Features
• High Performance, Low Power Atmel® AVR® 8-Bit Microcontroller
• Advanced RISC Architecture
– 135 Powerful Instructions – Most Single Clock Cycle Execution
– 32 × 8 General Purpose Working Registers
– Fully Static Operation
– Up to 16 MIPS Throughput at 16MHz
– On-Chip 2-cycle Multiplier
• High Endurance Non-volatile Memory Segments
– 64K/128K/256KBytes of In-System Self-Programmable Flash
– 4Kbytes EEPROM
– 8Kbytes Internal SRAM
– Write/Erase Cycles:10,000 Flash/100,000 EEPROM
– Data retention: 20 years at 85°C/ 100 years at 25°C
– Optional Boot Code Section with Independent Lock Bits
• In-System Programming by On-chip Boot Program
• True Read-While-Write Operation
– Programming Lock for Software Security
• Endurance: Up to 64Kbytes Optional External Memory Space
• Atmel® QTouch® library support
– Capacitive touch buttons, sliders and wheels
– QTouch and QMatrix® acquisition
– Up to 64 sense channels
• JTAG (IEEE std. 1149.1 compliant) Interface
– Boundary-scan Capabilities According to the JTAG Standard
– Extensive On-chip Debug Support
– Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface
• Peripheral Features
– Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode
– Four 16-bit Timer/Counter with Separate Prescaler, Compare- and Capture Mode
– Real Time Counter with Separate Oscillator
– Four 8-bit PWM Channels
– Six/Twelve PWM Channels with Programmable Resolution from 2 to 16 Bits
(ATmega1281/2561, ATmega640/1280/2560)
– Output Compare Modulator
– 8/16-channel, 10-bit ADC (ATmega1281/2561, ATmega640/1280/2560)
– Two/Four Programmable Serial USART (ATmega1281/2561, ATmega640/1280/2560)
– Master/Slave SPI Serial Interface
– Byte Oriented 2-wire Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
– Interrupt and Wake-up on Pin Change
• Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated Oscillator
– External and Internal Interrupt Sources
– Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby,
and Extended Standby
• I/O and Packages
– 54/86 Programmable I/O Lines (ATmega1281/2561, ATmega640/1280/2560)
– 64-pad QFN/MLF, 64-lead TQFP (ATmega1281/2561)
– 100-lead TQFP, 100-ball CBGA (ATmega640/1280/2560)
– RoHS/Fully Green
• Temperature Range:
– -40°C to 85°C Industrial
• Ultra-Low Power Consumption
– Active Mode: 1MHz, 1.8V: 500µA
– Power-down Mode: 0.1µA at 1.8V
• Speed Grade:
– ATmega640V/ATmega1280V/ATmega1281V:
• 0 - 4MHz @ 1.8V - 5.5V, 0 - 8MHz @ 2.7V - 5.5V
– ATmega2560V/ATmega2561V:
• 0 - 2MHz @ 1.8V - 5.5V, 0 - 8MHz @ 2.7V - 5.5V
– ATmega640/ATmega1280/ATmega1281:
• 0 - 8MHz @ 2.7V - 5.5V, 0 - 16MHz @ 4.5V - 5.5V
– ATmega2560/ATmega2561:
• 0 - 16MHz @ 4.5V - 5.5V
8-bit Atmel
Microcontroller
with
64K/128K/256K
Bytes In-System
Programmable
Flash
ATmega640/V
ATmega1280/V
ATmega1281/V
ATmega2560/V
ATmega2561/V
2549P–AVR–10/20122
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
1. Pin Configurations
Figure 1-1. TQFP-pinout ATmega640/1280/2560
GND
VCC
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
AVCC
GND
AREF
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PF4 (ADC4/TCK)
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF7 (ADC7/TDI)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PK0 (ADC8/PCINT16) PK1 (ADC9/PCINT17) PK2 (ADC10/PCINT18) PK3 (ADC11/PCINT19) PK4 (ADC12/PCINT20) PK5 (ADC13/PCINT21) PK6 (ADC14/PCINT22) PK7 (ADC15/PCINT23)
(OC2B) PH6
(TOSC2) PG3
(TOSC1) PG4
(T4) PH7
RESET
(ICP4) PL0
VCC
GND
XTAL2
XTAL1
PL6
PL7
GND
VCC
(OC0B) PG5
VCC
GND
(RXD2) PH0
(TXD2) PH1
(XCK2) PH2
(OC4A) PH3
(OC4B) PH4
(OC4C) PH5
(RXD0/PCINT8) PE0
(TXD0) PE1
(XCK0/AIN0) PE2
(OC3A/AIN1) PE3
(OC3B/INT4) PE4
(OC3C/INT5) PE5
(T3/INT6) PE6
(CLKO/ICP3/INT7) PE7
(SS/PCINT0) PB0
(SCK/PCINT1) PB1
(MOSI/PCINT2) PB2
(MISO/PCINT3) PB3
(OC2A/PCINT4) PB4
(OC1A/PCINT5) PB5
(OC1B/PCINT6) PB6
(OC0A/OC1C/PCINT7) PB7
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
(TXD1/INT3) PD3
(ICP1) PD4
(XCK1) PD5
(T1) PD6
(T0) PD7
(SCL/INT0) PD0
(SDA/INT1) PD1
(RXD1/INT2) PD2
(ICP5) PL1
(T5) PL2
(OC5A) PL3
(OC5B) PL4
PJ6 (PCINT15)
PJ5 (PCINT14)
PJ4 (PCINT13)
PJ3 (PCINT12)
PJ2 (XCK3/PCINT11)
PJ1 (TXD3/PCINT10)
PJ0 (RXD3/PCINT9)
PJ7
(OC5C) PL5
INDEX CORNER3
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 1-2. CBGA-pinout ATmega640/1280/2560
Note: The functions for each pin is the same as for the 100 pin packages shown in Figure 1-1 on page 2.
A
B
C
D
E
F
G
H
J
K
1 2 3 4 5 6 7 8 9 10
A
B
C
D
E
F
G
H
J
K
10 9 8 7 6 5 4 3 2 1
Top view Bottom view
Table 1-1. CBGA-pinout ATmega640/1280/2560
1 2 3 4 5 6 7 8 9 10
A GND AREF PF0 PF2 PF5 PK0 PK3 PK6 GND VCC
B AVCC PG5 PF1 PF3 PF6 PK1 PK4 PK7 PA0 PA2
C PE2 PE0 PE1 PF4 PF7 PK2 PK5 PJ7 PA1 PA3
D PE3 PE4 PE5 PE6 PH2 PA4 PA5 PA6 PA7 PG2
E PE7 PH0 PH1 PH3 PH5 PJ6 PJ5 PJ4 PJ3 PJ2
F VCC PH4 PH6 PB0 PL4 PD1 PJ1 PJ0 PC7 GND
G GND PB1 PB2 PB5 PL2 PD0 PD5 PC5 PC6 VCC
H PB3 PB4 RESET PL1 PL3 PL7 PD4 PC4 PC3 PC2
J PH7 PG3 PB6 PL0 XTAL2 PL6 PD3 PC1 PC0 PG1
K PB7 PG4 VCC GND XTAL1 PL5 PD2 PD6 PD7 PG04
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 1-3. Pinout ATmega1281/2561
Note: The large center pad underneath the QFN/MLF package is made of metal and internally connected
to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
(RXD0/PCINT8/PDI) PE0
(TXD0/PDO) PE1
(XCK0/AIN0) PE2
(OC3A/AIN1) PE3
(OC3B/INT4) PE4
(OC3C/INT5) PE5
(T3/INT6) PE6
(ICP3/CLKO/INT7) PE7
(SS/PCINT0) PB0
(OC0B) PG5
(SCK/PCINT1) PB1
(MOSI/PCINT2) PB2
(MISO/PCINT3) PB3
(OC2A/ PCINT4) PB4
(OC1A/PCINT5) PB5
(OC1B/PCINT6) PB6
(OC0A/OC1C/PCINT7) PB7
(TOSC2) PG3
(TOSC1) PG4
RESET
VCC
GND
XTAL2
XTAL1
(SCL/INT0) PD0
(SDA/INT1) PD1
(RXD1/INT2) PD2
(TXD1/INT3) PD3
(ICP1) PD4
(XCK1) PD5
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
AVCC
GND
AREF
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PF4 (ADC4/TCK)
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF7 (ADC7/TDI)
GND
VCC
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
(T1) PD6
(T0) PD7
INDEX CORNER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
325
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
2. Overview
The ATmega640/1280/1281/2560/2561 is a low-power CMOS 8-bit microcontroller based on the
AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the
ATmega640/1280/1281/2560/2561 achieves throughputs approaching 1 MIPS per MHz allowing
the system designer to optimize power consumption versus processing speed.
2.1 Block Diagram
Figure 2-1. Block Diagram
CPU
GND
VCC
RESET
Power
Supervision
POR / BOD &
RESET
Watchdog
Oscillator
Watchdog
Timer
Oscillator
Circuits /
Clock
Generation
XTAL1
XTAL2
PC7..0 PORT C (8)
PA7..0 PORT A (8)
PORT D (8)
PD7..0
PORT B (8)
PB7..0
PORT E (8)
PE7..0
PORT F (8)
PF7..0
PORT J (8)
PJ7..0
PG5..0 PORT G (6)
PORT H (8)
PH7..0
PORT K (8)
PK7..0
PORT L (8)
PL7..0
XRAM
TWI SPI
EEPROM
JTAG
8 bit T/C 0 8 bit T/C 2
16 bit T/C 1
16 bit T/C 3
FLASH SRAM
16 bit T/C 4
16 bit T/C 5
USART 2
USART 1
USART 0
Internal
Bandgap reference
Analog
Comparator
A/D
Converter
USART 3
NOTE:
Shaded parts only available
in the 100-pin version.
Complete functionality for
the ADC, T/C4, and T/C5 only
available in the 100-pin version.6
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
The Atmel® AVR® core combines a rich instruction set with 32 general purpose working registers.
All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two
independent registers to be accessed in one single instruction executed in one clock cycle. The
resulting architecture is more code efficient while achieving throughputs up to ten times faster
than conventional CISC microcontrollers.
The ATmega640/1280/1281/2560/2561 provides the following features: 64K/128K/256K bytes of
In-System Programmable Flash with Read-While-Write capabilities, 4Kbytes EEPROM, 8
Kbytes SRAM, 54/86 general purpose I/O lines, 32 general purpose working registers, Real
Time Counter (RTC), six flexible Timer/Counters with compare modes and PWM, 4 USARTs, a
byte oriented 2-wire Serial Interface, a 16-channel, 10-bit ADC with optional differential input
stage with programmable gain, programmable Watchdog Timer with Internal Oscillator, an SPI
serial port, IEEE® std. 1149.1 compliant JTAG test interface, also used for accessing the Onchip
Debug system and programming and six software selectable power saving modes. The Idle
mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system
to continue functioning. The Power-down mode saves the register contents but freezes the
Oscillator, disabling all other chip functions until the next interrupt or Hardware Reset. In Powersave
mode, the asynchronous timer continues to run, allowing the user to maintain a timer base
while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all
I/O modules except Asynchronous Timer and ADC, to minimize switching noise during ADC
conversions. In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the
device is sleeping. This allows very fast start-up combined with low power consumption. In
Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run.
Atmel offers the QTouch® library for embedding capacitive touch buttons, sliders and wheelsfunctionality
into AVR microcontrollers. The patented charge-transfer signal acquisition
offersrobust sensing and includes fully debounced reporting of touch keys and includes Adjacent
KeySuppression® (AKS™) technology for unambiguous detection of key events. The easy-to-use
QTouch Suite toolchain allows you to explore, develop and debug your own touch applications.
The device is manufactured using Atmel’s high-density nonvolatile memory technology. The Onchip
ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial
interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program
running on the AVR core. The boot program can use any interface to download the application
program in the application Flash memory. Software in the Boot Flash section will continue to run
while the Application Flash section is updated, providing true Read-While-Write operation. By
combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip,
the Atmel ATmega640/1280/1281/2560/2561 is a powerful microcontroller that provides a highly
flexible and cost effective solution to many embedded control applications.
The ATmega640/1280/1281/2560/2561 AVR is supported with a full suite of program and system
development tools including: C compilers, macro assemblers, program
debugger/simulators, in-circuit emulators, and evaluation kits.7
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
2.2 Comparison Between ATmega1281/2561 and ATmega640/1280/2560
Each device in the ATmega640/1280/1281/2560/2561 family differs only in memory size and
number of pins. Table 2-1 summarizes the different configurations for the six devices.
2.3 Pin Descriptions
2.3.1 VCC
Digital supply voltage.
2.3.2 GND
Ground.
2.3.3 Port A (PA7..PA0)
Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port A output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port A pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port A also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 78.
2.3.4 Port B (PB7..PB0)
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port B has better driving capabilities than the other ports.
Port B also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 79.
2.3.5 Port C (PC7..PC0)
Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port C output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up
Table 2-1. Configuration Summary
Device Flash EEPROM RAM
General
Purpose I/O pins
16 bits resolution
PWM channels
Serial
USARTs
ADC
Channels
ATmega640 64KB 4KB 8KB 86 12 4 16
ATmega1280 128KB 4KB 8KB 86 12 4 16
ATmega1281 128KB 4KB 8KB 54 6 2 8
ATmega2560 256KB 4KB 8KB 86 12 4 16
ATmega2561 256KB 4KB 8KB 54 6 2 88
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
resistors are activated. The Port C pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port C also serves the functions of special features of the ATmega640/1280/1281/2560/2561 as
listed on page 82.
2.3.6 Port D (PD7..PD0)
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port D output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port D also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 83.
2.3.7 Port E (PE7..PE0)
Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port E output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port E pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port E also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 86.
2.3.8 Port F (PF7..PF0)
Port F serves as analog inputs to the A/D Converter.
Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins
can provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical
drive characteristics with both high sink and source capability. As inputs, Port F pins
that are externally pulled low will source current if the pull-up resistors are activated. The Port F
pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the
JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will
be activated even if a reset occurs.
Port F also serves the functions of the JTAG interface.
2.3.9 Port G (PG5..PG0)
Port G is a 6-bit I/O port with internal pull-up resistors (selected for each bit). The Port G output
buffers have symmetrical drive characteristics with both high sink and source capability. As
inputs, Port G pins that are externally pulled low will source current if the pull-up resistors are
activated. The Port G pins are tri-stated when a reset condition becomes active, even if the clock
is not running.
Port G also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 90.
2.3.10 Port H (PH7..PH0)
Port H is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port H output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port H pins that are externally pulled low will source current if the pull-up9
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
resistors are activated. The Port H pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port H also serves the functions of various special features of the ATmega640/1280/2560 as
listed on page 92.
2.3.11 Port J (PJ7..PJ0)
Port J is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port J output buffers have symmetrical drive characteristics with both high sink and source capability.
As inputs, Port J pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port J pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port J also serves the functions of various special features of the ATmega640/1280/2560 as
listed on page 94.
2.3.12 Port K (PK7..PK0)
Port K serves as analog inputs to the A/D Converter.
Port K is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port K output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port K pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port K pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port K also serves the functions of various special features of the ATmega640/1280/2560 as
listed on page 96.
2.3.13 Port L (PL7..PL0)
Port L is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port L output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port L pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port L pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port L also serves the functions of various special features of the ATmega640/1280/2560 as
listed on page 98.
2.3.14 RESET
Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running. The minimum pulse length is given in “System and Reset
Characteristics” on page 372. Shorter pulses are not guaranteed to generate a reset.
2.3.15 XTAL1
Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
2.3.16 XTAL2
Output from the inverting Oscillator amplifier.10
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
2.3.17 AVCC
AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally connected
to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC
through a low-pass filter.
2.3.18 AREF
This is the analog reference pin for the A/D Converter.11
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
3. Resources
A comprehensive set of development tools and application notes, and datasheets are available
for download on http://www.atmel.com/avr.
4. About Code Examples
This documentation contains simple code examples that briefly show how to use various parts of
the device. Be aware that not all C compiler vendors include bit definitions in the header files
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation
for more details.
These code examples assume that the part specific header file is included before compilation.
For I/O registers located in extended I/O map, "IN", "OUT", "SBIS", "SBIC", "CBI", and "SBI"
instructions must be replaced with instructions that allow access to extended I/O. Typically
"LDS" and "STS" combined with "SBRS", "SBRC", "SBR", and "CBR".
5. Data Retention
Reliability Qualification results show that the projected data retention failure rate is much less
than 1 ppm over 20 years at 85°C or 100 years at 25°C.
6. Capacitive touch sensing
The Atmel®QTouch® Library provides a simple to use solution to realize touch sensitive interfaces
on most Atmel AVR® microcontrollers. The QTouch Library includes support for the
QTouch and QMatrix® acquisition methods.
Touch sensing can be added to any application by linking the appropriate Atmel QTouch Library
for the AVR Microcontroller. This is done by using a simple set of APIs to define the touch channels
and sensors, and then calling the touch sensing API’s to retrieve the channel information
and determine the touch sensor states.
The QTouch Library is FREE and downloadable from the Atmel website at the following location:
www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the
Atmel QTouch Library User Guide - also available for download from the Atmel website.12
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
7. AVR CPU Core
7.1 Introduction
This section discusses the AVR core architecture in general. The main function of the CPU core
is to ensure correct program execution. The CPU must therefore be able to access memories,
perform calculations, control peripherals, and handle interrupts.
7.2 Architectural Overview
Figure 7-1. Block Diagram of the AVR Architecture
In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with
separate memories and buses for program and data. Instructions in the program memory are
executed with a single level pipelining. While one instruction is being executed, the next instruction
is pre-fetched from the program memory. This concept enables instructions to be executed
in every clock cycle. The program memory is In-System Reprogrammable Flash memory.
Flash
Program
Memory
Instruction
Register
Instruction
Decoder
Program
Counter
Control Lines
32 x 8
General
Purpose
Registers
ALU
Status
and Control
I/O Lines
EEPROM
Data Bus 8-bit
Data
SRAM
Direct Addressing
Indirect Addressing
Interrupt
Unit
SPI
Unit
Watchdog
Timer
Analog
Comparator
I/O Module 2
I/O Module1
I/O Module n13
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The fast-access Register File contains 32 × 8-bit general purpose working registers with a single
clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical
ALU operation, two operands are output from the Register File, the operation is executed,
and the result is stored back in the Register File – in one clock cycle.
Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data
Space addressing – enabling efficient address calculations. One of the these address pointers
can also be used as an address pointer for look up tables in Flash program memory. These
added function registers are the 16-bit X-, Y-, and Z-register, described later in this section.
The ALU supports arithmetic and logic operations between registers or between a constant and
a register. Single register operations can also be executed in the ALU. After an arithmetic operation,
the Status Register is updated to reflect information about the result of the operation.
Program flow is provided by conditional and unconditional jump and call instructions, able to
directly address the whole address space. Most AVR instructions have a single 16-bit word format.
Every program memory address contains a 16-bit or 32-bit instruction.
Program Flash memory space is divided in two sections, the Boot Program section and the
Application Program section. Both sections have dedicated Lock bits for write and read/write
protection. The SPM instruction that writes into the Application Flash memory section must
reside in the Boot Program section.
During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the
Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack
size is only limited by the total SRAM size and the usage of the SRAM. All user programs must
initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack
Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed
through the five different addressing modes supported in the AVR architecture.
The memory spaces in the AVR architecture are all linear and regular memory maps.
A flexible interrupt module has its control registers in the I/O space with an additional Global
Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the
Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position.
The lower the Interrupt Vector address, the higher the priority.
The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers,
SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data
Space locations following those of the Register File, 0x20 - 0x5F. In addition, the
ATmega640/1280/1281/2560/2561 has Extended I/O space from 0x60 - 0x1FF in SRAM where
only the ST/STS/STD and LD/LDS/LDD instructions can be used.
7.3 ALU – Arithmetic Logic Unit
The high-performance AVR ALU operates in direct connection with all the 32 general purpose
working registers. Within a single clock cycle, arithmetic operations between general purpose
registers or between a register and an immediate are executed. The ALU operations are divided
into three main categories – arithmetic, logical, and bit-functions. Some implementations of the
architecture also provide a powerful multiplier supporting both signed/unsigned multiplication
and fractional format. See the “Instruction Set Summary” on page 416 for a detailed description.14
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7.4 Status Register
The Status Register contains information about the result of the most recently executed arithmetic
instruction. This information can be used for altering program flow in order to perform
conditional operations. Note that the Status Register is updated after all ALU operations, as
specified in the “Instruction Set Summary” on page 416. This will in many cases remove the
need for using the dedicated compare instructions, resulting in faster and more compact code.
The Status Register is not automatically stored when entering an interrupt routine and restored
when returning from an interrupt. This must be handled by software.
7.4.1 SREG – AVR Status Register
The AVR Status Register – SREG – is defined as:
• Bit 7 – I: Global Interrupt Enable
The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt
enable control is then performed in separate control registers. If the Global Interrupt Enable
Register is cleared, none of the interrupts are enabled independent of the individual interrupt
enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by
the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by
the application with the SEI and CLI instructions, as described in the “Instruction Set Summary”
on page 416.
• Bit 6 – T: Bit Copy Storage
The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination
for the operated bit. A bit from a register in the Register File can be copied into T by the
BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the
BLD instruction.
• Bit 5 – H: Half Carry Flag
The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is useful
in BCD arithmetic. See the “Instruction Set Summary” on page 416 for detailed information.
• Bit 4 – S: Sign Bit, S = N ⊕ V
The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement
Overflow Flag V. See the “Instruction Set Summary” on page 416 for detailed information.
• Bit 3 – V: Two’s Complement Overflow Flag
The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the
“Instruction Set Summary” on page 416 for detailed information.
• Bit 2 – N: Negative Flag
The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the
“Instruction Set Summary” on page 416 for detailed information.
Bit 7 6 5 4 3 2 1 0
0x3F (0x5F) I T H S V N Z C SREG
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 015
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• Bit 1 – Z: Zero Flag
The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction
Set Summary” on page 416 for detailed information.
• Bit 0 – C: Carry Flag
The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set
Summary” on page 416 for detailed information.
7.5 General Purpose Register File
The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve
the required performance and flexibility, the following input/output schemes are supported by the
Register File:
• One 8-bit output operand and one 8-bit result input
• Two 8-bit output operands and one 8-bit result input
• Two 8-bit output operands and one 16-bit result input
• One 16-bit output operand and one 16-bit result input
Figure 7-2 shows the structure of the 32 general purpose working registers in the CPU.
