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Farnell PDF

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STM32F405xxSTM32F407xx - Farnell Element 14

STM32F405xxSTM32F407xx - Farnell Element 14 - Revenir à l'accueil

 

 

Branding Farnell element14 (France)

 

Farnell Element 14 :

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Everything You Need To Know About Arduino

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Tutorial 01 for Arduino: Getting Acquainted with Arduino

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The Cube® 3D Printer

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What's easier- DIY Dentistry or our new our website features?

 

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Ben Heck's Getting Started with the BeagleBone Black Trailer

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Ben Heck's Home-Brew Solder Reflow Oven 2.0 Trailer

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Get Started with Pi Episode 3 - Online with Raspberry Pi

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Discover Simulink Promo -- Exclusive element14 Webinar

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Ben Heck's TV Proximity Sensor Trailer

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Ben Heck's PlayStation 4 Teardown Trailer

See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…

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Get Started with Pi Episode 4 - Your First Raspberry Pi Project

Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.

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Ben Heck Anti-Pickpocket Wallet Trailer

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Molex Earphones - The 14 Holiday Products of Newark element14 Promotion

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Tripp Lite Surge Protector - The 14 Holiday Products of Newark element14 Promotion

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Microchip ChipKIT Pi - The 14 Holiday Products of Newark element14 Promotion

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Beagle Bone Black - The 14 Holiday Products of Newark element14 Promotion

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3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

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3M Colored Duct Tape - The 14 Holiday Products of Newark element14 Promotion

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Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

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Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

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Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

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Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

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Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

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Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

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Dymo RHINO 6000 Label Printer - The 14 Holiday Products of Newark element14 Promotion

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3M LED Advanced Lights A-19 - The 14 Holiday Products of Newark element14 Promotion

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Innovative LPS Resistor Features Very High Power Dissipation

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Charge Injection Evaluation Board for DG508B Multiplexer Demo

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Ben Heck The Great Glue Gun Trailer Part 2

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Introducing element14 TV

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Ben Heck Time to Meet Your Maker Trailer

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Détecteur de composants

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Recherche intégrée

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Ben Builds an Accessibility Guitar Trailer Part 1

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Ben Builds an Accessibility Guitar - Part 2 Trailer

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PiFace Control and Display Introduction

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Flashmob Farnell

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Express Yourself in 3D with Cube 3D Printers from Newark element14

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Farnell YouTube Channel Move

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Farnell: Design with the best

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French Farnell Quest

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Altera - 3 Ways to Quickly Adapt to Changing Ethernet Protocols

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Cy-Net3 Network Module

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MC AT - Professional and Precision Series Thin Film Chip Resistors

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Solderless LED Connector

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PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701T

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3-axis Universal Motion Controller For Stepper Motor Drivers: TMC429

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Voltage Level Translation

Puce électronique / Microchip :

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Microchip - 8-bit Wireless Development Kit

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

Sans fil - Wireless :

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Microchip - 8-bit Wireless Development Kit

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Wireless Power Solutions - Wurth Electronics, Texas Instruments, CadSoft and element14

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Analog Devices - Remote Water Quality Monitoring via a Low Power, Wireless Network

Texas instrument :

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Texas Instruments - Automotive LED Headlights

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Texas Instruments - Digital Power Solutions

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Texas Instruments - Industrial Sensor Solutions

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Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

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Texas Instruments - Industrial Automation System Components

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Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

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Texas Instruments - TMS320C66x KeyStone Multicore Architecture

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Texas Instruments - Industrial Interfaces

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Texas Instruments - Concerto™ MCUs - Connectivity without compromise

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Texas Instruments - Stellaris Robot Chronos

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Texas Instruments - DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit

Ordinateurs :

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Ask Ben Heck - Connect Raspberry Pi to Car Computer

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Ben's Portable Raspberry Pi Computer Trailer

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Ben's Raspberry Pi Portable Computer Trailer 2

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Ben Heck's Pocket Computer Trailer

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Ask Ben Heck - Atari Computer

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Ask Ben Heck - Using Computer Monitors for External Displays

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Raspberry Pi Partnership with BBC Computer Literacy Project - Answers from co-founder Eben Upton

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Installing RaspBMC on your Raspberry Pi with the Farnell element14 Accessory kit

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Raspberry Pi Served - Joey Hudy

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Happy Birthday Raspberry Pi

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Raspberry Pi board B product overview

Logiciels :

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Ask Ben Heck - Best Opensource or Free CAD Software

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Tektronix FPGAView™ software makes debugging of FPGAs faster than ever!

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Ask Ben Heck - Best Open-Source Schematic Capture and PCB Layout Software

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Introduction to Cadsoft EAGLE PCB Design Software in Chinese

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Altera - Developing Software for Embedded Systems on FPGAs

Tutoriels :

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Ben Heck The Great Glue Gun Trailer Part 1

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the knode tutorial - element14

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Ben's Autodesk 123D Tutorial Trailer

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Ben's CadSoft EAGLE Tutorial Trailer

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Ben Heck's Soldering Tutorial Trailer

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Ben Heck's AVR Dev Board tutorial

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Ben Heck's Pinball Tutorial Trailer

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Ben Heck's Interface Tutorial Trailer

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First Stage with Python and PiFace Digital

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Cypress - Getting Started with PSoC® 3 - Part 2

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Energy Harvesting Challenge

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New Features of CadSoft EAGLE v6

