8-bit Atmel Microcontroller with 64K/128K/256K - Farnell Element 14 - Revenir à l'accueil

 

 

Branding Farnell element14 (France)

 

Farnell Element 14 :

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Everything You Need To Know About Arduino

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Tutorial 01 for Arduino: Getting Acquainted with Arduino

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The Cube® 3D Printer

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What's easier- DIY Dentistry or our new our website features?

 

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Ben Heck's Getting Started with the BeagleBone Black Trailer

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Ben Heck's Home-Brew Solder Reflow Oven 2.0 Trailer

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Get Started with Pi Episode 3 - Online with Raspberry Pi

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Discover Simulink Promo -- Exclusive element14 Webinar

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Ben Heck's TV Proximity Sensor Trailer

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Ben Heck's PlayStation 4 Teardown Trailer

See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…

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Get Started with Pi Episode 4 - Your First Raspberry Pi Project

Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.

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Ben Heck Anti-Pickpocket Wallet Trailer

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Molex Earphones - The 14 Holiday Products of Newark element14 Promotion

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Tripp Lite Surge Protector - The 14 Holiday Products of Newark element14 Promotion

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Microchip ChipKIT Pi - The 14 Holiday Products of Newark element14 Promotion

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Beagle Bone Black - The 14 Holiday Products of Newark element14 Promotion

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3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

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3M Colored Duct Tape - The 14 Holiday Products of Newark element14 Promotion

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Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

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Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

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Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

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Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

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Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

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Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

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Dymo RHINO 6000 Label Printer - The 14 Holiday Products of Newark element14 Promotion

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3M LED Advanced Lights A-19 - The 14 Holiday Products of Newark element14 Promotion

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Innovative LPS Resistor Features Very High Power Dissipation

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Charge Injection Evaluation Board for DG508B Multiplexer Demo

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Ben Heck The Great Glue Gun Trailer Part 2

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Introducing element14 TV

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Ben Heck Time to Meet Your Maker Trailer

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Détecteur de composants

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Recherche intégrée

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Ben Builds an Accessibility Guitar Trailer Part 1

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Ben Builds an Accessibility Guitar - Part 2 Trailer

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PiFace Control and Display Introduction

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Flashmob Farnell

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Express Yourself in 3D with Cube 3D Printers from Newark element14

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Farnell YouTube Channel Move

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Farnell: Design with the best

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French Farnell Quest

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Altera - 3 Ways to Quickly Adapt to Changing Ethernet Protocols

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Cy-Net3 Network Module

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MC AT - Professional and Precision Series Thin Film Chip Resistors

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Solderless LED Connector

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PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701T

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3-axis Universal Motion Controller For Stepper Motor Drivers: TMC429

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Voltage Level Translation

Puce électronique / Microchip :

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Microchip - 8-bit Wireless Development Kit

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

Sans fil - Wireless :

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Microchip - 8-bit Wireless Development Kit

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Wireless Power Solutions - Wurth Electronics, Texas Instruments, CadSoft and element14

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Analog Devices - Remote Water Quality Monitoring via a Low Power, Wireless Network

Texas instrument :

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Texas Instruments - Automotive LED Headlights

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Texas Instruments - Digital Power Solutions

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Texas Instruments - Industrial Sensor Solutions

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Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

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Texas Instruments - Industrial Automation System Components

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Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

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Texas Instruments - TMS320C66x KeyStone Multicore Architecture

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Texas Instruments - Industrial Interfaces

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Texas Instruments - Concerto™ MCUs - Connectivity without compromise

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Texas Instruments - Stellaris Robot Chronos

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Texas Instruments - DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit

Ordinateurs :

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Ask Ben Heck - Connect Raspberry Pi to Car Computer

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Ben's Portable Raspberry Pi Computer Trailer

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Ben's Raspberry Pi Portable Computer Trailer 2

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Ben Heck's Pocket Computer Trailer

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Ask Ben Heck - Atari Computer

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Ask Ben Heck - Using Computer Monitors for External Displays

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Raspberry Pi Partnership with BBC Computer Literacy Project - Answers from co-founder Eben Upton

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Installing RaspBMC on your Raspberry Pi with the Farnell element14 Accessory kit

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Raspberry Pi Served - Joey Hudy

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Happy Birthday Raspberry Pi

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Raspberry Pi board B product overview

Logiciels :

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Ask Ben Heck - Best Opensource or Free CAD Software

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Tektronix FPGAView™ software makes debugging of FPGAs faster than ever!

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Ask Ben Heck - Best Open-Source Schematic Capture and PCB Layout Software

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Introduction to Cadsoft EAGLE PCB Design Software in Chinese

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Altera - Developing Software for Embedded Systems on FPGAs

Tutoriels :

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Ben Heck The Great Glue Gun Trailer Part 1

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the knode tutorial - element14

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Ben's Autodesk 123D Tutorial Trailer

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Ben's CadSoft EAGLE Tutorial Trailer

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Ben Heck's Soldering Tutorial Trailer

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Ben Heck's AVR Dev Board tutorial

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Ben Heck's Pinball Tutorial Trailer

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Ben Heck's Interface Tutorial Trailer

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First Stage with Python and PiFace Digital

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Cypress - Getting Started with PSoC® 3 - Part 2

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Energy Harvesting Challenge

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New Features of CadSoft EAGLE v6

Autres documentations :