Figure 7-2. AVR CPU General Purpose Working Registers
Most of the instructions operating on the Register File have direct access to all registers, and
most of them are single cycle instructions.
As shown in Figure 7-2, each register is also assigned a data memory address, mapping them
directly into the first 32 locations of the user Data Space. Although not being physically implemented
as SRAM locations, this memory organization provides great flexibility in access of the
registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file.
7.5.1 The X-register, Y-register, and Z-register
The registers R26..R31 have some added functions to their general purpose usage. These registers
are 16-bit address pointers for indirect addressing of the data space. The three indirect
address registers X, Y, and Z are defined as described in Figure 7-3 on page 16.
7 0 Addr.
R0 0x00
R1 0x01
R2 0x02
…
R13 0x0D
General R14 0x0E
Purpose R15 0x0F
Working R16 0x10
Registers R17 0x11
…
R26 0x1A X-register Low Byte
R27 0x1B X-register High Byte
R28 0x1C Y-register Low Byte
R29 0x1D Y-register High Byte
R30 0x1E Z-register Low Byte
R31 0x1F Z-register High Byte16
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Figure 7-3. The X-, Y-, and Z-registers
In the different addressing modes these address registers have functions as fixed displacement,
automatic increment, and automatic decrement (see the “Instruction Set Summary” on page 416
for details).
7.6 Stack Pointer
The Stack is mainly used for storing temporary data, for storing local variables and for storing
return addresses after interrupts and subroutine calls. The Stack Pointer Register always points
to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations
to lower memory locations. This implies that a Stack PUSH command decreases the Stack
Pointer.
The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt
Stacks are located. This Stack space in the data SRAM must be defined by the program before
any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to
point above 0x0200. The initial value of the stack pointer is the last address of the internal
SRAM. The Stack Pointer is decremented by one when data is pushed onto the Stack with the
PUSH instruction, and it is decremented by two for ATmega640/1280/1281 and three for
ATmega2560/2561 when the return address is pushed onto the Stack with subroutine call or
interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the
POP instruction, and it is incremented by two for ATmega640/1280/1281 and three for
ATmega2560/2561 when data is popped from the Stack with return from subroutine RET or
return from interrupt RETI.
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of
bits actually used is implementation dependent. Note that the data space in some implementations
of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register
will not be present.
15 XH XL 0
X-register 7 07 0
R27 (0x1B) R26 (0x1A)
15 YH YL 0
Y-register 7 07 0
R29 (0x1D) R28 (0x1C)
15 ZH ZL 0
Z-register 70 7 0
R31 (0x1F) R30 (0x1E)
Bit 15 14 13 12 11 10 9 8
0x3E (0x5E) SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH
0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL
76543210
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 1 0 0 0 0 1
1111111117
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7.6.1 RAMPZ – Extended Z-pointer Register for ELPM/SPM
For ELPM/SPM instructions, the Z-pointer is a concatenation of RAMPZ, ZH, and ZL, as shown
in Figure 7-4. Note that LPM is not affected by the RAMPZ setting.
Figure 7-4. The Z-pointer used by ELPM and SPM
The actual number of bits is implementation dependent. Unused bits in an implementation will
always read as zero. For compatibility with future devices, be sure to write these bits to zero.
7.6.2 EIND – Extended Indirect Register
For EICALL/EIJMP instructions, the Indirect-pointer to the subroutine/routine is a concatenation
of EIND, ZH, and ZL, as shown in Figure 7-5. Note that ICALL and IJMP are not affected by the
EIND setting.
Figure 7-5. The Indirect-pointer used by EICALL and EIJMP
The actual number of bits is implementation dependent. Unused bits in an implementation will
always read as zero. For compatibility with future devices, be sure to write these bits to zero.
7.7 Instruction Execution Timing
This section describes the general access timing concepts for instruction execution. The AVR
CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the
chip. No internal clock division is used.
Figure 7-6 on page 18 shows the parallel instruction fetches and instruction executions enabled
by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining
concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions
per cost, functions per clocks, and functions per power-unit.
Bit 7 6 5 4 3 2 1 0
0x3B (0x5B) RAMPZ7 RAMPZ6 RAMPZ5 RAMPZ4 RAMPZ3 RAMPZ2 RAMPZ1 RAMPZ0 RAMPZ
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit
(Individually)
7 0 7 07 0
RAMPZ ZH ZL
Bit (Z-pointer) 23 16 15 8 7 0
Bit 7 6 5 4 3 2 1 0
0x3C (0x5C) EIND7 EIND6 EIND5 EIND4 EIND3 EIND2 EIND1 EIND0 EIND
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit
(Individually)
7 07 07 0
EIND ZH ZL
Bit (Indirectpointer)
23 16 15 8 7 018
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Figure 7-6. The Parallel Instruction Fetches and Instruction Executions
Figure 7-7 shows the internal timing concept for the Register File. In a single clock cycle an ALU
operation using two register operands is executed, and the result is stored back to the destination
register.
Figure 7-7. Single Cycle ALU Operation
7.8 Reset and Interrupt Handling
The AVR provides several different interrupt sources. These interrupts and the separate Reset
Vector each have a separate program vector in the program memory space. All interrupts are
assigned individual enable bits which must be written logic one together with the Global Interrupt
Enable bit in the Status Register in order to enable the interrupt. Depending on the Program
Counter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12
are programmed. This feature improves software security. See the section “Memory Programming”
on page 335 for details.
The lowest addresses in the program memory space are by default defined as the Reset and
Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 105. The list also
determines the priority levels of the different interrupts. The lower the address the higher is the
priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request
0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSEL
bit in the MCU Control Register (MCUCR). Refer to “Interrupts” on page 105 for more information.
The Reset Vector can also be moved to the start of the Boot Flash section by programming
the BOOTRST Fuse, see “Memory Programming” on page 335.
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled.
The user software can write logic one to the I-bit to enable nested interrupts. All enabled
interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a
Return from Interrupt instruction – RETI – is executed.
clk
1st Instruction Fetch
1st Instruction Execute
2nd Instruction Fetch
2nd Instruction Execute
3rd Instruction Fetch
3rd Instruction Execute
4th Instruction Fetch
T1 T2 T3 T4
CPU
Total Execution Time
Register Operands Fetch
ALU Operation Execute
Result Write Back
T1 T2 T3 T4
clkCPU19
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There are basically two types of interrupts. The first type is triggered by an event that sets the
Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector
in order to execute the interrupt handling routine, and hardware clears the corresponding
Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s)
to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is
cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is
cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt
Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the
Global Interrupt Enable bit is set, and will then be executed by order of priority.
The second type of interrupts will trigger as long as the interrupt condition is present. These
interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the
interrupt is enabled, the interrupt will not be triggered.
When the AVR exits from an interrupt, it will always return to the main program and execute one
more instruction before any pending interrupt is served.
Note that the Status Register is not automatically stored when entering an interrupt routine, nor
restored when returning from an interrupt routine. This must be handled by software.
When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled.
No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the
CLI instruction. The following example shows how this can be used to avoid interrupts during the
timed EEPROM write sequence.
When using the SEI instruction to enable interrupts, the instruction following SEI will be executed
before any pending interrupts, as shown in this example.
Assembly Code Example
in r16, SREG ; store SREG value
cli ; disable interrupts during timed sequence
sbi EECR, EEMPE ; start EEPROM write
sbi EECR, EEPE
out SREG, r16 ; restore SREG value (I-bit)
C Code Example
char cSREG;
cSREG = SREG; /* store SREG value */
/* disable interrupts during timed sequence */
__disable_interrupt();
EECR |= (1< xxx
;
.org 0x1F002
0x1F002 jmp EXT_INT0 ; IRQ0 Handler
0x1F004 jmp EXT_INT1 ; IRQ1 Handler
... ... ... ;
0x1FO70 jmp USART3_TXC ; USART3 TX Complete Handler
0x0040 jmp TIM3_COMPA ; Timer3 CompareA Handler
0x0042 jmp TIM3_COMPB ; Timer3 CompareB Handler
0x0044 jmp TIM3_COMPC ; Timer3 CompareC Handler
0x0046 jmp TIM3_OVF ; Timer3 Overflow Handler
0x0048 jmp USART1_RXC ; USART1 RX Complete Handler
0x004A jmp USART1_UDRE ; USART1,UDR Empty Handler
0x004C jmp USART1_TXC ; USART1 TX Complete Handler
0x004E jmp TWI ; 2-wire Serial Handler
0x0050 jmp SPM_RDY ; SPM Ready Handler
0x0052 jmp TIM4_CAPT ; Timer4 Capture Handler
0x0054 jmp TIM4_COMPA ; Timer4 CompareA Handler
0x0056 jmp TIM4_COMPB ; Timer4 CompareB Handler
0x0058 jmp TIM4_COMPC ; Timer4 CompareC Handler
0x005A jmp TIM4_OVF ; Timer4 Overflow Handler
0x005C jmp TIM5_CAPT ; Timer5 Capture Handler
0x005E jmp TIM5_COMPA ; Timer5 CompareA Handler
0x0060 jmp TIM5_COMPB ; Timer5 CompareB Handler
0x0062 jmp TIM5_COMPC ; Timer5 CompareC Handler
0x0064 jmp TIM5_OVF ; Timer5 Overflow Handler
0x0066 jmp USART2_RXC ; USART2 RX Complete Handler
0x0068 jmp USART2_UDRE ; USART2,UDR Empty Handler
0x006A jmp USART2_TXC ; USART2 TX Complete Handler
0x006C jmp USART3_RXC ; USART3 RX Complete Handler
0x006E jmp USART3_UDRE ; USART3,UDR Empty Handler
0x0070 jmp USART3_TXC ; USART3 TX Complete Handler
;
0x0072 RESET: ldi r16, high(RAMEND) ; Main program start
0x0073 out SPH,r16 ; Set Stack Pointer to top of RAM
0x0074 ldi r16, low(RAMEND)
0x0075 out SPL,r16
0x0076 sei ; Enable interrupts
0x0077 xxx
... ... ... ...109
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When the BOOTRST Fuse is programmed and the Boot section size set to 8Kbytes, the most
typical and general program setup for the Reset and Interrupt Vector Addresses is:
Address Labels Code Comments
.org 0x0002
0x00002 jmp EXT_INT0 ; IRQ0 Handler
0x00004 jmp EXT_INT1 ; IRQ1 Handler
... ... ... ;
0x00070 jmp USART3_TXC ; USART3 TX Complete Handler
;
.org 0x1F000
0x1F000 RESET: ldi r16,high(RAMEND); Main program start
0x1F001 out SPH,r16 ; Set Stack Pointer to top of RAM
0x1F002 ldi r16,low(RAMEND)
0x1F003 out SPL,r16
0x1F004 sei ; Enable interrupts
0x1F005 xxx
When the BOOTRST Fuse is programmed, the Boot section size set to 8Kbytes and the IVSEL
bit in the MCUCR Register is set before any interrupts are enabled, the most typical and general
program setup for the Reset and Interrupt Vector Addresses is:
Address Labels Code Comments
;
.org 0x1F000
0x1F000 jmp RESET ; Reset handler
0x1F002 jmp EXT_INT0 ; IRQ0 Handler
0x1F004 jmp EXT_INT1 ; IRQ1 Handler
... ... ... ;
0x1F070 jmp USART3_TXC ; USART3 TX Complete Handler
;
0x1F072 RESET: ldi r16,high(RAMEND) ; Main program start
0x1F073 out SPH,r16 ; Set Stack Pointer to top of RAM
0x1F074 ldi r16,low(RAMEND)
0x1F075 out SPL,r16
0x1F076 sei ; Enable interrupts
0x1FO77 xxx
14.3 Moving Interrupts Between Application and Boot Section
The MCU Control Register controls the placement of the Interrupt Vector table, see Code Example
below. For more details, see “Reset and Interrupt Handling” on page 18.110
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14.4 Register Description
14.4.1 MCUCR – MCU Control Register
• Bit 1 – IVSEL: Interrupt Vector Select
When the IVSEL bit is cleared (zero), the Interrupt Vectors are placed at the start of the Flash
memory. When this bit is set (one), the Interrupt Vectors are moved to the beginning of the Boot
Loader section of the Flash. The actual address of the start of the Boot Flash Section is determined
by the BOOTSZ Fuses. Refer to the section “Memory Programming” on page 335 for
details. To avoid unintentional changes of Interrupt Vector tables, a special write procedure must
be followed to change the IVSEL bit (see “Moving Interrupts Between Application and Boot Section”
on page 109):
1. Write the Interrupt Vector Change Enable (IVCE) bit to one.
2. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE.
Assembly Code Example
Move_interrupts:
; Get MCUCR
in r16, MCUCR
mov r17, r16
; Enable change of Interrupt Vectors
ori r16, (1< CSn2:0 > 1). The number of system clock cycles from
when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles,
where N equals the prescaler divisor (8, 64, 256, or 1024).
It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution.
However, care must be taken if the other Timer/Counter that shares the same prescaler
also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is
connected to.
18.3 External Clock Source
An external clock source applied to the Tn pin can be used as Timer/Counter clock (clkTn). The
Tn pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized
(sampled) signal is then passed through the edge detector. Figure 18-1 shows a functional
equivalent block diagram of the Tn synchronization and edge detector logic. The registers are
clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the
high period of the internal system clock.
The edge detector generates one clkTn pulse for each positive (CSn2:0 = 7) or negative (CSn2:0
= 6) edge it detects.
Figure 18-1. Tn/T0 Pin Sampling
Tn_sync
(To Clock
Select Logic)
Synchronization Edge Detector
D Q D Q
LE
Tn D Q
clkI/O170
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The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles
from an edge has been applied to the Tn pin to the counter is updated.
Enabling and disabling of the clock input must be done when Tn has been stable for at least one
system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated.
Each half period of the external clock applied must be longer than one system clock cycle to
ensure correct sampling. The external clock must be guaranteed to have less than half the system
clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses
sampling, the maximum frequency of an external clock it can detect is half the sampling frequency
(Nyquist sampling theorem). However, due to variation of the system clock frequency
and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is
recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5.
An external clock source can not be prescaled.
Figure 18-2. Prescaler for synchronous Timer/Counters
18.4 Register Description
18.4.1 GTCCR – General Timer/Counter Control Register
• Bit 7 – TSM: Timer/Counter Synchronization Mode
Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the
value that is written to the PSRASY and PSRSYNC bits is kept, hence keeping the corresponding
prescaler reset signals asserted. This ensures that the corresponding Timer/Counters are
halted and can be configured to the same value without the risk of one of them advancing during
configuration. When the TSM bit is written to zero, the PSRASY and PSRSYNC bits are cleared
by hardware, and the Timer/Counters start counting simultaneously.
PSR10
Clear
Tn
Tn
clkI/O
Synchronization
Synchronization
TIMER/COUNTERn CLOCK SOURCE
clkTn
TIMER/COUNTERn CLOCK SOURCE
clkTn
CSn0
CSn1
CSn2
CSn0
CSn1
CSn2
Bit 7 6 5 4 3 2 1 0
0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR
Read/Write R/W R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0171
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• Bit 0 – PSRSYNC: Prescaler Reset for Synchronous Timer/Counters
When this bit is one, Timer/Counter0, Timer/Counter1, Timer/Counter3, Timer/Counter4 and
Timer/Counter5 prescaler will be Reset. This bit is normally cleared immediately by hardware,
except if the TSM bit is set. Note that Timer/Counter0, Timer/Counter1, Timer/Counter3,
Timer/Counter4 and Timer/Counter5 share the same prescaler and a reset of this prescaler will
affect all timers.172
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19. Output Compare Modulator (OCM1C0A)
19.1 Overview
The Output Compare Modulator (OCM) allows generation of waveforms modulated with a carrier
frequency. The modulator uses the outputs from the Output Compare Unit C of the 16-bit
Timer/Counter1 and the Output Compare Unit of the 8-bit Timer/Counter0. For more details
about these Timer/Counters see “Timer/Counter 0, 1, 3, 4, and 5 Prescaler” on page 169 and “8-
bit Timer/Counter2 with PWM and Asynchronous Operation” on page 174.
Figure 19-1. Output Compare Modulator, Block Diagram
When the modulator is enabled, the two output compare channels are modulated together as
shown in the block diagram (see Figure 19-1).
19.2 Description
The Output Compare unit 1C and Output Compare unit 2 shares the PB7 port pin for output. The
outputs of the Output Compare units (OC1C and OC0A) overrides the normal PORTB7 Register
when one of them is enabled (that is, when COMnx1:0 is not equal to zero). When both OC1C
and OC0A are enabled at the same time, the modulator is automatically enabled.
The functional equivalent schematic of the modulator is shown on Figure 19-2. The schematic
includes part of the Timer/Counter units and the port B pin 7 output driver circuit.
Figure 19-2. Output Compare Modulator, Schematic
OC1C
Pin
OC1C /
OC0A / PB7
Timer/Counter 1
Timer/Counter 0 OC0A
PORTB7 DDRB7
D Q D Q
Pin
COMA01
COMA00
DATABUS
OC1C /
OC0A/ PB7
COM1C1
COM1C0
Modulator
1
0
OC1C
D Q
OC0A
D Q
( From Waveform Generator )
( From Waveform Generator )
0
1
Vcc173
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When the modulator is enabled the type of modulation (logical AND or OR) can be selected by
the PORTB7 Register. Note that the DDRB7 controls the direction of the port independent of the
COMnx1:0 bit setting.
19.2.1 Timing example
Figure 19-3 illustrates the modulator in action. In this example the Timer/Counter1 is set to operate
in fast PWM mode (non-inverted) and Timer/Counter0 uses CTC waveform mode with toggle
Compare Output mode (COMnx1:0 = 1).
Figure 19-3. Output Compare Modulator, Timing Diagram
In this example, Timer/Counter2 provides the carrier, while the modulating signal is generated
by the Output Compare unit C of the Timer/Counter1.
The resolution of the PWM signal (OC1C) is reduced by the modulation. The reduction factor is
equal to the number of system clock cycles of one period of the carrier (OC0A). In this example
the resolution is reduced by a factor of two. The reason for the reduction is illustrated in Figure
19-3 at the second and third period of the PB7 output when PORTB7 equals zero. The period 2
high time is one cycle longer than the period 3 high time, but the result on the PB7 output is
equal in both periods.
1 2
OC0A
(CTC Mode)
OC1C
(FPWM Mode)
PB7
(PORTB7 = 0)
PB7
(PORTB7 = 1)
(Period) 3
clk I/O174
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20. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. The main
features are:
• Single Channel Counter
• Clear Timer on Compare Match (Auto Reload)
• Glitch-free, Phase Correct Pulse Width Modulator (PWM)
• Frequency Generator
• 10-bit Clock Prescaler
• Overflow and Compare Match Interrupt Sources (TOV2, OCF2A and OCF2B)
• Allows Clocking from External 32kHz Watch Crystal Independent of the I/O Clock
20.1 Overview
A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 17-12. For the actual
placement of I/O pins, see “Pin Configurations” on page 2. CPU accessible I/O Registers, including
I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations
are listed in the “Register Description” on page 187.
The Power Reduction Timer/Counter2 bit, PRTIM2, in “PRR0 – Power Reduction Register 0” on
page 56 must be written to zero to enable Timer/Counter2 module.
Figure 20-1. 8-bit Timer/Counter Block Diagram
Timer/Counter
DATA BUS
OCRnA
OCRnB
=
=
TCNTn
Waveform
Generation
Waveform
Generation
OCnA
OCnB
=
Fixed
TOP
Value
Control Logic
= 0
TOP BOTTOM
Count
Clear
Direction
TOVn
(Int.Req.)
OCnA
(Int.Req.)
OCnB
(Int.Req.)
TCCRnA TCCRnB
clkTn
ASSRn
Synchronization Unit
Prescaler
T/C Oscillator
clkI/O
clkASY
asynchronous mode
select (ASn)
Synchronized Status flags
TOSC1
TOSC2
Status flags
clkI/O175
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20.1.1 Registers
The Timer/Counter (TCNT2) and Output Compare Register (OCR2A and OCR2B) are 8-bit registers.
Interrupt request (abbreviated to Int.Req.) signals are all visible in the Timer Interrupt Flag
Register (TIFR2). All interrupts are individually masked with the Timer Interrupt Mask Register
(TIMSK2). TIFR2 and TIMSK2 are not shown in the figure.
The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from
the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by
the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock
source the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive
when no clock source is selected. The output from the Clock Select logic is referred to as the
timer clock (clkT2).
The double buffered Output Compare Register (OCR2A and OCR2B) are compared with the
Timer/Counter value at all times. The result of the compare can be used by the Waveform Generator
to generate a PWM or variable frequency output on the Output Compare pins (OC2A and
OC2B). See “Output Compare Unit” on page 180 for details. The compare match event will also
set the Compare Flag (OCF2A or OCF2B) which can be used to generate an Output Compare
interrupt request.
20.1.2 Definitions
Many register and bit references in this document are written in general form. A lower case “n”
replaces the Timer/Counter number, in this case 2. However, when using the register or bit
defines in a program, the precise form must be used, that is, TCNT2 for accessing
Timer/Counter2 counter value and so on.
The definitions in Table 20-1 are also used extensively throughout the section.
20.2 Timer/Counter Clock Sources
The Timer/Counter can be clocked by an internal synchronous or an external asynchronous
clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2
bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter
Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “Asynchronous
Operation of Timer/Counter2” on page 184. For details on clock sources and
prescaler, see “Timer/Counter Prescaler” on page 186.
20.3 Counter Unit
The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure
20-2 on page 176 shows a block diagram of the counter and its surrounding environment.
Table 20-1. Definitions
BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00)
MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255)
TOP The counter reaches the TOP when it becomes equal to the highest value in the count
sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the
value stored in the OCR2A Register. The assignment is dependent on the mode of
operation176
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Figure 20-2. Counter Unit Block Diagram
Signal description (internal signals):
count Increment or decrement TCNT2 by 1.
direction Selects between increment and decrement.
clear Clear TCNT2 (set all bits to zero).
clkTn Timer/Counter clock, referred to as clkT2 in the following.
top Signalizes that TCNT2 has reached maximum value.
bottom Signalizes that TCNT2 has reached minimum value (zero).
Depending on the mode of operation used, the counter is cleared, incremented, or decremented
at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source,
selected by the Clock Select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the
timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of
whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or
count operations.
The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in
the Timer/Counter Control Register (TCCR2A) and the WGM22 located in the Timer/Counter
Control Register B (TCCR2B). There are close connections between how the counter behaves
(counts) and how waveforms are generated on the Output Compare outputs OC2A and OC2B.