Autres documentations :
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STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data Features • Core: ARM 32-bit Cortex™-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low power – Sleep, Stop and Standby modes – VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII • 8- to 14-bit parallel camera interface up to 54 Mbytes/s • True random number generator • CRC calculation unit • 96-bit unique ID • RTC: subsecond accuracy, hardware calendar LQFP64 (10 × 10 mm) LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm) FBGA UFBGA176 (10 × 10 mm) LQFP176 (24 × 24 mm) WLCSP90 Table 1. Device summary Reference Part number STM32F405xx STM32F405RG, STM32F405VG, STM32F405ZG, STM32F405OG, STM32F405OE STM32F407xx STM32F407VG, STM32F407IG, STM32F407ZG, STM32F407VE, STM32F407ZE, STM32F407IE www.st.com Contents STM32F405xx, STM32F407xx 2/185 DocID022152 Rev 4 Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1 Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.2 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.2.1 ARM® Cortex™-M4F core with embedded Flash and SRAM . . . . . . . . 19 2.2.2 Adaptive real-time memory accelerator (ART Accelerator™) . . . . . . . . 19 2.2.3 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.2.4 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.2.5 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . 20 2.2.6 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.2.7 Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.2.8 DMA controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.2.9 Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . . 22 2.2.10 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 22 2.2.11 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . 22 2.2.12 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.2.13 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.2.14 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.2.15 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.2.16 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2.2.17 Regulator ON/OFF and internal reset ON/OFF availability . . . . . . . . . . 28 2.2.18 Real-time clock (RTC), backup SRAM and backup registers . . . . . . . . 28 2.2.19 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 2.2.20 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.2.21 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.2.22 Inter-integrated circuit interface (I²C) . . . . . . . . . . . . . . . . . . . . . . . . . . 33 2.2.23 Universal synchronous/asynchronous receiver transmitters (USART) . 33 2.2.24 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.2.25 Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.2.26 Audio PLL (PLLI2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.2.27 Secure digital input/output interface (SDIO) . . . . . . . . . . . . . . . . . . . . . 35 2.2.28 Ethernet MAC interface with dedicated DMA and IEEE 1588 support . 35 2.2.29 Controller area network (bxCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DocID022152 Rev 4 3/185 STM32F405xx, STM32F407xx Contents 2.2.30 Universal serial bus on-the-go full-speed (OTG_FS) . . . . . . . . . . . . . . . 36 2.2.31 Universal serial bus on-the-go high-speed (OTG_HS) . . . . . . . . . . . . . 36 2.2.32 Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.2.33 Random number generator (RNG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.2.34 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . 37 2.2.35 Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.2.36 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.2.37 Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.2.38 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.2.39 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 5.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 5.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 5.3.2 VCAP_1/VCAP_2 external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 5.3.3 Operating conditions at power-up / power-down (regulator ON) . . . . . . 80 5.3.4 Operating conditions at power-up / power-down (regulator OFF) . . . . . 80 5.3.5 Embedded reset and power control block characteristics . . . . . . . . . . . 80 5.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 5.3.7 Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 5.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 5.3.11 PLL spread spectrum clock generation (SSCG) characteristics . . . . . 102 Contents STM32F405xx, STM32F407xx 4/185 DocID022152 Rev 4 5.3.12 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 5.3.13 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 5.3.14 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 108 5.3.15 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 5.3.16 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 5.3.17 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 5.3.18 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 5.3.19 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 5.3.20 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 5.3.21 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 5.3.22 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 5.3.23 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 5.3.24 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 5.3.25 FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 5.3.26 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 155 5.3.27 SD/SDIO MMC card host interface (SDIO) characteristics . . . . . . . . . 156 5.3.28 RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 6.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 6.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Appendix A Application block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 A.1 USB OTG full speed (FS) interface solutions . . . . . . . . . . . . . . . . . . . . . 171 A.2 USB OTG high speed (HS) interface solutions . . . . . . . . . . . . . . . . . . . . 173 A.3 Ethernet interface solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 DocID022152 Rev 4 5/185 STM32F405xx, STM32F407xx List of tables List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. STM32F405xx and STM32F407xx: features and peripheral counts. . . . . . . . . . . . . . . . . . 13 Table 3. Regulator ON/OFF and internal reset ON/OFF availability. . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 4. Timer feature comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 5. USART feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 6. Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 7. STM32F40x pin and ball definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 8. FSMC pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 9. Alternate function mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 10. STM32F40x register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 11. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Table 12. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 13. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 14. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 15. Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . . 79 Table 16. VCAP_1/VCAP_2 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table 17. Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . . 80 Table 18. Operating conditions at power-up / power-down (regulator OFF). . . . . . . . . . . . . . . . . . . . 80 Table 19. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table 20. Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator enabled) or RAM . . . . . . . . . . . . . . . . . . . 83 Table 21. Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator disabled) . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Table 22. Typical and maximum current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . 87 Table 23. Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 24. Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 88 Table 25. Typical and maximum current consumptions in VBAT mode. . . . . . . . . . . . . . . . . . . . . . . . 89 Table 26. Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Table 27. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Table 28. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Table 29. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Table 30. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Table 31. HSE 4-26 MHz oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Table 32. LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 33. HSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 34. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Table 35. Main PLL characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Table 36. PLLI2S (audio PLL) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Table 37. SSCG parameters constraint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Table 38. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Table 39. Flash memory programming. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Table 40. Flash memory programming with VPP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Table 41. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Table 42. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Table 43. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Table 44. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Table 45. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Table 46. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 List of tables STM32F405xx, STM32F407xx 6/185 DocID022152 Rev 4 Table 47. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Table 48. Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Table 49. I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Table 50. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Table 51. Characteristics of TIMx connected to the APB1 domain . . . . . . . . . . . . . . . . . . . . . . . . . 115 Table 52. Characteristics of TIMx connected to the APB2 domain . . . . . . . . . . . . . . . . . . . . . . . . . 116 Table 53. I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Table 54. SCL frequency (fPCLK1= 42 MHz.,VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Table 55. SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Table 56. I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 Table 57. USB OTG FS startup time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Table 58. USB OTG FS DC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Table 59. USB OTG FS electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Table 60. USB HS DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Table 61. USB HS clock timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Table 62. ULPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Table 63. Ethernet DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Table 64. Dynamic characteristics: Ehternet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . . 127 Table 65. Dynamic characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . . 128 Table 66. Dynamic characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . . 128 Table 67. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 Table 68. ADC accuracy at fADC = 30 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Table 69. Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Table 70. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Table 71. VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Table 72. Embedded internal reference voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Table 73. Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Table 74. DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Table 75. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 138 Table 76. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 139 Table 77. Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 140 Table 78. Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Table 79. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 Table 80. Synchronous multiplexed PSRAM write timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Table 81. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 145 Table 82. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Table 83. Switching characteristics for PC Card/CF read and write cycles in attribute/common space. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 Table 84. Switching characteristics for PC Card/CF read and write cycles in I/O space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 Table 85. Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Table 86. Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Table 87. DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Table 88. Dynamic characteristics: SD / MMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 Table 89. RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 Table 90. WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data . . . . . . . . . 159 Table 91. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data . . . . . . . . . 160 Table 92. LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data. . . . . . . 162 Table 93. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data . . . . . . . 164 Table 94. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Table 95. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package mechanical data . . . . . . . 167 DocID022152 Rev 4 7/185 STM32F405xx, STM32F407xx List of tables Table 96. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 Table 97. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Table 98. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 List of figures STM32F405xx, STM32F407xx 8/185 DocID022152 Rev 4 List of figures Figure 1. Compatible board design between STM32F10xx/STM32F4xx for LQFP64. . . . . . . . . . . . 15 Figure 2. Compatible board design STM32F10xx/STM32F2xx/STM32F4xx for LQFP100 package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 3. Compatible board design between STM32F10xx/STM32F2xx/STM32F4xx for LQFP144 package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 4. Compatible board design between STM32F2xx and STM32F4xx for LQFP176 and BGA176 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 5. STM32F40x block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 6. Multi-AHB matrix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 7. Power supply supervisor interconnection with internal reset OFF . . . . . . . . . . . . . . . . . . . 24 Figure 8. PDR_ON and NRST control with internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 9. Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 10. Startup in regulator OFF mode: slow VDD slope - power-down reset risen after VCAP_1/VCAP_2 stabilization . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 11. Startup in regulator OFF mode: fast VDD slope - power-down reset risen before VCAP_1/VCAP_2 stabilization . . . . . . . . . . . . . . . . . . . . . . 28 Figure 12. STM32F40x LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Figure 13. STM32F40x LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Figure 14. STM32F40x LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 15. STM32F40x LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 16. STM32F40x UFBGA176 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 17. STM32F40x WLCSP90 ballout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Figure 18. STM32F40x memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Figure 19. Pin loading conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Figure 20. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Figure 21. Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Figure 22. Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Figure 23. External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Figure 24. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator ON) or RAM, and peripherals OFF . . . . 85 Figure 25. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator ON) or RAM, and peripherals ON . . . . . 85 Figure 26. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator OFF) or RAM, and peripherals OFF . . . 86 Figure 27. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator OFF) or RAM, and peripherals ON . . . . 86 Figure 28. Typical VBAT current consumption (LSE and RTC ON/backup RAM OFF) . . . . . . . . . . . . 89 Figure 29. Typical VBAT current consumption (LSE and RTC ON/backup RAM ON) . . . . . . . . . . . . . 90 Figure 30. High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Figure 31. Low-speed external clock source AC timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Figure 32. Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Figure 33. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Figure 34. ACCLSI versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Figure 35. PLL output clock waveforms in center spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Figure 36. PLL output clock waveforms in down spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Figure 37. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Figure 38. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Figure 39. I2C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 DocID022152 Rev 4 9/185 STM32F405xx, STM32F407xx List of figures Figure 40. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Figure 41. SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Figure 42. SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 Figure 43. I2S slave timing diagram (Philips protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Figure 44. I2S master timing diagram (Philips protocol)(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Figure 45. USB OTG FS timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . 124 Figure 46. ULPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Figure 47. Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Figure 48. Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Figure 49. Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 Figure 50. ADC accuracy characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Figure 51. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 Figure 52. Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 133 Figure 53. Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 133 Figure 54. 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 Figure 55. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 138 Figure 56. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 139 Figure 57. Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 140 Figure 58. Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 141 Figure 59. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 Figure 60. Synchronous multiplexed PSRAM write timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Figure 61. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 145 Figure 62. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 Figure 63. PC Card/CompactFlash controller waveforms for common memory read access . . . . . . 148 Figure 64. PC Card/CompactFlash controller waveforms for common memory write access . . . . . . 148 Figure 65. PC Card/CompactFlash controller waveforms for attribute memory read access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 Figure 66. PC Card/CompactFlash controller waveforms for attribute memory write access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Figure 67. PC Card/CompactFlash controller waveforms for I/O space read access . . . . . . . . . . . . 150 Figure 68. PC Card/CompactFlash controller waveforms for I/O space write access . . . . . . . . . . . . 151 Figure 69. NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Figure 70. NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Figure 71. NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 154 Figure 72. NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 154 Figure 73. DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Figure 74. SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Figure 75. SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 Figure 76. WLCSP90 - 0.400 mm pitch wafer level chip size package outline . . . . . . . . . . . . . . . . . 159 Figure 77. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . 160 Figure 78. LQFP64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 Figure 79. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 162 Figure 80. LQFP100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Figure 81. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 164 Figure 82. LQFP144 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 Figure 83. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Figure 84. LQFP176 24 x 24 mm, 176-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 167 Figure 85. LQFP176 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Figure 86. USB controller configured as peripheral-only and used in Full speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 Figure 87. USB controller configured as host-only and used in full speed mode. . . . . . . . . . . . . . . . 171 List of figures STM32F405xx, STM32F407xx 10/185 DocID022152 Rev 4 Figure 88. USB controller configured in dual mode and used in full speed mode . . . . . . . . . . . . . . . 172 Figure 89. USB controller configured as peripheral, host, or dual-mode and used in high speed mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 Figure 90. MII mode using a 25 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Figure 91. RMII with a 50 MHz oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Figure 92. RMII with a 25 MHz crystal and PHY with PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 DocID022152 Rev 4 11/185 STM32F405xx, STM32F407xx Introduction 1 Introduction This datasheet provides the description of the STM32F405xx and STM32F407xx lines of microcontrollers. For more details on the whole STMicroelectronics STM32™ family, please refer to Section 2.1: Full compatibility throughout the family. The STM32F405xx and STM32F407xx datasheet should be read in conjunction with the STM32F4xx reference manual. The reference and Flash programming manuals are both available from the STMicroelectronics website www.st.com. For information on the Cortex™-M4 core, please refer to the Cortex™-M4 programming manual (PM0214) available from www.st.com. Description STM32F405xx, STM32F407xx 12/185 DocID022152 Rev 4 2 Description The STM32F405xx and STM32F407xx family is based on the high-performance ARM® Cortex™-M4 32-bit RISC core operating at a frequency of up to 168 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all ARM singleprecision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The Cortex-M4 core with FPU will be referred to as Cortex-M4F throughout this document. The STM32F405xx and STM32F407xx family incorporates high-speed embedded memories (Flash memory up to 1 Mbyte, up to 192 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix. All devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers. a true random number generator (RNG). They also feature standard and advanced communication interfaces. • Up to three I2Cs • Three SPIs, two I2Ss full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization. • Four USARTs plus two UARTs • An USB OTG full-speed and a USB OTG high-speed with full-speed capability (with the ULPI), • Two CANs • An SDIO/MMC interface • Ethernet and the camera interface available on STM32F407xx devices only. New advanced peripherals include an SDIO, an enhanced flexible static memory control (FSMC) interface (for devices offered in packages of 100 pins and more), a camera interface for CMOS sensors. Refer to Table 2: STM32F405xx and STM32F407xx: features and peripheral counts for the list of peripherals available on each part number. The STM32F405xx and STM32F407xx family operates in the –40 to +105 °C temperature range from a 1.8 to 3.6 V power supply. The supply voltage can drop to 1.7 V when the device operates in the 0 to 70 °C temperature range using an external power supply supervisor: refer to Section : Internal reset OFF. A comprehensive set of power-saving mode allows the design of low-power applications. The STM32F405xx and STM32F407xx family offers devices in various packages ranging from 64 pins to 176 pins. The set of included peripherals changes with the device chosen. These features make the STM32F405xx and STM32F407xx microcontroller family suitable for a wide range of applications: • Motor drive and application control • Medical equipment • Industrial applications: PLC, inverters, circuit breakers • Printers, and scanners • Alarm systems, video intercom, and HVAC • Home audio appliances STM32F405xx, STM32F407xx Description DocID022152 Rev 4 13/185 Figure 5 shows the general block diagram of the device family. Table 2. STM32F405xx and STM32F407xx: features and peripheral counts Peripherals STM32F405RG STM32F405OG STM32F405VG STM32F405ZG STM32F405OE STM32F407Vx STM32F407Zx STM32F407Ix Flash memory in Kbytes 1024 512 512 1024 512 1024 512 1024 SRAM in Kbytes System 192(112+16+64) Backup 4 FSMC memory controller No Yes(1) Ethernet No Yes Timers Generalpurpose 10 Advanced -control 2 Basic 2 IWDG Yes WWDG Yes RTC Yes Random number generator Yes Description STM32F405xx, STM32F407xx 14/185 DocID022152 Rev 4 Communi cation interfaces SPI / I2S 3/2 (full duplex)(2) I2C 3 USART/ UART 4/2 USB OTG FS Yes USB OTG HS Yes CAN 2 SDIO Yes Camera interface No Yes GPIOs 51 72 82 114 72 82 114 140 12-bit ADC Number of channels 3 16 13 16 24 13 16 24 24 12-bit DAC Number of channels Yes 2 Maximum CPU frequency 168 MHz Operating voltage 1.8 to 3.6 V(3) Operating temperatures Ambient temperatures: –40 to +85 °C /–40 to +105 °C Junction temperature: –40 to + 125 °C Package LQFP64 WLCSP90 LQFP100 LQFP144 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 1. For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. 2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section : Internal reset OFF). Table 2. STM32F405xx and STM32F407xx: features and peripheral counts Peripherals STM32F405RG STM32F405OG STM32F405VG STM32F405ZG STM32F405OE STM32F407Vx STM32F407Zx STM32F407Ix DocID022152 Rev 4 15/185 STM32F405xx, STM32F407xx Description 2.1 Full compatibility throughout the family The STM32F405xx and STM32F407xx are part of the STM32F4 family. They are fully pinto- pin, software and feature compatible with the STM32F2xx devices, allowing the user to try different memory densities, peripherals, and performances (FPU, higher frequency) for a greater degree of freedom during the development cycle. The STM32F405xx and STM32F407xx devices maintain a close compatibility with the whole STM32F10xxx family. All functional pins are pin-to-pin compatible. The STM32F405xx and STM32F407xx, however, are not drop-in replacements for the STM32F10xxx devices: the two families do not have the same power scheme, and so their power pins are different. Nonetheless, transition from the STM32F10xxx to the STM32F40x family remains simple as only a few pins are impacted. Figure 4, Figure 3, Figure 2, and Figure 1 give compatible board designs between the STM32F40x, STM32F2xxx, and STM32F10xxx families. Figure 1. Compatible board design between STM32F10xx/STM32F4xx for LQFP64 31 1 16 17 32 48 33 64 49 47 VSS VSS VSS VSS 0 Ω resistor or soldering bridge present for the STM32F10xx configuration, not present in the STM32F4xx configuration ai18489 Description STM32F405xx, STM32F407xx 16/185 DocID022152 Rev 4 Figure 2. Compatible board design STM32F10xx/STM32F2xx/STM32F4xx for LQFP100 package Figure 3. Compatible board design between STM32F10xx/STM32F2xx/STM32F4xx for LQFP144 package 20 49 1 25 26 50 75 51 100 76 73 19 VSS VSS VDD VSS VSS VSS 0 ΩΩ resistor or soldering bridge present for the STM32F10xxx configuration, not present in the STM32F4xx configuration ai18488c 99 (VSS) VDD VSS Two 0 Ω resistors connected to: - VSS for the STM32F10xx - VSS for the STM32F4xx VSS for STM32F10xx VDD for STM32F4xx - VSS, VDD or NC for the STM32F2xx ai18487d 31 71 1 36 37 72 108 73 144 109 VSS 0 Ω resistor or soldering bridge present for the STM32F10xx configuration, not present in the STM32F4xx configuration 106 VSS 30 Two 0 Ω resistors connected to: - VSS for the STM32F10xx - VDD or signal from external power supply supervisor for the STM32F4xx VDD VSS VSS VSS 143 (PDR_ON) VDD VSS VSS for STM32F10xx VDD for STM32F4xx - VSS, VDD or NC for the STM32F2xx Signal from external power supply supervisor DocID022152 Rev 4 17/185 STM32F405xx, STM32F407xx Description Figure 4. Compatible board design between STM32F2xx and STM32F4xx for LQFP176 and BGA176 packages MS19919V3 1 44 45 88 132 89 176 133 Two 0 Ω resistors connected to: - VSS, VDD or NC for the STM32F2xx - VDD or signal from external power supply supervisor for the STM32F4xx 171 (PDR_ON) VDDVSS Signal from external power supply supervisor Description STM32F405xx, STM32F407xx 18/185 DocID022152 Rev 4 2.2 Device overview Figure 5. STM32F40x block diagram 1. The timers connected to APB2 are clocked from TIMxCLK up to 168 MHz, while the timers connected to APB1 are clocked from TIMxCLK either up to 84 MHz or 168 MHz, depending on TIMPRE bit configuration in the RCC_DCKCFGR register. 2. The camera interface and ethernet are available only on STM32F407xx devices. MS19920V3 GPIO PORT A AHB/APB2 140 AF PA[15:0] TIM1 / PWM 4 compl. channels (TIM1_CH1[1:4]N, 4 channels (TIM1_CH1[1:4]ETR, BKIN as AF RX, TX, CK, CTS, RTS as AF MOSI, MISO, SCK, NSS as AF APB 1 30M Hz 8 analog inputs common to the 3 ADCs VDDREF_ADC MOSI/SD, MISO/SD_ext, SCK/CK NSS/WS, MCK as AF TX, RX DAC1_OUT as AF ITF WWDG 4 KB BKPSRAM RTC_AF1 OSC32_IN OSC32_OUT VDDA, VSSA NRST 16b SDIO / MMC D[7:0] CMD, CK as AF VBAT = 1.65 to 3.6 V DMA2 SCL, SDA, SMBA as AF JTAG & SW ARM Cortex-M4 168 MHz ETM NVIC MPU TRACECLK TRACED[3:0] Ethernet MAC 10/100 DMA/ FIFO MII or RMII as AF MDIO as AF USB OTG HS DP, DM ULPI:CK, D[7:0], DIR, STP, NXT ID, VBUS, SOF DMA2 8 Streams FIFO ART ACCEL/ CACHE SRAM 112 KB CLK, NE [3:0], A[23:0], D[31:0], OEN, WEN, NBL[3:0], NL, NREG, NWAIT/IORDY, CD INTN, NIIS16 as AF RNG Camera interface HSYNC, VSYNC PUIXCLK, D[13:0] PHY USB OTG FS DP DM ID, VBUS, SOF FIFO AHB1 168 MHz PHY FIFO @VDDA @VDDA POR/PDR BOR Supply supervision @VDDA PVD Int POR reset XTAL 32 kHz MAN AGT RTC RC HS FCLK RC LS PWR interface IWDG @VBAT AWU Reset & clock control P L L1&2 PCLKx VDD = 1.8 to 3.6 V VSS VCAP1, VCPA2 Voltage regulator 3.3 to 1.2 V VDD Power managmt Backup register RTC_AF1 AHB bus-matrix 8S7M LS 2 channels as AF DAC1 DAC2 Flash up to 1 MB SRAM, PSRAM, NOR Flash, PC Card (ATA), NAND Flash External memory controller (FSMC) TIM6 TIM7 TIM2 TIM3 TIM4 TIM5 TIM12 TIM13 TIM14 USART2 USART3 UART4 UART5 SP3/I2S3 I2C1/SMBUS I2C2/SMBUS I2C3/SMBUS bxCAN1 bxCAN2 SPI1 EXT IT. WKUP D-BUS FIFO FPU APB142 MHz (max) SRAM 16 KB CCM data RAM 64 KB AHB3 AHB2 168 MHz NJTRST, JTDI, JTCK/SWCLK JTDO/SWD, JTDO I-BUS S-BUS DMA/ FIFO DMA1 8 Streams FIFO PB[15:0] PC[15:0] PD[15:0] PE[15:0] PF[15:0] PG[15:0] PH[15:0] PI[11:0] GPIO PORT B GPIO PORT C GPIO PORT D GPIO PORT E GPIO PORT F GPIO PORT G GPIO PORT H GPIO PORT I TIM8 / PWM 16b 4 compl. channels (TIM1_CH1[1:4]N, 4 channels (TIM1_CH1[1:4]ETR, BKIN as AF 1 channel as AF 1 channel as AF RX, TX, CK, CTS, RTS as AF 8 analog inputs common to the ADC1 & 2 8 analog inputs for ADC3 DAC2_OUT as AF 16b 16b SCL, SDA, SMBA as AF SCL, SDA, SMBA as AF MOSI/SD, MISO/SD_ext, SCK/CK NSS/WS, MCK as AF TX, RX RX, TX as AF RX, TX as AF RX, TX as AF CTS, RTS as AF RX, TX as AF CTS, RTS as AF 1 channel as AF smcard irDA smcard irDA 16b 16b 16b 1 channel as AF 2 channels as AF 32b 16b 16b 32b 4 channels 4 channels, ETR as AF 4 channels, ETR as AF 4 channels, ETR as AF DMA1 AHB/APB1 LS OSC_IN OSC_OUT HCLKx XTAL OSC 4- 16MHz FIFO SP2/I2S2 NIORD, IOWR, INT[2:3] ADC3 ADC2 ADC1 Temperature sensor IF TIM9 16b TIM10 16b TIM11 16b smcard irDA USART1 irDA smcard USART6 APB2 84 MHz @VDD @VDD @VDDA DocID022152 Rev 4 19/185 STM32F405xx, STM32F407xx Description 2.2.1 ARM® Cortex™-M4F core with embedded Flash and SRAM The ARM Cortex-M4F processor is the latest generation of ARM processors for embedded systems. It was developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced response to interrupts. The ARM Cortex-M4F 32-bit RISC processor features exceptional code-efficiency, delivering the high-performance expected from an ARM core in the memory size usually associated with 8- and 16-bit devices. The processor supports a set of DSP instructions which allow efficient signal processing and complex algorithm execution. Its single precision FPU (floating point unit) speeds up software development by using metalanguage development tools, while avoiding saturation. The STM32F405xx and STM32F407xx family is compatible with all ARM tools and software. Figure 5 shows the general block diagram of the STM32F40x family. Note: Cortex-M4F is binary compatible with Cortex-M3. 2.2.2 Adaptive real-time memory accelerator (ART Accelerator™) The ART Accelerator™ is a memory accelerator which is optimized for STM32 industrystandard ARM® Cortex™-M4F processors. It balances the inherent performance advantage of the ARM Cortex-M4F over Flash memory technologies, which normally requires the processor to wait for the Flash memory at higher frequencies. To release the processor full 210 DMIPS performance at this frequency, the accelerator implements an instruction prefetch queue and branch cache, which increases program execution speed from the 128-bit Flash memory. Based on CoreMark benchmark, the performance achieved thanks to the ART accelerator is equivalent to 0 wait state program execution from Flash memory at a CPU frequency up to 168 MHz. 2.2.3 Memory protection unit The memory protection unit (MPU) is used to manage the CPU accesses to memory to prevent one task to accidentally corrupt the memory or resources used by any other active task. This memory area is organized into up to 8 protected areas that can in turn be divided up into 8 subareas. The protection area sizes are between 32 bytes and the whole 4 gigabytes of addressable memory. The MPU is especially helpful for applications where some critical or certified code has to be protected against the misbehavior of other tasks. It is usually managed by an RTOS (realtime operating system). If a program accesses a memory location that is prohibited by the MPU, the RTOS can detect it and take action. In an RTOS environment, the kernel can dynamically update the MPU area setting, based on the process to be executed. The MPU is optional and can be bypassed for applications that do not need it. 2.2.4 Embedded Flash memory The STM32F40x devices embed a Flash memory of 512 Kbytes or 1 Mbytes available for storing programs and data. Description STM32F405xx, STM32F407xx 20/185 DocID022152 Rev 4 2.2.5 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of verifying the Flash memory integrity. The CRC calculation unit helps compute a software signature during runtime, to be compared with a reference signature generated at link-time and stored at a given memory location. 2.2.6 Embedded SRAM All STM32F40x products embed: • Up to 192 Kbytes of system SRAM including 64 Kbytes of CCM (core coupled memory) data RAM RAM memory is accessed (read/write) at CPU clock speed with 0 wait states. • 4 Kbytes of backup SRAM This area is accessible only from the CPU. Its content is protected against possible unwanted write accesses, and is retained in Standby or VBAT mode. 2.2.7 Multi-AHB bus matrix The 32-bit multi-AHB bus matrix interconnects all the masters (CPU, DMAs, Ethernet, USB HS) and the slaves (Flash memory, RAM, FSMC, AHB and APB peripherals) and ensures a seamless and efficient operation even when several high-speed peripherals work simultaneously. DocID022152 Rev 4 21/185 STM32F405xx, STM32F407xx Description Figure 6. Multi-AHB matrix 2.2.8 DMA controller (DMA) The devices feature two general-purpose dual-port DMAs (DMA1 and DMA2) with 8 streams each. They are able to manage memory-to-memory, peripheral-to-memory and memory-to-peripheral transfers. They feature dedicated FIFOs for APB/AHB peripherals, support burst transfer and are designed to provide the maximum peripheral bandwidth (AHB/APB). The two DMA controllers support circular buffer management, so that no specific code is needed when the controller reaches the end of the buffer. The two DMA controllers also have a double buffering feature, which automates the use and switching of two memory buffers without requiring any special code. Each stream is connected to dedicated hardware DMA requests, with support for software trigger on each stream. Configuration is made by software and transfer sizes between source and destination are independent. The DMA can be used with the main peripherals: • SPI and I2S • I2C • USART • General-purpose, basic and advanced-control timers TIMx • DAC • SDIO • Camera interface (DCMI) • ADC. ARM Cortex-M4 GP DMA1 GP DMA2 MAC Ethernet USB OTG HS Bus matrix-S S0 S1 S2 S3 S4 S5 S6 S7 ICODE DCODE ACCEL Flash memory SRAM1 112 Kbyte SRAM2 16 Kbyte AHB1 peripherals AHB2 FSMC Static MemCtl M0 M1 M2 M3 M4 M5 M6 I-bus D-bus S-bus DMA_PI DMA_MEM1 DMA_MEM2 DMA_P2 ETHERNET_M USB_HS_M ai18490c CCM data RAM 64-Kbyte APB1 APB2 peripherals Description STM32F405xx, STM32F407xx 22/185 DocID022152 Rev 4 2.2.9 Flexible static memory controller (FSMC) The FSMC is embedded in the STM32F405xx and STM32F407xx family. It has four Chip Select outputs supporting the following modes: PCCard/Compact Flash, SRAM, PSRAM, NOR Flash and NAND Flash. Functionality overview: • Write FIFO • Maximum FSMC_CLK frequency for synchronous accesses is 60 MHz. LCD parallel interface The FSMC can be configured to interface seamlessly with most graphic LCD controllers. It supports the Intel 8080 and Motorola 6800 modes, and is flexible enough to adapt to specific LCD interfaces. This LCD parallel interface capability makes it easy to build costeffective graphic applications using LCD modules with embedded controllers or high performance solutions using external controllers with dedicated acceleration. 2.2.10 Nested vectored interrupt controller (NVIC) The STM32F405xx and STM32F407xx embed a nested vectored interrupt controller able to manage 16 priority levels, and handle up to 82 maskable interrupt channels plus the 16 interrupt lines of the Cortex™-M4F. • Closely coupled NVIC gives low-latency interrupt processing • Interrupt entry vector table address passed directly to the core • Allows early processing of interrupts • Processing of late arriving, higher-priority interrupts • Support tail chaining • Processor state automatically saved • Interrupt entry restored on interrupt exit with no instruction overhead This hardware block provides flexible interrupt management features with minimum interrupt latency. 2.2.11 External interrupt/event controller (EXTI) The external interrupt/event controller consists of 23 edge-detector lines used to generate interrupt/event requests. Each line can be independently configured to select the trigger event (rising edge, falling edge, both) and can be masked independently. A pending register maintains the status of the interrupt requests. The EXTI can detect an external line with a pulse width shorter than the Internal APB2 clock period. Up to 140 GPIOs can be connected to the 16 external interrupt lines. 2.2.12 Clocks and startup On reset the 16 MHz internal RC oscillator is selected as the default CPU clock. The 16 MHz internal RC oscillator is factory-trimmed to offer 1% accuracy over the full temperature range. The application can then select as system clock either the RC oscillator or an external 4-26 MHz clock source. This clock can be monitored for failure. If a failure is detected, the system automatically switches back to the internal RC oscillator and a software interrupt is generated (if enabled). This clock source is input to a PLL thus allowing to increase the frequency up to 168 MHz. Similarly, full interrupt management of the PLL DocID022152 Rev 4 23/185 STM32F405xx, STM32F407xx Description clock entry is available when necessary (for example if an indirectly used external oscillator fails). Several prescalers allow the configuration of the three AHB buses, the high-speed APB (APB2) and the low-speed APB (APB1) domains. The maximum frequency of the three AHB buses is 168 MHz while the maximum frequency of the high-speed APB domains is 84 MHz. The maximum allowed frequency of the low-speed APB domain is 42 MHz. The devices embed a dedicated PLL (PLLI2S) which allows to achieve audio class performance. In this case, the I2S master clock can generate all standard sampling frequencies from 8 kHz to 192 kHz. 2.2.13 Boot modes At startup, boot pins are used to select one out of three boot options: • Boot from user Flash • Boot from system memory • Boot from embedded SRAM The boot loader is located in system memory. It is used to reprogram the Flash memory by using USART1 (PA9/PA10), USART3 (PC10/PC11 or PB10/PB11), CAN2 (PB5/PB13), USB OTG FS in Device mode (PA11/PA12) through DFU (device firmware upgrade). 2.2.14 Power supply schemes • VDD = 1.8 to 3.6 V: external power supply for I/Os and the internal regulator (when enabled), provided externally through VDD pins. • VSSA, VDDA = 1.8 to 3.6 V: external analog power supplies for ADC, DAC, Reset blocks, RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively. • VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup registers (through power switch) when VDD is not present. Refer to Figure 21: Power supply scheme for more details. Note: VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section : Internal reset OFF). Refer to Table 2 in order to identify the packages supporting this option. 2.2.15 Power supply supervisor Internal reset ON On packages embedding the PDR_ON pin, the power supply supervisor is enabled by holding PDR_ON high. On all other packages, the power supply supervisor is always enabled. The device has an integrated power-on reset (POR) / power-down reset (PDR) circuitry coupled with a Brownout reset (BOR) circuitry. At power-on, POR/PDR is always active and ensures proper operation starting from 1.8 V. After the 1.8 V POR threshold level is reached, the option byte loading process starts, either to confirm or modify default BOR threshold levels, or to disable BOR permanently. Three BOR thresholds are available through option bytes. The device remains in reset mode when VDD is below a specified threshold, VPOR/PDR or VBOR, without the need for an external reset circuit. Description STM32F405xx, STM32F407xx 24/185 DocID022152 Rev 4 The device also features an embedded programmable voltage detector (PVD) that monitors the VDD/VDDA power supply and compares it to the VPVD threshold. An interrupt can be generated when VDD/VDDA drops below the VPVD threshold and/or when VDD/VDDA is higher than the VPVD threshold. The interrupt service routine can then generate a warning message and/or put the MCU into a safe state. The PVD is enabled by software. Internal reset OFF This feature is available only on packages featuring the PDR_ON pin. The internal power-on reset (POR) / power-down reset (PDR) circuitry is disabled with the PDR_ON pin. An external power supply supervisor should monitor VDD and should maintain the device in reset mode as long as VDD is below a specified threshold. PDR_ON should be connected to this external power supply supervisor. Refer to Figure 7: Power supply supervisor interconnection with internal reset OFF. Figure 7. Power supply supervisor interconnection with internal reset OFF 1. PDR = 1.7 V for reduce temperature range; PDR = 1.8 V for all temperature range. The VDD specified threshold, below which the device must be maintained under reset, is 1.8 V (see Figure 7). This supply voltage can drop to 1.7 V when the device operates in the 0 to 70 °C temperature range. A comprehensive set of power-saving mode allows to design low-power applications. When the internal reset is OFF, the following integrated features are no more supported: • The integrated power-on reset (POR) / power-down reset (PDR) circuitry is disabled • The brownout reset (BOR) circuitry is disabled • The embedded programmable voltage detector (PVD) is disabled • VBAT functionality is no more available and VBAT pin should be connected to VDD All packages, except for the LQFP64 and LQFP100, allow to disable the internal reset through the PDR_ON signal. MS31383V3 NRST VDD PDR_ON External VDD power supply supervisor Ext. reset controller active when VDD < 1.7 V or 1.8 V (1) VDD Application reset signal (optional) DocID022152 Rev 4 25/185 STM32F405xx, STM32F407xx Description Figure 8. PDR_ON and NRST control with internal reset OFF 1. PDR = 1.7 V for reduce temperature range; PDR = 1.8 V for all temperature range. 2.2.16 Voltage regulator The regulator has four operating modes: • Regulator ON – Main regulator mode (MR) – Low power regulator (LPR) – Power-down • Regulator OFF Regulator ON On packages embedding the BYPASS_REG pin, the regulator is enabled by holding BYPASS_REG low. On all other packages, the regulator is always enabled. There are three power modes configured by software when regulator is ON: • MR is used in the nominal regulation mode (With different voltage scaling in Run) In Main regulator mode (MR mode), different voltage scaling are provided to reach the best compromise between maximum frequency and dynamic power consumption. Refer to Table 14: General operating conditions. • LPR is used in the Stop modes The LP regulator mode is configured by software when entering Stop mode. • Power-down is used in Standby mode. The Power-down mode is activated only when entering in Standby mode. The regulator output is in high impedance and the kernel circuitry is powered down, inducing zero consumption. The contents of the registers and SRAM are lost) MS19009V6 VDD time PDR = 1.7 V or 1.8 V (1) time NRST PDR_ON PDR_ON Reset by other source than power supply supervisor Description STM32F405xx, STM32F407xx 26/185 DocID022152 Rev 4 Two external ceramic capacitors should be connected on VCAP_1 & VCAP_2 pin. Refer to Figure 21: Power supply scheme and Figure 16: VCAP_1/VCAP_2 operating conditions. All packages have regulator ON feature. Regulator OFF This feature is available only on packages featuring the BYPASS_REG pin. The regulator is disabled by holding BYPASS_REG high. The regulator OFF mode allows to supply externally a V12 voltage source through VCAP_1 and VCAP_2 pins. Since the internal voltage scaling is not manage internally, the external voltage value must be aligned with the targetted maximum frequency. Refer to Table 14: General operating conditions. The two 2.2 μF ceramic capacitors should be replaced by two 100 nF decoupling capacitors. Refer to Figure 21: Power supply scheme When the regulator is OFF, there is no more internal monitoring on V12. An external power supply supervisor should be used to monitor the V12 of the logic power domain. PA0 pin should be used for this purpose, and act as power-on reset on V12 power domain. In regulator OFF mode the following features are no more supported: • PA0 cannot be used as a GPIO pin since it allows to reset a part of the V12 logic power domain which is not reset by the NRST pin. • As long as PA0 is kept low, the debug mode cannot be used under power-on reset. As a consequence, PA0 and NRST pins must be managed separately if the debug connection under reset or pre-reset is required. Figure 9. Regulator OFF ai18498V4 External VCAP_1/2 power supply supervisor Ext. reset controller active when VCAP_1/2 < Min V12 V12 VCAP_1 VCAP_2 BYPASS_REG VDD PA0 NRST Application reset signal (optional) VDD V12 DocID022152 Rev 4 27/185 STM32F405xx, STM32F407xx Description The following conditions must be respected: • VDD should always be higher than VCAP_1 and VCAP_2 to avoid current injection between power domains. • If the time for VCAP_1 and VCAP_2 to reach V12 minimum value is faster than the time for VDD to reach 1.8 V, then PA0 should be kept low to cover both conditions: until VCAP_1 and VCAP_2 reach V12 minimum value and until VDD reaches 1.8 V (see Figure 10). • Otherwise, if the time for VCAP_1 and VCAP_2 to reach V12 minimum value is slower than the time for VDD to reach 1.8 V, then PA0 could be asserted low externally (see Figure 11). • If VCAP_1 and VCAP_2 go below V12 minimum value and VDD is higher than 1.8 V, then a reset must be asserted on PA0 pin. Note: The minimum value of V12 depends on the maximum frequency targeted in the application (see Table 14: General operating conditions). Figure 10. Startup in regulator OFF mode: slow VDD slope - power-down reset risen after VCAP_1/VCAP_2 stabilization 1. This figure is valid both whatever the internal reset mode (onON or OFFoff). 2. PDR = 1.7 V for reduced temperature range; PDR = 1.8 V for all temperature ranges. ai18491e VDD time Min V12 PDR = 1.7 V or 1.8 V (2) VCAP_1/VCAP_2 V12 NRST time Description STM32F405xx, STM32F407xx 28/185 DocID022152 Rev 4 Figure 11. Startup in regulator OFF mode: fast VDD slope - power-down reset risen before VCAP_1/VCAP_2 stabilization 1. This figure is valid both whatever the internal reset mode (onON or offOFF). 2. PDR = 1.7 V for a reduced temperature range; PDR = 1.8 V for all temperature ranges. 2.2.17 Regulator ON/OFF and internal reset ON/OFF availability 2.2.18 Real-time clock (RTC), backup SRAM and backup registers The backup domain of the STM32F405xx and STM32F407xx includes: • The real-time clock (RTC) • 4 Kbytes of backup SRAM • 20 backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the second, minute, hour (in 12/24 hour), week day, date, month, year, in BCD (binarycoded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are performed automatically. The RTC provides a programmable alarm and programmable periodic interrupts with wakeup from Stop and Standby modes. The sub-seconds value is also available in binary format. It is clocked by a 32.768 kHz external crystal, resonator or oscillator, the internal low-power RC oscillator or the high-speed external clock divided by 128. The internal low-speed RC VDD time Min V12 VCAP_1/VCAP_2 V12 PA0 asserted externally NRST time ai18492d PDR = 1.7 V or 1.8 V (2) Table 3. Regulator ON/OFF and internal reset ON/OFF availability Regulator ON Regulator OFF Internal reset ON Internal reset OFF LQFP64 LQFP100 Yes No Yes No LQFP144 LQFP176 Yes PDR_ON set to VDD Yes PDR_ON connected to an external power supply supervisor WLCSP90 UFBGA176 Yes BYPASS_REG set to VSS Yes BYPASS_REG set to VDD DocID022152 Rev 4 29/185 STM32F405xx, STM32F407xx Description has a typical frequency of 32 kHz. The RTC can be calibrated using an external 512 Hz output to compensate for any natural quartz deviation. Two alarm registers are used to generate an alarm at a specific time and calendar fields can be independently masked for alarm comparison. To generate a periodic interrupt, a 16-bit programmable binary auto-reload downcounter with programmable resolution is available and allows automatic wakeup and periodic alarms from every 120 μs to every 36 hours. A 20-bit prescaler is used for the time base clock. It is by default configured to generate a time base of 1 second from a clock at 32.768 kHz. The 4-Kbyte backup SRAM is an EEPROM-like memory area. It can be used to store data which need to be retained in VBAT and standby mode. This memory area is disabled by default to minimize power consumption (see Section 2.2.19: Low-power modes). It can be enabled by software. The backup registers are 32-bit registers used to store 80 bytes of user application data when VDD power is not present. Backup registers are not reset by a system, a power reset, or when the device wakes up from the Standby mode (see Section 2.2.19: Low-power modes). Additional 32-bit registers contain the programmable alarm subseconds, seconds, minutes, hours, day, and date. Like backup SRAM, the RTC and backup registers are supplied through a switch that is powered either from the VDD supply when present or from the VBAT pin. 2.2.19 Low-power modes The STM32F405xx and STM32F407xx support three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: • Sleep mode In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can wake up the CPU when an interrupt/event occurs. • Stop mode The Stop mode achieves the lowest power consumption while retaining the contents of SRAM and registers. All clocks in the V12 domain are stopped, the PLL, the HSI RC and the HSE crystal oscillators are disabled. The voltage regulator can also be put either in normal or in low-power mode. The device can be woken up from the Stop mode by any of the EXTI line (the EXTI line source can be one of the 16 external lines, the PVD output, the RTC alarm / wakeup / tamper / time stamp events, the USB OTG FS/HS wakeup or the Ethernet wakeup). • Standby mode The Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is switched off so that the entire V12 domain is powered off. The PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering Description STM32F405xx, STM32F407xx 30/185 DocID022152 Rev 4 Standby mode, the SRAM and register contents are lost except for registers in the backup domain and the backup SRAM when selected. The device exits the Standby mode when an external reset (NRST pin), an IWDG reset, a rising edge on the WKUP pin, or an RTC alarm / wakeup / tamper /time stamp event occurs. The standby mode is not supported when the embedded voltage regulator is bypassed and the V12 domain is controlled by an external power. 2.2.20 VBAT operation The VBAT pin allows to power the device VBAT domain from an external battery, an external supercapacitor, or from VDD when no external battery and an external supercapacitor are present. VBAT operation is activated when VDD is not present. The VBAT pin supplies the RTC, the backup registers and the backup SRAM. Note: When the microcontroller is supplied from VBAT, external interrupts and RTC alarm/events do not exit it from VBAT operation. When PDR_ON pin is not connected to VDD (internal reset OFF), the VBAT functionality is no more available and VBAT pin should be connected to VDD. 2.2.21 Timers and watchdogs The STM32F405xx and STM32F407xx devices include two advanced-control timers, eight general-purpose timers, two basic timers and two watchdog timers. All timer counters can be frozen in debug mode. Table 4 compares the features of the advanced-control, general-purpose and basic timers. Table 4. Timer feature comparison Timer type Timer Counter resolutio n Counter type Prescaler factor DMA request generatio n Capture/ compare channels Complementar y output Max interface clock (MHz) Max timer clock (MHz) Advanced -control TIM1, TIM8 16-bit Up, Down, Up/dow n Any integer between 1 and 65536 Yes 4 Yes 84 168 DocID022152 Rev 4 31/185 STM32F405xx, STM32F407xx Description Advanced-control timers (TIM1, TIM8) The advanced-control timers (TIM1, TIM8) can be seen as three-phase PWM generators multiplexed on 6 channels. They have complementary PWM outputs with programmable inserted dead times. They can also be considered as complete general-purpose timers. Their 4 independent channels can be used for: • Input capture • Output compare • PWM generation (edge- or center-aligned modes) • One-pulse mode output If configured as standard 16-bit timers, they have the same features as the general-purpose TIMx timers. If configured as 16-bit PWM generators, they have full modulation capability (0- 100%). The advanced-control timer can work together with the TIMx timers via the Timer Link feature for synchronization or event chaining. TIM1 and TIM8 support independent DMA request generation. General purpose TIM2, TIM5 32-bit Up, Down, Up/dow n Any integer between 1 and 65536 Yes 4 No 42 84 TIM3, TIM4 16-bit Up, Down, Up/dow n Any integer between 1 and 65536 Yes 4 No 42 84 TIM9 16-bit Up Any integer between 1 and 65536 No 2 No 84 168 TIM10 , TIM11 16-bit Up Any integer between 1 and 65536 No 1 No 84 168 TIM12 16-bit Up Any integer between 1 and 65536 No 2 No 42 84 TIM13 , TIM14 16-bit Up Any integer between 1 and 65536 No 1 No 42 84 Basic TIM6, TIM7 16-bit Up Any integer between 1 and 65536 Yes 0 No 42 84 Table 4. Timer feature comparison (continued) Timer type Timer Counter resolutio n Counter type Prescaler factor DMA request generatio n Capture/ compare channels Complementar y output Max interface clock (MHz) Max timer clock (MHz) Description STM32F405xx, STM32F407xx 32/185 DocID022152 Rev 4 General-purpose timers (TIMx) There are ten synchronizable general-purpose timers embedded in the STM32F40x devices (see Table 4 for differences). • TIM2, TIM3, TIM4, TIM5 The STM32F40x include 4 full-featured general-purpose timers: TIM2, TIM5, TIM3, and TIM4.The TIM2 and TIM5 timers are based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler. The TIM3 and TIM4 timers are based on a 16- bit auto-reload up/downcounter and a 16-bit prescaler. They all feature 4 independent channels for input capture/output compare, PWM or one-pulse mode output. This gives up to 16 input capture/output compare/PWMs on the largest packages. The TIM2, TIM3, TIM4, TIM5 general-purpose timers can work together, or with the other general-purpose timers and the advanced-control timers TIM1 and TIM8 via the Timer Link feature for synchronization or event chaining. Any of these general-purpose timers can be used to generate PWM outputs. TIM2, TIM3, TIM4, TIM5 all have independent DMA request generation. They are capable of handling quadrature (incremental) encoder signals and the digital outputs from 1 to 4 hall-effect sensors. • TIM9, TIM10, TIM11, TIM12, TIM13, and TIM14 These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler. TIM10, TIM11, TIM13, and TIM14 feature one independent channel, whereas TIM9 and TIM12 have two independent channels for input capture/output compare, PWM or one-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4, TIM5 full-featured general-purpose timers. They can also be used as simple time bases. Basic timers TIM6 and TIM7 These timers are mainly used for DAC trigger and waveform generation. They can also be used as a generic 16-bit time base. TIM6 and TIM7 support independent DMA request generation. Independent watchdog The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is clocked from an independent 32 kHz internal RC and as it operates independently from the main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free-running timer for application timeout management. It is hardware- or software-configurable through the option bytes. Window watchdog The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early warning interrupt capability and the counter can be frozen in debug mode. DocID022152 Rev 4 33/185 STM32F405xx, STM32F407xx Description SysTick timer This timer is dedicated to real-time operating systems, but could also be used as a standard downcounter. It features: • A 24-bit downcounter • Autoreload capability • Maskable system interrupt generation when the counter reaches 0 • Programmable clock source. 2.2.22 Inter-integrated circuit interface (I²C) Up to three I²C bus interfaces can operate in multimaster and slave modes. They can support the Standard-mode (up to 100 kHz) and Fast-mode (up to 400 kHz) . They support the 7/10-bit addressing mode and the 7-bit dual addressing mode (as slave). A hardware CRC generation/verification is embedded. They can be served by DMA and they support SMBus 2.0/PMBus. 2.2.23 Universal synchronous/asynchronous receiver transmitters (USART) The STM32F405xx and STM32F407xx embed four universal synchronous/asynchronous receiver transmitters (USART1, USART2, USART3 and USART6) and two universal asynchronous receiver transmitters (UART4 and UART5). These six interfaces provide asynchronous communication, IrDA SIR ENDEC support, multiprocessor communication mode, single-wire half-duplex communication mode and have LIN Master/Slave capability. The USART1 and USART6 interfaces are able to communicate at speeds of up to 10.5 Mbit/s. The other available interfaces communicate at up to 5.25 Mbit/s. USART1, USART2, USART3 and USART6 also provide hardware management of the CTS and RTS signals, Smart Card mode (ISO 7816 compliant) and SPI-like communication capability. All interfaces can be served by the DMA controller. Description STM32F405xx, STM32F407xx 34/185 DocID022152 Rev 4 2.2.24 Serial peripheral interface (SPI) The STM32F40x feature up to three SPIs in slave and master modes in full-duplex and simplex communication modes. SPI1 can communicate at up to 42 Mbits/s, SPI2 and SPI3 can communicate at up to 21 Mbit/s. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable to 8 bits or 16 bits. The hardware CRC generation/verification supports basic SD Card/MMC modes. All SPIs can be served by the DMA controller. The SPI interface can be configured to operate in TI mode for communications in master mode and slave mode. 2.2.25 Inter-integrated sound (I2S) Two standard I2S interfaces (multiplexed with SPI2 and SPI3) are available. They can be operated in master or slave mode, in full duplex and half-duplex communication modes, and can be configured to operate with a 16-/32-bit resolution as an input or output channel. Audio sampling frequencies from 8 kHz up to 192 kHz are supported. When either or both of the I2S interfaces is/are configured in master mode, the master clock can be output to the external DAC/CODEC at 256 times the sampling frequency. All I2Sx can be served by the DMA controller. 2.2.26 Audio PLL (PLLI2S) The devices feature an additional dedicated PLL for audio I2S application. It allows to achieve error-free I2S sampling clock accuracy without compromising on the CPU performance, while using USB peripherals. Table 5. USART feature comparison USART name Standard features Modem (RTS/ CTS) LIN SPI master irDA Smartcard (ISO 7816) Max. baud rate in Mbit/s (oversampling by 16) Max. baud rate in Mbit/s (oversampling by 8) APB mapping USART1 X X X X X X 5.25 10.5 APB2 (max. 84 MHz) USART2 X X X X X X 2.62 5.25 APB1 (max. 42 MHz) USART3 X X X X X X 2.62 5.25 APB1 (max. 42 MHz) UART4 X - X - X - 2.62 5.25 APB1 (max. 42 MHz) UART5 X - X - X - 2.62 5.25 APB1 (max. 42 MHz) USART6 X X X X X X 5.25 10.5 APB2 (max. 84 MHz) DocID022152 Rev 4 35/185 STM32F405xx, STM32F407xx Description The PLLI2S configuration can be modified to manage an I2S sample rate change without disabling the main PLL (PLL) used for CPU, USB and Ethernet interfaces. The audio PLL can be programmed with very low error to obtain sampling rates ranging from 8 KHz to 192 KHz. In addition to the audio PLL, a master clock input pin can be used to synchronize the I2S flow with an external PLL (or Codec output). 2.2.27 Secure digital input/output interface (SDIO) An SD/SDIO/MMC host interface is available, that supports MultiMediaCard System Specification Version 4.2 in three different databus modes: 1-bit (default), 4-bit and 8-bit. The interface allows data transfer at up to 48 MHz, and is compliant with the SD Memory Card Specification Version 2.0. The SDIO Card Specification Version 2.0 is also supported with two different databus modes: 1-bit (default) and 4-bit. The current version supports only one SD/SDIO/MMC4.2 card at any one time and a stack of MMC4.1 or previous. In addition to SD/SDIO/MMC, this interface is fully compliant with the CE-ATA digital protocol Rev1.1. 2.2.28 Ethernet MAC interface with dedicated DMA and IEEE 1588 support Peripheral available only on the STM32F407xx devices. The STM32F407xx devices provide an IEEE-802.3-2002-compliant media access controller (MAC) for ethernet LAN communications through an industry-standard mediumindependent interface (MII) or a reduced medium-independent interface (RMII). The STM32F407xx requires an external physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.). the PHY is connected to the STM32F407xx MII port using 17 signals for MII or 9 signals for RMII, and can be clocked using the 25 MHz (MII) from the STM32F407xx. The STM32F407xx includes the following features: • Supports 10 and 100 Mbit/s rates • Dedicated DMA controller allowing high-speed transfers between the dedicated SRAM and the descriptors (see the STM32F40x reference manual for details) • Tagged MAC frame support (VLAN support) • Half-duplex (CSMA/CD) and full-duplex operation • MAC control sublayer (control frames) support • 32-bit CRC generation and removal • Several address filtering modes for physical and multicast address (multicast and group addresses) • 32-bit status code for each transmitted or received frame • Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive FIFO are both 2 Kbytes. • Supports hardware PTP (precision time protocol) in accordance with IEEE 1588 2008 (PTP V2) with the time stamp comparator connected to the TIM2 input • Triggers interrupt when system time becomes greater than target time Description STM32F405xx, STM32F407xx 36/185 DocID022152 Rev 4 2.2.29 Controller area network (bxCAN) The two CANs are compliant with the 2.0A and B (active) specifications with a bitrate up to 1 Mbit/s. They can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. Each CAN has three transmit mailboxes, two receive FIFOS with 3 stages and 28 shared scalable filter banks (all of them can be used even if one CAN is used). 256 bytes of SRAM are allocated for each CAN. 2.2.30 Universal serial bus on-the-go full-speed (OTG_FS) The STM32F405xx and STM32F407xx embed an USB OTG full-speed device/host/OTG peripheral with integrated transceivers. The USB OTG FS peripheral is compliant with the USB 2.0 specification and with the OTG 1.0 specification. It has software-configurable endpoint setting and supports suspend/resume. The USB OTG full-speed controller requires a dedicated 48 MHz clock that is generated by a PLL connected to the HSE oscillator. The major features are: • Combined Rx and Tx FIFO size of 320 × 35 bits with dynamic FIFO sizing • Supports the session request protocol (SRP) and host negotiation protocol (HNP) • 4 bidirectional endpoints • 8 host channels with periodic OUT support • HNP/SNP/IP inside (no need for any external resistor) • For OTG/Host modes, a power switch is needed in case bus-powered devices are connected 2.2.31 Universal serial bus on-the-go high-speed (OTG_HS) The STM32F405xx and STM32F407xx devices embed a USB OTG high-speed (up to 480 Mb/s) device/host/OTG peripheral. The USB OTG HS supports both full-speed and high-speed operations. It integrates the transceivers for full-speed operation (12 MB/s) and features a UTMI low-pin interface (ULPI) for high-speed operation (480 MB/s). When using the USB OTG HS in HS mode, an external PHY device connected to the ULPI is required. The USB OTG HS peripheral is compliant with the USB 2.0 specification and with the OTG 1.0 specification. It has software-configurable endpoint setting and supports suspend/resume. The USB OTG full-speed controller requires a dedicated 48 MHz clock that is generated by a PLL connected to the HSE oscillator. The major features are: • Combined Rx and Tx FIFO size of 1 Kbit × 35 with dynamic FIFO sizing • Supports the session request protocol (SRP) and host negotiation protocol (HNP) • 6 bidirectional endpoints • 12 host channels with periodic OUT support • Internal FS OTG PHY support • External HS or HS OTG operation supporting ULPI in SDR mode. The OTG PHY is connected to the microcontroller ULPI port through 12 signals. It can be clocked using the 60 MHz output. • Internal USB DMA • HNP/SNP/IP inside (no need for any external resistor) • for OTG/Host modes, a power switch is needed in case bus-powered devices are connected DocID022152 Rev 4 37/185 STM32F405xx, STM32F407xx Description 2.2.32 Digital camera interface (DCMI) The camera interface is not available in STM32F405xx devices. STM32F407xx products embed a camera interface that can connect with camera modules and CMOS sensors through an 8-bit to 14-bit parallel interface, to receive video data. The camera interface can sustain a data transfer rate up to 54 Mbyte/s at 54 MHz. It features: • Programmable polarity for the input pixel clock and synchronization signals • Parallel data communication can be 8-, 10-, 12- or 14-bit • Supports 8-bit progressive video monochrome or raw bayer format, YCbCr 4:2:2 progressive video, RGB 565 progressive video or compressed data (like JPEG) • Supports continuous mode or snapshot (a single frame) mode • Capability to automatically crop the image 2.2.33 Random number generator (RNG) All STM32F405xx and STM32F407xx products embed an RNG that delivers 32-bit random numbers generated by an integrated analog circuit. 2.2.34 General-purpose input/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain, with or without pull-up or pull-down), as input (floating, with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. All GPIOs are high-current-capable and have speed selection to better manage internal noise, power consumption and electromagnetic emission. The I/O configuration can be locked if needed by following a specific sequence in order to avoid spurious writing to the I/Os registers. Fast I/O handling allowing maximum I/O toggling up to 84 MHz. 2.2.35 Analog-to-digital converters (ADCs) Three 12-bit analog-to-digital converters are embedded and each ADC shares up to 16 external channels, performing conversions in the single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of analog inputs. Additional logic functions embedded in the ADC interface allow: • Simultaneous sample and hold • Interleaved sample and hold The ADC can be served by the DMA controller. An analog watchdog feature allows very precise monitoring of the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds. To synchronize A/D conversion and timers, the ADCs could be triggered by any of TIM1, TIM2, TIM3, TIM4, TIM5, or TIM8 timer. 2.2.36 Temperature sensor The temperature sensor has to generate a voltage that varies linearly with temperature. The conversion range is between 1.8 V and 3.6 V. The temperature sensor is internally Description STM32F405xx, STM32F407xx 38/185 DocID022152 Rev 4 connected to the ADC1_IN16 input channel which is used to convert the sensor output voltage into a digital value. As the offset of the temperature sensor varies from chip to chip due to process variation, the internal temperature sensor is mainly suitable for applications that detect temperature changes instead of absolute temperatures. If an accurate temperature reading is needed, then an external temperature sensor part should be used. 2.2.37 Digital-to-analog converter (DAC) The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. This dual digital Interface supports the following features: • two DAC converters: one for each output channel • 8-bit or 12-bit monotonic output • left or right data alignment in 12-bit mode • synchronized update capability • noise-wave generation • triangular-wave generation • dual DAC channel independent or simultaneous conversions • DMA capability for each channel • external triggers for conversion • input voltage reference VREF+ Eight DAC trigger inputs are used in the device. The DAC channels are triggered through the timer update outputs that are also connected to different DMA streams. 2.2.38 Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. Debug is performed using 2 pins only instead of 5 required by the JTAG (JTAG pins could be re-use as GPIO with alternate function): the JTAG TMS and TCK pins are shared with SWDIO and SWCLK, respectively, and a specific sequence on the TMS pin is used to switch between JTAG-DP and SW-DP. 2.2.39 Embedded Trace Macrocell™ The ARM Embedded Trace Macrocell provides a greater visibility of the instruction and data flow inside the CPU core by streaming compressed data at a very high rate from the STM32F40x through a small number of ETM pins to an external hardware trace port analyser (TPA) device. The TPA is connected to a host computer using USB, Ethernet, or any other high-speed channel. Real-time instruction and data flow activity can be recorded and then formatted for display on the host computer that runs the debugger software. TPA hardware is commercially available from common development tool vendors. The Embedded Trace Macrocell operates with third party debugger software tools. DocID022152 Rev 4 39/185 STM32F405xx, STM32F407xx Pinouts and pin description 3 Pinouts and pin description Figure 12. STM32F40x LQFP64 pinout 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VBAT PC14 PC15 NRST PC0 PC1 PC2 PC3 VSSA VDDA PA0_WKUP PA1 PA2 VDD PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PD2 PC12 PC11 PC10 PA15 PA14 VDD VCAP_2 PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 PB15 PB14 PB13 PB12 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PB10 PB11 VCAP_1 VDD LQFP64 ai18493b PC13 PH0 PH1 VSS Pinouts and pin description STM32F405xx, STM32F407xx 40/185 DocID022152 Rev 4 Figure 13. STM32F40x LQFP100 pinout 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 123456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PE2 PE3 PE4 PE5 PE6 VBAT PC14 PC15 VSS VDD PH0 NRST PC0 PC1 PC2 PC3 VDD VSSA VREF+ VDDA PA0 PA1 PA2 VDD VSS VCAP_2 PA13 PA12 PA 11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 PD15 PD14 PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PE7 PE8 PE9 PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP_1 VDD VDD VSS PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 ai18495c LQFP100 PC13 PH1 DocID022152 Rev 4 41/185 STM32F405xx, STM32F407xx Pinouts and pin description Figure 14. STM32F40x LQFP144 pinout VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDD VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 PE2 VDD PE3 VSS PE4 PE5 PA13 PE6 PA12 VBAT PA11 PC13 PA10 PC14 PA9 PC15 PA8 PF0 PC9 PF1 PC8 PF2 PC7 PF3 PC6 PF4 VDD PF5 VSS VSS PG8 VDD PG7 PF6 PG6 PF7 PG5 PF8 PG4 PF9 PG3 PF10 PG2 PH0 PD15 PH1 PD14 NRST VDD PC0 VSS PC1 PD13 PC2 PD12 PC3 PD11 VSSA VDD PD10 PD9 VREF+ PD8 VDDA PB15 PA0 PB14 PA1 PB13 PA2 PB12 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP_1 VDD 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 109 123456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 72 LQFP144 120 119 118 117 116 115 114 113 112 111 110 61 62 63 64 65 66 67 68 69 70 71 26 27 28 29 30 31 32 33 34 35 36 83 82 81 80 79 78 77 76 75 74 73 ai18496b VCAP_2 VSS Pinouts and pin description STM32F405xx, STM32F407xx 42/185 DocID022152 Rev 4 Figure 15. STM32F40x LQFP176 pinout MS19916V3 PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PI7 PI6 PE2 PE3 PE4 PE5 PA13 PE6 PA12 VBAT PA11 PI8 PA10 PC14 PA9 PC15 PA8 PF0 PC9 PF1 PC8 PF2 PC7 PF3 PC6 PF4 PF5 PG8 PG7 PF6 PG6 PF7 PG5 PF8 PG4 PF9 PG3 PF10 PG2 PH0 PD15 PH1 PD14 NRST V PC0 V PC1 PD13 PC2 PD12 PC3 PD11 PD10 PD9 VREF+ PD8 PB15 PA0 PB14 PA1 PB13 PA2 PB12 PA3 PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 141 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 80 LQFP176 152 151 150 149 148 147 146 145 144 143 142 69 70 71 72 73 74 75 76 77 78 79 26 27 28 29 30 31 32 33 34 35 36 107 106 105 104 103 102 101 100 99 98 89 PI4 PA15 PA14 PI3 PI2 PI5 140 139 138 137 136 135 134 133 PH4 PH5 PH6 PH7 PH8 PH9 PH10 PH11 88 81 82 83 84 85 86 87 PI1 PI0 PH15 PH14 PH13 PH12 96 95 94 93 92 91 90 97 37 38 39 40 41 42 43 44 PC13 PI9 PI10 PI11 VSS PH2 PH3 VDD VSS VDD VDDA VSSA VDDA BYPASS_REG VDD VDD VSS VDD VCAP_1 VDD VSS VDD VCAP_2 VSS VDD VSS VDD VSS VDD VSS VDD VDD VSS VDD VSS VDD DocID022152 Rev 4 43/185 STM32F405xx, STM32F407xx Pinouts and pin description Figure 16. STM32F40x UFBGA176 ballout 1. This figure shows the package top view. ai18497b 1 2 3 9 10 11 12 13 14 15 A PE3 PE2 PE1 PE0 PB8 PB5 PG14 PG13 PB4 PB3 PD7 PC12 PA15 PA14 PA13 B PE4 PE5 PE6 PB9 PB7 PB6 PG15 PG12 PG11 PG10 PD6 PD0 PC11 PC10 PA12 C VBAT PI7 PI6 PI5 VDD PDR_ON VDD VDD VDD PG9 PD5 PD1 PI3 PI2 PA11 D PC13 PI8 PI9 PI4 BOOT0 VSS VSS VSS PD4 PD3 PD2 PH15 PI1 PA10 E PC14 PF0 PI10 PI11 PH13 PH14 PI0 PA9 F PC15 VSS VDD PH2 VSS VSS VSS VSS VSS VSS VCAP_2 PC9 PA8 G PH0 VSS VDD PH3 VSS VSS VSS VSS VSS VSS VDD PC8 PC7 H PH1 PF2 PF1 PH4 VSS VSS VSS VSS VSS VSS VDD PG8 PC6 J NRST PF3 PF4 PH5 VSS VSS VSS VSS VSS VDD VDD PG7 PG6 K PF7 PF6 PF5 VDD VSS VSS VSS VSS VSS PH12 PG5 PG4 PG3 L PF10 PF9 PF8 BYPASS_ REG PH11 PH10 PD15 PG2 M VSSA PC0 PC1 PC2 PC3 PB2 PG1 VSS VSS VCAP_1 PH6 PH8 PH9 PD14 PD13 N VREF- PA1 PA0 PA4 PC4 PF13 PG0 VDD VDD VDD PE13 PH7 PD12 PD11 PD10 P VREF+ PA2 PA6 PA5 PC5 PF12 PF15 PE8 PE9 PE11 PE14 PB12 PB13 PD9 PD8 R VDDA PA3 PA7 PB1 PB0 PF11 PF14 PE7 PE10 PE12 PE15 PB10 PB11 PB14 PB15 VSS 4 5 6 7 8 Pinouts and pin description STM32F405xx, STM32F407xx 44/185 DocID022152 Rev 4 Figure 17. STM32F40x WLCSP90 ballout 1. This figure shows the package bump view. A VBAT PC13 PDR_ON PB4 PD7 PD4 PC12 B PC15 VDD PB7 PB3 PD6 PD2 PA15 C PA0 VSS PB6 PD5 PD1 PC11 PI0 D PC2 PB8 PA13 E PC3 VSS F PH1 PA1 G NRST H VSSA J PA2 PA 4 PA7 PB2 PE11 PB11 PB12 MS30402V1 1 PA14 PI1 PA12 PA10 PA9 PC0 PC9 PC8 PH0 PB13 PC6 PD14 PD12 PE8 PE12 BYPASS_ REG PD9 PD8 PE9 PB14 10 9 8 7 6 5 4 3 2 VDD PC14 VCAP_2 PA11 PB5 PD0 PC10 PA8 VSS VDD VSS VDD PC7 VDD PE10 PE14 VCAP_1 PD15 PE13 PE15 PD10 PD11 PA3 PA6 PB1 PB10 PB15 PB9 BOOT0 VDDA PA5 PB0 PE7 Table 6. Legend/abbreviations used in the pinout table Name Abbreviation Definition Pin name Unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name Pin type S Supply pin I Input only pin I/O Input / output pin I/O structure FT 5 V tolerant I/O TTa 3.3 V tolerant I/O directly connected to ADC B Dedicated BOOT0 pin RST Bidirectional reset pin with embedded weak pull-up resistor Notes Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset Alternate functions Functions selected through GPIOx_AFR registers Additional functions Functions directly selected/enabled through peripheral registers DocID022152 Rev 4 45/185 STM32F405xx, STM32F407xx Pinouts and pin description Table 7. STM32F40x pin and ball definitions Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 - - 1 1 A2 1 PE2 I/O FT TRACECLK/ FSMC_A23 / ETH_MII_TXD3 / EVENTOUT - - 2 2 A1 2 PE3 I/O FT TRACED0/FSMC_A19 / EVENTOUT - - 3 3 B1 3 PE4 I/O FT TRACED1/FSMC_A20 / DCMI_D4/ EVENTOUT - - 4 4 B2 4 PE5 I/O FT TRACED2 / FSMC_A21 / TIM9_CH1 / DCMI_D6 / EVENTOUT - - 5 5 B3 5 PE6 I/O FT TRACED3 / FSMC_A22 / TIM9_CH2 / DCMI_D7 / EVENTOUT 1 A10 6 6 C1 6 VBAT S - - - - D2 7 PI8 I/O FT (2)( 3) EVENTOUT RTC_TAMP1, RTC_TAMP2, RTC_TS 2 A9 7 7 D1 8 PC13 I/O FT (2) (3) EVENTOUT RTC_OUT, RTC_TAMP1, RTC_TS 3 B10 8 8 E1 9 PC14/OSC32_IN (PC14) I/O FT (2)( 3) EVENTOUT OSC32_IN(4) 4 B9 9 9 F1 10 PC15/ OSC32_OUT (PC15) I/O FT (2)( 3) EVENTOUT OSC32_OUT(4) - - - - D3 11 PI9 I/O FT CAN1_RX / EVENTOUT - - - - E3 12 PI10 I/O FT ETH_MII_RX_ER / EVENTOUT - - - - E4 13 PI11 I/O FT OTG_HS_ULPI_DIR / EVENTOUT - - - - F2 14 VSS S - - - - F3 15 VDD S - - - 10 E2 16 PF0 I/O FT FSMC_A0 / I2C2_SDA / EVENTOUT Pinouts and pin description STM32F405xx, STM32F407xx 46/185 DocID022152 Rev 4 - - - 11 H3 17 PF1 I/O FT FSMC_A1 / I2C2_SCL / EVENTOUT - - - 12 H2 18 PF2 I/O FT FSMC_A2 / I2C2_SMBA / EVENTOUT - - - 13 J2 19 PF3 I/O FT (4) FSMC_A3/EVENTOUT ADC3_IN9 - - - 14 J3 20 PF4 I/O FT (4) FSMC_A4/EVENTOUT ADC3_IN14 - - - 15 K3 21 PF5 I/O FT (4) FSMC_A5/EVENTOUT ADC3_IN15 - C9 10 16 G2 22 VSS S - B8 11 17 G3 23 VDD S - - - 18 K2 24 PF6 I/O FT (4) TIM10_CH1 / FSMC_NIORD/ EVENTOUT ADC3_IN4 - - - 19 K1 25 PF7 I/O FT (4) TIM11_CH1/FSMC_NREG / EVENTOUT ADC3_IN5 - - - 20 L3 26 PF8 I/O FT (4) TIM13_CH1 / FSMC_NIOWR/ EVENTOUT ADC3_IN6 - - - 21 L2 27 PF9 I/O FT (4) TIM14_CH1 / FSMC_CD/ EVENTOUT ADC3_IN7 - - - 22 L1 28 PF10 I/O FT (4) FSMC_INTR/ EVENTOUT ADC3_IN8 5 F10 12 23 G1 29 PH0/OSC_IN (PH0) I/O FT EVENTOUT OSC_IN(4) 6 F9 13 24 H1 30 PH1/OSC_OUT (PH1) I/O FT EVENTOUT OSC_OUT(4) 7 G10 14 25 J1 31 NRST I/O RS T 8 E10 15 26 M2 32 PC0 I/O FT (4) OTG_HS_ULPI_STP/ EVENTOUT ADC123_IN10 9 - 16 27 M3 33 PC1 I/O FT (4) ETH_MDC/ EVENTOUT ADC123_IN11 10 D10 17 28 M4 34 PC2 I/O FT (4) SPI2_MISO / OTG_HS_ULPI_DIR / ETH_MII_TXD2 /I2S2ext_SD/ EVENTOUT ADC123_IN12 Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 DocID022152 Rev 4 47/185 STM32F405xx, STM32F407xx Pinouts and pin description 11 E9 18 29 M5 35 PC3 I/O FT (4) SPI2_MOSI / I2S2_SD / OTG_HS_ULPI_NXT / ETH_MII_TX_CLK/ EVENTOUT ADC123_IN13 - - 19 30 G3 36 VDD S 12 H10 20 31 M1 37 VSSA S - - - - N1 - VREF– S - - 21 32 P1 38 VREF+ S 13 G9 22 33 R1 39 VDDA S 14 C10 23 34 N3 40 PA0/WKUP (PA0) I/O FT (5) USART2_CTS/ UART4_TX/ ETH_MII_CRS / TIM2_CH1_ETR/ TIM5_CH1 / TIM8_ETR/ EVENTOUT ADC123_IN0/WKUP(4 ) 15 F8 24 35 N2 41 PA1 I/O FT (4) USART2_RTS / UART4_RX/ ETH_RMII_REF_CLK / ETH_MII_RX_CLK / TIM5_CH2 / TIM2_CH2/ EVENTOUT ADC123_IN1 16 J10 25 36 P2 42 PA2 I/O FT (4) USART2_TX/TIM5_CH3 / TIM9_CH1 / TIM2_CH3 / ETH_MDIO/ EVENTOUT ADC123_IN2 - - - - F4 43 PH2 I/O FT ETH_MII_CRS/EVENTOU T - - - - G4 44 PH3 I/O FT ETH_MII_COL/EVENTOU T - - - - H4 45 PH4 I/O FT I2C2_SCL / OTG_HS_ULPI_NXT/ EVENTOUT - - - - J4 46 PH5 I/O FT I2C2_SDA/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 Pinouts and pin description STM32F405xx, STM32F407xx 48/185 DocID022152 Rev 4 17 H9 26 37 R2 47 PA3 I/O FT (4) USART2_RX/TIM5_CH4 / TIM9_CH2 / TIM2_CH4 / OTG_HS_ULPI_D0 / ETH_MII_COL/ EVENTOUT ADC123_IN3 18 E5 27 38 - - VSS S D9 L4 48 BYPASS_REG I FT 19 E4 28 39 K4 49 VDD S 20 J9 29 40 N4 50 PA4 I/O TTa (4) SPI1_NSS / SPI3_NSS / USART2_CK / DCMI_HSYNC / OTG_HS_SOF/ I2S3_WS/ EVENTOUT ADC12_IN4 /DAC_OUT1 21 G8 30 41 P4 51 PA5 I/O TTa (4) SPI1_SCK/ OTG_HS_ULPI_CK / TIM2_CH1_ETR/ TIM8_CH1N/ EVENTOUT ADC12_IN5/DAC_OU T2 22 H8 31 42 P3 52 PA6 I/O FT (4) SPI1_MISO / TIM8_BKIN/TIM13_CH1 / DCMI_PIXCLK / TIM3_CH1 / TIM1_BKIN/ EVENTOUT ADC12_IN6 23 J8 32 43 R3 53 PA7 I/O FT (4) SPI1_MOSI/ TIM8_CH1N / TIM14_CH1/TIM3_CH2/ ETH_MII_RX_DV / TIM1_CH1N / ETH_RMII_CRS_DV/ EVENTOUT ADC12_IN7 24 - 33 44 N5 54 PC4 I/O FT (4) ETH_RMII_RX_D0 / ETH_MII_RX_D0/ EVENTOUT ADC12_IN14 25 - 34 45 P5 55 PC5 I/O FT (4) ETH_RMII_RX_D1 / ETH_MII_RX_D1/ EVENTOUT ADC12_IN15 26 G7 35 46 R5 56 PB0 I/O FT (4) TIM3_CH3 / TIM8_CH2N/ OTG_HS_ULPI_D1/ ETH_MII_RXD2 / TIM1_CH2N/ EVENTOUT ADC12_IN8 Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 DocID022152 Rev 4 49/185 STM32F405xx, STM32F407xx Pinouts and pin description 27 H7 36 47 R4 57 PB1 I/O FT (4) TIM3_CH4 / TIM8_CH3N/ OTG_HS_ULPI_D2/ ETH_MII_RXD3 / TIM1_CH3N/ EVENTOUT ADC12_IN9 28 J7 37 48 M6 58 PB2/BOOT1 (PB2) I/O FT EVENTOUT - - - 49 R6 59 PF11 I/O FT DCMI_D12/ EVENTOUT - - - 50 P6 60 PF12 I/O FT FSMC_A6/ EVENTOUT - - - 51 M8 61 VSS S - - - 52 N8 62 VDD S - - - 53 N6 63 PF13 I/O FT FSMC_A7/ EVENTOUT - - - 54 R7 64 PF14 I/O FT FSMC_A8/ EVENTOUT - - - 55 P7 65 PF15 I/O FT FSMC_A9/ EVENTOUT - - - 56 N7 66 PG0 I/O FT FSMC_A10/ EVENTOUT - - - 57 M7 67 PG1 I/O FT FSMC_A11/ EVENTOUT - G6 38 58 R8 68 PE7 I/O FT FSMC_D4/TIM1_ETR/ EVENTOUT - H6 39 59 P8 69 PE8 I/O FT FSMC_D5/ TIM1_CH1N/ EVENTOUT - J6 40 60 P9 70 PE9 I/O FT FSMC_D6/TIM1_CH1/ EVENTOUT - - - 61 M9 71 VSS S - - - 62 N9 72 VDD S - F6 41 63 R9 73 PE10 I/O FT FSMC_D7/TIM1_CH2N/ EVENTOUT - J5 42 64 P10 74 PE11 I/O FT FSMC_D8/TIM1_CH2/ EVENTOUT - H5 43 65 R10 75 PE12 I/O FT FSMC_D9/TIM1_CH3N/ EVENTOUT - G5 44 66 N11 76 PE13 I/O FT FSMC_D10/TIM1_CH3/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 Pinouts and pin description STM32F405xx, STM32F407xx 50/185 DocID022152 Rev 4 - F5 45 67 P11 77 PE14 I/O FT FSMC_D11/TIM1_CH4/ EVENTOUT - G4 46 68 R11 78 PE15 I/O FT FSMC_D12/TIM1_BKIN/ EVENTOUT 29 H4 47 69 R12 79 PB10 I/O FT SPI2_SCK / I2S2_CK / I2C2_SCL/ USART3_TX / OTG_HS_ULPI_D3 / ETH_MII_RX_ER / TIM2_CH3/ EVENTOUT 30 J4 48 70 R13 80 PB11 I/O FT I2C2_SDA/USART3_RX/ OTG_HS_ULPI_D4 / ETH_RMII_TX_EN/ ETH_MII_TX_EN / TIM2_CH4/ EVENTOUT 31 F4 49 71 M10 81 VCAP_1 S 32 - 50 72 N10 82 VDD S - - - - M11 83 PH6 I/O FT I2C2_SMBA / TIM12_CH1 / ETH_MII_RXD2/ EVENTOUT - - - - N12 84 PH7 I/O FT I2C3_SCL / ETH_MII_RXD3/ EVENTOUT - - - - M12 85 PH8 I/O FT I2C3_SDA / DCMI_HSYNC/ EVENTOUT - - - - M13 86 PH9 I/O FT I2C3_SMBA / TIM12_CH2/ DCMI_D0/ EVENTOUT - - - - L13 87 PH10 I/O FT TIM5_CH1 / DCMI_D1/ EVENTOUT - - - - L12 88 PH11 I/O FT TIM5_CH2 / DCMI_D2/ EVENTOUT - - - - K12 89 PH12 I/O FT TIM5_CH3 / DCMI_D3/ EVENTOUT - - - - H12 90 VSS S - - - - J12 91 VDD S Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 DocID022152 Rev 4 51/185 STM32F405xx, STM32F407xx Pinouts and pin description 33 J3 51 73 P12 92 PB12 I/O FT SPI2_NSS / I2S2_WS / I2C2_SMBA/ USART3_CK/ TIM1_BKIN / CAN2_RX / OTG_HS_ULPI_D5/ ETH_RMII_TXD0 / ETH_MII_TXD0/ OTG_HS_ID/ EVENTOUT 34 J1 52 74 P13 93 PB13 I/O FT SPI2_SCK / I2S2_CK / USART3_CTS/ TIM1_CH1N /CAN2_TX / OTG_HS_ULPI_D6 / ETH_RMII_TXD1 / ETH_MII_TXD1/ EVENTOUT OTG_HS_VBUS 35 J2 53 75 R14 94 PB14 I/O FT SPI2_MISO/ TIM1_CH2N / TIM12_CH1 / OTG_HS_DM/ USART3_RTS / TIM8_CH2N/I2S2ext_SD/ EVENTOUT 36 H1 54 76 R15 95 PB15 I/O FT SPI2_MOSI / I2S2_SD/ TIM1_CH3N / TIM8_CH3N / TIM12_CH2 / OTG_HS_DP/ EVENTOUT RTC_REFIN - H2 55 77 P15 96 PD8 I/O FT FSMC_D13 / USART3_TX/ EVENTOUT - H3 56 78 P14 97 PD9 I/O FT FSMC_D14 / USART3_RX/ EVENTOUT - G3 57 79 N15 98 PD10 I/O FT FSMC_D15 / USART3_CK/ EVENTOUT - G1 58 80 N14 99 PD11 I/O FT FSMC_CLE / FSMC_A16/USART3_CT S/ EVENTOUT - G2 59 81 N13 100 PD12 I/O FT FSMC_ALE/ FSMC_A17/TIM4_CH1 / USART3_RTS/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 Pinouts and pin description STM32F405xx, STM32F407xx 52/185 DocID022152 Rev 4 - - 60 82 M15 101 PD13 I/O FT FSMC_A18/TIM4_CH2/ EVENTOUT - - - 83 - 102 VSS S - - - 84 J13 103 VDD S - F2 61 85 M14 104 PD14 I/O FT FSMC_D0/TIM4_CH3/ EVENTOUT/ EVENTOUT - F1 62 86 L14 105 PD15 I/O FT FSMC_D1/TIM4_CH4/ EVENTOUT - - - 87 L15 106 PG2 I/O FT FSMC_A12/ EVENTOUT - - - 88 K15 107 PG3 I/O FT FSMC_A13/ EVENTOUT - - - 89 K14 108 PG4 I/O FT FSMC_A14/ EVENTOUT - - - 90 K13 109 PG5 I/O FT FSMC_A15/ EVENTOUT - - - 91 J15 110 PG6 I/O FT FSMC_INT2/ EVENTOUT - - - 92 J14 111 PG7 I/O FT FSMC_INT3 /USART6_CK/ EVENTOUT - - - 93 H14 112 PG8 I/O FT USART6_RTS / ETH_PPS_OUT/ EVENTOUT - - - 94 G12 113 VSS S - - - 95 H13 114 VDD S 37 F3 63 96 H15 115 PC6 I/O FT I2S2_MCK / TIM8_CH1/SDIO_D6 / USART6_TX / DCMI_D0/TIM3_CH1/ EVENTOUT 38 E1 64 97 G15 116 PC7 I/O FT I2S3_MCK / TIM8_CH2/SDIO_D7 / USART6_RX / DCMI_D1/TIM3_CH2/ EVENTOUT 39 E2 65 98 G14 117 PC8 I/O FT TIM8_CH3/SDIO_D0 /TIM3_CH3/ USART6_CK / DCMI_D2/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 DocID022152 Rev 4 53/185 STM32F405xx, STM32F407xx Pinouts and pin description 40 E3 66 99 F14 118 PC9 I/O FT I2S_CKIN/ MCO2 / TIM8_CH4/SDIO_D1 / /I2C3_SDA / DCMI_D3 / TIM3_CH4/ EVENTOUT 41 D1 67 100 F15 119 PA8 I/O FT MCO1 / USART1_CK/ TIM1_CH1/ I2C3_SCL/ OTG_FS_SOF/ EVENTOUT 42 D2 68 101 E15 120 PA9 I/O FT USART1_TX/ TIM1_CH2 / I2C3_SMBA / DCMI_D0/ EVENTOUT OTG_FS_VBUS 43 D3 69 102 D15 121 PA10 I/O FT USART1_RX/ TIM1_CH3/ OTG_FS_ID/DCMI_D1/ EVENTOUT 44 C1 70 103 C15 122 PA11 I/O FT USART1_CTS / CAN1_RX / TIM1_CH4 / OTG_FS_DM/ EVENTOUT 45 C2 71 104 B15 123 PA12 I/O FT USART1_RTS / CAN1_TX/ TIM1_ETR/ OTG_FS_DP/ EVENTOUT 46 D4 72 105 A15 124 PA13 (JTMS-SWDIO) I/O FT JTMS-SWDIO/ EVENTOUT 47 B1 73 106 F13 125 VCAP_2 S - E7 74 107 F12 126 VSS S 48 E6 75 108 G13 127 VDD S - - - - E12 128 PH13 I/O FT TIM8_CH1N / CAN1_TX/ EVENTOUT - - - - E13 129 PH14 I/O FT TIM8_CH2N / DCMI_D4/ EVENTOUT - - - - D13 130 PH15 I/O FT TIM8_CH3N / DCMI_D11/ EVENTOUT - C3 - - E14 131 PI0 I/O FT TIM5_CH4 / SPI2_NSS / I2S2_WS / DCMI_D13/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 Pinouts and pin description STM32F405xx, STM32F407xx 54/185 DocID022152 Rev 4 - B2 - - D14 132 PI1 I/O FT SPI2_SCK / I2S2_CK / DCMI_D8/ EVENTOUT - - - - C14 133 PI2 I/O FT TIM8_CH4 /SPI2_MISO / DCMI_D9 / I2S2ext_SD/ EVENTOUT - - - - C13 134 PI3 I/O FT TIM8_ETR / SPI2_MOSI / I2S2_SD / DCMI_D10/ EVENTOUT - - - - D9 135 VSS S - - - - C9 136 VDD S 49 A2 76 109 A14 137 PA14 (JTCK/SWCLK) I/O FT JTCK-SWCLK/ EVENTOUT 50 B3 77 110 A13 138 PA15 (JTDI) I/O FT JTDI/ SPI3_NSS/ I2S3_WS/TIM2_CH1_ET R / SPI1_NSS / EVENTOUT 51 D5 78 111 B14 139 PC10 I/O FT SPI3_SCK / I2S3_CK/ UART4_TX/SDIO_D2 / DCMI_D8 / USART3_TX/ EVENTOUT 52 C4 79 112 B13 140 PC11 I/O FT UART4_RX/ SPI3_MISO / SDIO_D3 / DCMI_D4/USART3_RX / I2S3ext_SD/ EVENTOUT 53 A3 80 113 A12 141 PC12 I/O FT UART5_TX/SDIO_CK / DCMI_D9 / SPI3_MOSI /I2S3_SD / USART3_CK/ EVENTOUT - D6 81 114 B12 142 PD0 I/O FT FSMC_D2/CAN1_RX/ EVENTOUT - C5 82 115 C12 143 PD1 I/O FT FSMC_D3 / CAN1_TX/ EVENTOUT 54 B4 83 116 D12 144 PD2 I/O FT TIM3_ETR/UART5_RX/ SDIO_CMD / DCMI_D11/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 DocID022152 Rev 4 55/185 STM32F405xx, STM32F407xx Pinouts and pin description - - 84 117 D11 145 PD3 I/O FT FSMC_CLK/ USART2_CTS/ EVENTOUT - A4 85 118 D10 146 PD4 I/O FT FSMC_NOE/ USART2_RTS/ EVENTOUT - C6 86 119 C11 147 PD5 I/O FT FSMC_NWE/USART2_TX / EVENTOUT - - - 120 D8 148 VSS S - - - 121 C8 149 VDD S - B5 87 122 B11 150 PD6 I/O FT FSMC_NWAIT/ USART2_RX/ EVENTOUT - A5 88 123 A11 151 PD7 I/O FT USART2_CK/FSMC_NE1/ FSMC_NCE2/ EVENTOUT - - - 124 C10 152 PG9 I/O FT USART6_RX / FSMC_NE2/FSMC_NCE3 / EVENTOUT - - - 125 B10 153 PG10 I/O FT FSMC_NCE4_1/ FSMC_NE3/ EVENTOUT - - - 126 B9 154 PG11 I/O FT FSMC_NCE4_2 / ETH_MII_TX_EN/ ETH _RMII_TX_EN/ EVENTOUT - - - 127 B8 155 PG12 I/O FT FSMC_NE4 / USART6_RTS/ EVENTOUT - - - 128 A8 156 PG13 I/O FT FSMC_A24 / USART6_CTS /ETH_MII_TXD0/ ETH_RMII_TXD0/ EVENTOUT - - - 129 A7 157 PG14 I/O FT FSMC_A25 / USART6_TX /ETH_MII_TXD1/ ETH_RMII_TXD1/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 Pinouts and pin description STM32F405xx, STM32F407xx 56/185 DocID022152 Rev 4 - E8 - 130 D7 158 VSS S - F7 - 131 C7 159 VDD S - - - 132 B7 160 PG15 I/O FT USART6_CTS / DCMI_D13/ EVENTOUT 55 B6 89 133 A10 161 PB3 (JTDO/ TRACESWO) I/O FT JTDO/ TRACESWO/ SPI3_SCK / I2S3_CK / TIM2_CH2 / SPI1_SCK/ EVENTOUT 56 A6 90 134 A9 162 PB4 (NJTRST) I/O FT NJTRST/ SPI3_MISO / TIM3_CH1 / SPI1_MISO / I2S3ext_SD/ EVENTOUT 57 D7 91 135 A6 163 PB5 I/O FT I2C1_SMBA/ CAN2_RX / OTG_HS_ULPI_D7 / ETH_PPS_OUT/TIM3_CH 2 / SPI1_MOSI/ SPI3_MOSI / DCMI_D10 / I2S3_SD/ EVENTOUT 58 C7 92 136 B6 164 PB6 I/O FT I2C1_SCL/ TIM4_CH1 / CAN2_TX / DCMI_D5/USART1_TX/ EVENTOUT 59 B7 93 137 B5 165 PB7 I/O FT I2C1_SDA / FSMC_NL / DCMI_VSYNC / USART1_RX/ TIM4_CH2/ EVENTOUT 60 A7 94 138 D6 166 BOOT0 I B VPP 61 D8 95 139 A5 167 PB8 I/O FT TIM4_CH3/SDIO_D4/ TIM10_CH1 / DCMI_D6 / ETH_MII_TXD3 / I2C1_SCL/ CAN1_RX/ EVENTOUT 62 C8 96 140 B4 168 PB9 I/O FT SPI2_NSS/ I2S2_WS / TIM4_CH4/ TIM11_CH1/ SDIO_D5 / DCMI_D7 / I2C1_SDA / CAN1_TX/ EVENTOUT Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 DocID022152 Rev 4 57/185 STM32F405xx, STM32F407xx Pinouts and pin description - - 97 141 A4 169 PE0 I/O FT TIM4_ETR / FSMC_NBL0 / DCMI_D2/ EVENTOUT - - 98 142 A3 170 PE1 I/O FT FSMC_NBL1 / DCMI_D3/ EVENTOUT 63 - 99 - D5 - VSS S - A8 - 143 C6 171 PDR_ON I FT 64 A1 10 0 144 C5 172 VDD S - - - - D4 173 PI4 I/O FT TIM8_BKIN / DCMI_D5/ EVENTOUT - - - - C4 174 PI5 I/O FT TIM8_CH1 / DCMI_VSYNC/ EVENTOUT - - - - C3 175 PI6 I/O FT TIM8_CH2 / DCMI_D6/ EVENTOUT - - - - C2 176 PI7 I/O FT TIM8_CH3 / DCMI_D7/ EVENTOUT 1. Function availability depends on the chosen device. 2. PC13, PC14, PC15 and PI8 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 and PI8 in output mode is limited: - The speed should not exceed 2 MHz with a maximum load of 30 pF. - These I/Os must not be used as a current source (e.g. to drive an LED). 3. Main function after the first backup domain power-up. Later on, it depends on the contents of the RTC registers even after reset (because these registers are not reset by the main reset). For details on how to manage these I/Os, refer to the RTC register description sections in the STM32F4xx reference manual, available from the STMicroelectronics website: www.st.com. 4. FT = 5 V tolerant except when in analog mode or oscillator mode (for PC14, PC15, PH0 and PH1). 5. If the device is delivered in an UFBGA176 or WLCSP90 and the BYPASS_REG pin is set to VDD (Regulator off/internal reset ON mode), then PA0 is used as an internal Reset (active low). Table 7. STM32F40x pin and ball definitions (continued) Pin number Pin name (function after reset)(1) Pin type I / O structure Notes Alternate functions Additional functions LQFP64 WLCSP90 LQFP100 LQFP144 UFBGA176 LQFP176 Table 8. FSMC pin definition Pins(1) FSMC LQFP100(2) WLCSP90 (2) CF NOR/PSRAM/ SRAM NOR/PSRAM Mux NAND 16 bit PE2 A23 A23 Yes PE3 A19 A19 Yes Pinouts and pin description STM32F405xx, STM32F407xx 58/185 DocID022152 Rev 4 PE4 A20 A20 Yes PE5 A21 A21 Yes PE6 A22 A22 Yes PF0 A0 A0 - - PF1 A1 A1 - - PF2 A2 A2 - - PF3 A3 A3 - - PF4 A4 A4 - - PF5 A5 A5 - - PF6 NIORD - - PF7 NREG - - PF8 NIOWR - - PF9 CD - - PF10 INTR - - PF12 A6 A6 - - PF13 A7 A7 - - PF14 A8 A8 - - PF15 A9 A9 - - PG0 A10 A10 - - PG1 A11 - - PE7 D4 D4 DA4 D4 Yes Yes PE8 D5 D5 DA5 D5 Yes Yes PE9 D6 D6 DA6 D6 Yes Yes PE10 D7 D7 DA7 D7 Yes Yes PE11 D8 D8 DA8 D8 Yes Yes PE12 D9 D9 DA9 D9 Yes Yes PE13 D10 D10 DA10 D10 Yes Yes PE14 D11 D11 DA11 D11 Yes Yes PE15 D12 D12 DA12 D12 Yes Yes PD8 D13 D13 DA13 D13 Yes Yes PD9 D14 D14 DA14 D14 Yes Yes PD10 D15 D15 DA15 D15 Yes Yes PD11 A16 A16 CLE Yes Yes Table 8. FSMC pin definition (continued) Pins(1) FSMC LQFP100(2) WLCSP90 (2) CF NOR/PSRAM/ SRAM NOR/PSRAM Mux NAND 16 bit DocID022152 Rev 4 59/185 STM32F405xx, STM32F407xx Pinouts and pin description PD12 A17 A17 ALE Yes Yes PD13 A18 A18 Yes PD14 D0 D0 DA0 D0 Yes Yes PD15 D1 D1 DA1 D1 Yes Yes PG2 A12 - - PG3 A13 - - PG4 A14 - - PG5 A15 - - PG6 INT2 - - PG7 INT3 - - PD0 D2 D2 DA2 D2 Yes Yes PD1 D3 D3 DA3 D3 Yes Yes PD3 CLK CLK Yes PD4 NOE NOE NOE NOE Yes Yes PD5 NWE NWE NWE NWE Yes Yes PD6 NWAIT NWAIT NWAIT NWAIT Yes Yes PD7 NE1 NE1 NCE2 Yes Yes PG9 NE2 NE2 NCE3 - - PG10 NCE4_1 NE3 NE3 - - PG11 NCE4_2 - - PG12 NE4 NE4 - - PG13 A24 A24 - - PG14 A25 A25 - - PB7 NADV NADV Yes Yes PE0 NBL0 NBL0 Yes PE1 NBL1 NBL1 Yes 1. Full FSMC features are available on LQFP144, LQFP176, and UFBGA176. The features available on smaller packages are given in the dedicated package column. 