
EEDATA EEPROM Data Register 55
EECON2 EEPROM Control Register 2 (not a physical register) 55
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 55
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP 56
PIR2 OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF 56
PIE2 OSCFIE CMIE USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE 56
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.
PIC18F2455/2550/4455/4550
DS39632E-page 96 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS39632E-page 97
PIC18F2455/2550/4455/4550
8.0 8 x 8 HARDWARE MULTIPLIER
8.1 Introduction
All PIC18 devices include an 8 x 8 hardware multiplier
as part of the ALU. The multiplier performs an unsigned
operation and yields a 16-bit result that is stored in the
product register pair, PRODH:PRODL. The multiplier’s
operation does not affect any flags in the STATUS
register.
Making multiplication a hardware operation allows it to
be completed in a single instruction cycle. This has the
advantages of higher computational throughput and
reduced code size for multiplication algorithms and
allows the PIC18 devices to be used in many applications
previously reserved for digital signal processors.
A comparison of various hardware and software
multiply operations, along with the savings in memory
and execution time, is shown in Table 8-1.
8.2 Operation
Example 8-1 shows the instruction sequence for an
8 x 8 unsigned multiplication. Only one instruction is
required when one of the arguments is already loaded
in the WREG register.
Example 8-2 shows the sequence to do an 8 x 8 signed
multiplication. To account for the sign bits of the
arguments, each argument’s Most Significant bit (MSb)
is tested and the appropriate subtractions are done.
EXAMPLE 8-1: 8 x 8 UNSIGNED
MULTIPLY ROUTINE
EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY
ROUTINE
TABLE 8-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS
MOVF ARG1, W ;
MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL
MOVF ARG1, W
MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL
BTFSC ARG2, SB ; Test Sign Bit
SUBWF PRODH, F ; PRODH = PRODH
; - ARG1
MOVF ARG2, W
BTFSC ARG1, SB ; Test Sign Bit
SUBWF PRODH, F ; PRODH = PRODH
; - ARG2
Routine Multiply Method
Program
Memory
(Words)
Cycles
(Max)
Time
@ 40 MHz @ 10 MHz @ 4 MHz
8 x 8 unsigned
Without hardware multiply 13 69 6.9 μs 27.6 μs 69 μs
Hardware multiply 1 1 100 ns 400 ns 1 μs
8 x 8 signed
Without hardware multiply 33 91 9.1 μs 36.4 μs 91 μs
Hardware multiply 6 6 600 ns 2.4 μs 6 μs
16 x 16 unsigned
Without hardware multiply 21 242 24.2 μs 96.8 μs 242 μs
Hardware multiply 28 28 2.8 μs 11.2 μs 28 μs
16 x 16 signed
Without hardware multiply 52 254 25.4 μs 102.6 μs 254 μs
Hardware multiply 35 40 4.0 μs 16.0 μs 40 μs
PIC18F2455/2550/4455/4550
DS39632E-page 98 © 2009 Microchip Technology Inc.
Example 8-3 shows the sequence to do a 16 x 16
unsigned multiplication. Equation 8-1 shows the
algorithm that is used. The 32-bit result is stored in four
registers (RES3:RES0).
EQUATION 8-1: 16 x 16 UNSIGNED
MULTIPLICATION
ALGORITHM
EXAMPLE 8-3: 16 x 16 UNSIGNED
MULTIPLY ROUTINE
Example 8-4 shows the sequence to do a 16 x 16
signed multiply. Equation 8-2 shows the algorithm
used. The 32-bit result is stored in four registers
(RES3:RES0). To account for the sign bits of the
arguments, the MSb for each argument pair is tested
and the appropriate subtractions are done.