For more details about advanced counting sequences and waveform generation, see “Modes of
Operation” on page 176.
The Timer/Counter Overflow Flag (TOV2) is set according to the mode of operation selected by
the WGM22:0 bits. TOV2 can be used for generating a CPU interrupt.
20.4 Modes of Operation
The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins,
is defined by the combination of the Waveform Generation mode (WGM22:0) and Compare Output
mode (COM2x1:0) bits. The Compare Output mode bits do not affect the counting sequence,
while the Waveform Generation mode bits do. The COM2x1:0 bits control whether the PWM output
generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes
the COM2x1:0 bits control whether the output should be set, cleared, or toggled at a compare
match. See “Compare Match Output Unit” on page 182.
For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 183.
DATA BUS
TCNTn Control Logic
count
TOVn
(Int.Req.)
bottom top
direction
clear
TOSC1
T/C
Oscillator
TOSC2
Prescaler
clkI/O
clk Tn177
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20.4.1 Normal Mode
The simplest mode of operation is the Normal mode (WGM22:0 = 0). In this mode the counting
direction is always up (incrementing), and no counter clear is performed. The counter simply
overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom
(0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same
timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth
bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt
that automatically clears the TOV2 Flag, the timer resolution can be increased by software.
There are no special cases to consider in the Normal mode, a new counter value can be written
anytime.
The Output Compare unit can be used to generate interrupts at some given time. Using the Output
Compare to generate waveforms in Normal mode is not recommended, since this will
occupy too much of the CPU time.
20.4.2 Clear Timer on Compare Match (CTC) Mode
In Clear Timer on Compare or CTC mode (WGM22:0 = 2), the OCR2A Register is used to
manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter
value (TCNT2) matches the OCR2A. The OCR2A defines the top value for the counter, hence
also its resolution. This mode allows greater control of the compare match output frequency. It
also simplifies the operation of counting external events.
The timing diagram for the CTC mode is shown in Figure 20-3. The counter value (TCNT2)
increases until a compare match occurs between TCNT2 and OCR2A, and then counter
(TCNT2) is cleared.
Figure 20-3. CTC Mode, Timing Diagram
An interrupt can be generated each time the counter value reaches the TOP value by using the
OCF2A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating
the TOP value. However, changing TOP to a value close to BOTTOM when the counter is running
with none or a low prescaler value must be done with care since the CTC mode does not
have the double buffering feature. If the new value written to OCR2A is lower than the current
value of TCNT2, the counter will miss the compare match. The counter will then have to count to
its maximum value (0xFF) and wrap around starting at 0x00 before the compare match can
occur.
For generating a waveform output in CTC mode, the OC2A output can be set to toggle its logical
level on each compare match by setting the Compare Output mode bits to toggle mode
(COM2A1:0 = 1). The OC2A value will not be visible on the port pin unless the data direction for
TCNTn
OCnx
(Toggle)
OCnx Interrupt Flag Set
Period 1 2 3 4
(COMnx1:0 = 1)178
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the pin is set to output. The waveform generated will have a maximum frequency of fOC2A =
fclk_I/O/2 when OCR2A is set to zero (0x00). The waveform frequency is defined by the following
equation:
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the
counter counts from MAX to 0x00.
20.4.3 Fast PWM Mode
Figure 20-4. Fast PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches TOP. If the interrupt
is enabled, the interrupt handler routine can be used for updating the compare value.
In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin.
Setting the COM2x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output
can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3,
and OCR2A when WGM2:0 = 7 (see Table 20-3 on page 187). The actual OC2x value will only
be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform
is generated by setting (or clearing) the OC2x Register at the compare match between
OCR2x and TCNT2, and clearing (or setting) the OC2x Register at the timer clock cycle the
counter is cleared (changes from TOP to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
The extreme values for the OCR2A Register represent special cases when generating a PWM
waveform output in the fast PWM mode. If the OCR2A is set equal to BOTTOM, the output will
be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2A equal to MAX will result
f
OCnx
f
clk_I/O
2 ⋅ ⋅ N ( ) 1 + OCRnx = -------------------------------------------------
TCNTn
OCRnx Update and
TOVn Interrupt Flag Set
Period 1 2 3
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
OCRnx Interrupt Flag Set
4 5 6 7
f
OCnxPWM
f
clk_I/O
N ⋅ 256 = ------------------179
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in a constantly high or low output (depending on the polarity of the output set by the COM2A1:0
bits).
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting
OC2x to toggle its logical level on each compare match (COM2x1:0 = 1). The waveform
generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2A is set to zero. This feature
is similar to the OC2A toggle in CTC mode, except the double buffer feature of the Output
Compare unit is enabled in the fast PWM mode.
20.4.4 Phase Correct PWM Mode
The phase correct PWM mode (WGM22:0 = 1 or 5) provides a high resolution phase correct
PWM waveform generation option. The phase correct PWM mode is based on a dual-slope
operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOTTOM.
TOP is defined as 0xFF when WGM22:0 = 1, and OCR2A when MGM22:0 = 5. In noninverting
Compare Output mode, the Output Compare (OC2x) is cleared on the compare match
between TCNT2 and OCR2x while upcounting, and set on the compare match while downcounting.
In inverting Output Compare mode, the operation is inverted. The dual-slope operation has
lower maximum operation frequency than single slope operation. However, due to the symmetric
feature of the dual-slope PWM modes, these modes are preferred for motor control
applications.
In phase correct PWM mode the counter is incremented until the counter value matches TOP.
When the counter reaches TOP, it changes the count direction. The TCNT2 value will be equal
to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown
on Figure 20-5. The TCNT2 value is in the timing diagram shown as a histogram for illustrating
the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The
small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2x
and TCNT2.
Figure 20-5. Phase Correct PWM Mode, Timing Diagram
TOVn Interrupt Flag Set
OCnx Interrupt Flag Set
1 2 3
TCNTn
Period
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
OCRnx Update180
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The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The
Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM
value.
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the
OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM. An inverted PWM
output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when
WGM2:0 = 3, and OCR2A when MGM2:0 = 7 (see Table 20-4 on page 188). The actual OC2x
value will only be visible on the port pin if the data direction for the port pin is set as output. The
PWM waveform is generated by clearing (or setting) the OC2x Register at the compare match
between OCR2x and TCNT2 when the counter increments, and setting (or clearing) the OC2x
Register at compare match between OCR2x and TCNT2 when the counter decrements. The
PWM frequency for the output when using phase correct PWM can be calculated by the following
equation:
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
The extreme values for the OCR2A Register represent special cases when generating a PWM
waveform output in the phase correct PWM mode. If the OCR2A is set equal to BOTTOM, the
output will be continuously low and if set equal to MAX the output will be continuously high for
non-inverted PWM mode. For inverted PWM the output will have the opposite logic values.
At the very start of period 2 in Figure 20-5 on page 179 OCnx has a transition from high to low
even though there is no Compare Match. The point of this transition is to guarantee symmetry
around BOTTOM. There are two cases that give a transition without Compare Match.
• OCR2A changes its value from MAX, like in Figure 20-5 on page 179. When the OCR2A
value is MAX the OCn pin value is the same as the result of a down-counting compare
match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the
result of an up-counting Compare Match.
• The timer starts counting from a value higher than the one in OCR2A, and for that reason
misses the Compare Match and hence the OCn change that would have happened on the
way up.
20.5 Output Compare Unit
The 8-bit comparator continuously compares TCNT2 with the Output Compare Register
(OCR2A and OCR2B). Whenever TCNT2 equals OCR2A or OCR2B, the comparator signals a
match. A match will set the Output Compare Flag (OCF2A or OCF2B) at the next timer clock
cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output
Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is executed.
Alternatively, the Output Compare Flag can be cleared by software by writing a logical
one to its I/O bit location. The Waveform Generator uses the match signal to generate an output
according to operating mode set by the WGM22:0 bits and Compare Output mode (COM2x1:0)
bits. The max and bottom signals are used by the Waveform Generator for handling the special
cases of the extreme values in some modes of operation (see “Modes of Operation” on page
176).
Figure 20-6 on page 181 shows a block diagram of the Output Compare unit.
f
OCnxPCPWM
f
clk_I/O
N ⋅ 510 = ------------------181
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Figure 20-6. Output Compare Unit, Block Diagram
The OCR2x Register is double buffered when using any of the Pulse Width Modulation (PWM)
modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the double
buffering is disabled. The double buffering synchronizes the update of the OCR2x Compare
Register to either top or bottom of the counting sequence. The synchronization prevents the
occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.
The OCR2x Register access may seem complex, but this is not case. When the double buffering
is enabled, the CPU has access to the OCR2x Buffer Register, and if double buffering is disabled
the CPU will access the OCR2x directly.
20.5.1 Force Output Compare
In non-PWM waveform generation modes, the match output of the comparator can be forced by
writing a one to the Force Output Compare (FOC2x) bit. Forcing compare match will not set the
OCF2x Flag or reload/clear the timer, but the OC2x pin will be updated as if a real compare
match had occurred (the COM2x1:0 bits settings define whether the OC2x pin is set, cleared or
toggled).
20.5.2 Compare Match Blocking by TCNT2 Write
All CPU write operations to the TCNT2 Register will block any compare match that occurs in the
next timer clock cycle, even when the timer is stopped. This feature allows OCR2x to be initialized
to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is
enabled.
20.5.3 Using the Output Compare Unit
Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock
cycle, there are risks involved when changing TCNT2 when using the Output Compare channel,
independently of whether the Timer/Counter is running or not. If the value written to TCNT2
equals the OCR2x value, the compare match will be missed, resulting in incorrect waveform
generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is
downcounting.
OCFnx (Int.Req.)
= (8-bit Comparator )
OCRnx
OCnx
DATA BUS
TCNTn
WGMn1:0
Waveform Generator
top
FOCn
COMnX1:0
bottom182
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The setup of the OC2x should be performed before setting the Data Direction Register for the
port pin to output. The easiest way of setting the OC2x value is to use the Force Output Compare
(FOC2x) strobe bit in Normal mode. The OC2x Register keeps its value even when
changing between Waveform Generation modes.
Be aware that the COM2x1:0 bits are not double buffered together with the compare value.
Changing the COM2x1:0 bits will take effect immediately.
20.6 Compare Match Output Unit
The Compare Output mode (COM2x1:0) bits have two functions. The Waveform Generator uses
the COM2x1:0 bits for defining the Output Compare (OC2x) state at the next compare match.
Also, the COM2x1:0 bits control the OC2x pin output source. Figure 20-7 shows a simplified
schematic of the logic affected by the COM2x1:0 bit setting. The I/O Registers, I/O bits, and I/O
pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers
(DDR and PORT) that are affected by the COM2x1:0 bits are shown. When referring to the
OC2x state, the reference is for the internal OC2x Register, not the OC2x pin.
Figure 20-7. Compare Match Output Unit, Schematic
The general I/O port function is overridden by the Output Compare (OC2x) from the Waveform
Generator if either of the COM2x1:0 bits are set. However, the OC2x pin direction (input or output)
is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction
Register bit for the OC2x pin (DDR_OC2x) must be set as output before the OC2x value is visible
on the pin. The port override function is independent of the Waveform Generation mode.
The design of the Output Compare pin logic allows initialization of the OC2x state before the output
is enabled. Note that some COM2x1:0 bit settings are reserved for certain modes of
operation. See “Register Description” on page 187.
PORT
DDR
D Q
D Q
OCnx
OCnx Pin
D Q Waveform
Generator
COMnx1
COMnx0
0
1
DATA BU
S
FOCnx
clkI/O183
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20.6.1 Compare Output Mode and Waveform Generation
The Waveform Generator uses the COM2x1:0 bits differently in normal, CTC, and PWM modes.
For all modes, setting the COM2x1:0 = 0 tells the Waveform Generator that no action on the
OC2x Register is to be performed on the next compare match. For compare output actions in the
non-PWM modes refer to Table 20-5 on page 188. For fast PWM mode, refer to Table 20-6 on
page 188, and for phase correct PWM refer to Table 20-7 on page 189.
A change of the COM2x1:0 bits state will have effect at the first compare match after the bits are
written. For non-PWM modes, the action can be forced to have immediate effect by using the
FOC2x strobe bits.
20.7 Timer/Counter Timing Diagrams
The following figures show the Timer/Counter in synchronous mode, and the timer clock (clkT2)
is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should be replaced by
the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are
set. Figure 20-8 contains timing data for basic Timer/Counter operation. The figure shows the
count sequence close to the MAX value in all modes other than phase correct PWM mode.
Figure 20-8. Timer/Counter Timing Diagram, no Prescaling
Figure 20-9 shows the same timing data, but with the prescaler enabled.
Figure 20-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)
clkTn
(clkI/O/1)
TOVn
clkI/O
TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1
TOVn
TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1
clkI/O
clkTn
(clkI/O/8)184
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Figure 20-10 shows the setting of OCF2A in all modes except CTC mode.
Figure 20-10. Timer/Counter Timing Diagram, Setting of OCF2A, with Prescaler (fclk_I/O/8)
Figure 20-11 shows the setting of OCF2A and the clearing of TCNT2 in CTC mode.
Figure 20-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Prescaler
(fclk_I/O/8)
20.8 Asynchronous Operation of Timer/Counter2
When Timer/Counter2 operates asynchronously, some considerations must be taken.
• Warning: When switching between asynchronous and synchronous clocking of
Timer/Counter2, the Timer Registers TCNT2, OCR2x, and TCCR2x might be corrupted. A
safe procedure for switching clock source is:
1. Disable the Timer/Counter2 interrupts by clearing OCIE2x and TOIE2.
2. Select clock source by setting AS2 as appropriate.
3. Write new values to TCNT2, OCR2x, and TCCR2x.
4. To switch to asynchronous operation: Wait for TCN2UB, OCR2xUB, and TCR2xUB.
5. Clear the Timer/Counter2 Interrupt Flags.
6. Enable interrupts, if needed.
OCFnx
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
clkI/O
clkTn
(clkI/O/8)
OCFnx
OCRnx
TCNTn
(CTC)
TOP
TOP - 1 TOP BOTTOM BOTTOM + 1
clkI/O
clkTn
(clkI/O/8)185
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• The CPU main clock frequency must be more than four times the Oscillator frequency.
• When writing to one of the registers TCNT2, OCR2x, or TCCR2x, the value is transferred to
a temporary register, and latched after two positive edges on TOSC1. The user should not
write a new value before the contents of the temporary register have been transferred to its
destination. Each of the five mentioned registers have their individual temporary register,
which means that, for example, writing to TCNT2 does not disturb an OCR2x write in
progress. To detect that a transfer to the destination register has taken place, the
Asynchronous Status Register – ASSR has been implemented.
• When entering Power-save or ADC Noise Reduction mode after having written to TCNT2,
OCR2x, or TCCR2x, the user must wait until the written register has been updated if
Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode
before the changes are effective. This is particularly important if any of the Output
Compare2 interrupt is used to wake up the device, since the Output Compare function is
disabled during writing to OCR2x or TCNT2. If the write cycle is not finished, and the MCU
enters sleep mode before the corresponding OCR2xUB bit returns to zero, the device will
never receive a compare match interrupt, and the MCU will not wake up.
• If Timer/Counter2 is used to wake the device up from Power-save or ADC Noise Reduction
mode, precautions must be taken if the user wants to re-enter one of these modes: The
interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and reentering
sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the
device will fail to wake up. If the user is in doubt whether the time before re-entering Powersave
or ADC Noise Reduction mode is sufficient, the following algorithm can be used to
ensure that one TOSC1 cycle has elapsed:
1. Write a value to TCCR2x, TCNT2, or OCR2x.
2. Wait until the corresponding Update Busy Flag in ASSR returns to zero.
3. Enter Power-save or ADC Noise Reduction mode.
• When the asynchronous operation is selected, the 32.768kHz Oscillator for Timer/Counter2
is always running, except in Power-down and Standby modes. After a Power-up Reset or
wake-up from Power-down or Standby mode, the user should be aware of the fact that this
Oscillator might take as long as one second to stabilize. The user is advised to wait for at
least one second before using Timer/Counter2 after power-up or wake-up from Power-down
or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost
after a wake-up from Power-down or Standby mode due to unstable clock signal upon startup,
no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin.
• Description of wake up from Power-save or ADC Noise Reduction mode when the timer is
clocked asynchronously: When the interrupt condition is met, the wake up process is started
on the following cycle of the timer clock, that is, the timer is always advanced by at least one
before the processor can read the counter value. After wake-up, the MCU is halted for four
cycles, it executes the interrupt routine, and resumes execution from the instruction
following SLEEP.
• Reading of the TCNT2 Register shortly after wake-up from Power-save may give an
incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2
must be done through a register synchronized to the internal I/O clock domain.
Synchronization takes place for every rising TOSC1 edge. When waking up from Powersave
mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous
value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC
clock after waking up from Power-save mode is essentially unpredictable, as it depends on
the wake-up time. The recommended procedure for reading TCNT2 is thus as follows:
1. Write any value to either of the registers OCR2x or TCCR2x.
2. Wait for the corresponding Update Busy Flag to be cleared.
3. Read TCNT2.186
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• During asynchronous operation, the synchronization of the Interrupt Flags for the
asynchronous timer takes three processor cycles plus one timer cycle. The timer is therefore
advanced by at least one before the processor can read the timer value causing the setting
of the Interrupt Flag. The Output Compare pin is changed on the timer clock and is not
synchronized to the processor clock.
20.9 Timer/Counter Prescaler
Figure 20-12. Prescaler for Timer/Counter2
The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main
system I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously
clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter
(RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port C. A crystal can
then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock
source for Timer/Counter2. The Oscillator is optimized for use with a 32.768kHz crystal. By setting
the EXCLK bit in the ASSR, a 32kHz external clock can be applied. See “ASSR –
Asynchronous Status Register” on page 192 for details.
For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64,
clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected.
Setting the PSRASY bit in GTCCR resets the prescaler. This allows the user to operate with a
predictable prescaler.
10-BIT T/C PRESCALER
TIMER/COUNTER2 CLOCK SOURCE
clkI/O clkT2S
TOSC1
AS2
CS20
CS21
CS22
clkT2S/8
clkT2S/64
clkT2S/128
clkT2S/1024
clkT2S/256
clkT2S/32
0 PSRASY
Clear
clkT2187
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20.10 Register Description
20.10.1 TCCR2A –Timer/Counter Control Register A
• Bits 7:6 – COM2A1:0: Compare Match Output A Mode
These bits control the Output Compare pin (OC2A) behavior. If one or both of the COM2A1:0
bits are set, the OC2A output overrides the normal port functionality of the I/O pin it is connected
to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2A pin
must be set in order to enable the output driver.
When OC2A is connected to the pin, the function of the COM2A1:0 bits depends on the
WGM22:0 bit setting. Table 20-2 shows the COM2A1:0 bit functionality when the WGM22:0 bits
are set to a normal or CTC mode (non-PWM).
Table 20-3 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to fast PWM
mode.
Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare
Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on
page 178 for more details.
Table 20-4 on page 188 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set
to phase correct PWM mode.
Bit 7 6 5 4 3 2 1 0
(0xB0) COM2A1 COM2A0 COM2B1 COM2B0 – – WGM21 WGM20 TCCR2A
Read/Write R/W R/W R/W R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 20-2. Compare Output Mode, non-PWM Mode
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected
0 1 Toggle OC2A on Compare Match
1 0 Clear OC2A on Compare Match
1 1 Set OC2A on Compare Match
Table 20-3. Compare Output Mode, Fast PWM Mode(1)
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected
0 1 WGM22 = 0: Normal Port Operation, OC2A Disconnected
WGM22 = 1: Toggle OC2A on Compare Match
1 0 Clear OC2A on Compare Match, set OC2A at BOTTOM
(non-inverting mode)
1 1 Set OC2A on Compare Match, clear OC2A at BOTTOM
(inverting mode)188
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Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare
Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on
page 179 for more details.
• Bits 5:4 – COM2B1:0: Compare Match Output B Mode
These bits control the Output Compare pin (OC2B) behavior. If one or both of the COM2B1:0
bits are set, the OC2B output overrides the normal port functionality of the I/O pin it is connected
to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2B pin
must be set in order to enable the output driver.
When OC2B is connected to the pin, the function of the COM2B1:0 bits depends on the
WGM22:0 bit setting. Table 20-5 shows the COM2B1:0 bit functionality when the WGM22:0 bits
are set to a normal or CTC mode (non-PWM).
Table 20-6 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to fast PWM
mode.
Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare
Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on
page 178 for more details.
Table 20-4. Compare Output Mode, Phase Correct PWM Mode(1)
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected
0 1 WGM22 = 0: Normal Port Operation, OC2A Disconnected
WGM22 = 1: Toggle OC2A on Compare Match
1 0 Clear OC2A on Compare Match when up-counting
Set OC2A on Compare Match when down-counting
1 1 Set OC2A on Compare Match when up-counting
Clear OC2A on Compare Match when down-counting
Table 20-5. Compare Output Mode, non-PWM Mode
COM2B1 COM2B0 Description
0 0 Normal port operation, OC2B disconnected
0 1 Toggle OC2B on Compare Match
1 0 Clear OC2B on Compare Match
1 1 Set OC2B on Compare Match
Table 20-6. Compare Output Mode, Fast PWM Mode(1)
COM2B1 COM2B0 Description
0 0 Normal port operation, OC2B disconnected
0 1 Reserved
1 0 Clear OC2B on Compare Match, set OC2B at BOTTOM
(non-inverting mode)
1 1 Set OC2B on Compare Match, clear OC2B at BOTTOM
(inverting mode)189
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Table 20-7 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to phase correct
PWM mode.
Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare
Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on
page 179 for more details.
• Bits 3, 2 – Res: Reserved Bits
These bits are reserved bits and will always read as zero.
• Bits 1:0 – WGM21:0: Waveform Generation Mode
Combined with the WGM22 bit found in the TCCR2B Register, these bits control the counting
sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform
generation to be used, see Table 20-8. Modes of operation supported by the Timer/Counter
unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and two types of
Pulse Width Modulation (PWM) modes (see “Modes of Operation” on page 176).
Notes: 1. MAX = 0xFF.