2. Ports F and G are not available in devices delivered in 100-pin packages. Table 8. FSMC pin definition (continued) Pins(1) FSMC LQFP100(2) WLCSP90 (2) CF NOR/PSRAM/ SRAM NOR/PSRAM Mux NAND 16 bit Pinouts and pin description STM32F405xx, STM32F407xx 60/185 DocID022152 Rev 4 Table 9. Alternate function mapping Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI Port A PA0 TIM2_CH1_E TR TIM 5_CH1 TIM8_ETR USART2_CTS UART4_TX ETH_MII_CRS EVENTOUT PA1 TIM2_CH2 TIM5_CH2 USART2_RTS UART4_RX ETH_MII _RX_CLK ETH_RMII__REF _CLK EVENTOUT PA2 TIM2_CH3 TIM5_CH3 TIM9_CH1 USART2_TX ETH_MDIO EVENTOUT PA3 TIM2_CH4 TIM5_CH4 TIM9_CH2 USART2_RX OTG_HS_ULPI_ D0 ETH _MII_COL EVENTOUT PA4 SPI1_NSS SPI3_NSS I2S3_WS USART2_CK OTG_HS_SO F DCMI_HSYN C EVENTOUT PA5 TIM2_CH1_E TR TIM8_CH1N SPI1_SCK OTG_HS_ULPI_ CK EVENTOUT PA6 TIM1_BKIN TIM3_CH1 TIM8_BKIN SPI1_MISO TIM13_CH1 DCMI_PIXCK EVENTOUT PA7 TIM1_CH1N TIM3_CH2 TIM8_CH1N SPI1_MOSI TIM14_CH1 ETH_MII _RX_DV ETH_RMII _CRS_DV EVENTOUT PA8 MCO1 TIM1_CH1 I2C3_SCL USART1_CK OTG_FS_SOF EVENTOUT PA9 TIM1_CH2 I2C3_SMB A USART1_TX DCMI_D0 EVENTOUT PA10 TIM1_CH3 USART1_RX OTG_FS_ID DCMI_D1 EVENTOUT PA11 TIM1_CH4 USART1_CTS CAN1_RX OTG_FS_DM EVENTOUT PA12 TIM1_ETR USART1_RTS CAN1_TX OTG_FS_DP EVENTOUT PA13 JTMSSWDIO EVENTOUT PA14 JTCKSWCLK EVENTOUT PA15 JTDI TIM 2_CH1 TIM 2_ETR SPI1_NSS SPI3_NSS/ I2S3_WS EVENTOUT STM32F405xx, STM32F407xx Pinouts and pin description DocID022152 Rev 4 61/185 Port B PB0 TIM1_CH2N TIM3_CH3 TIM8_CH2N OTG_HS_ULPI_ D1 ETH _MII_RXD2 EVENTOUT PB1 TIM1_CH3N TIM3_CH4 TIM8_CH3N OTG_HS_ULPI_ D2 ETH _MII_RXD3 EVENTOUT PB2 EVENTOUT PB3 JTDO/ TRACES WO TIM2_CH2 SPI1_SCK SPI3_SCK I2S3_CK EVENTOUT PB4 NJTRST TIM3_CH1 SPI1_MISO SPI3_MISO I2S3ext_SD EVENTOUT PB5 TIM3_CH2 I2C1_SMB A SPI1_MOSI SPI3_MOSI I2S3_SD CAN2_RX OTG_HS_ULPI_ D7 ETH _PPS_OUT DCMI_D10 EVENTOUT PB6 TIM4_CH1 I2C1_SCL USART1_TX CAN2_TX DCMI_D5 EVENTOUT PB7 TIM4_CH2 I2C1_SDA USART1_RX FSMC_NL DCMI_VSYN C EVENTOUT PB8 TIM4_CH3 TIM10_CH1 I2C1_SCL CAN1_RX ETH _MII_TXD3 SDIO_D4 DCMI_D6 EVENTOUT PB9 TIM4_CH4 TIM11_CH1 I2C1_SDA SPI2_NSS I2S2_WS CAN1_TX SDIO_D5 DCMI_D7 EVENTOUT PB10 TIM2_CH3 I2C2_SCL SPI2_SCK I2S2_CK USART3_TX OTG_HS_ULPI_ D3 ETH_ MII_RX_ER EVENTOUT PB11 TIM2_CH4 I2C2_SDA USART3_RX OTG_HS_ULPI_ D4 ETH _MII_TX_EN ETH _RMII_TX_EN EVENTOUT PB12 TIM1_BKIN I2C2_SMB A SPI2_NSS I2S2_WS USART3_CK CAN2_RX OTG_HS_ULPI_ D5 ETH _MII_TXD0 ETH _RMII_TXD0 OTG_HS_ID EVENTOUT PB13 TIM1_CH1N SPI2_SCK I2S2_CK USART3_CTS CAN2_TX OTG_HS_ULPI_ D6 ETH _MII_TXD1 ETH _RMII_TXD1 EVENTOUT PB14 TIM1_CH2N TIM8_CH2N SPI2_MISO I2S2ext_SD USART3_RTS TIM12_CH1 OTG_HS_DM EVENTOUT PB15 RTC_ REFIN TIM1_CH3N TIM8_CH3N SPI2_MOSI I2S2_SD TIM12_CH2 OTG_HS_DP EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI Pinouts and pin description STM32F405xx, STM32F407xx 62/185 DocID022152 Rev 4 Port C PC0 OTG_HS_ULPI_ STP EVENTOUT PC1 ETH_MDC EVENTOUT PC2 SPI2_MISO I2S2ext_SD OTG_HS_ULPI_ DIR ETH _MII_TXD2 EVENTOUT PC3 SPI2_MOSI I2S2_SD OTG_HS_ULPI_ NXT ETH _MII_TX_CLK EVENTOUT PC4 ETH_MII_RXD0 ETH_RMII_RXD0 EVENTOUT PC5 ETH _MII_RXD1 ETH _RMII_RXD1 EVENTOUT PC6 TIM3_CH1 TIM8_CH1 I2S2_MCK USART6_TX SDIO_D6 DCMI_D0 EVENTOUT PC7 TIM3_CH2 TIM8_CH2 I2S3_MCK USART6_RX SDIO_D7 DCMI_D1 EVENTOUT PC8 TIM3_CH3 TIM8_CH3 USART6_CK SDIO_D0 DCMI_D2 EVENTOUT PC9 MCO2 TIM3_CH4 TIM8_CH4 I2C3_SDA I2S_CKIN SDIO_D1 DCMI_D3 EVENTOUT PC10 SPI3_SCK/ I2S3_CK USART3_TX/ UART4_TX SDIO_D2 DCMI_D8 EVENTOUT PC11 I2S3ext_SD SPI3_MISO/ USART3_RX UART4_RX SDIO_D3 DCMI_D4 EVENTOUT PC12 SPI3_MOSI I2S3_SD USART3_CK UART5_TX SDIO_CK DCMI_D9 EVENTOUT PC13 EVENTOUT PC14 EVENTOUT PC15 EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI STM32F405xx, STM32F407xx Pinouts and pin description DocID022152 Rev 4 63/185 Port D PD0 CAN1_RX FSMC_D2 EVENTOUT PD1 CAN1_TX FSMC_D3 EVENTOUT PD2 TIM3_ETR UART5_RX SDIO_CMD DCMI_D11 EVENTOUT PD3 USART2_CTS FSMC_CLK EVENTOUT PD4 USART2_RTS FSMC_NOE EVENTOUT PD5 USART2_TX FSMC_NWE EVENTOUT PD6 USART2_RX FSMC_NWAIT EVENTOUT PD7 USART2_CK FSMC_NE1/ FSMC_NCE2 EVENTOUT PD8 USART3_TX FSMC_D13 EVENTOUT PD9 USART3_RX FSMC_D14 EVENTOUT PD10 USART3_CK FSMC_D15 EVENTOUT PD11 USART3_CTS FSMC_A16 EVENTOUT PD12 TIM4_CH1 USART3_RTS FSMC_A17 EVENTOUT PD13 TIM4_CH2 FSMC_A18 EVENTOUT PD14 TIM4_CH3 FSMC_D0 EVENTOUT PD15 TIM4_CH4 FSMC_D1 EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI Pinouts and pin description STM32F405xx, STM32F407xx 64/185 DocID022152 Rev 4 Port E PE0 TIM4_ETR FSMC_NBL0 DCMI_D2 EVENTOUT PE1 FSMC_NBL1 DCMI_D3 EVENTOUT PE2 TRACECL K ETH _MII_TXD3 FSMC_A23 EVENTOUT PE3 TRACED0 FSMC_A19 EVENTOUT PE4 TRACED1 FSMC_A20 DCMI_D4 EVENTOUT PE5 TRACED2 TIM9_CH1 FSMC_A21 DCMI_D6 EVENTOUT PE6 TRACED3 TIM9_CH2 FSMC_A22 DCMI_D7 EVENTOUT PE7 TIM1_ETR FSMC_D4 EVENTOUT PE8 TIM1_CH1N FSMC_D5 EVENTOUT PE9 TIM1_CH1 FSMC_D6 EVENTOUT PE10 TIM1_CH2N FSMC_D7 EVENTOUT PE11 TIM1_CH2 FSMC_D8 EVENTOUT PE12 TIM1_CH3N FSMC_D9 EVENTOUT PE13 TIM1_CH3 FSMC_D10 EVENTOUT PE14 TIM1_CH4 FSMC_D11 EVENTOUT PE15 TIM1_BKIN FSMC_D12 EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI STM32F405xx, STM32F407xx Pinouts and pin description DocID022152 Rev 4 65/185 Port F PF0 I2C2_SDA FSMC_A0 EVENTOUT PF1 I2C2_SCL FSMC_A1 EVENTOUT PF2 I2C2_ SMBA FSMC_A2 EVENTOUT PF3 FSMC_A3 EVENTOUT PF4 FSMC_A4 EVENTOUT PF5 FSMC_A5 EVENTOUT PF6 TIM10_CH1 FSMC_NIORD EVENTOUT PF7 TIM11_CH1 FSMC_NREG EVENTOUT PF8 TIM13_CH1 FSMC_ NIOWR EVENTOUT PF9 TIM14_CH1 FSMC_CD EVENTOUT PF10 FSMC_INTR EVENTOUT PF11 DCMI_D12 EVENTOUT PF12 FSMC_A6 EVENTOUT PF13 FSMC_A7 EVENTOUT PF14 FSMC_A8 EVENTOUT PF15 FSMC_A9 EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI Pinouts and pin description STM32F405xx, STM32F407xx 66/185 DocID022152 Rev 4 Port G PG0 FSMC_A10 EVENTOUT PG1 FSMC_A11 EVENTOUT PG2 FSMC_A12 EVENTOUT PG3 FSMC_A13 EVENTOUT PG4 FSMC_A14 EVENTOUT PG5 FSMC_A15 EVENTOUT PG6 FSMC_INT2 EVENTOUT PG7 USART6_CK FSMC_INT3 EVENTOUT PG8 USART6_ RTS ETH _PPS_OUT EVENTOUT PG9 USART6_RX FSMC_NE2/ FSMC_NCE3 EVENTOUT PG10 FSMC_ NCE4_1/ FSMC_NE3 EVENTOUT PG11 ETH _MII_TX_EN ETH _RMII_ TX_EN FSMC_NCE4_ 2 EVENTOUT PG12 USART6_ RTS FSMC_NE4 EVENTOUT PG13 UART6_CTS ETH _MII_TXD0 ETH _RMII_TXD0 FSMC_A24 EVENTOUT PG14 USART6_TX ETH _MII_TXD1 ETH _RMII_TXD1 FSMC_A25 EVENTOUT PG15 USART6_ CTS DCMI_D13 EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI STM32F405xx, STM32F407xx Pinouts and pin description DocID022152 Rev 4 67/185 Port H PH0 EVENTOUT PH1 EVENTOUT PH2 ETH _MII_CRS EVENTOUT PH3 ETH _MII_COL EVENTOUT PH4 I2C2_SCL OTG_HS_ULPI_ NXT EVENTOUT PH5 I2C2_SDA EVENTOUT PH6 I2C2_SMB A TIM12_CH1 ETH _MII_RXD2 EVENTOUT PH7 I2C3_SCL ETH _MII_RXD3 EVENTOUT PH8 I2C3_SDA DCMI_HSYN C EVENTOUT PH9 I2C3_SMB A TIM12_CH2 DCMI_D0 EVENTOUT PH10 TIM5_CH1 DCMI_D1 EVENTOUT PH11 TIM5_CH2 DCMI_D2 EVENTOUT PH12 TIM5_CH3 DCMI_D3 EVENTOUT PH13 TIM8_CH1N CAN1_TX EVENTOUT PH14 TIM8_CH2N DCMI_D4 EVENTOUT PH15 TIM8_CH3N DCMI_D11 EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI Pinouts and pin description STM32F405xx, STM32F407xx 68/185 DocID022152 Rev 4 Port I PI0 TIM5_CH4 SPI2_NSS I2S2_WS DCMI_D13 EVENTOUT PI1 SPI2_SCK I2S2_CK DCMI_D8 EVENTOUT PI2 TIM8_CH4 SPI2_MISO I2S2ext_SD DCMI_D9 EVENTOUT PI3 TIM8_ETR SPI2_MOSI I2S2_SD DCMI_D10 EVENTOUT PI4 TIM8_BKIN DCMI_D5 EVENTOUT PI5 TIM8_CH1 DCMI_ VSYNC EVENTOUT PI6 TIM8_CH2 DCMI_D6 EVENTOUT PI7 TIM8_CH3 DCMI_D7 EVENTOUT PI8 EVENTOUT PI9 CAN1_RX EVENTOUT PI10 ETH _MII_RX_ER EVENTOUT PI11 OTG_HS_ULPI_ DIR EVENTOUT Table 9. Alternate function mapping (continued) Port AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2 TIM3/4/5 TIM8/9/10/1 1 I2C1/2/3 SPI1/SPI2/ I2S2/I2S2ext SPI3/I2Sext/ I2S3 USART1/2/3/ I2S3ext UART4/5/ USART6 CAN1/ CAN2/ TIM12/13/14 OTG_FS/ OTG_HS ETH FSMC/SDIO/ OTG_FS DCMI DocID022152 Rev 4 69/185 STM32F405xx, STM32F407xx Memory mapping 4 Memory mapping The memory map is shown in Figure 18. Figure 18. STM32F40x memory map 512-Mbyte block 7 Cortex-M4's internal peripherals 512-Mbyte block 6 Not used 512-Mbyte block 5 FSMC registers 512-Mbyte block 4 FSMC bank 3 & bank4 512-Mbyte block 3 FSMC bank1 & bank2 512-Mbyte block 2 Peripherals 512-Mbyte block 1 SRAM 0x0000 0000 0x1FFF FFFF 0x2000 0000 0x3FFF FFFF 0x4000 0000 0x5FFF FFFF 0x6000 0000 0x7FFF FFFF 0x8000 0000 0x9FFF FFFF 0xA000 0000 0xBFFF FFFF 0xC000 0000 0xDFFF FFFF 0xE000 0000 0xFFFF FFFF 512-Mbyte block 0 Code Flash 0x0810 0000 - 0x0FFF FFFF 0x1FFF 0000 - 0x1FFF 7A0F 0x1FFF C000 - 0x1FFF C007 0x0800 0000 - 0x080F FFFF 0x0010 0000 - 0x07FF FFFF 0x0000 0000 - 0x000F FFFF System memory + OTP Reserved Reserved Aliased to Flash, system memory or SRAM depending on the BOOT pins SRAM (16 KB aliased by bit-banding) Reserved 0x2000 0000 - 0x2001 BFFF 0x2001 C000 - 0x2001 FFFF 0x2002 0000 - 0x3FFF FFFF 0x4000 0000 Reserved 0x4000 7FFF 0x4000 7800 - 0x4000 FFFF 0x4001 0000 0x4001 57FF 0x4002 000 Reserved 0x5006 0C00 - 0x5FFF FFFF 0x6000 0000 AHB3 0xA000 0FFF 0xA000 1000 - 0xDFFF FFFF ai18513f Option Bytes Reserved 0x4001 5800 - 0x4001 FFFF 0x5006 0BFF AHB2 0x5000 0000 Reserved 0x4008 0000 - 0x4FFF FFFF AHB1 SRAM (112 KB aliased by bit-banding) Reserved 0x1FFF C008 - 0x1FFF FFFF Reserved 0x1FFF 7A10 - 0x1FFF 7FFF CCM data RAM (64 KB data SRAM) 0x1000 0000 - 0x1000 FFFF Reserved 0x1001 0000 - 0x1FFE FFFF Reserved APB2 0x4007 FFFF APB1 CORTEX-M4 internal peripherals 0xE000 0000 - 0xE00F FFFF Reserved 0xE010 0000 - 0xFFFF FFFF Memory mapping STM32F405xx, STM32F407xx 70/185 DocID022152 Rev 4 Table 10. STM32F40x register boundary addresses Bus Boundary address Peripheral 0xE00F FFFF - 0xFFFF FFFF Reserved Cortex-M4 0xE000 0000 - 0xE00F FFFF Cortex-M4 internal peripherals 0xA000 1000 - 0xDFFF FFFF Reserved AHB3 0xA000 0000 - 0xA000 0FFF FSMC control register 0x9000 0000 - 0x9FFF FFFF FSMC bank 4 0x8000 0000 - 0x8FFF FFFF FSMC bank 3 0x7000 0000 - 0x7FFF FFFF FSMC bank 2 0x6000 0000 - 0x6FFF FFFF FSMC bank 1 0x5006 0C00- 0x5FFF FFFF Reserved AHB2 0x5006 0800 - 0x5006 0BFF RNG 0x5005 0400 - 0x5006 07FF Reserved 0x5005 0000 - 0x5005 03FF DCMI 0x5004 0000- 0x5004 FFFF Reserved 0x5000 0000 - 0x5003 FFFF USB OTG FS 0x4008 0000- 0x4FFF FFFF Reserved DocID022152 Rev 4 71/185 STM32F405xx, STM32F407xx Memory mapping AHB1 0x4004 0000 - 0x4007 FFFF USB OTG HS 0x4002 9400 - 0x4003 FFFF Reserved 0x4002 9000 - 0x4002 93FF ETHERNET MAC 0x4002 8C00 - 0x4002 8FFF 0x4002 8800 - 0x4002 8BFF 0x4002 8400 - 0x4002 87FF 0x4002 8000 - 0x4002 83FF 0x4002 6800 - 0x4002 7FFF Reserved 0x4002 6400 - 0x4002 67FF DMA2 0x4002 6000 - 0x4002 63FF DMA1 0x4002 5000 - 0x4002 5FFF Reserved 0x4002 4000 - 0x4002 4FFF BKPSRAM 0x4002 3C00 - 0x4002 3FFF Flash interface register 0x4002 3800 - 0x4002 3BFF RCC 0x4002 3400 - 0x4002 37FF Reserved 0x4002 3000 - 0x4002 33FF CRC 0x4002 2400 - 0x4002 2FFF Reserved 0x4002 2000 - 0x4002 23FF GPIOI 0x4002 1C00 - 0x4002 1FFF GPIOH 0x4002 1800 - 0x4002 1BFF GPIOG 0x4002 1400 - 0x4002 17FF GPIOF 0x4002 1000 - 0x4002 13FF GPIOE 0x4002 0C00 - 0x4002 0FFF GPIOD 0x4002 0800 - 0x4002 0BFF GPIOC 0x4002 0400 - 0x4002 07FF GPIOB 0x4002 0000 - 0x4002 03FF GPIOA 0x4001 5800- 0x4001 FFFF Reserved Table 10. STM32F40x register boundary addresses (continued) Bus Boundary address Peripheral Memory mapping STM32F405xx, STM32F407xx 72/185 DocID022152 Rev 4 APB2 0x4001 4C00 - 0x4001 57FF Reserved 0x4001 4800 - 0x4001 4BFF TIM11 0x4001 4400 - 0x4001 47FF TIM10 0x4001 4000 - 0x4001 43FF TIM9 0x4001 3C00 - 0x4001 3FFF EXTI 0x4001 3800 - 0x4001 3BFF SYSCFG 0x4001 3400 - 0x4001 37FF Reserved 0x4001 3000 - 0x4001 33FF SPI1 0x4001 2C00 - 0x4001 2FFF SDIO 0x4001 2400 - 0x4001 2BFF Reserved 0x4001 2000 - 0x4001 23FF ADC1 - ADC2 - ADC3 0x4001 1800 - 0x4001 1FFF Reserved 0x4001 1400 - 0x4001 17FF USART6 0x4001 1000 - 0x4001 13FF USART1 0x4001 0800 - 0x4001 0FFF Reserved 0x4001 0400 - 0x4001 07FF TIM8 0x4001 0000 - 0x4001 03FF TIM1 0x4000 7800- 0x4000 FFFF Reserved Table 10. STM32F40x register boundary addresses (continued) Bus Boundary address Peripheral DocID022152 Rev 4 73/185 STM32F405xx, STM32F407xx Memory mapping APB1 0x4000 7800 - 0x4000 7FFF Reserved 0x4000 7400 - 0x4000 77FF DAC 0x4000 7000 - 0x4000 73FF PWR 0x4000 6C00 - 0x4000 6FFF Reserved 0x4000 6800 - 0x4000 6BFF CAN2 0x4000 6400 - 0x4000 67FF CAN1 0x4000 6000 - 0x4000 63FF Reserved 0x4000 5C00 - 0x4000 5FFF I2C3 0x4000 5800 - 0x4000 5BFF I2C2 0x4000 5400 - 0x4000 57FF I2C1 0x4000 5000 - 0x4000 53FF UART5 0x4000 4C00 - 0x4000 4FFF UART4 0x4000 4800 - 0x4000 4BFF USART3 0x4000 4400 - 0x4000 47FF USART2 0x4000 4000 - 0x4000 43FF I2S3ext 0x4000 3C00 - 0x4000 3FFF SPI3 / I2S3 0x4000 3800 - 0x4000 3BFF SPI2 / I2S2 0x4000 3400 - 0x4000 37FF I2S2ext 0x4000 3000 - 0x4000 33FF IWDG 0x4000 2C00 - 0x4000 2FFF WWDG 0x4000 2800 - 0x4000 2BFF RTC & BKP Registers 0x4000 2400 - 0x4000 27FF Reserved 0x4000 2000 - 0x4000 23FF TIM14 0x4000 1C00 - 0x4000 1FFF TIM13 0x4000 1800 - 0x4000 1BFF TIM12 0x4000 1400 - 0x4000 17FF TIM7 0x4000 1000 - 0x4000 13FF TIM6 0x4000 0C00 - 0x4000 0FFF TIM5 0x4000 0800 - 0x4000 0BFF TIM4 0x4000 0400 - 0x4000 07FF TIM3 0x4000 0000 - 0x4000 03FF TIM2 Table 10. STM32F40x register boundary addresses (continued) Bus Boundary address Peripheral Electrical characteristics STM32F405xx, STM32F407xx 74/185 DocID022152 Rev 4 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to VSS. 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA = 25 °C and TA = TAmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean±3Σ). 5.1.2 Typical values Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 3.3 V (for the 1.8 V ≤ VDD ≤ 3.6 V voltage range). They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean±2Σ). 5.1.3 Typical curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 5.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in Figure 19. 5.1.5 Pin input voltage The input voltage measurement on a pin of the device is described in Figure 20. Figure 19. Pin loading conditions Figure 20. Pin input voltage MS19011V1 C = 50 pF STM32F pin OSC_OUT (Hi-Z when using HSE or LSE) MS19010V1 STM32F pin VIN OSC_OUT (Hi-Z when using HSE or LSE) DocID022152 Rev 4 75/185 STM32F405xx, STM32F407xx Electrical characteristics 5.1.6 Power supply scheme Figure 21. Power supply scheme 1. Each power supply pair must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure the good functionality of the device. 2. To connect BYPASS_REG and PDR_ON pins, refer to Section 2.2.16: Voltage regulator and Table 2.2.15: Power supply supervisor. 3. The two 2.2 μF ceramic capacitors should be replaced by two 100 nF decoupling capacitors when the voltage regulator is OFF. 4. The 4.7 μF ceramic capacitor must be connected to one of the VDD pin. 5. VDDA=VDD and VSSA=VSS. MS19911V2 Backup circuitry (OSC32K,RTC, Wakeup logic Backup registers, backup RAM) Kernel logic (CPU, digital & RAM) Analog: RCs, PLL,.. Power switch VBAT GPIOs OUT IN 15 × 100 nF + 1 × 4.7 μF VBAT = 1.65 to 3.6V Voltage regulator VDDA ADC Level shifter IO Logic VDD 100 nF + 1 μF Flash memory VCAP_1 2 × 2.2 μF VCAP_2 BYPASS_REG PDR_ON Reset controller VDD 1/2/...14/15 VSS 1/2/...14/15 VDD VREF+ VREFVSSA VREF 100 nF + 1 μF Electrical characteristics STM32F405xx, STM32F407xx 76/185 DocID022152 Rev 4 5.1.7 Current consumption measurement Figure 22. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 11: Voltage characteristics, Table 12: Current characteristics, and Table 13: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. ai14126 VBAT VDD VDDA IDD_VBAT IDD Table 11. Voltage characteristics Symbol Ratings Min Max Unit VDD–VSS External main supply voltage (including VDDA, VDD)(1) 1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. –0.3 4.0 V VIN Input voltage on five-volt tolerant pin(2) 2. VIN maximum value must always be respected. Refer to Table 12 for the values of the maximum allowed injected current. VSS–0.3 VDD+4 Input voltage on any other pin VSS–0.3 4.0 |ΔVDDx| Variations between different VDD power pins - 50 mV |VSSX − VSS| Variations between all the different ground pins - 50 VESD(HBM) Electrostatic discharge voltage (human body model) see Section 5.3.14: Absolute maximum ratings (electrical sensitivity) DocID022152 Rev 4 77/185 STM32F405xx, STM32F407xx Electrical characteristics 5.3 Operating conditions 5.3.1 General operating conditions Table 12. Current characteristics Symbol Ratings Max. Unit IVDD Total current into VDD power lines (source)(1) 1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. 150 mA IVSS Total current out of VSS ground lines (sink)(1) 150 IIO Output current sunk by any I/O and control pin 25 Output current source by any I/Os and control pin 25 IINJ(PIN) (2) 2. Negative injection disturbs the analog performance of the device. See note in Section 5.3.20: 12-bit ADC characteristics. Injected current on five-volt tolerant I/O(3) 3. Positive injection is not possible on these I/Os. A negative injection is induced by VINVDD while a negative injection is induced by VIN 25 MHz. 4. When the ADC is ON (ADON bit set in the ADC_CR2 register), add an additional power consumption of 1.6 mA per ADC for the analog part. 5. When analog peripheral blocks such as ADCs, DACs, HSE, LSE, HSI, or LSI are ON, an additional power consumption should be considered. 6. In this case HCLK = system clock/2. Electrical characteristics STM32F405xx, STM32F407xx 84/185 DocID022152 Rev 4 Table 21. Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator disabled) Symbol Parameter Conditions fHCLK Typ Max(1) Unit TA = 25 °C TA = 85 °C TA = 105 °C IDD Supply current in Run mode External clock(2), all peripherals enabled(3)(4) 168 MHz 93 109 117 mA 144 MHz 76 89 96 120 MHz 67 79 86 90 MHz 53 65 73 60 MHz 37 49 56 30 MHz 20 32 39 25 MHz 16 27 35 16 MHz 11 23 30 8 MHz 6 18 25 4 MHz 4 16 23 2 MHz 3 15 22 External clock(2), all peripherals disabled(3)(4) 168 MHz 46 61 69 144 MHz 40 52 60 120 MHz 37 48 56 90 MHz 30 42 50 60 MHz 22 33 41 30 MHz 12 24 31 25 MHz 10 21 29 16 MHz 7 19 26 8 MHz 4 16 23 4 MHz 3 15 22 2 MHz 2 14 21 1. Based on characterization, tested in production at VDD max and fHCLK max with peripherals enabled. 2. External clock is 4 MHz and PLL is on when fHCLK > 25 MHz. 3. When analog peripheral blocks such as (ADCs, DACs, HSE, LSE, HSI,LSI) are on, an additional power consumption should be considered. 4. When the ADC is ON (ADON bit set in the ADC_CR2 register), add an additional power consumption of 1.6 mA per ADC for the analog part. DocID022152 Rev 4 85/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 24. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator ON) or RAM, and peripherals OFF Figure 25. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator ON) or RAM, and peripherals ON MS19974V1 0 5 10 15 20 25 30 35 40 45 50 0 20 40 60 80 100 120 140 160 180 IDD RUN( mA) CPU Frequency (MHz -45 °C 0 °C 25 °C 55 °C 85 °C 105 °C MS19975V1 0 10 20 30 40 50 60 70 80 90 100 0 20 40 60 80 100 120 140 160 180 IDD RUN( mA) CPU Frequency (MHz -45°C 0°C 25°C 55°C 85°C 105°C Electrical characteristics STM32F405xx, STM32F407xx 86/185 DocID022152 Rev 4 Figure 26. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator OFF) or RAM, and peripherals OFF Figure 27. Typical current consumption versus temperature, Run mode, code with data processing running from Flash (ART accelerator OFF) or RAM, and peripherals ON MS19976V1 0 10 20 30 40 50 60 0 20 40 60 80 100 120 140 160 180 IDD RUN( mA) CPU Frequency (MHz -45°C 0°C 25°C 55°C 85°C 105°C MS19977V1 0 20 40 60 80 100 120 0 20 40 60 80 100 120 140 160 180 IDD RUN( mA) CPU Frequency (MHz -45°C 0°C 25°C 55°C 85°C 105°C DocID022152 Rev 4 87/185 STM32F405xx, STM32F407xx Electrical characteristics Table 22. Typical and maximum current consumption in Sleep mode Symbol Parameter Conditions fHCLK Typ Max(1) T Unit A = 25 °C TA = 85 °C TA = 105 °C IDD Supply current in Sleep mode External clock(2), all peripherals enabled(3) 168 MHz 59 77 84 mA 144 MHz 46 61 67 120 MHz 38 53 60 90 MHz 30 44 51 60 MHz 20 34 41 30 MHz 11 24 31 25 MHz 8 21 28 16 MHz 6 18 25 8 MHz 3 16 23 4 MHz 2 15 22 2 MHz 2 14 21 External clock(2), all peripherals disabled 168 MHz 12 27 35 144 MHz 9 22 29 120 MHz 8 20 28 90 MHz 7 19 26 60 MHz 5 17 24 30 MHz 3 16 23 25 MHz 2 15 22 16 MHz 2 14 21 8 MHz 1 14 21 4 MHz 1 13 21 2 MHz 1 13 21 1. Based on characterization, tested in production at VDD max and fHCLK max with peripherals enabled. 2. External clock is 4 MHz and PLL is on when fHCLK > 25 MHz. 3. Add an additional power consumption of 1.6 mA per ADC for the analog part. In applications, this consumption occurs only while the ADC is ON (ADON bit is set in the ADC_CR2 register). Electrical characteristics STM32F405xx, STM32F407xx 88/185 DocID022152 Rev 4 Table 23. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Typ Max T Unit A = 25 °C TA = 25 °C TA = 85 °C TA = 105 °C IDD_STOP Supply current in Stop mode with main regulator in Run mode Flash in Stop mode, low-speed and highspeed internal RC oscillators and high-speed oscillator OFF (no independent watchdog) 0.45 1.5 11.00 20.00 mA Flash in Deep power down mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog) 0.40 1.5 11.00 20.00 Supply current in Stop mode with main regulator in Low Power mode Flash in Stop mode, low-speed and highspeed internal RC oscillators and high-speed oscillator OFF (no independent watchdog) 0.31 1.1 8.00 15.00 Flash in Deep power down mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog) 0.28 1.1 8.00 15.00 Table 24. Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Typ Max(1) TA = 25 °C Unit TA = 85 °C TA = 105 °C VDD = 1.8 V VDD= 2.4 V VDD = 3.3 V VDD = 3.6 V IDD_STBY Supply current in Standby mode Backup SRAM ON, lowspeed oscillator and RTC ON 3.0 3.4 4.0 20 36 μA Backup SRAM OFF, lowspeed oscillator and RTC ON 2.4 2.7 3.3 16 32 Backup SRAM ON, RTC OFF 2.4 2.6 3.0 12.5 24.8 Backup SRAM OFF, RTC OFF 1.7 1.9 2.2 9.8 19.2 1. Based on characterization, not tested in production. DocID022152 Rev 4 89/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 28. Typical VBAT current consumption (LSE and RTC ON/backup RAM OFF) Table 25. Typical and maximum current consumptions in VBAT mode Symbol Parameter Conditions Typ Max(1) Unit TA = 25 °C TA = 85 °C TA = 105 °C VBAT = 1.8 V VBAT= 2.4 V VBAT = 3.3 V VBAT = 3.6 V IDD_VBA T Backup domain supply current Backup SRAM ON, low-speed oscillator and RTC ON 1.29 1.42 1.68 6 11 μA Backup SRAM OFF, low-speed oscillator and RTC ON 0.62 0.73 0.96 3 5 Backup SRAM ON, RTC OFF 0.79 0.81 0.86 5 10 Backup SRAM OFF, RTC OFF 0.10 0.10 0.10 2 4 1. Based on characterization, not tested in production. MS19990V1 0 0.5 1 1.5 2 2.5 3 3.5 0 10 20 30 40 50 60 70 80 90 100 IVBAT in (μA) Temperature in (°C) 1.65V 1.8V 2V 2.4V 2.7V 3V 3.3V 3.6V Electrical characteristics STM32F405xx, STM32F407xx 90/185 DocID022152 Rev 4 Figure 29. Typical VBAT current consumption (LSE and RTC ON/backup RAM ON) I/O system current consumption The current consumption of the I/O system has two components: static and dynamic. I/O static current consumption All the I/Os used as inputs with pull-up generate current consumption when the pin is externally held low. The value of this current consumption can be simply computed by using the pull-up/pull-down resistors values given in Table 47: I/O static characteristics. For the output pins, any external pull-down or external load must also be considered to estimate the current consumption. Additional I/O current consumption is due to I/Os configured as inputs if an intermediate voltage level is externally applied. This current consumption is caused by the input Schmitt trigger circuits used to discriminate the input value. Unless this specific configuration is required by the application, this supply current consumption can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should be configured as analog inputs. Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently, as a result of external electromagnetic noise. To avoid current consumption related to floating pins, they must either be configured in analog mode, or forced internally to a definite digital value. This can be done either by using pull-up/down resistors or by configuring the pins in output mode. I/O dynamic current consumption In addition to the internal peripheral current consumption measured previously (see Table 27: Peripheral current consumption), the I/Os used by an application also contribute to the current consumption. When an I/O pin switches, it uses the current from the MCU MS19991V1 0 1 2 3 4 5 6 0 10 20 30 40 50 60 70 80 90 100 IVBAT in (μA) Temperature in (°C) 1.65V 1.8V 2V 2.4V 2.7V 3V 3.3V 3.6V DocID022152 Rev 4 91/185 STM32F405xx, STM32F407xx Electrical characteristics supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load (internal or external) connected to the pin: where ISW is the current sunk by a switching I/O to charge/discharge the capacitive load VDD is the MCU supply voltage fSW is the I/O switching frequency C is the total capacitance seen by the I/O pin: C = CINT+ CEXT The test pin is configured in push-pull output mode and is toggled by software at a fixed frequency. ISW = VDD × fSW × C Electrical characteristics STM32F405xx, STM32F407xx 92/185 DocID022152 Rev 4 Table 26. Switching output I/O current consumption Symbol Parameter Conditions(1) I/O toggling frequency (fSW) Typ Unit IDDIO I/O switching current VDD = 3.3 V(2) C = CINT 2 MHz 0.02 mA 8 MHz 0.14 25 MHz 0.51 50 MHz 0.86 60 MHz 1.30 VDD = 3.3 V CEXT = 0 pF C = CINT + CEXT+ CS 2 MHz 0.10 8 MHz 0.38 25 MHz 1.18 50 MHz 2.47 60 MHz 2.86 VDD = 3.3 V CEXT = 10 pF C = CINT + CEXT+ CS 2 MHz 0.17 8 MHz 0.66 25 MHz 1.70 50 MHz 2.65 60 MHz 3.48 VDD = 3.3 V CEXT = 22 pF C = CINT + CEXT+ CS 2 MHz 0.23 8 MHz 0.95 25 MHz 3.20 50 MHz 4.69 60 MHz 8.06 VDD = 3.3 V CEXT = 33 pF C = CINT + CEXT+ CS 2 MHz 0.30 8 MHz 1.22 25 MHz 3.90 50 MHz 8.82 60 MHz -(3) 1. CS is the PCB board capacitance including the pad pin. CS = 7 pF (estimated value). 2. This test is performed by cutting the LQFP package pin (pad removal). 3. At 60 MHz, C maximum load is specified 30 pF. DocID022152 Rev 4 93/185 STM32F405xx, STM32F407xx Electrical characteristics On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in Table 27. The MCU is placed under the following conditions: • At startup, all I/O pins are configured as analog pins by firmware. • All peripherals are disabled unless otherwise mentioned • The code is running from Flash memory and the Flash memory access time is equal to 5 wait states at 168 MHz. • The code is running from Flash memory and the Flash memory access time is equal to 4 wait states at 144 MHz, and the power scale mode is set to 2. • ART accelerator and Cache off. • The given value is calculated by measuring the difference of current consumption – with all peripherals clocked off – with one peripheral clocked on (with only the clock applied) • When the peripherals are enabled: HCLK is the system clock, fPCLK1 = fHCLK/4, and fPCLK2 = fHCLK/2. • The typical values are obtained for VDD = 3.3 V and TA= 25 °C, unless otherwise specified. Table 27. Peripheral current consumption Peripheral(1) 168 MHz 144 MHz Unit AHB1 GPIO A 0.49 0.36 mA GPIO B 0.45 0.33 GPIO C 0.45 0.34 GPIO D 0.45 0.34 GPIO E 0.47 0.35 GPIO F 0.45 0.33 GPIO G 0.44 0.33 GPIO H 0.45 0.34 GPIO I 0.44 0.33 OTG_HS + ULPI 4.57 3.55 CRC 0.07 0.06 BKPSRAM 0.11 0.08 DMA1 6.15 4.75 DMA2 6.24 4.8 ETH_MAC + ETH_MAC_TX ETH_MAC_RX ETH_MAC_PTP 3.28 2.54 AHB2 OTG_FS 4.59 3.69 mA DCMI 1.04 0.80 Electrical characteristics STM32F405xx, STM32F407xx 94/185 DocID022152 Rev 4 AHB3 FSMC 2.18 1.67 mA APB1 TIM2 0.80 0.61 TIM3 0.58 0.44 TIM4 0.62 0.48 TIM5 0.79 0.61 TIM6 0.15 0.11 TIM7 0.16 0.12 TIM12 0.33 0.26 TIM13 0.27 0.21 TIM14 0.27 0.21 PWR 0.04 0.03 USART2 0.17 0.13 USART3 0.17 0.13 UART4 0.17 0.13 UART5 0.17 0.13 I2C1 0.17 0.13 I2C2 0.18 0.13 I2C3 0.18 0.13 SPI2/I2S2(2) 0.17/0.16 0.13/0.12 SPI3/I2S3(2) 0.16/0.14 0.12/0.12 CAN1 0.27 0.21 CAN2 0.26 0.20 DAC 0.14 0.10 DAC channel 1(3) 0.91 0.89 DAC channel 2(4) 0.91 0.89 DAC channel 1 and 2(3)(4) 1.69 1.68 WWDG 0.04 0.04 Table 27. Peripheral current consumption (continued) Peripheral(1) 168 MHz 144 MHz Unit DocID022152 Rev 4 95/185 STM32F405xx, STM32F407xx Electrical characteristics 5.3.7 Wakeup time from low-power mode The wakeup times given in Table 28 is measured on a wakeup phase with a 16 MHz HSI RC oscillator. The clock source used to wake up the device depends from the current operating mode: • Stop or Standby mode: the clock source is the RC oscillator • Sleep mode: the clock source is the clock that was set before entering Sleep mode. All timings are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 14. APB2 SDIO 0.64 0.54 mA TIM1 1.47 1.14 TIM8 1.58 1.22 TIM9 0.68 0.54 TIM10 0.45 0.36 TIM11 0.47 0.38 ADC1(5) 2.20 2.10 ADC2(5) 2.04 1.93 ADC3(5) 2.10 2.00 SPI1 0.14 0.12 USART1 0.34 0.27 USART6 0.34 0.28 1. HSE oscillator with 4 MHz crystal and PLL are ON. 2. I2SMOD bit set in SPI_I2SCFGR register, and then the I2SE bit set to enable I2S peripheral. 3. EN1 bit is set in DAC_CR register. 4. EN2 bit is set in DAC_CR register. 5. ADON bit set in ADC_CR2 register. Table 27. Peripheral current consumption (continued) Peripheral(1) 168 MHz 144 MHz Unit Table 28. Low-power mode wakeup timings Symbol Parameter Min(1) Typ(1) Max(1) Unit tWUSLEEP (2) Wakeup from Sleep mode - 1 - μs tWUSTOP (2) Wakeup from Stop mode (regulator in Run mode) - 13 - Wakeup from Stop mode (regulator in low power mode) - 17 40 μs Wakeup from Stop mode (regulator in low power mode and Flash memory in Deep power down mode) - 110 - tWUSTDBY (2)(3) Wakeup from Standby mode 260 375 480 μs 1. Based on characterization, not tested in production. 2. The wakeup times are measured from the wakeup event to the point in which the application code reads the first instruction. 3. tWUSTDBY minimum and maximum values are given at 105 °C and –45 °C, respectively. Electrical characteristics STM32F405xx, STM32F407xx 96/185 DocID022152 Rev 4 5.3.8 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in Table 29 result from tests performed using an high-speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table 14. Low-speed external user clock generated from an external source The characteristics given in Table 30 result from tests performed using an low-speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table 14. Table 29. High-speed external user clock characteristics Symbol Parameter Conditions Min Typ Max Unit fHSE_ext External user clock source frequency(1) 1 - 50 MHz VHSEH OSC_IN input pin high level voltage 0.7VDD - VDD V VHSEL OSC_IN input pin low level voltage VSS - 0.3VDD tw(HSE) tw(HSE) OSC_IN high or low time(1) 1. Guaranteed by design, not tested in production. 5 - - ns tr(HSE) tf(HSE) OSC_IN rise or fall time(1) - - 10 Cin(HSE) OSC_IN input capacitance(1) - 5 - pF DuCy(HSE) Duty cycle 45 - 55 % IL OSC_IN Input leakage current VSS ≤ VIN ≤ VDD - - ±1 μA Table 30. Low-speed external user clock characteristics Symbol Parameter Conditions Min Typ Max Unit fLSE_ext User External clock source frequency(1) - 32.768 1000 kHz VLSEH OSC32_IN input pin high level voltage 0.7VDD - VDD V VLSEL OSC32_IN input pin low level voltage VSS - 0.3VDD tw(LSE) tf(LSE) OSC32_IN high or low time(1) 450 - - ns tr(LSE) tf(LSE) OSC32_IN rise or fall time(1) - - 50 Cin(LSE) OSC32_IN input capacitance(1) - 5 - pF DuCy(LSE) Duty cycle 30 - 70 % IL OSC32_IN Input leakage current VSS ≤ VIN ≤ VDD - - ±1 μA 1. Guaranteed by design, not tested in production. DocID022152 Rev 4 97/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 30. High-speed external clock source AC timing diagram Figure 31. Low-speed external clock source AC timing diagram High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with a 4 to 26 MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 31. In the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and startup stabilization time. Refer to the crystal resonator manufacturer for more details on the resonator characteristics (frequency, package, accuracy). ai17528 OSC_IN External STM32F clock source VHSEH tf(HSE) tW(HSE) IL 90% 10% THSE tr(HSE) tW(HSE) t fHSE_ext VHSEL ai17529 External OSC32_IN STM32F clock source VLSEH tf(LSE) tW(LSE) IL 90% 10% TLSE tr(LSE) tW(LSE) t fLSE_ext VLSEL Electrical characteristics STM32F405xx, STM32F407xx 98/185 DocID022152 Rev 4 For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the 5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match the requirements of the crystal or resonator (see Figure 32). CL1 and CL2 are usually the same size. The crystal manufacturer typically specifies a load capacitance which is the series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF can be used as a rough estimate of the combined pin and board capacitance) when sizing CL1 and CL2. Note: For information on electing the crystal, refer to the application note AN2867 “Oscillator design guide for ST microcontrollers” available from the ST website www.st.com. Figure 32. Typical application with an 8 MHz crystal 1. REXT value depends on the crystal characteristics. Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 32. In the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and startup stabilization time. Refer to the crystal resonator manufacturer for more details on the resonator characteristics (frequency, package, accuracy). Table 31. HSE 4-26 MHz oscillator characteristics(1) (2) 1. Resonator characteristics given by the crystal/ceramic resonator manufacturer. 2. Based on characterization, not tested in production. Symbol Parameter Conditions Min Typ Max Unit fOSC_IN Oscillator frequency 4 - 26 MHz RF Feedback resistor - 200 - kΩ IDD HSE current consumption VDD=3.3 V, ESR= 30 Ω, CL=5 pF@25 MHz - 449 - μA VDD=3.3 V, ESR= 30 Ω, CL=10 pF@25 MHz - 532 - gm Oscillator transconductance Startup 5 - - mA/V tSU(HSE (3) 3. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer Startup time VDD is stabilized - 2 - ms ai17530 OSC_OUT OSC_IN fHSE CL1 RF STM32F 8 MHz resonator Resonator with integrated capacitors Bias controlled gain CL2 REXT(1) DocID022152 Rev 4 99/185 STM32F405xx, STM32F407xx Electrical characteristics Note: For information on electing the crystal, refer to the application note AN2867 “Oscillator design guide for ST microcontrollers” available from the ST website www.st.com. Figure 33. Typical application with a 32.768 kHz crystal 5.3.9 Internal clock source characteristics The parameters given in Table 33 and Table 34 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 14. High-speed internal (HSI) RC oscillator Table 32. LSE oscillator characteristics (fLSE = 32.768 kHz) (1) 1. Guaranteed by design, not tested in production. Symbol Parameter Conditions Min Typ Max Unit RF Feedback resistor - 18.4 - MΩ IDD LSE current consumption - - 1 μA gm Oscillator Transconductance 2.8 - - μA/V tSU(LSE) (2) 2. tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 32.768 kHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer startup time VDD is stabilized - 2 - s ai17531 OSC32_OUT OSC32_IN fLSE CL1 RF STM32F 32.768 kHz resonator Resonator with integrated capacitors Bias controlled gain CL2 Table 33. HSI oscillator characteristics (1) Symbol Parameter Conditions Min Typ Max Unit fHSI Frequency - 16 - MHz ACCHSI Accuracy of the HSI oscillator User-trimmed with the RCC_CR register - - 1 % Factorycalibrated TA = –40 to 105 °C(2) –8 - 4.5 % TA = –10 to 85 °C(2) –4 - 4 % TA = 25 °C –1 - 1 % tsu(HSI) (3) HSI oscillator startup time - 2.2 4 μs IDD(HSI) HSI oscillator power consumption - 60 80 μA Electrical characteristics STM32F405xx, STM32F407xx 100/185 DocID022152 Rev 4 Low-speed internal (LSI) RC oscillator Figure 34. ACCLSI versus temperature 5.3.10 PLL characteristics The parameters given in Table 35 and Table 36 are derived from tests performed under temperature and VDD supply voltage conditions summarized in Table 14. 1. VDD = 3.3 V, TA = –40 to 105 °C unless otherwise specified. 2. Based on characterization, not tested in production. 3. Guaranteed by design, not tested in production. Table 34. LSI oscillator characteristics (1) 1. VDD = 3 V, TA = –40 to 105 °C unless otherwise specified. Symbol Parameter Min Typ Max Unit fLSI (2) 2. Based on characterization, not tested in production. Frequency 17 32 47 kHz tsu(LSI) (3) 3. Guaranteed by design, not tested in production. LSI oscillator startup time - 15 40 μs IDD(LSI) (3) LSI oscillator power consumption - 0.4 0.6 μA MS19013V1 -40 -30 -20 -10 0 10 20 30 40 50 -45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95 105 Normalized deviati on (%) Temperature (°C) max avg min DocID022152 Rev 4 101/185 STM32F405xx, STM32F407xx Electrical characteristics Table 35. Main PLL characteristics Symbol Parameter Conditions Min Typ Max Unit fPLL_IN PLL input clock(1) 0.95(2) 1 2.10 MHz fPLL_OUT PLL multiplier output clock 24 - 168 MHz fPLL48_OUT 48 MHz PLL multiplier output clock - 48 75 MHz fVCO_OUT PLL VCO output 192 - 432 MHz tLOCK PLL lock time VCO freq = 192 MHz 75 - 200 μs VCO freq = 432 MHz 100 - 300 Jitter(3) Cycle-to-cycle jitter System clock 120 MHz RMS - 25 - ps peak to peak - ±150 - Period Jitter RMS - 15 - peak to peak - ±200 - Main clock output (MCO) for RMII Ethernet Cycle to cycle at 50 MHz on 1000 samples - 32 - Main clock output (MCO) for MII Ethernet Cycle to cycle at 25 MHz on 1000 samples - 40 - Bit Time CAN jitter Cycle to cycle at 1 MHz on 1000 samples - 330 - IDD(PLL) (4) PLL power consumption on VDD VCO freq = 192 MHz VCO freq = 432 MHz 0.15 0.45 - 0.40 0.75 mA IDDA(PLL) (4) PLL power consumption on VDDA VCO freq = 192 MHz VCO freq = 432 MHz 0.30 0.55 - 0.40 0.85 mA 1. Take care of using the appropriate division factor M to obtain the specified PLL input clock values. The M factor is shared between PLL and PLLI2S. 2. Guaranteed by design, not tested in production. 3. The use of 2 PLLs in parallel could degraded the Jitter up to +30%. 4. Based on characterization, not tested in production. Table 36. PLLI2S (audio PLL) characteristics Symbol Parameter Conditions Min Typ Max Unit fPLLI2S_IN PLLI2S input clock(1) 0.95(2) 1 2.10 MHz fPLLI2S_OUT PLLI2S multiplier output clock - - 216 MHz fVCO_OUT PLLI2S VCO output 192 - 432 MHz tLOCK PLLI2S lock time VCO freq = 192 MHz 75 - 200 μs VCO freq = 432 MHz 100 - 300 Electrical characteristics STM32F405xx, STM32F407xx 102/185 DocID022152 Rev 4 5.3.11 PLL spread spectrum clock generation (SSCG) characteristics The spread spectrum clock generation (SSCG) feature allows to reduce electromagnetic interferences (see Table 43: EMI characteristics). It is available only on the main PLL. Equation 1 The frequency modulation period (MODEPER) is given by the equation below: fPLL_IN and fMod must be expressed in Hz. As an example: If fPLL_IN = 1 MHz, and fMOD = 1 kHz, the modulation depth (MODEPER) is given by equation 1: Jitter(3) Master I2S clock jitter Cycle to cycle at 12.288 MHz on 48KHz period, N=432, R=5 RMS - 90 - peak to peak - ±280 - ps Average frequency of 12.288 MHz N = 432, R = 5 on 1000 samples - 90 - ps WS I2S clock jitter Cycle to cycle at 48 KHz on 1000 samples - 400 - ps IDD(PLLI2S) (4) PLLI2S power consumption on VDD VCO freq = 192 MHz VCO freq = 432 MHz 0.15 0.45 - 0.40 0.75 mA IDDA(PLLI2S) (4) PLLI2S power consumption on VDDA VCO freq = 192 MHz VCO freq = 432 MHz 0.30 0.55 - 0.40 0.85 mA 1. Take care of using the appropriate division factor M to have the specified PLL input clock values. 2. Guaranteed by design, not tested in production. 3. Value given with main PLL running. 4. Based on characterization, not tested in production. Table 36. PLLI2S (audio PLL) characteristics (continued) Symbol Parameter Conditions Min Typ Max Unit Table 37. SSCG parameters constraint Symbol Parameter Min Typ Max(1) Unit fMod Modulation frequency - - 10 KHz md Peak modulation depth 0.25 - 2 % MODEPER * INCSTEP - - 215−1 - 1. Guaranteed by design, not tested in production. MODEPER = round[fPLL_IN ⁄ (4 × fMod)] MODEPER round 106 4 10 3 = [ ⁄ ( × )] = 250 DocID022152 Rev 4 103/185 STM32F405xx, STM32F407xx Electrical characteristics Equation 2 Equation 2 allows to calculate the increment step (INCSTEP): fVCO_OUT must be expressed in MHz. With a modulation depth (md) = ±2 % (4 % peak to peak), and PLLN = 240 (in MHz): An amplitude quantization error may be generated because the linear modulation profile is obtained by taking the quantized values (rounded to the nearest integer) of MODPER and INCSTEP. As a result, the achieved modulation depth is quantized. The percentage quantized modulation depth is given by the following formula: As a result: Figure 35 and Figure 36 show the main PLL output clock waveforms in center spread and down spread modes, where: F0 is fPLL_OUT nominal. Tmode is the modulation period. md is the modulation depth. Figure 35. PLL output clock waveforms in center spread mode INCSTEP = round[((215 – 1) × md × PLLN) ⁄ (100 × 5 × MODEPER)] INCSTEP = round[((215 – 1) × 2 × 240) ⁄ (100 × 5 × 250)] = 126md(quantitazed)% mdquantized% = (MODEPER × INCSTEP × 100 × 5) ⁄ ((215 – 1) × PLLN) mdquantized% = (250 × 126 × 100 × 5) ⁄ ((215 – 1) × 240) = 2.002%(peak) Frequency (PLL_OUT) Time F0 tmode md ai17291 md 2 x tmode Electrical characteristics STM32F405xx, STM32F407xx 104/185 DocID022152 Rev 4 Figure 36. PLL output clock waveforms in down spread mode 5.3.12 Memory characteristics Flash memory The characteristics are given at TA = –40 to 105 °C unless otherwise specified. The devices are shipped to customers with the Flash memory erased. Time ai17292 Frequency (PLL_OUT) F0 2 x md tmode 2 x tmode Table 38. Flash memory characteristics Symbol Parameter Conditions Min Typ Max Unit IDD Supply current Write / Erase 8-bit mode, VDD = 1.8 V - 5 - Write / Erase 16-bit mode, VDD = 2.1 V - 8 - mA Write / Erase 32-bit mode, VDD = 3.3 V - 12 - Table 39. Flash memory programming Symbol Parameter Conditions Min(1) Typ Max(1) Unit tprog Word programming time Program/erase parallelism (PSIZE) = x 8/16/32 - 16 100(2) μs tERASE16KB Sector (16 KB) erase time Program/erase parallelism (PSIZE) = x 8 - 400 800 Program/erase parallelism ms (PSIZE) = x 16 - 300 600 Program/erase parallelism (PSIZE) = x 32 - 250 500 DocID022152 Rev 4 105/185 STM32F405xx, STM32F407xx Electrical characteristics tERASE64KB Sector (64 KB) erase time Program/erase parallelism (PSIZE) = x 8 - 1200 2400 Program/erase parallelism ms (PSIZE) = x 16 - 700 1400 Program/erase parallelism (PSIZE) = x 32 - 550 1100 tERASE128KB Sector (128 KB) erase time Program/erase parallelism (PSIZE) = x 8 - 2 4 Program/erase parallelism s (PSIZE) = x 16 - 1.3 2.6 Program/erase parallelism (PSIZE) = x 32 - 1 2 tME Mass erase time Program/erase parallelism (PSIZE) = x 8 - 16 32 Program/erase parallelism s (PSIZE) = x 16 - 11 22 Program/erase parallelism (PSIZE) = x 32 - 8 16 Vprog Programming voltage 32-bit program operation 2.7 - 3.6 V 16-bit program operation 2.1 - 3.6 V 8-bit program operation 1.8 - 3.6 V 1. Based on characterization, not tested in production. 2. The maximum programming time is measured after 100K erase operations. Table 39. Flash memory programming (continued) Symbol Parameter Conditions Min(1) Typ Max(1) Unit Electrical characteristics STM32F405xx, STM32F407xx 106/185 DocID022152 Rev 4 5.3.13 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: • Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard. • FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant with the IEC 61000-4-4 standard. Table 40. Flash memory programming with VPP Symbol Parameter Conditions Min(1) Typ Max(1) 1. Guaranteed by design, not tested in production. Unit tprog Double word programming TA = 0 to +40 °C VDD = 3.3 V VPP = 8.5 V - 16 100(2) 2. The maximum programming time is measured after 100K erase operations. μs tERASE16KB Sector (16 KB) erase time - 230 - tERASE64KB Sector (64 KB) erase time - 490 - ms tERASE128KB Sector (128 KB) erase time - 875 - tME Mass erase time - 6.9 - s Vprog Programming voltage 2.7 - 3.6 V VPP VPP voltage range 7 - 9 V IPP Minimum current sunk on the VPP pin 10 - - mA tVPP (3) 3. VPP should only be connected during programming/erasing. Cumulative time during which VPP is applied - - 1 hour Table 41. Flash memory endurance and data retention Symbol Parameter Conditions Value Unit Min(1) 1. Based on characterization, not tested in production. NEND Endurance TA = –40 to +85 °C (6 suffix versions) TA = –40 to +105 °C (7 suffix versions) 10 kcycles tRET Data retention 1 kcycle(2) at TA = 85 °C 2. Cycling performed over the whole temperature range. 30 1 kcycle(2) at TA = 105 °C 10 Years 10 kcycles(2) at TA = 55 °C 20 DocID022152 Rev 4 107/185 STM32F405xx, STM32F407xx Electrical characteristics A device reset allows normal operations to be resumed. The test results are given in Table 42. They are based on the EMS levels and classes defined in application note AN1709. Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations The software flowchart must include the management of runaway conditions such as: • Corrupted program counter • Unexpected reset • Critical Data corruption (control registers...) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Electromagnetic Interference (EMI) The electromagnetic field emitted by the device are monitored while a simple application, executing EEMBC? code, is running. This emission test is compliant with SAE IEC61967-2 standard which specifies the test board and the pin loading. Table 42. EMS characteristics Symbol Parameter Conditions Level/ Class VFESD Voltage limits to be applied on any I/O pin to induce a functional disturbance VDD = 3.3 V, LQFP176, TA = +25 °C, fHCLK = 168 MHz, conforms to IEC 61000-4-2 2B VEFTB Fast transient voltage burst limits to be applied through 100 pF on VDD and VSS pins to induce a functional disturbance VDD = 3.3 V, LQFP176, TA = +25 °C, fHCLK = 168 MHz, conforms to IEC 61000-4-2 4A Electrical characteristics STM32F405xx, STM32F407xx 108/185 DocID022152 Rev 4 5.3.14 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test conforms to the JESD22-A114/C101 standard. Static latchup Two complementary static tests are required on six parts to assess the latchup performance: • A supply overvoltage is applied to each power supply pin • A current injection is applied to each input, output and configurable I/O pin These tests are compliant with EIA/JESD 78A IC latchup standard. Table 43. EMI characteristics Symbol Parameter Conditions Monitored frequency band Max vs. [fHSE/fCPU] Unit 25/168 MHz SEMI Peak level VDD = 3.3 V, TA = 25 °C, LQFP176 package, conforming to SAE J1752/3 EEMBC, code running from Flash with ART accelerator enabled 0.1 to 30 MHz 32 30 to 130 MHz 25 dBμV 130 MHz to 1GHz 29 SAE EMI Level 4 - VDD = 3.3 V, TA = 25 °C, LQFP176 package, conforming to SAE J1752/3 EEMBC, code running from Flash with ART accelerator and PLL spread spectrum enabled 0.1 to 30 MHz 19 30 to 130 MHz 16 dBμV 130 MHz to 1GHz 18 SAE EMI level 3.5 - Table 44. ESD absolute maximum ratings Symbol Ratings Conditions Class Maximum value(1) Unit VESD(HBM) Electrostatic discharge voltage (human body model) TA = +25 °C conforming to JESD22-A114 2 2000(2) V VESD(CDM) Electrostatic discharge voltage (charge device model) TA = +25 °C conforming to JESD22-C101 II 500 1. Based on characterization results, not tested in production. 2. On VBAT pin, VESD(HBM) is limited to 1000 V. DocID022152 Rev 4 109/185 STM32F405xx, STM32F407xx Electrical characteristics 5.3.15 I/O current injection characteristics As a general rule, current injection to the I/O pins, due to external voltage below VSS or above VDD (for standard, 3 V-capable I/O pins) should be avoided during normal product operation. However, in order to give an indication of the robustness of the microcontroller in cases when abnormal injection accidentally happens, susceptibility tests are performed on a sample basis during device characterization. Functional susceptibilty to I/O current injection While a simple application is executed on the device, the device is stressed by injecting current into the I/O pins programmed in floating input mode. While current is injected into the I/O pin, one at a time, the device is checked for functional failures. The failure is indicated by an out of range parameter: ADC error above a certain limit (>5 LSB TUE), out of conventional limits of induced leakage current on adjacent pins (out of 5 uA/+0 uA range), or other functional failure (for example reset, oscillator frequency deviation). Negative induced leakage current is caused by negative injection and positive induced leakage current by positive injection. The test results are given in Table 46. 5.3.16 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 47 are derived from tests performed under the conditions summarized in Table 14. All I/Os are CMOS and TTL compliant. Table 45. Electrical sensitivities Symbol Parameter Conditions Class LU Static latch-up class TA = +105 °C conforming to JESD78A II level A Table 46. I/O current injection susceptibility Symbol Description Functional susceptibility Negative Unit injection Positive injection IINJ (1) 1. It is recommended to add a Schottky diode (pin to ground) to analog pins which may potentially inject negative currents. Injected current on all FT pins –5 +0 mA Injected current on any other pin –5 +5 Electrical characteristics STM32F405xx, STM32F407xx 110/185 DocID022152 Rev 4 All I/Os are CMOS and TTL compliant (no software configuration required). Their characteristics cover more than the strict CMOS-technology or TTL parameters. Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA (with a relaxed VOL/VOH) except PC13, PC14 and PC15 which can sink or source up to ±3mA. When using the PC13 to PC15 GPIOs in output mode, the speed should not exceed 2 MHz with a maximum load of 30 pF. Table 47. I/O static characteristics Symbol Parameter Conditions Min Typ Max Unit VIL Input low level voltage TTL ports 2.7 V ≤ VDD ≤ 3.6 V - - 0.8 V VIH (1) Input high level voltage 2.0 - - VIL Input low level voltage CMOS ports 1.8 V ≤ VDD ≤ 3.6 V - - 0.3VDD VIH (1) Input high level voltage 0.7VDD - - - - Vhys I/O Schmitt trigger voltage hysteresis(2) - 200 - IO FT Schmitt trigger voltage mV hysteresis(2) 5% VDD (3) - - Ilkg I/O input leakage current (4) VSS ≤ VIN ≤ VDD - - ±1 μA I/O FT input leakage current (4) VIN = 5 V - - 3 RPU Weak pull-up equivalent resistor(5) All pins except for PA10 and PB12 VIN = VSS 30 40 50 kΩ PA10 and PB12 8 11 15 RPD Weak pull-down equivalent resistor All pins except for PA10 and PB12 VIN = VDD 30 40 50 PA10 and PB12 8 11 15 CIO (6) I/O pin capacitance 5 pF 1. Tested in production. 2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization, not tested in production. 3. With a minimum of 100 mV. 4. Leakage could be higher than the maximum value, if negative current is injected on adjacent pins. 5. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This MOS/NMOS contribution to the series resistance is minimum (~10% order). 6. Guaranteed by design, not tested in production. DocID022152 Rev 4 111/185 STM32F405xx, STM32F407xx Electrical characteristics In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 5.2. In particular: • The sum of the currents sourced by all the I/Os on VDD, plus the maximum Run consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating IVDD (see Table 12). • The sum of the currents sunk by all the I/Os on VSS plus the maximum Run consumption of the MCU sunk on VSS cannot exceed the absolute maximum rating IVSS (see Table 12). Output voltage levels Unless otherwise specified, the parameters given in Table 48 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 14. All I/Os are CMOS and TTL compliant. Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 37 and Table 49, respectively. Table 48. Output voltage characteristics(1) 1. PC13, PC14, PC15 and PI8 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 and PI8 in output mode is limited: the speed should not exceed 2 MHz with a maximum load of 30 pF and these I/Os must not be used as a current source (e.g. to drive an LED). Symbol Parameter Conditions Min Max Unit VOL (2) 2. The IIO current sunk by the device must always respect the absolute maximum rating specified in Table 12 and the sum of IIO (I/O ports and control pins) must not exceed IVSS. Output low level voltage for an I/O pin when 8 pins are sunk at same time CMOS port IIO = +8 mA 2.7 V < VDD < 3.6 V - 0.4 V VOH (3) 3. The IIO current sourced by the device must always respect the absolute maximum rating specified in Table 12 and the sum of IIO (I/O ports and control pins) must not exceed IVDD. Output high level voltage for an I/O pin when 8 pins are sourced at same time VDD–0.4 - VOL (2) Output low level voltage for an I/O pin when 8 pins are sunk at same time TTL port IIO =+ 8mA 2.7 V < VDD < 3.6 V - 0.4 V VOH (3) Output high level voltage for an I/O pin when 8 pins are sourced at same time 2.4 - VOL (2)(4) 4. Based on characterization data, not tested in production. Output low level voltage for an I/O pin when 8 pins are sunk at same time IIO = +20 mA 2.7 V < VDD < 3.6 V - 1.3 V VOH (3)(4) Output high level voltage for an I/O pin when 8 pins are sourced at same time VDD–1.3 - VOL (2)(4) Output low level voltage for an I/O pin when 8 pins are sunk at same time IIO = +6 mA 2 V < VDD < 2.7 V - 0.4 V VOH (3)(4) Output high level voltage for an I/O pin when 8 pins are sourced at same time VDD–0.4 - Electrical characteristics STM32F405xx, STM32F407xx 112/185 DocID022152 Rev 4 Unless otherwise specified, the parameters given in Table 49 are derived from tests performed under the ambient temperature and VDD supply voltage conditions summarized in Table 14. Table 49. I/O AC characteristics(1)(2)(3) OSPEEDRy [1:0] bit value(1) Symbol Parameter Conditions Min Typ Max Unit 00 fmax(IO)out Maximum frequency(4) CL = 50 pF, VDD > 2.70 V - - 2 MHz CL = 50 pF, VDD > 1.8 V - - 2 CL = 10 pF, VDD > 2.70 V - - TBD CL = 10 pF, VDD > 1.8 V - - TBD tf(IO)out Output high to low level fall time CL = 50 pF, VDD = 1.8 V to 3.6 V - - TBD ns tr(IO)out Output low to high level rise time - - TBD 01 fmax(IO)out Maximum frequency(4) CL = 50 pF, VDD > 2.70 V - - 25 MHz CL = 50 pF, VDD > 1.8 V - - 12.5(5) CL = 10 pF, VDD > 2.70 V - - 50(5) CL = 10 pF, VDD > 1.8 V - - TBD tf(IO)out Output high to low level fall time CL = 50 pF, VDD < 2.7 V - - TBD ns CL = 10 pF, VDD > 2.7 V - - TBD tr(IO)out Output low to high level rise time CL = 50 pF, VDD < 2.7 V - - TBD CL = 10 pF, VDD > 2.7 V - - TBD 10 fmax(IO)out Maximum frequency(4) CL = 40 pF, VDD > 2.70 V - - 50(5) MHz CL = 40 pF, VDD > 1.8 V - - 25 CL = 10 pF, VDD > 2.70 V - - 100(5) CL = 10 pF, VDD > 1.8 V - - TBD tf(IO)out Output high to low level fall time CL = 50 pF, 2.4 < VDD < 2.7 V - - TBD CL = 10 pF, VDD > 2.7 V - - TBD ns tr(IO)out Output low to high level rise time CL = 50 pF, 2.4 < VDD < 2.7 V - - TBD CL = 10 pF, VDD > 2.7 V - - TBD DocID022152 Rev 4 113/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 37. I/O AC characteristics definition 5.3.17 NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor, RPU (see Table 47). Unless otherwise specified, the parameters given in Table 50 are derived from tests performed under the ambient temperature and VDD supply voltage conditions summarized in Table 14. 11 Fmax(IO)ou t Maximum frequency(4) CL = 30 pF, VDD > 2.70 V - - 100(5) MHz CL = 30 pF, VDD > 1.8 V - - 50(5) CL = 10 pF, VDD > 2.70 V - - 200(5) CL = 10 pF, VDD > 1.8 V - - TBD tf(IO)out Output high to low level fall time CL = 20 pF, 2.4 < VDD < 2.7 V - - TBD ns CL = 10 pF, VDD > 2.7 V - - TBD tr(IO)out Output low to high level rise time CL = 20 pF, 2.4 < VDD < 2.7 V - - TBD CL = 10 pF, VDD > 2.7 V - - TBD - tEXTIpw Pulse width of external signals detected by the EXTI controller 10 - - ns 1. Based on characterization data, not tested in production. 2. The I/O speed is configured using the OSPEEDRy[1:0] bits. Refer to the STM32F20/21xxx reference manual for a description of the GPIOx_SPEEDR GPIO port output speed register. 3. TBD stands for “to be defined”. 4. The maximum frequency is defined in Figure 37. 5. For maximum frequencies above 50 MHz, the compensation cell should be used. Table 49. I/O AC characteristics(1)(2)(3) (continued) OSPEEDRy [1:0] bit value(1) Symbol Parameter Conditions Min Typ Max Unit ai14131 10% 90% 50% tr(IO)out OUTPUT EXTERNAL ON 50pF Maximum frequency is achieved if (tr + tf) ≤ 2/3)T and if the duty cycle is (45-55%) 10% 50% 90% when loaded by 50pF T tr(IO)out Electrical characteristics STM32F405xx, STM32F407xx 114/185 DocID022152 Rev 4 Figure 38. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the VIL(NRST) max level specified in Table 50. Otherwise the reset is not taken into account by the device. 5.3.18 TIM timer characteristics The parameters given in Table 51 and Table 52 are guaranteed by design. Refer to Section 5.3.16: I/O port characteristics for details on the input/output alternate function characteristics (output compare, input capture, external clock, PWM output). Table 50. NRST pin characteristics Symbol Parameter Conditions Min Typ Max Unit VIL(NRST) (1) 1. Guaranteed by design, not tested in production. NRST Input low level voltage TTL ports 2.7 V ≤ VDD ≤ 3.6 V - - 0.8 V VIH(NRST) (1) NRST Input high level voltage 2 - - VIL(NRST) (1) NRST Input low level voltage CMOS ports 1.8 V ≤ VDD ≤ 3.6 V - 0.3VDD VIH(NRST) (1) NRST Input high level voltage 0.7VDD - Vhys(NRST) NRST Schmitt trigger voltage hysteresis - 200 - mV RPU Weak pull-up equivalent resistor(2) 2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to the series resistance must be minimum (~10% order). VIN = VSS 30 40 50 kΩ VF(NRST) (1) NRST Input filtered pulse - - 100 ns VNF(NRST) (1) NRST Input not filtered pulse VDD > 2.7 V 300 - - ns TNRST_OUT Generated reset pulse duration Internal Reset source 20 - - μs ai14132c STM32Fxxx NRST(2) RPU VDD Filter Internal Reset 0.1 μF External reset circuit(1) DocID022152 Rev 4 115/185 STM32F405xx, STM32F407xx Electrical characteristics Table 51. Characteristics of TIMx connected to the APB1 domain(1) 1. TIMx is used as a general term to refer to the TIM2, TIM3, TIM4, TIM5, TIM6, TIM7, and TIM12 timers. Symbol Parameter Conditions Min Max Unit tres(TIM) Timer resolution time AHB/APB1 prescaler distinct from 1, fTIMxCLK = 84 MHz 1 - tTIMxCLK 11.9 - ns AHB/APB1 prescaler = 1, fTIMxCLK = 42 MHz 1 - tTIMxCLK 23.8 - ns fEXT Timer external clock frequency on CH1 to CH4 fTIMxCLK = 84 MHz APB1= 42 MHz 0 fTIMxCLK/2 MHz 0 42 MHz ResTIM Timer resolution - 16/32 bit tCOUNTER 16-bit counter clock period when internal clock is selected 1 65536 tTIMxCLK 0.0119 780 μs 32-bit counter clock period when internal clock is selected 1 - tTIMxCLK 0.0119 51130563 μs tMAX_COUNT Maximum possible count - 65536 × 65536 tTIMxCLK - 51.1 s Electrical characteristics STM32F405xx, STM32F407xx 116/185 DocID022152 Rev 4 5.3.19 Communications interfaces I2C interface characteristics The STM32F405xx and STM32F407xx I2C interface meets the requirements of the standard I2C communication protocol with the following restrictions: the I/O pins SDA and SCL are mapped to are not “true” open-drain. When configured as open-drain, the PMOS connected between the I/O pin and VDD is disabled, but is still present. The I2C characteristics are described in Table 53. Refer also to Section 5.3.16: I/O port characteristics for more details on the input/output alternate function characteristics (SDA and SCL). Table 52. Characteristics of TIMx connected to the APB2 domain(1) 1. TIMx is used as a general term to refer to the TIM1, TIM8, TIM9, TIM10, and TIM11 timers. Symbol Parameter Conditions Min Max Unit tres(TIM) Timer resolution time AHB/APB2 prescaler distinct from 1, fTIMxCLK = 168 MHz 1 - tTIMxCLK 5.95 - ns AHB/APB2 prescaler = 1, fTIMxCLK = 84 MHz 1 - tTIMxCLK 11.9 - ns fEXT Timer external clock frequency on CH1 to CH4 fTIMxCLK = 168 MHz APB2 = 84 MHz 0 fTIMxCLK/2 MHz 0 84 MHz ResTIM Timer resolution - 16 bit tCOUNTER 16-bit counter clock period when internal clock is selected 1 65536 tTIMxCLK tMAX_COUNT Maximum possible count - 32768 tTIMxCLK Table 53. I2C characteristics Symbol Parameter Standard mode I2C(1) Fast mode I2C(1)(2) Unit Min Max Min Max tw(SCLL) SCL clock low time 4.7 - 1.3 - μs tw(SCLH) SCL clock high time 4.0 - 0.6 - tsu(SDA) SDA setup time 250 - 100 - ns th(SDA) SDA data hold time 0(3) - 0 900(4) tr(SDA) tr(SCL) SDA and SCL rise time - 1000 20 + 0.1Cb 300 tf(SDA) tf(SCL) SDA and SCL fall time - 300 - 300 DocID022152 Rev 4 117/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 39. I2C bus AC waveforms and measurement circuit 1. Rs= series protection resistor. 2. Rp = external pull-up resistor. 3. VDD_I2C is the I2C bus power supply. th(STA) Start condition hold time 4.0 - 0.6 - μs tsu(STA) Repeated Start condition setup time 4.7 - 0.6 - tsu(STO) Stop condition setup time 4.0 - 0.6 - μs tw(STO:STA) Stop to Start condition time (bus free) 4.7 - 1.3 - μs Cb Capacitive load for each bus line - 400 - 400 pF 1. Guaranteed by design, not tested in production. 2. fPCLK1 must be at least 2 MHz to achieve standard mode I2C frequencies. It must be at least 4 MHz to achieve fast mode I2C frequencies, and a multiple of 10 MHz to reach the 400 kHz maximum I2C fast mode clock. 3. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL. 4. The maximum data hold time has only to be met if the interface does not stretch the low period of SCL signal. Table 53. I2C characteristics (continued) Symbol Parameter Standard mode I2C(1) Fast mode I2C(1)(2) Unit Min Max Min Max ai14979c S TAR T SD A RP I²C bus VDD_I2C STM32Fxx SDA SCL tf(SDA) tr(SDA) SCL th(STA) tw(SCLH) tw(SCLL) tsu(SDA) tr(SCL) tf(SCL) th(SDA) S TAR T REPEATED t S TAR T su(STA) tsu(STO) S TOP tw(STO:STA) VDD_I2C RP RS RS Electrical characteristics STM32F405xx, STM32F407xx 118/185 DocID022152 Rev 4 SPI interface characteristics Unless otherwise specified, the parameters given in Table 55 for SPI are derived from tests performed under the ambient temperature, fPCLKx frequency and VDD supply voltage conditions summarized in Table 14 with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 10 • Capacitive load C = 30 pF • Measurement points are done at CMOS levels: 0.5 VDD Refer to Section 5.3.16: I/O port characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO). Table 54. SCL frequency (fPCLK1= 42 MHz.,VDD = 3.3 V)(1)(2) 1. RP = External pull-up resistance, fSCL = I2C speed, 2. For speeds around 200 kHz, the tolerance on the achieved speed is of ±5%. For other speed ranges, the tolerance on the achieved speed ±2%. These variations depend on the accuracy of the external components used to design the application. fSCL (kHz) I2C_CCR value RP = 4.7 kΩ 400 0x8019 300 0x8021 200 0x8032 100 0x0096 50 0x012C 20 0x02EE Table 55. SPI dynamic characteristics(1) Symbol Parameter Conditions Min Typ Max Unit fSCK SPI clock frequency Master mode, SPI1, 2.7V < VDD < 3.6V - - 42 MHz Slave mode, SPI1, 2.7V < VDD < 3.6V 42 1/tc(SCK) Master mode, SPI1/2/3, 1.7V < VDD < 3.6V - - 21 Slave mode, SPI1/2/3, 1.7V < VDD < 3.6V 21 Duty(SCK) Duty cycle of SPI clock frequency Slave mode 30 50 70 % DocID022152 Rev 4 119/185 STM32F405xx, STM32F407xx Electrical characteristics tw(SCKH) SCK high and low time Master mode, SPI presc = 2, 2.7V < VDD < 3.6V TPCLK-0.5 TPCLK TPCLK+0.5 ns tw(SCKL) Master mode, SPI presc = 2, 1.7V < VDD < 3.6V TPCLK-2 TPCLK TPCLK+2 tsu(NSS) NSS setup time Slave mode, SPI presc = 2 4 x TPCLK - - th(NSS) NSS hold time Slave mode, SPI presc = 2 2 x TPCLK tsu(MI) Data input setup time Master mode 6.5 - - tsu(SI) Slave mode 2.5 - - th(MI) Data input hold time Master mode 2.5 - - th(SI) Slave mode 4 - - ta(SO) (2) Data output access time Slave mode, SPI presc = 2 0 - 4 x TPCLK tdis(SO) (3) Data output disable time Slave mode, SPI1, 2.7V < VDD < 3.6V 0 - 7.5 Slave mode, SPI1/2/3 1.7V < VDD < 3.6V 0 - 16.5 tv(SO) th(SO) Data output valid/hold time Slave mode (after enable edge), SPI1, 2.7V < VDD < 3.6V - 11 13 Slave mode (after enable edge), SPI2/3, 2.7V < VDD < 3.6V - 12 16.5 Slave mode (after enable edge), SPI1, 1.7V < VDD < 3.6V - 15.5 19 Slave mode (after enable edge), SPI2/3, 1.7V < VDD < 3.6V - 18 20.5 tv(MO) Data output valid time Master mode (after enable edge), SPI1 , 2.7V < VDD < 3.6V - - 2.5 Master mode (after enable edge), SPI1/2/3 , 1.7V < VDD < 3.6V - - 4.5 th(MO) Data output hold time Master mode (after enable edge) 0 - - 1. Data based on characterization results, not tested in production. 2. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate the data. 3. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put the data in Hi-Z. Table 55. SPI dynamic characteristics(1) (continued) Symbol Parameter Conditions Min Typ Max Unit Electrical characteristics STM32F405xx, STM32F407xx 120/185 DocID022152 Rev 4 Figure 40. SPI timing diagram - slave mode and CPHA = 0 Figure 41. SPI timing diagram - slave mode and CPHA = 1 ai14134c SCK Input CPHA=0 MOSI INPUT MISO OUT PUT CPHA=0 MSB O UT MSB IN BIT6 OUT LSB IN LSB OUT CPOL=0 CPOL=1 BIT1 IN NSS input tSU(NSS) tc(SCK) th(NSS) ta(SO) tw(SCKH) tw(SCKL) tv(SO) th(SO) tr(SCK) tf(SCK) tdis(SO) tsu(SI) th(SI) ai14135 SCK Input CPHA=1 MOSI INPUT MISO OUT PUT CPHA=1 MSB O UT MSB IN BIT6 OUT LSB IN LSB OUT CPOL=0 CPOL=1 BIT1 IN tSU(NSS) tc(SCK) th(NSS) ta(SO) tw(SCKH) tw(SCKL) tv(SO) th(SO) tr(SCK) tf(SCK) tdis(SO) tsu(SI) th(SI) NSS input DocID022152 Rev 4 121/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 42. SPI timing diagram - master mode ai14136 SCK Input CPHA=0 MOSI OUTUT MISO INPUT CPHA=0 MSBIN MSB OUT BIT6 IN LSB OUT LSB IN CPOL=0 CPOL=1 BIT1 OUT NSS input tc(SCK) tw(SCKH) tw(SCKL) tr(SCK) tf(SCK) th(MI) High SCK Input CPHA=1 CPHA=1 CPOL=0 CPOL=1 tsu(MI) tv(MO) th(MO) Electrical characteristics STM32F405xx, STM32F407xx 122/185 DocID022152 Rev 4 I2S interface characteristics Unless otherwise specified, the parameters given in Table 56 for the i2S interface are derived from tests performed under the ambient temperature, fPCLKx frequency and VDD supply voltage conditions summarized in Table 14, with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 10 • Capacitive load C = 30 pF • Measurement points are done at CMOS levels: 0.5 VDD Refer to Section 5.3.16: I/O port characteristics for more details on the input/output alternate function characteristics (CK, SD, WS). Note: Refer to the I2S section of RM0090 reference manual for more details on the sampling frequency (FS). fMCK, fCK, and DCK values reflect only the digital peripheral behavior. The value of these parameters might be slightly impacted by the source clock accuracy. DCK depends mainly on the value of ODD bit. The digital contribution leads to a minimum value of I2SDIV / (2 x I2SDIV + ODD) and a maximum value of (I2SDIV + ODD) / (2 x I2SDIV + ODD). FS maximum value is supported for each mode/condition. Table 56. I2S dynamic characteristics(1) Symbol Parameter Conditions Min Max Unit fMCK I2S main clock output - 256 x 8K 256 x FS (2) MHz fCK I2S clock frequency Master data: 32 bits - 64 x FS MHz Slave data: 32 bits - 64 x FS DCK I2S clock frequency duty cycle Slave receiver 30 70 % tv(WS) WS valid time Master mode 0 6 ns th(WS) WS hold time Master mode 0 - tsu(WS) WS setup time Slave mode 1 - th(WS) WS hold time Slave mode 0 - tsu(SD_MR) Data input setup time Master receiver 7.5 - tsu(SD_SR) Slave receiver 2 - th(SD_MR) Data input hold time Master receiver 0 - th(SD_SR) Slave receiver 0 - tv(SD_ST) th(SD_ST) Data output valid time Slave transmitter (after enable edge) - 27 tv(SD_MT) Master transmitter (after enable edge) - 20 th(SD_MT) Data output hold time Master transmitter (after enable edge) 2.5 - 1. Data based on characterization results, not tested in production. 2. The maximum value of 256 x FS is 42 MHz (APB1 maximum frequency). DocID022152 Rev 4 123/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 43. I2S slave timing diagram (Philips protocol) 1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first byte. Figure 44. I2S master timing diagram (Philips protocol)(1) 1. Based on characterization, not tested in production. 2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first byte. USB OTG FS characteristics This interface is present in both the USB OTG HS and USB OTG FS controllers. CK Input CPOL = 0 CPOL = 1 tc(CK) WS input SDtransmit SDreceive tw(CKH) tw(CKL) tsu(WS) tv(SD_ST) th(SD_ST) th(WS) tsu(SD_SR) th(SD_SR) MSB receive Bitn receive LSB receive MSB transmit Bitn transmit LSB transmit ai14881b LSB receive(2) LSB transmit(2) CK output CPOL = 0 CPOL = 1 tc(CK) WS output SDreceive SDtransmit tw(CKH) tw(CKL) tsu(SD_MR) tv(SD_MT) th(SD_MT) th(WS) th(SD_MR) MSB receive Bitn receive LSB receive MSB transmit Bitn transmit LSB transmit ai14884b tf(CK) tr(CK) tv(WS) LSB receive(2) LSB transmit(2) Electrical characteristics STM32F405xx, STM32F407xx 124/185 DocID022152 Rev 4 Figure 45. USB OTG FS timings: definition of data signal rise and fall time Table 57. USB OTG FS startup time Symbol Parameter Max Unit tSTARTUP (1) 1. Guaranteed by design, not tested in production. USB OTG FS transceiver startup time 1 μs Table 58. USB OTG FS DC electrical characteristics Symbol Parameter Conditions Min.(1) 1. All the voltages are measured from the local ground potential. Typ. Max.(1) Unit Input levels VDD USB OTG FS operating voltage 3.0(2) 2. The STM32F405xx and STM32F407xx USB OTG FS functionality is ensured down to 2.7 V but not the full USB OTG FS electrical characteristics which are degraded in the 2.7-to-3.0 V VDD voltage range. - 3.6 V VDI (3) 3. Guaranteed by design, not tested in production. Differential input sensitivity I(USB_FS_DP/DM, USB_HS_DP/DM) 0.2 - - VCM V (3) Differential common mode range Includes VDI range 0.8 - 2.5 VSE (3) Single ended receiver threshold 1.3 - 2.0 Output levels VOL Static output level low RL of 1.5 kΩ to 3.6 V(4) 4. RL is the load connected on the USB OTG FS drivers - - 0.3 V VOH Static output level high RL of 15 kΩ to VSS (4) 2.8 - 3.6 RPD PA11, PA12, PB14, PB15 (USB_FS_DP/DM, USB_HS_DP/DM) VIN = VDD 17 21 24 kΩ PA9, PB13 (OTG_FS_VBUS, OTG_HS_VBUS) 0.65 1.1 2.0 RPU PA12, PB15 (USB_FS_DP, USB_HS_DP) VIN = VSS 1.5 1.8 2.1 PA9, PB13 (OTG_FS_VBUS, OTG_HS_VBUS) VIN = VSS 0.25 0.37 0.55 ai14137 tf Differen tial Data L ines VSS VCRS tr Crossover points DocID022152 Rev 4 125/185 STM32F405xx, STM32F407xx Electrical characteristics USB HS characteristics Unless otherwise specified, the parameters given in Table 62 for ULPI are derived from tests performed under the ambient temperature, fHCLK frequency summarized in Table 61 and VDD supply voltage conditions summarized in Table 60, with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 10 • Capacitive load C = 30 pF • Measurement points are done at CMOS levels: 0.5VDD. Refer to Section Section 5.3.16: I/O port characteristics for more details on the input/outputcharacteristics. Table 59. USB OTG FS electrical characteristics(1) 1. Guaranteed by design, not tested in production. Driver characteristics Symbol Parameter Conditions Min Max Unit tr Rise time(2) 2. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to USB Specification - Chapter 7 (version 2.0). CL = 50 pF 4 20 ns tf Fall time(2) CL = 50 pF 4 20 ns trfm Rise/ fall time matching tr/tf 90 110 % VCRS Output signal crossover voltage 1.3 2.0 V Table 60. USB HS DC electrical characteristics Symbol Parameter Min.(1) 1. All the voltages are measured from the local ground potential. Max.(1) Unit Input level VDD USB OTG HS operating voltage 2.7 3.6 V Table 61. USB HS clock timing parameters(1) Parameter Symbol Min Nominal Max Unit fHCLK value to guarantee proper operation of USB HS interface 30 MHz Frequency (first transition) 8-bit ±10% FSTART_8BIT 54 60 66 MHz Frequency (steady state) ±500 ppm FSTEADY 59.97 60 60.03 MHz Duty cycle (first transition) 8-bit ±10% DSTART_8BIT 40 50 60 % Duty cycle (steady state) ±500 ppm DSTEADY 49.975 50 50.025 % Time to reach the steady state frequency and duty cycle after the first transition TSTEADY - - 1.4 ms Clock startup time after the de-assertion of SuspendM Peripheral TSTART_DEV - - 5.6 ms Host TSTART_HOST - - - PHY preparation time after the first transition of the input clock TPREP - - - μs Electrical characteristics STM32F405xx, STM32F407xx 126/185 DocID022152 Rev 4 Figure 46. ULPI timing diagram Ethernet characteristics Unless otherwise specified, the parameters given in Table 64, Table 65 and Table 66 for SMI, RMII and MII are derived from tests performed under the ambient temperature, fHCLK frequency summarized in Table 14 and VDD supply voltage conditions summarized in Table 63, with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 10 • Capacitive load C = 30 pF • Measurement points are done at CMOS levels: 0.5VDD. Refer to Section 5.3.16: I/O port characteristics for more details on the input/output characteristics. 1. Guaranteed by design, not tested in production. Table 62. ULPI timing Parameter Symbol Value(1) 1. VDD = 2.7 V to 3.6 V and TA = –40 to 85 °C. Unit Min. Max. Control in (ULPI_DIR) setup time tSC - 2.0 ns Control in (ULPI_NXT) setup time - 1.5 Control in (ULPI_DIR, ULPI_NXT) hold time tHC 0 - Data in setup time tSD - 2.0 Data in hold time tHD 0 - Control out (ULPI_STP) setup time and hold time tDC - 9.2 Data out available from clock rising edge tDD - 10.7 Clock Control In (ULPI_DIR, ULPI_NXT) data In (8-bit) Control out (ULPI_STP) data out (8-bit) tDD tDC tSD tHD tSC tHC ai17361c tDC DocID022152 Rev 4 127/185 STM32F405xx, STM32F407xx Electrical characteristics Table 64 gives the list of Ethernet MAC signals for the SMI (station management interface) and Figure 47 shows the corresponding timing diagram. Figure 47. Ethernet SMI timing diagram Table 65 gives the list of Ethernet MAC signals for the RMII and Figure 48 shows the corresponding timing diagram. Figure 48. Ethernet RMII timing diagram Table 63. Ethernet DC electrical characteristics Symbol Parameter Min.(1) 1. All the voltages are measured from the local ground potential. Max.(1) Unit Input level VDD Ethernet operating voltage 2.7 3.6 V Table 64. Dynamic characteristics: Ehternet MAC signals for SMI(1) 1. Data based on characterization results, not tested in production. Symbol Parameter Min Typ Max Unit tMDC MDC cycle time( 2.38 MHz) 411 420 425 ns Td(MDIO) Write data valid time 6 10 13 tsu(MDIO) Read data setup time 12 - - th(MDIO) Read data hold time 0 - - MS31384V1 ETH_MDC ETH_MDIO(O) ETH_MDIO(I) tMDC td(MDIO) tsu(MDIO) th(MDIO) RMII_REF_CLK RMII_TX_EN RMII_TXD[1:0] RMII_RXD[1:0] RMII_CRS_DV td(TXEN) td(TXD) tsu(RXD) tsu(CRS) tih(RXD) tih(CRS) ai15667 Electrical characteristics STM32F405xx, STM32F407xx 128/185 DocID022152 Rev 4 Table 66 gives the list of Ethernet MAC signals for MII and Figure 48 shows the corresponding timing diagram. Figure 49. Ethernet MII timing diagram Table 65. Dynamic characteristics: Ethernet MAC signals for RMII Symbol Rating Min Typ Max Unit tsu(RXD) Receive data setup time 2 - - ns tih(RXD) Receive data hold time 1 - - ns tsu(CRS) Carrier sense set-up time 0.5 - - ns tih(CRS) Carrier sense hold time 2 - - ns td(TXEN) Transmit enable valid delay time 8 9.5 11 ns td(TXD) Transmit data valid delay time 8.5 10 11.5 ns Table 66. Dynamic characteristics: Ethernet MAC signals for MII(1) 1. Data based on characterization results, not tested in production. Symbol Parameter Min Typ Max Unit tsu(RXD) Receive data setup time 9 - ns tih(RXD) Receive data hold time 10 - tsu(DV) Data valid setup time 9 - tih(DV) Data valid hold time 8 - tsu(ER) Error setup time 6 - tih(ER) Error hold time 8 - td(TXEN) Transmit enable valid delay time 0 10 14 td(TXD) Transmit data valid delay time 0 10 15 MII_RX_CLK MII_RXD[3:0] MII_RX_DV MII_RX_ER td(TXEN) td(TXD) tsu(RXD) tsu(ER) tsu(DV) tih(RXD) tih(ER) tih(DV) ai15668 MII_TX_CLK MII_TX_EN MII_TXD[3:0] DocID022152 Rev 4 129/185 STM32F405xx, STM32F407xx Electrical characteristics CAN (controller area network) interface Refer to Section 5.3.16: I/O port characteristics for more details on the input/output alternate function characteristics (CANTX and CANRX). 5.3.20 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 67 are derived from tests performed under the ambient temperature, fPCLK2 frequency and VDDA supply voltage conditions summarized in Table 14. Table 67. ADC characteristics Symbol Parameter Conditions Min Typ Max Unit VDDA Power supply 1.8(1) - 3.6 V VREF+ Positive reference voltage 1.8(1)(2)(3) - VDDA V fADC ADC clock frequency VDDA = 1.8(1)(3) to 2.4 V 0.6 15 18 MHz VDDA = 2.4 to 3.6 V(3) 0.6 30 36 MHz fTRIG (4) External trigger frequency fADC = 30 MHz, 12-bit resolution - - 1764 kHz - - 17 1/fADC VAIN Conversion voltage range(5) 0 (VSSA or VREFtied to ground) - VREF+ V RAIN (4) External input impedance See Equation 1 for details - - 50 κΩ RADC (4)(6) Sampling switch resistance - - 6 κΩ CADC (4) Internal sample and hold capacitor - 4 - pF tlat (4) Injection trigger conversion latency fADC = 30 MHz - - 0.100 μs - - 3(7) 1/fADC tlatr (4) Regular trigger conversion latency fADC = 30 MHz - - 0.067 μs - - 2(7) 1/fADC tS (4) Sampling time fADC = 30 MHz 0.100 - 16 μs 3 - 480 1/fADC tSTAB (4) Power-up time - 2 3 μs Electrical characteristics STM32F405xx, STM32F407xx 130/185 DocID022152 Rev 4 Equation 1: RAIN max formula The formula above (Equation 1) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. N = 12 (from 12-bit resolution) and k is the number of sampling periods defined in the ADC_SMPR1 register. tCONV (4) Total conversion time (including sampling time) fADC = 30 MHz 12-bit resolution 0.50 - 16.40 μs fADC = 30 MHz 10-bit resolution 0.43 - 16.34 μs fADC = 30 MHz 8-bit resolution 0.37 - 16.27 μs fADC = 30 MHz 6-bit resolution 0.30 - 16.20 μs 9 to 492 (tS for sampling +n-bit resolution for successive approximation) 1/fADC fS (4) Sampling rate (fADC = 30 MHz, and tS = 3 ADC cycles) 12-bit resolution Single ADC - - 2 Msps 12-bit resolution Interleave Dual ADC mode - - 3.75 Msps 12-bit resolution Interleave Triple ADC mode - - 6 Msps IVREF+ (4) ADC VREF DC current consumption in conversion mode - 300 500 μA IVDDA (4) ADC VDDA DC current consumption in conversion mode - 1.6 1.8 mA 1. VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section : Internal reset OFF). 2. It is recommended to maintain the voltage difference between VREF+ and VDDA below 1.8 V. 3. VDDA -VREF+ < 1.2 V. 4. Based on characterization, not tested in production. 5. VREF+ is internally connected to VDDA and VREF- is internally connected to VSSA. 6. RADC maximum value is given for VDD=1.8 V, and minimum value for VDD=3.3 V. 7. For external triggers, a delay of 1/fPCLK2 must be added to the latency specified in Table 67. Table 67. ADC characteristics (continued) Symbol Parameter Conditions Min Typ Max Unit RAIN (k – 0.5) fADC CADC 2N + 2 × × ln( ) = -------------------------------------------------------------- – RADC DocID022152 Rev 4 131/185 STM32F405xx, STM32F407xx Electrical characteristics a Note: ADC accuracy vs. negative injection current: injecting a negative current on any analog input pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to analog pins which may potentially inject negative currents. Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 5.3.16 does not affect the ADC accuracy. Figure 50. ADC accuracy characteristics 1. See also Table 68. 2. Example of an actual transfer curve. 3. Ideal transfer curve. 4. End point correlation line. 5. ET = Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves. EO = Offset Error: deviation between the first actual transition and the first ideal one. Table 68. ADC accuracy at fADC = 30 MHz(1) 1. Better performance could be achieved in restricted VDD, frequency and temperature ranges. Symbol Parameter Test conditions Typ Max(2) 2. Based on characterization, not tested in production. Unit ET Total unadjusted error fPCLK2 = 60 MHz, fADC = 30 MHz, RAIN < 10 kΩ, VDDA = 1.8(3) to 3.6 V 3. VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section : Internal reset OFF). ±2 ±5 LSB EO Offset error ±1.5 ±2.5 EG Gain error ±1.5 ±3 ED Differential linearity error ±1 ±2 EL Integral linearity error ±1.5 ±3 ai14395c EO EG 1L SBIDEAL 4095 4094 4093 5 4 3 2 1 0 7 6 1 2 3 456 7 4093 4094 4095 4096 (1) (2) ET ED EL (3) VSSA VDDA VREF+ 4096 (or depending on package)] VDDA 4096 [1LSB IDEAL = Electrical characteristics STM32F405xx, STM32F407xx 132/185 DocID022152 Rev 4 EG = Gain Error: deviation between the last ideal transition and the last actual one. ED = Differential Linearity Error: maximum deviation between actual steps and the ideal one. EL = Integral Linearity Error: maximum deviation between any actual transition and the end point correlation line. Figure 51. Typical connection diagram using the ADC 1. Refer to Table 67 for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (roughly 5 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this, fADC should be reduced. ai17534 VDD STM32F AINx IL±1 μA 0.6 V VT RAIN (1) Cparasitic VAIN 0.6 V VT RADC (1) CADC(1) 12-bit converter Sample and hold ADC converter DocID022152 Rev 4 133/185 STM32F405xx, STM32F407xx Electrical characteristics General PCB design guidelines Power supply decoupling should be performed as shown in Figure 52 or Figure 53, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 52. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. VREF+ and VREF– inputs are both available on UFBGA176. VREF+ is also available on LQFP100, LQFP144, and LQFP176. When VREF+ and VREF– are not available, they are internally connected to VDDA and VSSA. Figure 53. Power supply and reference decoupling (VREF+ connected to VDDA) 1. VREF+ and VREF– inputs are both available on UFBGA176. VREF+ is also available on LQFP100, LQFP144, and LQFP176. When VREF+ and VREF– are not available, they are internally connected to VDDA and VSSA. VREF+ STM32F VDDA VSSA/V REF- 1 μF // 10 nF 1 μF // 10 nF ai17535 (See note 1) (See note 1) VREF+/VDDA STM32F 1 μF // 10 nF VREF–/VSSA ai17536 (See note 1) (See note 1) Electrical characteristics STM32F405xx, STM32F407xx 134/185 DocID022152 Rev 4 5.3.21 Temperature sensor characteristics 5.3.22 VBAT monitoring characteristics Table 69. Temperature sensor characteristics Symbol Parameter Min Typ Max Unit TL (1) VSENSE linearity with temperature - ±1 ±2 °C Avg_Slope(1) Average slope - 2.5 mV/°C V25 (1) Voltage at 25 °C - 0.76 V tSTART (2) Startup time - 6 10 μs TS_temp (3)(2) ADC sampling time when reading the temperature (1 °C accuracy) 10 - - μs 1. Based on characterization, not tested in production. 2. Guaranteed by design, not tested in production. 3. Shortest sampling time can be determined in the application by multiple iterations. Table 70. Temperature sensor calibration values Symbol Parameter Memory address TS_CAL1 TS ADC raw data acquired at temperature of 30 °C, VDDA=3.3 V 0x1FFF 7A2C - 0x1FFF 7A2D TS_CAL2 TS ADC raw data acquired at temperature of 110 °C, VDDA=3.3 V 0x1FFF 7A2E - 0x1FFF 7A2F Table 71. VBAT monitoring characteristics Symbol Parameter Min Typ Max Unit R Resistor bridge for VBAT - 50 - KΩ Q Ratio on VBAT measurement - 2 - Er(1) Error on Q –1 - +1 % TS_vbat (2)(2) ADC sampling time when reading the VBAT 1 mV accuracy 5 - - μs 1. Guaranteed by design, not tested in production. 2. Shortest sampling time can be determined in the application by multiple iterations. DocID022152 Rev 4 135/185 STM32F405xx, STM32F407xx Electrical characteristics 5.3.23 Embedded reference voltage The parameters given in Table 72 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 14. 5.3.24 DAC electrical characteristics Table 72. Embedded internal reference voltage Symbol Parameter Conditions Min Typ Max Unit VREFINT Internal reference voltage –40 °C < TA < +105 °C 1.18 1.21 1.24 V TS_vrefint (1) ADC sampling time when reading the internal reference voltage 10 - - μs VRERINT_s (2) Internal reference voltage spread over the temperature range VDD = 3 V - 3 5 mV TCoeff (2) Temperature coefficient - 30 50 ppm/°C tSTART (2) Startup time - 6 10 μs 1. Shortest sampling time can be determined in the application by multiple iterations. 2. Guaranteed by design, not tested in production. Table 73. Internal reference voltage calibration values Symbol Parameter Memory address VREFIN_CAL Raw data acquired at temperature of 30 °C, VDDA=3.3 V 0x1FFF 7A2A - 0x1FFF 7A2B Table 74. DAC characteristics Symbol Parameter Min Typ Max Unit Comments VDDA Analog supply voltage 1.8(1) - 3.6 V VREF+ Reference supply voltage 1.8(1) - 3.6 V VREF+ ≤ VDDA VSSA Ground 0 - 0 V RLOAD (2) Resistive load with buffer ON 5 - - kΩ RO (2) Impedance output with buffer OFF - - 15 kΩ When the buffer is OFF, the Minimum resistive load between DAC_OUT and VSS to have a 1% accuracy is 1.5 MΩ CLOAD (2) Capacitive load - - 50 pF Maximum capacitive load at DAC_OUT pin (when the buffer is ON). DAC_OUT min(2) Lower DAC_OUT voltage with buffer ON 0.2 - - V It gives the maximum output excursion of the DAC. It corresponds to 12-bit input code (0x0E0) to (0xF1C) at VREF+ = 3.6 V and (0x1C7) to (0xE38) at VREF+ = 1.8 V DAC_OUT max(2) Higher DAC_OUT voltage with buffer ON - - VDDA – 0.2 V Electrical characteristics STM32F405xx, STM32F407xx 136/185 DocID022152 Rev 4 DAC_OUT min(2) Lower DAC_OUT voltage with buffer OFF - 0.5 - mV It gives the maximum output DAC_OUT excursion of the DAC. max(2) Higher DAC_OUT voltage with buffer OFF - - VREF+ – 1LSB V IVREF+ (4) DAC DC VREF current consumption in quiescent mode (Standby mode) - 170 240 μA With no load, worst code (0x800) at VREF+ = 3.6 V in terms of DC consumption on the inputs - 50 75 With no load, worst code (0xF1C) at VREF+ = 3.6 V in terms of DC consumption on the inputs IDDA (4) DAC DC VDDA current consumption in quiescent mode(3) - 280 380 μA With no load, middle code (0x800) on the inputs - 475 625 μA With no load, worst code (0xF1C) at VREF+ = 3.6 V in terms of DC consumption on the inputs DNL(4) Differential non linearity Difference between two consecutive code-1LSB) - - ±0.5 LSB Given for the DAC in 10-bit configuration. - - ±2 LSB Given for the DAC in 12-bit configuration. INL(4) Integral non linearity (difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 1023) - - ±1 LSB Given for the DAC in 10-bit configuration. - - ±4 LSB Given for the DAC in 12-bit configuration. Offset(4) Offset error (difference between measured value at Code (0x800) and the ideal value = VREF+/2) - - ±10 mV Given for the DAC in 12-bit configuration - - ±3 LSB Given for the DAC in 10-bit at VREF+ = 3.6 V - - ±12 LSB Given for the DAC in 12-bit at VREF+ = 3.6 V Gain error(4) Gain error - - ±0.5 % Given for the DAC in 12-bit configuration tSETTLING (4) Settling time (full scale: for a 10-bit input code transition between the lowest and the highest input codes when DAC_OUT reaches final value ±4LSB - 3 6 μs CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ THD(4) Total Harmonic Distortion Buffer ON - - - dB CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ Table 74. DAC characteristics (continued) Symbol Parameter Min Typ Max Unit Comments DocID022152 Rev 4 137/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 54. 12-bit buffered /non-buffered DAC 1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the DAC_CR register. 5.3.25 FSMC characteristics Unless otherwise specified, the parameters given in Table 75 to Table 86 for the FSMC interface are derived from tests performed under the ambient temperature, fHCLK frequency and VDD supply voltage conditions summarized in Table 14, with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 10 • Capacitive load C = 30 pF • Measurement points are done at CMOS levels: 0.5VDD Refer to Section Section 5.3.16: I/O port characteristics for more details on the input/output characteristics. Update rate(2) Max frequency for a correct DAC_OUT change when small variation in the input code (from code i to i+1LSB) - - 1 MS/s CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ tWAKEUP (4) Wakeup time from off state (Setting the ENx bit in the DAC Control register) - 6.5 10 μs CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ input code between lowest and highest possible ones. PSRR+ (2) Power supply rejection ratio (to VDDA) (static DC measurement) - –67 –40 dB No RLOAD, CLOAD = 50 pF 1. VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section : Internal reset OFF). 2. Guaranteed by design, not tested in production. 3. The quiescent mode corresponds to a state where the DAC maintains a stable output level to ensure that no dynamic consumption occurs. 4. Guaranteed by characterization, not tested in production. Table 74. DAC characteristics (continued) Symbol Parameter Min Typ Max Unit Comments RLOAD CLOAD Buffered/Non-buffered DAC DACx_OUT Buffer(1) 12-bit digital to analog converter ai17157 Electrical characteristics STM32F405xx, STM32F407xx 138/185 DocID022152 Rev 4 Asynchronous waveforms and timings Figure 55 through Figure 58 represent asynchronous waveforms and Table 75 through Table 78 provide the corresponding timings. The results shown in these tables are obtained with the following FSMC configuration: • AddressSetupTime = 1 • AddressHoldTime = 0x1 • DataSetupTime = 0x1 • BusTurnAroundDuration = 0x0 In all timing tables, the THCLK is the HCLK clock period. Figure 55. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms 1. Mode 2/B, C and D only. In Mode 1, FSMC_NADV is not used. Table 75. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings(1)(2) Symbol Parameter Min Max Unit tw(NE) FSMC_NE low time 2THCLK–0.5 2 THCLK+1 ns tv(NOE_NE) FSMC_NEx low to FSMC_NOE low 0.5 3 ns tw(NOE) FSMC_NOE low time 2THCLK–2 2THCLK+ 2 ns th(NE_NOE) FSMC_NOE high to FSMC_NE high hold time 0 - ns tv(A_NE) FSMC_NEx low to FSMC_A valid - 4.5 ns th(A_NOE) Address hold time after FSMC_NOE high 4 - ns Data FSMC_NE FSMC_NBL[1:0] FSMC_D[15:0] tv(BL_NE) t h(Data_NE) FSMC_NOE FSMC_A[25:0] Address tv(A_NE) FSMC_NWE tsu(Data_NE) tw(NE) ai14991c tv(NOE_NE) t w(NOE) t h(NE_NOE) th(Data_NOE) t h(A_NOE) t h(BL_NOE) tsu(Data_NOE) FSMC_NADV(1) t v(NADV_NE) tw(NADV) DocID022152 Rev 4 139/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 56. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms 1. Mode 2/B, C and D only. In Mode 1, FSMC_NADV is not used. tv(BL_NE) FSMC_NEx low to FSMC_BL valid - 1.5 ns th(BL_NOE) FSMC_BL hold time after FSMC_NOE high 0 - ns tsu(Data_NE) Data to FSMC_NEx high setup time THCLK+4 - ns tsu(Data_NOE) Data to FSMC_NOEx high setup time THCLK+4 - ns th(Data_NOE) Data hold time after FSMC_NOE high 0 - ns th(Data_NE) Data hold time after FSMC_NEx high 0 - ns tv(NADV_NE) FSMC_NEx low to FSMC_NADV low - 2 ns tw(NADV) FSMC_NADV low time - THCLK ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 76. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings(1)(2) Symbol Parameter Min Max Unit tw(NE) FSMC_NE low time 3THCLK 3THCLK+ 4 ns tv(NWE_NE) FSMC_NEx low to FSMC_NWE low THCLK–0.5 THCLK+0.5 ns tw(NWE) FSMC_NWE low time THCLK–1 THCLK+2 ns th(NE_NWE) FSMC_NWE high to FSMC_NE high hold time THCLK–1 - ns tv(A_NE) FSMC_NEx low to FSMC_A valid - 0 ns Table 75. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings(1)(2) NBL Data FSMC_NEx FSMC_NBL[1:0] FSMC_D[15:0] tv(BL_NE) th(Data_NWE) FSMC_NOE FSMC_A[25:0] Address tv(A_NE) tw(NWE) FSMC_NWE tv(NWE_NE) t h(NE_NWE) th(A_NWE) th(BL_NWE) tv(Data_NE) tw(NE) ai14990 FSMC_NADV(1) t v(NADV_NE) tw(NADV) Electrical characteristics STM32F405xx, STM32F407xx 140/185 DocID022152 Rev 4 Figure 57. Asynchronous multiplexed PSRAM/NOR read waveforms th(A_NWE) Address hold time after FSMC_NWE high THCLK– 2 - ns tv(BL_NE) FSMC_NEx low to FSMC_BL valid - 1.5 ns th(BL_NWE) FSMC_BL hold time after FSMC_NWE high THCLK– 1 - ns tv(Data_NE) Data to FSMC_NEx low to Data valid - THCLK+3 ns th(Data_NWE) Data hold time after FSMC_NWE high THCLK–1 - ns tv(NADV_NE) FSMC_NEx low to FSMC_NADV low - 2 ns tw(NADV) FSMC_NADV low time - THCLK+0.5 ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 77. Asynchronous multiplexed PSRAM/NOR read timings(1)(2) Symbol Parameter Min Max Unit tw(NE) FSMC_NE low time 3THCLK–1 3THCLK+1 ns tv(NOE_NE) FSMC_NEx low to FSMC_NOE low 2THCLK–0.5 2THCLK+0.5 ns tw(NOE) FSMC_NOE low time THCLK–1 THCLK+1 ns th(NE_NOE) FSMC_NOE high to FSMC_NE high hold time 0 - ns tv(A_NE) FSMC_NEx low to FSMC_A valid - 3 ns Table 76. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings(1)(2) NBL Data FSMC_NBL[1:0] FSMC_AD[15:0] tv(BL_NE) th(Data_NE) FSMC_A[25:16] Address tv(A_NE) FSMC_NWE t v(A_NE) ai14892b Address FSMC_NADV t v(NADV_NE) tw(NADV) tsu(Data_NE) th(AD_NADV) FSMC_NE FSMC_NOE tw(NE) t w(NOE) tv(NOE_NE) t h(NE_NOE) th(A_NOE) th(BL_NOE) tsu(Data_NOE) th(Data_NOE) DocID022152 Rev 4 141/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 58. Asynchronous multiplexed PSRAM/NOR write waveforms tv(NADV_NE) FSMC_NEx low to FSMC_NADV low 1 2 ns tw(NADV) FSMC_NADV low time THCLK– 2 THCLK+1 ns th(AD_NADV) FSMC_AD(adress) valid hold time after FSMC_NADV high) THCLK - ns th(A_NOE) Address hold time after FSMC_NOE high THCLK–1 - ns th(BL_NOE) FSMC_BL time after FSMC_NOE high 0 - ns tv(BL_NE) FSMC_NEx low to FSMC_BL valid - 2 ns tsu(Data_NE) Data to FSMC_NEx high setup time THCLK+4 - ns tsu(Data_NOE) Data to FSMC_NOE high setup time THCLK+4 - ns th(Data_NE) Data hold time after FSMC_NEx high 0 - ns th(Data_NOE) Data hold time after FSMC_NOE high 0 - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 78. Asynchronous multiplexed PSRAM/NOR write timings(1)(2) Symbol Parameter Min Max Unit tw(NE) FSMC_NE low time 4THCLK–0.5 4THCLK+3 ns tv(NWE_NE) FSMC_NEx low to FSMC_NWE low THCLK–0.5 THCLK -0.5 ns tw(NWE) FSMC_NWE low tim e 2THCLK–0.5 2THCLK+3 ns Table 77. Asynchronous multiplexed PSRAM/NOR read timings(1)(2) (continued) NBL Data FSMC_NEx FSMC_NBL[1:0] FSMC_AD[15:0] tv(BL_NE) th(Data_NWE) FSMC_NOE FSMC_A[25:16] Address tv(A_NE) tw(NWE) FSMC_NWE tv(NWE_NE) t h(NE_NWE) th(A_NWE) th(BL_NWE) t v(A_NE) tw(NE) ai14891B Address FSMC_NADV t v(NADV_NE) tw(NADV) t v(Data_NADV) th(AD_NADV) Electrical characteristics STM32F405xx, STM32F407xx 142/185 DocID022152 Rev 4 Synchronous waveforms and timings Figure 59 through Figure 62 represent synchronous waveforms and Table 80 through Table 82 provide the corresponding timings. The results shown in these tables are obtained with the following FSMC configuration: • BurstAccessMode = FSMC_BurstAccessMode_Enable; • MemoryType = FSMC_MemoryType_CRAM; • WriteBurst = FSMC_WriteBurst_Enable; • CLKDivision = 1; (0 is not supported, see the STM32F40xxx/41xxx reference manual) • DataLatency = 1 for NOR Flash; DataLatency = 0 for PSRAM In all timing tables, the THCLK is the HCLK clock period (with maximum FSMC_CLK = 60 MHz). th(NE_NWE) FSMC_NWE high to FSMC_NE high hold time THCLK - ns tv(A_NE) FSMC_NEx low to FSMC_A valid - 0 ns tv(NADV_NE) FSMC_NEx low to FSMC_NADV low 1 2 ns tw(NADV) FSMC_NADV low time THCLK– 2 THCLK+ 1 ns th(AD_NADV) FSMC_AD(address) valid hold time after FSMC_NADV high) THCLK–2 - ns th(A_NWE) Address hold time after FSMC_NWE high THCLK - ns th(BL_NWE) FSMC_BL hold time after FSMC_NWE high THCLK–2 - ns tv(BL_NE) FSMC_NEx low to FSMC_BL valid - 1.5 ns tv(Data_NADV) FSMC_NADV high to Data valid - THCLK–0.5 ns th(Data_NWE) Data hold time after FSMC_NWE high THCLK - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 78. Asynchronous multiplexed PSRAM/NOR write timings(1)(2) DocID022152 Rev 4 143/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 59. Synchronous multiplexed NOR/PSRAM read timings Table 79. Synchronous multiplexed NOR/PSRAM read timings(1)(2) Symbol Parameter Min Max Unit tw(CLK) FSMC_CLK period 2THCLK - ns td(CLKL-NExL) FSMC_CLK low to FSMC_NEx low (x=0..2) - 0 ns td(CLKL-NExH) FSMC_CLK low to FSMC_NEx high (x= 0…2) 2 - ns td(CLKL-NADVL) FSMC_CLK low to FSMC_NADV low - 2 ns td(CLKL-NADVH) FSMC_CLK low to FSMC_NADV high 2 - ns td(CLKL-AV) FSMC_CLK low to FSMC_Ax valid (x=16…25) - 0 ns td(CLKL-AIV) FSMC_CLK low to FSMC_Ax invalid (x=16…25) 0 - ns td(CLKL-NOEL) FSMC_CLK low to FSMC_NOE low - 0 ns td(CLKL-NOEH) FSMC_CLK low to FSMC_NOE high 2 - ns td(CLKL-ADV) FSMC_CLK low to FSMC_AD[15:0] valid - 4.5 ns td(CLKL-ADIV) FSMC_CLK low to FSMC_AD[15:0] invalid 0 - ns tsu(ADV-CLKH) FSMC_A/D[15:0] valid data before FSMC_CLK high 6 - ns FSMC_CLK FSMC_NEx FSMC_NADV FSMC_A[25:16] FSMC_NOE FSMC_AD[15:0] AD[15:0] D1 D2 FSMC_NWAIT (WAITCFG = 1b, WAITPOL + 0b) FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) tw(CLK) tw(CLK) Data latency = 0 BUSTURN = 0 td(CLKL-NExL) td(CLKL-NExH) td(CLKL-NADVL) td(CLKL-AV) td(CLKL-NADVH) td(CLKL-AIV) td(CLKL-NOEL) td(CLKL-NOEH) td(CLKL-ADV) td(CLKL-ADIV) tsu(ADV-CLKH) th(CLKH-ADV) tsu(ADV-CLKH) th(CLKH-ADV) tsu(NWAITV-CLKH) th(CLKH-NWAITV) tsu(NWAITV-CLKH) th(CLKH-NWAITV) tsu(NWAITV-CLKH) th(CLKH-NWAITV) ai14893g Electrical characteristics STM32F405xx, STM32F407xx 144/185 DocID022152 Rev 4 Figure 60. Synchronous multiplexed PSRAM write timings th(CLKH-ADV) FSMC_A/D[15:0] valid data after FSMC_CLK high 0 - ns tsu(NWAIT-CLKH) FSMC_NWAIT valid before FSMC_CLK high 4 - ns th(CLKH-NWAIT) FSMC_NWAIT valid after FSMC_CLK high 0 - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 80. Synchronous multiplexed PSRAM write timings(1)(2) Symbol Parameter Min Max Unit tw(CLK) FSMC_CLK period 2THCLK - ns td(CLKL-NExL) FSMC_CLK low to FSMC_NEx low (x=0..2) - 1 ns td(CLKL-NExH) FSMC_CLK low to FSMC_NEx high (x= 0…2) 1 - ns td(CLKL-NADVL) FSMC_CLK low to FSMC_NADV low - 0 ns td(CLKL-NADVH) FSMC_CLK low to FSMC_NADV high 0 - ns td(CLKL-AV) FSMC_CLK low to FSMC_Ax valid (x=16…25) - 0 ns Table 79. Synchronous multiplexed NOR/PSRAM read timings(1)(2) (continued) FSMC_CLK FSMC_NEx FSMC_NADV FSMC_A[25:16] FSMC_NWE FSMC_AD[15:0] AD[15:0] D1 D2 FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) tw(CLK) tw(CLK) Data latency = 0 BUSTURN = 0 td(CLKL-NExL) td(CLKL-NExH) td(CLKL-NADVL) td(CLKL-AV) td(CLKL-NADVH) td(CLKL-AIV) td(CLKL-NWEL) td(CLKL-NWEH) td(CLKL-NBLH) td(CLKL-ADV) td(CLKL-ADIV) td(CLKL-Data) tsu(NWAITV-CLKH) th(CLKH-NWAITV) ai14992g td(CLKL-Data) FSMC_NBL DocID022152 Rev 4 145/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 61. Synchronous non-multiplexed NOR/PSRAM read timings td(CLKL-AIV) FSMC_CLK low to FSMC_Ax invalid (x=16…25) 8 - ns td(CLKL-NWEL) FSMC_CLK low to FSMC_NWE low - 0.5 ns td(CLKL-NWEH) FSMC_CLK low to FSMC_NWE high 0 - ns td(CLKL-ADIV) FSMC_CLK low to FSMC_AD[15:0] invalid 0 - ns td(CLKL-DATA) FSMC_A/D[15:0] valid data after FSMC_CLK low - 3 ns td(CLKL-NBLH) FSMC_CLK low to FSMC_NBL high 0 - ns tsu(NWAIT-CLKH) FSMC_NWAIT valid before FSMC_CLK high 4 - ns th(CLKH-NWAIT) FSMC_NWAIT valid after FSMC_CLK high 0 - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 81. Synchronous non-multiplexed NOR/PSRAM read timings(1)(2) Symbol Parameter Min Max Unit tw(CLK) FSMC_CLK period 2THCLK –0.5 - ns td(CLKL-NExL) FSMC_CLK low to FSMC_NEx low (x=0..2) - 0.5 ns Table 80. Synchronous multiplexed PSRAM write timings(1)(2) FSMC_CLK FSMC_NEx FSMC_A[25:0] FSMC_NOE FSMC_D[15:0] D1 D2 FSMC_NWAIT (WAITCFG = 1b, WAITPOL + 0b) FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) tw(CLK) tw(CLK) Data latency = 0 BUSTURN = 0 td(CLKL-NExL) td(CLKL-NExH) td(CLKL-AV) td(CLKL-AIV) td(CLKL-NOEL) td(CLKL-NOEH) tsu(DV-CLKH) th(CLKH-DV) tsu(DV-CLKH) th(CLKH-DV) tsu(NWAITV-CLKH) th(CLKH-NWAITV) tsu(NWAITV-CLKH) t h(CLKH-NWAITV) tsu(NWAITV-CLKH) th(CLKH-NWAITV) ai14894f FSMC_NADV td(CLKL-NADVL) td(CLKL-NADVH) Electrical characteristics STM32F405xx, STM32F407xx 146/185 DocID022152 Rev 4 Figure 62. Synchronous non-multiplexed PSRAM write timings td(CLKL-NExH) FSMC_CLK low to FSMC_NEx high (x= 0…2) 0 - ns td(CLKL-NADVL) FSMC_CLK low to FSMC_NADV low - 2 ns td(CLKL-NADVH) FSMC_CLK low to FSMC_NADV high 3 - ns td(CLKL-AV) FSMC_CLK low to FSMC_Ax valid (x=16…25) - 0 ns td(CLKL-AIV) FSMC_CLK low to FSMC_Ax invalid (x=16…25) 2 - ns td(CLKL-NOEL) FSMC_CLK low to FSMC_NOE low - 0.5 ns td(CLKL-NOEH) FSMC_CLK low to FSMC_NOE high 1.5 - ns tsu(DV-CLKH) FSMC_D[15:0] valid data before FSMC_CLK high 6 - ns th(CLKH-DV) FSMC_D[15:0] valid data after FSMC_CLK high 3 - ns tsu(NWAIT-CLKH) FSMC_NWAIT valid before FSMC_CLK high 4 - ns th(CLKH-NWAIT) FSMC_NWAIT valid after FSMC_CLK high 0 - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Table 81. Synchronous non-multiplexed NOR/PSRAM read timings(1)(2) (continued) FSMC_CLK FSMC_NEx FSMC_A[25:0] FSMC_NWE FSMC_D[15:0] D1 D2 FSMC_NWAIT (WAITCFG = 0b, WAITPOL + 0b) tw(CLK) tw(CLK) Data latency = 0 BUSTURN = 0 td(CLKL-NExL) td(CLKL-NExH) td(CLKL-AV) td(CLKL-AIV) td(CLKL-NWEL) td(CLKL-NWEH) td(CLKL-Data) tsu(NWAITV-CLKH) th(CLKH-NWAITV) ai14993g FSMC_NADV td(CLKL-NADVL) td(CLKL-NADVH) td(CLKL-Data) FSMC_NBL td(CLKL-NBLH) DocID022152 Rev 4 147/185 STM32F405xx, STM32F407xx Electrical characteristics PC Card/CompactFlash controller waveforms and timings Figure 63 through Figure 68 represent synchronous waveforms, and Table 83 and Table 84 provide the corresponding timings. The results shown in this table are obtained with the following FSMC configuration: • COM.FSMC_SetupTime = 0x04; • COM.FSMC_WaitSetupTime = 0x07; • COM.FSMC_HoldSetupTime = 0x04; • COM.FSMC_HiZSetupTime = 0x00; • ATT.FSMC_SetupTime = 0x04; • ATT.FSMC_WaitSetupTime = 0x07; • ATT.FSMC_HoldSetupTime = 0x04; • ATT.FSMC_HiZSetupTime = 0x00; • IO.FSMC_SetupTime = 0x04; • IO.FSMC_WaitSetupTime = 0x07; • IO.FSMC_HoldSetupTime = 0x04; • IO.FSMC_HiZSetupTime = 0x00; • TCLRSetupTime = 0; • TARSetupTime = 0. In all timing tables, the THCLK is the HCLK clock period. Table 82. Synchronous non-multiplexed PSRAM write timings(1)(2) 1. CL = 30 pF. 2. Based on characterization, not tested in production. Symbol Parameter Min Max Unit tw(CLK) FSMC_CLK period 2THCLK - ns td(CLKL-NExL) FSMC_CLK low to FSMC_NEx low (x=0..2) - 1 ns td(CLKL-NExH) FSMC_CLK low to FSMC_NEx high (x= 0…2) 1 - ns td(CLKL-NADVL) FSMC_CLK low to FSMC_NADV low - 7 ns td(CLKL-NADVH) FSMC_CLK low to FSMC_NADV high 6 - ns td(CLKL-AV) FSMC_CLK low to FSMC_Ax valid (x=16…25) - 0 ns td(CLKL-AIV) FSMC_CLK low to FSMC_Ax invalid (x=16…25) 6 - ns td(CLKL-NWEL) FSMC_CLK low to FSMC_NWE low - 1 ns td(CLKL-NWEH) FSMC_CLK low to FSMC_NWE high 2 - ns td(CLKL-Data) FSMC_D[15:0] valid data after FSMC_CLK low - 3 ns td(CLKL-NBLH) FSMC_CLK low to FSMC_NBL high 3 - ns tsu(NWAIT-CLKH) FSMC_NWAIT valid before FSMC_CLK high 4 - ns th(CLKH-NWAIT) FSMC_NWAIT valid after FSMC_CLK high 0 - ns Electrical characteristics STM32F405xx, STM32F407xx 148/185 DocID022152 Rev 4 Figure 63. PC Card/CompactFlash controller waveforms for common memory read access 1. FSMC_NCE4_2 remains high (inactive during 8-bit access. Figure 64. PC Card/CompactFlash controller waveforms for common memory write access FSMC_NWE tw(NOE) FSMC_NOE FSMC_D[15:0] FSMC_A[10:0] FSMC_NCE4_2(1) FSMC_NCE4_1 FSMC_NREG FSMC_NIOWR FSMC_NIORD td(NCE4_1-NOE) tsu(D-NOE) th(NOE-D) tv(NCEx-A) td(NREG-NCEx) td(NIORD-NCEx) th(NCEx-AI) th(NCEx-NREG) th(NCEx-NIORD) th(NCEx-NIOWR) ai14895b td(NCE4_1-NWE) tw(NWE) th(NWE-D) tv(NCE4_1-A) td(NREG-NCE4_1) td(NIORD-NCE4_1) th(NCE4_1-AI) MEMxHIZ =1 tv(NWE-D) th(NCE4_1-NREG) th(NCE4_1-NIORD) th(NCE4_1-NIOWR) ai14896b FSMC_NWE FSMC_NOE FSMC_D[15:0] FSMC_A[10:0] FSMC_NCE4_1 FSMC_NREG FSMC_NIOWR FSMC_NIORD td(NWE-NCE4_1) td(D-NWE) FSMC_NCE4_2 High DocID022152 Rev 4 149/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 65. PC Card/CompactFlash controller waveforms for attribute memory read access 1. Only data bits 0...7 are read (bits 8...15 are disregarded). td(NCE4_1-NOE) tw(NOE) tsu(D-NOE) th(NOE-D) tv(NCE4_1-A) th(NCE4_1-AI) td(NREG-NCE4_1) th(NCE4_1-NREG) ai14897b FSMC_NWE FSMC_NOE FSMC_D[15:0](1) FSMC_A[10:0] FSMC_NCE4_2 FSMC_NCE4_1 FSMC_NREG FSMC_NIOWR FSMC_NIORD td(NOE-NCE4_1) High Electrical characteristics STM32F405xx, STM32F407xx 150/185 DocID022152 Rev 4 Figure 66. PC Card/CompactFlash controller waveforms for attribute memory write access 1. Only data bits 0...7 are driven (bits 8...15 remains Hi-Z). Figure 67. PC Card/CompactFlash controller waveforms for I/O space read access tw(NWE) tv(NCE4_1-A) td(NREG-NCE4_1) th(NCE4_1-AI) th(NCE4_1-NREG) tv(NWE-D) ai14898b FSMC_NWE FSMC_NOE FSMC_D[7:0](1) FSMC_A[10:0] FSMC_NCE4_2 FSMC_NCE4_1 FSMC_NREG FSMC_NIOWR FSMC_NIORD td(NWE-NCE4_1) High td(NCE4_1-NWE) td(NIORD-NCE4_1) tw(NIORD) tsu(D-NIORD) td(NIORD-D) tv(NCEx-A) th(NCE4_1-AI) ai14899B FSMC_NWE FSMC_NOE FSMC_D[15:0] FSMC_A[10:0] FSMC_NCE4_2 FSMC_NCE4_1 FSMC_NREG FSMC_NIOWR FSMC_NIORD DocID022152 Rev 4 151/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 68. PC Card/CompactFlash controller waveforms for I/O space write access td(NCE4_1-NIOWR) tw(NIOWR) tv(NCEx-A) th(NCE4_1-AI) th(NIOWR-D) ATTxHIZ =1 tv(NIOWR-D) ai14900c FSMC_NWE FSMC_NOE FSMC_D[15:0] FSMC_A[10:0] FSMC_NCE4_2 FSMC_NCE4_1 FSMC_NREG FSMC_NIOWR FSMC_NIORD Table 83. Switching characteristics for PC Card/CF read and write cycles in attribute/common space(1)(2) Symbol Parameter Min Max Unit tv(NCEx-A) FSMC_Ncex low to FSMC_Ay valid - 0 ns th(NCEx_AI) FSMC_NCEx high to FSMC_Ax invalid 4 - ns td(NREG-NCEx) FSMC_NCEx low to FSMC_NREG valid - 3.5 ns th(NCEx-NREG) FSMC_NCEx high to FSMC_NREG invalid THCLK+4 - ns td(NCEx-NWE) FSMC_NCEx low to FSMC_NWE low - 5THCLK+0.5 ns td(NCEx-NOE) FSMC_NCEx low to FSMC_NOE low - 5THCLK +0.5 ns tw(NOE) FSMC_NOE low width 8THCLK–1 8THCLK+1 ns td(NOE_NCEx) FSMC_NOE high to FSMC_NCEx high 5THCLK+2.5 - ns tsu (D-NOE) FSMC_D[15:0] valid data before FSMC_NOE high 4.5 - ns th(N0E-D) FSMC_N0E high to FSMC_D[15:0] invalid 3 - ns tw(NWE) FSMC_NWE low width 8THCLK–0.5 8THCLK+ 3 ns td(NWE_NCEx) FSMC_NWE high to FSMC_NCEx high 5THCLK–1 - ns td(NCEx-NWE) FSMC_NCEx low to FSMC_NWE low - 5THCLK+ 1 ns tv(NWE-D) FSMC_NWE low to FSMC_D[15:0] valid - 0 ns th (NWE-D) FSMC_NWE high to FSMC_D[15:0] invalid 8THCLK –1 - ns td (D-NWE) FSMC_D[15:0] valid before FSMC_NWE high 13THCLK –1 - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. Electrical characteristics STM32F405xx, STM32F407xx 152/185 DocID022152 Rev 4 NAND controller waveforms and timings Figure 69 through Figure 72 represent synchronous waveforms, and Table 85 and Table 86 provide the corresponding timings. The results shown in this table are obtained with the following FSMC configuration: • COM.FSMC_SetupTime = 0x01; • COM.FSMC_WaitSetupTime = 0x03; • COM.FSMC_HoldSetupTime = 0x02; • COM.FSMC_HiZSetupTime = 0x01; • ATT.FSMC_SetupTime = 0x01; • ATT.FSMC_WaitSetupTime = 0x03; • ATT.FSMC_HoldSetupTime = 0x02; • ATT.FSMC_HiZSetupTime = 0x01; • Bank = FSMC_Bank_NAND; • MemoryDataWidth = FSMC_MemoryDataWidth_16b; • ECC = FSMC_ECC_Enable; • ECCPageSize = FSMC_ECCPageSize_512Bytes; • TCLRSetupTime = 0; • TARSetupTime = 0. In all timing tables, the THCLK is the HCLK clock period. Table 84. Switching characteristics for PC Card/CF read and write cycles in I/O space(1)(2) Symbol Parameter Min Max Unit tw(NIOWR) FSMC_NIOWR low width 8THCLK –1 - ns tv(NIOWR-D) FSMC_NIOWR low to FSMC_D[15:0] valid - 5THCLK– 1 ns th(NIOWR-D) FSMC_NIOWR high to FSMC_D[15:0] invalid 8THCLK– 2 - ns td(NCE4_1-NIOWR) FSMC_NCE4_1 low to FSMC_NIOWR valid - 5THCLK+ 2.5 ns th(NCEx-NIOWR) FSMC_NCEx high to FSMC_NIOWR invalid 5THCLK–1.5 - ns td(NIORD-NCEx) FSMC_NCEx low to FSMC_NIORD valid - 5THCLK+ 2 ns th(NCEx-NIORD) FSMC_NCEx high to FSMC_NIORD) valid 5THCLK– 1.5 - ns tw(NIORD) FSMC_NIORD low width 8THCLK–0.5 - ns tsu(D-NIORD) FSMC_D[15:0] valid before FSMC_NIORD high 9 - ns td(NIORD-D) FSMC_D[15:0] valid after FSMC_NIORD high 0 - ns 1. CL = 30 pF. 2. Based on characterization, not tested in production. DocID022152 Rev 4 153/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 69. NAND controller waveforms for read access Figure 70. NAND controller waveforms for write access FSMC_NWE FSMC_NOE (NRE) FSMC_D[15:0] tsu(D-NOE) th(NOE-D) ai14901c ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NCEx td(ALE-NOE) th(NOE-ALE) tv(NWE-D) th(NWE-D) ai14902c FSMC_NWE FSMC_NOE (NRE) FSMC_D[15:0] ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NCEx td(ALE-NWE) th(NWE-ALE) Electrical characteristics STM32F405xx, STM32F407xx 154/185 DocID022152 Rev 4 Figure 71. NAND controller waveforms for common memory read access Figure 72. NAND controller waveforms for common memory write access Table 85. Switching characteristics for NAND Flash read cycles(1) 1. CL = 30 pF. Symbol Parameter Min Max Unit tw(N0E) FSMC_NOE low width 4THCLK– 0.5 4THCLK+ 3 ns tsu(D-NOE) FSMC_D[15-0] valid data before FSMC_NOE high 10 - ns th(NOE-D) FSMC_D[15-0] valid data after FSMC_NOE high 0 - ns td(ALE-NOE) FSMC_ALE valid before FSMC_NOE low - 3THCLK ns th(NOE-ALE) FSMC_NWE high to FSMC_ALE invalid 3THCLK– 2 - ns FSMC_NWE FSMC_NOE FSMC_D[15:0] tw(NOE) tsu(D-NOE) th(NOE-D) ai14912c ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NCEx td(ALE-NOE) th(NOE-ALE) tw(NWE) tv(NWE-D) th(NWE-D) ai14913c FSMC_NWE FSMC_NOE FSMC_D[15:0] td(D-NWE) ALE (FSMC_A17) CLE (FSMC_A16) FSMC_NCEx td(ALE-NOE) th(NOE-ALE) DocID022152 Rev 4 155/185 STM32F405xx, STM32F407xx Electrical characteristics 5.3.26 Camera interface (DCMI) timing specifications Unless otherwise specified, the parameters given in Table 87 for DCMI are derived from tests performed under the ambient temperature, fHCLK frequency and VDD supply voltage summarized in Table 13, with the following configuration: • PCK polarity: falling • VSYNC and HSYNC polarity: high • Data format: 14 bits Figure 73. DCMI timing diagram Table 86. Switching characteristics for NAND Flash write cycles(1) 1. CL = 30 pF. Symbol Parameter Min Max Unit tw(NWE) FSMC_NWE low width 4THCLK–1 4THCLK+ 3 ns tv(NWE-D) FSMC_NWE low to FSMC_D[15-0] valid - 0 ns th(NWE-D) FSMC_NWE high to FSMC_D[15-0] invalid 3THCLK –2 - ns td(D-NWE) FSMC_D[15-0] valid before FSMC_NWE high 5THCLK–3 - ns td(ALE-NWE) FSMC_ALE valid before FSMC_NWE low - 3THCLK ns th(NWE-ALE) FSMC_NWE high to FSMC_ALE invalid 3THCLK–2 - ns Table 87. DCMI characteristics(1) Symbol Parameter Min Max Unit Frequency ratio DCMI_PIXCLK/fHCLK - 0.4 DCMI_PIXCLK Pixel clock input - 54 MHz Dpixel Pixel clock input duty cycle 30 70 % MS32414V1 Pixel clock tsu(VSYNC) tsu(HSYNC) HSYNC VSYNC DATA[0:13] 1/DCMI_PIXCLK th(HSYNC) th(HSYNC) tsu(DATA) th(DATA) Electrical characteristics STM32F405xx, STM32F407xx 156/185 DocID022152 Rev 4 5.3.27 SD/SDIO MMC card host interface (SDIO) characteristics Unless otherwise specified, the parameters given in Table 88 are derived from tests performed under ambient temperature, fPCLKx frequency and VDD supply voltage conditions summarized in Table 14 with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 10 • Capacitive load C = 30 pF • Measurement points are done at CMOS levels: 0.5VDD Refer to Section 5.3.16: I/O port characteristics for more details on the input/output characteristics. Figure 74. SDIO high-speed mode tsu(DATA) Data input setup time 2.5 - ns th(DATA) Data hold time 1 - tsu(HSYNC), tsu(VSYNC) HSYNC/VSYNC input setup time 2 - th(HSYNC), th(VSYNC) HSYNC/VSYNC input hold time 0.5 - 1. Data based on characterization results, not tested in production. Table 87. DCMI characteristics(1) (continued) Symbol Parameter Min Max Unit tW(CKH) CK D, CMD (output) D, CMD (input) tC tW(CKL) tOV tOH tISU tIH tf tr ai14887 DocID022152 Rev 4 157/185 STM32F405xx, STM32F407xx Electrical characteristics Figure 75. SD default mode 5.3.28 RTC characteristics CK D, CMD (output) tOVD tOHD ai14888 Table 88. Dynamic characteristics: SD / MMC characteristics(1) Symbol Parameter Conditions Min Typ Max Unit fPP Clock frequency in data transfer mode 0 48 MHz SDIO_CK/fPCLK2 frequency ratio - - 8/3 - tW(CKL) Clock low time fpp = 48 MHz 8.5 9 - ns tW(CKH) Clock high time fpp = 48 MHz 8.3 10 - CMD, D inputs (referenced to CK) in MMC and SD HS mode tISU Input setup time HS fpp = 48 MHz 3 - - ns tIH Input hold time HS fpp = 48 MHz 0 - - CMD, D outputs (referenced to CK) in MMC and SD HS mode tOV Output valid time HS fpp = 48 MHz - 4.5 6 ns tOH Output hold time HS fpp = 48 MHz 1 - - CMD, D inputs (referenced to CK) in SD default mode tISUD Input setup time SD fpp = 24 MHz 1.5 - - ns tIHD Input hold time SD fpp = 24 MHz 0.5 - - CMD, D outputs (referenced to CK) in SD default mode tOVD Output valid default time SD fpp = 24 MHz - 4.5 7 ns tOHD Output hold default time SD fpp = 24 MHz 0.5 - - 1. Data based on characterization results, not tested in production. Table 89. RTC characteristics Symbol Parameter Conditions Min Max - fPCLK1/RTCCLK frequency ratio Any read/write operation from/to an RTC register 4 - Package characteristics STM32F405xx, STM32F407xx 158/185 DocID022152 Rev 4 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID022152 Rev 4 159/185 STM32F405xx, STM32F407xx Package characteristics Figure 76. WLCSP90 - 0.400 mm pitch wafer level chip size package outline Bump side Side view Detail A Wafer back side A1 ball location A1 Detail A rotated by 90 °C eee D A0JW_ME Seating plane A2 A b E e e1 e G F e2 Table 90. WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.520 0.570 0.620 0.0205 0.0224 0.0244 A1 0.165 0.190 0.215 0.0065 0.0075 0.0085 A2 0.350 0.380 0.410 0.0138 0.015 0.0161 b 0.240 0.270 0.300 0.0094 0.0106 0.0118 D 4.178 4.218 4.258 0.1645 0.1661 0.1676 E 3.964 3.969 4.004 0.1561 0.1563 0.1576 e 0.400 0.0157 e1 3.600 0.1417 e2 3.200 0.126 F 0.312 0.0123 G 0.385 0.0152 eee 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Package characteristics STM32F405xx, STM32F407xx 160/185 DocID022152 Rev 4 Figure 77. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline 1. Drawing is not to scale. ai14398b A A2 A1 c L1 L E E1 D D1 e b Table 91. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 1.600 0.0630 A1 0.050 0.150 0.0020 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 c 0.090 0.200 0.0035 0.0079 D 12.000 0.4724 D1 10.000 0.3937 E 12.000 0.4724 E1 10.000 0.3937 e 0.500 0.0197 θ 0° 3.5° 7° 0° 3.5° 7° L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 1.000 0.0394 N Number of pins 64 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID022152 Rev 4 161/185 STM32F405xx, STM32F407xx Package characteristics Figure 78. LQFP64 recommended footprint 1. Drawing is not to scale. 2. Dimensions are in millimeters. 48 49 32 64 17 1 16 1.2 0.3 33 10.3 12.7 10.3 0.5 7.8 12.7 ai14909 Package characteristics STM32F405xx, STM32F407xx 162/185 DocID022152 Rev 4 Figure 79. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline 1. Drawing is not to scale. IDENTIFICATION e PIN 1 GAUGE PLANE 0.25 mm SEATING PLANE D D1 D3 E3 E1 E K ccc C C 1 25 100 26 76 75 51 50 1L_ME_V4 A2 A A1 L1 L c b A1 Table 92. LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data(1) Symbol millimeters inches Min Typ Max Min Typ Max A 1.600 0.0630 A1 0.050 0.150 0.0020 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 c 0.090 0.200 0.0035 0.0079 D 15.800 16.000 16.200 0.6220 0.6299 0.6378 D1 13.800 14.000 14.200 0.5433 0.5512 0.5591 D3 12.000 0.4724 E 15.80v 16.000 16.200 0.6220 0.6299 0.6378 E1 13.800 14.000 14.200 0.5433 0.5512 0.5591 E3 12.000 0.4724 e 0.500 0.0197 L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 1.000 0.0394 k 0° 3.5° 7° 0° 3.5° 7° ccc 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID022152 Rev 4 163/185 STM32F405xx, STM32F407xx Package characteristics Figure 80. LQFP100 recommended footprint 1. Drawing is not to scale. 2. Dimensions are in millimeters. 75 51 76 50 0.5 0.3 16.7 14.3 100 26 12.3 25 1.2 16.7 1 ai14906 Package characteristics STM32F405xx, STM32F407xx 164/185 DocID022152 Rev 4 Figure 81. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline 1. Drawing is not to scale. D1 D3 D E3 E1 E e Pin 1 identification 73 72 37 36 109 144 108 1 A A2A1 b c A1 L L1 k Seating plane C ccc C 0.25 mm gage plane ME_1A Table 93. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 1.600 0.0630 A1 0.050 0.150 0.0020 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 c 0.090 0.200 0.0035 0.0079 D 21.800 22.000 22.200 0.8583 0.8661 0.874 D1 19.800 20.000 20.200 0.7795 0.7874 0.7953 D3 17.500 0.689 E 21.800 22.000 22.200 0.8583 0.8661 0.8740 E1 19.800 20.000 20.200 0.7795 0.7874 0.7953 E3 17.500 0.6890 e 0.500 0.0197 L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 1.000 0.0394 DocID022152 Rev 4 165/185 STM32F405xx, STM32F407xx Package characteristics Figure 82. LQFP144 recommended footprint 1. Drawing is not to scale. 2. Dimensions are in millimeters. k 0° 3.5° 7° 0° 3.5° 7° ccc 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 93. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max ai14905c 0.5 0.35 19.9 17.85 22.6 1.35 22.6 19.9 1 36 37 72 108 73 109 144 Package characteristics STM32F405xx, STM32F407xx 166/185 DocID022152 Rev 4 Figure 83. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline 1. Drawing is not to scale. Table 94. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.002 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 b 0.230 0.280 0.330 0.0091 0.0110 0.0130 D 9.900 10.000 10.100 0.3898 0.3937 0.3976 E 9.900 10.000 10.100 0.3898 0.3937 0.3976 e 0.650 0.0256 F 0.425 0.450 0.475 0.0167 0.0177 0.0187 ddd 0.080 0.0031 eee 0.150 0.0059 fff 0.080 0.0031 A0E7_ME_V4 Seating plane A2 ddd C A1 A e F F e R A 15 1 BOTTOM VIEW E D TOP VIEW Øb (176 + 25 balls) B A Ø eee M B Ø fff M C C A C A1 ball identifier A1 ball index area DocID022152 Rev 4 167/185 STM32F405xx, STM32F407xx Package characteristics Figure 84. LQFP176 24 x 24 mm, 176-pin low-profile quad flat package outline 1. Drawing is not to scale. ccc C C Seating plane A A2 A1 c 0.25 mm gauge plane HD D A1 L L1 k 89 88 E HE 45 44 e 1 176 Pin 1 identification b 133 132 1T_ME ZD ZE Table 95. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 1.600 0.0630 A1 0.050 0.150 0.0020 A2 1.350 1.450 0.0531 0.0060 b 0.170 0.270 0.0067 0.0106 C 0.090 0.200 0.0035 0.0079 D 23.900 24.100 0.9409 0.9488 E 23.900 24.100 0.9409 0.9488 e 0.500 0.0197 HD 25.900 26.100 1.0200 1.0276 HE 25.900 26.100 1.0200 1.0276 L 0.450 0.750 0.0177 0.0295 L1 1.000 0.0394 ZD 1.250 0.0492 ZE 1.250 0.0492 Package characteristics STM32F405xx, STM32F407xx 168/185 DocID022152 Rev 4 Figure 85. LQFP176 recommended footprint 1. Dimensions are expressed in millimeters. ccc 0.080 0.0031 k 0 ° 7 ° 0 ° 7 ° 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 95. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max 1T_FP_V1 133 132 1.2 0.3 0.5 89 88 1.2 44 45 21.8 26.7 1 176 26.7 21.8 DocID022152 Rev 4 169/185 STM32F405xx, STM32F407xx Package characteristics 6.2 Thermal characteristics The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: • TA max is the maximum ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. Table 96. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient LQFP64 - 10 × 10 mm / 0.5 mm pitch 46 °C/W Thermal resistance junction-ambient LQFP100 - 14 × 14 mm / 0.5 mm pitch 43 Thermal resistance junction-ambient LQFP144 - 20 × 20 mm / 0.5 mm pitch 40 Thermal resistance junction-ambient LQFP176 - 24 × 24 mm / 0.5 mm pitch 38 Thermal resistance junction-ambient UFBGA176 - 10× 10 mm / 0.65 mm pitch 39 Thermal resistance junction-ambient WLCSP90 - 0.400 mm pitch 38.1 Part numbering STM32F405xx, STM32F407xx 170/185 DocID022152 Rev 4 7 Part numbering For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST sales office. Table 97. Ordering information scheme Example: STM32 F 405 R E T 6 xxx Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 405 = STM32F40x, connectivity 407= STM32F40x, connectivity, camera interface, Ethernet Pin count R = 64 pins O = 90 pins V = 100 pins Z = 144 pins I = 176 pins Flash memory size E = 512 Kbytes of Flash memory G = 1024 Kbytes of Flash memory Package T = LQFP H = UFBGA Y = WLCSP Temperature range 6 = Industrial temperature range, –40 to 85 °C. 7 = Industrial temperature range, –40 to 105 °C. Options xxx = programmed parts TR = tape and reel DocID022152 Rev 4 171/185 STM32F405xx, STM32F407xx Application block diagrams Appendix A Application block diagrams A.1 USB OTG full speed (FS) interface solutions Figure 86. USB controller configured as peripheral-only and used in Full speed mode 1. External voltage regulator only needed when building a VBUS powered device. 2. The same application can be developed using the OTG HS in FS mode to achieve enhanced performance thanks to the large Rx/Tx FIFO and to a dedicated DMA controller. Figure 87. USB controller configured as host-only and used in full speed mode 1. The current limiter is required only if the application has to support a VBUS powered device. A basic power switch can be used if 5 V are available on the application board. 2. The same application can be developed using the OTG HS in FS mode to achieve enhanced performance thanks to the large Rx/Tx FIFO and to a dedicated DMA controller. STM32F4xx 5V to VDD Volatge regulator (1) VDD VBUS DP VSS PA12/PB15 PA11//PB14 USB Std-B connector DM OSC_IN OSC_OUT MS19000V5 STM32F4xx VDD VBUS DP VSS USB Std-A connector DM GPIO+IRQ GPIO EN Overcurrent 5 V Pwr OSC_IN OSC_OUT MS19001V4 Current limiter power switch(1) PA12/PB15 PA11//PB14 Application block diagrams STM32F405xx, STM32F407xx 172/185 DocID022152 Rev 4 Figure 88. USB controller configured in dual mode and used in full speed mode 1. External voltage regulator only needed when building a VBUS powered device. 2. The current limiter is required only if the application has to support a VBUS powered device. A basic power switch can be used if 5 V are available on the application board. 3. The ID pin is required in dual role only. 4. The same application can be developed using the OTG HS in FS mode to achieve enhanced performance thanks to the large Rx/Tx FIFO and to a dedicated DMA controller. STM32F4xx VDD VBUS DP VSS PA9/PB13 PA12/PB15 PA11/PB14 USB micro-AB connector DM GPIO+IRQ GPIO EN Overcurrent 5 V Pwr 5 V to VDD voltage regulator (1) VDD ID(3) PA10/PB12 OSC_IN OSC_OUT MS19002V3 Current limiter power switch(2) DocID022152 Rev 4 173/185 STM32F405xx, STM32F407xx Application block diagrams A.2 USB OTG high speed (HS) interface solutions Figure 89. USB controller configured as peripheral, host, or dual-mode and used in high speed mode 1. It is possible to use MCO1 or MCO2 to save a crystal. It is however not mandatory to clock the STM32F40x with a 24 or 26 MHz crystal when using USB HS. The above figure only shows an example of a possible connection. 2. The ID pin is required in dual role only. DP STM32F4xx DM VBUS VSS DM DP ID(2) USB USB HS OTG Ctrl FS PHY ULPI High speed OTG PHY ULPI_CLK ULPI_D[7:0] ULPI_DIR ULPI_STP ULPI_NXT not connected connector MCO1 or MCO2 24 or 26 MHz XT(1) PLL XT1 XI MS19005V2 Application block diagrams STM32F405xx, STM32F407xx 174/185 DocID022152 Rev 4 A.3 Ethernet interface solutions Figure 90. MII mode using a 25 MHz crystal 1. fHCLK must be greater than 25 MHz. 2. Pulse per second when using IEEE1588 PTP optional signal. Figure 91. RMII with a 50 MHz oscillator 1. fHCLK must be greater than 25 MHz. MCU Ethernet MAC 10/100 Ethernet PHY 10/100 PLL HCLK XT1 PHY_CLK 25 MHz MII_RX_CLK MII_RXD[3:0] MII_RX_DV MII_RX_ER MII_TX_CLK MII_TX_EN MII_TXD[3:0] MII_CRS MII_COL MDIO MDC HCLK(1) PPS_OUT(2) XTAL 25 MHz STM32 OSC TIM2 Timestamp comparator Timer input trigger IEEE1588 PTP MII = 15 pins MII + MDC = 17 pins MS19968V1 MCO1/MCO2 MCU Ethernet MAC 10/100 Ethernet PHY 10/100 PLL HCLK PHY_CLK 50 MHz XT1 RMII_RXD[1:0] RMII_CRX_DV RMII_REF_CLK RMII_TX_EN RMII_TXD[1:0] MDIO MDC HCLK(1) STM32 OSC 50 MHz TIM2 Timestamp comparator Timer input trigger IEEE1588 PTP RMII = 7 pins RMII + MDC = 9 pins MS19969V1 /2 or /20 2.5 or 25 MHz synchronous 50 MHz 50 MHz DocID022152 Rev 4 175/185 STM32F405xx, STM32F407xx Application block diagrams Figure 92. RMII with a 25 MHz crystal and PHY with PLL 1. fHCLK must be greater than 25 MHz. 2. The 25 MHz (PHY_CLK) must be derived directly from the HSE oscillator, before the PLL block. MCU Ethernet MAC 10/100 Ethernet PHY 10/100 PLL HCLK PHY_CLK 25 MHz XT1 RMII_RXD[1:0] RMII_CRX_DV RMII_REF_CLK RMII_TX_EN RMII_TXD[1:0] MDIO MDC HCLK(1) STM32F TIM2 Timestamp comparator Timer input trigger IEEE1588 PTP RMII = 7 pins RMII + MDC = 9 pins MS19970V1 /2 or /20 2.5 or 25 MHz synchronous 50 MHz XTAL 25 MHz OSC PLL REF_CLK MCO1/MCO2 Revision history STM32F405xx, STM32F407xx 176/185 DocID022152 Rev 4 8 Revision history Table 98. Document revision history Date Revision Changes 15-Sep-2011 1 Initial release. 24-Jan-2012 2 Added WLCSP90 package on cover page. Renamed USART4 and USART5 into UART4 and UART5, respectively. Updated number of USB OTG HS and FS in Table 2: STM32F405xx and STM32F407xx: features and peripheral counts. Updated Figure 3: Compatible board design between STM32F10xx/STM32F2xx/STM32F4xx for LQFP144 package and Figure 4: Compatible board design between STM32F2xx and STM32F4xx for LQFP176 and BGA176 packages, and removed note 1 and 2. Updated Section 2.2.9: Flexible static memory controller (FSMC). Modified I/Os used to reprogram the Flash memory for CAN2 and USB OTG FS in Section 2.2.13: Boot modes. Updated note in Section 2.2.14: Power supply schemes. PDR_ON no more available on LQFP100 package. Updated Section 2.2.16: Voltage regulator. Updated condition to obtain a minimum supply voltage of 1.7 V in the whole document. Renamed USART4/5 to UART4/5 and added LIN and IrDA feature for UART4 and UART5 in Table 5: USART feature comparison. Removed support of I2C for OTG PHY in Section 2.2.30: Universal serial bus on-the-go full-speed (OTG_FS). Added Table 6: Legend/abbreviations used in the pinout table. Table 7: STM32F40x pin and ball definitions: replaced VSS_3, VSS_4, and VSS_8 by VSS; reformatted Table 7: STM32F40x pin and ball definitions to better highlight I/O structure, and alternate functions versus additional functions; signal corresponding to LQFP100 pin 99 changed from PDR_ON to VSS; EVENTOUT added in the list of alternate functions for all I/Os; ADC3_IN8 added as alternate function for PF10; FSMC_CLE and FSMC_ALE added as alternate functions for PD11 and PD12, respectively; PH10 alternate function TIM15_CH1_ETR renamed TIM5_CH1; updated PA4 and PA5 I/O structure to TTa. Removed OTG_HS_SCL, OTG_HS_SDA, OTG_FS_INTN in Table 7: STM32F40x pin and ball definitions and Table 9: Alternate function mapping. Changed TCM data RAM to CCM data RAM in Figure 18: STM32F40x memory map. Added IVDD and IVSS maximum values in Table 12: Current characteristics. Added Note 1 related to fHCLK, updated Note 2 in Table 14: General operating conditions, and added maximum power dissipation values. Updated Table 15: Limitations depending on the operating power supply range. DocID022152 Rev 4 177/185 STM32F405xx, STM32F407xx Revision history 24-Jan-2012 2 (continued) Added V12 in Table 19: Embedded reset and power control block characteristics. Updated Table 21: Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator disabled) and Table 20: Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator enabled) or RAM. Added Figure , Figure 25, Figure 26, and Figure 27. Updated Table 22: Typical and maximum current consumption in Sleep mode and removed Note 1. Updated Table 23: Typical and maximum current consumptions in Stop mode and Table 24: Typical and maximum current consumptions in Standby mode, Table 25: Typical and maximum current consumptions in VBAT mode, and Table 26: Switching output I/O current consumption. Section : On-chip peripheral current consumption: modified conditions, and updated Table 27: Peripheral current consumption and Note 2. Changed fHSE_ext to 50 MHz and tr(HSE)/tf(HSE) maximum value in Table 29: High-speed external user clock characteristics. Added Cin(LSE) in Table 30: Low-speed external user clock characteristics. Updated maximum PLL input clock frequency, removed related note, and deleted jitter for MCO for RMII Ethernet typical value in Table 35: Main PLL characteristics. Updated maximum PLLI2S input clock frequency and removed related note in Table 36: PLLI2S (audio PLL) characteristics. Updated Section : Flash memory to specify that the devices are shipped to customers with the Flash memory erased. Updated Table 38: Flash memory characteristics, and added tME in Table 39: Flash memory programming. Updated Table 42: EMS characteristics, and Table 43: EMI characteristics. Updated Table 56: I2S dynamic characteristics Updated Figure 46: ULPI timing diagram and Table 62: ULPI timing. Added tCOUNTER and tMAX_COUNT in Table 51: Characteristics of TIMx connected to the APB1 domain and Table 52: Characteristics of TIMx connected to the APB2 domain. Updated Table 65: Dynamic characteristics: Ethernet MAC signals for RMII. Removed USB-IF certification in Section : USB OTG FS characteristics. Table 98. Document revision history (continued) Date Revision Changes Revision history STM32F405xx, STM32F407xx 178/185 DocID022152 Rev 4 24-Jan-2012 2 (continued) Updated Table 61: USB HS clock timing parameters Updated Table 67: ADC characteristics. Updated Table 68: ADC accuracy at fADC = 30 MHz. Updated Note 1 in Table 74: DAC characteristics. Section 5.3.25: FSMC characteristics: updated Table 75 toTable 86, changed CL value to 30 pF, and modified FSMC configuration for asynchronous timings and waveforms. Updated Figure 60: Synchronous multiplexed PSRAM write timings. Updated Table 96: Package thermal characteristics. Appendix A.1: USB OTG full speed (FS) interface solutions: modified Figure 86: USB controller configured as peripheral-only and used in Full speed mode added Note 2, updated Figure 87: USB controller configured as host-only and used in full speed mode and added Note 2, changed Figure 88: USB controller configured in dual mode and used in full speed mode and added Note 3. Appendix A.2: USB OTG high speed (HS) interface solutions: removed figures USB OTG HS device-only connection in FS mode and USB OTG HS host-only connection in FS mode, and updated Figure 89: USB controller configured as peripheral, host, or dual-mode and used in high speed mode and added Note 2. Added Appendix A.3: Ethernet interface solutions. Table 98. Document revision history (continued) Date Revision Changes DocID022152 Rev 4 179/185 STM32F405xx, STM32F407xx Revision history 31-May-2012 3 Updated Figure 5: STM32F40x block diagram and Figure 7: Power supply supervisor interconnection with internal reset OFF Added SDIO, added notes related to FSMC and SPI/I2S in Table 2: STM32F405xx and STM32F407xx: features and peripheral counts. Starting from Silicon revision Z, USB OTG full-speed interface is now available for all STM32F405xx devices. Added full information on WLCSP90 package together with corresponding part numbers. Changed number of AHB buses to 3. Modified available Flash memory sizes in Section 2.2.4: Embedded Flash memory. Modified number of maskable interrupt channels in Section 2.2.10: Nested vectored interrupt controller (NVIC). Updated case of Regulator ON/internal reset ON, Regulator ON/internal reset OFF, and Regulator OFF/internal reset ON in Section 2.2.16: Voltage regulator. Updated standby mode description in Section 2.2.19: Low-power modes. Added Note 1 below Figure 16: STM32F40x UFBGA176 ballout. Added Note 1 below Figure 17: STM32F40x WLCSP90 ballout. Updated Table 7: STM32F40x pin and ball definitions. Added Table 8: FSMC pin definition. Removed OTG_HS_INTN alternate function in Table 7: STM32F40x pin and ball definitions and Table 9: Alternate function mapping. Removed I2S2_WS on PB6/AF5 in Table 9: Alternate function mapping. Replaced JTRST by NJTRST, removed ETH_RMII _TX_CLK, and modified I2S3ext_SD on PC11 in Table 9: Alternate function mapping. Added Table 10: STM32F40x register boundary addresses. Updated Figure 18: STM32F40x memory map. Updated VDDA and VREF+ decoupling capacitor in Figure 21: Power supply scheme. Added power dissipation maximum value for WLCSP90 in Table 14: General operating conditions. Updated VPOR/PDR in Table 19: Embedded reset and power control block characteristics. Updated notes in Table 21: Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator disabled), Table 20: Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator enabled) or RAM, and Table 22: Typical and maximum current consumption in Sleep mode. Updated maximum current consumption at TA = 25 °n Table 23: Typical and maximum current consumptions in Stop mode. Table 98. Document revision history (continued) Date Revision Changes Revision history STM32F405xx, STM32F407xx 180/185 DocID022152 Rev 4 31-May-2012 3 (continued) Removed fHSE_ext typical value in Table 29: High-speed external user clock characteristics. Updated Table 31: HSE 4-26 MHz oscillator characteristics and Table 32: LSE oscillator characteristics (fLSE = 32.768 kHz). Added fPLL48_OUT maximum value in Table 35: Main PLL characteristics. Modified equation 1 and 2 in Section 5.3.11: PLL spread spectrum clock generation (SSCG) characteristics. Updated Table 38: Flash memory characteristics, Table 39: Flash memory programming, and Table 40: Flash memory programming with VPP. Updated Section : Output driving current. Table 53: I2C characteristics: Note 4 updated and applied to th(SDA) in Fast mode, and removed note 4 related to th(SDA) minimum value. Updated Table 67: ADC characteristics. Updated note concerning ADC accuracy vs. negative injection current below Table 68: ADC accuracy at fADC = 30 MHz. Added WLCSP90 thermal resistance in Table 96: Package thermal characteristics. Updated Table 90: WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data. Updated Figure 83: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline and Table 94: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data. Added Figure 85: LQFP176 recommended footprint. Removed 256 and 768 Kbyte Flash memory density from Table 97: Ordering information scheme. Table 98. Document revision history (continued) Date Revision Changes DocID022152 Rev 4 181/185 STM32F405xx, STM32F407xx Revision history 04-Jun-2013 4 Modified Note 1 below Table 2: STM32F405xx and STM32F407xx: features and peripheral counts. Updated Figure 4 title. Updated Note 3 below Figure 21: Power supply scheme. Changed simplex mode into half-duplex mode in Section 2.2.25: Interintegrated sound (I2S). Replaced DAC1_OUT and DAC2_OUT by DAC_OUT1 and DAC_OUT2, respectively. Updated pin 36 signal in Figure 15: STM32F40x LQFP176 pinout. Changed pin number from F8 to D4 for PA13 pin in Table 7: STM32F40x pin and ball definitions. Replaced TIM2_CH1/TIM2_ETR by TIM2_CH1_ETR for PA0 and PA5 pins in Table 9: Alternate function mapping. Changed system memory into System memory + OTP in Figure 18: STM32F40x memory map. Added Note 1 below Table 16: VCAP_1/VCAP_2 operating conditions. Updated IDDA description in Table 74: DAC characteristics. Removed PA9/PB13 connection to VBUS in Figure 86: USB controller configured as peripheral-only and used in Full speed mode and Figure 87: USB controller configured as host-only and used in full speed mode. Updated SPI throughput on front page and Section 2.2.24: Serial peripheral interface (SPI) Updated operating voltages in Table 2: STM32F405xx and STM32F407xx: features and peripheral counts Updated note in Section 2.2.14: Power supply schemes Updated Section 2.2.15: Power supply supervisor Updated “Regulator ON” paragraph in Section 2.2.16: Voltage regulator Removed note in Section 2.2.19: Low-power modes Corrected wrong reference manual in Section 2.2.28: Ethernet MAC interface with dedicated DMA and IEEE 1588 support Updated Table 15: Limitations depending on the operating power supply range Updated Table 24: Typical and maximum current consumptions in Standby mode Updated Table 25: Typical and maximum current consumptions in VBAT mode Updated Table 36: PLLI2S (audio PLL) characteristics Updated Table 43: EMI characteristics Updated Table 48: Output voltage characteristics Updated Table 50: NRST pin characteristics Updated Table 55: SPI dynamic characteristics Updated Table 56: I2S dynamic characteristics Deleted Table 59 Updated Table 62: ULPI timing Updated Figure 47: Ethernet SMI timing diagram Table 98. Document revision history (continued) Date Revision Changes Revision history STM32F405xx, STM32F407xx 182/185 DocID022152 Rev 4 04-Jun-2013 4 (continued) Updated Figure 83: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline Updated Table 94: UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data Updated Figure 5: STM32F40x block diagram Updated Section 2: Description Updated footnote (3) in Table 2: STM32F405xx and STM32F407xx: features and peripheral counts Updated Figure 3: Compatible board design between STM32F10xx/STM32F2xx/STM32F4xx for LQFP144 package Updated Figure 4: Compatible board design between STM32F2xx and STM32F4xx for LQFP176 and BGA176 packages Updated Section 2.2.14: Power supply schemes Updated Section 2.2.15: Power supply supervisor Updated Section 2.2.16: Voltage regulator, including figures. Updated Table 14: General operating conditions, including footnote (2). Updated Table 15: Limitations depending on the operating power supply range, including footnote (3). Updated footnote (1) in Table 67: ADC characteristics. Updated footnote (3) in Table 68: ADC accuracy at fADC = 30 MHz. Updated footnote (1) in Table 74: DAC characteristics. Updated Figure 9: Regulator OFF. Updated Figure 7: Power supply supervisor interconnection with internal reset OFF. Added Section 2.2.17: Regulator ON/OFF and internal reset ON/OFF availability. Updated footnote (2) of Figure 21: Power supply scheme. Replaced respectively “I2S3S_WS" by "I2S3_WS”, “I2S3S_CK” by “I2S3_CK” and “FSMC_BLN1” by “FSMC_NBL1” in Table 9: Alternate function mapping. Added “EVENTOUT” as alternate function “AF15” for pin PC13, PC14, PC15, PH0, PH1, PI8 in Table 9: Alternate function mapping Replaced “DCMI_12” by “DCMI_D12” in Table 7: STM32F40x pin and ball definitions. Removed the following sentence from Section : I2C interface characteristics: ”Unless otherwise specified, the parameters given in Table 53 are derived from tests performed under the ambient temperature, fPCLK1 frequency and VDD supply voltage conditions summarized in Table 14.”. In Table 7: STM32F40x pin and ball definitions on page 45: – For pin PC13, replaced “RTC_AF1” by “RTC_OUT, RTC_TAMP1, RTC_TS” – for pin PI8, replaced “RTC_AF2” by “RTC_TAMP1, RTC_TAMP2, RTC_TS”. – for pin PB15, added RTC_REFIN in Alternate functions column. In Table 9: Alternate function mapping on page 60, for port PB15, replaced “RTC_50Hz” by “RTC_REFIN”. Table 98. Document revision history (continued) Date Revision Changes DocID022152 Rev 4 183/185 STM32F405xx, STM32F407xx Revision history 04-Jun-2013 4 (continued) Updated Figure 6: Multi-AHB matrix. Updated Figure 7: Power supply supervisor interconnection with internal reset OFF Changed 1.2 V to V12 in Section : Regulator OFF Updated LQFP176 pin 48. Updated Section 1: Introduction. Updated Section 2: Description. Updated operating voltage in Table 2: STM32F405xx and STM32F407xx: features and peripheral counts. Updated Note 1. Updated Section 2.2.15: Power supply supervisor. Updated Section 2.2.16: Voltage regulator. Updated Figure 9: Regulator OFF. Updated Table 3: Regulator ON/OFF and internal reset ON/OFF availability. Updated Section 2.2.19: Low-power modes. Updated Section 2.2.20: VBAT operation. Updated Section 2.2.22: Inter-integrated circuit interface (I²C) . Updated pin 48 in Figure 15: STM32F40x LQFP176 pinout. Updated Table 6: Legend/abbreviations used in the pinout table. Updated Table 7: STM32F40x pin and ball definitions. Updated Table 14: General operating conditions. Updated Table 15: Limitations depending on the operating power supply range. Updated Section 5.3.7: Wakeup time from low-power mode. Updated Table 33: HSI oscillator characteristics. Updated Section 5.3.15: I/O current injection characteristics. Updated Table 47: I/O static characteristics. Updated Table 50: NRST pin characteristics. Updated Table 53: I2C characteristics. Updated Figure 39: I2C bus AC waveforms and measurement circuit. Updated Section 5.3.19: Communications interfaces. Updated Table 67: ADC characteristics. Added Table 70: Temperature sensor calibration values. Added Table 73: Internal reference voltage calibration values. Updated Section 5.3.25: FSMC characteristics. Updated Section 5.3.27: SD/SDIO MMC card host interface (SDIO) characteristics. Updated Table 23: Typical and maximum current consumptions in Stop mode. Updated Section : SPI interface characteristics included Table 55. Updated Section : I2S interface characteristics included Table 56. Updated Table 64: Dynamic characteristics: Ehternet MAC signals for SMI. Updated Table 66: Dynamic characteristics: Ethernet MAC signals for MII. Table 98. Document revision history (continued) Date Revision Changes Revision history STM32F405xx, STM32F407xx 184/185 DocID022152 Rev 4 04-Jun-2013 4 (continued) Updated Table 64: Dynamic characteristics: Ehternet MAC signals for SMI. Updated Table 66: Dynamic characteristics: Ethernet MAC signals for MII. Updated Table 79: Synchronous multiplexed NOR/PSRAM read timings. Updated Table 80: Synchronous multiplexed PSRAM write timings. Updated Table 81: Synchronous non-multiplexed NOR/PSRAM read timings. Updated Table 82: Synchronous non-multiplexed PSRAM write timings. Updated Section 5.3.26: Camera interface (DCMI) timing specifications including Table 87: DCMI characteristics and addition of Figure 73: DCMI timing diagram. Updated Section 5.3.27: SD/SDIO MMC card host interface (SDIO) characteristics including Table 88. Updated Chapter Figure 9. Table 98. Document revision history (continued) Date Revision Changes DocID022152 Rev 4 185/185 STM32F405xx, STM32F407xx Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland SIXTY User Guide LU Sixty.book Page 1 Mardi, 26. octobre 2010 2:22 14 1Couv.fm Page 1 Dimanche, 16. mai 2010 3:20 15 3 Dear customer, You have just acquired a new generation Sagemcom telephone and thank you for placing your confidence in us. This device has been manufactured with the utmost care. If you should have difficulties in operating it, we recommend that you consult this user manual. You can also find information on the following site: http://www.sagemcom.com/sixty To operate the device safely and easily, please read carefully the paragraph “Recommendations and safety instructions”, page 6. The CE label confirms that the product complies with the 1999/5/EC regulations of the European Union Parliament regarding wireless systems and telecommunications. The declaration of compliance may be looked up on the www.sagemcom.com website, or can be obtained from the following address : Sagemcom Broadband SAS 250, route de l'Empereur - 92848 Rueil-Malmaison Cedex - France Copyright © Sagemcom Broadband SAS All rights reserved Sagemcom is a registered trademark LU Sixty.book Page 3 Mercredi, 19. mai 2010 12:30 12 4 Contents Recommendations and safety instructions .....................6 Unpacking .......................................................................8 Phone description ...........................................................8 Your base................................................................... 8 Your handset.............................................................. 9 Control panel............................................................ 10 Phone installation ............................................ 12 Connecting the base .....................................................12 Setting up the handset ..................................................12 Charging batteries .........................................................12 Settings required before use .........................................13 Navigating in the menu .................................................13 Menu structure ......................................................... 14 Browsing through the menus ................................... 14 Phone use......................................................... 15 Handset location ...........................................................15 Telephoning ..................................................................15 Receiving a call ........................................................ 15 Making a call ............................................................ 16 Ending a call............................................................. 16 During a call ............................................................. 16 Call key function....................................................... 17 Secret mode............................................................. 17 Hands-free/speakerphone mode.............................. 17 Calling the last number dialled ................................. 18 Call time display ....................................................... 18 Phonebook ....................................................... 18 Creating an entry ...........................................................18 Editing an entry .............................................................19 Associating a ring tone with a phonebook entry ............19 Other number ................................................................19 Deleting an entry ...........................................................19 Calling using the phonebook .........................................20 Searching for a contact .................................................20 Call log.............................................................. 20 Viewing the received and dialled call log ...................... 20 The events log .............................................................. 21 Viewing the events log............................................. 21 Activating/deactivating the new event information screen............................ 21 Clearing notifications ............................................... 21 Information .................................................................... 21 Accessories...................................................... 22 Alarm clock ................................................................... 22 Activating / deactivating the alarm clock.................. 22 Changing the alarm clock ring tone ......................... 22 Modifying the alarm clock time ................................ 22 Timer ............................................................................ 22 Activate the timer..................................................... 22 Changing the programmed time of the timer ........... 23 Displaying or hiding the programmed time of the timer............................................................... 23 Changing the timer ring tone ................................... 23 Ring tones ........................................................ 23 Changing the ring tones ............................................... 23 Activating or deactivating the beeps ............................. 23 Activating/deactivating the silent mode ........................ 24 Settings............................................................. 24 Modifying the date and time ......................................... 24 Adjusting the contrast ................................................... 24 Modifying the language ................................................ 24 the voice box number (according to operator) .............. 25 Defining forbidden prefixes - Call barring ..................... 25 Demo ............................................................................ 26 Advanced settings ........................................................ 26 Base settings ........................................................... 26 Line settings ............................................................ 27 Modifying the base code.......................................... 29 LU Sixty.book Page 4 Mercredi, 19. mai 2010 12:30 12 5 Answering machine......................................... 29 Enabling / disabling the answering machine .................29 Modifying the OGM .......................................................30 Recording a personal outgoing message ................ 30 Deleting your personal OGM ................................... 30 Listen to a personal message .................................. 30 Playing messages .........................................................30 Remote access to answering machine .........................31 Deleting all the old messages .......................................31 TAM settings .................................................... 32 Activating and deactivating call screening ....................32 Modifying the remote access code ...............................32 Number of rings ............................................................32 Replacing the batteries................................... 33 Pairing GAP-compatible DECT handsets on the SIXTY base ........................................... 33 Appendix .......................................................... 34 Care and Maintenance ..................................................34 Problems .......................................................................34 Technical characteristics................................ 35 Initial condition .............................................................35 Environment..................................................... 36 Packaging .....................................................................36 Batteries and rechargeable batteries ............................36 The product ...................................................................36 Guarantee......................................................... 37 Terms and Conditions for United Kingdom & Ireland only ................................................................37 Terms and Conditions for other countries .....................39 LU SixtyTDM.fm Page 5 Jeudi, 20. mai 2010 9:03 09 6 RECOMMENDATIONS AND SAFETY INSTRUCTIONS Do not install your DECT telephone in a damp environment, such as a bathroom, washroom, kitchen etc, and not within 1.50 metres of a source of water or outside. This device is designed for use in temperatures of between 5 °C and 45 °C. Do not attempt to remove screws or open the appliance. It does not contain any user-replaceable parts. Only use the power unit supplied and connect it to the electricity mains in accordance with the installation instructions in this user manual and the details on the sticker regarding voltage, electrical current and frequency. As a precaution if there is a risk of danger, the power plug can be pulled out to disconnect the 230 volt power supply. Therefore the sockets should be near the device and easily accessible. This device is designed to be used for connecting to the public telephone network. If problems should arise, contact your nearest specialist dealer. Only use the telephone cable supplied. For safety reasons, never put the handset in the base station without the battery inserted or without the lid on the battery compartment as this could cause an electric shock. To avoid damaging your handset/base, only use certified rechargeable batteries NiMH 1.2 V 450 mAh, never use non rechargeable batteries. Insert the batteries in the handset/base battery compartment respecting polarity. The used battery must be disposed of in line with the recycling regulations in this user manual. Your DECT telephone has a range of approx. 50 metres indoors and up to 300 metres outdoors. The range can be affected by the proximity of metal objects, such as a television and electrical devices. Zones without reception may appear owing to elements in the building. This can cause brief interruptions in the conversation, caused by faulty transmission. LU Sixty.book Page 6 Mercredi, 19. mai 2010 12:30 12 7 Certain medical equipment and highly-sensitive machines or security systems may be affected by the transmission power of the telephone. In these cases we recommend adhering to the safety information. In regions greatly affected by electrical storms we recommend that you protect your telephone circuit with a special fixture for excess voltage. Your SIXTY has anti-skid pads that should leave no traces on your furniture and ensure stability. However, given the the wide variety of finishes used by furniture manufacturers, traces may appear on surfaces in contact with the parts of your SIXTY. Sagemcom Broadband SAS decline all responsibility in any such cases of damage. LU Sixty.book Page 7 Mercredi, 19. mai 2010 12:30 12 8 UNPACKING Place the box in front of you, open it and make sure it contains the following items: • one base SIXTY, one handset, one telephone line cord, one equipped power adapter and this user guide. PHONE DESCRIPTION Your base The SIXTY is the contemporary interpretation by SAGEMCOM of the S63, which accompanied the development of telephone communications in many countries in the 60s and 70s. It nevertheless has the latest technology, such as browser touch buttons, Hifi ringtones, dialling light and sound effects. * Keyway: indicates the position of the handset earpiece ** Press and hold the key : - If the answering machine is turned off: access to voice messaging service. - If the answering machine is turned on: access to your messages on the answering machine. Base button/Paging - Short press: find handsets (Paging) - Press and hold : handset registration Keyway * Loudspeaker/ Pick up Indicator light Access to voice messaging service/ Access to your messages on the answering machine ** LU Sixty.book Page 8 Mercredi, 19. mai 2010 12:30 12 9 Your handset SIXTY's particularity is that it has a wireless handset. The single button on the handset allows the user to hang up or answer an incoming call. It should be noted that the handset is provided with a buzzer that sounds on receiving an incoming call with the handset not on its base. The handset batteries are charged when the handset is placed on its base. When off the base, the handset's battery power provides 120 hours of standby time and 10 hours of talk time. Indicator light operation: • Fast flashing: handset registration or paging. • Slow flashing: handset on line or new events. Make sure that when the handset is on the charger, the icon is animated. Hang up/ Pick up Battery compartment Battery cover Handset charging contacts Speaker Microphone + - LU Sixty.book Page 9 Mercredi, 19. mai 2010 12:30 12 10 Control panel Your SIXTY has a touch keys for access to configuration and settings functions. The screen tells you about the state (date and time, unread message, etc..). Using the touch buttons The screen includes six touch keys around its periphery. Simply touch the tactile area for the function to be taken into account: Key Function(s) Key Function(s) Scroll up /Go to the menu list. Browse down / Go to the menu list. Context key 1: Access a menu / Validate the selection. Context key 2: Delete an entry / Return to the previous menu. Asterisk key. # key. LU Sixty.book Page 10 Mercredi, 19. mai 2010 12:30 12 11 Display screen During use or on standby, the screen of your SIXTY tells you about the state of your telephone by showing icons, and in particular: * The low emission icon (ECO mode): Your telephone is provided with an automatic power management system. As soon as the handset is near its base, the power required is reduced to the minimum. Radio transmissions are also cut off when the handset is placed on the base, and the low emission icon is then displayed. If a second handset is paired with the base, the "low emission" icon is no longer displayed. Battery indicator Microphone off Current call Speakerphone on Recording answering machine on Alarm on New voice message Low emission icon* LU Sixty.book Page 11 Mercredi, 19. mai 2010 12:30 12 12 PHONE INSTALLATION CONNECTING THE BASE Never force the plugs: they are in different shapes to avoid connection mistakes. 1. On the underside of the base, click the phone jack into its socket and connect the other end of the cord to the telephone wall outlet. 2. Connect the end of the power supply cord on the underside of the base and connect the power adapter to the mains socket. The phone display is turned on. SETTING UP THE HANDSET The batteries are already inserted in the handset. To put the handset into use, simply remove the tab by pulling on it firmly in the direction of the arrow. The handset emits a double beep to indicate that it has started and then a second beep to indicate that the handset is synchronized with the base. From then on, your handset becomes operative and you can use it to make calls. You can now use your telephone to make and receive calls. CHARGING BATTERIES Place the handset on its base and fully charge the batteries. An audio signal is emitted and a light flashes when the handset is placed correctly on the base. The battery charge icon is animated to indicate that the battery is being charged and stops to indicate that the batteries are fully charged. Before making any connections, please refer to the safety instructions presented at the beginning of this user guide. Power socket Telephone socket On leaving the factory, the handset is already registered in the base. If your handset is not recognized by the base, then launch a manual registration (See paragraph "Set the base to registration mode", page 26. LU Sixty.book Page 12 Mercredi, 19. mai 2010 12:30 12 13 SETTINGS REQUIRED BEFORE USE Setting the date and time accurately will enable you to Follow your calls and messages chronologically. According to where your base is situated in the room, You may have to adjust the contrast. To set the date and time, refer to paragraph "Modifying the date and time ", page 24. To set the contrast or the brightness of the screen, refer to paragraph "Adjusting the contrast ", page 24. NAVIGATING IN THE MENU With your SIXTY you can create your own telephone directory, display the list of calls etc. To do this, use the touch keys. With the touch keys 􀀘 and 􀀙 you can choose a menu, a sub-menu or a precise setting. The key allows you to enter the sub-menus of the chosen function and select the setting to modify. With the key you can return to the previous function or cancel the current choice. The keys and are used when you use the answerphone. See the menu structure to familiarise yourself with what your phone can do. The handset batteries charging time is 10 hours. During charging, the batteries may heat up. This is quite normal and perfectly safe. Handset charging contacts Base charging contacts LU Sixty.book Page 13 Mercredi, 19. mai 2010 12:30 12 14 Menu structure To access one of your phone's menus, use key 􀀘 or 􀀙. Browsing through the menus Use the browsing keys 􀀘 or 􀀙 to select the desired menu. Press Valid. To confirm your selection. Select the desired function by pressing the browsing keys 􀀘 or 􀀙 and then press the Valid. key. - To return to the previous menu, press Return. - To save the settings, press Valid.. Example: To access the menu SETTINGS /DATE/TIME: 1. Use 􀀘 or 􀀙 to access the menu list. 2. Select SETTINGS using 􀀘 or 􀀙. Press Valid.. 3. Select DATE/TIME using 􀀘 or 􀀙. Press Valid. You are now under the DATE/TIME menu.P Menu PHONEBOOK ACCESSORIES CALLS CALL INCOMING CALLS OUTGOING CALLS EVENTS ALARM TIMER EXTERNAL CALL SILENT MODE RING TONE SETTINGS Option VIEW RING TONE DELETE ADD NUMBER NEW ENTRY BEEPS DATE/TIME CONTRAST DEMO ANS.MACH MESSAGES ON/ OFF OUTGOING MESS. SETTINGS LANGUAGE Edit RESTRICTION ADVANCED SET. VOICE BOX No DATE/TIME LU Sixty.book Page 14 Mercredi, 19. mai 2010 12:30 12 15 PHONE USE HANDSET LOCATION Lost your handset? Press the button on the back of the base, behind the keypad. The handset will then ring. TELEPHONING Receiving a call • When a call is received, the phone rings. • The caller's phone number is displayed on the screen if you have subscribed to the "Caller ID" service. The caller's name may also be displayed if it is included in your phone book. Accepting a call in handset mode • Pick up the phone handset. You do not need to press the handset's button. • Make sure to identify the handset direction by the dot which identifies the earpiece end. The call time counter is displayed on the screen. • To end the call, hang up the handset or press the handset button. • A visual and audible signal confirms that the handset is hung up correctly. • If the handset is not on the base, you have to press the handset button to take the call. Accepting a call in speakerphone mode • Press to speak in speakerphone mode (without holding the handset). The symbol and the call time counter are displayed on the screen. • To end the call, press again. Toggle between handset mode and speakerphone mode • If you are in handset mode, press and hold the key and then hang up the handset to toggle to speakerphone mode. Press the key again to end the call. • If you are in speakerphone mode: - If the handset is hung up on the base, lift the phone handset to toggle to handset mode. - If the handset is not hung up on the base, press the dial tone button to toggle to handset mode. • To end the call, hang up the handset on the base or press . Use the 􀀘 and 􀀙 keys to vary the earphone volume or speakerphone volume. The handset earphone volume or speakerphone volume can vary from 1 to 5. LU Sixty.book Page 15 Mercredi, 19. mai 2010 12:30 12 16 Making a call The call can be made in two ways: Making a call in handset mode • Pick up the handset. • The icon is displayed on the screen. Dial your number on the keypad. The call time counter is displayed on the screen. Making a call in speakerphone mode • Press to obtain a dial tone prompt on the screen. Dial your number on the keypad. The and icons are displayed on the screen. The call time counter is displayed on the screen. Ending a call When you have finished your call, press or hang up the handset on the base. During a call Receiving a second call • During the call, a beep is transmitted to your telephone by your service provider to let you know that you have a second call waiting. • Press ACCEPT to take this new call. • Your other caller is then put on hold and you can talk with your second caller. Making a second call • During a call, you can put your contact on hold and call a second one by pressing -R- and dial the number using the keypad. • The second call is then launched, with the first call still on hold. To alternate from one call to the other • To toggle from one call to the other, press Menu then SWITCH. • The call in progress is put on hold, and you can then take the second call. To end one of the calls and continue the other one • To toggle from one call and take the other, press Menu and then HANGING UP. • The call in progress is definitely terminated, and you can then take the second call. You can also dial a number in pre-dialling mode, whether in handset or speakerphone mode: dial the number on the keypad and then lift the handset or press . If necessary, you can correct the number entered by pressing BACK. The caller on hold hears a beep emitted by the network. LU Sixty.book Page 16 Mercredi, 19. mai 2010 12:30 12 17 To set up a 3 way-call (the two parties and yourself) • During a call, press Menu and then 3-PARTY CONF. • You can then talk to both parties simultaneously, and "3-PARTY CONF" is displayed on the screen. • To end the 3 way-call, Hang up the handset. Call key function This key is a shortcut to your phone's call log. • From the idle screen, press the key : - INCOMING CALLS, - OUTGOING CALLS, - EVENTS. • Press keys 􀀘 or 􀀙 to select the calls list. • Press Valid. and then select the number using keys 􀀘 or 􀀙. Secret mode During a call, you can switch to mute mode and your phone's microphone will be muted. The person you are on line with can no longer hear you. To activate secret mode : • During a call, press Menu/ SECRET and then Activ.. • The "SECRET MODE" message will appear on the screen. To deactivate secret mode : • Press Exit, "SECRET MODE" disappears from the screen. Your correspondent will be able to hear you again. Hands-free/speakerphone mode If you want to phone in speakerphone mode, do not lift the handset, but press the base key; the icon is displayed on your phone's screen. The caller can then be heard through the loudspeaker and you speak into the base microphone. To end the call, press the key again . If you want to toggle to speakerphone mode during a call in handset mode, press the key; the icon is displayed on your phone's screen. The caller can then be heard through the base loudspeaker and the handset earphone and you speak into the handset microphone. In this mode the base microphone is inactive. You can return to speakerphone mode by holding down the key and then replacing the handset. To end the call, replace the handset or press the key . When you call hand-free/speakerphone mode, you can increase or decrease the audio volume from 1 to 5, using 􀀘 or 􀀙. LU Sixty.book Page 17 Mercredi, 19. mai 2010 12:30 12 18 Calling the last number dialled Your SIXTY stores the last 20 dialled numbers: • Go to CALLS / OUTGOING CALLS. • Select the number you want to call. • Go to Option / CALL. The number is automatically dialed in speakerphone mode. Call time display Once connected, the call time is displayed on the screen (minutes and seconds). PHONEBOOK You can save up to 150 entries in your phone book, with each sheet able to contain a 24-digit number and a name up to 12 letters long. CREATING AN ENTRY To enter a text, repeatedly press the required key to display the desired letter. • Go to PHONEBOOK / New. • Enter the name of your contact using the alphanumeric keys. • Press Valid.. • Enter the contact`s telephone number using the alphanumeric keys. • PressValid.. • Select an icon for this number to specify the type of number. • Press Valid.. The name and number are then stored in your phone book. LU Sixty.book Page 18 Mercredi, 19. mai 2010 12:30 12 19 EDITING AN ENTRY • Go to the menu PHONEBOOK. • Press keys 􀀘 or 􀀙 to select the contact you want to change. • Select Option / Edit. • Press Valid.. • You enter the name input screen. To correct the name, press Return to delete characters. Enter your changes on the keypad. After making the changes, press Valid.. • You enter the number input screen. To correct the number, press Return to delete the numbers. Enter your changes on the keypad. After making the changes, press Valid.. • Select an icon for this number. • Press Valid.. ASSOCIATING A RING TONE WITH A PHONEBOOK ENTRY You can associate a unique ring tone to each entry and thus create your own call groups As you need the active number presentation service on your handset, contact your operator to find out about the conditions for obtaining the service. • Go to the menu PHONEBOOK. • Select the entry with which you want to associate a ring tone. • Go to Option / RING TONE. • Select the ring tone of your choice. • Press Valid.. OTHER NUMBER This function allows you to assign new numbers to the same name. • Go to the menu PHONEBOOK. • Select the entry you want to assign another number to. • Go to Option / ADD NUMBER. • Enter the phone number on the alphanumeric keys. • PressValid.. • Select an icon according to the type of number entered. Press Valid.. DELETING AN ENTRY • Go to the menu PHONEBOOK. • Press keys 􀀘 or 􀀙 to select the contact you want to delete. • Select Option / DELETE. • Press Valid.. • A confirmation screen asks you if you wish to delete the entry. - To delete the entry, press Yes, the contact is deleted from your phone book. - If you do not wish to delete the entry, press No. LU Sixty.book Page 19 Mercredi, 19. mai 2010 12:30 12 20 CALLING USING THE PHONEBOOK • Go to the menu PHONEBOOK. • From the list of names, select the contact you want to call using keys 􀀘 or 􀀙. • Go to Option/CALL. The number is automatically dialled in speakerphone mode. SEARCHING FOR A CONTACT • Access your phonebook list, press successively on the keypad key which corresponds to the first letter of the name you are searching for so as to make it appear at the top of the screen. • Once the first letter of the name is displayed, wait a moment. • The phonebook selects the first name in the list that starts with the selected letter. CALL LOG Caller identification is a service that requires prior registration with your operator. VIEWING THE RECEIVED AND DIALLED CALL LOG • Go to the menu CALLS / INCOMING CALLS or OUTGOING CALLS. • Select the event to be viewed. • Press Valid.. • The screen presents the following information. (depending on the operator and the subscription): - the full name of your contact and the telephone number, - the number of consecutive calls, - time (for calls during the day) or the date (for previous calls) of the call. The calls are organised in chronological order, from the most recent call to the oldest call. To see the previous calls, use the keys 􀀘 or 􀀙. To check your call log directly, press the Log key from the idle screen. LU Sixty.book Page 20 Mercredi, 19. mai 2010 12:30 12 21 By pressing Option, a list of various executable actions appears: - CALL : To call the number. - VIEW : To view the selected call again. - STORE NUMBER : To store the name and number in the phonebook. - DELETE : To delete the call currently viewed. - DELETE ALL : To delete all calls. To return to the call viewing screen, press Return. THE EVENTS LOG Viewing the events log If one or more new events occurred during your absence, the information screen "NEW EVENTS !" appears and the light starts flashing. • If you do not wish to view the event log at this time, press Return. • To view the event log, press Valid.. • Choose the event using 􀀘 or 􀀙. • Press Valid.. Activating/deactivating the new event information screen The new event information screen can be inhibited. The events which have occurred can then be viewed in the menu CALLS / EVENTS / VIEW. The default setting is active. • Go to the menu CALLS / EVENTS. • Select ACTIVATE or DEACTIVATE to enable or disable the displaying of the new events screen. • Press Valid.. Clearing notifications The notifications received are saved in the event log and can be deleted once they have been viewed. • Go to the menu CALLS / EVENTS. • Select DELETE NOTIF. and press Valid. to remove the notifications received on your base. INFORMATION During an incoming call, following messages can be displayed: PRIVATE: Your contact does not want their number to be displayed. UNAVAILABLE: If there is a problem on the phone network. The light only stops flashing when all the events have been viewed. LU Sixty.book Page 21 Mercredi, 19. mai 2010 12:30 12 22 ACCESSORIES ALARM CLOCK This function enable you to use your SIXTY as an alarm clock. When the alarm is triggered the selected ring tone sounds for 60 seconds through the handset speaker and an alert screen is displayed. Activating / deactivating the alarm clock • Go to ACCESSORIES / ALARM. • An information screen shows the alarm clock status. • Use􀀘 or 􀀙 to select ACTIVATE or DEACTIVATE. • Press Valid.. The alarm settings information screen appears showing the new status. Changing the alarm clock ring tone • Go to ACCESSORIES / ALARM. • Use􀀘 or 􀀙 to select RING TONE in the list, press Valid.. • Select the ring tone of your choice, press Volume. • Select the desired ring tone using 􀀘 or 􀀙 to increase or decrease the volume, press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. Modifying the alarm clock time • Go to ACCESSORIES / ALARM. • Use􀀘 or 􀀙 to select SET TIME. • Enter the time at which you would like the alarm clock to sound. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. TIMER With this menu you can use your telephone as a timer. Once the specified time has elapsed, the base rings for 60 seconds and the alarm screen is activated. Turn off the alarm by pressing Stop, the base stops ringing. Activate the timer • Go to ACCESSORIES / TIMER. • Press Start. If a timer duration is already specified, the timer is directly activated. If not please follow instructions in the next paragraph. The timer function must be inactive so that it can be set. LU Sixty.book Page 22 Mercredi, 19. mai 2010 12:30 12 23 Changing the programmed time of the timer • Go to ACCESSORIES / TIMER. • Press Valid.. • Select SET DURATION in the list. Press Valid.. • Enter the desired time. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. Displaying or hiding the programmed time of the timer • Go to ACCESSORIES / TIMER. • Select VIEW in the list. Press Valid.. • If you want to show the timer, press Yes, else press No. • Press Return. Changing the timer ring tone • Go to ACCESSORIES / TIMER. • Select RING TONE in the list of options, press Valid.. • The list of ring tones appears, the handset plays the ring tone. • Select the ring tone. Press Volume. • Press 􀀘 or 􀀙 to increase or decrease the volume. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. RING TONES CHANGING THE RING TONES This menu enables you to associate a unique ring tone to incoming calls. • Go to RING TONE / EXTERNAL CALL. • Press Valid.. • Select the ring tone of your choice. • then press Volume. Adjust the ringer volume using 􀀘 or 􀀙. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. ACTIVATING OR DEACTIVATING THE BEEPS • Go to RING TONE / BEEPS. • Press Valid.. • To change the beep status, press Edit. The status is changed on the screen. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. LU Sixty.book Page 23 Mercredi, 19. mai 2010 12:30 12 24 ACTIVATING/DEACTIVATING THE SILENT MODE When in silent mode, the telephone ringer and keypad beeps are inhibited. • Go to RING TONE / SILENT MODE. • SILENCE MODE? is displayed on the screen. • Press Yes to activate the silent mode. SETTINGS MODIFYING THE DATE AND TIME • Go to SETTINGS / DATE/TIME. • Enter the date in DD/MM/YY format. • Press Valid.. • Enter the time in HH/ MM format. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. ADJUSTING THE CONTRAST • Go to SETTINGS / CONTRAST. • A list with five levels of contrast is displayed. • Select the level you want using the keys 􀀘 or 􀀙. The contrast is directly visible on the screen. • when you have obtained a satisfactory level. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. MODIFYING THE LANGUAGE • Go to SETTINGS / LANGUAGE. • An information screen presents the current language used. - To keep the setting, press Valid.. - To change the setting, press 􀀘 or 􀀙. • Select the language. When you activate the silent mode, your handset is muted for all timer and alarm type functions. LU Sixty.book Page 24 Mercredi, 19. mai 2010 12:30 12 25 • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. THE VOICE BOX NUMBER (ACCORDING TO OPERATOR) This function allows you to receive calls in your absence on your operator's voice messaging service. To indicate that a new message has been received the reception indicator on the the top of the '1' key is lit in red and the new event message is displayed on the screen. To change the voice box number, proceed as follows: • Go to SETTINGS / VOICE BOX No. • The programmed number is displayed on the screen. - The number is correct, press Valid.. - To modify the number, press Edit. DEFINING FORBIDDEN PREFIXES - CALL BARRING You can prohibit the use of certain prefixes on your telephone. When a prefix is forbidden, it becomes impossible to call numbers that begin by this prefix. • Go to SETTINGS/ RESTRICTION. • Press Edit, • Select PREFIX using 􀀘 or 􀀙, press Valid.. • Enter the base code (by default 0000), press Valid.. • Select a location (dashes), press Valid.. • Enter the prefix using the keypad (for example : 06, 08, etc..). • Press Valid.. • OK is displayed on the screen. • Select ACTIVATE using 􀀘 or 􀀙. • Enter the base code (by default 0000), press Valid.. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. The answering machine message language depends on the phone language. To check your voice messaging service, hold down key . LU Sixty.book Page 25 Mercredi, 19. mai 2010 12:30 12 26 DEMO This menu allows you to see an animation for each of your phone's key and ring tones. • Go to SETTINGS / DEMO. • Press Valid.. • Display of "DEMO Chenillard" with the animation of each key. • Press the key during this animation, "DEMO MELODY" is displayed, and the melody for external calls is initiated. • Press Exit to stop the demonstration. ADVANCED SETTINGS Base settings Set the base to registration mode Using this function you can add GAP compatible hnadsets to your base. The handset that you want to pair with your base must itself be in pair mode. Consult the user booklet of your handset to find out what to do. • Go to SETTINGS / ADVANCED SET. / SET BASE / REGISTR. MODE. • Press Valid.. • REGISTR. MODE? is displayed on the screen, press Yes. • Indicator on the the top of the '1' key starts to flash rapidly. Your base will remain in registration mode for about 1 minute. Resetting the base When you reset your base, all the base parameters are reset to their initial values (factory settings). • Go to SETTINGS / ADVANCED SET. / SET BASE / RESET BASE. • Press Valid.. • REINIT. BASE? is displayed on the screen. • Press Yes. • Enter the base code. • Press Valid.. The "RE-INIT. IN PROCESS" and the OK messages are displayed successively. Your base is now reset. You can save up to 5 GAP-compatible handsets on your SIXTY base. You can also set the base to pairing mode by holding down your base's key. LU Sixty.book Page 26 Mercredi, 19. mai 2010 12:30 12 27 De-registering a handset • Go to SETTINGS / ADVANCED SET. / SET BASE / DELETE HANDSET. • Press Valid.. • Select the handset you wish to unregister using 􀀘 or 􀀙. • Press Valid.. • A screen prompts you to confirm the unregistration. Press Yes to unregister the handset. The handset is no more registered to the base. Line settings Modifying the network type Your telephone can be installed on a public or private network (when using a PABX). This function enables you to configure your telephone according to the type of network. • Go to SETTINGS / ADVANCED SET. / SET LINE / NETWORK TYPE. • Press Valid.. • A screen presents the current status. - To keep the status, press Valid.. - To change the status, press Edit. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. Modifying the dialling mode The type of dialling generally used is voice frequency. It is possible that the exchange to which you are connected uses pulse dialling. • Go to SETTINGS / ADVANCED SET. / SET LINE / DIAL. • Press Valid.. • A screen displays the current status. - To keep the status, press Valid.. - To modify the status, press Edit. The status is modified on the screen. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. Before changing the settings of the telephone line, contact your operator to obtain the parameters for your line. The default dialling mode is tone. LU Sixty.book Page 27 Mercredi, 19. mai 2010 12:30 12 28 Modifying the flash duration If you connect your telephone to a private automatic branch exchange or use it in a foreign country, you may need to modify the flash duration in order to use your telephone correctly with regard to the following functionalities: outgoing 2nd call, incoming 2nd call, 3 way calling. Contact your service provider to obtain the correct flash duration and then modify it by doing the following. • Go to SETTINGS / ADVANCED SET. / SET LINE / FLASHING. • Press Valid.. • An information screen presents the current flash duration. - To keep the duration, press Valid.. - To modify the duration, press Edit. • Select the new duration. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. Setting a PABX prefix If a private automatic branch exchange is used, you can programme the external call prefix. With this function you can set the: - PABX prefix number, - dialled number length at which point the PABX prefix will be automatically inserted (this length is called “digit before prefix”), - prefix status (on or off). • Go to SETTINGS / ADVANCED SET. / SET LINE / PABX PREFIX. • Press Valid.. • Press to modify this setting. • Select the desired option: - ACTIVATE / DEACTIVATE : to select a status. - PREFIX : to enter the number giving you access to the outside line. - EDIT LENGTH : to specify the «digits before prefix». • To modify the prefix, select PREFIX press Valid.. • Enter the prefix using the keypad, press Valid.. OK is displayed on the screen. • To modify the digits before prefix, select EDIT LENGTH, press Valid.. • Enter the digits before prefix using the keypad. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. • Now you can activate the automatic PABX prefix functionality, select ACTIVATE and press Valid.. LU Sixty.book Page 28 Mercredi, 19. mai 2010 12:30 12 29 Modifying the base code This code securises and limits the use of your telephone. • Go to SETTINGS / ADVANCED SET. / CHANGE CODE. • Press Valid.. • Enter the old base code using the keypad (default is 0000). • Press Valid.. • Enter the new base code using the keypad. • Press Valid.. • Confirm by entering the new base code again. • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. ANSWERING MACHINE Your phone's answering machine provides the following features: • Active answering machine mode with pre-recorded messages, • Call filtering, • Remote querying. ENABLING / DISABLING THE ANSWERING MACHINE • Go to ANS. MACH / ON/OFF. • Press Valid.. • A screen displays the current status of the answering machine (On or Off). - To keep the displayed status, press Valid.. - To change the status, press 􀀘 or 􀀙: To activate the answering machine, select ACTIVATE. To turn off the answering machine, select OFF. Press Valid.. • OK is displayed on the screen. • Press Return to go back to the previous menu. If you have not recorded a personal message, the answering machine will automatically use one of the pre-recorded messages in the selected language. LU Sixty.book Page 29 Mercredi, 19. mai 2010 12:30 12 30 MODIFYING THE OGM Recording a personal outgoing message • Go to ANS. MACH / OUTGOING MESS. / CHANGE. • Press Valid.. • RECORD OGM is displayed on the screen. • Press Begin to start recording your OGM. Start talking in the base microphone. • To stop recording press End. Your outgoing message is automatically played back. • Press Return to go back to the previous menu or make a new recording. Deleting your personal OGM • Go to ANS. MACH / OUTGOING MESS. / DELETE. • Press Valid.. • DELETE ANOUNCE? is displayed on the screen, press Yes to confirm the deletion of your personal outgoing message. • OGM DELETED is displayed on the screen. • Press Return to go back to the previous menu. Listen to a personal message • Go to ANS. MACH / OUTGOING MESS. / PLAY. • Press Valid.. • PLAY OGM is displayed on the screen and the OGM is played back. At the end of the playback you will return to the menu RECORD OGM. • Press Return to go back to the previous menu. PLAYING MESSAGES If you have new messages (unread), these messages are read first. Afterwards, the messages that have already been taken are played back in chronological order (from the oldest messages to the most recent messages). • Go to ANS. MACH / MESSAGES / PLAY. • Press Valid.. • The messages are played through the loudspeaker. In order to modify an OGM, you must first turn on the answering machine. If you delete your personal outgoing message, the answering machine will automatically use the anonymous message. If you have not recorded a personal message, you will hear the anonymous, pre-recorded message. LU Sixty.book Page 30 Mercredi, 19. mai 2010 12:30 12 31 • Depending on your service provider and your subscription, the name and number of your contact will be displayed on the screen (except for a confidential call). • During playback, you can use the touch-sensitive keys to perform the following actions: - * : go back to the beginning of the message. - * x 2: return to the previous message. - # : go to the next message. - Pause/PLAY (context key 1): pause/resume playback. - DELETE (context key 2): delete the message being played. - : exit playback of messages. REMOTE ACCESS TO ANSWERING MACHINE Your answering machine can be queried remotely. This feature allows you to read your messages and query your answering from any phone when you are not at home. To remotely access your answering machine: • Dial your telephone number. • Wait for the answering machine to come on. • When your outgoing message is played, press «#». • Enter your remote access code. • A beep will indicate access to the answer machine, Any unread messages will be automatically played back. • At the end of playback, a new beep will sound to let you know that the answer machine is ready. • You can carry out the following operations : - 0 : delete the message being played. - 1 : go back to the beginning of the message. - 1 (x2): previous message. - 2 : pause / play. - 3 : next message. - 5 : messages read. - 9 : enable/disable the answering machine. DELETING ALL THE OLD MESSAGES • Go to ANS. MACH / MESSAGES / DELETE OLD. • Press Valid.. • To confirm the deletion of all the old messages, press Yes. • Press Return to go back to the previous menu. The remote access code is 0000 by default. However, it can only be used once it is customised, refer to paragraph "Modifying the remote access code ", page 32. To delete old messages one by one, refer to the previous paragraph and delete unwanted messages during playback. LU Sixty.book Page 31 Mercredi, 19. mai 2010 12:30 12 32 TAM SETTINGS This menu allows you to change the advanced settings of your answering machine. You can access the answering machine SETTINGS menu from the ANS. MACH menu. ACTIVATING AND DEACTIVATING CALL SCREENING The filtering function, when activated, allows you to listen to the message left by the caller as it is being recorded. You can unhook to answer at any time. • Go to ANS. MACH/SETTINGS/CALL SCREENING. • Press Valid.. • A screen indicating the function status appears. - To keep the current status, press Valid.. - To change the status, press 􀀘 or 􀀙. • Press Valid.. MODIFYING THE REMOTE ACCESS CODE The remote access code enables you to listen to the messages left on your answering machine via another telephone. • Go to ANS. MACH / SETTINGS / REMOTE CODE. • Press Valid.. • CODE BASE is displayed, enter your Base code (default setting is 0000). • Press Valid.. • CODE DISTANCE is displayed, enter the new remote access code (4 digits mandatory). • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. NUMBER OF RINGS This parameter determines the number of times your phone rings before your answering machine is started. The number of rings is between 3 and 7. • Go to ANS. MACH / SETTINGS / NO OF RINGS. • Press Valid.. • The programmed number of rings is displayed on the screen. Press keys 􀀘 or 􀀙 to change this number (from 3 to 7). • Press Valid.. OK is displayed on the screen. • Press Return to go back to the previous menu. LU Sixty.book Page 32 Mercredi, 19. mai 2010 12:30 12 33 REPLACING THE BATTERIES Your batteries' autonomy is no more satisfactory ? Please contact your retailer, he will propose to you new equivalent batteries. • Remove the battery compartment hatch. • Remove the old batteries, insert the new batteries one by one in compliance with the polarity of the batteries, as indicated in paragraph “Your handset”, page 9 • Refit the battery compartment hatch. • Leave your handset on its base in order to fully charge the batteries. PAIRING GAP-COMPATIBLE DECT HANDSETS ON THE SIXTY BASE Additional GAP-compatible DECT handsets can be registered on the SIXTY base. To register an additional handset on the SIXTY base: • Set your base to pairing mode by holding down the key. The light indicator on the top of the '1' key starts flashing. The base remains in pairing mode for one minute. • Set the additional handset to registration mode. (Refer to the your handset's user manual). Up to five GAP-compatible DECT handsets can be registered on the SIXTY base. LU Sixty.book Page 33 Mercredi, 19. mai 2010 12:30 12 34 APPENDIX CARE AND MAINTENANCE Turn off your phone. Use a soft damp cloth to wipe it. Do not use a dry cloth, strong liquid detergents, thinners, alcohol or any other type of solvent to clean your phone. These products may damage your phone. PROBLEMS Refer to the table presented below in case of an operational malfunction: Problems Possible causes Remedies You are having trouble reading or cannot read the display when not in standby mode. Contrast too low. Increase the contrast level (refer to paragraph "Adjusting the contrast ", page 24). No display on the base screen. Power connection unplugged. Check the power connection to the phone. No tone. The phone jack is not connected or is incorrectly connected. Check the phone cable connection (refer to paragraph "Connecting the base ", page 12). Make sure you have a dialling tone. The speaker volume is too low. Increase the speaker volume (refer to paragraph "Receiving a call ", page 15). The phone does not ring when a call is received. The mute mode is turned on. Turn off the mute mode (refer to paragraph "Activating/ deactivating the silent mode ", page 24). Your party cannot hear you. You have turned on the mute mode (microphone off). Turn off the mute mode (microphone off) in MENU then MUTE. Make sure that the "MUTE MODE" message is not displayed. You obtain a "busy" dial tone for each dialled number. Incorrect flashing time. Set the flashing time (refer to paragraph "Modifying the flash duration ", page 28). Contact your operator to get it to provide you with the right time. LU Sixty.book Page 34 Mercredi, 19. mai 2010 12:30 12 35 TECHNICAL CHARACTERISTICS INITIAL CONDITION Standard Radio frequency band Number of channels Duplex mode Spacing between channels Bit rate Modulation Vocoding Transmitting power ::::::::: DECT, GAP 1.88-1.90 GHz 120 TDMA 1.728MHz 1152 kbit/s GFSK ADPCM 250 mW Charging time Range up to Batteries Handset operating time Max answering machine capacity Ambient temperature Dimensions Weight including batteries :::::::: Handset Batteries: 10 hours 300 m outside and up to, up to 50 m inside buildings Type Ni-MH, AAA, 2 x 1.2 V 450 mAh talk time up to 10 hours standby time up to 120 hours 20 minutes +5°C to +45°C Base(WxHxL) 220 x 63 x 39 mm Handset(WxHxL) 176 x 130 x 89 mm Base 172g Handset 43 g Accessories Advanced Settings Alarm clock off Network type Public Timer off Dial mode Tone Ring Tone Flashing 100 ms Ringer Traditional PABX prefix Off Keyboard beeps On Answering Machine Silent mode Off Status On Settings Call screening Off Date/Time 01/01/10 // 00:00 Remote access code 0000 Contrast Level 2 Number of rings 7 Language English Restriction off Base code 0000 LU Sixty.book Page 35 Mercredi, 19. mai 2010 12:30 12 36 ENVIRONMENT Environmental protection and sustainable development is an important priority for SAGEMCOM. SAGEMCOM has a policy of using environmentally- friendly systems and makes environmental protection an essential part of the life-cycle of its products – from the manufacturing, to the installation, operation and disposal. PACKAGING The logo (green point) on the packaging means that a fee is paid to an authorised national organisation to improve packaging recycling and the recycling infrastructure. Follow the local sorting regulations for this type of waste product in order to improve recycling. BATTERIES AND RECHARGEABLE BATTERIES If your product contains batteries or rechargeable batteries, these must be disposed of at designated collecting centers. THE PRODUCT The crossed out dustbin displayed on the product signifies that it belongs to the electrical and electronic equipment group. The European regulations request you to carry out your own selective recycling collection at: • the sales outlet when you buy a similar new device. • the collection points available in your area (recycling centres, sorting points, etc). This means you participate in the recycling and valorisation of used electric and electronic goods which would otherwise have a negative impact on the environment and health. Annexe.fm Page 36 Jeudi, 20. mai 2010 9:03 09 37 GUARANTEE TERMS AND CONDITIONS FOR UNITED KINGDOM & IRELAND ONLY In order to apply the guarantee, you should contact the SAGEMCOM Helpdesk or the retailer where you purchased the equipment. Proof of purchase will be required in either case. Please make sure that you use your equipment only for the purpose for which it was designed and under normal usage conditions. SAGEMCOM do not accept any liability for the equipment if used outside the frame of its original designed purpose or any consequence that may arise from this usage. Should any malfunction arise, the SAGEMCOM Helpdesk or your retailer will advise you how to proceed. A) General Guarantee conditions SAGEMCOM undertakes to remedy by repair or exchange at its own convenience, free of charge for labour and replacement parts, any defects in the equipment during the guarantee period of 12 (twelve) months or 3 (three) months for accessories, from the date of original invoice of the Equipment, where those defects are a result of faulty workmanship. Unless the customer has concluded with SAGEMCOM a maintenance contract in respect of the equipment which specifically provides for repairs to be carried out at the customer`s premises, the repairs will not be carried out on the equipment at the customer premises. The customer must however return the defective equipment at his/her own expense, to the address supplied by the SAGEMCOM Helpdesk or by the retailer. In the case that a product needs to be sent in for a repair, it must always be accompanied by a proof of purchase (which is not altered, written on or in any way made illegible) showing that the product is still under guarantee. In the case that no proof of purchase is enclosed, the SAGEMCOM repair centre will use the production date as its reference for establishing the guarantee status of the product. Apart from all legal obligatory rules, SAGEMCOM, do not give any Guarantee, either implicit or explicit which is not set force in the present section, and can not be held responsible for any direct or indirect, material or immaterial damage, either in or out of the frame of the present guarantee. If any provision of this guarantee shall be held to be in whole or in part invalid or illegal due to an obligatory rule applicable to consumers pursuant to their national legislation, such invalidity or illegality shall not impair or affect the remaining provisions or parts of this guarantee. This guarantee does not affect the Customer statutory rights. LU Sixty.book Page 37 Mercredi, 19. mai 2010 12:30 12 38 B) Exclusions From Guarantee SAGEMCOM shall have no liability under the guarantee in respect of: • Damage, defects, breakdown or malfunction due to one or more of the following: - Failure to properly follow the installation process and instructions for use - An external cause to the equipment (including but not limited to: lightening, fire, shock, vandalism, inappropriate conditions of electrical network or water damage of any nature) - Modifications made without the written approval of SAGEMCOM - Unsuitable operating conditions, particularly of temperature and humidity - Repair or maintenance of the equipment by persons not authorised by SAGEMCOM • Wear and tear from normal daily use of the equipment and its accessories • Damage due to insufficient or bad packaging of equipment when returned to SAGEMCOM • Usage of new versions of software without the previous approval of SAGEMCOM • Work on any equipment or software modified or added without the prior written consent of SAGEMCOM • Malfunctions not resulting from the Equipment or from software installed in user workstations for the purpose of use of the equipment. Communication problems related to an unsuitable environment including: - Problems related to access and/or connection to the Internet such as interruptions by access networks or malfunction of the line used by the subscriber or his correspondent - Transmission faults (for example poor geographical coverage by radio and TV transmitters, interference or poor line quality) - Local network faults (wiring, servers, workstations) or the failure of the transmission network (such as but not limited to interferences, fault or poor quality of the network) - Modification of the parameters of the cellular or broadcast network carried out after the sale of the Product • Normal servicing (as defined in the user guide supplied with the equipment) as well as malfunctioning due to servicing not being carried out. Servicing costs are in any event always borne by the customer. • Malfunctions resulting from the usage of products, consumables or accessories not compatible with the equipment. C) Out of Guarantee Repairs In the cases set forth in B) as well as after expiry of the guarantee period, the customer must ask the Authorised SAGEMCOM Repair Centre for a cost estimation prior to work being carried out. In such cases, the repair and delivery costs will be invoiced to the customer. The foregoing shall apply unless otherwise agreed in writing with the customer and only for the United Kingdom and Ireland. LU Sixty.book Page 38 Mercredi, 19. mai 2010 12:30 12 39 TERMS AND CONDITIONS FOR OTHER COUNTRIES If, despite our best efforts, your product presents any defects, you should refer to your retailer and present the proof of purchase that they gave you on the day of purchase. Should any malfunctioning arise, the retailer will advise you what to do. For the warranty to apply, you should ensure that the product was used in accordance with the instructions for use and the purpose for use, and that you have at your disposal the sales invoice or receipt stating the date of purchase, the name of the retailer, the reference and the serial number of the product. No coverage shall be given under this warranty if the following conditions are applicable: • The required documents have been modified or altered in order to take advantage of the warranty. • The manufacturing numbers, product brands or labels have been altered or made illegible. • Interventions on the product have been made by an unauthorized person. • The product has been subjected to abnormal or improper use. • The product has been damaged by external factors such as lightning, over-voltage, moisture, accidental damage, improper care as well as all Acts of God. This present warranty does not affect the consumer rights that you may have under the laws in effect in your country. Important: Should you return the product to the after-sales department, please ensure that you return as well all the elements and accessories originally supplied with the product. LU Sixty.book Page 39 Mercredi, 19. mai 2010 12:30 12 SIXTY by Sagemcom Broadband SAS 250, route de l'Empereur - 92848 Rueil-Malmaison - France Tél. +33(0)1 57 61 10 00 - Fax : +33(0)1 57 61 10 01 www.sagemcom.com All rights reserved. Sagemcom Broadband SAS reserves the right to change the technical characteristics of its products and services or to stop marketing them at any time. The information and specifications included are subject to change without prior notice. Sagemcom Broadband SAS tries to ensure that all information in this document is correct, but does not accept liability for error or omission. Non contractual document. All trademarks are registered by their respective owners. Simplified joint stock company - Capital 35 703 000 € - 518 250 360 RCS Nanterre Thermomètre infrarouge 572-2 L'outil qu'il vous faut pour les environnements les plus chauds 2 Fluke Corporation Thermomètre infrarouge 572-2 Caractéristiques techniques du thermomètre infrarouge 572-2 Mesures infrarouges Gamme de température infrarouge -30 °C à 900 °C Précision IR (Géométrie d'étalonnage à une température ambiante de 23 °C ± 2 °C) ≥0 °C ± 1 °C ou ± 1 % du relevé, selon la valeur la plus élevée ≥-10 °C à <0 °C ± 2 °C <-10 °C ± 3 °C Répétabilité IR ± 0,5 % de la mesure ou ± 0,5 °C, selon la valeur la plus élevée Résolution d'affichage 0,1 °C / 0,1 °F Distance : Mesure 60:1 (calculée à 90 % de l'énergie) Dimensions minimales du point 19 mm Système de visée laser Décalage du laser double, puissance de sortie <1 mW Réponse spectrale 8 μm à 14 μm Temps de réponse (95 %) <500 ms Emissivité Réglable numériquement de 0,10 à 1,00 par pas de 0,01 ou à partir du tableau intégré des matériaux courants Options de mesure Alarmes Basse et/ou Haute Sonores ou visuelles en couleur Min/Max/Moy/Dif Oui Commutable entre degrés Celsius et Fahrenheit Oui Rétro-éclairage Deux niveaux, normal et ultra-lumineux pour les environnements sombres Entrée sonde Thermocouple de type K Affichage simultanée de la température IR et de la sonde sur le thermocouple de type-K Verrouillage du déclenchement Oui Stockage de données 99 points Ecran Matriciel de 98 x 96 pixels avec menus de fonctions Communication USB 2.0 Caractéristiques techniques du thermocouple de type K Gamme de températures en entrée du thermocouple de type K -270 °C à 1 372 °C Précision d'entrée du thermocouple de type-K (avec température ambiante de 23 °C ± 2 °C) <-40 °C ± (1 °C + 0,2 °/1 °C) ≥-40 °C ± 1 % ou 1 °C, selon le plus élevé des deux Résolution du thermocouple de type K 0,1 °C Répétabilité de thermocouple type K ± 0,5 % de la mesure ou ± 0,5 °C, selon la valeur la plus élevée Gamme de mesure (sonde à perles du thermocouple de type K) -40 °C à 260 °C Précision ± 1,1 °C de 0 °C à 260 °C. Typiquement à moins de 1,1 °C de -40 °C à 0 °C Longueur du câble Câble de thermocouple de type K de 1 m avec connecteur de thermocouple miniature standard et terminaison par perle Caractéristiques générales Température de fonctionnement 0 °C à 50 °C Température de stockage -20 °C à 60 °C Humidité relative 10 % à 90 % HR sans condensation jusqu'à 30 °C Altitude de fonctionnement 2 000 mètres au-dessus du niveau moyen de la mer Poids 0,322 kg Puissance 2 piles AA Autonomie 8 heures avec laser et rétro-éclairage allumés ; 100 heures avec laser et rétro-éclairage éteints, rapport cyclique de 100 % (thermomètre actif en continu) Sécurité et conformité IEC 60825-1 Laser FDA Classe II EMC 61326-1 Conformité CE CMC 沪制01120009 3 Fluke Corporation Thermomètre infrarouge 572-2 Pour commander Thermomètre infrarouge 572-2 Comprend Thermomètre infrarouge avec fonctions de thermomètre de contact, sonde à perle pour thermocouple de type K, cordon d’interface USB 2.0, logiciel de documentation FlukeView® Forms, mallette de transport rigide, manuel d'introduction (papier) et manuel de l'utilisateur (CD). Sondes de température recommandées Sonde Utilisation 80PK-1 Cette sonde à perle polyvalente permet de mesurer rapidement et avec précision les températures de surface et les températures de l'air dans les gaines et les bouches d'aération. 80PK-8 Les sondes de température à collier de serrage (2) sont essentielles pour le suivi des différentiels de température en constante évolution sur les boucles de tuyauterie et les tubulures d'eau chaude, et excellentes pour obtenir des températures de réfrigération rapides et précises. 80PK-9 La sonde de perforation d'isolant dispose d'un embout pointu pour perforer l'isolation des tuyaux, et d'un embout à bout plat pour obtenir des mesures de contact thermique en surface, des températures dans les gaines et les bouches d'aération. 80PK-11 La sonde pour thermocouple à gaine souple permet de fixer facilement un thermocouple au tuyau pour une utilisation en mains libres. 80PK-25 La sonde perforante est l’option la plus polyvalente. Excellente pour vérifier la température de l'air des conduits, la température de surface sous les moquettes/rembourrages, des liquides, des puits de thermomètre, des températures d'évacuation et pour pénétrer l'isolation des tuyaux. 80PK-26 La sonde conique est une excellente sonde polyvalente de mesure de surface et de gaz, disposant d'une bonne longueur et d'un revêtement d'embout à faible masse pour une réaction accélérée aux températures de l'air et des surfaces. Fluke Deutschland GmbH Parc des Nations - Allee du Ponant Bat T3 95956 ROISSY CDG CEDEX Téléphone: (01) 48 17 37 37 Télécopie: (01) 48 17 37 30 E-mail: info@fr.fluke.nl Web: www.fluke.fr N.V. Fluke Belgium S.A. Langveld Park – Unit 5 P. Basteleusstraat 2-4-6 1600 St. Pieters-Leeuw Tel: 02/40 22 100 Fax: 02/40 22 101 E-mail: info@fluke.be Web: www.fluke.be Fluke (Switzerland) GmbH Industrial Division Hardstrasse 20 CH-8303 Bassersdorf Tel: 044 580 75 00 Fax: 044 580 75 01 E-mail: info@ch.fluke.nl Web: www.fluke.ch ©2013 Fluke Corporation. Tous droits réservés. Informations modifiables sans préavis. 6/2013 Pub_ID: 12090-fre La modiflcation de ce document est interdite sans l’autorisation écrite de Fluke Corporation. User’s Guide October 2012 LMP91051EVM User’s Guide October 2012 LMP91051EVM User’s Guide CONTENTS 1 INTRODUCTION ................................................................................................... 1 2 SETUP .................................................................................................................. 2 3 OPERATION ......................................................................................................... 5 4 INSTALLING THE SENSOR AFE SOFTWARE ................................................... 10 5 BOARD LAYOUT ................................................................................................ 11 6 SCHEMATIC ....................................................................................................... 12 7 BOM .................................................................................................................... 13 LIST OF FIGURES 1 Connection Diagram ............................................................................................... 2 2 Jumper Setting (Default) for voltage reading ........................................................... 3 3 LMP91051EVM to SPIO-4 Board Connection ......................................................... 4 4 Sensor AFE Items of Interest .................................................................................. 5 5 Recommended LMP91051 Configuration for a voltage Reading ............................. 7 6 Sensor Database Window ..................................................................................... 8 7 Reults of DC Reading ............................................................................................. 9 8 LMP91051EVM’s J3 for SPI Signals ..................................................................... 10 9 LMP91051EVM Layout ......................................................................................... 11 8 LMP91051EVM Schematic ................................................................................... 12 LIST OF TABLES 1 Jumpers for Voltage Measurement ......................................................................... 3 2 LMP91051EVM Bill of Materials............................................................................ 13 1. Introduction The LMP91051 Design Kit (consisting of the LMP91051 Evaluation Module, the SPIO-4 Digital Controller Board, the Sensor AFE software, and this user’s guide) is designed to ease evaluation and design-in of Texas Instrument’s LMP91051 Configurable AFE for Nondispersive Infrared (NDIR). Data capturing and evaluations are simplified by connecting the SPIO-4 Digital Controller Board (SPIO-4 board) to a PC via USB and running the Sensor AFE software. The data capture board will generate the SPI signals to communicate to and capture data from the LMP91051. The user will also have the option to evaluate the LMP91051 without using the SPIO-4 board or the Sensor AFE software. The on board data converter will digitize the LMP91051’s analog output, and the software will display these results in time domain and histogram. The software also allows customers to write to and read from registers, to configure the device’s gain, output offset, and common mode voltage, and most importantly, to configure and learn about the LMP91051. 2 LMP91051EVM User’s Guide snou034 This document describes the connection between the boards and PC, and provides a quick start for voltage measurements. This document also describes how to evaluate the LMP91051 with and without the SPIO-4 board and provides the schematic, board layout, and BOM. 2. Setup This section describes the jumpers and connectors on the EVM as well and how to properly connect, set up and use the LMP91051EVM. 2.1. Connection Diagram Figure 1 shows the connection between the LMP91051 Evaluation Module (LMP91051EVM), SPIO-4 board, and a personal computer with the Sensor AFE software. LMP91051 can be powered using external power supplies or from the SPIO-4 board. Figure 1: Connection Diagram 2.2. Jumper Connections 1. The jumpers for this example application can be seen in Figure 2 and Table 1. 2. The SPIO-4 board is properly setup out of the box (no assembly required). 3. The schematic for the LMP91051EVM can be seen in Figure 10. 3 LMP91051EVM User’s Guide October 2012 Figure 2: Jumper Setting (Default) for voltage reading Table 1: Jumpers for Voltage Measurement Jumpers Pin Purpose JP1: VDD_DUT P1-P2 Connect LMP91051 VDD to +3.3V from SPIO4 JP2: VREF_ADC P1-P2 Connect ADC VREF to 4.1V from U5 (LM4140) JP3: VA_ADC P1-P2 Connect ADC VA to +5V from SPIO4 JP4: OUT_DUT to ADC P1-P2 Connect LMP91051 OUT to ADC input RC filter JP5: VDD to VIO Open Connect LMP91051 VDD to VIO JP6: VIO P2-P3 Connect LMP91051 VIO to +3.3V from SPIO4 J1: IN1 to CMOUT Open Connect LMP91051 IN1 to CMOUT. Note: Board is provided with this jumper open. Use provided jumper to short IN to CMOUT for easy evaluation. J2: IN2 to CMOUT Open Connect LMP91051 IN2 to CMOUT. Note: Board is provided with this jumper open. Use provided jumper to short IN to CMOUT for easy evaluation. 4 LMP91051EVM User’s Guide snou034 2.3. Installing/Opening the Software Follow Section 4 to install and open the Sensor AFE software. 2.4. Connecting and Powering the Boards These Steps have to be done in this order. 1. Connect the LMP91051EVM’s J3 to SPIO-4 Board’s J6. See Figure 3. . Figure 3: LMP91051EVM to SPIO-4 Board Connection 2. Connect SPIO-4 board to a PC via USB. 3. Use a multimeter to measure LMP91051EVM’s +5V test point; it should be approximately 5V. If it is not, check your power supplies and jumpers. Measure test point VREF_ADC; it should be approximately 4.1V. If it’s not, check your jumpers and U5. J3 5 LMP91051EVM User’s Guide October 2012 3. Operation 3.1. Sensor AFE Software Overview Once connection between the boards and PC is established, you can use the software to communicate to and capture data from the LMP91051. Drag cursor over window icons to get an icon description. Some items of interest are shown in Figure 4. Figure 4: Sensor AFE Items of Interest . 1. Menu Bar Icons (from left to right) a. Save Configuration to File: Saves the current configuration settings (register settings) to an .xml file. b. Load Configuration File: Loads the selected configuration settings (register settings) .xml file. c. Register Map: Opens Register Map window. An alternative to the Virtual Device, for writing and reading the device registers. See datasheet for details on device Register Map. d. Save All Registers to File: Saves register contents to a .cvs file. e. Read All Register from Board: After configuring the register map, use this button to read all registers. Functional only in SDIO Mode (see Item 3). f. Write All Registers To Board: After configuring the register map use this button to write all registers. Registers will not be updated until this step is done. g. Zoom In/Out Diagram Image: Zoom in and out of the virtual device image. h. Show Tutorial: Takes you to the interactive Software Overview videos. 1 2 3 4 5 6 LMP91051EVM User’s Guide snou034 i. Documentation: Accesses the LMP91051 Datasheet, SPIO4 User’s Guide, or Evaluation Board User’s Guide. 2. Device Selection and User Inputs a. LMP91050/1 : Toggle between LMP91050 and LMP91051 device. b. fc: Center frequency of external bandpass filter. c. bandwidth: Pass band bandwidth of external bandpass filter. d. R1_EXT, R2_EXT, C1_EXT, C2_EXT: External bandpass filter component values calculated based on user input for center frequency (fc) and pass band (bandwidth) described above. e. Supply: LMP91051 supply voltage (VDD). f. IC Temp: LMP91051 operating temperature g. Offset Adjust Voltage: The tool will calculate the DAC code (decimal) required to achieve this output offset adjust voltage. User must then Write to the register to update the value in the NDAC register. h. ADC Vref: ADC reference voltage. User should input value measured at VREF_ADC test point. Value used to calculate displayed Output Voltage. i. Vout Dark: This value corresponds to the user measured value at the LMP91051 output (OUT) when input is shorted (IN = CMOUT). Tool will use this value to estimate LMP91051 input voltage (IN - CMOUT) on subsequent measurements. 3. Change Mode: Change between device Read Mode OFF (default) and ON. See datasheet for details on SPI Read Mode. 4. Eval Board Setting: Document to show user how to configure jumpers and connect thermopile based on sensor selected. 5. Virtual Device: Drag cursor across color coded blocks and click to configure each block. To update registers “Write All Registers” when done. 3.2. Configuring the LMP91051 Using the Sensor AFE Software Follow the step-by-step instructions under the “HelpBar” mini-tab (left hand side of the GUI) to configure the LMP91051 for this example. These step-by-step instructions are discussed in details below, and the recommended configuration should look similar to Figure 5. 7 LMP91051EVM User’s Guide October 2012 Figure 5: Recommended LMP91051 Configuration for a voltage Reading 1. Step 1: Select a Sensor – Sensor Database window opens. See Figure 6. Step 1: Click sensor type (Thermopile) and the sensors will show in the bottom table. Step 2: Click sensor and then click “Select” button on the left to use this sensor. 8 LMP91051EVM User’s Guide snou034 Figure 6: Sensor Database Window 2. Step 2: Input Mux – click on the mux block to set “1: IN1” (default). 3. Step 3: PGA1 Enable – click on the “PGA1” block to set “1: PGA1 ON” . Remember after configuring the register map to use the Write All Registers button to update the registers. 4. Step 4: PGA2 Enable – click on the “PGA2” block to set “1: PGA2 ON” . Note: By default PGA1 and PGA2 are OFF on power up. However the software was designed to automatically power ON PGA1 and PGA2 for ease of use. 5. Step 5: External Filter – click on the switch block to choose “0: PGA1 to PGA2 direct” (default). 6. Step 6: Common Mode – click on the “CM GEN” block to set “0: 1.15V” (default). 7. Step 7: GAIN 2 – click on the “PGA2” block to set “00: 4” (default). 8. Step 8: GAIN 1 – click on the “PGA1” block to set “0: 250” (default). 9. Step 8: DAC (Output Offset) – click on the “DAC” block to set “128” (default) for 0 mV offset. Alternatively, user can also use the Offset Adjust Voltage user input field to input 0 mV. 10. Step 10: Performance - click on the “Performance” mini-tab. This tab displays the Estimated Device Performance based on device configuration and user input device Supply and IC Temp .This tab also displays the Measured System Performance if you’ve connected a board and ran the LMP91051. Step 1 Step 2 9 LMP91051EVM User’s Guide October 2012 3.3. Capturing Data 1. Click on the “Measurement” tab. 2. Under the “Output Format” field, select Display as “Output Voltage (V)” 3. Under the “Stop Condition” field, select Run as “1” Seconds. Alternatively, select “Run Continuously” radio button to run continuously up to 1 hour. 4. Click on the “Run” button to view the output voltage results. A reading should be plotted as seen in Figure . Output voltage will vary depending on input voltage across input (IN1/IN2) and CMOUT. If J1/J2 are shorted, IN1/IN2 = CMOUT, output voltage should be about 1V. Note: Board is provided with jumper J1/J2 open. Use provided jumper to short IN1/IN2 to CMOUT for easy evaluation. Figure 7: Results of DC Reading 3.4. Powering the LMP91051EVM There are two ways in which VDD can be sourced: external supply or SPIO-4 power. If using an external power supply to source VDD, do the following: 1. Connect an external power supply to banana jacks VDD-EXT and GND. 2. Jumper pins 2 and 3 of JP1 to connect the external power to VDD_DUT. If using the SPIO-4 power to source VDD, then do the following: 1. Jumper pins 1 and 2 of JP1 to connect +3.3V SPIO-4 power to VDD_DUT. The schematic for the LMP91051EVM can be seen in Figure 10. 10 LMP91051EVM User’s Guide snou034 3.5. Evaluating the LMP91051 without the SPIO-4 Board The SPIO-4 digital controller board is used to generate the SPI signals to communicate to the LMP91051. Without the SPIO-4 board, the Sensor AFE software for the LMP91051 cannot be used to capture and analyze data from the LMP91051EVM. If the SPIO-4 board is not available but LMP91051 evaluation is desirable, then connect your own SPI signals to J1 of the LMP91051EVM as seen below. Reference the LMP91051 datasheet for appropriate SPI timing diagrams. Source LMP91051 VDD with an external power supply per previous section. Figure 8: LMP91051EVM’s J3 for SPI Signals Refer to the LMP91051 datasheet for more information on the LMP91051’s SPI protocol. 4. Installing the Sensor AFE Software Each Sensor AFE product will have its own software. To access the Sensor AFE software for LMP91051, follow the steps below. 1. Getting the Zip Files a. You can find the latest downloadable Sensor AFE software at ti.com/sensorafe b. Download the zip file onto your local hard drive. Unzip this folder. 2. Installing the Driver - skip this step if you don’t have the LMP91051EVM and SPIO4 digital controller board. a. See the provided Installation Guide For SensorAFE Drivers.pdf. 11 LMP91051EVM User’s Guide October 2012 3. Installing the Software a. See the provided Installation Guide for LMP91050 SensorAFE Software.pdf i. Note: If you run the software without the boards, you’ll get an error message. Ignore that error message and click “Ok” to continue. 5. Board Layout Figure 9: LMP91051EVM Layout 6. Schematic Figure 10: LMP91051EVM Schematic 7. BOM LMP91051EVM Bill of Materials Item Designator Description Manufacturer PartNumber Quantity 1 +3P3V, +5V, A0_DUT, A1_DUT, CMOUT_DUT, CSB_ADC, CSB_DUT, DOUT_ADC, IN1_DUT, IN2_DUT, MISO, MOSI, MOSI_EN, OUT_DUT, REF_ADC, SCLK_ADC, SCLK_DUT, SDIO_DUT, TEMP, VA_ADC, VDD_DUT, VDD_EXT, VIO, VIO_ADC, VIO_EXT, VREF_ADC Test Point, TH, Compact, Red Keystone Electronics 5005 26 2 AA1 Printed Circuit Board TBD by TI 551xxxxxx-001 REV A 1 3 BNC1, BNC2, OUT DNS Amphenol Connex 112404 3 4 C1 CAP, CERM, 10uF, 6.3V, +/- 20%, X5R, 1206 TDK C3216X5R0J106M 1 5 C2 CAP CER 4700PF 250V X7R 10% 0805 TDK C2012X7R2E472K 1 6 C3, C9, C10, C12, C17, C22 CAP, TANT, 10uF, 10V, +/- 20%, 3.4 ohm, 3216-18 SMD Vishay-Sprague 293D106X0010A2TE3 6 7 C4, C7, C13, C15, C18, C19, C23 CAP, CERM, 0.1uF, 16V, +/- 5%, X7R, 0603 AVX 0603YC104JAT2A 7 8 C5, C6, C21 CAP, CERM, 10nF, 50V, +/-5%, C0G/NP0, 0805 MuRata GRM2195C1H103JA01D 3 9 C8, C14 CAP, CERM, 0.1uF, 25V, +/- 10%, X7R, 0805 AVX 08053C104KAT2A 2 10 C11 CAP, CERM, 0.1uF, 100V, +/- 5%, X7R, 1206 AVX 12061C104JAT2A 1 11 C16, C20 CAP, CERM, 1uF, 10V, +/-10%, X7R, 0805 AVX 0805ZC105KAT2A 2 12 FID1, FID2, FID3 Fiducial mark. There is nothing to buy or mount. N/A N/A 3 13 GND1, GND2, GND3, GND4, GND5, GND6, GND7, GND8, GND9, GND10, GND11 Test Point, TH, Compact, Black Keystone Electronics 5006 11 14 H1, H2, H3, H4 Bump Hemisphere B&F Fastener Supply NY PMS 440 0025 PH 4 15 J1, J2, JP3, JP4, JP5 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec Inc. TSW-102-07-G-S 5 16 J3 SPIO-GPSI16 Header, 16-Pin, Dual row, Right Angle Sullins Connector Solutions PBC36DGAN 1 17 JP1, JP2, JP6 Header, TH, 100mil, 1x3, Gold plated, 230 mil above insulator Samtec Inc. TSW-103-07-G-S 3 18 L1, L2 Ferrite, Chip, 200mA, .080 ohm, SMD Wurth Elektronik eiSos BLM21BD272SN1L 2 19 R1, R2 RES, 160k ohm, 5%, 0.125W, 0805 Vishay-Dale CRCW0805160KJNEA 2 20 R3 DNS Vishay-Dale DNS 1 21 R4 RES, 100k ohm, 5%, 0.125W, 0805 Vishay-Dale CRCW0805100KJNEA 1 22 R5, R10 RES, 0 ohm, 5%, 0.125W, 0805 Vishay-Dale CRCW08050000Z0EA 2 23 R6 RES, 100k ohm, 1%, 0.125W, 0805 Vishay-Dale CRCW0805100KFKEA 1 24 R7 RES, 1.00k ohm, 1%, 0.125W, 0805 Vishay-Dale CRCW08051K00FKEA 1 25 R8 RES, 27.4 ohm, 1%, 0.1W, 0603 Vishay-Dale CRCW060327R4FKEA 1 26 R9 RES, 51.1 ohm, 1%, 0.1W, 0603 Vishay-Dale CRCW060351R1FKEA 1 27 R11, R12, R13, R14 DNS Vishay-Dale CRCW06031R00JNEA 4 28 U1 LMP91051 Texas Instruments LMP91051 1 29 U2 16-Bit, 50 to 250 kSPS, Differential Input, MicroPower ADC, 10-pin Mini SOIC, Pb- Free Texas Instruments ADC141S628QIMMX/NOP B 1 30 U3 Non-Inverting 3-State Buffer Texas Instruments SN74AHC1G125DCKR 1 31 U4 DNS Heimann HMS J21 1 32 U5 Precision Micropower Low Dropout Voltage Reference, 8- pin Narrow SOIC Texas Instruments LM4140ACM-4.1 1 33 U6 2K 5.0V I2C Serial EEPROM On Semiconductor CAT24C02WI-GT3 1 34 Y1 Osc 4.000Mhz 5.0V Full Size ECS Inc ECS-100AX-100 1 35 Y1A Oscllator Socket Aires Electronics A462-ND 1 EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. 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All rights reserved. FEN LOGIC LTD. Gertboard User Manual Gert van Loo and Myra VanInwegen Revision 1.0 The Gertboard is an add-on GPIO expansion board for the Raspberry Pi computer. It comes with a large variety of components, including buttons, LEDs, A/D and D/A converters, a motor controller, and an Atmel AVR microcontroller. There is a suite of test/example programs for the Gertboard, written in C, which is freely available at www.element14.com/raspberrypi This manual explains both how to set up the Gertboard for various control experiments and also explains at a high level how the test code works. 3 Contents Gertboard Overview ................................................................................................................................ 4 Labels on the circuit board .................................................................................................................. 5 Location of the building blocks on the Gertboard .............................................................................. 7 Jumpers and straps .............................................................................................................................. 8 GPIO pins ........................................................................................................................................... 8 Schematics .......................................................................................................................................... 9 Test programs overview ...................................................................................................................... 9 Macros........................................................................................................................................... 10 Buffered I/O, LEDs, and pushbuttons ................................................................................................... 11 Push buttons ...................................................................................................................................... 12 Locating the relevant sections of the Gertboard ............................................................................... 12 Testing the pushbuttons .................................................................................................................... 14 Testing the LEDs .............................................................................................................................. 16 Testing I/O ........................................................................................................................................ 18 Open Collector Driver ........................................................................................................................... 19 Testing the open collector drivers ..................................................................................................... 20 Motor Controller ................................................................................................................................... 22 Testing the motor controller .............................................................................................................. 23 Digital to Analogue and Analogue to Digital Converters ..................................................................... 25 Digital to analogue converter ............................................................................................................ 25 Analogue to Digital converter ........................................................................................................... 26 Testing the D/A and A/D .................................................................................................................. 26 ATmega device ..................................................................................................................................... 29 Programming the ATmega ................................................................................................................ 30 Arduino pins on the Gertboard ...................................................................................................... 30 A few sketches to get you going ................................................................................................... 31 Minicom ........................................................................................................................................ 36 Combined Tests .................................................................................................................................... 38 A/D and motor controller .................................................................................................................. 38 Decoder ............................................................................................................................................. 39 For More Information ........................................................................................................................... 40 Appendix A: Schematics ....................................................................................................................... 40 4 Gertboard Overview Raspi open collector (6x) Micro controller strapping area Motor controller D A A D SPI PWM I/O UART I/O 12x 3x SPI/dbg out in 1k 1k ULN2803a ATmega 74xx244 L6203 MCP3002 MCP4802 Fig. 1: The principle, high level diagram of the Gertboard. In this view it is possible to see how flexible Gertboard is, by being able to connect various parts of the board together. Above is a principle diagram1 of the Gertboard. Each circle in the diagram represents a header pin. These headers give you access to a wide range of control combinations. As you begin experimenting with the board, you will probably use the strapping area to connect various components on the Gertboard to the Raspberry Pi. This flexibility even allows you, for example, to connect the motor controller input pins to the Atmel ATmega device (an AVR microcontroller). The ATmega device has a separate 6-pin header, which allows it to be programmed by the Raspberry Pi using the (Serial Peripheral Interface) SPI bus. The major building blocks are: • 12x buffered I/O • 3x push buttons • 6x open collector drivers (50V, 0.5A) • 48V, 4A motor controller • 28-pin dual in line ATmega microcontroller • 2-channel 8/10/12 bit Digital to Analogue converter • 2-channel 10 bit Analogue to Digital converter Each of these building blocks has a section below. 1 A ‘principle diagram’ is a coarse overview of the most important parts of the system. It is not correct in all details. For that you must look at the board schematics. 5 Labels on the circuit board Fig. 2: A photograph of the unpopulated Gertboard viewed from above, showing the silver coloured holes and pads that eventually will be home to the components, as well as the legends printed in white epoxy ink, and green solder resist coating. Fig. 3: This image is a diagrammatic representation of the same photograph shown in Fig. 2 above. It was generated from the same files that were used to create the physical printed circuit board. The blue elements in the diagram correspond to the white text and lines on the photo and the red elements correspond to the silver pads and holes on the photo. 6 From now onwards in this guide, because it is much clearer to see, the diagram shown in Fig. x will be used in preference to show you how to wire up the Gertboard, and to run the test and example programs. It is useful to be able to look at the bare board in order to see the labels (the white text in the photo and the blue text in the diagram) on the board without the components getting in the way. These labels provide essential information that is required in order to use Gertboard to its full potential. Almost all of the components have labels, and more importantly, the pins in the headers have labels. It isn’t necessary to be too concerned about the majority of the components; such as resistors and capacitors (labelled with Cn and Rn, where n is some number). These are fairly simple devices that don’t have a ‘right way round’ when they are assembled to the board. Diodes on the other hand, do need assembling the right way round (covered later) - all the diodes are labelled Dn; of these, the ones that you will be interested in are D1 through D12, the light emitting diodes (LEDs; they are located near the top of the board on the left). Pushbutton switches are labelled S1, S2, and S3 (they are located just beneath the LEDs). Fig. 4: Two examples of ICs – an 8-pin and a 20-pin dual-inline (DIL) package. In this package style, pin 1 is always identified as the first pin anticlockwise from the package notch marking. Integrated circuits, or ICs, are marked Un, so for example the I/O buffer chips are U3, U4, and U5 (these are near the middle of the board), while the Atmel microcontroller is U8 (this is below and to the left of U3 to U5). For the ICs, it is very important to know which is pin 1. If the IC is orientated so that the end with the semi-circle notch is to the left, then pin 1 is the leftmost pin in the bottom row. On the Gertboard, the location of pin 1 is always marked with a square pad. Pin numbers increase in an anti-clockwise direction from there, as shown in the diagram. Knowing this means that the schematics in Appendix A can always be related to the pinning on the ICs on the Gertboard. Headers (the rows of pins sticking up from the board) will be a frequently used component on the Gertboard. They are labelled Jn, so for example the header to the ribbon cable from the Raspberry Pi is attached, is J1. Pin 1 on the headers is again marked with a square pad. Power pins are marked with their voltage; for example there are a few positions marked 3V3. This is a commonly used notation in electronics, and in this case it means 3.3 volts. A 5V power supply comes onto the board via the GPIO connector, but the standard Gertboard assembly instructions do not require that a header is installed to access this. If 5V is really required, and spare header pins are available, a header can be soldered in location J24 in the lower right-hand corner of the board, and then a 5V supply can be picked up from the lower pin (next to the text ‘5V’). Ground is marked with GND or a ⊥ symbol. 1 2 3 4 8 7 6 5 1 2 3 4 5 6 7 8 20 19 18 9 10 17 16 15 14 13 12 11 7 Location of the building blocks on the Gertboard Fig. 5: Photograph of an assembled Gertboard, with key functional blocks identified by coloured boundary marking. This image serves as a good reference point for a board that has been successfully assembled from bare board and components. Please note that the appearance of some components can vary. This annotated photo of a populated Gertboard shows where the building blocks (the major capabilities of the board) are located. Some of the building blocks have two areas marked. For example, the turquoise lines showing the Atmel ATmega chip not only surround the chip itself (on the lower left) but also surround two header pins near the bottom of the board, in the middle. These pins are connected to the Atmel chip and provide an easy way to interface the GPIO signals from the Raspberry Pi (which are in the black box) with the Atmel chip. The supply voltage (the voltage that acts as high or logical 1 on the board) is 3.3V. This is generated from the 5V power pin in the J1 header (the one where the ribbon cable to the Raspberry Pi is attached) by the components in the lower right corner of the board. The open collector and motor controllers can handle higher voltages and have points to attach external power supplies. 8 Jumpers and straps Fig. 6: Image showing straps on the left hand side, and jumpers on the right. Straps connect two parts of Gertboard together, whilst jumpers conveniently connect two adjacent pins on the same header, together. The Gertboard Kit contains materials to produce single straps, although the double strap also shown can also be useful. To work properly, and get the maximum flexibility from the Gertboard a number of straps and jumpers are essential. On the left of the photo are straps: they consist of wires that connect the small metal connector and plastic housing, that slip over the header pins. They are meant for connecting header pins that are further apart. It is sometimes useful to have straps that connect two or three adjacent pins to the same number of adjacent pins elsewhere on the board. This is useful for example when you want to use several LEDs. On the right of the above photo are jumpers: they are used to connect two header pins that are right next to each other. There is one jumper that should be in place at all times on the board: the one connecting pins 1 and 2 in header J7. This is the jumper that connects power from the power input pins to the rest of the board. It is near the lower right corner of the board and is the jumper connecting the two pins below the text 3V3 in the photo below. Fig. 7: Image showing header J7 with translucent jumper in place. J7 is located just above J8 (J7 legend is obscured in this image) GPIO pins The header J2, to the right of the text ‘Raspberry Pi’ on the board, provides access to all the I/O pins on the GPIO header. There are 26 pins in J1 (the GPIO header which is connected to the Raspberry Pi through the ribbon cable) but only 17 pins in J2: 3 of the pins in J1 are power and ground, and 6 are DNC (do not connect). The labels on these pins, GP0, GP1, GP4, GP7, etc, may initially seem a little arbitrary, as there are some obvious gaps, and the numbers do not correspond with the pin numbers on the GPIO header J1. These labels are important however: they correspond with the signal names used 9 by the BCM2835, the processor on the Raspberry Pi. Signal GPIOn on the BCM2835 datasheet corresponds to the pin labelled GPn on header J2 (so for example, GPIO17 on the data sheet can be found at the pin labelled GP17 on the board). The numbers in the labels allow us to specify which pins are required in the control programs to be run later. Some of the GPIO pins have an alternate function that are made use of in some of the test programs. These are shown in the table below. The rest are only used as general purpose input/output in the code. On page 27 there is a description of how to gain access to the alternate functions of GPIO pins. GPIO0 SDA0 (alt 0) I2C bus GPIO1 SLC0 (alt 0) GPIO7 SPI_CE1_N (alt 0) SPI bus GPIO8 SPI_CE0_N (alt 0) GPIO9 SPI_MISO (alt 0) GPIO10 SPI_MOSI (alt 0) GPIO11 SPI_SCLK (alt 0) GPIO14 TXD0 (alt 0) UART GPIO15 RXD0 (alt 0) GPIO18 PWM0 (alt 5) pulse width modulation Table 1: Table showing the GPIO pins on the Gertboard, and what their alternative function is. We mention the I2C bus use of GPIO0 and 1 above not because the I2C bus is used in the test programs, but because each of them has a 1800 pull-up resistor on the Raspberry Pi, and this prevents them from being used with the pushbuttons (see page 134). Schematics Whilst there are some circuit diagrams, or schematics, in the main body of the manual for some of the building blocks of the board, they are simplifications of the actual circuits on the board. To truly understand the board and the connections you need to make on it, you need to be a little familiar with the schematics. Thus we have attached the full schematics at the end of this manual as Appendix A. These pages are in landscape format. The page numbers A-1, A-2, etc, are in the lower left corner of the pages (if you hold them so that the writing is the right way up). Test programs overview When you download the Gertboard test/example code (available at www.element14.com/raspberrypi), you will have a file with a name something like gertboard_sw_10_07_12.tar.gz. This is a compressed (hence the .gz suffix, which means it was compressed using the gzip algorithm) archive (hence the .tar), where an archive is a collection of different files, all stored in a single file. To retrieve the original software, put the file where you want your Gertboard software to end up on your Raspberry Pi computer, then uncompress it by typing the following in one of the terminal windows on your Pi (substituting the name of the actual file you have downloaded for the file name we are using in this example): gunzip gertboard_sw_10_07_12.tar.gz 10 Typing a directory command, ls, should then show the newly uncompressed archive file gertboard_sw_10_07_12.tar . So now, to extract the files from the archive, type tar –xvf gertboard_sw_10_07_12.tar A new directory, gertboard_sw, will be created. In it is a set of C files and a makefile. C files are software files, but they need to be compiled to run on the processor on your system. In the case of Raspberry Pi, this is an ARM11. To compile all the code to run on Raspberry Pi, first change directory to gertboard_sw by typing: cd gertboard_sw And then in that directory, type: make all Each building block has at least one test program that goes with it. Currently the test programs are written in C; but they’ll be translated into Python in the near future. Each test program is compiled from two or more C files. The file gb_common.c (which has an associated header file gb_common.h) contains code used by all of the building blocks on the board. Each test has a C file that contains code specific to that test (thus you will find main here). Some of the tests use a special interface (for example the SPI bus), and these tests have an additional C file that provides code specific to that interface (these files are gb_spi.c for the SPI bus and gb_pwm for the pulse width modulator). In each of the sections about the individual building blocks, the code specific to the tests for that block is explained. Since all of the tests share the code in gb_common.c, an overview of that code will be given here. In order to use the Gertboard via the GPIO, the test code first needs to call setup_io. This function allocates various arrays and then calls mmap to associate the arrays with the devices that it wants to control, such as the GPIO, SPI bus, PWM (pulse width modulator) etc. The result of this is that it writes to these arrays control the devices or sends data to them, and reads from these arrays get status bits or data from the devices. At the end of a test program, restore_io should be called, which undoes the memory map and frees the allocated memory. Macros In gb_common.h, gb_spi.h, and gb_pwm.h there are a number of macros that give a more intuitive name to various parts of the arrays that have been mapped. These macros are used to do everything from setting whether a GPIO is used as input or output to controlling the clock speed of the pulse width modulator. In the chart below is a summary of the purpose of the more commonly used macros and give the page number on which its use is explained in more detail. The T column below gives the ‘type’ of the macro. This shows how the macro is used. ‘E’ means that the command is executed, as in: INP_GPIO(17); ‘W’ means that that the command is written to (assigned), as in: GPIO_PULL = 2; 11 ‘R’ means that that the command is read from, as in: data = GPIO_IN0; Macro name T Explanation Page no. INP_GPIO(n) E activates GPIO pin number n (for input) 11 OUT_GPIO(n) E used after above, sets pin n for output 11 SET_GPIO_ALT(n, a) E used after INP_GPIO, select alternate function for pin 24 GPIO_PULL W set pull code 16 GPIO_PULLCCLK0 W select which pins pull code is applied to 16 GPIO_IN0 R get input values 16 GPIO_SET0 W select which pins are set high 17 GPIO_CLR0 W select which pins are set low 17 Table 2: Commonly used macros, their purpose, type and location within this manual. The macro INP_GPIO(n) must be called for a pin number n to allow this pin to be used. By default its mode is set up as an input. If it is required that the pin is used for an output, OUT_GPIO(n)must be called after INP_GPIO(n). Buffered I/O, LEDs, and pushbuttons There are 12 pins which can be used as input or output ports. Each can be set to behave either as an input or an output, using a jumper. Note that the terms ‘input’ and ‘output’ here are always with respect to the Raspberry Pi: in input mode, the pin inputs data to the Pi; in output mode it acts as output from the Pi. It is important to keep this in mind as the Gertboard is set up: an output from the Gertboard is an input to the Raspberry Pi, and so the ‘input’ jumper must be installed to implement this. I/O 1k 1k-10k input 74xx244 output Raspi Fig. 8: The circuit diagram for I/O ports 4-12 The triangles symbols in the diagram above represent buffers. In order to make the port function as an input to the Raspberry Pi you install the ‘input’ jumper: then the data flows from the ‘I/O’ point to the ‘Raspi’ point. To make the port function as an output, the ‘output’ jumper must be installed: then the data flows from the ‘Raspi’ point to the ‘I/O’ point. If both jumpers are installed, it won’t harm the board, but the port won’t do anything sensible. 12 In both the input and output mode the LED will indicate what the logic level is on the ‘I/O’ pin. The LED will be on when the level is high and it will be off when the level is low. There is a third option for using this port: if neither the input nor output jumper is placed the I/O pin can be used as a simple ‘logic’ detector. The I/O pin can be connected to some other logic point (i.e. one that is either at 0V or 3.3V) and use the LED to check if the connect point is seen as high or low. Depending on the type of 74xx244 buffer chosen, the LED could behave randomly if the port is not driven properly. In that case it may easily switch state, switching on or off with the smallest of electronic changes, for example, when the board is simply touched. There is a series resistor between the input buffer and the GPIO port. This is to protect the BCM2835 (the processor on the Raspberry Pi) in case the user programs the GPIO as output and also leaves the ‘input’ jumper in place. The BCM2835 input is a high impedance input and thus even a 10K series resistor will not produce a noticeable change in behaviour when it is used as input. Push buttons The Gertboard has three push buttons; these are connected to ports 1, 2, and 3. Thus the first three I/O ports look like this: I/O 1k 1k-10k input 74xx244 output Raspi 1k Fig. 9: Circuit diagram showing one of the three push buttons I/Os. There is a circuit like this for ports 1 to 3. In order to use a push button, the ‘input’ jumper must not be installed, even if the intention is to use this as an input to the Raspberry Pi. If it is installed, the output of the lower buffer prevents the pushbutton from working properly. To make clear what state each button is in, the output jumper can be installed, and then the LED will now show the button state (LED on means button up, LED off means button down). To use the push buttons, a pull-up must be set on the Raspberry Pi GPIO pins used (described below, page 16) so that they are read as high (logical 1) when the buttons are not pressed. Locating the relevant sections of the Gertboard In the building blocks location diagram on page 7, the components implementing the buffered I/O are outlined in red. The ICs containing the buffers are U3, U4, and U5 near the centre of the board. The LEDs (the round translucent red plastic devices) are labelled D1 to D12; D1 is driven by port 1, D2 by port 2, etc. The pushbutton switches (the silver rectangular devices with circular depressions in the middle) are labelled S1 to S3; S1 is connected to port 1 and so on. The long thin yellow components with multiple pins, are resistor arrays. 13 The pins corresponding to ‘Raspi’ in the circuit diagrams above are B1 to B12 on the J3 header above the words ‘Raspberry Pi’ on the board (B1 to B3 correspond to the ‘Raspi’ points on the second circuit diagram with the pushbutton, and B4 to B12 correspond to the ‘Raspi’ points on the first circuit diagram). They are called ‘Raspi’ because these are the ones that should be connected to the pins in header J2, which are directly connected to the pins in J1, and which are then finally connected via the ribbon cable to the Raspberry Pi. The pins corresponding to the ‘I/O’ point on the right of the circuit diagrams above are BUF1 to BUF12 in the (unlabeled) single row header at the top of the Gertboard. On the Gertboard schematic, I/O buffers are on page A-2. The buffer chips U3, U4, and U5 are clearly labelled. It should be apparent that ports 1 to 4 are handled by chip U3, ports 5 to 8 by chip U4, and ports 9 to 12 by chip U5. The ‘Raspi’ points in the circuit diagrams above are shown as the signals BUF_1 to BUF_12 on the left side of the page, and the ‘I/O’ points are BUF1 to BUF12 to the right of the buffer chips. The input jumper locations are the blue rectangles labelled P1, P3, P5, P7, etc to the left of the buffer chips, and the output jumper locations are the blue rectangles labelled P2, P4, P6, P8, etc, to the right of the buffer chips. The pushbutton switches S1, S2, and S3 are shown separately, on the right side of the page near the bottom. The buffered I/O ports can be used with (almost) any of the GPIO pins; they just have to be connected up using the straps. So for example, if you want to use port 1 with GPIO17 a strap is placed between the B1 pin in J3 and the GP17 pin in J2. Beware that the push buttons cannot be used with GPIO0 or GPIO1 (GP0 and GP1 in header J2 on the board) as those two pins have a 1800 pull-up resistor on the Raspberry Pi. When the button is pressed the voltage on the input will be 3.3 × 1000Ω 1000Ω + 1800Ω = 1.2 This is not an I/O voltage which can be reliably seen as low. The output and input jumper locations are above and below the U3, U4, and U5 buffer chips. The ‘input’ jumpers need to be placed on the headers below the chips (shown on the board with the ‘in’ text; they are separated from the chip they go with by a yellow resistor array), and the ‘output’ jumpers need to be placed on the headers above the chips (with the ‘out’ text). If viewed closely (it is clearer on the bare board), it is possible to see that each row of 8 header pins above and below the buffer chips is divided up into 4 pairs of pins. The pairs on U3 are labelled B1 to B4, the ones on U4 are B5 to B8, and the ones on U5 are B9 to B12. The B1 pins are for port 1, B2 for port 2, etc. To use port n as an input (but not when using the pushbutton, if n is 1, 2, or 3), a jumper is installed over the pair of pins in Bn in the row marked ‘in’ (below the appropriate buffer chip). To use port n as an output, a jumper is installed over the pair of pins in Bn in the row marked ‘out’ (above the appropriate buffer chip). 14 Fig. 10: Example of port configuration where ports 1 to 3 are set to be outputs and ports 10 and 11 are set to be inputs. As a concrete example, in the picture above, ports 1, 2, and 3 are configured for output (because of the jumpers across B1, B2, and B3 on the ‘out’ side of chip U3). Ports 10 and 11 are configured for input (because of the jumpers across B10 and B11 on the ‘in’ side of U5). In the test programs, the required connections are printed out before starting the tests. The input and output jumpers are referred to in the following way: U3-out-B1 means that there is a jumper across the B1 pins on the ‘out’ side of the U3 buffer chip. So the 5 jumpers in the picture above would be referred to as U3-out-B1, U3-out-B2, U3-out-B3, U5-in-B10, and U5-in-B11. Testing the pushbuttons The test program for the pushbutton switches is called buttons. To run this test, the Gertboard must be set up as in the image below. There are straps connecting pins B1, B2, and B3 in header J3 to pins GP25, GP24, and GP23 in header J2 (respectively). Thus GPIO25 will read the leftmost pushbutton, GPIO24 will read the middle one, and GPIO23 will read the rightmost pushbutton. The jumpers on the ‘out’ area of U3 (U3-out-B1, U3-out-B2, U3-out-B3) are optional: if they are installed, the leftmost 3 LEDs will light up to indicate the state of the switches. 15 Fig. 11: Whilst the image above is clear, it isn’t very good at showing exactly how the straps are connected, and between which pins on the board. Fig. 12: This type of diagram is much more effective at showing how straps connect pins together on the board, so from now onwards, we will use these type of diagrams to show wiring arrangements. 16 In the diagram, black circles show which pins are being connected, and black lines between two pins indicate that jumpers (if they are adjacent) or straps (if they are further apart) are used to connect them. The code specific to the buttons test is buttons.c. In the main routine, the connections required for this test are firstly printed to the terminal (a text description of the wiring diagram above). When the user verifies that the connections are correct, setup_io is called (described on page 10) to get everything ready. setup_gpio is then called, which gets GPIO pins 1 to 3 ready to be used as pushbutton inputs. It does this by first using the macro INP_GPIO(n) (where n is the GPIO pin number) to select these 3 pins for input. Then pins are required to be pulled high: the buttons work by dropping the voltage down to 0V when the button is pressed, so it needs to be high when the button is not pressed. This is done by setting GPIO_PULL to 2, the code for pull-up. Should it ever be required, the code for pull-down is 1. The code for no pull is 0; this will allows this pin to be used for output after it has been used as a pushbutton input. To apply this code to the desired pins, set GPIO_PULLCCLK0 = 0X03800000. This hexadecimal number has bits 23, 24, and 25 set to 1 and all the rest set to 0. This means that the pull code is applied to GPIO pins 23, 24, and 25. A short_wait allows time for this to take effect, and then GPIO_PULL and GPIO_PULLCLK0 are set back to 0. Back in the main routine, a loop is entered in which the button states are read (using macro GPIO_IN0), grabbing bits 23, 24, and 25 using a shift and mask logical operations, and, if the button state is different from before, it is printed out in binary: up (high) is printed as ‘1’ and down (low) is printed as ‘0’. This loop executes until a sufficient number of button state changes have occurred. After the loop, unpull_pins is called, which undoes the pull-up on the pins, then call restore_io in gb_common.c to clean up. Testing the LEDs The test program for the LEDs is called leds. To set up the Gertboard to run this test, see the wiring diagram below. Every I/O port is connected up as an output, so all the ‘out’ jumpers (those above the buffer chips) are installed. Straps are used to connect the following (where all the ‘GP’ pins are in header J2 and all the ‘B’ pins are in header J3): GP25 to B1, GP24 to B2, GP23 to B3, GP22 to B4, GP21 to B5, GP18 to B6, GP17 to B7, GP11 to B8, GP10 to B9, GP9 to B10, GP8 to B11, and GP7 to B12. In other words, the leftmost 12 ‘GP’ pins are connected to the ‘B’ pins, except that GP14 and GP15 are missed out: they are already set to UART mode by Linux, so it’s best if they are not touched. If there aren’t enough jumpers or straps to wire these connections all up at once, don’t worry. Just wire up as many as possible, and run the test. Once it’s finished the straps/jumpers can be moved and the test can be run again. Nothing bad will happen if a pin is written to that has nothing connected to it. 17 Fig. 13: The wiring diagram necessary to run the Gertboard LED test program, leds The test code in leds.c first calls setup_io to get everything ready. Then setup_gpio is called, which prepares 12 GPIO pins to be used as outputs (as all 12 I/O ports will require controlling). All of the GPIO signals except GPIO 0, 1, 4, 14, and 15 are used. To set them up for output, first call INP_GPIO(n) (where n is the GPIO pin number) for each of the 12 pins to activate them. This also sets them up for input, so then call OUT_GPIO(n) afterwards for each of the 12 pins to put them in output mode. LEDs are switched on using the macro GPIO_SET0: the value assigned to GPIO_SET0 will set GPIO pin n to high if bit n is set in that value. When a GPIO pin is set high, the I/O port connected to that pin goes high, and the LED for that port turns on. Thus, the line of code “GPIO_SET0 = 0x180;” will set GPIO pins 7 and 8 high (since bits 7 and 8 are set in the hexadecimal number 0x180). Given the wiring setup above, ports 11 and 12 will go high (because these are the ports connected to GP7 and GP8), and thus the rightmost two LEDs will turn on. To turn LEDs off, use macro GPIO_CLR0. This works in a similar way to GPIO_SET0, but here the bits that are high in the value assigned to GPIO_CLR0 specify which GPIO ports will be set low (and hence which ports will be set low, and which LEDs will turn off). So for example, given the wiring above, the command “GPIO_CLR0 = 0x100;” will set GPIO8 pin low, and thus turn off the LED for port 11, which is the port connected to GP8. (In leds.c the LEDs are always all turned off together, but they don’t have to be used this way.) The test program flashes the LEDs in three patterns. The patterns are specified by a collection of global arrays given values using an initializer. The number in each of the arrays says which LEDs will 18 be turned on at that point in the pattern – so, pattern value is submitted sequentially to produce the changing pattern, switching all the LEDs off between successive pattern values. Each pattern is run through twice. The first pattern lights the LEDs one at a time in sequence, left to right. The second pattern does the same but when it reaches the rightmost LED, it then reverses direction and lights them in sequence right to left. The third pattern starts at the left end and at each step switches on one more LED until they are all lit up, then starting at the left it switches them off one by one until they are all off. Finally, the test program switches off all the LEDs and then finally calls restore_io to clean up all the LEDs to a predictable final state. Testing I/O Our two examples so far have only used the ports to access the pushbuttons and LEDs. The next example, called butled (for BUTton LED) will show one of the ports serving just as an input port. The idea is that one port (along with its button) is used to generate a signal, and software then sends that signal to another port which it is used as just an input. We read both ports in and print them on the screen. Fig. 14: The wiring diagram for test program butled which detects a button press, and then display that button state on the screen. This is to test all the I/O on the Gertboard. The wiring for this test is shown above. Pin GPIO23 controls I/O port 3, and GPIO22 controls I/O port 6, so GP23 in header J2 is connected to pin B3 in header J3, and GP22 is connected to B6. Now, for the interesting part. The pushbutton on port 3 is going to be used here, but the LED for port 3 should not be used, so therefore the output jumper for port 3 is not installed (which would be placed at U3-out-B3). 19 Looking at the schematic on page A-2, it is clear that the output buffer for port 3 goes to pin 14 of buffer chip U3. This is connected to the U3-out-B3 header pin just above pin 14 on the chip (it is pin 1 of U3-out-B3; this is clear from the schematic and from the fact that this pin has a square pad on the bare circuit board), so that pin is connected to the BUF6 pin at the top of the board. This allows the switch to generate a signal which is then sent to port 6. A jumper is installed across U4-in-B6 to allow that signal to be input from the board. The value of the switch from port 3 is also read in, and these two should be the same (most of the time). In butled.c we use INP_GPIO to set GPIO22 and GPIO23 to input and GPIO_PULL and GPIO_PULLCLK0 to set the pull-up on GPIO23. This is described in more detail on page 16, in the buttons test. Then the GPIO values are repeatedly read in, and the binary values of GPIO22 and GPIO23 are printed out, if they have changed since the last cycle. So if ‘01’ is displayed on the monitor, it can be deduced that GPIO23 is low and GPIO22 is high. (Note that the LED for port 6, labelled D6, should be off when switch 3 is pressed and on when switch 3 is up.) Now, if the values for GPIO22 and GPIO23 are always the same, ‘00’ and ‘11’ will only ever be printed out. But if the test is started with button 3 up (so ‘11’ is displayed), and then the button is pushed down, occasionally ‘01’ might be seen, followed very quickly by ‘00’. The reason for this differs between the Python and C implementations. In the C version, both values are read at the same time, and the signal from the push button (which is connected to GPIO23) takes a small amount of time to propagate through the buffers to get to GPIO22. It may even be possible to get one reading in after GPIO23 has changed, but insufficient time has passed for GPIO22 to change state and follow it! In the Python code, the read of GPIO22 occurs before the read of GPIO23 (the button). Thus if the button is pressed or released between these two reads, the new value will be read in for the button (GPIO23), but the new value of the other input (GPIO22) won’t change until the next time through the while loop. Open Collector Driver The Gertboard uses six ports of a ULN2803a to provide open collector drivers. These are used to turn off and on devices, especially those that need a different voltage or higher current than that available on the Gertboard and are powered by an external power supply. The ULN2803a can withstand up to 50V and drive 500mA on each of its ports. Each driver has an integrated protection diode (the uppermost diode in the circuit diagram below). Raspi OUT common Fig. 15: Circuit diagram of each open collector driver. 20 The ‘common’ pin is, as the name states, common for all open collector drivers. It is not connected to any other point on the Gertboard. As with all devices the control for the open collector drivers (the ‘Raspi’ point) can also be connected to the ATmega controller to, for example, drive relays or motors. The open collector drivers are in the schematics on page A-3. On the Gertboard building block diagram on page 7, the area containing the components for the open collector drivers are outlined in yellow. The pins corresponding to ‘Raspi’ in the diagram above are RLY1 to RLY6 pins in the J4 header; the pins corresponding to ‘common’ are the ones marked RPWR in the headers on the right edge of the board; and the pins corresponding to ‘OUT’ are the RLY1 to RLY6 pins in the headers J12 to J17. How these are then used is demonstrated by the test wiring and code examples. Testing the open collector drivers The program ocol (for open collector) allows the functional testing of the open collector drivers. A simple mechanism was required to switch the driver on and off, so we created a little circuit (see diagram below) consisting of two large LEDs and a resistor in series. Once connected, the forward voltage across each of these LEDs is a little above 3V, so we used a 9V battery as a power supply, and calculated a series resistance of around about 90 to set a suitable current flow through the LEDs. Since this small test circuit will not be used again, it can simply be hand soldered together off-board. Remember that LEDs are diodes, and have to be connected the right way round. The small ‘flat’ in the LED moulding denotes the ‘cathode’ or negative pin. If you think of the LED symbol in the circuit diagram below as an arrow, it is pointing in the direction of the current flow, from + to -, or from anode to cathode. To turn the circuit off and on using the open collector driver (say you want to use driver 1), first check that it works with the power supply described above. Then, leave the positive side of your circuit attached to the positive terminal of the power supply, but in addition connect it to one of the RPWR pins in the headers on the right edge of the board (they are all connected together). Disconnect the ground side of the circuit from the power supply and connect it instead to RLY1 in header J12 on the right of the board. Attach the ground terminal of the power supply to any GND or ⊥ pin on the board. Now, we need a signal to control the driver. For the ocol test we are using GPIO4 to control the open collector (you could of course use any logic signal), so connect GP4 in header J2 to RLY1 in J4. (To test a different driver, say n, with the ocol test, connect the ground side of the circuit up to RLYn in the headers on the right of the board and connect GP4 in header J2 to RLYn in J4.) Now, when RLY1 in J4 is set low, the circuit doesn’t receive any power and thus is off. When RLY1 in J4 goes high, the open collector driver uses transistors to connect the ‘ground’ side of the circuit to the ground on the board, and since this is connected to the ground terminal on the power supply, the power supply ends up powering the circuit: it is just turned off and on by the open collector driver. 21 Fig.16: Wiring diagram showing how to connect Gertboard to test the open collector drivers. It also shows the small test power supply made up of two LEDs in series, a 90  resistor and a 9V battery. You may wonder why you need to connect the positive terminal of the power supply to the open collector driver (via the RPWR pin). The reason for this is that if the circuit happens to contain an component that has electrical inductance, for example a motor or a relay, when the power is turned off this inductance causes the voltage on RLYn pin to quickly rise to a higher voltage than the positive terminal of the power supply, dropping quickly afterwards. The chip itself has an internal diode connecting the RLYn pin to the RPWR. This allows current to flow to the top (positive side) of your circuit, allowing the energy to dissipate, and preventing damage. The ocol test is very simple. First, it prints out the connections required on the board (and with your external circuit and power supply), and then it calls setup_io to get the GPIO interface ready to use and setup_gpio to set pin GPIO4 to be used as an output (using the commands INP_GPIO(4); OUT_GPIO(4); as described on page 11). Then in it uses GPIO_SET0 and GPIO_CLR0 (described on page 17) to set GPIO4 high then low 10 times. Note: the test asks which driver should be tested, but it only uses this information to print out the connections that need to be made. Otherwise it ignores your response. 22 Motor Controller The Gertboard has a position for a L6203 (Miniwatt package) motor controller. The motor controller is for brushed DC motors. The controller has two input pins, A and B (labelled MOTA and MOTB on the board). The pins can be driven high or low, and the motor responds according to the table below. The speed of the motor can be controlled by applying a pulse-width-modulated (PWM) signal to either the A or B pin. A B Motor action 0 0 no movement 0 1 rotate one way 1 0 rotate opposite way from above 1 1 no movement Table 3: Truth table showing the behaviour of the motor controller under different logic combinations. The motor controller IC has internal temperature protection. Current protection is provided by a fuse on the Gertboard. The motor controller is in the schematics on page A-4. On the Gertboard building block diagram on page 7, the area containing the components for the motor controller are outlined in purple. The motor controller and screw terminals are near the top of the board, and there are two pins for the control signals in a small header just above GP4 and GP1 in header J2. The MOTA and MOTB pins just above header J2 are the inputs to the motor controller – these are digital signals (low and high). The screw terminals at the top of the board labelled MOTA and MOTB are the outputs of the motor controller: they actually provide the power to the motor. The motor will probably need more power (a higher voltage or current) than that provided by the Gertboard. The screw terminals at the top labelled MOT+ and ⊥ allow the connection of an external power supply to provide this: the motor controller directs this power to the MOTA and MOTB screw terminals, modulating it according to the MOTA and MOTB inputs near J2. If you just want to turn the motor off and on, in either direction, this is achieved by simply choosing two of the GPIO pins and installing straps between them to the MOTA and MOTB motor controller inputs. Then, to control the motor, the pins are set high or low per the table 3 above. To control the speed of the motor however, pulse width modulation (PWM) is required. This is a device that outputs a square wave that flips back and forth from on to off very rapidly, as in the diagram below: Fig. 17: An example of a PWM output. In this example the output is neither on nor off all the time. In fact, here it is on for 50% of the time, and is therefore said to have a duty cycle of 50%. 0 1 23 With a PWM, you can control the amount of time the output is high vs. when it is low. This is called the duty cycle and is expressed as a percentage. The diagram above shows a 50% duty cycle; the one below is 25%. Fig. 18: In this PWM example, the duty cycle is 25%. There is a PWM in the BCM2835 (the Raspberry Pi processor), and it’s output can be accessed via GPIO18 (it is alternate function 5). If this is connected to one of the motor controller inputs (MOTA has been used in our motor test), and set the other motor controller input (MOTB in our test) to a steady high or low, the speed and direction of the motor can be controlled. Fig. 19: The motor direction is set by MOTB. Whilst MOTA has a duty cycle of 25%, the motor only receives power when MOTA and MOTB are different, thus it receives power for 75% of the time. For example, in the diagram above we are alternating between A low/B high and A high/B high (the second and fourth lines of the table above). When A is low, the motor will receive power making it turn one way; when A is high it will not receive power. The end result for the 25% duty cycle shown here is that the motor will turn one way at roughly ¾ speed. Fig. 20: In this example, the truth table predicts that the motor will run in the opposite direction at around 25% speed. If on the other hand you set MOTB low, as in the diagram above, then when A is high the motor will receive power making it turn in the other direction, and when A is low the motor will not receive power. The result for the 25% duty cycle is that it will turn in the other direction at about ¼ speed. Testing the motor controller The PWM is controlled by a memory map, like the GPIO and SPI bus. This memory map is part of the setup_io function in gb_common.c, so that is whether the PWM is used or not. Further setup code is found in, gb_pwm.c, with an associated header file gb_pwm.h. The function setup_pwm in gb_pwm.c sets the speed of the PWM clock, and sets the maximum value of the PWM to 1024: this is the value at which the duty cycle of the PWM will be 100%. It also makes sure that the PWM is off. The two routines set_pwm0 and force_pwm0 set the value that controls the duty cycle for the PWM. set_pwm0 sets the value (first checking that it is between 0 and 1024), but as there are only certain points in the PWM cycle where a new value is picked up, if a second value is written again quickly the first will have no effect. The force_pwm0 routine takes two arguments, a new value and a new mode. It disables the PWM, then sets the value, then re-enables it with the given mode setting, 0 1 0 1 0 1 MOTA MOTB 0 1 0 1 MOTA MOTB 24 with delays in strategic places to allow the new values to be picked up. The pwm_off routine simply disables the PWM. The test program for the motor controller is called motor. To set up Gertboard for this, connect GP17 in J2 to the MOTB pin (the MOTB pin in the 2-pin header above GP1 and GP4, not the one at the top of the board), and GP18 to MOTA in that little header. The motor leads need to be connected to the MOTA and MOTB screw terminals at the top of the board, and the power supply for the motor needs to be connected to the MOT+ and ⊥ screw terminals. This is shown below. Fig. 20: The wiring diagram for the test program motor. The code for the motor program is in motor.c. In the main routine, first the connections that must be made on the board to run this program are printed out, then call setup_io to get the GPIO interface ready for use. setup_gpio is then called to set GPIO18 up for use as the PWM output and GPIO17 up for normal output. For the latter, both INP_GPIO and OUT_GPIO are used, see page 11 for more info. To set up GPIO18, first use INP_GPIO(18) to activate the pin. One of the alternate functions for GPIO18 is to act as the output for the PWM; this is alternative 5. Thus use the macro SET_GPIO_ALT(18, 5) to select this alternate use of the pin. (See table Table 6-31 from the BCM2835 datasheet, or the online version at http://elinux.org/RPi_BCM2835_GPIOs, for more details about alternative functions for the GPIO pins. A summary of the alternate function of GPIO pins used on the Gertboard, see the table on page 9.) 25 We set the output of GPIO17 low (to make sure that the motor doesn’t turn) and then initialize the PWM by calling setup_pwm. We enable the PWM by setting the mode to PWM0_ENABLE using force_pwm0. Since GPIO17 (motor controller B input) is set low, when the duty cycle on the PWM (motor controller A input) is high enough, the motor will turn the ‘opposite way’ as described in the motor table on page 22. A loop now starts where the PWM is started, first with a very low duty cycle (because the value passed to set_pwm0 is low), then gradually increasing this to the maximum (which is set to 0x400 – 1024 – in setup_pwm). Then the value sent to the PWM is decreased to slow the motor down. Then GPIO17 is set high, so that the motor will get power on the low phase of the PWM signal. The PWM is re-enabled with the mode PWM0_ENABLE|PWM0_REVPOLAR. The reverse polarization flag flips the PWM signal, so that a low value sent to the PWM results in a signal that is high most of the time (rather than low most of the time). That way the same code can be used to slowly ramp up the speed of the motor (but in the ‘one way’ direction as in the table on page 22), then slow it down again. Finally the PWM is switched off, and the GPIO interface is closed down. Digital to Analogue and Analogue to Digital Converters In the Gertboard building blocks diagram on page 7, the components implementing the converters are outlined in orange. Both the analogue converter (D/A) and analogue to digital converter (A/D) are 8- pin chips from Microchip. The D/A is U6 (above) and the A/D is U10 (below). Each supports 2 channels. Both use the SPI bus to communicate with the Raspberry Pi. The SPI pins on the two chips are connected to the pins labelled SCLK, MOSI, MISO, CSnA, and CSnB in the header just above J2 on the board (thus in the building blocks diagram, these pins are also outlined in orange). SCLK is the clock, MOSI is the output from the RPi, and MISO is the input to the RPi. CSnA is the chip select for the A/D, and CSnB is the chip select signal for the D/A (the ‘n’ in the signal name means that the signal is ‘negative’, thus the chip is only selected when the pin is low). Both A/D and D/A chips have a 10K pull-up resistor on their chip-select pins, so the devices will not be accessed if the chips select pins are not connected. The SPI pins are conveniently located just above GP7 to GP11 in header J2, because one of the alternate functions of these pins is to drive the SPI signals. For example, the “ALT0” (alternative 0) function of GPIO9 is SPI0_MISO, which is why the pin labelled MISO is just about the pin labelled GP9. Thus to use the A/D and D/A, simply put jumpers connecting pins GP7 to GP11 to the SPI pins directly about them (although technically you only need CSnA for the A/D and CSnB for the D/A). In the schematics, the D/A and A/D converts are on page A-6. Digital to analogue converter The Gertboard uses a MCP48xx digital to analogue converter (D/A) from Microchip. The device comes in three different types: 8, 10 or 12 bits. It is likely that MCP4802, the 8 bit version, will be used, but if higher resolutions are needed, it can be replaced with the MCP4812 (10 bits) or MCP4822 (12 bits). These chips are all pin-compatible and are written to in the same way. In particular, the routine that writes to the D/A assumes that writes are in 12 bits, so it is important that the value is selected appropriately (details are below in the “Testing the D/A and A/D” section). The maximum output voltage of the D/A – the output voltage when you send an input of all 1s – is 2.04V. 26 The analogue outputs of the two channels go to pins labelled DA0 (for channel 0) and DA1 (for channel 1) in the J29 header. Just next to these pins are ground pins (GND) to provide a reference. Analogue to Digital converter The Gertboard uses a MCP3002 10-bit analogue to digital converter from Microchip. It supports 2 channels with a sampling rate of ~72k samples per second (sps). The maximum value (1023) is returned when the input voltage is 3.3V. The analogue inputs for these two channels are AD0 (for channel 0) and AD1 (for channel 1) in the J28 header. Just next to these pins are ground pins (GND) to provide a reference. Testing the D/A and A/D Since the D/A and A/D converters both use the SPI bus, the common SPI bus code has been placed into a separate file, gb_spi.c. There is also an associated header file, gb_spi.h, which contains many macros and constants needed for interacting with the SPI bus, as well as the declarations for the functions in gb_spi.c. These functions are setup_spi, read_adc, and write_dac. setup_spi sets the clock speed for the bus and clears status bits. read_adc takes an argument specifying the channel (should be 0 or 1) and returns an integer with the value read from the A/D converter. The value returned will be between 0 and 1023 (i.e. only the least significant 10 bits are set), with 0 returned when the input pin for that channel is 0V and 1023 returned for 3.3V. The write_dac routine takes two arguments, a channel number (0 or 1) and a value to write. The value written requires some explanation. The MCP48xx family of digital to analogue converters all accept a 12 bit value. The MCP4822 uses all the bits; the MCP4812 ignores the last two; and the MCP4802 (which is probably the one you are using) ignores the last four. Since you could use any of those chips on the Gertboard, write_dac is written in so that it will work with all three, so it simply sends to the D/A the value it was given. If Gertboard is fitted with the MCP4802, it can only handle values between 0 and 255, but these must be in bits 4 through 11 (assuming the least significant bit is bit 0) of the bit string it is sent. Thus if the desired number to be sent to the D/A is between 0 and 255, it must be multiplied by 16 (which effectively shifts the information 4 bits to the left) before sending this value to write_dac. The value on the output pin, Vout, is given by the following formula (assuming the 8-bit MCP4802):  =  256 × 2.048 To test the D/A, a multimeter is required. The test program for this is dtoa. To set up Gertboard for this test, jumpers are placed on the pins GP11, GP10, GP9, and GP7 connecting them to the SPI bus pins above them. Attach the multimeter as follows: the black lead needs to be connected to ground. You can use any of the pins marked with ⊥ or GND for this. The red lead needs to be connected to DA0 (to test the D/A channel 0 which is shown below) or DA1 (for channel 1). Switch the multimeter on, and set it to measure voltages from 0 to around 5V. 27 Fig. 21: The wiring diagram required to measure the output from the D to A converter fitted to the Gertboard whilst running the test program dtoa. The dtoa program first asks which channel to use and prints out the connections needed to make on Gertboard to run the program. Then it calls setup_io to get the GPIO ready to use, then calls setup_gpio to choose which pins to use and how to use them. In setup_gpio, as usual INP_GPIO(n) (where n is the pin number) is used to activate the pins. This also sets them up to be used as inputs. They should however, be used as an SPI bus, which is one of the alternative functions for these pins (it is alternate 0). Thus we use SET_GPIO_ALT(n, a) (where n is the pin number and a is the alternate number, in this case 0) to select this alternate use of the pins. Then the program sends different values to the D/A and asks for real verification, using the multimeter, that the D/A converter is generating the correct output voltage. The test program for the A/D is called atod. To run this test a voltage source on the analogue input is required. This is most easily provided by a potentiometer (a variable resistor). The two ends of the potentiometer are connected, one side to high (3.3V, which you can access from any pin labelled 3V3) and the other to low (GND or ⊥), and the middle (wiper) part to AD0 (for channel 0 as shown below) or AD1 (for channel 1). To use the SPI bus jumpers should be installed on the pins GP11, GP10, GP9, and GP8 connecting them to the SPI bus pins above them. 28 Fig. 22: Wiring diagram showing how the Gertboard is connected to verify that the A/D converter is working properly, using the test program atod. The atod program first asks which channel should be used and prints out the connections required on Gertboard to run the program. Then it calls setup_io to get the GPIO ready, then calls setup_gpio to choose which pins will be used, and how they will be used. The setup_gpio used in atod works the same way as the one in dtoa (except for activating GPIO8 instead of GPIO7). Then atod repeatedly reads the 10 bit value from the A/D converter and prints out the value on the terminal, both as an absolute number and as a bar graph (the value read is divided by 16, and the quotient is represented as a string of ‘#’ characters). One thing to be aware of is that even if the potentiometer is not moved, exactly the same result may not appear on successive reads. With 10 bits of accuracy, it is very sensitive, and even the smallest changes, such as house current running in nearby wires, can affect the value read. Even without a multimeter or a potentiometer, it is still possible to test the A/D and D/A by sending the output of the D/A to the input of the A/D. The test that does this is called dad, for digitalanalogue- digital. To set the Gertboard up for this test, hook up all the SPI bus pins (connecting GP11 though GP7 with jumpers to the pins above them) and put a jumper between pins DA1 and AD0, as in the diagram below. 29 Fig. 23: The wiring diagram for an alternative method of testing the A/D and D/A converters together, without the aid of a multimeter and potentiometer. The dad test sends 17 different digital values to the D/A (0 to 255 in even jumps, then back down to 0). The resulting values are then read in from the A/D. Both the original digital values sent and the values read back are printed out, as is a bar graph representing the value read back (divided by 16 as in atod). The bar graph printed out should be a triangle shape: the lines will start out very short, then get longer and longer as larger digital values are read back, then will get shorter again. ATmega device The Gertboard can hold an Atmel AVR microcontroller, a 28-pin ATmega device, at location U8 on the lower left of the board. This can be any of the following: ATmega48A/PA, 88A/PA, 168A/PA or 328/P in a 28-pin DIP package. The device has a 12MHz ceramic resonator attached to pins 9 and 10. All input/output pins are brought out to header J25 on the left edge of the board. There is a separate 6- pin header (J23 on the left side of the board) that can be used to program the device. The PD0/PD1 pins (ATmega UART TX and RX) are brought out to pins placed adjacent to the Raspberry Pi UART pins so you only need to place two jumpers to connect the two devices. Note that the ATmega device on the Gertboard operates at 3.3Volts. That is in contrast to the ‘Arduino’ system which runs at 5V. It is also the reason why the device does not have a 16MHz clock. In fact at 3V3 the maximum operating frequency according to the specification is just under 12MHz. Warning: many of the Arduino example sketches (programs) mention +5V as part of the circuit. Because we are running at 3.3V, you must use 3.3V instead of 5V wherever the latter is mentioned. If you use 5V you risk damaging the chip. The ATmega device is in the schematics on page A-6. 