EQUATION 8-2: 16 x 16 SIGNED
MULTIPLICATION
ALGORITHM
EXAMPLE 8-4: 16 x 16 SIGNED
MULTIPLY ROUTINE
RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L
= (ARG1H • ARG2H • 216) +
(ARG1H • ARG2L • 28) +
(ARG1L • ARG2H • 28) +
(ARG1L • ARG2L)
MOVF ARG1L, W
MULWF ARG2L ; ARG1L * ARG2L->
; PRODH:PRODL
MOVFF PRODH, RES1 ;
MOVFF PRODL, RES0 ;
;
MOVF ARG1H, W
MULWF ARG2H ; ARG1H * ARG2H->
; PRODH:PRODL
MOVFF PRODH, RES3 ;
MOVFF PRODL, RES2 ;
;
MOVF ARG1L, W
MULWF ARG2H ; ARG1L * ARG2H->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWF RES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFC RES3, F ;
;
MOVF ARG1H, W ;
MULWF ARG2L ; ARG1H * ARG2L->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWF RES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFC RES3, F ;
RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L
= (ARG1H • ARG2H • 216) +
(ARG1H • ARG2L • 28) +
(ARG1L • ARG2H • 28) +
(ARG1L • ARG2L) +
(-1 • ARG2H<7> • ARG1H:ARG1L • 216) +
(-1 • ARG1H<7> • ARG2H:ARG2L • 216)
MOVF ARG1L, W
MULWF ARG2L ; ARG1L * ARG2L ->
; PRODH:PRODL
MOVFF PRODH, RES1 ;
MOVFF PRODL, RES0 ;
;
MOVF ARG1H, W
MULWF ARG2H ; ARG1H * ARG2H ->
; PRODH:PRODL
MOVFF PRODH, RES3 ;
MOVFF PRODL, RES2 ;
;
MOVF ARG1L,W
MULWF ARG2H ; ARG1L * ARG2H ->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWF RES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFC RES3, F ;
;
MOVF ARG1H, W ;
MULWF ARG2L ; ARG1H * ARG2L ->
; PRODH:PRODL
MOVF PRODL, W ;
ADDWF RES1, F ; Add cross
MOVF PRODH, W ; products
ADDWFC RES2, F ;
CLRF WREG ;
ADDWFC RES3, F ;
;
BTFSS ARG2H, 7 ; ARG2H:ARG2L neg?
BRA SIGN_ARG1 ; no, check ARG1
MOVF ARG1L, W ;
SUBWF RES2 ;
MOVF ARG1H, W ;
SUBWFB RES3
;
SIGN_ARG1
BTFSS ARG1H, 7 ; ARG1H:ARG1L neg?
BRA CONT_CODE ; no, done
MOVF ARG2L, W ;
SUBWF RES2 ;
MOVF ARG2H, W ;
SUBWFB RES3
;
CONT_CODE
:
© 2009 Microchip Technology Inc. DS39632E-page 99
PIC18F2455/2550/4455/4550
9.0 INTERRUPTS
The PIC18F2455/2550/4455/4550 devices have
multiple interrupt sources and an interrupt priority feature
that allows each interrupt source to be assigned a highpriority
level or a low-priority level. The high-priority
interrupt vector is at 000008h and the low-priority
interrupt vector is at 000018h. High-priority interrupt
events will interrupt any low-priority interrupts that may
be in progress.
There are ten registers which are used to control
interrupt operation. These registers are:
• RCON
• INTCON
• INTCON2
• INTCON3
• PIR1, PIR2
• PIE1, PIE2
• IPR1, IPR2
It is recommended that the Microchip header files
supplied with MPLAB® IDE be used for the symbolic bit
names in these registers. This allows the assembler/
compiler to automatically take care of the placement of
these bits within the specified register.
Each interrupt source has three bits to control its
operation. The functions of these bits are:
• Flag bit to indicate that an interrupt event
occurred
• Enable bit that allows program execution to
branch to the interrupt vector address when the
flag bit is set
• Priority bit to select high priority or low priority
The interrupt priority feature is enabled by setting the
IPEN bit (RCON<7>). When interrupt priority is
enabled, there are two bits which enable interrupts
globally. Setting the GIEH bit (INTCON<7>) enables all
interrupts that have the priority bit set (high priority).