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Features • High Performance, Low Power Atmel® AVR® 8-Bit Microcontroller • Advanced RISC Architecture – 135 Powerful Instructions – Most Single Clock Cycle Execution – 32 × 8 General Purpose Working Registers – Fully Static Operation – Up to 16 MIPS Throughput at 16MHz – On-Chip 2-cycle Multiplier • High Endurance Non-volatile Memory Segments – 64K/128K/256KBytes of In-System Self-Programmable Flash – 4Kbytes EEPROM – 8Kbytes Internal SRAM – Write/Erase Cycles:10,000 Flash/100,000 EEPROM – Data retention: 20 years at 85°C/ 100 years at 25°C – Optional Boot Code Section with Independent Lock Bits • In-System Programming by On-chip Boot Program • True Read-While-Write Operation – Programming Lock for Software Security • Endurance: Up to 64Kbytes Optional External Memory Space • Atmel® QTouch® library support – Capacitive touch buttons, sliders and wheels – QTouch and QMatrix® acquisition – Up to 64 sense channels • JTAG (IEEE std. 1149.1 compliant) Interface – Boundary-scan Capabilities According to the JTAG Standard – Extensive On-chip Debug Support – Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface • Peripheral Features – Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode – Four 16-bit Timer/Counter with Separate Prescaler, Compare- and Capture Mode – Real Time Counter with Separate Oscillator – Four 8-bit PWM Channels – Six/Twelve PWM Channels with Programmable Resolution from 2 to 16 Bits (ATmega1281/2561, ATmega640/1280/2560) – Output Compare Modulator – 8/16-channel, 10-bit ADC (ATmega1281/2561, ATmega640/1280/2560) – Two/Four Programmable Serial USART (ATmega1281/2561, ATmega640/1280/2560) – Master/Slave SPI Serial Interface – Byte Oriented 2-wire Serial Interface – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator – Interrupt and Wake-up on Pin Change • Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal Calibrated Oscillator – External and Internal Interrupt Sources – Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby • I/O and Packages – 54/86 Programmable I/O Lines (ATmega1281/2561, ATmega640/1280/2560) – 64-pad QFN/MLF, 64-lead TQFP (ATmega1281/2561) – 100-lead TQFP, 100-ball CBGA (ATmega640/1280/2560) – RoHS/Fully Green • Temperature Range: – -40°C to 85°C Industrial • Ultra-Low Power Consumption – Active Mode: 1MHz, 1.8V: 500µA – Power-down Mode: 0.1µA at 1.8V • Speed Grade: – ATmega640V/ATmega1280V/ATmega1281V: • 0 - 4MHz @ 1.8V - 5.5V, 0 - 8MHz @ 2.7V - 5.5V – ATmega2560V/ATmega2561V: • 0 - 2MHz @ 1.8V - 5.5V, 0 - 8MHz @ 2.7V - 5.5V – ATmega640/ATmega1280/ATmega1281: • 0 - 8MHz @ 2.7V - 5.5V, 0 - 16MHz @ 4.5V - 5.5V – ATmega2560/ATmega2561: • 0 - 16MHz @ 4.5V - 5.5V 8-bit Atmel Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash ATmega640/V ATmega1280/V ATmega1281/V ATmega2560/V ATmega2561/V 2549P–AVR–10/20122 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 1. Pin Configurations Figure 1-1. TQFP-pinout ATmega640/1280/2560 GND VCC PA0 (AD0) PA1 (AD1) PA2 (AD2) PA3 (AD3) PA4 (AD4) PA5 (AD5) PA6 (AD6) PA7 (AD7) PG2 (ALE) AVCC GND AREF PF0 (ADC0) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) PF7 (ADC7/TDI) 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PK0 (ADC8/PCINT16) PK1 (ADC9/PCINT17) PK2 (ADC10/PCINT18) PK3 (ADC11/PCINT19) PK4 (ADC12/PCINT20) PK5 (ADC13/PCINT21) PK6 (ADC14/PCINT22) PK7 (ADC15/PCINT23) (OC2B) PH6 (TOSC2) PG3 (TOSC1) PG4 (T4) PH7 RESET (ICP4) PL0 VCC GND XTAL2 XTAL1 PL6 PL7 GND VCC (OC0B) PG5 VCC GND (RXD2) PH0 (TXD2) PH1 (XCK2) PH2 (OC4A) PH3 (OC4B) PH4 (OC4C) PH5 (RXD0/PCINT8) PE0 (TXD0) PE1 (XCK0/AIN0) PE2 (OC3A/AIN1) PE3 (OC3B/INT4) PE4 (OC3C/INT5) PE5 (T3/INT6) PE6 (CLKO/ICP3/INT7) PE7 (SS/PCINT0) PB0 (SCK/PCINT1) PB1 (MOSI/PCINT2) PB2 (MISO/PCINT3) PB3 (OC2A/PCINT4) PB4 (OC1A/PCINT5) PB5 (OC1B/PCINT6) PB6 (OC0A/OC1C/PCINT7) PB7 PC7 (A15) PC6 (A14) PC5 (A13) PC4 (A12) PC3 (A11) PC2 (A10) PC1 (A9) PC0 (A8) PG1 (RD) PG0 (WR) (TXD1/INT3) PD3 (ICP1) PD4 (XCK1) PD5 (T1) PD6 (T0) PD7 (SCL/INT0) PD0 (SDA/INT1) PD1 (RXD1/INT2) PD2 (ICP5) PL1 (T5) PL2 (OC5A) PL3 (OC5B) PL4 PJ6 (PCINT15) PJ5 (PCINT14) PJ4 (PCINT13) PJ3 (PCINT12) PJ2 (XCK3/PCINT11) PJ1 (TXD3/PCINT10) PJ0 (RXD3/PCINT9) PJ7 (OC5C) PL5 INDEX CORNER3 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 1-2. CBGA-pinout ATmega640/1280/2560 Note: The functions for each pin is the same as for the 100 pin packages shown in Figure 1-1 on page 2. A B C D E F G H J K 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K 10 9 8 7 6 5 4 3 2 1 Top view Bottom view Table 1-1. CBGA-pinout ATmega640/1280/2560 1 2 3 4 5 6 7 8 9 10 A GND AREF PF0 PF2 PF5 PK0 PK3 PK6 GND VCC B AVCC PG5 PF1 PF3 PF6 PK1 PK4 PK7 PA0 PA2 C PE2 PE0 PE1 PF4 PF7 PK2 PK5 PJ7 PA1 PA3 D PE3 PE4 PE5 PE6 PH2 PA4 PA5 PA6 PA7 PG2 E PE7 PH0 PH1 PH3 PH5 PJ6 PJ5 PJ4 PJ3 PJ2 F VCC PH4 PH6 PB0 PL4 PD1 PJ1 PJ0 PC7 GND G GND PB1 PB2 PB5 PL2 PD0 PD5 PC5 PC6 VCC H PB3 PB4 RESET PL1 PL3 PL7 PD4 PC4 PC3 PC2 J PH7 PG3 PB6 PL0 XTAL2 PL6 PD3 PC1 PC0 PG1 K PB7 PG4 VCC GND XTAL1 PL5 PD2 PD6 PD7 PG04 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 1-3. Pinout ATmega1281/2561 Note: The large center pad underneath the QFN/MLF package is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. (RXD0/PCINT8/PDI) PE0 (TXD0/PDO) PE1 (XCK0/AIN0) PE2 (OC3A/AIN1) PE3 (OC3B/INT4) PE4 (OC3C/INT5) PE5 (T3/INT6) PE6 (ICP3/CLKO/INT7) PE7 (SS/PCINT0) PB0 (OC0B) PG5 (SCK/PCINT1) PB1 (MOSI/PCINT2) PB2 (MISO/PCINT3) PB3 (OC2A/ PCINT4) PB4 (OC1A/PCINT5) PB5 (OC1B/PCINT6) PB6 (OC0A/OC1C/PCINT7) PB7 (TOSC2) PG3 (TOSC1) PG4 RESET VCC GND XTAL2 XTAL1 (SCL/INT0) PD0 (SDA/INT1) PD1 (RXD1/INT2) PD2 (TXD1/INT3) PD3 (ICP1) PD4 (XCK1) PD5 PA3 (AD3) PA4 (AD4) PA5 (AD5) PA6 (AD6) PA7 (AD7) PG2 (ALE) PC7 (A15) PC6 (A14) PC5 (A13) PC4 (A12) PC3 (A11) PC2 (A10) PC1 (A9) PC0 (A8) PG1 (RD) PG0 (WR) AVCC GND AREF PF0 (ADC0) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) PF7 (ADC7/TDI) GND VCC PA0 (AD0) PA1 (AD1) PA2 (AD2) (T1) PD6 (T0) PD7 INDEX CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 325 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 2. Overview The ATmega640/1280/1281/2560/2561 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega640/1280/1281/2560/2561 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram CPU GND VCC RESET Power Supervision POR / BOD & RESET Watchdog Oscillator Watchdog Timer Oscillator Circuits / Clock Generation XTAL1 XTAL2 PC7..0 PORT C (8) PA7..0 PORT A (8) PORT D (8) PD7..0 PORT B (8) PB7..0 PORT E (8) PE7..0 PORT F (8) PF7..0 PORT J (8) PJ7..0 PG5..0 PORT G (6) PORT H (8) PH7..0 PORT K (8) PK7..0 PORT L (8) PL7..0 XRAM TWI SPI EEPROM JTAG 8 bit T/C 0 8 bit T/C 2 16 bit T/C 1 16 bit T/C 3 FLASH SRAM 16 bit T/C 4 16 bit T/C 5 USART 2 USART 1 USART 0 Internal Bandgap reference Analog Comparator A/D Converter USART 3 NOTE: Shaded parts only available in the 100-pin version. Complete functionality for the ADC, T/C4, and T/C5 only available in the 100-pin version.6 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 The Atmel® AVR® core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATmega640/1280/1281/2560/2561 provides the following features: 64K/128K/256K bytes of In-System Programmable Flash with Read-While-Write capabilities, 4Kbytes EEPROM, 8 Kbytes SRAM, 54/86 general purpose I/O lines, 32 general purpose working registers, Real Time Counter (RTC), six flexible Timer/Counters with compare modes and PWM, 4 USARTs, a byte oriented 2-wire Serial Interface, a 16-channel, 10-bit ADC with optional differential input stage with programmable gain, programmable Watchdog Timer with Internal Oscillator, an SPI serial port, IEEE® std. 1149.1 compliant JTAG test interface, also used for accessing the Onchip Debug system and programming and six software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or Hardware Reset. In Powersave mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except Asynchronous Timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. Atmel offers the QTouch® library for embedding capacitive touch buttons, sliders and wheelsfunctionality into AVR microcontrollers. The patented charge-transfer signal acquisition offersrobust sensing and includes fully debounced reporting of touch keys and includes Adjacent KeySuppression® (AKS™) technology for unambiguous detection of key events. The easy-to-use QTouch Suite toolchain allows you to explore, develop and debug your own touch applications. The device is manufactured using Atmel’s high-density nonvolatile memory technology. The Onchip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program running on the AVR core. The boot program can use any interface to download the application program in the application Flash memory. Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega640/1280/1281/2560/2561 is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The ATmega640/1280/1281/2560/2561 AVR is supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit emulators, and evaluation kits.7 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 2.2 Comparison Between ATmega1281/2561 and ATmega640/1280/2560 Each device in the ATmega640/1280/1281/2560/2561 family differs only in memory size and number of pins. Table 2-1 summarizes the different configurations for the six devices. 2.3 Pin Descriptions 2.3.1 VCC Digital supply voltage. 2.3.2 GND Ground. 2.3.3 Port A (PA7..PA0) Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A also serves the functions of various special features of the ATmega640/1280/1281/2560/2561 as listed on page 78. 2.3.4 Port B (PB7..PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B has better driving capabilities than the other ports. Port B also serves the functions of various special features of the ATmega640/1280/1281/2560/2561 as listed on page 79. 2.3.5 Port C (PC7..PC0) Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up Table 2-1. Configuration Summary Device Flash EEPROM RAM General Purpose I/O pins 16 bits resolution PWM channels Serial USARTs ADC Channels ATmega640 64KB 4KB 8KB 86 12 4 16 ATmega1280 128KB 4KB 8KB 86 12 4 16 ATmega1281 128KB 4KB 8KB 54 6 2 8 ATmega2560 256KB 4KB 8KB 86 12 4 16 ATmega2561 256KB 4KB 8KB 54 6 2 88 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port C also serves the functions of special features of the ATmega640/1280/1281/2560/2561 as listed on page 82. 2.3.6 Port D (PD7..PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATmega640/1280/1281/2560/2561 as listed on page 83. 2.3.7 Port E (PE7..PE0) Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port E output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up resistors are activated. The Port E pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port E also serves the functions of various special features of the ATmega640/1280/1281/2560/2561 as listed on page 86. 2.3.8 Port F (PF7..PF0) Port F serves as analog inputs to the A/D Converter. Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins can provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port F pins that are externally pulled low will source current if the pull-up resistors are activated. The Port F pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will be activated even if a reset occurs. Port F also serves the functions of the JTAG interface. 2.3.9 Port G (PG5..PG0) Port G is a 6-bit I/O port with internal pull-up resistors (selected for each bit). The Port G output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port G pins that are externally pulled low will source current if the pull-up resistors are activated. The Port G pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port G also serves the functions of various special features of the ATmega640/1280/1281/2560/2561 as listed on page 90. 2.3.10 Port H (PH7..PH0) Port H is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port H output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port H pins that are externally pulled low will source current if the pull-up9 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 resistors are activated. The Port H pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port H also serves the functions of various special features of the ATmega640/1280/2560 as listed on page 92. 2.3.11 Port J (PJ7..PJ0) Port J is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port J output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port J pins that are externally pulled low will source current if the pull-up resistors are activated. The Port J pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port J also serves the functions of various special features of the ATmega640/1280/2560 as listed on page 94. 2.3.12 Port K (PK7..PK0) Port K serves as analog inputs to the A/D Converter. Port K is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port K output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port K pins that are externally pulled low will source current if the pull-up resistors are activated. The Port K pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port K also serves the functions of various special features of the ATmega640/1280/2560 as listed on page 96. 2.3.13 Port L (PL7..PL0) Port L is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port L output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port L pins that are externally pulled low will source current if the pull-up resistors are activated. The Port L pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port L also serves the functions of various special features of the ATmega640/1280/2560 as listed on page 98. 2.3.14 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in “System and Reset Characteristics” on page 372. Shorter pulses are not guaranteed to generate a reset. 2.3.15 XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit. 2.3.16 XTAL2 Output from the inverting Oscillator amplifier.10 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 2.3.17 AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. 2.3.18 AREF This is the analog reference pin for the A/D Converter.11 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 3. Resources A comprehensive set of development tools and application notes, and datasheets are available for download on http://www.atmel.com/avr. 4. About Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. These code examples assume that the part specific header file is included before compilation. For I/O registers located in extended I/O map, "IN", "OUT", "SBIS", "SBIC", "CBI", and "SBI" instructions must be replaced with instructions that allow access to extended I/O. Typically "LDS" and "STS" combined with "SBRS", "SBRC", "SBR", and "CBR". 5. Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 ppm over 20 years at 85°C or 100 years at 25°C. 6. Capacitive touch sensing The Atmel®QTouch® Library provides a simple to use solution to realize touch sensitive interfaces on most Atmel AVR® microcontrollers. The QTouch Library includes support for the QTouch and QMatrix® acquisition methods. Touch sensing can be added to any application by linking the appropriate Atmel QTouch Library for the AVR Microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the touch sensing API’s to retrieve the channel information and determine the touch sensor states. The QTouch Library is FREE and downloadable from the Atmel website at the following location: www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the Atmel QTouch Library User Guide - also available for download from the Atmel website.12 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 7. AVR CPU Core 7.1 Introduction This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 7.2 Architectural Overview Figure 7-1. Block Diagram of the AVR Architecture In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is In-System Reprogrammable Flash memory. Flash Program Memory Instruction Register Instruction Decoder Program Counter Control Lines 32 x 8 General Purpose Registers ALU Status and Control I/O Lines EEPROM Data Bus 8-bit Data SRAM Direct Addressing Indirect Addressing Interrupt Unit SPI Unit Watchdog Timer Analog Comparator I/O Module 2 I/O Module1 I/O Module n13 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 The fast-access Register File contains 32 × 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every program memory address contains a 16-bit or 32-bit instruction. Program Flash memory space is divided in two sections, the Boot Program section and the Application Program section. Both sections have dedicated Lock bits for write and read/write protection. The SPM instruction that writes into the Application Flash memory section must reside in the Boot Program section. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. In addition, the ATmega640/1280/1281/2560/2561 has Extended I/O space from 0x60 - 0x1FF in SRAM where only the ST/STS/STD and LD/LDS/LDD instructions can be used. 7.3 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction Set Summary” on page 416 for a detailed description.14 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 7.4 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the “Instruction Set Summary” on page 416. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. 7.4.1 SREG – AVR Status Register The AVR Status Register – SREG – is defined as: • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the “Instruction Set Summary” on page 416. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is useful in BCD arithmetic. See the “Instruction Set Summary” on page 416 for detailed information. • Bit 4 – S: Sign Bit, S = N ⊕ V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Summary” on page 416 for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Summary” on page 416 for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Summary” on page 416 for detailed information. Bit 7 6 5 4 3 2 1 0 0x3F (0x5F) I T H S V N Z C SREG Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 015 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Summary” on page 416 for detailed information. • Bit 0 – C: Carry Flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set Summary” on page 416 for detailed information. 7.5 General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 7-2 shows the structure of the 32 general purpose working registers in the CPU. Figure 7-2. AVR CPU General Purpose Working Registers Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 7-2, each register is also assigned a data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file. 7.5.1 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 7-3 on page 16. 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 … R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte16 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 7-3. The X-, Y-, and Z-registers In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the “Instruction Set Summary” on page 416 for details). 7.6 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x0200. The initial value of the stack pointer is the last address of the internal SRAM. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two for ATmega640/1280/1281 and three for ATmega2560/2561 when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two for ATmega640/1280/1281 and three for ATmega2560/2561 when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 15 XH XL 0 X-register 7 07 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 07 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 70 7 0 R31 (0x1F) R30 (0x1E) Bit 15 14 13 12 11 10 9 8 0x3E (0x5E) SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH 0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 76543210 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 1 0 0 0 0 1 1111111117 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 7.6.1 RAMPZ – Extended Z-pointer Register for ELPM/SPM For ELPM/SPM instructions, the Z-pointer is a concatenation of RAMPZ, ZH, and ZL, as shown in Figure 7-4. Note that LPM is not affected by the RAMPZ setting. Figure 7-4. The Z-pointer used by ELPM and SPM The actual number of bits is implementation dependent. Unused bits in an implementation will always read as zero. For compatibility with future devices, be sure to write these bits to zero. 7.6.2 EIND – Extended Indirect Register For EICALL/EIJMP instructions, the Indirect-pointer to the subroutine/routine is a concatenation of EIND, ZH, and ZL, as shown in Figure 7-5. Note that ICALL and IJMP are not affected by the EIND setting. Figure 7-5. The Indirect-pointer used by EICALL and EIJMP The actual number of bits is implementation dependent. Unused bits in an implementation will always read as zero. For compatibility with future devices, be sure to write these bits to zero. 7.7 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 7-6 on page 18 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Bit 7 6 5 4 3 2 1 0 0x3B (0x5B) RAMPZ7 RAMPZ6 RAMPZ5 RAMPZ4 RAMPZ3 RAMPZ2 RAMPZ1 RAMPZ0 RAMPZ Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit (Individually) 7 0 7 07 0 RAMPZ ZH ZL Bit (Z-pointer) 23 16 15 8 7 0 Bit 7 6 5 4 3 2 1 0 0x3C (0x5C) EIND7 EIND6 EIND5 EIND4 EIND3 EIND2 EIND1 EIND0 EIND Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit (Individually) 7 07 07 0 EIND ZH ZL Bit (Indirectpointer) 23 16 15 8 7 018 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 7-6. The Parallel Instruction Fetches and Instruction Executions Figure 7-7 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 7-7. Single Cycle ALU Operation 7.8 Reset and Interrupt Handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate program vector in the program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. Depending on the Program Counter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12 are programmed. This feature improves software security. See the section “Memory Programming” on page 335 for details. The lowest addresses in the program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 105. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSEL bit in the MCU Control Register (MCUCR). Refer to “Interrupts” on page 105 for more information. The Reset Vector can also be moved to the start of the Boot Flash section by programming the BOOTRST Fuse, see “Memory Programming” on page 335. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. clk 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch T1 T2 T3 T4 CPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back T1 T2 T3 T4 clkCPU19 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence. When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in this example. Assembly Code Example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ __disable_interrupt(); EECR |= (1< xxx ; .org 0x1F002 0x1F002 jmp EXT_INT0 ; IRQ0 Handler 0x1F004 jmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x1FO70 jmp USART3_TXC ; USART3 TX Complete Handler 0x0040 jmp TIM3_COMPA ; Timer3 CompareA Handler 0x0042 jmp TIM3_COMPB ; Timer3 CompareB Handler 0x0044 jmp TIM3_COMPC ; Timer3 CompareC Handler 0x0046 jmp TIM3_OVF ; Timer3 Overflow Handler 0x0048 jmp USART1_RXC ; USART1 RX Complete Handler 0x004A jmp USART1_UDRE ; USART1,UDR Empty Handler 0x004C jmp USART1_TXC ; USART1 TX Complete Handler 0x004E jmp TWI ; 2-wire Serial Handler 0x0050 jmp SPM_RDY ; SPM Ready Handler 0x0052 jmp TIM4_CAPT ; Timer4 Capture Handler 0x0054 jmp TIM4_COMPA ; Timer4 CompareA Handler 0x0056 jmp TIM4_COMPB ; Timer4 CompareB Handler 0x0058 jmp TIM4_COMPC ; Timer4 CompareC Handler 0x005A jmp TIM4_OVF ; Timer4 Overflow Handler 0x005C jmp TIM5_CAPT ; Timer5 Capture Handler 0x005E jmp TIM5_COMPA ; Timer5 CompareA Handler 0x0060 jmp TIM5_COMPB ; Timer5 CompareB Handler 0x0062 jmp TIM5_COMPC ; Timer5 CompareC Handler 0x0064 jmp TIM5_OVF ; Timer5 Overflow Handler 0x0066 jmp USART2_RXC ; USART2 RX Complete Handler 0x0068 jmp USART2_UDRE ; USART2,UDR Empty Handler 0x006A jmp USART2_TXC ; USART2 TX Complete Handler 0x006C jmp USART3_RXC ; USART3 RX Complete Handler 0x006E jmp USART3_UDRE ; USART3,UDR Empty Handler 0x0070 jmp USART3_TXC ; USART3 TX Complete Handler ; 0x0072 RESET: ldi r16, high(RAMEND) ; Main program start 0x0073 out SPH,r16 ; Set Stack Pointer to top of RAM 0x0074 ldi r16, low(RAMEND) 0x0075 out SPL,r16 0x0076 sei ; Enable interrupts 0x0077 xxx ... ... ... ...109 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 When the BOOTRST Fuse is programmed and the Boot section size set to 8Kbytes, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: Address Labels Code Comments .org 0x0002 0x00002 jmp EXT_INT0 ; IRQ0 Handler 0x00004 jmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x00070 jmp USART3_TXC ; USART3 TX Complete Handler ; .org 0x1F000 0x1F000 RESET: ldi r16,high(RAMEND); Main program start 0x1F001 out SPH,r16 ; Set Stack Pointer to top of RAM 0x1F002 ldi r16,low(RAMEND) 0x1F003 out SPL,r16 0x1F004 sei ; Enable interrupts 0x1F005 xxx When the BOOTRST Fuse is programmed, the Boot section size set to 8Kbytes and the IVSEL bit in the MCUCR Register is set before any interrupts are enabled, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: Address Labels Code Comments ; .org 0x1F000 0x1F000 jmp RESET ; Reset handler 0x1F002 jmp EXT_INT0 ; IRQ0 Handler 0x1F004 jmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x1F070 jmp USART3_TXC ; USART3 TX Complete Handler ; 0x1F072 RESET: ldi r16,high(RAMEND) ; Main program start 0x1F073 out SPH,r16 ; Set Stack Pointer to top of RAM 0x1F074 ldi r16,low(RAMEND) 0x1F075 out SPL,r16 0x1F076 sei ; Enable interrupts 0x1FO77 xxx 14.3 Moving Interrupts Between Application and Boot Section The MCU Control Register controls the placement of the Interrupt Vector table, see Code Example below. For more details, see “Reset and Interrupt Handling” on page 18.110 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 14.4 Register Description 14.4.1 MCUCR – MCU Control Register • Bit 1 – IVSEL: Interrupt Vector Select When the IVSEL bit is cleared (zero), the Interrupt Vectors are placed at the start of the Flash memory. When this bit is set (one), the Interrupt Vectors are moved to the beginning of the Boot Loader section of the Flash. The actual address of the start of the Boot Flash Section is determined by the BOOTSZ Fuses. Refer to the section “Memory Programming” on page 335 for details. To avoid unintentional changes of Interrupt Vector tables, a special write procedure must be followed to change the IVSEL bit (see “Moving Interrupts Between Application and Boot Section” on page 109): 1. Write the Interrupt Vector Change Enable (IVCE) bit to one. 2. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE. Assembly Code Example Move_interrupts: ; Get MCUCR in r16, MCUCR mov r17, r16 ; Enable change of Interrupt Vectors ori r16, (1< CSn2:0 > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution. However, care must be taken if the other Timer/Counter that shares the same prescaler also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is connected to. 18.3 External Clock Source An external clock source applied to the Tn pin can be used as Timer/Counter clock (clkTn). The Tn pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 18-1 shows a functional equivalent block diagram of the Tn synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkTn pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 18-1. Tn/T0 Pin Sampling Tn_sync (To Clock Select Logic) Synchronization Edge Detector D Q D Q LE Tn D Q clkI/O170 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the Tn pin to the counter is updated. Enabling and disabling of the clock input must be done when Tn has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 18-2. Prescaler for synchronous Timer/Counters 18.4 Register Description 18.4.1 GTCCR – General Timer/Counter Control Register • Bit 7 – TSM: Timer/Counter Synchronization Mode Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the value that is written to the PSRASY and PSRSYNC bits is kept, hence keeping the corresponding prescaler reset signals asserted. This ensures that the corresponding Timer/Counters are halted and can be configured to the same value without the risk of one of them advancing during configuration. When the TSM bit is written to zero, the PSRASY and PSRSYNC bits are cleared by hardware, and the Timer/Counters start counting simultaneously. PSR10 Clear Tn Tn clkI/O Synchronization Synchronization TIMER/COUNTERn CLOCK SOURCE clkTn TIMER/COUNTERn CLOCK SOURCE clkTn CSn0 CSn1 CSn2 CSn0 CSn1 CSn2 Bit 7 6 5 4 3 2 1 0 0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR Read/Write R/W R R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0171 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 • Bit 0 – PSRSYNC: Prescaler Reset for Synchronous Timer/Counters When this bit is one, Timer/Counter0, Timer/Counter1, Timer/Counter3, Timer/Counter4 and Timer/Counter5 prescaler will be Reset. This bit is normally cleared immediately by hardware, except if the TSM bit is set. Note that Timer/Counter0, Timer/Counter1, Timer/Counter3, Timer/Counter4 and Timer/Counter5 share the same prescaler and a reset of this prescaler will affect all timers.172 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 19. Output Compare Modulator (OCM1C0A) 19.1 Overview The Output Compare Modulator (OCM) allows generation of waveforms modulated with a carrier frequency. The modulator uses the outputs from the Output Compare Unit C of the 16-bit Timer/Counter1 and the Output Compare Unit of the 8-bit Timer/Counter0. For more details about these Timer/Counters see “Timer/Counter 0, 1, 3, 4, and 5 Prescaler” on page 169 and “8- bit Timer/Counter2 with PWM and Asynchronous Operation” on page 174. Figure 19-1. Output Compare Modulator, Block Diagram When the modulator is enabled, the two output compare channels are modulated together as shown in the block diagram (see Figure 19-1). 19.2 Description The Output Compare unit 1C and Output Compare unit 2 shares the PB7 port pin for output. The outputs of the Output Compare units (OC1C and OC0A) overrides the normal PORTB7 Register when one of them is enabled (that is, when COMnx1:0 is not equal to zero). When both OC1C and OC0A are enabled at the same time, the modulator is automatically enabled. The functional equivalent schematic of the modulator is shown on Figure 19-2. The schematic includes part of the Timer/Counter units and the port B pin 7 output driver circuit. Figure 19-2. Output Compare Modulator, Schematic OC1C Pin OC1C / OC0A / PB7 Timer/Counter 1 Timer/Counter 0 OC0A PORTB7 DDRB7 D Q D Q Pin COMA01 COMA00 DATABUS OC1C / OC0A/ PB7 COM1C1 COM1C0 Modulator 1 0 OC1C D Q OC0A D Q ( From Waveform Generator ) ( From Waveform Generator ) 0 1 Vcc173 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 When the modulator is enabled the type of modulation (logical AND or OR) can be selected by the PORTB7 Register. Note that the DDRB7 controls the direction of the port independent of the COMnx1:0 bit setting. 19.2.1 Timing example Figure 19-3 illustrates the modulator in action. In this example the Timer/Counter1 is set to operate in fast PWM mode (non-inverted) and Timer/Counter0 uses CTC waveform mode with toggle Compare Output mode (COMnx1:0 = 1). Figure 19-3. Output Compare Modulator, Timing Diagram In this example, Timer/Counter2 provides the carrier, while the modulating signal is generated by the Output Compare unit C of the Timer/Counter1. The resolution of the PWM signal (OC1C) is reduced by the modulation. The reduction factor is equal to the number of system clock cycles of one period of the carrier (OC0A). In this example the resolution is reduced by a factor of two. The reason for the reduction is illustrated in Figure 19-3 at the second and third period of the PB7 output when PORTB7 equals zero. The period 2 high time is one cycle longer than the period 3 high time, but the result on the PB7 output is equal in both periods. 1 2 OC0A (CTC Mode) OC1C (FPWM Mode) PB7 (PORTB7 = 0) PB7 (PORTB7 = 1) (Period) 3 clk I/O174 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20. 8-bit Timer/Counter2 with PWM and Asynchronous Operation Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. The main features are: • Single Channel Counter • Clear Timer on Compare Match (Auto Reload) • Glitch-free, Phase Correct Pulse Width Modulator (PWM) • Frequency Generator • 10-bit Clock Prescaler • Overflow and Compare Match Interrupt Sources (TOV2, OCF2A and OCF2B) • Allows Clocking from External 32kHz Watch Crystal Independent of the I/O Clock 20.1 Overview A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 17-12. For the actual placement of I/O pins, see “Pin Configurations” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “Register Description” on page 187. The Power Reduction Timer/Counter2 bit, PRTIM2, in “PRR0 – Power Reduction Register 0” on page 56 must be written to zero to enable Timer/Counter2 module. Figure 20-1. 8-bit Timer/Counter Block Diagram Timer/Counter DATA BUS OCRnA OCRnB = = TCNTn Waveform Generation Waveform Generation OCnA OCnB = Fixed TOP Value Control Logic = 0 TOP BOTTOM Count Clear Direction TOVn (Int.Req.) OCnA (Int.Req.) OCnB (Int.Req.) TCCRnA TCCRnB clkTn ASSRn Synchronization Unit Prescaler T/C Oscillator clkI/O clkASY asynchronous mode select (ASn) Synchronized Status flags TOSC1 TOSC2 Status flags clkI/O175 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20.1.1 Registers The Timer/Counter (TCNT2) and Output Compare Register (OCR2A and OCR2B) are 8-bit registers. Interrupt request (abbreviated to Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFR2). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK2). TIFR2 and TIMSK2 are not shown in the figure. The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock source the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the Clock Select logic is referred to as the timer clock (clkT2). The double buffered Output Compare Register (OCR2A and OCR2B) are compared with the Timer/Counter value at all times. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pins (OC2A and OC2B). See “Output Compare Unit” on page 180 for details. The compare match event will also set the Compare Flag (OCF2A or OCF2B) which can be used to generate an Output Compare interrupt request. 20.1.2 Definitions Many register and bit references in this document are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 2. However, when using the register or bit defines in a program, the precise form must be used, that is, TCNT2 for accessing Timer/Counter2 counter value and so on. The definitions in Table 20-1 are also used extensively throughout the section. 20.2 Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal synchronous or an external asynchronous clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2 bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “Asynchronous Operation of Timer/Counter2” on page 184. For details on clock sources and prescaler, see “Timer/Counter Prescaler” on page 186. 20.3 Counter Unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 20-2 on page 176 shows a block diagram of the counter and its surrounding environment. Table 20-1. Definitions BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00) MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255) TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR2A Register. The assignment is dependent on the mode of operation176 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 20-2. Counter Unit Block Diagram Signal description (internal signals): count Increment or decrement TCNT2 by 1. direction Selects between increment and decrement. clear Clear TCNT2 (set all bits to zero). clkTn Timer/Counter clock, referred to as clkT2 in the following. top Signalizes that TCNT2 has reached maximum value. bottom Signalizes that TCNT2 has reached minimum value (zero). Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source, selected by the Clock Select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in the Timer/Counter Control Register (TCCR2A) and the WGM22 located in the Timer/Counter Control Register B (TCCR2B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare outputs OC2A and OC2B. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 176. The Timer/Counter Overflow Flag (TOV2) is set according to the mode of operation selected by the WGM22:0 bits. TOV2 can be used for generating a CPU interrupt. 20.4 Modes of Operation The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGM22:0) and Compare Output mode (COM2x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM2x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM2x1:0 bits control whether the output should be set, cleared, or toggled at a compare match. See “Compare Match Output Unit” on page 182. For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 183. DATA BUS TCNTn Control Logic count TOVn (Int.Req.) bottom top direction clear TOSC1 T/C Oscillator TOSC2 Prescaler clkI/O clk Tn177 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20.4.1 Normal Mode The simplest mode of operation is the Normal mode (WGM22:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV2 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 20.4.2 Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM22:0 = 2), the OCR2A Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT2) matches the OCR2A. The OCR2A defines the top value for the counter, hence also its resolution. This mode allows greater control of the compare match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 20-3. The counter value (TCNT2) increases until a compare match occurs between TCNT2 and OCR2A, and then counter (TCNT2) is cleared. Figure 20-3. CTC Mode, Timing Diagram An interrupt can be generated each time the counter value reaches the TOP value by using the OCF2A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR2A is lower than the current value of TCNT2, the counter will miss the compare match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the compare match can occur. For generating a waveform output in CTC mode, the OC2A output can be set to toggle its logical level on each compare match by setting the Compare Output mode bits to toggle mode (COM2A1:0 = 1). The OC2A value will not be visible on the port pin unless the data direction for TCNTn OCnx (Toggle) OCnx Interrupt Flag Set Period 1 2 3 4 (COMnx1:0 = 1)178 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 the pin is set to output. The waveform generated will have a maximum frequency of fOC2A = fclk_I/O/2 when OCR2A is set to zero (0x00). The waveform frequency is defined by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. 20.4.3 Fast PWM Mode Figure 20-4. Fast PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches TOP. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when WGM2:0 = 7 (see Table 20-3 on page 187). The actual OC2x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC2x Register at the compare match between OCR2x and TCNT2, and clearing (or setting) the OC2x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2A Register represent special cases when generating a PWM waveform output in the fast PWM mode. If the OCR2A is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2A equal to MAX will result f OCnx f clk_I/O 2 ⋅ ⋅ N ( ) 1 + OCRnx = ------------------------------------------------- TCNTn OCRnx Update and TOVn Interrupt Flag Set Period 1 2 3 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx Interrupt Flag Set 4 5 6 7 f OCnxPWM f clk_I/O N ⋅ 256 = ------------------179 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 in a constantly high or low output (depending on the polarity of the output set by the COM2A1:0 bits). A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC2x to toggle its logical level on each compare match (COM2x1:0 = 1). The waveform generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2A is set to zero. This feature is similar to the OC2A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 20.4.4 Phase Correct PWM Mode The phase correct PWM mode (WGM22:0 = 1 or 5) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOTTOM. TOP is defined as 0xFF when WGM22:0 = 1, and OCR2A when MGM22:0 = 5. In noninverting Compare Output mode, the Output Compare (OC2x) is cleared on the compare match between TCNT2 and OCR2x while upcounting, and set on the compare match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. In phase correct PWM mode the counter is incremented until the counter value matches TOP. When the counter reaches TOP, it changes the count direction. The TCNT2 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 20-5. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2x and TCNT2. Figure 20-5. Phase Correct PWM Mode, Timing Diagram TOVn Interrupt Flag Set OCnx Interrupt Flag Set 1 2 3 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx Update180 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM. An inverted PWM output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7 (see Table 20-4 on page 188). The actual OC2x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC2x Register at the compare match between OCR2x and TCNT2 when the counter increments, and setting (or clearing) the OC2x Register at compare match between OCR2x and TCNT2 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2A Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR2A is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. At the very start of period 2 in Figure 20-5 on page 179 OCnx has a transition from high to low even though there is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM. There are two cases that give a transition without Compare Match. • OCR2A changes its value from MAX, like in Figure 20-5 on page 179. When the OCR2A value is MAX the OCn pin value is the same as the result of a down-counting compare match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match. • The timer starts counting from a value higher than the one in OCR2A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up. 20.5 Output Compare Unit The 8-bit comparator continuously compares TCNT2 with the Output Compare Register (OCR2A and OCR2B). Whenever TCNT2 equals OCR2A or OCR2B, the comparator signals a match. A match will set the Output Compare Flag (OCF2A or OCF2B) at the next timer clock cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is executed. Alternatively, the Output Compare Flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the WGM22:0 bits and Compare Output mode (COM2x1:0) bits. The max and bottom signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation (see “Modes of Operation” on page 176). Figure 20-6 on page 181 shows a block diagram of the Output Compare unit. f OCnxPCPWM f clk_I/O N ⋅ 510 = ------------------181 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 20-6. Output Compare Unit, Block Diagram The OCR2x Register is double buffered when using any of the Pulse Width Modulation (PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR2x Compare Register to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR2x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR2x Buffer Register, and if double buffering is disabled the CPU will access the OCR2x directly. 20.5.1 Force Output Compare In non-PWM waveform generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC2x) bit. Forcing compare match will not set the OCF2x Flag or reload/clear the timer, but the OC2x pin will be updated as if a real compare match had occurred (the COM2x1:0 bits settings define whether the OC2x pin is set, cleared or toggled). 20.5.2 Compare Match Blocking by TCNT2 Write All CPU write operations to the TCNT2 Register will block any compare match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR2x to be initialized to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is enabled. 20.5.3 Using the Output Compare Unit Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT2 when using the Output Compare channel, independently of whether the Timer/Counter is running or not. If the value written to TCNT2 equals the OCR2x value, the compare match will be missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is downcounting. OCFnx (Int.Req.) = (8-bit Comparator ) OCRnx OCnx DATA BUS TCNTn WGMn1:0 Waveform Generator top FOCn COMnX1:0 bottom182 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 The setup of the OC2x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC2x value is to use the Force Output Compare (FOC2x) strobe bit in Normal mode. The OC2x Register keeps its value even when changing between Waveform Generation modes. Be aware that the COM2x1:0 bits are not double buffered together with the compare value. Changing the COM2x1:0 bits will take effect immediately. 20.6 Compare Match Output Unit The Compare Output mode (COM2x1:0) bits have two functions. The Waveform Generator uses the COM2x1:0 bits for defining the Output Compare (OC2x) state at the next compare match. Also, the COM2x1:0 bits control the OC2x pin output source. Figure 20-7 shows a simplified schematic of the logic affected by the COM2x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM2x1:0 bits are shown. When referring to the OC2x state, the reference is for the internal OC2x Register, not the OC2x pin. Figure 20-7. Compare Match Output Unit, Schematic The general I/O port function is overridden by the Output Compare (OC2x) from the Waveform Generator if either of the COM2x1:0 bits are set. However, the OC2x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC2x pin (DDR_OC2x) must be set as output before the OC2x value is visible on the pin. The port override function is independent of the Waveform Generation mode. The design of the Output Compare pin logic allows initialization of the OC2x state before the output is enabled. Note that some COM2x1:0 bit settings are reserved for certain modes of operation. See “Register Description” on page 187. PORT DDR D Q D Q OCnx OCnx Pin D Q Waveform Generator COMnx1 COMnx0 0 1 DATA BU S FOCnx clkI/O183 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20.6.1 Compare Output Mode and Waveform Generation The Waveform Generator uses the COM2x1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM2x1:0 = 0 tells the Waveform Generator that no action on the OC2x Register is to be performed on the next compare match. For compare output actions in the non-PWM modes refer to Table 20-5 on page 188. For fast PWM mode, refer to Table 20-6 on page 188, and for phase correct PWM refer to Table 20-7 on page 189. A change of the COM2x1:0 bits state will have effect at the first compare match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOC2x strobe bits. 20.7 Timer/Counter Timing Diagrams The following figures show the Timer/Counter in synchronous mode, and the timer clock (clkT2) is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should be replaced by the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are set. Figure 20-8 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. Figure 20-8. Timer/Counter Timing Diagram, no Prescaling Figure 20-9 shows the same timing data, but with the prescaler enabled. Figure 20-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) clkTn (clkI/O/1) TOVn clkI/O TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 TOVn TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8)184 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 20-10 shows the setting of OCF2A in all modes except CTC mode. Figure 20-10. Timer/Counter Timing Diagram, Setting of OCF2A, with Prescaler (fclk_I/O/8) Figure 20-11 shows the setting of OCF2A and the clearing of TCNT2 in CTC mode. Figure 20-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Prescaler (fclk_I/O/8) 20.8 Asynchronous Operation of Timer/Counter2 When Timer/Counter2 operates asynchronously, some considerations must be taken. • Warning: When switching between asynchronous and synchronous clocking of Timer/Counter2, the Timer Registers TCNT2, OCR2x, and TCCR2x might be corrupted. A safe procedure for switching clock source is: 1. Disable the Timer/Counter2 interrupts by clearing OCIE2x and TOIE2. 2. Select clock source by setting AS2 as appropriate. 