30 Programming the ATmega Programming the ATmega microcontroller is straightforward once you have all the infrastructure set up, but it requires a fair bit of software to be installed on your Raspberry Pi. We are immensely grateful to Gordon Henderson, of Drogon Systems, for working out what needed to be done and providing the customized software. Using his system, you can use the Arduino IDE (Integrated Development Environment) on the Raspberry Pi to develop and upload code for the ATmega chip on the Gertboard. The Atmel chips most commonly used on the Gertboard are the ATmega168 and ATmega328, so Gordon assumes you have one of these. To use Gordon’s system, first you need to install the Arduino IDE. Then you download a custom version of avrdude, which allows you to program the AVR microcontroller using the SPI bus. (GPIO pins GPIO7 through GPIO11 can be used as a SPI bus.) Then you have to edit various configuration files to fully integrate the Gertboard into the Arduino IDE. Finally, you have to program the ‘fuses’ on the ATmega chip. Happily, Gordon has written some scripts to do all this for you. Full instructions, scripts, and the modified avrdude are available at: https://projects.drogon.net/raspberry-pi/gertboard/ We assume now that you have downloaded and successfully installed and configured the Arduino IDE, as described above, and we proceed from there. To get going with the ATmega chip, start up the Arduino IDE. This should be easy: if the installation of the Arduino package was successful, you will have a new item “Arduino IDE” in your start menu, under “Electronics”. The exact version of the IDE you get with depends on the operating system you are using. The version number is given in the title bar. The Debian squeeze package is version 0018, while the wheezy package is 1.0.1. First you will need to configure the IDE to work with the Gertboard. Go to the Tools > Board menu and choose the Gertboard option with the chip you are using (ATmega168 or ATmega328). For IDE version 1.0.1, you will also have go to the Tools > Programmer menu and choose “Raspberry Pi GPIO”. Arduino pins on the Gertboard All the input and output pins of the ATmega chip are brought out to header J25 on the left edge of the board. They are labelled PCn, PDn, and PBn, where n is a number. These labels correspond to the pinout diagrams of the ATmega168/328 chips. However, in the Arduino world, the pins of the chips are not referred to directly. Instead there is an abstract notion of digital and analogue pin numbers, which is independent of the physical devices. This allows code written for one Arduino board to be easily used with another Arduino board, which may have a chip with a different pinout. Thus, in order to use your Gertboard with the Arduino IDE, you need to know how the Arduino pin number relates to the labels on your Gertboard. The table below shows this correspondence (“GB” means Gertboard). 31 Arduino Pin GB pin Arduino Pin GB pin Arduino Pin GB pin digital 0 PD0 digital 7 PD7 analogue 0, A0 PC0 digital 1 PD1 digital 8 PB0 analogue 1, A1 PC1 digital 2 PD2 digital 9 PB1 analogue 2, A2 PC2 digital 3 PD3 digital 10 PB2 analogue 3, A3 PC3 digital 4 PD4 digital 11 PB3 analogue 4, A4 PC4 digital 5 PD5 digital 12 PB4 analogue 5, A5 PC5 digital 6 PD6 digital 13 PB5 Table 4: The relationship between pins on Arduino and pins on the Gertboard. In both versions of the Arduino IDE, digital pins are referred to in the code with just a number. For example digitalWrite(13, HIGH); will set pin 13 (PB5 on the Gertboard) to logical 1. (In the Arduino world, LOW refers to logical 0, and HIGH refers to logical 1.) The analogue pins are handled slightly differently. In version 0018, analogue pins are referred to simply by number, so whether 0 refers to PD0 (a digital pin) or PC0 (an analogue pin) depends on the context. The command value = digitalRead(0); will cause a read from digital 0 (PD0), and value will be assigned LOW or HIGH, while the command value = analogRead(0); will cause a read from analogue 0 (PC0), and value will be assigned a number between 0 and 1023, as the A/D converters in the ATmega chip return 10 bit values. In version 1.0.1, however, although numbers 0 through 5 still work to specify analogue pins, they are referred to in the examples as A0 to A5, and this seems to be the preferred style now. So to read from analogue pin 0 you would use the command value = analogRead(A0); A few sketches to get you going A good first sketch to try is Blink, which makes an LED turn on and off. With version 0018 of the IDE it’s in the File > Examples > Digital menu; in 1.0.1 it’s in the File > Examples > Basics menu. When you select this, a new window pops up with the Blink code. There are only two functions in the code, setup and loop. These are required for all Arduino programs: setup is executed once at the very beginning, and loop is called repeatedly, as long as the chip has power. Note that you do not need to provide any code to call these functions. 32 The modified avrdude that you downloaded uses the SPI bus to upload the code to the ATmega chip, so you need to connect the GPIO pins used for the SPI bus to the 6-pin header J23, as in the diagram below. Here you are simply connecting the SPI pins in the GPIO to the corresponding SPI pins in the header. The arrangement of the pins in J23 is shown in the schematics, on page A-6. Fig. 23: The wiring diagram for downloading sketches to the ATmega microprocessor. To upload your sketch to the chip in Arduino IDE version 0018, either choose File > Upload to I/O Board option, or click the icon with the right-pointing arrow and the array of dots. With version 1.0.1 choose File > Upload Using Programmer. It will take a bit of time to compile and upload, and then your sketch is running. But nothing is happening! On most Arduino boards, pin 13 (the digital pin used by this sketch) has an LED attached to it, but not the Gertboard. You have to wire up the LED yourself. Looking at the table above, we see that digital pin 13 is labelled PB5 on the Gertboard, so you need to connect PB5 to one of the I/O ports. Looking back to the port diagram on page Error! Bookmark not defined., we need to connect it to the point labelled ‘I/O’ on that diagram. Recall that the pins corresponding to these points are BUF1 to BUF12 in the (unlabeled) single row header at the top of the Gertboard. So if you connect PB5 to BUF1, as below, the first LED will start to blink. 33 Fig. 24: Wiring diagram for the sketch Blink. Note that in this diagram we have not shown the connections to the SPI pins. Once you have uploaded the code, you no longer need them and can remove the straps. On the other hand, if you want you can leave them in place, and this is a good idea if you are planning on uploading some other sketches later. Let’s look at another fairly simple sketch called Button, located under File > Examples > Digital menu in both 0018 and 1.0.1. The comments at the beginning of the sketch read The circuit: * LED attached from pin 13 to ground * pushbutton attached to pin 2 from +5V * 10K resistor attached to pin 2 from ground Assuming that you have Blink working, your LED is already wired up, but what about the button? As mentioned above, since the ATmega chip on the Gertboard runs at 3.3V, we must replace the 5V with 3.3V. So they suggest using a circuit like the one below, where the value read at pin 2 is logical 0 if the button is not pressed (due to the 10K pull-down resistor) and logical 1 if the button is pressed. Fig. 25: Suggested switch circuit for use with Button sketch. However, the buttons on the Gertboard are used like this: 34 Fig. 26: Circuit actually in use on the Gertboard, showing an additional 1k resistor to protect the input to BCM2835. The 1K resistor between the pushbutton and the ‘Raspi’ point is to protect the BCM2835 (the processor on the Raspberry Pi) if you accidentally set the GPIO pin connected to ‘Raspi’ to output instead of input. The circuit to the right of the ‘Raspi’ point happens on the Raspberry Pi: to use the push button we set a pull-up (shown as a resistor in the circuit above) on the pin so that the value read is logical 1 when the button is not pressed (see page 16). The Gertboard buttons are connected directly to ground so they cannot be made to read logic 1 when pressed. If you are want to use a Gertboard button with an Arduino sketch that assumes that the button reads 1 when pressed, the best approach is to modify the sketch, if needed, so that it will invert the value it reads from the button. For the pull-up, we can take advantage of the pull-ups in the ATmega chip. To do this, find the lines below in the sketch // initialize the pushbutton pin as an input: pinMode(buttonPin, INPUT); and insert the following two lines after them: // set pullup on pushbutton pin digitalWrite(buttonPin, HIGH); To invert the value read from the button, find the line below: buttonSate = digitalRead(buttonPin); and insert a ! (the negation operator in C) as follows: buttonSate = !digitalRead(buttonPin); Now upload this modified sketch, as described for Blink. We still need to attach Arduino digial pin 2 (PD2 on the Gertboard, as you can see from the table) to a button, say button 3.The ‘Raspi’ pin in the circuit diagram above, which is where we want to read the value, is in the J3 header. 35 Fig. 27: Wiring diagram showing the additional strap necessary for button operation for the sketch Button. When you have done this, the first LED will be on when the third button is pressed, and off when the third button is up. Now let’s try using an analogue pin. Find the AnalogInput sketch under File > Examples > Analog (in both versions 0018 and 1.0.1). This reads in a value from analogue input 0 (which has already been converted by the internal A/D to a value between 0 and 1023), then uses that number as a delay between turning an LED on and off. Thus, the lower the voltage on the analogue pin, the faster the LED flashes. To run this example, you’ll need a potentiometer. The one used to test the A/D will work fine here. The comments for AnalogInput say to connect the potentiometer so that the wiper is on analogue pin 0 (PC0 on the Gertboard) and the outer pins are connected to +5V and ground. As above, you must use 3.3V instead of 5V as we’re running the chip at 3.3V here. The diagram below shows how to connect up the Gertboard to make this sketch work after it is uploaded. 36 Fig. 28: Wiring diagram for the AnalogInput sketch. Minicom Some of the Arduino sketches involve reading or writing data via the serial port, or UART. An example is AnalogInSerial under File > Examples > Analog for version 0018. In version 1.0.1, this same example has been renamed AnalogReadSerial and is under File > Examples > Basics. This sketch sets the baud rate to 9600, then repeatedly reads in a value from analogue pin 0 and prints this value to the serial port (also called UART). The value read in is between 0 and 1023; 0 means that the input pin is at 0V and 1023 means that it is at the supply voltage (3.3V for the Gertboard). To set up your Gertboard for this sketch, you need the potentiometer attached to analogue input 0 as described above. In addition you need to connect the ATmega chip’s UART pins to the Raspberry Pi. Digital pin 0 (PD0 on the Gertboard) is RX (receive), and digital pin 1 (PD1 on the Gertboard) is TX (transmit). These signals are also brought out to the pins labelled MCTX and MCRX just above the GP15 and GP14 pins in header J2 on the Gertboard. Thus you can use two jumpers to attach the ATmega’s TX to GP15 and RX to GP14, as shown below. 37 Fig. 29: Wiring diagram for the sketch AnalogInSerial/AnalogReadSerial. GPIO14 and GPIO15 are the pins that the Raspberry Pi uses for the UART serial port. If you refer back to the table of alternate functions on page 9, you will see that GPIO14 is listed as TX and GPIO15 as RX. This is not a mistake! This swapping is necessary: the data that is transmitted by the ATmega is received by the Raspberry Pi, and vice versa. Now, how to we get the Raspberry Pi to read and show us the data that the ATmega is sending out on the serial port? There is a button labelled Serial Monitor on the toolbar of the Arduino IDE, but it doesn’t work on the Raspberry Pi. It assumes that you are talking to an Arduino board over USB, not talking to a Gertboard over GPIO. The easiest way to retrieve this data is to use the minicom program. You can install this easily by typing into a terminal this command: sudo apt-get install minicom You can use menus to configure minicom (by typing minicom –s). Alternatively, included with the Gertboard software is a file minirc.ama0 with the settings you need to read from the GPIO UART pins at 9600 baud. Copy this file (which was provided by Gordon Henderson) to /etc/minicom/ (you’ll probably need to sudo this) and invoke minicom by typing sudo minicom ama0 Now if you upload the sketch to the ATmega chip, you should see the value from the potentiometer displayed in your minicom monitor. These examples have only just scratched the surface of the wonderful world of Arduino. Check out http://arduino.cc/en/Tutorial/HomePage for much, much more. 38 Combined Tests This section shows some examples of using more than one building block at a time. A/D and motor controller In the potmot (for potentiometer-motor) test we use a potentiometer (“pot”) connected to the analogue to digital converter (A/D) to get an input value, and this value is used to control the speed and direction of the motor. It is set up so that at one extreme, the motor is going at top speed, and as you move the wiper towards the middle it slows, at the middle the motor stops, and as you continue to move the wiper along, the motor speeds up again but in the other direction. The main routine for this is in potmot.c. Functions from gb_spi.c and gb_pwm.c are used to control the SPI bus (for reading the A/D) and the pulse width modulator (for controlling the speed of the motor). To wire up the Gertboard for this example, you combine the wiring for the A/D and motor tests. Jumpers connect GP8 to GP11 to the pins directly above them to allow us to control the SPI bus using GPIO8 to GPIO11. You must attach your potentiometer to the AD0 input. GPIO17 controls the motor B input and GPIO18 controls the motor A input using the pulse width modulator (PWM). Thus GP17 must be connected via a strap to MOTB, and GP18 must be connected to MOTA. The motor and its power source must be connected to the screw terminals in J19 at the top of the board. See the wiring diagram below. Fig. 30: Wiring diagram for the combined potmot test. + - your power source goes here M 1 2 3 39 In the main routine for potmot, first we print to the terminal the connections that need to be made on the Gertboard to run this example, then we call setup_io to set up the GPIO ready for use. Then we call setup_gpio to set the GPIO pins the way we want them. In this, we set up GPIO8 to GPIO11 to use the SPI bus using INP_GPIO and SET_GPIO_ALT as described in the section on A/D and D/A converters (page 27). GPIO17 is set up as an output (using INP_GPIO and OUT_GPIO), and GPIO18 is set up as a PWM using as INP_GPIO and SET_GPIO_ALT as described in the section on the motor controller (page 24). Back in main, we call setup_spi and setup_pwm to get the SPI bus and PWM ready for use and get the motor ready to go. Then we repeatedly read the A/D and set the direction and speed of the motor depending on the value we read. Lower A/D values (up to 511 – recall that the A/D chip used returns a 10 bit value so the maximum will be 1023) result in the motor B input being set high, and thus the motor goes in the “rotate one way” as in the motor controller table on page 22. Confusingly, this motor direction is called “backwards” in the comments of the program! Higher A/D values (512 to 1023) result in the motor B input being set low, and the motor goes in the “rotate opposite way” direction. This is called “forwards” in the comments of the program. Simple arithmetic is used to translate A/D values near 511 to slow motor speeds and A/D values near the endpoints of the range (0 and 1023) to fast motor speeds by varying the value sent to the PWM. Decoder The decoder implemented by the decoder program takes the three pushbuttons as input and turns on one of 8 LEDs to indicate the number with the binary encoding given by the state of the buttons. Switch S1 gives the most significant bit of the number, S2 the middle bit, and S3 the least significant bit. For output, the LED D5 represents the number 0, D6 represents 1, and so on, so D12 represents 7. Recall that the pushbuttons are high (1) when up and low (0) when pushed, so LED D12 is lit up when no buttons are pressed (giving binary 111 or 7), D6 is lit up when S1 and S2 are pressed (giving binary 001), etc. There is quite a bit of wiring for this one, as we are using all but one of the I/O ports.GPIO25 to GPIO23 are reading the pushbuttons, so you need to connect GP25 to B1, GP24 to B2, and GP23 to B3. The 8 lowest-numbered GPIO pins are used with I/O ports 5 to 12, so you need to connect GP11 to B5, GP10 to B6, GP9 to B7, GP8 to B8, GP7 to B9, GP4 to B10, GP1to B11, and GP0 to B12. In addition, since we are using I/O ports 5 to 12 for output, you need to install all the out jumpers for buffer chips U4 and U5 (recall that the out jumpers are those above the chips). 40 Fig. 31: Wiring diagram for the decoder test. In the main routine for decoder, as always we start out by printing out to the terminal the connections that need to be made on the Gertboard. Then we call setup_io to set up the GPIO ready for use. Then we call setup_gpio to set GPIO25 to 23 for use with the pushbuttons (by selecting them for input and enabling a pull-up, as described on page 16) and to set GPIO11 to GP7, GPIO4, GPIO1, and GPIO0 up as outputs (as described on page 11). Then we enter a loop where we read the state of the pushbuttons and light up the LED corresponding to this number (after turning off the LED previously set). We turn the LEDs on and off using GPIO_SET0 and GPIO_CLR0 as described on page 17. For More Information For further information, the datasheet for the processor can be found here: http://www.raspberrypi.org/wp-content/uploads/2012/02/BCM2835-ARM-Peripherals.pdf Appendix A: Schematics We have included the schematics for the Gertboard in the pages that follow. They are numbered A-1, A-2, etc. The page number is located in the lower left hand of each page. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A in gnd out Front 1 2 3 TO220 Not used. Do not install! Do not use LDxxx series. They have a different pin-out! GPIO9 GPIO22 GPIO21 GPIO1 GPIO11 GPIO17 GPIO4 GPIO10 GPIO14 GPIO15 GPIO18 GPIO23 GPIO24 GPIO25 GPIO8 GPIO7 GPIO0 GPIO0 GPIO1 GPIO4 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO14 GPIO15 GPIO17 GPIO18 GPIO21 GPIO22 GPIO23 GPIO24 GPIO25 3V3_RASP 5V_RASP 3V3_RASP 3V3 5V_RASP 3V3 3V3 MOTOR_A MOTOR_B BUF_1 BUF_2 BUF_4 BUF_3 BUF_6 BUF_7 BUF_8 BUF_5 RELAY_1 RELAY_2 RELAY_3 RELAY_4 BUF_9 BUF_12 BUF_10 BUF_11 RELAY_5 RELAY_6 SCLK MOSI MISO CSnA CSnB MC_TX MC_RX Title Size Document Number Rev Date: Sheet of - 3 Gertboard A4 1 6 R1 10K-0805 J4 CON6 1 2 3 4 5 6 J2 CON17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 D20 ~1.5A MH1 HOLE_M3 J5 CON2 1 2 C6 100nF-0805 MH2 HOLE_M3 C3 100nF-0805 R2 10K-0805 U2 REG78xx In 1 Gnd 2 Out 3 J64 CON2 1 2 J11 HEADER 5 1 2 3 4 5 J3 CON12 1 2 3 4 5 6 7 8 9 10 11 12 U1 REG3v3 In 1 Gnd 2 Out 3 C2 100nF-0805 + C5 10uF-1206 J7 CON3 1 2 3 MH4 HOLE_M3 J9 CON3 1 2 3 J1 CON26A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 + C1 10uF-1206 + C4 100uF-CX02-C MH3 HOLE_M3 C7 100nF-0805 J8 CON3 1 2 3 J24 CON2 1 2 A-1 5 5 4 4 3 3 2 2 1 1 D D C C B B A A BUF1 BUF2 BUF6 BUF5 BUF10 BUF9 BUF3 BUF4 BUF8 BUF11 BUF12 BUF2 BUF12 BUF1 BUF6 BUF5 BUF11 BUF7 BUF4 BUF9 BUF3 BUF8 BUF10 BUF7 3V3 3V3 3V3 3V3 BUF_1 BUF_3 BUF_4 BUF_8 BUF_5 BUF_6 BUF_7 BUF_12 BUF_9 BUF_10 BUF_11 BUF_2 BUF_3 BUF_2 BUF_1 Title Size Document Number Rev Date: Sheet of - 3 Gertboard A4 2 6 P4 CON2 1 2 P11 CON2 1 2 U4 74xx244 20 1 19 2 4 6 8 18 14 16 12 9 7 5 3 10 11 13 15 17 RN7B 1k 4 3 P23 CON2 1 2 RN5B 1k-10k 4 3 P1 CON2 1 2 D10 LED P12 CON2 1 2 P3 CON2 1 2 D12 LED D6 LED D8 LED S3 Switch 1 2 3 4 S1 Switch 1 2 3 4 P8 CON2 1 2 RN2 1K_RESN4X1 1 2 3 4 5 D1 LED RN4C 1k-10k 6 5 P13 CON2 1 2 D9 LED RN7A 1k 2 1 C9 100n-0805 RN5A 1k-10k 2 1 D5 LED P17 CON2 1 2 P18 CON2 1 2 P15 CON2 1 2 P6 CON2 1 2 P14 CON2 1 2 P24 CON2 1 2 RN5C 1k-10k 6 5 S2 Switch 1 2 3 4 D11 LED RN7D 1k 8 7 D7 LED P2 CON2 1 2 P5 CON2 1 2 RN3 1K_RESN4x1 1 2 3 4 5 RN6D 1k-10k 8 7 RN6B 1k-10k 4 3 P20 CON2 1 2 C10 100n-0805 P9 CON2 1 2 P19 CON2 1 2 RN4A 1k-10k 2 1 D3 LED RN4D 1k-10k 8 7 J10 CON24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 P10 24 CON2 1 2 RN6A 1k-10k 2 1 U3 74xx244 20 1 19 2 4 6 8 18 14 16 12 9 7 5 3 10 11 13 15 17 D4 LED RN1 1K_RESN4X1 1 2 3 4 5 C8 100n-0805 RN5D 1k-10k 8 7 RN4B 1k-10k 4 3 P7 CON2 1 2 RN6C 1k-10k 6 5 U5 74xx244 20 1 19 2 4 6 8 18 14 16 12 9 7 5 3 10 11 13 15 17 D2 LED P21 CON2 1 2 P22 CON2 1 2 P16 CON2 1 2 RN7C 1k 6 5 A-2 5 5 4 4 3 3 2 2 1 1 D D C C B B A A RELAY_PWR RELAY_6 RELAY_4 RELAY_2 RELAY_1 RELAY_5 RELAY_3 Title Size Document Number Rev Date: Sheet of - 3 Gertboard A4 3 6 J16 CON2 1 2 J13 CON2 1 2 8x U12 ULN2803A I1 1 I2 2 I3 3 I4 4 I5 5 I6 6 I7 7 I8 8 GND 9 Q1 18 Q2 17 Q3 16 Q4 15 Q5 14 Q6 13 Q7 12 Q8 11 COM 10 J12 CON2 1 2 J15 CON2 1 2 J17 CON2 1 2 J14 CON2 1 2 J6 CON2 1 2 A-3 5 5 4 4 3 3 2 2 1 1 D D C C B B A A motor power nets named to make high current MB MP MPC MA MGND 3V3 MOTOR_A MOTOR_B Title Size Document Number Rev Date: Sheet of - 3 Gertboard A4 4 6 C13 22n-0805 J20 CON2 1 2 F1 4A C11 100n-0805 R23 0.1-2512 C12 22n-0805 J19 CON4 1 2 3 4 U7 L6203-MW VREF 9 ENB 11 IN1 5 IN2 7 BOOT1 4 BOOT2 8 OUT1 3 OUT2 1 VSS 2 GND 6 Sense 10 A-4 5 5 4 4 3 3 2 2 1 1 D D C C B B A A Patch area 3V3 3V3 3V3 of - 3 Gertboard A4 5 6 Title Size Document Number Rev Date: Sheet J37 CON2-DNF 1 2 J68 CON3-DNF 1 2 3 J42 CON2-DNF 1 2 J51 CON2-DNF 1 2 J70 CON2-DNF 1 2 J30 CON2-DNF 1 2 J36 CON2-DNF 1 2 J48 CON2-DNF 1 2 J50 CON2-DNF 1 2 J35 CON2-DNF 1 2 J55 CON3-DNF 1 2 3 J43 CON2-DNF 1 2 J32 CON2-DNF 1 2 J60 CON2-DNF 1 2 J62 CON3-DNF 1 2 3 J53 CON2-DNF 1 2 J69 CON3-DNF 1 2 3 J40 CON2-DNF 1 2 J56 CON3-DNF 1 2 3 J57 CON3-DNF 1 2 3 J38 CON2-DNF 1 2 J54 CON2-DNF 1 2 J26 CON2-DNF 1 2 J34 CON2-DNF 1 2 J47 CON2-DNF 1 2 J66 CON3-DNF 1 2 3 J67 CON3-DNF 1 2 3 J45 CON2-DNF 1 2 J41 CON2-DNF 1 2 J59 CON3-DNF 1 2 3 J39 CON2-DNF 1 2 J44 CON2-DNF 1 2 J49 CON2-DNF 1 2 J63 CON3-DNF 1 2 3 J52 CON2-DNF 1 2 J33 CON2-DNF 1 2 J46 CON2-DNF 1 2 J58 CON3-DNF 1 2 3 J27 CON2-DNF 1 2 J65 CON3-DNF 1 2 3 J31 CON2-DNF 1 2 J61 CON2-DNF 1 2 A-5 5 5 4 4 3 3 2 2 1 1 D D C C B B A A AD0 XTAL_IN DA0 DA1 AD1 XTAL_IN PD0 PD1 PD2 PD3 PD4 PC4 PC5 PB1 PB0 PC0 PC1 PC2 RC3 PD6 PD5 PD7 PC6/DBG/RESETn PC1 PC4 PC5 PC0 PC2 RC3 PD0 PD5 PD3 PD6 PD2 PD7 PD4 PD1 PB1 PB0 PC6/DBG/RESETn PD0 PD1 MC_SCK MC_MISO MC_MOSI MC_MOSI PB2 PB2 MC_MOSI MC_MISO MC_SCK MC_SCK MC_MISO 3V3 3V3 3V3 3V3 MISO MOSI MOSI SCLK SCLK MC_RX MC_TX CSnA CSnB Title Size Document Number Rev Date: Sheet of - 3 Gertboard A4 6 6 R4 0_0805 U8 ATmega328P PC6/Reset_n 1 PD0/RXD 2 PD1/TXD 3 PD2/INT0 4 PD4/XCK/T0 6 VCC 7 PB6/XTAL1 9 GND 8 PB7/XTAL2 10 PD5/OC0B/T1 11 PD6/OC0A/AIN0 12 PD7/AIN1 13 PB0/CLK0/ICP1 14 GND 22 AVCC 20 AREF 21 OC1A/PB1 SS_n/OC1B/PB2 15 MOSI/OC2A/PB3 16 MISO/OC2A/PB4 17 SCK/PB5 18 19 ADC0/PC0 ADC1/PC1 23 ADC2/PC2 24 ADC3/PC3 25 ADC4/SDA/PC4 26 ADC5/SCL/PC5 27 28 PD3/INT1/OC2B 5 J25 CONN PCB 20x2 2 4 6 8 10 12 14 16 18 20 24 22 26 28 30 32 34 36 38 40 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 D19 1N4001 J29 CON4A 1 3 2 4 U10 MCP4802 VDD 1 CSn 2 SCK 3 SDI 4 LDACn 5 VOUTB 6 VOUTA 8 VSS 7 J71 HEADER 1 1 J28 CON4A 1 3 2 4 C15 100nF-0805 U6 MCP3002 VDD 8 VSS 4 CH0 2 CH1 3 CSn/SHDN 1 CLK 7 DOUT 6 DIN 5 R24 0_0805 C17 100nF-0805 X1 Cer resonator 1 2 3 C19 100nF-0805 C20 100nF-0805 R34 10K-0805 J23 HEADER 3X2 2 4 6 1 3 5 C16 xxF-1206 A-6 User's Guide SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial This user's guide describes the characteristics, operation, and use of the TMP006EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects of the program operation. Throughout this document, the terms evaluation board, evaluation module, and EVM are synonymous with the TMP006EVM. This document also includes an electrical schematic, printed circuit board (PCB) layout drawings, and a parts list for the EVM. Contents 1 Overview ..................................................................................................................... 2 2 TMP006EVM Hardware Setup ............................................................................................ 3 3 TMP006EVM Hardware Overview ........................................................................................ 7 4 TMP006EVM Software Overview ......................................................................................... 8 5 TMP006EVM Software Use .............................................................................................. 11 List of Figures 1 Hardware Included with TMP006EVM Kit ............................................................................... 2 2 TMP006EVM Hardware Setup ............................................................................................ 3 3 TMP006EVM Board Block Diagram ...................................................................................... 4 4 TMP006 Test Board Schematic........................................................................................... 5 5 Typical Hardware Connection ............................................................................................. 7 6 Typical PC Behavior After Connecting TMP006EVM .................................................................. 8 7 TMP006EVM Software Installation Files................................................................................. 8 8 TMP006EVM Software Installation Launch.............................................................................. 9 9 TMP006EVM GUI Software Installation Prompts....................................................................... 9 10 TMP006EVM GUI Software Default Configuration.................................................................... 10 11 Hardware Error Message................................................................................................. 11 12 Read All Registers to Update Temperature............................................................................ 12 13 Make Changes to TMP006 Registers .................................................................................. 13 14 Write Changes to TMP006 Registers................................................................................... 14 15 TMP006EVM GUI Software Registers Tab ............................................................................ 15 16 Read Registers Continuously to Update Graphs...................................................................... 16 17 Enable Transient Correction Algorithm ................................................................................. 17 18 Start Data Logging ........................................................................................................ 18 19 Example .CSV Output File (Formatted and Displayed in Microsoft Excel®) ....................................... 19 List of Tables 1 TMP006EVM Kit Contents................................................................................................. 2 2 TMP006 Test Board Parts List ........................................................................................... 6 3 Signal Definitions for H1 (10-Pin Female Socket) on TMP006EVM Board ......................................... 6 4 Signal Definition for H2 (10-Pin FFC Connector) on TMP006EVM Board .......................................... 7 Excel, Microsoft, Windows are registered trademarks of Microsoft Corporation. SPI is a trademark of Motorola Inc. I2C is a trademark of NXP Semiconductors. All other trademarks are the property of their respective owners. SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 1 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Overview www.ti.com 1 Overview The TMP006 is an infrared thermopile sensor with digital output integrated circuit. This device measures the temperature of an object without making contact, making it ideal for many types of applications. The TMP006EVM is a platform for evaluating the performance of the TMP006 under various conditions. The TMP006EVM consists of two PCBs. One board, the SM-USB-DIG, communicates with the user’s computer, provides power, and sends and receives appropriate digital signals to communicate with the TMP006. The second PCB, the TMP006_Test_Board, contains the TMP006 as well as support and configuration circuitry. This document gives a general overview of the TMP006EVM, and provides a general description of the features and functions to be considered while using this evaluation module. 1.1 TMP006EVM Kit Contents Table 1 summarizes the contents of the TMP006EVM kit. Figure 1 shows all of the included hardware. Contact the Texas Instruments Product Information Center nearest you if any component is missing. It is highly recommended that you also check the TMP006 product folder on the TI web site at www.ti.com to verify that you have the latest versions of the related software. Table 1. TMP006EVM Kit Contents Item Quantity TMP006_Test_Board 1 SM-USB-DIG Board 1 USB Cable 1 CR-ROM with TMP006EVM GUI Software (not shown) 1 Figure 1. Hardware Included with TMP006EVM Kit 2 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Hardware Setup 1.2 Related Documentation from Texas Instruments The following documents provide information regarding Texas Instruments' integrated circuits used in the assembly of the TMP006EVM. This user's guide is available from the TI web site under literature number SBOU109A. Any letter appended to the literature number corresponds to the document revision that is current at the time of the writing of this document. Newer revisions may be available from the TI web site, or call the Texas Instruments' Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the document by both title and literature number. Related Documentation Document Literature Number TMP006 Product Data Sheet SBOS518 SM-USB-DIG_Platform User Guide SBOU0958 TMP006 Layout and Assembly SBOU108 Guidelines 2 TMP006EVM Hardware Setup Figure 2 shows the system setup for the TMP006EVM. The PC runs graphical user interface (GUI) software that communicates with the SM-USB-DIG over a USB connection. The SM-USB-DIG translates the USB commands from the PC into power, I2C™, SPI™, and general-purpose input/output (GPIO) commands for the TMP006_Test_Board. The TMP006EVM does not require any additional components to operate. Figure 2. TMP006EVM Hardware Setup SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 3 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006 V Supply (Switched +3.3-V Power) DUT I C Interface 2 Serial Interface (SPI) 10-Pin Female SM-USB-DIG Connector DRDY LED Circuitry 10-Pin FFC Cable Connector TMP006EVM Hardware Setup www.ti.com 2.1 Theory of Operation for the TMP006 Test Board A block diagram of the TMP006 test board hardware setup is shown in Figure 3. The TMP006 Test Board contains connections for the power, I2C, SPI, and GPIO signals from the SM-USB-DIG. It also has a connector that allows other boards to be connected to the TMP006 Test Board to assist with calibrating the TMP006. Figure 3. TMP006EVM Board Block Diagram 4 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Hardware Setup Figure 4 shows the complete schematic of the TMP006 Test Board. The ferrite bead and input capacitor, FB1 and C1 respectively, filter the power coming into the TMP006 test board from the SM-USB-DIG. The I2C pull-up resistors, R3 and R4, and the DRDY pull-up, R5, are required for the open-drain outputs to operate correctly. The Q1 and R6 components drive the LED (D1) so current is not provided from the TMP006 that would cause the device to self-heat. Power, I2C, and SPI signals are provided to the calibration header, H2, for use with the TMP006 calibration tools. Figure 4. TMP006 Test Board Schematic SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 5 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Hardware Setup www.ti.com 2.2 Bill of Materials for the TMP006 Test Board Table 2 lists the bill of materials for the TMP006EVM board. Table 2. TMP006 Test Board Parts List Qty RefDes Value Description Part Number MFR 1 C1 1μF Capacitor, Ceramic 1.0μF 16V X7R 10% 0603 C1608X7R1C105K TDK 1 C2 0.01μF Capacitor, Ceramic 10000pF 25V X7R 10% 0402 C1005X7R1E103K TDK 1 D1 LED Alingap Grn Wht Diff 0603SMD SML-LX0603SUGW- Lumex TR 1 FB1 Ferrite Bead 300Ω .2A 0402 74279272 Wurth 1 H1 Connector, Socket 50-Pl .050 R/A Sngl 851-43-050-20- Mill-Max 001000 1 H2 Connector, FPC/FFC 10-Pos .5mm Horz SMD FH12-10S-0.5SH(55) Hirose 1 Q1 MOSFET P-CH 50V 130mA SC70-3 BSS84W-7-F Diodes Inc 2 R1, R2 0Ω Resistor, 0.0Ω 1/16W 0402 SMD MCR01MZPJ000 Rohm 3 R3, R4, R5 47k Resistor, 47.0kΩ 1/16W 1% 0402 SMD MCR01MZPF4702 Rohm 1 R6 160Ω Resistor, 160Ω 1/16W 1% 0402 SMD MCR01MZPF1600 Rohm 1 U1 Infrared Sensor with Digital Interface TMP006 Texas Instruments 2.3 Signal Definition of H1 (10-Pin Female Socket) Table 3 identifies the signals connected to the H1 connector on the TMP006 Test Board. This summary also identifies the signals that are used with the TMP006EVM along with the respective signal names. Table 3. Signal Definitions for H1 (10-Pin Female Socket) on TMP006EVM Board Used on the TMP006 Test Board Pin No. Signal TMP006EVM? Signal 1 I2C_SCL Yes SCL 2 CTRL/MEAS4 Yes DRDY 3 I2C_SDA1 Yes SDA 4 CTRL/MEAS5 No — 5 SPI_DOUT1 Yes SDO 6 VDUT Yes VCC 7 SPI_CLK Yes SCLK 8 GND Yes GND 9 SPI_CS1 Yes CS 10 SPI_DIN1 Yes SDI 6 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Hardware Overview 2.4 Signal Definition of H2 (10-Pin FFC Connector) Table 4 shows the signals connected to the H2 connector on the TMP006 Test Board. Table 4. Signal Definition for H2 (10-Pin FFC Connector) on TMP006EVM Board Pin No. Signal 1 SCL 2 VCC 3 SDA 4 VCC 5 SDO 6 GND 7 SCLK 8 GND 9 CS 10 SDI 3 TMP006EVM Hardware Overview If not already assembled, the basic hardware setup for the TMP006EVM involves connecting the TMP006 Test Board to the SM-USB-DIG and then connecting the USB cable. This section presents the details of this procedure. 3.1 Electrostatic Discharge Warning CAUTION Many of the components on the TMP006EVM are susceptible to damage by electrostatic discharge (ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling the EVM, including the use of a grounded wrist strap at an approved ESD workstation. 3.2 Typical TMP006EVM Hardware Setup Connect the right-angle female socket (H1) on the TMP006 Test Board to the right-angle male header (H2) on the SM-USB-DIG. Take special care to ensure that the two 10-pin sockets directly align with each other. Plug the female USB-A cable to the SM-USB-DIG and then plug the male USB-A cable into the computer. Always connect the two boards together before connecting the USB cable to avoid any issues if the connectors are misaligned. Figure 5. Typical Hardware Connection SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 7 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Software Overview www.ti.com Figure 6 shows the typical behavior when the SM-USB-DIG is plugged into the USB port of a PC for the first time. Typically, the computer will respond with a Found New Hardware, USB Device pop-up dialog. The pop-up window then typically changes to Found New Hardware, USB Human Interface Device. This pop-up indicates that the device is ready to be used. The SM-USB-DIG uses the human interface device drivers that are part of the Microsoft® Windows® operating system. Figure 6. Typical PC Behavior After Connecting TMP006EVM In some cases, the Windows Add Hardware wizard appears. If this installation prompt occurs, allow the Device Manager to install the human interface drivers by clicking Yes at each request to install the drivers. 4 TMP006EVM Software Overview This section describes the installation and use of the TMP006EVM software. 4.1 Hardware Requirements The TMP006EVM software has been tested on the Microsoft Windows XP operating system (OS) with United States and European regional settings. The software should function correctly on other Windows-based OSs. 4.2 GUI Software Installation The TMP006EVM software is included on the CD that is shipped with the EVM kit. It is also available through the TMP006EVM product folder on the TI web site. To install the software to a computer, insert the disc into an available CD-ROM drive. Navigate to the drive contents and open the TMP006EVM software folder. Locate and launch the TMP006EVM installation file, setup.exe, as shown in Figure 7. It is in the Installer directory. Figure 7. TMP006EVM Software Installation Files 8 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Software Overview The TMP006EVM software installer file then begins the installation process as shown in Figure 8. Figure 8. TMP006EVM Software Installation Launch Follow the prompts as shown in Figure 9 to install the TMP006EVM GUI software. Figure 9. TMP006EVM GUI Software Installation Prompts The TMP006EVM GUI software is now installed. SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 9 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Software Overview www.ti.com 4.3 Launching the TMP006EVM GUI Software With the TMP006EVM properly connected (see Figure 5), launch the EVM GUI software from the Start menu. It is located in a folder titled, TMP006EVM GUI Installer. The software should launch with a screen similar to that shown in Figure 10. Figure 10. TMP006EVM GUI Software Default Configuration 10 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Software Use If the message shown in Figure 11 appears when the TMP006EVM GUI software is launched, disconnect all components of the TMP006EVM kit, and repeat the hardware assembly instructions in Section 3.2. Figure 11. Hardware Error Message 5 TMP006EVM Software Use This section discusses how to use the TMP006EVM software. The TMP006EVM GUI software has a primary window that is used to configure and read from the TMP006, along with two other windows that are used to access different features of the TMP006. Basic GUI functionality and a description of the tabs are also presented in this section. SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 11 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Software Use www.ti.com 5.1 Reading from the TMP006 On the primary GUI window (see Figure 10), press the Read All Reg button to read the TMP006 registers and begin collecting temperature measurement data. Figure 12 illustrates this action. Raw temperature and configuration register values can be found in the Registers tab (refer to Section 5.3). Figure 12. Read All Registers to Update Temperature 12 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Software Use 5.2 Writing to the TMP006 To modify the TMP006 configuration register, make any desired changes on the Block Diagram tab and then press the Write All Reg button, as shown in Figure 13. Figure 13. Make Changes to TMP006 Registers SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 13 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Software Use www.ti.com The Pending changes need to be written LED illuminates when there are changes that have not been written to the TMP006, as shown in Figure 14. Figure 14. Write Changes to TMP006 Registers 14 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Software Use 5.3 Registers Tab In this tab, you can select any row in the Register table by clicking on it with your mouse. When a row is selected, it becomes highlighted in blue in the table. The individual 16 bits in the selected register are displayed below the Register table. Note that each bit has descriptive text above the bit that identifies the function of the bit. You can edit the bit value using the up (↑) or down (↓) arrow to the left of the bit. Any changes on the bit are displayed in the table and in the block diagram. Additionally, any changes in the block diagram are reflected in the table. The Help w Reg button can be pressed to see detailed help about the register that is currently selected. This feature gives detailed information regarding the meaning of each bit. The Registers tab on the TMP006EVM GUI software is illustrated in Figure 15. Figure 15. TMP006EVM GUI Software Registers Tab SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 15 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Software Use www.ti.com 5.4 Graphing Tab The Graphing tab allows you to graph the temperature sensor results. To start the graphing process, you must press the Read Continuous button. After pressing this button, it turns green and the graph starts to update. Press the Read Continuous button again to turn off this function. Figure 16 shows this process. Figure 16. Read Registers Continuously to Update Graphs 16 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Software Use 5.5 Transient Correction Algorithm The accurate performance of the TMP006EVM is highly dependent on a stable local temperature. Degraded performance can be observed when local temperature transients are introduced into the system, because the infrared (IR) thermopile in the TMP006 is sensitive to conducted and radiated IR energy from below the sensor as well as radiated IR energy that comes from above the sensor. When the TMP006EVM experiences a local temperature transient event, the PCB temperature and the TMP006 die temperature drift apart from each other as a result of the thermal time constant of the TMP006 thermopile. This difference in temperatures causes a heat transfer between the IR sensor and the PCB to occur. Because of the small distance between the PCB and the bottom of the sensor, this heat energy is conducted (as opposed to radiated) through the thin layer of air between the IR sensor and the PCB below it. This conducted heat energy causes an offset in the IR sensor voltage reading, and ultimately leads to unwanted temperature calculation error. The additional error that results from local temperature transient events can be suppressed in the software by using a transient correction algorithm. This algorithm monitors the TMP006 die temperature over a four-second interval and uses the die temperature data to calculate a local temperature slope, as shown in Equation 1. TSLOPE = – (0.3 × TDIE1) – (0.1 × TDIE2) + (0.1 × TDIE3) + (0.3 × TDIE4) (1) The local temperature slope and the known thermal resistance and capacitance of the TMP006 thermopile are then applied to Equation 2 to correct the sensor voltage reading. VOBJ_CORRECTED = VOBJ + TSLOPE × 2.96 × 10–4 (2) The corrected sensor voltage value is then substituted for the raw sensor voltage, and the object temperature is calculated using the normal methods. To enable the transient correction algorithm, simply click the Transient Correction button in the TMP006EVM GUI as shown in Figure 17. When transient correction is first enabled, a delay of four conversions will be observed while the local temperature slope is being calculated. Figure 17. Enable Transient Correction Algorithm SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 17 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TMP006EVM Software Use www.ti.com 5.6 Logging Data from the TMP006EVM The TMP006EVM software has the ability to save data collected by the TMP006 into a comma-separated value (.CSV) format file. To save data in this format, select Save Temperature Data from the USB Controls drop-down menu. Figure 18 shows the steps required to begin logging temperature data with the TMP006EVM. Figure 18. Start Data Logging 18 TMP006EVM User Guide and Software Tutorial SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com TMP006EVM Software Use Figure 19 displays an example of how the output file can appear after minimal formatting by the user. Figure 19. Example .CSV Output File (Formatted and Displayed in Microsoft Excel®) SBOU109A–May 2011–Revised October 2011 TMP006EVM User Guide and Software Tutorial 19 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Revision History www.ti.com Revision History Changes from Original (May, 2011) to A Revision .......................................................................................................... Page • Updated document to reflect new software functionality ............................................................................ 1 • Revised Figure 2 for improved clarity .................................................................................................. 3 • Updated Figure 4 to reflect unpopulated connector H2 ............................................................................. 5 • Changed Figure 5 to reflect new SM-USB-DIG casing .............................................................................. 7 • Corrected typos and updated Figure 10 through Figure 16 to reflect new software functionality ............................. 8 • Added Transient Correction Algorithm section ...................................................................................... 17 • Updated Figure 18 to reflect new software functionality ........................................................................... 18 • Revised Figure 19 for improved clarity ............................................................................................... 19 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 20 Revision History SBOU109A–May 2011–Revised October 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Evaluation Board/Kit Important Notice Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. 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It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. EVM Warnings and Restrictions It is important to operate this EVM within the input voltage range of 2.7V (min) to 5.5V (max) and the output voltage range of 2.7V (min) to 5.5V (max). Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than +25°C. The EVM is designed to operate properly with certain components above +25°C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. 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DS51589A Explorer 16 Development Board User’s Guide DS51589A-page ii © 2005 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page iii Table of Contents Preface ........................................................................................................................... 1 Chapter 1. Introducing the Explorer 16 Development Board 1.1 Introduction ..................................................................................................... 7 1.2 Highlights ........................................................................................................ 7 1.3 What’s in the Kit ............................................................................................. 7 1.4 Explorer 16 Development Board Functionality and Features ......................... 8 1.5 Using the Explorer 16 Out of the Box ............................................................. 9 1.6 Explorer 16 Development Board Demonstration Programs ......................... 10 1.7 Reference Documents .................................................................................. 10 Chapter 2. Explorer 16 Programming Tutorial 2.1 Introduction ................................................................................................... 11 2.2 Highlights ...................................................................................................... 11 2.3 Tutorial Overview ......................................................................................... 11 2.4 Creating the Project ...................................................................................... 12 2.5 Building The Code ........................................................................................ 16 2.6 Programming the Device .............................................................................. 19 Chapter 3. Explorer 16 Tutorial Programs 3.1 Introduction ................................................................................................... 23 3.2 PIC24 Tutorial Program Operation ............................................................... 23 3.3 dsPIC33F Tutorial Program Operation ......................................................... 25 Chapter 4. Explorer 16 Development Hardware 4.1 Introduction .................................................................................................. 27 4.2 Hardware Features ....................................................................................... 27 Appendix A. Explorer 16 Development Board Schematics A.1 Introduction .................................................................................................. 33 A.2 Development Board Block Diagram ............................................................. 33 A.3 Development Board Schematics .................................................................. 34 Appendix B. Updating the USB Connectivity Firmware B.1 Introduction .................................................................................................. 43 B.2 Updating the PICkit 2 Microcontroller Programmer ..................................... 43 B.3 Other USB Firmware Updates ..................................................................... 44 Index ............................................................................................................................. 45 Worldwide Sales and Service .................................................................................... 46 Explorer 16 Development Board User’s Guide DS51589A-page iv © 2005 Microchip Technology Inc. NOTES: EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 1 Preface INTRODUCTION This chapter contains general information that will be useful to know before using the Explorer 16 Development Board. Items discussed in this chapter include: • Document Layout • Conventions Used in this Guide • Warranty Registration • Recommended Reading • The Microchip Web Site • Development Systems Customer Change Notification Service • Customer Support • Document Revision History DOCUMENT LAYOUT This document describes how to use the Explorer 16 Development Board as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1. “Introducing the Explorer 16 Development Board” provides a brief overview of the Explorer 16 Development Board, its features and its uses. • Chapter 2. “Explorer 16 Programming Tutorial” provides step-by-step instructions for using MBLAB® IDE to create a project and program the Explorer 16 board. • Chapter 3. “Explorer 16 Tutorial Programs” describes the demonstration program created in Chapter 2. “Explorer 16 Programming Tutorial”. • Chapter 4. “Explorer 16 Development Hardware” provides a more detailed description of the Explorer 16 board’s hardware features. • Appendix A. “Explorer 16 Development Board Schematics” provides a block diagram and detailed schematics of the Explorer 16 board. • Appendix B. “Updating the USB Connectivity Firmware” describes how to upgrade the Explorer 16 board’s USB connectivity subsystem. NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files. Preface © 2005 Microchip Technology Inc. DS51589A-page 2 CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: WARRANTY REGISTRATION Please complete the enclosed Warranty Registration Card and mail it promptly. Sending in the Warranty Registration Card entitles users to receive new product updates. Interim software releases are available at the Microchip web site. DOCUMENTATION CONVENTIONS Description Represents Examples Arial font: Italic characters Referenced books MPLAB® IDE User’s Guide Emphasized text ...is the only compiler... Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window or dialog “Save project before build” Underlined, italic text with right angle bracket A menu path File>Save Bold characters A dialog button Click OK A tab Click the Power tab Text in angle brackets < > A key on the keyboard Press , Courier New font: Plain Courier New Sample source code #define START Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants (in source code) 0xFF, ‘A’ Italic Courier New A variable argument file.o, where file can be any valid filename Square brackets [ ] Optional arguments mcc18 [options] file [options] Curly brackets and pipe character: { | } Choice of mutually exclusive arguments; an OR selection errorlevel {0|1} Ellipses... Replaces repeated text var_name [, var_name...] Represents code supplied by user void main (void) { ... } Explorer 16 Development Board User’s Guide DS51589A-page 3 © 2005 Microchip Technology Inc. RECOMMENDED READING This user’s guide describes how to use the Explorer 16 Development Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources. Readme for the Explorer 16 Development Board For the latest information on using the Explorer 16 Development Board, read the Readme for Explorer 16 Development Board.txt file (an ASCII text file) at the root level of the Explorer 16 CD-ROM. The Readme file contains update information and known issues that may not be included in this user’s guide. Readme Files For the latest information on using other tools, read the tool-specific Readme files in the Readmes subdirectory of the MPLAB IDE installation directory. The Readme files contain update information and known issues that may not be included in this user’s guide. PIC24FJ128GA010 PS Data Sheet (DS39756) and PIC24FJ128GA Family Data Sheet (DS39747) Consult this document for detailed information on the PIC24F general purpose, 16-bit devices. Reference information found in this data sheet includes: • Device memory map • Device pinout and packaging details • Device electrical specifications • List of peripherals included on the device Note that document, DS39756, is for use only with the initial prototype samples of the PIC24F family. These devices are all marked with a “PS” suffix at the end of the device number. For all other PIC24FJ128GA family devices, including those with an “ES” suffix, use DS39747. dsPIC33F Family Data Sheet (DS70165) Consult this document for detailed information on the dsPIC33F Digital Signal Controllers. Reference information found in this data sheet includes: • Device memory map • Device pinout and packaging details • Device electrical specifications • List of peripherals included on the device dsPIC30F Programmer’s Reference Manual (DS70030) This manual is a software developer’s reference for all of Microchip’s 16-bit digital signal controllers. It describes the instruction set in detail and also provides general information to assist in developing software for PIC24 MCUs, dsPIC30F and dsPIC33F DSCs. PIC24H Family Overview (DS70166) This document provides an overview of the functionality of the new PIC24H product family. It helps determine how the PIC24H high-performance, 16-bit microcontrollers fit a specific product application. Preface © 2005 Microchip Technology Inc. DS51589A-page 4 MPLAB® C30 C Compiler User’s Guide (DS51284) This document details the use of Microchip’s MPLAB C30 C Compiler for dsPIC® devices to develop an application. MPLAB C30 is a GNU-based language tool, based on source code from the Free Software Foundation (FSF). For more information about the FSF, see www.fsf.org. Other GNU language tools available from Microchip are: • MPLAB ASM30 Assembler • MPLAB LINK30 Linker • MPLAB LIB30 Librarian/Archiver MPLAB® IDE Simulator, Editor User’s Guide (DS51025) Consult this document for more information pertaining to the installation and implementation of the MPLAB Integrated Development Environment (IDE) software. THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Explorer 16 Development Board User’s Guide DS51589A-page 5 © 2005 Microchip Technology Inc. DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. The Development Systems product group categories are: • Compilers – The latest information on Microchip C compilers and other language tools. These include the MPLAB C18 and MPLAB C30 C compilers; MPASM™ and MPLAB ASM30 assemblers; MPLINK™ and MPLAB LINK30 object linkers; and MPLIB™ and MPLAB LIB30 object librarians. • Emulators – The latest information on Microchip in-circuit emulators.This includes the MPLAB ICE 2000 and MPLAB ICE 4000. • In-Circuit Debuggers – The latest information on the Microchip in-circuit debugger, MPLAB ICD 2. • MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows® Integrated Development Environment for development systems tools. This list is focused on the MPLAB IDE, MPLAB SIM simulator, MPLAB IDE Project Manager and general editing and debugging features. • Programmers – The latest information on Microchip programmers. These include the MPLAB PM3 and PRO MATE® II device programmers and the PICSTART® Plus and PICkit™ 1 development programmers. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com DOCUMENT REVISION HISTORY Revision A (November 2005) This is the initial release of this Document. Preface © 2005 Microchip Technology Inc. DS51589A-page 6 NOTES: EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 7 Chapter 1. Introducing the Explorer 16 Development Board 1.1 INTRODUCTION Thank you for purchasing Microchip Technology’s Explorer 16 Development Board Kit. The development board provides a low-cost, modular development system for Microchip’s new line of 16-bit microcontroller families, including the PIC24, PIC24H and the 16-bit digital signal controller family, dsPIC33F. As provided, the development board works as a demo board right from the box, and also has the ability to extend its functionality through modular expansion interfaces. The Explorer 16 board supports MPLAB ICD 2 for full emulation and debug capabilities, and also allows 3V controllers to interface with 5V peripheral devices. 1.2 HIGHLIGHTS This chapter covers the following topics: • What’s in the Kit • Explorer 16 Development Board Functionality and Features • Using the Explorer 16 Out of the Box • Explorer 16 Development Board Demonstration Programs • Reference Documents 1.3 WHAT’S IN THE KIT The Explorer 16 Development Board Kit contains the following: • The Explorer 16 Development Board. • A preprogrammed PIC24FJ128GA010 Processor Installation Module (PIM), already installed to the board • A preprogrammed dsPIC33FJ256GP710 PIM • An RS-232 cable • The Explorer 16 Development CD ROM, containing: - This User’s Guide - Data Sheets for the PIC24FJ128GA family and dsPIC33FJ256GP family - Schematics and PCB drawing files for the PIM modules - Example programs for use with the PIC24 and dsPIC33F devices - Files detailing general purpose expansion boards that can be used with the Explorer 16 board (provided in Gerber format) If you are missing any part of the kit, please contact your nearest Microchip sales office, listed on the last page of this manual, for further assistance. Note: The Explorer 16 Development Board has been designed to function primarily from a permanently mounted PIC24FJ128GA010 device at position U1. Initial units will be shipped with U1 unpopulated and a PIC24FJ PIM of equal functionality mounted on the U1A headers instead. When using the PIC24FJ PIM or any other PIM, it is critical to verify that switch S2 always remains in the “PIM” position. See Section 4.2.1 “Processor Support” for more information. Introducing the Explorer 16 Development Board © 2005 Microchip Technology Inc. DS51589A-page 8 1.4 EXPLORER 16 DEVELOPMENT BOARD FUNCTIONALITY AND FEATURES A layout of the Explorer 16 Development Board is shown in Figure 1-1. The board includes these key features, as indicated in the diagram: 1. 100-pin PIM riser, compatible with the PIM versions of all Microchip PIC24F/24H/dsPIC33F devices 2. Direct 9 VDC power input that provides +3.3V and +5V (regulated) to the entire board 3. Power indicator LED 4. RS-232 serial port and associated hardware 5. On-board analog thermal sensor 6. USB connectivity for communications and device programming/debugging 7. Standard 6-wire In-Circuit Debugger (ICD) connector for connections to an MPLAB ICD 2 programmer/debugger module 8. Hardware selection of PIM or soldered on-board microcontroller (in future versions) 9. 2-line by 16-character LCD 10. Provisioning on PCB for add on graphic LCD 11. Push button switches for device Reset and user-defined inputs 12. Potentiometer for analog input 13. Eight indicator LEDs 14. 74HCT4053 multiplexers for selectable crossover configuration on serial communication lines 15. Serial EEPROM 16. Independent crystals for precision microcontroller clocking (8 MHz) and RTCC operation (32.768 kHz) 17. Prototype area for developing custom applications 18. Socket and edge connector for PICtail™ Plus card compatibility 19. Six-pin interface for PICkit 2 Programmer 20. JTAG connector pad for optional boundary scan functionality For additional details on these features, refer to Chapter 4. “Explorer 16 Development Hardware”. 1.4.1 Sample Devices Included with the Development Kit Each Explorer 16 Development Board Kit contains two preprogrammed 16-bit devices: a PIC24FJ128GA010 and a dsPIC33FJ256GP710. These are provided as 100-pin PIMs on riser sockets, which can be quickly installed on pin header U1A and exchanged as needed. Note: As Microchip’s 16-bit portfolio develops, alternate devices may be included with the Explorer 16 Development Board Kit. It is anticipated that one device each of the PIC24 and dsPIC33F families will always be included. Also in the future, the included PIC24 device will be soldered onto the board and only the dsPIC33F device will be provided as a PIM. Explorer 16 Development Board User’s Guide DS51589A-page 9 © 2005 Microchip Technology Inc. FIGURE 1-1: EXPLORER 16 DEVELOPMENT BOARD LAYOUT 1.5 USING THE EXPLORER 16 OUT OF THE BOX Although intended as a development platform, the Explorer 16 board may also be used directly from the box as a demonstration board for PIC24 and dsPIC33F devices. The programs discussed in Chapter 3. “Explorer 16 Tutorial Programs” are preprogrammed into the sample device PIMs (i.e., PIC24ExplDemo.hex for the PIC24 device and dsPIC33ExplDemo.hex for the dsPIC33F device) and are ready for immediate use. To get started with the board: 1. For Explorer 16 boards without a permanently mounted PIC24FJ device: verify that the PIC24FJ128GA010 PIM is correctly installed onto the board. If you want to use the dsPIC® device PIM, carefully remove the PIC24 PIM and install the dsPIC33F PIM in its place. For all PIMs, be certain to align the PIM so the notched corner marking is oriented in the upper left corner. 2. For Explorer 16 boards without a permanently mounted PIC24FJ device: verify that switch S2 is set in the “PIM” position. For Explorer 16 boards with a permanently mounted PIC24FJ device: verify that switch S2 is set in the “PIC” position. 3. Verify that the jumper on JP2 is installed (to enable the LEDs). 4. Apply power to the board (9 VDC) at power input J2. For information on acceptable power sources, see Appendix A. “Explorer 16 Development Board Schematics”. Refer to Chapter 3. “Explorer 16 Tutorial Programs” for details on the demonstration code operation. 1 10 7 4 5 6 3 2 8 9 11 12 13 14 15 16 17 18 19 20 Introducing the Explorer 16 Development Board © 2005 Microchip Technology Inc. DS51589A-page 10 FIGURE 1-2: EXPLORER 16 PIM MODULE, SHOWING NOTCHED CORNER MARKING 1.6 EXPLORER 16 DEVELOPMENT BOARD DEMONSTRATION PROGRAMS The preprogrammed example code on the PIMs has been included on the Explorer 16 CD-ROM for future reference. All project files have been included, so that the code may be used directly to restore a PIM to its original state (i.e., if the sample device has been reprogrammed with another program), or so the user may use the tutorial code as a platform for further experimentation. In addition, the CD-ROM contains sample demonstration programs for both PIC24 and dsPIC33F family devices. Separate demo source code (as files in C) and compiled code files (in Hex) are provided for each family. These may be used with the included PIC24 and dsPIC33F PIMs by reprogramming the devices using MPLAB ICD 2. 1.7 REFERENCE DOCUMENTS In addition to the documents listed in the “Recommended Reading” section, these documents are also available from Microchip to support the use of the Explorer 16 Development Board: • PIC18F2455/2550/4455/4550 Data Sheet (DS39632) • TC1047/TC1047A Data Sheet (DS21498) • 25AA256/25LC256 Data Sheet (DS21822) • PICkit™ 2 Microcontroller Programmer User’s Guide (DS51553) • MPLAB® ICD 2 In-Circuit Debugger Quick Start Guide (DS51268) • PRO MATE® II User’s Guide (DS30082) You can obtain these reference documents from your nearest Microchip sales office (listed in the back of this document) or by downloading them from the Microchip web site (www.microchip.com). PIC24FJ128GA010 EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 11 Chapter 2. Explorer 16 Programming Tutorial 2.1 INTRODUCTION This chapter is a self-paced tutorial to get you started using the Explorer 16 Development Board. 2.2 HIGHLIGHTS Items discussed in this chapter include: • Tutorial Overview • Creating the Project • Building the Code • Programming the Device 2.3 TUTORIAL OVERVIEW The tutorial in this chapter demonstrates the main features of the MPLAB IDE and MPLAB ICD 2 as they are used with the Explorer 16 Development Board. As presented, it is designed for use with the PIC24FJ128GA010 specifically. However, the same procedures and toolsuites can also be used with PIC24H or dsPIC33F devices. The PIC24 tutorial project demonstrated here, PIC24ExplDemo.mcp, is written in C for MPLAB C30. The program displays PIC24 features on the alphanumeric LCD, and also displays voltage, temperature and date/time as the various buttons are pressed. Described with the PIC24 project is the dsPIC device tutorial, Example1_RTC_LED_ADC.mcp. It is also written in C for MPLAB C30. The program displays voltage and current time, updating the display on command. Both programs are described in more detail in Chapter 3. “Explorer 16 Tutorial Programs”. For either project, the source file (PIC24ExplDemo.c or main_rtc.c for PIC24 or dsPIC33F, respectively) is used with a linker script file (p24fj128ga010.gld or p33fj256gp710ps.gld) and header file (p24fj128ga010.h or p33fj256gp710ps.h) to form a complete project. While these simple projects use a single source code file, more complex projects might use multiple assembler and compiler source files, as well as library files and precompiled object files. Upon completing this tutorial, you should be able to: • Create a project using the Project Wizard • Assemble and link the code and set the Configuration bits • Set up MPLAB IDE to use the MPLAB ICD 2 • Program the chip with the MPLAB ICD 2 There are three steps to this tutorial: 1. Creating a project in MPLAB IDE. 2. Assembling and linking the code. 3. Programming the chip with the MPLAB ICD 2. Explorer 16 Programming Tutorial © 2005 Microchip Technology Inc. DS51589A-page 12 2.4 CREATING THE PROJECT The first step is to create a project and a workspace in MPLAB IDE. Typically, there is one project in one workspace. A project contains the files needed to build an application (source code, linker script files, etc.) along with their associations to various build tools and build options. A workspace contains one or more projects and information on the selected device, debug tool and/or programmer, open windows and their location and other MPLAB IDE configuration settings. MPLAB IDE contains a Project Wizard to help create new projects. Before starting, create a folder named Tutorial for the project files for this tutorial (C:\Tutorial is assumed in the instructions that follow). From the Example Code\Tutorial Code directory on the Explorer 16 Development Kit Software CD-ROM, copy all of the source files into this folder. 2.4.1 Select a Device 1. Start MPLAB IDE. 2. Close any workspace that might be open (File > Close Workspace). 3. From the Project menu, select Project Wizard. 4. From the Welcome screen, click Next > to display the Project Wizard Step One dialog (Figure 2-1). FIGURE 2-1: SELECTING THE DEVICE 5. From the Device drop-down list, select “PIC24FJ128GA010” or “dsPIC33FJ256GP710PS”, depending on the PIM being used. Click Next >. The Project Wizard Step Two dialog will be displayed (see Figure 2-2). Note: These instructions presume the use of MPLAB IDE 7.22 or newer. Note: The screen shots in the following sections show the PIC24 tutorial. Except for displayed file names, the screens for the dsPIC33F tutorial will be identical. Explorer 16 Development Board User’s Guide DS51589A-page 13 © 2005 Microchip Technology Inc. FIGURE 2-2: SELECTING THE TOOLSUITE 2.4.2 Select Language Toolsuite 1. From the Active Toolsuite drop-down list, select Microchip C30 Toolsuite. This toolsuite includes the assembler and linker that will be used. 2. In the Toolsuite Contents combo box, select MPLAB C30 Compiler (pic30-gcc.exe). 3. In the Location box, click Browse... and navigate to C:\Program Files\Microchip\MPLAB C30\bin\pic30-as.exe. 4. With MPLAB LINK 30 Object Linker (pic30-ld.exe) selected in Toolsuite Contents, click Browse... and navigate to C:\Program Files\Microchip\MPLAB C30\bin\pic30-Id.exe. 5. Click Next > to continue. The Project Wizard Step Three dialog displays (Figure 2-3). Explorer 16 Programming Tutorial © 2005 Microchip Technology Inc. DS51589A-page 14 FIGURE 2-3: NAMING YOUR PROJECT 2.4.3 Name Your Project 1. In the Project Name text box, type “MyProject”. 2. In the Project Directory box, click Browse... and navigate to C:\Tutorial to place your project in the Tutorial folder. 3. Click Next > to continue. The Project Wizard Step Four dialog displays (Figure 2-4). FIGURE 2-4: ADDING FILES TO THE PROJECT Explorer 16 Development Board User’s Guide DS51589A-page 15 © 2005 Microchip Technology Inc. 2.4.4 Add Files to Project 1. From the list of folders on the PC, locate the C:\Tutorial folder. 2. Select the source (.c) and header (.h) files. Click Add >> to include the file in the project. 3. Expand the C:\Program Files\Microchip\MPLAB 30\support\gld folder and select the p24fj128ga010.gld or p33fj256gp710ps.gld file, as appropriate. 4. Click Add >> to include this file in the project. There should now be two files in the project. 5. Click Next > to continue. 6. When the summary screen displays, click Finish. After the Project Wizard completes, the MPLAB Project window shows the source files in the Source Files folder and the appropriate linker script in the Linker Scripts folder (Figure 2-5). FIGURE 2-5: PROJECT WINDOW A project and workspace has now been created in MPLAB IDE. MyProject.mcw is the workspace file and MyProject.mcp is the project file. Double-click the PIC24ExplDemo.c file (for PIC24) or main_rtc.c file (for dsPIC33F) in the Project window to open the file. MPLAB IDE should now look similar to Figure 2-6. Explorer 16 Programming Tutorial © 2005 Microchip Technology Inc. DS51589A-page 16 FIGURE 2-6: MPLAB® IDE WORKSPACE 2.5 BUILDING THE CODE In this project, building the code consists of compiling the source files to create an object file, MyProject.o, then linking the object file to create the MyProject.hex and MyProject.cof output files. (For dsPIC33F projects, the files would be Example1_RTC_LED_ADC.o, Example1_RTC_LED_ADC.hex and Example1_RTC_LED_ADC.cof.)The Hex file contains the data necessary to program the device, and the .cof file contains additional information that lets you debug the code at the source code level. Before building, there are settings required to tell MPLAB IDE where to find the include files and to reserve space for the extra debug code when the MPLAB ICD 2 is used. For PIC24 projects, the following line in the system.h file is: #include “p24fj128ga010.h” For dsPIC33 projects, the line is: #include “p33fj256gp710ps.h” This line causes a standard include file to be used. Microchip provides these files with all the Special Function Register (SFR) labels already defined for convenience. To build the code, select Build Options > Project from the Project menu. The Build Options dialog displays (Figure 2-7). Project Window Output Window Source Window Code Explorer 16 Development Board User’s Guide DS51589A-page 17 © 2005 Microchip Technology Inc. FIGURE 2-7: BUILD OPTIONS 2.5.1 Identify Assembler Include Path 1. Select the General tab. 2. Click Suite Default. This tells the environment where to find the library files. 3. Select the MPLAB LINK30 tab to view the linker settings (Figure 2-8). 4. Check Link for ICD2. 5. Click OK. The text box closes while the linker reserves space for the debug code used by the MPLAB ICD 2. 6. Click OK again to save these changes. The project is now ready to build. Explorer 16 Programming Tutorial © 2005 Microchip Technology Inc. DS51589A-page 18 FIGURE 2-8: MPLAB® LINK30 BUILD OPTIONS 2.5.2 Build the Project From the menu bar of the main MPLAB IDE window, select Project > Make. The Build Output window displays (Figure 2-9). Observe the progress of the build. When the “BUILD SUCCEEDED” message displays, you are ready to program the device. FIGURE 2-9: BUILD OUTPUT Explorer 16 Development Board User’s Guide DS51589A-page 19 © 2005 Microchip Technology Inc. 2.6 PROGRAMMING THE DEVICE The MPLAB ICD 2 In-Circuit Debugger is used to program and debug the microcontroller in-circuit on the Explorer 16 Development Board. 2.6.1 Set Up the Device Configuration The device configuration for the target microcontroller can be set by two methods: using configuration macros in the source code, or using the Configuration Bits window in MPLAB IDE. The PIC24 Explorer 16 tutorial code already includes configuration macros in the source code itself. It is only necessary to confirm that the following macros are in place near the top of the PIC24ExplDemo.c file: _CONFIG1(JTAGEN_OFF & GSS0_OFF & GWRP_OFF & BKBUG_OFF & COE_OFF & FWDTEN_OFF & FNOSC_PRI) _CONFIG2(FCKSM_CSDCMD & OSCIOFNC_ON & POSCMOD_HS) For the dsPIC33F tutorial code, confirm that the following macros are in place near the top of the main_rtc.c file: _FGS(CODE_WRITE_PROT_OFF); _FOSCSEL(FRC_PLL); _FOSC(CSW_FSCM_OFF & OSC2_IO & XT); _FWDT(WDT_OFF); If configuration macros are not used in the source code, it is also possible to set device configuration with the Configuration Bits window. For the PIC24 code, the process is as follows: 1. From the main window’s menu bar, select Configure > Configuration Bits to display the configuration settings (Figure 2-10). 2. Set the Configuration bits by clicking on a particular line item and selecting an option from the drop-down menu that appears. The Configuration bits should be set as shown in Figure 2-10. The settings that will most likely need to change are: a) Primary Oscillator Select: HS Oscillator Enabled b) Oscillator Select: Primary Oscillator (XT, HS, ES) c) Clock Switching and Monitor: SW Disabled, Mon Disabled d) Watchdog Timer Enable: Disable Note: Before proceeding, make sure that the USB driver for the MPLAB ICD 2 has been installed on the PC (see the MPLAB® ICD 2 In-Circuit Debugger User’s Guide (DS51331) for more details regarding the installation of the MPLAB ICD 2). Explorer 16 Programming Tutorial © 2005 Microchip Technology Inc. DS51589A-page 20 FIGURE 2-10: CONFIGURATION SETTINGS (PIC24) 2.6.2 Connect and Enable MPLAB ICD 2 1. Connect the MPLAB ICD 2 module to the PC with the USB cable. 2. Connect the MPLAB ICD 2 to the Explorer 16 Development Board with the short RJ-11 cable. 3. Apply power to the Explorer 16 board. 4. From the Debugger menu, click Select Tool > MPLAB ICD 2 to set the MPLAB ICD 2 as the debug tool in MPLAB IDE. 5. From the Debugger menu, select Connect to connect the debugger to the device. MPLAB IDE should report that it found the PIC24FJ128GA010 device, as shown in Figure 2-11. FIGURE 2-11: ENABLING MPLAB® ICD 2 Note: Do not use the Configuration Bits window to set device configuration if configuration macros are already used in the source code. In cases where both methods are used, configuration macros may override settings from the Configuration Bits window. Refer to the MPLAB IDE Simulator, Editor User’s Guide (DS51025) for additional information. Note: MPLAB IDE may need to download new firmware if this is the first time the MPLAB ICD 2 is being used with a PIC24FJ device. Allow it to do so. If any errors are shown, double-click the error message to get more information. Status indicates device is found Explorer 16 Development Board User’s Guide DS51589A-page 21 © 2005 Microchip Technology Inc. 2.6.3 Program the Device 1. From the Debugger menu, select Program to program the part. The Output window (Figure 2-12) displays the program steps as they occur. 2. Observe the results of the programming. When “MPLAB ICD 2 Ready” displays, the device is programmed and ready to run. FIGURE 2-12: PROGRAMMING THE DEVICE Explorer 16 Programming Tutorial © 2005 Microchip Technology Inc. DS51589A-page 22 NOTES: EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 23 Chapter 3. Explorer 16 Tutorial Programs 3.1 INTRODUCTION This chapter provides a high-level overview of the PIC24 and dsPIC33F firmware programmed during the tutorial exercise in the previous chapter. 3.2 PIC24 TUTORIAL PROGRAM OPERATION The PIC24 tutorial program is made up of three components which are individually displayed on the LCD. The program is used to demonstrate the new Parallel Master Port (PMP) module which is used to drive the LCD, as well as the new Real-Time Clock/Calendar module (RTCC). The program flow is shown in Figure 3-1. 3.2.1 PIC24 Features Features mode displays a continuous description of the PIC24FJ128GA010 device feature set. To exit the display and continue to the next mode, press S4. 3.2.2 Voltmeter/Temperature Voltmeter/Temperature mode uses the code modules, vbanner.c and ADC.c, and the A/D module to measure analog signals from the board and convert them for display on the LCD. The voltage is taken from the potentiometer (R6) and displays a voltage between 0.00V and 3.29V on line 1 of the LCD. Temperature is from a TC1074A analog thermal sensor (U5). The temperature is displayed on line 2 of the LCD and automatically alternates between Celsius and Fahrenheit values. The voltage and temperature are updated continuously. This mode also lets users store the current temperature in the on-board serial EEPROM by pressing S5. Pressing S6 switches the display between current and stored temperature values. An ‘M’ on the right side of the LCD indicates that a stored temperature value is being displayed. To exit and continue to the next mode, press S4. 3.2.3 Clock/Calendar Clock/Calendar mode uses code in the modules, rtcc.c and tbanner.c. Once this mode is entered from the main menu, a Real-Time Clock will start counting from 10:00:00, and display the date and day for Oct. 10, 2005. The new RTCC module and a 32 kHz clock crystal are used to provide the Real-Time Clock with day/date calendar. In Clock/Calendar mode, the user-defined push buttons do the following: • S3 toggles the Clock Set mode, which allows the user to set the date and time. Setup mode starts with the tens digit of the hour in the time display. • S4 accepts the value of the current item and moves cursor to the next item. • S5 decrements the currently selected item. • S6 increments the currently selected item. Pressing S3 once superimposes a flashing cursor over the tens digit of the hour in the time display. Each press of S4 moves the cursor sequentially through the digits of the time display, then the month, day and year. Pressing S3 at any time in the process returns to the regular clock/calendar display. Explorer 16 Tutorial Programs © 2005 Microchip Technology Inc. DS51589A-page 24 Pressing S4 at this point exits Clock/Calendar mode and returns the device to the PIC24 Features mode. The data that is sent to the LCD is also sent to the RS-232 serial port using the UART. A terminal emulator, such as HyperTerminal (installed by default on most Microsoft® Windows systems), will be able to display the same information. To do this, set the terminal emulator for 19200 baud, 8-bit data, 1 Stop bit and no parity check. FIGURE 3-1: PIC24 TUTORIAL PROGRAM FLOWCHART “Explorer 16 Development Board” Power-up PIC24 Features Scrolling Banner Is S4 pressed? “Mon 10:00:00” “Oct 10, 2005” No Yes Is S4 pressed? Is S5 pressed? Toggle Displayed Temperature between Current and Stored Is S4 pressed? No Is S3 pressed? Clock Setup mode: S3 – Exit Setup mode S4 – Accept Selection, Adjust Next Value S5 – Decrement Selection S6 – Increment Selection Yes Yes No Yes No Yes No Display Voltage Display Display Display Store Temperature in EEROM Is S6 pressed? No Yes and Temperature Explorer 16 Development Board User’s Guide DS51589A-page 25 © 2005 Microchip Technology Inc. 3.3 dsPIC33F TUTORIAL PROGRAM OPERATION The dsPIC33F tutorial program is made up of five simple processes which continuously execute on the dsPIC33FJ256GP710 device: • Real-Time Clock (RTC) using Timer1 • A/D conversion of Potentiometer (R6) • A/D volts to Hex conversion • Hex to Decimal conversion (for LCD display) • LCD Update The time of day and A/D conversion values are continually updated and displayed on the LCD. The program demonstrates the basic code to initialize Timer1, enable the Timer1 oscillator for RTC operation, and initialize the A/D for single channel conversion of potentiometer, RP5. The LCD is driven via the port pins. The program flow is shown in Figure 3-2. In addition to the tutorial, the Explorer 16 CD also provides code examples to demonstrate higher level processing requirements, such as DMA, digital filters and Fast Fourier Transforms (FFT). See Code Example 2 on the CD for more information. 3.3.1 Voltmeter The simple tutorial program initializes the A/D module for 12-bit mode with auto-sampling and conversion of the potentiometer connected to pin AN5 and initializes the respective interrupt. The A/D module continually samples and converts the potentiometer signal (0 to 3.3 VDC) on analog channel, AN5. When a conversion is complete, an interrupt is generated and the result in the ADCBUF0 register is copied into a temporary variable, temp1. The adc_lcd_update flag is then asserted and the A/D Interrupt Flag, AD1IF (IFS0<13>), is cleared. The program exits the Interrupt Service Routine and re-enters the main program loop. The variable, adc_lcd_update, is evaluated in the main loop to determine if there is a new A/D conversion value which can be converted and displayed on the LCD. The primary code modules associated with the operation of the ADC module and display are: • init_ADC.c • isr_ADC.c • advolts.c • hexdec.c 3.3.2 Real-Time Clock The tutorial program also supports a Real-Time Clock demo. Timer1 is initialized with interrupts enabled and the external 32.768 kHz oscillator is enabled. Within the Timer1 Interrupt Service Routine (once every second), the variables, hours, minutes and seconds, are updated, the flag variable, rtc_lcd_update, is asserted and the Timer1 Interrupt Flag, T1IF (IFS0<3>), is cleared. The program exits the Interrupt Service Routine and re-enters the main program loop. The variable, rtc_lcd_update, is evaluated in the main loop to determine if there is a new time of day value which can be converted and displayed on the LCD. The primary code modules associated with the operation of the Timer1 module and display are: • init_timer1.c • isr_timer1.c • hexdec.c Explorer 16 Tutorial Programs © 2005 Microchip Technology Inc. DS51589A-page 26 FIGURE 3-2: dsPIC33F TUTORIAL PROGRAM FLOWCHART “dsPIC33 Demo” “Press S3 to cont” Power-up Initialize Timer1 Is S3 pressed? Initialize A/D Converter to Decimal and Call Update_LCD No Update time? Update volts? Yes Yes No Yes No Convert Time of Day Display “Time 00:00:00” “R6 = 0.00 VDC” Display to Decimal and Call Update_LCD Convert A/D Result EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 27 Chapter 4. Explorer 16 Development Hardware 4.1 INTRODUCTION This chapter provides a more detailed description of the hardware features of the Explorer 16 Development Board. 4.2 HARDWARE FEATURES The key features of the Explorer 16 board are listed below. They are presented in the order given in Section 1.4 “Explorer 16 Development Board Functionality and Features”, Figure 1-1. 4.2.1 Processor Support The Explorer 16 board has been designed to accommodate both permanently mounted (i.e., soldered on) and detachable PIM processors. Slider switch, S2, allows the user to choose which processor to use. This makes it possible for the Explorer 16 board to support most 3V, 16-bit, pin compatible microcontrollers with appropriate PIMs. PIMs are visually indexed for proper installation. The PIM is always installed with the notched corner mark on the corner of the PIM board oriented to the upper left corner. Current revisions of the board do not have a permanently mounted microcontroller in U1. In order for the board to work, therefore, S2 must always be left in the “PIM” position. In future versions with a permanently mounted PIC24 device at U1, setting S2 in the “PIC” position will enable the on-board device and disable the PIM socket. 4.2.2 Power Supply There are two ways to supply power to the Explorer 16 board: • An unregulated DC supply of 9V to 15V (preferably 9V) supplied to J12. For default functionality, a power supply with a current capability of 250 mA is sufficient. Since the board can serve as a modular development platform that can connect to multiple expansion boards, voltage regulators (Q1 and Q2) with a maximum current capability of 800 mA are used. This may require a larger power supply of up to 1.6A. Because the regulators do not have heat sinks, long-term operation at such loads is not recommended. • An external, regulated DC power supply that provides both +5V and +3.3V can be connected to the terminals provided (at the bottom left side of the board, near S3). One green LED (D1) is provided to show when the Explorer 16 board is powered up. The power-on LED indicates the presence of +3.3V. Note: The Explorer 16 kit does not include a power supply. If an external supply is needed, use Microchip part number AC162039. Note: Do not attempt to power the Explorer 16 board using the MPLAB ICD 2 module. It is not designed to be a USB bus power source. Explorer 16 Development Hardware © 2005 Microchip Technology Inc. DS51589A-page 28 4.2.3 RS-232 Serial Port An RS-232 level shifter (U3) has been provided with all necessary hardware to support RS-232 connection with hardware flow control through the DB9 connector. The port is configured as a DCE device, and can be connected to a PC using a straight-through cable. The PIC24/dsPIC33F RX and TX pins are tied to the RX and TX lines of U3. The PIC24/dsPIC33F RTS and CTS pins are tied to the RX2 (DIN2) and TX2 (DOUT2) lines of the MAX3232 for hardware flow control. 4.2.4 Temperature Sensor An analog output thermal sensor (Microchip TC1074A, U4) is connected to one of the controller’s A/D channels. 4.2.5 USB Connectivity The Explorer 16 board includes a PIC18LF4550 USB microcontroller, which provides both USB connectivity and support for protocol translation. The PIC18LF4550 is hard-wired to the PIC24/dsPIC33F devices to provide three types of connectivity: • SPI™ of PIC18LF4550 to SPI1 of PIC24/dsPIC33F • I/O pins of PIC18LF4550 to ICSP™ pins of PIC24/dsPIC33F • I/O pins of PIC18LF4550 to JTAG pins of PIC24/dsPIC33F The type of connectivity depends on the firmware installed on the PIC18LF4550. At the time of initial release, the PIC18LF4550 is loaded with USB bootloader firmware, which permits easy upgrades of connectivity firmware over the USB. Installing this firmware is described in Appendix B. “Updating the USB Connectivity Firmware”. PIC24 and dsPIC33F devices both have some 5V tolerant input pins. If a 5V tolerant input is connected to the PIC18LF4550, protection diodes on the PIC18LF4550 device’s port pins will limit inputs to VDD. For more information on which pins of the 16-bit devices are 5V tolerant, refer to the appropriate device data sheet. 4.2.6 ICD Connector An MPLAB ICD 2 module can be connected by way of the modular connector (JP1) for low-cost debugging. The ICD connector utilizes port pins, RB6 and RB7 of the microcontroller, for in-circuit debugging. Jumper J7 decides the terminus of the ICD 2 connector. If the jumper is set to the “PIC24” side, JP1 communicates directly with RB6/RB7 of the PIM or on-board device (determined by S2). If the jumper is set to the “F4450” side, JP1 communicates with the on-board PIC18LF4550 USB device. 4.2.7 LCD The Explorer 16 board includes an alphanumeric LCD display with two lines of 16 characters each. The display is driven with three control lines (RD4, RD5 and RD15) and eight data lines (RE7:RE0). On PIC24 devices, the LCD is driven by the PMP module, not the I/O port. The Explorer 16 board has multiple LCD footprints and support options, although only one footprint is ever populated at one time. The Lumex LCM-SO1062 (populated at LCD4) is a 5V LCD with TTL input, and is used in the initial version of the Explorer 16 board. The Tianma TM162JCAWG1 (populated at LCD1) is a 3V LCD; it is anticipated to be used in future versions of the board. An alternate configuration option allows the use of RD3:RD0 as four of the data lines, instead of RE7:RE4. To do this, the user must cut the trace jumpers at R60/62/64/66 and create solder bridges from the pads for R61/63/65/67 (see Figure 4-1). Explorer 16 Development Board User’s Guide DS51589A-page 29 © 2005 Microchip Technology Inc. FIGURE 4-1: MODIFICATIONS TO R60-R67 FOR LCD CONFIGURATION (SCALE ENHANCED FOR VISIBILITY) 4.2.8 Graphic LCD The Explorer 16 also has a footprint and layout support for the Optrex 128 x 64 dot-matrix graphic LCD (part number F-51320GNB-LW-AB) and associated circuitry. This is the same display used in Microchip’s MPLAB PM3 programmer. 4.2.9 Switches Five push button switches provide the following functions: • S1: Active-low MCLR switch to hard reset the processor • S3: Active-low switch connected to RD6 (user-defined) • S4: Active-low switch connected to RD13 (user-defined) • S5: Active-low switch connected to RA7 (user-defined) • S6: Active-low switch connected to RD7 (user-defined) Switch S1 has a debounce capacitor, whereas S3 through S6 do not; this allows the user to investigate debounce techniques. When Idle, the switches are pulled high (+3.3V). When pressed, they are grounded. 4.2.10 Analog Input (Potentiometer) A 10 kΩ potentiometer is connected through a series resistor to AN5. It can be adjusted from VDD to GND to provide an analog input to one of the controller’s A/D channels. 4.2.11 LEDs Eight red LEDs (D2 through D9) are connected to PORTA of the PIM socket. The PORTA pins are set high to light the LEDs. These LEDs may be disabled by removing jumper JP2. 4.2.12 Oscillator Options The installed microcontroller has two separate oscillator circuits connected.The main oscillator uses an 8 MHz crystal (Y3) and functions as the controller’s primary oscillator. A second circuit, using a 32.768 kHz (watch type) crystal (Y2), functions as the Timer1 oscillator and serves as the source for the RTCC and secondary oscillator. The PIC18LF4550, at the heart of the USB subsystem, is independently clocked and has its own 20 MHz crystal (Y1). 4.2.13 Serial EEPROM A 25LC256 256K (32K x 8) serial EEPROM (U5) is included for nonvolatile firmware storage. It is also used to demonstrate SPI bus operation. R60 R61 R62 R63 R64 R65 R66 R67 Cut Traces Here Add Solder Bridges Here Explorer 16 Development Hardware © 2005 Microchip Technology Inc. DS51589A-page 30 4.2.14 PICkit 2 Connector Connector J14 provides the footprint for a 6-pin PICkit 2 programmer interface. This will provide a third low-cost programming option, besides MPLAB ICD 2 and the JTAG interface, when PICkit 2 support for larger devices become available in the future. 4.2.15 JTAG Connector Connector J13 provides a standard JTAG interface, allowing users to connect to and program the controller via JTAG. 4.2.16 PICtail™ Plus Card Edge Modular Expansion Connectors The Explorer 16 board has been designed with the PICtail™ Plus modular expansion interface, allowing the board to provide basic generic functionality and still be easily extendable to new technologies as they become available. PICtail Plus is based on a 120-pin connection divided into three sections of 30 pins, 30 pins and 56 pins. The two 30-pin connections have parallel functionality; for example, pins 1, 3, 5 and 7 have SPI1 functionality on the top 30-pin segment, with similar SPI2 functionality on the corresponding pins in the middle 30-pin segment. Each 30-pin section provides connections to all of the serial communications peripherals, as well as many I/O ports, external interrupts and A/D channels. This provides enough signals to develop many different expansion interfaces, such as Ethernet, Zigbee™, IrDA® and so on. The 30-pin PICtail Plus expansion boards can be used in either the top or middle 30-pin sections. The Explorer 16 board provides footprints for two edge connectors for daughter cards, one populated (J5, Samtec # MEC1-160-02-S-D-A) and one unpopulated (J6). The board also has a matching male edge connection (J9), allowing it to be used as an expansion card itself. 