CD4066B (Rev. D) - Texas Instruments - Farnell Element 14 - Revenir à l'accueil

 

 

Branding Farnell element14 (France)

 

Farnell Element 14 :

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Everything You Need To Know About Arduino

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Tutorial 01 for Arduino: Getting Acquainted with Arduino

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The Cube® 3D Printer

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What's easier- DIY Dentistry or our new our website features?

 

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Ben Heck's Getting Started with the BeagleBone Black Trailer

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Ben Heck's Home-Brew Solder Reflow Oven 2.0 Trailer

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Get Started with Pi Episode 3 - Online with Raspberry Pi

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Discover Simulink Promo -- Exclusive element14 Webinar

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Ben Heck's TV Proximity Sensor Trailer

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Ben Heck's PlayStation 4 Teardown Trailer

See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…

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Get Started with Pi Episode 4 - Your First Raspberry Pi Project

Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.

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Ben Heck Anti-Pickpocket Wallet Trailer

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Molex Earphones - The 14 Holiday Products of Newark element14 Promotion

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Tripp Lite Surge Protector - The 14 Holiday Products of Newark element14 Promotion

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Microchip ChipKIT Pi - The 14 Holiday Products of Newark element14 Promotion

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Beagle Bone Black - The 14 Holiday Products of Newark element14 Promotion

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3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

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3M Colored Duct Tape - The 14 Holiday Products of Newark element14 Promotion

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Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

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Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

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Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

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Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

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Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

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Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

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Dymo RHINO 6000 Label Printer - The 14 Holiday Products of Newark element14 Promotion

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3M LED Advanced Lights A-19 - The 14 Holiday Products of Newark element14 Promotion

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Innovative LPS Resistor Features Very High Power Dissipation

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Charge Injection Evaluation Board for DG508B Multiplexer Demo

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Ben Heck The Great Glue Gun Trailer Part 2

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Introducing element14 TV

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Ben Heck Time to Meet Your Maker Trailer

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Détecteur de composants

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Recherche intégrée

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Ben Builds an Accessibility Guitar Trailer Part 1

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Ben Builds an Accessibility Guitar - Part 2 Trailer

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PiFace Control and Display Introduction

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Flashmob Farnell

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Express Yourself in 3D with Cube 3D Printers from Newark element14

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Farnell YouTube Channel Move

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Farnell: Design with the best

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French Farnell Quest

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Altera - 3 Ways to Quickly Adapt to Changing Ethernet Protocols

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Cy-Net3 Network Module

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MC AT - Professional and Precision Series Thin Film Chip Resistors

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Solderless LED Connector

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PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701T

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3-axis Universal Motion Controller For Stepper Motor Drivers: TMC429

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Voltage Level Translation

Puce électronique / Microchip :

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Microchip - 8-bit Wireless Development Kit

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

Sans fil - Wireless :

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Microchip - 8-bit Wireless Development Kit

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Wireless Power Solutions - Wurth Electronics, Texas Instruments, CadSoft and element14

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Analog Devices - Remote Water Quality Monitoring via a Low Power, Wireless Network

Texas instrument :

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Texas Instruments - Automotive LED Headlights

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Texas Instruments - Digital Power Solutions

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Texas Instruments - Industrial Sensor Solutions

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Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

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Texas Instruments - Industrial Automation System Components

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Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

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Texas Instruments - TMS320C66x KeyStone Multicore Architecture

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Texas Instruments - Industrial Interfaces

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Texas Instruments - Concerto™ MCUs - Connectivity without compromise

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Texas Instruments - Stellaris Robot Chronos

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Texas Instruments - DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit

Ordinateurs :

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Ask Ben Heck - Connect Raspberry Pi to Car Computer

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Ben's Portable Raspberry Pi Computer Trailer

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Ben's Raspberry Pi Portable Computer Trailer 2

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Ben Heck's Pocket Computer Trailer

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Ask Ben Heck - Atari Computer

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Ask Ben Heck - Using Computer Monitors for External Displays

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Raspberry Pi Partnership with BBC Computer Literacy Project - Answers from co-founder Eben Upton

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Installing RaspBMC on your Raspberry Pi with the Farnell element14 Accessory kit

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Raspberry Pi Served - Joey Hudy

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Happy Birthday Raspberry Pi

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Raspberry Pi board B product overview

Logiciels :

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Ask Ben Heck - Best Opensource or Free CAD Software

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Tektronix FPGAView™ software makes debugging of FPGAs faster than ever!

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Ask Ben Heck - Best Open-Source Schematic Capture and PCB Layout Software

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Introduction to Cadsoft EAGLE PCB Design Software in Chinese

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Altera - Developing Software for Embedded Systems on FPGAs

Tutoriels :

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Ben Heck The Great Glue Gun Trailer Part 1

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the knode tutorial - element14

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Ben's Autodesk 123D Tutorial Trailer

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Ben's CadSoft EAGLE Tutorial Trailer

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Ben Heck's Soldering Tutorial Trailer

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Ben Heck's AVR Dev Board tutorial

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Ben Heck's Pinball Tutorial Trailer

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Ben Heck's Interface Tutorial Trailer

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First Stage with Python and PiFace Digital

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Cypress - Getting Started with PSoC® 3 - Part 2

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Energy Harvesting Challenge

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New Features of CadSoft EAGLE v6

Autres documentations :