2. BOTTOM = 0x00.
Table 20-7. Compare Output Mode, Phase Correct PWM Mode(1)
COM2B1 COM2B0 Description
0 0 Normal port operation, OC2B disconnected
0 1 Reserved
1 0 Clear OC2B on Compare Match when up-counting
Set OC2B on Compare Match when down-counting
1 1 Set OC2B on Compare Match when up-counting
Clear OC2B on Compare Match when down-counting
Table 20-8. Waveform Generation Mode Bit Description
Mode WGM2 WGM1 WGM0
Timer/Counter
Mode of
Operation TOP
Update of
OCRx at
TOV Flag
Set on(1)(2)
00 0 0 Normal 0xFF Immediate MAX
10 0 1 PWM, Phase
Correct 0xFF TOP BOTTOM
2 0 1 0 CTC OCRA Immediate MAX
3 0 1 1 Fast PWM 0xFF BOTTOM MAX
4 1 0 0 Reserved – – –
51 0 1 PWM, Phase
Correct OCRA TOP BOTTOM
6 1 1 0 Reserved – – –
7 1 1 1 Fast PWM OCRA BOTTOM TOP190
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20.10.2 TCCR2B – Timer/Counter Control Register B
• Bit 7 – FOC2A: Force Output Compare A
The FOC2A bit is only active when the WGM bits specify a non-PWM mode.
However, for ensuring compatibility with future devices, this bit must be set to zero when
TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2A bit,
an immediate Compare Match is forced on the Waveform Generation unit. The OC2A output is
changed according to its COM2A1:0 bits setting. Note that the FOC2A bit is implemented as a
strobe. Therefore it is the value present in the COM2A1:0 bits that determines the effect of the
forced compare.
A FOC2A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using
OCR2A as TOP.
The FOC2A bit is always read as zero.
• Bit 6 – FOC2B: Force Output Compare B
The FOC2B bit is only active when the WGM bits specify a non-PWM mode.
However, for ensuring compatibility with future devices, this bit must be set to zero when
TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2B bit,
an immediate Compare Match is forced on the Waveform Generation unit. The OC2B output is
changed according to its COM2B1:0 bits setting. Note that the FOC2B bit is implemented as a
strobe. Therefore it is the value present in the COM2B1:0 bits that determines the effect of the
forced compare.
A FOC2B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using
OCR2B as TOP.
The FOC2B bit is always read as zero.
• Bits 5:4 – Res: Reserved Bits
These bits are reserved bits and will always read as zero.
• Bit 3 – WGM22: Waveform Generation Mode
See the description in the “TCCR2A –Timer/Counter Control Register A” on page 187.
• Bit 2:0 – CS22:0: Clock Select
The three Clock Select bits select the clock source to be used by the Timer/Counter, see Table
20-9 on page 191.
Bit 7 6 5 4 3 2 1 0
(0xB1) FOC2A FOC2B – – WGM22 CS22 CS21 CS20 TCCR2B
Read/Write W W R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0191
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If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the
counter even if the pin is configured as an output. This feature allows software control of the
counting.
20.10.3 TCNT2 – Timer/Counter Register
The Timer/Counter Register gives direct access, both for read and write operations, to the
Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare
Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running,
introduces a risk of missing a Compare Match between TCNT2 and the OCR2x Registers.
20.10.4 OCR2A – Output Compare Register A
The Output Compare Register A contains an 8-bit value that is continuously compared with the
counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to
generate a waveform output on the OC2A pin.
20.10.5 OCR2B – Output Compare Register B
The Output Compare Register B contains an 8-bit value that is continuously compared with the
counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to
generate a waveform output on the OC2B pin.
Table 20-9. Clock Select Bit Description
CS22 CS21 CS20 Description
000 No clock source (Timer/Counter stopped)
0 0 1 clkT2S/(No prescaling)
0 1 0 clkT2S/8 (From prescaler)
0 1 1 clkT2S/32 (From prescaler)
1 0 0 clkT2S/64 (From prescaler)
1 0 1 clkT2S/128 (From prescaler)
1 1 0 clkT2S/256 (From prescaler)
1 1 1 clkT2S/1024 (From prescaler)
Bit 7 6 5 4 3 2 1 0
(0xB2) TCNT2[7:0] TCNT2
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0xB3) OCR2A[7:0] OCR2A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0xB4) OCR2B[7:0] OCR2B
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0192
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20.10.6 ASSR – Asynchronous Status Register
• Bit 6 – EXCLK: Enable External Clock Input
When EXCLK is written to one, and asynchronous clock is selected, the external clock input buffer
is enabled and an external clock can be input on Timer Oscillator 1 (TOSC1) pin instead of a
32kHz crystal. Writing to EXCLK should be done before asynchronous operation is selected.
Note that the crystal Oscillator will only run when this bit is zero.
• Bit 5 – AS2: Asynchronous Timer/Counter2
When AS2 is written to zero, Timer/Counter2 is clocked from the I/O clock, clkI/O. When AS2 is
written to one, Timer/Counter2 is clocked from a crystal Oscillator connected to the Timer Oscillator
1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2A,
OCR2B, TCCR2A and TCCR2B might be corrupted.
• Bit 4 – TCN2UB: Timer/Counter2 Update Busy
When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set.
When TCNT2 has been updated from the temporary storage register, this bit is cleared by hardware.
A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value.
• Bit 3 – OCR2AUB: Output Compare Register2 Update Busy
When Timer/Counter2 operates asynchronously and OCR2A is written, this bit becomes set.
When OCR2A has been updated from the temporary storage register, this bit is cleared by hardware.
A logical zero in this bit indicates that OCR2A is ready to be updated with a new value.
• Bit 2 – OCR2BUB: Output Compare Register2 Update Busy
When Timer/Counter2 operates asynchronously and OCR2B is written, this bit becomes set.
When OCR2B has been updated from the temporary storage register, this bit is cleared by hardware.
A logical zero in this bit indicates that OCR2B is ready to be updated with a new value.
• Bit 1 – TCR2AUB: Timer/Counter Control Register2 Update Busy
When Timer/Counter2 operates asynchronously and TCCR2A is written, this bit becomes set.
When TCCR2A has been updated from the temporary storage register, this bit is cleared by
hardware. A logical zero in this bit indicates that TCCR2A is ready to be updated with a new
value.
• Bit 0 – TCR2BUB: Timer/Counter Control Register2 Update Busy
When Timer/Counter2 operates asynchronously and TCCR2B is written, this bit becomes set.
When TCCR2B has been updated from the temporary storage register, this bit is cleared by
hardware. A logical zero in this bit indicates that TCCR2B is ready to be updated with a new
value.
If a write is performed to any of the five Timer/Counter2 Registers while its update busy flag is
set, the updated value might get corrupted and cause an unintentional interrupt to occur.
Bit 7 6 5 4 3 2 1 0
(0xB6) – EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB ASSR
Read/Write R R/W R/W RR R R R
Initial Value 0 0 0 0 0 0 0 0193
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The mechanisms for reading TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B are different.
When reading TCNT2, the actual timer value is read. When reading OCR2A, OCR2B, TCCR2A
and TCCR2B the value in the temporary storage register is read.
20.10.7 TIMSK2 – Timer/Counter2 Interrupt Mask Register
• Bit 2 – OCIE2B: Timer/Counter2 Output Compare Match B Interrupt Enable
When the OCIE2B bit is written to one and the I-bit in the Status Register is set (one), the
Timer/Counter2 Compare Match B interrupt is enabled. The corresponding interrupt is executed
if a compare match in Timer/Counter2 occurs, that is, when the OCF2B bit is set in the
Timer/Counter 2 Interrupt Flag Register – TIFR2.
• Bit 1 – OCIE2A: Timer/Counter2 Output Compare Match A Interrupt Enable
When the OCIE2A bit is written to one and the I-bit in the Status Register is set (one), the
Timer/Counter2 Compare Match A interrupt is enabled. The corresponding interrupt is executed
if a compare match in Timer/Counter2 occurs, that is, when the OCF2A bit is set in the
Timer/Counter 2 Interrupt Flag Register – TIFR2.
• Bit 0 – TOIE2: Timer/Counter2 Overflow Interrupt Enable
When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the
Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an
overflow in Timer/Counter2 occurs, that is, when the TOV2 bit is set in the Timer/Counter2 Interrupt
Flag Register – TIFR2.
20.10.8 TIFR2 – Timer/Counter2 Interrupt Flag Register
• Bit 2 – OCF2B: Output Compare Flag 2 B
The OCF2B bit is set (one) when a compare match occurs between the Timer/Counter2 and the
data in OCR2B – Output Compare Register2. OCF2B is cleared by hardware when executing
the corresponding interrupt handling vector. Alternatively, OCF2B is cleared by writing a logic
one to the flag. When the I-bit in SREG, OCIE2B (Timer/Counter2 Compare match Interrupt
Enable), and OCF2B are set (one), the Timer/Counter2 Compare match Interrupt is executed.
• Bit 1 – OCF2A: Output Compare Flag 2 A
The OCF2A bit is set (one) when a compare match occurs between the Timer/Counter2 and the
data in OCR2A – Output Compare Register2. OCF2A is cleared by hardware when executing
the corresponding interrupt handling vector. Alternatively, OCF2A is cleared by writing a logic
one to the flag. When the I-bit in SREG, OCIE2A (Timer/Counter2 Compare match Interrupt
Enable), and OCF2A are set (one), the Timer/Counter2 Compare match Interrupt is executed.
Bit 7 6 5 4 3 2 1 0
(0x70) – – – – – OCIE2B OCIE2A TOIE2 TIMSK2
Read/Write R R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x17 (0x37) – – – – – OCF2B OCF2A TOV2 TIFR2
Read/Write R R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0194
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• Bit 0 – TOV2: Timer/Counter2 Overflow Flag
The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hardware
when executing the corresponding interrupt handling vector. Alternatively, TOV2 is cleared
by writing a logic one to the flag. When the SREG I-bit, TOIE2A (Timer/Counter2 Overflow Interrupt
Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In
PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00.
20.10.9 GTCCR – General Timer/Counter Control Register
• Bit 1 – PSRASY: Prescaler Reset Timer/Counter2
When this bit is one, the Timer/Counter2 prescaler will be reset. This bit is normally cleared
immediately by hardware. If the bit is written when Timer/Counter2 is operating in asynchronous
mode, the bit will remain one until the prescaler has been reset. The bit will not be cleared by
hardware if the TSM bit is set. Refer to the description of the “Bit 7 – TSM: Timer/Counter Synchronization
Mode” on page 170 for a description of the Timer/Counter Synchronization mode.
Bit 7 6 5 4 3 2 1 0
0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR
Read/Write R/W R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0195
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21. SPI – Serial Peripheral Interface
The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the
ATmega640/1280/1281/2560/2561 and peripheral devices or between several AVR devices.
The ATmega640/1280/1281/2560/2561 SPI includes the following features:
• Full-duplex, Three-wire Synchronous Data Transfer
• Master or Slave Operation
• LSB First or MSB First Data Transfer
• Seven Programmable Bit Rates
• End of Transmission Interrupt Flag
• Write Collision Flag Protection
• Wake-up from Idle Mode
• Double Speed (CK/2) Master SPI Mode
USART can also be used in Master SPI mode, see “USART in SPI Mode” on page 232.
The Power Reduction SPI bit, PRSPI, in “PRR0 – Power Reduction Register 0” on page 56 on
page 50 must be written to zero to enable SPI module.
Figure 21-1. SPI Block Diagram(1)
Note: 1. Refer to Figure 1-1 on page 2, and Table 13-6 on page 79 for SPI pin placement.
The interconnection between Master and Slave CPUs with SPI is shown in Figure 21-2 on page
196. The system consists of two shift Registers, and a Master clock generator. The SPI Master
initiates the communication cycle when pulling low the Slave Select SS pin of the desired Slave. SPI2X SPI2X
DIVIDER
/2/4/8/16/32/64/128196
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Master and Slave prepare the data to be sent in their respective shift Registers, and the Master
generates the required clock pulses on the SCK line to interchange data. Data is always shifted
from Master to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the
Master In – Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave
by pulling high the Slave Select, SS, line.
When configured as a Master, the SPI interface has no automatic control of the SS line. This
must be handled by user software before communication can start. When this is done, writing a
byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight
bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end of
Transmission Flag (SPIF). If the SPI Interrupt Enable bit (SPIE) in the SPCR Register is set, an
interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or
signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be
kept in the Buffer Register for later use.
When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long
as the SS pin is driven high. In this state, software may update the contents of the SPI Data
Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin
until the SS pin is driven low. As one byte has been completely shifted, the end of Transmission
Flag, SPIF is set. If the SPI Interrupt Enable bit, SPIE, in the SPCR Register is set, an interrupt
is requested. The Slave may continue to place new data to be sent into SPDR before reading
the incoming data. The last incoming byte will be kept in the Buffer Register for later use.
Figure 21-2. SPI Master-slave Interconnection
The system is single buffered in the transmit direction and double buffered in the receive direction.
This means that bytes to be transmitted cannot be written to the SPI Data Register before
the entire shift cycle is completed. When receiving data, however, a received character must be
read from the SPI Data Register before the next character has been completely shifted in. Otherwise,
the first byte is lost.
In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure
correct sampling of the clock signal, the minimum low and high periods should be:
Low period: longer than 2 CPU clock cycles.
High period: longer than 2 CPU clock cycles.
When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden
according to Table 21-1. For more details on automatic port overrides, refer to “Alternate Port
SHIFT
ENABLE197
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Functions” on page 75.
Note: 1. See “Alternate Functions of Port B” on page 79 for a detailed description of how to define the
direction of the user defined SPI pins.
The following code examples show how to initialize the SPI as a Master and how to perform a
simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction
Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by the
actual data direction bits for these pins. For example, if MOSI is placed on pin PB5, replace
DD_MOSI with DDB5 and DDR_SPI with DDRB.
Table 21-1. SPI Pin Overrides(1)
Pin Direction, Master SPI Direction, Slave SPI
MOSI User Defined Input
MISO Input User Defined
SCK User Defined Input
SS User Defined Input198
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Note: 1. See “About Code Examples” on page 11.
Assembly Code Example(1)
SPI_MasterInit:
; Set MOSI and SCK output, all others input
ldi r17,(1<>8);
UBRRL = (unsigned char)ubrr;
/* Enable receiver and transmitter */
UCSRB = (1<> 1) & 0x01;
return ((resh << 8) | resl);
}217
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buffer is empty (that is, does not contain any unread data). If the Receiver is disabled (RXENn =
0), the receive buffer will be flushed and consequently the RXCn bit will become zero.
When the Receive Complete Interrupt Enable (RXCIEn) in UCSRnB is set, the USART Receive
Complete interrupt will be executed as long as the RXCn Flag is set (provided that global interrupts
are enabled). When interrupt-driven data reception is used, the receive complete routine
must read the received data from UDRn in order to clear the RXCn Flag, otherwise a new interrupt
will occur once the interrupt routine terminates.
22.6.4 Receiver Error Flags
The USART Receiver has three Error Flags: Frame Error (FEn), Data OverRun (DORn) and
Parity Error (UPEn). All can be accessed by reading UCSRnA. Common for the Error Flags is
that they are located in the receive buffer together with the frame for which they indicate the
error status. Due to the buffering of the Error Flags, the UCSRnA must be read before the
receive buffer (UDRn), since reading the UDRn I/O location changes the buffer read location.
Another equality for the Error Flags is that they can not be altered by software doing a write to
the flag location. However, all flags must be set to zero when the UCSRnA is written for upward
compatibility of future USART implementations. None of the Error Flags can generate interrupts.
The Frame Error (FEn) Flag indicates the state of the first stop bit of the next readable frame
stored in the receive buffer. The FEn Flag is zero when the stop bit was correctly read (as one),
and the FEn Flag will be one when the stop bit was incorrect (zero). This flag can be used for
detecting out-of-sync conditions, detecting break conditions and protocol handling. The FEn
Flag is not affected by the setting of the USBSn bit in UCSRnC since the Receiver ignores all,
except for the first, stop bits. For compatibility with future devices, always set this bit to zero
when writing to UCSRnA.
The Data OverRun (DORn) Flag indicates data loss due to a receiver buffer full condition. A
Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting
in the Receive Shift Register, and a new start bit is detected. If the DORn Flag is set there
was one or more serial frame lost between the frame last read from UDRn, and the next frame
read from UDRn. For compatibility with future devices, always write this bit to zero when writing
to UCSRnA. The DORn Flag is cleared when the frame received was successfully moved from
the Shift Register to the receive buffer.
The Parity Error (UPEn) Flag indicates that the next frame in the receive buffer had a Parity
Error when received. If Parity Check is not enabled the UPEn bit will always be read zero. For
compatibility with future devices, always set this bit to zero when writing to UCSRnA. For more
details see “Parity Bit Calculation” on page 210 and “Parity Checker” on page 217.
22.6.5 Parity Checker
The Parity Checker is active when the high USART Parity mode (UPMn1) bit is set. Type of Parity
Check to be performed (odd or even) is selected by the UPMn0 bit. When enabled, the Parity
Checker calculates the parity of the data bits in incoming frames and compares the result with
the parity bit from the serial frame. The result of the check is stored in the receive buffer together
with the received data and stop bits. The Parity Error (UPEn) Flag can then be read by software
to check if the frame had a Parity Error.
The UPEn bit is set if the next character that can be read from the receive buffer had a Parity
Error when received and the Parity Checking was enabled at that point (UPMn1 = 1). This bit is
valid until the receive buffer (UDRn) is read.218
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22.6.6 Disabling the Receiver
In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing
receptions will therefore be lost. When disabled (that is, the RXENn is set to zero) the Receiver
will no longer override the normal function of the RxDn port pin. The Receiver buffer FIFO will be
flushed when the Receiver is disabled. Remaining data in the buffer will be lost.
22.6.7 Flushing the Receive Buffer
The receiver buffer FIFO will be flushed when the Receiver is disabled, that is, the buffer will be
emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal
operation, due to for instance an error condition, read the UDRn I/O location until the RXCn Flag
is cleared. The following code example shows how to flush the receive buffer.
Note: 1. See “About Code Examples” on page 11.
22.7 Asynchronous Data Reception
The USART includes a clock recovery and a data recovery unit for handling asynchronous data
reception. The clock recovery logic is used for synchronizing the internally generated baud rate
clock to the incoming asynchronous serial frames at the RxDn pin. The data recovery logic samples
and low pass filters each incoming bit, thereby improving the noise immunity of the
Receiver. The asynchronous reception operational range depends on the accuracy of the internal
baud rate clock, the rate of the incoming frames, and the frame size in number of bits.
22.7.1 Asynchronous Clock Recovery
The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 22-5
on page 219 illustrates the sampling process of the start bit of an incoming frame. The sample
rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double Speed
mode. The horizontal arrows illustrate the synchronization variation due to the sampling process.
Note the larger time variation when using the Double Speed mode (U2Xn = 1) of
operation. Samples denoted zero are samples done when the RxDn line is idle (that is, no communication
activity).
Assembly Code Example(1)
USART_Flush:
sbis UCSRnA, RXCn
ret
in r16, UDRn
rjmp USART_Flush
C Code Example(1)
void USART_Flush( void )
{
unsigned char dummy;
while ( UCSRnA & (1< 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz
High: > 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz
30.8.2 Serial Programming Algorithm
When writing serial data to the ATmega640/1280/1281/2560/2561, data is clocked on the rising
edge of SCK.
When reading data from the ATmega640/1280/1281/2560/2561, data is clocked on the falling
edge of SCK. See Figure 30-12 on page 353 for timing details.
To program and verify the ATmega640/1280/1281/2560/2561 in the serial programming mode,
the following sequence is recommended (see four byte instruction formats in Table 30-17 on
Table 30-15. Pin Mapping Serial Programming
Symbol
Pins
(TQFP-100)
Pins
(TQFP-64) I/O Description
PDI PB2 PE0 I Serial Data in
PDO PB3 PE1 O Serial Data out
SCK PB1 PB1 I Serial Clock
VCC
GND
XT AL1
SCK
PDO
PDI
RESET
+1.8V - 5.5V
AVCC
+1.8V - 5.5V(2)351
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page 352):
1. Power-up sequence:
Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems,
the programmer can not guarantee that SCK is held low during power-up. In this
case, RESET must be given a positive pulse of at least two CPU clock cycles duration
after SCK has been set to “0”.
2. Wait for at least 20ms and enable serial programming by sending the Programming
Enable serial instruction to pin PDI.
3. The serial programming instructions will not work if the communication is out of synchronization.
When in sync. the second byte (0x53), will echo back when issuing the third
byte of the Programming Enable instruction. Whether the echo is correct or not, all four
bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a
positive pulse and issue a new Programming Enable command.
4. The Flash is programmed one page at a time. The memory page is loaded one byte at a
time by supplying the 7 LSB of the address and data together with the Load Program
Memory Page instruction. To ensure correct loading of the page, the data low byte must
be loaded before data high byte is applied for a given address. The Program Memory
Page is stored by loading the Write Program Memory Page instruction with the address
lines 15:8. Before issuing this command, make sure the instruction Load Extended
Address Byte has been used to define the MSB of the address. The extended address
byte is stored until the command is re-issued, that is, the command needs only be issued
for the first page, and when crossing the 64KWord boundary. If polling (RDY/BSY) is not
used, the user must wait at least tWD_FLASH before issuing the next page (see Table 30-
16). Accessing the serial programming interface before the Flash write operation completes
can result in incorrect programming.
5. The EEPROM array is programmed one byte at a time by supplying the address and data
together with the appropriate Write instruction. An EEPROM memory location is first
automatically erased before new data is written. If polling is not used, the user must wait
at least tWD_EEPROM before issuing the next byte (see Table 30-16). In a chip erased
device, no 0xFFs in the data file(s) need to be programmed.
6. Any memory location can be verified by using the Read instruction which returns the content
at the selected address at serial output PDO. When reading the Flash memory, use
the instruction Load Extended Address Byte to define the upper address byte, which is
not included in the Read Program Memory instruction. The extended address byte is
stored until the command is re-issued, that is, the command needs only be issued for the
first page, and when crossing the 64KWord boundary.
7. At the end of the programming session, RESET can be set high to commence normal
operation.
8. Power-off sequence (if needed):
Set RESET to “1”.
Turn VCC power off.
Table 30-16. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location
Symbol Minimum Wait Delay
tWD_FLASH 4.5ms
tWD_EEPROM 3.6ms
tWD_ERASE 9.0ms352
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30.8.3 Serial Programming Instruction set
Table 30-17 and Figure 30-11 on page 353 describes the Instruction set.
Notes: 1. Not all instructions are applicable for all parts.
2. a = address.
3. Bits are programmed ‘0’, unprogrammed ‘1’.
4. To ensure future compatibility, unused Fuses and Lock bits should be unprogrammed (‘1’).
5. Refer to the correspondig section for Fuse and Lock bits, Calibration and Signature bytes and
Page size.