4.2.16.1 CROSSOVER CONNECTIONS FOR SPI AND UART The PICtail Plus interface allows two Explorer 16 boards to be connected directly to each other without any external connector. This provides 1-to-1 connection between the microcontrollers on the two boards, an interface that works well for many types of peripherals (I2C, PMP, etc.). However, certain serial peripheral modules, such as SPIs and UARTs, require cross-wire connections; that is, the TX (or SDO) pin of one controller must be connected to the RX (or SDI) of the other and vice versa. The Explorer 16 board uses two 74HCT4053 analog multiplexers to simplify the connections between itself and any daughter boards. U6 and U7 provide active control of the cross-wire capability on SPI1 and UART1, with a hardware flow control signal provided by three I/O pins. The multiplexers are controlled by the state of pins RB12, RB13 and RB14. When a control pin is high (the default state), the corresponding SPI1 or UART1 pin pairs are connected to their default pins on the PICtail Plus interface. When a control pin is asserted low, the corresponding pin pair functions are swapped. Table 4-1 details the relationship between the control pins and SPI1/UART1 functions on the interface. Explorer 16 Development Board User’s Guide DS51589A-page 31 © 2005 Microchip Technology Inc. TABLE 4-1: LOCATION OF SPI1 AND UART1 PINS ON PICtail™ PLUS INTERFACE Control Pin State UART1 Control Pins SPI1 Control Pin RB14 Control Pin RB13 Control Pin RB12 U1RX U1TX U1CTS U1RTS SDI1 SDO1 1 2 4 19 20 5 7 0 4 2 20 19 7 5 Note: When connecting SPI and UART peripherals on two Explorer 16 boards, use crossover connection on only one of the boards. Explorer 16 Development Hardware © 2005 Microchip Technology Inc. DS51589A-page 32 NOTES: EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 33 Appendix A. Explorer 16 Development Board Schematics A.1 INTRODUCTION This section provides detailed technical information on the Explorer 16 board. A.2 DEVELOPMENT BOARD BLOCK DIAGRAM FIGURE A-1: HIGH-LEVEL BLOCK DIAGRAM OF THE EXPLORER 16 DEVELOPMENT BOARD PIC24FJ128GA010 dsPIC33FJ256GP710 16x2 LCD Display PIC18LF4550 SPI* ICSP* JTAG* ICD/ICSP JTAG RS-232 Transceiver SPI EEPROM +3.3V and +5V Supply 9-15 VDC Switches Temperature Sensor LEDs POT Modular Expansion Connector USB PICtail™ Plus PICtail™ Plus * Hardware support only; firmware support for SPI™, JTAG and ICSP™ via USB are not available at this time. Explorer 16 Development Board Schematics © 2005 Microchip Technology Inc. DS51589A-page 34 A.3 DEVELOPMENT BOARD SCHEMATICS FIGURE A-2: EXPLORER 16 BOARD SCHEMATIC, SHEET 1 OF 8 (PIM SOCKET) VCAP/VDDCORE VDDCORE VSS VSS VDD 100-Pin PIM VSS VDD VSS VDD CVREF/AN10/RB10 AVDD AVSS VSS VDD VDD Explorer 16 Development Board User’s Guide DS51589A-page 35 © 2005 Microchip Technology Inc. FIGURE A-3: EXPLORER 16 BOARD SCHEMATIC, SHEET 2 OF 8 (BOARD MOUNTED PIC24FJ128GA010 MCU, WHEN INSTALLED) 10 μF .1 μF VCAP/VDDCORE VDD VSS PIC24FJ128GA010 VDD AVDD VDD VSS AVSS CVREF/AN10/RB10 VSS VDD VDD VSS VSS Explorer 16 Development Board Schematics © 2005 Microchip Technology Inc. DS51589A-page 36 FIGURE A-4: EXPLORER 16 BOARD SCHEMATIC, SHEET 3 OF 8 (MPLAB® ICD 2, JTAG, PICkit™ 2 AND PICtail™ Plus CONNECTORS) MPLAB® ICD 2 Connector .1 μF PICkit™ 2 Programmer Explorer 16 Development Board User’s Guide DS51589A-page 37 © 2005 Microchip Technology Inc. FIGURE A-5: EXPLORER 16 BOARD SCHEMATIC, SHEET 4 OF 8 (PICtail™ PLUS EDGE AND SOCKET CONNECTORS) Explorer 16 Development Board Schematics © 2005 Microchip Technology Inc. DS51589A-page 38 FIGURE A-6: EXPLORER 16 BOARD SCHEMATIC, SHEET 5 OF 8 (SWITCHES, MULTIPLEXERS AND POTENTIOMETER) VEE VCC .1 μF .1 μF VCC VEE .1 μF Explorer 16 Development Board User’s Guide DS51589A-page 39 © 2005 Microchip Technology Inc. FIGURE A-7: EXPLORER 16 BOARD SCHEMATIC, SHEET 6 OF 8 (EEPROM, TEMPERATURE SENSOR, LEDs, OSCILLATOR CIRCUITS AND POWER SUPPLY) .1 μF 25LC256 .1 μF TC1047A 22 pF 22 pF 32 kHz .1 μF 47 μF .1 μF 47 μF 47 μF .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF VCC VSS VDD VOUT VSS 8 MHz 22 pF 22 pF Explorer 16 Development Board Schematics © 2005 Microchip Technology Inc. DS51589A-page 40 FIGURE A-8: EXPLORER 16 BOARD SCHEMATIC, SHEET 7 OF 8 (USB AND UART SUBSYSTEMS) VUSB VSS VDD VDD VSS VSS VDD PIC18F4550_QFN44 VDD .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF .1 μF 22 pF 22 pF 20 MHz VBUS VCC Explorer 16 Development Board User’s Guide DS51589A-page 41 © 2005 Microchip Technology Inc. FIGURE A-9: EXPLORER 16 BOARD SCHEMATIC, SHEET 8 OF 8 (LCDs AND OPTIONAL LCD CONNECTIONS) Alternative LCD Configurations: 4.7 μF 4.7 μF 4.7 μF 4.7 μF 1 μF 1 μF 1 μF 1 μF 1 μF .1 μF VEE VO VCC VEE VCC VEE VEE VSS VDD VO Explorer 16 Development Board Schematics © 2005 Microchip Technology Inc. DS51589A-page 42 NOTES: EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 43 Appendix B. Updating the USB Connectivity Firmware B.1 INTRODUCTION The USB subsystem of the Explorer 16 Development Board is preprogrammed with USB bootloader firmware. This provides an easy method for upgrading the PIC18LF4550 firmware to support ICSP, JTAG and SPI connectivity to PIC24 and dsPIC33F devices. This chapter describes how to upgrade the PIC18LF4550 device’s firmware with the PICkit 2 software. The same process can be used to upgrade the PIC18LF4550 device’s firmware when updates and new firmware packages become available. B.2 UPDATING THE PICkit 2 MICROCONTROLLER PROGRAMMER Before beginning, it will be necessary to obtain and install the PICkit 2 programmer software. Complete instructions for installing and using the programmer software application is provided in the PICkit™ 2 Microcontroller Programmer User’s Guide (DS51553). The programmer and user’s guide, as well as the latest version of the PICkit 2 operating system firmware, are available from the Microchip corporate web site, www.microchip.com. To update the USB firmware: 1. If not done already, download the latest PICkit 2 operating system software from the Microchip web site. 2. On the Explorer 16 board, install a jumper between pins 9 and 10 of the JTAG connector (J13). 3. Press and release MCLR (S1). This places the USB subsystem in Bootloader mode and makes it ready to accept new code. 4. Connect the Explorer 16 board to the PC via a standard USB cable. 5. Launch the PICkit 2 programmer software. From the menu bar, select Tools > Download PICKit 2 Operating System (Figure B-1). FIGURE B-1: DOWNLOAD PICkit™ 2 OPERATING SYSTEM Updating the USB Connectivity Firmware © 2005 Microchip Technology Inc. DS51589A-page 44 6. Browse to the directory where the latest operating system firmware was saved (Figure B-2). FIGURE B-2: SELECT PICkit™ 2 OPERATING SYSTEM 7. Select the PK2_Explorer16_*.hex file and click the Open button. The progress of the update is displayed in the status bar of the programming software. When the update completes successfully, the status bar displays “Operating System Verified”. The update is now complete. B.3 OTHER USB FIRMWARE UPDATES It is anticipated that various USB connectivity firmwares will be made available in the future. Users are encouraged to periodically check the Microchip web site (www.microchip.com) for new and revised code. EXPLORER 16 DEVELOPMENT BOARD USER’S GUIDE © 2005 Microchip Technology Inc. DS51589A-page 45 Index B Build Options............................................................ 16 C Configuration Bits..................................................... 19 Crossover Connections (Serial Communications) ...................................8, 30 Customer Change Notification Service ...................... 5 Customer Support ...................................................... 5 D Documentation Conventions........................................................ 2 Layout ................................................................. 1 dsPIC33 Tutorial Program........................................ 25 dsPIC33F Tutorial Program Flowchart .......................................................... 26 E Explorer 16 Development Board Block Diagram .................................................. 33 Layout ................................................................. 9 Schematics ..................................................34–41 Explorer 16 Programming Tutorial ........................... 11 Building the Code ............................................. 16 Creating the Project .......................................... 12 Programming the Device .................................. 19 F Free Software Foundation ......................................... 4 G GNU Language Tools ................................................ 4 H Hardware Features Analog Potentiometer ....................................8, 29 ICD Connector ...............................................8, 28 JTAG Connector ............................................8, 30 LCD, Alphanumeric........................................8, 28 LCD, Graphic .................................................8, 29 LEDs ..............................................................8, 29 Multiplexers....................................................8, 30 Oscillator Options ..........................................8, 29 PICkit 2 Connector.........................................8, 30 PICtail Plus Card Edge Connectors...............8, 30 Power Indicator LED........................................... 8 Power Supply.................................................8, 27 Processor Support ........................................ 8, 27 Prototype Area .................................................... 8 RS-232 Serial Port ........................................ 8, 28 Serial EEPROM............................................ 8, 29 Switches........................................................ 8, 29 Temperature Sensor ..................................... 8, 28 USB Connectivity .......................................... 8, 28 I Internet Address......................................................... 4 L Language Toolsuite.................................................. 13 M Microchip Internet Web Site ....................................... 4 MPLAB ICD 2........................................................... 10 MPLAB IDE Simulator, Editor User’s Guide............... 4 P PIC24 Tutorial Program ........................................... 23 Flowchart .......................................................... 24 PICtail Plus Edge Connectors Use with Crossover Serial Connections........................................ 30 Project ...................................................................... 12 Project Wizard.......................................................... 12 R Reading, Recommended ........................................... 3 Readme...................................................................... 3 Reference Documents ............................................. 10 S Schematics......................................................... 34–41 U USB Connectivity ...................................................... 28 Updating the USB Connectivity Firmware............................................. 43 W Warranty Registration ................................................ 2 Workspace ............................................................... 12 WWW Address........................................................... 4 DS51589A-page 46 © 2005 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong 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Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 WORLDWIDE SALES AND SERVICE 10/31/05 MSP-EXP430F5529 Experimenter Board User's Guide Literature Number: SLAU330A May 2011–Revised June 2011 2 SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Contents Preface ....................................................................................................................................... 5 1 Getting Started ................................................................................................................... 7 1.1 MSP-EXP430F5529 Experimenter Board Introduction ............................................................. 7 1.2 Kit Contents .............................................................................................................. 8 2 User Experience Software .................................................................................................... 9 2.1 Introduction ............................................................................................................... 9 2.2 Main Menu ............................................................................................................... 9 2.3 Clock ..................................................................................................................... 10 2.4 Games ................................................................................................................... 10 2.5 Power Tests ............................................................................................................ 10 2.6 Demo Apps ............................................................................................................. 11 2.7 SD Card Access ....................................................................................................... 12 2.8 Settings Menu .......................................................................................................... 12 3 Software Installation and Debugging ................................................................................... 13 3.1 Software ................................................................................................................. 13 3.2 Download the Required Software .................................................................................... 13 3.3 Working With the Example Software ................................................................................ 13 4 MSP-EXP430F5529 Hardware .............................................................................................. 17 4.1 Hardware Overview .................................................................................................... 17 4.2 Jumper Settings and Power .......................................................................................... 18 4.3 eZ-FET Emulator ....................................................................................................... 21 4.4 MSP-EXP430F5529 Hardware Components ...................................................................... 21 5 Frequently Asked Questions, References, and Schematics .................................................... 24 5.1 Frequently Asked Questions ......................................................................................... 24 5.2 References .............................................................................................................. 24 5.3 Schematics and BOM ................................................................................................. 25 SLAU330A–May 2011–Revised June 2011 Table of Contents 3 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com List of Figures 1 MSP-EXP430F5529 Experimenter Board ............................................................................... 7 2 User Experience Navigation ............................................................................................... 9 3 Selecting a CCS Workspace............................................................................................. 14 4 Opening Existing Project ................................................................................................. 14 5 Simple Hardware Overview .............................................................................................. 17 6 Hardware Block Details ................................................................................................... 18 7 Common Power Jumper Settings ....................................................................................... 18 8 Visual Power Schematic.................................................................................................. 20 9 MSP430 Current Measurement Connection ........................................................................... 21 10 Schematics (1 of 7)........................................................................................................ 25 11 Schematics (2 of 7)........................................................................................................ 26 12 Schematics (3 of 7)........................................................................................................ 27 13 Schematics (4 of 7)........................................................................................................ 28 14 Schematics (5 of 7)........................................................................................................ 29 15 Schematics (6 of 7)........................................................................................................ 30 16 Schematics (7 of 7)........................................................................................................ 31 List of Tables 1 MSP-EXP430F5529 Jumper Settings and Functionality ............................................................. 19 2 Push Buttons, Potentiometer, and LED Connections................................................................. 22 3 Pinning Mapping for Header J4.......................................................................................... 23 4 Pin Mapping for Header J5............................................................................................... 23 5 Pin Mapping for Header J12 ............................................................................................. 23 6 Bill of Materials............................................................................................................. 32 4 List of Figures SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Preface SLAU330A–May 2011–Revised June 2011 Read This First If You Need Assistance The primary sources of information for MSP430 devices are the data sheets and the family user's guides. The most up-to-date versions of these documents can be found at www.ti.com/msp430. Information specific to the MSP-EXP430F5529 Experimenter Board can be found at www.ti.com/usbexp. Customer support for MSP430 devices and the MSP-EXP430F5529 Experimenter Board is provided by the Texas Instruments Product Information Center (PIC), as well as on the TI E2E (Engineer-2-Engineer) Forum at the link below. Contact information for the PIC can be found on the TI web site at: support.ti.com. The MSP430 Specific E2E forum is located at: community.ti.com/forums/12.aspx. Related Documentation from Texas Instruments MSP-EXP430F5529 Experimenter Board User's Guide (SLAU330) MSP-EXP430F5529 Experimenter Board User Experience Software MSP-EXP430F5529 Experimenter Board Quick Start Guide (SLAU339) MSP-EXP430F5529 Experimenter Board PCB Design Files (SLAR055) MSP430F552x Code Examples (SLAC300) FCC Warning This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user, at his own expense, will be required to take whatever measures may be required to correct this interference. SLAU330A–May 2011–Revised June 2011 Preface 5 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated 6 Read This First SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated User's Guide SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 1 Getting Started 1.1 MSP-EXP430F5529 Experimenter Board Introduction The MSP-EXP430F5529 Experimenter Board is a development platform based on the MSP430F5529 with integrated USB. The Experimenter Board showcases the abilities of the latest family of MSP430s and is perfect for learning and developing USB-based applications using the MSP430. The features include a 102x64 dot-matrix LCD, microSD memory card interface, 3-axis accelerometer, five capacitive-touch pads, RF EVM expansion headers, nine LEDs, an analog thumb-wheel, easy access to spare F5529 pins, integrated Spy-Bi-Wire flash emulation module, and standard full JTAG pin access. The kit is pre-programmed with an out-of-box demo to immediately demonstrate the capabilities of the MSP430 and Experimenter Board. This document details the hardware, its use, and the example software. Figure 1. MSP-EXP430F5529 Experimenter Board The MSP-EXP430F5529 Experimenter Board is available for purchase from the TI eStore: https://estore.ti.com/MSP-EXP430F5529-MSP430F5529-Experimenter-Board-P2413C43.aspx SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 7 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Getting Started www.ti.com 1.2 Kit Contents • MSP-EXP430F5529 Experimenter Board • Two mini-USB cables • Battery holder • 1GB microSD card • Quick start guide 8 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com User Experience Software 2 User Experience Software 2.1 Introduction The MSP-EXP430F5529 Experimenter Board arrives with a User Experience application installed to demonstrate a few of the capabilities of the MSP430F5529. Set the power switch to "LDO", and connect your PC to the "5529 USB" connection as shown in Figure 2. A splash screen displaying the TI logo should appear on the LCD. Wait approximately three seconds, or press either the S1 or S2 button, to display the Main Menu. Use the thumb wheel to navigate up and down the menu items on the LCD screen. Press the S1 pushbutton to enter a selection, or press the S2 pushbutton to cancel. Figure 2. User Experience Navigation 2.2 Main Menu The main menu displays a list of applications and settings that demonstrate key features of the MSP430F5529. Use the thumb wheel on the bottom right of the PCB to scroll up and down through the menu options. Use the push-buttons to enter and exit menu items. Press S1 to enter a menu item. Press S2 to return to a previous menu or to cancel an operation. Each application in the main menu is described in the following sections. SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 9 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated User Experience Software www.ti.com 2.3 Clock Select this option from the main menu to bring up the Clock sub-menu. Press S2 to return to the previous menu. NOTE: The User Experience software initializes the real-time clock to 04:30:00 - 01/01/2011 when powered is applied to the MSP430. Digital Clock: Displays an image of a digital watch with the current time and date. Analog Clock: Displays an image of an analog clock with the current time. Set Time: Allows the user to set the current time. Use the scroll wheel to change the value of the current selection. Press push-button S1 is used to advance to the next field. The clock changes take affect after the last field is updated. 2.4 Games Select this option from the main menu to bring up the Games sub-menu. Press S2 to return to the previous menu. Defender: The player controls a small spaceship. The object of the game is to fly through a tunnel without hitting the walls and to successfully navigate around mines scattered throughout the tunnel. Press S1 or S2 to begin the game. Use the wheel to move the ship up and down and press S1 or S2 to shoot a missile. As the game progresses, the tunnel gets narrower and the game speeds up. After the player's ship crashes, the score is displayed. Simon: A version of the famous memory game. The objective of the game is to match a randomly generated sequence of LEDs displayed on the touch pads. After the sequence is displayed, the user must touch the correct pads in the same sequence. The game begins with a single-symbol sequence and adds an additional symbol to the sequence after each successful response by the user. The game ends when the user incorrectly enters a sequence. The number of turns obtained in the sequence is then displayed. Tilt Puzzle: A version of the famous "8-puzzle" game. The game consists of a 3 by 3 grid with eight numbers and one empty space. The game utilizes the on-board accelerometer to shift numbers up-down and left-right. The objective of the game is to have the sum of the numbers in each row and column equal to twelve. Press S1 to begin a new game if the current game is unsolvable. The nature of the game is that there is a 50% probability the game is not solvable. 2.5 Power Tests Select this option from the main menu to bring up the Power Test sub-menu. Press S2 to return to the previous menu. The Power Test menu contains two demonstrations that allow the user to externally measure the current consumption of the MSP430 in both active mode and low-power mode. Current consumption can be measured using a multi-meter with current measuring capabilities (ammeter). Remove the jumper on "430 PWR" (JP6) and connect a multi-meter in series with the MSP430 VCC supply. This connection can be made using the two large vias near the "430 PWR" text on the PCB. See Section 4 for more details on this connection. Active Mode: Demo for measuring active mode current of the MSP430. Instructions are presented on screen. Press S1 to continue to the application. Press S2 to return to the Power Tests sub-menu. The Active Mode menu consists of two columns. The left column controls the core voltage (VCORE) of the MSP430F5529, and the right column controls MCLK. The right column displays only those MCLK frequencies that are valid for the current VCORE setting. The capacitive touch pads at the bottom of the board control which column is currently active. The wheel scrolls through the options in the active column. 10 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com User Experience Software Press S1 to enter Measurement Mode. While in measurement mode, measure the current by attaching a multi-meter across the 430 PWR holes and removing the 430 PWR jumper J6. Replace the 430 PWR jumper after making the measurement, then press S1 or S2 to return to the Active Mode menu. Press S2 to return to the Power Tests sub-menu Low Power Mode: Selecting Low Power Mode takes the user to an information screen with directions on how to navigate the Low Power Mode menu. Press S1 to continue on to the application. Press S2 to return to the Power Tests sub-menu. In the Low Power Mode menu, use the wheel to select a low-power mode option, then press S1 to enter low-power mode. While in low-power mode, measure the current by attaching a multi-meter across the 430 PWR holes and removing the 430 PWR jumper. Press S1 or S2 to return to the Low Power Mode menu. 2.6 Demo Apps Select this option from the main menu to bring up the Demo Apps sub-menu, which allows access to various demo applications. Many of them require a USB connection. Use the wheel to select one of the options and then press S1 to enter the application. Press S2 to return to the main menu. Terminal Echo uses the CDC stack to communicate with a hyperterminal on the PC. USB Mouse uses the HID stack to interface with the PC. Terminal Echo: Select Terminal Echo to display an informational screen and connects to the PC. Make sure to connect a USB cable from the USB port labeled "5529 USB" to the host PC. Open a hyperterminal window and connect to the MSP430. Text that is typed in the hyperterminal window is echoed back to the terminal and is displayed on the LCD screen of the Experimenter Board. Press S2 to exit and return Demo Apps sub-menu. USB Mouse: Select USB Mouse to display an informational screen and connects to the PC. Make sure to connect a USB cable from the USB port labeled "5529 USB" to the host PC. The MSP430 now acts as the mouse for the PC. Tilt the board to move the mouse around the screen, and press S1 to click. Press S2 to exit and return Demo Apps sub-menu. USB microSD: Select USB microSD to connect to the PC as a mass storage device. Make sure to connect a USB cable from the USB port labeled "5529 USB" to the host PC. The MSP430 shows as an external drive (or removable drive) for the PC. Press S2 to return to the Demo Apps sub-menu. Touch Graph: Select Touch Graph to display an instruction screen for a very short time and then launch the application. Touch the capacitor key pads with varying pressures to see the varying capacitance being displayed as bars with varying heights. Slide a finger over multiple capacitor key pads to observe the change in heights of bars with respect to the current position of the finger and also the effect of capacitance from neighboring pads. Press S2 to exit and return Demo Apps sub-menu. Touch Slide: Select Touch Slide to display an instruction screen for a very short time and then launch the application. Touch the capacitor key pads with varying pressures to see the varying capacitance being displayed as bars with varying heights. Slide a finger over multiple capacitor key pads to observe the change in heights of bars with respect to the current position of the finger and also the effect of capacitance from neighboring pads. Press S2 to exit and return Demo Apps sub-menu. Demo Cube: Select Demo Cube to launch the demo cube application. Read the instructions and press S1 to start the application. There are two modes. Use S1 to toggle between them. In the first mode, the cube randomly rotates by itself. In the second mode, the cube can be rotated by tilting the board. This mode uses the accelerometer. Press S2 to exit and return Demo Apps sub-menu. SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 11 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated User Experience Software www.ti.com 2.7 SD Card Access Select SD Card Access to access a microSD card placed in the SD card reader at the top of the board. If no SD card is present, a warning screen is displayed. When an SD card is present, the screen displays a list of the contents of the card. Directories are denoted by "". Use the wheel to scroll through the list and select files or directories to open by pressing S1. When a file is open, use the wheel to scroll further through the file. Press S2 to close the current file or directory. Press S2 while in the root directory to return to the main menu. 2.8 Settings Menu Select Settings to modify the display settings for the Experimenter Board. Use the wheel to select the setting to modify and press S1 to enter. Press S2 to return to the main menu. Contrast: Modify the contrast of the LCD by turning the wheel. When first entering the menu, the contrast remains unchanged for a few seconds to allow the user to read the instructions and then changes to the setting for the current position of the wheel. After the contrast is set at the desired level, press S2 to return to the Settings sub-menu. Backlight: Modify the brightness of the backlight by turning the wheel. There are 12 brightness settings, from having the backlight turned off up to full brightness. After the backlight is set at the desired level, press S2 to return to the Settings sub-menu. Calibrate Accel: Sets the "default" position for the accelerometer. An instruction screen is shown first. For best results, set the board on a flat surface. Press S1 to start calibrations. The accelerometer readings at that point in time are stored to flash and are subtracted from the subsequent accelerometer readings of other applications like USB Mouse and USB Tilt Puzzle. SW Version: Displays the current version of the firmware loaded on the Experimenter Board. LEDs & Logo: Lights all the LEDs on the board. There are one red, one yellow, one green, and five blue LEDs on the capacitive touch pads. This provides a method to determine whether or not all the LEDs are in working condition. The screen also displays the TI Bug and a USB Flash Drive logo on the screen. 12 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Software Installation and Debugging 3 Software Installation and Debugging 3.1 Software Texas Instruments' Code Composer Studio (CCS) is an MSP430 integrated development environment (IDE) designed specifically to develop applications and program MSP430 devices. CCS, CCS Core Edition, and IAR Embedded Workbench can all be used to evaluate the example software for the Experimenter Board. The compiler limitation of 8KB prevents IAR KickStart from being used for the evaluation of the example software. The example software, titled "User Experience," is available online as MSP-EXP430F5529 Experimenter Board User Experience Software. 3.2 Download the Required Software Different development software tools are available for the MSP-EXP430F5529 Experimenter Board development board. IAR Embedded Workbench KickStart and Code Composer Studio (CCS) are both available in a free limited version. IAR Embedded Workbench KickStart allows 8KB of C-code compilation. CCS is limited to a code size of 16KB. The software is available at www.ti.com/msp430. The firmware is larger than IAR KickStart's 8KB limit, so a full license of IAR Workbench is required to compile the application using IAR. A 30-day evaluation version of IAR is also available from http://supp.iar.com/Download/SW/?item=EW430-EVAL. This document describes working with Code Composer Studio (CCS). There are many other compilers and integrated development environments (IDEs) for MSP430 that can be used with the MSP-EXP430F5529 Experimenter Board, including Rowley Crossworks and MSPGCC. However, the example project has been created using Code Composer Studio (CCS) and IAR. For more information on the supported software and the latest code examples visit the online product folder (http://focus.ti.com/docs/toolsw/folders/print/msp-exp430f5529.html). 3.3 Working With the Example Software The MSP-EXP430F5529 example software is written in C and offers APIs to control the MSP430F5529 chip and external components on the MSP-EXP430F5529 Experimenter Board. New application development can use this library for guidance. The example software can be downloaded from the MSP-EXP430F5529 tools page, MSP-EXP430F5529 Experimenter Board User Experience Software. The zip package includes the MSP-EXP430F5529 example software. The code is ready for compilation and execution. To modify, compile, and debug the example code the following steps should be followed: 1. If you have not already done so, download the sample code from the MSP-EXP430F5529 tools page. 2. Install 5529UE-x.xx-Setup.exe installation package to the PC. 3. Connect the MSP-FET430UIF programmer to the PC. If you have not already done so, install the drivers for the programmer. 4. Connect one end of the 14-pin cable to JTAG programmer and another end to the JTAG header on the board. 5. Open CCS and select a workspace directory (see Figure 3). SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 13 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Software Installation and Debugging www.ti.com Figure 3. Selecting a CCS Workspace • Select Project > Import Existing CCS/CCE Eclipse Project. • Browse to the extracted project directory. The project should now show up in the Projects list (see Figure 4). • Make sure the project is selected, and click Finish. Figure 4. Opening Existing Project The project is now open. To build, download, and debug the code on the device on the MSP-EXP430F5529 Experimenter Board, select Target > Debug Active Project or click the green 'bug' button. 14 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Software Installation and Debugging You may be prompted to update the firmware on the MSP-FET430UIF programmer. Do not be concerned; click the button that says Update, and the program download should continue as expected. NOTE: To begin developing your own application, follow these steps: 1. Download and install a supported IDE: Code Composer Studio – Free 16KB IDE: www.ti.com/ccs IAR Embedded Workbench KickStart – Free 8KB IDE: www.ti.com/iar-kickstart 2. Connect the MSP-EXP430F5529 Experimenter Board "eZ-FET" USB to the PC. 3. Download and debug your application. SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 15 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Software Installation and Debugging www.ti.com 3.3.1 Basic Code Structure CTS "Capacitive Touch Sensing" library with functions related to the capacitive touch pads. CCS CCS-specific project files CCS_Code_Size_Limited CCS-specific project files for 16kb code size limited version F5xx_F6xx_Core_Lib Core Libraries FatFs Stack for the FAT file system used by SD Card IAR IAR-specific project files MSP-EXP430F5529_HAL Provides an abstraction layer for events like button presses, etc. HAL_AppUart Functions for controlling application UART HAL_Board Experimenter Board port initialization and control HAL_Buttons Driver for the buttons on the Experimenter Board HAL_Cma3000 Functions required to use on-board accelerometer HAL_Dogs102x6 Driver for the DOGS 102x64 display HAL_Menu Used to create the menus for the example software and applications HAL_SDCard Driver for the SD Card module HAL_Wheel Driver for the scroll (thumb) wheel USB USB stack for the Experimenter Board UserExperienceDemo Files related to the example software provided with the board 5xx_ACTIVE_test Runs a RAM test Clock Displays analog and digital clocks. Also provides a function to set time and date. Demo_Cube Displays a auto/manual rotating cube (uses accelerometer) DemoApps Contains the demos for capacitive touch EchoUsb HyperTerminal application LPM Provides options for various low-power modes MassStorage Use microSD as external storage on computer menuGames Play LaunchPad Defender or Simon Puzzle Play Tilt-puzzle Mouse Use the Experimenter Board as a mouse PMM Active low-power modes. Choose VCORE and MCLK settings. PowerTest Test the current consumption of various low-power modes Random Random number generator SDCard Access microSD card contents on the Experimenter's Board Settings Options to set various parameters like contrast, brightness, etc. UserExperience.c Main MSP-EXP430F5529 Experimenter Board file MSP-EXP430F5529 User Experience Manifest.pdf readme.txt 16 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com MSP-EXP430F5529 Hardware 4 MSP-EXP430F5529 Hardware 4.1 Hardware Overview Figure 5 and Figure 6 show the functional blocks and connections of the MSP-EXP430F5529 Experimenter Board. The area of the PCB labeled as "eZ430-FET Emulator" and bordered by a thick broken line on the PCB silk screen is an integrated TI Flash Emulation Tool (FET) which is connected to the Experimenter Board by the jumpers on JP16. This module is similar to any eZ430 emulator, and provides real-time in-system Spy-Bi-Wire programming and debugging via a USB connection to a PC. Using the eZ430-FET Emulator module eliminates the need for using an external MSP430 Flash Emulation Tool (MSP-FET430UIF). However, full speed 4-wire JTAG communication is only possible with a MSP-FET430UIF connected to the "5529 JTAG" header. For additional details on the installation and usage of the Flash Emulation Tool, Spy-Bi-Wire and JTAG, see the MSP430 Hardware Tools User's Guide (SLAU278). Figure 5. Simple Hardware Overview SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 17 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated MSP-EXP430F5529 Hardware www.ti.com Figure 6. Hardware Block Details 4.2 Jumper Settings and Power Figure 7 shows the common jumper settings, depending on the power source for the MSP-EXP430F5529 Experimenter Board. Figure 7. Common Power Jumper Settings 18 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com MSP-EXP430F5529 Hardware There are also other jumpers available for current measurement, disconnection of certain peripherals, and other advanced options (see Table 1). The black line on the board below the jumpers JP8 (LDO) and JP11 (JTAG) indicates the default jumper position. Table 1. MSP-EXP430F5529 Jumper Settings and Functionality Header Functionality When Jumper Present Functionality When Jumper Absent JP2 – POT Connects pin P8.0 to potentiometer Disconnects pin P8.0 to potentiometer JP3 – LED1 Connects pin P1.0 to LED1 Disconnects pin P1.0 to LED1 JP6 – 430 PWR Provides power to MSP430F5529. Also used to measure current MSP430F5529 is not powered. consumption of the MSP430F5529. NOTE: The two large vias near the "430 PWR" label on the PCB are connected to JP6 as well. These vias can be used to easily connect a test lead onto the PCB for current consumption measurement. JP7 – SYS PWR Provides power to the entire MSP-EXP430F5529 board. Also MSP-EXP430F5529 Experimenter used to measure current consumption of the entire board. Board system devices are not powered. JP8 – LDO Only applicable when powering via "5529 USB" connection. No connection to MSP430 VCC when powered via "5529 USB". ALT (Default): Connects the alternate LDO (TPS73533) to the MSP430 VCC. INT: Connects the internal 'F5529 LDO to the MSP430 VCC. JP11 – JTAG Only applicable when powering via JTAG connection. JTAG tool does NOT provide power to system. EXT (Default): JTAG tool does NOT provide power to system. INT: JTAG tool will provide power to system. JP14 – RF PWR Connects system VCC to the RF headers: J12, J13, and RF2. RF headers: J12, J13, and RF2 do not have power. JP15 – USB PWR Connects USB 5-V power to MSP430F5529 and Alternate LDO USB 5-V power not connected to (TPS73533). system. JP16 – eZ-FET DVCC: Connects MSP430 V No connection between CC to eZ-FET Connection MSP430F5529 and the eZ-FET. TXD / RXD: Connects UART between F5529 and eZ-FET. RST / TEST: Connects Spy-Bi-Wire JTAG between F5529 and eZ-FET. SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 19 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated MSP-EXP430F5529 Hardware www.ti.com Figure 8 shows a visual diagram of the power connections for the MSP-EXP430F5529 Experimenter Board. Care should be observed when using multiple power sources such as USB and a battery at the same time. This could lead to the battery being charged if the power settings are not correct. Figure 8. Visual Power Schematic 20 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com MSP-EXP430F5529 Hardware Figure 9 shows a method of connecting a multi-meter to the MSP-EXP430F5529 to measure the current of the MSP430F5529. Figure 9. MSP430 Current Measurement Connection 4.3 eZ-FET Emulator The connection between the eZ-FET emulator and the MSP-EXP430F5529 can be opened by removing the jumpers on JP16. This is necessary only to ensure there is no interaction between the two sub-systems. The eZ-FET Emulator can program other eZ430 tools such as the eZ430-F2013 target board as well. A six-pin header on J17 would need be installed on the PCB for this feature. The USB interface on the eZ-FET emulator also allows for UART communication with a PC host, in addition to providing power to Experimenter Board when the power switch is set to 'eZ'. The USCI module in the MSP430F5529 supports the UART protocol that is used to communicate with the TI TUSB3410 device on the eZ-FET emulator for data transfer to the PC. 4.4 MSP-EXP430F5529 Hardware Components 4.4.1 Dot-Matrix LCD The EA DOGS102W-6 is a dot-matrix LCD with a resolution of 102x64 pixels. The LCD has a built-in back-light driver that can be controlled by a PWM signal from the MSP430F5529, pin P7.6. The MSP430F5529 communicates with the EA DOGS102W-6 via an SPI-like communication protocol. To supplement the limited set of instructions and functionalities provided by the on-chip LCD driver, an LCD driver has been developed for the MSP430F5529 to support additional functionalities such as font set and graphical utilities. More information on the LCD can be obtained from the manufacturer's data sheet. SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 21 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated MSP-EXP430F5529 Hardware www.ti.com 4.4.2 Push Buttons, Potentiometer, and LEDs Table 2 describes the pin connections for the potentiometer, push-button switches, and the on-board LEDs. Table 2. Push Buttons, Potentiometer, and LED Connections Peripheral Pin Connection Potentiometer Wheel P8.0 Switch 1 (S1) P1.7 Switch 2 (S2) P2.2 RESET Switch (S3) RST / NMI LED1 P1.0 LED2 P8.1 LED3 P8.3 Capacitive Touch Pad 1 (Cross) P1.1 Capacitive Touch Pad 2 (Square) P1.2 Capacitive Touch Pad 3 (Octagon) P1.3 Capacitive Touch Pad 4 (Triangle) P1.4 Capacitive Touch Pad 5 (Circle) P1.5 4.4.3 Wireless Evaluation Module Interface Included in the communication peripherals are the headers that support the CC-EM boards from TI. The transceiver modules connect to the USCI of the MSP430F5529 configured in SPI mode using the UCB0 peripheral. Libraries that interface the MSP430 to these transceivers are available at www.ti.com/msp430 under the Code Examples tab. The RF PWR jumper must be populated to provide power to the EM daughterboard. The following radio daughter cards are compatible with the MSP-EXP430F5529 Experimenter Board: • CC1100EMK/CC1101EMK – Sub-1-GHz radio • CC2500EMK – 2.4-GHz radio • CC2420EMK/CC2430EMK – 2.4-GHz 802.15.4 [SoC] radio • CC2520EMK/CC2530EMK – 2.4-GHz 802.15.4 [SoC] radio • CC2520 + CC2591 EM (if R4 and R8 0-Ω resistors are connected) NOTE: Future evaluation boards may also be compatible with the header connections. 4.4.4 eZ430-RF2500T Interface The eZ430-RF2500T module can be attached to the MSP-EXP430F5529 Experimenter Board in one of two ways – through an 18-pin connector (J12 – eZ RF) or a 6-pin connector (J13 – eZ RF Target). The pins on the eZ430-RF2500T headers are multiplexed with the pins on the CC-EM headers, which allows the EZ430-RF2500T module to behave identically to a CC-EM daughterboard. Power must be provided to the EZ430-RF2500T module by setting the jumper RF PWR (JP14). The eZ430-RF2500T connection should always be made with the antenna facing off of the board. For more information on the connections to the required eZ430-RF2500T, see the eZ430-RF2500 Development Tool User's Guide (SLAU227), available through www.ti.com/ez430. 22 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com MSP-EXP430F5529 Hardware 4.4.5 Three-Axis Accelerometer The MSP-EXP430F5529 Experimenter Board includes a VTI digital three-axis accelerometer (part number CMA3000-D01). The accelerometer supports SPI communication and outputs data for each X, Y and Z axis. The accelerometer is powered through pin P3.6. This interface, especially in conjunction with other on-board interfaces such as the LCD, enables several potential applications such as USB mouse movement emulation and tilt sensing. The example software used the accelerometer for the Tilt Puzzle, Demo Cube, and USB Mouse. For more information on the accelerometer chip, see the manufacturer's data sheet (http://www.vti.fi). 4.4.6 Pin Access Headers The MSP-EXP430F5529 Experimenter Boards includes three headers (J4, J5, and J12) that can be used as additional connections to external hardware or for signal analysis during firmware development. All pins except the GND pin are internally selectable as either general purpose input/output pins or as described in the device datasheet. Table 3. Pinning Mapping for Header J4 Pin Description Port Pin Port Pin Pin Description Vcc VCC P6.6 CB6 / A6 UCA1RXD / UCA1SOMI P4.5 P8.1 GPIO – LED2 UCA1TXD / UCA1SIMO P4.4 P8.2 GPIO – LED3 GPIO P4.6 P8.0 GPIO – POT GPIO P4.7 P4.5 UCA1RXD / UCA1SOMI A9 / VREF- / VeREF- P5.1 P4.4 UCA1TXD / UCA1SIMO GND GND P6.7 CB7 / A7 Table 4. Pin Mapping for Header J5 Pin Description Port Pin Port Pin Pin Description VCC VCC P7.0 CB8 / A12 UCB1SOMI / UCB1SCL - SD P4.2 P7.1 CB9 / A13 UCB1SIMO / UCB1SDA - LCD/SD P4.1 P7.2 CB10 / A14 UCB1CLK / UCA1STE - LCD/SD P4.3 P7.3 CB11 / A15 UCB1STE / UCA1CLK - RF P4.0 P4.1 UCB1SIMO / UCB1SDA - LCD/SD TB0OUTH / SVMOUT - SD P3.7 P4.2 UCB1SOMI / UCB1SCL - SD GND GND P7.7 TB0CLK / MCLK Table 5. Pin Mapping for Header J12 Pin Description Port Pin Port Pin Pin Description (RF_STE) P2.6 P3.0 (RF_SIMO) (RF_SOMI) P3.1 P3.2 (RF_SPI_CLK) TA2.0 P2.3 P2.1 TA1.2 TB0.3 P7.5 GND GND GPIO P4.7 P2.4 TA2.1 (RXD) P4.5 P4.6 GPIO (TXD) P4.4 P4.0 UCx1xx (LED1) P1.0 P2.0 TA1.1 GND GND RF_PWR RF_PWR SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 23 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Frequently Asked Questions, References, and Schematics www.ti.com 5 Frequently Asked Questions, References, and Schematics 5.1 Frequently Asked Questions 1. Which devices can be programmed with the Experimenter Board? The MSP-EXP430F5529 board is designed specifically to demonstrate the MSP430F5529. 2. The MSP430F5529 is no longer accessible via JTAG. Is something wrong with the device? Verify that the jumpers are configured correctly. See Section 4 for jumper configuration. Verify that the target device is powered properly. If the target is powered locally, verify that the supplied VCC is sufficient to power the board. Check the device data sheet for the specification. 3. I did every step in the previous question but still could not use or communicate with the device. Improper programming of the device could lead to a JTAG total lockup condition. The cause of this problem might be an incorrect device selection when creating a new project in CCS (select MSP430F5529) or programming the device without a stable power source (low battery, switching the Power Selector while programming, or absence of the MSP430 power jumper JP6 during programming). To solve this, completely reset the device. First unplug all power sources and connections (JTAG and USB cables). Set the Power Selector Switch to FET mode. Use a jumper cable to briefly short one of the GND test points with the 430 PWR test point. The device should now be released from the lockup state. 4. Does the Experimenter board protect against blowing the JTAG fuse of the target device? No. Fuse blow capability is inherent to all flash-based MSP430 devices to protect user's intellectual property. Care must be taken to avoid the enabling of the fuse blow option during programming, because blowing the fuse would prevent further access to the MSP430 device via JTAG. 5. I am measuring system current in the range of 30 mA, is this normal? The LCD and the LCD backlight require a large amount of current (approximately 20 mA to 25 mA) to operate. This results in a total system current consumption in the range of 30 mA. If the LCD backlight is on, 30 mA is considered normal. To ensure the board is OK, disable the LCD and the LCD backlight and measure the current again. The entire board current consumption should not exceed 10 mA at this state. Note that the current consumption of the board could vary greatly depending on the optimization of the board configurations and the applications. The expected current consumption for the MSP430F5529 in standby mode (LPM3), for example, is ~2 μA. Operating at 1 MHz, the total current consumption should not exceed ~280 μA. 6. I have trouble reading the LCD clearly. Why is the LCD contrast setting so low? The LCD contrast is highly dependent on the voltage of the system. Changing power source from USB (3.3 V) to batteries (~3 V) could drastically reduce the contrast. Fortunately, the LCD driver supports adjustable contrast. The specific instruction can be found in the LCD user's guide. The MSP-EXP430F5529 software also provides the function to adjust the contrast using the wheel (see Section 2.8). 7. When I run the example code, nothing happens on the LCD. Verify that all jumpers are installed correctly and the 14-pin JTAG cable are properly connected. 5.2 References • MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208) • Code Composer Studio (CCStudio) Integrated Development Environment (IDE) (http://focus.ti.com/docs/toolsw/folders/print/msp-ccstudio.html) • MSP430 Interface to CC1100/2500 Code Library (PDF: SLAA325) (Associated Files: SLAA325.ZIP) 24 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Frequently Asked Questions, References, and Schematics 5.3 Schematics and BOM The following pages show the schematics and BOM. In addition, the original Eagle CAD schematics and Gerber files are available for download (SLAR055). Figure 10. Schematics (1 of 7) SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 25 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Frequently Asked Questions, References, and Schematics www.ti.com Figure 11. Schematics (2 of 7) 26 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Frequently Asked Questions, References, and Schematics Figure 12. Schematics (3 of 7) SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 27 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Frequently Asked Questions, References, and Schematics www.ti.com Figure 13. Schematics (4 of 7) 28 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Frequently Asked Questions, References, and Schematics Figure 14. Schematics (5 of 7) SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 29 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Frequently Asked Questions, References, and Schematics www.ti.com Figure 15. Schematics (6 of 7) 30 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Frequently Asked Questions, References, and Schematics Figure 16. Schematics (7 of 7) SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 31 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Frequently Asked Questions, References, and Schematics www.ti.com Table 6. Bill of Materials Part Value Package Type Device C1 47pF 0805 C2 12pF 0805 C3 DNP 0603 C4 12pF 0805 C5 10μF 0805 C6 47pF 0805 C7 100nF 0805 C8 220n 0603 C9 220n 0603 C10 10uF/6,3V 1210 C11 100n 0603 C12 100n 0805 C13 100n 0805 C14 DNP 0603 C15 10uF/6,3V 1210 C16 100n 0805 C17 470n 0805 C18 10μF 0805 C19 100nF 0805 C20 .1u 0603 C21 .1u 0603 C22 1μF 0805 C23 1μF 0805 C24 1μF 0805 C25 1μF 0805 C26 1μF 0805 C27 1μF 0805 C28 4.7uF 0805 C29 10nF 0805 C30 1μF 0805 C31 .1u 0603 C32 4.7u 0805 C33 0.1u 0603 C34 4u7 0603 C35 10p 0603 C36 10p 0603 C37 10n 0402 C38 33p 0402 C39 33p 0402 C40 1u/6.3V 0603 C41 100n 0402 C42 1u/6.3V 0603 C43 100n 0402 C44 1u/6.3V 0603 C45 22p 0402 C46 22p 0402 C47 100n 0402 C48 100n 0402 C49 100n 0402 C50 10uF/6,3V 1210 CON1 8PIN_SM_MA_HEADER HEADER 2x4 MALE .1" SMD CON2 8PIN_SM_MA_HEADER HEADER 2x4 MALE .1" SMD 32 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Frequently Asked Questions, References, and Schematics Table 6. Bill of Materials (continued) Part Value Package Type Device CON3 8PIN_SM_MA_HEADER HEADER 2x4 MALE .1" SMD D1 LLSD103A-7 Mini MELF D2 1N4148 Micro MELF SOD110-R J1 103308-2 14-Pin Male JTAG Connector JP2 POT_JMP HEADER 1x2 MALE .1" TH JP1E\SMALL_PIN JP3 LED_JMP HEADER 1x2 MALE .1" TH JP1E\SMALL_PIN J4 HEADER - F5529 PIN ACCESS HEADER 2x7 MALE .1" TH J5 HEADER - F5529 PIN ACCESS HEADER 2x7 MALE .1" TH JP6 430_PWR HEADER 1x2 MALE .1" TH JP1E JP7 SYS_PWR HEADER 1x2 MALE .1" TH JP1E JP8 LDO_PWR_SEL HEADER 1x3 MALE .1" TH PINHD-1X3/SMALL_PIN J9 22-03-5035 MOLEX 3-PIN MALE HEADER 22-03-5035 J10 HEADER - PWR HEADER 1x3 MALE .1" TH PINHD-1X3 JP11 JTAG_PWR_SEN HEADER 1x3 MALE .1" TH PINHD-1X3/SMALL_PIN J12 eZ-RF1 HEADER - RF2500 HEADER 2x9 MALE .1" TH J13 6-Pin Male eZ430 Connector 6-Pin Male eZ430 Connector SL127L6TH JP14 RF_PWR HEADER 1x2 MALE .1" TH JP1E JP15 USB_PWR HEADER 1x2 MALE .1" TH JP1E JP16 eZ430-FET_JMP HEADER 2x5 MALE .1" TH JP5Q J17 6-Pin Male eZ430 Connector 6-Pin Male eZ430 Connector SL127L6TH LED1 LEDCHIPLED_0603 0603 LEDCHIPLED_0603 LED2 LEDCHIPLED_0603 0603 LEDCHIPLED_0603 LED3 LEDCHIPLED_0603 0603 LEDCHIPLED_0603 LED4 OSRAM TOPLED Santana Blue LED 0805 (Surface Mount Bottom) OSRAM TOPLED Santana Blue LED LED5 OSRAM TOPLED Santana Blue LED 0805 (Surface Mount Bottom) OSRAM TOPLED Santana Blue LED LED6 OSRAM TOPLED Santana Blue LED 0805 (Surface Mount Bottom) OSRAM TOPLED Santana Blue LED LED7 OSRAM TOPLED Santana Blue LED 0805 (Surface Mount Bottom) OSRAM TOPLED Santana Blue LED LED8 OSRAM TOPLED Santana Blue LED 0805 (Surface Mount Bottom) OSRAM TOPLED Santana Blue LED LED9 LEDCHIPLED_0603 0603 LED_0603D0603 PAD1 CAP_TOUCH_PAD CAP_TOUCH_PAD PROJECT7264_CC430_PAD PAD2 CAP_TOUCH_PAD CAP_TOUCH_PAD PROJECT7264_CC430_PAD PAD3 CAP_TOUCH_PAD CAP_TOUCH_PAD PROJECT7264_CC430_PAD PAD4 CAP_TOUCH_PAD CAP_TOUCH_PAD PROJECT7264_CC430_PAD PAD5 CAP_TOUCH_PAD CAP_TOUCH_PAD PROJECT7264_CC430_PAD POT1 EVL-HFKA05B54 POT EVL-HFKA05B54 Q1 MS3V-T1R 32.768kHz CL Clock Crystal 32kHz F20XX_PIR_DEMO_&_EVAL_CM200T Q2 SMD Oscillator 4MHz SMD Oscillator 4MHz QUARZ_HC49_4P-1 Q3 SMD Oscillator 12MHz SMD Oscillator 12MHz XTL_FT7AFT10A R1 47k 0603 R-US_R0603 R2 0R 0603 R-US_R0603 R3 470R 0603 R-US_R0603 R4 470R 0603 R-US_R0603 R5 470R 0603 R-US_R0603 R6 47k 0603 R-US_R0603 R7 680 0805 RES0805 R8 680 0805 RES0805 R9 680 0805 RES0805 R10 680 0805 RES0805 R11 680 0805 RES0805 R12 100K 0603 R-US_R0603 R13 100k 0603 R-US_R0603 SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 33 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Frequently Asked Questions, References, and Schematics www.ti.com Table 6. Bill of Materials (continued) Part Value Package Type Device R14 100k 0603 R-US_R0603 R15 100K 0603 R-US_R0603 R16 100k 0603 R-US_R0603 R17 47k 0603 R-US_R0603 R18 47k 0603 R-US_R0603 R19 0 0603 R-US_R0603 R20 100k 0603 R-US_R0603 R21 36k 1% 0603 R-US_R0603 R22 27R 0603 R-US_R0603 R23 27R 0603 R-US_R0603 R24 1M 0603 R-US_R0603 R25 1k4 0603 R-US_R0603 R26 100R 0603 R-US_R0603 R27 33k 0603 R-US_R0603 R28 47k 0402 R_SMDR0402 R29 47k 0402 R_SMDR0402 R30 47k 0402 R_SMDR0402 R31 100R 0402 R_SMDR0402 R32 100R 0402 R_SMDR0402 R33 270 0402 R_SMDR0402 R34 DNP 0402 R_SMDR0402 R35 100R 0402 R_SMDR0402 R36 100R 0402 R_SMDR0402 R37 6k8 0402 R_SMDR0402 R38 3k3 0402 R_SMDR0402 R39 10k 0402 R_SMDR0402 R40 15k 0402 R_SMDR0402 R41 33k 0402 R_SMDR0402 R42 1k5 0402 R_SMDR0402 R43 33R 0402 R_SMDR0402 R44 DNP (47k) 0402 R_SMDR0402 R45 DNP (47k) 0402 R_SMDR0402 R46 33R 0402 R_SMDR0402 R47 100k/1% 0402 R_SMDR0402 R48 33k 0402 R_SMDR0402 R49 3k3 0402 R_SMDR0402 R50 100k/1% 0402 R_SMDR0402 R51 3k3 0402 R_SMDR0402 R52 100R 0402 R_SMDR0402 R53 1k5 0402 R_SMDR0402 R54 1k5 0402 R_SMDR0402 RF1 CCxxxx RF EVM HEADER CCXXXX_20PIN TFM-110-02-SM-D-A-K RF2 CCxxxx RF EVM HEADER CCXXXX_20PIN TFM-110-02-SM-D-A-K S1 USER1 PUSHBUTTON BUTTON EVQ-11L05R S2 USER2 PUSHBUTTON BUTTON EVQ-11L05R S3 F5529 RESET PUSHBUTTON BUTTON EVQ-11L05R S4 F5529 USB BSL PUSHBUTTON BUTTON EVQ-11L05R SW1 POWER SELECT SWITCH DP3T_SWITCH JS203011CQN TP1 F5529 VREF+ TEST POINT TEST_POINT - TP2 F5529 VCORE TEST POINT TEST_POINT - TP3 CC430 EM TEST POINT TEST_POINT - 34 MSP-EXP430F5529 Experimenter Board SLAU330A–May 2011–Revised June 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated www.ti.com Frequently Asked Questions, References, and Schematics Table 6. Bill of Materials (continued) Part Value Package Type Device TP4 CC430 EM TEST POINT TEST_POINT - TP5 CC430 EM TEST POINT TEST_POINT - TP6 CC430 EM TEST POINT TEST_POINT - TP7 CC430 EM TEST POINT TEST_POINT - TP8 CC430 EM TEST POINT TEST_POINT - TP9 eZ430 F16x TEST POINT (EZ_VBUS) TEST_POINT - TP10 eZ430 F16x TEST POINT (RESET) TEST_POINT - TP11 eZ430 F16x TEST POINT (GND) TEST_POINT - TP12 eZ430 F16x TEST POINT (HTCK) TEST_POINT - TP13 eZ430 F16x TEST POINT (HTMS) TEST_POINT - TP14 eZ430 F16x TEST POINT (HTDI) TEST_POINT - TP15 eZ430 F16x TEST POINT (HTDO) TEST_POINT - U1 F5529 - MSP430F5529 80-LQFP MSP430F5529IPNR U2 3-AXIS SPI/I2C ACCELEROMETER SMD CMA3000 CMA3000-D01 U3 102x64 LCD DISPLAY EA DOGS102-6 EA DOGS102-6 U3 LED BACKLIGHT EA DOGS102-6 EA LED39x41-W U4 Alternate LDO - TPS73533 SC70-5 TPS73533DRBT U5 LED Backlight Current Source - TPS75105 SON-10 TPS75105DSKR U6 F5529 USB ESD Protection - TPD2E001 SOT-5 TPD2E001DRLR U7 eZ430 - MSP430F16x 64-LQFP MSP430F1612IPMR U8 eZ430 Level Translator - TXS0104E 14-TSSOP TXS0104EPWR U9 eZ430 LDO - TPS77301 8-MSOP TPS77301DGK U10 eZ430 - TUSB3410 32-LQFP TUSB3410VF U11 eZ430 USB ESD Protection - TPD2E001 SOT-5 TPD2E001DRLR U12 eZ430 EEPROM - CAT24C128YI 8-TSSOP CAT24C128YI USB1 F5529 USB Mini-USB Through Hole 54819-0519 USB2 eZ430 USB Mini-USB Through Hole 54819-0519 X1 microSD Card Holder microSD Card Holder 502702-0891 SLAU330A–May 2011–Revised June 2011 MSP-EXP430F5529 Experimenter Board 35 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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Hardware User Guide STK525 Hardware User Guide User Guide 1 7608A–AVR–04/06 Section 1 Introduction ........................................................................................... 1-3 1.1 Overview ...................................................................................................1-3 1.2 STK525 Starter Kit Features .....................................................................1-4 Section 2 Using the STK525................................................................................. 2-6 2.1 Overview ...................................................................................................2-6 2.2 Power Supply ............................................................................................2-7 2.3 RESET ....................................................................................................2-10 2.4 AT90USBxxx AVR Microcontroller..........................................................2-11 2.5 Serial Links .............................................................................................2-11 2.6 On-board Resources...............................................................................2-14 2.7 STK500 Resources .................................................................................2-19 2.8 In-System Programming .........................................................................2-20 2.10 Test Points ..............................................................................................2-23 2.11 Configuration Pads .................................................................................2-24 2.12 Solder Pads ............................................................................................2-25 Section 3 Troubleshooting Guide ....................................................................... 3-26 Section 4 Technical Specifications ..................................................................... 4-27 Section 5 Technical Support............................................................................... 5-28 Section 6 Complete Schematics......................................................................... 6-29 STK525 Hardware User Guide 1-3 7608A–AVR–04/06 Section 1 Introduction Congratulation for acquiring the AVR® STK525 Starter Kit. This kit is designed to give designers a quick start to develop code on the AT90USBxxx and for prototyping and testing of new designs. 1.1 Overview This document describes the STK525 dedicated to the AT90USBxxx AVR microcontroller. This board is designed to allow an easy evaluation of the product using demonstration software. To complement the evaluation and enable additional development capability, the STK525 can be plugged into the Atmel STK500 Starter Kit Board in order to use the AT90USBxxx with advanced features such as variable VCC, variable VRef, variable XTAL, etc. and supports all AVR development tools. To increase its demonstrative capabilities, this stand alone board has numerous onboard resources (USB, RS232, joystick, data-flash, microphone and temperature sensor). This user guide acts as a general getting started guide as well as a complete technical reference for advanced users. Introduction 1-4 STK525 Hardware User Guide 7608A–AVR–04/06 Figure 1-1 . STK525 Board 1.2 STK525 Starter Kit Features The STK525 provides the following features: 􀀀 AT90USBxxx TQFP device (2.7V 1.0 STK500 Expand connectors A4 Tuesday , January 17, 2006 2 4 STKNC Important: Def ault conf iguration: open reserv ed f or f uture mass storage extension 3.3V SP3 STK525 MEZZANINE FOR STK500 NRST STKNC VTG XTAL1 PA0 R8 2k PB7 PB3 PB5 PD5 PD7 PB1 PB6 PD1 PD3 PB2 PB4 PD6 PB0 PD2 PD4 C12 1nF PD0 1 2 AREF JP3 STK AREF VTG REF XT1 XT2 PE[2..0] VTG VTG PE[2..0] VTG PC[7..0] PC[7..0] PB[7..0] PD[7..0] PA[7..0] PA[7..0] PA5 PA7 PA6 PA1 PA3 PA4 1 2 JP1 STK X1 PA2 1 2 JP2 STK X2 PB[7..0] Complete Schematics STK525 Hardware User Guide 6-33 7608A–AVR–04/06 Figure 6-3 . Schematics, 3 of 5 Data Flash 3.3V LEDs 3.3V PF[7..0] DECOUPLING CAPACITOR CLOSE TO THE CONNECTOR R19 POT 100k Select 5 Lef t 7 Up 3 Right 6 Down 4 Com1 1 Com2 2 SW3 TPA511G PF[7..0] Temp Sensor PB[7..0] R18 NCP18WF104J03RB 5 9 4 8 3 7 2 6 1 10 11 P1 SUB-D9 FEMALE RS232 1234 J7 PF Spare (Not mounted) RS232 Interface JTAG Interface RS-CTS 3.3V Serial ISP Interface PE[7..0] CP1 VCC R16 100k STK525 MEZZANINE FOR STK500 3.3V VCC BUSY 1 RESET 2 WP 3 VCC 6 GND 7 CS 11 SCK 12 SI 13 SO 14 U2 AT45DB321C TSOP28 Microphone Preamplifier Interface PF0 VCC PB[7..0] CTS Title Size Document Number Rev Date: Sheet of 1.0 Interf aces A4 Tuesday , January 17, 2006 3 4 C20 100nF RTS CP2 R23 100k . 11 . 12 . 10 . 9 . 8 . 7 . 13 . 14 . 15 . 16 C1+ 1 V+ 2 C1- 3 C2+ 4 C2- 5 V- 6 TTL RS 232 GND VCC U3 MAX3232 RS232 BUFFER C17 100nF C16 100nF C18 100nF PF1 C19 100nF PD2 RxD DECOUPLING CAPACITOR CLOSE TO THE DEVICE RS-TxD RS-RxD PD[7..0] VCC PF0 1 TP4 Mic VCC DECOUPLING CAPACITOR CLOSE TO THE DEVICE C15 100nF PF1 SP4 PF2 SP5 VCC Caution DataFlash Fix 3V Power supply Only PF3 PB[7..0] C26 100nF RESET R11 100k CP3 DECOUPLING CAPACITOR CLOSE TO THE CONNECTOR PB5 PDO 1 VCC 2 SCK 3 PDI 4 RESET 5 GND 6 CON 2x3 J5 ISP CON TCK 1 GND 2 TDO 3 VCC 4 TMS 5 RESET 6 VCC 7 n.c. 8 TDI 9 GND 10 CON 2x5 J4 JTAG CON C21 100nF C23 100nF PD1 PF4 PF6 PF7 PF5 RESET PB1 R17 0 PB2 PB3 3.3V PB6 PD0 VCC PD3 TXD SP7 PB7 5 6 7 8 4 + - U4B LMV358 3 2 1 8 4 + - U4A LMV358 R27 0 R26 22k R25 10k R24 100k PB4 + C25 1uF R21 100k R28 100k C22 220pF + C24 4.7uF 3.3V R20 2.2k MIC1 MICROPHONE R22 100k DECOUPLING CAPACITOR CLOSE TO THE DEVICE PE4 PB1 R10 100k PF2 In-line Grouped LEDs RESET TOPLED LP M676 D2 LED 0 (green) TOPLED LP M676 D3 LED 1 (green) TOPLED LP M676 D4 LED 2 (green) TOPLED LP M676 D5 LED 3 (green) PB2 1k R12 1k R13 PE5 1k R14 1k R15 PD4 PB3 PD5 PD7 PD[7..0] PD6 SP8 RS-RTS Joystick Interface Complete Schematics 6-34 STK525 Hardware User Guide 7608A–AVR–04/06 Figure 6-4 . Schematics, 4 of 5 - C30 4.7uF VTG IN GND OUT U8 LM340 VBUS generator f or OTG/HOST mode 1F 1.0 POWER A4 Tuesday , January 17, 2006 4 4 5V C32 220nF 1 2 3 4 5 6 7 8 JP6 VCC Source VCC - C34 4.7uF 2 1 3 JP7 VBUS gen D6 LL4148 R32 10k R35 100k 1% 3 1 4 2 - + U7 DF005S 321 J6 CONNECTOR JACK PWR Ext Power Supply C33 100nF C29 33nF UVCON VBUS OUT 1 IN 2 GND 3 OUT 4 FAULT SHDN 8 7 CC 6 SET 5 U6 LP3982 Complete Schematics STK525 Hardware User Guide 6-35 7608A–AVR–04/06 Figure 6-5 . Assembly Drawing, 1 of 2 (component side) Figure 6-6 . Assembly Drawing, 2 of 2 (solder side) Complete Schematics 6-36 STK525 Hardware User Guide 7608A–AVR–04/06 Table 6-1 . Bill of material Item Q.ty Reference Part Tech. Characteristics Package 1 2 CR1,CR2 PGB0010603 ESD protection CASE 0805 2 19 C1,C2,C3,C4,C5,C6,C13,C14,C15,C16,C 17,C18,C19,C20,C21,C23,C26,C27,C33 100nF 50V-10% Ceramic CASE 0805 3 2 C7,C25 1uF 10Vmin ±10% EIA/IECQ 3216 4 3 C8,C9,C32 220nF 50V-10% Ceramic CASE 0805 5 2 C10,C11 15pF 50V-5% Ceramic CASE 0805 6 1 C12 1nF 50V-5% Ceramic CASE 0805 7 1 C22 220pF 50V-5% Ceramic CASE 0805 8 5 C24,C28,C30,C31,C34 4.7uF 10Vmin ±10% EIA/IECQ 3216 9 1 C29 33nF 50V-5% Ceramic CASE 0805 10 3 CP1, CP2, CP3 Configuration Pad 11 1 D1 BAT54/SOT Vf=0.3V SOT23 12 5 D2,D3,D4,D5,D8 TOPLED LP M676 Green I=10 mA_ PLCC-2 13 2 D6,D7 LL4148 i=200mA max LL-34 14 5 JP1,JP2,JP3,JP4,JP5 JUMPER 1x2 Need 1 shunt 0,1" pitch 15 1 J1 USB_MiniABF USB mini AB receptacle Surface mount 16 2 J2,J3 CON 2x20 17 1 J4 CON 2x5 18 1 J5 CON 2x3 19 1 J7 CON 2x2 Not Mounted 20 1 JP6 JUMPER 2x4 Need 1 shunt 0,1" pitch 21 1 J6 CONNECTOR JACK PWR Int.Diam=2.1mm PCB Embase 22 1 JP7 JUMPER 3x1 23 1 L1 BLM-21A102S FERRITE BEAD 1 KOhms at 100 MHz CASE 0805 24 1 MIC1 MICROPHONE Electret Cap Mic 25 1 M1 FDV304P/FAI MOSFET P SOT23 26 1 P1 SUB-D9 FEMALE 90° with harpoons 27 2 Q1,Q2 BC847B NPN IC peak=200mA SOT23 28 2 R1,R2 22 1/16W-5% SMD CASE 0602 29 2 R3,R5 47k 1/16W-5% SMD CASE 0603 30 5 R4,R6,R7,R17,R27 0 CASE 0603 31 1 R8 2k CASE 0604 32 4 R9,R25,R29,R32 10k 1/16W-5% SMD CASE 0603 Complete Schematics STK525 Hardware User Guide 6-37 7608A–AVR–04/06 6.0.1 Default Configuration - Summary Table 6-2 . Default Configuration summary 33 9 R10,R11,R16,R21,R22,R23,R24,R28,R33 100k 1/16W-5% SMD CASE 0603 34 5 R12,R13,R14,R15,R34 1k 1/16W-5% SMD CASE 0603 35 1 R18 NCP18WF104J03RB 100K - ß=4250 CASE 0603 36 1 R19 POT 100k PT10MH104ME 37 1 R19 Button Pot Button 38 1 R20 2.2k 1/16W-5% SMD CASE 0603 39 1 R26 22k 1/16W-5% SMD CASE 0603 40 1 R30, R35 100k 1% 1/16W-1% SMD CASE 0603 41 1 R31 120k 1% 1/16W-1% SMD CASE 0603 42 6 SP1,SP2,SP3,SP4,SP5,SP6 SolderPad (NA) (NA) 43 2 SW1,SW2 PUSH-BUTTON 6x3.5mm - 1.6N 44 1 SW3 TPA511G 4+1 ways joystick CMS 45 8 TP1,TP2,TP3,TP4,TP5,TP6, TP7, TP8 TEST POINT Diam.=1.32mm 46 1 U1 AT90USBxxx TQFP64 47 1 U1 Socket TQFP64 ZIF 48 1 U2 AT45DB321C TSOP28 49 1 U3 MAX3232ECAE+ SSOP16 50 1 U4 LMV358 SO8 51 1 U5 TPS2041A SOIC8 52 1 U6 LP3982 Low Drop Out Vin Max 6V, 300mA MSOP8 53 1 U7 DF005S Bridge rectifier See DS 54 1 U8 LM340 Reg 5V CMS SOT223 55 1 Y1 8MHz CRYSTAL H=4mm HC49/4H Item Q.ty Reference Part Tech. Characteristics Package Name Ref. Function State Jumpers STKX1 JP1 XTAL Configuration OFF STKX2 JP2 XTAL Configuration OFF Aref JP3 STK500 Analog Ref OFF VTG33 JP4 Short 3.3V to VTG (Mass storage extension board) OFF UCAP JP5 Short UCAP with Uvcc OFF Vcc Src JP6 Vcc Selection 3.4 shorted Vbus Gen JP7 VBUS generation selection (host mode) 2.3 shorted Solder PADS Complete Schematics 6-38 STK525 Hardware User Guide 7608A–AVR–04/06 SP1 Bypass L1 OPEN SP2 OPEN SP3 3.3V on Expand 0 NC pin OPEN SP4 CTS OPEN SP5 RTS OPEN SP6 Bypass limiter OPEN SP7 RS232 hardware control enable OPEN SP8 RS232 hardware control enable OPEN Configuration PADS CP1 Bypass CTN in on PF0 CLOSE CP2 Bypass Potentiometer ADC in on PF1 CLOSE CP3 Bypass Mic In on PF2 CLOSE Name Ref. Function State Printed on recycled paper. 7608A–AVR–04/06 /xM © Atmel Corporation 2006. All rights reserved. Atmel®, logo and combinations thereof, are registered trademarks, and Everywhere You Are® are the trademarks of Atmel Corporation or its subsidiaries. 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Atmel Corporation Atmel Operations 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-30-00 Fax: (33) 4-76-58-34-80 Literature Requests www.atmel.com/literature MSP430 Hardware Tools User's Guide Literature Number: SLAU278R May 2009–Revised May 2014 Contents Preface ........................................................................................................................................ 8 1 Get Started Now!................................................................................................................ 11 1.1 Flash Emulation Tool (FET) Overview................................................................................... 12 1.2 Kit Contents, MSP-FET430PIF........................................................................................... 13 1.3 Kit Contents, eZ430-F2013 ............................................................................................... 13 1.4 Kit Contents, eZ430-T2012 ............................................................................................... 13 1.5 Kit Contents, eZ430-RF2500 ............................................................................................. 13 1.6 Kit Contents, eZ430-RF2500T............................................................................................ 13 1.7 Kit Contents, eZ430-RF2500-SEH....................................................................................... 13 1.8 Kit Contents, eZ430-Chronos-xxx........................................................................................ 14 1.9 Kit Contents, MSP-FET430UIF........................................................................................... 14 1.10 Kit Contents, MSP-FET.................................................................................................... 14 1.11 Kit Contents, MSP-FET430xx ............................................................................................ 14 1.12 Kit Contents, FET430F6137RF900 ...................................................................................... 15 1.13 Kit Contents, MSP-TS430xx .............................................................................................. 15 1.14 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 17 1.15 Hardware Installation, MSP-FET430PIF ................................................................................ 17 1.16 Hardware Installation, MSP-FET430UIF ................................................................................ 18 1.17 Hardware Installation, MSP-FET ......................................................................................... 18 1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529.......... 18 1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ....... 19 1.20 Important MSP430 Documents on the Web ............................................................................ 20 2 Design Considerations for In-Circuit Programming ................................................................ 21 2.1 Signal Connections for In-System Programming and Debugging ................................................... 22 2.2 External Power ............................................................................................................. 26 2.3 Bootstrap Loader (BSL) ................................................................................................... 26 A Frequently Asked Questions and Known Issues .................................................................... 27 A.1 Hardware FAQs ............................................................................................................ 28 A.2 Known Issues ............................................................................................................... 30 B Hardware........................................................................................................................... 31 B.1 MSP-TS430D8.............................................................................................................. 33 B.2 MSP-TS430PW14.......................................................................................................... 36 B.3 MSP-TS430L092 ........................................................................................................... 39 B.4 MSP-TS430L092 Active Cable ........................................................................................... 42 B.5 MSP-TS430PW24.......................................................................................................... 45 B.6 MSP-TS430DW28.......................................................................................................... 48 B.7 MSP-TS430PW28.......................................................................................................... 51 B.8 MSP-TS430PW28A........................................................................................................ 54 B.9 MSP-TS430RHB32A....................................................................................................... 57 B.10 MSP-TS430DA38 .......................................................................................................... 60 B.11 MSP-TS430QFN23x0...................................................................................................... 63 B.12 MSP-TS430RSB40......................................................................................................... 66 B.13 MSP-TS430RHA40A....................................................................................................... 69 B.14 MSP-TS430DL48........................................................................................................... 72 2 Contents SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com B.15 MSP-TS430RGZ48B....................................................................................................... 75 B.16 MSP-TS430RGZ48C ...................................................................................................... 78 B.17 MSP-TS430PM64 .......................................................................................................... 81 B.18 MSP-TS430PM64A ........................................................................................................ 84 B.19 MSP-TS430RGC64B ...................................................................................................... 87 B.20 MSP-TS430RGC64C ...................................................................................................... 90 B.21 MSP-TS430RGC64USB................................................................................................... 94 B.22 MSP-TS430PN80 .......................................................................................................... 98 B.23 MSP-TS430PN80A ....................................................................................................... 101 B.24 MSP-TS430PN80USB ................................................................................................... 104 B.25 MSP-TS430PZ100........................................................................................................ 108 B.26 MSP-TS430PZ100A...................................................................................................... 111 B.27 MSP-TS430PZ100B...................................................................................................... 114 B.28 MSP-TS430PZ100C...................................................................................................... 117 B.29 MSP-TS430PZ100D...................................................................................................... 121 B.30 MSP-TS430PZ5x100..................................................................................................... 124 B.31 MSP-TS430PZ100USB .................................................................................................. 127 B.32 MSP-TS430PEU128...................................................................................................... 131 B.33 EM430F5137RF900 ...................................................................................................... 134 B.34 EM430F6137RF900 ...................................................................................................... 138 B.35 EM430F6147RF900 ...................................................................................................... 142 B.36 MSP-FET .................................................................................................................. 146 B.36.1 Features ......................................................................................................... 146 B.36.2 Release Notes .................................................................................................. 146 B.36.3 Schematics ...................................................................................................... 148 B.36.4 Layout............................................................................................................ 153 B.36.5 LED Signals ..................................................................................................... 153 B.36.6 JTAG Target Connector ....................................................................................... 154 B.36.7 Specifications ................................................................................................... 156 B.36.8 MSP-FET Revision History.................................................................................... 156 B.37 MSP-FET430PIF.......................................................................................................... 157 B.38 MSP-FET430UIF.......................................................................................................... 159 B.38.1 MSP-FET430UIF Revision History ........................................................................... 164 C Hardware Installation Guide ............................................................................................... 165 C.1 Hardware Installation ..................................................................................................... 166 Revision History ........................................................................................................................ 171 SLAU278R–May 2009–Revised May 2014 Contents 3 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com List of Figures 2-1. Signal Connections for 4-Wire JTAG Communication................................................................. 23 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx, and MSP430F4xx Devices.............................................................................. 24 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices ..................................................................................................... 25 B-1. MSP-TS430D8 Target Socket Module, Schematic .................................................................... 33 B-2. MSP-TS430D8 Target Socket Module, PCB ........................................................................... 34 B-3. MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 36 B-4. MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 37 B-5. MSP-TS430L092 Target Socket Module, Schematic.................................................................. 39 B-6. MSP-TS430L092 Target Socket Module, PCB......................................................................... 40 B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 42 B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB......................................................... 43 B-9. MSP-TS430PW24 Target Socket Module, Schematic ................................................................ 45 B-10. MSP-TS430PW24 Target Socket Module, PCB ....................................................................... 46 B-11. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 48 B-12. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 49 B-13. MSP-TS430PW28 Target Socket Module, Schematic ................................................................ 51 B-14. MSP-TS430PW28 Target Socket Module, PCB ....................................................................... 52 B-15. MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 54 B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) .............................................................. 55 B-17. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 57 B-18. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 58 B-19. MSP-TS430DA38 Target Socket Module, Schematic................................................................. 60 B-20. MSP-TS430DA38 Target Socket Module, PCB........................................................................ 61 B-21. MSP-TS430QFN23x0 Target Socket Module, Schematic ............................................................ 63 B-22. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 64 B-23. MSP-TS430RSB40 Target Socket Module, Schematic ............................................................... 66 B-24. MSP-TS430RSB40 Target Socket Module, PCB ...................................................................... 67 B-25. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 69 B-26. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 70 B-27. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 72 B-28. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 73 B-29. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 75 B-30. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 76 B-31. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................. 78 B-32. MSP-TS430RGZ48C Target Socket Module, PCB .................................................................... 79 B-33. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 81 B-34. MSP-TS430PM64 Target Socket Module, PCB........................................................................ 82 B-35. MSP-TS430PM64A Target Socket Module, Schematic............................................................... 84 B-36. MSP-TS430PM64A Target Socket Module, PCB...................................................................... 85 B-37. MSP-TS430RGC64B Target Socket Module, Schematic............................................................. 87 B-38. MSP-TS430RGC64B Target Socket Module, PCB.................................................................... 88 B-39. MSP-TS430RGC64C Target Socket Module, Schematic............................................................. 91 B-40. MSP-TS430RGC64C Target Socket Module, PCB.................................................................... 92 B-41. MSP-TS430RGC64USB Target Socket Module, Schematic ......................................................... 94 B-42. MSP-TS430RGC64USB Target Socket Module, PCB ................................................................ 95 B-43. MSP-TS430PN80 Target Socket Module, Schematic................................................................. 98 4 List of Figures SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com B-44. MSP-TS430PN80 Target Socket Module, PCB........................................................................ 99 B-45. MSP-TS430PN80A Target Socket Module, Schematic.............................................................. 101 B-46. MSP-TS430PN80A Target Socket Module, PCB..................................................................... 102 B-47. MSP-TS430PN80USB Target Socket Module, Schematic.......................................................... 104 B-48. MSP-TS430PN80USB Target Socket Module, PCB................................................................. 105 B-49. MSP-TS430PZ100 Target Socket Module, Schematic .............................................................. 108 B-50. MSP-TS430PZ100 Target Socket Module, PCB ..................................................................... 109 B-51. MSP-TS430PZ100A Target Socket Module, Schematic ............................................................ 111 B-52. MSP-TS430PZ100A Target Socket Module, PCB ................................................................... 112 B-53. MSP-TS430PZ100B Target Socket Module, Schematic ............................................................ 114 B-54. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 115 B-55. MSP-TS430PZ100C Target Socket Module, Schematic ............................................................ 117 B-56. MSP-TS430PZ100C Target Socket Module, PCB ................................................................... 118 B-57. MSP-TS430PZ100D Target Socket Module, Schematic ............................................................ 121 B-58. MSP-TS430PZ100D Target Socket Module, PCB ................................................................... 122 B-59. MSP-TS430PZ5x100 Target Socket Module, Schematic ........................................................... 124 B-60. MSP-TS430PZ5x100 Target Socket Module, PCB .................................................................. 125 B-61. MSP-TS430PZ100USB Target Socket Module, Schematic......................................................... 127 B-62. MSP-TS430PZ100USB Target Socket Module, PCB................................................................ 128 B-63. MSP-TS430PEU128 Target Socket Module, Schematic ............................................................ 131 B-64. MSP-TS430PEU128 Target Socket Module, PCB ................................................................... 132 B-65. EM430F5137RF900 Target board, Schematic........................................................................ 134 B-66. EM430F5137RF900 Target board, PCB............................................................................... 135 B-67. EM430F6137RF900 Target board, Schematic........................................................................ 138 B-68. EM430F6137RF900 Target Board, PCB .............................................................................. 139 B-69. EM430F6147RF900 Target Board, Schematic ....................................................................... 142 B-70. EM430F6147RF900 Target Board, PCB .............................................................................. 143 B-71. MSP-FET Top View ...................................................................................................... 147 B-72. MSP-FET Bottom View .................................................................................................. 147 B-73. MSP-FET USB Debugger, Schematic (1 of 5)........................................................................ 148 B-74. MSP-FET USB Debugger, Schematic (2 of 5)........................................................................ 149 B-75. MSP-FET USB Debugger, Schematic (3 of 5)........................................................................ 150 B-76. MSP-FET USB Debugger, Schematic (4 of 5)........................................................................ 151 B-77. MSP-FET USB Debugger, Schematic (5 of 5)........................................................................ 152 B-78. MSP-FET USB Debugger, PCB (Top) ................................................................................. 153 B-79. MSP-FET USB Debugger, PCB (Bottom) ............................................................................. 153 B-80. JTAG Connector Pinout.................................................................................................. 154 B-81. Pin States After Power-Up............................................................................................... 155 B-82. MSP-FET430PIF FET Interface Module, Schematic................................................................. 157 B-83. MSP-FET430PIF FET Interface Module, PCB........................................................................ 158 B-84. MSP-FET430UIF USB Interface, Schematic (1 of 4) ................................................................ 159 B-85. MSP-FET430UIF USB Interface, Schematic (2 of 4) ................................................................ 160 B-86. MSP-FET430UIF USB Interface, Schematic (3 of 4) ................................................................ 161 B-87. MSP-FET430UIF USB Interface, Schematic (4 of 4) ................................................................ 162 B-88. MSP-FET430UIF USB Interface, PCB................................................................................. 163 C-1. Windows XP Hardware Wizard ......................................................................................... 166 C-2. Windows XP Driver Location Selection Folder........................................................................ 167 C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 ................................... 168 C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 ..................................... 169 SLAU278R–May 2009–Revised May 2014 List of Figures 5 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 .................................... 170 6 List of Figures SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com List of Tables 1-1. Flash Emulation Tool (FET) Features and Device Compatibility..................................................... 12 1-2. Individual Kit Contents, MSP-TS430xx.................................................................................. 15 B-1. MSP-TS430D8 Bill of Materials .......................................................................................... 35 B-2. MSP-TS430PW14 Bill of Materials....................................................................................... 38 B-3. MSP-TS430L092 Bill of Materials ........................................................................................ 41 B-4. MSP-TS430L092 JP1 Settings ........................................................................................... 43 B-5. MSP-TS430L092 Active Cable Bill of Materials ........................................................................ 44 B-6. MSP-TS430PW24 Bill of Materials....................................................................................... 47 B-7. MSP-TS430DW28 Bill of Materials ...................................................................................... 50 B-8. MSP-TS430PW28 Bill of Materials ...................................................................................... 53 B-9. MSP-TS430PW28A Bill of Materials..................................................................................... 56 B-10. MSP-TS430RHB32A Bill of Materials ................................................................................... 59 B-11. MSP-TS430DA38 Bill of Materials ....................................................................................... 62 B-12. MSP-TS430QFN23x0 Bill of Materials .................................................................................. 65 B-13. MSP-TS430RSB40 Bill of Materials ..................................................................................... 68 B-14. MSP-TS430RHA40A Bill of Materials ................................................................................... 