Consent Manager Tag v2.0 (for TCF 2.0) -->
Farnell PDF
Datasheet - NXP Semiconductors - Farnell Element 14
Datasheet - NXP Semiconductors - Farnell Element 14
- Revenir à l'accueil
Farnell Element 14 :
See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…
Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.
Puce électronique / Microchip :
Sans fil - Wireless :
Texas instrument :
Ordinateurs :
Logiciels :
Tutoriels :
Autres documentations :
![[TXT]](http://www.audentia-gestion.fr/icons/text.gif)
Analog-Devices-ADC-S..> 09-Sep-2014 08:21 2.4M
Analog-Devices-ADMC2..> 09-Sep-2014 08:21 2.4M
Analog-Devices-ADMC4..> 09-Sep-2014 08:23 2.3M
Analog-Devices-AN300..> 08-Sep-2014 17:42 2.0M
Analog-Devices-ANF32..> 09-Sep-2014 08:18 2.6M
Analog-Devices-Basic..> 08-Sep-2014 17:49 1.9M
Analog-Devices-Compl..> 08-Sep-2014 17:38 2.0M
Analog-Devices-Convo..> 09-Sep-2014 08:26 2.1M
Analog-Devices-Convo..> 09-Sep-2014 08:25 2.2M
Analog-Devices-Convo..> 09-Sep-2014 08:25 2.2M
Analog-Devices-Digit..> 08-Sep-2014 18:02 2.1M
Analog-Devices-Digit..> 08-Sep-2014 18:03 2.0M
Analog-Devices-Gloss..> 08-Sep-2014 17:36 2.0M
Analog-Devices-Intro..> 08-Sep-2014 17:39 1.9M
Analog-Devices-The-C..> 08-Sep-2014 17:41 1.9M
Analog-Devices-Visua..> 09-Sep-2014 08:18 2.5M
Analog-Devices-Wi-Fi..> 09-Sep-2014 08:23 2.3M
Electronique-Basic-o..> 08-Sep-2014 17:43 1.8M
Farnell-0050375063-D..> 18-Jul-2014 17:03 2.5M
Farnell-03-iec-runds..> 04-Jul-2014 10:40 3.7M
Farnell-0430300011-D..> 14-Jun-2014 18:13 2.0M
Farnell-0433751001-D..> 18-Jul-2014 17:02 2.5M
Farnell-06-6544-8-PD..> 26-Mar-2014 17:56 2.7M
Farnell-1N4148WS-Fai..> 06-Jul-2014 10:04 1.9M
Farnell-2-GBPS-Diffe..> 28-Jul-2014 17:42 2.7M
Farnell-2N3906-Fairc..> 08-Sep-2014 07:22 2.1M
Farnell-2N7002DW-Fai..> 06-Jul-2014 10:03 886K
Farnell-3M-Polyimide..> 21-Mar-2014 08:09 3.9M
Farnell-3M-VolitionT..> 25-Mar-2014 08:18 3.3M
Farnell-4-Bit-Magnit..> 08-Jul-2014 18:53 2.2M
Farnell-10BQ060-PDF.htm 14-Jun-2014 09:50 2.4M
Farnell-10TPB47M-End..> 14-Jun-2014 18:16 3.4M
Farnell-12mm-Size-In..> 14-Jun-2014 09:50 2.4M
Farnell-24AA024-24LC..> 23-Jun-2014 10:26 3.1M
Farnell-50A-High-Pow..> 20-Mar-2014 17:31 2.9M
Farnell-74AC00-74ACT..> 06-Jul-2014 10:03 911K
Farnell-74LCX573-Fai..> 06-Jul-2014 10:05 1.9M
Farnell-197.31-KB-Te..> 04-Jul-2014 10:42 3.3M
Farnell-270-Series-O..> 08-Jul-2014 18:49 2.3M
Farnell-760G-French-..> 07-Jul-2014 19:45 1.2M
Farnell-851-Series-P..> 08-Jul-2014 18:47 3.0M
Farnell-900-Series-B..> 08-Jul-2014 18:50 2.3M
Farnell-1734-ARALDIT..> 07-Jul-2014 19:45 1.2M
Farnell-1907-2006-PD..> 26-Mar-2014 17:56 2.7M
Farnell-2020-Manuel-..> 08-Jul-2014 18:55 2.1M
Farnell-3367-ARALDIT..> 07-Jul-2014 19:46 1.2M
Farnell-5910-PDF.htm 25-Mar-2014 08:15 3.0M
Farnell-6517b-Electr..> 29-Mar-2014 11:12 3.3M
Farnell-43031-0002-M..> 18-Jul-2014 17:03 2.5M
Farnell-A-4-Hardener..> 07-Jul-2014 19:44 1.4M
Farnell-A-True-Syste..> 29-Mar-2014 11:13 3.3M
Farnell-AC-DC-Power-..> 15-Jul-2014 16:47 845K
Farnell-ACC-Silicone..> 04-Jul-2014 10:40 3.7M
Farnell-AD524-PDF.htm 20-Mar-2014 17:33 2.8M
Farnell-AD584-Rev-C-..> 08-Sep-2014 07:20 2.2M
Farnell-AD586BRZ-Ana..> 08-Sep-2014 08:09 1.6M
Farnell-AD620-Rev-H-..> 09-Sep-2014 08:13 2.6M
Farnell-AD736-Rev-I-..> 08-Sep-2014 07:31 1.3M
Farnell-AD7171-16-Bi..> 06-Jul-2014 10:06 1.0M
Farnell-AD7719-Low-V..> 18-Jul-2014 16:59 1.4M
Farnell-AD8300-Data-..> 18-Jul-2014 16:56 1.3M
Farnell-AD8307-Data-..> 08-Sep-2014 07:30 1.3M
Farnell-AD8310-Analo..> 08-Sep-2014 07:24 2.1M
Farnell-AD8313-Analo..> 08-Sep-2014 07:26 2.0M
Farnell-AD8361-Rev-D..> 08-Sep-2014 07:23 2.1M
Farnell-AD9833-Rev-E..> 08-Sep-2014 17:49 1.8M
Farnell-AD9834-Rev-D..> 08-Sep-2014 07:32 1.2M
Farnell-ADE7753-Rev-..> 08-Sep-2014 07:20 2.3M
Farnell-ADE7758-Rev-..> 08-Sep-2014 07:28 1.7M
Farnell-ADL6507-PDF.htm 14-Jun-2014 18:19 3.4M
Farnell-ADSP-21362-A..> 20-Mar-2014 17:34 2.8M
Farnell-ADuM1200-ADu..> 08-Sep-2014 08:09 1.6M
Farnell-ADuM1300-ADu..> 08-Sep-2014 08:11 1.7M
Farnell-ALF1210-PDF.htm 06-Jul-2014 10:06 4.0M
Farnell-ALF1225-12-V..> 01-Apr-2014 07:40 3.4M
Farnell-ALF2412-24-V..> 01-Apr-2014 07:39 3.4M
Farnell-AN10361-Phil..> 23-Jun-2014 10:29 2.1M
Farnell-ARADUR-HY-13..> 26-Mar-2014 17:55 2.8M
Farnell-ARALDITE-201..> 21-Mar-2014 08:12 3.7M
Farnell-ARALDITE-CW-..> 26-Mar-2014 17:56 2.7M
Farnell-AT89C5131-Ha..> 29-Jul-2014 10:31 1.2M
Farnell-AT90USBKey-H..> 29-Jul-2014 10:31 902K
Farnell-ATMEL-8-bit-..> 19-Mar-2014 18:04 2.1M
Farnell-ATMEL-8-bit-..> 11-Mar-2014 07:55 2.1M
Farnell-ATmega640-VA..> 14-Jun-2014 09:49 2.5M
Farnell-ATtiny20-PDF..> 25-Mar-2014 08:19 3.6M
Farnell-ATtiny26-L-A..> 18-Jul-2014 17:00 2.6M
Farnell-ATtiny26-L-A..> 13-Jun-2014 18:40 1.8M
Farnell-Alimentation..> 07-Jul-2014 19:43 1.8M
Farnell-Alimentation..> 14-Jun-2014 18:24 2.5M
Farnell-Alimentation..> 01-Apr-2014 07:42 3.4M
Farnell-Amplificateu..> 29-Mar-2014 11:11 3.3M
Farnell-Amplifier-In..> 06-Jul-2014 10:02 940K
Farnell-An-Improved-..> 14-Jun-2014 09:49 2.5M
Farnell-Araldite-Fus..> 07-Jul-2014 19:45 1.2M
Farnell-Arithmetic-L..> 08-Jul-2014 18:54 2.1M
Farnell-Atmel-ATmega..> 19-Mar-2014 18:03 2.2M
Farnell-Avvertenze-e..> 14-Jun-2014 18:20 3.3M
Farnell-BA-Series-Oh..> 08-Jul-2014 18:50 2.3M
Farnell-BAV99-Fairch..> 06-Jul-2014 10:03 896K
Farnell-BC846DS-NXP-..> 13-Jun-2014 18:42 1.6M
Farnell-BC847DS-NXP-..> 23-Jun-2014 10:24 3.3M
Farnell-BD6xxx-PDF.htm 22-Jul-2014 12:33 1.6M
Farnell-BF545A-BF545..> 23-Jun-2014 10:28 2.1M
Farnell-BGA7124-400-..> 18-Jul-2014 16:59 1.5M
Farnell-BK889B-PONT-..> 07-Jul-2014 19:42 1.8M
Farnell-BK2650A-BK26..> 29-Mar-2014 11:10 3.3M
Farnell-BT151-650R-N..> 13-Jun-2014 18:40 1.7M
Farnell-BTA204-800C-..> 13-Jun-2014 18:42 1.6M
Farnell-BUJD203AX-NX..> 13-Jun-2014 18:41 1.7M
Farnell-BYV29F-600-N..> 13-Jun-2014 18:42 1.6M
Farnell-BYV79E-serie..> 10-Mar-2014 16:19 1.6M
Farnell-BZX384-serie..> 23-Jun-2014 10:29 2.1M
Farnell-Battery-GBA-..> 14-Jun-2014 18:13 2.0M
Farnell-Both-the-Del..> 06-Jul-2014 10:01 948K
Farnell-C.A-6150-C.A..> 14-Jun-2014 18:24 2.5M
Farnell-C.A 8332B-C...> 01-Apr-2014 07:40 3.4M
Farnell-CC-Debugger-..> 07-Jul-2014 19:44 1.5M
Farnell-CC2530ZDK-Us..> 08-Jul-2014 18:55 2.1M
Farnell-CC2531-USB-H..> 07-Jul-2014 19:43 1.8M
Farnell-CC2560-Bluet..> 29-Mar-2014 11:14 2.8M
Farnell-CD4536B-Type..> 14-Jun-2014 18:13 2.0M
Farnell-CIRRUS-LOGIC..> 10-Mar-2014 17:20 2.1M
Farnell-CLASS 1-or-2..> 22-Jul-2014 12:30 4.7M
Farnell-CRC-HANDCLEA..> 07-Jul-2014 19:46 1.2M
Farnell-CS5532-34-BS..> 01-Apr-2014 07:39 3.5M
Farnell-Cannon-ZD-PD..> 11-Mar-2014 08:13 2.8M
Farnell-Ceramic-tran..> 14-Jun-2014 18:19 3.4M
Farnell-Circuit-Impr..> 25-Jul-2014 12:22 3.1M
Farnell-Circuit-Note..> 26-Mar-2014 18:00 2.8M
Farnell-Circuit-Note..> 26-Mar-2014 18:00 2.8M
Farnell-Cles-electro..> 21-Mar-2014 08:13 3.9M
Farnell-Clipper-Seri..> 08-Jul-2014 18:48 2.8M
Farnell-Compensating..> 09-Sep-2014 08:16 2.6M
Farnell-Compensating..> 09-Sep-2014 08:16 2.6M
Farnell-Conception-d..> 11-Mar-2014 07:49 2.4M
Farnell-Connectors-N..> 14-Jun-2014 18:12 2.1M
Farnell-Construction..> 14-Jun-2014 18:25 2.5M
Farnell-Controle-de-..> 11-Mar-2014 08:16 2.8M
Farnell-Cordless-dri..> 14-Jun-2014 18:13 2.0M
Farnell-Cube-3D-Prin..> 18-Jul-2014 17:02 2.5M
Farnell-Current-Tran..> 26-Mar-2014 17:58 2.7M
Farnell-Current-Tran..> 26-Mar-2014 17:58 2.7M
Farnell-Current-Tran..> 26-Mar-2014 17:59 2.7M
Farnell-Current-Tran..> 26-Mar-2014 17:59 2.7M
Farnell-DAC8143-Data..> 18-Jul-2014 16:59 1.5M
Farnell-DC-DC-Conver..> 15-Jul-2014 16:48 781K
Farnell-DC-Fan-type-..> 14-Jun-2014 09:48 2.5M
Farnell-DC-Fan-type-..> 14-Jun-2014 09:51 1.8M
Farnell-DG411-DG412-..> 07-Jul-2014 19:47 1.0M
Farnell-DP83846A-DsP..> 18-Jul-2014 16:55 1.5M
Farnell-DS3231-DS-PD..> 18-Jul-2014 16:57 2.5M
Farnell-Data-Sheet-K..> 07-Jul-2014 19:46 1.2M
Farnell-Data-Sheet-M..> 09-Sep-2014 08:05 2.8M
Farnell-Data-Sheet-S..> 18-Jul-2014 17:00 1.2M
Farnell-Datasheet-FT..> 09-Sep-2014 08:10 2.8M
Farnell-Datasheet-Fa..> 06-Jul-2014 10:04 861K
Farnell-Datasheet-Fa..> 15-Jul-2014 17:05 1.0M
Farnell-Datasheet-NX..> 15-Jul-2014 17:06 1.0M
Farnell-Davum-TMC-PD..> 14-Jun-2014 18:27 2.4M
Farnell-De-la-puissa..> 29-Mar-2014 11:10 3.3M
Farnell-Decapant-KF-..> 07-Jul-2014 19:45 1.2M
Farnell-Directive-re..> 25-Mar-2014 08:16 3.0M
Farnell-Documentatio..> 14-Jun-2014 18:26 2.5M
Farnell-Download-dat..> 16-Jul-2014 09:02 2.2M
Farnell-Download-dat..> 13-Jun-2014 18:40 1.8M
Farnell-Dremel-Exper..> 22-Jul-2014 12:34 1.6M
Farnell-Dual-MOSFET-..> 28-Jul-2014 17:41 2.8M
Farnell-ECO-Series-T..> 20-Mar-2014 08:14 2.5M
Farnell-EE-SPX303N-4..> 15-Jul-2014 17:06 969K
Farnell-ELMA-PDF.htm 29-Mar-2014 11:13 3.3M
Farnell-EMC1182-PDF.htm 25-Mar-2014 08:17 3.0M
Farnell-EPCOS-173438..> 04-Jul-2014 10:43 3.3M
Farnell-EPCOS-Sample..> 11-Mar-2014 07:53 2.2M
Farnell-ES1F-ES1J-fi..> 06-Jul-2014 10:04 867K
Farnell-ES2333-PDF.htm 11-Mar-2014 08:14 2.8M
Farnell-ESCON-Featur..> 06-Jul-2014 10:05 938K
Farnell-ESCON-Featur..> 06-Jul-2014 10:02 931K
Farnell-Ed.081002-DA..> 19-Mar-2014 18:02 2.5M
Farnell-Encodeur-USB..> 08-Jul-2014 18:56 2.0M
Farnell-Evaluating-t..> 22-Jul-2014 12:28 4.9M
Farnell-Everything-Y..> 11-Oct-2014 12:05 1.5M
Farnell-Excalibur-Hi..> 28-Jul-2014 17:10 2.4M
Farnell-Excalibur-Hi..> 28-Jul-2014 17:10 2.4M
Farnell-Explorer-16-..> 29-Jul-2014 10:31 1.3M
Farnell-F28069-Picco..> 14-Jun-2014 18:14 2.0M
Farnell-F42202-PDF.htm 19-Mar-2014 18:00 2.5M
Farnell-FAN6756-Fair..> 06-Jul-2014 10:04 850K
Farnell-FDC2512-Fair..> 06-Jul-2014 10:03 886K
Farnell-FDS-ITW-Spra..> 14-Jun-2014 18:22 3.3M
Farnell-FDV301N-Digi..> 06-Jul-2014 10:03 886K
Farnell-FICHE-DE-DON..> 10-Mar-2014 16:17 1.6M
Farnell-Fast-Charge-..> 28-Jul-2014 17:12 6.4M
Farnell-Fastrack-Sup..> 23-Jun-2014 10:25 3.3M
Farnell-Ferric-Chlor..> 29-Mar-2014 11:14 2.8M
Farnell-Fiche-de-don..> 14-Jun-2014 09:47 2.5M
Farnell-Fiche-de-don..> 14-Jun-2014 18:26 2.5M
Farnell-Fluke-1730-E..> 14-Jun-2014 18:23 2.5M
Farnell-Full-Datashe..> 15-Jul-2014 17:08 951K
Farnell-Full-Datashe..> 15-Jul-2014 16:47 803K
Farnell-GALVA-A-FROI..> 26-Mar-2014 17:56 2.7M
Farnell-GALVA-MAT-Re..> 26-Mar-2014 17:57 2.7M
Farnell-GN-RELAYS-AG..> 20-Mar-2014 08:11 2.6M
Farnell-Gertboard-Us..> 29-Jul-2014 10:30 1.4M
Farnell-HC49-4H-Crys..> 14-Jun-2014 18:20 3.3M
Farnell-HFE1600-Data..> 14-Jun-2014 18:22 3.3M
Farnell-HI-70300-Sol..> 14-Jun-2014 18:27 2.4M
Farnell-HIP4081A-Int..> 07-Jul-2014 19:47 1.0M
Farnell-HUNTSMAN-Adv..> 10-Mar-2014 16:17 1.7M
Farnell-Haute-vitess..> 11-Mar-2014 08:17 2.4M
Farnell-Hex-Inverter..> 29-Jul-2014 10:31 875K
Farnell-High-precisi..> 08-Jul-2014 18:51 2.3M
Farnell-ICM7228-Inte..> 07-Jul-2014 19:46 1.1M
Farnell-IP4252CZ16-8..> 13-Jun-2014 18:41 1.7M
Farnell-ISL6251-ISL6..> 07-Jul-2014 19:47 1.1M
Farnell-Instructions..> 19-Mar-2014 18:01 2.5M
Farnell-Jeu-multi-la..> 25-Jul-2014 12:23 3.0M
Farnell-KSZ8851SNL-S..> 23-Jun-2014 10:28 2.1M
Farnell-Keyboard-Mou..> 22-Jul-2014 12:27 5.9M
Farnell-L-efficacite..> 11-Mar-2014 07:52 2.3M
Farnell-L78S-STMicro..> 22-Jul-2014 12:32 1.6M
Farnell-L293d-Texas-..> 08-Jul-2014 18:53 2.2M
Farnell-LCW-CQ7P.CC-..> 25-Mar-2014 08:19 3.2M
Farnell-LD-WSECO16-P..> 25-Jul-2014 12:22 3.1M
Farnell-LM3S6952-Mic..> 22-Jul-2014 12:27 5.9M
Farnell-LM19-Texas-I..> 18-Jul-2014 17:00 1.2M
Farnell-LM324-Texas-..> 29-Jul-2014 10:32 1.5M
Farnell-LM386-Low-Vo..> 29-Jul-2014 10:32 1.5M
Farnell-LM555-Timer-..> 08-Jul-2014 18:53 2.2M
Farnell-LM7805-Fairc..> 09-Sep-2014 08:13 2.7M
Farnell-LME49725-Pow..> 14-Jun-2014 09:49 2.5M
Farnell-LMH6518-Texa..> 18-Jul-2014 16:59 1.3M
Farnell-LMP91051-Use..> 29-Jul-2014 10:30 1.4M
Farnell-LMT88-2.4V-1..> 28-Jul-2014 17:42 2.8M
Farnell-LOCTITE-542-..> 25-Mar-2014 08:15 3.0M
Farnell-LOCTITE-3463..> 25-Mar-2014 08:19 3.0M
Farnell-LPC11U3x-32-..> 16-Jul-2014 09:01 2.4M
Farnell-LPC81xM-32-b..> 16-Jul-2014 09:02 2.0M
Farnell-LPC408x-7x 3..> 16-Jul-2014 09:03 1.6M
Farnell-LPC1769-68-6..> 16-Jul-2014 09:02 1.9M
Farnell-LPC3220-30-4..> 16-Jul-2014 09:02 2.2M
Farnell-LQ-RELAYS-AL..> 06-Jul-2014 10:02 924K
Farnell-LT1961-Linea..> 18-Jul-2014 16:58 1.6M
Farnell-LT3757-Linea..> 18-Jul-2014 16:58 1.6M
Farnell-LT6233-Linea..> 18-Jul-2014 16:56 1.3M
Farnell-LUMINARY-MIC..> 22-Jul-2014 12:31 3.6M
Farnell-LUXEON-Guide..> 11-Mar-2014 07:52 2.3M
Farnell-Leaded-Trans..> 23-Jun-2014 10:26 3.2M
Farnell-Les-derniers..> 11-Mar-2014 07:50 2.3M
Farnell-Loctite3455-..> 25-Mar-2014 08:16 3.0M
Farnell-Low-Noise-24..> 06-Jul-2014 10:05 1.0M
Farnell-Low-cost-Enc..> 13-Jun-2014 18:42 1.7M
Farnell-Lubrifiant-a..> 26-Mar-2014 18:00 2.7M
Farnell-MAX232-MAX23..> 08-Jul-2014 18:52 2.3M
Farnell-MAX1365-MAX1..> 18-Jul-2014 16:56 1.4M
Farnell-MAX3221-Rev-..> 08-Sep-2014 07:28 1.8M
Farnell-MAX4661-MAX4..> 09-Sep-2014 08:10 2.8M
Farnell-MC3510-PDF.htm 25-Mar-2014 08:17 3.0M
Farnell-MC21605-PDF.htm 11-Mar-2014 08:14 2.8M
Farnell-MCF532x-7x-E..> 29-Mar-2014 11:14 2.8M
Farnell-MCOC1-Farnel..> 16-Jul-2014 09:04 1.0M
Farnell-MCP3421-Micr..> 18-Jul-2014 17:00 1.2M
Farnell-MICREL-KSZ88..> 11-Mar-2014 07:54 2.2M
Farnell-MICROCHIP-PI..> 19-Mar-2014 18:02 2.5M
Farnell-MICROCHIP-PI..> 25-Jul-2014 12:34 6.7M
Farnell-MIDAS-un-tra..> 15-Jul-2014 17:05 1.0M
Farnell-MOLEX-39-00-..> 10-Mar-2014 17:19 1.9M
Farnell-MOLEX-43020-..> 10-Mar-2014 17:21 1.9M
Farnell-MOLEX-43160-..> 10-Mar-2014 17:21 1.9M
Farnell-MOLEX-87439-..> 10-Mar-2014 17:21 1.9M
Farnell-MPXV7002-Rev..> 20-Mar-2014 17:33 2.8M
Farnell-MSP-EXP430F5..> 29-Jul-2014 10:31 1.2M
Farnell-MSP430-Hardw..> 29-Jul-2014 10:36 1.1M
Farnell-MSP430F15x-M..> 08-Sep-2014 07:32 1.3M
Farnell-MTX-3250-MTX..> 18-Jul-2014 17:01 2.5M
Farnell-MTX-Compact-..> 18-Jul-2014 17:01 2.5M
Farnell-MULTICOMP-Ra..> 22-Jul-2014 12:57 5.9M
Farnell-MX670-MX675-..> 14-Jun-2014 09:46 2.5M
Farnell-Microchip-MC..> 13-Jun-2014 18:27 1.8M
Farnell-Microship-PI..> 11-Mar-2014 07:53 2.2M
Farnell-Midas-Active..> 14-Jun-2014 18:17 3.4M
Farnell-Midas-MCCOG4..> 14-Jun-2014 18:11 2.1M
Farnell-Mini-Fit-Jr-..> 18-Jul-2014 17:03 2.5M
Farnell-Miniature-Ci..> 26-Mar-2014 17:55 2.8M
Farnell-Mistral-PDF.htm 14-Jun-2014 18:12 2.1M
Farnell-Molex-83421-..> 14-Jun-2014 18:17 3.4M
Farnell-Molex-COMMER..> 14-Jun-2014 18:16 3.4M
Farnell-Molex-Crimp-..> 10-Mar-2014 16:27 1.7M
Farnell-Multi-Functi..> 20-Mar-2014 17:38 3.0M
Farnell-NA555-NE555-..> 08-Jul-2014 18:53 2.2M
Farnell-NA555-NE555-..> 08-Sep-2014 07:51 1.5M
Farnell-NE5532-Texas..> 29-Jul-2014 10:32 1.5M
Farnell-NTE_SEMICOND..> 11-Mar-2014 07:52 2.3M
Farnell-NVE-datashee..> 28-Jul-2014 17:12 6.5M
Farnell-NXP-74VHC126..> 10-Mar-2014 16:17 1.6M
Farnell-NXP-BT136-60..> 11-Mar-2014 07:52 2.3M
Farnell-NXP-PBSS9110..> 10-Mar-2014 17:21 1.9M
Farnell-NXP-PCA9555 ..> 11-Mar-2014 07:54 2.2M
Farnell-NXP-PMBFJ620..> 10-Mar-2014 16:16 1.7M
Farnell-NXP-PSMN1R7-..> 10-Mar-2014 16:17 1.6M
Farnell-NXP-PSMN7R0-..> 10-Mar-2014 17:19 2.1M
Farnell-NXP-TEA1703T..> 11-Mar-2014 08:15 2.8M
Farnell-NaPiOn-Panas..> 06-Jul-2014 10:02 911K
Farnell-Nilï¬-sk-E-..> 14-Jun-2014 09:47 2.5M
Farnell-Novembre-201..> 20-Mar-2014 17:38 3.3M
Farnell-OMRON-INDUST..> 25-Jul-2014 12:31 6.9M
Farnell-OMRON-INDUST..> 25-Jul-2014 12:32 6.9M
Farnell-OMRON-Master..> 10-Mar-2014 16:26 1.8M
Farnell-OPA627-Texas..> 09-Sep-2014 08:08 2.8M
Farnell-OSLON-SSL-Ce..> 19-Mar-2014 18:03 2.1M
Farnell-OXPCIE958-FB..> 13-Jun-2014 18:40 1.8M
Farnell-Octal-Genera..> 28-Jul-2014 17:42 2.8M
Farnell-PADO-semi-au..> 04-Jul-2014 10:41 3.7M
Farnell-PBSS5160T-60..> 19-Mar-2014 18:03 2.1M
Farnell-PCF8574-PCF8..> 16-Jul-2014 09:03 1.7M
Farnell-PDTA143X-ser..> 20-Mar-2014 08:12 2.6M
Farnell-PDTB123TT-NX..> 13-Jun-2014 18:43 1.5M
Farnell-PESD5V0F1BL-..> 13-Jun-2014 18:43 1.5M
Farnell-PESD9X5.0L-P..> 13-Jun-2014 18:43 1.6M
Farnell-PIC12F609-61..> 04-Jul-2014 10:41 3.7M
Farnell-PIC18F2420-2..> 18-Jul-2014 16:57 2.5M
Farnell-PIC18F2455-2..> 23-Jun-2014 10:27 3.1M
Farnell-PIC24FJ256GB..> 14-Jun-2014 09:51 2.4M
Farnell-PMBT3906-PNP..> 13-Jun-2014 18:44 1.5M
Farnell-PMBT4403-PNP..> 23-Jun-2014 10:27 3.1M
Farnell-PMEG4002EL-N..> 14-Jun-2014 18:18 3.4M
Farnell-PMEG4010CEH-..> 13-Jun-2014 18:43 1.6M
Farnell-PN512-Full-N..> 16-Jul-2014 09:03 1.4M
Farnell-Panasonic-15..> 23-Jun-2014 10:29 2.1M
Farnell-Panasonic-EC..> 20-Mar-2014 17:36 2.6M
Farnell-Panasonic-EZ..> 20-Mar-2014 08:10 2.6M
Farnell-Panasonic-Id..> 20-Mar-2014 17:35 2.6M
Farnell-Panasonic-Ne..> 20-Mar-2014 17:36 2.6M
Farnell-Panasonic-Ra..> 20-Mar-2014 17:37 2.6M
Farnell-Panasonic-TS..> 20-Mar-2014 08:12 2.6M
Farnell-Panasonic-Y3..> 20-Mar-2014 08:11 2.6M
Farnell-PiFace-Digit..> 25-Jul-2014 12:25 3.0M
Farnell-Pico-Spox-Wi..> 10-Mar-2014 16:16 1.7M
Farnell-PicoScope-42..> 25-Jul-2014 12:23 3.0M
Farnell-PicoScope-se..> 25-Jul-2014 12:24 3.0M
Farnell-Pompes-Charg..> 24-Apr-2014 20:23 3.3M
Farnell-Ponts-RLC-po..> 14-Jun-2014 18:23 3.3M
Farnell-Portable-Ana..> 29-Mar-2014 11:16 2.8M
Farnell-Power-suppli..> 25-Jul-2014 12:29 7.0M
Farnell-Premier-Farn..> 21-Mar-2014 08:11 3.8M
Farnell-Produit-3430..> 14-Jun-2014 09:48 2.5M
Farnell-Proskit-SS-3..> 10-Mar-2014 16:26 1.8M
Farnell-Puissance-ut..> 11-Mar-2014 07:49 2.4M
Farnell-Q48-PDF.htm 23-Jun-2014 10:29 2.1M
Farnell-QRE1113-Fair..> 06-Jul-2014 10:03 879K
Farnell-Quadruple-2-..> 08-Sep-2014 07:29 1.5M
Farnell-Quick-Start-..> 25-Jul-2014 12:25 3.0M
Farnell-RASPBERRY-PI..> 22-Jul-2014 12:35 5.9M
Farnell-RDS-80-PDF.htm 18-Jul-2014 16:57 1.3M
Farnell-REF19x-Serie..> 09-Sep-2014 08:08 2.8M
Farnell-REF102-10V-P..> 28-Jul-2014 17:09 2.4M
Farnell-RF-short-tra..> 28-Jul-2014 17:16 6.3M
Farnell-Radial-Lead-..> 20-Mar-2014 08:12 2.6M
Farnell-RaspiCam-Doc..> 22-Jul-2014 12:32 1.6M
Farnell-Realiser-un-..> 11-Mar-2014 07:51 2.3M
Farnell-Reglement-RE..> 21-Mar-2014 08:08 3.9M
Farnell-Repartiteurs..> 14-Jun-2014 18:26 2.5M
Farnell-S-TRI-SWT860..> 21-Mar-2014 08:11 3.8M
Farnell-S1A-Fairchil..> 06-Jul-2014 10:03 896K
Farnell-SB175-Connec..> 11-Mar-2014 08:14 2.8M
Farnell-SB520-SB5100..> 22-Jul-2014 12:32 1.6M
Farnell-SERIAL-TFT-M..> 15-Jul-2014 17:05 1.0M
Farnell-SICK-OPTIC-E..> 18-Jul-2014 16:58 1.5M
Farnell-SL3ICS1002-1..> 16-Jul-2014 09:05 2.5M
Farnell-SL3S1203_121..> 16-Jul-2014 09:04 1.1M
Farnell-SL3S4011_402..> 16-Jul-2014 09:03 1.1M
Farnell-SL59830-Inte..> 06-Jul-2014 10:11 1.0M
Farnell-SMBJ-Transil..> 29-Mar-2014 11:12 3.3M
Farnell-SMU-Instrume..> 08-Jul-2014 18:51 2.3M
Farnell-SN54HC164-SN..> 08-Sep-2014 07:25 2.0M
Farnell-SN54HC244-SN..> 08-Jul-2014 18:52 2.3M
Farnell-SN54LV4053A-..> 28-Jul-2014 17:20 5.9M
Farnell-SO967460-PDF..> 11-Oct-2014 12:05 2.9M
Farnell-SOT-23-Multi..> 11-Mar-2014 07:51 2.3M
Farnell-SOURIAU-Cont..> 08-Jul-2014 19:04 3.0M
Farnell-SPLC780A1-16..> 14-Jun-2014 18:25 2.5M
Farnell-SSC7102-Micr..> 23-Jun-2014 10:25 3.2M
Farnell-STM32F103x8-..> 22-Jul-2014 12:33 1.6M
Farnell-STM32F405xxS..> 27-Aug-2014 18:27 1.8M
Farnell-SVPE-series-..> 14-Jun-2014 18:15 2.0M
Farnell-Schroff-A108..> 25-Jul-2014 12:27 2.8M
Farnell-Schroff-Main..> 25-Jul-2014 12:26 2.9M
Farnell-Schroff-mult..> 25-Jul-2014 12:26 2.9M
Farnell-Sensorless-C..> 04-Jul-2014 10:42 3.3M
Farnell-Septembre-20..> 20-Mar-2014 17:46 3.7M
Farnell-Serial-File-..> 06-Jul-2014 10:02 941K
Farnell-Serie-PicoSc..> 19-Mar-2014 18:01 2.5M
Farnell-Serie-Standa..> 14-Jun-2014 18:23 3.3M
Farnell-Series-2600B..> 20-Mar-2014 17:30 3.0M
Farnell-Series-TDS10..> 04-Jul-2014 10:39 4.0M
Farnell-Signal-PCB-R..> 14-Jun-2014 18:11 2.1M
Farnell-Silica-Gel-M..> 07-Jul-2014 19:46 1.2M
Farnell-Single-Chip-..> 08-Sep-2014 07:30 1.5M
Farnell-SmartRF06-Ev..> 07-Jul-2014 19:43 1.6M
Farnell-Strangkuhlko..> 21-Mar-2014 08:09 3.9M
Farnell-Supercapacit..> 26-Mar-2014 17:57 2.7M
Farnell-Synchronous-..> 08-Jul-2014 18:54 2.1M
Farnell-T672-3000-Se..> 08-Jul-2014 18:59 2.0M
Farnell-TAS1020B-USB..> 28-Jul-2014 17:19 6.2M
Farnell-TCL-DC-traco..> 15-Jul-2014 16:46 858K
Farnell-TDK-Lambda-H..> 14-Jun-2014 18:21 3.3M
Farnell-TEKTRONIX-DP..> 10-Mar-2014 17:20 2.0M
Farnell-TEL-5-Series..> 15-Jul-2014 16:47 814K
Farnell-TEN-8-WI-Ser..> 15-Jul-2014 16:46 939K
Farnell-TEP-150WI-Se..> 15-Jul-2014 16:47 837K
Farnell-TEXAS-INSTRU..> 22-Jul-2014 12:29 4.8M
Farnell-TEXAS-INSTRU..> 22-Jul-2014 12:31 2.4M
Farnell-TEXAS-INSTRU..> 22-Jul-2014 12:30 4.6M
Farnell-TIS-Instruct..> 15-Jul-2014 16:47 845K
Farnell-TIS-series-t..> 15-Jul-2014 16:46 875K
Farnell-TKC2-Dusters..> 07-Jul-2014 19:46 1.2M
Farnell-TL082-Wide-B..> 28-Jul-2014 17:16 6.3M
Farnell-TLV320AIC23B..> 08-Sep-2014 07:18 2.4M
Farnell-TLV320AIC325..> 28-Jul-2014 17:45 2.9M
Farnell-TMLM-Series-..> 15-Jul-2014 16:47 810K
Farnell-TMP006EVM-Us..> 29-Jul-2014 10:30 1.3M
Farnell-TMR-2-Series..> 15-Jul-2014 16:46 897K
Farnell-TMR-2-series..> 15-Jul-2014 16:48 787K
Farnell-TMR-3-WI-Ser..> 15-Jul-2014 16:46 939K
Farnell-TMS320F28055..> 28-Jul-2014 17:09 2.7M
Farnell-TOS-tracopow..> 15-Jul-2014 16:47 852K
Farnell-TPS40060-Wid..> 28-Jul-2014 17:19 6.3M
Farnell-TSV6390-TSV6..> 28-Jul-2014 17:14 6.4M
Farnell-TXL-series-t..> 15-Jul-2014 16:47 829K
Farnell-TYCO-ELECTRO..> 25-Jul-2014 12:30 6.9M
Farnell-Tektronix-AC..> 13-Jun-2014 18:44 1.5M
Farnell-Telemetres-l..> 20-Mar-2014 17:46 3.7M
Farnell-Termometros-..> 14-Jun-2014 18:14 2.0M
Farnell-The-Discrete..> 08-Sep-2014 17:44 1.8M
Farnell-The-essentia..> 10-Mar-2014 16:27 1.7M
Farnell-Thermometre-..> 29-Jul-2014 10:30 1.4M
Farnell-Tiva-C-Serie..> 08-Jul-2014 18:49 2.6M
Farnell-Trust-Digita..> 25-Jul-2014 12:24 3.0M
Farnell-U2270B-PDF.htm 14-Jun-2014 18:15 3.4M
Farnell-ULINKpro-Deb..> 25-Jul-2014 12:35 5.9M
Farnell-ULN2803A-Rev..> 09-Sep-2014 19:26 2.9M
Farnell-USB-Buccanee..> 14-Jun-2014 09:48 2.5M
Farnell-USB-to-Seria..> 08-Sep-2014 07:27 2.0M
Farnell-USB1T11A-PDF..> 19-Mar-2014 18:03 2.1M
Farnell-UTO-Souriau-..> 08-Jul-2014 18:48 2.8M
Farnell-UTS-Series-S..> 08-Jul-2014 18:49 2.8M
Farnell-UTS-Series-S..> 08-Jul-2014 18:49 2.5M
Farnell-User-Guide-M..> 07-Jul-2014 19:41 2.0M
Farnell-V4N-PDF.htm 14-Jun-2014 18:11 2.1M
Farnell-Videk-PDF.htm 06-Jul-2014 10:01 948K
Farnell-WIRE-WRAP-50..> 25-Jul-2014 12:34 5.9M
Farnell-WetTantalum-..> 11-Mar-2014 08:14 2.8M
Farnell-XPS-AC-Octop..> 14-Jun-2014 18:11 2.1M
Farnell-XPS-MC16-XPS..> 11-Mar-2014 08:15 2.8M
Farnell-XPSAF5130-PD..> 18-Jul-2014 16:56 1.4M
Farnell-YAGEO-DATA-S..> 11-Mar-2014 08:13 2.8M
Farnell-ZigBee-ou-le..> 11-Mar-2014 07:50 2.4M
Farnell-celpac-SUL84..> 21-Mar-2014 08:11 3.8M
Farnell-china_rohs_o..> 21-Mar-2014 10:04 3.9M
Farnell-cree-Xlamp-X..> 20-Mar-2014 17:34 2.8M
Farnell-cree-Xlamp-X..> 20-Mar-2014 17:35 2.7M
Farnell-cree-Xlamp-X..> 20-Mar-2014 17:31 2.9M
Farnell-cree-Xlamp-m..> 20-Mar-2014 17:32 2.9M
Farnell-cree-Xlamp-m..> 20-Mar-2014 17:32 2.9M
Farnell-ev-relays-ae..> 06-Jul-2014 10:02 926K
Farnell-fiche-de-don..> 07-Jul-2014 19:44 1.4M
Farnell-fx-3650P-fx-..> 29-Jul-2014 10:42 1.5M
Farnell-iServer-Micr..> 22-Jul-2014 12:32 1.6M
Farnell-ir1150s_fr.p..> 29-Mar-2014 11:11 3.3M
Farnell-manual-bus-p..> 10-Mar-2014 16:29 1.9M
Farnell-maxim-integr..> 28-Jul-2014 17:14 6.4M
Farnell-pmbta13_pmbt..> 15-Jul-2014 17:06 959K
Farnell-propose-plus..> 11-Mar-2014 08:19 2.8M
Farnell-safety-data-..> 07-Jul-2014 19:44 1.4M
Farnell-techfirst_se..> 21-Mar-2014 08:08 3.9M
Farnell-tesa®pack63..> 08-Jul-2014 18:56 2.0M
Farnell-testo-205-20..> 20-Mar-2014 17:37 3.0M
Farnell-testo-470-Fo..> 20-Mar-2014 17:38 3.0M
Farnell-uC-OS-III-Br..> 10-Mar-2014 17:20 2.0M
Farnell-user-manuel-..> 29-Jul-2014 10:29 1.5M
Sefram-7866HD.pdf-PD..> 29-Mar-2014 11:46 472K
Sefram-CAT_ENREGISTR..> 29-Mar-2014 11:46 461K
Sefram-CAT_MESUREURS..> 29-Mar-2014 11:46 435K
Sefram-GUIDE_SIMPLIF..> 29-Mar-2014 11:46 481K
Sefram-GUIDE_SIMPLIF..> 29-Mar-2014 11:46 442K
Sefram-GUIDE_SIMPLIF..> 29-Mar-2014 11:46 422K
Sefram-SP270.pdf-PDF..> 29-Mar-2014 11:46 464K
Farnell-AN2794-Appli..> 13-Oct-2014 10:02 1.0M
Farnell-Data-Sheet-S..> 13-Oct-2014 10:09 1.2M
Farnell-ESM6045DV-ST..> 13-Oct-2014 10:07 850K
Farnell-L78-Positive..> 13-Oct-2014 10:05 1.8M
Farnell-L78S-STMicro..> 13-Oct-2014 10:09 1.6M
Farnell-L4978-STMicr..> 13-Oct-2014 10:08 783K
Farnell-L6384E-STMic..> 13-Oct-2014 10:03 1.9M
Farnell-L6562-STMicr..> 13-Oct-2014 10:08 754K
Farnell-LM139-LM239-..> 13-Oct-2014 10:08 771K
Farnell-LM217-LM317-..> 13-Oct-2014 10:05 1.7M
Farnell-LM350-STMicr..> 13-Oct-2014 10:04 1.8M
Farnell-LM2904-LM290..> 13-Oct-2014 10:05 1.7M
Farnell-MC34063ABD-T..> 13-Oct-2014 10:07 844K
Farnell-SG2525A-SG35..> 13-Oct-2014 10:02 1.0M
Farnell-SMAJ-STMicro..> 13-Oct-2014 10:08 734K
Farnell-ST1S10PHR-ST..> 13-Oct-2014 10:08 820K
Farnell-ST3232B-ST32..> 13-Oct-2014 10:07 867K
Farnell-STEVAL-TDR02..> 13-Oct-2014 10:02 960K
Farnell-STM32F030x4-..> 13-Oct-2014 10:07 1.1M
Farnell-STM32F103x8-..> 13-Oct-2014 10:07 1.0M
Farnell-STM32F205xx-..> 13-Oct-2014 10:06 1.7M
Farnell-STM32F405xx-..> 13-Oct-2014 10:06 1.4M
Farnell-STP16NF06L-n..> 13-Oct-2014 10:06 1.7M
Farnell-STP80NF55L-0..> 13-Oct-2014 10:06 1.7M
Farnell-Smart-street..> 13-Oct-2014 10:04 1.8M
Farnell-TIP41C-TIP42..> 13-Oct-2014 10:08 829K
Farnell-TIP102-TIP10..> 13-Oct-2014 10:07 853K
Farnell-TSV6390-TSV6..> 13-Oct-2014 10:10 6.4M
Farnell-ULN2001-ULN2..> 13-Oct-2014 10:03 1.9M
Farnell-ULQ2001-ULQ2..> 13-Oct-2014 10:03 1.9M
Farnell-VND920P-E-ST..> 13-Oct-2014 10:04 1.8M
1. Product profile
1.1 General description
Unidirectional double ElectroStatic Discharge (ESD) protection diodes in a common
cathode configuration, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted
Device (SMD) plastic package. The devices are designed for ESD and transient
overvoltage protection of up to two signal lines.
[1] All types available as /DG halogen-free version.
1.2 Features
1.3 Applications
MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage
suppression
Rev. 01 — 3 September 2008 Product data sheet
Table 1. Product overview
Type number[1] Package Configuration
NXP JEDEC
MMBZ12VDL SOT23 TO-236AB dual common cathode
MMBZ15VDL
MMBZ18VCL
MMBZ20VCL
MMBZ27VCL
MMBZ33VCL
■ Unidirectional ESD protection of
two lines
■ ESD protection up to 30 kV (contact
discharge)
■ Bidirectional ESD protection of one line ■ IEC 61000-4-2; level 4 (ESD)
■ Low diode capacitance: Cd ≤ 140 pF ■ IEC 61643-321
■ Rated peak pulse power: PPPM ≤ 40 W ■ AEC-Q101 qualified
■ Ultra low leakage current: IRM ≤ 5 nA
■ Computers and peripherals ■ Automotive electronic control units
■ Audio and video equipment ■ Portable electronics
■ Cellular handsets and accessoriesMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 2 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
1.4 Quick reference data
2. Pinning information
Table 2. Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse standoff voltage
MMBZ12VDL
MMBZ12VDL/DG
- - 8.5 V
MMBZ15VDL
MMBZ15VDL/DG
- - 12.8 V
MMBZ18VCL
MMBZ18VCL/DG
- - 14.5 V
MMBZ20VCL
MMBZ20VCL/DG
- - 17 V
MMBZ27VCL
MMBZ27VCL/DG
- - 22 V
MMBZ33VCL
MMBZ33VCL/DG
- - 26 V
Cd diode capacitance f = 1 MHz; VR =0V
MMBZ12VDL
MMBZ12VDL/DG
- 110 140 pF
MMBZ15VDL
MMBZ15VDL/DG
- 85 105 pF
MMBZ18VCL
MMBZ18VCL/DG
- 70 90 pF
MMBZ20VCL
MMBZ20VCL/DG
- 65 80 pF
MMBZ27VCL
MMBZ27VCL/DG
- 48 60 pF
MMBZ33VCL
MMBZ33VCL/DG
- 45 55 pF
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 anode (diode 1)
2 anode (diode 2)
3 common cathode
1 2
3
006aaa150
1 2
3MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 3 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 4. Ordering information
Type number Package
Name Description Version
MMBZ12VDL - plastic surface-mounted package; 3 leads SOT23
MMBZ15VDL
MMBZ18VCL
MMBZ20VCL
MMBZ27VCL
MMBZ33VCL
MMBZ12VDL/DG - plastic surface-mounted package; 3 leads SOT23
MMBZ15VDL/DG
MMBZ18VCL/DG
MMBZ20VCL/DG
MMBZ27VCL/DG
MMBZ33VCL/DG
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
MMBZ12VDL *MA MMBZ12VDL/DG TJ*
MMBZ15VDL *MB MMBZ15VDL/DG TL*
MMBZ18VCL *MC MMBZ18VCL/DG TN*
MMBZ20VCL *MD MMBZ20VCL/DG TQ*
MMBZ27VCL *ME MMBZ27VCL/DG TS*
MMBZ33VCL *MF MMBZ33VCL/DG TU*MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 4 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
5. Limiting values
[1] In accordance with IEC 61643-321 (10/1000 µs current waveform).
[2] Measured from pin 1 or 2 to pin 3.
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 or 2 to pin 3.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
PPPM rated peak pulse power tp = 10/1000 µs [1][2] - 40 W
IPPM rated peak pulse current tp = 10/1000 µs [1][2]
MMBZ12VDL
MMBZ12VDL/DG
- 2.35 A
MMBZ15VDL
MMBZ15VDL/DG
- 1.9 A
MMBZ18VCL
MMBZ18VCL/DG
- 1.6 A
MMBZ20VCL
MMBZ20VCL/DG
- 1.4 A
MMBZ27VCL
MMBZ27VCL/DG
- 1A
MMBZ33VCL
MMBZ33VCL/DG
- 0.87 A
Per device
Ptot total power dissipation Tamb ≤ 25 °C [3] - 350 mW
[4] - 440 mW
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. ESD maximum ratings
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
Per diode
VESD electrostatic discharge voltage [1][2]
IEC 61000-4-2
(contact discharge)
- 30 kV
machine model - 2 kVMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 5 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Soldering point at pin 3.
Table 8. ESD standards compliance
Standard Conditions
Per diode
IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model) > 8 kV
Fig 1. 10/1000 µs pulse waveform according to
IEC 61643-321
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
tp (ms)
0 4.0 1.0 2.0 3.0
006aab319
50
100
150
IPP
(%)
0
50 % IPP; 1000 µs
100 % IPP; 10 µs
001aaa631
IPP
100 %
90 %
t
30 ns
60 ns
10 %
tr = 0.7 ns to 1 ns
Table 9. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from junction
to ambient
in free air [1] - - 350 K/W
[2] - - 280 K/W
Rth(j-sp) thermal resistance from junction
to solder point
[3] - - 60 K/WMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 6 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
7. Characteristics
Table 10. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VF forward voltage
MMBZ12VDL
MMBZ12VDL/DG
IF = 10 mA - - 0.9 V
MMBZ15VDL
MMBZ15VDL/DG
IF = 10 mA - - 0.9 V
MMBZ18VCL
MMBZ18VCL/DG
IF = 10 mA - - 0.9 V
MMBZ20VCL
MMBZ20VCL/DG
IF = 10 mA - - 0.9 V
MMBZ27VCL
MMBZ27VCL/DG
IF = 200 mA - - 1.1 V
MMBZ33VCL
MMBZ33VCL/DG
IF = 10 mA - - 0.9 V
VRWM reverse standoff
voltage
MMBZ12VDL
MMBZ12VDL/DG
- - 8.5 V
MMBZ15VDL
MMBZ15VDL/DG
- - 12.8 V
MMBZ18VCL
MMBZ18VCL/DG
- - 14.5 V
MMBZ20VCL
MMBZ20VCL/DG
- - 17 V
MMBZ27VCL
MMBZ27VCL/DG
- - 22 V
MMBZ33VCL
MMBZ33VCL/DG
- - 26 V
IRM reverse leakage current
MMBZ12VDL
MMBZ12VDL/DG
VRWM = 8.5 V - 0.1 5 nA
MMBZ15VDL
MMBZ15VDL/DG
VRWM = 12.8 V - 0.1 5 nA
MMBZ18VCL
MMBZ18VCL/DG
VRWM = 14.5 V - 0.1 5 nA
MMBZ20VCL
MMBZ20VCL/DG
VRWM = 17 V - 0.1 5 nA
MMBZ27VCL
MMBZ27VCL/DG
VRWM = 22 V - 0.1 5 nA
MMBZ33VCL
MMBZ33VCL/DG
VRWM = 26 V - 0.1 5 nAMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 7 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
VBR breakdown voltage IR = 1 mA
MMBZ12VDL
MMBZ12VDL/DG
11.4 12 12.6 V
MMBZ15VDL
MMBZ15VDL/DG
14.3 15 15.8 V
MMBZ18VCL
MMBZ18VCL/DG
17.1 18 18.9 V
MMBZ20VCL
MMBZ20VCL/DG
19 20 21 V
MMBZ27VCL
MMBZ27VCL/DG
25.65 27 28.35 V
MMBZ33VCL
MMBZ33VCL/DG
31.35 33 34.65 V
Cd diode capacitance f = 1 MHz; VR =0V
MMBZ12VDL
MMBZ12VDL/DG
- 110 140 pF
MMBZ15VDL
MMBZ15VDL/DG
- 85 105 pF
MMBZ18VCL
MMBZ18VCL/DG
- 70 90 pF
MMBZ20VCL
MMBZ20VCL/DG
- 65 80 pF
MMBZ27VCL
MMBZ27VCL/DG
- 48 60 pF
MMBZ33VCL
MMBZ33VCL/DG
- 45 55 pF
VCL clamping voltage [1][2]
MMBZ12VDL
MMBZ12VDL/DG
IPPM = 2.35 A - - 17 V
MMBZ15VDL
MMBZ15VDL/DG
IPPM = 1.9 A - - 21.2 V
MMBZ18VCL
MMBZ18VCL/DG
IPPM = 1.6 A - - 25 V
MMBZ20VCL
MMBZ20VCL/DG
IPPM = 1.4 A - - 28 V
MMBZ27VCL
MMBZ27VCL/DG
IPPM = 1 A - - 38 V
MMBZ33VCL
MMBZ33VCL/DG
IPPM = 0.87 A - - 46 V
Table 10. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max UnitMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 8 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
[1] In accordance with IEC 61643-321 (10/1000 µs current waveform).
[2] Measured from pin 1 or 2 to pin 3.
SZ temperature coefficient IZ = 1 mA
MMBZ12VDL
MMBZ12VDL/DG
- 8.1 - mV/K
MMBZ15VDL
MMBZ15VDL/DG
- 11 - mV/K
MMBZ18VCL
MMBZ18VCL/DG
- 14 - mV/K
MMBZ20VCL
MMBZ20VCL/DG
- 15.8 - mV/K
MMBZ27VCL
MMBZ27VCL/DG
- 23 - mV/K
MMBZ33VCL
MMBZ33VCL/DG
- 29.4 - mV/K
Table 10. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
MMBZ27VCL: unidirectional and bidirectional
Tamb = 25 °C
Fig 3. Rated peak pulse power as a function of
exponential pulse duration (rectangular
waveform); typical values
Fig 4. Relative variation of rated peak pulse power as
a function of junction temperature; typical
values
006aab327
102
10
103
PPPM
(W)
1
tp (ms)
10−2 103 102 10−1 1 10
Tj
(°C)
0 200 50 100 150
006aab321
0.4
0.8
1.2
PPPM
0
PPPM(25°C)MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 9 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
f = 1 MHz; Tamb = 25 °C
(1) MMBZ15VDL: unidirectional
(2) MMBZ15VDL: bidirectional
(3) MMBZ27VCL: unidirectional
(4) MMBZ27VCL: bidirectional
MMBZ27VCL: VRWM = 22 V
Fig 5. Diode capacitance as a function of reverse
voltage; typical values
Fig 6. Reverse leakage current as a function of
junction temperature; typical values
Fig 7. V-I characteristics for a unidirectional
ESD protection diode
Fig 8. V-I characteristics for a bidirectional
ESD protection diode
VR (V)
0 25 5 10 15 20
006aab328
40
60
20
80
100
Cd
(pF)
0
(1)
(2)
(3)
(4)
006aab329
10−1
10−2
10
1
102
IRM
(nA)
10−3
Tamb (°C)
−75 175 −25 25 75 125
006aab324
−VCL −VBR −VRWM
−IRM
−IR
−IPP
V
I
P-N
− +
−IPPM 006aab325
−VCL −VBR −VRWM
−IRM VRWM VBR VCL
IRM
−IR
IR
−IPP
IPP
− +
IPPM
−IPPMMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 10 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
8. Application information
The MMBZxVCL series and the MMBZxVDL series are designed for the protection of up
to two unidirectional data or signal lines from the damage caused by ESD and surge
pulses. The devices may be used on lines where the signal polarities are either positive or
negative with respect to ground. The devices provide a surge capability of 40 W per line
for a 10/1000 µs waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the devices as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 9. Typical application: ESD and transient voltage protection of data lines
006aab330
MMBZxVCL/VDL
line 1 to be protected
unidirectional protection of two lines bidirectional protection of one line
line 2 to be protected
GND
MMBZxVCL/VDL
line 1 to be protected
GNDMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 11 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
10. Package outline
11. Packing information
[1] For further information and the availability of packing methods, see Section 15.