6. See htt://www.atmel.com/avr for Application Notes regarding programming and programmers.
If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until
this bit returns ‘0’ before the next instruction is carried out.
Table 30-17. Serial Programming Instruction Set
Instruction/Operation
Instruction Format
Byte 1 Byte 2 Byte 3 Byte 4
Programming Enable $AC $53 $00 $00
Chip Erase (Program Memory/EEPROM) $AC $80 $00 $00
Poll RDY/BSY $F0 $00 $00 data byte out
Load Instructions
Load Extended Address byte(1) $4D $00 Extended adr $00
Load Program Memory Page, High byte $48 $00 adr LSB high data byte in
Load Program Memory Page, Low byte $40 $00 adr LSB low data byte in
Load EEPROM Memory Page (page access) $C1 $00 0000 000aa data byte in
Read Instructions
Read Program Memory, High byte $28 adr MSB adr LSB high data byte out
Read Program Memory, Low byte $20 adr MSB adr LSB low data byte out
Read EEPROM Memory $A0 0000 aaaa aaaa aaaa data byte out
Read Lock bits $58 $00 $00 data byte out
Read Signature Byte $30 $00 0000 000aa data byte out
Read Fuse bits $50 $00 $00 data byte out
Read Fuse High bits $58 $08 $00 data byte out
Read Extended Fuse Bits $50 $08 $00 data byte out
Read Calibration Byte $38 $00 $00 data byte out
Write Instructions
Write Program Memory Page $4C adr MSB adr LSB $00
Write EEPROM Memory $C0 0000 aaaa aaaa aaaa data byte in
Write EEPROM Memory Page (page access) $C2 0000 aaaa aaaa 00 $00
Write Lock bits $AC $E0 $00 data byte in
Write Fuse bits $AC $A0 $00 data byte in
Write Fuse High bits $AC $A8 $00 data byte in
Write Extended Fuse Bits $AC $A4 $00 data byte in353
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Within the same page, the low data byte must be loaded prior to the high data byte.
After data is loaded to the page buffer, program the EEPROM page, see Figure 30-11.
Figure 30-11. Serial Programming Instruction example
30.8.4 Serial Programming Characteristics
For characteristics of the Serial Programming module, see “SPI Timing Characteristics” on page
375.
Figure 30-12. Serial Programming Waveforms
Byte 1 Byte 2 Byte 3 Byte 4
Adr LSB
Bit 15 B 0
Serial Programming Instruction
Program Memory/
EEPROM Memory
Page 0
Page 1
Page 2
Page N-1
Page Buffer
Write Program Memory Page/
Write EEPROM Memory Page
Load Program Memory Page (High/Low Byte)/
Load EEPROM Memory Page (page access)
Byte 1 Byte 2 Byte 3 Byte 4
Bit 15 B 0
Adr MSB
Page Offset
Page Number
Adr MSB Adr LSB
MSB
MSB
LSB
LSB
SERIAL CLOCK INPUT
(SCK)
SERIAL DATA INPUT
(MOSI)
(MISO)
SAMPLE
SERIAL DATA OUTPUT354
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30.9 Programming via the JTAG Interface
Programming through the JTAG interface requires control of the four JTAG specific pins: TCK,
TMS, TDI, and TDO. Control of the reset and clock pins is not required.
To be able to use the JTAG interface, the JTAGEN Fuse must be programmed. The device is
default shipped with the fuse programmed. In addition, the JTD bit in MCUCR must be cleared.
Alternatively, if the JTD bit is set, the external reset can be forced low. Then, the JTD bit will be
cleared after two chip clocks, and the JTAG pins are available for programming. This provides a
means of using the JTAG pins as normal port pins in Running mode while still allowing In-System
Programming via the JTAG interface. Note that this technique can not be used when using
the JTAG pins for Boundary-scan or On-chip Debug. In these cases the JTAG pins must be dedicated
for this purpose.
During programming the clock frequency of the TCK Input must be less than the maximum frequency
of the chip. The System Clock Prescaler can not be used to divide the TCK Clock Input
into a sufficiently low frequency.
As a definition in this datasheet, the LSB is shifted in and out first of all Shift Registers.
30.9.1 Programming Specific JTAG Instructions
The Instruction Register is 4-bit wide, supporting up to 16 instructions. The JTAG instructions
useful for programming are listed below.
The OPCODE for each instruction is shown behind the instruction name in hex format. The text
describes which Data Register is selected as path between TDI and TDO for each instruction.
The Run-Test/Idle state of the TAP controller is used to generate internal clocks. It can also be
used as an idle state between JTAG sequences. The state machine sequence for changing the
instruction word is shown in Figure 30-13 on page 355.355
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Figure 30-13. State Machine Sequence for Changing the Instruction Word
30.9.2 AVR_RESET (0xC)
The AVR specific public JTAG instruction for setting the AVR device in the Reset mode or taking
the device out from the Reset mode. The TAP controller is not reset by this instruction. The one
bit Reset Register is selected as Data Register. Note that the reset will be active as long as there
is a logic “one” in the Reset Chain. The output from this chain is not latched.
The active states are:
• Shift-DR: The Reset Register is shifted by the TCK input
30.9.3 PROG_ENABLE (0x4)
The AVR specific public JTAG instruction for enabling programming via the JTAG port. The 16-
bit Programming Enable Register is selected as Data Register. The active states are the
following:
• Shift-DR: The programming enable signature is shifted into the Data Register
• Update-DR: The programming enable signature is compared to the correct value, and
Programming mode is entered if the signature is valid
Test-Logic-Reset
Run-Test/Idle
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR Scan
Capture-IR
Shift-IR
Exit1-IR
Pause-IR
Exit2-IR
Update-IR
Select-DR Scan
Capture-DR
0
1
0 11 1
0 0
0 0
1 1
1 0
1
1
0
1
0
0
1 0
1
1
0
1
0
0
0 0
1 1356
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30.9.4 PROG_COMMANDS (0x5)
The AVR specific public JTAG instruction for entering programming commands via the JTAG
port. The 15-bit Programming Command Register is selected as Data Register. The active
states are the following:
• Capture-DR: The result of the previous command is loaded into the Data Register
• Shift-DR: The Data Register is shifted by the TCK input, shifting out the result of the
previous command and shifting in the new command
• Update-DR: The programming command is applied to the Flash inputs
• Run-Test/Idle: One clock cycle is generated, executing the applied command
30.9.5 PROG_PAGELOAD (0x6)
The AVR specific public JTAG instruction to directly load the Flash data page via the JTAG port.
An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBs
of the Programming Command Register. The active states are the following:
• Shift-DR: The Flash Data Byte Register is shifted by the TCK input.
• Update-DR: The content of the Flash Data Byte Register is copied into a temporary register.
A write sequence is initiated that within 11 TCK cycles loads the content of the temporary
register into the Flash page buffer. The AVR automatically alternates between writing the low
and the high byte for each new Update-DR state, starting with the low byte for the first
Update-DR encountered after entering the PROG_PAGELOAD command. The Program
Counter is pre-incremented before writing the low byte, except for the first written byte. This
ensures that the first data is written to the address set up by PROG_COMMANDS, and
loading the last location in the page buffer does not make the program counter increment
into the next page.
30.9.6 PROG_PAGEREAD (0x7)
The AVR specific public JTAG instruction to directly capture the Flash content via the JTAG port.
An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBs
of the Programming Command Register. The active states are the following:
• Capture-DR: The content of the selected Flash byte is captured into the Flash Data Byte
Register. The AVR automatically alternates between reading the low and the high byte for
each new Capture-DR state, starting with the low byte for the first Capture-DR encountered
after entering the PROG_PAGEREAD command. The Program Counter is post-incremented
after reading each high byte, including the first read byte. This ensures that the first data is
captured from the first address set up by PROG_COMMANDS, and reading the last location
in the page makes the program counter increment into the next page.
• Shift-DR: The Flash Data Byte Register is shifted by the TCK input.
30.9.7 Data Registers
The Data Registers are selected by the JTAG instruction registers described in section “Programming
Specific JTAG Instructions” on page 354. The Data Registers relevant for
programming operations are:
• Reset Register
• Programming Enable Register
• Programming Command Register
• Flash Data Byte Register357
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30.9.8 Reset Register
The Reset Register is a Test Data Register used to reset the part during programming. It is
required to reset the part before entering Programming mode.
A high value in the Reset Register corresponds to pulling the external reset low. The part is reset
as long as there is a high value present in the Reset Register. Depending on the Fuse settings
for the clock options, the part will remain reset for a Reset Time-out period (refer to “Clock
Sources” on page 41) after releasing the Reset Register. The output from this Data Register is
not latched, so the reset will take place immediately, as shown in Figure 28-2 on page 304.
30.9.9 Programming Enable Register
The Programming Enable Register is a 16-bit register. The contents of this register is compared
to the programming enable signature, binary code 0b1010_0011_0111_0000. When the contents
of the register is equal to the programming enable signature, programming via the JTAG
port is enabled. The register is reset to 0 on Power-on Reset, and should always be reset when
leaving Programming mode.
Figure 30-14. Programming Enable Register
30.9.10 Programming Command Register
The Programming Command Register is a 15-bit register. This register is used to serially shift in
programming commands, and to serially shift out the result of the previous command, if any. The
JTAG Programming Instruction Set is shown in Table 30-18 on page 359. The state sequence
when shifting in the programming commands is illustrated in Figure 30-16 on page 362.
TDI
TDO
D
A
T
A
= D Q
ClockDR & PROG_ENABLE
Programming Enable
0xA370358
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Figure 30-15. Programming Command Register
TDI
TDO
S
T
R
O
B
E
S
A
D
D
R
E
S
S
/
D
A
T
A
Flash
EEPROM
Fuses
Lock Bits359
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Table 30-18. JTAG Programming Instruction
Set a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out,
i = data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes
1a. Chip Erase
0100011_10000000
0110001_10000000
0110011_10000000
0110011_10000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
1b. Poll for Chip Erase Complete 0110011_10000000 xxxxxox_xxxxxxxx (2)
2a. Enter Flash Write 0100011_00010000 xxxxxxx_xxxxxxxx
2b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10)
2c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx
2d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
2e. Load Data Low Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx
2f. Load Data High Byte 0010111_iiiiiiii xxxxxxx_xxxxxxxx
2g. Latch Data
0110111_00000000
1110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
2h. Write Flash Page
0110111_00000000
0110101_00000000
0110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
2i. Poll for Page Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
3a. Enter Flash Read 0100011_00000010 xxxxxxx_xxxxxxxx
3b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10)
3c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx
3d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
3e. Read Data Low and High Byte
0110010_00000000
0110110_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
xxxxxxx_oooooooo
Low byte
High byte
4a. Enter EEPROM Write 0100011_00010001 xxxxxxx_xxxxxxxx
4b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10)
4c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
4d. Load Data Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx
4e. Latch Data
0110111_00000000
1110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
4f. Write EEPROM Page
0110011_00000000
0110001_00000000
0110011_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)360
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4g. Poll for Page Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2)
5a. Enter EEPROM Read 0100011_00000011 xxxxxxx_xxxxxxxx
5b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10)
5c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
5d. Read Data Byte
0110011_bbbbbbbb
0110010_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
6a. Enter Fuse Write 0100011_01000000 xxxxxxx_xxxxxxxx
6b. Load Data Low Byte(6) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3)
6c. Write Fuse Extended Byte
0111011_00000000
0111001_00000000
0111011_00000000
0111011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
6d. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
6e. Load Data Low Byte(7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3)
6f. Write Fuse High Byte
0110111_00000000
0110101_00000000
0110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
6g. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
6h. Load Data Low Byte(7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3)
6i. Write Fuse Low Byte
0110011_00000000
0110001_00000000
0110011_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
6j. Poll for Fuse Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2)
7a. Enter Lock Bit Write 0100011_00100000 xxxxxxx_xxxxxxxx
7b. Load Data Byte(9) 0010011_11iiiiii xxxxxxx_xxxxxxxx (4)
7c. Write Lock Bits
0110011_00000000
0110001_00000000
0110011_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
7d. Poll for Lock Bit Write complete 0110011_00000000 xxxxxox_xxxxxxxx (2)
8a. Enter Fuse/Lock Bit Read 0100011_00000100 xxxxxxx_xxxxxxxx
8b. Read Extended Fuse Byte(6) 0111010_00000000
0111011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
8c. Read Fuse High Byte(7) 0111110_00000000
0111111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
Table 30-18. JTAG Programming Instruction (Continued)
Set (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte,
o = data out, i = data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes361
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Notes: 1. This command sequence is not required if the seven MSB are correctly set by the previous command sequence (which is
normally the case).
2. Repeat until o = “1”.
3. Set bits to “0” to program the corresponding Fuse, “1” to unprogram the Fuse.
4. Set bits to “0” to program the corresponding Lock bit, “1” to leave the Lock bit unchanged.
5. “0” = programmed, “1” = unprogrammed.
6. The bit mapping for Fuses Extended byte is listed in Table 30-3 on page 336.
7. The bit mapping for Fuses High byte is listed in Table 30-4 on page 337.
8. The bit mapping for Fuses Low byte is listed in Table 30-5 on page 337.
9. The bit mapping for Lock bits byte is listed in Table 30-1 on page 335.
10. Address bits exceeding PCMSB and EEAMSB (Table 30-7 on page 338 and Table 30-8 on page 338) are don’t care.
11. All TDI and TDO sequences are represented by binary digits (0b...).
8d. Read Fuse Low Byte(8) 0110010_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
8e. Read Lock Bits(9) 0110110_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxoooooo (5)
8f. Read Fuses and Lock Bits
0111010_00000000
0111110_00000000
0110010_00000000
0110110_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
xxxxxxx_oooooooo
xxxxxxx_oooooooo
xxxxxxx_oooooooo
(5)
Fuse Ext. byte
Fuse High byte
Fuse Low byte
Lock bits
9a. Enter Signature Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx
9b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
9c. Read Signature Byte 0110010_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
10a. Enter Calibration Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx
10b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
10c. Read Calibration Byte 0110110_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
11a. Load No Operation Command 0100011_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
Table 30-18. JTAG Programming Instruction (Continued)
Set (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte,
o = data out, i = data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes362
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ATmega640/1280/1281/2560/2561
Figure 30-16. State Machine Sequence for Changing/Reading the Data Word
30.9.11 Flash Data Byte Register
The Flash Data Byte Register provides an efficient way to load the entire Flash page buffer
before executing Page Write, or to read out/verify the content of the Flash. A state machine sets
up the control signals to the Flash and senses the strobe signals from the Flash, thus only the
data words need to be shifted in/out.
The Flash Data Byte Register actually consists of the 8-bit scan chain and a 8-bit temporary register.
During page load, the Update-DR state copies the content of the scan chain over to the
temporary register and initiates a write sequence that within 11 TCK cycles loads the content of
the temporary register into the Flash page buffer. The AVR automatically alternates between
writing the low and the high byte for each new Update-DR state, starting with the low byte for the
first Update-DR encountered after entering the PROG_PAGELOAD command. The Program
Counter is pre-incremented before writing the low byte, except for the first written byte. This
ensures that the first data is written to the address set up by PROG_COMMANDS, and loading
the last location in the page buffer does not make the Program Counter increment into the next
page.
During Page Read, the content of the selected Flash byte is captured into the Flash Data Byte
Register during the Capture-DR state. The AVR automatically alternates between reading the
low and the high byte for each new Capture-DR state, starting with the low byte for the first CapTest-Logic-Reset
Run-Test/Idle
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR Scan
Capture-IR
Shift-IR
Exit1-IR
Pause-IR
Exit2-IR
Update-IR
Select-DR Scan
Capture-DR
0
1
0 11 1
0 0
0 0
1 1
1 0
1
1
0
1
0
0
1 0
1
1
0
1
0
0
0 0
1 1363
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ture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter is
post-incremented after reading each high byte, including the first read byte. This ensures that
the first data is captured from the first address set up by PROG_COMMANDS, and reading the
last location in the page makes the program counter increment into the next page.
Figure 30-17. Flash Data Byte Register
The state machine controlling the Flash Data Byte Register is clocked by TCK. During normal
operation in which eight bits are shifted for each Flash byte, the clock cycles needed to navigate
through the TAP controller automatically feeds the state machine for the Flash Data Byte Register
with sufficient number of clock pulses to complete its operation transparently for the user.
However, if too few bits are shifted between each Update-DR state during page load, the TAP
controller should stay in the Run-Test/Idle state for some TCK cycles to ensure that there are at
least 11 TCK cycles between each Update-DR state.
30.9.12 Programming Algorithm
All references below of type “1a”, “1b”, and so on, refer to Table 30-18 on page 359.
30.9.13 Entering Programming Mode
1. Enter JTAG instruction AVR_RESET and shift 1 in the Reset Register.
2. Enter instruction PROG_ENABLE and shift 0b1010_0011_0111_0000 in the Programming
Enable Register.
30.9.14 Leaving Programming Mode
1. Enter JTAG instruction PROG_COMMANDS.
2. Disable all programming instructions by using no operation instruction 11a.
3. Enter instruction PROG_ENABLE and shift 0b0000_0000_0000_0000 in the programming
Enable Register.
4. Enter JTAG instruction AVR_RESET and shift 0 in the Reset Register.
TDI
TDO
D
A
T
A
Flash
EEPROM
Fuses
Lock Bits
STROBES
ADDRESS
State
Machine364
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30.9.15 Performing Chip Erase
1. Enter JTAG instruction PROG_COMMANDS.
2. Start Chip Erase using programming instruction 1a.
3. Poll for Chip Erase complete using programming instruction 1b, or wait for tWLRH_CE (refer
to Table 30-14 on page 348).
30.9.16 Programming the Flash
Before programming the Flash a Chip Erase must be performed, see “Performing Chip Erase”
on page 364.
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash write using programming instruction 2a.
3. Load address Extended High byte using programming instruction 2b.
4. Load address High byte using programming instruction 2c.
5. Load address Low byte using programming instruction 2d.
6. Load data using programming instructions 2e, 2f and 2g.
7. Repeat steps 5 and 6 for all instruction words in the page.
8. Write the page using programming instruction 2h.
9. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH (refer to
Table 30-14 on page 348).
10. Repeat steps 3 to 9 until all data have been programmed.
A more efficient data transfer can be achieved using the PROG_PAGELOAD instruction:
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash write using programming instruction 2a.
3. Load the page address using programming instructions 2b, 2c and 2d. PCWORD (refer
to Table 30-7 on page 338) is used to address within one page and must be written as 0.
4. Enter JTAG instruction PROG_PAGELOAD.
5. Load the entire page by shifting in all instruction words in the page byte-by-byte, starting
with the LSB of the first instruction in the page and ending with the MSB of the last
instruction in the page. Use Update-DR to copy the contents of the Flash Data Byte Register
into the Flash page location and to auto-increment the Program Counter before
each new word.
6. Enter JTAG instruction PROG_COMMANDS.
7. Write the page using programming instruction 2h.
8. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH (refer to
Table 30-14 on page 348).
9. Repeat steps 3 to 8 until all data have been programmed.
30.9.17 Reading the Flash
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash read using programming instruction 3a.
3. Load address using programming instructions 3b, 3c and 3d.
4. Read data using programming instruction 3e.
5. Repeat steps 3 and 4 until all data have been read.365
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A more efficient data transfer can be achieved using the PROG_PAGEREAD instruction:
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash read using programming instruction 3a.
3. Load the page address using programming instructions 3b, 3c and 3d. PCWORD (refer
to Table 30-7 on page 338) is used to address within one page and must be written as 0.
4. Enter JTAG instruction PROG_PAGEREAD.
5. Read the entire page (or Flash) by shifting out all instruction words in the page (or Flash),
starting with the LSB of the first instruction in the page (Flash) and ending with the MSB
of the last instruction in the page (Flash). The Capture-DR state both captures the data
from the Flash, and also auto-increments the program counter after each word is read.
Note that Capture-DR comes before the shift-DR state. Hence, the first byte which is
shifted out contains valid data.
6. Enter JTAG instruction PROG_COMMANDS.
7. Repeat steps 3 to 6 until all data have been read.
30.9.18 Programming the EEPROM
Before programming the EEPROM a Chip Erase must be performed, see “Performing Chip
Erase” on page 364.
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable EEPROM write using programming instruction 4a.
3. Load address High byte using programming instruction 4b.
4. Load address Low byte using programming instruction 4c.
5. Load data using programming instructions 4d and 4e.
6. Repeat steps 4 and 5 for all data bytes in the page.
7. Write the data using programming instruction 4f.
8. Poll for EEPROM write complete using programming instruction 4g, or wait for tWLRH
(refer to Table 30-14 on page 348).
9. Repeat steps 3 to 8 until all data have been programmed.
Note that the PROG_PAGELOAD instruction can not be used when programming the EEPROM.
30.9.19 Reading the EEPROM
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable EEPROM read using programming instruction 5a.
3. Load address using programming instructions 5b and 5c.
4. Read data using programming instruction 5d.
5. Repeat steps 3 and 4 until all data have been read.
Note that the PROG_PAGEREAD instruction can not be used when reading the EEPROM.
30.9.20 Programming the Fuses
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Fuse write using programming instruction 6a.
3. Load data high byte using programming instructions 6b. A bit value of “0” will program the
corresponding fuse, a “1” will unprogram the fuse.
4. Write Fuse High byte using programming instruction 6c.366
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5. Poll for Fuse write complete using programming instruction 6d, or wait for tWLRH (refer to
Table 30-14 on page 348).
6. Load data low byte using programming instructions 6e. A “0” will program the fuse, a “1”
will unprogram the fuse.
7. Write Fuse low byte using programming instruction 6f.
8. Poll for Fuse write complete using programming instruction 6g, or wait for tWLRH (refer to
Table 30-14 on page 348).
30.9.21 Programming the Lock Bits
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Lock bit write using programming instruction 7a.
3. Load data using programming instructions 7b. A bit value of “0” will program the corresponding
lock bit, a “1” will leave the lock bit unchanged.
4. Write Lock bits using programming instruction 7c.
5. Poll for Lock bit write complete using programming instruction 7d, or wait for tWLRH (refer
to Table 30-14 on page 348).
30.9.22 Reading the Fuses and Lock Bits
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Fuse/Lock bit read using programming instruction 8a.
3. To read all Fuses and Lock bits, use programming instruction 8e.
To only read Fuse High byte, use programming instruction 8b.
To only read Fuse Low byte, use programming instruction 8c.
To only read Lock bits, use programming instruction 8d.
30.9.23 Reading the Signature Bytes
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Signature byte read using programming instruction 9a.