71 B-15. MSP-TS430DL48 Bill of Materials ....................................................................................... 74 B-16. MSP-TS430RGZ48B Bill of Materials ................................................................................... 77 B-17. MSP-TS430RGZ48C Revision History .................................................................................. 79 B-18. MSP-TS430RGZ48C Bill of Materials ................................................................................... 80 B-19. MSP-TS430PM64 Bill of Materials....................................................................................... 83 B-20. MSP-TS430PM64A Bill of Materials ..................................................................................... 86 B-21. MSP-TS430RGC64B Bill of Materials ................................................................................... 89 B-22. MSP-TS430RGC64C Bill of Materials ................................................................................... 93 B-23. MSP-TS430RGC64USB Bill of Materials ............................................................................... 96 B-24. MSP-TS430PN80 Bill of Materials...................................................................................... 100 B-25. MSP-TS430PN80A Bill of Materials.................................................................................... 103 B-26. MSP-TS430PN80USB Bill of Materials ................................................................................ 106 B-27. MSP-TS430PZ100 Bill of Materials .................................................................................... 110 B-28. MSP-TS430PZ100A Bill of Materials................................................................................... 113 B-29. MSP-TS430PZ100B Bill of Materials................................................................................... 116 B-30. MSP-TS430PZ100C Bill of Materials .................................................................................. 119 B-31. MSP-TS430PZ100D Bill of Materials .................................................................................. 123 B-32. MSP-TS430PZ5x100 Bill of Materials.................................................................................. 126 B-33. MSP-TS430PZ100USB Bill of Materials ............................................................................... 129 B-34. MSP-TS430PEU128 Bill of Materials .................................................................................. 133 B-35. EM430F5137RF900 Bill of Materials................................................................................... 136 B-36. EM430F6137RF900 Bill of Materials................................................................................... 140 B-37. EM430F6147RF900 Bill of Materials................................................................................... 144 B-38. UART Backchannel Implementation ................................................................................... 146 B-39. MSP-FET LED Signals................................................................................................... 153 B-40. JTAG Connector Pin State by Operating Mode ...................................................................... 154 B-41. Specifications.............................................................................................................. 156 B-42. MSP-FET Revision History .............................................................................................. 156 C-1. USB VIDs and PIDs Used in MSP430 Tools.......................................................................... 166 SLAU278R–May 2009–Revised May 2014 List of Tables 7 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Preface SLAU278R–May 2009–Revised May 2014 Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430™ ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described. How to Use This Manual Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, provides instructions on installing the hardware and according software drivers. After you see how quick and easy it is to use the development tools, TI recommends that you read all of this manual. This manual describes the setup and operation of the FET but does not fully describe the MSP430™ microcontrollers or the development software systems. For details of these items, see the appropriate TI documents listed in Section 1.20. This manual applies to the following tools (and devices): • MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices) • MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices) • MSP-FET (successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430 devices) • eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices) • eZ430-T2012 (three MSP430F2012 based target boards) • eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices) • eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack) • eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target and solar energy harvesting module) • eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system contained in a watch. Includes <1 GHz RF USB access point) Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx. Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective target socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain also the USB debug interface (MSP-FET430UIF): • FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB) • FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green PCB) These tools contain the most up-to-date materials available at the time of packaging. For the latest materials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430 web site at www.ti.com/msp430 or contact your local TI sales office. 8 Read This First SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com Information About Cautions and Warnings Information About Cautions and Warnings This document may contain cautions and warnings. CAUTION This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment. WARNING This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection. Read each caution and warning carefully. Related Documentation From Texas Instruments MSP430 development tools documentation: Code Composer Studio for MSP430 User's Guide (literature number SLAU157) Code Composer Studio v5.x Core Edition (CCS Mediawiki) IAR Embedded Workbench for MSP430(tm) User's Guide (literature number SLAU138) IAR Embedded Workbench KickStart installer (literature number SLAC050) eZ430-F2013 Development Tool User's Guide (literature number SLAU176) eZ430-RF2480 Demonstration Kit User's Guide (literature number SWRU151) eZ430-RF2500 Development Tool User's Guide (literature number SLAU227) eZ430-RF2500-SEH Development Tool User's Guide (literature number SLAU273) eZ430-Chronos Development Tool User's Guide (literature number SLAU292) Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (literature number SLAU371) MSP-EXP430F5529 Experimenter Board User's Guide (literature number SLAU330) MSP-EXP430F5438 Experimenter Board User's Guide (literature number SLAU263) MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (literature number SLAU318) MSP Gang Programmer (MSP-GANG) User's Guide (literature number SLAU358) MSP430 Gang Programmer (MSP-GANG430) User's Guide (literature number SLAU101) MSP430 device user's guides: MSP430x1xx Family User's Guide (literature number SLAU049) MSP430x2xx Family User's Guide (literature number SLAU144) MSP430x3xx Family User's Guide (literature number SLAU012) MSP430x4xx Family User's Guide (literature number SLAU056) MSP430x5xx and MSP430x6xx Family User's Guide (literature number SLAU208) CC430 Family User's Guide (literature number SLAU259) SLAU278R–May 2009–Revised May 2014 Read This First 9 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated If You Need Assistance www.ti.com MSP430FR57xx Family User's Guide (literature number SLAU272) MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367) If You Need Assistance Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provide open interaction with peer engineers, TI engineers, and other experts. Additional device-specific information can be found on the MSP430 web site. 10 Read This First SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Chapter 1 SLAU278R–May 2009–Revised May 2014 Get Started Now! This chapter lists the contents of the FET and provides instruction on installing the hardware. Topic ........................................................................................................................... Page 1.1 Flash Emulation Tool (FET) Overview ................................................................... 12 1.2 Kit Contents, MSP-FET430PIF.............................................................................. 13 1.3 Kit Contents, eZ430-F2013................................................................................... 13 1.4 Kit Contents, eZ430-T2012................................................................................... 13 1.5 Kit Contents, eZ430-RF2500 ................................................................................ 13 1.6 Kit Contents, eZ430-RF2500T............................................................................... 13 1.7 Kit Contents, eZ430-RF2500-SEH ......................................................................... 13 1.8 Kit Contents, eZ430-Chronos-xxx......................................................................... 14 1.9 Kit Contents, MSP-FET430UIF.............................................................................. 14 1.10 Kit Contents, MSP-FET ....................................................................................... 14 1.11 Kit Contents, MSP-FET430xx .............................................................................. 14 1.12 Kit Contents, FET430F6137RF900 ........................................................................ 15 1.13 Kit Contents, MSP-TS430xx ................................................................................. 15 1.14 Kit Contents, EM430Fx1x7RF900.......................................................................... 17 1.15 Hardware Installation, MSP-FET430PIF ................................................................. 17 1.16 Hardware Installation, MSP-FET430UIF ................................................................. 18 1.17 Hardware Installation, MSP-FET........................................................................... 18 1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529..................................................................................................... 18 1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ............................................................................................. 19 1.20 Important MSP430 Documents on the Web............................................................ 20 SLAU278R–May 2009–Revised May 2014 Get Started Now! 11 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Flash Emulation Tool (FET) Overview www.ti.com 1.1 Flash Emulation Tool (FET) Overview TI offers several flash emulation tools according to different requirements. Table 1-1. Flash Emulation Tool (FET) Features and Device Compatibility(1) eZ430-F2013 eZ430-RF2500 eZ430-RF2480 eZ430-RF2560 MSP-WDSxx Metawatch eZ430-Chronos MSP-FET430PIF MSP-FET430UIF LaunchPad (MSP-EXP430G2) MSP-EXP430FR5739 MSP-EXP430F5529 Supports all programmable MSP430 and CC430 devices (F1xx, F2xx, F4xx, F5xx, F6xx, G2xx, L092, FR57xx, FR59xx, x x MSP430TCH5E) Supports only F20xx, G2x01, G2x11, x G2x21, G2x31 Supports MSP430F20xx, F21x2, F22xx, x G2x01, G2x11, G2x21, G2x31, G2x53 Supports MSP430F20xx, F21x2, F22xx, x x G2x01, G2x11, G2x21, G2x31 Supports F5438, F5438A x Supports BT5190, F5438A x x Supports only F552x x Supports FR57xx, F5638, F6638 x Supports only CC430F613x x Allows fuse blow x Adjustable target supply voltage x Fixed 2.8-V target supply voltage x Fixed 3.6-V target supply voltage x x x x x x x x x 4-wire JTAG x x 2-wire JTAG(2) x x x x x x x x x x Application UART x x x x x x x x Supported by CCS for Windows x x x x x x x x x x x Supported by CCS for Linux x Supported by IAR x x x x x x x x x x x (1) The MSP-FET430PIF is for legacy device support only. This emulation tool will not support any new devices released after 2011. (2) The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface. 12 Get Started Now! SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com Kit Contents, MSP-FET430PIF 1.2 Kit Contents, MSP-FET430PIF • One READ ME FIRST document • One MSP-FET430PIF interface module • One 25-conductor cable • One 14-conductor cable NOTE: This part is obsolete and is not recommended to use in new design. 1.3 Kit Contents, eZ430-F2013 • One QUICK START GUIDE document • One eZ430-F2013 development tool including one MSP430F2013 target board 1.4 Kit Contents, eZ430-T2012 • Three MSP430F2012-based target boards 1.5 Kit Contents, eZ430-RF2500 • One QUICK START GUIDE document • One eZ430-RF2500 CD-ROM • One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board • One eZ430-RF2500T target board • One AAA battery pack with expansion board (batteries included) 1.6 Kit Contents, eZ430-RF2500T • One eZ430-RF2500T target board • One AAA battery pack with expansion board (batteries included) 1.7 Kit Contents, eZ430-RF2500-SEH • One MSP430 development tool CD containing documentation and development software • One eZ430-RF USB debugging interface • Two eZ430-RF2500T wireless target boards • One SEH-01 solar energy harvester board • One AAA battery pack with expansion board (batteries included) SLAU278R–May 2009–Revised May 2014 Get Started Now! 13 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Kit Contents, eZ430-Chronos-xxx www.ti.com 1.8 Kit Contents, eZ430-Chronos-xxx '433, '868, '915 • One QUICK START GUIDE document • One ez430-Chronos emulator • One screwdriver • Two spare screws eZ430-Chronos-433: – One 433-MHz eZ430-Chronos watch (battery included) – One 433-MHz eZ430-Chronos access point eZ430-Chronos-868: – One 868-MHz eZ430-Chronos watch (battery included) – One 868-MHz eZ430-Chronos access point eZ430-Chronos-915: – One 915-MHz eZ430-Chronos watch (battery included) – One 915-MHz eZ430-Chronos access point 1.9 Kit Contents, MSP-FET430UIF • One READ ME FIRST document • One MSP-FET430UIF interface module • One USB cable • One 14-conductor cable 1.10 Kit Contents, MSP-FET • One READ ME FIRST document • One MSP-FET interface module • One USB cable • One 14-conductor cable 1.11 Kit Contents, MSP-FET430xx • One READ ME FIRST document • One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the case, and a 2×7-pin male connector on the other end of the case. • One USB cable • One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz. • A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092) • One 14-Pin JTAG conductor cable • One small box containing two MSP430 device samples (See table for Sample Type) • One target socket module. To determine the devices used for each board and a summary of the board, see Table 1-2. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx kit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board. Refer to the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi. 14 Get Started Now! SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com Kit Contents, FET430F6137RF900 1.12 Kit Contents, FET430F6137RF900 • One READ ME FIRST document • One legal notice • One MSP-FET430UIF interface module • Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB. • Two CC430EM battery packs • Four AAA batteries • Two 868-MHz or 915-MHz antennas • Two 32.768-kHz crystals • 18 PCB 2x4-pin headers • One USB cable • One 14-pin JTAG conductor cable 1.13 Kit Contents, MSP-TS430xx • One READ ME FIRST document • One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24) • One target socket module • A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092) • MSP430 device samples (see Table 1-2 for sample type) Table 1-2. Individual Kit Contents, MSP-TS430xx Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP-TS430D8 8-pin D MSP430G2210, 1 x MSP430G2210ID and Two PCB 1×4-pin headers (two male and (green PCB) (TSSOP ZIF) MSP430G2230 1 x MSP430G2230ID two female) MSP430F20xx, MSP-TS430PW14 14-pin PW MSP430G2x01, Four PCB 1×7-pin headers (two male and (green PCB) (TSSOP ZIF) MSP430G2x11, 2 x MSP430F2013IPW two female) MSP430G2x21, MSP430G2x31 Four PCB 1×7-pin headers (two male and two female). A "Micro-MaTch" 10-pin MSP-TS430L092 14-pin PW female connector is also present on the (green PCB) (TSSOP ZIF) MSP-TS430L092 2 x MSP430L092IPW PCB which connects the kit with an 'Active Cable' PCB; this 'Active Cable' PCB is connected by 14-pin JTAG cable with the FET430UIF MSP-TS430PW24 24-pin PW MSP430AFE2xx 2 x MSP430AFE253IPW Four PCB 1×12-pin headers (two male (green PCB) (TSSOP ZIF) and two female) MSP430F11x1, MSP430F11x2, MSP-TS430DW28 28-pin DW MSP430F12x, Four PCB 1×12-pin headers (two male (green PCB) (SSOP ZIF) MSP430F12x2, 2 x MSP430F123IDW and two female) MSP430F21xx Supports devices in 20- and 28-pin DA packages MSP430F11x1, MSP-TS430PW28 28-pin PW MSP430F11x2, Four PCB 1×12-pin headers (two male (green PCB) (TSSOP ZIF) MSP430F12x, 2 x MSP430F2132IPW and two female) MSP430F12x2, MSP430F21xx MSP430F20xx, MSP-TS430PW28A 28-pin PW MSP430G2xxx in 14-, 20-, Four PCB 1×12-pin headers (two male (red PCB) (TSSOP ZIF) and 28-pin PW packages, 2 x MSP430G2452IPW20 and two female) MSP430TCH5E in PW package MSP-TS430RHB32A 32-pin RHB MSP430i204x 2 x MSP430i2041TRHB Eight PCB 1×8-pin headers (four male (red PCB) (QFN ZIF) and four female) MSP-TS430DA38 38-pin DA MSP430F22xx, 2 x MSP430F2274IDA Four PCB 1×19-pin headers (two male (green PCB) (TSSOP ZIF) MSP430G2x44, 2 x MSP430G2744IDA and two female) MSP430G2x55 2 x MSP430G2955IDA SLAU278R–May 2009–Revised May 2014 Get Started Now! 15 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Kit Contents, MSP-TS430xx www.ti.com Table 1-2. Individual Kit Contents, MSP-TS430xx (continued) Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP-TS430QFN23x0 40-pin RHA MSP430F23x0 2 x MSP430F2370IRHA Eight PCB 1×10-pin headers (four male (green PCB) (QFN ZIF) and four female) MSP-TS430RSB40 40-pin RSB MSP430F51x1, 2 x MSP430F5172IRSB Eight PCB 1×10-pin headers (four male (green PCB) (QFN ZIF) MSP430F51x2 and four female) MSP-TS430RHA40A 40-pin RHA MSP430FR572x, 2 x MSP430FR5739IRHA Eight PCB 1×10-pin headers (four male (red PCB) (QFN ZIF) MSP430FR573x and four female) MSP-TS430DL48 48-pin DL MSP430F42x0 2 x MSP430F4270IDL Four PCB 2×12-pin headers (two male (green PCB) (TSSOP ZIF) and two female) MSP-TS430RGZ48B 48-pin RGZ MSP430F534x 2 x MSP430F5342IRGZ Eight PCB 1×12-pin headers (four male (blue PCB) (QFN ZIF) and four female) MSP-TS430RGZ48C 48-pin RGZ MSP430FR58xx and 2 x MSP430FR5969IRGZ Eight PCB 1×12-pin headers (four male (black PCB) (QFN ZIF) MSP430FR59xx and four female) MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x, MSP430F16x1, MSP430F23x, TS Kit: MSP-TS430PM64 64-pin PM MSP430F24x, 2 x MSP430F2618IPM; Eight PCB 1×16-pin headers (four male (green PCB) (QFP ZIF) MSP430F24xx, FET Kit: and four female) MSP430F261x, 2 x MSP430F417IPM and MSP430F41x, 2 x MSP430F169IPM MSP430F42x, MSP430F42xA, MSP430FE42x, MSP430FE42xA, MSP430FE42x2, MSP430FW42x MSP-TS430PM64A 64-pin PM MSP430F41x2 2 x MSP430F4152IPM Eight PCB 1×16-pin headers (four male (red PCB) (QFP ZIF) and four female) MSP-TS430RGC64B 64-pin RGC MSP430F530x 2 x MSP430F5310IRGC Eight PCB 1×16-pin headers (four male (blue PCB) (QFN ZIF) and four female) MSP430F522x, MSP-TS430RGC64C 64-pin RGC MSP430F521x , Eight PCB 1×16-pin headers (four male (black PCB) (QFN ZIF) MSP430F523x, 2 x MSP430F5229IRGC and four female) MSP430F524x, MSP430F525x MSP-TS430RGC64USB 64-pin RGC MSP430F550x, 2 x MSP430F5510IRGC or Eight PCB 1×16-pin headers (four male (green PCB) (QFN ZIF) MSP430F551x, 2 x MSP430F5528IRGC and four female) MSP430F552x MSP430F241x, MSP430F261x, MSP-TS430PN80 80-pin PN MSP430F43x, Eight PCB 1×20-pin headers (four male (green PCB) (QFP ZIF) MSP430F43x1, 2 x MSP430FG439IPN and four female) MSP430FG43x, MSP430F47x, MSP430FG47x MSP-TS430PN80A 80-pin PN MSP430F532x 2 x MSP430F5329IPN Eight PCB 1×20-pin headers (four male (red PCB) (QFP ZIF) and four female) MSP-TS430PN80USB 80-pin PN MSP430F552x, 2 x MSP430F5529IPN Eight PCB 1×20-pin headers (four male (green PCB) (QFP ZIF) MSP430F551x and four female) MSP430F43x, MSP-TS430PZ100 100-pin PZ MSP430F43x1, Eight PCB 1×25-pin headers (four male (green PCB) (QFP ZIF) MSP430F44x, 2 x MSP430FG4619IPZ and four female) MSP430FG461x, MSP430F47xx MSP-TS430PZ100A 100-pin PZ MSP430F471xx 2 x MSP430F47197IPZ Eight PCB 1×25-pin headers (four male (red PCB) (QFP ZIF) and four female) MSP-TS430PZ100B 100-pin PZ MSP430F67xx 2 x MSP430F6733IPZ Eight PCB 1×25-pin headers (four male (blue PCB) (QFP ZIF) and four female) MSP430F645x, MSP-TS430PZ100C 100-pin PZ MSP430F643x, 2 x MSP430F6438IPZ Eight PCB 1×25-pin headers (four male (black PCB) (QFP ZIF) MSP430F535x, and four female) MSP430F533x MSP-TS430PZ100D 100-pin PZ MSP430FR698x(1), 2 x MSP430FR6989IPZ Eight PCB 1×25-pin headers (four male (white PCB) (QFP ZIF) MSP430FR688x(1) and four female) 16 Get Started Now! SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com Kit Contents, EM430Fx1x7RF900 Table 1-2. Individual Kit Contents, MSP-TS430xx (continued) Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP-TS430PZ5x100 100-pin PZ MSP430F543x, Eight PCB 1×25-pin headers (four male (green PCB) (QFP ZIF) MSP430BT5190, 2 x MSP430F5438IPZ and four female) MSP430SL5438A MSP-TS430PZ100USB 100-pin PZ MSP430F665x, Eight PCB 1×25-pin headers (four male (green PCB) (QFP ZIF) MSP430F663x, 2 x MSP430F6638IPZ and four female) MSP430F563x MSP430F677x, MSP430F676x, Four PCB 1x26-pin headers (two male MSP-TS430PEU128 128-pin PEU MSP430F674x, 2 x MSP430F67791IPEU and two female) and four PCB 1x38-pin (green PCB) (QFP ZIF) MSP430F677x1, headers (two male and two female) MSP430F676x1, MSP430F674x1 See the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi. 1.14 Kit Contents, EM430Fx1x7RF900 • One READ ME FIRST document • One legal notice • Two target socket module MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on the PCB MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which is soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB • Two CC430EM battery packs • Four AAA batteries • Two 868- or 915-MHz antennas • Two 32.768-kHz crystals • 18 PCB 2×4-pin headers 1.15 Hardware Installation, MSP-FET430PIF Follow these steps to install the hardware for the MSP-FET430PIF tools: 1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR Embedded Workbench installation. Note that a restart is required after the CCS or IAR Embedded Workbench installation for the driver to become active. 2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B. SLAU278R–May 2009–Revised May 2014 Get Started Now! 17 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Hardware Installation, MSP-FET430UIF www.ti.com 1.16 Hardware Installation, MSP-FET430UIF Follow these steps to install the hardware for the MSP-FET430UIF tool: 1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE installation installs drivers automatically. 2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET should be recognized, as the USB device driver is installed automatically. If the driver has not been installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files. The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version of the tool. The default location for IAR Embedded Workbench is \Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or \Embedded Workbench x.x\430\drivers\, depending of firmware version of the tool. The USB driver is installed automatically. Detailed driver installation instructions can be found in Appendix C. 3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash for approximately two seconds. If the self-test passes successfully, the green LED stays on. 4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an MSP-TS430xxx target socket module. 5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG security fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA. 1.17 Hardware Installation, MSP-FET Follow these steps to install the hardware for the MSP-FET tool: 1. Install the IDE (CCS or IAR) that you plan to use before connecting MSP-FET to PC. During IDE installation, USB drivers are installed automatically. Make sure to use the latest IDE version, otherwise the USB drivers might not be able to recognize the MSP-FET. 2. Connect the MSP-FET to a USB port on the PC with the provided USB cable. 3. The following procedure applies to operation under Windows: (a) After connecting to the PC, the MSP-FET should be recognized automatically, as the USB device driver has been already installed together with the IDE. (b) If the driver has not been installed yet, the Found New Hardware wizard starts. Follow the instructions and point the wizard to the driver files. (c) The default location for CCS is c:\ti\ccsv6\ccs_base\emulation\drivers\msp430\USB_CDC. (d) The default location for IAR Embedded Workbench is \Embedded Workbench x.x\430\drivers\. 4. After connecting to a PC, the MSP-FET performs a self-test. If the self-test passes successfully, the green LED stays on. For a complete list of LED signals, please refer to the MSP-FET chapter in this document. 5. Connect the MSP-FET to a target board, such as an MSP-TS430xxx target socket module, with the 14-conductor cable. 6. Make sure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529 To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools, follow steps 1 and 2 of Section 1.16 18 Get Started Now! SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools: 1. Follow steps 1 and 2 of Section 1.16 2. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC. Use the 14-conductor cable to connect the FET interface module to the supplied target socket module. 3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations of the target socket modules and their parts are found in Appendix B. SLAU278R–May 2009–Revised May 2014 Get Started Now! 19 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Important MSP430 Documents on the Web www.ti.com 1.20 Important MSP430 Documents on the Web The primary sources of MSP430 information are the device-specific data sheet and user's guide. The MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents. PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is available, and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provide additional help besides the product help and Welcome page. PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker, and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the latest information) are available in HTML format in the same directories. A IAR specific Wiki Page is also available. 20 Get Started Now! SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Chapter 2 SLAU278R–May 2009–Revised May 2014 Design Considerations for In-Circuit Programming This chapter presents signal requirements for in-circuit programming of the MSP430. Topic ........................................................................................................................... Page 2.1 Signal Connections for In-System Programming and Debugging............................. 22 2.2 External Power................................................................................................... 26 2.3 Bootstrap Loader (BSL) ...................................................................................... 26 SLAU278R–May 2009–Revised May 2014 Design Considerations for In-Circuit Programming 21 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Signal Connections for In-System Programming and Debugging www.ti.com 2.1 Signal Connections for In-System Programming and Debugging MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430 With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSPFET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers, thus providing an easy way to program prototype boards, if desired. Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target device required to support in-system programming and debugging for 4-wire JTAG communication. Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is supported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230). The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430 User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138) for information on which interface method can be used on which device. The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430 are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board (through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCCsense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC present on the target board (that is, a battery or other local power supply) and adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCCsense feature and prevents any contention that might occur if the local on-board VCC were connected to the VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sense feature is not necessary (that is, if the target board is to be powered from the FET interface module, MSPGANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying VCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired to eliminate the jumper block. Pins 2 and 4 must not be connected at the same time. Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4-wire JTAG communication mode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAG mode, the RST connection must be made. The MSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset. 22 Design Considerations for In-Circuit Programming SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 1 3 5 7 9 11 13 2 4 6 8 10 12 14 TDO/TDI TDI/VPP TMS TCK GND TEST/VPP JTAG VCC TOOL VCC TARGET J1 (see Note A) J2 (see Note A) VCC R1 47 k (see Note B) W C2 10 μF C3 0.1 μF VCC/AVCC/DVCC RST/NMI TDO/TDI TDI/VPP TMS TCK TEST/VPP (see Note C) V /AV /DV SS SS SS MSP430Fxxx C1 10 nF/2.2 nF (see Notes B and E) RST (see Note D) Important to connect www.ti.com Signal Connections for In-System Programming and Debugging A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2. B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family user's guide for the recommended configuration. C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data sheet to determine if this pin is available. D The connection to the JTAG connector RST pin is optional when using a device that supports only 4-wire JTAG communication mode, and it is not required for device programming or debugging. However, this connection is required when using a device that supports 2-wire JTAG communication mode in 4-wire JTAG mode. E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should not exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET). Figure 2-1. Signal Connections for 4-Wire JTAG Communication SLAU278R–May 2009–Revised May 2014 Design Considerations for In-Circuit Programming 23 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 1 3 5 7 9 11 13 2 4 6 8 10 12 14 TEST/SBWTCK MSP430Fxxx RST/NMI/SBWTDIO TDO/TDI TCK GND TEST/VPP JTAG VCC TOOL VCC TARGET 330! R2 J1 (see Note A) J2 (see Note A) Important to connect VCC/AVCC/DVCC V /AV /DV SS SS SS R1 47 k! See Note B C1 2.2 nF See Note B VCC C2 10 μF C3 0.1 μF Signal Connections for In-System Programming and Debugging www.ti.com A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2. B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI tools. C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω) and do not connect TEST/VPP to TEST/SBWTCK. Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx, and MSP430F4xx Devices 24 Design Considerations for In-Circuit Programming SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 1 3 5 7 9 11 13 2 4 6 8 10 12 14 TEST/SBWTCK MSP430Fxxx RST/NMI/SBWTDIO TDO/TDI TCK GND JTAG R1 47 k! See Note B VCC TOOL VCC TARGET C1 2.2 nF See Note B J1 (see Note A) J2 (see Note A) Important to connect VCC/AVCC/DVCC V /AV /DV SS SS SS VCC C2 10 μF C3 0.1 μF www.ti.com Signal Connections for In-System Programming and Debugging A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug or programming adapter. B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI tools. Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices SLAU278R–May 2009–Revised May 2014 Design Considerations for In-Circuit Programming 25 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated External Power www.ti.com 2.2 External Power The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Note that the target should not consume more than 60 mA, even as a peak current, as it may violate the USB specification. For example, if the target board has a capacitor on VCC more than 10 μF, it may cause inrush current during capacitor charging that may exceed 60 mA. In this case, the current should be limited by the design of the target board, or an external power supply should be used. The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the target can be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin connector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically. Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected; not both at the same time. When a target socket module is powered from an external supply, the external supply powers the device on the target socket module and any user circuitry connected to the target socket module, and the FET interface module continues to be powered from the PC through the parallel port. If the externally supplied voltage differs from that of the FET interface module, the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module (so that it may adjust its output voltage levels accordingly). See the target socket module schematics in Appendix B. The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the tool through connections provided on the target socket modules. See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors. Note that the MSPFET430PIF is not recommended for new design. 2.3 Bootstrap Loader (BSL) The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices, these pins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program (a "bootstrap loader") that permits the flash memory to be erased and programmed using a reduced set of signals. The MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319) describes this interface. See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers. TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests providing access to these signals by, for example, a header). See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins. 26 Design Considerations for In-Circuit Programming SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Appendix A SLAU278R–May 2009–Revised May 2014 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware. Topic ........................................................................................................................... Page A.1 Hardware FAQs.................................................................................................. 28 A.2 Known Issues .................................................................................................... 30 SLAU278R–May 2009–Revised May 2014 Frequently Asked Questions and Known Issues 27 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Hardware FAQs www.ti.com A.1 Hardware FAQs 1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configuration and only to the period while a debug session is active. Workarounds: • Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly. • Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at top of Debug View). This prevents the debugger from accessing the MSP430 device while the application is running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature. • Use an external clock source to drive XIN directly. 2. With current interface hardware and software, there is a weakness when adapting target boards that are powered externally. This leads to an accidental fuse check in the MSP430 device. This is valid for PIF and UIF but is seen most often on the UIF. A solution is being developed. Workarounds: • Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the RST line, which also resets the device internal fuse logic. • Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down menu. This prevents the debugger from accessing the MCU while the application is running. Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature. • Use an external clock source to drive XIN directly. 3. The 14-conductor cable that connects the FET interface module and the target socket module must not exceed 8 inches (20 centimeters) in length. 4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB FET. 5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket module. See the schematic of the target socket module to populate the capacitor according to the data sheet of the device. 6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on the target socket module. See the schematic of the target socket module to populate the capacitor according to the data sheet of the device. 7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module. For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal data sheets for the value of capacitance. 8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C-SPY (as any required clocking and timing is derived from the internal DCO and FLL). 9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability: For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected. For C-SPY: "Release JTAG On Go" must be selected. 10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 is that the family members are code and architecturally compatible, so code developed on one device (for example, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent set of peripherals). 28 Frequently Asked Questions and Known Issues SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com Hardware FAQs 11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI. 12. The device current is higher then expected. The device current measurement may not be accurate with the debugger connected to the device. For accurate measurement, disconnect the debugger. Additionally some unused pins of the device should be terminated. See the Connection of Unused Pins table in the device's family user's guide. 13. The following ZIF sockets are used in the FET tools and target socket modules: • 8-pin device (D package): Yamaichi IC369-0082 • 14-pin device (PW package): Enplas OTS-14-065-01 • 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146 • 24-pin package (PW package): Enplas OTS-24(28)-0.65-02 • 28-pin device (DW package): Wells-CTI 652 D028 • 28-pin device (PW package): Enplas OTS-28-0.65-01 • 38-pin device (DA package): Yamaichi IC189-0382-037 • 40-pin device (RHA package): Enplas QFN-40B-0.5-01 • 40-pin device (RSB package): Enplas QFN-40B-0.4 • 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001 • 48-pin device (DL package): Yamaichi IC51-0482-1163 • 64-pin device (PM package): Yamaichi IC51-0644-807 • 64-pin device (RGC package): Yamaichi QFN11T064-006 • 80-pin device (PN package): Yamaichi IC201-0804-014 • 100-pin device (PZ package): Yamaichi IC201-1004-008 • 128-pin device (PEU package): Yamaichi IC500-1284-009P Enplas: www.enplas.com Wells-CTI: www.wellscti.com Yamaichi: www.yamaichi.us SLAU278R–May 2009–Revised May 2014 Frequently Asked Questions and Known Issues 29 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Known Issues www.ti.com A.2 Known Issues MSP-FET430UIF Current detection algorithm of the UIF firmware Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequently switching on and off the target power supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control. A side issue is that if the UIF firmware has entered this switch on and switch off loop, it is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A power cycle is required to remove the device from this state. Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version 2.04.00.003 and higher do not show this problem. Update the software development tool to this version or higher to update the MSP-FET430UIF firmware. MSP-FET430PIF Some PCs do not supply 5 V through the parallel port Problem Description Device identification problems with modern PCs, because the parallel port often does not deliver 5 V as was common with earlier hardware. 1. When connected to a laptop, the test signal is clamped to 2.5 V. 2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter through pin 4 (sense). Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the VCC pads of the interface. The jumper on a the target socket must be switched to external power. 30 Frequently Asked Questions and Known Issues SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Appendix B SLAU278R–May 2009–Revised May 2014 Hardware This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate productspecific user's guides. SLAU278R–May 2009–Revised May 2014 Hardware 31 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Appendix B www.ti.com Topic ........................................................................................................................... Page B.1 MSP-TS430D8 .................................................................................................... 33 B.2 MSP-TS430PW14................................................................................................ 36 B.3 MSP-TS430L092 ................................................................................................. 39 B.4 MSP-TS430L092 Active Cable .............................................................................. 42 B.5 MSP-TS430PW24................................................................................................ 45 B.6 MSP-TS430DW28................................................................................................ 48 B.7 MSP-TS430PW28................................................................................................ 51 B.8 MSP-TS430PW28A.............................................................................................. 54 B.9 MSP-TS430RHB32A............................................................................................ 57 B.10 MSP-TS430DA38 ................................................................................................ 60 B.11 MSP-TS430QFN23x0........................................................................................... 63 B.12 MSP-TS430RSB40 .............................................................................................. 66 B.13 MSP-TS430RHA40A............................................................................................ 69 B.14 MSP-TS430DL48 ................................................................................................ 72 B.15 MSP-TS430RGZ48B ............................................................................................ 75 B.16 MSP-TS430RGZ48C ............................................................................................ 78 B.17 MSP-TS430PM64 ................................................................................................ 81 B.18 MSP-TS430PM64A.............................................................................................. 84 B.19 MSP-TS430RGC64B............................................................................................ 87 B.20 MSP-TS430RGC64C............................................................................................ 90 B.21 MSP-TS430RGC64USB ....................................................................................... 94 B.22 MSP-TS430PN80 ................................................................................................ 98 B.23 MSP-TS430PN80A ............................................................................................ 101 B.24 MSP-TS430PN80USB ........................................................................................ 104 B.25 MSP-TS430PZ100 ............................................................................................. 108 B.26 MSP-TS430PZ100A ........................................................................................... 111 B.27 MSP-TS430PZ100B ........................................................................................... 114 B.28 MSP-TS430PZ100C ........................................................................................... 117 B.29 MSP-TS430PZ100D ........................................................................................... 121 B.30 MSP-TS430PZ5x100 .......................................................................................... 124 B.31 MSP-TS430PZ100USB ....................................................................................... 127 B.32 MSP-TS430PEU128 ........................................................................................... 131 B.33 EM430F5137RF900 ........................................................................................... 134 B.34 EM430F6137RF900 ........................................................................................... 138 B.35 EM430F6147RF900 ........................................................................................... 142 B.36 MSP-FET ......................................................................................................... 146 B.37 MSP-FET430PIF................................................................................................ 157 B.38 MSP-FET430UIF ............................................................................................... 159 32 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated GND 100nF 330R 10uF/10V 47K 2.2nF GND 330R GND GND green FE4L FE4H GND Ext_PWR Socket: YAMAICHI Type: IC369-0082 Vcc ext int to measure supply current DNP 1 3 5 7 9 11 13 2 4 6 12 14 8 10 SBW C5 R3 C7 R5 C8 1 2 3 J3 1 2 J4 1 2 J6 1 2 3 J5 R2 D1 1 2 3 4 J1 5 6 7 8 J2 DVCC 1 DVSS 8 P1.2/TA1/A2 2 P1.5/TA0/A5/SCLK 3 P1.6/TA1/A6/SDO/SCL 4 TST/SBWTCK 7 RST/SBWTDIO 6 P1.7/A7/SDI/SDA 5 U1 MSP-TS430D8 GND VCC RST/SBWTDIO RST/SBWTDIO RST/SBWTDIO SBWTCK VCC430 TST/SBWTCK TST/SBWTCK TST/SBWTCK P1.5 P1.6 P1.7 P1.2 Date: 28.07.201111:03:35 Sheet: /11 REV: TITLE: Document Number: MSP-TS430D8 + 1.0 MSP-TS430D8 Target Socket Board www.ti.com MSP-TS430D8 B.1 MSP-TS430D8 Figure B-1. MSP-TS430D8 Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 33 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper J4 Open to disconnect LED D1 LED connected to P1.2 Orient Pin 1 of MSP430 device 14-pin connector for debugging in Spy-Bi-Wire mode only (4-Wire JTAG not available) Jumper J6 Open to measure current Jumper J5 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector J3 External power connector Jumper J5 to “ext” MSP-TS430D8 www.ti.com Figure B-2. MSP-TS430D8 Target Socket Module, PCB 34 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430D8 Table B-1. MSP-TS430D8 Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 3 SBW 1 10-pin connector, male, TH HRP10H-ND 4 J3 1 3-pin header, male, TH SAM1035-03-ND 5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292 6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND 7 R5 1 47K, 0805 541-47000ATR-ND 8 C5 1 100nF, CSMD0805 311-1245-2-ND 9 R2, R3 2 330R, 0805 541-330ATR-ND 10 J1, J2 2 4-pin header, TH SAM1029-04-ND DNP: headers enclosed with kit. Keep vias free of solder. 10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit. 11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi 12 D1 1 red, LED 0603 13 MSP430 2 MSP430G2210, MSP430G2230 DNP: enclosed with kit. Is supplied by TI 14 PCB 1 50,0mmx44,5mm MSP-TS430D8 Rev. 1.0 SLAU278R–May 2009–Revised May 2014 Hardware 35 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 12pF 12pF GND 100nF 330R 10uF/10V 47K 2.2nF GND 330R 100nF GND GND GND green Ext_PWR Socket: ENPLAS Type: OTS-14-065 Vcc ext int to measure supply current DNP DNP DNP DNP DNP JTAG -> SBW -> JTAG-Mode selection: 4-wire JTAG: Set jumpers J7 to J12 to position 2-3 2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG C2 C1 C5 R3 C7 R5 C8 1 2 3 J3 Q1 8 9 10 11 12 13 14 J2 1 2 3 4 5 6 7 J1 1 2 J4 1 2 J6 J5 1 2 3 R2 C3 J7 1 2 3 J8 1 2 3 J9 1 2 3 J10 1 2 3 J11 1 2 3 J12 1 2 3 1 2 3 4 5 6 7 8 9 10 14 13 12 11 D1 P1.0 P1.3 P1.2 P1.1 XOUT XOUT GND XIN XIN VCC RST/SBWTDIO RST/SBWTDIO SBWTCK TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK VCC430 P1.4/TCK P1.4/TCK P1.5/TMS P1.5/TMS P1.6/TDI P1.6/TDI P1.7/TDO P1.7/TDO TDO/SBWTDIO RST/NMI TMS TDI Date: 7/16/2007 8:22:36 AM Sheet: 1/1 REV: TITLE: Document Number: MSP-TS430PW14 + 2.0 MSP-TS430PW14 Target Socket Board MSP-TS430PW14 www.ti.com B.2 MSP-TS430PW14 Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic 36 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper J6 Open to measure current Connector J3 External power connector D1 Jumper J5 to "ext" LED connected to P1.0 Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. Jumper J5 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool www.ti.com MSP-TS430PW14 Figure B-4. MSP-TS430PW14 Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 37 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430PW14 www.ti.com Table B-2. MSP-TS430PW14 Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C7 1 10uF, 10V, Tantal Size 511-1463-2-ND B 3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3 4 C8 0 2.2nF, SMD0805 DNP 5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: Headers and receptacles enclosed with kit. Keep vias free of 6 J1, J2 0 7-pin header, TH solder SAM1029-07-ND : Header SAM1213-07-ND : Receptacle J3, J5, J7, Place jumpers on headers J5, J7, J8, 7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND J9, J10, J11, J12; Pos 1-2 J11, J12 8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2 10 JTAG 1 14-pin connector, male, HRP14H-ND TH Micro Crystal MS1V-T1K 12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder 12.5pF 13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas 17 PCB 1 56 x 53 mm 2 layers Adhesive Approximately 6mm For example, 3M 18 plastic feet 4 width, 2mm height Bumpons Part No. SJ- Apply to corners at bottom side 5302 19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI 38 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430L092 B.3 MSP-TS430L092 Figure B-5. MSP-TS430L092 Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 39 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Connector J3 External power connector Jumper JP3 Open to measure current Jumper JP1 Write enable for EPROM Orient pin 1 of MSP430 device MSP-TS430L092 www.ti.com Settings of the MSP-TS430L092 Target Socket Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended: • JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read. • JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current consumption. For default operation, they should be closed. Figure B-6. MSP-TS430L092 Target Socket Module, PCB 40 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430L092 Table B-3. MSP-TS430L092 Bill of Materials Pos. Ref Des No. No. Per Description Digi-Key Part No. Comment Board 1 C1, C2 2 330nF, SMD0603 2 C5 1 100n, SMD0603 3 C6 1 10u, SMD0805 4 C10 1 100n, SMD0603 5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND DNP: headers and receptacles enclosed with kit. 7 J1, J2 2 7-pin header, TH Keep vias free of solder. SAM1213-07-ND : Header SAM1035-07-ND : Receptacle 8 J3 1 3-pin header, male, TH SAM1035-03-ND 9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder. 11 J13 1 MICRO_STECKV_10 Reichelt: MicroMaTch- Connector: MM FL 10G 12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557 16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065 17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC 18 R0, R6, R7 3 2K7, SMD0603 19 R1 1 1k, SMD0603 20 R2 1 47k, SMD0603 21 R4,R5, R8, 6 10k, SMD0603 R10, RC, RD 22 RA 1 3.9k, SMD0603 23 RB 1 6.8k, SMD0603 24 U1 1 14 Pin Socket - IC189-0142- Manuf. Yamaichi 146 22 MSP430 2 MSP430L092PWR DNP: Enclosed with kit. Is supplied by TI. SLAU278R–May 2009–Revised May 2014 Hardware 41 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430L092 Active Cable www.ti.com B.4 MSP-TS430L092 Active Cable Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic 42 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Connector JTAG For JTAG Tool JP2 JP1 www.ti.com MSP-TS430L092 Active Cable Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible: • JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4. Table B-4. MSP-TS430L092 JP1 Settings Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function. Off On The active cable receives power from target socket. For this option, the target socket must have its own power supply. On Off The active cable receives power from the JTAG connector. The JTAG connector powers the active cable and the target socket. For On On this option, the target socket must not have its own power source, as this would cause a not defined state. • JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero. Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 43 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430L092 Active Cable www.ti.com Table B-5. MSP-TS430L092 Active Cable Bill of Materials Pos. Ref Des No. Per Description Digi-Key Part No. Comment Board 1 C1, C3, C5, 4 100nF, SMD0603 C6 2 C2, C4 2 1uF, SMD0805 3 R1, R10 2 10K, SMD0603 4 R2 1 4K7, SMD0603 5 R5, R6, R7, 4 100, SMD0603 R9 6 R8 1 680k, SMD0603 7 R11, R15 2 1K, SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0, SMD0603 11 IC1 1 SN74AUC1G04DBVR Manu: TI 12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI 13 J2 1 MICRO_STECKV_10 Reichelt: MicroMaTch- Connector: MM FL 10G 14 JP1 1 2x2 Header JP2Q Put jumper on Position 1 and 2. Do not mix direction. 15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header 16 JTAG 1 14-pin connector, male, TH HRP14H-ND 17 Q1 1 BC817-25LT1SMD, SOT23- Digi-Key: BC817- BEC 25LT1GOSCT-ND 18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI 44 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430PW24 B.5 MSP-TS430PW24 Figure B-9. MSP-TS430PW24 Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 45 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool MSP-TS430PW24 www.ti.com Figure B-10. MSP-TS430PW24 Target Socket Module, PCB 46 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430PW24 Table B-6. MSP-TS430PW24 Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C5 1 2.2nF, SMD0805 3 C3, C7 2 10uF, 10V, SMD0805 4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND SAM1029-07- DNP: Headers and receptacles 6 J1, J2 0 12-pin header, TH NDSAM1213-07-ND enclosed with kit. Keep vias free of solder. (Header and Receptacle) J5, JP1, 7 JP4, JP5, 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 JP6, JP7, Place on 1-2 on JP1 JP8, JP9 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 9 Jumper 15-38-1024-ND see Pos 7 an 8 10 JTAG 1 14-pin connector, male, HRP14H-ND TH 11 Q1 0 Crystal DNP: keep vias free of solder 12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND 13 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6 R8, R9, 14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND 15 U1 1 Socket: OTS 24(28)- Manuf.: Enplas 065-02-00 16 PCB 1 68.5 x 61 mm 2 layers Adhesive Approximately 6mm for example, 3M 17 plastic feet 4 width, 2mm height Bumpons Part No. SJ- Apply to corners at bottom side 5302 18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI SLAU278R–May 2009–Revised May 2014 Hardware 47 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated ML14 LED3 12pF 12pF GND GND 100nF 560R ML10 JP1Q JP1Q 10uF/10V 50K 10nF 0R 0R 0R - - 0R - U1 SOCK28DW F123 FE14H FE14L 0R GND remove R8 and add R9 (0 Ohm) If external supply voltage: remove R11 and add R10 (0 Ohm) SMD-Footprint Socket: Yamaichi 2.0 MSP-TS430DW28 Target Socket DW28 Type: IC189-0282-042 If external supply voltage: R1, C1, C2 not assembled not assembled 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG D1 C2 C1 C5 R3 BOOTST 1 2 3 4 5 6 7 8 9 10 1 2 J5 J4 1 2 C7 R5 C8 R6 R7 R8 R9 R10 R11 R1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 TST 1 VCC 2 P2.5 3 VSS 4 XOUT 5 XIN 6 RST 7 P2.0 8 P2.1 9 P2.2 10 P2.3 19 P2.4 20 P1.0 21 P1.1 22 P1.2 23 P1.3 24 P1.4 25 P1.5 26 P1.6 27 P1.7 28 P3.0 11 P3.1 12 P3.2 13 P3.3 14 P3.4 15 P3.5 16 P3.6 17 P3.7 18 U2 15 16 17 18 19 20 21 22 23 24 25 26 27 28 J2 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 R2 1 2 3 J3 Q1 QUARZ3 P1.0 P1.0 P1.3 P1.3 P1.2 P1.2 P1.1 P1.1 RST/NMI RST/NMI RST/NMI RST/NMI RST/NMI TCK TCK TCK TMS TMS TMS TDI TDI TDI TDO TDO TDO XOUT XOUT VCC GND GND GND P2.3 P2.3 P2.4 P2.4 XIN XIN P2.5 P2.5 P2.2 P2.2 P2.1 P2.1 P2.0 P2.0 TST/VPP TST/VPP TST/VPP P3.0 P3.0 P3.1 P3.1 P3.2 P3.2 P3.3 P3.3 P3.7 P3.7 P3.6 P3.6 P3.5 P3.5 P3.4 P3.4 VCC430 Ext_PWR Date: 11/14/2006 1:26:04 PM Sheet: 1/1 REV: TITLE: Document Number: MSP-TS430DW28 + VCC430 MSP-TS430DW28 www.ti.com B.6 MSP-TS430DW28 Figure B-11. MSP-TS430DW28 Target Socket Module, Schematic 48 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper J5 Open to measure current Connector J3 External power connector Remove R8 and jumper R9 D1 LED connected to P1.0 Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool www.ti.com MSP-TS430DW28 Figure B-12. MSP-TS430DW28 Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 49 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430DW28 www.ti.com Table B-7. MSP-TS430DW28 Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2, Cover holes while soldering 2 C5 1 100nF, SMD0805 3 C7 1 10uF, 10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1 3mm yellow RS: 228-4991 Micro Crystal MS1V-T1K 6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering 12.5pF DNP: Headers and receptacles enclosed with kit. Keep vias free of 7 J1, J2 2 14-pin header, TH male solder. : Header : Receptacle DNP: Headers and receptacles enclosed with kit. Keep vias free of 7.1 2 14-pin header, TH solder. female : Header : Receptacle 8 J3 1 3-Pin Connector, male 9 J4, J5 2 2-Pin Connector, male With jumper 10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering 11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121 R1, R2, 12 R6, R7, 4 0R, SMD0805 DNP: R1, R2, R9, R10 R8,R9, R10, R11 13 R3 1 560R, SMD0805 14 R5 1 47K, SMD0805 15 U1 1 SOP28DW socket Yamaichi: IC189-0282- 042 16 U2 0 TSSOP DNP 50 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 12pF 12pF GND GND 100nF 330R 10uF/10V - 0R GND GND green 2.2nF 47k GND 0R 0R 330R MSP430F12xx If external supply voltage: remove R11 and add R10 (0 Ohm) 3.1 MSP-TS430PW28: OTS-28-0.65-01 Socket: Enplas Vcc int ext Target Socket Board for MSP430's in PW28 package DNP DNP DNP DNP DNP DNP DNP JTAG -> SBW -> JTAG-Mode selection: 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2 DNP 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG C2 C1 C4 R1 1 2 3 4 5 6 7 8 9 10 BOOTST C3 R2 R3 1 2 3 J5 JP1 1 2 3 JP2 1 2 1 2 JP3 D1 C5 R4 JP4 1 2 3 JP5 1 2 3 JP6 1 2 3 JP7 1 2 3 JP8 1 2 3 JP9 1 2 3 R5 R6 1 2 Q1 R7 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 J2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 U1 TST 1 VCC 2 P2.5 3 VSS 4 XOUT 5 XIN 6 RST 7 P2.0 8 P2.1 9 P2.2 10 P2.3 19 P2.4 20 P1.0 21 P1.1 22 P1.2 23 P1.3 24 P1.4 25 P1.5 26 P1.6 27 P1.7 28 P3.0 11 P3.1 12 P3.2 13 P3.3 14 P3.4 15 P3.5 16 P3.6 17 P3.7 18 P1.0 P1.0 RST/NMI TMS TDI VCC GND GND VCC430 VCC430 P2.0 P1.1 P1.1 P3.3 P3.2 P3.1 P3.0 P2.2 P2.2 XIN/P2.6 XIN/P2.6 XOUT/P2.7 XOUT/P2.7 P2.1 RST/SBWTDIO RST/SBWTDIO RST/SBWTDIO P3.4 P3.5 P3.6 P3.7 P2.3 P2.4 P1.2 P1.3 P1.4/TCK P1.4/TCK P1.5/TMS P1.5/TMS P1.6/TDI P1.6/TDI P1.7/TDO P1.7/TDO TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK P2.5 TCK/SBWTCK TDO/SBWTDIO XTLGND Ext_PWR + www.ti.com MSP-TS430PW28 B.7 MSP-TS430PW28 Figure B-13. MSP-TS430PW28 Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 51 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to measure current Jumper JP3 Open to disconnect LED D1 LED connected to P5.1 Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP1 to “ext” MSP-TS430PW28 www.ti.com Figure B-14. MSP-TS430PW28 Target Socket Module, PCB 52 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430PW28 Table B-8. MSP-TS430PW28 Bill of Materials(1) Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 , Cover holes while soldering 2 C3 1 10uF, 10V Tantal Elko B 3 C4 1 100nF, SMD0805 4 C5 0 2.2nF, SMD0805 DNP 5 D1 1 LED green SMD0603 Micro Crystal MS1V-T1K DNP: Cover holes and 6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while 12.5pF soldering DNP: Headers and receptacles enclosed with 7 J1, J2 2 14-pin header, TH male kit.Keep vias free of solder. : Header : Receptacle DNP: headers and receptacles enclosed with 7.1 2 14-pin header, TH female kit.Keep vias free of solder. : Header : Receptacle 8 J5, IP1 1 3-Pin Connector , male JP1, JP4, 8a JP5, JP6, 7 3-Pin Connector , male Jumper on Pos 1-2 JP7, JP8, JP9 9 JP2, JP3 2 2-Pin Connector , male with Jumper 10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 DNP: Cover holes while soldering 11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121 12 R1, R7 2 330R, SMD0805 12 R2, R3, R5, 0 0R, SMD0805 DNP R6 14 R4 1 47K, SMD0805 15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01 (1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces SLAU278R–May 2009–Revised May 2014 Hardware 53 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated JTAG Mode selection: 4-wire JTAG: Set jumpers J4 to J9 to position 2-3 2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1 MSP-TS430PW28A www.ti.com B.8 MSP-TS430PW28A Figure B-15. MSP-TS430PW28A Target Socket Module, Schematic 54 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply www.ti.com MSP-TS430PW28A Figure B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) SLAU278R–May 2009–Revised May 2014 Hardware 55 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430PW28A www.ti.com Table B-9. MSP-TS430PW28A Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C5 1 2.2nF, SMD0805 3 C3 1 10uF, 10V, SMD0805 4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles 6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of solder: (Header and Receptacle) J5, JP1, 7 JP4, JP5, 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 JP6, JP7, Place on 1-2 on JP1 JP8, JP9 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 9 Jumper 15-38-1024-ND see Pos 7 an 8 10 JTAG 1 14-pin connector, male, HRP14H-ND TH 11 BOOTST 0 DNP Keep vias free of solder Micro Crystal MS3V 12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder 12.5pF 13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND 14 R2, R3,R5, 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6 R6, 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas 17 PCB 1 63.5 x 64.8 mm 2 layers Adhesive Approximately 6mm for example, 3M 18 plastic feet 4 width, 2mm height Bumpons Part No. SJ- Apply to corners at bottom side 5302 19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI 56 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated DNP DNP DNP DNP DNP DNP DNP DNP GND 0R 330R 2.2nF PWR3 GND GND 0R 47K 470nF 100nF 10uF 100nF GND GND 20k/0.1% 10k 10k 10k 10k GND AVSS AVSS 10k 10k 10k 10k GND SAM1029-08-ND1-8 SAM1029-08-ND9-16 MSP430I2040TRHBQFN11T032-003 SAM1029-08-ND17-2417-24 SAM1029-08-ND25-32 1.0 for MSP430i2040 MSP430: Target-Socket MSP-TS430RHB32A DNP <- SBW <- JTAG Vcc int ext Socket: Yamaichi QFN11T032-003 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG R1 R3 C8 J5 1 2 3 1 JP1 2 1 2 JP2 R4 1 2 3 JP4 1 2 3 JP9 1 2 3 JP8 1 2 3 JP7 1 2 3 JP6 1 2 3 JP5 R5 D1 C9 1 2 3 JP3 C14 C12 C13 R2 R6 R8 R9 R10 R11 R12 R13 R14 1 2 3 4 5 6 7 8 J1 9 10 11 12 13 14 15 16 J2 A0.0+ 1 A0.0- 2 A1.0+ 3 A1.0- 4 A2.0+ 5 A2.0- 6 A3.0+ 7 A3.0- 8 VREF 9 AVSS 10 ROSC 11 DVSS 12 VCC 13 VCORE 14 P2.3/VMONIN 28 P2.2/TA1.2 27 P2.1/TA1.1 26 P2.0/TA1.0/CLKIN 25 P1.7/UCB0SDA/UCB0SIMO/TA1CLK 24 P1.6/UCB0SCL/UCB0SOMI/TA0.2 23 P1.5/UCB0CLK/TA0.1 22 P1.4/UCB0STE/TA0.0 21 P1.3/UCA0TXD/UCA0SIMO/TA0CLK/TDO/TDI 20 P1.2/UCA0RXD/UCA0SOMI/ACLK/TDI/TCLK 19 P1.1/UCA0CLK/SMCLK/TMS 18 P1.0/UCA0STE/MCLK/TCK 17 TEST/SBWTCK 16 RST/NMI/SBWTDIO 15 U1 P2.4/TA1.0 29 P2.5/TA0.0 30 P2.6/TA0.1 31 P2.7/TA0.2 32 17 18 19 20 21 22 23 24 J3 25 26 27 28 29 30 31 32 J4 TMS TMS TDI TDI TDO TDO TDO VCC GND GND P1.4 P1.4 DVCC DVCC DVCC AVSS M M I I O O RST/NMI RST/NMI TCK TCK TCK C TEST/SBWTCK C TEST/SBWTCK VCORE A0.0+ A0.0- A1.0+ A1.0- VREF ROSC RST RST RST A2.0+ A2.0- A3.0+ A3.0- P1.5 P1.6 P1.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 www.ti.com MSP-TS430RHB32A B.9 MSP-TS430RHB32A Figure B-17. MSP-TS430RHB32A Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 57 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Orient Pin 1 of MSP430 device D1 LED connected to P1.4 Jumper JP1 Open to measure current Connector J5 External power connector Jumper JP3 to “ext” Connector JTAG For JTAG Tool Jumper JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 3-4 to debug in 4-wire JTAG mode Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP2 Open to disconnect LED P1.4 14 1 2 GND GND VCC 1 2 3 3 2 1 8 5 1 16 9 17 20 24 25 30 32 Vcc ext int MSP-TS430RHB32A Rev.: 1.0 RoHS SBW JTAG 1 Curr. Meas. JTAG R1 R3 C8 J5 JP1 JP2 R4 JP4 JP9 JP8 JP7 JP6 JP5 R5 D1 C9 JP3 C14 C13 C12 R2 R6 R8 R9 R10 R11 R12 R13 R14 J1 J2 U1 J3 J4 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 MSP-TS430RHB32A www.ti.com Figure B-18. MSP-TS430RHB32A Target Socket Module, PCB 58 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RHB32A Table B-10. MSP-TS430RHB32A Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 PCB 1 76.9 x 67.6 mm MSP-TS430RHB32A Rev. 2 layers, red solder mask 1 2 D1 1 green LED, DIODE0805 P516TR-ND 3 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 4 JP3, JP4, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2 JP5, JP6, (SBW) JP7, JP8, JP9 5 R1, R4 2 0R, 0805 541-0.0ATR-ND 6 C8 1 2.2nF, CSMD0805 490-1628-2-ND DNP 7 R6, R8, R9, 8 10k, 0805 311-10KARTR-ND DNP R10, R11, R12, R13, R14 8 C12 1 10uF, CSMD0805 445-1371-2-ND 9 R2 1 20k/0.1%, 0805 P20KDACT-ND 10 R5 1 47K, 0805 311-47KARTR-ND 11 C13, C14 2 100nF, CSMD0805 311-1245-2-ND 12 R3 1 330R, 0805 541-330ATR-ND 13 C9 1 470nF, CSMD0805 445-1357-2-ND 14 J1, J2, J3, 1 8-pin header, TH SAM1029-08-ND DNP: headers and J4 receptacles, enclosed with kit. Keep vias free of solder. 15 J1, J2, J3, 1 8-pin receptable, TH SAM1213-08-ND DNP: headers and J4 receptacles, enclosed with kit. Keep vias free of solder. 16 JTAG 1 14-pin connector, male, TH HRP14H-ND 17 U1 1 Socket QFN11T032-003 Manuf.: Yamaichi 18 U1 1 MSP430i2041TRHB DNP: enclosed with kit. Is supplied by TI 19 J5 1 3-pin header, male, TH SAM1035-03-ND 20 Rubber 4 Buerklin: 20H1724 apply to corners at bottom stand off side SLAU278R–May 2009–Revised May 2014 Hardware 59 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 12pF 12pF GND GND 100nF 560R 10uF/10V 47k 10nF - 0R GND MSP430F2274IDA GND 330R GND yellow If external supply voltage: remove R11 and add R10 (0 Ohm) IC189-0382-037 Socket: 4-wire JTAG: 2-wire "SpyBiWire": JTAG-Mode selection: Set jumpers JP4 to JP9 to position 2-3 Set jumpers JP4 to JP9 to position 2-1 JTAG -> SBW -> Yamaichi DNP DNP DNP DNP DNP DNP DNP 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG C2 C1 C5 R3 1 2 3 4 5 6 7 8 9 10 BOOTST C7 R5 C8 R10 R11 1 2 3 J3 Q1 TEST/SBWTCK 1 P3.5 26 P3.6 27 P1.4/TCK 35 RST/SBWDAT 7 DVCC 2 DVSS 4 P4.7 24 P3.7 28 AVSS 15 AVCC 16 P3.0 11 P3.1 12 P3.2 13 P3.3 14 P4.0 17 P4.1 18 P4.2 19 P3.4 25 P2.5 3 P2.4 30 P2.3 29 P2.2 10 P2.1 9 P2.0 8 P1.5/TMS 36 P1.6/TDI 37 P1.7/TDO 38 P2.7 5 P2.6 6 P4.6 23 P4.5 22 P4.4 21 P4.3 20 P1.0 31 P1.1 32 P1.2 33 P1.3 34 U1 JP1 1 2 3 JP2 1 2 1 2 JP3 1 2 3 JP4 JP5 1 2 3 JP6 1 2 3 JP7 1 2 3 JP8 1 2 3 R1 JP9 1 2 3 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 1 J1 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 20 J2 D1 P1.0 P1.0 RST/NMI TMS TDI VCC GND GND GND VCC430 VCC430 VCC430 TCK/SBWTCK TDO/SBWTDIO TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK P2.5 P2.0 P2.1 P3.0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P1.7/TDO P1.7/TDO P1.6/TDI P1.6/TDI P1.5/TMS P1.5/TMS P1.4/TCK P1.4/TCK P1.3 P1.2 P1.1 P1.1 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 P4.7 P4.6 P4.5 P4.4 P4.3 P2.7/XOUT P2.7/XOUT P2.6/XIN P2.6/XIN RST/SBWTDIO RST/SBWTDIO RST/SBWTDIO P2.2 P2.2 Ext_PWR Date: 6/18/2008 11:04:56 AM Sheet: 1/1 REV: TITLE: Document Number: MSP-TS430DA38 + 1.3 MSP-TS430DA38: Vcc int ext Target Socket Board for MSP430F2247IDA MSP-TS430DA38 www.ti.com B.10 MSP-TS430DA38 Figure B-19. MSP-TS430DA38 Target Socket Module, Schematic 60 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Orient pin 1 of MSP430 device D1 LED connected to P1.0 Connector J3 External power connector Jumper JP1 to "ext" Jumper JP3 Open to disconnect LED Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool www.ti.com MSP-TS430DA38 Figure B-20. MSP-TS430DA38 Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 61 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430DA38 www.ti.com Table B-11. MSP-TS430DA38 Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 DNP 5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: headers and receptacles enclosed with 6 J1, J2 0 19-pin header, TH kit.Keep vias free of solder. SAM1029-19-ND : Header SAM1213-19-ND : Receptacle "J3, JP1, Place jumpers on headers 7 JP4, JP5, 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7, JP6, JP7, JP8, JP9; Pos 1-2 JP8, JP9" 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1- 2 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Micro Crystal MS1V-T1K DNP: Keep vias free of 12 Q1 0 Crystal 32.768kHz, C(Load) = solder 12.5pF 13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND 14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi 17 PCB 1 67 x 66 mm 2 layers 18 Adhesive 4 ~6mm width, 2mm height for example, 3M Bumpons Apply to corners at bottom Plastic feet Part No. SJ-5302 side 19 MSP430 2 MSP430F2274IDA DNP: enclosed with kit supplied by TI 62 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430QFN23x0 B.11 MSP-TS430QFN23x0 Figure B-21. MSP-TS430QFN23x0 Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 63 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated D1 LED connected to P1.0 Connector J5 External power connector Jumper JP1 to "ext" Jumper JP3 Open to disconnect LED Jumper JP2 Open to measure current Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Orient Pin 1 of MSP430 device MSP-TS430QFN23x0 www.ti.com Figure B-22. MSP-TS430QFN23x0 Target Socket Module, PCB 64 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430QFN23x0 Table B-12. MSP-TS430QFN23x0 Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C4 1 100nF, SMD0805 478-3351-2-ND 4 C5 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: headers and receptacles enclosed with 6 J1, J2, J3, 0 10-pin header, TH kit.Keep vias free of solder. J4 SAM1034-10-ND : Header SAM1212-10-ND : Receptacle 7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1; Pos 1-2. 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Micro Crystal MS1V-T1K DNP: Keep vias free of 12 Q1 0 Crystal 32.768kHz, C(Load) = solder 12.5pF 13 R1 1 330 Ω, SMD0805 541-330ATR-ND 14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas 17 PCB 1 79 x 66 mm 2 layers 18 Adhesive 4 ~6mm width, 2mm height for example, 3M Bumpons Apply to corners at bottom Plastic feet Part No. SJ-5302 side 19 MSP430 2 MSP430F2370IRHA DNP: enclosed with kit supplied by TI SLAU278R–May 2009–Revised May 2014 Hardware 65 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430RSB40 www.ti.com B.12 MSP-TS430RSB40 Figure B-23. MSP-TS430RSB40 Target Socket Module, Schematic 66 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J5 External power connector Jumper JP1 to "ext" Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply www.ti.com MSP-TS430RSB40 Figure B-24. MSP-TS430RSB40 Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 67 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430RSB40 www.ti.com Table B-13. MSP-TS430RSB40 Bill of Materials Pos. Ref Des No. Per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C3, C7, C10, 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12 C12 3 C4, C6, C8, 3 100nF, SMD0805 311-1245-2-ND DNP C11 C11 4 C5 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles enclosed with kit. 7 J1, J2, J3, J4 4 10-pin header, TH Keep vias free of solder. : Header : Receptacle DNP: headers and receptacles enclosed with kit. 7.1 4 10-pin header, TH Keep vias free of solder. : Header : Receptacle JP1, JP4,JP5, Jumper: 1-2 on JP1, JP10; 2- 8 JP6, JP7, 9 3-pin header, male, TH SAM1035-03-ND 3 on JP4-JP9 JP8, JP9, J5, JP10 9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder 12 U1 1 QFN-40B-0.4_ Enplas ENPLAS_SOCKET Micro Crystal MS3V-T1R DNP: Q1. Keep vias free of 13 Q1 0 Crystal 32.768kHz, C(Load) = solder 12.5pF Place on: JP1, JP2, JP3, 15 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8, JP9, JP10 16 R1,R7 2 330R SMD0805 R2, R3, R5, 17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6 R10 18 R4 1 47k SMD0805 19 MSP430 2 MSP430F5132 DNP: enclosed with kit. Is supplied by TI 20 Rubber stand 4 select appropriate; for apply to corners at bottom off example, Buerklin: 20H1724 side 68 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RHA40A B.13 MSP-TS430RHA40A Figure B-25. MSP-TS430RHA40A Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 69 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to measure current Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool MSP-TS430RHA40A www.ti.com Figure B-26. MSP-TS430RHA40A Target Socket Module, PCB 70 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RHA40A Table B-14. MSP-TS430RHA40A Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C5 0 2.2nF, SMD0805 DNP C12 3 C3, C7 2 10uF, 10V, SMD0805 5 DNP C11 4 C4, C6 2 100nF, SMD0805 478-3351-2-ND 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of 7 J1, J2, J3, 4 10-pin header, TH solder. J4 : Header : Receptacle DNP: headers and receptacles enclosed with kit. Keep vias free of 7.1 4 10-pin header, TH solder. : Header : Receptacle J5, JP1, 8 JP4, JP5, 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9; JP6, JP7, Place on 1-2 on JP1 JP8, JP9 9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 10 9 Jumper 15-38-1024-ND see Pos 8 an 9 11 JTAG 1 14-pin connector, male, HRP14H-ND TH 12 BOOTST 0 10-pin connector, male, DNP. Keep vias free of solder TH 13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas Micro Crystal MS3V-T1R 14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder 12.5pF 15 R1,R7 2 330R SMD0805 541-330ATR-ND R2, R3, 16 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6 R8, R9, 17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 2 layers Rubber select appropriate; for 19 stand off 4 example, Buerklin: apply to corners at bottom side 20H1724 20 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI SLAU278R–May 2009–Revised May 2014 Hardware 71 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated ML14 LED3 12pF 12pF GND GND 100nF 560R ML10 JP1Q JP1Q 10uF/10V 47K 10nF 0R 0R GND 0R 0R 10uF/10V GND IC51-1387.KS-15186 100nF 1.3 MSP-TS430DL48 Target Socket DL48 Q1, C1, C2 not assembled 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG D1 C2 C1 C5 R3 BOOTST 1 2 3 4 5 6 7 8 9 10 1 2 J5 J4 1 2 C7 R5 C8 R6 R7 1 2 3 J3 Q1 QUARZ3 J2 1 3 5 2 4 6 7 9 8 10 11 13 15 12 14 16 17 19 18 20 21 23 22 24 1 3 5 2 4 6 7 9 8 10 11 13 15 12 14 16 17 19 18 20 21 23 22 24 J1 R12 R4 JP1 1 2 3 1 2 3 JP2 C4 U1 TDO/TDI 1 TDI/TCLK 2 TMS 3 TCK 4 RST/NMI 5 DVCC 6 DVSS 7 XIN 8 XOUT 9 AVSS 10 AVCC 11 VREF+ 12 P6.0 13 P6.1 14 P6.2 15 P6.3 16 P6.4 17 P6.5 18 P6.6 19 P6.7 20 P2.5 39 P2.4 40 P2.3 41 P2.2 42 P2.1 43 P2.0 44 COM0 45 P5.2 46 P5.3 47 P5.4 48 LCDREF 29 LCDCAP 30 P5.1 31 P5.0 32 P5.5 33 P5.6 34 P5.7 35 S5 36 P2.7 37 P2.6 38 P1.7 21 P1.6 22 P1.5 23 P1.4 24 P1.0 28 P1.1 27 P1.2 26 P1.3 25 C3 P1.0 P1.0 RST/NMI RST/NMI RST/NMI TCK TCK TCK TMS TMS TDI TDI TDO TDO XOUT XOUT GND GND GND XIN XIN BSL_TX VCC BSL_RX Ext_PWR Date: 11/14/2006 1:24:44 PM Sheet: 1/1 REV: TITLE: Document Number: MSP-TS430DL48 + + Vcc ext int int ext Vcc MSP-TS430DL48 www.ti.com B.14 MSP-TS430DL48 Figure B-27. MSP-TS430DL48 Target Socket Module, Schematic 72 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper J4 Open to disconnect LED D1 LED connected to P1.0 Orient pin 1 of MSP430 device Jumper J5 Open to measure current Connector J3 External power connector Jumper JP2 to "ext" Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP2 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply www.ti.com MSP-TS430DL48 Figure B-28. MSP-TS430DL48 Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 73 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430DL48 www.ti.com Table B-15. MSP-TS430DL48 Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C3, C5 2 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND DNP: Headers and receptacles enclosed with 6 J1, J2 0 24-pin header, TH kit.Keep vias free of solder. SAM1034-12-ND : Header SAM1212-12-ND : Receptacle 7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1; Pos 1-2. DNP: JP2 8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Micro Crystal MS1V-T1K DNP: Keep vias free of 12 Q1 0 Crystal 32.768kHz, C(Load) = solder 12.5pF 13 R3 1 560 Ω, SMD0805 541-560ATR-ND 14 R4, R6, R7, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7 R12 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-1387 KS- Manuf.: Yamaichi 15186 17 PCB 1 58 x 66 mm 2 layers 18 Adhesive 4 ~6mm width, 2mm height for example, 3M Bumpons Apply to corners at bottom Plastic feet Part No. SJ-5302 side 19 MSP430 2 MSP430F4270IDL DNP: Enclosed with kit supplied by TI 74 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RGZ48B B.15 MSP-TS430RGZ48B Figure B-29. MSP-TS430RGZ48B Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 75 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to disconnect LED Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply MSP-TS430RGZ48B www.ti.com Figure B-30. MSP-TS430RGZ48B Target Socket Module, PCB 76 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RGZ48B Table B-16. MSP-TS430RGZ48B Bill of Materials Position Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, 3 10uF, 6.3V, SMD0805 C12 4 C5, C11, 4 100nF, SMD0805 311-1245-2-ND C13, C14 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 D1 1 green LED, SMD0805 P516TR-ND J1, J2, J3, SAM1029-12-ND DNP: Headers and receptacles 8 J4 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free of ND (Receptacle) solder: 9 J5 1 3-pin header, male, TH JP3, JP5, place jumpers on pins 2-3 on JP5, 10 JP6, JP7, 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place JP8, JP9, jumpers on pins 1-2 on JP3, JP10 11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11 13 JTAG 1 14-pin connector, male, HRP14H-ND TH 14 BOOTST 0 10-pin connector, male, "DNP Keep vias free of solder" TH Micro Crystal MS3V-T1R 15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder 12.5pF 16 Q2 0 Crystal Q2: 4MHz Buerklin: DNP: Q2 Keep vias free of solder 78D134 Insulating http://www.ettinger.de/Ar 17 disk to Q2 0 Insulating disk to Q2 t_Detail.cfm?ART_ART NUM=70.08.121 18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND R1, R2, R4, R6, 19 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12 R9,R10, R11, R12 20 R5 1 47k Ω, SMD0805 541-47000ATR-ND 21 U1 1 Socket: QFN11T048- Manuf.: Yamaichi 008_A101121_RGZ48 22 PCB 1 81 x 76 mm 2 layers Adhesive Approximately 6mm for example, 3M 23 plastic feet 4 width, 2mm height Bumpons Part No. SJ- Apply to corners at bottom side 5302 24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI SLAU278R–May 2009–Revised May 2014 Hardware 77 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated DNP DNP DNP GND GND 100nF 330R 0R - GND GND 47k 1.1nF GND 0R 0R 0R 1uF/10V QUARZ5 1uF/10V 100nF green DNP yellow (DNP) DNP red (DNP) 0R GND DNP DNP 0R 0R QUARZ5 EVQ11 0R DNP DNP If external supply voltage: remove R3 and add R2 (0 Ohm) 1.3 Ext_PWR MSP-TS430RGZ48C Vcc int ext Target Socket Board for MSP430FR58xx, FR59xx IRGZ DNP DNP DNP DNP DNP JTAG -> SBW -> JTAG-Mode selection: 4-wire JTAG: Set jumpers JP3 to JP8 to position 2-3 2-wire "SpyBiWire": Set jumpers JP3 to JP8 to position 1-2 connection by via DNP DNP 1 3 5 7 9 11 13 2 4 6 12 14 8 10 JTAG C2 C1 C4 R1 1 2 3 4 5 6 7 8 9 10 BOOTST R3 R2 1 2 3 J2 J1 1 2 3 JP1 1 2 1 2 JP9 R4 C5 1 2 3 JP3 1 2 3 JP4 1 2 3 JP5 1 2 3 JP6 1 2 3 JP7 1 2 3 JP8 R5 R6 R7 C3 Q1 C7 C6 D1 R10 1 2 JP10 D2 R11 1 2 JP11 D3 R12 JP2 1 2 C8 C9 R9 R8 Q2 SV4 1 2 3 4 5 6 7 8 9 10 11 12 SV1 1 2 3 4 5 6 7 8 9 10 11 12 SV2 1 2 3 4 5 6 7 8 9 10 11 12 SV3 1 2 3 4 5 6 7 8 9 10 11 12 1 1_P1.0 2 2_P1.1 3 3_P1.2 4 4_P3.0 5 5_P3.1 6 6_P3.2 7 7_P3.3 8 8_P4.7 9 9_P1.3 10 10_P1.4 11 11_P1.5 12 12_PJ.0_TDO 13 13_PJ.1_TDI 14 14_PJ.2_TMS 15 15_PJ.3/TCK 16 16_P4.0 17 17_P4.1 18 18_P4.2 19 19_P4.3 20 20_P2.5 21 21_P2.6 22 22_TEST/SBWTCK 23 23_RST/SBWTDIO 24 24_P2.0 25_P2.1 25 26_P2.2 26 27_P3.4 27 28_P3.5 28 29_P3.6 29 30_P3.7 30 31_P1.6 31 32_P1.7 32 33_P4.4 33 34_P4.5 34 35_P4.6 35 36_DVSS 36 37_DVCC 37 38_P2.7 38 39_P2.3 39 40_P2.4 40 41_AVSS 41 42_HFXIN 42 43_HFXOUT 43 44_AVSS 44 45_LFXIN 45 46_LFXOUT 46 47_AVSS 47 48_AVCC 48 U1 SW1 R13 TP1TP2 SW2 R14 P1.0 P1.0 RST/NMI TMS TDI VCC GND P1.1 P1.1 RST/SBWTDIO RST/SBWTDIO RST/SBWTDIO TCK/SBWTCK TDO/SBWTDIO PJ.0/TDO PJ.0/TDO PJ.2/TMS PJ.2/TMS PJ.3/TCK PJ.3/TCK PJ.1/TDI PJ.1/TDI P1.2 P1.2 P2.0 P2.0 P2.1 P2.1 P1.3 P1.3 P1.4 P1.5 AVCC AVCC AVSS AVSS AVSS AVSS LFXOUT LFXIN LFGND HFGND HFXOUT HFXIN P2.4 P2.3 P2.7 DVCC DVCC DVCC DVCC DVSS DVSS P4.6 P4.5 P4.4 P1.7 P1.6 P3.7 P3.6 P3.5 P3.4 P2.2 P2.6 P2.5 P4.3 P4.2 P4.1 P4.0 P4.7 P3.3 P3.2 P3.1 P3.0 TEST/SBWTCK1 TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK MSP-TS430RGZ48C www.ti.com B.16 MSP-TS430RGZ48C Figure B-31. MSP-TS430RGZ48C Target Socket Module, Schematic 78 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP1 Open to measure current Connector J2 External power connector Jumper J1 to "ext" Jumpers JP3 to JP8 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Switch SW1 Device reset LEDs connected to P1.0, P1.1, P1.2 via JP9, JP10, JP11 (only D1 assembled) Orient Pin 1 of MSP430 device Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper J1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP2 Analog/digital power Switch SW2 Connected to P1.3 HF ands LF oscillators with capacitors and resistors to connect pinheads www.ti.com MSP-TS430RGZ48C Figure B-32. MSP-TS430RGZ48C Target Socket Module, PCB Table B-17. MSP-TS430RGZ48C Revision History Revision Comments 1.2 Initial release LFOSC pins swapped at SV1 (9-10). 1.3 HFOSC pins swapped at SV1 (6-7). BOOTST pin 4 now directly connected to the device RST/SBWTDIO pin. SLAU278R–May 2009–Revised May 2014 Hardware 79 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430RGZ48C www.ti.com Table B-18. MSP-TS430RGZ48C Bill of Materials Number Pos Ref Des Per Description Digi-Key Part Number Comment Board 1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit. SV4 Keep vias free of solder. SAM1029-12-ND : Header : Receptacle 1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit. SV4 Keep vias free of solder. : Header SAM1213-12-ND : Receptacle 2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP 4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 JP6, JP7, JP8 5 J2 1 3-pin header, male, TH SAM1035-03-ND 6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6, JP3, JP4, JP5, JP7, JP8 JP6, JP7, JP8 7 R2, R3, R5, R6, 9 DNP, 0805 DNP R8, R9, R10, R11, R14 8 R12, R13, R7 3 0R, 0805 541-000ATR-ND 9 C5 1 1.1nF, CSMD0805 490-1623-2-ND 10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND 11 R4 1 47k, 0805 541-47000ATR-ND 12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND 13 R1 1 330R, 0805 541-330ATR-ND 14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP 15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP 16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder 17 JTAG 1 14-pin connector, male, TH HRP14H-ND 18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias 20ppm, 12.5pF) free of solder 19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder 20 U1 1 Socket: QFN11T048-008 Manuf.: Yamaichi A101121-001 20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI. 21 D1 1 green LED, DIODE0805 P516TR-ND 22 D3 1 red (DNP), DIODE0805 DNP 23 D2 1 yellow (DNP), DIODE0805 DNP 24 TP1, TP2 2 Testpoint DNP, keep pads free of solder 25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side 26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder mask Rev. 1.2 80 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated ML14 LED3 0R 12pF 12pF 12pF 12pF GND GND 0R 100nF 560R ML10 JP1Q JP1Q 10uF/6,3V 10uF/10V 47K 10nF 0R 0R 0R - - 0R - 0R 0R FE16-1-1 FE16-1-2 FE16-1-3 FE16-1-4 PWR3 GNDGND - MSP64PM not assembled not assembled not assembled not assembled enhancement reserved for future JTAG 1 3 5 7 9 11 13 2 4 6 12 14 8 10 D1 R2 C2 C1 C3 C4 R1 C5 R3 BOOTST 1 2 3 4 5 6 7 8 9 10 J7 1 2 J6 1 2 C6 C7 R5 C8 R6 R7 R8 R9 R10 R11 R12 R13 R14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 J1 J2 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 J3 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 J4 J5 1 2 3 R4 Q1 LFXTCLK XTCLK U2 DVCC 2 3 4 5 6 7 XIN XOUT 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 TDO TDI TMS TCK RST 59 60 61 AVSS DVSS AVCC RST/NMI TCK TMS TDI TDO VCC Date: 3/14/2006 10:46:30 AM Sheet: 1/1 REV: TITLE: Document Number: MSP-TS430PM64 + + 1 MSP-TS430PM64 Target Socket PM64 Yamaichi IC51-0644-807 Socket: 1.2 for F14x and F41x Open J6 if LCD is connected If external supply voltage: remove R8 and add R9 (0 Ohm) If external supply voltage: remove R11 and add R10 (0 Ohm) For BSL usage add: R6 R7 R13 R14 MSP430F14x : 0 0 open open MSP430F41x : open open 0 0 www.ti.com MSP-TS430PM64 B.17 MSP-TS430PM64 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-33. MSP-TS430PM64 Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 81 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Connector J5 External power connection Remove R8 and jumper R9 D1 LED connected to pin 12 Jumper J6 Open to disconnect LED Jumper J7 Open to measure current Orient Pin 1 of MSP430 device Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool MSP-TS430PM64 www.ti.com Figure B-34. MSP-TS430PM64 Target Socket Module, PCB 82 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430PM64 Table B-19. MSP-TS430PM64 Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles enclosed with 7 J1, J2, J3, J4 0 16-pin header, TH kit.Keep vias free of solder. SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 11 2 Jumper 15-38-1024-ND Place on: J6, J7 12 JTAG 1 14-pin connector, male, TH HRP14H-ND 13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of 14 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder 12.5pF 15 R3 1 330 Ω, SMD0805 541-330ATR-ND R1, R2, R4, R6, R7, R8, DNP: R4, R6, R7, R9, R10, 16 R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND R11, R12, R13, R14 R11, R12, R13, R14 17 R5 1 47k Ω, SMD0805 541-47000ATR-ND 18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 19 PCB 1 78 x 75 mm 2 layers 20 Rubber 4 select appropriate Apply to corners at bottom standoff side 21 MSP430 22 MSP430F2619IPM DNP: Enclosed with kit MSP430F417IPM supplied by TI SLAU278R–May 2009–Revised May 2014 Hardware 83 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated 0R 12pF 12pF GND GND 0R 100nF 330R 10uF/6.3V 0R 0R 0R 0R PWR3 GND 47k 2.2nF 330R GND GND 100nF GND 0R 0R MSP-TS430PM64A Target Socket DNP Yamaichi IC51-0644-807 Socket: DNP 1.1 for F4152 Open JP1 if LCD is connected JTAG -> SBW -> DNP DNP DNP DNP DNP DNP DNP Vcc ext int TEST/SBWTCK RST/SBWTDIO P7.0/TDO P7.1/TDI P7.2/TMS P7.3/TCK ADD LCD-CAP! DNP DNP JTAG 1 3 5 7 9 11 13 2 4 6 12 14 8 10 R2 C2 C1 R1 C5 R3 BOOTST 1 2 3 4 5 6 7 8 9 10 C6 R10 R11 R13 R14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 J1 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 J2 J3 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 J4 J5 1 2 3 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 1 2 3 4 5 6 7 8 9 11 12 13 14 15 10 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 2 Q1 R4 C3 1 2 3 JP4 JP5 1 2 3 JP6 1 2 3 JP7 1 2 3 JP8 1 2 3 R6 JP9 1 2 3 1 2 JP1 JP2 1 2 JP3 1 2 3 D1 C4 R5 R7 RST/NMI TMS TDI VCC GND XTLGND TCK/SBWTCK TDO/SBWTDIO VCC430 VCC430 VCC430 P5.1 P5.1 AVCC AVCC AVSS AVSS P1.0 P1.1 XIN XOUT A A A B B B C C D D E E F F Date: 3/29/2011 3:07:02 PM Sheet: 1/1 REV: TITLE: Document Number: MSP-TS430PM64A + TEST/SBWTCK RST/SBWTDIO If supplied locally: populate R10 (0R), remove R11 If supplied by interface: populate R11 (0R), remove R10 MSP-TS430PM64A www.ti.com B.18 MSP-TS430PM64A Figure B-35. MSP-TS430PM64A Target Socket Module, Schematic 84 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to measure current Jumper JP1 Open to disconnect LED D1 LED connected to P5.1 Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 ofMSP430 device Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP3 to "ext" www.ti.com MSP-TS430PM64A Figure B-36. MSP-TS430PM64A Target Socket Module, PCB SLAU278R–May 2009–Revised May 2014 Hardware 85 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430PM64A www.ti.com Table B-20. MSP-TS430PM64A Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2, 0 12pF, SMD0805 DNP 2 C3 0 2.2nF, SMD0805 DNP 3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND 4 C4, C5 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles enclosed with kit. 6 J1, J2, J3, J4 0 16-pin header, TH Keep vias free of solder. SAM1029-16-ND : Header SAM1213-16-ND : Receptacle J5, JP3, JP4, 7 JP5, JP6, 8 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9 8 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 2 Jumper 15-38-1024-ND Place on: J6, J7 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Micro Crystal MS1V-T1K DNP: Keep vias free of 12 Q1 0 Crystal 32.768kHz, C(Load) = solder 12.5pF 13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND R1, R2, R5, 14 R7, R9, R10, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R5, R7, R9, R10, R11, R11, R13, R13, R14 R14 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 17 PCB 1 78 x 75 mm 4 layers 18 Rubber stand 4 select appropriate Apply to corners at bottom off side 19 MSP430 2 MSP430F4152IPM DNP: Enclosed with kit supplied by TI 86 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RGC64B B.19 MSP-TS430RGC64B Figure B-37. MSP-TS430RGC64B Target Socket Module, Schematic SLAU278R–May 2009–Revised May 2014 Hardware 87 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Jumper JP2 Open to disconnect LED Connector J5 External power connector Jumpers JP5 to JP10 Jumper JP3 to "ext" Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 If the system should be supplied via LDOI (J6), close JP4 and set JP3 to "ext" Orient Pin 1 of MSP430 device Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP1 Open to measure current MSP-TS430RGC64B www.ti.com Figure B-38. MSP-TS430RGC64B Target Socket Module, PCB 88 Hardware SLAU278R–May 2009–Revised May 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated www.ti.com MSP-TS430RGC64B Table B-21. MSP-TS430RGC64B Bill of Materials Pos. Ref Des No. per Description Digi-Key Part No. Comment Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10 3 10uF, 6.3V, SMD0805 C5, C11, 4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND C15 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND J1, J2, J3, SAM1029-16-ND DNP: Headers and receptacles 10 J4 0 16-pin header, TH (Header) SAM1213-16- enclosed with kit. Keep vias free of ND (Receptacle) solder: 11 J5 , J6 2 3-pin header, male, TH JP3, JP5, place jumpers on pins 2-3 on JP5, JP6, 12 JP6, JP7, 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on JP8, JP9, pins 1-2 on JP3, JP10 13 JP1, JP2, 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header JP4 14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 15 JTAG 1 14-pin connector, male, HRP14H-ND TH 16 BOOTST 0 10-pin connector, male, "DNP Keep vias free of solder" TH Micro Crystal MS3V-T1R 17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder 12.5pF 18 Q2 0 Crystal Q2: 4MHz Buerklin: DNP: Q2 Keep vias free of solder 78D134 Insulating http://www.ettinger.de/Art 19 disk to Q2 0 Insulating disk to Q2 _Detail.cfm?ART_ARTNU M=70.08.121 20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND R1, R2, R4, 21 R6, R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12 R9,R10, R11, R12 22 R5 1 47k Ω, SMD0805 541-47000ATR-ND 23 U1 1 Socket: QFN11T064-006- Manuf.: Yamaichi N-HSP 24 PCB 1 85 x 76 mm 2 layers Adhesive Approximately 6mm for example, 3M 25 plastic feet 4 width, 2mm height Bumpons Part No. SJ- Apply to corners at bottom side 5302 26 D3,D4 27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI SLAU278R–May 2009–Revised May 2014 Hardware 89 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated MSP-TS430RGC64C www.ti.com B.20 MSP-TS430RGC64C The MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIO input voltage supplied via header J6 (see Figure B-39). This development platform does not supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device operation. For correct JTAG connection, programming, and debug operation, it is important to follow this procedure: 1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to 0 V. 2. Enable the 1.8-V external DVIO power supply. 3. Enable the 1.8-V to 3.6-V VCC power s