Fig 10. Package outline SOT23 (TO-236AB)
Dimensions in mm 04-11-04
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
1 2
3
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
MMBZ12VDL SOT23 4 mm pitch, 8 mm tape and reel -215 -235
MMBZ15VDL
MMBZ18VCL
MMBZ20VCL
MMBZ27VCL
MMBZ33VCL
MMBZ12VDL/DG SOT23 4 mm pitch, 8 mm tape and reel -215 -235
MMBZ15VDL/DG
MMBZ18VCL/DG
MMBZ20VCL/DG
MMBZ27VCL/DG
MMBZ33VCL/DGMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 12 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
12. Soldering
Fig 11. Reflow soldering footprint SOT23 (TO-236AB)
Fig 12. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mmMMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 13 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
13. Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
MMBZXVCL_MMBZXVDL_SER_1 20080903 Product data sheet - -MMBZXVCL_MMBZXVDL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 3 September 2008 14 of 15
NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
ESD protection devices — These products are only intended for protection
against ElectroStatic Discharge (ESD) pulses and are not intended for any
other usage including, without limitation, voltage regulation applications. NXP
Semiconductors accepts no liability for use in such applications and therefore
such use is at the customer’s own risk.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors MMBZxVCL; MMBZxVDL series
Double ESD protection diodes for transient overvoltage suppression
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 September 2008
Document identifier: MMBZXVCL_MMBZXVDL_SER_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Application information. . . . . . . . . . . . . . . . . . 10
9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
9.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10
10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Packing information. . . . . . . . . . . . . . . . . . . . . 11
12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15 Contact information. . . . . . . . . . . . . . . . . . . . . 14
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1. Product profile
1.1 General description
The devices are 4-, 6- and 8-channel RC low-pass filter arrays which are designed to
provide filtering of undesired RF signals on the I/O ports of portable communication or
computing devices. In addition, the devices incorporate diodes to provide protection to
downstream components from ElectroStatic Discharge (ESD) voltages as high as ±30 kV.
The devices are fabricated using monolithic silicon technology and integrate up to eight
resistors and sixteen diodes in a 0.4 mm pitch 8-, 12- or 16-pin ultra-thin leadless Quad
Flat No-leads (QFN) plastic package with a height of 0.55 mm only.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
4-, 6- and 8-channel integrated π-type RC filter network
ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 far exceeding
level 4
QFN plastic package with 0.4 mm pitch and 0.55 mm height
1.3 Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
Cellular phone and Personal Communication System (PCS) mobile handsets
Cordless telephones
Wireless data (WAN/LAN) systems
Mobile Internet Devices (MID)
Portable Media Players (PMP)
IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
with ESD protection
Rev. 2 — 5 May 2011 Product data sheetIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 2 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
1.4 Quick reference data
[1] For the total channel.
2. Pinning information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 10 - pF
Rs(ch) channel series resistance 80 100 120 Ω
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 12 - pF
Rs(ch) channel series resistance 32 40 48 Ω
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 30 - pF
Rs(ch) channel series resistance 160 200 240 Ω
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
Cch channel capacitance f = 100 kHz;
Vbias(DC) = 2.5 V
[1] - 30 - pF
Rs(ch) channel series resistance 80 100 120 Ω
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
IP4251CZ8-4-TTL; IP4252CZ8-4-TTL; IP4253CZ8-4-TTL; IP4254CZ8-4-TTL (SOT1166-1)
1 and 8 filter channel 1
2 and 7 filter channel 2
3 and 6 filter channel 3
4 and 5 filter channel 4
ground pad ground
IP4251CZ12-6-TTL; IP4252CZ12-6-TTL; IP4253CZ12-6-TTL; IP4254CZ12-6-TTL (SOT1167-1)
1 and 12 filter channel 1
2 and 11 filter channel 2
3 and 10 filter channel 3
4 and 9 filter channel 4
5 and 8 filter channel 5
6 and 7 filter channel 6
ground pad ground
Transparent
top view
8
1
5
4
018aaa071
Rs(ch)
Cch
1 to 4 5 to 8
GND
2
Cch
2
Transparent
top view
12
1
7
6
018aaa072
Rs(ch)
1 to 6 7 to 12
GND
Cch
2
Cch
2IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 3 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
3. Ordering information
IP4251CZ16-8-TTL; IP4252CZ16-8-TTL; IP4253CZ16-8-TTL; IP4254CZ16-8-TTL (SOT1168-1)
1 and 16 filter channel 1
2 and 15 filter channel 2
3 and 14 filter channel 3
4 and 13 filter channel 4
5 and 12 filter channel 5
6 and 11 filter channel 6
7 and 10 filter channel 7
8 and 9 filter channel 8
ground pad ground
Table 2. Pinning …continued
Pin Description Simplified outline Graphic symbol
Transparent
top view
16
1
9
8
018aaa073
Rs(ch)
1 to 8 9 to 16
GND
Cch
2
Cch
2
Table 3. Ordering information
Type number Package
Name Description Version
IP4251CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4251CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4251CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP4252CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4252CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4252CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP4253CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4253CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4253CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP4254CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP4254CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP4254CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 4 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
4. Limiting values
[1] Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
[2] Device tested with 1000 pulses of ±30 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground;
contact discharge
[1] - ±15 kV
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground;
contact discharge
[1] - ±15 kV
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground [2]
contact discharge - ±30 kV
air discharge - ±30 kV
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
VESD electrostatic discharge
voltage
all pins to ground [2]
contact discharge - ±30 kV
air discharge - ±30 kV
Per device
VESD electrostatic discharge
voltage
IEC 61000-4-2, level 4;
all pins to ground
contact discharge - ±8 kV
air discharge - ±15 kV
VCC supply voltage −0.5 +5.6 V
Pch channel power dissipation Tamb = 85 °C - 60 mW
Ptot total power dissipation Tamb = 85 °C - 200 mW
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °CIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 5 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
5. Characteristics
[1] For the total channel.
[2] Guaranteed by design.
Table 5. Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 10 - pF
Vbias(DC) =0V [2] - 15 - pF
Rs(ch) channel series resistance 80 100 120 Ω
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 12 - pF
Vbias(DC) =0V [2] - 18 - pF
Rs(ch) channel series resistance 32 40 48 Ω
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 30 - pF
Vbias(DC) =0V [2] - 45 - pF
Rs(ch) channel series resistance 160 200 240 Ω
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
Cch channel capacitance f = 100 kHz [1]
Vbias(DC) = 2.5 V - 30 - pF
Vbias(DC) =0V [2] - 45 - pF
Rs(ch) channel series resistance 80 100 120 Ω
Per device
ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 μA
VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 9 V
VF forward voltage negative clamp; IF = 1 mA 0.4 - 1.5 VIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 6 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Table 6. Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 16 - dB
f = 1 GHz - 20 - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 30 - dB
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 12 - dB
f = 1 GHz - 14 - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 40 - dB
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 33 - dB
f = 1 GHz 35 - - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 30 - dB
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
αil insertion loss Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz - 28 - dB
f = 1 GHz 30 - - dB
αct crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
- 30 - dBIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 7 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
6. Application information
6.1 Insertion loss
The devices are designed as EMI/RFI filters for multichannel interfaces.
The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1.
Typical measurements results are shown in Figure 2 to Figure 6 for the different devices.
(1) IP4252CZ16-8-TTL - channel 1 to channel 16
(2) IP4251CZ16-8-TTL - channel 1 to channel 16
(3) IP4254CZ16-8-TTL - channel 1 to channel 16
(4) IP4253CZ16-8-TTL - channel 1 to channel 16
Fig 1. Frequency response setup Fig 2. Frequency response curves overview
018aaa074
50 Ω
Vgen
50 Ω
DUT
IN OUT
001aaj308
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
(3)
(4)IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 8 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Due to the optimized silicon dice and package design, all channels in a single package
show a very good matching performance as the insertion loss for a channel at the
package side (e.g. channel 1 to channel 16) is nearly identical with the center channels
(e.g. channel 4 to channel 13).
(1) Channel 1 to channel 16
(2) Channel 4 to channel 13
(1) Channel 1 to channel 16
(2) Channel 4 to channel 13
Fig 3. IP4251CZ16-8-TTL: frequency response
curves
Fig 4. IP4252CZ16-8-TTL: frequency response
curves
(1) Channel 1 to channel 16
(2) Channel 4 to channel 13
(1) Channel 4 to channel 13
(2) Channel 1 to channel 16
Fig 5. IP4253CZ16-8-TTL: frequency response
curves
Fig 6. IP4254CZ16-8-TTL: frequency response
curves
001aaj608
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
001aaj609
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
001aaj610
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)
001aaj611
−30
−20
−40
−10
0
S21
(dB)
−50
f (MHz)
10−1 104 103 1 102 10
(1)
(2)IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 9 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
6.2 Selection
The selection of one of the filter devices has to be performed depending on the maximum
clock frequency, driver strength, capacitive load of the sink, and also the maximum
applicable rise and fall times.
6.2.1 SDHC and MMC memory interface
The Secure Digital High Capacity (SDHC) memory card interface standard specification
and the Multi Media Card (MMC) (JESD 84A43) standard specification recommend a rise
and fall time of 25 % to 62.5 % (62.5 % to 25 % respectively) of 3 ns or less for the input
signal of the receiving interface side.
Assuming a typical capacitance of about 20 pF for the SDHC memory card itself, and
approximately 4 pF to 7 pF for the Printed-Circuit Board (PCB) and the card holder,
IP4252CZ12-6-TTL (6 channels, Rs(ch) = 40 Ω, Cch = 12 pF at Vbias(DC) = 2.5 V) is a
matching selection to filter and protect all relevant interface pins such as CLK, CMD, and
DAT0 to DAT3/CD. Please refer to Figure 7 for a general example of the implementation
of the device in an SDHC card interface.
In case additional channels such as write-protect or a mechanical card-detection switch
are used, the IP4252CZ16-8-TTL (8 channels, Rs(ch) = 40 Ω, Cch = 12 pF at
Vbias(DC) = 2.5 V) offers two additional channels.IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 10 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
The capacitance values specified for the signal channels of the MMC interface differ from
the SDHC specification. The MMC card-side interface is specified to have an intrinsic
capacitance of 12 pF to 18 pF and the total channel is limited according to the
specification to 30 pF only. Therefore, any filter device capacitance is limited to a
maximum of up to 18 pF, including the card holder and PCB traces.
Please refer to Figure 8 for a general example of the implementation of the IP4252 in an
MMC interface application.
Fig 7. Example of IP4252 in an SDHC card interface
018aaa075
IP4252CZ12-6-TTL
(IP4252CZ16-8-TTL)
DAT1
pull-up resistors
10 kΩ − 100 kΩ
10 kΩ − 90 kΩ
DAT3/CD pull-up
10 kΩ − 100 kΩ
DAT3/CD pull-up
>270 kΩ
exact value
depends on
required
logic levels
DAT1 SD MEMORY
CARD
SET_CLR_
CARD_DETECT
(ACMD42)
to HOST
INTERFACE
DAT0
GND
CLK
VCC(VSD)
VCC(VSD)
DAT3/CD
CMD
DAT2
optional:
2-additional channels
of IP4252CZ16-8-TTL
optional:
write protect switch
optional:
electrical card detect
WP
DAT0
CLK
CMD
DAT3/CD
DAT2
CD
WP
optional:
card detect switch
CDIP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 11 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
To generate SDHC and MMC-compliant digital signals, the driver strength should not
significantly undercut 8 mA.
6.2.2 LCD interfaces, medium-speed interfaces
For digital interfaces such as LCD interfaces running at clock speeds between 10 MHz
and 25 MHz or more, IP4251, IP4252 or IP4254 can be used depending on the sink load,
clock speed, driver strength and rise and fall time requirements. Also the minimum
EMI filter requirements may be a decision-making factor.
6.2.3 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces
(e.g. Recommended Standard (RS) 232) and low-speed control signals,
IP4253 (Rs(ch) = 200 Ω, Cch = 30 pF at Vbias(DC) = 2.5 V) offers a very robust
ESD protection and strong suppression of unwanted frequencies (EMI filtering).
Fig 8. Example of IP4252 in an MMC interface
018aaa076
IP4252CZ12-6-TTL
IP4252CZ8-4-TTL
DAT1
pull-up resistors
50 kΩ - 100 kΩ
CMD pull-up
4.7 kΩ - 100 kΩ
DAT1 C8
e.g.
RSMMC
HOST
INTERFACE
DAT0 C7
DAT7 C13
VSS2 C6
DAT6 C12
CLK C5
VCC(VMMC)
VCC(VMMC)
C4
VSS1 C3
DAT5 C11
CMD C2
DAT4 C10
DAT3 C1
DAT2
CMD
DAT4
DAT3
DAT2 C9
DAT0
DAT7
DAT6
CLK
DAT5IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 12 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
7. Package outline
Fig 9. Package outline SOT1166-1 (HUSON8)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOT1166-1 - - - - - - - - -
sot1166-1_po
10-03-18
10-03-22
Unit(1)
mm
max
nom
min
0.55 0.05
0.00
0.25
0.20
0.15
1.8
1.7
1.6
1.3
1.2
1.1
1.45
1.35
1.25
0.4 1.2
0.30
0.25
0.20
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1
A1 c
0.127
b DDh E Eh
0.45
0.40
0.35
e e1 k
0.2
L v
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y1 C y
tiebars are indicated on
arbitrary location and size
detail X
A
A1
c
terminal 1
index area
D B A
E
b
terminal 1
index area
e1
e v C A B
w C
L
k
Eh
Dh
1
8
4
5IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 13 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Fig 10. Package outline SOT1167-1 (HUSON12)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOT1167-1 - - - - - - - - -
sot1167-1_po
10-03-18
10-03-22
Unit(1)
mm
max
nom
min
0.55 0.05
0.00
0.25
0.20
0.15
2.6
2.5
2.4
2.1
2.0
1.9
1.45
1.35
1.25
0.4 2.0
0.30
0.25
0.20
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HUSON12: plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 x 2.5 x 0.55 mm SOT1167-1
A1 c
0.127
b DDh E Eh
0.45
0.40
0.35
e e1 k
0.2
L v
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y1 C y
tiebars are indicated on
arbitrary location and size
detail X
A
A1
c
terminal 1
index area
D B A
E
b
terminal 1
index area
e1
e v C A B
w C
L
k
Eh
Dh
1
12
6
7IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 14 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Fig 11. Package outline SOT1168-1 (HUSON16)
Outline References
version
European
projection Issue date
IEC JEDEC JEITA
SOT1168-1 - - - - - - - - -
sot1168-1_po
10-03-18
10-03-22
Unit(1)
mm
max
nom
min
0.55 0.05
0.00
0.25
0.20
0.15
3.4
3.3
3.2
2.9
2.8
2.7
1.45
1.35
1.25
0.4 2.8
0.30
0.25
0.20
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1
A1 c
0.127
b DDh E Eh
0.45
0.40
0.35
e e1 k
0.2
L v
0.1
w
0.05
y
0.05
y1
0 1 2 mm
scale
X
C
y1 C y
tiebars are indicated on
arbitrary location and size
detail X
A
A1
c
terminal 1
index area
D B A
E
b
terminal 1
index area
e1
e v C A B
w C
L
k
Eh
Dh
1
16
8
9IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 15 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
IP4251_52_53_54-TTL v.2 20110505 Product data sheet - IP4251_52_53_54-TTL v.1
Modifications: • Section 1 “Product profile”: updated.
• Table 2 “Pinning”: updated.
• Deleted section “Thermal characteristics”.
IP4251_52_53_54-TTL v.1 20110131 Objective data sheet - -IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 16 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. IP4251_52_53_54-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 5 May 2011 17 of 18
NXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors IP4251/52/53/54-TTL
Integrated 4-, 6- and 8-channel passive filter network
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 May 2011
Document identifier: IP4251_52_53_54-TTL
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Application information. . . . . . . . . . . . . . . . . . . 7
6.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.2 Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.2.1 SDHC and MMC memory interface . . . . . . . . . 9
6.2.2 LCD interfaces, medium-speed interfaces . . . 11
6.2.3 Keypad, low-speed interfaces. . . . . . . . . . . . . 11
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
10 Contact information. . . . . . . . . . . . . . . . . . . . . 17
11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
DATA SHEET
Product data sheet
Supersedes data of 2003 Nov 27
2004 Nov 04
DISCRETE SEMICONDUCTORS
PBSS5320X
20 V, 3 A
PNP low VCEsat (BISS) transistor
dbook, halfpage
M3D1092004 Nov 04 2
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
FEATURES
• SOT89 (SC-62) package
• Low collector-emitter saturation voltage VCEsat
• High collector current capability: IC and ICM
• Higher efficiency leading to less heat generation
• Reduced printed-circuit board requirements.
APPLICATIONS
• Power management
– DC/DC converters
– Supply line switching
– Battery charger
– LCD backlighting.
• Peripheral drivers
– Driver in low supply voltage applications (e.g. lamps
and LEDs)
– Inductive load driver (e.g. relays,
buzzers and motors).
DESCRIPTION
PNP low VCEsat transistor in a SOT89 plastic package.
NPN complement: PBSS4320X.
MARKING
TYPE NUMBER MARKING CODE
PBSS5320X S45
PINNING
PIN DESCRIPTION
1 emitter
2 collector
3 base
321 sym079
1
2
3
Fig.1 Simplified outline (SOT89) and symbol.
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
VCEO collector-emitter voltage −20 V
IC collector current (DC) −3 A
ICM peak collector current −5 A
RCEsat equivalent on-resistance 105 mΩ
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PBSS5320X SC-62 plastic surface mounted package; collector pad for good heat
transfer; 3 leads
SOT892004 Nov 04 3
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; standard footprint.
2. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 1 cm2.
3. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 6 cm2.
4. Device mounted on a ceramic printed-circuit board 7 cm2, single-sided copper, tin-plated.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − −20 V
VCEO collector-emitter voltage open base − −20 V
VEBO emitter-base voltage open collector − −5 V
IC collector current (DC) note 4 − −3 A
ICM peak collector current limited by Tj(max) − −5 A
IB base current (DC) − −0.5 A
Ptot total power dissipation Tamb ≤ 25 °C
note 1 − 550 mW
note 2 − 1 W
note 3 − 1.4 W
note 4 − 1.6 W
Tstg storage temperature −65 +150 °C
Tj junction temperature − 150 °C
Tamb ambient temperature −65 +150 °C2004 Nov 04 4
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
handbook, halfpage
0 40 80 160
Ptot
(W) (1)
(2)
(3)
2
0
1.6
120
1.2
0.8
0.4
MLE372
Tamb (°C)
(4)
Fig.2 Power derating curves.
(1) Ceramic PCB; 7 cm2
mounting pad for collector.
(2) FR4 PCB; 6 cm2 copper
mounting pad for collector.
(3) FR4 PCB; 1 cm2 copper
mounting pad for collector.
(4) Standard footprint.2004 Nov 04 5
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
THERMAL CHARACTERISTICS
Notes
1. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; standard footprint.
2. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 1 cm2.
3. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 6 cm2.
4. Device mounted on a ceramic printed-circuit board 7 cm2, single-sided copper, tin-plated.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air
note 1 225 K/W
note 2 125 K/W
note 3 90 K/W
note 4 80 K/W
Rth(j-s) thermal resistance from junction to soldering point 16 K/W
006aaa243
10
1
102
103
Zth(j-a)
(K/W)
10−1
10−5 10 10 −2 10−4 102 10−1
tp (s)
10−3 103 1
duty cycle =
1.00
0.75
0.50
0.33
0.20
0.10
0.05
0.02
0.01
0
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
Mounted on FR4 printed-circuit board; standard footprint.2004 Nov 04 6
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
006aaa244
10
1
102
103
Zth(j-a)
(K/W)
10−1
10−5 10 10 −2 10−4 102 10−1
tp (s)
10−3 103 1
duty cycle =
1.00
0.75
0.50
0.20
0.05
0.02
0.01
0
0.33
0.10
Fig.4 Transient thermal impedance as a function of pulse time; typical values.
Mounted on FR4 printed-circuit board; mounting pad for collector 1 cm2.
006aaa245
10
1
102
103
Zth(j-a)
(K/W)
10−1
10−5 10 10 −2 10−4 102 10−1
tp (s)
10−3 103 1
duty cycle =
1.00
0.75
0.50
0.20
0.05
0.02
0.01
0
0.33
0.10
Fig.5 Transient thermal impedance as a function of pulse time; typical values.
Mounted on FR4 printed-circuit board; mounting pad for collector 6 cm2.2004 Nov 04 7
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
ICBO collector-base cut-off current VCB = −20 V; IE = 0 A − − −100 nA
VCB = −20 V; IE = 0 A; Tj = 150 °C − − −50 μA
ICES collector-emitter cut-off current VCE = −20 V; VBE = 0 V − − −100 nA
IEBO emitter-base cut-off current VEB = −5 V; IC = 0 A − − −100 nA
hFE DC current gain VCE = −2 V
IC = −0.1 A 220 − −
IC = −0.5 A 220 − −
IC = −1 A; note 1 200 − −
IC = −2 A; note 1 150 − −
IC = −3 A; note 1 100 − −
VCEsat collector-emitter saturation
voltage
IC = −0.5 A; IB = −50 mA − − −70 mV
IC = −1 A; IB = −50 mA − − −130 mV
IC = −2 A; IB = −100 mA − − −230 mV
IC = −3 A; IB = −300 mA; note 1 − − −300 mV
RCEsat equivalent on-resistance IC = −3 A; IB = −300 mA; note 1 − 90 105 mΩ
VBEsat base-emitter saturation voltage IC = −2 A; IB = −100 mA − −1.1 − V
IC = −3 A; IB = −300 mA; note 1 − − −1.2 V
VBEon base-emitter turn-on voltage VCE = −2 V; IC = −1 A −1.1 − − V
fT transition frequency IC = −100 mA; VCE = −5 V;
f = 100 MHz
100 − − MHz
Cc collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz − − 50 pF2004 Nov 04 8
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
0
800
200
400
600
MLE374
−10−1 −1
I
C (mA)
hFE
−10 −102 −103 −104
(2)
(3)
(1)
Fig.6 DC current gain as a function of collector
current; typical values.
VCE = −2 V.
(1) Tamb = 100 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
handbook, halfpage
MLE368
0
−1.2
−0.4
−0.8
−10−1 −1 −10
I
C (mA)
VBE
(V)
−102 −103 −104
(1)
(3)
(2)
Fig.7 Base-emitter voltage as a function of
collector current; typical values.
VCE = −2 V.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 100 °C.
handbook, halfpage
MLE370
−1
−10−1
−10−2
−10−3
−10−1 −1 −10
I
C (mA)
VCEsat
(V)
−102 −103 −104
(1)
(3)
(2)
Fig.8 Collector-emitter saturation voltage as a
function of collector current; typical values.
IC/IB = 20.
(1) Tamb = 100 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
handbook, halfpage
MLE371
−1
−10−1
−10−2
−10−3
−10−1 −1 −10
I
C (mA)
VCEsat
(V)
−102 −103 −104
(3)
(1)
(2)
Fig.9 Collector-emitter saturation voltage as a
function of collector current; typical values.
Tamb = 25 °C.
(1) IC/IB = 100.
(2) IC/IB = 50.
(3) IC/IB = 10.2004 Nov 04 9
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
handbook, halfpage −10
−1
−10−1 −1 −10 −102 −103 −104 −10−1
MLE369
I
C (mA)
VBEsat
(V)
(2)
(3)
(1)
Fig.10 Base-emitter saturation voltage as a
function of collector current; typical values.
IC/IB = 20.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 100 °C.
handbook, halfpage
103
102
10
1
10−2
10−1
MLE376
−10−1 −1 −10
I
C (mA)
RCEsat
(Ω)
−103 −102 −104
(1)
(3) (2)
Fig.11 Equivalent on-resistance as a function of
collector current; typical values.
Tamb = 25 °C.
(1) IC/IB = 100. (2) IC/IB = 50. (3) IC/IB = 10.
handbook, halfpage
MLE367
102
10
10−1
10−2
1
−10−1 −1
RCEsat
(Ω)
I
C (mA) −10 −102 −103 −104
(2)
(3)
(1)
Fig.12 Equivalent on-resistance as a function of
collector current; typical values.
IC/IB = 20.
(1) Tamb = 100 °C. (2) Tamb = 25 °C. (3) Tamb = −55 °C.
handbook, halfpage
0 −2
−5
0
−1
−2
−3
−4
−0.4
VCE (V)
I
C
(A)
−0.8 −1.2 −1.6
MLE375
(8)
(5)
(1)
(2)
(3)
(4)
(10)
(7)
(6)
(9)
Fig.13 Collector current as a function of
collector-emitter voltage; typical values.
(1) IB = −25 mA.
(2) IB = −22.5 mA.
(3) IB = −20 mA.
(4) IB = −17.5 mA.
(5) IB = −15 mA.
(6) IB = −12.5 mA.
(7) IB = −10 mA.
(8) IB = −7.5 mA.
(9) IB = −5 mA.
(10) IB = −2.5 mA.
Tamb = 25 °C.2004 Nov 04 10
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
PACKAGE OUTLINE
REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
DIMENSIONS (mm are the original dimensions)
SOT89 TO-243 SC-62 04-08-03
06-03-16
w M
e1
e
E
HE
B
0 2 4 mm
scale
bp3
bp2
bp1
c
D
Lp
A
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89
1 23
UNIT A
mm 1.6
1.4
0.48
0.35
c
0.44
0.23
D
4.6
4.4
E
2.6
2.4
HE Lp
4.25
3.75
e
3.0
w
0.13
e1
1.5 1.2
0.8
bp1 bp2
0.53
0.40
bp3
1.8
1.42004 Nov 04 11
NXP Semiconductors Product data sheet
20 V, 3 A
PNP low VCEsat (BISS) transistor PBSS5320X
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
DISCLAIMERS
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding. NXP Semiconductors
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R75/03/pp12 Date of release: 2004 Nov 04 Document order number: 9397 750 13887
Features
• Utilizes the AVR® RISC Architecture
• AVR – High-performance and Low-power RISC Architecture
– 120 Powerful Instructions – Most Single Clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 20 MIPS Throughput at 20 MHz
• Data and Non-volatile Program and Data Memories
– 2K Bytes of In-System Self Programmable Flash
Endurance 10,000 Write/Erase Cycles
– 128 Bytes In-System Programmable EEPROM
Endurance: 100,000 Write/Erase Cycles
– 128 Bytes Internal SRAM
– Programming Lock for Flash Program and EEPROM Data Security
• Peripheral Features
– One 8-bit Timer/Counter with Separate Prescaler and Compare Mode
– One 16-bit Timer/Counter with Separate Prescaler, Compare and Capture Modes
– Four PWM Channels
– On-chip Analog Comparator
– Programmable Watchdog Timer with On-chip Oscillator
– USI – Universal Serial Interface
– Full Duplex USART
• Special Microcontroller Features
– debugWIRE On-chip Debugging
– In-System Programmable via SPI Port
– External and Internal Interrupt Sources
– Low-power Idle, Power-down, and Standby Modes
– Enhanced Power-on Reset Circuit
– Programmable Brown-out Detection Circuit
– Internal Calibrated Oscillator
• I/O and Packages
– 18 Programmable I/O Lines
– 20-pin PDIP, 20-pin SOIC, 20-pad QFN/MLF
• Operating Voltages
– 1.8 – 5.5V (ATtiny2313V)
– 2.7 – 5.5V (ATtiny2313)
• Speed Grades
– ATtiny2313V: 0 – 4 MHz @ 1.8 - 5.5V, 0 – 10 MHz @ 2.7 – 5.5V
– ATtiny2313: 0 – 10 MHz @ 2.7 - 5.5V, 0 – 20 MHz @ 4.5 – 5.5V
• Typical Power Consumption
– Active Mode
1 MHz, 1.8V: 230 µA
32 kHz, 1.8V: 20 µA (including oscillator)
– Power-down Mode
< 0.1 µA at 1.8V
8-bit
Microcontroller
with 2K Bytes
In-System
Programmable
Flash
ATtiny2313/V
Preliminary
Rev. 2543L–AVR–08/102
2543L–AVR–08/10
ATtiny2313
Pin
Configurations
Figure 1. Pinout ATtiny2313
Overview The ATtiny2313 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC
architecture. By executing powerful instructions in a single clock cycle, the ATtiny2313 achieves
throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption
versus processing speed.
(RESET/dW) PA2
(RXD) PD0
(TXD) PD1
(XTAL2) PA1
(XTAL1) PA0
(CKOUT/XCK/INT0) PD2
(INT1) PD3
(T0) PD4
(OC0B/T1) PD5
GND
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
VCC
PB7 (UCSK/SCL/PCINT7)
PB6 (MISO/DO/PCINT6)
PB5 (MOSI/DI/SDA/PCINT5)
PB4 (OC1B/PCINT4)
PB3 (OC1A/PCINT3)
PB2 (OC0A/PCINT2)
PB1 (AIN1/PCINT1)
PB0 (AIN0/PCINT0)
PD6 (ICP)
PDIP/SOIC
1
2
3
4
5
MLF
15
14
13
12
11
20
19
18
17
16
6
7
8
9
10
(TXD) PD1
XTAL2) PA1
(XTAL1) PA0
(CKOUT/XCK/INT0) PD2
(INT1) PD3
(T0) PD4
(OC0B/T1) PD5
GND
(ICP) PD6
(AIN0/PCINT0) PB0
PB5 (MOSI/DI/SDA/PCINT5)
PB4 (OC1B/PCINT4)
PB3 (OC1A/PCINT3)
PB2 (OC0A/PCINT2)
PB1 (AIN1/PCINT1)
PD0 (RXD)
PA2 (RESET/dW)
VCC
PB7 (UCSK/SCK/PCINT7)
PB6 (MISO/DO/PCINT6)
NOTE: Bottom pad should be soldered to ground.3
2543L–AVR–08/10
ATtiny2313
Block Diagram
Figure 2. Block Diagram
PROGRAM
COUNTER
PROGRAM
FLASH
INSTRUCTION
REGISTER
GND
VCC
INSTRUCTION
DECODER
CONTROL
LINES
STACK
POINTER
SRAM
GENERAL
PURPOSE
REGISTER
ALU
STATUS
REGISTER
PROGRAMMING
LOGIC SPI
8-BIT DATA BUS
XTAL1 XTAL2
RESET
INTERNAL
OSCILLATOR
OSCILLATOR
WATCHDOG
TIMER
TIMING AND
CONTROL
MCU CONTROL
REGISTER
MCU STATUS
REGISTER
TIMER/
COUNTERS
INTERRUPT
UNIT
EEPROM
USI
USART
ANALOG
COMPARATOR
DATA REGISTER
PORTB
DATA DIR.
REG. PORTB
DATA REGISTER
PORTA
DATA DIR.
REG. PORTA
PORTB DRIVERS
PB0 - PB7
PORTA DRIVERS
PA0 - PA2
DATA REGISTER
PORTD
DATA DIR.
REG. PORTD
PORTD DRIVERS
PD0 - PD6
ON-CHIP
DEBUGGER
INTERNAL
CALIBRATED
OSCILLATOR4
2543L–AVR–08/10
ATtiny2313
The AVR core combines a rich instruction set with 32 general purpose working registers. All the
32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent
registers to be accessed in one single instruction executed in one clock cycle. The resulting
architecture is more code efficient while achieving throughputs up to ten times faster than conventional
CISC microcontrollers.
The ATtiny2313 provides the following features: 2K bytes of In-System Programmable Flash,
128 bytes EEPROM, 128 bytes SRAM, 18 general purpose I/O lines, 32 general purpose working
registers, a single-wire Interface for On-chip Debugging, two flexible Timer/Counters with
compare modes, internal and external interrupts, a serial programmable USART, Universal
Serial Interface with Start Condition Detector, a programmable Watchdog Timer with internal
Oscillator, and three software selectable power saving modes. The Idle mode stops the CPU
while allowing the SRAM, Timer/Counters, and interrupt system to continue functioning. The
Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip
functions until the next interrupt or hardware reset. In Standby mode, the crystal/resonator Oscillator
is running while the rest of the device is sleeping. This allows very fast start-up combined
with low-power consumption.
The device is manufactured using Atmel’s high density non-volatile memory technology. The
On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI
serial interface, or by a conventional non-volatile memory programmer. By combining an 8-bit
RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATtiny2313
is a powerful microcontroller that provides a highly flexible and cost effective solution to many
embedded control applications.
The ATtiny2313 AVR is supported with a full suite of program and system development tools
including: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators,
and Evaluation kits.5
2543L–AVR–08/10
ATtiny2313
Pin Descriptions
VCC Digital supply voltage.
GND Ground.
Port A (PA2..PA0) Port A is a 3-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port A output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port A pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port A also serves the functions of various special features of the ATtiny2313 as listed on page
53.
Port B (PB7..PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port B also serves the functions of various special features of the ATtiny2313 as listed on page
53.
Port D (PD6..PD0) Port D is a 7-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port D output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port D also serves the functions of various special features of the ATtiny2313 as listed on page
56.
RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running. The minimum pulse length is given in Table 15 on page
34. Shorter pulses are not guaranteed to generate a reset. The Reset Input is an alternate function
for PA2 and dW.
XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit. XTAL1
is an alternate function for PA0.
XTAL2 Output from the inverting Oscillator amplifier. XTAL2 is an alternate function for PA1.6
2543L–AVR–08/10
ATtiny2313
General
Information
Resources A comprehensive set of development tools, application notes and datasheets are available for
downloadon http://www.atmel.com/avr.
Code Examples This documentation contains simple code examples that briefly show how to use various parts of
the device. These code examples assume that the part specific header file is included before
compilation. Be aware that not all C compiler vendors include bit definitions in the header files
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation
for more details.
Disclaimer Typical values contained in this data sheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.7
2543L–AVR–08/10
ATtiny2313
AVR CPU Core
Introduction This section discusses the AVR core architecture in general. The main function of the CPU core
is to ensure correct program execution. The CPU must therefore be able to access memories,
perform calculations, control peripherals, and handle interrupts.
Architectural
Overview
Figure 3. Block Diagram of the AVR Architecture
In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with
separate memories and buses for program and data. Instructions in the program memory are
executed with a single level pipelining. While one instruction is being executed, the next instruction
is pre-fetched from the program memory. This concept enables instructions to be executed
in every clock cycle. The program memory is In-System Reprogrammable Flash memory.
The fast-access Register File contains 32 x 8-bit general purpose working registers with a single
clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical
ALU operation, two operands are output from the Register File, the operation is executed,
and the result is stored back in the Register File – in one clock cycle.
Flash
Program
Memory
Instruction
Register
Instruction
Decoder
Program
Counter
Control Lines
32 x 8
General
Purpose
Registrers
ALU
Status
and Control
I/O Lines
EEPROM
Data Bus 8-bit
Data
SRAM
Direct Addressing
Indirect Addressing
Interrupt
Unit
SPI
Unit
Watchdog
Timer
Analog
Comparator
I/O Module 2
I/O Module1
I/O Module n8
2543L–AVR–08/10
ATtiny2313
Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data
Space addressing – enabling efficient address calculations. One of the these address pointers
can also be used as an address pointer for look up tables in Flash program memory. These
added function registers are the 16-bit X-, Y-, and Z-register, described later in this section.
The ALU supports arithmetic and logic operations between registers or between a constant and
a register. Single register operations can also be executed in the ALU. After an arithmetic operation,
the Status Register is updated to reflect information about the result of the operation.
Program flow is provided by conditional and unconditional jump and call instructions, able to
directly address the whole address space. Most AVR instructions have a single 16-bit word format.
Every program memory address contains a 16- or 32-bit instruction.
During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the
Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack
size is only limited by the total SRAM size and the usage of the SRAM. All user programs must
initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack
Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed
through the five different addressing modes supported in the AVR architecture.
The memory spaces in the AVR architecture are all linear and regular memory maps.
A flexible interrupt module has its control registers in the I/O space with an additional Global
Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the
Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position.
The lower the Interrupt Vector address, the higher the priority.
The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers,
and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space
locations following those of the Register File, 0x20 - 0x5F.
ALU – Arithmetic
Logic Unit
The high-performance AVR ALU operates in direct connection with all the 32 general purpose
working registers. Within a single clock cycle, arithmetic operations between general purpose
registers or between a register and an immediate are executed. The ALU operations are divided
into three main categories – arithmetic, logical, and bit-functions. Some implementations of the
architecture also provide a powerful multiplier supporting both signed/unsigned multiplication
and fractional format. See the “Instruction Set” section for a detailed description.
Status Register The Status Register contains information about the result of the most recently executed arithmetic
instruction. This information can be used for altering program flow in order to perform
conditional operations. Note that the Status Register is updated after all ALU operations, as
specified in the Instruction Set Reference. This will in many cases remove the need for using the
dedicated compare instructions, resulting in faster and more compact code.
The Status Register is not automatically stored when entering an interrupt routine and restored
when returning from an interrupt. This must be handled by software.9
2543L–AVR–08/10
ATtiny2313
The AVR Status Register – SREG – is defined as:
• Bit 7 – I: Global Interrupt Enable
The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt
enable control is then performed in separate control registers. If the Global Interrupt Enable
Register is cleared, none of the interrupts are enabled independent of the individual interrupt
enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by
the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by
the application with the SEI and CLI instructions, as described in the instruction set reference.
• Bit 6 – T: Bit Copy Storage
The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination
for the operated bit. A bit from a register in the Register File can be copied into T by the
BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the
BLD instruction.
• Bit 5 – H: Half Carry Flag
The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is useful
in BCD arithmetic. See the “Instruction Set Description” for detailed information.
• Bit 4 – S: Sign Bit, S = N ⊕ V
The S-bit is always an exclusive or between the negative flag N and the Two’s Complement
Overflow Flag V. See the “Instruction Set Description” for detailed information.
• Bit 3 – V: Two’s Complement Overflow Flag
The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the
“Instruction Set Description” for detailed information.
• Bit 2 – N: Negative Flag
The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the
“Instruction Set Description” for detailed information.
• Bit 1 – Z: Zero Flag
The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction
Set Description” for detailed information.
• Bit 0 – C: Carry Flag
The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set
Description” for detailed information.
General Purpose
Register File
The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve
the required performance and flexibility, the following input/output schemes are supported by the
Register File:
• One 8-bit output operand and one 8-bit result input
• Two 8-bit output operands and one 8-bit result input
• Two 8-bit output operands and one 16-bit result input
• One 16-bit output operand and one 16-bit result input
Figure 4 shows the structure of the 32 general purpose working registers in the CPU.
Bit 7 6 5 4 3 2 1 0
I T H S V N Z C SREG
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 010
2543L–AVR–08/10
ATtiny2313
Figure 4. AVR CPU General Purpose Working Registers
Most of the instructions operating on the Register File have direct access to all registers, and
most of them are single cycle instructions.
As shown in Figure 4, each register is also assigned a data memory address, mapping them
directly into the first 32 locations of the user Data Space. Although not being physically implemented
as SRAM locations, this memory organization provides great flexibility in access of the
registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file.
The X-register, Yregister,
and Z-register
The registers R26..R31 have some added functions to their general purpose usage. These registers
are 16-bit address pointers for indirect addressing of the data space. The three indirect
address registers X, Y, and Z are defined as described in Figure 5.
Figure 5. The X-, Y-, and Z-registers
In the different addressing modes these address registers have functions as fixed displacement,
automatic increment, and automatic decrement (see the instruction set reference for details).
7 0 Addr.
R0 0x00
R1 0x01
R2 0x02
…
R13 0x0D
General R14 0x0E
Purpose R15 0x0F
Working R16 0x10
Registers R17 0x11
…
R26 0x1A X-register Low Byte
R27 0x1B X-register High Byte
R28 0x1C Y-register Low Byte
R29 0x1D Y-register High Byte
R30 0x1E Z-register Low Byte
R31 0x1F Z-register High Byte
15 XH XL 0
X-register 7 0 7 0
R27 (0x1B) R26 (0x1A)
15 YH YL 0
Y-register 7 0 7 0
R29 (0x1D) R28 (0x1C)
15 ZH ZL 0
Z-register 7 0 7 0
R31 (0x1F) R30 (0x1E)11
2543L–AVR–08/10
ATtiny2313
Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing
return addresses after interrupts and subroutine calls. The Stack Pointer Register always points
to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations
to lower memory locations. This implies that a Stack PUSH command decreases the Stack
Pointer.
The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt
Stacks are located. This Stack space in the data SRAM must be defined by the program before
any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to
point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack
with the PUSH instruction, and it is decremented by two when the return address is pushed onto
the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is
popped from the Stack with the POP instruction, and it is incremented by two when data is
popped from the Stack with return from subroutine RET or return from interrupt RETI.
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of
bits actually used is implementation dependent. Note that the data space in some implementations
of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register
will not be present.
Instruction
Execution Timing
This section describes the general access timing concepts for instruction execution. The AVR
CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the
chip. No internal clock division is used.
Figure 6 shows the parallel instruction fetches and instruction executions enabled by the Harvard
architecture and the fast-access Register File concept. This is the basic pipelining concept
to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost,
functions per clocks, and functions per power-unit.
Figure 6. The Parallel Instruction Fetches and Instruction Executions
Figure 7 shows the internal timing concept for the Register File. In a single clock cycle an ALU
operation using two register operands is executed, and the result is stored back to the destination
register.
Bit 15 14 13 12 11 10 9 8
– – – – – – – – SPH
SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL
76543210
Read/Write R R R R R R R R
R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND
RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND
clk
1st Instruction Fetch
1st Instruction Execute
2nd Instruction Fetch
2nd Instruction Execute
3rd Instruction Fetch
3rd Instruction Execute
4th Instruction Fetch
T1 T2 T3 T4
CPU12
2543L–AVR–08/10
ATtiny2313
Figure 7. Single Cycle ALU Operation
Reset and
Interrupt Handling
The AVR provides several different interrupt sources. These interrupts and the separate Reset
Vector each have a separate program vector in the program memory space. All interrupts are
assigned individual enable bits which must be written logic one together with the Global Interrupt
Enable bit in the Status Register in order to enable the interrupt.
The lowest addresses in the program memory space are by default defined as the Reset and
Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 44. The list also
determines the priority levels of the different interrupts. The lower the address the higher is the
priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request
0. Refer to “Interrupts” on page 44 for more information.
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled.
The user software can write logic one to the I-bit to enable nested interrupts. All enabled
interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a
Return from Interrupt instruction – RETI – is executed.
There are basically two types of interrupts. The first type is triggered by an event that sets the
interrupt flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector
in order to execute the interrupt handling routine, and hardware clears the corresponding interrupt
flag. Interrupt flags can also be cleared by writing a logic one to the flag bit position(s) to be
cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared,
the interrupt flag will be set and remembered until the interrupt is enabled, or the flag is cleared
by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable
bit is cleared, the corresponding interrupt flag(s) will be set and remembered until the Global
Interrupt Enable bit is set, and will then be executed by order of priority.
The second type of interrupts will trigger as long as the interrupt condition is present. These
interrupts do not necessarily have interrupt flags. If the interrupt condition disappears before the
interrupt is enabled, the interrupt will not be triggered.
When the AVR exits from an interrupt, it will always return to the main program and execute one
more instruction before any pending interrupt is served.
Note that the Status Register is not automatically stored when entering an interrupt routine, nor
restored when returning from an interrupt routine. This must be handled by software.
When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled.
No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the
Total Execution Time
Register Operands Fetch
ALU Operation Execute
Result Write Back
T1 T2 T3 T4
clkCPU13
2543L–AVR–08/10
ATtiny2313
CLI instruction. The following example shows how this can be used to avoid interrupts during the
timed EEPROM write sequence..
When using the SEI instruction to enable interrupts, the instruction following SEI will be executed
before any pending interrupts, as shown in this example.
Interrupt Response
Time
The interrupt execution response for all the enabled AVR interrupts is four clock cycles minimum.
After four clock cycles the program vector address for the actual interrupt handling routine
is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack.
The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If
an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed
before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt
execution response time is increased by four clock cycles. This increase comes in addition to the
start-up time from the selected sleep mode.
A return from an interrupt handling routine takes four clock cycles. During these four clock
cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is
incremented by two, and the I-bit in SREG is set.
Assembly Code Example
in r16, SREG ; store SREG value
cli ; disable interrupts during timed sequence
sbi EECR, EEMPE ; start EEPROM write
sbi EECR, EEPE
out SREG, r16 ; restore SREG value (I-bit)
C Code Example
char cSREG;
cSREG = SREG; /* store SREG value */
/* disable interrupts during timed sequence */
__disable_interrupt();
EECR |= (1< xxx
... ... ... ... 46
2543L–AVR–08/10
ATtiny2313
I/O-Ports
Introduction All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports.
This means that the direction of one port pin can be changed without unintentionally changing
the direction of any other pin with the SBI and CBI instructions. The same applies when changing
drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as
input). Each output buffer has symmetrical drive characteristics with both high sink and source
capability. The pin driver is strong enough to drive LED displays directly. All port pins have individually
selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have
protection diodes to both VCC and Ground as indicated in Figure 21. Refer to “Electrical Characteristics”
on page 177 for a complete list of parameters.
Figure 21. I/O Pin Equivalent Schematic
All registers and bit references in this section are written in general form. A lower case “x” represents
the numbering letter for the port, and a lower case “n” represents the bit number. However,
when using the register or bit defines in a program, the precise form must be used. For example,
PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Registers
and bit locations are listed in “Register Description for I/O-Ports” on page 58.
Three I/O memory address locations are allocated for each port, one each for the Data Register
– PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input Pins
I/O location is read only, while the Data Register and the Data Direction Register are read/write.
However, writing a logic one to a bit in the PINx Register, will result in a toggle in the corresponding
bit in the Data Register. In addition, the Pull-up Disable – PUD bit in MCUCR disables the
pull-up function for all pins in all ports when set.
Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on page
47. Most port pins are multiplexed with alternate functions for the peripheral features on the
device. How each alternate function interferes with the port pin is described in “Alternate Port
Functions” on page 51. Refer to the individual module sections for a full description of the alternate
functions.
Note that enabling the alternate function of some of the port pins does not affect the use of the
other pins in the port as general digital I/O.
Cpin
Logic
Rpu
See Figure
"General Digital I/O" for
Details
Pxn47
2543L–AVR–08/10
ATtiny2313
Ports as General
Digital I/O
The ports are bi-directional I/O ports with optional internal pull-ups. Figure 22 shows a functional
description of one I/O-port pin, here generically called Pxn.
Figure 22. General Digital I/O(1)
Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O,
SLEEP, and PUD are common to all ports.
Configuring the Pin Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in “Register
Description for I/O-Ports” on page 58, the DDxn bits are accessed at the DDRx I/O address, the
PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address.
The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one,
Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input
pin.
If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is
activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to
be configured as an output pin. The port pins are tri-stated when reset condition becomes active,
even if no clocks are running.
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven
high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port
pin is driven low (zero).
Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn.
Note that the SBI instruction can be used to toggle one single bit in a port.
clk
RPx
RRx
RDx
WDx
PUD
SYNCHRONIZER
WDx: WRITE DDRx
WRx: WRITE PORTx
RRx: READ PORTx REGISTER
RPx: READ PORTx PIN
PUD: PULLUP DISABLE
clkI/O: I/O CLOCK
RDx: READ DDRx
D
L
Q
Q
RESET
RESET
Q
D Q
Q
Q D
CLR
PORTxn
Q
Q D
CLR
DDxn
PINxn
DATA BUS
SLEEP
SLEEP: SLEEP CONTROL
Pxn
I/O
WPx
0
1
WRx
WPx: WRITE PINx REGISTER48
2543L–AVR–08/10
ATtiny2313
Switching Between
Input and Output
When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn}
= 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output
low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully acceptable,
as a high-impedant environment will not notice the difference between a strong high driver
and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all
pull-ups in all ports.
Switching between input with pull-up and output low generates the same problem. The user
must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn}
= 0b11) as an intermediate step.
Table 22 summarizes the control signals for the pin value.
Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the
PINxn Register bit. As shown in Figure 22, the PINxn Register bit and the preceding latch constitute
a synchronizer. This is needed to avoid metastability if the physical pin changes value near
the edge of the internal clock, but it also introduces a delay. Figure 23 shows a timing diagram of
the synchronization when reading an externally applied pin value. The maximum and minimum
propagation delays are denoted tpd,max and tpd,min respectively.
Figure 23. Synchronization when Reading an Externally Applied Pin value
Table 22. Port Pin Configurations
DDxn PORTxn
PUD
(in MCUCR) I/O Pull-up Comment
0 0 X Input No Tri-state (Hi-Z)
0 1 0 Input Yes
Pxn will source current if ext. pulled
low.
0 1 1 Input No Tri-state (Hi-Z)
1 0 X Output No Output Low (Sink)
1 1 X Output No Output High (Source)
XXX in r17, PINx
0x00 0xFF
INSTRUCTIONS
SYNC LATCH
PINxn
r17
XXX
SYSTEM CLK
tpd, max
tpd, min49
2543L–AVR–08/10
ATtiny2313
Consider the clock period starting shortly after the first falling edge of the system clock. The latch
is closed when the clock is low, and goes transparent when the clock is high, as indicated by the
shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock
goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indicated
by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed
between ½ and 1½ system clock period depending upon the time of assertion.
When reading back a software assigned pin value, a nop instruction must be inserted as indicated
in Figure 24. The out instruction sets the “SYNC LATCH” signal at the positive edge of the
clock. In this case, the delay tpd through the synchronizer is 1 system clock period.
Figure 24. Synchronization when Reading a Software Assigned Pin Value
out PORTx, r16 nop in r17, PINx
0xFF
0x00 0xFF
SYSTEM CLK
r16
INSTRUCTIONS
SYNC LATCH
PINxn
r17
t pd50
2543L–AVR–08/10
ATtiny2313
The following code example shows how to set port B pins 0 and 1 high, 2 and 3 low, and define
the port pins from 4 to 7 as input with pull-ups assigned to port pins 6 and 7. The resulting pin
values are read back again, but as previously discussed, a nop instruction is included to be able
to read back the value recently assigned to some of the pins.
Note: 1. For the assembly program, two temporary registers are used to minimize the time from pullups
are set on pins 0, 1, 6, and 7, until the direction bits are correctly set, defining bit 2 and 3
as low and redefining bits 0 and 1 as strong high drivers.
Digital Input Enable
and Sleep Modes
As shown in Figure 22, the digital input signal can be clamped to ground at the input of the
Schmitt Trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep Controller in
Power-down mode, and Standby mode to avoid high power consumption if some input signals
are left floating, or have an analog signal level close to VCC/2.
SLEEP is overridden for port pins enabled as external interrupt pins. If the external interrupt
request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by various
other alternate functions as described in “Alternate Port Functions” on page 51.
If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as
“Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt
is not enabled, the corresponding External Interrupt Flag will be set when resuming from the
above mentioned Sleep mode, as the clamping in these sleep mode produces the requested
logic change.
Assembly Code Example(1)
...
; Define pull-ups and set outputs high
; Define directions for port pins
ldi r16,(1< CSn2:0 > 1). The number of system clock
cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system
clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024).
It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution.
However, care must be taken if the other Timer/Counter that shares the same prescaler
also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is
connected to.
External Clock Source An external clock source applied to the T1/T0 pin can be used as Timer/Counter clock
(clkT1/clkT0). The T1/T0 pin is sampled once every system clock cycle by the pin synchronization
logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 38
shows a functional equivalent block diagram of the T1/T0 synchronization and edge detector
logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch
is transparent in the high period of the internal system clock.
The edge detector generates one clkT1/clkT0 pulse for each positive (CSn2:0 = 7) or negative
(CSn2:0 = 6) edge it detects.
Figure 38. T1/T0 Pin Sampling
The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles
from an edge has been applied to the T1/T0 pin to the counter is updated.
Enabling and disabling of the clock input must be done when T1/T0 has been stable for at least
one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated.
Each half period of the external clock applied must be longer than one system clock cycle to
ensure correct sampling. The external clock must be guaranteed to have less than half the system
clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses
sampling, the maximum frequency of an external clock it can detect is half the sampling freTn_sync
(To Clock
Select Logic)
Synchronization Edge Detector
D Q D Q
LE
Tn D Q
clkI/O81
2543L–AVR–08/10
ATtiny2313
quency (Nyquist sampling theorem). However, due to variation of the system clock frequency
and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is
recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5.
An external clock source can not be prescaled.
Figure 39. Prescaler for Timer/Counter0 and Timer/Counter1(1)
Note: 1. The synchronization logic on the input pins (T1/T0) is shown in Figure 38.
General Timer/Counter
Control Register –
GTCCR
• Bits 7..1 – Res: Reserved Bits
These bits are reserved bits in the ATtiny2313 and will always read as zero.
• Bit 0 – PSR10: Prescaler Reset Timer/Counter1 and Timer/Counter0
When this bit is one, Timer/Counter1 and Timer/Counter0 prescaler will be Reset. This bit is normally
cleared immediately by hardware. Note that Timer/Counter1 and Timer/Counter0 share
the same prescaler and a reset of this prescaler will affect both timers.
PSR10
Clear
clkT1 clkT0
T1
T0
clkI/O
Synchronization
Synchronization
Bit 7 6 5 4 3 2 1 0
— – – – – – — PSR10 GTCCR
Read/Write R R R R R R R R/W
Initial Value 0 0 0 0 0 0 0 082
2543L–AVR–08/10
ATtiny2313
16-bit
Timer/Counter1
The 16-bit Timer/Counter unit allows accurate program execution timing (event management),
wave generation, and signal timing measurement. The main features are:
• True 16-bit Design (i.e., Allows 16-bit PWM)
• Two independent Output Compare Units
• Double Buffered Output Compare Registers
• One Input Capture Unit
• Input Capture Noise Canceler
• Clear Timer on Compare Match (Auto Reload)
• Glitch-free, Phase Correct Pulse Width Modulator (PWM)
• Variable PWM Period
• Frequency Generator
• External Event Counter
• Four independent interrupt Sources (TOV1, OCF1A, OCF1B, and ICF1)
Overview Most register and bit references in this section are written in general form. A lower case “n”
replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit
channel. However, when using the register or bit defines in a program, the precise form must be
used, i.e., TCNT1 for accessing Timer/Counter1 counter value and so on.
A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 40. For the actual
placement of I/O pins, refer to “Pinout ATtiny2313” on page 2. CPU accessible I/O Registers,
including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations
are listed in the “16-bit Timer/Counter Register Description” on page 104.
Figure 40. 16-bit Timer/Counter Block Diagram(1)
Note: 1. Refer to Figure 1 on page 2 for Timer/Counter1 pin placement and description.
Clock Select
Timer/Counter
DATA BUS
OCRnA
OCRnB
ICRn
=
=
TCNTn
Waveform
Generation
Waveform
Generation
OCnA
OCnB
Noise
Canceler
ICPn
=
Fixed
TOP
Values
Edge
Detector
Control Logic
= 0
TOP BOTTOM
Count
Clear
Direction
TOVn
(Int.Req.)
OCnA
(Int.Req.)
OCnB
(Int.Req.)
ICFn (Int.Req.)
TCCRnA TCCRnB
( From Analog
Comparator Ouput )
Tn Edge
Detector
( From Prescaler )
clkTn83
2543L–AVR–08/10
ATtiny2313
Registers The Timer/Counter (TCNT1), Output Compare Registers (OCR1A/B), and Input Capture Register
(ICR1) are all 16-bit registers. Special procedures must be followed when accessing the 16-
bit registers. These procedures are described in the section “Accessing 16-bit Registers” on
page 84. The Timer/Counter Control Registers (TCCR1A/B) are 8-bit registers and have no CPU
access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are all visible
in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer
Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure.
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on
the T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter
uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source
is selected. The output from the Clock Select logic is referred to as the timer clock (clkT1).
The double buffered Output Compare Registers (OCR1A/B) are compared with the Timer/Counter
value at all time. The result of the compare can be used by the Waveform Generator to
generate a PWM or variable frequency output on the Output Compare pin (OC1A/B). See “Output
Compare Units” on page 90.. The compare match event will also set the Compare Match
Flag (OCF1A/B) which can be used to generate an Output Compare interrupt request.