3. Write new values to TCNT2, OCR2x, and TCCR2x. 4. To switch to asynchronous operation: Wait for TCN2UB, OCR2xUB, and TCR2xUB. 5. Clear the Timer/Counter2 Interrupt Flags. 6. Enable interrupts, if needed. OCFnx OCRnx TCNTn OCRnx Value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8) OCFnx OCRnx TCNTn (CTC) TOP TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8)185 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 • The CPU main clock frequency must be more than four times the Oscillator frequency. • When writing to one of the registers TCNT2, OCR2x, or TCCR2x, the value is transferred to a temporary register, and latched after two positive edges on TOSC1. The user should not write a new value before the contents of the temporary register have been transferred to its destination. Each of the five mentioned registers have their individual temporary register, which means that, for example, writing to TCNT2 does not disturb an OCR2x write in progress. To detect that a transfer to the destination register has taken place, the Asynchronous Status Register – ASSR has been implemented. • When entering Power-save or ADC Noise Reduction mode after having written to TCNT2, OCR2x, or TCCR2x, the user must wait until the written register has been updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode before the changes are effective. This is particularly important if any of the Output Compare2 interrupt is used to wake up the device, since the Output Compare function is disabled during writing to OCR2x or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode before the corresponding OCR2xUB bit returns to zero, the device will never receive a compare match interrupt, and the MCU will not wake up. • If Timer/Counter2 is used to wake the device up from Power-save or ADC Noise Reduction mode, precautions must be taken if the user wants to re-enter one of these modes: The interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and reentering sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the device will fail to wake up. If the user is in doubt whether the time before re-entering Powersave or ADC Noise Reduction mode is sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has elapsed: 1. Write a value to TCCR2x, TCNT2, or OCR2x. 2. Wait until the corresponding Update Busy Flag in ASSR returns to zero. 3. Enter Power-save or ADC Noise Reduction mode. • When the asynchronous operation is selected, the 32.768kHz Oscillator for Timer/Counter2 is always running, except in Power-down and Standby modes. After a Power-up Reset or wake-up from Power-down or Standby mode, the user should be aware of the fact that this Oscillator might take as long as one second to stabilize. The user is advised to wait for at least one second before using Timer/Counter2 after power-up or wake-up from Power-down or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost after a wake-up from Power-down or Standby mode due to unstable clock signal upon startup, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin. • Description of wake up from Power-save or ADC Noise Reduction mode when the timer is clocked asynchronously: When the interrupt condition is met, the wake up process is started on the following cycle of the timer clock, that is, the timer is always advanced by at least one before the processor can read the counter value. After wake-up, the MCU is halted for four cycles, it executes the interrupt routine, and resumes execution from the instruction following SLEEP. • Reading of the TCNT2 Register shortly after wake-up from Power-save may give an incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2 must be done through a register synchronized to the internal I/O clock domain. Synchronization takes place for every rising TOSC1 edge. When waking up from Powersave mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC clock after waking up from Power-save mode is essentially unpredictable, as it depends on the wake-up time. The recommended procedure for reading TCNT2 is thus as follows: 1. Write any value to either of the registers OCR2x or TCCR2x. 2. Wait for the corresponding Update Busy Flag to be cleared. 3. Read TCNT2.186 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 • During asynchronous operation, the synchronization of the Interrupt Flags for the asynchronous timer takes three processor cycles plus one timer cycle. The timer is therefore advanced by at least one before the processor can read the timer value causing the setting of the Interrupt Flag. The Output Compare pin is changed on the timer clock and is not synchronized to the processor clock. 20.9 Timer/Counter Prescaler Figure 20-12. Prescaler for Timer/Counter2 The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main system I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter (RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port C. A crystal can then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock source for Timer/Counter2. The Oscillator is optimized for use with a 32.768kHz crystal. By setting the EXCLK bit in the ASSR, a 32kHz external clock can be applied. See “ASSR – Asynchronous Status Register” on page 192 for details. For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64, clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected. Setting the PSRASY bit in GTCCR resets the prescaler. This allows the user to operate with a predictable prescaler. 10-BIT T/C PRESCALER TIMER/COUNTER2 CLOCK SOURCE clkI/O clkT2S TOSC1 AS2 CS20 CS21 CS22 clkT2S/8 clkT2S/64 clkT2S/128 clkT2S/1024 clkT2S/256 clkT2S/32 0 PSRASY Clear clkT2187 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20.10 Register Description 20.10.1 TCCR2A –Timer/Counter Control Register A • Bits 7:6 – COM2A1:0: Compare Match Output A Mode These bits control the Output Compare pin (OC2A) behavior. If one or both of the COM2A1:0 bits are set, the OC2A output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2A pin must be set in order to enable the output driver. When OC2A is connected to the pin, the function of the COM2A1:0 bits depends on the WGM22:0 bit setting. Table 20-2 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to a normal or CTC mode (non-PWM). Table 20-3 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 178 for more details. Table 20-4 on page 188 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to phase correct PWM mode. Bit 7 6 5 4 3 2 1 0 (0xB0) COM2A1 COM2A0 COM2B1 COM2B0 – – WGM21 WGM20 TCCR2A Read/Write R/W R/W R/W R/W R R R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 20-2. Compare Output Mode, non-PWM Mode COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 Toggle OC2A on Compare Match 1 0 Clear OC2A on Compare Match 1 1 Set OC2A on Compare Match Table 20-3. Compare Output Mode, Fast PWM Mode(1) COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 WGM22 = 0: Normal Port Operation, OC2A Disconnected WGM22 = 1: Toggle OC2A on Compare Match 1 0 Clear OC2A on Compare Match, set OC2A at BOTTOM (non-inverting mode) 1 1 Set OC2A on Compare Match, clear OC2A at BOTTOM (inverting mode)188 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page 179 for more details. • Bits 5:4 – COM2B1:0: Compare Match Output B Mode These bits control the Output Compare pin (OC2B) behavior. If one or both of the COM2B1:0 bits are set, the OC2B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2B pin must be set in order to enable the output driver. When OC2B is connected to the pin, the function of the COM2B1:0 bits depends on the WGM22:0 bit setting. Table 20-5 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to a normal or CTC mode (non-PWM). Table 20-6 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 178 for more details. Table 20-4. Compare Output Mode, Phase Correct PWM Mode(1) COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 WGM22 = 0: Normal Port Operation, OC2A Disconnected WGM22 = 1: Toggle OC2A on Compare Match 1 0 Clear OC2A on Compare Match when up-counting Set OC2A on Compare Match when down-counting 1 1 Set OC2A on Compare Match when up-counting Clear OC2A on Compare Match when down-counting Table 20-5. Compare Output Mode, non-PWM Mode COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Toggle OC2B on Compare Match 1 0 Clear OC2B on Compare Match 1 1 Set OC2B on Compare Match Table 20-6. Compare Output Mode, Fast PWM Mode(1) COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Reserved 1 0 Clear OC2B on Compare Match, set OC2B at BOTTOM (non-inverting mode) 1 1 Set OC2B on Compare Match, clear OC2B at BOTTOM (inverting mode)189 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Table 20-7 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page 179 for more details. • Bits 3, 2 – Res: Reserved Bits These bits are reserved bits and will always read as zero. • Bits 1:0 – WGM21:0: Waveform Generation Mode Combined with the WGM22 bit found in the TCCR2B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 20-8. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes (see “Modes of Operation” on page 176). Notes: 1. MAX = 0xFF. 2. BOTTOM = 0x00. Table 20-7. Compare Output Mode, Phase Correct PWM Mode(1) COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Reserved 1 0 Clear OC2B on Compare Match when up-counting Set OC2B on Compare Match when down-counting 1 1 Set OC2B on Compare Match when up-counting Clear OC2B on Compare Match when down-counting Table 20-8. Waveform Generation Mode Bit Description Mode WGM2 WGM1 WGM0 Timer/Counter Mode of Operation TOP Update of OCRx at TOV Flag Set on(1)(2) 00 0 0 Normal 0xFF Immediate MAX 10 0 1 PWM, Phase Correct 0xFF TOP BOTTOM 2 0 1 0 CTC OCRA Immediate MAX 3 0 1 1 Fast PWM 0xFF BOTTOM MAX 4 1 0 0 Reserved – – – 51 0 1 PWM, Phase Correct OCRA TOP BOTTOM 6 1 1 0 Reserved – – – 7 1 1 1 Fast PWM OCRA BOTTOM TOP190 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20.10.2 TCCR2B – Timer/Counter Control Register B • Bit 7 – FOC2A: Force Output Compare A The FOC2A bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2A bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC2A output is changed according to its COM2A1:0 bits setting. Note that the FOC2A bit is implemented as a strobe. Therefore it is the value present in the COM2A1:0 bits that determines the effect of the forced compare. A FOC2A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2A as TOP. The FOC2A bit is always read as zero. • Bit 6 – FOC2B: Force Output Compare B The FOC2B bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2B bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC2B output is changed according to its COM2B1:0 bits setting. Note that the FOC2B bit is implemented as a strobe. Therefore it is the value present in the COM2B1:0 bits that determines the effect of the forced compare. A FOC2B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2B as TOP. The FOC2B bit is always read as zero. • Bits 5:4 – Res: Reserved Bits These bits are reserved bits and will always read as zero. • Bit 3 – WGM22: Waveform Generation Mode See the description in the “TCCR2A –Timer/Counter Control Register A” on page 187. • Bit 2:0 – CS22:0: Clock Select The three Clock Select bits select the clock source to be used by the Timer/Counter, see Table 20-9 on page 191. Bit 7 6 5 4 3 2 1 0 (0xB1) FOC2A FOC2B – – WGM22 CS22 CS21 CS20 TCCR2B Read/Write W W R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0191 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. 20.10.3 TCNT2 – Timer/Counter Register The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running, introduces a risk of missing a Compare Match between TCNT2 and the OCR2x Registers. 20.10.4 OCR2A – Output Compare Register A The Output Compare Register A contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2A pin. 20.10.5 OCR2B – Output Compare Register B The Output Compare Register B contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2B pin. Table 20-9. Clock Select Bit Description CS22 CS21 CS20 Description 000 No clock source (Timer/Counter stopped) 0 0 1 clkT2S/(No prescaling) 0 1 0 clkT2S/8 (From prescaler) 0 1 1 clkT2S/32 (From prescaler) 1 0 0 clkT2S/64 (From prescaler) 1 0 1 clkT2S/128 (From prescaler) 1 1 0 clkT2S/256 (From prescaler) 1 1 1 clkT2S/1024 (From prescaler) Bit 7 6 5 4 3 2 1 0 (0xB2) TCNT2[7:0] TCNT2 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 (0xB3) OCR2A[7:0] OCR2A Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 (0xB4) OCR2B[7:0] OCR2B Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0192 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 20.10.6 ASSR – Asynchronous Status Register • Bit 6 – EXCLK: Enable External Clock Input When EXCLK is written to one, and asynchronous clock is selected, the external clock input buffer is enabled and an external clock can be input on Timer Oscillator 1 (TOSC1) pin instead of a 32kHz crystal. Writing to EXCLK should be done before asynchronous operation is selected. Note that the crystal Oscillator will only run when this bit is zero. • Bit 5 – AS2: Asynchronous Timer/Counter2 When AS2 is written to zero, Timer/Counter2 is clocked from the I/O clock, clkI/O. When AS2 is written to one, Timer/Counter2 is clocked from a crystal Oscillator connected to the Timer Oscillator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B might be corrupted. • Bit 4 – TCN2UB: Timer/Counter2 Update Busy When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set. When TCNT2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value. • Bit 3 – OCR2AUB: Output Compare Register2 Update Busy When Timer/Counter2 operates asynchronously and OCR2A is written, this bit becomes set. When OCR2A has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2A is ready to be updated with a new value. • Bit 2 – OCR2BUB: Output Compare Register2 Update Busy When Timer/Counter2 operates asynchronously and OCR2B is written, this bit becomes set. When OCR2B has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2B is ready to be updated with a new value. • Bit 1 – TCR2AUB: Timer/Counter Control Register2 Update Busy When Timer/Counter2 operates asynchronously and TCCR2A is written, this bit becomes set. When TCCR2A has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2A is ready to be updated with a new value. • Bit 0 – TCR2BUB: Timer/Counter Control Register2 Update Busy When Timer/Counter2 operates asynchronously and TCCR2B is written, this bit becomes set. When TCCR2B has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2B is ready to be updated with a new value. If a write is performed to any of the five Timer/Counter2 Registers while its update busy flag is set, the updated value might get corrupted and cause an unintentional interrupt to occur. Bit 7 6 5 4 3 2 1 0 (0xB6) – EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB ASSR Read/Write R R/W R/W RR R R R Initial Value 0 0 0 0 0 0 0 0193 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 The mechanisms for reading TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B are different. When reading TCNT2, the actual timer value is read. When reading OCR2A, OCR2B, TCCR2A and TCCR2B the value in the temporary storage register is read. 20.10.7 TIMSK2 – Timer/Counter2 Interrupt Mask Register • Bit 2 – OCIE2B: Timer/Counter2 Output Compare Match B Interrupt Enable When the OCIE2B bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match B interrupt is enabled. The corresponding interrupt is executed if a compare match in Timer/Counter2 occurs, that is, when the OCF2B bit is set in the Timer/Counter 2 Interrupt Flag Register – TIFR2. • Bit 1 – OCIE2A: Timer/Counter2 Output Compare Match A Interrupt Enable When the OCIE2A bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match A interrupt is enabled. The corresponding interrupt is executed if a compare match in Timer/Counter2 occurs, that is, when the OCF2A bit is set in the Timer/Counter 2 Interrupt Flag Register – TIFR2. • Bit 0 – TOIE2: Timer/Counter2 Overflow Interrupt Enable When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter2 occurs, that is, when the TOV2 bit is set in the Timer/Counter2 Interrupt Flag Register – TIFR2. 20.10.8 TIFR2 – Timer/Counter2 Interrupt Flag Register • Bit 2 – OCF2B: Output Compare Flag 2 B The OCF2B bit is set (one) when a compare match occurs between the Timer/Counter2 and the data in OCR2B – Output Compare Register2. OCF2B is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF2B is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2B (Timer/Counter2 Compare match Interrupt Enable), and OCF2B are set (one), the Timer/Counter2 Compare match Interrupt is executed. • Bit 1 – OCF2A: Output Compare Flag 2 A The OCF2A bit is set (one) when a compare match occurs between the Timer/Counter2 and the data in OCR2A – Output Compare Register2. OCF2A is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF2A is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2A (Timer/Counter2 Compare match Interrupt Enable), and OCF2A are set (one), the Timer/Counter2 Compare match Interrupt is executed. Bit 7 6 5 4 3 2 1 0 (0x70) – – – – – OCIE2B OCIE2A TOIE2 TIMSK2 Read/Write R R R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x17 (0x37) – – – – – OCF2B OCF2A TOV2 TIFR2 Read/Write R R R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0194 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 • Bit 0 – TOV2: Timer/Counter2 Overflow Flag The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, TOV2 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE2A (Timer/Counter2 Overflow Interrupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00. 20.10.9 GTCCR – General Timer/Counter Control Register • Bit 1 – PSRASY: Prescaler Reset Timer/Counter2 When this bit is one, the Timer/Counter2 prescaler will be reset. This bit is normally cleared immediately by hardware. If the bit is written when Timer/Counter2 is operating in asynchronous mode, the bit will remain one until the prescaler has been reset. The bit will not be cleared by hardware if the TSM bit is set. Refer to the description of the “Bit 7 – TSM: Timer/Counter Synchronization Mode” on page 170 for a description of the Timer/Counter Synchronization mode. Bit 7 6 5 4 3 2 1 0 0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR Read/Write R/W R R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0195 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 21. SPI – Serial Peripheral Interface The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the ATmega640/1280/1281/2560/2561 and peripheral devices or between several AVR devices. The ATmega640/1280/1281/2560/2561 SPI includes the following features: • Full-duplex, Three-wire Synchronous Data Transfer • Master or Slave Operation • LSB First or MSB First Data Transfer • Seven Programmable Bit Rates • End of Transmission Interrupt Flag • Write Collision Flag Protection • Wake-up from Idle Mode • Double Speed (CK/2) Master SPI Mode USART can also be used in Master SPI mode, see “USART in SPI Mode” on page 232. The Power Reduction SPI bit, PRSPI, in “PRR0 – Power Reduction Register 0” on page 56 on page 50 must be written to zero to enable SPI module. Figure 21-1. SPI Block Diagram(1) Note: 1. Refer to Figure 1-1 on page 2, and Table 13-6 on page 79 for SPI pin placement. The interconnection between Master and Slave CPUs with SPI is shown in Figure 21-2 on page 196. The system consists of two shift Registers, and a Master clock generator. The SPI Master initiates the communication cycle when pulling low the Slave Select SS pin of the desired Slave. SPI2X SPI2X DIVIDER /2/4/8/16/32/64/128196 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Master and Slave prepare the data to be sent in their respective shift Registers, and the Master generates the required clock pulses on the SCK line to interchange data. Data is always shifted from Master to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In – Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pulling high the Slave Select, SS, line. When configured as a Master, the SPI interface has no automatic control of the SS line. This must be handled by user software before communication can start. When this is done, writing a byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end of Transmission Flag (SPIF). If the SPI Interrupt Enable bit (SPIE) in the SPCR Register is set, an interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be kept in the Buffer Register for later use. When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long as the SS pin is driven high. In this state, software may update the contents of the SPI Data Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin until the SS pin is driven low. As one byte has been completely shifted, the end of Transmission Flag, SPIF is set. If the SPI Interrupt Enable bit, SPIE, in the SPCR Register is set, an interrupt is requested. The Slave may continue to place new data to be sent into SPDR before reading the incoming data. The last incoming byte will be kept in the Buffer Register for later use. Figure 21-2. SPI Master-slave Interconnection The system is single buffered in the transmit direction and double buffered in the receive direction. This means that bytes to be transmitted cannot be written to the SPI Data Register before the entire shift cycle is completed. When receiving data, however, a received character must be read from the SPI Data Register before the next character has been completely shifted in. Otherwise, the first byte is lost. In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure correct sampling of the clock signal, the minimum low and high periods should be: Low period: longer than 2 CPU clock cycles. High period: longer than 2 CPU clock cycles. When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden according to Table 21-1. For more details on automatic port overrides, refer to “Alternate Port SHIFT ENABLE197 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Functions” on page 75. Note: 1. See “Alternate Functions of Port B” on page 79 for a detailed description of how to define the direction of the user defined SPI pins. The following code examples show how to initialize the SPI as a Master and how to perform a simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by the actual data direction bits for these pins. For example, if MOSI is placed on pin PB5, replace DD_MOSI with DDB5 and DDR_SPI with DDRB. Table 21-1. SPI Pin Overrides(1) Pin Direction, Master SPI Direction, Slave SPI MOSI User Defined Input MISO Input User Defined SCK User Defined Input SS User Defined Input198 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Note: 1. See “About Code Examples” on page 11. Assembly Code Example(1) SPI_MasterInit: ; Set MOSI and SCK output, all others input ldi r17,(1<>8); UBRRL = (unsigned char)ubrr; /* Enable receiver and transmitter */ UCSRB = (1<> 1) & 0x01; return ((resh << 8) | resl); }217 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 buffer is empty (that is, does not contain any unread data). If the Receiver is disabled (RXENn = 0), the receive buffer will be flushed and consequently the RXCn bit will become zero. When the Receive Complete Interrupt Enable (RXCIEn) in UCSRnB is set, the USART Receive Complete interrupt will be executed as long as the RXCn Flag is set (provided that global interrupts are enabled). When interrupt-driven data reception is used, the receive complete routine must read the received data from UDRn in order to clear the RXCn Flag, otherwise a new interrupt will occur once the interrupt routine terminates. 