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      SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1  15-V Digital or ±7.5-V Peak-to-Peak Switching  125-Ω Typical On-State Resistance for 15-V Operation  Switch On-State Resistance Matched to Within 5 Ω Over 15-V Signal-Input Range  On-State Resistance Flat Over Full Peak-to-Peak Signal Range  High On/Off Output-Voltage Ratio: 80 dB Typical at fis = 10 kHz, RL = 1 kΩ  High Degree of Linearity: <0.5% Distortion Typical at fis = 1 kHz, Vis = 5 V p-p, VDD − VSS ≥ 10 V, RL = 10 kΩ  Extremely Low Off-State Switch Leakage, Resulting in Very Low Offset Current and High Effective Off-State Resistance: 10 pA Typical at VDD − VSS = 10 V, TA = 25°C  Extremely High Control Input Impedance (Control Circuit Isolated From Signal Circuit): 1012 Ω Typical  Low Crosstalk Between Switches: −50 dB Typical at fis = 8 MHz, RL = 1 kΩ  Matched Control-Input to Signal-Output Capacitance: Reduces Output Signal Transients  Frequency Response, Switch On = 40 MHz Typical  100% Tested for Quiescent Current at 20 V  5-V, 10-V, and 15-V Parametric Ratings  Meets All Requirements of JEDEC Tentative Standard No. 13-B, Standard Specifications for Description of “B” Series CMOS Devices  Applications: − Analog Signal Switching/Multiplexing: Signal Gating, Modulator, Squelch Control, Demodulator, Chopper, Commutating Switch − Digital Signal Switching/Multiplexing − Transmission-Gate Logic Implementation − Analog-to-Digital and Digital-to-Analog Conversion − Digital Control of Frequency, Impedance, Phase, and Analog-Signal Gain description/ordering information The CD4066B is a quad bilateral switch intended for the transmission or multiplexing of analog or digital signals. It is pin-for-pin compatible with the CD4016B, but exhibits a much lower on-state resistance. In addition, the on-state resistance is relatively constant over the full signal-input range. The CD4066B consists of four bilateral switches, each with independent controls. Both the p and the n devices in a given switch are biased on or off simultaneously by the control signal. As shown in Figure 1, the well of the n-channel device on each switch is tied to either the input (when the switch is on) or to VSS (when the switch is off). This configuration eliminates the variation of the switch-transistor threshold voltage with input signal and, thus, keeps the on-state resistance low over the full operating-signal range. The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold applications, the CD4016B is recommended.      !"   #!$% &"' Copyright  2003, Texas Instruments Incorporated &!   #" #" (" "  ") !" && *+' &! #", &"  ""%+ %!&" ",  %% #""' Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 14 13 12 11 10 9 8 SIG A IN/OUT SIG A OUT/IN SIG B OUT/IN SIG B IN/OUT CONTROL B CONTROL C VSS VDD CONTROL A CONTROL D SIG D IN/OUT SIG D OUT/IN SIG C OUT/IN SIG C IN/OUT E, F, M, NS, OR PW PACKAGE (TOP VIEW)       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description/ordering information (continued) ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING CDIP − F Tube of 25 CD4066BF3A CD4066BF3A PDIP − E Tube of 25 CD4066BE CD4066BE Tube of 50 CD4066BM −55°C to 125°C SOIC − M Reel of 2500 CD4066BM96 CD4066BM −55°C to 125°C SOIC − M Reel of 250 CD4066BMT CD4066BM SOP − NS Reel of 2000 CD4066BNSR CD4066B TSSOP − PW Tube of 90 CD4066BPW CM066B Reel of 2000 CD4066BPWR † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. † All control inputs are protected by the CMOS protection network. NOTES: A. All p substrates are connected to VDD. B. Normal operation control-line biasing: switch on (logic 1), VC = VDD; switch off (logic 0), VC = VSS C. Signal-level range: VSS ≤ Vis ≤ VDD Control VC† VDD VSS VSS n n p Out Vos Control Switch In 92CS-29113 p n Vis Figure 1. Schematic Diagram of One-of-Four Identical Switches and Associated Control Circuitry       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† DC supply-voltage range, VDD (voltages referenced to VSS terminal) −0.5 V to 20 V . . . . . . . . . . . . . . . . . . . . Input voltage range, Vis (all inputs) −0.5 V to V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DD + 0.5 V DC input current, IIN (any one input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA Package thermal impedance, θJA (see Note 1): E package 80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W M package 86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W NS package 76 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W PW package 113 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 265 . . . . . . . . . . . . . . . . . . . . . . . °C Storage temperature range, Tstg −65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN MAX UNIT VDD Supply voltage 3 18 V TA Operating free-air temperature −55 125 °C       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics LIMITS AT INDICATED TEMPERATURES PARAMETER TEST CONDITIONS VIN VDD −55°C −40°C 85°C 125°C PARAMETER TEST CONDITIONS 25°C UNIT VIN (V) VDD (V) −55°C −40°C 85°C 125°C TYP MAX UNIT 0, 5 5 0.25 0.25 7.5 7.5 0.01 0.25 IDD Quiescent device 0, 10 10 0.5 0.5 15 15 0.01 0.5 IDD A Quiescent device current 0, 15 15 1 1 30 30 0.01 1 µA current 0, 20 20 5 5 150 150 0.02 5 Signal Inputs (Vis) and Outputs (Vos) VC = VDD, RL = 10 kΩ returned 5 800 850 1200 1300 470 1050 ron On-state resistance (max) RL = 10 kΩ returned to , VDD VSS 2 on 10 310 330 500 550 180 400 Ω (max) to , Vis = VSS to VDD 2 15 200 210 300 320 125 240 On-state resistance 5 15 ∆ron On-state resistance difference between any two switches RL = 10 kΩ, VC = VDD ∆ron difference between 10 10 Ω any two switches RL = 10 kΩ, VC = VDD 15 5 Ω THD Total harmonic distortion VC = VDD = 5 V, VSS = −5 V, Vis(p-p) = 5 V (sine wave centered on 0 V), RL = 10 kΩ, fis = 1-kHz sine wave 0.4 % −3-dB cutoff frequency (switch on) VC = VDD = 5 V, VSS = −5 V, Vis(p-p) = 5 V (sine wave centered on 0 V), RL = 1 kΩ 40 MHz −50-dB feedthrough frequency (switch off) VC = VSS = −5 V, Vis(p-p) = 5 V (sine wave centered on 0 V), RL = 1 kΩ 1 MHz Iis Input/output leakage current (switch off) (max) VC = 0 V, Vis = 18 V, Vos = 0 V; and VC = 0 V, Vis = 0 V, Vos = 18 V 18 ±0.1 ±0.1 ±1 ±1 ±10−5 ±0.1 µA −50-dB crosstalk frequency VC(A) = VDD = 5 V, VC(B) = VSS = −5 V, Vis(A) = 5 Vp-p, 50-Ω source, RL = 1 kΩ 8 MHz Propagation delay RL = 200 kΩ, VC = VDD, VSS = GND, CL = 50 pF, 5 20 40 tpd Propagation delay (signal input to signal output) VSS = GND, CL = 50 pF, Vis = 10 V (square wave centered on 5 V), pd (signal input to 10 10 20 ns signal output) is (square wave centered on 5 V), tr, tf = 20 ns 15 7 15 Cis Input capacitance VDD = 5 V, VC = VSS = −5 V 8 pF Cos Output capacitance VDD = 5 V, VC = VSS = −5 V 8 pF Cios Feedthrough VDD = 5 V, VC = VSS = −5 V 0.5 pF       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 electrical characteristics (continued) LIMITS AT INDICATED TEMPERATURES CHARACTERISTIC TEST CONDITIONS VDD −55°C −40°C 85°C 125°C CHARACTERISTIC TEST CONDITIONS 25°C UNIT VDD (V) −55°C −40°C 85°C 125°C TYP MAX UNIT Control (VC) Control input, |Iis| < 10 µA, 5 1 1 1 1 1 VILC Control input, low voltage (max) |Iis| < 10 µA, Vis = VSS, VOS = VDD, and V = V , V = V VILC 10 2 2 2 2 2 V low voltage (max) Vis = VSS, VOS = VDD, and Vis = VDD, VOS = VSS 15 2 2 2 2 2 V Control input, 5 3.5 (MIN) VIHC high voltage VIHC See Figure 6 10 7 (MIN) V high voltage See Figure 6 15 11 (MIN) V IIN Input current (max) Vis ≤ VDD, VDD − VSS = 18 V, VCC ≤ VDD − VSS 18 ±0.1 ±0.1 ±1 ±1 ±10−5 ±0.1 µA Crosstalk (control input to signal output) VC = 10 V (square wave), tr, tf = 20 ns, RL = 10 kΩ 10 50 mV Turn-on and turn-off VIN = VDD, tr, tf = 20 ns, 5 35 70 Turn-on and turn-off propagation delay VIN = VDD, tr, tf = 20 ns, CL = 50 pF, RL = 1 kΩ 10 20 40 ns propagation delay CL = 50 pF, RL = 1 kΩ 15 15 30 ns Vis = VDD, VSS = GND, RL = 1 kΩ to GND, CL = 50 pF, 5 6 Maximum control input repetition rate RL = 1 kΩ to GND, CL = 50 pF, VC = 10 V (square wave centered on 5 V), tr, tf = 20 ns, 10 9 MHz repetition rate C centered on 5 V), tr, tf = 20 ns, Vos = 1/2 Vos at 1 kHz 15 9.5 CI Input capacitance 5 7.5 pF switching characteristics VDD SWITCH INPUT SWITCH VDD OUTPUT, Vos (V) Vis (V) Iis (mA) OUTPUT, Vos (V) (V) Vis (V) −55°C −40°C 25°C 85°C 125°C MIN MAX 5 0 0.64 0.61 0.51 0.42 0.36 0.4 5 5 −0.64 −0.61 −0.51 −0.42 −0.36 4.6 10 0 1.6 1.5 1.3 1.1 0.9 0.5 10 10 −1.6 −1.5 −1.3 −1.1 −0.9 9.5 15 0 4.2 4 3.4 2.8 2.4 1.5 15 15 −4.2 −4 −3.4 −2.8 −2.4 13.5       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS Vis − Input Signal Voltage − V 600 500 400 300 200 100 0 −4 −3 −2 −1 0 1 2 3 4 TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 92CS-27326RI Figure 2 TA = 125°C +25°C −55°C Supply Voltage (VDD − VSS) = 5 V − Channel On-State Resistance − on Ω r Figure 3 TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 300 250 200 150 100 50 0 −10 −7.5 −5 −2.5 0 2.5 5 7.5 10 Supply Voltage (VDD − VSS) = 10 V TA = 125°C Vis − Input Signal Voltage − V +25°C −55°C 92CS-27327RI − Channel On-State Resistance − on Ω r Vis − Input Signal Voltage − V TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) Figure 4 300 250 200 150 100 50 0 −10 −7.5 −5 −2.5 0 2.5 5 7.5 10 Supply Voltage (VDD − VSS) = 15 V TA = 125°C +25°C −55°C 92CS-27329RI − Channel On-State Resistance − on Ω r Vis − Input Signal Voltage − V Figure 5 TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 600 500 400 300 200 100 0 −10 −7.5 −5 −2.5 0 2.5 5 7.5 10 Supply Voltage (VDD − VSS) = 5 V TA = 125°C 10 V −15 V 92CS-27330RI − Channel On-State Resistance − on Ω r       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TYPICAL CHARACTERISTICS CD4066B 1 of 4 Switches Iis Vis Vos 92CS-30966 |Vis − Vos| |Iis| ron = Figure 6. Determination of ron as a Test Condition for Control-Input High-Voltage (VIHC) Specification X-Y Plotter 1-kΩ Range TG On Keithley 160 Digital Multimeter H. P. Moseley 7030A X VSS VDD 10 kΩ 92CS-22716 Y Figure 7. Channel On-State Resistance Measurement Circuit Figure 8 TYPICAL ON CHARACTERISTICS FOR 1 OF 4 CHANNELS 3 2 1 0 −1 −2 −3 −3 −2 −1 0 1 2 3 4 VI − Input Voltage − V 92CS-30919 Output Voltage − V V − VC = VDD VDD Vis Vos RL VSS All unused terminals are connected to VSS CD4066B 1 of 4 Switches O Figure 9 10 102 103 10 101 102 103 104 f − Switching Frequency − kHz POWER DISSIPATION PER PACKAGE vs SWITCHING FREQUENCY TA = 25°C Power Dissipation Per Package − W D µ 6 4 2 6 4 2 6 4 2 6 4 2 2 46 2 46 92C-30920 5 V 10 V VSS VDD 5 6 13 12 7 CD4066B P − 14 Supply Voltage (VDD) = 15 V       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS V VDD = 5 V C = −5 V VSS = −5 V Cios Cis Cos CD4066B 1 of 4 Switches Measured on Boonton capacitance bridge, model 75a (1 MHz); test-fixture capacitance nulled out. 92CS-30921 Figure 10. Typical On Characteristics for One of Four Channels VDD VC = VSS Vos VSS CD4066B 1 of 4 Switches Vis = VDD I 92CS-30922 Figure 11. Off-Switch Input or Output Leakage All unused terminals are connected to VSS. VDD VC = VDD Vos VSS CD4066B 1 of 4 Switches Vis Figure 12. Propagation Delay Time Signal Input (Vis) to Signal Output (Vos) 92CS-30923 200 kΩ 50 pF VDD tr = tf = 20 ns All unused terminals are connected to VSS. VC VDD Vos VSS CD4066B 1 of 4 Switches Vis Figure 13. Crosstalk-Control Input to Signal Output +10 V tr = tf = 20 ns 92CS-30924 1 kΩ 10 kΩ All unused terminals are connected to VSS.       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TYPICAL CHARACTERISTICS VDD VC = VDD Vos VSS CD4066B 1 of 4 Switches VDD 92CS-30925 1 kΩ 50 pF VDD NOTES: A. All unused terminals are connected to VSS. B. Delay is measured at Vos level of +10% from ground (turn-on) or on-state output level (turn-off). tr = tf = 20 ns Figure 14. Propagation Delay, tPLH, tPHL Control-Signal Output VDD = 10 V VC VSS CD4066B 1 of 4 Switches Vis = 10 V 92CS-30925 50 pF 1 kΩ tr = tf = 20 ns VC Vos 90% 10% All unused terminals are connected to VSS. VOS  VOS at 1 kHz 2 VOS  VOS at 1 kHz 2 Repetition Rate 50% tr tf 10 V 0 V Figure 15. Maximum Allowable Control-Input Repetition Rate       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS Inputs VSS Measure inputs sequentially to both VDD and VSS. Connect all unused inputs to either VDD or VSS. Measure control inputs only. I VSS VDD 92CS-27555 Figure 16. Input Leakage-Current Test Circuit VDD Channel 1 Channel 2 Channel 3 Channel 4 Channel 1 Channel 2 Channel 3 Channel 4 1/4 CD4066B CD4066B CD4066B CD4018B CD4018B 1/4 CD4066B CD4001B LPF LPF LPF LPF 1 10 2 3 7 9 12 5 4 14 15 13 1 2 3 5 2 4 1 2 5 6 8 9 12 13 3 4 10 1 8 4 11 11 12 6 5 13 9 10 2 3 10 2 3 7 9 12 14 15 1 5 4 7 9 6 10 13 12 9 8 6 5 2 1 11 10 4 3 12 6 5 11 11 12 5 4 3 8 11 4 1 2 3 9 10 PE J1 J2 J3 J4 J5 Q1 Q2 1/3 CD4049B CD4001B Signal Inputs Clock Reset Package Count 2 - CD4001B 1 - CD4049B 3 - CD4066B 2 - CD4018B 1/3 CD4049B 1/6 CD4049B 10 k Signal Outputs PE J1 J2 J3 J4 J5 Q1 Q2 External Reset Clock Chan 1 Chan 2 Chan 3 Chan 4 VDD 30% (VDD − VSS) Clock Maximum Allowable Signal Level VSS 92CM-30928 Ω 10 kΩ 10 kΩ 10 kΩ 10 kΩ Figure 17. Four-Channel PAM Multiplex System Diagram       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TYPICAL CHARACTERISTICS SWA SWB SWC SWD 92CS-30927 Analog Inputs (±5 V) VDD = 5 V VDD = 5 V 5 V −5 V 5 V CD4066B Analog Outputs (±5 V) VSS = −5 V CD4054B VSS = 0 V VEE = −5 V IN 0 Digital Control Inputs 0 Figure 18. Bidirectional Signal Transmission Via Digital Control Logic       SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION In applications that employ separate power sources to drive VDD and the signal inputs, the VDD current capability should exceed VDD/RL (RL = effective external load of the four CD4066B bilateral switches). This provision avoids any permanent current flow or clamp action on the VDD supply when power is applied or removed from the CD4066B. In certain applications, the external load-resistor current can include both VDD and signal-line components. To avoid drawing VDD current when switch current flows into terminals 1, 4, 8, or 11, the voltage drop across the bidirectional switch must not exceed 0.8 V (calculated from ron values shown). No VDD current will flow through RL if the switch current flows into terminals 2, 3, 9, or 10. PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples CD4066BE ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU | CU SN N / A for Pkg Type -55 to 125 CD4066BE CD4066BEE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4066BE CD4066BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4066BF CD4066BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4066BF3A CD4066BF3AS2283 OBSOLETE CDIP J 14 TBD Call TI Call TI CD4066BF3AS2534 OBSOLETE CDIP J 14 TBD Call TI Call TI CD4066BM ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BM96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BMG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BMT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066B CD4066BPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B CD4066BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B CD4066BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CM066B CD4066BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples JM38510/05852BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05852BCA M38510/05852BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05852BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2015 Addendum-Page 3 OTHER QUALIFIED VERSIONS OF CD4066B, CD4066B-MIL : • Catalog: CD4066B • Automotive: CD4066B-Q1, CD4066B-Q1 • Military: CD4066B-MIL NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Military - QML certified for Military and Defense Applications TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant CD4066BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BM96 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 CD4066BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4066BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Apr-2014 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4066BM96 SOIC D 14 2500 333.2 345.9 28.6 CD4066BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4066BM96 SOIC D 14 2500 364.0 364.0 27.0 CD4066BM96G4 SOIC D 14 2500 367.0 367.0 38.0 CD4066BM96G4 SOIC D 14 2500 333.2 345.9 28.6 CD4066BMT SOIC D 14 250 367.0 367.0 38.0 CD4066BNSR SO NS 14 2000 367.0 367.0 38.0 CD4066BPWR TSSOP PW 14 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 7-Apr-2014 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 20-W STEREO DIGITAL AUDIO POWER AMPLIFIER WITH EQ AND DRC Check for Samples: TAS5707 TAS5707A 1FEATURES 23• Audio Input/Output Night-Mode Listening – 20-W Into an 8-Ω Load From an 18-V Supply – Autobank Switching: Preload Coefficients – Wide PVDD Range, From 8 V to 26 V for Different Sample Rates. No Need to Write New Coefficients to the Part When – Efficient Class-D Operation Eliminates Sample Rate Changes. Need for Heatsinks – Autodetect: Automatically Detects – Requires Only 3.3 V and PVDD Sample-Rate Changes. No Need for – One Serial Audio Input (Two Audio External Microprocessor Intervention Channels) – Supports 8-kHz to 48-kHz Sample Rate APPLICATIONS (LJ/RJ/I2S) • Television • Audio/PWM Processing • iPod™ Dock – Independent Channel Volume Controls With • Sound Bar 24 dB to Mute – Soft Mute (50% Duty Cycle) DESCRIPTION – Programmable Dynamic Range Control The TAS5707 is a 20-W, efficient, digital-audio power – 14 Programmable Biquads for Speaker EQ amplifier for driving stereo bridge-tied speakers. One and Other Audio Processing Features serial data input allows processing of up to two discrete audio channels and seamless integration to – Programmable Coefficients for DRC Filters most digital audio processors and MPEG decoders. – DC Blocking Filters The device accepts a wide range of input data and • General Features data rates. A fully programmable data path routes these channels to the internal speaker drivers. – Serial Control Interface Operational Without MCLK The TAS5707 is a slave-only device receiving all clocks from external sources. The TAS5707 operates – Factory-Trimmed Internal Oscillator for with a PWM carrier between a 384-kHz switching rate Automatic Rate Detection and 352-KHz switching rate, depending on the input – Surface Mount, 48-PIN, 7-mm × 7-mm sample rate. Oversampling combined with a HTQFP Package fourth-order noise shaper provides a flat noise floor – Thermal and Short-Circuit Protection and excellent dynamic range from 20 Hz to 20 kHz.. • Benefits The TAS5707A is identical in function to the HTQFP packaged TAS5707, but has a unique I 2 – EQ: Speaker Equalization Improves Audio C device Performance address. The address of the TAS5707 is 0x36. The address of the TAS5707A is 0x3A. – DRC: Dynamic Range Compression. Can Be Used As Power Limiter. Enables Speaker Protection, Easy Listening, 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2iPod is a trademark of Apple Inc. 3All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. SDIN LRCLK SCLK MCLK RESET PDN SDA PLL_FLTM PLL_FLTP AVDD/DVDD PVDD OUT_A OUT_C OUT_B OUT_D BST_A BST_C BST_B BST_D 3.3 V 8 V–26 V SCL Digital Audio Source I C Control 2 Control Inputs LC LC Left Right B0264-11 Loop Filter(1) TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SIMPLIFIED APPLICATION DIAGRAM (1)See user's guide for loop-filter details. 2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A SDIN MCLK SCLK LRCLK Serial Audio Port 7 BQ L R V O L U M E DRC Protection Logic Click and Pop Control 7 BQ SDA SCL 4 Order th Noise Shaper and PWM S R C mDAP Sample Rate Autodetect and PLL Serial Control Microcontroller Based System Control Terminal Control OUT_A OUT_B 2 HB ´ FET Out OUT_C OUT_D 2 HB ´ FET Out B0262-02 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 FUNCTIONAL VIEW Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TAS5707 TAS5707A Temp. Sense VALID FAULT AGND OC_ADJ Power On Reset Undervoltage Protection GND PWM_D OUT_D PGND_CD PVDD_D BST_D Gate Drive PWM Rcv Overcurrent Protection 4 Protection and I/O Logic PWM_C OUT_C PGND_CD PVDD_C BST_C Timing Gate Drive Ctrl PWM Rcv GVDD_CD PWM_B OUT_B PGND_AB PVDD_B BST_B Timing Gate Drive Ctrl PWM Rcv PWM_A OUT_A PGND_AB PVDD_A BST_A Timing Gate Drive Ctrl PWM Rcv GVDD_AB Ctrl Pulldown Resistor Pulldown Resistor Pulldown Resistor Pulldown Resistor 4 GVDD_CD Regulator GVDD_AB Regulator Timing I sense B0034-05 PWM Controller FAULT TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Figure 1. Power Stage Functional Block Diagram 4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A Vol1 R L 7 BQ EQ ´ ´ ealpha ealpha ´ ´ 7 BQ EQ Input Muxing Vol2 B0341-01 1 Energy MAXMUX Attack Decay DRC1 DRC ON/OFF 50[D7] 30–36 29–2F 3A 3A 3B–3C 46[D0] To PWM Hex numbers refer to I2C subaddresses [Di] = bit "i" of subaddress SSTIMER OC_ADJ PLL_FLTP VR_ANA NC AVSS PLL_FLTM BST_A GVDD_OUT PVDD_A OUT_A RESET PVDD_A STEST PDN VR_DIG OSC_RES DVSSO DVDD FAULT MCLK SCLK SDIN LRCLK AVDD SDA SCL DVSS GND VREG PVDD_B BST_B PVDD_C OUT_C PVDD_D BST_D PGND_AB OUT_B PGND_CD OUT_D AGND PGND_AB PVDD_B PGND_CD PVDD_D BST_C PVDD_C GVDD_OUT P0075-01 PHP Package (Top View) TAS5707 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 DAP Process Structure 48-TERMINAL, HTQFP PACKAGE (TOP VIEW) Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com PIN FUNCTIONS PIN TYPE 5-V TERMINATION (1) DESCRIPTION TOLERANT (2) NAME NO. AGND 30 P Analog ground for power stage AVDD 13 P 3.3-V analog power supply AVSS 9 P Analog 3.3-V supply ground BST_A 4 P High-side bootstrap supply for half-bridge A BST_B 43 P High-side bootstrap supply for half-bridge B BST_C 42 P High-side bootstrap supply for half-bridge C BST_D 33 P High-side bootstrap supply for half-bridge D DVDD 27 P 3.3-V digital power supply DVSSO 17 P Oscillator ground DVSS 28 P Digital ground FAULT 14 DO Backend error indicator. Asserted LOW for over temperature, over current, over voltage, and under voltage error conditions. De-asserted upon recovery from error condition. GND 29 P Analog ground for power stage GVDD_OUT 5, 32 P Gate drive internal regulator output LRCLK 20 DI 5-V Pulldown Input serial audio data left/right clock (sample rate clock) MCLK 15 DI 5-V Pulldown Master clock input NC 8 – No connection OC_ADJ 7 AO Analog overcurrent programming. Requires resistor to ground. OSC_RES 16 AO Oscillator trim resistor. Connect an 18.2-kΩ 1% resistor to DVSSO. OUT_A 1 O Output, half-bridge A OUT_B 46 O Output, half-bridge B OUT_C 39 O Output, half-bridge C OUT_D 36 O Output, half-bridge D PDN 19 DI 5-V Pullup Power down, active-low. PDN prepares the device for loss of power supplies by shutting down the noise shaper and initiating PWM stop sequence. PGND_AB 47, 48 P Power ground for half-bridges A and B PGND_CD 37, 38 P Power ground for half-bridges C and D PLL_FLTM 10 AO PLL negative loop filter terminal PLL_FLTP 11 AO PLL positive loop filter terminal PVDD_A 2, 3 P Power supply input for half-bridge output A PVDD_B 44, 45 P Power supply input for half-bridge output B PVDD_C 40, 41 P Power supply input for half-bridge output C PVDD_D 34, 35 P Power supply input for half-bridge output D RESET 25 DI 5-V Pullup Reset, active-low. A system reset is generated by applying a logic low to this pin. RESET is an asynchronous control signal that restores the DAP to its default conditions, and places the PWM in the hard mute state (tristated). SCL 24 DI 5-V I 2C serial control clock input SCLK 21 DI 5-V Pulldown Serial audio data clock (shift clock). SCLK is the serial audio port input data bit clock. SDA 23 DIO 5-V I 2C serial control data interface input/output SDIN 22 DI 5-V Pulldown Serial audio data input. SDIN supports three discrete (stereo) data formats. (1) TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output (2) All pullups are weak pullups and all pulldowns are weak pulldowns. The pullups and pulldowns are included to assure proper input logic levels if the pins are left unconnected (pullups → logic 1 input; pulldowns → logic 0 input). 6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 PIN FUNCTIONS (continued) PIN TYPE 5-V TERMINATION (1) DESCRIPTION TOLERANT (2) NAME NO. SSTIMER 6 AI Controls ramp time of OUT_X to minimize pop. Leave this pin floating for BD mode. Requires capacitor of 2.2 nF to GND in AD mode. The capacitor determines the ramp time. STEST 26 DI Factory test pin. Connect directly to DVSS. VR_ANA 12 P Internally regulated 1.8-V analog supply voltage. This pin must not be used to power external devices. VR_DIG 18 P Internally regulated 1.8-V digital supply voltage. This pin must not be used to power external devices. VREG 31 P Digital regulator output. Not to be used for powering external circuitry. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT DVDD, AVDD –0.3 to 3.6 V Supply voltage PVDD_X –0.3 to 30 V OC_ADJ –0.3 to 4.2 V 3.3-V digital input –0.5 to DVDD + 0.5 V Input voltage 5-V tolerant(2) digital input (except MCLK) –0.5 to DVDD + 2.5(3) V 5-V tolerant MCLK input –0.5 to AVDD + 2.5(3) V OUT_x to PGND_X 32(4) V BST_x to PGND_X 43(4) V Input clamp current, IIK ±20 mA Output clamp current, IOK ±20 mA Operating free-air temperature 0 to 85 °C Operating junction temperature range 0 to 150 °C Storage temperature range, Tstg –40 to 125 °C (1) Stresses beyond those listed under absolute ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operation conditions are not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability. (2) 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL. (3) Maximum pin voltage should not exceed 6.0Vele (4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions. DISSIPATION RATINGS(1) DERATING FACTOR TA ≤ 25°C TA = 45°C TA = 70°C PACKAGE ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING 7-mm × 7-mm HTQFP 40 mW/°C 5 W 4.2 W 3.2 W (1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Digital/analog supply voltage DVDD, AVDD 3 3.3 3.6 V Half-bridge supply voltage PVDD_X 8 26 V VIH High-level input voltage 5-V tolerant 2 V VIL Low-level input voltage 5-V tolerant 0.8 V TA Operating ambient temperature range 0 85 °C Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com RECOMMENDED OPERATING CONDITIONS (continued) MIN NOM MAX UNIT TJ (1) Operating junction temperature range 0 125 °C RL (BTL) Load impedance Output filter: L = 15 μH, C = 680 nF. 6 8 Ω Minimum output inductance under 10 LO (BTL) Output-filter inductance μH short-circuit condition (1) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device. PWM OPERATION AT RECOMMENDED OPERATING CONDITIONS PARAMETER TEST CONDITIONS VALUE UNIT 11.025/22.05/44.1-kHz data rate ±2% 352.8 kHz Output sample rate 48/24/12/8/16/32-kHz data rate ±2% 384 8 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 PLL INPUT PARAMETERS AND EXTERNAL FILTER COMPONENTS PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fMCLKI MCLK Frequency 2.8224 24.576 MHz MCLK duty cycle 40% 50% 60% tr / Rise/fall time for MCLK 5 ns tf(MCLK) LRCLK allowable drift before LRCLK reset 4 MCLKs External PLL filter capacitor C1 SMD 0603 Y5V 47 nF External PLL filter capacitor C2 SMD 0603 Y5V 4.7 nF External PLL filter resistor R SMD 0603, metal film 470 Ω ELECTRICAL CHARACTERISTICS DC Characteristics TA = 25°, PVCC_X = 18V, DVDD = AVDD = 3.3V, RL= 8Ω, BTL AD Mode, FS = 48KHz (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage FAULTZ and SDA IOH = –4 mA 2.4 V DVDD = AVDD = 3 V VOL Low-level output voltage FAULTZ and SDA IOL = 4 mA 0.5 V DVDD = AVDD = 3 V VI < VIL ; DVDD = AVDD 75 IIL Low-level input current μA = 3.6V VI > VIH ; DVDD = 75 IIH High-level input current μA AVDD = 3.6V Normal Mode 48 83 3.3 V supply voltage (DVDD, IDD 3.3 V supply current Reset (RESET = low, 24 32 mA AVDD) PDN = high) Normal Mode 30 55 IPVDD Half-bridge supply current No load (PVDD_X) Reset (RESET = low, 5 13 mA PDN = high) Drain-to-source resistance, LS TJ = 25°C, includes metallization resistance 180 rDS(on) (1) Drain-to-source resistance, mΩ TJ = 25°C, includes metallization resistance 180 HS I/O Protection Vuvp Undervoltage protection limit PVDD falling 7.2 V Vuvp,hyst Undervoltage protection limit PVDD rising 7.6 V OTE(2) Overtemperature error 150 °C Extra temperature drop OTEHYST (2) 30 °C required to recover from error OTW Overtemperature warning 125 °C Temperature drop required to OTWHYST 25 °C recover from warning OLPC Overload protection counter fPWM = 384 kHz 0.63 ms IOC Overcurrent limit protection Resistor—programmable, max. current, ROCP = 22 kΩ 4.5 A IOCT Overcurrent response time 150 ns OC programming resistor Resistor tolerance = 5% for typical value; the minimum ROCP 20 22 kΩ range resistance should not be less than 20 kΩ. Internal pulldown resistor at Connected when drivers are tristated to provide bootstrap RPD 3 kΩ the output of each half-bridge capacitor charge. (1) This does not include bond-wire or pin resistance. (2) Specified by design Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com AC Characteristics (BTL) PVDD_X = 18 V, BTL AD mode, FS = 48 KHz, RL = 8 Ω, ROCP = 22 KΩ, CBST = 33 nF, audio frequency = 1 kHz, AES17 filter, fPWM = 384 kHz, TA = 25°C (unless otherwise noted). All performance is in accordance with recommended operating conditions, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PVDD = 18 V,10% THD, 1-kHz input signal 20.6 PVDD = 18 V, 7% THD, 1-kHz input signal 19.5 PVDD = 12 V, 10% THD, 1-kHz input 9.4 P signal O Power output per channel W PVDD = 12 V, 7% THD, 1-kHz input signal 8.9 PVDD = 8 V, 10% THD, 1-kHz input signal 4.1 PVDD = 8 V, 7% THD, 1-kHz input signal 3.8 PVDD= 18 V; PO = 1 W 0.06% THD+N Total harmonic distortion + noise PVDD= 12 V; PO = 1 W 0.13% PVDD= 8 V; PO = 1 W 0.2% Vn Output integrated noise (rms) A-weighted 56 μV PO = 0.25 W, f = 1kHz (BD Mode) –82 dB Crosstalk PO = 0.25 W, f = 1kHz (AD Mode) -69 dB A-weighted, f = 1 kHz, maximum power at SNR Signal-to-noise ratio (1) 106 dB THD < 1% (1) SNR is calculated relative to 0-dBFS input level. 10 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A th1 t su1 t (edge) t su2 th2 SCLK (Input) LRCLK (Input) SDIN T0026-04 t r t f TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 SERIAL AUDIO PORTS SLAVE MODE over recommended operating conditions (unless otherwise noted) TEST PARAMETER MIN TYP MAX UNIT CONDITIONS fSCLKIN Frequency, SCLK 32 × fS, 48 × fS, 64 × fS CL = 30 pF 1.024 12.288 MHz tsu1 Setup time, LRCLK to SCLK rising edge 10 ns th1 Hold time, LRCLK from SCLK rising edge 10 ns tsu2 Setup time, SDIN to SCLK rising edge 10 ns th2 Hold time, SDIN from SCLK rising edge 10 ns LRCLK frequency 8 48 48 kHz SCLK duty cycle 40% 50% 60% LRCLK duty cycle 40% 50% 60% SCLK SCLK rising edges between LRCLK rising edges 32 64 edges t(edge) SCLK LRCLK clock edge with respect to the falling edge of SCLK –1/4 1/4 period tr / ns Rise/fall time for SCLK/LRCLK 8 tf(SCLK/LRCLK) Figure 2. Slave Mode Serial Data Interface Timing Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): TAS5707 TAS5707A SCL SDA tw(H) tw(L) t r t f t su1 th1 T0027-01 SCL SDA th2 t (buf) t su2 t su3 Start Condition Stop Condition T0028-01 TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com I 2C SERIAL CONTROL PORT OPERATION Timing characteristics for I 2C Interface signals over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT fSCL Frequency, SCL No wait states 400 kHz tw(H) Pulse duration, SCL high 0.6 μs tw(L) Pulse duration, SCL low 1.3 μs tr Rise time, SCL and SDA 300 ns tf Fall time, SCL and SDA 300 ns tsu1 Setup time, SDA to SCL 100 ns th1 Hold time, SCL to SDA 0 ns t(buf) Bus free time between stop and start condition 1.3 μs tsu2 Setup time, SCL to start condition 0.6 μs th2 Hold time, start condition to SCL 0.6 μs tsu3 Setup time, SCL to stop condition 0.6 μs CL Load capacitance for each bus line 400 pF Figure 3. SCL and SDA Timing Figure 4. Start and Stop Conditions Timing 12 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A tw(RESET) RESET td(I2C_ready) System Initialization. Enable via I C. 2 T0421-01 I C Active 2 I C Active 2 f − Frequency − Hz 20 PVDD = 18 V RL = 8 Ω 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 20k G001 P = 1 W P = 5 W 0.001 0.01 10 0.1 1 f − Frequency − Hz 20 PVDD = 12 V RL = 8 Ω 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 20k G002 P = 2.5 W 0.001 0.01 10 0.1 1 P = 0.5 W TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 RESET TIMING (RESET) Control signal parameters over recommended operating conditions (unless otherwise noted). Please refer to Recommended Use Model section on usage of all terminals. PARAMETER MIN TYP MAX UNIT tw(RESET) Pulse duration, RESET active 100 us td(I2C_ready) Time to enable I 2C 13.5 ms NOTE: On power up, it is recommended that the TAS5707 RESET be held LOW for at least 100 μs after DVDD has reached 3.0 V NOTE: If the RESET is asserted LOW while PDN is LOW, then the RESET must continue to be held LOW for at least 100 μs after PDN is deasserted (HIGH). Figure 5. Reset Timing TYPICAL CHARACTERISTICS, BTL CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs FREQUENCY FREQUENCY Figure 6. Figure 7. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Link(s): TAS5707 TAS5707A f − Frequency − Hz 20 PVDD = 8 V RL = 8 Ω 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 20k G003 P = 0.5 W P = 1 W 0.001 0.01 10 0.1 1 P = 2.5 W PO − Output Power − W 0.01 PVDD = 18 V RL = 8 Ω 0.1 1 10 THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 10 40 0.1 G004 1 f = 20 Hz f = 1 kHz f = 10 kHz PO − Output Power − W 0.01 PVDD = 12 V RL = 8 Ω 0.1 1 10 THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 10 40 0.1 G005 1 f = 20 Hz f = 1 kHz f = 10 kHz PO − Output Power − W 0.01 PVDD = 8 V RL = 8 Ω 0.1 1 10 THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 10 40 0.1 G006 1 f = 20 Hz f = 1 kHz f = 10 kHz TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs FREQUENCY OUTPUT POWER Figure 8. Figure 9. TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs OUTPUT POWER OUTPUT POWER Figure 10. Figure 11. 14 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A PVDD − Supply Voltage − V 2 4 6 8 10 12 14 16 18 20 8 9 10 11 12 13 14 15 16 17 18 PO − Output Power − W G010 RL = 8 Ω THD+N = 1% THD+N = 10% PO − Output Power (Per Channel) − W 0 10 20 30 40 50 60 70 80 90 100 0 4 8 12 16 20 24 28 32 36 40 Efficiency − % G012 PVDD = 12 V PVDD = 18 V RL = 8 Ω PVDD = 8 V −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 f − Frequency − Hz Crosstalk − dB G013 20 100 1k 10k 20k Left to Right Right to Left PO = 0.25 W PVDD = 18 V RL = 8 Ω −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 f − Frequency − Hz Crosstalk − dB G014 20 100 1k 10k 20k Left to Right Right to Left PO = 0.25 W PVDD = 12 V RL = 8 Ω TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) OUTPUT POWER EFFICIENCY vs vs SUPPLY VOLTAGE OUTPUT POWER Figure 12. Figure 13. CROSSTALK CROSSTALK vs vs FREQUENCY FREQUENCY Figure 14. Figure 15. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Link(s): TAS5707 TAS5707A −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 f − Frequency − Hz Crosstalk − dB G015 20 100 1k 10k 20k Left to Right Right to Left PO = 0.25 W PVDD = 8 V RL = 8 Ω TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) CROSSTALK vs FREQUENCY Figure 16. 16 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 DETAILED DESCRIPTION POWER SUPPLY To facilitate system design, the TAS5707 needs only a 3.3-V supply in addition to the (typical) 18-V power-stage supply. An internal voltage regulator provides suitable voltage levels for the gate drive circuitry. Additionally, all circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is accommodated by built-in bootstrap circuitry requiring only a few external capacitors. In order to provide good electrical and acoustical characteristics, the PWM signal path for the output stage is designed as identical, independent half-bridges. For this reason, each half-bridge has separate bootstrap pins (BST_X), and power-stage supply pins (PVDD_X). The gate drive voltages (GVDD_AB and GVDD_CD) are derived from the PVDD voltage. Special attention should be paid to placing all decoupling capacitors as close to their associated pins as possible. In general, inductance between the power-supply pins and decoupling capacitors must be avoided. For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin (BST_X) to the power-stage output pin (OUT_X). When the power-stage output is low, the bootstrap capacitor is charged through an internal diode connected between the gate-drive regulator output pin (GVDD_X) and the bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM switching frequencies in the range from 352 kHz to 384 kHz, it is recommended to use 33-nF ceramic capacitors, size 0603 or 0805, for the bootstrap supply. These 33-nF capacitors ensure sufficient energy storage, even during minimal PWM duty cycles, to keep the high-side power stage FET (LDMOS) fully turned on during the remaining part of the PWM cycle. Special attention should be paid to the power-stage power supply; this includes component selection, PCB placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD_X). For optimal electrical performance, EMI compliance, and system reliability, it is important that each PVDD_X pin is decoupled with a 100-nF ceramic capacitor placed as close as possible to each supply pin. The TAS5707 is fully protected against erroneous power-stage turnon due to parasitic gate charging. ERROR REPORTING Any fault resulting in device shutdown is signaled by the FAULT pin going low (see Table 1). A sticky version of this pin is available on D1 of register 0X02. Table 1. FAULT Output States FAULT DESCRIPTION 0 Overcurrent (OC) or undervoltage (UVP) error or overtemperature error (OTE) or over voltage ERROR 1 No faults (normal operation) DEVICE PROTECTION SYSTEM Overcurrent (OC) Protection With Current Limiting The device has independent, fast-reacting current detectors on all high-side and low-side power-stage FETs. The detector outputs are closely monitored by two protection systems. The first protection system controls the power stage in order to prevent the output current further increasing, i.e., it performs a cycle-by-cycle current-limiting function, rather than prematurely shutting down during combinations of high-level music transients and extreme speaker load impedance drops. If the high-current condition situation persists, i.e., the power stage is being overloaded, a second protection system triggers a latching shutdown, resulting in the power stage being set in the high-impedance (Hi-Z) state. The device returns to normal operation once the fault condition (i.e., a short circuit on the output) is removed. Current limiting and overcurrent protection are not independent for half-bridges. That is, if the bridge-tied load between half-bridges A and B causes an overcurrent fault, half-bridges A, B, C, and D are shut down. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Overtemperature Protection The TAS5707 has a two-level temperature-protection system that asserts an active-high warning signal (OTW) when the device junction temperature exceeds 125°C (nominal) and, if the device junction temperature exceeds 150°C (nominal), the device is put into thermal shutdown, resulting in all half-bridge outputs being set in the high-impedance (Hi-Z) state and FAULT being asserted low. The TAS5707 recovers from shutdown automatically once the temperature drops approximately 30°C. The overtemperature warning (OTW) is disabled once the temperature drops approximately 25°C. Undervoltage Protection (UVP) and Power-On Reset (POR) The UVP and POR circuits of the TAS5707 fully protect the device in any power-up/down and brownout situation. While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are fully operational when the PVDD and AVDD supply voltages reach 7.6 V and 2.7 V, respectively. Although PVDD and AVDD are independently monitored, a supply voltage drop below the UVP threshold on AVDD or either PVDD pin results in all half-bridge outputs immediately being set in the high-impedance (Hi-Z) state and FAULT being asserted low. SSTIMER FUNCTIONALITY The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when exiting all-channel shutdown. The capacitor on the SSTIMER pin is slowly charged through an internal current source, and the charge time determines the rate at which the output transitions from a near zero duty cycle to the desired duty cycle. This allows for a smooth transition that minimizes audible pops and clicks. When the part is shutdown the drivers are tristated and transition slowly down through a 3K resistor, similarly minimizing pops and clicks. The shutdown transition time is independent of SSTIMER pin capacitance. Larger capacitors will increase the start-up time, while capacitors smaller than 2.2 nF will decrease the start-up time. The SSTIMER pin should be left floating for BD modulation. CLOCK, AUTO DETECTION, AND PLL The TAS5707 is a slave device. It accepts MCLK, SCLK, and LRCLK. The digital audio processor (DAP) supports all the sample rates and MCLK rates that are defined in the clock control register . The TAS5707 checks to verify that SCLK is a specific value of 32 fS, 48 fS, or 64 fS. The DAP only supports a 1 × fS LRCLK. The timing relationship of these clocks to SDIN is shown in subsequent sections. The clock section uses MCLK or the internal oscillator clock (when MCLK is unstable, out of range, or absent) to produce the internal clock (DCLK) running at 512 time the PWM switching frequency. The DAP can autodetect and set the internal clock control logic to the appropriate settings for all supported clock rates as defined in the clock control register. TAS5707 has robust clock error handling that uses the bulit-in trimmed oscillator clock to quickly detect changes/errors. Once the system detects a clock change/error, it will mute the audio (through a single step mute) and then force PLL to limp using the internal oscillator as a reference clock. Once the clocks are stable, the system will auto detect the new rate and revert to normal operation. During this process, the default volume will be restored in a single step (also called hard unmute). The ramp process can be programmed to ramp back slowly (also called soft unmute) as defined in volume register (0X0E). SERIAL DATA INTERFACE Serial data is input on SDIN. The PWM outputs are derived from SDIN. The TAS5707 DAP accepts serial data in 16-, 20-, or 24-bit left-justified, right-justified, and I 2S serial data formats. PWM Section The TAS5707 DAP device uses noise-shaping and sophisticated non-linear correction algorithms to achieve high power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper to increase dynamic range and SNR in the audio band. The PWM section accepts 24-bit PCM data from the DAP and outputs two BTL PWM audio output channels. 18 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 32 Clks LRCLK (Note Reversed Phase) Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 32 Clks Right Channel 2-Channel I S (Philips Format) Stereo Input 2 T0034-01 9 8 5 4 1 0 0 5 4 1 0 23 22 1 19 18 15 14 MSB LSB 9 8 5 4 1 0 0 5 4 1 0 SCLK TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 The PWM section has individual channel dc blocking filters that can be enabled and disabled. The filter cutoff frequency is less than 1 Hz. Individual channel de-emphasis filters for 44.1- and 48-kHz are included and can be enabled and disabled. Finally, the PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%. For detailed description of using audio processing features like DRC and EQ, please refer to User's Guide and TAS570X GDE software development tool documentation. Also refer to GDE software development tool for device data path. I 2C COMPATIBLE SERIAL CONTROL INTERFACE The TAS5707 DAP has an I 2C serial control slave interface to receive commands from a system controller. The serial control interface supports both normal-speed (100-kHz) and high-speed (400-kHz) operations without wait states. As an added feature, this interface operates even if MCLK is absent. The serial control interface supports both single-byte and multi-byte read and write operations for status registers and the general control registers associated with the PWM. SERIAL INTERFACE CONTROL AND TIMING I 2S Timing I 2S timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is low for the left channel and high for the right channel. A bit clock running at 32, 48, or 64 × fS is used to clock in the data. There is a delay of one bit clock from the time the LRCLK signal changes state to the first bit of data on the data lines. The data is written MSB first and is valid on the rising edge of bit clock. The DAP masks unused trailing data bit positions. NOTE: All data presented in 2s-complement form with MSB first. Figure 17. I 2S 64-fS Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 24 Clks LRCLK Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 24 Clks Right Channel 2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size) 2 T0092-01 17 16 9 8 5 4 3 2 1 0 0 13 12 5 4 9 8 1 0 23 22 SCLK 1 19 18 15 14 MSB LSB 17 16 9 8 5 4 3 2 13 12 5 4 1 0 9 8 1 0 SCLK 16 Clks LRCLK Left Channel 16-Bit Mode 15 14 1 15 14 1 MSB LSB 16 Clks Right Channel 2-Channel I S (Philips Format) Stereo Input 2 T0266-01 13 12 11 10 9 8 5 4 3 2 0 13 12 11 10 9 8 5 4 3 2 SCLK MSB LSB TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com NOTE: All data presented in 2s-complement form with MSB first. Figure 18. I 2S 48-fS Format NOTE: All data presented in 2s-complement form with MSB first. Figure 19. I 2S 32-fS Format 20 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 32 Clks LRCLK Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 32 Clks Right Channel 2-Channel Left-Justified Stereo Input T0034-02 9 8 5 4 5 4 1 1 0 0 0 23 22 1 19 18 15 14 MSB LSB 9 8 5 4 5 4 1 1 0 0 0 SCLK TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Left-Justified Left-justified (LJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at the same time LRCLK toggles. The data is written MSB first and is valid on the rising edge of the bit clock. The DAP masks unused trailing data bit positions. NOTE: All data presented in 2s-complement form with MSB first. Figure 20. Left-Justified 64-fS Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 24 Clks LRCLK Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 24 Clks Right Channel 2-Channel Left-Justified Stereo Input (24-Bit Transfer Word Size) T0092-02 17 16 9 8 5 4 13 12 5 4 1 9 8 1 0 0 0 21 17 13 23 22 SCLK 1 19 18 15 14 MSB LSB 17 16 9 8 5 4 13 12 5 4 1 9 8 1 0 0 0 21 17 13 SCLK 16 Clks LRCLK Left Channel 16-Bit Mode 15 14 1 15 14 1 MSB LSB 16 Clks Right Channel 2-Channel Left-Justified Stereo Input T0266-02 13 12 11 10 9 8 5 4 3 2 0 13 12 11 10 9 8 5 4 3 2 0 SCLK MSB LSB TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com NOTE: All data presented in 2s-complement form with MSB first. Figure 21. Left-Justified 48-fS Format NOTE: All data presented in 2s-complement form with MSB first. Figure 22. Left-Justified 32-fS Format 22 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 32 Clks LRCLK Left Channel 24-Bit Mode 1 20-Bit Mode 16-Bit Mode 15 14 MSB LSB SCLK 32 Clks Right Channel 2-Channel Right-Justified (Sony Format) Stereo Input T0034-03 19 18 19 18 1 1 0 0 0 15 14 15 14 23 22 1 15 14 MSB LSB 19 18 19 18 1 1 0 0 0 15 14 15 14 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Right-Justified Right-justified (RJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data 8 bit-clock periods (for 24-bit data) after LRCLK toggles. In RJ mode the LSB of data is always clocked by the last bit clock before LRCLK transitions. The data is written MSB first and is valid on the rising edge of bit clock. The DAP masks unused leading data bit positions. Figure 23. Right Justified 64-fS Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 24 Clks LRCLK Left Channel 24-Bit Mode 1 20-Bit Mode 16-Bit Mode 15 14 MSB LSB SCLK 24 Clks Right Channel MSB 2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size) T0092-03 19 18 5 19 18 5 1 5 1 0 0 0 2 2 2 6 6 6 15 14 15 14 23 22 1 15 14 19 18 5 19 18 5 1 5 1 0 0 0 2 2 2 6 6 6 15 14 15 14 LSB TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Figure 24. Right Justified 48-fS Format Figure 25. Right Justified 32-fS Format 24 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 7-Bit Slave Address R/ W A 8-Bit Register Address (N) 8-Bit Register Data For Address (N) Start Stop SDA SCL 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 A 8-Bit Register Data For Address (N) A A T0035-01 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 I 2C SERIAL CONTROL INTERFACE The TAS5707 DAP has a bidirectional I 2C interface that compatible with the I 2C (Inter IC) bus protocol and supports both 100-kHz and 400-kHz data transfer rates for single and multiple byte write and read operations. This is a slave only device that does not support a multimaster bus environment or wait state insertion. The control interface is used to program the registers of the device and to read device status. The DAP supports the standard-mode I 2C bus operation (100 kHz maximum) and the fast I 2C bus operation (400 kHz maximum). The DAP performs all I 2C operations without I 2C wait cycles. General I 2C Operation The I 2C bus employs two signals; SDA (data) and SCL (clock), to communicate between integrated circuits in a system. Data is transferred on the bus serially one bit at a time. The address and data can be transferred in byte (8-bit) format, with the most significant bit (MSB) transferred first. In addition, each byte transferred on the bus is acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data pin (SDA) while the clock is high to indicate a start and stop conditions. A high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data bit transitions must occur within the low time of the clock period. These conditions are shown in Figure 26. The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another device and then waits for an acknowledge condition. The TAS5707 holds SDA low during the acknowledge clock period to indicate an acknowledgment. When this occurs, the master transmits the next byte of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signals via a bidirectional bus using a wired-AND connection. An external pullup resistor must be used for the SDA and SCL signals to set the high level for the bus. Figure 26. Typical I 2C Sequence There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is shown in Figure 26. The 7-bit address for TAS5707 is 0011 011 (0x36). The 7-bit address for the TAS5707A is 0011 101 (0x3A). The TAS5707 address can be changed from 0x36 to 0x38 by writing 0x38 to device slave address register 0xF9. The TAS5707A address can be changed from 0x3A to 0x3C by writing 0x3C to device slave address register 0xF9. Single- and Multiple-Byte Transfers The serial control interface supports both single-byte and multiple-byte read/write operations for subaddresses 0x00 to 0x1F. However, for the subaddresses 0x20 to 0xFF, the serial control interface supports only multiple-byte read/write operations (in multiples of 4 bytes). During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does not contain 32 bits, the unused bits are read as logic 0. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Link(s): TAS5707 TAS5707A A6 A5 A4 A3 A2 A1 A0 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK Start Condition Stop Condition Acknowledge Acknowledge Acknowledge I C Device Address and 2 Read/Write Bit Subaddress Data Byte T0036-01 D7 D0 ACK Stop Condition Acknowledge I C Device Address and 2 Read/Write Bit Subaddress Last Data Byte A6 A5 A1 A0 R/W ACK A7 A5 A1 A0 ACK D7 ACK Start Condition Acknowledge Acknowledge Acknowledge First Data Byte A6 A4 A3 Other Data Bytes ACK Acknowledge D0 D7 D0 T0036-02 TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes that are required for each specific subaddress. For example, if a write command is received for a biquad subaddress, the DAP expects to receive five 32-bit words. If fewer than five 32-bit data words have been received when a stop command (or another start command) is received, the data received is discarded. Supplying a subaddress for each subaddress transaction is referred to as random I 2C addressing. The TAS5707 also supports sequential I 2C addressing. For write transactions, if a subaddress is issued followed by data for that subaddress and the 15 subaddresses that follow, a sequential I 2C write transaction has taken place, and the data for all 16 subaddresses is successfully received by the TAS5707. For I 2C sequential write transactions, the subaddress then serves as the start address, and the amount of data subsequently transmitted, before a stop or start is transmitted, determines how many subaddresses are written. As was true for random addressing, sequential addressing requires that a complete set of data be transmitted. If only a partial set of data is written to the last subaddress, the data for the last subaddress is discarded. However, all other data written is accepted; only the incomplete data is discarded. Single-Byte Write As shown in Figure 27, a single-byte data write transfer begins with the master device transmitting a start condition followed by the I 2C device address and the read/write bit. The read/write bit determines the direction of the data transfer. For a write data transfer, the read/write bit will be a 0. After receiving the correct I 2C device address and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the address byte or bytes corresponding to the TAS5707 internal memory address being accessed. After receiving the address byte, the TAS5707 again responds with an acknowledge bit. Next, the master device transmits the data byte to be written to the memory address being accessed. After receiving the data byte, the TAS5707 again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data write transfer. Figure 27. Single-Byte Write Transfer Multiple-Byte Write A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes are transmitted by the master device to the DAP as shown in Figure 28. After receiving each data byte, the TAS5707 responds with an acknowledge bit. Figure 28. Multiple-Byte Write Transfer 26 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A A6 A5 A0 R/W ACK A7 A6 A5 A4 A0 ACK A6 A5 A0 ACK Start Condition Stop Condition Acknowledge Acknowledge Acknowledge I C Device Address and 2 Read/Write Bit Subaddress Data Byte D7 D6 D1 D0 ACK I C Device Address and Read/Write Bit 2 Not Acknowledge A1 A1 R/W Repeat Start Condition T0036-03 A6 A0 ACK Acknowledge I C Device Address and Read/Write Bit 2 A6 A0 R/W ACK A0 ACK R/W D7 D0 ACK Start Condition Stop Condition Acknowledge Acknowledge Acknowledge Last Data Byte ACK First Data Byte Repeat Start Condition Not Acknowledge I C Device Address and Read/Write Bit 2 Subaddress Other Data Bytes A7 A6 A5 D7 D0 ACK Acknowledge D7 D0 T0036-04 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Single-Byte Read As shown in Figure 29, a single-byte data read transfer begins with the master device transmitting a start condition followed by the I 2C device address and the read/write bit. For the data read transfer, both a write followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5707 address and the read/write bit, TAS5707 responds with an acknowledge bit. In addition, after sending the internal memory address byte or bytes, the master device transmits another start condition followed by the TAS5707 address and the read/write bit again. This time the read/write bit becomes a 1, indicating a read transfer. After receiving the address and the read/write bit, the TAS5707 again responds with an acknowledge bit. Next, the TAS5707 transmits the data byte from the memory address being read. After receiving the data byte, the master device transmits a not acknowledge followed by a stop condition to complete the single byte data read transfer. Figure 29. Single-Byte Read Transfer Multiple-Byte Read A multiple-byte data read transfer is identical to a single-byte data read transfer except that multiple data bytes are transmitted by the TAS5707 to the master device as shown in Figure 30. Except for the last data byte, the master device responds with an acknowledge bit after receiving each data byte. Figure 30. Multiple Byte Read Transfer Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Link(s): TAS5707 TAS5707A Output Level (dB) Input Level (dB) T O K M0091-02 1:1 Transfer Function Implemented Transfer Function S Z –1 Alpha Filter Structure w a B0265-01 Energy Filter a w, T, K, O a w a , a d d / , a w DRC 0x3A 0x40, 0x41, 0x42 0x3B / 0x3C Compression Control Attack and Decay Filters Audio Input DRC Coefficient NOTE: w a = 1 – TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Dynamic Range Control (DRC) The DRC scheme has a single threshold, offset, and slope (all programmable). There is one ganged DRC for the left/right channels. The DRC input/output diagram is shown in Figure 31. Professional-quality dynamic range compression automatically adjusts volume to flatten volume level. • One DRC for left/right • The DRC has adjustable threshold, offset, and compression levels • Programmable energy, attack, and decay time constants • Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging, and decay times can be set slow enough to avoid pumping. Figure 31. Dynamic Range Control Figure 32. DRC Structure 28 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 2 Bit –23 S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx 2 Bit –5 2 Bit –1 2 Bit 0 Sign Bit 2 Bit 1 M0125-01 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 BANK SWITCHING The TAS5707 uses an approach called bank switching together with automatic sample-rate detection. All processing features that must be changed for different sample rates are stored internally in three banks. The user can program which sample rates map to each bank. By default, bank 1 is used in 32kHz mode, bank 2 is used in 44.1/48 kHz mode, and bank 3 is used for all other rates. Combined with the clock-rate autodetection feature, bank switching allows the TAS5707 to detect automatically a change in the input sample rate and switch to the appropriate bank without any MCU intervention. An external controller configures bankable locations (0x29-0x36 and 0x3A-0x3C) for all three banks during the initialization sequence. If auto bank switching is enabled (register 0x50, bits 2:0) , then the TAS5707 automatically swaps the coefficients for subsequent sample rate changes, avoiding the need for any external controller intervention for a sample rate change. By default, bits 2:0 have the value 000; indicating that bank switching is disabled. In that state, updates to bankable locations take immediate effect. A write to register 0x50 with bits 2:0 being 001, 010, or 011 brings the system into the coefficient-bank-update state update bank1, update bank2, or update bank3, respectively. Any subsequent write to bankable locations updates the coefficient banks stored outside the DAP. After updating all the three banks, the system controller should issue a write to register 0x50 with bits 2:0 being 100; this changes the system state to automatic bank switching mode. In automatic bank switching mode, the TAS5707 automatically swaps banks based on the sample rate. Command sequences for updating DAP coefficients can be summarized as follows: 1. Bank switching disabled (default): DAP coefficient writes take immediate effect and are not influenced by subsequent sample rate changes. OR Bank switching enabled: (a) Update bank-1 mode: Write "001" to bits 2:0 of reg 0x50. Load the 32 kHz coefficients. (b) Update bank-2 mode: Write "010" to bits 2:0 of reg 0x50. Load the 48 kHz coefficients. (c) Update bank-3 mode: Write "011" to bits 2:0 of reg 0x50. Load the other coefficients. (d) Enable automatic bank switching by writing "100" to bits 2:0 of reg 0x50. 26-Bit 3.23 Number Format All mixer gain coefficients are 26-bit coefficients using a 3.23 number format. Numbers formatted as 3.23 numbers means that there are 3 bits to the left of the decimal point and 23 bits to the right of the decimal point. This is shown in Figure 33 . Figure 33. 3.23 Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Link(s): TAS5707 TAS5707A (1 or 0) 2 + ´ 1 (1 or 0) 2 + (1 or 0) 2 + ....... (1 or 0) 2 + ....... (1 or 0) 2 ´ ´ ´ ´ 0 –1 –4 –23 2 Bit 1 2 Bit 0 2 Bit –1 2 Bit –4 2 Bit –23 M0126-01 u Coefficient Digit 8 u u u u u S x Coefficient Digit 7 x. x x x Coefficient Digit 6 x x x x Coefficient Digit 5 x x x x Coefficient Digit 4 x x x x Coefficient Digit 3 x x x x Coefficient Digit 2 x x x x Coefficient Digit 1 Fraction Digit 5 Fraction Digit 4 Fraction Digit 3 Fraction Digit 2 Fraction Integer Digit 1 Digit 1 Sign Bit Fraction Digit 6 u = unused or don’t care bits Digit = hexadecimal digit M0127-01 0 TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 33. If the most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct number. If the most significant bit is a logic 1, then the number is a negative number. In this case every bit must be inverted, a 1 added to the result, and then the weighting shown in Figure 34 applied to obtain the magnitude of the negative number. Figure 34. Conversion Weighting Factors—3.23 Format to Floating Point Gain coefficients, entered via the I 2C bus, must be entered as 32-bit binary numbers. The format of the 32-bit number (4-byte or 8-digit hexadecimal number) is shown in Figure 35 Figure 35. Alignment of 3.23 Coefficient in 32-Bit I 2C Word Table 2. Sample Calculation for 3.23 Format db Linear Decimal Hex (3.23 Format) 0 1 8388608 00800000 5 1.7782794 14917288 00E39EA8 –5 0.5623413 4717260 0047FACC X L = 10(X/20) D = 8388608 × L H = dec2hex (D, 8) Table 3. Sample Calculation for 9.17 Format db Linear Decimal Hex (9.17 Format) 0 1 131072 20000 5 1.77 231997 38A3D –5 0.56 73400 11EB8 X L = 10(X/20) D = 131072 × L H = dec2hex (D, 8) 30 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A Initialization 50 ms 50 ms 2 sm 2 sm 2 sm 2 sm AVDD/DVDD PDN PVDD RESET T0419-01 3 V 3 V 0 ns 0 ns 0 ns 10 sm 100 sμ 13.5 ms 100 sm 6 V 6 V 8 V 8 V 2I S MCLK LRCLK SCLK SDIN 2I C SCL SDA Trim Volume and Mute Commands Clock Changes/Errors OK Stable and Valid Clocks Stable and Valid Clocks Exit SD Enter SD DAP Config Other Config 1 ms + 1.3 tstart(2) 1 ms + 1.3 tstart(2) tPLL(1) tPLL(1) 1 ms + 1.3 tstop(2) 0 ns Normal Operation Shutdown Powerdown (1) t has to be greater than 240 ms + 1.3 t . This constraint only applies to the first trim command following AVDD/DVDD power-up. It does not apply to trim commands following subsequent resets. (2) t /t = PWM start/stop time as defined in register 0X1A PLL start start stop TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Recommended Use Model Figure 36. Recommended Command Sequence Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 31 Product Folder Link(s): TAS5707 TAS5707A 2 sm 2 sm 2 sm AVDD/DVDD PDN PVDD RESET T0420-01 3 V 8 V 6 V I S2 I C2 2 ms 0 ns 0 ns 0 ns 0 ns TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Figure 37. Power Loss Sequence Recommended Command Sequences The DAP has two groups of commands. One set is for configuration and is intended for use only during initialization. The other set has built-in click and pop protection and may be used during normal operation while audio is streaming. The following supported command sequences illustrate how to initialize, operate, and shutdown the device. Initialization Sequence Use the following sequence to power-up and initialize the device: 1. Hold all digital inputs low and ramp up AVDD/DVDD to at least 3V. 2. Initialize digital inputs and PVDD supply as follows: • Drive RESETZ=0, PDNZ=1, and other digital inputs to their desired state while ensuring that all are never more than 2.5V above AVDD/DVDD. Provide stable and valid I2S clocks (MCLK, LRCLK, and SCLK). Wait at least 100us, drive RESETZ=1, and wait at least another 13.5ms. • Ramp up PVDD to at least 8V while ensuring that it remains below 6V for at least 100us after AVDD/DVDD reaches 3V. Then wait at least another 10us. 3. Trim oscillator (write 0x00 to register 0x1B) and wait at least 50ms. 4. Configure the DAP via I 2C (see Users's Guide for typical values): Biquads (0x29-36) DRC parameters (0x3A-3C, 0x40-42, and 0x46) Bank select (0x50) 5. Configure remaining registers 6. Exit shutdown (sequence defined below). 32 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Normal Operation The following are the only events supported during normal operation: (a) Writes to master/channel volume registers (b) Writes to soft mute register (c) Enter and exit shutdown (sequence defined below) (d) Clock errors and rate changes Note: Events (c) and (d) are not supported for 240ms+1.3*Tstart after trim following AVDD/DVDD powerup ramp (where Tstart is specified by register 0x1A). Shutdown Sequence Enter: 1. Ensure I2S clocks have been stable and valid for at least 50ms. 2. Write 0x40 to register 0x05. 3. Wait at least 1ms+1.3*Tstop (where Tstop is specified by register 0x1A). 4. Once in shutdown, stable clocks are not required while device remains idle. 5. If desired, reconfigure by ensuring that clocks have been stable and valid for at least 50ms before returning to step 4 of initialization sequence. Exit: 1. Ensure I2S clocks have been stable and valid for at least 50ms. 2. Write 0x00 to register 0x05 (exit shutdown command may not be serviced for as much as 240ms after trim following AVDD/DVDD powerup ramp). 3. Wait at least 1ms+1.3*Tstart (where Tstart is specified by register 0x1A). 4. Proceed with normal operation. Powerdown Sequence Use the following sequence to powerdown the device and its supplies: 1. If time permits, enter shutdown (sequence defined above); else, in case of sudden power loss, assert PDNZ=0 and wait at least 2ms. 2. Assert RESETZ=0. 3. Drive digital inputs low and ramp down PVDD supply as follows: • Drive all digital inputs low after RESETZ has been low for at least 2us. • Ramp down PVDD while ensuring that it remains above 8V until RESETZ has been low for at least 2us. 4. Ramp down AVDD/DVDD while ensuring that it remains above 3V until PVDD is below 6V and that it is never more than 2.5V below the digital inputs. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 33 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Table 4. Serial Control Interface Register Summary NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE A u indicates unused bits. 0x00 Clock control register 1 Description shown in subsequent section 0x6C 0x01 Device ID register 1 Description shown in subsequent section 0x70 0x02 Error status register 1 Description shown in subsequent section 0x00 0x03 System control register 1 1 Description shown in subsequent section 0xA0 0x04 Serial data interface 1 Description shown in subsequent section 0x05 register 0x05 System control register 2 1 Description shown in subsequent section 0x40 0x06 Soft mute register 1 Description shown in subsequent section 0x00 0x07 Master volume 1 Description shown in subsequent section 0xFF (mute) 0x08 Channel 1 vol 1 Description shown in subsequent section 0x30 (0 dB) 0x09 Channel 2 vol 1 Description shown in subsequent section 0x30 (0 dB) 0x0A Fine master volume 1 Description shown in subsequent section 0x00 (0 dB) 0x0B–0X0D 1 Reserved(1) 0x0E Volume configuration 1 Description shown in subsequent section 0x91 register 0x0F 1 Reserved(1) 0x10 Modulation limit register 1 Description shown in subsequent section 0x02 0x11 IC delay channel 1 1 Description shown in subsequent section 0xAC 0x12 IC delay channel 2 1 Description shown in subsequent section 0x54 0x13 IC delay channel 3 1 Description shown in subsequent section 0xAC 0x14 IC delay channel 4 1 Description shown in subsequent section 0x54 0x15–0x19 1 Reserved(1) 0x1A Start/stop period register 1 Description shown in subsequent section 0x0F 0x1B Oscillator trim register 1 Description shown in subsequent section 0x82 0x1C BKND_ERR register 1 Description shown in subsequent section 0x02 0x1D–0x1F 1 Reserved(1) 0x20 Input MUX register 4 Description shown in subsequent section 0x0001 7772 0x21-0X24 4 Reserved(1) 0x25 PWM MUX register 4 Description shown in subsequent section 0x0102 1345 0x26–0x28 4 Reserved(1) 0x29 ch1_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2A ch1_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2B ch1_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 (1) Reserved registers should not be accessed. 34 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Table 4. Serial Control Interface Register Summary (continued) NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE 0x2C ch1_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2D ch1_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2E ch1_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2F ch1_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x30 ch2_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x31 ch2_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x32 ch2_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x33 ch2_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x34 ch2_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 35 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Table 4. Serial Control Interface Register Summary (continued) NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE 0x35 ch2_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x36 ch2_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x37–0x39 Reserved(2) DRC ae(3) u[31:26], ae[25:0] 0x0080 0000 0x3A 8 DRC (1 – ae) u[31:26], (1 – ae)[25:0] 0x0000 0000 DRC aa u[31:26], aa[25:0] 0x0080 0000 0x3B 8 DRC (1 – aa) u[31:26], (1 – aa)[25:0] 0x0000 0000 DRC ad u[31:26], ad[25:0] 0x0080 0000 0x3C 8 DRC (1 – ad) u[31:26], (1 – ad)[25:0] 0x0000 0000 0x3D–0x3F Reserved(2) 0x40 DRC-T 4 T[31:0] (9.23 format) 0xFDA2 1490 0x41 DRC-K 4 u[31:26], K[25:0] 0x0384 2109 0x42 DRC-O 4 u[31:26], O[25:0] 0x0008 4210 0x43–0x45 Reserved(2) 0x46 DRC control 4 Description shown in subsequent section 0x0000 0000 0x47–0x4F Reserved(2) 0x50 Bank switch control 4 Description shown in subsequent section 0x0F70 8000 0x51–0xC9 Reserved(2) 0xCA 8 Reserved(2) 0xCB–0xF8 Reserved(2) Update device address 4 New Dev Id[7:1], ZERO[0] (New Dev Id = 0x38), 0x00000036 0xF9 register (7:1) defines the new device address 0xFA-0xFF Reserved(2) (2) Reserved registers should not be accessed. (3) "ae" stands for µ of energy filter, "aa" stands for µ of attack filter and "ad" stands for µ of decay filter and 1- µ = ω. All DAP coefficients are 3.23 format unless specified otherwise. 36 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 CLOCK CONTROL REGISTER (0x00) The clocks and data rates are automatically determined by the TAS5707. The clock control register contains the auto-detected clock status. Bits D7–D5 reflect the sample rate. Bits D4–D2 reflect the MCLK frequency. The device accepts a 64-fS or 32-fS SCLK rate for all MCLK rates, but accepts a 48-fS SCLK rate for MCLK rates of 192 fS and 384 fS only. Table 5. Clock Control Register (0x00) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 – – – – – fS = 32-kHz sample rate 0 0 1 – – – – – Reserved(1) 0 1 0 – – – – – Reserved(1) 0 1 1 – – – – – fS = 44.1/48-kHz sample rate (2) 1 0 0 – – – – – fs = 16-kHz sample rate 1 0 1 – – – – – fs = 22.05/24 -kHz sample rate 1 1 0 – – – – – fs = 8-kHz sample rate 1 1 1 – – – – – fs = 11.025/12 -kHz sample rate – – – 0 0 0 – – MCLK frequency = 64 × fS (3) – – – 0 0 1 – – MCLK frequency = 128 × fS (3) – – – 0 1 0 – – MCLK frequency = 192 × fS (4) – – – 0 1 1 – – MCLK frequency = 256 × fS (2) (5) – – – 1 0 0 – – MCLK frequency = 384 × fS – – – 1 0 1 – – MCLK frequency = 512 × fS – – – 1 1 0 – – Reserved(1) – – – 1 1 1 – – Reserved(1) – – – – – – 0 – Reserved(1) – – – – – – – 0 Reserved(1) (1) Reserved registers should not be accessed. (2) Default values are in bold. (3) Only available for 44.1 kHz and 48 kHz rates. (4) Rate only available for 32/44.1/48 KHz sample rates (5) Not available at 8 kHz DEVICE ID REGISTER (0x01) The device ID register contains the ID code for the firmware revision. Table 6. General Status Register (0x01) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION X – – – – – – – Reserved – 1 1 1 0 0 0 0 Identification code Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 37 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com ERROR STATUS REGISTER (0x02) The error bits are sticky and are not cleared by the hardware. This means that the software must clear the register (write zeroes) and then read them to determine if they are persistent errors. Error Definitions: • MCLK Error : MCLK frequency is changing. The number of MCLKs per LRCLK is changing. • SCLK Error: The number of SCLKs per LRCLK is changing. • LRCLK Error: LRCLK frequency is changing. • Frame Slip: LRCLK phase is drifting with respect to internal frame sync. Table 7. Error Status Register (0x02) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 1 - – – – – – – MCLK error – 1 – – – – – – PLL autolock error – – 1 – – – – – SCLK error – – – 1 – – – – LRCLK error – – – – 1 – – – Frame slip – – – – – – 1 – Overcurrent, overtemperature, overvoltage or undervoltage error – – – – – – – 1 Overtemperature warning (sets around 125°) 0 0 0 0 0 0 0 0 No errors (1) (1) Default values are in bold. SYSTEM CONTROL REGISTER 1 (0x03) The system control register 1 has several functions: Bit D7: If 0, the dc-blocking filter for each channel is disabled. If 1, the dc-blocking filter (–3 dB cutoff <1 Hz) for each channel is enabled (default). Bit D5: If 0, use soft unmute on recovery from clock error. This is a slow recovery. Unmute takes same time as volume ramp defined in reg 0X0E. If 1, use hard unmute on recovery from clock error (default). This is a fast recovery, a single step volume ramp Bits D1–D0: Select de-emphasis Table 8. System Control Register 1 (0x03) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 – – – – – – – PWM high-pass (dc blocking) disabled 1 – – – – – – – PWM high-pass (dc blocking) enabled (1) – 0 – – – – – – Reserved (1) – – 0 – – – – – Soft unmute on recovery from clock error – – 1 – – – – – Hard unmute on recovery from clock error (1) – – – 0 – – – – Reserved (1) – – – – 0 – – – Reserved (1) – – – – – 0 – – Reserved(1) – – – – – – 0 0 No de-emphasis (1) – – – – – – 0 1 De-emphasis for fS = 32 kHz – – – – – – 1 0 Reserved – – – – – – 1 1 De-emphasis for fS = 48 kHz (1) Default values are in bold. 38 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 SERIAL DATA INTERFACE REGISTER (0x04) As shown in Table 9, the TAS5707 supports 9 serial data modes. The default is 24-bit, I 2S mode, Table 9. Serial Data Interface Control Register (0x04) Format RECEIVE SERIAL DATA WORD D7–D4 D3 D2 D1 D0 INTERFACE FORMAT LENGTH Right-justified 16 0000 0 0 0 0 Right-justified 20 0000 0 0 0 1 Right-justified 24 0000 0 0 1 0 I 2S 16 000 0 0 1 1 I 2S 20 0000 0 1 0 0 I 2S (1) 24 0000 0 1 0 1 Left-justified 16 0000 0 1 1 0 Left-justified 20 0000 0 1 1 1 Left-justified 24 0000 1 0 0 0 Reserved 0000 1 0 0 1 Reserved 0000 1 0 1 0 Reserved 0000 1 0 1 1 Reserved 0000 1 1 0 0 Reserved 0000 1 1 0 1 Reserved 0000 1 1 1 0 Reserved 0000 1 1 1 1 (1) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 39 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com SYSTEM CONTROL REGISTER 2 (0x05) When bit D6 is set low, the system exits all channel shutdown and starts playing audio; otherwise, the outputs are shut down(hard mute). Table 10. System Control Register 2 (0x05) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 – – – – – – – Reserved (1) – 1 – – – – – – Enter all channel shut down (hard mute).(1) – 0 – – – – – – Exit all-channel shutdown (normal operation) – – 0 0 0 0 0 0 Reserved (1) (1) Default values are in bold. SOFT MUTE REGISTER (0x06) Writing a 1 to any of the following bits sets the output of the respective channel to 50% duty cycle (soft mute). Table 11. Soft Mute Register (0x06) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION – – – – – – – 1 Soft mute channel 1 – – – – – – – 0 Soft unmute channel 1 – – – – – – 1 – Soft mute channel 2 – – – – – – 0 – Soft unmute channel 2 0 0 0 0 0 0 – – Reserved 40 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 VOLUME REGISTERS (0x07, 0x08, 0x09) Step size is 0.5 dB. Master volume – 0x07 (default is mute) Channel-1 volume – 0x08 (default is 0 dB) Channel-2 volume – 0x09 (default is 0 dB) Table 12. Volume Registers (0x07, 0x08, 0x09) D D D D D D D D FUNCTION 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 24 dB 0 0 1 1 0 0 0 0 0 dB (default for individual channel volume) (1) 1 1 0 0 1 1 0 1 –78.5 dB 1 1 0 0 1 1 1 0 –79.0 dB 1 1 0 0 1 1 1 1 Values between 0xCF and 0xFE are Reserved 1 1 1 1 1 1 1 1 MUTE (default for master volume) (1) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 41 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com MASTER FINE VOLUME REGISTER (0x0A) This register can be used to provide precision tuning of master volume. Table 13. Master Fine Volume Register (0x0A) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION – – – – – – 0 0 0 dB (1) – – – – – – 0 1 0.125 dB – – – – – – 1 0 0.25 dB – – – – – – 1 1 0.375 dB 1 – – – – – – – Write enable bit 0 – – – – – – – Ignore Write to register 0X0A (1) Default values are in bold. VOLUME CONFIGURATION REGISTER (0x0E) Bits Volume slew rate (Used to control volume change and MUTE ramp rates). These bits control the D2–D0: number of steps in a volume ramp.Volume steps occur at a rate that depends on the sample rate of the I2S data as follows Sample Rate (KHz) Approximate Ramp Rate 8/16/32 125 us/step 11.025/22.05/44.1 90.7 us/step 12/24/48 83.3 us/step Table 14. Volume Control Register (0x0E) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 1 0 0 1 0 – – – Reserved (1) – – – – – 0 0 0 Volume slew 512 steps (43 ms volume ramp time at 48kHz) – – – – – 0 0 1 Volume slew 1024 steps (85 ms volume ramp time at 48kHz) (1) – – – – – 0 1 0 Volume slew 2048 steps (171 ms volume ramp time at 48kHz) – – – – – 0 1 1 Volume slew 256 steps (21ms volume ramp time at 48kHz) – – – – – 1 X X Reserved (1) Default values are in bold. 42 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 MODULATION LIMIT REGISTER (0x10) The modulation limit is the maximum duty cycle of the PWM output waveform. Table 15. Modulation Limit Register (0x10) D7 D6 D5 D4 D3 D2 D1 D0 MODULATION LIMIT – – – – – 0 0 0 99.2% – – – – – 0 0 1 98.4% – – – – – 0 1 0 97.7% – – – – – 0 1 1 96.9% – – – – – 1 0 0 96.1% – – – – – 1 0 1 95.3% – – – – – 1 1 0 94.5% – – – – – 1 1 1 93.8% 0 0 0 0 0 – – – RESERVED INTERCHANNEL DELAY REGISTERS (0x11, 0x12, 0x13, and 0x14) Internal PWM channels 1, 2, 1, and 2 are mapped into registers 0x11, 0x12, 0x13, and 0x14. Table 16. Channel Interchannel Delay Register Format BITS DEFINITION D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 0 0 0 – – Minimum absolute delay, 0 DCLK cycles 0 1 1 1 1 1 – – Maximum positive delay, 31 × 4 DCLK cycles 1 0 0 0 0 0 – – Maximum negative delay, –32 × 4 DCLK cycles 0 0 RESERVED SUBADDRESS D7 D6 D5 D4 D3 D2 D1 D0 Delay = (value) × 4 DCLKs 0x11 1 0 1 0 1 1 – – Default value for channel 1 (1) 0x12 0 1 0 1 0 1 – – Default value for channel 2 (1) 0x13 1 0 1 0 1 1 – – Default value for channel 1 (1) 0x14 0 1 0 1 0 1 – – Default value for channel 2 (1) (1) Default values are in bold. ICD settings have high impact on audio performance (e.g., dynamic range, THD, crosstalk etc.) Therefore, appropriate ICD settings must be used. By default, the device has ICD settings for AD mode. If used in BD mode, then update these registers before coming out of all-channel shutdown. REGISTER AD MODE BD MODE 0x11 0xAC 0xB8 0x12 0x54 0x60 0x13 0xAC 0xA0 0x14 0x54 0x48 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 43 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com START/STOP PERIOD REGISTER (0x1A) This register is used to control the soft-start and soft-stop period following an enter/exit all channel shut down command or change in the PDN state. This helps reduce pops and clicks at start-up and shutdown.The times are only approximate and vary depending on device activity level and I2S clock stability. Table 17. Start/Stop Period Register (0x1A) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 – – – – – Reserved – – – 0 0 – – – No 50% duty cycle start/stop period – – – 0 1 0 0 0 16.5-ms 50% duty cycle start/stop period – – – 0 1 0 0 1 23.9-ms 50% duty cycle start/stop period – – – 0 1 0 1 0 31.4-ms 50% duty cycle start/stop period – – – 0 1 0 1 1 40.4-ms 50% duty cycle start/stop period – – – 0 1 1 0 0 53.9-ms 50% duty cycle start/stop period – – – 0 1 1 0 1 70.3-ms 50% duty cycle start/stop period – – – 0 1 1 1 0 94.2-ms 50% duty cycle start/stop period – – – 0 1 1 1 1 125.7-ms 50% duty cycle start/stop period(1) – – – 1 0 0 0 0 164.6-ms 50% duty cycle start/stop period – – – 1 0 0 0 1 239.4-ms 50% duty cycle start/stop period – – – 1 0 0 1 0 314.2-ms 50% duty cycle start/stop period – – – 1 0 0 1 1 403.9-ms 50% duty cycle start/stop period – – – 1 0 1 0 0 538.6-ms 50% duty cycle start/stop period – – – 1 0 1 0 1 703.1-ms 50% duty cycle start/stop period – – – 1 0 1 1 0 942.5-ms 50% duty cycle start/stop period – – – 1 0 1 1 1 1256.6-ms 50% duty cycle start/stop period – – – 1 1 0 0 0 1728.1-ms 50% duty cycle start/stop period – – – 1 1 0 0 1 2513.6-ms 50% duty cycle start/stop period – – – 1 1 0 1 0 3299.1-ms 50% duty cycle start/stop period – – – 1 1 0 1 1 4241.7-ms 50% duty cycle start/stop period – – – 1 1 1 0 0 5655.6-ms 50% duty cycle start/stop period – – – 1 1 1 0 1 7383.7-ms 50% duty cycle start/stop period – – – 1 1 1 1 0 9897.3-ms 50% duty cycle start/stop period – – – 1 1 1 1 1 13,196.4-ms 50% duty cycle start/stop period (1) Default values are in bold. 44 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 OSCILLATOR TRIM REGISTER (0x1B) The TAS5707 PWM processor contains an internal oscillator to support autodetect of I2S clock rates. This reduces system cost because an external reference is not required. Currently, TI recommends a reference resistor value of 18.2 kΩ (1%). This should be connected between OSC_RES and DVSSO. Writing 0X00 to reg 0X1B enables the trim that was programmed at the factory. Note that trim must always be run following reset of the device. Table 18. Oscillator Trim Register (0x1B) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 1 – – – – – – – Reserved (1) – 0 – – – – – – Oscillator trim not done (read-only) (1) – 1 – – – – – – Oscillator trim done (read only) – – 0 0 0 0 – – Reserved (1) – – – – – – 0 – Select factory trim (Write a 0 to select factory trim; default is 1.) – – – – – – 1 – Factory trim disabled (1) – – – – – – – 0 Reserved (1) (1) Default values are in bold. BKND_ERR REGISTER (0x1C) When a back-end error signal is received from the internal power stage, the power stage is reset stopping all PWM activity. Subsequently, the modulator waits approximately for the time listed in Table 19 before attempting to re-start the power stage. Table 19. BKND_ERR Register (0x1C)(1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 0 0 0 0 X Reserved – – – – 0 0 1 0 Set back-end reset period to 299 ms (2) – – – – 0 0 1 1 Set back-end reset period to 449 ms – – – – 0 1 0 0 Set back-end reset period to 598 ms – – – – 0 1 0 1 Set back-end reset period to 748 ms – – – – 0 1 1 0 Set back-end reset period to 898 ms – – – – 0 1 1 1 Set back-end reset period to 1047 ms – – – – 1 0 0 0 Set back-end reset period to 1197 ms – – – – 1 0 0 1 Set back-end reset period to 1346 ms – – – – 1 0 1 X Set back-end reset period to 1496 ms – – – – 1 1 X X Set back-end reset period to 1496 ms (1) This register can be written only with a "non-Reserved" value. Also this register can be written once after the reset. (2) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 45 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com INPUT MULTIPLEXER REGISTER (0x20) This register controls the modulation scheme (AD or BD mode) as well as the routing of I2S audio to the internal channels. Table 20. Input Multiplexer Register (0x20) D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 – – – – – – – Channel-1 AD mode 1 – – – – – – – Channel-1 BD mode – 0 0 0 – – – – SDIN-L to channel 1 (1) – 0 0 1 – – – – SDIN-R to channel 1 – 0 1 0 – – – – Reserved – 0 1 1 – – – – Reserved – 1 0 0 – – – – Reserved – 1 0 1 – – – – Reserved – 1 1 0 – – – – Ground (0) to channel 1 – 1 1 1 – – – – Reserved – – – – 0 – – – Channel 2 AD mode – – – – 1 – – – Channel 2 BD mode – – – – – 0 0 0 SDIN-L to channel 2 – – – – – 0 0 1 SDIN-R to channel 2 (1) – – – – – 0 1 0 Reserved – – – – – 0 1 1 Reserved – – – – – 1 0 0 Reserved – – – – – 1 0 1 Reserved – – – – – 1 1 0 Ground (0) to channel 2 – – – – – 1 1 1 Reserved D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 1 1 1 0 1 1 1 Reserved (1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 1 1 1 0 0 1 0 Reserved (1) (1) Default values are in bold. PWM OUTPUT MUX REGISTER (0x25) This DAP output mux selects which internal PWM channel is output to the external pins. Any channel can be output to any external output pin. Bits D21–D20: Selects which PWM channel is output to OUT_A Bits D17–D16: Selects which PWM channel is output to OUT_B Bits D13–D12: Selects which PWM channel is output to OUT_C Bits D09–D08: Selects which PWM channel is output to OUT_D Note that channels are enclosed so that channel 1 = 0x00, channel 2 = 0x01, channet 1 = 0x02, and channel 2 = 0x03. 46 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Table 21. PWM Output Mux Register (0x25) D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 0 0 0 0 0 0 1 Reserved(1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 0 – – – – – – Reserved(1) – – 0 0 – – – – Multiplex channel 1 to OUT_A (1) – – 0 1 – – – – Multiplex channel 2 to OUT_A – – 1 0 – – – – Multiplex channel 1 to OUT_A – – 1 1 – – – – Multiplex channel 2 to OUT_A – – – – 0 0 – – Reserved (1) – – – – – – 0 0 Multiplex channel 1 to OUT_B – – – – – – 0 1 Multiplex channel 2 to OUT_B – – – – – – 1 0 Multiplex channel 1 to OUT_B (1) – – – – – – 1 1 Multiplex channel 2 to OUT_B D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 0 – – – – – – Reserved (1) – – 0 0 – – – – Multiplex channel 1 to OUT_C – – 0 1 – – – – Multiplex channel 2 to OUT_C(1) – – 1 0 – – – – Multiplex channel 1 to OUT_C – – 1 1 – – – – Multiplex channel 2 to OUT_C – – – – 0 0 – – Reserved (1) – – – – – – 0 0 Multiplex channel 1 to OUT_D – – – – – – 0 1 Multiplex channel 2 to OUT_D – – – – – – 1 0 Multiplex channel 1 to OUT_D – – – – – – 1 1 Multiplex channel 2 to OUT_D (1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 1 0 0 0 1 0 1 RESERVED (1) Default values are in bold. DRC CONTROL (0x46) Each DRC can be enabled independently using the DRC control register. The DRCs are disabled by default. Table 22. DRC Control Register (0x46) D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION – – – – – – – 0 DRC turned OFF (1) – – – – – – – 1 DRC turned ON 0 0 0 0 0 0 0 – Reserved (1) (1) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 47 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com BANK SWITCH AND EQ CONTROL (0x50) Table 23. Bank Switching Command D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 – – – – – – – 32 kHz, does not use bank 3 (1) 1 – – – – – – – 32 kHz, uses bank 3 – 0 – – – – – – Reserved(1) – – 0 – – – – – Reserved(1) – – – 0 – – – – 44.1/48 kHz, does not use bank 3 (1) – – – 1 – – – – 44.1/48 kHz, uses bank 3 – – – – 0 – – – 16 kHz, does not use bank 3 – – – – 1 – – – 16 kHz, uses bank 3 (1) – – – – – 0 – – 22.025/24 kHz, does not use bank 3 – – – – – 1 – – 22.025/24 kHz, uses bank 3 (1) – – – – – – 0 – 8 kHz, does not use bank 3 – – – – – – 1 – 8 kHz, uses bank 3 (1) – – – – – – – 0 11.025 kHz/12, does not use bank 3 – – – – – – – 1 11.025/12 kHz, uses bank 3 (1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 – – – – – – – 32 kHz, does not use bank 2 (1) 1 – – – – – – – 32 kHz, uses bank 2 – 1 – – – – – – Reserved (1) – – 1 – – – – – Reserved (1) – – – 0 – – – – 44.1/48 kHz, does not use bank 2 – – – 1 – – – – 44.1/48 kHz, uses bank 2 (1) – – – – 0 – – – 16 kHz, does not use bank 2 (1) – – – – 1 – – – 16 kHz, uses bank 2 – – – – – 0 – – 22.025/24 kHz, does not use bank 2 (1) – – – – – 1 – – 22.025/24 kHz, uses bank 2 – – – – – – 0 – 8 kHz, does not use bank 2 (1) – – – – – – 1 – 8 kHz, uses bank 2 – – – – – – – 0 11.025/12 kHz, does not use bank 2 (1) – – – – – – – 1 11.025/12 kHz, uses bank 2 D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 – – – – – – – 32 kHz, does not use bank 1 1 – – – – – – – 32 kHz, uses bank 1 (1) – 0 – – – – – – Reserved(1) – – 0 – – – – – Reserved(1) – – – 0 – – – – 44.1/48 kHz, does not use bank 1 (1) – – – 1 – – – – 44.1/48 kHz, uses bank 1 – – – – 0 – – – 16 kHz, does not use bank 1 (1) – – – – 1 – – – 16 kHz, uses bank 1 – – – – – 0 – – 22.025/24 kHz, does not use bank 1 (1) – – – – – 1 – – 22.025/24 kHz, uses bank 1 – – – – – – 0 – 8 kHz, does not use bank 1 (1) – – – – – – 1 – 8 kHz, uses bank 1 – – – – – – – 0 11.025/12 kHz, does not use bank 1 (1) – – – – – – – 1 11.025/12 kHz, uses bank 1 (1) Default values are in bold. 48 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Table 23. Bank Switching Command (continued) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 EQ ON 1 – – – – – – – EQ OFF (bypass BQ 0-6 of channels 1 and 2) – 0 – – – – – – Reserved (2) – – 0 – – – – – Ignore bank-mapping in bits D31–D8.Use default mapping. (2) 1 Use bank-mapping in bits D31–D8. – – – 0 – – – – L and R can be written independently. (2) L and R are ganged for EQ biquads; a write to Left channel BQ is – – – 1 – – – – also written to Right channel BQ. (0X29-2F is ganged to 0X30-0X36). – – – – 0 – – – Reserved (2) – – – – – 0 0 0 No bank switching. All updates to DAP (2) – – – – – 0 0 1 Configure bank 1 (32 kHz by default) – – – – – 0 1 0 Configure bank 2 (44.1/48 kHz by default) – – – – – 0 1 1 Configure bank 3 (other sample rates by default) – – – – – 1 0 0 Automatic bank selection – – – – – 1 0 1 Reserved – – – – – 1 1 X Reserved (2) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 49 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Changes from Revision A (November 2008) to Revision B Page • Added TAS5707A device to data sheet ................................................................................................................................ 1 • Changed PVDD maximum voltage to 26 V in Features ....................................................................................................... 1 • Added Applications section ................................................................................................................................................... 1 • Inserted paragraph on TAS5707A into Description section .................................................................................................. 1 • Changed PVDD maximum voltage to 26 V in simplified application diagram ...................................................................... 2 • Changed PVDD maximum voltage to 26 V in recommended operating conditions ............................................................. 7 • Added AVDD to output voltage test conditions ..................................................................................................................... 9 • Added rows to Electrical Characteristics fro OTW and OTW ............................................................................................... 9 • Changed OLPC typical value to 0.63 ms. ............................................................................................................................. 9 • Replaced text of Overtemperature Protection section ........................................................................................................ 18 • Added address information for the TAS5707A ................................................................................................................... 25 • Revised Sample Calculation for 3.23 Format table ............................................................................................................ 30 • Added 0xCA row to Register Summary table ..................................................................................................................... 36 • Revised 0xF9 row of Register Summary table ................................................................................................................... 36 • Corrected temperature from 145°C to 125°C ..................................................................................................................... 38 • Changed de-emphasis settings in register 0x03 table ........................................................................................................ 38 • Added text to Modulationi Limit Register section ................................................................................................................ 43 • Added text to the DRC Control section ............................................................................................................................... 47 50 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A PACKAGE OPTION ADDENDUM www.ti.com 9-Sep-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TAS5707APHP ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707A TAS5707APHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707A TAS5707PHP ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707 TAS5707PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TAS5707APHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 TAS5707APHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 TAS5707PHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2014 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TAS5707APHPR HTQFP PHP 48 1000 367.0 367.0 38.0 TAS5707APHPR HTQFP PHP 48 1000 336.6 336.6 31.8 TAS5707PHPR HTQFP PHP 48 1000 336.6 336.6 31.8 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2014 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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B2 1 www.fairchildsemi.com FDS6679AZ P-Channel PowerTrench® MOSFET -30V, -13A, 9mΩ General Description This P-Channel MOSFET is producted using Fairchild Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance. This device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs. Features „ Max rDS(on) = 9.3mΩ at VGS = -10V, ID = -13A „ Max rDS(on) = 14.8mΩ at VGS = -4.5V, ID = -11A „ Extended VGS range (-25V) for battery applications „ HBM ESD protection level of 6kV typical (note 3) „ High performance trench technology for extremely low rDS(on) „ High power and current handing capability „ RoHS Compliant S D S S SO-8 D D D G 1 7 5 2 8 4 6 3 MOSFET Maximum Ratings TA = 25°C unless otherwise noted Thermal Characteristics Package Marking and Ordering Information Symbol Parameter Ratings Units VDS Drain to Source Voltage -30 V VGS Gate to Source Voltage ±25 V ID Drain Current -Continuous (Note 1a) -13 A -Pulsed -65 PD Power Dissipation for Single Operation (Note 1a) 2.5 (Note 1b) 1.2 W (Note 1c) 1.0 TJ, TSTG Operating and Storage Temperature -55 to +150 °C RθJA Thermal Resistance , Junction to Ambient (Note 1a) 50 °C/W RθJC Thermal Resistance , Junction to Case (Note 1) 25 °C/W Device Marking Device Reel Size Tape Width Quantity FDS6679AZ FDS6679AZ 13’’ 12mm 2500 units FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com FDS6679AZ Rev. B2 Electrical Characteristics T J = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source Breakdown Voltage I D = -250 µA, VGS = 0V -30 V ∆ BVDSS ∆ T J Breakdown Voltage Temperature Coefficient I D = -250 µA, referenced to 25 ° C -20 mV/°C IDSS Zero Gate Voltage Drain Current VDS = -24V, VGS=0V -1 µ A IGSS Gate to Source Leakage Current VGS = ±25V, VDS=0V ±10 µ A On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, I D = -250 µ A -1 -1.9 -3 V ∆ VGS(th) ∆ T J Gate to Source Threshold Voltage Temperature Coefficient I D = -250 µA, referenced to 25°C 6.5 mV/°C rDS(on) Drain to Source On Resistance VGS = -10V, I D = -13A 7.7 9.3 m Ω VGS = -4.5V, I D = -11A 11.8 14.8 VGS = -10V, I D = -13A, T J = 125 ° C 10.7 13.4 gFS Forward Transconductance VDS = -5V, I D = -13A 55 S (Note 2) Dynamic Characteristics Ciss Input Capacitance VDS = -15V, VGS = 0V, f = 1MHz 2890 3845 pF Coss Output Capacitance 500 665 pF Crss Reverse Transfer Capacitance 495 745 pF Switching Characteristics (Note 2) td(on) Turn-On Delay Time VDD = -15V, I D = -1A VGS = -10V, RGS = 6 Ω 13 24 ns t r Rise Time 15 27 ns td(off) Turn-Off Delay Time 210 336 ns tf Fall Time 92 148 ns Qg Total Gate Charge VDS = -15V, VGS = -10V, ID = -13A 68 96 nC Qg Total Gate Charge VDS = -15V, VGS = -5V, ID = -13A 38 54 nC Qgs Gate to Source Gate Charge 10 nC Qgd Gate to Drain Charge 17 nC Drain-Source Diode Characteristic VSD Source to Drain Diode Forward Voltage VGS = 0V, I S = -2.1A -0.7 -1.2 V trr Reverse Recovery Time I F = -13A, di/dt = 100A/ µ s 40 ns Qrr Reverse Recovery Charge I F = -13A, di/dt = 100A/ µ s -31 nC Notes: 1: R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while R θCA is determined by the user’s board design. Scale 1 : 1 on letter size paper 2: Pulse Test:Pulse Width <300 µs, Duty Cycle <2.0% 3: The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied. a) 50 °C/W when mounted on a 1 in 2 pad of 2 oz copper b)105 °C/W when mounted on a .04 in 2 pad of 2 oz copper minimun pad c) 125 °C/W when mounted on a FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com FDS6679AZ Rev. B2 Typical Characteristics T J = 25°C unless otherwise noted Figure 1. On Region Characteristics 01234 0 10 20 30 40 50 60 70 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX VGS = -5V VGS = -4V VGS = -3V VGS = -3.5V VGS = -4.5V VGS = -10V -ID, DRAIN CURRENT (A) -VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 2. Normalized 0 10 20 30 40 50 60 70 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX NORMALIZED DRAIN TO SOURCE ON-RESISTANCE -I D, DRAIN CURRENT(A) VGS = -10V VGS = -5V VGS = -4.5V VGS = -4V VGS = -3.5V On-Resistance vs Drain Current and Gate Voltage Figure 3. -80 -40 0 40 80 120 160 0.6 0.8 1.0 1.2 1.4 1.6 I D = -13A VGS = -10V NORMALIZED DRAIN TO SOURCE ON-RESISTANCE T J, JUNCTION TEMPERATURE ( o C ) Normalized On Resistance vs Junction Temperature Figure 4. 3.0 4.5 6.0 7.5 9.0 0 10 20 30 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX TJ = 150oC TJ = 25oC ID = -13A rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ) -VGS, GATE TO SOURCE VOLTAGE (V) 10 On-Resistance vs Gate to Source Voltage Figure 5. Transfer Characteristics 2.0 2.5 3.0 3.5 4.0 4.5 0 10 20 30 40 50 60 70 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX T J = -55 o C T J = 25 o C TJ = 150 o C -ID, DRAIN CURRENT (A) -VGS, GATE TO SOURCE VOLTAGE (V) Figure 6. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1E-3 0.01 0.11 10 100 T J = -55 o C T J = 25 o C TJ = 150 o C VGS = 0V -IS, REVERSE DRAIN CURRENT (A) -VSD, BODY DIODE FORWARD VOLTAGE (V) Source to Drain Diode Forward Voltage vs Source Current FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com FDS6679AZ Rev. B2 Figure 7. 0 15 30 45 60 75 02468 10 VDD = -20V VDD = -10V -VGS, GATE TO SOURCE VOLTAGE(V) Q g, GATE CHARGE(nC) VDD = -15V Gate Charge Characteristics Figure 8. 0.1 1 10 100 1000 10000 f = 1MHz VGS = 0V CAPACITANCE (pF) -VDS, DRAIN TO SOURCE VOLTAGE (V) Crss Coss Ciss 30 Capacitance vs Drain to Source Voltage Figure 9. I g vs VGS 0 5 10 15 20 25 30 35 1E-4 1E-3 0.01 0.11 10 100 1000 TJ = 150 o CT J = 25 o C -Ig(uA) -VGS(V) Figure 10. 10-2 10-1 10 0 10 1 10 2 1 10 TJ = 25 o C TJ = 125 o C -IAS, AVALANCHE CURRENT(A) 20 t AV, TIME IN AVALANCHE(ms) Unclamped Inductive Switching Capability Figure 11. 25 50 75 100 125 150 02468 10 12 14 16 VGS = -10V VGS = -4.5V -ID, DRAIN CURRENT (A) TA, AMBIENT TEMPERATURE ( o C ) Maximum Continuous Drain Current vs Ambient Temperature Figure 12. Forward Bias Safe Operating Area 0.01 0.1 1 10 100 0.01 0.11 10 100 100 us 1 s 10 s DC 100 ms 10 ms 1 ms ID, DRAIN CURRENT (A) VDS, DRAIN to SOURCE VOLTAGE (V) THIS AREA IS LIMITED BY rDS(on) SINGLE PULSE TJ = MAX RATED RθJA = 125 o C/W TA = 25 o C 200 Typical Characteristics T J = 25°C unless otherwise noted FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com FDS6679AZ Rev. B2 Figure 13. 10-4 10-3 10-2 10-1 1 10 10 2 10 3 0.51 10 10 2 10 3 10 4 SINGLE PULSE RθJA = 125 o C/W TA = 25 o C VGS = -10 V P(PK), PEAK TRANSIENT POWER (W) t, PULSE WIDTH (sec) Single Pulse Maximum Power Dissipation Figure 14. 10-4 10-3 10-2 10-1 1 10 10 2 10 3 10-4 10-3 10-2 10-11 SINGLE PULSE RθJA = 125 o C/W DUTY CYCLE-DESCENDING ORDER NORMALIZED THERMAL IMPEDANCE, ZθJA t, RECTANGULAR PULSE DURATION (sec) D = 0.5 0.2 0.1 0.05 0.02 0.01 2 PDM t 1 t 2 NOTES: DUTY FACTOR: D = t 1/t 2 PEAK T J = PDM x Z θJA x R θJA + TA Junction-to-Ambient Transient Thermal Response Curve Typical Characteristics T J = 25°C unless otherwise noted 6 www.fairchildsemi.com FDS6679AZ P-Channel PowerTrench ® MOSFET ©2009 Fairchild Semiconductor Corporation FDS6679AZ Rev. B2 Rev. I39 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 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PRODUCT STATUS DEFINITIONS Definition of Terms Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EfficentMax™ EZSWITCH™ * ™ Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter® * FPS™ F-PFS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® PDP SPM™ Power-SPM™ PowerTrench® PowerXS™ Programmable Active Droop™ QFET® QS™ Quiet Series™ RapidConfigure™ ™ Saving our world, 1mW /W /kW at a time™ SmartMax™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ ® The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™* µSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™ tm ® tm tm Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC32 - Plastic Film Capacitors Metallized Polyester Film Capacitor Type:ECQE(F) Non-inductive construction using metallized Polyester film with flame retardant epoxy resin coating ■Features •Self-healing property •Excellent electrical characteristics •Flame retardant epoxy resin coating •RoHS directive compliant ■Recommended Applications •General purpose usage ❈Please contact us when applications are CD , ignitor etc. ■Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E C Q E Product code Dielectric & construction Rated volt. Capacitance F Cap. Tol. Suffix Suffix 1 2 4 6 100 VDC 250 VDC 400 VDC 630 VDC 10 12 1A 2A 1000 VDC 1250 VDC 125 VAC 250 VAC J K ±5 % ±10 % E C Q E Product code Dielectric & construction Rated volt. Capacitance R F Suffix Cap. Tol. Suffix ■Specifications ●Explanation of Part Number for Odd Size Taping Category temp. range (Including temperature-rise on unit surface) Rated voltage Capacitance range Capacitance tolerance Dissipation factor (tan ) Withstand voltage Insulation resistance (IR) 100 VDC, 250 VDC,400 VDC, 630 VDC, 1000 VDC, 1250 VDC, 125 VAC, 250 VAC –40 ˚C to +105 ˚C –40 ˚C to +105 ˚C 100 VDC, 250 VDC, 400 VDC, 630 VDC, 1000 VDC, 1250 VDC, (Derating of rated voltage by 1.25 %/˚C at more than 85 ˚C) 125 VAC, 250 VAC 0.0010 µF to 10 µF (E12) ±5 %(J), ±10 %(K) tan <=1.0 % (20 ˚C, 1 kHz) •Rated volt. 100 V to 630 VDC Between terminals : Rated volt.(VDC)✕150 % 60 s •Rated volt. 1000 VDC, 1250 VDC Between terminals : Rated volt. (VDC)✕175 % 2 s to 5 s or 1000 VAC 60 s Between terminals to enclosure : 1500 VAC 60 s •Rated volt. 125 VAC, 250 VAC Between terminals : Rated volt.(VAC)✕230 % 60 s Between terminals to enclosure : 1500 VAC 60 s 100 V to 630 VDC: C <= 0.33 µF : IR>=9000 MΩ (20 ˚C, 100 VDC, 60 s) C > 0.33 µF : IR>=3000 MΩ . µF 1000 VDC, 1250 VDC: IR>=10000 MΩ (20 ˚C, 100 VDC, 60 s) IR>=2000 MΩ (20 ˚C, 500 VDC, 60 s) 125 VAC, 250 VAC: C <= 0.47 µF : IR>=2000 MΩ (20 ˚C, 500 VDC, 60 s) C > 0.47 µF : IR>=3000 MΩ . µF (20 ˚C, 100 VDC, 60 s) ❈ In case of applying voltage in alternating current (50 Hz or 60 Hz sine wave) to a capacitor with DC rated voltage, please refer to the page of “Permissible voltage (R.M.S) in alternating current corresponding to DC rated voltage”. ❈ Voltage to be applied to ECQE1A (F) & ECQE2A (F) is only sine wave (50 Hz or 60 Hz). Suffix Blank B Z 3 6 Lead Form Straight Crimped lead Cut lead Crimped taping (Ammo) Crimped taping (Ammo) p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 32 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC33 - Plastic Film Capacitors ■Dimensions in mm (not to scale) Cut lead ■Packaging Specifications for Bulk Package Packing quantity:100 pcs./bag ■Taping Specifications for Automatic Insertion ●Taping style ❈Refer to the page of taping specifications. 