The Input Capture Register can capture the Timer/Counter value at a given external (edge triggered)
event on either the Input Capture pin (ICP1) or on the Analog Comparator pins (See
“Analog Comparator” on page 149.) The Input Capture unit includes a digital filtering unit (Noise
Canceler) for reducing the chance of capturing noise spikes.
The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined
by either the OCR1A Register, the ICR1 Register, or by a set of fixed values. When using
OCR1A as TOP value in a PWM mode, the OCR1A Register can not be used for generating a
PWM output. However, the TOP value will in this case be double buffered allowing the TOP
value to be changed in run time. If a fixed TOP value is required, the ICR1 Register can be used
as an alternative, freeing the OCR1A to be used as PWM output.
Definitions The following definitions are used extensively throughout the section:
Compatibility The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bit
AVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier version
regarding:
• All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt
Registers.
• Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers.
• Interrupt Vectors.
The following control bits have changed name, but have same functionality and register location:
• PWM10 is changed to WGM10.
• PWM11 is changed to WGM11.
• CTC1 is changed to WGM12.
Table 42. Definitions
BOTTOM The counter reaches the BOTTOM when it becomes 0x0000.
MAX The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535).
TOP
The counter reaches the TOP when it becomes equal to the highest value in the
count sequence. The TOP value can be assigned to be one of the fixed values:
0x00FF, 0x01FF, or 0x03FF, or to the value stored in the OCR1A or ICR1 Register.
The assignment is dependent of the mode of operation.84
2543L–AVR–08/10
ATtiny2313
The following bits are added to the 16-bit Timer/Counter Control Registers:
• FOC1A and FOC1B are added to TCCR1A.
• WGM13 is added to TCCR1B.
The 16-bit Timer/Counter has improvements that will affect the compatibility in some special
cases.
Accessing 16-bit
Registers
The TCNT1, OCR1A/B, and ICR1 are 16-bit registers that can be accessed by the AVR CPU via
the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations.
Each 16-bit timer has a single 8-bit register for temporary storing of the high byte of the 16-bit
access. The same temporary register is shared between all 16-bit registers within each 16-bit
timer. Accessing the low byte triggers the 16-bit read or write operation. When the low byte of a
16-bit register is written by the CPU, the high byte stored in the temporary register, and the low
byte written are both copied into the 16-bit register in the same clock cycle. When the low byte of
a 16-bit register is read by the CPU, the high byte of the 16-bit register is copied into the temporary
register in the same clock cycle as the low byte is read.
Not all 16-bit accesses uses the temporary register for the high byte. Reading the OCR1A/B 16-
bit registers does not involve using the temporary register.
To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read, the low
byte must be read before the high byte.
The following code examples show how to access the 16-bit timer registers assuming that no
interrupts updates the temporary register. The same principle can be used directly for accessing
the OCR1A/B and ICR1 Registers. Note that when using “C”, the compiler handles the 16-bit
access.85
2543L–AVR–08/10
ATtiny2313
Note: 1. The example code assumes that the part specific header file is included.
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.
The assembly code example returns the TCNT1 value in the r17:r16 register pair.
It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt
occurs between the two instructions accessing the 16-bit register, and the interrupt code
updates the temporary register by accessing the same or any other of the 16-bit timer registers,
then the result of the access outside the interrupt will be corrupted. Therefore, when both the
main code and the interrupt code update the temporary register, the main code must disable the
interrupts during the 16-bit access.
Assembly Code Examples(1)
...
; Set TCNT1 to 0x01FF
ldi r17,0x01
ldi r16,0xFF
out TCNT1H,r17
out TCNT1L,r16
; Read TCNT1 into r17:r16
in r16,TCNT1L
in r17,TCNT1H
...
C Code Examples(1)
unsigned int i;
...
/* Set TCNT1 to 0x01FF */
TCNT1 = 0x1FF;
/* Read TCNT1 into i */
i = TCNT1;
...86
2543L–AVR–08/10
ATtiny2313
The following code examples show how to do an atomic read of the TCNT1 Register contents.
Reading any of the OCR1A/B or ICR1 Registers can be done by using the same principle.
Note: 1. The example code assumes that the part specific header file is included.
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.
The assembly code example returns the TCNT1 value in the r17:r16 register pair.
Assembly Code Example(1)
TIM16_ReadTCNT1:
; Save global interrupt flag
in r18,SREG
; Disable interrupts
cli
; Read TCNT1 into r17:r16
in r16,TCNT1L
in r17,TCNT1H
; Restore global interrupt flag
out SREG,r18
ret
C Code Example(1)
unsigned int TIM16_ReadTCNT1( void )
{
unsigned char sreg;
unsigned int i;
/* Save global interrupt flag */
sreg = SREG;
/* Disable interrupts */
__disable_interrupt();
/* Read TCNT1 into i */
i = TCNT1;
/* Restore global interrupt flag */
SREG = sreg;
return i;
}87
2543L–AVR–08/10
ATtiny2313
The following code examples show how to do an atomic write of the TCNT1 Register contents.
Writing any of the OCR1A/B or ICR1 Registers can be done by using the same principle.
Note: 1. The example code assumes that the part specific header file is included.
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.
The assembly code example requires that the r17:r16 register pair contains the value to be written
to TCNT1.
Reusing the
Temporary High Byte
Register
If writing to more than one 16-bit register where the high byte is the same for all registers written,
then the high byte only needs to be written once. However, note that the same rule of atomic
operation described previously also applies in this case.
Assembly Code Example(1)
TIM16_WriteTCNT1:
; Save global interrupt flag
in r18,SREG
; Disable interrupts
cli
; Set TCNT1 to r17:r16
out TCNT1H,r17
out TCNT1L,r16
; Restore global interrupt flag
out SREG,r18
ret
C Code Example(1)
void TIM16_WriteTCNT1( unsigned int i )
{
unsigned char sreg;
unsigned int i;
/* Save global interrupt flag */
sreg = SREG;
/* Disable interrupts */
__disable_interrupt();
/* Set TCNT1 to i */
TCNT1 = i;
/* Restore global interrupt flag */
SREG = sreg;
}88
2543L–AVR–08/10
ATtiny2313
Timer/Counter
Clock Sources
The Timer/Counter can be clocked by an internal or an external clock source. The clock source
is selected by the Clock Select logic which is controlled by the Clock Select (CS12:0) bits
located in the Timer/Counter control Register B (TCCR1B). For details on clock sources and
prescaler, see “Timer/Counter0 and Timer/Counter1 Prescalers” on page 80.
Counter Unit The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit.
Figure 41 shows a block diagram of the counter and its surroundings.
Figure 41. Counter Unit Block Diagram
Signal description (internal signals):
Count Increment or decrement TCNT1 by 1.
Direction Select between increment and decrement.
Clear Clear TCNT1 (set all bits to zero).
clkT1 Timer/Counter clock.
TOP Signalize that TCNT1 has reached maximum value.
BOTTOM Signalize that TCNT1 has reached minimum value (zero).
The 16-bit counter is mapped into two 8-bit I/O memory locations: Counter High (TCNT1H) containing
the upper eight bits of the counter, and Counter Low (TCNT1L) containing the lower eight
bits. The TCNT1H Register can only be indirectly accessed by the CPU. When the CPU does an
access to the TCNT1H I/O location, the CPU accesses the high byte temporary register (TEMP).
The temporary register is updated with the TCNT1H value when the TCNT1L is read, and
TCNT1H is updated with the temporary register value when TCNT1L is written. This allows the
CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus.
It is important to notice that there are special cases of writing to the TCNT1 Register when the
counter is counting that will give unpredictable results. The special cases are described in the
sections where they are of importance.
Depending on the mode of operation used, the counter is cleared, incremented, or decremented
at each timer clock (clkT1). The clkT1 can be generated from an external or internal clock source,
selected by the Clock Select bits (CS12:0). When no clock source is selected (CS12:0 = 0) the
timer is stopped. However, the TCNT1 value can be accessed by the CPU, independent of
whether clkT1 is present or not. A CPU write overrides (has priority over) all counter clear or
count operations.
The counting sequence is determined by the setting of the Waveform Generation mode bits
(WGM13:0) located in the Timer/Counter Control Registers A and B (TCCR1A and TCCR1B).
There are close connections between how the counter behaves (counts) and how waveforms
are generated on the Output Compare outputs OC1x. For more details about advanced counting
sequences and waveform generation, see “Modes of Operation” on page 94.
TEMP (8-bit)
DATA BUS (8-bit)
TCNTn (16-bit Counter)
TCNTnH (8-bit) TCNTnL (8-bit) Control Logic
Count
Clear
Direction
TOVn
(Int.Req.)
Clock Select
TOP BOTTOM
Tn Edge
Detector
( From Prescaler )
clkTn89
2543L–AVR–08/10
ATtiny2313
The Timer/Counter Overflow Flag (TOV1) is set according to the mode of operation selected by
the WGM13:0 bits. TOV1 can be used for generating a CPU interrupt.
Input Capture Unit The Timer/Counter incorporates an Input Capture unit that can capture external events and give
them a time-stamp indicating time of occurrence. The external signal indicating an event, or multiple
events, can be applied via the ICP1 pin or alternatively, via the analog-comparator unit. The
time-stamps can then be used to calculate frequency, duty-cycle, and other features of the signal
applied. Alternatively the time-stamps can be used for creating a log of the events.
The Input Capture unit is illustrated by the block diagram shown in Figure 42. The elements of
the block diagram that are not directly a part of the Input Capture unit are gray shaded. The
small “n” in register and bit names indicates the Timer/Counter number.
Figure 42. Input Capture Unit Block Diagram
When a change of the logic level (an event) occurs on the Input Capture pin (ICP1), alternatively
on the Analog Comparator output (ACO), and this change confirms to the setting of the edge
detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter
(TCNT1) is written to the Input Capture Register (ICR1). The Input Capture Flag (ICF1) is set at
the same system clock as the TCNT1 value is copied into ICR1 Register. If enabled (ICIE1 = 1),
the Input Capture Flag generates an Input Capture interrupt. The ICF1 flag is automatically
cleared when the interrupt is executed. Alternatively the ICF1 flag can be cleared by software by
writing a logical one to its I/O bit location.
Reading the 16-bit value in the Input Capture Register (ICR1) is done by first reading the low
byte (ICR1L) and then the high byte (ICR1H). When the low byte is read the high byte is copied
into the high byte temporary register (TEMP). When the CPU reads the ICR1H I/O location it will
access the TEMP Register.
The ICR1 Register can only be written when using a Waveform Generation mode that utilizes
the ICR1 Register for defining the counter’s TOP value. In these cases the Waveform Generation
mode (WGM13:0) bits must be set before the TOP value can be written to the ICR1
Register. When writing the ICR1 Register the high byte must be written to the ICR1H I/O location
before the low byte is written to ICR1L.
ICFn (Int.Req.)
Analog
Comparator
WRITE ICRn (16-bit Register)
ICRnH (8-bit)
Noise
Canceler
ICPn
Edge
Detector
TEMP (8-bit)
DATA BUS (8-bit)
ICRnL (8-bit)
TCNTn (16-bit Counter)
TCNTnH (8-bit) TCNTnL (8-bit)
ACO* ACIC* ICNC ICES90
2543L–AVR–08/10
ATtiny2313
For more information on how to access the 16-bit registers refer to “Accessing 16-bit Registers”
on page 84.
Input Capture Trigger
Source
The main trigger source for the Input Capture unit is the Input Capture pin (ICP1).
Timer/Counter1 can alternatively use the Analog Comparator output as trigger source for the
Input Capture unit. The Analog Comparator is selected as trigger source by setting the Analog
Comparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register
(ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flag
must therefore be cleared after the change.
Both the Input Capture pin (ICP1) and the Analog Comparator output (ACO) inputs are sampled
using the same technique as for the T1 pin (Figure 38 on page 80). The edge detector is also
identical. However, when the noise canceler is enabled, additional logic is inserted before the
edge detector, which increases the delay by four system clock cycles. Note that the input of the
noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Waveform
Generation mode that uses ICR1 to define TOP.
An Input Capture can be triggered by software by controlling the port of the ICP1 pin.
Noise Canceler The noise canceler improves noise immunity by using a simple digital filtering scheme. The
noise canceler input is monitored over four samples, and all four must be equal for changing the
output that in turn is used by the edge detector.
The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNC1) bit in
Timer/Counter Control Register B (TCCR1B). When enabled the noise canceler introduces additional
four system clock cycles of delay from a change applied to the input, to the update of the
ICR1 Register. The noise canceler uses the system clock and is therefore not affected by the
prescaler.
Using the Input
Capture Unit
The main challenge when using the Input Capture unit is to assign enough processor capacity
for handling the incoming events. The time between two events is critical. If the processor has
not read the captured value in the ICR1 Register before the next event occurs, the ICR1 will be
overwritten with a new value. In this case the result of the capture will be incorrect.
When using the Input Capture interrupt, the ICR1 Register should be read as early in the interrupt
handler routine as possible. Even though the Input Capture interrupt has relatively high
priority, the maximum interrupt response time is dependent on the maximum number of clock
cycles it takes to handle any of the other interrupt requests.
Using the Input Capture unit in any mode of operation when the TOP value (resolution) is
actively changed during operation, is not recommended.
Measurement of an external signal’s duty cycle requires that the trigger edge is changed after
each capture. Changing the edge sensing must be done as early as possible after the ICR1
Register has been read. After a change of the edge, the Input Capture Flag (ICF1) must be
cleared by software (writing a logical one to the I/O bit location). For measuring frequency only,
the clearing of the ICF1 flag is not required (if an interrupt handler is used).
Output Compare
Units
The 16-bit comparator continuously compares TCNT1 with the Output Compare Register
(OCR1x). If TCNT equals OCR1x the comparator signals a match. A match will set the Output
Compare Flag (OCF1x) at the next timer clock cycle. If enabled (OCIE1x = 1), the Output Compare
Flag generates an Output Compare interrupt. The OCF1x flag is automatically cleared
when the interrupt is executed. Alternatively the OCF1x flag can be cleared by software by writing
a logical one to its I/O bit location. The Waveform Generator uses the match signal to
generate an output according to operating mode set by the Waveform Generation mode
(WGM13:0) bits and Compare Output mode (COM1x1:0) bits. The TOP and BOTTOM signals91
2543L–AVR–08/10
ATtiny2313
are used by the Waveform Generator for handling the special cases of the extreme values in
some modes of operation (See “Modes of Operation” on page 94.)
A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (i.e.,
counter resolution). In addition to the counter resolution, the TOP value defines the period time
for waveforms generated by the Waveform Generator.
Figure 43 shows a block diagram of the Output Compare unit. The small “n” in the register and
bit names indicates the device number (n = 1 for Timer/Counter 1), and the “x” indicates Output
Compare unit (A/B). The elements of the block diagram that are not directly a part of the Output
Compare unit are gray shaded.
Figure 43. Output Compare Unit, Block Diagram
The OCR1x Register is double buffered when using any of the twelve Pulse Width Modulation
(PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the
double buffering is disabled. The double buffering synchronizes the update of the OCR1x Compare
Register to either TOP or BOTTOM of the counting sequence. The synchronization
prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output
glitch-free.
The OCR1x Register access may seem complex, but this is not case. When the double buffering
is enabled, the CPU has access to the OCR1x Buffer Register, and if double buffering is disabled
the CPU will access the OCR1x directly. The content of the OCR1x (Buffer or Compare)
Register is only changed by a write operation (the Timer/Counter does not update this register
automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the high byte
temporary register (TEMP). However, it is a good practice to read the low byte first as when
accessing other 16-bit registers. Writing the OCR1x Registers must be done via the TEMP Register
since the compare of all 16 bits is done continuously. The high byte (OCR1xH) has to be
written first. When the high byte I/O location is written by the CPU, the TEMP Register will be
updated by the value written. Then when the low byte (OCR1xL) is written to the lower eight bits,
the high byte will be copied into the upper 8-bits of either the OCR1x buffer or OCR1x Compare
Register in the same system clock cycle.
OCFnx (Int.Req.)
= (16-bit Comparator )
OCRnx Buffer (16-bit Register)
OCRnxH Buf. (8-bit)
OCnx
TEMP (8-bit)
DATA BUS (8-bit)
OCRnxL Buf. (8-bit)
TCNTn (16-bit Counter)
TCNTnH (8-bit) TCNTnL (8-bit)
WGMn3:0 COMnx1:0
OCRnx (16-bit Register)
OCRnxH (8-bit) OCRnxL (8-bit)
Waveform Generator
TOP
BOTTOM92
2543L–AVR–08/10
ATtiny2313
For more information of how to access the 16-bit registers refer to “Accessing 16-bit Registers”
on page 84.
Force Output
Compare
In non-PWM Waveform Generation modes, the match output of the comparator can be forced by
writing a one to the Force Output Compare (FOC1x) bit. Forcing compare match will not set the
OCF1x flag or reload/clear the timer, but the OC1x pin will be updated as if a real compare
match had occurred (the COM11:0 bits settings define whether the OC1x pin is set, cleared or
toggled).
Compare Match
Blocking by TCNT1
Write
All CPU writes to the TCNT1 Register will block any compare match that occurs in the next timer
clock cycle, even when the timer is stopped. This feature allows OCR1x to be initialized to the
same value as TCNT1 without triggering an interrupt when the Timer/Counter clock is enabled.
Using the Output
Compare Unit
Since writing TCNT1 in any mode of operation will block all compare matches for one timer clock
cycle, there are risks involved when changing TCNT1 when using any of the Output Compare
channels, independent of whether the Timer/Counter is running or not. If the value written to
TCNT1 equals the OCR1x value, the compare match will be missed, resulting in incorrect waveform
generation. Do not write the TCNT1 equal to TOP in PWM modes with variable TOP
values. The compare match for the TOP will be ignored and the counter will continue to 0xFFFF.
Similarly, do not write the TCNT1 value equal to BOTTOM when the counter is downcounting.
The setup of the OC1x should be performed before setting the Data Direction Register for the
port pin to output. The easiest way of setting the OC1x value is to use the Force Output Compare
(FOC1x) strobe bits in Normal mode. The OC1x Register keeps its value even when
changing between Waveform Generation modes.
Be aware that the COM1x1:0 bits are not double buffered together with the compare value.
Changing the COM1x1:0 bits will take effect immediately.93
2543L–AVR–08/10
ATtiny2313
Compare Match
Output Unit
The Compare Output mode (COM1x1:0) bits have two functions. The Waveform Generator uses
the COM1x1:0 bits for defining the Output Compare (OC1x) state at the next compare match.
Secondly the COM1x1:0 bits control the OC1x pin output source. Figure 44 shows a simplified
schematic of the logic affected by the COM1x1:0 bit setting. The I/O Registers, I/O bits, and I/O
pins in the figure are shown in bold. Only the parts of the general I/O port control registers (DDR
and PORT) that are affected by the COM1x1:0 bits are shown. When referring to the OC1x
state, the reference is for the internal OC1x Register, not the OC1x pin. If a system reset occur,
the OC1x Register is reset to “0”.
Figure 44. Compare Match Output Unit, Schematic
The general I/O port function is overridden by the Output Compare (OC1x) from the Waveform
Generator if either of the COM1x1:0 bits are set. However, the OC1x pin direction (input or output)
is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction
Register bit for the OC1x pin (DDR_OC1x) must be set as output before the OC1x value is visible
on the pin. The port override function is generally independent of the Waveform Generation
mode, but there are some exceptions. Refer to Table 43, Table 44 and Table 45 for details.
The design of the Output Compare pin logic allows initialization of the OC1x state before the output
is enabled. Note that some COM1x1:0 bit settings are reserved for certain modes of
operation. See “16-bit Timer/Counter Register Description” on page 104.
The COM1x1:0 bits have no effect on the Input Capture unit.
PORT
DDR
D Q
D Q
OCnx
OCnx Pin
D Q Waveform
Generator
COMnx1
COMnx0
0
1
DATA BUS
FOCnx
clkI/O94
2543L–AVR–08/10
ATtiny2313
Compare Output Mode
and Waveform
Generation
The Waveform Generator uses the COM1x1:0 bits differently in normal, CTC, and PWM modes.
For all modes, setting the COM1x1:0 = 0 tells the Waveform Generator that no action on the
OC1x Register is to be performed on the next compare match. For compare output actions in the
non-PWM modes refer to Table 43 on page 104. For fast PWM mode refer to Table 44 on page
104, and for phase correct and phase and frequency correct PWM refer to Table 45 on page
105.
A change of the COM1x1:0 bits state will have effect at the first compare match after the bits are
written. For non-PWM modes, the action can be forced to have immediate effect by using the
FOC1x strobe bits.
Modes of
Operation
The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is
defined by the combination of the Waveform Generation mode (WGM13:0) and Compare Output
mode (COM1x1:0) bits. The Compare Output mode bits do not affect the counting sequence,
while the Waveform Generation mode bits do. The COM1x1:0 bits control whether the PWM output
generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes
the COM1x1:0 bits control whether the output should be set, cleared or toggle at a compare
match (See “Compare Match Output Unit” on page 93.)
For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 102.
Normal Mode The simplest mode of operation is the Normal mode (WGM13:0 = 0). In this mode the counting
direction is always up (incrementing), and no counter clear is performed. The counter simply
overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the
BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOV1) will be set in
the same timer clock cycle as the TCNT1 becomes zero. The TOV1 flag in this case behaves
like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow
interrupt that automatically clears the TOV1 flag, the timer resolution can be increased by software.
There are no special cases to consider in the Normal mode, a new counter value can be
written anytime.
The Input Capture unit is easy to use in Normal mode. However, observe that the maximum
interval between the external events must not exceed the resolution of the counter. If the interval
between events are too long, the timer overflow interrupt or the prescaler must be used to
extend the resolution for the capture unit.
The Output Compare units can be used to generate interrupts at some given time. Using the
Output Compare to generate waveforms in Normal mode is not recommended, since this will
occupy too much of the CPU time.
Clear Timer on
Compare Match (CTC)
Mode
In Clear Timer on Compare or CTC mode (WGM13:0 = 4 or 12), the OCR1A or ICR1 Register
are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when
the counter value (TCNT1) matches either the OCR1A (WGM13:0 = 4) or the ICR1 (WGM13:0 =
12). The OCR1A or ICR1 define the top value for the counter, hence also its resolution. This
mode allows greater control of the compare match output frequency. It also simplifies the operation
of counting external events.
The timing diagram for the CTC mode is shown in Figure 45 on page 95. The counter value
(TCNT1) increases until a compare match occurs with either OCR1A or ICR1, and then counter
(TCNT1) is cleared.95
2543L–AVR–08/10
ATtiny2313
Figure 45. CTC Mode, Timing Diagram
An interrupt can be generated at each time the counter value reaches the TOP value by either
using the OCF1A or ICF1 flag according to the register used to define the TOP value. If the interrupt
is enabled, the interrupt handler routine can be used for updating the TOP value. However,
changing the TOP to a value close to BOTTOM when the counter is running with none or a low
prescaler value must be done with care since the CTC mode does not have the double buffering
feature. If the new value written to OCR1A or ICR1 is lower than the current value of TCNT1, the
counter will miss the compare match. The counter will then have to count to its maximum value
(0xFFFF) and wrap around starting at 0x0000 before the compare match can occur. In many
cases this feature is not desirable. An alternative will then be to use the fast PWM mode using
OCR1A for defining TOP (WGM13:0 = 15) since the OCR1A then will be double buffered.
For generating a waveform output in CTC mode, the OCFA output can be set to toggle its logical
level on each compare match by setting the Compare Output mode bits to toggle mode
(COM1A1:0 = 1). The OCF1A value will not be visible on the port pin unless the data direction
for the pin is set to output (DDR_OCF1A = 1). The waveform generated will have a maximum
frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). The waveform frequency is
defined by the following equation:
The N variable represents the prescaler factor (1, 8, 64, 256, or 1024).
As for the Normal mode of operation, the TOV1 flag is set in the same timer clock cycle that the
counter counts from MAX to 0x0000.
TCNTn
OCnA
(Toggle)
OCnA Interrupt Flag Set
or ICFn Interrupt Flag Set
(Interrupt on TOP)
Period 1 2 3 4
(COMnA1:0 = 1)
f
OCnA
f
clk_I/O
2 ⋅ ⋅ N ( ) 1 + OCRnA = --------------------------------------------------96
2543L–AVR–08/10
ATtiny2313
Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM13:0 = 5, 6, 7, 14, or 15) provides a
high frequency PWM waveform generation option. The fast PWM differs from the other PWM
options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts
from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is set on
the compare match between TCNT1 and OCR1x, and cleared at TOP. In inverting Compare
Output mode output is cleared on compare match and set at TOP. Due to the single-slope operation,
the operating frequency of the fast PWM mode can be twice as high as the phase correct
and phase and frequency correct PWM modes that use dual-slope operation. This high frequency
makes the fast PWM mode well suited for power regulation, rectification, and DAC
applications. High frequency allows physically small sized external components (coils, capacitors),
hence reduces total system cost.
The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either ICR1 or
OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum
resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be
calculated by using the following equation:
In fast PWM mode the counter is incremented until the counter value matches either one of the
fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 5, 6, or 7), the value in ICR1 (WGM13:0 =
14), or the value in OCR1A (WGM13:0 = 15). The counter is then cleared at the following timer
clock cycle. The timing diagram for the fast PWM mode is shown in Figure 46. The figure shows
fast PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing
diagram shown as a histogram for illustrating the single-slope operation. The diagram includes
non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes
represent compare matches between OCR1x and TCNT1. The OC1x interrupt flag will be set
when a compare match occurs.
Figure 46. Fast PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches TOP. In addition
the OCF1A or ICF1 flag is set at the same timer clock cycle as TOV1 is set when either OCR1A
or ICR1 is used for defining the TOP value. If one of the interrupts are enabled, the interrupt handler
routine can be used for updating the TOP and compare values.
When changing the TOP value the program must ensure that the new TOP value is higher or
equal to the value of all of the Compare Registers. If the TOP value is lower than any of the
Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x.
RFPWM
log( ) TOP + 1
log( ) 2 = -----------------------------------
TCNTn
OCRnx/TOP Update and
TOVn Interrupt Flag Set and
OCnA Interrupt Flag Set
or ICFn Interrupt Flag Set
(Interrupt on TOP)
Period 1 2 3 4 5 6 7 8
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)97
2543L–AVR–08/10
ATtiny2313
Note that when using fixed TOP values the unused bits are masked to zero when any of the
OCR1x Registers are written.
The procedure for updating ICR1 differs from updating OCR1A when used for defining the TOP
value. The ICR1 Register is not double buffered. This means that if ICR1 is changed to a low
value when the counter is running with none or a low prescaler value, there is a risk that the new
ICR1 value written is lower than the current value of TCNT1. The result will then be that the
counter will miss the compare match at the TOP value. The counter will then have to count to the
MAX value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur.
The OCR1A Register however, is double buffered. This feature allows the OCR1A I/O location
to be written anytime. When the OCR1A I/O location is written the value written will be put into
the OCR1A Buffer Register. The OCR1A Compare Register will then be updated with the value
in the Buffer Register at the next timer clock cycle the TCNT1 matches TOP. The update is done
at the same timer clock cycle as the TCNT1 is cleared and the TOV1 flag is set.
Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using
ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However,
if the base PWM frequency is actively changed (by changing the TOP value), using the OCR1A
as TOP is clearly a better choice due to its double buffer feature.
In fast PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins.
Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output
can be generated by setting the COM1x1:0 to three (see Table 43 on page 104). The actual
OC1x value will only be visible on the port pin if the data direction for the port pin is set as output
(DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at
the compare match between OCR1x and TCNT1, and clearing (or setting) the OC1x Register at
the timer clock cycle the counter is cleared (changes from TOP to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCR1x Register represents special cases when generating a PWM
waveform output in the fast PWM mode. If the OCR1x is set equal to BOTTOM (0x0000) the output
will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCR1x equal to TOP
will result in a constant high or low output (depending on the polarity of the output set by the
COM1x1:0 bits.)
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting
OCF1A to toggle its logical level on each compare match (COM1A1:0 = 1). The waveform
generated will have a maximum frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero
(0x0000). This feature is similar to the OCF1A toggle in CTC mode, except the double buffer
feature of the Output Compare unit is enabled in the fast PWM mode.
f
OCnxPWM
f
clk_I/O
N ⋅ ( ) 1 + TOP = -----------------------------------98
2543L–AVR–08/10
ATtiny2313
Phase Correct PWM
Mode
The phase correct Pulse Width Modulation or phase correct PWM mode (WGM13:0 = 1, 2, 3,
10, or 11) provides a high resolution phase correct PWM waveform generation option. The
phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dualslope
operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from
TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is
cleared on the compare match between TCNT1 and OCR1x while upcounting, and set on the
compare match while downcounting. In inverting Output Compare mode, the operation is
inverted. The dual-slope operation has lower maximum operation frequency than single slope
operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes
are preferred for motor control applications.
The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or defined
by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to
0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution
in bits can be calculated by using the following equation:
In phase correct PWM mode the counter is incremented until the counter value matches either
one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 1, 2, or 3), the value in ICR1
(WGM13:0 = 10), or the value in OCR1A (WGM13:0 = 11). The counter has then reached the
TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock
cycle. The timing diagram for the phase correct PWM mode is shown on Figure 47. The figure
shows phase correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1
value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The
diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on
the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x interrupt
flag will be set when a compare match occurs.
Figure 47. Phase Correct PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches BOTTOM. When
either OCR1A or ICR1 is used for defining the TOP value, the OCF1A or ICF1 flag is set accordingly
at the same timer clock cycle as the OCR1x Registers are updated with the double buffer
RPCPWM
log( ) TOP + 1
log( ) 2 = -----------------------------------
OCRnx/TOP Update and
OCnA Interrupt Flag Set
or ICFn Interrupt Flag Set
(Interrupt on TOP)
1 2 3 4
TOVn Interrupt Flag Set
(Interrupt on Bottom)
TCNTn
Period
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)99
2543L–AVR–08/10
ATtiny2313
value (at TOP). The interrupt flags can be used to generate an interrupt each time the counter
reaches the TOP or BOTTOM value.
When changing the TOP value the program must ensure that the new TOP value is higher or
equal to the value of all of the Compare Registers. If the TOP value is lower than any of the
Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x.
Note that when using fixed TOP values, the unused bits are masked to zero when any of the
OCR1x Registers are written. As the third period shown in Figure 47 illustrates, changing the
TOP actively while the Timer/Counter is running in the phase correct mode can result in an
unsymmetrical output. The reason for this can be found in the time of update of the OCR1x Register.
Since the OCR1x update occurs at TOP, the PWM period starts and ends at TOP. This
implies that the length of the falling slope is determined by the previous TOP value, while the
length of the rising slope is determined by the new TOP value. When these two values differ the
two slopes of the period will differ in length. The difference in length gives the unsymmetrical
result on the output.
It is recommended to use the phase and frequency correct mode instead of the phase correct
mode when changing the TOP value while the Timer/Counter is running. When using a static
TOP value there are practically no differences between the two modes of operation.
In phase correct PWM mode, the compare units allow generation of PWM waveforms on the
OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted
PWM output can be generated by setting the COM1x1:0 to three (See Table 44 on page 104).
The actual OC1x value will only be visible on the port pin if the data direction for the port pin is
set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x
Register at the compare match between OCR1x and TCNT1 when the counter increments, and
clearing (or setting) the OC1x Register at compare match between OCR1x and TCNT1 when
the counter decrements. The PWM frequency for the output when using phase correct PWM can
be calculated by the following equation:
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCR1x Register represent special cases when generating a PWM
waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the
output will be continuously low and if set equal to TOP the output will be continuously high for
non-inverted PWM mode. For inverted PWM the output will have the opposite logic values.
f
OCnxPCPWM
f
clk_I/O
2 ⋅ ⋅ N TOP = ----------------------------100
2543L–AVR–08/10
ATtiny2313
Phase and Frequency
Correct PWM Mode
The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM
mode (WGM13:0 = 8 or 9) provides a high resolution phase and frequency correct PWM waveform
generation option. The phase and frequency correct PWM mode is, like the phase correct
PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM
(0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the
Output Compare (OC1x) is cleared on the compare match between TCNT1 and OCR1x while
upcounting, and set on the compare match while downcounting. In inverting Compare Output
mode, the operation is inverted. The dual-slope operation gives a lower maximum operation frequency
compared to the single-slope operation. However, due to the symmetric feature of the
dual-slope PWM modes, these modes are preferred for motor control applications.
The main difference between the phase correct, and the phase and frequency correct PWM
mode is the time the OCR1x Register is updated by the OCR1x Buffer Register, (see Figure 47
and Figure 48).
The PWM resolution for the phase and frequency correct PWM mode can be defined by either
ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and
the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can
be calculated using the following equation:
In phase and frequency correct PWM mode the counter is incremented until the counter value
matches either the value in ICR1 (WGM13:0 = 8), or the value in OCR1A (WGM13:0 = 9). The
counter has then reached the TOP and changes the count direction. The TCNT1 value will be
equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency
correct PWM mode is shown on Figure 48. The figure shows phase and frequency correct PWM
mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram
shown as a histogram for illustrating the dual-slope operation. The diagram includes noninverted
and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent
compare matches between OCR1x and TCNT1. The OC1x interrupt flag will be set when a
compare match occurs.
Figure 48. Phase and Frequency Correct PWM Mode, Timing Diagram
RPFCPWM
log( ) TOP + 1
log( ) 2 = -----------------------------------
OCRnx/TOP Updateand
TOVn Interrupt Flag Set
(Interrupt on Bottom)
OCnA Interrupt Flag Set
or ICFn Interrupt Flag Set
(Interrupt on TOP)
1 2 3 4
TCNTn
Period
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)101
2543L–AVR–08/10
ATtiny2313
The Timer/Counter Overflow Flag (TOV1) is set at the same timer clock cycle as the OCR1x
Registers are updated with the double buffer value (at BOTTOM). When either OCR1A or ICR1
is used for defining the TOP value, the OCF1A or ICF1 flag set when TCNT1 has reached TOP.
The interrupt flags can then be used to generate an interrupt each time the counter reaches the
TOP or BOTTOM value.
When changing the TOP value the program must ensure that the new TOP value is higher or
equal to the value of all of the Compare Registers. If the TOP value is lower than any of the
Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x.
As Figure 48 shows the output generated is, in contrast to the phase correct mode, symmetrical
in all periods. Since the OCR1x Registers are updated at BOTTOM, the length of the rising and
the falling slopes will always be equal. This gives symmetrical output pulses and is therefore frequency
correct.
Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using
ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However,
if the base PWM frequency is actively changed by changing the TOP value, using the OCR1A as
TOP is clearly a better choice due to its double buffer feature.
In phase and frequency correct PWM mode, the compare units allow generation of PWM waveforms
on the OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and
an inverted PWM output can be generated by setting the COM1x1:0 to three (See Table 45 on
page 105). The actual OC1Fx value will only be visible on the port pin if the data direction for the
port pin is set as output (DDR_OCF1x). The PWM waveform is generated by setting (or clearing)
the OCF1x Register at the compare match between OCR1x and TCNT1 when the counter increments,
and clearing (or setting) the OCF1x Register at compare match between OCR1x and
TCNT1 when the counter decrements. The PWM frequency for the output when using phase
and frequency correct PWM can be calculated by the following equation:
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCR1x Register represents special cases when generating a PWM
waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the
output will be continuously low and if set equal to TOP the output will be set to high for noninverted
PWM mode. For inverted PWM the output will have the opposite logic values.
f
OCnxPFCPWM
f
clk_I/O
2 ⋅ ⋅ N TOP = ----------------------------102
2543L–AVR–08/10
ATtiny2313
Timer/Counter
Timing Diagrams
The Timer/Counter is a synchronous design and the timer clock (clkT1) is therefore shown as a
clock enable signal in the following figures. The figures include information on when interrupt
flags are set, and when the OCR1x Register is updated with the OCR1x buffer value (only for
modes utilizing double buffering). Figure 49 shows a timing diagram for the setting of OCF1x.
Figure 49. Timer/Counter Timing Diagram, Setting of OCF1x, no Prescaling
Figure 50 shows the same timing data, but with the prescaler enabled.
Figure 50. Timer/Counter Timing Diagram, Setting of OCF1x, with Prescaler (fclk_I/O/8)
Figure 51 shows the count sequence close to TOP in various modes. When using phase and
frequency correct PWM mode the OCR1x Register is updated at BOTTOM. The timing diagrams
will be the same, but TOP should be replaced by BOTTOM, TOP-1 by BOTTOM+1 and so on.
The same renaming applies for modes that set the TOV1 flag at BOTTOM.
clkTn
(clkI/O/1)
OCFnx
clkI/O
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
OCFnx
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
clkI/O
clkTn
(clkI/O/8)103
2543L–AVR–08/10
ATtiny2313
Figure 51. Timer/Counter Timing Diagram, no Prescaling
Figure 52 shows the same timing data, but with the prescaler enabled.
Figure 52. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)
TOVn (FPWM)
and ICFn (if used
as TOP)
OCRnx
(Update at TOP)
TCNTn
(CTC and FPWM)
TCNTn
(PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2
Old OCRnx Value New OCRnx Value
TOP - 1 TOP BOTTOM BOTTOM + 1
clkTn
(clkI/O/1)
clkI/O
TOVn (FPWM)
and ICFn (if used
as TOP)
OCRnx
(Update at TOP)
TCNTn
(CTC and FPWM)
TCNTn
(PC and PFC PWM)
TOP - 1 TOP TOP - 1 TOP - 2
Old OCRnx Value New OCRnx Value
TOP - 1 TOP BOTTOM BOTTOM + 1
clkI/O
clkTn
(clkI/O/8)104
2543L–AVR–08/10
ATtiny2313
16-bit
Timer/Counter
Register
Description
Timer/Counter1
Control Register A –
TCCR1A
• Bit 7:6 – COM1A1:0: Compare Output Mode for Channel A
• Bit 5:4 – COM1B1:0: Compare Output Mode for Channel B
The COM1A1:0 and COM1B1:0 control the Output Compare pins (OC1A and OC1B respectively)
behavior. If one or both of the COM1A1:0 bits are written to one, the OC1A output
overrides the normal port functionality of the I/O pin it is connected to. If one or both of the
COM1B1:0 bit are written to one, the OC1B output overrides the normal port functionality of the
I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding
to the OC1A or OC1B pin must be set in order to enable the output driver.
When the OC1A or OC1B is connected to the pin, the function of the COM1x1:0 bits is dependent
of the WGM13:0 bits setting. Table 43 shows the COM1x1:0 bit functionality when the
WGM13:0 bits are set to a Normal or a CTC mode (non-PWM).
Table 44 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the fast PWM
mode.
Bit 7 6 5 4 3 2 1 0
COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 TCCR1A
Read/Write R/W R/W R/W R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 43. Compare Output Mode, non-PWM
COM1A1/COM1B1 COM1A0/COM1B0 Description
0 0 Normal port operation, OC1A/OC1B
disconnected.
0 1 Toggle OC1A/OC1B on Compare Match.
1 0 Clear OC1A/OC1B on Compare Match (Set
output to low level).
1 1 Set OC1A/OC1B on Compare Match (Set output
to high level).
Table 44. Compare Output Mode, Fast PWM(1)
COM1A1/COM1B1 COM1A0/COM1B0 Description
0 0 Normal port operation, OC1A/OC1B
disconnected.
0 1 WGM13=0: Normal port operation, OC1A/OC1B
disconnected.
WGM13=1: Toggle OC1A on Compare Match,
OC1B reserved.
1 0 Clear OC1A/OC1B on Compare Match, set
OC1A/OC1B at TOP
1 1 Set OC1A/OC1B on Compare Match, clear
OC1A/OC1B at TOP105
2543L–AVR–08/10
ATtiny2313
Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. In
this case the compare match is ignored, but the set or clear is done at TOP. See “Fast PWM
Mode” on page 96. for more details.
Table 45 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the phase correct
or the phase and frequency correct, PWM mode.
Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. See
“Phase Correct PWM Mode” on page 98. for more details.
• Bit 1:0 – WGM11:0: Waveform Generation Mode
Combined with the WGM13:2 bits found in the TCCR1B Register, these bits control the counting
sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform
generation to be used, see Table 46. Modes of operation supported by the Timer/Counter
unit are: Normal mode (counter), Clear Timer on Compare match (CTC) mode, and three types
of Pulse Width Modulation (PWM) modes. (See “Modes of Operation” on page 94.).
Table 45. Compare Output Mode, Phase Correct and Phase and Frequency Correct PWM(1)
COM1A1/COM1B1 COM1A0/COM1B0 Description
0 0 Normal port operation, OC1A/OC1B
disconnected.
0 1 WGM13=0: Normal port operation, OC1A/OC1B
disconnected.
WGM13=1: Toggle OC1A on Compare Match,
OC1B reserved.
1 0 Clear OC1A/OC1B on Compare Match when upcounting.
Set OC1A/OC1B on Compare Match
when downcounting.
1 1 Set OC1A/OC1B on Compare Match when upcounting.
Clear OC1A/OC1B on Compare Match
when downcounting.106
2543L–AVR–08/10
ATtiny2313
Note: 1. The CTC1 and PWM11:0 bit definition names are obsolete. Use the WGM12:0 definitions. However, the functionality and
location of these bits are compatible with previous versions of the timer.
Table 46. Waveform Generation Mode Bit Description(1)
Mode WGM13
WGM12
(CTC1)
WGM11
(PWM11)
WGM10
(PWM10)
Timer/Counter Mode of
Operation TOP
Update of
OCR1x at
TOV1 Flag
Set on
0 0 0 0 0 Normal 0xFFFF Immediate MAX
1 0 0 0 1 PWM, Phase Correct, 8-bit 0x00FF TOP BOTTOM
2 0 0 1 0 PWM, Phase Correct, 9-bit 0x01FF TOP BOTTOM
3 0 0 1 1 PWM, Phase Correct, 10-bit 0x03FF TOP BOTTOM
4 0 1 0 0 CTC OCR1A Immediate MAX
5 0 1 0 1 Fast PWM, 8-bit 0x00FF TOP TOP
6 0 1 1 0 Fast PWM, 9-bit 0x01FF TOP TOP
7 0 1 1 1 Fast PWM, 10-bit 0x03FF TOP TOP
8 1 0 0 0 PWM, Phase and Frequency
Correct
ICR1 BOTTOM BOTTOM
9 1 0 0 1 PWM, Phase and Frequency
Correct
OCR1A BOTTOM BOTTOM
10 1 0 1 0 PWM, Phase Correct ICR1 TOP BOTTOM
11 1 0 1 1 PWM, Phase Correct OCR1A TOP BOTTOM
12 1 1 0 0 CTC ICR1 Immediate MAX
13 1 1 0 1 (Reserved) – – –
14 1 1 1 0 Fast PWM ICR1 TOP TOP
15 1 1 1 1 Fast PWM OCR1A TOP TOP107
2543L–AVR–08/10
ATtiny2313
Timer/Counter1
Control Register B –
TCCR1B
• Bit 7 – ICNC1: Input Capture Noise Canceler
Setting this bit (to one) activates the Input Capture Noise Canceler. When the noise canceler is
activated, the input from the Input Capture pin (ICP1) is filtered. The filter function requires four
successive equal valued samples of the ICP1 pin for changing its output. The Input Capture is
therefore delayed by four Oscillator cycles when the noise canceler is enabled.
• Bit 6 – ICES1: Input Capture Edge Select
This bit selects which edge on the Input Capture pin (ICP1) that is used to trigger a capture
event. When the ICES1 bit is written to zero, a falling (negative) edge is used as trigger, and
when the ICES1 bit is written to one, a rising (positive) edge will trigger the capture.
When a capture is triggered according to the ICES1 setting, the counter value is copied into the
Input Capture Register (ICR1). The event will also set the Input Capture Flag (ICF1), and this
can be used to cause an Input Capture Interrupt, if this interrupt is enabled.
When the ICR1 is used as TOP value (see description of the WGM13:0 bits located in the
TCCR1A and the TCCR1B Register), the ICP1 is disconnected and consequently the Input Capture
function is disabled.
• Bit 5 – Reserved Bit
This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be
written to zero when TCCR1B is written.
• Bit 4:3 – WGM13:2: Waveform Generation Mode
See TCCR1A Register description.
• Bit 2:0 – CS12:0: Clock Select
The three Clock Select bits select the clock source to be used by the Timer/Counter, see Figure
49 and Figure 50.
If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock the
counter even if the pin is configured as an output. This feature allows software control of the
counting.
Bit 7 6 5 4 3 2 1 0
ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 TCCR1B
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 47. Clock Select Bit Description
CS12 CS11 CS10 Description
0 0 0 No clock source (Timer/Counter stopped).
0 0 1 clkI/O/1 (No prescaling)
0 1 0 clkI/O/8 (From prescaler)
0 1 1 clkI/O/64 (From prescaler)
1 0 0 clkI/O/256 (From prescaler)
1 0 1 clkI/O/1024 (From prescaler)
1 1 0 External clock source on T1 pin. Clock on falling edge.
1 1 1 External clock source on T1 pin. Clock on rising edge.108
2543L–AVR–08/10
ATtiny2313
Timer/Counter1
Control Register C –
TCCR1C
• Bit 7 – FOC1A: Force Output Compare for Channel A
• Bit 6 – FOC1B: Force Output Compare for Channel B
The FOC1A/FOC1B bits are only active when the WGM13:0 bits specifies a non-PWM mode.
However, for ensuring compatibility with future devices, these bits must be set to zero when
TCCR1A is written when operating in a PWM mode. When writing a logical one to the
FOC1A/FOC1B bit, an immediate compare match is forced on the Waveform Generation unit.
The OC1A/OC1B output is changed according to its COM1x1:0 bits setting. Note that the
FOC1A/FOC1B bits are implemented as strobes. Therefore it is the value present in the
COM1x1:0 bits that determine the effect of the forced compare.
A FOC1A/FOC1B strobe will not generate any interrupt nor will it clear the timer in Clear Timer
on Compare match (CTC) mode using OCR1A as TOP.
The FOC1A/FOC1B bits are always read as zero.
Timer/Counter1 –
TCNT1H and TCNT1L
The two Timer/Counter I/O locations (TCNT1H and TCNT1L, combined TCNT1) give direct
access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To
ensure that both the high and low bytes are read and written simultaneously when the CPU
accesses these registers, the access is performed using an 8-bit temporary high byte register
(TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit
Registers” on page 84.
Modifying the counter (TCNT1) while the counter is running introduces a risk of missing a compare
match between TCNT1 and one of the OCR1x Registers.
Writing to the TCNT1 Register blocks (removes) the compare match on the following timer clock
for all compare units.
Output Compare
Register 1 A –
OCR1AH and OCR1AL
Bit 7 6 5 4 3 2 1 0
FOC1A FOC1B – – – – – – TCCR1C
Read/Write W W R R R R R R
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
TCNT1[15:8] TCNT1H
TCNT1[7:0] TCNT1L
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
OCR1A[15:8] OCR1AH
OCR1A[7:0] OCR1AL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0109
2543L–AVR–08/10
ATtiny2313
Output Compare
Register 1 B -
OCR1BH and OCR1BL
The Output Compare Registers contain a 16-bit value that is continuously compared with the
counter value (TCNT1). A match can be used to generate an Output Compare interrupt, or to
generate a waveform output on the OC1x pin.
The Output Compare Registers are 16-bit in size. To ensure that both the high and low bytes are
written simultaneously when the CPU writes to these registers, the access is performed using an
8-bit temporary high byte register (TEMP). This temporary register is shared by all the other 16-
bit registers. See “Accessing 16-bit Registers” on page 84.
Input Capture Register
1 – ICR1H and ICR1L
The Input Capture is updated with the counter (TCNT1) value each time an event occurs on the
ICP1 pin (or optionally on the Analog Comparator output for Timer/Counter1). The Input Capture
can be used for defining the counter TOP value.
The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes are read
simultaneously when the CPU accesses these registers, the access is performed using an 8-bit
temporary high byte register (TEMP). This temporary register is shared by all the other 16-bit
registers. See “Accessing 16-bit Registers” on page 84.
Timer/Counter
Interrupt Mask
Register – TIMSK
• Bit 7 – TOIE1: Timer/Counter1, Overflow Interrupt Enable
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally
enabled), the Timer/Counter1 Overflow interrupt is enabled. The corresponding Interrupt Vector
(See “Interrupts” on page 44.) is executed when the TOV1 flag, located in TIFR, is set.
• Bit 6 – OCIE1A: Timer/Counter1, Output Compare A Match Interrupt Enable
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally
enabled), the Timer/Counter1 Output Compare A Match interrupt is enabled. The corresponding
Interrupt Vector (See “Interrupts” on page 44.) is executed when the OCF1A flag, located in
TIFR, is set.
• Bit 5 – OCIE1B: Timer/Counter1, Output Compare B Match Interrupt Enable
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally
enabled), the Timer/Counter1 Output Compare B Match interrupt is enabled. The corresponding
Interrupt Vector (See “Interrupts” on page 44.) is executed when the OCF1B flag, located in
TIFR, is set.
• Bit 3 – ICIE1: Timer/Counter1, Input Capture Interrupt Enable
Bit 7 6 5 4 3 2 1 0
OCR1B[15:8] OCR1BH
OCR1B[7:0] OCR1BL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
ICR1[15:8] ICR1H
ICR1[7:0] ICR1L
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
TOIE1 OCIE1A OCIE1B – ICIE1 OCIE0B TOIE0 OCIE0A TIMSK
Read/Write R/W R/W R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0110
2543L–AVR–08/10
ATtiny2313
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally
enabled), the Timer/Counter1 Input Capture interrupt is enabled. The corresponding Interrupt
Vector (See “Interrupts” on page 44.) is executed when the ICF1 flag, located in TIFR, is set.
Timer/Counter
Interrupt Flag Register
– TIFR
• Bit 7 – TOV1: Timer/Counter1, Overflow Flag
The setting of this flag is dependent of the WGM13:0 bits setting. In Normal and CTC modes,
the TOV1 flag is set when the timer overflows. Refer to Table 46 on page 106 for the TOV1 flag
behavior when using another WGM13:0 bit setting.
TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed.
Alternatively, TOV1 can be cleared by writing a logic one to its bit location.
• Bit 6 – OCF1A: Timer/Counter1, Output Compare A Match Flag
This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output
Compare Register A (OCR1A).
Note that a Forced Output Compare (FOC1A) strobe will not set the OCF1A flag.
OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is executed.
Alternatively, OCF1A can be cleared by writing a logic one to its bit location.
• Bit 5 – OCF1B: Timer/Counter1, Output Compare B Match Flag
This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output
Compare Register B (OCR1B).
Note that a Forced Output Compare (FOC1B) strobe will not set the OCF1B flag.
OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is executed.
Alternatively, OCF1B can be cleared by writing a logic one to its bit location.
• Bit 3 – ICF1: Timer/Counter1, Input Capture Flag
This flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register
(ICR1) is set by the WGM13:0 to be used as the TOP value, the ICF1 flag is set when the counter
reaches the TOP value.
ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively,
ICF1 can be cleared by writing a logic one to its bit location.
Bit 7 6 5 4 3 2 1 0
TOV1 OCF1A OCF1B – ICF1 OCF0B TOV0 OCF0A TIFR
Read/Write R/W R/W R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0111
2543L–AVR–08/10
ATtiny2313
USART The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a
highly flexible serial communication device. The main features are:
• Full Duplex Operation (Independent Serial Receive and Transmit Registers)
• Asynchronous or Synchronous Operation
• Master or Slave Clocked Synchronous Operation
• High Resolution Baud Rate Generator
• Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits
• Odd or Even Parity Generation and Parity Check Supported by Hardware
• Data OverRun Detection
• Framing Error Detection
• Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter
• Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete
• Multi-processor Communication Mode
• Double Speed Asynchronous Communication Mode
Overview A simplified block diagram of the USART Transmitter is shown in Figure 53. CPU accessible I/O
Registers and I/O pins are shown in bold.
Figure 53. USART Block Diagram(1)
Note: 1. Refer to Figure 1 on page 2, Table 29 on page 57, and Table 26 on page 55 for USART pin
placement.
PARITY
GENERATOR
UBRR[H:L]
UDR (Transmit)
UCSRA UCSRB UCSRC
BAUD RATE GENERATOR
TRANSMIT SHIFT REGISTER
RECEIVE SHIFT REGISTER RxD
TxD PIN
CONTROL
UDR (Receive)
PIN
CONTROL
XCK
DATA
RECOVERY
CLOCK
RECOVERY
PIN
CONTROL
TX
CONTROL
RX
CONTROL
PARITY
CHECKER
DATA BUS
OSC
SYNC LOGIC
Clock Generator
Transmitter
Receiver112
2543L–AVR–08/10
ATtiny2313
The dashed boxes in the block diagram separate the three main parts of the USART (listed from
the top): Clock Generator, Transmitter and Receiver. Control registers are shared by all units.
The Clock Generation logic consists of synchronization logic for external clock input used by
synchronous slave operation, and the baud rate generator. The XCK (Transfer Clock) pin is only
used by synchronous transfer mode. The Transmitter consists of a single write buffer, a serial
Shift Register, Parity Generator and Control logic for handling different serial frame formats. The
write buffer allows a continuous transfer of data without any delay between frames. The
Receiver is the most complex part of the USART module due to its clock and data recovery
units. The recovery units are used for asynchronous data reception. In addition to the recovery
units, the Receiver includes a Parity Checker, Control logic, a Shift Register and a two level
receive buffer (UDR). The Receiver supports the same frame formats as the Transmitter, and
can detect Frame Error, Data OverRun and Parity Errors.
AVR USART vs. AVR
UART – Compatibility
The USART is fully compatible with the AVR UART regarding:
• Bit locations inside all USART Registers.
• Baud Rate Generation.
• Transmitter Operation.
• Transmit Buffer Functionality.
• Receiver Operation.
However, the receive buffering has two improvements that will affect the compatibility in some
special cases:
• A second Buffer Register has been added. The two Buffer Registers operate as a circular
FIFO buffer. Therefore the UDR must only be read once for each incoming data! More
important is the fact that the error flags (FE and DOR) and the ninth data bit (RXB8) are
buffered with the data in the receive buffer. Therefore the status bits must always be read
before the UDR Register is read. Otherwise the error status will be lost since the buffer state
is lost.
• The Receiver Shift Register can now act as a third buffer level. This is done by allowing the
received data to remain in the serial Shift Register (see Figure 53) if the Buffer Registers are
full, until a new start bit is detected. The USART is therefore more resistant to Data OverRun
(DOR) error conditions.
The following control bits have changed name, but have same functionality and register location:
• CHR9 is changed to UCSZ2.
• OR is changed to DOR.
Clock Generation The Clock Generation logic generates the base clock for the Transmitter and Receiver. The
USART supports four modes of clock operation: Normal asynchronous, Double Speed asynchronous,
Master synchronous and Slave synchronous mode. The UMSEL bit in USART
Control and Status Register C (UCSRC) selects between asynchronous and synchronous operation.
Double Speed (asynchronous mode only) is controlled by the U2X found in the UCSRA
Register. When using synchronous mode (UMSEL = 1), the Data Direction Register for the XCK
pin (DDR_XCK) controls whether the clock source is internal (Master mode) or external (Slave
mode). The XCK pin is only active when using synchronous mode.
Figure 54 shows a block diagram of the clock generation logic.113
2543L–AVR–08/10
ATtiny2313
Figure 54. Clock Generation Logic, Block Diagram
Signal description:
txclk Transmitter clock (Internal Signal).
rxclk Receiver base clock (Internal Signal).
xcki Input from XCK pin (internal Signal). Used for synchronous slave operation.
xcko Clock output to XCK pin (Internal Signal). Used for synchronous master
operation.
fosc XTAL pin frequency (System Clock).