22.6.4 Receiver Error Flags The USART Receiver has three Error Flags: Frame Error (FEn), Data OverRun (DORn) and Parity Error (UPEn). All can be accessed by reading UCSRnA. Common for the Error Flags is that they are located in the receive buffer together with the frame for which they indicate the error status. Due to the buffering of the Error Flags, the UCSRnA must be read before the receive buffer (UDRn), since reading the UDRn I/O location changes the buffer read location. Another equality for the Error Flags is that they can not be altered by software doing a write to the flag location. However, all flags must be set to zero when the UCSRnA is written for upward compatibility of future USART implementations. None of the Error Flags can generate interrupts. The Frame Error (FEn) Flag indicates the state of the first stop bit of the next readable frame stored in the receive buffer. The FEn Flag is zero when the stop bit was correctly read (as one), and the FEn Flag will be one when the stop bit was incorrect (zero). This flag can be used for detecting out-of-sync conditions, detecting break conditions and protocol handling. The FEn Flag is not affected by the setting of the USBSn bit in UCSRnC since the Receiver ignores all, except for the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to UCSRnA. The Data OverRun (DORn) Flag indicates data loss due to a receiver buffer full condition. A Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in the Receive Shift Register, and a new start bit is detected. If the DORn Flag is set there was one or more serial frame lost between the frame last read from UDRn, and the next frame read from UDRn. For compatibility with future devices, always write this bit to zero when writing to UCSRnA. The DORn Flag is cleared when the frame received was successfully moved from the Shift Register to the receive buffer. The Parity Error (UPEn) Flag indicates that the next frame in the receive buffer had a Parity Error when received. If Parity Check is not enabled the UPEn bit will always be read zero. For compatibility with future devices, always set this bit to zero when writing to UCSRnA. For more details see “Parity Bit Calculation” on page 210 and “Parity Checker” on page 217. 22.6.5 Parity Checker The Parity Checker is active when the high USART Parity mode (UPMn1) bit is set. Type of Parity Check to be performed (odd or even) is selected by the UPMn0 bit. When enabled, the Parity Checker calculates the parity of the data bits in incoming frames and compares the result with the parity bit from the serial frame. The result of the check is stored in the receive buffer together with the received data and stop bits. The Parity Error (UPEn) Flag can then be read by software to check if the frame had a Parity Error. The UPEn bit is set if the next character that can be read from the receive buffer had a Parity Error when received and the Parity Checking was enabled at that point (UPMn1 = 1). This bit is valid until the receive buffer (UDRn) is read.218 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 22.6.6 Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing receptions will therefore be lost. When disabled (that is, the RXENn is set to zero) the Receiver will no longer override the normal function of the RxDn port pin. The Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in the buffer will be lost. 22.6.7 Flushing the Receive Buffer The receiver buffer FIFO will be flushed when the Receiver is disabled, that is, the buffer will be emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal operation, due to for instance an error condition, read the UDRn I/O location until the RXCn Flag is cleared. The following code example shows how to flush the receive buffer. Note: 1. See “About Code Examples” on page 11. 22.7 Asynchronous Data Reception The USART includes a clock recovery and a data recovery unit for handling asynchronous data reception. The clock recovery logic is used for synchronizing the internally generated baud rate clock to the incoming asynchronous serial frames at the RxDn pin. The data recovery logic samples and low pass filters each incoming bit, thereby improving the noise immunity of the Receiver. The asynchronous reception operational range depends on the accuracy of the internal baud rate clock, the rate of the incoming frames, and the frame size in number of bits. 22.7.1 Asynchronous Clock Recovery The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 22-5 on page 219 illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double Speed mode. The horizontal arrows illustrate the synchronization variation due to the sampling process. Note the larger time variation when using the Double Speed mode (U2Xn = 1) of operation. Samples denoted zero are samples done when the RxDn line is idle (that is, no communication activity). Assembly Code Example(1) USART_Flush: sbis UCSRnA, RXCn ret in r16, UDRn rjmp USART_Flush C Code Example(1) void USART_Flush( void ) { unsigned char dummy; while ( UCSRnA & (1< 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz High: > 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz 30.8.2 Serial Programming Algorithm When writing serial data to the ATmega640/1280/1281/2560/2561, data is clocked on the rising edge of SCK. When reading data from the ATmega640/1280/1281/2560/2561, data is clocked on the falling edge of SCK. See Figure 30-12 on page 353 for timing details. To program and verify the ATmega640/1280/1281/2560/2561 in the serial programming mode, the following sequence is recommended (see four byte instruction formats in Table 30-17 on Table 30-15. Pin Mapping Serial Programming Symbol Pins (TQFP-100) Pins (TQFP-64) I/O Description PDI PB2 PE0 I Serial Data in PDO PB3 PE1 O Serial Data out SCK PB1 PB1 I Serial Clock VCC GND XT AL1 SCK PDO PDI RESET +1.8V - 5.5V AVCC +1.8V - 5.5V(2)351 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 page 352): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0”. 2. Wait for at least 20ms and enable serial programming by sending the Programming Enable serial instruction to pin PDI. 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 7 LSB of the address and data together with the Load Program Memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program Memory Page is stored by loading the Write Program Memory Page instruction with the address lines 15:8. Before issuing this command, make sure the instruction Load Extended Address Byte has been used to define the MSB of the address. The extended address byte is stored until the command is re-issued, that is, the command needs only be issued for the first page, and when crossing the 64KWord boundary. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page (see Table 30- 16). Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling is not used, the user must wait at least tWD_EEPROM before issuing the next byte (see Table 30-16). In a chip erased device, no 0xFFs in the data file(s) need to be programmed. 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output PDO. When reading the Flash memory, use the instruction Load Extended Address Byte to define the upper address byte, which is not included in the Read Program Memory instruction. The extended address byte is stored until the command is re-issued, that is, the command needs only be issued for the first page, and when crossing the 64KWord boundary. 7. At the end of the programming session, RESET can be set high to commence normal operation. 8. Power-off sequence (if needed): Set RESET to “1”. Turn VCC power off. Table 30-16. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location Symbol Minimum Wait Delay tWD_FLASH 4.5ms tWD_EEPROM 3.6ms tWD_ERASE 9.0ms352 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 30.8.3 Serial Programming Instruction set Table 30-17 and Figure 30-11 on page 353 describes the Instruction set. Notes: 1. Not all instructions are applicable for all parts. 2. a = address. 3. Bits are programmed ‘0’, unprogrammed ‘1’. 4. To ensure future compatibility, unused Fuses and Lock bits should be unprogrammed (‘1’). 5. Refer to the correspondig section for Fuse and Lock bits, Calibration and Signature bytes and Page size. 6. See htt://www.atmel.com/avr for Application Notes regarding programming and programmers. If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until this bit returns ‘0’ before the next instruction is carried out. Table 30-17. Serial Programming Instruction Set Instruction/Operation Instruction Format Byte 1 Byte 2 Byte 3 Byte 4 Programming Enable $AC $53 $00 $00 Chip Erase (Program Memory/EEPROM) $AC $80 $00 $00 Poll RDY/BSY $F0 $00 $00 data byte out Load Instructions Load Extended Address byte(1) $4D $00 Extended adr $00 Load Program Memory Page, High byte $48 $00 adr LSB high data byte in Load Program Memory Page, Low byte $40 $00 adr LSB low data byte in Load EEPROM Memory Page (page access) $C1 $00 0000 000aa data byte in Read Instructions Read Program Memory, High byte $28 adr MSB adr LSB high data byte out Read Program Memory, Low byte $20 adr MSB adr LSB low data byte out Read EEPROM Memory $A0 0000 aaaa aaaa aaaa data byte out Read Lock bits $58 $00 $00 data byte out Read Signature Byte $30 $00 0000 000aa data byte out Read Fuse bits $50 $00 $00 data byte out Read Fuse High bits $58 $08 $00 data byte out Read Extended Fuse Bits $50 $08 $00 data byte out Read Calibration Byte $38 $00 $00 data byte out Write Instructions Write Program Memory Page $4C adr MSB adr LSB $00 Write EEPROM Memory $C0 0000 aaaa aaaa aaaa data byte in Write EEPROM Memory Page (page access) $C2 0000 aaaa aaaa 00 $00 Write Lock bits $AC $E0 $00 data byte in Write Fuse bits $AC $A0 $00 data byte in Write Fuse High bits $AC $A8 $00 data byte in Write Extended Fuse Bits $AC $A4 $00 data byte in353 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Within the same page, the low data byte must be loaded prior to the high data byte. After data is loaded to the page buffer, program the EEPROM page, see Figure 30-11. Figure 30-11. Serial Programming Instruction example 30.8.4 Serial Programming Characteristics For characteristics of the Serial Programming module, see “SPI Timing Characteristics” on page 375. Figure 30-12. Serial Programming Waveforms Byte 1 Byte 2 Byte 3 Byte 4 Adr LSB Bit 15 B 0 Serial Programming Instruction Program Memory/ EEPROM Memory Page 0 Page 1 Page 2 Page N-1 Page Buffer Write Program Memory Page/ Write EEPROM Memory Page Load Program Memory Page (High/Low Byte)/ Load EEPROM Memory Page (page access) Byte 1 Byte 2 Byte 3 Byte 4 Bit 15 B 0 Adr MSB Page Offset Page Number Adr MSB Adr LSB MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUT354 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 30.9 Programming via the JTAG Interface Programming through the JTAG interface requires control of the four JTAG specific pins: TCK, TMS, TDI, and TDO. Control of the reset and clock pins is not required. To be able to use the JTAG interface, the JTAGEN Fuse must be programmed. The device is default shipped with the fuse programmed. In addition, the JTD bit in MCUCR must be cleared. Alternatively, if the JTD bit is set, the external reset can be forced low. Then, the JTD bit will be cleared after two chip clocks, and the JTAG pins are available for programming. This provides a means of using the JTAG pins as normal port pins in Running mode while still allowing In-System Programming via the JTAG interface. Note that this technique can not be used when using the JTAG pins for Boundary-scan or On-chip Debug. In these cases the JTAG pins must be dedicated for this purpose. During programming the clock frequency of the TCK Input must be less than the maximum frequency of the chip. The System Clock Prescaler can not be used to divide the TCK Clock Input into a sufficiently low frequency. As a definition in this datasheet, the LSB is shifted in and out first of all Shift Registers. 30.9.1 Programming Specific JTAG Instructions The Instruction Register is 4-bit wide, supporting up to 16 instructions. The JTAG instructions useful for programming are listed below. The OPCODE for each instruction is shown behind the instruction name in hex format. The text describes which Data Register is selected as path between TDI and TDO for each instruction. The Run-Test/Idle state of the TAP controller is used to generate internal clocks. It can also be used as an idle state between JTAG sequences. The state machine sequence for changing the instruction word is shown in Figure 30-13 on page 355.355 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 30-13. State Machine Sequence for Changing the Instruction Word 30.9.2 AVR_RESET (0xC) The AVR specific public JTAG instruction for setting the AVR device in the Reset mode or taking the device out from the Reset mode. The TAP controller is not reset by this instruction. The one bit Reset Register is selected as Data Register. Note that the reset will be active as long as there is a logic “one” in the Reset Chain. The output from this chain is not latched. The active states are: • Shift-DR: The Reset Register is shifted by the TCK input 30.9.3 PROG_ENABLE (0x4) The AVR specific public JTAG instruction for enabling programming via the JTAG port. The 16- bit Programming Enable Register is selected as Data Register. The active states are the following: • Shift-DR: The programming enable signature is shifted into the Data Register • Update-DR: The programming enable signature is compared to the correct value, and Programming mode is entered if the signature is valid Test-Logic-Reset Run-Test/Idle Shift-DR Exit1-DR Pause-DR Exit2-DR Update-DR Select-IR Scan Capture-IR Shift-IR Exit1-IR Pause-IR Exit2-IR Update-IR Select-DR Scan Capture-DR 0 1 0 11 1 0 0 0 0 1 1 1 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 0 0 1 1356 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 30.9.4 PROG_COMMANDS (0x5) The AVR specific public JTAG instruction for entering programming commands via the JTAG port. The 15-bit Programming Command Register is selected as Data Register. The active states are the following: • Capture-DR: The result of the previous command is loaded into the Data Register • Shift-DR: The Data Register is shifted by the TCK input, shifting out the result of the previous command and shifting in the new command • Update-DR: The programming command is applied to the Flash inputs • Run-Test/Idle: One clock cycle is generated, executing the applied command 30.9.5 PROG_PAGELOAD (0x6) The AVR specific public JTAG instruction to directly load the Flash data page via the JTAG port. An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBs of the Programming Command Register. The active states are the following: • Shift-DR: The Flash Data Byte Register is shifted by the TCK input. • Update-DR: The content of the Flash Data Byte Register is copied into a temporary register. A write sequence is initiated that within 11 TCK cycles loads the content of the temporary register into the Flash page buffer. The AVR automatically alternates between writing the low and the high byte for each new Update-DR state, starting with the low byte for the first Update-DR encountered after entering the PROG_PAGELOAD command. The Program Counter is pre-incremented before writing the low byte, except for the first written byte. This ensures that the first data is written to the address set up by PROG_COMMANDS, and loading the last location in the page buffer does not make the program counter increment into the next page. 30.9.6 PROG_PAGEREAD (0x7) The AVR specific public JTAG instruction to directly capture the Flash content via the JTAG port. An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBs of the Programming Command Register. The active states are the following: • Capture-DR: The content of the selected Flash byte is captured into the Flash Data Byte Register. The AVR automatically alternates between reading the low and the high byte for each new Capture-DR state, starting with the low byte for the first Capture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter is post-incremented after reading each high byte, including the first read byte. This ensures that the first data is captured from the first address set up by PROG_COMMANDS, and reading the last location in the page makes the program counter increment into the next page. • Shift-DR: The Flash Data Byte Register is shifted by the TCK input. 30.9.7 Data Registers The Data Registers are selected by the JTAG instruction registers described in section “Programming Specific JTAG Instructions” on page 354. The Data Registers relevant for programming operations are: • Reset Register • Programming Enable Register • Programming Command Register • Flash Data Byte Register357 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 30.9.8 Reset Register The Reset Register is a Test Data Register used to reset the part during programming. It is required to reset the part before entering Programming mode. A high value in the Reset Register corresponds to pulling the external reset low. The part is reset as long as there is a high value present in the Reset Register. Depending on the Fuse settings for the clock options, the part will remain reset for a Reset Time-out period (refer to “Clock Sources” on page 41) after releasing the Reset Register. The output from this Data Register is not latched, so the reset will take place immediately, as shown in Figure 28-2 on page 304. 30.9.9 Programming Enable Register The Programming Enable Register is a 16-bit register. The contents of this register is compared to the programming enable signature, binary code 0b1010_0011_0111_0000. When the contents of the register is equal to the programming enable signature, programming via the JTAG port is enabled. The register is reset to 0 on Power-on Reset, and should always be reset when leaving Programming mode. Figure 30-14. Programming Enable Register 30.9.10 Programming Command Register The Programming Command Register is a 15-bit register. This register is used to serially shift in programming commands, and to serially shift out the result of the previous command, if any. The JTAG Programming Instruction Set is shown in Table 30-18 on page 359. The state sequence when shifting in the programming commands is illustrated in Figure 30-16 on page 362. TDI TDO D A T A = D Q ClockDR & PROG_ENABLE Programming Enable 0xA370358 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 30-15. Programming Command Register TDI TDO S T R O B E S A D D R E S S / D A T A Flash EEPROM Fuses Lock Bits359 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Table 30-18. JTAG Programming Instruction Set a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care Instruction TDI Sequence TDO Sequence Notes 1a. Chip Erase 0100011_10000000 0110001_10000000 0110011_10000000 0110011_10000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx 1b. Poll for Chip Erase Complete 0110011_10000000 xxxxxox_xxxxxxxx (2) 2a. Enter Flash Write 0100011_00010000 xxxxxxx_xxxxxxxx 2b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10) 2c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx 2d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 2e. Load Data Low Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx 2f. Load Data High Byte 0010111_iiiiiiii xxxxxxx_xxxxxxxx 2g. Latch Data 0110111_00000000 1110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 2h. Write Flash Page 0110111_00000000 0110101_00000000 0110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 2i. Poll for Page Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2) 3a. Enter Flash Read 0100011_00000010 xxxxxxx_xxxxxxxx 3b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10) 3c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx 3d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 3e. Read Data Low and High Byte 0110010_00000000 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo xxxxxxx_oooooooo Low byte High byte 4a. Enter EEPROM Write 0100011_00010001 xxxxxxx_xxxxxxxx 4b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10) 4c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 4d. Load Data Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx 4e. Latch Data 0110111_00000000 1110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 4f. Write EEPROM Page 0110011_00000000 0110001_00000000 0110011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1)360 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 4g. Poll for Page Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2) 5a. Enter EEPROM Read 0100011_00000011 xxxxxxx_xxxxxxxx 5b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10) 5c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 5d. Read Data Byte 0110011_bbbbbbbb 0110010_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 6a. Enter Fuse Write 0100011_01000000 xxxxxxx_xxxxxxxx 6b. Load Data Low Byte(6) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3) 6c. Write Fuse Extended Byte 0111011_00000000 0111001_00000000 0111011_00000000 0111011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 6d. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2) 6e. Load Data Low Byte(7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3) 6f. Write Fuse High Byte 0110111_00000000 0110101_00000000 0110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 6g. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2) 6h. Load Data Low Byte(7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3) 6i. Write Fuse Low Byte 0110011_00000000 0110001_00000000 0110011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 6j. Poll for Fuse Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2) 7a. Enter Lock Bit Write 0100011_00100000 xxxxxxx_xxxxxxxx 7b. Load Data Byte(9) 0010011_11iiiiii xxxxxxx_xxxxxxxx (4) 7c. Write Lock Bits 0110011_00000000 0110001_00000000 0110011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 7d. Poll for Lock Bit Write complete 0110011_00000000 xxxxxox_xxxxxxxx (2) 8a. Enter Fuse/Lock Bit Read 0100011_00000100 xxxxxxx_xxxxxxxx 8b. Read Extended Fuse Byte(6) 0111010_00000000 0111011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 8c. Read Fuse High Byte(7) 0111110_00000000 0111111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo Table 30-18. JTAG Programming Instruction (Continued) Set (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care Instruction TDI Sequence TDO Sequence Notes361 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. This command sequence is not required if the seven MSB are correctly set by the previous command sequence (which is normally the case). 2. Repeat until o = “1”. 3. Set bits to “0” to program the corresponding Fuse, “1” to unprogram the Fuse. 4. Set bits to “0” to program the corresponding Lock bit, “1” to leave the Lock bit unchanged. 5. “0” = programmed, “1” = unprogrammed. 6. The bit mapping for Fuses Extended byte is listed in Table 30-3 on page 336. 7. The bit mapping for Fuses High byte is listed in Table 30-4 on page 337. 8. The bit mapping for Fuses Low byte is listed in Table 30-5 on page 337. 9. The bit mapping for Lock bits byte is listed in Table 30-1 on page 335. 10. Address bits exceeding PCMSB and EEAMSB (Table 30-7 on page 338 and Table 30-8 on page 338) are don’t care. 11. All TDI and TDO sequences are represented by binary digits (0b...). 