Setting the GIEL bit (INTCON<6>) enables all
interrupts that have the priority bit cleared (low priority).
When the interrupt flag, enable bit and appropriate
global interrupt enable bit are set, the interrupt will
vector immediately to address 000008h or 000018h,
depending on the priority bit setting. Individual interrupts
can be disabled through their corresponding
enable bits.
When the IPEN bit is cleared (default state), the
interrupt priority feature is disabled and interrupts are
compatible with PIC® mid-range devices. In
Compatibility mode, the interrupt priority bits for each
source have no effect. INTCON<6> is the PEIE bit
which enables/disables all peripheral interrupt sources.
INTCON<7> is the GIE bit which enables/disables all
interrupt sources. All interrupts branch to address
000008h in Compatibility mode.
When an interrupt is responded to, the global interrupt
enable bit is cleared to disable further interrupts. If the
IPEN bit is cleared, this is the GIE bit. If interrupt priority
levels are used, this will be either the GIEH or GIEL bit.
High-priority interrupt sources can interrupt a lowpriority
interrupt. Low-priority interrupts are not
processed while high-priority interrupts are in progress.
The return address is pushed onto the stack and the
PC is loaded with the interrupt vector address
(000008h or 000018h). Once in the Interrupt Service
Routine, the source(s) of the interrupt can be determined
by polling the interrupt flag bits. The interrupt
flag bits must be cleared in software before re-enabling
interrupts to avoid recursive interrupts.
The “return from interrupt” instruction, RETFIE, exits
the interrupt routine and sets the GIE bit (GIEH or GIEL
if priority levels are used) which re-enables interrupts.
For external interrupt events, such as the INTx pins or
the PORTB input change interrupt, the interrupt latency
will be three to four instruction cycles. The exact
latency is the same for one or two-cycle instructions.
Individual interrupt flag bits are set regardless of the
status of their corresponding enable bit or the GIE bit.
9.1 USB Interrupts
Unlike other peripherals, the USB module is capable of
generating a wide range of interrupts for many types of
events. These include several types of normal communication
and status events and several module level
error events.
To handle these events, the USB module is equipped
with its own interrupt logic. The logic functions in a
manner similar to the microcontroller level interrupt funnel,
with each interrupt source having separate flag and
enable bits. All events are funneled to a single device
level interrupt, USBIF (PIR2<5>). Unlike the device
level interrupt logic, the individual USB interrupt events
cannot be individually assigned their own priority. This
is determined at the device level interrupt funnel for all
USB events by the USBIP bit.
For additional details on USB interrupt logic, refer to
Section 17.5 “USB Interrupts”.
Note: Do not use the MOVFF instruction to modify
any of the interrupt control registers while
any interrupt is enabled. Doing so may
cause erratic microcontroller behavior.
PIC18F2455/2550/4455/4550
DS39632E-page 100 © 2009 Microchip Technology Inc.
FIGURE 9-1: INTERRUPT LOGIC
TMR0IE
GIE/GIEH
PEIE/GIEL
Wake-up if in Sleep Mode
Interrupt to CPU
Vector to Location
0008h
INT2IF
INT2IE
INT2IP
INT1IF
INT1IE
INT1IP
TMR0IF
TMR0IE
TMR0IP
RBIF
RBIE
RBIP
IPEN
TMR0IF
TMR0IP
INT1IF
INT1IE
INT1IP
INT2IF
INT2IE
INT2IP
RBIF
RBIE
RBIP
INT0IF
INT0IE
PEIE/GIEL
Interrupt to CPU
Vector to Location
IPEN
IPEN
0018h
Peripheral Interrupt Flag bit
Peripheral Interrupt Enable bit
Peripheral Interrupt Priority bit
Peripheral Interrupt Flag bit
Peripheral Interrupt Enable bit
Peripheral Interrupt Priority bit
TMR1IF
TMR1IE
TMR1IP
USBIF
USBIE
USBIP
Additional Peripheral Interrupts
TMR1IF
TMR1IE
TMR1IP
High-Priority Interrupt Generation
Low-Priority Interrupt Generation
USBIF
USBIE
USBIP
Additional Peripheral Interrupts
GIE/GIEH
From USB
Interrupt Logic
From USB
Interrupt Logic
© 2009 Microchip Technology Inc. DS39632E-page 101
PIC18F2455/2550/4455/4550
9.2 INTCON Registers
The INTCON registers are readable and writable
registers which contain various enable, priority and flag
bits.