Internal Clock
Generation – The
Baud Rate Generator
Internal clock generation is used for the asynchronous and the synchronous master modes of
operation. The description in this section refers to Figure 54.
The USART Baud Rate Register (UBRR) and the down-counter connected to it function as a
programmable prescaler or baud rate generator. The down-counter, running at system clock
(fosc), is loaded with the UBRR value each time the counter has counted down to zero or when
the UBRRL Register is written. A clock is generated each time the counter reaches zero. This
clock is the baud rate generator clock output (= fosc/(UBRR+1)). The Transmitter divides the
baud rate generator clock output by 2, 8 or 16 depending on mode. The baud rate generator output
is used directly by the Receiver’s clock and data recovery units. However, the recovery units
use a state machine that uses 2, 8 or 16 states depending on mode set by the state of the
UMSEL, U2X and DDR_XCK bits.
Table 48 contains equations for calculating the baud rate (in bits per second) and for calculating
the UBRR value for each mode of operation using an internally generated clock source.
Note: 1. The baud rate is defined to be the transfer rate in bit per second (bps)
Prescaling
Down-Counter /2
UBRR
/4 /2
fosc
UBRR+1
Sync
Register
OSC
XCK
Pin
txclk
U2X
UMSEL
DDR_XCK
0
1
0
1
xcki
xcko
DDR_XCK rxclk 0
1
1
0
Edge
Detector
UCPOL
Table 48. Equations for Calculating Baud Rate Register Setting
Operating Mode
Equation for Calculating
Baud Rate(1)
Equation for Calculating
UBRR Value
Asynchronous Normal
mode (U2X = 0)
Asynchronous Double
Speed mode (U2X = 1)
Synchronous Master
mode
BAUD f
OSC
16( ) UBRR + 1 = -------------------------------------- UBRR f
OSC
16BAUD = ------------------------ – 1
BAUD f
OSC
8( ) UBRR + 1 = ----------------------------------- UBRR f
OSC
8BAUD = -------------------- – 1
BAUD f
OSC
2( ) UBRR + 1 = ----------------------------------- UBRR f
OSC
2BAUD = -------------------- – 1114
2543L–AVR–08/10
ATtiny2313
BAUD Baud rate (in bits per second, bps)
fOSC System Oscillator clock frequency
UBRR Contents of the UBRRH and UBRRL Registers, (0-4095)
Some examples of UBRR values for some system clock frequencies are found in Table 56 (see
page 134).
Double Speed
Operation (U2X)
The transfer rate can be doubled by setting the U2X bit in UCSRA. Setting this bit only has effect
for the asynchronous operation. Set this bit to zero when using synchronous operation.
Setting this bit will reduce the divisor of the baud rate divider from 16 to 8, effectively doubling
the transfer rate for asynchronous communication. Note however that the Receiver will in this
case only use half the number of samples (reduced from 16 to 8) for data sampling and clock
recovery, and therefore a more accurate baud rate setting and system clock are required when
this mode is used. For the Transmitter, there are no downsides.
External Clock External clocking is used by the synchronous slave modes of operation. The description in this
section refers to Figure 54 for details.
External clock input from the XCK pin is sampled by a synchronization register to minimize the
chance of meta-stability. The output from the synchronization register must then pass through
an edge detector before it can be used by the Transmitter and Receiver. This process introduces
a two CPU clock period delay and therefore the maximum external XCK clock frequency
is limited by the following equation:
Note that fosc depends on the stability of the system clock source. It is therefore recommended to
add some margin to avoid possible loss of data due to frequency variations.
Synchronous Clock
Operation
When synchronous mode is used (UMSEL = 1), the XCK pin will be used as either clock input
(Slave) or clock output (Master). The dependency between the clock edges and data sampling
or data change is the same. The basic principle is that data input (on RxD) is sampled at the
opposite XCK clock edge of the edge the data output (TxD) is changed.
Figure 55. Synchronous Mode XCK Timing.
The UCPOL bit UCRSC selects which XCK clock edge is used for data sampling and which is
used for data change. As Figure 55 shows, when UCPOL is zero the data will be changed at risf
XCK
f
OSC
4 < -----------
RxD / TxD
XCK
RxD / TxD
UCPOL = 0 XCK
UCPOL = 1
Sample
Sample115
2543L–AVR–08/10
ATtiny2313
ing XCK edge and sampled at falling XCK edge. If UCPOL is set, the data will be changed at
falling XCK edge and sampled at rising XCK edge.
Frame Formats A serial frame is defined to be one character of data bits with synchronization bits (start and stop
bits), and optionally a parity bit for error checking. The USART accepts all 30 combinations of
the following as valid frame formats:
• 1 start bit
• 5, 6, 7, 8, or 9 data bits
• no, even or odd parity bit
• 1 or 2 stop bits
A frame starts with the start bit followed by the least significant data bit. Then the next data bits,
up to a total of nine, are succeeding, ending with the most significant bit. If enabled, the parity bit
is inserted after the data bits, before the stop bits. When a complete frame is transmitted, it can
be directly followed by a new frame, or the communication line can be set to an idle (high) state.
Figure 56 illustrates the possible combinations of the frame formats. Bits inside brackets are
optional.
Figure 56. Frame Formats
St Start bit, always low.
(n) Data bits (0 to 8).
P Parity bit. Can be odd or even.
Sp Stop bit, always high.
IDLE No transfers on the communication line (RxD or TxD). An IDLE line must be
high.
The frame format used by the USART is set by the UCSZ2:0, UPM1:0 and USBS bits in UCSRB
and UCSRC. The Receiver and Transmitter use the same setting. Note that changing the setting
of any of these bits will corrupt all ongoing communication for both the Receiver and Transmitter.
The USART Character SiZe (UCSZ2:0) bits select the number of data bits in the frame. The
USART Parity mode (UPM1:0) bits enable and set the type of parity bit. The selection between
one or two stop bits is done by the USART Stop Bit Select (USBS) bit. The Receiver ignores the
second stop bit. An FE (Frame Error) will therefore only be detected in the cases where the first
stop bit is zero.
Parity Bit Calculation The parity bit is calculated by doing an exclusive-or of all the data bits. If odd parity is used, the
result of the exclusive or is inverted. The relation between the parity bit and data bits is as
follows:
Peven Parity bit using even parity
Podd Parity bit using odd parity
(IDLE) St Sp1 [Sp2] 0 2 3 4 [5] [6] [7] [8] [P] 1 (St / IDLE)
FRAME
Peven dn – 1 … d3 d2 d1 d0 0
Podd
⊕⊕⊕⊕⊕⊕
dn – 1 … d3 d2 d1 d0 ⊕⊕⊕⊕⊕⊕ 1
=
=116
2543L–AVR–08/10
ATtiny2313
dn Data bit n of the character
If used, the parity bit is located between the last data bit and first stop bit of a serial frame.
USART
Initialization
The USART has to be initialized before any communication can take place. The initialization process
normally consists of setting the baud rate, setting frame format and enabling the
Transmitter or the Receiver depending on the usage. For interrupt driven USART operation, the
Global Interrupt Flag should be cleared (and interrupts globally disabled) when doing the
initialization.
Before doing a re-initialization with changed baud rate or frame format, be sure that there are no
ongoing transmissions during the period the registers are changed. The TXC flag can be used to
check that the Transmitter has completed all transfers, and the RXC flag can be used to check
that there are no unread data in the receive buffer. Note that the TXC flag must be cleared
before each transmission (before UDR is written) if it is used for this purpose.
The following simple USART initialization code examples show one assembly and one C function
that are equal in functionality. The examples assume asynchronous operation using polling
(no interrupts enabled) and a fixed frame format. The baud rate is given as a function parameter.
For the assembly code, the baud rate parameter is assumed to be stored in the r17:r16
Registers.
Note: 1. The example code assumes that the part specific header file is included.
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.
Assembly Code Example(1)
USART_Init:
; Set baud rate
out UBRRH, r17
out UBRRL, r16
; Enable receiver and transmitter
ldi r16, (1<>8);
UBRRL = (unsigned char)baud;
/* Enable receiver and transmitter */
UCSRB = (1<> 1) & 0x01;
return ((resh << 8) | resl);
}123
2543L–AVR–08/10
ATtiny2313
Note: 1. The example code assumes that the part specific header file is included.
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.
The receive function example reads all the I/O Registers into the Register File before any computation
is done. This gives an optimal receive buffer utilization since the buffer location read will
be free to accept new data as early as possible.
Receive Compete Flag
and Interrupt
The USART Receiver has one flag that indicates the Receiver state.
The Receive Complete (RXC) flag indicates if there are unread data present in the receive buffer.
This flag is one when unread data exist in the receive buffer, and zero when the receive
buffer is empty (i.e., does not contain any unread data). If the Receiver is disabled (RXEN = 0),
the receive buffer will be flushed and consequently the RXC bit will become zero.
When the Receive Complete Interrupt Enable (RXCIE) in UCSRB is set, the USART Receive
Complete interrupt will be executed as long as the RXC flag is set (provided that global interrupts
are enabled). When interrupt-driven data reception is used, the receive complete routine
must read the received data from UDR in order to clear the RXC flag, otherwise a new interrupt
will occur once the interrupt routine terminates.
Receiver Error Flags The USART Receiver has three error flags: Frame Error (FE), Data OverRun (DOR) and Parity
Error (UPE). All can be accessed by reading UCSRA. Common for the error flags is that they are
located in the receive buffer together with the frame for which they indicate the error status. Due
to the buffering of the error flags, the UCSRA must be read before the receive buffer (UDR),
since reading the UDR I/O location changes the buffer read location. Another equality for the
error flags is that they can not be altered by software doing a write to the flag location. However,
all flags must be set to zero when the UCSRA is written for upward compatibility of future
USART implementations. None of the error flags can generate interrupts.
The Frame Error (FE) flag indicates the state of the first stop bit of the next readable frame
stored in the receive buffer. The FE flag is zero when the stop bit was correctly read (as one),
and the FE flag will be one when the stop bit was incorrect (zero). This flag can be used for
detecting out-of-sync conditions, detecting break conditions and protocol handling. The FE flag
is not affected by the setting of the USBS bit in UCSRC since the Receiver ignores all, except for
the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to
UCSRA.
The Data OverRun (DOR) flag indicates data loss due to a receiver buffer full condition. A Data
OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in
the Receive Shift Register, and a new start bit is detected. If the DOR flag is set there was one
or more serial frame lost between the frame last read from UDR, and the next frame read from
UDR. For compatibility with future devices, always write this bit to zero when writing to UCSRA.
The DOR flag is cleared when the frame received was successfully moved from the Shift Register
to the receive buffer.
The Parity Error (UPE) Flag indicates that the next frame in the receive buffer had a Parity Error
when received. If Parity Check is not enabled the UPE bit will always be read zero. For compatibility
with future devices, always set this bit to zero when writing to UCSRA. For more details see
“Parity Bit Calculation” on page 115 and “Parity Checker” on page 124.124
2543L–AVR–08/10
ATtiny2313
Parity Checker The Parity Checker is active when the high USART Parity mode (UPM1) bit is set. Type of Parity
Check to be performed (odd or even) is selected by the UPM0 bit. When enabled, the Parity
Checker calculates the parity of the data bits in incoming frames and compares the result with
the parity bit from the serial frame. The result of the check is stored in the receive buffer together
with the received data and stop bits. The Parity Error (UPE) flag can then be read by software to
check if the frame had a Parity Error.
The UPE bit is set if the next character that can be read from the receive buffer had a Parity
Error when received and the Parity Checking was enabled at that point (UPM1 = 1). This bit is
valid until the receive buffer (UDR) is read.
Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing
receptions will therefore be lost. When disabled (i.e., the RXEN is set to zero) the Receiver will
no longer override the normal function of the RxD port pin. The Receiver buffer FIFO will be
flushed when the Receiver is disabled. Remaining data in the buffer will be lost
Flushing the Receive
Buffer
The receiver buffer FIFO will be flushed when the Receiver is disabled, i.e., the buffer will be
emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal
operation, due to for instance an error condition, read the UDR I/O location until the RXC flag is
cleared. The following code example shows how to flush the receive buffer.
Note: 1. The example code assumes that the part specific header file is included.
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.
Asynchronous
Data Reception
The USART includes a clock recovery and a data recovery unit for handling asynchronous data
reception. The clock recovery logic is used for synchronizing the internally generated baud rate
clock to the incoming asynchronous serial frames at the RxD pin. The data recovery logic samples
and low pass filters each incoming bit, thereby improving the noise immunity of the
Receiver. The asynchronous reception operational range depends on the accuracy of the internal
baud rate clock, the rate of the incoming frames, and the frame size in number of bits.
Assembly Code Example(1)
USART_Flush:
sbis UCSRA, RXC
ret
in r16, UDR
rjmp USART_Flush
C Code Example(1)
void USART_Flush( void )
{
unsigned char dummy;
while ( UCSRA & (1< 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz
High:> 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz
t
BVDV BS1 Valid to DATA valid 0 250 ns
tOLDV OE Low to DATA Valid 250 ns
tOHDZ OE High to DATA Tri-stated 250 ns
Table 76. Parallel Programming Characteristics, VCC = 5V ± 10% (Continued)
Symbol Parameter Min Typ Max Units
VCC
GND
XTAL1
SCK
MISO
MOSI
RESET
+1.8 - 5.5V173
2543L–AVR–08/10
ATtiny2313
Serial Programming
Algorithm
When writing serial data to the ATtiny2313, data is clocked on the rising edge of SCK.
When reading data from the ATtiny2313, data is clocked on the falling edge of SCK. See Figure
79, Figure 80 and Table 79 for timing details.
To program and verify the ATtiny2313 in the serial programming mode, the following sequence
is recommended (See four byte instruction formats in Table 78 on page 174):
1. Power-up sequence:
Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems,
the programmer can not guarantee that SCK is held low during power-up. In this
case, RESET must be given a positive pulse of at least two CPU clock cycles duration
after SCK has been set to “0”.
2. Wait for at least 20 ms and enable serial programming by sending the Programming
Enable serial instruction to pin MOSI.
3. The serial programming instructions will not work if the communication is out of synchronization.
When in sync. the second byte (0x53), will echo back when issuing the third
byte of the Programming Enable instruction. Whether the echo is correct or not, all four
bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a
positive pulse and issue a new Programming Enable command.
4. The Flash is programmed one page at a time. The memory page is loaded one byte at a
time by supplying the 4 LSB of the address and data together with the Load Program
Memory Page instruction. To ensure correct loading of the page, the data low byte must
be loaded before data high byte is applied for a given address. The Program Memory
Page is stored by loading the Write Program Memory Page instruction with the 6 MSB of
the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before
issuing the next page. (See Table 77 on page 174.) Accessing the serial programming
interface before the Flash write operation completes can result in incorrect programming.
5. A: The EEPROM array is programmed one byte at a time by supplying the address and
data together with the appropriate Write instruction. An EEPROM memory location is first
automatically erased before new data is written. If polling (RDY/BSY) is not used, the user
must wait at least tWD_EEPROM before issuing the next byte. (See Table 77 on page 174.)
In a chip erased device, no 0xFFs in the data file(s) need to be programmed.
B: The EEPROM array is programmed one page at a time. The Memory page is loaded
one byte at a time by supplying the 2 LSB of the address and data together with the Load
EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading
the Write EEPROM Memory Page Instruction with the 5 MSB of the address. When using
EEPROM page access only byte locations loaded with the Load EEPROM Memory Page
instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is
not used, the used must wait at least tWD_EEPROM before issuing the next page (See Table
77 on page 174). In a chip erased device, no 0xFF in the data file(s) need to be
programmed.
6. Any memory location can be verified by using the Read instruction which returns the content
at the selected address at serial output MISO.
7. At the end of the programming session, RESET can be set high to commence normal
operation.
8. Power-off sequence (if needed):
Set RESET to “1”.
Turn VCC power off.174
2543L–AVR–08/10
ATtiny2313
Figure 79. Serial Programming Waveforms
Table 77. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location
Symbol Minimum Wait Delay
tWD_FLASH 4.5 ms
tWD_EEPROM 4.0 ms
tWD_ERASE 9.0 ms
tWD_FUSE 4.5 ms
MSB
MSB
LSB
LSB
SERIAL CLOCK INPUT
(SCK)
SERIAL DATA INPUT
(MOSI)
(MISO)
SAMPLE
SERIAL DATA OUTPUT
Table 78. Serial Programming Instruction Set
Instruction
Instruction Format
Byte 1 Byte 2 Byte 3 Byte4 Operation
Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after
RESET goes low.
Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash.
Read Program Memory 0010 H000 0000 00aa bbbb bbbb oooo oooo Read H (high or low) data o from
Program memory at word address a:b.
Load Program Memory Page 0100 H000 000x xxxx xxxx bbbb iiii iiii Write H (high or low) data i to Program
Memory page at word address b. Data
low byte must be loaded before Data
high byte is applied within the same
address.
Write Program Memory Page 0100 1100 0000 00aa bbbb xxxx xxxx xxxx Write Program Memory Page at
address a:b.
Read EEPROM Memory 1010 0000 000x xxxx xbbb bbbb oooo oooo Read data o from EEPROM memory at
address b.
Write EEPROM Memory 1100 0000 000x xxxx xbbb bbbb iiii iiii Write data i to EEPROM memory at
address b.
Load EEPROM Memory
Page (page access)
1100 0001 0000 0000 0000 00bb iiii iiii Load data i to EEPROM memory page
buffer. After data is loaded, program
EEPROM page.
Write EEPROM Memory
Page (page access)
1100 0010 00xx xxxx xbbb bb00 xxxx xxxx
Write EEPROM page at address b.175
2543L–AVR–08/10
ATtiny2313
Note: a = address high bits, b = address low bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care
Read Lock bits 0101 1000 0000 0000 xxxx xxxx xxoo oooo Read Lock bits. “0” = programmed, “1”
= unprogrammed. See Table 64 on
page 158 for details.
Write Lock bits 1010 1100 111x xxxx xxxx xxxx 11ii iiii Write Lock bits. Set bits = “0” to
program Lock bits. See Table 64 on
page 158 for details.
Read Signature Byte 0011 0000 000x xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b.
Write Fuse bits 1010 1100 1010 0000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to
unprogram.
Write Fuse High bits 1010 1100 1010 1000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to
unprogram.
Write Extended Fuse Bits 1010 1100 1010 0100 xxxx xxxx xxxx xxxi Set bits = “0” to program, “1” to
unprogram.
Read Fuse bits 0101 0000 0000 0000 xxxx xxxx oooo oooo Read Fuse bits. “0” = programmed, “1”
= unprogrammed.
Read Fuse High bits 0101 1000 0000 1000 xxxx xxxx oooo oooo Read Fuse High bits. “0” = programmed,
“1” = unprogrammed.
Read Extended Fuse Bits 0101 0000 0000 1000 xxxx xxxx oooo oooo Read Extended Fuse bits. “0” = programmed,
“1” = unprogrammed.
Read Calibration Byte 0011 1000 000x xxxx 0000 000b oooo oooo Read Calibration Byte at address b.
Poll RDY/BSY 1111 0000 0000 0000 xxxx xxxx xxxx xxxo If o = “1”, a programming operation is
still busy. Wait until this bit returns to
“0” before applying another command.
Table 78. Serial Programming Instruction Set
Instruction
Instruction Format
Byte 1 Byte 2 Byte 3 Byte4 Operation176
2543L–AVR–08/10
ATtiny2313
Serial Programming
Characteristics
Figure 80. Serial Programming Timing
Note: 1. 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz
Table 79. Serial Programming Characteristics, TA = -40°C to +85°C, VCC = 2.7V - 5.5V (Unless
Otherwise Noted)
Symbol Parameter Min Typ Max Units
1/tCLCL Oscillator Frequency (ATtiny2313L) 0 10 MHz
tCLCL Oscillator Period (ATtiny2313L) 125 ns
1/tCLCL
Oscillator Frequency (ATtiny2313, VCC = 4.5V -
5.5V) 0 20 MHz
tCLCL
Oscillator Period (ATtiny2313, VCC = 4.5V -
5.5V) 67 ns
tSHSL SCK Pulse Width High 2 tCLCL* ns
tSLSH SCK Pulse Width Low 2 tCLCL* ns
tOVSH MOSI Setup to SCK High tCLCL ns
tSHOX MOSI Hold after SCK High 2 tCLCL ns
tSLIV SCK Low to MISO Valid 100 ns
MOSI
MISO
SCK
t
OVSH
t
SHSL
t t
SHOX SLSH
t
SLIV177
2543L–AVR–08/10
ATtiny2313
Electrical Characteristics
Absolute Maximum Ratings*
DC Characteristics
Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°C to +150°C
Voltage on any Pin except RESET
with respect to Ground ................................-0.5V to VCC+0.5V
Voltage on RESET with respect to Ground......-0.5V to +13.0V
Maximum Operating Voltage ............................................ 6.0V
DC Current per I/O Pin ............................................... 40.0 mA
DC Current VCC and GND Pins ................................ 200.0 mA
TA = -40°C to +85°C, VCC = 1.8V to 5.5V (unless otherwise noted)(1)
Symbol Parameter Condition Min. Typ.(2) Max. Units
VIL
Input Low Voltage except
XTAL1 and RESET pin
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V -0.5 0.2VCC(3)
0.3VCC(3) V
VIH
Input High-voltage except
XTAL1 and RESET pins
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V
0.7VCC(4)
0.6VCC(4) VCC +0.5 V
VIL1
Input Low Voltage
XTAL1 pin
VCC = 1.8V - 5.5V -0.5 0.1VCC(3) V
VIH1
Input High-voltage
XTAL1 pin
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V
0.8VCC(4)
0.7VCC(4) VCC +0.5 V
VIL2
Input Low Voltage
RESET pin VCC = 1.8V - 5.5V -0.5 0.2VCC(3) V
VIH2
Input High-voltage
RESET pin VCC = 1.8V - 5.5V 0.9VCC(4) VCC +0.5 V
VIL3
Input Low Voltage
RESET pin as I/O
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V -0.5 0.2VCC(3)
0.3VCC(3) V
VIH3
Input High-voltage
RESET pin as I/O
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V
0.7VCC(4)
0.6VCC(4) VCC +0.5 V
VOL
Output Low Voltage(5)
(Port A, Port B, Port D)
I
OL = 20 mA, VCC = 5V
IOL = 10 mA, VCC = 3V
0.7
0.5
V
V
VOH
Output High-voltage(6)
(Port A, Port B, Port D)
I
OH = -20 mA, VCC = 5V
IOH = -10 mA, VCC = 3V
4.2
2.5
V
V
IIL
Input Leakage
Current I/O Pin
VCC = 5.5V, pin low
(absolute value) 1 µA
IIH
Input Leakage
Current I/O Pin
VCC = 5.5V, pin high
(absolute value) 1 µA
RRST Reset Pull-up Resistor 30 60 kΩ
Rpu I/O Pin Pull-up Resistor 20 50 kΩ178
2543L–AVR–08/10
ATtiny2313
Notes: 1. All DC Characteristics contained in this data sheet are based on simulation and characterization of other AVR microcontrollers
manufactured in the same process technology. These values are preliminary values representing design targets, and
will be updated after characterization of actual silicon.
2. Typical values at +25°C.
3. “Max” means the highest value where the pin is guaranteed to be read as low.
4. “Min” means the lowest value where the pin is guaranteed to be read as high.
5. Although each I/O port can sink more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state
conditions (non-transient), the following must be observed:
1] The sum of all IOL, for all ports, should not exceed 60 mA.
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater
than the listed test condition.
6. Although each I/O port can source more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state
conditions (non-transient), the following must be observed:
1] The sum of all IOH, for all ports, should not exceed 60 mA.
If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current
greater than the listed test condition.
ICC
Power Supply Current
Active 1MHz, VCC = 2V 0.35 mA
Active 4MHz, VCC = 3V 2 mA
Active 8MHz, VCC = 5V 6 mA
Idle 1MHz, VCC = 2V 0.08 0.2 mA
Idle 4MHz, VCC = 3V 0.41 1 mA
Idle 8MHz, VCC = 5V 1.6 3 mA
Power-down mode
WDT enabled, VCC = 3V < 3 6 µA
WDT disabled, VCC = 3V < 0.5 2 µA
VACIO
Analog Comparator
Input Offset Voltage
VCC = 5V
Vin = VCC/2 < 10 40 mV
IACLK
Analog Comparator
Input Leakage Current
VCC = 5V
Vin = VCC/2 -50 50 nA
t
ACPD
Analog Comparator
Propagation Delay
VCC = 2.7V
VCC = 5.0V
750
500 ns
TA = -40°C to +85°C, VCC = 1.8V to 5.5V (unless otherwise noted)(1) (Continued)
Symbol Parameter Condition Min. Typ.(2) Max. Units179
2543L–AVR–08/10
ATtiny2313
External Clock
Drive Waveforms
Figure 81. External Clock Drive Waveforms
External Clock
Drive
VIL1
VIH1
Table 80. External Clock Drive (Estimated Values)
Symbol Parameter
VCC = 1.8 - 5.5V VCC = 2.7 - 5.5V VCC = 4.5 - 5.5V
Min. Max. Min. Max. Min. Max. Units
1/tCLCL
Oscillator
Frequency 0 4 0 10 0 20 MHz
tCLCL Clock Period 250 100 50 ns
tCHCX High Time 100 40 20 ns
tCLCX Low Time 100 40 20 ns
tCLCH Rise Time 2.0 1.6 0.5 μs
tCHCL Fall Time 2.0 1.6 0.5 μs
ΔtCLCL
Change in
period from one
clock cycle to
the next
2 2 2%180
2543L–AVR–08/10
ATtiny2313
Maximum Speed
vs. VCC
Maximum frequency is dependent on VCC. As shown in Figure 82 and Figure 83, the Maximum
Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V and between 2.7V < VCC < 4.5V.
Figure 82. Maximum Frequency vs. VCC, ATtiny2313V
Figure 83. Maximum Frequency vs. VCC, ATtiny2313
10 MHz
4 MHz
1.8V 2.7V 5.5V
Safe Operating Area
20 MHz
10 MHz
2.7V 4.5V 5.5V
Safe Operating Area181
2543L–AVR–08/10
ATtiny2313
ATtiny2313
Typical
Characteristics
The following charts show typical behavior. These figures are not tested during manufacturing.
All current consumption measurements are performed with all I/O pins configured as inputs and
with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock
source.
The power consumption in Power-down mode is independent of clock selection.
The current consumption is a function of several factors such as: operating voltage, operating
frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature.
The dominating factors are operating voltage and frequency.
The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where
CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin.
The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to
function properly at frequencies higher than the ordering code indicates.
The difference between current consumption in Power-down mode with Watchdog Timer
enabled and Power-down mode with Watchdog Timer disabled represents the differential current
drawn by the Watchdog Timer.
Active Supply Current Figure 84. Active Supply Current vs. Frequency (0.1 - 1.0 MHz)
ACTIVE SUPPLY CURRENT vs. LOW FREQUENCY
0.1 - 1.0 MHz
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
0
0.2
0.4
0.6
0.8
1
1.2
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
ICC (mA)182
2543L–AVR–08/10
ATtiny2313
Figure 85. Active Supply Current vs. Frequency (1 - 20 MHz)
Figure 86. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
ACTIVE SUPPLY CURRENT vs. FREQUENCY
1 - 20 MHz
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
0
2
4
6
8
10
12
14
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
ICC (mA)
ACTIVE SUPPLY CURRENT vs. VCC
INTERNAL RC OSCILLATOR, 8 MHz
85 ˚C
25 ˚C
-40 ˚C
0
1
2
3
4
5
6
7
8
9
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)183
2543L–AVR–08/10
ATtiny2313
Figure 87. Active Supply Current vs. VCC (Internal RC Oscillator, 4 MHz)
Figure 88. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
ACTIVE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 4 MHz
85 °C
25 °C
-40 °C
0
1
2
3
4
5
6
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)
ACTIVE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 1 MHz
85 °C
25 °C
-40 °C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)184
2543L–AVR–08/10
ATtiny2313
Figure 89. Active Supply Current vs. VCC (Internal RC Oscillator, 0.5 MHz)
Figure 90. Active Supply Current vs. VCC (Internal RC Oscillator, 128 KHz)
ACTIVE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 0.5 MHz
85 °C
25 °C
-40 °C
0
0.2
0.4
0.6
0.8
1
1.2
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)
ACTIVE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 128 KHz
85 °C
25 °C
-40 °C
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Vcc (V)
Icc (mA)185
2543L–AVR–08/10
ATtiny2313
Idle Supply Current Figure 91. Idle Supply Current vs. Frequency (0.1 - 1.0 MHz)
Figure 92. Idle Supply Current vs. Frequency (1 - 20 MHz)
IDLE SUPPLY CURRENT vs. FREQUENCY
0.1 - 1.0 MHz
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
0
0.05
0.1
0.15
0.2
0.25
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
Icc (m A)
IDLE SUPPLY CURRENT vs. FREQUENCY
1 - 20 MHz
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
Icc (mA)186
2543L–AVR–08/10
ATtiny2313
Figure 93. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
Figure 94. Idle Supply Current vs. VCC (Internal RC Oscillator, 4 MHz)
IDLE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 8 MHz
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)
IDLE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 4 MHz
85 °C
25 °C
-40 °C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)187
2543L–AVR–08/10
ATtiny2313
Figure 95. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
Figure 96. Idle Supply Current vs. VCC (Internal RC Oscillator, 0.5 MHz)
IDLE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 1 MHz
85 °C
25 °C
-40 °C
0
0.1
0.2
0.3
0.4
0.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)
IDLE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 0.5 MHz
85 °C
25 °C
-40 °C
0
0.05
0.1
0.15
0.2
0.25
0.3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)188
2543L–AVR–08/10
ATtiny2313
Figure 97. Idle Supply Current vs. VCC (Internal RC Oscillator, 128 KHz)
Power-down Supply
Current
Figure 98. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)
IDLE SUPPLY CURRENT vs. Vcc
INTERNAL RC OSCILLATOR, 128 KHz
85 °C
25 °C
-40 °C
0
0.005
0.01
0.015
0.02
0.025
0.03
0.035
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (m A)
POWER-DOWN SUPPLY CURRENT vs. Vcc
WATCHDOG TIMER DISABLED
85 °C
25 °C
-40 °C
0
0.25
0.5
0.75
1
1.25
1.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (uA)189
2543L–AVR–08/10
ATtiny2313
Figure 99. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)
Standby Supply
Current
Figure 100. Standby Supply Current vs. VCC
POWER-DOWN SUPPLY CURRENT vs. Vcc
WATCHDOG TIMER ENABLED
85 °C
25 °C
-40 °C
0
2
4
6
8
10
12
14
16
18
20
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (uA)
STANDBY SUPPLY CURRENT vs. Vcc
455KHz Res
2MHz Xtal
2MHz Res
1MHz Res
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (m A)190
2543L–AVR–08/10
ATtiny2313
Pin Pull-up Figure 101. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)
Figure 102. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V)
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE
Vcc = 5V
85 °C 25 °C
-40 °C
0
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VOP (V)
IOP (uA )
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE
Vcc = 2.7V
85 °C 25 °C
-40 °C
0
10
20
30
40
50
60
70
80
0 0.5 1 1.5 2 2.5 3
VOP (V)
IOP (uA)191
2543L–AVR–08/10
ATtiny2313
Figure 103. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V)
Figure 104. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V)
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE
Vcc = 5V
85 °C
25 °C
-40 °C
0
20
40
60
80
100
120
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VRESET (V)
IRESET (uA)
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE
Vcc = 2.7V
85 °C
-40 °C 25 °C
0
10
20
30
40
50
60
0 0.5 1 1.5 2 2.5 3
VRESET (V)
IRESET (uA)192
2543L–AVR–08/10
ATtiny2313
Pin Driver Strength Figure 105. I/O Pin Source Current vs. Output Voltage (VCC = 5V)
Figure 106. I/O Pin Source Current vs. Output Voltage (VCC = 2.7V)
I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE
Vcc = 5V
85 °C
25 °C
-40 °C
0
10
20
30
40
50
60
70
80
90
3 3.2 3.4 3.6 3.8 4 4.2 4.4 4.6 4.8 5
VOH (V)
IOH (mA)
I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE
Vcc = 2.7V
85 °C
25 °C
-40 °C
0
5
10
15
20
25
30
35
0.5 1 1.5 2 2.5 3
VOH (V)
IOH (mA)193
2543L–AVR–08/10
ATtiny2313
Figure 107. I/O Pin Source Current vs. Output Voltage (VCC = 1.8V)
Figure 108. I/O Pin Sink Current vs. Output Voltage (VCC = 5V)
I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE
Vcc = 1.8V
85 °C
25 °C
-40 °C
0
1
2
3
4
5
6
7
8
9
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOH (V)
IOH (mA)
I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE
Vcc = 5V
85 °C
25 °C
-40 °C
0
10
20
30
40
50
60
70
80
90
100
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
IOL (mA)194
2543L–AVR–08/10
ATtiny2313
Figure 109. I/O Pin Sink Current vs. Output Voltage (VCC = 2.7V)
Figure 110. I/O Pin Sink Current vs. Output Voltage (VCC = 1.8V)
I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE
Vcc = 2.7V
85 °C
25 °C
-40 °C
0
5
10
15
20
25
30
35
40
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
IOL (mA)
I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE
Vcc = 1.8V
85 °C
25 °C
-40 °C
0
2
4
6
8
10
12
14
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
VOL (V)
IOL (mA)195
2543L–AVR–08/10
ATtiny2313
Figure 111. Reset I/O Pin Source Current vs. Output Voltage (VCC = 5V)
Figure 112. Reset I/O Pin Source Current vs. Output Voltage (VCC = 2.7V)
RESET I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE
Vcc = 5V
85 °C
25 °C
-40 °C
0
2
4
6
8
10
12
14
16
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VOH (V)
Current (mA)
RESET I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE
Vcc = 2.7V
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0 0.5 1 1.5 2 2.5 3
VOH (V)
Current (m A)196
2543L–AVR–08/10
ATtiny2313
Figure 113. Reset I/O Pin Source Current vs. Output Voltage (VCC = 1.8V)
Figure 114. Reset I/O Pin Sink Current vs. Output Voltage (VCC = 5V)
RESET I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE
Vcc = 1.8V
85 °C
25 °C
-40 °C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOH (V)
Current (mA)
RESET I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE
Vcc = 5V
85 °C
25 °C
-40 °C
0
2
4
6
8
10
12
14
16
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VOL (V)
Current (mA)197
2543L–AVR–08/10
ATtiny2313
Figure 115. Reset I/O Pin Sink Current vs. Output Voltage (VCC = 2.7V)
Figure 116. Reset I/O Pin Sink Current vs. Output Voltage (VCC = 1.8V)
RESET I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE
Vcc = 2.7V
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VOL (V)
Current (mA)
RESET I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE
Vcc = 1.8V
85 °C
25 °C
-40 °C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
VOL (V)
Current (mA)198
2543L–AVR–08/10
ATtiny2313
Pin Thresholds and
Hysteresis
Figure 117. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”)
Figure 118. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”)
I/O PIN INPUT THRESHOLD VOLTAGE vs. Vcc
VIH, IO PIN READ AS '1'
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)
I/O PIN INPUT THRESHOLD VOLTAGE vs. Vcc
VIL, IO PIN READ AS '0'
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)199
2543L–AVR–08/10
ATtiny2313
Figure 119. Reset I/O Input Threshold Voltage vs. VCC (VIH,Reset Pin Read as “1”)
Figure 120. Reset I/O Input Threshold Voltage vs. VCC (VIL,Reset Pin Read as “0”)
RESET I/O PIN INPUT THRESHOLD VOLTAGE vs. Vcc
VIH, IO PIN READ AS '1'
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Threshold (V)
RESET I/O PIN INPUT THRESHOLD VOLTAGE vs. Vcc
VIL, IO PIN READ AS '0'
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Threshold (V)200
2543L–AVR–08/10
ATtiny2313
Figure 121. Reset I/O Input Pin Hysteresis vs. VCC
Figure 122. Reset Input Threshold Voltage vs. VCC (VIH,Reset Pin Read as “1”)
RESET I/O INPUT PIN HYSTERESIS vs. Vcc
85 °C
25 °C
-40 °C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Input Hysteresis (V)
RESET INPUT THRESHOLD VOLTAGE vs. Vcc
VIH, IO PIN READ AS '1'
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)201
2543L–AVR–08/10
ATtiny2313
Figure 123. Reset Input Threshold Voltage vs. VCC (VIL,Reset Pin Read as “0”)
Figure 124. Reset Input Pin Hysteresis vs. VCC
RESET INPUT THRESHOLD VOLTAGE vs. Vcc
VIL, IO PIN READ AS '0'
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Threshold (V)
RESET INPUT PIN HYSTERESIS vs. Vcc
85 °C
25 °C
-40 °C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Input Hysteresis (V)202
2543L–AVR–08/10
ATtiny2313
BOD Thresholds and
Analog Comparator
Offset
Figure 125. BOD Thresholds vs. Temperature (BOD Level is 4.3V)
Figure 126. BOD Thresholds vs. Temperature (BOD Level is 2.7V)
BOD THRESHOLDS vs. TEMPERATURE
BODLEVEL IS 4.3V
4.25
4.3
4.35
4.4
4.45
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (C)
Thres hol d (V )
Rising Vcc
Falling Vcc
BOD THRESHOLDS vs. TEMPERATURE
BODLEVEL IS 2.7V
2.65
2.7
2.75
2.8
2.85
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (C)
Threshold (V)
Rising Vcc
Falling Vcc203
2543L–AVR–08/10
ATtiny2313
Figure 127. BOD Thresholds vs. Temperature (BOD Level is 1.8V)
Internal Oscillator
Speed
Figure 128. Watchdog Oscillator Frequency vs. VCC
BOD THRESHOLDS vs. TEMPERATURE
BODLEVEL IS 1.8V
Rising Vcc
Falling Vcc
1.78
1.8
1.82
1.84
1.86
1.88
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (C)
Threshold (V)
WATCHDOG OSCILLATOR FREQUENCY vs. VCC
85 °C
25 °C
-40 °C
0.095
0.096
0.097
0.098
0.099
0.1
0.101
0.102
0.103
0.104
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FRC (M Hz)204
2543L–AVR–08/10
ATtiny2313
Figure 129. Watchdog Oscillator Frequency vs. Temperature
Figure 130. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature
WATCHDOG OSCILLATOR FREQUENCY vs. TEMPERATURE
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
0.096
0.097
0.098
0.099
0.1
0.101
0.102
0.103
0.104
0.105
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (°C)
FRC (MHz)
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
7.7
7.8
7.9
8
8.1
8.2
8.3
8.4
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (°C)
FRC (MHz )205
2543L–AVR–08/10
ATtiny2313
Figure 131. Calibrated 8 MHz RC Oscillator Frequency vs. VCC
Figure 132. Calibrated 8 MHz RC Oscillator Frequency vs. Osccal Value
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. Vcc
85 °C
25 °C
-40 °C
7.7
7.8
7.9
8
8.1
8.2
8.3
8.4
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FRC (MHz)
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE
25 °C
0
2
4
6
8
10
12
14
0 16 32 48 64 80 96 112 128
OSCCAL VALUE
FRC (MHz)206
2543L–AVR–08/10
ATtiny2313
Figure 133. Calibrated 4 MHz RC Oscillator Frequency vs. Temperature
Figure 134. Calibrated 4 MHz RC Oscillator Frequency vs. VCC
CALIBRATED 4MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE
5.5 V
5.0 V
3.3 V
1.8 V
3.9
3.95
4
4.05
4.1
4.15
4.2
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (°C)
FRC (MHz)
CALIBRATED 4MHz RC OSCILLATOR FREQUENCY vs. Vcc
85 °C
25 °C
-40 °C
3.9
3.95
4
4.05
4.1
4.15
4.2
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FRC (MHz)207
2543L–AVR–08/10
ATtiny2313
Figure 135. Calibrated 4 MHz RC Oscillator Frequency vs. Osccal Value
Current Consumption
of Peripheral Units
Figure 136. Brownout Detector Current vs. VCC
CALIBRATED 4MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE
25 °C
0
1
2
3
4
5
6
7
0 8 16 24 32 40 48 56 64 72 80 88 96 104 112 120 128
OSCCAL VALUE
FRC (MHz )
BROWNOUT DETECTOR CURRENT vs. Vcc
85 °C
25 °C
-40 °C
0
5
10
15
20
25
30
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (uA)208
2543L–AVR–08/10
ATtiny2313
Figure 137. Analog Comparator Current vs. VCC
Figure 138. Programming Current vs. VCC
ANALOG COMPARATOR CURRENT vs. Vcc
85 °C
25 °C
-40 °C
0
10
20
30
40
50
60
70
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (uA)
PROGRAMMING CURRENT vs. Vcc
85 °C
25 °C
-40 °C
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Icc (mA)209
2543L–AVR–08/10
ATtiny2313
Current Consumption
in Reset and Reset
Pulsewidth
Figure 139. Reset Supply Current vs. VCC (0.1 - 1.0 MHz, Excluding Current Through The
Reset Pull-up)
Figure 140. Reset Supply Current vs. VCC (1 - 20 MHz, Excluding Current Through The Reset
Pull-up)
RESET SUPPLY CURRENT vs. Vcc
0.1 - 1.0 MHz, EXCLUDING CURRENT THROUGH THE RESET PULLUP
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
1.8 V
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
Icc (mA)
RESET SUPPLY CURRENT vs. Vcc
1 - 20 MHz, EXCLUDING CURRENT THROUGH THE RESET PULLUP
5.5 V
5.0 V
4.5 V
4.0 V
3.3 V
2.7 V
0
0.5
1
1.5
2
2.5
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
Icc (mA)210
2543L–AVR–08/10
ATtiny2313
Figure 141. Minimum Reset Pulse Width vs. VCC
MINIMUM RESET PULSE WIDTH vs. Vcc
85 °C
25 °C
-40 °C
0
500
1000
1500
2000
2500
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Pulsewidth (ns)211
2543L–AVR–08/10
ATtiny2313
Register Summary
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
0x3F (0x5F) SREG I T H S V N Z C 8
0x3E (0x5E) Reserved – – – – – – – –
0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 11
0x3C (0x5C) OCR0B Timer/Counter0 – Compare Register B 77
0x3B (0x5B) GIMSK INT1 INT0 PCIE – – – – – 60
0x3A (0x5A) EIFR INTF1 INTF0 PCIF – – – – – 61
0x39 (0x59) TIMSK TOIE1 OCIE1A OCIE1B – ICIE1 OCIE0B TOIE0 OCIE0A 78, 109
0x38 (0x58) TIFR TOV1 OCF1A OCF1B – ICF1 OCF0B TOV0 OCF0A 78
0x37 (0x57) SPMCSR – – – CTPB RFLB PGWRT PGERS SELFPRGEN 155
0x36 (0x56) OCR0A Timer/Counter0 – Compare Register A 77
0x35 (0x55) MCUCR PUD SM1 SE SM0 ISC11 ISC10 ISC01 ISC00 53
0x34 (0x54) MCUSR – – – – WDRF BORF EXTRF PORF 37
0x33 (0x53) TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 76
0x32 (0x52) TCNT0 Timer/Counter0 (8-bit) 77
0x31 (0x51) OSCCAL – CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 26
0x30 (0x50) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 73
0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1BO – – WGM11 WGM10 104
0x2E (0x4E) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 107
0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High Byte 108
0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low Byte 108
0x2B (0x4B) OCR1AH Timer/Counter1 – Compare Register A High Byte 108
0x2A (0x4A) OCR1AL Timer/Counter1 – Compare Register A Low Byte 108
0x29 (0x49) OCR1BH Timer/Counter1 – Compare Register B High Byte 109
0x28 (0x48) OCR1BL Timer/Counter1 – Compare Register B Low Byte 109
0x27 (0x47) Reserved – – – – – – – –
0x26 (0x46) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 28
0x25 (0x45) ICR1H Timer/Counter1 - Input Capture Register High Byte 109
0x24 (0x44) ICR1L Timer/Counter1 - Input Capture Register Low Byte 109
0x23 (0x43) GTCCR – – – – – – – PSR10 81
0x22 (ox42) TCCR1C FOC1A FOC1B – – – – – – 108
0x21 (0x41) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 42
0x20 (0x40) PCMSK PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 61
0x1F (0x3F) Reserved – – – – – – – –
0x1E (0x3E) EEAR – EEPROM Address Register 16
0x1D (0x3D) EEDR EEPROM Data Register 17
0x1C (0x3C) EECR – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE 17
0x1B (0x3B) PORTA – – – – – PORTA2 PORTA1 PORTA0 58
0x1A (0x3A) DDRA – – – – – DDA2 DDA1 DDA0 58
0x19 (0x39) PINA – – – – – PINA2 PINA1 PINA0 58
0x18 (0x38) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 58
0x17 (0x37) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 58
0x16 (0x36) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 58
0x15 (0x35) GPIOR2 General Purpose I/O Register 2 21
0x14 (0x34) GPIOR1 General Purpose I/O Register 1 21
0x13 (0x33) GPIOR0 General Purpose I/O Register 0 21
0x12 (0x32) PORTD – PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 58
0x11 (0x31) DDRD – DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 58
0x10 (0x30) PIND – PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 58
0x0F (0x2F) USIDR USI Data Register 144
0x0E (0x2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 145
0x0D (0x2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 145
0x0C (0x2C) UDR UART Data Register (8-bit) 129
0x0B (0x2B) UCSRA RXC TXC UDRE FE DOR UPE U2X MPCM 129
0x0A (0x2A) UCSRB RXCIE TXCIE UDRIE RXEN TXEN UCSZ2 RXB8 TXB8 131
0x09 (0x29) UBRRL UBRRH[7:0] 133
0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 149
0x07 (0x27) Reserved – – – – – – – –
0x06 (0x26) Reserved – – – – – – – –
0x05 (0x25) Reserved – – – – – – – –
0x04 (0x24) Reserved – – – – – – – –
0x03 (0x23) UCSRC – UMSEL UPM1 UPM0 USBS UCSZ1 UCSZ0 UCPOL 132
0x02 (0x22) UBRRH – – – – UBRRH[11:8] 133
0x01 (0x21) DIDR – – – – – – AIN1D AIN0D 150
0x00 (0x20) Reserved – – – – – – – –212
2543L–AVR–08/10
ATtiny2313
Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these
registers, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the status flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI
instructions will only operate on the specified bit, and can therefore be used on registers containing such status flags. The
CBI and SBI instructions work with registers 0x00 to 0x1F only.
4. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O
Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. 213
2543L–AVR–08/10
ATtiny2313
Instruction Set Summary
Mnemonics Operands Description Operation Flags #Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1
ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1
ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2
SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1
SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1
SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1
SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1
SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2
AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1
ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1
OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1
ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1
EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1
COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1
NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1
SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1
CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1
INC Rd Increment Rd ← Rd + 1 Z,N,V 1
DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1
TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1
CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1
SER Rd Set Register Rd ← 0xFF None 1
BRANCH INSTRUCTIONS
RJMP k Relative Jump PC ← PC + k + 1 None 2
IJMP Indirect Jump to (Z) PC ← Z None 2
RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3
ICALL Indirect Call to (Z) PC ← Z None 3
RET Subroutine Return PC ← STACK None 4
RETI Interrupt Return PC ← STACK I 4
CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3
CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1
CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1
CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1
SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3
SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3
SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3
SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3
BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2
BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2
BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2
BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2
BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2
BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2
BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2
BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2
BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2
BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2
BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2
BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2
BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2
BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2
BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2
BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2
BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2
BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2
BIT AND BIT-TEST INSTRUCTIONS
SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2
CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2
LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1
LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1
ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1214
2543L–AVR–08/10
ATtiny2313
ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1
ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1
BSET s Flag Set SREG(s) ← 1 SREG(s) 1
BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1
BST Rr, b Bit Store from Register to T T ← Rr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) ← T None 1
SEC Set Carry C ← 1 C1
CLC Clear Carry C ← 0 C 1
SEN Set Negative Flag N ← 1 N1
CLN Clear Negative Flag N ← 0 N 1
SEZ Set Zero Flag Z ← 1 Z1
CLZ Clear Zero Flag Z ← 0 Z 1
SEI Global Interrupt Enable I ← 1 I1
CLI Global Interrupt Disable I ← 0 I 1
SES Set Signed Test Flag S ← 1 S1
CLS Clear Signed Test Flag S ← 0 S 1
SEV Set Twos Complement Overflow. V ← 1 V1
CLV Clear Twos Complement Overflow V ← 0 V 1
SET Set T in SREG T ← 1 T1
CLT Clear T in SREG T ← 0 T 1
SEH Set Half Carry Flag in SREG H ← 1 H1
CLH Clear Half Carry Flag in SREG H ← 0 H 1
DATA TRANSFER INSTRUCTIONS
MOV Rd, Rr Move Between Registers Rd ← Rr None 1
MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1
LDI Rd, K Load Immediate Rd ← K None 1
LD Rd, X Load Indirect Rd ← (X) None 2
LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2
LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2
LD Rd, Y Load Indirect Rd ← (Y) None 2
LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2
LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2
LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2
LD Rd, Z Load Indirect Rd ← (Z) None 2
LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2
LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2
LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2
LDS Rd, k Load Direct from SRAM Rd ← (k) None 2
ST X, Rr Store Indirect (X) ← Rr None 2
ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2
ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2
ST Y, Rr Store Indirect (Y) ← Rr None 2
ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2
ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2
STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2
ST Z, Rr Store Indirect (Z) ← Rr None 2
ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2
ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2
STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2
STS k, Rr Store Direct to SRAM (k) ← Rr None 2
LPM Load Program Memory R0 ← (Z) None 3
LPM Rd, Z Load Program Memory Rd ← (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3
SPM Store Program Memory (Z) ← R1:R0 None -
IN Rd, P In Port Rd ← P None 1
OUT P, Rr Out Port P ← Rr None 1
PUSH Rr Push Register on Stack STACK ← Rr None 2
POP Rd Pop Register from Stack Rd ← STACK None 2
MCU CONTROL INSTRUCTIONS
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep function) None 1
WDR Watchdog Reset (see specific descr. for WDR/timer) None 1
BREAK Break For On-chip Debug Only None N/A
Mnemonics Operands Description Operation Flags #Clocks215
2543L–AVR–08/10
ATtiny2313
Ordering Information
Notes: 1. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging alternative, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive).
Also Halide free and fully Green.
3. For Speed vs. VCC, see Figure 82 on page 180 and Figure 83 on page 180.
4. Code Indicators:
– U: matte tin
– R: tape & reel
Speed (MHz)(3) Power Supply (V) Ordering Code(4) Package(2) Operation Range
10 1.8 - 5.5
ATtiny2313V-10PU
ATtiny2313V-10SU
ATtiny2313V-10SUR
ATtiny2313V-10MU
ATtiny2313V-10MUR
20P3
20S
20S
20M1
20M1
Industrial
(-40°C to +85°C)(1)
20 2.7 - 5.5
ATtiny2313-20PU
ATtiny2313-20SU
ATtiny2313-20SUR
ATtiny2313-20MU
ATtiny2313-20MUR
20P3
20S
20S
20M1
20M1
Industrial
(-40°C to +85°C)(1)
Package Type
20P3 20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
20S 20-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (SOIC)
20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (MLF)216
2543L–AVR–08/10
ATtiny2313
Packaging Information
20P3
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual
Inline Package (PDIP) 20P3 C
1/12/04
PIN
1
E1
A1
B
E
B1
C
L
SEATING PLANE
A
D
e
eB
eC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A – – 5.334
A1 0.381 – –
D 25.493 – 25.984 Note 2
E 7.620 – 8.255
E1 6.096 – 7.112 Note 2
B 0.356 – 0.559
B1 1.270 – 1.551
L 2.921 – 3.810
C 0.203 – 0.356
eB – – 10.922
eC 0.000 – 1.524
e 2.540 TYP
Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). 217
2543L–AVR–08/10
ATtiny2313
20S218
2543L–AVR–08/10
ATtiny2313
20M1
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 20M1 A
10/27/04
2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)
A 0.70 0.75 0.80
A1 – 0.01 0.05
A2 0.20 REF
b 0.18 0.23 0.30
D 4.00 BSC
D2 2.45 2.60 2.75
E 4.00 BSC
E2 2.45 2.60 2.75
e 0.50 BSC
L 0.35 0.40 0.55
SIDE VIEW
Pin 1 ID
Pin #1
Notch
(0.20 R)
BOTTOM VIEW
TOP VIEW
Note: Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D
E
e
A2
A1
A
D2
E2
0.08 C
L
1
2
3
b
1
2
3219
2543L–AVR–08/10
ATtiny2313
Errata The revision in this section refers to the revision of the ATtiny2313 device.
ATtiny2313 Rev C No known errata
ATtiny2313 Rev B • Wrong values read after Erase Only operation
• Parallel Programming does not work
• Watchdog Timer Interrupt disabled
• EEPROM can not be written below 1.9 volts
1. Wrong values read after Erase Only operation
At supply voltages below 2.7 V, an EEPROM location that is erased by the Erase Only operation
may read as programmed (0x00).
Problem Fix/Workaround
If it is necessary to read an EEPROM location after Erase Only, use an Atomic Write operation
with 0xFF as data in order to erase a location. In any case, the Write Only operation can
be used as intended. Thus no special considerations are needed as long as the erased location
is not read before it is programmed.
2. Parallel Programming does not work
Parallel Programming is not functioning correctly. Because of this, reprogramming of the
device is impossible if one of the following modes are selected:
– In-System Programming disabled (SPIEN unprogrammed)
– Reset Disabled (RSTDISBL programmed)
Problem Fix/Workaround
Serial Programming is still working correctly. By avoiding the two modes above, the device
can be reprogrammed serially.
3. Watchdog Timer Interrupt disabled
If the watchdog timer interrupt flag is not cleared before a new timeout occurs, the watchdog
will be disabled, and the interrupt flag will automatically be cleared. This is only applicable in
interrupt only mode. If the Watchdog is configured to reset the device in the watchdog timeout
following an interrupt, the device works correctly.
Problem fix / Workaround
Make sure there is enough time to always service the first timeout event before a new
watchdog timeout occurs. This is done by selecting a long enough time-out period.
4. EEPROM can not be written below 1.9 volts
Writing the EEPROM at VCC below 1.9 volts might fail.
Problem fix / Workaround
Do not write the EEPROM when VCC is below 1.9 volts.
ATtiny2313 Rev A Revision A has not been sampled.220
2543L–AVR–08/10
ATtiny2313
Datasheet
Revision
History
Please note that the referring page numbers in this section refer to the complete document.
Rev. 2543L - 8/10 Added tape and reel part numbers in “Ordering Information” on page 215. Removed text
“Not recommended for new design” from cover page. Fixed literature number mismatch
in Datasheet Revision History.
Rev. 2543K - 03/10
Rev. 2543J - 11/09
Changes from Rev.
2543H-02/05 to
Rev. 2543I-04/06
Changes from Rev.
2543G-10/04 to
Rev. 2543H-02/05
1. Added device Rev C “No known errata” in “Errata” on page 219.
1. Updated template
2. Changed device status to “Not recommended for new designs.”
3. Updated “Stack Pointer” on page 11.
4. Updated Table “Sleep Mode Select” on page 30.
5. Updated “Calibration Byte” on page 160 (to one byte of calibration data)
1. Updated typos.
2. Updated Figure 1 on page 2.
3 Added “Resources” on page 6.
4. Updated “Default Clock Source” on page 23.
5. Updated “128 kHz Internal Oscillator” on page 28.
6. Updated “Power Management and Sleep Modes” on page 30
7. Updated Table 3 on page 23,Table 13 on page 30, Table 14 on page 31,
Table 19 on page 42, Table 31 on page 60, Table 79 on page 176.