100 VDC 250 VDC 400 VDC 630 VDC 1000 VDC 1250 VDC 125 VAC 250 VAC ECQE (F) AD AS AB BCD E 0.56 to 0.68 ○ Ammo ( ) F3 0.82 to 1.0 ○ Ammo ( ) F3 1.2 to 3.3 ○ Ammo ( ) F3 1.2 to 3.3 ○ Ammo R( ) F 0.010 to 0.27 ○ Ammo ( ) F3 0.33 ○ Ammo ( ) F3 0.39 to 1.5 ○ Ammo ( ) F3 0.010 to 0.33 ○ Ammo R( ) F 0.39 to 1.5 ○ Ammo R( ) F 0.010 to 0.10 ○ Ammo ( ) F3 0.12 to 0.47 ○ Ammo ( ) F3 0.010 to 0.10 ○ Ammo R( ) F 0.12 to 0.47 ○ Ammo R( ) F 0.0010 to 0.033 ○ Ammo ( ) F3 0.039 to 0.047 ○ Ammo ( ) F3 0.056 to 0.22 ○ Ammo ( ) F3 0.0010 to 0.047 ○ Ammo R( ) F 0.056 to 0.22 ○ Ammo R( ) F 0.010 to 0.10 ○ Ammo R( ) F 0.0010 to 0.022 ○ Ammo R( ) F 0.010 to 0.068 ○ Ammo ( ) F6 0.010 to 0.068 ○ Ammo R( ) F 0.010 to 0.033 ○ Ammo ( ) F6 0.010 to 0.047 ○ Ammo R( ) F 0.056 to 0.22 ○ Ammo R( ) F ●Packaging Specifications Cap. range (µF) Taping style Type Rated volt. Packing suffix Style AD AB B C D E Lead Spacing 5.0 mm 5.0 mm 5.0 mm 5.0 mm 7.5 mm 7.5 mm ❈See the column “Rating, Dimensions & Quantity Box” for packing quantity. ●Lead Spacing Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 33 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC34 - Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 250 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K) Style D: 0.010 µF to 0.33 µF Style B: 0.39 µF to 10.0 µF Suffix for lead crimped or taped type Cap. tol. code ▲ ▲ Suffix for lead crimped or taped type Cap. tol. code ▲ ▲ ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 100 VDC, Capacitance tolerance : ± 5 %(J), ±10 %(K) 0.56 12.0 5.5 10.9 15.9 10.0 10.0 1.0 0.60 0.68 12.0 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.82 12.0 6.0 13.5 18.5 10.0 10.0 1.0 0.60 1.0 12.0 6.7 14.0 19.0 10.0 10.0 1.0 0.60 1.2 18.5 5.5 12.8 17.8 15.0 10.0 1.0 0.60 1.5 18.5 6.0 13.4 18.4 15.0 10.0 1.0 0.80 1.8 18.5 6.5 14.4 19.4 15.0 10.0 1.0 0.80 2.2 18.5 7.0 15.0 20.0 15.0 10.0 1.0 0.80 2.7 18.5 8.0 15.8 20.8 15.0 10.0 1.0 0.80 3.3 18.5 8.5 16.5 21.5 15.0 10.0 1.0 0.80 3.9 26.0 7.0 16.4 21.4 22.5 15.0 1.0 0.80 4.7 26.0 7.5 17.0 22.0 22.5 15.0 1.0 0.80 5.6 26.0 8.3 17.5 22.5 22.5 15.0 1.0 0.80 6.8 26.0 9.0 18.5 23.5 22.5 15.0 1.0 0.80 8.2 26.0 10.0 20.0 25.0 22.5 15.0 1.5 0.80 10.0 26.0 11.5 21.0 26.0 22.5 15.0 1.5 0.80 Part No. Cap. (µF) Min. order Q'ty Taping 500 - - - - Dimensions (mm) L max. T max. Standard 5 mm Odd size 5 mm Odd size 7.5 mm ø d ECQE1564□F( ) ECQE1684□F( ) ECQE1824□F( ) ECQE1105□F( ) ECQE1125□F( ) ECQE1155□F( ) ECQE1185□F( ) ECQE1225□F( ) ECQE1275□F( ) ECQE1335□F( ) ECQE1395□F( ) ECQE1475□F( ) ECQE1565□F( ) ECQE1685□F( ) ECQE1825□F( ) ECQE1106□F( ) 500 1,000 400 400 500 600 - H max. Straight Crimped lead Straight F Crimped lead S Straight G max. Bulk 500 style D: 0.056 µF to 1.0 µF style B: 1.2 µF to 10.0 µF Part No. Cap. (µF) Dimensions (mm) L max. T max. ø d ECQE2103□F( ) 0.010 10.3 4.3 7.4 12.4 7.5 7.5 1.0 0.60 ECQE2123□F( ) 0.012 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2153□F( ) 0.015 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2183□F( ) 0.018 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2223□F( ) 0.022 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2273□F( ) 0.027 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2333□F( ) 0.033 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2393□F( ) 0.039 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2473□F( ) 0.047 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2563□F( ) 0.056 10.3 4.8 7.9 12.9 7.5 7.5 1.0 0.60 ECQE2683□F( ) 0.068 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2823□F( ) 0.082 10.3 4.9 8.0 13.0 7.5 7.5 1.0 0.60 ECQE2104□F( ) 0.10 10.3 5.8 8.4 13.4 7.5 7.5 1.0 0.60 ECQE2124□F( ) 0.12 10.3 6.0 9.0 14.0 7.5 7.5 1.0 0.60 ECQE2154□F( ) 0.15 10.3 6.0 10.8 15.8 7.5 7.5 1.0 0.60 ECQE2184□F( ) 0.18 12.0 5.0 10.3 15.3 10.0 10.0 1.0 0.60 ECQE2224□F( ) 0.22 12.0 5.5 10.5 15.5 10.0 10.0 1.0 0.60 ECQE2274□F( ) 0.27 12.0 6.0 11.5 16.5 10.0 10.0 1.0 0.60 ECQE2334□F( ) 0.33 12.0 6.5 12.0 17.0 10.0 10.0 1.0 0.60 ECQE2394□F( ) 0.39 18.5 4.9 12.0 17.0 15.0 10.0 1.0 0.60 ECQE2474□F( ) 0.47 18.5 5.3 12.5 17.5 15.0 10.0 1.0 0.60 ECQE2564□F( ) 0.56 18.5 5.5 13.0 18.0 15.0 10.0 1.0 0.60 ECQE2684□F( ) 0.68 18.5 6.0 13.5 18.5 15.0 10.0 1.0 0.80 ECQE2824□F( ) 0.82 18.5 6.5 14.5 19.5 15.0 10.0 1.0 0.80 ECQE2105□F( ) 1.0 18.5 7.4 15.0 20.0 15.0 10.0 1.0 0.80 ECQE2125□F( ) 1.2 18.5 8.0 15.9 20.9 15.0 10.0 1.0 0.80 ECQE2155□F( ) 1.5 18.5 9.0 16.8 21.8 15.0 10.0 1.0 0.80 ECQE2185□F( ) 1.8 26.0 7.5 15.5 20.5 22.5 15.0 1.0 0.80 ECQE2225□F( ) 2.2 26.0 8.5 16.3 21.3 22.5 15.0 1.0 0.80 ECQE2275□F( ) 2.7 26.0 9.4 17.0 22.0 22.5 15.0 1.0 0.80 ECQE2335□F( ) 3.3 26.0 10.3 18.0 23.0 22.5 15.0 1.5 0.80 ECQE2395□F( ) 3.9 26.0 11.0 20.5 25.5 22.5 15.0 1.5 0.80 ECQE2475□F( ) 4.7 26.0 12.0 21.5 26.5 22.5 15.0 1.5 0.80 ECQE2565□F( ) 5.6 31.0 11.8 21.0 26.0 27.5 22.5 1.5 0.80 ECQE2685□F( ) 6.8 31.0 13.0 22.4 27.4 27.5 22.5 1.5 0.80 ECQE2825□F( ) 8.2 31.0 14.3 23.5 28.5 27.5 22.5 1.5 0.80 ECQE2106□F( )10.0 31.0 15.9 25.8 30.8 27.5 22.5 1.5 0.80 1000 - - 1000 500 500 1000 400 500 400 300 - - H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 34 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC35 - Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 400 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K) style D:0.010 µF to 0.10 µF style B:0.12 µF to 2.2 µF Suffix for lead crimped or taped type Cap. tol. code ▲ ▲ Part No. 0.010 10.3 4.3 7.4 12.4 7.5 7.5 1.0 0.60 0.012 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.015 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.018 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.022 10.3 4.8 7.9 12.9 7.5 7.5 1.0 0.60 0.027 10.3 5.5 8.0 13.0 7.5 7.5 1.0 0.60 0.033 10.3 6.0 9.0 14.0 7.5 7.5 1.0 0.60 0.039 12.0 4.9 8.0 13.0 10.0 10.0 1.0 0.60 0.047 12.0 5.0 8.3 13.3 10.0 10.0 1.0 0.60 0.056 12.0 5.0 10.0 15.0 10.0 10.0 1.0 0.60 0.068 12.0 5.4 10.5 15.5 10.0 10.0 1.0 0.60 0.082 12.0 5.8 11.0 16.0 10.0 10.0 1.0 0.60 0.10 12.0 6.3 12.0 17.0 10.0 10.0 1.0 0.60 0.12 18.5 5.0 10.0 15.0 15.0 10.0 1.0 0.60 0.15 18.5 5.0 12.4 17.4 15.0 10.0 1.0 0.60 0.18 18.5 5.4 12.5 17.5 15.0 10.0 1.0 0.60 0.22 18.5 5.9 13.0 18.0 15.0 10.0 1.0 0.60 0.27 18.5 6.5 14.3 19.3 15.0 10.0 1.0 0.80 0.33 18.5 7.0 14.9 19.9 15.0 10.0 1.0 0.80 0.39 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80 0.47 18.5 7.8 17.0 22.0 15.0 10.0 1.0 0.80 0.56 26.0 6.5 16.0 21.0 22.5 15.0 1.0 0.80 0.68 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80 0.82 26.0 7.9 17.3 22.3 22.5 15.0 1.0 0.80 1.0 26.0 8.5 18.0 23.0 22.5 15.0 1.0 0.80 1.2 26.0 9.5 18.9 23.9 22.5 15.0 1.0 0.80 1.5 31.0 9.5 19.0 24.0 27.5 22.5 1.0 0.80 1.8 31.0 11.0 20.5 25.5 27.5 22.5 1.5 0.80 2.2 31.0 11.0 22.0 27.0 27.5 22.5 1.5 0.80 ECQE4103□F( ) ECQE4123□F( ) ECQE4153□F( ) ECQE4183□F( ) ECQE4223□F( ) ECQE4273□F( ) ECQE4333□F( ) ECQE4393□F( ) ECQE4473□F( ) ECQE4563□F( ) ECQE4683□F( ) ECQE4823□F( ) ECQE4104□F( ) ECQE4124□F( ) ECQE4154□F( ) ECQE4184□F( ) ECQE4224□F( ) ECQE4274□F( ) ECQE4334□F( ) ECQE4394□F( ) ECQE4474□F( ) ECQE4564□F( ) ECQE4684□F( ) ECQE4824□F( ) ECQE4105□F( ) ECQE4125□F( ) ECQE4155□F( ) ECQE4185□F( ) ECQE4225□F( ) Cap. (µF) 1000 500 - - 500 500 400 - - 1000 Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 35 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC36 - Plastic Film Capacitors ●Rated voltage : 630 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K) Suffix for lead crimped or taped type. Cap. tol. code ▲ ▲ style D:0.010 µF to 0.047 µF style B:0.0010 µF to 0.0082 µF, 0.056 µF to 2.2 µF Part No. 0.0010 10.0 4.5 9.5 14.5 7.5 5.0 1.0 0.60 0.0012 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0015 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0018 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0022 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0027 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0033 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0039 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0047 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60 0.0056 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60 0.0068 12.0 4.9 10.0 15.0 10.0 7.5 1.0 0.60 0.0082 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60 0.010 12.0 4.5 7.5 12.5 10.0 10.0 1.0 0.60 0.012 12.0 4.5 7.8 12.8 10.0 10.0 1.0 0.60 0.015 12.0 5.0 8.2 13.2 10.0 10.0 1.0 0.60 0.018 12.0 4.9 10.0 15.0 10.0 10.0 1.0 0.60 0.022 12.0 5.3 10.5 15.5 10.0 10.0 1.0 0.60 0.027 12.0 5.5 10.9 15.9 10.0 10.0 1.0 0.60 0.033 12.0 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.039 12.0 6.0 13.4 18.4 10.0 10.0 1.0 0.60 0.047 12.0 6.5 13.5 18.5 10.0 10.0 1.0 0.60 0.056 18.5 5.4 10.5 15.5 15.0 10.0 1.0 0.60 0.068 18.5 5.8 11.0 16.0 15.0 10.0 1.0 0.60 0.082 18.5 6.5 12.0 17.0 15.0 10.0 1.0 0.60 0.10 18.5 6.3 14.0 19.0 15.0 10.0 1.0 0.60 0.12 18.5 6.3 14.5 19.5 15.0 10.0 1.0 0.80 0.15 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80 0.18 18.5 8.0 16.0 21.0 15.0 10.0 1.0 0.80 0.22 18.5 9.0 16.5 21.5 15.0 10.0 1.0 0.80 0.27 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80 0.33 26.0 7.8 17.0 22.0 22.5 15.0 1.0 0.80 0.39 26.0 8.5 17.9 22.9 22.5 15.0 1.0 0.80 0.47 26.0 9.3 18.5 23.5 22.5 15.0 1.0 0.80 0.56 26.0 10.0 20.0 25.0 22.5 15.0 1.5 0.80 0.68 26.0 11.5 21.0 26.0 22.5 15.0 1.5 0.80 0.82 31.0 11.3 20.5 25.5 27.5 22.5 1.5 0.80 1.0 31.0 12.5 21.9 26.9 27.5 22.5 1.5 0.80 1.2 31.0 13.5 23.0 28.0 27.5 22.5 1.5 0.80 1.5 31.0 15.3 24.7 29.7 27.5 22.5 1.5 0.80 1.8 31.0 16.8 27.0 32.0 27.5 22.5 1.5 0.80 2.2 31.0 19.5 29.0 34.0 27.5 22.5 1.5 0.80 ECQE6102□F( ) ECQE6122□F( ) ECQE6152□F( ) ECQE6182□F( ) ECQE6222□F( ) ECQE6272□F( ) ECQE6332□F( ) ECQE6392□F( ) ECQE6472□F( ) ECQE6562□F( ) ECQE6682□F( ) ECQE6822□F( ) ECQE6103□F( ) ECQE6123□F( ) ECQE6153□F( ) ECQE6183□F( ) ECQE6223□F( ) ECQE6273□F( ) ECQE6333□F( ) ECQE6393□F( ) ECQE6473□F( ) ECQE6563□F( ) ECQE6683□F( ) ECQE6823□F( ) ECQE6104□F( ) ECQE6124□F( ) ECQE6154□F( ) ECQE6184□F( ) ECQE6224□F( ) ECQE6274□F( ) ECQE6334□F( ) ECQE6394□F( ) ECQE6474□F( ) ECQE6564□F( ) ECQE6684□F( ) ECQE6824□F( ) ECQE6105□F( ) ECQE6125□F( ) ECQE6155□F( ) ECQE6185□F( ) ECQE6225□F( ) Cap. (µF) 1000 - 1000 500 400 300 1000 500 400 - - 500 - Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 36 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC37 - Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 1000 VDC, Note) 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) Note) This type has two rated voltage, one is DC rated voltage another is AC rated voltage.. DC rated voltage is 1000 V, AC rated voltage is 125 V. Making for rated voltage is「1000 V, 125 V 」 When capacitors use in secondary side of power source, and in case of applying voltage in altering current (50 Hz or 60 Hz sine wave) to a capacitor, please refer to the page of ''Permissible voltage (R.M.S) in altering current corresponding to DC rated voltage''. When capacitors use in primary side of power source, the rated voltage is shown 125 VAC. Voltage to be applied to capacitors in only sine wave (50 Hz or 60 Hz). AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. And not complying with clause 2 of ''Electrical Appliance and Material Safety Law'', in this case please use ECQUL type or ECQUG type Part No. 0.010 15.5 6.0 11.0 16.0 12.5 12.5 1.0 0.60 0.012 15.5 6.0 12.0 17.0 12.5 12.5 1.0 0.60 0.015 15.5 7.0 12.5 17.5 12.5 12.5 1.0 0.60 0.018 15.5 7.5 13.0 20.0 12.5 12.5 1.0 0.80 0.022 15.5 7.5 15.5 22.5 12.5 12.5 1.0 0.80 0.027 21.0 6.0 13.0 18.0 17.5 12.5 1.0 0.80 0.033 21.0 6.5 14.0 19.0 17.5 12.5 1.0 0.80 0.039 21.0 7.0 14.5 19.5 17.5 12.5 1.0 0.80 0.047 21.0 7.5 15.5 20.5 17.5 12.5 1.0 0.80 0.056 21.0 7.5 17.0 22.0 17.5 12.5 1.0 0.80 0.068 21.0 8.5 18.0 23.0 17.5 12.5 1.0 0.80 0.082 21.0 9.0 18.5 23.5 17.5 12.5 1.0 0.80 0.10 21.0 10.0 20.0 25.0 17.5 12.5 1.0 0.80 0.12 26.0 9.0 18.5 23.5 22.5 17.5 1.0 0.80 0.15 26.0 10.0 20.0 25.0 22.5 17.5 1.5 0.80 0.18 26.0 10.5 22.0 27.0 22.5 17.5 1.5 0.80 0.22 26.0 12.0 23.0 28.0 22.5 17.5 1.5 0.80 ECQE10103□F( ) ECQE10123□F( ) ECQE10153□F( ) ECQE10183□F( ) ECQE10223□F( ) ECQE10273□F( ) ECQE10333□F( ) ECQE10393□F( ) ECQE10473□F( ) ECQE10563□F( ) ECQE10683□F( ) ECQE10823□F( ) ECQE10104□F( ) ECQE10124□F( ) ECQE10154□F( ) ECQE10184□F( ) ECQE10224□F( ) Cap. (µF) Min. order Q'ty 500 400 500 400 300 - Dimensions (mm) L max. T max. ø d 7.5 mm H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Bulk Taping Style D: 0.010 µF to 0.022 µF Style B: 0.027 µF to 0.22 µF Suffix for lead crimped or taped type. Cap. tol. code ▲ ▲ Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 37 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC38 - Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 1250 VDC, Note) 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) Note) This type has two rated voltage, one is DC rated voltage another is AC rated voltage.. DC rated voltage is 1250 V, AC rated voltage is 125 V. Making for rated voltage is「1250 V, 125 V 」 When capacitors use in secondary side of power source, and in case of applying voltage in altering current (50 Hz or 60 Hz sine wave) to a capacitor, please refer to the page of ''Permissible voltage (R.M.S) in altering current corresponding to DC rated voltage''. When capacitors use in primary side of power source, the rated voltage is shown 125 VAC. Voltage to be applied to capacitors in only sine wave (50 Hz or 60 Hz). AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. And not complying with clause 2 of ''Electrical Appliance and Material Safety Law'', in this case please use ECQUL type or ECQUG type Style D: 0.0010 µF to 0.0068 µF Style B: 0.0082 µF to 0.22 µF Part No. 0.0010 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0012 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0015 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0018 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0022 15.5 6.0 11.5 16.5 12.5 10.0 1.0 0.60 0.0027 15.5 6.5 12.0 17.0 12.5 10.0 1.0 0.60 0.0033 15.5 6.0 11.5 16.5 12.5 10.0 1.0 0.60 0.0039 15.5 6.5 12.0 17.0 12.5 10.0 1.0 0.60 0.0047 15.5 7.0 12.5 17.5 12.5 10.0 1.0 0.60 0.0056 15.5 7.5 13.0 18.0 12.5 10.0 1.0 0.60 0.0068 15.5 7.5 15.0 20.0 12.5 10.0 1.0 0.60 0.0082 21.0 5.0 12.0 17.0 17.5 12.5 1.0 0.60 0.010 21.0 5.0 12.5 17.5 17.5 12.5 1.0 0.60 0.012 21.0 5.5 13.0 18.0 17.5 12.5 1.0 0.60 0.015 21.0 6.0 13.5 18.5 17.5 12.5 1.0 0.60 0.018 21.0 6.5 14.5 19.5 17.5 12.5 1.0 0.80 0.022 21.0 7.0 15.0 20.0 17.5 12.5 1.0 0.80 0.027 26.0 6.0 15.5 20.5 22.5 17.5 1.0 0.80 0.033 26.0 6.5 16.0 21.0 22.5 17.5 1.0 0.80 0.039 26.0 7.0 16.5 21.5 22.5 17.5 1.0 0.80 0.047 26.0 8.0 17.0 22.0 22.5 17.5 1.0 0.80 0.056 31.0 7.5 17.0 22.0 27.5 22.5 1.0 0.80 0.068 31.0 8.0 17.5 22.5 27.5 22.5 1.0 0.80 0.082 31.0 9.0 18.5 23.5 27.5 22.5 1.0 0.80 0.10 31.0 10.0 19.5 24.5 27.5 22.5 1.0 0.80 0.12 31.0 11.5 20.5 25.5 27.5 22.5 1.5 0.80 0.15 31.0 12.0 23.0 28.0 27.5 22.5 1.5 0.80 0.18 31.0 13.0 24.5 29.5 27.5 22.5 1.5 0.80 0.22 31.0 14.5 26.5 31.5 27.5 22.5 1.5 0.80 ECQE12102□F( ) ECQE12122□F( ) ECQE12152□F( ) ECQE12182□F( ) ECQE12222□F( ) ECQE12272□F( ) ECQE12332□F( ) ECQE12392□F( ) ECQE12472□F( ) ECQE12562□F( ) ECQE12682□F( ) ECQE12822□F( ) ECQE12103□F( ) ECQE12123□F( ) ECQE12153□F( ) ECQE12183□F( ) ECQE12223□F( ) ECQE12273□F( ) ECQE12333□F( ) ECQE12393□F( ) ECQE12473□F( ) ECQE12563□F( ) ECQE12683□F( ) ECQE12823□F( ) ECQE12104□F( ) ECQE12124□F( ) ECQE12154□F( ) ECQE12184□F( ) ECQE12224□F( ) Cap. (µF) Min. order Q'ty 500 400 500 Dimensions (mm) L max. T max. ø d 7.5 mm H max. Straight Crimped lead Straight F Crimped lead S Straight G max. Bulk Taping 500 Suffix for lead crimped or taped type. Cap. tol. code ▲ ▲ p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 38 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC39 - Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) ●Noise suppression Capacitors (Across-the-line) style D:0.010 µF to 0.068 µF Suffix for lead crimped or taped type. Cap. tol. code MF( ) Table 1 Notice for AC rated AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. As for clause 2 of ''Electrical Appliance and Material Safety Law'', please use ECQUL type or ECQUG type. When using these capacitors as a across-the-line capacitor, it shall be required to follow either item 1. or item 2. condition. 1. Capacitor shall be connected in parallel with varistor (Specified varistor voltage in table 1.) 2. Voltage applied for capacitor shall not exceed other than specified in table 1, when using these capacitors. Cap. Rated Voltage 125 VAC Varistor voltage 250 V Pulse voltage 250 V0–P Part No. 0.010 10.5 4.5 7.5 12.5 7.5 7.5 1.0 0.60 0.012 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.015 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.018 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.022 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.027 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.033 10.5 4.5 7.8 12.8 7.5 7.5 1.0 0.60 0.039 10.5 4.5 7.8 12.8 7.5 7.5 1.0 0.60 0.047 10.5 5.5 8.0 13.0 7.5 7.5 1.0 0.60 0.056 10.5 5.9 8.5 13.5 7.5 7.5 1.0 0.60 0.068 10.5 6.3 9.4 14.4 7.5 7.5 1.0 0.60 ECQE1A103□F( ) ECQE1A123□F( ) ECQE1A153□F( ) ECQE1A183□F( ) ECQE1A223□F( ) ECQE1A273□F( ) ECQE1A333□F( ) ECQE1A393□F( ) ECQE1A473□F( ) ECQE1A563□F( ) ECQE1A683□F( ) Cap. (µF) 1000 - 1000 500 Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 39 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. - FC40 - Plastic Film Capacitors ●Rated voltage : 250 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) Noise suppression Capacitors (Across-the-line) Style D:0.010 µF to 0.047 µF Style B:0.056 µF to 0.47 µF Table 1 ❈Please consult us about Crimed lead type of 0.56 µF to 2.2 µF. Notice for AC rated AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. As for clause 2 of ''Electrical Appliance and Material Safety Law'', please use ECQUL type or ECQUG type. When using these capacitors as a across-the-line capacitor, it shall be required to follow either item 1. or item 2. condition. 1. Capacitor shall be connected in parallel with varistor (Specified varistor voltage in table 1.) 2. Voltage applied for capacitor shall not exceed other than specified in table 1, when using these capacitors. Cap. Rated Voltage 250 VAC Varistor voltage 470 V Pulse voltage 630 V0–P Suffix for lead crimped or taped type. Cap. tol. code MF( ) Part No. 0.010 12.5 5.5 10.8 15.8 10.0 10.0 1.0 0.60 0.012 12.5 6.0 11.5 16.5 10.0 10.0 1.0 0.60 0.015 12.5 6.3 9.9 14.9 10.0 10.0 1.0 0.60 0.018 12.5 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.022 12.5 6.0 11.5 16.5 10.0 10.0 1.0 0.60 0.027 12.5 5.5 10.9 15.9 10.0 10.0 1.0 0.60 0.033 12.5 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.039 12.5 6.0 13.4 18.4 10.0 10.0 1.0 0.60 0.047 12.5 6.5 14.4 19.4 10.0 10.0 1.0 0.60 0.056 18.5 5.4 10.5 15.5 15.0 10.0 1.0 0.60 0.068 18.5 5.8 11.0 16.0 15.0 10.0 1.0 0.60 0.082 18.5 6.3 12.0 17.0 15.0 10.0 1.0 0.60 0.10 18.5 6.3 14.0 19.0 15.0 10.0 1.0 0.60 0.12 18.5 6.8 14.5 19.5 15.0 10.0 1.0 0.80 0.15 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80 0.18 18.5 8.0 16.0 21.0 15.0 10.0 1.0 0.80 0.22 18.5 9.0 16.9 21.9 15.0 10.0 1.0 0.80 0.27 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80 0.33 26.0 7.8 17.0 22.0 22.5 15.0 1.0 0.80 0.39 26.0 8.5 17.9 22.9 22.5 15.0 1.0 0.80 0.47 26.0 9.3 18.5 23.5 22.5 15.0 1.0 0.80 0.56 26.0 10.0 20.0 ─ 22.5 ─ 1.0 0.80 0.68 26.0 11.5 21.0 ─ 22.5 ─ 1.0 0.80 0.82 26.0 13.0 22.5 ─ 22.5 ─ 1.0 0.80 1.0 31.0 12.5 21.9 ─ 27.5 ─ 1.5 0.80 1.2 31.0 13.5 23.0 ─ 27.5 ─ 1.5 0.80 1.5 31.0 15.3 24.7 ─ 27.5 ─ 1.5 0.80 1.8 31.0 16.8 27.0 ─ 27.5 ─ 1.5 0.80 2.2 31.0 19.5 29.0 ─ 27.5 ─ 1.5 0.80 ECQE2A103□F( ) ECQE2A123□F( ) ECQE2A153□F( ) ECQE2A183□F( ) ECQE2A223□F( ) ECQE2A273□F( ) ECQE2A333□F( ) ECQE2A393□F( ) ECQE2A473□F( ) ECQE2A563□F( ) ECQE2A683□F( ) ECQE2A823□F( ) ECQE2A104□F( ) ECQE2A124□F( ) ECQE2A154□F( ) ECQE2A184□F( ) ECQE2A224□F( ) ECQE2A274□F( ) ECQE2A334□F( ) ECQE2A394□F( ) ECQE2A474□F( ) ECQE2A564P( )( ) ECQE2A684P( )( ) ECQE2A824P( )( ) ECQE2A105P( )( ) ECQE2A125P( )( ) ECQE2A155P( )( ) ECQE2A185P( )( ) ECQE2A225P( )( ) Cap. (µF) 500 1000 500 400 300 - - Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 7.5 mm Bulk p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 40 Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 100VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 10uF 4.7uF 1.0uF 10uF 4.7uF 1.0uF 10uF 4.7uF 1.0uF 10uF 4.7uF 1.0uF 1.0uF 4.7uF 10uF 1.0uF 4.7uF 10uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.56 564 12.32 0.68 684 15.0 0.82 824 18.0 1.00 105 22.0 1.20 125 13.2 1.50 155 17.1 1.80 185 19.8 2.20 225 24.2 2.70 275 29.7 3.30 335 36.3 3.90 395 23.4 4.70 475 28.2 5.60 565 33.6 6.80 685 40.8 8.20 825 49.2 10.00 106 60.0 Pulse Handling Capability (dV/dt) (Max 10000cycles) Voltage Derating by Temperature Permissible Current Permissible Voltage 6 22 100VDC 11 0 20 40 60 80 100 120 -60 -40 -20 0 20 40 60 80 100 120 0.1 1 10 100 10 100 1000 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 100VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) 1.0uF 2.2uF 4.7uF 10uF 1.0uF 2.2uF 4.7uF 10uF From 0.56uF to 10uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 250VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 10uF 1.0uF 0.1uF 10uF 1.0uF 0.1uF 10uF 1.0uF 0.01uF 10uF 1.0uF 0.1uF 0.1uF 1.0uF 10uF 0.1uF 1.0uF 10uF 0.01uF 0.01uF 0.1uF 0.01uF 0.01uF 0.01uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.010 103 0.48 0.015 153 0.72 0.022 223 1.06 0.033 333 1.58 0.047 473 2.26 0.068 683 3.26 0.100 104 4.80 0.150 154 7.20 0.220 224 7.26 0.330 334 10.89 0.470 474 8.46 0.680 684 12.24 1.000 105 18.00 1.500 155 27.00 2.200 225 22.00 3.300 335 33.00 4.700 475 47.00 6.800 685 54.40 10.000 106 80.00 250VDC Pulse Handling Capability (dV/dt) Voltage Derating by Temperature (Max 10000cycles) 48 8 10 18 33 Permissible Current Permissible Voltage 0 50 100 150 200 250 300 -60 -40 -20 0 20 40 60 80 100 120 1 10 100 10 100 1000 0 1 2 3 4 5 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 250VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) 1.0uF 2.2uF 4.7uF 10uF From 0.01uF to 10uF 0.47uF 0.22uF 0.10uF 0.047u 0.022u 0.01uF 0.01uF 0.022uF 0.047uF 0.10uF 0.22uF 0.47uF 1.0uF 2.2uF 4.7uF 10uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 400VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 2.2uF 1.0uF 0.1uF 2.2uF 1.0uF 0.1uF 2.2uF 1.0uF 0.1uF 0.01uF 0.01uF 0.01uF 0.01uF 0.1uF 1.0uF 2.2uF 0.01uF 0.1uF 1.0uF 2.2uF 2.2uF 1.0uF 0.1uF 0.01uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.010 103 1.31 0.015 153 1.97 0.022 223 2.88 0.033 333 4.32 0.047 473 3.67 0.068 683 5.30 0.100 104 7.80 0.150 154 5.55 0.220 224 8.14 0.330 334 12.21 0.470 474 17.39 0.680 684 14.96 1.000 105 22.00 1.200 155 27.00 2.200 225 39.60 Permissible Voltage Voltage Derating by Temperature 131 Permissible Current Pulse Handling Capability (dV/dt) (Max 10000cycles) 400VDC 78 37 22 18 0 100 200 300 400 500 -60 -40 -20 0 20 40 60 80 100 120 0 0.5 1 1.5 2 2.5 3 10 100 1000 1 10 100 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 400VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) From 0.01uF to 2.2uF 2.2uF 1.0uF 0.47uF 0.22uF 0.1uF 0.047uF 0.022uF 0.01uF 0.01uF 0.022uF 0.047uF 0.1uF 0.22uF 0.47uF 1.0uF 2.2uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 630VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 2.2uF 1.0uF 0.1uF 2.2uF 1.0uF 0.1uF 1.0uF 0.1uF 0.01uF 0.01uF 0.01uF 0.01uF 0.1uF 1.0uF 2.2uF 0.01uF 0.1uF 1.0uF 2.2uF 2.2uF 1.0uF 0.1uF 0.01uF 2.2uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.010 103 2.73 0.015 153 4.10 0.022 223 6.01 0.033 333 9.01 0.047 473 12.83 0.068 683 7.89 0.100 104 11.60 0.150 154 17.40 0.220 224 25.52 0.330 334 20.79 0.470 474 29.61 0.680 684 42.84 1.000 105 48.00 1.500 155 72.00 2.200 225 105.60 (Max 10000cycles) 273 Voltage Derating by Temperature 630VDC Permissible Current Permissible Voltage 116 63 48 Pulse Handling Capability (dV/dt) 0 100 200 300 400 500 600 700 800 -60 -40 -20 0 20 40 60 80 100 120 1 10 100 10 100 1000 0 1 2 3 4 5 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 630VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) From 0.01uF to 2.2uF 2.2uF 1.0uF 0.47uF 0.22uF 0.1uF 0.047uF 0.022uF 0.01uF 0.01uF 0.022uF 0.047uF 0.1uF 0.22uF 0.47uF 1.0uF 2.2uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 125VAC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.01uF 0.47uF 0.1uF 0.047uF 0.047uF 0.1uF 0.47uF 0.047uF 0.1uF 0.47uF 0.01uF 0.01uF 0.047uF 0.01uF 0.01uF 0.01uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 250VAC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.01uF 0.47uF 0.1uF 0.047uF 0.047uF 0.1uF 0.47uF 0.047uF 0.1uF 0.47uF 0.01uF 0.01uF 0.047uF 0.01uF 0.01uF 0.01uF Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-82 – 010 Sleeve L 14 min. 3 min. = = L16 : L±1.5 L20 : L±2.0 Pressure relief 06.3 + – 08 0D±0.5 F±0.5 0D±0.5 fd±0.05 ■ Country of origin Malaysia Radial Lead Type Series: FR Type: A ■ Specifi cations Category Temp. Range –40 °C to +105 °C Rated W.V. Range 6.3 V.DC to 100 V.DC Nominal Cap. Range 4.7 μF to 8200 μF Capacitance Tolerance ±20 % (120 Hz/+20 °C) DC Leakage Cur rent I < 0.01 CV (μA) After 2 minutes tan d W.V. 6.3 10 16 25 35 50 63 100 (120 Hz/+20 °C) tan d 0.22 0.19 0.16 0.14 0.12 0.10 0.09 0.08 Add 0.02 per 1000 μF for products of 1000 μF or more. Endurance After following life test with DC voltage and +105 °C±2 °C ripple current value applied. (The sum of DC and ripple peak voltage shall not exceed the rated working voltage) when the capacitors are restored to 20 °C, the capacitors shall meet the limits specifi ed below. Duration 05×11/ 06.3×11.2 : 5000 hours 08×11.5/ 010×12.5 : 6000 hours (✽ Only EEUFR1V331U (010×12.5) 5000 hours) 08×15/ 010×16 : 8000 hours, 08×20 : 9000 hours 010×20 to 010×25/ 012.5×20 to 012.5×35/ 016×20 to 016×25 : 10000 hours Capacitance change ±25 % of initial measured value (6.3 V to 10 V : ±30 %) tan d < 200 % of initial specifi ed value DC leakage current < initial specifi ed value Shelf Life After storage for 1000 hours at +105 °C±2 °C with no voltage applied and then being stabilized at +20 °C, capacitors shall meet the limits specifi ed in Endurance. (With voltage treatment) ■ Di men sions in mm (not to scale) W.V.(V.DC) Cap (μF) Frequency (Hz) 60 120 1 k 10 k 100 k 6.3 to 100 4.7 to 33 0.45 0.55 0.75 0.90 1.00 47 to 330 0.60 0.70 0.85 0.95 1.00 390 to 1000 0.65 0.75 0.90 0.98 1.00 1200 to 8200 0.75 0.80 0.95 1.00 1.00 ■ Frequency correction factor for ripple current Body Dia. 0D 5 6.3 8 10 12.5 16 Body Length L — — — — 12.5 to 25 30 to 35 — Lead Dia. 0d 0.5 0.5 0.6 0.6 0.6 0.8 0.8 Lead space F 2.0 2.5 3.5 5.0 5.0 7.5 ■ Features ● Low ESR (Same as FM Series) ● Endurance : 5000 h to 10000 h at +105 °C ● RoHS directive compliant ■ Attention Not applicable for automotive (Unit : mm) 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-83 – ■ Case size/Impedance/Ripple current W.V.(V.DC) 6.3 V to 35 V 50 V Case size (0D×L) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) +20 °C –10 °C +105 °C +20 °C –10 °C +105 °C 5 × 11 0.300 1.000 280 0.340 1.130 250 6.3 × 11.2 0.130 0.430 455 0.140 0.460 405 8 × 11.5 0.056 0.168 950 0.061 0.183 870 8 × 15 0.041 0.123 1240 0.045 0.135 1140 8 × 20 0.030 0.090 1560 0.033 0.099 1430 10 × 12.5 0.043 0.114 1290 0.042 0.126 1170 10 × 16 0.028 0.078 1790 0.030 0.090 1650 10 × 20 0.020 0.057 2180 0.023 0.069 1890 10 × 25 0.018 0.054 2470 0.022 0.066 2150 12.5 × 20 0.018 0.045 2600 0.022 0.055 2260 12.5 × 25 0.015 0.038 3190 0.018 0.045 2660 12.5 × 30 0.013 0.033 3630 0.016 0.040 3160 12.5 × 35 0.012 0.030 3750 0.014 0.035 3270 16 × 20 0.017 0.043 3300 0.019 0.048 2870 16 × 25 0.014 0.035 3820 0.016 0.040 3320 W.V.(V.DC) 63 V Case size (0D×L) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) +20 °C –10 °C +105 °C 5 × 11 0.510 2.040 175 6.3 × 11.2 0.210 0.840 284 8 × 11.5 0.092 0.368 566 8 × 15 0.068 0.272 741 8 × 20 0.050 0.200 930 10 × 12.5 0.063 0.252 761 10 × 16 0.045 0.180 1073 10 × 20 0.035 0.140 1229 10 × 25 0.033 0.132 1500 12.5 × 20 0.033 0.125 1582 12.5 × 25 0.027 0.092 1995 12.5 × 30 0.024 0.082 2528 12.5 × 35 0.021 0.071 2780 16 × 20 0.029 0.093 2153 16 × 25 0.024 0.074 2988 W.V.(V.DC) 100 V Case size (0D×L) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) +20 °C –10 °C +105 °C 10 × 20 0.084 0.336 1500 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-84 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 6.3 150 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR0J151( ) 200 2000 220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J221( ) 200 2000 330 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J331( ) 200 2000 470 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J471( ) 200 2000 820 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR0J821( ) 200 1000 1000 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR0J102( ) 200 1000 1200 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR0J122L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR0J122( ) 200 500 1500 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR0J152L( ) 200 1000 1800 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR0J182( ) 200 500 2200 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR0J222( ) 200 500 2700 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR0J272L( ) 200 500 3300 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR0J332L( ) 200 500 3900 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR0J392( ) 200 500 4700 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR0J472( ) 200 500 5600 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR0J562L 100 6800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR0J682L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR0J682S( ) 100 250 8200 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR0J822( ) 100 250 10 100 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1A101( ) 200 2000 150 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1A151( ) 200 2000 220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1A221( ) 200 2000 270 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1A271( ) 200 2000 470 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1A471( ) 200 1000 680 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1A681( ) 200 1000 820 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1A821( ) 200 500 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1A102( ) 200 500 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1A102L( ) 200 1000 1500 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1A152L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1A152( ) 200 500 1800 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1A182( ) 200 500 2200 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1A222L( ) 200 500 3300 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1A332( ) 200 500 3900 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1A392( ) 200 500 4700 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1A472L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1A472S( ) 100 250 5600 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1A562L 100 6800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1A682L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1A682( ) 100 250 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-85 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 16 68 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1C680( ) 200 2000 100 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1C101( ) 200 2000 120 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1C121( ) 200 2000 220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1C221( ) 200 2000 470 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1C471( ) 200 1000 680 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1C681L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1C681( ) 200 500 1000 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1C102L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1C102( ) 200 500 1500 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1C152( ) 200 500 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1C152L( ) 200 500 1800 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1C182L( ) 200 500 2200 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1C222( ) 200 500 2700 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1C272( ) 200 500 3300 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1C332L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1C332S( ) 100 250 3900 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1C392L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1C392S( ) 100 250 4700 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1C472L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1C472( ) 100 250 5600 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1C562( ) 100 250 25 47 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1E470( ) 200 2000 68 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1E680( ) 200 2000 100 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1E101( ) 200 2000 150 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1E151( ) 200 2000 220 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1E221( ) 200 1000 330 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1E331( ) 200 1000 390 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1E391L( ) 200 1000 470 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1E471Y( ) 200 1000 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E471L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1E471( ) 200 500 560 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E561L( ) 200 1000 680 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E681L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1E681( ) 200 500 820 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1E821( ) 200 500 1000 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1E102( ) 200 500 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1E102L( ) 200 500 1200 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1E122L( ) 200 500 1500 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1E152( ) 200 500 1800 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1E182( ) 200 500 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E182S( ) 100 250 2200 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1E222L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E222S( ) 100 250 2700 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1E272L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E272S( ) 100 250 3300 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1E332( ) 100 250 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-86 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 35 33 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1V330( ) 200 2000 68 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1V680( ) 200 2000 100 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V101( ) 200 1000 180 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V181( ) 200 1000 220 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V221( ) 200 1000 270 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1V271L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1V271( ) 200 500 330 10 12.5 1330 0.043 5000 0.6 5.0 5.0 EEUFR1V331U( ) 200 500 390 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1V391L( ) 200 1000 470 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1V471L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1V471( ) 200 500 560 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1V561( ) 200 500 680 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1V681( ) 200 500 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1V681L( ) 200 500 820 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1V821L( ) 200 500 1000 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1V102( ) 200 500 1200 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1V122( ) 200 500 1500 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1V152L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1V152S( ) 100 250 1800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1V182L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1V182( ) 100 250 2200 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1V222L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1V222( ) 100 250 50 4.7 5 11 185 0.620 5000 0.5 2.0 5.0 2.5 EEUFR1H4R7( ) 200 2000 10 5 11 250 0.340 5000 0.5 2.0 5.0 2.5 EEUFR1H100( ) 200 2000 22 5 11 250 0.340 5000 0.5 2.0 5.0 2.5 EEUFR1H220( ) 200 2000 47 6.3 11.2 405 0.140 5000 0.5 2.5 5.0 EEUFR1H470( ) 200 2000 56 6.3 11.2 405 0.140 5000 0.5 2.5 5.0 2.5 EEUFR1H560( ) 200 2000 100 8 11.5 870 0.061 6000 0.6 3.5 5.0 EEUFR1H101( ) 200 1000 120 8 15 1140 0.045 8000 0.6 3.5 5.0 EEUFR1H121L( ) 200 1000 150 10 12.5 1170 0.042 6000 0.6 5.0 5.0 EEUFR1H151( ) 200 500 180 8 20 1430 0.033 9000 0.6 3.5 5.0 EEUFR1H181L( ) 200 1000 220 10 16 1650 0.030 8000 0.6 5.0 5.0 EEUFR1H221( ) 200 500 270 10 20 1890 0.023 10000 0.6 5.0 5.0 EEUFR1H271( ) 200 500 330 10 25 2150 0.022 10000 0.6 5.0 5.0 EEUFR1H331L( ) 200 500 470 12.5 20 2260 0.022 10000 0.6 5.0 5.0 EEUFR1H471( ) 200 500 560 12.5 25 2660 0.018 10000 0.6 5.0 5.0 EEUFR1H561( ) 200 500 680 12.5 30 3160 0.016 10000 0.8 5.0 EEUFR1H681L 100 820 12.5 35 3270 0.014 10000 0.8 5.0 EEUFR1H821L 100 16 20 2870 0.019 10000 0.8 7.5 7.5 EEUFR1H821S( ) 100 250 1000 16 25 3320 0.016 10000 0.8 7.5 7.5 EEUFR1H102( ) 100 250 63 18 5 11 175 0.510 5000 0.5 2.0 5.0 2.5 EEUFR1J180( ) 200 2000 47 6.3 11.2 284 0.210 5000 0.5 2.5 5.0 2.5 EEUFR1J470( ) 200 2000 82 8 11.5 566 0.092 6000 0.6 3.5 5.0 EEUFR1J820( ) 200 1000 100 8 15 741 0.068 8000 0.6 3.5 5.0 EEUFR1J101L( ) 200 1000 10 12.5 761 0.063 6000 0.6 5.0 5.0 EEUFR1J101( ) 200 500 120 8 20 930 0.050 9000 0.6 3.5 5.0 EEUFR1J121L( ) 200 1000 10 16 1073 0.045 8000 0.6 5.0 5.0 EEUFR1J121( ) 200 500 150 8 20 930 0.050 9000 0.6 3.5 5.0 EEUFR1J151L( ) 200 1000 10 16 1073 0.045 8000 0.6 5.0 5.0 EEUFR1J151( ) 200 500 180 10 20 1229 0.035 10000 0.6 5.0 5.0 EEUFR1J181( ) 200 500 220 10 25 1500 0.033 10000 0.6 5.0 5.0 EEUFR1J221L( ) 200 500 270 10 20 1229 0.035 10000 0.6 5.0 5.0 EEUFR1J271U( ) 200 500 10 25 1500 0.033 10000 0.6 5.0 5.0 EEUFR1J271L( ) 200 500 12.5 20 1582 0.033 10000 0.6 5.0 5.0 EEUFR1J271( ) 200 500 330 12.5 20 1582 0.033 10000 0.6 5.0 5.0 EEUFR1J331( ) 200 500 390 12.5 25 1995 0.027 10000 0.6 5.0 5.0 EEUFR1J391( ) 200 500 470 12.5 25 1995 0.027 10000 0.6 5.0 5.0 EEUFR1J471( ) 200 500 560 12.5 30 2528 0.024 10000 0.8 5.0 EEUFR1J561L 100 16 20 2153 0.029 10000 0.8 7.5 7.5 EEUFR1J561S( ) 100 250 680 12.5 35 2780 0.021 10000 0.8 5.0 EEUFR1J681L 100 820 16 25 2988 0.024 10000 0.8 7.5 7.5 EEUFR1J821( ) 100 250 100 100 10 20 1500 0.084 10000 0.6 5.0 5.0 EEUFR2A101( ) 200 500 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ M – EEE-111 – 010 Sleeve L 14 min. 3 min. = 06.3 =L16 : L±1.0 L20 : L±2.0 Pressure relief + –  08 0D+0.5 F±0.5 0D+0.5 fd±0.05 ■ Features ● Endurance : 85 °C 2000 h ● Smaller than series SU ● RoHS directive compliant Radial Lead Type Series: M Type: A ■ Specifi cations Category Temp. Range –40 °C to + 85 °C –25 °C to +85 °C Rated W.V. Range 6.3 V.DC to 100 V.DC 160 V.DC to 450 V.DC Nominal Cap. Range 2.2 μF to 22000 μF 1 μF to 470 μF Capacitance Tolerance ±20 % (120 Hz/+20 °C) DC Leakage Cur rent I < 0.01 CV or 3 (μA) After 2 minutes (Whichever is greater) I < 0.06 CV +10 (μA) After 2 minutes tan d Please see the attached standard products list Endurance After applying rated working voltage for 2000 hours at +85°C±2 °C, when the capacitors are restored to 20 °C, capacitors shall meet the following limits. Capacitance change ±20 % of initial measured value tan d <150 % of initial specifi ed value DC leakage current > NXP Semiconductors LPC2468 Single-chip 16-bit/32-bit micro 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Functional description . . . . . . . . . . . . . . . . . . 24 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 24 7.2 On-chip flash programming memory . . . . . . . 25 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 25 7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 27 7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 28 7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 28 7.7 External memory controller. . . . . . . . . . . . . . . 28 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.8 General purpose DMA controller . . . . . . . . . . 29 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.9 Fast general purpose parallel I/O . . . . . . . . . . 30 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.11 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.11.1 USB device controller . . . . . . . . . . . . . . . . . . . 32 7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.11.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 32 7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.11.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 33 7.11.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.12 CAN controller and acceptance filters . . . . . . 33 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.15 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 35 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 35 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 35 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.19 I2C-bus serial I/O controller . . . . . . . . . . . . . . 36 7.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . 36 7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.21 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 38 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 39 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 39 7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 7.25 Clocking and power control . . . . . . . . . . . . . . 40 7.25.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 40 7.25.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 40 7.25.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 40 7.25.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 41 7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 41 7.25.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 43 7.25.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 43 7.26 System control . . . . . . . . . . . . . . . . . . . . . . . . 44 7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 7.26.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 44 7.26.3 Code security (Code Read Protection - CRP) 44 7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 7.26.5 External interrupt inputs . . . . . . . . . . . . . . . . . 45 7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 45 7.27 Emulation and debugging . . . . . . . . . . . . . . . 45 7.27.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 45 7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 46 7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 46 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 47 9 Thermal characteristics . . . . . . . . . . . . . . . . . 48 10 Static characteristics . . . . . . . . . . . . . . . . . . . 49 10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 52 10.2 Deep power-down mode . . . . . . . . . . . . . . . . 53 10.3 Electrical pin characteristics. . . . . . . . . . . . . . 55 11 Dynamic characteristics. . . . . . . . . . . . . . . . . 56 11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 57 11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 57 11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 58 NXP Semiconductors LPC2468 Single-chip 16-bit/32-bit micro © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 January 2013 Document identifier: LPC2468 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11.5 Static external memory interface . . . . . . . . . . 59 11.6 Dynamic external memory interface . . . . . . . . 61 11.7 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 12 ADC electrical characteristics . . . . . . . . . . . . 65 13 DAC electrical characteristics . . . . . . . . . . . . 68 14 Application information. . . . . . . . . . . . . . . . . . 69 14.1 Suggested USB interface solutions . . . . . . . . 69 14.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 14.3 RTC 32 kHz oscillator component selection. . 75 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines. . . . . . . . . . . . . . . . . . . . . . . 76 14.5 Standard I/O pin configuration . . . . . . . . . . . . 76 14.6 Reset pin configuration. . . . . . . . . . . . . . . . . . 77 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 78 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 80 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 81 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 82 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 82 18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 83 19 Contact information. . . . . . . . . . . . . . . . . . . . . 83 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 1. General description The LPC2141/42/44/46/48 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combine the microcontroller with embedded high-speed flash memory ranging from 32 kB to 512 kB. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. Due to their tiny size and low power consumption, LPC2141/42/44/46/48 are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. Serial communications interfaces ranging from a USB 2.0 Full-speed device, multiple UARTs, SPI, SSP to I2C-bus and on-chip SRAM of 8 kB up to 40 kB, make these devices very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit ADC(s), 10-bit DAC, PWM channels and 45 fast GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers suitable for industrial control and medical systems. 2. Features and benefits 2.1 Key features  16-bit/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.  8 kB to 40 kB of on-chip static RAM and 32 kB to 512 kB of on-chip flash memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation.  In-System Programming/In-Application Programming (ISP/IAP) via on-chip boot loader software. Single flash sector or full chip erase in 400 ms and programming of 256 B in 1 ms.  EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the on-chip RealMonitor software and high-speed tracing of instruction execution.  USB 2.0 Full-speed compliant device controller with 2 kB of endpoint RAM. In addition, the LPC2146/48 provides 8 kB of on-chip RAM accessible to USB by DMA.  One or two (LPC2141/42 vs. LPC2144/46/48) 10-bit ADCs provide a total of 6/14 analog inputs, with conversion times as low as 2.44 s per channel.  Single 10-bit DAC provides variable analog output (LPC2142/44/46/48 only).  Two 32-bit timers/external event counters (with four capture and four compare channels each), PWM unit (six outputs) and watchdog.  Low power Real-Time Clock (RTC) with independent power and 32 kHz clock input. LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC Rev. 5 — 12 August 2011 Product data sheet LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 2 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers  Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s), SPI and SSP with buffering and variable data length capabilities.  Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.  Up to 45 of 5 V tolerant fast general purpose I/O pins in a tiny LQFP64 package.  Up to 21 external interrupt pins available.  60 MHz maximum CPU clock available from programmable on-chip PLL with settling time of 100 s.  On-chip integrated oscillator operates with an external crystal from 1 MHz to 25 MHz.  Power saving modes include Idle and Power-down.  Individual enable/disable of peripheral functions as well as peripheral clock scaling for additional power optimization.  Processor wake-up from Power-down mode via external interrupt or BOD.  Single power supply chip with POR and BOD circuits:  CPU operating voltage range of 3.0 V to 3.6 V (3.3 V  10 %) with 5 V tolerant I/O pads. 3. Ordering information 3.1 Ordering options [1] While the USB DMA is the primary user of the additional 8 kB RAM, this RAM is also accessible at any time by the CPU as a general purpose RAM for data and code storage. Table 1. Ordering information Type number Package Name Description Version LPC2141FBD64 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2 LPC2142FBD64 LPC2144FBD64 LPC2146FBD64 LPC2148FBD64 Table 2. Ordering options Type number Flash memory RAM Endpoint USB RAM ADC (channels overall) DAC Temperature range LPC2141FBD64 32 kB 8 kB 2 kB 1 (6 channels) - 40 C to +85 C LPC2142FBD64 64 kB 16 kB 2 kB 1 (6 channels) 1 40 C to +85 C LPC2144FBD64 128 kB 16 kB 2 kB 2 (14 channels) 1 40 C to +85 C LPC2146FBD64 256 kB 32 kB + 8 kB shared with USB DMA[1] 2 kB 2 (14 channels) 1 40 C to +85 C LPC2148FBD64 512 kB 32 kB + 8 kB shared with USB DMA[1] 2 kB 2 (14 channels) 1 40 C to +85 C LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 3 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 4. Block diagram (1) Pins shared with GPIO. (2) LPC2144/46/48 only. (3) USB DMA controller with 8 kB of RAM accessible as general purpose RAM and/or DMA is available in LPC2146/48 only. (4) LPC2142/44/46/48 only. Fig 1. Block diagram 002aab560 system clock TRST(1) TMS(1) TCK(1) TDI(1) TDO(1) XTAL2 XTAL1 AMBA AHB (Advanced High-performance Bus) INTERNAL FLASH CONTROLLER AHB BRIDGE EMULATION TRACE MODULE TEST/DEBUG INTERFACE AHB AHB TO APB DECODER BRIDGE APB DIVIDER VECTORED INTERRUPT CONTROLLER SYSTEM FUNCTIONS PLL0 USB clock PLL1 SYSTEM CONTROL 32 kB/64 kB/128 kB/ 256 kB/512 kB FLASH ARM7TDMI-S LPC2141/42/44/46/48 INTERNAL SRAM CONTROLLER 8 kB/16 kB/ 32 kB SRAM ARM7 local bus SCL0, SCL1 SDA0, SDA1 4 × CAP0 4 × CAP1 8 × MAT0 8 × MAT1 I 2C-BUS SERIAL INTERFACES 0 AND 1 CAPTURE/COMPARE (W/EXTERNAL CLOCK) TIMER 0/TIMER 1 EINT3 to EINT0 EXTERNAL INTERRUPTS D+ D− UP_LED CONNECT VBUS USB 2.0 FULL-SPEED DEVICE CONTROLLER WITH DMA(3) SCK0, SCK1 MOSI0, MOSI1 MISO0, MISO1 AD0[7:6] and AD0[4:1] AD1[7:0](2) SSEL0, SSEL1 SPI AND SSP SERIAL INTERFACES A/D CONVERTERS 0 AND 1(2) TXD0, TXD1 RXD0, RXD1 DSR1(2),CTS1(2), RTS1(2), DTR1(2) DCD1(2),RI1(2) AOUT(4) D/A CONVERTER UART0/UART1 P0[31:28] and P0[25:0] P1[31:16] RTXC2 RTXC1 VBAT REAL-TIME CLOCK GENERAL PURPOSE I/O PWM6 to PWM0 WATCHDOG TIMER PWM0 P0[31:28] and P0[25:0] P1[31:16] FAST GENERAL PURPOSE I/O 8 kB RAM SHARED WITH USB DMA(3) RST LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 4 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 5. Pinning information 5.1 Pinning Fig 2. LPC2141 pinning LPC2141 P0.21/PWM5/CAP1.3 P1.20/TRACESYNC P0.22/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2 RTCX1 P0.16/EINT0/MAT0.2/CAP0.2 P1.19/TRACEPKT3 P0.15/EINT2 RTCX2 P1.21/PIPESTAT0 VSS VDD VDDA VSS P1.18/TRACEPKT2 P0.14/EINT1/SDA1 P0.25/AD0.4 P1.22/PIPESTAT1 D+ P0.13/MAT1.1 D− P0.12/MAT1.0 P1.17/TRACEPKT1 P0.11/CAP1.1/SCL1 P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2 P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/CAP1.0 P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3 P1.16/TRACEPKT0 P0.8/TXD1/PWM4 P0.31/UP_LED/CONNECT P1.27/TDO VSS VREF P0.0/TXD0/PWM1 XTAL1 P1.31/TRST XTAL2 P0.1/RXD0/PWM3/EINT0 P1.28/TDI P0.2/SCL0/CAP0.0 VSSA VDD P0.23/VBUS P1.26/RTCK RESET VSS P1.29/TCK P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3 P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2 P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3 P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS P0.6/MOSI0/CAP0.2 VDD P0.7/SSEL0/PWM2/EINT2 VSS P1.24/TRACECLK VBAT 002aab733 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 5 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers Fig 3. LPC2142 pinning LPC2142 P0.21/PWM5/CAP1.3 P1.20/TRACESYNC P0.22/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2 RTCX1 P0.16/EINT0/MAT0.2/CAP0.2 P1.19/TRACEPKT3 P0.15/EINT2 RTCX2 P1.21/PIPESTAT0 VSS VDD VDDA VSS P1.18/TRACEPKT2 P0.14/EINT1/SDA1 P0.25/AD0.4/AOUT P1.22/PIPESTAT1 D+ P0.13/MAT1.1 D− P0.12/MAT1.0 P1.17/TRACEPKT1 P0.11/CAP1.1/SCL1 P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2 P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/CAP1.0 P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3 P1.16/TRACEPKT0 P0.8/TXD1/PWM4 P0.31/UP_LED/CONNECT P1.27/TDO VSS VREF P0.0/TXD0/PWM1 XTAL1 P1.31/TRST XTAL2 P0.1/RXD0/PWM3/EINT0 P1.28/TDI P0.2/SCL0/CAP0.0 VSSA VDD P0.23/VBUS P1.26/RTCK RESET VSS P1.29/TCK P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3 P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2 P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3 P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS P0.6/MOSI0/CAP0.2 VDD P0.7/SSEL0/PWM2/EINT2 VSS P1.24/TRACECLK VBAT 002aab734 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 6 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers Fig 4. LPC2144/46/48 pinning LPC2144/2146/2148 P0.21/PWM5/AD1.6/CAP1.3 P1.20/TRACESYNC P0.22/AD1.7/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2 RTCX1 P0.16/EINT0/MAT0.2/CAP0.2 P1.19/TRACEPKT3 P0.15/RI1/EINT2/AD1.5 RTCX2 P1.21/PIPESTAT0 VSS VDD VDDA VSS P1.18/TRACEPKT2 P0.14/DCD1/EINT1/SDA1 P0.25/AD0.4/AOUT P1.22/PIPESTAT1 D+ P0.13/DTR1/MAT1.1/AD1.4 D− P0.12/DSR1/MAT1.0/AD1.3 P1.17/TRACEPKT1 P0.11/CTS1/CAP1.1/SCL1 P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2 P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/RTS1/CAP1.0/AD1.2 P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3 P1.16/TRACEPKT0 P0.8/TXD1/PWM4/AD1.1 P0.31/UP_LED/CONNECT P1.27/TDO VSS VREF P0.0/TXD0/PWM1 XTAL1 P1.31/TRST XTAL2 P0.1/RXD0/PWM3/EINT0 P1.28/TDI P0.2/SCL0/CAP0.0 VSSA VDD P0.23/VBUS P1.26/RTCK RESET VSS P1.29/TCK P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3 P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2 P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3 P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS P0.6/MOSI0/CAP0.2/AD1.0 VDD P0.7/SSEL0/PWM2/EINT2 VSS P1.24/TRACECLK VBAT 002aab735 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 7 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 5.2 Pin description Table 3. Pin description Symbol Pin Type Description P0.0 to P0.31 I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. Total of 31 pins of the Port 0 can be used as a general purpose bidirectional digital I/Os while P0.31 is output only pin. The operation of port 0 pins depends upon the pin function selected via the pin connect block. Pins P0.24, P0.26 and P0.27 are not available. P0.0/TXD0/ PWM1 19[1] I/O P0.0 — General purpose input/output digital pin (GPIO). O TXD0 — Transmitter output for UART0. O PWM1 — Pulse Width Modulator output 1. P0.1/RXD0/ PWM3/EINT0 21[2] I/O P0.1 — General purpose input/output digital pin (GPIO). I RXD0 — Receiver input for UART0. O PWM3 — Pulse Width Modulator output 3. I EINT0 — External interrupt 0 input. P0.2/SCL0/ CAP0.0 22[3] I/O P0.2 — General purpose input/output digital pin (GPIO). I/O SCL0 — I 2C0 clock input/output. Open-drain output (for I2C-bus compliance). I CAP0.0 — Capture input for Timer 0, channel 0. P0.3/SDA0/ MAT0.0/EINT1 26[3] I/O P0.3 — General purpose input/output digital pin (GPIO). I/O SDA0 — I 2C0 data input/output. Open-drain output (for I2C-bus compliance). O MAT0.0 — Match output for Timer 0, channel 0. I EINT1 — External interrupt 1 input. P0.4/SCK0/ CAP0.1/AD0.6 27[4] I/O P0.4 — General purpose input/output digital pin (GPIO). I/O SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave. I CAP0.1 — Capture input for Timer 0, channel 1. I AD0.6 — ADC 0, input 6. P0.5/MISO0/ MAT0.1/AD0.7 29[4] I/O P0.5 — General purpose input/output digital pin (GPIO). I/O MISO0 — Master In Slave Out for SPI0. Data input to SPI master or data output from SPI slave. O MAT0.1 — Match output for Timer 0, channel 1. I AD0.7 — ADC 0, input 7. P0.6/MOSI0/ CAP0.2/AD1.0 30[4] I/O P0.6 — General purpose input/output digital pin (GPIO). I/O MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave. I CAP0.2 — Capture input for Timer 0, channel 2. I AD1.0 — ADC 1, input 0. Available in LPC2144/46/48 only. P0.7/SSEL0/ PWM2/EINT2 31[2] I/O P0.7 — General purpose input/output digital pin (GPIO). I SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave. O PWM2 — Pulse Width Modulator output 2. I EINT2 — External interrupt 2 input. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 8 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P0.8/TXD1/ PWM4/AD1.1 33[4] I/O P0.8 — General purpose input/output digital pin (GPIO). O TXD1 — Transmitter output for UART1. O PWM4 — Pulse Width Modulator output 4. I AD1.1 — ADC 1, input 1. Available in LPC2144/46/48 only. P0.9/RXD1/ PWM6/EINT3 34[2] I/O P0.9 — General purpose input/output digital pin (GPIO). I RXD1 — Receiver input for UART1. O PWM6 — Pulse Width Modulator output 6. I EINT3 — External interrupt 3 input. P0.10/RTS1/ CAP1.0/AD1.2 35[4] I/O P0.10 — General purpose input/output digital pin (GPIO). O RTS1 — Request to Send output for UART1. LPC2144/46/48 only. I CAP1.0 — Capture input for Timer 1, channel 0. I AD1.2 — ADC 1, input 2. Available in LPC2144/46/48 only. P0.11/CTS1/ CAP1.1/SCL1 37[3] I/O P0.11 — General purpose input/output digital pin (GPIO). I CTS1 — Clear to Send input for UART1. Available in LPC2144/46/48 only. I CAP1.1 — Capture input for Timer 1, channel 1. I/O SCL1 — I 2C1 clock input/output. Open-drain output (for I2C-bus compliance) P0.12/DSR1/ MAT1.0/AD1.3 38[4] I/O P0.12 — General purpose input/output digital pin (GPIO). I DSR1 — Data Set Ready input for UART1. Available in LPC2144/46/48 only. O MAT1.0 — Match output for Timer 1, channel 0. I AD1.3 — ADC 1 input 3. Available in LPC2144/46/48 only. P0.13/DTR1/ MAT1.1/AD1.4 39[4] I/O P0.13 — General purpose input/output digital pin (GPIO). O DTR1 — Data Terminal Ready output for UART1. LPC2144/46/48 only. O MAT1.1 — Match output for Timer 1, channel 1. I AD1.4 — ADC 1 input 4. Available in LPC2144/46/48 only. P0.14/DCD1/ EINT1/SDA1 41[3] I/O P0.14 — General purpose input/output digital pin (GPIO). I DCD1 — Data Carrier Detect input for UART1. LPC2144/46/48 only. I EINT1 — External interrupt 1 input. I/O SDA1 — I 2C1 data input/output. Open-drain output (for I2C-bus compliance). Note: LOW on this pin while RESET is LOW forces on-chip boot loader to take over control of the part after reset. P0.15/RI1/ EINT2/AD1.5 45[4] I/O P0.15 — General purpose input/output digital pin (GPIO). I RI1 — Ring Indicator input for UART1. Available in LPC2144/46/48 only. I EINT2 — External interrupt 2 input. I AD1.5 — ADC 1, input 5. Available in LPC2144/46/48 only. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 9 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P0.16/EINT0/ MAT0.2/CAP0.2 46[2] I/O P0.16 — General purpose input/output digital pin (GPIO). I EINT0 — External interrupt 0 input. O MAT0.2 — Match output for Timer 0, channel 2. I CAP0.2 — Capture input for Timer 0, channel 2. P0.17/CAP1.2/ SCK1/MAT1.2 47[1] I/O P0.17 — General purpose input/output digital pin (GPIO). I CAP1.2 — Capture input for Timer 1, channel 2. I/O SCK1 — Serial Clock for SSP. Clock output from master or input to slave. O MAT1.2 — Match output for Timer 1, channel 2. P0.18/CAP1.3/ MISO1/MAT1.3 53[1] I/O P0.18 — General purpose input/output digital pin (GPIO). I CAP1.3 — Capture input for Timer 1, channel 3. I/O MISO1 — Master In Slave Out for SSP. Data input to SPI master or data output from SSP slave. O MAT1.3 — Match output for Timer 1, channel 3. P0.19/MAT1.2/ MOSI1/CAP1.2 54[1] I/O P0.19 — General purpose input/output digital pin (GPIO). O MAT1.2 — Match output for Timer 1, channel 2. I/O MOSI1 — Master Out Slave In for SSP. Data output from SSP master or data input to SSP slave. I CAP1.2 — Capture input for Timer 1, channel 2. P0.20/MAT1.3/ SSEL1/EINT3 55[2] I/O P0.20 — General purpose input/output digital pin (GPIO). O MAT1.3 — Match output for Timer 1, channel 3. I SSEL1 — Slave Select for SSP. Selects the SSP interface as a slave. I EINT3 — External interrupt 3 input. P0.21/PWM5/ AD1.6/CAP1.3 1[4] I/O P0.21 — General purpose input/output digital pin (GPIO). O PWM5 — Pulse Width Modulator output 5. I AD1.6 — ADC 1, input 6. Available in LPC2144/46/48 only. I CAP1.3 — Capture input for Timer 1, channel 3. P0.22/AD1.7/ CAP0.0/MAT0.0 2[4] I/O P0.22 — General purpose input/output digital pin (GPIO). I AD1.7 — ADC 1, input 7. Available in LPC2144/46/48 only. I CAP0.0 — Capture input for Timer 0, channel 0. O MAT0.0 — Match output for Timer 0, channel 0. P0.23/VBUS 58[1] I/O P0.23 — General purpose input/output digital pin (GPIO). I VBUS — Indicates the presence of USB bus power. Note: This signal must be HIGH for USB reset to occur. P0.25/AD0.4/ AOUT 9[5] I/O P0.25 — General purpose input/output digital pin (GPIO). I AD0.4 — ADC 0, input 4. O AOUT — DAC output. Available in LPC2142/44/46/48 only. P0.28/AD0.1/ CAP0.2/MAT0.2 13[4] I/O P0.28 — General purpose input/output digital pin (GPIO). I AD0.1 — ADC 0, input 1. I CAP0.2 — Capture input for Timer 0, channel 2. O MAT0.2 — Match output for Timer 0, channel 2. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 10 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P0.29/AD0.2/ CAP0.3/MAT0.3 14[4] I/O P0.29 — General purpose input/output digital pin (GPIO). I AD0.2 — ADC 0, input 2. I CAP0.3 — Capture input for Timer 0, channel 3. O MAT0.3 — Match output for Timer 0, channel 3. P0.30/AD0.3/ EINT3/CAP0.0 15[4] I/O P0.30 — General purpose input/output digital pin (GPIO). I AD0.3 — ADC 0, input 3. I EINT3 — External interrupt 3 input. I CAP0.0 — Capture input for Timer 0, channel 0. P0.31/UP_LED/ CONNECT 17[6] O P0.31 — General purpose output only digital pin (GPO). O UP_LED — USB GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. O CONNECT — Signal used to switch an external 1.5 k resistor under the software control. Used with the SoftConnect USB feature. Important: This is an digital output only pin. This pin MUST NOT be externally pulled LOW when RESET pin is LOW or the JTAG port will be disabled. P1.0 to P1.31 I/O Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. Pins 0 through 15 of port 1 are not available. P1.16/ TRACEPKT0 16[6] I/O P1.16 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT0 — Trace Packet, bit 0. P1.17/ TRACEPKT1 12[6] I/O P1.17 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT1 — Trace Packet, bit 1. P1.18/ TRACEPKT2 8[6] I/O P1.18 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT2 — Trace Packet, bit 2. P1.19/ TRACEPKT3 4[6] I/O P1.19 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT3 — Trace Packet, bit 3. P1.20/ TRACESYNC 48[6] I/O P1.20 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACESYNC — Trace Synchronization. Note: LOW on this pin while RESET is LOW enables pins P1.25:16 to operate as Trace port after reset. P1.21/ PIPESTAT0 44[6] I/O P1.21 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O PIPESTAT0 — Pipeline Status, bit 0. P1.22/ PIPESTAT1 40[6] I/O P1.22 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O PIPESTAT1 — Pipeline Status, bit 1. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 11 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P1.23/ PIPESTAT2 36[6] I/O P1.23 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O PIPESTAT2 — Pipeline Status, bit 2. P1.24/ TRACECLK 32[6] I/O P1.24 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACECLK — Trace Clock. P1.25/EXTIN0 28[6] I/O P1.25 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. I EXTIN0 — External Trigger Input. P1.26/RTCK 24[6] I/O P1.26 — General purpose input/output digital pin (GPIO). I/O RTCK — Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bidirectional pin with internal pull-up. Note: LOW on RTCK while RESET is LOW enables pins P1[31:26] to operate as Debug port after reset. P1.27/TDO 64[6] I/O P1.27 — General purpose input/output digital pin (GPIO). O TDO — Test Data out for JTAG interface. P1.28/TDI 60[6] I/O P1.28 — General purpose input/output digital pin (GPIO). I TDI — Test Data in for JTAG interface. P1.29/TCK 56[6] I/O P1.29 — General purpose input/output digital pin (GPIO). I TCK — Test Clock for JTAG interface. This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to operate. P1.30/TMS 52[6] I/O P1.30 — General purpose input/output digital pin (GPIO). I TMS — Test Mode Select for JTAG interface. P1.31/TRST 20[6] I/O P1.31 — General purpose input/output digital pin (GPIO). I TRST — Test Reset for JTAG interface. D+ 10[7] I/O USB bidirectional D+ line. D 11[7] I/O USB bidirectional D line. RESET 57[8] I External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. XTAL1 62[9] I Input to the oscillator circuit and internal clock generator circuits. XTAL2 61[9] O Output from the oscillator amplifier. RTCX1 3[9][10] I Input to the RTC oscillator circuit. RTCX2 5[9][10] O Output from the RTC oscillator circuit. VSS 6, 18, 25, 42, 50 I Ground: 0 V reference. VSSA 59 I Analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. VDD 23, 43, 51 I 3.3 V power supply: This is the power supply voltage for the core and I/O ports. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 12 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers [1] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. [2] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. [3] Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output functionality. [4] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital section of the pad is disabled. [5] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog output function. When configured as the DAC output, digital section of the pad is disabled. [6] 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. The pull-up resistor’s value typically ranges from 60 k to 300 k. [7] Pad is designed in accordance with the Universal Serial Bus (USB) specification, revision 2.0 (Full-speed and Low-speed mode only). [8] 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only. [9] Pad provides special analog functionality. [10] When unused, the RTCX1 pin can be grounded or left floating. For lowest power leave it floating. The other RTC pin, RTCX2, should be left floating. VDDA 7 I Analog 3.3 V power supply: This should be nominally the same voltage as VDD but should be isolated to minimize noise and error. This voltage is only used to power the on-chip ADC(s) and DAC. VREF 63 I ADC reference voltage: This should be nominally less than or equal to the VDD voltage but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC(s) and DAC. VBAT 49 I RTC power supply voltage: 3.3 V on this pin supplies the power to the RTC. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 13 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6. Functional description 6.1 Architectural overview The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers (CISC). This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets: • The standard 32-bit ARM set. • A 16-bit Thumb set. The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. The particular flash implementation in the LPC2141/42/44/46/48 allows for full speed execution also in ARM mode. It is recommended to program performance critical and short code sections (such as interrupt service routines and DSP algorithms) in ARM mode. The impact on the overall code size will be minimal but the speed can be increased by 30 % over Thumb mode. 6.2 On-chip flash program memory The LPC2141/42/44/46/48 incorporate a 32 kB, 64 kB, 128 kB, 256 kB and 512 kB flash memory system respectively. This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port. The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field firmware upgrades, etc. Due to the architectural solution chosen for an on-chip boot loader, flash memory available for user’s code on LPC2141/42/44/46/48 is 32 kB, 64 kB, 128 kB, 256 kB and 500 kB respectively. The LPC2141/42/44/46/48 flash memory provides a minimum of 100000 erase/write cycles and 20 years of data-retention. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 14 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.3 On-chip static RAM On-chip static RAM may be used for code and/or data storage. The SRAM may be accessed as 8-bit, 16-bit, and 32-bit. The LPC2141, LPC2142/44 and LPC2146/48 provide 8 kB, 16 kB and 32 kB of static RAM respectively. In case of LPC2146/48 only, an 8 kB SRAM block intended to be utilized mainly by the USB can also be used as a general purpose RAM for data storage and code storage and execution. 6.4 Memory map The LPC2141/42/44/46/48 memory map incorporates several distinct regions, as shown in Figure 5. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either flash memory (the default) or on-chip static RAM. This is described in Section 6.19 “System control”. Fig 5. LPC2141/42/44/46/48 memory map AHB PERIPHERALS VPB PERIPHERALS RESERVED ADDRESS SPACE BOOT BLOCK (12 kB REMAPPED FROM ON-CHIP FLASH MEMORY RESERVED ADDRESS SPACE 0xFFFF FFFF 0xF000 0000 0xE000 0000 0xC000 0000 0x8000 0000 0x7FFF FFFF 0x7FD0 2000 TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY (LPC2148) 0x0004 0000 0x0007 FFFF TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY (LPC2146) 0x0002 0000 0x0003 FFFF TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY (LPC2144) 0x0001 0000 0x0001 FFFF TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY (LPC2142) 0x0000 8000 0x0000 FFFF TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY (LPC2141) 0x0000 0000 0x0000 7FFF RESERVED ADDRESS SPACE 0x0008 0000 0x3FFF FFFF 8 kB ON-CHIP STATIC RAM (LPC2141) 0x4000 0000 0x4000 1FFF 16 kB ON-CHIP STATIC RAM (LPC2142/2144) 0x4000 2000 0x4000 3FFF 32 kB ON-CHIP STATIC RAM (LPC2146/2148) 0x4000 4000 0x4000 7FFF RESERVED ADDRESS SPACE 0x4000 8000 0x7FCF FFFF 8 kB ON-CHIP USB DMA RAM (LPC2146/2148) 0x7FD0 0000 0x7FD0 1FFF 0x7FFF D000 0x7FFF CFFF 4.0 GB 3.75 GB 3.5 GB 3.0 GB 2.0 GB 1.0 GB 0.0 GB 002aab558 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 15 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.5 Interrupt controller The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt ReQuest (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine does not need to branch into the interrupt service routine but can run from the interrupt vector location. If more than one request is assigned to the FIQ class, the FIQ service routine will read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest. Non-vectored IRQs have the lowest priority. The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored IRQs. The default routine can read another VIC register to see what IRQs are active. 6.5.1 Interrupt sources Each peripheral device has one interrupt line connected to the Vectored Interrupt Controller, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source. 6.6 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. The Pin Control Module with its pin select registers defines the functionality of the microcontroller in a given hardware environment. After reset all pins of Port 0 and Port 1 are configured as input with the following exceptions: If debug is enabled, the JTAG pins will assume their JTAG functionality; if trace is enabled, the Trace pins will assume their trace functionality. The pins associated with the I2C0 and I2C1 interface are open drain. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 16 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.7 Fast general purpose parallel I/O (GPIO) Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins. LPC2141/42/44/46/48 introduce accelerated GPIO functions over prior LPC2000 devices: • GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte addressable. • Entire port value can be written in one instruction. 6.7.1 Features • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • Direction control of individual bits. • Separate control of output set and clear. • All I/O default to inputs after reset. 6.8 10-bit ADC The LPC2141/42 contain one and the LPC2144/46/48 contain two analog to digital converters. These converters are single 10-bit successive approximation analog to digital converters. While ADC0 has six channels, ADC1 has eight channels. Therefore, total number of available ADC inputs for LPC2141/42 is 6 and for LPC2144/46/48 is 14. 6.8.1 Features • 10 bit successive approximation analog to digital converter. • Measurement range of 0 V to VREF (2.5 V  VREF  VDDA). • Each converter capable of performing more than 400000 10-bit samples per second. • Every analog input has a dedicated result register to reduce interrupt overhead. • Burst conversion mode for single or multiple inputs. • Optional conversion on transition on input pin or timer match signal. • Global Start command for both converters (LPC2142/44/46/48 only). 6.9 10-bit DAC The DAC enables the LPC2141/42/44/46/48 to generate a variable analog output. The maximum DAC output voltage is the VREF voltage. 6.9.1 Features • 10-bit DAC. • Buffered output. • Power-down mode available. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 17 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers • Selectable speed versus power. 6.10 USB 2.0 device controller The USB is a 4-wire serial bus that supports communication between a host and a number (127 max) of peripherals. The host controller allocates the USB bandwidth to attached devices through a token based protocol. The bus supports hot plugging, unplugging, and dynamic configuration of the devices. All transactions are initiated by the host controller. The LPC2141/42/44/46/48 is equipped with a USB device controller that enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory and DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. A DMA controller (available in LPC2146/48 only) can transfer data between an endpoint buffer and the USB RAM. 6.10.1 Features • Fully compliant with USB 2.0 Full-speed specification. • Supports 32 physical (16 logical) endpoints. • Supports control, bulk, interrupt and isochronous endpoints. • Scalable realization of endpoints at run time. • Endpoint maximum packet size selection (up to USB maximum specification) by software at run time. • RAM message buffer size based on endpoint realization and maximum packet size. • Supports SoftConnect and GoodLink LED indicator. These two functions are sharing one pin. • Supports bus-powered capability with low suspend current. • Supports DMA transfer on all non-control endpoints (LPC2146/48 only). • One duplex DMA channel serves all endpoints (LPC2146/48 only). • Allows dynamic switching between CPU controlled and DMA modes (only in LPC2146/48). • Double buffer implementation for bulk and isochronous endpoints. 6.11 UARTs The LPC2141/42/44/46/48 each contain two UARTs. In addition to standard transmit and receive data lines, the LPC2144/46/48 UART1 also provides a full modem control handshake interface. Compared to previous LPC2000 microcontrollers, UARTs in LPC2141/42/44/46/48 introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers to achieve standard baud rates such as 115200 with any crystal frequency above 2 MHz. In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware (UART1 in LPC2144/46/48 only). LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 18 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.11.1 Features • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Transmission FIFO control enables implementation of software (XON/XOFF) flow control on both UARTs. • LPC2144/46/48 UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). 6.12 I2C-bus serial I/O controller The LPC2141/42/44/46/48 each contain two I2C-bus controllers. The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line (SCL), and a Serial DAta line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the capability to both receive and send information (such as memory)). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2141/42/44/46/48 supports bit rates up to 400 kbit/s (Fast I2C-bus). 6.12.1 Features • Compliant with standard I2C-bus interface. • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. 6.13 SPI serial I/O controller The LPC2141/42/44/46/48 each contain one SPI controller. The SPI is a full duplex serial interface, designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 19 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.13.1 Features • Compliant with SPI specification. • Synchronous, Serial, Full Duplex, Communication. • Combined SPI master and slave. • Maximum data bit rate of one eighth of the input clock rate. 6.14 SSP serial I/O controller The LPC2141/42/44/46/48 each contain one Serial Synchronous Port controller (SSP). The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. However, only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with data frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. Often only one of these data flows carries meaningful data. 6.14.1 Features • Compatible with Motorola’s SPI, TI’s 4-wire SSI and National Semiconductor’s Microwire buses. • Synchronous serial communication. • Master or slave operation. • 8-frame FIFOs for both transmit and receive. • Four bits to 16 bits per frame. 6.15 General purpose timers/external event counters The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an externally supplied clock and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. Multiple pins can be selected to perform a single capture or match function, providing an application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them. The LPC2141/42/44/46/48 can count external events on one of the capture inputs if the minimum external pulse is equal or longer than a period of the PCLK. In this configuration, unused capture lines can be selected as regular timer capture inputs, or used as external interrupts. 6.15.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • External event counter or timer operation. • Four 32-bit capture channels per timer/counter that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 20 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Four external outputs per timer/counter corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 6.16 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 6.16.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 32-bit timer with internal pre-scaler. • Selectable time period from (Tcy(PCLK)  256  4) to (Tcy(PCLK)  232  4) in multiples of Tcy(PCLK)  4. 6.17 Real-time clock The RTC is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode). 6.17.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra-low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the external crystal/oscillator input at XTAL1. Programmable reference clock divider allows fine adjustment of the RTC. • Dedicated power supply pin can be connected to a battery or the main 3.3 V. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 21 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.18 Pulse width modulator The PWM is based on the standard timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2141/42/44/46/48. The timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is also based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 6.18.1 Features • Seven match registers allow up to six single edge controlled or three double edge controlled PWM outputs, or a mix of both types. • The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 22 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 6.19 System control 6.19.1 Crystal oscillator On-chip integrated oscillator operates with external crystal in range of 1 MHz to 25 MHz. The oscillator output frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same value unless the PLL is running and connected. Refer to Section 6.19.2 “PLL” for additional information. 6.19.2 PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The PLL settling time is 100 s. 6.19.3 Reset and wake-up timer Reset has two sources on the LPC2141/42/44/46/48: the RESET pin and watchdog reset. The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip flash controller has completed its initialization. When the internal reset is removed, the processor begins executing at address 0, which is the reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values. The Wake-up Timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power on, all types of reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 23 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 6.19.4 Brownout detector The LPC2141/42/44/46/48 include 2-stage monitoring of the voltage on the VDD pins. If this voltage falls below 2.9 V, the BOD asserts an interrupt signal to the VIC. This signal can be enabled for interrupt; if not, software can monitor the signal by reading dedicated register. The second stage of low voltage detection asserts reset to inactivate the LPC2141/42/44/46/48 when the voltage on the VDD pins falls below 2.6 V. This reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the POR circuitry maintains the overall reset. Both the 2.9 V and 2.6 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.9 V detection to reliably interrupt, or a regularly-executed event loop to sense the condition. 6.19.5 Code security This feature of the LPC2141/42/44/46/48 allow an application to control whether it can be debugged or protected from observation. If after reset on-chip boot loader detects a valid checksum in flash and reads 0x8765 4321 from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be protected from observation. Once debugging is disabled, it can be enabled only by performing a full chip erase using the ISP. 6.19.6 External interrupt inputs The LPC2141/42/44/46/48 include up to nine edge or level sensitive External Interrupt Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake-up the processor from Power-down mode. Additionally capture input pins can also be used as external interrupts without the option to wake the device up from Power-down mode. 6.19.7 Memory mapping control The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip flash memory, or to the on-chip static RAM. This allows code running in different memory spaces to have control of the interrupts. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 24 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.19.8 Power control The LPC2141/42/44/46/48 supports two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses. In Power-down mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero. Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip RTC will enable the microcontroller to have the RTC active during Power-down mode. Power-down current is increased with RTC active. However, it is significantly lower than in Idle mode. A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings during active and Idle mode. 6.19.9 APB bus The APB divider determines the relationship between the processor clock (CCLK) and the clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first is to provide peripherals with the desired PCLK via APB bus so that they can operate at the speed chosen for the ARM processor. In order to achieve this, the APB bus may be slowed down to 12 to 14 of the processor clock rate. Because the APB bus must work properly at power-up (and its timing cannot be altered if it does not work since the APB divider control registers reside on the APB bus), the default condition at reset is for the APB bus to run at 14 of the processor clock rate. The second purpose of the APB divider is to allow power savings when an application does not require any peripherals to run at the full processor rate. Because the APB divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode. 6.20 Emulation and debugging The LPC2141/42/44/46/48 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself. 6.20.1 EmbeddedICE Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote debug protocol commands to the JTAG data needed to access the ARM core. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 25 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic. This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to operate. 6.20.2 Embedded trace Since the LPC2141/42/44/46/48 have significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction. 6.20.3 RealMonitor RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC, which is present in the EmbeddedICE logic. The LPC2141/42/44/46/48 contain a specific configuration of RealMonitor software programmed into the on-chip flash memory. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 26 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 7. Limiting values [1] The following applies to the Limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] Not to exceed 4.6 V. [4] The peak current is limited to 25 times the corresponding maximum current. [5] Dependent on package type. [6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) 0.5 +3.6 V VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V Vi(VREF) input voltage on pin VREF 0.5 +4.6 V VIA analog input voltage on ADC related pins 0.5 +5.1 V VI input voltage 5 V tolerant I/O pins; only valid when the VDD supply voltage is present [2] 0.5 +6.0 V other I/O pins [2][3] 0.5 VDD + 0.5 V IDD supply current per supply pin [4] - 100 mA ISS ground current per ground pin [4] - 100 mA Isink sink current for I2C-bus; DC; T = 85 C - 20 mA Tstg storage temperature [5] 65 +150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W Vesd electrostatic discharge voltage human body model [6] all pins 4000 +4000 V LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 27 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 8. Static characteristics Table 5. Static characteristics Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD supply voltage [2] 3.0 3.3 3.6 V VDDA analog supply voltage 3.3 V pad 3.0 3.3 3.6 V Vi(VBAT) input voltage on pin VBAT [3] 2.0 3.3 3.6 V Vi(VREF) input voltage on pin VREF 2.5 3.3 VDDA V Standard port pins, RESET, P1.26/RTCK IIL LOW-level input current VI = 0 V; no pull-up - - 3 A IIH HIGH-level input current VI = VDD; no pull-down - - 3 A IOZ OFF-state output current VO = 0 V; VO = VDD; no pull-up/down --3 A Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD); Tj < 125 C - - 100 mA VI input voltage pin configured to provide a digital function [4][5][6] [7] 0- 5.5 V VO output voltage output active 0 - VDD V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage IOH = 4 mA [8] VDD  0.4 - - V VOL LOW-level output voltage IOL = 4 mA [8] --0.4 V IOH HIGH-level output current VOH = VDD  0.4 V [8] 4 - - mA IOL LOW-level output current VOL = 0.4 V [8] 4- - mA IOHS HIGH-level short-circuit output current VOH =0V [9] - - 45 mA IOLS LOW-level short-circuit output current VOL = VDDA [9] --50 mA Ipd pull-down current VI =5V [10] 10 50 150 A Ipu pull-up current VI =0V [11] 15 50 85 A VDD < VI <5V [10] 000 A LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 28 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers IDD(act) active mode supply current VDD = 3.3 V; Tamb = 25 C; code while(1){} executed from flash, no active peripherals CCLK = 10 MHz - 15 50 mA CCLK = 60 MHz - 40 70 mA VDD = 3.3 V; Tamb = 25 C; code executed from flash; USB enabled and active; all other peripherals disabled CCLK = 12 MHz - 27 70 mA CCLK = 60 MHz - 57 90 mA IDD(pd) Power-down mode supply current VDD = 3.3 V; Tamb = 25 C - 40 100 A VDD = 3.3 V; Tamb = 85 C -250 500 A IBATpd Power-down mode battery supply current RTC clock = 32 kHz (from RTCXn pins); Tamb = 25 C VDD = 3.0 V; Vi(VBAT) = 2.5 V [12] - 15 30 A VDD = 3.0 V; Vi(VBAT) = 3.0 V - 20 40 A IBATact active mode battery supply current CCLK = 60 MHz; PCLK = 15 MHz; PCLK enabled to RTCK; RTC clock = 32 kHz (from RTCXn pins); Tamb = 25 C VDD = 3.0 V; Vi(VBAT) = 3.0 V [12] - 78 - A IBATact(opt) optimized active mode battery supply current PCLK disabled to RTCK in the PCONP register; RTC clock = 32 kHz (from RTCXn pins); Tamb = 25 C; Vi(VBAT) = 3.3 V CCLK = 25 MHz [12][13] - 23 - A CCLK = 60 MHz - 30 - A I 2C-bus pins VIH HIGH-level input voltage 0.7VDD --V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.05VDD - V VOL LOW-level output voltage IOLS = 3 mA [8] --0.4 V ILI input leakage current VI = VDD [14] - 24 A VI = 5 V - 10 22 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 1.8 1.95 V Table 5. Static characteristics …continued Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 29 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Core and external rail. [3] The RTC typically fails when Vi(VBAT) drops below 1.6 V. [4] Including voltage on outputs in 3-state mode. [5] VDD supply voltages must be present. [6] 3-state outputs go into 3-state mode when VDD is grounded. [7] Please also see the errata note mentioned in errata sheet. [8] Accounts for 100 mV voltage drop in all supply lines. [9] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [10] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. [11] Applies to P1.16 to P1.31. [12] On pin VBAT. [13] Optimized for low battery consumption. [14] To VSS. [15] Includes external resistors of 33  ± 1 % on D+ and D. Vo(XTAL2) output voltage on pin XTAL2 0.5 1.8 1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 1.8 1.95 V Vo(RTCX2) output voltage on pin RTCX2 0.5 1.8 1.95 V USB pins IOZ OFF-state output current 0V 85 C [12] 15 50 100 A VDD(3V3) < VI <5V [11] 00 0 A I 2C-bus pins (P0[27] and P0[28]) VIH HIGH-level input voltage 0.7VDD(3V3) - -V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage - 0.05VDD(3V3) - V VOL LOW-level output voltage IOLS = 3 mA [9] -- 0.4 V ILI input leakage current VI = VDD(3V3) [13] -2 4 A VI = 5 V - 10 22 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 1.8 1.95 V Vo(XTAL2) output voltage on pin XTAL2 0.5 1.8 1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 1.8 1.95 V Vo(RTCX2) output voltage on pin RTCX2 0.5 1.8 1.95 V Table 8. Static characteristics …continued Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 43 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] The RTC typically fails when Vi(VBAT) drops below 1.6 V. [3] VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb = 25 C. [4] On pin VBAT. [5] Including voltage on outputs in 3-state mode. [6] VDD(3V3) supply voltages must be present. [7] 3-state outputs go into 3-state mode when VDD(3V3) is grounded. [8] Please also see the errata note in errata sheet. [9] Accounts for 100 mV voltage drop in all supply lines. [10] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [11] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. [12] LPC2364HBD only. [13] To VSS. [14] Includes external resistors of 33   1 % on D+ and D. USB pins (LPC2364/66/68 only) IOZ OFF-state output current 0V 85 C [3] 1 -60 MHz IRC; 40 C to +85 C 3.96 4 4.04 MHz IRC; > 85 C [3] 3.98 4.02 4.06 MHz External clock fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk)  0.4 - - ns tCLCX clock LOW time Tcy(clk)  0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns I 2C-bus pins (P0[27] and P0[28]) tf(o) output fall time VIH to VIL 20 + 0.1  Cb [4] - - ns SSP interface tsu(SPI_MISO) SPI_MISO set-up time Tamb = 25 C; measured in SPI Master mode; see Figure 15 - 11- ns Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) tCHCL tCLCX tCHCX Tcy(clk) tCLCH 002aaa907 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 49 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 11.1 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 11.2 I/O pins [1] Applies to standard I/O pins and RESET pin. 11.3 USB interface [1] Characterized but not implemented as production test. Guaranteed by design. Table 10. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 3.0 V  VDD(3V3)  3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz fi(RTC) RTC input frequency - - 32.768 - kHz Table 11. Dynamic characteristic: I/O pins[1] Tamb = 40 C to +85 C; VDD(3V3) over specified ranges. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns Table 12. Dynamic characteristics of USB pins (full-speed) (LPC2364/66/68 only) CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3), unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr / tf - -109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 14 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 14 2 - +5 ns tJR1 receiver jitter to next transition 18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns tEOPR1 EOP width at receiver must reject as EOP; see Figure 14 [1] 40 - - ns tEOPR2 EOP width at receiver must accept as EOP; see Figure 14 [1] 82 - - ns LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 50 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 11.4 Flash memory [1] Number of program/erase cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes. Table 13. Dynamic characteristics of flash Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified; VDD(3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance [1] 10000 100000 - cycles tret retention time powered; 100 cycles 10 - - years unpowered;  100 cycles 20 - - years ter erase time sector or multiple consecutive sectors 95 100 105 ms tprog programming time [2] 0.95 1 1.05 ms LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 51 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 11.5 Timing Fig 14. Differential data-to-EOP transition skew and EOP width 002aab561 TPERIOD differential data lines crossover point source EOP width: tFEOPT receiver EOP width: tEOPR1, tEOPR2 crossover point extended differential data to SE0/EOP skew n × TPERIOD + tFDEOP Fig 15. MISO line set-up time in SSP Master mode tsu(SPI_MISO) SCK shifting edges MOSI MISO 002aad326 sampling edges LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 52 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 12. ADC electrical characteristics [1] Conditions: VSSA = 0 V, VDDA = 3.3 V. [2] The ADC is monotonic, there are no missing codes. [3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 16. [4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 16. [5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 16. [6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 16. [7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 16. [8] See Figure 17. Table 14. ADC characteristics VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C, unless otherwise specified; ADC frequency 4.5 MHz. Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA V Cia analog input capacitance - - 1 pF ED differential linearity error [1][2][3] - - 1 LSB EL(adj) integral non-linearity [1][4] - - 2 LSB EO offset error [1][5] - - 3 LSB EG gain error [1][6] - - 0.5 % ET absolute error [1][7] - - 4 LSB Rvsi voltage source interface resistance [8] --40 k LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 53 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 16. ADC characteristics 1023 1022 1021 1020 1019 (2) (1) 123456 7 1018 1019 1020 1021 1022 1023 1024 7 6 5 4 3 2 1 0 1018 (5) (4) (3) 1 LSB (ideal) code out offset error EO gain error EG offset error EO VIA (LSBideal) 002aae604 Vi(VREF) − VSSA 1024 1 LSB = LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 54 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Fig 17. Suggested ADC interface - LPC2364/65/66/67/68 AD0[y] pin LPC23XX AD0[y]SAMPLE AD0[y] 20 kΩ 3 pF 5 pF Rvsi VSS VEXT 002aac610 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 55 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 13. DAC electrical characteristics 14. Application information 14.1 Suggested USB interface solutions (LPC2364/66/68 only) Table 15. DAC electrical characteristics VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ED differential linearity error - 1 - LSB EL(adj) integral non-linearity - 1.5 - LSB EO offset error - 0.6 - % EG gain error - 0.6 - % CL load capacitance - 200 - pF RL load resistance 1 - - k Fig 18. LPC2364/66/68 USB interface on a self-powered device LPC23XX USB-B connector USB_D+ USB_CONNECT SoftConnect switch USB_D− VBUS VSS VDD(3V3) R1 1.5 kΩ RS = 33 Ω 002aac578 RS = 33 Ω USB_UP_LED LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 56 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.2 Crystal oscillator XTAL input and component selection The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In slave mode, a minimum of 200 mV (RMS) is needed. In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 20), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTAL2 pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 21 and in Table 16 and Table 17. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and RS). Capacitance CP in Figure 21 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer. Fig 19. LPC2364/66/68 USB interface on a bus-powered device LPC23XX VDD(3V3) R1 1.5 kΩ R2 USB_UP_LED 002aac579 USB-B connector USB_D+ USB_D− VBUS VSS RS = 33 Ω RS = 33 Ω Fig 20. Slave mode operation of the on-chip oscillator LPC2xxx XTAL1 Ci 100 pF Cg 002aae718 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 57 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Fig 21. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 16. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1/CX2 1 MHz to 5 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 300  39 pF, 39 pF 30 pF < 300  57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 200  39 pF, 39 pF 30 pF < 100  57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 60  39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80  18 pF, 18 pF Table 17. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF 20 pF < 100  39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 80  39 pF, 39 pF 002aag469 LPC2xxx XTAL1 XTAL2 CX1 CX2 XTAL = CL CP RS L LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 58 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.3 RTC 32 kHz oscillator component selection The RTC external oscillator circuit is shown in Figure 22. Since the feedback resistance is integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected externally to the microcontroller. Table 18 gives the crystal parameters that should be used. CL is the typical load capacitance of the crystal and is usually specified by the crystal manufacturer. The actual CL influences oscillation frequency. When using a crystal that is manufactured for a different load capacitance, the circuit will oscillate at a slightly different frequency (depending on the quality of the crystal) compared to the specified one. Therefore for an accurate time reference it is advised to use the load capacitors as specified in Table 18 that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in this table are calculated from the internal parasitic capacitances and the CL. Parasitics from PCB and package are not taken into account. 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. Fig 22. RTC oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 18. Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1/CX2 11 pF < 100 k 18 pF, 18 pF 13 pF < 100 k 22 pF, 22 pF 15 pF < 100 k 27 pF, 27 pF 002aaf495 LPC2xxx RTCX1 RTCX2 CX1 CX2 32 kHz XTAL = CL CP RS L LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 59 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.5 Standard I/O pin configuration Figure 23 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Analog input (for ADC input channels) The default configuration for standard I/O pins is input with pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. Fig 23. Standard I/O pin configuration with analog input PIN VDD ESD VSS ESD VDD weak pull-up weak pull-down output enable output pull-up enable pull-down enable data input analog input select analog input 002aaf496 pin configured as digital output driver pin configured as digital input pin configured as analog input LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 60 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.6 Reset pin configuration Fig 24. Reset pin configuration VSS reset 002aaf274 VDD VDD VDD Rpu ESD ESD 20 ns RC GLITCH FILTER PIN LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 61 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 15. Package outline Fig 25. Package outline SOT407-1 (LQFP100) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp ywv Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 0.5 16.25 15.75 1.15 0.85 7 0 o 1 0.2 0.08 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT407-1 136E20 MS-026 00-02-01 03-02-20 D(1) (1)(1) 14.1 13.9 HD 16.25 15.75 Z E 1.15 0.85 D bp e θ E A1 A Lp detail X L (A ) 3 B 25 c DH bp EH A2 v M B D ZD A ZE e v M A X 1 100 76 75 51 50 26 y pin 1 index w M w M 0 5 10 mm scale LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 62 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Fig 26. Package outline SOT926-1 (TFBGA100) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT926-1 - - - - - - - - - SOT926-1 05-12-09 05-12-22 UNIT A max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 A1 DIMENSIONS (mm are the original dimensions) TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm A2 b D E e2 7.2 e 0.8 e1 7.2 v 0.15 w 0.05 y 0.08 y1 0.1 0 2.5 5 mm scale b e2 e1 e e 1/2 e 1/2 e ∅ v M AC B ∅ w M C ball A1 index area A B C D E F H K G J 13579 2 4 6 8 10 ball A1 index area B A E D C y1 C y X detail X A A1 A2 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 63 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 16. Abbreviations Table 19. Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus AMBA Advanced Microcontroller Bus Architecture APB Advanced Peripheral Bus BOD BrownOut Detection CAN Controller Area Network DAC Digital-to-Analog Converter DCC Debug Communication Channel DMA Direct Memory Access DSP Digital Signal Processing EOP End Of Packet ETM Embedded Trace Macrocell GPIO General Purpose Input/Output IrDA Infrared Data Association JTAG Joint Test Action Group MII Media Independent Interface MIIM Media Independent Interface Management PHY Physical Layer PLL Phase-Locked Loop PWM Pulse Width Modulator RMII Reduced Media Independent Interface SE0 Single Ended Zero SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TTL Transistor-Transistor Logic UART Universal Asynchronous Receiver/Transmitter USB Universal Serial Bus LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 64 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 17. Revision history Table 20. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC2364_65_66_67_68 v.7.1 20131016 Product data sheet - LPC2364_65_66_67_68 v.7 Modifications: • Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns. • Table 9 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40. LPC2364_65_66_67_68 v.7 20111020 Product data sheet - LPC2364_65_66_67_68 v.6 Modifications: • Table 13 “Dynamic characteristics of flash”: Added characteristics for ter and tprog. • Table 4 “Pin description”: Updated description for USB_UP_LED. • Table 4 “Pin description”: Added Table note 12 “If the RTC is not used, these pins can be left floating.” for RTCX1 and RTCX2 pins. • Table 4 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.” for DBGEN, TMS, TDI, TRST, and RTCK pins. • Table 4 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no built-in pull-down resistor.” for TCK and TDO pins. • Table 5 “Limiting values”: Added “non-operating” to conditions column of Tstg. • Table 5 “Limiting values”: Updated Table note 5 “The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.”. • Table 5 “Limiting values”: Updated storage temperature min/max to 65/+150. • Added Table 7 “Thermal resistance value (C/W): ±15 %”. • Added Table 10 “Dynamic characteristic: internal oscillators”. • Added Table 11 “Dynamic characteristic: I/O pins[1]”. • Table 8 “Static characteristics”: Changed Vhys typ value from 0.5VDD(3V3) to 0.05VDD(3V3). • Table 13 “Dynamic characteristics of flash”: Updated table. • Added Section 9 “Thermal characteristics”. • Added Section 10.3 “Electrical pin characteristics”. • Added Section 14.2 “Crystal oscillator XTAL input and component selection”. • Added Section 14.3 “RTC 32 kHz oscillator component selection”. • Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”. • Added Section 14.5 “Standard I/O pin configuration”. • Added Section 14.6 “Reset pin configuration”. LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 65 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers LPC2364_65_66_67_68 v.6 20100201 Product data sheet - LPC2364_65_66_67_68 v.5 Modifications: • Table 5 “Limiting values”: Changed VESD min/max to 2500/+2500. • Table 6: Updated min, typical and max values for oscillator pins. • Table 6: Updated conditions and typical values for IDD(DCDC)pd(3V3), IBATact; IDD(DCDC)dpd(3V3) and IBAT added. • Table 9 “Dynamic characteristics of flash”: Changed flash endurance spec from 100000 to 10000 minimum cycles. • Added Table 11 “DAC electrical characteristics”. • Section 7.2 “On-chip flash programming memory”: Removed text regarding flash endurance minimum specs. • Added Section 7.24.4.4 “Deep power-down mode”. • Section 7.25.2 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3). • Added Section 9.2 “Deep power-down mode”. • Added Section 13.2 “XTAL1 input”. • Added Section 13.3 “XTAL and RTC Printed-Circuit Board (PCB) layout guidelines”. • Added table note for XTAL1 and XTAL2 pins in Table 3. LPC2364_65_66_67_68 v.5 20090409 Product data sheet - LPC2364_65_66_67_68 v.4 Modifications: • Added part LPC2364HBD100. • Section 7.2: Added sentence clarifying SRAM speeds for LPC2364HBD. • Table 5: Updated Vesd min/max. • Table 6: Updated ZDRV Table note [14]. • Table 6: Vhys, moved 0.4 from typ to min column. • Table 6: Ipu, added specs for >85 C. • Table 6: Removed Rpu. • Table 7: CCLK and IRC, added specs for >85 C. • Added Table 9. • Updated Figure 14. • Updated Figure 11. LPC2364_65_66_67_68 v.4 20080417 Product data sheet - LPC2364_66_68 v.3 LPC2364_66_68 v.3 20071220 Product data sheet - LPC2364_66_68 v.2 LPC2364_66_68 v.2 20071001 Preliminary data sheet - LPC2364_66_68 v.1 LPC2364_66_68 v.1 20070103 Preliminary data sheet - - Table 20. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 66 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 18. Legal information 18.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 67 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I 2C-bus — logo is a trademark of NXP B.V. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 68 of 69 continued >> NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Functional description . . . . . . . . . . . . . . . . . . 18 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 18 7.2 On-chip flash programming memory . . . . . . . 19 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 19 7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 20 7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 21 7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 21 7.7 General purpose DMA controller . . . . . . . . . . 21 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.8 Fast general purpose parallel I/O . . . . . . . . . . 22 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.9 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.10 USB interface (LPC2364/66/68 only) . . . . . . . 24 7.10.1 USB device controller . . . . . . . . . . . . . . . . . . . 24 7.10.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.11 CAN controller and acceptance filters (LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 25 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.12 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.13 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.14 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.15 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 26 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.16 SSP serial I/O controller . . . . . . . . . . . . . . . . . 27 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.17 SD/MMC card interface (LPC2367/68 only) . . 27 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.18 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 27 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.19 I2S-bus serial I/O controllers. . . . . . . . . . . . . . 28 7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.20 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 29 7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.21 Pulse width modulator . . . . . . . . . . . . . . . . . . 29 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.22 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 30 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.23 RTC and battery RAM . . . . . . . . . . . . . . . . . . 31 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.24 Clocking and power control . . . . . . . . . . . . . . 31 7.24.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 31 7.24.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 32 7.24.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.24.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.24.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.24.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 34 7.24.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 34 7.24.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 34 7.25 System control . . . . . . . . . . . . . . . . . . . . . . . . 35 7.25.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.25.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 35 7.25.3 Code security (Code Read Protection - CRP) . . . . . . . . . . . 36 7.25.