3. Load address 0x00 using programming instruction 9b.
4. Read first signature byte using programming instruction 9c.
5. Repeat steps 3 and 4 with address 0x01 and address 0x02 to read the second and third
signature bytes, respectively.
30.9.24 Reading the Calibration Byte
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Calibration byte read using programming instruction 10a.
3. Load address 0x00 using programming instruction 10b.
4. Read the calibration byte using programming instruction 10c.367
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31. Electrical Characteristics
Absolute Maximum Ratings*
31.1 DC Characteristics
Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°C to +150°C
Voltage on any Pin except RESET
with respect to Ground ................................-0.5V to VCC+0.5V
Voltage on RESET with respect to Ground......-0.5V to +13.0V
Maximum Operating Voltage ............................................ 6.0V
DC Current per I/O Pin ................................................ 40.0mA
DC Current VCC and GND Pins................................. 200.0mA
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted)
Symbol Parameter Condition Min. Typ. Max. Units
VIL
Input Low Voltage, Except
XTAL1 and Reset pin
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V
-0.5
-0.5
0.2VCC(1)
0.3VCC(1)
V
VIL1
Input Low Voltage,
XTAL1 pin VCC = 1.8V - 5.5V -0.5 0.1VCC(1)
VIL2
Input Low Voltage,
RESET pin VCC = 1.8V - 5.5V -0.5 0.1VCC(1)
VIH
Input High Voltage,
Except XTAL1 and
RESET pins
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V
0.7VCC(2)
0.6VCC(2)
VCC + 0.5
VCC + 0.5
VIH1
Input High Voltage,
XTAL1 pin
VCC = 1.8V - 2.4V
VCC = 2.4V - 5.5V
0.8VCC(2)
0.7VCC(2)
VCC + 0.5
VCC + 0.5
VIH2
Input High Voltage,
RESET pin VCC = 1.8V - 5.5V 0.9VCC(2) VCC + 0.5
VOL
Output Low Voltage(3),
Except RESET pin
I
OL = 20mA, VCC = 5V
IOL = 10mA, VCC = 3V
0.9
0.6
VOH
Output High Voltage(4),
Except RESET pin
IOH = -20mA, VCC = 5V
IOH = -10mA, VCC = 3V
4.2
2.3
I
IL
Input Leakage
Current I/O Pin
VCC = 5.5V, pin low
(absolute value) 1
µA
IIH
Input Leakage
Current I/O Pin
VCC = 5.5V, pin high
(absolute value) 1
RRST Reset Pull-up Resistor 30 60
kΩ
RPU I/O Pin Pull-up Resistor 20 50368
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ATmega640/1280/1281/2560/2561
Notes: 1. "Max" means the highest value where the pin is guaranteed to be read as low.
2. "Min" means the lowest value where the pin is guaranteed to be read as high.
3. Although each I/O port can sink more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state
conditions (non-transient), the following must be observed:
ATmega1281/2561:
1.)The sum of all IOL, for ports A0-A7, G2, C4-C7 should not exceed 100mA.
2.)The sum of all IOL, for ports C0-C3, G0-G1, D0-D7 should not exceed 100mA.
3.)The sum of all IOL, for ports G3-G5, B0-B7, E0-E7 should not exceed 100mA.
4.)The sum of all IOL, for ports F0-F7 should not exceed 100mA.
ATmega640/1280/2560:
1.)The sum of all IOL, for ports J0-J7, A0-A7, G2 should not exceed 200mA.
2.)The sum of all IOL, for ports C0-C7, G0-G1, D0-D7, L0-L7 should not exceed 200mA.
3.)The sum of all IOL, for ports G3-G4, B0-B7, H0-B7 should not exceed 200mA.
4.)The sum of all IOL, for ports E0-E7, G5 should not exceed 100mA.
5.)The sum of all IOL, for ports F0-F7, K0-K7 should not exceed 100mA.
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater
than the listed test condition.
4. Although each I/O port can source more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady
state conditions (non-transient), the following must be observed:
ATmega1281/2561:
1)The sum of all IOH, for ports A0-A7, G2, C4-C7 should not exceed 100mA.
2)The sum of all IOH, for ports C0-C3, G0-G1, D0-D7 should not exceed 100mA.
3)The sum of all IOH, for ports G3-G5, B0-B7, E0-E7 should not exceed 100mA.
4)The sum of all IOH, for ports F0-F7 should not exceed 100mA.
ATmega640/1280/2560:
1)The sum of all IOH, for ports J0-J7, G2, A0-A7 should not exceed 200mA.
2)The sum of all IOH, for ports C0-C7, G0-G1, D0-D7, L0-L7 should not exceed 200mA.
3)The sum of all IOH, for ports G3-G4, B0-B7, H0-H7 should not exceed 200mA.
4)The sum of all IOH, for ports E0-E7, G5 should not exceed 100mA.
ICC
Power Supply Current(5)
Active 1MHz, VCC = 2V
(ATmega640/1280/2560/1V) 0.5 0.8
mA
Active 4MHz, VCC = 3V
(ATmega640/1280/2560/1L) 3.2 5
Active 8MHz, VCC = 5V
(ATmega640/1280/1281/2560/2561) 10 14
Idle 1MHz, VCC = 2V
(ATmega640/1280/2560/1V) 0.14 0.22
Idle 4MHz, VCC = 3V
(ATmega640/1280/2560/1L) 0.7 1.1
Idle 8MHz, VCC = 5V
(ATmega640/1280/1281/2560/2561) 2.7 4
Power-down mode
WDT enabled, VCC = 3V <5 15
µA
WDT disabled, VCC = 3V <1 7.5
VACIO
Analog Comparator
Input Offset Voltage
VCC = 5V
Vin = VCC/2 <10 40 mV
I
ACLK
Analog Comparator
Input Leakage Current
VCC = 5V
Vin = VCC/2 -50 50 nA
t
ACID
Analog Comparator
Propagation Delay
VCC = 2.7V
VCC = 4.0V
750
500 ns
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) (Continued)
Symbol Parameter Condition Min. Typ. Max. Units369
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5)The sum of all IOH, for ports F0-F7, K0-K7 should not exceed 100mA.
If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current
greater than the listed test condition.
5. Values with “PRR1 – Power Reduction Register 1” enabled (0xFF).
31.2 Speed Grades
Maximum frequency is depending on VCC. As shown in Figure 31-1 trough Figure 31-4 on page
370, the Maximum Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V and between
2.7V < VCC < 4.5V.
31.2.1 8MHz
Figure 31-1. Maximum Frequency vs. VCC, ATmega640V/1280V/1281V/2560V/2561V
Figure 31-2. Maximum Frequency vs. VCC when also No-Read-While-Write Section(1),
ATmega2560V/ATmega2561V, is used
Note: 1. When only using the Read-While-Write Section of the program memory, a higher speed can
be achieved at low voltage, see “Read-While-Write and No Read-While-Write Flash Sections”
on page 317 for addresses.
8 MHz
4 MHz
1.8V 2.7V 5.5V
Safe Operating Area
8 MHz
2 MHz
1.8V 2.7V 5.5V
Safe Operating Area370
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31.2.2 16 MHz
Figure 31-3. Maximum Frequency vs. VCC, ATmega640/ATmega1280/ATmega1281
Figure 31-4. Maximum Frequency vs. VCC, ATmega2560/ATmega2561
16 MHz
8 MHz
2.7V 4.5V 5.5V
Safe Operating Area
16 MHz
4.5V 5.5V
Safe Operating Area371
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31.3 Clock Characteristics
31.3.1 Calibrated Internal RC Oscillator Accuracy
Notes: 1. Voltage range for ATmega640V/1281V/1280V/2561V/2560V.
2. Voltage range for ATmega640/1281/1280/2561/2560.
31.3.2 External Clock Drive Waveforms
Figure 31-5. External Clock Drive Waveforms
31.4 External Clock Drive
Table 31-1. Calibration Accuracy of Internal RC Oscillator
Frequency VCC Temperature Calibration Accuracy
Factory Calibration 8.0MHz 3V 25°C ±10%
User Calibration 7.3MHz - 8.1MHz 1.8V - 5.5V(1)
2.7V - 5.5V(2) -40°C - 85°C ±1%
VIL1
VIH1
Table 31-2. External Clock Drive
Symbol Parameter
VCC = 1.8V - 5.5V VCC = 2.7V - 5.5V VCC = 4.5V - 5.5V
Min. Max. Min. Max. Min. Max. Units
1/tCLCL
Oscillator
Frequency 0 2 0 8 0 16 MHz
tCLCL Clock Period 500 125 62.5
tCHCX High Time 200 50 25 ns
t
CLCX Low Time 200 50 25
t
CLCH Rise Time 2.0 1.6 0.5
μs
tCHCL Fall Time 2.0 1.6 0.5
ΔtCLCL
Change in period
from one clock
cycle to the next
2 2 2%372
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31.5 System and Reset Characteristics
Note: 1. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling).
31.5.1 Standard Power-On Reset
This implementation of power-on reset existed in early versions of
ATmega640/1280/1281/2560/2561. The table below describes the characteristics of this poweron
reset and it is valid for the following devices only:
• ATmega640: revision A
• ATmega1280: revision A
• ATmega1281: revision A
• ATmega2560: revision A to E
• ATmega2561: revision A to E
Table 31-4. Characteristics of Standard Power-On Reset. TA= -40 to +85°C.
Notes: 1. Values are guidelines only.
2. Threshold where device is released from reset when voltage is rising.
3. The power-on reset threshold voltage (falling) will not work unless the supply voltage has been
below VPOT.
Table 31-3. Reset, Brown-out and Internal voltage CharacteristicsCharacteristics
Symbol Parameter Condition Min Typ Max Units
VRST RESET Pin Threshold Voltage 0.2VCC 0.9VCC V
tRST Minimum pulse width on RESET Pin 2.5 µs
VHYST Brown-out Detector Hysteresis 50 mV
tBOD Min Pulse Width on Brown-out Reset 2 µs
VBG Bandgap reference voltage VCC=2.7V, TA= 25°C 1.0 1.1 1.2 V
t
BG Bandgap reference start-up time VCC=2.7V, TA= 25°C 40 70 µs
I
BG Bandgap reference current consumption VCC=2.7V, TA= 25°C 10 µA
Symbol Parameter Min.(1) Typ.(1) Max.(1) Units
VPOT
Power-on Reset Threshold Voltage (rising)(2) 0.7 1.0 1.4 V
Power-on Reset Threshold Voltage (falling)(3) 0.05 0.9 1.3 V
VPSR Power-on slope rate 0.01 4.5 V/ms373
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31.5.2 Enhanced Power-On Reset
This implementation of power-on reset exists in newer versions of
ATmega640/1280/1281/2560/2561. The table below describes the characteristics of this poweron
reset and it is valid for the following devices only:
• ATmega640: revision B and newer
• ATmega1280: revision B and newer
• ATmega1281: revision B and newer
• ATmega2560: revision F and newer
• ATmega2561: revision F and newer
Table 31-5. Characteristics of Enhanced Power-On Reset. TA= -40 to +85°C.
Notes: 1. Values are guidelines only.
2. Threshold where device is released from reset when voltage is rising.
3. The power-on reset threshold voltage (falling) will not work unless the supply voltage has been
below VPOT.
Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is
tested down to VCC = VBOT during the production test. This guarantees that a Brown-Out Reset will occur before VCC drops to
a voltage where correct operation of the microcontroller is no longer guaranteed. The test is performed using
BODLEVEL = 110 for 4MHz operation of ATmega640V/1280V/1281V/2560V/2561V, BODLEVEL = 101 for 8MHz operation
of ATmega640V/1280V/1281V/2560V/2561V and ATmega640/1280/1281, and BODLEVEL = 100 for 16MHz operation of
ATmega640/1280/1281/2560/2561.
31.6 2-wire Serial Interface Characteristics
Table 31-7 on page 374 describes the requirements for devices connected to the 2-wire Serial
Bus. The ATmega640/1280/1281/2560/2561 2-wire Serial Interface meets or exceeds these
requirements under the noted conditions.
Timing symbols refer to Figure 31-6 on page 375.
Symbol Parameter Min.(1) Typ.(1) Max.(1) Units
VPOT
Power-on Reset Threshold Voltage (rising)(2) 1.1 1.4 1.6 V
Power-on Reset Threshold Voltage (falling)(3) 0.6 1.3 1.6 V
VPSR Power-On Slope Rate 0.01 V/ms
Table 31-6. BODLEVEL Fuse Coding(1)
BODLEVEL 2:0 Fuses Min VBOT Typ VBOT Max VBOT Units
111 BOD Disabled
110 1.7 1.8 2.0
101 2.5 2.7 2.9 V
100 4.1 4.3 4.5
011
Reserved
010
001
000374
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Notes: 1. In ATmega640/1280/1281/2560/2561, this parameter is characterized and not 100% tested.
2. Required only for fSCL > 100kHz.
3. Cb = capacitance of one bus line in pF.
4. fCK = CPU clock frequency.
Table 31-7. 2-wire Serial Bus Requirements
Symbol Parameter Condition Min Max Units
VIL Input Low-voltage -0.5 0.3 VCC
V
VIH Input High-voltage 0.7 VCC VCC + 0.5
Vhys(1) Hysteresis of Schmitt Trigger Inputs 0.05 VCC(2) –
VOL(1) Output Low-voltage 3mA sink current 0 0.4
tr
(1) Rise Time for both SDA and SCL 20 +
0.1Cb
(3)(2) 300
ns tof
(1) Output Fall Time from VIHmin to VILmax 10pF < Cb < 400pF(3) 20 +
0.1Cb
(3)(2) 250
tSP(1) Spikes Suppressed by Input Filter 0 50(2)
Ii Input Current each I/O Pin 0.1VCC < Vi
< 0.9VCC -10 10 µA
Ci
(1) Capacitance for each I/O Pin – 10 pF
fSCL SCL Clock Frequency fCK(4) > max(16fSCL,
250kHz)(5) 0 400 kHz
Rp Value of Pull-up resistor
fSCL ≤ 100kHz
fSCL > 100kHz
tHD;STA Hold Time (repeated) START Condition
fSCL ≤ 100kHz 4.0 –
µs
fSCL > 100kHz 0.6 –
tLOW Low Period of the SCL Clock
fSCL ≤ 100kHz(6) 4.7 –
fSCL > 100kHz(7) 1.3 –
tHIGH High period of the SCL clock
fSCL ≤ 100kHz 4.0 –
fSCL > 100kHz 0.6 –
tSU;STA Set-up time for a repeated START condition
fSCL ≤ 100kHz 4.7 –
fSCL > 100kHz 0.6 –
tHD;DAT Data hold time
fSCL ≤ 100kHz 0 3.45
fSCL > 100kHz 0 0.9
tSU;DAT Data setup time
fSCL ≤ 100kHz 250 –
fSCL > 100kHz 100 –
tSU;STO Setup time for STOP condition
fSCL ≤ 100kHz 4.0 –
fSCL > 100kHz 0.6 –
tBUF
Bus free time between a STOP and START
condition
fSCL ≤ 100kHz 4.7 –
fSCL > 100kHz 1.3 –
VCC – 0.4V
3mA ---------------------------- 1000ns
Cb
-------------------
Ω
VCC – 0.4V
3mA ---------------------------- 300 ns
Cb
-----------------375
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
5. This requirement applies to all ATmega640/1280/1281/2560/2561 2-wire Serial Interface operation. Other devices connected
to the 2-wire Serial Bus need only obey the general fSCL requirement.
6. The actual low period generated by the ATmega640/1280/1281/2560/2561 2-wire Serial Interface is (1/fSCL - 2/fCK), thus fCK
must be greater than 6MHz for the low time requirement to be strictly met at fSCL = 100kHz.
7. The actual low period generated by the ATmega640/1280/1281/2560/2561 2-wire Serial Interface is (1/fSCL - 2/fCK), thus the
low time requirement will not be strictly met for fSCL > 308kHz when fCK = 8MHz. Still, ATmega640/1280/1281/2560/2561
devices connected to the bus may communicate at full speed (400kHz) with other ATmega640/1280/1281/2560/2561
devices, as well as any other device with a proper tLOW acceptance margin.
Figure 31-6. 2-wire Serial Bus Timing
31.7 SPI Timing Characteristics
See Figure 31-7 on page 376 and Figure 31-8 on page 376 for details.
Note: 1. In SPI Programming mode the minimum SCK high/low period is:
- 2 tCLCL for fCK < 12MHz
- 3 tCLCL for fCK > 12MHz
t
SU;STA
t
LOW
t
HIGH
t
LOW
t
of
t
HD;STA t
HD;DAT t
SU;DAT t
SU;STO
t
BUF
SCL
SDA
t
r
Table 31-8. SPI Timing Parameters
Description Mode Min Typ Max
1 SCK period Master See Table 21-5 on
page 203
ns
2 SCK high/low Master 50% duty cycle
3 Rise/Fall time Master 3.6
4 Setup Master 10
5 Hold Master 10
6 Out to SCK Master 0.5 • tsck
7 SCK to out Master 10
8 SCK to out high Master 10
9 SS low to out Slave 15
10 SCK period Slave 4 • tck
11 SCK high/low(1) Slave 2 • tck
12 Rise/Fall time Slave 1600
13 Setup Slave 10
14 Hold Slave tck
15 SCK to out Slave 15
16 SCK to SS high Slave 20
17 SS high to tri-state Slave 10
18 SS low to SCK Slave 20376
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ATmega640/1280/1281/2560/2561
Figure 31-7. SPI Interface Timing Requirements (Master Mode)
Figure 31-8. SPI Interface Timing Requirements (Slave Mode)
MOSI
(Data Output)
SCK
(CPOL = 1)
MISO
(Data Input)
SCK
(CPOL = 0)
SS
MSB LSB
MSB LSB
...
...
6 1
2 2
4 5 3
7 8
MISO
(Data Output)
SCK
(CPOL = 1)
MOSI
(Data Input)
SCK
(CPOL = 0)
SS
MSB LSB
MSB LSB
...
...
10
11 11
13 14 12
15 17
9
X
16377
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ATmega640/1280/1281/2560/2561
31.8 ADC Characteristics – Preliminary Data
Note: 1. Values are guidelines only.
Table 31-9. ADC Characteristics, Singel Ended Channels
Symbol Parameter Condition Min(1) Typ(1) Max(1) Units
Resolution Single Ended Conversion 10 Bits
Absolute accuracy (Including
INL, DNL, quantization error,
gain and offset error)
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC= 200kHz
2.25 2.5
LSB
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC = 1MHz
3
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC = 200kHz
Noise Reduction Mode
2
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC = 1MHz
Noise Reduction Mode
3
Integral Non-Linearity (INL)
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC = 200kHz
1.25
Differential Non-Linearity (DNL)
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC = 200kHz
0.5
Gain Error
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC= 200kHz
2
Offset Error
Single Ended Conversion
VREF = 4V, VCC = 4V,
CLKADC = 200kHz
-2
Conversion Time Free Running Conversion 13 260 µs
Clock Frequency Single Ended Conversion 50 1000 kHz
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3
VREF Reference Voltage 1.0 AVCC V
VIN Input Voltage GND VREF
Input Bandwidth 38,5 kHz
VINT1 Internal Voltage Reference 1.1V 1.0 1.1 1.2
V
VINT2 Internal Voltage Reference 2.56V 2.4 2.56 2.8
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ378
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Table 31-10. ADC Characteristics, Differential Channels
Symbol Parameter Condition Min(1) Typ(1) Max(1) Units
Resolution
Gain = 1× 8
Gain = 10× 8 Bits
Gain = 200× 7
Absolute Accuracy(Including INL, DNL,
Quantization Error, Gain and Offset Error)
Gain = 1×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
18
LSB
Gain = 10×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
17
Gain = 200×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
9
Integral Non-Linearity (INL)
Gain = 1×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
2.5
Gain = 10×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
5
Gain = 200×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
9
Differential Non-Linearity (DNL)
Gain = 1×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
0.75
Gain = 10×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
1.5
Gain = 200×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
10
Gain Error
Gain = 1× 1.7
Gain = 10× 1.7 %
Gain = 200× 0.5
Offset Error
Gain = 1×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
2
LSB
Gain = 10×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
2
Gain = 200×
VREF = 4V, VCC = 5V
CLKADC = 50 - 200kHz
3
Clock Frequency 50 200 kHz
Conversion Time 65 260 µs379
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Note: Values are guidelines only.
31.9 External Data Memory Timing
Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1.
2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1.
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3
V
VREF Reference Voltage 2.7 AVCC - 0.5
VIN Input Voltage GND VCC
VDIFF Input Differential Voltage -VREF/Gain VREF/Gain
ADC Conversion Output -511 511 LSB
Input Bandwidth 4 kHz
VINT Internal Voltage Reference 2.3 2.56 2.8 V
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ
Table 31-11. External Data Memory Characteristics, 4.5 to 5.5 Volts, No Wait-state
Symbol Parameter
8MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
1 tLHLL ALE Pulse Width 115 1.0tCLCL-10
ns
2 tAVLL Address Valid A to ALE Low 57.5 0.5tCLCL-5(1)
3a tLLAX_ST
Address Hold After ALE Low,
write access 5 5
3b tLLAX_LD
Address Hold after ALE Low,
read access 5 5
4 tAVLLC Address Valid C to ALE Low 57.5 0.5tCLCL-5(1)
5 tAVRL Address Valid to RD Low 115 1.0tCLCL-10
6 tAVWL Address Valid to WR Low 115 1.0tCLCL-10
7 tLLWL ALE Low to WR Low 47.5 67.5 0.5tCLCL-15(2) 0.5tCLCL+5(2)
8 tLLRL ALE Low to RD Low 47.5 67.5 0.5tCLCL-15(2) 0.5tCLCL+5(2)
9 tDVRH Data Setup to RD High 40 40
10 tRLDV Read Low to Data Valid 75 1.0tCLCL-50
11 tRHDX Data Hold After RD High 0 0
12 tRLRH RD Pulse Width 115 1.0tCLCL-10
13 tDVWL Data Setup to WR Low 42.5 0.5tCLCL-20(1)
14 tWHDX Data Hold After WR High 115 1.0tCLCL-10
15 tDVWH Data Valid to WR High 125 1.0tCLCL
16 tWLWH WR Pulse Width 115 1.0tCLCL-10
Table 31-10. ADC Characteristics, Differential Channels (Continued)
Symbol Parameter Condition Min(1) Typ(1) Max(1) Units380
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Table 31-12. External Data Memory Characteristics, 4.5 to 5.5 Volts, 1 Cycle Wait-state
Symbol Parameter
8MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
10 tRLDV Read Low to Data Valid 200 2.0tCLCL-50
ns
12 tRLRH RD Pulse Width 240 2.0tCLCL-10
15 tDVWH Data Valid to WR High 240 2.0tCLCL
16 tWLWH WR Pulse Width 240 2.0tCLCL-10
Table 31-13. External Data Memory Characteristics, 4.5 to 5.5 Volts, SRWn1 = 1, SRWn0 = 0
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50
ns
12 tRLRH RD Pulse Width 365 3.0tCLCL-10
15 tDVWH Data Valid to WR High 375 3.0tCLCL
16 tWLWH WR Pulse Width 365 3.0tCLCL-10
Table 31-14. External Data Memory Characteristics, 4.5 to 5.5 Volts, SRWn1 = 1, SRWn0 = 1
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50
ns
12 tRLRH RD Pulse Width 365 3.0tCLCL-10
14 tWHDX Data Hold After WR High 240 2.0tCLCL-10
15 tDVWH Data Valid to WR High 375 3.0tCLCL
16 tWLWH WR Pulse Width 365 3.0tCLCL-10
Table 31-15. External Data Memory Characteristics, 2.7 to 5.5 Volts, No Wait-state
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz381
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1.