8. Updated “External Interrupts” on page 59.
9. Updated “Bit 7..0 – PCINT7..0: Pin Change Enable Mask 7..0” on page
61.
10. Updated “Bit 6 – ACBG: Analog Comparator Bandgap Select” on page
149.
11. Updated “Calibration Byte” on page 160.
12. Updated “DC Characteristics” on page 177.
13. Updated “Register Summary” on page 211.
14. Updated “Ordering Information” on page 215.
15. Changed occurences of OCnA to OCFnA, OCnB to OCFnB and OC1x to
OCF1x.
1. Updated Table 6 on page 25, Table 15 on page 34, Table 68 on page 160
and Table 80 on page 179.
2. Changed CKSEL default value in “Default Clock Source” on page 23 to
8 MHz.221
2543L–AVR–08/10
ATtiny2313
Changes from Rev.
2543F-08/04 to
Rev. 2543G-10/04
Changes from Rev.
2543E-04/04 to
Rev. 2543F-08/04
Changes from Rev.
2543D-03/04 to
Rev. 2543E-04/04
Changes from Rev.
2543C-12/03 to
Rev. 2543D-03/04
3. Updated “Programming the Flash” on page 165, “Programming the
EEPROM” on page 167 and “Enter Programming Mode” on page 163.
4. Updated “DC Characteristics” on page 177.
5. MLF option updated to “Quad Flat No-Lead/Micro Lead Frame
(QFN/MLF)”
1. Updated “Features” on page 1.
2. Updated “Pinout ATtiny2313” on page 2.
3. Updated “Ordering Information” on page 215.
4. Updated “Packaging Information” on page 216.
5. Updated “Errata” on page 219.
1. Updated “Features” on page 1.
2. Updated “Alternate Functions of Port B” on page 53.
3. Updated “Calibration Byte” on page 160.
4. Moved Table 69 on page 160 and Table 70 on page 160 to “Page Size”
on page 160.
5. Updated “Enter Programming Mode” on page 163.
6. Updated “Serial Programming Algorithm” on page 173.
7. Updated Table 78 on page 174.
8. Updated “DC Characteristics” on page 177.
9. Updated “ATtiny2313 Typical Characteristics” on page 181.
10. Changed occurences of PCINT15 to PCINT7, EEMWE to EEMPE and
EEWE to EEPE in the document.
1. Speed Grades changed
- 12MHz to 10MHz
- 24MHz to 20MHz
2. Updated Figure 1 on page 2.
3. Updated “Ordering Information” on page 215.
4. Updated “Maximum Speed vs. VCC” on page 180.
5. Updated “ATtiny2313 Typical Characteristics” on page 181.
1. Updated Table 2 on page 23.
2. Replaced “Watchdog Timer” on page 39.
3. Added “Maximum Speed vs. VCC” on page 180.
4. “Serial Programming Algorithm” on page 173 updated.
5. Changed mA to µA in preliminary Figure 136 on page 207.
6. “Ordering Information” on page 215 updated.
MLF package option removed222
2543L–AVR–08/10
ATtiny2313
Changes from Rev.
2543B-09/03 to
Rev. 2543C-12/03
Changes from Rev.
2543A-09/03 to
Rev. 2543B-09/03
7. Package drawing “20P3” on page 216 updated.
8. Updated C-code examples.
9. Renamed instances of SPMEN to SELFPRGEN, Self Programming
Enable.
1. Updated “Calibrated Internal RC Oscillator” on page 25.
1. Fixed typo from UART to USART and updated Speed Grades and Power
Consumption Estimates in “Features” on page 1.
2. Updated “Pin Configurations” on page 2.
3. Updated Table 15 on page 34 and Table 80 on page 179.
4. Updated item 5 in “Serial Programming Algorithm” on page 173.
5. Updated “Electrical Characteristics” on page 177.
6. Updated Figure 82 on page 180 and added Figure 83 on page 180.
7. Changed SFIOR to GTCCR in “Register Summary” on page 211.
8. Updated “Ordering Information” on page 215.
9. Added new errata in “Errata” on page 219.i
2543L–AVR–08/10
ATtiny2313
Table of Contents
Features 1
Pin Configurations 2
General Information 6
Resources 6
Code Examples 6
Disclaimer 6
AVR CPU Core 7
Introduction 7
Architectural Overview 7
ALU – Arithmetic Logic Unit 8
Status Register 8
General Purpose Register File 9
Instruction Execution Timing 11
Reset and Interrupt Handling 12
AVR ATtiny2313 Memories 14
In-System Reprogrammable Flash Program Memory 14
EEPROM Data Memory 16
I/O Memory 20
System Clock and Clock Options 22
Clock Systems and their Distribution 22
Clock Sources 23
Default Clock Source 23
Crystal Oscillator 23
Calibrated Internal RC Oscillator 25
System Clock Prescalar 28
Power Management and Sleep Modes 30
Idle Mode 30
Power-down Mode 31
Standby Mode 31
Minimizing Power Consumption 31
System Control and Reset 33
Interrupts 44
Interrupt Vectors in ATtiny2313 44
I/O-Ports 46
Introduction 46ii
2543L–AVR–08/10
ATtiny2313
Ports as General Digital I/O 47
Alternate Port Functions 51
External Interrupts 59
Pin Change Interrupt Timing 59
8-bit Timer/Counter0 with PWM 62
Overview 62
Timer/Counter Clock Sources 63
Counter Unit 63
Output Compare Unit 64
Compare Match Output Unit 65
Modes of Operation 66
Timer/Counter Timing Diagrams 71
Timer/Counter0 and Timer/Counter1 Prescalers 80
16-bit Timer/Counter1 82
Overview 82
Accessing 16-bit Registers 84
Counter Unit 88
Input Capture Unit 89
Output Compare Units 90
Modes of Operation 94
USART 111
Overview 111
Clock Generation 112
Frame Formats 115
USART Initialization 116
Asynchronous Data Reception 124
Universal Serial Interface – USI 138
Overview 138
Functional Descriptions 139
Alternative USI Usage 144
USI Register Descriptions 144
Analog Comparator 149
debugWIRE On-chip Debug System 151
Features 151
Overview 151
Physical Interface 151
Software Break Points 152
Limitations of debugWIRE 152iii
2543L–AVR–08/10
ATtiny2313
debugWIRE Related Register in I/O Memory 152
Self-Programming the Flash 153
Memory Programming 158
Program And Data Memory Lock Bits 158
Signature Bytes 160
Calibration Byte 160
Page Size 160
Parallel Programming Parameters, Pin Mapping, and Commands 161
Serial Programming Pin Mapping 163
Parallel Programming 163
Serial Downloading 172
External Clock Drive 179
ATtiny2313 Typical Characteristics 181
Errata 219
ATtiny2313 Rev C 219
ATtiny2313 Rev B 219
ATtiny2313 Rev A 219
Datasheet Revision History 220
Rev. 2543L - 8/10 220
Rev. 2543K - 03/10 220
Rev. 2543J - 11/09 220
Changes from Rev. 2543H-02/05 to Rev. 2543I-04/06 220
Changes from Rev. 2543G-10/04 to Rev. 2543H-02/05 220
Changes from Rev. 2543F-08/04 to Rev. 2543G-10/04 221
Changes from Rev. 2543E-04/04 to Rev. 2543F-08/04 221
Changes from Rev. 2543D-03/04 to Rev. 2543E-04/04 221
Changes from Rev. 2543C-12/03 to Rev. 2543D-03/04 221
Changes from Rev. 2543B-09/03 to Rev. 2543C-12/03 222
Changes from Rev. 2543A-09/03 to Rev. 2543B-09/03 2222543L–AVR–08/10
Headquarters International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Unit 1-5 & 16, 19/F
BEA Tower, Millennium City 5
418 Kwun Tong Road
Kwun Tong, Kowloon
Hong Kong
Tel: (852) 2245-6100
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054 Saint-Quentin-enYvelines
Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Product Contact
Web Site
www.atmel.com
Technical Support
avr@atmel.com
Sales Contact
www.atmel.com/contacts
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS
OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL
DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2010 Atmel Corporation. All rights reserved. Atmel®, Atmel logo and combinations thereof, AVR® and others are registered trademarks or
trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
AVR172: Sensorless Commutation of Brushless
DC Motor (BLDC) using ATmega32M1 and
ATAVRMC320
Features
• Robust sensorless commutation control
• Ramp-up sequence
References
[1] ATmega32M1 Data sheet
[2] AVR194: Brushless DC Motor Control using ATmega32M1
[3] AVR430: MC300 Hardware User Guide
[4] AVR470: MC310 User Guide
[5] AVR471: MC320 Getting Started Guide
[6] AVR928: Sensorless methods to drive BLDC motors
1 Introduction
This application note describes how to implement a sensorless commutation of
BLDC motors with the ATAVRMC320 development kit.
The ATmega32M1 is equipped with integrated peripherals that reduce the number
of external components required in a BLDC application. The ATmega32M1 is
suitable for sensorless commutation and for commutation with Hall sensors as well,
but this application note focuses on the sensorless commutation.
The AVR928 Application Note describes the theory of the sensorless control
method and must be carefully read first.
8-bit Microcontrollers
Application Note
Rev. 8306B-AVR-05/10 2 AVR172
8306B-AVR-05/10
2 Hardware
The hardware includes the ATAVRMC310 and ATAVRMC300 boards which are the
two parts of the ATAVRMC320 Starter kit.
Please refer to the ATAVRMC300 and ATAVRMC310 user guides :
- AVR430: MC300 Hardware User Guide
- AVR470: MC310 Hardware User Guide
2.1 MC310 jumpers setting
The AVR172 firmware has been developed with the following jumper settings:
Table 2-1.ATAVRMC310 jumpers setting for sensorless control
Designator Setting Function
J5 Vm connect PB4 to Vm’ (motor voltage measurement if necessary)
J6 PFC OC Connect to overcurrent signal
J7 none used by CAN applications
J8 ShCo connect PC5 to ShCo for current measurement
J9 GNDm connect PC4 to GNDm for current measurement
J12 TxD connect PD3 to the RS232 driver
MOSI A Connect PD3 to ISP connector (for ISP use)
RxDUSB Connect PD3 to RxD1 (for USB interface use)
J13 RxD connect PD4 to the RS232 driver
SCK Connect PD3 to ISP connector (for ISP use)
TxDUSB Connect PD3 to RxD1 (for USB interface use)
J15 none used by CAN application to add a termination resistor
J21 Cmp- connect ACMP0- to V+W bemf conditioning
J22 Cmp+ connect ACMP0+ to U bemf conditioning
J23 Cmp- connect ACMP1- to U+W bemf conditioning
J24 Cmp+ connect ACMP1+ to V bemf conditioning
J25 Cmp- connect ACMP2- to U+V bemf conditioning
J26 Cmp+ connect ACMP2+ to W bemf conditioning
J28 VCC supply the on board USB dongle from the board power supply
See also following picture of MC310 Jumpers configurations : AVR172
3
8306B-AVR-05/10
Figure 1. MC310 Jumpers configuration
2.2 MC300 jumper settings
Table 2-1. ATAVRMC300 jumpers setting for sensorless control
Designator Setting Function
J2 none provide +5V to supply the ATAVRMC310 board
On ATAVRMC300, Vm and Vin connectors can be supplied from the same +12V/7A
power supply. Nevertheless a separate +12V/1A can also be used to supply the Vin
(processor supply voltage).
2.3 Power-supply
This firmware example has been configured according to a power-supply Vm=12V.
This power-supply must be able to provide up to 4A output current.
2.4 Motor
The BLDC motor provided inside MC320 and MC300 Motor Control Kit has the
following characteristics:
Manufacturer : TECMOTION
Number of phases : 3
Number of poles : 8 (4 pairs)
Rated voltage : 24V
Rated speed : 4000 rpm
Rated torque : 62.5 Nm
Torque constant : 35 Nm/A = k_tau4 AVR172
8306B-AVR-05/10
Line to Line Resistance : 1.8 ohm = R
Back EMF : 3.66 V/Krpm = k_e
Peak current : 5.4A
As Vm=12V, the rated speed will be 2000 rpm.
2.5 ATmega32M1 Configuration
ATmega32M1 must be programmed to run at 16MHz using PLL (set corresponding
Fuse bits).
The CKDIV8 fuse must be disabled.
Extended/High/Low Fuses configurations are : FF/DF/F3
2.6 Technical Advices
2.6.1 Disconnecting the BLDC Motor
The BLDC motor must not be disconnected while it is running or while its coils carry
current. It is allowed to disconnect a BLDC motor if the PWM duty cycle is 0% and the
rotor is at rest so that no current is driven through the coils. Be careful, when stopping
the power supply or PWM, a BLDC motor with a high moment of inertia is able to run
for a relatively long time.
2.6.2 Ground and Power Wirings
One design its own board has to take care of the ground wiring and power wiring. The
power supply of the processor and additional signal conditioning components (e.g.
additional fast comparators, operational amplifiers, …) has to be decoupled from the
motor power supply. The ground connection has to be of low resistance and low
inductance to prevent against voltage drop and noise due to high currents. A ground
plane within a multi layer PCB is recommended for proper operation.
3 Firmware
The example firmware is based on the Sensorless method described in AVR928
Application Note.
It is operating in sensorless mode using the ATmega32M1 internal comparators. Hall
sensor wires of the BLDC motor of the kit can remain unconnected.
The source file directory embeds an html documentation which can be opened
through the readme.html file.
The theory of the different tasks has been detailed in AVR928. The application to
ATmega32M1 is detailed in following sections.
3.1 Main Flow chart
The firmware main flowchart is described below : AVR172
5
8306B-AVR-05/10
Figure 2. Main flow chart
The tasks are scheduled thanks to the g_tick produced each 1.024ms with Timer0. 6 AVR172
8306B-AVR-05/10
3.2 MS_ALIGN phase
The ALIGN phase forces the motor at a specific position. The time of this phase is
controlled with ALIGN_TIME constant which is the ru_period_counter initial value
(200 for MC310 motor).
3.3 RAMP_UP phase
The ramp-up charateristics (duty-cycles and times) are stored in two tables:
• ramp_up_duty_table[] : which provides the duty_cycle of the step
• ramp_up_time_table[] : which provides the length of the step (ru_step_length)
These two tables are specific to the motor and the application.
The scanning of the step sequences and the monitoring of the step length are
achieved thanks to three independant counters :
- ru_step_length_cntr : which counts the commutation time (up to ru_step_length
variable)
- ru_period_counter : which counts the step length (up to RAMP_UP_PERIOD
constant)
- ramp_up_index : which counts the step numbers (up to
RAMP_UP_INDEX_MAX constant)
The figure below provides a waveform of steps timing :
Figure 3. Steps timing AVR172
7
8306B-AVR-05/10
3.3.1 Time of steps
The step time is RAMP_UP_PERIOD = 50ms.
3.3.2 Number of steps
The parameter : RAMP_UP_INDEX_MAX = 9, defines 10 steps ramp up.
3.3.3 Parameters tables
In firmware example, the tables have been defined according to the characteristics of
the motor provided in the kit (see parameters in 2.4 Motor section) :
ramp_up_time_table[] = {26,23,20,17,14,11,8,5,3,2,2};
ramp_up_duty_table[] = {122,124,126,129,131,133,135,137,140,143,145};
3.3.4 Sp1/pwm1
The usual parameters described in AVR928 Application Note are:
• Pwm1 = 50%
• Sp1 = Sp_max/60
The parameters defined with MC310 Tecmotion motor are:
• Pwm1 = 48% (= 122/256)
• Sp1 :
Sp1 is defined thanks to the initialization value of ru_step_length :
ru_step_length = RAMP_UP_STEP_MAX = 40
This variable determines one commutation each 40ms.
So an electrical rotation time is 120ms. As the motor has 4 pairs of poles, the
mechanical rotation time is 480ms. So the rotation speed is 60/0.48 = 125 rpm.
So Sp1 = Sp_max/32.
The second value of ru_step_length is 26 in the time table. It defines the following
commutation time.
3.3.5 Sp2/pwm2
The theorical parameters described in AVR928 Application Note are:
• Pwm2 = 60%
• Sp2 = Sp_max/6 = Sp1 / 10
The parameters defined with Tecmotion motor are:
• Pwm2 = 57% (= 145/256)
• Sp2 :
Sp2 is defined thanks to the last value of ru_step_length : 2
This variable determines one commutation each 4ms.
So an electrical rotation time is 12ms. As the motor has 4 pairs of poles, the
mechanical rotation time is 48ms. So the rotation speed is 60/0.048 = 1250 rpm.
So Sp2 = Sp_max/3.2. 8 AVR172
8306B-AVR-05/10
This confirms also the usual ratio = 10 between Sp1 and Sp2 which is defined in
AVR498 Application Note.
3.4 LAST_RAMP_UP phase
To avoid a shorten last step, this phase monitors the last ramp-up step to guarantee it
is ended properly before running in closed loop.
3.5 RUNNING Phase
3.5.1 Closed-loop block diagram
The Running phase is a sensorless closed loop which block diagram is following :
Figure 4. Closed-loop block diagram AVR172
9
8306B-AVR-05/10
3.5.2 Running flowchart
The flowchart is following :
Figure 5. Closed-loop flowchart
•
Motor_state is kept equal to MS_RUNNING
mci_set_ref_speed() function updates the speed setpoint according to the
potentiometer adjustment or the speed command received on serial transmission.
In mc_regulation_loop() function, duty_cycle_reference is the duty_cycle variable
which controls the PWM generator. This variable is the result of following functions :
• In OPEN_LOOP:
mci_set_ref_speed() function
• In SPEED_LOOP: 10 AVR172
8306B-AVR-05/10
mc_control_speed(2*mci_get_ref_speed())
duty-cycle_reference is calculated from ref_speed and from
monitored mci_get_measured_speed()
measured_speed = (KSPEED * 4) / mci_measured_period
with mci_measured_period calculated in the Interrupt vector of
Analog Comparator 1. This interrupt uses Timer 0 to compute the
period.
• In CURRENT_LOOP :
mc_control_current(mc_get_potentiometer_value()
3.5.3 Sensorless Detection and Commutation Management
The analog comparators 0, 1 and 2 are used to detect the zero crossing of the U, V
and W phases.
The timer 1 is used to monitor the time between two consecutive zero crossings. This
time corresponds to one sector of the electrical rotation of the motor. It equals 60° of
the entire electrical period of the motor.
When a zero crossing event occurs, the timer 1 value is stored. Then this value is
divided by 2 (providing the 30° time) and loaded into the Compare A register of timer
1. Then this value is added to the half of itself to provide the 45° time and loaded into
the Compare B register of timer 1.
The timer 1 compare A event occurs 30° after the zero crossing. It activates the next
commutation state and masks the zero crossing to avoid the discharge of the
inductance (demagnetization) pulse generated at the end of a step when the active
switches are released.
Due to the inductance of the motor coils, a voltage equals to -Ldi/dt is generated, the
demagnetization is done through the diodes of the power bridge.
The timer 1 compare B event releases the zero crossing mask : enables the
comparator n interrupt according to the motor_step variable. This Timer1 interrupt
provides the demagnetization mask delay. AVR172
11
8306B-AVR-05/10
4 RS232 Communication with firmware
4.1 Connecting ATAVRMC310 to use the RS232 interface
Connect PC com port to the ATAVRMC310 RS232 connector through a direct cable.
The serial configuration is:
• 38400 bauds,
• 8 bit data bit,
• 1 stop bit,
• no handshake,
4.2 PC applications
User can communicate with firmware through RS232 with usual PC serial
communication applications (i.e. Hyperterminal) or the Atmel “Motor Control Center”
application which can be downloaded from Atmel web at url : http://www.atmel.com
4.2.1 PC Terminal : RS232 Messages and Commands
At power up the following welcome message is received on terminal :
“ATMEL Motor Control Interface”.
The following commands can be sent to the firmware:
Table 2-1. List of commands
Command Action
ru Run motor
st Stop Motor
help Gives help
fw Set direction to Forward
bw Set direction to Backward
ss Set Speed (followed with speed value)
gi Get ID
g0 Get Status 0
g1 Get Status 1
4.2.2 Motor Control Center
The User Guide is available in Install directory at URL :
C:\Program Files\Atmel\Motor Control Center\help\Overview.htm
The AVR172 Target must be selected first to get the right configuration :
To select a target, execute the File > Select Target command or click the
button in the toolbar. The following dialog pops up: 12 AVR172
8306B-AVR-05/10
Figure 6. Motor Control Center Interface
5 USB communication
Communication can be achieved from PC to USB connector of MC310 board.
The AVR470, MC310 Hardware User Guide details the configuration to be achieved.
Communication port becomes a Virtual Com port. Same tools as described in section
4 (RS232 Communication with firmware), can be used through this Virtual Com port. 8306B-AVR-05/10
Disclaimer
Headquarters International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Unit 1-5 & 16, 19/F
BEA Tower, Millennium City 5
418 Kwun Tong Road
Kwun Tong, Kowloon
Hong Kong
Tel: (852) 2245-6100
Fax: (852) 2722-1369
Product Contact
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054 Saint-Quentin-enYvelines
Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Web Site
http://www.atmel.com/
Technical Support
avr@atmel.com
Sales Contact
www.atmel.com/contacts
Literature Request
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND
CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED
OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT,
CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS,
BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the
contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any
commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in,
automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.
© 2010 Atmel Corporation. All rights reserved. Atmel®
, Atmel logo and combinations thereof, AVR®
, AVR®
logo and others, are the
registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
1. Product profile
1.1 General description
NPN/NPN general-purpose transistor pair in a small SOT457 (SC-74) Surface-Mounted
Device (SMD) plastic package.
1.2 Features
■ Low collector capacitance
■ Low collector-emitter saturation voltage
■ Closely matched current gain
■ Reduces number of components and board space
■ No mutual interference between the transistors
■ AEC-Q101 qualified
1.3 Applications
■ General-purpose switching and amplification
1.4 Quick reference data
BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
Rev. 01 — 17 July 2009 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
VCEO collector-emitter voltage open base - - 65 V
IC collector current - - 100 mA
hFE DC current gain VCE = 5 V; IC = 2 mA 200 300 450BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 2 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 emitter TR1
2 base TR1
3 collector TR2
4 emitter TR2
5 base TR2
6 collector TR1
1 3 2
6 5 4
sym020
1 2 3
6 5
TR1
TR2
4
Table 3. Ordering information
Type number Package
Name Description Version
BC846DS SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 4. Marking codes
Type number Marking code
BC846DS ZK
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
VCBO collector-base voltage open emitter - 80 V
VCEO collector-emitter voltage open base - 65 V
VEBO emitter-base voltage open collector - 6 V
IC collector current - 100 mA
ICM peak collector current single pulse;
tp ≤ 1 ms
- 200 mA
IBM peak base current single pulse;
tp ≤ 1 ms
- 200 mA
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW
Per device
Ptot total power dissipation Tamb ≤ 25 °C [1] - 380 mWBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 3 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve SOT457 (SC-74)
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Tamb (°C)
−75 175 −25 25 75 125
006aab621
200
300
100
400
500
Ptot
(mW)
0
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point
- - 250 K/W
Per device
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 328 K/WBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 4 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
7. Characteristics
FR4 PCB, standard footprint
Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
006aab622
10−5 10 10 −2 10−4 102 10−1
tp (s)
10−3 103 1
102
10
103
Zth(j-a)
(K/W)
1
δ = 1
0.75
0.50
0.33
0.10
0.05
0.02
0.01
0
0.20
Table 7. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
ICBO collector-base cut-off
current
VCB = 50 V; IE = 0 A - - 15 nA
VCB = 30 V; IE = 0 A;
Tj = 150 °C
--5 µA
IEBO emitter-base cut-off
current
VEB = 6 V; IC = 0 A - - 100 nA
hFE DC current gain VCE =5V
IC = 10 µA - 280 -
IC = 2 mA 200 300 450
VCEsat collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA - 55 100 mV
IC = 100 mA; IB = 5 mA - 200 300 mV
VBEsat base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA - 755 850 mV
IC = 100 mA; IB = 5 mA - 1000 - mV
VBE base-emitter voltage VCE =5V
IC = 2 mA 580 650 700 mV
IC = 10 mA - - 770 mVBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 5 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
Cc collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
- 1.9 - pF
Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A;
f = 1 MHz
- 11 - pF
fT transition frequency VCE = 5 V; IC = 10 mA;
f = 100 MHz
100 - - MHz
NF noise figure VCE = 5 V; IC = 0.2 mA;
RS =2kΩ;
f = 10 Hz to 15.7 kHz
- 1.9 - dB
VCE = 5 V; IC = 0.2 mA;
RS =2kΩ; f = 1 kHz;
B = 200 Hz
- 3.1 - dB
Table 7. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCE =5V
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Tamb = 25 °C
Fig 3. Per transistor: DC current gain as a function of
collector current; typical values
Fig 4. Per transistor: Collector current as a function
of collector-emitter voltage; typical values
006aaa533
200
400
600
hFE
0
IC (mA)
10−2 103 102 10−1 1 10
(3)
(1)
(2)
006aaa532
VCE (V)
0 10 2 4 6 8
0.08
0.12
0.04
0.16
0.20
IC
(A)
0
IB (mA) = 4.50
2.70
3.15
4.05
3.60
0.45
0.90
1.35
1.80
2.25BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 6 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
VCE = 5 V; Tamb = 25 °C IC/IB = 20
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 5. Per transistor: Base-emitter voltage as a
function of collector current; typical values
Fig 6. Per transistor: Base-emitter saturation voltage
as a function of collector current; typical
values
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
VCE = 5 V; Tamb = 25 °C
Fig 7. Per transistor: Collector-emitter saturation
voltage as a function of collector current;
typical values
Fig 8. Per transistor: Transition frequency as a
function of collector current; typical values
006aaa536
0.6
0.8
1
VBE
(V)
0.4
IC (mA)
10−1 103 102 1 10
006aaa534
IC (mA)
10−1 103 102 1 10
0.5
0.9
1.3
0.3
0.7
1.1
VBEsat
(V)
0.1
(1)
(2)
(3)
006aaa535
1
10−1
10
VCEsat
(V)
10−2
IC (mA)
10−1 103 102 1 10
(1)
(2)
(3)
006aaa537
IC (mA)
1 102 10
102
103
fT
(MHz)
10BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 7 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
f = 1 MHz; Tamb = 25 °C f = 1 MHz; Tamb = 25 °C
Fig 9. Per transistor: Collector capacitance as a
function of collector-base voltage; typical
values
Fig 10. Per transistor: Emitter capacitance as a
function of emitter-base voltage; typical values
VCB (V)
0 10 2 4 6 8
006aab620
2
4
6
Cc
(pF)
0
006aaa539
VEB (V)
0 6 2 4
9
11
7
13
15
Ce
(pF)
5BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 8 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
Fig 11. Package outline SOT457 (SC-74)
Dimensions in mm 04-11-08
3.0
2.5
1.7
1.3
3.1
2.7
pin 1 index
1.9
0.26
0.10
0.40
0.25 0.95
1.1
0.9
0.6
0.2
1 3 2
6 5 4
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BC846DS SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 9 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
11. Soldering
Fig 12. Reflow soldering footprint SOT457 (SC-74)
Fig 13. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
sot457_fr
3.45
1.95
3.3 2.825
0.45
(6×)
0.55
(6×)
0.7
(6×)
0.8
(6×)
2.4
0.95
0.95
Dimensions in mm
sot457_fw
5.3
5.05
1.45
(6×)
0.45
(2×)
1.5
(4×)
2.85
1.475
1.475
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mmBC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 10 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BC846DS_1 20090717 Product data sheet - -BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 11 of 12
NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BC846DS
65 V, 100 mA NPN/NPN general-purpose transistor
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 July 2009
Document identifier: BC846DS_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 8
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information. . . . . . . . . . . . . . . . . . . . . 11
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead
Surface-Mounted Device (SMD) plastic package.
1.2 Features
■ Average forward current: IF(AV) ≤ 1 A
■ Reverse voltage: VR ≤ 30 V
■ Low forward voltage
■ High power capability due to clip-bond technology
■ AEC-Q101 qualified
■ Small and flat lead SMD plastic package
1.3 Applications
■ Low voltage rectification
■ High efficiency DC-to-DC conversion
■ Switch Mode Power Supply (SMPS)
■ Reverse polarity protection
■ Low power consumption applications
1.4 Quick reference data
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
Rev. 01 — 30 December 2008 Product data sheet
Table 1. Quick reference data
Tj = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IF(AV) average forward current square wave;
δ = 0.5;
f = 20 kHz
Tamb ≤ 130 °C [1] - - 1A
Tsp ≤ 145 °C - - 1A
VR reverse voltage - - 30 V
VF forward voltage IF = 1 A - 320 360 mV
IR reverse current VR = 30 V - 0.6 1.5 mAPMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 2 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode [1]
2 anode 1 2
sym001
1 2
Table 3. Ordering information
Type number Package
Name Description Version
PMEG3010EP - plastic surface-mounted package; 2 leads SOD128
Table 4. Marking codes
Type number Marking code
PMEG3010EP A1
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VR reverse voltage Tj = 25 °C - 30 V
IF(AV) average forward current square wave;
δ = 0.5;
f = 20 kHz
Tamb ≤ 130 °C [1] - 1A
Tsp ≤ 145 °C - 1A
IFSM non-repetitive peak
forward current
square wave;
tp = 8 ms
[2] - 50 A
Ptot total power dissipation Tamb ≤ 25 °C [3][4] - 625 mW
[3][5] - 1050 mW
[3][1] - 2100 mWPMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 3 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
[1] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[2] Tj = 25 °C prior to surge.
[3] Reflow soldering is the only recommended soldering method.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[6] Soldering point of cathode tab.
Tj junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
in free air [1][2]
[3] - - 200 K/W
[4] - - 120 K/W
[5] - - 60 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[6] - - 12 K/WPMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 4 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
FR4 PCB, standard footprint
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab296
10
1
102
103
Zth(j-a)
(K/W)
10−1
tp (s)
10−3 102 103 10 1 10 −2 10−1
duty cycle =
1
0.75
0.5
0.33
0.25 0.2
0.1
0.05
0.02 0.01
0
006aab297
10
1
102
103
Zth(j-a)
(K/W)
10−1
tp (s)
10−3 102 103 10 1 10 −2 10−1
duty cycle =
1
0.75
0.5
0.33 0.25
0.2
0.1
0.05
0.02 0.01
0PMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 5 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
7. Characteristics
Ceramic PCB, Al2O3, standard footprint
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab298
10
1
102
103
Zth(j-a)
(K/W)
10−1
tp (s)
10−3 102 103 10 1 10 −2 10−1
duty cycle =
1
0.75
0.5 0.33
0.25 0.2
0.1
0.05
0.02 0.01
0
Table 7. Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VF forward voltage IF = 0.1 A - 230 260 mV
IF = 0.5 A - 280 310 mV
IF = 1 A - 320 360 mV
IR reverse current VR = 5 V - 55 - µA
VR = 30 V - 0.6 1.5 mA
Cd diode capacitance f = 1 MHz
VR = 1 V - 170 - pF
VR = 10 V - 60 - pFPMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 6 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = −40 °C
Fig 4. Forward current as a function of forward
voltage; typical values
Fig 5. Reverse current as a function of reverse
voltage; typical values
f = 1 MHz; Tamb = 25 °C
Fig 6. Diode capacitance as a function of reverse voltage; typical values
006aab299
10−2
10−3
1
10−1
10
IF
(A)
10−4
VF (V)
0 0.8 0.2 0.4 0.6
(1)
(2)
(3) (4) (5)
006aab300
VR (V)
0 30 10 20
1
10−1
10−2
10−3
10−4
10−5
10−6
IR
(A)
10−7
(1)
(2)
(3)
(4)
VR (V)
0 30 10 20
006aab301
100
200
300
Cd
(pF)
0PMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 7 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Tj = 125 °C
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig 7. Average forward power dissipation as a
function of average forward current; typical
values
Fig 8. Average reverse power dissipation as a
function of reverse voltage; typical values
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
FR4 PCB, mounting pad for cathode 1 cm2
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 9. Average forward current as a function of
ambient temperature; typical values
Fig 10. Average forward current as a function of
ambient temperature; typical values
006aab302
IF(AV) (A)
0 1.5 0.5 1
0.2
0.1
0.3
0.4
PF(AV)
(W)
0
(1) (2)
(3)
(4)
VR (V)
0 30 10 20
006aab303 3.5
PR(AV)
(W)
0
0.5
1
1.5
2
2.5
3
(1)
(2)
(3)
(4)
Tamb (°C)
0 75 25 150 50 100 125 175
006aab304
0.8
0.4
1.2
1.6
IF(AV)
(A)
0
(1)
(2)
(3)
(4)
Tamb (°C)
0 75 25 150 50 100 125 175
006aab305
0.8
0.4
1.2
1.6
IF(AV)
(A)
0
(1)
(2)
(3)
(4)PMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 8 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 11. Average forward current as a function of
ambient temperature; typical values
Fig 12. Average forward current as a function of
solder point temperature; typical values
Tamb (°C)
0 75 25 150 50 100 125 175
006aab306
0.8
0.4
1.2
1.6
IF(AV)
(A)
0
(1)
(2)
(3)
(4)
Tsp (°C)
0 75 25 150 50 100 125 175
006aab307
0.8
0.4
1.2
1.6
IF(AV)
(A)
0
(1)
(2)
(3)
(4)PMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 9 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
8. Test information
The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are
calculated according to the equations: with IM defined as peak current,
at DC, and with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
Fig 13. Duty cycle definition
t1
t2
P
t
006aaa812
duty cycle δ =
t1
t2
IF AV ( ) = IM × δ
IRMS IF AV ( ) = IRMS = IM × δ
Fig 14. Package outline SOD128
Dimensions in mm 07-09-12
1.1
0.9
0.22
0.10
0.6
0.3
5.0
4.4
4.0
3.6
1.9
1.6
2.7
2.3
1
2PMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 10 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000
PMEG3010EP SOD128 4 mm pitch, 12 mm tape and reel -115
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOD128
solder lands
solder resist
occupied area
solder paste
3.4 2.5 2.1
(2×)
1.9
(2×)
4.4
4.2
6.2
1.2
(2×)
1.4
(2×) sod128_fr
Dimensions in mmPMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 11 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMEG3010EP_1 20081230 Product data sheet - -PMEG3010EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 30 December 2008 12 of 13
NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors PMEG3010EP
1 A low VF MEGA Schottky barrier rectifier
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 December 2008
Document identifier: PMEG3010EP_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Packing information. . . . . . . . . . . . . . . . . . . . . 10
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Contact information. . . . . . . . . . . . . . . . . . . . . 12
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1. Product profile
1.1 General description
Planar Schottky barrier single diode with an integrated guard ring for stress protection,
encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device
(SMD) plastic package.
1.2 Features
■ Low forward voltage
■ Very small and flat lead SMD plastic package
■ Low capacitance
■ Flat leads: excellent coplanarity and improved thermal behavior
1.3 Applications
■ Voltage clamping
■ Line termination
■ Reverse polarity protection
1.4 Quick reference data
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
BAT54J
Schottky barrier single diode
Rev. 01 — 8 March 2007 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IF forward current - - 200 mA
VR reverse voltage - - 30 V
VF forward voltage IF = 1 mA [1] - - 320 mVBAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 2 of 8
NXP Semiconductors BAT54J
Schottky barrier single diode
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
Table 2. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode 1 2
sym001
1 2
Table 3. Ordering information
Type number Package
Name Description Version
BAT54J SC-90 plastic surface-mounted package; 2 leads SOD323F
Table 4. Marking codes
Type number Marking code
BAT54J AP
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VR reverse voltage - 30 V
IF forward current - 200 mA
IFRM repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5 - 300 mA
IFSM non-repetitive peak forward
current
square wave;
tp < 10 ms
- 600 mA
Ptot total power dissipation Tamb ≤ 25 °C [1] - 550 mW
Tj junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °CBAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 3 of 8
NXP Semiconductors BAT54J
Schottky barrier single diode
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
in free air [1][2] - - 230 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[3] - - 55 K/W
Table 7. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VF forward voltage [1]
IF = 0.1 mA - - 240 mV
IF = 1 mA - - 320 mV
IF = 10 mA - - 400 mV
IF = 30 mA - - 500 mV
IF = 100 mA - - 800 mV
IR reverse current VR = 25 V - - 2 µA
Cd diode capacitance VR = 1 V; f = 1 MHz - - 10 pFBAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 4 of 8
NXP Semiconductors BAT54J
Schottky barrier single diode
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
Tamb = 25 °C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
103
102
10−1
IF
(mA)
VF (V)
10
1
0 0.4 0.8 1.2
msa892
(1) (2) (3)
(1) (2) (3)
0 10 20 30 VR (V)
103
102
10−1
IR
(µA)
10
1
(1)
(2)
(3)
msa893
0 10 20 30
0
5
10
15
VR (V)
Cd
(pF)
msa891BAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 5 of 8
NXP Semiconductors BAT54J
Schottky barrier single diode
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
Fig 4. Package outline SOD323F (SC-90)
Dimensions in mm 04-09-13
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BAT54J SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD323F (SC-90)
001aab169
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.95 0.50
solder lands
solder resist
occupied area
solder pasteBAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 6 of 8
NXP Semiconductors BAT54J
Schottky barrier single diode
11. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAT54J_1 20070308 Product data sheet - -BAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 7 of 8
NXP Semiconductors BAT54J
Schottky barrier single diode
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.NXP Semiconductors BAT54J
Schottky barrier single diode
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 March 2007
Document identifier: BAT54J_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 5
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Contact information. . . . . . . . . . . . . . . . . . . . . . 7
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
FUJITSU SEMICONDUCTOR
DATA SHEET
Copyright©2012-2013 FUJITSU SEMICONDUCTOR LIMITED All rights reserved
2013.2
Memory FRAM
128K (16 K × 8) Bit SPI
MB85RS128B
■ DESCRIPTION
MB85RS128B is a FRAM (Ferroelectric Random Access Memory) chip in a configuration of 16,384
words × 8 bits, using the ferroelectric process and silicon gate CMOS process technologies for forming the
nonvolatile memory cells.
MB85RS128B adopts the Serial Peripheral Interface (SPI).
The MB85RS128B is able to retain data without using a back-up battery, as is needed for SRAM.
The memory cells used in the MB85RS128B can be used for 1012 read/write operations, which is a significant
improvement over the number of read and write operations supported by Flash memory and E2PROM.
MB85RS128B does not take long time to write data like Flash memories or E2PROM, and MB85RS128B
takes no wait time.
■ FEATURES
• Bit configuration : 16,384 words × 8 bits
• Serial Peripheral Interface : SPI (Serial Peripheral Interface)
Correspondent to SPI mode 0 (0, 0) and mode 3 (1, 1)
• Operating frequency : All commands except READ 33 MHz (Max)
READ command 25 MHz (Max)
• High endurance : 1012 times / byte
• Data retention : 10 years ( + 85 °C), 95 years ( + 55 °C), over 200 years ( + 35 °C)
• Operating power supply voltage : 2.7 V to 3.6 V
• Low power consumption : Operating power supply current 6 mA (Typ @33 MHz)
Standby current 9 μA (Typ)
• Operation ambient temperature range : − 40 °C to + 85 °C
• Package : 8-pin plastic SOP (FPT-8P-M02)
RoHS compliant
DS501-00020-2v0-EMB85RS128B
2 DS501-00020-2v0-E
■ PIN ASSIGNMENT
■ PIN FUNCTIONAL DESCRIPTIONS
Pin No. Pin Name Functional description
1 CS
Chip Select pin
This is an input pin to make chips select. When CS is the “H” level, device is in deselect
(standby) status and SO becomes High-Z. Inputs from other pins are ignored at this time.
When CS is the “L” level, device is in select (active) status. CS has to be the “L” level
before inputting op-code.
3 WP
Write Protect pin
This is a pin to control writing to a status register. The writing of status register (see
“■STATUS REGISTER”) is protected in related with WP and WPEN. See “■WRITING
PROTECT” for detail.
7 HOLD
Hold pin
This pin is used to interrupt serial input/output without making chips deselect. When
HOLD is the “L” level, hold operation is activated, SO becomes High-Z, SCK and SI become
don’t care. While the hold operation, CS has to be retained the “L” level.
6 SCK
Serial Clock pin
This is a clock input pin to input/output serial data. SI is loaded synchronously to a rising
edge, SO is output synchronously to a falling edge.
5 SI Serial Data Input pin
This is an input pin of serial data. This inputs op-code, address, and writing data.
2 SO
Serial Data Output pin
This is an output pin of serial data. Reading data of FRAM memory cell array and status
register data are output. This is High-Z during standby.
8 VDD Supply Voltage pin
4 GND Ground pin
GND SI
SO
VDD
WP SCK
CS
HOLD
8
7
6
4 5
3
2
1
(TOP VIEW)
(FPT-8P-M02)MB85RS128B
DS501-00020-2v0-E 3
■ BLOCK DIAGRAM
SCK
SO
SI Serial-Parallel Converter
FRAM Cell Array
16,384 ✕ 8
Column Decoder/Sense Amp/
Write Amp
FRAM
Status Register
Data Register
Parallel-Serial Converter Control Circuit
Address Counter
Ro
w Decoder
CS
WP
HOLDMB85RS128B
4 DS501-00020-2v0-E
■ SPI MODE
MB85RS128B corresponds to the SPI mode 0 (CPOL = 0, CPHA = 0) , and SPI mode 3 (CPOL = 1, CPHA = 1) .
SCK
SI
CS
SCK
SI
CS
76543210
76543210
MSB LSB
MSB LSB
SPI Mode 0
SPI Mode 3MB85RS128B
DS501-00020-2v0-E 5
■ SERIAL PERIPHERAL INTERFACE (SPI)
MB85RS128B works as a slave of SPI. More than 2 devices can be connected by using microcontroller
equipped with SPI port. By using a microcontroller not equipped with SPI port, SI and SO can be bus
connected to use.
SCK
SS1
HOLD1
MOSI
MISO
SS2
HOLD2
SCK
CS HOLD
SISO SCK
CS HOLD
SISO
MB85RS128B MB85RS128B
SCK
CS HOLD
SISO
MB85RS128B
SPI
Microcontroller
MOSI : Master Out Slave In
MISO : Master In Slave Out
SS : Slave Select
System Configuration with SPI Port
System Configuration without SPI Port
MicrocontrollerMB85RS128B
6 DS501-00020-2v0-E
■ STATUS REGISTER
■ OP-CODE
MB85RS128B accepts 8 kinds of command specified in op-code. Op-code is a code composed of 8 bits
shown in the table below. Do not input invalid codes other than those codes. If CS is risen while inputting
op-code, the command are not performed.
Bit No. Bit Name Function
7 WPEN
Status Register Write Protect
This is a bit composed of nonvolatile memories (FRAM). WPEN protects
writing to a status register (refer to “■ WRITING PROTECT”) relating with
WP input. Writing with the WRSR command and reading with the RDSR
command are possible.
6 to 4 ⎯
Not Used Bits
These are bits composed of nonvolatile memories, writing with the WRSR
command is possible, and “000” is written before shipment. These bits are
not used but they are read with the RDSR command.
3 BP1 Block Protect
This is a bit composed of nonvolatile memory. This defines size of write
protect block for the WRITE command (refer to “■ BLOCK PROTECT”).
Writing with the WRSR command and reading with the RDSR command
are possible.
2 BP0
1 WEL
Write Enable Latch
This indicates an FRAM Array and status register are writable. The
WREN command is for setting, and the WRDI command is for resetting.
With the RDSR command, reading is possible but writing is not possible
with the WRSR command. WEL is reset after the following operations.
After power ON.
After WRDI command recognition.
The rising edge of CS after WRSR command recognition.
The rising edge of CS after WRITE command recognition.
0 0 This is a bit fixed to “0”.
Name Description Op-code
WREN Set Write Enable Latch 0000 0110B
WRDI Reset Write Enable Latch 0000 0100B
RDSR Read Status Register 0000 0101B
WRSR Write Status Register 0000 0001B
READ Read Memory Code 0000 0011B
WRITE Write Memory Code 0000 0010B
RDID Read Device ID 1001 1111B
FSTRD Fast Read Memory Code 0000 1011BMB85RS128B
DS501-00020-2v0-E 7
■ COMMAND
• WREN
The WREN command sets WEL (Write Enable Latch) . WEL has to be set with the WREN command before
writing operation (WRSR command and WRITE command) . WREN command is applicable to “Up to
33 MHz operation”.
• WRDI
The WRDI command resets WEL (Write Enable Latch) . Writing operation (WRITE command and WRSR
command) are not performed when WEL is reset. WRDI command is applicable to “Up to 33 MHz operation”.
SO
SCK
SI
CS
00000110
High-Z
210 3 7654
Invalid Invalid
SO
SCK
SI
CS
00000100
High-Z
210 3 7654
Invalid InvalidMB85RS128B
8 DS501-00020-2v0-E
• RDSR
The RDSR command reads status register data. After op-code of RDSR is input to SI, 8-cycle clock is input
to SCK. The SI value is invalid for this time. SO is output synchronously to a falling edge of SCK. In the
RDSR command, repeated reading of status register is enabled by sending SCK continuously before rising
of CS. RDSR command is applicable to “Up to 33 MHz operation”.
• WRSR
The WRSR command writes data to the nonvolatile memory bit of status register. After performing WRSR
op-code to a SI pin, 8 bits writing data is input. WEL (Write Enable Latch) is not able to be written with WRSR
command. A SI value correspondent to bit 1 is ignored. Bit 0 of the status register is fixed to “0” and cannot
be written. The SI value corresponding to bit 0 is ignored. The WP signal level shall be fixed before performing
the WRSR command, and do not change the WP signal level until the end of command sequence. WRSR
command is applicable to “Up to 33 MHz operation”.
SO
SCK
SI
CS
00000101
High-Z
210 3 7654
Invalid
MSB
210 3 7654
Data Out
LSB
Invalid
SO
SCK
SI
CS
00000001
210 3 7654
Data In
MSB
210 3 7654
High-Z
LSB
7654 3 210
InstructionMB85RS128B
DS501-00020-2v0-E 9
• READ
The READ command reads FRAM memory cell array data. Arbitrary 16 bits address and op-code of READ
are input to SI. The 2-bit upper address bit is invalid. Then, 8-cycle clock is input to SCK. SO is output
synchronously to the falling edge of SCK. While reading, the SI value is invalid. When CS is risen, the READ
command is completed, but keeps on reading with automatic address increment which is enabled by continuously
sending clocks to SCK in unit of 8 cycles before CS rising. When it reaches the most significant
address, it rolls over to the starting address, and reading cycle keeps on infinitely. READ command is
applicable to “Up to 25 MHz operation”.
• WRITE
The WRITE command writes data to FRAM memory cell array. WRITE op-code, arbitrary 16 bits of address
and 8 bits of writing data are input to SI. The 2-bit upper address bit is invalid. When 8 bits of writing data is
input, data is written to FRAM memory cell array. Risen CS will terminate the WRITE command, but if you
continue sending the writing data for 8 bits each before CS rising, it is possible to continue writing with
automatic address increment. When it reaches the most significant address, it rolls over to the starting
address, and writing cycle can be continued infinitely. WRITE command is applicable to “Up to 33 MHz
operation”.
SO
SCK
SI
CS
00 0 0 X 1 12 10
MSB
76543210
MSB Data Out
High-Z
LSB
420 1
Invalid
8 131211109 8 252423222120191 2726 8 3130292
OP-CODE
0 0 1 11 X 3 13 5
16-bit Address
Invalid
LSB
6 4 57 2 0 13
SO
SCK
SI
CS
00 0 0 X 1 12 10
MSB
76543210
Data In
MSB
High-Z
LSB
420 1
8 131211109 8 252423222120191 2726 8 3130292
OP-CODE
0 0 0 11 X 3 13 5
16-bit Address
LSB
6 4 57 2 0 13MB85RS128B
10 DS501-00020-2v0-E
• FSTRD
The FSTRD command reads FRAM memory cell array data. Arbitrary 16 bits address and op-code of FSTRD
are input to SI followed by 8 bits dummy. The 2-bit upper address bit is invalid. Then, 8-cycle clock is input
to SCK. SO is output synchronously to the falling edge of SCK. While reading, the SI value is invalid. When
CS is risen, the FSTRD command is completed, but keeps on reading with automatic address increment
which is enabled by continuously sending clocks to SCK in unit of 8 cycles before CS rising. When it reaches
the most significant address, it rolls over to the starting address, and reading cycle keeps on infinitely.
FSTRD command is applicable to “Up to 33 MHz operation”.
• RDID
The RDID command reads fixed Device ID. After performing RDID op-code to SI, 32-cycle clock is input to
SCK. The SI value is invalid for this time. SO is output synchronously to a falling edge of SCK. The output
is in order of Manufacturer ID (8bit)/Continuation code (8bit)/Product ID (1st Byte)/Product ID (2nd Byte).
In the RDID command, SO holds the output state of the last bit after 32-bit Device ID output by continuously
sending SCK clock before CS is risen. RDID command is applicable to “Up to 33 MHz operation”.
SO
SCK
SI
CS
00 0 1 X 1 13
76543210
MSB
High-Z
XX
8 11109 33323130 37363534 8 393
0 0 1 12 X Invalid
LSB
6 4 57 2 0 13
1 XX 02
24 25232221
Invalid
MSB Data Out LSB
OP-CODE 16-bit Address 8-bit Dummy
SO
SCK
SI
CS
MSB
76543210
Data Out Data Out
High-Z
LSB
8 11109 333231 37363534 8 393
Invalid
30 2 2931 8
10011111
8 6 4 57 2 0 13
bit
7 6 5 4 3 2 1 0 Hex
Manufacturer ID 0 0 0 0 0 1 0 0 04H Fujitsu
Continuation code 0 1 1 1 1 1 1 1 7FH
Proprietary use Density Hex
Product ID (1st Byte) 0 0 0 0 0 1 0 0 04H
Density: 00100B =
128kbit
Proprietary use Hex
Product ID (2nd Byte) 0 0 0 0 1 0 0 1 09HMB85RS128B
DS501-00020-2v0-E 11
■ BLOCK PROTECT
Writing protect block for WRITE command is configured by the value of BP0 and BP1 in the status register.
■ WRITING PROTECT
Writing operation of the WRITE command and the WRSR command are protected with the value of WEL,
WPEN, WP as shown in the table.
■ HOLD OPERATION
Hold status is retained without aborting a command if HOLD is the “L” level while CS is the “L” level. The
timing for starting and ending hold status depends on the SCK to be the “H” level or the “L” level when a
HOLD pin input is transited to the hold condition as shown in the diagram below. In case the HOLD pin
transited to “L” level when SCK is “L” level, return the HOLD pin to “H” level at SCK being “L” level. In the
same manner, in case the HOLD pin transited to “L” level when SCK is “H” level, return the HOLD pin to “H”
level at SCK being “H” level. Arbitrary command operation is interrupted in hold status, SCK and SI inputs
become don’t care. And, SO becomes High-Z while reading command (RDSR, READ) . If CS is rising during
hold status, a command is aborted. In case the command is aborted before its recognition, WEL holds the
value before transition to HOLD status.
BP1 BP0 Protected Block
0 0 None
0 1 3000H to 3FFFH (upper 1/4)
1 0 2000H to 3FFFH (upper 1/2)
1 1 0000H to 3FFFH (all)
WEL WPEN WP Protected Blocks Unprotected Blocks Status Register
0 X X Protected Protected Protected
1 0 X Protected Unprotected Unprotected
1 1 0 Protected Unprotected Protected
1 1 1 Protected Unprotected Unprotected
SCK
CS
Hold Condition
HOLD
Hold ConditionMB85RS128B
12 DS501-00020-2v0-E
■ ABSOLUTE MAXIMUM RATINGS
*:These parameters are based on the condition that VSS is 0 V.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
*:These parameters are based on the condition that VSS is 0 V.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconductor device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
Parameter Symbol Rating Unit
Min Max
Power supply voltage* VDD − 0.5 + 4.0 V
Input voltage* VIN − 0.5 VDD + 0.5 V
Output voltage* VOUT − 0.5 VDD + 0.5 V
Operation ambient temperature TA − 40 + 85 °C
Storage temperature Tstg − 55 + 125 °C
Parameter Symbol
Value
Unit
Min Typ Max
Power supply voltage* VDD 2.7 3.3 3.6 V
Input high voltage* VIH VDD × 0.8 ⎯ VDD + 0.5 V
Input low voltage* VIL − 0.5 ⎯ + 0.6 V
Operation ambient temperature TA − 40 ⎯ + 85 °CMB85RS128B
DS501-00020-2v0-E 13
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics
(within recommended operating conditions)
*1 : Applicable pin : CS, WP, HOLD, SCK, SI
*2 : Applicable pin : SO
Parameter Symbol Condition
Value
Unit
Min Typ Max
Input leakage current*1 |ILI| VIN = 0 V to VDD ⎯ ⎯ 10 μA
Output leakage current*2 |ILO| VOUT = 0 V to VDD ⎯ ⎯ 10 μA
Operating power supply current IDD
SCK = 25 MHz ⎯ 4 5 mA
SCK = 33 MHz ⎯ 5 6 mA
Standby current ISB
All inputs VSS or
SCK = SI = CS = VDD
⎯ 9 50 μA
Output high voltage VOH IOH = −2 mA VDD × 0.8 ⎯ ⎯ V
Output low voltage VOL IOL = 2 mA ⎯ ⎯ 0.4 VMB85RS128B
14 DS501-00020-2v0-E
2. AC Characteristics
* : All commands except READ are applicable to “Up to 33 MHz operation”.
READ command is applicable to “Up to 25MHz operation”.
AC Test Condition
Power supply voltage : 2.7 V to 3.6 V
Operation ambient temperature : − 40 °C to + 85 °C
Input voltage magnitude : 0.3 V to 2.7 V
Input rising time : 5 ns
Input falling time : 5 ns
Input judge level : VDD/2
Output judge level : VDD/2
Parameter Symbol
Value
Up to 25MHz Operation Up to 33MHz Operation* Unit
Min Max Min Max
SCK clock frequency fCK 0 25033 MHz
Clock high time tCH 20 ⎯ 15 ⎯ ns
Clock low time tCL 20 ⎯ 15 ⎯ ns
Chip select set up time tCSU 10 ⎯ 10 ⎯ ns
Chip select hold time tCSH 10 ⎯ 10 ⎯ ns
Output disable time tOD ⎯ 20 ⎯ 20 ns
Output data valid time tODV ⎯ 18 ⎯ 13 ns
Output hold time tOH 0 ⎯ 0 ⎯ ns
Deselect time tD 60 ⎯ 40 ⎯ ns
Data in rising time tR ⎯ 50 - 50 ns
Data falling time tF ⎯ 50 - 50 ns
Data set up time tSU 5 ⎯ 5 ⎯ ns
Data hold time tH 5 ⎯ 5 ⎯ ns
HOLD set up time tHS 10 ⎯ 10 ⎯ ns
HOLD hold time tHH 10 ⎯ 10 ⎯ ns
HOLD output floating time tHZ ⎯ 20 ⎯ 20 ns
HOLD output active time tLZ ⎯ 20 ⎯ 20 nsMB85RS128B
DS501-00020-2v0-E 15
AC Load Equivalent Circuit
3. Pin Capacitance
Parameter Symbol Conditions
Value
Unit
Min Max
Output capacitance CO VDD = VIN = VOUT = 0 V,
f = 1 MHz, TA = + 25 °C
⎯ 10 pF
Input capacitance CI ⎯ 10 pF
30 pF
Output
3.3 V
1.2 k
0.95 kMB85RS128B
16 DS501-00020-2v0-E
■ TIMING DIAGRAM
• Serial Data Timing
• Hold Timing
SCK
CS
SI Valid in
SO High-Z
: H or L
tCSU
tCH tCL tCH
tSU tH
tODV
tOH tOD
tCSH
tD
High-Z
SCK
CS
SO
tHS tHS
tHH tHH tHH tHH
tHZ tLZ tHZ tLZ
tHS tHS
HOLD
High-Z High-ZMB85RS128B
DS501-00020-2v0-E 17
■ POWER ON/OFF SEQUENCE
If VDD falls down below 2.0 V, VDD is required to be started from 1.0 V or less to prevent malfunctions when
the power is turned on again (see the figure below).