8d. Read Fuse Low Byte(8) 0110010_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 8e. Read Lock Bits(9) 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxoooooo (5) 8f. Read Fuses and Lock Bits 0111010_00000000 0111110_00000000 0110010_00000000 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo xxxxxxx_oooooooo xxxxxxx_oooooooo xxxxxxx_oooooooo (5) Fuse Ext. byte Fuse High byte Fuse Low byte Lock bits 9a. Enter Signature Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx 9b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 9c. Read Signature Byte 0110010_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 10a. Enter Calibration Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx 10b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 10c. Read Calibration Byte 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 11a. Load No Operation Command 0100011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx Table 30-18. JTAG Programming Instruction (Continued) Set (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care Instruction TDI Sequence TDO Sequence Notes362 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 30-16. State Machine Sequence for Changing/Reading the Data Word 30.9.11 Flash Data Byte Register The Flash Data Byte Register provides an efficient way to load the entire Flash page buffer before executing Page Write, or to read out/verify the content of the Flash. A state machine sets up the control signals to the Flash and senses the strobe signals from the Flash, thus only the data words need to be shifted in/out. The Flash Data Byte Register actually consists of the 8-bit scan chain and a 8-bit temporary register. During page load, the Update-DR state copies the content of the scan chain over to the temporary register and initiates a write sequence that within 11 TCK cycles loads the content of the temporary register into the Flash page buffer. The AVR automatically alternates between writing the low and the high byte for each new Update-DR state, starting with the low byte for the first Update-DR encountered after entering the PROG_PAGELOAD command. The Program Counter is pre-incremented before writing the low byte, except for the first written byte. This ensures that the first data is written to the address set up by PROG_COMMANDS, and loading the last location in the page buffer does not make the Program Counter increment into the next page. During Page Read, the content of the selected Flash byte is captured into the Flash Data Byte Register during the Capture-DR state. The AVR automatically alternates between reading the low and the high byte for each new Capture-DR state, starting with the low byte for the first CapTest-Logic-Reset Run-Test/Idle Shift-DR Exit1-DR Pause-DR Exit2-DR Update-DR Select-IR Scan Capture-IR Shift-IR Exit1-IR Pause-IR Exit2-IR Update-IR Select-DR Scan Capture-DR 0 1 0 11 1 0 0 0 0 1 1 1 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 0 0 1 1363 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 ture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter is post-incremented after reading each high byte, including the first read byte. This ensures that the first data is captured from the first address set up by PROG_COMMANDS, and reading the last location in the page makes the program counter increment into the next page. Figure 30-17. Flash Data Byte Register The state machine controlling the Flash Data Byte Register is clocked by TCK. During normal operation in which eight bits are shifted for each Flash byte, the clock cycles needed to navigate through the TAP controller automatically feeds the state machine for the Flash Data Byte Register with sufficient number of clock pulses to complete its operation transparently for the user. However, if too few bits are shifted between each Update-DR state during page load, the TAP controller should stay in the Run-Test/Idle state for some TCK cycles to ensure that there are at least 11 TCK cycles between each Update-DR state. 30.9.12 Programming Algorithm All references below of type “1a”, “1b”, and so on, refer to Table 30-18 on page 359. 30.9.13 Entering Programming Mode 1. Enter JTAG instruction AVR_RESET and shift 1 in the Reset Register. 2. Enter instruction PROG_ENABLE and shift 0b1010_0011_0111_0000 in the Programming Enable Register. 30.9.14 Leaving Programming Mode 1. Enter JTAG instruction PROG_COMMANDS. 2. Disable all programming instructions by using no operation instruction 11a. 3. Enter instruction PROG_ENABLE and shift 0b0000_0000_0000_0000 in the programming Enable Register. 4. Enter JTAG instruction AVR_RESET and shift 0 in the Reset Register. TDI TDO D A T A Flash EEPROM Fuses Lock Bits STROBES ADDRESS State Machine364 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 30.9.15 Performing Chip Erase 1. Enter JTAG instruction PROG_COMMANDS. 2. Start Chip Erase using programming instruction 1a. 3. Poll for Chip Erase complete using programming instruction 1b, or wait for tWLRH_CE (refer to Table 30-14 on page 348). 30.9.16 Programming the Flash Before programming the Flash a Chip Erase must be performed, see “Performing Chip Erase” on page 364. 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash write using programming instruction 2a. 3. Load address Extended High byte using programming instruction 2b. 4. Load address High byte using programming instruction 2c. 5. Load address Low byte using programming instruction 2d. 6. Load data using programming instructions 2e, 2f and 2g. 7. Repeat steps 5 and 6 for all instruction words in the page. 8. Write the page using programming instruction 2h. 9. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH (refer to Table 30-14 on page 348). 10. Repeat steps 3 to 9 until all data have been programmed. A more efficient data transfer can be achieved using the PROG_PAGELOAD instruction: 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash write using programming instruction 2a. 3. Load the page address using programming instructions 2b, 2c and 2d. PCWORD (refer to Table 30-7 on page 338) is used to address within one page and must be written as 0. 4. Enter JTAG instruction PROG_PAGELOAD. 5. Load the entire page by shifting in all instruction words in the page byte-by-byte, starting with the LSB of the first instruction in the page and ending with the MSB of the last instruction in the page. Use Update-DR to copy the contents of the Flash Data Byte Register into the Flash page location and to auto-increment the Program Counter before each new word. 6. Enter JTAG instruction PROG_COMMANDS. 7. Write the page using programming instruction 2h. 8. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH (refer to Table 30-14 on page 348). 9. Repeat steps 3 to 8 until all data have been programmed. 30.9.17 Reading the Flash 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash read using programming instruction 3a. 3. Load address using programming instructions 3b, 3c and 3d. 4. Read data using programming instruction 3e. 5. Repeat steps 3 and 4 until all data have been read.365 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 A more efficient data transfer can be achieved using the PROG_PAGEREAD instruction: 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash read using programming instruction 3a. 3. Load the page address using programming instructions 3b, 3c and 3d. PCWORD (refer to Table 30-7 on page 338) is used to address within one page and must be written as 0. 4. Enter JTAG instruction PROG_PAGEREAD. 5. Read the entire page (or Flash) by shifting out all instruction words in the page (or Flash), starting with the LSB of the first instruction in the page (Flash) and ending with the MSB of the last instruction in the page (Flash). The Capture-DR state both captures the data from the Flash, and also auto-increments the program counter after each word is read. Note that Capture-DR comes before the shift-DR state. Hence, the first byte which is shifted out contains valid data. 6. Enter JTAG instruction PROG_COMMANDS. 7. Repeat steps 3 to 6 until all data have been read. 30.9.18 Programming the EEPROM Before programming the EEPROM a Chip Erase must be performed, see “Performing Chip Erase” on page 364. 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable EEPROM write using programming instruction 4a. 3. Load address High byte using programming instruction 4b. 4. Load address Low byte using programming instruction 4c. 5. Load data using programming instructions 4d and 4e. 6. Repeat steps 4 and 5 for all data bytes in the page. 7. Write the data using programming instruction 4f. 8. Poll for EEPROM write complete using programming instruction 4g, or wait for tWLRH (refer to Table 30-14 on page 348). 9. Repeat steps 3 to 8 until all data have been programmed. Note that the PROG_PAGELOAD instruction can not be used when programming the EEPROM. 30.9.19 Reading the EEPROM 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable EEPROM read using programming instruction 5a. 3. Load address using programming instructions 5b and 5c. 4. Read data using programming instruction 5d. 5. Repeat steps 3 and 4 until all data have been read. Note that the PROG_PAGEREAD instruction can not be used when reading the EEPROM. 30.9.20 Programming the Fuses 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Fuse write using programming instruction 6a. 3. Load data high byte using programming instructions 6b. A bit value of “0” will program the corresponding fuse, a “1” will unprogram the fuse. 4. Write Fuse High byte using programming instruction 6c.366 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 5. Poll for Fuse write complete using programming instruction 6d, or wait for tWLRH (refer to Table 30-14 on page 348). 6. Load data low byte using programming instructions 6e. A “0” will program the fuse, a “1” will unprogram the fuse. 7. Write Fuse low byte using programming instruction 6f. 8. Poll for Fuse write complete using programming instruction 6g, or wait for tWLRH (refer to Table 30-14 on page 348). 30.9.21 Programming the Lock Bits 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Lock bit write using programming instruction 7a. 3. Load data using programming instructions 7b. A bit value of “0” will program the corresponding lock bit, a “1” will leave the lock bit unchanged. 4. Write Lock bits using programming instruction 7c. 5. Poll for Lock bit write complete using programming instruction 7d, or wait for tWLRH (refer to Table 30-14 on page 348). 30.9.22 Reading the Fuses and Lock Bits 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Fuse/Lock bit read using programming instruction 8a. 3. To read all Fuses and Lock bits, use programming instruction 8e. To only read Fuse High byte, use programming instruction 8b. To only read Fuse Low byte, use programming instruction 8c. To only read Lock bits, use programming instruction 8d. 30.9.23 Reading the Signature Bytes 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Signature byte read using programming instruction 9a. 3. Load address 0x00 using programming instruction 9b. 4. Read first signature byte using programming instruction 9c. 5. Repeat steps 3 and 4 with address 0x01 and address 0x02 to read the second and third signature bytes, respectively. 30.9.24 Reading the Calibration Byte 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Calibration byte read using programming instruction 10a. 3. Load address 0x00 using programming instruction 10b. 4. Read the calibration byte using programming instruction 10c.367 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 31. Electrical Characteristics Absolute Maximum Ratings* 31.1 DC Characteristics Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ................................................ 40.0mA DC Current VCC and GND Pins................................. 200.0mA TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min. Typ. Max. Units VIL Input Low Voltage, Except XTAL1 and Reset pin VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V -0.5 -0.5 0.2VCC(1) 0.3VCC(1) V VIL1 Input Low Voltage, XTAL1 pin VCC = 1.8V - 5.5V -0.5 0.1VCC(1) VIL2 Input Low Voltage, RESET pin VCC = 1.8V - 5.5V -0.5 0.1VCC(1) VIH Input High Voltage, Except XTAL1 and RESET pins VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.7VCC(2) 0.6VCC(2) VCC + 0.5 VCC + 0.5 VIH1 Input High Voltage, XTAL1 pin VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.8VCC(2) 0.7VCC(2) VCC + 0.5 VCC + 0.5 VIH2 Input High Voltage, RESET pin VCC = 1.8V - 5.5V 0.9VCC(2) VCC + 0.5 VOL Output Low Voltage(3), Except RESET pin I OL = 20mA, VCC = 5V IOL = 10mA, VCC = 3V 0.9 0.6 VOH Output High Voltage(4), Except RESET pin IOH = -20mA, VCC = 5V IOH = -10mA, VCC = 3V 4.2 2.3 I IL Input Leakage Current I/O Pin VCC = 5.5V, pin low (absolute value) 1 µA IIH Input Leakage Current I/O Pin VCC = 5.5V, pin high (absolute value) 1 RRST Reset Pull-up Resistor 30 60 kΩ RPU I/O Pin Pull-up Resistor 20 50368 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. "Max" means the highest value where the pin is guaranteed to be read as low. 2. "Min" means the lowest value where the pin is guaranteed to be read as high. 3. Although each I/O port can sink more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: ATmega1281/2561: 1.)The sum of all IOL, for ports A0-A7, G2, C4-C7 should not exceed 100mA. 2.)The sum of all IOL, for ports C0-C3, G0-G1, D0-D7 should not exceed 100mA. 3.)The sum of all IOL, for ports G3-G5, B0-B7, E0-E7 should not exceed 100mA. 4.)The sum of all IOL, for ports F0-F7 should not exceed 100mA. ATmega640/1280/2560: 1.)The sum of all IOL, for ports J0-J7, A0-A7, G2 should not exceed 200mA. 2.)The sum of all IOL, for ports C0-C7, G0-G1, D0-D7, L0-L7 should not exceed 200mA. 3.)The sum of all IOL, for ports G3-G4, B0-B7, H0-B7 should not exceed 200mA. 4.)The sum of all IOL, for ports E0-E7, G5 should not exceed 100mA. 5.)The sum of all IOL, for ports F0-F7, K0-K7 should not exceed 100mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: ATmega1281/2561: 1)The sum of all IOH, for ports A0-A7, G2, C4-C7 should not exceed 100mA. 2)The sum of all IOH, for ports C0-C3, G0-G1, D0-D7 should not exceed 100mA. 3)The sum of all IOH, for ports G3-G5, B0-B7, E0-E7 should not exceed 100mA. 4)The sum of all IOH, for ports F0-F7 should not exceed 100mA. ATmega640/1280/2560: 1)The sum of all IOH, for ports J0-J7, G2, A0-A7 should not exceed 200mA. 2)The sum of all IOH, for ports C0-C7, G0-G1, D0-D7, L0-L7 should not exceed 200mA. 3)The sum of all IOH, for ports G3-G4, B0-B7, H0-H7 should not exceed 200mA. 4)The sum of all IOH, for ports E0-E7, G5 should not exceed 100mA. ICC Power Supply Current(5) Active 1MHz, VCC = 2V (ATmega640/1280/2560/1V) 0.5 0.8 mA Active 4MHz, VCC = 3V (ATmega640/1280/2560/1L) 3.2 5 Active 8MHz, VCC = 5V (ATmega640/1280/1281/2560/2561) 10 14 Idle 1MHz, VCC = 2V (ATmega640/1280/2560/1V) 0.14 0.22 Idle 4MHz, VCC = 3V (ATmega640/1280/2560/1L) 0.7 1.1 Idle 8MHz, VCC = 5V (ATmega640/1280/1281/2560/2561) 2.7 4 Power-down mode WDT enabled, VCC = 3V <5 15 µA WDT disabled, VCC = 3V <1 7.5 VACIO Analog Comparator Input Offset Voltage VCC = 5V Vin = VCC/2 <10 40 mV I ACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nA t ACID Analog Comparator Propagation Delay VCC = 2.7V VCC = 4.0V 750 500 ns TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) (Continued) Symbol Parameter Condition Min. Typ. Max. Units369 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 5)The sum of all IOH, for ports F0-F7, K0-K7 should not exceed 100mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 5. Values with “PRR1 – Power Reduction Register 1” enabled (0xFF). 31.2 Speed Grades Maximum frequency is depending on VCC. As shown in Figure 31-1 trough Figure 31-4 on page 370, the Maximum Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V and between 2.7V < VCC < 4.5V. 31.2.1 8MHz Figure 31-1. Maximum Frequency vs. VCC, ATmega640V/1280V/1281V/2560V/2561V Figure 31-2. Maximum Frequency vs. VCC when also No-Read-While-Write Section(1), ATmega2560V/ATmega2561V, is used Note: 1. When only using the Read-While-Write Section of the program memory, a higher speed can be achieved at low voltage, see “Read-While-Write and No Read-While-Write Flash Sections” on page 317 for addresses. 8 MHz 4 MHz 1.8V 2.7V 5.5V Safe Operating Area 8 MHz 2 MHz 1.8V 2.7V 5.5V Safe Operating Area370 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 31.2.2 16 MHz Figure 31-3. Maximum Frequency vs. VCC, ATmega640/ATmega1280/ATmega1281 Figure 31-4. Maximum Frequency vs. VCC, ATmega2560/ATmega2561 16 MHz 8 MHz 2.7V 4.5V 5.5V Safe Operating Area 16 MHz 4.5V 5.5V Safe Operating Area371 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 31.3 Clock Characteristics 31.3.1 Calibrated Internal RC Oscillator Accuracy Notes: 1. Voltage range for ATmega640V/1281V/1280V/2561V/2560V. 2. Voltage range for ATmega640/1281/1280/2561/2560. 31.3.2 External Clock Drive Waveforms Figure 31-5. External Clock Drive Waveforms 31.4 External Clock Drive Table 31-1. Calibration Accuracy of Internal RC Oscillator Frequency VCC Temperature Calibration Accuracy Factory Calibration 8.0MHz 3V 25°C ±10% User Calibration 7.3MHz - 8.1MHz 1.8V - 5.5V(1) 2.7V - 5.5V(2) -40°C - 85°C ±1% VIL1 VIH1 Table 31-2. External Clock Drive Symbol Parameter VCC = 1.8V - 5.5V VCC = 2.7V - 5.5V VCC = 4.5V - 5.5V Min. Max. Min. Max. Min. Max. Units 1/tCLCL Oscillator Frequency 0 2 0 8 0 16 MHz tCLCL Clock Period 500 125 62.5 tCHCX High Time 200 50 25 ns t CLCX Low Time 200 50 25 t CLCH Rise Time 2.0 1.6 0.5 μs tCHCL Fall Time 2.0 1.6 0.5 ΔtCLCL Change in period from one clock cycle to the next 2 2 2%372 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 31.5 System and Reset Characteristics Note: 1. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling). 31.5.1 Standard Power-On Reset This implementation of power-on reset existed in early versions of ATmega640/1280/1281/2560/2561. The table below describes the characteristics of this poweron reset and it is valid for the following devices only: • ATmega640: revision A • ATmega1280: revision A • ATmega1281: revision A • ATmega2560: revision A to E • ATmega2561: revision A to E Table 31-4. Characteristics of Standard Power-On Reset. TA= -40 to +85°C. Notes: 1. Values are guidelines only. 2. Threshold where device is released from reset when voltage is rising. 3. The power-on reset threshold voltage (falling) will not work unless the supply voltage has been below VPOT. Table 31-3. Reset, Brown-out and Internal voltage CharacteristicsCharacteristics Symbol Parameter Condition Min Typ Max Units VRST RESET Pin Threshold Voltage 0.2VCC 0.9VCC V tRST Minimum pulse width on RESET Pin 2.5 µs VHYST Brown-out Detector Hysteresis 50 mV tBOD Min Pulse Width on Brown-out Reset 2 µs VBG Bandgap reference voltage VCC=2.7V, TA= 25°C 1.0 1.1 1.2 V t BG Bandgap reference start-up time VCC=2.7V, TA= 25°C 40 70 µs I BG Bandgap reference current consumption VCC=2.7V, TA= 25°C 10 µA Symbol Parameter Min.(1) Typ.(1) Max.(1) Units VPOT Power-on Reset Threshold Voltage (rising)(2) 0.7 1.0 1.4 V Power-on Reset Threshold Voltage (falling)(3) 0.05 0.9 1.3 V VPSR Power-on slope rate 0.01 4.5 V/ms373 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 31.5.2 Enhanced Power-On Reset This implementation of power-on reset exists in newer versions of ATmega640/1280/1281/2560/2561. The table below describes the characteristics of this poweron reset and it is valid for the following devices only: • ATmega640: revision B and newer • ATmega1280: revision B and newer • ATmega1281: revision B and newer • ATmega2560: revision F and newer • ATmega2561: revision F and newer Table 31-5. Characteristics of Enhanced Power-On Reset. TA= -40 to +85°C. Notes: 1. Values are guidelines only. 2. Threshold where device is released from reset when voltage is rising. 3. The power-on reset threshold voltage (falling) will not work unless the supply voltage has been below VPOT. Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-Out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. The test is performed using BODLEVEL = 110 for 4MHz operation of ATmega640V/1280V/1281V/2560V/2561V, BODLEVEL = 101 for 8MHz operation of ATmega640V/1280V/1281V/2560V/2561V and ATmega640/1280/1281, and BODLEVEL = 100 for 16MHz operation of ATmega640/1280/1281/2560/2561. 31.6 2-wire Serial Interface Characteristics Table 31-7 on page 374 describes the requirements for devices connected to the 2-wire Serial Bus. The ATmega640/1280/1281/2560/2561 2-wire Serial Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 31-6 on page 375. Symbol Parameter Min.(1) Typ.(1) Max.(1) Units VPOT Power-on Reset Threshold Voltage (rising)(2) 1.1 1.4 1.6 V Power-on Reset Threshold Voltage (falling)(3) 0.6 1.3 1.6 V VPSR Power-On Slope Rate 0.01 V/ms Table 31-6. BODLEVEL Fuse Coding(1) BODLEVEL 2:0 Fuses Min VBOT Typ VBOT Max VBOT Units 111 BOD Disabled 110 1.7 1.8 2.0 101 2.5 2.7 2.9 V 100 4.1 4.3 4.5 011 Reserved 010 001 000374 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. In ATmega640/1280/1281/2560/2561, this parameter is characterized and not 100% tested. 2. Required only for fSCL > 100kHz. 3. Cb = capacitance of one bus line in pF. 4. fCK = CPU clock frequency. Table 31-7. 2-wire Serial Bus Requirements Symbol Parameter Condition Min Max Units VIL Input Low-voltage -0.5 0.3 VCC V VIH Input High-voltage 0.7 VCC VCC + 0.5 Vhys(1) Hysteresis of Schmitt Trigger Inputs 0.05 VCC(2) – VOL(1) Output Low-voltage 3mA sink current 0 0.4 tr (1) Rise Time for both SDA and SCL 20 + 0.1Cb (3)(2) 300 ns tof (1) Output Fall Time from VIHmin to VILmax 10pF < Cb < 400pF(3) 20 + 0.1Cb (3)(2) 250 tSP(1) Spikes Suppressed by Input Filter 0 50(2) Ii Input Current each I/O Pin 0.1VCC < Vi < 0.9VCC -10 10 µA Ci (1) Capacitance for each I/O Pin – 10 pF fSCL SCL Clock Frequency fCK(4) > max(16fSCL, 250kHz)(5) 0 400 kHz Rp Value of Pull-up resistor fSCL ≤ 100kHz fSCL > 100kHz tHD;STA Hold Time (repeated) START Condition fSCL ≤ 100kHz 4.0 – µs fSCL > 100kHz 0.6 – tLOW Low Period of the SCL Clock fSCL ≤ 100kHz(6) 4.7 – fSCL > 100kHz(7) 1.3 – tHIGH High period of the SCL clock fSCL ≤ 100kHz 4.0 – fSCL > 100kHz 0.6 – tSU;STA Set-up time for a repeated START condition fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 0.6 – tHD;DAT Data hold time fSCL ≤ 100kHz 0 3.45 fSCL > 100kHz 0 0.9 tSU;DAT Data setup time fSCL ≤ 100kHz 250 – fSCL > 100kHz 100 – tSU;STO Setup time for STOP condition fSCL ≤ 100kHz 4.0 – fSCL > 100kHz 0.6 – tBUF Bus free time between a STOP and START condition fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 1.3 – VCC – 0.4V 3mA ---------------------------- 1000ns Cb ------------------- Ω VCC – 0.4V 3mA ---------------------------- 300 ns Cb -----------------375 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 5. This requirement applies to all ATmega640/1280/1281/2560/2561 2-wire Serial Interface operation. Other devices connected to the 2-wire Serial Bus need only obey the general fSCL requirement. 6. The actual low period generated by the ATmega640/1280/1281/2560/2561 2-wire Serial Interface is (1/fSCL - 2/fCK), thus fCK must be greater than 6MHz for the low time requirement to be strictly met at fSCL = 100kHz. 7. The actual low period generated by the ATmega640/1280/1281/2560/2561 2-wire Serial Interface is (1/fSCL - 2/fCK), thus the low time requirement will not be strictly met for fSCL > 308kHz when fCK = 8MHz. Still, ATmega640/1280/1281/2560/2561 devices connected to the bus may communicate at full speed (400kHz) with other ATmega640/1280/1281/2560/2561 devices, as well as any other device with a proper tLOW acceptance margin. Figure 31-6. 