2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1.
1 tLHLL ALE Pulse Width 235 tCLCL-15
ns
2 tAVLL Address Valid A to ALE Low 115 0.5tCLCL-10(1)
3a tLLAX_ST
Address Hold After ALE Low,
write access 5 5
3b tLLAX_LD
Address Hold after ALE Low,
read access 5 5
4 tAVLLC Address Valid C to ALE Low 115 0.5tCLCL-10(1)
5 tAVRL Address Valid to RD Low 235 1.0tCLCL-15
6 tAVWL Address Valid to WR Low 235 1.0tCLCL-15
7 tLLWL ALE Low to WR Low 115 130 0.5tCLCL-10(2) 0.5tCLCL+5(2)
8 tLLRL ALE Low to RD Low 115 130 0.5tCLCL-10(2) 0.5tCLCL+5(2)
9 tDVRH Data Setup to RD High 45 45
10 tRLDV Read Low to Data Valid 190 1.0tCLCL-60
11 tRHDX Data Hold After RD High 0 0
12 tRLRH RD Pulse Width 235 1.0tCLCL-15
13 tDVWL Data Setup to WR Low 105 0.5tCLCL-20(1)
14 tWHDX Data Hold After WR High 235 1.0tCLCL-15
15 tDVWH Data Valid to WR High 250 1.0tCLCL
16 tWLWH WR Pulse Width 235 1.0tCLCL-15
Table 31-15. External Data Memory Characteristics, 2.7 to 5.5 Volts, No Wait-state (Continued)
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
Table 31-16. External Data Memory Characteristics, 2.7 to 5.5 Volts, SRWn1 = 0, SRWn0 = 1
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
10 tRLDV Read Low to Data Valid 440 2.0tCLCL-60
ns
12 tRLRH RD Pulse Width 485 2.0tCLCL-15
15 tDVWH Data Valid to WR High 500 2.0tCLCL
16 tWLWH WR Pulse Width 485 2.0tCLCL-15382
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 31-9. External Memory Timing (SRWn1 = 0, SRWn0 = 0
Table 31-17. External Data Memory Characteristics, 2.7 to 5.5 Volts, SRWn1 = 1, SRWn0 = 0
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60
ns
12 tRLRH RD Pulse Width 735 3.0tCLCL-15
15 tDVWH Data Valid to WR High 750 3.0tCLCL
16 tWLWH WR Pulse Width 735 3.0tCLCL-15
Table 31-18. External Data Memory Characteristics, 2.7 to 5.5 Volts, SRWn1 = 1, SRWn0 = 1
Symbol Parameter
4MHz Oscillator Variable Oscillator
Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60
ns
12 tRLRH RD Pulse Width 735 3.0tCLCL-15
14 tWHDX Data Hold After WR High 485 2.0tCLCL-15
15 tDVWH Data Valid to WR High 750 3.0tCLCL
16 tWLWH WR Pulse Width 735 3.0tCLCL-15
ALE
T1 T2 T3
Write Read
WR
T4
A15:8 Prev. addr. Address
DA7:0 Prev. data Address Data XX
RD
DA7:0 (XMBK = 0) Address Data
System Clock (CLKCPU)
1
4
2
7
6
3a
3b
5
8 12
16
13
10
11
14
15
9383
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 31-10. External Memory Timing (SRWn1 = 0, SRWn0 = 1)
Figure 31-11. External Memory Timing (SRWn1 = 1, SRWn0 = 0)
ALE
T1 T2 T3
Write Read
WR
T5
A15:8 Prev. addr. Address
DA7:0 Prev. data Address XX Data
RD
DA7:0 (XMBK = 0) Address Data
System Clock (CLKCPU)
1
4
2
7
6
3a
3b
5
8 12
16
13
10
11
14
15
9
T4
ALE
T1 T2 T3
Write Read
WR
T6
A15:8 Prev. addr. Address
DA7:0 Prev. data Address Data XX
RD
DA7:0 (XMBK = 0) Address Data
System Clock (CLKCPU)
1
4
2
7
6
3a
3b
5
8 12
16
13
10
11
14
15
9
T4 T5384
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 31-12. External Memory Timing (SRWn1 = 1, SRWn0 = 1)()
The ALE pulse in the last period (T4-T7) is only present if the next instruction accesses the RAM
(internal or external).
ALE
T1 T2 T3
Write Read
WR
T7
A15:8 Prev. addr. Address
DA7:0 Prev. data Address Data XX
RD
DA7:0 (XMBK = 0) Address Data
System Clock (CLKCPU)
1
4
2
7
6
3a
3b
5
8 12
16
13
10
11
14
15
9
T4 T5 T6385
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
32. Typical Characteristics
The following charts show typical behavior. These figures are not tested during manufacturing.
All current consumption measurements are performed with all I/O pins configured as inputs and
with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock
source.
All Active- and Idle current consumption measurements are done with all bits in the PRR registers
set and thus, the corresponding I/O modules are turned off. Also the Analog Comparator is
disabled during these measurements. Table 32-1 on page 390 and Table 32-2 on page 391
show the additional current consumption compared to ICC Active and ICC Idle for every I/O module
controlled by the Power Reduction Register. See “Power Reduction Register” on page 54 for
details.
The power consumption in Power-down mode is independent of clock selection.
The current consumption is a function of several factors such as: operating voltage, operating
frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature.
The dominating factors are operating voltage and frequency.
The current drawn from capacitive loaded pins may be estimated (for one pin) as CL × VCC × f
where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O
pin.
The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to
function properly at frequencies higher than the ordering code indicates.
The difference between current consumption in Power-down mode with Watchdog Timer
enabled and Power-down mode with Watchdog Timer disabled represents the differential current
drawn by the Watchdog Timer.
32.1 Active Supply Current
Figure 32-1. Active Supply Current vs. frequency (0.1MHz - 1.0MHz)
5.5V
5.0V
4.5V
4.0V
3.3V
2.7V
1.8V
0
0.5
1
1.5
2
2.5
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
ICC (m
A)386
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-2. Active Supply Current vs. Frequency (1MHz - 16MHz)
Figure 32-3. Active Supply Current vs. VCC (Internal RC Oscillator, 8MHz)
5.5V
5.0V
4.5V
0
5
10
15
20
25
0246 8 10 12 14 16
Frequency (MHz)
ICC (m A)
4.0V
3.3V
2.7V
1.8V
85°C
25°C
-40°C
0
2
4
6
8
10
12
14
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)387
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1MHz)
Figure 32-5. Active Supply Current vs. VCC (Internal RC Oscillator, 128kHz)
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)
85°C
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)388
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
32.2 Idle Supply Current
Figure 32-6. Idle Supply Current vs. Low Frequency (0.1MHz - 1.0MHz)
Figure 32-7. Idle Supply Current vs. Frequency (1MHz - 16MHz)
5.5V
5.0V
4.5V
4.0V
3.3V
2.7V
1.8V
0
0.1
0.2
0.3
0.4
0.5
0.6
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
ICC (mA)
5.5V
5.0V
4.5V
0
1
2
3
4
5
6
7
8
0246 8 10 12 14 16
Frequency (MHz)
ICC (mA)
4.0V
3.3V
2.7V
1.8V389
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 8MHz)
Figure 32-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 1MHz)
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
3
3.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)
85°C
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)390
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 128kHz)I
32.2.1 Supply Current of IO modules
The tables and formulas below can be used to calculate the additional current consumption for
the different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modules
are controlled by the Power Reduction Register. See “Power Reduction Register” on page 54 for
details.
85°C
25°C
-40°C
0
0.05
0.1
0.15
0.2
0.25
0.3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (m A )
Table 32-1. Additional Current Consumption for the different I/O modules (absolute values)
PRR bit Typical numbers
VCC = 2V, F = 1MHz VCC = 3V, F = 4MHz VCC = 5V, F = 8MHz
PRUSART3 8.0µA 51µA 220µA
PRUSART2 8.0µA 51µA 220µA
PRUSART1 8.0µA 51µA 220µA
PRUSART0 8.0µA 51µA 220µA
PRTWI 12µA 75µA 315µA
PRTIM5 6.0µA 39µA 150µA
PRTIM4 6.0µA 39µA 150µA
PRTIM3 6.0µA 39µA 150µA
PRTIM2 11µA 72µA 300µA
PRTIM1 6.0µA 39µA 150µA
PRTIM0 4.0µA 24µA 100µA
PRSPI 15µA 95µA 400µA
PRADC 12µA 75µA 315µA391
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
It is possible to calculate the typical current consumption based on the numbers from Table 32-1
on page 390 for other VCC and frequency settings than listed in Table 32-2.
32.2.1.1 Example 1
Calculate the expected current consumption in idle mode with USART0, TIMER1, and TWI
enabled at VCC = 2.0V and F = 1MHz. From Table 32-2, third column, we see that we need to
add 17% for the USART0, 24% for the TWI, and 10% for the TIMER1 module. Reading from Figure
32-6 on page 388, we find that the idle current consumption is ~0.15mA at VCC = 2.0V and F
= 1MHz. The total current consumption in idle mode with USART0, TIMER1, and TWI enabled,
gives:
Table 32-2. Additional Current Consumption (percentage) in Active and Idle mode
PRR bit
Additional Current consumption
compared to Active with external clock
Additional Current consumption
compared to Idle with external clock
PRUSART3 3.0% 17%
PRUSART2 3.0% 17%
PRUSART1 3.0% 17%
PRUSART0 3.0% 17%
PRTWI 4.4% 24%
PRTIM5 1.8% 10%
PRTIM4 1.8% 10%
PRTIM3 1.8% 10%
PRTIM2 4.3% 23%
PRTIM1 1.8% 10%
PRTIM0 1.5% 8.0%
PRSPI 3.3% 18%
PRADC 4.5% 24%
ICCtotal ≈ ≈ 0.15mA • ( ) 1 0.17 0.24 0.10 +++ 0.227mA392
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
32.3 Power-down Supply Current
Figure 32-11. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)
Figure 32-12. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
3
3.5
4
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)
25°C
-40°C
0
2
4
6
8
10
12
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)
85°C393
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
32.4 Power-save Supply Current
Figure 32-13. Power-save Supply Current vs. VCC (Watchdog Timer Disabled)
Figure 32-14. Power-save Supply Current vs. VCC (Watchdog Timer Enabled)
25°C
4
5
6
7
8
9
10
11
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC(µA)
0
1
2
3
4
5
6
7
8
9
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)
25°C394
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
32.5 Standby Supply Current
Figure 32-15. Standby Supply Current vs. VCC (Watchdog Timer Disabled)
32.6 Pin Pull-up
Figure 32-16. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 1.8V)
6MHz xtal
6MHz res
4MHz xtal
4MHz res
455kHz res
32kHz xtal
2MHz xtal
2MHz res
1MHz res
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)
85°C
25°C
-40°C 0
10
20
30
40
50
60
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOP (V)
IOP (µA)395
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-17. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V)
Figure 32-18. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)
85°C
25°C
0 -40°C
10
20
30
40
50
60
70
80
90
0 0.5 1 1.5 2 2.5 3
VOP (V)
IOP (µA)
85°C
25°C
0 -40°C
20
40
60
80
100
120
140
160
0123456
VOP (V)
IOP (µA)396
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-19. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V)
Figure 32-20. Reset pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V)
85°C
25°C
-40°C
0
5
10
15
20
25
30
35
40
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VRESET (V)
IRESET (µA)
85°C
25°C
-40°C
0
10
20
30
40
50
60
70
0 0.5 1 1.5 2 2.5 3
VRESET (V)
IRESET (µA)397
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-21. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V)
32.7 Pin Driver Strength
Figure 32-22. I/O Pin output Voltage vs.Sink Current (VCC = 3V)
85°C
25°C
-40°C
0
20
40
60
80
100
120
0123 456
VRESET (V)
IRESET (µA)
85°C
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 5 10 15 20 25
IOL (mA)
VOL (V)398
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-23. I/O Pin Output Voltage vs. Sink Current (VCC = 5V)
Figure 32-24. I/O Pin Output Voltage vs. Source Current (VCC = 3V)
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0 5 10 15 20 25
IOL (mA)
VOL (V)
85°C
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
3
3.5
0 5 10 15 20 25
IOH (mA)
VOH (V)399
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-25. I/O Pin Output Voltage vs. Source Current (VCC = 5V)
32.8 Pin Threshold and Hysteresis
Figure 32-26. I/O Pin Input Threshold Voltage vs. VCC (VIH, IO Pin Read as “1“)
85°C
25°C
-40°C
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5
5.1
0 5 10 15 20 25
IOH (mA)
VOH (V)
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
3
3.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)400
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-27. I/O Pin Input Threshold Voltage vs. VCC (VIL, IO Pin Read as “0“)
Figure 32-28. I/O Pin Input Hysteresis
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)
85°C
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Input Hysteresis (mV)401
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-29. Reset Input Threshold Voltage vs. VCC (VIH, IO Pin Read as “1“)
Figure 32-30. Reset Input Threshold Voltage vs. VCC (VIL, IO Pin Read as “0“)
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)
85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Threshold (V)402
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-31. Reset Pin Input Hysteresis vs. VCC
32.9 BOD Threshold and Analog Comparator Offset
Figure 32-32. BOD Threshold vs. Temperature (BOD Level is 4.3V)
85°C
25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Input Hysteresis (mV)
Rising Vcc
Falling Vcc
4.2
4.25
4.3
4.35
4.4
-60 -40 -20 0 20 40 60 80 100
Temperature (°C)
Threshold (V)403
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-33. BOD Threshold vs. Temperature (BOD Level is 2.7V)
Figure 32-34. BOD Threshold vs. Temperature (BOD Level is 1.8V)
Rising Vcc
Falling Vcc
2.6
2.65
2.7
2.75
2.8
-60 -40 -20 0 20 40 60 80 100
Temperature (°C)
Threshold (V)
Rising Vcc
Fallling Vcc
1.7
1.75
1.8
1.85
1.9
-60 -40 -20 0 20 40 60 80 100
Temperature (°C)
T hre shold (V )404
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
32.10 Internal Oscillator Speed
Figure 32-35. Watchdog Oscillator Frequency vs. VCC
Figure 32-36. Watchdog Oscillator Frequency vs. Temperature
85°C
25°C
-40°C
114
116
118
120
122
124
126
128
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FRC (kHz)
5.5V
4.0V
3.3V
2.7V
2.1V
114
116
118
120
122
124
126
128
-60 -40 -20 0 20 40 60 80 100
Temperature (°C)
FRC (kHz)405
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-37. Calibrated 8MHz RC Oscillator Frequency vs. VCC
Figure 32-38. Calibrated 8MHz RC Oscillator Frequency vs. Temperature
85°C
25°C
-40°C
7.6
7.7
7.8
7.9
8
8.1
8.2
8.3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FRC (MHz)
5.0V
3.0V
7.9
8
8.1
8.2
8.3
8.4
8.5
-60 -40 -20 0 20 40 60 80 100
Temperature (°C)
FRC (MHz)406
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-39. Calibrated 8MHz RC Oscillator Frequency vs. Osccal Value
32.11 Current Consumption of Peripheral Units
Figure 32-40. Brownout Detector Current vs. VCC
85°C
25°C
-40°C
0
2
4
6
8
10
12
14
16
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256
OSCCAL (X1)
FRC (MHz)
85°C
25°C
-40°C
0
5
10
15
20
25
30
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)407
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-41. ADC Current vs. VCC (AREF = AVCC)
Figure 32-42. AREF External Reference Current vs. VCC
85°C
25°C
-40°C
0
50
100
150
200
250
300
350
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)
85°C
25°C
-40°C
0
50
100
150
200
250
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)408
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-43. Watchdog Timer Current vs. VCC
Figure 32-44. Analog Comparator Current vs. VCC
85°C
25°C
-40°C
0
1
2
3
4
5
6
7
8
9
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)
85°C
25°C
-40°C
0
10
20
30
40
50
60
70
80
90
100
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (µA)409
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-45. Programming Current vs. VCC
32.12 Current Consumption in Reset and Reset Pulsewidth
Figure 32-46. Reset Supply Current vs VCC (0.1MHz - 1.0MHz, Excluding Current Through The
Reset Pull-up)
85°C
25°C
-40°C
0
2
4
6
8
10
12
14
16
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
ICC (mA)
5.5V
5.0V
4.5V
4.0V
3.3V
2.7V
1.8V
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
ICC (mA)410
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 32-47. Reset Supply Current vs. VCC (1MHz - 16MHz, Excluding Current Through The
Reset Pull-up)
Figure 32-48. Minimum Reset Pulse Width vs. VCC
5.5V
5.0V
4.5V
0
0.5
1
1.5
2
2.5
3
3.5
4
0246 8 10 12 14 16
Frequency (MHz)
ICC (mA)
4.0V
3.3V
2.7V
1.8V
85°C
25°C
-40°C
0
500
1000
1500
2000
2500
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Pu lsewidth (ns)411
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
33. Register Summary
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
(0x1FF) Reserved - - - - - - - -
... Reserved - - - - - - - -
(0x13F) Reserved
(0x13E) Reserved
(0x13D) Reserved
(0x13C) Reserved
(0x13B) Reserved
(0x13A) Reserved
(0x139) Reserved
(0x138) Reserved
(0x137) Reserved
(0x136) UDR3 USART3 I/O Data Register 222
(0x135) UBRR3H - - - - USART3 Baud Rate Register High Byte 227
(0x134) UBRR3L USART3 Baud Rate Register Low Byte 227
(0x133) Reserved - - - - - - - -
(0x132) UCSR3C UMSEL31 UMSEL30 UPM31 UPM30 USBS3 UCSZ31 UCSZ30 UCPOL3 239
(0x131) UCSR3B RXCIE3 TXCIE3 UDRIE3 RXEN3 TXEN3 UCSZ32 RXB83 TXB83 238
(0x130) UCSR3A RXC3 TXC3 UDRE3 FE3 DOR3 UPE3 U2X3 MPCM3 238
(0x12F) Reserved - - - - - - - -
(0x12E) Reserved - - - - - - - -
(0x12D) OCR5CH Timer/Counter5 - Output Compare Register C High Byte 165
(0x12C) OCR5CL Timer/Counter5 - Output Compare Register C Low Byte 165
(0x12B) OCR5BH Timer/Counter5 - Output Compare Register B High Byte 165
(0x12A) OCR5BL Timer/Counter5 - Output Compare Register B Low Byte 165
(0x129) OCR5AH Timer/Counter5 - Output Compare Register A High Byte 164
(0x128) OCR5AL Timer/Counter5 - Output Compare Register A Low Byte 164
(0x127) ICR5H Timer/Counter5 - Input Capture Register High Byte 165
(0x126) ICR5L Timer/Counter5 - Input Capture Register Low Byte 165
(0x125) TCNT5H Timer/Counter5 - Counter Register High Byte 163
(0x124) TCNT5L Timer/Counter5 - Counter Register Low Byte 163
(0x123) Reserved - - - - - - - -
(0x122) TCCR5C FOC5A FOC5B FOC5C - - - - - 162
(0x121) TCCR5B ICNC5 ICES5 - WGM53 WGM52 CS52 CS51 CS50 160
(0x120) TCCR5A COM5A1 COM5A0 COM5B1 COM5B0 COM5C1 COM5C0 WGM51 WGM50 158
(0x11F) Reserved - - - - - - - -
(0x11E) Reserved - - - - - - - -
(0x11D) Reserved - - - - - - - -
(0x11C) Reserved - - - - - - - -
(0x11B) Reserved - - - - - - - -
(0x11A) Reserved - - - - - - - -
(0x119) Reserved - - - - - - - -
(0x118) Reserved - - - - - - - -
(0x117) Reserved - - - - - - - -
(0x116) Reserved - - - - - - - -
(0x115) Reserved - - - - - - - -
(0x114) Reserved - - - - - - - -
(0x113) Reserved - - - - - - - -
(0x112) Reserved - - - - - - - -
(0x111) Reserved - - - - - - - -
(0x110) Reserved - - - - - - - -
(0x10F) Reserved - - - - - - - -
(0x10E) Reserved - - - - - - - -
(0x10D) Reserved - - - - - - - -
(0x10C) Reserved - - - - - - - -
(0x10B) PORTL PORTL7 PORTL6 PORTL5 PORTL4 PORTL3 PORTL2 PORTL1 PORTL0 104
(0x10A) DDRL DDL7 DDL6 DDL5 DDL4 DDL3 DDL2 DDL1 DDL0 104
(0x109) PINL PINL7 PINL6 PINL5 PINL4 PINL3 PINL2 PINL1 PINL0 104
(0x108) PORTK PORTK7 PORTK6 PORTK5 PORTK4 PORTK3 PORTK2 PORTK1 PORTK0 103
(0x107) DDRK DDK7 DDK6 DDK5 DDK4 DDK3 DDK2 DDK1 DDK0 103
(0x106) PINK PINK7 PINK6 PINK5 PINK4 PINK3 PINK2 PINK1 PINK0 103
(0x105) PORTJ PORTJ7 PORTJ6 PORTJ5 PORTJ4 PORTJ3 PORTJ2 PORTJ1 PORTJ0 103
(0x104) DDRJ DDJ7 DDJ6 DDJ5 DDJ4 DDJ3 DDJ2 DDJ1 DDJ0 103
(0x103) PINJ PINJ7 PINJ6 PINJ5 PINJ4 PINJ3 PINJ2 PINJ1 PINJ0 103
(0x102) PORTH PORTH7 PORTH6 PORTH5 PORTH4 PORTH3 PORTH2 PORTH1 PORTH0 102
(0x101) DDRH DDH7 DDH6 DDH5 DDH4 DDH3 DDH2 DDH1 DDH0 103412
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
(0x100) PINH PINH7 PINH6 PINH5 PINH4 PINH3 PINH2 PINH1 PINH0 103
(0xFF) Reserved - - - - - - - -
(0xFE) Reserved - - - - - - - -
(0xFD) Reserved - - - - - - - -
(0xFC) Reserved - - - - - - - -
(0xFB) Reserved - - - - - - - -
(0xFA) Reserved - - - - - - - -
(0xF9) Reserved - - - - - - - -
(0xF8) Reserved - - - - - - - -
(0xF7) Reserved - - - - - - - -
(0xF6) Reserved - - - - - - - -
(0xF5) Reserved - - - - - - - -
(0xF4) Reserved - - - - - - - -
(0xF3) Reserved - - - - - - - -
(0xF2) Reserved - - - - - - - -
(0xF1) Reserved - - - - - - - -
(0xF0) Reserved - - - - - - - -
(0xEF) Reserved - - - - - - - -
(0xEE) Reserved - - - - - - - -
(0xED) Reserved - - - - - - - -
(0xEC) Reserved - - - - - - - -
(0xEB) Reserved - - - - - - -
(0xEA) Reserved - - - - - - - -
(0xE9) Reserved - - - - - - - -
(0xE8) Reserved - - - - - - - -
(0xE7) Reserved - - - - - - -
(0xE6) Reserved - - - - - - - -
(0xE5) Reserved - - - - - - - -
(0xE4) Reserved - - - - - - - -
(0xE3) Reserved - - - - - - -
(0xE2) Reserved - - - - - - - -
(0xE1) Reserved - - - - - - -
(0xE0) Reserved - - - - - - -
(0xDF) Reserved - - - - - - - -
(0xDE) Reserved - - - - - - - -
(0xDD) Reserved - - - - - - -
(0xDC) Reserved - - - - - - - -
(0xDB) Reserved - - - - - - - -
(0xDA) Reserved - - - - - - - -
(0xD9) Reserved - - - - - - -
(0xD8) Reserved - - - - - - - -
(0xD7) Reserved - - - - - - - -
(0xD6) UDR2 USART2 I/O Data Register 222
(0xD5) UBRR2H - - - - USART2 Baud Rate Register High Byte 227
(0xD4) UBRR2L USART2 Baud Rate Register Low Byte 227