If the device does not operate within the specified conditions of read cycle, write cycle or power on/off
sequence, memory data can not be guaranteed.
■ FRAM CHARACTERISTICS
*1 : Total number of reading and writing defines the minimum value of endurance, as an FRAM memory operates
with destructive readout mechanism.
*2 : Minimun values define retention time of the first reading/writing data right after shipment, and these values
are calculated by qualification results.
■ NOTE ON USE
Data written before performing IR reflow is not guaranteed after IR reflow.
Parameter Symbol
Value
Unit
Min Max
CS level hold time at power OFF tpd 200 ⎯ ns
CS level hold time at power ON tpu 85 ⎯ ns
Power supply rising time tr 0.05 200 ms
Item Min Max Unit Parameter
Read/Write Endurance*1 1012 ⎯ Times/byte Operation Ambient Temperature TA = + 85 °C
Data Retention*2
10 ⎯
Years
Operation Ambient Temperature TA = + 85 °C
95 ⎯ Operation Ambient Temperature TA = + 55 °C
≥ 200 ⎯ Operation Ambient Temperature TA = + 35 °C
GND
CS >VDD × 0.8*
tpd tr tpu
VIL (Max)
1.0 V
VIH (Min)
3.0 V
VDD
CS : don't care CS >VDD × 0.8* CS CS
GND
VIL (Max)
1.0 V
VIH (Min)
3.0 V
VDD
* : CS (Max) < VDD + 0.5 VMB85RS128B
18 DS501-00020-2v0-E
■ ESD AND LATCH-UP
• Current method of Latch-Up Resistance Test
Note : The voltage VIN is increased gradually and the current IIN of 300 mA at maximum shall flow.
Confirm the latch up does not occur under IIN = ± 300 mA.
In case the specific requirement is specified for I/O and IIN cannot be 300 mA, the voltage shall be
increased to the level that meets the specific requirement.
Test DUT Value
ESD HBM (Human Body Model)
JESD22-A114 compliant
MB85RS128BPNF-G-JNE1
≥ |2000 V|
ESD MM (Machine Model)
JESD22-A115 compliant ≥ |200 V|
ESD CDM (Charged Device Model)
JESD22-C101 compliant ⎯
Latch-Up (I-test)
JESD78 compliant ⎯
Latch-Up (Vsupply overvoltage test)
JESD78 compliant ⎯
Latch-Up (Current Method)
Proprietary method ⎯
Latch-Up (C-V Method)
Proprietary method ⎯
A
VDD
VSS
DUT
V
IIN
VIN
+
-
Test terminal
Protection Resistance
VDD
(Max.Rating)
Reference
terminalMB85RS128B
DS501-00020-2v0-E 19
• C-V method of Latch-Up Resistance Test
Note : Charge voltage alternately switching 1 and 2 approximately 2 sec interval. This switching process is
considered as one cycle.
Repeat this process 5 times. However, if the latch-up condition occurs before completing 5times, this
test must be stopped immediately.
VDD
VSS
DUT
VIN
+
-
SW
1 2
C
200pF
V
A
Test
terminal
Protection Resistance
VDD
(Max.Rating)
Reference
terminalMB85RS128B
20 DS501-00020-2v0-E
■ REFLOW CONDITIONS AND FLOOR LIFE
Reflow Profile
Item Condition
Method IR (infrared reflow) , Convection
Times 2
Floor life
Before unpacking Please use within 2 years after production.
From unpacking to 2nd reflow Within 8 days
In case over period of floor life
Baking with 125 °C+/-3 °C for
24hrs+2hrs/-0hrs is required.
Then please use within 8 days.
(Please remember baking is up to 2 times)
Floor life condition Between 5 °C and 30 °C and also below 70%RH required.
(It is preferred lower humidity in the required temp range.)
260°C
(e)
(d')
(d)
255°C
170 °C
190 °C
RT (b)
(a)
(c)
to
Note : Temperature on the top of the package body is measured.
(a) Average ramp-up rate : 1 °C/s to 4 °C/s
(b) Preheat & Soak : 170 °C to 190 °C, 60 s to 180 s
(c) Average ramp-up rate : 1 °C/s to 4 °C/s
(d) Peak temperature : Temperature 260 °C Max; 255 °C within 10 s
(d’) Liquidous temperature : Up to 230 °C within 40 s or
Up to 225 °C within 60 s or
Up to 220 °C within 80 s
(e) Cooling : Natural cooling or forced cooling
Liquidous
TemperatureMB85RS128B
DS501-00020-2v0-E 21
■ RESTRICTED SUBSTANCES
This product complies with the regulations below (Based on current knowledge as of November 2011).
• EU RoHS Directive (2002/95/EC)
• China RoHS (Administration on the Control of Pollution Caused by Electronic Information Products
( ))
• Vietnam RoHS (30/2011/TT-BCT)
Restricted substances in each regulation are as follows.
* : The mark of “❍” shows below a threshold value.
Substances Threshold Contain status*
Lead and its compounds 1,000 ppm ❍
Mercury and its compounds 1,000 ppm ❍
Cadmium and its compounds 100 ppm ❍
Hexavalent chromium compound 1,000 ppm ❍
Polybrominated biphenyls (PBB) 1,000 ppm ❍
Polybrominated diphenyl ethers (PBDE) 1,000 ppm ❍MB85RS128B
22 DS501-00020-2v0-E
■ ORDERING INFORMATION
Part number Package Shipping form Minimum shipping
quantity
MB85RS128BPNF-G-JNE1 8-pin plastic SOP
(FPT-8P-M02) Tube 1
MB85RS128BPNF-G-JNERE1 8-pin plastic SOP
(FPT-8P-M02) Embossed Carrier tape 1500MB85RS128B
DS501-00020-2v0-E 23
■ PACKAGE DIMENSION
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
8-pin plastic SOP Lead pitch 1.27 mm
Package width ×
package length 3.9 mm × 5.05 mm
Lead shape Gullwing
Sealing method Plastic mold
Mounting height 1.75 mm MAX
Weight 0.06 g
8-pin plastic SOP
(FPT-8P-M02)
(FPT-8P-M02)
C
1.27(.050)
3.90±0.30 6.00±0.20
.199 –.008
+.010
–0.20
+0.25 5.05
0.13(.005) M
(.154±.012) (.236±.008)
0.10(.004)
1 4
8 5
0.44±0.08
(.017±.003)
–0.07
+0.03 0.22
.009 +.001
–.003
45°
0.40(.016)
"A" 0~8°
0.25(.010)
(Mounting height)
Details of "A" part
1.55±0.20
(.061±.008)
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
0.10(.004)
*1
*2
2002-2012 FUJITSU SEMICONDUCTOR LIMITED F08004S-c-5-10
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) 1 : These dimensions include resin protrusion.
Note 2) 2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
*
*MB85RS128B
24 DS501-00020-2v0-E
■ MARKING
RS128B
E11150
300
[MB85RS128BPNF-G-JNE1]
[MB85RS128BPNF-G-JNERE1]
[FPT-8P-M02]MB85RS128B
DS501-00020-2v0-E 25
■ PACKING INFORMATION
1. Tube
1.1 Tube Dimensions
• Tube/stopper shape
Tube cross-sections and Maximum quantity
Package form Package code
Maximum quantity
pcs/
tube
pcs/inner
box
pcs/outer
box
SOP, 8, plastic (2)
t = 0.5
Transparent polyethylene terephthalate
FPT-8P-M02 95 7600 30400
(Dimensions in mm)
(treated to antistatic)
Tube length: 520 mm
(treated to antistatic)
Stopper
Tube
Transparent polyethylene terephthalate
4.4
6.4
7.4
1.8
C 2006 FUJITSU LIMITED F08008-SET1-PET:FJ99L-0022-E0008-1-K-1 2.6
©2006-2010 FUJITSU SEMICONDUCTOR LIMITED
F08008-SET1-PET:FJ99L-0022-E0008-1-K-3MB85RS128B
26 DS501-00020-2v0-E
1.2 Tube Dry pack packing specifications
*1: For a product of witch part number is suffixed with “E1”, a “ ” marks is display to the moisture barrier
bag and the inner boxes.
*2: The space in the outer box will be filled with empty inner boxes, or cushions, etc.
*3: Please refer to an attached sheet about the indication label.
Note: The packing specifications may not be applied when the product is delivered via a distributer.
Tube
Dry pack
Inner box
Outer box
For SOP
Stopper
Aluminum Iaminated bag
Index mark
Desiccant
Label I *1*3
Heat seal
Aluminum Iaminated bag
(tubes inside)
Cushioning material
Inner box
Label I *1*3
Cushioning material
Humidity indicater
Outer box*2
Label II-A *3
Label II-B *3
IC
Use adhesive tapes.
G PbMB85RS128B
DS501-00020-2v0-E 27
1.3 Product label indicators
Label I: Label on Inner box/Moisture Barrier Bag/ (It sticks it on the reel for the emboss taping)
[C-3 Label (50mm × 100mm) Supplemental Label (20mm × 100mm)]
Label II-A: Label on Outer box [D Label] (100mm × 100mm)
Label II-B: Outer boxes product indicate
Note: Depending on shipment state, “Label II-A” and “Label II-B” on the external boxes might not be printed.
(Customer part number or FJ part number)
(Customer part number or FJ part number)
(FJ control number bar code)
XX/XX XXXX-XXX XXX
XXXX-XXX XXX
(Lot Number and quantity)
(Package count)
(Customer part number or FJ part number
bar code)
(Part number and quantity)
(FJ control number)
QC PASS
XXXXXXXXXXXXXX
XXXX/XX/XX (Packed years/month/day) ASSEMBLED IN xxxx
(3N)1 XXXXXXXXXXXXXX XXX
(Quantity)
(3N)2 XXXXXXXXXX
XXX pcs
XXXXXX
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX (Customer part number or FJ part number)
XXXXXXXXXXXXXX (Comment)
XXXXXXXXXX (FJ control number )
(LEAD FREE mark)
C-3 Label
Supplemental Label
Perforated line
XXXXXXXXXXXXX (Customer Name)
(CUST.)
XXX (FJ control number)
XXX (FJ control number)
XXX (FJ control number)
XXXXXXXXXXXXXX
(Part number)
(FJ control number + Product quantity)
(FJ control number + Product quantity
bar code)
(Part number + Product quantity bar code)
XXXXXXXXX (Delivery Address)
(DELIVERY POINT)
XXXXXXXXXXXXXX
(TRANS.NO.) (FJ control number)
XXXXXXXXXXXXXX
(PART NO.) (Customer part number or
FJ part number)
XXX/XXX
(Q’TY/TOTAL Q’TY)
XX
(UNIT)
(CUSTOMER'S
REMARKS)
XXXXXXXXXXXXXXXXXXXX
(PACKAGE COUNT)
XXX/XXX
(PART NAME) XXXXXXXXXXXXXX (Part number)
(3N)3 XXXXXXXXXXXXXX XXX
(3N)4 XXXXXXXXXXXXXX XXX (Part number + Product quantity)
(FJ control number)
(FJ control number bar code)
(3N)5 XXXXXXXXXX
D Label
XXXXXXXXXXXXXX (Part number)
(Lot Number)
XXXX-XXX
XXXX-XXX
(Count) (Quantity)
X XXX
X XXX
XXXMB85RS128B
28 DS501-00020-2v0-E
1.4 Dimensions for Containers
(1) Dimensions for inner box
(2) Dimensions for outer box
LWH
540 125 75
(Dimensions in mm)
LWH
565 270 180
(Dimensions in mm)
L W
H
L
W
HMB85RS128B
DS501-00020-2v0-E 29
2. Emboss Tape
2.1 Tape Dimensions
PKG code Reel No
Maximum storage capacity
pcs/reel pcs/inner box pcs/outer box
FPT-8P-M02 3 1500 1500 10500
(Dimensions in mm)
Material : Conductive polystyrene
Heat proof temperature : No heat resistance.
Package should not be baked
by using tape and reel.
C 2012 FUJITSU SEMICONDUCTOR LIMITED SOL8-EMBOSSTAPE9 : NFME-EMB-X0084-1-P-1
8±0.1
6.4±0.1
3.9±0.2
4±0.1
5.5±0.05
5.5±0.1
2.1±0.1
0.4
1.75±0.1
0.3±0.05
2±0.05
+0.1 ø1.5 –0
+0.1 ø1.5 –0
+0.3 –0.1 12
B
A B A
SEC.A-A
SEC.B-BMB85RS128B
30 DS501-00020-2v0-E
2.2 IC orientation
2.3 Reel dimensions
Dimensions in mm
Reel No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Tape width
Symbol 8 12 16 24 32 44 56 12 16 24
A 254 ± 2 254 ± 2 330 ± 2 254 ± 2 330 ± 2 254 ± 2 330 ± 2 330 ± 2
B 100 100 150 100 150 100 100 ± 2
C 13 ± 0.2 13
D 21 ± 0.8 20.5
E 2 ± 0.5
W1 8.4 12.4 16.4 24.4 32.4 44.4 56.4 12.4 16.4 24.4
W2 less than
14.4 less than 18.4 less than 22.4 less than 30.4 less than 38.4 less than 50.4 less than
62.4
less than
18.4
less than
22.4
less than
30.4
W3 7.9 ~ 10.9 11.9 ~ 15.4 15.9 ~ 19.4 23.9 ~ 27.4 31.9 ~ 35.4 43.9 ~ 47.4 55.9 ~
59.4
12.4 ~
14.4
16.4 ~
18.4
24.4 ~
26.4
r 1.0
(User Direction of Feed) (User Direction of Feed)
• ER type Index mark
(Reel side)
∗
∗: Hub unit width dimensions
Reel cutout dimensions
W1
W2 r
E
W3
B
A
C
D
+2
-0 +2
-0 +2
-0 +2
-0 +2
-0 +2
-0
+0.5
-0.2
+1
-0.2
+2
-0 +2
-0 +2
-0 +2
-0 +2
-0 +2
-0 +2
-0 +1
-0 +1
-0 +0.1
-0MB85RS128B
DS501-00020-2v0-E 31
2.4 Taping (φ330mm Reel) Dry Pack Packing Specifications
*1: For a product of witch part number is suffixed with “E1”, a “ ” marks is display to the moisture barrier
bag and the inner boxes.
*2: The size of the outer box may be changed depending on the quantity of inner boxes.
*3: The space in the outer box will be filled with empty inner boxes, or cushions, etc.
*4: Please refer to an attached sheet about the indication label.
Note: The packing specifications may not be applied when the product is delivered via a distributer.
Embossed
tapes
Dry pack
Inner box
Outer box
Outside diameter: 330mm reel
Heat seal
Label I *1, *4
Label II-B Label II-A *4 *4
Label I *1, *4
Label I *1, *4
Taping
Use adhesive tapes.
Outer box *2, *3
φ
Inner box
Label I *1, *4
Desiccant
Humidity indicator
Aluminum laminated bag
G PbMB85RS128B
32 DS501-00020-2v0-E
2.5 Product label indicators
Label I: Label on Inner box/Moisture Barrier Bag/ (It sticks it on the reel for the emboss taping)
[C-3 Label (50mm × 100mm) Supplemental Label (20mm × 100mm)]
Label II-A: Label on Outer box [D Label] (100mm × 100mm)
Label II-B: Outer boxes product indicate
Note: Depending on shipment state, “Label II-A” and “Label II-B” on the external boxes might not be printed.
(Customer part number or FJ part number)
(Customer part number or FJ part number)
(FJ control number bar code)
XX/XX XXXX-XXX XXX
XXXX-XXX XXX
(Lot Number and quantity)
(Package count)
(Customer part number or FJ part number
bar code)
(Part number and quantity)
(FJ control number)
QC PASS
XXXXXXXXXXXXXX
XXXX/XX/XX (Packed years/month/day) ASSEMBLED IN xxxx
(3N)1 XXXXXXXXXXXXXX XXX
(Quantity)
(3N)2 XXXXXXXXXX
XXX pcs
XXXXXX
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX (Customer part number or FJ part number)
XXXXXXXXXXXXXX (Comment)
XXXXXXXXXX (FJ control number )
(LEAD FREE mark)
C-3 Label
Supplemental Label
Perforated line
XXXXXXXXXXXXX (Customer Name)
(CUST.)
XXX (FJ control number)
XXX (FJ control number)
XXX (FJ control number)
XXXXXXXXXXXXXX
(Part number)
(FJ control number + Product quantity)
(FJ control number + Product quantity
bar code)
(Part number + Product quantity bar code)
XXXXXXXXX (Delivery Address)
(DELIVERY POINT)
XXXXXXXXXXXXXX
(TRANS.NO.) (FJ control number)
XXXXXXXXXXXXXX
(PART NO.) (Customer part number or
FJ part number)
XXX/XXX
(Q’TY/TOTAL Q’TY)
XX
(UNIT)
(CUSTOMER'S
REMARKS)
XXXXXXXXXXXXXXXXXXXX
(PACKAGE COUNT)
XXX/XXX
(PART NAME) XXXXXXXXXXXXXX (Part number)
(3N)3 XXXXXXXXXXXXXX XXX
(3N)4 XXXXXXXXXXXXXX XXX (Part number + Product quantity)
(FJ control number)
(FJ control number bar code)
(3N)5 XXXXXXXXXX
D Label
XXXXXXXXXXXXXX (Part number)
(Lot Number)
XXXX-XXX
XXXX-XXX
(Count) (Quantity)
X XXX
X XXX
XXXMB85RS128B
DS501-00020-2v0-E 33
2.6 Dimensions for Containers
(1) Dimensions for inner box
(2) Dimensions for outer box
Tape width L W H
12, 16
365 345
40
24, 32 50
44 65
56 75
(Dimensions in mm)
LWH
415 400 315
(Dimensions in mm)
L
W
H
L
W
HMB85RS128B
34 DS501-00020-2v0-E
■ MAJOR CHANGES IN THIS EDITION
A change on a page is indicated by a vertical line drawn on the left side of that page.
Page Section Change Results
1
■ FEATURES Revised the Data retention
10 years ( + 85 °C)
→10 years ( + 85 °C), 95 years ( + 55 °C),
over 200 years ( + 35 °C)
17
■ POWER ON/OFF SEQUENCE Revised the following description:
“VDD pin is required to be rising from 0 V because turning the
power on from an intermediate level may cause malfunctions,
when the power is turned on.”
→ “If VDD falls down below 2.0 V, VDD is required to be started
from 1.0 V or less to prevent malfunctions when the power is
turned on again (see the figure below).”
Moved the following description under the table:
“If the device does not operate within the specified conditions of
read cycle, write cycle or power on/off sequence, memory data
can not be guaranteed.”
■ FRAM CHARACTERISTICS Revised the table and NoteMB85RS128B
DS501-00020-2v0-E 35
MEMOMB85RS128B
FUJITSU SEMICONDUCTOR LIMITED
Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome,
Kohoku-ku Yokohama Kanagawa 222-0033, Japan
Tel: +81-45-415-5858
http://jp.fujitsu.com/fsl/en/
For further information please contact:
North and South America
FUJITSU SEMICONDUCTOR AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://us.fujitsu.com/micro/
Europe
FUJITSU SEMICONDUCTOR EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/semiconductor/
Korea
FUJITSU SEMICONDUCTOR KOREA LTD.
902 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fsk/
Asia Pacific
FUJITSU SEMICONDUCTOR ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://sg.fujitsu.com/semiconductor/
FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD.
30F, Kerry Parkside, 1155 Fang Dian Road, Pudong District,
Shanghai 201204, China
Tel : +86-21-6146-3688 Fax : +86-21-6146-3660
http://cn.fujitsu.com/fss/
FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD.
2/F, Green 18 Building, Hong Kong Science Park,
Shatin, N.T., Hong Kong
Tel : +852-2736-3232 Fax : +852-2314-4207
http://cn.fujitsu.com/fsp/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU SEMICONDUCTOR does
not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any
third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right
by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or
other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect
to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in
nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in
weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages arising
in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent
levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations
of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department
1. Product profile
1.1 General description
Standard level N-channel MOSFET in LFPAK package qualified to 175 °C. This product is
designed and qualified for use in a wide range of industrial, communications and domestic
equipment.
1.2 Features and benefits
Advanced TrenchMOS provides low
RDSon and low gate charge
High efficiency gains in switching
power converters
Improved mechanical and thermal
characteristics
LFPAK provides maximum power
density in a Power SO8 package
1.3 Applications
DC-to-DC converters
Lithium-ion battery protection
Load switching
Motor control
Server power supplies
1.4 Quick reference data
PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
Rev. 02 — 28 October 2010 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 80 V
ID drain current Tmb = 25 °C; VGS = 10 V;
see Figure 1
- - 67 A
Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 117 W
Tj junction temperature -55 - 175 °C
Static characteristics
RDSon drain-source on-state
resistance
VGS = 10 V; ID = 25 A;
Tj = 100 °C; see Figure 12
- - 18 mΩ
VGS = 10 V; ID = 25 A;
Tj = 25 °C; see Figure 12;
see Figure 13
- 8.6 11 mΩPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 2 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
2. Pinning information
3. Ordering information
Dynamic characteristics
QGD gate-drain charge VGS = 10 V; ID = 25 A;
VDS = 40 V; see Figure 14;
see Figure 15
- 11 - nC
QG(tot) total gate charge - 45 - nC
Avalanche ruggedness
EDS(AL)S non-repetitive
drain-source avalanche
energy
VGS = 10 V; Tj(init) = 25 °C;
ID = 67 A; Vsup ≤ 80 V;
RGS = 50 Ω; unclamped
- - 121 mJ
Table 1. Quick reference data …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 S source
SOT669 (LFPAK)
2 S source
3 S source
4 G gate
mb D mounting base; connected to
drain
mb
1234
S
D
G
mbb076
Table 3. Ordering information
Type number Package
Name Description Version
PSMN011-80YS LFPAK plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669PSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 3 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 80 V
VDGR drain-gate voltage Tj ≥ 25 °C; Tj ≤ 175 °C; RGS = 20 kΩ - 80 V
VGS gate-source voltage -20 20 V
ID drain current VGS = 10 V; Tmb = 100 °C; see Figure 1 - 47 A
VGS = 10 V; Tmb = 25 °C; see Figure 1 - 67 A
IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; see Figure 3 - 266 A
Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 117 W
Tstg storage temperature -55 175 °C
Tj junction temperature -55 175 °C
Tsld(M) peak soldering temperature - 260 °C
Source-drain diode
IS source current Tmb = 25 °C - 67 A
ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 266 A
Avalanche ruggedness
EDS(AL)S non-repetitive drain-source
avalanche energy
VGS = 10 V; Tj(init) = 25 °C; ID = 67 A;
Vsup ≤ 80 V; RGS = 50 Ω; unclamped
- 121 mJ
Fig 1. Continuous drain current as a function of
mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
003aad341
0
20
40
60
80
0 50 100 150 200
Tmb (°C)
ID
(A)
Tmb (°C)
0 200 50 100 150
03aa16
40
80
120
Pder
(%)
0PSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 4 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
003aad343
10-1
1
10
102
103
1 10 102 103
VDS (V)
ID
(A)
DC
100 ms
10 ms
1 ms
100 μs
10 μs
Limit RDSon = VDS / IDPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 5 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from junction to
mounting base
see Figure 4 - 0.5 1.3 K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration; typical
values
003aad342
single shot
0.2
0.1
0.05
0.02
10−3
10−2
10−1
1
1−6 10−5 10−4 10−3 10−2 10−1 1 tp (s)
Zth (j-mb)
(K/W) δ = 0.5PSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 6 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source breakdown
voltage
ID = 250 µA; VGS = 0 V; Tj = -55 °C 73 - - V
ID = 250 µA; VGS = 0 V; Tj = 25 °C 80 - - V
VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 175 °C;
see Figure 10
1- - V
ID = 1 mA; VDS = VGS; Tj = -55 °C;
see Figure 10
- - 4.6 V
ID = 1 mA; VDS = VGS; Tj = 25 °C;
see Figure 11; see Figure 10
234V
IDSS drain leakage current VDS = 80 V; VGS = 0 V; Tj = 25 °C - 0.02 1 µA
VDS = 80 V; VGS = 0 V; Tj = 125 °C - - 100 µA
IGSS gate leakage current VGS = -20 V; VDS = 0 V; Tj = 25 °C - - 100 nA
VGS = 20 V; VDS = 0 V; Tj = 25 °C - - 100 nA
RDSon drain-source on-state
resistance
VGS = 10 V; ID = 25 A; Tj = 175 °C;
see Figure 12
- 19 26 mΩ
VGS = 10 V; ID = 25 A; Tj = 100 °C;
see Figure 12
- - 18 mΩ
VGS = 10 V; ID = 25 A; Tj = 25 °C;
see Figure 12; see Figure 13
- 8.6 11 mΩ
RG internal gate resistance (AC) f = 1 MHz - 0.7 - Ω
Dynamic characteristics
QG(tot) total gate charge ID = 0 A; VDS = 0 V; VGS = 10 V - 38 - nC
ID = 25 A; VDS = 40 V; VGS = 10 V;
see Figure 14; see Figure 15
- 45 - nC
QGS gate-source charge - 13 - nC
QGS(th) pre-threshold gate-source
charge
ID = 25 A; VDS = 40 V; VGS = 10 V;
see Figure 14
- 8 - nC
QGS(th-pl) post-threshold gate-source
charge
- 5 - nC
QGD gate-drain charge ID = 25 A; VDS = 40 V; VGS = 10 V;
see Figure 14; see Figure 15
- 11 - nC
VGS(pl) gate-source plateau voltage ID = 25 A; VDS = 40 V; see Figure 14;
see Figure 15
- 4.9 - V
Ciss input capacitance VDS = 40 V; VGS = 0 V; f = 1 MHz;
Tj = 25 °C; see Figure 16
- 2800 - pF
Coss output capacitance - 270 - pF
Crss reverse transfer capacitance - 146 - pF
td(on) turn-on delay time VDS = 40 V; RL = 1.6 Ω; VGS = 10 V;
RG(ext) = 4.7 Ω
- 23 - ns
tr rise time - 20 - ns
td(off) turn-off delay time - 40 - ns
tf fall time - 12 - nsPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 7 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
Source-drain diode
VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C;
see Figure 17
- 0.8 1.2 V
trr reverse recovery time IS = 40 A; dIS/dt = 100 A/µs;
VGS = 0 V; VDS = 40 V
- 54 - ns
Qr recovered charge - 98 - nC
Table 6. Characteristics …continued
Symbol Parameter Conditions Min Typ Max Unit
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 7. Forward transconductance as a function of
drain current; typical values
Fig 8. Input and reverse transfer capacitances as a
function of gate-source voltage; typical values
003aad311
0
20
40
60
80
100
0123 VDS (V)
ID
(A)
8 10
20
5.5
5
6
VGS (V) = 4.5
003aad333
0
20
40
60
80
100
0246
VGS (V)
ID
(A)
Tj
= 175 °C
Tj
= 25 °C
003aad338
0
20
40
60
80
100
0 20 40 60 80 100
ID (A)
gfs
(S)
003aad337
1000
1500
2000
2500
3000
3500
4000
0 5 10 15 20 25
VGS (V)
C
(pF)
Ciss
CrssPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 8 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
Fig 9. Drain-source on-state resistance as a function
of gate-source voltage; typical values
Fig 10. Gate-source threshold voltage as a function of
junction temperature
Fig 11. Sub-threshold drain current as a function of
gate-source voltage
Fig 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
003aad339
5
10
15
20
25
30
4 8 12 16 20
VGS (V)
RDSon
(mΩ)
Tj
(°C)
−60 180 0 60 120
003aad280
2
3
1
4
5
VGS(th)
(V)
0
max
typ
min
03aa35
VGS (V)
0 6 2 4
10−4
10−5
10−2
10−3
10−1
ID
(A)
10−6
min typ max
003aae090
0
0.6
1.2
1.8
2.4
3
-60 0 60 120 180
Tj
(°C)
aPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 9 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
Fig 13. Drain-source on-state resistance as a function
of drain current; typical values
Fig 14. Gate charge waveform definitions
Fig 15. Gate-source voltage as a function of gate
charge; typical values
Fig 16. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
003aad312
5
8
11
14
17
20
0 20 40 60 80 100
ID (A)
RDSon
(mΩ)
8
5.5
20
6
10
VGS (V) = 5
003aaa508
VGS
VGS(th)
QGS1 QGS2
QGD
VDS
QG(tot)
ID
QGS
VGS(pl)
003aad335
0
2
4
6
8
10
0 10 20 30 40 50
QG (nC)
VGS
(V)
VDS = 40V
64V
16V
003aad336
102
103
104
10-1 1 10 102
VDS (V)
C
(pF)
Ciss
Crss
CossPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 10 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values
003aad334
0
20
40
60
80
100
0 0.3 0.6 0.9 1.2
VSD (V)
IS
(A)
Tj
= 25 °C
Tj
= 175 °CPSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 11 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
7. Package outline
Fig 18. Package outline SOT669 (LFPAK)
REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT669 MO-235 04-10-13
06-03-16
0 2.5 5 mm
scale
e
E1
b
c2
A2
UNIT A A2 b c e
DIMENSIONS (mm are the original dimensions)
mm 1.10
0.95
A1 A3
0.15
0.00
1.20
1.01
0.50
0.35
b2
4.41
3.62
b3
2.2
2.0
b4
0.9
0.7
0.25
0.19
c2
0.30
0.24
4.10
3.80
6.2
5.8
H
1.3
0.8
L2
0.85
0.40
L
1.3
0.8
L1
8°
0°
D w y (1)
5.0
4.8
E(1)
3.3
3.1
E1
D1 (1) (1)
max
0.25 4.20 1.27 0.25 0.1
1 2 34
mounting
base
D1
c
Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669
E
b2
b3
b4
H D
L2
L1
A
w M A
C
C
X
1/2 e
y C
θ
θ
(A ) 3
L
A
A1
detail X
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. PSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 12 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PSMN011-80YS v.2 20101028 Product data sheet - PSMN011-80YS v.1
Modifications: • Status changed from objective to product.
• Various changes to content.
PSMN011-80YS v.1 20100226 Objective data sheet - -PSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 13 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.PSMN011-80YS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 28 October 2010 14 of 15
NXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PSMN011-80YS
N-channel LFPAK 80 V 11 mΩ standard level MOSFET
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 October 2010
Document identifier: PSMN011-80YS
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14
10 Contact information. . . . . . . . . . . . . . . . . . . . . .14
1. Product profile
1.1 General description
Femtofarad bidirectional ElectroStatic Discharge (ESD) protection diode in a leadless
ultra small SOD882 Surface-Mounted Device (SMD) plastic package designed to protect
one signal line from the damage caused by ESD and other transients. The combination of
extremely low capacitance, high ESD maximum rating and ultra small package makes the
device ideal for high-speed data line protection and antenna protection applications.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
Rev. 3 — 24 October 2011 Product data sheet
Bidirectional ESD protection of one line ESD protection up to 10 kV
Femtofarad capacitance: Cd = 400 fF IEC 61000-4-2; level 4 (ESD)
Low ESD clamping voltage: 30 V
at 30 ns and 8 kV
AEC-Q101 qualified
Very low leakage current: IRM < 1 nA
10/100/1000 Mbit/s Ethernet Portable electronics
FireWire Communication systems
High-speed data lines Computers and peripherals
Subscriber Identity Module (SIM) card
protection
Audio and video equipment
Cellular handsets and accessories Antenna protection
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per device
VRWM reverse standoff voltage - - 5.5 V
Cd diode capacitance f = 1 MHz; VR = 0 V - 0.4 0.55 pFPESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 2 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode (diode 1)
2 cathode (diode 2) 21
Transparent
top view
sym045
1 2
Table 3. Ordering information
Type number Package
Name Description Version
PESD5V0F1BL - leadless ultra small plastic package; 2 terminals;
body 1.0 0.6 0.5 mm
SOD882
Table 4. Marking codes
Type number Marking code
PESD5V0F1BL ZZ
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per device
IPP peak pulse current tp = 8/20 s [1] - 2.5 A
Tj junction temperature - 125 C
Tamb ambient temperature 40 +125 C
Tstg storage temperature 55 +125 CPESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 3 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
[1] Device stressed with ten non-repetitive ESD pulses.
Table 6. ESD maximum ratings
Tamb = 25 C unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
Per device
VESD electrostatic discharge voltage IEC 61000-4-2
(contact discharge)
[1] - 10 kV
MIL-STD-883
(human body model)
- 10 kV
Table 7. ESD standards compliance
Standard Conditions
Per device
IEC 61000-4-2; level 4 (ESD) > 8 kV (contact)
MIL-STD-883; class 3 (human body model) > 4 kV
Fig 1. 8/20 s pulse waveform according to
IEC 61000-4-5
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
t (μs)
0 40 10 20 30
001aaa630
40
80
120
IPP
(%)
0
e−t
100 % IPP; 8 μs
50 % IPP; 20 μs
001aaa631
IPP
100 %
90 %
t
30 ns
60 ns
10 %
tr = 0.7 ns to 1 nsPESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 4 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
6. Characteristics
[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
Table 8. Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per device
VRWM reverse standoff
voltage
- - 5.5 V
IRM reverse leakage current VRWM = 5 V - 1 100 nA
VBR breakdown voltage IR = 1 mA 6 8 10 V
Cd diode capacitance f = 1 MHz; VR = 0 V - 0.4 0.55 pF
VCL clamping voltage [1]
IPP =1A - - 11 V
IPP = 2.5 A - - 15 V
rdif differential resistance IR = 20 mA - - 30
f = 1 MHz; Tamb = 25 C
Fig 3. Diode capacitance as a function of reverse
voltage; typical values
Fig 4. V-I characteristics for a bidirectional
ESD protection diode
VR (V)
−6.0 −2.0 2.0 6.0
006aab598
0.3
0.4
0.5
Cd
(pF)
0.2
006aaa676
−VCL −VBR −VRWM
−IRM VRWM VBR VCL
IRM
−IR
IR
−IPP
IPP
− +PESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 5 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
Fig 5. ESD clamping test setup and waveforms
006aab599
50 Ω
RZ
CZ
DUT
(DEVICE
UNDER
TEST)
GND
GND
450 Ω
RG 223/U
50 Ω coax
ESD TESTER
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
GND
GND
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network) pin 1 to 2
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network) pin 1 to 2
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
vertical scale = 50 V/div
horizontal scale = 15 ns/div
vertical scale = 50 V/div
horizontal scale = 15 ns/divPESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 6 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
7. Application information
PESD5V0F1BL is designed for the protection of one bidirectional data or signal line from
the damage caused by ESD and surge pulses. The device may be used on lines where
the signal polarities are both, positive and negative with respect to ground.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 6. Application diagram
006aab600
PESD5V0F1BL
GND
GPS
ANTENNAPESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 7 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
This is a generic drawing for SOD882 package. This product has no cathode marking.
Fig 7. Package outline PESD5V0F1BL (SOD882)
Dimensions in mm 03-04-17
0.55
0.47
0.65
0.62
0.55
0.50
0.46
cathode marking on top side
1.02
0.95
0.30
0.22
0.30
0.22
2
1
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
10000
PESD5V0F1BL SOD882 2 mm pitch, 8 mm tape and reel -315PESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 8 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
11. Soldering
Reflow soldering is the only recommended soldering method.
Fig 8. Reflow soldering footprint PESD5V0F1BL (SOD882)
solder lands
solder resist
occupied area
solder paste
sod882_fr
0.9
0.3
(2×)
R0.05 (8×)
0.6
(2×)
0.7
(2×)
0.4
(2×)
1.3
0.5
(2×)
0.8
(2×)
0.7
Dimensions in mmPESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 9 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PESD5V0F1BL v.3 20111024 Product data sheet - PESD5V0F1BL v.2
Modifications: • Figure 7 “Package outline PESD5V0F1BL (SOD882)”: updated.
• Section 13 “Legal information”: updated.
PESD5V0F1BL v.2 20110323 Product data sheet - PESD5V0F1BL v.1
PESD5V0F1BL v.1 20091001 Product data sheet - -PESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 10 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. PESD5V0F1BL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 24 October 2011 11 of 12
NXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PESD5V0F1BL
Femtofarad bidirectional ESD protection diode
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 24 October 2011
Document identifier: PESD5V0F1BL
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 6
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Packing information . . . . . . . . . . . . . . . . . . . . . 7
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information. . . . . . . . . . . . . . . . . . . . . 11
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1. Product profile
1.1 General description
500 mA PNP Resistor-Equipped Transistor (RET) in a small SOT23 (TO-236AB)
Surface-Mounted Device (SMD) plastic package.
NPN complement: PDTD123TT.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
PDTB123TT
PNP 500 mA, 50 V resistor-equipped transistor;
R1 = 2.2 kΩ, R2 = open
Rev. 4 — 8 November 2010 Product data sheet
500 mA output current capability Reduces component count
Built-in bias resistor Reduces pick and place costs
Simplifies circuit design AEC-Q101 qualified
Digital application in automotive and
industrial segments
Cost-saving alternative for BC807 series
in digital applications
Control of IC inputs Switching loads
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - −50 V
IO output current - - −500 mA
R1 bias resistor 1 (input) 1.54 2.2 2.86 kΩPDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 2 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 input (base)
2 GND (emitter)
3 output (collector)
006aaa144
1 2
3
sym009
3
2
1 R1
Table 3. Ordering information
Type number Package
Name Description Version
PDTB123TT - plastic surface-mounted package; 3 leads SOT23
Table 4. Marking codes
Type number Marking code[1]
PDTB123TT *1UPDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 3 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - −50 V
VCEO collector-emitter voltage open base - −50 V
VEBO emitter-base voltage open collector - −5 V
VI input voltage
positive - +5 V
negative - −12 V
IO output current - −500 mA
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW
Tj junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 500 K/WPDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 4 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
7. Characteristics
Table 7. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base
cut-off current
VCB = −40 V; IE =0A - - −100 nA
VCB = −50 V; IE =0A - - −100 nA
ICEO collector-emitter
cut-off current
VCE = −50 V; IB =0A - - −0.5 μA
IEBO emitter-base
cut-off current
VEB = −5 V; IC =0A - - −100 nA
hFE DC current gain VCE = −5 V;
IC = −50 mA
100 250 -
VCEsat collector-emitter
saturation voltage
IC = −50 mA;
IB = −2.5 mA
- - −0.3 V
R1 bias resistor 1 (input) 1.54 2.2 2.86 kΩ
Cc collector capacitance VCB = −10 V;
IE = ie = 0 A;
f = 100 MHz
- 11 - pF
VCE = −5 V
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
Fig 1. DC current gain as a function of collector
current; typical values
Fig 2. Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa455
IC (mA)
−10−1 −103 −102 −1 −10
103
hFE
102
(2)
(3)
(1)
006aaa456
IC (mA) −10−1 −102 −1 −10
−10−1
VCEsat
(V)
−10−2
(2)
(3)
(1)PDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 5 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 3. Package outline SOT23 (TO-236AB)
Dimensions in mm 04-11-04
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
1 2
3
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
PDTB123TT SOT23 4 mm pitch, 8 mm tape and reel -215 -235PDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 6 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
11. Soldering
Fig 4. Reflow soldering footprint SOT23 (TO-236AB)
Fig 5. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mmPDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 7 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PDTB123TT v.4 20101108 Product data sheet - PDTB123T_SER_3
Modifications: • Type numbers PDTB123TK and PDTB123TS deleted.
• Table 7 “Characteristics”: unit for VCEsat changed from mV to V.
• Section 8 “Test information”: added.
• Section 11 “Soldering”: added.
• Section 13 “Legal information”: updated.
PDTB123T_SER_3 20091116 Product data sheet - PDTB123T_SER_2
PDTB123T_SER_2 20050804 Product data sheet - PDTB123TK_1
PDTB123TK_1 20050519 Product data sheet - -PDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 8 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. PDTB123TT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 8 November 2010 9 of 10
NXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PDTB123TT
PNP 500 mA resistor-equipped transistor; R1 = 2.2 kΩ, R2 = open
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 November 2010
Document identifier: PDTB123TT
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Packing information . . . . . . . . . . . . . . . . . . . . . 5
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
http://www.farnell.com/datasheets/1754399.pdf
http://www.farnell.com/datasheets/1754399.pdf
1. Product profile
1.1 General description
PNP switching transistor in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD)
plastic package.
NPN complement: PMBT3904.
1.2 Features and benefits
Collector-emitter voltage VCEO = −40 V
Collector current capability IC = −200 mA
1.3 Applications
General amplification and switching
1.4 Quick reference data
2. Pinning information
PMBT3906
PNP switching transistor
Rev. 06 — 2 March 2010 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - −40 V
IC collector current - - −200 mA
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 base
2 emitter
3 collector
1 2
3
006aab259
2
1
3PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 2 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB).
Table 3. Ordering information
Type number Package
Name Description Version
PMBT3906 - plastic surface-mounted package; 3 leads SOT23
Table 4. Marking codes
Type number Marking code[1]
PMBT3906 *2A
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - −40 V
VCEO collector-emitter voltage open base - −40 V
VEBO emitter-base voltage open collector - −6 V
IC collector current - −200 mA
ICM peak collector current - −200 mA
IBM peak base current - −100 mA
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW
Tj junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °CPMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 3 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
6. Thermal characteristics
[1] Device mounted on an FR4 PCB.
7. Characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 500 K/W
Table 7. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off
current
VCB = −30 V; IE =0A - - −50 nA
IEBO emitter-base cut-off
current
VEB = −6 V; IC =0A - - −50 nA
hFE DC current gain VCE = −1 V
IC = −0.1 mA 60 - -
IC = −1 mA 80 - -
IC = −10 mA 100 - 300
IC = −50 mA 60 - -
IC = −100 mA 30 - -
VCEsat collector-emitter
saturation voltage
IC = −10 mA; IB = −1 mA - - −250 mV
IC = −50 mA; IB = −5 mA - - −400 mV
VBEsat base-emitter
saturation voltage
IC = −10 mA; IB = −1 mA - - −850 mV
IC = −50 mA; IB = −5 mA - - −950 mV
td delay time ICon = −10 mA;
IBon = −1 mA;
IBoff = 1 mA
- - 35 ns
tr rise time - - 35 ns
ton turn-on time - - 70 ns
ts storage time - - 225 ns
tf fall time - - 75 ns
toff turn-off time - - 300 ns
fT transition frequency VCE = −20 V;
IC = −10 mA;
f = 100 MHz
250 - - MHz
Cc collector capacitance VCB = −5 V; IE = ie = 0 A;
f = 1 MHz
- - 4.5 pF
Ce emitter capacitance VEB = −500 mV;
IC = ic = 0 A; f = 1 MHz
- - 10 pF
NF noise figure IC = −100 μA;
VCE = −5 V; RS =1kΩ;
f = 10 Hz to 15.7 kHz
- - 4 dBPMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 4 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
VCE = −1 V
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Tamb = 25 °C
Fig 1. DC current gain as a function of collector
current; typical values
Fig 2. Collector current as a function of
collector-emitter voltage; typical values
VCE = −1 V
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
IC/IB = 10
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
Fig 3. Base-emitter voltage as a function of
collector current; typical values
Fig 4. Base-emitter saturation voltage as a function
of collector current; typical values
0
400
600
200
mhc459
−10−1 −1 −10
IC (mA)
hFE
−102 −103
(1)
(3)
(2)
0 −10
−250
0
−50
−100
−150
−200
−2
VCE (V)
IC
(mA)
−4 −6 −8
006aab845
IB (mA) = −1.5
−1.05
−0.75
−0.45
−0.15
−0.3
−0.6
−0.9
−1.2
−1.35
mhc461
−600
−800
−400
−1000
−1200
VBE
(mV)
−200
IC (mA)
−10−1 −103 −102 −1 −10
(1)
(2)
(3)
mhc462
−600
−800
−400
−1000
−1200
VBEsat
(mV)
−200
IC (mA)
−10−1 −103 −102 −1 −10
(1)
(2)
(3)PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 5 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
IC/IB = 10
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 5. Collector-emitter saturation voltage as a function of collector current; typical values
−103
−102
−10
mhc463
−10−1 −1 −10
IC (mA)
VCEsat
(mV)
−102 −103
(1)
(2)
(3)PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 6 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
8. Test information
Fig 6. BISS transistor switching time definition
VI = 5 V; T = 500 μs; tp = 10 μs; tr = tf ≤ 3 ns
R1 = 56 Ω; R2 = 2.5 kΩ; RB = 3.9 kΩ; RC = 270 Ω
VBB = 1.9 V; VCC = −3 V
Oscilloscope: input impedance Zi = 50 Ω
Fig 7. Test circuit for switching times
006aaa266
−IBon (100 %)
−IB
input pulse
(idealized waveform)
−IBoff
90 %
10 %
−IC (100 %)
−IC
td
ton
90 %
10 %
tr
output pulse
(idealized waveform)
tf
t
ts
toff
RC
R2
R1
DUT
mgd624
Vo
RB
(probe)
450 Ω
(probe)
450 Ω oscilloscope oscilloscope
VBB
VI
VCCPMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 7 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 13.
Fig 8. Package outline SOT23 (TO-236AB)
Dimensions in mm 04-11-04
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
1 2
3
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
PMBT3906 SOT23 4 mm pitch, 8 mm tape and reel -215 -235PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 8 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
11. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMBT3906_6 20100302 Product data sheet - PMBT3906_N_5
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 4 “Marking”: amended
• Table 7 “Characteristics”: F redefined to NF noise figure
• Section 8 “Test information”: added
• Figure 6: added
• Figure 8: superseded by minimized package outline drawing
• Section 10 “Packing information”: added
• Section 12 “Legal information”: updated
PMBT3906_N_5 20071004 Product data sheet - PMBT3906_4
PMBT3906_4 20040121 Product specification - PMBT3906_3
PMBT3906_3 19990427 Product specification - PMBT3906_CNV_2
PMBT3906_CNV_2 19970505 Product specification - -PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 9 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification. PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 06 — 2 March 2010 10 of 11
NXP Semiconductors PMBT3906
PNP switching transistor
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PMBT3906
PNP switching transistor
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 March 2010
Document identifier: PMBT3906_6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Packing information . . . . . . . . . . . . . . . . . . . . . 7
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Contact information. . . . . . . . . . . . . . . . . . . . . 10
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SG2525A
SG3525A
REGULATING PULSE WIDTH MODULATORS
..8 TO 35 V OPERATION .5.1 V REFERENCE TRIMMED TO ± 1 % .100 Hz TO 500 KHz OSCILLATOR RANGE .SEPARATE OSCILLATOR SYNC TERMINAL .ADJUSTABLE DEADTIME CONTROL .INTERNAL SOFT-START .PULSE-BY-PULSE SHUTDOWN INPUT UNDERVOLTAGE LOCKOUT WITH
.HYSTERESIS LATCHING PWM TO PREVENT MULTIPLE
.PULSES DUAL SOURCE/SINK OUTPUT DRIVERS
DESCRIPTION
The SG3525A series of pulse width modulator integrated
circuits are designed to offer improved performance
and lowered external parts count when
used in designing all types of switching power supplies.
The on-chip + 5.1 V reference is trimmed to ±
1 % and the input common-mode range of the error
amplifier includes the reference voltage eliminating
external resistors. A sync input to the oscillator allows
multiple units to be slaved or a single unit to be
synchronized to an external system clock. A single
resistor between the CT and the discharge terminals
provide a wide range of dead time ad- justment.
These devices also feature built-in soft-start circuitry
with only an external timing capacitor required. A
shutdown terminal controls both the soft-start circuity
and the output stages, providing instantaneous
turn off through the PWM latch with pulsed shutdown,
as well as soft-start recycle with longer shutdown
commands. These functions are also controlled
by an undervoltage lockout which keeps the outputs
off and the soft-start capacitor discharged for
sub-normal input voltages. This lockout circuitry includes
approximately 500 mV of hysteresis for jitterfree
operation. Another feature of these PWM circuits
is a latch following the comparator. Once a
PWM pulses has been terminated for any reason,
the outputs will remain off for the duration of the period.
The latch is reset with each clock pulse. The
output stages are totem-pole designs capable of
sourcing or sinking in excess of 200 mA. The
SG3525A output stage features NOR logic, giving a
LOW output for an OFF state.
DIP16 16(Narrow)
Type Plastic DIP SO16
SG2525A SG2525AN SG2525AP
SG3525A SG3525AN SG3525AP
PIN CONNECTIONS AND ORDERING NUMBERS (top view)
®
June 2000 1/12
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
Vi Supply Voltage 40 V
VC Collector Supply Voltage 40 V
IOSC Oscillator Charging Current 5 mA
Io Output Current, Source or Sink 500 mA
IR Reference Output Current 50 mA
IT Current through CT Terminal
Logic Inputs
Analog Inputs
5
– 0.3 to + 5.5
– 0.3 to Vi
mA
V
V
Ptot Total Power Dissipation at Tamb = 70 °C 1000 mW
Tj Junction Temperature Range – 55 to 150 °C
Tstg Storage Temperature Range – 65 to 150 °C
Top Operating Ambient Temperature : SG2525A
SG3525A
– 25 to 85
0 to 70
°C
°C
THERMAL DATA
Symbol Parameter SO16 DIP16 Unit
Rth j-pins
Rth j-amb
Rth j-alumina
Thermal Resistance Junction-pins Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Junction-alumina (*) Max 50
50
80
°C/W
°C/W
°C/W
* Thermal resistance junction-alumina with the device soldered on the middle of an alumina supporting substrate measuring 15 ´ 20 mm ; 0.65 mm
thickness with infinite heatsink.
BLOCK DIAGRAM
SG2525A-SG3525A
2/12
ELECTRICAL CHARACTERISTICS
(V# i = 20 V, and over operating temperature, unless otherwise specified)
Symbol Parameter Test Conditions
SG2525A SG3525A
Unit
Min. Typ. Max. Min. Typ. Max.
REFERENCE SECTION
VREF Output Voltage Tj = 25 °C 5.05 5.1 5.15 5 5.1 5.2 V
DVREF Line Regulation Vi = 8 to 35 V 10 20 10 20 mV
DVREF Load Regulation IL = 0 to 20 mA 20 50 20 50 mV
DVREF/DT* Temp. Stability Over Operating Range 20 50 20 50 mV
* Total Output Variation Line, Load and
Temperature
5 5.2 4.95 5.25 V
Short Circuit Current VREF = 0 Tj = 25 °C 80 100 80 100 mA
* Output Noise Voltage 10 Hz £f £ 10 kHz,
Tj = 25 °C
40 200 40 200 mVrms
DVREF* Long Term Stability Tj = 125 °C, 1000 hrs 20 50 20 50 mV
OSCILLATOR SECTION * *
*, · Initial Accuracy Tj = 25 °C ± 2 ± 6 ± 2 ± 6 %
*, · Voltage Stability Vi = 8 to 35 V ± 0.3 ± 1 ± 1 ± 2 %
Df/DT* Temperature Stability Over Operating Range ± 3 ± 6 ± 3 ± 6 %
fMIN Minimum Frequency RT = 200 KW CT = 0.1 mF 120 120 Hz
fMAX Maximum Frequency RT = 2 KW CT = 470 pF 400 400 KHz
Current Mirror IRT = 2 mA 1.7 2 2.2 1.7 2 2.2 mA
*, · Clock Amplitude 3 3.5 3 3.5 V
*, · Clock Width Tj = 25 °C 0.3 0.5 1 0.3 0.5 1 ms
Sync Threshold 1.2 2 2.8 1.2 2 2.8 V
Sync Input Current Sync Voltage = 3.5 V 1 2.5 1 2.5 mA
ERROR AMPLIFIER SECTION (VCM = 5.1 V)
VOS Input Offset Voltage 0.5 5 2 10 mV
Ib Input Bias Current 1 10 1 10 mA
Ios Input Offset Current 1 1 mA
DC Open Loop Gain RL ³ 10 MW 60 75 60 75 dB
* Gain Bandwidth
Product
Gv = 0 dB Tj = 25 °C 1 2 1 2 MHz
*, z DC Transconduct. 30 KW £ RL £ 1 MW
Tj = 25 °C
1.1 1.5 1.1 1.5 ms
Output Low Level 0.2 0.5 0.2 0.5 V
Output High Level 3.8 5.6 3.8 5.6 V
CMR Comm. Mode Reject. VCM = 1.5 to 5.2 V 60 75 60 75 dB
PSR Supply Voltage
Rejection
Vi = 8 to 35 V 50 60 50 60 dB
SG2525A-SG3525A
3/12
ELECTRICAL CHARACTERISTICS (continued)
Symbol Parameter Test Conditions
SG2525A SG3525A
Unit
Min. Typ. Max. Min. Typ. Max.
PWM COMPARATOR
Minimum Duty-cycle 0 0 %
· Maximum Duty-cycle 45 49 45 49 %
· Input Threshold Zero Duty-cycle 0.7 0.9 0.7 0.9 V
Maximum Duty-cycle 3.3 3.6 3.3 3.6 V
* Input Bias Current 0.05 1 0.05 1 mA
SHUTDOWN SECTION
Soft Start Current VSD = 0 V, VSS = 0 V 25 50 80 25 50 80 mA
Soft Start Low Level VSD = 2.5 V 0.4 0.7 0.4 0.7 V
Shutdown Threshold To outputs, VSS = 5.1 V
Tj = 25 °C
0.6 0.8 1 0.6 0.8 1 V
Shutdown Input Current VSD = 2.5 V 0.4 1 0.4 1 mA
* Shutdown Delay VSD = 2.5 V Tj = 25 °C 0.2 0.5 0.2 0.5 ms
OUTPUT DRIVERS (each output) (VC = 20 V)
Output Low Level Isink = 20 mA 0.2 0.4 0.2 0.4 V
Isink = 100 mA 1 2 1 2 V
Output High Level Isource = 20 mA 18 19 18 19 V
Isource = 100 mA 17 18 17 18 V
Under-Voltage Lockout Vcomp and Vss = High 6 7 8 6 7 8 V
IC
Collector Leakage VC = 35 V 200 200 mA
tr* Rise Time CL = 1 nF, Tj = 25 °C 100 600 100 600 ns
tf* Fall Time CL = 1 nF, Tj = 25 °C 50 300 50 300 ns
TOTAL STANDBY CURRENT
Is Supply Current Vi = 35 V 14 20 14 20 mA
* These parameters, although guaranteed over the recommended operating conditions, are not 100 % tested in production. · Tested at fosc = 40 KHz (RT = 3.6 KW, CT = 10nF, RD = 0 W). Approximate oscillator frequency is defined by :
f = 1
CT (0.7 RT + 3 RD)
.DC transconductance (gM) relates to DC open-loop voltage gain (Gv) according to the following equation : Gv = gM RL where RL is the resistance
from pin 9 to ground. The minimum gM specification is used to calculate minimum Gv when the error amplifier output is loaded.
SG2525A-SG3525A
4/12
TEST CIRCUIT
SG2525A-SG3525A
5/12
Figure 1 : Oscillator Charge Time vs. RT
and CT.
Figure 2 : Oscillator Discharge Time vs. RD
and CT.