Note: Interrupt flag bits are set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
interrupt enable bit. User software should
ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt.
This feature allows for software polling.
REGISTER 9-1: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE/GIEH: Global Interrupt Enable bit
When IPEN = 0:
1 = Enables all unmasked interrupts
0 = Disables all interrupts
When IPEN = 1:
1 = Enables all high-priority interrupts
0 = Disables all interrupts
bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit
When IPEN = 0:
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
When IPEN = 1:
1 = Enables all low-priority peripheral interrupts (if GIE/GIEH = 1)
0 = Disables all low-priority peripheral interrupts
bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 overflow interrupt
0 = Disables the TMR0 overflow interrupt
bit 4 INT0IE: INT0 External Interrupt Enable bit
1 = Enables the INT0 external interrupt
0 = Disables the INT0 external interrupt
bit 3 RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1 INT0IF: INT0 External Interrupt Flag bit
1 = The INT0 external interrupt occurred (must be cleared in software)
0 = The INT0 external interrupt did not occur
bit 0 RBIF: RB Port Change Interrupt Flag bit(1)
1 = At least one of the RB7:RB4 pins changed state (must be cleared in software)
0 = None of the RB7:RB4 pins have changed state
Note 1: A mismatch condition will continue to set this bit. Reading PORTB, and then waiting one additional instruction
cycle, will end the mismatch condition and allow the bit to be cleared.
PIC18F2455/2550/4455/4550
DS39632E-page 102 © 2009 Microchip Technology Inc.
REGISTER 9-2: INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1
RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RBPU: PORTB Pull-up Enable bit
1 = All PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6 INTEDG0: External Interrupt 0 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 5 INTEDG1: External Interrupt 1 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 4 INTEDG2: External Interrupt 2 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 3 Unimplemented: Read as ‘0’
bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit
1 = High priority
0 = Low priority
bit 1 Unimplemented: Read as ‘0’
bit 0 RBIP: RB Port Change Interrupt Priority bit
1 = High priority
0 = Low priority
Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding
enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt. This feature allows for software polling.
© 2009 Microchip Technology Inc. DS39632E-page 103
PIC18F2455/2550/4455/4550
REGISTER 9-3: INTCON3: INTERRUPT CONTROL REGISTER 3
R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 INT2IP: INT2 External Interrupt Priority bit
1 = High priority
0 = Low priority
bit 6 INT1IP: INT1 External Interrupt Priority bit
1 = High priority
0 = Low priority
bit 5 Unimplemented: Read as ‘0’
bit 4 INT2IE: INT2 External Interrupt Enable bit
1 = Enables the INT2 external interrupt
0 = Disables the INT2 external interrupt
bit 3 INT1IE: INT1 External Interrupt Enable bit
1 = Enables the INT1 external interrupt
0 = Disables the INT1 external interrupt
bit 2 Unimplemented: Read as ‘0’
bit 1 INT2IF: INT2 External Interrupt Flag bit
1 = The INT2 external interrupt occurred (must be cleared in software)
0 = The INT2 external interrupt did not occur
bit 0 INT1IF: INT1 External Interrupt Flag bit
1 = The INT1 external interrupt occurred (must be cleared in software)
0 = The INT1 external interrupt did not occur
Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding
enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt. This feature allows for software polling.
PIC18F2455/2550/4455/4550
DS39632E-page 104 © 2009 Microchip Technology Inc.
9.3 PIR Registers
The PIR registers contain the individual flag bits for the
peripheral interrupts. Due to the number of peripheral
interrupt sources, there are two Peripheral Interrupt
Request (Flag) registers (PIR1 and PIR2).