(0xD3) Reserved - - - - - - - -
(0xD2) UCSR2C UMSEL21 UMSEL20 UPM21 UPM20 USBS2 UCSZ21 UCSZ20 UCPOL2 239
(0xD1) UCSR2B RXCIE2 TXCIE2 UDRIE2 RXEN2 TXEN2 UCSZ22 RXB82 TXB82 238
(0xD0) UCSR2A RXC2 TXC2 UDRE2 FE2 DOR2 UPE2 U2X2 MPCM2 238
(0xCF) Reserved - - - - - - - -
(0xCE) UDR1 USART1 I/O Data Register 222
(0xCD) UBRR1H - - - - USART1 Baud Rate Register High Byte 227
(0xCC) UBRR1L USART1 Baud Rate Register Low Byte 227
(0xCB) Reserved - - - - - - - -
(0xCA) UCSR1C UMSEL11 UMSEL10 UPM11 UPM10 USBS1 UCSZ11 UCSZ10 UCPOL1 239
(0xC9) UCSR1B RXCIE1 TXCIE1 UDRIE1 RXEN1 TXEN1 UCSZ12 RXB81 TXB81 238
(0xC8) UCSR1A RXC1 TXC1 UDRE1 FE1 DOR1 UPE1 U2X1 MPCM1 238
(0xC7) Reserved - - - - - - - -
(0xC6) UDR0 USART0 I/O Data Register 222
(0xC5) UBRR0H - - - - USART0 Baud Rate Register High Byte 227
(0xC4) UBRR0L USART0 Baud Rate Register Low Byte 227
(0xC3) Reserved - - - - - - - -
(0xC2) UCSR0C UMSEL01 UMSEL00 UPM01 UPM00 USBS0 UCSZ01 UCSZ00 UCPOL0 239
(0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 238
(0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 238
(0xBF) Reserved - - - - - - - -
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page413
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
(0xBE) Reserved - - - - - - - -
(0xBD) TWAMR TWAM6 TWAM5 TWAM4 TWAM3 TWAM2 TWAM1 TWAM0 - 269
(0xBC) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN - TWIE 266
(0xBB) TWDR 2-wire Serial Interface Data Register 268
(0xBA) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE 269
(0xB9) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 - TWPS1 TWPS0 268
(0xB8) TWBR 2-wire Serial Interface Bit Rate Register 266
(0xB7) Reserved - - - - - - - -
(0xB6) ASSR - EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB 184
(0xB5) Reserved - - - - - - - -
(0xB4) OCR2B Timer/Counter2 Output Compare Register B 191
(0xB3) OCR2A Timer/Counter2 Output Compare Register A 191
(0xB2) TCNT2 Timer/Counter2 (8 Bit) 191
(0xB1) TCCR2B FOC2A FOC2B - - WGM22 CS22 CS21 CS20 190
(0xB0) TCCR2A COM2A1 COM2A0 COM2B1 COM2B0 - - WGM21 WGM20 191
(0xAF) Reserved - - - - - - - -
(0xAE) Reserved - - - - - - - -
(0xAD) OCR4CH Timer/Counter4 - Output Compare Register C High Byte 164
(0xAC) OCR4CL Timer/Counter4 - Output Compare Register C Low Byte 164
(0xAB) OCR4BH Timer/Counter4 - Output Compare Register B High Byte 164
(0xAA) OCR4BL Timer/Counter4 - Output Compare Register B Low Byte 164
(0xA9) OCR4AH Timer/Counter4 - Output Compare Register A High Byte 164
(0xA8) OCR4AL Timer/Counter4 - Output Compare Register A Low Byte 164
(0xA7) ICR4H Timer/Counter4 - Input Capture Register High Byte 165
(0xA6) ICR4L Timer/Counter4 - Input Capture Register Low Byte 165
(0xA5) TCNT4H Timer/Counter4 - Counter Register High Byte 163
(0xA4) TCNT4L Timer/Counter4 - Counter Register Low Byte 163
(0xA3) Reserved - - - - - - - -
(0xA2) TCCR4C FOC4A FOC4B FOC4C - - - - - 162
(0xA1) TCCR4B ICNC4 ICES4 - WGM43 WGM42 CS42 CS41 CS40 160
(0xA0) TCCR4A COM4A1 COM4A0 COM4B1 COM4B0 COM4C1 COM4C0 WGM41 WGM40 158
(0x9F) Reserved - - - - - - - -
(0x9E) Reserved - - - - - - - -
(0x9D) OCR3CH Timer/Counter3 - Output Compare Register C High Byte 164
(0x9C) OCR3CL Timer/Counter3 - Output Compare Register C Low Byte 164
(0x9B) OCR3BH Timer/Counter3 - Output Compare Register B High Byte 164
(0x9A) OCR3BL Timer/Counter3 - Output Compare Register B Low Byte 164
(0x99) OCR3AH Timer/Counter3 - Output Compare Register A High Byte 163
(0x98) OCR3AL Timer/Counter3 - Output Compare Register A Low Byte 163
(0x97) ICR3H Timer/Counter3 - Input Capture Register High Byte 165
(0x96) ICR3L Timer/Counter3 - Input Capture Register Low Byte 165
(0x95) TCNT3H Timer/Counter3 - Counter Register High Byte 162
(0x94) TCNT3L Timer/Counter3 - Counter Register Low Byte 162
(0x93) Reserved - - - - - - - -
(0x92) TCCR3C FOC3A FOC3B FOC3C - - - - - 162
(0x91) TCCR3B ICNC3 ICES3 - WGM33 WGM32 CS32 CS31 CS30 160
(0x90) TCCR3A COM3A1 COM3A0 COM3B1 COM3B0 COM3C1 COM3C0 WGM31 WGM30 158
(0x8F) Reserved - - - - - - - -
(0x8E) Reserved - - - - - - - -
(0x8D) OCR1CH Timer/Counter1 - Output Compare Register C High Byte 163
(0x8C) OCR1CL Timer/Counter1 - Output Compare Register C Low Byte 163
(0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte 163
(0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte 163
(0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte 163
(0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte 163
(0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte 165
(0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte 165
(0x85) TCNT1H Timer/Counter1 - Counter Register High Byte 162
(0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte 162
(0x83) Reserved - - - - - - - -
(0x82) TCCR1C FOC1A FOC1B FOC1C - - - - - 161
(0x81) TCCR1B ICNC1 ICES1 - WGM13 WGM12 CS12 CS11 CS10 160
(0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 COM1C1 COM1C0 WGM11 WGM10 158
(0x7F) DIDR1 - - - - - - AIN1D AIN0D 274
(0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D 295
(0x7D) DIDR2 ADC15D ADC14D ADC13D ADC12D ADC11D ADC10D ADC9D ADC8D 295
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page414
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
(0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 289
(0x7B) ADCSRB - ACME - - MUX5 ADTS2 ADTS1 ADTS0 272, 290, 294
(0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 292
(0x79) ADCH ADC Data Register High byte 294
(0x78) ADCL ADC Data Register Low byte 294
(0x77) Reserved - - - - - - - -
(0x76) Reserved - - - - - - - -
(0x75) XMCRB XMBK - - - - XMM2 XMM1 XMM0 38
(0x74) XMCRA SRE SRL2 SRL1 SRL0 SRW11 SRW10 SRW01 SRW00 37
(0x73) TIMSK5 - - ICIE5 - OCIE5C OCIE5B OCIE5A TOIE5 166
(0x72) TIMSK4 - - ICIE4 - OCIE4C OCIE4B OCIE4A TOIE4 166
(0x71) TIMSK3 - - ICIE3 - OCIE3C OCIE3B OCIE3A TOIE3 166
(0x70) TIMSK2 - - - - - OCIE2B OCIE2A TOIE2 193
(0x6F) TIMSK1 - - ICIE1 - OCIE1C OCIE1B OCIE1A TOIE1 166
(0x6E) TIMSK0 - - - - - OCIE0B OCIE0A TOIE0 134
(0x6D) PCMSK2 PCINT23 PCINT22 PCINT21 PCINT20 PCINT19 PCINT18 PCINT17 PCINT16 116
(0x6C) PCMSK1 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 116
(0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 117
(0x6A) EICRB ISC71 ISC70 ISC61 ISC60 ISC51 ISC50 ISC41 ISC40 114
(0x69) EICRA ISC31 ISC30 ISC21 ISC20 ISC11 ISC10 ISC01 ISC00 113
(0x68) PCICR - - - - - PCIE2 PCIE1 PCIE0 115
(0x67) Reserved - - - - - - - -
(0x66) OSCCAL Oscillator Calibration Register 50
(0x65) PRR1 - - PRTIM5 PRTIM4 PRTIM3 PRUSART3 PRUSART2 PRUSART1 57
(0x64) PRR0 PRTWI PRTIM2 PRTIM0 - PRTIM1 PRSPI PRUSART0 PRADC 56
(0x63) Reserved - - - - - - - -
(0x62) Reserved - - - - - - - -
(0x61) CLKPR CLKPCE - - - CLKPS3 CLKPS2 CLKPS1 CLKPS0 50
(0x60) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 67
0x3F (0x5F) SREG I T H S V N Z C 14
0x3E (0x5E) SPH SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 16
0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 16
0x3C (0x5C) EIND - - - - - - - EIND0 17
0x3B (0x5B) RAMPZ - - - - - - RAMPZ1 RAMPZ0 17
0x3A (0x5A) Reserved - - - - - - - -
0x39 (0x59) Reserved - - - - - - - -
0x38 (0x58) Reserved - - - - - - - -
0x37 (0x57) SPMCSR SPMIE RWWSB SIGRD RWWSRE BLBSET PGWRT PGERS SPMEN 332
0x36 (0x56) Reserved - - - - - - - -
0x35 (0x55) MCUCR JTD - - PUD - - IVSEL IVCE 67, 110, 100, 308
0x34 (0x54) MCUSR - - - JTRF WDRF BORF EXTRF PORF 308
0x33 (0x53) SMCR - - - - SM2 SM1 SM0 SE 52
0x32 (0x52) Reserved - - - - - - - -
0x31 (0x51) OCDR OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 301
0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 272
0x2F (0x4F) Reserved - - - - - - - -
0x2E (0x4E) SPDR SPI Data Register 204
0x2D (0x4D) SPSR SPIF WCOL - - - - - SPI2X 203
0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 202
0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 37
0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 37
0x29 (0x49) Reserved - - - - - - - -
0x28 (0x48) OCR0B Timer/Counter0 Output Compare Register B 133
0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A 133
0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) 133
0x25 (0x45) TCCR0B FOC0A FOC0B - - WGM02 CS02 CS01 CS00 132
0x24 (0x44) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 - - WGM01 WGM00 129
0x23 (0x43) GTCCR TSM - - - - - PSRASY PSRSYNC 170, 194
0x22 (0x42) EEARH - - - - EEPROM Address Register High Byte 35
0x21 (0x41) EEARL EEPROM Address Register Low Byte 35
0x20 (0x40) EEDR EEPROM Data Register 35
0x1F (0x3F) EECR - - EEPM1 EEPM0 EERIE EEMPE EEPE EERE 35
0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 37
0x1D (0x3D) EIMSK INT7 INT6 INT5 INT4 INT3 INT2 INT1 INT0 115
0x1C (0x3C) EIFR INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 INTF0 115
0x1B (0x3B) PCIFR - - - - - PCIF2 PCIF1 PCIF0 116
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page415
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these registers,
the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the status flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on
all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions
work with registers 0x00 to 0x1F only.
4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O registers
as data space using LD and ST instructions, $20 must be added to these addresses. The
ATmega640/1280/1281/2560/2561 is a complex microcontroller with more peripheral units than can be supported within the
64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from $60 - $1FF in SRAM, only
the ST/STS/STD and LD/LDS/LDD instructions can be used.
0x1A (0x3A) TIFR5 - - ICF5 - OCF5C OCF5B OCF5A TOV5 166
0x19 (0x39) TIFR4 - - ICF4 - OCF4C OCF4B OCF4A TOV4 167
0x18 (0x38) TIFR3 - - ICF3 - OCF3C OCF3B OCF3A TOV3 167
0x17 (0x37) TIFR2 - - - - - OCF2B OCF2A TOV2 193
0x16 (0x36) TIFR1 - - ICF1 - OCF1C OCF1B OCF1A TOV1 167
0x15 (0x35) TIFR0 - - - - - OCF0B OCF0A TOV0 134
0x14 (0x34) PORTG - - PORTG5 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 102
0x13 (0x33) DDRG - - DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 102
0x12 (0x32) PING - - PING5 PING4 PING3 PING2 PING1 PING0 102
0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 101
0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 102
0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 102
0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 101
0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 101
0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 102
0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 101
0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 101
0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 101
0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 101
0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 101
0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 101
0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 100
0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 100
0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 100
0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 100
0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 100
0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 100
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page416
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
34. Instruction Set Summary
Mnemonics Operands Description Operation Flags #Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z, C, N, V, H 1
ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z, C, N, V, H 1
ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z, C, N, V, S 2
SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z, C, N, V, H 1
SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z, C, N, V, H 1
SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z, C, N, V, H 1
SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z, C, N, V, H 1
SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z, C, N, V, S 2
AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z, N, V 1
ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z, N, V 1
OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z, N, V 1
ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z, N, V 1
EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z, N, V 1
COM Rd One’s Complement Rd ← 0xFF − Rd Z, C, N, V 1
NEG Rd Two’s Complement Rd ← 0x00 − Rd Z, C, N, V, H 1
SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z, N, V 1
CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z, N, V 1
INC Rd Increment Rd ← Rd + 1 Z, N, V 1
DEC Rd Decrement Rd ← Rd − 1 Z, N, V 1
TST Rd Test for Zero or Minus Rd ← Rd • Rd Z, N, V 1
CLR Rd Clear Register Rd ← Rd ⊕ Rd Z, N, V 1
SER Rd Set Register Rd ← 0xFF None 1
MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z, C 2
MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z, C 2
MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z, C 2
FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z, C 2
FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z, C 2
FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z, C 2
BRANCH INSTRUCTIONS
RJMP k Relative Jump PC ← PC + k + 1 None 2
IJMP Indirect Jump to (Z) PC ← Z None 2
EIJMP Extended Indirect Jump to (Z) PC ←(EIND:Z) None 2
JMP k Direct Jump PC ← k None 3
RCALL k Relative Subroutine Call PC ← PC + k + 1 None 4
ICALL Indirect Call to (Z) PC ← Z None 4
EICALL Extended Indirect Call to (Z) PC ←(EIND:Z) None 4
CALL k Direct Subroutine Call PC ← k None 5
RET Subroutine Return PC ← STACK None 5
RETI Interrupt Return PC ← STACK I 5
CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3
CP Rd,Rr Compare Rd − Rr Z, N, V, C, H 1
CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N, V, C, H 1
CPI Rd,K Compare Register with Immediate Rd − K Z, N, V, C, H 1
SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3
SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3
SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3
SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3
BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2
BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2
BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2
BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2
BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2
BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2
BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2
BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2
BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2
BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2
BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2
BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2
BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2
BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2
BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2
BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2417
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2
BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2
BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2
BIT AND BIT-TEST INSTRUCTIONS
SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2
CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2
LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z, C, N, V 1
LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z, C, N, V 1
ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z, C, N, V 1
ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z, C, N, V 1
ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z, C, N, V 1
SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1
BSET s Flag Set SREG(s) ← 1 SREG(s) 1
BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1
BST Rr, b Bit Store from Register to T T ← Rr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) ← T None 1
SEC Set Carry C ← 1 C1
CLC Clear Carry C ← 0 C 1
SEN Set Negative Flag N ← 1 N 1
CLN Clear Negative Flag N ← 0 N 1
SEZ Set Zero Flag Z ← 1 Z1
CLZ Clear Zero Flag Z ← 0 Z 1
SEI Global Interrupt Enable I ← 1 I1
CLI Global Interrupt Disable I ← 0 I 1
SES Set Signed Test Flag S ← 1 S1
CLS Clear Signed Test Flag S ← 0 S 1
SEV Set Twos Complement Overflow. V ← 1 V1
CLV Clear Twos Complement Overflow V ← 0 V 1
SET Set T in SREG T ← 1 T1
CLT Clear T in SREG T ← 0 T 1
SEH Set Half Carry Flag in SREG H ← 1 H1
CLH Clear Half Carry Flag in SREG H ← 0 H 1
DATA TRANSFER INSTRUCTIONS
MOV Rd, Rr Move Between Registers Rd ← Rr None 1
MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1
LDI Rd, K Load Immediate Rd ← K None 1
LD Rd, X Load Indirect Rd ← (X) None 2
LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2
LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2
LD Rd, Y Load Indirect Rd ← (Y) None 2
LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2
LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2
LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2
LD Rd, Z Load Indirect Rd ← (Z) None 2
LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2
LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2
LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2
LDS Rd, k Load Direct from SRAM Rd ← (k) None 2
ST X, Rr Store Indirect (X) ← Rr None 2
ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2
ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2
ST Y, Rr Store Indirect (Y) ← Rr None 2
ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2
ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2
STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2
ST Z, Rr Store Indirect (Z) ← Rr None 2
ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2
ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2
STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2
STS k, Rr Store Direct to SRAM (k) ← Rr None 2
LPM Load Program Memory R0 ← (Z) None 3
LPM Rd, Z Load Program Memory Rd ← (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3
ELPM Extended Load Program Memory R0 ← (RAMPZ:Z) None 3
ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3
Mnemonics Operands Description Operation Flags #Clocks418
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Note: EICALL and EIJMP do not exist in ATmega640/1280/1281.
ELPM does not exist in ATmega640.
ELPM Rd, Z+ Extended Load Program Memory Rd ← (RAMPZ:Z), RAMPZ:Z ←RAMPZ:Z+1 None 3
SPM Store Program Memory (Z) ← R1:R0 None -
IN Rd, P In Port Rd ← P None 1
OUT P, Rr Out Port P ← Rr None 1
PUSH Rr Push Register on Stack STACK ← Rr None 2
POP Rd Pop Register from Stack Rd ← STACK None 2
MCU CONTROL INSTRUCTIONS
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep function) None 1
WDR Watchdog Reset (see specific descr. for WDR/timer) None 1
BREAK Break For On-chip Debug Only None N/A
Mnemonics Operands Description Operation Flags #Clocks419
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
35. Ordering Information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Speed Grades” on page 369.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
4. Tape & Reel.
35.1 ATmega640
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
8 1.8 - 5.5V
ATmega640V-8AU
ATmega640V-8AUR(4)
ATmega640V-8CU
ATmega640V-8CUR(4)
100A
100A
100C1
100C1
Industrial (-40°C to 85°C)
16 2.7 - 5.5V
ATmega640-16AU
ATmega640-16AUR(4)
ATmega640-16CU
ATmega640-16CUR(4)
100A
100A
100C1
100C1
Package Type
100A 100-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)420
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Speed Grades” on page 369.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
4. Tape & Reel.
35.2 ATmega1280
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
8 1.8V - 5.5V
ATmega1280V-8AU
ATmega1280V-8AUR(4)
ATmega1280V-8CU
ATmega1280V-8CUR(4)
100A
100A
100C1
100C1
Industrial (-40°C to 85°C)
16 2.7V - 5.5V
ATmega1280-16AU
ATmega1280-16AUR(4)
ATmega1280-16CU
ATmega1280-16CUR(4)
100A
100A
100C1
100C1
Package Type
100A 100-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)421
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Speed Grades” on page 369.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
4. Tape & Reel.
35.3 ATmega1281
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
8 1.8 - 5.5V
ATmega1281V-8AU
ATmega1281V-8AUR(4)
ATmega1281V-8MU
ATmega1281V-8MUR(4)
64A
64A
64M2
64M2 Industrial
(-40°C to 85°C)
16 2.7 - 5.5V
ATmega1281-16AU
ATmega1281-16AUR(4)
ATmega1281-16MU
ATmega1281-16MUR(4)
64A
64A
64M2
64M2
Package Type
64A 64-lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M2 64-pad, 9mm × 9mm × 1.0mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)422
2549P–AVR–10/2012
ATmega640/1280/1281/2560/2561
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Speed Grades” on page 369.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
4. Tape & Reel.
35.4 ATmega2560
Speed (MHz)(2