RECOMMENDED OPERATING CONDITIONS (·)
Parameter Value
Input Voltage (Vi) 8 to 35 V
Collector Supply Voltage (VC) 4.5 to 35 V
Sink/Source Load Current (steady state) 0 to 100 mA
Sink/Source Load Current (peak) 0 to 400 mA
Reference Load Current 0 to 20 mA
Oscillator Frequency Range 100 Hz to 400 KHz
Oscillator Timing Resistor 2 KW to 150 KW
Oscillator Timing Capacitor 0.001 mF to 0.1 mF
Dead Time Resistor Range 0 to 500 W
· (×) Range over which the device is functional and parameter limits are guaranteed.
Figure 3 : Output Saturation
Characteristics.
Figure 4 : Error Amplifier Voltage Gain and
Phase vs. Frequency.
SG2525A-SG3525A
6/12
SHUTDOWN OPTIONS (see Block Diagram)
Since both the compensation and soft-start terminals
(Pins 9 and 8) have current source pull-ups,
either can readily accept a pull-down signal which
only has to sink a maximum of 100 mA to turn off the
outputs. This is subject to the added requirement of
discharging whatever external capacitance may be
attached to these pins.
An alternate approach is the use of the shutdown circuitry
of Pin 10 which has been improved to enhance
the available shutdown options. Activating
this circuit by applying a positive signal on Pin 10
performs two functions : the PWM latch is immediately
set providing the fastest turn-off signal to the
outputs ; and a 150 mA current sink begins to discharge
the external soft-start capacitor. If the shutdown
command is short, the PWM signal is terminated
without significant discharge of the soft-start
capacitor, thus, allowing, for example, a convenient
implementation of pulse-by-pulse current limiting.
Holding Pin 10 high for a longer duration, however,
will ultimately discharge this external capacitor, recycling
slow turn-on upon release.
Pin 10 should not be left floating as noise pickup
could conceivably interrupt normal operation.
Figure 5 : Error Amplifier.
PRINCIPLES OF OPERATION
SG2525A-SG3525A
7/12
Figure 7 : Output Circuit (1/2 circuit shown).
Figure 6 : Oscillator Schematic.
SG2525A-SG3525A
8/12
Figure 10. Figure 11.
For single-ended supplies, the driver outputs are
grounded. The VC terminal is switched to ground by
the totem-pole source transistors on alternate oscillator
cycles.
In conventional push-pull bipolar designs, forward
base drive is controlled by R1 - R3. Rapid turn-off
times for the power devices are achieved with
speed-up capacitors C1 and C2.
The low source impedance of the output drivers provides
rapid charging of Power Mos input capacitance
while minimizing external components.
Low power transformers can be driven directly.
Automatic reset occurs during dead time, when both
ends of the primary winding are switched to ground.
Figure 8. Figure 9.
SG2525A-SG3525A
9/12
DIP16
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
OUTLINE AND
MECHANICAL DATA
SG2525A-SG3525A
10/12
SO16 Narrow
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.069
a1 0.1 0.25 0.004 0.009
a2 1.6 0.063
b 0.35 0.46 0.014 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.020
c1 45° (typ.)
D (1) 9.8 10 0.386 0.394
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F (1) 3.8 4 0.150 0.157
G 4.6 5.3 0.181 0.209
L 0.4 1.27 0.016 0.050
M 0.62 0.024
S
(1) D and F do not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch).
OUTLINE AND
MECHANICAL DATA
8°(max.)
SG2525A-SG3525A
11/12
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this
publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics
products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
SG2525A-SG3525A
12/12
AN2794
Application note
1 kW dual stage DC-AC converter based on the STP160N75F3
Introduction
This application note provides design guidelines and performance characterization of the
STEVAL-ISV001V1 demonstration board.
This board implements a 1 kW dual stage DC-AC converter, suitable for use in batterypowered
uninterruptible power supplies (UPS) or photovoltaic (PV) standalone systems.
The converter is fed by a low DC input voltage varying from 20 V to 28 V, and is capable of
supplying up to 1 kW of output power on a single-phase AC load. These features are
possible thanks to a dual stage conversion topology that includes an efficient step-up pushpull
DC-DC converter, which produces a regulated high-voltage DC bus and a sinusoidal HBridge
PWM inverter to generate a 50 Hz, 230 Vrms output sine wave. Other key features of
the system proposed are high power density, high switching frequency and efficiency
greater than 90% over a wide output load range
Figure 1. 1 kW DC-AC converter prototype
www.st.com
Contents AN2794
2/39 Doc ID 14827 Rev 2
Contents
1 System description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Design considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Layout considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3 Schematic description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4 Experimental results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6 Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Appendix A Component list. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Appendix B Product technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
AN2794 List of tables
Doc ID 14827 Rev 2 3/39
List of tables
Table 1. System specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Push-pull converter specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3. HF transformer design parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Output inductor design parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5. Power MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 6. Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 7. Bill of material (BOM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 8. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
List of figures AN2794
4/39 Doc ID 14827 Rev 2
List of figures
Figure 1. 1 kW DC-AC converter prototype . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Block diagram of an offline UPS system. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Possible use of a DC-AC converter in standalone PV conversion . . . . . . . . . . . . . . . . . . . . 5
Figure 4. Block diagram of the proposed conversion scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 5. Push-pull converter typical waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6. Distribution of converter losses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7. Distribution of losses with 3 STP160N75F3s paralleled . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 8. Component placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 9. Top layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 10. Bottom layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 11. Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 12. Characteristic waveforms (measured at 24 V input voltage and 280 W resistive load) . . . 26
Figure 13. Characteristic waveforms (measured at 28 V input voltage and 1000 W resistive load) . . 26
Figure 14. MOSFET voltage (ch4) and current (ch3) without RC snubber . . . . . . . . . . . . . . . . . . . . . 27
Figure 15. MOSFET voltage (ch4) and current (ch3) with RC snubber . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 16. Rectifier diode current (ch3) and voltage (ch4) without RDC snubber . . . . . . . . . . . . . . . . 27
Figure 17. Rectifier diode current (ch3) and voltage (ch4) with RDC snubber. . . . . . . . . . . . . . . . . . . 27
Figure 18. Ch1, ch3 MOSFETs drain current, ch2, ch4 MOSFET drain-source voltage . . . . . . . . . . . 28
Figure 19. Startup, ch2, ch3 inverter voltage and current, ch4 DC bus voltage . . . . . . . . . . . . . . . . . 28
Figure 20. DC-DC converter efficiency with 20 V input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 21. DC-DC converter efficiency with 22 V input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 22. DC-DC converter efficiency with 24 V input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 23. DC-DC converter efficiency with 26 V input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 24. DC-DC converter efficiency with 28 V input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 25. Converter efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 26. Technical specification for 1.5 mH 2.5 A inductor L4 (produced by MAGNETICA) . . . . . . 35
Figure 27. Technical specification for 1 kW, 100 kHz switch mode power transformer TX1
(produced by MAGNETICA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 28. Dimensional drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
AN2794 System description
Doc ID 14827 Rev 2 5/39
1 System description
In a UPS system, as shown in Figure 2, a DC-AC converter is always used to convert the
DC power from the batteries to AC power used to supply the load. The basic scheme also
includes a battery pack, a battery charger which converts AC power from the grid into DC
power, and a transfer switch to supply the load from the mains or from the energy storage
elements if a line voltage drop or failure occurs.
Figure 2. Block diagram of an offline UPS system
Another application where a DC-AC converter is always required is shown in the block
diagram of Figure 3. In this case, the converter is part of a conversion scheme commonly
used in standalone photovoltaic systems. An additional DC-DC converter operates as a
battery charger while performing a maximum power point tracking algorithm (MPPT), which
is necessary to maximize the energy yield from the PV array. The battery pack is always
present to store energy when solar radiation is available and release it at night or during
hours of low insolation.
Figure 3. Possible use of a DC-AC converter in standalone PV conversion
A possible implementation of an isolated DC-AC converter, which can be successfully used
in both the above mentioned applications, is given in the block diagram of Figure 4. It
consists of three main sections:
1. The DC-DC converter
2. The DC-AC converter
3. The power supply section
Battery
AC/DC DC/AC SWITCH
Battery
Charger
+
MPPT
Batteries
LC Filter
DC/DC
DC/AC
Load
System description AN2794
6/39 Doc ID 14827 Rev 2
Figure 4. Block diagram of the proposed conversion scheme
The DC-DC section is a critical part of the converter design. In fact, the need for high overall
efficiency (close to 90% or higher) together with the specifications for continuous power
rating, low input voltage range leading to high input current, and the need for high switching
frequency to minimize weight and size of passive components, makes it a quite challenging
design.
Due to the constraints given by the specifications given in Table 1, few topology solutions
are suitable to meet the efficiency target. Actually, since the input voltage of the DC-AC
converter must be at least equal to 350 V, it is not feasible to use non-isolated DC-DC
converters. Moreover, the output power rating prevents the use of single switch topologies
such as the flyback and the forward. Among the remaining isolated topologies, the half
bridge and full bridge are more suitable for high DC input voltage applications and also
characterized by the added complexity of gate drive circuitry of the high side switches.
Due to such considerations, the push-pull represents the most suitable choice. This
topology features two transistors on the primary side and a center tapped high frequency
transformer, as shown in the step-up section in Figure 4. It is quite efficient at low input
voltage making it widely used in battery powered UPS applications. Both power devices are
ground referenced with consequent simple gate drive circuits. They are alternatively turned
Table 1. System specifications
Specification Value
Nominal input voltage 24 V
Output voltage 230 Vrms, 50 Hz
Output power 1kW
Efficiency 90%
Switching frequency 100 kHz (DC-DC); 16 kHz (DC-AC)
AN2794 System description
Doc ID 14827 Rev 2 7/39
on and off in order to transfer power to each primary of the center tapped transformer.
Contemporary conduction of both devices must be avoided by limiting the duty cycle value
of the constant frequency PWM modulator to less than 0.5. The PWM modulator should also
prevent unequal ON times for the driving signals since this would result in transformer
saturation caused by the "Flux Walking" phenomenon.
The basic operation is similar to a forward converter. In fact, when a primary switch is active,
the current flows through the rectifier diodes, charging the output inductor, while when both
the switches are off, the output inductor discharges. It is important to point out that the
operating frequency of the output inductor is twice the switching frequency.
A transformer reset circuit is not needed thanks to the bipolar flux operation, which also
means better transformer core utilization with respect to single-ended topologies.
The main disadvantage of the push-pull converter is the breakdown voltage of primary
power devices which has to be higher than twice the input voltage. In fact, when voltage is
applied to one of the two transformer primary windings by the conduction of a transistor, the
reflected voltage across the other primary winding puts the drain of the off state transistor at
twice the input voltage with respect to ground. This is the reason why push-pull converters
are not suitable for high input voltage applications.
For the above mentioned reasons, the voltage fed push-pull converter, shown in Figure 4, is
chosen to boost the input voltage from 24 V to a regulated 350 V, suitable for optimal
inverter operation. The high voltage conversion ratio can be achieved by proper transformer
turns ratio design, taking into account that the input to output voltage transfer function is
given by:
Equation 1
The duty cycle is set by a voltage mode PWM regulator (SG3525) to keep a constant output
DC bus voltage. This voltage is then converted into AC using a standard H-bridge converter
implemented with four ultrafast switching IGBTs in PowerMESH™ technology, switching at
16 kHz. The switching strategy, based on PWM sinusoidal modulation, is implemented on
an 8-bit ST7lite39 microcontroller unit. This allows the use of a simple LC circuit to obtain a
high quality sine wave in terms of harmonic content.
The power supply section consists of a buck-boost converter to produce a regulated 15 V
from a minimum input voltage of 4 V. The circuit can be simply implemented by means of a
L5973 device, characterized by an internal P-channel DMOS transistor and few external
components. In this way, it is possible to supply all the driving circuits and the PWM
modulator. A standard linear regulator, L7805, provides 5 V supply to the microcontroller
unit.
in
1
2
out DV
N
N
V = 2
Design considerations AN2794
8/39 Doc ID 14827 Rev 2
2 Design considerations
The basic operation of a voltage fed push-pull converter is shown in Figure 5, where
theoretical converter waveforms are highlighted. In practice, significant overvoltages across
devices M1, M2 and across the four rectifier diodes are observed in most cases due to the
leakage inductance of the high frequency transformer. As a consequence, the breakdown
voltage of primary devices must be greater than twice the input voltage, and the use of
snubbing and/or clamping circuits is often helpful.
Special attention has to be paid to transformer design, due to the difficulties in minimizing
the leakage inductance and implementing low-voltage high-current terminations. Moreover,
imbalance in the two primary inductance values must be avoided both by symmetrical
windings and proper printed circuit board (PCB) layout. While transformer construction
techniques guarantee good symmetry and low leakage inductance values, asymmetrical
layout due to inappropriate component placement can be the source of different PCB trace
inductances. Whatever the cause of a difference in peak current through the switching
elements, transformer saturation in voltage mode push-pull converters can occur in a few
switching cycles with catastrophic consequences.
Figure 5. Push-pull converter typical waveforms
AN2794 Design considerations
Doc ID 14827 Rev 2 9/39
Starting from the specifications in Table 2, a step-by-step design procedure and some
design hints to obtain a symmetrical layout are given below.
A switching frequency of f = 100 kHz was chosen to minimize passive components size and
weight, then the following step-by-step calculation was done:
● Switching period:
Equation 2
● Maximum duty cycle
The theoretical maximum on time for each phase of the push-pull converter is:
Equation 3
Since deadtime has to be provided in order to avoid simultaneous device conduction, it is
better to choose the maximum duty cycle of each phase as:
Equation 4
This means a total deadtime of 1μs at maximum duty cycle, occurring for minimum input
voltage operation.
● Input power
Assuming 90% efficiency the input power is:
Equation 5
Table 2. Push-pull converter specifications
Specification Symbol Value
Nominal input voltage Vin 24 V
Maximum input voltage Vinmax 28 V
Minimum input voltage Vinmin 20 V
Nominal output power Pout 1000 W
Nominal output voltage Vout 350 V
Target efficiency η > 90%
Switching frequency f 100 kHz
10 s
10
1
f
1
T 5 = = = μ
t on 0.5T 5 s
* = = μ
0.45
T
t
D 0.9 on
*
max = =
1111W
0.9
P
P out
in = =
Design considerations AN2794
10/39 Doc ID 14827 Rev 2
● Maximum average input current:
Equation 6
● Maximum equivalent flat topped input current:
Equation 7
● Maximum input RMS current:
Equation 8
● Maximum MOSFET RMS current:
Equation 9
● Minimum MOSFET breakdown voltage:
Equation 10
● Transformer turns ratio:
Equation 11
● Minimum duty cycle value:
Equation 12
● Duty cycle at nominal input voltage:
Equation 13
● Maximum average output current:
Equation 14
55.55 A
20
1111
V
P
I
inmin
in
in = = =
61.72 A
0.9
55.55
2D
I
I
max
in
pft = = =
Iin Ipft 2Dmax 58.55A RMS
= =
IMosRMS = Ipft Dmax = 41.4A
VBrk 1.3 2 VinMax 72.8 V Mos
= • • =
19
2V D
V
N
N
N
in max
out
1
2
min
= = =
0.32
2NV
V
D
inmax
out
min = =
0.38
2NV
V
D
in
out
min = =
2.86A
V
P
I
out
out
out = =
AN2794 Design considerations
Doc ID 14827 Rev 2 11/39
● Secondary maximum RMS current
Assuming that the secondary top flat current value is equal to the average output value the
rms secondary current is:
Equation 15
● Rectifier diode voltage:
Equation 16
● Output filter inductor value:
Equation 17
Assuming a ripple current value ΔI= 15% Iout = 0.43A, the minimum value for the output filter
inductance is:
Equation 18
With this value of inductance continuous current mode (CCM) operation is guaranteed for a
minimum output current of:
Equation 19
which means a minimum load of 75 W is required for CCM operation. The chosen value for
this design is L=1.5 mH.
● Output filter capacitor value:
Equation 20
Considering a maximum output ripple value equal to:
Equation 21
Isec Iout Dmax 1.91A RMS
= =
Vdiode = NVinMax = 532 V
in
1
2
min V
N
N
L ≥ ( -
I
t
V ) onMax
out Δ
Lmin = 1.109 mH
0.215A
2
I
I
outMin =
Δ
=
s
0
L T
V
I
8
1
C
Δ
Δ
=
ΔV0 = 0.1%Vout = 0.35 V
Design considerations AN2794
12/39 Doc ID 14827 Rev 2
the minimum value of capacitance is:
Equation 22
and the equivalent series resistance (ESR) has to be lower than:
Equation 23
● Input capacitor:
Equation 24
where Icrms is the RMS capacitor current value given by:
Equation 25
and
Equation 26
then
Equation 27
Cmin = 1.53 μF
= Ω
Δ
Δ
= 0.81
I
V
ESR
L
0
max
in
onMax
in Crms V
T
C I
Δ
Δ
=
I I I2 19A
in
2
Crms InRms
= - =
V 0.1%V 0.028V
in inMax Δ = =
3053 F
V
T
C I
in
onMax
in Crms = μ
Δ
Δ
=
AN2794 Design considerations
Doc ID 14827 Rev 2 13/39
● HF transformer design
The design method is based on the Kg core geometry approach. The design can be done
according to the specifications in Table 3.
The first step is to compute the transformer apparent power given by:
Equation 28
The second step is the electrical condition parameter calculation Ke:
Equation 29
where Kf=4 is the waveform coefficient (for square waves).
Equation 30
The next step is to calculate the core geometry parameter:
Equation 31
Table 3. HF transformer design parameters
Specification Symbol Value
Nominal input voltage Vin 24 V
Maximum input voltage Vinmax 28 V
Minimum input voltage Vinmin 20 V
RMS input current Iin 41.4 A
Nominal output voltage Vout 350 V
Output current Iout 2.86 A
Switching frequency f 100 kHz
Efficiency η 98%
Regulation α 0.05%
Max operating flux density Bm 0.05T
Window utilization Ku 0.3
Duty cycle Dmax 0.45
Temperature rise Tr 30 °C
1)V I 2021 W
1
P (
P
P 0 0 0
0
t + =
η
+ =
η
=
( ) 4 2m
2 2f
Ke 0.145 K f B 10= • • • -
K 0.145(4)2 (100.000)2 (0.05)2 (10 4 ) 5800
e = = -
5
e
t
g 0.348 cm
2K
P
K =
α
=
Design considerations AN2794
14/39 Doc ID 14827 Rev 2
The Kg constant is related to the core geometrical parameters by the following equation:
Equation 32
where Wa is the core window area, Ac is the core cross sectional area and MLT is the mean
length per turn.
For example, choosing an E55/28/21 core with N27 ferrite, having
● Wa= 2.8 cm2
● Ac= 3.5 cm2
● MLT= 11.3 cm
the resulting Kg factor is:
● Kg= 0.91 cm2
which is then suitable for this application.
Once the core has been chosen, it is possible to calculate the number of primary turns as
follows:
Equation 33
The primary inductance value is:
Equation 34
and the number of secondary turns is:
Equation 35
At this point wires must be selected in order to implement primary and secondary windings.
At 100 kHz the current penetration depth is:
Equation 36
Then, the wire diameter can be selected as follows:
Equation 37
MLT
W A K
K u
2c
a
g =
2 turns
BA
V D T
N
c
in max
1
min =
Δ
=
L N AL 4 5800 nH 23.2 H
2
p = = • = μ
N2 = N • N1 = 38 turns
0.0209 cm
f
6.62 δ = =
d = 2δ = 0.0418cm
AN2794 Design considerations
Doc ID 14827 Rev 2 15/39
and the conductor section is:
Equation 38
Checking the wire table we notice that AWG26, having a wire area of AWAWG26 = 0.00128
cm2, can be used in this design. Considering a current density J = 500 A/cm2 the number of
primary wires is given by:
Equation 39
where:
Equation 40
Since the AWG26 has a resistance of 1345 μΩ/cm, the primary resistance is:
Equation 41
and so the value of resistance for the primary winding is:
Equation 42
Using the same procedure, the secondary winding is:
Equation 43
Equation 44
Equation 45
Equation 46
2
2
W 0.00137cm
4
d
A = π =
62
A
A
S
wAWG26
wp
np = =
in 2
wp 0.08 cm
J
I
A = =
21.69 / cm
62
1345 / cm
rp = μΩ
μΩ
=
Rp = N1 •MLT • rp = 490.1 μΩ
out 2
ws 0.00572 cm
J
I
A = =
5
A
A
S
wAWG26
ws
ns = =
269 / cm
5
1345 / cm
rs = μΩ
μΩ
=
Rs = N2 • MLT • rs = 115 .5mΩ
Design considerations AN2794
16/39 Doc ID 14827 Rev 2
The total copper losses are:
Equation 47
And transformer regulation is:
Equation 48
From the core loss curve of N27 material, at 55 °C, 50mT and 100 kHz, the selected core
has the following losses:
Equation 49
Where Ve= 43900 mm3 is the core volume. The transformer temperature rise is:
Equation 50
with
Equation 51
● Output inductor
The output filter inductor can be made using powder cores to minimize eddy current losses
and introduce a distributed air gap into the core. The design parameters are shown in
Table 4:
Table 4. Output inductor design parameters
Specification Symbol Value
Minimum inductance value Lmin 1.5 mH
DC current I0 2.86 A
AC current ΔI 0.41 A
Output power P0 1000 W
Ripple frequency fr 200 kHz
Operating flux density Bm 0.3 T
Core material Kool μ
Window utilization K u 0.4
Temperature rise Tr 25 °C
W 78 . 1 I R I R P P P 2s
in s
2
Cu = p + s = p + =
100 0.178%
P
P
out
α = cu =
V 1.23W
m
kW
PV = 28.1 3 • e =
T R (P P ) 33 oC
r = th • Cu + V =
W
C
R 11
o
th =
AN2794 Design considerations
Doc ID 14827 Rev 2 17/39
The peak current value across the inductor is:
Equation 52
To select a proper core we must compute the LI2
pk value:
Equation 53
Knowing this parameter, from Magnetics’ core chart, a 46.7 mm x 28.7 mm x 12.2 mm Kool
μ toroid, with μ=60 permeability and AL = 0.086 nH/turn can be selected. The required
number of turns is then:
Equation 54
The resulting magnetizing force (DC bias) is:
Equation 55
The initial value of turns has to be increased by dividing it by 0.8 (as shown in the data
catalog) to take into account the reduction of initial permeability (μe = 39 at full load) at
nominal current value. Then, the adjusted number of turns is:
Equation 56
The wire table shows that at 3 A the AWG20 can be used. With this choice, the maximum
number of turns per layer, for the selected core, is Nlayer= 96 and the resistance per single
layer is rlayer= 0.166Ω. The total winding resistance is then:
Equation 57
and the copper losses are:
Equation 58
The core losses can be evaluated as follows:
3.06A
2
I
Ipk I0 =
Δ
= +
LI2 10.3mH A
pk = •
132 turns
A
L
N
L
= =
84.2 oersteds
L
NI
H 0.4
e
= π =
N = 165 turns
= r = 0.38Ω
N
N
R layer
layer
W 1 . 3 RI P 2o
cu = =
Design considerations AN2794
18/39 Doc ID 14827 Rev 2
Equation 59
Equation 60
where MPL=11.8 cm is the magnetic path length. Since the core weight is 95.8 g, the core
losses are:
Equation 61
● Analysis of the converter losses
Once the transformer has been designed, the next step in performing the loss analysis is to
choose the power devices both for the input and output stage of the push-pull converter.
According to the calculations given above the following components have been selected:
MOSFET and diode losses can be separated into conduction and switching losses which
can be estimated, in the worst case operating condition (junction temperature of 100 °C),
with the following equations:
Equation 62
Equation 63
Equation 64
Table 5. Power MOSFET
Device Type RDS(on) tr+tf Vbr Id at 100 °C
STP160N75F3
Power
MOSFET
4.5 mΩ 70 ns+15 ns 75 V 96 A
Table 6. Diode
Device Type VF at 175 °C trrMax VRRM IF at 100 °C
STTH8R06 Ultrafast diode 1.4 V 25 ns 600 V 8 A
P kB2.12f1.23 2.047mW/ g
L = ac =
( )
0.0137T
MPL
10
2
I
0.4 N
B
4
e
ac =
μ
Δ
π
=
-
PL = 0.2W
P 1.6R I 12.5W ON RMS
Mos
2
cond = ds =
Pgate = QgVgsf = 0.165W
8.5W
T
V I (t t )
2
1
P Off mos r f
sw(ON OFF)
=
+
=
+
AN2794 Design considerations
Doc ID 14827 Rev 2 19/39
Equation 65
Equation 66
Note: Assuming: tB= trr/2, VRM= 350 V
Converter losses are distributed according to the graphic in Figure 6, where PCB trace
losses and control losses are not considered. What is important to note is that primary
switch conduction accounts for 36% of total DC-DC converter losses. This contribution can
be reduced by paralleling either two or three power devices. For example, by paralleling
three STP160N75F3s, a reduction in MOSFET conduction losses of 33% is achieved. Thus
MOSFET conduction losses account for 16% of total DC-DC converter losses, resulting in a
1.8% efficiency improvement.
Figure 6. Distribution of converter losses
P V I 2.67W
condDiode F secRMS = =
Pdiode VRMIRRtbf 2.4W SW
= =
36%
25%
16%
14%
4% 5%
MOSFET cond. Losses MOSFET sw. Losses
Diode cond. Losses Diode sw. Losses
Transformer Losses Inductor Losses
AM00627v1
Design considerations AN2794
20/39 Doc ID 14827 Rev 2
Figure 7. Distribution of losses with 3 STP160N75F3s paralleled
2.1 Layout considerations
Because of the high power level involved with this design, the parasitic elements must be
reduced as much as possible. Proper operation of the push-pull converter can be assured
through geometrical symmetry of the PCB board. In fact, geometrical symmetry leads to
electrical symmetry, preventing a difference in the current values across the two primary
windings of the transformer which can be the cause of core saturation. The output stage of
the converter has also to be routed with a certain degree of symmetry even if in this case the
impact of unwanted parasitic elements is lower because of lower current values with respect
to the input stage. In Figure 8, Figure 9 and Figure 10, a symmetrical layout designed for the
application is shown.
16%
33%
21%
18%
6% 6%
MOSFET cond. Losses MOSFET sw. Losses
Diode cond. Losses Diode sw. Losses
Transformer Losses Inductor Losses
AM00628v1
AN2794 Design considerations
Doc ID 14827 Rev 2 21/39
Figure 8. Component placement
Figure 9. Top layer
AM00629v1
AM00630v1
Design considerations AN2794
22/39 Doc ID 14827 Rev 2
Figure 10. Bottom layer
To obtain geometrical symmetry the HF transformer has been placed at the center of the
board, which has been developed using double-sided, 140 μm FR-4 substrate with
135 x 185 mm size. In addition, this placement of the transformer is the most suitable since
it is the bulkiest part of the board. Both the primary and secondary AC current loops are
placed very close to the transformer in order to reduce their area and consequently their
parasitic inductances. For this reason the MOSFET and rectifier diodes lie at the edges of
the PCB. Input loop PCB traces show identical shapes to guarantee the same values of
resistance and parasitic inductance. Also the IGBTs of the inverter stage lie at one edge of
the board. This gives the advantage of using a single heat sink for each group of power
components. The output filter is placed on the right side of the transformer, between the
bridge rectifier and the inverter stage.
The power supply section lies on the left side of the transformer, simplifying the routing of
the 15 V bus dedicated to supply all the control circuitry.
AM00631v1
AN2794 Schematic description
Doc ID 14827 Rev 2 23/39
3 Schematic description
The schematic of the converter is shown in Figure 11. Three MOSFETs are paralleled in
order to transfer power to each primary winding of the transformer. Both RC and RCD
networks can be connected between the drain and source of the MOSFETs to reduce the
overvoltages and voltage ringing caused by unclamped leakage inductance. The output of
the transformer is rectified by a full bridge of ultrafast soft-recovery diodes. An RCD network
is connected across the rectifier output to clamp the diode voltage to its steady state value
and recover the reverse recovery energy stored in the leakage inductance. This energy is
first transferred to the clamp capacitor and then partially diverted to the output through a
resistor.
The IGBT full bridge is connected to the output of the push-pull stage. Their control signals
are generated by an SG3525 voltage mode PWM modulator. Its internal clock, necessary to
generate the 100 kHz modulation, is set by an external RC network. The PWM output stage
is capable of sourcing or sinking up to 100 mA which can be enough to directly drive the
gate of the MOSFETs devices. The PWM controller power dissipation, given by the sum of
its own power consumption and the power needed to drive six STP160N75F3s at 100 kHz,
can be evaluated with the following equation:
Equation 67
where Vs and Is are the supply voltage and current.
Since this power dissipation would result in a high operating temperature of the IC, a totem
pole driving circuit has been used to handle the power losses and peak currents, achieving
a more favorable operating condition. This circuit was implemented by means of an NPNPNP
complementary pair of BJT transistors. The control and driver stage schematic is
shown in Figure 11.
PContoller tot = 6QgfVdrive + VsIs = 1.3W
Schematic description AN2794
24/39 Doc ID 14827 Rev 2
Figure 11. Schematic
AN2794 Schematic description
Doc ID 14827 Rev 2 25/39
The PWM modulation of the H-bridge inverter is implemented on an ST7lite39
microcontroller connected to the gate drive circuit composed of two L6386, as shown in the
schematic in Figure 11.
The auxiliary power supply section consists of an L5973D and an L7805, used to implement
a buck-boost converter to decrease the battery voltage from 24 V to 15 V and from 15 V to
5 V respectively.
Experimental results AN2794
26/39 Doc ID 14827 Rev 2
4 Experimental results
Typical voltage and current waveforms of the DC-AC converter and the efficiency curves of
the push-pull DC-DC stage, measured at different input voltages, are shown below. In
particular, Figure 12 and Figure 13 show both input and output characteristic waveforms of
the DC-DC converter both in light load and full load condition.
The HF transformer leakage inductance, which is about 1% of the magnetizing inductance,
is the cause of severe ringing across the input and the output power devices. MOSFETs
voltage and current waveforms with and without the connection of a snubber network are
shown in Figure 14 and 15, while Figure 16 and 17 show the effect of the RCD clamp circuit
connected across the rectifier bridge output. In Figure 18 the current and the voltage across
one of the three parallel-connected MOSFETs, powering each of the two windings of the
transformer are shown, while in Figure 19 it is possible to observe the variation of the
inverter output voltage and current together with the DC-DC converter bus voltage. In
Figure 20, 21, 22, 23 and 24, the efficiency curves of the push-pull converter measured with
an RL load are given. A maximum efficiency above 93% has been measured at nominal
input voltage and 640 W output power. The minimum value of efficiency has been tested
under low load and maximum input voltage. In Figure 25, the efficiency of the whole board is
shown. The efficiency tests have been carried out connecting an RL load at the inverter
output connectors, with 3 mH output inductor.
Figure 12. Characteristic waveforms
(measured at 24 V input
voltage and 280 W resistive
load)
Figure 13. Characteristic waveforms
(measured at 28 V input
voltage and 1000 W resistive
load)
Ch1 and Ch2: MOSFETs drain source voltage;
Ch4: HF transformer output voltage; Ch3: filter
inductor current
Ch1 and Ch2: MOSFETs drain source voltage;
Ch3: filter inductor current
AN2794 Experimental results
Doc ID 14827 Rev 2 27/39
Figure 14. MOSFET voltage (ch4) and
current (ch3) without RC
snubber
Figure 15. MOSFET voltage (ch4) and
current (ch3) with RC
snubber
Figure 16. Rectifier diode current (ch3)
and voltage (ch4) without
RDC snubber
Figure 17. Rectifier diode current (ch3)
and voltage (ch4) with RDC
snubber
Experimental results AN2794
28/39 Doc ID 14827 Rev 2
Figure 18. Ch1, ch3 MOSFETs drain
current, ch2, ch4 MOSFET
drain-source voltage
Figure 19. Startup, ch2, ch3 inverter
voltage and current, ch4 DC
bus voltage
Figure 20. DC-DC converter efficiency
with 20 V input
Figure 21. DC-DC converter efficiency
with 22 V input
Figure 22. DC-DC converter efficiency
with 24 V input
Figure 23. DC-DC converter efficiency
with 26 V input
0.8
0.85
0.9
0.95
1
0 200 400 600 800 1000 1200
Output Power [W]
Efficiency
AM00636v1
0.8
0.85
0.9
0.95
1
0 200 400 600 800 1000 1200
Output Power [W]
Efficiency
AM00637v1
0.8
0.85
0.9
0.95
1
0 200 400 600 800 1000 1200
Output Power [W]
Efficiency
AM00638v1
0.8
0.85
0.9
0.95
1
0 200 400 600 800 1000 1200
Output Power [W]
Efficiency
AM00639v1
AN2794 Experimental results
Doc ID 14827 Rev 2 29/39
Figure 24. DC-DC converter efficiency
with 28 V input
Figure 25. Converter efficiency
0.75
0.8
0.85
0.9
0.95
0 200 400 600 800 1000 1200
Output Power [W]
Efficiency
AM00640v1
87
88
89
90
91
92
93
0 200 400 600 800 1000
Output Power [W]
Effciency %
AM00641v1
Conclusion AN2794
30/39 Doc ID 14827 Rev 2
5 Conclusion
The theoretical analysis, design and implementation of a DC-AC converter, consisting of a
push-pull DC-DC stage and a full-bridge inverter circuit, have been evaluated. Due to the
use of the parallel connection of three STP160N75F3 MOSFETs the converter shows good
performance in terms of efficiency. Moreover the use of an ST7lite39 8-bit microcontroller
allows achieving simple control of the IGBTs used to implement the DC-AC stage. Any
additional feature, such as regulation of the AC output voltage or protection requirements,
can simply be achieved with firmware development.
6 Bibliography
1. Power Electronics: Converters, Applications and Design
2. Transformer and Inductor Design Handbook, Second Edition
3. Magnetic Core Selection for Transformers and Inductors, Second Edition
4. Switching Power Supply Design. New York.
AN2794 Component list
Doc ID 14827 Rev 2 31/39
Appendix A Component list
Table 7. Bill of material (BOM)
Component Part value Description Supplier
Cs1 100 nF, 630 V Polip. cap., MKP series EPCOS
Cs2 100 nF, 630 V Polip. cap., MKP series EPCOS
C1 100 nF, 50 V X7R ceramic cap.., B37987 series EPCOS
C2 100 nF, 50 V X7R ceramic cap., B37987 series EPCOS
C57 100 nF, 50 V X7R ceramic cap., B37987 series EPCOS
C59 100 nF, 50 V X7R ceramic cap., B37987 series EPCOS
C10 47 μF, 35 V SMD tantalum capacitor TAJ series AVX
C11 4.7 nF, 25 V SMD multilayer ceramic capacitor muRata
C12 100 μF, 25 V SMD X7R ceramic cap. C3225 series; size 1210 TDK
C14 47 μF, 35 V SMD tantalum capacitor TAJ series AVX
C16 100 pF, 25 V SMD multilayer ceramic capacitor muRata
C41 100 pF, 50 V General purpose ceramic cap., radial AVX
C17 680 nF, 25 V SMD multilayer ceramic capacitor muRata
C18 22 μF, 25 V Electrolytic cap FC series Panasonic
C19 22 μF, 25 V Electrolytic cap. FC series Panasonic
C26 2.2 μF, 25 V X7R ceramic cap., B37984 series EPCOS
C31 2.2 μF, 25 V X7R ceramic cap., B37984 series EPCOS
C28 470 nF, 25 V X7R ceramic cap., B37984 series EPCOS
C33 470 nF, 25 V X7R ceramic cap., B37984 series EPCOS
C34 33 μF, 450 V Electrolytic cap. B43821 series EPCOS
C35 33 μF, 450 V Electrolytic cap. B43821 series EPCOS
C37 3900 μF, 35 V Elec. capacitor 0.012 Ω, YXH series Rubycon
C38 3900 μF, 35 V Elec. capacitor 0.012 Ω, YXH series Rubycon
C39 150 μF, 35 V Electrolytic cap. fc series Panasonic
C40 22 nF, 50 V General purpose ceramic cap., radial AVX
C42 100 μF, 25 V Electrolytic cap. fc series Panasonic
C51 100 μF, 25 V Electrolytic cap.fc series Panasonic
C52 100 μF, 25 V Electrolytic cap.fc series Panasonic
C53 2.2 μF, 450 V Elcrolytic capactor B43851 series EPCOS
C54 4.7 nF, 100 V Polip. cap., MKT series EPCOS
C55 4.7 nF, 100 V Polip. cap., MKT series EPCOS
C56 470 nF, 50 V X7R ceramic cap., B37984 series EPCOS
Component list AN2794
32/39 Doc ID 14827 Rev 2
C58 0.33 μF, 50 V X7R ceramic cap., B37984 series EPCOS
C60 150 nF, 50 V SMD multilayer ceramic capacitor muRata
D1 STTH8R06D Ultrafast high voltage rectifier; TO-220AC STMicroelectronics
D2 STTH8R06 D Ultrafast high voltage rectifier; TO-220AC STMicroelectronics
D3 STTH8R06 D Ultrafast high voltage rectifier; TO-220AC STMicroelectronics
D4 STTH8R06 D Ultrafast high voltage rectifier; TO-220AC STMicroelectronics
D13 STTH8R06 D Ultrafast high voltage rectifier; TO-220AC STMicroelectronics
D5 BAT46 Small signal Schottky diode; SOD-123 STMicroelectronics
D6 BAT46 Small signal Schottky diode; SOD-123 STMicroelectronics
D8 BAT46 Small signal Schottky diode; SOD-123 STMicroelectronics
D7 BAT46 Small signal Schottky diode; SOD-123 STMicroelectronics
D9 STTH1L06 Ultrafast high voltage rectifier; DO-41 STMicroelectronics
D10 STTH1L06 Ultrafast high voltage rectifier; DO-41 STMicroelectronics
D11 1N5821 Schottky rectifier; DO-221AD STMicroelectronics
D12 1N5821 Schottky rectifier; DO-221AD STMicroelectronics
VOUT AC 1 CON1 FASTON RS components
VOUT AC 2 CON1 FASTON RS components
VOUT - CON1 FASTON RS components
VOUT + CON1 FASTON RS components
VIN CON1 FASTON RS components
GND CON1 FASTON RS components
IC1 L6386D High-voltage high and low side driver; dip-14 STMicroelectronics
IC2 L6386D High-voltage high and low side driver; dip-14 STMicroelectronics
IGBT LOW 1 STGW19NC60WD N-channel 19 A - 600 V TO-247 PowerMESH™ IGBT STMicroelectronics
IGBT HIGH 1 STGW19NC60WD N-channel 19 A - 600 V TO-247 PowerMESH™ IGBT STMicroelectronics
IGBT LOW 2 STGW19NC60WD N-channel 19 A - 600 V TO-247 PowerMESH™ IGBT STMicroelectronics
IGBT HIGH 2 STGW19NC60WD N-channel 19 A - 600 V TO-247 PowerMESH™ IGBT STMicroelectronics
J1 CON10 10-way idc connector commercial box header series Tyco Electronics
L3 150 μH, 3 A Power use SMD inductor; SLF12575T series TDK
L4(1) 1174.0018 ST04 1.5 mH, filter inductor MAGNETICA
M1 STP160N75F3
N-channel 75 V - 3.5 mΩ 120 A TO-220 STripFET™
Power MOSFET
STMicroelectronics
M2 STP160N75F3
N-channel 75 V - 3.5 mΩ 120 A TO-220 STripFET™
Power MOSFET
STMicroelectronics
M3 STP160N75F3
N-channel 75 V - 3.5 mΩ 120 A TO-220 STripFET™
Power MOSFET
STMicroelectronics
Table 7. Bill of material (BOM) (continued)
Component Part value Description Supplier
AN2794 Component list
Doc ID 14827 Rev 2 33/39
M4 STP160N75F3
N-channel 75 V - 3.5 mΩ 120 A TO-220 STripFET™
Power MOSFET
STMicroelectronics
M5 STP160N75F3
N-channel 75 V - 3.5 mΩ 120 A TO-220 STripFET™
Power MOSFET
STMicroelectronics
M6 STP160N75F3
N-channel 75 V - 3.5 mΩ 120 A TO-220 STripFET™
Power MOSFET
STMicroelectronics
Q8 STN4NF03L
N-channel 30 V , 6.5 A SOT-223 STripFET™ II Power
MOSFET
STMicroelectronics
Q9 2SD882 NPN Power BJT 30 V, 3 A transistor- SOT-32 STMicroelectronics
Q10 2SD882 NPN Power BJT 30 V, 3 A transistor- SOT-32 STMicroelectronics
Q11 2SB772 NPN Power BJT 30 V, 3 A transistor - SOT-32 STMicroelectronics
Q12 2SB772 NPN Power BJT 30 V, 3 A transistor - SOT-32 STMicroelectronics
RGATE IGBT
LOW 1
100 SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
RGATE IGBT
HIGH 1
100 SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
RGATE IGBT
LOW 2
100 SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
RGATE IGBT
HIGH 2
100 SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
R7 390 kΩ SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
R9 5.6 kΩ SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
R20
12 Ω SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
R21
R22
10 Ω SMD standard film res - 1/8 W - 1% - 100 ppm/°C BC components
R23
R24
R25
R99
R100
R101
R102
R103
R104
R81 22 kΩ Standard film res - 1/4 W 5%, axial 05 T-Ohm
R82 3.3 kΩ Standard film res - 1/4 W 5%, axial 05 T-Ohm
R83 39 kΩ Standard film res - 1/4 W 5%, axial 05 T-Ohm
R87 10 kΩ SMD standard film res - 1/8 W - 1% - 100ppm/°C BC components
Table 7. Bill of material (BOM) (continued)
Component Part value Description Supplier
Component list AN2794
34/39 Doc ID 14827 Rev 2
R88
10 kΩ SMD standard film res - 1/8 W - 1% - 100ppm/°C BC components
R89
R90
R91
R92
R93 1.5 kΩ SMD standard film res - 1/8 W – 1% - 100ppm/°C BC components
R94 470 Ω High voltage 17 W ceramic resistor sbcv type Meggit CGS
R95 470 Ω High voltage 17 W ceramic resistor sbcv type Meggit CGS
R96
10 Ω Standard film res – 2 W 5%, axial 05 T-Ohm
R97
R98 47 kΩ Standard film res - 1/4 W 5%, axial 05 T-Ohm
TX1(2) 1356.0004 rev.01 Power transformer MAGNETICA
U1 SG3525 Pulse width modulator SO-16 (narrow) STMicroelectronics
U16 L5973D 2.5 A switch step down regulator; HSOP8 STMicroelectronics
U17 ST7FLITE39F2 8-bit microcontroller; SO-20 STMicroelectronics
U20 L7805 Positive voltage regulator; D2PAK STMicroelectronics
124 HEAT SINK
Part n. 78185, S562 cooled package TO-220; thermal
res. 7.52 °C/W at length 70 mm width 40 mm height
57 mm
Aavid Thermalloy
125
HEAT SINK
Part n. 78350, SA36 cooled package TO-220; thermal
res. 1.2°C/W at length 135 mm width 49.5 mm height
85.5 mm
Aavid Thermalloy
126
1. The technical specification for this component is provided in Figure 26.
2. The technical specification for this component is provided in Figure 27.
Table 7. Bill of material (BOM) (continued)
Component Part value Description Supplier
AN2794 Product technical specification
Doc ID 14827 Rev 2 35/39
Appendix B Product technical specification
Figure 26. Technical specification for 1.5 mH 2.5 A inductor L4 (produced by
MAGNETICA)
TYPICAL APPLICATION
INDUCTOR FOR DC/DC CONVERTERS AS BUCK, BOOST E
BUCK-BOOST CONVERTERS. ALSO SUITABLE IN HALFBRIDGE,
PUSH-PULL AND FULL-BRIDGE APPLICATIONS
TECHNICAL DATA
INDUCTANCE 1.5mH ±15%
(MEASURE 1KHZ, TA 20°C)
RESISTANCE 0.52 max
(MEASURE DC, TA 20°C)
OPERATING VOLTAGE 800 VP MAX
(F 100K HZ, IR 2.5A, TA 20°C)
OPERATING VOLTAGE 2.5 A MAX
(MEASURE DC 800 VP, TA 20°C)
SATURATION CURRENT 4.5 A NOM
(MEASURE DC, L 50%NOM, TA 20°C)
SELF-RESONANT FREQUENY 1MHZ NOM
(TA 20°C)
OPERATING TEMPERATURE RANGE -10°C÷+45°C
(IR 2.5 A MAX)
DIMENSIONS 45X20 H46mm
WEIGHT 78g CIRCA
SCHEMATIC
INDUCTANCE VS CURRENT
INDUCTANCE VS FREQUENCY
DIMENSIONAL DRAWING
DIMENSIONS IN MM, DRAWING NOT IN SCALE
1
3
10%
100%
0 1 2 3 4 5 6
L
I [A]
0%
50%
100%
150%
200%
250%
0 200 400 600 800 1000
L/L(1kHz)
f [kHz]
1 2 2 3
3 min 1
45 max
46 max
20 max
0.8 (X4), RECOMMENDED PCB HOLE 1.2 (X4)
2 3
4
BOTTOM VIEW (PIN SIDE)
12.7
10.16
30.48
Product technical specification AN2794
36/39 Doc ID 14827 Rev 2
Figure 27. Technical specification for 1 kW, 100 kHz switch mode power transformer
TX1 (produced by MAGNETICA)
TYPICAL APPLICATION
TRANSFORMER TO POWER APPLICATIONS WITH HALF -
BRIDGE , PUSH -PULL E FULL -BRIDGE TYPOLOGY .
TECHNICAL DATA
INDUCTANCE
(MEASURE 1KHZ, TA 20°C)
PIN 1,2 – 3,4,5 17.2 uH MIN
PIN 3,4,5 – 6,7 17.2 uH MIN
PIN 9 – 13 (10-12 IN CC ) 5.7 mH MIN
R ESISTANCE
(MEASURE D .C, TA 20°C)
PIN 1,2 – 3,4,5 6 mΩ MAX
PIN 3,4,5 – 6,7 6 mΩ MAX
PIN 9 – 13 (10-12 IN CC ) 90 mΩ MAX
TRANSFORMER RATIO
(MEASURE 10KHZ, 10-12 IN CC , TA 20°C)
PIN 13 – 9 ⇔ 1,2 – 3,4,5 18 ± 5%
PIN 13 – 9 ⇔ 3,4,5 – 6,7 18 ± 5%
L EAKAGE INDUCTANCE 0.11 % NOM
(MEASURE 9-13, 1-2-3-4-5-6-7 AND 10-12 IN C .C, F 10KHZ, TA 20°C)
OPERATING VOLTAGE 800 VP MAX
(MEASURE 13-9, 10-12 IN CC , F 100KHZ , DUTY CYCLE 0.8,T A 20°C)
OPERATING CURRENT 2.5 A MAX
(MEASURE 13-9 WITH 1-2-3-4-5-6-7 IN CC ,
PMAX 1KW ,F 100 KHZ, TA 20°C)
OPERATING FREQUENCY 100KHZ NOM
(P MAX 1KW , TA 20°C)
OPERATING TEMPERATURE RANGE -10°C ÷+45°C
(P MAX 1KW, F 100KHZ )
INSULATION CLASS I
( PMAX 1KW, TA 20°C )
P RIMARY TO SECONDARY INSULATION 2500V
(F 50H Z,DURATION TEST 2”, TA 20°C)
MAXIMUM DIMENSIONS 57X57H45 mm
WEIGHT 292g CIRCA
SCHEMATIC
PRODUCT PICTURE
PIN DESCRIPTION
PIN (*) FUNCTION PIN (*) FUNCTION
1A P RIMARY DRAIN A 8 NOT USED
2A P RIMARY DRAIN A 9 SECONDARY GROUND
3B
PRIMARY +VB 24V
10D INTERMEDIARY S ECONDARY ACCESS
4B 11 MISSING , REFERENCE TO PCB ASSEMBLING
5B 12D INTERMEDIARY S ECONDARY ACCESS
6C P RIMARY DRAIN B 13 S ECONDARY 400V 2.5A
7C P RIMARY DRAIN B 14 NOT USED
(*)P IN WITH THE SAME SUBSCRIPT MU ST BE CONNECTED TOGETHER ON PCB
13
12
1
2
3
4
5
6
7
10
9
AN2794 Product technical specification
Doc ID 14827 Rev 2 37/39
Figure 28. Dimensional drawing
7 8
55.5 max
3 min
ı 1.0, Recommended PCB hole ı 1.4
56.5 max
14 13 12 4 10 9 8
1356.0004
SMT 1kW 100kHz
MAGNETICA 08149
BOTTOM VIEW (PIN SIDE )
40 5
1
7 8
14
MISSING PIN
REFERENCE AS PCB ASSEMBLING
Revision history AN2794
38/39 Doc ID 14827 Rev 2
7 Revision history
Table 8. Document revision history
Date Revision Changes
16-Feb-2009 1 Initial release
13-Jan-2012 2
– Introduction modified
– Section 3 modified
AN2794
Doc ID 14827 Rev 2 39/39
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
STEVAL-TDR027V1
Portable UHF 2-way radio demonstration board
based on the PD84008L-E
Features
■ Excellent thermal stability
■ Frequency: 380 - 512 MHz
■ Supply voltage: 7.2 V
■ Output power: > 6 W
■ Power gain: 11.7 ± 0.5 dB
■ Efficiency: 46% - 71%
■ Load mismatch: 20:1 all phases
■ BeO-free amplifier
Description
The STEVAL-TDR027V1 demonstration board is
a portable UHF 2-way radio designed as a
platform for evaluating the performance of the
PD84008L-E LDMOS RF power transistor.
Table 1. Device summary
Part number
STEVAL-TDR027V1
Mechanical specification:
L = 60 mm, W = 30 mm
www.st.com
Contents STEVAL-TDR027V1
2/11 Doc ID 18109 Rev 1
Contents
1 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Typical performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Circuit photo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STEVAL-TDR027V1 Electrical characteristics
Doc ID 18109 Rev 1 3/11
1 Electrical characteristics
TA = +25 oC, VDD = 7.2 V, Idq = 200 mA
Table 2. Electrical specification
Symbol Test conditions Min Typ Max Unit
Freq Frequency range 380 512 MHz
POUT @ PIN = 27 dBm 6 W
Gain @ PIN = 27 dBm 11.7 ± 0.5 dB
ND @ PIN = 27 dB 46 - 71 %
H2 2nd harmonic @ PIN = 27 dB -38 / -70 dBc
H3 3rd harmonic @ PIN = 27 dB -60 / -70 dBc
VSWR Load mismatch all phases @ POUT = 6 W 20:1
Impedance STEVAL-TDR027V1
4/11 Doc ID 18109 Rev 1
2 Impedance
Figure 1. Impedance diagram
Table 3. Impedance data
F (MHz) ZGS ZDL
380 3,3 + j6,2 2,2 - j0,7
390 3,6 + j6,7 2,2 - j0,4
400 4,1 + j7,1 2,2 - j0,1
410 4,6 + j7,4 2,2 + j0,2
420 5,3 + j7,5 2,2 + j0,5
430 6,2 + j7,3 2,3 + j0,8
440 6,8 + j6,6 2,4 + j1,0
450 7,0 + j5,4 2,4 + j1,3
460 6,4 + j4,2 2,6 + j1,5
470 5,2 + j3,6 2,7 + j1,6
480 3,9 + j3,7 2,8 + j1,7
490 2,8 + j4,2 2,9 + j1,8
500 2,1 + j4,9 3,0 + j1,9
510 1,6 + j5,6 3,1 + j1,8
520 1,3 + j6,3 3,2 + j1,7
STEVAL-TDR027V1 Typical performance
Doc ID 18109 Rev 1 5/11
3 Typical performance
Figure 2. Output power and efficiency vs.
frequency (pin=27 dBm)
Figure 3. Output power and efficiency vs.
frequency (pin=28 dBm)
Figure 4. Gain vs. frequency Figure 5. Gain vs. Pout
Fig
Typical performance STEVAL-TDR027V1
6/11 Doc ID 18109 Rev 1
Figure 8. Harmonics vs. frequency
STEVAL-TDR027V1 Test circuit
Doc ID 18109 Rev 1 7/11
4 Test circuit
Figure 9. Test circuit schematic diagram
+
TL5 TL6
C12
C13 RFout
C11
L4
C10
L3
C9
C6
RFin TL1 TL2
C8 PD84008L-E
LDMOS
R2
R1
R3
C7
L2
L1
C2
C1
Vcc
2 -
1 +
B2 C3 C4 C5
TL4
TL3
D1
FR4
H=60 mil
MSub
B1
Table 4. Component list
Component
ID
Description Value Case size Manufacturer Part code
B1
Ferrite bead
Panasonic EXCELDRC35C
B2 Panasonic EXCELDRC35C
C1, C2
Capacitor
120 pF 1206 MURATA
GRM42-6 COG 121J
50_
C3 1 nF 1206 MURATA GRM42-6 COG 102J 50
C4 100 nF 1206 MURATA
GRM42-6_X7R 104K
50_
C5 10 uF SMT Panasonic EEVHB1V100P
C6, C13 33 pF 100B ATC ATC 100B 330JW
C7 22 pF 100B ATC ATC 100B 220JW
C8 47 pF 100B ATC ATC 100B 470JW
C9 39 pF 100B ATC ATC 100B 390JW
C10 15 pF 100B ATC ATC 100B 150JW
C11 6.8 pF 100B ATC ATC 100B 6R8BW
C12 2.2 pF 100B ATC ATC 100B 2R2BW
D1 Zener diode 5.1 V SOD110 Philips BZX284C5V1
L1
Inductor
18.5 nH Coilcraft A05T
L2 5 nH Coilcraft A02T
L3, L4 2.5 nH Coilcraft A01T
R1 Resistor 1 kΩ 1206 Tyco Electronics 01623440-1
Test circuit STEVAL-TDR027V1
8/11 Doc ID 18109 Rev 1
R2 Potentiometer 10 kΩ Bourns Electronics 3214W-1-103E
R3 Resistor 560 Ω 1206 Bourns Electronics
TL1
Transmission line
W=2.87 mm L=7.4 mm
TL2 W=2.87 mm L=5.0 mm
TL3 W=4.98 mm L=4.8 mm
TL4 W=4.98 mm L=4.0 mm
TL5 W=2.87 mm L=1.5 mm
TL6 W=2.87 mm L=6.1 mm
PD84008L LDMOS STMicroelectronics PD84008L-E
Board FR-4 THk=0.060" 2OZ Cu both sides
Table 4. Component list (continued)
Component
ID
Description Value Case size Manufacturer Part code
STEVAL-TDR027V1 Board photo
Doc ID 18109 Rev 1 9/11
5 Board photo
Figure 10. STEVAL-TDR027V1 demonstration board
Revision history STEVAL-TDR027V1
10/11 Doc ID 18109 Rev 1
6 Revision history
Updated Table 5. Document revision history
Date Revision Changes
18-Oct-2010 1 Initial release.
STEVAL-TDR027V1
Doc ID 18109 Rev 1 11/11
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
L6384E
High voltage half-bridge driver
Datasheet - production data
Features
High voltage rail up to 600 V
dV/dt immunity ± 50 V/nsec in full temperature
range
Driver current capability
– 400 mA source
– 650 mA sink
Switching times 50/30 nsec rise/fall with 1 nF
load
CMOS/TTL Schmitt trigger inputs with
hysteresis and pull-down
Shutdown input
Deadtime setting
Undervoltage lockout
Integrated bootstrap diode
Clamping on VCC
Available in DIP-8/SO-8 packages
Applications
Home appliances
Induction heating
HVAC
Industrial applications and drives
Motor drivers
– DC, AC, PMDC and PMAC motors
Lighting applications
Factory automation
Power supply systems
Description
The L6384E is a high voltage gate driver,
manufactured with the BCD™ “offline”
technology, and able to drive a half-bridge of
power MOS or IGBT devices. The high-side
(floating) section is enabled to work with voltage
rail up to 600 V. Both device outputs can sink and
source 650 mA and 400 mA respectively and
cannot be simultaneously driven high thanks to an
integrated interlocking function. Further
prevention from outputs cross conduction is
guaranteed by the deadtime function, tunable by
the user through an external resistor connected to
the DT/SD pin.