2-wire Serial Bus Timing 31.7 SPI Timing Characteristics See Figure 31-7 on page 376 and Figure 31-8 on page 376 for details. Note: 1. In SPI Programming mode the minimum SCK high/low period is: - 2 tCLCL for fCK < 12MHz - 3 tCLCL for fCK > 12MHz t SU;STA t LOW t HIGH t LOW t of t HD;STA t HD;DAT t SU;DAT t SU;STO t BUF SCL SDA t r Table 31-8. SPI Timing Parameters Description Mode Min Typ Max 1 SCK period Master See Table 21-5 on page 203 ns 2 SCK high/low Master 50% duty cycle 3 Rise/Fall time Master 3.6 4 Setup Master 10 5 Hold Master 10 6 Out to SCK Master 0.5 • tsck 7 SCK to out Master 10 8 SCK to out high Master 10 9 SS low to out Slave 15 10 SCK period Slave 4 • tck 11 SCK high/low(1) Slave 2 • tck 12 Rise/Fall time Slave 1600 13 Setup Slave 10 14 Hold Slave tck 15 SCK to out Slave 15 16 SCK to SS high Slave 20 17 SS high to tri-state Slave 10 18 SS low to SCK Slave 20376 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 31-7. SPI Interface Timing Requirements (Master Mode) Figure 31-8. SPI Interface Timing Requirements (Slave Mode) MOSI (Data Output) SCK (CPOL = 1) MISO (Data Input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 6 1 2 2 4 5 3 7 8 MISO (Data Output) SCK (CPOL = 1) MOSI (Data Input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 10 11 11 13 14 12 15 17 9 X 16377 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 31.8 ADC Characteristics – Preliminary Data Note: 1. Values are guidelines only. Table 31-9. ADC Characteristics, Singel Ended Channels Symbol Parameter Condition Min(1) Typ(1) Max(1) Units Resolution Single Ended Conversion 10 Bits Absolute accuracy (Including INL, DNL, quantization error, gain and offset error) Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC= 200kHz 2.25 2.5 LSB Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC = 1MHz 3 Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC = 200kHz Noise Reduction Mode 2 Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC = 1MHz Noise Reduction Mode 3 Integral Non-Linearity (INL) Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC = 200kHz 1.25 Differential Non-Linearity (DNL) Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC = 200kHz 0.5 Gain Error Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC= 200kHz 2 Offset Error Single Ended Conversion VREF = 4V, VCC = 4V, CLKADC = 200kHz -2 Conversion Time Free Running Conversion 13 260 µs Clock Frequency Single Ended Conversion 50 1000 kHz AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 VREF Reference Voltage 1.0 AVCC V VIN Input Voltage GND VREF Input Bandwidth 38,5 kHz VINT1 Internal Voltage Reference 1.1V 1.0 1.1 1.2 V VINT2 Internal Voltage Reference 2.56V 2.4 2.56 2.8 RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ378 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Table 31-10. ADC Characteristics, Differential Channels Symbol Parameter Condition Min(1) Typ(1) Max(1) Units Resolution Gain = 1× 8 Gain = 10× 8 Bits Gain = 200× 7 Absolute Accuracy(Including INL, DNL, Quantization Error, Gain and Offset Error) Gain = 1× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 18 LSB Gain = 10× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 17 Gain = 200× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 9 Integral Non-Linearity (INL) Gain = 1× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 2.5 Gain = 10× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 5 Gain = 200× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 9 Differential Non-Linearity (DNL) Gain = 1× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 0.75 Gain = 10× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 1.5 Gain = 200× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 10 Gain Error Gain = 1× 1.7 Gain = 10× 1.7 % Gain = 200× 0.5 Offset Error Gain = 1× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 2 LSB Gain = 10× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 2 Gain = 200× VREF = 4V, VCC = 5V CLKADC = 50 - 200kHz 3 Clock Frequency 50 200 kHz Conversion Time 65 260 µs379 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Note: Values are guidelines only. 31.9 External Data Memory Timing Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1. 2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1. AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V VREF Reference Voltage 2.7 AVCC - 0.5 VIN Input Voltage GND VCC VDIFF Input Differential Voltage -VREF/Gain VREF/Gain ADC Conversion Output -511 511 LSB Input Bandwidth 4 kHz VINT Internal Voltage Reference 2.3 2.56 2.8 V RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ Table 31-11. External Data Memory Characteristics, 4.5 to 5.5 Volts, No Wait-state Symbol Parameter 8MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 1 tLHLL ALE Pulse Width 115 1.0tCLCL-10 ns 2 tAVLL Address Valid A to ALE Low 57.5 0.5tCLCL-5(1) 3a tLLAX_ST Address Hold After ALE Low, write access 5 5 3b tLLAX_LD Address Hold after ALE Low, read access 5 5 4 tAVLLC Address Valid C to ALE Low 57.5 0.5tCLCL-5(1) 5 tAVRL Address Valid to RD Low 115 1.0tCLCL-10 6 tAVWL Address Valid to WR Low 115 1.0tCLCL-10 7 tLLWL ALE Low to WR Low 47.5 67.5 0.5tCLCL-15(2) 0.5tCLCL+5(2) 8 tLLRL ALE Low to RD Low 47.5 67.5 0.5tCLCL-15(2) 0.5tCLCL+5(2) 9 tDVRH Data Setup to RD High 40 40 10 tRLDV Read Low to Data Valid 75 1.0tCLCL-50 11 tRHDX Data Hold After RD High 0 0 12 tRLRH RD Pulse Width 115 1.0tCLCL-10 13 tDVWL Data Setup to WR Low 42.5 0.5tCLCL-20(1) 14 tWHDX Data Hold After WR High 115 1.0tCLCL-10 15 tDVWH Data Valid to WR High 125 1.0tCLCL 16 tWLWH WR Pulse Width 115 1.0tCLCL-10 Table 31-10. ADC Characteristics, Differential Channels (Continued) Symbol Parameter Condition Min(1) Typ(1) Max(1) Units380 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Table 31-12. External Data Memory Characteristics, 4.5 to 5.5 Volts, 1 Cycle Wait-state Symbol Parameter 8MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 10 tRLDV Read Low to Data Valid 200 2.0tCLCL-50 ns 12 tRLRH RD Pulse Width 240 2.0tCLCL-10 15 tDVWH Data Valid to WR High 240 2.0tCLCL 16 tWLWH WR Pulse Width 240 2.0tCLCL-10 Table 31-13. External Data Memory Characteristics, 4.5 to 5.5 Volts, SRWn1 = 1, SRWn0 = 0 Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50 ns 12 tRLRH RD Pulse Width 365 3.0tCLCL-10 15 tDVWH Data Valid to WR High 375 3.0tCLCL 16 tWLWH WR Pulse Width 365 3.0tCLCL-10 Table 31-14. External Data Memory Characteristics, 4.5 to 5.5 Volts, SRWn1 = 1, SRWn0 = 1 Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50 ns 12 tRLRH RD Pulse Width 365 3.0tCLCL-10 14 tWHDX Data Hold After WR High 240 2.0tCLCL-10 15 tDVWH Data Valid to WR High 375 3.0tCLCL 16 tWLWH WR Pulse Width 365 3.0tCLCL-10 Table 31-15. External Data Memory Characteristics, 2.7 to 5.5 Volts, No Wait-state Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz381 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1. 2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1. 1 tLHLL ALE Pulse Width 235 tCLCL-15 ns 2 tAVLL Address Valid A to ALE Low 115 0.5tCLCL-10(1) 3a tLLAX_ST Address Hold After ALE Low, write access 5 5 3b tLLAX_LD Address Hold after ALE Low, read access 5 5 4 tAVLLC Address Valid C to ALE Low 115 0.5tCLCL-10(1) 5 tAVRL Address Valid to RD Low 235 1.0tCLCL-15 6 tAVWL Address Valid to WR Low 235 1.0tCLCL-15 7 tLLWL ALE Low to WR Low 115 130 0.5tCLCL-10(2) 0.5tCLCL+5(2) 8 tLLRL ALE Low to RD Low 115 130 0.5tCLCL-10(2) 0.5tCLCL+5(2) 9 tDVRH Data Setup to RD High 45 45 10 tRLDV Read Low to Data Valid 190 1.0tCLCL-60 11 tRHDX Data Hold After RD High 0 0 12 tRLRH RD Pulse Width 235 1.0tCLCL-15 13 tDVWL Data Setup to WR Low 105 0.5tCLCL-20(1) 14 tWHDX Data Hold After WR High 235 1.0tCLCL-15 15 tDVWH Data Valid to WR High 250 1.0tCLCL 16 tWLWH WR Pulse Width 235 1.0tCLCL-15 Table 31-15. External Data Memory Characteristics, 2.7 to 5.5 Volts, No Wait-state (Continued) Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit Table 31-16. External Data Memory Characteristics, 2.7 to 5.5 Volts, SRWn1 = 0, SRWn0 = 1 Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 10 tRLDV Read Low to Data Valid 440 2.0tCLCL-60 ns 12 tRLRH RD Pulse Width 485 2.0tCLCL-15 15 tDVWH Data Valid to WR High 500 2.0tCLCL 16 tWLWH WR Pulse Width 485 2.0tCLCL-15382 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 31-9. External Memory Timing (SRWn1 = 0, SRWn0 = 0 Table 31-17. External Data Memory Characteristics, 2.7 to 5.5 Volts, SRWn1 = 1, SRWn0 = 0 Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60 ns 12 tRLRH RD Pulse Width 735 3.0tCLCL-15 15 tDVWH Data Valid to WR High 750 3.0tCLCL 16 tWLWH WR Pulse Width 735 3.0tCLCL-15 Table 31-18. External Data Memory Characteristics, 2.7 to 5.5 Volts, SRWn1 = 1, SRWn0 = 1 Symbol Parameter 4MHz Oscillator Variable Oscillator Min Max Min Max Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60 ns 12 tRLRH RD Pulse Width 735 3.0tCLCL-15 14 tWHDX Data Hold After WR High 485 2.0tCLCL-15 15 tDVWH Data Valid to WR High 750 3.0tCLCL 16 tWLWH WR Pulse Width 735 3.0tCLCL-15 ALE T1 T2 T3 Write Read WR T4 A15:8 Prev. addr. Address DA7:0 Prev. data Address Data XX RD DA7:0 (XMBK = 0) Address Data System Clock (CLKCPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9383 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 31-10. External Memory Timing (SRWn1 = 0, SRWn0 = 1) Figure 31-11. External Memory Timing (SRWn1 = 1, SRWn0 = 0) ALE T1 T2 T3 Write Read WR T5 A15:8 Prev. addr. Address DA7:0 Prev. data Address XX Data RD DA7:0 (XMBK = 0) Address Data System Clock (CLKCPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 T4 ALE T1 T2 T3 Write Read WR T6 A15:8 Prev. addr. Address DA7:0 Prev. data Address Data XX RD DA7:0 (XMBK = 0) Address Data System Clock (CLKCPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 T4 T5384 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 31-12. External Memory Timing (SRWn1 = 1, SRWn0 = 1)() The ALE pulse in the last period (T4-T7) is only present if the next instruction accesses the RAM (internal or external). ALE T1 T2 T3 Write Read WR T7 A15:8 Prev. addr. Address DA7:0 Prev. data Address Data XX RD DA7:0 (XMBK = 0) Address Data System Clock (CLKCPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 T4 T5 T6385 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 32. Typical Characteristics The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock source. All Active- and Idle current consumption measurements are done with all bits in the PRR registers set and thus, the corresponding I/O modules are turned off. Also the Analog Comparator is disabled during these measurements. Table 32-1 on page 390 and Table 32-2 on page 391 show the additional current consumption compared to ICC Active and ICC Idle for every I/O module controlled by the Power Reduction Register. See “Power Reduction Register” on page 54 for details. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as CL × VCC × f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. 32.1 Active Supply Current Figure 32-1. Active Supply Current vs. frequency (0.1MHz - 1.0MHz) 5.5V 5.0V 4.5V 4.0V 3.3V 2.7V 1.8V 0 0.5 1 1.5 2 2.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (m A)386 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-2. Active Supply Current vs. Frequency (1MHz - 16MHz) Figure 32-3. Active Supply Current vs. VCC (Internal RC Oscillator, 8MHz) 5.5V 5.0V 4.5V 0 5 10 15 20 25 0246 8 10 12 14 16 Frequency (MHz) ICC (m A) 4.0V 3.3V 2.7V 1.8V 85°C 25°C -40°C 0 2 4 6 8 10 12 14 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)387 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1MHz) Figure 32-5. Active Supply Current vs. VCC (Internal RC Oscillator, 128kHz) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)388 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 32.2 Idle Supply Current Figure 32-6. Idle Supply Current vs. Low Frequency (0.1MHz - 1.0MHz) Figure 32-7. Idle Supply Current vs. Frequency (1MHz - 16MHz) 5.5V 5.0V 4.5V 4.0V 3.3V 2.7V 1.8V 0 0.1 0.2 0.3 0.4 0.5 0.6 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) 5.5V 5.0V 4.5V 0 1 2 3 4 5 6 7 8 0246 8 10 12 14 16 Frequency (MHz) ICC (mA) 4.0V 3.3V 2.7V 1.8V389 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 8MHz) Figure 32-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 1MHz) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)390 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 128kHz)I 32.2.1 Supply Current of IO modules The tables and formulas below can be used to calculate the additional current consumption for the different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modules are controlled by the Power Reduction Register. See “Power Reduction Register” on page 54 for details. 85°C 25°C -40°C 0 0.05 0.1 0.15 0.2 0.25 0.3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (m A ) Table 32-1. Additional Current Consumption for the different I/O modules (absolute values) PRR bit Typical numbers VCC = 2V, F = 1MHz VCC = 3V, F = 4MHz VCC = 5V, F = 8MHz PRUSART3 8.0µA 51µA 220µA PRUSART2 8.0µA 51µA 220µA PRUSART1 8.0µA 51µA 220µA PRUSART0 8.0µA 51µA 220µA PRTWI 12µA 75µA 315µA PRTIM5 6.0µA 39µA 150µA PRTIM4 6.0µA 39µA 150µA PRTIM3 6.0µA 39µA 150µA PRTIM2 11µA 72µA 300µA PRTIM1 6.0µA 39µA 150µA PRTIM0 4.0µA 24µA 100µA PRSPI 15µA 95µA 400µA PRADC 12µA 75µA 315µA391 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 It is possible to calculate the typical current consumption based on the numbers from Table 32-1 on page 390 for other VCC and frequency settings than listed in Table 32-2. 32.2.1.1 Example 1 Calculate the expected current consumption in idle mode with USART0, TIMER1, and TWI enabled at VCC = 2.0V and F = 1MHz. From Table 32-2, third column, we see that we need to add 17% for the USART0, 24% for the TWI, and 10% for the TIMER1 module. Reading from Figure 32-6 on page 388, we find that the idle current consumption is ~0.15mA at VCC = 2.0V and F = 1MHz. The total current consumption in idle mode with USART0, TIMER1, and TWI enabled, gives: Table 32-2. Additional Current Consumption (percentage) in Active and Idle mode PRR bit Additional Current consumption compared to Active with external clock Additional Current consumption compared to Idle with external clock PRUSART3 3.0% 17% PRUSART2 3.0% 17% PRUSART1 3.0% 17% PRUSART0 3.0% 17% PRTWI 4.4% 24% PRTIM5 1.8% 10% PRTIM4 1.8% 10% PRTIM3 1.8% 10% PRTIM2 4.3% 23% PRTIM1 1.8% 10% PRTIM0 1.5% 8.0% PRSPI 3.3% 18% PRADC 4.5% 24% ICCtotal ≈ ≈ 0.15mA • ( ) 1 0.17 0.24 0.10 +++ 0.227mA392 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 32.3 Power-down Supply Current Figure 32-11. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) Figure 32-12. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C -40°C 0 2 4 6 8 10 12 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C393 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 32.4 Power-save Supply Current Figure 32-13. Power-save Supply Current vs. VCC (Watchdog Timer Disabled) Figure 32-14. Power-save Supply Current vs. VCC (Watchdog Timer Enabled) 25°C 4 5 6 7 8 9 10 11 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC(µA) 0 1 2 3 4 5 6 7 8 9 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C394 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 32.5 Standby Supply Current Figure 32-15. Standby Supply Current vs. VCC (Watchdog Timer Disabled) 32.6 Pin Pull-up Figure 32-16. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 1.8V) 6MHz xtal 6MHz res 4MHz xtal 4MHz res 455kHz res 32kHz xtal 2MHz xtal 2MHz res 1MHz res 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 10 20 30 40 50 60 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VOP (V) IOP (µA)395 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-17. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V) Figure 32-18. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V) 85°C 25°C 0 -40°C 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 3 VOP (V) IOP (µA) 85°C 25°C 0 -40°C 20 40 60 80 100 120 140 160 0123456 VOP (V) IOP (µA)396 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-19. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V) Figure 32-20. Reset pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) 85°C 25°C -40°C 0 5 10 15 20 25 30 35 40 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VRESET (V) IRESET (µA) 85°C 25°C -40°C 0 10 20 30 40 50 60 70 0 0.5 1 1.5 2 2.5 3 VRESET (V) IRESET (µA)397 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-21. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) 32.7 Pin Driver Strength Figure 32-22. I/O Pin output Voltage vs.Sink Current (VCC = 3V) 85°C 25°C -40°C 0 20 40 60 80 100 120 0123 456 VRESET (V) IRESET (µA) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 5 10 15 20 25 IOL (mA) VOL (V)398 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-23. I/O Pin Output Voltage vs. Sink Current (VCC = 5V) Figure 32-24. I/O Pin Output Voltage vs. Source Current (VCC = 3V) 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 IOL (mA) VOL (V) 85°C 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 0 5 10 15 20 25 IOH (mA) VOH (V)399 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-25. I/O Pin Output Voltage vs. Source Current (VCC = 5V) 32.8 Pin Threshold and Hysteresis Figure 32-26. I/O Pin Input Threshold Voltage vs. VCC (VIH, IO Pin Read as “1“) 85°C 25°C -40°C 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 5.1 0 5 10 15 20 25 IOH (mA) VOH (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V)400 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-27. I/O Pin Input Threshold Voltage vs. VCC (VIL, IO Pin Read as “0“) Figure 32-28. I/O Pin Input Hysteresis 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (mV)401 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-29. Reset Input Threshold Voltage vs. VCC (VIH, IO Pin Read as “1“) Figure 32-30. Reset Input Threshold Voltage vs. VCC (VIL, IO Pin Read as “0“) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V)402 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-31. Reset Pin Input Hysteresis vs. VCC 32.9 BOD Threshold and Analog Comparator Offset Figure 32-32. BOD Threshold vs. Temperature (BOD Level is 4.3V) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (mV) Rising Vcc Falling Vcc 4.2 4.25 4.3 4.35 4.4 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) Threshold (V)403 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-33. BOD Threshold vs. Temperature (BOD Level is 2.7V) Figure 32-34. BOD Threshold vs. Temperature (BOD Level is 1.8V) Rising Vcc Falling Vcc 2.6 2.65 2.7 2.75 2.8 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) Threshold (V) Rising Vcc Fallling Vcc 1.7 1.75 1.8 1.85 1.9 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) T hre shold (V )404 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 32.10 Internal Oscillator Speed Figure 32-35. Watchdog Oscillator Frequency vs. VCC Figure 32-36. Watchdog Oscillator Frequency vs. Temperature 85°C 25°C -40°C 114 116 118 120 122 124 126 128 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (kHz) 5.5V 4.0V 3.3V 2.7V 2.1V 114 116 118 120 122 124 126 128 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (kHz)405 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-37. Calibrated 8MHz RC Oscillator Frequency vs. VCC Figure 32-38. Calibrated 8MHz RC Oscillator Frequency vs. Temperature 85°C 25°C -40°C 7.6 7.7 7.8 7.9 8 8.1 8.2 8.3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 5.0V 3.0V 7.9 8 8.1 8.2 8.3 8.4 8.5 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (MHz)406 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-39. Calibrated 8MHz RC Oscillator Frequency vs. Osccal Value 32.11 Current Consumption of Peripheral Units Figure 32-40. Brownout Detector Current vs. VCC 85°C 25°C -40°C 0 2 4 6 8 10 12 14 16 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL (X1) FRC (MHz) 85°C 25°C -40°C 0 5 10 15 20 25 30 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)407 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-41. ADC Current vs. VCC (AREF = AVCC) Figure 32-42. AREF External Reference Current vs. VCC 85°C 25°C -40°C 0 50 100 150 200 250 300 350 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 50 100 150 200 250 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)408 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-43. Watchdog Timer Current vs. VCC Figure 32-44. Analog Comparator Current vs. VCC 85°C 25°C -40°C 0 1 2 3 4 5 6 7 8 9 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 10 20 30 40 50 60 70 80 90 100 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)409 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-45. Programming Current vs. VCC 32.12 Current Consumption in Reset and Reset Pulsewidth Figure 32-46. Reset Supply Current vs VCC (0.1MHz - 1.0MHz, Excluding Current Through The Reset Pull-up) 85°C 25°C -40°C 0 2 4 6 8 10 12 14 16 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 5.5V 5.0V 4.5V 4.0V 3.3V 2.7V 1.8V 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)410 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Figure 32-47. Reset Supply Current vs. VCC (1MHz - 16MHz, Excluding Current Through The Reset Pull-up) Figure 32-48. Minimum Reset Pulse Width vs. VCC 5.5V 5.0V 4.5V 0 0.5 1 1.5 2 2.5 3 3.5 4 0246 8 10 12 14 16 Frequency (MHz) ICC (mA) 4.0V 3.3V 2.7V 1.8V 85°C 25°C -40°C 0 500 1000 1500 2000 2500 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Pu lsewidth (ns)411 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 33. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page (0x1FF) Reserved - - - - - - - - ... Reserved - - - - - - - - (0x13F) Reserved (0x13E) Reserved (0x13D) Reserved (0x13C) Reserved (0x13B) Reserved (0x13A) Reserved (0x139) Reserved (0x138) Reserved (0x137) Reserved (0x136) UDR3 USART3 I/O Data Register 222 (0x135) UBRR3H - - - - USART3 Baud Rate Register High Byte 227 (0x134) UBRR3L USART3 Baud Rate Register Low Byte 227 (0x133) Reserved - - - - - - - - (0x132) UCSR3C UMSEL31 UMSEL30 UPM31 UPM30 USBS3 UCSZ31 UCSZ30 UCPOL3 239 (0x131) UCSR3B RXCIE3 TXCIE3 UDRIE3 RXEN3 TXEN3 UCSZ32 RXB83 TXB83 238 (0x130) UCSR3A RXC3 TXC3 UDRE3 FE3 DOR3 UPE3 U2X3 MPCM3 238 (0x12F) Reserved - - - - - - - - (0x12E) Reserved - - - - - - - - (0x12D) OCR5CH Timer/Counter5 - Output Compare Register C High Byte 165 (0x12C) OCR5CL Timer/Counter5 - Output Compare Register C Low Byte 165 (0x12B) OCR5BH Timer/Counter5 - Output Compare Register B High Byte 165 (0x12A) OCR5BL Timer/Counter5 - Output Compare Register B Low Byte 165 (0x129) OCR5AH Timer/Counter5 - Output Compare Register A High Byte 164 (0x128) OCR5AL Timer/Counter5 - Output Compare Register A Low Byte 164 (0x127) ICR5H Timer/Counter5 - Input Capture Register High Byte 165 (0x126) ICR5L Timer/Counter5 - Input Capture Register Low Byte 165 (0x125) TCNT5H Timer/Counter5 - Counter Register High Byte 163 (0x124) TCNT5L Timer/Counter5 - Counter Register Low Byte 163 (0x123) Reserved - - - - - - - - (0x122) TCCR5C FOC5A FOC5B FOC5C - - - - - 162 (0x121) TCCR5B ICNC5 ICES5 - WGM53 WGM52 CS52 CS51 CS50 160 (0x120) TCCR5A COM5A1 COM5A0 COM5B1 COM5B0 COM5C1 COM5C0 WGM51 WGM50 158 (0x11F) Reserved - - - - - - - - (0x11E) Reserved - - - - - - - - (0x11D) Reserved - - - - - - - - (0x11C) Reserved - - - - - - - - (0x11B) Reserved - - - - - - - - (0x11A) Reserved - - - - - - - - (0x119) Reserved - - - - - - - - (0x118) Reserved - - - - - - - - (0x117) Reserved - - - - - - - - (0x116) Reserved - - - - - - - - (0x115) Reserved - - - - - - - - (0x114) Reserved - - - - - - - - (0x113) Reserved - - - - - - - - (0x112) Reserved - - - - - - - - (0x111) Reserved - - - - - - - - (0x110) Reserved - - - - - - - - (0x10F) Reserved - - - - - - - - (0x10E) Reserved - - - - - - - - (0x10D) Reserved - - - - - - - - (0x10C) Reserved - - - - - - - - (0x10B) PORTL PORTL7 PORTL6 PORTL5 PORTL4 PORTL3 PORTL2 PORTL1 PORTL0 104 (0x10A) DDRL DDL7 DDL6 DDL5 DDL4 DDL3 DDL2 DDL1 DDL0 104 (0x109) PINL PINL7 PINL6 PINL5 PINL4 PINL3 PINL2 PINL1 PINL0 104 (0x108) PORTK PORTK7 PORTK6 PORTK5 PORTK4 PORTK3 PORTK2 PORTK1 PORTK0 103 (0x107) DDRK DDK7 DDK6 DDK5 DDK4 DDK3 DDK2 DDK1 DDK0 103 (0x106) PINK PINK7 PINK6 PINK5 PINK4 PINK3 PINK2 PINK1 PINK0 103 (0x105) PORTJ PORTJ7 PORTJ6 PORTJ5 PORTJ4 PORTJ3 PORTJ2 PORTJ1 PORTJ0 103 (0x104) DDRJ DDJ7 DDJ6 DDJ5 DDJ4 DDJ3 DDJ2 DDJ1 DDJ0 103 (0x103) PINJ PINJ7 PINJ6 PINJ5 PINJ4 PINJ3 PINJ2 PINJ1 PINJ0 103 (0x102) PORTH PORTH7 PORTH6 PORTH5 PORTH4 PORTH3 PORTH2 PORTH1 PORTH0 102 (0x101) DDRH DDH7 DDH6 DDH5 DDH4 DDH3 DDH2 DDH1 DDH0 103412 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 (0x100) PINH PINH7 PINH6 PINH5 PINH4 PINH3 PINH2 PINH1 PINH0 103 (0xFF) Reserved - - - - - - - - (0xFE) Reserved - - - - - - - - (0xFD) Reserved - - - - - - - - (0xFC) Reserved - - - - - - - - (0xFB) Reserved - - - - - - - - (0xFA) Reserved - - - - - - - - (0xF9) Reserved - - - - - - - - (0xF8) Reserved - - - - - - - - (0xF7) Reserved - - - - - - - - (0xF6) Reserved - - - - - - - - (0xF5) Reserved - - - - - - - - (0xF4) Reserved - - - - - - - - (0xF3) Reserved - - - - - - - - (0xF2) Reserved - - - - - - - - (0xF1) Reserved - - - - - - - - (0xF0) Reserved - - - - - - - - (0xEF) Reserved - - - - - - - - (0xEE) Reserved - - - - - - - - (0xED) Reserved - - - - - - - - (0xEC) Reserved - - - - - - - - (0xEB) Reserved - - - - - - - (0xEA) Reserved - - - - - - - - (0xE9) Reserved - - - - - - - - (0xE8) Reserved - - - - - - - - (0xE7) Reserved - - - - - - - (0xE6) Reserved - - - - - - - - (0xE5) Reserved - - - - - - - - (0xE4) Reserved - - - - - - - - (0xE3) Reserved - - - - - - - (0xE2) Reserved - - - - - - - - (0xE1) Reserved - - - - - - - (0xE0) Reserved - - - - - - - (0xDF) Reserved - - - - - - - - (0xDE) Reserved - - - - - - - - (0xDD) Reserved - - - - - - - (0xDC) Reserved - - - - - - - - (0xDB) Reserved - - - - - - - - (0xDA) Reserved - - - - - - - - (0xD9) Reserved - - - - - - - (0xD8) Reserved - - - - - - - - (0xD7) Reserved - - - - - - - - (0xD6) UDR2 USART2 I/O Data Register 222 (0xD5) UBRR2H - - - - USART2 Baud Rate Register High Byte 227 (0xD4) UBRR2L USART2 Baud Rate Register Low Byte 227 (0xD3) Reserved - - - - - - - - (0xD2) UCSR2C UMSEL21 UMSEL20 UPM21 UPM20 USBS2 UCSZ21 UCSZ20 UCPOL2 239 (0xD1) UCSR2B RXCIE2 TXCIE2 UDRIE2 RXEN2 TXEN2 UCSZ22 RXB82 TXB82 238 (0xD0) UCSR2A RXC2 TXC2 UDRE2 FE2 DOR2 UPE2 U2X2 MPCM2 238 (0xCF) Reserved - - - - - - - - (0xCE) UDR1 USART1 I/O Data Register 222 (0xCD) UBRR1H - - - - USART1 Baud Rate Register High Byte 227 (0xCC) UBRR1L USART1 Baud Rate Register Low Byte 227 (0xCB) Reserved - - - - - - - - (0xCA) UCSR1C UMSEL11 UMSEL10 UPM11 UPM10 USBS1 UCSZ11 UCSZ10 UCPOL1 239 (0xC9) UCSR1B RXCIE1 TXCIE1 UDRIE1 RXEN1 TXEN1 UCSZ12 RXB81 TXB81 238 (0xC8) UCSR1A RXC1 TXC1 UDRE1 FE1 DOR1 UPE1 U2X1 MPCM1 238 (0xC7) Reserved - - - - - - - - (0xC6) UDR0 USART0 I/O Data Register 222 (0xC5) UBRR0H - - - - USART0 Baud Rate Register High Byte 227 (0xC4) UBRR0L USART0 Baud Rate Register Low Byte 227 (0xC3) Reserved - - - - - - - - (0xC2) UCSR0C UMSEL01 UMSEL00 UPM01 UPM00 USBS0 UCSZ01 UCSZ00 UCPOL0 239 (0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 238 (0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 238 (0xBF) Reserved - - - - - - - - Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page413 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 (0xBE) Reserved - - - - - - - - (0xBD) TWAMR TWAM6 TWAM5 TWAM4 TWAM3 TWAM2 TWAM1 TWAM0 - 269 (0xBC) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN - TWIE 266 (0xBB) TWDR 2-wire Serial Interface Data Register 268 (0xBA) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE 269 (0xB9) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 - TWPS1 TWPS0 268 (0xB8) TWBR 2-wire Serial Interface Bit Rate Register 266 (0xB7) Reserved - - - - - - - - (0xB6) ASSR - EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB 184 (0xB5) Reserved - - - - - - - - (0xB4) OCR2B Timer/Counter2 Output Compare Register B 191 (0xB3) OCR2A Timer/Counter2 Output Compare Register A 191 (0xB2) TCNT2 Timer/Counter2 (8 Bit) 191 (0xB1) TCCR2B FOC2A FOC2B - - WGM22 CS22 CS21 CS20 190 (0xB0) TCCR2A COM2A1 COM2A0 COM2B1 COM2B0 - - WGM21 WGM20 191 (0xAF) Reserved - - - - - - - - (0xAE) Reserved - - - - - - - - (0xAD) OCR4CH Timer/Counter4 - Output Compare Register C High Byte 164 (0xAC) OCR4CL Timer/Counter4 - Output Compare Register C Low Byte 164 (0xAB) OCR4BH Timer/Counter4 - Output Compare Register B High Byte 164 (0xAA) OCR4BL Timer/Counter4 - Output Compare Register B Low Byte 164 (0xA9) OCR4AH Timer/Counter4 - Output Compare Register A High Byte 164 (0xA8) OCR4AL Timer/Counter4 - Output Compare Register A Low Byte 164 (0xA7) ICR4H Timer/Counter4 - Input Capture Register High Byte 165 (0xA6) ICR4L Timer/Counter4 - Input Capture Register Low Byte 165 (0xA5) TCNT4H Timer/Counter4 - Counter Register High Byte 163 (0xA4) TCNT4L Timer/Counter4 - Counter Register Low Byte 163 (0xA3) Reserved - - - - - - - - (0xA2) TCCR4C FOC4A FOC4B FOC4C - - - - - 162 (0xA1) TCCR4B ICNC4 ICES4 - WGM43 WGM42 CS42 CS41 CS40 160 (0xA0) TCCR4A COM4A1 COM4A0 COM4B1 COM4B0 COM4C1 COM4C0 WGM41 WGM40 158 (0x9F) Reserved - - - - - - - - (0x9E) Reserved - - - - - - - - (0x9D) OCR3CH Timer/Counter3 - Output Compare Register C High Byte 164 (0x9C) OCR3CL Timer/Counter3 - Output Compare Register C Low Byte 164 (0x9B) OCR3BH Timer/Counter3 - Output Compare Register B High Byte 164 (0x9A) OCR3BL Timer/Counter3 - Output Compare Register B Low Byte 164 (0x99) OCR3AH Timer/Counter3 - Output Compare Register A High Byte 163 (0x98) OCR3AL Timer/Counter3 - Output Compare Register A Low Byte 163 (0x97) ICR3H Timer/Counter3 - Input Capture Register High Byte 165 (0x96) ICR3L Timer/Counter3 - Input Capture Register Low Byte 165 (0x95) TCNT3H Timer/Counter3 - Counter Register High Byte 162 (0x94) TCNT3L Timer/Counter3 - Counter Register Low Byte 162 (0x93) Reserved - - - - - - - - (0x92) TCCR3C FOC3A FOC3B FOC3C - - - - - 162 (0x91) TCCR3B ICNC3 ICES3 - WGM33 WGM32 CS32 CS31 CS30 160 (0x90) TCCR3A COM3A1 COM3A0 COM3B1 COM3B0 COM3C1 COM3C0 WGM31 WGM30 158 (0x8F) Reserved - - - - - - - - (0x8E) Reserved - - - - - - - - (0x8D) OCR1CH Timer/Counter1 - Output Compare Register C High Byte 163 (0x8C) OCR1CL Timer/Counter1 - Output Compare Register C Low Byte 163 (0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte 163 (0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte 163 (0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte 163 (0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte 163 (0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte 165 (0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte 165 (0x85) TCNT1H Timer/Counter1 - Counter Register High Byte 162 (0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte 162 (0x83) Reserved - - - - - - - - (0x82) TCCR1C FOC1A FOC1B FOC1C - - - - - 161 (0x81) TCCR1B ICNC1 ICES1 - WGM13 WGM12 CS12 CS11 CS10 160 (0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 COM1C1 COM1C0 WGM11 WGM10 158 (0x7F) DIDR1 - - - - - - AIN1D AIN0D 274 (0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D 295 (0x7D) DIDR2 ADC15D ADC14D ADC13D ADC12D ADC11D ADC10D ADC9D ADC8D 295 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page414 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 (0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 289 (0x7B) ADCSRB - ACME - - MUX5 ADTS2 ADTS1 ADTS0 272, 290, 294 (0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 292 (0x79) ADCH ADC Data Register High byte 294 (0x78) ADCL ADC Data Register Low byte 294 (0x77) Reserved - - - - - - - - (0x76) Reserved - - - - - - - - (0x75) XMCRB XMBK - - - - XMM2 XMM1 XMM0 38 (0x74) XMCRA SRE SRL2 SRL1 SRL0 SRW11 SRW10 SRW01 SRW00 37 (0x73) TIMSK5 - - ICIE5 - OCIE5C OCIE5B OCIE5A TOIE5 166 (0x72) TIMSK4 - - ICIE4 - OCIE4C OCIE4B OCIE4A TOIE4 166 (0x71) TIMSK3 - - ICIE3 - OCIE3C OCIE3B OCIE3A TOIE3 166 (0x70) TIMSK2 - - - - - OCIE2B OCIE2A TOIE2 193 (0x6F) TIMSK1 - - ICIE1 - OCIE1C OCIE1B OCIE1A TOIE1 166 (0x6E) TIMSK0 - - - - - OCIE0B OCIE0A TOIE0 134 (0x6D) PCMSK2 PCINT23 PCINT22 PCINT21 PCINT20 PCINT19 PCINT18 PCINT17 PCINT16 116 (0x6C) PCMSK1 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 116 (0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 117 (0x6A) EICRB ISC71 ISC70 ISC61 ISC60 ISC51 ISC50 ISC41 ISC40 114 (0x69) EICRA ISC31 ISC30 ISC21 ISC20 ISC11 ISC10 ISC01 ISC00 113 (0x68) PCICR - - - - - PCIE2 PCIE1 PCIE0 115 (0x67) Reserved - - - - - - - - (0x66) OSCCAL Oscillator Calibration Register 50 (0x65) PRR1 - - PRTIM5 PRTIM4 PRTIM3 PRUSART3 PRUSART2 PRUSART1 57 (0x64) PRR0 PRTWI PRTIM2 PRTIM0 - PRTIM1 PRSPI PRUSART0 PRADC 56 (0x63) Reserved - - - - - - - - (0x62) Reserved - - - - - - - - (0x61) CLKPR CLKPCE - - - CLKPS3 CLKPS2 CLKPS1 CLKPS0 50 (0x60) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 67 0x3F (0x5F) SREG I T H S V N Z C 14 0x3E (0x5E) SPH SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 16 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 16 0x3C (0x5C) EIND - - - - - - - EIND0 17 0x3B (0x5B) RAMPZ - - - - - - RAMPZ1 RAMPZ0 17 0x3A (0x5A) Reserved - - - - - - - - 0x39 (0x59) Reserved - - - - - - - - 0x38 (0x58) Reserved - - - - - - - - 0x37 (0x57) SPMCSR SPMIE RWWSB SIGRD RWWSRE BLBSET PGWRT PGERS SPMEN 332 0x36 (0x56) Reserved - - - - - - - - 0x35 (0x55) MCUCR JTD - - PUD - - IVSEL IVCE 67, 110, 100, 308 0x34 (0x54) MCUSR - - - JTRF WDRF BORF EXTRF PORF 308 0x33 (0x53) SMCR - - - - SM2 SM1 SM0 SE 52 0x32 (0x52) Reserved - - - - - - - - 0x31 (0x51) OCDR OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 301 0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 272 0x2F (0x4F) Reserved - - - - - - - - 0x2E (0x4E) SPDR SPI Data Register 204 0x2D (0x4D) SPSR SPIF WCOL - - - - - SPI2X 203 0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 202 0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 37 0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 37 0x29 (0x49) Reserved - - - - - - - - 0x28 (0x48) OCR0B Timer/Counter0 Output Compare Register B 133 0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A 133 0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) 133 0x25 (0x45) TCCR0B FOC0A FOC0B - - WGM02 CS02 CS01 CS00 132 0x24 (0x44) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 - - WGM01 WGM00 129 0x23 (0x43) GTCCR TSM - - - - - PSRASY PSRSYNC 170, 194 0x22 (0x42) EEARH - - - - EEPROM Address Register High Byte 35 0x21 (0x41) EEARL EEPROM Address Register Low Byte 35 0x20 (0x40) EEDR EEPROM Data Register 35 0x1F (0x3F) EECR - - EEPM1 EEPM0 EERIE EEMPE EEPE EERE 35 0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 37 0x1D (0x3D) EIMSK INT7 INT6 INT5 INT4 INT3 INT2 INT1 INT0 115 0x1C (0x3C) EIFR INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 INTF0 115 0x1B (0x3B) PCIFR - - - - - PCIF2 PCIF1 PCIF0 116 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page415 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the status flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O registers as data space using LD and ST instructions, $20 must be added to these addresses. The ATmega640/1280/1281/2560/2561 is a complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from $60 - $1FF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. 0x1A (0x3A) TIFR5 - - ICF5 - OCF5C OCF5B OCF5A TOV5 166 0x19 (0x39) TIFR4 - - ICF4 - OCF4C OCF4B OCF4A TOV4 167 0x18 (0x38) TIFR3 - - ICF3 - OCF3C OCF3B OCF3A TOV3 167 0x17 (0x37) TIFR2 - - - - - OCF2B OCF2A TOV2 193 0x16 (0x36) TIFR1 - - ICF1 - OCF1C OCF1B OCF1A TOV1 167 0x15 (0x35) TIFR0 - - - - - OCF0B OCF0A TOV0 134 0x14 (0x34) PORTG - - PORTG5 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 102 0x13 (0x33) DDRG - - DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 102 0x12 (0x32) PING - - PING5 PING4 PING3 PING2 PING1 PING0 102 0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 101 0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 102 0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 102 0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 101 0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 101 0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 102 0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 101 0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 101 0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 101 0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 101 0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 101 0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 101 0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 100 0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 100 0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 100 0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 100 0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 100 0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 100 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page416 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 34. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z, C, N, V, H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z, C, N, V, H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z, C, N, V, S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z, C, N, V, H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z, C, N, V, H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z, C, N, V, H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z, C, N, V, H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z, C, N, V, S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z, N, V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z, N, V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z, N, V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z, N, V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z, N, V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z, C, N, V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z, C, N, V, H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z, N, V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z, N, V 1 INC Rd Increment Rd ← Rd + 1 Z, N, V 1 DEC Rd Decrement Rd ← Rd − 1 Z, N, V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z, N, V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z, N, V 1 SER Rd Set Register Rd ← 0xFF None 1 MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z, C 2 MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z, C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z, C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z, C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z, C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z, C 2 BRANCH INSTRUCTIONS RJMP k Relative Jump PC ← PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC ← Z None 2 EIJMP Extended Indirect Jump to (Z) PC ←(EIND:Z) None 2 JMP k Direct Jump PC ← k None 3 RCALL k Relative Subroutine Call PC ← PC + k + 1 None 4 ICALL Indirect Call to (Z) PC ← Z None 4 EICALL Extended Indirect Call to (Z) PC ←(EIND:Z) None 4 CALL k Direct Subroutine Call PC ← k None 5 RET Subroutine Return PC ← STACK None 5 RETI Interrupt Return PC ← STACK I 5 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N, V, C, H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N, V, C, H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N, V, C, H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2417 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z, C, N, V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z, C, N, V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z, C, N, V 1 ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z, C, N, V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z, C, N, V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N 1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Twos Complement Overflow. V ← 1 V1 CLV Clear Twos Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd ← Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 LPM Load Program Memory R0 ← (Z) None 3 LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 ELPM Extended Load Program Memory R0 ← (RAMPZ:Z) None 3 ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3 Mnemonics Operands Description Operation Flags #Clocks418 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Note: EICALL and EIJMP do not exist in ATmega640/1280/1281. ELPM does not exist in ATmega640. ELPM Rd, Z+ Extended Load Program Memory Rd ← (RAMPZ:Z), RAMPZ:Z ←RAMPZ:Z+1 None 3 SPM Store Program Memory (Z) ← R1:R0 None - IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 BREAK Break For On-chip Debug Only None N/A Mnemonics Operands Description Operation Flags #Clocks419 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 35. Ordering Information Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. See “Speed Grades” on page 369. 3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 4. Tape & Reel. 35.1 ATmega640 Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range 8 1.8 - 5.5V ATmega640V-8AU ATmega640V-8AUR(4) ATmega640V-8CU ATmega640V-8CUR(4) 100A 100A 100C1 100C1 Industrial (-40°C to 85°C) 16 2.7 - 5.5V ATmega640-16AU ATmega640-16AUR(4) ATmega640-16CU ATmega640-16CUR(4) 100A 100A 100C1 100C1 Package Type 100A 100-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 100C1 100-ball, Chip Ball Grid Array (CBGA)420 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. See “Speed Grades” on page 369. 3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 4. Tape & Reel. 35.2 ATmega1280 Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range 8 1.8V - 5.5V ATmega1280V-8AU ATmega1280V-8AUR(4) ATmega1280V-8CU ATmega1280V-8CUR(4) 100A 100A 100C1 100C1 Industrial (-40°C to 85°C) 16 2.7V - 5.5V ATmega1280-16AU ATmega1280-16AUR(4) ATmega1280-16CU ATmega1280-16CUR(4) 100A 100A 100C1 100C1 Package Type 100A 100-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 100C1 100-ball, Chip Ball Grid Array (CBGA)421 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. See “Speed Grades” on page 369. 3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 4. Tape & Reel. 35.3 ATmega1281 Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range 8 1.8 - 5.5V ATmega1281V-8AU ATmega1281V-8AUR(4) ATmega1281V-8MU ATmega1281V-8MUR(4) 64A 64A 64M2 64M2 Industrial (-40°C to 85°C) 16 2.7 - 5.5V ATmega1281-16AU ATmega1281-16AUR(4) ATmega1281-16MU ATmega1281-16MUR(4) 64A 64A 64M2 64M2 Package Type 64A 64-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M2 64-pad, 9mm × 9mm × 1.0mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)422 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. See “Speed Grades” on page 369. 3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 4. Tape & Reel. 35.4 ATmega2560 Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range 8 1.8V - 5.5V ATmega2560V-8AU ATmega2560V-8AUR(4) ATmega2560V-8CU ATmega2560V-8CUR(4) 100A 100A 100C1 100C1 Industrial (-40°C to 85°C) 16 4.5V - 5.5V ATmega2560-16AU ATmega2560-16AUR(4) ATmega2560-16CU ATmega2560-16CUR(4) 100A 100A 100C1 100C1 Package Type 100A 100-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 100C1 100-ball, Chip Ball Grid Array (CBGA)423 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. See “Speed Grades” on page 369. 3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 4. Tape & Reel. 35.5 ATmega2561 Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range 8 1.8V - 5.5V ATmega1281V-8AU ATmega1281V-8AUR(4) ATmega1281V-8MU ATmega1281V-8MUR(4) 64A 64A 64M2 64M2 Industrial (-40°C to 85°C) 16 4.5V - 5.5V ATmega1281-16AU ATmega1281-16AUR(4) ATmega1281-16MU ATmega1281-16MUR(4) 64A 64A 64M2 64M2 Package Type 64A 64-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M2 64-pad, 9mm × 9mm × 1.0mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)424 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 36. Packaging Information 36.1 100A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 100A, 100-lead, 14 x 14mm Body Size, 1.0mm Body Thickness, 0.5mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 100A D 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.17 – 0.27 C 0.09 – 0.20 L 0.45 – 0.75 e 0.50 TYP Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.08mm maximum. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE425 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 36.2 100C1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 100C1, 100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.80 mm Chip Array BGA Package (CBGA) 100C1 A 5/25/06 TOP VIEW SIDE VIEW BOTTOM VIEW COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 1.10 – 1.20 A1 0.30 0.35 0.40 D 8.90 9.00 9.10 E 8.90 9.00 9.10 D1 7.10 7.20 7.30 E1 7.10 7.20 7.30 Øb 0.35 0.40 0.45 e 0.80 TYP Marked A1 Identifier 8 7 6 5 4 3 2 1 A B C D E 9 F G H I J 10 0.90 TYP 0.90 TYP A1 Corner 0.12 Z E D e e Øb A A1 E1 D1426 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 36.3 64A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64A, 64-lead, 14 x 14mm Body Size, 1.0mm Body Thickness, 0.8mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 64A C 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B COMMON DIMENSIONS (Unit of measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP427 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 36.4 64M2 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64M2, 64-pad, 9 x 9 x 1.0mm Bod y, Lead Pitch 0.50mm , 64M2 E 2010-10-20 COMMON DIMENSIONS (Unit of measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 – 0.02 0.05 b 0.18 0.25 0.30 D D2 7.50 7.65 7.80 8.90 9.00 9.10 E 8.90 9.00 9.10 E2 7.50 7.65 7.80 e 0.50 BSC L 0.35 0.40 0.45 TOP VIEW SIDE VIEW BOTTOM VIEW D E Marked pin# 1 ID SEATING PLANE A1 C A 0.08 C 1 2 3 K 0.20 0.27 0.40 2. Dimension and tolerance conform to ASMEY14.5M-1994. A3 0.20 REF A3 E2 D2 b e Pin #1 Corner L Pin #1 Triangle Pin #1 Chamfer (C 0.30) Option A Option B Pin #1 Notch (0.20 R) Option C K K Notes: 1. JEDEC Standard MO-220, (SAW Singulation) fig . 1, VMMD. 7.65mm Exposed Pad, Micro Lead Frame Package (MLF) 428 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 37. Errata 37.1 ATmega640 rev. B • Inaccurate ADC conversion in differential mode with 200× gain • High current consumption in sleep mode 1. Inaccurate ADC conversion in differential mode with 200× gain With AVCC <3.6V, random conversions will be inaccurate. Typical absolute accuracy may reach 64 LSB. Problem Fix/Workaround None. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled. 37.2 ATmega640 rev. A • Inaccurate ADC conversion in differential mode with 200× gain • High current consumption in sleep mode 1. Inaccurate ADC conversion in differential mode with 200× gain With AVCC <3.6V, random conversions will be inaccurate. Typical absolute accuracy may reach 64 LSB. Problem Fix/Workaround None. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled. 37.3 ATmega1280 rev. B • Inaccurate ADC conversion in differential mode with 200× gain • High current consumption in sleep mode 1. Inaccurate ADC conversion in differential mode with 200× gain With AVCC <3.6V, random conversions will be inaccurate. Typical absolute accuracy may reach 64 LSB.429 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 Problem Fix/Workaround None. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled. 37.4 ATmega1280 rev. A • Inaccurate ADC conversion in differential mode with 200× gain • High current consumption in sleep mode 1. Inaccurate ADC conversion in differential mode with 200× gain With AVCC <3.6V, random conversions will be inaccurate. Typical absolute accuracy may reach 64 LSB. Problem Fix/Workaround None. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled. 37.5 ATmega1281 rev. B • Inaccurate ADC conversion in differential mode with 200× gain • High current consumption in sleep mode 1. Inaccurate ADC conversion in differential mode with 200× gain With AVCC <3.6V, random conversions will be inaccurate. Typical absolute accuracy may reach 64 LSB. Problem Fix/Workaround None. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled.430 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 37.6 ATmega1281 rev. A • Inaccurate ADC conversion in differential mode with 200× gain • High current consumption in sleep mode 1. Inaccurate ADC conversion in differential mode with 200× gain With AVCC <3.6V, random conversions will be inaccurate. Typical absolute accuracy may reach 64 LSB. Problem Fix/Workaround None. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled. 37.7 ATmega2560 rev. F Not sampled. 37.8 ATmega2560 rev. E No known errata. 37.9 ATmega2560 rev. D Not sampled. 37.10 ATmega2560 rev. C • High current consumption in sleep mode 1. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected sleep mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem Fix/Workaround Before entering sleep, interrupts not used to wake the part from the sleep mode should be disabled. 37.11 ATmega2560 rev. B Not sampled.431 2549P–AVR–10/2012 ATmega640/1280/1281/2560/2561 37.12 ATmega2560 rev. A • Non-Read-While-Write area of flash not functional • Part does not work under 2.4 volts • Incorrect ADC reading in differential mode • Internal ADC reference has too low value • IN/OUT instructions may be executed twice when Stack is in external RAM • EEPROM read from application code does not work in Lock Bit Mode 3 1. Non-Read-While-Write area of flash not functional The Non-Read-While-Write area of the flash is not working as expected. The problem is related to the speed of the part when reading the flash of this area. Problem Fix/Workaround - Only use the first 248K of the flash. - If boot functionality is needed, run the code in the Non-Read-While-Write area at maximum 1/4th of the maximum frequency of the device at any given voltage. This is done by writing the CLKPR register before entering the boot section of the code. 2. Part does not work under 2.4 volts The part does not execute code correctly below 2.4 volts. Problem Fix/Workaround Do not use the part at voltages below 2.4 volts. 3. Incorrect ADC reading in differential mode The ADC has high noise in differential mode. It can give up to 7 LSB error. Problem Fix/Work