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.25.5 External interrupt inputs . . . . . . . . . . . . . . . . . 36 7.25.6 Memory mapping control . . . . . . . . . . . . . . . . 37 7.26 Emulation and debugging . . . . . . . . . . . . . . . 37 7.26.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 37 7.26.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 37 7.26.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 39 9 Thermal characteristics . . . . . . . . . . . . . . . . . 40 10 Static characteristics . . . . . . . . . . . . . . . . . . . 41 10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 44 10.2 Deep power-down mode . . . . . . . . . . . . . . . . 45 10.3 Electrical pin characteristics. . . . . . . . . . . . . . 47 11 Dynamic characteristics. . . . . . . . . . . . . . . . . 48 11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 49 11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 49 11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 50 11.5 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 12 ADC electrical characteristics . . . . . . . . . . . . 52 13 DAC electrical characteristics . . . . . . . . . . . . 55 14 Application information . . . . . . . . . . . . . . . . . 55 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 October 2013 Document identifier: LPC2364_65_66_67_68 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14.1 Suggested USB interface solutions (LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 55 14.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 14.3 RTC 32 kHz oscillator component selection. . 58 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . 58 14.5 Standard I/O pin configuration . . . . . . . . . . . . 59 14.6 Reset pin configuration. . . . . . . . . . . . . . . . . . 60 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 61 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 63 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 64 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 66 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 66 18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 67 19 Contact information. . . . . . . . . . . . . . . . . . . . . 67 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 ©2002 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.1 Features • 5V ±1% Reference • Oscillator Sync Terminal • Internal Soft Start • Deadtime Control • Under Voltage Lockout Description The KA3525A is a monolithic integrated circuit that includes all of the control circuits necessary for a pulse width modulating regulator. There are a voltage reference, an error amplifier, a pulse width modulator, an oscillator, an under voltage lockout, a soft start circuit, and the output driver in the chip. 16-DIP 1 Internal Block Diagram 16 15 12 1 2 9 8 10 5 7 3 6 4 14 11 13 U.V.L.O. BAND GAP REF 5V LATCH S R F/F Q Q 5K VC OUTPUT A OUTPUT B OSCILLATOR DISCHARGE 5K ERR AMP PWM COMP _ + _ + CT VREF VCC GND EA(-) EA(+) EAOUT C (SOFT START) SHUT DOWN SYNC RT OSC OUTPUT KA3525A SMPS Controller KA3525A 2 Absolute Maximum Ratings Electrical Characteristics (VCC = 20V, TA = 0 to +70°C, unless otherwise specified) Parameter Symbol Value Unit Supply Voltage VCC 40 V Collector Supply Voltage VC 40 V Output Current, Sink or Source IO 500 mA Reference Output Current IREF 50 mA Oscillator Charging Current ICHG(OSC) 5 mA Power Dissipation (TA = 25°C) PD 1000 m/W Operating Temperature TOPR 0 ~ +70 °C Storage Temperature TSTG -65 ~ +150 °C Lead Temperature (Soldering, 10sec) TLEAD +300 °C Parameter Symbol Conditions Min. Typ. Max. Unit REFERENCE SECTION Reference Output Voltage VREF TJ = 25°C 5.0 5.1 5.2 V Line Regulation ∆VREF VCC = 8 to 35V - 9 20 mV Load Regulation ∆VREF IREF = 0 to 20mA - 20 50 mV Short Circuit Output Current ISC VREF = 0, TJ = 25°C - 80 100 mA Total Output Variation (Note1) ∆VREF Line, Load and Temperature 4.95 - 5.25 V Temperature Stability (Note1) STT - - 20 50 mV Long Term Stability (Note1) ST TJ = 125°C ,1KHRS - 20 50 mV OSCILLATOR SECTION Initial Accuracy (Note1, 2) ACCUR TJ = 25°C - ±3 ±6 % Frequency Change With Voltage ∆f/∆VCC VCC = 8 to 35V (Note1, 2) - ±0.8 ±2 % Maximum Frequency f(MAX) RT = 2kΩ, CT = 470pF 400 430 - kHz Minimum Frequency f(MIN) RT = 200kΩ, CT = 0.1uF - 60 120 Hz Clock Amplitude (Note1, 2) V(CLK) - 34- V Clock Width (Note1, 2) tW(CLK) TJ = 25°C 0.3 0.6 1 µs Sync Threshold VTH(SYNC) - 1.2 2 2.8 V Sync Input Current II(SYNC) Sync = 3.5V - 1.3 2.5 mA KA3525A 3 Electrical Characteristics (Continued) (VCC = 20V, TA = 0 to +70°C, unless otherwise specified) Note : 1. These parameters. although guaranteed over the recommended operating conditions, are not 100% tested in production 2. Tested at fOSC=40kHz (RT =3.6K, CT =0.01uF, RI = 0Ω) Parameter Symbol Conditions Min. Typ. Max. Unit ERROR AMPLIFIER SECTION (VCM = 5.1V) Input Offset Voltage VIO - - 1.5 10 mV Input Bias Current IBIAS - - 1 10 µA Input Offset Current IIO - - 0.1 1 µA Open Loop Voltage Gain GVO RL ≥ 10MΩ 60 80 - dB Common Mode Rejection Ratio CMRR VCM = 1.5 to 5.2V 60 90 - dB Power Supply Rejection Ratio PSRR VCC = 8 to 3.5V 50 60 - dB PWM COMPARATOR SECTION Minimum Duty Cycle D(MIN) - - - 0% Maximum Duty Cycle D(MAX) - 45 49 - % Input Threshold Voltage (Note2) VTH1 Zero Duty Cycle 0.7 0.9 - V Input Threshold Voltage (Note2) VTH2 Max Duty Cycle - 3.2 3.6 V SOFT-START SECTION Soft Start Current ISOFT VSD = 0V, VSS = 0V 25 51 80 µA Soft Start Low Level Voltage VSL VSD = 25V - 0.3 0.7 V Shutdown Threshold Voltage VTH(SD) - 0.9 1.3 1.7 V Shutdown Input Current IN(SD) VSD = 2.5V - 0.3 1 mA OUTPUT SECTION Low Output Voltage I VOL I ISINK = 20mA - 0.1 0.4 V Low Output Voltage II VOL II ISINK = 100mA - 0.05 2 V High Output Voltage I VCH I ISOURCE = 20mA 18 19 - V High Output Voltage II VCH II ISOURCE = 100mA 17 18 - V Under Voltage Lockout VUV V8 and V9 = High 6 7 8 V Collector Leakage Current ILKG VCC = 35V - 80 200 µA Rise Time (Note1) tR CL = 1uF, TJ = 25°C - 80 600 ns Fall Time (Note1) tF CL = 1uF, TJ = 25°C - 70 300 ns STANDBY CURRENT Supply Current ICC VCC = 35V - 12 20 mA KA3525A 4 Test Circuit 16 15 12 1 2 9 8 10 5 7 13 11 14 3 6 BAND GAP REF 5V U.V.L.O. A B 0.1 Vcc 0.1 3k RWM ADJ 10k 1.5K 10K 0.01 5.0uF 5.0k 5.0k 5.0k 100 F/F ERR AMP ERR AMP OSCILLATOR LATCH S S R SOFT START + SHUTDOWN VREF CT RAMP 0.009 0.1 + 3.6k 0.001 DEAD TIME OUT B 10k 10k OUT A VC CLOCK _ + + _ RT KA3525A 5 Mechanical Dimensions Package #1 #8 #9 #16 6.40 ±0.20 7.62 0.300 2.54 0.100 0.252 ±0.008 0~15° 0.25 +0.10 –0.05 0.010 +0.004 –0.002 3.30 ±0.30 0.130 ±0.012 3.25 ±0.20 0.128 ±0.008 19.40 ±0.20 0.764 ±0.008 19.80 0.780 MAX 5.08 0.200 0.38 0.014 MAX MIN 0.81 0.032 ( ) 0.46 ±0.10 0.018 ±0.004 0.059 ±0.004 1.50 ±0.10 16-DIP KA3525A 10/2/02 0.0m 001 Stock#DSxxxxxxxx  2002 Fairchild Semiconductor Corporation LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. Ordering Information Product Number Package Operating Temperature KA3525A 16-DIP 0 ~ +70°C ©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FPS Rev.1.0.6 TM is a trademark of Fairchild Semiconductor Corporation. Features • Internal Avalanche Rugged Sense FET • Advanced Burst-Mode operation consumes under 1 W at 240VAC & 0.5W load • Precision Fixed Operating Frequency (66kHz) • Internal Start-up Circuit • Improved Pulse by Pulse Current Limiting • Over Voltage Protection (OVP) • Over Load Protection (OLP) • Internal Thermal Shutdown Function (TSD) • Auto-Restart Mode • Under Voltage Lock Out (UVLO) with hysteresis • Low Operating Current (2.5mA) • Built-in Soft Start Application • SMPS for LCD monitor and STB • Adaptor Description The FSDM0565RB is an integrated Pulse Width Modulator (PWM) and Sense FET specifically designed for high performance offline Switch Mode Power Supplies (SMPS) with minimal external components. This device is an integrated high voltage power switching regulator which combine an avalanche rugged Sense FET with a current mode PWM control block. The PWM controller includes integrated fixed frequency oscillator, under voltage lockout, leading edge blanking (LEB), optimized gate driver, internal soft start, temperature compensated precise current sources for a loop compensation and self protection circuitry. Compared with discrete MOSFET and PWM controller solution, it can reduce total cost, component count, size and weight simultaneously increasing efficiency, productivity, and system reliability. This device is a basic platform well suited for cost effective designs of flyback converters. Table 1. Maximum Output Power Notes: 1. Typical continuous power in a non-ventilated enclosed adapter measured at 50°C ambient. 2. Maximum practical continuous power in an open frame design at 50°C ambient. 3. 230 VAC or 100/115 VAC with doubler. Typical Circuit Figure 1. Typical Flyback Application OUTPUT POWER TABLE PRODUCT 230VAC ±15%(3) 85-265VAC Adapter(1) Open Frame(2) Adapter(1) Open Frame(2) FSDM0565RB 60W 70W 50W 60W FSDM0565RBI 60W 70W 50W 60W FSDM07652RB 70W 80W 60W 70W Drain Source Vstr Vfb Vcc PWM AC IN DC OUT FSDM0565RB Green Mode Fairchild Power Switch (FPSTM) FSDM0565RB 2 Internal Block Diagram Figure 2. Functional Block Diagram of FSDM0565RB 8V/12V 3 1 2 4 5 Vref Internal Bias S Q Q R OSC Vcc Vref Idelay IFB VSD TSD Vovp Vcc VCL S Q Q R R 2.5R Vcc good Vcc Drain N.C FB GND Gate driver 6 Vstr Istart Vcc good 0.5/0.7V LEB PWM Soft start + - FSDM0565RB 3 Pin Definitions Pin Configuration Figure 3. Pin Configuration (Top View) Pin Number Pin Name Pin Function Description 1 Drain This pin is the high voltage power Sense FET drain. It is designed to drive the transformer directly. 2 GND This pin is the control ground and the Sense FET source. 3 Vcc This pin is the positive supply voltage input. During start up, the power is supplied by an internal high voltage current source that is connected to the Vstr pin. When Vcc reaches 12V, the internal high voltage current source is disabled and the power is supplied from the auxiliary transformer winding. 4 Vfb This pin is internally connected to the inverting input of the PWM comparator. The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor should be placed between this pin and GND. If the voltage of this pin reaches 6.0V, the over load protection is activated resulting in shutdown of the FPSTM. 5 N.C - 6 Vstr This pin is connected directly to the high voltage DC link. At startup, the internal high voltage current source supplies internal bias and charges the external capacitor that is connected to the Vcc pin. Once Vcc reaches 12V, the internal current source is disabled. 6.Vstr 5.N.C. 4.Vfb 3.Vcc 2.GND 1.Drain TO-220F-6L 6.Vstr 5.N.C. 4.Vfb 3.Vcc 2.GND 1.Drain I2-PAK-6L FSDM0565RB 4 Absolute Maximum Ratings (Ta=25°C, unless otherwise specified) Notes: 1. Repetitive rating: Pulse width limited by maximum junction temperature 2. L=14mH, starting Tj=25°C 3. L=13uH, starting Tj=25°C Thermal Impedance Notes: 1. Free standing with no heat-sink under natural convection. 2. Infinite cooling condition - Refer to the SEMI G30-88. Parameter Symbol Value Unit Drain-source voltage VDSS 650 V Vstr Max Voltage VSTR 650 V Pulsed Drain current (Tc=25°C)(1) IDM 11 ADC Continuous Drain Current(Tc=25°C) ID 2.8 A Continuous Drain Current(Tc=100°C) 1.7 A Single pulsed avalanche energy (2) EAS 190 mJ Single pulsed avalanche current (3) IAS - A Supply voltage VCC 20 V Input voltage range VFB -0.3 to VCC V Total power dissipation(Tc=25°C) PD(Watt H/S) 45 (TO-220-6L) W 75 (I2-PAK-6L) Operating junction temperature Tj Internally limited °C Operating ambient temperature TA -25 to +85 °C Storage temperature range TSTG -55 to +150 °C ESD Capability, HBM Model (All pins excepts for Vstr and Vfb) - 2.0 (GND-Vstr/Vfb=1.5kV) kV ESD Capability, Machine Model (All pins excepts for Vstr and Vfb) - 300 (GND-Vstr/Vfb=225V) V Parameter Symbol Package Value Unit Junction-to-Ambient Thermal θJA(1) TO-220F-6L 49.90 °C/W I2-PAK-6L 30 Junction-to-Case Thermal θJC(2) TO-220F-6L 2.78 °C/W I2-PAK-6L 1.67 FSDM0565RB 5 Electrical Characteristics (Ta = 25°C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit Sense FET SECTION Drain source breakdown voltage BVDSS VGS = 0V, ID = 250μA 650 - - V Zero gate voltage drain current IDSS VDS = 650V, VGS = 0V - - 500 μA VDS= 520V VGS = 0V, TC = 125°C - - 500 μA Static drain source on resistance (1) RDS(ON) VGS = 10V, ID = 2.5A - 1.76 2.2 Ω Output capacitance COSS VGS = 0V, VDS = 25V, f = 1MHz - 78 - pF Turn on delay time TD(ON) VDD= 325V, ID= 5A (MOSFET switching time is essentially independent of operating temperature) - 22 - ns Rise time TR - 52 - Turn off delay time TD(OFF) - 95 - Fall time TF - 50 - CONTROL SECTION Initial frequency FOSC VFB = 3V 60 66 72 kHz Voltage stability FSTABLE 13V ≤ Vcc ≤ 18V 0 1 3 % Temperature stability (2) ΔFOSC -25°C ≤ Ta ≤ 85°C 0 ±5 ±10 % Maximum duty cycle DMAX - 77 82 87 % Minimum duty cycle DMIN - - - 0% Start threshold voltage VSTART VFB=GND 11 12 13 V Stop threshold voltage VSTOP VFB=GND 7 8 9 V Feedback source current IFB VFB=GND 0.7 0.9 1.1 mA Soft-start time TS Vfb=3 - 10 15 ms Leading Edge Blanking time TLEB - - 250 - ns BURST MODE SECTION Burst Mode Voltages (2) VBURH Vcc=14V - 0.7 - V VBURL Vcc=14V - 0.5 - V PROTECTION SECTION Peak current limit (4) IOVER VFB=5V, VCC=14V 2.0 2.25 2.5 A Over voltage protection VOVP - 18 19 20 V Thermal shutdown temperature (2) TSD 130 145 160 °C Shutdown feedback voltage VSD VFB ≥ 5.5V 5.5 6.0 6.5 V Shutdown delay current IDELAY VFB=5V 2.8 3.5 4.2 μA FSDM0565RB 6 Notes: 1. Pulse test : Pulse width ≤ 300μS, duty ≤ 2% 2. These parameters, although guaranteed at the design, are not tested in mass production. 3. These parameters, although guaranteed, are tested in EDS(wafer test) process. 4. These parameters indicate the inductor current. 5. This parameter is the current flowing into the control IC. TOTAL DEVICE SECTION Operating supply current (5) IOP VFB=GND, VCC=14V IOP(MIN) VFB=GND, VCC=10V - 2.5 5 mA IOP(MAX) VFB=GND, VCC=18V FSDM0565RB 7 Comparison Between FS6M07652RTC and FSDM0565RB Function FS6M07652RTC FSDM0565RB FSDM0565RB Advantages Soft-Start Adjustable soft-start time using an external capacitor Internal soft-start with typically 10ms (fixed) • Gradually increasing current limit during soft-start further reduces peak current and voltage component stresses • Eliminates external components used for soft-start in most applications • Reduces or eliminates output overshoot Burst Mode Operation • Built into controller • Output voltage drops to around half • Built into controller • Output voltage fixed • Improve light load efficiency • Reduces no-load consumption FSDM0565RB 8 Typical Performance Characteristics (These Characteristic Graphs are Normalized at Ta= 25°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Operating Frequency (Fosc) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Start Thershold Voltage (Vstart) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Stop Threshold Voltage (Vstop) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Maximum Duty Cycle (Dmax) Operating Current vs. Temp Start Threshold Voltage vs. Temp Stop Threshold Voltage vs. Temp Operating Freqency vs. Temp Maximum Duty vs. Temp Feedback Source Current vs. Temp 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Operating Current (Iop) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) FB Source Current (Ifb) FSDM0565RB 9 Typical Performance Characteristics (Continued) (These Characteristic Graphs are Normalized at Ta= 25°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Shutdown Delay Current (Idelay) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Over Voltage Protection (Vovp) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -50 -25 0 25 50 75 100 125 Junction Temperature(℃) Peak Current Limit(Self protection) (Iover) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) FB Burst Mode Enable Voltage (Vfbe) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) FB Burst Mode Disable Voltage (Vfbd) ShutDown Feedback Voltage vs. Temp ShutDown Delay Current vs. Temp Over Voltage Protection vs. Temp Burst Mode Enable Voltage vs. Temp Burst Mode Disable Voltage vs. Temp Current Limit vs. Temp 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Shutdown FB Voltage (Vsd) FSDM0565RB 10 Typical Performance Characteristics (Continued) (These Characteristic Graphs are Normalized at Ta= 25°C) Soft Start Time vs. Temp 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -50 -25 0 25 50 75 100 125 Junction Temperature(℃) Soft Start Time (Normalized to 25℃) FSDM0565RB 11 Functional Description 1. Startup : In previous generations of Fairchild Power Switches (FPSTM) the Vcc pin had an external start-up resistor to the DC input voltage line. In this generation the startup resistor is replaced by an internal high voltage current source. At startup, an internal high voltage current source supplies the internal bias and charges the external capacitor (Cvcc) that is connected to the Vcc pin as illustrated in Figure 4. When Vcc reaches 12V, the FSDM0565RB begins switching and the internal high voltage current source is disabled. Then, the FSDM0565RB continues its normal switching operation and the power is supplied from the auxiliary transformer winding unless Vcc goes below the stop voltage of 8V. Figure 4. Internal startup circuit 2. Feedback Control : FSDM0565RB employs current mode control, as shown in Figure 5. An opto-coupler (such as the H11A817A) and shunt regulator (such as the KA431) are typically used to implement the feedback network. Comparing the feedback voltage with the voltage across the Rsense resistor plus an offset voltage makes it possible to control the switching duty cycle. When the reference pin voltage of the KA431 exceeds the internal reference voltage of 2.5V, the H11A817A LED current increases, thus pulling down the feedback voltage and reducing the duty cycle. This event typically happens when the input voltage is increased or the output load is decreased. 2.1 Pulse-by-pulse current limit: Because current mode control is employed, the peak current through the Sense FET is limited by the inverting input of PWM comparator (Vfb*) as shown in Figure 5. Assuming that the 0.9mA current source flows only through the internal resistor (2.5R +R= 2.8 kΩ), the cathode voltage of diode D2 is about 2.5V. Since D1 is blocked when the feedback voltage (Vfb) exceeds 2.5V, the maximum voltage of the cathode of D2 is clamped at this voltage, thus clamping Vfb*. Therefore, the peak value of the current through the Sense FET is limited. 2.2 Leading edge blanking (LEB) : At the instant the internal Sense FET is turned on, there usually exists a high current spike through the Sense FET, caused by primary-side capacitance and secondary-side rectifier reverse recovery. Excessive voltage across the Rsense resistor would lead to incorrect feedback operation in the current mode PWM control. To counter this effect, the FSDM0565RB employs a leading edge blanking (LEB) circuit. This circuit inhibits the PWM comparator for a short time (TLEB) after the Sense FET is turned on. Figure 5. Pulse width modulation (PWM) circuit 3. Protection Circuit : The FSDM0565RB has several self protective functions such as over load protection (OLP), over voltage protection (OVP) and thermal shutdown (TSD). Because these protection circuits are fully integrated into the IC without external components, the reliability can be improved without increasing cost. Once the fault condition occurs, switching is terminated and the Sense FET remains off. This causes Vcc to fall. When Vcc reaches the UVLO stop voltage, 8V, the protection is reset and the internal high voltage current source charges the Vcc capacitor via the Vstr pin. When Vcc reaches the UVLO start voltage,12V, the FSDM0565RB resumes its normal operation. In this manner, the auto-restart can alternately enable and disable the switching of the power Sense FET until the fault condition is eliminated (see Figure 6). 8V/12V 3 Vref Internal Bias Vcc 6 Vstr Istart Vcc good VDC CVcc 4 OSC Vcc Vref Idelay IFB VSD R 2.5R Gate driver OLP D1 D2 + Vfb* - Vfb KA431 CB Vo H11A817A Rsense SenseFET FSDM0565RB 12 Figure 6. Auto restart operation 3.1 Over Load Protection (OLP) : Overload is defined as the load current exceeding a pre-set level due to an unexpected event. In this situation, the protection circuit should be activated in order to protect the SMPS. However, even when the SMPS is in the normal operation, the over load protection circuit can be activated during the load transition. In order to avoid this undesired operation, the over load protection circuit is designed to be activated after a specified time to determine whether it is a transient situation or an overload situation. Because of the pulse-by-pulse current limit capability, the maximum peak current through the Sense FET is limited, and therefore the maximum input power is restricted with a given input voltage. If the output consumes beyond this maximum power, the output voltage (Vo) decreases below the set voltage. This reduces the current through the opto-coupler LED, which also reduces the opto-coupler transistor current, thus increasing the feedback voltage (Vfb). If Vfb exceeds 2.5V, D1 is blocked and the 3.5uA current source starts to charge CB slowly up to Vcc. In this condition, Vfb continues increasing until it reaches 6V, when the switching operation is terminated as shown in Figure 7. The delay time for shutdown is the time required to charge CB from 2.5V to 6.0V with 3.5uA. In general, a 10 ~ 50 ms delay time is typical for most applications. Figure 7. Over load protection 3.2 Over voltage Protection (OVP) : If the secondary side feedback circuit were to malfunction or a solder defect caused an open in the feedback path, the current through the opto-coupler transistor becomes almost zero. Then, Vfb climbs up in a similar manner to the over load situation, forcing the preset maximum current to be supplied to the SMPS until the over load protection is activated. Because more energy than required is provided to the output, the output voltage may exceed the rated voltage before the over load protection is activated, resulting in the breakdown of the devices in the secondary side. In order to prevent this situation, an over voltage protection (OVP) circuit is employed. In general, Vcc is proportional to the output voltage and the FSDM0565RB uses Vcc instead of directly monitoring the output voltage. If VCC exceeds 19V, an OVP circuit is activated resulting in the termination of the switching operation. In order to avoid undesired activation of OVP during normal operation, Vcc should be designed to be below 19V. 3.3 Thermal Shutdown (TSD) : The Sense FET and the control IC are built in one package. This makes it easy for the control IC to detect the heat generation from the Sense FET. When the temperature exceeds approximately 150°C, the thermal shutdown is activated. 4. Soft Start : The FSDM0565RB has an internal soft start circuit that increases PWM comparator inverting input voltage together with the Sense FET current slowly after it starts up. The typical soft start time is 10msec, The pulse width to the power switching device is progressively increased to establish the correct working conditions for transformers, inductors, and capacitors. The voltage on the output capacitors is progressively increased with the intention of smoothly establishing the required output voltage. It also helps to prevent transformer saturation and reduce the stress on the secondary diode during startup. Fault situation 8V 12V Vcc Vds t Fault occurs Fault removed Normal operation Normal operation Power on VFB t 2.5V 6.0V Over load protection T12= Cfb*(6.0-2.5)/I delay T1 T2 FSDM0565RB 13 5. Burst operation : In order to minimize power dissipation in standby mode, the FSDM0565RB enters burst mode operation. As the load decreases, the feedback voltage decreases. As shown in Figure 8, the device automatically enters burst mode when the feedback voltage drops below VBURL(500mV). At this point switching stops and the output voltages start to drop at a rate dependent on standby current load. This causes the feedback voltage to rise. Once it passes VBURH(700mV) switching resumes. The feedback voltage then falls and the process repeats. Burst mode operation alternately enables and disables switching of the power Sense FET thereby reducing switching loss in Standby mode. Figure 8. Waveforms of burst operation VFB Vds 0.5V 0.7V Ids Vo Voset time Switching disabled T1 T2 T3 Switching disabled T4 FSDM0565RB 14 Typical application circuit Features • High efficiency (>81% at 85Vac input) • Low zero load power consumption (<300mW at 240Vac input) • Low standby mode power consumption (<800mW at 240Vac input and 0.3W load) • Low component count • Enhanced system reliability through various protection functions • Internal soft-start (10ms) Key Design Notes • Resistors R102 and R105 are employed to prevent start-up at low input voltage. After startup, there is no power loss in these resistors since the startup pin is internally disconnected after startup. • The delay time for over load protection is designed to be about 50ms with C106 of 47nF. If a faster triggering of OLP is required, C106 can be reduced to 10nF. • Zener diode ZD102 is used for a safety test such as UL. When the drain pin and feedback pin are shorted, the zener diode fails and remains short, which causes the fuse (F1) blown and prevents explosion of the opto-coupler (IC301). This zener diode also increases the immunity against line surge. 1. Schematic Application Output power Input voltage Output voltage (Max current) LCD Monitor 40W Universal input (85-265Vac) 5V (2.0A) 12V (2.5A) 3 4 C102 220nF 275VAC LF101 23mH C101 220nF 275VAC RT1 5D-9 F1 FUSE 250V 2A C103 100uF 400V R102 30kΩ R105 40kΩ R103 56kΩ 2W C104 2.2nF 1kV D101 UF 4007 C106 47nF 50V C105 22uF 50V D102 TVR10G R104 5Ω 1 2 3 4 5 T1 EER3016 BD101 2KBP06M3N257 1 2 R101 560kΩ 1W IC1 FSDM0565RB Vstr NC Vfb Vcc Drain GND 1 2 3 4 5 6 ZD101 22V 8 10 D202 MBRF10100 C201 1000uF 25V C202 1000uF 25V L201 12V, 2.5A 6 7 D201 MBRF1045 C203 1000uF 10V C204 1000uF 10V L202 5V, 2A R201 1kΩ R202 1.2kΩ R204 5.6kΩ R203 12kΩ C205 47nF R205 5.6kΩ C301 4.7nF IC301 H11A817A IC201 KA431 ZD102 10V FSDM0565RB 15 2. Transformer Schematic Diagram 3.Winding Specification 4.Electrical Characteristics 5. Core & Bobbin Core : EER 3016 Bobbin : EER3016 Ae(mm2) : 96 No Pin (s→f) Wire Turns Winding Method Na 4 → 5 0.2φ × 1 8 Center Winding Insulation: Polyester Tape t = 0.050mm, 2Layers Np/2 2 → 1 0.4φ × 1 18 Solenoid Winding Insulation: Polyester Tape t = 0.050mm, 2Layers N12V 10 → 8 0.3φ × 3 7 Center Winding Insulation: Polyester Tape t = 0.050mm, 2Layers N5V 7 → 6 0.3φ × 3 3 Center Winding Insulation: Polyester Tape t = 0.050mm, 2Layers Np/2 3 → 2 0.4φ × 1 18 Solenoid Winding Outer Insulation: Polyester Tape t = 0.050mm, 2Layers Pin Specification Remarks Inductance 1 - 3 520uH ± 10% 100kHz, 1V Leakage Inductance 1 - 3 10uH Max 2nd all short EER3016 Np /2 N12V Na 1 2 3 4 5 6 7 8 9 10 Np /2 N5V FSDM0565RB 16 6.Demo Circuit Part List Part Value Note Part Value Note Fuse C301 4.7nF Polyester Film Cap. F101 2A/250V NTC Inductor RT101 5D-9 L201 5uH Wire 1.2mm Resistor L202 5uH Wire 1.2mm R101 560K 1W R102 30K 1/4W R103 56K 2W R104 5 1/4W Diode R105 40K 1/4W D101 UF4007 R201 1K 1/4W D102 TVR10G R202 1.2K 1/4W D201 MBRF1045 R203 12K 1/4W D202 MBRF10100 R204 5.6K 1/4W ZD101 Zener Diode 22V R205 5.6K 1/4W ZD102 Zener Diode 10V Bridge Diode BD101 2KBP06M 3N257 Bridge Diode Capacitor C101 220nF/275VAC Box Capacitor Line Filter C102 220nF/275VAC Box Capacitor LF101 23mH Wire 0.4mm C103 100uF/400V Electrolytic Capacitor IC C104 2.2nF/1kV Ceramic Capacitor IC101 FSDM0565RB FPSTM(5A,650V) C105 22uF/50V Electrolytic Capacitor IC201 KA431(TL431) Voltage reference C106 47nF/50V Ceramic Capacitor IC301 H11A817A Opto-coupler C201 1000uF/25V Electrolytic Capacitor C202 1000uF/25V Electrolytic Capacitor C203 1000uF/10V Electrolytic Capacitor C204 1000uF/10V Electrolytic Capacitor C205 47nF/50V Ceramic Capacitor FSDM0565RB 17 7. Layout Figure 9. Layout Considerations for FSDM0565RB Figure 10. Layout Considerations for FSDM0565RB FSDM0565RB 18 Package Dimensions TO-220F-6L(Forming) FSDM0565RB 19 Package Dimensions (Continued) I2-PAK-6L(Forming) FSDM0565RB 1/9/06 0.0m 001 © 2006 Fairchild Semiconductor Corporation LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. Ordering Information WDTU : Forming Type Product Number Package Marking Code BVdss Rds(on)Max. FSDM0565RBWDTU TO-220F-6L(Forming) DM0565R 650V 2.2 Ω FSDM0565RBIWDTU I2-PAK-6L (Forming) DM0565R 650V 2.2 Ω Data Sheet: JN5148-001 IEEE802.15.4 Wireless Microcontroller © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 1 Overview Features: Transceiver • 2.4GHz IEEE802.15.4 compliant • Time of Flight ranging engine • 128-bit AES security processor • MAC accelerator with packet formatting, CRCs, address check, auto-acks, timers • 500 & 667kbps data rate modes • Integrated sleep oscillator for low power • On chip power regulation for 2.0V to 3.6V battery operation • Deep sleep current 100nA • Sleep current with active sleep timer 1.25µA • <$0.50 external component cost • Rx current 17.5mA • Tx current 15.0mA • Receiver sensitivity -95dBm • Transmit power 2.5dBm Features: Microcontroller • Low power 32-bit RISC CPU, 4 to 32MHz clock speed • Variable instruction width for high coding efficiency • Multi-stage instruction pipeline • 128kB ROM and 128kB RAM for bootloaded program code & data • JTAG debug interface • 4-input 12-bit ADC, 2 12-bit DACs, 2 comparators • 3 application timer/counters, • 2 UARTs • SPI port with 5 selects • 2-wire serial interface • 4-wire digital audio interface • Watchdog timer • Low power pulse counters • Up to 21 DIO Industrial temp (-40°C to +85°C) 8x8mm 56-lead Punched QFN Lead-free and RoHS compliant The JN5148-001 is an ultra low power, high performance wireless microcontroller targeted at JenNet and ZigBee PRO networking applications. The device features an enhanced 32-bit RISC processor offering high coding efficiency through variable width instructions, a multistage instruction pipeline and low power operation with programmable clock speeds. It also includes a 2.4GHz IEEE802.15.4 compliant transceiver, 128kB of ROM, 128kB of RAM, and a rich mix of analogue and digital peripherals. The large memory footprint allows the device to run both a network stack (e.g. ZigBee PRO) and an embedded application or in a coprocessor mode. The operating current is below 18mA, allowing operation direct from a coin cell. Enhanced peripherals include low power pulse counters running in sleep mode designed for pulse counting in AMR applications and a unique Time of Flight ranging engine, allowing accurate location services to be implemented on wireless sensor networks. It also includes a 4-wire I2 S audio interface, to interface directly to mainstream audio CODECs, as well as conventional MCU peripherals. Block Diagram 32-bit RISC CPU Timers UAR Ts 12-bit ADC, Comparators 12-bit DACs, Temp Sensor 2-Wire Serial RAM SPI 128kB 128-bit AES Encryption Accelerator 2.4GHz Radio ROM 128kB Power Management XTAL O-QPSK Modem IEEE802.15.4 MAC Accelerator 32-byte OTP eFuse 4-Wire Audio Sleep Counters Time of Flight Engine Watchdog Timer Benefits • Single chip integrates transceiver and microcontroller for wireless sensor networks • Large memory footprint to run ZigBee PRO or JenNet together with an application • Very low current solution for long battery life • Highly featured 32-bit RISC CPU for high performance and low power • System BOM is low in component count and cost • Extensive user peripherals Applications • Robust and secure low power wireless applications • ZigBee PRO and JenNet networks • Smart metering (e.g. AMR) • Home and commercial building automation • Location Aware services – e.g. Asset Tracking • Industrial systems • Telemetry • Remote Control • Toys and gaming peripherals2 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Contents 1 Introduction 6 1.1 Wireless Transceiver 6 1.2 RISC CPU and Memory 6 1.3 Peripherals 7 1.4 Block Diagram 8 2 Pin Configurations 9 2.1 Pin Assignment 10 2.2 Pin Descriptions 12 2.2.1 Power Supplies 12 2.2.2 Reset 12 2.2.3 32MHz Oscillator 12 2.2.4 Radio 12 2.2.5 Analogue Peripherals 13 2.2.6 Digital Input/Output 13 3 CPU 15 4 Memory Organisation 16 4.1 ROM 16 4.2 RAM 17 4.3 OTP eFuse Memory 17 4.4 External Memory 17 4.4.1 External Memory Encryption 18 4.5 Peripherals 18 4.6 Unused Memory Addresses 18 5 System Clocks 19 5.1 16MHz System Clock 19 5.1.1 32MHz Oscillator 19 5.1.2 24MHz RC Oscillator 19 5.2 32kHz System Clock 20 5.2.1 32kHz RC Oscillator 20 5.2.2 32kHz Crystal Oscillator 20 5.2.3 32kHz External Clock 20 6 Reset 21 6.1 Internal Power-on Reset 21 6.2 External Reset 22 6.3 Software Reset 22 6.4 Brown-out Detect 23 6.5 Watchdog Timer 23 7 Interrupt System 24 7.1 System Calls 24 7.2 Processor Exceptions 24 7.2.1 Bus Error 24 7.2.2 Alignment 24 7.2.3 Illegal Instruction 24 7.2.4 Stack Overflow 24 7.3 Hardware Interrupts 25© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 3 8 Wireless Transceiver 26 8.1 Radio 26 8.1.1 Radio External Components 27 8.1.2 Antenna Diversity 27 8.2 Modem 29 8.3 Baseband Processor 30 8.3.1 Transmit 30 8.3.2 Reception 30 8.3.3 Auto Acknowledge 31 8.3.4 Beacon Generation 31 8.3.5 Security 31 8.4 Security Coprocessor 31 8.5 Location Awareness 31 8.6 Higher Data Rates 32 9 Digital Input/Output 33 10 Serial Peripheral Interface 35 11 Timers 38 11.1 Peripheral Timer/Counters 38 11.1.1 Pulse Width Modulation Mode 39 11.1.2 Capture Mode 39 11.1.3 Counter/Timer Mode 40 11.1.4 Delta-Sigma Mode 40 11.1.5 Example Timer / Counter Application 41 11.2 Tick Timer 41 11.3 Wakeup Timers 42 11.3.1 RC Oscillator Calibration 43 12 Pulse Counters 44 13 Serial Communications 45 13.1 Interrupts 46 13.2 UART Application 46 14 JTAG Debug Interface 47 15 Two-Wire Serial Interface 48 15.1 Connecting Devices 48 15.2 Clock Stretching 49 15.3 Master Two-wire Serial Interface 49 15.4 Slave Two-wire Serial Interface 50 16 Four-Wire Digital Audio Interface 51 17 Random Number Generator 53 18 Sample FIFO 54 19 Intelligent Peripheral Interface 55 19.1 Data Transfer Format 55 19.2 JN5148 (Slave) Initiated Data Transfer 56 19.3 Remote (Master) Processor Initiated Data Transfer 564 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 20 Analogue Peripherals 58 20.1 Analogue to Digital Converter 59 20.1.1 Operation 59 20.1.2 Supply Monitor 60 20.1.3 Temperature Sensor 60 20.2 Digital to Analogue Converter 60 20.2.1 Operation 60 20.3 Comparators 61 21 Power Management and Sleep Modes 62 21.1 Operating Modes 62 21.1.1 Power Domains 62 21.2 Active Processing Mode 62 21.2.1 CPU Doze 62 21.3 Sleep Mode 62 21.3.1 Wakeup Timer Event 63 21.3.2 DIO Event 63 21.3.3 Comparator Event 63 21.3.4 Pulse Counter 63 21.4 Deep Sleep Mode 63 22 Electrical Characteristics 64 22.1 Maximum Ratings 64 22.2 DC Electrical Characteristics 64 22.2.1 Operating Conditions 64 22.2.2 DC Current Consumption 65 22.2.3 I/O Characteristics 66 22.3 AC Characteristics 66 22.3.1 Reset and Voltage Brown-Out 66 22.3.2 SPI MasterTiming 68 22.3.3 Intelligent Peripheral (SPI Slave) Timing 68 22.3.4 Two-wire Serial Interface 69 22.3.5 Four-Wire Digital Audio Interface 70 22.3.6 Wakeup and Boot Load Timings 70 22.3.7 Bandgap Reference 71 22.3.8 Analogue to Digital Converters 71 22.3.9 Digital to Analogue Converters 72 22.3.10 Comparators 73 22.3.11 32kHz RC Oscillator 73 22.3.12 32kHz Crystal Oscillator 74 22.3.13 32MHz Crystal Oscillator 74 22.3.14 24MHz RC Oscillator 75 22.3.15 Temperature Sensor 75 22.3.16 Radio Transceiver 76© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 5 Appendix A Mechanical and Ordering Information 81 A.1 56-pin QFN Package Drawing 81 A.2 PCB Decal 82 A.3 Ordering Information 83 A.4 Device Package Marking 84 A.5 Tape and Reel Information 85 A.5.1 Tape Orientation and Dimensions 85 A.5.2 Reel Information: 180mm Reel 86 A.5.3 Reel Information: 330mm Reel 87 A.5.4 Dry Pack Requirement for Moisture Sensitive Material 87 Appendix B Development Support 88 B.1 Crystal Oscillators 88 B.1.1 Crystal Equivalent Circuit 88 B.1.2 Crystal Load Capacitance 88 B.1.3 Crystal ESR and Required Transconductance 89 B.2 32MHz Oscillator 90 B.3 32kHz Oscillator 92 B.4 JN5148 Module Reference Designs 94 B.4.1 Schematic Diagram 94 B.4.2 PCB Design and Reflow Profile 96 Related Documents 97 RoHS Compliance 97 Status Information 97 Disclaimers 98 Trademarks 98 Version Control 99 Contact Details 1006 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 1 Introduction The JN5148-001 is an IEEE802.15.4 wireless microcontroller that provides a fully integrated solution for applications using the IEEE802.15.4 standard in the 2.4 - 2.5GHz ISM frequency band [1], including JenNet and ZigBee PRO. It includes all of the functionality required to meet the IEEE802.15.4, JenNet and ZigBee PRO specifications and has additional processor capability to run a wide range of applications including, but not limited to Smart Energy, Automatic Meter Reading, Remote Control, Home and Building Automation, Toys and Gaming. Applications that transfer data wirelessly tend to be more complex than wired ones. Wireless protocols make stringent demands on frequencies, data formats, timing of data transfers, security and other issues. Application development must consider the requirements of the wireless network in addition to the product functionality and user interfaces. To minimise this complexity, NXP provides a series of software libraries and interfaces that control the transceiver and peripherals of the JN5148. These libraries and interfaces remove the need for the developer to understand wireless protocols and greatly simplifies the programming complexities of power modes, interrupts and hardware functionality. In view of the above, the register details of the JN5148 are not provided in the datasheet. The device includes a Wireless Transceiver, RISC CPU, on chip memory and an extensive range of peripherals. Hereafter, the JN5148-001 will be referred to as JN5148. 1.1 Wireless Transceiver The Wireless Transceiver comprises a 2.45GHz radio, a modem, a baseband controller and a security coprocessor. In addition, the radio also provides an output to control transmit-receive switching of external devices such as power amplifiers allowing applications that require increased transmit power to be realised very easily. Appendix B.4, describes a complete reference design including Printed Circuit Board (PCB) design and Bill Of Materials (BOM). The security coprocessor provides hardware-based 128-bit AES-CCM* modes as specified by the IEEE802.15.4 2006 standard. Specifically this includes encryption and authentication covered by the MIC –32/ -64/ -128, ENC and ENC-MIC –32/ -64/ -128 modes of operation. The transceiver elements (radio, modem and baseband) work together to provide IEEE802.15.4 Medium Access Control (MAC) under the control of a protocol stack. Applications incorporating IEEE802.15.4 functionality can be rapidly developed by combining user-developed application software with a protocol stack library. 1.2 RISC CPU and Memory A 32-bit RISC CPU allows software to be run on chip, its processing power being shared between the IEEE802.15.4 MAC protocol, other higher layer protocols and the user application. The JN5148 has a unified memory architecture, code memory, data memory, peripheral devices and I/O ports are organised within the same linear address space. The device contains 128kbytes of ROM, 128kbytes of RAM and a 32-byte One Time Programmable (OTP) eFuse memory. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 7 1.3 Peripherals The following peripherals are available on chip: • Master SPI port with five select outputs • Two UARTs with support for hardware or software flow control • Three programmable Timer/Counters – all three support Pulse Width Modulation (PWM) capability, two have capture/compare facility • Two programmable Sleep Timers and a Tick Timer • Two-wire serial interface (compatible with SMbus and I2 C) supporting master and slave operation • Four-wire digital audio interface (compatible with I²S) • Slave SPI port for Intelligent peripheral mode (shared with digital I/O) • Twenty-one digital I/O lines (multiplexed with peripherals such as timers and UARTs) • Four channel, 12-bit, Analogue to Digital converter • Two 12-bit Digital to Analogue converters • Two programmable analogue comparators • Internal temperature sensor and battery monitor • Time Of Flight ranging engine • Two low power pulse counters • Random number generator • Watchdog Timer and Voltage Brown-out • Sample FIFO for digital audio interface or ADC/DAC • JTAG hardware debug port User applications access the peripherals using the Integrated Peripherals API. This allows applications to use a tested and easily understood view of the peripherals allowing rapid system development. 8 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 1.4 Block Diagram 32-bit RISC CPU Reset SPI Master MUX UART0 UART1 Wakeup Timer1 Wakeup Timer0 Security Coprocessor DIO6/TXD0/JTAG_TDO DIO7/RXD0/JTAG_TDI DIO4/CTS0/JTAG_TCK DIO5/RTS0/JTAG_TMS DIO19/TXD1/JTAG_TDO DIO17/CTS1/IP_SEL/DAI_SCK/ JTAG_TCK DIO18/RTS1/IP_INT/DAI_SDOUT/ JTAG_TMS Digital Baseband Radio Programmable Interrupt Controller Timer0 2-wire Interf ace Timer1 SPICLK DIO10/TIM0OUT/32KXTALOUT SPIMOSI SPIMISO SPISEL0 DIO0/SPISEL1 DIO3/SPISEL4/RFTX DIO2/SPISEL3/RFRX DIO1/SPISEL2/PC0 DIO9/TIM0CAP/32KXTALIN/32KIN DIO8/TIM0CK_GT/PC1 DIO13/TIM1OUT/ADE/DAI_SDIN DIO11/TIM1CK_GT/TIM2OUT DIO12/TIM1CAP/ADO/DAI_WS DIO14/SIF_CLK/IP_CLK DIO15/SIF_D/IP_DO DIO16/RXD1/IP_DI/JTAG_TDI From Peripherals RESETN Wireless Transceiv er 32MHz Clock Generator XTAL_IN XTAL_OUT RF_IN VCOTUNE Tick Timer Voltage Regulators 1.8V VDD1 VDD2 Intelligent Peripheral IBAIS VB_XX Clock Divider Multiplier Timer2 SPISEL1 SPISEL2 SPISEL3 SPISEL4 TXD0 RXD0 RTS0 CTS0 TXD1 RXD1 RTS1 CTS1 TIM0CK_GT TIM0CAP TIM0OUT TIM1CK_GT TIM1CAP TIM1OUT TIM2OUT SIF_D SIF_CLK IP_DO IP_DI IP_INT IP_CLK IP_SEL 4-wire Digital Audio Interf ace I2S_OUT I2S_DIN I2S_CLK I2S_SYNC Pulse Counters PC0 PC1 JTAG Debug JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO RAM 128kB ROM 128kB OTP eFuse 32kHz RC Osc 32kHz Clock Select 32KIN 32kHz Clock Gen 32KXTALIN 32KXTALOUT Antenna Div ersity ADO ADE Time Of Flight Sample FIFO DIO20/RXD1/JTAG_TDI 24MHz RC Osc Comparator2 COMP2P COMP2M COMP1P/ Comparator1 EXT_PA_C COMP1M/ EXT_PA_B DAC1 DAC2 DAC1 DAC2 ADC M U ADC4 X ADC1 ADC2 ADC3 Temperature Sensor Supply Monitor CPU and 16MHz System Clock Watchdog Timer Brown-out Detect Figure 1: JN5148 Block Diagram DIO 16/IP_DI© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 9 2 Pin Configurations DIO16/RXD 1/IP_DI/JTAG_TDI DIO17/CTS1/IP_SEL/DAI_SC K/JTAG_TCK VSS3 DIO18/RTS1/IP_INT/DAI_SDOUT/JTAG_TMS DIO19/TXD1/JTAG_TDO VSS2 VSSS XTAL_OUT XTAL_IN VB_SYNTH VCOTUNE VB_VCO VDD1 IBIAS VREF VB_RF2 RF_IN VB_RF COMP1M COMP1P ADC1 ADC2 ADC3 ADC4 COMP2M COMP2P VB_A NC DAC1 DAC2 DIO20/RXD 1/JTAG_TDI VSS1 SPICLK SPIMISO VB_RAM SPIMOSI SPISEL0 DIO0/SPISEL1 RESETN VB_DIG DIO1/SPISEL2/PC0 DIO2/SPISEL3/RFRX DIO15/SIF_D/IP_DO DIO14/SIF_C LK/IP_CLK DIO13/T IM1OUT/ADE/DAI_SDIN DIO12/T IM1CAP/ADO/DAI_WS DIO11/T IM1CK_GT /TIM2OUT DIO10/T IM0OUT/32KXT ALOUT DIO9/TIM0CAP/32KXT ALIN/32KIN VDD2 DIO8/TIM0CK_GT/PC 1 DIO7/RXD0/JT AG_TDI DIO6/TXD0/JTAG_TDO DIO5/RTS0/JTAG_TMS DIO4/CTS0/JTAG_TCK DIO3/SPISEL4/RFTX VSSA (Paddl e) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 56 55 54 53 52 51 50 49 48 47 46 45 44 43 Figure 2: 56-pin QFN Configuration (top view)  Note: Please refer to Appendix B.4 JN5148 Module Reference Design for important applications information regarding the connection of the PADDLE to the PCB. DIO 16/IP_DI10 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 2.1 Pin Assignment Pin No Power supplies Signal Type Description 10, 12, 16, 18, 27, 35, 40 VB_SYNTH, VB_VCO, VB_RF2, VB_RF, VB_A, VB_RAM, VB_DIG 1.8V Regulated supply voltage 13, 49 VDD1, VDD2 3.3V Supplies: VDD1 for analogue, VDD2 for digital 32, 6, 3, 7, Paddle VSS1, VSS2, VSS3, VSSS, VSSA 0V Grounds (see appendix A.2 for paddle details) 28 NC No connect General 39 RESETN CMOS Reset input 8, 9 XTAL_OUT, XTAL_IN 1.8V System crystal oscillator Radio 11 VCOTUNE 1.8V VCO tuning RC network 14 IBIAS 1.8V Bias current control 17 RF_IN 1.8V RF antenna Analogue Peripheral I/O 21, 22, 23, 24 ADC1, ADC2, ADC3, ADC4 3.3V ADC inputs 15 VREF 1.8V Analogue peripheral reference voltage 29, 30 DAC1, DAC2 3.3V DAC outputs 19, 20 COMP1M/EXT_PA_B, COMP1P/EXT_PA_C 3.3V Comparator 1 inputs and external PA control 25, 26 COMP2M, COMP2P 3.3V Comparator 2 inputs Digital Peripheral I/O Primary Alternate Functions 33 SPICLK CMOS SPI Clock Output 36 SPIMOSI CMOS SPI Master Out Slave In Output 34 SPIMISO CMOS SPI Master In Slave Out Input 37 SPISEL0 CMOS SPI Slave Select Output 0 38 DIO0 SPISEL1 CMOS DIO0 or SPI Slave Select Output 1 41 DIO1 SPISEL2 PC0 CMOS DIO1, SPI Slave Select Output 2 or Pulse Counter0 Input 42 DIO2 SPISEL3 RFRX CMOS DIO2, SPI Slave Select Output 3 or Radio Receive Control Output 43 DIO3 SPISEL4 RFTX CMOS DIO3, SPI Slave Select Output 4 or Radio Transmit Control Output 44 DIO4 CTS0 JTAG_TCK CMOS DIO4, UART 0 Clear To Send Input or JTAG CLK 45 DIO5 RTS0 JTAG_TMS CMOS DIO5, UART 0 Request To Send Output or JTAG Mode Select 46 DIO6 TXD0 JTAG_TDO CMOS DIO6, UART 0 Transmit Data Output or JTAG Data Output 47 DIO7 RXD0 JTAG_TDI CMOS DIO7, UART 0 Receive Data Input or JTAG Data Input 48 DIO8 TIM0CK_GT PC1 CMOS DIO8, Timer0 Clock/Gate Input or Pulse Counter1 Input 50 DIO9 TIM0CAP 32KXTALIN 32KIN CMOS DIO9, Timer0 Capture Input, 32K External Crystal Input or 32K Clock Input© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 11 Pin No Digital Peripheral I/O Signal Type Description Primary Alternate Functions 51 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output or 32K External Crystal Output 52 DIO11 TIM1CK_GT TIM2OUT CMOS DIO11, Timer1 Clock/Gate Input or Timer2 PWM Output 53 DIO12 TIM1CAP ADO DAI_WS CMOS DIO12, Timer1 Capture Input, Antenna Diversity or Digital Audio Word Select 54 DIO13 TIM1OUT ADE DAI_SDIN CMOS DIO13, Timer1 PWM Output, Antenna Diversity or Digital Audio Data Input 55 DIO14 SIF_CLK IP_CLK CMOS DIO14, Serial Interface Clock or Intelligent Peripheral Clock Input 56 DIO15 SIF_D IP_DO CMOS DIO15, Serial Interface Data or Intelligent Peripheral Data Out 1 DIO16 IP_DI CMOS DIO16 or Intelligent Peripheral Data In 2 DIO17 CTS1 IP_SEL DAI_SCK JTAG_TCK CMOS DIO17, UART 1 Clear To Send Input, Intelligent Peripheral Device Select Input or Digital Audio Clock or JTAG CLK 4 DIO18 RTS1 IP_INT DAI_SDOUT JTAG_TMS CMOS DIO18, UART 1 Request To Send Output, Intelligent Peripheral Interrupt Output or Digital Audio Data Output or JTAG Mode Select 5 DIO19 TXD1 JTAG_TDO CMOS DIO19 or UART 1 Transmit Data Output or JTAG Data Out 31 DIO 20 RXD1 JTAG_TDI CMOS DIO 20, UART 1 Receive Data Input or JTAG data In  The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN5148 failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application.12 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 2.2 Pin Descriptions 2.2.1 Power Supplies The device is powered from the VDD1 and VDD2 pins, each being decoupled with a 100nF ceramic capacitor. VDD1 is the power supply to the analogue circuitry; it should be decoupled to ground. VDD2 is the power supply for the digital circuitry; and should also be decoupled to ground. A 10uF tantalum capacitor is required. Decoupling pins for the internal 1.8V regulators are provided which require a 100nF capacitor located as close to the device as practical. VB_RF, VB_A and VB_SYNTH should be decoupled with an additional 47pF capacitor, while VB_RAM and VB_DIG require only 100nF. VB_RF and VB_RF2 should be connected together as close to the device as practical, and only require one 100nF capacitor and one 47pF capacitor. The pin VB_VCO requires a 10nF capacitor in parallel with a 47pF capacitor. Refer to B.4.1 for schematic diagram. VSSA, VSSS, VSS1, VSS2, VSS3 are the ground pins. Users are strongly discouraged from connecting their own circuits to the 1.8v regulated supply pins, as the regulators have been optimised to supply only enough current for the internal circuits. 2.2.2 Reset RESETN is a bi-directional active low reset pin that is connected to a 40kΩ internal pull-up resistor. It may be pulled low by an external circuit, or can be driven low by the JN5148 if an internal reset is generated. Typically, it will be used to provide a system reset signal. Refer to section 6.2, External Reset, for more details. 2.2.3 32MHz Oscillator A crystal is connected between XTALIN and XTALOUT to form the reference oscillator, which drives the system clock. A capacitor to analogue ground is required on each of these pins. Refer to section 5.1 16MHz System Clock for more details. The 32MHz reference frequency is divided down to 16MHz and this is used as the system clock throughout the device. 2.2.4 Radio The radio is a single ended design, requiring a capacitor and just two inductors to match to 50Ω microstrip line to the RF_IN pin. An external resistor (43kΩ) is required between IBIAS and analogue ground to set various bias currents and references within the radio.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 13 2.2.5 Analogue Peripherals Several of the analogue peripherals require a reference voltage to use as part of their operations. They can use either an internal reference voltage or an external reference connected to VREF. This voltage is referenced to analogue ground and the performance of the analogue peripherals is dependant on the quality of this reference. There are four ADC inputs, two pairs of comparator inputs and two DAC outputs. The analogue I/O pins on the JN5148 can have signals applied up to 0.3v higher than VDD1. A schematic view of the analogue I/O cell is shown in Figure 3: Analogue I/O Cell In reset and deep sleep, the analogue peripherals are all off and the DAC outputs are in a high impedance state. In sleep, the ADC and DACs are off, with the DAC outputs in high impedance state. The comparators may optionally be used as a wakeup source. Unused ADC and comparator inputs should be left unconnected. VDD1 Analogue I/O Pin VSSA Analogue Peripheral Figure 3: Analogue I/O Cell 2.2.6 Digital Input/Output Digital I/O pins on the JN5148 can have signals applied up to 2V higher than VDD2 (with the exception of pins DIO9 and DIO10 that are 3V tolerant) and are therefore TTL-compatible with VDD2 > 3V. For other DC properties of these pins see section 22.2.3 I/O Characteristics. When used in their primary function all Digital Input/Output pins are bi-directional and are connected to weak internal pull up resistors (40kΩ nominal) that can be disabled. When used in their secondary function (selected when the appropriate peripheral block is enabled through software library calls) then their direction is fixed by the function. The pull up resistor is enabled or disabled independently of the function and direction; the default state from reset is enabled. A schematic view of the digital I/O cell is in Figure 4: DIO Pin Equivalent Schematic.14 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 I O IE VDD2 VSS Pu RPU RPROT OE DIO[x] Pin Figure 4: DIO Pin Equivalent Schematic In reset, the digital peripherals are all off and the DIO pins are set as high-impedance inputs. During sleep and deep sleep, the DIO pins retain both their input/output state and output level that was set as sleep commences. If the DIO pins were enabled as inputs and the interrupts were enabled then these pins may be used to wake up the JN5148 from sleep.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 15 3 CPU The CPU of the JN5148 is a 32-bit load and store RISC processor. It has been architected for three key requirements: • Low power consumption for battery powered applications • High performance to implement a wireless protocol at the same time as complex applications • Efficient coding of high-level languages such as C provided with the NXP Software Developer’s Kit It features a linear 32-bit logical address space with unified memory architecture, accessing both code and data in the same address space. Registers for peripheral units, such as the timers, UARTs and the baseband processor are also mapped into this space. The CPU has access to a block of 15 32-bit General-Purpose (GP) registers together with a small number of special purpose registers which are used to store processor state and control interrupt handling. The contents of any GP register can be loaded from or stored to memory, while arithmetic and logical operations, shift and rotate operations, and signed and unsigned comparisons can be performed either between two registers and stored in a third, or between registers and a constant carried in the instruction. Operations between general or special-purpose registers execute in one cycle while those that access memory require a further cycle to allow the memory to respond. The instruction set manipulates 8, 16 and 32-bit data; this means that programs can use objects of these sizes very efficiently. Manipulation of 32-bit quantities is particularly useful for protocols and high-end applications allowing algorithms to be implemented in fewer instructions than on smaller word-size processors, and to execute in fewer clock cycles. In addition, the CPU supports hardware Multiply that can be used to efficiently implement algorithms needed by Digital Signal Processing applications. The instruction set is designed for the efficient implementation of high-level languages such as C. Access to fields in complex data structures is very efficient due to the provision of several addressing modes, together with the ability to be able to use any of the GP registers to contain the address of objects. Subroutine parameter passing is also made more efficient by using GP registers rather than pushing objects onto the stack. The recommended programming method for the JN5148 is by using C, which is supported by a software developer kit comprising a C compiler, linker and debugger. The CPU architecture also contains features that make the processor suitable for embedded, real-time applications. In some applications, it may be necessary to use a real-time operating system to allow multiple tasks to run on the processor. To provide protection for device-wide resources being altered by one task and affecting another, the processor can run in either supervisor or user mode, the former allowing access to all processor registers, while the latter only allows the GP registers to be manipulated. Supervisor mode is entered on reset or interrupt; tasks starting up would normally run in user mode in a RTOS environment. Embedded applications require efficient handling of external hardware events. When using JenOS, prioritised interrupts are supported, with 15 priority levels, and can be configured as required by the application. To improve power consumption a number of power-saving modes are implemented in the JN5148, described more fully in section 21 - Power Management and Sleep Modes. One of these modes is the CPU doze mode; under software control, the processor can be shut down and on an interrupt it will wake up to service the request. Additionally, it is possible under software control, to set the speed of the CPU to 4, 8, 16 or 32MHz. This feature can be used to trade-off processing power against current consumption.16 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 4 Memory Organisation This section describes the different memories found within the JN5148. The device contains ROM, RAM, OTP eFuse memory, the wireless transceiver and peripherals all within the same linear address space. 0x00000000 0x00020000 RAM (128kB) 0xF0000000 0xFFFFFFFF Unpopulated ROM (128kB) 0xF0020000 RAM Echo 0x04000000 Peripherals 0x02000000 Figure 5: JN5148 Memory Map 4.1 ROM The ROM is 128k bytes in size, and can be accessed by the processor in a single CPU clock cycle. The ROM contents include bootloader to allow external Flash memory contents to be bootloaded into RAM at runtime, a default interrupt vector table, an interrupt manager, IEEE802.15.4 MAC and APIs for interfacing on-chip peripherals. The operation of the boot loader is described in detail in Application Note [7]. The interrupt manager routes interrupt calls to the application’s soft interrupt vector table contained within RAM. Section 7 contains further information regarding the handling of interrupts. ROM contents are shown in Figure 6. Interrupt Vectors Interrupt Manager Boot Loader IEEE802.15.4 Stack 0x00000000 0x00020000 APIs Spare Figure 6: Typical ROM contents© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 17 4.2 RAM The JN5148 contains 128kBytes of high speed RAM. It can be used for both code and data storage and is accessed by the CPU in a single clock cycle. At reset, a boot loader controls the loading of segments of code and data from an external memory connected to the SPI port, into RAM. Software can control the power supply to the RAM allowing the contents to be maintained during a sleep period when other parts of the device are un-powered. Typical RAM contents are shown in Figure 7. MAC Data Interrupt Vector Table Application CPU Stack (Grows Down) 0x04000000 0x04020000 MAC Address Figure 7: Typical RAM Contents 4.3 OTP eFuse Memory The JN5148 contains a total of 32bytes of eFuse memory; this is a One Time Programmable (OTP) memory that can be used to support on chip 64-bit MAC ID and a 128-bit AES security key. A limited number of bits are available for customer use for storage of configuration information; configuration of these is made through use of software APIs. For further information on how to program and use the eFuse memory, please contact technical support via the online tech-support system. Alternatively, NXP can provide an eFuse programming service for customers that wish to use the eFuse but do not wish to undertake this for themselves. For further details of this service, please contact your local NXP sales office. 4.4 External Memory An external memory with an SPI interface may be used to provide storage for program code and data for the device when external power is removed. The memory is connected to the SPI interface using select line SPISEL0; this select line is dedicated to the external memory interface and is not available for use with other external devices. See Figure 8 for connection details. JN5148 Serial Memory SPISEL0 SPIMISO SPIMOSI SPICLK SS SDO SDI CLK Figure 8: Connecting External Serial Memory18 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 At reset, the contents of this memory are copied into RAM by the software boot loader. The Flash memory devices that are supported as standard through the JN5148 bootloader are given in Table 1. NXP recommends that where possible one of these devices should be selected. Manufacturer Device Number SST (Silicon Storage Technology) 25VF010A (1Mbit device) Numonyx M25P10-A (1Mbit device), M25P40 (4Mbit device) Table 1: Supported Flash Memories Applications wishing to use an alternate Flash memory device should refer to application note [2] JN-AN-1038 Programming Flash devices not supported by the JN51xx ROM-based bootloader. This application note provides guidance on developing an interface to an alternate device. 4.4.1 External Memory Encryption The contents of the external serial memory may be encrypted. The AES security processor combined with a user programmable 128-bit encryption key is used to encrypt the contents of the external memory. The encryption key is stored in eFuse. When bootloading program code from external serial memory, the JN5148 automatically accesses the encryption key to execute the decryption process. User program code does not need to handle any of the decryption process; it is transparent. With encryption enabled, the time taken to boot code from external flash is increased. 4.5 Peripherals All peripherals have their registers mapped into the memory space. Access to these registers requires 3 clock cycles. Applications have access to the peripherals through the software libraries that present a high-level view of the peripheral’s functions through a series of dedicated software routines. These routines provide both a tested method for using the peripherals and allow bug-free application code to be developed more rapidly. For details, see the JN51xx Integrated Peripherals API User Guide (JN-UG-3066)[5]. 4.6 Unused Memory Addresses Any attempt to access an unpopulated memory area will result in a bus error exception (interrupt) being generated.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 19 5 System Clocks Two system clocks are used to provide timing references into the on-chip subsystems of the JN5148. A 16MHz clock, generated by a crystal-controlled 32MHz oscillator, is used by the transceiver, processor, memory and digital and analogue peripherals. A 32kHz clock is used by the sleep timer and during the startup phase of the chip. 5.1 16MHz System Clock The 16MHz system clock is used by the digital and analogue peripherals and the transceiver. A scaled version (4,8,16 or 32MHz) of this clock is also used by the processor and memories. For most operations it is necessary to source this clock from the 32MHz oscillator. Crystal oscillators are generally slow to start. Hence to provide a faster start-up following a sleep cycle a fast RC oscillator is provided that can be used as the source for the 16MHz system clock. The oscillator starts very quickly and is typically 24MHz causing the system clock to run at 12MHz. Using a clock of this speed scales down the speed of the processor and any peripherals in use. For the SPI interface this causes no functional issues as the generated SPI clock is slightly slower and is used to clock the external SPI slave. Use of the radio is not possible when using the 24MHz RC oscillator. Additionally, timers and UARTs should not be used as the exact frequency will not be known. The JN5148 device can be configured to wake up from sleep using the fast RC oscillator and automatically switch over to use the 32MHz xtal as the clock source, when it has started up. This could allow application code to be downloaded from the flash before the xtal is ready, typically improving start-up time by 550usec. Alternatively, the switch over can be controlled by software, or the system could always use the 32MHz oscillator as the clock source. 5.1.1 32MHz Oscillator The JN5148 contains the necessary on chip components to build a 32MHz reference oscillator with the addition of an external crystal resonator and two tuning capacitors. The schematic of these components are shown in Figure 9. The two capacitors, C1 and C2, should typically be 15pF and use a COG dielectric. Due to the small size of these capacitors, it is important to keep the traces to the external components as short as possible. The on chip transconductance amplifier is compensated for temperature variation, and is self-biasing by means of the internal resistor R1. The electrical specification of the oscillator can be found in section 22.3.13. Please refer to Appendix B for development support with the crystal oscillator circuit. XTALOUT C1 C2 R1 XTALIN JN5148 Figure 9: 32MHz Crystal Oscillator Connections 5.1.2 24MHz RC Oscillator An on-chip 24MHz RC oscillator is provided. No external components are required for this oscillator. The electrical specification of the oscillator can be found in section 22.3.14.20 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 5.2 32kHz System Clock The 32kHz system clock is used for timing the length of a sleep period (see section 21 Power Management and Sleep Modes) and also to generate the system clock used internally during reset. The clock can be selected from one of three sources through the application software: • 32kHz RC Oscillator • 32kHz Crystal Oscillator • 32kHz External Clock Upon a chip reset or power-up the JN5148 defaults to using the internal 32kHz RC Oscillator. If another clock source is selected then it will remain in use for all 32kHz timing until a chip reset is performed. 5.2.1 32kHz RC Oscillator The internal 32kHz RC oscillator requires no external components. The internal timing components of the oscillator have a wide tolerance due to manufacturing process variation and so the oscillator runs nominally at 32kHz ±30%. To make this useful as a timing source for accurate wakeup from sleep, a frequency calibration factor derived from the more accurate 16MHz clock may be applied. The calibration factor is derived through software, details can be found in section 11.3.1. For detailed electrical specifications, see section 22.3.11. 5.2.2 32kHz Crystal Oscillator In order to obtain more accurate sleep periods, the JN5148 contains the necessary on-chip components to build a 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be connected between 32KXTALIN and 32KXTALOUT (DIO9 and DIO10), with two equal capacitors to ground, one on each pin. Due to the small size of the capacitors, it is important to keep the traces to the external components as short as possible. The electrical specification of the oscillator can be found in section 22.3.12. The oscillator cell is flexible and can operate with a range of commonly available 32.768kHz crystals with load capacitances from 6 to 12.5pF. However, the maximum ESR of the crystal and the supply current are both functions of the actual crystal used, see appendix B.1 for more details. 32KXTALIN 32KXTALOUT JN5148 Figure 10: 32kHz crystal oscillator connections 5.2.3 32kHz External Clock An externally supplied 32kHz reference clock on the 32KIN input (DIO9) may be provided to the JN5148. This would allow the 32kHz system clock to be sourced from a very stable external oscillator module, allowing more accurate sleep cycle timings compared to the internal RC oscillator. (See section 22.2.3 I/O Characteristics, DIO9 is a 3V tolerant input)© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 21 6 Reset A system reset initialises the device to a pre-defined state and forces the CPU to start program execution from the reset vector. The reset process that the JN5148 goes through is as follows. When power is applied, the 32kHz RC oscillator starts up and stabilises, which takes approximately 100µsec. At this point, the 32MHz crystal oscillator is enabled and power is applied to the processor and peripheral logic. The logic blocks are held in reset until the 32MHz crystal oscillator stabilises, typically this takes 0.75ms. Then the internal reset is removed from the CPU and peripheral logic and the CPU starts to run code beginning at the reset vector, consisting of initialisation code and the resident boot loader. [7] Section 22.3.1 provides detailed electrical data and timing. The JN5148 has five sources of reset: • Internal Power-on Reset • External Reset • Software Reset • Watchdog timer • Brown-out detect  Note: When the device exits a reset condition, device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, then the device must be held in reset until the operating conditions are met. (See section 22.3) 6.1 Internal Power-on Reset For the majority of applications the internal power-on reset is capable of generating the required reset signal. When power is applied to the device, the power-on reset circuit monitors the rise of the VDD supply. When the VDD reaches the specified threshold, the reset signal is generated and can be observed as a rising edge on the RESETN pin. This signal is held internally until the power supply and oscillator stabilisation time has elapsed, when the internal reset signal is then removed and the CPU is allowed to run. RESETN Pin Internal RESET VDD Figure 11: Internal Power-on Reset When the supply drops below the power on reset ‘falling’ threshold, it will re-trigger the reset. Use of the external reset circuit show in Figure 12 is suggested. 22 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 RESETN C1 R1 JN5148 VDD 18k 470nF Figure 12: External Reset Generation The external resistor and capacitor provide a simple reset operation when connected to the RESETN pin. 6.2 External Reset An external reset is generated by a low level on the RESETN pin. Reset pulses longer than the minimum pulse width will generate a reset during active or sleep modes. Shorter pulses are not guaranteed to generate a reset. The JN5148 is held in reset while the RESETN pin is low. When the applied signal reaches the Reset Threshold Voltage (VRST) on its positive edge, the internal reset process starts. Multiple devices may connect to the RESETN pin in an open-collector mode. The JN5148 has an internal pull-up resistor connect to the RESETN pin. The pin is an input for an external reset, an output during the power-on reset and may optionally be an output during a software reset. No devices should drive the RESETN pin high. Internal Reset RESETN pin Reset Figure 13: External Reset 6.3 Software Reset A system reset can be triggered at any time through software control, causing a full chip reset and invalidating the RAM contents. For example this can be executed within a user’s application upon detection of a system failure. When performing the reset, the RESETN pin is driven low for 1µsec; depending on the external components this may or may not be visible on the pin. In addition, the RESETN line can be driven low by the JN5148 to provide a reset to other devices in the system (e.g. external sensors) without resetting itself. When the RESETN line is not driven it will pull back high through either the internal pull-up resistor or any external circuitry. It is essential to ensure that the RESETN line pulls back high within 100µsec after the JN5148 stops driving the line; otherwise a system reset will occur. Due to this, careful consideration should be taken of any capacitance on this line. For instance, the RC values recommended in section 6.1 may need to be replaced with a suitable reset IC© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 23 6.4 Brown-out Detect An internal brown-out detect module is used to monitor the supply voltage to the JN5148; this can be used whilst the device is awake or is in CPU doze mode. Dips in the supply voltage below a variable threshold can be detected and can be used to cause the JN5148 to perform a chip reset. Equally, dips in the supply voltage can be detected and used to cause an interrupt to the processor, when the voltage either drops below the threshold or rises above it. The brown-out detect is enabled by default from power-up and can extend the reset during power-up. This will keep the CPU in reset until the voltage exceeds the brown-out threshold voltage. The threshold voltage is configurable to 2.0V, 2.3V, 2.7V and 3.0V and is controllable by software. From power-up the threshold is set by eFuse settings and the default chip configuration is for the 2.3V threshold. It is recommended that the threshold is set so that, as a minimum, the chip is held in reset until the voltage reaches the level required by the external memory device on the SPI interface. 6.5 Watchdog Timer A watchdog timer is provided to guard against software lockups. It operates by counting cycles of the 32kHz system clock. A pre-scaler is provided to allow the expiry period to be set between typically 8ms and 16.4 seconds. Failure to restart the watchdog timer within the pre-configured timer period will cause a chip reset to be performed. A status bit is set if the watchdog was triggered so that the software can differentiate watchdog initiated resets from other resets, and can perform any required recovery once it restarts. If the source of the 32kHz system clock is the 32kHz RC oscillator then the watchdog expiry periods are subject to the variation in period of the RC oscillator. After power up, reset, start from deep sleep or start from sleep, the watchdog is always enabled with the largest timeout period and will commence counting as if it had just been restarted. Under software control the watchdog can be disabled. If it is enabled, the user must regularly restart the watchdog timer to stop it from expiring and causing a reset. The watchdog runs continuously, even during doze, however the watchdog does not operate during sleep or deep sleep, or when the hardware debugger has taken control of the CPU. It will recommence automatically if enabled once the debugger un-stalls the CPU. 24 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 7 Interrupt System The interrupt system on the JN5148 is a hardware-vectored interrupt system. The JN5148 provides several interrupt sources, some associated with CPU operations (CPU exceptions) and others which are used by hardware in the device. When an interrupt occurs, the CPU stops executing the current program and loads its program counter with a fixed hardware address specific to that interrupt. The interrupt handler or interrupt service routine is stored at this location and is run on the next CPU cycle. Execution of interrupt service routines is always performed in supervisor mode. Interrupt sources and their vector locations are listed in Table 2 below: Interrupt Source Vector Location Interrupt Definition Bus error 0x08 Typically cause by an attempt to access an invalid address or a disabled peripheral Tick timer 0x0e Tick timer interrupt asserted Alignment error 0x14 Load/store address to non-naturally-aligned location Illegal instruction 0x1a Attempt to execute an unrecognised instruction Hardware interrupt 0x20 interrupt asserted System call 0x26 System call initiated by b.sys instruction Trap 0x2c caused by the b.trap instruction or the debug unit Reset 0x38 Caused by software or hardware reset. Stack Overflow 0x3e Stack overflow Table 2: Interrupt Vectors 7.1 System Calls The b.trap and b.sys instructions allow processor exceptions to be generated by software. A system call exception will be generated when the b.sys instruction is executed. This exception can, for example, be used to enable a task to switch the processor into supervisor mode when a real time operating system is in use. (See section 3 for further details.) The b.trap instruction is commonly used for trapping errors and for debugging. 7.2 Processor Exceptions 7.2.1 Bus Error A bus error exception is generated when software attempts to access a memory address that does not exist, or is not populated with memory or peripheral registers or when writing to ROM. 7.2.2 Alignment Alignment exceptions are generated when software attempts to access objects that are not aligned to natural word boundaries. 16-bit objects must be stored on even byte boundaries, while 32-bit objects must be stored on quad byte boundaries. For instance, attempting to read a 16-bit object from address 0xFFF1 will trigger an alignment exception as will a read of a 32-bit object from 0xFFF1, 0xFFF2 or 0xFFF3. Examples of legal 32-bit object addresses are 0xFFF0, 0xFFF4, 0xFFF8 etc. 7.2.3 Illegal Instruction If the CPU reads an unrecognised instruction from memory as part of its instruction fetch, it will cause an illegal instruction exception. 7.2.4 Stack Overflow When enabled, a stack overflow exception occurs if the stack pointer reaches a programmable location.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 25 7.3 Hardware Interrupts Hardware interrupts generated from the transceiver, analogue or digital peripherals and DIO pins are individually masked using the Programmable Interrupt Controller (PIC). Management of interrupts is provided in the peripherals library [5]. For details of the interrupts generated from each peripheral see the respective section in this datasheet. Interrupts can be used to wake the JN5148 from sleep. The peripherals, baseband controller, security coprocessor and PIC are powered down during sleep but the DIO interrupts and optionally the pulse counters, wake-up timers and analogue comparator interrupts remain powered to bring the JN5148 out of sleep. Prioritised external interrupt handling (i.e., interrupts from hardware peripherals) is provided to enable an application to control an events priority to provide for deterministic program execution. The priority Interrupt controller provides 15 levels of prioritised interrupts. The priority level of all interrupts can be set, with value 0 being used to indicate that the source can never produce an external interrupt, 1 for the lowest priority source(s) and 15 for the highest priority source(s). Note that multiple interrupt sources can be assigned the same priority level if desired. If while processing an interrupt, a new event occurs at the same or lower priority level, a new external interrupt will not be triggered. However, if a new higher priority event occurs, the external interrupt will again be asserted, interrupting the current interrupt service routine. Once the interrupt service routine is complete, lower priority events can be serviced. 26 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 8 Wireless Transceiver The wireless transceiver comprises a 2.45GHz radio, modem, a baseband processor, a security coprocessor and PHY controller. These blocks, with protocol software provided as a library, implement an IEEE802.15.4 standardsbased wireless transceiver that transmits and receives data over the air in the unlicensed 2.4GHz band. 8.1 Radio Figure 14 shows the single ended radio architecture. LNA synth PA ADC Reference & Bias Switch Radio Calibration Lim1 Lim2 Lim3 Lim4 sigma delta D-Type Figure 14: Radio Architecture The radio comprises a low-IF receive path and a direct modulation transmit path, which converge at the TX/RX switch. The switch connects to the external single ended matching network, which consists of two inductors and a capacitor, this arrangement creates a 50Ω port and removes the need for a balun. A 50Ω single ended antenna can be connected directly to this port. The 32MHz crystal oscillator feeds a divider, which provides the frequency synthesiser with a reference frequency. The synthesiser contains programmable feedback dividers, phase detector, charge pump and internal Voltage Controlled Oscillator (VCO). The VCO has no external components, and includes calibration circuitry to compensate for differences in internal component values due to process and temperature variations. The VCO is controlled by a Phase Locked Loop (PLL) that has an internal loop filter. A programmable charge pump is also used to tune the loop characteristic. The receiver chain starts with the low noise amplifier / mixer combination whose outputs are passed to a lowpass filter, which provides the channel definition. The signal is then passed to a series of amplifier blocks forming a limiting strip. The signal is converted to a digital signal before being passed to the Modem. The gain control for the RX path is derived in the automatic gain control (AGC) block within the Modem, which samples the signal level at various points down the RX chain. To improve the performance and reduce current consumption, automatic calibration is applied to various blocks in the RX path. In the transmit direction, the digital stream from the Modem is passed to a digital sigma-delta modulator which controls the feedback dividers in the synthesiser, (dual point modulation). The VCO frequency now tracks the applied modulation. The 2.4 GHz signal from the VCO is then passed to the RF Power Amplifier (PA), whose power control can be selected from one of three settings. The output of the PA drives the antenna via the RX/TX switch© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 27 8.1.1 Radio External Components In order to realise the full performance of the radio it is essential that the reference PCB layout and BOM are carefully followed. See Appendix B.4. The radio is powered from a number of internal 1.8V regulators fed from the analogue supply VDD1, in order to provide good noise isolation between the digital logic of the JN5148 and the analogue blocks. These regulators are also controlled by the baseband controller and protocol software to minimise power consumption. Decoupling for internal regulators is required as described in section 2.2.1, Power Supplies For single ended antennas or connectors, a balun is not required, however a matching network is needed. The RF matching network requires three external components and the IBIAS pin requires one external component as shown in schematic in B.4.1. These components are critical and should be placed close to the JN5148 pins and analogue ground as defined in Table 8: JN5148 Printed Antenna Reference Module Components and PCB Layout Constraints. Specifically, the output of the network comprising L2, C1 and L1 is designed to present an accurate match to a 50 ohm resistive network as well as provide a DC path to the final output stage or antenna. Users wishing to match to other active devices such as amplifiers should design their networks to match to 50 ohms at the output of L1 R1 43K IBIAS C20 100nF L2 2.7nH VB_RF VREF VB_RF2 RF_IN C12 47pF C3 100nF VB_RF1 C1 47pF L1 5.6nH To Coaxial Socket or Integrated Antenna VB_RF Figure 15 External Radio Components 8.1.2 Antenna Diversity Support is provided for antenna diversity. Antenna diversity is a technique that maximises the performance of an antenna system. It allows the radio to switch between two antennas that have very low correlation between their received signals. Typically, this is achieved by spacing two antennas around 0.25 wavelengths apart or by using two orthogonal polarisations. So, if a packet is transmitted and no acknowledgement is received, the radio system can switch to the other antenna for the retry, with a different probability of success. The JN5148 provides an output (ADO) on DIO12 that is asserted on odd numbered retries and optionally its complement (ADE) on DIO13, that can be used to control an antenna switch; this enables antenna diversity to be implemented easily (see Figure 16 and Figure 17).28 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Antenna A Antenna B A B COM SEL SELB ADO (DIO[12]) ADE (DIO[13]) Device RF Port RF Switch: Single-Pole, Double-Throw (SPDT) Figure 16 Simple Antenna Diversity Implementation using External RF Switch ADO (DIO[12]) TX Active RX Active ADE (DIO[13]) 1st TX-RX Cycle 2nd TX-RX Cycle (1st Retry) Figure 17 Antenna Diversity ADO Signal for TX with Acknowledgement If two DIO pins cannot be spared, DIO13 can be configured to be a normal DIO pin, and the inverse of ADO generated with an inverter on the PCB. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 29 8.2 Modem The modem performs all the necessary modulation and spreading functions required for digital transmission and reception of data at 250kbps in the 2450MHz radio frequency band in compliance with the IEEE802.15.4 standard. It also provides a high data rate modes at 500 and 667kbps. AGC Demodulation Symbol Detection (Despreading) Modulation Spreading TX RX TX Data Interface RX Data Interface VCO Sigma-Delta Modulator IF Signal Gain Figure 18 Modem Architecture Features provided to support network channel selection algorithms include Energy Detection (ED), Link Quality Indication (LQI) and fully programmable Clear Channel Assessment (CCA). The Modem provides a digital Receive Signal Strength Indication (RSSI) that facilitates the implementation of the IEEE 802.15.4 ED function and LQI function. The ED and LQI are both related to receiver power in the same way, as shown in Fig19. LQI is associated with a received packet, whereas ED is an indication of signal power on air at a particular moment. The CCA capability of the Modem supports all modes of operation defined in the IEEE 802.15.4 standard, namely Energy above ED threshold, Carrier Sense and Carrier Sense and/or energy above ED threshold. Figure 19 Energy Detect Value vs Receive Power Level30 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 8.3 Baseband Processor The baseband processor provides all time-critical functions of the IEEE802.15.4 MAC layer. Dedicated hardware guarantees air interface timing is precise. The MAC layer hardware/software partitioning, enables software to implement the sequencing of events required by the protocol and to schedule timed events with millisecond resolution, and the hardware to implement specific events with microsecond timing resolution. The protocol software layer performs the higher-layer aspects of the protocol, sending management and data messages between endpoint and coordinator nodes, using the services provided by the baseband processor. Append Checksum Verify Checksum CSMA CCA Backoff Control Deserialiser Serialiser Tx/Rx Frame Buffer Tx Bitstream Rx Bitstream Protocol Timing Engine Supervisor Radio Status Control Processor Bus Protocol Timers Security Coprocessor Decrypt Port Encrypt Port AES Codec Figure 20: Baseband Processor 8.3.1 Transmit A transmission is performed by software writing the data to be transferred into the Tx/Rx Frame Buffer, together with parameters such as the destination address and the number of retries allowed, and programming one of the protocol timers to indicate the time at which the frame is to be sent. This time will be determined by the software tracking the higher-layer aspects of the protocol such as superframe timing and slot boundaries. Once the packet is prepared and protocol timer set, the supervisor block controls the transmission. When the scheduled time arrives, the supervisor controls the sequencing of the radio and modem to perform the type of transmission required. It can perform all the algorithms required by IEEE802.15.4 such as CSMA/CA, GTS without processor intervention including retries and random backoffs. When the transmission begins, the header of the frame is constructed from the parameters programmed by the software and sent with the frame data through the serialiser to the Modem. At the same time, the radio is prepared for transmission. During the passage of the bitstream to the modem, it passes through a CRC checksum generator that calculates the checksum on-the-fly, and appends it to the end of the frame. If using slotted access, it is possible for a transmission to overrun the time in its allocated slot; the Baseband Processor handles this situation autonomously and notifies the protocol software via interrupt, rather than requiring it to handle the overrun explicitly. 8.3.2 Reception During reception, the radio is set to receive on a particular channel. On receipt of data from the modem, the frame is directed into the Tx/Rx Frame Buffer where both header and frame data can be read by the protocol software. An interrupt may be provided on receipt of the frame header. As the frame data is being received from the modem it is passed through a checksum generator; at the end of the reception the checksum result is compared with the checksum at the end of the message to ensure that the data has been received correctly. An interrupt may be © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 31 provided to indicate successful packet reception. During reception, the modem determines the Link Quality, which is made available at the end of the reception as part of the requirements of IEEE802.15.4. 8.3.3 Auto Acknowledge Part of the protocol allows for transmitted frames to be acknowledged by the destination sending an acknowledge packet within a very short window after the transmitted frame has been received. The JN5148 baseband processor can automatically construct and send the acknowledgement packet without processor intervention and hence avoid the protocol software being involved in time-critical processing within the acknowledge sequence. The JN5148 baseband processor can also request an acknowledge for packets being transmitted and handle the reception of acknowledged packets without processor intervention. 8.3.4 Beacon Generation In beaconing networks, the baseband processor can automatically generate and send beacon frames; the repetition rate of the beacons is programmed by the CPU, and the baseband then constructs the beacon contents from data delivered by the CPU. The baseband processor schedules the beacons and transmits them without CPU intervention. 8.3.5 Security The transmission and reception of secured frames using the Advanced Encryption Standard (AES) algorithm is handled by the security coprocessor and the stack software. The application software must provide the appropriate encrypt/decrypt keys for the transmission or reception. On transmission, the key can be programmed at the same time as the rest of the frame data and setup information. 8.4 Security Coprocessor The security coprocessor is available to the application software to perform encryption/decryption operations. A hardware implementation of the encryption engine significantly speeds up the processing of the encrypted packets over a pure software implementation. The AES library for the JN5148 provides operations that utilise the encryption engine in the device and allow the contents of memory buffers to be transformed. Information such as the type of security operation to be performed and the encrypt/decrypt key to be used must also be provided. Processor Interface AES Block Encrpytion Controller AES Encoder Key Generation Figure 21: Security Coprocessor Architecture 8.5 Location Awareness The JN5148 provides the ability for an application to obtain the Time Of Flight (TOF) between two network nodes. The TOF information is an alternative metric to that of the existing Energy Detect value (RSSI) that has been typically used for calculating the relative inter-nodal separation, for subsequent use in a location awareness system. For short ranges RSSI will typically give a better accuracy than TOF, however for distances above 5 to 10 meters TOF will offer significant improvements in accuracy compared to RSSI. In general, the RSSI error scales with distance, such that if the distance doubles then the error doubles.32 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 8.6 Higher Data Rates To support the demands of applications that require high data throughputs such as in audio or data streaming applications, the JN5148 supports higher data rate modes that offer 500kbps or 667kbps on air transmission rates. The switching between standard and higher data rates is controlled via software, When operating in a higher data rate mode standard IEEE802.15.4 features, such as clear channel assessment, can still be used. This allows the JN5148 in a higher data rate mode to co-exist in an IEEE802.15.4 based network (adhering to the correct bit rates and frame timing etc.) whilst at the same time providing the benefit of the higher data rate where required. When operating in a higher data rate mode, the receive sensitivity will be degraded by at least 3dB.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 33 9 Digital Input/Output There are 21 Digital I/O (DIO) pins, which can be configured as either an input or an output, and each has a selectable internal pull-up resistor. Most DIO pins are multiplexed with alternate peripheral features of the device, see section 2.1. Once a peripheral is enabled it takes precedence over the device pins. Refer to the individual module sections for a full description of the alternate peripherals functions. Following a reset (and whilst the reset input is held low), all peripherals are off and the DIO pins are configured as inputs with the internals pull-ups turned on. When a peripheral is not enabled, the DIO pins associated with it can be used as digital inputs or outputs. Each pin can be controlled individually by setting the direction and then reading or writing to the pin. The individual pull-up resistors, RPU, can also be enabled or disabled as needed and the setting is held through sleep cycles. The pull-ups are generally configured once after reset depending on the external components and functionality. For instance, outputs should generally have the pull-ups disabled. An input that is always driven should also have the pull-up disabled. When configured as an input each pin can be used to generate an interrupt upon a change of state (selectable transition either from low to high or high to low); the interrupt can be enabled or disabled. When the device is sleeping, these interrupts become events that can be used to wake the device up. Equally the status of the interrupt may be read. See section 21 Power Management and Sleep Modes for further details on sleep and wakeup. The state of all DIO pins can be read, irrespective of whether the DIO is configured as an input or an output. Throughout a sleep cycle the direction of the DIO, and the state of the outputs, is held. This is based on the resultant of the GPIO Data/ Direction registers and the effect of any enabled peripherals at the point of entering sleep. Following a wake-up these directions and output values are maintained under control of the GPIO data / direction registers. Any peripherals enabled before the sleep cycle are not automatically re-enabled, this must be done through software after the wake-up. For example, if DIO0 is configured to be SPISEL1 then it becomes an output. The output value is controlled by the SPI functional block. If the device then enters a sleep cycle, the DIO will remain an output and hold the value being output when entering sleep. After wake-up the DIO will still be an output with the same value but controlled from the GPIO Data/Direction registers. It can be altered with the software functions that adjust the DIO, or the application may re-configure it to be SPISEL1. Unused DIO pins are recommended to be set as inputs with the pull-up enabled. Two DIO pins can optionally be used to provide control signals for RF circuitry (eg switches and PA) in high power range extenders. DIO3 / RFTX is asserted when the radio is in the transmit state and similarly, DIO2 / RFRX is asserted when the radio is in the receiver state.34 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 4-wire Digital Audio Interface Antenna Diversity JTAG Debug Pulse Counters Intelligent Peripheral MUX 2-wire Interface Timer2 Timer1 Timer0 UART1 UART0 SPI Master SPISEL1 SPISEL2 SPISEL3 SPISEL4 TXD0 RXD0 RTS0 CTS0 TXD1 RXD1 RTS1 CTS1 TIM0CK_GT TIM0OUT TIM0CAP TIM1CK_GT TIM1OUT TIM1CAP TIM2OUT SIF_D SIF_CLK IP_DO IP_DI IP_INT IP_CLK IP_SEL PC0 PC1 JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO ADO ADE I2S_OUT I2S_DIN I2S_CLK I2S_SYNC SPICLK SPIMOSI SPIMISO SPISEL0 DIO0/SPISEL1 DIO1/SPISEL2/PC0 DIO2/SPISEL3/RFRX DIO3/SPISEL4/RFTX DIO4/CTS0/JTAG_TCK DIO5/RTS0/JTAG_TMS DIO6/TXD0/JTAG_TDO DIO7/RXD0/JTAG_TDI DIO8/TIM0CK_GT/PC1 DIO9/TIM0CAP/32KXTALIN/32KIN DIO10/TIM0OUT/32KXTALOUT DIO11/TIM1CK_GT/TIM2OUT DIO12/TIM1CAP/ADO/DAI_WS DIO13/TIM1OUT/ADE/DAI_SDN DIO14/SIF_CLK/IP_CLK DIO15/SIF_D/IP_DO DIO16/IP_DI DIO17/CTS1/IP_SEL/DAI_SCK/ JTAG_TCK DIO18/RTS1/IP_INT/DAI_SDOUT/ JTAG_TMS DIO19/TXD1/JTAG_TDO DIO20/RXD1/JTAG_TDI Figure 22 DIO Block Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 35 10 Serial Peripheral Interface The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the JN5148 and peripheral devices. The JN5148 operates as a master on the SPI bus and all other devices connected to the SPI are expected to be slave devices under the control of the JN5148 CPU. The SPI includes the following features: • Full-duplex, three-wire synchronous data transfer • Programmable bit rates (up to 16Mbit/s) • Programmable transaction size up to 32-bits • Standard SPI modes 0,1,2 and 3 • Manual or Automatic slave select generation (up to 5 slaves) • Maskable transaction complete interrupt • LSB First or MSB First Data Transfer • Supports delayed read edges Clock Divider SPI Bus Cycle Controller Data Buffer DIV Clock Edge Select Data CHAR_LEN LSB SPIMISO SPIMOSI SPICLK Select Latch SPISEL [4..0] 16 MHz Figure 23: SPI Block Diagram The SPI bus employs a simple shift register data transfer scheme. Data is clocked out of and into the active devices in a first-in, first-out fashion allowing SPI devices to transmit and receive data simultaneously. There are three dedicated pins SPICLK, SPIMOSI, SPIMISO that are shared across all devices on the bus. MasterOut-Slave-In or Master-In-Slave-Out data transfer is relative to the clock signal SPICLK generated by the JN5148. The JN5148 provides five slave selects, SPISEL0 to SPISEL4 to allow five SPI peripherals on the bus. SPISEL0 is a dedicated pin; this is generally connected to a serial Flash/ EEPROM memory holding application code that is downloaded to internal RAM via software from reset. SPISEL1 to 4, are alternate functions of pins DIO0 to 3 respectively. The interface can transfer from 1 to 32-bits without software intervention and can keep the slave select lines asserted between transfers when required, to enable longer transfers to be performed. When the device reset is active, the three outputs SPISEL, SPICLK and SPI_MOSI are tri-stated and SPI_MISO is set to be an input. The pull-up resistors associated with all four pins will be active at this time. 36 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 SI C SO SS Slave 0 Flash/ EEPROM Memory JN5148 37 38 41 42 43 36 33 34 SI C SO SS Slave 1 User Defined SI C SO SS Slave 2 User Defined SI C SO SS Slave 3 User Defined SI C SO SS Slave 4 User Defined SPIMISO SPIMOSI SPICLK SPISEL4 SPISEL2 SPISEL3 SPISEL1 SPISEL0 Figure 24: Typical JN5148 SPI Peripheral Connection The data transfer rate on the SPI bus is determined by the SPICLK signal. The JN5148 supports transfers at selectable data rates from 16MHz to 125kHz selected by a clock divider. Both SPICLK clock phase and polarity are configurable. The clock phase determines which edge of SPICLK is used by the JN5148 to present new data on the SPIMOSI line; the opposite edge will be used to read data from the SPIMISO line. The interface should be configured appropriately for the SPI slave being accessed. SPICLK Mode Description Polarity (CPOL) Phase (CPHA) 0 0 0 SPICLK is low when idle – the first edge is positive. Valid data is output on SPIMOSI before the first clock and changes every negative edge. SPIMISO is sampled every positive edge. 0 1 1 SPICLK is low when idle – the first edge is positive. Valid data is output on SPIMOSI every positive edge. SPIMISO is sampled every negative edge. 1 0 2 SPICLK is high when idle – the first edge is negative. Valid data is output on SPIMOSI before the first clock edge and is changed every positive edge. SPIMISO is sampled every negative edge. 1 1 3 SPICLK is high when idle – the first edge is negative. Valid data is output on SPIMOSI every negative edge. SPIMISO is sampled every positive edge. Table 3 SPI Configurations If more than one SPISEL line is to be used in a system they must be used in numerical order starting from SPISEL0. For instance if 3 SPI select lines are to be used, they must be SPISEL0, 1 and 2. A SPISEL line can be automatically deasserted between transactions if required, or it may stay asserted over a number of transactions. For devices such as memories where a large amount of data can be received by the master by continually providing SPICLK transitions, the ability for the select line to stay asserted is an advantage since it keeps the slave enabled over the whole of the transfer. A transaction commences with the SPI bus being set to the correct configuration, and then the slave device is selected. Upon commencement of transmission (1 to 32 bits) data is placed in the FIFO data buffer and clocked out, at the same time generating the corresponding SPICLK transitions. Since the transfer is full-duplex, the same number of data bits is being received from the slave as it transmits. The data that is received during this transmission can be read (1 to 32 bits). If the master simply needs to provide a number of SPICLK transitions to allow data to be © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 37 sent from a slave, it should perform transmit using dummy data. An interrupt can be generated when the transaction has completed or alternatively the interface can be polled. If a slave device wishes to signal the JN5148 indicating that it has data to provide, it may be connected to one of the DIO pins that can be enabled as an interrupt. Figure 25 shows a complex SPI transfer, reading data from a FLASH device, that can be achieved using the SPI master interface. The slave select line must stay low for many separate SPI accesses, and therefore manual slave select mode must be used. The required slave select can then be asserted (active low) at the start of the transfer. A sequence 8 and 32 bit transfers can be used to issue the command and address to the FLASH device and then to read data back. Finally, the slave select can be deselected to end the transaction. 0 1 2 3 4 5 6 7 Instruction (0x03) 23 22 21 3 2 1 0 8 9 10 28 29 30 31 24-bit Address MSB Instruction Transaction 7 6 5 4 3 2 1 0 MSB 0 1 2 3 4 5 7 8N-1 3 2 1 0 LSB Read Data Bytes Transaction(s) 1-N SPISEL SPICLK SPIMOSI SPIMISO SPISEL SPICLK SPIMOSI SPIMISO 8 9 10 7 6 5 MSB Byte 1 Byte 2 Byte N value unused by peripherals 6 Figure 25: Example SPI Waveforms – Reading from FLASH device using Mode 038 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 11 Timers 11.1 Peripheral Timer/Counters Three general-purpose timer/counter units are available that can be independently configured to operate in one of five possible modes. Timer 0 and 1 support all 5 modes of operation and Timer 2 supports PWM and Delta-Sigma modes only. The timers have the following: • 5-bit prescaler, divides system clock by 2 prescale value as the clock to the timer (prescaler range is 0 to 16) • Clocked from internal system clock (16MHz) • 16-bit counter, 16-bit Rise and Fall (period) registers • Timer: can generate interrupts off Rise and Fall counts. Can be gated by external signal • Counter: counts number of transitions on external event signal. Can use low-high, high-low or both transitions • PWM/Single pulse: outputs repeating Pulse Width Modulation signal or a single pulse. Can set period and mark-space ratio • Capture: measures times between transitions of an applied signal • Delta-Sigma: Return-To-Zero (RTZ) and Non-Return-to-Zero (NRZ) modes • Timer usage of external IO can be controlled on a pin by pin basis Interrupt Generator Rise Fall Delta-Sigma Counter Reset Generator = Prescaler INT Int Enable SYSCLK S/w Reset System Reset Single Shot = S R OE Gate Gate Edge Select Reset PWM/DeltaSigma Capture Generator Capture Enable PWM/∆−Σ PWM/∆−Σ TIMxCK_GT TIMxOUT TIMxCAP Figure 26: Timer Unit Block Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 39 The clock source for the timer unit is fed from the 16MHz system clock. This clock passes to a 5-bit prescaler where a value of 0 leaves the clock unmodified and other values divide it by 2 prescale value. For example, a prescale value of 2 applied to the 16MHz system clock source results in a timer clock of 4MHz. The counter is optionally gated by a signal on the clock/gate input (TIMxCK_GT). If the gate function is selected, then the counter is frozen when the clock/gate input is high. An interrupt can be generated whenever the counter is equal to the value in either of the High or Low registers. The internal Output Enable (OE) signal enables or disables the timer output. The Timer 0 signals CK_GT, CAP and OUT are alternate functions of pins DIO8, 9 and 10 respectively and Timer 1 signals CK_GT, CAP and OUT are alternate functions of pins DIO11, 12, and 13 respectively. Timer 2 OUT is an alternate function of DIO11 If operating in timer mode it is not necessary to use any of the DIO pins, allowing the standard DIO functionality to be available to the application. Note, timer 0 may only be used as an internal timer or in counter mode (counting events) if an external 32kHz crystal is used. If timer 2 is used in PWM or Delta-Sigma mode then timer 1 does not have access to its clock/gate pin. Therefore, it can not operate in counter mode (counting events) or use the gate function. 11.1.1 Pulse Width Modulation Mode Pulse Width Modulation (PWM) mode allows the user to specify an overall cycle time and pulse length within the cycle. The pulse can be generated either as a single shot or as a train of pulses with a repetition rate determined by the cycle time. In this mode, the cycle time and low periods of the PWM output signal can be set by the values of two independent 16-bit registers (Fall and Rise). The counter increments and its output is compared to the 16-bit Rise and Fall registers. When the counter is equal to the Rise register, the PWM output is set to high; when the counter reaches the Fall value, the output returns to low. In continuous mode, when the counter reaches the Fall value, it will reset and the cycle repeats. The PWM waveform is available on TIMxOUT when the output driver is enabled. Rise Fall Figure 27: PWM Output Timings 11.1.2 Capture Mode The capture mode can be used to measure the time between transitions of a signal applied to the capture input (TIMxCAP). When the capture is started, on the next low-to-high transition of the captured signal, the count value is stored in the Rise register, and on the following high-to-low transition, the counter value is stored in the Fall register. The pulse width is the difference in counts in the two registers multiplied by the period of the prescaled clock. Upon reading the capture registers the counter is stopped. The values in the High and Low registers will be updated whenever there is a corresponding transition on the capture input, and the value stored will be relative to when the mode was started. Therefore, if multiple pulses are seen on TIMxCAP before the counter is stopped only the last pulse width will be stored.40 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 CLK CAPT x 9 3 x 14 t RISE t RISE t FALL t FALL Rise Fall 9 5 3 4 7 Capture Mode Enabled Figure 28: Capture Mode 11.1.3 Counter/Timer Mode The counter/timer can be used to generate interrupts, based on the timers or event counting, for software to use. As a timer the clock source is from the system clock, prescaled if required. The timer period is programmed into the Fall register and the Fall register match interrupt enabled. The timer is started as either a single-shot or a repeating timer, and generates an interrupt when the counter reaches the Fall register value. When used to count external events on TIMxCK_GT the clock source is selected from the input pin and the number of events programmed into the Fall register. The Fall register match interrupt is enabled and the counter started, usually in single shot mode. An interrupt is generated when the programmed number of transitions is seen on the input pin. The transitions counted can configured to be rising, falling or both rising and falling edges. Edges on the event signal must be at least 100nsec apart, i.e. pulses must be wider than 100nsec. 11.1.4 Delta-Sigma Mode A separate delta-sigma mode is available, allowing a low speed delta-sigma DAC to be implemented with up to 16-bit resolution. This requires that a resistor-capacitor network is placed between the output DIO pin and digital ground. A stream of pulses with digital voltage levels is generated which is integrated by the RC network to give an analogue voltage. A conversion time is defined in terms of a number of clock cycles. The width of the pulses generated is the period of a clock cycle. The number of pulses output in the cycle, together with the integrator RC values, will determine the resulting analogue voltage. For example, generating approximately half the number of pulses that make up a complete conversion period will produce a voltage on the RC output of VDD1/2, provided the RC time constant is chosen correctly. During a conversion, the pulses will be pseudo-randomly dispersed throughout the cycle in order to produce a steady voltage on the output of the RC network. The output signal is asserted for the number of clock periods defined in the High register, with the total period being 216 cycles. For the same value in the High register, the pattern of pulses on subsequent cycles is different, due to the pseudo-random distribution. The delta-sigma convertor output can operate in a Return-To-Zero (RTZ) or a Non-Return-to-Zero (NRZ) mode. The NRZ mode will allow several pulses to be output next to each other. The RTZ mode ensures that each pulse is separated from the next by at least one period. This improves linearity if the rise and fall times of the output are different to one another. Essentially, the output signal is low on every other output clock period, and the conversion cycle time is twice the NRZ cycle time ie 217 clocks. The integrated output will only reach half VDD2 in RTZ mode, since even at full scale only half the cycle contains pulses. Figure 29 and Figure 30 illustrate the difference between RTZ and NRZ for the same programmed number of pulses.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 41 1 2 3 1 2 N Conversion cycle 1 217 N Conversion cycle 2 3 Figure 29: Return To Zero Mode in Operation 1 2 3 1 2 N Conversion cycle 1 N 3 216 Conversion cycle 2 Figure 30: Non-Return to Zero Mode 11.1.5 Example Timer / Counter Application Figure 31 shows an application of the JN5148 timers to provide closed loop speed control. Timer 0 is configured in PWM mode to provide a variable mark-space ratio switching waveform to the gate of the NFET. This in turn controls the power in the DC motor. Timer 1 is configured to count the rising edge events on the clk/gate pin over a constant period. This converts the tacho pulse stream output into a count proportional to the motor speed. This value is then used by the application software executing the control algorithm. If required for other functionality, then the unused IO associated with the timers could be used as general purpose DIO. JN5148 Timer 0 Timer 1 CLK/GATE CLK/GATE CAPTURE CAPTURE PWM PWM M Tacho 48 50 52 53 54 1N4007 +12V IRF521 51 1 pulse/rev Figure 31: Closed Loop PWM Speed Control Using JN5148 Timers 11.2 Tick Timer The JN5148 contains a hardware timer that can be used for generating timing interrupts to software. It may be used to implement regular events such as ticks for software timers or an operating system, as a high-precision timing reference or can be used to implement system monitor timeouts as used in a watchdog timer. Features include: • 32-bit counter42 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 • 28-bit match value • Maskable timer interrupt • Single-shot, Restartable or Continuous modes of operation Match Value Counter = Mode Control & & SysClk Run Match Int Enable Tick Timer Interrupt Reset Mode Figure 32: Tick Timer The Tick Timer is clocked from a continuous 16MHz clock, which is fed to a 32-bit wide resettable up-counter, gated by a signal from the mode control block. A match register allows comparison between the counter and a programmed value. The match value, measured in 16MHz clock cycles is programmed through software, in the range 0 to 0x0FFFFFFF. The output of the comparison can be used to generate an interrupt if the interrupt is enabled and used in controlling the counter in the different modes. Upon configuring the timer mode, the counter is also reset. If the mode is programmed as single shot, the counter begins to count from zero until the match value is reached. The match signal will be generated which will cause an interrupt if enabled, and the counter will stop counting. The counter is restarted by reprogramming the mode. If the mode is programmed as restartable, the operation of the counter is the same as for the single shot mode, except that when the match value is reached the counter is reset and begins counting from zero. An interrupt will be generated when the match value is reached if it is enabled. Continuous mode operation is similar to restartable, except that when the match value is reached, the counter is not reset but continues to count. An interrupt will be generated when the match value is reached if enabled. 11.3 Wakeup Timers Two 32-bit wakeup timers are available in the JN5148 driven from the 32kHz internal clock. They may run during sleep periods when the majority of the rest of the device is powered down, to time sleep periods or other long period timings that may be required by the application. The wakeup timers do not run during deep sleep and may optionally be disabled in sleep mode through software control. When a wakeup timer expires it typically generates an interrupt, if the device is asleep then the interrupt may be used as an event to end the sleep period. See Section 21 for further details on how they are used during sleep periods. Features include: • 35-bit down-counter • Optionally runs during sleep periods • Clocked by 32kHz system clock; either 32kHz RC oscillator, 32kHz XTAL oscillator or 32kHz clock input© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 43 A wakeup timer consists of a 35-bit down counter clocked from the selected 32 kHz clock. An interrupt or wakeup event can be generated when the counter reaches zero. On reaching zero the counter will continue to count down until stopped, which allows the latency in responding to the interrupt to be measured. If an interrupt or wakeup event is required, the timer interrupt should be enabled before loading the count value for the period. Once the count value is loaded and counter started, the counter begins to count down; the counter can be stopped at any time through software control. The counter will remain at the value it contained when the timer was stopped and no interrupt will be generated. The status of the timers can be read to indicate if the timers are running and/or have expired; this is useful when the timer interrupts are masked. This operation will reset any expired status flags. 11.3.1 RC Oscillator Calibration The RC oscillator that can be used to time sleep periods is designed to require very little power to operate and be self-contained, requiring no external timing components and hence is lower cost. As a consequence of using on-chip resistors and capacitors, the inherent absolute accuracy and temperature coefficient is lower than that of a crystal oscillator, but once calibrated the accuracy approaches that of a crystal oscillator. Sleep time periods should be as close to the desired time as possible in order to allow the device to wake up in time for important events, for example beacon transmissions in the IEEE802.15.4 protocol. If the sleep time is accurate, the device can be programmed to wake up very close to the calculated time of the event and so keep current consumption to a minimum. If the sleep time is less accurate, it will be necessary to wake up earlier in order to be certain the event will be captured. If the device wakes earlier, it will be awake for longer and so reduce battery life. In order to allow sleep time periods to be as close to the desired length as possible, the true frequency of the RC oscillator needs to be determined to better than the initial 30% accuracy. The calibration factor can then be used to calculate the true number of nominal 32kHz periods needed to make up a particular sleep time. A calibration reference counter, clocked from the 16MHz system clock, is provided to allow comparisons to be made between the 32kHz RC clock and the 16MHz system clock when the JN5148 is awake. Wakeup timer0 counts for a set number of 32kHz clock periods during which time the reference counter runs. When the wakeup timer reaches zero the reference counter is stopped, allowing software to read the number of 16MHz clock ticks generated during the time represented by the number of 32kHz ticks programmed in the wakeup timer. The true period of the 32kHz clock can thus be determined and used when programming a wakeup timer to achieve a better accuracy and hence more accurate sleep periods For a RC oscillator running at exactly 32,000Hz the value returned by the calibration procedure should be 10000, for a calibration period of twenty 32,000Hz clock periods. If the oscillator is running faster than 32,000Hz the count will be less than 10000, if running slower the value will be higher. For a calibration count of 9000, indicating that the RC oscillator period is running at approximately 35kHz, to time for a period of 2 seconds the timer should be loaded with 71,111 ((10000/9000) x (32000 x 2)) rather than 64000.44 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 12 Pulse Counters Two 16-bit counters are provided that can increment during all modes of operation (including sleep), based on pulses received on 2 dedicated DIO inputs; DIO1 and DIO8. The pulses can be de-bounced using the 32kHz clock to guard against false counting on slow or noisy edges. Increments occur from a configurable rising or falling edge on the respective DIO input. Each counter has an associated 16-bit reference that is loaded by the user. An interrupt (and wakeup event if asleep) may be generated when a counter reaches its pre-configured reference value. The two counters may optionally be cascaded together to provide a single 32-bit counter, linked to DIO1. The counters do not saturate at 65535, but naturally roll-over to 0. Additionally, the pulse counting continues when the reference value is reached without software interaction so that pulses are not missed even if there is a long delay before an interrupt is serviced or during the wakeup process. The system can work with signals up to 100kHz, with no debounce, or from 5.3kHz to 1.7kHz with debounce. When using debounce the 32kHz clock must be active, so for minimum sleep currents the debounce mode should not be used.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 45 13 Serial Communications The JN5148 has two independent Universal Asynchronous Receiver/Transmitter (UART) serial communication interfaces. These provide similar operating features to the industry standard 16550A device operating in FIFO mode. Each interface performs serial-to-parallel conversion on incoming serial data and parallel-to-serial conversion on outgoing data from the CPU to external devices. In both directions, a 16-byte deep FIFO buffer allows the CPU to read and write multiple characters on each transaction. This means that the CPU is freed from handling data on a character-by-character basis, with the associated high processor overhead. The UARTs have the following features: • Emulates behaviour of industry standard NS16450 and NS16550A UARTs • 16 byte transmit and receive FIFO buffers reduce interrupts to CPU, with direct access to fill levels of each • Adds / deletes standard start, stop and parity communication bits to or from the serial data • Independently controlled transmit, receive, status and data sent interrupts • Optional modem flow control signals CTS and RTS • Fully programmable data formats: baud rate, start, stop and parity settings • False start bit detection, parity, framing and FIFO overrun error detect and break indication • Internal diagnostic capabilities: loop-back controls for communications link fault isolation • Flow control by software or automatically by hardware Processor Bus Divisor Latch Registers Line Status Register Line Control Register FIFO Control Register Receiver FIFO Transmitter FIFO Baud Generator Logic Transmitter Shift Register Receiver Shift Register Transmitter Logic Receiver Logic RXD TXD Modem Control Register Modem Status Register Modem Signals Logic RTS CTS Interrupt ID Register Interrupt Enable Register Interrupt Logic Internal Interrupt Figure 33: UART Block Diagram The serial interface contains programmable fields that can be used to set number of data bits (5, 6,7 or 8), even, odd, set-at-1, set-at-0 or no-parity detection and generation of single or multiple stop bit, (for 5 bit data, multiple is 1.5 stop bits; for 6, 7 or 8 data bits, multiple is 2 bits). The baud rate is programmable up to 1Mbps, standard baud rates such as 4800, 9600, 19.2k, 38.4k etc. can be configured. For applications requiring hardware flow control, two control signals are provided: Clear-To-Send (CTS) and RequestTo-Send (RTS). CTS is an indication sent by an external device to the UART that it is ready to receive data. RTS is an indication sent by the UART to the external device that it is ready to receive data. RTS is controlled from software, while the value of CTS can be read. Monitoring and control of CTS and RTS is a software activity, normally performed as part of interrupt processing. The signals do not control parts of the UART hardware, but simply indicate to software the state of the UART external interface. Alternatively, the Automatic Flow Control mode can be set 46 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 where the hardware controls the value of the generated RTS (negated if the receive FIFO fill level is greater than a programmable threshold of 8, 11, 13 or 15 bytes), and only transmits data when the incoming CTS is asserted. Software can read characters, one byte at a time, from the Receive FIFO and can also write to the Transmit FIFO, one byte at a time. The Transmit and Receive FIFOs can be cleared and reset independently of each other. The status of the transmitter can be checked to see if it is empty, and if there is a character being transmitted. The status of the receiver can also be checked, indicating if conditions such as parity error, framing error or break indication have occurred. It also shows if an overrun error occurred (receive buffer full and another character arrives) and if there is data held in the receive FIFO. UART 0 signals CTS, RTS, TXD and RXD are alternate functions of pins DIO4, 5, 6 and 7 respectively and UART 1 signals CTS, RTS, TXD and RXD are alternate functions of pins DIO17, 18, 19 and 20 respectively. If CTS and RTS are not required on the devices external pins, then they may be disabled, this allows the DIOx function to be used for other purposes. Note: With the automatic flow control threshold set to 15, the hardware flow control within the UART block negates RTS when the receive FIFO is about to become full. In some instances it has been observed that remote devices that are transmitting data do not respond quickly enough to the de-asserted CTS and continue to transmit data. In these instances the data will be lost in a receive FIFO overflow. 13.1 Interrupts Interrupt generation can be controlled for the UART block, and is divided into four categories: • Received Data Available: Is set when data in the Rx FIFO queue reaches a particular level (the trigger level can be configured as 1, 4, 8 or 14) or if no character has been received for 4 character times. • Transmit FIFO Empty: set when the last character from the Tx FIFO is read and starts to be transmitted. • Receiver Line Status: set when one of the following occur (1) Parity Error - the character at the head of the receive FIFO has been received with a parity error, (2) Overrun Error - the Rx FIFO is full and another character has been received at the Receiver shift register, (3) Framing Error - the character at the head of the receive FIFO does not have a valid stop bit and (4) Break Interrupt – occurs when the RxD line has been held low for an entire character. • Modem Status: Generated when the CTS (Clear To Send) input control line changes. 13.2 UART Application The following example shows the UART connected to a 9-pin connector compatible with a PC. As the JN5148 device pins do not provide the RS232 line voltage, a level shifter is used. JN5148 RTS CTS TXD UART0 RXD RS232 Lev el Shif ter 1 2 3 4 5 6 7 8 9 CD RD TD DTR SG DSR RTS CTS RI PC COM Port 1 5 Pin Signal 6 9 46 47 45 44 Figure 34: JN5148 Serial Communication Link© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 47 14 JTAG Debug Interface The JN5148 includes an IEEE1149.1 compliant JTAG port for the sole purpose of software code debug with NXP's Software Developer’s Kit. The JTAG interface is disabled by default and is enabled under software control. Therefore, debugging is only possible if enabled by the application. Once enabled, the application executes as normal until the external debugger controller initiates debug activity. The Debugger supports breakpoints and watchpoints based on four comparisons between any of program counter, load/store effective address and load/store data. There is the ability to chain the comparisons together. There is also the ability, under debugger control to perform the following commands: go, stop, reset, step over/into/out/next, run to cursor and breakpoints. In addition, under control of the debugger, it is possible to: • Read and write registers on the wishbone bus • Read ROM and RAM, and write to RAM • Read and write CPU internal registers The Debugger interface is accessed, depending upon the configuration, through the pins used for UART0 or UART1. This is enabled under software control and is dealt with in JN-AN-1118 JN5148 Application Debugging [4]. The following table details which DIO are used for the JTAG interface depending upon the configuration. Signal DIO Assignment UART0 pins UART1 pins clock (TCK) 4 17 control (TMS) 5 18 data out (TDO) 6 19 data in (TDI) 7 20 Table 4 Hardware Debugger IO If doze mode is active when debugging is started, the processor will be woken and then respond to debugger commands. It is not possible to wake the device from sleep using the debug interface and debugging is not available while the device is sleeping. When using the debug interface, program execution is halted, and control of the CPU is handed to the debugger. The watchdog, tick timer and the three timers described in section 11 are stalled while the debugger is in control of the CPU. When control is handed from the CPU to the debugger or back a small number of CPU clock cycles are taken flushing or reloading the CPU pipeline. Because of this, when a program is halted by the debugger and then restarted again, a small number of tick timer cycles will elapse. It is possible to prevent all hardware debugging by blowing the relevant Efuse bit. The JTAG interface does not support boundary scan testing. It is recommended that the JN5148 is not connected as part of the board scan chain.48 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 15 Two-Wire Serial Interface The JN5148 includes industry standard two-wire synchronous Serial Interface operates as a Master (MSIF) or Slave (SSIF) that provides a simple and efficient method of data exchange between devices. The system uses a serial data line (SIF_D) and a serial clock line (SIF_CLK) to perform bi-directional data transfers and includes the following features: Common to both master and slave: • Compatible with both I2 C and SMbus peripherals • Support for 7 and 10-bit addressing modes • Optional pulse suppression on signal inputs Master only: • Multi-master operation • Software programmable clock frequency • Clock stretching and wait state generation • Software programmable acknowledge bit • Interrupt or bit-polling driven byte-by-byte data-transfers • Bus busy detection Slave only: • Programmable slave address • Simple byte level transfer protocol • Write data flow control with optional clock stretching or acknowledge mechanism • Read data preloaded or provided as required 15.1 Connecting Devices The clock and data lines, SIF_D and SIF_CLK, are alternate functions of DIO15 and DIO14 respectively. The serial interface function of these pins is selected when the interface is enabled. They are both bi-directional lines, connected internally to the positive supply voltage via weak (45kΩ) programmable pull-up resistors. However, it is recommended that external 4.7kΩ pull-ups be used for reliable operation at high bus speeds, as shown in Figure 35. When the bus is free, both lines are HIGH. The output stages of devices connected to the bus must have an opendrain or open-collector in order to perform the wired-AND function. The number of devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. SIF_CLK SIF_D VDD D1_OUT D1_IN CLK1_IN CLK1_OUT D2_IN CLK2_IN CLK2_OUT DEVICE 1 DEVICE 2 RP RP Pullup Resistors D2_OUT JN5148 SIF DIO14 DIO15 Figure 35: Connection Details© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 49 15.2 Clock Stretching Slave devices can use clock stretching to slow down the transfer bit rate. After the master has driven SIF_CLK low, the slave can drive SIF_CLK low for the required period and then release it. If the slave’s SIF_CLK low period is greater than the master’s low period the resulting SIF_CLK bus signal low period is stretched thus inserting wait states. SIF_CLK SIF_CLK SIF_CLK Master SIF_CLK Slave SIF_CLK Wired-AND SIF_CLK Clock held low by Slave Figure 36: Clock Stretching 15.3 Master Two-wire Serial Interface When operating as a master device, it provides the clock signal and a prescale register determines the clock rate, allowing operation up to 400kbit/s. Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for indicating when start, stop, read, write and acknowledge control should be generated. Write data written into a transmit buffer will be written out across the two-wire interface when indicated, and read data received on the interface is made available in a receive buffer. Indication of when a particular transfer has completed may be indicated by means of an interrupt or by polling a status bit. The first byte of data transferred by the device after a start bit is the slave address. The JN5148 supports both 7-bit and 10-bit slave addresses by generating either one or two address transfers. Only the slave with a matching address will respond by returning an acknowledge bit. The master interface provides a true multi-master bus including collision detection and arbitration that prevents data corruption. If two or more masters simultaneously try to control the bus, a clock synchronization procedure determines the bus clock. Because of the wired-AND connection of the interface, a high-to-low transition on the bus affects all connected devices. This means a high-to-low transition on the SIF_CLK line causes all concerned devices to count off their low period. Once the clock input of a device has gone low, it will hold the SIF_CLK line in that state until the clock high state is reached when it releases the SIF_CLK line. Due to the wired-AND connection, the SIF_CLK line will therefore be held low by the device with the longest low period, and held high by the device with the shortest high period. SIF_CLK1 SIF_CLK2 SIF_CLK Master1 SIF_CLK Master2 SIF_CLK Wired-AND SIF_CLK Start counting low period Start counting high period Wait State Figure 37: Multi-Master Clock Synchronisation After each transfer has completed, the status of the device must be checked to ensure that the data has been acknowledged correctly, and that there has been no loss of arbitration. (N.B. Loss of arbitration may occur at any point during the transfer, including data cycles). An interrupt will be generated when arbitration has been lost.50 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 15.4 Slave Two-wire Serial Interface When operating as a slave device, the interface does not provide a clock signal, although it may drive the clock signal low if it is required to apply clock stretching. Only transfers whose address matches the value programmed into the interface’s address register are accepted. The interface allows both 7 and 10 bit addresses to be programmed, but only responds with an acknowledge to a single address. Addresses defined as “reserved” will not be responded to, and should not be programmed into the address register. A list of reserved addresses is shown in Table 5. Address Name Behaviour 0000 000 General Call/Start Byte Ignored 0000 001 CBUS address Ignored 0000 010 Reserved Ignored 0000 011 Reserved Ignored 0000 1XX Hs-mode master code Ignored 1111 1XX Reserved Ignored 1111 0XX 10-bit address Only responded to if 10 bit address set in address register Table 5 : List of two-wire serial interface reserved addresses Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for taking write data from a receive buffer and providing read data to a transmit buffer when indicated. A series of interrupt status bits are provided to control the flow of data. For writes, in to the slave interface, it is important that data is taken from the receive buffer by the processor before the next byte of data arrives. To enable this, the interface may be configured to work in two possible backoff modes: • Not Acknowledge mode – where the interface returns a Not Acknowledge (NACK) to the master if more data is received before the previous data has been taken. This will lead to the termination of the current data transfer. • Clock Stretching mode – where the interface holds the clock line low until the previous data has been taken. This will occur after transfer of the next data but before issuing an acknowledge For reads, from the slave interface, the data may be preloaded into the transmit buffer when it is empty (i.e. at the start of day, or when the last data has been read), or fetched each time a read transfer is requested. When using data preload, read data in the buffer must be replenished following a data write, as the transmit and received data is contained in a shared buffer. The interface will hold the bus using clock stretching when the transmit buffer is empty. Interrupts may be triggered when: • Data Buffer read data is required – a byte of data to be read should be provided to avoid the interface from clock stretching • Data Buffer read data has been taken – this indicates when the next data may be preloaded into the data buffer • Data Buffer write data is available – a byte of data should be taken from the data buffer to avoid data backoff as defined above • The last data in a transfer has completed – i.e. the end of a burst of data, when a Stop or Restart is seen • A protocol error has been spotted on the interface© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 51 16 Four-Wire Digital Audio Interface The JN5148 includes a four-wire digital audio interface that can be used for interfacing to audio CODECs. The following features are supported: • Compatible with the industry standard I²S interface • Option to support I²S, left justified and right justified modes • Optional support for connection to mono sample FIFO with data transferred on the left or right channel • Master only • Transmit on falling edge and receive on rising edge • Up to 8MHz maximum clock range • Maximum system size of 32-bits, allowing up to 16-bits per channel (left or right channels) • Option for pad bit insertion, allowing length of transfer per channel to be anything from 16 to 32 bits • Data Transfer size range of 1 to 16-bits per channel • Option to invert WS (normally 0 for left, but allow 1 for left instead) • Continuous clock output option to support CODECs which use it as a clock source • Separate input and output data lines • Option to invert idle state of WS (to indicate left or right) The Word Select (WS), Data In (SDIN), Clock (SCK) and Data Out (SDOUT) lines are alternate functions of DIO lines 12,13,17 and 18 respectively. Data transfer is always bidirectional. Data placed in the Data Buffer before a transfer command is issued will be transmitted on SDOUT whilst the data received on SDIN will be placed in the Data Buffer at the end of the transfer. Indication that a transfer has completed is by means of an interrupt or by polling a status bit. Left channel data is always sent first, with MSB first on each channel. The interface will always transfer both left and right channel data. For mono data transfer, the user should pad out the unused channel with 0’s, and ignore any data returned on the unused channel. The length of a data transfer is derived as follows: • When padding is disabled – Data Transfer Length = 2 x Data Transfer Size • When padding is enabled – Data Transfer Length = 2 x (16 + Extra Pad Length) Timing of the 3 main modes is shown in Figure 38, Figure 39 and Figure 40. The Data Buffer shows how the data is stored and how it will be transferred onto the interface. SD Max Size indicates how the maximum transfer size (16 with no additional padding) will transfer, whilst SD 3-bits indicates how 3 bits of data will be aligned when padding is enabled. Received data in the Data Buffer will always be padded out with 0’s if the Data Transfer Size is less than 16- bits, and any bits received beyond 16-bits when extra padding is used, will be discarded. In the examples, the polarity of WS is shown with Left channel = 0, and the idle state is Right Channel. 52 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Data Buffer Right R2 R1 R0 Left L2 L1 L0 SCK WS SD Max Size SD 3-bits MSB LSB MSB LSB Left Right L2 L1 L0 0 R2 R1 R0 MSB-1 MSB-2 MSB-1 MSB-2 0 0 0 Figure 38: I²S Mode Data Buffer Right R2 R1 R0 Left L2 L1 L0 SCK WS SD Max Size SD 3-bits MSB LSB MSB LSB Left Right L2 L1 L0 0 R2 R1 R0 MSB-1 MSB-2 MSB-1 MSB-2 0 0 0 Figure 39: Left Justified Mode Data Buffer Right R2 R1 R0 Left L2 L1 L0 SCK WS SD Max Size SD 3-bits MSB LSB MSB LSB Left Right 0 L2 L1 L0 R2 R1 R0 MSB-1 MSB-1 0 0 0 Figure 40: Right Justified Mode© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 53 17 Random Number Generator A random number generator is provided which creates a 16-bit random number each time it is invoked. Consecutive calls can be made to build up any length of random number required. Each call takes approximately 0.25msec to complete. Alternatively, continuous generation mode can be used where a new number is generated approximately every 0.25msec. In either mode of operation an interrupt can be generated to indicate when the number is available, or a status bit can be polled. The random bits are generated by sampling the state of the 32MHz clock every 32kHz system clock edge. As these clocks are asynchronous to each other, each sampled bit is unpredictable and hence random.54 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 18 Sample FIFO A 10 deep FIFO is provided to buffer data between the CPU and either the four-wire digital audio interface or the DAC/ ADC. It supports single channel input and output data, up to 16 bits wide. When used it can reduce the rate at which the processor has to generate/process data, and this may allow more efficient operation. Interrupts can be generated based on fill levels and also FIFO empty and full conditions. Normal configuration of the digital audio interface or the DAC/ ADC is still required when accessing the data via the FIFO. When used with the DAC / ADC functions a timing signal is generated by the DAC/ ADC functions to control the transfer of data to and from the FIFO and the analogue peripherals. The transfers will occur at the sample rate configured within the DAC / ADC functions. When the FIFO is linked to the four-wire digital audio interface, timer 2 must be used to generate an internal timing signal to control the flow of data across the interface. The timer does not require any external pins to be enabled. The timer should be set up to produce a PWM output with a rising edge generated every time a digital audio transfer is required. The transfer rate is typically configured to be the audio sample rate, e.g. 8kHz. If the transfer rate is too fast or slow data will be transferred correctly between the FIFO and the digital audio block.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 55 19 Intelligent Peripheral Interface The Intelligent Peripheral (IP) Interface is provided for systems that are more complex, where there is a processor that requires a wireless peripheral. As an example, the JN5148 may provide a complete JenNet or ZigBee PRO wireless network interface to a phone, computer, PDA, set-top box or games console. No resources are required from the main processor compared to a transceiver as the complete wireless protocol may be run on the internal JN5148 CPU. The wireless peripheral may be controlled via one of the UARTs but the IP interface is intended to provide a high-speed, low-processor-overhead interface. The intelligent peripheral interface is a SPI slave interface and uses pins shared with other DIO signals. The interface is designed to allow message passing and data transfer. Data received and transmitted on the IP interface is copied directly to and from a dedicated area of memory without intervention from the CPU. This memory area, the intelligent peripheral memory block, contains 64 32-bit word receive and transmit buffers. JN5148 Intelligent Peripheral Interface SPI MASTER System Processor (e.g. in cellphone, computer) CPU IP_DO SPIMISO IP_INT SPIINT IP_DI SPIMOSI IP_SEL SPISEL IP_CLK SPICLK Figure 41: Intelligent Peripheral Connection The interface functions as a SPI slave. It is possible to select the clock edge of IP_CLK on which data on the IP_DIN line of the interface is sampled, and the state of data output IP_DOUT is changed. The order of transmission is MSB first. The IP_DO data output is tri-stated when the device is inactive, i.e. the device is not selected via IP_SEL. An interrupt output line IP_INT is available so that the JN5148 can indicate to an external master that it has data to transfer. The interface can be clocked at up to 8MHz The IP interface signals IP_CLK, IP_DO, IP_DI, IP_SEL, IP_INT are alternate functions of pins DIO14 to 18 respectively. 19.1 Data Transfer Format Transfers are started by the remote processor asserting the IP_SEL line and terminated by the remote processor deasserting IP_SEL. Data transfers are bi-directional and traffic in both directions has a format of status byte, data length byte (of the number of 32-bit words to transfer) and data packet (from the receive and transmit buffers), as shown in Figure 42 The first byte transferred into the JN5148 is a status byte with the format shown in Table 6. This is followed by a padding byte that should be set to zero. The first byte output by the JN5148 is a padding byte, that should be ignored, followed by a status byte with the format shown in Table 6 Bit Field Description 7:2 RSVD Reserved, set to 0 1 TXQ 1: Data queued for transmission 0 RXRDY 1: Buffer ready to receive data Table 6: IP Status Byte Format56 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 If data is queued for transmission and the recipient has indicated that they are ready for it (RXRDY in incoming status byte was 1), the next byte to be transmitted is the data length in words (N). If either the JN5148 or the remote processor has no data to transfer, then the data length should be set to zero. The transaction can be terminated by the master after the status and padding bytes have been sent if it is not possible to send data in either direction. This may be because neither party has data to send or because the receiver does not have a buffer available. If the data length is non-zero, the data in the JN5148 transmit memory buffer is sent, beginning at the start of the buffer. At the same time that data bytes are being sent from the transmit buffer, the JN5148 receive buffer is being filled with incoming data, beginning from the start of the buffer. The remote processor, acting as the master, must determine the larger of its incoming or outgoing data transfers and deassert IP_SEL when all of the transmit and receive data has been transferred. The data is transferred into or out of the buffers starting from the lowest address in the buffer, and each word is assembled with the MSB first on the serial data lines. Following a transaction, IP_SEL must be high (deasserted) for at least 400nsec before a further transaction can begin. IP_SEL IP_CLK IP_DI Status (8-bit) N words of data IP_DO data length or 0s (8-bit) padding (8-bit) Status (8-bit) data length or 0s (8-bit) N words of data padding (8-bit) Figure 42: Intelligent Peripheral Data Transfer Waveforms The N words of data transferred on the interface are also formatted. The first three bytes, of the first word, must be zero. These are followed by a one byte length field that must be one less than the data length shown in the data length field in Figure 42, i.e. N-1. Following this are the (N-1) words of data. The application running on the JN5148 has high level software functions for sending and receiving data on this interface. The function of generating and interpreting the individual bytes on the interface is handled by hardware within the device. The remote processor must generate, and interpret, the signals in the interface. For instance, this may be done with a configurable SPI master interface. 19.2 JN5148 (Slave) Initiated Data Transfer To send data, the data is written into either buffer 0 or 1 of the intelligent peripheral memory area. Then the buffer number is written together with the data length. If the call is successful, the interrupt line IP_INT will signal to the remote processor that there is a message ready to be sent from the JN5148. When a remote processor starts a transfer to the JN5148 by deasserting IP_SEL, then IP_INT is deasserted. If the transfer is unsuccessful and the data is not output then IP_INT is reasserted after the transfer to indicate that data is still waiting to be sent. The interface can be configured to generate an internal interrupt whenever a transaction completes (for example IP_SEL becomes inactive after a transfer starts). It is also possible to mask the interrupt. The end of the transmission can be signalled by an interrupt, or the interface can be polled. To receive data the interface must be firstly initialised and when this is done, the bit RXRDY sent in the status byte from the IP block will show that data can be received by the JN5148. Successful data arrival can be indicated by an interrupt, or the interface can be polled. IP_INT is asserted if the JN5148 is configured to be able to receive, and the remote processor has previously attempted to send data but the RXRDY indicated that it could not be sent. To send and receive at the same time, the transmit and receive buffers must be set to be different. 19.3 Remote (Master) Processor Initiated Data Transfer The remote processor (master) must initiate a transfer to send data to the JN5148 (slave) by asserting the slave select pin, IP_SEL, and generating its status byte on IP_DI with TXRDY set. After receiving the status byte from the JN5148, the master should check that the JN5148 has a buffer ready by reading the RXRDY bit of the received status byte. If the RXRDY bit is 0 indicating that the JN5148 cannot accept data, it must terminate the transfer by deasserting IP_SEL unless it is receiving data from the JN5148. If the RXRDY bit is 1, indicating that the JN5148 can accept data, then the master should generate a further 8 clocks on IP_CLK in order to transfer its own message length on IP_DI. The master must continue clocking the interface until sufficient clocks have been generated to send © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 57 all the data specified in the length field to the JN5148. The master must then deassert IP_SEL to show the transfer is complete. The master may initiate a transfer to read data from the JN5148 by asserting the slave select pin, IP_SEL, and generating its status byte on IP_DI with RXRDY set. After receiving the status byte from the JN5148, it should check that the JN5148 has a buffer ready by reading the TXRDY bit of the received status byte. If the TXRDY bit is 0, indicating that the JN5148 does not have data to send, it must terminate the transfer by deasserting IP_SEL unless it is transmitting data to the JN5148. If the TXRDY bit is 1, indicating that the JN5148 can send data, then the master must generate a further 8 clocks on IP_CLK in order to receive the message length on IP_DO. The master must continue clocking the interface until sufficient clocks have been generated to receive all the data specified in the length field from the JN5148. The master should then deassert IP_SEL to show the transfer is complete. Data can be sent in both directions at once and the master must ensure both transfers have completed before deasserting IP_SEL.58 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 20 Analogue Peripherals The JN5148 contains a number of analogue peripherals allowing the direct connection of a wide range of external sensors, switches and actuators. ADC DAC1 DAC2 VREF Chip Boundary Internal Reference Processor Bus Supply Voltage (VDD1) Vref select Temp Sensor Comparator 2 Comparator 1 COMP2M COMP1M COMP1P COMP2P DAC1 DAC2 ADC1 ADC2 ADC3 ADC4 Vref Figure 43: Analogue Peripherals In order to provide good isolation from digital noise, the analogue peripherals are powered by a separate regulator, supplied from the analogue supply VDD1 and referenced to analogue ground VSSA. A common reference Vref for the ADC and DAC can be selected between an internal bandgap reference or an external voltage reference supplied to the VREF pin. Gain settings for the ADC and DAC are independent of each other. The ADC and DAC are clocked from a common clock source derived from the 16MHz clock© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 59 20.1 Analogue to Digital Converter The 12-bit analogue to digital converter (ADC) uses a successive approximation design to perform high accuracy conversions as typically required in wireless sensor network applications. It has six multiplexed single-ended input channels: four available externally, one connected to an internal temperature sensor, and one connected to an internal supply monitoring circuit. 20.1.1 Operation The input range of the ADC can be set between 0V to either the reference voltage or twice the reference voltage. The reference can be either taken from the internal voltage reference or from the external voltage applied to the VREF pin. For example, an external reference of 1.2V supplied to VREF may be used to set the ADC range between 0V and 2.4V. VREF Gain Setting Maximum Input Range Supply Voltage Range (VDD) 1.2V 1.6V 1.2V 1.6V 0 0 1 1 1.2V 1.6V 2.4V 3.2V 2.2V - 3.6V 2.2V - 3.6V 2.6V - 3.6V 3.4V - 3.6V Table 7 ADC/DAC Maximum Input Range The input clock to the ADC is 16MHz and can be divided down to 2MHz, 1MHz, 500kHz and 250kHz. During an ADC conversion the selected input channel is sampled for a fixed period and then held. This sampling period is defined as a number of ADC clock periods and can be programmed to 2, 4, 6 or 8. The conversion rate is ((3 x Sample period) + 14) clock periods. For example for 500kHz conversion with sample period of 2 will be (3 x 2) + 14 = 20 clock periods, 40usecs or 25kHz. . The ADC can be operated in either a single conversion mode or alternatively a new conversion can be started as soon as the previous one has completed, to give continuous conversions. If the source resistance of the input voltage is 1kΩ or less, then the default sampling time of 2 clocks should be used. The input to the ADC can be modelled as a resistor of 5kΩ(typ) and 10kΩ (max) to represent the on-resistance of the switches and the sampling capacitor 8pF. The sampling time required can then be calculated, by adding the sensor source resistance to the switch resistance, multiplying by the capacitance giving a time constant. Assuming normal exponential RC charging, the number of time constants required to give an acceptable error can be calculated, 7 time constants gives an error of 0.1%, so for 12-bit accuracy 10 time constants should be the target. For a source with zero resistance, 10 time constants is 800 nsecs, hence the smallest sampling window of 2 clock periods can be used. ADC pin 5 K 8 pF Sample Switch ADC front end Figure 44 ADC Input Equivalent Circuit The ADC sampling period, input range and mode (single shot or continuous) are controlled through software. When the ADC conversion is complete, an interrupt is generated. Alternatively the conversion status can be polled. When operating in continuous mode, it is recommended that the interrupt is used to signal the end of a conversion, since conversion times may range from 10 to 152 µsecs. Polling over this period would be wasteful of processor bandwidth. To facilitate averaging of the ADC values, which is a common practice in microcontrollers, a dedicated accumulator has been added, the user can define the accumulation to occur over 2,4,8 or 16 samples. The end of conversion 60 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 interrupt can be modified to occur at the end of the chosen accumulation period, alternatively polling can still be used. Software can then be used to apply the appropriate rounding and shifting to generate the average value, as well as setting up the accumulation function. For detailed electrical specifications, see section 22.3.8. 20.1.2 Supply Monitor The internal supply monitor allows the voltage on the analogue supply pin VDD1 to be measured. This is achieved with a potential divider that reduces the voltage by a factor of 0.666, allowing it to fall inside the input range of the ADC when set with an input range twice the internal voltage reference. The resistor chain that performs the voltage reduction is disabled until the measurement is made to avoid a continuous drain on the supply. 20.1.3 Temperature Sensor The on chip temperature sensor can be used either to provide an absolute measure of the device temperature or to detect changes in the ambient temperature. In common with most on chip temperature sensors, it is not trimmed and so the absolute accuracy variation is large; the user may wish to calibrate the sensor prior to use. The sensor forces a constant current through a forward biased diode to provide a voltage output proportional to the chip die temperature which can then be measured using the ADC. The measured voltage has a linear relationship to temperature as described in section 22.3.15. Because this sensor is on chip, any measurements taken must account for the thermal time constants. For example, if the device just came out of sleep mode the user application should wait until the temperature has stabilised before taking a measurement. 20.2 Digital to Analogue Converter The Digital to Analogue Converter (DAC) provides two output channels and is capable of producing voltages of 0 to Vref or 0 to 2Vref where Vref is selected between the internal reference and the VREF pin, with a resolution of 12-bits and a minimum conversion time of 10µsecs (2MHz clock). 20.2.1 Operation The output range of each DAC can be set independently to swing between 0V to either the reference voltage or twice the reference voltage. The reference voltage is selected from the internal reference or the VREF pin. For example, an external reference of 0.8V supplied to VREF may be used to set DAC1 maximum output of 0.8V and DAC2 maximum output of 1.6V. The DAC output amplifier is capable of driving a capacitive load up to that specified in section 22.3.9 Programmable clock periods allow a trade-off between conversion speed and resolution. The full 12-bit resolution is achieved with the 250kHz clock rate. See section 22.3.9 electrical characteristics, for more details. The conversion period of the DACs are given by the same formula as the ADC conversion time and so can vary between 10 and 152uS. The DAC values may be updated at the same time as the ADC is active. The clock divider ratio, interrupt enable and reference voltage select are all controlled through software, options common to both the ADC and DAC. The DAC output range and initial value can be set and the subsequent updates provided by updating only the DAC value. Polling is available to determine if a DAC channel is busy performing a conversion. The DAC can be disabled which will power down the DAC cell. Simultaneous conversions with DAC1 and DAC2 are possible. To use both DACs at the same time it is only necessary to enable them and supply the digital values via the software. The DACs should not be used in single shot mode, but continuous conversion mode only, in order to maintain a steady output voltage. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 61 20.3 Comparators The JN5148 contains two analogue comparators COMP1 and COMP2 that are designed to have true rail-to-rail inputs and operate over the full voltage range of the analogue supply VDD1. The hysteresis level (common to both comparators) can be set to a nominal value of 0mV, 10mV, 20mV or 40mV. In addition, the source of the negative input signal for each comparator (COMP1M and COMP2M) can be set to the internal voltage reference, the output of DAC1 or DAC2 (COMP1 or COMP2 respectively) or the appropriate external pin. The comparator outputs are routed to internal registers and can be polled, or can be used to generate interrupts. The comparators can be disabled to reduce power consumption. The comparators have a low power mode where the response time of the comparator is slower than normal and is specified in section 22.3.10. This mode may be used during non-sleep operation however it is particularly useful in sleep mode to wake up the JN5148 from sleep where low current consumption is important. The wakeup action and the configuration for which edge of the comparator output will be active are controlled through software. In sleep mode the negative input signal source, must be configured to be driven from the external pins.62 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 21 Power Management and Sleep Modes 21.1 Operating Modes Three operating modes are provided in the JN5148 that enable the system power consumption to be controlled carefully to maximise battery life. • Active Processing Mode • Sleep Mode • Deep Sleep Mode The variation in power consumption of the three modes is a result of having a series of power domains within the chip that may be controllably powered on or off. 21.1.1 Power Domains The JN5148 has the following power domains: • VDD Supply Domain: supplies the wake-up timers and controller, DIO blocks, Comparators, 32kHz RC and crystal oscillators. This domain is driven from the external supply (battery) and is always powered. The wake-up timers and controller, and the 32kHz RC and crystal oscillators may be powered on or off in sleep mode through software control. • Digital Logic Domain: supplies the digital peripherals, CPU, ROM, Baseband controller, Modem and Encryption processor. It is powered off during sleep mode. • Analogue Domain: supplies the ADC, DACs and the temperature sensor. It is powered off during sleep mode and may be powered on or off in active processing mode through software control. • RAM Domain: supplies the RAM during sleep mode to retain the memory contents. It may be powered on or off for sleep mode through software control. • Radio Domain: supplies the radio interface. It is powered during transmit and receive and controlled by the baseband processor. It is powered off during sleep mode. The current consumption figures for the different modes of operation of the device is given in section 22.2.2. 21.2 Active Processing Mode Active processing mode in the JN5148 is where all of the application processing takes place. By default, the CPU will execute at the selected clock speed executing application firmware. All of the peripherals are available to the application, as are options to actively enable or disable them to control power consumption; see specific peripheral sections for details. Whilst in Active processing mode there is the option to doze the CPU but keep the rest of the chip active; this is particularly useful for radio transmit and receive operations, where the CPU operation is not required therefore saving power. 21.2.1 CPU Doze Whilst in doze mode, CPU operation is stopped but the chip remains powered and the digital peripherals continue to run. Doze mode is entered through software and is terminated by any interrupt request. Once the interrupt service routine has been executed, normal program execution resumes. Doze mode uses more power than sleep and deep sleep modes but requires less time to restart and can therefore be used as a low power alternative to an idle loop. Whilst in CPU doze the current associated with the CPU is not consumed, therefore the basic device current is reduced as shown in the figures in section 22.2.2.1. 21.3 Sleep Mode The JN5148 enters sleep mode through software control. In this mode most of the internal chip functions are shutdown to save power, however the