The L6384E device has one input pin, one enable
pin (DT/SD) and two output pins, and guarantees
matched delays between low-side and high-side
sections, thus simplifying device's high frequency
operation. The logic inputs are CMOS/TTL
compatible to ease the interfacing with controlling
devices. The bootstrap diode is integrated inside
the device, allowing a more compact and reliable
solution.
The L6384E features the UVLO protection and
a voltage clamp on the VCC supply voltage. The
voltage clamp is typically around 15.6 V and is
useful in order to ensure a correct device
functioning in cases where VCC supply voltage is
ramped up too slowly or is subject to voltage
drops.
The device is available in a DIP-8 tube and SO-8
tube and tape and reel packaging options.
DIP-8 SO-8
Table 1. Device summary
Part number Package Packaging
L6384E DIP-8 Tube
L6384ED SO-8 Tube
L6384ED013TR SO-8 Tape and reel
www.st.com
Contents L6384E
2/15 DocID13862 Rev 2
Contents
1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 AC operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2 DC operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3 Timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Bootstrap driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
CBOOT selection and charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Typical characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DocID13862 Rev 2 3/15
L6384E Block diagram
15
1 Block diagram
Figure 1. Block diagram
LOGIC
UV
DETECTION
LEVEL
SHIFTER
R S
VCC
LVG
DRIVER
VCC
IN
DT/SD
VBOOT
HVG
DRIVER
HVG
H.V.
LOAD
OUT
LVG
GND
D97IN518A
DEAD
TIME
VCC
Idt
Vthi
BOOTSTRAP DRIVER
CBOOT
4
3
5
6
7
8
1
2
Electrical data L6384E
4/15 DocID13862 Rev 2
2 Electrical data
2.1 Absolute maximum ratings
2.2 Thermal data
2.3 Recommended operating conditions
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
Vout Output voltage -3 to Vboot -18 V
Vcc Supply voltage(1)
1. The device has an internal clamping Zener between GND and the Vcc pin, It must not be supplied by a low
impedance voltage source.
- 0.3 to 14.6 V
Is Supply current(1) 25 mA
Vboot Floating supply voltage -1 to 618 V
Vhvg High-side gate output voltage -1 to Vboot V
Vlvg Low-side gate output voltage -0.3 to Vcc +0.3 V
Vi Logic input voltage -0.3 to Vcc +0.3 V
Vsd Shutdown/deadtime voltage -0.3 to Vcc +0.3 V
dVout/dt Allowed output slew rate 50 V/ns
Ptot Total power dissipation (Tj = 85 °C) 750 mW
TJ Junction temperature 150 °C
Ts Storage temperature -50 to 150 °C
Table 3. Thermal data
Symbol Parameter SO-8 DIP-8 Unit
Rth(JA) Thermal resistance junction to ambient 150 100 °C/W
Table 4. Recommended operating conditions
Symbol Pin Parameter Test condition Min. Typ. Max. Unit
Vout 6 Output voltage (1)
1. If the condition Vboot - Vout < 18 V is guaranteed, Vout can range from -3 to 580 V.
580 V
VBS
(2)
2. VBS = Vboot - Vout.
8 Floating supply voltage (1) 17 V
fsw Switching frequency HVG, LVG load CL = 1 nF 400 kHz
Vcc 2 Supply voltage Vclamp V
Tj Junction temperature -45 125 °C
DocID13862 Rev 2 5/15
L6384E Pin connection
15
3 Pin connection
Figure 2. Pin connection (top view)
IN
VCC
DT/SD
GND
1
3
2
4 LVG
VOUT
HVG
8 VBOOT
7
6
5
D97IN519
Table 5. Pin description
No. Pin Type Function
1 IN I Logic input: it is in phase with HVG and in opposition of phase with LVG. It is compatible
to VCC voltage. (Vil Max = 1.5 V, Vih Min = 3.6 V).
2 VCC P Supply input voltage: there is an internal clamp [typ. 15.6 V].
3 DT/SD I
High impedance pin with two functionalities. When pulled lower than Vdt (typ. 0.5 V), the
device is shut down. A voltage higher than Vdt sets the deadtime between the high-side
gate driver and low-side gate driver. The deadtime value can be set forcing a certain
voltage level on the pin or connecting a resistor between the pin 3 and ground. Care
must be taken to avoid below threshold spikes on the pin 3 that can cause undesired
shutdown of the IC. For this reason the connection of the components between the pin 3
and ground has to be as short as possible. This pin can not be left floating for the same
reason. The pin has not be pulled through a low impedance to VCC, because of the drop
on the current source that feeds Rdt. The operative range is: Vdt … 270 K Idt, that
allows a dt range of 0.4 - 3.1 s.
4 GND P Ground
5 LVG O
Low-side driver output: the output stage can deliver 400 mA source and 650 mA sink
(typ. values). The circuit guarantees 0.3 V max. on the pin (at Isink = 10 mA) with
VCC > 3 V and lower than the turn-on threshold. This allows to omit the bleeder resistor
connected between the gate and the source of the external MOSFET normally used to
hold the pin low; the gate driver ensures low impedance also in SD conditions.
6 Vout P High-side driver floating reference: layout care has to be taken to avoid below ground
spikes on this pin.
7 HVG O
High-side driver output: the output stage can deliver 400 mA source and 650 mA sink
(typ. values). The circuit guarantees 0.3 V max. between this pin and Vout
(at Isink = 10 mA) with VCC > 3 V and lower than the turn-on threshold. This allows to omit
the bleeder resistor connected between the gate and the source of the external MOSFET
normally used to hold the pin low; the gate driver ensures low impedance also in SD
conditions.
8 Vboot P
Bootstrap supply voltage: it is the high-side driver floating supply. The bootstrap capacitor
connected between this pin and the pin 6 can be fed by an internal structure named
“bootstrap driver” (a patented structure). This structure can replace the external
bootstrap diode.
Electrical characteristics L6384E
6/15 DocID13862 Rev 2
4 Electrical characteristics
4.1 AC operation
4.2 DC operation
Table 6. AC operation electrical characteristics (VCC = 14.4V; TJ = 25°C)
Symbol Pin Parameter Test condition Min. Typ. Max. Unit
ton 1 vs. 5, 7 High/low-side driver turn-on
propagation delay Vout = 0 V Rdt= 47 k 200+
dt ns
tonsd 3 vs. 5, 7 Shutdown input propagation
delay 220 280 ns
toff 1 vs. 5, 7 High/low-side driver turn-off
propagation delay
Vout = 0 V Rdt = 47 k 250 300 ns
Vout = 0 V Rdt = 146 k 200 250 ns
Vout = 0 V Rdt = 270 k 170 200 ns
tr 5, 7 Rise time CL = 1000 pF 50 ns
tf 5, 7 Fall time CL = 1000 pF 30 ns
Table 7. DC operation electrical characteristics (VCC = 14.4 V; TJ = 25 °C)
Symbol Pin Parameter Test condition Min. Typ. Max. Unit
Supply voltage section
Vclamp 2 Supply voltage clamping Is = 5 mA 14.6 15.6 16.6 V
Vccth1 2 VCC UV turn-on threshold 11.5 12 12.5 V
Vccth2
2
VCC UV turn-off threshold 9.5 10 10.5 V
Vcchys VCC UV hysteresis 2 V
Iqccu
Undervoltage quiescent supply
current Vcc 11 V 150 A
Iqcc Quiescent current Vin = 0 380 500 A
Bootstrapped supply voltage section
Vboot
8
Bootstrap supply voltage 17 V
IQBS Quiescent current IN = HIGH 100 A
ILK High voltage leakage current Vhvg = Vout = Vboot = 600 V 10 A
Rdson Bootstrap driver on-resistance(1) Vcc 12.5 V; IN = LOW 125
High/low-side driver
Iso 5, 7
Source short-circuit current VIN = Vih (tp < 10 s) 300 400 mA
Isi Sink short-circuit current VIN = Vil (tp < 10 s) 500 650 mA
DocID13862 Rev 2 7/15
L6384E Electrical characteristics
15
4.3 Timing diagram
Figure 3. Input/output timing diagram
Symbol Pin Parameter Test condition Min. Typ. Max. Unit
Logic inputs
Vil
1, 3
Low level logic threshold voltage 1.5 V
Vih High level logic threshold voltage 3.6 V
Iih High level logic input current VIN = 15 V 50 70 A
Iil Low level logic input current VIN = 0 V 1 A
Iref 3 Deadtime setting current 28 A
dt 3 vs. 5, 7 Deadtime setting range(2)
Rdt = 47 k
Rdt = 146 k
Rdt = 270 k
0.4 0.5
1.5
2.7 3.1
s
s
s
Vdt 3 Shutdown threshold 0.5 V
1. RDS(on) is tested in the following way:
Where I1 is the pin 8 current when VCBOOT = VCBOOT1, I2 when VCBOOT = VCBOOT2.
2. The pin 3 is a high impedance pin. Therefore dt can be set also forcing a certain voltage V3 on this pin. The deadtime is the
same obtained with an Rdt if it is: Rdt × Iref = V3.
Table 7. DC operation electrical characteristics (continued)(VCC = 14.4 V; TJ = 25 °C)
RDSON
VCC – VCBOOT1 – VCC – VCBOOT2
= I--1------V----C----C---,--V-----C---B----O----O----T---1-------–----I--2-----V-----C---C----,--V----C----B----O----O----T---2----
IN
SD
HVG
LVG
D99IN1017
Bootstrap driver L6384E
8/15 DocID13862 Rev 2
5 Bootstrap driver
A bootstrap circuitry is needed to supply the high voltage section. This function is normally
accomplished by a high voltage fast recovery diode (Figure 4 a). In the L6384E device
a patented integrated structure replaces the external diode. It is realized by a high voltage
DMOS, driven synchronously with the low-side driver (LVG), with a diode in series, as
shown in Figure 4 b. An internal charge pump (Figure 4 b) provides the DMOS driving
voltage. The diode connected in series to the DMOS has been added to avoid undesirable
turn-on.
CBOOT selection and charging
To choose the proper CBOOT value the external MOS can be seen as an equivalent
capacitor. This capacitor CEXT is related to the MOS total gate charge:
Equation 1
The ratio between the capacitors CEXT and CBOOT is proportional to the cyclical voltage loss.
It has to be:
CBOOT>>>CEXT
E.g.: if Qgate is 30 nC and Vgate is 10 V, CEXT is 3 nF. With CBOOT = 100 nF the drop would be
300 mV.
If HVG has to be supplied for a long time, the CBOOT selection has to take into account also
the leakage losses.
E.g.: HVG steady state consumption is lower than 100 A, so if HVG TON is 5 ms, CBOOT
has to supply 0.5 C to CEXT. This charge on a 1 F capacitor means a voltage drop of
0.5 V.
The internal bootstrap driver gives great advantages: the external fast recovery diode can
be avoided (it usually has a great leakage current).
This structure can work only if VOUT is close to GND (or lower) and in the meanwhile the
LVG is on. The charging time (Tcharge ) of the CBOOT is the time in which both conditions are
fulfilled and it has to be long enough to charge the capacitor.
The bootstrap driver introduces a voltage drop due to the DMOS RDSON (typical value:
125 ). At low frequency this drop can be neglected. Anyway increasing the frequency it
must be taken in to account.
The following equation is useful to compute the drop on the bootstrap DMOS:
Equation 2
where Qgate is the gate charge of the external power MOS, Rdson is the on-resistance of the
bootstrap DMOS, and Tcharge is the charging time of the bootstrap capacitor.
CEXT
Qgate
Vgate
= --------------
Vdrop Ich argeRdson Vdrop
Qgate
Tch arge
= = -------------------Rdson
DocID13862 Rev 2 9/15
L6384E Bootstrap driver
15
For example: using a power MOS with a total gate charge of 30 nC, the drop on the
bootstrap DMOS is about 1 V, if the Tcharge is 5 s. In fact:
Equation 3
Vdrop has to be taken into account when the voltage drop on CBOOT is calculated: if this drop
is too high, or the circuit topology doesn’t allow a sufficient charging time, an external diode
can be used.
Figure 4. Bootstrap driver
Vdrop
30nC
5s
= -------------- 125 0.8V
TO LOAD
D99IN1067
H.V.
HVG
a b
LVG
HVG
LVG
CBOOT
TO LOAD
H.V.
CBOOT
DBOOT
VS VBOOT VS
VOUT
VBOOT
VOUT
Typical characteristic L6384E
10/15 DocID13862 Rev 2
6 Typical characteristic
Figure 5. Typical rise and fall times
vs. load capacitance
Figure 6. Quiescent current vs. supply
voltage
Figure 7. Deadtime vs. resistance Figure 8. Driver propagation delay
vs. temperature
Figure 9. Deadtime vs. temperature Figure 10. Shutdown threshold
vs. temperature
For both high and low side buffers @25°C Tamb
0 1 2 3 4 5 C (nF)
0
50
100
150
200
250
time
(nsec)
Tr
D99IN1015
Tf
0 2 4 6 8 10 12 14 VS(V)
10
102
103
104
Iq
(μA)
D99IN1016
50 100 150 200 250 300
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
dt (s)
Rdt (k)
Typ.
@ Vcc = 14.4V
-45 -25 0 25 50 75 100 125
0
100
200
300
400
Ton,Toff (ns)
@ Rdt = 47kOhm
@ Rdt = 146kOhm
@ Rdt = 270kOhm
Tj (°C)
Typ.
Typ.
Typ.
@ Vcc = 14.4V
-45 -25 0 25 50 75 100 125
Tj (°C)
0
0.5
1
1.5
2
2.5
3
dt (s)
R=47K
R=146K
Typ. R=270K
Typ.
Typ.
@ Vcc = 14.4V
-45 -25 0 25 50 75 100 125
0
0.2
0.4
0.6
0.8
1
Vdt (V)
Tj (°C)
Typ.
@ Vcc = 14.4V
DocID13862 Rev 2 11/15
L6384E Typical characteristic
15
Figure 11. VCC UV turn-on vs. temperature Figure 12. Output source current
vs. temperature
Figure 13. VCC UV turn-off
vs. temperature
Figure 14. Output sink current
vs. temperature
-45 -25 0 25 50 75 100 125
10
11
12
13
14
15
Vccth1 (V)
Tj (°C)
Typ.
-45 -25 0 25 50 75 100 125
0
200
400
600
800
1000
Current (mA)
Tj (°C)
Typ.
@ Vcc = 14.4V
-45 -25 0 25 50 75 100 125
8
9
10
11
12
13
Vccth2 (V)
Tj (°C)
Typ.
-45 -25 0 25 50 75 100 125
0
200
400
600
800
1000
Current (mA)
Tj (°C)
Typ.
@ Vcc = 14.4V
Package information L6384E
12/15 DocID13862 Rev 2
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 15. DIP-8 package outline
Table 8. DIP-8 package mechanical data
Symbol
Dimensions (mm) Dimensions (inch)
Min. Typ. Max. Min. Typ. Max.
A 3.32 0.131
a1 0.51 0.020
B 1.15 1.65 0.045 0.065
b 0.356 0.55 0.014 0.022
b1 0.204 0.304 0.008 0.012
D 10.92 0.430
E 7.95 9.75 0.313 0.384
e 2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 6.6 0.260
I 5.08 0.200
L 3.18 3.81 0.125 0.150
Z 1.52 0.060
DocID13862 Rev 2 13/15
L6384E Package information
15
Figure 16. SO-8 package outline
Table 9. SO-8 package mechanical data
Symbol
Dimensions (mm) Dimensions (inch)
Min. Typ. Max. Min. Typ. Max.
A 1.750 0.0689
A1 0.100 0.250 0.0039 0.0098
A2 1.250 0.0492
b 0.280 0.480 0.0110 0.0189
c 0.170 0.230 0.0067 0.0091
D(1)
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm in total (both sides).
4.800 4.900 5.000 0.1890 0.1929 0.1969
E 5.800 6.000 6.200 0.2283 0.2362 0.2441
E1(2)
2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25 mm per side.
3.800 3.900 4.000 0.1496 0.1535 0.1575
e 1.270 0.0500
h 0.250 0.500 0.0098 0.0197
L 0.400 1.270 0.0157 0.0500
L1 1.040 0.0409
k 0° 8° 0° 8°
ccc 0.100 0.0039
Revision history L6384E
14/15 DocID13862 Rev 2
8 Revision history
Table 10. Document revision history
Date Revision Changes
12-Oct-2007 1 First release
20-Jun-2014 2
Added Section : Applications on page 1.
Updated Section : Description on page 1 (replaced by new
description).
Updated Table 1: Device summary on page 1 (moved from page 15
to page 1, updated title).
Updated Figure 1: Block diagram on page 3 (moved from page 1 to
page 3, numbered and added title to Section 1: Block diagram on
page 3).
Updated Section 2.1: Absolute maximum ratings on page 4
(removed note below Table 2: Absolute maximum ratings).
Updated Table 5: Pin description on page 5 (updated “Type” of
several pins).
Updated Table 7 on page 6 (updated “Max.” value of IQBS symbol).
Updated Section : CBOOT selection and charging on page 8 (updated
values of “E.g.: HVG”).
Numbered Equation 1 on page 8, Equation 2 on page 8 and
Equation 3 on page 9.
Updated Section 7: Package information on page 12 [updated/added
titles, updated ECOPACK text, reversed order of Figure 15 and
Table 8, Figure 16 and Table 9 (numbered tables), removed 3D
package figures, minor modifications].
Minor modifications throughout document.
DocID13862 Rev 2 15/15
L6384E
15
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT
PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2014 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
ULQ2001
ULQ2003 - ULQ2004
Seven Darlington array
Features
■ Seven Darlington per package
■ Extended temperature range: -40 to 105 °C
■ Output current 500 mA per driver (600 mA
peak)
■ Output voltage 50 V
■ Automotive Grade product in SO16 package
■ Integrated suppression diodes for inductive
loads
■ Outputs can be paralleled for higher current
■ TTL/CMOS/PMOS/DTL compatible inputs
■ Inputs pinned opposite outputs to simplify
layout
Description
The ULQ2001, ULQ2003 and ULQ2004 are high
voltage, high current Darlington arrays each
containing seven open collector Darlington pairs
with common emitters. Each channel rated at 500
mA and can withstand peak currents of 600 mA.
Suppression diodes are included for inductive
load driving and the inputs are pinned opposite
the outputs to simplify board layout. The versions
interface to all common logic families. These
versatile devices are useful for driving a wide
range of loads including solenoids, relays DC
motors, LED displays filament lamps, thermal
print-heads and high power buffers. The
ULQ2001A/2003A and 2004A are supplied in 16
pin plastic DIP packages with a copper leadframe
to reduce thermal resistance. They are
available also in small outline package (SO16) as
ULQ2003D1/2004D1. The ULQ2003 is available
as Automotive Grade in SO16 package. The
commercial part numbers is shown in the order
codes. This device is qualified according to the
specification AEC-Q100 of the Automotive
market, in the temperature range -40 °C to 125 °C
and the statistical tests PAT, SYL, SBL are
performed.
DIP-16 SO16
(Narrow)
Table 1. Device summary
Part numbers Order codes Description Packages
ULQ2001 ULQ2001A
General purpose, DTL, TTL,
PMOS, CMOS
DIP-16
ULQ2003 ULQ2003A 5 V TTL, CMOS DIP-16
ULQ2004 ULQ2004A 6–15 V CMOS, PMOS DIP-16
ULQ2003 ULQ2003D1013TR SO16 in tape and reel
ULQ2003 ULQ2003D1013TRY (1) SO16 in tape and reel
ULQ2004 ULQ2004D1013TR SO16 in tape and reel
1. Automotive Grade products.
www.st.com
Contents ULQ2001, ULQ2003, ULQ2004
2/14 Doc ID 1537 Rev 6
Contents
1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
ULQ2001, ULQ2003, ULQ2004 Diagram
Doc ID 1537 Rev 6 3/14
1 Diagram
Figure 1. Schematic diagram
ULQ2001 (each driver) ULQ2003 (each driver)
ULQ2004 (each driver)
Pin configuration ULQ2001, ULQ2003, ULQ2004
4/14 Doc ID 1537 Rev 6
2 Pin configuration
Figure 2. Pin connections (top view)
ULQ2001, ULQ2003, ULQ2004 Maximum ratings
Doc ID 1537 Rev 6 5/14
3 Maximum ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VO Output voltage 50 V
VIN Input voltage (for ULQ2003A/D1 - 2004A/D1) 30 V
IC Continuous collector current 500 mA
IB Continuous base current 25 mA
TA Operating ambient temperature range -40 to 105 °C
TSTG Storage temperature range -55 to 150 °C
TJ Junction temperature 150 °C
Table 3. Thermal data
Symbol Parameter DIP-16 SO16 Unit
RthJA Thermal resistance junction-ambient, max. 70 120 °C/W
Electrical characteristics ULQ2001, ULQ2003, ULQ2004
6/14 Doc ID 1537 Rev 6
4 Electrical characteristics
TJ = -40 to 105 °C for DIP16 unless otherwise specified,
TJ = -25 to 105 °C for SO16 unless otherwise specified.
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
ICEX Output leakage current
VCE = 50V, (Figure 3) 50
μA
TJ = 105°C, VCE= 50V (Figure 3) 100
TJ = 105°C for ULQ2004, VCE= 50V,
VI = 1V (Figure 4)
500
VCE(SAT)
Collector-emitter saturation
voltage (Figure 5)
IC = 100mA, IB = 250μA 0.9 1.1
IC = 200mA, IB= 350μA 1.1 1.3 V
IC = 350mA, IB= 500μA 1.3 1.6
II(ON) Input current (Figure 6)
for ULQ2003, VI = 3.85V 0.93 1.35
for ULQ2004, VI = 5V 0.35 0.5 mA
for ULQ2004, VI = 12V 1 1.45
II(OFF) Input current (Figure 7) TJ = 105°C, IC = 500μA 50 65 μA
VI(ON) Input voltage (Figure 8)
for ULQ2003
VCE= 2V, IC = 200mA
VCE= 2V, IC = 250mA
VCE= 2V, IC = 300mA
for ULQ2004
VCE= 2V, IC = 125mA
VCE= 2V, IC = 200mA
VCE= 2V, IC = 275mA
VCE= 2V, IC = 350mA
2.4
2.7
3
5
6
7
8
V
hFE
DC forward current gain
(Figure 5)
for ULQ2001, VCE = 2V,
IC = 350mA
1000
CI Input capacitance 15 25 (1) pF
tPLH Turn-on delay time 0.5 VI to 0.5VO 0.25 1 (1) μs
tPHL Turn-off delay time 0.5 VI to 0.5VO 0.25 1 (1) μs
IR
Clamp diode leakage current
(Figure 9)
VR = 50V 50
μA
TJ = 105°C, VR = 50V 100
VF
Clamp diode forward voltage
(Figure 10)
IF = 350mA 1.7 2 V
1. Guaranteed by design.
ULQ2001, ULQ2003, ULQ2004 Electrical characteristics
Doc ID 1537 Rev 6 7/14
TJ = -40 to 125 °C for SO16 unless otherwise specified.
Table 5. Electrical characteristics for ULQ2003D1013TRY (Automotive Grade)
Symbol Parameter Test conditions Min. Typ. Max. Unit
ICEX
Output leakage current
(Figure 3)
VCE = 50V 50 μA
VCE(SAT)
Collector-emitter saturation
voltage (Figure 5)
IC = 100mA, IB = 250μA 0.9 1.1
IC = 200mA, IB= 350μA 1.1 1.3 V
IC = 350mA, IB= 500μA 1.3 1.6
II(ON) Input current (Figure 6) VI = 3.85V 0.93 1.35 mA
II(OFF) Input current (Figure 7) IC = 500μA 50 65 μA
VI(ON) Input voltage (Figure 8)
VCE = 2V, IC = 200mA
VCE = 2V, IC = 250mA
VCE = 2V,IC = 300mA
2.4
2.7
3
V
CI Input capacitance 15 25 pF
tPLH Turn-on delay time 0.5 VI to 0.5VO 0.25 1 μs
tPHL Turn-off delay time 0.5 VI to 0.5VO 0.25 1 μs
IR
Clamp diode leakage current
(Figure 9)
VR = 50V 50 μA
VF
Clamp diode forward voltage
(Figure 10)
IF = 350mA 1.7 2 V
Test circuits ULQ2001, ULQ2003, ULQ2004
8/14 Doc ID 1537 Rev 6
5 Test circuits
Figure 3. Output leakage current Figure 4. Output leakage current (for
ULN2002 only)
Figure 5. Collector-emitter saturation voltage Figure 6. Input current (ON)
Figure 7. Input current (OFF) Figure 8. Input voltage
ULQ2001, ULQ2003, ULQ2004 Test circuits
Doc ID 1537 Rev 6 9/14
Figure 9. Clamp diode leakage current Figure 10. Clamp diode forward voltage
Package mechanical data ULQ2001, ULQ2003, ULQ2004
10/14 Doc ID 1537 Rev 6
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
ULQ2001, ULQ2003, ULQ2004 Package mechanical data
Doc ID 1537 Rev 6 11/14
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
Plastic DIP-16 (0.25) mechanical data
P001C
Package mechanical data ULQ2001, ULQ2003, ULQ2004
12/14 Doc ID 1537 Rev 6
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.069
a1 0.1 0.25 0.004 0.009
a2 1.6 0.063
b 0.35 0.46 0.014 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.020
c1 45° (typ.)
D(1) 9.8 10 0.386 0.394
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F(1) 3.8 4.0 0.150 0.157
G 4.60 5.30 0.181 0.208
L 0.4 1.27 0.150 0.050
M 0.62 0.024
S 8° (max.)
(1) "D" and "F" do not include mold flash or protrusions - Mold
flash or protrusions shall not exceed 0.15mm (.006inc.)
SO16 (Narrow)
0016020 D
ULQ2001, ULQ2003, ULQ2004 Revision history
Doc ID 1537 Rev 6 13/14
7 Revision history
Table 6. Document revision history
Date Revision Changes
05-Dec-2006 2 Order codes updated.
23-May-2007 3 Order codes updated.
17-Apr-2008 4 Added new order codes for Automotive grade products see Table 1 on page 1.
25-Aug-2008 5 Modified: Table 4 on page 6 and Table 5 on page 7.
11-Feb-2011 6 Modified: TJ = -25 to 105 °C Table 4 on page 6.
ULQ2001, ULQ2003, ULQ2004
14/14 Doc ID 1537 Rev 6
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
ULN2001, ULN2002
ULN2003, ULN2004
Seven Darlington array
Datasheet − production data
Features
■ Seven Darlingtons per package
■ Output current 500 mA per driver (600 mA
peak)
■ Output voltage 50 V
■ Integrated suppression diodes for inductive
loads
■ Outputs can be paralleled for higher current
■ TTL/CMOS/PMOS/DTL compatible inputs
■ Inputs pinned opposite outputs to simplify
layout
Description
The ULN2001, ULN2002, ULN2003 and ULN
2004 are high voltage, high current Darlington
arrays each containing seven open collector
Darlington pairs with common emitters. Each
channel rated at 500 mA and can withstand peak
currents of 600 mA. Suppression diodes are
included for inductive load driving and the inputs
are pinned opposite the outputs to simplify board
layout.
The versions interface to all common logic
families:
– ULN2001 (general purpose, DTL, TTL,
PMOS, CMOS)
– ULN2002 (14 - 25 V PMOS)
– ULN2003 (5 V TTL, CMOS)
– ULN2004 (6 - 15 V CMOS, PMOS)
These versatile devices are useful for driving a
wide range of loads including solenoids, relays
DC motors, LED displays filament lamps, thermal
printheads and high power buffers.
The ULN2001A/2002A/2003A and 2004A are
supplied in 16 pin plastic DIP packages with a
copper leadframe to reduce thermal resistance.
They are available also in small outline package
(SO-16) as ULN2001D1/2002D1/2003D1/
2004D1
DIP-16 SO-16
(Narrow)
Table 1. Device summary
Order codes
ULN2001A ULN2001D1013TR
ULN2002A ULN2002D1013TR
ULN2003A ULN2003D1013TR
ULN2004A ULN2004D1013TR
www.st.com
Contents ULN2001, ULN2002, ULN2003, ULN2004
2/16 Doc ID 5279 Rev 8
Contents
1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ULN2001, ULN2002, ULN2003, ULN2004 Diagram
Doc ID 5279 Rev 8 3/16
1 Diagram
Figure 1. Schematic diagram
ULN2001 (each driver) ULN2002 (each driver)
ULN2003 (each driver) ULN2004 (each driver)
Pin configuration ULN2001, ULN2002, ULN2003, ULN2004
4/16 Doc ID 5279 Rev 8
2 Pin configuration
Figure 2. Pin connections (top view)
ULN2001, ULN2002, ULN2003, ULN2004 Maximum ratings
Doc ID 5279 Rev 8 5/16
3 Maximum ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VO Output voltage 50 V
VI
Input voltage (for ULN2002A/D - 2003A/D -
2004A/D)
30 V
IC Continuous collector current 500 mA
IB Continuous base current 25 mA
TA Operating ambient temperature range - 40 to 85 °C
TSTG Storage temperature range - 55 to 150 °C
TJ Junction temperature 150 °C
Table 3. Thermal data
Symbol Parameter DIP-16 SO-16 Unit
RthJA Thermal resistance junction-ambient, Max. 70 120 °C/W
Electrical characteristics ULN2001, ULN2002, ULN2003, ULN2004
6/16 Doc ID 5279 Rev 8
4 Electrical characteristics
TA = 25 °C unless otherwise specified.
Table 4. Electrical characteristics
Symbol Parameter Test condition Min. Typ. Max. Unit
ICEX Output leakage current
VCE = 50 V, (Figure 3.) 50
μA
TA = 85°C, VCE = 50 V (Figure 3.) 100
TA = 85°C for ULN2002, VCE = 50 V,
VI = 6 V (Figure 4.)
500
TA = 85°C for ULN2002, VCE = 50 V,
VI = 1V (Figure 4.)
500
VCE(SAT)
Collector-emitter saturation
voltage (Figure 5.)
IC = 100 mA, IB = 250 μA 0.9 1.1
IC = 200 mA, IB= 350 μA 1.1 1.3 V
IC = 350 mA, IB= 500 μA 1.3 1.6
II(ON) Input current (Figure 6.)
for ULN2002, VI = 17 V 0.82 1.25
mA
for ULN2003, VI = 3.85 V 0.93 1.35
for ULN2004, VI = 5 V 0.35 0.5
VI = 12 V 1 1.45
II(OFF) Input current (Figure 7.) TA = 85°C, IC = 500 μA 50 65 μA
VI(ON) Input voltage (Figure 8.)
VCE= 2 V, for ULN2002
IC = 300 mA
for ULN2003
IC = 200 mA
IC = 250 mA
IC = 300 mA
for ULN2004
IC = 125 mA
IC = 200 mA
IC = 275 mA
IC = 350 mA
13
2.4
2.7
3
5
6
7
8
V
hFE
DC Forward current gain
(Figure 5.)
for ULN2001, VCE = 2 V,
IC = 350 mA
1000
CI Input capacitance 15 25 pF
tPLH Turn-on delay time 0.5 VI to 0.5 VO 0.25 1 μs
tPHL Turn-off delay time 0.5 VI to 0.5 VO 0.25 1 μs
IR
Clamp diode leakage current
(Figure 9.)
VR = 50 V 50
μA
TA = 85°C, VR = 50 V 100
VF
Clamp diode forward voltage
(Figure 10.)
IF = 350 mA 1.7 2 V
ULN2001, ULN2002, ULN2003, ULN2004 Test circuits
Doc ID 5279 Rev 8 7/16
5 Test circuits
Figure 3. Output leakage current Figure 4. Output leakage current (for
ULN2002 only)
Figure 5. Collector-emitter saturation voltage Figure 6. Input current (ON)
Figure 7. Input current (OFF) Figure 8. Input voltage
Test circuits ULN2001, ULN2002, ULN2003, ULN2004
8/16 Doc ID 5279 Rev 8
Figure 9. Clamp diode leakage current Figure 10. Clamp diode forward voltage
ULN2001, ULN2002, ULN2003, ULN2004 Typical performance characteristics
Doc ID 5279 Rev 8 9/16
6 Typical performance characteristics
Figure 11. Collector current vs. saturation
voltage (TJ = 25°C)
Figure 12. Collector current vs. saturation
voltage
Figure 13. Input current vs. input voltage Figure 14. Input current vs. input voltage
(Ta = 25°C)
Figure 15. Collector current vs. input current Figure 16. hFE vs. output current
IOUT [mA]
85°C
25°C
-30°C
VCESAT [V]
IIN = 500 μA
ULN2003A
Typ
Max
Min
ULN2003A
Ta = 25°C Iout=100mA
Iout=200mA
Iout=300mA
IIN [μA]
I OUT [mA]
-30°C
85°C
25°C
VCE = 2 V
1
10
100
1000
10000
1 10 100 1000
DC Current Transfer Ratio (hFE)
Output current IOUT [mA]
85 °C
-40 °C
25 °C
VCE = 2 V
Typical performance characteristics ULN2001, ULN2002, ULN2003, ULN2004
10/16 Doc ID 5279 Rev 8
Figure 17. Peak collector current vs. duty
cycle (DIP-16)
Figure 18. Peak collector current vs. duty
cycle (SO-16)
0 20 40 60 80 DC
0
100
200
300
400
500
Ic peak
(mA)
Tamb=70°C
(DIP16)
7 6 5 4 3 2
NUMBER OF ACTIVE OUTPUT
D96IN451
0 20 40 60 80 100 DC
0
100
200
300
400
500
Ic peak
(mA)
D96IN452A
7
5
3
2
NUMBER OF ACTIVE OUTPUT
Tamb=70°C
(SO16)
ULN2001, ULN2002, ULN2003, ULN2004 Package mechanical data
Doc ID 5279 Rev 8 11/16
7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5. DIP-16L mechanical data
Dim.
mm.
Min. Typ. Max.
A 5.33
A1 0.38
A2 2.92 3.30 4.95
b 0.36 0.46 0.56
b2 1.14 1.52 1.78
c 0.20 0.25 0.36
D 18067 19.18 19.69
E 7.62 7.87 8.26
E1 6.10 6.35 7.11
e 2.54
e1 17.78
eA 7.62
eB 10.92
L 2.92 3.30 3.81
Package mechanical data ULN2001, ULN2002, ULN2003, ULN2004
12/16 Doc ID 5279 Rev 8
Figure 19. DIP-16L package dimensions
0015895_E
ULN2001, ULN2002, ULN2003, ULN2004 Package mechanical data
Doc ID 5279 Rev 8 13/16
Table 6. SO-16 narrow mechanical data
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A 1.75 0.069
a1 0.1 0.25 0.004 0.009
a2 1.6 0.063
b 0.35 0.46 0.014 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.020
c1 45° (typ.)
D(1) 9.8 10 0.386 0.394
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F(1) 3.8 4.0 0.150 0.157
G 4.60 5.30 0.181 0.208
L 0.4 1.27 0.150 0.050
M 0.62 0.024
S 8° (max.)
Figure 20. SO-16 package dimensions
Order codes ULN2001, ULN2002, ULN2003, ULN2004
14/16 Doc ID 5279 Rev 8
8 Order codes
Table 7. Order codes
Part numbers Packages
ULN2001A DIP-16
ULN2002A DIP-16
ULN2003A DIP-16
ULN2004A DIP-16
ULN2001D1013TR SO-16 in tape and reel
ULN2002D1013TR SO-16 in tape and reel
ULN2003D1013TR SO-16 in tape and reel
ULN2004D1013TR SO-16 in tape and reel
ULN2001, ULN2002, ULN2003, ULN2004 Revision history
Doc ID 5279 Rev 8 15/16
9 Revision history
Table 8. Revision history
Date Revision Changes
05-Dec-2006 5 Order code updated and document reformatted.
28-Aug-2007 6 Added Table 1 in cover page.
07-May-2012 7
Modified: Figure 12 on page 9.
Added: Figure 13, 14, 15 and Figure 16 on page 9.
01-Jun-2012 8
Updated: DIP-16L package mechanical data Table 5 on page 11 and
Figure 19 on page 12.
ULN2001, ULN2002, ULN2003, ULN2004
16/16 Doc ID 5279 Rev 8
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Smart street lighting solutions
GPRS/3G
network
Data flow
Contents
Goals and design of street lighting
Smart street lighting
From incandescent lamps to HID and LED: today’s highest luminous performances
The advantages of electronic ballasts for HID lamps: ST’s solutions
Using LEDs in street lighting: ST’s solutions
Smart communication system: wireless and wired
Real-time lamppost fall detection using MEMS
A complete solution for smart street lighting
Goals and design of street lighting
Goals
Design principles
Ensure maximum visual safety for drivers and pedestrians
Improve visibility of people and objects
Provide the best light quality and the highest color rendering
Make residential areas surer
Enhance street furniture appearance
Energy efficient
Reliable and safe
Technically advanced
Cost effective
Convenient for maintenance
What is smart street lighting?
Enables smart cities with highly-efficient street light driving, advanced
monitoring and remote control
GPRS/3G
network
Data flow
Lamp controller with
connectivity
PDA with RF
connectivity
District data
concentrator
Services
center
Reduced maintenance costs
Reduced energy consumption
Performance and energy-consumption data at your fingertips
Reduced greenhouse gas emissions
Greater citizen satisfaction
Why smart street lighting?
From incandescent lamps to HID, LED
Inefficient light sources such as incandescent lamps will be phased out
LED technology will push the lighting market
HID and HB LED offer outstanding luminous efficiency
Source: U.S Department of energy 2004, Philips Lighting 2005
HID, LED: highest performances
Ignition at very high voltage
Warm-up phase is required
Steady-state phase with lamp power control is needed
Different performances according to the metals and filler materials
High pressure sodium (up to 150 lm/W)
Metal halide (up to 110 lm/W)
Mercury vapor (up to 60 lm/W)
A LED is activated when a DC voltage is applied
The luminous flux and dominant wavelength are controlled by average current
The ripple current has to be kept at acceptable levels
Dimming can be implemented through digital or analog control
Best LED efficiency: 150 lm/W High intensity discharge (HID) Light emitting diode (LED) Source: OSRAM
Electronic ballasts for HID lamps
Increased lamp life
Enhanced lumen constancy with life
10-15% lower energy consumption than magnetic ballasts
More reliable lamp operation (end of life protection)
Electronic ballasts are smaller than electromagnetic ballasts
Electronics allow smart communication
Lamp controller with connectivity
Source: Philips Lighting
Input: 185 to 265 VAC, 50 Hz
Load: 150 W MH or HPS lamp
PF = 0.99, THD = 2.8%
Dimmable
Average efficiency: 90%
EN55015 compliant
Remote control interfacing by PLM
150 W electronic ballast for HID lamps
ESICOM order code: STEVAL-ILH005V2* Description and purpose
Key features
2-stage electronic ballast for 150 W HID (high-intensity discharge) lamp, including a boost converter (PFC) working in transition mode (TM), and a full bridge inverter to drive a lamp with a low-frequency square wave Key products STF10NM60ND; STGF10NC60SD; STTH1L06; STTH1R06; VIPer16L; L6562A; L6388E; TS272; ST7FLITE39F2 * Available in Q1/2012
Wide input voltage range
High power factor (up to 0.998) and very low THD (5%)
PFC boost working in TM
Half bridge based on power MOSFETs
Controls the igniter circuit
Implements buck converter in TM
Provides alternate low frequency square wave current
Overvoltage and short-circuit protection
Suitable for HPS and MH lamps
70 W electronic ballast for HID lamps ESICOM order code: STEVAL-ILH004V1* Description and purpose Key features
Fully digital ballast to drive 70 W HID lamps, based on two ICs, the digital combo driver L6382D5 and a low-cost 8-bit microcontroller, able to manage the PFC and the half bridge stage
Key products
L6382D5; STF8NM60ND; STTH1L06;
VIPer16L; ST7LITE49K2; LIC01. * Available in Q1/2012
Source of graphic: RUUD lighting
LED HID
Using LEDs in street lighting
The green way to lowering energy costs
Low power consumption
Long lumen constancy
Long and predictable lifetime
Light emission can be easily redirected
Reliability (robust against shock and vibration)
Environment friendly (CO2 saving and mercury free)
Quick turn on/off and dimming
100 W and above
130 W LED driver based on L6562AT and L6599AT
Input mains range: 85 to 305 VAC
SMPS output voltage: 48 V at 2.7 A
Long life time, electrolytic capacitors are not used
Mains harmonics: meet EN61000-3-2 Class-C
Efficiency at full load: > 93%
EMI: meets EN55022-Class-B, EN55015
Digital dimming
ESICOM order code: EVL130W-STRLIG, EVL130W-SL-EU, EVL6562A-LED Description and purpose Key features The system is composed of three stages:
a front-end PFC
an LLC resonant converter
an inverse buck converter The key benefits are very high efficiency, long term reliability and small form factor
Key products
L6562AT, L6599AT, STF21NM60N, STD10NM60N, SEA05, STTH3L06U, STPS1L60A, STPS2H100A, STN3NF06
Wide input voltage range: 88 to 265 VAC
LED current set to 350 mA, 700 mA and 1 A
High efficiency (~90%) and high power factor
Universal PWM input for dimming (ext. board required)
Non-isolated SMPS
Brightness regulation between 0% and 100%
EMI filter implemented
EN55015 and EN61000-3-2 compliant
80 W and above
80 W offline LED driver with dimming based on L6562A
ESICOM order code: STEVAL-ILL013V1
Description and purpose Key features
An innovative non-isolated solution for driving LEDs where high power factor, high efficiency and individual LED brightness regulation is required
PFC boost, inverse buck converter Key products L6562A, STTH1L06A, STF10NM50N, STP8NM50N , STPSC806D, BUX87
Input voltage range: 185 to 265 VAC
Able to drive single LED String
Provides 350 mA to 0.5 A constant current for LED
Max output voltage: 130 VDC
No input electrolytic capacitor
Efficiency: from 91% to 92.5%
PF > 0.95
Maximum 2fLINE output ripple: 1.0%
Up to 75 W ESICOM order code: STEVAL-ILL042V1* Description and purpose Key features Key products L6562AT; STP7N95K3; TSM101; 1.5KE350A; STTH1L06; STTH2L06
Single-stage isolated solution based on L6562AT and TSM101, offering high performance with a simple and reliable design for LED street lighting
High power factor flyback
60 W offline LED driver for single LED string based on L6562AT
* Available in Q1/2012
Digital constant-current controller for multi-string LED driving based on STM8S
Input DC bus voltage: 48 V
Independent LED string average current control
Inverse buck topology
System power: 120 W
Switching frequency: 100 kHz
Ripple current <10%
Global dimming from 0% to 100% at 225 Hz (PWM dimming)
Independent analog dimming on 4 channels
Short-circuit protection
Innovative multi-string LED driving
ESICOM order code: STEVAL-ILL031V1 Description and purpose Key features Key products STM8S208RB; STPS1L60; STN3NF06
Complete platform (HW/SW) for LED multi-string constant-current control based on an innovative methodology
Each LED string can be dimmed and brightened independently
System can be interfaced with ZigBee or PLM modules for remote control
Smart communication
GPRS/3G
network
Data flow
Dimming level, adjust on/off timing, lamp failure, consumed
energy, lamp-burning hours, lamppost tilt, etc.
Highway: simple linear topology City centre: complex topology
Wireless network solution STM32W108xx: 32-bit MCU ARM Cortex-M3 ZigBee system on chip SPZB32W1x2.1: ZigBee PRO modules based on the STM32W chipset M24LR64-R: 64-Kbit Dual Interface EEPROM (I²C and ISO 15693 RF protocol at 13.56 MHz)
IEEE 802.15.4 - ZigBee® network
A mesh topology is used to reach the data concentrator
A network for each district is identified by its PANID
Lamppost’s node configuration using RFID EEPROM which can be written/read during both manufacturing process and installation procedure by the PDA C
R1 R2 N2 R3 N4 N3 N1 Data concentrator/ network coordinator Router lamppost End node lamppost STM32W or SPZB32W1x2.1
M24LR64-R Lamppost communication mode
PLC wired network solution STM32F103xx: 32-bit MCU ARM Cortex-M3 microcontroller M24LR64-R: 64-Kbit Dual Interface EEPROM (I²C and ISO 15693 RF protocol at 13.56 MHz) ST7570: IEC 61334-5-1 compliant PLM ST7540: FSK stripped down power line transceiver
IEC 61334-5-1 power line communication network (ST7570) or proprietary protocol (ST7540)
Configured to work in CENELEC band B or C to avoid interference with AMR network
Data repeaters are used to reach the data concentrator
A network for each district identified by unique identification
Node configuration using RFID EEPROM which can be written/read during both manufacturing process and installation procedure by the PDA C R1 R2 N2 R3 N4 N3 N1 Data concentrator/ network initiator Repeater lamppost
End node lamppost STM32F
ST7570 or ST7540 Lamppost communication mode M24LR64-R
Data concentrator STM32F107xx: 32-bit MCU ARM Cortex-M3 microcontroller with Ethernet M24LR64-R: 64-Kbit Dual Interface EEPROM (I²C and ISO 15693 RF protocol at 13.56 MHz) ST7570: IEC 61334-5-1 compliant PLM ST7540: FSK stripped down power line transceiver STM32W108xx: 32-bit MCU ARM Cortex-M3 ZigBee system on chip SPZB32W1x2.1: ZigBee PRO modules based on the STM32W chipset M24128-Bxx: 128-Kbit EEPROM
One concentrator for each district STM32F ST7570 or ST7540 M24LR64-R STM32W or SPZB32W1x2.1 GPRS module M24128-Bxx PLM option
ZigBee® option
Real-time lamppost fall detection
STM32F LIS331DLH STM32W or SPZB32W1x2.1
One low-g 3-axis accelerometer for each lamppost
Tilt angle measurement
Lamppost fall detection
Key application benefits
Road safety
Reduced maintenance cost
150 W HID lamp ballast + ST7540-based communication for networked street lighting
Solutions for smart street lighting
Lamp driver and controller
150 W high-efficiency HID lamp ballast
High reliability (up to 85°C ambient temperature)
Dimmable and EN55015 compliant
Suitable for HPS and MH lamps
Communication section
Remote control on power line
Routing policies to cover long distances without dedicated hardware resources
Allows remote turn-on/off, dimming, lamp and ballast status monitoring Description and purpose Key features
Innovative networked street lighting system with remote control and monitoring based on PLM, including a dedicated PC GUI * Available in Q1/2012 ESICOM order code: STEVAL-ILH005V2* STEVAL-IHP003V1
Thank you
For more information, visit our website:
www.st.com
Or follow the links below:
LED and general lighting
HID lighting
LED lighting
Evaluation boards
LM350
Three-terminal 3 A adjustable voltage regulators
Features
■ Guaranteed 3 A output current
■ Adjustable output down to 1.2 V
■ Line regulation typically 0.005 %/V
■ Load regulation typically 0.1 %
■ Guaranteed thermal regulation
■ Current limit constant with temperature
■ Standard 3-lead transistor package
TO-3
Table 1. Device summary
Order codes
TO-3 Temperature range
LM350K 0 to 125 °C
www.st.com
Contents LM350
2/14
Contents
1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.1 External capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.2 Load regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.3 Protection diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 Application circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
LM350 Diagram
3/14
1 Diagram
Figure 1. Schematic diagram
Pin configuration LM350
4/14
2 Pin configuration
Figure 2. Pin connections (bottom view)
LM350 Maximum ratings
5/14
3 Maximum ratings
Note: Absolute maximum ratings are those values beyond which damage to the device may occur.
Functional operation under these condition is not implied
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
PD Power dissipation Internally limited
VI - VO Input-output voltage differential 35 V
TSTG Storage temperature range -65 to 150 °C
TLEAD lead temperature (Soldering, 10 seconds) 300 °C
TOP Operating junction temperature range 0 to 125 °C
Table 3. Thermal data
Symbol Parameter Value Unit
RthJC Thermal resistance junction-case 1.5 °C/W
RthJA Thermal resistance junction-ambient 35 °C/W
Electrical characteristics LM350
6/14
4 Electrical characteristics
Table 4. Electrical characteristics (VI -VO = 5V, IO = 1.5 A. Although power dissipation is internally
limited, these specifications apply to power dissipation up to 30 W, unless otherwise
specified)
Symbol Parameter Test conditions Min. Typ. Max. Unit
KVI Line regulation (1)
1. Regulation is measured at constant junction temperature. Changes in output voltage due to heating effects are taken into
account separately by thermal rejection.
Ta = 25°C, VI - VO = 3 to 35 V 0.005 0.03 %/V
KVO Load regulation (1) Ta = 25°C
IO = 10 mA to 3 A
VO ≤ 5 V 5 25 mV
VO ≥ 5 V 0.1 0.5 %
Thermal regulation Pulse = 20 ms 0.002 0.02 %/W
IADJ Adjustment pin current 50 100 μA
ΔIADJ
Adjustment pin current
change
IL = 10 mA to 3 A, VI - VO = 3 to 35 V 0.2 5 μA
VREF Reference voltage
VI - VO = 3 to 35 V, IO = 10 mA to 3 A
P ≤ 30 W
1.19 1.24 1.29 V
KVI Line regulation (1) VI - VO = 3 to 35 V 0.02 0.05 %/V
KVO Load regulation (1) IO = 10 mA to 3 A
VO ≤ 5 V 20 70 mV
VO ≥ 5 V 0.3 1.5 %
KVT Temperature stability TJ = TMIN to TMAX 1 %
IO(MIN) Minimum load current VI - VO ≤ 35 V 3.5 10 mA
IO(MAX) Current limit VI - VO ≤ 10 V
DC 3 4.5
A
VI - VO = 30 V 1
VNO
RMS output noise
(% of VO)
Ta = 25°C, f = 10 Hz to 10 kHz 0.001 %
RVF Ripple rejection ratio
VO = 10 V, f = 120 Hz 65
dB
CADJ = 10 μF 66 86
KVH Long term stability Ta = 125°C 0.3 1 %
LM350 Typical performance
7/14
5 Typical performance
Δ Needed if device is far from filter capacitors.
* Optional-improves transient response. Output capacitors in the range of 1 μF to 100 μF of aluminium or
tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients
** VO = 1.25 V (1 + R2/R1)
Figure 3. 1.2 V to 25 V adjustable regulator
Application hints LM350
8/14
6 Application hints
In operation, the LM350 develops a nominal 1.25 V reference voltage, V(REF), between the
output and adjustment terminal. The reference voltage is impressed across program resistor
R1 and, since the voltage is constant, a constant current I1 then flows through the output set
resistor R2, giving an output voltage of:
VO = V(REF) (1+ R2 / R1) + IADJ x R2.
Since the 50 μA current from the adjustment terminal represents an error term, the LM350
was designed to minimize IADJ and make it very constant with line and load changes. To do
this, all quiescent operating current is returned to the output establishing a minimum load
current requirement. If there is insufficient load on the output, the output will rise.
6.1 External capacitors
An input bypass capacitor is recommended. A 0.1 μF disc or 1 μF solid tantalum on the input
is suitable input by passing for almost all applications. The device is more sensitive to the
absence of input bypassing when adjustment or output capacitors are used by the above
values will eliminate the possibility of problems.
The adjustment terminal can be bypassed to ground on the LM350 to improve ripple
rejection. This bypass capacitor prevents ripple form being amplified as the output voltage is
increased. With a 10 μF bypass capacitor 75 dB ripple rejection is obtainable at any output
level. Increases over 20 μF do not appreciably improve the ripple rejection at frequencies
above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to include
protection diodes to prevent the capacitor from discharging through internal low current
paths and damaging the device.
In general, the best type of capacitors to use are solid tantalum. Solid tantalum capacitors
have low impedance even at high frequencies. Depending upon capacitor construction, it
takes about 25 μF in aluminium electrolytic to equal 1 μF solid tantalum at high frequencies.
Ceramic capacitors are also good at high frequencies, but some types have a large
Figure 4. Circuit
LM350 Application hints
9/14
decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01 μF disc may
seem to work better than a 0.1 μF disc as a bypass.
Although the LM350 is stable with no output capacitors, like any feedback circuit, certain
values of external capacitance can cause excessive ringing. This occurs with values
between 500 pF and 5000 pF. A 1 μF solid tantalum (or 25 μF aluminium electrolytic) on the
output swamps this effect and insures stability.
6.2 Load regulation
The LM350 is capable of providing extremely good load regulation but a few precautions are
needed to obtain maximum performance. The current set resistor connected between the
adjustment terminal and the output terminal (usually 240 Ω) should be tied directly to the
output of the regulator rather than near the load. This eliminates line drops from appearing
effectively in series with the reference and degrading regulation. For example, a 15 V
regulator with 0.05 Ω resistance between the regulator and load will have a load regulation
due to line resistance of 0.05 Ω x IL. If the set resistor is connected near the load the
effective line resistance will be 0.05 Ω (1 + R2/R1) or in this case, 11.5 times worse.
Figure 5 shows the effect of resistance between the regulator and 140 Ω set resistor. With
the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by
using 2 separate leads to the case. The ground of R2 can be returned near the ground of the
load to provide remote ground sensing and improve load regulation.
6.3 Protection diodes
When external capacitors are used with any IC regulator it is sometimes necessary to add
protection diodes to prevent the capacitors from discharging through low current points into
the regulator. Most 20 μF capacitors have low enough internal series resistance to deliver
20 A spikes when shorted. Although the surge is short, there is enough energy to damage
parts of the IC.
When an output capacitor is connected to a regulator and the input is shorted, the output
capacitor will discharge into the output of the regulator. The discharge current depends on
the value of the capacitor, the output voltage of the regulator, and the rate of decrease of VI.
In the LM350 this discharge path is through a large junction that is able to sustain 25 A
surge with no problem. This is not true of other types of positive regulators. For output
capacitors of 100 μF or less at output of 15 V or less, there is no need to use diodes.
The bypass capacitor on the adjustment terminal can discharge through a low current
junction. Discharge occurs when either the input or output is shorted. Internal to the LM350
is a 50 Ω resistor which limits the peak discharge current. No protection is needed for output
voltages of 25 V or less and 10 μF capacitance. Figure 6 shows an LM350 with protection
diodes included for use with outputs greater than 25 V and high values of output
capacitance.
Application circuits LM350
10/14
7 Application circuits
Figure 5. Regulator with line resistance in output lead
Figure 6. Regulator with protection diodes
LM350 Package mechanical data
11/14
8 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Package mechanical data LM350
12/14
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A 11.85 0.466
B 0.96 1.05 1.10 0.037 0.041 0.043
C 1.70 0.066
D 8.7 0.342
E 20.0 0.787
G 10.9 0.429
N 16.9 0.665
P 26.2 1.031
R 3.88 4.09 0.152 0.161
U 39.5 1.555
V 30.10 1.185
TO-3 mechanical data
P003C/C
E
B
R
C
P A D
G
N
V
U
O
LM350 Revision history
13/14
9 Revision history
Table 5. Document revision history
Date Revision Changes
29-Sep-2006 1
11-Feb-2008 2 Added: Table 1 on page 1.
LM350
14/14
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
VND920P-E
Double channel high-side driver
Features
■