Note 1: Interrupt flag bits are set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE (INTCON<7>).
2: User software should ensure the appropriate
interrupt flag bits are cleared prior to
enabling an interrupt and after servicing
that interrupt.
REGISTER 9-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1
R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
SPPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SPPIF: Streaming Parallel Port Read/Write Interrupt Flag bit(1)
1 = A read or a write operation has taken place (must be cleared in software)
0 = No read or write has occurred
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = An A/D conversion completed (must be cleared in software)
0 = The A/D conversion is not complete
bit 5 RCIF: EUSART Receive Interrupt Flag bit
1 = The EUSART receive buffer, RCREG, is full (cleared when RCREG is read)
0 = The EUSART receive buffer is empty
bit 4 TXIF: EUSART Transmit Interrupt Flag bit
1 = The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written)
0 = The EUSART transmit buffer is full
bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2 CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode.
bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software)
0 = TMR1 register did not overflow
Note 1: This bit is reserved on 28-pin devices; always maintain this bit clear.
© 2009 Microchip Technology Inc. DS39632E-page 105
PIC18F2455/2550/4455/4550
REGISTER 9-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit
1 = System oscillator failed, clock input has changed to INTOSC (must be cleared in software)
0 = System clock operating
bit 6 CMIF: Comparator Interrupt Flag bit
1 = Comparator input has changed (must be cleared in software)
0 = Comparator input has not changed
bit 5 USBIF: USB Interrupt Flag bit
1 = USB has requested an interrupt (must be cleared in software)
0 = No USB interrupt request
bit 4 EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit
1 = The write operation is complete (must be cleared in software)
0 = The write operation is not complete or has not been started
bit 3 BCLIF: Bus Collision Interrupt Flag bit
1 = A bus collision has occurred (must be cleared in software)
0 = No bus collision occurred
bit 2 HLVDIF: High/Low-Voltage Detect Interrupt Flag bit
1 = A high/low-voltage condition occurred (must be cleared in software)
0 = No high/low-voltage event has occurred
bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit
1 = TMR3 register overflowed (must be cleared in software)
0 = TMR3 register did not overflow
bit 0 CCP2IF: CCP2 Interrupt Flag bit
Capture mode:
1 = A TMR1 or TMR3 register capture occurred (must be cleared in software)
0 = No TMR1 or TMR3 register capture occurred
Compare mode:
1 = A TMR1 or TMR3 register compare match occurred (must be cleared in software)
0 = No TMR1 or TMR3 register compare match occurred
PWM mode:
Unused in this mode.
PIC18F2455/2550/4455/4550
DS39632E-page 106 © 2009 Microchip Technology Inc.
9.4 PIE Registers
The PIE registers contain the individual enable bits for
the peripheral interrupts. Due to the number of peripheral
interrupt sources, there are two Peripheral Interrupt
Enable registers (PIE1 and PIE2). When IPEN = 0, the
PEIE bit must be set to enable any of these peripheral
interrupts.
REGISTER 9-6: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SPPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SPPIE: Streaming Parallel Port Read/Write Interrupt Enable bit(1)
1 = Enables the SPP read/write interrupt
0 = Disables the SPP read/write interrupt
bit 6 ADIE: A/D Converter Interrupt Enable bit
1 = Enables the A/D interrupt
0 = Disables the A/D interrupt
bit 5 RCIE: EUSART Receive Interrupt Enable bit
1 = Enables the EUSART receive interrupt
0 = Disables the EUSART receive interrupt
bit 4 TXIE: EUSART Transmit Interrupt Enable bit
1 = Enables the EUSART transmit interrupt
0 = Disables the EUSART transmit interrupt
bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
Note 1: This bit is reserved on 28-pin devices; always maintain this bit clear.
© 2009 Microchip Technology Inc. DS39632E-page 107
PIC18F2455/2550/4455/4550
REGISTER 9-7: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OSCFIE CMIE USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 6 CMIE: Comparator Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 5 USBIE: USB Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 4 EEIE: