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Farnell PDF

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ATtiny2313A/4313 Data Sheet - Atmel - Farnell Element 14

ATtiny2313A/4313 Data Sheet - Atmel - Farnell Element 14 - Revenir à l'accueil

 

 

Branding Farnell element14 (France)

 

Farnell Element 14 :

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Everything You Need To Know About Arduino

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Tutorial 01 for Arduino: Getting Acquainted with Arduino

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The Cube® 3D Printer

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What's easier- DIY Dentistry or our new our website features?

 

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Ben Heck's Getting Started with the BeagleBone Black Trailer

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Ben Heck's Home-Brew Solder Reflow Oven 2.0 Trailer

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Get Started with Pi Episode 3 - Online with Raspberry Pi

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Discover Simulink Promo -- Exclusive element14 Webinar

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Ben Heck's TV Proximity Sensor Trailer

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Ben Heck's PlayStation 4 Teardown Trailer

See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…

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Get Started with Pi Episode 4 - Your First Raspberry Pi Project

Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.

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Ben Heck Anti-Pickpocket Wallet Trailer

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Molex Earphones - The 14 Holiday Products of Newark element14 Promotion

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Tripp Lite Surge Protector - The 14 Holiday Products of Newark element14 Promotion

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Microchip ChipKIT Pi - The 14 Holiday Products of Newark element14 Promotion

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Beagle Bone Black - The 14 Holiday Products of Newark element14 Promotion

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3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

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3M Colored Duct Tape - The 14 Holiday Products of Newark element14 Promotion

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Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

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Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

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Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

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Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

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Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

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Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

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Dymo RHINO 6000 Label Printer - The 14 Holiday Products of Newark element14 Promotion

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3M LED Advanced Lights A-19 - The 14 Holiday Products of Newark element14 Promotion

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Innovative LPS Resistor Features Very High Power Dissipation

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Charge Injection Evaluation Board for DG508B Multiplexer Demo

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Ben Heck The Great Glue Gun Trailer Part 2

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Introducing element14 TV

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Ben Heck Time to Meet Your Maker Trailer

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Détecteur de composants

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Recherche intégrée

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Ben Builds an Accessibility Guitar Trailer Part 1

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Ben Builds an Accessibility Guitar - Part 2 Trailer

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PiFace Control and Display Introduction

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Flashmob Farnell

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Express Yourself in 3D with Cube 3D Printers from Newark element14

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Farnell YouTube Channel Move

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Farnell: Design with the best

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French Farnell Quest

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Altera - 3 Ways to Quickly Adapt to Changing Ethernet Protocols

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Cy-Net3 Network Module

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MC AT - Professional and Precision Series Thin Film Chip Resistors

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Solderless LED Connector

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PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701T

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3-axis Universal Motion Controller For Stepper Motor Drivers: TMC429

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Voltage Level Translation

Puce électronique / Microchip :

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Microchip - 8-bit Wireless Development Kit

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

Sans fil - Wireless :

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Microchip - 8-bit Wireless Development Kit

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Wireless Power Solutions - Wurth Electronics, Texas Instruments, CadSoft and element14

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Analog Devices - Remote Water Quality Monitoring via a Low Power, Wireless Network

Texas instrument :

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Texas Instruments - Automotive LED Headlights

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Texas Instruments - Digital Power Solutions

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Texas Instruments - Industrial Sensor Solutions

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Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

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Texas Instruments - Industrial Automation System Components

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Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

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Texas Instruments - TMS320C66x KeyStone Multicore Architecture

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Texas Instruments - Industrial Interfaces

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Texas Instruments - Concerto™ MCUs - Connectivity without compromise

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Texas Instruments - Stellaris Robot Chronos

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Texas Instruments - DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit

Ordinateurs :

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Ask Ben Heck - Connect Raspberry Pi to Car Computer

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Ben's Portable Raspberry Pi Computer Trailer

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Ben's Raspberry Pi Portable Computer Trailer 2

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Ben Heck's Pocket Computer Trailer

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Ask Ben Heck - Atari Computer

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Ask Ben Heck - Using Computer Monitors for External Displays

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Raspberry Pi Partnership with BBC Computer Literacy Project - Answers from co-founder Eben Upton

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Installing RaspBMC on your Raspberry Pi with the Farnell element14 Accessory kit

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Raspberry Pi Served - Joey Hudy

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Happy Birthday Raspberry Pi

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Raspberry Pi board B product overview

Logiciels :

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Ask Ben Heck - Best Opensource or Free CAD Software

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Tektronix FPGAView™ software makes debugging of FPGAs faster than ever!

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Ask Ben Heck - Best Open-Source Schematic Capture and PCB Layout Software

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Introduction to Cadsoft EAGLE PCB Design Software in Chinese

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Altera - Developing Software for Embedded Systems on FPGAs

Tutoriels :

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Ben Heck The Great Glue Gun Trailer Part 1

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the knode tutorial - element14

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Ben's Autodesk 123D Tutorial Trailer

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Ben's CadSoft EAGLE Tutorial Trailer

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Ben Heck's Soldering Tutorial Trailer

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Ben Heck's AVR Dev Board tutorial

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Ben Heck's Pinball Tutorial Trailer

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Ben Heck's Interface Tutorial Trailer

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First Stage with Python and PiFace Digital

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Cypress - Getting Started with PSoC® 3 - Part 2

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Energy Harvesting Challenge

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New Features of CadSoft EAGLE v6

Autres documentations :

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Features • High Performance, Low Power AVR® 8-Bit Microcontroller • Advanced RISC Architecture – 120 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation – Up to 20 MIPS Throughput at 20 MHz • Data and Non-volatile Program and Data Memories – 2/4K Bytes of In-System Self Programmable Flash • Endurance 10,000 Write/Erase Cycles – 128/256 Bytes In-System Programmable EEPROM • Endurance: 100,000 Write/Erase Cycles – 128/256 Bytes Internal SRAM – Programming Lock for Flash Program and EEPROM Data Security • Peripheral Features – One 8-bit Timer/Counter with Separate Prescaler and Compare Mode – One 16-bit Timer/Counter with Separate Prescaler, Compare and Capture Modes – Four PWM Channels – On-chip Analog Comparator – Programmable Watchdog Timer with On-chip Oscillator – USI – Universal Serial Interface – Full Duplex USART • Special Microcontroller Features – debugWIRE On-chip Debugging – In-System Programmable via SPI Port – External and Internal Interrupt Sources – Low-power Idle, Power-down, and Standby Modes – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit – Internal Calibrated Oscillator • I/O and Packages – 18 Programmable I/O Lines – 20-pin PDIP, 20-pin SOIC, 20-pad MLF/VQFN • Operating Voltage – 1.8 – 5.5V • Speed Grades – 0 – 4 MHz @ 1.8 – 5.5V – 0 – 10 MHz @ 2.7 – 5.5V – 0 – 20 MHz @ 4.5 – 5.5V • Industrial Temperature Range: -40°C to +85°C • Low Power Consumption – Active Mode • 190 µA at 1.8V and 1MHz – Idle Mode • 24 µA at 1.8V and 1MHz – Power-down Mode • 0.1 µA at 1.8V and +25°C 8-bit Microcontroller with 2/4K Bytes In-System Programmable Flash ATtiny2313A ATtiny4313 Rev. 8246B–AVR–09/112 8246B–AVR–09/11 ATtiny2313A/4313 1. Pin Configurations Figure 1-1. Pinout ATtiny2313A/4313 (PCINT10/RESET/dW) PA2 (PCINT11/RXD) PD0 (PCINT12/TXD) PD1 (PCINT9/XTAL2) PA1 (PCINT8/CLKI/XTAL1) PA0 (PCINT13/CKOUT/XCK/INT0) PD2 (PCINT14/INT1) PD3 (PCINT15/T0) PD4 (PCINT16/OC0B/T1) PD5 GND 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 VCC PB7 (USCK/SCL/SCK/PCINT7) PB6 (MISO/DO/PCINT6) PB5 (MOSI/DI/SDA/PCINT5) PB4 (OC1B/PCINT4) PB3 (OC1A/PCINT3) PB2 (OC0A/PCINT2) PB1 (AIN1/PCINT1) PB0 (AIN0/PCINT0) PD6 (ICPI/PCINT17) PDIP/SOIC 1 2 3 4 5 MLF/VQFN 15 14 13 12 11 20 19 18 17 16 6 7 8 9 10 (PCINT12/TXD) PD1 (PCINT9/XTAL2) PA1 (PCINT8/CLKI/XTAL1) PA0 (PCINT13/CKOUT/XCK/INT0) PD2 (PCINT14/INT1) PD3 (PCINT15/T0) PD4 (PCINT16/OC0B/T1) PD5 GND (PCINT17/ICPI) PD6 (AIN0/PCINT0) PB0 PB5 (MOSI/DI/SDA/PCINT5) PB4 (OC1B/PCINT4) PB3 (OC1A/PCINT3) PB2 (OC0A/PCINT2) PB1 (AIN1/PCINT1) PD0 (RXD/PCINT11) PA2 (RESET/dW/PCINT10) VCC PB7 (USCK/SCL/SCK/PCINT7) PB6 (MISO/DO/PCINT6) NOTE: Bottom pad should be soldered to ground.3 8246B–AVR–09/11 ATtiny2313A/4313 1.1 Pin Descriptions 1.1.1 VCC Digital supply voltage. 1.1.2 GND Ground. 1.1.3 Port A (PA2..PA0) Port A is a 3-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability, except PA2 which has the RESET capability. To use pin PA2 as I/O pin, instead of RESET pin, program (“0”) RSTDISBL fuse. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A also serves the functions of various special features of the ATtiny2313A/4313 as listed on page 62. 1.1.4 Port B (PB7..PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B also serves the functions of various special features of the ATtiny2313A/4313 as listed on page 63. 1.1.5 Port D (PD6..PD0) Port D is a 7-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATtiny2313A/4313 as listed on page 67. 1.1.6 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided that the reset pin has not been disabled. The minimum pulse length is given in Table 22-3 on page 201. Shorter pulses are not guaranteed to generate a reset. The Reset Input is an alternate function for PA2 and dW. The reset pin can also be used as a (weak) I/O pin. 1.1.7 XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit. XTAL1 is an alternate function for PA0.4 8246B–AVR–09/11 ATtiny2313A/4313 1.1.8 XTAL2 Output from the inverting Oscillator amplifier. XTAL2 is an alternate function for PA1.5 8246B–AVR–09/11 ATtiny2313A/4313 2. Overview The ATtiny2313A/4313 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny2313A/4313 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram PROGRAM COUNTER PROGRAM FLASH INSTRUCTION REGISTER GND VCC INSTRUCTION DECODER CONTROL LINES STACK POINTER SRAM GENERAL PURPOSE REGISTER ALU STATUS REGISTER PROGRAMMING LOGIC SPI 8-BIT DATA BUS XTAL1 XTAL2 RESET INTERNAL OSCILLATOR OSCILLATOR WATCHDOG TIMER TIMING AND CONTROL MCU CONTROL REGISTER MCU STATUS REGISTER TIMER/ COUNTERS INTERRUPT UNIT EEPROM USI USART ANALOG COMPARATOR DATA REGISTER PORTB DATA DIR. REG. PORTB DATA REGISTER PORTA DATA DIR. REG. PORTA PORTB DRIVERS PB0 - PB7 PORTA DRIVERS PA0 - PA2 DATA REGISTER PORTD DATA DIR. REG. PORTD PORTD DRIVERS PD0 - PD6 ON-CHIP DEBUGGER INTERNAL CALIBRATED OSCILLATOR6 8246B–AVR–09/11 ATtiny2313A/4313 The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATtiny2313A/4313 provides the following features: 2/4K bytes of In-System Programmable Flash, 128/256 bytes EEPROM, 128/256 bytes SRAM, 18 general purpose I/O lines, 32 general purpose working registers, a single-wire Interface for On-chip Debugging, two flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, Universal Serial Interface with Start Condition Detector, a programmable Watchdog Timer with internal Oscillator, and three software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or hardware reset. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low-power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI serial interface, or by a conventional non-volatile memory programmer. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATtiny2313A/4313 is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The ATtiny2313A/4313 AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators, and Evaluation kits. 2.2 Comparison Between ATtiny2313A and ATtiny4313 The ATtiny2313A and ATtiny4313 differ only in memory sizes. Table 2-1 summarizes the different memory sizes for the two devices. Table 2-1. Memory Size Summary Device Flash EEPROM RAM ATtiny2313A 2K Bytes 128 Bytes 128 Bytes ATtiny4313 4K Bytes 256 Bytes 256 Bytes7 8246B–AVR–09/11 ATtiny2313A/4313 3. About 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. For I/O Registers located in the extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically, this means “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. Note that not all AVR devices include an extended I/O map. 3.3 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C.8 8246B–AVR–09/11 ATtiny2313A/4313 4. CPU Core This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 4.1 Architectural Overview Figure 4-1. Block Diagram of the AVR Architecture In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is In-System Reprogrammable Flash memory. The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Flash Program Memory Instruction Register Instruction Decoder Program Counter Control Lines 32 x 8 General Purpose Registrers ALU Status and Control I/O Lines EEPROM Data Bus 8-bit Data SRAM Direct Addressing Indirect Addressing Interrupt Unit SPI Unit Watchdog Timer Analog Comparator I/O Module 2 I/O Module1 I/O Module n9 8246B–AVR–09/11 ATtiny2313A/4313 Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every program memory address contains a 16- or 32-bit instruction. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. 4.2 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction Set” section for a detailed description. 4.3 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software.10 8246B–AVR–09/11 ATtiny2313A/4313 The AVR Status Register – SREG – is defined as: • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the instruction set reference. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is useful in BCD arithmetic. See the “Instruction Set Description” for detailed information. • Bit 4 – S: Sign Bit, S = N ⊕ V The S-bit is always an exclusive or between the negative flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Description” for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Description” for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 0 – C: Carry Flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. Bit 7 6 5 4 3 2 1 0 0x3F (0x5F) I T H S V N Z C SREG Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 011 8246B–AVR–09/11 ATtiny2313A/4313 4.4 General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 4-2 shows the structure of the 32 general purpose working registers in the CPU. Figure 4-2. AVR CPU General Purpose Working Registers Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 4-2, each register is also assigned a data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file. 4.4.1 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 4-3. 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 … R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte12 8246B–AVR–09/11 ATtiny2313A/4313 Figure 4-3. The X-, Y-, and Z-registers In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the instruction set reference for details). 4.5 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The Stack Pointer is implemented as one 8-bit register in the I/O space. 4.6 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 4-4 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. 15 XH XL 0 X-register 7 07 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 07 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 70 7 0 R31 (0x1F) R30 (0x1E) Bit 7 6 5 4 3 2 1 0 0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND13 8246B–AVR–09/11 ATtiny2313A/4313 Figure 4-4. The Parallel Instruction Fetches and Instruction Executions Figure 4-5 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 4-5. Single Cycle ALU Operation 4.7 Reset and Interrupt Handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate program vector in the program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. The lowest addresses in the program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 48. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. Refer to “Interrupts” on page 48 for more information. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the interrupt flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding interrupt flag. Interrupt flags can also be cleared by writing a logic one to the flag bit position(s) to be clk 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch T1 T2 T3 T4 CPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back T1 T2 T3 T4 clkCPU14 8246B–AVR–09/11 ATtiny2313A/4313 cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the interrupt flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding interrupt flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have interrupt flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence.. When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in this example. Assembly Code Example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ __disable_interrupt(); EECR |= (1< xxx ... ... ... ... 9.2 External Interrupts External Interrupts are triggered by the INT0 or INT1 pin or any of the PCINT17..0 pins. Observe that, if enabled, the interrupts will trigger even if the INT0, INT1 or PCINT17..0 pins are configured as outputs. This feature provides a way of generating a software interrupt. Pin change 0 interrupts PCI0 will trigger if any enabled PCINT7..0 pin toggles. Pin change 1 interrupts PCI1 will trigger if any enabled PCINT10..8 pin toggles. Pin change 2 interrupts PCI2 will trigger, if any enabled PCINT17..11 pin toggles. The PCMSK0, PCMSK1, and PCMSK2 Registers control which pins contribute to the pin change interrupts. Pin change interrupts on PCINT17..0 are detected asynchronously, which means that these interrupts can be used for waking the part also from sleep modes other than Idle mode. The INT0 and INT1 interrupts can be triggered by a falling or rising edge or a low level. This is set up as shown in “MCUCR – MCU Control Register” on page 51. When the INT0 or INT1 interrupt is enabled and configured as level triggered, the interrupt will trigger as long as the pin is held low. Note that recognition of falling or rising edge interrupts on INT0 or INT1 requires the presence of an I/O clock, as described in “Clock Sources” on page 27.50 8246B–AVR–09/11 ATtiny2313A/4313 9.2.1 Low Level Interrupt A low level interrupt on INT0 or INT1 is detected asynchronously. This means that the interrupt source can be used for waking the part also from sleep modes other than Idle (the I/O clock is halted in all sleep modes except Idle). Note that if a level triggered interrupt is used for wake-up from Power-down, the required level must be held long enough for the MCU to complete the wake-up to trigger the level interrupt. If the level disappears before the end of the Start-up Time, the MCU will still wake up, but no interrupt will be generated. The start-up time is defined by the SUT and CKSEL fuses, as described in “Clock System” on page 26. If the low level on the interrupt pin is removed before the device has woken up then program execution will not be diverted to the interrupt service routine but continue from the instruction following the SLEEP command. 9.2.2 Pin Change Interrupt Timing A timing example of a pin change interrupt is shown in Figure 9-1. Figure 9-1. Timing of pin change interrupts clk PCINT(0) pin_lat pin_sync pcint_in_(0) pcint_syn pcint_setflag PCIF PCINT(0) pin_sync pcint_syn pin_lat D Q LE pcint_setflag PCIF clk clk PCINT(0) in PCMSK(x) pcint_in_(0) 0 x51 8246B–AVR–09/11 ATtiny2313A/4313 9.3 Register Description 9.3.1 MCUCR – MCU Control Register The External Interrupt Control Register contains control bits for interrupt sense control. • Bit 3, 2 – ISC11, ISC10: Interrupt Sense Control 1 Bit 1 and Bit 0 The External Interrupt 1 is activated by the external pin INT1 if the SREG I-flag and the corresponding interrupt mask are set. The level and edges on the external INT1 pin that activate the interrupt are defined in Table 9-2. The value on the INT1 pin is sampled before detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low level interrupt is selected, the low level must be held until the completion of the currently executing instruction to generate an interrupt • Bits 1, 0 – ISC01, ISC00: Interrupt Sense Control 0 Bit 1 and Bit 0 The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corresponding interrupt mask are set. The level and edges on the external INT0 pin that activate the interrupt are defined in Table 9-3. The value on the INT0 pin is sampled before detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low level interrupt is selected, the low level must be held until the completion of the currently executing instruction to generate an interrupt. Bit 7 6 5 4 3 2 1 0 0x35 (0x55) PUD SM1 SE SM0 ISC11 ISC10 ISC01 ISC00 MCUCR Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 9-2. Interrupt 1 Sense Control ISC11 ISC10 Description 0 0 The low level of INT1 generates an interrupt request. 0 1 Any logical change on INT1 generates an interrupt request. 1 0 The falling edge of INT1 generates an interrupt request. 1 1 The rising edge of INT1 generates an interrupt request. Table 9-3. Interrupt 0 Sense Control ISC01 ISC00 Description 0 0 The low level of INT0 generates an interrupt request. 0 1 Any logical change on INT0 generates an interrupt request. 1 0 The falling edge of INT0 generates an interrupt request. 1 1 The rising edge of INT0 generates an interrupt request.52 8246B–AVR–09/11 ATtiny2313A/4313 9.3.2 GIMSK – General Interrupt Mask Register • Bits 2..0 – Res: Reserved Bits These bits are reserved and will always read as zero. • Bit 7 – INT1: External Interrupt Request 1 Enable When the INT1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the external pin interrupt is enabled. The Interrupt Sense Control bits (ISC11 and ISC10) in the External Interrupt Control Register A (EICRA) define whether the external interrupt is activated on rising and/or falling edge of the INT1 pin or level sensed. Activity on the pin will cause an interrupt request even if INT1 is configured as an output. The corresponding interrupt of External Interrupt Request 1 is executed from the INT1 Interrupt Vector. • Bit 6 – INT0: External Interrupt Request 0 Enable When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the external pin interrupt is enabled. The Interrupt Sense Control bits (ISC01 and ISC00) in the External Interrupt Control Register A (EICRA) define whether the external interrupt is activated on rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an interrupt request even if INT0 is configured as an output. The corresponding interrupt of External Interrupt Request 0 is executed from the INT0 Interrupt Vector. • Bit 5 – PCIE0: Pin Change Interrupt Enable 0 When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 0 is enabled. Any change on any enabled PCINT7..0 pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Interrupt Vector. PCINT7..0 pins are enabled individually by the PCMSK0 Register. • Bit 4 – PCIE2: Pin Change Interrupt Enable 2 When the PCIE2 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 2 is enabled. Any change on any enabled PCINT17..11 pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI2 Interrupt Vector. PCINT17..11 pins are enabled individually by the PCMSK2 Register. • Bit 3 – PCIE1: Pin Change Interrupt Enable 1 When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 1 is enabled. Any change on any enabled PCINT10..8 pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI1 Interrupt Vector. PCINT10..8 pins are enabled individually by the PCMSK1 Register. Bit 7 6 5 4 3 2 1 0 0x3B (0x5B) INT1 INT0 PCIE0 PCIE2 PCIE1 – – – GIMSK Read/Write R/W R/W R/W R/W R/W R R R Initial Value 0 0 0 0 0 0 0 053 8246B–AVR–09/11 ATtiny2313A/4313 9.3.3 GIFR – General Interrupt Flag Register • Bits 2..0 – Res: Reserved Bits These bits are reserved and will always read as zero. • Bit 7 – INTF1: External Interrupt Flag 1 When an edge or logic change on the INT1 pin triggers an interrupt request, INTF1 becomes set (one). If the I-bit in SREG and the INT1 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared when INT1 is configured as a level interrupt. • Bit 6 – INTF0: External Interrupt Flag 0 When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set (one). If the I-bit in SREG and the INT0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared when INT0 is configured as a level interrupt. • Bit 5 – PCIF0: Pin Change Interrupt Flag 0 When a logic change on any PCINT7..0 pin triggers an interrupt request, PCIF becomes set (one). If the I-bit in SREG and the PCIE0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. • Bit 4 – PCIF2: Pin Change Interrupt Flag 2 When a logic change on any PCINT17..11 pin triggers an interrupt request, PCIF2 becomes set (one). If the I-bit in SREG and the PCIE2 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. • Bit 3 – PCIF1: Pin Change Interrupt Flag 1 When a logic change on any PCINT10..8 pin triggers an interrupt request, PCIF1 becomes set (one). If the I-bit in SREG and the PCIE1 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. 9.3.4 PCMSK2 – Pin Change Mask Register 2 • Bit 7 – Res: Reserved Bit These bits are reserved and will always read as zero. Bit 7 6 5 4 3 2 1 0 0x3A (0x5A) INTF1 INTF0 PCIF0 PCIF2 PCIF1 – – – GIFR Read/Write R/W R/W R/W R/W R/W R R R Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x05 (0x25) – PCINT17 PCINT16 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCMSK2 Read/Write R R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 054 8246B–AVR–09/11 ATtiny2313A/4313 • Bits 6..0 – PCINT17..11: Pin Change Enable Mask 17..11 Each PCINT17..11 bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT17..11 is set and the PCIE1 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT17..11 is cleared, pin change interrupt on the corresponding I/O pin is disabled. 9.3.5 PCMSK1 – Pin Change Mask Register 1 • Bits 7:3 – Res: Reserved Bits These bits are reserved and will always read as zero. • Bits 2..0 – PCINT10..8: Pin Change Enable Mask 10..8 Each PCINT10..8 bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT10..8 is set and the PCIE1 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT10..8 is cleared, pin change interrupt on the corresponding I/O pin is disabled. 9.3.6 PCMSK0 – Pin Change Mask Register 0 • Bits 7..0 – PCINT7..0: Pin Change Enable Mask 7..0 Each PCINT7..0 bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT7..0 is set and the PCIE0 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT7..0 is cleared, pin change interrupt on the corresponding I/O pin is disabled. Bit 7 6 5 4 3 2 1 0 0x04 (0x24) – – – – – PCINT10 PCINT9 PCINT8 PCMSK1 Read/Write R R R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x20 (0x40) PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 PCMSK0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 055 8246B–AVR–09/11 ATtiny2313A/4313 10. I/O-Ports All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports. This means that the direction of one port pin can be changed without unintentionally changing the direction of any other pin with the SBI and CBI instructions. The same applies when changing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as input). Each output buffer has symmetrical drive characteristics with both high sink and source capability. The pin driver is strong enough to drive LED displays directly. All port pins have individually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have protection diodes to both VCC and Ground as indicated in Figure 10-1 on page 55. See “Electrical Characteristics” on page 198 for a complete list of parameters. Figure 10-1. I/O Pin Equivalent Schematic All registers and bit references in this section are written in general form. A lower case “x” represents the numbering letter for the port, and a lower case “n” represents the bit number. However, when using the register or bit defines in a program, the precise form must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Registers and bit locations are listed in “Register Description” on page 69. Three I/O memory address locations are allocated for each port, one each for the Data Register – PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input Pins I/O location is read only, while the Data Register and the Data Direction Register are read/write. However, writing a logic one to a bit in the PINx Register, will result in a toggle in the corresponding bit in the Data Register. In addition, the Pull-up Disable – PUD bit in MCUCR disables the pull-up function for all pins in all ports when set. Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on page 56. Most port pins are multiplexed with alternate functions for the peripheral features on the device. How each alternate function interferes with the port pin is described in “Alternate Port Functions” on page 60. Refer to the individual module sections for a full description of the alternate functions. Note that enabling the alternate function of some of the port pins does not affect the use of the other pins in the port as general digital I/O. Cpin Logic Rpu See Figure "General Digital I/O" for Details Pxn56 8246B–AVR–09/11 ATtiny2313A/4313 10.1 Ports as General Digital I/O The ports are bi-directional I/O ports with optional internal pull-ups. Figure 10-2 shows a functional description of one I/O-port pin, here generically called Pxn. Figure 10-2. General Digital I/O(1) Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports. 10.1.1 Configuring the Pin Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in “Register Description” on page 69, the DDxn bits are accessed at the DDRx I/O address, the PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address. The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input pin. If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to be configured as an output pin. The port pins are tri-stated when reset condition becomes active, even if no clocks are running. If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port pin is driven low (zero). clk RPx RRx RDx WDx PUD SYNCHRONIZER WDx: WRITE DDRx WRx: WRITE PORTx RRx: READ PORTx REGISTER RPx: READ PORTx PIN PUD: PULLUP DISABLE clkI/O: I/O CLOCK RDx: READ DDRx D L Q Q RESET RESET Q D Q Q Q D CLR PORTxn Q Q D CLR DDxn PINxn DATA BUS SLEEP SLEEP: SLEEP CONTROL Pxn I/O WPx 0 1 WRx WPx: WRITE PINx REGISTER57 8246B–AVR–09/11 ATtiny2313A/4313 10.1.2 Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn. Note that the SBI instruction can be used to toggle one single bit in a port. 10.1.3 Switching Between Input and Output When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn} = 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully acceptable, as a high-impedant environment will not notice the difference between a strong high driver and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all pull-ups in all ports. Switching between input with pull-up and output low generates the same problem. The user must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn} = 0b10) as an intermediate step. Table 10-1 summarizes the control signals for the pin value. 10.1.4 Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the PINxn Register bit. As shown in Figure 10-2 on page 56, the PINxn Register bit and the preceding latch constitute a synchronizer. This is needed to avoid metastability if the physical pin changes value near the edge of the internal clock, but it also introduces a delay. Figure 10-3 shows a timing diagram of the synchronization when reading an externally applied pin value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min respectively. Figure 10-3. Synchronization when Reading an Externally Applied Pin value Table 10-1. Port Pin Configurations DDxn PORTxn PUD (in MCUCR) I/O Pull-up Comment 0 0 X Input No Tri-state (Hi-Z) 0 1 0 Input Yes Pxn will source current if ext. pulled low 0 1 1 Input No Tri-state (Hi-Z) 1 0 X Output No Output Low (Sink) 1 1 X Output No Output High (Source) XXX in r17, PINx 0x00 0xFF INSTRUCTIONS SYNC LATCH PINxn r17 XXX SYSTEM CLK tpd, max tpd, min58 8246B–AVR–09/11 ATtiny2313A/4313 Consider the clock period starting shortly after the first falling edge of the system clock. The latch is closed when the clock is low, and goes transparent when the clock is high, as indicated by the shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed between ½ and 1½ system clock period depending upon the time of assertion. When reading back a software assigned pin value, a nop instruction must be inserted as indicated in Figure 10-4 on page 58. The out instruction sets the “SYNC LATCH” signal at the positive edge of the clock. In this case, the delay tpd through the synchronizer is one system clock period. Figure 10-4. Synchronization when Reading a Software Assigned Pin Value 10.1.5 Digital Input Enable and Sleep Modes As shown in Figure 10-2 on page 56, the digital input signal can be clamped to ground at the input of the schmitt-trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep Controller in Power-down and Standby modes to avoid high power consumption if some input signals are left floating, or have an analog signal level close to VCC/2. SLEEP is overridden for port pins enabled as external interrupt pins. If the external interrupt request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by various other alternate functions as described in “Alternate Port Functions” on page 60. If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as “Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt is not enabled, the corresponding External Interrupt Flag will be set when resuming from the above mentioned Sleep mode, as the clamping in these sleep mode produces the requested logic change. 10.1.6 Unconnected Pins If some pins are unused, it is recommended to ensure that these pins have a defined level. Even though most of the digital inputs are disabled in the deep sleep modes as described above, floating inputs should be avoided to reduce current consumption in all other modes where the digital inputs are enabled (Reset, Active mode and Idle mode). The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up. In this case, the pull-up will be disabled during reset. If low power consumption during reset is out PORTx, r16 nop in r17, PINx 0xFF 0x00 0xFF SYSTEM CLK r16 INSTRUCTIONS SYNC LATCH PINxn r17 t pd59 8246B–AVR–09/11 ATtiny2313A/4313 important, it is recommended to use an external pull-up or pulldown. Connecting unused pins directly to VCC or GND is not recommended, since this may cause excessive currents if the pin is accidentally configured as an output. 10.1.7 Program Examples The following code example shows how to set port A pins 0 and 1 high, 2 and 3 low, and define the port pins from 4 to 7 as input with a pull-up assigned to port pin 4. The resulting pin values are read back again, but as previously discussed, a nop instruction is included to be able to read back the value recently assigned to some of the pins. Note: Two temporary registers are used to minimize the time from pull-ups are set on pins 0, 1 and 4, until the direction bits are correctly set, defining bit 2 and 3 as low and redefining bits 0 and 1 as strong high drivers. Note: 1. See “Code Examples” on page 7. Assembly Code Example ... ; Define pull-ups and set outputs high ; Define directions for port pins ldi r16,(1< CSn2:0 > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution. However, care must be taken if the other Timer/Counter that shares the same prescaler also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is connected to. 13.3 External Clock Source An external clock source applied to the T1/T0 pin can be used as Timer/Counter clock (clkT1/clkT0). The T1/T0 pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 13-1 shows a functional equivalent block diagram of the T1/T0 synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkT1/clkT0 pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 13-1. T1/T0 Pin Sampling The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the T1/T0 pin to the counter is updated. Tn_sync (To Clock Select Logic) Synchronization Edge Detector D Q D Q LE Tn D Q clkI/O119 8246B–AVR–09/11 ATtiny2313A/4313 Enabling and disabling of the clock input must be done when T1/T0 has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 13-2. Prescaler for Timer/Counter0 and Timer/Counter1(1) Note: 1. The synchronization logic on the input pins (T1/T0) is shown in Figure 13-1 on page 118. 13.4 Register Description 13.4.1 GTCCR – General Timer/Counter Control Register • Bits 7..1 – Res: Reserved Bits These bits are reserved bits in the ATtiny2313A/4313 and will always read as zero. • Bit 0 – PSR10: Prescaler Reset Timer/Counter1 and Timer/Counter0 When this bit is one, Timer/Counter1 and Timer/Counter0 prescaler will be Reset. This bit is normally cleared immediately by hardware. Note that Timer/Counter1 and Timer/Counter0 share the same prescaler and a reset of this prescaler will affect both timers. PSR10 Clear clkT1 clkT0 T1 T0 clkI/O Synchronization Synchronization Bit 7 6 5 4 3 2 1 0 0x23 (0x43) — — — — — — — PSR10 GTCCR Read/Write R R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0120 8246B–AVR–09/11 ATtiny2313A/4313 14. USART 14.1 Features • Full Duplex Operation (Independent Serial Receive and Transmit Registers) • Asynchronous or Synchronous Operation • Master or Slave Clocked Synchronous Operation • High Resolution Baud Rate Generator • Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits • Odd or Even Parity Generation and Parity Check Supported by Hardware • Data OverRun Detection • Framing Error Detection • Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter • Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete • Multi-processor Communication Mode • Double Speed Asynchronous Communication Mode 14.2 Overview The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a highly flexible serial communication device. A simplified block diagram of the USART Transmitter is shown in Figure 14-1. CPU accessible I/O Registers and I/O pins are shown in bold. Figure 14-1. USART Block Diagram(1) Note: 1. Refer to Figure 1-1 on page 2, Table 10-9 on page 68, and Table 10-6 on page 66 for USART pin placement. PARITY GENERATOR UBRR[H:L] UDR (Transmit) UCSRA UCSRB UCSRC BAUD RATE GENERATOR TRANSMIT SHIFT REGISTER RECEIVE SHIFT REGISTER RxD TxD PIN CONTROL UDR (Receive) PIN CONTROL XCK DATA RECOVERY CLOCK RECOVERY PIN CONTROL TX CONTROL RX CONTROL PARITY CHECKER DATA BUS OSC SYNC LOGIC Clock Generator Transmitter Receiver121 8246B–AVR–09/11 ATtiny2313A/4313 The dashed boxes in the block diagram separate the three main parts of the USART (listed from the top): Clock Generator, Transmitter and Receiver. Control registers are shared by all units. The Clock Generation logic consists of synchronization logic for external clock input used by synchronous slave operation, and the baud rate generator. The XCK (Transfer Clock) pin is only used by synchronous transfer mode. The Transmitter consists of a single write buffer, a serial Shift Register, Parity Generator and Control logic for handling different serial frame formats. The write buffer allows a continuous transfer of data without any delay between frames. The Receiver is the most complex part of the USART module due to its clock and data recovery units. The recovery units are used for asynchronous data reception. In addition to the recovery units, the Receiver includes a Parity Checker, Control logic, a Shift Register and a two level receive buffer (UDR). The Receiver supports the same frame formats as the Transmitter, and can detect Frame Error, Data OverRun and Parity Errors. 14.2.1 AVR USART vs. AVR UART – Compatibility The USART is fully compatible with the AVR UART regarding: • Bit locations inside all USART Registers. • Baud Rate Generation. • Transmitter Operation. • Transmit Buffer Functionality. • Receiver Operation. However, the receive buffering has two improvements that will affect the compatibility in some special cases: • A second Buffer Register has been added. The two Buffer Registers operate as a circular FIFO buffer. Therefore the UDR must only be read once for each incoming data! More important is the fact that the error flags (FE and DOR) and the ninth data bit (RXB8) are buffered with the data in the receive buffer. Therefore the status bits must always be read before the UDR Register is read. Otherwise the error status will be lost since the buffer state is lost. • The Receiver Shift Register can now act as a third buffer level. This is done by allowing the received data to remain in the serial Shift Register (see Figure 14-1) if the Buffer Registers are full, until a new start bit is detected. The USART is therefore more resistant to Data OverRun (DOR) error conditions. The following control bits have changed name, but have same functionality and register location: • CHR9 is changed to UCSZ2. • OR is changed to DOR. 14.3 Clock Generation The Clock Generation logic generates the base clock for the Transmitter and Receiver. The USART supports four modes of clock operation: Normal asynchronous, Double Speed asynchronous, Master synchronous and Slave synchronous mode. The UMSEL bit in USART Control and Status Register C (UCSRC) selects between asynchronous and synchronous operation. Double Speed (asynchronous mode only) is controlled by the U2X found in the UCSRA Register. When using synchronous mode (UMSEL = 1), the Data Direction Register for the XCK122 8246B–AVR–09/11 ATtiny2313A/4313 pin (DDR_XCK) controls whether the clock source is internal (Master mode) or external (Slave mode). The XCK pin is only active when using synchronous mode. Figure 14-2 shows a block diagram of the clock generation logic. Figure 14-2. Clock Generation Logic, Block Diagram Signal description: txclk Transmitter clock (Internal Signal). rxclk Receiver base clock (Internal Signal). xcki Input from XCK pin (internal Signal). Used for synchronous slave operation. xcko Clock output to XCK pin (Internal Signal). Used for synchronous master operation. fosc XTAL pin frequency (System Clock). 14.3.1 Internal Clock Generation – The Baud Rate Generator Internal clock generation is used for the asynchronous and the synchronous master modes of operation. The description in this section refers to Figure 14-2. The USART Baud Rate Register (UBRR) and the down-counter connected to it function as a programmable prescaler or baud rate generator. The down-counter, running at system clock (fosc), is loaded with the UBRR value each time the counter has counted down to zero or when the UBRRL Register is written. A clock is generated each time the counter reaches zero. This clock is the baud rate generator clock output (= fosc/(UBRR+1)). The Transmitter divides the baud rate generator clock output by 2, 8 or 16 depending on mode. The baud rate generator output is used directly by the Receiver’s clock and data recovery units. However, the recovery units use a state machine that uses 2, 8 or 16 states depending on mode set by the state of the UMSEL, U2X and DDR_XCK bits. Table 14-1 contains equations for calculating the baud rate (in bits per second) and for calculating the UBRR value for each mode of operation using an internally generated clock source. Prescaling Down-Counter /2 UBRR /4 /2 fosc UBRR+1 Sync Register OSC XCK Pin txclk U2X UMSEL DDR_XCK 0 1 0 1 xcki xcko DDR_XCK rxclk 0 1 1 0 Edge Detector UCPOL123 8246B–AVR–09/11 ATtiny2313A/4313 Note: 1. The baud rate is defined to be the transfer rate in bit per second (bps) BAUD Baud rate (in bits per second, bps) fOSC System Oscillator clock frequency UBRR Contents of the UBRRH and UBRRL Registers, (0-4095) Some examples of UBRR values for some system clock frequencies are found in Table 14-9 (see page 142). 14.3.2 Double Speed Operation (U2X) The transfer rate can be doubled by setting the U2X bit in UCSRA. Setting this bit only has effect for the asynchronous operation. Set this bit to zero when using synchronous operation. Setting this bit will reduce the divisor of the baud rate divider from 16 to 8, effectively doubling the transfer rate for asynchronous communication. Note however that the Receiver will in this case only use half the number of samples (reduced from 16 to 8) for data sampling and clock recovery, and therefore a more accurate baud rate setting and system clock are required when this mode is used. For the Transmitter, there are no downsides. 14.3.3 External Clock External clocking is used by the synchronous slave modes of operation. The description in this section refers to Figure 14-2 for details. External clock input from the XCK pin is sampled by a synchronization register to minimize the chance of meta-stability. The output from the synchronization register must then pass through an edge detector before it can be used by the Transmitter and Receiver. This process introduces a two CPU clock period delay and therefore the maximum external XCK clock frequency is limited by the following equation: Note that fosc depends on the stability of the system clock source. It is therefore recommended to add some margin to avoid possible loss of data due to frequency variations. Table 14-1. Equations for Calculating Baud Rate Register Setting Operating Mode Equation for Calculating Baud Rate(1) Equation for Calculating UBRR Value Asynchronous Normal mode (U2X = 0) Asynchronous Double Speed mode (U2X = 1) Synchronous Master mode BAUD f OSC 16( ) UBRR + 1 = -------------------------------------- UBRR f OSC 16BAUD = ------------------------ – 1 BAUD f OSC 8( ) UBRR + 1 = ----------------------------------- UBRR f OSC 8BAUD = -------------------- – 1 BAUD f OSC 2( ) UBRR + 1 = ----------------------------------- UBRR f OSC 2BAUD = -------------------- – 1 f XCK f OSC 4 < -----------124 8246B–AVR–09/11 ATtiny2313A/4313 14.3.4 Synchronous Clock Operation When synchronous mode is used (UMSEL = 1), the XCK pin will be used as either clock input (Slave) or clock output (Master). The dependency between the clock edges and data sampling or data change is the same. The basic principle is that data input (on RxD) is sampled at the opposite XCK clock edge of the edge the data output (TxD) is changed. Figure 14-3. Synchronous Mode XCK Timing. The UCPOL bit UCRSC selects which XCK clock edge is used for data sampling and which is used for data change. As Figure 14-3 shows, when UCPOL is zero the data will be changed at rising XCK edge and sampled at falling XCK edge. If UCPOL is set, the data will be changed at falling XCK edge and sampled at rising XCK edge. 14.4 Frame Formats A serial frame is defined to be one character of data bits with synchronization bits (start and stop bits), and optionally a parity bit for error checking. The USART accepts all 30 combinations of the following as valid frame formats: • 1 start bit • 5, 6, 7, 8, or 9 data bits • no, even or odd parity bit • 1 or 2 stop bits A frame starts with the start bit followed by the least significant data bit. Then the next data bits, up to a total of nine, are succeeding, ending with the most significant bit. If enabled, the parity bit is inserted after the data bits, before the stop bits. When a complete frame is transmitted, it can be directly followed by a new frame, or the communication line can be set to an idle (high) state. Figure 14-4 illustrates the possible combinations of the frame formats. Bits inside brackets are optional. Figure 14-4. Frame Formats RxD / TxD XCK RxD / TxD UCPOL = 0 XCK UCPOL = 1 Sample Sample (IDLE) St Sp1 [Sp2] 0 2 3 4 [5] [6] [7] [8] [P] 1 (St / IDLE) FRAME125 8246B–AVR–09/11 ATtiny2313A/4313 St Start bit, always low. (n) Data bits (0 to 8). P Parity bit. Can be odd or even. Sp Stop bit, always high. IDLE No transfers on the communication line (RxD or TxD). An IDLE line must be high. The frame format used by the USART is set by the UCSZ2:0, UPM1:0 and USBS bits in UCSRB and UCSRC. The Receiver and Transmitter use the same setting. Note that changing the setting of any of these bits will corrupt all ongoing communication for both the Receiver and Transmitter. The USART Character SiZe (UCSZ2:0) bits select the number of data bits in the frame. The USART Parity mode (UPM1:0) bits enable and set the type of parity bit. The selection between one or two stop bits is done by the USART Stop Bit Select (USBS) bit. The Receiver ignores the second stop bit. An FE (Frame Error) will therefore only be detected in the cases where the first stop bit is zero. 14.4.1 Parity Bit Calculation The parity bit is calculated by doing an exclusive-or of all the data bits. If odd parity is used, the result of the exclusive or is inverted. The relation between the parity bit and data bits is as follows: Peven Parity bit using even parity Podd Parity bit using odd parity dn Data bit n of the character If used, the parity bit is located between the last data bit and first stop bit of a serial frame. 14.5 USART Initialization The USART has to be initialized before any communication can take place. The initialization process normally consists of setting the baud rate, setting frame format and enabling the Transmitter or the Receiver depending on the usage. For interrupt driven USART operation, the Global Interrupt Flag should be cleared (and interrupts globally disabled) when doing the initialization. Before doing a re-initialization with changed baud rate or frame format, be sure that there are no ongoing transmissions during the period the registers are changed. The TXC flag can be used to check that the Transmitter has completed all transfers, and the RXC flag can be used to check that there are no unread data in the receive buffer. Note that the TXC flag must be cleared before each transmission (before UDR is written) if it is used for this purpose. Peven dn – 1 … d3 d2 d1 d0 0 Podd ⊕⊕⊕⊕⊕⊕ dn – 1 … d3 d2 d1 d0 ⊕⊕⊕⊕⊕⊕ 1 = =126 8246B–AVR–09/11 ATtiny2313A/4313 The following simple USART initialization code examples show one assembly and one C function that are equal in functionality. The examples assume asynchronous operation using polling (no interrupts enabled) and a fixed frame format. The baud rate is given as a function parameter. For the assembly code, the baud rate parameter is assumed to be stored in the r17:r16 Registers. Note: 1. See “Code Examples” on page 7. More advanced initialization routines can be made that include frame format as parameters, disable interrupts and so on. However, many applications use a fixed setting of the baud and control registers, and for these types of applications the initialization code can be placed directly in the main routine, or be combined with initialization code for other I/O modules. 14.6 Data Transmission – The USART Transmitter The USART Transmitter is enabled by setting the Transmit Enable (TXEN) bit in the UCSRB Register. When the Transmitter is enabled, the normal port operation of the TxD pin is overridden by the USART and given the function as the Transmitter’s serial output. The baud rate, mode of operation and frame format must be set up once before doing any transmissions. If synchronous operation is used, the clock on the XCK pin will be overridden and used as transmission clock. Assembly Code Example(1) USART_Init: ; Set baud rate out UBRRH, r17 out UBRRL, r16 ; Enable receiver and transmitter ldi r16, (1<>8); UBRRL = (unsigned char)baud; /* Enable receiver and transmitter */ UCSRB = (1<> 1) & 0x01; return ((resh << 8) | resl); }132 8246B–AVR–09/11 ATtiny2313A/4313 The receive function example reads all the I/O Registers into the Register File before any computation is done. This gives an optimal receive buffer utilization since the buffer location read will be free to accept new data as early as possible. 14.7.3 Receive Compete Flag and Interrupt The USART Receiver has one flag that indicates the Receiver state. The Receive Complete (RXC) flag indicates if there are unread data present in the receive buffer. This flag is one when unread data exist in the receive buffer, and zero when the receive buffer is empty (i.e., does not contain any unread data). If the Receiver is disabled (RXEN = 0), the receive buffer will be flushed and consequently the RXC bit will become zero. When the Receive Complete Interrupt Enable (RXCIE) in UCSRB is set, the USART Receive Complete interrupt will be executed as long as the RXC flag is set (provided that global interrupts are enabled). When interrupt-driven data reception is used, the receive complete routine must read the received data from UDR in order to clear the RXC flag, otherwise a new interrupt will occur once the interrupt routine terminates. 14.7.4 Receiver Error Flags The USART Receiver has three error flags: Frame Error (FE), Data OverRun (DOR) and Parity Error (UPE). All can be accessed by reading UCSRA. Common for the error flags is that they are located in the receive buffer together with the frame for which they indicate the error status. Due to the buffering of the error flags, the UCSRA must be read before the receive buffer (UDR), since reading the UDR I/O location changes the buffer read location. Another equality for the error flags is that they can not be altered by software doing a write to the flag location. However, all flags must be set to zero when the UCSRA is written for upward compatibility of future USART implementations. None of the error flags can generate interrupts. The Frame Error (FE) flag indicates the state of the first stop bit of the next readable frame stored in the receive buffer. The FE flag is zero when the stop bit was correctly read (as one), and the FE flag will be one when the stop bit was incorrect (zero). This flag can be used for detecting out-of-sync conditions, detecting break conditions and protocol handling. The FE flag is not affected by the setting of the USBS bit in UCSRC since the Receiver ignores all, except for the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to UCSRA. The Data OverRun (DOR) flag indicates data loss due to a receiver buffer full condition. A Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in the Receive Shift Register, and a new start bit is detected. If the DOR flag is set there was one or more serial frame lost between the frame last read from UDR, and the next frame read from UDR. For compatibility with future devices, always write this bit to zero when writing to UCSRA. The DOR flag is cleared when the frame received was successfully moved from the Shift Register to the receive buffer. The Parity Error (UPE) Flag indicates that the next frame in the receive buffer had a Parity Error when received. If Parity Check is not enabled the UPE bit will always be read zero. For compatibility with future devices, always set this bit to zero when writing to UCSRA. For more details see “Parity Bit Calculation” on page 125 and “Parity Checker” on page 132. 14.7.5 Parity Checker The Parity Checker is active when the high USART Parity mode (UPM1) bit is set. Type of Parity Check to be performed (odd or even) is selected by the UPM0 bit. When enabled, the Parity133 8246B–AVR–09/11 ATtiny2313A/4313 Checker calculates the parity of the data bits in incoming frames and compares the result with the parity bit from the serial frame. The result of the check is stored in the receive buffer together with the received data and stop bits. The Parity Error (UPE) flag can then be read by software to check if the frame had a Parity Error. The UPE bit is set if the next character that can be read from the receive buffer had a Parity Error when received and the Parity Checking was enabled at that point (UPM1 = 1). This bit is valid until the receive buffer (UDR) is read. 14.7.6 Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing receptions will therefore be lost. When disabled (i.e., the RXEN is set to zero) the Receiver will no longer override the normal function of the RxD port pin. The Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in the buffer will be lost 14.7.7 Flushing the Receive Buffer The receiver buffer FIFO will be flushed when the Receiver is disabled, i.e., the buffer will be emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal operation, due to for instance an error condition, read the UDR I/O location until the RXC flag is cleared. The following code example shows how to flush the receive buffer. Note: 1. See “Code Examples” on page 7. 14.8 Asynchronous Data Reception The USART includes a clock recovery and a data recovery unit for handling asynchronous data reception. The clock recovery logic is used for synchronizing the internally generated baud rate clock to the incoming asynchronous serial frames at the RxD pin. The data recovery logic samples and low pass filters each incoming bit, thereby improving the noise immunity of the Receiver. The asynchronous reception operational range depends on the accuracy of the internal baud rate clock, the rate of the incoming frames, and the frame size in number of bits. 14.8.1 Asynchronous Clock Recovery The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 14-5 illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times Assembly Code Example(1) USART_Flush: sbis UCSRA, RXC ret in r16, UDR rjmp USART_Flush C Code Example(1) void USART_Flush( void ) { unsigned char dummy; while ( UCSRA & (1< MSB MSB 6 5 4 3 2 1 LSB 1 2 3 4 5 6 7 8 6 5 4 3 2 1 LSB USCK USCK DO DI A B C D E CYCLE ( Reference )159 8246B–AVR–09/11 ATtiny2313A/4313 SPITransfer_loop: out USICR,r17 in r16, USISR sbrs r16, USIOIF rjmp SPITransfer_loop in r16,USIDR ret The code is size optimized using only eight instructions (plus return). The code example assumes that the DO and USCK pins have been enabled as outputs in DDRA. The value stored in register r16 prior to the function is called is transferred to the slave device, and when the transfer is completed the data received from the slave is stored back into the register r16. The second and third instructions clear the USI Counter Overflow Flag and the USI counter value. The fourth and fifth instructions set three-wire mode, positive edge clock, count at USITC strobe, and toggle USCK. The loop is repeated 16 times. The following code demonstrates how to use the USI as an SPI master with maximum speed (fSCK = fCK/2): SPITransfer_Fast: out USIDR,r16 ldi r16,(1< 2 CPU clock cycles – When fck >= 12MHz: 3 CPU clock cycles • Minimum high period of serial clock: – When fck < 12MHz: > 2 CPU clock cycles – When fck >= 12MHz: 3 CPU clock cycles VCC GND XTAL1 SCK MISO MOSI RESET +1.8 - 5.5V195 8246B–AVR–09/11 ATtiny2313A/4313 21.3.1 Pin Mapping The pin mapping is listed in Table 21-7. Note that not all parts use the SPI pins dedicated for the internal SPI interface. 21.3.2 Programming Algorithm When writing serial data to the ATtiny2313A/4313, data is clocked on the rising edge of SCK. When reading data from the ATtiny2313A/4313, data is clocked on the falling edge of SCK. See Figure 22-6 on page 205 and Figure 22-7 on page 205 for timing details. To program and verify the ATtiny2313A/4313 in the serial programming mode, the following sequence is recommended (See Table 21-8, “Serial Programming Instruction Set,” on page 196): 1. Power-up sequence: apply power between VCC and GND while RESET and SCK are set to “0” – In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse after SCK has been set to '0'. The duration of the pulse must be at least tRST plus two CPU clock cycles. See Table 22-3 on page 201 for definition of minimum pulse width on RESET pin, tRST 2. Wait for at least 20 ms and then enable serial programming by sending the Programming Enable serial instruction to the MOSI pin 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync, the second byte (0x53) will echo back when issuing the third byte of the Programming Enable instruction – Regardless if the echo is correct or not, all four bytes of the instruction must be transmitted – If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 4 LSB of the address and data together with the Load Program Memory Page instruction. – To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address – The Program Memory Page is stored by loading the Write Program Memory Page instruction with the 6 MSB of the address – If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 21-9 on page 197). Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. The EEPROM can be programmed one byte or one page at a time. Table 21-7. Pin Mapping Serial Programming Symbol Pins I/O Description MOSI PB5 I Serial Data in MISO PB6 O Serial Data out SCK PB7 I Serial Clock196 8246B–AVR–09/11 ATtiny2313A/4313 – A: Byte programming. The EEPROM array is programmed one byte at a time by supplying the address and data together with the Write instruction. EEPROM memory locations are automatically erased before new data is written. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte (See Table 21-9). In a chip erased device, no 0xFFs in the data file(s) need to be programmed – B: Page programming (the EEPROM array is programmed one page at a time). The memory page is loaded one byte at a time by supplying the 6 LSB of the address and data together with the Load EEPROM Memory Page instruction. The EEPROM memory page is stored by loading the Write EEPROM Memory Page Instruction with the 7 MSB of the address. When using EEPROM page access only byte locations loaded with the Load EEPROM Memory Page instruction are altered and the remaining locations remain unchanged. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte (See Table 21-9). In a chip erased device, no 0xFF in the data file(s) need to be programmed 6. Any memory location can be verified by using the Read instruction, which returns the content at the selected address at the serial output pin (MISO) 7. At the end of the programming session, RESET can be set high to commence normal operation 8. Power-off sequence (if required): set RESET to “1”, and turn VCC power off 21.3.3 Programming Instruction Set The instruction set for serial programming is described in Table 21-8. Table 21-8. Serial Programming Instruction Set Instruction Instruction Format Byte 1 Byte 2 Byte 3 Byte4 Operation Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after RESET goes low. Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash. Read Program Memory 0010 H000 0000 00aa bbbb bbbb oooo oooo Read H (high or low) data o from Program memory at word address a:b. Load Program Memory Page 0100 H000 000x xxxx xxxx bbbb iiii iiii Write H (high or low) data i to Program Memory page at word address b. Data low byte must be loaded before Data high byte is applied within the same address. Write Program Memory Page 0100 1100 0000 00aa bbbb xxxx xxxx xxxx Write Program Memory Page at address a:b. Read EEPROM Memory 1010 0000 000x xxxx xbbb bbbb oooo oooo Read data o from EEPROM memory at address b. Write EEPROM Memory 1100 0000 000x xxxx xbbb bbbb iiii iiii Write data i to EEPROM memory at address b. Load EEPROM Memory Page (page access) 1100 0001 0000 0000 0000 00bb iiii iiii Load data i to EEPROM memory page buffer. After data is loaded, program EEPROM page.197 8246B–AVR–09/11 ATtiny2313A/4313 Note: a = address high bits, b = address low bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care If the LSB of RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until this bit returns ‘0’ before the next instruction is carried out. Within the same page, the low data byte must be loaded prior to the high data byte. After data is loaded to the page buffer, program the EEPROM page. 21.4 Programming Time for Flash and EEPROM Flash and EEPROM wait times are listed in Table 21-9. Write EEPROM Memory Page (page access) 1100 0010 00xx xxxx xbbb bb00 xxxx xxxx Write EEPROM page at address b. Read Lock bits 0101 1000 0000 0000 xxxx xxxx xxoo oooo Read Lock bits. “0” = programmed, “1” = unprogrammed. See Table 20-1 on page 178 for details. Write Lock bits 1010 1100 111x xxxx xxxx xxxx 11ii iiii Write Lock bits. Set bits = “0” to program Lock bits. See Table 20-1 on page 178 for details. Read Signature Byte 0011 0000 000x xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b. Write Fuse bits 1010 1100 1010 0000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. Write Fuse High bits 1010 1100 1010 1000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. Write Extended Fuse Bits 1010 1100 1010 0100 xxxx xxxx xxxx xxxi Set bits = “0” to program, “1” to unprogram. Read Fuse bits 0101 0000 0000 0000 xxxx xxxx oooo oooo Read Fuse bits. “0” = programmed, “1” = unprogrammed. Read Fuse High bits 0101 1000 0000 1000 xxxx xxxx oooo oooo Read Fuse High bits. “0” = programmed, “1” = unprogrammed. Read Extended Fuse Bits 0101 0000 0000 1000 xxxx xxxx oooo oooo Read Extended Fuse bits. “0” = programmed, “1” = unprogrammed. Read Calibration Byte 0011 1000 000x xxxx 0000 000b oooo oooo Read Calibration Byte at address b. Poll RDY/BSY 1111 0000 0000 0000 xxxx xxxx xxxx xxxo If o = “1”, a programming operation is still busy. Wait until this bit returns to “0” before applying another command. Table 21-8. Serial Programming Instruction Set Instruction Instruction Format Byte 1 Byte 2 Byte 3 Byte4 Operation Table 21-9. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location Symbol Minimum Wait Delay tWD_FLASH 4.5 ms tWD_EEPROM 4.0 ms tWD_ERASE 9.0 ms tWD_FUSE 4.5 ms198 8246B–AVR–09/11 ATtiny2313A/4313 22. Electrical Characteristics 22.1 Absolute Maximum Ratings* 22.2 DC Characteristics Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ............................................... 40.0 mA DC Current VCC and GND Pins................................ 200.0 mA TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min. Typ. Max. Units VIL Input Low Voltage except XTAL1 and RESET pin VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V -0.5 0.2VCC 0.3VCC V VIH Input High-voltage except XTAL1 and RESET pins VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.7VCC (1) 0.6VCC (1) VCC +0.5 (2) V VIL1 Input Low Voltage XTAL1 pin VCC = 1.8V - 5.5V -0.5 0.1VCC V VIH1 Input High-voltage XTAL1 pin VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.8VCC (1) 0.7VCC (1) VCC +0.5 (2) V VIL2 Input Low Voltage RESET pin VCC = 1.8V - 5.5V -0.5 0.2VCC V VIH2 Input High-voltage RESET pin VCC = 1.8V - 5.5V 0.9VCC (1) VCC +0.5 (2) V VIL3 Input Low Voltage RESET pin as I/O VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V -0.5 0.2VCC 0.3VCC V VIH3 Input High-voltage RESET pin as I/O VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.7VCC (1) 0.6VCC (1) VCC +0.5 (2) V VOL Output Low Voltage(3) (Except Reset Pin)(5) IOL = 20 mA, VCC = 5V IOL = 10mA, VCC = 3V 0.8 0.6 V V VOH Output High-voltage(4) (Except Reset Pin)(5) IOH = -20 mA, VCC = 5V IOH = -10 mA, VCC = 3V 4.2 2.4 V V I IL Input Leakage Current I/O Pin VCC = 5.5V, pin low (absolute value) 1(6) µA IIH Input Leakage Current I/O Pin VCC = 5.5V, pin high (absolute value) 1(6) µA RRST Reset Pull-up Resistor 30 60 kΩ Rpu I/O Pin Pull-up Resistor 20 50 kΩ199 8246B–AVR–09/11 ATtiny2313A/4313 Notes: 1. “Min” means the lowest value where the pin is guaranteed to be read as high. 2. “Max” means the highest value where the pin is guaranteed to be read as low. 3. Although each I/O port can sink more than the test conditions (20 mA at VCC = 5V, 10 mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: 1] The sum of all IOL, for all ports, should not exceed 60 mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20 mA at VCC = 5V, 10 mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: 1] The sum of all IOH, for all ports, should not exceed 60 mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 5. The RESET pin must tolerate high voltages when entering and operating in programming modes and, as a consequence, has a weak drive strength as compared to regular I/O pins. See Figure 23-29 and Figure 23-30. 6. These are test limits, which account for leakage currents of the test environment. Actual device leakage currents are lower. 7. Values using methods described in “Minimizing Power Consumption” on page 36. Power Reduction is enabled (PRR = 0xFF), the external clock is selected (CKSEL = 0000), and there is no I/O drive. 8. BOD Disabled. I CC Power Supply Current Active 1MHz, VCC = 2V(7) 0.2 0.55 mA Active 4MHz, VCC = 3V(7) 1.3 2.5 mA Active 8MHz, VCC = 5V(7) 3.9 7 mA Idle 1MHz, VCC = 2V(7) 0.03 0.15 mA Idle 4MHz, VCC = 3V(7) 0.25 0.6 mA Idle 8MHz, VCC = 5V(7) 1 2 mA Power-down mode WDT enabled, VCC = 3V(8) 4 10 µA WDT disabled, VCC = 3V(8) < 0.15 2 µA TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) (Continued) Symbol Parameter Condition Min. Typ. Max. Units200 8246B–AVR–09/11 ATtiny2313A/4313 22.3 Speed The maximum operating frequency of the device is dependent on supply voltage, VCC . The relationship between supply voltage and maximum operating frequency is piecewise linear, as shown in Figure 22-1. Figure 22-1. Maximum Frequency vs. VCC 22.4 Clock Characteristics 22.4.1 Calibrated Internal RC Oscillator Accuracy It is possible to manually calibrate the internal oscillator to be more accurate than default factory calibration. Note that the oscillator frequency depends on temperature and voltage. Voltage and temperature characteristics can be found in Figure 23-46 on page 229, and Figure 23-47 on page 230. Notes: 1. Accuracy of oscillator frequency at calibration point (fixed temperature and fixed voltage). 4 MHz 1.8V 5.5V 4.5V 20 MHz 2.7V 10 MHz Table 22-1. Calibration Accuracy of Internal RC Oscillator Calibration Method Target Frequency VCC Temperature Accuracy at given Voltage & Temperature(1) Factory Calibration 4.0 / 8.0MHz 3V 25°C ±10% User Calibration Fixed frequency within: 3.1 – 4.7 MHz / 7.3 – 9.1MHz Fixed voltage within: 1.8V – 5.5V Fixed temperature within: -40°C – 85°C ±2%201 8246B–AVR–09/11 ATtiny2313A/4313 22.4.2 External Clock Drive Figure 22-2. External Clock Drive Waveform 22.5 System and Reset Characteristics Notes: 1. When RESET pin used as reset (not as I/O). 2. Not tested in production. VIL1 VIH1 Table 22-2. External Clock Drive Symbol Parameter VCC = 1.8 - 5.5V VCC = 2.7 - 5.5V VCC = 4.5 - 5.5V Min. Max. Min. Max. Min. Max. Units 1/tCLCL Clock Frequency 0 4 0 10 0 20 MHz tCLCL Clock Period 250 100 50 ns tCHCX High Time 100 40 20 ns tCLCX Low Time 100 40 20 ns tCLCH Rise Time 2.0 1.6 0.5 µs tCHCL Fall Time 2.0 1.6 0.5 µs ΔtCLCL Change in period from one clock cycle to the next 2 2 2 % Table 22-3. Reset, Brown-out, and Internal Voltage Characteristics Symbol Parameter Condition Min Typ Max Units VRST RESET Pin Threshold Voltage 0.2 VCC 0.8VCC V t RST Minimum pulse width on RESET Pin (1)(2) VCC = 1.8 - 5.5V 2.5 µs VHYST Brown-out Detector Hysteresis (2) 50 mV tBOD Min Pulse Width on Brown-out Reset (2) 2 µs VBG Internal bandgap reference voltage VCC = 2.7V TA = 25°C 1.0 1.1 1.2 V tBG Internal bandgap reference start-up time (2) VCC = 2.7V TA = 25°C 40 70 µs IBG Internal bandgap reference current consumption (2) VCC = 2.7V TA = 25°C 15 µA202 8246B–AVR–09/11 ATtiny2313A/4313 22.5.1 Enhanced Power-On Reset Notes: 1. Values are guidelines, only. 2. Threshold where device is released from reset when voltage is rising. 3. The Power-on Reset will not work unless the supply voltage has been below VPOA. 22.5.2 Brown-Out Detection Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. 22.6 Analog Comparator Characteristics Note: All parameters are based on simulation results and they are not tested in production Table 22-4. Characteristics of Enhanced Power-On Reset. TA = -40 – 85°C Symbol Parameter Min(1) Typ(1) Max(1) Units VPOR Release threshold of power-on reset (2) 1.1 1.4 1.6 V VPOA Activation threshold of power-on reset (3) 0.6 1.3 1.6 V SRON Power-On Slope Rate 0.01 V/ms Table 22-5. VBOT vs. BODLEVEL Fuse Coding BODLEVEL [1:0] Fuses Min(1) Typ(1) Max(1) Units 11 BOD Disabled 10 1.7 1.8 2.0 01 2.5 2.7 2.9 V 00 4.1 4.3 4.5 Table 22-6. Analog Comparator Characteristics, TA = -40°C - 85°C Symbol Parameter Condition Min Typ Max Units VACIO Input Offset Voltage VCC = 5V, VIN = VCC / 2 < 10 40 mV IACLK Input Leakage Current VCC = 5V, VIN = VCC / 2 -50 50 nA tACPD Analog Propagation Delay (from saturation to slight overdrive) VCC = 2.7V 750 ns VCC = 4.0V 500 Analog Propagation Delay (large step change) VCC = 2.7V 100 VCC = 4.0V 75 tDPD Digital Propagation Delay VCC = 1.8V - 5.5 1 2 CLK203 8246B–AVR–09/11 ATtiny2313A/4313 22.7 Parallel Programming Characteristics Notes: 1. tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse bits and Write Lock bits commands. 2. tWLRH_CE is valid for the Chip Erase command. Table 22-7. Parallel Programming Characteristics, VCC = 5V ± 10% Symbol Parameter Min Typ Max Units VPP Programming Enable Voltage 11.5 12.5 V I PP Programming Enable Current 250 μA t DVXH Data and Control Valid before XTAL1 High 67 ns tXLXH XTAL1 Low to XTAL1 High 200 ns tXHXL XTAL1 Pulse Width High 150 ns tXLDX Data and Control Hold after XTAL1 Low 67 ns tXLWL XTAL1 Low to WR Low 0 ns tXLPH XTAL1 Low to PAGEL high 0 ns tPLXH PAGEL low to XTAL1 high 150 ns tBVPH BS1 Valid before PAGEL High 67 ns tPHPL PAGEL Pulse Width High 150 ns tPLBX BS1 Hold after PAGEL Low 67 ns tWLBX BS2/1 Hold after WR Low 67 ns tPLWL PAGEL Low to WR Low 67 ns tBVWL BS1 Valid to WR Low 67 ns tWLWH WR Pulse Width Low 150 ns tWLRL WR Low to RDY/BSY Low 0 1 μs t WLRH WR Low to RDY/BSY High(1) 3.7 4.5 ms tWLRH_CE WR Low to RDY/BSY High for Chip Erase(2) 7.5 9 ms tXLOL XTAL1 Low to OE Low 0 ns tBVDV BS1 Valid to DATA valid 0 1000 ns tOLDV OE Low to DATA Valid 1000 ns t OHDZ OE High to DATA Tri-stated 1000 ns204 8246B–AVR–09/11 ATtiny2313A/4313 Figure 22-3. Parallel Programming Timing, Including some General Timing Requirements Figure 22-4. Parallel Programming Timing, Loading Sequence with Timing Requirements(1) Note: 1. The timing requirements shown in Figure 22-3 (i.e., tDVXH, tXHXL, and tXLDX) also apply to loading operation. Figure 22-5. Parallel Programming Timing, Reading Sequence (within the Same Page) with Timing Requirements(1) Note: 1. The timing requirements shown in Figure 22-3 (i.e., tDVXH, tXHXL, and tXLDX) also apply to reading operation. Data & Contol (DATA, XA0/1, BS1, BS2) XTAL1 t XHXL t WLWH t DVXH t XLDX t PLWL t WLRH WR RDY/BSY PAGEL t PHPL t PLBX t BVPH t XLWL t WLBX tBVWL WLRL XTAL1 PAGEL t XLXH PLXH t t XLPH DATA ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte) BS1 XA0 XA1 LOAD ADDRESS (LOW BYTE) LOAD DATA (LOW BYTE) LOAD DATA (HIGH BYTE) LOAD DATA LOAD ADDRESS (LOW BYTE) XTAL1 OE DATA ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte) BS1 XA0 XA1 LOAD ADDRESS (LOW BYTE) READ DATA (LOW BYTE) READ DATA (HIGH BYTE) LOAD ADDRESS (LOW BYTE) t BVDV t OLDV t XLOL t OHDZ205 8246B–AVR–09/11 ATtiny2313A/4313 22.8 Serial Programming Characteristics Figure 22-6. Serial Programming Timing Note: 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz Figure 22-7. Serial Programming Waveform Table 22-8. Serial Programming Characteristics, TA = -40°C to 85°C, VCC = 1.8 - 5.5V (Unless Otherwise Noted) Symbol Parameter Min Typ Max Units 1/tCLCL Oscillator Frequency (ATtiny2313A/4313) 0 4 MHz tCLCL Oscillator Period (ATtiny2313A/4313) 250 ns 1/tCLCL Oscillator Frequency (ATtiny2313A/4313, VCC = 4.5V - 5.5V) 0 20 MHz t CLCL Oscillator Period (ATtiny2313A/4313, VCC = 4.5V - 5.5V) 50 ns tSHSL SCK Pulse Width High 2 tCLCL* ns tSLSH SCK Pulse Width Low 2 tCLCL* ns tOVSH MOSI Setup to SCK High tCLCL ns t SHOX MOSI Hold after SCK High 2 tCLCL ns tSLIV SCK Low to MISO Valid 100 ns MOSI MISO SCK t OVSH t SHSL t t SHOX SLSH MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUT206 8246B–AVR–09/11 ATtiny2313A/4313 23. Typical Characteristics The data contained in this section is largely based on simulations and characterization of similar devices in the same process and design methods. Thus, the data should be treated as indications of how the part will behave. The following charts show typical behavior. These figures are not tested during manufacturing. During characterisation devices are operated at frequencies higher than test limits but they are not guaranteed to function properly at frequencies higher than the ordering code indicates. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. Current consumption is a function of several factors such as operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. A sine wave generator with rail-to-rail output is used as clock source but current consumption in Power-Down mode is independent of clock selection. The difference between current consumption in Power-Down mode with Watchdog Timer enabled and Power-Down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. The current drawn from pins with a capacitive load may be estimated (for one pin) as follows: where VCC = operating voltage, CL = load capacitance and fSW = average switching frequency of I/O pin. 23.1 Effect of Power Reduction Peripheral modules are enabled and disabled via control bits in the Power Reduction Register. See “Power Reduction Register” on page 35 for details. I CP VCC CL × × f SW ≈ Table 23-1. Additional Current Consumption (Absolute) for Peripherals of ATtiny2313A/4313 PRR bit Typical numbers VCC = 2V, f = 1MHz VCC = 3V, f = 4MHz VCC = 5V, f = 8MHz PRTIM0 2 µA 11 µA 50 µA PRTIM1 5 µA 30 µA 120 µA PRUSI 2 µA 11 µA 50 µA PRUSART 4 µA 22 µA 95 µA207 8246B–AVR–09/11 ATtiny2313A/4313 23.2 ATtiny2313A 23.2.1 Current Consumption in Active Mode Figure 23-1. Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz) Figure 23-2. Active Supply Current vs. Frequency (1 - 20 MHz) ACTIVE SUPPLY CURRENT vs. LOW FREQUENCY (ATtiny2313A) (PRR=0xFF) 5.5 V 5.0 V 4.5 V 3.3 V 2.7 V 1.8 V 0 0,2 0,4 0,6 0,8 1 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) ACTIVE SUPPLY CURRENT vs. FREQUENCY (ATtiny2313A) (PRR=0xFF) 0 2 4 6 8 10 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 1.8V 2.7V 3.3V 4.5V 5.0V 5.5V208 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-3. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) Figure 23-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) ACTIVE SUPPLY CURRENT vs. VCC (ATtiny2313A) INTERNAL RC OSCILLATOR, 8 MHz 85 °C 25 °C -40 °C 0 1 2 3 4 5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) ACTIVE SUPPLY CURRENT vs. VCC (ATtiny2313A) INTERNAL RC OSCILLATOR, 1 MHz 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)209 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-5. Active Supply Current vs. VCC (Internal RC Oscillator, 128 KHz) 23.2.2 Current Consumption in Idle Mode Figure 23-6. Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz) ACTIVE SUPPLY CURRENT vs. VCC (ATtiny2313A) INTERNAL RC OSCILLATOR, 128 KHz 85 °C 25 °C -40 °C 0 0,02 0,04 0,06 0,08 0,1 0,12 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) IDLE SUPPLY CURRENT vs. LOW FREQUENCY (ATtiny2313A) (PRR=0xFF) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0,16 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA)210 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-7. Idle Supply Current vs. Frequency (1 - 20 MHz) Figure 23-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) IDLE SUPPLY CURRENT vs. FREQUENCY (ATtiny2313A) (PRR=0xFF) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,5 1 1,5 2 2,5 3 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) IDLE SUPPLY CURRENT vs. VCC (ATtiny2313A) INTERNAL RC OSCILLATOR, 8 MHz 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)211 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) Figure 23-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 128 KHz) IDLE SUPPLY CURRENT vs. VCC (ATtiny2313A) INTERNAL RC OSCILLATOR, 1 MHz 85 °C 25 °C -40 °C 0 0,05 0,1 0,15 0,2 0,25 0,3 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) IDLE SUPPLY CURRENT vs. VCC (ATtiny2313A) INTERNAL RC OSCILLATOR, 128 KHz 85 °C 25 °C -40 °C 0 0,005 0,01 0,015 0,02 0,025 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)212 8246B–AVR–09/11 ATtiny2313A/4313 23.2.3 Current Consumption in Power-down Mode Figure 23-11. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) Figure 23-12. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) POWER-DOWN SUPPLY CURRENT vs. VCC (ATtiny2313A) WATCHDOG TIMER DISABLED 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) POWER-DOWN SUPPLY CURRENT vs. VCC (ATtiny2313A) WATCHDOG TIMER ENABLED 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 7 8 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)213 8246B–AVR–09/11 ATtiny2313A/4313 23.2.4 Current Consumption in Reset Figure 23-13. Reset Supply Current vs. VCC (0.1 - 1.0 MHz, Excluding Current Through The Reset Pull-up) Figure 23-14. Reset Supply Current vs. VCC (1 - 20 MHz, Excluding Current Through The Reset Pull-up) RESET SUPPLY CURRENT vs. VCC (ATtiny2313A) EXCLUDING CURRENT THROUGH THE RESET PULLUP 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V RESET SUPPLY CURRENT vs. VCC (ATtiny2313A) EXCLUDING CURRENT THROUGH THE RESET PULLUP 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 2,2 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA)214 8246B–AVR–09/11 ATtiny2313A/4313 23.2.5 Current Consumption of Peripheral Units Figure 23-15. Brownout Detector Current vs. VCC Figure 23-16. Programming Current vs. VCC (ATtiny2313A) Note: Above programming current based on simulation and characterisation of similar device (ATtiny24A). BROWNOUT DETECTOR CURRENT vs. VCC (ATtiny2313A) BOD level = 1.8V 85 °C 25 °C -40 °C 0 5 10 15 20 25 30 35 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) PROGRAMMING CURRENT vs. VCC 85 °C 25 °C -40 °C 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)215 8246B–AVR–09/11 ATtiny2313A/4313 23.2.6 Pull-up Resistors Figure 23-17. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 1.8V) Figure 23-18. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 2.7V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE (ATtiny2313A) 0 10 20 30 40 50 60 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VOP (V) IOP (uA) 85 °C 25 °C -40 °C 85 °C 25 °C -40 °C I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE (ATtiny2313A) 0 10 20 30 40 50 60 70 80 90 0 0,5 1 1,5 2 2,5 3 VOP (V) IOP (uA)216 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-19. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 5V) Figure 23-20. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V) 85 °C 25 °C -40 °C I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE (ATtiny2313A) 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 VOP (V) IOP (uA) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE (ATtiny2313A) -40 °C 25 °C 85 °C 0 5 10 15 20 25 30 35 40 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VRESET (V) IRESET (uA)217 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-21. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) Figure 23-22. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) -40 °C 25 °C 85 °C RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE (ATtiny2313A) 0 10 20 30 40 50 60 0 0,5 1 1,5 2 2,5 3 VRESET (V) IRESET (uA) -40 °C 25 °C 85 °C RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE (ATtiny2313A) 0 20 40 60 80 100 120 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 VRESET (V) IRESET (uA)218 8246B–AVR–09/11 ATtiny2313A/4313 23.2.7 Output Driver Strength Figure 23-23. VOL: Output Voltage vs. Sink Current (I/O Pin, VCC = 1.8V) Figure 23-24. VOL: Output Voltage vs. Sink Current (I/O Pin, VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny2313A) Vcc = 1.8V 85 °C 25 °C -40 °C 0 0,05 0,1 0,15 0,2 0,25 0,3 0,35 0,4 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 IOL (mA) VOL (V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny2313A) Vcc = 3V 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0 2 4 6 8 10 IOL (mA) VOL (V)219 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-25. VOL: Output Voltage vs. Sink Current (I/O Pin, VCC = 5V) Figure 23-26. VOH: Output Voltage vs. Source Current (I/O Pin, VCC = 1.8V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny2313A) Vcc = 5V 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0 2 4 6 8 10 12 14 16 18 20 IOL (mA) VOL (V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny2313A) Vcc = 1.8V 85 °C 25 °C -40 °C 1,2 1,3 1,4 1,5 1,6 1,7 1,8 1,9 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 IOH (mA) VOH (V)220 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-27. VOH: Output Voltage vs. Source Current (I/O Pin, VCC = 3V) Figure 23-28. VOH: Output Voltage vs. Source Current (I/O Pin, VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny2313A) Vcc = 3V 85 °C 25 °C -40 °C 2,5 2,6 2,7 2,8 2,9 3 3,1 0 2 4 6 8 10 IOH (mA) VOH (V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny2313A) Vcc = 5V 85 °C 25 °C -40 °C 4,3 4,5 4,7 4,9 5,1 0 5 10 15 20 IOH (mA) VOH (V)221 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-29. VOL: Output Voltage vs. Sink Current (Reset Pin as I/O, T = 25°C) Figure 23-30. VOH: Output Voltage vs. Source Current (Reset Pin as I/O, T = 25°C) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny2313A) 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 0 1 2 3 4 IOL (mA) VOL (V) 5.0 V 1.8 V 3.0 V RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny2313A) 5.0 V 3.0 V 1.8 V 0 1 2 3 4 5 0 0,2 0,4 0,6 0,8 1 IOH (mA) VOH (V)222 8246B–AVR–09/11 ATtiny2313A/4313 23.2.8 Input Thresholds and Hysteresis (for I/O Ports) Figure 23-31. VIH: Input Threshold Voltage vs. VCC (I/O Pin Read as ‘1’) Figure 23-32. VIL: Input Threshold Voltage vs. VCC (I/O Pin, Read as ‘0’) I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny2313A) VIH, IO PIN READ AS '1' 0 0,5 1 1,5 2 2,5 3 3,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny2313A) VIL, IO PIN READ AS '0' 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C223 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-33. VIH-VIL: Input Hysteresis vs. VCC (I/O Pin) Figure 23-34. VIH: Input Threshold Voltage vs. VCC (Reset Pin as I/O, Read as ‘1’) I/O PIN INPUT HYSTERESIS vs. VCC (ATtiny2313A) 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC (ATtiny2313A) VIH, RESET READ AS '1' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)224 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-35. VIL: Input Threshold Voltage vs. VCC (Reset Pin as I/O, Read as ‘0’) Figure 23-36. VIH-VIL: Input Hysteresis vs. VCC (Reset Pin as I/O) RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC (ATtiny2313A) VIL, RESET READ AS '0' 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C RESET PIN AS IO, INPUT HYSTERESIS vs. VCC (ATtiny2313A) VIL, IO PIN READ AS "0" 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V)225 8246B–AVR–09/11 ATtiny2313A/4313 23.2.9 BOD, Bandgap and Reset Figure 23-37. BOD Thresholds vs. Temperature (BOD Level is 4.3V) Figure 23-38. BOD Thresholds vs. Temperature (BOD Level is 2.7V) BOD THRESHOLDS vs. TEMPERATURE (BOD Level set to 4.3V) (ATtiny2313A) BODLEVEL = 4.3V 4,22 4,24 4,26 4,28 4,3 4,32 4,34 4,36 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (C) Threshold (V) VCC RISING VCC FALLING BOD THRESHOLDS vs. TEMPERATURE (BOD Level set to 2.7V) (ATtiny2313A) BODLEVEL = 2.7V 2,66 2,68 2,7 2,72 2,74 2,76 2,78 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) VCC RISING VCC FALLING226 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-39. BOD Thresholds vs. Temperature (BOD Level is 1.8V) Figure 23-40. Bandgap Voltage vs. Supply Voltage BOD THRESHOLDS vs. TEMPERATURE (BOD Level set to 1.8V) (ATtiny2313A) BODLEVEL = 1.8V 1,78 1,79 1,8 1,81 1,82 1,83 1,84 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) VCC RISING VCC FALLING BANDGAP VOLTAGE vs. VCC (ATtiny2313A) CALIBRATED 0,95 1 1,05 1,1 1,15 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 Vcc (V) Bandgap Voltage (V)227 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-41. Bandgap Voltage vs. Temperature Figure 23-42. VIH: Input Threshold Voltage vs. VCC (Reset Pin, Read as ‘1’) BANDGAP VOLTAGE vs. TEMP (ATtiny2313A) (Vcc=5V) CALIBRATED 1 1,02 1,04 1,06 1,08 1,1 1,12 1,14 1,16 -40 -20 0 20 40 60 80 100 Temperature Bandgap Voltage (V) RESET INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny2313A) VIH, IO PIN READ AS '1' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)228 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-43. VIL: Input Threshold Voltage vs. VCC (Reset Pin, Read as ‘0’) Figure 23-44. VIH-VIL: Input Hysteresis vs. VCC (Reset Pin) RESET INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny2313A) VIL, IO PIN READ AS '0' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) RESET PIN INPUT HYSTERESIS vs. VCC (ATtiny2313A) 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) 85 °C 25 °C -40 °C229 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-45. Minimum Reset Pulse Width vs. VCC 23.2.10 Internal Oscillator Speed Figure 23-46. Calibrated 8 MHz RC Oscillator Frequency vs. VCC MINIMUM RESET PULSE WIDTH vs. VCC (ATtiny2313A) 85 °C 25 °C -40 °C 0 200 400 600 800 1000 1200 1400 1600 1800 2000 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Pulsewidth (ns) CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE (ATtiny2313A) 7 7,2 7,4 7,6 7,8 8 8,2 8,4 8,6 8,8 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) FRC (MHz) 85 °C 25 °C -40 °C230 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-47. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature Figure 23-48. Calibrated 8 MHz RC Oscillator Frequency vs. Osccal Value CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE (ATtiny2313A) 5.0 V 3.0 V 1.8 V 7 7,5 8 8,5 9 -40 -20 0 20 40 60 80 100 Temperature FRC (MHz) CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE (ATtiny2313A) (Vcc=3V) 85 °C 25 °C -40 °C 0 2 4 6 8 10 12 14 0 16 32 48 64 80 96 112 OSCCAL (X1) FRC (MHz)231 8246B–AVR–09/11 ATtiny2313A/4313 23.3 ATtiny4313 23.3.1 Current Consumption in Active Mode Figure 23-49. Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz) Figure 23-50. Active Supply Current vs. Frequency (1 - 20 MHz) ACTIVE SUPPLY CURRENT vs. LOW FREQUENCY (ATtiny4313) (PRR=0xFF) 5.5 V 5.0 V 4.5 V 3.3 V 2.7 V 1.8 V 0 0,2 0,4 0,6 0,8 1 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) ACTIVE SUPPLY CURRENT vs. FREQUENCY (ATtiny4313) (PRR=0xFF) 0 2 4 6 8 10 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 1.8V 2.7V 3.3V 4.5V 5.0V 5.5V232 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-51. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) Figure 23-52. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) ACTIVE SUPPLY CURRENT vs. VCC (ATtiny4313) INTERNAL RC OSCILLATOR, 8 MHz 85 °C 25 °C -40 °C 0 1 2 3 4 5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) ACTIVE SUPPLY CURRENT vs. VCC (ATtiny4313) INTERNAL RC OSCILLATOR, 1 MHz 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)233 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-53. Active Supply Current vs. VCC (Internal RC Oscillator, 128 KHz) 23.3.2 Current Consumption in Idle Mode Figure 23-54. Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz) ACTIVE SUPPLY CURRENT vs. VCC (ATtiny4313) INTERNAL RC OSCILLATOR, 128 KHz 85 °C 25 °C -40 °C 0 0,02 0,04 0,06 0,08 0,1 0,12 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) IDLE SUPPLY CURRENT vs. LOW FREQUENCY (ATtiny4313) (PRR=0xFF) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0,16 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA)234 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-55. Idle Supply Current vs. Frequency (1 - 20 MHz) Figure 23-56. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) IDLE SUPPLY CURRENT vs. FREQUENCY (ATtiny4313) (PRR=0xFF) 0 0,5 1 1,5 2 2,5 3 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V IDLE SUPPLY CURRENT vs. VCC (ATtiny4313) INTERNAL RC OSCILLATOR, 8 MHz 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)235 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-57. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) Figure 23-58. Idle Supply Current vs. VCC (Internal RC Oscillator, 128 KHz) IDLE SUPPLY CURRENT vs. VCC (ATtiny4313) INTERNAL RC OSCILLATOR, 1 MHz 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) IDLE SUPPLY CURRENT vs. VCC (ATtiny4313) INTERNAL RC OSCILLATOR, 128 KHz 85 °C 25 °C -40 °C 0 0,005 0,01 0,015 0,02 0,025 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)236 8246B–AVR–09/11 ATtiny2313A/4313 23.3.3 Current Consumption in Power-down Mode Figure 23-59. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) Figure 23-60. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) POWER-DOWN SUPPLY CURRENT vs. VCC (ATtiny4313) WATCHDOG TIMER DISABLED 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) POWER-DOWN SUPPLY CURRENT vs. VCC (ATtiny4313) WATCHDOG TIMER ENABLED 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 7 8 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)237 8246B–AVR–09/11 ATtiny2313A/4313 23.3.4 Current Consumption in Reset Figure 23-61. Reset Supply Current vs. VCC (0.1 - 1.0 MHz, Excluding Current Through The Reset Pull-up) Figure 23-62. Reset Supply Current vs. VCC (1 - 20 MHz, Excluding Current Through The Reset Pull-up) RESET SUPPLY CURRENT vs. VCC (ATtiny4313) EXCLUDING CURRENT THROUGH THE RESET PULLUP 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) RESET SUPPLY CURRENT vs. VCC (ATtiny4313) EXCLUDING CURRENT THROUGH THE RESET PULLUP 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 2,2 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V238 8246B–AVR–09/11 ATtiny2313A/4313 23.3.5 Current Consumption of Peripheral Units Figure 23-63. Brownout Detector Current vs. VCC Figure 23-64. Programming Current vs. VCC (ATtiny4313) Note: Above programming current based on simulation and characterisation of similar device (ATtiny44A). BROWNOUT DETECTOR CURRENT vs. VCC (ATtiny4313) BOD level = 1.8V 85 °C 25 °C -40 °C 0 5 10 15 20 25 30 35 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) PROGRAMMING CURRENT vs. VCC 85 °C 25 °C -40 °C 0 2000 4000 6000 8000 10000 12000 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)239 8246B–AVR–09/11 ATtiny2313A/4313 23.3.6 Pull-up Resistors Figure 23-65. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 1.8V) Figure 23-66. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 2.7V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE (ATtiny4313) 0 10 20 30 40 50 60 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VOP (V) IOP (uA) 85 °C 25 °C -40 °C I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE (ATtiny4313) 0 10 20 30 40 50 60 70 80 0 0,5 1 1,5 2 2,5 3 VOP (V) IOP (uA) 85 °C 25 °C -40 °C240 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-67. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 5V) Figure 23-68. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE (ATtiny4313) 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 VOP (V) IOP (uA) 85 °C 25 °C -40 °C RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE (ATtiny4313) 0 5 10 15 20 25 30 35 40 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C241 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-69. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) Figure 23-70. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE (ATtiny4313) 0 10 20 30 40 50 60 0 0,5 1 1,5 2 2,5 3 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE (ATtiny4313) 0 20 40 60 80 100 120 0 1 2 3 4 5 6 VRESET (V) IRESET (uA)242 8246B–AVR–09/11 ATtiny2313A/4313 23.3.7 Output Driver Strength Figure 23-71. VOL: Output Voltage vs. Sink Current (I/O Pin, VCC = 1.8V) Figure 23-72. VOL: Output Voltage vs. Sink Current (I/O Pin, VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny4313) 0 0,05 0,1 0,15 0,2 0,25 0,3 0,35 0,4 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 IOL (mA) VOL (V) VCC = 1.8V 85 °C 25 °C -40 °C I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny4313) 0 0,1 0,2 0,3 0,4 0,5 0,6 0 2 4 6 8 10 IOL (mA) VOL (V) VCC = 3V 85 °C 25 °C -40 °C243 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-73. VOL: Output Voltage vs. Sink Current (I/O Pin, VCC = 5V) Figure 23-74. VOH: Output Voltage vs. Source Current (I/O Pin, VCC = 1.8V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny4313) 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0 2 4 6 8 10 12 14 16 18 20 IOL (mA) VOL (V) VCC = 5V I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny4313) 1 1,2 1,4 1,6 1,8 2 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 IOH (mA) VOH (V) VCC = 1.8V 85 °C 25 °C -40 °C244 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-75. VOH: Output Voltage vs. Source Current (I/O Pin, VCC = 3V) Figure 23-76. VOH: Output Voltage vs. Source Current (I/O Pin, VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny4313) 2,5 2,6 2,7 2,8 2,9 3 3,1 0 2 4 6 8 10 IOH (mA) VOH (V) VCC = 3V 85 °C 25 °C -40 °C I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny4313) 85 °C 25 °C -40 °C 4,3 4,5 4,7 4,9 5,1 0 5 10 15 20 IOH (mA) VOH (V) VCC = 5V245 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-77. VOL: Output Voltage vs. Sink Current (Reset Pin as I/O, T = 25°C) Figure 23-78. VOH: Output Voltage vs. Source Current (Reset Pin as I/O, T = 25°C) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT (ATtiny4313) 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 0 1 2 3 4 IOL (mA) VOL (V) 5.0 V 1.8 V 3.0 V RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT (ATtiny4313) 0 1 2 3 4 5 0 0,2 0,4 0,6 0,8 1 IOH (mA) VOH (V) 5.0V 3.0V 1.8V246 8246B–AVR–09/11 ATtiny2313A/4313 23.3.8 Input Thresholds and Hysteresis (for I/O Ports) Figure 23-79. VIH: Input Threshold Voltage vs. VCC (I/O Pin Read as ‘1’) Figure 23-80. VIL: Input Threshold Voltage vs. VCC (I/O Pin, Read as ‘0’) I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny4313) VIH, IO PIN READ AS '1' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 3,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny4313) VIL, IO PIN READ AS '0' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)247 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-81. VIH-VIL: Input Hysteresis vs. VCC (I/O Pin) Figure 23-82. VIH: Input Threshold Voltage vs. VCC (Reset Pin as I/O, Read as ‘1’) I/O PIN INPUT HYSTERESIS vs. VCC (ATtiny4313) 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC (ATtiny4313) VIH, RESET READ AS '1' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)248 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-83. VIL: Input Threshold Voltage vs. VCC (Reset Pin as I/O, Read as ‘0’) Figure 23-84. VIH-VIL: Input Hysteresis vs. VCC (Reset Pin as I/O) RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC (ATtiny4313) VIL, RESET READ AS '0' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) RESET PIN AS IO, INPUT HYSTERESIS vs. VCC (ATtiny4313) VIL, IO PIN READ AS "0" 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V)249 8246B–AVR–09/11 ATtiny2313A/4313 23.3.9 BOD, Bandgap and Reset Figure 23-85. BOD Thresholds vs. Temperature (BOD Level is 4.3V) Figure 23-86. BOD Thresholds vs. Temperature (BOD Level is 2.7V) BOD THRESHOLDS vs. TEMPERATURE (BOD Level set to 4.3V) (ATtiny4313) BOD Level = 4.3V 4,16 4,18 4,2 4,22 4,24 4,26 4,28 4,3 4,32 4,34 4,36 4,38 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (C) Threshold (V) VCC RISING VCC FALLING BOD THRESHOLDS vs. TEMPERATURE (BOD Level set to 2.7V) (ATtiny4313) BOD Level = 2.7V 2,62 2,64 2,66 2,68 2,7 2,72 2,74 2,76 2,78 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) VCC RISING VCC FALLING250 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-87. BOD Thresholds vs. Temperature (BOD Level is 1.8V) Figure 23-88. Bandgap Voltage vs. Supply Voltage 1,76 1,77 1,78 1,79 1,8 1,81 1,82 1,83 1,84 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) BOD THRESHOLDS vs. TEMPERATURE (BOD Level set to 1.8V) (ATtiny4313) BOD Level = 1.8V VCC RISING VCC FALLING BANDGAP VOLTAGE vs. VCC (ATtiny4313) CALIBRATED 0,95 1 1,05 1,1 1,15 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Bandgap Voltage (V)251 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-89. Bandgap Voltage vs. Temperature Figure 23-90. VIH: Input Threshold Voltage vs. VCC (Reset Pin, Read as ‘1’) BANDGAP VOLTAGE vs. TEMP (ATtiny4313) (Vcc=5V) CALIBRATED 1 1,02 1,04 1,06 1,08 1,1 1,12 1,14 -40 -20 0 20 40 60 80 100 Temperature Bandgap Voltage (V) RESET INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny4313) VIH, IO PIN READ AS '1' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)252 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-91. VIL: Input Threshold Voltage vs. VCC (Reset Pin, Read as ‘0’) Figure 23-92. VIH-VIL: Input Hysteresis vs. VCC (Reset Pin) RESET INPUT THRESHOLD VOLTAGE vs. VCC (ATtiny4313) VIL, IO PIN READ AS '0' 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) RESET PIN INPUT HYSTERESIS vs. VCC (ATtiny4313) 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V)253 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-93. Minimum Reset Pulse Width vs. VCC 23.3.10 Internal Oscillator Speed Figure 23-94. Calibrated 8 MHz RC Oscillator Frequency vs. VCC MINIMUM RESET PULSE WIDTH vs. VCC (ATtiny4313) 85 °C 25 °C -40 °C 0 200 400 600 800 1000 1200 1400 1600 1800 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Pulsewidth (ns) CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE (ATtiny4313) 7,2 7,4 7,6 7,8 8 8,2 8,4 8,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) FRC (MHz) 85 °C 25 °C -40 °C254 8246B–AVR–09/11 ATtiny2313A/4313 Figure 23-95. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature Figure 23-96. Calibrated 8 MHz RC Oscillator Frequency vs. Osccal Value CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE (ATtiny4313) 5.0 V 3.0 V 1.8 V 7,4 7,6 7,8 8 8,2 8,4 8,6 -40 -20 0 20 40 60 80 100 Temperature FRC (MHz) CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE (ATtiny4313) (Vcc=3V) 85 °C 25 °C -40 °C 0 2 4 6 8 10 12 14 0 16 32 48 64 80 96 112 OSCCAL (X1) FRC (MHz)255 8246B–AVR–09/11 ATtiny2313A/4313 24. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F (0x5F) SREG I T H S V N Z C 9 0x3E (0x5E) Reserved – – – – – – – – 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 12 0x3C (0x5C) OCR0B Timer/Counter0 – Compare Register B 86 0x3B (0x5B) GIMSK INT1 INT0 PCIE0 PCIE2 PCIE1 – – – 52 0x3A (0x5A) GIFR INTF1 INTF0 PCIF0 PCIF2 PCIF1 – – – 53 0x39 (0x59) TIMSK TOIE1 OCIE1A OCIE1B – ICIE1 OCIE0B TOIE0 OCIE0A 87, 116 0x38 (0x58) TIFR TOV1 OCF1A OCF1B – ICF1 OCF0B TOV0 OCF0A 87, 117 0x37 (0x57) SPMCSR – – RSIG CTPB RFLB PGWRT PGERS SPMEN 176 0x36 (0x56) OCR0A Timer/Counter0 – Compare Register A 86 0x35 (0x55) MCUCR PUD SM1 SE SM0 ISC11 ISC10 ISC01 ISC00 37, 51, 69 0x34 (0x54) MCUSR – – – – WDRF BORF EXTRF PORF 45 0x33 (0x53) TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 85 0x32 (0x52) TCNT0 Timer/Counter0 (8-bit) 86 0x31 (0x51) OSCCAL – CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 32 0x30 (0x50) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 82 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 111 0x2E (0x4E) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 113 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High Byte 115 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low Byte 115 0x2B (0x4B) OCR1AH Timer/Counter1 – Compare Register A High Byte 115 0x2A (0x4A) OCR1AL Timer/Counter1 – Compare Register A Low Byte 115 0x29 (0x49) OCR1BH Timer/Counter1 – Compare Register B High Byte 115 0x28 (0x48) OCR1BL Timer/Counter1 – Compare Register B Low Byte 115 0x27 (0x47) Reserved – – – – – – – – 0x26 (0x46) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 32 0x25 (0x45) ICR1H Timer/Counter1 - Input Capture Register High Byte 116 0x24 (0x44) ICR1L Timer/Counter1 - Input Capture Register Low Byte 116 0x23 (0x43) GTCCR – – – – – – – PSR10 119 0x22 (ox42) TCCR1C FOC1A FOC1B – – – – – – 114 0x21 (0x41) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 45 0x20 (0x40) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 54 0x1F (0x3F) Reserved – – – – – – – – 0x1E (0x3E) EEAR – EEPROM Address Register 24 0x1D (0x3D) EEDR EEPROM Data Register 23 0x1C (0x3C) EECR – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE 24 0x1B (0x3B) PORTA – – – – – PORTA2 PORTA1 PORTA0 69 0x1A (0x3A) DDRA – – – – – DDA2 DDA1 DDA0 69 0x19 (0x39) PINA – – – – – PINA2 PINA1 PINA0 70 0x18 (0x38) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 70 0x17 (0x37) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 70 0x16 (0x36) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 70 0x15 (0x35) GPIOR2 General Purpose I/O Register 2 25 0x14 (0x34) GPIOR1 General Purpose I/O Register 1 25 0x13 (0x33) GPIOR0 General Purpose I/O Register 0 25 0x12 (0x32) PORTD – PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 70 0x11 (0x31) DDRD – DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 70 0x10 (0x30) PIND – PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 70 0x0F (0x2F) USIDR USI Data Register 166 0x0E (0x2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 165 0x0D (0x2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 163 0x0C (0x2C) UDR UART Data Register (8-bit) 137 0x0B (0x2B) UCSRA RXC TXC UDRE FE DOR UPE U2X MPCM 138 0x0A (0x2A) UCSRB RXCIE TXCIE UDRIE RXEN TXEN UCSZ2 RXB8 TXB8 139 0x09 (0x29) UBRRL UBRRH[7:0] 141 0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 168 0x07 (0x27) BODCR – – – – – – BODS BODSE 38 0x06 (0x26) PRR – – – – PRTIM1 PRTIM0 PRUSI PRUSART 37 0x05 (0x25) PCMSK2 – PCINT17 PCINT16 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 53 0x04 (0x24) PCMSK1 – – – – – PCINT10 PCINT9 PCINT8 54 0x03 (0x23) UCSRC UMSEL1 UMSEL0 UPM1 UPM0 USBS UCSZ1 UCSZ0 UCPOL 140 0x02 (0x22) UBRRH – – – – UBRRH[11:8] 141 0x01 (0x21) DIDR – – – – – – AIN1D AIN0D 169 0x00 (0x20) USIBR USI Buffer Register 167256 8246B–AVR–09/11 ATtiny2313A/4313 Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the status flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such status flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 4. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. 257 8246B–AVR–09/11 ATtiny2313A/4313 25. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 BRANCH INSTRUCTIONS RJMP k Relative Jump PC ← PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC ← Z None 2 RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ← Z None 3 RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1258 8246B–AVR–09/11 ATtiny2313A/4313 ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Twos Complement Overflow. V ← 1 V1 CLV Clear Twos Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd ← Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 LPM Load Program Memory R0 ← (Z) None 3 LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 SPM Store Program Memory (Z) ← R1:R0 None - IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 BREAK Break For On-chip Debug Only None N/A Mnemonics Operands Description Operation Flags #Clocks259 8246B–AVR–09/11 ATtiny2313A/4313 26. Ordering Information Notes: 1. For speed vs. supply voltage, see section 22.3 “Speed” on page 200. 2. All packages are Pb-free, halide-free and fully green, and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Code indicators: – H: NiPdAu lead finish – U or N: matte tin – R: tape & reel 4. Can also be supplied in wafer form. Contact your local Atmel sales office for ordering information and minimum quantities. 5. NiPdAu finish 6. Topside markings : – 1st Line: T2313 – 2nd Line: Axx – 3rd Line: xxx 26.1 ATtiny2313A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) 20 1.8 – 5.5 Industrial (-40°C to +85°C) (4) 20P3 ATtiny2313A-PU 20S ATtiny2313A-SU ATtiny2313A-SUR 20M1 ATtiny2313A-MU ATtiny2313A-MUR 20M2 (5)(6) ATtiny2313A-MMH ATtiny2313A-MMHR Package Type 20P3 20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 20S 20-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead / Micro Lead Frame Package (MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN)260 8246B–AVR–09/11 ATtiny2313A/4313 Notes: 1. For speed vs. supply voltage, see section 22.3 “Speed” on page 200. 2. All packages are Pb-free, halide-free and fully green, and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Code indicators: – H: NiPdAu lead finish – U or N: matte tin – R: tape & reel 4. Can also be supplied in wafer form. Contact your local Atmel sales office for ordering information and minimum quantities. 5. NiPdAu finish 6. Topside markings: – 1st Line: T4313 – 2nd Line: Axx – 3rd Line: xxx 26.2 ATtiny4313 Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) 20 1.8 – 5.5 Industrial (-40°C to +85°C) (4) 20P3 ATtiny4313-PU 20S ATtiny4313-SU ATtiny4313-SUR 20M1 ATtiny4313-MU ATtiny4313-MUR 20M2 (5)(6) ATtiny4313-MMH ATtiny4313-MMHR Package Type 20P3 20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 20S 20-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN)261 8246B–AVR–09/11 ATtiny2313A/4313 27. Packaging Information 27.1 20P3 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual Inline Package (PDIP) 20P3 D 2010-10-19 PIN 1 E1 A1 B E B1 C L SEATING PLANE A D e eB eC COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 5.334 A1 0.381 – – D 25.493 – 25.984 Note 2 E 7.620 – 8.255 E1 6.096 – 7.112 Note 2 B 0.356 – 0.559 B1 1.270 – 1.551 L 2.921 – 3.810 C 0.203 – 0.356 eB – – 10.922 eC 0.000 – 1.524 e 2.540 TYP Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). 262 8246B–AVR–09/11 ATtiny2313A/4313 27.2 20S263 8246B–AVR–09/11 ATtiny2313A/4313 27.3 20M1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 20M1 A 10/27/04 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) A 0.70 0.75 0.80 A1 – 0.01 0.05 A2 0.20 REF b 0.18 0.23 0.30 D 4.00 BSC D2 2.45 2.60 2.75 E 4.00 BSC E2 2.45 2.60 2.75 e 0.50 BSC L 0.35 0.40 0.55 SIDE VIEW Pin 1 ID Pin #1 Notch (0.20 R) BOTTOM VIEW TOP VIEW Note: Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D E e A2 A1 A D2 E2 0.08 C L 1 2 3 b 1 2 3264 8246B–AVR–09/11 ATtiny2313A/4313 27.4 20M2 TITLE GPC DRAWING NO. REV. Package Drawing Contact: packagedrawings@atmel.com ZFC B 20M2 20M2, 20-pad, 3 x 3 x 0.85 mm Body, Lead Pitch 0.45 mm, 1.55 x 1.55 mm Exposed Pad, Thermally Enhanced Plastic Very Thin Quad Flat No Lead Package (VQFN) 10/24/08 15 14 13 12 11 1 2 3 4 5 16 17 18 19 20 10 9 8 7 6 D2 E2 e b L K Pin #1 Chamfer (C 0.3) D E SIDE VIEW A1 y Pin 1 ID BOTTOM VIEW TOP VIEW A C C0.18 (8X) 0.3 Ref (4x) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.75 0.80 0.85 A1 0.00 0.02 0.05 b 0.17 0.22 0.27 C 0.152 D 2.90 3.00 3.10 D2 1.40 1.55 1.70 E 2.90 3.00 3.10 E2 1.40 1.55 1.70 e – 0.45 – L 0.35 0.40 0.45 K 0.20 – – y 0.00 – 0.08 265 8246B–AVR–09/11 ATtiny2313A/4313 28. Errata The revision letters in this section refer to the revision of the corresponding ATtiny2313A/4313 device. 28.1 ATtiny2313A 28.1.1 Rev. D No known errata. 28.1.2 Rev. A – C These device revisions were referred to as ATtiny2313/ATtiny2313V. 28.2 ATtiny4313 28.2.1 Rev. A No known errata.266 8246B–AVR–09/11 ATtiny2313A/4313 29. Datasheet Revision History 29.1 Rev. 8246B – 10/11 1. Updated device status from Preliminary to Final. 2. Updated document template. 3. Added order codes for tape&reel devices, on page 259 and page 260 4. Updated figures: – Figure 23-33 on page 223 – Figure 23-44 on page 228 – Figure 23-81 on page 247 – Figure 23-92 on page 252 5. Updated sections: – Section 5. “Memories” on page 16 – Section 19. “Self-Programming” on page 173 – Section 20. “Lock Bits, Fuse Bits and Device Signature” on page 178 – Section 21. “External Programming” on page 184 – Section 26. “Ordering Information” on page 259 29.2 Rev. 8246A – 11/09 1. Initial revision. Created from document 2543_t2313. 2. Updated datasheet template. 3. Added VQFN in the Pinout Figure 1-1 on page 2. 4. Added Section 7.2 “Software BOD Disable” on page 35. 5. Added Section 7.3 “Power Reduction Register” on page 35. 6. Updated Table 7-2, “Sleep Mode Select,” on page 37. 7. Added Section 7.5.3 “BODCR – Brown-Out Detector Control Register” on page 38. 8. Added reset disable function in Figure 8-1 on page 39. 9. Added pin change interrupts PCINT1 and PCINT2 in Table 9-1 on page 48. 10. Added PCINT17..8 and PCMSK2..1 in Section 9.2 “External Interrupts” on page 49. 11. Added Section 9.3.4 “PCMSK2 – Pin Change Mask Register 2” on page 53. 12. Added Section 9.3.5 “PCMSK1 – Pin Change Mask Register 1” on page 54. 13. Updated Section 10.2.1 “Alternate Functions of Port A” on page 62. 14. Updated Section 10.2.2 “Alternate Functions of Port B” on page 63. 15. Updated Section 10.2.3 “Alternate Functions of Port D” on page 67. 16. Added UMSEL1 and UMSEL0 in Section 14.10.4 “UCSRC – USART Control and Status Register C” on page 140. 17. Added Section 15. “USART in SPI Mode” on page 146. 18. Added USI Buffer Register (USIBR) in Section 16.2 “Overview” on page 156 and in Figure 16-1 on page 156. 19. Added Section 16.5.4 “USIBR – USI Buffer Register” on page 167. 20. Updated Section 19.6.3 “Reading Device Signature Imprint Table from Firmware” on page 175.267 8246B–AVR–09/11 ATtiny2313A/4313 21. Updated Section 19.7.1 “SPMCSR – Store Program Memory Control and Status Register” on page 176. 22. Added Section 20.3 “Device Signature Imprint Table” on page 180. 23. Updated Section 20.3.1 “Calibration Byte” on page 181. 24. Changed BS to BS1 in Section 20.6.13 “Reading the Signature Bytes” on page 189. 25. Updated Section 22.2 “DC Characteristics” on page 198. 26. Added Section 23.1 “Effect of Power Reduction” on page 206. 27. Updated characteristic plots in Section 23. “Typical Characteristics” for ATtiny2313A (pages 207 - 230), and added plots for ATtiny4313 (pages 231 - 254). 28. Updated Section 24. “Register Summary” on page 255 . 29. Updated Section 26. “Ordering Information” on page 259, added the package type 20M2 and the ordering code -MMH (VQFN), and added the topside marking note.268 8246B–AVR–09/11 ATtiny2313A/4313i 8246B–AVR–09/11 ATtiny2313A/4313 Table of Contents Features ..................................................................................................... 1 1 Pin Configurations ................................................................................... 2 1.1 Pin Descriptions .................................................................................................3 2 Overview ................................................................................................... 5 2.1 Block Diagram ...................................................................................................5 2.2 Comparison Between ATtiny2313A and ATtiny4313 ........................................6 3 About ......................................................................................................... 7 3.1 Resources .........................................................................................................7 3.2 Code Examples .................................................................................................7 3.3 Data Retention ...................................................................................................7 4 CPU Core .................................................................................................. 8 4.1 Architectural Overview .......................................................................................8 4.2 ALU – Arithmetic Logic Unit ...............................................................................9 4.3 Status Register ..................................................................................................9 4.4 General Purpose Register File ........................................................................10 4.5 Stack Pointer ...................................................................................................12 4.6 Instruction Execution Timing ...........................................................................12 4.7 Reset and Interrupt Handling ...........................................................................13 5 Memories ................................................................................................ 15 5.1 Program Memory (Flash) .................................................................................15 5.2 Data Memory (SRAM) and Register Files .......................................................16 5.3 Data Memory (EEPROM) ................................................................................17 5.4 Register Description ........................................................................................22 6 Clock System ......................................................................................... 25 6.1 Clock Subsystems ...........................................................................................25 6.2 Clock Sources .................................................................................................26 6.3 System Clock Prescaler ..................................................................................30 6.4 Clock Output Buffer .........................................................................................31 6.5 Register Description ........................................................................................31 7 Power Management and Sleep Modes ................................................. 33 7.1 Sleep Modes ....................................................................................................33 7.2 Software BOD Disable .....................................................................................34ii 8246B–AVR–09/11 ATtiny2313A/4313 7.3 Power Reduction Register ...............................................................................34 7.4 Minimizing Power Consumption ......................................................................35 7.5 Register Description ........................................................................................36 8 System Control and Reset .................................................................... 38 8.1 Resetting the AVR ...........................................................................................38 8.2 Reset Sources .................................................................................................39 8.3 Internal Voltage Reference ..............................................................................41 8.4 Watchdog Timer ..............................................................................................41 8.5 Register Description ........................................................................................44 9 Interrupts ................................................................................................ 47 9.1 Interrupt Vectors ..............................................................................................47 9.2 External Interrupts ...........................................................................................48 9.3 Register Description ........................................................................................50 10 I/O-Ports .................................................................................................. 54 10.1 Ports as General Digital I/O .............................................................................55 10.2 Alternate Port Functions ..................................................................................59 10.3 Register Description ........................................................................................68 11 8-bit Timer/Counter0 with PWM ............................................................ 70 11.1 Features ..........................................................................................................70 11.2 Overview ..........................................................................................................70 11.3 Clock Sources .................................................................................................71 11.4 Counter Unit ....................................................................................................71 11.5 Output Compare Unit .......................................................................................72 11.6 Compare Match Output Unit ............................................................................74 11.7 Modes of Operation .........................................................................................75 11.8 Timer/Counter Timing Diagrams .....................................................................79 11.9 Register Description ........................................................................................81 12 16-bit Timer/Counter1 ............................................................................ 88 12.1 Features ..........................................................................................................88 12.2 Overview ..........................................................................................................88 12.3 Timer/Counter Clock Sources .........................................................................90 12.4 Counter Unit ....................................................................................................90 12.5 Input Capture Unit ...........................................................................................91 12.6 Output Compare Units .....................................................................................93iii 8246B–AVR–09/11 ATtiny2313A/4313 12.7 Compare Match Output Unit ............................................................................95 12.8 Modes of Operation .........................................................................................96 12.9 Timer/Counter Timing Diagrams ...................................................................104 12.10 Accessing 16-bit Registers ............................................................................106 12.11 Register Description ......................................................................................110 13 Timer/Counter0 and Timer/Counter1 Prescalers .............................. 117 13.1 Internal Clock Source ....................................................................................117 13.2 Prescaler Reset .............................................................................................117 13.3 External Clock Source ...................................................................................117 13.4 Register Description ......................................................................................118 14 USART ................................................................................................... 119 14.1 Features ........................................................................................................119 14.2 Overview ........................................................................................................119 14.3 Clock Generation ...........................................................................................120 14.4 Frame Formats ..............................................................................................123 14.5 USART Initialization .......................................................................................124 14.6 Data Transmission – The USART Transmitter ..............................................125 14.7 Data Reception – The USART Receiver .......................................................129 14.8 Asynchronous Data Reception ......................................................................132 14.9 Multi-processor Communication Mode ..........................................................135 14.10 Register Description ......................................................................................136 14.11 Examples of Baud Rate Setting .....................................................................141 15 USART in SPI Mode ............................................................................. 145 15.1 Features ........................................................................................................145 15.2 Overview ........................................................................................................145 15.3 Clock Generation ...........................................................................................145 15.4 SPI Data Modes and Timing ..........................................................................146 15.5 Frame Formats ..............................................................................................147 15.6 Data Transfer .................................................................................................149 15.7 AVR USART MSPIM vs. AVR SPI ................................................................151 15.8 Register Description ......................................................................................152 16 USI – Universal Serial Interface .......................................................... 155 16.1 Features ........................................................................................................155 16.2 Overview ........................................................................................................155 16.3 Functional Descriptions .................................................................................156iv 8246B–AVR–09/11 ATtiny2313A/4313 16.4 Alternative USI Usage ...................................................................................162 16.5 Register Description ......................................................................................162 17 Analog Comparator ............................................................................. 167 17.1 Register Description ......................................................................................167 18 debugWIRE On-chip Debug System .................................................. 169 18.1 Features ........................................................................................................169 18.2 Overview ........................................................................................................169 18.3 Physical Interface ..........................................................................................169 18.4 Software Break Points ...................................................................................170 18.5 Limitations of debugWIRE .............................................................................170 18.6 Register Description ......................................................................................171 19 Self-Programming ................................................................................ 172 19.1 Features ........................................................................................................172 19.2 Overview ........................................................................................................172 19.3 Lock Bits ........................................................................................................172 19.4 Self-Programming the Flash ..........................................................................172 19.5 Preventing Flash Corruption ..........................................................................175 19.6 Programming Time for Flash when Using SPM ............................................175 19.7 Register Description ......................................................................................175 20 Lock Bits, Fuse Bits and Device Signature ....................................... 177 20.1 Lock Bits ........................................................................................................177 20.2 Fuse Bits ........................................................................................................178 20.3 Device Signature Imprint Table .....................................................................179 20.4 Reading Lock Bits, Fuse Bits and Signature Data from Software .................180 21 External Programming ........................................................................ 183 21.1 Memory Parametrics .....................................................................................183 21.2 Parallel Programming ....................................................................................183 21.3 Serial Programming .......................................................................................192 21.4 Programming Time for Flash and EEPROM .................................................196 22 Electrical Characteristics .................................................................... 198 22.1 Absolute Maximum Ratings* .........................................................................198 22.2 DC Characteristics .........................................................................................198 22.3 Speed ............................................................................................................199 22.4 Clock Characteristics .....................................................................................200v 8246B–AVR–09/11 ATtiny2313A/4313 22.5 System and Reset Characteristics ................................................................201 22.6 Analog Comparator Characteristics ...............................................................202 22.7 Parallel Programming Characteristics ...........................................................203 22.8 Serial Programming Characteristics ..............................................................205 23 Typical Characteristics ........................................................................ 206 23.1 Effect of Power Reduction .............................................................................206 23.2 ATtiny2313A ..................................................................................................207 23.3 ATtiny4313 ....................................................................................................231 24 Register Summary ............................................................................... 255 25 Instruction Set Summary .................................................................... 257 26 Ordering Information ........................................................................... 259 26.1 ATtiny2313A ..................................................................................................259 26.2 ATtiny4313 ....................................................................................................260 27 Packaging Information ........................................................................ 261 27.1 20P3 ..............................................................................................................261 27.2 20S ................................................................................................................262 27.3 20M1 ..............................................................................................................263 27.4 20M2 ..............................................................................................................264 28 Errata ..................................................................................................... 265 28.1 ATtiny2313A ..................................................................................................265 28.2 ATtiny4313 ....................................................................................................265 29 Datasheet Revision History ................................................................ 266 29.1 Rev. 8246B – 10/11 .......................................................................................266 29.2 Rev. 8246A – 11/09 .......................................................................................2668246B–AVR–09/11 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Limited Unit 01-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site www.atmel.com Technical Support avr@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. 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Features • High Performance, Low Power AVR® 8-bit Microcontroller • Advanced RISC Architecture – 120 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation • High Endurance, Non-volatile Memory Segments – 2K/4K/8K Bytes of In-System, Self-programmable Flash Program Memory • Endurance: 10,000 Write/Erase Cycles – 128/256/512 Bytes of In-System Programmable EEPROM • Endurance: 100,000 Write/Erase Cycles – 128/256/512 Bytes of Internal SRAM – Data Retention: 20 years at 85°C / 100 years at 25°C – Programming Lock for Self-programming Flash & EEPROM Data Security • Peripheral Features – One 8-bit and One 16-bit Timer/Counter with Two PWM Channels, Each – 10-bit ADC • 8 Single-ended Channels • 12 Differential ADC Channel Pairs with Programmable Gain (1x / 20x) – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator – Universal Serial Interface • Special Microcontroller Features – debugWIRE On-chip Debug System – In-System Programmable via SPI Port – Internal and External Interrupt Sources • Pin Change Interrupt on 12 Pins – Low Power Idle, ADC Noise Reduction, Standby and Power-down Modes – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit with Software Disable Function – Internal Calibrated Oscillator – On-chip Temperature Sensor • I/O and Packages – Available in 20-pin QFN/MLF/VQFN, 14-pin SOIC, 14-pin PDIP and 15-ball UFBGA – Twelve Programmable I/O Lines • Operating Voltage: – 1.8 – 5.5V • Speed Grade: – 0 – 4 MHz @ 1.8 – 5.5V – 0 – 10 MHz @ 2.7 – 5.5V – 0 – 20 MHz @ 4.5 – 5.5V • Industrial Temperature Range: -40°C to +85°C • Low Power Consumption – Active Mode: • 210 µA at 1.8V and 1 MHz – Idle Mode: • 33 µA at 1.8V and 1 MHz – Power-down Mode: • 0.1 µA at 1.8V and 25°C 8-bit Microcontroller with 2K/4K/8K Bytes In-System Programmable Flash ATtiny24A ATtiny44A ATtiny84A Rev. 8183F–AVR–06/122 8183F–AVR–06/12 ATtiny24A/44A/84A 1. Pin Configurations Figure 1-1. Pinout of ATtiny24A/44A/84A Table 1-1. UFBGA - Pinout ATtiny24A/44A/84A (top view) 1234 A PA5 PA6 PB2 B PA4 PA7 PB1 PB3 C PA3 PA2 PA1 PB0 D PA0 GND GND VCC 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC (PCINT8/XTAL1/CLKI) PB0 (PCINT9/XTAL2) PB1 (PCINT11/RESET/dW) PB3 (PCINT10/INT0/OC0A/CKOUT) PB2 (PCINT7/ICP/OC0B/ADC7) PA7 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) PA6 GND PA0 (ADC0/AREF/PCINT0) PA1 (ADC1/AIN0/PCINT1) PA2 (ADC2/AIN1/PCINT2) PA3 (ADC3/T0/PCINT3) PA4 (ADC4/USCK/SCL/T1/PCINT4) PA5 (ADC5/DO/MISO/OC1B/PCINT5) PDIP/SOIC 1 2 3 4 5 QFN/MLF/VQFN 15 14 13 12 11 20 19 18 17 16 6 7 8 9 10 NOTE Bottom pad should be soldered to ground. DNC: Do Not Connect DNC DNC GND VCC DNC PA7 (PCINT7/ICP/OC0B/ADC7) PB2 (PCINT10/INT0/OC0A/CKOUT) PB3 (PCINT11/RESET/dW) PB1 (PCINT9/XTAL2) PB0 (PCINT8/XTAL1/CLKI) PA5 DNC DNC DNC PA6 Pin 16: PA6 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) Pin 20: PA5 (ADC5/DO/MISO/OC1B/PCINT5) (ADC4/USCK/SCL/T1/PCINT4) PA4 (ADC3/T0/PCINT3) PA3 (ADC2/AIN1/PCINT2) PA2 (ADC1/AIN0/PCINT1) PA1 (ADC0/AREF/PCINT0) PA03 8183F–AVR–06/12 ATtiny24A/44A/84A 1.1 Pin Descriptions 1.1.1 VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB3:PB0) Port B is a 4-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability except PB3 which has the RESET capability. To use pin PB3 as an I/O pin, instead of RESET pin, program (‘0’) RSTDISBL fuse. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B also serves the functions of various special features of the ATtiny24A/44A/84A as listed in Section 10.2 “Alternate Port Functions” on page 58. 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 20-4 on page 176. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 1.1.5 Port A (PA7:PA0) Port A is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A has alternate functions as analog inputs for the ADC, analog comparator, timer/counter, SPI and pin change interrupt as described in “Alternate Port Functions” on page 58.4 8183F–AVR–06/12 ATtiny24A/44A/84A 2. Overview ATtiny24A/44A/84A are low-power CMOS 8-bit microcontrollers based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny24A/44A/84A achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. Figure 2-1. Block Diagram The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. WATCHDOG TIMER MCU CONTROL REGISTER TIMER/ COUNTER0 DATA DIR. REG.PORT A DATA REGISTER PORT A PROGRAMMING LOGIC TIMING AND CONTROL MCU STATUS REGISTER PORT A DRIVERS PA[7:0] VCC GND + _ ANALOG COMPARATOR 8-BIT DATABUS ADC ISP INTERFACE INTERRUPT UNIT EEPROM INTERNAL OSCILLATOR OSCILLATORS CALIBRATED OSCILLATOR INTERNAL DATA DIR. REG.PORT B DATA REGISTER PORT B PORT B DRIVERS PB[3:0] PROGRAM COUNTER STACK POINTER PROGRAM FLASH SRAM GENERAL PURPOSE REGISTERS INSTRUCTION REGISTER INSTRUCTION DECODER STATUS REGISTER Z Y X ALU CONTROL LINES TIMER/ COUNTER15 8183F–AVR–06/12 ATtiny24A/44A/84A The ATtiny24A/44A/84A provides the following features: 2K/4K/8K byte of In-System Programmable Flash, 128/256/512 bytes EEPROM, 128/256/512 bytes SRAM, 12 general purpose I/O lines, 32 general purpose working registers, an 8-bit Timer/Counter with two PWM channels, a 16-bit timer/counter with two PWM channels, Internal and External Interrupts, a 8-channel 10-bit ADC, programmable gain stage (1x, 20x) for 12 differential ADC channel pairs, a programmable Watchdog Timer with internal oscillator, internal calibrated oscillator, and four software selectable power saving modes. Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. ADC Noise Reduction mode minimizes switching noise during ADC conversions by stopping the CPU and all I/O modules except the ADC. In Power-down mode registers keep their contents and all chip functions are disbaled until the next interrupt or hardware reset. In Standby mode, the crystal/resonator oscillator is running while the rest of the device is sleeping, allowing very fast start-up combined with low power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The onchip ISP Flash allows the Program memory to be re-programmed in-system through an SPI serial interface, by a conventional non-volatile memory programmer or by an on-chip boot code running on the AVR core. The ATtiny24A/44A/84A AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators and Evaluation kits.6 8183F–AVR–06/12 ATtiny24A/44A/84A 3. General Information 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. For I/O Registers located in the extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically, this means “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. Note that not all AVR devices include an extended I/O map. 3.3 Capacitive Touch Sensing Atmel QTouch Library provides a simple to use solution for touch sensitive interfaces on Atmel AVR microcontrollers. The QTouch Library includes support for QTouch® and QMatrix® acquisition methods. Touch sensing is easily added to any application by linking the QTouch Library and using the Application Programming Interface (API) of the library to define the touch channels and sensors. The application then calls the API to retrieve channel information and determine the state of the touch sensor. The QTouch Library is free and can be downloaded from the Atmel website. For more information and details of implementation, refer to the QTouch Library User Guide – also available from the Atmel website. 3.4 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 3.5 Disclaimer Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device has been characterized.7 8183F–AVR–06/12 ATtiny24A/44A/84A 4. CPU Core This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 4.1 Architectural Overview Figure 4-1. Block Diagram of the AVR Architecture In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the Program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the Program memory. This concept enables instructions to be executed in every clock cycle. The Program memory is In-System Reprogrammable Flash memory. Flash Program Memory Instruction Register Instruction Decoder Program Counter Control Lines 32 x 8 General Purpose Registrers ALU Status and Control I/O Lines EEPROM Data Bus 8-bit Data SRAM Direct Addressing Indirect Addressing Interrupt Unit Watchdog Timer Analog Comparator Timer/Counter 0 Timer/Counter 1 Universal Serial Interface ADC8 8183F–AVR–06/12 ATtiny24A/44A/84A The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash Program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, capable of directly addressing the whole address space. Most AVR instructions have a single 16-bit word format but 32-bit wide instructions also exist. The actual instruction set varies, as some devices only implement a part of the instruction set. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. 4.2 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction Set” section for a detailed description. 4.3 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code.9 8183F–AVR–06/12 ATtiny24A/44A/84A The Status Register is neither automatically stored when entering an interrupt routine, nor restored when returning from an interrupt. This must be handled by software. 4.4 General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 4-2 below shows the structure of the 32 general purpose working registers in the CPU. Figure 4-2. AVR CPU General Purpose Working Registers Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 4-2, each register is also assigned a Data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file. 4.4.1 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 4-3 below. Figure 4-3. The X-, Y-, and Z-registers 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 … R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte 15 XH XL 010 8183F–AVR–06/12 ATtiny24A/44A/84A In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the instruction set reference for details). 4.5 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 4.6 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 4-4 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. X-register 7 0 7 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 0 7 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 7 0 7 0 R31 (0x1F) R30 (0x1E)11 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 4-4. The Parallel Instruction Fetches and Instruction Executions Figure 4-5 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 4-5. Single Cycle ALU Operation 4.7 Reset and Interrupt Handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate Program Vector in the Program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. The lowest addresses in the Program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 47. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) clk 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch T1 T2 T3 T4 CPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back T1 T2 T3 T4 clkCPU12 8183F–AVR–06/12 ATtiny24A/44A/84A to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence. Note: See “Code Examples” on page 6. Assembly Code Example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ _CLI(); EECR |= (1< ... ... 9.2 External Interrupts External Interrupts are triggered by the INT0 pin or any of the PCINT[11:0] pins. Observe that, if enabled, the interrupts will trigger even if the INT0 or PCINT[11:0] pins are configured as outputs. This feature provides a way of generating a software interrupt. Pin change 0 interrupts PCI0 will trigger if any enabled PCINT[7:0] pin toggles. Pin change 1 interrupts PCI1 will trigger if any enabled PCINT[11:8] pin toggles. The PCMSK0 and PCMSK1 Registers control which pins contribute to the pin change interrupts. Pin change interrupts on PCINT[11:0] are detected asynchronously, which means that these interrupts can be used for waking the part also from sleep modes other than Idle mode. The INT0 interrupt can be triggered by a falling or rising edge or a low level. This is set up as shown in “MCUCR – MCU Control Register” on page 50. When the INT0 interrupt is enabled and configured as level triggered, the interrupt will trigger as long as the pin is held low. Note that recognition of falling or rising edge interrupts on INT0 requires the presence of an I/O clock, as described in “Clock Sources” on page 25. 9.2.1 Low Level Interrupt A low level interrupt on INT0 is detected asynchronously. This means that the interrupt source can be used for waking the part also from sleep modes other than Idle (the I/O clock is halted in all sleep modes except Idle).49 8183F–AVR–06/12 ATtiny24A/44A/84A Note that if a level triggered interrupt is used for wake-up from Power-down, the required level must be held long enough for the MCU to complete the wake-up to trigger the level interrupt. If the level disappears before the end of the Start-up Time, the MCU will still wake up, but no interrupt will be generated. The start-up time is defined by the SUT and CKSEL fuses, as described in “Clock System” on page 24. If the low level on the interrupt pin is removed before the device has woken up then program execution will not be diverted to the interrupt service routine but continue from the instruction following the SLEEP command. 9.2.2 Pin Change Interrupt Timing A timing example of a pin change interrupt is shown in Figure 9-1. Figure 9-1. Timing of pin change interrupts clk PCINT(0) pin_lat pin_sync pcint_in_(0) pcint_syn pcint_setflag PCIF PCINT(0) pin_sync pcint_syn pin_lat D Q LE pcint_setflag PCIF clk clk PCINT(0) in PCMSK(x) pcint_in_(0) 0 x50 8183F–AVR–06/12 ATtiny24A/44A/84A 9.3 Register Description 9.3.1 MCUCR – MCU Control Register The External Interrupt Control Register A contains control bits for interrupt sense control. • Bits 1:0 – ISC0[1:0]: Interrupt Sense Control 0 Bit 1 and Bit 0 The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corresponding interrupt mask are set. The level and edges on the external INT0 pin that activate the interrupt are defined in Table 9-2. The value on the INT0 pin is sampled before detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low level interrupt is selected, the low level must be held until the completion of the currently executing instruction to generate an interrupt. 9.3.2 GIMSK – General Interrupt Mask Register • Bits 7, 3:0 – Res: Reserved Bits These bits are reserved in the ATtiny24A/44A and will always read as zero. • Bit 6 – INT0: External Interrupt Request 0 Enable When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the external pin interrupt is enabled. The Interrupt Sense Control bits (ISC01 and ISC00) in the External Interrupt Control Register A (EICRA) define whether the external interrupt is activated on rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an interrupt request even if INT0 is configured as an output. The corresponding interrupt of External Interrupt Request 0 is executed from the INT0 Interrupt Vector. • Bit 5 – PCIE1: Pin Change Interrupt Enable 1 When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 1 is enabled. Any change on any enabled PCINT[11:8] pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI1 Interrupt Vector. PCINT[11:8] pins are enabled individually by the PCMSK1 Register. Bit 7 6 5 4 3 2 1 0 0x35 (0x55) BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 MCUCR Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 9-2. Interrupt 0 Sense Control ISC01 ISC00 Description 0 0 The low level of INT0 generates an interrupt request. 0 1 Any logical change on INT0 generates an interrupt request. 1 0 The falling edge of INT0 generates an interrupt request. 1 1 The rising edge of INT0 generates an interrupt request. Bit 7 6 5 4 3 2 1 0 0x3B (0x5B) – INT0 PCIE1 PCIE0 – – – – GIMSK Read/Write R R/W R/W R/W1 R R R R Initial Value 0 0 0 0 0 0 0 051 8183F–AVR–06/12 ATtiny24A/44A/84A • Bit 4 – PCIE0: Pin Change Interrupt Enable 0 When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 0 is enabled. Any change on any enabled PCINT[7:0] pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Interrupt Vector. PCINT[7:0] pins are enabled individually by the PCMSK0 Register. 9.3.3 GIFR – General Interrupt Flag Register • Bits 7, 3:0 – Res: Reserved Bits These bits are reserved in the ATtiny24A/44A and will always read as zero. • Bit 6 – INTF0: External Interrupt Flag 0 When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set (one). If the I-bit in SREG and the INT0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared when INT0 is configured as a level interrupt. • Bit 5 – PCIF1: Pin Change Interrupt Flag 1 When a logic change on any PCINT[11:8] pin triggers an interrupt request, PCIF1 becomes set (one). If the I-bit in SREG and the PCIE1 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. • Bit 4 – PCIF0: Pin Change Interrupt Flag 0 When a logic change on any PCINT[7:0] pin triggers an interrupt request, PCIF becomes set (one). If the I-bit in SREG and the PCIE0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. 9.3.4 PCMSK1 – Pin Change Mask Register 1 • Bits 7:4 – Res: Reserved Bits These bits are reserved in the ATtiny24A/44A and will always read as zero. • Bits 3:0 – PCINT[11:8]: Pin Change Enable Mask 11:8 Each PCINT[11:8] bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT[11:8] is set and the PCIE1 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT[11:8] is cleared, pin change interrupt on the corresponding I/O pin is disabled. Bit 7 6 5 4 3 2 1 0 0x3A (0x5A) – INTF0 PCIF1 PCIF0 – – – – GIFR Read/Write R R/W R/W R/W R R R R Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x20 (0x40) – – – – PCINT11 PCINT10 PCINT9 PCINT8 PCMSK1 Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 052 8183F–AVR–06/12 ATtiny24A/44A/84A 9.3.5 PCMSK0 – Pin Change Mask Register 0 • Bits 7:0 – PCINT[7:0]: Pin Change Enable Mask 7:0 Each PCINT[7:0] bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT[7:0] is set and the PCIE0 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT[7:0] is cleared, pin change interrupt on the corresponding I/O pin is disabled. Bit 7 6 5 4 3 2 1 0 0x12 (0x32) PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 PCMSK0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 053 8183F–AVR–06/12 ATtiny24A/44A/84A 10. I/O Ports All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports. This means that the direction of one port pin can be changed without unintentionally changing the direction of any other pin with the SBI and CBI instructions. The same applies when changing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as input). Each output buffer has symmetrical drive characteristics with both high sink and source capability. The pin driver is strong enough to drive LED displays directly. All port pins have individually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have protection diodes to both VCC and Ground as indicated in Figure 10-1 on page 53. See “Electrical Characteristics” on page 173 for a complete list of parameters. Figure 10-1. I/O Pin Equivalent Schematic All registers and bit references in this section are written in general form. A lower case “x” represents the numbering letter for the port, and a lower case “n” represents the bit number. However, when using the register or bit defines in a program, the precise form must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Registers and bit locations are listed in “Register Description” on page 66. Three I/O memory address locations are allocated for each port, one each for the Data Register – PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input Pins I/O location is read only, while the Data Register and the Data Direction Register are read/write. However, writing a logic one to a bit in the PINx Register, will result in a toggle in the corresponding bit in the Data Register. In addition, the Pull-up Disable – PUD bit in MCUCR disables the pull-up function for all pins in all ports when set. Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on page 54. Most port pins are multiplexed with alternate functions for the peripheral features on the device. How each alternate function interferes with the port pin is described in “Alternate Port Functions” on page 58. Refer to the individual module sections for a full description of the alternate functions. Note that enabling the alternate function of some of the port pins does not affect the use of the other pins in the port as general digital I/O. Cpin Logic Rpu See Figure "General Digital I/O" for Details Pxn54 8183F–AVR–06/12 ATtiny24A/44A/84A 10.1 Ports as General Digital I/O The ports are bi-directional I/O ports with optional internal pull-ups. Figure 10-2 shows a functional description of one I/O-port pin, here generically called Pxn. Figure 10-2. General Digital I/O(1) Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports. 10.1.1 Configuring the Pin Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in “Register Description” on page 66, the DDxn bits are accessed at the DDRx I/O address, the PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address. The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input pin. If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to be configured as an output pin. The port pins are tri-stated when reset condition becomes active, even if no clocks are running. If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port pin is driven low (zero). clk RPx RRx RDx WDx PUD SYNCHRONIZER WDx: WRITE DDRx WRx: WRITE PORTx RRx: READ PORTx REGISTER RPx: READ PORTx PIN PUD: PULLUP DISABLE clkI/O: I/O CLOCK RDx: READ DDRx D L Q Q RESET RESET Q D Q Q Q D CLR PORTxn Q Q D CLR DDxn PINxn DATA BU S SLEEP SLEEP: SLEEP CONTROL Pxn I/O WPx 0 1 WRx WPx: WRITE PINx REGISTER55 8183F–AVR–06/12 ATtiny24A/44A/84A 10.1.2 Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn. Note that the SBI instruction can be used to toggle one single bit in a port. 10.1.3 Switching Between Input and Output When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn} = 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully acceptable, as a high-impedant environment will not notice the difference between a strong high driver and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all pull-ups in all ports. Switching between input with pull-up and output low generates the same problem. The user must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn} = 0b10) as an intermediate step. Table 10-1 summarizes the control signals for the pin value. 10.1.4 Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the PINxn Register bit. As shown in Figure 10-2 on page 54, the PINxn Register bit and the preceding latch constitute a synchronizer. This is needed to avoid metastability if the physical pin changes value near the edge of the internal clock, but it also introduces a delay. Figure 10-3 shows a timing diagram of the synchronization when reading an externally applied pin value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min respectively. Figure 10-3. Synchronization when Reading an Externally Applied Pin value Table 10-1. Port Pin Configurations DDxn PORTxn PUD (in MCUCR) I/O Pull-up Comment 0 0 X Input No Tri-state (Hi-Z) 0 1 0 Input Yes Pxn will source current if ext. pulled low 0 1 1 Input No Tri-state (Hi-Z) 1 0 X Output No Output Low (Sink) 1 1 X Output No Output High (Source) XXX in r17, PINx 0x00 0xFF INSTRUCTIONS SYNC LATCH PINxn r17 XXX SYSTEM CLK tpd, max tpd, min56 8183F–AVR–06/12 ATtiny24A/44A/84A Consider the clock period starting shortly after the first falling edge of the system clock. The latch is closed when the clock is low, and goes transparent when the clock is high, as indicated by the shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed between ½ and 1½ system clock period depending upon the time of assertion. When reading back a software assigned pin value, a nop instruction must be inserted as indicated in Figure 10-4 on page 56. The out instruction sets the “SYNC LATCH” signal at the positive edge of the clock. In this case, the delay tpd through the synchronizer is one system clock period. Figure 10-4. Synchronization when Reading a Software Assigned Pin Value 10.1.5 Digital Input Enable and Sleep Modes As shown in Figure 10-2 on page 54, the digital input signal can be clamped to ground at the input of the schmitt-trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep Controller in Power-down and Standby modes to avoid high power consumption if some input signals are left floating, or have an analog signal level close to VCC/2. SLEEP is overridden for port pins enabled as external interrupt pins. If the external interrupt request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by various other alternate functions as described in “Alternate Port Functions” on page 58. If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as “Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt is not enabled, the corresponding External Interrupt Flag will be set when resuming from the above mentioned Sleep mode, as the clamping in these sleep mode produces the requested logic change. 10.1.6 Unconnected Pins If some pins are unused, it is recommended to ensure that these pins have a defined level. Even though most of the digital inputs are disabled in the deep sleep modes as described above, floating inputs should be avoided to reduce current consumption in all other modes where the digital inputs are enabled (Reset, Active mode and Idle mode). The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up. In this case, the pull-up will be disabled during reset. If low power consumption during reset is out PORTx, r16 nop in r17, PINx 0xFF 0x00 0xFF SYSTEM CLK r16 INSTRUCTIONS SYNC LATCH PINxn r17 t pd57 8183F–AVR–06/12 ATtiny24A/44A/84A important, it is recommended to use an external pull-up or pulldown. Connecting unused pins directly to VCC or GND is not recommended, since this may cause excessive currents if the pin is accidentally configured as an output. 10.1.7 Program Examples The following code example shows how to set port A pins 0 and 1 high, 2 and 3 low, and define the port pins from 4 to 5 as input with a pull-up assigned to port pin 4. The resulting pin values are read back again, but as previously discussed, a nop instruction is included to be able to read back the value recently assigned to some of the pins. Note: Two temporary registers are used to minimize the time from pull-ups are set on pins 0, 1 and 4, until the direction bits are correctly set, defining bit 2 and 3 as low and redefining bits 0 and 1 as strong high drivers. Note: See “Code Examples” on page 6. Assembly Code Example ... ; Define pull-ups and set outputs high ; Define directions for port pins ldi r16,(1< MSB MSB 6 5 4 3 2 1 LSB 1 2 3 4 5 6 7 8 6 5 4 3 2 1 LSB USCK USCK DO DI A B C D E CYCLE ( Reference )119 8183F–AVR–06/12 ATtiny24A/44A/84A SPITransfer_loop: out USICR,r17 in r16, USISR sbrs r16, USIOIF rjmp SPITransfer_loop in r16,USIDR ret The code is size optimized using only eight instructions (plus return). The code example assumes that the DO and USCK pins have been enabled as outputs in DDRA. The value stored in register r16 prior to the function is called is transferred to the slave device, and when the transfer is completed the data received from the slave is stored back into the register r16. The second and third instructions clear the USI Counter Overflow Flag and the USI counter value. The fourth and fifth instructions set three-wire mode, positive edge clock, count at USITC strobe, and toggle USCK. The loop is repeated 16 times. The following code demonstrates how to use the USI as an SPI master with maximum speed (fSCK = fCK/2): SPITransfer_Fast: out USIDR,r16 ldi r16,(1< 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz • High:> 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz 19.5.1 Serial Programming Algorithm When writing serial data to the ATtiny24A/44A/84A, data is clocked on the rising edge of SCK. When reading, data is clocked on the falling edge of SCK. See Figure 20-3 and Figure 20-4 for timing details. To program and verify the ATtiny24A/44A/84A in the Serial Programming mode, the following sequence is recommended (see four byte instruction formats in Table 19-12): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse after SCK has been set to '0'. The duration of the pulse must be at least tRST (the minimum pulse width on RESET pin, see Table 20-4 on page 176) plus two CPU clock cycles. 2. Wait for at least 20 ms and enable serial programming by sending the Programming Enable serial instruction to pin MOSI. 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 5 LSB of the address and data together with the Load Program memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program memory Page is stored by loading the Write Program memory Page instruction with the 3 MSB of the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 19-11 on page 164.) Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. A: The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte. (See Table 19-11 on page 164.) In a chip erased device, no 0xFFs in the data file(s) need to be programmed. B: The EEPROM array is programmed one page at a time. The Memory page is loaded one byte at a time by supplying the 2 LSB of the address and data together with the Load EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading the Write EEPROM Memory Page Instruction with the 4 MSB of the address. When using EEPROM page access only byte locations loaded with the Load EEPROM Memory Page instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is not used, the used must wait at least tWD_EEPROM before issuing the next page (See Table 19-11 on page 164). In a chip erased device, no 0xFF in the data file(s) need to be programmed. 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output MISO.164 8183F–AVR–06/12 ATtiny24A/44A/84A 7. At the end of the programming session, RESET can be set high to commence normal operation. 8. Power-off sequence (if needed): Set RESET to “1”. Turn VCC power off. 19.5.2 Serial Programming Instruction set The instruction set is described in Table 19-12 and Figure 19-2 on page 165. Table 19-11. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location Symbol Minimum Wait Delay tWD_FLASH 4.5 ms tWD_EEPROM 4.0 ms tWD_ERASE 9.0 ms tWD_FUSE 4.5 ms Table 19-12. Serial Programming Instruction Set Instruction/Operation(1) Instruction Format Byte 1 Byte 2 Byte 3 Byte4 Programming Enable $AC $53 $00 $00 Chip Erase (Program Memory/EEPROM) $AC $80 $00 $00 Poll RDY/BSY $F0 $00 $00 data byte out Load Instructions Load Extended Address byte $4D $00 Extended adr $00 Load Program Memory Page, High byte $48 adr MSB adr LSB high data byte in Load Program Memory Page, Low byte $40 adr MSB adr LSB low data byte in Load EEPROM Memory Page (page access) $C1 $00 adr LSB data byte in Read Instructions Read Program Memory, High byte $28 adr MSB adr LSB high data byte out Read Program Memory, Low byte $20 adr MSB adr LSB low data byte out Read EEPROM Memory $A0 $00 adr LSB data byte out Read Lock bits $58 $00 $00 data byte out Read Signature Byte $30 $00 adr LSB data byte out Read Fuse bits $50 $00 $00 data byte out Read Fuse High bits $58 $08 $00 data byte out Read Extended Fuse Bits $50 $08 $00 data byte out Read Calibration Byte $38 $00 $00 data byte out Write Instructions(6) Write Program Memory Page $4C adr MSB adr LSB $00 Write EEPROM Memory $C0 $00 adr LSB data byte in Write EEPROM Memory Page (page access) $C2 $00 adr LSB $00165 8183F–AVR–06/12 ATtiny24A/44A/84A Notes: 1. Not all instructions are applicable for all parts. 2. a = address 3. Bits are programmed ‘0’, unprogrammed ‘1’. 4. To ensure future compatibility, unused Fuses and Lock bits should be unprogrammed (‘1’) . 5. Refer to the correspondig section for Fuse and Lock bits, Calibration and Signature bytes and Page size. 6. Instructions accessing program memory use a word address. This address may be random within the page range. 7. See http://www.atmel.com/avr for Application Notes regarding programming and programmers. Figure 19-2. Serial Programming Instruction example If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until this bit returns ‘0’ before the next instruction is carried out. Within the same page, the low data byte must be loaded prior to the high data byte. Write Lock bits $AC $E0 $00 data byte in Write Fuse bits $AC $A0 $00 data byte in Write Fuse High bits $AC $A8 $00 data byte in Write Extended Fuse Bits $AC $A4 $00 data byte in Table 19-12. Serial Programming Instruction Set (Continued) Instruction/Operation(1) Instruction Format Byte 1 Byte 2 Byte 3 Byte4 Byte 1 Byte 2 Byte 3 Byte 4 Adr MSB Adr LSB Bit 15 B 0 Serial Programming Instruction Program Memory/ EEPROM Memory Page 0 Page 1 Page 2 Page N-1 Page Buffer Write Program Memory Page/ Write EEPROM Memory Page Load Program Memory Page (High/Low Byte)/ Load EEPROM Memory Page (page access) Byte 1 Byte 2 Byte 3 Byte 4 Bit 15 B 0 Adr MSB Adr LSB Page Offset Page Number Adr MSB Adr LSB166 8183F–AVR–06/12 ATtiny24A/44A/84A After data is loaded to the page buffer, program the EEPROM page, see Figure 19-2 on page 165. 19.6 High-voltage Serial Programming This section describes how to program and verify Flash Program memory, EEPROM Data memory, Lock bits and Fuse bits in the ATtiny24A/44A/84A. Figure 19-3. High-voltage Serial Programming The minimum period for the Serial Clock Input (SCI) during High-voltage Serial Programming is 220 ns. 19.7 High-Voltage Serial Programming Algorithm To program and verify the ATtiny24A/44A/84A in the High-voltage Serial Programming mode, the following sequence is recommended (See instruction formats in Table 19-16 on page 170): Table 19-13. Pin Name Mapping Signal Name in High-voltage Serial Programming Mode Pin Name I/O Function SDI PA6 I Serial Data Input SII PA5 I Serial Instruction Input SDO PA4 O Serial Data Output SCI PB0 I Serial Clock Input (min. 220ns period) Table 19-14. Pin Values Used to Enter Programming Mode Pin Symbol Value PA0 Prog_enable[0] 0 PA1 Prog_enable[1] 0 PA2 Prog_enable[2] 0 VCC GND SDO SII SDI (RESET) +4.5 - 5.5V PA6 PA5 PA4 PB3 +11.5 - 12.5V SCI PB0 PA2:0167 8183F–AVR–06/12 ATtiny24A/44A/84A 19.7.1 Enter High-voltage Serial Programming Mode The following algorithm puts the device in High-voltage Serial Programming mode: 1. Set Prog_enable pins listed in Table 19-14 on page 166 to “000”, RESET pin and VCC to 0V. 2. Apply 4.5 - 5.5V between VCC and GND. Ensure that VCC reaches at least 1.8V within the next 20 µs. 3. Wait 20 - 60 µs, and apply 11.5 - 12.5V to RESET. 4. Keep the Prog_enable pins unchanged for at least 10 µs after the High-voltage has been applied to ensure the Prog_enable Signature has been latched. 5. Release the Prog_enable[2] pin after tHVRST has elapsed. 6. Wait at least 300 µs before giving any serial instructions on SDI/SII. 7. Exit Programming mode by power the device down or by bringing RESET pin to 0V. If the rise time of the VCC is unable to fulfill the requirements listed above, the following alternative algorithm can be used: 1. Set Prog_enable pins listed in Table 19-14 on page 166 to “000”, RESET pin and VCC to 0V. 2. Apply 4.5 - 5.5V between VCC and GND. 3. Monitor VCC, and as soon as VCC reaches 0.9 - 1.1V, apply 11.5 - 12.5V to RESET. 4. Keep the Prog_enable pins unchanged for at least 10 µs after the High-voltage has been applied to ensure the Prog_enable Signature has been latched. 5. Release the Prog_enable[2] pin to avoid drive contention on the Prog_enable[2]/SDO pin. 6. Wait until VCC actually reaches 4.5 - 5.5V before giving any serial instructions on SDI/SII. 7. Exit Programming mode by power the device down or by bringing RESET pin to 0V. Table 19-15. High-voltage Reset Characteristics Supply Voltage RESET Pin High-voltage Threshold Minimum High-voltage Period for Latching Prog_enable VCC VHVRST tHVRST 4.5V 11.5V 100 ns 5.5V 11.5V 100 ns168 8183F–AVR–06/12 ATtiny24A/44A/84A 19.7.2 Considerations for Efficient Programming The loaded command and address are retained in the device during programming. For efficient programming, the following should be considered. • The command needs only be loaded once when writing or reading multiple memory locations. • Skip writing the data value 0xFF that is the contents of the entire EEPROM (unless the EESAVE Fuse is programmed) and Flash after a Chip Erase. • Address High byte needs only be loaded before programming or reading a new 256 word window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes reading. 19.7.3 Chip Erase The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock bits are not reset until the Program memory has been completely erased. The Fuse bits are not changed. A Chip Erase must be performed before the Flash and/or EEPROM are reprogrammed. 1. Load command “Chip Erase” (see Table 19-16 on page 170). 2. Wait after Instr. 3 until SDO goes high for the “Chip Erase” cycle to finish. 3. Load Command “No Operation”. Note: 1. The EEPROM memory is preserved during Chip Erase if the EESAVE Fuse is programmed. 19.7.4 Programming the Flash The Flash is organized in pages, see “Page Size” on page 161. When programming the Flash, the program data is latched into a page buffer. This allows one page of program data to be programmed simultaneously. The following procedure describes how to program the entire Flash memory: 1. Load Command “Write Flash” (see Table 19-16 on page 170). 2. Load Flash Page Buffer. 3. Load Flash High Address and Program Page. Wait after Instr. 3 until SDO goes high for the “Page Programming” cycle to finish. 4. Repeat 2 through 3 until the entire Flash is programmed or until all data has been programmed. 5. End Page Programming by Loading Command “No Operation”. When writing or reading serial data to the ATtiny24A/44A/84A, data is clocked on the rising edge of the serial clock, see Figure 20-5 on page 181, Figure 19-3 on page 166 and Table 20-12 on page 181 for details.169 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 19-4. Addressing the Flash which is Organized in Pages Figure 19-5. High-voltage Serial Programming Waveforms 19.7.5 Programming the EEPROM The EEPROM is organized in pages, see Table 20-11 on page 180. When programming the EEPROM, the data is latched into a page buffer. This allows one page of data to be programmed simultaneously. The programming algorithm for the EEPROM Data memory is as follows (refer to Table 19-16 on page 170): 1. Load Command “Write EEPROM”. 2. Load EEPROM Page Buffer. 3. Program EEPROM Page. Wait after Instr. 2 until SDO goes high for the “Page Programming” cycle to finish. 4. Repeat 2 through 3 until the entire EEPROM is programmed or until all data has been programmed. 5. End Page Programming by Loading Command “No Operation”. PROGRAM MEMORY WORD ADDRESS WITHIN A PAGE PAGE ADDRESS WITHIN THE FLASH INSTRUCTION WORD PAGE PCWORD[PAGEMSB:0]: 00 01 02 PAGEEND PAGE PCPAGE PCWORD PCMSB PAGEMSB PROGRAM COUNTER MSB MSB MSB LSB LSB LSB 0 1 2 3 4 5 6 7 8 9 10 SDI PA6 SII PA5 SDO PA4 SCI PB0170 8183F–AVR–06/12 ATtiny24A/44A/84A 19.7.6 Reading the Flash The algorithm for reading the Flash memory is as follows (refer to Table 19-16 on page 170): 1. Load Command "Read Flash". 2. Read Flash Low and High Bytes. The contents at the selected address are available at serial output SDO. 19.7.7 Reading the EEPROM The algorithm for reading the EEPROM memory is as follows (refer to Table 19-16 on page 170): 1. Load Command “Read EEPROM”. 2. Read EEPROM Byte. The contents at the selected address are available at serial output SDO. 19.7.8 Programming and Reading the Fuse and Lock Bits The algorithms for programming and reading the Fuse Low/High bits and Lock bits are shown in Table 19-16 on page 170. 19.7.9 Reading the Signature Bytes and Calibration Byte The algorithms for reading the Signature bytes and Calibration byte are shown in Table 19-16 on page 170. 19.7.10 Power-off sequence Set SCI to “0”. Set RESET to “1”. Turn VCC power off. Table 19-16. High-voltage Serial Programming Instruction Set for ATtiny24A/44A/84A Instruction Instruction Format Instr.1/5 Instr.2/6 Instr.3/7 Instr.4 Operation Remarks Chip Erase SDI SII SDO 0_1000_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Wait after Instr.3 until SDO goes high for the Chip Erase cycle to finish. Load “Write Flash” Command SDI SII SDO 0_0001_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx Enter Flash Programming code. Load Flash Page Buffer SDI SII SDO 0_ bbbb_bbbb _00 0_0000_1100_00 x_xxxx_xxxx_xx 0_eeee_eeee_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1101_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Repeat after Instr. 1 - 7until the entire page buffer is filled or until all data within the page is filled.(2) SDI SII SDO 0_dddd_dddd_00 0_0011_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1101_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1100_00 x_xxxx_xxxx_xx Instr 5-7. Load Flash High Address and Program Page SDI SII SDO 0_0000_000a_00 0_0001_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Wait after Instr 3 until SDO goes high. Repeat Instr. 2 - 3 for each loaded Flash Page until the entire Flash or all data is programmed. Repeat Instr. 1 for a new 256 byte page.(2)171 8183F–AVR–06/12 ATtiny24A/44A/84A Load “Read Flash” Command SDI SII SDO 0_0000_0010_00 0_0100_1100_00 x_xxxx_xxxx_xx Enter Flash Read mode. Read Flash Low and High Bytes SDI SII SDO 0_bbbb_bbbb_00 0_0000_1100_00 x_xxxx_xxxx_xx 0_0000_000a_00 0_0001_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 q_qqqq_qqqx_xx Repeat Instr. 1, 3 - 6 for each new address. Repeat Instr. 2 for a new 256 byte page. SDI SII SDO 0_0000_0000_00 0_0111_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1100_00 p_pppp_pppx_xx Instr 5 - 6. Load “Write EEPROM” Command SDI SII SDO 0_0001_0001_00 0_0100_1100_00 x_xxxx_xxxx_xx Enter EEPROM Programming mode. Load EEPROM Page Buffer SDI SII SDO 0_bbbb_bbbb_00 0_0000_1100_00 x_xxxx_xxxx_xx 0_aaaa_aaaa_00 0_0001_1100_00 x_xxxx_xxxx_xx 0_eeee_eeee_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1101_00 x_xxxx_xxxx_xx Repeat Instr. 1 - 5 until the entire page buffer is filled or until all data within the page is filled.(3) SDI SII SDO 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Program EEPROM Page SDI SII SDO 0_0000_0000_00 0_0110_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Wait after Instr. 2 until SDO goes high. Repeat Instr. 1 - 2 for each loaded EEPROM page until the entire EEPROM or all data is programmed. Write EEPROM Byte SDI SII SDO 0_bbbb_bbbb_00 0_0000_1100_00 x_xxxx_xxxx_xx 0_aaaa_aaaa_00 0_0001_1100_00 x_xxxx_xxxx_xx 0_eeee_eeee_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1101_00 x_xxxx_xxxx_xx Repeat Instr. 1 - 6 for each new address. Wait after Instr. 6 until SDO goes high.(4) SDI SII SDO 0_0000_0000_00 0_0110_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Instr. 5-6 Load “Read EEPROM” Command SDI SII SDO 0_0000_0011_00 0_0100_1100_00 x_xxxx_xxxx_xx Enter EEPROM Read mode. Read EEPROM Byte SDI SII SDO 0_bbbb_bbbb_00 0_0000_1100_00 x_xxxx_xxxx_xx 0_aaaa_aaaa_00 0_0001_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 q_qqqq_qqq0_00 Repeat Instr. 1, 3 - 4 for each new address. Repeat Instr. 2 for a new 256 byte page. Write Fuse Low Bits SDI SII SDO 0_0100_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_A987_6543_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Wait after Instr. 4 until SDO goes high. Write A - 3 = “0” to program the Fuse bit. Write Fuse High Bits SDI SII SDO 0_0100_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_IHGF_EDCB_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1100_00 x_xxxx_xxxx_xx Wait after Instr. 4 until SDO goes high. Write F - B = “0” to program the Fuse bit. Write Fuse Extended Bits SDI SII SDO 0_0100_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_000J_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_0110_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1110_00 x_xxxx_xxxx_xx Wait after Instr. 4 until SDO goes high. Write J = “0” to program the Fuse bit. Table 19-16. High-voltage Serial Programming Instruction Set for ATtiny24A/44A/84A (Continued) Instruction Instruction Format Instr.1/5 Instr.2/6 Instr.3/7 Instr.4 Operation Remarks172 8183F–AVR–06/12 ATtiny24A/44A/84A Notes: 1. a = address high bits, b = address low bits, d = data in high bits, e = data in low bits, p = data out high bits, q = data out low bits, x = don’t care, 1 = Lock Bit1, 2 = Lock Bit2, 3 = CKSEL0 Fuse, 4 = CKSEL1 Fuse, 5 = CKSEL2 Fuse, 6 = CKSEL3 Fuse, 7 = SUT0 Fuse, 8 = SUT1 Fuse, 9 = CKOUT Fuse, A = CKDIV8 Fuse, B = BODLEVEL0 Fuse, C = BODLEVEL1 Fuse, D= BODLEVEL2 Fuse, E = EESAVE Fuse, F = WDTON Fuse, G = SPIEN Fuse, H = DWEN Fuse, I = RSTDISBL Fuse, J = SELFPRGEN Fuse 2. For page sizes less than 256 words, parts of the address (bbbb_bbbb) will be parts of the page address. 3. For page sizes less than 256 bytes, parts of the address (bbbb_bbbb) will be parts of the page address. 4. The EEPROM is written page-wise. But only the bytes that are loaded into the page are actually written to the EEPROM. Page-wise EEPROM access is more efficient when multiple bytes are to be written to the same page. Note that auto-erase of EEPROM is not available in High-voltage Serial Programming, only in SPI Programming. Write Lock Bits SDI SII SDO 0_0010_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0021_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_0100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_xxxx_xx Wait after Instr. 4 until SDO goes high. Write 2 - 1 = “0” to program the Lock Bit. Read Fuse Low Bits SDI SII SDO 0_0000_0100_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 A_9876_543x_xx Reading A - 3 = “0” means the Fuse bit is programmed. Read Fuse High Bits SDI SII SDO 0_0000_0100_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1010_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1100_00 I_HGFE_DCBx_xx Reading F - B = “0” means the Fuse bit is programmed. Read Fuse Extended Bits SDI SII SDO 0_0000_0100_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1010_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1110_00 x_xxxx_xxJx_xx Reading J = “0” means the Fuse bit is programmed. Read Lock Bits SDI SII SDO 0_0000_0100_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 x_xxxx_x21x_xx Reading 2, 1 = “0” means the Lock bit is programmed. Read Signature Bytes SDI SII SDO 0_0000_1000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_00bb_00 0_0000_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1100_00 q_qqqq_qqqx_xx Repeats Instr 2 4 for each signature byte address. Read Calibration Byte SDI SII SDO 0_0000_1000_00 0_0100_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0000_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1000_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0111_1100_00 p_pppp_pppx_xx Load “No Operation” Command SDI SII SDO 0_0000_0000_00 0_0100_1100_00 x_xxxx_xxxx_xx Table 19-16. High-voltage Serial Programming Instruction Set for ATtiny24A/44A/84A (Continued) Instruction Instruction Format Instr.1/5 Instr.2/6 Instr.3/7 Instr.4 Operation Remarks173 8183F–AVR–06/12 ATtiny24A/44A/84A 20. Electrical Characteristics 20.1 Absolute Maximum Ratings* 20.2 DC Characteristics Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ............................................... 40.0 mA DC Current VCC and GND Pins ................................ 200.0 mA Table 20-1. DC Characteristics. TA = -40°C to +85°C Symbol Parameter Condition Min Typ(1) Max Units VIL Input Low Voltage VCC = 1.8V - 2.4V -0.5 0.2VCC(3) V VCC = 2.4V - 5.5V -0.5 0.3VCC(3) V Input Low Voltage, RESET Pin as Reset (4) VCC = 1.8V - 5.5 -0.5 0.2VCC(3) VIH Input High-voltage Except RESET pin VCC = 1.8V - 2.4V 0.7VCC(2) VCC +0.5 V VCC = 2.4V - 5.5V 0.6VCC(2) VCC +0.5 V Input High-voltage RESET pin as Reset (4) VCC = 1.8V to 5.5V 0.9VCC(2) VCC +0.5 V VOL Output Low Voltage (5) Except RESET pin (7) IOL = 10 mA, VCC = 5V 0.6 V IOL = 5 mA, VCC = 3V 0.5 V VOH Output High-voltage (6) Except RESET pin (7) IOH = -10 mA, VCC = 5V 4.3 V IOH = -5 mA, VCC = 3V 2.5 V ILIL Input Leakage Current I/O Pin VCC = 5.5V, pin low (absolute value) < 0.05 1(8) µA ILIH Input Leakage Current I/O Pin VCC = 5.5V, pin high (absolute value) < 0.05 1(8) µA RPU Pull-up Resistor, I/O Pin VCC = 5.5V, input low 20 50 kΩ Pull-up Resistor, Reset Pin VCC = 5.5V, input low 30 60 kΩ174 8183F–AVR–06/12 ATtiny24A/44A/84A Notes: 1. Typical values at 25°C. 2. “Min” means the lowest value where the pin is guaranteed to be read as high. 3. “Max” means the highest value where the pin is guaranteed to be read as low. 4. Not tested in production. 5. Although each I/O port can sink more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state conditions (non-transient), the sum of all IOL (for all ports) should not exceed 60 mA. If IOL exceeds the test conditions, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 6. Although each I/O port can source more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state conditions (non-transient), the sum of all IOH (for all ports) should not exceed 60 mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 7. The RESET pin must tolerate high voltages when entering and operating in programming modes and, as a consequence, has a weak drive strength as compared to regular I/O pins. See Figure 21-87, Figure 21-88, Figure 21-89, and Figure 21-90 (starting on page 226). 8. These are test limits, which account for leakage currents of the test environment. Actual device leakage currents are lower. 9. Values are with external clock using methods described in “Minimizing Power Consumption” on page 35. Power Reduction is enabled (PRR = 0xFF) and there is no I/O drive. 10. BOD Disabled. 20.3 Speed The maximum operating frequency of the device depends on VCC. As shown in Figure 20-1, the relationship between maximum frequency and VCC is linear in the region 1.8V < VCC < 4.5V. Figure 20-1. Maximum Frequency vs. VCC ICC Supply Current, Active Mode (9) f = 1 MHz, VCC = 2V 0.25 0.5 mA f = 4 MHz, VCC = 3V 1.2 2 mA f = 8 MHz, VCC = 5V 4.4 7 mA Supply Current, Idle Mode (9) f = 1 MHz, VCC = 2V 0.04 0.2 mA f = 4 MHz, VCC = 3V 0.25 0.6 mA f = 8 MHz, VCC = 5V 1.3 2 mA Supply Current, Power-Down Mode (10) WDT enabled, VCC = 3V 4 10 µA WDT disabled, VCC = 3V 0.13 2 µA Table 20-1. DC Characteristics. TA = -40°C to +85°C (Continued) Symbol Parameter Condition Min Typ(1) Max Units 4 MHz 1.8V 5.5V 4.5V 20 MHz175 8183F–AVR–06/12 ATtiny24A/44A/84A 20.4 Clock Characteristics 20.4.1 Accuracy of Calibrated Internal Oscillator It is possible to manually calibrate the internal oscillator to be more accurate than default factory calibration. Note that the oscillator frequency depends on temperature and voltage. Voltage and temperature characteristics can be found in Figure 21-109 on page 237 and Figure 21-110 on page 238. Notes: 1. Accuracy of oscillator frequency at calibration point (fixed temperature and fixed voltage). 20.4.2 External Clock Drive Figure 20-2. External Clock Drive Waveform Table 20-2. Calibration Accuracy of Internal RC Oscillator Calibration Method Target Frequency VCC Temperature Accuracy at given voltage & temperature (1) Factory Calibration 8.0 MHz 3V 25°C ±10% User Calibration Fixed frequency within: 7.3 – 8.1 MHz Fixed voltage within: 1.8V – 5.5V Fixed temperature within: -40°C to +85°C ±1% VIL1 VIH1 Table 20-3. External Clock Drive Characteristics Symbol Parameter VCC = 1.8 - 5.5V VCC = 2.7 - 5.5V VCC = 4.5 - 5.5V Min. Max. Min. Max. Min. Max. Units 1/tCLCL Clock Frequency 0 4 0 10 0 20 MHz tCLCL Clock Period 250 100 50 ns tCHCX High Time 100 40 20 ns tCLCX Low Time 100 40 20 ns tCLCH Rise Time 2.0 1.6 0.5 µs tCHCL Fall Time 2.0 1.6 0.5 µs ΔtCLCL Change in period from one clock cycle to the next 2 2 2 %176 8183F–AVR–06/12 ATtiny24A/44A/84A 20.5 System and Reset Characteristics Note: 1. Values are guidelines, only 20.5.1 Power-On Reset Note: 1. Values are guidelines, only 2. Threshold where device is released from reset when voltage is rising 3. The Power-on Reset will not work unless the supply voltage has been below VPOA 20.5.2 Brown-Out Detection Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. Table 20-4. Reset, Brown-out, and Internal Voltage Characteristics Symbol Parameter Condition Min(1) Typ(1) Max(1) Units VRST RESET pin threshold voltage 0.2 VCC 0.9VCC V tRST Minimum pulse width on RESET pin VCC = 1.8V VCC = 3V VCC = 5V 2000 700 400 ns VHYST Brown-out Detector hysteresis 50 mV tBOD Minimum pulse width on Brown-out Reset 2 µs VBG Internal bandgap reference voltage VCC = 5V TA = 25°C 1.0 1.1 1.2 V tBG Internal bandgap reference start-up time VCC = 5V TA = 25°C 40 70 µs IBG Internal bandgap reference current consumption VCC = 5V TA = 25°C 15 µA Table 20-5. Characteristics of Enhanced Power-On Reset. TA = = -40°C to +85°C Symbol Parameter Min(1) Typ(1) Max(1) Units VPOR Release threshold of power-on reset (2) 1.1 1.4 1.6 V VPOA Activation threshold of power-on reset (3) 0.6 1.3 1.6 V SRON Power-On Slope Rate 0.01 V/ms Table 20-6. VBOT vs. BODLEVEL Fuse Coding BODLEVEL[2:0] Fuses Min(1) Typ(1) Max(1) Units 111 BOD Disabled 110 1.7 1.8 2.0 101 2.5 2.7 2.9 V 100 4.1 4.3 4.5 0XX Reserved177 8183F–AVR–06/12 ATtiny24A/44A/84A 20.6 ADC Characteristics Table 20-7. ADC Characteristics, Single Ended Channels. T = -40°C to +85°C Symbol Parameter Condition Min Typ Max Units Resolution 10 Bits Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 2.0 LSB VREF = 4V, VCC = 4V, ADC clock = 1 MHz 2.5 LSB VREF = 4V, VCC = 4V, ADC clock = 200 kHz Noise Reduction Mode 1.5 LSB VREF = 4V, VCC = 4V, ADC clock = 1 MHz Noise Reduction Mode 2.0 LSB Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 1.0 LSB Differential Non-linearity (DNL) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 0.5 LSB Gain Error VREF = 4V, VCC = 4V, ADC clock = 200 kHz 2.0 LSB Offset Error (Absolute) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 1.5 LSB Conversion Time Free Running Conversion 14 280 µs Clock Frequency 50 1000 kHz VIN Input Voltage GND VREF V Input Bandwidth 38.5 kHz AREF External Voltage Reference 2.0 VCC V VINT Internal Voltage Reference 1.0 1.1 1.2 V RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ ADC Conversion Output 0 1023 LSB178 8183F–AVR–06/12 ATtiny24A/44A/84A Table 20-8. ADC Characteristics, Differential Channels (Unipolar Mode), TA = -40°C to +85°C Symbol Parameter Condition Min Typ Max Units Resolution Gain = 1x 10 Bits Gain = 20x 10 Bits Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 10 LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 15 LSB Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4 LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 10 LSB Gain Error Gain = 1x 10 LSB Gain = 20x 15 LSB Offset Error Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 3 LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4 LSB Conversion Time Free Running Conversion 70 280 µs Clock Frequency 50 200 kHz VIN Input Voltage GND VCC V VDIFF Input Differential Voltage VREF/Gain V Input Bandwidth 4 kHz AREF External Reference Voltage 2.0 VCC - 1.0 V VINT Internal Voltage Reference 1.0 1.1 1.2 V RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ ADC Conversion Output 0 1023 LSB179 8183F–AVR–06/12 ATtiny24A/44A/84A Table 20-9. ADC Characteristics, Differential Channels (Bipolar Mode), TA = -40°C to +85°C Symbol Parameter Condition Min Typ Max Units Resolution Gain = 1x 10 Bits Gain = 20x 10 Bits Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 8 LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 8 LSB Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4 LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 5 LSB Gain Error Gain = 1x 4 LSB Gain = 20x 5 LSB Offset Error Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 3 LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4 LSB Conversion Time Free Running Conversion 70 280 µs Clock Frequency 50 200 kHz VIN Input Voltage GND VCC V VDIFF Input Differential Voltage VREF/Gain V Input Bandwidth 4 kHz AREF External Reference Voltage 2.0 VCC - 1.0 V VINT Internal Voltage Reference 1.0 1.1 1.2 V RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ ADC Conversion Output -512 511 LSB180 8183F–AVR–06/12 ATtiny24A/44A/84A 20.7 Analog Comparator Characteristics Note: All parameters are based on simulation results and are not tested in production 20.8 Serial Programming Characteristics Figure 20-3. Serial Programming Timing Figure 20-4. Serial Programming Waveform Table 20-10. Analog Comparator Characteristics, TA = -40°C to +85°C Symbol Parameter Condition Min Typ Max Units VAIO Input Offset Voltage VCC = 5V, VIN = VCC / 2 < 10 40 mV ILAC Input Leakage Current VCC = 5V, VIN = VCC / 2 -50 50 nA tAPD Analog Propagation Delay (from saturation to slight overdrive) VCC = 2.7V 750 ns VCC = 4.0V 500 Analog Propagation Delay (large step change) VCC = 2.7V 100 VCC = 4.0V 75 tDPD Digital Propagation Delay VCC = 1.8V - 5.5 1 2 CLK Table 20-11. Serial Programming Characteristics, TA = -40°C to +85°C, VCC = 1.8 - 5.5V (Unless Otherwise Noted) Symbol Parameter Min Typ Max Units 1/tCLCL Oscillator Frequency 0 4 MHz tCLCL Oscillator Period 250 ns 1/tCLCL Oscillator Freq. (VCC = 4.5V - 5.5V) 0 20 MHz MOSI MISO SCK t OVSH t SHSL t t SHOX SLSH MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUT181 8183F–AVR–06/12 ATtiny24A/44A/84A Note: 1. 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz 20.9 High-Voltage Serial Programming Characteristics Figure 20-5. High-voltage Serial Programming Timing tCLCL Oscillator Period (VCC = 4.5V - 5.5V) 50 ns tSHSL SCK Pulse Width High 2 tCLCL(1) ns tSLSH SCK Pulse Width Low 2 tCLCL(1) ns tOVSH MOSI Setup to SCK High tCLCL ns tSHOX MOSI Hold after SCK High 2 tCLCL ns Table 20-11. Serial Programming Characteristics, TA = -40°C to +85°C, VCC = 1.8 - 5.5V (Unless Otherwise Noted) Symbol Parameter Min Typ Max Units Table 20-12. High-voltage Serial Programming Characteristics TA = 25°C, VCC = 5V (Unless otherwise noted) Symbol Parameter Min Typ Max Units tSHSL SCI (PB0) Pulse Width High 125 ns tSLSH SCI (PB0) Pulse Width Low 125 ns tIVSH SDI (PA6), SII (PB1) Valid to SCI (PB0) High 50 ns tSHIX SDI (PA6), SII (PB1) Hold after SCI (PB0) High 50 ns tSHOV SCI (PB0) High to SDO (PA4) Valid 16 ns tWLWH_PFB Wait after Instr. 3 for Write Fuse Bits 2.5 ms SDI (PA6), SII (PA5) SDO (PA4) SCI (PB0) t IVSH t SHSL t t SHIX SLSH t SHOV182 8183F–AVR–06/12 ATtiny24A/44A/84A 21. Typical Characteristics The data contained in this section is largely based on simulations and characterization of similar devices in the same process and design methods. Thus, the data should be treated as indications of how the part will behave. The following charts show typical behavior. These figures are not tested during manufacturing. During characterisation devices are operated at frequencies higher than test limits but they are not guaranteed to function properly at frequencies higher than the ordering code indicates. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. Current consumption is a function of several factors such as operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. A sine wave generator with rail-to-rail output is used as clock source but current consumption in Power-Down mode is independent of clock selection. The difference between current consumption in Power-Down mode with Watchdog Timer enabled and Power-Down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. The current drawn from pins with a capacitive load may be estimated (for one pin) as follows: where VCC = operating voltage, CL = load capacitance and fSW = average switching frequency of I/O pin. 21.1 Supply Current of I/O Modules The tables and formulas below can be used to calculate the additional current consumption for the different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modules is controlled by the Power Reduction Register. See “Power Reduction Register” on page 35 for details. Table 21-2 below can be used for calculating typical current consumption for other supply voltages and frequencies than those mentioned in the Table 21-1 above. I CP VCC CL × × f SW ≈ Table 21-1. Additional Current Consumption for the different I/O modules (absolute values) PRR bit Typical numbers VCC = 2V, f = 1 MHz VCC = 3V, f = 4 MHz VCC = 5V, f = 8 MHz PRTIM1 1.6 µA 11 µA 48 µA PRTIM0 4.4 µA 29 µA 120 µA PRUSI 1.6 µA 11 µA 48 µA PRADC 8.0 µA 55 µA 240 µA183 8183F–AVR–06/12 ATtiny24A/44A/84A 21.1.1 Example Calculate the expected current consumption in idle mode with USI, TIMER0, and ADC enabled at VCC = 2.0V and f = 1 MHz. From Table 21-2 on page 183, third column, we see that we need to add 5% for the USI, 10% for TIMER0, and 20% for the ADC. Reading from Figure 21-61 on page 213, we find that current consumption in idle mode at 2V and 1 MHz is about 0.04 mA. The total current consumption in idle mode with USI, TIMER0, and ADC enabled is therefore: 21.2 ATtiny24A 21.2.1 Current Consumption in Active Mode Figure 21-1. Active Supply Current vs. Low Frequency 0.1 - 1.0 MHz, PRR = 0xFF Table 21-2. Additional Current Consumption (percentage) in Active and Idle mode PRR bit Current consumption additional to active mode with external clock (see Figure 21-56 and Figure 21-57) Current consumption additional to idle mode with external clock (see Figure 21-61 and Figure 21-62) PRTIM1 1 % 5 % PRTIM0 3 % 10 % PRUSI 1 % 5 % PRADC 5 % 20 % ICCTOT ≈ ≈ 0,05mA × ( ) 1 0,05 0,10 0,20 +++ 0,06mA 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,2 0,4 0,6 0,8 1 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA)184 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-2. Active Supply Current vs. Frequency 1 - 20 MHz, PRR = 0xFF Figure 21-3. Active Supply Current vs. VCC Internal RC Oscillator, 8 MHz 0 2 4 6 8 10 12 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)185 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-4. Active Supply Current vs. VCC Internal RC Oscillator, 1 MHz Figure 21-5. Active Supply Current vs. VCC Internal RC Oscillator, 128 kHz 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)186 8183F–AVR–06/12 ATtiny24A/44A/84A 21.2.2 Current Consumption in Idle Mode Figure 21-6. Idle Supply Current vs. Low Frequency 0.1 - 1.0 MHz, PRR = 0xFF Figure 21-7. Idle Supply Current vs. Frequency 1 - 20 MHz, PRR = 0xFF 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) 0 0,5 1 1,5 2 2,5 3 3,5 4 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V187 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-8. Idle Supply Current vs. VCC Internal RC Oscillator, 8 MHz Figure 21-9. Idle Supply Current vs. VCC Internal RC Oscillator, 1 MHz 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0,05 0,1 0,15 0,2 0,25 0,3 0,35 0,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)188 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-10. Idle Supply Current vs. VCC Internal RC Oscillator, 128 kHz 21.2.3 Current Consumption in Power-down Mode Figure 21-11. Power-down Supply Current vs. VCC Watchdog Timer Disabled 85 °C 25 °C -40 °C 0 0,005 0,01 0,015 0,02 0,025 0,03 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)189 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-12. Power-down Supply Current vs. VCC Watchdog Timer Enabled 21.2.4 Current Consumption in Reset Figure 21-13. Reset Supply Current vs. VCC 0.1 - 1.0 MHz, Excluding Current through Reset Pull-up 85 °C 25 °C -40 °C 0 2 4 6 8 10 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0,16 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA)190 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-14. Reset Supply Current vs. VCC 1 - 20 MHz, Excluding Current through Reset Pull-up 21.2.5 Current Consumption of Peripheral Units Figure 21-15. ADC Current vs. VCC 4 MHz Frequency 0 0,5 1 1,5 2 2,5 3 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 100 200 300 400 500 600 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)191 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-16. AREF Pin Current vs. Pin Voltage Figure 21-17. Analog Comparator Current vs. VCC 4 MHz Frequency 0 20 40 60 80 100 120 140 160 180 200 1,5 2 2,5 3 3,5 4 4,5 5 5,5 AREF (V) AREF pin current (uA) 0 20 40 60 80 100 120 140 160 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)192 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-18. Programming Current vs. VCC Figure 21-19. Brownout Detector Current vs. VCC BOD Level = 1.8V 85 °C 25 °C -40 °C 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 1,5 2,5 3,5 4,5 5,5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 5 10 15 20 25 30 35 40 45 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)193 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-20. Watchdog Timer Current vs. VCC 21.2.6 Pull-up Resistors Figure 21-21. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 1.8V 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 7 8 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 85 °C -40 °C 25 °C 0 10 20 30 40 50 60 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VOP (V) IOP (uA)194 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-22. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 2.7V Figure 21-23. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 5V 0 10 20 30 40 50 60 70 80 0 0,5 1 1,5 2 2,5 3 VOP (V) IOP (uA) 85 °C -40 °C 25 °C 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 VOP (V) IOP (uA) 85 °C -40 °C 25 °C195 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-24. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 1.8V Figure 21-25. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 2.7V 0 5 10 15 20 25 30 35 40 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VRESET (V) IRESET (uA) 85 °C -40 °C 25 °C 0 10 20 30 40 50 60 0 0,5 1 1,5 2 2,5 3 VRESET (V) IRESET (uA) 85 °C -40 °C 25 °C196 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-26. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 5V 21.2.7 Output Driver Strength Figure 21-27. VOL: Output Voltage vs. Sink Current I/O Pin, VCC = 3V 0 20 40 60 80 100 120 0 1 2 3 4 5 6 VRESET (V) IRESET (uA) 85 °C -40 °C 25 °C 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 0 5 10 15 20 IOL (mA) VOL (V)197 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-28. VOL: Output Voltage vs. Sink Current I/O Pin, VCC = 5V Figure 21-29. VOH: Output Voltage vs. Source Current I/O Pin, VCC = 3V 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0 5 10 15 20 IOL (mA) VOL (V) 85 °C 25 °C -40 °C 1,8 2 2,2 2,4 2,6 2,8 3 3,2 0 5 10 15 20 IOH (mA) VOH (V)198 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-30. VOH: Output Voltage vs. Source Current I/O Pin, VCC = 5V Figure 21-31. VOL: Output Voltage vs. Sink Current Reset Pin as I/O, VCC = 3V 85 °C 25 °C -40 °C 4,2 4,4 4,6 4,8 5 5,2 0 5 10 15 20 IOH (mA) VOH (V) 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,4 0 0,5 1 1,5 2 2,5 3 IOL (mA) VOL (V)199 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-32. VOL: Output Voltage vs. Sink Current Reset Pin as I/O, VCC = 5V Figure 21-33. VOH: Output Voltage vs. Source Current Reset Pin as I/O, VCC = 3V 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 IOL (mA) VOL (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 IOH (mA) VOH (V)200 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-34. VOH: Output Voltage vs. Source Current Reset Pin as I/O, VCC = 5V 21.2.8 Input Threshold and Hysteresis (for I/O Ports) Figure 21-35. VIH: Input Threshold Voltage vs. VCC I/O Pin, Read as ‘1’ 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 IOH (mA) VOH (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 3,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)201 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-36. VIL: Input Threshold Voltage vs. VCC I/O Pin, Read as ‘0’ Figure 21-37. VIH-VIL: Input Hysteresis vs. VCC I/O Pin 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V)202 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-38. VIH: Input Threshold Voltage vs. VCC Reset Pin as I/O, Read as ‘1’ Figure 21-39. VIL: Input Threshold Voltage vs. VCC Reset Pin as I/O, Read as ‘0’ 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)203 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-40. VIH-VIL: Input Hysteresis vs. VCC Reset Pin as I/O 21.2.9 BOD, Bandgap and Reset Figure 21-41. BOD Threshold vs. Temperature BODLEVEL is 4.3V 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (V) RISING VCC FALLING VCC 4,26 4,28 4,3 4,32 4,34 4,36 4,38 4,4 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (C) Threshold (V)204 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-42. BOD Threshold vs. Temperature BODLEVEL is 2.7V Figure 21-43. BOD Threshold vs. Temperature BODLEVEL is 1.8V 2,68 2,7 2,72 2,74 2,76 2,78 2,8 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (C) Threshold (V) RISING VCC FALLING VCC RISING VCC FALLING VCC 1,77 1,78 1,79 1,8 1,81 1,82 1,83 1,84 1,85 1,86 1,87 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (C) Threshold (V)205 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-44. Bandgap Voltage vs. Supply Voltage Figure 21-45. Bandgap Voltage vs. Temperature 1 1,02 1,04 1,06 1,08 1,1 1,12 1,14 1,16 1,18 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 Vcc (V) Bandgap Voltage (V) 1 1,02 1,04 1,06 1,08 1,1 1,12 1,14 1,16 1,18 1,2 -40 -20 0 20 40 60 80 100 Temperature (C) Bandgap Voltage (V)206 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-46. VIH: Input Threshold Voltage vs. VCC Reset Pin, Read as ‘1’ Figure 21-47. VIL: Input Threshold Voltage vs. VCC Reset Pin, Read as ‘0’ 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)207 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-48. VIH-VIL: Input Hysteresis vs. VCC Reset Pin Figure 21-49. Minimum Reset Pulse Width vs. VCC 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) 85 °C 25 °C -40 °C 0 200 400 600 800 1000 1200 1400 1600 1800 2000 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Pulsewidth (ns)208 8183F–AVR–06/12 ATtiny24A/44A/84A 21.2.10 Analog Comparator Offset Figure 21-50. Analog Comparator Offset VCC = 5V 21.2.11 Internal Oscillator Speed Figure 21-51. Watchdog Oscillator Frequency vs. VCC 85 25 -40 -0.008 -0.006 -0.004 -0.002 0 0.002 0.004 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VIN (V) Offset (V) 85 °C 25 °C -40 °C 112 114 116 118 120 122 124 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) FRC (kHz)209 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-52. Watchdog Oscillator Frequency vs. Temperature Figure 21-53. Calibrated 8 MHz RC Oscillator Frequency vs. VCC 5.5 V 3.0 V 1.8 V 112 114 116 118 120 122 124 -40 -20 0 20 40 60 80 100 Temperature (C) FRC (kHz) 85 °C 25 °C -40 °C 7,4 7,6 7,8 8 8,2 8,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) FRC (MHz)210 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-54. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature Figure 21-55. Calibrated 8 MHz RC Oscillator Frequency vs. OSCCAL Value VCC = 3V 5.5 V 3.0 V 1.8 V 7,5 7,6 7,7 7,8 7,9 8 8,1 8,2 8,3 8,4 -40 -20 0 20 40 60 80 100 Temperature (C) FRC (MHz) 85 °C 25 °C -40 °C 0 4 8 12 16 20 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL (X1) FRC (MHz)211 8183F–AVR–06/12 ATtiny24A/44A/84A 21.3 ATtiny44A 21.3.1 Current Consumption in Active Mode Figure 21-56. Active Supply Current vs. Low Frequency 0.1 - 1.0 MHz, PRR = 0xFF Figure 21-57. Active Supply Current vs. frequency 1 - 20 MHz, PRR = 0xFF 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0.2 0.4 0.6 0.8 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 2 4 6 8 10 12 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA)212 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-58. Active Supply Current vs. VCC Internal RC Oscillator, 8 MHz Figure 21-59. Active Supply Current vs. VCC Internal RC Oscillator, 1 MHz 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA)213 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-60. Active Supply Current vs. VCC Internal RC Oscillator, 128 kHz 21.3.2 Current Consumption in Idle Mode Figure 21-61. Idle Supply Current vs. Low Frequency 0.1 - 1.0 MHz, PRR = 0xFF 85 °C 25 °C -40 °C 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)214 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-62. Idle Supply Current vs. Frequency 1 - 20 MHz, PRR = 0xFF Figure 21-63. Idle Supply Current vs. VCC Internal RC Oscillator, 8 MHz 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0.5 1 1.5 2 2.5 3 3.5 4 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA)215 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-64. Idle Supply Current vs. VCC Internal RC Oscillator, 1 MHz Figure 21-65. Idle Supply Current vs. VCC Internal RC Oscillator, 128 kHz 85 °C 25 °C -40 °C 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0.005 0.01 0.015 0.02 0.025 0.03 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA)216 8183F–AVR–06/12 ATtiny24A/44A/84A 21.3.3 Standby Supply Current Figure 21-66. Standby Supply Current vs. VCC 4 MHz External Crystal, 22 pF External Capacitors, Watchdog Timer Disabled 21.3.4 Current Consumption in Power-down Mode Figure 21-67. Power-down Supply Current vs. VCC Watchdog Timer Disabled 85 °C 25 °C -40 °C 0 0.02 0.04 0.06 0.08 0.1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (uA)217 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-68. Power-down Supply Current vs. VCC Watchdog Timer Enabled 21.3.5 Current Consumption in Reset Figure 21-69. Reset Supply Current vs. VCC 0.1 - 1.0 MHz, Excluding Current through Reset Pull-up 85 °C 25 °C -40 °C 0 2 4 6 8 10 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (uA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)218 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-70. Reset Supply Current vs. VCC 1 - 20 MHz, Excluding Current Through Reset Pull-up 21.3.6 Current Consumption of Peripheral Units Figure 21-71. ADC Current vs. VCC 4 MHz Frequency 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0.5 1 1.5 2 2.5 3 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 0 100 200 300 400 500 600 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (uA)219 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-72. AREF Pin Current vs. Pin Voltage Figure 21-73. Analog Comparator Current vs. VCC 4 MHz Frequency 0 20 40 60 80 100 120 140 160 180 1.5 2 2.5 3 3.5 4 4.5 5 5.5 AREF (V) AREF pin current (uA) 0 20 40 60 80 100 120 140 160 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (uA)220 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-74. Programming Current vs. VCC Figure 21-75. Brownout Detector Current vs. VCC BOD Level = 1.8V 85 °C 25 °C -40 °C 0 2000 4000 6000 8000 10000 12000 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (uA) 85 °C 25 °C -40 °C 0 5 10 15 20 25 30 35 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (uA)221 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-76. Watchdog Timer Current vs. VCC 21.3.7 Pull-up Resistors Figure 21-77. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 1.8V 85 °C 25 °C -40 °C 0 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) ICC (mA) 85 °C 25 °C -40 °C 0 10 20 30 40 50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VOP (V) IOP (uA)222 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-78. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 2.7V Figure 21-79. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 5V 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 70 80 0 0.5 1 1.5 2 2.5 3 VOP (V) IOP (uA) 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 140 160 012345 VOP (V) IOP (uA)223 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-80. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 1.8V Figure 21-81. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 2.7V 0 5 10 15 20 25 30 35 40 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C 85 °C 25 °C 0 -40 °C 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 3 VRESET (V) IRESET (uA)224 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-82. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 5V 21.3.8 Output Driver Strength Figure 21-83. VOL: Output Voltage vs. Sink Current I/O Pin, VCC = 3V 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 012345 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 0 5 10 15 20 IOL (mA) VOL (V)225 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-84. VOL: Output Voltage vs. Sink Current I/O Pin, VCC = 5V Figure 21-85. VOH: Output Voltage vs. Source Current I/O Pin, VCC = 3V 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 IOL (mA) VOL (V) 85 °C 25 °C -40 °C 1.8 2 2.2 2.4 2.6 2.8 3 3.2 0 5 10 15 20 IOH (mA) VOH (V)226 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-86. VOH: Output Voltage vs. Source Current I/O Pin, VCC = 5V Figure 21-87. VOL: Output Voltage vs. Sink Current Reset Pin as I/O, VCC = 3V 85 °C 25 °C -40 °C 4.2 4.4 4.6 4.8 5 5.2 0 5 10 15 20 IOH (mA) VOH (V) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 0.5 1 1.5 2 2.5 3 IOL (mA) VOL (V)227 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-88. VOL: Output Voltage vs. Sink Current Reset Pin as I/O, VCC = 5V Figure 21-89. VOH: Output Voltage vs. Source Current Reset Pin as I/O, VCC = 3V 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 012345678 IOL (mA) VOL (V) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 IOH (mA) VOH (V)228 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-90. VOH: Output Voltage vs. Source Current Reset Pin as I/O, VCC = 5V 21.3.9 Input Threshold and Hysteresis (for I/O Ports) Figure 21-91. VIH: Input Threshold Voltage vs. VCC IO Pin, Read as ‘1’ 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 IOH (mA) VOH (V) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 3.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Threshold (V)229 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-92. VIL: Input Threshold Voltage vs. VCC I/O Pin, Read as ‘0’ Figure 21-93. VIH-VIL: Input Hysteresis vs. VCC I/O Pin 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Input Hysteresis (V)230 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-94. VIH: Input Threshold Voltage vs. VCC Reset Pin as I/O, Read as ‘1’ Figure 21-95. VIL: Input Threshold Voltage vs. VCC Reset Pin as I/O, Read as ‘0’ 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Threshold (V)231 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-96. VIH-VIL: Input Hysteresis vs. VCC Reset Pin as I/O 21.3.10 BOD, Bandgap and Reset Figure 21-97. BOD Threshold vs. Temperature BODLEVEL is 4.3V 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Input Hysteresis (V) 4.2 4.22 4.24 4.26 4.28 4.3 4.32 4.34 4.36 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) RISING VCC FALLING VCC232 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-98. BOD Threshold vs. Temperature BODLEVEL is 2.7V Figure 21-99. BOD Threshold vs. Temperature BODLEVEL is 1.8V 2.64 2.66 2.68 2.7 2.72 2.74 2.76 2.78 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) RISING VCC FALLING VCC RISING VCC FALLING VCC 1.77 1.78 1.79 1.8 1.81 1.82 1.83 1.84 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V)233 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-100. Bandgap Voltage vs. Supply Voltage Figure 21-101. Bandgap Voltage vs. Temperature 1 1.02 1.04 1.06 1.08 1.1 1.12 1.14 1.16 1.18 1.2 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Bandgap Voltage (V) 1 1.02 1.04 1.06 1.08 1.1 1.12 1.14 1.16 1.18 1.2 -40 -20 0 20 40 60 80 100 Temperature (C) Bandgap Voltage (V)234 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-102. VIH: Input Threshold Voltage vs. VCC Reset Pin, Read as ‘1’ Figure 21-103. VIL: Input Threshold Voltage vs. VCC Reset Pin, Read as ‘0’ 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V)235 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-104. VIH-VIL: Input Hysteresis vs. VCC Reset Pin Figure 21-105. Minimum Reset Pulse Width vs. VCC 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Input Hysteresis (V) 85 °C 25 °C -40 °C 0 200 400 600 800 1000 1200 1400 1600 1800 2000 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Pulsewidth (ns)236 8183F–AVR–06/12 ATtiny24A/44A/84A 21.3.11 Analog Comparator Offset Figure 21-106. Analog Comparator Offset VCC = 5V 21.3.12 Internal Oscillator Speed Figure 21-107. Watchdog Oscillator Frequency vs. VCC 85 25 -40 -0.007 -0.006 -0.005 -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0.004 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VIN (V) Offset (V) 85 °C 25 °C -40 °C 0.108 0.11 0.112 0.114 0.116 0.118 0.12 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Frequency (MHz)237 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-108. Watchdog Oscillator Frequency vs. Temperature Figure 21-109. Calibrated 8 MHz RC Oscillator Frequency vs. VCC 5.5 V 3.0 V 1.8 V 0.106 0.108 0.11 0.112 0.114 0.116 0.118 0.12 -40 -20 0 20 40 60 80 100 Temperature (C) Frequency (MHz) 7.4 7.6 7.8 8 8.2 8.4 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) Frequency (MHz) 85 °C 25 °C -40 °C238 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-110. Calibrated 8 MHz RC oscillator Frequency vs. Temperature Figure 21-111. Calibrated 8 MHz RC Oscillator Frequency vs. OSCCAL Value VCC = 3V 5.0 V 3.0 V 1.8 V 7.5 7.6 7.7 7.8 7.9 8 8.1 8.2 -40 -20 0 20 40 60 80 100 Temperature (C) Frequency (MHz) 85 °C 25 °C -40 °C 0 2 4 6 8 10 12 14 16 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL (X1) Frequency (MHz)239 8183F–AVR–06/12 ATtiny24A/44A/84A 21.4 ATtiny84A 21.4.1 Current Consumption in Active Mode Figure 21-112. Active Supply Current vs. Low Frequency 0.1 - 1.0 MHz, PRR = 0xFF Figure 21-113. Active Supply Current vs. Frequency 1 - 20 MHz, PRR = 0xFF 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,2 0,4 0,6 0,8 1 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 2 4 6 8 10 12 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA)240 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-114. Active Supply Current vs. VCC Internal RC Oscillator, 8 MHz Figure 21-115. Active Supply Current vs. VCC Internal RC Oscillator, 1 MHz 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA)241 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-116. Active Supply Current vs. VCC Internal RC Oscillator, 128 kHz 21.4.2 Current Consumption in Idle Mode Figure 21-117. Idle Supply Current vs. Low Frequency 0.1 - 1.0 MHz, PRR = 0xFF 85 °C 25 °C -40 °C 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA)242 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-118. Idle Supply Current vs. Frequency 1 - 20 MHz, PRR = 0xFF Figure 21-119. Idle Supply Current vs. VCC Internal RC Oscillator, 8 MHz 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,5 1 1,5 2 2,5 3 3,5 4 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C243 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-120. Idle Supply Current vs. VCC Internal RC Oscillator, 1 MHz Figure 21-121. Idle Supply Current vs. VCC Internal RC Oscillator, 128 kHz 85 °C 25 °C -40 °C 0 0,05 0,1 0,15 0,2 0,25 0,3 0,35 0,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 0 0,005 0,01 0,015 0,02 0,025 0,03 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C244 8183F–AVR–06/12 ATtiny24A/44A/84A 21.4.3 Current Consumption in Power-down Mode Figure 21-122. Power-down Supply Current vs. VCC Watchdog Timer Disabled Figure 21-123. Power-down Supply Current vs. VCC Watchdog Timer Enabled 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 2 4 6 8 10 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C245 8183F–AVR–06/12 ATtiny24A/44A/84A 21.4.4 Current Consumption in Reset Figure 21-124. Reset Supply Current vs. VCC 0.1 - 1.0 MHz, Excluding Current through Reset Pull-up Figure 21-125. Reset Supply Current vs. VCC 1 - 20 MHz, Excluding Current through Reset Pull-up 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,02 0,04 0,06 0,08 0,1 0,12 0,14 0,16 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.3 V 2.7 V 1.8 V 0 0,5 1 1,5 2 2,5 3 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA)246 8183F–AVR–06/12 ATtiny24A/44A/84A 21.4.5 Current Consumption of Peripheral Units Figure 21-126. ADC Current vs. VCC 4 MHz Frequency Figure 21-127. AREF Pin Current vs. Pin Voltage 0 100 200 300 400 500 600 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 0 20 40 60 80 100 120 140 160 1,5 2 2,5 3 3,5 4 4,5 5 5,5 AREF (V) AREF pin current (uA)247 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-128. Analog Comparator Current vs. VCC 4 MHz Frequency Figure 21-129. Programming Current vs. VCC 0 20 40 60 80 100 120 140 160 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 1000 2000 3000 4000 5000 6000 7000 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA)248 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-130. Brownout Detector Current vs. VCC BOD Level = 1.8V 21.4.6 Pull-up Resistors Figure 21-131. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 1.8V 85 °C 25 °C -40 °C 0 5 10 15 20 25 30 35 40 45 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VOP (V) IOP (uA)249 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-132. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 2.7V Figure 21-133. Pull-up Resistor Current vs. Input Voltage I/O Pin, VCC = 5V 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 70 80 0 0,5 1 1,5 2 2,5 3 VOP (V) IOP (uA) 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 VOP (V) IOP (uA)250 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-134. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 1.8V Figure 21-135. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 2.7V 85 °C 25 °C -40 °C 0 5 10 15 20 25 30 35 40 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 0 0,5 1 1,5 2 2,5 3 VRESET (V) IRESET (uA)251 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-136. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 5V 21.4.7 Output Driver Strength Figure 21-137. VOL: Output Voltage vs. Sink Current I/O Pin, VCC = 3V 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 0 2 4 6 8 10 12 14 16 18 20 IOL (mA) VOL (V)252 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-138. VOL: Output Voltage vs. Sink Current I/O Pin, VCC = 5V Figure 21-139. VOH: Output Voltage vs. Source Current I/O Pin, VCC = 3V 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0 2 4 6 8 10 12 14 16 18 20 IOL (mA) VOL (V) 85 °C 25 °C -40 °C 1,8 2 2,2 2,4 2,6 2,8 3 3,2 0 2 4 6 8 10 12 14 16 18 20 IOH (mA) VOH (V)253 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-140. VOH: Output Voltage vs. Source Current I/O Pin, VCC = 5V Figure 21-141. VOL: Output Voltage vs. Sink Current Reset Pin as I/O, VCC = 3V 85 °C 25 °C -40 °C 4,2 4,4 4,6 4,8 5 5,2 0 2 4 6 8 10 12 14 16 18 20 IOH (mA) VOH (V) 0 0,2 0,4 0,6 0,8 1 1,2 1,4 0 0,5 1 1,5 2 2,5 3 IOL (mA) VOL (V) 85 °C 25 °C -40 °C254 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-142. VOL: Output Voltage vs. Sink Current Reset Pin as I/O, VCC = 5V Figure 21-143. VOH: Output Voltage vs. Source Current Reset Pin as I/O, VCC = 3V 85 °C 25 °C -40 °C 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 012345678 IOL (mA) VOL (V) 0 0,5 1 1,5 2 2,5 3 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 IOH (mA) VOH (V) 85 °C 25 °C -40 °C255 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-144. VOH: Output Voltage vs. Source Current Reset Pin as I/O, VCC = 5V 21.4.8 Input Threshold and Hysteresis (for I/O Ports) Figure 21-145. VIH: Input Threshold Voltage vs. VCC I/O Pin, Read as ‘1’ 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 IOH (mA) VOH (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 3 3,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C256 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-146. VIL: Input Threshold Voltage vs. VCC I/O Pin, Read as ‘0’ Figure 21-147. VIH-VIL: Input Hysteresis vs. VCC I/O Pin 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 0 0,1 0,2 0,3 0,4 0,5 0,6 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) 85 °C 25 °C -40 °C257 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-148. VIH: Input Threshold Voltage vs. VCC Reset Pin as I/O, Read as ‘1’ Figure 21-149. VIL: Input Threshold Voltage vs. VCC Reset Pin as I/O, Read as ‘0’ 0 0,5 1 1,5 2 2,5 3 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C258 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-150. VIH-VIL: Input Hysteresis vs. VCC Reset Pin as I/O 21.4.9 BOD, Bandgap and Reset Figure 21-151. BOD Threshold vs. Temperature BODLEVEL is 4.3V 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) 4,24 4,26 4,28 4,3 4,32 4,34 4,36 4,38 4,4 4,42 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) RISING VCC FALLING VCC259 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-152. BOD Threshold vs. Temperature BODLEVEL is 2.7V Figure 21-153. Bandgap Voltage vs. Supply Voltage 2,66 2,68 2,7 2,72 2,74 2,76 2,78 2,8 2,82 -40 -20 0 20 40 60 80 100 Temperature (C) Threshold (V) RISING VCC FALLING VCC 1 1,02 1,04 1,06 1,08 1,1 1,12 1,14 1,16 1,18 1,2 1,5 2 2,5 3 3,5 4 4,5 5 5,5 Vcc (V) Bandgap Voltage (V)260 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-154. Bandgap Voltage vs. Temperature Figure 21-155. VIH: Input Threshold Voltage vs. VCC Reset Pin, Read as ‘1’ 1 1,02 1,04 1,06 1,08 1,1 1,12 1,14 1,16 1,18 1,2 -40 -20 0 20 40 60 80 100 Temperature (C) Bandgap Voltage (V) 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C261 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-156. VIL: Input Threshold Voltage vs. VCC Reset Pin, Read as ‘0’ Figure 21-157. VIH-VIL: Input Hysteresis vs. VCC Reset Pin 0 0,5 1 1,5 2 2,5 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Threshold (V) 85 °C 25 °C -40 °C 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Input Hysteresis (V) 85 °C 25 °C -40 °C262 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-158. Minimum Reset Pulse Width vs. VCC 21.4.10 Analog Comparator Offset Figure 21-159. Analog Comparator Offset VCC = 5V 0 200 400 600 800 1000 1200 1400 1600 1800 2000 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Pulsewidth (ns) 85 °C 25 °C -40 °C 85 25 -40 -0.012 -0.01 -0.008 -0.006 -0.004 -0.002 0 0.002 0.004 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Vin (V) Offset (V)263 8183F–AVR–06/12 ATtiny24A/44A/84A 21.4.11 Internal Oscillator Speed Figure 21-160. Watchdog Oscillator Frequency vs. VCC Figure 21-161. Watchdog Oscillator Frequency vs. Temperature 108 110 112 114 116 118 120 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) FRC (kHz) 85 °C 25 °C -40 °C 5.5 V 3.0 V 1.8 V 106 108 110 112 114 116 118 120 -40 -20 0 20 40 60 80 100 Temperature (C) FRC (kHz)264 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-162. Calibrated 8 MHz RC Oscillator Frequency vs. VCC Figure 21-163. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature 7,4 7,5 7,6 7,7 7,8 7,9 8 8,1 8,2 8,3 8,4 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) FRC (MHz) 85 °C 25 °C -40 °C 5.0 V 3.0 V 1.8 V 7,5 7,6 7,7 7,8 7,9 8 8,1 8,2 8,3 8,4 -40 -20 0 20 40 60 80 100 Temperature (C) FRC (MHz)265 8183F–AVR–06/12 ATtiny24A/44A/84A Figure 21-164. Calibrated 8 MHz RC Oscillator Frequency vs. OSCCAL Value VCC = 3V 0 2 4 6 8 10 12 14 16 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL (X1) FRC (MHz) 85 °C 25 °C -40 °C266 8183F–AVR–06/12 ATtiny24A/44A/84A 22. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F (0x5F) SREG I T H S V N Z C Page 14 0x3E (0x5E) SPH – – – – – – SP9 SP8 Page 13 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 Page 13 0x3C (0x5C) OCR0B Timer/Counter0 – Output Compare Register B Page 83 0x3B (0x5B) GIMSK – INT0 PCIE1 PCIE0 – – – – Page 50 0x3A (0x5A) GIFR – INTF0 PCIF1 PCIF0 – – – – Page 51 0x39 (0x59) TIMSK0 – – – – – OCIE0B OCIE0A TOIE0 Page 83 0x38 (0x58) TIFR0 – – – – – OCF0B OCF0A TOV0 Page 84 0x37 (0x57) SPMCSR – – RSIG CTPB RFLB PGWRT PGERS SPMEN Page 156 0x36 (0x56) OCR0A Timer/Counter0 – Output Compare Register A Page 83 0x35 (0x55) MCUCR BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 Pages 36, 50, 66 0x34 (0x54) MCUSR – – – – WDRF BORF EXTRF PORF Page 44 0x33 (0x53) TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 Page 82 0x32 (0x52) TCNT0 Timer/Counter0 Page 83 0x31 (0x51) OSCCAL CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 Page 31 0x30 (0x50) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 Page 79 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 Page 106 0x2E (0x4E) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 Page 108 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High Byte Page 110 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low Byte Page 110 0x2B (0x4B) OCR1AH Timer/Counter1 – Compare Register A High Byte Page 110 0x2A (0x4A) OCR1AL Timer/Counter1 – Compare Register A Low Byte Page 110 0x29 (0x49) OCR1BH Timer/Counter1 – Compare Register B High Byte Page 110 0x28 (0x48) OCR1BL Timer/Counter1 – Compare Register B Low Byte Page 110 0x27 (0x47) DWDR DWDR[7:0] Page 151 0x26 (0x46) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 Page 31 0x25 (0x45) ICR1H Timer/Counter1 - Input Capture Register High Byte Page 111 0x24 (0x44) ICR1L Timer/Counter1 - Input Capture Register Low Byte Page 111 0x23 (0x43) GTCCR TSM – – – – – – PSR10 Page 114 0x22 (0x42) TCCR1C FOC1A FOC1B – – – – – – Page 109 0x21 (0x41) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 Page 44 0x20 (0x40) PCMSK1 – – – – PCINT11 PCINT10 PCINT9 PCINT8 Page 51 0x1F (0x3F) EEARH – – – – – – – EEAR8 Page 20 0x1E (0x3E) EEARL EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 Page 21 0x1D (0x3D) EEDR EEPROM Data Register Page 21 0x1C (0x3C) EECR – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE Page 23 0x1B (0x3B) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 Page 66 0x1A (0x3A) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 Page 66 0x19 (0x39) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 Page 67 0x18 (0x38) PORTB – – – – PORTB3 PORTB2 PORTB1 PORTB0 Page 67 0x17 (0x37) DDRB – – – – DDB3 DDB2 DDB1 DDB0 Page 67 0x16 (0x36) PINB – – – – PINB3 PINB2 PINB1 PINB0 Page 67 0x15 (0x35) GPIOR2 General Purpose I/O Register 2 Page 22 0x14 (0x34) GPIOR1 General Purpose I/O Register 1 Page 23 0x13 (0x33) GPIOR0 General Purpose I/O Register 0 Page 23 0x12 (0x32) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 Page 52 0x11 (0x31)) Reserved – 0x10 (0x30) USIBR USI Buffer Register Page 127 0x0F (0x2F) USIDR USI Data Register Page 126 0x0E (0x2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 Page 125 0x0D (0x2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC Page 123 0x0C (0x2C) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 Page 111 0x0B (0x2B) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 Page 112 0x0A (0x2A) Reserved – 0x09 (0x29) Reserved – 0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 Page 129 0x07 (0x27) ADMUX REFS1 REFS0 MUX5 MUX4 MUX3 MUX2 MUX1 MUX0 Page 144 0x06 (0x26) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 Page 146 0x05 (0x25) ADCH ADC Data Register High Byte Page 148 0x04 (0x24) ADCL ADC Data Register Low Byte Page 148 0x03 (0x23) ADCSRB BIN ACME – ADLAR – ADTS2 ADTS1 ADTS0 Pages 130, 148 0x02 (0x22) Reserved – 0x01 (0x21) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D Pages 131, 149 0x00 (0x20) PRR – – – – PRTIM1 PRTIM0 PRUSI PRADC Page 37267 8183F–AVR–06/12 ATtiny24A/44A/84A Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only.268 8183F–AVR–06/12 ATtiny24A/44A/84A 23. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 BRANCH INSTRUCTIONS RJMP k Relative Jump PC ← PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC ← Z None 2 RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ← Z None 3 RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1269 8183F–AVR–06/12 ATtiny24A/44A/84A ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Twos Complement Overflow. V ← 1 V1 CLV Clear Twos Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd ← Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 LPM Load Program Memory R0 ← (Z) None 3 LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 SPM Store Program Memory (z) ← R1:R0 None IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/Timer) None 1 BREAK Break For On-chip Debug Only None N/A Mnemonics Operands Description Operation Flags #Clocks270 8183F–AVR–06/12 ATtiny24A/44A/84A 24. Ordering Information Notes: 1. For speed vs. supply voltage, see section 20.3 “Speed” on page 174. 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS) 3. Code indicators: – H: NiPdAu lead finish – F, N, U: matte tin – R: tape & reel 4. Topside marking for ATtiny24A: T24 / Axx / manufacturing data 5. Also supplied in wafer form. Contact your local Atmel sales office for ordering information and minimum quantities. 6. For typical and electrical characteristics, see “Appendix A – ATtiny24A/44A Specification at 105°C”. 7. For typical and electrical characteristics, see “Appendix B – ATtiny24A/44A/84A Specification at 125°C”. 24.1 ATtiny24A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) 20 1.8 – 5.5V Industrial (-40°C to +85°C) (5) 14S1 ATtiny24A-SSU ATtiny24A-SSUR 14P3 ATtiny24A-PU 15CC1 ATtiny24A-CCU ATtiny24A-CCUR 20M1 ATtiny24A-MU ATtiny24A-MUR 20M2 ATtiny24A-MMH (4) ATtiny24A-MMHR (4) Industrial (-40°C to +105°C) (6) 14S1 ATtiny24A-SSN ATtiny24A-SSNR Industrial (-40°C to +125°C) (7) 14S1 ATtiny24A-SSF ATtiny24A-SSFR 20M1 ATtiny24A-MF ATtiny24A-MFR 20M2 ATtiny24A-MM8 ATtiny24A-MM8R Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 15CC1 15-ball (4 x 4 Array), 0.65 mm Pitch, 3.0 x 3.0 x 0.6 mm, Ultra Thin, Fine-Pitch Ball Grid Array Package (UFBGA) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No Lead / Micro Lead Frame Package (QFN/MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN)271 8183F–AVR–06/12 ATtiny24A/44A/84A Notes: 1. For speed vs. supply voltage, see section 20.3 “Speed” on page 174. 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Code indicators: – H: NiPdAu lead finish – F, N, U: matte tin – R: tape & reel 4. Topside marking for ATtiny44A: – 1st Line: T44 – 2nd Line: Axx – 3rd Line: manufacturing data 5. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 6. For typical and electrical characteristics, see “Appendix A – ATtiny24A/44A Specification at 105°C”. 7. For typical and electrical characteristics, see “Appendix B – ATtiny24A/44A/84A Specification at 125°C”. 24.2 ATtiny44A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) 20 1.8 – 5.5V Industrial (-40°C to +85°C) (5) 14S1 ATtiny44A-SSU ATtiny44A-SSUR 14P3 ATtiny44A-PU 15CC1 ATtiny44A-CCU ATtiny44A-CCUR 20M1 ATtiny44A-MU ATtiny44A-MUR 20M2 ATtiny44A-MMH (4) ATtiny44A-MMHR (4) Industrial (-40°C to +105°C) (6) 14S1 ATtiny44A-SSN ATtiny44A-SSNR Industrial (-40°C to +125°C) (7) 14S1 ATtiny44A-SSF ATtiny44A-SSFR 20M1 ATtiny44A-MF ATtiny44A-MFR Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 15CC1 15-ball (4 x 4 Array), 0.65 mm Pitch, 3.0 x 3.0 x 0.6 mm, Ultra Thin, Fine-Pitch Ball Grid Array Package (UFBGA) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No Lead / Micro Lead Frame Package (QFN/MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN)272 8183F–AVR–06/12 ATtiny24A/44A/84A Notes: 1. For speed vs. supply voltage, see section 20.3 “Speed” on page 174. 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Code indicators: – H: NiPdAu lead finish – F, N, U: matte tin – R: tape & reel 4. Topside marking for ATtiny84A: – 1st Line: T84 – 2nd Line: Axx – 3rd Line: manufacturing data 5. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 6. For typical and electrical characteristics, see “Appendix A – ATtiny24A/44A Specification at 105°C”. 7. For typical and electrical characteristics, see “Appendix B – ATtiny24A/44A/84A Specification at 125°C”. 24.3 ATtiny84A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) 20 1.8 – 5.5V Industrial (-40°C to +85°C) (5) 14S1 ATtiny84A-SSU ATtiny84A-SSUR 14P3 ATtiny84A-PU 15CC1 ATtiny84A-CCU ATtiny84A-CCUR 20M1 ATtiny84A-MU ATtiny84A-MUR 20M2 ATtiny84A-MMH (4) ATtiny84A-MMHR (4) Industrial (-40°C to +125°C) (7) 14S1 ATtiny84A-SSF ATtiny84A-SSFR Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 15CC1 15-ball (4 x 4 Array), 0.65 mm Pitch, 3.0 x 3.0 x 0.6 mm, Ultra Thin, Fine-Pitch Ball Grid Array Package (UFBGA) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No Lead / Micro Lead Frame Package (QFN/MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN)273 8183F–AVR–06/12 ATtiny24A/44A/84A 25. Packaging Information 25.1 14S1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 14S1, 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 2/5/02 14S1 A A1 E L Side View Top View End View E H b N 1 e A D COMMON DIMENSIONS (Unit of Measure = mm/inches) SYMBOL MIN NOM MAX NOTE Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-012, Variation AB for additional information. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusion and gate burrs shall not exceed 0.15 mm (0.006") per side. 3. Dimension E does not include inter-lead Flash or protrusion. Inter-lead flash and protrusions shall not exceed 0.25 mm (0.010") per side. 4. L is the length of the terminal for soldering to a substrate. 5. The lead width B, as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm (0.024") per side. A 1.35/0.0532 – 1.75/0.0688 A1 0.1/.0040 – 0.25/0.0098 b 0.33/0.0130 – 0.5/0.02005 D 8.55/0.3367 – 8.74/0.3444 2 E 3.8/0.1497 – 3.99/0.1574 3 H 5.8/0.2284 – 6.19/0.2440 L 0.41/0.0160 – 1.27/0.0500 4 e 1.27/0.050 BSC274 8183F–AVR–06/12 ATtiny24A/44A/84A 25.2 14P3 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 14P3, 14-lead (0.300"/7.62 mm Wide) Plastic Dual Inline Package (PDIP) 14P3 B 2010-10-20 PIN 1 E1 A1 B E B1 C L SEATING PLANE A D e eB eC COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 5.334 A1 0.381 – – D 18.669 – 19.685 Note 2 E 7.620 – 8.255 E1 6.096 – 7.112 Note 2 B 0.356 – 0.559 B1 1.143 – 1.778 L 2.921 – 3.810 C 0.203 – 0.356 eB – – 10.922 eC 0.000 – 1.524 e 2.540 TYP Notes: 1. This package conforms to JEDEC reference MS-001, Variation AA. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). 275 8183F–AVR–06/12 ATtiny24A/44A/84A 25.3 15CC1 TITLE GPC DRAWING NO. REV. Package Drawing Contact: R packagedrawings@atmel.com CBC C 15CC1, 15-ball (4 x 4 Array), 3.0 x 3.0 x 0.6 mm package, ball pitch 0.65 mm, Ultra thin, Fine-Pitch Ball Grid Array Package (UFBGA) 15CC1 07/06/10 A – – 0.60 A1 0.12 – – A2 0.38 REF b 0.25 0.30 0.35 1 b1 0.25 – – 2 D 2.90 3.00 3.10 D1 1.95 BSC E 2.90 3.00 3.10 E1 1.95 BSC e 0.65 BSC COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE TOP VIEW 123 4 A B C D E D 15-Øb D C B A Pin#1 ID 0.08 A1 A D1 E1 A2 A1 BALL CORNER e 123 4 SIDE VIEW b1 BOTTOM VIEW e Note1: Dimension “b” is measured at the maximum ball dia. in a plane parallel to the seating plane. Note2: Dimension “b1” is the solderable surface defined by the opening of the solder resist layer.276 8183F–AVR–06/12 ATtiny24A/44A/84A 25.4 20M1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 20M1 B 10/27/04 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) A 0.70 0.75 0.80 A1 – 0.01 0.05 A2 0.20 REF b 0.18 0.23 0.30 D 4.00 BSC D2 2.45 2.60 2.75 E 4.00 BSC E2 2.45 2.60 2.75 e 0.50 BSC L 0.35 0.40 0.55 SIDE VIEW Pin 1 ID Pin #1 Notch (0.20 R) BOTTOM VIEW TOP VIEW Note: Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D E e A2 A1 A D2 E2 0.08 C L 1 2 3 b 1 2 3277 8183F–AVR–06/12 ATtiny24A/44A/84A 25.5 20M2 TITLE GPC DRAWING NO. REV. Package Drawing Contact: packagedrawings@atmel.com ZFC B 20M2 20M2, 20-pad, 3 x 3 x 0.85 mm Body, Lead Pitch 0.45 mm, 1.55 x 1.55 mm Exposed Pad, Thermally Enhanced Plastic Very Thin Quad Flat No Lead Package (VQFN) 10/24/08 15 14 13 12 11 1 2 3 4 5 16 17 18 19 20 10 9 8 7 6 D2 E2 e b L K Pin #1 Chamfer (C 0.3) D E SIDE VIEW A1 y Pin 1 ID BOTTOM VIEW TOP VIEW A C C0.18 (8X) 0.3 Ref (4x) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.75 0.80 0.85 A1 0.00 0.02 0.05 b 0.17 0.22 0.27 C 0.152 D 2.90 3.00 3.10 D2 1.40 1.55 1.70 E 2.90 3.00 3.10 E2 1.40 1.55 1.70 e – 0.45 – L 0.35 0.40 0.45 K 0.20 – – y 0.00 – 0.08 278 8183F–AVR–06/12 ATtiny24A/44A/84A 26. Errata The revision letters in this section refer to the revision of the corresponding ATtiny24A/44A/84A device. 26.1 ATtiny24A 26.1.1 Rev. H No known errata. 26.1.2 Rev. G Not sampled. 26.1.3 Rev. F Not sampled. 26.2 ATtiny44A 26.2.1 Rev. G No known errata. Yield improvement. 26.2.2 Rev. F No known errata. 26.2.3 Rev. E Not sampled. 26.3 ATtiny84A 26.3.1 Rev. C No known errata.279 8183F–AVR–06/12 ATtiny24A/44A/84A 27. Datasheet Revision History 27.1 Rev. 8183F – 06/12 1. Updated: – Table 16-1 on page 138 – Figure 16-7 on page 137 – “Ordering Information” on page 270 27.2 Rev. 8183E – 01/12 1. Updated: – Production status for ATtiny24A and ATtiny84A – “Start Condition Detector” on page 122 – “Ordering Information” on page 270, 271, and 272 27.3 Rev. 8183D – 04/11 1. Added errata for ATtiny44A rev. G in Section 26. “Errata” on page 278 27.4 Rev. 8183C – 03/11 1. Added: – ATtiny84A, including typical characteristics plots – Section 3.3 “Capacitive Touch Sensing” on page 6 – Table 6-8, “Capacitance of Low-Frequency Crystal Oscillator,” on page 28 – Analog Comparator Offset plots for ATtiny24A (Figure 21.2.10 on page 208) and ATtiny44A (Figure 21.3.11 on page 236) – Extended temperature part numbers in Section 24. “Ordering Information” on page 270 2. Updated: – Bit syntax throughout the datasheet, e.g. from CS02:0 to CS0[2:0] – Section 6.4 “Clock Output Buffer” on page 30, changed CLKO to CKOUT – Table 16-4, “Single-Ended Input channel Selections,” on page 145, added note for Internal 1.1V Reference – Table 19-16, “High-voltage Serial Programming Instruction Set for ATtiny24A/44A/84A,” on page 170, adjusted notes – Table 20-1, “DC Characteristics. TA = -40°C to +85°C,” on page 173, adjusted notes 27.5 Rev. 8183B – 03/10 1. Updated template. 2. Added UFBGA package (15CC1) in: “Features” on page 1, “Pin Configurations” on page 2, Section 24. “Ordering Information” on page 270, and Section 25.3 “15CC1” on page 275. 3. Separated typical characteristic plots, added Section 21.2 “ATtiny24A” on page 183. 4. Updated sections: – Section 14.5.4 “USIBR – USI Buffer Register” on page 127, header updated280 8183F–AVR–06/12 ATtiny24A/44A/84A – Section 24. “Ordering Information” on page 270, added tape & reel and topside marking, updated notes 5. Updated Figures: – Figure 4-1 “Block Diagram of the AVR Architecture” on page 7 – Figure 8-1 “Reset Logic” on page 38 – Figure 14-1 “Universal Serial Interface, Block Diagram” on page 116, USIDB -> USIBR – Figure 19-5 “High-voltage Serial Programming Waveforms” on page 169 6. Updated Tables: – Table 19-11, “Minimum Wait Delay Before Writing the Next Flash or EEPROM Location,” on page 164, updated value for tWD_ERASE 27.6 Rev. 8183A – 12/08 1. Initial revision. Created from document 8006H. 2. Updated "Ordering Information" on page 278 and page 278. Pb-plated packages are no longer offered and there are no separate ordering codes for commercial operation range, the only available option now is industrial. Also, updated some order codes to reflect changes in leadframe composition and added VQFN package option. 3. Updated data sheet template. 4. Removed all references to 8K device. 5. Updated characteristic plots of section “Typical Characteristics”, starting on page 182. 6. Added characteristic plots: – “Bandgap Voltage vs. Supply Voltage” on page 233 – “Bandgap Voltage vs. Temperature” on page 233 7. Updated sections: – “Features” on page 1 – “Power Reduction Register” on page 35 – “Analog Comparator” on page 128 – “Features” on page 132 – “Operation” on page 133 – “Starting a Conversion” on page 134 – “ADC Voltage Reference” on page 139 – “Speed” on page 174 8. Updated Figures: – “Program Memory Map” on page 15 – “Data Memory Map” on page 16 9. Update Tables: – “Device Signature Bytes” on page 161 – “DC Characteristics. TA = -40°C to +85°C” on page 173 – “Additional Current Consumption for the different I/O modules (absolute values)” on page 182 – “Additional Current Consumption (percentage) in Active and Idle mode” on page 183i 8183F–AVR–06/12 ATtiny24A/44A/84A Table of Contents Features ..................................................................................................... 1 1 Pin Configurations ................................................................................... 2 1.1 Pin Descriptions .................................................................................................3 2 Overview ................................................................................................... 4 3 General Information ................................................................................. 6 3.1 Resources .........................................................................................................6 3.2 Code Examples .................................................................................................6 3.3 Capacitive Touch Sensing .................................................................................6 3.4 Data Retention ...................................................................................................6 3.5 Disclaimer ..........................................................................................................6 4 CPU Core .................................................................................................. 7 4.1 Architectural Overview .......................................................................................7 4.2 ALU – Arithmetic Logic Unit ...............................................................................8 4.3 Status Register ..................................................................................................8 4.4 General Purpose Register File ..........................................................................9 4.5 Stack Pointer ...................................................................................................10 4.6 Instruction Execution Timing ...........................................................................10 4.7 Reset and Interrupt Handling ...........................................................................11 4.8 Register Description ........................................................................................13 5 Memories ................................................................................................ 15 5.1 In-System Re-programmable Flash Program Memory ....................................15 5.2 SRAM Data Memory ........................................................................................15 5.3 EEPROM Data Memory ..................................................................................16 5.4 I/O Memory ......................................................................................................20 5.5 Register Description ........................................................................................20 6 Clock System ......................................................................................... 24 6.1 Clock Subsystems ...........................................................................................24 6.2 Clock Sources .................................................................................................25 6.3 System Clock Prescaler ..................................................................................30 6.4 Clock Output Buffer .........................................................................................30 6.5 Register Description ........................................................................................31 7 Power Management and Sleep Modes ................................................. 33ii 8183F–AVR–06/12 ATtiny24A/44A/84A 7.1 Sleep Modes ....................................................................................................33 7.2 Software BOD Disable .....................................................................................34 7.3 Power Reduction Register ...............................................................................35 7.4 Minimizing Power Consumption ......................................................................35 7.5 Register Description ........................................................................................36 8 System Control and Reset .................................................................... 38 8.1 Resetting the AVR ...........................................................................................38 8.2 Reset Sources .................................................................................................39 8.3 Internal Voltage Reference ..............................................................................41 8.4 Watchdog Timer ..............................................................................................41 8.5 Register Description ........................................................................................44 9 Interrupts ................................................................................................ 47 9.1 Interrupt Vectors ..............................................................................................47 9.2 External Interrupts ...........................................................................................48 9.3 Register Description ........................................................................................50 10 I/O Ports .................................................................................................. 53 10.1 Ports as General Digital I/O .............................................................................54 10.2 Alternate Port Functions ..................................................................................58 10.3 Register Description ........................................................................................66 11 8-bit Timer/Counter0 with PWM ............................................................ 68 11.1 Features ..........................................................................................................68 11.2 Overview ..........................................................................................................68 11.3 Clock Sources .................................................................................................69 11.4 Counter Unit ....................................................................................................69 11.5 Output Compare Unit .......................................................................................70 11.6 Compare Match Output Unit ............................................................................72 11.7 Modes of Operation .........................................................................................73 11.8 Timer/Counter Timing Diagrams .....................................................................77 11.9 Register Description ........................................................................................79 12 16-bit Timer/Counter1 ............................................................................ 85 12.1 Features ..........................................................................................................85 12.2 Overview ..........................................................................................................85 12.3 Timer/Counter Clock Sources .........................................................................87 12.4 Counter Unit ....................................................................................................87iii 8183F–AVR–06/12 ATtiny24A/44A/84A 12.5 Input Capture Unit ...........................................................................................88 12.6 Output Compare Units .....................................................................................90 12.7 Compare Match Output Unit ............................................................................92 12.8 Modes of Operation .........................................................................................94 12.9 Timer/Counter Timing Diagrams ...................................................................101 12.10 Accessing 16-bit Registers ............................................................................103 12.11 Register Description ......................................................................................106 13 Timer/Counter Prescaler ..................................................................... 113 13.1 Prescaler Reset .............................................................................................113 13.2 External Clock Source ...................................................................................113 13.3 Register Description ......................................................................................114 14 USI – Universal Serial Interface .......................................................... 116 14.1 Features ........................................................................................................116 14.2 Overview ........................................................................................................116 14.3 Functional Descriptions .................................................................................117 14.4 Alternative USI Usage ...................................................................................123 14.5 Register Descriptions ....................................................................................123 15 Analog Comparator ............................................................................. 128 15.1 Analog Comparator Multiplexed Input ...........................................................128 15.2 Register Description ......................................................................................129 16 Analog to Digital Converter ................................................................ 132 16.1 Features ........................................................................................................132 16.2 Overview ........................................................................................................132 16.3 Operation .......................................................................................................133 16.4 Starting a Conversion ....................................................................................134 16.5 Prescaling and Conversion Timing ................................................................135 16.6 Changing Channel or Reference Selection ...................................................138 16.7 ADC Noise Canceler .....................................................................................139 16.8 Analog Input Circuitry ....................................................................................139 16.9 Noise Canceling Techniques .........................................................................140 16.10 ADC Accuracy Definitions .............................................................................140 16.11 ADC Conversion Result .................................................................................142 16.12 Temperature Measurement ...........................................................................143 16.13 Register Description ......................................................................................144iv 8183F–AVR–06/12 ATtiny24A/44A/84A 17 debugWIRE On-chip Debug System .................................................. 150 17.1 Features ........................................................................................................150 17.2 Overview ........................................................................................................150 17.3 Physical Interface ..........................................................................................150 17.4 Software Break Points ...................................................................................151 17.5 Limitations of debugWIRE .............................................................................151 17.6 Register Description ......................................................................................151 18 Self-Programming the Flash ............................................................... 152 18.1 Performing Page Erase by SPM ....................................................................152 18.2 Filling the Temporary Buffer (Page Loading) .................................................152 18.3 Performing a Page Write ...............................................................................153 18.4 Addressing the Flash During Self-Programming ...........................................153 18.5 EEPROM Write Prevents Writing to SPMCSR ..............................................154 18.6 Reading Lock, Fuse and Signature Data from Software ...............................154 18.7 Preventing Flash Corruption ..........................................................................156 18.8 Programming Time for Flash when Using SPM ............................................156 18.9 Register Description ......................................................................................156 19 Memory Programming ......................................................................... 158 19.1 Program And Data Memory Lock Bits ...........................................................158 19.2 Fuse Bytes .....................................................................................................159 19.3 Device Signature Imprint Table .....................................................................160 19.4 Page Size ......................................................................................................161 19.5 Serial Programming .......................................................................................162 19.6 High-voltage Serial Programming ..................................................................166 19.7 High-Voltage Serial Programming Algorithm .................................................166 20 Electrical Characteristics .................................................................... 173 20.1 Absolute Maximum Ratings* .........................................................................173 20.2 DC Characteristics .........................................................................................173 20.3 Speed ............................................................................................................174 20.4 Clock Characteristics .....................................................................................175 20.5 System and Reset Characteristics ................................................................176 20.6 ADC Characteristics ......................................................................................177 20.7 Analog Comparator Characteristics ...............................................................180 20.8 Serial Programming Characteristics ..............................................................180 20.9 High-Voltage Serial Programming Characteristics ........................................181v 8183F–AVR–06/12 ATtiny24A/44A/84A 21 Typical Characteristics ........................................................................ 182 21.1 Supply Current of I/O Modules ......................................................................182 21.2 ATtiny24A ......................................................................................................183 21.3 ATtiny44A ......................................................................................................211 21.4 ATtiny84A ......................................................................................................239 22 Register Summary ............................................................................... 266 23 Instruction Set Summary .................................................................... 268 24 Ordering Information ........................................................................... 270 24.1 ATtiny24A ......................................................................................................270 24.2 ATtiny44A ......................................................................................................271 24.3 ATtiny84A ......................................................................................................272 25 Packaging Information ........................................................................ 273 25.1 14S1 ..............................................................................................................273 25.2 14P3 ..............................................................................................................274 25.3 15CC1 ...........................................................................................................275 25.4 20M1 ..............................................................................................................276 25.5 20M2 ..............................................................................................................277 26 Errata ..................................................................................................... 278 26.1 ATtiny24A ......................................................................................................278 26.2 ATtiny44A ......................................................................................................278 26.3 ATtiny84A ......................................................................................................278 27 Datasheet Revision History ................................................................ 279 27.1 Rev. 8183F – 06/12 .......................................................................................279 27.2 Rev. 8183E – 01/12 .......................................................................................279 27.3 Rev. 8183D – 04/11 .......................................................................................279 27.4 Rev. 8183C – 03/11 .......................................................................................279 27.5 Rev. 8183B – 03/10 .......................................................................................279 27.6 Rev. 8183A – 12/08 .......................................................................................2808183F–AVR–06/12 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 Product Contact Web Site www.atmel.com Technical Support avr@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2012 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Atmel Xplained Pro Atmel® Xplained Pro kits provide a complete and easy to use low-cost development platform for evaluating and prototyping your Atmel Flash-based microcontrollers (MCUs) designs. The Xplained Pro kits offer expansion ports that allow you to connect extension boards to provide more system functionality including OLED LCD displays, buttons, sensors and more, for fast application prototyping. You can purchase add-on boards from Atmel, or build your own. The new kits are part of Atmel’s complete MCU tools ecosystem, working seamlessly with Atmel Studio 6 IDP that includes over 1600 example projects from Atmel Software Framework. When combined with Atmel Gallery, an online apps store for development tools and embedded software, and Atmel Spaces, a cloud-based collaborative development work space, the Xplained Pro kits further simplify your embedded MCU designs reducing your overall development time. To learn more about Atmel Xplained Pro kits, visit http://www.atmel.com/XplainedPro Atmel Xplained Pro kits are available from your Atmel distributor or at store.atmel.com.© 2013 Atmel Corporation. All rights reserved. / Rev.: Atmel-45024B-Xplained-Pro-Flyer_E_A5_0213 Atmel®, Atmel logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T : (+1)(408) 441. 0311 F : (+1)(408) 436. 4200 | www.atmel.com Evaluation Kit Contents SAP Code Price SAM4L Xplained Pro Evaluation Kit SAM4L MCU Board ATSAM4L-XPRO $39 SAM4S Xplained Pro Evaluation Kit SAM4S MCU Board ATSAM4S-XPRO $39 ATmega256RFR2 Xplained Pro Evaluation Kit ATmega256RFR2 MCU Board ATMEGA256RFR2-XPRO $39 SAM4L Xplained Pro Starter Kit SAM4L MCU Board 4 Extension Boards: Segment LCD, OLED Display, I/O, Prototyping ATSAM4L-XSTK $109 SAM4S Xplained Pro Starter Kit SAM4S MCU Board 3 Extension Boards: OLED Display, I/O, Prototyping ATSAM4S-XSTK $99 RFR2 Xplained Pro Starter Kit 3 Extension Boards: OLED Display, I/O, Prototyping ATMEGA256RFR2-XSTK $99 OLED Xplained Pro Extension Extension board with 128x32 OLED Display, 3 Buttons and 3 LEDs ATOLED1-XPRO $22 Segment LCD Xplained Pro Extension Extension Board with LCD Segment Display ATSLCD1-XPRO $22 I/O Xplained Pro Extension Extension Board with Light Sensor, Temperature Sensor, Micro SD Card, UART Loopback ATIO1-XPRO $27 Prototyping Xplained Pro Extension Prototyping Extension Board with Bread-boarding Area ATPROTO1-XPRO $18 Not recommended for new designs - Use XMEGA A1U series 8067O–AVR–06/2013 Features  High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller  Nonvolatile program and data memories  64K - 128KBytes of in-system self-programmable flash  4K - 8KBytes boot section  2 KBBytes EEPROM  4 KB - 8 KBBytes internal SRAM  External bus interface for up to 16Mbytes SRAM  External bus interface for up to 128Mbit SDRAM  Peripheral features  Four-channel DMA controller  Eight-channel event system  Eight 16-bit timer/counters  Four timer/counters with 4 output compare or input capture channels  Four timer/counters with 2 output compare or input capture channels  High resolution extension on all timer/counters  Advanced waveform extension (AWeX) on two timer/counters  Eight USARTs with IrDA support for one USART  Four two-wire interfaces with dual address match (I2 C and SMBus compatible)  Four serial peripheral interfaces (SPIs)  AES and DES crypto engine  16-bit real time counter (RTC) with separate oscillator  Two sixteen channel, 12-bit, 2msps Analog to Digital Converters  Two two-channel, 12-bit, 1msps Digital to Analog Converters  Four Analog Comparators (ACs) with window compare function, and current sources  External interrupts on all general purpose I/O pins  Programmable watchdog timer with separate on-chip ultra low power oscillator  QTouch® library support  Capacitive touch buttons, sliders and wheels  Special microcontroller features  Power-on reset and programmable brown-out detection  Internal and external clock options with PLL and prescaler  Programmable multilevel interrupt controller  Five sleep modes  Programming and debug interfaces  JTAG (IEEE 1149.1 compliant) interface, including boundary scan  PDI (Program and Debug Interface)  I/O and packages  78 Programmable I/O pins  100 lead TQFP  100 ball BGA  100 ball VFBGA  Operating voltage  1.6 – 3.6V  Operating frequency  0 – 12MHz from 1.6V  0 – 32MHz from 2.7V 8/16-bit XMEGA A1 Microcontroller ATxmega128A1 / ATxmega64A1 Preliminary 8067O–AVR–06/2013 Not recommended for new designs - Use XMEGA A1U series[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 2 8067O–AVR–06/2013 ‘ 1. Ordering Information Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For packaging information, see “Packaging information” on page 70. Typical Applications Ordering Code Flash (B) E2 SRAM Speed (MHz) Power Supply Package(1)(2)(3) Temp ATxmega128A1-AU 128K + 8K 2 KB 8 KB 32 1.6 - 3.6V 100A -40C - 85C ATxmega128A1-AUR ATxmega64A1-AU 64K + 4K 2 KB 4 KB ATxmega64A1-AUR ATxmega128A1-CU 128K + 8K 2 KB 8 KB 100C1 ATxmega128A1CUR ATxmega64A1-CU 64K + 4K 2 KB 4 KB ATxmega64A1-CUR ATxmega128A1-C7U 128K + 8K 2 KB 8 KB 100C2 ATxmega128A1-C7UR ATxmega64A1-C7U 64K + 4K 2 KB 4 KB ATxmega64A1-C7UR Package Type 100A 100-lead, 14 x 14 x 1.0mm, 0.5mm lead pitch, thin profile plastic quad flat package (TQFP) 100C1 100-ball, 9 x 9 x 1.2mm body, ball pitch 0.88mm, chip ball grid array (CBGA) 100C2 100-ball, 7 x 7 x 1.0mm body, ball pitch 0.65mm, very thin fine-pitch ball grid array (VFBGA) Industrial control Climate control Low power battery applications Factory automation RF and ZigBee® Power tools Building control Sensor control HVAC Board control Optical Utility metering White goods Medical applications[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 3 8067O–AVR–06/2013 2. Pinout/Block Diagram Figure 2-1. Block diagram and pinout Notes: 1. For full details on pinout and pin functions refer to “Pinout and Pin Functions” on page 55. 2. VCC/GND on pin 83/84 are swapped compared to other VCC/GND to allow easier routing of GND to 32kHz crystal. INDEX CORNER PA6 PA7 GND AVCC PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 GND VCC PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 GND VCC PD0 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 PD1 PD2 PD3 PD4 PD5 PD6 PD7 GND VCC PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 GND VCC PF0 PF1 PF2 PF3 PF4 PF5 PK0 VCC GND PJ7 PJ6 PJ5 PJ4 PJ3 PJ2 PJ1 PJ0 VCC GND PH7 PH6 PH5 PH4 PH3 PH2 PH1 PH0 VCC GND PF7 PF6 PA5 PA4 PA3 PA2 PA1 PA0 AVCC GND PR1 PR0 RESET/PDI PDI PQ3 PQ2 PQ1 PQ0 GND VCC PK7 PK6 PK5 PK4 PK3 PK2 PK1 FLASH RAM E 2PROM DMA Interrupt Controlle r OCD External Bus Interface ADC A ADC B DAC B DAC A AC A0 AC A1 AC B0 AC B1 Port A Port B Event System ctrl Port K Port J Port H Port R Port Q Power Contro l Reset Contro l Watchdog OSC/CLK Contro l BOD POR RTC EVENT ROUTING NETWORK DATA BU S DATA BU S VREF TEMP Port C CPU T/C0:1 USART0:1 TWI SPI Port D Port E Port F T/C0:1 USART0/1 TWI SPI T/C0:1 USART0:1 TWI SPI T/C0:1 USART0:1 TWI SPI[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 4 8067O–AVR–06/2013 Figure 2-2. CBGA-pinout Table 2-1. CBGA-pinout. 1 2 3 4 5 6 7 8 9 10 A PK0 VCC GND PJ3 VCC GND PH1 GND VCC PF7 B PK3 PK2 PK1 PJ4 PH7 PH4 PH2 PH0 PF6 PF5 C VCC PK5 PK4 PJ5 PJ0 PH5 PH3 PF2 PF3 VCC D GND PK6 PK7 PJ6 PJ1 PH6 PF0 PF1 PF4 GND E PQ0 PQ1 PQ2 PJ7 PJ2 PE7 PE6 PE5 PE4 PE3 F PR1 PR0 RESET/ PDI PDI PQ3 PC2 PE2 PE1 PE0 VCC G GND PA1 PA4 PB3 PB4 PC1 PC6 PD7 PD6 GND H AVCC PA2 PA5 PB2 PB5 PC0 PC5 PD5 PD4 PD3 J PA0 PA3 PB0 PB1 PB6 PC3 PC4 PC7 PD2 PD1 K PA6 PA7 GND AVCC PB7 VCC GND VCC GND PD0 A B C D E F G H J K 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K 10 9 8 7 6 5 4 3 2 1 Top view Bottom view[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 5 8067O–AVR–06/2013 3. Overview The Atmel AVR XMEGA is a family of low power, high performance, and peripheral rich 8/16-bit microcontrollers based on the AVR enhanced RISC architecture. By executing instructions in a single clock cycle, the AVR XMEGA devices achieve CPU throughput approaching one million instructions per second (MIPS) per megahertz, allowing the system designer to optimize power consumption versus processing speed. The Atmel AVR CPU combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the arithmetic logic unit (ALU), allowing two independent registers to be accessed in a single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times faster than conventional single-accumulator or CISC based microcontrollers. The AVR XMEGA A1 devices provide the following features: in-system programmable flash with read-while-write capabilities; internal EEPROM and SRAM; four-channel DMA controller, eight-channel event system and programmable multilevel interrupt controller, 78 general purpose I/O lines, 16-bit real-time counter (RTC); eight flexible, 16-bit timer/counters with compare and PWM channels, eight USARTs; four two-wire serial interfaces (TWIs); four serial peripheral interfaces (SPIs); AES and DES cryptographic engine; two 16-channel, 12-bit ADCs with programmable gain; two 2-channel, 12-bit DACs; four Analog Comparators (ACs) with window mode; programmable watchdog timer with separate internal oscillator; accurate internal oscillators with PLL and prescaler; and programmable brown-out detection. The program and debug interface (PDI), a fast, two-pin interface for programming and debugging, is available. The devices also have an IEEE std. 1149.1 compliant JTAG interface, and this can also be used for boundary scan, on-chip debug and programming. The XMEGA A1 devices have five software selectable power saving modes. The idle mode stops the CPU while allowing the SRAM, DMA controller, event system, interrupt controller, and all peripherals to continue functioning. The powerdown mode saves the SRAM and register contents, but stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or reset. In power-save mode, the asynchronous real-time counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In standby mode, the external crystal oscillator keeps running while the rest of the device is sleeping. This allows very fast startup from the external crystal, combined with low power consumption. In extended standby mode, both the main oscillator and the asynchronous timer continue to run. To further reduce power consumption, the peripheral clock to each individual peripheral can optionally be stopped in active mode and idle sleep mode. Atmel offers a free QTouch library for embedding capacitive touch buttons, sliders and wheels functionality into AVR microcontrollers. The device are manufactured using Atmel high-density, nonvolatile memory technology. The program flash memory can be reprogrammed in-system through the PDI or JTAG interfaces. A boot loader running in the device can use any interface to download the application program to the flash memory. The boot loader software in the boot flash section will continue to run while the application flash section is updated, providing true read-while-write operation. By combining an 8/16-bit RISC CPU with in-system, self-programmable flash, the AVR XMEGA is a powerful microcontroller family that provides a highly flexible and cost effective solution for many embedded applications. All Atmel AVR XMEGA devices are supported with a full suite of program and system development tools, including C compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 6 8067O–AVR–06/2013 3.1 Block Diagram Figure 3-1. XMEGA A1 Block Diagram VBAT Power Supervision Battery Backup Controller Real Time Counter 32.768 kHz XOSC Power Supervision POR/BOD & RESET PORT A (8) PORT B (8) EVENT ROUTING NETWORK DMA Controller BUS Matrix SRAM EBI ADCA DACA ACA DACB ADCB ACB OCD PORT K (8) PORT J (8) PORT H (8) PDI Watchdog Timer Watchdog Oscillator Interrupt Controller DATA BUS Prog/Debug Controller PORT R (2) Oscillator Circuits/ Clock Generation Oscillator Control Real Time Counter Event System Controller JTAG Sleep Controller DES IRCOM PORT G (8) PORT L (8) PORT Q (8) PORT M (8) PORT C (8) TCC0:1 USARTC0:1 SPIC TWIC PORT D (8) TCD0:1 USARTD0:1 SPID TWID TCF0:1 USARTF0:1 SPIF TWIF TCE0:1 USARTE0:1 SPIE TWIE PORT E (8) PORT F (8) EVENT ROUTING NETWORK AES AREFA AREFB PORT N (8) PORT P (8) CPU NVM Controller Flash EEPROM DATA BUS Int. Refs. Tempref Digital function Analog function Bus masters / Programming / Debug Oscillator / Crystal / Clock General Purpose I/O EBI[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 7 8067O–AVR–06/2013 4. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 4.1 Recommended reading  XMEGA A Manual  XMEGA A Application Notes This device data sheet only contains part specific information and a short description of each peripheral and module. The XMEGA A Manual describes the modules and peripherals in depth. The XMEGA A application notes contain example code and show applied use of the modules and peripherals. The XMEGA A Manual and Application Notes are available from http://www.atmel.com/avr. 5. Capacitive touch sensing The Atmel QTouch library provides a simple to use solution to realize touch sensitive interfaces on most Atmel AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key events. The QTouch library includes support for the QTouch and QMatrix acquisition methods. Touch sensing can be added to any application by linking the appropriate Atmel QTouch library for the AVR microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the touch sensing API’s to retrieve the channel information and determine the touch sensor states. The QTouch library is FREE and downloadable from the Atmel website at the following location: www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the QTouch library user guide - also available for download from the Atmel website. 6. Disclaimer For devices that are not available yet, typical values contained in this datasheet are based on simulations and characterization of other AVR XMEGA microcontrollers manufactured on the same process technology. Min. and Max values will be available after the device is characterized.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 8 8067O–AVR–06/2013 7. AVR CPU 7.1 Features  8/16-bit high performance AVR RISC Architecture  138 instructions  Hardware multiplier  32x8-bit registers directly connected to the ALU  Stack in SRAM  Stack Pointer accessible in I/O memory space  Direct addressing of up to 16M Bytes of program and data memory  True 16/24-bit access to 16/24-bit I/O registers  Support for 8-, 16- and 32-bit Arithmetic  Configuration Change Protection of system critical features 7.2 Overview All Atmel AVR XMEGA devices use the 8/16-bit AVR CPU. The main function of the CPU is to execute the code and perform all calculations. The CPU is able to access memories, perform calculations, control peripherals, and execute the program in the flash memory. Interrupt handling is described in a separate section, refer to “Interrupts and Programmable Multilevel Interrupt Controller” on page 29. 7.3 Architectural Overview In order to maximize performance and parallelism, the AVR CPU uses a Harvard architecture with separate memories and buses for program and data. Instructions in the program memory are executed with single-level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This enables instructions to be executed on every clock cycle. For details of all AVR instructions, refer to http://www.atmel.com/avr.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 9 8067O–AVR–06/2013 Figure 7-1. Block diagram of the AVR CPU architecture. The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single-register operations can also be executed in the ALU. After an arithmetic operation, the status register is updated to reflect information about the result of the operation. The ALU is directly connected to the fast-access register file. The 32 x 8-bit general purpose working registers all have single clock cycle access time allowing single-cycle arithmetic logic unit (ALU) operation between registers or between a register and an immediate. Six of the 32 registers can be used as three 16-bit address pointers for program and data space addressing, enabling efficient address calculations. The memory spaces are linear. The data memory space and the program memory space are two different memory spaces. The data memory space is divided into I/O registers, SRAM, and external RAM. In addition, the EEPROM can be memory mapped in the data memory. All I/O status and control registers reside in the lowest 4KB addresses of the data memory. This is referred to as the I/O memory space. The lowest 64 addresses can be accessed directly, or as the data space locations from 0x00 to 0x3F. The rest is the extended I/O memory space, ranging from 0x0040 to 0x0FFF. I/O registers here must be accessed as data space locations using load (LD/LDS/LDD) and store (ST/STS/STD) instructions. The SRAM holds data. Code execution from SRAM is not supported. It can easily be accessed through the five different addressing modes supported in the AVR architecture. The first SRAM address is 0x2000. Data addresses 0x1000 to 0x1FFF are reserved for memory mapping of EEPROM. The program memory is divided in two sections, the application program section and the boot program section. Both sections have dedicated lock bits for write and read/write protection. The SPM instruction that is used for selfprogramming of the application flash memory must reside in the boot program section. The application section contains an application table section with separate lock bits for write and read/write protection. The application table section can be used for safe storing of nonvolatile data in the program memory.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 10 8067O–AVR–06/2013 7.4 ALU - Arithmetic Logic Unit The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single-register operations can also be executed. The ALU operates in direct connection with all 32 general purpose registers. In a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed and the result is stored in the register file. After an arithmetic or logic operation, the status register is updated to reflect information about the result of the operation. ALU operations are divided into three main categories – arithmetic, logical, and bit functions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for efficient implementation of 32-bit aritmetic. The hardware multiplier supports signed and unsigned multiplication and fractional format. 7.4.1 Hardware Multiplier The multiplier is capable of multiplying two 8-bit numbers into a 16-bit result. The hardware multiplier supports different variations of signed and unsigned integer and fractional numbers:  Multiplication of unsigned integers  Multiplication of signed integers  Multiplication of a signed integer with an unsigned integer  Multiplication of unsigned fractional numbers  Multiplication of signed fractional numbers  Multiplication of a signed fractional number with an unsigned one A multiplication takes two CPU clock cycles. 7.5 Program Flow After reset, the CPU starts to execute instructions from the lowest address in the flash program memory ‘0.’ The program counter (PC) addresses the next instruction to be fetched. Program flow is provided by conditional and unconditional jump and call instructions capable of addressing the whole address space directly. Most AVR instructions use a 16-bit word format, while a limited number use a 32-bit format. During interrupts and subroutine calls, the return address PC is stored on the stack. The stack is allocated in the general data SRAM, and consequently the stack size is only limited by the total SRAM size and the usage of the SRAM. After reset, the stack pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR CPU. 7.6 Status Register The status register (SREG) contains information about the result of the most recently executed arithmetic or logic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the status register is updated after all ALU operations, as specified in the instruction set reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The status register is not automatically stored when entering an interrupt routine nor restored when returning from an interrupt. This must be handled by software. The status register is accessible in the I/O memory space. 7.6.1 Stack and Stack Pointer The stack is used for storing return addresses after interrupts and subroutine calls. It can also be used for storing temporary data. The stack pointer (SP) register always points to the top of the stack. It is implemented as two 8-bit registers that are accessible in the I/O memory space. Data are pushed and popped from the stack using the PUSH and POP instructions. The stack grows from a higher memory location to a lower memory location. This implies that pushing data onto the stack decreases the SP, and popping data off the stack increases the SP. The SP is automatically loaded [Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 11 8067O–AVR–06/2013 after reset, and the initial value is the highest address of the internal SRAM. If the SP is changed, it must be set to point above address 0x2000, and it must be defined before any subroutine calls are executed or before interrupts are enabled. During interrupts or subroutine calls, the return address is automatically pushed on the stack. The return address can be two or three bytes, depending on program memory size of the device. For devices with 128KB or less of program memory, the return address is two bytes, and hence the stack pointer is decremented/incremented by two. For devices with more than 128KB of program memory, the return address is three bytes, and hence the SP is decremented/incremented by three. The return address is popped off the stack when returning from interrupts using the RETI instruction, and from subroutine calls using the RET instruction. The SP is decremented by one when data are pushed on the stack with the PUSH instruction, and incremented by one when data is popped off the stack using the POP instruction. To prevent corruption when updating the stack pointer from software, a write to SPL will automatically disable interrupts for up to four instructions or until the next I/O memory write. After reset the stack pointer is initialized to the highest address of the SRAM. See Table 8-2 on page 15. 7.7 Register File The register file consists of 32 x 8-bit general purpose working registers with single clock cycle access time. The register file supports the following input/output schemes:  One 8-bit output operand and one 8-bit result input  Two 8-bit output operands and one 8-bit result input  Two 8-bit output operands and one 16-bit result input  One 16-bit output operand and one 16-bit result input Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing, enabling efficient address calculations. One of these address pointers can also be used as an address pointer for lookup tables in flash program memory.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 12 8067O–AVR–06/2013 8. Memories 8.1 Features  Flash Program Memory  One linear address space  In-System Programmable  Self-Programming and Bootloader support  Application Section for application code  Application Table Section for application code or data storage  Boot Section for application code or bootloader code  Separate lock bits and protection for all sections  Built in fast CRC check of a selectable flash program memory section  Data Memory  One linear address space  Single cycle access from CPU  SRAM  EEPROM  Byte and page accessible  Optional memory mapping for direct load and store  I/O Memory  Configuration and Status registers for all peripherals and modules  16 bit-accessible General Purpose Register for global variables or flags  External Memory support  SRAM  SDRAM  Memory mapped external hardware  Bus arbitration  Safe and deterministic handling of CPU and DMA Controller priority  Separate buses for SRAM, EEPROM, I/O Memory and External Memory access  Simultaneous bus access for CPU and DMA Controller  Production Signature Row Memory for factory programmed data  Device ID for each microcontroller device type  Serial number for each device  Oscillator calibration bytes  ADC, DAC and temperature sensor calibration data  User Signature Row  One flash page in size  Can be read and written from software  Content is kept after chip erase 8.2 Overview The Atmel AVR architecture has two main memory spaces, the program memory and the data memory. Executable code can reside only in the program memory, while data can be stored in the program memory and the data memory. The data memory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are linear and require no memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write operations. This prevents unrestricted access to the application software. A separate memory section contains the fuse bytes. These are used for configuring important system functions, and can only be written by an external programmer.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 13 8067O–AVR–06/2013 The available memory size configurations are shown in “Ordering Information” on page 2. In addition each device has a flash memory signature rows for calibration data, device identification, serial number etc. 8.3 In-System Programmable Flash Program Memory he Atmel AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for program storage. The flash memory can be accessed for read and write from an external programmer through the PDI or from application software running in the device. All AVR CPU instructions are 16 or 32 bits wide, and each flash location is 16 bits wide. The flash memory is organized in two main sections, the application section and the boot loader section. The sizes of the different sections are fixed, but device-dependent. These two sections have separate lock bits, and can have different levels of protection. The store program memory (SPM) instruction, which is used to write to the flash from the application software, will only operate when executed from the boot loader section. The application section contains an application table section with separate lock settings. This enables safe storage of nonvolatile data in the program memory. Figure 8-1. Flash Program Memory (Hexadecimal address) 8.3.1 Application Section The Application section is the section of the flash that is used for storing the executable application code. The protection level for the application section can be selected by the boot lock bits for this section. The application section can not store any boot loader code since the SPM instruction cannot be executed from the application section. 8.3.2 Application Table Section The application table section is a part of the application section of the flash memory that can be used for storing data. The size is identical to the boot loader section. The protection level for the application table section can be selected by the boot lock bits for this section. The possibilities for different protection levels on the application section and the application table section enable safe parameter storage in the program memory. If this section is not used for data, application code can reside here. 8.3.3 Boot Loader Section While the application section is used for storing the application code, the boot loader software must be located in the boot loader section because the SPM instruction can only initiate programming when executing from this section. The SPM instruction can access the entire flash, including the boot loader section itself. The protection level for the boot loader section can be selected by the boot loader lock bits. If this section is not used for boot loader software, application code can be stored here. Word Address ATxega128A1 ATxmega64A1 0 0 Application Section (Bytes) (128K/64K) ... EFFF / 77FF F000 / 7800 Application Table Section (Bytes) FFFF / 7FFF (8K/4K) 10000 / 8000 Boot Section (Bytes) 10FFF / 87FF (8K/4K)[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 14 8067O–AVR–06/2013 8.3.4 Production Signature Row The production signature row is a separate memory section for factory programmed data. It contains calibration data for functions such as oscillators and analog modules. Some of the calibration values will be automatically loaded to the corresponding module or peripheral unit during reset. Other values must be loaded from the signature row and written to the corresponding peripheral registers from software. For details on calibration conditions, refer to “Electrical Characteristics” on page 76. The production signature row also contains an ID that identifies each microcontroller device type and a serial number for each manufactured device. The serial number consists of the production lot number, wafer number, and wafer coordinates for the device. The device ID for the available devices is shown in Table 8-1. The production signature row cannot be written or erased, but it can be read from application software and external programmers. Table 8-1. Device ID bytes. 8.3.5 User Signature Row The user signature row is a separate memory section that is fully accessible (read and write) from application software and external programmers. It is one flash page in size, and is meant for static user parameter storage, such as calibration data, custom serial number, identification numbers, random number seeds, etc. This section is not erased by chip erase commands that erase the flash, and requires a dedicated erase command. This ensures parameter storage during multiple program/erase operations and on-chip debug sessions. 8.4 Fuses and Lock bits The fuses are used to configure important system functions, and can only be written from an external programmer. The application software can read the fuses. The fuses are used to configure reset sources such as brownout detector and watchdog, startup configuration, JTAG enable, and JTAG user ID. The lock bits are used to set protection levels for the different flash sections (that is, if read and/or write access should be blocked). Lock bits can be written by external programmers and application software, but only to stricter protection levels. Chip erase is the only way to erase the lock bits. To ensure that flash contents are protected even during chip erase, the lock bits are erased after the rest of the flash memory has been erased. An unprogrammed fuse or lock bit will have the value one, while a programmed fuse or lock bit will have the value zero. Both fuses and lock bits are reprogrammable like the flash program memory. 8.5 Data Memory The data memory contains the I/O memory, internal SRAM, optionally memory mapped EEPROM, and external memory if available. The data memory is organized as one continuous memory section, see Figure 8-2 on page 15. To simplify development, I/O Memory, EEPROM and SRAM will always have the same start addresses for all Atmel AVR XMEGA devices. The address space for External Memory will always start at the end of Internal SRAM and end at address 0xFFFFFF. Device Device ID bytes Byte 2 Byte 1 Byte 0 ATxmega64A1 4E 96 1E ATxmega128A1 4C 97 1E[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 15 8067O–AVR–06/2013 Figure 8-2. Data Memory Map (Hexadecimal address) 8.6 EEPROM XMEGA AU devices have EEPROM for nonvolatile data storage. It is either addressable in a separate data space (default) or memory mapped and accessed in normal data space. The EEPROM supports both byte and page access. Memory mapped EEPROM allows highly efficient EEPROM reading and EEPROM buffer loading. When doing this, EEPROM is accessible using load and store instructions. Memory mapped EEPROM will always start at hexadecimal address 0x1000. 8.7 I/O Memory The status and configuration registers for peripherals and modules, including the CPU, are addressable through I/O memory locations. All I/O locations can be accessed by the load (LD/LDS/LDD) and store (ST/STS/STD) instructions, which is used to transfer data between the 32 registers in the register file and the I/O memory. The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly. In the address range 0x00 - 0x1F, single- cycle instructions for manipulation and checking of individual bits are available. The I/O memory address for all peripherals and modules in XMEGA A1U is shown in the “Peripheral Module Address Map” on page 62. 8.7.1 General Purpose I/O Registers The lowest 16 I/O memory addresses are reserved as general purpose I/O registers. These registers can be used for storing global variables and flags, as they are directly bit-accessible using the SBI, CBI, SBIS, and SBIC instructions. 8.8 External Memory Four ports can be used for external memory, supporting external SRAM, SDRAM, and memory mapped peripherals such as LCD displays. Refer to “EBI – External Bus Interface” on page 47. The external memory address space will always start at the end of internal SRAM. 8.9 Data Memory and Bus Arbitration Since the data memory is organized as four separate sets of memories, the different bus masters (CPU, DMA controller read and DMA controller write, etc.) can access different memory sections at the same time. Byte Address ATxmega128A1 Byte Address ATxmega64A1 0 I/O Registers (4 KB) 0 I/O Registers FFF FFF (4 KB) 1000 EEPROM (2 KB) 1000 EEPROM 17FF 17FF (2 KB) RESERVED RESERVED 2000 Internal SRAM (8 KB) 2000 Internal SRAM 3FFF 2FFF (4 KB) 4000 External Memory (0 to 16 MB) 3000 External Memory FFFFFF FFFFFF (0 to 16 MB)[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 16 8067O–AVR–06/2013 8.10 Memory Timing Read and write access to the I/O memory takes one CPU clock cycle. A write to SRAM takes one cycle, and a read from SRAM takes two cycles. For burst read (DMA), new data are available every cycle. EEPROM page load (write) takes one cycle, and three cycles are required for read. For burst read, new data are available every second cycle. External memory has multi-cycle read and write. The number of cycles depends on the type of memory and configuration of the external bus interface. Refer to the instruction summary for more details on instructions and instruction timing. 8.11 Device ID and Revision Each device has a three-byte device ID. This ID identifies Atmel as the manufacturer of the device and the device type. A separate register contains the revision number of the device. 8.12 I/O Memory Protection Some features in the device are regarded as critical for safety in some applications. Due to this, it is possible to lock the I/O register related to the clock system, the event system, and the advanced waveform extensions. As long as the lock is enabled, all related I/O registers are locked and they can not be written from the application software. The lock registers themselves are protected by the configuration change protection mechanism. 8.13 JTAG Disable It is possible to disable the JTAG interface from the application software. This will prevent all external JTAG access to the device until the next device reset or until JTAG is enabled again from the application software. As long as JTAG is disabled, the I/O pins required for JTAG can be used as normal I/O pins. 8.14 Flash and EEPROM Page Size The flash program memory and EEPROM data memory are organized in pages. The pages are word accessible for the flash and byte accessible for the EEPROM. Table 8-2 shows the Flash Program Memory organization. Flash write and erase operations are performed on one page at a time, while reading the Flash is done one byte at a time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) gives the page number and the least significant address bits (FWORD) gives the word in the page. Table 8-2. Number of words and Pages in the Flash. Table 8-3 shows EEPROM memory organization for the Atmel AVR XMEGA A1U devices. EEPROM write and erase operations can be performed one page or one byte at a time, while reading the EEPROM is done one byte at a time. For EEPROM access the NVM Address Register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE) give the page number and the least significant address bits (E2BYTE) give the byte in the page. Device PC size Flash Page Size FWORD FPAGE Application Boot bits bytes words Size No of pages Size No of pages ATxmega64A1 16 64K + 4K 128 Z[7:1] Z[16:8] 64K 256 4K 16 ATxmega128A1 17 128K+ 8K 256 Z[8:1] Z[17:9] 128K 256 8K 16[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 17 8067O–AVR–06/2013 Table 8-3. Number of Bytes and Pages in the EEPROM. 8.14.1 I/O Memory All peripherals and modules are addressable through I/O memory locations in the data memory space. All I/O memory locations can be accessed by the Load (LD/LDS/LDD) and Store (ST/STS/STD) instructions, transferring data between the 32 general purpose registers in the CPU and the I/O Memory. The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly. I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. The value of single bits can be checked by using the SBIS and SBIC instructions on these registers. The I/O memory address for all peripherals and modules in XMEGA A1 is shown in the “Peripheral Module Address Map” on page 62. Device EEPROM Page Size E2BYTE E2PAGE No of pages Size bytes ATxmega64A1 2 KB 32 ADDR[4:0] ADDR[10:5] 64 ATxmega128A1 2 KB 32 ADDR[4:0 ADDR[10:5] 64[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 18 8067O–AVR–06/2013 9. DMAC - Direct Memory Access Controller 9.1 Features  Allows High-speed data transfer  From memory to peripheral  From memory to memory  From peripheral to memory  From peripheral to peripheral  4 Channels  From 1 byte and up to 16M bytes transfers in a single transaction  Multiple addressing modes for source and destination address  Increment  Decrement  Static  1, 2, 4, or 8 byte Burst Transfers  Programmable priority between channels 9.2 Overview The four-channel direct memory access (DMA) controller can transfer data between memories and peripherals, and thus offload these tasks from the CPU. It enables high data transfer rates with minimum CPU intervention, and frees up CPU time. The four DMA channels enable up to four independent and parallel transfers. The DMA controller can move data between SRAM and peripherals, between SRAM locations and directly between peripheral registers. With access to all peripherals, the DMA controller can handle automatic transfer of data to/from communication modules. The DMA controller can also read from memory mapped EEPROM. Data transfers are done in continuous bursts of 1, 2, 4, or 8 bytes. They build block transfers of configurable size from 1 byte to 64KB. A repeat counter can be used to repeat each block transfer for single transactions up to 16MB. Source and destination addressing can be static, incremental or decremental. Automatic reload of source and/or destination addresses can be done after each burst or block transfer, or when a transaction is complete. Application software, peripherals, and events can trigger DMA transfers. The four DMA channels have individual configuration and control settings. This include source, destination, transfer triggers, and transaction sizes. They have individual interrupt settings. Interrupt requests can be generated when a transaction is complete or when the DMA controller detects an error on a DMA channel. To allow for continuous transfers, two channels can be interlinked so that the second takes over the transfer when the first is finished, and vice versa.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 19 8067O–AVR–06/2013 10. Event System 10.1 Features  Inter-peripheral communication and signalling with minimum latency  CPU and DMA independent operation  8 Event Channels allows for up to 8 signals to be routed at the same time  Events can be generated by  Timer/Counters (TCxn)  Real Time Counter (RTC)  Analog to Digital Converters (ADCx)  Analog Comparators (ACx)  Ports (PORTx)  System Clock (ClkSYS)  Software (CPU)  Events can be used by  Timer/Counters (TCxn)  Analog to Digital Converters (ADCx)  Digital to Analog Converters (DACx)  Ports (PORTx)  DMA Controller (DMAC)  IR Communication Module (IRCOM)  The same event can be used by multiple peripherals for synchronized timing  Advanced Features  Manual Event Generation from software (CPU)  Quadrature Decoding  Digital Filtering  Functions in Active and Idle mode 10.2 Overview The Event System is a set of features for inter-peripheral communication. It enables the possibility for a change of state in one peripheral to automatically trigger actions in one or more peripherals. These changes in a peripheral that will trigger actions in other peripherals are configurable by software. It is a simple, but powerful system as it allows for autonomous control of peripherals without any use of interrupts, CPU or DMA resources. The indication of a change in a peripheral is referred to as an event, and is usually the same as the interrupt conditions for that peripheral. Events are passed between peripherals using a dedicated routing network called the Event Routing Network. Figure 10-1 on page 20 shows a basic block diagram of the Event System with the Event Routing Network and the peripherals to which it is connected. This highly flexible system can be used for simple routing of signals, pin functions or for sequencing of events. The maximum latency is two CPU clock cycles from when an event is generated in one peripheral, until the actions are triggered in one or more other peripherals. The Event System is functional in both Active and Idle modes.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 20 8067O–AVR–06/2013 Figure 10-1. Event system block diagram. he event routing network consists of eight software-configurable multiplexers that control how events are routed and used. These are called event channels, and allow for up to eight parallel event routing configurations. The maximum routing latency is two peripheral clock cycles. The event system works in both active mode and idle sleep mode. DAC Timer / Counters ADC Real Time Counter Port pins CPU / Software DMA Controller IRCOM Event Routing Network Event System Controller clkPER Prescaler AC[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 21 8067O–AVR–06/2013 11. System Clock and Clock options 11.1 Features  Fast start-up time  Safe run-time clock switching  Internal Oscillators:  32 MHz run-time calibrated RC oscillator  2 MHz run-time calibrated RC oscillator  32.768 kHz calibrated RC oscillator  32 kHz Ultra Low Power (ULP) oscillator with 1 kHz ouput  External clock options  0.4 - 16 MHz Crystal Oscillator  32 kHz Crystal Oscillator  External clock  PLL with internal and external clock options with 1 to 31x multiplication  Clock Prescalers with 1x to 2048x division  Fast peripheral clock running at two and four times the CPU clock speed  Automatic Run-Time Calibration of internal oscillators  Crystal Oscillator failure detection 11.2 Overview Atmel AVR XMEGA devices have a flexible clock system supporting a large number of clock sources. It incorporates both accurate internal oscillators and external crystal oscillator and resonator support. A high-frequency phase locked loop (PLL) and clock prescalers can be used to generate a wide range of clock frequencies. An oscillator failure monitor can be enabled to issue a non-maskable interrupt and switch to the internal oscillator if the external oscillator or PLL fails. When a reset occurs, all clock sources except the 32kHz ultra low power oscillator are disabled. After reset, the device will always start up running from the 2MHz internal oscillator. During normal operation, the system clock source and prescalers can be changed from software at any time. Figure 11-1 on page 22 presents the principal clock system in the XMEGA A1U family devices. Not all of the clocks need to be active at a given time. The clocks for the CPU and peripherals can be stopped using sleep modes and power reduction registers as described in “Power Management and Sleep Modes” on page 24.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 22 8067O–AVR–06/2013 Figure 11-1. The clock system, clock sources and clock distribution 11.3 Clock Options The clock sources are divided in two main groups: internal oscillators and external clock sources. Most of the clock sources can be directly enabled and disabled from software, while others are automatically enabled or disabled, depending on peripheral settings. After reset, the device starts up running from the 2MHz internal oscillator. The other clock sources and PLL are turned off by default. The internal oscillators do not require any external components to run. For details on characteristics and accuracy of the internal oscillators, refer to the device datasheet. 11.3.1 32 kHz Ultra Low Power Internal Oscillator This oscillator provides an approximate 32kHz clock. The 32kHz ultra low power (ULP) internal oscillator is a very low power clock source, and it is not designed for high accuracy. The oscillator employs a built-in prescaler that provides a 1kHz output. The oscillator is automatically enabled/disabled when it is used as clock source for any part of the device. This oscillator can be selected as the clock source for the RTC. Real Time Counter Peripherals RAM AVR CPU Non-Volatile Memory Watchdog Timer Brown-out Detector System Clock Prescalers System Clock Multiplexer (SCLKSEL) PLLSRC RTCSRC DIV32 32 kHz Int. ULP 32.768 kHz Int. OSC 32.768 kHz TOSC 2 MHz Int. Osc 32 MHz Int. Osc 0.4 – 16 MHz XTAL DIV32 DIV32 DIV4 XOSCSEL PLL TOSC1 TOSC2 XTAL1 XTAL2 clkSYS clkRTC clkPER2 clkPER clkCPU clkPER4[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 23 8067O–AVR–06/2013 11.3.2 32.768 kHz Calibrated Internal Oscillator This oscillator provides an approximate 32.768kHz clock. It is calibrated during production to provide a default frequency close to its nominal frequency. The calibration register can also be written from software for run-time calibration of the oscillator frequency. The oscillator employs a built-in prescaler, which provides both a 32.768kHz output and a 1.024kHz output. 11.3.3 32.768 kHz Crystal Oscillator A 32.768kHz crystal oscillator can be connected between the 1 and 2 pins and enables a dedicated low frequency oscillator input circuit. A low power mode with reduced voltage swing on 2 is available. This oscillator can be used as a clock source for the system clock and RTC. 11.3.4 0.4 - 16 MHz Crystal Oscillator This oscillator can operate in four different modes optimized for different frequency ranges, all within 0.4 - 16MHz. 11.3.5 2 MHz Run-time Calibrated Internal Oscillator The 2MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32kHz Calibrated Internal Oscillator or the 32kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 11.3.6 32 MHz Run-time Calibrated Internal Oscillator The 32MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32kHz Calibrated Internal Oscillator or the 32kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 11.3.7 External Clock input The XTAL1 and XTAL2 pins can be used to drive an external oscillator, either a quartz crystal or a ceramic resonator. XTAL1 can be used as input for an external clock signal. The 1 and 2 pins is dedicated to driving a 32.768kHz crystal oscillator. 11.3.8 PLL with Multiplication factor 1 - 31x The built-in phase locked loop (PLL) can be used to generate a high-frequency system clock. The PLL has a userselectable multiplication factor of from 1 to 31. In combination with the prescalers, this gives a wide range of output frequencies from all clock sources.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 24 8067O–AVR–06/2013 12. Power Management and Sleep Modes 12.1 Features  Power management for adjusting power consumption and functions  5 sleep modes  Idle  Power-down  Power-save  Standby  Extended standby  Power reduction register to disable clock and turn off unused peripherals in active and idle modes 12.2 Overview Various sleep modes and clock gating are provided in order to tailor power consumption to application requirements. This enables the Atmel AVR XMEGA microcontroller to stop unused modules to save power. All sleep modes are available and can be entered from active mode. In active mode, the CPU is executing application code. When the device enters sleep mode, program execution is stopped and interrupts or a reset is used to wake the device again. The application code decides which sleep mode to enter and when. Interrupts from enabled peripherals and all enabled reset sources can restore the microcontroller from sleep to active mode. In addition, power reduction registers provide a method to stop the clock to individual peripherals from software. When this is done, the current state of the peripheral is frozen, and there is no power consumption from that peripheral. This reduces the power consumption in active mode and idle sleep modes and enables much more fine-tuned power management than sleep modes alone. 12.3 Sleep Modes Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power. XMEGA microcontrollers have five different sleep modes tuned to match the typical functional stages during application execution. A dedicated sleep instruction (SLEEP) is available to enter sleep mode. Interrupts are used to wake the device from sleep, and the available interrupt wake-up sources are dependent on the configured sleep mode. When an enabled interrupt occurs, the device will wake up and execute the interrupt service routine before continuing normal program execution from the first instruction after the SLEEP instruction. If other, higher priority interrupts are pending when the wake-up occurs, their interrupt service routines will be executed according to their priority before the interrupt service routine for the wake-up interrupt is executed. After wake-up, the CPU is halted for four cycles before execution starts. The content of the register file, SRAM and registers are kept during sleep. If a reset occurs during sleep, the device will reset, start up, and execute from the reset vector. 12.3.1 Idle Mode In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming will be completed), but all peripherals, including the interrupt controller, event system and DMA controller are kept running. Any enabled interrupt will wake the device. 12.3.2 Power-down Mode In power-down mode, all clocks, including the real-time counter clock source, are stopped. This allows operation only of asynchronous modules that do not require a running clock. The only interrupts that can wake up the MCU are the twowire interface address match interrupt and asynchronous port interrupts, e.g pin change.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 25 8067O–AVR–06/2013 12.3.3 Power-save Mode Power-save mode is identical to power down, with one exception. If the real-time counter (RTC) is enabled, it will keep running during sleep, and the device can also wake up from either an RTC overflow or compare match interrupt. 12.3.4 Standby Mode Standby mode is identical to power down, with the exception that the enabled system clock sources are kept running while the CPU, peripheral, and RTC clocks are stopped. This reduces the wake-up time. 12.3.5 Extended Standby Mode Extended standby mode is identical to power-save mode, with the exception that the enabled system clock sources are kept running while the CPU and peripheral clocks are stopped. This reduces the wake-up time.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 26 8067O–AVR–06/2013 13. System Control and Reset 13.1 Features  Multiple reset sources for safe operation and device reset  Power-On Reset  External Reset  Watchdog Reset  Brown-Out Reset  PDI reset  Software reset  Asynchronous reset  No running clock in the device is required for reset  Reset status register 13.2 Overview The reset system issues a microcontroller reset and sets the device to its initial state. This is for situations where operation should not start or continue, such as when the microcontroller operates below its power supply rating. If a reset source goes active, the device enters and is kept in reset until all reset sources have released their reset. The I/O pins are immediately tri-stated. The program counter is set to the reset vector location, and all I/O registers are set to their initial values. The SRAM content is kept. However, if the device accesses the SRAM when a reset occurs, the content of the accessed location can not be guaranteed. After reset is released from all reset sources, the default oscillator is started and calibrated before the device starts running from the reset vector address. By default, this is the lowest program memory address, 0, but it is possible to move the reset vector to the lowest address in the boot section. The reset functionality is asynchronous, and so no running system clock is required to reset the device. The software reset feature makes it possible to issue a controlled system reset from the user software. The reset status register has individual status flags for each reset source. It is cleared at power-on reset, and shows which sources have issued a reset since the last power-on. 13.3 Reset Sequence A reset request from any reset source will immediately reset the device and keep it in reset as long as the request is active. When all reset requests are released, the device will go through three stages before the device starts running again:  Reset counter delay  Oscillator startup  Oscillator calibration If another reset requests occurs during this process, the reset sequence will start over again. 13.4 Reset Sources 13.4.1 Power-On Reset TA power-on reset (POR) is generated by an on-chip detection circuit. The POR is activated when the VCC rises and reaches the POR threshold voltage (VPOT), and this will start the reset sequence. The POR is also activated to power down the device properly when the VCC falls and drops below the VPOT level. The VPOT level is higher for falling VCC than for rising VCC. Consult the datasheet for POR characteristics data.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 27 8067O–AVR–06/2013 13.4.2 Brownout Detection The on-chip brownout detection (BOD) circuit monitors the VCC level during operation by comparing it to a fixed, programmable level that is selected by the BODLEVEL fuses. If disabled, BOD is forced on at the lowest level during chip erase and when the PDI is enabled. 13.4.3 External Reset The external reset circuit is connected to the external RESET pin. The external reset will trigger when the RESET pin is driven below the RESET pin threshold voltage, VRST, for longer than the minimum pulse period, tEXT. The reset will be held as long as the pin is kept low. The RESET pin includes an internal pull-up resistor. 13.4.4 Watchdog Reset The watchdog timer (WDT) is a system function for monitoring correct program operation. If the WDT is not reset from the software within a programmable timeout period, a watchdog reset will be given. The watchdog reset is active for one to two clock cycles of the 2MHz internal oscillator. For more details see “WDT - Watchdog Timer” on page 28. 13.4.5 Software reset The software reset makes it possible to issue a system reset from software by writing to the software reset bit in the reset control register.The reset will be issued within two CPU clock cycles after writing the bit. It is not possible to execute any instruction from when a software reset is requested until it is issued. 13.4.6 Program and Debug Interface Reset The program and debug interface reset contains a separate reset source that is used to reset the device during external programming and debugging. This reset source is accessible only from external debuggers and programmers.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 28 8067O–AVR–06/2013 13.5 WDT - Watchdog Timer 13.5.1 Features  Issues a device reset if the timer is not reset before its timeout period  Asynchronous operation from dedicated oscillator  1kHz output of the 32kHz ultra low power oscillator  11 selectable timeout periods, from 8ms to 8s  Two operation modes:  Normal mode  Window mode  Configuration lock to prevent unwanted changes 13.6 Overview The watchdog timer (WDT) is a system function for monitoring correct program operation. It makes it possible to recover from error situations such as runaway or deadlocked code. The WDT is a timer, configured to a predefined timeout period, and is constantly running when enabled. If the WDT is not reset within the timeout period, it will issue a microcontroller reset. The WDT is reset by executing the WDR (watchdog timer reset) instruction from the application code. The window mode makes it possible to define a time slot or window inside the total timeout period during which WDT must be reset. If the WDT is reset outside this window, either too early or too late, a system reset will be issued. Compared to the normal mode, this can also catch situations where a code error causes constant WDR execution. The WDT will run in active mode and all sleep modes, if enabled. It is asynchronous, runs from a CPU-independent clock source, and will continue to operate to issue a system reset even if the main clocks fail. The configuration change protection mechanism ensures that the WDT settings cannot be changed by accident. For increased safety, a fuse for locking the WDT settings is also available.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 29 8067O–AVR–06/2013 14. Interrupts and Programmable Multilevel Interrupt Controller 14.1 Features  Short and predictable interrupt response time  Separate interrupt configuration and vector address for each interrupt  Programmable multilevel interrupt controller  Interrupt prioritizing according to level and vector address  Three selectable interrupt levels for all interrupts: low, medium and high  Selectable, round-robin priority scheme within low-level interrupts  Non-maskable interrupts for critical functions  Interrupt vectors optionally placed in the application section or the boot loader section 14.2 Overview Interrupts signal a change of state in peripherals, and this can be used to alter program execution. Peripherals can have one or more interrupts, and all are individually enabled and configured. When an interrupt is enabled and configured, it will generate an interrupt request when the interrupt condition is present. The programmable multilevel interrupt controller (PMIC) controls the handling and prioritizing of interrupt requests. When an interrupt request is acknowledged by the PMIC, the program counter is set to point to the interrupt vector, and the interrupt handler can be executed. All peripherals can select between three different priority levels for their interrupts: low, medium, and high. Interrupts are prioritized according to their level and their interrupt vector address. Medium-level interrupts will interrupt low-level interrupt handlers. High-level interrupts will interrupt both medium- and low-level interrupt handlers. Within each level, the interrupt priority is decided from the interrupt vector address, where the lowest interrupt vector address has the highest interrupt priority. Low-level interrupts have an optional round-robin scheduling scheme to ensure that all interrupts are serviced within a certain amount of time. Non-maskable interrupts (NMI) are also supported, and can be used for system critical functions. 14.3 Interrupt vectors The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in each peripheral. The base addresses for the Atmel AVR XMEGA A1U devices are shown in Table 14-1. Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA AU manual. For peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 14-1. The program address is the word address. Table 14-1. Reset and Interrupt vectors Program Address (Base Address) Source Interrupt Description 0x000 RESET 0x002 OSCF_INT_vect Crystal Oscillator Failure Interrupt vector (NMI) 0x004 PORTC_INT_base Port C Interrupt base 0x008 PORTR_INT_base Port R Interrupt base 0x00C DMA_INT_base DMA Controller Interrupt base 0x014 RTC_INT_base Real Time Counter Interrupt base 0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 30 8067O–AVR–06/2013 0x01C TCC0_INT_base Timer/Counter 0 on port C Interrupt base 0x028 TCC1_INT_base Timer/Counter 1 on port C Interrupt base 0x030 SPIC_INT_vect SPI on port C Interrupt vector 0x032 USARTC0_INT_base USART 0 on port C Interrupt base 0x038 USARTC1_INT_base USART 1 on port C Interrupt base 0x03E AES_INT_vect AES Interrupt vector 0x040 NVM_INT_base Non-Volatile Memory Interrupt base 0x044 PORTB_INT_base Port B Interrupt base 0x048 ACB_INT_base Analog Comparator on Port B Interrupt base 0x04E ADCB_INT_base Analog to Digital Converter on Port B Interrupt base 0x056 PORTE_INT_base Port E Interrupt base 0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base 0x05E TCE0_INT_base Timer/Counter 0 on port E Interrupt base 0x06A TCE1_INT_base Timer/Counter 1 on port E Interrupt base 0x072 SPIE_INT_vect SPI on port E Interrupt vector 0x074 USARTE0_INT_base USART 0 on port E Interrupt base 0x07A USARTE1_INT_base USART 1 on port E Interrupt base 0x080 PORTD_INT_base Port D Interrupt base 0x084 PORTA_INT_base Port A Interrupt base 0x088 ACA_INT_base Analog Comparator on Port A Interrupt base 0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base 0x096 TWID_INT_base Two-Wire Interface on Port D Interrupt base 0x09A TCD0_INT_base Timer/Counter 0 on port D Interrupt base 0x0A6 TCD1_INT_base Timer/Counter 1 on port D Interrupt base 0x0AE SPID_INT_vector SPI on port D Interrupt vector 0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base 0x0B6 USARTD1_INT_base USART 1 on port D Interrupt base 0x0BC PORTQ_INT_base Port Q INT base 0x0C0 PORTH_INT_base Port H INT base 0x0C4 PORTJ_INT_base Port J INT base 0x0C8 PORTK_INT_base Port K INT base 0x0D0 PORTF_INT_base Port F INT base 0x0D4 TWIF_INT_base Two-Wire Interface on Port F INT base Program Address (Base Address) Source Interrupt Description[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 31 8067O–AVR–06/2013 0x0D8 TCF0_INT_base Timer/Counter 0 on port F Interrupt base 0x0E4 TCF1_INT_base Timer/Counter 1 on port F Interrupt base 0x0EC SPIF_INT_vector SPI ion port F Interrupt base 0x0EE USARTF0_INT_base USART 0 on port F Interrupt base 0x0F4 USARTF1_INT_base USART 1 on port F Interrupt base Program Address (Base Address) Source Interrupt Description[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 32 8067O–AVR–06/2013 15. I/O Ports 15.1 Features  78 General purpose input and output pins with individual configuration  Output driver with configurable driver and pull settings:  Totem-pole  Wired-AND  Wired-OR  Bus-keeper  Inverted I/O  Input with synchronous and/or asynchronous sensing with interrupts and events  Sense both edges  Sense rising edges  Sense falling edges  Sense low level  Optional pull-up and pull-down resistor on input and Wired-OR/AND configurations  Optional slew rate control  Asynchronous pin change sensing that can wake the device from all sleep modes  Two port interrupts with pin masking per I/O port  Efficient and safe access to port pins  Hardware read-modify-write through dedicated toggle/clear/set registers  Configuration of multiple pins in a single operation  Mapping of port registers into bit-accessible I/O memory space  Peripheral clocks output on port pin  Real-time counter clock output to port pin  Event channels can be output on port pin  Remapping of digital peripheral pin functions  Selectable USART, SPI, and timer/counter input/output pin locations 15.2 Overview One port consists of up to eight port pins: pin 0 to 7. Each port pin can be configured as input or output with configurable driver and pull settings. They also implement synchronous and asynchronous input sensing with interrupts and events for selectable pin change conditions. Asynchronous pin-change sensing means that a pin change can wake the device from all sleep modes, included the modes where no clocks are running. All functions are individual and configurable per pin, but several pins can be configured in a single operation. The pins have hardware read-modify-write (RMW) functionality for safe and correct change of drive value and/or pull resistor configuration. The direction of one port pin can be changed without unintentionally changing the direction of any other pin. The port pin configuration also controls input and output selection of other device functions. It is possible to have both the peripheral clock and the real-time clock output to a port pin, and available for external use. The same applies to events from the event system that can be used to synchronize and control external functions. Other digital peripherals, such as USART, SPI, and timer/counters, can be remapped to selectable pin locations in order to optimize pin-out versus application needs. The notation of these ports are PORTA, PORTB, PORTC, PORTD, PORTE, PORTF, PORTH, PORTJ, PORTK, PORTQ and PORTR.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 33 8067O–AVR–06/2013 15.3 Output Driver All port pins (Pn) have programmable output configuration. The port pins also have configurable slew rate limitation to reduce electromagnetic emission. 15.3.1 Push-pull Figure 15-1. I/O configuration - Totem-pole 15.3.2 Pull-down Figure 15-2. I/O configuration - Totem-pole with pull-down (on input) 15.3.3 Pull-up Figure 15-3. I/O configuration - Totem-pole with pull-up (on input) INn OUTn DIRn Pn INn OUTn DIRn Pn INn OUTn DIRn Pn[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 34 8067O–AVR–06/2013 15.3.4 Bus-keeper The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’. Figure 15-4. I/O configuration - Totem-pole with bus-keeper 15.3.5 Others Figure 15-5. Output configuration - Wired-OR with optional pull-down Figure 15-6. I/O configuration - Wired-AND with optional pull-up INn OUTn DIRn Pn INn OUTn Pn INn OUTn Pn[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 35 8067O–AVR–06/2013 15.4 Input sensing Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is shown in Figure 15-7 on page 35. Figure 15-7. Input sensing system overview When a pin is configured with inverted I/O the pin value is inverted before the input sensing. 15.5 Port Interrupt Each ports have two interrupts with seperate priority and interrupt vector. All pins on the port can be individually selected as source for each of the interrupts. The interrupts are then triggered according to the input sense configuration for each pin configured as source for the interrupt. 15.6 Alternate Port Functions In addition to the input/output functions on all port pins, most pins have alternate functions. This means that other modules or peripherals connected to the port can use the port pins for their functions, such as communication or pulsewidth modulation. “Pinout and Pin Functions” on page 55 shows which modules on peripherals that enables alternate functions on a pin, and what alternate functions that is available on a pin. INVERTED I/O Interrupt Control IREQ Event Pn D Q R D Q R Synchronizer INn EDGE DETECT Asynchronous sensing Synchronous sensing EDGE DETECT[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 36 8067O–AVR–06/2013 16. T/C - 16-bit Timer/Counter 16.1 Features  Eight 16-bit Timer/Counters  Four Timer/Counters of type 0  Four Timer/Counters of type 1  Four Compare or Capture (CC) Channels in Timer/Counter 0  Two Compare or Capture (CC) Channels in Timer/Counter 1  Double Buffered Timer Period Setting  Double Buffered Compare or Capture Channels  Waveform Generation:  Single Slope Pulse Width Modulation  Dual Slope Pulse Width Modulation  Frequency Generation  Input Capture:  Input Capture with Noise Cancelling  Frequency capture  Pulse width capture  32-bit input capture  Event Counter with Direction Control  Timer Overflow and Timer Error Interrupts and Events  One Compare Match or Capture Interrupt and Event per CC Channel  Supports DMA Operation  Hi-Resolution Extension (Hi-Res)  Advanced Waveform Extension (AWEX) 16.2 Overview Atmel AVR XMEGA devices have a set of eight flexible 16-bit timer/counters (TC). Their capabilities include accurate program execution timing, frequency and waveform generation, and input capture with time and frequency measurement of digital signals. Two timer/counters can be cascaded to create a 32-bit timer/counter with optional 32-bit capture. A timer/counter consists of a base counter and a set of compare or capture (CC) channels. The base counter can be used to count clock cycles or events. It has direction control and period setting that can be used for timing. The CC channels can be used together with the base counter to do compare match control, frequency generation, and pulse width waveform modulation, as well as various input capture operations. A timer/counter can be configured for either capture or compare functions, but cannot perform both at the same time. A timer/counter can be clocked and timed from the peripheral clock with optional prescaling or from the event system. The event system can also be used for direction control and capture trigger or to synchronize operations. There are two differences between timer/counter type 0 and type 1. Timer/counter 0 has four CC channels, and timer/counter 1 has two CC channels. All information related to CC channels 3 and 4 is valid only for timer/counter 0. Only Timer/Counter 0 has the split mode feature that split it into 2 8-bit Timer/Counters with four compare channels each. Some timer/counters have extensions to enable more specialized waveform and frequency generation. The advanced waveform extension (AWeX) is intended for motor control and other power control applications. It enables low- and highside output with dead-time insertion, as well as fault protection for disabling and shutting down external drivers. It can also generate a synchronized bit pattern across the port pins. The advanced waveform extension can be enabled to provide extra and more advanced features for the Timer/Counter. This is only available for Timer/Counter 0. See “AWeX - Advanced Waveform Extension” on page 38 for more details.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 37 8067O–AVR–06/2013 The high-resolution (hi-res) extension can be used to increase the waveform output resolution by four or eight times by using an internal clock source running up to four times faster than the peripheral clock. See “Hi-Res - High Resolution Extension” on page 39 for more details. Figure 16-1. Overview of a Timer/Counter and closely related peripherals PORTC, PORTD, PORTE and PORTF each has one Timer/Counter 0 and one Timer/Counter1. Notation of these Timer/Counters are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1, TCE0, TCE1, TCF0, and TCF1, respectively. AWeX Compare/Capture Channel D Compare/Capture Channel C Compare/Capture Channel B Compare/Capture Channel A Waveform Generation Buffer Comparator Hi-Res Fault Protection Capture Control Base Counter Counter Control Logic Timer Period Prescaler DTI Dead-Time Insertion Pattern Generation clkPER4 PORT Event System clkPER Timer/Counter[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 38 8067O–AVR–06/2013 17. AWeX - Advanced Waveform Extension 17.1 Features  Output with complementary output from each Capture channel  Four Dead Time Insertion (DTI) Units, one for each Capture channel  8-bit DTI Resolution  Separate High and Low Side Dead-Time Setting  Double Buffered Dead-Time  Event Controlled Fault Protection  Single Channel Multiple Output Operation (for BLDC motor control)  Double Buffered Pattern Generation 17.2 Overview The advanced waveform extension (AWeX) provides extra functions to the timer/counter in waveform generation (WG) modes. It is primarily intended for use with different types of motor control and other power control applications. It enables low- and high side output with dead-time insertion and fault protection for disabling and shutting down external drivers. It can also generate a synchronized bit pattern across the port pins. Each of the waveform generator outputs from the Timer/Counter 0 are split into a complimentary pair of outputs when any AWeX features are enabled. These output pairs go through a dead-time insertion (DTI) unit that generates the noninverted low side (LS) and inverted high side (HS) of the WG output with dead-time insertion between LS and HS switching. The DTI output will override the normal port value according to the port override setting. The pattern generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition, the WG output from compare channel A can be distributed to and override all the port pins. When the pattern generator unit is enabled, the DTI unit is bypassed. The fault protection unit is connected to the event system, enabling any event to trigger a fault condition that will disable the AWeX output. The event system ensures predictable and instant fault reaction, and gives great flexibility in the selection of fault triggers. The AWeX is available for TCC0 and TCE0. The notation of these are AWEXC and AWEXE.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 39 8067O–AVR–06/2013 18. Hi-Res - High Resolution Extension 18.1 Features  Increases Waveform Generator resolution by 2-bits (4x)  Supports Frequency, single- and dual-slope PWM operation  Supports the AWeX when this is enabled and used for the same Timer/Counter 18.2 Overview TThe high-resolution (hi-res) extension can be used to increase the resolution of the waveform generation output from a timer/counter by four or eight. It can be used for a timer/counter doing frequency, single-slope PWM, or dual-slope PWM generation. It can also be used with the AWeX if this is used for the same timer/counter. The hi-res extension uses the peripheral 4x clock (ClkPER4). The system clock prescalers must be configured so the peripheral 4x clock frequency is four times higher than the peripheral and CPU clock frequency when the hi-res extension is enabled. There are four hi-res extensions that each can be enabled for each timer/counters pair on PORTC, PORTD, PORTE and PORTF. The notation of these peripherals are HIRESC, HIRESD, HIRESE and HIRESF, respectively.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 40 8067O–AVR–06/2013 19. RTC - 16-bit Real-Time Counter 19.1 Features  16-bit resolution  Selectable clock source  32.768kHz external crystal  External clock  32.768kHz internal oscillator  32kHz internal ULP oscillator  Programmable 10-bit clock prescaling  One compare register  One period register  Clear counter on period overflow  Optional interrupt/event on overflow and compare match 19.2 Overview The 16-bit real-time counter (RTC) is a counter that typically runs continuously, including in low-power sleep modes, to keep track of time. It can wake up the device from sleep modes and/or interrupt the device at regular intervals. The reference clock is typically the 1.024kHz output from a high-accuracy crystal of 32.768kHz, and this is the configuration most optimized for low power consumption. The faster 32.768kHz output can be selected if the RTC needs a resolution higher than 1ms. The RTC can also be clocked from an external clock signal, the 32.768kHz internal oscillator or the 32kHz internal ULP oscillator. The RTC includes a 10-bit programmable prescaler that can scale down the reference clock before it reaches the counter. A wide range of resolutions and time-out periods can be configured. With a 32.768kHz clock source, the maximum resolution is 30.5µs, and time-out periods can range up to 2000 seconds. With a resolution of 1s, the maximum timeout period is more than18 hours (65536 seconds). The RTC can give a compare interrupt and/or event when the counter equals the compare register value, and an overflow interrupt and/or event when it equals the period register value. Figure 19-1. Real Time Counter overview 32.768kHz Crystal Osc 32.768kHz Int. Osc TOSC1 TOSC2 External Clock DIV32 DIV32 32kHz int ULP (DIV32) RTCSRC 10-bit prescaler clkRTC CNT PER COMP = = ”match”/ Compare TOP/ Overflow[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 41 8067O–AVR–06/2013 20. TWI - Two-Wire Interface 20.1 Features  Four identical two-wire interface peripherals  Bidirectional two-wire communication interface  Phillips I2C compatible  System Management Bus (SMBus) compatible  Bus master and slave operation supported  Slave operation  Single bus master operation  Bus master in multi-master bus environment  Multi-master arbitration  Flexible slave address match functions  7-bit and general call address recognition in hardware  10-bit addressing supported  Address mask register for dual address match or address range masking  Optional software address recognition for unlimited number of addresses  Slave can operate in all sleep modes, including power-down  Slave address match can wake device from all sleep modes, including power-down  100kHz and 400kHz bus frequency support  Slew-rate limited output drivers  Input filter for bus noise and spike suppression  Support arbitration between start repeated start and data bit (SMBus)  Slave arbitration allows support for address resolve protocol (ARP) (SMBus) 20.2 Overview The two-wire interface (TWI) is a bidirectional, two-wire communication interface. It is I2C and System Management Bus (SMBus) compatible. The only external hardware needed to implement the bus is one pull-up resistor on each bus line. A device connected to the bus must act as a master or a slave. The master initiates a data transaction by addressing a slave on the bus and telling whether it wants to transmit or receive data. One bus can have many slaves and one or several masters that can take control of the bus. An arbitration process handles priority if more than one master tries to transmit data at the same time. Mechanisms for resolving bus contention are inherent in the protocol. The TWI module supports master and slave functionality. The master and slave functionality are separated from each other, and can be enabled and configured separately. The master module supports multi-master bus operation and arbitration. It contains the baud rate generator. Both 100kHz and 400kHz bus frequency is supported. Quick command and smart mode can be enabled to auto-trigger operations and reduce software complexity. The slave module implements 7-bit address match and general address call recognition in hardware. 10-bit addressing is also supported. A dedicated address mask register can act as a second address match register or as a register for address range masking. The slave continues to operate in all sleep modes, including power-down mode. This enables the slave to wake up the device from all sleep modes on TWI address match. It is possible to disable the address matching to let this be handled in software instead. The TWI module will detect START and STOP conditions, bus collisions, and bus errors. Arbitration lost, errors, collision, and clock hold on the bus are also detected and indicated in separate status flags available in both master and slave modes. [Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 42 8067O–AVR–06/2013 It is possible to disable the TWI drivers in the device, and enable a four-wire digital interface for connecting to an external TWI bus driver. This can be used for applications where the device operates from a different VCC voltage than used by the TWI bus. PORTC, PORTD, PORTE, and PORTF each has one TWI. Notation of these peripherals are TWIC, TWID, TWIE, and TWIF.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 43 8067O–AVR–06/2013 21. SPI - Serial Peripheral Interface 21.1 Features  Four identical SPI peripherals  Full-duplex, three-wire synchronous data transfer  Master or slave operation  Lsb first or msb first data transfer  Eight programmable bit rates  Interrupt flag at the end of transmission  Write collision flag to indicate data collision  Wake up from idle sleep mode  Double speed master mode 21.2 Overview The Serial Peripheral Interface (SPI) is a high-speed synchronous data transfer interface using three or four pins. It allows fast communication between an Atmel AVR XMEGA device and peripheral devices or between several microcontrollers. The SPI supports full-duplex communication. A device connected to the bus must act as a master or slave. The master initiates and controls all data transactions. PORTC, PORTD, PORTE, and PORTF each has one SPI. Notation of these peripherals are SPIC, SPID, SPIE, and SPIF.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 44 8067O–AVR–06/2013 22. USART 22.1 Features  Eight identical USART peripherals  Full-duplex operation  Asynchronous or synchronous operation  Synchronous clock rates up to 1/2 of the device clock frequency  Asynchronous clock rates up to 1/8 of the device clock frequency  Supports serial frames with 5, 6, 7, 8, or 9 data bits and 1 or 2 stop bits  Fractional baud rate generator  Can generate desired baud rate from any system clock frequency  No need for external oscillator with certain frequencies  Built-in error detection and correction schemes  Odd or even parity generation and parity check  Data overrun and framing error detection  Noise filtering includes false start bit detection and digital low-pass filter  Separate interrupts for  Transmit complete  Transmit data register empty  Receive complete  Multiprocessor communication mode  Addressing scheme to address a specific devices on a multidevice bus  Enable unaddressed devices to automatically ignore all frames  Master SPI mode  Double buffered operation  Operation up to 1/2 of the peripheral clock frequency  IRCOM module for IrDA compliant pulse modulation/demodulation 22.2 Overview The universal synchronous and asynchronous serial receiver and transmitter (USART) is a fast and flexible serial communication module. The USART supports full-duplex communication and asynchronous and synchronous operation. The USART can be configured to operate in SPI master mode and used for SPI communication. Communication is frame based, and the frame format can be customized to support a wide range of standards. The USART is buffered in both directions, enabling continued data transmission without any delay between frames. Separate interrupts for receive and transmit complete enable fully interrupt driven communication. Frame error and buffer overflow are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also be enabled. The clock generator includes a fractional baud rate generator that is able to generate a wide range of USART baud rates from any system clock frequencies. This removes the need to use an external crystal oscillator with a specific frequency to achieve a required baud rate. It also supports external clock input in synchronous slave operation. When the USART is set in master SPI mode, all USART-specific logic is disabled, leaving the transmit and receive buffers, shift registers, and baud rate generator enabled. Pin control and interrupt generation are identical in both modes. The registers are used in both modes, but their functionality differs for some control settings. An IRCOM module can be enabled for one USART to support IrDA 1.4 physical compliant pulse modulation and demodulation for baud rates up to 115.2Kbps. PORTC, PORTD, PORTE, and PORTF each has two USARTs. Notation of these peripherals are USARTC0, USARTC1, USARTD0, USARTD1, USARTE0, USARTE1, USARTF0 and USARTF1.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 45 8067O–AVR–06/2013 23. IRCOM - IR Communication Module 23.1 Features  Pulse modulation/demodulation for infrared communication  IrDA compatible for baud rates up to 115.2Kbps  Selectable pulse modulation scheme  3/16 of the baud rate period  Fixed pulse period, 8-bit programmable  Pulse modulation disabled  Built-in filtering  Can be connected to and used by any USART 23.2 Overview Atmel AVR XMEGA devices contain an infrared communication module (IRCOM) that is IrDA compatible for baud rates up to 115.2Kbps. It can be connected to any USART to enable infrared pulse encoding/decoding for that USART.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 46 8067O–AVR–06/2013 24. AES and DES Crypto Engine 24.1 Features  Data Encryption Standard (DES) CPU instruction  Advanced Encryption Standard (AES) crypto module  DES Instruction  Encryption and decryption  DES supported  Encryption/decryption in 16 CPU clock cycles per 8-byte block  AES crypto module  Encryption and decryption  Supports 128-bit keys  Supports XOR data load mode to the state memory  Encryption/decryption in 375 clock cycles per 16-byte block 24.2 Overview The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two commonly used standards for cryptography. These are supported through an AES peripheral module and a DES CPU instruction, and the communication interfaces and the CPU can use these for fast, encrypted communication and secure data storage. DES is supported by an instruction in the AVR CPU. The 8-byte key and 8-byte data blocks must be loaded into the register file, and then the DES instruction must be executed 16 times to encrypt/decrypt the data block. The AES crypto module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key. The key and data must be loaded into the key and state memory in the module before encryption/decryption is started. It takes 375 peripheral clock cycles before the encryption/decryption is done. The encrypted/encrypted data can then be read out, and an optional interrupt can be generated. The AES crypto module also has DMA support with transfer triggers when encryption/decryption is done and optional auto-start of encryption/decryption when the state memory is fully loaded.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 47 8067O–AVR–06/2013 25. EBI – External Bus Interface 25.1 Features  Supports SRAM up to:  512KB using 3-port EBI configuration  16MB using 3-port EBI configuration  Supports SDRAM up to:  128Mb using 3-port EBI configuration  Four software configurable chip selects  Software configurable wait state insertion  Can run from the 2x peripheral clock frequency for fast access 25.2 Overview The External Bus Interface (EBI) is used to connect external peripherals and memory for access through the data memory space. When the EBI is enabled, data address space outside the internal SRAM becomes available using dedicated EBI pins. The EBI can interface external SRAM, SDRAM, and peripherals, such as LCD displays and other memory mapped devices. The address space for the external memory is selectable from 256 bytes (8-bit) up to 16MB (24-bit). Various multiplexing modes for address and data lines can be selected for optimal use of pins when more or fewer pins are available for the EBI. The complete memory will be mapped into one linear data address space continuing from the end of the internal SRAM. The EBI has four chip selects, each with separate configuration. Each can be configured for SRAM, SRAM low pin count (LPC), or SDRAM. The EBI is clocked from the fast, 2x peripheral clock, running up to two times faster than the CPU. Four-bit and eight-bit SDRAM are supported, and SDRAM configurations, such as CAS latency and refresh rate, are configurable in software.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 48 8067O–AVR–06/2013 26. ADC - 12-bit Analog to Digital Converter 26.1 Features  Two ADCs with 12-bit resolution  2Msps sample rate for each ADC  Signed and unsigned conversions  4 result registers with individual input channel control for each ADC  8 single ended inputs for each ADC  8x4 differential inputs for each ADC  4 internal inputs:  Integrated Temperature Sensor  DAC Output  VCC voltage divided by 10  Bandgap voltage  Software selectable gain of 2, 4, 8, 16, 32 or 64  Software selectable resolution of 8- or 12-bit.  Internal or External Reference selection  Event triggered conversion for accurate timing  DMA transfer of conversion results  Interrupt/Event on compare result 26.2 Overview XMEGA A1 devices have two Analog to Digital Converters (ADC), see Figure 26-1 on page 49. The two ADC modules can be operated simultaneously, individually or synchronized. The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capable of converting up to 2 million samples per second. The input selection is flexible, and both single-ended and differential measurements can be done. For differential measurements an optional gain stage is available to increase the dynamic range. In addition several internal signal inputs are available. The ADC can provide both signed and unsigned results. This is a pipeline ADC. A pipeline ADC consists of several consecutive stages, where each stage convert one part of the result. The pipeline design enables high sample rate at low clock speeds, and remove limitations on samples speed versus propagation delay. This also means that a new analog voltage can be sampled and a new ADC measurement started while other ADC measurements are ongoing. ADC measurements can either be started by application software or an incoming event from another peripheral in the device. Four different result registers with individual input selection (MUX selection) are provided to make it easier for the application to keep track of the data. Each result register and MUX selection pair is referred to as an ADC Channel. It is possible to use DMA to move ADC results directly to memory or peripherals when conversions are done. Both internal and external analog reference voltages can be used. An accurate internal 1.0V reference is available. An integrated temperature sensor is available and the output from this can be measured with the ADC. The output from the DAC, VCC/10 and the Bandgap voltage can also be measured by the ADC.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 49 8067O–AVR–06/2013 Figure 26-1. ADC overview Each ADC has four MUX selection registers with a corresponding result register. This means that four channels can be sampled within 1.5 µs without any intervention by the application other than starting the conversion. The results will be available in the result registers. The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.5 µs for 12-bit to 2.5 µs for 8-bit result. ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when the result is represented as a signed integer (signed 16-bit number). PORTA and PORTB each has one ADC. Notation of these peripherals are ADCA and ADCB, respectively. CH1 Result CH0 Result CH2 Result Compare < > Threshold (Int Req) Internal 1.00V Internal VCC/1.6V AREFA AREFB VINP VINN Internal signals Internal signals CH3 Result ADC0 ADC7 ADC4 ADC7 ADC0 ADC3 • • • Int. signals Int. signals Reference Voltage 1x - 64x • • • • • • ADC0 ADC7 • • •[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 50 8067O–AVR–06/2013 27. DAC - 12-bit Digital to Analog Converter 27.1 Features  12-bit resolution  Two independent, continuous-drive output channels  Up to one million samples per second conversion rate  Built-in calibration that removes:  Offset error  Gain error  Multiple conversion trigger sources  On new available data  Events from the event system  High drive capabilities and support for  Resistive loads  Capacitive loads  Combined resistive and capacitive loads  Internal and external reference options  DAC output available as input to analog comparator and ADC  Low-power mode, with reduced drive strength  Optional DMA transfer of data 27.2 Overview The XMEGA A1 devices features two 12-bit, 1 Msps DACs with built-in offset and gain calibration, see Figure 27-1 on page 50. A DAC converts a digital value into an analog signal. The DAC may use an internal 1.0 voltage as the upper limit for conversion, but it is also possible to use the supply voltage or any applied voltage in-between. The external reference input is shared with the ADC reference input. Figure 27-1. DAC overview CH1DATA CH0DATA Trigger Internal 1.00V AREFA AREFB AVCC D A T A DAC CTRL DAC CH0 REFSEL Enable 12 12 ADC DAC DAC CH1 Output Control and Driver[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 51 8067O–AVR–06/2013 Each DAC has one continuous output with high drive capabilities for both resistive and capacitive loads. It is also possible to split the continuous time channel into two Sample and Hold (S/H) channels, each with separate data conversion registers. A DAC conversion may be started from the application software by writing the data conversion registers. The DAC can also be configured to do conversions triggered by the Event System to have regular timing, independent of the application software. DMA may be used for transferring data from memory locations to DAC data registers. The DAC has a built-in calibration system to reduce offset and gain error when loading with a calibration value from software. PORTA and PORTB each has one DAC. Notation of these peripherals are DACA and DACB. respectively.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 52 8067O–AVR–06/2013 28. AC - Analog Comparator 28.1 Features  Four Analog Comparators  Selectable propagation delay versus current consumption  Selectable hysteresis  No  Small  Large  Analog comparator output available on pin  Flexible input selection  All pins on the port  Output from the DAC  Bandgap reference voltage  A 64-level programmable voltage scaler of the internal VCC voltage  Interrupt and event generation on:  Rising edge  Falling edge  Toggle  Window function interrupt and event generation on:  Signal above window  Signal inside window  Signal below window  Constant current source with configurable output pin selection 28.2 Overview The analog comparator (AC) compares the voltage levels on two inputs and gives a digital output based on this comparison. The analog comparator may be configured to generate interrupt requests and/or events upon several different combinations of input change. Two important properties of the analog comparator’s dynamic behavior are: hysteresis and propagation delay. Both of these parameters may be adjusted in order to achieve the optimal operation for each application. The input selection includes analog port pins, several internal signals, and a 64-level programmable voltage scaler. The analog comparator output state can also be output on a pin for use by external devices. A constant current source can be enabled and output on a selectable pin. This can be used to replace, for example, external resistors used to charge capacitors in capacitive touch sensing applications. The analog comparators are always grouped in pairs on each port. These are called analog comparator 0 (AC0) and analog comparator 1 (AC1). They have identical behavior, but separate control registers. Used as pair, they can be set in window mode to compare a signal to a voltage range instead of a voltage level. PORTA and PORTB each has one AC pair. Notations are ACA and ACB, respectively.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 53 8067O–AVR–06/2013 Figure 28-1. Analog comparator overview The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Figure 28-2. Figure 28-2. Analog comparator window function ACnMUXCTRL ACnCTRL Interrupt Mode Enable Enable Hysteresis Hysteresis AC1OUT WINCTRL Interrupt Sensititivity Control & Window Function Events Interrupts AC0OUT Pin Input Pin Input Pin Input Pin Input Voltage Scaler DAC Bandgap + - + - AC0 + - AC1 + - Input signal Upper limit of window Lower limit of window Interrupt sensitivity control Interrupts Events[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 54 8067O–AVR–06/2013 29. Programming and Debugging 29.1 Features  Programming  External programming through PDI or JTAG interfaces  Minimal protocol overhead for fast operation  Built-in error detection and handling for reliable operation  Boot loader support for programming through any communication interface  Debugging  Nonintrusive, real-time, on-chip debug system  No software or hardware resources required from device except pin connection  Program flow control  Go, Stop, Reset, Step Into, Step Over, Step Out, Run-to-Cursor  Unlimited number of user program breakpoints  Unlimited number of user data breakpoints, break on:  Data location read, write, or both read and write  Data location content equal or not equal to a value  Data location content is greater or smaller than a value  Data location content is within or outside a range  No limitation on device clock frequency  Program and Debug Interface (PDI)  Two-pin interface for external programming and debugging  Uses the Reset pin and a dedicated pin  No I/O pins required during programming or debugging  JTAG interface  Four-pin, IEEE Std. 1149.1 compliant interface for programming and debugging  Boundary scan capabilities according to IEEE Std. 1149.1 (JTAG) 29.2 Overview The Program and Debug Interface (PDI) is an Atmel proprietary interface for external programming and on-chip debugging of a device. The PDI supports fast programming of nonvolatile memory (NVM) spaces; flash, EEPOM, fuses, lock bits, and the user signature row. Debug is supported through an on-chip debug system that offers nonintrusive, real-time debug. It does not require any software or hardware resources except for the device pin connection. Using the Atmel tool chain, it offers complete program flow control and support for an unlimited number of program and complex data breakpoints. Application debug can be done from a C or other high-level language source code level, as well as from an assembler and disassembler level. Programming and debugging can be done through two physical interfaces. The primary one is the PDI physical layer, which is available on all devices. This is a two-pin interface that uses the Reset pin for the clock input (PDI_CLK) and one other dedicated pin for data input and output (PDI_DATA). A JTAG interface is also available on most devices, and this can be used for programming and debugging through the four-pin JTAG interface. The JTAG interface is IEEE Std. 1149.1 compliant, and supports boundary scan. Any external programmer or on-chip debugger/emulator can be directly connected to either of these interfaces. Unless otherwise stated, all references to the PDI assume access through the PDI physical layer.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 55 8067O–AVR–06/2013 30. Pinout and Pin Functions The pinout of XMEGA A1 is shown in “Pinout/Block Diagram” on page 3. In addition to general I/O functionality, each pin may have several functions. This will depend on which peripheral is enabled and connected to the actual pin. Only one of the alternate pin functions can be used at time. 30.1 Alternate Pin Function Description The tables below shows the notation for all pin functions available and describes its function. 30.1.1 Operation/Power Supply 30.1.2 Port Interrupt functions 30.1.3 Analog functions 30.1.4 EBI functions VCC Digital supply voltage AVCC Analog supply voltage GND Ground SYNC Port pin with full synchronous and limited asynchronous interrupt function ASYNC Port pin with full synchronous and full asynchronous interrupt function ACn Analog Comparator input pin n AC0OUT Analog Comparator 0 Output ADCn Analog to Digital Converter input pin n DACn Digital to Analog Converter output pin n AREF Analog Reference input pin An Address line n Dn Data line n CSn Chip Select n ALEn Address Latch Enable pin n (SRAM) RE Read Enable (SRAM) WE External Data Memory Write (SRAM /SDRAM) BAn Bank Address (SDRAM) CAS Column Access Strobe (SDRAM) CKE SDRAM Clock Enable (SDRAM)[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 56 8067O–AVR–06/2013 30.1.5 Timer/Counter and AWEX functions 30.1.6 Communication functions 30.1.7 Oscillators, Clock and Event CLK SDRAM Clock (SDRAM) DQM Data Mask Signal/Output Enable (SDRAM) RAS Row Access Strobe (SDRAM) 2P 2 Port Interface 3P 3 Port Interface OCnx Output Compare Channel x for Timer/Counter n OCnx Inverted Output Compare Channel x for Timer/Counter n OCnxLS Output Compare Channel x Low Side for Timer/Counter n OCnxHS Output Compare Channel x High Side for Timer/Counter n SCL Serial Clock for TWI SDA Serial Data for TWI SCLIN Serial Clock In for TWI when external driver interface is enabled SCLOUT Serial Clock Out for TWI when external driver interface is enabled SDAIN Serial Data In for TWI when external driver interface is enabled SDAOUT Serial Data Out for TWI when external driver interface is enabled XCKn Transfer Clock for USART n RXDn Receiver Data for USART n TXDn Transmitter Data for USART n SS Slave Select for SPI MOSI Master Out Slave In for SPI MISO Master In Slave Out for SPI SCK Serial Clock for SPI n Timer Oscillator pin n XTALn Input/Output for inverting Oscillator pin n CLKOUT Peripheral Clock Output EVOUT Event Channel 0 Output[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 57 8067O–AVR–06/2013 30.1.8 Debug/System functions RESET Reset pin PDI_CLK Program and Debug Interface Clock pin PDI_DATA Program and Debug Interface Data pin TCK JTAG Test Clock TDI JTAG Test Data In TDO JTAG Test Data Out TMS JTAG Test Mode Select[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 58 8067O–AVR–06/2013 30.2 Alternate Pin Functions The tables below show the primary/default function for each pin on a port in the first column, the pin number in the second column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that enable and use the alternate pin functions. Table 30-1. Port A - Alternate functions. Table 30-2. Port B - Alternate functions. Table 30-3. Port C - Alternate functions. PORT A PIN # INTERRUPT ADCA POS ADCA NEG ADCA GAINPOS ADCA GAINNEG ACA POS ACA NEG ACA OUT DACA REFA GND 93 AVCC 94 PA0 95 SYNC ADC0 ADC0 ADC0 AC0 AC0 AREF PA1 96 SYNC ADC1 ADC1 ADC1 AC1 AC1 PA2 97 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 DAC0 PA3 98 SYNC ADC3 ADC3 ADC3 AC3 AC3 DAC1 PA4 99 SYNC ADC4 ADC4 ADC4 AC4 PA5 100 SYNC ADC5 ADC5 ADC5 AC5 AC5 PA6 1 SYNC ADC6 ADC6 ADC6 AC6 PA7 2 SYNC ADC7 ADC7 ADC7 AC7 AC0OUT PORT B PIN # INTERRUPT ADCB POS ADCB NEG ADCB GAINPOS ADCB GAINNEG ACB POS ACB NEG ACB OUT DACB REFB JTAG GND 3 AVCC 4 PB0 5 SYNC ADC0 ADC0 ADC0 AC0 AC0 AREF PB1 6 SYNC ADC1 ADC1 ADC1 AC1 AC1 PB2 7 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 DAC0 PB3 8 SYNC ADC3 ADC3 ADC3 AC3 AC3 DAC1 PB4 9 SYNC ADC4 ADC4 ADC4 AC4 TMS PB5 10 SYNC ADC5 ADC5 ADC5 AC5 AC5 TDI PB6 11 SYNC ADC6 ADC6 ADC6 AC6 TCK PB7 12 SYNC ADC7 ADC7 ADC7 AC7 AC0OUT TDO PORT C PIN # INTERRUPT TCC0 AWEXC TCC1 USARTC0 USARTC1 SPIC TWIC CLOCKOUT EVENTOUT GND 13 VCC 14 PC0 15 SYNC OC0A OC0ALS SDA PC1 16 SYNC OC0B OC0AHS XCK0 SCL PC2 17 SYNC/ASYNC OC0C OC0BLS RXD0[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 59 8067O–AVR–06/2013 Table 30-4. Port D - Alternate functions. Table 30-5. Port E - Alternate functions. Table 30-6. Port F - Alternate functions. PC3 18 SYNC OC0D OC0BHS TXD0 PC4 19 SYNC OC0CLS OC1A SS PC5 20 SYNC OC0CHS OC1B XCK1 MOSI PC6 21 SYNC OC0DLS RXD1 MISO PC7 22 SYNC OC0DHS TXD1 SCK CLKOUT EVOUT PORT D PIN # INTERRUPT TCD0 TCD1 USARTD0 USARTD1 SPID TWID CLOCKOUT EVENTOUT GND 23 VCC 24 PD0 25 SYNC OC0A SDA PD1 26 SYNC OC0B XCK0 SCL PD2 27 SYNC/ASYNC OC0C RXD0 PD3 28 SYNC OC0D TXD0 PD4 29 SYNC OC1A SS PD5 30 SYNC OC1B XCK1 MOSI PD6 31 SYNC RXD1 MISO PD7 32 SYNC TXD1 SCK CLKOUT EVOUT PORT E PIN # INTERRUPT TCE0 AWEXE TCE1 USARTE0 USARTE1 SPIE TWIE CLOCKOUT EVENTOUT GND 33 VCC 34 PE0 35 SYNC OC0A OC0ALS SDA PE1 36 SYNC OC0B OC0AHS XCK0 SCL PE2 37 SYNC/ASYNC OC0C OC0BLS RXD0 PE3 38 SYNC OC0D OC0BHS TXD0 PE4 39 SYNC OC0CLS OC1A SS PE5 40 SYNC OC0CHS OC1B XCK1 MOSI PE6 41 SYNC OC0DLS RXD1 MISO PE7 42 SYNC OC0DHS TXD1 SCK CLKOUT EVOUT PORT F PIN # INTERRUPT TCF0 TCF1 USARTF0 USARTF1 SPIF TWIF GND 43 VCC 44 PF0 45 SYNC OC0A SDA PORT C PIN # INTERRUPT TCC0 AWEXC TCC1 USARTC0 USARTC1 SPIC TWIC CLOCKOUT EVENTOUT[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 60 8067O–AVR–06/2013 Table 30-7. Port H - Alternate functions. Table 30-8. Port J - Alternate functions. PF1 46 SYNC OC0B XCK0 SCL PF2 47 SYNC/ASYNC OC0C RXD0 PF3 48 SYNC OC0D TXD0 PF4 49 SYNC OC1A SS PF5 50 SYNC OC1B XCK1 MOSI PF6 51 SYNC RXD1 MISO PF7 52 SYNC TXD1 SCK PORT H PIN # INTERRUPT SDRAM 3P SRAM ALE1 3P SRAM ALE12 3P LPC ALE1 3P LPC ALE1 2P LPC ALE12 2P GND 53 VCC 54 PH0 55 SYNC WE WE WE WE WE WE PH1 56 SYNC CAS RE RE RE RE RE PH2 57 SYNC/ASYNC RAS ALE1 ALE1 ALE1 ALE1 ALE1 PH3 58 SYNC DQM ALE2 ALE2 PH4 59 SYNC BA0 CS0/A16 CS0 CS0/A16 CS0 CS0/A16 PH5 60 SYNC BA1 CS1/A17 CS1 CS1/A17 CS1 CS1/A17 PH6 61 SYNC CKE CS2/A18 CS2 CS2/A18 CS2 CS2/A18 PH7 62 SYNC CLK CS3/A19 CS3 CS3/A19 CS3 CS3/A19 PORT J PIN # INTERRUPT SDRAM 3P SRAM ALE1 3P SRAM ALE12 3P LPC ALE1 3P LPC ALE1 2P LPC ALE12 2P GND 63 VCC 64 PJ0 65 SYNC D0 D0 D0 D0/A0 D0/A0 D0/A0/A8 PJ1 66 SYNC D1 D1 D1 D1/A1 D1/A1 D1/A1/A9 PJ2 67 SYNC/ASYNC D2 D2 D2 D2/A2 D2/A2 D2/A2/A10 PJ3 68 SYNC D3 D3 D3 D3/A3 D3/A3 D3/A3/A11 PJ4 69 SYNC A8 D4 D4 D4/A4 D4/A4 D4/A4/A12 PJ5 70 SYNC A9 D5 D5 D5/A5 D5/A5 D5/A5/A13 PJ6 71 SYNC A10 D6 D6 D6/A6 D6/A6 D6/A6/A14 PJ7 72 SYNC A11 D7 D7 D7/A7 D7/A7 D7/A7/A15 PORT F PIN # INTERRUPT TCF0 TCF1 USARTF0 USARTF1 SPIF TWIF[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 61 8067O–AVR–06/2013 Table 30-9. Port K - Alternate functions. Table 30-10. Port Q - Alternate functions. Table 30-11. Port R - Alternate functions. PORT K PIN # INTERRUPT SDRAM 3P SRAM ALE1 3P SRAM ALE12 3P LPC ALE1 3P LPC ALE1 2P LPC ALE12 2P GND 73 VCC 74 PK0 75 SYNC A0 A0/A8 A0/A8/A16 A8 PK1 76 SYNC A1 A1/A9 A1/A9/A17 A9 PK2 77 SYNC/ASYNC A2 A2/A10 A2/A10/A18 A10 PK3 78 SYNC A3 A3/A11 A3/A11/A19 A11 PK4 79 SYNC A4 A4/A12 A4/A12/A20 A12 PK5 80 SYNC A5 A5/A13 A5/A13/A21 A13 PK6 81 SYNC A6 A6/A14 A6/A14/A22 A14 PK7 82 SYNC A7 A7/A15 A7/A15/A23 A15 PORT Q PIN # INTERRUPT VCC 83 GND 84 PQ0 85 SYNC TOSC1 (Input) PQ1 86 SYNC TOSC2 (Output) PQ2 87 SYNC/ASYNC PQ3 88 SYNC PORT R PIN # INTERRUPT PDI XTAL PDI 89 PDI_DATA RESET 90 PDI_CLOCK PRO 91 SYNC XTAL2 PR1 92 SYNC XTAL1[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 62 8067O–AVR–06/2013 31. Peripheral Module Address Map The address maps show the base address for each peripheral and module in XMEGA A1. For complete register description and summary for each peripheral module, refer to the XMEGA A Manual. Table 31-1. Peripheral Module Address Map Base Address Name Description 0x0000 GPIO General Purpose IO Registers 0x0010 VPORT0 Virtual Port 0 0x0014 VPORT1 Virtual Port 1 0x0018 VPORT2 Virtual Port 2 0x001C VPORT3 Virtual Port 3 0x0030 CPU CPU 0x0040 CLK Clock Control 0x0048 SLEEP Sleep Controller 0x0050 OSC Oscillator Control 0x0060 DFLLRC32M DFLL for the 32 MHz Internal RC Oscillator 0x0068 DFLLRC2M DFLL for the 2 MHz RC Oscillator 0x0070 PR Power Reduction 0x0078 RST Reset Controller 0x0080 WDT Watch-Dog Timer 0x0090 MCU MCU Control 0x00A0 PMIC Programmable Multilevel Interrupt Controller 0x00B0 PORTCFG Port Configuration 0x00C0 AES AES Module 0x0100 DMA DMA Controller 0x0180 EVSYS Event System 0x01C0 NVM Non Volatile Memory (NVM) Controller 0x0200 ADCA Analog to Digital Converter on port A 0x0240 ADCB Analog to Digital Converter on port B 0x0300 DACA Digital to Analog Converter on port A 0x0320 DACB Digital to Analog Converter on port B 0x0380 ACA Analog Comparator pair on port A 0x0390 ACB Analog Comparator pair on port B 0x0400 RTC Real Time Counter 0x0440 EBI External Bus Interface 0x0480 TWIC Two Wire Interface on port C 0x0490 TWID Two Wire Interface on port D[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 63 8067O–AVR–06/2013 0x04A0 TWIE Two Wire Interface on port E 0x04B0 TWIF Two Wire Interface on port F 0x0600 PORTA Port A 0x0620 PORTB Port B 0x0640 PORTC Port C 0x0660 PORTD Port D 0x0680 PORTE Port E 0x06A0 PORTF Port F 0x06E0 PORTH Port H 0x0700 PORTJ Port J 0x0720 PORTK Port K 0x07C0 PORTQ Port Q 0x07E0 PORTR Port R 0x0800 TCC0 Timer/Counter 0 on port C 0x0840 TCC1 Timer/Counter 1 on port C 0x0880 AWEXC Advanced Waveform Extension on port C 0x0890 HIRESC High Resolution Extension on port C 0x08A0 USARTC0 USART 0 on port C 0x08B0 USARTC1 USART 1 on port C 0x08C0 SPIC Serial Peripheral Interface on port C 0x08F8 IRCOM Infrared Communication Module 0x0900 TCD0 Timer/Counter 0 on port D 0x0940 TCD1 Timer/Counter 1 on port D 0x0990 HIRESD High Resolution Extension on port D 0x09A0 USARTD0 USART 0 on port D 0x09B0 USARTD1 USART 1 on port D 0x09C0 SPID Serial Peripheral Interface on port D 0x0A00 TCE0 Timer/Counter 0 on port E 0x0A40 TCE1 Timer/Counter 1 on port E 0x0A80 AWEXE Advanced Waveform Extension on port E 0x0A90 HIRESE High Resolution Extension on port E 0x0AA0 USARTE0 USART 0 on port E 0x0AB0 USARTE1 USART 1 on port E 0x0AC0 SPIE Serial Peripheral Interface on port E 0x0B00 TCF0 Timer/Counter 0 on port F Base Address Name Description[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 64 8067O–AVR–06/2013 0x0B40 TCF1 Timer/Counter 1 on port F 0x0B90 HIRESF High Resolution Extension on port F 0x0BA0 USARTF0 USART 0 on port F 0x0BB0 USARTF1 USART 1 on port F 0x0BC0 SPIF Serial Peripheral Interface on port F Base Address Name Description[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 65 8067O–AVR–06/2013 32. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks Arithmetic and Logic Instructions ADD Rd, Rr Add without Carry Rd  Rd + Rr Z,C,N,V,S,H 1 ADC Rd, Rr Add with Carry Rd  Rd + Rr + C Z,C,N,V,S,H 1 ADIW Rd, K Add Immediate to Word Rd  Rd + 1:Rd + K Z,C,N,V,S 2 SUB Rd, Rr Subtract without Carry Rd  Rd - Rr Z,C,N,V,S,H 1 SUBI Rd, K Subtract Immediate Rd  Rd - K Z,C,N,V,S,H 1 SBC Rd, Rr Subtract with Carry Rd  Rd - Rr - C Z,C,N,V,S,H 1 SBCI Rd, K Subtract Immediate with Carry Rd  Rd - K - C Z,C,N,V,S,H 1 SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd  Rd + 1:Rd - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Rd  Rd  Rr Z,N,V,S 1 ANDI Rd, K Logical AND with Immediate Rd  Rd  K Z,N,V,S 1 OR Rd, Rr Logical OR Rd  Rd v Rr Z,N,V,S 1 ORI Rd, K Logical OR with Immediate Rd  Rd v K Z,N,V,S 1 EOR Rd, Rr Exclusive OR Rd  Rd  Rr Z,N,V,S 1 COM Rd One’s Complement Rd  $FF - Rd Z,C,N,V,S 1 NEG Rd Two’s Complement Rd  $00 - Rd Z,C,N,V,S,H 1 SBR Rd,K Set Bit(s) in Register Rd  Rd v K Z,N,V,S 1 CBR Rd,K Clear Bit(s) in Register Rd  Rd  ($FFh - K) Z,N,V,S 1 INC Rd Increment Rd  Rd + 1 Z,N,V,S 1 DEC Rd Decrement Rd  Rd - 1 Z,N,V,S 1 TST Rd Test for Zero or Minus Rd  Rd  Rd Z,N,V,S 1 CLR Rd Clear Register Rd  Rd  Rd Z,N,V,S 1 SER Rd Set Register Rd  $FF None 1 MUL Rd,Rr Multiply Unsigned R1:R0  Rd x Rr (UU) Z,C 2 MULS Rd,Rr Multiply Signed R1:R0  Rd x Rr (SS) Z,C 2 MULSU Rd,Rr Multiply Signed with Unsigned R1:R0  Rd x Rr (SU) Z,C 2 FMUL Rd,Rr Fractional Multiply Unsigned R1:R0  Rd x Rr<<1 (UU) Z,C 2 FMULS Rd,Rr Fractional Multiply Signed R1:R0  Rd x Rr<<1 (SS) Z,C 2 FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0  Rd x Rr<<1 (SU) Z,C 2 DES K Data Encryption if (H = 0) then R15:R0 else if (H = 1) then R15:R0   Encrypt(R15:R0, K) Decrypt(R15:R0, K) 1/2 Branch Instructions RJMP k Relative Jump PC  PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC(15:0) PC(21:16)   Z, 0 None 2 EIJMP Extended Indirect Jump to (Z) PC(15:0) PC(21:16)   Z, EIND None 2 JMP k Jump PC  k None 3[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 66 8067O–AVR–06/2013 RCALL k Relative Call Subroutine PC  PC + k + 1 None 2 / 3(1) ICALL Indirect Call to (Z) PC(15:0) PC(21:16)   Z, 0 None 2 / 3(1) EICALL Extended Indirect Call to (Z) PC(15:0) PC(21:16)   Z, EIND None 3(1) CALL k call Subroutine PC  k None 3 / 4(1) RET Subroutine Return PC  STACK None 4 / 5(1) RETI Interrupt Return PC  STACK I 4 / 5(1) CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC  PC + 2 or 3 None 1 / 2 / 3 CP Rd,Rr Compare Rd - Rr Z,C,N,V,S,H 1 CPC Rd,Rr Compare with Carry Rd - Rr - C Z,C,N,V,S,H 1 CPI Rd,K Compare with Immediate Rd - K Z,C,N,V,S,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC  PC + 2 or 3 None 1 / 2 / 3 SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC  PC + 2 or 3 None 1 / 2 / 3 SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC  PC + 2 or 3 None 2 / 3 / 4 SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC  PC + 2 or 3 None 2 / 3 / 4 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC  PC + k + 1 None 1 / 2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC  PC + k + 1 None 1 / 2 BREQ k Branch if Equal if (Z = 1) then PC  PC + k + 1 None 1 / 2 BRNE k Branch if Not Equal if (Z = 0) then PC  PC + k + 1 None 1 / 2 BRCS k Branch if Carry Set if (C = 1) then PC  PC + k + 1 None 1 / 2 BRCC k Branch if Carry Cleared if (C = 0) then PC  PC + k + 1 None 1 / 2 BRSH k Branch if Same or Higher if (C = 0) then PC  PC + k + 1 None 1 / 2 BRLO k Branch if Lower if (C = 1) then PC  PC + k + 1 None 1 / 2 BRMI k Branch if Minus if (N = 1) then PC  PC + k + 1 None 1 / 2 BRPL k Branch if Plus if (N = 0) then PC  PC + k + 1 None 1 / 2 BRGE k Branch if Greater or Equal, Signed if (N  V= 0) then PC  PC + k + 1 None 1 / 2 BRLT k Branch if Less Than, Signed if (N  V= 1) then PC  PC + k + 1 None 1 / 2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC  PC + k + 1 None 1 / 2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC  PC + k + 1 None 1 / 2 BRTS k Branch if T Flag Set if (T = 1) then PC  PC + k + 1 None 1 / 2 BRTC k Branch if T Flag Cleared if (T = 0) then PC  PC + k + 1 None 1 / 2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC  PC + k + 1 None 1 / 2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC  PC + k + 1 None 1 / 2 BRIE k Branch if Interrupt Enabled if (I = 1) then PC  PC + k + 1 None 1 / 2 BRID k Branch if Interrupt Disabled if (I = 0) then PC  PC + k + 1 None 1 / 2 Data Transfer Instructions MOV Rd, Rr Copy Register Rd  Rr None 1 MOVW Rd, Rr Copy Register Pair Rd+1:Rd  Rr+1:Rr None 1 Mnemonics Operands Description Operation Flags #Clocks[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 67 8067O–AVR–06/2013 LDI Rd, K Load Immediate Rd  K None 1 LDS Rd, k Load Direct from data space Rd  (k) None 2(1)(2) LD Rd, X Load Indirect Rd  (X) None 1(1)(2) LD Rd, X+ Load Indirect and Post-Increment Rd X   (X) X + 1 None 1(1)(2) LD Rd, -X Load Indirect and Pre-Decrement X  X - 1, Rd  (X)   X - 1 (X) None 2(1)(2) LD Rd, Y Load Indirect Rd  (Y)  (Y) None 1(1)(2) LD Rd, Y+ Load Indirect and Post-Increment Rd Y   (Y) Y + 1 None 1(1)(2) LD Rd, -Y Load Indirect and Pre-Decrement Y Rd   Y - 1 (Y) None 2(1)(2) LDD Rd, Y+q Load Indirect with Displacement Rd  (Y + q) None 2(1)(2) LD Rd, Z Load Indirect Rd  (Z) None 1(1)(2) LD Rd, Z+ Load Indirect and Post-Increment Rd Z   (Z), Z+1 None 1(1)(2) LD Rd, -Z Load Indirect and Pre-Decrement Z Rd   Z - 1, (Z) None 2(1)(2) LDD Rd, Z+q Load Indirect with Displacement Rd  (Z + q) None 2(1)(2) STS k, Rr Store Direct to Data Space (k)  Rd None 2(1) ST X, Rr Store Indirect (X)  Rr None 1(1) ST X+, Rr Store Indirect and Post-Increment (X) X   Rr, X + 1 None 1(1) ST -X, Rr Store Indirect and Pre-Decrement X (X)   X - 1, Rr None 2(1) ST Y, Rr Store Indirect (Y)  Rr None 1(1) ST Y+, Rr Store Indirect and Post-Increment (Y) Y   Rr, Y + 1 None 1(1) ST -Y, Rr Store Indirect and Pre-Decrement Y (Y)   Y - 1, Rr None 2(1) STD Y+q, Rr Store Indirect with Displacement (Y + q)  Rr None 2(1) ST Z, Rr Store Indirect (Z)  Rr None 1(1) ST Z+, Rr Store Indirect and Post-Increment (Z) Z   Rr Z + 1 None 1(1) ST -Z, Rr Store Indirect and Pre-Decrement Z  Z - 1 None 2(1) STD Z+q,Rr Store Indirect with Displacement (Z + q)  Rr None 2(1) LPM Load Program Memory R0  (Z) None 3 LPM Rd, Z Load Program Memory Rd  (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Increment Rd Z   (Z), Z + 1 None 3 ELPM Extended Load Program Memory R0  (RAMPZ:Z) None 3 ELPM Rd, Z Extended Load Program Memory Rd  (RAMPZ:Z) None 3 ELPM Rd, Z+ Extended Load Program Memory and PostIncrement Rd Z   (RAMPZ:Z), Z + 1 None 3 SPM Store Program Memory (RAMPZ:Z)  R1:R0 None - Mnemonics Operands Description Operation Flags #Clocks[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 68 8067O–AVR–06/2013 SPM Z+ Store Program Memory and Post-Increment by 2 (RAMPZ:Z) Z   R1:R0, Z + 2 None - IN Rd, A In From I/O Location Rd  I/O(A) None 1 OUT A, Rr Out To I/O Location I/O(A)  Rr None 1 PUSH Rr Push Register on Stack STACK  Rr None 1(1) POP Rd Pop Register from Stack Rd  STACK None 2(1) Bit and Bit-test Instructions LSL Rd Logical Shift Left Rd(n+1) Rd(0) C    Rd(n), 0, Rd(7) Z,C,N,V,H 1 LSR Rd Logical Shift Right Rd(n) Rd(7) C    Rd(n+1), 0, Rd(0) Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0) Rd(n+1) C    C, Rd(n), Rd(7) Z,C,N,V,H 1 ROR Rd Rotate Right Through Carry Rd(7) Rd(n) C    C, Rd(n+1), Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n)  Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)  Rd(7..4) None 1 BSET s Flag Set SREG(s)  1 SREG(s) 1 BCLR s Flag Clear SREG(s)  0 SREG(s) 1 SBI A, b Set Bit in I/O Register I/O(A, b)  1 None 1 CBI A, b Clear Bit in I/O Register I/O(A, b)  0 None 1 BST Rr, b Bit Store from Register to T T  Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b)  T None 1 SEC Set Carry C  1 C 1 CLC Clear Carry C  0 C 1 SEN Set Negative Flag N  1 N 1 CLN Clear Negative Flag N  0 N 1 SEZ Set Zero Flag Z  1 Z 1 CLZ Clear Zero Flag Z  0 Z 1 SEI Global Interrupt Enable I  1 I 1 CLI Global Interrupt Disable I  0 I 1 SES Set Signed Test Flag S  1 S 1 CLS Clear Signed Test Flag S  0 S 1 SEV Set Two’s Complement Overflow V  1 V 1 CLV Clear Two’s Complement Overflow V  0 V 1 SET Set T in SREG T  1 T 1 CLT Clear T in SREG T  0 T 1 SEH Set Half Carry Flag in SREG H  1 H 1 CLH Clear Half Carry Flag in SREG H  0 H 1 Mnemonics Operands Description Operation Flags #Clocks[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 69 8067O–AVR–06/2013 Notes: 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface. 2. One extra cycle must be added when accessing Internal SRAM. MCU Control Instructions BREAK Break (See specific descr. for BREAK) None 1 NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep) None 1 WDR Watchdog Reset (see specific descr. for WDR) None 1 Mnemonics Operands Description Operation Flags #Clocks[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 70 8067O–AVR–06/2013 33. Packaging information 33.1 100A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 100A D 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.17 – 0.27 C 0.09 – 0.20 L 0.45 – 0.75 e 0.50 TYP Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.08 mm maximum. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 71 8067O–AVR–06/2013 33.2 100C1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 100C1, 100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.80 mm Chip Array BGA Package (CBGA) 100C1 A 5/25/06 TOP VIEW SIDE VIEW BOTTOM VIEW COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 1.10 – 1.20 A1 0.30 0.35 0.40 D 8.90 9.00 9.10 E 8.90 9.00 9.10 D1 7.10 7.20 7.30 E1 7.10 7.20 7.30 Øb 0.35 0.40 0.45 e 0.80 TYP Marked A1 Identifier 8 7 6 5 4 3 2 1 A B C D E 9 F G H I J 10 0.90 TYP 0.90 TYP A1 Corner 0.12 Z E D e e Øb A A1 E1 D1[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 72 8067O–AVR–06/2013 33.3 100C2 TITLE GPC DRAWING NO. REV. Package Drawing Contact: packagedrawings@atmel.com CIF A 100C2 100C2, 100-ball (10 x 10 Array), 0.65 mm Pitch, 7.0 x 7.0 x 1.0 mm, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) 12/23/08 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 1.00 A1 0.20 – – A2 0.65 – – D 6.90 7.00 7.10 D1 5.85 BSC E 6.90 7.00 7.10 E1 5.85 BSC b 0.30 0.35 0.40 e 0.65 BSC TOP VIEW SIDE VIEW A1 BALL ID J I H G F E D C B A 12 3 4 5 6 7 8 9 10 A A1 A2 D E 0.10 E1 D1 100 - Ø0.35 ± 0.05 e A1 BALL CORNER BOTTOM VIEW b e[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 73 8067O–AVR–06/2013 34. Electrical Characteristics 34.1 Absolute Maximum Ratings* 34.2 DC Characteristics Table 34-1. Current consumption. Operating Temperature . . . . . . . . . . . -55C to +125C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature . . . . . . . . . . . . . -65C to +150°C Voltage on any Pin with respect to Ground-0.5V to VCC+0.5V Maximum Operating Voltage . . . . . . . . . . . . . . . . 3.6V DC Current per I/O Pin. . . . . . . . . . . . . . . . . . 20.0 mA DC Current VCC and GND Pins . . . . . . . . . . 200.0 mA Symbol Parameter Condition Min Typ Max Units ICC Active mode(1) 1 MHz, Ext. Clk VCC = 1.8V 365 µA VCC = 3.0V 790 2 MHz, Ext. Clk VCC = 1.8V 690 800 VCC = 3.0V 1400 1600 32 MHz, Ext. Clk VCC = 3.0V 18.35 20 mA Idle mode(1) 1 MHz, Ext. Clk VCC = 1.8V 135 µA VCC = 3.0V 255 2 MHz, Ext. Clk VCC = 1.8V 270 380 VCC = 3.0V 510 650 32 MHz, Ext. Clk VCC = 3.0V 8.15 9.2 mA Power-down mode All Functions Disabled VCC = 3.0V 0.1 µA All Functions Disabled, T = 85°C VCC = 3.0V 2 5 ULP, WDT, Sampled BOD VCC = 1.8V 0.5 VCC = 3.0V 0.6 ULP, WDT, Sampled BOD, T=85°C VCC = 3.0V 3 10 Power-save mode RTC 1 kHz from Low Power 32 kHz VCC = 1.8V 0.52 VCC = 3.0V 0.55 µA RTC from Low Power 32 kHz VCC = 3.0V 1.16[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 74 8067O–AVR–06/2013 Note: 1. All Power Reduction Registers set. Typical numbers measured at T = 25°C if nothing else is specified. 2. with no prescaling Module current consumption(2) ICC RC32M 395 µA RC32M w/DFLL Internal 32.768 kHz oscillator as DFLL source TBD RC2M 120 RC2M w/DFLL Internal 32.768 kHz oscillator as DFLL source 155 RC32K 30 PLL Multiplication factor = 10x 195 Watchdog normal mode TBD BOD Continuous mode 120 BOD Sampled mode 1 Internal 1.00 V ref 85 Temperature reference 80 RTC with int. 32 kHz RC as source No prescaling 30 RTC with ULP as source No prescaling 1 ADC 250 kS/s - Int. 1V Ref 3.6 DAC Normal Mode 1000 kS/s, Single channel, Int. 1V Ref 1.8 mA DAC Low-Power Mode 1000 KS/s, Single channel, Int. 1V Ref 1 AC High-speed 220 µA AC Low-power 110 USART Rx and Tx enabled, 9600 BAUD 7.5 DMA 180 Timer/Counter Prescaler DIV1 18 AES 195 Flash/EEPROM Programming Vcc = 2V 20 mA Vcc = 3V 30 Symbol Parameter Condition Min Typ Max Units[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 75 8067O–AVR–06/2013 34.3 Speed Table 34-2. Operating voltage and frequency. The maximum CPU clock frequency of the XMEGA A1 devices is depending on VCC. As shown in Figure 34-1 on page 75 the Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V. Figure 34-1. Maximum Frequency vs. Vcc Symbol Parameter Condition Min Typ Max Units ClkCPU CPU clock frequency VCC = 1.6V 0 12 MHz VCC = 1.8V 0 12 VCC = 2.7V 0 32 VCC = 3.6V 0 32 1.8 12 32 MHz 1.6 2.7 3.6 V Safe Operating Area[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 76 8067O–AVR–06/2013 34.4 Flash and EEPROM Memory Characteristics Table 34-3. Endurance and data retention. Table 34-4. Programming time. Notes: 1. Programming is timed from the internal 2 MHz oscillator. 2. EEPROM is not erased if the EESAVE fuse is programmed. 34.5 ADC Characteristics Table 34-5. ADC characteristics Symbol Parameter Condition Min Typ Max Units Flash Write/Erase cycles 25°C 10K Cycle 85°C 10K Data retention 25°C 100 Year 55°C 25 EEPROM Write/Erase cycles 25°C 80K Cycle 85°C 30K Data retention 25°C 100 Year 55°C 25 Symbol Parameter Condition Min Typ(1) Max Units Chip Erase Flash, EEPROM(2) and SRAM Erase 40 ms Flash Page Erase 4 Page Write 6 Page WriteAutomatic Page Erase and Write 12 EEPROM Page Erase 4 Page Write 6 Page Write Automatic Page Erase and Write 12 Symbol Parameter Condition Min Typ Max Units RES Resolution Programmable: 8/12 8 12 12 Bits INL Integral Non-Linearity 500 kS/s -5 <±1 5 LSB DNL Differential Non-Linearity 500 kS/s < ±0.75 LSB Gain Error ±10 mV Offset Error ±2 mV ADCclk ADC Clock frequency Max is 1/4 of Peripheral Clock VCC2.0V 2000 kHz VCC<2.0V 500[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 77 8067O–AVR–06/2013 Table 34-6. ADC gain stage characteristics. Conversion rate VCC2.0V 2000 ksps VCC<2.0V 500 Conversion time (propagation delay) (RES+2)/2+GAIN RES = 8 or 12, GAIN = 0 or 1 5 7 8 ADCclk cycles Sampling Time 1/2 ADCclk cycle 0.25 µS Conversion range 0 VREF V AVCC Analog Supply Voltage Vcc-0.3 Vcc+0.3 V VREF Reference voltage 1.0 Vcc-0.6 V Input bandwidth VCC2.0V 2000 kHz VCC<2.0V 500 INT1V Internal 1.00V reference 1.00 V INTVCC Internal VCC/1.6 VCC/1.6 V SCALEDVCC Scaled internal VCC/10 input VCC/10 V RAREF Reference input resistance >10 M Start-up time 12 24 ADCclk cycles Internal input sampling speed Temp. sensor, VCC/10, Bandgap 100 ksps Symbol Parameter Condition Min Typ Max Units Gain error 1 to 64 gain < ±1 % Offset error < ±1 mV Vrms Noise level at input 64x gain VREF = Int. 1V 0.12 mV VREF = Ext. 2V 0.06 Clock rate Same as ADC 1000 kHz Symbol Parameter Condition Min Typ Max Units[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 78 8067O–AVR–06/2013 34.6 DAC Characteristics Table 34-7. DAC characteristics. 34.7 Analog Comparator Characteristics Table 34-8. Analog Comparator characteristics. 34.8 Bandgap Characteristics Table 34-9. Bandgap voltage characteristics. Symbol Parameter Condition Min Typ Max Units INL Integral Non-Linearity VCC = 1.6-3.6V VREF = Ext. ref 5 LSB DNL Differential Non-Linearity VCC = 1.6-3.6V VREF = Ext. ref 0.6 <±1 LSB VREF= AVCC 0.6 Fclk Conversion rate 1000 ksps AREF External reference voltage 1.1 AVCC-0.6 V Reference input impedance >10 M Max output voltage Rload=100k AVCC*0.98 V Min output voltage Rload=100k 0.01 V Symbol Parameter Condition Min Typ Max Units Voff Input Offset Voltage VCC = 1.6 - 3.6V <±5 mV Ilk Input Leakage Current VCC = 1.6 - 3.6V < 1000 pA Vhys1 Hysteresis, No VCC = 1.6 - 3.6V 0 mV Vhys2 Hysteresis, Small VCC = 1.6 - 3.6V mode = HS 25 mV Vhys3 Hysteresis, Large VCC = 1.6 - 3.6V mode = HS 50 mV tdelay Propagation delay VCC = 3.0V, T= 85°C mode = HS 100 V ns CC = 1.6 - 3.6V mode = HS 70 VCC = 1.6 - 3.6V mode = LP 140 Symbol Parameter Condition Min Typ Max Units Bandgap startup time As reference for ADC or DAC 1 Clk_PER + 2.5µs µs Bandgap voltage 1.1 V[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 79 8067O–AVR–06/2013 34.9 Brownout Detection Characteristics Table 34-10. Brownout Detection characteristics. Note: 1. BOD is calibrated to BOD level 0 at 85°C, and BOD level 0 is the default level. 34.10 PAD Characteristics Table 34-11. PAD characteristics. ADC/DAC ref T= 85°C, After calibration 0.99 1.01 V 1 Variation over voltage and temperature VCC = 1.6 - 3.6V, T = -40C to 85C ±5 % Symbol Parameter Condition Min Typ Max Units Symbol Parameter Condition Min Typ Max Units BOD level 0 falling Vcc 1.6 V BOD level 1 falling Vcc 1.9 BOD level 2 falling Vcc 2.1 BOD level 3 falling Vcc 2.4 BOD level 4 falling Vcc 2.6 BOD level 5 falling Vcc 2.9 BOD level 6 falling Vcc 3.2 BOD level 7 falling Vcc 3.4 Hysteresis BOD level 0-5 2 % Symbol Parameter Condition Min Typ Max Units VIH Input High Voltage VCC = 2.4 - 3.6V 0.7*VCC VCC+0.5 V VCC = 1.6 - 2.4V 0.8*VCC VCC+0.5 VIL Input Low Voltage VCC = 2.4 - 3.6V -0.5 0.3*VCC V VCC = 1.6 - 2.4V -0.5 0.2*VCC VOL Output Low Voltage GPIO IOL = 15 mA, VCC = 3.3V 0.45 0.76 IOL = 10 mA, VCC = 3.0V 0.3 0.64 V IOL= 5 mA, VCC = 1.8V 0.2 0.46[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 80 8067O–AVR–06/2013 34.11 POR Characteristics Table 34-12. Power-on Reset characteristics. 34.12 Reset Characteristics Table 34-13. Reset characteristics. 34.13 Oscillator Characteristics Table 34-14. Internal 32.768kHz oscillator characteristics. VOH Output High Voltage GPIO IOH = -8 mA, VCC = 3.3V 2.6 3 IOH = -6 mA, VCC = 3.0V 2.1 2.2 V IOH = -2 mA, VCC = 1.8V 1.4 1.6 IIL Input Leakage Current I/O pin <0.001 1 µA IIH Input Leakage Current I/O pin <0.001 1 µA RP I/O pin Pull/Buss keeper Resistor 20 k RRST Reset pin Pull-up Resistor 20 k Input hysteresis 0.5 V Symbol Parameter Condition Min Typ Max Units Symbol Parameter Condition Min Typ Max Units VPOT- POR threshold voltage falling Vcc 1 V VPOT+ POR threshold voltage rising Vcc 1.4 V Symbol Parameter Condition Min Typ Max Units Minimum reset pulse width 90 ns Reset threshold voltage VCC = 2.7 - 3.6V 0.45*VCC V VCC = 1.6 - 2.7V 0.42*VCC Symbol Parameter Condition Min Typ Max Units Accuracy T = 85C, VCC = 3V, After production calibration -0.5 0.5 %[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 81 8067O–AVR–06/2013 Table 34-15. Internal 2MHz oscillator characteristics. Table 34-16. Internal 32MHz oscillator characteristics. Table 34-17. Internal 32kHz, ULP oscillator characteristics. Table 34-18. Maximum load capacitance (CL) and ESR recommendation for 32.768kHz crystal. Table 34-19. Device wake-up time from sleep. Notes: 1. Non-prescaled System Clock source. 2. Time from pin change on external interrupt pin to first available clock cycle. Additional interrupt response time is minimum 5 system clock source cycles. Symbol Parameter Condition Min Typ Max Units Accuracy T = 85C, VCC = 3V, After production calibration -1.5 1.5 % DFLL Calibration step size T = 25C, VCC = 3V 0.175 % Symbol Parameter Condition Min Typ Max Units Accuracy T = 85C, VCC = 3V, After production calibration -1.5 1.5 % DFLL Calibration stepsize T = 25C, VCC = 3V 0.2 % Symbol Parameter Condition Min Typ Max Units Output frequency 32 kHz ULP OSC T = 85C, VCC = 3.0V 26 kHz Crystal CL [pF] Max ESR [k] 6.5 60 9 35 Symbol Parameter Condition(1) Min Typ(2) Max Units Idle Sleep, Standby and Extended Standby sleep mode Int. 32.768 kHz RC 130 µS Int. 2 MHz RC 2 Ext. 2 MHz Clock 2 Int. 32 MHz RC 0.17 Power-save and Power-down Sleep mode Int. 32.768 kHz RC 320 Int. 2 MHz RC 10.3 Ext. 2 MHz Clock 4.5 Int. 32 MHz RC 5.8[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 82 8067O–AVR–06/2013 35. Typical Characteristics 35.1 Active Supply Current Figure 35-1. Active Supply Current vs. Frequency fSYS = 1 - 32 MHz, T = 25°C Figure 35-2. Active Supply Current vs. VCC fSYS = 1.0 MHz 3.3V 3.0V 2.7V 0 5 10 15 20 25 0 4 8 12 16 20 24 28 32 Frequency [MHz] Icc [mA] 1.8V 2.2V 85°C 25°C -40°C 0 200 400 600 800 1000 1200 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Icc [uA][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 83 8067O–AVR–06/2013 35.2 Idle Supply Current Figure 35-3. Idle Supply Current vs. Frequency fSYS = 1 - 32 MHz, T = 25°C Figure 35-4. Active Supply Current vs. VCC fSYS = 1.0 MHz , 3.3V 3.0V 2.7V 0 1 2 3 4 5 6 7 8 9 10 0 4 8 12 16 20 24 28 32 Frequency [MHz] Icc [mA] 1.8V 2.2V 85°C 25°C -40°C 0 50 100 150 200 250 300 350 400 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Icc [uA][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 84 8067O–AVR–06/2013 35.3 Power-down Supply Current Figure 35-5. Power-down Supply Current vs. Temperature 35.4 Power-save Supply Current Figure 35-6. Power-save Supply Current vs. Temperature Sampled BOD, WDT, RTC from ULP enabled 3.3V 3.0V 2.7V 2.2V 1.8V 0 0.5 1 1.5 2 2.5 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] Icc [uA] 3.3V 2.7V 2.2V 1.8V 0 0.5 1 1.5 2 2.5 3 3.5 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] Icc [uA][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 85 8067O–AVR–06/2013 35.5 Pin Pull-up Figure 35-7. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 1.8V Figure 35-8. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 3.0V 85 °C 25 °C -40 °C 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 vreset [V] Ireset [uA] 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 140 160 180 0 0.5 1 1.5 2 2.5 vreset [V] Ireset [uA][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 86 8067O–AVR–06/2013 Figure 35-9. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 3.3V 35.6 Pin Thresholds and Hysteresis Figure 35-10.I/O Pin Input Threshold Voltage vs. VCC VIH - I/O Pin Read as “1” 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 140 160 180 0 0.5 1 1.5 2 2.5 3 vreset [V] Ireset [uA] 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Vthreshold [V][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 87 8067O–AVR–06/2013 Figure 35-11.I/O Pin Input Threshold Voltage vs. VCC VIL - I/O Pin Read as “0” Figure 35-12.I/O Pin Input Hysteresis vs. VCC. 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Vthreshold [V] 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Vthreshold [V][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 88 8067O–AVR–06/2013 Figure 35-13.Reset Input Threshold Voltage vs. VCC VIH - I/O Pin Read as “1” Figure 35-14.Reset Input Threshold Voltage vs. VCC VIL - I/O Pin Read as “0” 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Vthreshold [V] 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Vthreshold [V][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 89 8067O–AVR–06/2013 35.7 Bod Thresholds Figure 35-15.BOD Thresholds vs. Temperature BOD Level = 1.6V Figure 35-16.BOD Thresholds vs. Temperature BOD Level = 2.9V Rising Vcc Falling Vcc 1.602 1.608 1.614 1.62 1.626 1.632 1.638 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] VBOT [V] Rising Vcc Falling Vcc 2.905 2.92 2.935 2.95 2.965 2.98 2.995 3.01 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] VBOT [V][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 90 8067O–AVR–06/2013 35.8 Bandgap Figure 35-17.Internal 1.00V Reference vs. Temperature. 35.9 Analog Comparator Figure 35-18.Analog Comparator Hysteresis vs. VCC High-speed, Small hysteresis 3.0V 1.8V 0.999 0.9995 1 1.0005 1.001 1.0015 1.002 1.0025 1.003 1.0035 1.004 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] VREF [V] 25°C 0 5 10 15 20 25 30 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Hysteresis [mV][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 91 8067O–AVR–06/2013 Figure 35-19.Analog Comparator Hysteresis vs. VCC, High-speed Large hysteresis Figure 35-20.Analog Comparator Propagation Delay vs. VCC High-speed 25°C 0 10 20 30 40 50 60 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Hysteresis [mV] 25°C 0 20 40 60 80 100 120 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Vcc [V] Propagation Delay [ns][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 92 8067O–AVR–06/2013 35.10 Oscillators and Wake-up Time Figure 35-21.Internal 32.768 kHz Oscillator Frequency vs. Temperature 1.024 kHz output Figure 35-22.Ultra Low-Power (ULP) Oscillator Frequency vs. Temperature 1 kHz output p 3.0 V 1.8 V 0.99 0.995 1 1.005 1.01 1.015 1.02 1.025 1.03 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 T [°C] f [kHz] p 3.0 V 1.8 V 0.87 0.88 0.89 0.9 0.91 0.92 0.93 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 T [°C] f1kHz output [kHz][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 93 8067O–AVR–06/2013 Figure 35-23.Internal 2 MHz Oscillator CalA Calibration Step Size T = -40 to 85C, VCC = 3V Figure 35-24.Internal 2 MHz Oscillator CalB Calibration Step Size T = -40 to 85C, VCC = 3V 0 0.001 0.002 0.003 0.004 0.005 0.006 0 20 40 60 80 100 120 140 CALA [LSB] Step size: f [MHz] 0 0.005 0.01 0.015 0.02 0.025 0.03 0.035 0.04 0 10 20 30 40 50 60 70 CALB [LSB] Step size: f [MHz][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 94 8067O–AVR–06/2013 Figure 35-25.Internal 32 MHz Oscillator CalA Calibration Step Size T = -40 to 85C, VCC = 3V Figure 35-26.Internal 32 MHz Oscillator CalB Calibration Step Size T = -40 to 85C, VCC = 3V 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0 20 40 60 80 100 120 140 CALA Step size: f [MHz] 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 10 20 30 40 50 60 70 CALB Step size: f [MHz][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 95 8067O–AVR–06/2013 35.11 PDI Speed Figure 35-27.PDI Speed vs. VCC 25 °C 0 5 10 15 20 25 30 35 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] fMAX [MHz][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 96 8067O–AVR–06/2013 36. Errata 36.1 ATxmega64A1and ATxmega128A1 rev. H  Bandgap voltage input for the ACs can not be changed when used for both ACs simultaneously  VCC voltage scaler for AC is non-linear  The ADC has up to ±2 LSB inaccuracy  ADC gain stage output range is limited to 2.4 V  Sampling speed limited to 500 ksps for supply voltage below 2.0V  ADC Event on compare match non-functional  Bandgap measurement with the ADC is non-functional when VCC is below 2.7V  Accuracy lost on first three samples after switching input to ADC gain stage  The input difference between two succeeding ADC samples is limited by VREF  Increased noise when using internal 1.0V reference at low temperature  Configuration of PGM and CWCM not as described in XMEGA A Manual  PWM is not restarted properly after a fault in cycle-by-cycle mode  BOD will be enabled at any reset  BODACT fuse location is not correct  Sampled BOD in Active mode will cause noise when bandgap is used as reference  DAC has up to ±10 LSB noise in Sampled Mode  DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V  DAC refresh may be blocked in S/H mode  Conversion lost on DAC channel B in event triggered mode  Both DFLLs and both oscillators have to be enabled for one to work  Access error when multiple bus masters are accessing SDRAM  EEPROM page buffer always written when NVM DATA0 is written  Pending full asynchronous pin change interrupts will not wake the device  Pin configuration does not affect Analog Comparator Output  Low level interrupt triggered when pin input is disabled  JTAG enable does not override Analog Comparator B output  NMI Flag for Crystal Oscillator Failure automatically cleared  Flash Power Reduction Mode can not be enabled when entering sleep  Some NVM Commands are non-functional  Crystal start-up time required after power-save even if crystal is source for RTC  Setting PRHIRES bit makes PWM output unavailable  Accessing EBI address space with PREBI set will lock Bus Master  RTC Counter value not correctly read after sleep  Pending asynchronous RTC-interrupts will not wake up device  TWI, the minimum I2C SCL low time could be violated in Master Read mode  TWI address-mask feature is non-functional  TWI, a general address call will match independent of the R/W-bit value  TWI Transmit collision flag not cleared on repeated start  Clearing TWI Stop Interrupt Flag may lock the bus[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 97 8067O–AVR–06/2013  TWI START condition at bus timeout will cause transaction to be dropped  TWI Data Interrupt Flag erroneously read as set  WDR instruction inside closed window will not issue reset 1. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input for another AC, the first comparator will be affected for up to 1 µs and could potentially give a wrong comparison result. Problem fix/Workaround If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling any of them. 2. VCC voltage scaler for AC is non-linear The 6-bit VCC voltage scaler in the Analog Comparators is non-linear. Figure 36-1. Analog Comparator Voltage Scaler vs. Scalefac T = 25°C Problem fix/Workaround Use external voltage input for the analog comparator if accurate voltage levels are needed 3. The ADC has up to ±2 LSB inaccuracy The ADC will have up to ±2 LSB inaccuracy, visible as a saw-tooth pattern on the input voltage/ output value transfer function of the ADC. The inaccuracy increases with increasing voltage reference reaching ±2 LSB with 3V reference. 3.3 V 2.7 V 1.8 V 0 0.5 1 1.5 2 2.5 3 3.5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 SCALEFAC VSCALE [V][Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 98 8067O–AVR–06/2013 Problem fix/Workaround None, the actual ADC resolution will be reduced with up to ±2 LSB. 4. ADC gain stage output range is limited to 2.4 V The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give correct output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of: Problem fix/Workaround Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep ADC voltage reference below 2.4 V. 5. Sampling speed limited to 500 ksps for supply voltage below 2.0V The sampling frequency is limited to 500 ksps for supply voltage below 2.0V. At higher sampling rate the INL error will be several hundred LSB. Problem fix/Workaround None. 6. ADC Event on compare match non-functional ADC signalling event will be given at every conversion complete even if Interrupt mode (INTMODE) is set to BELOW or ABOVE. Problem fix/Workaround Enable and use interrupt on compare match when using the compare function. 7. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V The ADC can not be used to do bandgap measurements when VCC is below 2.7V. Problem fix/Workaround – 1x gain: 2.4 V – 2x gain: 1.2 V – 4x gain: 0.6 V – 8x gain: 300 mV – 16x gain: 150 mV – 32x gain: 75 mV – 64x gain: 38 mV[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 99 8067O–AVR–06/2013 None. 8. Accuracy lost on first three samples after switching input to ADC gain stage Due to memory effect in the ADC gain stage, the first three samples after changing input channel must be disregarded to achieve 12-bit accuracy. Problem fix/Workaround Run three ADC conversions and discard these results after changing input channels to ADC gain stage. 9. The input difference between two succeeding ADC samples is limited by VREF If the difference in input between two samples changes more than the size of the reference, the ADC will not be able to convert the data correctly. Two conversions will be required before the conversion is correct. Problem fix/Workaround Discard the first conversion if input is changed more than VREF, or ensure that the input never changes more then VREF. 10. Increased noise when using internal 1.0V reference at low temperature When operating at below 0C and using internal 1.0V reference the RMS noise will be up 4 LSB, Peak-to-peak noise up to 25 LSB. Problem fix/Workaround Use averaging to remove noise. 11. Configuration of PGM and CWCM not as described in XMEGA A Manual Enabling Common Waveform Channel Mode will enable Pattern generation mode (PGM), but not Common Waveform Channel Mode. Enabling Pattern Generation Mode (PGM) and not Common Waveform Channel Mode (CWCM) will enable both Pattern Generation Mode and Common Waveform Channel Mode. Problem fix/Workaround 12 PWM is not restarted properly after a fault in cycle-by-cycle mode When the AWeX fault restore mode is set to cycle-by-cycle, the waveform output will not return to normal operation at first update after fault condition is no longer present. PGM CWCM Description 0 0 PGM and CWCM disabled 0 1 PGM enabled 1 0 PGM and CWCM enabled 1 1 PGM enabled[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 100 8067O–AVR–06/2013 Problem fix/Workaround Do a write to any AWeX I/O register to re-enable the output. 13. BOD will be enabled after any reset If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the programmed BOD level even if the BOD is disabled. Problem fix/Workaround Do not set the BOD level higher than VCC even if the BOD is not used. 14. BODACT fuse location is not correct The fuses for enabling BOD in active mode (BODACT) are located at FUSEBYTE2, bit 2 and 3 and not in FUSEBYTE 5 as described in the XMEGA A Manual. Problem fix/Workaround Access the fuses in FUSEBYTE2. 15. Sampled BOD in Active mode will cause noise when bandgap is used as reference Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap reference for ADC, DAC and Analog Comparator. Problem fix/Workaround If the bandgap is used as reference for either the ADC, DAC or Analog Comparator, the BOD must not be set in sampled mode. 16. DAC has up to ±10 LSB noise in Sampled Mode The DAC has noise of up to ±10 LSB in Sampled Mode for entire operation range. Problem fix/Workaround Use the DAC in continuous mode. 17. DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V Using the DAC with a reference voltage above 2.4V or VCC - 0.6V will give inaccurate output when converting codes that give below 0.75V output:  ±10 LSB for continuous mode  ±200 LSB for Sample and Hold mode Problem fix/Workaround None.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 101 8067O–AVR–06/2013 18. DAC has up to ±10 LSB noise in Sampled Mode If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate (i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second channel. Problem fix/Workaround When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or ensure that the conversion rate of both channels is high enough to not require refresh. 19. Conversion lost on DAC channel B in event triggered mode If during dual channel operation channel 1 is set in auto trigged conversion mode, channel 1 conversions are occasionally lost. This means that not all data-values written to the Channel 1 data register are converted. Problem fix/Workaround Keep the DAC conversion interval in the range 000-001 (1 and 3 CLK), and limit the Peripheral clock frequency so the conversion internal never is shorter than 1.5 µs. 20. Both DFLLs and both oscillators have to be enabled for one to work In order to use the automatic runtime calibration for the 2 MHz or the 32 MHz internal oscillators, the DFLL for both oscillators and both oscillators have to be enabled for one to work. Problem fix/Workaround Enable both DFLLs and both oscillators when using automatic runtime calibration for either of the internal oscillators. 21. Access error when multiple bus masters are accessing SDRAM If one bus master (CPU and DMA channels) is using the EBI to access an SDRAM in burst mode and another bus master is accessing the same row number in a different BANK of the SDRAM in the cycle directly after the burst access is complete, the access for the second bus master will fail. Problem fix/Workaround Do not put stack pointer in SDRAM and use DMA Controller in 1 byte burst mode if CPU and DMA Controller are required to access SDRAM at the same time. 22. EEPROM page buffer always written when NVM DATA0 is written If the EEPROM is memory mapped, writing to NVM DATA0 will corrupt data in the EEPROM page buffer. Problem fix/Workaround Before writing to NVM DATA0, for example when doing software CRC or flash page buffer write, check if EEPROM page buffer active loading flag (EELOAD) is set. Do not write NVM DATA0 when EELOAD is set. 23. Pending full asynchronous pin change interrupts will not wake the device[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 102 8067O–AVR–06/2013 Any full asynchronous pin-change Interrupt from pin 2, on any port, that is pending when the sleep instruction is executed, will be ignored until the device is woken from another source or the source triggers again. This applies when entering all sleep modes where the System Clock is stopped. Problem fix/Workaround None. 24. Pin configuration does not affect Analog Comparator Output The Output/Pull and inverted pin configuration does not affect the Analog Comparator output function. Problem fix/Workaround None for Output/Pull configuration. For inverted I/O, configure the Analog Comparator to give an inverted result (i.e. connect positive input to the negative AC input and vice versa), or use and external inverter to change polarity of Analog Comparator output. 25. Low level interrupt triggered when pin input is disabled If a pin input is disabled, but pin is configured to trigger on low level, interrupt request will be sent. Problem fix/Workaround Ensure that Interrupt mask for the disabled pin is cleared. 26. JTAG enable does not override Analog Comparator B output When JTAG is enabled this will not override the Analog Comparator B (ACB) output, AC0OUT on pin 7 if this is enabled. Problem fix/Workaround Use Analog Comparator output for ACA when JTAG is used, or use the PDI as debug interface. 27. NMI Flag for Crystal Oscillator Failure automatically cleared NMI flag for Crystal Oscillator Failure (XOSCFDIF) will be automatically cleared when executing the NMI interrupt handler. Problem fix/Workaround This device revision has only one NMI interrupt source, so checking the interrupt source in software is not required. 28. Flash Power Reduction Mode can not be enabled when entering sleep If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 103 8067O–AVR–06/2013 Problem fix/Workaround Disable Flash Power Reduction mode before entering sleep mode. 29. Some NVM Commands are non-functional The following NVM commands are non-functional: Problem fix/Workaround None for Flash Range CRC Use separate programming commands for accessing application and boot section. 30. Crystal start-up time required after power-save even if crystal is source for RTC Even if 32.768 kHz crystal is used for RTC during sleep, the clock from the crystal will not be ready for the system before the specified start-up time. See "XOSCSEL[3:0]: Crystal Oscillator Selection" in XMEGA A Manual. If BOD is used in active mode, the BOD will be on during this period (0.5s). Problem fix/Workaround If faster start-up is required, go to sleep with internal oscillator as system clock. 31. Setting PRHIRES bit makes PWM output unavailable Setting the HIRES Power Reduction (PR) bit for PORTx will make any Frequency or PWM output for the corresponding Timer/Counters (TCx0 and TCx1) unavailable on the pin even if the Hi-Res is not used. Problem fix/Workaround Do not write the HIRES PR bit on PORTx when frequency or PWM output from TCx0/1 is used. – 0x2B Erase Flash Page – 0x2E Write Flash Page – 0x2F Erase & Write Flash Page – 0x3A Flash Range CRC – 0x22 Erase Application Section Page – 0x24 Write Application Section Page – 0x25 Erase & Write Application Section Page – 0x2A Erase Boot Loader Section Page – 0x2C Write Boot Loader Section Page – 0x2D Erase & Write Boot Loader Section Page[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 104 8067O–AVR–06/2013 32. Accessing EBI address space with PREBI set will lock Bus Master If EBI Power Reduction Bit is set while EBI is enabled, accessing external memory could result in bus hang-up, blocking all further access to all data memory. Problem fix/Workaround Ensure that EBI is disabled before setting EBI Power Reduction bit. 33. RTC Counter value not correctly read after sleep If the RTC is set to wake up the device on RTC Overflow and bit 0 of RTC CNT is identical to bit 0 of RTC PER as the device is entering sleep, the value in the RTC count register can not be read correctly within the first prescaled RTC clock cycle after wakeup. The value read will be the same as the value in the register when entering sleep. The same applies if RTC Compare Match is used as wake-up source. Problem fix/Workaround Wait at least one prescaled RTC clock cycle before reading the RTC CNT value. 34. Pending asynchronous RTC-interrupts will not wake up device Asynchronous Interrupts from the Real-Time-Counter that is pending when the sleep instruction is executed, will be ignored until the device is woken from another source or the source triggers again. Problem fix/Workaround None. 35. TWI, the minimum I2 C SCL low time could be violated in Master Read mode If the TWI is in Master Read mode and issues a Repeated Start on the bus, this will immediately release the SCL line even if one complete SCL low period has not passed. This means that the minimum SCL low time in the I2C specification could be violated. Problem fix/Workaround If this is a problem in the application, ensure in software that the Repeated Start is never issued before one SCL low time has passed. 36. TWI address-mask feature is non-functional The address-mask feature is non-functional, so the TWI can not perform hardware address match on more than one address. Problem fix/Workaround If the TWI must respond to multiple addresses, enable Promiscuous Mode for the TWI to respond to all address and implement the address-mask function in software.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 105 8067O–AVR–06/2013 37. TWI, a general address call will match independent of the R/W-bit value When the TWI is in Slave mode and a general address call is issued on the bus, the TWI Slave will get an address match regardless of the received R/W bit. Problem fix/Workaround Use software to check the R/W-bit on general call address match. 38. TWI Transmit collision flag not cleared on repeated start The TWI transmit collision flag should be automatically cleared on start and repeated start, but is only cleared on start. Problem fix/Workaround Clear the flag in software after address interrupt. 39. Clearing TWI Stop Interrupt Flag may lock the bus If software clears the STOP Interrupt Flag (APIF) on the same Peripheral Clock cycle as the hardware sets this flag due to a new address received, CLKHOLD is not cleared and the SCL line is not released. This will lock the bus. Problem fix/Workaround Check if the bus state is IDLE. If this is the case, it is safe to clear APIF. If the bus state is not IDLE, wait for the SCL pin to be low before clearing APIF. Code: /* Only clear the interrupt flag if within a "safe zone". */ while ( /* Bus not IDLE: */ ((COMMS_TWI.MASTER.STATUS & TWI_MASTER_BUSSTATE_gm) != TWI_MASTER_BUSSTATE_IDLE_gc)) && /* SCL not held by slave: */ !(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm) ) { /* Ensure that the SCL line is low */ if ( !(COMMS_PORT.IN & PIN1_bm) ) if ( !(COMMS_PORT.IN & PIN1_bm) ) break; } /* Check for an pending address match interrupt */ if ( !(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm) ) { /* Safely clear interrupt flag */ COMMS_TWI.SLAVE.STATUS |= (uint8_t)TWI_SLAVE_APIF_bm; }[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 106 8067O–AVR–06/2013 40. TWI START condition at bus timeout will cause transaction to be dropped If Bus Timeout is enabled and a timeout occurs on the same Peripheral Clock cycle as a START is detected, the transaction will be dropped. Problem fix/Workaround None. 41. TWI Data Interrupt Flag erroneously read as set When issuing the TWI slave response command CMD=0b11, it takes 1 Peripheral Clock cycle to clear the data interrupt flag (DIF). A read of DIF directly after issuing the command will show the DIF still set. Problem fix/Workaround Add one NOP instruction before checking DIF. 42. WDR instruction inside closed window will not issue reset When a WDR instruction is execute within one ULP clock cycle after updating the window control register, the counter can be cleared without giving a system reset. Problem fix/Workaround Wait at least one ULP clock cycle before executing a WDR instruction.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 107 8067O–AVR–06/2013 36.2 ATxmega64A1 and ATxmega128A1 rev. G  Bootloader Section in Flash is non-functional  Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously  DAC is nonlinear and inaccurate when reference is above 2.4V  ADC gain stage output range is limited to 2.4 V  The ADC has up to ±2 LSB inaccuracy  TWI, a general address call will match independent of the R/W-bit value  TWI, the minimum I2 C SCL low time could be violated in Master Read mode  Setting HIRES PR bit makes PWM output unavailable  EEPROM erase and write does not work with all System Clock sources  BOD will be enabled after any reset  Propagation delay analog Comparator increasing to 2 ms at -40C  Sampled BOD in Active mode will cause noise when bandgap is used as reference  Default setting for SDRAM refresh period too low  Flash Power Reduction Mode can not be enabled when entering sleep mode  Enabling Analog Comparator B output will cause JTAG failure  JTAG enable does not override Analog Comparator B output  Bandgap measurement with the ADC is non-functional when VCC is below 2.7V  DAC refresh may be blocked in S/H mode  Inverted I/O enable does not affect Analog Comparator Output  Both DFLLs and both oscillators has to be enabled for one to work 1. Bootloader Section in Flash is non-functional The Bootloader Section is non-functional, and bootloader or application code cannot reside in this part of the Flash. Problem fix/Workaround None, do not use the Bootloader Section. 2. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input for the another AC, the first comparator will be affected for up to 1 us and could potentially give a wrong comparison result. Problem fix/Workaround If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling any of them. 3. DAC is nonlinear and inaccurate when reference is above 2.4V Using the DAC with a reference voltage above 2.4V give inaccurate output when converting codes that give below 0.75V output:  ±20 LSB for continuous mode[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 108 8067O–AVR–06/2013  ±200 LSB for Sample and Hold mode Problem fix/Workaround None, avoid using a voltage reference above 2.4V. 4. ADC gain stage output range is limited to 2.4 V The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give correct output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of: Problem fix/Workaround Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep ADC voltage reference below 2.4 V. 5. The ADC has up to ±2 LSB inaccuracy The ADC will have up to ±2 LSB inaccuracy, visible as a saw-tooth pattern on the input voltage/ output value transfer function of the ADC. The inaccuracy increases with increasing voltage reference reaching ±2 LSB with 3V reference. Problem fix/Workaround None, the actual ADC resolution will be reduced with up to ±2 LSB. 6. TWI, a general address call will match independent of the R/W-bit value When the TWI is in Slave mode and a general address call is issued on the bus, the TWI Slave will get an address match regardless of the R/W-bit (ADDR[0] bit) value in the Slave Address Register. Problem fix/Workaround Use software to check the R/W-bit on general call address match. – 1x gain: 2.4 V – 2x gain: 1.2 V – 4x gain: 0.6 V – 8x gain: 300 mV – 16x gain: 150 mV – 32x gain: 75 mV – 64x gain: 38 mV[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 109 8067O–AVR–06/2013 7. TWI, the minimum I2 C SCL low time could be violated in Master Read mode When the TWI is in Master Read mode and issuing a Repeated Start on the bus, this will immediately release the SCL line even if one complete SCL low period has not passed. This means that the minimum SCL low time in the I 2 C specification could be violated. Problem fix/Workaround If this causes a potential problem in the application, software must ensure that the Repeated Start is never issued before one SCL low time has passed. 8. Setting HIRES PR bit makes PWM output unavailable Setting the HIRES Power Reduction (PR) bit for PORTx will make any Frequency or PWM output for the corresponding Timer/Counters (TCx0 and TCx1) unavailable on the pin. Problem fix/Workaround Do not write the HIRES PR bit on PORTx when frequency or PWM output from TCx0/1 is used. 9. EEPROM erase and write does not work with all System Clock sources When doing EEPROM erase or Write operations with other clock sources than the 2 MHz RCOSC, Flash will be read wrongly for one or two clock cycles at the end of the EEPROM operation. Problem fix/Workaround Alt 1: Use the internal 2 MHz RCOSC when doing erase or write operations on EEPROM. Alt 2: Ensure to be in sleep mode while completing erase or write on EEPROM. After starting erase or write operations on EEPROM, other interrupts should be disabled and the device put to sleep. 10. BOD will be enabled after any reset If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the programmed BOD level even if the BOD is disabled. Problem fix/Workaround Do not set the BOD level higher than VCC even if the BOD is not used. 11. Propagation delay analog Comparator increasing to 2 ms at -40 °C When the analog comparator is used at temperatures reaching down to -40 °C, the propagation delay will increase to ~2 ms. Problem fix/Workaround None[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 110 8067O–AVR–06/2013 12. Sampled BOD in Active mode will cause noise when bandgap is used as reference Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap reference for ADC and DAC. Problem fix/Workaround If the bandgap is used as reference for either the ADC or the DAC, the BOD must not be set in sampled mode. 13. Default setting for SDRAM refresh period too low If the SDRAM refresh period is set to a value less then 0x20, the SDRAM content may be corrupted when accessing through On-Chip Debug sessions. Problem fix/Workaround The SDRAM refresh period (REFRESHH/L) should not be set to a value less then 0x20. 14. Flash Power Reduction Mode can not be enabled when entering sleep mode If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles. Problem fix/Workaround Disable Flash Power Reduction mode before entering sleep mode. 15. JTAG enable does not override Analog Comparator B output When JTAG is enabled this will not override the Anlog Comparator B (ACB)ouput, AC0OUT on pin 7 if this is enabled. Problem fix/Workaround AC0OUT for ACB should not be enabled when JTAG is used. Use only analog comparator output for ACA when JTAG is used, or use the PDI as debug interface. 16. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V The ADC cannot be used to do bandgap measurements when VCC is below 2.7V. Problem fix/Workaround If internal voltages must be measured when VCC is below 2.7V, measure the internal 1.00V reference instead of the bandgap.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 111 8067O–AVR–06/2013 17. DAC refresh may be blocked in S/H mode If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate (i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second channel. Problem fix/Workarund When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or ensure that the conversion rate of both channels is high enough to not require refresh. 18. Inverted I/O enable does not affect Analog Comparator Output The inverted I/O pin function does not affect the Analog Comparator output function. Problem fix/Workarund Configure the analog comparator setup to give a inverted result (i.e. connect positive input to the negative AC input and vice versa), or use and externel inverter to change polarity of Analog Comparator Output. 19. Both DFLLs and both oscillators has to be enabled for one to work In order to use the automatic runtime calibration for the 2 MHz or the 32 MHz internal oscilla-tors, the DFLL for both oscillators and both oscillators has to be enabled for one to work. Problem fix/Workarund Enabled both DFLLs and oscillators when using automatic runtime calibration for one of the internal oscillators. [Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 112 8067O–AVR–06/2013 37. Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. 37.1 8067O – 06/2013 37.2 8067N – 03/2013 37.3 8067M – 09/2010 37.4 8067L – 08/2010 1. Not recommended for new designs - Use XMEGA A1U series. 1. Removed all references to ATxmega192A1, ATxmega256A1 and ATxmega384A1. 2. Updated module description. Based on the XMEGA A1U device datasheet. 3. Updated analog comparator (AC) overview, Figure 28-1 on page 53. 4. Updated “ADC Characteristics” on page 76. 5 Updated page erase time in “Flash and EEPROM Memory Characteristics” on page 76. 6 Updated Output low voltage conditions from IOH to IOL in “PAD Characteristics” on page 79. 7. Removed TBDs from: “DC Characteristics” on page 73. “DAC Characteristics” on page 78. “Bandgap Characteristics” on page 78. 8. Updated “Errata” on page 96 to be valid for both ATxmega64A1 and ATxmega128A1. 9. Removed Boundary Scan Order table. 1. Updated Errata “ATxmega64A1and ATxmega128A1 rev. H” on page 96 1. Removed Footnote 3 of Figure 2-1 on page 3 2. Updated “Features” on page 32. Event Channel 0 output on port pin 7 3. Updated “DC Characteristics” on page 73, by adding ICC for Flash/EEPROM Programming. 4. Added AVCC in “ADC Characteristics” on page 76. 5. Updated Start up time in “ADC Characteristics” on page 76. [Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 113 8067O–AVR–06/2013 37.5 8067K – 02/2010 37.6 8067J – 02/2010 37.7 8067I – 04/2009 37.8 8067H – 04/2009 6. Updated “DAC Characteristics” on page 78. Removed DC output impedance. 7. Fixed typo in “Packaging information” section. 8. Fixed typo in “Errata” section. 1. Added “PDI Speed vs. VCC” on page 95. 1. Removed JTAG Reset from the datasheet. 2. Updated “Timer/Counter and AWEX functions” on page 56. 3. Updated “Alternate Pin Functions” on page 58. 3. Updated all “Electrical Characteristics” on page 73. 4. Updated “PAD Characteristics” on page 79. 5. Changed Internal Oscillator Speed to “Oscillators and Wake-up Time” on page 92. 6. Updated “Errata” on page 96 1. Updated “Ordering Information” on page 2. 2. Updated “PAD Characteristics” on page 79. 1. Editorial updates. 2. Updated “Overview” on page 54. 3. Updated Table 29-9 on page 54. 4. Updated “Peripheral Module Address Map” on page 62. IRCOM has address map: 0x08F8. 5. Updated “Electrical Characteristics” on page 73. 6. Updated “PAD Characteristics” on page 79. 7. Updated “Typical Characteristics” on page 82.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 114 8067O–AVR–06/2013 37.9 8067G – 11/2008 37.10 8067F – 09/2008 37.11 8067E – 08/2008 37.12 8067D – 07/2008 1. Updated “Block Diagram” on page 6. 2. Updated feature list in “Memories” on page 12. 3. Updated “Programming and Debugging” on page 54. 4. Updated “Peripheral Module Address Map” on page 62. IRCOM has address 0x8F0. 5. Added “Electrical Characteristics” on page 73. 6. Added “Typical Characteristics” on page 82. 7. Added “ATxmega64A1and ATxmega128A1 rev. H” on page 96. 8. Updated “ATxmega64A1 and ATxmega128A1 rev. G” on page 107. 1. Updated “Features” on page 1 2. Updated “Ordering Information” on page 2 3. Updated Figure 7-1 on page 11 and Figure 7-2 on page 11. 4. Updated Table 7-2 on page 15. 5. Updated “Features” on page 48 and “Overview” on page 48. 6. Removed “Interrupt Vector Summary” section from datasheet. 1. Changed Figure 2-1’s title to “Block diagram and pinout” on page 3. 2. Updated Figure 2-2 on page 4. 3. Updated Table 29-2 on page 51 and Table 29-3 on page 52. 1. Updated “Ordering Information” on page 2. 2. Updated “Peripheral Module Address Map” on page 62. 3. Inserted “Interrupt Vector Summary” on page 56.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 115 8067O–AVR–06/2013 37.13 8067C – 06/2008 37.14 8067B – 05/2008 37.15 8067A – 02/2008 1. Updated the Front page and “Features” on page 1. 2. Updated the “DC Characteristics” on page 73. 3. Updated Figure 3-1 on page 6. 4. Added “Flash and EEPROM Page Size” on page 15. 5. Updated Table 33-6 on page 72 with new data: Gain Error, Offset Error and Signal -to-Noise Ratio (SNR). 6. Updated Errata “ATxmega64A1 and ATxmega128A1 rev. G” on page 107. 1. Updated “Pinout/Block Diagram” on page 3 and “Pinout and Pin Functions” on page 55. 2. Added XMEGA A1 Block Diagram, Figure 3-1 on page 6. 3. Updated “Overview” on page 5 included the XMEGA A1 explanation text on page 6. 4. Updated AVR CPU “Features” on page 8. 5. Updated Event System block diagram, Figure 10-1 on page 20. 6. Updated “Interrupts and Programmable Multilevel Interrupt Controller” on page 29. 7. Updated “AC - Analog Comparator” on page 52. 8. Updated “Alternate Pin Function Description” on page 55. 9. Updated “Alternate Pin Functions” on page 58. 10. Updated “Typical Characteristics” on page 82. 11. Updated “Ordering Information” on page 2. 12. Updated “Overview” on page 5. 13. Updated Figure 6-1 on page 8. 14. Inserted a new Figure 16-1 on page 37. 15. Updated Speed grades in “Speed” on page 75. 16. Added a new ATxmega384A1 device in “Features” on page 1, updated “Ordering Information” on page 2 and “Memories” on page 12. 17. Replaced the Figure 3-1 on page 6 by a new XMEGA A1 detailed block diagram. 18. Inserted Errata “ATxmega64A1 and ATxmega128A1 rev. G” on page 107. 1. Initial revision.[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 116 8067O–AVR–06/2013[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 1 8067O–AVR–06/2013 Table of Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Pinout/Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 Recommended reading. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Capacitive touch sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6. Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7. AVR CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.3 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.4 ALU - Arithmetic Logic Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.5 Program Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.6 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.7 Register File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8. Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.3 In-System Programmable Flash Program Memory. . . . . . . . . . . . . . . . . . . . . 13 8.4 Fuses and Lock bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.5 Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.6 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.7 I/O Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.8 External Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.9 Data Memory and Bus Arbitration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.10 Memory Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 8.11 Device ID and Revision. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 8.12 I/O Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 8.13 JTAG Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 8.14 Flash and EEPROM Page Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9. DMAC - Direct Memory Access Controller . . . . . . . . . . . . . . . . . . . . 18 9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10. Event System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 10.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 11. System Clock and Clock options . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 2 8067O–AVR–06/2013 11.3 Clock Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 12. Power Management and Sleep Modes . . . . . . . . . . . . . . . . . . . . . . 24 12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 12.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 12.3 Sleep Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 13. System Control and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 13.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 13.3 Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 13.4 Reset Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 13.5 WDT - Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 13.6 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 14. Interrupts and Programmable Multilevel Interrupt Controller . . . . . . 29 14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 14.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 14.3 Interrupt vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 15. I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 15.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 15.3 Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 15.4 Input sensing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.5 Port Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.6 Alternate Port Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 16. T/C - 16-bit Timer/Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 16.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 17. AWeX - Advanced Waveform Extension . . . . . . . . . . . . . . . . . . . . . 38 17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 17.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 18. Hi-Res - High Resolution Extension . . . . . . . . . . . . . . . . . . . . . . . . . 39 18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 18.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 19. RTC - 16-bit Real-Time Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 19.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 20. TWI - Two-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 20.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 21. SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 21.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 22. USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 3 8067O–AVR–06/2013 22.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 22.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 23. IRCOM - IR Communication Module . . . . . . . . . . . . . . . . . . . . . . . . 45 23.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 23.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 24. AES and DES Crypto Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 24.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 24.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 25. EBI – External Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 25.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 25.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 26. ADC - 12-bit Analog to Digital Converter . . . . . . . . . . . . . . . . . . . . . 48 26.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 26.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 27. DAC - 12-bit Digital to Analog Converter . . . . . . . . . . . . . . . . . . . . . 50 27.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 27.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 28. AC - Analog Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 28.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 28.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 29. Programming and Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 29.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 29.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 30. Pinout and Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 30.1 Alternate Pin Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 30.2 Alternate Pin Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 31. Peripheral Module Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 32. Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 33. Packaging information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 33.1 100A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 33.2 100C1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 33.3 100C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 34. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 34.1 Absolute Maximum Ratings*. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 34.2 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 34.3 Speed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 34.4 Flash and EEPROM Memory Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 76 34.5 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 34.6 DAC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 34.7 Analog Comparator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 34.8 Bandgap Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 34.9 Brownout Detection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 4 8067O–AVR–06/2013 34.10 PAD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 34.11 POR Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 34.12 Reset Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 34.13 Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 35. Typical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 35.1 Active Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 35.2 Idle Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 35.3 Power-down Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 35.4 Power-save Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 35.5 Pin Pull-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 35.6 Pin Thresholds and Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 35.7 Bod Thresholds. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 35.8 Bandgap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 35.9 Analog Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 35.10 Oscillators and Wake-up Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 35.11 PDI Speed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 36. Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 36.1 ATxmega64A1and ATxmega128A1 rev. H. . . . . . . . . . . . . . . . . . . . . . . . . . . 96 36.2 ATxmega64A1 and ATxmega128A1 rev. G . . . . . . . . . . . . . . . . . . . . . . . . . 107 37. Datasheet Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 37.1 8067O – 06/2013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 37.2 8067N – 03/2013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 37.3 8067M – 09/2010 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 37.4 8067L – 08/2010 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 37.5 8067K – 02/2010. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 37.6 8067J – 02/2010 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 37.7 8067I – 04/2009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 37.8 8067H – 04/2009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 37.9 8067G – 11/2008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 37.10 8067F – 09/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 37.11 8067E – 08/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 37.12 8067D – 07/2008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 37.13 8067C – 06/2008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 37.14 8067B – 05/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 37.15 8067A – 02/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET] 5 8067O–AVR–06/2013Atmel Corporation 1600 Technology Drive San Jose, CA 95110 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Roa Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan G.K. 16F Shin-Osaki Kangyo Bldg 1-6-4 Osaki, Shinagawa-ku Tokyo 141-0032 JAPAN Tel: (+81) (3) 6417-0300 Fax: (+81) (3) 6417-0370 © 2013 Atmel Corporation. All rights reserved. / Rev.: 8067O–AVR–06/2013 Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 USER GUIDE Atmel SAM4S Xplained Pro Preface The Atmel® SAM4S Xplained Pro evaluation kit is a hardware platform to evaluate the ATSAM4SD32C microcontroller. Supported by the Atmel Studio integrated development platform, the kit provides easy access to the features of the Atmel ATSAM4SD32C and explains how to integrate the device in a custom design. The Xplained Pro MCU series evaluation kits include an on-board Embedded Debugger, and no external tools are necessary to program or debug the ATSAM4SD32C. The Xplained Pro extension series evaluation kits offers additional peripherals to extend the features of the board and ease the development of custom designs.Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 2 Table of Contents Preface .......................................................................................... 1 1. Introduction .............................................................................. 3 1.1. Features .............................................................................. 3 1.2. Kit overview ......................................................................... 3 2. Getting started ......................................................................... 5 2.1. Quick-start ........................................................................... 5 2.2. Connecting the kit ................................................................. 5 2.3. Design documentation and related links ..................................... 5 3. Xplained Pro ............................................................................ 6 3.1. Embedded Debugger ............................................................. 6 3.2. Hardware identification system ................................................. 6 3.3. Power supply ....................................................................... 7 3.3.1. Measuring SAM4S power consumption ......................... 7 3.4. Standard headers and connectors ............................................ 7 3.4.1. Xplained Pro extension header .................................... 7 3.4.2. Xplained Pro LCD connector ....................................... 8 3.4.3. Power header ......................................................... 10 4. Hardware user guide ............................................................ 11 4.1. Connectors ......................................................................... 11 4.1.1. I/O extension headers .............................................. 11 4.1.2. LCD extension connector .......................................... 12 4.1.3. Other headers ........................................................ 14 4.2. Peripherals ......................................................................... 14 4.2.1. NAND Flash ........................................................... 14 4.2.2. SD Card connector .................................................. 15 4.2.3. Crystals ................................................................. 15 4.2.4. Mechanical buttons .................................................. 16 4.2.5. LED ...................................................................... 16 4.2.6. Analog reference ..................................................... 16 4.3. Embedded Debugger implementation ...................................... 16 4.3.1. Serial Wire Debug ................................................... 16 4.3.2. Virtual COM port ..................................................... 16 4.3.3. Atmel Data Gateway Interface ................................... 17 5. Hardware revision history and known issues ........................ 18 5.1. Identifying product ID and revision .......................................... 18 5.2. Revision 5 .......................................................................... 18 5.3. Revision 4 .......................................................................... 18 6. Document revision history ..................................................... 19 7. Evaluation board/kit important notice .................................... 20Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 3 1. Introduction 1.1 Features ● Atmel ATSAM4SD32C microcontroller ● Embedded debugger (EDBG) ● USB interface ● Programming and debugging (target) through Serial Wire Debug (SWD) ● Virtual COM-port interface to target via UART ● Atmel Data Gateway Interface (DGI) to target via synchronous SPI or TWI ● Four GPIOs connected to target for code instrumentation ● Digital I/O ● Two mechanical buttons (user and reset button) ● One user LED ● Three extension headers ● LCD display header ● USB interface for host and device function (target) ● 2Gb NAND Flash for non-volatile storage ● SD card connector ● Adjustable analog reference ● Three possible power sources ● External power ● Embedded debugger USB ● Target USB ● 12MHz crystal ● 32kHz crystal 1.2 Kit overview The Atmel SAM4S Xplained Pro evaluation kit is a hardware platform to evaluate the Atmel ATSAM4SD32C. The kit offers a set of features that enables the ATSAM4SD32C user to get started using the ATSAM4SD32C peripherals right away and to get an understanding of how to integrate the device in their own design.Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 4 Figure 1.1. SAM4S Xplained Pro evaluation kit overviewAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 5 2. Getting started 2.1 Quick-start 3 Steps to start exploring the Atmel Xplained Pro Platform ● Download and install Atmel Studio1 . ● Launch Atmel Studio. ● Connect an USB cable to the DEBUG USB port. 2.2 Connecting the kit When connecting Atmel SAM4S Xplained Pro to your computer for the first time, the operating system will do a driver software installation. The driver file supports both 32-bit and 64-bit versions of Microsoft® Windows® XP and Windows 7. Once connected the green power LED will be lit and Atmel Studio will autodetect which Xplained Pro evaluation- and extension kit(s) that's connected. You'll be presented with relevant information like datasheets and kit documentation. You also have the option to launch Atmel Software Framework (ASF) example applications. The target device is programmed and debugged by the on-board Embedded Debugger and no external programmer or debugger tool is needed. Please refer to the Atmel Studio user guide2 for information regarding how to compile and program the kit. 2.3 Design documentation and related links The following list contains links to the most relevant documents and software for SAM4S Xplained Pro. 1. Xplained Pro products 3 - Atmel Xplained Pro is a series of small-sized and easy-to-use evaluation kits for 8- and 32-bit Atmel microcontrollers. It consists of a series of low cost MCU boards for evaluation and demonstration of features and capabilities of different MCU families. 2. SAM4S Xplained Pro User Guide 4 - PDF version of this User Guide. 3. SAM4S Xplained Pro Design Documentation 5 - Package containing schematics, BOM, assembly drawings, 3D plots, layer plots etc. 4. Atmel Studio 6 - Free Atmel IDE for development of C/C++ and assembler code for Atmel microcontrollers. 5. IAR Embedded Workbench® 7 for ARM®. This is a commercial C/C++ compiler that is available for ARM. There is a 30 day evaluation version as well as a code size limited kick-start version available from their website. The code size limit is 16K for devices with M0, M0+ and M1 cores and 32K for devices with other cores. 6. Atmel sample store 8 - Atmel sample store where you can order samples of devices. 1 http://www.atmel.com/atmelstudio 2 http://www.atmel.com/atmelstudio 3 http://www.atmel.com/XplainedPro 4 http://www.atmel.com/Images/Atmel-42075-SAM4S-Xplained-Pro_User-Guide.pdf 5 http://www.atmel.com/Images/Atmel-42075-SAM4S-Xplained-Pro_User-Guide.zip 6 http://www.atmel.com/atmelstudio 7 http://www.iar.com/en/Products/IAR-Embedded-Workbench/ARM/ 8 http://www.atmel.com/system/samplesstoreAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 6 3. Xplained Pro Xplained Pro is an evaluation platform that provides the full Atmel microcontroller experience. The platform consists of a series of Microcontroller (MCU) boards and extension boards that are integrated with Atmel Studio, have Atmel Software Framework (ASF) drivers and demo code, support data streaming and more. Xplained Pro MCU boards support a wide range of Xplained Pro extension boards that are connected through a set of standardized headers and connectors. Each extension board has an identification (ID) chip to uniquely identify which boards are mounted on a Xplained Pro MCU board. This information is used to present relevant user guides, application notes, datasheets and example code through Atmel Studio. Available Xplained Pro MCU and extension boards can be purchased in the Atmel Web Store 1 . 3.1 Embedded Debugger The SAM4S Xplained Pro contains the Atmel® Embedded Debugger (EDBG) for on-board debugging. The EDBG is a composite USB device of 3 interfaces; a debugger, Virtual COM Port and Data Gateway Interface (DGI). In conjunction with Atmel Studio, the EDBG debugger interface can program and debug the ATSAM4SD32C. On the SAM4S Xplained Pro, the SWD interface is connected between the EDBG and the ATSAM4SD32C. The Virtual COM Port is connected to a UART port on the ATSAM4SD32C (see section “Embedded Debugger implementation” on page 16 for pinout), and provides an easy way to communicate with the target application through a simple terminal software. It offers variable baud rate, parity and stop bit settings. Note that the settings on the target device UART must match the settings given in the terminal software. The DGI consists of several physical data interfaces for communication with the host computer. Please, see section “Embedded Debugger implementation” on page 16 for available interfaces and pinout. Communication over the interfaces are bidirectional. It can be used to send events and values from the ATSAM4SD32C, or as a generic printf-style data channel. Traffic over the interfaces can be timestamped on the EDBG for more accurate tracing of events. Note that timestamping imposes an overhead that reduces maximal throughput. The DGI uses a proprietary protocol, and is thus only compatible with Atmel Studio. The EDBG controls two LEDs on SAM4S Xplained Pro, a power LED and a status LED. Table 3.1, “EDBG LED control” shows how the LEDs are controlled in different operation modes. Table 3.1. EDBG LED control Operation mode Power LED Status LED Normal operation Power LED is lit when power is applied to the board. Activity indicator, LED flashes every time something happens on the EDBG. Bootloader mode (idle) The power LED and the status LED blinks simultaneously. Bootloader mode (firmware upgrade) The power LED and the status LED blinks in an alternating pattern. For further documentation on the EDBG, see the EDBG User Guide. 3.2 Hardware identification system All Xplained Pro compatible extension boards have an Atmel ATSHA204 crypto authentication chip mounted. This chip contains information that identifies the extension with its name and some extra data. When an Xplained Pro extension board is connected to an Xplained Pro MCU board the information is read and sent to Atmel Studio. The Atmel Kits extension, installed with Atmel Studio, will give relevant information, code examples and links to relevant documents. Table 3.2, “Xplained Pro ID chip content” shows the data fields stored in the ID chip with example content. Table 3.2. Xplained Pro ID chip content Data Field Data Type Example Content Manufacturer ASCII string Atmel’\0’ Product Name ASCII string Segment LCD1 Xplained Pro’\0’ Product Revision ASCII string 02’\0’ Product Serial Number ASCII string 1774020200000010’\0’ Minimum Voltage [mV] uint16_t 3000 1 http://store.atmel.com/CBC.aspx?q=c:100113Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 7 Data Field Data Type Example Content Maximum Voltage [mV] uint16_t 3600 Maximum Current [mA] uint16_t 30 3.3 Power supply The SAM4S Xplained Pro kit can be powered either by USB or by an external power source through the 4- pin power header, marked PWR. This connector is described in “Power header” on page 10. The available power sources and specifications are listed in Table 3.3, “Power sources for SAM4S Xplained Pro”. Table 3.3. Power sources for SAM4S Xplained Pro Power input Voltage requirements Current requirements Connector marking External power 5 V +/- 2 % (+/- 100 mV) for USB host operation. 4.3 V to 5.5 V if USB host operation is not required Recommended minimum is 1A to be able to provide enough current for connected USB devices and the board itself. Recommended maximum is 2A due to the input protection maximum current specification. PWR Embedded debugger USB 4.4V to 5.25V (according to USB spec) 500 mA (according to USB spec) DEBUG USB Target USB 4.4V to 5.25V (according to USB spec) 500 mA (according to USB spec) TARGET USB The kit will automatically detect which power sources are available and choose which one to use according to the following priority: 1. External power 2. Embedded debugger USB 3. Target USB Note External power is required when the 500mA through the USB connector is not enough to power a connected USB device in a USB host application. 3.3.1 Measuring SAM4S power consumption As part of an evaluation of the SAM4S it can be of interest to measure its power consumption. Because the device has a separate power plane (VCC_MCU_P3V3) on this board it is possible to measure the current consumption by measuring the current that is flowing into this plane. The VCC_MCU_P3V3 plane is connected via a jumper to the main power plane (VCC_TARGET_P3V3) and by replacing the jumper with an ampere meter it is possible to determine the current consumption. To locate the current measurement header, please refer to Figure 1.1, “SAM4S Xplained Pro evaluation kit overview”. Warning Do not power the board without having the jumper or an ampere meter mounted. This can cause the SAM4S to be powered through its I/O pins and cause undefined operation of the device. 3.4 Standard headers and connectors 3.4.1 Xplained Pro extension header All Xplained Pro kits have one or more dual row, 20 pin, 100mil extension headers. Xplained Pro MCU boards have male headers while Xplained Pro extensions have their female counterparts. Note that all pins are not always connected. However, all the connected pins follow the defined pin-out described in Table 3.4, “Xplained Pro extension header”. The extension headers can be used to connect a wide variety of Xplained ProAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 8 extensions to Xplained Pro MCU boards and to access the pins of the target MCU on Xplained Pro MCU board directly. Table 3.4. Xplained Pro extension header Pin number Name Description 1 ID Communication line to the ID chip on extension board. 2 GND Ground 3 ADC(+) Analog to digital converter , alternatively positive part of differential ADC 4 ADC(-) Analog to digital converter , alternatively negative part of differential ADC 5 GPIO1 General purpose IO 6 GPIO2 General purpose IO 7 PWM(+) Pulse width modulation , alternatively positive part of differential PWM 8 PWM(-) Pulse width modulation , alternatively positive part of differential PWM 9 IRQ/GPIO Interrupt request line and/or general purpose IO. 10 SPI_SS_B/GPIO Slave select for SPI and/or general purpose IO. 11 TWI_SDA Data line for two wire interface. Always implemented, bus type. 12 TWI_SCL Clock line for two wire interface. Always implemented, bus type. 13 USART_RX Receiver line of Universal Synchronous and Asynchronous serial Receiver and Transmitter 14 USART_TX Transmitter line of Universal Synchronous and Asynchronous serial Receiver and Transmitter 15 SPI_SS_A Slave select for SPI. Should be unique if possible. 16 SPI_MOSI Master out slave in line of Serial peripheral interface. Always implemented, bus type 17 SPI_MISO Master in slave out line of Serial peripheral interface. Always implemented, bus type 18 SPI_SCK Clock for Serial peripheral interface. Always implemented, bus type 19 GND Ground 20 VCC Power for extension board 3.4.2 Xplained Pro LCD connector The LCD connector provides the ability to connect to display extensions that have a parallel interface. The connector implements signals for a MCU parallel bus interface and a LCD controller interface as well as signals for a touchcontroller. The connector pin-out definition is shown in Table 3.5, “Xplained Pro LCD connector”. Note that usually only one display interface is implemented, either LCD controller or the MCU bus interface. A FPC/FFC connector with 50 pins and 0.5mm pitch is used for the LCD connector. The connector (XF2M-5015-1A) from Omron is used on several designs and can be used as a reference. Table 3.5. Xplained Pro LCD connector Pin number Name RGB interface description MCU interface description 1 ID Communication line to ID chip on extension board. 2 GND Ground 3 D0 Data line 4 D1 Data line 5 D2 Data line 6 D3 Data lineAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 9 Pin number Name RGB interface description MCU interface description 7 GND Ground 8 D4 Data line 9 D5 Data line 10 D6 Data line 11 D7 Data line 12 GND Ground 13 D8 Data line 14 D9 Data line 15 D10 Data line 16 D11 Data line 17 GND Ground 18 D12 Data line 19 D12 Data line 20 D14 Data line 21 D15 Data line 22 GND Ground 23 D16 Data line 24 D17 Data line 25 D18 Data line 26 D19 Data line 27 GND Ground 28 D20 Data line 29 D21 Data line 30 D22 Data line 31 D23 Data line 32 GND Ground 33 PCLK / CMD_DATA_SEL Pixel clock Command and data select. One address line of the MCU for displays where it is possible to select either the register or the data interface. 34 VSYNC / CS Vertical synchronization Chip select 35 HSYNC / WE Horizontal synchronization Write enable signal 36 DATA ENABLE / RE Data enable signal Read enable signal 37 SPI SCK Clock for Serial peripheral interface 38 SPI MOSI Master out slave in line of Serial peripheral interface 39 SPI MISO Master in slave out line of Serial peripheral interface 40 SPI SS Slave select for SPI. Should be unique if possible 41 ENABLE Display enable signal 42 TWI SDA I2C data line (maxTouch) 43 TWI SCL I2C clock line (maxTouch) 44 IRQ1 maxTouch interrupt lineAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 10 Pin number Name RGB interface description MCU interface description 45 IRQ2 Interrupt line for other I2C devices 46 PWM Backlight control 47 RESET Reset for both display and maxTouch 48 VCC 3.3V power supply for extension board 49 VCC 3.3V power supply for extension board 50 GND Ground 3.4.3 Power header The power header can be used to connect external power to the SAM4S Xplained Pro kit. The kit will automatically detect and switch to the external power if supplied. The power header can also be used as supply for external peripherals or extension boards. Care must be taken not to exceed the total current limitation of the on-board regulator for the 3.3V regulated output. To locate the current measurement header, please refer to Figure 1.1, “SAM4S Xplained Pro evaluation kit overview” Table 3.6. Power header PWR Pin number PWR header Pin name Description 1 VEXT_P5V0 External 5V input 2 GND Ground 3 VCC_P5V0 Unregulated 5V (output, derived from one of the input sources) 4 VCC_P3V3 Regulated 3.3V (output, used as main power for the kit) Note If the board is powered from a battery source it is recommended to use the PWR header. If there is a power source connected to EDBG USB, the EDBG is activated and it will consume more power.Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 11 4. Hardware user guide 4.1 Connectors This chapter describes the implementation of the relevant connectors and headers on SAM4S Xplained Pro and their connection to the ATSAM4SD32C. The tables of connections in this chapter also describes which signals are shared between the headers and on-board functionality. 4.1.1 I/O extension headers The SAM4S Xplained Pro headers EXT1, EXT2 and EXT3 offers access to the I/O of the microcontroller in order to expand the board e.g. by connecting extensions to the board. These headers all comply with the standard extension header specified in Xplained Pro Standard Extension Header. All headers have a pitch of 2.54 mm. Table 4.1. Extension header EXT1 Pin on EXT1 SAM4S pin Function Shared functionality 1 - - Communication line to ID chip on extension board. 2 - - GND 3 PA17 AD[0] 4 PA18 AD[1] 5 PA24 GPIO PIOD Interface Header 6 PA25 GPIO PIOD Interface Header 7 PA23 PWMH0 PIOD Interface Header 8 PA19 PWML0 9 PA1 WKUP1/GPIO 10 PA6 GPIO DGI_GPIO0 on EDBG 11 PA3 TWD0 EXT2 and EDBG 12 PA4 TWCK0 EXT2 and EDBG 13 PA21 USART1/RXD1 EXT2 14 PA22 USART1/TXD1 EXT2 15 PA11 SPI/NPCS[0] 16 PA13 SPI/MOSI EXT2, EXT3, LCD connector (EXT4) and EDBG 17 PA12 SPI/MISO EXT2, EXT3, LCD connector (EXT4) and EDBG 18 PA14 SPI/SPCK EXT2, EXT3, LCD connector (EXT4) and EDBG 19 - - GND 20 - - VCC Table 4.2. Extension header EXT2 Pin on EXT2 SAM4S pin Function Shared functionality 1 - - Communication line to ID chip on extension board. 2 - - GND 3 PB0 AD[4] 4 PB1 AD[5] 5 PC24 GPIO DGI_GPIO2 on EDBG 6 PC25 GPIO DGI_GPIO3 on EDBG 7 PC19 PWMH1Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 12 Pin on EXT2 SAM4S pin Function Shared functionality 8 PA20 PWML1 9 PC26 GPIO 10 PC27 GPIO 11 PA3 TWD0 EXT1 and EDBG 12 PA4 TWCK0 EXT1 and EDBG 13 PA21 USART1/RXD1 EXT1 14 PA22 USART1/TXD1 EXT1 15 PA9 SPI/NPCS[1] LCD connector (EXT4) 16 PA13 SPI/MOSI EXT1, EXT3, LCD connector (EXT4) and EDBG 17 PA12 SPI/MISO EXT1, EXT3, LCD connector (EXT4) and EDBG 18 PA14 SPI/SPCK EXT1, EXT3, LCD connector (EXT4) and EDBG 19 - - GND 20 - - VCC Table 4.3. Extension header EXT3 Pin on EXT3 SAM4S pin Function Shared functionality 1 - - Communication line to ID chip on extension board. 2 - - GND 3 PC29 AD[13] 4 PC30 AD[14] 5 PC21 GPIO 6 PC22 GPIO DGI_GPIO1 on EDBG 7 PC20 PWMH2 8 PA16 PWML2 PIOD Header 9 PA0 WKUP0/GPIO LCD connector (EXT4) 10 PC31 GPIO 11 PB4 TWD1 LCD connector (EXT4) 12 PB5 TWCK1 LCD connector (EXT4) 13 PB2 USART1/RXD1 CDC UART 14 PB3 USART1/TXD1 CDC UART 15 PA10 SPI/NPCS[2] LCD connector (EXT4) 16 PA13 SPI/MOSI EXT1, EXT2, LCD connector (EXT4) and EDBG 17 PA12 SPI/MISO EXT1, EXT2, LCD connector (EXT4) and EDBG 18 PA14 SPI/SPCK EXT1, EXT2, LCD connector (EXT4) and EDBG 19 - - GND 20 - - VCC 4.1.2 LCD extension connector Extension connector EXT4 is a special connector for LCD displays. The physical connector is an Omron Electronics XF2M-5015-1A FPC connector.Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 13 Table 4.4. LCD display connector EXT4 Pin on EXT4 SAM4S pin Function Shared functionality 1 - - Communication line to ID chip on extension board. 2 - - GND 3 PC0 D0 NAND Flash 4 PC1 D1 NAND Flash 5 PC2 D2 NAND Flash 6 PC3 D3 NAND Flash 7 - - GND 8 PC4 D4 NAND Flash 9 PC5 D5 NAND Flash 10 PC6 D6 NAND Flash 11 PC7 D7 NAND Flash 12 - - GND 13 - - 14 - - 15 - - 16 - - 17 - - GND 18 - - 19 - - 20 - - 21 - - 22 - - GND 23 - - 24 - - 25 - - 26 - - 27 - - GND 28 - - 29 - - 30 - - 31 - - 32 - - GND 33 PC18 A0 34 PC15 NPCS[1] 35 PC8 NWE 36 PC11 NRD 37 38 39 40 41 PB14 GPIO 42 PB4 TWD1/SDA EXT3Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 14 Pin on EXT4 SAM4S pin Function Shared functionality 43 PB5 TWCK1/SCL EXT3 44 PA0 WKUP0 EXT3 45 - - 46 PA15 PWML3 PIOD Interface header 47 PC28 GPIO 48 - VCC_P3V3 49 - VCC_P3V3 EXT2 50 - GND 4.1.3 Other headers In addition to the “I/O extension headers” on page 11, SAM4S Xplained Pro has two additional headers with spare signals that offers access to the I/O of the microcontroller which are otherwise not easily available elsewhere or might be favourable to have collected toghether. All headers have a pitch of 2.54mm. Table 4.5. SPARE SIGNALS header Pin on header SAM4S pin Function Shared functionality 1 PA2 DATRG User button, SW0 2 PA9 PWMF10 EXT2 3 PA26 TI0A2 SD Card and PIOD Interface header 4 PA27 TI0B2 SD Card and PIOD Interface header 5 PA28 TCLK1 SD Card and PIOD Interface header 6 PA29 TCLK2 SD Card and PIOD Interface header 7 PA31 PCK2 SD Card and PIOD Interface header 8 PB0 RTCOUT0 EXT2 9 PB1 RTCOUT1 EXT2 10 PB13 DAC0 11 PB14 DAC1 12 - - GND Table 4.6. PIOD INTERFACE header Pin on header SAM4S pin Function Shared functionality 1 PA15 PIODCEN1 LCD connector 2 PA16 PIODCEN2 EXT3 3 PA23 PIODCCLK EXT1 4 PA24 PIODC0 EXT1 5 PA25 PIODC1 EXT1 6 PA26 PIODC2 SD Card and SPARE Signals header 7 PA27 PIODC3 SD Card and SPARE Signals header 8 PA28 PIODC4 SD Card and SPARE Signals header 9 PA29 PIODC5 SD Card and SPARE Signals header 10 PA30 PIODC6 SD Card 11 PA31 PIODC7 SD Card and SPARE Signals header 12 - - GND 4.2 Peripherals 4.2.1 NAND Flash The SAM4S Xplained Pro kit has one 2Gb NAND Flash connected to the external bus interface of the SAM4S.Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 15 Table 4.7. NAND Flash connections SAM4S pin Function NAND Flash function Shared functionality PC0 D0 IO0 LCD connector PC1 D1 IO1 LCD connector PC2 D2 IO2 LCD connector PC3 D3 IO3 LCD connector PC4 D4 IO4 LCD connector PC5 D5 IO5 LCD connector PC6 D6 IO6 LCD connector PC7 D7 IO7 LCD connector PC9 NANDOE RE (active low) PC10 NANDWE WE (active low) PC13 GPIO R (active high)/ B (active low) PC14 NCS[0] CE (active low) PC16 NANDALE ALE (active low) PC17 NANDCLE CLE 4.2.2 SD Card connector The SAM4S Xplained Pro kit has one SD card connector which is connected to High Speed Multimedia Card Interface (HSMCI) of the SAM4S Table 4.8. SD Card connections SAM4S pin Function SD Card function Shared functionality PA26 MCDA2 DAT2 SPARE Signal and PIOD Interface headers PA27 MCDA3 DAT3 SPARE Signal and PIOD Interface headers PA28 MCCDA CMD SPARE Signal and PIOD Interface headers PA29 MCCK CLK SPARE Signal and PIOD Interface headers PA30 MCDA0 DAT0 PIOD Interface header PA31 MCDA1 DAT1 SPARE Signal and PIOD Interface headers PC12 GPIO Card Detect 4.2.3 Crystals The SAM4S Xplained Pro kit contains two crystals that can be used as clock sources for the SAM4S device. Each crystal has a cut-strap next to it that can be used to measure the oscillator safety factor. This is done by cutting the strap and adding a resistor across the strap. More information about oscillator allowance and safety factor can be found in appnote AVR4100 1 . Table 4.9. External 32.768kHz crystals Pin on SAM4S Function PA49 XIN32 PA48 XOUT32 1 http://www.atmel.com/images/doc8333.pdfAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 16 Table 4.10. External 12MHz crystals Pin on SAM4S Function PB9 XIN0 PB8 XOUT0 4.2.4 Mechanical buttons SAM4S Xplained Pro contains two mechanical buttons. One button is the RESET button connected to the SAM4S reset line and the other is a generic user configurable button. When a button is pressed it will drive the I/O line to GND. Table 4.11. Mechanical buttons Pin on SAM4S Silkscreen text NRST RESET PC24 SW0 4.2.5 LED There is one yellow LED available on the SAM4S Xplained Pro board that can be turned on and off. The LED can be activated by driving the connected I/O line to GND. Table 4.12. LED connections Pin on SAM4S LED PC23 Yellow LED0 4.2.6 Analog reference An adjustable voltage reference is implemented on the kit to have a reference for the ADC or DAC. The reference can be adjusted with the on-board multiturn trimmer potentiometer. Next to the potentiometer, a 2-pin header is available to measure the reference voltage for the AREF pin of the SAM4S. The voltage output range for the reference is 0V - 3.36V. 4.3 Embedded Debugger implementation SAM4S Xplained Pro contains an Embedded Debugger (EDBG) that can be used to program and debug the ATSAM4SD32C using Serial Wire Debug (SWD). The Embedded Debugger also include a Virtual Com port interface over UART, an Atmel Data Gateway Interface over SPI and TWI and it monitors four of the SAM4S GPIOs. Atmel Studio can be used as a front end for the Embedded Debugger. 4.3.1 Serial Wire Debug The Serial Wire Debug (SWD) use two pins to communicate with the target. For further information on how to use the programming and debugging capabilities of the EDBG, see “Embedded Debugger” on page 6. Table 4.13. SWD connections Pin on SAM4S Function PB7 SWD clock PB6 SWD data PB5 SWD trace output PB12 Erase 4.3.2 Virtual COM port The Embedded Debugger act as a Virtual Com Port gateway by using one of the ATSAM4SD32C UARTs. For further information on how to use the Virtual COM port see “Embedded Debugger” on page 6. Table 4.14. Virtual COM port connections Pin on SAM4S Function PB3 UART TXD (SAM4S TX line)Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 17 Pin on SAM4S Function PB2 UART RXD (SAM4S RX line) 4.3.3 Atmel Data Gateway Interface The Embedded Debugger features an Atmel Data Gateway Interface (DGI) by using either a SPI or TWI port. The DGI can be used to send a variety of data from the SAM4S to the host PC. For further information on how to use the DGI interface see “Embedded Debugger” on page 6. Table 4.15. DGI interface connections when using SPI Pin on SAM4S Function PA5 Slave select (SAM4S is Master) PA12 SPI MISO (Master In, Slave Out) PA13 SPI MOSI (Master Out, Slave in) PA14 SPI SCK (Clock Out) Table 4.16. DGI interface connections when using TWI Pin on SAM4S Function PA3 SDA (Data line) PA4 SCL (Clock line) Four GPIO lines are connected to the Embedded Debugger. The EDBG can monitor these lines and time stamp pin value changes. This makes it possible to accurately time stamp events in the SAM4S application code. For further information on how to configure and use the GPIO monitoring features see “Embedded Debugger” on page 6. Table 4.17. GPIO lines connected to the EDBG Pin on SAM4S Function PA6 GPIO0 PA22 GPIO1 PA24 GPIO2 PA25 GPIO3Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 18 5. Hardware revision history and known issues 5.1 Identifying product ID and revision The revision and product identifier of Xplained Pro boards can be found in two ways, through Atmel Studio or by looking at the sticker on the bottom side of the PCB. By connecting a Xplained Pro MCU board to a computer with Atmel Studio running, an information window will pop up. The first 6 digits of the serial number, which is listed under kit details, contain the product identifier and revision. Information about connected Xplained Pro extension boards will also appear in the Atmel Kits window. The same information can be found on the sticker on the bottom side of the PCB. Most kits will print the identifier and revision in plain text as A09-nnnn\rr where nnnn is the identifier and rr is the revision. Boards with limited space have a sticker with only a QR-code which contains a serial number string. The serial number string has the following format: "nnnnrrssssssssss" n = product identifier r = revision s = serial number The kit identifier for SAM4S Xplained Pro is 1803. 5.2 Revision 5 On this revision, the SPI clock net is improved to reduce any issues that might be caused by reflections. The SPI has been removed from the LCD (EXT4 connector) to reduce load on the clock net. The remaining clock lines have been divided into four terminated nets for each SPI source (EXT1, EXT2, EXT3, and EDBG) and routed in a star like layout. A series terminator resistor of 43ohm is placed on each clock net, close to the SPI clock pin. This reduces any issues that might be caused by reflections comming back from unterminated/ unused clock lines. It also reduces the rise/fall time of the clock edges and that will also help to reduce any reflection issues. 5.3 Revision 4 Known issues ● SAM4S has an on-die series termination of the SPI CLK which makes this signal not usable for a multi drop clock distribution because all devices along the line will see a fraction of VCC until the signal is reflected from the end of the transmission line. On the SAM4S Xplained Pro revision 4 this signal is routed to each extension connector with EXT1 at the end of the line. That means extensions that are connected along the transission line e.g. EXT3 header is likely to fail due to a non-monotinic edge caused by relections and the fraction of VCC that is present for a short time until the reflection comes back from the end of the line. Workaround: ● By slowing down the clock rise time with a capacitor, and thus effectively increasing the line length at which point it becomes a transmission line, it is possible to remove the clock issue. A 56pF capacitor has been mounted on the bottom side of the board between the SPI clock and GND. This however reduces the maximum SPI clock speed and it is recommended to not run this faster than 30MHz (this also depends on how much additional capacitance is added by connected extensions and needs to be checked case by case). The capacitor was added on revision 4 on the bottom side of the EXT3 header.Atmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 19 6. Document revision history Doc. Rev. Date Comment B 15/03/2013 Added information about changes done on rev 5 A 11/02/2013 First releaseAtmel SAM4S Xplained Pro [USER GUIDE] Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 20 7. Evaluation board/kit important notice This evaluation board/kit is intended for use for FURTHER ENGINEERING, DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY. It is not a finished product and may not (yet) comply with some or any technical or legal requirements that are applicable to finished products, including, without limitation, directives regarding electromagnetic compatibility, recycling (WEEE), FCC, CE or UL (except as may be otherwise noted on the board/kit). Atmel supplied this board/kit "AS IS," without any warranties, with all faults, at the buyer's and further users' sole risk. The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies Atmel from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge and any other technical or legal concerns. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER USER NOR ATMEL SHALL BE LIABLE TO EACH OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. No license is granted under any patent right or other intellectual property right of Atmel covering or relating to any machine, process, or combination in which such Atmel products or services might be or are used. Mailing Address: Atmel Corporation 1600 Technology Drive San Jose, CA 95110 USAAtmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2013 Atmel Corporation. All rights reserved. / Rev.: Atmel-42075B-MCU-Atmel SAM4S Xplained Pro-USER GUIDE-03/2013 Atmel®, Atmel logo and combinations thereof, AVR®, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Windows® is a registered trademark of Microsoft Corporation in U.S. and or other countries. ARM® is a registered trademark of ARM Ltd. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. APPLICATION NOTE Atmel AVR600: STK600 Expansion, Routing and Socket Boards Atmel Microcontrollers Introduction This application note describes the process of developing new routing, socket and expansion cards for the Atmel STK® 600. It also describes the physical parameters for creating such cards. The STK600 starter kit from Atmel has a sandwich design to match a specific part package and pin out to the generic pin headers. It also features an expansion area where most part pins are available. While the variety of IC packages is relatively limited, the number of possible pinouts increases rapidly with the number of pins. I.e. a 6-pin IC can have 720 (6!) different pinouts! The routing / socket card design provides a lowcost solution to support upcoming devices as the socket is the cost driving factor. STK600 users might also want to create their own routing cards to include specialized hardware to prototype their own design. Figure 1. STK600 router and socket card. 8170C−AVR−03/2013Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 2 Table of Contents 1. Routing Cards ...................................................................................... 3 1.1 Connector footprints .......................................................................................... 3 1.2 Physical dimensions and component placement .............................................. 4 1.3 Atmel STK600 socket connectors pinout .......................................................... 5 1.3.1 Signal descriptions .............................................................................. 8 2. Socket Cards ..................................................................................... 10 2.1 Power design issues ....................................................................................... 10 2.2 Connector MPN ............................................................................................... 10 2.3 Physical dimensions and component placement ............................................ 10 3. Expansion Cards ................................................................................ 11 3.1 Connector MPN ............................................................................................... 11 3.2 Physical dimensions and component placement ............................................ 12 3.3 Atmel STK600 expansion connectors pinout .................................................. 13 4. ID System .......................................................................................... 17 4.1 Signal usage ................................................................................................... 17 4.2 ID functions ..................................................................................................... 18 4.3 Examples ........................................................................................................ 19 5. Design Example ................................................................................. 20 6. Revision History ................................................................................. 22Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 3 1. Routing Cards The routing cards sit between the generic socket card and the Atmel STK600. It has one pair of electric pads underneath to mate with the STK600 spring loaded connector, and one pair of pads on top where the socket card connector connects. A part specific card with the target IC soldered on can be viewed as a routing card without the top pads. 1.1 Connector footprints A routing card should have pads to mate with the following spring loaded connectors: Table 1-1. Router card connectors. Manufacturer and MPN Quantity Comment SAMTEC, FSI-140-03-G-D-AD 2 80-pins to socket card (top) SAMTEC, FSI-150-03-G-D-AD 2 100-pins to STK600 (bottom) Figure 1-1. PCB land pattern for mating to FSI connectors. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 4 1.2 Physical dimensions and component placement Figure 1-2. Routing card connector pad placement and dimensions. Figure 1-3. Clip hole dimensions. The board thickness should be 1.6mm to be compatible with the clips. Note: Components on the main board might conflict with through hole mounted or secondary side mounted components. Areas with such components are highlighted in Figure 1-4. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 5 Figure 1-4. Height restricted areas due to main board components. 1.3 Atmel STK600 socket connectors pinout Figure 1-5 shows the pinout for the STK600 headers. This corresponds to the routing card connectors J1 and J2. Figure 1-5. STK600 socket connectors’ pinout. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 6 Table 1-2. Atmel STK600 J201 left, routing card connector J1 pinout. Signal name Pin number Signal name VTG 2 1 GND PA1 4 3 PA0 PA3 6 5 PA2 PA5 8 7 PA4 PA7 10 9 PA6 VTG 12 11 GND PB1 14 13 PB0 PB3 16 15 PB2 PB5 18 17 PB4 PB7 20 19 PB6 VTG 22 21 GND PC1 24 23 PC0 PC3 26 25 PC2 PC5 28 27 PC4 PC7 30 29 PC6 VTG 32 31 GND PD1 34 33 PD0 PD3 36 35 PD2 PD5 38 37 PD4 PD7 40 39 PD6 VTG 42 41 GND PE1 44 43 PE0 PE3 46 45 PE2 PE5 48 47 PE4 PE7 50 49 PE6 VTG 52 51 GND PF1 54 53 PF0 PF3 56 55 PF2 PF5 58 57 PF4 PF7 60 59 PF6 VTG 62 61 GND PG1 64 63 PG0 PG3 66 65 PG2 PG5 68 67 PG4 PG7 70 69 PG6 VTG 72 71 GND PH1 74 73 PH0 PH3 76 75 PH2 PH5 78 77 PH4 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 7 PH7 80 79 PH6 VTG 82 81 GND AREF0 84 83 XTAL1 AREF1 86 85 XTAL2 TGT_MOSI 88 87 GND TGT_MISO 90 89 TOSC1 TGT_SCK 92 91 TOSC2 TDI 94 93 TGT_RESET TDO 96 95 GND TMS 98 97 Vext TCK 100 99 Vcc Table 1-3. Atmel STK600 J202 right, routing card connector J2 pinout. Signal name Pin number Signal name VTG 2 1 GND PJ1 4 3 PJ0 PJ3 6 5 PJ2 PJ5 8 7 PJ4 PJ7 10 9 PJ6 VTG 12 11 GND PK1 14 13 PK0 PK3 16 15 PK2 PK5 18 17 PK4 PK7 20 19 PK6 VTG 22 21 GND PL1 24 23 PL0 PL3 26 25 PL2 PL5 28 27 PL4 PL7 30 29 PL6 VTG 32 31 GND PM1 34 33 PM0 PM3 36 35 PM2 PM5 38 37 PM4 PM7 40 39 PM6 VTG 42 41 GND PN1 44 43 PN0 PN3 46 45 PN2 PN5 48 47 PN4 PN7 50 49 PN6 VTG 52 51 GND PP1 54 53 PP0 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 8 PP3 56 55 PP2 PP5 58 57 PP4 PP7 60 59 PP6 VTG 62 61 GND PQ1 64 63 PQ0 PQ3 66 65 PQ2 PQ5 68 67 PQ4 PQ7 70 69 PQ6 VBUST 72 71 DP UVCON 74 73 DN Vcc 76 75 UID Vext 78 77 GND TGT_PDATA1 80 79 TGT_PDATA0 TGT_PDATA3 82 81 TGT_PDATA2 TGT_PDATA5 84 83 TGT_PDATA4 TGT_PDATA7 86 85 TGT_PDATA6 TGT_PCTRL1 88 87 TGT_PCTRL0 TGT_PCTRL3 90 89 TGT_PCTRL2 TGT_PCTRL5 92 91 TGT_PCTRL4 TGT_PCTRL7 94 93 TGT_PCTRL6 BOARD_ID1 96 95 BOARD_ID0 BOARD_ID3 98 97 BOARD_ID2 BOARD_ID5 100 99 BOARD_ID4 1.3.1 Signal descriptions Table 1-4. Socket card connector pin description. Atmel STK600 signal name MCU Comment PAx, PBx etc PAx, PBx etc 1-to-1 MCU pin mapping VTG Vcc Target supply rail controlled by Atmel AVR Studio® / STK600 GND GND AREFx AREF Analog reference voltage, controlled by AVR Studio / STK600 XTALx XTALx Clock pins connected to oscillator on STK600 TGT_SCK, TGT_MISO, TGT_MOSI ISP pins ISP programming interface TGT_TDI, TGT_TDO, TGT_TMS, TGT_TCK JTAG pins JTAG programming interface VBUST VBUS VBUS (sense) for USB UID UID ID pin for USB OTG UVCON UVCON USB VBUS generation control for USB OTG. A low level on this signal enables VBUS generation DP, DN DP, DN USB differential pair TGT_PDATA(0-7) (HV) data pins Data pins for high voltage (PP/HVSP) programming Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 9 TGT_CTRL0 (HV) BS2 Control signals for High voltage Parallel Programming / Serial Programming. Refer to AVR datasheet for further information. On AVRs with common XA1/BS2, XA1 is used. On AVRs with common BS1/PAGEL, BS1 is used. TGT_CTRL1 (HV) Ready/Busy TGT_CTRL2 (HV) /OE TGT_CTRL3 (HV) /WR TGT_CTRL4 (HV) BS1 TGT_CTRL5 (HV) XA0 TGT_CTRL6 (HV) XA1 TGT_CTRL7 (HV) PAGEL BOARD_IDn none ID system for router / socket / expansion cards, see Chapter 4 - ID System Notes: 1. Not all AVR will have every pin (ex. two aref pins, tosc or usb). 2. A MCU pin will fan-out to both Pnx pin and to the programming interface(s) located at that pin. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 10 2. Socket Cards Socket cards route each pin from the IC socket to separate pins on the spring loaded connectors on the bottom side, facing the routing card. 2.1 Power design issues As all routing is handled by the routing card, even power lines and power decoupling is ignored at the socket card. This produces less than ideal power design, which may lead to unwanted noise, ground bounce, and other effects. It should therefore be expected that heavily loaded designs cannot run at full speed on the Atmel STK600. Likewise, such power design is not recommended for custom designs. 2.2 Connector MPN Table 2-1. Socket card connector. Manufacturer and MPN Quantity Comment SAMTEC, FSI-140-03-G-D-AD 2 Spring loaded 80-pin connector 2.3 Physical dimensions and component placement Figure 2-1. Socket card connector placement and dimensions. ST1 J1 J2 45° Note! 105mm 94mm 66mm 7mm The board thickness should be 1.6mm to be compatible with the clips. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 11 3. Expansion Cards The Atmel STK600 features an expansion area where cards for custom peripherals like memory expansion, LCD etc can be placed. STK600 routes all part pins and power to the expansion card connectors. 3.1 Connector MPN Table 3-1. Expansion card connector. Manufacturer and MPN Quantity Comment FCI, 61082-101402LF 2 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 12 3.2 Physical dimensions and component placement Figure 3-1. Expansion card connector placement and dimensions. There is no requirement to board thickness. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 13 3.3 Atmel STK600 expansion connectors pinout Figure 3-2. Pinout for expansion connectors. Table 3-2. STK600 J301 “expand0” connector pinout. Signal name Pin number Signal name VTG 2 1 GND PA1 4 3 PA0 PA3 6 5 PA2 PA5 8 7 PA4 PA7 10 9 PA6 VTG 12 11 GND PB1 14 13 PB0 PB3 16 15 PB2 PB5 18 17 PB4 PB7 20 19 PB6 VTG 22 21 GND PC1 24 23 PC0 PC3 26 25 PC2 PC5 28 27 PC4 PC7 30 29 PC6 VTG 32 31 GND PD1 34 33 PD0 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 14 PD3 36 35 PD2 PD5 38 37 PD4 PD7 40 39 PD6 VTG 42 41 GND PE1 44 43 PE0 PE3 46 45 PE2 PE5 48 47 PE4 PE7 50 49 PE6 VTG 52 51 GND PF1 54 53 PF0 PF3 56 55 PF2 PF5 58 57 PF4 PF7 60 59 PF6 VTG 62 61 GND PG1 64 63 PG0 PG3 66 65 PG2 PG5 68 67 PG4 PG7 70 69 PG6 VTG 72 71 GND PH1 74 73 PH0 PH3 76 75 PH2 PH5 78 77 PH4 PH7 80 79 PH6 VTG 82 81 GND AREF0 84 83 XTAL1 AREF1 86 85 XTAL2 TGT_MOSI 88 87 GND TGT_MISO 90 89 TOSC1 TGT_SCK 92 91 TOSC2 TDI 94 93 TGT_RESET TDO 96 95 Vcc6 TMS 98 97 GND TCK 100 99 Vcc6 Table 3-3. Atmel STK600 J302 “expand1” connector pinout. Signal name Pin number Signal name VTG 2 1 GND PJ1 4 3 PJ0 PJ3 6 5 PJ2 PJ5 8 7 PJ4 PJ7 10 9 PJ6 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 15 VTG 12 11 GND PK1 14 13 PK0 PK3 16 15 PK2 PK5 18 17 PK4 PK7 20 19 PK6 VTG 22 21 GND PL1 24 23 PL0 PL3 26 25 PL2 PL5 28 27 PL4 PL7 30 29 PL6 VTG 32 31 GND PM1 34 33 PM0 PM3 36 35 PM2 PM5 38 37 PM4 PM7 40 39 PM6 VTG 42 41 GND PN1 44 43 PN0 PN3 46 45 PN2 PN5 48 47 PN4 PN7 50 49 PN6 VTG 52 51 GND PP1 54 53 PP0 PP3 56 55 PP2 PP5 58 57 PP4 PP7 60 59 PP6 VTG 62 61 GND PQ1 64 63 PQ0 PQ3 66 65 PQ2 PQ5 68 67 PQ4 PQ7 70 69 PQ6 Vext 72 71 GND Vext 74 73 GND GND 76 75 Vcc GND 78 77 Vcc TGT_PDATA1 80 79 TGT_PDATA0 TGT_PDATA3 82 81 TGT_PDATA2 TGT_PDATA5 84 83 TGT_PDATA4 TGT_PDATA7 86 85 TGT_PDATA6 TGT_PCTRL1 88 87 TGT_PCTRL0 TGT_PCTRL3 90 89 TGT_PCTRL2 TGT_PCTRL5 92 91 TGT_PCTRL4 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 16 TGT_PCTRL7 94 93 TGT_PCTRL6 Vcc3 96 95 GND BOARD_ID1 98 97 BOARD_ID0 BOARD_ID7 100 99 BOARD_ID6 Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 17 4. ID System The Atmel STK600 features an ID system to identify which routing, socket and expansion card is attached. The STK600 can impose voltage limitations based on the IDs, and Atmel AVR Studio will notify the user if the combination is incorrect. The ID system consists of two common output and two board unique input signals. Each input is one of sixteen possible values based in the input signals – giving a total ID space of 256. Three IDs are reserved for custom use and can be implemented without use of ICs. Table 4-1. IDs reserved for custom use. Type ID Board limited to 1.8V 0xCA Board limited to 3.3V 0xCC No limit on voltage 0xCF The ID 0xff indicates no board present. 4.1 Signal usage Table 4-2. ID system signal usage. Name Direction Function BOARD_ID0 Output (A) Common output to functions BOARD_ID1 Output (B) Common output to functions BOARD_ID2 Input Input from routing card BOARD_ID3 Input Input from routing card BOARD_ID4 Input Input from socket card BOARD_ID5 Input Input from socket card BOARD_ID6 Input Input from expansion card BOARD_ID7 Input Input from expansion card Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 18 4.2 ID functions The functions and their output according to input A and B: B A 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 1 0 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Functions as logic expressions: Function Expression ID 0 0 0x0 1 A + B 0x1 2 AB 0x2 3 B 0x3 4 AB 0x4 5 A 0x5 6 ⊕ BA 0x6 7 AB 0x7 8 AB 0x8 9 ⊕ BA 0x9 10 A 0xA 11 B + AB 0xB 12 B 0xC 13 B A⋅+ B 0xD 14 A + B 0xE 15 1 0xF Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 19 4.3 Examples For a socket card to report the ID 0xCA: Route BOARD_ID1 to BOARD_ID4 and BOARD_ID0 to BOARD_ID5 Figure 4-1. Socket card ID example. For an expansion card to report the ID 0xCF: Route BOARD_ID0 to BOARD_ID6 and VCC to BOARD_ID7 Figure 4-2. Expansion card ID example. For a router card to report the ID 0xCC: Route BOARD_ID1 to both BOARD_ID2 and BOARD_ID3. Figure 4-3. Routing card ID example. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 20 5. Design Example To support a new package type one would typically start with designing the socket card. The pinout between the socket card and routing card is not defined and left to the designer. An example is given in Figure 5-1. Next is the design of the routing card (Figure 5-3). The routing card’s role is to connect each pin from the socket card to the corresponding pin on the Atmel STK600. In addition to decoupling etc, the routing card should also fan-out the correct signals to programming headers. Each card in the stack has its own board_id pins; the routing card is responsible for passing on the signal to the socket card. Figure 5-1. Schema capture of socket card. Both the socket and routing card must also include the clip holes: Figure 5-2. Clip holes included in schematic. Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 21 Figure 5-3. Schema capture of routing card. Copyright © 2008, Atmel Corporation Atmel AVR600: STK600 Expansion, Routing and Socket Boards [APPLICATION NOTE] 8170C−AVR−03/2013 22 6. Revision History Doc. Rev. Date Comments 8170C 03/2013 Example schematics for the ID system are updated 8170B 12/2010 8170A 10/2008 Initial document release Atmel Corporation 1600 Technology Drive San Jose, CA 95110 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan G.K. 16F Shin-Osaki Kangyo Building 1-6-4 Osaki, Shinagawa-ku Tokyo 141-0032 JAPAN Tel: (+81)(3) 6417-0300 Fax: (+81)(3) 6417-0370 © 2013 Atmel Corporation. All rights reserved. / Rev.: 8170C−AVR−03/2013 Atmel®, Atmel logo and combinations thereof, AVR®, AVR Studio®, Enabling Unlimited Possibilities®, STK®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. 8159E–AVR–02/2013 Features • High-performance, Low-power Atmel®AVR® 8-bit Microcontroller • Advanced RISC Architecture – 130 Powerful Instructions – Most Single-clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation – Up to 16MIPS Throughput at 16MHz – On-chip 2-cycle Multiplier • High Endurance Non-volatile Memory segments – 8KBytes of In-System Self-programmable Flash program memory – 512Bytes EEPROM – 1KByte Internal SRAM – Write/Erase Cycles: 10,000 Flash/100,000 EEPROM – Data retention: 20 years at 85C/100 years at 25C(1) – Optional Boot Code Section with Independent Lock Bits • In-System Programming by On-chip Boot Program • True Read-While-Write Operation – Programming Lock for Software Security • Atmel QTouch® library support – Capacitive touch buttons, sliders and wheels – Atmel QTouch and QMatrix acquisition – Up to 64 sense channels • Peripheral Features – Two 8-bit Timer/Counters with Separate Prescaler, one Compare Mode – One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode – Real Time Counter with Separate Oscillator – Three PWM Channels – 8-channel ADC in TQFP and QFN/MLF package • Eight Channels 10-bit Accuracy – 6-channel ADC in PDIP package • Six Channels 10-bit Accuracy – Byte-oriented Two-wire Serial Interface – Programmable Serial USART – Master/Slave SPI Serial Interface – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator • Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal Calibrated RC Oscillator – External and Internal Interrupt Sources – Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby • I/O and Packages – 23 Programmable I/O Lines – 28-lead PDIP, 32-lead TQFP, and 32-pad QFN/MLF • Operating Voltages – 2.7 - 5.5V – 0 - 16MHz • Power Consumption at 4MHz, 3V, 25C – Active: 3.6mA – Idle Mode: 1.0mA – Power-down Mode: 0.5µA 8-bit Atmel Microcontroller with 8KB In-System Programmable Flash ATmega8AATmega8A [DATASHEET] 2 8159E–AVR–02/2013 1. Pin Configurations Figure 1-1. Pinout ATmega8A 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 (INT1) PD3 (XCK/T0) PD4 GND VCC GND VCC (XTAL1/TOSC1) PB6 (XTAL2/TOSC2) PB7 PC1 (ADC1) PC0 (ADC0) ADC7 GND AREF ADC6 AVCC PB5 (SCK) 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 (T1) PD5 (AIN0) PD6 (AIN1) PD7 (ICP1) PB0 (OC1A) PB1 (SS/OC1B) PB2 (MOSI/OC2) PB3 (MISO) PB4 PD2 (INT0) PD1 (TXD) PD0 (RXD) PC6 (RESET) PC5 (ADC5/SCL) PC4 (ADC4/SDA) PC3 (ADC3) PC2 (ADC2) TQFP Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 (RESET) PC6 (RXD) PD0 (TXD) PD1 (INT0) PD2 (INT1) PD3 (XCK/T0) PD4 VCC GND (XTAL1/TOSC1) PB6 (XTAL2/TOSC2) PB7 (T1) PD5 (AIN0) PD6 (AIN1) PD7 (ICP1) PB0 PC5 (ADC5/SCL) PC4 (ADC4/SDA) PC3 (ADC3) PC2 (ADC2) PC1 (ADC1) PC0 (ADC0) GND AREF AVCC PB5 (SCK) PB4 (MISO) PB3 (MOSI/OC2) PB2 (SS/OC1B) PB1 (OC1A) PDIP 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 MLF Top View (INT1) PD3 (XCK/T0) PD4 GND VCC GND VCC (XTAL1/TOSC1) PB6 (XTAL2/TOSC2) PB7 PC1 (ADC1) PC0 (ADC0) ADC7 GND AREF ADC6 AVCC PB5 (SCK) (T1) PD5 (AIN0) PD6 (AIN1) PD7 (ICP1) PB0 (OC1A) PB1 (SS/OC1B) PB2 (MOSI/OC2) PB3 (MISO) PB4 PD2 (INT0) PD1 (TXD) PD0 (RXD) PC6 (RESET) PC5 (ADC5/SCL) PC4 (ADC4/SDA) PC3 (ADC3) PC2 (ADC2) NOTE: The large center pad underneath the MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the PCB to ensure good mechanical stability. If the center pad is left unconneted, the package might loosen from the PCB.ATmega8A [DATASHEET] 3 8159E–AVR–02/2013 2. Overview The Atmel®AVR® ATmega8A is a low-power CMOS 8-bit microcontroller based on the AVR RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega8A achieves throughputs approaching 1 MIPS per MHz, allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram INTERNAL OSCILLATOR OSCILLATOR WATCHDOG TIMER MCU CTRL. & TIMING OSCILLATOR TIMERS/ COUNTERS INTERRUPT UNIT STACK POINTER EEPROM SRAM STATUS REGISTER USART PROGRAM COUNTER PROGRAM FLASH INSTRUCTION REGISTER INSTRUCTION DECODER PROGRAMMING LOGIC SPI ADC INTERFACE COMP. INTERFACE PORTC DRIVERS/BUFFERS PORTC DIGITAL INTERFACE GENERAL PURPOSE REGISTERS X Y Z ALU + - PORTB DRIVERS/BUFFERS PORTB DIGITAL INTERFACE PORTD DIGITAL INTERFACE PORTD DRIVERS/BUFFERS XTAL1 XTAL2 CONTROL LINES VCC GND MUX & ADC AGND AREF PC0 - PC6 PB0 - PB7 PD0 - PD7 AVR CPU TWI RESETATmega8A [DATASHEET] 4 8159E–AVR–02/2013 The Atmel®AVR® AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATmega8A provides the following features: 8K bytes of In-System Programmable Flash with Read-WhileWrite capabilities, 512 bytes of EEPROM, 1K byte of SRAM, 23 general purpose I/O lines, 32 general purpose working registers, three flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, a byte oriented Two-wire Serial Interface, a 6-channel ADC (eight channels in TQFP and QFN/MLF packages) with 10-bit accuracy, a programmable Watchdog Timer with Internal Oscillator, an SPI serial port, and five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next Interrupt or Hardware Reset. In Power-save mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except asynchronous timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low-power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The Flash Program memory can be reprogrammed In-System through an SPI serial interface, by a conventional non-volatile memory programmer, or by an On-chip boot program running on the AVR core. The boot program can use any interface to download the application program in the Application Flash memory. Software in the Boot Flash Section will continue to run while the Application Flash Section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega8A is a powerful microcontroller that provides a highly-flexible and cost-effective solution to many embedded control applications. The Atmel AVR ATmega8A is supported with a full suite of program and system development tools, including C compilers, macro assemblers, program simulators and evaluation kits. 2.2 Pin Descriptions 2.2.1 VCC Digital supply voltage. 2.2.2 GND Ground. 2.2.3 Port B (PB7:PB0) – XTAL1/XTAL2/TOSC1/TOSC2 Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Depending on the clock selection fuse settings, PB6 can be used as input to the inverting Oscillator amplifier and input to the internal clock operating circuit. Depending on the clock selection fuse settings, PB7 can be used as output from the inverting Oscillator amplifier. If the Internal Calibrated RC Oscillator is used as chip clock source, PB7:6 is used as TOSC2:1 input for the Asynchronous Timer/Counter2 if the AS2 bit in ASSR is set.ATmega8A [DATASHEET] 5 8159E–AVR–02/2013 The various special features of Port B are elaborated in “Alternate Functions of Port B” on page 56 and “System Clock and Clock Options” on page 24. 2.2.4 Port C (PC5:PC0) Port C is an 7-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. 2.2.5 PC6/RESET If the RSTDISBL Fuse is programmed, PC6 is used as an I/O pin. Note that the electrical characteristics of PC6 differ from those of the other pins of Port C. If the RSTDISBL Fuse is unprogrammed, PC6 is used as a Reset input. A low level on this pin for longer than the minimum pulse length will generate a Reset, even if the clock is not running. The minimum pulse length is given in Table 26-3 on page 228. Shorter pulses are not guaranteed to generate a Reset. The various special features of Port C are elaborated on page 59. 2.2.6 Port D (PD7:PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATmega8A as listed on page 61. 2.2.7 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in Table 26-3 on page 228. Shorter pulses are not guaranteed to generate a reset. 2.2.8 AVCC AVCC is the supply voltage pin for the A/D Converter, Port C (3:0), and ADC (7:6). It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. Note that Port C (5:4) use digital supply voltage, VCC. 2.2.9 AREF AREF is the analog reference pin for the A/D Converter. 2.2.10 ADC7:6 (TQFP and QFN/MLF Package Only) In the TQFP and QFN/MLF package, ADC7:6 serve as analog inputs to the A/D converter. These pins are powered from the analog supply and serve as 10-bit ADC channels.ATmega8A [DATASHEET] 6 8159E–AVR–02/2013 3. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. Note: 1. 4. Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 5. About Code Examples This datasheet contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. 6. Capacitive touch sensing The Atmel® QTouch® Library provides a simple to use solution to realize touch sensitive interfaces on most Atmel AVR® microcontrollers. The QTouch Library includes support for the QTouch and QMatrix® acquisition methods. Touch sensing can be added to any application by linking the appropriate Atmel QTouch Library for the AVR Microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the touch sensing API’s to retrieve the channel information and determine the touch sensor states. The QTouch Library is FREE and downloadable from the Atmel website at the following location: www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the Atmel QTouch Library User Guide - also available for download from the Atmel website.ATmega8A [DATASHEET] 7 8159E–AVR–02/2013 7. AVR CPU Core 7.1 Overview This section discusses the Atmel®AVR® core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. Figure 7-1. Block Diagram of the AVR MCU Architecture In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the Program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the Program memory. This concept enables instructions to be executed in every clock cycle. The Program memory is In-System Reprogrammable Flash memory. The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash Program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. Flash Program Memory Instruction Register Instruction Decoder Program Counter Control Lines 32 x 8 General Purpose Registrers ALU Status and Control I/O Lines EEPROM Data Bus 8-bit Data SRAM Direct Addressing Indirect Addressing Interrupt Unit SPI Unit Watchdog Timer Analog Comparator i/O Module 2 i/O Module1 i/O Module nATmega8A [DATASHEET] 8 8159E–AVR–02/2013 The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. The Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every Program memory address contains a 16- or 32-bit instruction. Program Flash memory space is divided in two sections, the Boot program section and the Application program section. Both sections have dedicated Lock Bits for write and read/write protection. The SPM instruction that writes into the Application Flash memory section must reside in the Boot program section. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the reset routine (before subroutines or interrupts are executed). The Stack Pointer SP is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional global interrupt enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. 7.2 Arithmetic Logic Unit – ALU The high-performance Atmel®AVR® ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction Set” section for a detailed description. 7.3 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. 7.3.1 SREG – The AVR Status Register Bit 7 6 5 4 3 2 1 0 I T H S V N Z C SREG Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 9 8159E–AVR–02/2013 • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the Instruction Set Reference. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry is useful in BCD arithmetic. See the “Instruction Set Description” for detailed information. • Bit 4 – S: Sign Bit, S = N V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Description” for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Description” for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 0 – C: Carry Flag The Carry Flag C indicates a Carry in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. 7.4 General Purpose Register File The Register File is optimized for the Atmel®AVR® Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input. • Two 8-bit output operands and one 8-bit result input. • Two 8-bit output operands and one 16-bit result input. • One 16-bit output operand and one 16-bit result input. Figure 7-2 shows the structure of the 32 general purpose working registers in the CPU.ATmega8A [DATASHEET] 10 8159E–AVR–02/2013 Figure 7-2. AVR CPU General Purpose Working Registers Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 7-2, each register is also assigned a Data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y-, and Z-pointer Registers can be set to index any register in the file. 7.4.1 The X-register, Y-register and Z-register The registers R26:R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the Data Space. The three indirect address registers X, Y and Z are defined as described in Figure 7-3. Figure 7-3. The X-, Y- and Z-Registers In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the Instruction Set Reference for details). 7.5 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. Note that the Stack is implemented as growing from higher to lower memory 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 … R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte 15 XH XL 0 X-register 7 0 7 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 0 7 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 7 0 7 0 R31 (0x1F) R30 (0x1E)ATmega8A [DATASHEET] 11 8159E–AVR–02/2013 locations. The Stack Pointer Register always points to the top of the Stack. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. A Stack PUSH command will decrease the Stack Pointer. The Stack in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. Initial Stack Pointer value equals the last address of the internal SRAM and the Stack Pointer must be set to point above start of the SRAM, see Figure 8-2 on page 16. See Table 7-1 for Stack Pointer details. The Atmel®AVR® Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 7.5.1 SPH and SPL – Stack Pointer High and Low Register 7.6 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The Atmel®AVR®CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 7-4 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Table 7-1. Stack Pointer instructions Instruction Stack pointer Description PUSH Decremented by 1 Data is pushed onto the stack CALL ICALL RCALL Decremented by 2 Return address is pushed onto the stack with a subroutine call or interrupt POP Incremented by 1 Data is popped from the stack RET RETI Incremented by 2 Return address is popped from the stack with return from subroutine or return from interrupt Bit 15 14 13 12 11 10 9 8 SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 76543210 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 00000000ATmega8A [DATASHEET] 12 8159E–AVR–02/2013 Figure 7-4. The Parallel Instruction Fetches and Instruction Executions Figure 7-5 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 7-5. Single Cycle ALU Operation 7.7 Reset and Interrupt Handling The Atmel®AVR® provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate Program Vector in the Program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. Depending on the Program Counter value, interrupts may be automatically disabled when Boot Lock Bits BLB02 or BLB12 are programmed. This feature improves software security. See the section “Memory Programming” on page 207 for details. The lowest addresses in the Program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of Vectors is shown in “Interrupts” on page 44. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of the boot Flash section by setting the Interrupt Vector Select (IVSEL) bit in the General Interrupt Control Register (GICR). Refer to “Interrupts” on page 44 for more information. The Reset Vector can also be moved to the start of the boot Flash section by programming the BOOTRST Fuse, see “Boot Loader Support – Read-While-Write Self-Programming” on page 194. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt clk 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch T1 T2 T3 T4 CPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back T1 T2 T3 T4 clkCPUATmega8A [DATASHEET] 13 8159E–AVR–02/2013 handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the global interrupt enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the global interrupt enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence. When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in the following example. Assembly Code Example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMWE ; start EEPROM write sbi EECR, EEWE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ _CLI(); EECR |= (1< xxx :. :. :. Table 12-2. Reset and Interrupt Vectors Placement BOOTRST(1) IVSEL Reset Address Interrupt Vectors Start Address 1 0 0x000 0x001 1 1 0x000 Boot Reset Address + 0x001 0 0 Boot Reset Address 0x001 0 1 Boot Reset Address Boot Reset Address + 0x001ATmega8A [DATASHEET] 46 8159E–AVR–02/2013 When the BOOTRST Fuse is unprogrammed, the boot section size set to 2K bytes and the IVSEL bit in the GICR Register is set before any interrupts are enabled, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: AddressLabels Code Comments $000 rjmp RESET ; Reset handler ; $001 RESET:ldi r16,high(RAMEND); Main program start $002 out SPH,r16 ; Set Stack Pointer to top of RAM $003 ldi r16,low(RAMEND) $004 out SPL,r16 $005 sei ; Enable interrupts $006 xxx ; .org $c01 $c01 rjmp EXT_INT0 ; IRQ0 Handler $c02 rjmp EXT_INT1 ; IRQ1 Handler :. :. :. ; $c12 rjmp SPM_RDY ; Store Program Memory Ready Handler When the BOOTRST Fuse is programmed and the boot section size set to 2K bytes, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: AddressLabels Code Comments .org $001 $001 rjmp EXT_INT0 ; IRQ0 Handler $002 rjmp EXT_INT1 ; IRQ1 Handler :. :. :. ; $012 rjmp SPM_RDY ; Store Program Memory Ready Handler ; .org $c00 $c00 rjmp RESET ; Reset handler ; $c01 RESET:ldi r16,high(RAMEND); Main program start $c02 out SPH,r16 ; Set Stack Pointer to top of RAM $c03 ldi r16,low(RAMEND) $c04 out SPL,r16 $c05 sei ; Enable interrupts $c06 xxxATmega8A [DATASHEET] 47 8159E–AVR–02/2013 When the BOOTRST Fuse is programmed, the boot section size set to 2K bytes, and the IVSEL bit in the GICR Register is set before any interrupts are enabled, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: AddressLabels Code Comments ; .org $c00 $c00 rjmp RESET ; Reset handler $c01 rjmp EXT_INT0 ; IRQ0 Handler $c02 rjmp EXT_INT1 ; IRQ1 Handler :. :. :. ; $c12 rjmp SPM_RDY ; Store Program Memory Ready Handler $c13 RESET: ldi r16,high(RAMEND); Main program start $c14 out SPH,r16 ; Set Stack Pointer to top of RAM $c15 ldi r16,low(RAMEND) $c16 out SPL,r16 $c17 sei ; Enable interrupts $c18 xxx 12.1.1 Moving Interrupts Between Application and Boot Space The General Interrupt Control Register controls the placement of the Interrupt Vector table. 12.2 Register Description 12.2.1 GICR – General Interrupt Control Register • Bit 1 – IVSEL: Interrupt Vector Select When the IVSEL bit is cleared (zero), the Interrupt Vectors are placed at the start of the Flash memory. When this bit is set (one), the Interrupt Vectors are moved to the beginning of the Boot Loader section of the Flash. The actual address of the start of the boot Flash section is determined by the BOOTSZ Fuses. Refer to the section “Boot Loader Support – Read-While-Write Self-Programming” on page 194 for details. To avoid unintentional changes of Interrupt Vector tables, a special write procedure must be followed to change the IVSEL bit: 1. Write the Interrupt Vector Change Enable (IVCE) bit to one. 2. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE. Interrupts will automatically be disabled while this sequence is executed. Interrupts are disabled in the cycle IVCE is set, and they remain disabled until after the instruction following the write to IVSEL. If IVSEL is not written, interrupts remain disabled for four cycles. The I-bit in the Status Register is unaffected by the automatic disabling. Note: If Interrupt Vectors are placed in the Boot Loader section and Boot Lock bit BLB02 is programmed, interrupts are disabled while executing from the Application section. If Interrupt Vectors are placed in the Application section and Boot Lock bit BLB12 is programed, interrupts are disabled while executing from the Boot Loader section. Refer to the section “Boot Loader Support – Read-While-Write Self-Programming” on page 194 for details on Boot Lock Bits. Bit 7 6 5 4 3 2 1 0 INT1 INT0 – – – – IVSEL IVCE GICR Read/Write R/W R/W R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 48 8159E–AVR–02/2013 • Bit 0 – IVCE: Interrupt Vector Change Enable The IVCE bit must be written to logic one to enable change of the IVSEL bit. IVCE is cleared by hardware four cycles after it is written or when IVSEL is written. Setting the IVCE bit will disable interrupts, as explained in the IVSEL description above. See Code Example below. Assembly Code Example Move_interrupts: ; Enable change of Interrupt Vectors ldi r16, (1< CSn2:0 > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution. However, care must be taken if the other Timer/Counter that shares the same prescaler also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is connected to. 16.4 External Clock Source An external clock source applied to the T1/T0 pin can be used as Timer/Counter clock (clkT1/clkT0). The T1/T0 pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 16-1 shows a functional equivalent block diagram of the T1/T0 synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkT1/clkT0 pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 16-1. T1/T0 Pin Sampling The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the T1/T0 pin to the counter is updated. Tn_sync (To Clock Select Logic) Synchronization Edge Detector D Q D Q LE Tn D Q clkI/OATmega8A [DATASHEET] 72 8159E–AVR–02/2013 Enabling and disabling of the clock input must be done when T1/T0 has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 16-2. Prescaler for Timer/Counter0 and Timer/Counter1(1) Note: 1. The synchronization logic on the input pins (T1/T0) is shown in Figure 16-1. 16.5 Register Description 16.5.1 SFIOR – Special Function IO Register • Bit 0 – PSR10: Prescaler Reset Timer/Counter1 and Timer/Counter0 When this bit is written to one, the Timer/Counter1 and Timer/Counter0 prescaler will be reset. The bit will be cleared by hardware after the operation is performed. Writing a zero to this bit will have no effect. Note that Timer/Counter1 and Timer/Counter0 share the same prescaler and a reset of this prescaler will affect both timers. This bit will always be read as zero. PSR10 Clear clkT1 clkT0 T1 T0 clkI/O Synchronization Synchronization Bit 7 6 5 4 3 2 1 0 – – – – ACME PUD PSR2 PSR10 SFIOR Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 73 8159E–AVR–02/2013 17. 16-bit Timer/Counter1 17.1 Features • True 16-bit Design (i.e., allows 16-bit PWM) • Two Independent Output Compare Units • Double Buffered Output Compare Registers • One Input Capture Unit • Input Capture Noise Canceler • Clear Timer on Compare Match (Auto Reload) • Glitch-free, Phase Correct Pulse Width Modulator (PWM) • Variable PWM Period • Frequency Generator • External Event Counter • Four Independent Interrupt Sources (TOV1, OCF1A, OCF1B, and ICF1) 17.2 Overview The 16-bit Timer/Counter unit allows accurate program execution timing (event management), wave generation, and signal timing measurement. Most register and bit references in this section are written in general form. A lower case “n” replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit channel. However, when using the register or bit defines in a program, the precise form must be used i.e., TCNT1 for accessing Timer/Counter1 counter value and so on. A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 17-1. For the actual placement of I/O pins, refer to “Pin Configurations” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “Register Description” on page 92.ATmega8A [DATASHEET] 74 8159E–AVR–02/2013 Figure 17-1. 16-bit Timer/Counter Block Diagram(1) Note: 1. Refer to “Pin Configurations” on page 2, Table 13-2 on page 56, and Table 13-8 on page 61 for Timer/Counter1 pin placement and description. 17.2.1 Registers The Timer/Counter (TCNT1), Output Compare Registers (OCR1A/B), and Input Capture Register (ICR1) are all 16-bit registers. Special procedures must be followed when accessing the 16-bit registers. These procedures are described in the section “Accessing 16-bit Registers” on page 75. The Timer/Counter Control Registers (TCCR1A/B) are 8-bit registers and have no CPU access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are all visible in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure since these registers are shared by other timer units. The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on the T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the clock select logic is referred to as the timer clock (clkT1). The double buffered Output Compare Registers (OCR1A/B) are compared with the Timer/Counter value at all time. The result of the compare can be used by the waveform generator to generate a PWM or variable frequency output on the Output Compare Pin (OC1A/B). See “Output Compare Units” on page 81. The Compare Match event will also set the Compare Match Flag (OCF1A/B) which can be used to generate an Output Compare interrupt request. Clock Select Timer/Counter DATA BUS OCRnA OCRnB ICRn = = TCNTn Waveform Generation Waveform Generation OCnA OCnB Noise Canceler ICPn = Fixed TOP Values Edge Detector Control Logic = 0 TOP BOTTOM Count Clear Direction TOVn (Int. Req.) OCFnA (Int. Req.) OCFnB (Int.Req.) ICFn (Int.Req.) TCCRnA TCCRnB ( From Analog Comparator Ouput ) Tn Edge Detector ( From Prescaler ) clkTnATmega8A [DATASHEET] 75 8159E–AVR–02/2013 The Input Capture Register can capture the Timer/Counter value at a given external (edge triggered) event on either the Input Capture Pin (ICP1) or on the Analog Comparator pins (see “Analog Comparator” on page 179). The Input Capture unit includes a digital filtering unit (Noise Canceler) for reducing the chance of capturing noise spikes. The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined by either the OCR1A Register, the ICR1 Register, or by a set of fixed values. When using OCR1A as TOP value in a PWM mode, the OCR1A Register can not be used for generating a PWM output. However, the TOP value will in this case be double buffered allowing the TOP value to be changed in run time. If a fixed TOP value is required, the ICR1 Register can be used as an alternative, freeing the OCR1A to be used as PWM output. 17.2.2 Definitions The following definitions are used extensively throughout the document: 17.2.3 Compatibility The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bit AVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier version regarding: • All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt Registers. • Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers. • Interrupt Vectors. • The following control bits have changed name, but have same functionality and register location: • PWM10 is changed to WGM10. • PWM11 is changed to WGM11. • CTC1 is changed to WGM12. The following bits are added to the 16-bit Timer/Counter Control Registers: • FOC1A and FOC1B are added to TCCR1A. • WGM13 is added to TCCR1B. The 16-bit Timer/Counter has improvements that will affect the compatibility in some special cases. 17.3 Accessing 16-bit Registers The TCNT1, OCR1A/B, and ICR1 are 16-bit registers that can be accessed by the AVR CPU via the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations. The 16-bit timer has a single 8-bit register for temporary storing of the High byte of the 16-bit access. The same temporary register is shared between all 16-bit registers within the 16-bit timer. Accessing the Low byte triggers the 16-bit read or write operation. When the Low byte of a 16-bit register is written by the CPU, the High byte stored in the temporary register, and the Low byte written are both copied into the 16-bit register in the same clock cycle. When the Low byte of a 16-bit register is read by the CPU, the High byte of the 16-bit register is copied into the temporary register in the same clock cycle as the Low byte is read. Table 17-1. Definitions BOTTOM The counter reaches the BOTTOM when it becomes 0x0000. MAX The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be one of the fixed values: 0x00FF, 0x01FF, or 0x03FF, or to the value stored in the OCR1A or ICR1 Register. The assignment is dependent of the mode of operation.ATmega8A [DATASHEET] 76 8159E–AVR–02/2013 Not all 16-bit accesses uses the temporary register for the High byte. Reading the OCR1A/B 16-bit registers does not involve using the temporary register. To do a 16-bit write, the High byte must be written before the Low byte. For a 16-bit read, the Low byte must be read before the High byte. The following code examples show how to access the 16-bit Timer Registers assuming that no interrupts updates the temporary register. The same principle can be used directly for accessing the OCR1A/B and ICR1 Registers. Note that when using “C”, the compiler handles the 16-bit access. Note: 1. See “About Code Examples” on page 6. The assembly code example returns the TCNT1 value in the r17:r16 Register pair. It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt occurs between the two instructions accessing the 16-bit register, and the interrupt code updates the temporary register by accessing the same or any other of the 16-bit Timer Registers, then the result of the access outside the interrupt will be corrupted. Therefore, when both the main code and the interrupt code update the temporary register, the main code must disable the interrupts during the 16-bit access. Assembly Code Example(1) :. ; Set TCNT1 to 0x01FF ldi r17,0x01 ldi r16,0xFF out TCNT1H,r17 out TCNT1L,r16 ; Read TCNT1 into r17:r16 in r16,TCNT1L in r17,TCNT1H :. C Code Example(1) unsigned int i; :. /* Set TCNT1 to 0x01FF */ TCNT1 = 0x1FF; /* Read TCNT1 into i */ i = TCNT1; :.ATmega8A [DATASHEET] 77 8159E–AVR–02/2013 The following code examples show how to do an atomic read of the TCNT1 Register contents. Reading any of the OCR1A/B or ICR1 Registers can be done by using the same principle. Note: 1. See “About Code Examples” on page 6. The assembly code example returns the TCNT1 value in the r17:r16 Register pair. Assembly Code Example(1) TIM16_ReadTCNT1: ; Save Global Interrupt Flag in r18,SREG ; Disable interrupts cli ; Read TCNT1 into r17:r16 in r16,TCNT1L in r17,TCNT1H ; Restore Global Interrupt Flag out SREG,r18 ret C Code Example(1) unsigned int TIM16_ReadTCNT1( void ) { unsigned char sreg; unsigned int i; /* Save Global Interrupt Flag */ sreg = SREG; /* Disable interrupts */ _CLI(); /* Read TCNT1 into i */ i = TCNT1; /* Restore Global Interrupt Flag */ SREG = sreg; return i; }ATmega8A [DATASHEET] 78 8159E–AVR–02/2013 The following code examples show how to do an atomic write of the TCNT1 Register contents. Writing any of the OCR1A/B or ICR1 Registers can be done by using the same principle. Note: 1. See “About Code Examples” on page 6. The assembly code example requires that the r17:r16 Register pair contains the value to be written to TCNT1. 17.3.1 Reusing the Temporary High Byte Register If writing to more than one 16-bit register where the High byte is the same for all registers written, then the High byte only needs to be written once. However, note that the same rule of atomic operation described previously also applies in this case. 17.4 Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal or an external clock source. The clock source is selected by the clock select logic which is controlled by the clock select (CS12:0) bits located in the Timer/Counter Control Register B (TCCR1B). For details on clock sources and prescaler, see “Timer/Counter0 and Timer/Counter1 Prescalers” on page 71. 17.5 Counter Unit The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit. Figure 17-2 shows a block diagram of the counter and its surroundings. Assembly Code Example(1) TIM16_WriteTCNT1: ; Save Global Interrupt Flag in r18,SREG ; Disable interrupts cli ; Set TCNT1 to r17:r16 out TCNT1H,r17 out TCNT1L,r16 ; Restore Global Interrupt Flag out SREG,r18 ret C Code Example(1) void TIM16_WriteTCNT1( unsigned int i ) { unsigned char sreg; unsigned int i; /* Save Global Interrupt Flag */ sreg = SREG; /* Disable interrupts */ _CLI(); /* Set TCNT1 to i */ TCNT1 = i; /* Restore Global Interrupt Flag */ SREG = sreg; }ATmega8A [DATASHEET] 79 8159E–AVR–02/2013 Figure 17-2. Counter Unit Block Diagram Signal description (internal signals): count Increment or decrement TCNT1 by 1. direction Select between increment and decrement. clear Clear TCNT1 (set all bits to zero). clkT1 Timer/Counter clock. TOP Signalize that TCNT1 has reached maximum value. BOTTOM Signalize that TCNT1 has reached minimum value (zero). The 16-bit counter is mapped into two 8-bit I/O memory locations: counter high (TCNT1H) containing the upper eight bits of the counter, and Counter Low (TCNT1L) containing the lower eight bits. The TCNT1H Register can only be indirectly accessed by the CPU. When the CPU does an access to the TCNT1H I/O location, the CPU accesses the High byte temporary register (TEMP). The temporary register is updated with the TCNT1H value when the TCNT1L is read, and TCNT1H is updated with the temporary register value when TCNT1L is written. This allows the CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus. It is important to notice that there are special cases of writing to the TCNT1 Register when the counter is counting that will give unpredictable results. The special cases are described in the sections where they are of importance. Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT1). The clkT1 can be generated from an external or internal clock source, selected by the clock select bits (CS12:0). When no clock source is selected (CS12:0 = 0) the timer is stopped. However, the TCNT1 value can be accessed by the CPU, independent of whether clkT1 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the Waveform Generation mode bits (WGM13:0) located in the Timer/Counter Control Registers A and B (TCCR1A and TCCR1B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare Outputs OC1x. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 84. The Timer/Counter Overflow (TOV1) fLag is set according to the mode of operation selected by the WGM13:0 bits. TOV1 can be used for generating a CPU interrupt. 17.6 Input Capture Unit The Timer/Counter incorporates an Input Capture unit that can capture external events and give them a timestamp indicating time of occurrence. The external signal indicating an event, or multiple events, can be applied via the ICP1 pin or alternatively, via the Analog Comparator unit. The time-stamps can then be used to calculate freTEMP (8-bit) DATA BUS (8-bit) TCNTn (16-bit Counter) TCNTnH (8-bit) TCNTnL (8-bit) Control Logic count clear direction TOVn (Int. Req.) Clock Select TOP BOTTOM Tn Edge Detector ( From Prescaler ) clkTnATmega8A [DATASHEET] 80 8159E–AVR–02/2013 quency, duty-cycle, and other features of the signal applied. Alternatively the time-stamps can be used for creating a log of the events. The Input Capture unit is illustrated by the block diagram shown in Figure 17-3. The elements of the block diagram that are not directly a part of the Input Capture unit are gray shaded. The small “n” in register and bit names indicates the Timer/Counter number. Figure 17-3. Input Capture Unit Block Diagram When a change of the logic level (an event) occurs on the Input Capture Pin (ICP1), alternatively on the Analog Comparator Output (ACO), and this change confirms to the setting of the edge detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter (TCNT1) is written to the Input Capture Register (ICR1). The Input Capture Flag (ICF1) is set at the same system clock as the TCNT1 value is copied into ICR1 Register. If enabled (TICIE1 = 1), the Input Capture Flag generates an Input Capture interrupt. The ICF1 Flag is automatically cleared when the interrupt is executed. Alternatively the ICF1 Flag can be cleared by software by writing a logical one to its I/O bit location. Reading the 16-bit value in the Input Capture Register (ICR1) is done by first reading the Low byte (ICR1L) and then the High byte (ICR1H). When the Low byte is read the High byte is copied into the High byte temporary register (TEMP). When the CPU reads the ICR1H I/O location it will access the TEMP Register. The ICR1 Register can only be written when using a Waveform Generation mode that utilizes the ICR1 Register for defining the counter’s TOP value. In these cases the Waveform Generation mode (WGM13:0) bits must be set before the TOP value can be written to the ICR1 Register. When writing the ICR1 Register the High byte must be written to the ICR1H I/O location before the Low byte is written to ICR1L. For more information on how to access the 16-bit registers refer to “Accessing 16-bit Registers” on page 75. 17.6.1 Input Capture Pin Source The main trigger source for the Input Capture unit is the Input Capture Pin (ICP1). Timer/Counter 1 can alternatively use the Analog Comparator Output as trigger source for the Input Capture unit. The Analog Comparator is selected as trigger source by setting the Analog Comparator Input Capture (ACIC) bit in the Analog Comparator ICFn (Int. Req.) Analog Comparator WRITE ICRn (16-bit Register) ICRnH (8-bit) Noise Canceler ICPn Edge Detector TEMP (8-bit) DATA BUS (8-bit) ICRnL (8-bit) TCNTn (16-bit Counter) TCNTnH (8-bit) TCNTnL (8-bit) ACO* ACIC* ICNC ICESATmega8A [DATASHEET] 81 8159E–AVR–02/2013 Control and Status Register (ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flag must therefore be cleared after the change. Both the Input Capture Pin (ICP1) and the Analog Comparator Output (ACO) inputs are sampled using the same technique as for the T1 pin (Figure 16-1 on page 71). The edge detector is also identical. However, when the noise canceler is enabled, additional logic is inserted before the edge detector, which increases the delay by four system clock cycles. Note that the input of the noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Waveform Generation mode that uses ICR1 to define TOP. An Input Capture can be triggered by software by controlling the port of the ICP1 pin. 17.6.2 Noise Canceler The noise canceler improves noise immunity by using a simple digital filtering scheme. The noise canceler input is monitored over four samples, and all four must be equal for changing the output that in turn is used by the edge detector. The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNC1) bit in Timer/Counter Control Register B (TCCR1B). When enabled the noise canceler introduces additional four system clock cycles of delay from a change applied to the input, to the update of the ICR1 Register. The noise canceler uses the system clock and is therefore not affected by the prescaler. 17.6.3 Using the Input Capture Unit The main challenge when using the Input Capture unit is to assign enough processor capacity for handling the incoming events. The time between two events is critical. If the processor has not read the captured value in the ICR1 Register before the next event occurs, the ICR1 will be overwritten with a new value. In this case the result of the capture will be incorrect. When using the Input Capture interrupt, the ICR1 Register should be read as early in the interrupt handler routine as possible. Even though the Input Capture interrupt has relatively high priority, the maximum interrupt response time is dependent on the maximum number of clock cycles it takes to handle any of the other interrupt requests. Using the Input Capture unit in any mode of operation when the TOP value (resolution) is actively changed during operation, is not recommended. Measurement of an external signal’s duty cycle requires that the trigger edge is changed after each capture. Changing the edge sensing must be done as early as possible after the ICR1 Register has been read. After a change of the edge, the Input Capture Flag (ICF1) must be cleared by software (writing a logical one to the I/O bit location). For measuring frequency only, the clearing of the ICF1 Flag is not required (if an interrupt handler is used). 17.7 Output Compare Units The 16-bit comparator continuously compares TCNT1 with the Output Compare Register (OCR1x). If TCNT equals OCR1x the comparator signals a match. A match will set the Output Compare Flag (OCF1x) at the next timer clock cycle. If enabled (OCIE1x = 1), the Output Compare Flag generates an Output Compare interrupt. The OCF1x Flag is automatically cleared when the interrupt is executed. Alternatively the OCF1x Flag can be cleared by software by writing a logical one to its I/O bit location. The waveform generator uses the match signal to generate an output according to operating mode set by the Waveform Generation mode (WGM13:0) bits and Compare Output mode (COM1x1:0) bits. The TOP and BOTTOM signals are used by the waveform generator for handling the special cases of the extreme values in some modes of operation (See “Modes of Operation” on page 84.) A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (i.e. counter resolution). In addition to the counter resolution, the TOP value defines the period time for waveforms generated by the waveform generator.ATmega8A [DATASHEET] 82 8159E–AVR–02/2013 Figure 17-4 shows a block diagram of the Output Compare unit. The small “n” in the register and bit names indicates the device number (n = 1 for Timer/Counter 1), and the “x” indicates Output Compare unit (A/B). The elements of the block diagram that are not directly a part of the Output Compare unit are gray shaded. Figure 17-4. Output Compare Unit, Block Diagram The OCR1x Register is double buffered when using any of the twelve Pulse Width Modulation (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR1x Compare Register to either TOP or BOTTOM of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR1x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR1x Buffer Register, and if double buffering is disabled the CPU will access the OCR1x directly. The content of the OCR1x (Buffer or Compare) Register is only changed by a write operation (the Timer/Counter does not update this register automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the High byte temporary register (TEMP). However, it is a good practice to read the Low byte first as when accessing other 16-bit registers. Writing the OCR1x Registers must be done via the TEMP Register since the compare of all 16-bit is done continuously. The High byte (OCR1xH) has to be written first. When the High byte I/O location is written by the CPU, the TEMP Register will be updated by the value written. Then when the Low byte (OCR1xL) is written to the lower eight bits, the High byte will be copied into the upper 8-bits of either the OCR1x buffer or OCR1x Compare Register in the same system clock cycle. For more information of how to access the 16-bit registers refer to “Accessing 16-bit Registers” on page 75. 17.7.1 Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC1x) bit. Forcing Compare Match will not set the OCF1x Flag or reload/clear the timer, but the OC1x pin will be updated as if a real Compare Match had occurred (the COM1x1:0 bits settings define whether the OC1x pin is set, cleared or toggled). OCFnx (Int.Req.) = (16-bit Comparator ) OCRnx Buffer (16-bit Register) OCRnxH Buf. (8-bit) OCnx TEMP (8-bit) DATA BUS (8-bit) OCRnxL Buf. (8-bit) TCNTn (16-bit Counter) TCNTnH (8-bit) TCNTnL (8-bit) WGMn3:0 COMnx1:0 OCRnx (16-bit Register) OCRnxH (8-bit) OCRnxL (8-bit) Waveform Generator TOP BOTTOMATmega8A [DATASHEET] 83 8159E–AVR–02/2013 17.7.2 Compare Match Blocking by TCNT1 Write All CPU writes to the TCNT1 Register will block any Compare Match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR1x to be initialized to the same value as TCNT1 without triggering an interrupt when the Timer/Counter clock is enabled. 17.7.3 Using the Output Compare Unit Since writing TCNT1 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT1 when using any of the Output Compare channels, independent of whether the Timer/Counter is running or not. If the value written to TCNT1 equals the OCR1x value, the Compare Match will be missed, resulting in incorrect waveform generation. Do not write the TCNT1 equal to TOP in PWM modes with variable TOP values. The Compare Match for the TOP will be ignored and the counter will continue to 0xFFFF. Similarly, do not write the TCNT1 value equal to BOTTOM when the counter is downcounting. The setup of the OC1x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC1x value is to use the Force Output Compare (FOC1x) strobe bits in Normal mode. The OC1x Register keeps its value even when changing between Waveform Generation modes. Be aware that the COM1x1:0 bits are not double buffered together with the compare value. Changing the COM1x1:0 bits will take effect immediately. 17.8 Compare Match Output Unit The Compare Output mode (COM1x1:0) bits have two functions. The waveform generator uses the COM1x1:0 bits for defining the Output Compare (OC1x) state at the next Compare Match. Secondly the COM1x1:0 bits control the OC1x pin output source. Figure 17-5 shows a simplified schematic of the logic affected by the COM1x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM1x1:0 bits are shown. When referring to the OC1x state, the reference is for the internal OC1x Register, not the OC1x pin. If a System Reset occur, the OC1x Register is reset to “0”. Figure 17-5. Compare Match Output Unit, Schematic PORT DDR D Q D Q OCnx OCnx Pin D Q Waveform Generator COMnx1 COMnx0 0 1 DATABUS FOCnx clkI/OATmega8A [DATASHEET] 84 8159E–AVR–02/2013 The general I/O port function is overridden by the Output Compare (OC1x) from the waveform generator if either of the COM1x1:0 bits are set. However, the OC1x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC1x pin (DDR_OC1x) must be set as output before the OC1x value is visible on the pin. The port override function is generally independent of the Waveform Generation mode, but there are some exceptions. Refer to Table 17-2, Table 17-3 and Table 17-4 for details. The design of the Output Compare Pin logic allows initialization of the OC1x state before the output is enabled. Note that some COM1x1:0 bit settings are reserved for certain modes of operation. See “Register Description” on page 92. The COM1x1:0 bits have no effect on the Input Capture unit. 17.8.1 Compare Output Mode and Waveform Generation The waveform generator uses the COM1x1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM1x1:0 = 0 tells the waveform generator that no action on the OC1x Register is to be performed on the next Compare Match. For compare output actions in the non-PWM modes refer to Table 17-2 on page 93. For fast PWM mode refer to Table 17-3 on page 93, and for phase correct and phase and frequency correct PWM refer to Table 17-4 on page 93. A change of the COM1x1:0 bits state will have effect at the first Compare Match after the bits are written. For nonPWM modes, the action can be forced to have immediate effect by using the FOC1x strobe bits. 17.9 Modes of Operation The mode of operation (i.e., the behavior of the Timer/Counter and the Output Compare pins) is defined by the combination of the Waveform Generation mode (WGM13:0) and Compare Output mode (COM1x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM1x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM1x1:0 bits control whether the output should be set, cleared or toggle at a Compare Match. See “Compare Match Output Unit” on page 83. For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 91. 17.9.1 Normal Mode The simplest mode of operation is the Normal mode (WGM13:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOV1) will be set in the same timer clock cycle as the TCNT1 becomes zero. The TOV1 Flag in this case behaves like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV1 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Input Capture unit is easy to use in Normal mode. However, observe that the maximum interval between the external events must not exceed the resolution of the counter. If the interval between events are too long, the timer overflow interrupt or the prescaler must be used to extend the resolution for the capture unit. The Output Compare units can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 17.9.2 Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM13:0 = 4 or 12), the OCR1A or ICR1 Register are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT1) matches either the OCR1A (WGM13:0 = 4) or the ICR1 (WGM13:0 = 12). The OCR1A or ICR1 define the top value for theATmega8A [DATASHEET] 85 8159E–AVR–02/2013 counter, hence also its resolution. This mode allows greater control of the Compare Match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 17-6. The counter value (TCNT1) increases until a Compare Match occurs with either OCR1A or ICR1, and then counter (TCNT1) is cleared. Figure 17-6. CTC Mode, Timing Diagram An interrupt can be generated at each time the counter value reaches the TOP value by either using the OCF1A or ICF1 Flag according to the register used to define the TOP value. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing the TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR1A or ICR1 is lower than the current value of TCNT1, the counter will miss the Compare Match. The counter will then have to count to its maximum value (0xFFFF) and wrap around starting at 0x0000 before the Compare Match can occur. In many cases this feature is not desirable. An alternative will then be to use the fast PWM mode using OCR1A for defining TOP (WGM13:0 = 15) since the OCR1A then will be double buffered. For generating a waveform output in CTC mode, the OC1A output can be set to toggle its logical level on each Compare Match by setting the Compare Output mode bits to toggle mode (COM1A1:0 = 1). The OC1A value will not be visible on the port pin unless the data direction for the pin is set to output (DDR_OC1A = 1). The waveform generated will have a maximum frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). The waveform frequency is defined by the following equation: The N variable represents the prescaler factor (1, 8, 64, 256, or 1024). As for the Normal mode of operation, the TOV1 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x0000. 17.9.3 Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM13:0 = 5, 6, 7, 14, or 15) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the Compare Match between TCNT1 and OCR1x, and set at BOTTOM. In inverting Compare Output mode output is set on Compare Match and cleared at BOTTOM. Due to the singleslope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct and phase and frequency correct PWM modes that use dual-slope operation. This high frequency makes the fast PWM TCNTn OCnA (Toggle) OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) Period 1 2 3 4 (COMnA1:0 = 1) f OCnA f clk_I/O 2   N   1 + OCRnA = --------------------------------------------------ATmega8A [DATASHEET] 86 8159E–AVR–02/2013 mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), hence reduces total system cost. The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated by using the following equation: In fast PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 5, 6, or 7), the value in ICR1 (WGM13:0 = 14), or the value in OCR1A (WGM13:0 = 15). The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 17-7. The figure shows fast PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag will be set when a Compare Match occurs. Figure 17-7. Fast PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches TOP. In addition the OCF1A or ICF1 Flag is set at the same timer clock cycle as TOV1 is set when either OCR1A or ICR1 is used for defining the TOP value. If one of the interrupts are enabled, the interrupt handler routine can be used for updating the TOP and compare values. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a Compare Match will never occur between the TCNT1 and the OCR1x. Note that when using fixed TOP values the unused bits are masked to zero when any of the OCR1x Registers are written. The procedure for updating ICR1 differs from updating OCR1A when used for defining the TOP value. The ICR1 Register is not double buffered. This means that if ICR1 is changed to a low value when the counter is running with none or a low prescaler value, there is a risk that the new ICR1 value written is lower than the current value of TCNT1. The result will then be that the counter will miss the Compare Match at the TOP value. The counter will then have to count to the MAX value (0xFFFF) and wrap around starting at 0x0000 before the Compare Match can occur. The OCR1A Register, however, is double buffered. This feature allows the OCR1A I/O location to be written anytime. When the OCR1A I/O location is written the value written will be put into the OCR1A Buffer Register. The OCR1A Compare Register will then be updated with the value in the Buffer Register at the next timer clock cycle RFPWM log  TOP + 1 log  2 = ----------------------------------- TCNTn OCRnx / TOP Update and TOVn Interrupt Flag Set and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) Period 1 2 3 4 5 6 7 8 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3)ATmega8A [DATASHEET] 87 8159E–AVR–02/2013 the TCNT1 matches TOP. The update is done at the same timer clock cycle as the TCNT1 is cleared and the TOV1 Flag is set. Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However, if the base PWM frequency is actively changed (by changing the TOP value), using the OCR1A as TOP is clearly a better choice due to its double buffer feature. In fast PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to 3. See Table 17-3 on page 93. The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the Compare Match between OCR1x and TCNT1, and clearing (or setting) the OC1x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represents special cases when generating a PWM waveform output in the fast PWM mode. If the OCR1x is set equal to BOTTOM (0x0000) the output will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCR1x equal to TOP will result in a constant high or low output (depending on the polarity of the output set by the COM1x1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC1A to toggle its logical level on each Compare Match (COM1A1:0 = 1). This applies only if OCR1A is used to define the TOP value (WGM13:0 = 15). The waveform generated will have a maximum frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). This feature is similar to the OC1A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 17.9.4 Phase Correct PWM Mode The phase correct Pulse Width Modulation or phase correct PWM mode (WGM13:0 = 1, 2, 3, 10, or 11) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the Compare Match between TCNT1 and OCR1x while upcounting, and set on the Compare Match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated by using the following equation: In phase correct PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 1, 2, or 3), the value in ICR1 (WGM13:0 = 10), or the value in OCR1A (WGM13:0 = 11). The counter has then reached the TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 17-8. The figure shows phase correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent f OCnxPWM f clk_I/O N    1 + TOP = ----------------------------------- RPCPWM log  TOP + 1 log  2 = -----------------------------------ATmega8A [DATASHEET] 88 8159E–AVR–02/2013 compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag will be set when a Compare Match occurs. Figure 17-8. Phase Correct PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches BOTTOM. When either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 Flag is set accordingly at the same timer clock cycle as the OCR1x Registers are updated with the double buffer value (at TOP). The Interrupt Flags can be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a Compare Match will never occur between the TCNT1 and the OCR1x. Note that when using fixed TOP values, the unused bits are masked to zero when any of the OCR1x Registers are written. As the third period shown in Figure 17-8 illustrates, changing the TOP actively while the Timer/Counter is running in the Phase Correct mode can result in an unsymmetrical output. The reason for this can be found in the time of update of the OCR1x Register. Since the OCR1x update occurs at TOP, the PWM period starts and ends at TOP. This implies that the length of the falling slope is determined by the previous TOP value, while the length of the rising slope is determined by the new TOP value. When these two values differ the two slopes of the period will differ in length. The difference in length gives the unsymmetrical result on the output. It is recommended to use the Phase and Frequency Correct mode instead of the Phase Correct mode when changing the TOP value while the Timer/Counter is running. When using a static TOP value there are practically no differences between the two modes of operation. In phase correct PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to 3. See Table 17-4 on page 93. The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the Compare Match between OCR1x and TCNT1 when the counter increments, and clearing (or setting) the OC1x Register at Compare Match between OCR1x and TCNT1 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: OCRnx / TOP Update and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) 1 2 3 4 TOVn Interrupt Flag Set (Interrupt on Bottom) TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) f OCnxPCPWM f clk_I/O 2   N TOP = ----------------------------ATmega8A [DATASHEET] 89 8159E–AVR–02/2013 The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. If OCR1A is used to define the TOP value (WMG13:0 = 11) and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle. 17.9.5 Phase and Frequency Correct PWM Mode The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM mode (WGM13:0 = 8 or 9) provides a high resolution phase and frequency correct PWM waveform generation option. The phase and frequency correct PWM mode is, like the phase correct PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the Compare Match between TCNT1 and OCR1x while upcounting, and set on the Compare Match while downcounting. In inverting Compare Output mode, the operation is inverted. The dual-slope operation gives a lower maximum operation frequency compared to the single-slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The main difference between the phase correct, and the phase and frequency correct PWM mode is the time the OCR1x Register is updated by the OCR1x Buffer Register, (see Figure 17-8 and Figure 17-9). The PWM resolution for the phase and frequency correct PWM mode can be defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated using the following equation: In phase and frequency correct PWM mode the counter is incremented until the counter value matches either the value in ICR1 (WGM13:0 = 8), or the value in OCR1A (WGM13:0 = 9). The counter has then reached the TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency correct PWM mode is shown on Figure 17-9. The figure shows phase and frequency correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag will be set when a Compare Match occurs. RPFCPWM log  TOP + 1 log  2 = -----------------------------------ATmega8A [DATASHEET] 90 8159E–AVR–02/2013 Figure 17-9. Phase and Frequency Correct PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV1) is set at the same timer clock cycle as the OCR1x Registers are updated with the double buffer value (at BOTTOM). When either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 Flag set when TCNT1 has reached TOP. The Interrupt Flags can then be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a Compare Match will never occur between the TCNT1 and the OCR1x. As Figure 17-9 shows the output generated is, in contrast to the Phase Correct mode, symmetrical in all periods. Since the OCR1x Registers are updated at BOTTOM, the length of the rising and the falling slopes will always be equal. This gives symmetrical output pulses and is therefore frequency correct. Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However, if the base PWM frequency is actively changed by changing the TOP value, using the OCR1A as TOP is clearly a better choice due to its double buffer feature. In phase and frequency correct PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to 3. See Table 17-4 on page 93. The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the Compare Match between OCR1x and TCNT1 when the counter increments, and clearing (or setting) the OC1x Register at Compare Match between OCR1x and TCNT1 when the counter decrements. The PWM frequency for the output when using phase and frequency correct PWM can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represents special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be set to high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. OCRnx / TOP Update and TOVn Interrupt Flag Set (Interrupt on Bottom) OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) 1 2 3 4 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) f OCnxPFCPWM f clk_I/O 2   N TOP = ----------------------------ATmega8A [DATASHEET] 91 8159E–AVR–02/2013 If OCR1A is used to define the TOP value (WGM13:0 = 9) and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle. 17.10 Timer/Counter Timing Diagrams The Timer/Counter is a synchronous design and the timer clock (clkT1) is therefore shown as a clock enable signal in the following figures. The figures include information on when Interrupt Flags are set, and when the OCR1x Register is updated with the OCR1x buffer value (only for modes utilizing double buffering). Figure 17-10 shows a timing diagram for the setting of OCF1x. Figure 17-10. Timer/Counter Timing Diagram, Setting of OCF1x, no Prescaling Figure 17-11 shows the same timing data, but with the prescaler enabled. Figure 17-11. Timer/Counter Timing Diagram, Setting of OCF1x, with Prescaler (fclk_I/O/8) Figure 17-12 shows the count sequence close to TOP in various modes. When using phase and frequency correct PWM mode the OCR1x Register is updated at BOTTOM. The timing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by BOTTOM+1 and so on. The same renaming applies for modes that set the TOV1 Flag at BOTTOM. clkTn (clkI/O/1) OCFnx clkI/O OCRnx TCNTn OCRnx Value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 OCFnx OCRnx TCNTn OCRnx Value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8)ATmega8A [DATASHEET] 92 8159E–AVR–02/2013 Figure 17-12. Timer/Counter Timing Diagram, no Prescaling Figure 17-13 shows the same timing data, but with the prescaler enabled. Figure 17-13. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) 17.11 Register Description 17.11.1 TCCR1A – Timer/Counter 1 Control Register A • Bit 7:6 – COM1A1:0: Compare Output Mode for channel A • Bit 5:4 – COM1B1:0: Compare Output Mode for channel B The COM1A1:0 and COM1B1:0 control the Output Compare Pins (OC1A and OC1B respectively) behavior. If one or both of the COM1A1:0 bits are written to one, the OC1A output overrides the normal port functionality of the I/O TOVn (FPWM) and ICFn (if used as TOP) OCRnx (Update at TOP) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2 Old OCRnx Value New OCRnx Value TOP - 1 TOP BOTTOM BOTTOM + 1 clkTn (clkI/O/1) clkI/O TOVn (FPWM) and ICFn (if used as TOP) OCRnx (Update at TOP) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2 Old OCRnx Value New OCRnx Value TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) Bit 7 6 5 4 3 2 1 0 COM1A1 COM1A0 COM1B1 COM1B0 FOC1A FOC1B WGM11 WGM10 TCCR1A Read/Write R/W R/W R/W R/W W W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 93 8159E–AVR–02/2013 pin it is connected to. If one or both of the COM1B1:0 bit are written to one, the OC1B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC1A or OC1B pin must be set in order to enable the output driver. When the OC1A or OC1B is connected to the pin, the function of the COM1x1:0 bits is dependent of the WGM13:0 bits setting. Table 17-2 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to a normal or a CTC mode (non-PWM). Table 17-3 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the fast PWM mode. Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. In this case the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 85. for more details. Table 17-4 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the phase correct or the phase and frequency correct, PWM mode. Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. See “Phase Correct PWM Mode” on page 87. for more details. Table 17-2. Compare Output Mode, Non-PWM COM1A1/ COM1B1 COM1A0/ COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 Toggle OC1A/OC1B on Compare Match 1 0 Clear OC1A/OC1B on Compare Match (Set output to low level) 1 1 Set OC1A/OC1B on Compare Match (Set output to high level) Table 17-3. Compare Output Mode, Fast PWM(1) COM1A1/ COM1B1 COM1A0/ COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 WGM13:0 = 15: Toggle OC1A on Compare Match, OC1B disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B disconnected. 1 0 Clear OC1A/OC1B on Compare Match, set OC1A/OC1B at BOTTOM, (non-inverting mode) 1 1 Set OC1A/OC1B on Compare Match, clear OC1A/OC1B at BOTTOM, (inverting mode) Table 17-4. Compare Output Mode, Phase Correct and Phase and Frequency Correct PWM(1) COM1A1/ COM1B1 COM1A0/ COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 WGM13:0 = 9 or 14: Toggle OC1A on Compare Match, OC1B disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B disconnected. 1 0 Clear OC1A/OC1B on Compare Match when up-counting. Set OC1A/OC1B on Compare Match when downcounting. 1 1 Set OC1A/OC1B on Compare Match when up-counting. Clear OC1A/OC1B on Compare Match when downcounting.ATmega8A [DATASHEET] 94 8159E–AVR–02/2013 • Bit 3 – FOC1A: Force Output Compare for channel A • Bit 2 – FOC1B: Force Output Compare for channel B The FOC1A/FOC1B bits are only active when the WGM13:0 bits specifies a non-PWM mode. However, for ensuring compatibility with future devices, these bits must be set to zero when TCCR1A is written when operating in a PWM mode. When writing a logical one to the FOC1A/FOC1B bit, an immediate Compare Match is forced on the waveform generation unit. The OC1A/OC1B output is changed according to its COM1x1:0 bits setting. Note that the FOC1A/FOC1B bits are implemented as strobes. Therefore it is the value present in the COM1x1:0 bits that determine the effect of the forced compare. A FOC1A/FOC1B strobe will not generate any interrupt nor will it clear the timer in Clear Timer on Compare Match (CTC) mode using OCR1A as TOP. The FOC1A/FOC1B bits are always read as zero. • Bit 1:0 – WGM11:0: Waveform Generation Mode Combined with the WGM13:2 bits found in the TCCR1B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 17-5. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and three types of Pulse Width Modulation (PWM) modes. (See “Modes of Operation” on page 84.) Note: 1. The CTC1 and PWM11:0 bit definition names are obsolete. Use the WGM12:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer. Table 17-5. Waveform Generation Mode Bit Description Mode WGM13 WGM12 (CTC1) WGM11 (PWM11) WGM10 (PWM10) Timer/Counter Mode of Operation(1) TOP Update of OCR1x TOV1 Flag Set on 0 0 0 0 0 Normal 0xFFFF Immediate MAX 1 0 0 0 1 PWM, Phase Correct, 8-bit 0x00FF TOP BOTTOM 2 0 0 1 0 PWM, Phase Correct, 9-bit 0x01FF TOP BOTTOM 3 0 0 1 1 PWM, Phase Correct, 10-bit 0x03FF TOP BOTTOM 4 0 1 0 0 CTC OCR1A Immediate MAX 5 0 1 0 1 Fast PWM, 8-bit 0x00FF BOTTOM TOP 6 0 1 1 0 Fast PWM, 9-bit 0x01FF BOTTOM TOP 7 0 1 1 1 Fast PWM, 10-bit 0x03FF BOTTOM TOP 8 1 0 0 0 PWM, Phase and Frequency Correct ICR1 BOTTOM BOTTOM 9 1 0 0 1 PWM, Phase and Frequency Correct OCR1A BOTTOM BOTTOM 10 1 0 1 0 PWM, Phase Correct ICR1 TOP BOTTOM 11 1 0 1 1 PWM, Phase Correct OCR1A TOP BOTTOM 12 1 1 0 0 CTC ICR1 Immediate MAX 13 1 1 0 1 (Reserved) – – – 14 1 1 1 0 Fast PWM ICR1 BOTTOM TOP 15 1 1 1 1 Fast PWM OCR1A BOTTOM TOPATmega8A [DATASHEET] 95 8159E–AVR–02/2013 17.11.2 TCCR1B – Timer/Counter 1 Control Register B • Bit 7 – ICNC1: Input Capture Noise Canceler Setting this bit (to one) activates the Input Capture Noise Canceler. When the noise canceler is activated, the input from the Input Capture Pin (ICP1) is filtered. The filter function requires four successive equal valued samples of the ICP1 pin for changing its output. The Input Capture is therefore delayed by four Oscillator cycles when the noise canceler is enabled. • Bit 6 – ICES1: Input Capture Edge Select This bit selects which edge on the Input Capture Pin (ICP1) that is used to trigger a capture event. When the ICES1 bit is written to zero, a falling (negative) edge is used as trigger, and when the ICES1 bit is written to one, a rising (positive) edge will trigger the capture. When a capture is triggered according to the ICES1 setting, the counter value is copied into the Input Capture Register (ICR1). The event will also set the Input Capture Flag (ICF1), and this can be used to cause an Input Capture Interrupt, if this interrupt is enabled. When the ICR1 is used as TOP value (see description of the WGM13:0 bits located in the TCCR1A and the TCCR1B Register), the ICP1 is disconnected and consequently the Input Capture function is disabled. • Bit 5 – Reserved Bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when TCCR1B is written. • Bit 4:3 – WGM13:2: Waveform Generation Mode See TCCR1A Register description. • Bit 2:0 – CS12:0: Clock Select The three clock select bits select the clock source to be used by the Timer/Counter, see Figure 17-10 and Figure 17-11. If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. Bit 7 6 5 4 3 2 1 0 ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 TCCR1B Read/Write R/W R/W R R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 17-6. Clock Select Bit Description CS12 CS11 CS10 Description 0 0 0 No clock source. (Timer/Counter stopped) 0 0 1 clkI/O/1 (No prescaling) 0 1 0 clkI/O/8 (From prescaler) 0 1 1 clkI/O/64 (From prescaler) 1 0 0 clkI/O/256 (From prescaler) 1 0 1 clkI/O/1024 (From prescaler) 1 1 0 External clock source on T1 pin. Clock on falling edge. 1 1 1 External clock source on T1 pin. Clock on rising edge.ATmega8A [DATASHEET] 96 8159E–AVR–02/2013 17.11.3 TCNT1H and TCNT1L – Timer/Counter 1 The two Timer/Counter I/O locations (TCNT1H and TCNT1L, combined TCNT1) give direct access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To ensure that both the high and Low bytes are read and written simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary High byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 75. Modifying the counter (TCNT1) while the counter is running introduces a risk of missing a Compare Match between TCNT1 and one of the OCR1x Registers. Writing to the TCNT1 Register blocks (removes) the Compare Match on the following timer clock for all compare units. 17.11.4 OCR1AH and OCR1AL– Output Compare Register 1 A 17.11.5 OCR1BH and OCR1BL – Output Compare Register 1 B The Output Compare Registers contain a 16-bit value that is continuously compared with the counter value (TCNT1). A match can be used to generate an Output Compare Interrupt, or to generate a waveform output on the OC1x pin. The Output Compare Registers are 16-bit in size. To ensure that both the high and Low bytes are written simultaneously when the CPU writes to these registers, the access is performed using an 8-bit temporary High byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 75. 17.11.6 ICR1H and ICR1L – Input Capture Register 1 The Input Capture is updated with the counter (TCNT1) value each time an event occurs on the ICP1 pin (or optionally on the Analog Comparator Output for Timer/Counter1). The Input Capture can be used for defining the counter TOP value. The Input Capture Register is 16-bit in size. To ensure that both the high and Low bytes are read simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary High byte Register Bit 7 6 5 4 3 2 1 0 TCNT1[15:8] TCNT1H TCNT1[7:0] TCNT1L Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1A[15:8] OCR1AH OCR1A[7:0] OCR1AL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1B[15:8] OCR1BH OCR1B[7:0] OCR1BL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 ICR1[15:8] ICR1H ICR1[7:0] ICR1L Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 97 8159E–AVR–02/2013 (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 75. 17.11.7 TIMSK(1) – Timer/Counter Interrupt Mask Register Note: 1. This register contains interrupt control bits for several Timer/Counters, but only Timer1 bits are described in this section. The remaining bits are described in their respective timer sections. • Bit 5 – TICIE1: Timer/Counter1, Input Capture Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Input Capture Interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 44) is executed when the ICF1 Flag, located in TIFR, is set. • Bit 4 – OCIE1A: Timer/Counter1, Output Compare A Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Output Compare A match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 44) is executed when the OCF1A Flag, located in TIFR, is set. • Bit 3 – OCIE1B: Timer/Counter1, Output Compare B Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Output Compare B match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 44) is executed when the OCF1B Flag, located in TIFR, is set. • Bit 2 – TOIE1: Timer/Counter1, Overflow Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Overflow Interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 44) is executed when the TOV1 Flag, located in TIFR, is set. 17.11.8 TIFR(1) – Timer/Counter Interrupt Flag Register Note: 1. This register contains flag bits for several Timer/Counters, but only Timer1 bits are described in this section. The remaining bits are described in their respective timer sections. • Bit 5 – ICF1: Timer/Counter1, Input Capture Flag This flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register (ICR1) is set by the WGM13:0 to be used as the TOP value, the ICF1 Flag is set when the counter reaches the TOP value. ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively, ICF1 can be cleared by writing a logic one to its bit location. • Bit 4 – OCF1A: Timer/Counter1, Output Compare A Match Flag This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output Compare Register A (OCR1A). Note that a Forced Output Compare (FOC1A) strobe will not set the OCF1A Flag. Bit 7 6 5 4 3 2 1 0 OCIE2 TOIE2 TICIE1 OCIE1A OCIE1B TOIE1 – TOIE0 TIMSK Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCF2 TOV2 ICF1 OCF1A OCF1B TOV1 – TOV0 TIFR Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 98 8159E–AVR–02/2013 OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is executed. Alternatively, OCF1A can be cleared by writing a logic one to its bit location. • Bit 3 – OCF1B: Timer/Counter1, Output Compare B Match Flag This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output Compare Register B (OCR1B). Note that a Forced Output Compare (FOC1B) strobe will not set the OCF1B Flag. OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is executed. Alternatively, OCF1B can be cleared by writing a logic one to its bit location. • Bit 2 – TOV1: Timer/Counter1, Overflow Flag The setting of this flag is dependent of the WGM13:0 bits setting. In normal and CTC modes, the TOV1 Flag is set when the timer overflows. Refer to Table 17-5 on page 94 for the TOV1 Flag behavior when using another WGM13:0 bit setting. TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed. Alternatively, TOV1 can be cleared by writing a logic one to its bit location.ATmega8A [DATASHEET] 99 8159E–AVR–02/2013 18. 8-bit Timer/Counter2 with PWM and Asynchronous Operation 18.1 Features • Single Channel Counter • Clear Timer on Compare Match (Auto Reload) • Glitch-free, phase Correct Pulse Width Modulator (PWM) • Frequency Generator • 10-bit Clock Prescaler • Overflow and Compare Match Interrupt Sources (TOV2 and OCF2) • Allows Clocking from External 32kHz Watch Crystal Independent of the I/O Clock 18.2 Overview Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 18-1. For the actual placement of I/O pins, refer to “Pin Configurations” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “Register Description” on page 112. Figure 18-1. 8-bit Timer/Counter Block Diagram Timer/Counter DATA BUS = TCNTn Waveform Generation OCn = 0 Control Logic = 0xFF BOTTOM TOP count clear direction TOVn (Int. Req.) OCn (Int. Req.) Synchronization Unit OCRn TCCRn ASSRn Status Flags clkI/O clkASY Synchronized Status Flags asynchronous Mode Select (ASn) TOSC1 T/C Oscillator TOSC2 Prescaler clkTn clkI/OATmega8A [DATASHEET] 100 8159E–AVR–02/2013 18.2.1 Registers The Timer/Counter (TCNT2) and Output Compare Register (OCR2) are 8-bit registers. Interrupt request (shorten as Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure since these registers are shared by other timer units. The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock source the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the clock select logic is referred to as the timer clock (clkT2). The double buffered Output Compare Register (OCR2) is compared with the Timer/Counter value at all times. The result of the compare can be used by the waveform generator to generate a PWM or variable frequency output on the Output Compare Pin (OC2). For details, see “Output Compare Unit” on page 101. The Compare Match event will also set the Compare Flag (OCF2) which can be used to generate an Output Compare interrupt request. 18.2.2 Definitions Many register and bit references in this document are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 2. However, when using the register or bit defines in a program, the precise form must be used (i.e., TCNT2 for accessing Timer/Counter2 counter value and so on). The definitions in Table 18-1 are also used extensively throughout the document. 18.3 Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal synchronous or an external asynchronous clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2 bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “Asynchronous Operation of the Timer/Counter” on page 109. For details on clock sources and prescaler, see “Timer/Counter0 and Timer/Counter1 Prescalers” on page 71. 18.4 Counter Unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 18-2 shows a block diagram of the counter and its surrounding environment. Table 18-1. Definitions BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00). MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR2 Register. The assignment is dependent on the mode of operation.ATmega8A [DATASHEET] 101 8159E–AVR–02/2013 Figure 18-2. Counter Unit Block Diagram Signal description (internal signals): count Increment or decrement TCNT2 by 1. direction Selects between increment and decrement. clear Clear TCNT2 (set all bits to zero). clkT2 Timer/Counter clock. TOP Signalizes that TCNT2 has reached maximum value. BOTTOM Signalizes that TCNT2 has reached minimum value (zero). Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source, selected by the clock select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in the Timer/Counter Control Register (TCCR2). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare Output OC2. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 104. The Timer/Counter Overflow (TOV2) Flag is set according to the mode of operation selected by the WGM21:0 bits. TOV2 can be used for generating a CPU interrupt. 18.5 Output Compare Unit The 8-bit comparator continuously compares TCNT2 with the Output Compare Register (OCR2). Whenever TCNT2 equals OCR2, the comparator signals a match. A match will set the Output Compare Flag (OCF2) at the next timer clock cycle. If enabled (OCIE2 = 1), the Output Compare Flag generates an Output Compare interrupt. The OCF2 Flag is automatically cleared when the interrupt is executed. Alternatively, the OCF2 Flag can be cleared by software by writing a logical one to its I/O bit location. The waveform generator uses the match signal to generate an output according to operating mode set by the WGM21:0 bits and Compare Output mode (COM21:0) bits. The max and bottom signals are used by the waveform generator for handling the special cases of the extreme values in some modes of operation (see “Modes of Operation” on page 104). Figure 18-3 shows a block diagram of the Output Compare unit. DATA BUS TCNTn Control Logic count TOVn (Int. Req.) BOTTOM TOP direction clear TOSC1 T/C Oscillator TOSC2 Prescaler clkI/O clk TnATmega8A [DATASHEET] 102 8159E–AVR–02/2013 Figure 18-3. Output Compare Unit, Block Diagram The OCR2 Register is double buffered when using any of the Pulse Width Modulation (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR2 Compare Register to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR2 Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR2 Buffer Register, and if double buffering is disabled the CPU will access the OCR2 directly. 18.5.1 Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC2) bit. Forcing Compare Match will not set the OCF2 Flag or reload/clear the timer, but the OC2 pin will be updated as if a real Compare Match had occurred (the COM21:0 bits settings define whether the OC2 pin is set, cleared or toggled). 18.5.2 Compare Match Blocking by TCNT2 Write All CPU write operations to the TCNT2 Register will block any Compare Match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR2 to be initialized to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is enabled. 18.5.3 Using the Output Compare Unit Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT2 when using the Output Compare channel, independently of whether the Timer/Counter is running or not. If the value written to TCNT2 equals the OCR2 value, the Compare Match will be OCFn (Int. Req.) = (8-bit Comparator ) OCRn OCxy DATA BUS TCNTn WGMn1:0 Waveform Generator TOP FOCn COMn1:0 BOTTOMATmega8A [DATASHEET] 103 8159E–AVR–02/2013 missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is downcounting. The setup of the OC2 should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC2 value is to use the Force Output Compare (FOC2) strobe bit in Normal mode. The OC2 Register keeps its value even when changing between waveform generation modes. Be aware that the COM21:0 bits are not double buffered together with the compare value. Changing the COM21:0 bits will take effect immediately. 18.6 Compare Match Output Unit The Compare Output mode (COM21:0) bits have two functions. The waveform generator uses the COM21:0 bits for defining the Output Compare (OC2) state at the next Compare Match. Also, the COM21:0 bits control the OC2 pin output source. Figure 18-4 shows a simplified schematic of the logic affected by the COM21:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM21:0 bits are shown. When referring to the OC2 state, the reference is for the internal OC2 Register, not the OC2 pin. Figure 18-4. Compare Match Output Unit, Schematic The general I/O port function is overridden by the Output Compare (OC2) from the waveform generator if either of the COM21:0 bits are set. However, the OC2 pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC2 pin (DDR_OC2) must be set as output before the OC2 value is visible on the pin. The port override function is independent of the Waveform Generation mode. PORT DDR D Q D Q OCn OCn Pin D Q Waveform Generator COMn1 COMn0 0 1 DATABUS FOCn clkI/OATmega8A [DATASHEET] 104 8159E–AVR–02/2013 The design of the Output Compare Pin logic allows initialization of the OC2 state before the output is enabled. Note that some COM21:0 bit settings are reserved for certain modes of operation. See “Register Description” on page 112. 18.6.1 Compare Output Mode and Waveform Generation The Waveform Generator uses the COM21:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM21:0 = 0 tells the waveform generator that no action on the OC2 Register is to be performed on the next Compare Match. For compare output actions in the non-PWM modes refer to Table 18-3 on page 112. For fast PWM mode, refer to Table 18-4 on page 113, and for phase correct PWM refer to Table 18-5 on page 113. A change of the COM21:0 bits state will have effect at the first Compare Match after the bits are written. For nonPWM modes, the action can be forced to have immediate effect by using the FOC2 strobe bits. 18.7 Modes of Operation The mode of operation (i.e., the behavior of the Timer/Counter and the Output Compare pins) is defined by the combination of the Waveform Generation mode (WGM21:0) and Compare Output mode (COM21:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM21:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM21:0 bits control whether the output should be set, cleared, or toggled at a Compare Match (see “Compare Match Output Unit” on page 103). For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 108. 18.7.1 Normal Mode The simplest mode of operation is the Normal mode (WGM21:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8- bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV2 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 18.7.2 Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM21:0 = 2), the OCR2 Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT2) matches the OCR2. The OCR2 defines the top value for the counter, hence also its resolution. This mode allows greater control of the Compare Match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 18-5. The counter value (TCNT2) increases until a Compare Match occurs between TCNT2 and OCR2, and then counter (TCNT2) is cleared.ATmega8A [DATASHEET] 105 8159E–AVR–02/2013 Figure 18-5. CTC Mode, Timing Diagram An interrupt can be generated each time the counter value reaches the TOP value by using the OCF2 Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing the TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR2 is lower than the current value of TCNT2, the counter will miss the Compare Match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the Compare Match can occur. For generating a waveform output in CTC mode, the OC2 output can be set to toggle its logical level on each Compare Match by setting the Compare Output mode bits to toggle mode (COM21:0 = 1). The OC2 value will not be visible on the port pin unless the data direction for the pin is set to output. The waveform generated will have a maximum frequency of fOC2 = fclk_I/O/2 when OCR2 is set to zero (0x00). The waveform frequency is defined by the following equation: The N variable represents the prescaler factor (1, 8, 32, 64, 128, 256, or 1024). As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. 18.7.3 Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM21:0 = 3) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM option by its single-slope operation. The counter counts from BOTTOM to MAX then restarts from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC2) is cleared on the Compare Match between TCNT2 and OCR2, and set at BOTTOM. In inverting Compare Output mode, the output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct PWM mode that uses dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), and therefore reduces total system cost. In fast PWM mode, the counter is incremented until the counter value matches the MAX value. The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 18-6. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2 and TCNT2. TCNTn OCn (Toggle) OCn Interrupt Flag Set Period 1 2 3 4 (COMn1:0 = 1) f OCn f clk_I/O 2   N   1 + OCRn = ----------------------------------------------ATmega8A [DATASHEET] 106 8159E–AVR–02/2013 Figure 18-6. Fast PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches MAX. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2 pin. Setting the COM21:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM21:0 to 3 (see Table 18-4 on page 113). The actual OC2 value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC2 Register at the Compare Match between OCR2 and TCNT2, and clearing (or setting) the OC2 Register at the timer clock cycle the counter is cleared (changes from MAX to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescaler factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2 Register represent special cases when generating a PWM waveform output in the fast PWM mode. If the OCR2 is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2 equal to MAX will result in a constantly high or low output (depending on the polarity of the output set by the COM21:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC2 to toggle its logical level on each Compare Match (COM21:0 = 1). The waveform generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2 is set to zero. This feature is similar to the OC2 toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 18.7.4 Phase Correct PWM Mode The phase correct PWM mode (WGM21:0 = 1) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to MAX and then from MAX to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC2) is cleared on the Compare Match between TCNT2 and OCR2 while upcounting, and set on the Compare Match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation TCNTn OCRn Update and TOVn Interrupt Flag Set Period 1 2 3 OCn OCn (COMn1:0 = 2) (COMn1:0 = 3) OCRn Interrupt Flag Set 4 5 6 7 f OCnPWM f clk_I/O N  256 = ------------------ATmega8A [DATASHEET] 107 8159E–AVR–02/2013 has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The PWM resolution for the phase correct PWM mode is fixed to eight bits. In phase correct PWM mode the counter is incremented until the counter value matches MAX. When the counter reaches MAX, it changes the count direction. The TCNT2 value will be equal to MAX for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 18-7. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2 and TCNT2. Figure 18-7. Phase Correct PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC2 pin. Setting the COM21:0 bits to 2 will produce a non-inverted PWM. An inverted PWM output can be generated by setting the COM21:0 to 3 (see Table 18-5 on page 113). The actual OC2 value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC2 Register at the Compare Match between OCR2 and TCNT2 when the counter increments, and setting (or clearing) the OC2 Register at Compare Match between OCR2 and TCNT2 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescaler factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2 Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR2 is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. TOVn Interrupt Flag Set OCn Interrupt Flag Set 1 2 3 TCNTn Period OCn OCn (COMn1:0 = 2) (COMn1:0 = 3) OCRn Update f OCnPCPWM f clk_I/O N  510 = ------------------ATmega8A [DATASHEET] 108 8159E–AVR–02/2013 At the very start of period 2 in Figure 18-7 OCn has a transition from high to low even though there is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM. There are two cases that give a transition without Compare Match: • OCR2A changes its value from MAX, like in Figure 18-7. When the OCR2A value is MAX the OCn pin value is the same as the result of a down-counting Compare Match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match. • The timer starts counting from a value higher than the one in OCR2A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up. 18.8 Timer/Counter Timing Diagrams The following figures show the Timer/Counter in Synchronous mode, and the timer clock (clkT2) is therefore shown as a clock enable signal. In Asynchronous mode, clkI/O should be replaced by the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are set. Figure 18-8 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. Figure 18-8. Timer/Counter Timing Diagram, no Prescaling Figure 18-9 shows the same timing data, but with the prescaler enabled. Figure 18-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) Figure 18-10 shows the setting of OCF2 in all modes except CTC mode. clkTn (clkI/O/1) TOVn clkI/O TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 TOVn TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8)ATmega8A [DATASHEET] 109 8159E–AVR–02/2013 Figure 18-10. Timer/Counter Timing Diagram, Setting of OCF2, with Prescaler (fclk_I/O/8) Figure 18-11 shows the setting of OCF2 and the clearing of TCNT2 in CTC mode. Figure 18-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match Mode, with Prescaler (fclk_I/O/8) 18.9 Asynchronous Operation of the Timer/Counter 18.9.1 Asynchronous Operation of Timer/Counter2 When Timer/Counter2 operates asynchronously, some considerations must be taken. • Warning: When switching between asynchronous and synchronous clocking of Timer/Counter2, the Timer Registers TCNT2, OCR2, and TCCR2 might be corrupted. A safe procedure for switching clock source is: 1. Disable the Timer/Counter2 interrupts by clearing OCIE2 and TOIE2. 2. Select clock source by setting AS2 as appropriate. 3. Write new values to TCNT2, OCR2, and TCCR2. 4. To switch to asynchronous operation: Wait for TCN2UB, OCR2UB, and TCR2UB. 5. Clear the Timer/Counter2 Interrupt Flags. 6. Enable interrupts, if needed. OCFn OCRn TCNTn OCRn Value OCRn - 1 OCRn OCRn + 1 OCRn + 2 clkI/O clkTn (clkI/O/8) OCFn OCRn TCNTn (CTC) TOP TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8)ATmega8A [DATASHEET] 110 8159E–AVR–02/2013 • The Oscillator is optimized for use with a 32.768 kHz watch crystal. Applying an external clock to the TOSC1 pin may result in incorrect Timer/Counter2 operation. The CPU main clock frequency must be more than four times the Oscillator frequency. • When writing to one of the registers TCNT2, OCR2, or TCCR2, the value is transferred to a temporary register, and latched after two positive edges on TOSC1. The user should not write a new value before the contents of the temporary register have been transferred to its destination. Each of the three mentioned registers have their individual temporary register, which means that e.g. writing to TCNT2 does not disturb an OCR2 write in progress. To detect that a transfer to the destination register has taken place, the Asynchronous Status Register – ASSR has been implemented. • When entering Power-save mode after having written to TCNT2, OCR2, or TCCR2, the user must wait until the written register has been updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode before the changes are effective. This is particularly important if the Output Compare2 interrupt is used to wake up the device, since the Output Compare function is disabled during writing to OCR2 or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode before the OCR2UB bit returns to zero, the device will never receive a Compare Match interrupt, and the MCU will not wake up. • If Timer/Counter2 is used to wake the device up from Power-save mode, precautions must be taken if the user wants to re-enter one of these modes: The interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and re-entering sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the device will fail to wake up. If the user is in doubt whether the time before re-entering Power-save or Extended Standby mode is sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has elapsed: 1. Write a value to TCCR2, TCNT2, or OCR2. 2. Wait until the corresponding Update Busy Flag in ASSR returns to zero. 3. Enter Power-save or Extended Standby mode. • When the asynchronous operation is selected, the 32.768kHz Oscillator for Timer/Counter2 is always running, except in Power-down and Standby modes. After a Power-up Reset or Wake-up from Power-down or Standby mode, the user should be aware of the fact that this Oscillator might take as long as one second to stabilize. The user is advised to wait for at least one second before using Timer/Counter2 after Power-up or Wake-up from Power-down or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost after a wake-up from Power-down or Standby mode due to unstable clock signal upon start-up, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin. • Description of wake up from Power-save or Extended Standby mode when the timer is clocked asynchronously: When the interrupt condition is met, the wake up process is started on the following cycle of the timer clock, that is, the timer is always advanced by at least one before the processor can read the counter value. After wake-up, the MCU is halted for four cycles, it executes the interrupt routine, and resumes execution from the instruction following SLEEP. • Reading of the TCNT2 Register shortly after wake-up from Power-save may give an incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2 must be done through a register synchronized to the internal I/O clock domain. Synchronization takes place for every rising TOSC1 edge. When waking up from Power-save mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC clock after waking up from Power-save mode is essentially unpredictable, as it depends on the wake-up time. The recommended procedure for reading TCNT2 is thus as follows: 1. Write any value to either of the registers OCR2 or TCCR2. 2. Wait for the corresponding Update Busy Flag to be cleared. 3. Read TCNT2. • During asynchronous operation, the synchronization of the Interrupt Flags for the asynchronous timer takes three processor cycles plus one timer cycle. The timer is therefore advanced by at least one before the ATmega8A [DATASHEET] 111 8159E–AVR–02/2013 processor can read the timer value causing the setting of the Interrupt Flag. The Output Compare Pin is changed on the timer clock and is not synchronized to the processor clock. 18.10 Timer/Counter Prescaler Figure 18-12. Prescaler for Timer/Counter2 The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main system I/O clock clkI/O. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter (RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port B. A crystal can then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock source for Timer/Counter2. The Oscillator is optimized for use with a 32.768kHz crystal. Applying an external clock source to TOSC1 is not recommended. For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64, clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected. Setting the PSR2 bit in SFIOR resets the prescaler. This allows the user to operate with a predictable prescaler. 10-BIT T/C PRESCALER TIMER/COUNTER2 CLOCK SOURCE clkI/O clkT2S TOSC1 AS2 CS20 CS21 CS22 clkT2S/8 clkT2S/64 clkT2S/128 clkT2S/1024 clkT2S/256 clkT2S/32 0 PSR2 Clear clkT2ATmega8A [DATASHEET] 112 8159E–AVR–02/2013 18.11 Register Description 18.11.1 TCCR2 – Timer/Counter Control Register • Bit 7 – FOC2: Force Output Compare The FOC2 bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2 is written when operating in PWM mode. When writing a logical one to the FOC2 bit, an immediate Compare Match is forced on the waveform generation unit. The OC2 output is changed according to its COM21:0 bits setting. Note that the FOC2 bit is implemented as a strobe. Therefore it is the value present in the COM21:0 bits that determines the effect of the forced compare. A FOC2 strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2 as TOP. The FOC2 bit is always read as zero. • Bit 6,3 – WGM21:0: Waveform Generation Mode These bits control the counting sequence of the counter, the source for the maximum (TOP) counter value, and what type of waveform generation to be used. Modes of operation supported by the Timer/Counter unit are: Normal mode, Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes. See Table 18-2 and “Modes of Operation” on page 104. Note: 1. The CTC2 and PWM2 bit definition names are now obsolete. Use the WGM21:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer. • Bit 5:4 – COM21:0: Compare Match Output Mode These bits control the Output Compare Pin (OC2) behavior. If one or both of the COM21:0 bits are set, the OC2 output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to OC2 pin must be set in order to enable the output driver. When OC2 is connected to the pin, the function of the COM21:0 bits depends on the WGM21:0 bit setting. Table 18-3 shows the COM21:0 bit functionality when the WGM21:0 bits are set to a normal or CTC mode (non-PWM). Bit 7 6 5 4 3 2 1 0 FOC2 WGM20 COM21 COM20 WGM21 CS22 CS21 CS20 TCCR2 Read/Write W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 18-2. Waveform Generation Mode Bit Description Mode WGM21 (CTC2) WGM20 (PWM2) Timer/Counter Mode of Operation(1) TOP Update of OCR2 TOV2 Flag Set 0 0 0 Normal 0xFF Immediate MAX 1 0 1 PWM, Phase Correct 0xFF TOP BOTTOM 2 1 0 CTC OCR2 Immediate MAX 3 1 1 Fast PWM 0xFF BOTTOM MAX Table 18-3. Compare Output Mode, Non-PWM Mode COM21 COM20 Description 0 0 Normal port operation, OC2 disconnected. 0 1 Toggle OC2 on Compare Match 1 0 Clear OC2 on Compare Match 1 1 Set OC2 on Compare MatchATmega8A [DATASHEET] 113 8159E–AVR–02/2013 Table 18-4 shows the COM21:0 bit functionality when the WGM21:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2 equals TOP and COM21 is set. In this case, the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 105 for more details. Table 18-5 shows the COM21:0 bit functionality when the WGM21:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2 equals TOP and COM21 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page 106 for more details. • Bit 2:0 – CS22:0: Clock Select The three clock select bits select the clock source to be used by the Timer/Counter, see Table 18-6. 18.11.2 TCNT2 – Timer/Counter Register Table 18-4. Compare Output Mode, Fast PWM Mode(1) COM21 COM20 Description 0 0 Normal port operation, OC2 disconnected. 0 1 Reserved 1 0 Clear OC2 on Compare Match, set OC2 at BOTTOM, (non-inverting mode) 1 1 Set OC2 on Compare Match, clear OC2 at BOTTOM, (inverting mode) Table 18-5. Compare Output Mode, Phase Correct PWM Mode(1) COM21 COM20 Description 0 0 Normal port operation, OC2 disconnected. 0 1 Reserved 1 0 Clear OC2 on Compare Match when up-counting. Set OC2 on Compare Match when downcounting. 1 1 Set OC2 on Compare Match when up-counting. Clear OC2 on Compare Match when downcounting. Table 18-6. Clock Select Bit Description CS22 CS21 CS20 Description 0 0 0 No clock source (Timer/Counter stopped). 0 0 1 clkT2S/(No prescaling) 0 1 0 clkT2S/8 (From prescaler) 0 1 1 clkT2S/32 (From prescaler) 1 0 0 clkT2S/64 (From prescaler) 1 0 1 clkT2S/128 (From prescaler) 1 1 0 clkT2S/256 (From prescaler) 1 1 1 clkT2S/1024 (From prescaler) Bit 7 6 5 4 3 2 1 0 TCNT2[7:0] TCNT2 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 114 8159E–AVR–02/2013 The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running, introduces a risk of missing a Compare Match between TCNT2 and the OCR2 Register. 18.11.3 OCR2 – Output Compare Register The Output Compare Register contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2 pin. 18.11.4 ASSR – Asynchronous Status Register • Bit 3 – AS2: Asynchronous Timer/Counter2 When AS2 is written to zero, Timer/Counter 2 is clocked from the I/O clock, clkI/O. When AS2 is written to one, Timer/Counter 2 is clocked from a crystal Oscillator connected to the Timer Oscillator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2, and TCCR2 might be corrupted. • Bit 2 – TCN2UB: Timer/Counter2 Update Busy When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set. When TCNT2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value. • Bit 1 – OCR2UB: Output Compare Register2 Update Busy When Timer/Counter2 operates asynchronously and OCR2 is written, this bit becomes set. When OCR2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2 is ready to be updated with a new value. • Bit 0 – TCR2UB: Timer/Counter Control Register2 Update Busy When Timer/Counter2 operates asynchronously and TCCR2 is written, this bit becomes set. When TCCR2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2 is ready to be updated with a new value. If a write is performed to any of the three Timer/Counter2 Registers while its update busy flag is set, the updated value might get corrupted and cause an unintentional interrupt to occur. The mechanisms for reading TCNT2, OCR2, and TCCR2 are different. When reading TCNT2, the actual timer value is read. When reading OCR2 or TCCR2, the value in the temporary storage register is read. Bit 7 6 5 4 3 2 1 0 OCR2[7:0] OCR2 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – – – AS2 TCN2UB OCR2UB TCR2UB ASSR Read/Write R R R R R/W R R R Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 115 8159E–AVR–02/2013 18.11.5 TIMSK – Timer/Counter Interrupt Mask Register • Bit 7 – OCIE2: Timer/Counter2 Output Compare Match Interrupt Enable When the OCIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match interrupt is enabled. The corresponding interrupt is executed if a Compare Match in Timer/Counter2 occurs (i.e., when the OCF2 bit is set in the Timer/Counter Interrupt Flag Register – TIFR). • Bit 6 – TOIE2: Timer/Counter2 Overflow Interrupt Enable When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter2 occurs (i.e., when the TOV2 bit is set in the Timer/Counter Interrupt Flag Register – TIFR). 18.11.6 TIFR – Timer/Counter Interrupt Flag Register • Bit 7 – OCF2: Output Compare Flag 2 The OCF2 bit is set (one) when a Compare Match occurs between the Timer/Counter2 and the data in OCR2 – Output Compare Register2. OCF2 is cleared by hardware when executing the corresponding interrupt Handling Vector. Alternatively, OCF2 is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2 (Timer/Counter2 Compare Match Interrupt Enable), and OCF2 are set (one), the Timer/Counter2 Compare Match Interrupt is executed. • Bit 6 – TOV2: Timer/Counter2 Overflow Flag The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hardware when executing the corresponding interrupt Handling Vector. Alternatively, TOV2 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE2 (Timer/Counter2 Overflow Interrupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00. 18.11.7 SFIOR – Special Function IO Register • Bit 1 – PSR2: Prescaler Reset Timer/Counter2 When this bit is written to one, the Timer/Counter2 prescaler will be reset. The bit will be cleared by hardware after the operation is performed. Writing a zero to this bit will have no effect. This bit will always be read as zero if Timer/Counter2 is clocked by the internal CPU clock. If this bit is written when Timer/Counter2 is operating in Asynchronous mode, the bit will remain one until the prescaler has been reset. Bit 7 6 5 4 3 2 1 0 OCIE2 TOIE2 TICIE1 OCIE1A OCIE1B TOIE1 – TOIE0 TIMSK Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCF2 TOV2 ICF1 OCF1A OCF1B TOV1 – TOV0 TIFR Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – – – ACME PUD PSR2 PSR10 SFIOR Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATmega8A [DATASHEET] 116 8159E–AVR–02/2013 19. Serial Peripheral Interface – SPI 19.1 Features • Full-duplex, Three-wire Synchronous Data Transfer • Master or Slave Operation • LSB First or MSB First Data Transfer • Seven Programmable Bit Rates • End of Transmission Interrupt Flag • Write Collision Flag Protection • Wake-up from Idle Mode • Double Speed (CK/2) Master SPI Mode 19.2 Overview The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the ATmega8A and peripheral devices or between several AVR devices. Figure 19-1. SPI Block Diagram(1) Note: 1. Refer to “Pin Configurations” on page 2, and Table 13-2 on page 56 for SPI pin placement. The interconnection between Master and Slave CPUs with SPI is shown in Figure 19-2. The system consists of two Shift Registers, and a Master clock generator. The SPI Master initiates the communication cycle when pulling low SPI2X SPI2X DIVIDER /2/4/8/16/32/64/128ATmega8A [DATASHEET] 117 8159E–AVR–02/2013 the Slave Select SS pin of the desired Slave. Master and Slave prepare the data to be sent in their respective Shift Registers, and the Master generates the required clock pulses on the SCK line to interchange data. Data is always shifted from Master to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In – Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pulling high the Slave Select, SS, line. When configured as a Master, the SPI interface has no automatic control of the SS line. This must be handled by user software before communication can start. When this is done, writing a byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end of Transmission Flag (SPIF). If the SPI interrupt enable bit (SPIE) in the SPCR Register is set, an interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be kept in the Buffer Register for later use. When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long as the SS pin is driven high. In this state, software may update the contents of the SPI Data Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin until the SS pin is driven low. As one byte has been completely shifted, the end of Transmission Flag, SPIF is set. If the SPI interrupt enable bit, SPIE, in the SPCR Register is set, an interrupt is requested. The Slave may continue to place new data to be sent into SPDR before reading the incoming data. The last incoming byte will be kept in the Buffer Register for later use. Figure 19-2. SPI Master-Slave Interconnection The system is single buffered in the transmit direction and double buffered in the receive direction. This means that bytes to be transmitted cannot be written to the SPI Data Register before the entire shift cycle is completed. When receiving data, however, a received character must be read from the SPI Data Register before the next character has been completely shifted in. Otherwise, the first byte is lost. In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure correct sampling of the clock signal, the minimum low and high periods should be: Low period: longer than 2 CPU clock cycles High period: longer than 2 CPU clock cycles. When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden according to Table 19-1. For more details on automatic port overrides, refer to “Alternate Port Functions” on page 54. MSB MASTER LSB 8 BIT SHIFT REGISTER MSB SLAVE LSB 8 BIT SHIFT REGISTER MISO MOSI SPI CLOCK GENERATOR SCK SS MISO MOSI SCK SS VCC SHIFT ENABLEATmega8A [DATASHEET] 118 8159E–AVR–02/2013 Note: 1. See “Port B Pins Alternate Functions” on page 56 for a detailed description of how to define the direction of the user defined SPI pins. The following code examples show how to initialize the SPI as a Master and how to perform a simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by the actual data direction bits for these pins. E.g. if MOSI is placed on pin PB5, replace DD_MOSI with DDB5 and DDR_SPI with DDRB. Table 19-1. SPI Pin Overrides(1) Pin Direction, Master SPI Direction, Slave SPI MOSI User Defined Input MISO Input User Defined SCK User Defined Input SS User Defined InputATmega8A [DATASHEET] 119 8159E–AVR–02/2013 Note: 1. See “About Code Examples” on page 6. Assembly Code Example(1) SPI_MasterInit: ; Set MOSI and SCK output, all others input ldi r17,(1<>8); UBRRL = (unsigned char)ubrr; /* Enable receiver and transmitter */ UCSRB = (1<> 1) & 0x01; return ((resh << 8) | resl); }ATmega8A [DATASHEET] 137 8159E–AVR–02/2013 20.6.9 Receive Compete Flag and Interrupt The USART Receiver has one flag that indicates the Receiver state. The Receive Complete (RXC) Flag indicates if there are unread data present in the receive buffer. This flag is one when unread data exist in the receive buffer, and zero when the receive buffer is empty (i.e., does not contain any unread data). If the Receiver is disabled (RXEN = 0), the receive buffer will be flushed and consequently the RXC bit will become zero. When the Receive Complete Interrupt Enable (RXCIE) in UCSRB is set, the USART Receive Complete Interrupt will be executed as long as the RXC Flag is set (provided that global interrupts are enabled). When interrupt-driven data reception is used, the receive complete routine must read the received data from UDR in order to clear the RXC Flag, otherwise a new interrupt will occur once the interrupt routine terminates. 20.6.10 Receiver Error Flags The USART Receiver has three error flags: Frame Error (FE), Data OverRun (DOR) and Parity Error (PE). All can be accessed by reading UCSRA. Common for the error flags is that they are located in the receive buffer together with the frame for which they indicate the error status. Due to the buffering of the error flags, the UCSRA must be read before the receive buffer (UDR), since reading the UDR I/O location changes the buffer read location. Another equality for the error flags is that they can not be altered by software doing a write to the flag location. However, all flags must be set to zero when the UCSRA is written for upward compatibility of future USART implementations. None of the error flags can generate interrupts. The Frame Error (FE) Flag indicates the state of the first stop bit of the next readable frame stored in the receive buffer. The FE Flag is zero when the stop bit was correctly read (as one), and the FE Flag will be one when the stop bit was incorrect (zero). This flag can be used for detecting out-of-sync conditions, detecting break conditions and protocol handling. The FE Flag is not affected by the setting of the USBS bit in UCSRC since the Receiver ignores all, except for the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to UCSRA. The Data OverRun (DOR) Flag indicates data loss due to a Receiver buffer full condition. A Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in the Receive Shift Register, and a new start bit is detected. If the DOR Flag is set there was one or more serial frame lost between the frame last read from UDR, and the next frame read from UDR. For compatibility with future devices, always write this bit to zero when writing to UCSRA. The DOR Flag is cleared when the frame received was successfully moved from the Shift Register to the receive buffer. The Parity Error (PE) Flag indicates that the next frame in the receive buffer had a parity error when received. If parity check is not enabled the PE bit will always be read zero. For compatibility with future devices, always set this bit to zero when writing to UCSRA. For more details see “Parity Bit Calculation” on page 130 and “Parity Checker” on page 137. 20.6.11 Parity Checker The Parity Checker is active when the high USART Parity mode (UPM1) bit is set. Type of parity check to be performed (odd or even) is selected by the UPM0 bit. When enabled, the Parity Checker calculates the parity of the data bits in incoming frames and compares the result with the parity bit from the serial frame. The result of the check is stored in the receive buffer together with the received data and stop bits. The Parity Error (PE) Flag can then be read by software to check if the frame had a parity error. The PE bit is set if the next character that can be read from the receive buffer had a parity error when received and the parity checking was enabled at that point (UPM1 = 1). This bit is valid until the receive buffer (UDR) is read. 20.6.12 Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing receptions will therefore be lost. When disabled (i.e., the RXEN is set to zero) the Receiver will no longer override the normal functionATmega8A [DATASHEET] 138 8159E–AVR–02/2013 of the RxD port pin. The Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in the buffer will be lost. 20.6.13 Flushing the Receive Buffer The Receiver buffer FIFO will be flushed when the Receiver is disabled (i.e., the buffer will be emptied of its contents). Unread data will be lost. If the buffer has to be flushed during normal operation, due to for instance an error condition, read the UDR I/O location until the RXC Flag is cleared. The following code example shows how to flush the receive buffer. Note: 1. See “About Code Examples” on page 6. 20.7 Asynchronous Data Reception The USART includes a clock recovery and a data recovery unit for handling asynchronous data reception. The clock recovery logic is used for synchronizing the internally generated baud rate clock to the incoming asynchronous serial frames at the RxD pin. The data recovery logic samples and low pass filters each incoming bit, thereby improving the noise immunity of the Receiver. The asynchronous reception operational range depends on the accuracy of the internal baud rate clock, the rate of the incoming frames, and the frame size in number of bits. 20.7.1 Asynchronous Clock Recovery The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 20-5 illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double Speed mode. The horizontal arrows illustrate the synchronization variation due to the sampling process. Note the larger time variation when using the Double Speed mode (U2X = 1) of operation. Samples denoted zero are samples done when the RxD line is idle (i.e., no communication activity). Figure 20-5. Start Bit Sampling When the clock recovery logic detects a high (idle) to low (start) transition on the RxD line, the start bit detection sequence is initiated. Let sample 1 denote the first zero-sample as shown in the figure. The clock recovery logic Assembly Code Example(1) USART_Flush: sbis UCSRA, RXC ret in r16, UDR rjmp USART_Flush C Code Example(1) void USART_Flush( void ) { unsigned char dummy; while ( UCSRA & (1< 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck  12MHz High: > 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck  12MHz 25.9.1 Serial Programming Algorithm When writing serial data to the ATmega8A, data is clocked on the rising edge of SCK. When reading data from the ATmega8A, data is clocked on the falling edge of SCK. See Figure 25-8 for timing details. Table 25-14. Pin Mapping Serial Programming Symbol Pins I/O Description MOSI PB3 I Serial data in MISO PB4 O Serial data out SCK PB5 I Serial clock VCC GND XTAL1 SCK MISO MOSI RESET PB3 PB4 PB5 +2.7 - 5.5V AVCC +2.7 - 5.5V (2)ATmega8A [DATASHEET] 221 8159E–AVR–02/2013 To program and verify the ATmega8A in the Serial Programming mode, the following sequence is recommended (See four byte instruction formats in Table 25-16): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during Power-up. In this case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0”. 2. Wait for at least 20 ms and enable Serial Programming by sending the Programming Enable serial instruction to pin MOSI. 3. The Serial Programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The page size is found in Table 25-5 on page 210. The memory page is loaded one byte at a time by supplying the 5LSB of the address and data together with the Load Program memory Page instruction. To ensure correct loading of the page, the data Low byte must be loaded before data High byte is applied for a given address. The Program memory Page is stored by loading the Write Program memory Page instruction with the 7 MSB of the address. If polling is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 25-15). 5. Note: If other commands than polling (read) are applied before any write operation (FLASH, EEPROM, Lock Bits, Fuses) is completed, it may result in incorrect programming. 6. The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling is not used, the user must wait at least tWD_EEPROM before issuing the next byte. (See Table 25-15 on page 222). In a chip erased device, no 0xFFs in the data file(s) need to be programmed. 7. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output MISO. 8. At the end of the programming session, RESET can be set high to commence normal operation. 9. Power-off sequence (if needed): Set RESET to “1”. Turn VCC power off 25.9.2 Data Polling Flash When a page is being programmed into the Flash, reading an address location within the page being programmed will give the value 0xFF. At the time the device is ready for a new page, the programmed value will read correctly. This is used to determine when the next page can be written. Note that the entire page is written simultaneously and any address within the page can be used for polling. Data polling of the Flash will not work for the value 0xFF, so when programming this value, the user will have to wait for at least tWD_FLASH before programming the next page. As a chip-erased device contains 0xFF in all locations, programming of addresses that are meant to contain 0xFF, can be skipped. See Table 97 for tWD_FLASH value. 25.9.3 Data Polling EEPROM When a new byte has been written and is being programmed into EEPROM, reading the address location being programmed will give the value 0xFF. At the time the device is ready for a new byte, the programmed value will read correctly. This is used to determine when the next byte can be written. This will not work for the value 0xFF, but the user should have the following in mind: As a chip-erased device contains 0xFF in all locations, programming of addresses that are meant to contain 0xFF, can be skipped. This does not apply if the EEPROM is Re-ATmega8A [DATASHEET] 222 8159E–AVR–02/2013 programmed without chip-erasing the device. In this case, data polling cannot be used for the value 0xFF, and the user will have to wait at least tWD_EEPROM before programming the next byte. See Table 25-15 for tWD_EEPROM value. Figure 25-8. Serial Programming Waveforms Table 25-15. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location Symbol Minimum Wait Delay tWD_FUSE 4.5 ms tWD_FLASH 4.5 ms tWD_EEPROM 9.0 ms tWD_ERASE 9.0 ms MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUTATmega8A [DATASHEET] 223 8159E–AVR–02/2013 Note: a = address high bits b = address low bits H = 0 – Low byte, 1 – High byte o = data out i = data in x = don’t care Table 25-16. Serial Programming Instruction Set Instruction Instruction Format Byte 1 Byte 2 Byte 3 Byte4 Operation Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after RESET goes low. Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash. Read Program Memory 0010 H000 0000 aaaa bbbb bbbb oooo oooo Read H (high or low) data o from Program memory at word address a:b. Load Program Memory Page 0100 H000 0000 xxxx xxxb bbbb iiii iiii Write H (high or low) data i to Program memory page at word address b. Data Low byte must be loaded before Data High byte is applied within the same address. Write Program Memory Page 0100 1100 0000 aaaa bbbx xxxx xxxx xxxx Write Program memory Page at address a:b. Read EEPROM Memory 1010 0000 00xx xxxa bbbb bbbb oooo oooo Read data o from EEPROM memory at address a:b. Write EEPROM Memory 1100 0000 00xx xxxa bbbb bbbb iiii iiii Write data i to EEPROM memory at address a:b. Read Lock Bits 0101 1000 0000 0000 xxxx xxxx xxoo oooo Read Lock Bits. “0” = programmed, “1” = unprogrammed. See Table 25-1 on page 207 for details. Write Lock Bits 1010 1100 111x xxxx xxxx xxxx 11ii iiii Write Lock Bits. Set bits = “0” to program Lock Bits. See Table 25- 1 on page 207 for details. Read Signature Byte 0011 0000 00xx xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b. Write Fuse Bits 1010 1100 1010 0000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. See Table 25-4 on page 209 for details. Write Fuse High Bits 1010 1100 1010 1000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. See Table 25-3 on page 208 for details. Read Fuse Bits 0101 0000 0000 0000 xxxx xxxx oooo oooo Read Fuse Bits. “0” = programmed, “1” = unprogrammed. See Table 25-4 on page 209 for details. Read Fuse High Bits 0101 1000 0000 1000 xxxx xxxx oooo oooo Read Fuse high bits. “0” = programmed, “1” = unprogrammed. See Table 25-3 on page 208 for details. Read Calibration Byte 0011 1000 00xx xxxx 0000 00bb oooo oooo Read Calibration ByteATmega8A [DATASHEET] 224 8159E–AVR–02/2013 25.9.4 SPI Serial Programming Characteristics For characteristics of the SPI module, see “SPI Timing Characteristics” on page 230.ATmega8A [DATASHEET] 225 8159E–AVR–02/2013 26. Electrical Characteristics – TA = -40°C to 85°C Note: Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. 26.2 DC Characteristics 26.1 Absolute Maximum Ratings* Operating Temperature.................................. -55C to +125C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ................................................ 40.0mA DC Current VCC and GND Pins................................. 300.0mA TA = -40C to 85C, VCC = 2.7V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage except XTAL1 and RESET pins VCC = 2.7V - 5.5V -0.5 0.2 VCC(1) V VIH Input High Voltage except XTAL1 and RESET pins VCC = 2.7V - 5.5V 0.6 VCC(2) VCC + 0.5 V VIL1 Input Low Voltage XTAL1 pin VCC = 2.7V - 5.5V -0.5 0.1 VCC(1) V VIH1 Input High Voltage XTAL 1 pin VCC = 2.7V - 5.5V 0.8 VCC(2) VCC + 0.5 V VIL2 Input Low Voltage RESET pin VCC = 2.7V - 5.5V -0.5 0.2 VCC V VIH2 Input High Voltage RESET pin VCC = 2.7V - 5.5V 0.9 VCC(2) VCC + 0.5 V VIL3 Input Low Voltage RESET pin as I/O VCC = 2.7V - 5.5V -0.5 0.2 VCC V VIH3 Input High Voltage RESET pin as I/O VCC = 2.7V - 5.5V 0.6 VCC(2) 0.7 VCC(2) VCC + 0.5 V VOL Output Low Voltage(3) (Ports B,C,D) I OL = 20mA, VCC = 5V IOL = 10mA, VCC = 3V 0.9 0.6 V V VOH Output High Voltage(4) (Ports B,C,D) I OH = -20mA, VCC = 5V IOH = -10mA, VCC = 3V 4.2 2.2 V V IIL Input Leakage Current I/O Pin Vcc = 5.5V, pin low (absolute value) 1 µA IIH Input Leakage Current I/O Pin Vcc = 5.5V, pin high (absolute value) 1 µAATmega8A [DATASHEET] 226 8159E–AVR–02/2013 Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low 2. “Min” means the lowest value where the pin is guaranteed to be read as high 3. Although each I/O port can sink more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP, TQFP, and QFN/MLF Package: 1] The sum of all IOL, for all ports, should not exceed 300mA. 2] The sum of all IOL, for ports C0 - C5 should not exceed 100mA. 3] The sum of all IOL, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP, TQFP, and QFN/MLF Package: 1] The sum of all IOH, for all ports, should not exceed 300mA. 2] The sum of all IOH, for port C0 - C5, should not exceed 100mA. 3] The sum of all IOH, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 5. Minimum VCC for Power-down is 2.5V. RRST Reset Pull-up Resistor 30 80 k Rpu I/O Pin Pull-up Resistor 20 50 k I CC Power Supply Current Active 4MHz, VCC = 3V 2 5 mA Active 8MHz, VCC = 5V 6 15 mA Idle 4MHz, VCC = 3V 0.5 2 mA Idle 8MHz, VCC = 5V 2.2 7 mA Power-down mode(5) WDT enabled, VCC = 3V <10 28 µA WDT disabled, VCC = 3V <1 3 µA VACIO Analog Comparator Input Offset Voltage VCC = 5V Vin = VCC/2 40 mV IACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nA tACPD Analog Comparator Propagation Delay VCC = 2.7V VCC = 5.0V 750 500 ns TA = -40C to 85C, VCC = 2.7V to 5.5V (unless otherwise noted) (Continued) Symbol Parameter Condition Min Typ Max UnitsATmega8A [DATASHEET] 227 8159E–AVR–02/2013 26.3 Speed Grades Figure 26-1. Maximum Frequency vs. Vcc 26.4 Clock Characteristics 26.4.1 External Clock Drive Waveforms Figure 26-2. External Clock Drive Waveforms 26.4.2 External Clock Drive 2.7V 4.5V 5.5V Safe Operating Area 16 MHz 8 MHz VIL1 VIH1 Table 26-1. External Clock Drive Symbol Parameter VCC = 2.7V to 5.5V VCC = 4.5V to 5.5V Min Max Min Max Units 1/tCLCL Oscillator Frequency 0 8 0 16 MHz tCLCL Clock Period 125 62.5 ns tCHCX High Time 50 25 ns tCLCX Low Time 50 25 ns tCLCH Rise Time 1.6 0.5 s tCHCL Fall Time 1.6 0.5 s tCLCL Change in period from one clock cycle to the next 2 2%ATmega8A [DATASHEET] 228 8159E–AVR–02/2013 Notes: 1. R should be in the range 3 k - 100 k, and C should be at least 20 pF. The C values given in the table includes pin capacitance. This will vary with package type. 2. The frequency will vary with package type and board layout. 26.5 System and Reset Characteristics Notes: 1. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling). 2. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. The test is performed using BODLEVEL = 1 and BODLEVEL = 0 for ATmega8A. Table 26-2. External RC Oscillator, Typical Frequencies R [k] (1) C [pF] f(2) 33 22 650kHz 10 22 2.0MHz Table 26-3. Reset, Brown-out and Internal Voltage Reference Characteristics Symbol Parameter Condition Min Typ Max Units VPOT Power-on Reset Threshold Voltage (rising)(1) 1.4 2.3 V Power-on Reset Threshold Voltage (falling) 1.3 2.3 V VRST RESET Pin Threshold Voltage 0.2 0.9 VCC tRST Minimum pulse width on RESET Pin 1.5 µs VBOT Brown-out Reset Threshold Voltage(2) BODLEVEL = 1 2.40 2.60 2.90 V BODLEVEL = 0 3.70 4.00 4.50 tBOD Minimum low voltage period for Brownout Detection BODLEVEL = 1 2 µs BODLEVEL = 0 2 µs VHYST Brown-out Detector hysteresis 130 mV VBG Bandgap reference voltage 1.15 1.23 1.35 V tBG Bandgap reference start-up time 40 70 µs IBG Bandgap reference current consumption 10 µsATmega8A [DATASHEET] 229 8159E–AVR–02/2013 26.6 Two-wire Serial Interface Characteristics Table 26-4 describes the requirements for devices connected to the Two-wire Serial Bus. The ATmega8A Two-wire Serial Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 26-3. Notes: 1. In ATmega8A, this parameter is characterized and not 100% tested. 2. Required only for fSCL > 100kHz. Table 26-4. Two-wire Serial Bus Requirements Symbol Parameter Condition Min Max Units VIL Input Low-voltage -0.5 0.3 VCC V VIH Input High-voltage 0.7 VCC VCC + 0.5 V Vhys(1) Hysteresis of Schmitt Trigger Inputs 0.05 VCC(2) – V VOL(1) Output Low-voltage 3mA sink current 0 0.4 V tr (1) Rise Time for both SDA and SCL 20 + 0.1Cb (3)(2) 300 ns tof (1) Output Fall Time from VIHmin to VILmax 10 pF < Cb < 400 pF(3) 20 + 0.1Cb (3)(2) 250 ns tSP(1) Spikes Suppressed by Input Filter 0 50(2) ns Ii Input Current each I/O Pin 0.1VCC < Vi < 0.9VCC -10 10 µA Ci (1) Capacitance for each I/O Pin – 10 pF fSCL SCL Clock Frequency fCK(4) > max(16fSCL, 250kHz)(5) 0 400 kHz Rp Value of Pull-up resistor fSCL  100kHz fSCL > 100kHz tHD;STA Hold Time (repeated) START Condition fSCL  100kHz 4.0 – µs fSCL > 100kHz 0.6 – µs tLOW Low Period of the SCL Clock fSCL  100kHz(6) 4.7 – µs fSCL > 100kHz(7) 1.3 – µs tHIGH High period of the SCL clock fSCL  100kHz 4.0 – µs fSCL > 100kHz 0.6 – µs tSU;STA Set-up time for a repeated START condition fSCL  100kHz 4.7 – µs fSCL > 100kHz 0.6 – µs tHD;DAT Data hold time fSCL  100kHz 0 3.45 µs fSCL > 100kHz 0 0.9 µs tSU;DAT Data setup time fSCL  100kHz 250 – ns fSCL > 100kHz 100 – ns tSU;STO Setup time for STOP condition fSCL  100kHz 4.0 – µs fSCL > 100kHz 0.6 – µs tBUF Bus free time between a STOP and START condition fSCL  100kHz 4.7 – µs fSCL > 100kHz 1.3 – µs VCC – 0,4V 3mA ---------------------------- 1000ns Cb -------------------  VCC – 0,4V 3mA ---------------------------- 300ns Cb ---------------- ATmega8A [DATASHEET] 230 8159E–AVR–02/2013 3. Cb = capacitance of one bus line in pF. 4. fCK = CPU clock frequency 5. This requirement applies to all ATmega8A Two-wire Serial Interface operation. Other devices connected to the Two-wire Serial Bus need only obey the general fSCL requirement. 6. The actual low period generated by the ATmega8A Two-wire Serial Interface is (1/fSCL - 2/fCK), thus fCK must be greater than 6MHz for the low time requirement to be strictly met at fSCL = 100kHz. 7. The actual low period generated by the ATmega8A Two-wire Serial Interface is (1/fSCL - 2/fCK), thus the low time requirement will not be strictly met for fSCL > 308kHz when fCK = 8MHz. Still, ATmega8A devices connected to the bus may communicate at full speed (400kHz) with other ATmega8A devices, as well as any other device with a proper tLOW acceptance margin. Figure 26-3. Two-wire Serial Bus Timing 26.7 SPI Timing Characteristics See Figure 26-4 and Figure 26-5 for details. Note: 1. In SPI Programming mode the minimum SCK high/low period is: - 2tCLCL for fCK < 12MHz - 3tCLCL for fCK > 12MHz t SU;STA t LOW t HIGH t LOW t of t HD;STA t HD;DAT t SU;DAT t SU;STO t BUF SCL SDA t r Table 26-5. SPI Timing Parameters Description Mode Min Typ Max 1 SCK period Master See Table 19-4 ns 2 SCK high/low Master 50% duty cycle 3 Rise/Fall time Master 3.6 4 Setup Master 10 5 Hold Master 10 6 Out to SCK Master 0.5 • tSCK 7 SCK to out Master 10 8 SCK to out high Master 10 9 SS low to out Slave 15 10 SCK period Slave 4 • tck 11 SCK high/low(1) Slave 2 • tck 12 Rise/Fall time Slave 1.6 13 Setup Slave 10 14 Hold Slave 10 15 SCK to out Slave 15 16 SCK to SS high Slave 20 17 SS high to tri-state Slave 10 18 SS low to SCK Salve 2 • tckATmega8A [DATASHEET] 231 8159E–AVR–02/2013 Figure 26-4. SPI interface timing requirements (Master Mode) Figure 26-5. SPI interface timing requirements (Slave Mode) MOSI (Data Output) SCK (CPOL = 1) MISO (Data Input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 6 1 2 2 4 5 3 7 8 MISO (Data Output) SCK (CPOL = 1) MOSI (Data Input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 10 11 11 13 14 12 15 17 9 X 16 18ATmega8A [DATASHEET] 232 8159E–AVR–02/2013 26.8 ADC Characteristics Notes: 1. Values are guidelines only. 2. Minimum for AVCC is 2.7V. 3. Maximum for AVCC is 5.5V. 4. Maximum conversion time is 1/50kHz*25 = 0.5 ms. Table 26-6. ADC Characteristics Symbol Parameter Condition Min(1) Typ(1) Max(1) Units Resolution Single Ended Conversion 10 Bits Absolute accuracy (Including INL, DNL, Quantization Error, Gain, and Offset Error) Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 1.75 LSB Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 1MHz 3 LSB Integral Non-linearity (INL) Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 0.75 LSB Differential Non-linearity (DNL) Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 0.5 LSB Gain Error Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 1 LSB Offset Error Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 1 LSB Conversion Time(4) Free Running Conversion 13 260 µs Clock Frequency 50 1000 kHz AVCC Analog Supply Voltage VCC - 0.3(2) VCC + 0.3(3) V VREF Reference Voltage 2.0 AVCC V VIN Input voltage GND VREF V Input bandwidth 38.5 kHz VINT Internal Voltage Reference 2.3 2.56 2.8 V RREF Reference Input Resistance 32 k RAIN Analog Input Resistance 55 100 MATmega8A [DATASHEET] 233 8159E–AVR–02/2013 27. Electrical Characteristics – TA = -40°C to 105°C Absolute Maximum Ratings* 27.1 DC Characteristics Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low Operating Temperature.................................. -55C to +125C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ............................................... 40.0 mA DC Current VCC and GND Pins................................ 200.0 mA TA = -40C to 105C, VCC = 2.7V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min. Typ. Max. Units VIL Input Low Voltage, Except XTAL1 and RESET pin VCC = 2.7V - 5.5V -0.5 0.2VCC(1) V VIL1 Input Low Voltage, XTAL1 pin VCC = 2.7V - 5.5V -0.5 0.1VCC(1) V VIL2 Input Low Voltage, RESET pin VCC = 2.7V - 5.5V -0.5 0.1VCC(1) V VIH Input High Voltage, Except XTAL1 and RESET pins VCC = 2.7V - 5.5V 0.6VCC(2) VCC + 0.5 V VIH1 Input High Voltage, XTAL1 pin VCC = 2.7V - 5.5V 0.8VCC(2) VCC + 0.5 V VIH2 Input High Voltage, RESET pin VCC = 2.7V - 5.5V 0.9VCC(2) VCC + 0.5 V VOL Output Low Voltage(3), Port B (except RESET) I OL =20 mA, VCC = 5V IOL =10 mA, VCC = 3V 0.8 0.6 V VOH Output High Voltage(4), Port B (except RESET) I OH = -20 mA, VCC = 5V IOH = -10 mA, VCC = 3V 4.0 2.2 V IIL Input Leakage Current I/O Pin 3 µA IIH Input Leakage Current I/O Pin 3 µA RRST Reset Pull-up Resistor 30 80 k RPU I/O Pin Pull-up Resistor 20 50 k VACIO Analog Comparator Input Offset Voltage VCC = 5V Vin = VCC/2 20 mV IACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nAATmega8A [DATASHEET] 234 8159E–AVR–02/2013 2. “Min” means the lowest value where the pin is guaranteed to be read as high 3. Although each I/O port can sink more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP, TQFP, and QFN/MLF Package: 1] The sum of all IOL, for all ports, should not exceed 300 mA. 2] The sum of all IOL, for ports C0 - C5 should not exceed 100 mA. 3] The sum of all IOL, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200 mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20 mA at Vcc = 5V, 10 mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP, TQFP, and QFN/MLF Package: 1] The sum of all IOH, for all ports, should not exceed 300 mA. 2] The sum of all IOH, for port C0 - C5, should not exceed 100 mA. 3] The sum of all IOH, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200 mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. Note: 1. The current consumption values include input leakage current. 27.1.1 ATmega8A DC Characteristics Table 27-1. TA = -40C to 105C, VCC = 1.8V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min. Typ. Max. Units ICC Power Supply Current Active 4 MHz, VCC = 3V 6 mA Active 8 MHz, VCC = 5V 15 mA Idle 4 MHz, VCC = 3V 3 mA Idle 8 MHz, VCC = 5V 8 mA Power-down mode(1) WDT enabled, VCC = 3V 35 µA WDT disabled, VCC = 3V 6 µAATmega8A [DATASHEET] 235 8159E–AVR–02/2013 28. Typical Characteristics – TA = -40°C to 85°C The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with Rail-to-Rail output is used as clock source. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. 28.1 Active Supply Current Figure 28-1. Active Supply Current vs. Frequency (0.1 - 1.0MHz) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.3 V 2.7 V 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)ATmega8A [DATASHEET] 236 8159E–AVR–02/2013 Figure 28-2. Active Supply Current vs. Frequency (1 - 16MHz) Figure 28-3. Active Supply Current vs. VCC (Internal RC Oscillator, 8MHz) 0 2 4 6 8 10 12 14 0246 8 10 12 14 16 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.3 V 2.7 V 85 °C 25 °C -40 °C 3 4 5 6 7 8 9 10 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 237 8159E–AVR–02/2013 Figure 28-4. Active Supply Current vs. VCC (Internal RC Oscillator, 4MHz) Figure 28-5. Active Supply Current vs. VCC (Internal RC Oscillator, 2MHz) 85 °C 25 °C -40 °C 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 1.2 1.6 2 2.4 2.8 3.2 3.6 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 238 8159E–AVR–02/2013 Figure 28-6. Active Supply Current vs. VCC (Internal RC Oscillator, 1MHz) Figure 28-7. Active Supply Current vs. VCC (32kHz External Oscillator) 85 °C 25 °C -40 °C 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 25 °C 40 45 50 55 60 65 70 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)ATmega8A [DATASHEET] 239 8159E–AVR–02/2013 28.2 Idle Supply Current Figure 28-8. Idle Supply Current vs. Frequency (0.1 - 1.0MHz) Figure 28-9. Idle Supply Current vs. Frequency (1 - 16MHz) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.3 V 2.7 V 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.3 V 2.7 V 0 1 2 3 4 5 6 0246 8 10 12 14 16 Frequency (MHz) ICC (mA)ATmega8A [DATASHEET] 240 8159E–AVR–02/2013 Figure 28-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 8MHz) Figure 28-11. Idle Supply Current vs. VCC (Internal RC Oscillator, 4MHz) 85 °C 25 °C -40 °C 1 1.5 2 2.5 3 3.5 4 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 241 8159E–AVR–02/2013 Figure 28-12. Idle Supply Current vs. VCC (Internal RC Oscillator, 2MHz) Figure 28-13. Idle Supply Current vs. VCC (Internal RC Oscillator, 1MHz) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 242 8159E–AVR–02/2013 Figure 28-14. Idle Supply Current vs. VCC (32kHz External Oscillator) 28.3 Power-down Supply Current Figure 28-15. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) 25 °C 0 5 10 15 20 25 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 243 8159E–AVR–02/2013 Figure 28-16. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) 28.4 Power-save Supply Current Figure 28-17. Power-save Supply Current vs. VCC (Watchdog Timer Disabled) 85 °C 25 °C -40 °C 0 5 10 15 20 25 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25 °C 2 4 6 8 10 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 244 8159E–AVR–02/2013 28.5 Standby Supply Current Figure 28-18. Standby Supply Current vs. VCC (455kHz Resonator, Watchdog Timer Disabled) Figure 28-19. Standby Supply Current vs. VCC (1MHz Resonator, Watchdog Timer Disabled) 25 °C 0 10 20 30 40 50 60 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25 °C 0 10 20 30 40 50 60 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 245 8159E–AVR–02/2013 Figure 28-20. Standby Supply Current vs. VCC (1MHz Xtal, Watchdog Timer Disabled) Figure 28-21. Standby Supply Current vs. VCC (4MHz Resonator, Watchdog Timer Disabled) 25 °C 0 10 20 30 40 50 60 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25 °C 0 15 30 45 60 75 90 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 246 8159E–AVR–02/2013 Figure 28-22. Standby Supply Current vs. VCC (4MHz Xtal, Watchdog Timer Disabled) Figure 28-23. Standby Supply Current vs. VCC (6MHz Resonator, Watchdog Timer Disabled) 25 °C 0 10 20 30 40 50 60 70 80 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25 °C 0 20 40 60 80 100 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 247 8159E–AVR–02/2013 Figure 28-24. Standby Supply Current vs. VCC (6MHz Xtal, Watchdog Timer Disabled) 28.6 Pin Pull-up Figure 28-25. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V) 25 °C 0 20 40 60 80 100 120 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 0 20 40 60 80 100 120 140 0123456 VOP (V) IOP (uA) 85 °C 25 °C -40 °CATmega8A [DATASHEET] 248 8159E–AVR–02/2013 Figure 28-26. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V) Figure 28-27. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 70 80 0 0.5 1 1.5 2 2.5 3 VOP (V) IOP (uA) 85 °C 25 °C -40 °C 0 20 40 60 80 100 120 012345 VRESET (V) IRESET (uA)ATmega8A [DATASHEET] 249 8159E–AVR–02/2013 Figure 28-28. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) 28.7 Pin Driver Strength Figure 28-29. I/O Pin Output Voltage vs. Source Current (VCC = 5.0V) 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 3 VRESET (V) IRESET (uA) 85 °C 25 °C -40 °C 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 0246 8 10 12 14 16 18 20 IOH (mA) VOH ( V)ATmega8A [DATASHEET] 250 8159E–AVR–02/2013 Figure 28-30. I/O Pin Output Voltage vs. Source Current (VCC = 3.0V) Figure 28-31. I/O Pin Output Voltage vs. Sink Current (VCC = 5.0V) 85 °C 25 °C -40 °C 1 1.5 2 2.5 3 3.5 0 4 8 12 16 20 IOH (mA) VOH ( V) 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0 4 8 12 16 20 IOL (mA) VOL ( V)ATmega8A [DATASHEET] 251 8159E–AVR–02/2013 Figure 28-32. I/O Pin Output Voltage vs. Sink Current (VCC = 3.0V) Figure 28-33. Reset Pin as I/O - Pin Source Current vs. Output Voltage (VCC = 5.0V) 85 °C 25 °C -40 °C 0 0.2 0.4 0.6 0.8 1 0246 8 10 12 14 16 18 20 IOL (mA) VOL ( V) 0 1 2 3 4 5 2 2.5 3 3.5 4 4.5 VOH (V) Current (mA) 85 °C 25 °C -40 °CATmega8A [DATASHEET] 252 8159E–AVR–02/2013 Figure 28-34. Reset Pin as I/O - Pin Source Current vs. Output Voltage (VCC = 2.7V) Figure 28-35. Reset Pin as I/O - Pin Sink Current vs. Output Voltage (VCC = 5.0V) 0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 2 2.5 VOH (V) Current (mA) 85 °C 25 °C -40 °C 85 °C 25 °C -40 °C 0 2 4 6 8 10 12 14 0 0.5 1 1.5 2 VOL (V) Current (mA)ATmega8A [DATASHEET] 253 8159E–AVR–02/2013 Figure 28-36. Reset Pin as I/O - Pin Sink Current vs. Output Voltage (VCC = 2.7V) 28.8 Pin Thresholds and Hysteresis Figure 28-37. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 0 0.5 1 1.5 2 VOL (V) Current (mA) 85 °C 25 °C -40 °C 1 1.5 2 2.5 3 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold ( V)ATmega8A [DATASHEET] 254 8159E–AVR–02/2013 Figure 28-38. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”) Figure 28-39. I/O Pin Input Hysteresis vs. VCC 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold ( V) 85 °C 25 °C -40 °C 0.2 0.25 0.3 0.35 0.4 0.45 0.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (m V)ATmega8A [DATASHEET] 255 8159E–AVR–02/2013 Figure 28-40. Reset Pin as I/O - Input Threshold Voltage vs. VCC (VIH, Reset Pin Read as “1”) Figure 28-41. Reset Pin as I/O - Input Threshold Voltage vs. VCC (VIL, Reset Pin Read as “0”) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold ( V) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold ( V)ATmega8A [DATASHEET] 256 8159E–AVR–02/2013 Figure 28-42. Reset Pin as I/O - Pin Hysteresis vs. VCC Figure 28-43. Reset Input Threshold Voltage vs. VCC (VIH, Reset Pin Read as “1”) 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (m V) 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold ( V)ATmega8A [DATASHEET] 257 8159E–AVR–02/2013 Figure 28-44. Reset Input Threshold Voltage vs. VCC (VIL, Reset Pin Read as “0”) Figure 28-45. Reset Input Pin Hysteresis vs. VCC 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold ( V) 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (m V)ATmega8A [DATASHEET] 258 8159E–AVR–02/2013 28.9 Bod Thresholds and Analog Comparator Offset Figure 28-46. BOD Thresholds vs. Temperature (BOD Level is 4.0V) Figure 28-47. BOD Thresholds vs. Temperature (BOD Level is 2.7v) 3.7 3.75 3.8 3.85 3.9 3.95 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Threshold ( V) Rising Vcc Falling Vcc Temperature (°C) 2.5 2.55 2.6 2.65 2.7 2.75 2.8 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature (°C) Threshold ( V) Rising Vcc Falling VccATmega8A [DATASHEET] 259 8159E–AVR–02/2013 Figure 28-48. Bandgap Voltage vs. VCC Figure 28-49. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 5V) 85 °C 25 °C -40 °C 1.18 1.185 1.19 1.195 1.2 1.205 1.21 1.215 2.5 3 3.5 4 4.5 5 5.5 Vcc (V) Bandgap Voltage ( V) Comparator Offset Voltage (V) 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Common Mode Voltage (V) 85 °C 25 °C -40 °C -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003ATmega8A [DATASHEET] 260 8159E–AVR–02/2013 Figure 28-50. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 2.8V) 28.10 Internal Oscillator Speed Figure 28-51. Watchdog Oscillator Frequency vs. VCC -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0.25 0.50 0.75 1.00 1.25 1.5 1.75 2.00 2.25 2.75 Common Mode Voltage (V) 2.50 Comparator Offset Voltage (V) 85 °C 25 °C -40 °C 85 °C 25 °C -40 °C 925 950 975 1000 1025 1050 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (kHz)ATmega8A [DATASHEET] 261 8159E–AVR–02/2013 Figure 28-52. Calibrated 8MHz RC Oscillator Frequency vs. Temperature Figure 28-53. Calibrated 8MHz RC Oscillator Frequency vs. VCC 5.5 V 4.0 V 2.7 V 6 6,5 7 7,5 8 8,5 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (MHz) 85 °C 25 °C -40 °C 6 6.5 7 7.5 8 8.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz)ATmega8A [DATASHEET] 262 8159E–AVR–02/2013 Figure 28-54. Calibrated 8MHz RC Oscillator Frequency vs. Osccal Value Figure 28-55. Calibrated 4MHz RC Oscillator Frequency vs. Temperature 25 °C 2 4 6 8 10 12 14 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL VALUE FRC (MHz) 5.5 V 4.0 V 2.7 V 3.5 3.6 3.7 3.8 3.9 4 4.1 -40 -20 0 20 40 60 80 100 FRC (MHz) Temperature (°C)ATmega8A [DATASHEET] 263 8159E–AVR–02/2013 Figure 28-56. Calibrated 4MHz RC Oscillator Frequency vs. VCC Figure 28-57. Calibrated 4MHz RC Oscillator Frequency vs. Osccal Value 85 °C 25 °C -40 °C 3.5 3.6 3.7 3.8 3.9 4 4.1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 25 °C 1 2 3 4 5 6 7 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL VALUE FRC (MHz)ATmega8A [DATASHEET] 264 8159E–AVR–02/2013 Figure 28-58. Calibrated 2MHz RC Oscillator Frequency vs. Temperature Figure 28-59. Calibrated 2MHz RC Oscillator Frequency vs. VCC 5.5 V 4.0 V 2.7 V 1.75 1.8 1.85 1.9 1.95 2 2.05 2.1 -40 -20 0 20 40 60 80 100 FRC (MHz) Temperature (°C) 85 °C 25 °C -40 °C 1.8 1.85 1.9 1.95 2 2.05 2.1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz)ATmega8A [DATASHEET] 265 8159E–AVR–02/2013 Figure 28-60. Calibrated 2MHz RC Oscillator Frequency vs. Osccal Value Figure 28-61. Calibrated 1MHz RC Oscillator Frequency vs. Temperature 25 °C 0.5 1 1.5 2 2.5 3 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL VALUE FRC (MHz) 5.5 V 4.0 V 2.7 V 0.9 0.92 0.94 0.96 0.98 1 1.02 1.04 -40 -20 0 20 40 60 80 100 FRC (MHz) Temperature (°C)ATmega8A [DATASHEET] 266 8159E–AVR–02/2013 Figure 28-62. Calibrated 1MHz RC Oscillator Frequency vs. VCC Figure 28-63. Calibrated 1MHz RC Oscillator Frequency vs. Osccal Value 85 °C 25 °C -40 °C 0,9 0.92 0.94 0.96 0.98 1 1.02 1.04 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 25 °C 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL VALUE FRC (MHz)ATmega8A [DATASHEET] 267 8159E–AVR–02/2013 28.11 Current Consumption of Peripheral Units Figure 28-64. Brown-out Detector Current vs. VCC Figure 28-65. ADC Current vs. VCC (AREF = AVCC) 85 °C 25 °C -40 °C 0 4 8 12 16 20 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 100 125 150 175 200 225 250 275 300 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 268 8159E–AVR–02/2013 Figure 28-66. AREF External Reference Current vs. VCC Figure 28-67. 32kHz TOSC Current vs. VCC (Watchdog Timer Disabled) 85 °C 25 °C -40 °C 40 60 80 100 120 140 160 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 2 4 6 8 10 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 269 8159E–AVR–02/2013 Figure 28-68. Watchdog Timer Current vs. VCC Figure 28-69. Analog Comparator Current vs. VCC 85 °C 25 °C -40 °C 0 4 8 12 16 20 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 70 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 270 8159E–AVR–02/2013 Figure 28-70. Programming Current vs. VCC 28.12 Current Consumption in Reset and Reset Pulsewidth Figure 28-71. Reset Supply Current vs. VCC (0.1 - 1.0MHz, Excluding Current Through The Reset Pull-up) 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.3 V 2.7 V 0 0.5 1 1.5 2 2.5 3 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)ATmega8A [DATASHEET] 271 8159E–AVR–02/2013 Figure 28-72. Reset Supply Current vs. VCC (1 - 16MHz, Excluding Current Through The Reset Pull-up) Figure 28-73. Reset Pulse Width vs. VCC 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.3 V 2.7 V 0 2 4 6 8 10 12 0246 8 10 12 14 16 Frequency (MHz) ICC (mA) 85 °C 25 °C -40 °C 0 150 300 450 600 750 2,5 3 3,5 4 4,5 5 5,5 V CC (V) Pulsewidth (ns)ATmega8A [DATASHEET] 272 8159E–AVR–02/2013 29. Typical Characteristics – TA = -40°C to 105°C The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock source. All Active- and Idle current consumption measurements are done with all bits in the PRR registers set and thus, the corresponding I/O modules are turned off. Also the Analog Comparator is disabled during these measurements. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. 29.1 ATmega8A Typical Characteristics 29.1.1 Active Supply Current Figure 29-1. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) 105 °C 85 °C 25 °C -40 °C 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 273 8159E–AVR–02/2013 Figure 29-2. Active Supply Current vs. VCC (Internal RC Oscillator, 4 MHz) Figure 29-3. Active Supply Current vs. VCC (Internal RC Oscillator, 2 MHz) 105 °C 85 °C 25 °C -40 °C 1.5 2 2.5 3 3.5 4 4.5 5 5.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA) 105 °C 85 °C 25 °C -40 °C 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 3.25 3.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 274 8159E–AVR–02/2013 Figure 29-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) Figure 29-5. Active Supply Current vs. VCC (32 kHz External Oscillator) 105 °C 85 °C 25 °C -40 °C 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA) 105 °C 85 °C 25 °C -40 °C 35 38 41 44 47 50 53 56 59 62 65 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 275 8159E–AVR–02/2013 29.1.2 Idle Supply Current Figure 29-6. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) Figure 29-7. Idle Supply Current vs. VCC (Internal RC Oscillator, 4 MHz) 105 °C 85 °C 25 °C -40 °C 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 3.9 4.2 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA) 105 °C 85 °C 25 °C -40 °C 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 276 8159E–AVR–02/2013 Figure 29-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 2 MHz) Figure 29-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) 105 °C 85 °C 25 °C -40 °C 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA) 105 °C 85 °C 25 °C -40 °C 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA)ATmega8A [DATASHEET] 277 8159E–AVR–02/2013 Figure 29-10. Idle Supply Current vs. VCC (32 kHz External RC Oscillator) 29.1.3 Power-down Supply Current Figure 29-11. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) 105 °C 85 °C 25 °C -40 °C 6.5 8.5 10.5 12.5 14.5 16.5 18.5 20.5 22.5 24.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA) 105 °C 85 °C 25 °C -40 °C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 278 8159E–AVR–02/2013 Figure 29-12. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) 29.1.4 Power-save Supply Current Figure 29-13. Power-save Supply Current vs. VCC (Watchdog Timer Disabled) 105 °C 85 °C 25 °C -40 °C 3 6 9 12 15 18 21 24 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA) 105 °C 85 °C 25 °C -40 °C 4 5 6 7 8 9 10 11 12 13 14 15 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 279 8159E–AVR–02/2013 29.1.5 Standby Supply Current Figure 29-14. Standby Supply Current vs. VCC (32 kHz External RC Oscillator) 29.1.6 Pin Pull-up Figure 29-15. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V) 105 °C 85 °C 25 °C -40 °C 7 9 11 13 15 17 19 21 23 25 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA) 0 20 40 60 80 100 120 140 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VOP (V) IOP (uA) 105 °C 85 °C 25 °C -40 °CATmega8A [DATASHEET] 280 8159E–AVR–02/2013 Figure 29-16. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V) Figure 29-17. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) 105 °C 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 70 80 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VOP (V) IOP (uA) 0 10 20 30 40 50 60 70 80 90 100 110 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VRESET (V) IRESET (uA) 105 °C 85 °C 25 °C -40 °CATmega8A [DATASHEET] 281 8159E–AVR–02/2013 Figure 29-18. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) 29.1.7 Pin Driver Strength Figure 29-19. I/O Pin Output Voltage vs. Source Current (VCC = 5V) 105 °C 85 °C 25 °C -40 °C 0 10 20 30 40 50 60 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VRESET (V) IRESET (uA) 105 °C 85 °C 25 °C -40 °C 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 5.1 0246 8 10 12 14 16 18 20 IOH (mA) VOH ( V)ATmega8A [DATASHEET] 282 8159E–AVR–02/2013 Figure 29-20. I/O Pin Output Voltage vs. Source Current (VCC = 3V) Figure 29-21. I/O Pin Output Voltage vs. Sink Current (VCC = 5V) 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 0246 8 10 12 14 16 18 20 IOH (mA) VOH ( V) 105 °C 85 °C 25 °C -40 °C 105 °C 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0246 8 10 12 14 16 18 20 IOL (mA) VOL ( V)ATmega8A [DATASHEET] 283 8159E–AVR–02/2013 Figure 29-22. I/O Pin Output Voltage vs. Sink Current (VCC = 3V) 29.1.8 Pin Threshold and Hysteresis Figure 29-23. I/O Pin Input Threshold vs. VCC (VIH , I/O Pin Read as ‘1’) 105 °C 85 °C 25 °C -40 °C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0246 8 10 12 14 16 18 20 IOL(mA) VOL ( V) 105 °C 85 °C 25 °C -40 °C 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Threshold ( V)ATmega8A [DATASHEET] 284 8159E–AVR–02/2013 Figure 29-24. I/O Pin Input Threshold vs. VCC (VIL, I/O Pin Read as ‘0’) Figure 29-25. I/O Pin Input Hysteresis vs. VCC 105 °C 85 °C 25 °C -40 °C 1 1.3 1.6 1.9 2.2 2.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Threshold ( V) 105 °C 85 °C 25 °C -40 °C 0.25 0.3 0.35 0.4 0.45 0.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Input Hysteresis (m V)ATmega8A [DATASHEET] 285 8159E–AVR–02/2013 Figure 29-26. Reset Pin as I/O - Input Threshold vs. VCC (VIH , I/O Pin Read as ‘1’) Figure 29-27. Reset Pin as I/O - Input Threshold vs. VCC (VIL, I/O Pin Read as ‘0’) 105 °C 85 °C 25 °C -40 °C 1.3 1.6 1.9 2.2 2.5 2.8 3.1 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Threshold ( V) 105 °C 85 °C 25 °C -40 °C 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Threshold ( V)ATmega8A [DATASHEET] 286 8159E–AVR–02/2013 Figure 29-28. Reset Pin as I/O - Pin Hysteresis vs. VCC Figure 29-29. Reset Input Threshold vs. VCC (VIH , Reset Pin Read as ‘1’) 105 °C 85 °C 25 °C -40 °C 0.4 0.45 0.5 0.55 0.6 0.65 0.7 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Input Hysteresis (m V) 105 °C 85 °C 25 °C -40 °C 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Threshold ( V)ATmega8A [DATASHEET] 287 8159E–AVR–02/2013 Figure 29-30. Reset Input Threshold vs. VCC (VIL, Reset Pin Read as ‘0’) Figure 29-31. Reset Pin Input Hysteresis vs. VCC 105 °C 85 °C 25 °C -40 °C 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Threshold ( V) 105 °C 85 °C 25 °C -40 °C 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Input Hysteresis (m V)ATmega8A [DATASHEET] 288 8159E–AVR–02/2013 29.1.9 BOD Threshold Figure 29-32. BOD Threshold vs. Temperature (VCC = 4.3V) Figure 29-33. BOD Threshold vs. Temperature (VCC = 2.7V) Rising Vcc Falling Vcc 3.8 3.82 3.84 3.86 3.88 3.9 3.92 3.94 3.96 3.98 4 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) Threshold ( V) Rising Vcc Falling Vcc 2.47 2.49 2.51 2.53 2.55 2.57 2.59 2.61 2.63 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) Threshold ( V)ATmega8A [DATASHEET] 289 8159E–AVR–02/2013 Figure 29-34. Bandgap Voltage vs. Temperature Figure 29-35. Bandgap Voltage vs. VCC 5.5V 5.0V 4.0V 3.3V 2.7V 1.8V 1.175 1.18 1.185 1.19 1.195 1.2 1.205 1.21 1.215 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) Bandgap Voltage ( V) 105 °C 85 °C 25 °C -40 °C 1.175 1.18 1.185 1.19 1.195 1.2 1.205 1.21 1.215 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Bandgap Voltage ( V)ATmega8A [DATASHEET] 290 8159E–AVR–02/2013 29.1.10 Internal Oscillator Speed Figure 29-36. Watchdog Oscillator Frequency vs. VCC Figure 29-37. Watchdog Oscillator Frequency vs. Temperature 105 °C 85 °C 25 °C -40 °C 980 1000 1020 1040 1060 1080 1100 1120 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) FRC (kHz) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 2.7 V 970 990 1010 1030 1050 1070 1090 1110 1130 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) FRC (kHz)ATmega8A [DATASHEET] 291 8159E–AVR–02/2013 Figure 29-38. Calibrated 8 MHz RC Oscillator vs. Temperature Figure 29-39. Calibrated 8 MHz RC Oscillator vs. VCC 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.0 V 2.7 V 6.6 6.8 7 7.2 7.4 7.6 7.8 8 8.2 8.4 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) FRC (MHz) 105 °C 85 °C 25 °C -40 °C 6.6 6.8 7 7.2 7.4 7.6 7.8 8 8.2 8.4 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) FRC (MHz)ATmega8A [DATASHEET] 292 8159E–AVR–02/2013 Figure 29-40. Calibrated 8 MHz RC Oscillator vs. OSCCAL Value Figure 29-41. Calibrated 4 MHz RC Oscillator vs. Temperature 105 °C 85 °C 25 °C -40 °C 2 4 6 8 10 12 14 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL (X1) FRC (MHz) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.0 V 2.7 V 3.55 3.65 3.75 3.85 3.95 4.05 4.15 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) FRC (MHz)ATmega8A [DATASHEET] 293 8159E–AVR–02/2013 Figure 29-42. Calibrated 4 MHz RC Oscillator vs. VCC Figure 29-43. Calibrated 4 MHz RC Oscillator vs. OSCCAL Value 105 °C 85 °C 25 °C -40 °C 3.6 3.65 3.7 3.75 3.8 3.85 3.9 3.95 4 4.05 4.1 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) FRC (MHz) 105 °C 85 °C 25 °C -40 °C 1 2 3 4 5 6 7 8 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL (X1) FRC (MHz)ATmega8A [DATASHEET] 294 8159E–AVR–02/2013 Figure 29-44. Calibrated 2 MHz RC Oscillator vs. Temperature Figure 29-45. Calibrated 2 MHz RC Oscillator vs. VCC 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.0 V 2.7 V 1.78 1.81 1.84 1.87 1.9 1.93 1.96 1.99 2.02 2.05 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) FRC (MHz) 105 °C 85 °C 25 °C -40 °C 1.8 1.83 1.86 1.89 1.92 1.95 1.98 2.01 2.04 2.07 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) FRC (MHz)ATmega8A [DATASHEET] 295 8159E–AVR–02/2013 Figure 29-46. Calibrated 2 MHz RC Oscillator vs. OSCCAL Value Figure 29-47. Calibrated 1 MHz RC Oscillator vs. Temperature 105 °C 85 °C 25 °C -40 °C 0.8 1.1 1.4 1.7 2 2.3 2.6 2.9 3.2 3.5 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL (X1) FRC (MHz) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 3.0 V 2.7 V 0.91 0.93 0.95 0.97 0.99 1.01 1.03 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 Temperature (°C) FRC (MHz)ATmega8A [DATASHEET] 296 8159E–AVR–02/2013 Figure 29-48. Calibrated 1 MHz RC Oscillator vs. VCC Figure 29-49. Calibrated 1 MHz RC Oscillator vs. OSCCAL Value 105 °C 85 °C 25 °C -40 °C 0.9 0.92 0.94 0.96 0.98 1 1.02 1.04 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) FRC (MHz) 105 °C 85 °C 25 °C -40 °C 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256 OSCCAL (X1) FRC (MHz)ATmega8A [DATASHEET] 297 8159E–AVR–02/2013 29.1.11 Current Consumption of Peripheral Units Figure 29-50. Brown-out Detector Current vs. VCC Figure 29-51. ADC Current vs. VCC (AREF = AVCC) 105 °C 85 °C 25 °C -40 °C 8 9 10 11 12 13 14 15 16 17 18 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA) 105 °C 85 °C 25 °C -40 °C 140 160 180 200 220 240 260 280 300 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA)ATmega8A [DATASHEET] 298 8159E–AVR–02/2013 Figure 29-52. Watchdog Timer Current vs. VCC Figure 29-53. Analog Comparator Current vs. VCC 4 6 8 10 12 14 16 18 20 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (uA) 105 °C 85 °C 25 °C -40 °C 32 36 40 44 48 52 56 60 64 68 72 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA) 105 °C 85 °C 25 °C -40 °CATmega8A [DATASHEET] 299 8159E–AVR–02/2013 Figure 29-54. Programming Current vs. VCC 29.1.12 Current Consumption in Reset and Reset Pulsewidth Figure 29-55. Reset Supply Current vs. Vcc (0.1 - 1.0 MHz, Excluding Current Through the Reset Pull-up) 105 °C 85 °C 25 °C -40 °C 0 1 2 3 4 5 6 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) ICC (mA) 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 2.7 V 0 0.5 1 1.5 2 2.5 3 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)ATmega8A [DATASHEET] 300 8159E–AVR–02/2013 Figure 29-56. Reset Supply Current vs. Vcc (1 - 16 MHz, Excluding Current Through the Reset Pull-up) Figure 29-57. Minimum Reset Pulsewidth vs. Vcc 5.5 V 5.0 V 4.5 V 4.0 V 3.6 V 2.7 V 0 2 4 6 8 10 12 0246 8 10 12 14 16 Frequency (MHz) ICC (mA) 105 °C 85 °C 25 °C -40 °C 100 200 300 400 500 600 700 800 2.5 2.8 3.1 3.4 3.7 4 4.3 4.6 4.9 5.2 5.5 VCC (V) Pulse width (ns)ATmega8A [DATASHEET] 301 8159E–AVR–02/2013 30. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F (0x5F) SREG I T H S V N Z C 8 0x3E (0x5E) SPH – – – – – SP10 SP9 SP8 10 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 10 0x3C (0x5C) Reserved 0x3B (0x5B) GICR INT1 INT0 – – – – IVSEL IVCE 47, 65 0x3A (0x5A) GIFR INTF1 INTF0 – – – – – – 65 0x39 (0x59) TIMSK OCIE2 TOIE2 TICIE1 OCIE1A OCIE1B TOIE1 – TOIE0 69, 97, 115 0x38 (0x58) TIFR OCF2 TOV2 ICF1 OCF1A OCF1B TOV1 – TOV0 70, 97, 97 0x37 (0x57) SPMCR SPMIE RWWSB – RWWSRE BLBSET PGWRT PGERS SPMEN 205 0x36 (0x56) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE 176 0x35 (0x55) MCUCR SE SM2 SM1 SM0 ISC11 ISC10 ISC01 ISC00 35, 64 0x34 (0x54) MCUCSR – – – – WDRF BORF EXTRF PORF 42 0x33 (0x53) TCCR0 – – – – – CS02 CS01 CS00 69 0x32 (0x52) TCNT0 Timer/Counter0 (8 Bits) 69 0x31 (0x51) OSCCAL Oscillator Calibration Register 31 0x30 (0x50) SFIOR – – – – ACME PUD PSR2 PSR10 55, 72, 115, 180 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 FOC1A FOC1B WGM11 WGM10 92 0x2E (0x4E) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 95 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High byte 96 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low byte 96 0x2B (0x4B) OCR1AH Timer/Counter1 – Output Compare Register A High byte 96 0x2A (0x4A) OCR1AL Timer/Counter1 – Output Compare Register A Low byte 96 0x29 (0x49) OCR1BH Timer/Counter1 – Output Compare Register B High byte 96 0x28 (0x48) OCR1BL Timer/Counter1 – Output Compare Register B Low byte 96 0x27 (0x47) ICR1H Timer/Counter1 – Input Capture Register High byte 96 0x26 (0x46) ICR1L Timer/Counter1 – Input Capture Register Low byte 96 0x25 (0x45) TCCR2 FOC2 WGM20 COM21 COM20 WGM21 CS22 CS21 CS20 112 0x24 (0x44) TCNT2 Timer/Counter2 (8 Bits) 113 0x23 (0x43) OCR2 Timer/Counter2 Output Compare Register 114 0x22 (0x42) ASSR – – – – AS2 TCN2UB OCR2UB TCR2UB 114 0x21 (0x41) WDTCR – – – WDCE WDE WDP2 WDP1 WDP0 42 0x20(1) (0x40)(1) UBRRH URSEL – – – UBRR[11:8] 147 UCSRC URSEL UMSEL UPM1 UPM0 USBS UCSZ1 UCSZ0 UCPOL 145 0x1F (0x3F) EEARH – – – – – – – EEAR8 18 0x1E (0x3E) EEARL EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 18 0x1D (0x3D) EEDR EEPROM Data Register 18 0x1C (0x3C) EECR – – – – EERIE EEMWE EEWE EERE 18 0x1B (0x3B) Reserved 0x1A (0x3A) Reserved 0x19 (0x39) Reserved 0x18 (0x38) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 62 0x17 (0x37) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 62 0x16 (0x36) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 63 0x15 (0x35) PORTC – PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 63 0x14 (0x34) DDRC – DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 63 0x13 (0x33) PINC – PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 63 0x12 (0x32) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 63 0x11 (0x31) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 63 0x10 (0x30) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 63 0x0F (0x2F) SPDR SPI Data Register 124 0x0E (0x2E) SPSR SPIF WCOL – – – – – SPI2X 124 0x0D (0x2D) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 123 0x0C (0x2C) UDR USART I/O Data Register 143 0x0B (0x2B) UCSRA RXC TXC UDRE FE DOR PE U2X MPCM 144 0x0A (0x2A) UCSRB RXCIE TXCIE UDRIE RXEN TXEN UCSZ2 RXB8 TXB8 145 0x09 (0x29) UBRRL USART Baud Rate Register Low byte 147 0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 180 0x07 (0x27) ADMUX REFS1 REFS0 ADLAR – MUX3 MUX2 MUX1 MUX0 190 0x06 (0x26) ADCSRA ADEN ADSC ADFR ADIF ADIE ADPS2 ADPS1 ADPS0 191 0x05 (0x25) ADCH ADC Data Register High byte 193 0x04 (0x24) ADCL ADC Data Register Low byte 193 0x03 (0x23) TWDR Two-wire Serial Interface Data Register 178 0x02 (0x22) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE 178 0x01 (0x21) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 – TWPS1 TWPS0 177 0x00 (0x20) TWBR Two-wire Serial Interface Bit Rate Register 176ATmega8A [DATASHEET] 302 8159E–AVR–02/2013 Note: 1. Refer to the USART description for details on how to access UBRRH and UCSRC. 2. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on all bits in the I/O Register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions work with registers 0x00 to 0x1F only.ATmega8A [DATASHEET] 303 8159E–AVR–02/2013 31. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd  Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd  Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl  Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd  Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd  Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd  Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd  Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl  Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd Rd  Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd  Rd K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd  Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd  Rd  Rr Z,N,V 1 COM Rd One’s Complement Rd  0xFF  Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd  0x00  Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd  Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd  Rd  (0xFF - K) Z,N,V 1 INC Rd Increment Rd  Rd + 1 Z,N,V 1 DEC Rd Decrement Rd  Rd  1 Z,N,V 1 TST Rd Test for Zero or Minus Rd  Rd  Rd Z,N,V 1 CLR Rd Clear Register Rd  Rd  Rd Z,N,V 1 SER Rd Set Register Rd  0xFF None 1 MUL Rd, Rr Multiply Unsigned R1:R0  Rd x Rr Z,C 2 MULS Rd, Rr Multiply Signed R1:R0  Rd x Rr Z,C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0  Rd x Rr Z,C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0  (Rd x Rr) << 1 Z,C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0  (Rd x Rr) << 1 Z,C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0  (Rd x Rr) << 1 Z,C 2 BRANCH INSTRUCTIONS RJMP k Relative Jump PC PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC  Z None 2 RCALL k Relative Subroutine Call PC  PC + k + 1 None 3 ICALL Indirect Call to (Z) PC  Z None 3 RET Subroutine Return PC  STACK None 4 RETI Interrupt Return PC  STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1 / 2 / 3 CP Rd,Rr Compare Rd  Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd  Rr  C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd  K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC  PC + 2 or 3 None 1 / 2 / 3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC  PC + 2 or 3 None 1 / 2 / 3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC  PC + 2 or 3 None 1 / 2 / 3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC  PC + 2 or 3 None 1 / 2 / 3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PCPC+k + 1 None 1 / 2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PCPC+k + 1 None 1 / 2 BREQ k Branch if Equal if (Z = 1) then PC  PC + k + 1 None 1 / 2 BRNE k Branch if Not Equal if (Z = 0) then PC  PC + k + 1 None 1 / 2 BRCS k Branch if Carry Set if (C = 1) then PC  PC + k + 1 None 1 / 2 BRCC k Branch if Carry Cleared if (C = 0) then PC  PC + k + 1 None 1 / 2 BRSH k Branch if Same or Higher if (C = 0) then PC  PC + k + 1 None 1 / 2 BRLO k Branch if Lower if (C = 1) then PC  PC + k + 1 None 1 / 2 BRMI k Branch if Minus if (N = 1) then PC  PC + k + 1 None 1 / 2 BRPL k Branch if Plus if (N = 0) then PC  PC + k + 1 None 1 / 2 BRGE k Branch if Greater or Equal, Signed if (N  V= 0) then PC  PC + k + 1 None 1 / 2 BRLT k Branch if Less Than Zero, Signed if (N  V= 1) then PC  PC + k + 1 None 1 / 2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC  PC + k + 1 None 1 / 2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC  PC + k + 1 None 1 / 2 BRTS k Branch if T Flag Set if (T = 1) then PC  PC + k + 1 None 1 / 2 BRTC k Branch if T Flag Cleared if (T = 0) then PC  PC + k + 1 None 1 / 2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC  PC + k + 1 None 1 / 2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC  PC + k + 1 None 1 / 2 Mnemonics Operands Description Operation Flags #Clocks BRIE k Branch if Interrupt Enabled if ( I = 1) then PC  PC + k + 1 None 1 / 2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC  PC + k + 1 None 1 / 2ATmega8A [DATASHEET] 304 8159E–AVR–02/2013 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd  Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd  Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd  K None 1 LD Rd, X Load Indirect Rd  (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd  (X), X  X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X  X - 1, Rd  (X) None 2 LD Rd, Y Load Indirect Rd  (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd  (Y), Y  Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y  Y - 1, Rd  (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd  (Y + q) None 2 LD Rd, Z Load Indirect Rd  (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd  (Z), Z  Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z  Z - 1, Rd  (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd  (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd  (k) None 2 ST X, Rr Store Indirect (X) Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) Rr, X  X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X  X - 1, (X)  Rr None 2 ST Y, Rr Store Indirect (Y)  Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y)  Rr, Y  Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y  Y - 1, (Y)  Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q)  Rr None 2 ST Z, Rr Store Indirect (Z)  Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z)  Rr, Z  Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z  Z - 1, (Z)  Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q)  Rr None 2 STS k, Rr Store Direct to SRAM (k)  Rr None 2 LPM Load Program Memory R0  (Z) None 3 LPM Rd, Z Load Program Memory Rd  (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd  (Z), Z  Z+1 None 3 SPM Store Program Memory (Z)  R1:R0 None - IN Rd, P In Port Rd  P None 1 OUT P, Rr Out Port P  Rr None 1 PUSH Rr Push Register on Stack STACK  Rr None 2 POP Rd Pop Register from Stack Rd  STACK None 2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b)  1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b)  0 None 2 LSL Rd Logical Shift Left Rd(n+1)  Rd(n), Rd(0)  0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n)  Rd(n+1), Rd(7)  0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)C,Rd(n+1) Rd(n),CRd(7) Z,C,N,V 1 ROR Rd Rotate Right Through Carry Rd(7)C,Rd(n) Rd(n+1),CRd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n)  Rd(n+1), n=0:6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3:0)Rd(7:4),Rd(7:4)Rd(3:0) None 1 BSET s Flag Set SREG(s)  1 SREG(s) 1 BCLR s Flag Clear SREG(s)  0 SREG(s) 1 BST Rr, b Bit Store from Register to T T  Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b)  T None 1 SEC Set Carry C  1 C1 CLC Clear Carry C  0 C 1 SEN Set Negative Flag N  1 N1 CLN Clear Negative Flag N  0 N 1 SEZ Set Zero Flag Z  1 Z1 CLZ Clear Zero Flag Z  0 Z 1 SEI Global Interrupt Enable I  1 I1 CLI Global Interrupt Disable I 0 I 1 SES Set Signed Test Flag S  1 S1 CLS Clear Signed Test Flag S  0 S 1 SEV Set Twos Complement Overflow. V  1 V1 CLV Clear Twos Complement Overflow V  0 V 1 SET Set T in SREG T  1 T1 Mnemonics Operands Description Operation Flags #Clocks CLT Clear T in SREG T  0 T 1 SEH Set Half Carry Flag in SREG H  1 H1 CLH Clear Half Carry Flag in SREG H  0 H 1 MCU CONTROL INSTRUCTIONS 31. Instruction Set Summary (Continued)ATmega8A [DATASHEET] 305 8159E–AVR–02/2013 NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 31. Instruction Set Summary (Continued)ATmega8A [DATASHEET] 306 8159E–AVR–02/2013 32. Ordering Information Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging alternative, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. Tape & Reel 4. See characterization specifications at 105C Speed (MHz) Power Supply (V) Ordering Code(2) Package(1) Operation Range 16 2.7 - 5.5 ATmega8A-AU ATmega8A-AUR(3) ATmega8A-PU ATmega8A-MU ATmega8A-MUR(3) 32A 32A 28P3 32M1-A 32M1-A Industrial (-40C to 85C) ATmega8A-AN ATmega8A-ANR(3) ATmega8A-PN ATmega8A-MN ATmega8A-MNR(3) 32A 32A 28P3 32M1-A 32M1-A Extended (-40C to 105C)(4) Package Type 32A 32-lead, Thin (1.0mm) Plastic Quad Flat Package (TQFP) 28P3 28-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP) 32M1-A 32-pad, 5 x 5 x 1.0 body, Lead Pitch 0.50 mm Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)ATmega8A [DATASHEET] 307 8159E–AVR–02/2013 33. Packaging Information 33.1 32A TITLE DRAWING NO. REV. 32A, 32-lead, 7 x 7mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) 32A C 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B Notes: 1. This package conforms to JEDEC reference MS-026, Variation ABA. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 8.75 9.00 9.25 D1 6.90 7.00 7.10 Note 2 E 8.75 9.00 9.25 E1 6.90 7.00 7.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP COMMON DIMENSIONS (Unit of measure = mm) SYMBOL MIN NOM MAX NOTEATmega8A [DATASHEET] 308 8159E–AVR–02/2013 33.2 28P3 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 28P3, 28-lead (0.300"/7.62mm Wide) Plastic Dual Inline Package (PDIP) 28P3 B 09/28/01 PIN 1 E1 A1 B REF E B1 C L SEATING PLANE A 0º ~ 15º D e eB B2 (4 PLACES) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 4.5724 A1 0.508 – – D 34.544 – 34.798 Note 1 E 7.620 – 8.255 E1 7.112 – 7.493 Note 1 B 0.381 – 0.533 B1 1.143 – 1.397 B2 0.762 – 1.143 L 3.175 – 3.429 C 0.203 – 0.356 eB – – 10.160 e 2.540 TYP Note: 1. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25mm (0.010"). ATmega8A [DATASHEET] 309 8159E–AVR–02/2013 32M1-A 34. Errata 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 32M1-A, 32-pad, 5 x 5 x 1.0mm Body, Lead Pitch 0.50mm, 32M1-A E 5/25/06 3.10mm Exposed Pad, Micro Lead Frame Package (MLF) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D1 D E1 E b e A3 A2 A1 A D2 E2 0.08 C L 1 2 3 P P 0 1 2 3 A 0.80 0.90 1.00 A1 – 0.02 0.05 A2 – 0.65 1.00 A3 0.20 REF b 0.18 0.23 0.30 D D1 D2 2.95 3.10 3.25 4.90 5.00 5.10 4.70 4.75 4.80 4.70 4.75 4.80 4.90 5.00 5.10 E E1 E2 2.95 3.10 3.25 e 0.50 BSC L 0.30 0.40 0.50 P – – 0.60 – – 12o Note: JEDEC Standard MO-220, Fig. 2 (Anvil Singulation), VHHD-2. TOP VIEW SIDE VIEW BOTTOM VIEW 0 Pin 1 ID Pin #1 Notch (0.20 R) K 0.20 – – K KATmega8A [DATASHEET] 310 8159E–AVR–02/2013 The revision letter in this section refers to the revision of the ATmega8A device. 34.1 ATmega8A, rev. L • First Analog Comparator conversion may be delayed • Interrupts may be lost when writing the timer registers in the asynchronous timer • Signature may be Erased in Serial Programming Mode • CKOPT Does not Enable Internal Capacitors on XTALn/TOSCn Pins when 32kHz Oscillator is Used to Clock the Asynchronous Timer/Counter2 • Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request 1. First Analog Comparator conversion may be delayed If the device is powered by a slow rising VCC, the first Analog Comparator conversion will take longer than expected on some devices. Problem Fix / Workaround When the device has been powered or reset, disable then enable theAnalog Comparator before the first conversion. 2. Interrupts may be lost when writing the timer registers in the asynchronous timer The interrupt will be lost if a timer register that is synchronous timer clock is written when the asynchronous Timer/Counter register (TCNTx) is 0x00. Problem Fix / Workaround Always check that the asynchronous Timer/Counter register neither have the value 0xFF nor 0x00 before writing to the asynchronous Timer Control Register (TCCRx), asynchronous Timer Counter Register (TCNTx), or asynchronous Output Compare Register (OCRx). 3. Signature may be Erased in Serial Programming Mode If the signature bytes are read before a chiperase command is completed, the signature may be erased causing the device ID and calibration bytes to disappear. This is critical, especially, if the part is running on internal RC oscillator. Problem Fix / Workaround: Ensure that the chiperase command has exceeded before applying the next command. 4. CKOPT Does not Enable Internal Capacitors on XTALn/TOSCn Pins when 32kHz Oscillator is Used to Clock the Asynchronous Timer/Counter2 When the internal RC Oscillator is used as the main clock source, it is possible to run the Timer/Counter2 asynchronously by connecting a 32kHz Oscillator between XTAL1/TOSC1 and XTAL2/TOSC2. But when the internal RC Oscillator is selected as the main clock source, the CKOPT Fuse does not control the internal capacitors on XTAL1/TOSC1 and XTAL2/TOSC2. As long as there are no capacitors connected to XTAL1/TOSC1 and XTAL2/TOSC2, safe operation of the Oscillator is not guaranteed. Problem Fix / Workaround Use external capacitors in the range of 20 - 36 pF on XTAL1/TOSC1 and XTAL2/TOSC2. This will be fixed in ATmega8A Rev. G where the CKOPT Fuse will control internal capacitors also when internal RC Oscillator is selected as main clock source. For ATmega8A Rev. G, CKOPT = 0 (programmed) will enable the internal capacitors on XTAL1 and XTAL2. Customers who want compatibility between Rev. G and older revisions, must ensure that CKOPT is unprogrammed (CKOPT = 1).ATmega8A [DATASHEET] 311 8159E–AVR–02/2013 5. Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request. Reading EEPROM by using the ST or STS command to set the EERE bit in the EECR register triggers an unexpected EEPROM interrupt request. Problem Fix / Workaround Always use OUT or SBI to set EERE in EECR.ATmega8A [DATASHEET] 312 8159E–AVR–02/2013 35. Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revision in this section refers to the document revision. 35.1 Rev.8159E – 02/2013 35.2 Rev.8159D – 02/11 35.3 Rev.8159C – 07/09 35.4 Rev.8159B – 05/09 1. Applied the Atmel new page layout for datasheets including new logo and last page. 2. Removed the reference to the debuggers and In-Circuit Emulators. 3. Added “Capacitive touch sensing” on page 6. 4. Added “Electrical Characteristics – TA = -40°C to 105°C” on page 233. 5. Added “Typical Characteristics – TA = -40°C to 105°C” on page 272. 1. Updated the datasheet according to the Atmel new Brand Style Guide. 2. Updated “Performing Page Erase by SPM” on page 200 by adding an extra note. 3. Updated “Ordering Information” on page 306 to include Tape & Reel. 1. Updated “Errata” on page 309. 1. Updated “System and Reset Characteristics” on page 228 with new BODLEVEL values 2. Updated “ADC Characteristics” on page 232 with new VINT values. 3. Updated “Typical Characteristics – TA = -40°C to 85°C” view. 4. Updated “Errata” on page 309. ATmega8A, rev L. 5. Created a new Table Of Contents.ATmega8A [DATASHEET] 313 8159E–AVR–02/2013 35.5 Rev.8159A – 08/08 1. Initial revision (Based on the ATmega8/L datasheet 2486T-AVR-05/08) 2. Changes done compared to ATmega8/L datasheet 2486T-AVR-05/08: – All Electrical Characteristics are moved to “Electrical Characteristics – TA = -40°C to 85°C” on page 225. – Updated “DC Characteristics” on page 225 with new VOL Max (0.9V and 0.6V) and typical value for ICC. – Added “Speed Grades” on page 227. – Added a new sub section “System and Reset Characteristics” on page 228. – Updated “System and Reset Characteristics” on page 228 with new VBOT BODLEVEL = 0 (3.6V, 4.0V and 4.2V). – Register descriptions are moved to sub section at the end of each chapter. – New graphics in “Typical Characteristics – TA = -40°C to 85°C” on page 235. – New “Ordering Information” on page 306.Enter Title of Manual [DATASHEET] i 8159E–AVR–02/2013 Table of Contents Features .....................................................................................................1 1 Pin Configurations ...................................................................................2 2 Overview ...................................................................................................3 2.1 Block Diagram ...................................................................................................3 2.2 Pin Descriptions .................................................................................................4 3 Resources .................................................................................................6 4 Data Retention ..........................................................................................6 5 About Code Examples .............................................................................6 6 Capacitive touch sensing ........................................................................6 7 AVR CPU Core ..........................................................................................7 7.1 Overview ............................................................................................................7 7.2 Arithmetic Logic Unit – ALU ...............................................................................8 7.3 Status Register ..................................................................................................8 7.4 General Purpose Register File ..........................................................................9 7.5 Stack Pointer ...................................................................................................10 7.6 Instruction Execution Timing ...........................................................................11 7.7 Reset and Interrupt Handling ...........................................................................12 8 AVR Memories ........................................................................................15 8.1 Overview ..........................................................................................................15 8.2 In-System Reprogrammable Flash Program Memory .....................................15 8.3 SRAM Data Memory ........................................................................................16 8.4 EEPROM Data Memory ..................................................................................17 8.5 I/O Memory ......................................................................................................17 8.6 Register Description ........................................................................................18 9 System Clock and Clock Options .........................................................24 9.1 Clock Systems and their Distribution ...............................................................24 9.2 Clock Sources .................................................................................................25 9.3 Crystal Oscillator .............................................................................................25 9.4 Low-frequency Crystal Oscillator .....................................................................27 9.5 External RC Oscillator .....................................................................................27 9.6 Calibrated Internal RC Oscillator .....................................................................29 9.7 External Clock .................................................................................................30Enter Title of Manual [DATASHEET] ii 8159E–AVR–02/2013 9.8 Timer/Counter Oscillator ..................................................................................30 9.9 Register Description ........................................................................................31 10 Power Management and Sleep Modes .................................................32 10.1 Sleep Modes ....................................................................................................32 10.2 Idle Mode .........................................................................................................32 10.3 ADC Noise Reduction Mode ............................................................................33 10.4 Power-down Mode ...........................................................................................33 10.5 Power-save Mode ............................................................................................33 10.6 Standby Mode .................................................................................................34 10.7 Minimizing Power Consumption ......................................................................34 10.8 Register Description ........................................................................................35 11 System Control and Reset .....................................................................36 11.1 Resetting the AVR ...........................................................................................36 11.2 Reset Sources .................................................................................................36 11.3 Internal Voltage Reference ..............................................................................39 11.4 Watchdog Timer ..............................................................................................40 11.5 Timed Sequences for Changing the Configuration of the Watchdog Timer ....40 11.6 Register Description ........................................................................................42 12 Interrupts .................................................................................................44 12.1 Interrupt Vectors in ATmega8A .......................................................................44 12.2 Register Description ........................................................................................47 13 I/O Ports ..................................................................................................49 13.1 Overview ..........................................................................................................49 13.2 Ports as General Digital I/O .............................................................................50 13.3 Alternate Port Functions ..................................................................................54 13.4 Register Description ........................................................................................62 14 External Interrupts .................................................................................64 14.1 Register Description ........................................................................................64 15 8-bit Timer/Counter0 ..............................................................................66 15.1 Features ..........................................................................................................66 15.2 Overview ..........................................................................................................66 15.3 Timer/Counter Clock Sources .........................................................................67 15.4 Counter Unit ....................................................................................................67 15.5 Operation .........................................................................................................67 15.6 Timer/Counter Timing Diagrams ......................................................................68Enter Title of Manual [DATASHEET] iii 8159E–AVR–02/2013 15.7 Register Description ........................................................................................69 16 Timer/Counter0 and Timer/Counter1 Prescalers .................................71 16.1 Overview ..........................................................................................................71 16.2 Internal Clock Source ......................................................................................71 16.3 Prescaler Reset ...............................................................................................71 16.4 External Clock Source .....................................................................................71 16.5 Register Description ........................................................................................72 17 16-bit Timer/Counter1 ............................................................................73 17.1 Features ..........................................................................................................73 17.2 Overview ..........................................................................................................73 17.3 Accessing 16-bit Registers ..............................................................................75 17.4 Timer/Counter Clock Sources .........................................................................78 17.5 Counter Unit ....................................................................................................78 17.6 Input Capture Unit ...........................................................................................79 17.7 Output Compare Units .....................................................................................81 17.8 Compare Match Output Unit ............................................................................83 17.9 Modes of Operation .........................................................................................84 17.10 Timer/Counter Timing Diagrams ......................................................................91 17.11 Register Description ........................................................................................92 18 8-bit Timer/Counter2 with PWM and Asynchronous Operation .........99 18.1 Features ..........................................................................................................99 18.2 Overview ..........................................................................................................99 18.3 Timer/Counter Clock Sources .......................................................................100 18.4 Counter Unit ..................................................................................................100 18.5 Output Compare Unit .....................................................................................101 18.6 Compare Match Output Unit ..........................................................................103 18.7 Modes of Operation .......................................................................................104 18.8 Timer/Counter Timing Diagrams ....................................................................108 18.9 Asynchronous Operation of the Timer/Counter .............................................109 18.10 Timer/Counter Prescaler ...............................................................................111 18.11 Register Description ......................................................................................112 19 Serial Peripheral Interface – SPI .........................................................116 19.1 Features ........................................................................................................116 19.2 Overview ........................................................................................................116 19.3 SS Pin Functionality ......................................................................................121Enter Title of Manual [DATASHEET] iv 8159E–AVR–02/2013 19.4 Data Modes ...................................................................................................121 19.5 Register Description ......................................................................................123 20 USART ...................................................................................................125 20.1 Features ........................................................................................................125 20.2 Overview ........................................................................................................125 20.3 Clock Generation ...........................................................................................127 20.4 Frame Formats ..............................................................................................129 20.5 USART Initialization .......................................................................................130 20.6 Data Transmission – The USART Transmitter ..............................................131 20.7 Asynchronous Data Reception ......................................................................138 20.8 Multi-processor Communication Mode ..........................................................141 20.9 Accessing UBRRH/UCSRC Registers ...........................................................142 20.10 Register Description ......................................................................................143 20.11 Examples of Baud Rate Setting .....................................................................147 21 Two-wire Serial Interface .....................................................................152 21.1 Features ........................................................................................................152 21.2 Overview ........................................................................................................152 21.3 Two-wire Serial Interface Bus Definition ........................................................154 21.4 Data Transfer and Frame Format ..................................................................155 21.5 Multi-master Bus Systems, Arbitration and Synchronization .........................157 21.6 Using the TWI ................................................................................................159 21.7 Multi-master Systems and Arbitration ............................................................174 21.8 Register Description ......................................................................................176 22 Analog Comparator ..............................................................................179 22.1 Overview ........................................................................................................179 22.2 Analog Comparator Multiplexed Input ...........................................................179 22.3 Register Description ......................................................................................180 23 Analog-to-Digital Converter ................................................................182 23.1 Features ........................................................................................................182 23.2 Overview ........................................................................................................182 23.3 Starting a Conversion ....................................................................................184 23.4 Prescaling and Conversion Timing ................................................................184 23.5 Changing Channel or Reference Selection ...................................................186 23.6 ADC Noise Canceler .....................................................................................187 23.7 ADC Conversion Result .................................................................................190Enter Title of Manual [DATASHEET] v 8159E–AVR–02/2013 23.8 Register Description ......................................................................................190 24 Boot Loader Support – Read-While-Write Self-Programming .........194 24.1 Features ........................................................................................................194 24.2 Overview ........................................................................................................194 24.3 Application and Boot Loader Flash Sections .................................................194 24.4 Read-While-Write and No Read-While-Write Flash Sections ........................194 24.5 Boot Loader Lock Bits ...................................................................................197 24.6 Entering the Boot Loader Program ................................................................198 24.7 Addressing the Flash During Self-Programming ...........................................198 24.8 Self-Programming the Flash ..........................................................................199 24.9 Register Description ......................................................................................205 25 Memory Programming .........................................................................207 25.1 Program And Data Memory Lock Bits ...........................................................207 25.2 Fuse Bits ........................................................................................................208 25.3 Signature Bytes .............................................................................................209 25.4 Calibration Byte .............................................................................................209 25.5 Page Size ......................................................................................................210 25.6 Parallel Programming Parameters, Pin Mapping, and Commands ...............210 25.7 Parallel Programming ....................................................................................212 25.8 Serial Downloading ........................................................................................220 25.9 Serial Programming Pin Mapping ..................................................................220 26 Electrical Characteristics – TA = -40°C to 85°C .................................225 26.1 Absolute Maximum Ratings* .........................................................................225 26.2 DC Characteristics .........................................................................................225 26.3 Speed Grades ...............................................................................................227 26.4 Clock Characteristics .....................................................................................227 26.5 System and Reset Characteristics ................................................................228 26.6 Two-wire Serial Interface Characteristics ......................................................229 26.7 SPI Timing Characteristics ............................................................................230 26.8 ADC Characteristics ......................................................................................232 27 Electrical Characteristics – TA = -40°C to 105°C ...............................233 27.1 DC Characteristics .........................................................................................233 28 Typical Characteristics – TA = -40°C to 85°C ....................................235 28.1 Active Supply Current ....................................................................................235 28.2 Idle Supply Current ........................................................................................239Enter Title of Manual [DATASHEET] vi 8159E–AVR–02/2013 28.3 Power-down Supply Current ..........................................................................242 28.4 Power-save Supply Current ...........................................................................243 28.5 Standby Supply Current ................................................................................244 28.6 Pin Pull-up .....................................................................................................247 28.7 Pin Driver Strength ........................................................................................249 28.8 Pin Thresholds and Hysteresis ......................................................................253 28.9 Bod Thresholds and Analog Comparator Offset ............................................258 28.10 Internal Oscillator Speed ...............................................................................260 28.11 Current Consumption of Peripheral Units ......................................................267 28.12 Current Consumption in Reset and Reset Pulsewidth ...................................270 29 Typical Characteristics – TA = -40°C to 105°C ..................................272 29.1 ATmega8A Typical Characteristics ................................................................272 30 Register Summary ................................................................................301 31 Instruction Set Summary .....................................................................303 32 Ordering Information ...........................................................................306 33 Packaging Information .........................................................................307 33.1 32A ................................................................................................................307 33.2 28P3 ..............................................................................................................308 34 Errata .....................................................................................................309 34.1 ATmega8A, rev. L ..........................................................................................310 35 Datasheet Revision History .................................................................312 35.1 Rev.8159E – 02/2013 ....................................................................................312 35.2 Rev.8159D – 02/11 ........................................................................................312 35.3 Rev.8159C – 07/09 ........................................................................................312 35.4 Rev.8159B – 05/09 ........................................................................................312 35.5 Rev.8159A – 08/08 ........................................................................................313 Table of Contents.......................................................................................iAtmel Corporation 1600 Technology Drive San Jose, CA 95110 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Roa Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan G.K. 16F Shin-Osaki Kangyo Bldg 1-6-4 Osaki, Shinagawa-ku Tokyo 141-0032 JAPAN Tel: (+81) (3) 6417-0300 Fax: (+81) (3) 6417-0370 © 2013 Atmel Corporation. All rights reserved. / Rev.: 8159E–AVR–02/2013 Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Atmel AVR1924: XMEGA-A1 Xplained Hardware User's Guide Features • Atmel® ATxmega128A1 microcontroller • External memory - 8MB SDRAM • Atmel AT32UC3B1256 - Communication gateway - Programmer for Atmel AVR® XMEGA® • Analog input (to ADC) - Temperature sensor - Light sensor • Analog output (from DAC) - Mono speaker via audio amplifier • Digital I/O - UART communication through USB gateway - Eight mechanical button switches - Eight LEDs - Eight spare analog pins - 24 spare digital pins 1 Introduction The Atmel XMEGA-A1 Xplained evaluation kit is a hardware platform to evaluate the Atmel ATxmega128A1 microcontroller. The kit offers a larger range of features that enables the Atmel AVR XMEGA user to get started using XMEGA peripherals right away and understand how to integrate the XMEGA device in their own design. Figure 1-1. XMEGA-A1 Xplained evaluation kit. 8-bit Atmel Microcontrollers Application Note Preliminary Rev. 8370C-AVR-12/11 2 Atmel AVR1924 8370C-AVR-12/11 2 Related items Atmel FLIP (Flexible In-system Programmer) http://www.atmel.com/dyn/products/tools_card.asp?tool_id=3886 Atmel AVR Studio® 4 (free Atmel IDE) http://www.atmel.com/dyn/products/tools_card.asp?tool_id=2725 Atmel AVR JTAGICE mkII (on-chip programming and debugging tool) http://www.atmel.com/dyn/products/tools_card.asp?tool_id=3353 Atmel AVR ONE! (on-chip programming and debugging tool) http://www.atmel.com/dyn/products/tools_card.asp?tool_id=4279 3 General information This document targets the Atmel XMEGA-A1 Xplained evaluation kit, revision 9. The schematic, layout, and bill of materials can be found online in the zip files associated with this application note at: http://www.atmel.com/products/AVR/xplain.asp?family_id=607&source=redirect. The XMEGA-A1 Xplained kit is intended to demonstrate the Atmel ATxmega128A1 microcontroller, and the hardware that relates to the Atmel AT32UC3B1256 is, therefore, not covered in this document. Figure 3-1. Overview of the XMEGA-A1 Xplained kit. SDRAM ATxmega128A1 JTAG and PDI DataFlash footprint XMEGA PORT A USB (COM and PSU) ATxmega128A1 Speaker XMEGA PORT C Audio amp. XMEGA PORT F Power jumper XMEGA PORT D/R Light sensor Temp. sensor AT32UC3B1256 3.1 Preprogrammed firmware The Atmel ATxmega128A1 and AT32UC3B1256 that come with the Atmel XMEGAA1 Xplained kit are both preprogrammed. The preprogrammed firmware in the XMEGA plays different sounds when the mechanical button switches are pushed. Atmel AVR1924 3 8370C-AVR-12/11 The preprogrammed Atmel AT32UC3B1256 firmware offers features such as a boot loader for self-programming and a UART-to-USB gateway. 3.2 Power supply The kit is powered via the USB connector, which leaves two options to power it: Connect the kit either to a PC through a USB cable, or to a 5V USB power supply (AC/DC adapter). 3.3 Measuring the XMEGA power consumption As part of an evaluation of the Atmel ATxmega128A1, it can be of interest to measure its power consumption. The power jumper (J300) is connected between the 3.3V regulated voltage from the regulator and the ATxmega128A1 supply. By replacing the jumper with an ammeter, it is possible to measure the current consumption of the ATxmega128A1. No other components are connected to the same supply as the ATxmega128A1, and other components, therefore, do not affect the measurement of the ATxmega128A1 current consumption (except the DC leakage in the decoupling capacitors). 3.4 Programming the XMEGA through the UART-to-USB gateway The ATxmega128A1 has a pre-programmed UART boot loader. How to program the device through the UART-to-USB gateway is described in the Atmel application note “AVR1927: XMEGA-A1 Xplained Getting started guide”. 3.5 Communication through the UART-to-USB gateway The XMEGA UARTC0 is connected to a UART on the AT32UC3B1256. The AT32UC3B1256 UART is communicating at 115200 baud, using one start bit, eight data bits, one stop bit, and no parity. When the AT32UC3B1256 device is enumerated (connected to a PC), the data transmitted from the XMEGA is passed on to a (virtual) COM port. This means that it is possible to use a terminal program to receive the transmitted data on a PC. Similarly, data transmitted from the PC COM port is passed on to the XMEGA UART through the gateway. NOTE The AT32UC3B1256 is also connected to the shared SPI and TWI lines, and so it is also possible to add TWI and SPI gateway functionality for these serial interfaces, if desired. This gateway functionality is not available in the default firmware for the AT32UC3B1256. Please refer to the schematics for more information about these connections. 4 Atmel AVR1924 8370C-AVR-12/11 4 Connectors The Atmel XMEGA-A1 Xplained kit has five 10-pin, 100mil headers. One header is used for programming the Atmel ATxmega128A1, and the others are used to access spare analog and digital pins on the XMEGA (expansion headers). 4.1 Programming headers The XMEGA can be programmed and debugged by connecting an external programming/debugging tool to the JTAG and PDI header (J201). The header has a standard JTAG programmer pin-out (refer to online help in the Atmel AVR Studio), and tools like the JTAGICE mkII or AVR ONE! can thus be connected directly to the header. If it is desired to use PDI programming/debugging, an adapter must be used. Due to physical differences of the JTAGICE mkII and AVR ONE! probes, the PCB has an opening below the JTAG and PDI header. This is to make room for the orientation tap on the JTAGICE mkII probe. Because JTAG TDO and PDI DATA are connected on the PCB for this kit, JTAG must be disabled on the device in order to use PDI. The reason for this is that when JTAG is enabled it will enable a pull-up internally on TDO which interferes with the PDI initialization sequence. The connection of JTAG_TDO with PDI_DATA is also an issue when the application on the device uses the JTAG_TDO pin e.g. by driving this pin actively or by using a pull-up. This will interfere with ongoing PDI communication. Additionally, when JTAG is disabled and the application is driving the JTAG_TDO pin it might even be not possible to establish a PDI connection. A workaround for this is to add a ~1k resistor from PDI_CLK/RESET to GND. This will keep the device in reset while PDI is enabled. When a PDI connection is established the flash can be erased or JTAG can be enabled in order to "unlock" the kit. Table 4-1. XMEGA programming and debugging interface – JTAG and PDI. J201 pin JTAG (1) PDI (2) 1 TCK - 2 GND GND (3) 3 TDO DATA 4 VCC VCC (3) 5 TMS - 6 nSRST CLK 7 - - 8 - - 9 TDI - 10 GND GND (3) Notes: 1. Standard pin-out for JTAGICE mkII and other Atmel programming tools. 2. Requires adapter to connect a JTAGICE mkII (refer to AVR Studio help). 3. It is only required to connect on VCC/GND pin. The Atmel AT32UC3B1256 can be programmed through its boot loader. The boot loader is evoked by shorting the J600 jumper before applying power to the board. The Atmel AVR1924 5 8370C-AVR-12/11 programming is performed through the FLIP plug-in in AVR Studio (which can also be started as a standalone application). FLIP (Flexible In-system Programmer) is free Atmel proprietary software that runs on Windows® 9x/Me/NT/2000/XP and Linux® x86. FLIP supports in-system programming of flash devices through RS232, USB, or CAN. Alternatively, the AT32UC3B1256 can be programmed by connecting a programming tool, such as JTAGICE mkII, to test points TP600-607. NOTE It is not recommended to program the AT32UC3B1256 using a programming tool, as this will erase the boot loader. 4.2 I/O expansion headers The XMEGA analog PORTA is available on the J2 header. This allows the user to connect external signals to the analog-to-digital converter (ADC), digital-to-analog converter (DAC), and analog comparators on PORTA. The XMEGA digital PORTF and PORTC are available on the J1 and J4 headers, respectively. These ports feature general-purpose I/O and various communication modules (USART, SPI, and TWI). PORTD and PORTF are mixed on the J3 header. NOTE The communication modules on PORTC and PORTF can be interconnected to test various functions and features: The USART can loop back communication with a jumper, or communicate between the two USARTs on the port. The native SPI and the USART in SPI master mode can be connected, and the TWI module can be enabled in both master and slave modes at the same time to get loop-back behavior. (Pull-up resistors can be mounted on R101 and R102. These are not mounted from the factory.) 6 Atmel AVR1924 8370C-AVR-12/11 5 Attached memories The Atmel XMEGA-A1 Xplained kit demonstrates how to use the external bus interface (EBI) module to connect a 4-bit SDRAM. An 8MB SDRAM (16Mb x 4) is attached in three-port EBI mode (PORTH, PORTK, and PORTJ). Atmel AVR1924 7 8370C-AVR-12/11 6 Miscellaneous I/O 6.1 Mechanical button switches Eight mechanical button switches are connected to XMEGA PORTD(PD0:PD5) and PORTR(PR0:PR1). Internal pull-ups should be enabled to detect when the buttons are pushed, as they short the respective line to GND. NOTE Buttons share the pins with the J3 header: Pushing the buttons potentially affects communication or other functionality on these pins. 6.2 LEDs Eight yellow LEDs are connected to XMEGA PORTE. The LEDs are active low, and thus light up when the respective lines are output low by the XMEGA. One green and one red LED are inside the same package and therefore the colors can be mixed to orange when both are activated. The red LED can be activated by driving the connected I/O line to GND. The green LED is controlled via a FET and is by default on when the board is powered. However this power indicator LED can also be turned off by driving the gate of the FET to GND. Both LEDs are controlled by the Atmel AT32UC3B1256. The default firmware will use the red LED to signal activity on the UART to USB bridge by toggling the LED. 6.3 Analog I/O An NTC temperature sensor and a light sensor are connected to PORTB on PB0 and PB1, respectively. These analog references can be used as input to the ADC. An audio amplifier (and mono speaker) is connected to PORTB on pin PB2. This pin is connected to the XMEGA DAC, and thus offers a way to generate sound. 8 Atmel AVR1924 8370C-AVR-12/11 7 Included code example The example application is based on the Atmel AVR Software Framework found online at http://asf.atmel.no. For documentation, help, and examples on the drivers used, please see the website. For more information about the included code example, see the Atmel application note “AVR1927: XMEGA-A1 Xplained Getting Started Guide”. 7.1 Compiling and running The code examples to be found in ASF can be compiled by running make on the makefile included in the project, or by opening the project in IAR™, and compiling the project within IAR. Atmel AVR1924 9 8370C-AVR-12/11 8 Further code examples and drivers Several Getting-Started trainings for the Atmel XMEGA-A1 Xplained kit can be downloaded from the Atmel website. These trainings offer general introduction to XMEGA peripherals. Please refer to AVR1500 through AVR1510. Further information and drivers for XMEGA can be downloaded as application notes, also distributed from the Atmel website. 10 Atmel AVR1924 8370C-AVR-12/11 9 Known issues 9.1 Light sensor The output range of the light sensor is 0V – 3.3V. The ADC reference must therefore be high enough to match the output range of the light sensor when performing measurements. 9.2 USB test points Touching the test points of the USB data lines on the reverse side of the board while there is an ongoing communication, might interrupt the device and cause the device to stop responding. The kit must be reconnected to start working properly again. 9.3 PDI initialization Because JTAG_TDO and PDI_DATA are connected on the PCB for this kit, JTAG must be disabled on the device in order to use PDI. The reason for this is that when JTAG is enabled it will enable a pull-up internally on TDO which interferes with the PDI initialization sequence. The connection of JTAG_TDO with PDI_DATA is also an issue when the application on the device uses the JTAG_TDO pin e.g. by driving this pin actively or by using a pull-up. This will interfere with ongoing PDI communication. Additionally, when JTAG is disabled and the application is driving the JTAG_TDO pin it might even not be possible to establish a PDI connection. A workaround for this is to add a ~1k resistor from PDI_CLK/RESET to GND. This will keep the device in reset while PDI is enabled. When a PDI connection is established the flash can be erased or JTAG can be enabled in order to "unlock" the kit. Atmel AVR1924 11 8370C-AVR-12/11 10 Revision history The revision of the evaluation kit can be found on the sticker on the reverse side of the PCB. 10.1 Revision 7 The Atmel XMEGA-A1 Xplained kit, revision 7, is the first released revision of the XMEGA-A1 Xplained kit. This kit replaces the Atmel Xplain evaluation kit. Information about the original Xplain evaluation kit can be found in the Atmel application note AVR1907: Xplain Hardware User’s Guide. 10.2 Revisions 1 to 6 Not released. 12 Atmel AVR1924 8370C-AVR-12/11 11 Table of contents Features............................................................................................... 1 1 Introduction...................................................................................... 1 2 Related items.................................................................................... 2 3 General information......................................................................... 2 3.1 Preprogrammed firmware.................................................................................... 2 3.2 Power supply....................................................................................................... 3 3.3 Measuring the XMEGA power consumption ....................................................... 3 3.4 Programming the XMEGA through the UART-to-USB gateway ......................... 3 3.5 Communication through the UART-to-USB gateway.......................................... 3 4 Connectors....................................................................................... 4 4.1 Programming headers......................................................................................... 4 4.2 I/O expansion headers ........................................................................................ 5 5 Attached memories.......................................................................... 6 6 Miscellaneous I/O............................................................................. 7 6.1 Mechanical button switches ................................................................................ 7 6.2 LEDs.................................................................................................................... 7 6.3 Analog I/O............................................................................................................ 7 7 Included code example ................................................................... 8 7.1 Compiling and running ........................................................................................ 8 8 Further code examples and drivers ............................................... 9 9 Known issues................................................................................. 10 9.1 Light sensor....................................................................................................... 10 9.2 USB test points.................................................................................................. 10 9.3 PDI initialization................................................................................................. 10 10 Revision history ........................................................................... 11 10.1 Revision 7........................................................................................................ 11 10.2 Revisions 1 to 6............................................................................................... 11 11 Table of contents ......................................................................... 128370C-AVR-12/11 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Milennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 16F, Shin Osaki Kangyo Bldg. 1-6-4 Osaki Shinagawa-ku Tokyo 104-0032 JAPAN Tel: (+81) 3-6417-0300 Fax: (+81) 3-6417-0370 © 2011 Atmel Corporation. All rights reserved. Atmel® , Atmel logo and combinations thereof, AVR® , AVR Logo® , AVR Studio® , XMEGA® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Windows® and others are registered trademarks of Microsoft Corporation in U.S. and or other countries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. Features • High-performance, Low-power Atmel®AVR® 8-bit Microcontroller • Advanced RISC Architecture – 130 Powerful Instructions – Most Single-clock Cycle Execution – 32 × 8 General Purpose Working Registers – Fully Static Operation – Up to 16MIPS Throughput at 16MHz – On-chip 2-cycle Multiplier • High Endurance Non-volatile Memory segments – 8Kbytes of In-System Self-programmable Flash program memory – 512Bytes EEPROM – 1Kbyte Internal SRAM – Write/Erase Cycles: 10,000 Flash/100,000 EEPROM – Data retention: 20 years at 85°C/100 years at 25°C(1) – Optional Boot Code Section with Independent Lock Bits In-System Programming by On-chip Boot Program True Read-While-Write Operation – Programming Lock for Software Security • Peripheral Features – Two 8-bit Timer/Counters with Separate Prescaler, one Compare Mode – One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode – Real Time Counter with Separate Oscillator – Three PWM Channels – 8-channel ADC in TQFP and QFN/MLF package Eight Channels 10-bit Accuracy – 6-channel ADC in PDIP package Six Channels 10-bit Accuracy – Byte-oriented Two-wire Serial Interface – Programmable Serial USART – Master/Slave SPI Serial Interface – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator • Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal Calibrated RC Oscillator – External and Internal Interrupt Sources – Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby • I/O and Packages – 23 Programmable I/O Lines – 28-lead PDIP, 32-lead TQFP, and 32-pad QFN/MLF • Operating Voltages – 2.7V - 5.5V (ATmega8L) – 4.5V - 5.5V (ATmega8) • Speed Grades – 0 - 8MHz (ATmega8L) – 0 - 16MHz (ATmega8) • Power Consumption at 4Mhz, 3V, 25C – Active: 3.6mA – Idle Mode: 1.0mA – Power-down Mode: 0.5µA 8-bit Atmel with 8KBytes InSystem Programmable Flash ATmega8 ATmega8L Rev.2486AA–AVR–02/20132 2486AA–AVR–02/2013 ATmega8(L) Pin Configurations 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 (INT1) PD3 (XCK/T0) PD4 GND VCC GND VCC (XTAL1/TOSC1) PB6 (XTAL2/TOSC2) PB7 PC1 (ADC1) PC0 (ADC0) ADC7 GND AREF ADC6 AVCC PB5 (SCK) 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 (T1) PD5 (AIN0) PD6 (AIN1) PD7 (ICP1) PB0 (OC1A) PB1 (SS/OC1B) PB2 (MOSI/OC2) PB3 (MISO) PB4 PD2 (INT0) PD1 (TXD) PD0 (RXD) PC6 (RESET) PC5 (ADC5/SCL) PC4 (ADC4/SDA) PC3 (ADC3) PC2 (ADC2) TQFP Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 (RESET) PC6 (RXD) PD0 (TXD) PD1 (INT0) PD2 (INT1) PD3 (XCK/T0) PD4 VCC GND (XTAL1/TOSC1) PB6 (XTAL2/TOSC2) PB7 (T1) PD5 (AIN0) PD6 (AIN1) PD7 (ICP1) PB0 PC5 (ADC5/SCL) PC4 (ADC4/SDA) PC3 (ADC3) PC2 (ADC2) PC1 (ADC1) PC0 (ADC0) GND AREF AVCC PB5 (SCK) PB4 (MISO) PB3 (MOSI/OC2) PB2 (SS/OC1B) PB1 (OC1A) PDIP 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 MLF Top View (INT1) PD3 (XCK/T0) PD4 GND VCC GND VCC (XTAL1/TOSC1) PB6 (XTAL2/TOSC2) PB7 PC1 (ADC1) PC0 (ADC0) ADC7 GND AREF ADC6 AVCC PB5 (SCK) (T1) PD5 (AIN0) PD6 (AIN1) PD7 (ICP1) PB0 (OC1A) PB1 (SS/OC1B) PB2 (MOSI/OC2) PB3 (MISO) PB4 PD2 (INT0) PD1 (TXD) PD0 (RXD) PC6 (RESET) PC5 (ADC5/SCL) PC4 (ADC4/SDA) PC3 (ADC3) PC2 (ADC2) NOTE: The large center pad underneath the MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the PCB to ensure good mechanical stability. If the center pad is left unconneted, the package might loosen from the PCB.3 2486AA–AVR–02/2013 ATmega8(L) Overview The Atmel®AVR® ATmega8 is a low-power CMOS 8-bit microcontroller based on the AVR RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega8 achieves throughputs approaching 1MIPS per MHz, allowing the system designer to optimize power consumption versus processing speed. Block Diagram Figure 1. Block Diagram INTERNAL OSCILLATOR OSCILLATOR WATCHDOG TIMER MCU CTRL. & TIMING OSCILLATOR TIMERS/ COUNTERS INTERRUPT UNIT STACK POINTER EEPROM SRAM STATUS REGISTER USART PROGRAM COUNTER PROGRAM FLASH INSTRUCTION REGISTER INSTRUCTION DECODER PROGRAMMING LOGIC SPI ADC INTERFACE COMP. INTERFACE PORTC DRIVERS/BUFFERS PORTC DIGITAL INTERFACE GENERAL PURPOSE REGISTERS X Y Z ALU + - PORTB DRIVERS/BUFFERS PORTB DIGITAL INTERFACE PORTD DIGITAL INTERFACE PORTD DRIVERS/BUFFERS XTAL1 XTAL2 CONTROL LINES VCC GND MUX & ADC AGND AREF PC0 - PC6 PB0 - PB7 PD0 - PD7 AVR CPU TWI RESET4 2486AA–AVR–02/2013 ATmega8(L) The Atmel®AVR® core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATmega8 provides the following features: 8 Kbytes of In-System Programmable Flash with Read-While-Write capabilities, 512 bytes of EEPROM, 1 Kbyte of SRAM, 23 general purpose I/O lines, 32 general purpose working registers, three flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, a byte oriented Twowire Serial Interface, a 6-channel ADC (eight channels in TQFP and QFN/MLF packages) with 10-bit accuracy, a programmable Watchdog Timer with Internal Oscillator, an SPI serial port, and five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Powerdown mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next Interrupt or Hardware Reset. In Power-save mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except asynchronous timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low-power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The Flash Program memory can be reprogrammed In-System through an SPI serial interface, by a conventional non-volatile memory programmer, or by an On-chip boot program running on the AVR core. The boot program can use any interface to download the application program in the Application Flash memory. Software in the Boot Flash Section will continue to run while the Application Flash Section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega8 is a powerful microcontroller that provides a highly-flexible and cost-effective solution to many embedded control applications. The ATmega8 is supported with a full suite of program and system development tools, including C compilers, macro assemblers, program simulators, and evaluation kits. Disclaimer Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Minimum and Maximum values will be available after the device is characterized.5 2486AA–AVR–02/2013 ATmega8(L) Pin Descriptions VCC Digital supply voltage. GND Ground. Port B (PB7..PB0) XTAL1/XTAL2/TOSC1/ TOSC2 Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Depending on the clock selection fuse settings, PB6 can be used as input to the inverting Oscillator amplifier and input to the internal clock operating circuit. Depending on the clock selection fuse settings, PB7 can be used as output from the inverting Oscillator amplifier. If the Internal Calibrated RC Oscillator is used as chip clock source, PB7..6 is used as TOSC2..1 input for the Asynchronous Timer/Counter2 if the AS2 bit in ASSR is set. The various special features of Port B are elaborated in “Alternate Functions of Port B” on page 58 and “System Clock and Clock Options” on page 25. Port C (PC5..PC0) Port C is an 7-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. PC6/RESET If the RSTDISBL Fuse is programmed, PC6 is used as an I/O pin. Note that the electrical characteristics of PC6 differ from those of the other pins of Port C. If the RSTDISBL Fuse is unprogrammed, PC6 is used as a Reset input. A low level on this pin for longer than the minimum pulse length will generate a Reset, even if the clock is not running. The minimum pulse length is given in Table 15 on page 38. Shorter pulses are not guaranteed to generate a Reset. The various special features of Port C are elaborated on page 61. Port D (PD7..PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATmega8 as listed on page 63. RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in Table 15 on page 38. Shorter pulses are not guaranteed to generate a reset.6 2486AA–AVR–02/2013 ATmega8(L) AVCC AVCC is the supply voltage pin for the A/D Converter, Port C (3..0), and ADC (7..6). It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. Note that Port C (5..4) use digital supply voltage, VCC. AREF AREF is the analog reference pin for the A/D Converter. ADC7..6 (TQFP and QFN/MLF Package Only) In the TQFP and QFN/MLF package, ADC7..6 serve as analog inputs to the A/D converter. These pins are powered from the analog supply and serve as 10-bit ADC channels.7 2486AA–AVR–02/2013 ATmega8(L) Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. Note: 1. Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C.8 2486AA–AVR–02/2013 ATmega8(L) About Code Examples This datasheet contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details.9 2486AA–AVR–02/2013 ATmega8(L) Atmel AVR CPU Core Introduction This section discusses the Atmel®AVR® core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. Architectural Overview Figure 2. Block Diagram of the AVR MCU Architecture In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the Program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the Program memory. This concept enables instructions to be executed in every clock cycle. The Program memory is In-System Reprogrammable Flash memory. The fast-access Register File contains 32 × 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers Flash Program Memory Instruction Register Instruction Decoder Program Counter Control Lines 32 x 8 General Purpose Registrers ALU Status and Control I/O Lines EEPROM Data Bus 8-bit Data SRAM Direct Addressing Indirect Addressing Interrupt Unit SPI Unit Watchdog Timer Analog Comparator i/O Module 2 i/O Module1 i/O Module n10 2486AA–AVR–02/2013 ATmega8(L) can also be used as an address pointer for look up tables in Flash Program memory. These added function registers are the 16-bit X-register, Y-register, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. The Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every Program memory address contains a 16-bit or 32-bit instruction. Program Flash memory space is divided in two sections, the Boot program section and the Application program section. Both sections have dedicated Lock Bits for write and read/write protection. The SPM instruction that writes into the Application Flash memory section must reside in the Boot program section. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the reset routine (before subroutines or interrupts are executed). The Stack Pointer SP is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional global interrupt enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F.11 2486AA–AVR–02/2013 ATmega8(L) Arithmetic Logic Unit – ALU The high-performance Atmel®AVR® ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. For a detailed description, see “Instruction Set Summary” on page 311. Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. The AVR Status Register – SREG – is defined as: • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the Instruction Set Reference. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry is useful in BCD arithmetic. See the “Instruction Set Description” for detailed information. • Bit 4 – S: Sign Bit, S = N V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Description” for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Description” for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. Bit 7 6 5 4 3 2 1 0 I T H S V N Z C SREG Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 012 2486AA–AVR–02/2013 ATmega8(L) • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 0 – C: Carry Flag The Carry Flag C indicates a Carry in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 3 shows the structure of the 32 general purpose working registers in the CPU. Figure 3. AVR CPU General Purpose Working Registers Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 3, each register is also assigned a Data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-pointer, Y-pointer, and Z-pointer Registers can be set to index any register in the file. 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 … R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte13 2486AA–AVR–02/2013 ATmega8(L) The X-register, Yregister and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the Data Space. The three indirect address registers X, Y and Z are defined as described in Figure 4. Figure 4. The X-register, Y-register and Z-Register In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the Instruction Set Reference for details). Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when address is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The Atmel®AVR® CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. 15 XH XL 0 X-register 7 0 7 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 0 7 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 7 0 7 0 R31 (0x1F) R30 (0x1E) Bit 15 14 13 12 11 10 9 8 SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 76543210 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 0000000014 2486AA–AVR–02/2013 ATmega8(L) Figure 5 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Figure 5. The Parallel Instruction Fetches and Instruction Executions Figure 6 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 6. Single Cycle ALU Operation Reset and Interrupt Handling The Atmel®AVR® provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate Program Vector in the Program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. Depending on the Program Counter value, interrupts may be automatically disabled when Boot Lock Bits BLB02 or BLB12 are programmed. This feature improves software security. See the section “Memory Programming” on page 215 for details. The lowest addresses in the Program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of Vectors is shown in “Interrupts” on page 46. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of the boot Flash section by setting the Interrupt Vector Select (IVSEL) bit in the General Interrupt Control Register (GICR). Refer to “Interrupts” on page 46 for more information. The Reset Vector can also be moved to the start of the boot Flash section by programming the BOOTRST Fuse, see “Boot Loader Support – ReadWhile-Write Self-Programming” on page 202. clk 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch T1 T2 T3 T4 CPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back T1 T2 T3 T4 clkCPU15 2486AA–AVR–02/2013 ATmega8(L) When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the global interrupt enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the global interrupt enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence. Assembly Code Example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMWE ; start EEPROM write sbi EECR, EEWE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ _CLI(); EECR |= (1< xxx ... ... ... Table 19. Reset and Interrupt Vectors Placement BOOTRST(1) IVSEL Reset Address Interrupt Vectors Start Address 1 0 0x000 0x001 1 1 0x000 Boot Reset Address + 0x001 0 0 Boot Reset Address 0x001 0 1 Boot Reset Address Boot Reset Address + 0x00148 2486AA–AVR–02/2013 ATmega8(L) When the BOOTRST Fuse is unprogrammed, the boot section size set to 2Kbytes and the IVSEL bit in the GICR Register is set before any interrupts are enabled, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: AddressLabels Code Comments $000 rjmp RESET ; Reset handler ; $001 RESET:ldi r16,high(RAMEND); Main program start $002 out SPH,r16 ; Set Stack Pointer to top of RAM $003 ldi r16,low(RAMEND) $004 out SPL,r16 $005 sei ; Enable interrupts $006 xxx ; .org $c01 $c01 rjmp EXT_INT0 ; IRQ0 Handler $c02 rjmp EXT_INT1 ; IRQ1 Handler ... ... ... ; $c12 rjmp SPM_RDY ; Store Program Memory Ready Handler When the BOOTRST Fuse is programmed and the boot section size set to 2Kbytes, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: AddressLabels Code Comments .org $001 $001 rjmp EXT_INT0 ; IRQ0 Handler $002 rjmp EXT_INT1 ; IRQ1 Handler ... ... ... ; $012 rjmp SPM_RDY ; Store Program Memory Ready Handler ; .org $c00 $c00 rjmp RESET ; Reset handler ; $c01 RESET:ldi r16,high(RAMEND); Main program start $c02 out SPH,r16 ; Set Stack Pointer to top of RAM $c03 ldi r16,low(RAMEND) $c04 out SPL,r16 $c05 sei ; Enable interrupts $c06 xxx49 2486AA–AVR–02/2013 ATmega8(L) When the BOOTRST Fuse is programmed, the boot section size set to 2Kbytes, and the IVSEL bit in the GICR Register is set before any interrupts are enabled, the most typical and general program setup for the Reset and Interrupt Vector Addresses is: AddressLabels Code Comments ; .org $c00 $c00 rjmp RESET ; Reset handler $c01 rjmp EXT_INT0 ; IRQ0 Handler $c02 rjmp EXT_INT1 ; IRQ1 Handler ... ... ... ; $c12 rjmp SPM_RDY ; Store Program Memory Ready Handler $c13 RESET: ldi r16,high(RAMEND); Main program start $c14 out SPH,r16 ; Set Stack Pointer to top of RAM $c15 ldi r16,low(RAMEND) $c16 out SPL,r16 $c17 sei ; Enable interrupts $c18 xxx Moving Interrupts Between Application and Boot Space The General Interrupt Control Register controls the placement of the Interrupt Vector table. General Interrupt Control Register – GICR • Bit 1 – IVSEL: Interrupt Vector Select When the IVSEL bit is cleared (zero), the Interrupt Vectors are placed at the start of the Flash memory. When this bit is set (one), the Interrupt Vectors are moved to the beginning of the Boot Loader section of the Flash. The actual address of the start of the boot Flash section is determined by the BOOTSZ Fuses. Refer to the section “Boot Loader Support – Read-While-Write Self-Programming” on page 202 for details. To avoid unintentional changes of Interrupt Vector tables, a special write procedure must be followed to change the IVSEL bit: 1. Write the Interrupt Vector Change Enable (IVCE) bit to one 2. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE Interrupts will automatically be disabled while this sequence is executed. Interrupts are disabled in the cycle IVCE is set, and they remain disabled until after the instruction following the write to IVSEL. If IVSEL is not written, interrupts remain disabled for four cycles. The I-bit in the Status Register is unaffected by the automatic disabling. Note: If Interrupt Vectors are placed in the Boot Loader section and Boot Lock bit BLB02 is programmed, interrupts are disabled while executing from the Application section. If Interrupt Vectors are placed in the Application section and Boot Lock bit BLB12 is programed, interrupts are disabled while executing from the Boot Loader section. Refer to the section “Boot Loader Support – Read-While-Write Self-Programming” on page 202 for details on Boot Lock Bits. Bit 7 6 5 4 3 2 1 0 INT1 INT0 – – – – IVSEL IVCE GICR Read/Write R/W R/W R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 050 2486AA–AVR–02/2013 ATmega8(L) • Bit 0 – IVCE: Interrupt Vector Change Enable The IVCE bit must be written to logic one to enable change of the IVSEL bit. IVCE is cleared by hardware four cycles after it is written or when IVSEL is written. Setting the IVCE bit will disable interrupts, as explained in the IVSEL description above. See Code Example below. Assembly Code Example Move_interrupts: ; Enable change of Interrupt Vectors ldi r16, (1< CSn2:0 > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution. However, care must be taken if the other Timer/Counter that shares the same prescaler also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is connected to. External Clock Source An external clock source applied to the T1/T0 pin can be used as Timer/Counter clock (clkT1/clkT0). The T1/T0 pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 30 shows a functional equivalent block diagram of the T1/T0 synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkT1/clkT0 pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 30. T1/T0 Pin Sampling The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the T1/T0 pin to the counter is updated. Enabling and disabling of the clock input must be done when T1/T0 has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses Tn_sync (To Clock Select Logic) Synchronization Edge Detector D Q D Q LE Tn D Q clkI/O74 2486AA–AVR–02/2013 ATmega8(L) sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 31. Prescaler for Timer/Counter0 and Timer/Counter1(1) Note: 1. The synchronization logic on the input pins (T1/T0) is shown in Figure 30 on page 73 Special Function IO Register – SFIOR • Bit 0 – PSR10: Prescaler Reset Timer/Counter1 and Timer/Counter0 When this bit is written to one, the Timer/Counter1 and Timer/Counter0 prescaler will be reset. The bit will be cleared by hardware after the operation is performed. Writing a zero to this bit will have no effect. Note that Timer/Counter1 and Timer/Counter0 share the same prescaler and a reset of this prescaler will affect both timers. This bit will always be read as zero. PSR10 Clear clkT1 clkT0 T1 T0 clkI/O Synchronization Synchronization Bit 7 6 5 4 3 2 1 0 – – – – ACME PUD PSR2 PSR10 SFIOR Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 075 2486AA–AVR–02/2013 ATmega8(L) 16-bit Timer/Counter1 The 16-bit Timer/Counter unit allows accurate program execution timing (event management), wave generation, and signal timing measurement. The main features are: • True 16-bit Design (that is, allows 16-bit PWM) • Two Independent Output Compare Units • Double Buffered Output Compare Registers • One Input Capture Unit • Input Capture Noise Canceler • Clear Timer on Compare Match (Auto Reload) • Glitch-free, Phase Correct Pulse Width Modulator (PWM) • Variable PWM Period • Frequency Generator • External Event Counter • Four Independent Interrupt Sources (TOV1, OCF1A, OCF1B, and ICF1) Overview Most register and bit references in this section are written in general form. A lower case “n” replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit channel. However, when using the register or bit defines in a program, the precise form must be used, that is, TCNT1 for accessing Timer/Counter1 counter value and so on. A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 32 on page 76. For the actual placement of I/O pins, refer to “Pin Configurations” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “16-bit Timer/Counter Register Description” on page 96.76 2486AA–AVR–02/2013 ATmega8(L) Figure 32. 16-bit Timer/Counter Block Diagram(1) Note: 1. Refer to “Pin Configurations” on page 2, Table 22 on page 58, and Table 28 on page 63 for Timer/Counter1 pin placement and description Registers The Timer/Counter (TCNT1), Output Compare Registers (OCR1A/B), and Input Capture Register (ICR1) are all 16-bit registers. Special procedures must be followed when accessing the 16- bit registers. These procedures are described in the section “Accessing 16-bit Registers” on page 77. The Timer/Counter Control Registers (TCCR1A/B) are 8-bit registers and have no CPU access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are all visible in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure since these registers are shared by other timer units. The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on the T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the clock select logic is referred to as the timer clock (clkT1). The double buffered Output Compare Registers (OCR1A/B) are compared with the Timer/Counter value at all time. The result of the compare can be used by the waveform generator to generate a PWM or variable frequency output on the Output Compare Pin (OC1A/B). See “Output Compare Units” on page 83. The Compare Match event will also set the Compare Match Flag (OCF1A/B) which can be used to generate an Output Compare interrupt request. Clock Select Timer/Counter DATA BUS OCRnA OCRnB ICRn = = TCNTn Waveform Generation Waveform Generation OCnA OCnB Noise Canceler ICPn = Fixed TOP Values Edge Detector Control Logic = 0 TOP BOTTOM Count Clear Direction TOVn (Int. Req.) OCFnA (Int. Req.) OCFnB (Int.Req.) ICFn (Int.Req.) TCCRnA TCCRnB ( From Analog Comparator Ouput ) Tn Edge Detector ( From Prescaler ) clkTn77 2486AA–AVR–02/2013 ATmega8(L) The Input Capture Register can capture the Timer/Counter value at a given external (edge triggered) event on either the Input Capture Pin (ICP1) or on the Analog Comparator pins (see “Analog Comparator” on page 186). The Input Capture unit includes a digital filtering unit (Noise Canceler) for reducing the chance of capturing noise spikes. The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined by either the OCR1A Register, the ICR1 Register, or by a set of fixed values. When using OCR1A as TOP value in a PWM mode, the OCR1A Register can not be used for generating a PWM output. However, the TOP value will in this case be double buffered allowing the TOP value to be changed in run time. If a fixed TOP value is required, the ICR1 Register can be used as an alternative, freeing the OCR1A to be used as PWM output. Definitions The following definitions are used extensively throughout the document: Compatibility The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bit AVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier version regarding: • All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt Registers • Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers • Interrupt Vectors The following control bits have changed name, but have same functionality and register location: • PWM10 is changed to WGM10 • PWM11 is changed to WGM11 • CTC1 is changed to WGM12 The following bits are added to the 16-bit Timer/Counter Control Registers: • FOC1A and FOC1B are added to TCCR1A • WGM13 is added to TCCR1B The 16-bit Timer/Counter has improvements that will affect the compatibility in some special cases. Accessing 16-bit Registers The TCNT1, OCR1A/B, and ICR1 are 16-bit registers that can be accessed by the AVR CPU via the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations. The 16-bit timer has a single 8-bit register for temporary storing of the High byte of the 16-bit access. The same temporary register is shared between all 16-bit registers within the 16-bit timer. Accessing the Low byte triggers the 16-bit read or write operation. When the Low byte of a 16-bit register is written by the CPU, the High byte stored in the temporary register, and the Low byte written are both copied into the 16-bit register in the same clock cycle. When the Low byte Table 35. Definitions BOTTOM The counter reaches the BOTTOM when it becomes 0x0000. MAX The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be one of the fixed values: 0x00FF, 0x01FF, or 0x03FF, or to the value stored in the OCR1A or ICR1 Register. The assignment is dependent of the mode of operation.78 2486AA–AVR–02/2013 ATmega8(L) of a 16-bit register is read by the CPU, the High byte of the 16-bit register is copied into the temporary register in the same clock cycle as the Low byte is read. Not all 16-bit accesses uses the temporary register for the High byte. Reading the OCR1A/B 16- bit registers does not involve using the temporary register. To do a 16-bit write, the High byte must be written before the Low byte. For a 16-bit read, the Low byte must be read before the High byte. The following code examples show how to access the 16-bit Timer Registers assuming that no interrupts updates the temporary register. The same principle can be used directly for accessing the OCR1A/B and ICR1 Registers. Note that when using “C”, the compiler handles the 16-bit access. Note: 1. See “About Code Examples” on page 8 The assembly code example returns the TCNT1 value in the r17:r16 Register pair. It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt occurs between the two instructions accessing the 16-bit register, and the interrupt code updates the temporary register by accessing the same or any other of the 16-bit Timer Registers, then the result of the access outside the interrupt will be corrupted. Therefore, when both the main code and the interrupt code update the temporary register, the main code must disable the interrupts during the 16-bit access. The following code examples show how to do an atomic read of the TCNT1 Register contents. Reading any of the OCR1A/B or ICR1 Registers can be done by using the same principle. Assembly Code Example(1) ... ; Set TCNT1 to 0x01FF ldi r17,0x01 ldi r16,0xFF out TCNT1H,r17 out TCNT1L,r16 ; Read TCNT1 into r17:r16 in r16,TCNT1L in r17,TCNT1H ... C Code Example(1) unsigned int i; ... /* Set TCNT1 to 0x01FF */ TCNT1 = 0x1FF; /* Read TCNT1 into i */ i = TCNT1; ...79 2486AA–AVR–02/2013 ATmega8(L) Note: 1. See “About Code Examples” on page 8 The assembly code example returns the TCNT1 value in the r17:r16 Register pair. Assembly Code Example(1) TIM16_ReadTCNT1: ; Save Global Interrupt Flag in r18,SREG ; Disable interrupts cli ; Read TCNT1 into r17:r16 in r16,TCNT1L in r17,TCNT1H ; Restore Global Interrupt Flag out SREG,r18 ret C Code Example(1) unsigned int TIM16_ReadTCNT1( void ) { unsigned char sreg; unsigned int i; /* Save Global Interrupt Flag */ sreg = SREG; /* Disable interrupts */ _CLI(); /* Read TCNT1 into i */ i = TCNT1; /* Restore Global Interrupt Flag */ SREG = sreg; return i; }80 2486AA–AVR–02/2013 ATmega8(L) The following code examples show how to do an atomic write of the TCNT1 Register contents. Writing any of the OCR1A/B or ICR1 Registers can be done by using the same principle. Note: 1. See “About Code Examples” on page 8 The assembly code example requires that the r17:r16 Register pair contains the value to be written to TCNT1. Reusing the Temporary High Byte Register If writing to more than one 16-bit register where the High byte is the same for all registers written, then the High byte only needs to be written once. However, note that the same rule of atomic operation described previously also applies in this case. Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal or an external clock source. The clock source is selected by the clock select logic which is controlled by the clock select (CS12:0) bits located in the Timer/Counter Control Register B (TCCR1B). For details on clock sources and prescaler, see “Timer/Counter0 and Timer/Counter1 Prescalers” on page 73. Counter Unit The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit. Figure 33 on page 81 shows a block diagram of the counter and its surroundings. Assembly Code Example(1) TIM16_WriteTCNT1: ; Save Global Interrupt Flag in r18,SREG ; Disable interrupts cli ; Set TCNT1 to r17:r16 out TCNT1H,r17 out TCNT1L,r16 ; Restore Global Interrupt Flag out SREG,r18 ret C Code Example(1) void TIM16_WriteTCNT1( unsigned int i ) { unsigned char sreg; unsigned int i; /* Save Global Interrupt Flag */ sreg = SREG; /* Disable interrupts */ _CLI(); /* Set TCNT1 to i */ TCNT1 = i; /* Restore Global Interrupt Flag */ SREG = sreg; }81 2486AA–AVR–02/2013 ATmega8(L) Figure 33. Counter Unit Block Diagram Signal description (internal signals): count Increment or decrement TCNT1 by 1 direction Select between increment and decrement clear Clear TCNT1 (set all bits to zero) clkT1 Timer/Counter clock TOP Signalize that TCNT1 has reached maximum value BOTTOM Signalize that TCNT1 has reached minimum value (zero) The 16-bit counter is mapped into two 8-bit I/O memory locations: counter high (TCNT1H) containing the upper eight bits of the counter, and Counter Low (TCNT1L) containing the lower eight bits. The TCNT1H Register can only be indirectly accessed by the CPU. When the CPU does an access to the TCNT1H I/O location, the CPU accesses the High byte temporary register (TEMP). The temporary register is updated with the TCNT1H value when the TCNT1L is read, and TCNT1H is updated with the temporary register value when TCNT1L is written. This allows the CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus. It is important to notice that there are special cases of writing to the TCNT1 Register when the counter is counting that will give unpredictable results. The special cases are described in the sections where they are of importance. Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT1). The clkT1 can be generated from an external or internal clock source, selected by the clock select bits (CS12:0). When no clock source is selected (CS12:0 = 0) the timer is stopped. However, the TCNT1 value can be accessed by the CPU, independent of whether clkT1 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the Waveform Generation mode bits (WGM13:0) located in the Timer/Counter Control Registers A and B (TCCR1A and TCCR1B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare Outputs OC1x. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 87. The Timer/Counter Overflow (TOV1) fLag is set according to the mode of operation selected by the WGM13:0 bits. TOV1 can be used for generating a CPU interrupt. Input Capture Unit The Timer/Counter incorporates an Input Capture unit that can capture external events and give them a time-stamp indicating time of occurrence. The external signal indicating an event, or multiple events, can be applied via the ICP1 pin or alternatively, via the Analog Comparator unit. TEMP (8-bit) DATA BUS (8-bit) TCNTn (16-bit Counter) TCNTnH (8-bit) TCNTnL (8-bit) Control Logic count clear direction TOVn (Int. Req.) Clock Select TOP BOTTOM Tn Edge Detector ( From Prescaler ) clkTn82 2486AA–AVR–02/2013 ATmega8(L) The time-stamps can then be used to calculate frequency, duty-cycle, and other features of the signal applied. Alternatively the time-stamps can be used for creating a log of the events. The Input Capture unit is illustrated by the block diagram shown in Figure 34. The elements of the block diagram that are not directly a part of the Input Capture unit are gray shaded. The small “n” in register and bit names indicates the Timer/Counter number. Figure 34. Input Capture Unit Block Diagram When a change of the logic level (an event) occurs on the Input Capture Pin (ICP1), alternatively on the Analog Comparator Output (ACO), and this change confirms to the setting of the edge detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter (TCNT1) is written to the Input Capture Register (ICR1). The Input Capture Flag (ICF1) is set at the same system clock as the TCNT1 value is copied into ICR1 Register. If enabled (TICIE1 = 1), the Input Capture Flag generates an Input Capture interrupt. The ICF1 Flag is automatically cleared when the interrupt is executed. Alternatively the ICF1 Flag can be cleared by software by writing a logical one to its I/O bit location. Reading the 16-bit value in the Input Capture Register (ICR1) is done by first reading the Low byte (ICR1L) and then the High byte (ICR1H). When the Low byte is read the High byte is copied into the High byte temporary register (TEMP). When the CPU reads the ICR1H I/O location it will access the TEMP Register. The ICR1 Register can only be written when using a Waveform Generation mode that utilizes the ICR1 Register for defining the counter’s TOP value. In these cases the Waveform Generation mode (WGM13:0) bits must be set before the TOP value can be written to the ICR1 Register. When writing the ICR1 Register the High byte must be written to the ICR1H I/O location before the Low byte is written to ICR1L. For more information on how to access the 16-bit registers refer to “Accessing 16-bit Registers” on page 77. Input Capture Pin Source The main trigger source for the Input Capture unit is the Input Capture Pin (ICP1). Timer/Counter 1 can alternatively use the Analog Comparator Output as trigger source for the Input Capture ICFn (Int. Req.) Analog Comparator WRITE ICRn (16-bit Register) ICRnH (8-bit) Noise Canceler ICPn Edge Detector TEMP (8-bit) DATA BUS (8-bit) ICRnL (8-bit) TCNTn (16-bit Counter) TCNTnH (8-bit) TCNTnL (8-bit) ACO* ACIC* ICNC ICES83 2486AA–AVR–02/2013 ATmega8(L) unit. The Analog Comparator is selected as trigger source by setting the Analog Comparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register (ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flag must therefore be cleared after the change. Both the Input Capture Pin (ICP1) and the Analog Comparator Output (ACO) inputs are sampled using the same technique as for the T1 pin (Figure 30 on page 73). The edge detector is also identical. However, when the noise canceler is enabled, additional logic is inserted before the edge detector, which increases the delay by four system clock cycles. Note that the input of the noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Waveform Generation mode that uses ICR1 to define TOP. An Input Capture can be triggered by software by controlling the port of the ICP1 pin. Noise Canceler The noise canceler improves noise immunity by using a simple digital filtering scheme. The noise canceler input is monitored over four samples, and all four must be equal for changing the output that in turn is used by the edge detector. The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNC1) bit in Timer/Counter Control Register B (TCCR1B). When enabled the noise canceler introduces additional four system clock cycles of delay from a change applied to the input, to the update of the ICR1 Register. The noise canceler uses the system clock and is therefore not affected by the prescaler. Using the Input Capture Unit The main challenge when using the Input Capture unit is to assign enough processor capacity for handling the incoming events. The time between two events is critical. If the processor has not read the captured value in the ICR1 Register before the next event occurs, the ICR1 will be overwritten with a new value. In this case the result of the capture will be incorrect. When using the Input Capture interrupt, the ICR1 Register should be read as early in the interrupt handler routine as possible. Even though the Input Capture interrupt has relatively high priority, the maximum interrupt response time is dependent on the maximum number of clock cycles it takes to handle any of the other interrupt requests. Using the Input Capture unit in any mode of operation when the TOP value (resolution) is actively changed during operation, is not recommended. Measurement of an external signal’s duty cycle requires that the trigger edge is changed after each capture. Changing the edge sensing must be done as early as possible after the ICR1 Register has been read. After a change of the edge, the Input Capture Flag (ICF1) must be cleared by software (writing a logical one to the I/O bit location). For measuring frequency only, the clearing of the ICF1 Flag is not required (if an interrupt handler is used). Output Compare Units The 16-bit comparator continuously compares TCNT1 with the Output Compare Register (OCR1x). If TCNT equals OCR1x the comparator signals a match. A match will set the Output Compare Flag (OCF1x) at the next timer clock cycle. If enabled (OCIE1x = 1), the Output Compare Flag generates an Output Compare interrupt. The OCF1x Flag is automatically cleared when the interrupt is executed. Alternatively the OCF1x Flag can be cleared by software by writing a logical one to its I/O bit location. The waveform generator uses the match signal to generate an output according to operating mode set by the Waveform Generation mode (WGM13:0) bits and Compare Output mode (COM1x1:0) bits. The TOP and BOTTOM signals are used by the waveform generator for handling the special cases of the extreme values in some modes of operation (see “Modes of Operation” on page 87). A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (that is counter resolution). In addition to the counter resolution, the TOP value defines the period time for waveforms generated by the waveform generator.84 2486AA–AVR–02/2013 ATmega8(L) Figure 35 shows a block diagram of the Output Compare unit. The small “n” in the register and bit names indicates the device number (n = 1 for Timer/Counter 1), and the “x” indicates Output Compare unit (A/B). The elements of the block diagram that are not directly a part of the Output Compare unit are gray shaded. Figure 35. Output Compare Unit, Block Diagram The OCR1x Register is double buffered when using any of the twelve Pulse Width Modulation (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR1x Compare Register to either TOP or BOTTOM of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR1x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR1x Buffer Register, and if double buffering is disabled the CPU will access the OCR1x directly. The content of the OCR1x (Buffer or Compare) Register is only changed by a write operation (the Timer/Counter does not update this register automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the High byte temporary register (TEMP). However, it is a good practice to read the Low byte first as when accessing other 16-bit registers. Writing the OCR1x Registers must be done via the TEMP Register since the compare of all 16-bit is done continuously. The High byte (OCR1xH) has to be written first. When the High byte I/O location is written by the CPU, the TEMP Register will be updated by the value written. Then when the Low byte (OCR1xL) is written to the lower eight bits, the High byte will be copied into the upper 8-bits of either the OCR1x buffer or OCR1x Compare Register in the same system clock cycle. For more information of how to access the 16-bit registers refer to “Accessing 16-bit Registers” on page 77. OCFnx (Int.Req.) = (16-bit Comparator ) OCRnx Buffer (16-bit Register) OCRnxH Buf. (8-bit) OCnx TEMP (8-bit) DATA BUS (8-bit) OCRnxL Buf. (8-bit) TCNTn (16-bit Counter) TCNTnH (8-bit) TCNTnL (8-bit) WGMn3:0 COMnx1:0 OCRnx (16-bit Register) OCRnxH (8-bit) OCRnxL (8-bit) Waveform Generator TOP BOTTOM85 2486AA–AVR–02/2013 ATmega8(L) Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC1x) bit. Forcing Compare Match will not set the OCF1x Flag or reload/clear the timer, but the OC1x pin will be updated as if a real Compare Match had occurred (the COM1x1:0 bits settings define whether the OC1x pin is set, cleared or toggled). Compare Match Blocking by TCNT1 Write All CPU writes to the TCNT1 Register will block any Compare Match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR1x to be initialized to the same value as TCNT1 without triggering an interrupt when the Timer/Counter clock is enabled. Using the Output Compare Unit Since writing TCNT1 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT1 when using any of the Output Compare channels, independent of whether the Timer/Counter is running or not. If the value written to TCNT1 equals the OCR1x value, the Compare Match will be missed, resulting in incorrect waveform generation. Do not write the TCNT1 equal to TOP in PWM modes with variable TOP values. The Compare Match for the TOP will be ignored and the counter will continue to 0xFFFF. Similarly, do not write the TCNT1 value equal to BOTTOM when the counter is downcounting. The setup of the OC1x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC1x value is to use the Force Output Compare (FOC1x) strobe bits in Normal mode. The OC1x Register keeps its value even when changing between Waveform Generation modes. Be aware that the COM1x1:0 bits are not double buffered together with the compare value. Changing the COM1x1:0 bits will take effect immediately. Compare Match Output Unit The Compare Output mode (COM1x1:0) bits have two functions. The waveform generator uses the COM1x1:0 bits for defining the Output Compare (OC1x) state at the next Compare Match. Secondly the COM1x1:0 bits control the OC1x pin output source. Figure 36 on page 86 shows a simplified schematic of the logic affected by the COM1x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM1x1:0 bits are shown. When referring to the OC1x state, the reference is for the internal OC1x Register, not the OC1x pin. If a System Reset occur, the OC1x Register is reset to “0”.86 2486AA–AVR–02/2013 ATmega8(L) Figure 36. Compare Match Output Unit, Schematic The general I/O port function is overridden by the Output Compare (OC1x) from the waveform generator if either of the COM1x1:0 bits are set. However, the OC1x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC1x pin (DDR_OC1x) must be set as output before the OC1x value is visible on the pin. The port override function is generally independent of the Waveform Generation mode, but there are some exceptions. Refer to Table 36 on page 96, Table 37 on page 96 and Table 38 on page 97 for details. The design of the Output Compare Pin logic allows initialization of the OC1x state before the output is enabled. Note that some COM1x1:0 bit settings are reserved for certain modes of operation. See “16-bit Timer/Counter Register Description” on page 96. The COM1x1:0 bits have no effect on the Input Capture unit. PORT DDR D Q D Q OCnx OCnx Pin D Q Waveform Generator COMnx1 COMnx0 0 1 DATABUS FOCnx clkI/O87 2486AA–AVR–02/2013 ATmega8(L) Compare Output Mode and Waveform Generation The waveform generator uses the COM1x1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM1x1:0 = 0 tells the waveform generator that no action on the OC1x Register is to be performed on the next Compare Match. For compare output actions in the non-PWM modes refer to Table 36 on page 96. For fast PWM mode refer to Table 37 on page 96, and for phase correct and phase and frequency correct PWM refer to Table 38 on page 97. A change of the COM1x1:0 bits state will have effect at the first Compare Match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOC1x strobe bits. Modes of Operation The mode of operation (that is, the behavior of the Timer/Counter and the Output Compare pins) is defined by the combination of the Waveform Generation mode (WGM13:0) and Compare Output mode (COM1x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM1x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM1x1:0 bits control whether the output should be set, cleared or toggle at a Compare Match. See “Compare Match Output Unit” on page 85. For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 94. Normal Mode The simplest mode of operation is the Normal mode (WGM13:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOV1) will be set in the same timer clock cycle as the TCNT1 becomes zero. The TOV1 Flag in this case behaves like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV1 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Input Capture unit is easy to use in Normal mode. However, observe that the maximum interval between the external events must not exceed the resolution of the counter. If the interval between events are too long, the timer overflow interrupt or the prescaler must be used to extend the resolution for the capture unit. The Output Compare units can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM13:0 = 4 or 12), the OCR1A or ICR1 Register are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT1) matches either the OCR1A (WGM13:0 = 4) or the ICR1 (WGM13:0 = 12). The OCR1A or ICR1 define the top value for the counter, hence also its resolution. This mode allows greater control of the Compare Match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 37 on page 88. The counter value (TCNT1) increases until a Compare Match occurs with either OCR1A or ICR1, and then counter (TCNT1) is cleared.88 2486AA–AVR–02/2013 ATmega8(L) Figure 37. CTC Mode, Timing Diagram An interrupt can be generated at each time the counter value reaches the TOP value by either using the OCF1A or ICF1 Flag according to the register used to define the TOP value. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing the TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR1A or ICR1 is lower than the current value of TCNT1, the counter will miss the Compare Match. The counter will then have to count to its maximum value (0xFFFF) and wrap around starting at 0x0000 before the Compare Match can occur. In many cases this feature is not desirable. An alternative will then be to use the fast PWM mode using OCR1A for defining TOP (WGM13:0 = 15) since the OCR1A then will be double buffered. For generating a waveform output in CTC mode, the OC1A output can be set to toggle its logical level on each Compare Match by setting the Compare Output mode bits to toggle mode (COM1A1:0 = 1). The OC1A value will not be visible on the port pin unless the data direction for the pin is set to output (DDR_OC1A = 1). The waveform generated will have a maximum frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). The waveform frequency is defined by the following equation: The N variable represents the prescaler factor (1, 8, 64, 256, or 1024). As for the Normal mode of operation, the TOV1 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x0000. Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM13:0 = 5, 6, 7, 14, or 15) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the Compare Match between TCNT1 and OCR1x, and set at BOTTOM. In inverting Compare Output mode output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct and phase and frequency correct PWM modes that use dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), hence reduces total system cost. The PWM resolution for fast PWM can be fixed to 8-bit, 9-bit, or 10-bit, or defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the TCNTn OCnA (Toggle) OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) Period 1 2 3 4 (COMnA1:0 = 1) f OCnA f clk_I/O 2   N   1 + OCRnA = --------------------------------------------------89 2486AA–AVR–02/2013 ATmega8(L) maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated by using the following equation: In fast PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 5, 6, or 7), the value in ICR1 (WGM13:0 = 14), or the value in OCR1A (WGM13:0 = 15). The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 38. The figure shows fast PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag will be set when a Compare Match occurs. Figure 38. Fast PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches TOP. In addition the OCF1A or ICF1 Flag is set at the same timer clock cycle as TOV1 is set when either OCR1A or ICR1 is used for defining the TOP value. If one of the interrupts are enabled, the interrupt handler routine can be used for updating the TOP and compare values. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a Compare Match will never occur between the TCNT1 and the OCR1x. Note that when using fixed TOP values the unused bits are masked to zero when any of the OCR1x Registers are written. The procedure for updating ICR1 differs from updating OCR1A when used for defining the TOP value. The ICR1 Register is not double buffered. This means that if ICR1 is changed to a low value when the counter is running with none or a low prescaler value, there is a risk that the new ICR1 value written is lower than the current value of TCNT1. The result will then be that the counter will miss the Compare Match at the TOP value. The counter will then have to count to the MAX value (0xFFFF) and wrap around starting at 0x0000 before the Compare Match can occur. The OCR1A Register, however, is double buffered. This feature allows the OCR1A I/O location to be written anytime. When the OCR1A I/O location is written the value written will be put into the OCR1A Buffer Register. The OCR1A Compare Register will then be updated with the value in the Buffer Register at the next timer clock cycle the TCNT1 matches TOP. The update is done at the same timer clock cycle as the TCNT1 is cleared and the TOV1 Flag is set. RFPWM log  TOP + 1 log  2 = ----------------------------------- TCNTn OCRnx / TOP Update and TOVn Interrupt Flag Set and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) Period 1 2 3 4 5 6 7 8 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3)90 2486AA–AVR–02/2013 ATmega8(L) Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However, if the base PWM frequency is actively changed (by changing the TOP value), using the OCR1A as TOP is clearly a better choice due to its double buffer feature. In fast PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to 3. See Table 37 on page 96. The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the Compare Match between OCR1x and TCNT1, and clearing (or setting) the OC1x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represents special cases when generating a PWM waveform output in the fast PWM mode. If the OCR1x is set equal to BOTTOM (0x0000) the output will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCR1x equal to TOP will result in a constant high or low output (depending on the polarity of the output set by the COM1x1:0 bits). A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC1A to toggle its logical level on each Compare Match (COM1A1:0 = 1). This applies only if OCR1A is used to define the TOP value (WGM13:0 = 15). The waveform generated will have a maximum frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). This feature is similar to the OC1A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. Phase Correct PWM Mode The phase correct Pulse Width Modulation or phase correct PWM mode (WGM13:0 = 1, 2, 3, 10, or 11) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dualslope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the Compare Match between TCNT1 and OCR1x while upcounting, and set on the Compare Match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The PWM resolution for the phase correct PWM mode can be fixed to 8-bit, 9-bit, or 10-bit, or defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated by using the following equation: In phase correct PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 1, 2, or 3), the value in ICR1 (WGM13:0 = 10), or the value in OCR1A (WGM13:0 = 11). The counter has then reached the TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 39 on page 91. The figure shows phase correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope operaf OCnxPWM f clk_I/O N    1 + TOP = ----------------------------------- RPCPWM log  TOP + 1 log  2 = -----------------------------------91 2486AA–AVR–02/2013 ATmega8(L) tion. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag will be set when a Compare Match occurs. Figure 39. Phase Correct PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches BOTTOM. When either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 Flag is set accordingly at the same timer clock cycle as the OCR1x Registers are updated with the double buffer value (at TOP). The Interrupt Flags can be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a Compare Match will never occur between the TCNT1 and the OCR1x. Note that when using fixed TOP values, the unused bits are masked to zero when any of the OCR1x Registers are written. As the third period shown in Figure 39 illustrates, changing the TOP actively while the Timer/Counter is running in the Phase Correct mode can result in an unsymmetrical output. The reason for this can be found in the time of update of the OCR1x Register. Since the OCR1x update occurs at TOP, the PWM period starts and ends at TOP. This implies that the length of the falling slope is determined by the previous TOP value, while the length of the rising slope is determined by the new TOP value. When these two values differ the two slopes of the period will differ in length. The difference in length gives the unsymmetrical result on the output. It is recommended to use the Phase and Frequency Correct mode instead of the Phase Correct mode when changing the TOP value while the Timer/Counter is running. When using a static TOP value there are practically no differences between the two modes of operation. In phase correct PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to 3. See Table 38 on page 97. The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the Compare Match between OCR1x and TCNT1 when the counter increments, and clearing (or setting) the OC1x Register at Compare Match between OCR1x and TCNT1 when OCRnx / TOP Update and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) 1 2 3 4 TOVn Interrupt Flag Set (Interrupt on Bottom) TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3)92 2486AA–AVR–02/2013 ATmega8(L) the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. If OCR1A is used to define the TOP value (WMG13:0 = 11) and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle. Phase and Frequency Correct PWM Mode The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM mode (WGM13:0 = 8 or 9) provides a high resolution phase and frequency correct PWM waveform generation option. The phase and frequency correct PWM mode is, like the phase correct PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the Compare Match between TCNT1 and OCR1x while upcounting, and set on the Compare Match while downcounting. In inverting Compare Output mode, the operation is inverted. The dual-slope operation gives a lower maximum operation frequency compared to the single-slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The main difference between the phase correct, and the phase and frequency correct PWM mode is the time the OCR1x Register is updated by the OCR1x Buffer Register, (see Figure 39 on page 91 and Figure 40 on page 93). The PWM resolution for the phase and frequency correct PWM mode can be defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated using the following equation: In phase and frequency correct PWM mode the counter is incremented until the counter value matches either the value in ICR1 (WGM13:0 = 8), or the value in OCR1A (WGM13:0 = 9). The counter has then reached the TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency correct PWM mode is shown on Figure 40 on page 93. The figure shows phase and frequency correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag will be set when a Compare Match occurs. f OCnxPCPWM f clk_I/O 2   N TOP = ---------------------------- RPFCPWM log  TOP + 1 log  2 = -----------------------------------93 2486AA–AVR–02/2013 ATmega8(L) Figure 40. Phase and Frequency Correct PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV1) is set at the same timer clock cycle as the OCR1x Registers are updated with the double buffer value (at BOTTOM). When either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 Flag set when TCNT1 has reached TOP. The Interrupt Flags can then be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a Compare Match will never occur between the TCNT1 and the OCR1x. As Figure 40 shows the output generated is, in contrast to the Phase Correct mode, symmetrical in all periods. Since the OCR1x Registers are updated at BOTTOM, the length of the rising and the falling slopes will always be equal. This gives symmetrical output pulses and is therefore frequency correct. Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However, if the base PWM frequency is actively changed by changing the TOP value, using the OCR1A as TOP is clearly a better choice due to its double buffer feature. In phase and frequency correct PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to 3. See Table 38 on page 97. The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the Compare Match between OCR1x and TCNT1 when the counter increments, and clearing (or setting) the OC1x Register at Compare Match between OCR1x and TCNT1 when the counter decrements. The PWM frequency for the output when using phase and frequency correct PWM can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represents special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the OCRnx / TOP Update and TOVn Interrupt Flag Set (Interrupt on Bottom) OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) 1 2 3 4 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) f OCnxPFCPWM f clk_I/O 2   N TOP = ----------------------------94 2486AA–AVR–02/2013 ATmega8(L) output will be continuously low and if set equal to TOP the output will be set to high for noninverted PWM mode. For inverted PWM the output will have the opposite logic values. If OCR1A is used to define the TOP value (WGM13:0 = 9) and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle. Timer/Counter Timing Diagrams The Timer/Counter is a synchronous design and the timer clock (clkT1) is therefore shown as a clock enable signal in the following figures. The figures include information on when Interrupt Flags are set, and when the OCR1x Register is updated with the OCR1x buffer value (only for modes utilizing double buffering). Figure 41 shows a timing diagram for the setting of OCF1x. Figure 41. Timer/Counter Timing Diagram, Setting of OCF1x, no Prescaling Figure 42 shows the same timing data, but with the prescaler enabled. Figure 42. Timer/Counter Timing Diagram, Setting of OCF1x, with Prescaler (fclk_I/O/8) Figure 43 on page 95 shows the count sequence close to TOP in various modes. When using phase and frequency correct PWM mode the OCR1x Register is updated at BOTTOM. The timclkTn (clkI/O/1) OCFnx clkI/O OCRnx TCNTn OCRnx Value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 OCFnx OCRnx TCNTn OCRnx Value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8)95 2486AA–AVR–02/2013 ATmega8(L) ing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by BOTTOM+1 and so on. The same renaming applies for modes that set the TOV1 Flag at BOTTOM. Figure 43. Timer/Counter Timing Diagram, no Prescaling Figure 44 shows the same timing data, but with the prescaler enabled. Figure 44. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) TOVn (FPWM) and ICFn (if used as TOP) OCRnx (Update at TOP) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2 Old OCRnx Value New OCRnx Value TOP - 1 TOP BOTTOM BOTTOM + 1 clkTn (clkI/O/1) clkI/O TOVn (FPWM) and ICFn (if used as TOP) OCRnx (Update at TOP) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2 Old OCRnx Value New OCRnx Value TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8)96 2486AA–AVR–02/2013 ATmega8(L) 16-bit Timer/Counter Register Description Timer/Counter 1 Control Register A – TCCR1A • Bit 7:6 – COM1A1:0: Compare Output Mode for channel A • Bit 5:4 – COM1B1:0: Compare Output Mode for channel B The COM1A1:0 and COM1B1:0 control the Output Compare Pins (OC1A and OC1B respectively) behavior. If one or both of the COM1A1:0 bits are written to one, the OC1A output overrides the normal port functionality of the I/O pin it is connected to. If one or both of the COM1B1:0 bit are written to one, the OC1B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC1A or OC1B pin must be set in order to enable the output driver. When the OC1A or OC1B is connected to the pin, the function of the COM1x1:0 bits is dependent of the WGM13:0 bits setting. Table 36 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to a normal or a CTC mode (non-PWM). Table 37 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the fast PWM mode. Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. In this case the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 88 for more details Bit 7 6 5 4 3 2 1 0 COM1A1 COM1A0 COM1B1 COM1B0 FOC1A FOC1B WGM11 WGM10 TCCR1A Read/Write R/W R/W R/W R/W W W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 36. Compare Output Mode, Non-PWM COM1A1/ COM1B1 COM1A0/ COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 Toggle OC1A/OC1B on Compare Match 1 0 Clear OC1A/OC1B on Compare Match (Set output to low level) 1 1 Set OC1A/OC1B on Compare Match (Set output to high level) Table 37. Compare Output Mode, Fast PWM(1) COM1A1/ COM1B1 COM1A0/ COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 WGM13:0 = 15: Toggle OC1A on Compare Match, OC1B disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B disconnected. 1 0 Clear OC1A/OC1B on Compare Match, set OC1A/OC1B at BOTTOM, (non-inverting mode) 1 1 Set OC1A/OC1B on Compare Match, clear OC1A/OC1B at BOTTOM, (inverting mode)97 2486AA–AVR–02/2013 ATmega8(L) Table 38 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the phase correct or the phase and frequency correct, PWM mode. Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. See “Phase Correct PWM Mode” on page 90 for more details • Bit 3 – FOC1A: Force Output Compare for channel A • Bit 2 – FOC1B: Force Output Compare for channel B The FOC1A/FOC1B bits are only active when the WGM13:0 bits specifies a non-PWM mode. However, for ensuring compatibility with future devices, these bits must be set to zero when TCCR1A is written when operating in a PWM mode. When writing a logical one to the FOC1A/FOC1B bit, an immediate Compare Match is forced on the waveform generation unit. The OC1A/OC1B output is changed according to its COM1x1:0 bits setting. Note that the FOC1A/FOC1B bits are implemented as strobes. Therefore it is the value present in the COM1x1:0 bits that determine the effect of the forced compare. A FOC1A/FOC1B strobe will not generate any interrupt nor will it clear the timer in Clear Timer on Compare Match (CTC) mode using OCR1A as TOP. The FOC1A/FOC1B bits are always read as zero. • Bit 1:0 – WGM11:0: Waveform Generation Mode Combined with the WGM13:2 bits found in the TCCR1B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 39. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and three types of Pulse Width Modulation (PWM) modes (see “Modes of Operation” on page 87). Table 38. Compare Output Mode, Phase Correct and Phase and Frequency Correct PWM(1) COM1A1/ COM1B1 COM1A0/ COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 WGM13:0 = 9 or 14: Toggle OC1A on Compare Match, OC1B disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B disconnected. 1 0 Clear OC1A/OC1B on Compare Match when up-counting. Set OC1A/OC1B on Compare Match when downcounting. 1 1 Set OC1A/OC1B on Compare Match when up-counting. Clear OC1A/OC1B on Compare Match when downcounting. Table 39. Waveform Generation Mode Bit Description Mode WGM13 WGM12 (CTC1) WGM11 (PWM11) WGM10 (PWM10) Timer/Counter Mode of Operation(1) TOP Update of OCR1x TOV1 Flag Set on 0 0 0 0 0 Normal 0xFFFF Immediate MAX 1 0 0 0 1 PWM, Phase Correct, 8-bit 0x00FF TOP BOTTOM 2 0 0 1 0 PWM, Phase Correct, 9-bit 0x01FF TOP BOTTOM 3 0 0 1 1 PWM, Phase Correct, 10-bit 0x03FF TOP BOTTOM 4 0 1 0 0 CTC OCR1A Immediate MAX 5 0 1 0 1 Fast PWM, 8-bit 0x00FF BOTTOM TOP 6 0 1 1 0 Fast PWM, 9-bit 0x01FF BOTTOM TOP98 2486AA–AVR–02/2013 ATmega8(L) Note: 1. The CTC1 and PWM11:0 bit definition names are obsolete. Use the WGM12:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer Timer/Counter 1 Control Register B – TCCR1B • Bit 7 – ICNC1: Input Capture Noise Canceler Setting this bit (to one) activates the Input Capture Noise Canceler. When the noise canceler is activated, the input from the Input Capture Pin (ICP1) is filtered. The filter function requires four successive equal valued samples of the ICP1 pin for changing its output. The Input Capture is therefore delayed by four Oscillator cycles when the noise canceler is enabled. • Bit 6 – ICES1: Input Capture Edge Select This bit selects which edge on the Input Capture Pin (ICP1) that is used to trigger a capture event. When the ICES1 bit is written to zero, a falling (negative) edge is used as trigger, and when the ICES1 bit is written to one, a rising (positive) edge will trigger the capture. When a capture is triggered according to the ICES1 setting, the counter value is copied into the Input Capture Register (ICR1). The event will also set the Input Capture Flag (ICF1), and this can be used to cause an Input Capture Interrupt, if this interrupt is enabled. When the ICR1 is used as TOP value (see description of the WGM13:0 bits located in the TCCR1A and the TCCR1B Register), the ICP1 is disconnected and consequently the Input Capture function is disabled. • Bit 5 – Reserved Bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when TCCR1B is written. • Bit 4:3 – WGM13:2: Waveform Generation Mode See TCCR1A Register description. • Bit 2:0 – CS12:0: Clock Select The three clock select bits select the clock source to be used by the Timer/Counter, see Figure 41 on page 94 and Figure 42 on page 94. 7 0 1 1 1 Fast PWM, 10-bit 0x03FF BOTTOM TOP 8 1 0 0 0 PWM, Phase and Frequency Correct ICR1 BOTTOM BOTTOM 9 1 0 0 1 PWM, Phase and Frequency Correct OCR1A BOTTOM BOTTOM 10 1 0 1 0 PWM, Phase Correct ICR1 TOP BOTTOM 11 1 0 1 1 PWM, Phase Correct OCR1A TOP BOTTOM 12 1 1 0 0 CTC ICR1 Immediate MAX 13 1 1 0 1 (Reserved) – – – 14 1 1 1 0 Fast PWM ICR1 BOTTOM TOP 15 1 1 1 1 Fast PWM OCR1A BOTTOM TOP Table 39. Waveform Generation Mode Bit Description (Continued) Mode WGM13 WGM12 (CTC1) WGM11 (PWM11) WGM10 (PWM10) Timer/Counter Mode of Operation(1) TOP Update of OCR1x TOV1 Flag Set on Bit 7 6 5 4 3 2 1 0 ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 TCCR1B Read/Write R/W R/W R R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 099 2486AA–AVR–02/2013 ATmega8(L) If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. Timer/Counter 1 – TCNT1H and TCNT1L The two Timer/Counter I/O locations (TCNT1H and TCNT1L, combined TCNT1) give direct access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To ensure that both the high and Low bytes are read and written simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary High byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 77. Modifying the counter (TCNT1) while the counter is running introduces a risk of missing a Compare Match between TCNT1 and one of the OCR1x Registers. Writing to the TCNT1 Register blocks (removes) the Compare Match on the following timer clock for all compare units. Output Compare Register 1 A – OCR1AH and OCR1AL Output Compare Register 1 B – OCR1BH and OCR1BL Table 40. Clock Select Bit Description CS12 CS11 CS10 Description 0 0 0 No clock source. (Timer/Counter stopped) 0 0 1 clkI/O/1 (No prescaling) 0 1 0 clkI/O/8 (From prescaler) 0 1 1 clkI/O/64 (From prescaler) 1 0 0 clkI/O/256 (From prescaler) 1 0 1 clkI/O/1024 (From prescaler) 1 1 0 External clock source on T1 pin. Clock on falling edge 1 1 1 External clock source on T1 pin. Clock on rising edge Bit 7 6 5 4 3 2 1 0 TCNT1[15:8] TCNT1H TCNT1[7:0] TCNT1L Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1A[15:8] OCR1AH OCR1A[7:0] OCR1AL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1B[15:8] OCR1BH OCR1B[7:0] OCR1BL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0100 2486AA–AVR–02/2013 ATmega8(L) The Output Compare Registers contain a 16-bit value that is continuously compared with the counter value (TCNT1). A match can be used to generate an Output Compare Interrupt, or to generate a waveform output on the OC1x pin. The Output Compare Registers are 16-bit in size. To ensure that both the high and Low bytes are written simultaneously when the CPU writes to these registers, the access is performed using an 8-bit temporary High byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 77. Input Capture Register 1 – ICR1H and ICR1L The Input Capture is updated with the counter (TCNT1) value each time an event occurs on the ICP1 pin (or optionally on the Analog Comparator Output for Timer/Counter1). The Input Capture can be used for defining the counter TOP value. The Input Capture Register is 16-bit in size. To ensure that both the high and Low bytes are read simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary High byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 77. Timer/Counter Interrupt Mask Register – TIMSK(1) Note: 1. This register contains interrupt control bits for several Timer/Counters, but only Timer1 bits are described in this section. The remaining bits are described in their respective timer sections • Bit 5 – TICIE1: Timer/Counter1, Input Capture Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Input Capture Interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 46) is executed when the ICF1 Flag, located in TIFR, is set. • Bit 4 – OCIE1A: Timer/Counter1, Output Compare A Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Output Compare A match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 46) is executed when the OCF1A Flag, located in TIFR, is set. • Bit 3 – OCIE1B: Timer/Counter1, Output Compare B Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Output Compare B match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 46) is executed when the OCF1B Flag, located in TIFR, is set. • Bit 2 – TOIE1: Timer/Counter1, Overflow Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Overflow Interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 46) is executed when the TOV1 Flag, located in TIFR, is set. Bit 7 6 5 4 3 2 1 0 ICR1[15:8] ICR1H ICR1[7:0] ICR1L Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCIE2 TOIE2 TICIE1 OCIE1A OCIE1B TOIE1 – TOIE0 TIMSK Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0101 2486AA–AVR–02/2013 ATmega8(L) Timer/Counter Interrupt Flag Register – TIFR(1) Note: 1. This register contains flag bits for several Timer/Counters, but only Timer1 bits are described in this section. The remaining bits are described in their respective timer sections • Bit 5 – ICF1: Timer/Counter1, Input Capture Flag This flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register (ICR1) is set by the WGM13:0 to be used as the TOP value, the ICF1 Flag is set when the counter reaches the TOP value. ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively, ICF1 can be cleared by writing a logic one to its bit location. • Bit 4 – OCF1A: Timer/Counter1, Output Compare A Match Flag This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output Compare Register A (OCR1A). Note that a Forced Output Compare (FOC1A) strobe will not set the OCF1A Flag. OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is executed. Alternatively, OCF1A can be cleared by writing a logic one to its bit location. • Bit 3 – OCF1B: Timer/Counter1, Output Compare B Match Flag This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output Compare Register B (OCR1B). Note that a Forced Output Compare (FOC1B) strobe will not set the OCF1B Flag. OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is executed. Alternatively, OCF1B can be cleared by writing a logic one to its bit location. • Bit 2 – TOV1: Timer/Counter1, Overflow Flag The setting of this flag is dependent of the WGM13:0 bits setting. In normal and CTC modes, the TOV1 Flag is set when the timer overflows. Refer to Table 39 on page 97 for the TOV1 Flag behavior when using another WGM13:0 bit setting. TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed. Alternatively, TOV1 can be cleared by writing a logic one to its bit location. Bit 7 6 5 4 3 2 1 0 OCF2 TOV2 ICF1 OCF1A OCF1B TOV1 – TOV0 TIFR Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0102 2486AA–AVR–02/2013 ATmega8(L) 8-bit Timer/Counter2 with PWM and Asynchronous Operation Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. The main features are: • Single Channel Counter • Clear Timer on Compare Match (Auto Reload) • Glitch-free, phase Correct Pulse Width Modulator (PWM) • Frequency Generator • 10-bit Clock Prescaler • Overflow and Compare Match Interrupt Sources (TOV2 and OCF2) • Allows Clocking from External 32kHz Watch Crystal Independent of the I/O Clock Overview A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 45. For the actual placement of I/O pins, refer to “Pin Configurations” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “8-bit Timer/Counter Register Description” on page 114. Figure 45. 8-bit Timer/Counter Block Diagram Timer/Counter DATA BUS = TCNTn Waveform Generation OCn = 0 Control Logic = 0xFF BOTTOM TOP count clear direction TOVn (Int. Req.) OCn (Int. Req.) Synchronization Unit OCRn TCCRn ASSRn Status Flags clkI/O clkASY Synchronized Status Flags asynchronous Mode Select (ASn) TOSC1 T/C Oscillator TOSC2 Prescaler clkTn clkI/O103 2486AA–AVR–02/2013 ATmega8(L) Registers The Timer/Counter (TCNT2) and Output Compare Register (OCR2) are 8-bit registers. Interrupt request (shorten as Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure since these registers are shared by other timer units. The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock source the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the clock select logic is referred to as the timer clock (clkT2). The double buffered Output Compare Register (OCR2) is compared with the Timer/Counter value at all times. The result of the compare can be used by the waveform generator to generate a PWM or variable frequency output on the Output Compare Pin (OC2). For details, see “Output Compare Unit” on page 105. The Compare Match event will also set the Compare Flag (OCF2) which can be used to generate an Output Compare interrupt request. Definitions Many register and bit references in this document are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 2. However, when using the register or bit defines in a program, the precise form must be used (that is, TCNT2 for accessing Timer/Counter2 counter value and so on). The definitions in Table 41 are also used extensively throughout the document. Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal synchronous or an external asynchronous clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2 bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “Asynchronous Status Register – ASSR” on page 117. For details on clock sources and prescaler, see “Timer/Counter Prescaler” on page 120. Table 41. Definitions BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00). MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR2 Register. The assignment is dependent on the mode of operation.104 2486AA–AVR–02/2013 ATmega8(L) Counter Unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 46 shows a block diagram of the counter and its surrounding environment. Figure 46. Counter Unit Block Diagram Signal description (internal signals): count Increment or decrement TCNT2 by 1 direction Selects between increment and decrement clear Clear TCNT2 (set all bits to zero) clkT2 Timer/Counter clock TOP Signalizes that TCNT2 has reached maximum value BOTTOM Signalizes that TCNT2 has reached minimum value (zero) Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source, selected by the clock select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in the Timer/Counter Control Register (TCCR2). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare Output OC2. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 108. The Timer/Counter Overflow (TOV2) Flag is set according to the mode of operation selected by the WGM21:0 bits. TOV2 can be used for generating a CPU interrupt. DATA BUS TCNTn Control Logic count TOVn (Int. Req.) BOTTOM TOP direction clear TOSC1 T/C Oscillator TOSC2 Prescaler clkI/O clk Tn105 2486AA–AVR–02/2013 ATmega8(L) Output Compare Unit The 8-bit comparator continuously compares TCNT2 with the Output Compare Register (OCR2). Whenever TCNT2 equals OCR2, the comparator signals a match. A match will set the Output Compare Flag (OCF2) at the next timer clock cycle. If enabled (OCIE2 = 1), the Output Compare Flag generates an Output Compare interrupt. The OCF2 Flag is automatically cleared when the interrupt is executed. Alternatively, the OCF2 Flag can be cleared by software by writing a logical one to its I/O bit location. The waveform generator uses the match signal to generate an output according to operating mode set by the WGM21:0 bits and Compare Output mode (COM21:0) bits. The max and bottom signals are used by the waveform generator for handling the special cases of the extreme values in some modes of operation (see “Modes of Operation” on page 108). Figure 47 shows a block diagram of the Output Compare unit. Figure 47. Output Compare Unit, Block Diagram The OCR2 Register is double buffered when using any of the Pulse Width Modulation (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR2 Compare Register to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR2 Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR2 Buffer Register, and if double buffering is disabled the CPU will access the OCR2 directly. OCFn (Int. Req.) = (8-bit Comparator ) OCRn OCxy DATA BUS TCNTn WGMn1:0 Waveform Generator TOP FOCn COMn1:0 BOTTOM106 2486AA–AVR–02/2013 ATmega8(L) Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC2) bit. Forcing Compare Match will not set the OCF2 Flag or reload/clear the timer, but the OC2 pin will be updated as if a real Compare Match had occurred (the COM21:0 bits settings define whether the OC2 pin is set, cleared or toggled). Compare Match Blocking by TCNT2 Write All CPU write operations to the TCNT2 Register will block any Compare Match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR2 to be initialized to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is enabled. Using the Output Compare Unit Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT2 when using the Output Compare channel, independently of whether the Timer/Counter is running or not. If the value written to TCNT2 equals the OCR2 value, the Compare Match will be missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is downcounting. The setup of the OC2 should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC2 value is to use the Force Output Compare (FOC2) strobe bit in Normal mode. The OC2 Register keeps its value even when changing between waveform generation modes. Be aware that the COM21:0 bits are not double buffered together with the compare value. Changing the COM21:0 bits will take effect immediately.107 2486AA–AVR–02/2013 ATmega8(L) Compare Match Output Unit The Compare Output mode (COM21:0) bits have two functions. The waveform generator uses the COM21:0 bits for defining the Output Compare (OC2) state at the next Compare Match. Also, the COM21:0 bits control the OC2 pin output source. Figure 48 shows a simplified schematic of the logic affected by the COM21:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM21:0 bits are shown. When referring to the OC2 state, the reference is for the internal OC2 Register, not the OC2 pin. Figure 48. Compare Match Output Unit, Schematic The general I/O port function is overridden by the Output Compare (OC2) from the waveform generator if either of the COM21:0 bits are set. However, the OC2 pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC2 pin (DDR_OC2) must be set as output before the OC2 value is visible on the pin. The port override function is independent of the Waveform Generation mode. The design of the Output Compare Pin logic allows initialization of the OC2 state before the output is enabled. Note that some COM21:0 bit settings are reserved for certain modes of operation. See “8-bit Timer/Counter Register Description” on page 114. PORT DDR D Q D Q OCn OCn Pin D Q Waveform Generator COMn1 COMn0 0 1 DATABUS FOCn clkI/O108 2486AA–AVR–02/2013 ATmega8(L) Compare Output Mode and Waveform Generation The Waveform Generator uses the COM21:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM21:0 = 0 tells the waveform generator that no action on the OC2 Register is to be performed on the next Compare Match. For compare output actions in the nonPWM modes refer to Table 43 on page 115. For fast PWM mode, refer to Table 44 on page 115, and for phase correct PWM refer to Table 45 on page 116. A change of the COM21:0 bits state will have effect at the first Compare Match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOC2 strobe bits. Modes of Operation The mode of operation (that is, the behavior of the Timer/Counter and the Output Compare pins) is defined by the combination of the Waveform Generation mode (WGM21:0) and Compare Output mode (COM21:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM21:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM21:0 bits control whether the output should be set, cleared, or toggled at a Compare Match (see “Compare Match Output Unit” on page 107). For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 112. Normal Mode The simplest mode of operation is the Normal mode (WGM21:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV2 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time.109 2486AA–AVR–02/2013 ATmega8(L) Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM21:0 = 2), the OCR2 Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT2) matches the OCR2. The OCR2 defines the top value for the counter, hence also its resolution. This mode allows greater control of the Compare Match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 49. The counter value (TCNT2) increases until a Compare Match occurs between TCNT2 and OCR2, and then counter (TCNT2) is cleared. Figure 49. CTC Mode, Timing Diagram An interrupt can be generated each time the counter value reaches the TOP value by using the OCF2 Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing the TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR2 is lower than the current value of TCNT2, the counter will miss the Compare Match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the Compare Match can occur. For generating a waveform output in CTC mode, the OC2 output can be set to toggle its logical level on each Compare Match by setting the Compare Output mode bits to toggle mode (COM21:0 = 1). The OC2 value will not be visible on the port pin unless the data direction for the pin is set to output. The waveform generated will have a maximum frequency of fOC2 = fclk_I/O/2 when OCR2 is set to zero (0x00). The waveform frequency is defined by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. TCNTn OCn (Toggle) OCn Interrupt Flag Set Period 1 2 3 4 (COMn1:0 = 1) f OCn f clk_I/O 2   N   1 + OCRn = ----------------------------------------------110 2486AA–AVR–02/2013 ATmega8(L) Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM21:0 = 3) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM option by its single-slope operation. The counter counts from BOTTOM to MAX then restarts from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC2) is cleared on the Compare Match between TCNT2 and OCR2, and set at BOTTOM. In inverting Compare Output mode, the output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct PWM mode that uses dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), and therefore reduces total system cost. In fast PWM mode, the counter is incremented until the counter value matches the MAX value. The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 50. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2 and TCNT2. Figure 50. Fast PWM Mode, Timing Diagram The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches MAX. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2 pin. Setting the COM21:0 bits to 2 will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM21:0 to 3 (see Table 44 on page 115). The actual OC2 value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC2 Register at the Compare Match between OCR2 and TCNT2, and clearing (or setting) the OC2 Register at the timer clock cycle the counter is cleared (changes from MAX to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). TCNTn OCRn Update and TOVn Interrupt Flag Set Period 1 2 3 OCn OCn (COMn1:0 = 2) (COMn1:0 = 3) OCRn Interrupt Flag Set 4 5 6 7 f OCnPWM f clk_I/O N  256 = ------------------111 2486AA–AVR–02/2013 ATmega8(L) The extreme values for the OCR2 Register represent special cases when generating a PWM waveform output in the fast PWM mode. If the OCR2 is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2 equal to MAX will result in a constantly high or low output (depending on the polarity of the output set by the COM21:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC2 to toggle its logical level on each Compare Match (COM21:0 = 1). The waveform generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2 is set to zero. This feature is similar to the OC2 toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. Phase Correct PWM Mode The phase correct PWM mode (WGM21:0 = 1) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to MAX and then from MAX to BOTTOM. In noninverting Compare Output mode, the Output Compare (OC2) is cleared on the Compare Match between TCNT2 and OCR2 while upcounting, and set on the Compare Match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The PWM resolution for the phase correct PWM mode is fixed to eight bits. In phase correct PWM mode the counter is incremented until the counter value matches MAX. When the counter reaches MAX, it changes the count direction. The TCNT2 value will be equal to MAX for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 51. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2 and TCNT2. Figure 51. Phase Correct PWM Mode, Timing Diagram TOVn Interrupt Flag Set OCn Interrupt Flag Set 1 2 3 TCNTn Period OCn OCn (COMn1:0 = 2) (COMn1:0 = 3) OCRn Update112 2486AA–AVR–02/2013 ATmega8(L) The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC2 pin. Setting the COM21:0 bits to 2 will produce a non-inverted PWM. An inverted PWM output can be generated by setting the COM21:0 to 3 (see Table 45 on page 116). The actual OC2 value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC2 Register at the Compare Match between OCR2 and TCNT2 when the counter increments, and setting (or clearing) the OC2 Register at Compare Match between OCR2 and TCNT2 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2 Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR2 is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for noninverted PWM mode. For inverted PWM the output will have the opposite logic values. At the very start of period 2 in Figure 51 on page 111 OCn has a transition from high to low even though there is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM. There are two cases that give a transition without Compare Match: • OCR2A changes its value from MAX, like in Figure 51 on page 111. When the OCR2A value is MAX the OCn pin value is the same as the result of a down-counting Compare Match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match • The timer starts counting from a value higher than the one in OCR2A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up Timer/Counter Timing Diagrams The following figures show the Timer/Counter in Synchronous mode, and the timer clock (clkT2) is therefore shown as a clock enable signal. In Asynchronous mode, clkI/O should be replaced by the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are set. Figure 52 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. Figure 52. Timer/Counter Timing Diagram, no Prescaling f OCnPCPWM f clk_I/O N  510 = ------------------ clkTn (clkI/O/1) TOVn clkI/O TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1113 2486AA–AVR–02/2013 ATmega8(L) Figure 53 shows the same timing data, but with the prescaler enabled. Figure 53. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) Figure 54 shows the setting of OCF2 in all modes except CTC mode. Figure 54. Timer/Counter Timing Diagram, Setting of OCF2, with Prescaler (fclk_I/O/8) TOVn TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) OCFn OCRn TCNTn OCRn Value OCRn - 1 OCRn OCRn + 1 OCRn + 2 clkI/O clkTn (clkI/O/8)114 2486AA–AVR–02/2013 ATmega8(L) Figure 55 shows the setting of OCF2 and the clearing of TCNT2 in CTC mode. Figure 55. Timer/Counter Timing Diagram, Clear Timer on Compare Match Mode, with Prescaler (fclk_I/O/8) 8-bit Timer/Counter Register Description Timer/Counter Control Register – TCCR2 • Bit 7 – FOC2: Force Output Compare The FOC2 bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2 is written when operating in PWM mode. When writing a logical one to the FOC2 bit, an immediate Compare Match is forced on the waveform generation unit. The OC2 output is changed according to its COM21:0 bits setting. Note that the FOC2 bit is implemented as a strobe. Therefore it is the value present in the COM21:0 bits that determines the effect of the forced compare. A FOC2 strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2 as TOP. The FOC2 bit is always read as zero. • Bit 6:3 – WGM21:0: Waveform Generation Mode These bits control the counting sequence of the counter, the source for the maximum (TOP) counter value, and what type of waveform generation to be used. Modes of operation supported by the Timer/Counter unit are: Normal mode, Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes. See Table 42 on page 115 and “Modes of Operation” on page 108. OCFn OCRn TCNTn (CTC) TOP TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) Bit 7 6 5 4 3 2 1 0 FOC2 WGM20 COM21 COM20 WGM21 CS22 CS21 CS20 TCCR2 Read/Write W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0115 2486AA–AVR–02/2013 ATmega8(L) Note: 1. The CTC2 and PWM2 bit definition names are now obsolete. Use the WGM21:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer • Bit 5:4 – COM21:0: Compare Match Output Mode These bits control the Output Compare Pin (OC2) behavior. If one or both of the COM21:0 bits are set, the OC2 output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to OC2 pin must be set in order to enable the output driver. When OC2 is connected to the pin, the function of the COM21:0 bits depends on the WGM21:0 bit setting. Table 43 shows the COM21:0 bit functionality when the WGM21:0 bits are set to a normal or CTC mode (non-PWM). Table 44 shows the COM21:0 bit functionality when the WGM21:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2 equals TOP and COM21 is set. In this case, the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 110 for more details Table 42. Waveform Generation Mode Bit Description Mode WGM21 (CTC2) WGM20 (PWM2) Timer/Counter Mode of Operation(1) TOP Update of OCR2 TOV2 Flag Set 0 0 0 Normal 0xFF Immediate MAX 1 0 1 PWM, Phase Correct 0xFF TOP BOTTOM 2 1 0 CTC OCR2 Immediate MAX 3 1 1 Fast PWM 0xFF BOTTOM MAX Table 43. Compare Output Mode, Non-PWM Mode COM21 COM20 Description 0 0 Normal port operation, OC2 disconnected 0 1 Toggle OC2 on Compare Match 1 0 Clear OC2 on Compare Match 1 1 Set OC2 on Compare Match Table 44. Compare Output Mode, Fast PWM Mode(1) COM21 COM20 Description 0 0 Normal port operation, OC2 disconnected 0 1 Reserved 1 0 Clear OC2 on Compare Match, set OC2 at BOTTOM, (non-inverting mode) 1 1 Set OC2 on Compare Match, clear OC2 at BOTTOM, (inverting mode)116 2486AA–AVR–02/2013 ATmega8(L) Table 45 shows the COM21:0 bit functionality when the WGM21:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2 equals TOP and COM21 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page 111 for more details • Bit 2:0 – CS22:0: Clock Select The three clock select bits select the clock source to be used by the Timer/Counter, see Table 46. Timer/Counter Register – TCNT2 The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running, introduces a risk of missing a Compare Match between TCNT2 and the OCR2 Register. Output Compare Register – OCR2 The Output Compare Register contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2 pin. Table 45. Compare Output Mode, Phase Correct PWM Mode(1) COM21 COM20 Description 0 0 Normal port operation, OC2 disconnected 0 1 Reserved 1 0 Clear OC2 on Compare Match when up-counting. Set OC2 on Compare Match when downcounting 1 1 Set OC2 on Compare Match when up-counting. Clear OC2 on Compare Match when downcounting Table 46. Clock Select Bit Description CS22 CS21 CS20 Description 0 0 0 No clock source (Timer/Counter stopped) 0 0 1 clkT2S/(No prescaling) 0 1 0 clkT2S/8 (From prescaler) 0 1 1 clkT2S/32 (From prescaler) 1 0 0 clkT2S/64 (From prescaler) 1 0 1 clkT2S/128 (From prescaler) 1 1 0 clkT2S/256 (From prescaler) 1 1 1 clkT2S/1024 (From prescaler) Bit 7 6 5 4 3 2 1 0 TCNT2[7:0] TCNT2 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR2[7:0] OCR2 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0117 2486AA–AVR–02/2013 ATmega8(L) Asynchronous Operation of the Timer/Counter Asynchronous Status Register – ASSR • Bit 3 – AS2: Asynchronous Timer/Counter2 When AS2 is written to zero, Timer/Counter 2 is clocked from the I/O clock, clkI/O. When AS2 is written to one, Timer/Counter 2 is clocked from a crystal Oscillator connected to the Timer Oscillator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2, and TCCR2 might be corrupted. • Bit 2 – TCN2UB: Timer/Counter2 Update Busy When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set. When TCNT2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value. • Bit 1 – OCR2UB: Output Compare Register2 Update Busy When Timer/Counter2 operates asynchronously and OCR2 is written, this bit becomes set. When OCR2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2 is ready to be updated with a new value. • Bit 0 – TCR2UB: Timer/Counter Control Register2 Update Busy When Timer/Counter2 operates asynchronously and TCCR2 is written, this bit becomes set. When TCCR2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2 is ready to be updated with a new value. If a write is performed to any of the three Timer/Counter2 Registers while its update busy flag is set, the updated value might get corrupted and cause an unintentional interrupt to occur. The mechanisms for reading TCNT2, OCR2, and TCCR2 are different. When reading TCNT2, the actual timer value is read. When reading OCR2 or TCCR2, the value in the temporary storage register is read. Asynchronous Operation of Timer/Counter2 When Timer/Counter2 operates asynchronously, some considerations must be taken. • Warning: When switching between asynchronous and synchronous clocking of Timer/Counter2, the Timer Registers TCNT2, OCR2, and TCCR2 might be corrupted. A safe procedure for switching clock source is: 1. Disable the Timer/Counter2 interrupts by clearing OCIE2 and TOIE2 2. Select clock source by setting AS2 as appropriate 3. Write new values to TCNT2, OCR2, and TCCR2 4. To switch to asynchronous operation: Wait for TCN2UB, OCR2UB, and TCR2UB 5. Clear the Timer/Counter2 Interrupt Flags 6. Enable interrupts, if needed • The Oscillator is optimized for use with a 32.768kHz watch crystal. Applying an external clock to the TOSC1 pin may result in incorrect Timer/Counter2 operation. The CPU main clock frequency must be more than four times the Oscillator frequency • When writing to one of the registers TCNT2, OCR2, or TCCR2, the value is transferred to a temporary register, and latched after two positive edges on TOSC1. The user should not Bit 7 6 5 4 3 2 1 0 – – – – AS2 TCN2UB OCR2UB TCR2UB ASSR Read/Write R R R R R/W R R R Initial Value 0 0 0 0 0 0 0 0118 2486AA–AVR–02/2013 ATmega8(L) write a new value before the contents of the temporary register have been transferred to its destination. Each of the three mentioned registers have their individual temporary register, which means that, for example, writing to TCNT2 does not disturb an OCR2 write in progress. To detect that a transfer to the destination register has taken place, the Asynchronous Status Register – ASSR has been implemented • When entering Power-save mode after having written to TCNT2, OCR2, or TCCR2, the user must wait until the written register has been updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode before the changes are effective. This is particularly important if the Output Compare2 interrupt is used to wake up the device, since the Output Compare function is disabled during writing to OCR2 or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode before the OCR2UB bit returns to zero, the device will never receive a Compare Match interrupt, and the MCU will not wake up • If Timer/Counter2 is used to wake the device up from Power-save mode, precautions must be taken if the user wants to re-enter one of these modes: The interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and re-entering sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the device will fail to wake up. If the user is in doubt whether the time before re-entering Power-save or Extended Standby mode is sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has elapsed: 1. Write a value to TCCR2, TCNT2, or OCR2 2. Wait until the corresponding Update Busy Flag in ASSR returns to zero 3. Enter Power-save or Extended Standby mode • When the asynchronous operation is selected, the 32.768kHZ Oscillator for Timer/Counter2 is always running, except in Power-down and Standby modes. After a Power-up Reset or Wake-up from Power-down or Standby mode, the user should be aware of the fact that this Oscillator might take as long as one second to stabilize. The user is advised to wait for at least one second before using Timer/Counter2 after Power-up or Wake-up from Power-down or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost after a wake-up from Power-down or Standby mode due to unstable clock signal upon startup, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin • Description of wake up from Power-save or Extended Standby mode when the timer is clocked asynchronously: When the interrupt condition is met, the wake up process is started on the following cycle of the timer clock, that is, the timer is always advanced by at least one before the processor can read the counter value. After wake-up, the MCU is halted for four cycles, it executes the interrupt routine, and resumes execution from the instruction following SLEEP • Reading of the TCNT2 Register shortly after wake-up from Power-save may give an incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2 must be done through a register synchronized to the internal I/O clock domain. Synchronization takes place for every rising TOSC1 edge. When waking up from Powersave mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC clock after waking up from Power-save mode is essentially unpredictable, as it depends on the wake-up time. The recommended procedure for reading TCNT2 is thus as follows: 1. Write any value to either of the registers OCR2 or TCCR2 2. Wait for the corresponding Update Busy Flag to be cleared 3. Read TCNT2119 2486AA–AVR–02/2013 ATmega8(L) • During asynchronous operation, the synchronization of the Interrupt Flags for the asynchronous timer takes three processor cycles plus one timer cycle. The timer is therefore advanced by at least one before the processor can read the timer value causing the setting of the Interrupt Flag. The Output Compare Pin is changed on the timer clock and is not synchronized to the processor clock Timer/Counter Interrupt Mask Register – TIMSK • Bit 7 – OCIE2: Timer/Counter2 Output Compare Match Interrupt Enable When the OCIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match interrupt is enabled. The corresponding interrupt is executed if a Compare Match in Timer/Counter2 occurs (that is, when the OCF2 bit is set in the Timer/Counter Interrupt Flag Register – TIFR). • Bit 6 – TOIE2: Timer/Counter2 Overflow Interrupt Enable When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter2 occurs (that is, when the TOV2 bit is set in the Timer/Counter Interrupt Flag Register – TIFR). Timer/Counter Interrupt Flag Register – TIFR • Bit 7 – OCF2: Output Compare Flag 2 The OCF2 bit is set (one) when a Compare Match occurs between the Timer/Counter2 and the data in OCR2 – Output Compare Register2. OCF2 is cleared by hardware when executing the corresponding interrupt Handling Vector. Alternatively, OCF2 is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2 (Timer/Counter2 Compare Match Interrupt Enable), and OCF2 are set (one), the Timer/Counter2 Compare Match Interrupt is executed. • Bit 6 – TOV2: Timer/Counter2 Overflow Flag The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hardware when executing the corresponding interrupt Handling Vector. Alternatively, TOV2 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE2 (Timer/Counter2 Overflow Interrupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00. Bit 7 6 5 4 3 2 1 0 OCIE2 TOIE2 TICIE1 OCIE1A OCIE1B TOIE1 – TOIE0 TIMSK Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCF2 TOV2 ICF1 OCF1A OCF1B TOV1 – TOV0 TIFR Read/Write R/W R/W R/W R/W R/W R/W R R/W Initial Value 0 0 0 0 0 0 0 0120 2486AA–AVR–02/2013 ATmega8(L) Timer/Counter Prescaler Figure 56. Prescaler for Timer/Counter2 The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main system I/O clock clkI/O. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter (RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port B. A crystal can then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock source for Timer/Counter2. The Oscillator is optimized for use with a 32.768kHz crystal. Applying an external clock source to TOSC1 is not recommended. For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64, clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected. Setting the PSR2 bit in SFIOR resets the prescaler. This allows the user to operate with a predictable prescaler. Special Function IO Register – SFIOR • Bit 1 – PSR2: Prescaler Reset Timer/Counter2 When this bit is written to one, the Timer/Counter2 prescaler will be reset. The bit will be cleared by hardware after the operation is performed. Writing a zero to this bit will have no effect. This bit will always be read as zero if Timer/Counter2 is clocked by the internal CPU clock. If this bit is written when Timer/Counter2 is operating in Asynchronous mode, the bit will remain one until the prescaler has been reset. 10-BIT T/C PRESCALER TIMER/COUNTER2 CLOCK SOURCE clkI/O clkT2S TOSC1 AS2 CS20 CS21 CS22 clkT2S/8 clkT2S/64 clkT2S/128 clkT2S/1024 clkT2S/256 clkT2S/32 0 PSR2 Clear clkT2 Bit 7 6 5 4 3 2 1 0 – – – – ACME PUD PSR2 PSR10 SFIOR Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0121 2486AA–AVR–02/2013 ATmega8(L) Serial Peripheral Interface – SPI The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the ATmega8 and peripheral devices or between several AVR devices. The ATmega8 SPI includes the following features: • Full-duplex, Three-wire Synchronous Data Transfer • Master or Slave Operation • LSB First or MSB First Data Transfer • Seven Programmable Bit Rates • End of Transmission Interrupt Flag • Write Collision Flag Protection • Wake-up from Idle Mode • Double Speed (CK/2) Master SPI Mode Figure 57. SPI Block Diagram(1) Note: 1. Refer to “Pin Configurations” on page 2, and Table 22 on page 58 for SPI pin placement The interconnection between Master and Slave CPUs with SPI is shown in Figure 58 on page 122. The system consists of two Shift Registers, and a Master clock generator. The SPI Master initiates the communication cycle when pulling low the Slave Select SS pin of the desired Slave. Master and Slave prepare the data to be sent in their respective Shift Registers, and the Master generates the required clock pulses on the SCK line to interchange data. Data is always shifted from Master to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In – Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pulling high the Slave Select, SS, line. When configured as a Master, the SPI interface has no automatic control of the SS line. This must be handled by user software before communication can start. When this is done, writing a SPI2X SPI2X DIVIDER /2/4/8/16/32/64/128122 2486AA–AVR–02/2013 ATmega8(L) byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end of Transmission Flag (SPIF). If the SPI interrupt enable bit (SPIE) in the SPCR Register is set, an interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be kept in the Buffer Register for later use. When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long as the SS pin is driven high. In this state, software may update the contents of the SPI Data Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin until the SS pin is driven low. As one byte has been completely shifted, the end of Transmission Flag, SPIF is set. If the SPI interrupt enable bit, SPIE, in the SPCR Register is set, an interrupt is requested. The Slave may continue to place new data to be sent into SPDR before reading the incoming data. The last incoming byte will be kept in the Buffer Register for later use. Figure 58. SPI Master-Slave Interconnection The system is single buffered in the transmit direction and double buffered in the receive direction. This means that bytes to be transmitted cannot be written to the SPI Data Register before the entire shift cycle is completed. When receiving data, however, a received character must be read from the SPI Data Register before the next character has been completely shifted in. Otherwise, the first byte is lost. In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure correct sampling of the clock signal, the minimum low and high periods should be: Low period: longer than 2 CPU clock cycles High period: longer than 2 CPU clock cycles When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden according to Table 47. For more details on automatic port overrides, refer to “Alternate Port Functions” on page 56. Note: 1. See “Port B Pins Alternate Functions” on page 58 for a detailed description of how to define the direction of the user defined SPI pins Table 47. SPI Pin Overrides(1) Pin Direction, Master SPI Direction, Slave SPI MOSI User Defined Input MISO Input User Defined SCK User Defined Input SS User Defined Input MSB MASTER LSB 8 BIT SHIFT REGISTER MSB SLAVE LSB 8 BIT SHIFT REGISTER MISO MOSI SPI CLOCK GENERATOR SCK SS MISO MOSI SCK SS VCC SHIFT ENABLE123 2486AA–AVR–02/2013 ATmega8(L) The following code examples show how to initialize the SPI as a Master and how to perform a simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by the actual data direction bits for these pins. For example if MOSI is placed on pin PB5, replace DD_MOSI with DDB5 and DDR_SPI with DDRB. Note: 1. See “About Code Examples” on page 8 Assembly Code Example(1) SPI_MasterInit: ; Set MOSI and SCK output, all others input ldi r17,(1<>8); UBRRL = (unsigned char)ubrr; /* Enable receiver and transmitter */ UCSRB = (1<> 1) & 0x01; return ((resh << 8) | resl); }141 2486AA–AVR–02/2013 ATmega8(L) Receive Compete Flag and Interrupt The USART Receiver has one flag that indicates the Receiver state. The Receive Complete (RXC) Flag indicates if there are unread data present in the receive buffer. This flag is one when unread data exist in the receive buffer, and zero when the receive buffer is empty (that is, does not contain any unread data). If the Receiver is disabled (RXEN = 0), the receive buffer will be flushed and consequently the RXC bit will become zero. When the Receive Complete Interrupt Enable (RXCIE) in UCSRB is set, the USART Receive Complete Interrupt will be executed as long as the RXC Flag is set (provided that global interrupts are enabled). When interrupt-driven data reception is used, the receive complete routine must read the received data from UDR in order to clear the RXC Flag, otherwise a new interrupt will occur once the interrupt routine terminates. Receiver Error Flags The USART Receiver has three error flags: Frame Error (FE), Data OverRun (DOR) and Parity Error (PE). All can be accessed by reading UCSRA. Common for the error flags is that they are located in the receive buffer together with the frame for which they indicate the error status. Due to the buffering of the error flags, the UCSRA must be read before the receive buffer (UDR), since reading the UDR I/O location changes the buffer read location. Another equality for the error flags is that they can not be altered by software doing a write to the flag location. However, all flags must be set to zero when the UCSRA is written for upward compatibility of future USART implementations. None of the error flags can generate interrupts. The Frame Error (FE) Flag indicates the state of the first stop bit of the next readable frame stored in the receive buffer. The FE Flag is zero when the stop bit was correctly read (as one), and the FE Flag will be one when the stop bit was incorrect (zero). This flag can be used for detecting out-of-sync conditions, detecting break conditions and protocol handling. The FE Flag is not affected by the setting of the USBS bit in UCSRC since the Receiver ignores all, except for the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to UCSRA. The Data OverRun (DOR) Flag indicates data loss due to a Receiver buffer full condition. A Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in the Receive Shift Register, and a new start bit is detected. If the DOR Flag is set there was one or more serial frame lost between the frame last read from UDR, and the next frame read from UDR. For compatibility with future devices, always write this bit to zero when writing to UCSRA. The DOR Flag is cleared when the frame received was successfully moved from the Shift Register to the receive buffer. The Parity Error (PE) Flag indicates that the next frame in the receive buffer had a parity error when received. If parity check is not enabled the PE bit will always be read zero. For compatibility with future devices, always set this bit to zero when writing to UCSRA. For more details see “Parity Bit Calculation” on page 134 and “Parity Checker” . Parity Checker The Parity Checker is active when the high USART Parity mode (UPM1) bit is set. Type of parity check to be performed (odd or even) is selected by the UPM0 bit. When enabled, the Parity Checker calculates the parity of the data bits in incoming frames and compares the result with the parity bit from the serial frame. The result of the check is stored in the receive buffer together with the received data and stop bits. The Parity Error (PE) Flag can then be read by software to check if the frame had a parity error. The PE bit is set if the next character that can be read from the receive buffer had a parity error when received and the parity checking was enabled at that point (UPM1 = 1). This bit is valid until the receive buffer (UDR) is read.142 2486AA–AVR–02/2013 ATmega8(L) Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing receptions will therefore be lost. When disabled (that is, the RXEN is set to zero) the Receiver will no longer override the normal function of the RxD port pin. The Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in the buffer will be lost Flushing the Receive Buffer The Receiver buffer FIFO will be flushed when the Receiver is disabled (that is, the buffer will be emptied of its contents). Unread data will be lost. If the buffer has to be flushed during normal operation, due to for instance an error condition, read the UDR I/O location until the RXC Flag is cleared. The following code example shows how to flush the receive buffer. Note: 1. See “About Code Examples” on page 8 Asynchronous Data Reception The USART includes a clock recovery and a data recovery unit for handling asynchronous data reception. The clock recovery logic is used for synchronizing the internally generated baud rate clock to the incoming asynchronous serial frames at the RxD pin. The data recovery logic samples and low pass filters each incoming bit, thereby improving the noise immunity of the Receiver. The asynchronous reception operational range depends on the accuracy of the internal baud rate clock, the rate of the incoming frames, and the frame size in number of bits. Asynchronous Clock Recovery The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 65 illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double Speed mode. The horizontal arrows illustrate the synchronization variation due to the sampling process. Note the larger time variation when using the Double Speed mode (U2X = 1) of operation. Samples denoted zero are samples done when the RxD line is idle (that is, no communication activity). Figure 65. Start Bit Sampling When the clock recovery logic detects a high (idle) to low (start) transition on the RxD line, the start bit detection sequence is initiated. Let sample 1 denote the first zero-sample as shown in Assembly Code Example(1) USART_Flush: sbis UCSRA, RXC ret in r16, UDR rjmp USART_Flush C Code Example(1) void USART_Flush( void ) { unsigned char dummy; while ( UCSRA & (1< 2 CPU clock cycles for fck <12MHz, 3 CPU clock cycles for fck >=12MHz High:> 2 CPU clock cycles for fck <12MHz, 3 CPU clock cycles for fck >=12MHz Table 96. Pin Mapping Serial Programming Symbol Pins I/O Description MOSI PB3 I Serial data in MISO PB4 O Serial data out SCK PB5 I Serial clock VCC GND XTAL1 SCK MISO MOSI RESET PB3 PB4 PB5 +2.7V - 5.5V AVCC +2.7V - 5.5V (2)231 2486AA–AVR–02/2013 ATmega8(L) Serial Programming Algorithm When writing serial data to the ATmega8, data is clocked on the rising edge of SCK. When reading data from the ATmega8, data is clocked on the falling edge of SCK. See Figure 113 on page 232 for timing details. To program and verify the ATmega8 in the Serial Programming mode, the following sequence is recommended (see four byte instruction formats in Table 98 on page 233): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during Power-up. In this case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0” 2. Wait for at least 20ms and enable Serial Programming by sending the Programming Enable serial instruction to pin MOSI 3. The Serial Programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command 4. The Flash is programmed one page at a time. The page size is found in Table 89 on page 218. The memory page is loaded one byte at a time by supplying the 5 LSB of the address and data together with the Load Program memory Page instruction. To ensure correct loading of the page, the data Low byte must be loaded before data High byte is applied for a given address. The Program memory Page is stored by loading the Write Program memory Page instruction with the 7MSB of the address. If polling is not used, the user must wait at least tWD_FLASH before issuing the next page (see Table 97 on page 232). Note: If other commands than polling (read) are applied before any write operation (FLASH, EEPROM, Lock Bits, Fuses) is completed, it may result in incorrect programming 5. The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling is not used, the user must wait at least tWD_EEPROM before issuing the next byte (see Table 97 on page 232). In a chip erased device, no 0xFFs in the data file(s) need to be programmed 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output MISO 7. At the end of the programming session, RESET can be set high to commence normal operation 8. Power-off sequence (if needed): Set RESET to “1” Turn VCC power off Data Polling Flash When a page is being programmed into the Flash, reading an address location within the page being programmed will give the value 0xFF. At the time the device is ready for a new page, the programmed value will read correctly. This is used to determine when the next page can be written. Note that the entire page is written simultaneously and any address within the page can be used for polling. Data polling of the Flash will not work for the value 0xFF, so when programming this value, the user will have to wait for at least tWD_FLASH before programming the next page. As a chip-erased device contains 0xFF in all locations, programming of addresses that are meant to contain 0xFF, can be skipped. See Table 97 on page 232 for tWD_FLASH value.232 2486AA–AVR–02/2013 ATmega8(L) Data Polling EEPROM When a new byte has been written and is being programmed into EEPROM, reading the address location being programmed will give the value 0xFF. At the time the device is ready for a new byte, the programmed value will read correctly. This is used to determine when the next byte can be written. This will not work for the value 0xFF, but the user should have the following in mind: As a chip-erased device contains 0xFF in all locations, programming of addresses that are meant to contain 0xFF, can be skipped. This does not apply if the EEPROM is Re-programmed without chip-erasing the device. In this case, data polling cannot be used for the value 0xFF, and the user will have to wait at least tWD_EEPROM before programming the next byte. See Table 97 for tWD_EEPROM value. Figure 113. Serial Programming Waveforms Table 97. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location Symbol Minimum Wait Delay tWD_FUSE 4.5ms tWD_FLASH 4.5ms tWD_EEPROM 9.0ms tWD_ERASE 9.0ms MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUT233 2486AA–AVR–02/2013 ATmega8(L) Note: a = address high bits b = address low bits H = 0 – Low byte, 1 – High byte o = data out i = data in x = don’t care Table 98. Serial Programming Instruction Set Instruction Instruction Format Byte 1 Byte 2 Byte 3 Byte 4 Operation Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after RESET goes low Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash Read Program Memory 0010 H000 0000 aaaa bbbb bbbb oooo oooo Read H (high or low) data o from Program memory at word address a:b Load Program Memory Page 0100 H000 0000 xxxx xxxb bbbb iiii iiii Write H (high or low) data i to Program memory page at word address b. Data Low byte must be loaded before Data High byte is applied within the same address Write Program Memory Page 0100 1100 0000 aaaa bbbx xxxx xxxx xxxx Write Program memory Page at address a:b Read EEPROM Memory 1010 0000 00xx xxxa bbbb bbbb oooo oooo Read data o from EEPROM memory at address a:b Write EEPROM Memory 1100 0000 00xx xxxa bbbb bbbb iiii iiii Write data i to EEPROM memory at address a:b Read Lock Bits 0101 1000 0000 0000 xxxx xxxx xxoo oooo Read Lock Bits. “0” = programmed, “1” = unprogrammed. See Table 85 on page 215 for details Write Lock Bits 1010 1100 111x xxxx xxxx xxxx 11ii iiii Write Lock Bits. Set bits = “0” to program Lock Bits. See Table 85 on page 215 for details Read Signature Byte 0011 0000 00xx xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b Write Fuse Bits 1010 1100 1010 0000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. See Table 88 on page 217 for details Write Fuse High Bits 1010 1100 1010 1000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. See Table 87 on page 216 for details Read Fuse Bits 0101 0000 0000 0000 xxxx xxxx oooo oooo Read Fuse Bits. “0” = programmed, “1” = unprogrammed. See Table 88 on page 217 for details Read Fuse High Bits 0101 1000 0000 1000 xxxx xxxx oooo oooo Read Fuse high bits. “0” = programmed, “1” = unprogrammed. See Table 87 on page 216 for details Read Calibration Byte 0011 1000 00xx xxxx 0000 00bb oooo oooo Read Calibration Byte234 2486AA–AVR–02/2013 ATmega8(L) SPI Serial Programming Characteristics For characteristics of the SPI module, see “SPI Timing Characteristics” on page 239.235 2486AA–AVR–02/2013 ATmega8(L) Electrical Characteristics – TA = -40°C to 85°C Note: Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. DC Characteristics Absolute Maximum Ratings* Operating Temperature.................................. -55C to +125C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ................................................ 40.0mA DC Current VCC and GND Pins................................. 300.0mA TA = -40C to +85C, VCC = 2.7V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage except XTAL1 and RESET pins VCC = 2.7V - 5.5V -0.5 0.2 VCC(1) V VIH Input High Voltage except XTAL1 and RESET pins VCC = 2.7V - 5.5V 0.6VCC(2) VCC + 0.5 VIL1 Input Low Voltage XTAL1 pin VCC = 2.7V - 5.5V -0.5 0.1VCC(1) VIH1 Input High Voltage XTAL 1 pin VCC = 2.7V - 5.5V 0.8VCC(2) VCC + 0.5 VIL2 Input Low Voltage RESET pin VCC = 2.7V - 5.5V -0.5 0.2 VCC VIH2 Input High Voltage RESET pin VCC = 2.7V - 5.5V 0.9VCC(2) VCC + 0.5 VIL3 Input Low Voltage RESET pin as I/O VCC = 2.7V - 5.5V -0.5 0.2VCC VIH3 Input High Voltage RESET pin as I/O VCC = 2.7V - 5.5V 0.6VCC(2) 0.7VCC(2) VCC + 0.5 VOL Output Low Voltage(3) (Ports B,C,D) I OL = 20mA, VCC = 5V IOL = 10mA, VCC = 3V 0.9 0.6 VOH Output High Voltage(4) (Ports B,C,D) I OH = -20mA, VCC = 5V IOH = -10mA, VCC = 3V 4.2 2.2 IIL Input Leakage Current I/O Pin Vcc = 5.5V, pin low (absolute value) 1 µA I IH Input Leakage Current I/O Pin Vcc = 5.5V, pin high (absolute value) 1 RRST Reset Pull-up Resistor 30 80 k236 2486AA–AVR–02/2013 ATmega8(L) Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low 2. “Min” means the lowest value where the pin is guaranteed to be read as high 3. Although each I/O port can sink more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP, TQFP, and QFN/MLF Package: 1] The sum of all IOL, for all ports, should not exceed 300mA. 2] The sum of all IOL, for ports C0 - C5 should not exceed 100mA. 3] The sum of all IOL, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition 4. Although each I/O port can source more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP, TQFP, and QFN/MLF Package: 1] The sum of all IOH, for all ports, should not exceed 300mA. 2] The sum of all IOH, for port C0 - C5, should not exceed 100mA. 3] The sum of all IOH, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 200mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition 5. Minimum VCC for Power-down is 2.5V Rpu I/O Pin Pull-up Resistor 20 50 k ICC Power Supply Current Active 4MHz, VCC = 3V (ATmega8L) 3 5 mA Active 8MHz, VCC = 5V (ATmega8) 11 15 Idle 4MHz, VCC = 3V (ATmega8L) 1 2 Idle 8MHz, VCC = 5V (ATmega8) 4.5 7 Power-down mode(5) WDT enabled, VCC = 3V < 22 28 µA WDT disabled, VCC = 3V < 1 3 VACIO Analog Comparator Input Offset Voltage VCC = 5V Vin = VCC/2 40 mV IACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nA tACPD Analog Comparator Propagation Delay VCC = 2.7V VCC = 5.0V 750 500 ns TA = -40C to +85C, VCC = 2.7V to 5.5V (unless otherwise noted) (Continued) Symbol Parameter Condition Min Typ Max Units237 2486AA–AVR–02/2013 ATmega8(L) External Clock Drive Waveforms Figure 114. External Clock Drive Waveforms External Clock Drive Notes: 1. R should be in the range 3k - 100k, and C should be at least 20pF. The C values given in the table includes pin capacitance. This will vary with package type 2. The frequency will vary with package type and board layout VIL1 VIH1 Table 99. External Clock Drive Symbol Parameter VCC = 2.7V to 5.5V VCC = 4.5V to 5.5V Min Max Min Max Units 1/tCLCL Oscillator Frequency 0 8 0 16 MHz tCLCL Clock Period 125 62.5 tCHCX High Time 50 25 ns tCLCX Low Time 50 25 tCLCH Rise Time 1.6 0.5 s tCHCL Fall Time 1.6 0.5 tCLCL Change in period from one clock cycle to the next 2 2% Table 100. External RC Oscillator, Typical Frequencies R [k] (1) C [pF] f(2) 33 22 650kHz 10 22 2.0MHz238 2486AA–AVR–02/2013 ATmega8(L) Two-wire Serial Interface Characteristics Table 101 describes the requirements for devices connected to the Two-wire Serial Bus. The ATmega8 Two-wire Serial Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 115 on page 239. Notes: 1. In ATmega8, this parameter is characterized and not 100% tested 2. Required only for fSCL > 100kHz 3. Cb = capacitance of one bus line in pF 4. fCK = CPU clock frequency Table 101. Two-wire Serial Bus Requirements Symbol Parameter Condition Min Max Units VIL Input Low-voltage -0.5 0.3VCC V VIH Input High-voltage 0.7VCC VCC + 0.5 Vhys(1) Hysteresis of Schmitt Trigger Inputs 0.05VCC(2) – VOL(1) Output Low-voltage 3mA sink Current 0 0.4 tr (1) Rise Time for both SDA and SCL 20 + 0.1Cb (3)(2) 300 tof ns (1) Output Fall Time from VIHmin to VILmax 10pF < Cb < 400pF(3) 20 + 0.1Cb (3)(2) 250 tSP(1) Spikes Suppressed by Input Filter 0 50(2) Ii Input Current each I/O Pin 0.1VCC < Vi < 0.9VCC -10 10 µA Ci (1) Capacitance for each I/O Pin – 10 pF fSCL SCL Clock Frequency fCK(4) > max(16fSCL, 250kHz)(5) 0 400 kHz Rp Value of Pull-up resistor fSCL  100kHz fSCL > 100kHz tHD;STA Hold Time (repeated) START Condition fSCL  100kHz 4.0 – µs fSCL > 100kHz 0.6 – tLOW Low Period of the SCL Clock fSCL  100kHz(6) 4.7 – fSCL > 100kHz(7) 1.3 – tHIGH High period of the SCL clock fSCL  100kHz 4.0 – fSCL > 100kHz 0.6 – tSU;STA Set-up time for a repeated START condition fSCL  100kHz 4.7 – fSCL > 100kHz 0.6 – tHD;DAT Data hold time fSCL  100kHz 0 3.45 fSCL > 100kHz 0 0.9 tSU;DAT Data setup time fSCL  100kHz 250 – ns fSCL > 100kHz 100 – tSU;STO Setup time for STOP condition fSCL  100kHz 4.0 – µs fSCL > 100kHz 0.6 – tBUF Bus free time between a STOP and START condition fSCL  100kHz 4.7 – fSCL > 100kHz 1.3 – VCC – 0.4V 3mA ---------------------------- 1000ns Cb -------------------  VCC – 0.4V 3mA ---------------------------- 300ns Cb ----------------239 2486AA–AVR–02/2013 ATmega8(L) 5. This requirement applies to all ATmega8 Two-wire Serial Interface operation. Other devices connected to the Two-wire Serial Bus need only obey the general fSCL requirement 6. The actual low period generated by the ATmega8 Two-wire Serial Interface is (1/fSCL - 2/fCK), thus fCK must be greater than 6MHz for the low time requirement to be strictly met at fSCL = 100kHz 7. The actual low period generated by the ATmega8 Two-wire Serial Interface is (1/fSCL - 2/fCK), thus the low time requirement will not be strictly met for fSCL > 308kHz when fCK = 8MHz. Still, ATmega8 devices connected to the bus may communicate at full speed (400kHz) with other ATmega8 devices, as well as any other device with a proper tLOW acceptance margin Figure 115. Two-wire Serial Bus Timing SPI Timing Characteristics See Figure 116 on page 240 and Figure 117 on page 240 for details. Note: 1. In SPI Programming mode the minimum SCK high/low period is: - 2tCLCL for fCK < 12MHz - 3tCLCL for fCK > 12MHz t SU;STA t LOW t HIGH t LOW t of t HD;STA t HD;DAT t SU;DAT t SU;STO t BUF SCL SDA t r Table 102. SPI Timing Parameters Description Mode Min Typ Max 1 SCK period Master See Table 50 on page 126 ns 2 SCK high/low Master 50% duty cycle 3 Rise/Fall time Master 3.6 4 Setup Master 10 5 Hold Master 10 6 Out to SCK Master 0.5 • tSCK 7 SCK to out Master 10 8 SCK to out high Master 10 9 SS low to out Slave 15 10 SCK period Slave 4 • tck 11 SCK high/low(1) Slave 2 • tck 12 Rise/Fall time Slave 1600 13 Setup Slave 10 14 Hold Slave 10 15 SCK to out Slave 15 16 SCK to SS high Slave 20 17 SS high to tri-state Slave 10 18 SS low to SCK Salve 2 • tck240 2486AA–AVR–02/2013 ATmega8(L) Figure 116. SPI interface timing requirements (Master Mode) Figure 117. SPI interface timing requirements (Slave Mode) MOSI (Data Output) SCK (CPOL = 1) MISO (Data Input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 6 1 2 2 4 5 3 7 8 MISO (Data Output) SCK (CPOL = 1) MOSI (Data Input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 10 11 11 13 14 12 15 17 9 X 16 18241 2486AA–AVR–02/2013 ATmega8(L) ADC Characteristics Notes: 1. Values are guidelines only 2. Minimum for AVCC is 2.7V 3. Maximum for AVCC is 5.5V 4. Maximum conversion time is 1/50kHz × 25 = 0.5ms Table 103. ADC Characteristics Symbol Parameter Condition Min(1) Typ(1) Max(1) Units Resolution Single Ended Conversion 10 Bits Absolute accuracy (including INL, DNL, Quantization Error, Gain, and Offset Error) Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 1.75 LSB Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 1MHz 3 Integral Non-linearity (INL) Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 0.75 Differential Non-linearity (DNL) Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 0.5 Gain Error Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 1 Offset Error Single Ended Conversion VREF = 4V, VCC = 4V ADC clock = 200kHz 1 Conversion Time(4) Free Running Conversion 13 260 µs Clock Frequency 50 1000 kHz AVCC Analog Supply Voltage VCC - 0.3(2) VCC + 0.3(3) V VREF Reference Voltage 2.0 AVCC VIN Input voltage GND VREF Input bandwidth 38.5 kHz VINT Internal Voltage Reference 2.3 2.56 2.9 V RREF Reference Input Resistance 32 k RAIN Analog Input Resistance 55 100 M242 2486AA–AVR–02/2013 ATmega8(L) Electrical Characteristics – TA = -40°C to 105°C Note: Typical values contained in this data sheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. Absolute Maximum Ratings* Operating Temperature.................................. -55C to +125C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ............................................... 40.0 mA DC Current VCC and GND Pins................................ 200.0 mA DC Characteristics TA = -40C to 105C, VCC = 2.7V to 5.5V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage Except XTAL1 pin -0.5 0.2 VCC(1) V VIL1 Input Low Voltage XTAL1 pin, External Clock Selected -0.5 0.1 VCC(1) V VIH Input High Voltage Except XTAL1 and RESET pins 0.6 VCC(2) VCC + 0.5 V VIH1 Input High Voltage XTAL1 pin, External Clock Selected 0.8 VCC(2) VCC + 0.5 V VIH2 Input High Voltage RESET pin 0.9 VCC(2) VCC + 0.5 V VOL Output Low Voltage(3) (Ports A,B,C,D) I OL = 20 mA, VCC = 5V IOL = 10 mA, VCC = 3V 0.8 0.6 V V VOH Output High Voltage(4) (Ports A,B,C,D) IOH = -20 mA, VCC = 5V IOH = -10 mA, VCC = 3V 4.0 2.2 V V IIL Input Leakage Current I/O Pin Vcc = 5.5V, pin low (absolute value) 3 µA IIH Input Leakage Current I/O Pin Vcc = 5.5V, pin high (absolute value) 3 µA RRST Reset Pull-up Resistor 30 80 k Rpu I/O Pin Pull-up Resistor 20 50 k243 2486AA–AVR–02/2013 ATmega8(L) Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low 2. “Min” means the lowest value where the pin is guaranteed to be read as high 3. Although each I/O port can sink more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP Package: 1] The sum of all IOL, for all ports, should not exceed 400 mA. 2] The sum of all IOL, for ports C0 - C5 should not exceed 200 mA. 3] The sum of all IOL, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 100 mA. TQFP and MLF Package: 1] The sum of all IOL, for all ports, should not exceed 400 mA. 2] The sum of all IOL, for ports C0 - C5, should not exceed 200 mA. 3] The sum of all IOL, for ports C6, D0 - D4, should not exceed 300 mA. 4] The sum of all IOL, for ports B0 - B7, D5 - D7, should not exceed 300 mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20mA at Vcc = 5V, 10mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed: PDIP Package: 1] The sum of all IOH, for all ports, should not exceed 400 mA. 2] The sum of all IOH, for port C0 - C5, should not exceed 100 mA. 3] The sum of all IOH, for ports B0 - B7, C6, D0 - D7 and XTAL2, should not exceed 100 mA. TQFP and MLF Package: 1] The sum of all IOH, for all ports, should not exceed 400 mA. 2] The sum of all IOH, for ports C0 - C5, should not exceed 200 mA. 3] The sum of all IOH, for ports C6, D0 - D4, should not exceed 300 mA. 4] The sum of all IOH, for ports B0 - B7, D5 - D7, should not exceed 300 mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 5. Minimum VCC for Power-down is 2.5V. I CC Power Supply Current Active 4 MHz, VCC = 3V (ATmega8L) 6 mA Active 8 MHz, VCC = 5V (ATmega8) 15 mA Idle 4 MHz, VCC = 3V (ATmega8L) 3 mA Idle 8 MHz, VCC = 5V (ATmega8) 8 mA Power-down mode(5) WDT enabled, VCC = 3V 35 µA WDT disabled, VCC = 3V 6 µA VACIO Analog Comparator Input Offset Voltage VCC = 5V Vin = VCC/2 20 mV IACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nA tACPD Analog Comparator Propagation Delay VCC = 2.7V VCC = 5.0V 750 500 ns DC Characteristics TA = -40C to 105C, VCC = 2.7V to 5.5V (unless otherwise noted) (Continued) Symbol Parameter Condition Min Typ Max Units244 2486AA–AVR–02/2013 ATmega8(L) ATmega8 Typical Characteristics – TA = -40°C to 85°C The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with Rail-to-Rail output is used as clock source. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as: CL × VCC × f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. Active Supply Current Figure 118. Active Supply Current vs. Frequency (0.1MHz - 1.0MHz) 0 0.5 1 1.5 2 2.5 3 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) 5.5V 5.0V 4.5V 3.3V 3.0V 2.7V 4.0V245 2486AA–AVR–02/2013 ATmega8(L) Figure 119. Active Supply Current vs. Frequency (1MHz - 20MHz) Figure 120. Active Supply Current vs. VCC (Internal RC Oscillator, 8MHz) 0 5 10 15 20 25 30 0246 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5V 5.0V 4.5V 3.3V 2.7V 3.0V 0 2 4 6 8 10 12 14 16 18 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C246 2486AA–AVR–02/2013 ATmega8(L) Figure 121. Active Supply Current vs. VCC (Internal RC Oscillator, 4MHz) Figure 122. Active Supply Current vs. VCC (Internal RC Oscillator, 2MHz) 0 2 4 6 8 10 12 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 1 2 3 4 5 6 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C247 2486AA–AVR–02/2013 ATmega8(L) Figure 123. Active Supply Current vs. VCC (Internal RC Oscillator, 1MHz) Figure 124. Active Supply Current vs. VCC (32kHz External Oscillator) 0 0.5 1 1.5 2 2.5 3 3.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 25°C 85°C -40°C 0 20 40 60 80 100 120 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C248 2486AA–AVR–02/2013 ATmega8(L) Idle Supply Current Figure 125. Idle Supply Current vs. Frequency (0.1MHz - 1.0MHz) Figure 126. Idle Supply Current vs. Frequency (1MHz - 20MHz) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) 5.5V 4.5V 4.0V 3.3V 3.0V 2.7V 5.0V 0 2 4 6 8 10 12 14 0246 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5V 4.5V 4.0V 3.3V 3.0V 2.7V 5.0V249 2486AA–AVR–02/2013 ATmega8(L) Figure 127. Idle Supply Current vs. VCC (Internal RC Oscillator, 8MHz) Figure 128. Idle Supply Current vs. VCC (Internal RC Oscillator, 4MHz) 0 1 2 3 4 5 6 7 8 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C250 2486AA–AVR–02/2013 ATmega8(L) Figure 129. Idle Supply Current vs. VCC (Internal RC Oscillator, 2MHz) Figure 130. Idle Supply Current vs. VCC (Internal RC Oscillator, 1MHz) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C251 2486AA–AVR–02/2013 ATmega8(L) Figure 131. Idle Supply Current vs. VCC (32kHz External Oscillator) Power-down Supply Current Figure 132. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) 0 5 10 15 20 25 30 35 40 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C252 2486AA–AVR–02/2013 ATmega8(L) Figure 133. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) Power-save Supply Current Figure 134. Power-save Supply Current vs. VCC (Watchdog Timer Disabled) 0 10 20 30 40 50 60 70 80 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 5 10 15 20 25 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C253 2486AA–AVR–02/2013 ATmega8(L) Standby Supply Current Figure 135. Standby Supply Current vs. VCC (455kHz Resonator, Watchdog Timer Disabled) Figure 136. Standby Supply Current vs. VCC (1MHz Resonator, Watchdog Timer Disabled) 0 10 20 30 40 50 60 70 80 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 0 10 20 30 40 50 60 70 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)254 2486AA–AVR–02/2013 ATmega8(L) Figure 137. Standby Supply Current vs. VCC (2MHz Resonator, Watchdog Timer Disabled) Figure 138. Standby Supply Current vs. VCC (2MHz Xtal, Watchdog Timer Disabled) 0 10 20 30 40 50 60 70 80 90 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 0 10 20 30 40 50 60 70 80 90 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)255 2486AA–AVR–02/2013 ATmega8(L) Figure 139. Standby Supply Current vs. VCC (4MHz Resonator, Watchdog Timer Disabled) Figure 140. Standby Supply Current vs. VCC (4MHz Xtal, Watchdog Timer Disabled) 0 20 40 60 80 100 120 140 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 0 20 40 60 80 100 120 140 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)256 2486AA–AVR–02/2013 ATmega8(L) Figure 141. Standby Supply Current vs. VCC (6MHz Resonator, Watchdog Timer Disabled) Figure 142. Standby Supply Current vs. VCC (6MHz Xtal, Watchdog Timer Disabled) 0 20 40 60 80 100 120 140 160 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 0 20 40 60 80 100 120 140 160 180 200 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)257 2486AA–AVR–02/2013 ATmega8(L) Pin Pull-up Figure 143. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V) Figure 144. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V) 0 20 40 60 80 100 120 140 160 012 3 4 56 VOP (V) IIO (µA) 85°C 25°C -40°C 0 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 3 VOP (V) IIO (µA) 85°C 25°C -40°C258 2486AA–AVR–02/2013 ATmega8(L) Figure 145. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) Figure 146. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) 0 20 40 60 80 100 012 VRESET (V) IRESET (µA) 85°C 25°C - 40°C 0 5 10 15 20 25 30 35 40 45 0 0.5 1 1.5 2 2.5 VRESET (V) IRESET (µA) 85°C 25°C -40°C259 2486AA–AVR–02/2013 ATmega8(L) Pin Driver Strength Figure 147. I/O Pin Source Current vs. Output Voltage (VCC = 5V) Figure 148. I/O Pin Source Current vs. Output Voltage (VCC = 2.7V) 0 10 20 30 40 50 60 70 80 VOH (V) IOH (mA) 85°C 25°C -40°C 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 VOH (V) IOH (mA) 85°C 25°C -40°C260 2486AA–AVR–02/2013 ATmega8(L) Figure 149. I/O Pin Sink Current vs. Output Voltage (VCC = 5V) Figure 150. I/O Pin Sink Current vs. Output Voltage (VCC = 2.7V) 0 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 VOL (V) IOL (mA) 85°C 25°C -40°C 0 5 10 15 20 25 30 35 0 0.5 1 1.5 2 2.5 VOL (V) IOL (mA) 85°C 25°C -40°C261 2486AA–AVR–02/2013 ATmega8(L) Figure 151. Reset Pin as I/O – Pin Source Current vs. Output Voltage (VCC = 5V) Figure 152. Reset Pin as I/O – Pin Source Current vs. Output Voltage (VCC = 2.7V) 0 0.5 1 1.5 2 2.5 3 3.5 4 2 2.5 3 3.5 4 4.5 VOH (V) Current (mA) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 VOH (V) Current (mA) 85°C 25°C -40°C262 2486AA–AVR–02/2013 ATmega8(L) Figure 153. Reset Pin as I/O – Pin Sink Current vs. Output Voltage (VCC = 5V) Figure 154. Reset Pin as I/O – Pin Sink Current vs. Output Voltage (VCC = 2.7V) 0 2 4 6 8 10 12 14 0 0.5 1 1.5 2 2.5 VOL (V) Current (mA) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 0 0.5 1 1.5 2 2.5 VOL (V) Current (mA) 85°C 25°C -40°C263 2486AA–AVR–02/2013 ATmega8(L) Pin Thresholds and Hysteresis Figure 155. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”) Figure 156. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”) 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C264 2486AA–AVR–02/2013 ATmega8(L) Figure 157. I/O Pin Input Hysteresis vs. VCC Figure 158. Reset Pin as I/O – Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C265 2486AA–AVR–02/2013 ATmega8(L) Figure 159. Reset Pin as I/O – Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”) Figure 160. Reset Pin as I/O – Pin Hysteresis vs. VCC 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (V) 85°C 25°C -40°C266 2486AA–AVR–02/2013 ATmega8(L) Figure 161. Reset Input Threshold Voltage vs. VCC (VIH, Reset Pin Read as “1”) Figure 162. Reset Input Threshold Voltage vs. VCC (VIL, Reset Pin Read as “0”) 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C267 2486AA–AVR–02/2013 ATmega8(L) Figure 163. Reset Input Pin Hysteresis vs. VCC Bod Thresholds and Analog Comparator Offset Figure 164. BOD Thresholds vs. Temperature (BOD Level is 4.0V) 0 0.2 0.4 0.6 0.8 1 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input Hysteresis (V) 85°C 25°C -40°C 3.7 3.8 3.9 4 4.1 4.2 4.3 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) Threshold (V) Rising VCC Falling VCC268 2486AA–AVR–02/2013 ATmega8(L) Figure 165. BOD Thresholds vs. Temperature (BOD Level is 2.7V) Figure 166. Bandgap Voltage vs. VCC 2.4 2.5 2.6 2.7 2.8 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) Threshold (V) Rising VCC Falling VCC 1.29 1.295 1.3 1.305 1.31 1.315 2.5 3 3.5 4 4.5 5 5.5 Vcc (V) Bandgap Voltage (V) -40°C 25°C 85°C269 2486AA–AVR–02/2013 ATmega8(L) Figure 167. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 5V) Figure 168. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 2.7V) -0.006 -0.005 -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Common Mode Voltage (V) Comparator Offset Voltage (V) 85°C 25°C -40°C -0.005 -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0 0.5 1 1.5 2 2.5 3 Common Mode Voltage (V) Comparator Offset Voltage (V) 85°C 25°C -40°C270 2486AA–AVR–02/2013 ATmega8(L) Internal Oscillator Speed Figure 169. Watchdog Oscillator Frequency vs. VCC Figure 170. Calibrated 8MHz RC Oscillator Frequency vs. Temperature 1100 1120 1140 1160 1180 1200 1220 1240 1260 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (kHz) 85°C 25°C -40°C 6.5 6.7 6.9 7.1 7.3 7.5 7.7 7.9 8.1 8.3 8.5 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (MHz) 5.5V 2.7V 4.0V271 2486AA–AVR–02/2013 ATmega8(L) Figure 171. Calibrated 8MHz RC Oscillator Frequency vs. VCC Figure 172. Calibrated 8MHz RC Oscillator Frequency vs. Osccal Value 6.5 6.7 6.9 7.1 7.3 7.5 7.7 7.9 8.1 8.3 8.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C 4 6 8 10 12 14 16 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL VALUE FRC (MHz)272 2486AA–AVR–02/2013 ATmega8(L) Figure 173. Calibrated 4MHz RC Oscillator Frequency vs. Temperature Figure 174. Calibrated 4MHz RC Oscillator Frequency vs. VCC 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (MHz) 5.5V 2.7V 4.0V 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C273 2486AA–AVR–02/2013 ATmega8(L) Figure 175. Calibrated 4MHz RC Oscillator Frequency vs. Osccal Value Figure 176. Calibrated 2MHz RC Oscillator Frequency vs. Temperature 2 3 4 5 6 7 8 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL VALUE FRC (MHz) 1.8 1.85 1.9 1.95 2 2.05 2.1 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (MHz) 5.5V 2.7V 4.0V274 2486AA–AVR–02/2013 ATmega8(L) Figure 177. Calibrated 2MHz RC Oscillator Frequency vs. VCC Figure 178. Calibrated 2MHz RC Oscillator Frequency vs. Osccal Value 1.7 1.8 1.9 2 2.1 2.2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C 0.8 1.3 1.8 2.3 2.8 3.3 3.8 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL VALUE FRC (MHz)275 2486AA–AVR–02/2013 ATmega8(L) Figure 179. Calibrated 1MHz RC Oscillator Frequency vs. Temperature Figure 180. Calibrated 1MHz RC Oscillator Frequency vs. VCC 0.9 0.92 0.94 0.96 0.98 1 1.02 1.04 -60 -40 -20 0 20 40 60 80 100 Temperature (°C) FRC (MHz) 5.5V 2.7V 4.0V 0.9 0.95 1 1.05 1.1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C276 2486AA–AVR–02/2013 ATmega8(L) Figure 181. Calibrated 1MHz RC Oscillator Frequency vs. Osccal Value Current Consumption of Peripheral Units Figure 182. Brown-out Detector Current vs. VCC 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL VALUE FRC (MHz) 0 5 10 15 20 25 30 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C 85°C -40°C277 2486AA–AVR–02/2013 ATmega8(L) Figure 183. ADC Current vs. VCC (AREF = AVCC) Figure 184. AREF External Reference Current vs. VCC 0 50 100 150 200 250 300 350 400 450 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 50 100 150 200 250 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C278 2486AA–AVR–02/2013 ATmega8(L) Figure 185. 32kHz TOSC Current vs. VCC (Watchdog Timer Disabled) Figure 186. Watchdog Timer Current vs. VCC 0 5 10 15 20 25 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C 0 10 20 30 40 50 60 70 80 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C279 2486AA–AVR–02/2013 ATmega8(L) Figure 187. Analog Comparator Current vs. VCC Figure 188. Programming Current vs. VCC 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 25°C 85°C -40°C 0 1 2 3 4 5 6 7 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 25°C 85°C -40°C280 2486AA–AVR–02/2013 ATmega8(L) Current Consumption in Reset and Reset Pulsewidth Figure 189. Reset Supply Current vs. VCC (0.1MHz - 1.0MHz, Excluding Current Through The Reset Pull-up) Figure 190. Reset Supply Current vs. VCC (1MHz - 20MHz, Excluding Current Through The Reset Pull-up) 0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) 5.5V 5.0V 4.5V 3.3V 3.0V 2.7V 4.0V 0 5 10 15 20 25 0246 8 10 12 14 16 18 20 Frequency (MHz) ICC (mA) 5.5V 5.0V 4.5V 3.3V 3.0V 2.7V281 2486AA–AVR–02/2013 ATmega8(L) Figure 191. Reset Pulse Width vs. VCC 0 200 400 600 800 1000 1200 1400 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Pulsewidth (ns) 85°C 25°C -40°C282 2486AA–AVR–02/2013 ATmega8(L) ATmega8 Typical Characteristics – TA = -40°C to 105°C The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with Rail-to-Rail output is used as clock source. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. Active Supply Current Figure 0-1. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 8 MHz 0 2 4 6 8 10 12 14 16 18 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C283 2486AA–AVR–02/2013 ATmega8(L) Figure 0-2. Active Supply Current vs. VCC (Internal RC Oscillator, 4 MHz) Figure 0-3. Active Supply Current vs. VCC (Internal RC Oscillator, 2 MHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 4 MHz 0 2 4 6 8 10 12 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 2 MHz 0 1 2 3 4 5 6 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C284 2486AA–AVR–02/2013 ATmega8(L) Figure 0-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) Idle Supply Current Figure 0-5. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 1 MHz 0 0.5 1 1.5 2 2.5 3 3.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 8 MHz 0 1 2 3 4 5 6 7 8 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C285 2486AA–AVR–02/2013 ATmega8(L) Figure 0-6. Idle Supply Current vs. VCC (Internal RC Oscillator, 4 MHz) Figure 0-7. Idle Supply Current vs. VCC (Internal RC Oscillator, 2 MHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 4 MHz 0 0.5 1 1.5 2 2.5 3 3.5 4 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 2 MHz 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C286 2486AA–AVR–02/2013 ATmega8(L) Figure 0-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) Power-down Supply Current Figure 0-9. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 1 MHz 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 105°C POWER-DOWN SUPPLY CURRENT vs. VCC WATCHDOG TIMER DISABLED 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 105°C 25°C -40°C 85°C287 2486AA–AVR–02/2013 ATmega8(L) Figure 0-10. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) Pin Pull-up Figure 0-11. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V) POWER-DOWN SUPPLY CURRENT vs. VCC WATCHDOG TIMER ENABLED 0 10 20 30 40 50 60 70 80 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85°C 25°C -40°C 105°C I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE Vcc = 5V 0 20 40 60 80 100 120 140 160 0123 VOP (V) IOP (uA) 85°C 25°C -40°C 105°C288 2486AA–AVR–02/2013 ATmega8(L) Figure 0-12. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V) Figure 0-13. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE Vcc = 2.7V 0 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 3 VOP (V) IOP (uA) 85°C 25°C -40°C 105°C RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE Vcc = 5V 0 20 40 60 80 100 012 VRESET (V) IRESET (uA) 85°C 25°C 105°C -40°C289 2486AA–AVR–02/2013 ATmega8(L) Figure 0-14. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) Pin Driver Strength Figure 0-15. I/O Pin Source Current vs. Output Voltage (VCC = 5V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE Vcc = 2.7V 0 5 10 15 20 25 30 35 40 45 0 0.5 1 1.5 2 2.5 VRESET (V) IRESET (uA) 85°C 25°C -40°C 105°C I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE Vcc = 5V 0 10 20 30 40 50 60 70 80 01234 VOH (V) IOH (mA) 85°C 25°C -40°C 105°C290 2486AA–AVR–02/2013 ATmega8(L) Figure 0-16. I/O Pin Source Current vs. Output Voltage (VCC = 2.7V) Figure 0-17. I/O Pin Sink Current vs. Output Voltage (VCC = 5V) I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE Vcc = 2.7V 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 VOH (V) IOH (mA) 85°C 25°C -40°C 105°C I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE Vcc = 5V 0 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 VOL (V) IOL (mA) 85°C 25°C -40°C 105°C291 2486AA–AVR–02/2013 ATmega8(L) Figure 0-18. I/O Pin Sink Current vs. Output Voltage (VCC = 2.7V) Figure 0-19. Reset Pin as I/O – Pin Source Current vs. Output Voltage (VCC = 5V) I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE Vcc = 2.7V 0 5 10 15 20 25 30 35 0 0.5 1 1.5 2 2.5 VOL (V) IOL (mA) 85°C 25°C -40°C 105°C RESET PIN AS I/O - SOURCE CURRENT vs. OUTPUT VOLTAGE Vcc = 5V 0 0.5 1 1.5 2 2.5 3 3.5 4 2 2.5 3 3.5 4 4.5 VOH (V) Current (mA) 85°C 25°C -40°C 105°C292 2486AA–AVR–02/2013 ATmega8(L) Figure 0-20. Reset Pin as I/O – Pin Source Current vs. Output Voltage (VCC = 2.7V) Figure 0-21. Reset Pin as I/O – Pin Sink Current vs. Output Voltage (VCC = 5V) RESET PIN AS I/O - SOURCE CURRENT vs. OUTPUT VOLTAGE Vcc = 2.7V 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 VOH (V) Current (mA) 85°C 25°C -40°C 105 °C RESET PIN AS I/O - SINK CURRENT vs. OUTPUT VOLTAGE Vcc = 5V 0 2 4 6 8 10 12 14 0 0.5 1 1.5 2 2.5 VOL (V) Current (mA) 85°C 25°C -40°C 105°C293 2486AA–AVR–02/2013 ATmega8(L) Figure 0-22. Reset Pin as I/O – Pin Sink Current vs. Output Voltage (VCC = 2.7V) Pin Thresholds and Hysteresis Figure 0-23. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”) RESET PIN AS I/O - SINK CURRENT vs. OUTPUT VOLTAGE Vcc = 2.7V 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 0 0.5 1 1.5 2 2.5 VOL (V) Current (mA) 85°C 25°C -40°C 105°C I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC VIH, IO PIN READ AS '1' 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 105°C -40°C 25°C294 2486AA–AVR–02/2013 ATmega8(L) Figure 0-24. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”) Figure 0-25. I/O Pin Input Hysteresis vs. VCC I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC VIL, IO PIN READ AS '0' 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C I/O PIN INPUT HYSTERESIS vs. VCC 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C295 2486AA–AVR–02/2013 ATmega8(L) Figure 0-26. Reset Pin as I/O – Input Threshold Voltage vs. VCC (VIH,I/O Pin Read as “1”) Figure 0-27. Reset Pin as I/O – Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”) RESET PIN AS I/O - INPUT THRESHOLD VOLTAGE vs. VCC VIH, RESET PIN READ AS '1' 0 0.5 1 1.5 2 2.5 3 3.5 4 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C RESET PIN AS I/O - INPUT THRESHOLD VOLTAGE vs. VCC VIL, RESET PIN READ AS '0' 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C296 2486AA–AVR–02/2013 ATmega8(L) Figure 0-28. Reset Pin as I/O – Pin Hysteresis vs. VCC Figure 0-29. Reset Input Threshold Voltage vs. VCC (VIH, Reset Pin Read as “1”) RESET PIN AS I/O - PIN HYSTERESIS vs. VCC 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C RESET INPUT THRESHOLD VOLTAGE vs. VCC VIH, RESET PIN READ AS '1' 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C297 2486AA–AVR–02/2013 ATmega8(L) Figure 0-30. Reset Input Threshold Voltage vs. VCC (VIL, Reset Pin Read as “0”) Figure 0-31. Reset Input Pin Hysteresis vs. VCC RESET INPUT THRESHOLD VOLTAGE vs. VCC VIL, RESET PIN READ AS '0' 0 0.5 1 1.5 2 2.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C RESET INPUT PIN HYSTERESIS vs. VCC 0 0.2 0.4 0.6 0.8 1 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 105°C298 2486AA–AVR–02/2013 ATmega8(L) Bod Thresholds and Analog Comparator Offset Figure 0-32. BOD Thresholds vs. Temperature (BOD Level is 4.0V) Figure 0-33. BOD Thresholds vs. Temperature (BOD Level is 2.7V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL IS 4.0V 3.8 3.9 4 4.1 4.2 4.3 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature (˚C) Threshold (V) Rising VCC Falling VCC BOD THRESHOLDS vs. TEMPERATURE BODLEVEL IS 2.7V 2.4 2.5 2.6 2.7 2.8 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature (˚C) Threshold (V) Rising VCC Falling VCC299 2486AA–AVR–02/2013 ATmega8(L) Figure 0-34. Bandgap Voltage vs. VCC Figure 0-35. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 5V) BANDGAP VOLTAGE vs. VCC 1.29 1.295 1.3 1.305 1.31 1.315 2.5 3 3.5 4 4.5 5 5.5 Vcc (V) Bandgap Voltage (V) 85°C 25°C -40°C 105°C ANALOG COMPARATOR OFFSET VOLTAGE vs. COMMON MODE VOLTAGE VCC = 5V -0.006 -0.005 -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Common Mode Voltage (V) Comparator Offset Voltage (V) 85°C 25°C -40°C 105°C300 2486AA–AVR–02/2013 ATmega8(L) Figure 0-36. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 2.7V) Internal Oscillator Speed Figure 0-37. Watchdog Oscillator Frequency vs. VCC ANALOG COMPARATOR OFFSET VOLTAGE vs. COMMON MODE VOLTAGE VCC = 2.7V -0.005 -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0 0.5 1 1.5 2 2.5 3 Common Mode Voltage (V) Comparator Offset Voltage (V) 85°C 25°C -40°C 105°C WATCHDOG OSCILLATOR FREQUENCY vs. VCC 1080 1100 1120 1140 1160 1180 1200 1220 1240 1260 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (kHz) 85°C 25°C -40°C 105°C301 2486AA–AVR–02/2013 ATmega8(L) Figure 0-38. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature Figure 0-39. Calibrated 8 MHz RC Oscillator Frequency vs. VCC CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 6.5 6.7 6.9 7.1 7.3 7.5 7.7 7.9 8.1 8.3 8.5 -60 -40 -20 0 20 40 60 80 100 120 Temperature (˚C) FRC (MHz) 5.5V 2.7V 4.0V CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. VCC 6.5 6.7 6.9 7.1 7.3 7.5 7.7 7.9 8.1 8.3 8.5 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C 105°C302 2486AA–AVR–02/2013 ATmega8(L) Figure 0-40. Calibrated 4 MHz RC Oscillator Frequency vs. Temperature Figure 0-41. Calibrated 4 MHz RC Oscillator Frequency vs. VCC CALIBRATED 4MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 -60 -40 -20 0 20 40 60 80 100 120 Temperature (˚C) FRC (MHz) 5.5V 2.7V 4.0V CALIBRATED 4MHz RC OSCILLATOR FREQUENCY vs. VCC 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C 105°C303 2486AA–AVR–02/2013 ATmega8(L) Figure 0-42. Calibrated 2 MHz RC Oscillator Frequency vs. Temperature Figure 0-43. Calibrated 2 MHz RC Oscillator Frequency vs. VCC CALIBRATED 2MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 1.75 1.8 1.85 1.9 1.95 2 2.05 2.1 -60 -40 -20 0 20 40 60 80 100 120 Temperature (˚C) FRC (MHz) 5.5V 2.7V 4.0V CALIBRATED 2MHz RC OSCILLATOR FREQUENCY vs. VCC 1.7 1.8 1.9 2 2.1 2.2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C 105°C304 2486AA–AVR–02/2013 ATmega8(L) Figure 0-44. Calibrated 1 MHz RC Oscillator Frequency vs. Temperature Figure 0-45. Calibrated 1 MHz RC Oscillator Frequency vs. VCC CALIBRATED 1MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 0.9 0.92 0.94 0.96 0.98 1 1.02 1.04 -60 -40 -20 0 20 40 60 80 100 120 Temperature (˚C) FRC (MHz) 5.5V 2.7V 4.0V CALIBRATED 1MHz RC OSCILLATOR FREQUENCY vs. VCC 0.9 0.95 1 1.05 1.1 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz) 85°C 25°C -40°C 105°C305 2486AA–AVR–02/2013 ATmega8(L) Current Consumption of Peripheral Units Figure 0-46. Brown-out Detector Current vs. VCC Figure 0-47. ADC Current vs. VCC (AREF = AVCC) BROWNOUT DETECTOR CURRENT vs. VCC 0 5 10 15 20 25 30 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25°C 85°C -40°C 105°C ADC CURRENT vs. VCC AREF = AVCC 0 50 100 150 200 250 300 350 400 450 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85°C 25°C -40°C 105°C306 2486AA–AVR–02/2013 ATmega8(L) Figure 0-48. AREF External Reference Current vs. VCC Figure 0-49. Watchdog Timer Current vs. VCC AREF EXTERNAL REFERENCE CURRENT vs. VCC 0 50 100 150 200 250 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 85°C 25°C -40°C 105°C WATCHDOG TIMER CURRENT vs. VCC 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 105°C 25°C -40°C 85°C307 2486AA–AVR–02/2013 ATmega8(L) Figure 0-50. Analog Comparator Current vs. VCC Figure 0-51. Programming Current vs. VCC ANALOG COMPARATOR CURRENT vs. VCC 0 20 40 60 80 100 120 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25°C 105°C -40°C 85°C PROGRAMMING CURRENT vs. VCC 0 1 2 3 4 5 6 7 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (uA) 25°C 85°C -40°C 105°C308 2486AA–AVR–02/2013 ATmega8(L) Current Consumption in Reset and Reset Pulsewidth Figure 0-52. Reset Pulse Width vs. VCC RESET PULSE WIDTH vs. VCC 0 200 400 600 800 1000 1200 1400 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Pulsewidth (ns) 85°C 25°C -40°C 105°C309 2486AA–AVR–02/2013 ATmega8(L) Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F (0x5F) SREG I T H S V N Z C 11 0x3E (0x5E) SPH – – – – – SP10 SP9 SP8 13 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 13 0x3C (0x5C) Reserved 0x3B (0x5B) GICR INT1 INT0 – – – – IVSEL IVCE 49, 67 0x3A (0x5A) GIFR INTF1 INTF0 – – – – – – 67 0x39 (0x59) TIMSK OCIE2 TOIE2 TICIE1 OCIE1A OCIE1B TOIE1 – TOIE0 72, 100, 119 0x38 (0x58) TIFR OCF2 TOV2 ICF1 OCF1A OCF1B TOV1 – TOV0 72, 101, 119 0x37 (0x57) SPMCR SPMIE RWWSB – RWWSRE BLBSET PGWRT PGERS SPMEN 206 0x36 (0x56) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE 165 0x35 (0x55) MCUCR SE SM2 SM1 SM0 ISC11 ISC10 ISC01 ISC00 33, 66 0x34 (0x54) MCUCSR – – – – WDRF BORF EXTRF PORF 41 0x33 (0x53) TCCR0 – – – – – CS02 CS01 CS00 71 0x32 (0x52) TCNT0 Timer/Counter0 (8 Bits) 72 0x31 (0x51) OSCCAL Oscillator Calibration Register 31 0x30 (0x50) SFIOR – – – – ACME PUD PSR2 PSR10 58, 74, 120, 186 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 FOC1A FOC1B WGM11 WGM10 96 0x2E (0x4E) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 98 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High byte 99 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low byte 99 0x2B (0x4B) OCR1AH Timer/Counter1 – Output Compare Register A High byte 99 0x2A (0x4A) OCR1AL Timer/Counter1 – Output Compare Register A Low byte 99 0x29 (0x49) OCR1BH Timer/Counter1 – Output Compare Register B High byte 99 0x28 (0x48) OCR1BL Timer/Counter1 – Output Compare Register B Low byte 99 0x27 (0x47) ICR1H Timer/Counter1 – Input Capture Register High byte 100 0x26 (0x46) ICR1L Timer/Counter1 – Input Capture Register Low byte 100 0x25 (0x45) TCCR2 FOC2 WGM20 COM21 COM20 WGM21 CS22 CS21 CS20 114 0x24 (0x44) TCNT2 Timer/Counter2 (8 Bits) 116 0x23 (0x43) OCR2 Timer/Counter2 Output Compare Register 116 0x22 (0x42) ASSR – – – – AS2 TCN2UB OCR2UB TCR2UB 117 0x21 (0x41) WDTCR – – – WDCE WDE WDP2 WDP1 WDP0 43 0x20(1) (0x40)(1) UBRRH URSEL – – – UBRR[11:8] 152 UCSRC URSEL UMSEL UPM1 UPM0 USBS UCSZ1 UCSZ0 UCPOL 150 0x1F (0x3F) EEARH – – – – – – – EEAR8 20 0x1E (0x3E) EEARL EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 20 0x1D (0x3D) EEDR EEPROM Data Register 20 0x1C (0x3C) EECR – – – – EERIE EEMWE EEWE EERE 20 0x1B (0x3B) Reserved 0x1A (0x3A) Reserved 0x19 (0x39) Reserved 0x18 (0x38) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 65 0x17 (0x37) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 65 0x16 (0x36) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 65 0x15 (0x35) PORTC – PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 65 0x14 (0x34) DDRC – DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 65 0x13 (0x33) PINC – PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 65 0x12 (0x32) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 65 0x11 (0x31) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 65 0x10 (0x30) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 65 0x0F (0x2F) SPDR SPI Data Register 127 0x0E (0x2E) SPSR SPIF WCOL – – – – – SPI2X 126 0x0D (0x2D) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 125 0x0C (0x2C) UDR USART I/O Data Register 148 0x0B (0x2B) UCSRA RXC TXC UDRE FE DOR PE U2X MPCM 148 0x0A (0x2A) UCSRB RXCIE TXCIE UDRIE RXEN TXEN UCSZ2 RXB8 TXB8 149 0x09 (0x29) UBRRL USART Baud Rate Register Low byte 152 0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 186 0x07 (0x27) ADMUX REFS1 REFS0 ADLAR – MUX3 MUX2 MUX1 MUX0 199 0x06 (0x26) ADCSRA ADEN ADSC ADFR ADIF ADIE ADPS2 ADPS1 ADPS0 200 0x05 (0x25) ADCH ADC Data Register High byte 201 0x04 (0x24) ADCL ADC Data Register Low byte 201 0x03 (0x23) TWDR Two-wire Serial Interface Data Register 167 0x02 (0x22) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE 167310 2486AA–AVR–02/2013 ATmega8(L) Notes: 1. Refer to the USART description (“USART” on page 129) for details on how to access UBRRH and UCSRC (“Accessing UBRRH/UCSRC Registers” on page 146) 2. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written 3. Some of the Status Flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on all bits in the I/O Register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions work with registers 0x00 to 0x1F only 0x01 (0x21) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 – TWPS1 TWPS0 166 0x00 (0x20) TWBR Two-wire Serial Interface Bit Rate Register 165 Register Summary (Continued) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page311 2486AA–AVR–02/2013 ATmega8(L) Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd  Rd + Rr Z, C, N, V, H 1 ADC Rd, Rr Add with Carry two Registers Rd  Rd + Rr + C Z, C, N, V, H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl  Rdh:Rdl + K Z, C, N, V, S 2 SUB Rd, Rr Subtract two Registers Rd  Rd - Rr Z, C, N, V, H 1 SUBI Rd, K Subtract Constant from Register Rd  Rd - K Z, C, N, V, H 1 SBC Rd, Rr Subtract with Carry two Registers Rd  Rd - Rr - C Z, C, N, V, H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd  Rd - K - C Z, C, N ,V, H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl  Rdh:Rdl - K Z, C, N, V, S 2 AND Rd, Rr Logical AND Registers Rd Rd  Rr Z, N, V 1 ANDI Rd, K Logical AND Register and Constant Rd  Rd K Z, N, V 1 OR Rd, Rr Logical OR Registers Rd  Rd v Rr Z, N, V 1 ORI Rd, K Logical OR Register and Constant Rd Rd v K Z, N, V 1 EOR Rd, Rr Exclusive OR Registers Rd  Rd  Rr Z, N, V 1 COM Rd One’s Complement Rd  0xFF  Rd Z, C, N, V 1 NEG Rd Two’s Complement Rd  0x00  Rd Z, C, N, V, H 1 SBR Rd,K Set Bit(s) in Register Rd  Rd v K Z, N, V 1 CBR Rd,K Clear Bit(s) in Register Rd  Rd  (0xFF - K) Z, N, V 1 INC Rd Increment Rd  Rd + 1 Z, N, V 1 DEC Rd Decrement Rd  Rd  1 Z, N, V 1 TST Rd Test for Zero or Minus Rd  Rd  Rd Z, N, V 1 CLR Rd Clear Register Rd  Rd  Rd Z, N, V 1 SER Rd Set Register Rd  0xFF None 1 MUL Rd, Rr Multiply Unsigned R1:R0  Rd x Rr Z, C 2 MULS Rd, Rr Multiply Signed R1:R0  Rd x Rr Z, C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0  Rd x Rr Z, C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0  (Rd x Rr) << 1 Z, C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0  (Rd x Rr) << 1 Z, C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0  (Rd x Rr) << 1 Z, C 2 BRANCH INSTRUCTIONS RJMP k Relative Jump PC PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC  Z None 2 RCALL k Relative Subroutine Call PC  PC + k + 1 None 3 ICALL Indirect Call to (Z) PC  Z None 3 RET Subroutine Return PC  STACK None 4 RETI Interrupt Return PC  STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1 / 2 / 3 CP Rd,Rr Compare Rd  Rr Z, N, V, C, H 1 CPC Rd,Rr Compare with Carry Rd  Rr  C Z, N, V, C, H 1 CPI Rd,K Compare Register with Immediate Rd  K Z, N, V, C, H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC  PC + 2 or 3 None 1 / 2 / 3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC  PC + 2 or 3 None 1 / 2 / 3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC  PC + 2 or 3 None 1 / 2 / 3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC  PC + 2 or 3 None 1 / 2 / 3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PCPC+k + 1 None 1 / 2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PCPC+k + 1 None 1 / 2 BREQ k Branch if Equal if (Z = 1) then PC  PC + k + 1 None 1 / 2 BRNE k Branch if Not Equal if (Z = 0) then PC  PC + k + 1 None 1 / 2 BRCS k Branch if Carry Set if (C = 1) then PC  PC + k + 1 None 1 / 2 BRCC k Branch if Carry Cleared if (C = 0) then PC  PC + k + 1 None 1 / 2 BRSH k Branch if Same or Higher if (C = 0) then PC  PC + k + 1 None 1 / 2 BRLO k Branch if Lower if (C = 1) then PC  PC + k + 1 None 1 / 2 BRMI k Branch if Minus if (N = 1) then PC  PC + k + 1 None 1 / 2 BRPL k Branch if Plus if (N = 0) then PC  PC + k + 1 None 1 / 2 BRGE k Branch if Greater or Equal, Signed if (N  V= 0) then PC  PC + k + 1 None 1 / 2 BRLT k Branch if Less Than Zero, Signed if (N  V= 1) then PC  PC + k + 1 None 1 / 2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC  PC + k + 1 None 1 / 2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC  PC + k + 1 None 1 / 2 BRTS k Branch if T Flag Set if (T = 1) then PC  PC + k + 1 None 1 / 2 BRTC k Branch if T Flag Cleared if (T = 0) then PC  PC + k + 1 None 1 / 2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC  PC + k + 1 None 1 / 2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC  PC + k + 1 None 1 / 2312 2486AA–AVR–02/2013 ATmega8(L) Mnemonics Operands Description Operation Flags #Clocks BRIE k Branch if Interrupt Enabled if ( I = 1) then PC  PC + k + 1 None 1 / 2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC  PC + k + 1 None 1 / 2 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd  Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd  Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd  K None 1 LD Rd, X Load Indirect Rd  (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd  (X), X  X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X  X - 1, Rd  (X) None 2 LD Rd, Y Load Indirect Rd  (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd  (Y), Y  Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y  Y - 1, Rd  (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd  (Y + q) None 2 LD Rd, Z Load Indirect Rd  (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd  (Z), Z  Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z  Z - 1, Rd  (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd  (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd  (k) None 2 ST X, Rr Store Indirect (X) Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) Rr, X  X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X  X - 1, (X)  Rr None 2 ST Y, Rr Store Indirect (Y)  Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y)  Rr, Y  Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y  Y - 1, (Y)  Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q)  Rr None 2 ST Z, Rr Store Indirect (Z)  Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z)  Rr, Z  Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z  Z - 1, (Z)  Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q)  Rr None 2 STS k, Rr Store Direct to SRAM (k)  Rr None 2 LPM Load Program Memory R0  (Z) None 3 LPM Rd, Z Load Program Memory Rd  (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd  (Z), Z  Z+1 None 3 SPM Store Program Memory (Z)  R1:R0 None - IN Rd, P In Port Rd  P None 1 OUT P, Rr Out Port P  Rr None 1 PUSH Rr Push Register on Stack STACK  Rr None 2 POP Rd Pop Register from Stack Rd  STACK None 2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b)  1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b)  0 None 2 LSL Rd Logical Shift Left Rd(n+1)  Rd(n), Rd(0)  0 Z, C, N, V 1 LSR Rd Logical Shift Right Rd(n)  Rd(n+1), Rd(7)  0 Z, C, N, V 1 ROL Rd Rotate Left Through Carry Rd(0)C,Rd(n+1) Rd(n),CRd(7) Z, C, N, V 1 ROR Rd Rotate Right Through Carry Rd(7)C,Rd(n) Rd(n+1),CRd(0) Z, C, N, V 1 ASR Rd Arithmetic Shift Right Rd(n)  Rd(n+1), n=0..6 Z, C, N, V 1 SWAP Rd Swap Nibbles Rd(3..0)Rd(7..4),Rd(7..4)Rd(3..0) None 1 BSET s Flag Set SREG(s)  1 SREG(s) 1 BCLR s Flag Clear SREG(s)  0 SREG(s) 1 BST Rr, b Bit Store from Register to T T  Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b)  T None 1 SEC Set Carry C  1 C1 CLC Clear Carry C  0 C 1 SEN Set Negative Flag N  1 N1 CLN Clear Negative Flag N  0 N 1 SEZ Set Zero Flag Z  1 Z1 CLZ Clear Zero Flag Z  0 Z 1 SEI Global Interrupt Enable I  1 I1 CLI Global Interrupt Disable I 0 I 1 SES Set Signed Test Flag S  1 S1 CLS Clear Signed Test Flag S  0 S 1 SEV Set Twos Complement Overflow. V  1 V1 CLV Clear Twos Complement Overflow V  0 V 1 SET Set T in SREG T  1 T1 Instruction Set Summary (Continued)313 2486AA–AVR–02/2013 ATmega8(L) Mnemonics Operands Description Operation Flags #Clocks CLT Clear T in SREG T  0 T 1 SEH Set Half Carry Flag in SREG H  1 H1 CLH Clear Half Carry Flag in SREG H  0 H 1 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 Instruction Set Summary (Continued)314 2486AA–AVR–02/2013 ATmega8(L) Ordering Information Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities 2. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green 3. Tape & Reel 4. See characterization specification at 105C Speed (MHz) Power Supply (V) Ordering Code(2) Package(1) Operation Range 8 2.7 - 5.5 ATmega8L-8AU ATmega8L-8AUR(3) ATmega8L-8PU ATmega8L-8MU ATmega8L-8MUR(3) 32A 32A 28P3 32M1-A 32M1-A Industrial (-40C to 85C) 16 4.5 - 5.5 ATmega8-16AU ATmega8-16AUR(3) ATmega8-16PU ATmega8-16MU ATmega8-16MUR(3) 32A 32A 28P3 32M1-A 32M1-A 8 2.7 - 5.5 ATmega8L-8AN ATmega8L-8ANR(3) ATmega8L-8PN ATmega8L-8MN ATmega8L-8MUR(3) 32A 32A 28P3 32M1-A 32M1-A Industrial (-40C to 105C) 16 4.5 - 5.5 ATmega8-16AN ATmega8-16ANR(3) ATmega8-16PN ATmega8-16MN ATmega8-16MUR(3) 32A 32A 28P3 32M1-A 32M1-A Package Type 32A 32-lead, Thin (1.0mm) Plastic Quad Flat Package (TQFP) 28P3 28-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP) 32M1-A 32-pad, 5 × 5 × 1.0 body, Lead Pitch 0.50mm Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)315 2486AA–AVR–02/2013 ATmega8(L) Packaging Information 32A TITLE DRAWING NO. REV. 32A, 32-lead, 7 x 7mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) 32A C 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B Notes: 1. This package conforms to JEDEC reference MS-026, Variation ABA. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 8.75 9.00 9.25 D1 6.90 7.00 7.10 Note 2 E 8.75 9.00 9.25 E1 6.90 7.00 7.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP COMMON DIMENSIONS (Unit of measure = mm) SYMBOL MIN NOM MAX NOTE316 2486AA–AVR–02/2013 ATmega8(L) 28P3 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 28P3, 28-lead (0.300"/7.62mm Wide) Plastic Dual Inline Package (PDIP) 28P3 B 09/28/01 PIN 1 E1 A1 B REF E B1 C L SEATING PLANE A 0º ~ 15º D e eB B2 (4 PLACES) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 4.5724 A1 0.508 – – D 34.544 – 34.798 Note 1 E 7.620 – 8.255 E1 7.112 – 7.493 Note 1 B 0.381 – 0.533 B1 1.143 – 1.397 B2 0.762 – 1.143 L 3.175 – 3.429 C 0.203 – 0.356 eB – – 10.160 e 2.540 TYP Note: 1. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25mm (0.010"). 317 2486AA–AVR–02/2013 ATmega8(L) 32M1-A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 32M1-A, 32-pad, 5 x 5 x 1.0mm Body, Lead Pitch 0.50mm, 32M1-A E 5/25/06 3.10mm Exposed Pad, Micro Lead Frame Package (MLF) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D1 D E1 E b e A3 A2 A1 A D2 E2 0.08 C L 1 2 3 P P 0 1 2 3 A 0.80 0.90 1.00 A1 – 0.02 0.05 A2 – 0.65 1.00 A3 0.20 REF b 0.18 0.23 0.30 D D1 D2 2.95 3.10 3.25 4.90 5.00 5.10 4.70 4.75 4.80 4.70 4.75 4.80 4.90 5.00 5.10 E E1 E2 2.95 3.10 3.25 e 0.50 BSC L 0.30 0.40 0.50 P – – 0.60 – – 12o Note: JEDEC Standard MO-220, Fig. 2 (Anvil Singulation), VHHD-2. TOP VIEW SIDE VIEW BOTTOM VIEW 0 Pin 1 ID Pin #1 Notch (0.20 R) K 0.20 – – K K318 2486AA–AVR–02/2013 ATmega8(L) Errata The revision letter in this section refers to the revision of the ATmega8 device. ATmega8 Rev. D to I, M • First Analog Comparator conversion may be delayed • Interrupts may be lost when writing the timer registers in the asynchronous timer • Signature may be Erased in Serial Programming Mode • CKOPT Does not Enable Internal Capacitors on XTALn/TOSCn Pins when 32KHz Oscillator is Used to Clock the Asynchronous Timer/Counter2 • Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request 1. First Analog Comparator conversion may be delayed If the device is powered by a slow rising VCC, the first Analog Comparator conversion will take longer than expected on some devices. Problem Fix / Workaround When the device has been powered or reset, disable then enable theAnalog Comparator before the first conversion. 2. Interrupts may be lost when writing the timer registers in the asynchronous timer The interrupt will be lost if a timer register that is synchronized to the asynchronous timer clock is written when the asynchronous Timer/Counter register(TCNTx) is 0x00. Problem Fix / Workaround Always check that the asynchronous Timer/Counter register neither have the value 0xFF nor 0x00 before writing to the asynchronous Timer Control Register(TCCRx), asynchronous Timer Counter Register(TCNTx), or asynchronous Output Compare Register(OCRx). 3. Signature may be Erased in Serial Programming Mode If the signature bytes are read before a chiperase command is completed, the signature may be erased causing the device ID and calibration bytes to disappear. This is critical, especially, if the part is running on internal RC oscillator. Problem Fix / Workaround: Ensure that the chiperase command has exceeded before applying the next command. 4. CKOPT Does not Enable Internal Capacitors on XTALn/TOSCn Pins when 32KHz Oscillator is Used to Clock the Asynchronous Timer/Counter2 When the internal RC Oscillator is used as the main clock source, it is possible to run the Timer/Counter2 asynchronously by connecting a 32KHz Oscillator between XTAL1/TOSC1 and XTAL2/TOSC2. But when the internal RC Oscillator is selected as the main clock source, the CKOPT Fuse does not control the internal capacitors on XTAL1/TOSC1 and XTAL2/TOSC2. As long as there are no capacitors connected to XTAL1/TOSC1 and XTAL2/TOSC2, safe operation of the Oscillator is not guaranteed. Problem Fix / Workaround Use external capacitors in the range of 20pF - 36pF on XTAL1/TOSC1 and XTAL2/TOSC2. This will be fixed in ATmega8 Rev. G where the CKOPT Fuse will control internal capacitors also when internal RC Oscillator is selected as main clock source. For ATmega8 Rev. G, CKOPT = 0 (programmed) will enable the internal capacitors on XTAL1 and XTAL2. Customers who want compatibility between Rev. G and older revisions, must ensure that CKOPT is unprogrammed (CKOPT = 1).319 2486AA–AVR–02/2013 ATmega8(L) 5. Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request. Reading EEPROM by using the ST or STS command to set the EERE bit in the EECR register triggers an unexpected EEPROM interrupt request. Problem Fix / Workaround Always use OUT or SBI to set EERE in EECR.320 2486AA–AVR–02/2013 ATmega8(L) Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. Changes from Rev. 2486Z- 02/11 to Rev. 2486AA- 02/2013 1. Updated the datasheet according to the Atmel new Brand Style Guide. 2.Removed the reference to “On-chip debugging” from the content. 3.Added “Electrical Characteristics – TA = -40°C to 105°C” on page 242. 4.Added “ATmega8 Typical Characteristics – TA = -40°C to 105°C” on page 282. 5.Updated “Ordering Information” on page 314. Changes from Rev. 2486Y- 10/10 to Rev. 2486Z- 02/11 1. Updated the datasheet according to the Atmel new Brand Style Guide. 2. Updated “Ordering Information” on page 314. Added Ordering Information for “Tape & Reel” devices Changes from Rev. 2486X- 06/10 to Rev. 2486Y- 10/10 1. Max Rise/Fall time in Table 102 on page 239 has been corrected from 1.6ns to 1600ns. 2. Note is added to “Performing Page Erase by SPM” on page 209. 3. Updated/corrected several short-cuts and added some new ones. 4. Updated last page according to new standard. Changes from Rev. 2486W- 02/10 to Rev. 2486X- 06/10 1. Updated “DC Characteristics” on page 235 with new VOL maximum value (0.9V and 0.6V). Changes from Rev. 2486V- 05/09 to Rev. 2486W- 02/10 1. Updated “ADC Characteristics” on page 241 with VINT maximum value (2.9V). Changes from Rev. 2486U- 08/08 to Rev. 2486V- 05/09 1. Updated “Errata” on page 318. 2. Updated the last page with Atmel’s new adresses. Changes from Rev. 2486T- 05/08 to Rev. 2486U- 08/08 1. Updated “DC Characteristics” on page 235 with I CC typical values.321 2486AA–AVR–02/2013 ATmega8(L) Changes from Rev. 2486S- 08/07 to Rev. 2486T- 05/08 1. Updated Table 98 on page 233. 2. Updated “Ordering Information” on page 314. - Commercial Ordering Code removed. - No Pb-free packaging option removed. Changes from Rev. 2486R- 07/07 to Rev. 2486S- 08/07 1. Updated “Features” on page 1. 2. Added “Data Retention” on page 7. 3. Updated “Errata” on page 318. 4. Updated “Slave Mode” on page 125. Changes from Rev. 2486Q- 10/06 to Rev. 2486R- 07/07 1. Added text to Table 81 on page 211. 2. Fixed typo in “Peripheral Features” on page 1. 3. Updated Table 16 on page 42. 4. Updated Table 75 on page 199. 5. Removed redundancy and updated typo in Notes section of “DC Characteristics” on page 235. Changes from Rev. 2486P- 02/06 to Rev. 2486Q- 10/06 1. Updated “Timer/Counter Oscillator” on page 32. 2. Updated “Fast PWM Mode” on page 88. 3. Updated code example in “USART Initialization” on page 134. 4. Updated Table 37 on page 96, Table 39 on page 97, Table 42 on page 115, Table 44 on page 115, and Table 98 on page 233. 5. Updated “Errata” on page 318. Changes from Rev. 2486O-10/04 to Rev. 2486P- 02/06 1. Added “Resources” on page 7. 2. Updated “External Clock” on page 32. 3. Updated “Serial Peripheral Interface – SPI” on page 121. 4. Updated Code Example in “USART Initialization” on page 134. 5. Updated Note in “Bit Rate Generator Unit” on page 164. 6. Updated Table 98 on page 233. 7. Updated Note in Table 103 on page 241.322 2486AA–AVR–02/2013 ATmega8(L) 8. Updated “Errata” on page 318. Changes from Rev. 2486N-09/04 to Rev. 2486O-10/04 1. Removed to instances of “analog ground”. Replaced by “ground”. 2. Updated Table 7 on page 29, Table 15 on page 38, and Table 100 on page 237. 3. Updated “Calibrated Internal RC Oscillator” on page 30 with the 1MHz default value. 4. Table 89 on page 218 and Table 90 on page 218 moved to new section “Page Size” on page 218. 5. Updated descripton for bit 4 in “Store Program Memory Control Register – SPMCR” on page 206. 6. Updated “Ordering Information” on page 314. Changes from Rev. 2486M-12/03 to Rev. 2486N-09/04 1. Added note to MLF package in “Pin Configurations” on page 2. 2. Updated “Internal Voltage Reference Characteristics” on page 42. 3. Updated “DC Characteristics” on page 235. 4. ADC4 and ADC5 support 10-bit accuracy. Document updated to reflect this. Updated features in “Analog-to-Digital Converter” on page 189. Updated “ADC Characteristics” on page 241. 5. Removed reference to “External RC Oscillator application note” from “External RC Oscillator” on page 28. Changes from Rev. 2486L-10/03 to Rev. 2486M-12/03 1. Updated “Calibrated Internal RC Oscillator” on page 30. Changes from Rev. 2486K-08/03 to Rev. 2486L-10/03 1. Removed “Preliminary” and TBDs from the datasheet. 2. Renamed ICP to ICP1 in the datasheet. 3. Removed instructions CALL and JMP from the datasheet. 4. Updated tRST in Table 15 on page 38, VBG in Table 16 on page 42, Table 100 on page 237 and Table 102 on page 239. 5. Replaced text “XTAL1 and XTAL2 should be left unconnected (NC)” after Table 9 in “Calibrated Internal RC Oscillator” on page 30. Added text regarding XTAL1/XTAL2 and CKOPT Fuse in “Timer/Counter Oscillator” on page 32. 6. Updated Watchdog Timer code examples in “Timed Sequences for Changing the Configuration of the Watchdog Timer” on page 45. 7. Removed bit 4, ADHSM, from “Special Function IO Register – SFIOR” on page 58. 8. Added note 2 to Figure 103 on page 208.323 2486AA–AVR–02/2013 ATmega8(L) 9. Updated item 4 in the “Serial Programming Algorithm” on page 231. 10. Added tWD_FUSE to Table 97 on page 232 and updated Read Calibration Byte, Byte 3, in Table 98 on page 233. 11. Updated Absolute Maximum Ratings* and DC Characteristics in “Electrical Characteristics – TA = -40°C to 85°C” on page 235. Changes from Rev. 2486J-02/03 to Rev. 2486K-08/03 1. Updated VBOT values in Table 15 on page 38. 2. Updated “ADC Characteristics” on page 241. 3. Updated “ATmega8 Typical Characteristics – TA = -40°C to 85°C” on page 244. 4. Updated “Errata” on page 318. Changes from Rev. 2486I-12/02 to Rev. 2486J-02/03 1. Improved the description of “Asynchronous Timer Clock – clkASY” on page 26. 2. Removed reference to the “Multipurpose Oscillator” application note and the “32kHz Crystal Oscillator” application note, which do not exist. 3. Corrected OCn waveforms in Figure 38 on page 89. 4. Various minor Timer 1 corrections. 5. Various minor TWI corrections. 6. Added note under “Filling the Temporary Buffer (Page Loading)” on page 209 about writing to the EEPROM during an SPM Page load. 7. Removed ADHSM completely. 8. Added section “EEPROM Write during Power-down Sleep Mode” on page 23. 9. Removed XTAL1 and XTAL2 description on page 5 because they were already described as part of “Port B (PB7..PB0) XTAL1/XTAL2/TOSC1/TOSC2” on page 5. 10. Improved the table under “SPI Timing Characteristics” on page 239 and removed the table under “SPI Serial Programming Characteristics” on page 234. 11. Corrected PC6 in “Alternate Functions of Port C” on page 61. 12. Corrected PB6 and PB7 in “Alternate Functions of Port B” on page 58. 13. Corrected 230.4 Mbps to 230.4 kbps under “Examples of Baud Rate Setting” on page 153. 14. Added information about PWM symmetry for Timer 2 in “Phase Correct PWM Mode” on page 111. 15. Added thick lines around accessible registers in Figure 76 on page 163.324 2486AA–AVR–02/2013 ATmega8(L) 16. Changed “will be ignored” to “must be written to zero” for unused Z-pointer bits under “Performing a Page Write” on page 209. 17. Added note for RSTDISBL Fuse in Table 87 on page 216. 18. Updated drawings in “Packaging Information” on page 315. Changes from Rev. 2486H-09/02 to Rev. 2486I-12/02 1. Added errata for Rev D, E, and F on page 318. Changes from Rev. 2486G-09/02 to Rev. 2486H-09/02 1. Changed the Endurance on the Flash to 10,000 Write/Erase Cycles. Changes from Rev. 2486F-07/02 to Rev. 2486G-09/02 1. Updated Table 103, “ADC Characteristics,” on page 241. Changes from Rev. 2486E-06/02 to Rev. 2486F-07/02 1. Changes in “Digital Input Enable and Sleep Modes” on page 55. 2. Addition of OCS2 in “MOSI/OC2 – Port B, Bit 3” on page 59. 3. The following tables have been updated: Table 51, “CPOL and CPHA Functionality,” on page 127, Table 59, “UCPOL Bit Settings,” on page 152, Table 72, “Analog Comparator Multiplexed Input(1),” on page 188, Table 73, “ADC Conversion Time,” on page 193, Table 75, “Input Channel Selections,” on page 199, and Table 84, “Explanation of Different Variables used in Figure 103 on page 208 and the Mapping to the Z-pointer,” on page 214. 4. Changes in “Reading the Calibration Byte” on page 227. 5. Corrected Errors in Cross References. Changes from Rev. 2486D-03/02 to Rev. 2486E-06/02 1. Updated Some Preliminary Test Limits and Characterization Data The following tables have been updated: Table 15, “Reset Characteristics,” on page 38, Table 16, “Internal Voltage Reference Characteristics,” on page 42, DC Characteristics on page 235, Table , “ADC Characteristics,” on page 241. 2. Changes in External Clock Frequency Added the description at the end of “External Clock” on page 32. Added period changing data in Table 99, “External Clock Drive,” on page 237. 3. Updated TWI Chapter More details regarding use of the TWI bit rate prescaler and a Table 65, “TWI Bit Rate Prescaler,” on page 167.325 2486AA–AVR–02/2013 ATmega8(L) Changes from Rev. 2486C-03/02 to Rev. 2486D-03/02 1. Updated Typical Start-up Times. The following tables has been updated: Table 5, “Start-up Times for the Crystal Oscillator Clock Selection,” on page 28, Table 6, “Start-up Times for the Low-frequency Crystal Oscillator Clock Selection,” on page 28, Table 8, “Start-up Times for the External RC Oscillator Clock Selection,” on page 29, and Table 12, “Start-up Times for the External Clock Selection,” on page 32. 2. Added “ATmega8 Typical Characteristics – TA = -40°C to 85°C” on page 244. Changes from Rev. 2486B-12/01 to Rev. 2486C-03/02 1. Updated TWI Chapter. More details regarding use of the TWI Power-down operation and using the TWI as Master with low TWBRR values are added into the datasheet. Added the note at the end of the “Bit Rate Generator Unit” on page 164. Added the description at the end of “Address Match Unit” on page 164. 2. Updated Description of OSCCAL Calibration Byte. In the datasheet, it was not explained how to take advantage of the calibration bytes for 2, 4, and 8MHz Oscillator selections. This is now added in the following sections: Improved description of “Oscillator Calibration Register – OSCCAL” on page 31 and “Calibration Byte” on page 218. 3. Added Some Preliminary Test Limits and Characterization Data. Removed some of the TBD’s in the following tables and pages: Table 3 on page 26, Table 15 on page 38, Table 16 on page 42, Table 17 on page 44, “TA = -40°C to +85°C, VCC = 2.7V to 5.5V (unless otherwise noted)” on page 235, Table 99 on page 237, and Table 102 on page 239. 4. Updated Programming Figures. Figure 104 on page 219 and Figure 112 on page 230 are updated to also reflect that AVCC must be connected during Programming mode. 5. Added a Description on how to Enter Parallel Programming Mode if RESET Pin is Disabled or if External Oscillators are Selected. Added a note in section “Enter Programming Mode” on page 221.1 2486AA–AVR–02/2013 ATmega8(L) Table of Contents Features 1 Pin Configurations 2 Overview 3 Block Diagram 3 Disclaimer 4 Pin Descriptions 5 Resources 7 Data Retention 7 About Code Examples 8 Atmel AVR CPU Core 9 Introduction 9 Architectural Overview 9 Arithmetic Logic Unit – ALU 11 Status Register 11 General Purpose Register File 12 Stack Pointer 13 Instruction Execution Timing 13 Reset and Interrupt Handling 14 AVR ATmega8 Memories 17 In-System Reprogrammable Flash Program Memory 17 SRAM Data Memory 18 Data Memory Access Times 19 EEPROM Data Memory 19 I/O Memory 24 System Clock and Clock Options 25 Clock Systems and their Distribution 25 Clock Sources 26 Crystal Oscillator 27 Low-frequency Crystal Oscillator 28 External RC Oscillator 28 Calibrated Internal RC Oscillator 30 External Clock 32 Timer/Counter Oscillator 32 Power Management and Sleep Modes 33 Idle Mode 342 2486AA–AVR–02/2013 ATmega8(L) ADC Noise Reduction Mode 34 Power-down Mode 34 Power-save Mode 34 Standby Mode 35 Minimizing Power Consumption 35 System Control and Reset 37 Internal Voltage Reference 42 Watchdog Timer 43 Timed Sequences for Changing the Configuration of the Watchdog Timer 45 Interrupts 46 Interrupt Vectors in ATmega8 46 I/O Ports 51 Introduction 51 Ports as General Digital I/O 52 Alternate Port Functions 56 Register Description for I/O Ports 65 External Interrupts 66 8-bit Timer/Counter0 69 Overview 69 Timer/Counter Clock Sources 70 Counter Unit 70 Operation 70 Timer/Counter Timing Diagrams 70 8-bit Timer/Counter Register Description 71 Timer/Counter0 and Timer/Counter1 Prescalers 73 16-bit Timer/Counter1 75 Overview 75 Accessing 16-bit Registers 77 Timer/Counter Clock Sources 80 Counter Unit 80 Input Capture Unit 81 Output Compare Units 83 Compare Match Output Unit 85 Modes of Operation 87 Timer/Counter Timing Diagrams 94 16-bit Timer/Counter Register Description 96 8-bit Timer/Counter2 with PWM and Asynchronous Operation 102 Overview 1023 2486AA–AVR–02/2013 ATmega8(L) Timer/Counter Clock Sources 103 Counter Unit 104 Output Compare Unit 105 Compare Match Output Unit 107 Modes of Operation 108 Timer/Counter Timing Diagrams 112 8-bit Timer/Counter Register Description 114 Asynchronous Operation of the Timer/Counter 117 Timer/Counter Prescaler 120 Serial Peripheral Interface – SPI 121 SS Pin Functionality 125 Data Modes 127 USART 129 Overview 129 Clock Generation 130 Frame Formats 133 USART Initialization 134 Data Transmission – The USART Transmitter 136 Data Reception – The USART Receiver 138 Asynchronous Data Reception 142 Multi-processor Communication Mode 145 Accessing UBRRH/UCSRC Registers 146 USART Register Description 148 Examples of Baud Rate Setting 153 Two-wire Serial Interface 157 Features 157 Two-wire Serial Interface Bus Definition 157 Data Transfer and Frame Format 158 Multi-master Bus Systems, Arbitration and Synchronization 161 Overview of the TWI Module 163 TWI Register Description 165 Using the TWI 168 Transmission Modes 171 Multi-master Systems and Arbitration 184 Analog Comparator 186 Analog Comparator Multiplexed Input 188 Analog-to-Digital Converter 189 Features 189 Starting a Conversion 191 Prescaling and Conversion Timing 191 Changing Channel or Reference Selection 1944 2486AA–AVR–02/2013 ATmega8(L) ADC Noise Canceler 195 ADC Conversion Result 199 Boot Loader Support – Read-While-Write Self-Programming 202 Boot Loader Features 202 Application and Boot Loader Flash Sections 202 Read-While-Write and No Read-While-Write Flash Sections 202 Boot Loader Lock Bits 204 Entering the Boot Loader Program 205 Addressing the Flash During Self-Programming 207 Self-Programming the Flash 208 Memory Programming 215 Program And Data Memory Lock Bits 215 Fuse Bits 216 Signature Bytes 218 Calibration Byte 218 Page Size 218 Parallel Programming Parameters, Pin Mapping, and Commands 219 Parallel Programming 221 Serial Downloading 230 Serial Programming Pin Mapping 230 Electrical Characteristics – TA = -40°C to 85°C 235 Absolute Maximum Ratings* 235 DC Characteristics 235 External Clock Drive Waveforms 237 External Clock Drive 237 Two-wire Serial Interface Characteristics 238 SPI Timing Characteristics 239 ADC Characteristics 241 Electrical Characteristics – TA = -40°C to 105°C 242 Absolute Maximum Ratings* 242 DC Characteristics TA = -40C to 105C, VCC = 2.7V to 5.5V (unless otherwise noted) 242 ATmega8 Typical Characteristics – TA = -40°C to 85°C 244 ATmega8 Typical Characteristics – TA = -40°C to 105°C 282 Active Supply Current 282 Idle Supply Current 284 Power-down Supply Current 286 Pin Pull-up 287 Pin Driver Strength 289 Pin Thresholds and Hysteresis 2935 2486AA–AVR–02/2013 ATmega8(L) Bod Thresholds and Analog Comparator Offset 298 Internal Oscillator Speed 300 Current Consumption of Peripheral Units 305 Current Consumption in Reset and Reset Pulsewidth 308 Register Summary 309 Instruction Set Summary 311 Ordering Information 314 Packaging Information 315 32A 315 28P3 316 32M1-A 317 Errata 318 ATmega8 Rev. D to I, M 318 Datasheet Revision History 320 Changes from Rev. 2486Z- 02/11 to Rev. 2486AA- 02/2013 320 Changes from Rev. 2486Y- 10/10 to Rev. 2486Z- 02/11 320 Changes from Rev. 2486X- 06/10 to Rev. 2486Y- 10/10 320 Changes from Rev. 2486W- 02/10 to Rev. 2486X- 06/10 320 Changes from Rev. 2486V- 05/09 to Rev. 2486W- 02/10 320 Changes from Rev. 2486U- 08/08 to Rev. 2486V- 05/09 320 Changes from Rev. 2486T- 05/08 to Rev. 2486U- 08/08 320 Changes from Rev. 2486S- 08/07 to Rev. 2486T- 05/08 321 Changes from Rev. 2486R- 07/07 to Rev. 2486S- 08/07 321 Changes from Rev. 2486Q- 10/06 to Rev. 2486R- 07/07 321 Changes from Rev. 2486P- 02/06 to Rev. 2486Q- 10/06 321 Changes from Rev. 2486O-10/04 to Rev. 2486P- 02/06 321 Changes from Rev. 2486N-09/04 to Rev. 2486O-10/04 322 Changes from Rev. 2486M-12/03 to Rev. 2486N-09/04 322 Changes from Rev. 2486L-10/03 to Rev. 2486M-12/03 322 Changes from Rev. 2486K-08/03 to Rev. 2486L-10/03 322 Changes from Rev. 2486J-02/03 to Rev. 2486K-08/03 323 Changes from Rev. 2486I-12/02 to Rev. 2486J-02/03 323 Changes from Rev. 2486H-09/02 to Rev. 2486I-12/02 324 Changes from Rev. 2486G-09/02 to Rev. 2486H-09/02 324 Changes from Rev. 2486F-07/02 to Rev. 2486G-09/02 324 Changes from Rev. 2486E-06/02 to Rev. 2486F-07/02 324 Changes from Rev. 2486D-03/02 to Rev. 2486E-06/02 324 Changes from Rev. 2486C-03/02 to Rev. 2486D-03/02 325 Changes from Rev. 2486B-12/01 to Rev. 2486C-03/02 3252486AA–AVR–02/2013 Atmel Corporation 1600 Technology Drive San Jose, CA 95110 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Roa Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan G.K. 16F Shin-Osaki Kangyo Bldg 1-6-4 Osaki, Shinagawa-ku Tokyo 141-0032 JAPAN Tel: (+81) (3) 6417-0300 Fax: (+81) (3) 6417-0370 © 2013 Atmel Corporation. All rights reserved. / Rev.: 2486AA–AVR–02/2013 Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. Table of Contents 1 8127F–AVR–02/2013 Features • High Performance, Low Power AVR® 8-Bit Microcontroller • Advanced RISC Architecture – 54 Powerful Instructions – Most Single Clock Cycle Execution – 16 x 8 General Purpose Working Registers – Fully Static Operation – Up to 12 MIPS Throughput at 12 MHz • Non-volatile Program and Data Memories – 512/1024 Bytes of In-System Programmable Flash Program Memory – 32 Bytes Internal SRAM – Flash Write/Erase Cycles: 10,000 – Data Retention: 20 Years at 85oC / 100 Years at 25oC • Peripheral Features – QTouch® Library Support for Capacitive Touch Sensing (1 Channel) – One 16-bit Timer/Counter with Prescaler and Two PWM Channels – Programmable Watchdog Timer with Separate On-chip Oscillator – 4-channel, 8-bit Analog to Digital Converter (ATtiny5/10, only) – On-chip Analog Comparator • Special Microcontroller Features – In-System Programmable (at 5V, only) – External and Internal Interrupt Sources – Low Power Idle, ADC Noise Reduction, and Power-down Modes – Enhanced Power-on Reset Circuit – Programmable Supply Voltage Level Monitor with Interrupt and Reset – Internal Calibrated Oscillator • I/O and Packages – Four Programmable I/O Lines – 6-pin SOT and 8-pad UDFN • Operating Voltage: – 1.8 – 5.5V • Programming Voltage: – 5V • Speed Grade – 0 – 4 MHz @ 1.8 – 5.5V – 0 – 8 MHz @ 2.7 – 5.5V – 0 – 12 MHz @ 4.5 – 5.5V • Industrial and Extended Temperature Ranges • Low Power Consumption – Active Mode: • 200µA at 1MHz and 1.8V – Idle Mode: • 25µA at 1MHz and 1.8V – Power-down Mode: • < 0.1µA at 1.8V Atmel 8-bit AVR Microcontroller with 512/1024 Bytes In-System Programmable Flash ATtiny4 / ATtiny5 / ATtiny9 / ATtiny10 Rev. 8127F–AVR–02/2013ATtiny4/5/9/10 [DATASHEET] 2 8127F–AVR–02/2013 1. Pin Configurations Figure 1-1. Pinout of ATtiny4/5/9/10 1.1 Pin Description 1.1.1 VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB3..PB0) This is a 4-bit, bi-directional I/O port with internal pull-up resistors, individually selectable for each bit. The output buffers have symmetrical drive characteristics, with both high sink and source capability. As inputs, the port pins that are externally pulled low will source current if pull-up resistors are activated. Port pins are tri-stated when a reset condition becomes active, even if the clock is not running. The port also serves the functions of various special features of the ATtiny4/5/9/10, as listed on page 36. 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 16-4 on page 118. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 1 2 3 6 5 4 (PCINT0/TPIDATA/OC0A/ADC0/AIN0) PB0 GND (PCINT1/TPICLK/CLKI/ICP0/OC0B/ADC1/AIN1) PB1 PB3 (RESET/PCINT3/ADC3) VCC PB2 (T0/CLKO/PCINT2/INT0/ADC2) SOT-23 1 2 3 4 8 7 6 5 (PCINT1/TPICLK/CLKI/ICP0/OC0B/ADC1/AIN1) PB1 NC NC GND PB2 (T0/CLKO/PCINT2/INT0/ADC2) VCC PB3 (RESET/PCINT3/ADC3) PB0 (AIN0/ADC0/OC0A/TPIDATA/PCINT0) UDFNATtiny4/5/9/10 [DATASHEET] 3 8127F–AVR–02/2013 2. Overview ATtiny4/5/9/10 are low-power CMOS 8-bit microcontrollers based on the compact AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny4/5/9/10 achieve throughputs approaching 1 MIPS per MHz, allowing the system designer to optimize power consumption versus processing speed. Figure 2-1. Block Diagram The AVR core combines a rich instruction set with 16 general purpose working registers and system registers. All registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is compact and code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATtiny4/5/9/10 provide the following features: 512/1024 byte of In-System Programmable Flash, 32 bytes of SRAM, four general purpose I/O lines, 16 general purpose working registers, a 16-bit timer/counter with two PWM STACK POINTER SRAM PROGRAM COUNTER PROGRAMMING LOGIC ISP INTERFACE INTERNAL OSCILLATOR WATCHDOG TIMER RESET FLAG REGISTER MCU STATUS REGISTER TIMER/ COUNTER0 CALIBRATED OSCILLATOR TIMING AND CONTROL INTERRUPT UNIT ANALOG COMPARATOR ADC GENERAL PURPOSE REGISTERS X Y Z ALU STATUS REGISTER PROGRAM FLASH INSTRUCTION REGISTER INSTRUCTION DECODER CONTROL LINES VCC RESET DATA REGISTER PORT B DIRECTION REG. PORT B DRIVERS PORT B GND PB3:0 8-BIT DATA BUSATtiny4/5/9/10 [DATASHEET] 4 8127F–AVR–02/2013 channels, internal and external interrupts, a programmable watchdog timer with internal oscillator, an internal calibrated oscillator, and four software selectable power saving modes. ATtiny5/10 are also equipped with a fourchannel, 8-bit Analog to Digital Converter (ADC). Idle mode stops the CPU while allowing the SRAM, timer/counter, ADC (ATtiny5/10, only), analog comparator, and interrupt system to continue functioning. ADC Noise Reduction mode minimizes switching noise during ADC conversions by stopping the CPU and all I/O modules except the ADC. In Power-down mode registers keep their contents and all chip functions are disabled until the next interrupt or hardware reset. In Standby mode, the oscillator is running while the rest of the device is sleeping, allowing very fast start-up combined with low power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The on-chip, in-system programmable Flash allows program memory to be re-programmed in-system by a conventional, non-volatile memory programmer. The ATtiny4/5/9/10 AVR are supported by a suite of program and system development tools, including macro assemblers and evaluation kits. 2.1 Comparison of ATtiny4, ATtiny5, ATtiny9 and ATtiny10 A comparison of the devices is shown in Table 2-1. Table 2-1. Differences between ATtiny4, ATtiny5, ATtiny9 and ATtiny10 Device Flash ADC Signature ATtiny4 512 bytes No 0x1E 0x8F 0x0A ATtiny5 512 bytes Yes 0x1E 0x8F 0x09 ATtiny9 1024 bytes No 0x1E 0x90 0x08 ATtiny10 1024 bytes Yes 0x1E 0x90 0x03ATtiny4/5/9/10 [DATASHEET] 5 8127F–AVR–02/2013 3. General Information 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/microcontroller/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. 3.3 Capacitive Touch Sensing Atmel QTouch Library provides a simple to use solution for touch sensitive interfaces on Atmel AVR microcontrollers. The QTouch Library includes support for QTouch® and QMatrix® acquisition methods. Touch sensing is easily added to any application by linking the QTouch Library and using the Application Programming Interface (API) of the library to define the touch channels and sensors. The application then calls the API to retrieve channel information and determine the state of the touch sensor. The QTouch Library is free and can be downloaded from the Atmel website. For more information and details of implementation, refer to the QTouch Library User Guide – also available from the Atmel website. 3.4 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C.ATtiny4/5/9/10 [DATASHEET] 6 8127F–AVR–02/2013 4. CPU Core This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 4.1 Architectural Overview Figure 4-1. Block Diagram of the AVR Architecture In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is In-System reprogrammable Flash memory. The fast-access Register File contains 16 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Flash Program Memory Instruction Register Instruction Decoder Program Counter Control Lines 16 x 8 General Purpose Registrers ALU Status and Control I/O Lines Data Bus 8-bit Data SRAM Direct Addressing Indirect Addressing Interrupt Unit Watchdog Timer Analog Comparator Timer/Counter 0 ADCATtiny4/5/9/10 [DATASHEET] 7 8127F–AVR–02/2013 Six of the 16 registers can be used as three 16-bit indirect address register pointers for data space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, capable of directly addressing the whole address space. Most AVR instructions have a single 16-bit word format but 32-bit wide instructions also exist. The actual instruction set varies, as some devices only implement a part of the instruction set. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the four different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O memory can be accessed as the data space locations, 0x0000 - 0x003F. 4.2 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 16 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bitfunctions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for a detailed description. 4.3 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in document “AVR Instruction Set” and section “Instruction Set Summary” on page 150. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. 4.4 General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • One 16-bit output operand and one 16-bit result inputATtiny4/5/9/10 [DATASHEET] 8 8127F–AVR–02/2013 Figure 4-2 below shows the structure of the 16 general purpose working registers in the CPU. Figure 4-2. AVR CPU General Purpose Working Registers Note: A typical implementation of the AVR register file includes 32 general prupose registers but ATtiny4/5/9/10 implement only 16 registers. For reasons of compatibility the registers are numbered R16...R31, not R0...R15. Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. 4.4.1 The X-register, Y-register, and Z-register Registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 4-3. Figure 4-3. The X-, Y-, and Z-registers 7 0 R16 R17 General R18 Purpose … Working R26 X-register Low Byte Registers R27 X-register High Byte R28 Y-register Low Byte R29 Y-register High Byte R30 Z-register Low Byte R31 Z-register High Byte 15 XH XL 0 X-register 7 07 0 R27 R26 15 YH YL 0 Y-register 7 07 0 R29 R28 15 ZH ZL 0 Z-register 7 07 0 R31 R30ATtiny4/5/9/10 [DATASHEET] 9 8127F–AVR–02/2013 In different addressing modes these address registers function as automatic increment and automatic decrement (see document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for details). 4.5 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x40. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 4.6 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 4-4. The Parallel Instruction Fetches and Instruction Executions Figure 4-4 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Figure 4-5 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. clk 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch T1 T2 T3 T4 CPUATtiny4/5/9/10 [DATASHEET] 10 8127F–AVR–02/2013 Figure 4-5. Single Cycle ALU Operation 4.7 Reset and Interrupt Handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate Program Vector in the program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. The lowest addresses in the program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 35. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back T1 T2 T3 T4 clkCPUATtiny4/5/9/10 [DATASHEET] 11 8127F–AVR–02/2013 When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in the following example. Note: See “Code Examples” on page 5. 4.7.1 Interrupt Response Time The interrupt execution response for all the enabled AVR interrupts is four clock cycles minimum. After four clock cycles the Program Vector address for the actual interrupt handling routine is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack. The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt execution response time is increased by four clock cycles. This increase comes in addition to the start-up time from the selected sleep mode. A return from an interrupt handling routine takes four clock cycles. During these four clock cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is incremented by two, and the I-bit in SREG is set. 4.8 Register Description 4.8.1 CCP – Configuration Change Protection Register • Bits 7:0 – CCP[7:0] – Configuration Change Protection In order to change the contents of a protected I/O register the CCP register must first be written with the correct signature. After CCP is written the protected I/O registers may be written to during the next four CPU instruction cycles. All interrupts are ignored during these cycles. After these cycles interrupts are automatically handled again by the CPU, and any pending interrupts will be executed according to their priority. When the protected I/O register signature is written, CCP[0] will read as one as long as the protected feature is enabled, while CCP[7:1] will always read as zero. Table 4-1 shows the signatures that are in recognised. Assembly Code Example sei ; set Global Interrupt Enable sleep ; enter sleep, waiting for interrupt ; note: will enter sleep before any pending interrupt(s) Bit 7 6 5 4 3 2 1 0 0x3C CCP[7:0] CCP Read/Write W W W W W W W R/W Initial Value 0 0 0 0 0 0 0 0 Table 4-1. Signatures Recognised by the Configuration Change Protection Register Signature Group Description 0xD8 IOREG: CLKMSR, CLKPSR, WDTCSR Protected I/O registerATtiny4/5/9/10 [DATASHEET] 12 8127F–AVR–02/2013 4.8.2 SPH and SPL — Stack Pointer Register 4.8.3 SREG – Status Register • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the document “AVR Instruction Set” and “Instruction Set Summary” on page 150. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry is useful in BCD arithmetic. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for detailed information. • Bit 4 – S: Sign Bit, S = N V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for detailed information. • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for detailed information. Bit 15 14 13 12 11 10 9 8 0x3E SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH 0x3D SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 76543210 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND Initial Value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND Bit 7 6 5 4 3 2 1 0 0x3F I T H S V N Z C SREG Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATtiny4/5/9/10 [DATASHEET] 13 8127F–AVR–02/2013 • Bit 0 – C: Carry Flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for detailed information.ATtiny4/5/9/10 [DATASHEET] 14 8127F–AVR–02/2013 5. Memories This section describes the different memories in the ATtiny4/5/9/10. Devices have two main memory areas, the program memory space and the data memory space. 5.1 In-System Re-programmable Flash Program Memory The ATtiny4/5/9/10 contain 512/1024 bytes of on-chip, in-system reprogrammable Flash memory for program storage. Since all AVR instructions are 16 or 32 bits wide, the Flash is organized as 256/512 x 16. The Flash memory has an endurance of at least 10,000 write/erase cycles. The ATtiny4/5/9/10 Program Counter (PC) is 9 bits wide, thus capable of addressing the 256/512 program memory locations, starting at 0x000. “Memory Programming” on page 106 contains a detailed description on Flash data serial downloading. Constant tables can be allocated within the entire address space of program memory. Since program memory can not be accessed directly, it has been mapped to the data memory. The mapped program memory begins at byte address 0x4000 in data memory (see Figure 5-1 on page 15). Although programs are executed starting from address 0x000 in program memory it must be addressed starting from 0x4000 when accessed via the data memory. Internal write operations to Flash program memory have been disabled and program memory therefore appears to firmware as read-only. Flash memory can still be written to externally but internal write operations to the program memory area will not be succesful. Timing diagrams of instruction fetch and execution are presented in “Instruction Execution Timing” on page 9. 5.2 Data Memory Data memory locations include the I/O memory, the internal SRAM memory, the non-volatile memory lock bits, and the Flash memory. See Figure 5-1 on page 15 for an illustration on how the ATtiny4/5/9/10 memory space is organized. The first 64 locations are reserved for I/O memory, while the following 32 data memory locations address the internal data SRAM. The non-volatile memory lock bits and all the Flash memory sections are mapped to the data memory space. These locations appear as read-only for device firmware. The four different addressing modes for data memory are direct, indirect, indirect with pre-decrement, and indirect with post-increment. In the register file, registers R26 to R31 function as pointer registers for indirect addressing. The IN and OUT instructions can access all 64 locations of I/O memory. Direct addressing using the LDS and STS instructions reaches the 128 locations between 0x0040 and 0x00BF. The indirect addressing reaches the entire data memory space. When using indirect addressing modes with automatic pre-decrement and post-increment, the address registers X, Y, and Z are decremented or incremented.ATtiny4/5/9/10 [DATASHEET] 15 8127F–AVR–02/2013 Figure 5-1. Data Memory Map (Byte Addressing) 5.2.1 Data Memory Access Times This section describes the general access timing concepts for internal memory access. The internal data SRAM access is performed in two clkCPU cycles as described in Figure 5-2. Figure 5-2. On-chip Data SRAM Access Cycles 0x0000 ... 0x003F 0x0040 ... 0x005F 0x0060 ... 0x3EFF 0x3F00 ... 0x3F01 0x3F02 ... 0x3F3F 0x3F40 ... 0x3F41 0x3F42 ... 0x3F7F 0x3F80 ... 0x3F81 0x3F82 ... 0x3FBF 0x3FC0 ... 0x3FC3 0x3FC4 ... 0x3FFF 0x4000 ... 0x41FF/0x43FF 0x4400 ... 0xFFFF I/O SPACE SRAM DATA MEMORY (reserved) NVM LOCK BITS (reserved) CONFIGURATION BITS (reserved) CALIBRATION BITS (reserved) DEVICE ID BITS (reserved) FLASH PROGRAM MEMORY (reserved) clk WR RD Data Data Address Address valid T1 T2 T3 Compute Address Read Write CPU Memory Access Instruction Next InstructionATtiny4/5/9/10 [DATASHEET] 16 8127F–AVR–02/2013 5.3 I/O Memory The I/O space definition of the ATtiny4/5/9/10 is shown in “Register Summary” on page 148. All ATtiny4/5/9/10 I/Os and peripherals are placed in the I/O space. All I/O locations may be accessed using the LD and ST instructions, enabling data transfer between the 16 general purpose working registers and the I/O space. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. See document “AVR Instruction Set” and section “Instruction Set Summary” on page 150 for more details. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. Some of the status flags are cleared by writing a logical one to them. Note that CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such status flags. The CBI and SBI instructions work on registers in the address range 0x00 to 0x1F, only. The I/O and Peripherals Control Registers are explained in later sections.ATtiny4/5/9/10 [DATASHEET] 17 8127F–AVR–02/2013 6. Clock System Figure 6-1 presents the principal clock systems and their distribution in ATtiny4/5/9/10. All of the clocks need not be active at a given time. In order to reduce power consumption, the clocks to modules not being used can be halted by using different sleep modes and power reduction register bits, as described in “Power Management and Sleep Modes” on page 23. The clock systems is detailed below. Figure 6-1. Clock Distribution 6.1 Clock Subsystems The clock subsystems are detailed in the sections below. 6.1.1 CPU Clock – clkCPU The CPU clock is routed to parts of the system concerned with operation of the AVR Core. Examples of such modules are the General Purpose Register File, the System Registers and the SRAM data memory. Halting the CPU clock inhibits the core from performing general operations and calculations. 6.1.2 I/O Clock – clkI/O The I/O clock is used by the majority of the I/O modules, like Timer/Counter. The I/O clock is also used by the External Interrupt module, but note that some external interrupts are detected by asynchronous logic, allowing such interrupts to be detected even if the I/O clock is halted. 6.1.3 NVM clock - clkNVM The NVM clock controls operation of the Non-Volatile Memory Controller. The NVM clock is usually active simultaneously with the CPU clock. CLOCK CONTROL UNIT GENERAL I/O MODULES ANALOG-TO-DIGITAL CONVERTER CPU CORE WATCHDOG TIMER RESET LOGIC CLOCK PRESCALER RAM CLOCK SWITCH NVM CALIBRATED OSCILLATOR clk ADC SOURCE CLOCK clk I/O clk CPU clk NVM WATCHDOG CLOCK WATCHDOG OSCILLATOR EXTERNAL CLOCKATtiny4/5/9/10 [DATASHEET] 18 8127F–AVR–02/2013 6.1.4 ADC Clock – clkADC The ADC is provided with a dedicated clock domain. This allows halting the CPU and I/O clocks in order to reduce noise generated by digital circuitry. This gives more accurate ADC conversion results. The ADC is available in ATtiny5/10, only. 6.2 Clock Sources All synchronous clock signals are derived from the main clock. The device has three alternative sources for the main clock, as follows: • Calibrated Internal 8 MHz Oscillator (see page 18) • External Clock (see page 18) • Internal 128 kHz Oscillator (see page 19) See Table 6-3 on page 21 on how to select and change the active clock source. 6.2.1 Calibrated Internal 8 MHz Oscillator The calibrated internal oscillator provides an approximately 8 MHz clock signal. Though voltage and temperature dependent, this clock can be very accurately calibrated by the user. See Table 16-2 on page 117, Figure 17-39 on page 141 and Figure 17-40 on page 141 for more details. This clock may be selected as the main clock by setting the Clock Main Select bits CLKMS[1:0] in CLKMSR to 0b00. Once enabled, the oscillator will operate with no external components. During reset, hardware loads the calibration byte into the OSCCAL register and thereby automatically calibrates the oscillator. The accuracy of this calibration is shown as Factory calibration in Table 16-2 on page 117. When this oscillator is used as the main clock, the watchdog oscillator will still be used for the watchdog timer and reset time-out. For more information on the pre-programmed calibration value, see section “Calibration Section” on page 109. 6.2.2 External Clock To use the device with an external clock source, CLKI should be driven as shown in Figure 6-2. The external clock is selected as the main clock by setting CLKMS[1:0] bits in CLKMSR to 0b10. Figure 6-2. External Clock Drive Configuration When applying an external clock, it is required to avoid sudden changes in the applied clock frequency to ensure stable operation of the MCU. A variation in frequency of more than 2% from one clock cycle to the next can lead to unpredictable behavior. It is required to ensure that the MCU is kept in reset during such changes in the clock frequency. EXTERNAL CLOCK SIGNAL CLKI GNDATtiny4/5/9/10 [DATASHEET] 19 8127F–AVR–02/2013 6.2.3 Internal 128 kHz Oscillator The internal 128 kHz oscillator is a low power oscillator providing a clock of 128 kHz. The frequency depends on supply voltage, temperature and batch variations. This clock may be select as the main clock by setting the CLKMS[1:0] bits in CLKMSR to 0b01. 6.2.4 Switching Clock Source The main clock source can be switched at run-time using the “CLKMSR – Clock Main Settings Register” on page 21. When switching between any clock sources, the clock system ensures that no glitch occurs in the main clock. 6.2.5 Default Clock Source The calibrated internal 8 MHz oscillator is always selected as main clock when the device is powered up or has been reset. The synchronous system clock is the main clock divided by 8, controlled by the System Clock Prescaler. The Clock Prescaler Select Bits can be written later to change the system clock frequency. See “System Clock Prescaler”. 6.3 System Clock Prescaler The system clock is derived from the main clock via the System Clock Prescaler. The system clock can be divided by setting the “CLKPSR – Clock Prescale Register” on page 22. The system clock prescaler can be used to decrease power consumption at times when requirements for processing power is low or to bring the system clock within limits of maximum frequency. The prescaler can be used with all main clock source options, and it will affect the clock frequency of the CPU and all synchronous peripherals. The System Clock Prescaler can be used to implement run-time changes of the internal clock frequency while still ensuring stable operation. 6.3.1 Switching Prescaler Setting When switching between prescaler settings, the system clock prescaler ensures that no glitch occurs in the system clock and that no intermediate frequency is higher than neither the clock frequency corresponding the previous setting, nor the clock frequency corresponding to the new setting. The ripple counter that implements the prescaler runs at the frequency of the main clock, which may be faster than the CPU's clock frequency. Hence, it is not possible to determine the state of the prescaler - even if it were readable, and the exact time it takes to switch from one clock division to another cannot be exactly predicted. From the time the CLKPS values are written, it takes between T1 + T2 and T1 + 2*T2 before the new clock frequency is active. In this interval, two active clock edges are produced. Here, T1 is the previous clock period, and T2 is the period corresponding to the new prescaler setting.ATtiny4/5/9/10 [DATASHEET] 20 8127F–AVR–02/2013 6.4 Starting 6.4.1 Starting from Reset The internal reset is immediately asserted when a reset source goes active. The internal reset is kept asserted until the reset source is released and the start-up sequence is completed. The start-up sequence includes three steps, as follows. 1. The first step after the reset source has been released consists of the device counting the reset start-up time. The purpose of this reset start-up time is to ensure that supply voltage has reached sufficient levels. The reset start-up time is counted using the internal 128 kHz oscillator. See Table 6-1 for details of reset start-up time. Note that the actual supply voltage is not monitored by the start-up logic. The device will count until the reset start-up time has elapsed even if the device has reached sufficient supply voltage levels earlier. 2. The second step is to count the oscillator start-up time, which ensures that the calibrated internal oscillator has reached a stable state before it is used by the other parts of the system. The calibrated internal oscillator needs to oscillate for a minimum number of cycles before it can be considered stable. See Table 6-1 for details of the oscillator start-up time. 3. The last step before releasing the internal reset is to load the calibration and the configuration values from the Non-Volatile Memory to configure the device properly. The configuration time is listed in Table 6-1. Notes: 1. After powering up the device or after a reset the system clock is automatically set to calibrated internal 8 MHz oscillator, divided by 8 6.4.2 Starting from Power-Down Mode When waking up from Power-Down sleep mode, the supply voltage is assumed to be at a sufficient level and only the oscillator start-up time is counted to ensure the stable operation of the oscillator. The oscillator start-up time is counted on the selected main clock, and the start-up time depends on the clock selected. See Table 6-2 for details. Notes: 1. The start-up time is measured in main clock oscillator cycles. 6.4.3 Starting from Idle / ADC Noise Reduction / Standby Mode When waking up from Idle, ADC Noise Reduction or Standby Mode, the oscillator is already running and no oscillator start-up time is introduced. The ADC is available in ATtiny5/10, only. Table 6-1. Start-up Times when Using the Internal Calibrated Oscillator Reset Oscillator Configuration Total start-up time 64 ms 6 cycles 21 cycles 64 ms + 6 oscillator cycles + 21 system clock cycles (1) Table 6-2. Start-up Time from Power-Down Sleep Mode. Oscillator start-up time Total start-up time 6 cycles 6 oscillator cycles (1)ATtiny4/5/9/10 [DATASHEET] 21 8127F–AVR–02/2013 6.5 Register Description 6.5.1 CLKMSR – Clock Main Settings Register • Bit 7:2 – Res: Reserved Bits These bits are reserved and always read zero. • Bit 1:0 – CLKMS[1:0]: Clock Main Select Bits These bits select the main clock source of the system. The bits can be written at run-time to switch the source of the main clock. The clock system ensures glitch free switching of the main clock source. The main clock alternatives are shown in Table 6-3. To avoid unintentional switching of main clock source, a protected change sequence must be followed to change the CLKMS bits, as follows: 1. Write the signature for change enable of protected I/O register to register CCP 2. Within four instruction cycles, write the CLKMS bits with the desired value 6.5.2 OSCCAL – Oscillator Calibration Register . • Bits 7:0 – CAL[7:0]: Oscillator Calibration Value The oscillator calibration register is used to trim the calibrated internal oscillator and remove process variations from the oscillator frequency. A pre-programmed calibration value is automatically written to this register during chip reset, giving the factory calibrated frequency as specified in Table 16-2, “Calibration Accuracy of Internal RC Oscillator,” on page 117. The application software can write this register to change the oscillator frequency. The oscillator can be calibrated to frequencies as specified in Table 16-2, “Calibration Accuracy of Internal RC Oscillator,” on page 117. Calibration outside the range given is not guaranteed. The CAL[7:0] bits are used to tune the frequency of the oscillator. A setting of 0x00 gives the lowest frequency, and a setting of 0xFF gives the highest frequency. Bit 7 6 5 4 3 2 1 0 0x37 – – – – – – CLKMS1 CLKMS0 CLKMSR Read/Write R R R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 6-3. Selection of Main Clock CLKM1 CLKM0 Main Clock Source 0 0 Calibrated Internal 8 MHzOscillator 0 1 Internal 128 kHz Oscillator (WDT Oscillator) 1 0 External clock 1 1 Reserved Bit 7 6 5 4 3 2 1 0 0x39 CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 OSCCAL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value X X X X X X X XATtiny4/5/9/10 [DATASHEET] 22 8127F–AVR–02/2013 6.5.3 CLKPSR – Clock Prescale Register • Bits 7:4 – Res: Reserved Bits These bits are reserved and will always read as zero. • Bits 3:0 – CLKPS[3:0]: Clock Prescaler Select Bits 3 - 0 These bits define the division factor between the selected clock source and the internal system clock. These bits can be written at run-time to vary the clock frequency and suit the application requirements. As the prescaler divides the master clock input to the MCU, the speed of all synchronous peripherals is reduced accordingly. The division factors are given in Table 6-4. To avoid unintentional changes of clock frequency, a protected change sequence must be followed to change the CLKPS bits: 1. Write the signature for change enable of protected I/O register to register CCP 2. Within four instruction cycles, write the desired value to CLKPS bits At start-up, CLKPS bits are reset to 0b0011 to select the clock division factor of 8. If the selected clock source has a frequency higher than the maximum allowed the application software must make sure a sufficient division factor is used. To make sure the write procedure is not interrupted, interrupts must be disabled when changing prescaler settings. Bit 7 6 5 4 3 2 1 0 0x36 – – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 CLKPSR Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 1 1 Table 6-4. Clock Prescaler Select CLKPS3 CLKPS2 CLKPS1 CLKPS0 Clock Division Factor 0000 1 0001 2 0010 4 0 0 1 1 8 (default) 0 1 0 0 16 0 1 0 1 32 0 1 1 0 64 0 1 1 1 128 1 0 0 0 256 1 0 0 1 Reserved 1 0 1 0 Reserved 1 0 1 1 Reserved 1 1 0 0 Reserved 1 1 0 1 Reserved 1 1 1 0 Reserved 1 1 1 1 ReservedATtiny4/5/9/10 [DATASHEET] 23 8127F–AVR–02/2013 7. Power Management and Sleep Modes The high performance and industry leading code efficiency makes the AVR microcontrollers an ideal choise for low power applications. In addition, sleep modes enable the application to shut down unused modules in the MCU, thereby saving power. The AVR provides various sleep modes allowing the user to tailor the power consumption to the application’s requirements. 7.1 Sleep Modes Figure 6-1 on page 17 presents the different clock systems and their distribution in ATtiny4/5/9/10. The figure is helpful in selecting an appropriate sleep mode. Table 7-1 shows the different sleep modes and their wake up sources. Note: 1. The ADC is available in ATtiny5/10, only 2. For INT0, only level interrupt. To enter any of the four sleep modes, the SE bits in SMCR must be written to logic one and a SLEEP instruction must be executed. The SM2:0 bits in the SMCR register select which sleep mode (Idle, ADC Noise Reduction, Standby or Power-down) will be activated by the SLEEP instruction. See Table 7-2 for a summary. If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up. The MCU is then halted for four cycles in addition to the start-up time, executes the interrupt routine, and resumes execution from the instruction following SLEEP. The contents of the Register File and SRAM are unaltered when the device wakes up from sleep. If a reset occurs during sleep mode, the MCU wakes up and executes from the Reset Vector. Note that if a level triggered interrupt is used for wake-up the changed level must be held for some time to wake up the MCU (and for the MCU to enter the interrupt service routine). See “External Interrupts” on page 36 for details. 7.1.1 Idle Mode When bits SM2:0 are written to 000, the SLEEP instruction makes the MCU enter Idle mode, stopping the CPU but allowing the analog comparator, timer/counter, watchdog, and the interrupt system to continue operating. This sleep mode basically halts clkCPU and clkNVM, while allowing the other clocks to run. Idle mode enables the MCU to wake up from external triggered interrupts as well as internal ones like the timer overflow. If wake-up from the analog comparator interrupt is not required, the analog comparator can be powered down by setting the ACD bit in “ACSR – Analog Comparator Control and Status Register” on page 80. This will reduce power consumption in idle mode. If the ADC is enabled (ATtiny5/10, only), a conversion starts automatically when this mode is entered. Table 7-1. Active Clock Domains and Wake-up Sources in Different Sleep Modes Sleep Mode Active Clock Domains Oscillators Wake-up Sources clkCPU clkNVM clkIO clkADC (1) Main Clock Source Enabled INT0 and Pin Change ADC (1) Other I/O Watchdog Interrupt VLM Interrupt Idle X X X X X X X X ADC Noise Reduction X X X (2) X XX Standby X X (2) X Power-down X (2) XATtiny4/5/9/10 [DATASHEET] 24 8127F–AVR–02/2013 7.1.2 ADC Noise Reduction Mode When bits SM2:0 are written to 001, the SLEEP instruction makes the MCU enter ADC Noise Reduction mode, stopping the CPU but allowing the ADC, the external interrupts, and the watchdog to continue operating (if enabled). This sleep mode halts clkI/O, clkCPU, and clkNVM, while allowing the other clocks to run. This mode improves the noise environment for the ADC, enabling higher resolution measurements. If the ADC is enabled, a conversion starts automatically when this mode is entered. This mode is available in all devices, although only ATtiny5/10 are equipped with an ADC. 7.1.3 Power-down Mode When bits SM2:0 are written to 010, the SLEEP instruction makes the MCU enter Power-down mode. In this mode, the oscillator is stopped, while the external interrupts, and the watchdog continue operating (if enabled). Only a watchdog reset, an external level interrupt on INT0, or a pin change interrupt can wake up the MCU. This sleep mode halts all generated clocks, allowing operation of asynchronous modules only. 7.1.4 Standby Mode When bits SM2:0 are written to 100, the SLEEP instruction makes the MCU enter Standby mode. This mode is identical to Power-down with the exception that the oscillator is kept running. This reduces wake-up time, because the oscillator is already running and doesn't need to be started up. 7.2 Power Reduction Register The Power Reduction Register (PRR), see “PRR – Power Reduction Register” on page 26, provides a method to reduce power consumption by stopping the clock to individual peripherals. When the clock for a peripheral is stopped then: • The current state of the peripheral is frozen. • The associated registers can not be read or written. • Resources used by the peripheral will remain occupied. The peripheral should in most cases be disabled before stopping the clock. Clearing the PRR bit wakes up the peripheral and puts it in the same state as before shutdown. Peripheral shutdown can be used in Idle mode and Active mode to significantly reduce the overall power consumption. See “Supply Current of I/O Modules” on page 121 for examples. In all other sleep modes, the clock is already stopped. 7.3 Minimizing Power Consumption There are several issues to consider when trying to minimize the power consumption in an AVR Core controlled system. In general, sleep modes should be used as much as possible, and the sleep mode should be selected so that as few as possible of the device’s functions are operating. All functions not needed should be disabled. In particular, the following modules may need special consideration when trying to achieve the lowest possible power consumption. 7.3.1 Analog Comparator When entering Idle mode, the analog comparator should be disabled if not used. In the power-down mode, the analog comparator is automatically disabled. See “Analog Comparator” on page 80 for further details.ATtiny4/5/9/10 [DATASHEET] 25 8127F–AVR–02/2013 7.3.2 Analog to Digital Converter If enabled, the ADC will be enabled in all sleep modes. To save power, the ADC should be disabled before entering any sleep mode. When the ADC is turned off and on again, the next conversion will be an extended conversion. See “Analog to Digital Converter” on page 82 for details on ADC operation. The ADC is available in ATtiny5/10, only. 7.3.3 Watchdog Timer If the Watchdog Timer is not needed in the application, this module should be turned off. If the Watchdog Timer is enabled, it will be enabled in all sleep modes, and hence, always consume power. In the deeper sleep modes, this will contribute significantly to the total current consumption. Refer to “Watchdog Timer” on page 30 for details on how to configure the Watchdog Timer. 7.3.4 Port Pins When entering a sleep mode, all port pins should be configured to use minimum power. The most important thing is then to ensure that no pins drive resistive loads. In sleep modes where the I/O clock (clkI/O) is stopped, the input buffers of the device will be disabled. This ensures that no power is consumed by the input logic when not needed. In some cases, the input logic is needed for detecting wake-up conditions, and it will then be enabled. Refer to the section “Digital Input Enable and Sleep Modes” on page 44 for details on which pins are enabled. If the input buffer is enabled and the input signal is left floating or has an analog signal level close to VCC/2, the input buffer will use excessive power. For analog input pins, the digital input buffer should be disabled at all times. An analog signal level close to VCC/2 on an input pin can cause significant current even in active mode. Digital input buffers can be disabled by writing to the Digital Input Disable Register (DIDR0). Refer to “DIDR0 – Digital Input Disable Register 0” on page 81 for details. 7.4 Register Description 7.4.1 SMCR – Sleep Mode Control Register The SMCR Control Register contains control bits for power management. • Bits 7:4 – Res: Reserved Bits These bits are reserved and will always read zero. • Bits 3:1 – SM2..SM0: Sleep Mode Select Bits 2..0 These bits select between available sleep modes, as shown in Table 7-2. Bit 7 6 5 4 3 2 1 0 0x3A – – – – SM2 SM1 SM0 SE SMCR Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Table 7-2. Sleep Mode Select SM2 SM1 SM0 Sleep Mode 0 0 0 Idle 0 0 1 ADC noise reduction (1) 0 1 0 Power-down 0 1 1 Reserved 1 0 0 StandbyATtiny4/5/9/10 [DATASHEET] 26 8127F–AVR–02/2013 Note: 1. This mode is available in all devices, although only ATtiny5/10 are equipped with an ADC • Bit 0 – SE: Sleep Enable The SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEP instruction is executed. To avoid the MCU entering the sleep mode unless it is the programmer’s purpose, it is recommended to write the Sleep Enable (SE) bit to one just before the execution of the SLEEP instruction and to clear it immediately after waking up. 7.4.2 PRR – Power Reduction Register • Bits 7:2 – Res: Reserved Bits These bits are reserved and will always read zero. • Bit 1 – PRADC: Power Reduction ADC Writing a logic one to this bit shuts down the ADC. The ADC must be disabled before shut down. The analog comparator cannot use the ADC input MUX when the ADC is shut down. The ADC is available in ATtiny5/10, only. • Bit 0 – PRTIM0: Power Reduction Timer/Counter0 Writing a logic one to this bit shuts down the Timer/Counter0 module. When the Timer/Counter0 is enabled, operation will continue like before the shutdown. 1 0 1 Reserved 1 1 0 Reserved 1 1 1 Reserved Table 7-2. Sleep Mode Select SM2 SM1 SM0 Sleep Mode Bit 7 6 5 4 3 2 1 0 0x35 – – – – – – PRADC PRTIM0 PRR Read/Write R R R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0ATtiny4/5/9/10 [DATASHEET] 27 8127F–AVR–02/2013 8. System Control and Reset 8.1 Resetting the AVR During reset, all I/O registers are set to their initial values, and the program starts execution from the Reset Vector. The instruction placed at the Reset Vector must be a RJMP – Relative Jump – instruction to the reset handling routine. If the program never enables an interrupt source, the interrupt vectors are not used, and regular program code can be placed at these locations. The circuit diagram in Figure 8-1 shows the reset logic. Electrical parameters of the reset circuitry are defined in section “System and Reset Characteristics” on page 118. Figure 8-1. Reset Logic The I/O ports of the AVR are immediately reset to their initial state when a reset source goes active. This does not require any clock source to be running. After all reset sources have gone inactive, a delay counter is invoked, stretching the internal reset. This allows the power to reach a stable level before normal operation starts. The start up sequence is described in “Starting from Reset” on page 20. 8.2 Reset Sources The ATtiny4/5/9/10 have three sources of reset: • Power-on Reset. The MCU is reset when the supply voltage is below the Power-on Reset threshold (VPOT) • External Reset. The MCU is reset when a low level is present on the RESET pin for longer than the minimum pulse length • Watchdog Reset. The MCU is reset when the Watchdog Timer period expires and the Watchdog is enabled 8.2.1 Power-on Reset A Power-on Reset (POR) pulse is generated by an on-chip detection circuit. The detection level is defined in section “System and Reset Characteristics” on page 118. The POR is activated whenever VCC is below the detection level. The POR circuit can be used to trigger the Start-up Reset, as well as to detect a failure in supply voltage. Reset Flag Register (RSTFLR) CK Delay Counters TIMEOUT WDRF EXTRF PORF DATA BUS Clock Generator SPIKE FILTER Pull-up Resistor Watchdog Oscillator Power-on Reset Circuit VLMATtiny4/5/9/10 [DATASHEET] 28 8127F–AVR–02/2013 A Power-on Reset (POR) circuit ensures that the device is reset from Power-on. Reaching the Power-on Reset threshold voltage invokes the delay counter, which determines how long the device is kept in reset after VCC rise. The reset signal is activated again, without any delay, when VCC decreases below the detection level. Figure 8-2. MCU Start-up, RESET Tied to VCC Figure 8-3. MCU Start-up, RESET Extended Externally 8.2.2 VCC Level Monitoring ATtiny4/5/9/10 have a VCC Level Monitoring (VLM) circuit that compares the voltage level at the VCC pin against fixed trigger levels. The trigger levels are set with VLM2:0 bits, see “VLMCSR – VCC Level Monitoring Control and Status register” on page 33. The VLM circuit provides a status flag, VLMF, that indicates if voltage on the VCC pin is below the selected trigger level. The flag can be read from VLMCSR, but it is also possible to have an interrupt generated when the VLMF status flag is set. This interrupt is enabled by the VLMIE bit in the VLMCSR register. The flag can be cleared by changing the trigger level or by writing it to zero. The flag is automatically cleared when the voltage at VCC rises back above the selected trigger level. The VLM can also be used to improve reset characteristics at falling supply. Without VLM, the Power-On Reset (POR) does not activate before supply voltage has dropped to a level where the MCU is not necessarily functional any more. With VLM, it is possible to generate a reset earlier. When active, the VLM circuit consumes some power, as illustrated in Figure 17-48 on page 145. To save power the VLM circuit can be turned off completely, or it can be switched on and off at regular intervals. However, detection takes some time and it is therefore recommended to leave the circuitry on long enough for signals to settle. See “VCC Level Monitor” on page 118. V TIME-OUT RESET RESET TOUT INTERNAL t VPOT VRST CC V TIME-OUT TOUT TOUT INTERNAL CC t VPOT VRST > t RESET RESETATtiny4/5/9/10 [DATASHEET] 29 8127F–AVR–02/2013 When VLM is active and voltage at VCC is above the selected trigger level operation will be as normal and the VLM can be shut down for a short period of time. If voltage at VCC drops below the selected threshold the VLM will either flag an interrupt or generate a reset, depending on the configuration. When the VLM has been configured to generate a reset at low supply voltage it will keep the device in reset as long as VCC is below the reset level. See Table 8-4 on page 34 for reset level details. If supply voltage rises above the reset level the condition is removed and the MCU will come out of reset, and initiate the power-up start-up sequence. If supply voltage drops enough to trigger the POR then PORF is set after supply voltage has been restored. 8.2.3 External Reset An External Reset is generated by a low level on the RESET pin if enabled. Reset pulses longer than the minimum pulse width (see section “System and Reset Characteristics” on page 118) will generate a reset, even if the clock is not running. Shorter pulses are not guaranteed to generate a reset. When the applied signal reaches the Reset Threshold Voltage – VRST – on its positive edge, the delay counter starts the MCU after the time-out period – tTOUT – has expired. External reset is ignored during Power-on start-up count. After Power-on reset the internal reset is extended only if RESET pin is low when the initial Power-on delay count is complete. See Figure 8-2 and Figure 8- 3 on page 28. Figure 8-4. External Reset During Operation 8.2.4 Watchdog Reset When the Watchdog times out, it will generate a short reset pulse of one CK cycle duration. On the falling edge of this pulse, the delay timer starts counting the time-out period tTOUT. See page 30 for details on operation of the Watchdog Timer and Table 16-4 on page 118 for details on reset time-out. CCATtiny4/5/9/10 [DATASHEET] 30 8127F–AVR–02/2013 Figure 8-5. Watchdog Reset During Operation 8.3 Watchdog Timer The Watchdog Timer is clocked from an on-chip oscillator, which runs at 128 kHz. See Figure 8-6. By controlling the Watchdog Timer prescaler, the Watchdog Reset interval can be adjusted as shown in Table 8-2 on page 32. The WDR – Watchdog Reset – instruction resets the Watchdog Timer. The Watchdog Timer is also reset when it is disabled and when a device reset occurs. Ten different clock cycle periods can be selected to determine the reset period. If the reset period expires without another Watchdog Reset, the ATtiny4/5/9/10 resets and executes from the Reset Vector. For timing details on the Watchdog Reset, refer to Table 8-3 on page 33. Figure 8-6. Watchdog Timer The Wathdog Timer can also be configured to generate an interrupt instead of a reset. This can be very helpful when using the Watchdog to wake-up from Power-down. To prevent unintentional disabling of the Watchdog or unintentional change of time-out period, two different safety levels are selected by the fuse WDTON as shown in Table 8-1 on page 31. See “Procedure for Changing the Watchdog Timer Configuration” on page 31 for details. CK CC OSC/2K OSC/4K OSC/8K OSC/16K OSC/32K OSC/64K OSC/128K OSC/256K OSC/512K OSC/1024K MCU RESET WATCHDOG PRESCALER 128 kHz OSCILLATOR WATCHDOG RESET WDP0 WDP1 WDP2 WDP3 WDE MUXATtiny4/5/9/10 [DATASHEET] 31 8127F–AVR–02/2013 8.3.1 Procedure for Changing the Watchdog Timer Configuration The sequence for changing configuration differs between the two safety levels, as follows: 8.3.1.1 Safety Level 1 In this mode, the Watchdog Timer is initially disabled, but can be enabled by writing the WDE bit to one without any restriction. A special sequence is needed when disabling an enabled Watchdog Timer. To disable an enabled Watchdog Timer, the following procedure must be followed: 1. Write the signature for change enable of protected I/O registers to register CCP 2. Within four instruction cycles, in the same operation, write WDE and WDP bits 8.3.1.2 Safety Level 2 In this mode, the Watchdog Timer is always enabled, and the WDE bit will always read as one. A protected change is needed when changing the Watchdog Time-out period. To change the Watchdog Time-out, the following procedure must be followed: 1. Write the signature for change enable of protected I/O registers to register CCP 2. Within four instruction cycles, write the WDP bit. The value written to WDE is irrelevant 8.3.2 Code Examples The following code example shows how to turn off the WDT. The example assumes that interrupts are controlled (e.g., by disabling interrupts globally) so that no interrupts will occur during execution of these functions. Note: See “Code Examples” on page 5. Table 8-1. WDT Configuration as a Function of the Fuse Settings of WDTON WDTON Safety Level WDT Initial State How to Disable the WDT How to Change Time-out Unprogrammed 1 Disabled Protected change sequence No limitations Programmed 2 Enabled Always enabled Protected change sequence Assembly Code Example WDT_off: wdr ; Clear WDRF in RSTFLR in r16, RSTFLR andi r16, ~(1< Table 9-1. Reset and Interrupt Vectors Vector No. Program Address Label Interrupt Source 1 0x0000 RESET External Pin, Power-on Reset, VLM Reset, Watchdog Reset 2 0x0001 INT0 External Interrupt Request 0 3 0x0002 PCINT0 Pin Change Interrupt Request 0 4 0x0003 TIM0_CAPT Timer/Counter0 Input Capture 5 0x0004 TIM0_OVF Timer/Counter0 Overflow 6 0x0005 TIM0_COMPA Timer/Counter0 Compare Match A 7 0x0006 TIM0_COMPB Timer/Counter0 Compare Match B 8 0x0007 ANA_COMP Analog Comparator 9 0x0008 WDT Watchdog Time-out 10 0x0009 VLM VCC Voltage Level Monitor 11 0x000A ADC ADC Conversion Complete (1)ATtiny4/5/9/10 [DATASHEET] 36 8127F–AVR–02/2013 0x000B RESET: ldi r16, high(RAMEND); Main program start 0x000C out SPH,r16 ; Set Stack Pointer 0x000D ldi r16, low(RAMEND) ; to top of RAM 0x000E out SPL,r16 0x000F sei ; Enable interrupts 0x0010 ... ... 9.2 External Interrupts External Interrupts are triggered by the INT0 pin or any of the PCINT3..0 pins. Observe that, if enabled, the interrupts will trigger even if the INT0 or PCINT3..0 pins are configured as outputs. This feature provides a way of generating a software interrupt. Pin change 0 interrupts PCI0 will trigger if any enabled PCINT3..0 pin toggles. The PCMSK Register controls which pins contribute to the pin change interrupts. Pin change interrupts on PCINT3..0 are detected asynchronously, which means that these interrupts can be used for waking the part also from sleep modes other than Idle mode. The INT0 interrupt can be triggered by a falling or rising edge or a low level. This is set up as shown in “EICRA – External Interrupt Control Register A” on page 37. When the INT0 interrupt is enabled and configured as level triggered, the interrupt will trigger as long as the pin is held low. Note that recognition of falling or rising edge interrupts on INT0 requires the presence of an I/O clock, as described in “Clock System” on page 17. 9.2.1 Low Level Interrupt A low level interrupt on INT0 is detected asynchronously. This means that the interrupt source can be used for waking the part also from sleep modes other than Idle (the I/O clock is halted in all sleep modes except Idle). Note that if a level triggered interrupt is used for wake-up from Power-down, the required level must be held long enough for the MCU to complete the wake-up to trigger the level interrupt. If the level disappears before the end of the Start-up Time, the MCU will still wake up, but no interrupt will be generated. The start-up time is defined as described in “Clock System” on page 17. If the low level on the interrupt pin is removed before the device has woken up then program execution will not be diverted to the interrupt service routine but continue from the instruction following the SLEEP command. 9.2.2 Pin Change Interrupt Timing A timing example of a pin change interrupt is shown in Figure 9-1.ATtiny4/5/9/10 [DATASHEET] 37 8127F–AVR–02/2013 Figure 9-1. Timing of pin change interrupts 9.3 Register Description 9.3.1 EICRA – External Interrupt Control Register A The External Interrupt Control Register A contains control bits for interrupt sense control. • Bits 7:2 – Res: Reserved Bits These bits are reserved and will always read zero. • Bits 1:0 – ISC01, ISC00: Interrupt Sense Control 0 Bit 1 and Bit 0 The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corresponding interrupt mask are set. The level and edges on the external INT0 pin that activate the interrupt are defined in Table 9-2. The value on the INT0 pin is sampled before detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If clk PCINT(0) pin_lat pin_sync pcint_in_(0) pcint_syn pcint_setflag PCIF PCINT(0) pin_sync pcint_syn pin_lat D Q LE pcint_setflag PCIF clk clk PCINT(0) in PCMSK(x) pcint_in_(0) 0 x Bit 7 6 5 4 3 2 1 0 0x15 – – – – – – ISC01 ISC00 EICRA Read/Write R R R R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0ATtiny4/5/9/10 [DATASHEET] 38 8127F–AVR–02/2013 low level interrupt is selected, the low level must be held until the completion of the currently executing instruction to generate an interrupt. 9.3.2 EIMSK – External Interrupt Mask Register • Bits 7:1 – Res: Reserved Bits These bits are reserved and will always read zero. • Bit 0 – INT0: External Interrupt Request 0 Enable When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the external pin interrupt is enabled. The Interrupt Sense Control bits (ISC01 and ISC00) in the External Interrupt Control Register A (EICRA) define whether the external interrupt is activated on rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an interrupt request even if INT0 is configured as an output. The corresponding interrupt of External Interrupt Request 0 is executed from the INT0 Interrupt Vector. 9.3.3 EIFR – External Interrupt Flag Register • Bits 7:1 – Res: Reserved Bits These bits are reserved and will always read zero. • Bit 0 – INTF0: External Interrupt Flag 0 When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set (one). If the I-bit in SREG and the INT0 bit in EIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. This flag is constantly zero when INT0 is configured as a level interrupt. Table 9-2. Interrupt 0 Sense Control ISC01 ISC00 Description 0 0 The low level of INT0 generates an interrupt request. 0 1 Any logical change on INT0 generates an interrupt request. 1 0 The falling edge of INT0 generates an interrupt request. 1 1 The rising edge of INT0 generates an interrupt request. Bit 7 6 5 4 3 2 1 0 0x13 – – – – – – – INTO EIMSK Read/Write R R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x14 – – – – – – – INTF0 EIFR Read/Write R R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0ATtiny4/5/9/10 [DATASHEET] 39 8127F–AVR–02/2013 9.3.4 PCICR – Pin Change Interrupt Control Register • Bits 7:1 – Res: Reserved Bits These bits are reserved and will always read zero. • Bit 0 – PCIE0: Pin Change Interrupt Enable 0 When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 0 is enabled. Any change on any enabled PCINT3..0 pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Interrupt Vector. PCINT3..0 pins are enabled individually by the PCMSK Register. 9.3.5 PCIFR – Pin Change Interrupt Flag Register • Bits 7:1 – Res: Reserved Bits These bits are reserved and will always read zero. • Bit 0 – PCIF0: Pin Change Interrupt Flag 0 When a logic change on any PCINT3..0 pin triggers an interrupt request, PCIF0 becomes set (one). If the I-bit in SREG and the PCIE0 bit in PCICR are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. 9.3.6 PCMSK – Pin Change Mask Register • Bits 7:4 – Res: Reserved Bits These bits are reserved and will always read zero. • Bits 3:0 – PCINT3..0: Pin Change Enable Mask 3..0 Each PCINT3..0 bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT3..0 is set and the PCIE0 bit in PCICR is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT3..0 is cleared, pin change interrupt on the corresponding I/O pin is disabled. Bit 7 6 5 4 3 2 1 0 0x12 – – – – – – – PCIE0 PCICR Read/Write R R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x11 – – – – – – – PCIF0 PCIFR Read/Write R R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x10 – – – – PCINT3 PCINT2 PCINT1 PCINT0 PCMSK Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0ATtiny4/5/9/10 [DATASHEET] 40 8127F–AVR–02/2013 10. I/O Ports 10.1 Overview All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports. This means that the direction of one port pin can be changed without unintentionally changing the direction of any other pin with the SBI and CBI instructions. The same applies when changing drive value (if configured as output) or enabling/disabling of pull-up resistors. Each output buffer has symmetrical drive characteristics with both high sink and source capability. The pin driver is strong enough to drive LED displays directly. All port pins have individually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have protection diodes to both VCC and Ground as indicated in Figure 10-1 on page 40. See “Electrical Characteristics” on page 115 for a complete list of parameters. Figure 10-1. I/O Pin Equivalent Schematic All registers and bit references in this section are written in general form. A lower case “x” represents the numbering letter for the port, and a lower case “n” represents the bit number. However, when using the register or bit defines in a program, the precise form must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Registers and bit locations are listed in “Register Description” on page 50. Four I/O memory address locations are allocated for each port, one each for the Data Register – PORTx, Data Direction Register – DDRx, Pull-up Enable Register – PUEx, and the Port Input Pins – PINx. The Port Input Pins I/O location is read only, while the Data Register, the Data Direction Register, and the Pull-up Enable Register are read/write. However, writing a logic one to a bit in the PINx Register, will result in a toggle in the corresponding bit in the Data Register. Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on page 41. Most port pins are multiplexed with alternate functions for the peripheral features on the device. How each alternate function interferes with the port pin is described in “Alternate Port Functions” on page 45. Refer to the individual module sections for a full description of the alternate functions. Note that enabling the alternate function of some of the port pins does not affect the use of the other pins in the port as general digital I/O. Cpin Logic Rpu See Figure "General Digital I/O" for Details PxnATtiny4/5/9/10 [DATASHEET] 41 8127F–AVR–02/2013 10.2 Ports as General Digital I/O The ports are bi-directional I/O ports with optional internal pull-ups. Figure 10-2 shows a functional description of one I/O-port pin, here generically called Pxn. Figure 10-2. General Digital I/O(1) Note: 1. WEx, WRx, WPx, WDx, REx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, and SLEEP are common to all ports. 10.2.1 Configuring the Pin Each port pin consists of four register bits: DDxn, PORTxn, PUExn, and PINxn. As shown in “Register Description” on page 50, the DDxn bits are accessed at the DDRx I/O address, the PORTxn bits at the PORTx I/O address, the PUExn bits at the PUEx I/O address, and the PINxn bits at the PINx I/O address. The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input pin. clk RPx RRx RDx WDx WEx SYNCHRONIZER WDx: WRITE DDRx WRx: WRITE PORTx RRx: READ PORTx REGISTER RPx: READ PORTx PIN clkI/O: I/O CLOCK RDx: READ DDRx WEx: WRITE PUEx REx: READ PUEx D L Q Q REx RESET RESET Q D Q Q Q D CLR PORTxn Q Q D CLR DDxn PINxn DATA BUS SLEEP SLEEP: SLEEP CONTROL Pxn I/O WPx RESET Q Q D CLR PUExn 0 1 WRx WPx: WRITE PINx REGISTERATtiny4/5/9/10 [DATASHEET] 42 8127F–AVR–02/2013 If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port pin is driven low (zero). The pull-up resistor is activated, if the PUExn is written logic one. To switch the pull-up resistor off, PUExn has to be written logic zero. Table 10-1 summarizes the control signals for the pin value. Port pins are tri-stated when a reset condition becomes active, even when no clocks are running. 10.2.2 Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn. Note that the SBI instruction can be used to toggle one single bit in a port. 10.2.3 Break-Before-Make Switching In Break-Before-Make mode, switching the DDRxn bit from input to output introduces an immediate tri-state period lasting one system clock cycle, as indicated in Figure 10-3. For example, if the system clock is 4 MHz and the DDRxn is written to make an output, an immediate tri-state period of 250 ns is introduced before the value of PORTxn is seen on the port pin. To avoid glitches it is recommended that the maximum DDRxn toggle frequency is two system clock cycles. The Break-Before-Make mode applies to the entire port and it is activated by the BBMx bit. For more details, see “PORTCR – Port Control Register” on page 50. When switching the DDRxn bit from output to input no immediate tri-state period is introduced. Table 10-1. Port Pin Configurations DDxn PORTxn PUExn I/O Pull-up Comment 0 X 0 Input No Tri-state (hi-Z) 0 X 1 Input Yes Sources current if pulled low externally 1 0 0 Output No Output low (sink) 1 0 1 Output Yes NOT RECOMMENDED. Output low (sink) and internal pull-up active. Sources current through the internal pull-up resistor and consumes power constantly 1 1 0 Output No Output high (source) 1 1 1 Output Yes Output high (source) and internal pull-up activeATtiny4/5/9/10 [DATASHEET] 43 8127F–AVR–02/2013 Figure 10-3. Switching Between Input and Output in Break-Before-Make-Mode 10.2.4 Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the PINxn Register bit. As shown in Figure 10-2 on page 41, the PINxn Register bit and the preceding latch constitute a synchronizer. This is needed to avoid metastability if the physical pin changes value near the edge of the internal clock, but it also introduces a delay. Figure 10-4 shows a timing diagram of the synchronization when reading an externally applied pin value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min respectively. Figure 10-4. Synchronization when Reading an Externally Applied Pin value Consider the clock period starting shortly after the first falling edge of the system clock. The latch is closed when the clock is low, and goes transparent when the clock is high, as indicated by the shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed between ½ and 1½ system clock period depending upon the time of assertion. When reading back a software assigned pin value, a nop instruction must be inserted as indicated in Figure 10-5 on page 44. The out instruction sets the “SYNC LATCH” signal at the positive edge of the clock. In this case, the delay tpd through the synchronizer is one system clock period. out DDRx, r16 nop 0x02 0x01 SYSTEM CLK INSTRUCTIONS DDRx intermediate tri-state cycle out DDRx, r17 PORTx 0x55 0x01 intermediate tri-state cycle Px0 Px1 tri-state tri-state tri-state r17 0x01 r16 0x02 XXX in r17, PINx 0x00 0xFF INSTRUCTIONS SYNC LATCH PINxn r17 XXX SYSTEM CLK tpd, max tpd, minATtiny4/5/9/10 [DATASHEET] 44 8127F–AVR–02/2013 Figure 10-5. Synchronization when Reading a Software Assigned Pin Value 10.2.5 Digital Input Enable and Sleep Modes As shown in Figure 10-2 on page 41, the digital input signal can be clamped to ground at the input of the schmitttrigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep Controller in Power-down and Standby modes to avoid high power consumption if some input signals are left floating, or have an analog signal level close to VCC/2. SLEEP is overridden for port pins enabled as external interrupt pins. If the external interrupt request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by various other alternate functions as described in “Alternate Port Functions” on page 45. If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as “Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt is not enabled, the corresponding External Interrupt Flag will be set when resuming from the above mentioned Sleep mode, as the clamping in these sleep mode produces the requested logic change. 10.2.6 Unconnected Pins If some pins are unused, it is recommended to ensure that these pins have a defined level. Even though most of the digital inputs are disabled in the deep sleep modes as described above, floating inputs should be avoided to reduce current consumption in all other modes where the digital inputs are enabled (Reset, Active mode and Idle mode). The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up. In this case, the pull-up will be disabled during reset. If low power consumption during reset is important, it is recommended to use an external pull-up or pulldown. Connecting unused pins directly to VCC or GND is not recommended, since this may cause excessive currents if the pin is accidentally configured as an output. out PORTx, r16 nop in r17, PINx 0xFF 0x00 0xFF SYSTEM CLK r16 INSTRUCTIONS SYNC LATCH PINxn r17 t pdATtiny4/5/9/10 [DATASHEET] 45 8127F–AVR–02/2013 10.2.7 Program Example The following code example shows how to set port B pin 0 high, pin 1 low, and define the port pins from 2 to 3 as input with a pull-up assigned to port pin 2. The resulting pin values are read back again, but as previously discussed, a nop instruction is included to be able to read back the value recently assigned to some of the pins. Note: See “Code Examples” on page 5. 10.3 Alternate Port Functions Most port pins have alternate functions in addition to being general digital I/Os. In Figure 10-6 below is shown how the port pin control signals from the simplified Figure 10-2 on page 41 can be overridden by alternate functions. Assembly Code Example ... ; Define pull-ups and set outputs high ; Define directions for port pins ldi r16,(1<> Cx must be observed for proper operation; a typical load capacitance (Cx) ranges from 5 – 20 pF while Cs is usually about 2 – 50 nF. Increasing amounts of Cx destroy gain, therefore it is important to limit the amount of stray capacitance on both SNS terminals. This can be done, for example, by minimizing trace lengths and widths and keeping these traces away from power or ground traces or copper pours. The traces and any components associated with SNS and SNSK will become touch sensitive and should be treated with caution to limit the touch area to the desired location. A series resistor, Rs, should be placed in line with SNSK to the electrode to suppress ESD and EMC effects. 2.4 Sensitivity 2.4.1 Introduction The sensitivity on the QT1010 is a function of things like the value of Cs, electrode size and capacitance, electrode shape and orientation, the composition and aspect of the object to be sensed, the thickness and composition of any overlaying panel material, and the degree of ground coupling of both sensor and object. 2.4.2 Increasing Sensitivity In some cases it may be desirable to increase sensitivity; for example, when using the sensor with very thick panels having a low dielectric constant, or when the device is used as a proximity sensor. Sensitivity can often be increased by using a larger electrode or reducing panel thickness. Increasing electrode size can have diminishing returns, as high values of Cx will reduce sensor gain. AT42QT1010 [DATASHEET] 6 9541I–AT42–05/2013 The value of Cs also has a dramatic effect on sensitivity, and this can be increased in value with the trade-off of slower response time and more power. Increasing the electrode's surface area will not substantially increase touch sensitivity if its diameter is already much larger in surface area than the object being detected. Panel material can also be changed to one having a higher dielectric constant, which will better help to propagate the field. In the case of proximity detection, usually the object being detected is on an approaching hand, so a larger surface area can be effective. Ground planes around and under the electrode and its SNSK trace will cause high Cx loading and destroy gain. The possible signal-to-noise ratio benefits of ground area are more than negated by the decreased gain from the circuit, and so ground areas around electrodes are discouraged. Metal areas near the electrode will reduce the field strength and increase Cx loading and should be avoided, if possible. Keep ground away from the electrodes and traces. 2.4.3 Decreasing Sensitivity In some cases the QT1010 may be too sensitive. In this case gain can be easily lowered further by decreasing Cs. 2.4.4 Proximity Sensing By increasing the sensitivity, the QT1010 can be used as a very effective proximity sensor, allowing the presence of a nearby object (typically a hand) to be detected. In this scenario, as the object being sensed is typically a hand, very large electrode sizes can be used, which is extremely effective in increasing the sensitivity of the detector. In this case, the value of Cs will also need to be increased to ensure improved sensitivity, as mentioned in Section 2.4.2. Note that, although this affects the responsiveness of the sensor, it is less of an issue in proximity sensing applications; in such applications it is necessary to detect simply the presence of a large object, rather than a small, precise touch.AT42QT1010 [DATASHEET] 7 9541I–AT42–05/2013 3. Operation Specifics 3.1 Run Modes 3.1.1 Introduction The QT1010 has three running modes which depend on the state of the SYNC pin (high or low). 3.1.2 Fast Mode The QT1010 runs in Fast mode if the SYNC pin is permanently high. In this mode the QT1010 runs at maximum speed at the expense of increased current consumption. Fast mode is useful when speed of response is the prime design requirement. The delay between bursts in Fast mode is approximately 1 ms, as shown in Figure 3-1. Figure 3-1. Fast Mode Bursts (SYNC Held High) 3.1.3 Low Power Mode The QT1010 runs in Low Power (LP) mode if the SYNC pin is held low. In this mode it sleeps for approximately 80 ms at the end of each burst, saving power but slowing response. On detecting a possible key touch, it temporarily switches to Fast mode until either the key touch is confirmed or found to be spurious (via the detect integration process). It then returns to LP mode after the key touch is resolved, as shown in Figure 3-2. Figure 3-2. Low Power Mode (SYNC Held Low) SNSK SYNC ~1 ms sleep sleep SYNC SNSK sleep fast detect integrator OUT Key ~80 ms touchAT42QT1010 [DATASHEET] 8 9541I–AT42–05/2013 3.1.4 SYNC Mode It is possible to synchronize the device to an external clock source by placing an appropriate waveform on the SYNC pin. SYNC mode can synchronize multiple QT1010 devices to each other to prevent cross-interference, or it can be used to enhance noise immunity from low frequency sources such as 50Hz or 60Hz mains signals. The SYNC pin is sampled at the end of each burst. If the device is in Fast mode and the SYNC pin is sampled high, then the device continues to operate in Fast mode (Figure 3-1 on page 7). If SYNC is sampled low, then the device goes to sleep. From then on, it will operate in SYNC mode (Figure 3-2). Therefore, to guarantee entry into SYNC mode the low period of the SYNC signal should be longer than the burst length (Figure 3-3). Figure 3-3. SYNC Mode (Triggered by SYNC Edges) However, once SYNC mode has been entered, if the SYNC signal consists of a series of short pulses (>10 µs) then a burst will only occur on the falling edge of each pulse (Figure 3-4) instead of on each change of SYNC signal, as normal (Figure 3-3). In SYNC mode, the device will sleep after each measurement burst (just as in LP mode) but will be awakened by a change in the SYNC signal in either direction, resulting in a new measurement burst. If SYNC remains unchanged for a period longer than the LP mode sleep period (about 80 ms), the device will resume operation in either Fast or LP mode depending on the level of the SYNC pin (Figure 3-3). There is no detect integrator (DI) in SYNC mode (each touch is a detection) but the Max On-duration will depend on the time between SYNC pulses; see Section 3.3 and Section 3.4 on page 9. Recalibration timeout is a fixed number of measurements so will vary with the SYNC period. Figure 3-4. SYNC Mode (Short Pulses) SYNC SYNC SNSK SNSK slow mode sleep period sleep sleep sleep sleep sleep sleep Revert to Fast Mode Revert to Slow Mode slow mode sleep period SNSK SYNC >10 sμ >10 sμ >10 sμAT42QT1010 [DATASHEET] 9 9541I–AT42–05/2013 3.2 Threshold The internal signal threshold level is fixed at 10 counts of change with respect to the internal reference level, which in turn adjusts itself slowly in accordance with the drift compensation mechanism. The QT1010 employs a hysteresis dropout of two counts of the delta between the reference and threshold levels. 3.3 Max On-duration If an object or material obstructs the sense pad the signal may rise enough to create a detection, preventing further operation. To prevent this, the sensor includes a timer which monitors detections. If a detection exceeds the timer setting the sensor performs a full recalibration. This is known as the Max On-duration feature and is set to ~60s (at 3V in LP mode). This will vary slightly with Cs and if SYNC mode is used. As the internal timebase for Max Onduration is determined by the burst rate, the use of SYNC can cause dramatic changes in this parameter depending on the SYNC pulse spacing. For example, at 60Hz SYNC mode the Max On-duration will be ~6s at 3V. 3.4 Detect Integrator It is desirable to suppress detections generated by electrical noise or from quick brushes with an object. To accomplish this, the QT1010 incorporates a detect integration (DI) counter that increments with each detection until a limit is reached, after which the output is activated. If no detection is sensed prior to the final count, the counter is reset immediately to zero. In the QT1010, the required count is four. In LP mode the device will switch to Fast mode temporarily in order to resolve the detection more quickly; after a touch is either confirmed or denied the device will revert back to normal LP mode operation automatically. The DI can also be viewed as a “consensus filter” that requires four successive detections to create an output. 3.5 Forced Sensor Recalibration The QT1010 has no recalibration pin; a forced recalibration is accomplished when the device is powered up or after the recalibration timeout. However, supply drain is low so it is a simple matter to treat the entire IC as a controllable load; driving the QT1010's Vdd pin directly from another logic gate or a microcontroller port will serve as both power and “forced recalibration”. The source resistance of most CMOS gates and microcontrollers is low enough to provide direct power without problem. 3.6 Drift Compensation Signal drift can occur because of changes in Cx and Cs over time. It is crucial that drift be compensated for, otherwise false detections, non-detections, and sensitivity shifts will follow. Drift compensation (Figure 3-5) is performed by making the reference level track the raw signal at a slow rate, but only while there is no detection in effect. The rate of adjustment must be performed slowly, otherwise legitimate detections could be ignored. The QT1010 drift compensates using a slew-rate limited change to the reference level; the threshold and hysteresis values are slaved to this reference. Once an object is sensed, the drift compensation mechanism ceases since the signal is legitimately high, and therefore should not cause the reference level to change.AT42QT1010 [DATASHEET] 10 9541I–AT42–05/2013 Figure 3-5. Drift Compensation The QT1010 drift compensation is asymmetric; the reference level drift-compensates in one direction faster than it does in the other. Specifically, it compensates faster for decreasing signals than for increasing signals. Increasing signals should not be compensated for quickly, since an approaching finger could be compensated for partially or entirely before even approaching the sense electrode. However, an obstruction over the sense pad, for which the sensor has already made full allowance, could suddenly be removed leaving the sensor with an artificially elevated reference level and thus become insensitive to touch. In this latter case, the sensor will compensate for the object's removal very quickly, usually in only a few seconds. With large values of Cs and small values of Cx, drift compensation will appear to operate more slowly than with the converse. Note that the positive and negative drift compensation rates are different. 3.7 Response Time The QT1010's response time is highly dependent on run mode and burst length, which in turn is dependent on Cs and Cx. With increasing Cs, response time slows, while increasing levels of Cx reduce response time. The response time will also be a lot slower in LP or SYNC mode due to a longer time between burst measurements. 3.8 Spread Spectrum The QT1010 modulates its internal oscillator by ±7.5% during the measurement burst. This spreads the generated noise over a wider band, reducing emission levels. This also reduces susceptibility since there is no longer a single fundamental burst frequency. 3.9 Output Features 3.9.1 Output The output of the QT1010 is active-high upon detection. The output will remain active-high for the duration of the detection, or until the Max On-duration expires, whichever occurs first. If a Max On-duration timeout occurs first, the sensor performs a full recalibration and the output becomes inactive (low) until the next detection. 3.9.2 HeartBeat Output The QT1010 output has a HeartBeat “health” indicator superimposed on it in all modes. This operates by taking the output pin into a three-state mode for 15 µs, once before every QT burst. This output state can be used to determine that the sensor is operating properly, using one of several simple methods, or it can be ignored. The HeartBeat indicator can be sampled by using a pull-up resistor on the OUT pin (Figure 3-6), and feeding the resulting positive-going pulse into a counter, flip flop, one-shot, or other circuit. The pulses will only be visible when the chip is not detecting a touch. Threshold Signal Hysteresis Reference OutputAT42QT1010 [DATASHEET] 11 9541I–AT42–05/2013 Figure 3-6. Obtaining HeartBeat Pulses with a Pull-up Resistor (SOT23-6) If the sensor is wired to a microcontroller as shown in Figure 3-7 on page 11, the microcontroller can reconfigure the load resistor to either Vss or Vdd depending on the output state of the QT1010, so that the pulses are evident in either state. Figure 3-7. Using a Microcontroller to Obtain HeartBeat Pulses in Either Output State (SOT23-6) Electromechanical devices like relays will usually ignore the short HeartBeat pulse. The pulse also has too low a duty cycle to visibly affect LEDs. It can be filtered completely if desired, by adding an RC filter to the output, or if interfacing directly and only to a high-impedance CMOS input, by doing nothing or at most adding a small noncritical capacitor from OUT to Vss. 3.9.3 Output Drive The OUT pin is active high and can sink or source up to 2 mA. When a large value of Cs (>20 nF) is used the OUT current should be limited to <1 mA to prevent gain-shifting side effects, which happen when the load current creates voltage drops on the die and bonding wires; these small shifts can materially influence the signal level to cause detection instability. OUT VDD SNSK SNS SYNC/MODE VSS 2 6 4 1 3 5 VDD HeartBeat" Pulse Ro OUT SNSK SNS SYNC/MODE 6 4 1 3 Ro Microcontroller Port_M.x Port_M.yAT42QT1010 [DATASHEET] 12 9541I–AT42–05/2013 4. Circuit Guidelines 4.1 More Information Refer to Application Note QTAN0002, Secrets of a Successful QTouch Design and the Touch Sensors Design Guide (both downloadable from the Atmel website), for more information on construction and design methods. 4.2 Sample Capacitor Cs is the charge sensing sample capacitor. The required Cs value depends on the thickness of the panel and its dielectric constant. Thicker panels require larger values of Cs. Typical values are 2 nF to 50 nF depending on the sensitivity required; larger values of Cs demand higher stability and better dielectric to ensure reliable sensing. The Cs capacitor should be a stable type, such as X7R ceramic or PPS film. For more consistent sensing from unit to unit, 5% tolerance capacitors are recommended. X7R ceramic types can be obtained in 5% tolerance at little or no extra cost. In applications where high sensitivity (long burst length) is required the use of PPS capacitors is recommended. For battery powered operation a higher value sample capacitor is recommended (typical value 8.2 nF). 4.3 UDFN/USON Package Restrictions The central pad on the underside of the UDFN/USON chip is connected to ground. Do not run any tracks underneath the body of the chip, only ground. 4.4 Power Supply and PCB Layout See Section 5.2 on page 14 for the power supply range. At 3 V current drain averages less than 500 µA in Fast mode. If the power supply is shared with another electronic system, care should be taken to ensure that the supply is free of digital spikes, sags, and surges which can adversely affect the QT1010. The QT1010 will track slow changes in Vdd, but it can be badly affected by rapid voltage fluctuations. It is highly recommended that a separate voltage regulator be used just for the QT1010 to isolate it from power supply shifts caused by other components. If desired, the supply can be regulated using a Low Dropout (LDO) regulator, although such regulators often have poor transient line and load stability. See Application Note QTAN0002, Secrets of a Successful QTouch™ Design for further information. Parts placement: The chip should be placed to minimize the SNSK trace length to reduce low frequency pickup, and to reduce stray Cx which degrades gain. The Cs and Rs resistors (see Figure 1-1 on page 4) should be placed as close to the body of the chip as possible so that the trace between Rs and the SNSK pin is very short, thereby reducing the antenna-like ability of this trace to pick up high frequency signals and feed them directly into the chip. A ground plane can be used under the chip and the associated discrete components, but the trace from the Rs resistor and the electrode should not run near ground, to reduce loading. For best EMC performance the circuit should be made entirely with SMT components. Electrode trace routing: Keep the electrode trace (and the electrode itself) away from other signal, power, and ground traces including over or next to ground planes. Adjacent switching signals can induce noise onto the sensing signal; any adjacent trace or ground plane next to, or under, the electrode trace will cause an increase in Cx load and desensitize the device. Note: For proper operation a 100 nF (0.1 µF) ceramic bypass capacitor must be used directly between Vdd and Vss, to prevent latch-up if there are substantial Vdd transients; for example, during an ESD event. The bypass capacitor should be placed very close to the Vss and Vdd pins.AT42QT1010 [DATASHEET] 13 9541I–AT42–05/2013 4.5 Power On On initial power up, the QT1010 requires approximately 100 ms to power on to allow power supplies to stabilize. During this time the OUT pin state is not valid and should be ignored.AT42QT1010 [DATASHEET] 14 9541I–AT42–05/2013 5. Specifications 5.1 Absolute Maximum Specifications 5.2 Recommended Operating Conditions 5.3 AC Specifications Operating temperature –40°C to +85°C Storage temperature –55°C to +125°C VDD 0 to +6.5 V Max continuous pin current, any control or drive pin ±20 mA Short circuit duration to Vss, any pin Infinite Short circuit duration to Vdd, any pin Infinite Voltage forced onto any pin –0.6V to (Vdd + 0.6) V CAUTION: Stresses beyond those listed under Absolute Maximum Specifications may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum specification conditions for extended periods may affect device reliability VDD +1.8 to 5.5 V Short-term supply ripple + noise ±20 mV Long-term supply stability ±100 mV Cs value 2 to 50 nF Cx value 5 to 50 pF Vdd = 3.0 V, Cs = 4.7 nF, Cx = 5 pF, Ta = recommended range, unless otherwise noted Parameter Description Min Typ Max Units Notes TRC Recalibration time – 200 – ms Cs, Cx dependent TPC Charge duration – 3.05 – µs ±7.5% spread spectrum variation TPT Transfer duration – 9.0 – µs ±7.5% spread spectrum variation TG1 Time between end of burst and start of the next (Fast mode) – 1.2 – ms TG2 Time between end of burst and start of the next (LP mode) – 80 – ms Increases with decreasing VDD See Figure 5-1 on page 15AT42QT1010 [DATASHEET] 15 9541I–AT42–05/2013 Figure 5-1. TG2 – Time Between Bursts (LP Mode) Figure 5-2. TBL – Burst Length TBL Burst length – 2.45 – ms VDD, Cs and Cx dependent. See Section 4.2 for capacitor selection. TR Response time – – 100 ms THB HeartBeat pulse width – 15 – µs Vdd = 3.0 V, Cs = 4.7 nF, Cx = 5 pF, Ta = recommended range, unless otherwise noted Parameter Description Min Typ Max Units NotesAT42QT1010 [DATASHEET] 16 9541I–AT42–05/2013 5.4 Signal Processing 5.5 DC Specifications Vdd = 3.0V, Cs = 4.7 nF, Cx = 5 pF, Ta = recommended range, unless otherwise noted Description Min Typ Max Units Notes Threshold differential 10 counts Hysteresis 2 counts Consensus filter length 4 samples Max on-duration 60 seconds (At 3 V in LP mode) Will vary in SYNC mode and with Vdd Vdd = 3.0V, Cs = 4.7 nF, Cx = 5 pF, Ta = recommended range, unless otherwise noted Parameter Description Min Typ Max Units Notes VDD Supply voltage 1.8 5.5 V IDD Supply current, Fast mode – 203.0 246.0 378.5 542.5 729.0 – µA 1.8 V 2.0 V 3.0 V 4.0 V 5.0 V IDDI Supply current, LP mode – 16.5 19.5 34.0 51.5 73.5 – µA 1.8 V 2.0 V 3.0 V 4.0 V 5.0 V VDDS Supply turn-on slope 10 – – V/s Required for proper start-up VIL Low input logic level – – 0.2 × Vdd 0.3 × Vdd V Vdd = 1.8 V – 2.4 V Vdd = 2.4 V – 5.5 V VHL High input logic level 0.7 × Vdd 0.6 × Vdd – – V Vdd = 1.8 V – 2.4 V Vdd = 2.4 V – 5.5 V VOL Low output voltage – – 0.5 V OUT, 4 mA sink VOH High output voltage 2.3 – – V OUT, 1 mA source IIL Input leakage current – <0.05 1 µA CX Load capacitance range 2 – 50 pF AR Acquisition resolution – 9 14 bitsAT42QT1010 [DATASHEET] 17 9541I–AT42–05/2013 5.6 Mechanical Dimensions 5.6.1 6-pin SOT23-6 9524D–AT42–05/2013 Features  Number of QTouch® Keys:  Up to four  Discrete Outputs:  Four discrete outputs indicating individual key touch  Technology:  Patented spread-spectrum charge-transfer (direct mode)  Electrode Design:  Simple self-capacitance style (refer to the Touch Sensors Design Guide)  Electrode Materials:  Etched copper, silver, carbon, Indium Tin Oxide (ITO)  Electrode Substrates:  PCB, FPCB, plastic films, glass  Panel Materials:  Plastic, glass, composites, painted surfaces (low particle density metallic paints possible)  Panel Thickness:  Up to 10 mm glass, 5 mm plastic (electrode size dependent)  Key Sensitivity:  Fixed key threshold, sensitivity adjusted via sample capacitor value  Adjacent Key Suppression  Patented Adjacent Key Suppression® (AKS®) technology to enable accurate key detection  Interface:  Pin-per-key outputs, plus debug mode to observe sensor signals  Moisture Tolerance:  Increased moisture tolerance based on hardware design and firmware tuning  Signal Processing:  Self-calibration, auto drift compensation, noise filtering  Applications:  Mobile, consumer, white goods, toys, kiosks, POS, and so on  Power:  1.8 V – 5.5 V  Package:  20-pin 3 x 3 mm VQFN RoHS compliant Atmel AT42QT1040 Four-key QTouch® Touch Sensor IC DATASHEETAT42QT1040 [DATASHEET] 2 9524D–AT42–05/2013 1. Pinout and Schematic 1.1 Pinout Configuration NC NC VSS VDD NC SNS2 SNSK1 SNS1 SNSK0 SNS0 OUT0 OUT1 1 2 3 4 5 11 12 13 14 15 20 19 18 17 16 6 7 8 9 10 QT1040 OUT3 OUT2 SNSK3 SNSK2 NC NC NC SNS3AT42QT1040 [DATASHEET] 3 9524D–AT42–05/2013 1.2 Pin Descriptions I/O CMOS input and output OD CMOS open drain output P Ground or power Table 1-1. Pin Listing Pin Name Type Function Notes If Unused... 1 SNS2 I/O Sense pin To Cs2 Leave open 2 SNSK1 I/O Sense pin and option detect To Cs1 and option resistor + key Connect to option resistor* 3 SNS1 I/O Sense pin To Cs1 Leave open 4 SNSK0 I/O Sense pin and option detect To Cs0 and option resistor + key Connect to option resistor* 5 SNS0 I/O Sense pin To Cs0 Leave open 6 N/C – – – 7 N/C – – – 8 Vss P Supply ground – 9 Vdd P Power – 10 N/C – – – 11 OUT0 OD Out 0 Alternative function: Debug CLK Leave open 12 OUT1 OD Out 1 Alternative function: Debug DATA Leave open 13 OUT3 OD Out 3 Leave open 14 OUT2 OD Out 2 Leave open 15 SNSK3 I/O Sense pin To Cs3 + key Leave open 16 SNS3 I/O Sense pin To Cs3 Leave open 17 N/C – – – 18 N/C – – – 19 N/C – – – 20 SNSK2 I/O Sense pin To Cs2 + key Leave open * Option resistor should always be fitted even if channel is unused and Cs capacitor is not fixed.AT42QT1040 [DATASHEET] 4 9524D–AT42–05/2013 1.3 Schematic Figure 1-1. Typical Circuit Suggested regulator manufacturers:  Torex (XC6215 series)  Seiko (S817 series)  BCDSemi (AP2121 series) For component values in Figure 1-1 check the following sections:  Section 3.1 on page 7: Cs capacitors (Cs0 – Cs3)  Section 3.5 on page 7: Voltage levels  Section 3.3 on page 7: LED traces SLOW FAST OFF LED3 LED2 LED1 LED0 VDD VDD 2 1 3 J2 VDD 2 1 3 J1 ON 2 2 5 5 4 4 3 3 1 1 J3 VDD 9 VSS 8 N/C 19 N/C 10 OUT2 14 SNSK3 15 SNSK2 20 SNSK1 2 SNSK0 4 N/C 18 N/C 7 N/C 17 OUT1 12 OUT0 11 SNS3 16 SNS1 3 N/C 6 OUT3 13 SNS0 5 SNS2 1 SPEED SELECT AKS SELECT NOTES: 1) The central pad on the underside of the VQFN chip is a Vss pin and should be connected to ground. Do not put any other tracks underneath the body of the chip. 2) It is important to place all Cs and Rs components physically near to the chip. Add a 100 nF capacitor close to pin 9. QT1040 Creg Creg VREG Follow regulator manufacturer's recommended values for input and output bypass capacitors (Creg). Key0 Key1 Key2 Key3 VUNREG GND Cs0 Cs1 Cs2 Cs3 RL0 RL1 RL2 RL3 RAKS RFS Rs0 Rs1 Rs2 Rs3 Example use of output pinsAT42QT1040 [DATASHEET] 5 9524D–AT42–05/2013 2. Overview of the AT42QT1040 2.1 Introduction The AT42QT1040 (QT1040) is a digital burst mode charge-transfer (QT™) capacitive sensor driver designed for touch-key applications. The device can sense from one to four keys; one to three keys can be disabled by not installing their respective sense capacitors. Any of the four channels can be disabled in this way. The device includes all signal processing functions necessary to provide stable sensing under a wide variety of changing conditions, and the outputs are fully de-bounced. Only a few external parts are required for operation. The QT1040 modulates its bursts in a spread-spectrum fashion in order to heavily suppress the effects of external noise, and to suppress RF emissions. 2.2 Signal Processing 2.2.1 Detect Threshold The internal signal threshold level is fixed at 10 counts of change with respect to the internal reference level. This in turn adjusts itself slowly in accordance with the drift compensation mechanism. See Section 3.1 on page 7 for details on how to adjust the sensitivity of each key. When going out of detect there is a hysteresis element to the detection. The signal threshold must drop below 8 counts of change with respect to the internal reference level to register as un-touched. 2.2.2 Detection Integrator The device features a detection integration mechanism, which acts to confirm a detection in a robust fashion. A perkey counter is incremented each time the key has exceeded its threshold, and a key is only finally declared to be touched when this counter reaches a fixed limit of 5. In other words, the device has to exceed its threshold, and stay there for 5 acquisitions in succession without going below the threshold level, before the key is declared to be touched. 2.2.3 Burst Length Limitations Burst length is the number of times the charge transfer process is performed on a given channel; that is, the number of pulses it takes to measure the key capacitance. The maximum burst length is 2048 pulses. The recommended design is to use a capacitor that gives a signal of <1000 pulses. Longer bursts take more time and use more power. Note that the keys are independent of each other. It is therefore possible, for example, to have a signal of 100 on one key and a signal of 1000 on another. Refer to Application Note QTAN0002, Secrets of a Successful QTouch Design (downloadable from the Atmel website), for more information on using a scope to measure the pulses and hence determine the burst length. Refer also to the Touch Sensors Design Guide. 2.2.4 Adjacent Key Suppression Technology The device includes the Atmel-patented Adjacent Key Suppression (AKS) technology, to allow the use of tightly spaced keys on a keypad with no loss of selectability by the user. There is one global AKS group, implemented so that only one key in the group may be reported as being touched at any one time. The use of AKS is selected by connecting a 1 M resistor between Vdd and the SNSK0 pin (see Section 4.1 on page 9 for more information). When AKS is disabled, any combinations of keys can enter detect.AT42QT1040 [DATASHEET] 6 9524D–AT42–05/2013 2.2.5 Auto Drift Compensation Signal drift can occur because of changes in Cx and Cs over time. It is crucial that drift be compensated for, otherwise false detections, non-detections, and sensitivity shifts will follow. Drift compensation is performed by making the reference level track the raw signal at a slow rate, but only while there is no detection in effect. The rate of adjustment must be performed slowly otherwise legitimate detections could be ignored. Once an object is sensed and a key is in detect, the drift compensation mechanism ceases, since the signal is legitimately high and should not therefore cause the reference level to change. The QT1040 drift compensation is asymmetric, that is, the reference level drift-compensates in one direction faster than it does in the other. Specifically, it compensates faster for decreasing (towards touch) signals than for increasing (away from touch) signals. The reason for this difference in compensation rates is that increasing signals should not be compensated for quickly, since a nearby finger could be compensated for partially or entirely before even approaching the sense electrode. However, decreasing signals need to be compensated for more quickly. For example, an obstruction over the sense pad (for which the sensor has already made full allowance) could suddenly be removed, leaving the sensor with an artificially elevated reference level and thus become insensitive to touch. In this latter case, the sensor will compensate for the object's removal very quickly, usually in only a few seconds. Negative drift (that is, towards touch) occurs at a rate of ~3 seconds, while positive drift occurs at a rate of ~1 second. Drifting only occurs when no keys are in detect state. 2.2.6 Response Time The QT1040 response time is highly dependent on run mode and burst length, which in turn is dependent on Cs and Cx. With increasing Cs, response time slows, while increasing levels of Cx reduce response time. The response time will also be slower in slow mode due to a longer time between burst measurements. This mode offers an increased detection latency in favor of reduced average current consumption. 2.2.7 Spread Spectrum The QT1040 modulates its internal oscillator by ±7.5% during the measurement burst. This spreads the generated noise over a wider band reducing emission levels. This also reduces susceptibility since there is no longer a single fundamental burst frequency. 2.2.8 Max On-duration If an object or material obstructs the sense pad, the signal may rise enough to create a detection, preventing further operation. To prevent this, the sensor includes a timer known as the Max On-duration feature which monitors detections. If a detection exceeds the timer setting, the sensor performs an automatic recalibration. Max On-duration is set to ~30s.AT42QT1040 [DATASHEET] 7 9524D–AT42–05/2013 3. Wiring and Parts 3.1 Cs Sample Capacitors Cs0 – Cs3 are the charge sensing sample capacitors; normally they are identical in nominal value. The optimal Cs values depend on the corresponding keys electrode design, the thickness of the panel and its dielectric constant. Thicker panels require larger values of Cs. Values can be in the range 2.2 nF (for faster operation) to 22 nF (for best sensitivity); typical values are 4.7 nF to 10 nF. The value of Cs should be chosen such that a light touch on a key mounted in a production unit or a prototype panel causes a reliable detection. The chosen Cs value should never be so large that the key signals exceed ~1000, as reported by the chip in the debug data. The Cs capacitors must be X7R or PPS film type, for stability. For consistent sensitivity, they should have a 10% tolerance. Twenty percent tolerance may cause small differences in sensitivity from key to key and unit to unit. If a key is not used, the Cs capacitor may be omitted. 3.2 Rs Resistors The series resistors Rs0 – Rs3 are in line with the electrode connections (close to the QT1040 chip) and are used to limit electrostatic discharge (ESD) currents and to suppress radio frequency (RF) interference. A typical value is 4.7 k, but up to 20 k can be used if it is found to be of benefit. Although these resistors may be omitted, the device may become susceptible to external noise or radio frequency interference (RFI). For details on how to select these resistors refer to Application Note QTAN0002, Secrets of a Successful QTouch Design, and the Touch Sensors Design Guide, both downloadable from the Touch Technology area of the Atmel website, www.atmel.com. 3.3 LED Traces and Other Switching Signals For advice on LEDs and nearby traces, refer to Application Note QTAN0002, Secrets of a Successful QTouch Design, and the Touch Sensors Design Guide, both downloadable from the Touch Technology area of Atmel’s website, www.atmel.com. 3.4 PCB Cleanliness Modern no-clean flux is generally compatible with capacitive sensing circuits. 3.5 Power Supply See Section 5.2 on page 15 for the power supply range. If the power supply fluctuates slowly with temperature, the device tracks and compensates for these changes automatically with only minor changes in sensitivity. If the supply voltage drifts or shifts quickly, the drift compensation mechanism is not able to keep up, causing sensitivity anomalies or false detections. The usual power supply considerations with QT parts apply to the device. The power should be clean and come from a separate regulator if possible. However, this device is designed to minimize the effects of unstable power, and except in extreme conditions should not require a separate Low Dropout (LDO) regulator. CAUTION: If a PCB is reworked to correct soldering faults relating to the device, or to any associated traces or components, be sure that you fully understand the nature of the flux used during the rework process. Leakage currents from hygroscopic ionic residues can stop capacitive sensors from functioning. If you have any doubts, a thorough cleaning after rework may be the only safe option.AT42QT1040 [DATASHEET] 8 9524D–AT42–05/2013 See under Figure 1.3 on page 4 for suggested regulator manufacturers. It is assumed that a larger bypass capacitor (for example, 1 µF) is somewhere else in the power circuit; for example, near the regulator. To assist with transient regulator stability problems, the QT1040 waits 500 µs any time it wakes up from a sleep state (that is, in Sleep mode) before acquiring, to allow Vdd to fully stabilize. 3.6 VQFN Package Restrictions The central pad on the underside of the VQFN chip should be connected to ground. Do not run any tracks underneath the body of the chip, only ground. Figure 3-1 shows an example of good/bad tracking. Figure 3-1. Examples of Good and Bad Tracking Caution: A regulator IC shared with other logic can result in erratic operation and is not advised. A single ceramic 0.1 µF bypass capacitor, with short traces, should be placed very close to the power pins of the IC. Failure to do so can result in device oscillation, high current consumption, erratic operation, and so on. Example of GOOD tracking Example of BAD trackingAT42QT1040 [DATASHEET] 9 9524D–AT42–05/2013 4. Detailed Operations 4.1 Adjacent Key Suppression The use of AKS is selected by the connection of a 1 M resistor (RAKS resistor) between the SNSK0 pin and either Vdd (AKS mode on) or Vss (AKS mode off). Note: Changing the RAKS option will affect the sensitivity of the particular key. Always check that the sensitivity is suitable after a change. Retune Cs0 if necessary. 4.2 Discrete Outputs There are four discrete outputs (channels 0 to 3), located on pins OUT0 to OUT3. An output pin goes active when the corresponding key is touched. The outputs are open-drain type and are active-low. On the OUT2 pin there is a ~500 ns low pulse occurring approximately 20 ms after a power-up/reset (see Figure 4-1 for an example oscilloscope trace of this pulse at two zoom levels). This pulse may need to be considered from the system design perspective. The discrete outputs have sufficient current sinking capability to directly drive LEDs. Try to limit the sink current to less than 5 mA per output and be cautious if connecting LEDs to a power supply other than Vdd; if the LED supply is higher than Vdd it may cause erratic behavior of the QT1040 and back-power the QT1040 through its I/O pins. Table 4-1. RAKS Resistor RAKS Connected To... Mode Vdd AKS on Vss AKS off The RAKS resistor should always be connected to either Vdd or Vss and should not be changed during operation of the device.AT42QT1040 [DATASHEET] 10 9524D–AT42–05/2013 Figure 4-1. ~500 ns Pulse On OUT2 Pin 4.3 Speed Selection Speed selection is determined by a 1 M resistor (RFS resistor) connected between SNSK1 and either Vdd (Fast Mode) or Vss (Slow Mode). In Fast Mode, the device sleeps for 16 ms between burst acquisitions. In Slow Mode, the device sleeps for 64 ms between acquisitions. Hence, Slow Mode conserves more power but results in slightly less responsiveness. Note: The RFS resistor should always be connected to either Vdd or Vss and not changed during operation of the device. Changing the RFS option will affect the sensitivity of the particular key. Always check that the sensitivity is suitable after a change. Retune Cs1 if necessary. 4.4 Moisture Tolerance The presence of water (condensation, sweat, spilt water, and so on) on a sensor can alter the signal values measured and thereby affect the performance of any capacitive device. The moisture tolerance of QTouch devices can be improved by designing the hardware and fine-tuning the firmware following the recommendations in the application note Atmel AVR3002: Moisture Tolerant QTouch Design (www.atmel.com/Images/doc42017.pdf). Pulse on OUT2 SNS0K OUT2 SNS0K OUT2 Power-on/ ~20 ms Reset Table 4-2. RFS Resistor RFS Connected To Mode Vdd Fast mode Vss Slow modeAT42QT1040 [DATASHEET] 11 9524D–AT42–05/2013 4.5 Calibration Calibration is the process by which the sensor chip assesses the background capacitance on each channel. During calibration, a number of samples are taken in quick succession to get a baseline for the channel reference value. Calibration takes place ~50 ms after power is applied to the device. Calibration also occurs if the Max On-duration is exceeded or a positive re-calibration occurs. 4.6 Debug Mode An added feature to this device is a debug option whereby internal parameters from the IC can be clocked out and monitored externally. Debug mode is entered by shorting the CS3 capacitor (SNSK3 and SNS3 pins) on power-up and removing the short within 5 seconds. Note: If the short is not removed within 5 seconds, debug mode is still entered, but with Channel 3 unusable until a re-calibration occurs. Note that as Channel 3 will show as being in detect, a recalibration will occur after Max On-duration (~30 seconds). Debug CLK pin (OUT0) and Debug Data pin (OUT1) float while debug data is not being output and are driven outputs once debug output starts (that is, not open drain). The serial data is clocked out at a rate of ~200 kHz, MSB first, as in Table 4-3. Table 4-3. Serial Data Output Byte Purpose Notes 0 Frame Number Framing index number 0-255 1 Chip Version Upper nibble: major revision Lower nibble: minor revision 2 Reference 0 Low Byte Unsigned 16-bit integer 3 Reference 0 High Byte 4 Reference 1 Low Byte Unsigned 16-bit integer 5 Reference 1 High Byte 6 Reference 2 Low Byte Unsigned 16-bit integer 7 Reference 2 High Byte 8 Reference 3 Low Byte Unsigned 16-bit integer 9 Reference 3 High Byte 10 Signal 0 Low Byte Unsigned 16-bit integer 11 Signal 0 High Byte 12 Signal 1 Low Byte Unsigned 16-bit integer 13 Signal 1 High Byte 14 Signal 2 Low Byte Unsigned 16-bit integer 15 Signal 2 High Byte 16 Signal 3 Low Byte Unsigned 16-bit integer 17 Signal 3 High ByteAT42QT1040 [DATASHEET] 12 9524D–AT42–05/2013 Bit 7: This bit is set during calibration Bits 4 – 6: Contains the number of keys active Bits 0 – 3: Show the touch status of the corresponding keys Figure 4-2 to Figure 4-5 show the usefulness of the debug data out feature. Channels can be monitored and tweaked to the specific application with great accuracy. 18 Delta 0 Low Byte Signed 16-bit integer 19 Delta 0 High Byte 20 Delta 1 Low Byte Signed 16-bit integer 21 Delta 1 High Byte 22 Delta 2 Low Byte Signed 16-bit integer 23 Delta 2 High Byte 24 Delta 3 Low Byte Signed 16-bit integer 25 Delta 3 High Byte 26 Flags Various operational flags 27 Flags2 Unsigned bytes 28 Status Byte Unsigned byte. See Table 4-4 29 Frame Number Repeat of framing index number in byte 0 Table 4-4. Status Byte (Byte 28) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 CAL Number of Keys (2 – 4) Key 3 Key 2 Key 1 Key 0 Table 4-3. Serial Data Output (Continued) Byte Purpose NotesAT42QT1040 [DATASHEET] 13 9524D–AT42–05/2013 Figure 4-2. Byte Clocked Out (~5 µs Period) Figure 4-3. Byte Following Byte (~ 30 µs Period) Figure 4-4. Full Debug Send (30 Bytes)AT42QT1040 [DATASHEET] 14 9524D–AT42–05/2013 Figure 4-5. Debug Lines Floating Between Debug Data Sends (30 Bytes, ~2 ms to Send)AT42QT1040 [DATASHEET] 15 9524D–AT42–05/2013 5. Specifications 5.1 Absolute Maximum Specifications 5.2 Recommended Operating Conditions 5.3 DC Specifications Vdd –0.5 to +6.0 V Max continuous pin current, any control or drive pin ±10 mA Voltage forced onto any pin –0.5 V to (Vdd + 0.5) V Operating temperature –40°C to +85°C Storage temperature –55°C to +125°C Vdd 1.8 V to 5.5 V Supply ripple + noise ±20 mV maximum Cx capacitance per key 2 to 20 pF Vdd = 5.0 V, Cs = 4.7 nF, Ta = recommended range, unless otherwise noted Parameter Description Min Typ Max Units Notes Vil Low input logic level –0.5 – 0.3 V Vih High input logic level 0.6 × Vdd Vdd Vdd + 0.5 V Vol Low output voltage 0 – 0.7 V 10 mA sink current Voh High output voltage 0.8 × Vdd – Vdd V 10 mA source current Iil Input leakage current – <0.05 1 µA Rrst Internal RST pull-up resistor 20 – 50 k CAUTION: Stresses beyond those listed under Absolute Maximum Specifications may cause permanent damage the device. This is a stress rating only and functional operation of the device at these or other conditions beyo those indicated in the operational sections of this specification is not implied. Exposure to absolute maximu specification conditions for extended periods may affect device reliabilityAT42QT1040 [DATASHEET] 16 9524D–AT42–05/2013 5.4 Timing Specifications 5.5 Power Consumption Parameter Description Min Typ Max Units Notes TBS Burst duration – 3.5 – ms Cx = 5 pF, Cs = 18 nF Fc Burst center frequency – 119 – kHz Fm Burst modulation, percentage –7.5 – +7.5 % TPW Burst pulse width – 2 – µs Vdd (V) AKS Mode (RAKS) Speed (RFS) Power Consumption (µA) 1.8 Off Slow 31 Off Fast 104 On Slow 36 On Fast 114 3.3 Off Slow 100 Off Fast 340 On Slow 117 On Fast 380 5.0 Off Slow 215 Off Fast 710 On Slow 245 On Fast 800AT42QT1040 [DATASHEET] 17 9524D–AT42–05/2013 5.6 Mechanical Dimensions Features • High performance, low power AVR® 8-bit Microcontroller • Advanced RISC architecture – 135 powerful instructions – most single clock cycle execution – 32 × 8 general purpose working registers – Fully static operation – Up to 16MIPS throughput at 16MHz – On-chip 2-cycle multiplier • Non-volatile program and data memories – 64/128Kbytes of in-system self-programmable flash • Endurance: 100,000 write/erase cycles – Optional Boot Code section with independent lock bits • USB boot loader programmed by default in the factory • In-system programming by on-chip boot program hardware activated after reset • True read-while-write operation • All supplied parts are pre-programed with a default USB bootloader – 2K/4K (64K/128K flash version) bytes EEPROM • Endurance: 100,000 write/erase cycles – 4K/8K (64K/128K flash version) bytes internal SRAM – Up to 64Kbytes optional external memory space – Programming lock for software security • JTAG (IEEE std. 1149.1 compliant) interface – Boundary-scan capabilities according to the JTAG standard – Extensive on-chip debug support – Programming of flash, EEPROM, fuses, and lock bits through the JTAG interface • USB 2.0 full-speed/low-speed device and on-the-go module – Complies fully with: – Universal serial bus specification REV 2.0 – On-the-go supplement to the USB 2.0 specification rev 1.0 – Supports data transfer rates up to 12Mbit/s and 1.5Mbit/s • USB full-speed/low speed device module with interrupt on transfer completion – Endpoint 0 for control transfers: up to 64-bytes – Six programmable endpoints with in or out directions and with bulk, interrupt or isochronous transfers – Configurable endpoints size up to 256bytes in double bank mode – Fully independent 832bytes USB DPRAM for endpoint memory allocation – Suspend/resume interrupts – Power-on reset and USB bus reset – 48MHz PLL for full-speed bus operation – USB bus disconnection on microcontroller request • USB OTG reduced host: – Supports host negotiation protocol (HNP) and session request protocol (SRP) for OTG dual-role devices – Provide status and control signals for software implementation of HNP and SRP – Provides programmable times required for HNP and SRP • Peripheral features – Two 8-bit timer/counters with separate prescaler and compare mode – Two16-bit timer/counter with separate prescaler, compare- and capture mode 8-bit Atmel Microcontroller with 64/128Kbytes of ISP Flash and USB Controller AT90USB646 AT90USB647 AT90USB1286 AT90USB1287 7593L–AVR–09/122 7593L–AVR–09/12 AT90USB64/128 – Real time counter with separate oscillator – Four 8-bit PWM channels – Six PWM channels with programmable resolution from 2 to 16 bits – Output compare modulator – 8-channels, 10-bit ADC – Programmable serial USART – Master/slave SPI serial interface – Byte oriented 2-wire serial interface – Programmable watchdog timer with separate on-chip oscillator – On-chip analog comparator – Interrupt and wake-up on pin change • Special microcontroller features – Power-on reset and programmable brown-out detection – Internal calibrated oscillator – External and internal interrupt sources – Six sleep modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby • I/O and packages – 48 programmable I/O lines – 64-lead TQFP and 64-lead QFN • Operating voltages – 2.7 - 5.5V • Operating temperature – Industrial (-40°C to +85°C) • Maximum frequency – 8MHz at 2.7V - industrial range – 16MHz at 4.5V - industrial range3 7593L–AVR–09/12 AT90USB64/128 1. Pin configurations Figure 1-1. Pinout Atmel AT90USB64/128-TQFP. AT90USB90128/64 TQFP64 (INT.7/AIN.1/UVcon) PE7 UVcc D- D+ UGnd UCap VBus (IUID) PE3 (SS/PCINT0) PB0 (INT.6/AIN.0) PE6 (PCINT1/SCLK) PB1 (PDI/PCINT2/MOSI) PB2 (PDO/PCINT3/MISO) PB3 (PCINT4/OC.2A) PB4 (PCINT5/OC.1A) PB5 (PCINT6/OC.1B) PB6 (PCINT7/OC.0A/OC.1C) PB7 (INT4/TOSC1) PE4 (INT.5/TOSC2) PE5 RESET VCC GND XTAL2 XTAL1 (OC0B/SCL/INT0) PD0 (OC2B/SDA/INT1) PD1 (RXD1/INT2) PD2 (TXD1/INT3) PD3 (ICP1) PD4 (XCK1) PD5 PA3 (AD3) PA4 (AD4) PA5 (AD5) PA6 (AD6) PA7 (AD7) PE2 (ALE/HWB) PC7 (A15/IC.3/CLKO) PC6 (A14/OC.3A) PC5 (A13/OC.3B) PC4 (A12/OC.3C) PC3 (A11/T.3) PC2 (A10) PC1 (A9) PC0 (A8) PE1 (RD) PE0 (WR) AVCC GND AREF PF0 (ADC0) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) PF7 (ADC7/TDI) GND VCC PA0 (AD0) PA1 (AD1) PA2 (AD2) (T1) PD6 (T0) PD7 INDEX CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 324 7593L–AVR–09/12 AT90USB64/128 Figure 1-2. Pinout Atmel AT90USB64/128-QFN. Note: The large center pad underneath the MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 33 15 47 46 48 45 44 43 42 41 40 39 38 37 36 35 34 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 AT90USB128/64 (64-lead QFN top view) INDEX CORNER AVCC G N D AREF PF0 (ADC0) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) PF7 (ADC7/TDI) G N D VCC PA0 (AD0) PA1 (AD1) PA2 (AD2) (INT.7/AIN.1/UVcon) PE7 UVcc D- D+ UGnd UCap VBus (IUID) PE3 (SS/PCINT0) PB0 (INT.6/AIN.0) PE6 (PCINT1/SCLK) PB1 (PDI/PCINT2/MOSI) PB2 (PDO/PCINT3/MISO) PB3 (PCINT4/OC.2A) PB4 (PCINT5/OC.1A) PB5 (PCINT6/OC.1B) PB6 (PCI NT7/OC.0A/OC.1C) PB7 (INT4/TOSC1) PE4 (INT.5/TOSC2) PE5 VCC G N D XTAL2 XTAL1 (OC0B/SCL/I NT0) PD0 (OC2B/SDA/I NT1) PD1 (RXD1/I NT2) PD2 (TXD1/I NT3) PD3 (ICP1) PD4 (XCK1) PD5 (T1) PD6 (T0) PD7 RESET PA3 (AD3) PA4 (AD4) PA5 (AD5) PA6 (AD6) PA7 (AD7) PE2 (ALE/HWB) PC7 (A15/IC.3/CLKO) PC6 (A14/OC.3A) PC5 (A13/OC.3B) PC4 (A12/OC.3C) PC3 (A11/T.3) PC2 (A10) PC1 (A9) PC0 (A8) PE1 (RD) PE0 (WR)5 7593L–AVR–09/12 AT90USB64/128 2. Overview The Atmel® AVR® AT90USB64/128 is a low-power CMOS 8-bit microcontroller based on the Atmel® AVR® enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the AT90USB64/128 achieves throughputs approaching 1MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.6 7593L–AVR–09/12 AT90USB64/128 2.1 Block diagram Figure 2-1. Block diagram. The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting PROGRAM COUNTER ST ACK POINTER PROGRAM FLASH MCU CONTROL REGISTER SRAM GENERAL PURPOSE REGISTERS INSTRUCTION REGISTER TIMER/ COUNTERS INSTRUCTION DECODER DATA DIR. REG. PORTB DATA DIR. REG. PORTE DATA DIR. REG. PORT A DATA DIR. REG. PORTD DATA REGISTER PORTB DATA REGISTER PORTE DATA REGISTER PORT A DATA REGISTER PORTD INTERRUPT UNIT EEPROM USART1 SPI ST ATUS REGISTER Z Y X ALU POR TE DRIVERS POR TB DRIVERS POR TF DRIVERS POR TA DRIVERS POR TD DRIVERS POR TC DRIVERS PE7 - PE0 PB7 - PB0 PF7 - PF0 PA7 - P A0 RESET VCC AGND GND AREF XT AL1 XT AL2 CONTROL LINES + - ANALOG COMP ARATOR PC7 - PC0 INTERNAL OSCILLA TOR WATCHDOG TIMER 8-BIT DA TA BUS AVCC USB TIMING AND CONTROL OSCILLA TOR CALIB. OSC DATA DIR. REG. PORT C DATA REGISTER PORT C ON-CHIP DEBUG JTAG TAP PROGRAMMING LOGIC BOUNDARYSCAN DATA DIR. REG. PORT F DATA REGISTER PORT F ADC POR - BOD RESET PD7 - PD0 TWO-WIRE SERIAL INTERFACE PLL7 7593L–AVR–09/12 AT90USB64/128 architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The Atmel AT90USB64/128 provides the following features: 64/128Kbytes of In-System Programmable Flash with Read-While-Write capabilities, 2K/4Kbytes EEPROM, 4K/8K bytes SRAM, 48 general purpose I/O lines, 32 general purpose working registers, Real Time Counter (RTC), four flexible Timer/Counters with compare modes and PWM, one USART, a byte oriented 2-wire Serial Interface, a 8-channels, 10-bit ADC with optional differential input stage with programmable gain, programmable Watchdog Timer with Internal Oscillator, an SPI serial port, IEEE std. 1149.1 compliant JTAG test interface, also used for accessing the On-chip Debug system and programming and six software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or Hardware Reset. In Power-save mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except Asynchronous Timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. The device is manufactured using the Atmel high-density nonvolatile memory technology. The On-chip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program running on the AVR core. The boot program can use any interface to download the application program in the application Flash memory. Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the AT90USB64/128 is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The AT90USB64/128 AVR is supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit emulators, and evaluation kits.8 7593L–AVR–09/12 AT90USB64/128 2.2 Pin descriptions 2.2.1 VCC Digital supply voltage. 2.2.2 GND Ground. 2.2.3 AVCC Analog supply voltage. 2.2.4 Port A (PA7..PA0) Port A is an 8-bit bidirectional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A also serves the functions of various special features of the Atmel AT90USB64/128 as listed on page 78. 2.2.5 Port B (PB7..PB0) Port B is an 8-bit bidirectional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B has better driving capabilities than the other ports. Port B also serves the functions of various special features of the AT90USB64/128 as listed on page 79. 2.2.6 Port C (PC7..PC0) Port C is an 8-bit bidirectional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port C also serves the functions of special features of the AT90USB64/128 as listed on page 82. 2.2.7 Port D (PD7..PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the AT90USB64/128 as listed on page 83. 9 7593L–AVR–09/12 AT90USB64/128 2.2.8 Port E (PE7..PE0) Port E is an 8-bit bidirectional I/O port with internal pull-up resistors (selected for each bit). The Port E output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up resistors are activated. The Port E pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port E also serves the functions of various special features of the AT90USB64/128 as listed on page 86. 2.2.9 Port F (PF7..PF0) Port F serves as analog inputs to the A/D Converter. Port F also serves as an 8-bit bidirectional I/O port, if the A/D Converter is not used. Port pins can provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port F pins that are externally pulled low will source current if the pull-up resistors are activated. The Port F pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will be activated even if a reset occurs. Port F also serves the functions of the JTAG interface. 2.2.10 DUSB Full speed / Low Speed Negative Data Upstream Port. Should be connected to the USB Dconnector pin with a serial 22Ω resistor. 2.2.11 D+ USB Full speed / Low Speed Positive Data Upstream Port. Should be connected to the USB D+ connector pin with a serial 22Ω resistor. 2.2.12 UGND USB Pads Ground. 2.2.13 UVCC USB Pads Internal Regulator Input supply voltage. 2.2.14 UCAP USB Pads Internal Regulator Output supply voltage. Should be connected to an external capacitor (1µF). 2.2.15 VBUS USB VBUS monitor and OTG negociations. 2.2.16 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in Table 9-1 on page 58. Shorter pulses are not guaranteed to generate a reset. 2.2.17 XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.10 7593L–AVR–09/12 AT90USB64/128 2.2.18 XTAL2 Output from the inverting oscillator amplifier. 2.2.19 AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. 2.2.20 AREF This is the analog reference pin for the A/D Converter. 3. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 4. About code examples This documentation contains simple code examples that briefly show how to use various parts of the device. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. These code examples assume that the part specific header file is included before compilation. For I/O registers located in extended I/O map, "IN", "OUT", "SBIS", "SBIC", "CBI", and "SBI" instructions must be replaced with instructions that allow access to extended I/O. Typically "LDS" and "STS" combined with "SBRS", "SBRC", "SBR", and "CBR".11 7593L–AVR–09/12 AT90USB64/128 5. AVR CPU core 5.1 Introduction This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 5.2 Architectural overview Figure 5-1. Block diagram of the AVR architecture. In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is In-System Re-programmable Flash memory. Flash program memory Instruction register Instruction decoder Program counter Control lines 32 x 8 general purpose registrers ALU Status and control I/O lines EEPROM Data bus 8-bit Data SRAM Direct addressing Indirect addressing Interrupt unit SPI unit Watchdog timer Analog comparator I/O Module 2 I/O Module1 I/O Module n12 7593L–AVR–09/12 AT90USB64/128 The fast-access Register File contains 32 × 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every program memory address contains a 16- or 32-bit instruction. Program Flash memory space is divided in two sections, the Boot Program section and the Application Program section. Both sections have dedicated Lock bits for write and read/write protection. The SPM instruction that writes into the Application Flash memory section must reside in the Boot Program section. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. In addition, the Atmel AT90USB64/128 has Extended I/O space from 0x60 - 0xFF in SRAM where only the ST/STS/STD and LD/LDS/LDD instructions can be used. 5.3 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction set summary” on page 423 for a detailed description.13 7593L–AVR–09/12 AT90USB64/128 5.4 Status register The status register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the status register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The status register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. The AVR status register – SREG – is defined as: • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the instruction set reference. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is useful in BCD arithmetic. See the “Instruction set summary” on page 423 for detailed information. • Bit 4 – S: Sign Bit, S = N ⊕ V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction set summary” on page 423 for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction set summary” on page 423 for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction set summary” on page 423 for detailed information. • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction set summary” on page 423 for detailed information. Bit 7 6 5 4 3 2 1 0 I T H S V N Z C SREG Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 014 7593L–AVR–09/12 AT90USB64/128 • Bit 0 – C: Carry Flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction set summary” on page 423 for detailed information. 5.5 General purpose register file The register file is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the register file: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 5-2 shows the structure of the 32 general purpose working registers in the CPU. Figure 5-2. AVR CPU general purpose working registers. Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 5-2, each register is also assigned a data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y-, and Z-pointer registers can be set to index any register in the file. 5.5.1 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 5-3. 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E purpose R15 0x0F working R16 0x10 registers R17 0x11 … R26 0x1A X-register Low byte R27 0x1B X-register High byte R28 0x1C Y-register Low byte R29 0x1D Y-register High byte R30 0x1E Z-register Low byte R31 0x1F Z-register High byte15 7593L–AVR–09/12 AT90USB64/128 Figure 5-3. The X-, Y-, and Z-registers. In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the instruction set reference for details). 5.6 Stack pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x0100. The initial value of the stack pointer is the last address of the internal SRAM. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by three when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by three when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 15 XH XL 0 X-register 7 07 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 07 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 70 7 0 R31 (0x1F) R30 (0x1E) Bit 15 14 13 12 11 10 9 8 SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 76543210 Read/write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 1 0 0 0 0 0 1111111116 7593L–AVR–09/12 AT90USB64/128 5.6.1 RAMPZ - Extended Z-pointer register for ELPM/SPM For ELPM/SPM instructions, the Z-pointer is a concatenation of RAMPZ, ZH, and ZL, as shown in Figure 5-4. Note that LPM is not affected by the RAMPZ setting. Figure 5-4. The Z-pointer used by ELPM and SPM. The actual number of bits is implementation dependent. Unused bits in an implementation will always read as zero. For compatibility with future devices, be sure to write these bits to zero. 5.7 Instruction execution timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 5-5 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Figure 5-5. The parallel instruction fetches and instruction executions. Figure 5-6 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Bit 7 6 5 4 3 2 1 0 RAMPZ7 RAMPZ6 RAMPZ5 RAMPZ4 RAMPZ3 RAMPZ2 RAMPZ1 RAMPZ0 RAMPZ Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit (individually) 7 0 7 0 7 0 RAMPZ ZH ZL Bit (Z-pointer) 23 16 15 8 7 0 clk 1st instruction fetch 1st instruction execute 2nd instruction fetch 2nd instruction execute 3rd instruction fetch 3rd instruction execute 4th instruction fetch T1 T2 T3 T4 CPU17 7593L–AVR–09/12 AT90USB64/128 Figure 5-6. Single cycle ALU operation. 5.8 Reset and interrupt handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate program vector in the program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. Depending on the Program Counter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12 are programmed. This feature improves software security. See the section “Memory programming” on page 359 for details. The lowest addresses in the program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 68. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSEL bit in the MCU Control Register (MCUCR). Refer to “Interrupts” on page 68 for more information. The Reset Vector can also be moved to the start of the Boot Flash section by programming the BOOTRST Fuse, see “Memory programming” on page 359. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Total execution time Register operands fetch ALU operation execute Result write back T1 T2 T3 T4 clkCPU18 7593L–AVR–09/12 AT90USB64/128 Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence. When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in this example. Assembly code example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C code example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ __disable_interrupt(); EECR |= (1< CSn2:0 > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution. However, care must be taken if the other Timer/Counter that shares the same prescaler also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is connected to. 13.3 External clock source An external clock source applied to the Tn pin can be used as Timer/Counter clock (clkTn). The Tn pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 13-1 shows a functional equivalent block diagram of the Tn synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkTn pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 13-1. Tn/T0 pin sampling. The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the Tn pin to the counter is updated. Enabling and disabling of the clock input must be done when Tn has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Tn_sync (To clock select logic) Synchronization Edge detector D Q D Q LE Tn D Q clkI/O97 7593L–AVR–09/12 AT90USB64/128 Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 13-2. Prescaler for synchronous Timer/Counters 13.4 GTCCR – General Timer/Counter Control Register • Bit 7 – TSM: Timer/Counter Synchronization Mode Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the value that is written to the PSRASY and PSRSYNC bits is kept, hence keeping the corresponding prescaler reset signals asserted. This ensures that the corresponding Timer/Counters are halted and can be configured to the same value without the risk of one of them advancing during configuration. When the TSM bit is written to zero, the PSRASY and PSRSYNC bits are cleared by hardware, and the Timer/Counters start counting simultaneously. • Bit 0 – PSRSYNC: Prescaler Reset for Synchronous Timer/Counters When this bit is one, Timer/Counter0 and Timer/Counter1 and Timer/Counter3 prescaler will be Reset. This bit is normally cleared immediately by hardware, except if the TSM bit is set. Note that Timer/Counter0, Timer/Counter1 and Timer/Counter3 share the same prescaler and a reset of this prescaler will affect all timers. PSR10 Clear Tn Tn clkI/O Synchronization Synchronization TIMER/COUNTERn CLOCK SOURCE clkTn TIMER/COUNTERn CLOCK SOURCE clkTn CSn0 CSn1 CSn2 CSn0 CSn1 CSn2 Bit 7 6 5 4 3 2 1 0 TSM – – – – – PSRASY PSRSYNC GTCCR Read/write R/W R R R R R R/W R/W Initial value 0 0 0 0 0 0 0 098 7593L–AVR–09/12 AT90USB64/128 14. 8-bit Timer/Counter0 with PWM Timer/Counter0 is a general purpose 8-bit Timer/Counter module, with two independent Output Compare Units, and with PWM support. It allows accurate program execution timing (event management) and wave generation. The main features are: • Two independent output compare units • Double buffered output compare registers • Clear timer on compare match (auto reload) • Glitch free, phase correct pulse width modulator (PWM) • Variable PWM period • Frequency generator • Three independent interrupt sources (TOV0, OCF0A, and OCF0B) 14.1 Overview A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 14-1. For the actual placement of I/O pins, refer to “Pinout Atmel AT90USB64/128-TQFP.” on page 3. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “8-bit Timer/Counter register description” on page 108. Figure 14-1. 8-bit Timer/Counter block diagram. 14.1.1 Registers The Timer/Counter (TCNT0) and Output Compare Registers (OCR0A and OCR0B) are 8-bit registers. Interrupt request (abbreviated to Int.Req. in the figure) signals are all visible in the Timer Interrupt Flag Register (TIFR0). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK0). TIFR0 and TIMSK0 are not shown in the figure. The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on the T0 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the Clock Select logic is referred to as the timer clock (clkT0). Clock select Timer/Counter DATA BUS OCRnA OCRnB = = TCNTn Waveform generation Waveform generation OCnA OCnB = Fixed TOP value Control logic = 0 TOP BOTTOM Count Clear Direction TOVn (int.req.) OCnA (int.req.) OCnB (Int.Req.) TCCRnA TCCRnB Tn Edge detector (From prescaler) clkTn99 7593L–AVR–09/12 AT90USB64/128 The double buffered Output Compare Registers (OCR0A and OCR0B) are compared with the Timer/Counter value at all times. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pins (OC0A and OC0B). See “Output compare unit” on page 100. for details. The Compare Match event will also set the Compare Flag (OCF0A or OCF0B) which can be used to generate an Output Compare interrupt request. 14.1.2 Definitions Many register and bit references in this section are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 0. A lower case “x” replaces the Output Compare Unit, in this case Compare Unit A or Compare Unit B. However, when using the register or bit defines in a program, the precise form must be used, that is, TCNT0 for accessing Timer/Counter0 counter value and so on. The definitions in the table below are also used extensively throughout the document. 14.2 Timer/Counter clock sources The Timer/Counter can be clocked by an internal or an external clock source. The clock source is selected by the Clock Select logic which is controlled by the Clock Select (CS02:0) bits located in the Timer/Counter Control Register (TCCR0B). For details on clock sources and prescaler, see “Timer/Counter0, Timer/Counter1, and Timer/Counter3 prescalers” on page 96. 14.3 Counter unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 14-2 shows a block diagram of the counter and its surroundings. Figure 14-2. Counter unit block diagram. BOTTOM The counter reaches the BOTTOM when it becomes 0x00. MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR0A Register. The assignment is dependent on the mode of operation. DATA BUS TCNTn Control logic count TOVn (int.req.) Clock select top Tn Edge detector (From prescaler) clkTn bottom direction clear100 7593L–AVR–09/12 AT90USB64/128 Signal description (internal signals): count Increment or decrement TCNT0 by 1. direction Select between increment and decrement. clear Clear TCNT0 (set all bits to zero). clkTn Timer/Counter clock, referred to as clkT0 in the following. top Signalize that TCNT0 has reached maximum value. bottom Signalize that TCNT0 has reached minimum value (zero). Depending of the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT0). clkT0 can be generated from an external or internal clock source, selected by the Clock Select bits (CS02:0). When no clock source is selected (CS02:0 = 0) the timer is stopped. However, the TCNT0 value can be accessed by the CPU, regardless of whether clkT0 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM01 and WGM00 bits located in the Timer/Counter Control Register (TCCR0A) and the WGM02 bit located in the Timer/Counter Control Register B (TCCR0B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare outputs OC0A and OC0B. For more details about advanced counting sequences and waveform generation, see “Modes of operation” on page 103. The Timer/Counter Overflow Flag (TOV0) is set according to the mode of operation selected by the WGM02:0 bits. TOV0 can be used for generating a CPU interrupt. 14.4 Output compare unit The 8-bit comparator continuously compares TCNT0 with the Output Compare Registers (OCR0A and OCR0B). Whenever TCNT0 equals OCR0A or OCR0B, the comparator signals a match. A match will set the Output Compare Flag (OCF0A or OCF0B) at the next timer clock cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is executed. Alternatively, the flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the WGM02:0 bits and Compare Output mode (COM0x1:0) bits. The maximum and bottom signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation (“Modes of operation” on page 103). Figure 14-3 on page 101 shows a block diagram of the Output Compare unit. 101 7593L–AVR–09/12 AT90USB64/128 Figure 14-3. Output Compare Unit, block diagram. The OCR0x Registers are double buffered when using any of the Pulse Width Modulation (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR0x Compare Registers to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR0x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR0x Buffer Register, and if double buffering is disabled the CPU will access the OCR0x directly. 14.4.1 Force output compare In non-PWM waveform generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC0x) bit. Forcing Compare Match will not set the OCF0x Flag or reload/clear the timer, but the OC0x pin will be updated as if a real Compare Match had occurred (the COM0x1:0 bits settings define whether the OC0x pin is set, cleared or toggled). 14.4.2 Compare match blocking by TCNT0 write All CPU write operations to the TCNT0 Register will block any Compare Match that occur in the next timer clock cycle, even when the timer is stopped. This feature allows OCR0x to be initialized to the same value as TCNT0 without triggering an interrupt when the Timer/Counter clock is enabled. 14.4.3 Using the output compare unit Since writing TCNT0 in any mode of operation will block all Compare Matches for one timer clock cycle, there are risks involved when changing TCNT0 when using the Output Compare Unit, independently of whether the Timer/Counter is running or not. If the value written to TCNT0 equals the OCR0x value, the Compare Match will be missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT0 value equal to BOTTOM when the counter is down-counting. OCFnx (int.req.) = (8-bit comparator) OCRnx OCnx DATA BUS TCNTn WGMn1:0 Waveform generator top FOCn COMnX1:0 bottom102 7593L–AVR–09/12 AT90USB64/128 The setup of the OC0x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC0x value is to use the Force Output Compare (FOC0x) strobe bits in Normal mode. The OC0x Registers keep their values even when changing between Waveform Generation modes. Be aware that the COM0x1:0 bits are not double buffered together with the compare value. Changing the COM0x1:0 bits will take effect immediately. 14.5 Compare Match Output Unit The Compare Output mode (COM0x1:0) bits have two functions. The Waveform Generator uses the COM0x1:0 bits for defining the Output Compare (OC0x) state at the next Compare Match. Also, the COM0x1:0 bits control the OC0x pin output source. Figure 14-4 shows a simplified schematic of the logic affected by the COM0x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM0x1:0 bits are shown. When referring to the OC0x state, the reference is for the internal OC0x Register, not the OC0x pin. If a system reset occur, the OC0x Register is reset to “0”. Figure 14-4. Compare Match Output Unit, schematic. The general I/O port function is overridden by the Output Compare (OC0x) from the Waveform Generator if either of the COM0x1:0 bits are set. However, the OC0x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC0x pin (DDR_OC0x) must be set as output before the OC0x value is visible on the pin. The port override function is independent of the Waveform Generation mode. The design of the Output Compare pin logic allows initialization of the OC0x state before the output is enabled. Note that some COM0x1:0 bit settings are reserved for certain modes of operation. See “8-bit Timer/Counter register description” on page 108. 14.5.1 Compare output mode and waveform generation The Waveform Generator uses the COM0x1:0 bits differently in Normal, CTC, and PWM modes. For all modes, setting the COM0x1:0 = 0 tells the Waveform Generator that no action on the OC0x Register is to be performed on the next Compare Match. For compare output actions in PORT DDR D Q D Q OCnx OCnx Pin D Q Waveform generator COMnx1 COMnx0 0 1 DATA BUS FOCn clkI/O103 7593L–AVR–09/12 AT90USB64/128 the non-PWM modes refer to Table 14-1 on page 109. For fast PWM mode, refer to Table 14-2 on page 109, and for phase correct PWM refer to Table 14-3 on page 109. A change of the COM0x1:0 bits state will have effect at the first Compare Match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOC0x strobe bits. 14.6 Modes of operation The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGM02:0) and Compare Output mode (COM0x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM0x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM0x1:0 bits control whether the output should be set, cleared, or toggled at a Compare Match (See “Compare Match Output Unit” on page 102.). For detailed timing information see “Timer/Counter timing diagrams” on page 107. 14.6.1 Normal mode The simplest mode of operation is the Normal mode (WGM02:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV0) will be set in the same timer clock cycle as the TCNT0 becomes zero. The TOV0 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV0 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare Unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 14.6.2 Clear Timer on Compare Match (CTC) mode In Clear Timer on Compare or CTC mode (WGM02:0 = 2), the OCR0A Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT0) matches the OCR0A. The OCR0A defines the top value for the counter, hence also its resolution. This mode allows greater control of the Compare Match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 14-5 on page 104. The counter value (TCNT0) increases until a Compare Match occurs between TCNT0 and OCR0A, and then counter (TCNT0) is cleared.104 7593L–AVR–09/12 AT90USB64/128 Figure 14-5. CTC mode, timing diagram. An interrupt can be generated each time the counter value reaches the TOP value by using the OCF0A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR0A is lower than the current value of TCNT0, the counter will miss the Compare Match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the Compare Match can occur. For generating a waveform output in CTC mode, the OC0A output can be set to toggle its logical level on each Compare Match by setting the Compare Output mode bits to toggle mode (COM0A1:0 = 1). The OC0A value will not be visible on the port pin unless the data direction for the pin is set to output. The waveform generated will have a maximum frequency of fOC0 = fclk_I/O/2 when OCR0A is set to zero (0x00). The waveform frequency is defined by the following equation: The N variable represents the prescale factor (1, 8, 64, 256, or 1024). As for the Normal mode of operation, the TOV0 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. 14.6.3 Fast PWM mode The fast Pulse Width Modulation or fast PWM mode (WGM02:0 = 3 or 7) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM option by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. TOP is defined as 0xFF when WGM2:0 = 3, and OCR0A when WGM2:0 = 7. In noninverting Compare Output mode, the Output Compare (OC0x) is cleared on the Compare Match between TCNT0 and OCR0x, and set at BOTTOM. In inverting Compare Output mode, the output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct PWM mode that use dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), and therefore reduces total system cost. In fast PWM mode, the counter is incremented until the counter value matches the TOP value. The counter is then cleared at the following timer clock cycle. The timing diagram for the fast TCNTn OCn (Toggle) OCnx Interrupt Flag Set Period 1 2 3 4 (COMnx1:0 = 1) f OCnx f clk_I/O 2 ⋅ ⋅ N ( ) 1 + OCRnx = -------------------------------------------------105 7593L–AVR–09/12 AT90USB64/128 PWM mode is shown in Figure 14-6. The TCNT0 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT0 slopes represent Compare Matches between OCR0x and TCNT0. Figure 14-6. Fast PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches TOP. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM0x1:0 to three: Setting the COM0A1:0 bits to one allows the OC0A pin to toggle on Compare Matches if the WGM02 bit is set. This option is not available for the OC0B pin (see Table 14-2 on page 109). The actual OC0x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC0x Register at the Compare Match between OCR0x and TCNT0, and clearing (or setting) the OC0x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 64, 256, or 1024). The extreme values for the OCR0A Register represents special cases when generating a PWM waveform output in the fast PWM mode. If the OCR0A is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR0A equal to MAX will result in a constantly high or low output (depending on the polarity of the output set by the COM0A1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC0x to toggle its logical level on each Compare Match (COM0x1:0 = 1). The waveform generated will have a maximum frequency of fOC0 = fclk_I/O/2 when OCR0A is set to zero. This TCNTn OCRnx update and TOVn Interrupt Flag Set Period 1 2 3 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx Interrupt Flag Set 4 5 6 7 f OCnxPWM f clk_I/O N ⋅ 256 = ------------------106 7593L–AVR–09/12 AT90USB64/128 feature is similar to the OC0A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 14.6.4 Phase correct PWM mode The phase correct PWM mode (WGM02:0 = 1 or 5) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOTTOM. TOP is defined as 0xFF when WGM2:0 = 1, and OCR0A when WGM2:0 = 5. In noninverting Compare Output mode, the Output Compare (OC0x) is cleared on the Compare Match between TCNT0 and OCR0x while up-counting, and set on the Compare Match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. In phase correct PWM mode the counter is incremented until the counter value matches TOP. When the counter reaches TOP, it changes the count direction. The TCNT0 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 14-7. The TCNT0 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT0 slopes represent Compare Matches between OCR0x and TCNT0. Figure 14-7. Phase correct PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM. An inverted PWM output can be generated by setting the COM0x1:0 to three: Setting the COM0A0 bits to TOVn Interrupt Flag Set OCnx Interrupt Flag Set 1 2 3 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx update107 7593L–AVR–09/12 AT90USB64/128 one allows the OC0A pin to toggle on Compare Matches if the WGM02 bit is set. This option is not available for the OC0B pin (see Table 14-3 on page 109). The actual OC0x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC0x Register at the Compare Match between OCR0x and TCNT0 when the counter increments, and setting (or clearing) the OC0x Register at Compare Match between OCR0x and TCNT0 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 64, 256, or 1024). The extreme values for the OCR0A Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR0A is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. At the very start of period 2 in Figure 14-7 on page 106 OCnx has a transition from high to low even though there is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM. There are two cases that give a transition without Compare Match. • OCR0A changes its value from MAX, like in Figure 14-7 on page 106. When the OCR0A value is MAX the OCn pin value is the same as the result of a down-counting Compare Match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match • The timer starts counting from a value higher than the one in OCR0A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up 14.7 Timer/Counter timing diagrams The Timer/Counter is a synchronous design and the timer clock (clkT0) is therefore shown as a clock enable signal in the following figures. The figures include information on when Interrupt Flags are set. Figure 14-8 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. Figure 14-8. Timer/Counter timing diagram, no prescaling. Figure 14-9 on page 108 shows the same timing data, but with the prescaler enabled. f OCnxPCPWM f clk_I/O N ⋅ 510 = ------------------ clkTn (clkI/O/1) TOVn clkI/O TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1108 7593L–AVR–09/12 AT90USB64/128 Figure 14-9. Timer/Counter timing diagram, with prescaler (fclk_I/O/8). Figure 14-10 shows the setting of OCF0B in all modes and OCF0A in all modes except CTC mode and PWM mode, where OCR0A is TOP. Figure 14-10. Timer/Counter timing diagram, setting of OCF0x, with prescaler (fclk_I/O/8). Figure 14-11 shows the setting of OCF0A and the clearing of TCNT0 in CTC mode and fast PWM mode where OCR0A is TOP. Figure 14-11. Timer/Counter timing diagram, clear timer on Compare Match mode, with prescaler (fclk_I/O/8) 14.8 8-bit Timer/Counter register description 14.8.1 TCCR0A – Timer/Counter Control Register A TOVn TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) OCFnx OCRnx TCNTn OCRnx Value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8) OCFnx OCRnx TCNTn (CTC) TOP TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) Bit 7 6 5 4 3 2 1 0 COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 TCCR0A Read/write R/W R/W R/W R/W R R R/W R/W Initial value 0 0 0 0 0 0 0 0109 7593L–AVR–09/12 AT90USB64/128 • Bits 7:6 – COM01A:0: Compare Match Output A Mode These bits control the Output Compare pin (OC0A) behavior. If one or both of the COM0A1:0 bits are set, the OC0A output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC0A pin must be set in order to enable the output driver. When OC0A is connected to the pin, the function of the COM0A1:0 bits depends on the WGM02:0 bit setting. Table 14-1 shows the COM0A1:0 bit functionality when the WGM02:0 bits are set to a normal or CTC mode (non-PWM). Table 14-2 shows the COM0A1:0 bit functionality when the WGM01:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Fast PWM mode” on page 104 for more details. Table 14-3 shows the COM0A1:0 bit functionality when the WGM02:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 106 for more details. Table 14-1. Compare Output mode, non-PWM mode. COM0A1 COM0A0 Description 0 0 Normal port operation, OC0A disconnected. 0 1 Toggle OC0A on Compare Match 1 0 Clear OC0A on Compare Match 1 1 Set OC0A on Compare Match Table 14-2. Compare Output mode, Fast PWM mode (1). COM0A1 COM0A0 Description 0 0 Normal port operation, OC0A disconnected. 0 1 WGM02 = 0: Normal Port Operation, OC0A Disconnected. WGM02 = 1: Toggle OC0A on Compare Match. 1 0 Clear OC0A on Compare Match, set OC0A at TOP 1 1 Set OC0A on Compare Match, clear OC0A at TOP Table 14-3. Compare Output mode, phase correct PWM mode (1). COM0A1 COM0A0 Description 0 0 Normal port operation, OC0A disconnected. 0 1 WGM02 = 0: Normal Port Operation, OC0A Disconnected. WGM02 = 1: Toggle OC0A on Compare Match. 1 0 Clear OC0A on Compare Match when up-counting. Set OC0A on Compare Match when down-counting. 1 1 Set OC0A on Compare Match when up-counting. Clear OC0A on Compare Match when down-counting.110 7593L–AVR–09/12 AT90USB64/128 • Bits 5:4 – COM0B1:0: Compare Match Output B mode These bits control the Output Compare pin (OC0B) behavior. If one or both of the COM0B1:0 bits are set, the OC0B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC0B pin must be set in order to enable the output driver. When OC0B is connected to the pin, the function of the COM0B1:0 bits depends on the WGM02:0 bit setting. Table 14-1 shows the COM0A1:0 bit functionality when the WGM02:0 bits are set to a normal or CTC mode (non-PWM). Table 14-2 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Fast PWM mode” on page 104 for more details. Table 14-3 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 106 for more details. • Bits 3, 2 – Res: Reserved bits These bits are reserved bits in the Atmel AT90USB64/128 and will always read as zero. Table 14-4. Compare Output mode, non-PWM mode. COM01 COM00 Description 0 0 Normal port operation, OC0B disconnected. 0 1 Toggle OC0B on Compare Match 1 0 Clear OC0B on Compare Match 1 1 Set OC0B on Compare Match Table 14-5. Compare Output mode, fast PWM mode (1). COM01 COM00 Description 0 0 Normal port operation, OC0B disconnected. 0 1 Reserved. 1 0 Clear OC0B on Compare Match, set OC0B at TOP. 1 1 Set OC0B on Compare Match, clear OC0B at TOP. Table 14-6. Compare Output mode, phase correct PWM mode (1). COM0A1 COM0A0 Description 0 0 Normal port operation, OC0B disconnected. 0 1 Reserved. 1 0 Clear OC0B on Compare Match when up-counting. Set OC0B on Compare Match when down-counting. 1 1 Set OC0B on Compare Match when up-counting. Clear OC0B on Compare Match when down-counting.111 7593L–AVR–09/12 AT90USB64/128 • Bits 1:0 – WGM01:0: Waveform Generation Mode Combined with the WGM02 bit found in the TCCR0B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 14-7. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes (see “Modes of operation” on page 103). Notes: 1. MAX = 0xFF 2. BOTTOM = 0x00 14.8.2 TCCR0B – Timer/Counter Control Register B • Bit 7 – FOC0A: Force Output Compare A The FOC0A bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR0B is written when operating in PWM mode. When writing a logical one to the FOC0A bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC0A output is changed according to its COM0A1:0 bits setting. Note that the FOC0A bit is implemented as a strobe. Therefore it is the value present in the COM0A1:0 bits that determines the effect of the forced compare. A FOC0A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR0A as TOP. The FOC0A bit is always read as zero. • Bit 6 – FOC0B: Force Output Compare B The FOC0B bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR0B is written when operating in PWM mode. When writing a logical one to the FOC0B bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC0B output is changed according to its COM0B1:0 bits setting. Note that the FOC0B bit is implemented as a Table 14-7. Waveform Generation Mode bit description. Mode WGM2 WGM1 WGM0 Timer/Counter mode of operation TOP Update of OCRx at TOV flag set on (1)(2) 0 0 0 0 Normal 0xFF Immediate MAX 1 0 0 1 PWM, phase correct 0xFF TOP BOTTOM 2 0 1 0 CTC OCRA Immediate MAX 3 0 1 1 Fast PWM 0xFF TOP MAX 4 1 0 0 Reserved – – – 5 1 0 1 PWM, phase correct OCRA TOP BOTTOM 6 1 1 0 Reserved – – – 7 1 1 1 Fast PWM OCRA TOP TOP Bit 7 6 5 4 3 2 1 0 FOC0A FOC0B – – WGM02 CS02 CS01 CS00 TCCR0B Read/write W W R R R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0112 7593L–AVR–09/12 AT90USB64/128 strobe. Therefore it is the value present in the COM0B1:0 bits that determines the effect of the forced compare. A FOC0B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR0B as TOP. The FOC0B bit is always read as zero. • Bits 5:4 – Res: Reserved bits These bits are reserved bits and will always read as zero. • Bit 3 – WGM02: Waveform Generation Mode See the description in the “TCCR0A – Timer/Counter Control Register A” on page 108. • Bits 2:0 – CS02:0: Clock Select The three Clock Select bits select the clock source to be used by the Timer/Counter. If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. 14.8.3 TCNT0 – Timer/Counter Register The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT0 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT0) while the counter is running, introduces a risk of missing a Compare Match between TCNT0 and the OCR0x Registers. 14.8.4 OCR0A – Output Compare Register A Table 14-8. Clock Select bit description. CS02 CS01 CS00 Description 0 0 0 No clock source (Timer/Counter stopped) 0 0 1 clkI/O/(No prescaling) 0 1 0 clkI/O/8 (From prescaler) 0 1 1 clkI/O/64 (From prescaler) 1 0 0 clkI/O/256 (From prescaler) 1 0 1 clkI/O/1024 (From prescaler) 1 1 0 External clock source on T0 pin. Clock on falling edge. 1 1 1 External clock source on T0 pin. Clock on rising edge. Bit 7 6 5 4 3 2 1 0 TCNT0[7:0] TCNT0 Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR0A[7:0] OCR0A Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0113 7593L–AVR–09/12 AT90USB64/128 The Output Compare Register A contains an 8-bit value that is continuously compared with the counter value (TCNT0). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC0A pin. 14.8.5 OCR0B – Output Compare Register B The Output Compare Register B contains an 8-bit value that is continuously compared with the counter value (TCNT0). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC0B pin. 14.8.6 TIMSK0 – Timer/Counter Interrupt Mask Register • Bits 7..3, 0 – Res: Reserved bits These bits are reserved bits and will always read as zero. • Bit 2 – OCIE0B: Timer/Counter Output Compare Match B Interrupt Enable When the OCIE0B bit is written to one, and the I-bit in the Status Register is set, the Timer/Counter Compare Match B interrupt is enabled. The corresponding interrupt is executed if a Compare Match in Timer/Counter occurs, that is, when the OCF0B bit is set in the Timer/Counter Interrupt Flag Register – TIFR0. • Bit 1 – OCIE0A: Timer/Counter0 Output Compare Match A Interrupt Enable When the OCIE0A bit is written to one, and the I-bit in the Status Register is set, the Timer/Counter0 Compare Match A interrupt is enabled. The corresponding interrupt is executed if a Compare Match in Timer/Counter0 occurs, that is, when the OCF0A bit is set in the Timer/Counter 0 Interrupt Flag Register – TIFR0. • Bit 0 – TOIE0: Timer/Counter0 Overflow Interrupt Enable When the TOIE0 bit is written to one, and the I-bit in the Status Register is set, the Timer/Counter0 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter0 occurs, that is, when the TOV0 bit is set in the Timer/Counter 0 Interrupt Flag Register – TIFR0. 14.8.7 TIFR0 – Timer/Counter 0 Interrupt Flag Register • Bits 7..3, 0 – Res: Reserved bits These bits are reserved bits in the Atmel AT90USB64/128 and will always read as zero. Bit 7 6 5 4 3 2 1 0 OCR0B[7:0] OCR0B Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – – – – OCIE0B OCIE0A TOIE0 TIMSK0 Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – – – – OCF0B OCF0A TOV0 TIFR0 Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0114 7593L–AVR–09/12 AT90USB64/128 • Bit 2 – OCF0B: Timer/Counter 0 Output Compare B Match Flag The OCF0B bit is set when a Compare Match occurs between the Timer/Counter and the data in OCR0B – Output Compare Register0 B. OCF0B is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF0B is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE0B (Timer/Counter Compare B Match Interrupt Enable), and OCF0B are set, the Timer/Counter Compare Match Interrupt is executed. • Bit 1 – OCF0A: Timer/Counter 0 Output Compare A Match Flag The OCF0A bit is set when a Compare Match occurs between the Timer/Counter0 and the data in OCR0A – Output Compare Register0. OCF0A is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF0A is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE0A (Timer/Counter0 Compare Match Interrupt Enable), and OCF0A are set, the Timer/Counter0 Compare Match Interrupt is executed. • Bit 0 – TOV0: Timer/Counter0 Overflow Flag The bit TOV0 is set when an overflow occurs in Timer/Counter0. TOV0 is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, TOV0 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE0 (Timer/Counter0 Overflow Interrupt Enable), and TOV0 are set, the Timer/Counter0 Overflow interrupt is executed. The setting of this flag is dependent of the WGM02:0 bit setting. Refer to Table 14-7, “Waveform Generation Mode bit description.” on page 111.115 7593L–AVR–09/12 AT90USB64/128 15. 16-bit Timer/Counter (Timer/Counter1 and Timer/Counter3) The 16-bit Timer/Counter unit allows accurate program execution timing (event management), wave generation, and signal timing measurement. The main features are: • True 16-bit design (that is, allows 16-bit PWM) • Three independent output compare units • Double buffered output compare registers • One input capture unit • Input capture noise canceler • Clear timer on compare match (auto reload) • Glitch-free, phase correct pulse width modulator (PWM) • Variable PWM period • Frequency generator • External event counter • Ten independent interrupt sources (TOV1, OCF1A, OCF1B, OCF1C, ICF1, TOV3, OCF3A, OCF3B, OCF3C, and ICF3) 15.1 Overview Most register and bit references in this section are written in general form. A lower case “n” replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit channel. However, when using the register or bit defines in a program, the precise form must be used, that is, TCNT1 for accessing Timer/Counter1 counter value and so on. A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 15-1 on page 116. For the actual placement of I/O pins, see “Pinout Atmel AT90USB64/128-TQFP.” on page 3. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “16-bit Timer/Counter (Timer/Counter1 and Timer/Counter3)” on page 115. The Power Reduction Timer/Counter1 bit, PRTIM1, in “PRR0 – Power Reduction Register 0” on page 54 must be written to zero to enable Timer/Counter1 module. The Power Reduction Timer/Counter3 bit, PRTIM3, in “PRR1 – Power Reduction Register 1” on page 55 must be written to zero to enable Timer/Counter3 module.116 7593L–AVR–09/12 AT90USB64/128 Figure 15-1. 16-bit Timer/Counter block diagram (1). Note: 1. Refer to Figure 1-1 on page 3, Table 11-6 on page 79, and Table 11-9 on page 82 for Timer/Counter1 and 3 and 3 pin placement and description. 15.1.1 Registers The Timer/Counter (TCNTn), Output Compare Registers (OCRnA/B/C), and Input Capture Register (ICRn) are all 16-bit registers. Special procedures must be followed when accessing the 16- bit registers. These procedures are described in the section “Accessing 16-bit registers” on page 117. The Timer/Counter Control Registers (TCCRnA/B/C) are 8-bit registers and have no CPU access restrictions. Interrupt requests (shorten as Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFRn). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSKn). TIFRn and TIMSKn are not shown in the figure since these registers are shared by other timer units. The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on the Tn pin. The Clock Select logic block controls which clock source and edge the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the clock select logic is referred to as the timer clock (clkTn). The double buffered Output Compare Registers (OCRnA/B/C) are compared with the Timer/Counter value at all time. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pin (OCnA/B/C). ICFn (Int.Req.) TOVn (int.req.) Clock select Timer/Counter DATABUS ICRn = = = TCNTn Waveform generation Waveform generation Waveform generation OCnA OCnB OCnC Noise canceler ICPn = Fixed TOP values Edge detector Control logic = 0 TOP BOTTOM Count Clear Direction OCFnA (Int.Req.) OCFnB (Int.Req.) OCFnC (Int.Req.) TCCRnA TCCRnB TCCRnC ( From Analog Comparator Ouput ) Tn Edge detector (From prescaler) TCLK OCRnC OCRnB OCRnA117 7593L–AVR–09/12 AT90USB64/128 See “Output Compare units” on page 124.. The compare match event will also set the Compare Match Flag (OCFnA/B/C) which can be used to generate an Output Compare interrupt request. The Input Capture Register can capture the Timer/Counter value at a given external (edge triggered) event on either the Input Capture pin (ICPn) or on the Analog Comparator pins (see “Analog Comparator” on page 304) The Input Capture unit includes a digital filtering unit (Noise Canceler) for reducing the chance of capturing noise spikes. The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined by either the OCRnA Register, the ICRn Register, or by a set of fixed values. When using OCRnA as TOP value in a PWM mode, the OCRnA Register can not be used for generating a PWM output. However, the TOP value will in this case be double buffered allowing the TOP value to be changed in run time. If a fixed TOP value is required, the ICRn Register can be used as an alternative, freeing the OCRnA to be used as PWM output. 15.1.2 Definitions The following definitions are used extensively throughout the document: 15.2 Accessing 16-bit registers The TCNTn, OCRnA/B/C, and ICRn are 16-bit registers that can be accessed by the AVR CPU via the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations. Each 16-bit timer has a single 8-bit register for temporary storing of the high byte of the 16- bit access. The same Temporary Register is shared between all 16-bit registers within each 16- bit timer. Accessing the low byte triggers the 16-bit read or write operation. When the low byte of a 16-bit register is written by the CPU, the high byte stored in the Temporary Register, and the low byte written are both copied into the 16-bit register in the same clock cycle. When the low byte of a 16-bit register is read by the CPU, the high byte of the 16-bit register is copied into the Temporary Register in the same clock cycle as the low byte is read. Not all 16-bit accesses uses the Temporary Register for the high byte. Reading the OCRnA/B/C 16-bit registers does not involve using the Temporary Register. To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read, the low byte must be read before the high byte. The following code examples show how to access the 16-bit timer registers assuming that no interrupts updates the temporary register. The same principle can be used directly for accessing the OCRnA/B/C and ICRn Registers. Note that when using “C”, the compiler handles the 16-bit access. BOTTOM The counter reaches the BOTTOM when it becomes 0x0000. MAX The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be one of the fixed values: 0x00FF, 0x01FF, or 0x03FF, or to the value stored in the OCRnA or ICRn Register. The assignment is dependent of the mode of operation.118 7593L–AVR–09/12 AT90USB64/128 Note: 1. See “About code examples” on page 10. The assembly code example returns the TCNTn value in the r17:r16 register pair. It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt occurs between the two instructions accessing the 16-bit register, and the interrupt code updates the temporary register by accessing the same or any other of the 16-bit Timer Registers, then the result of the access outside the interrupt will be corrupted. Therefore, when both the main code and the interrupt code update the temporary register, the main code must disable the interrupts during the 16-bit access. Assembly code examples (1) ... ; Set TCNTn to 0x01FF ldi r17,0x01 ldi r16,0xFF out TCNTnH,r17 out TCNTnL,r16 ; Read TCNTn into r17:r16 in r16,TCNTnL in r17,TCNTnH ... C code examples (1) unsigned int i; ... /* Set TCNTn to 0x01FF */ TCNTn = 0x1FF; /* Read TCNTn into i */ i = TCNTn; ...119 7593L–AVR–09/12 AT90USB64/128 The following code examples show how to do an atomic read of the TCNTn Register contents. Reading any of the OCRnA/B/C or ICRn Registers can be done by using the same principle. Note: 1. See “About code examples” on page 10. The assembly code example returns the TCNTn value in the r17:r16 register pair. Assembly code example (1) TIM16_ReadTCNTn: ; Save global interrupt flag in r18,SREG ; Disable interrupts cli ; Read TCNTn into r17:r16 in r16,TCNTnL in r17,TCNTnH ; Restore global interrupt flag out SREG,r18 ret C code example (1) unsigned int TIM16_ReadTCNTn( void ) { unsigned char sreg; unsigned int i; /* Save global interrupt flag */ sreg = SREG; /* Disable interrupts */ __disable_interrupt(); /* Read TCNTn into i */ i = TCNTn; /* Restore global interrupt flag */ SREG = sreg; return i; }120 7593L–AVR–09/12 AT90USB64/128 The following code examples show how to do an atomic write of the TCNTn Register contents. Writing any of the OCRnA/B/C or ICRn Registers can be done by using the same principle. Note: 1. See “About code examples” on page 10. The assembly code example requires that the r17:r16 register pair contains the value to be written to TCNTn. 15.2.1 Reusing the Temporary High Byte register If writing to more than one 16-bit register where the high byte is the same for all registers written, then the high byte only needs to be written once. However, note that the same rule of atomic operation described previously also applies in this case. 15.3 Timer/Counter clock sources The Timer/Counter can be clocked by an internal or an external clock source. The clock source is selected by the Clock Select logic which is controlled by the Clock Select (CSn2:0) bits located in the Timer/Counter control Register B (TCCRnB). For details on clock sources and prescaler, see Section “Timer/Counter0, Timer/Counter1, and Timer/Counter3 prescalers” on page 96. Assembly code example (1) TIM16_WriteTCNTn: ; Save global interrupt flag in r18,SREG ; Disable interrupts cli ; Set TCNTn to r17:r16 out TCNTnH,r17 out TCNTnL,r16 ; Restore global interrupt flag out SREG,r18 ret C code example (1) void TIM16_WriteTCNTn( unsigned int i ) { unsigned char sreg; unsigned int i; /* Save global interrupt flag */ sreg = SREG; /* Disable interrupts */ __disable_interrupt(); /* Set TCNTn to i */ TCNTn = i; /* Restore global interrupt flag */ SREG = sreg; }121 7593L–AVR–09/12 AT90USB64/128 15.4 Counter unit The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit. Figure 15-2 shows a block diagram of the counter and its surroundings. Figure 15-2. Counter unit block diagram. Signal description (internal signals): Count Increment or decrement TCNTn by 1. Direction Select between increment and decrement. Clear Clear TCNTn (set all bits to zero). clkTn Timer/Counter clock. TOP Signalize that TCNTn has reached maximum value. BOTTOM Signalize that TCNTn has reached minimum value (zero). The 16-bit counter is mapped into two 8-bit I/O memory locations: Counter High (TCNTnH) containing the upper eight bits of the counter, and Counter Low (TCNTnL) containing the lower eight bits. The TCNTnH Register can only be indirectly accessed by the CPU. When the CPU does an access to the TCNTnH I/O location, the CPU accesses the high byte temporary register (TEMP). The temporary register is updated with the TCNTnH value when the TCNTnL is read, and TCNTnH is updated with the temporary register value when TCNTnL is written. This allows the CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus. It is important to notice that there are special cases of writing to the TCNTn Register when the counter is counting that will give unpredictable results. The special cases are described in the sections where they are of importance. Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkTn). The clkTn can be generated from an external or internal clock source, selected by the Clock Select bits (CSn2:0). When no clock source is selected (CSn2:0 = 0) the timer is stopped. However, the TCNTn value can be accessed by the CPU, independent of whether clkTn is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the Waveform Generation mode bits (WGMn3:0) located in the Timer/Counter Control Registers A and B (TCCRnA and TCCRnB). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare outputs OCnx. For more details about advanced counting sequences and waveform generation, see Section “Modes of operation” on page 127. TEMP (8-bit) DATA BUS (8-bit) TCNTn (16-bit counter) TCNTnH (8-bit) TCNTnL (8-bit) Control logic Count Clear Direction TOVn (Int.Req.) Clock select TOP BOTTOM Tn Edge detector (From prescaler) clkTn122 7593L–AVR–09/12 AT90USB64/128 The Timer/Counter Overflow Flag (TOVn) is set according to the mode of operation selected by the WGMn3:0 bits. TOVn can be used for generating a CPU interrupt. 15.5 Input Capture unit The Timer/Counter incorporates an Input Capture unit that can capture external events and give them a time-stamp indicating time of occurrence. The external signal indicating an event, or multiple events, can be applied via the ICPn pin or alternatively, for the Timer/Counter1 only, via the Analog Comparator unit. The time-stamps can then be used to calculate frequency, duty-cycle, and other features of the signal applied. Alternatively the time-stamps can be used for creating a log of the events. The Input Capture unit is illustrated by the block diagram shown in Figure 15-3. The elements of the block diagram that are not directly a part of the input capture unit are gray shaded. The small “n” in register and bit names indicates the Timer/Counter number. Figure 15-3. Input Capture Unit block diagram. Note: The Analog Comparator Output (ACO) can only trigger the Timer/Counter1 ICP – not Timer/Counter3, 4, or 5. When a change of the logic level (an event) occurs on the Input Capture Pin (ICPn), alternatively on the analog Comparator output (ACO), and this change confirms to the setting of the edge detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter (TCNTn) is written to the Input Capture Register (ICRn). The Input Capture Flag (ICFn) is set at the same system clock as the TCNTn value is copied into ICRn Register. If enabled (TICIEn = 1), the input capture flag generates an input capture interrupt. The ICFn flag is automatically cleared when the interrupt is executed. Alternatively the ICFn flag can be cleared by software by writing a logical one to its I/O bit location. ICFn (int.req.) Analog comparator WRITE ICRn (16-bit register) ICRnH (8-bit) Noise canceler ICPn Edge detector TEMP (8-bit) DATA BUS (8-bit) ICRnL (8-bit) TCNTn (16-bit counter) TCNTnH (8-bit) TCNTnL (8-bit) ACO* ACIC* ICNC ICES123 7593L–AVR–09/12 AT90USB64/128 Reading the 16-bit value in the Input Capture Register (ICRn) is done by first reading the low byte (ICRnL) and then the high byte (ICRnH). When the low byte is read the high byte is copied into the high byte Temporary Register (TEMP). When the CPU reads the ICRnH I/O location it will access the TEMP Register. The ICRn Register can only be written when using a Waveform Generation mode that utilizes the ICRn Register for defining the counter’s TOP value. In these cases the Waveform Generation mode (WGMn3:0) bits must be set before the TOP value can be written to the ICRn Register. When writing the ICRn Register the high byte must be written to the ICRnH I/O location before the low byte is written to ICRnL. For more information on how to access the 16-bit registers refer to Section “Accessing 16-bit registers” on page 117. 15.5.1 Input Capture Trigger Source The main trigger source for the input capture unit is the Input Capture Pin (ICPn). Timer/Counter1 can alternatively use the analog comparator output as trigger source for the input capture unit. The Analog Comparator is selected as trigger source by setting the analog Comparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register (ACSR). Be aware that changing trigger source can trigger a capture. The input capture flag must therefore be cleared after the change. Both the Input Capture Pin (ICPn) and the Analog Comparator output (ACO) inputs are sampled using the same technique as for the Tn pin (Figure 13-1 on page 96). The edge detector is also identical. However, when the noise canceler is enabled, additional logic is inserted before the edge detector, which increases the delay by four system clock cycles. Note that the input of the noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Waveform Generation mode that uses ICRn to define TOP. An input capture can be triggered by software by controlling the port of the ICPn pin. 15.5.2 Noise Canceler The Noise Canceler improves noise immunity by using a simple digital filtering scheme. The noise canceler input is monitored over four samples, and all four must be equal for changing the output that in turn is used by the edge detector. The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNCn) bit in Timer/Counter Control Register B (TCCRnB). When enabled the noise canceler introduces additional four system clock cycles of delay from a change applied to the input, to the update of the ICRn Register. The noise canceler uses the system clock and is therefore not affected by the prescaler. 15.5.3 Using the Input Capture unit The main challenge when using the Input Capture unit is to assign enough processor capacity for handling the incoming events. The time between two events is critical. If the processor has not read the captured value in the ICRn Register before the next event occurs, the ICRn will be overwritten with a new value. In this case the result of the capture will be incorrect. When using the Input Capture interrupt, the ICRn Register should be read as early in the interrupt handler routine as possible. Even though the Input Capture interrupt has relatively high priority, the maximum interrupt response time is dependent on the maximum number of clock cycles it takes to handle any of the other interrupt requests.124 7593L–AVR–09/12 AT90USB64/128 Using the Input Capture unit in any mode of operation when the TOP value (resolution) is actively changed during operation, is not recommended. Measurement of an external signal’s duty cycle requires that the trigger edge is changed after each capture. Changing the edge sensing must be done as early as possible after the ICRn Register has been read. After a change of the edge, the Input Capture Flag (ICFn) must be cleared by software (writing a logical one to the I/O bit location). For measuring frequency only, the clearing of the ICFn Flag is not required (if an interrupt handler is used). 15.6 Output Compare units The 16-bit comparator continuously compares TCNTn with the Output Compare Register (OCRnx). If TCNT equals OCRnx the comparator signals a match. A match will set the Output Compare Flag (OCFnx) at the next timer clock cycle. If enabled (OCIEnx = 1), the Output Compare Flag generates an Output Compare interrupt. The OCFnx Flag is automatically cleared when the interrupt is executed. Alternatively the OCFnx Flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the Waveform Generation mode (WGMn3:0) bits and Compare Output mode (COMnx1:0) bits. The TOP and BOTTOM signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation (see “Modes of operation” on page 127) A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (that is, counter resolution). In addition to the counter resolution, the TOP value defines the period time for waveforms generated by the Waveform Generator. Figure 15-4 shows a block diagram of the Output Compare unit. The small “n” in the register and bit names indicates the device number (n = n for Timer/Counter n), and the “x” indicates Output Compare unit (A/B/C). The elements of the block diagram that are not directly a part of the Output Compare unit are gray shaded. Figure 15-4. Output Compare Unit, block diagram. OCFnx (int.req.) = (16-bit comparator ) OCRnx buffer (16-bit register) OCRnxH buf. (8-bit) OCnx TEMP (8-bit) DATA BUS (8-bit) OCRnxL buf. (8-bit) TCNTn (16-bit counter) TCNTnH (8-bit) TCNTnL (8-bit) WGMn3:0 COMnx1:0 OCRnx (16-bit register) OCRnxH (8-bit) OCRnxL (8-bit) Waveform generator TOP BOTTOM125 7593L–AVR–09/12 AT90USB64/128 The OCRnx Register is double buffered when using any of the twelve Pulse Width Modulation (PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCRnx Compare Register to either TOP or BOTTOM of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCRnx Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCRnx Buffer Register, and if double buffering is disabled the CPU will access the OCRnx directly. The content of the OCR1x (Buffer or Compare) Register is only changed by a write operation (the Timer/Counter does not update this register automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the high byte temporary register (TEMP). However, it is a good practice to read the low byte first as when accessing other 16-bit registers. Writing the OCRnx Registers must be done via the TEMP Register since the compare of all 16 bits is done continuously. The high byte (OCRnxH) has to be written first. When the high byte I/O location is written by the CPU, the TEMP Register will be updated by the value written. Then when the low byte (OCRnxL) is written to the lower eight bits, the high byte will be copied into the upper 8-bits of either the OCRnx buffer or OCRnx Compare Register in the same system clock cycle. For more information of how to access the 16-bit registers refer to Section “Accessing 16-bit registers” on page 117. 15.6.1 Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOCnx) bit. Forcing compare match will not set the OCFnx Flag or reload/clear the timer, but the OCnx pin will be updated as if a real compare match had occurred (the COMn1:0 bits settings define whether the OCnx pin is set, cleared or toggled). 15.6.2 Compare Match Blocking by TCNTn write All CPU writes to the TCNTn Register will block any compare match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCRnx to be initialized to the same value as TCNTn without triggering an interrupt when the Timer/Counter clock is enabled. 15.6.3 Using the Output Compare unit Since writing TCNTn in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNTn when using any of the Output Compare channels, independent of whether the Timer/Counter is running or not. If the value written to TCNTn equals the OCRnx value, the compare match will be missed, resulting in incorrect waveform generation. Do not write the TCNTn equal to TOP in PWM modes with variable TOP values. The compare match for the TOP will be ignored and the counter will continue to 0xFFFF. Similarly, do not write the TCNTn value equal to BOTTOM when the counter is counting down. The setup of the OCnx should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OCnx value is to use the Force Output Compare (FOCnx) strobe bits in Normal mode. The OCnx Register keeps its value even when changing between Waveform Generation modes. Be aware that the COMnx1:0 bits are not double buffered together with the compare value. Changing the COMnx1:0 bits will take effect immediately.126 7593L–AVR–09/12 AT90USB64/128 15.7 Compare Match Output unit The Compare Output mode (COMnx1:0) bits have two functions. The Waveform Generator uses the COMnx1:0 bits for defining the Output Compare (OCnx) state at the next compare match. Secondly the COMnx1:0 bits control the OCnx pin output source. Figure 15-5 shows a simplified schematic of the logic affected by the COMnx1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COMnx1:0 bits are shown. When referring to the OCnx state, the reference is for the internal OCnx Register, not the OCnx pin. If a system reset occur, the OCnx Register is reset to “0”. Figure 15-5. Compare Match Output unit, schematic. The general I/O port function is overridden by the Output Compare (OCnx) from the Waveform Generator if either of the COMnx1:0 bits are set. However, the OCnx pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OCnx pin (DDR_OCnx) must be set as output before the OCnx value is visible on the pin. The port override function is generally independent of the Waveform Generation mode, but there are some exceptions. Refer to Table 15-1 on page 137, Table 15-2 on page 137, and Table 15-3 on page 138 for details. The design of the Output Compare pin logic allows initialization of the OCnx state before the output is enabled. Note that some COMnx1:0 bit settings are reserved for certain modes of operation. See “16-bit Timer/Counter (Timer/Counter1 and Timer/Counter3)” on page 115. The COMnx1:0 bits have no effect on the Input Capture unit. 15.7.1 Compare Output mode and Waveform generation The Waveform Generator uses the COMnx1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COMnx1:0 = 0 tells the Waveform Generator that no action on the OCnx Register is to be performed on the next compare match. For compare output actions in the PORT DDR D Q D Q OCnx OCnx pin D Q Waveform generator COMnx1 COMnx0 0 1 DATA BUS FOCnx clkI/O127 7593L–AVR–09/12 AT90USB64/128 non-PWM modes refer to Table 15-1 on page 137. For fast PWM mode refer to Table 15-2 on page 137, and for phase correct and phase and frequency correct PWM refer to Table 15-3 on page 138. A change of the COMnx1:0 bits state will have effect at the first compare match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOCnx strobe bits. 15.8 Modes of operation The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGMn3:0) and Compare Output mode (COMnx1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COMnx1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COMnx1:0 bits control whether the output should be set, cleared or toggle at a compare match (see “Compare Match Output unit” on page 126). For detailed timing information refer to “Timer/Counter timing diagrams” on page 134. 15.8.1 Normal mode The simplest mode of operation is the Normal mode (WGMn3:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOVn) will be set in the same timer clock cycle as the TCNTn becomes zero. The TOVn Flag in this case behaves like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOVn Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Input Capture unit is easy to use in Normal mode. However, observe that the maximum interval between the external events must not exceed the resolution of the counter. If the interval between events are too long, the timer overflow interrupt or the prescaler must be used to extend the resolution for the capture unit. The Output Compare units can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 15.8.2 Clear Timer on Compare Match (CTC) mode In Clear Timer on Compare or CTC mode (WGMn3:0 = 4 or 12), the OCRnA or ICRn Register are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNTn) matches either the OCRnA (WGMn3:0 = 4) or the ICRn (WGMn3:0 = 12). The OCRnA or ICRn define the top value for the counter, hence also its resolution. This mode allows greater control of the compare match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 15-6 on page 128. The counter value (TCNTn) increases until a compare match occurs with either OCRnA or ICRn, and then counter (TCNTn) is cleared.128 7593L–AVR–09/12 AT90USB64/128 Figure 15-6. CTC mode, timing diagram. An interrupt can be generated at each time the counter value reaches the TOP value by either using the OCFnA or ICFn Flag according to the register used to define the TOP value. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing the TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCRnA or ICRn is lower than the current value of TCNTn, the counter will miss the compare match. The counter will then have to count to its maximum value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur. In many cases this feature is not desirable. An alternative will then be to use the fast PWM mode using OCRnA for defining TOP (WGMn3:0 = 15) since the OCRnA then will be double buffered. For generating a waveform output in CTC mode, the OCnA output can be set to toggle its logical level on each compare match by setting the Compare Output mode bits to toggle mode (COMnA1:0 = 1). The OCnA value will not be visible on the port pin unless the data direction for the pin is set to output (DDR_OCnA = 1). The waveform generated will have a maximum frequency of fOCnA = fclk_I/O/2 when OCRnA is set to zero (0x0000). The waveform frequency is defined by the following equation: The N variable represents the prescaler factor (1, 8, 64, 256, or 1024). As for the Normal mode of operation, the TOVn Flag is set in the same timer clock cycle that the counter counts from MAX to 0x0000. 15.8.3 Fast PWM mode The fast Pulse Width Modulation or fast PWM mode (WGMn3:0 = 5, 6, 7, 14, or 15) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OCnx) is set on the compare match between TCNTn and OCRnx, and cleared at TOP. In inverting Compare Output mode output is cleared on compare match and set at TOP. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct and phase and frequency correct PWM modes that use dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), hence reduces total system cost. TCNTn OCnA (Toggle) OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (interrupt on TOP) Period 1 2 3 4 (COMnA1:0 = 1) f OCnA f clk_I/O 2 ⋅ ⋅ N ( ) 1 + OCRnA = --------------------------------------------------129 7593L–AVR–09/12 AT90USB64/128 The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to 0x0003), and the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM resolution in bits can be calculated by using the following equation: In fast PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGMn3:0 = 5, 6, or 7), the value in ICRn (WGMn3:0 = 14), or the value in OCRnA (WGMn3:0 = 15). The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 15-7. The figure shows fast PWM mode when OCRnA or ICRn is used to define TOP. The TCNTn value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNTn slopes represent compare matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set when a compare match occurs. Figure 15-7. Fast PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOVn) is set each time the counter reaches TOP. In addition the OCnA or ICFn Flag is set at the same timer clock cycle as TOVn is set when either OCRnA or ICRn is used for defining the TOP value. If one of the interrupts are enabled, the interrupt handler routine can be used for updating the TOP and compare values. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a compare match will never occur between the TCNTn and the OCRnx. Note that when using fixed TOP values the unused bits are masked to zero when any of the OCRnx Registers are written. The procedure for updating ICRn differs from updating OCRnA when used for defining the TOP value. The ICRn Register is not double buffered. This means that if ICRn is changed to a low value when the counter is running with none or a low prescaler value, there is a risk that the new ICRn value written is lower than the current value of TCNTn. The result will then be that the counter will miss the compare match at the TOP value. The counter will then have to count to the MAX value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur. The OCRnA Register however, is double buffered. This feature allows the OCRnA I/O location RFPWM log( ) TOP + 1 log( ) 2 = ----------------------------------- TCNTn OCRnx / TOP Update and TOVn Interrupt Flag Set and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) Period 1 2 3 4 5 6 7 8 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3)130 7593L–AVR–09/12 AT90USB64/128 to be written anytime. When the OCRnA I/O location is written the value written will be put into the OCRnA Buffer Register. The OCRnA Compare Register will then be updated with the value in the Buffer Register at the next timer clock cycle the TCNTn matches TOP. The update is done at the same timer clock cycle as the TCNTn is cleared and the TOVn Flag is set. Using the ICRn Register for defining TOP works well when using fixed TOP values. By using ICRn, the OCRnA Register is free to be used for generating a PWM output on OCnA. However, if the base PWM frequency is actively changed (by changing the TOP value), using the OCRnA as TOP is clearly a better choice due to its double buffer feature. In fast PWM mode, the compare units allow generation of PWM waveforms on the OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COMnx1:0 to three (see Table on page 137). The actual OCnx value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OCnx). The PWM waveform is generated by setting (or clearing) the OCnx Register at the compare match between OCRnx and TCNTn, and clearing (or setting) the OCnx Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCRnx Register represents special cases when generating a PWM waveform output in the fast PWM mode. If the OCRnx is set equal to BOTTOM (0x0000) the output will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCRnx equal to TOP will result in a constant high or low output (depending on the polarity of the output set by the COMnx1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OCnA to toggle its logical level on each compare match (COMnA1:0 = 1). This applies only if OCR1A is used to define the TOP value (WGM13:0 = 15). The waveform generated will have a maximum frequency of fOCnA = fclk_I/O/2 when OCRnA is set to zero (0x0000). This feature is similar to the OCnA toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 15.8.4 Phase correct PWM mode The phase correct Pulse Width Modulation or phase correct PWM mode (WGMn3:0 = 1, 2, 3, 10, or 11) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dualslope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OCnx) is cleared on the compare match between TCNTn and OCRnx while upcounting, and set on the compare match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or defined by either ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to f OCnxPWM f clk_I/O N ⋅ ( ) 1 + TOP = -----------------------------------131 7593L–AVR–09/12 AT90USB64/128 0x0003), and the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM resolution in bits can be calculated by using the following equation: In phase correct PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGMn3:0 = 1, 2, or 3), the value in ICRn (WGMn3:0 = 10), or the value in OCRnA (WGMn3:0 = 11). The counter has then reached the TOP and changes the count direction. The TCNTn value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 15-8. The figure shows phase correct PWM mode when OCRnA or ICRn is used to define TOP. The TCNTn value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNTn slopes represent compare matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set when a compare match occurs. Figure 15-8. Phase correct PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOVn) is set each time the counter reaches BOTTOM. When either OCRnA or ICRn is used for defining the TOP value, the OCnA or ICFn Flag is set accordingly at the same timer clock cycle as the OCRnx Registers are updated with the double buffer value (at TOP). The Interrupt Flags can be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a compare match will never occur between the TCNTn and the OCRnx. Note that when using fixed TOP values, the unused bits are masked to zero when any of the OCRnx Registers are written. As the third period shown in Figure 15-8 illustrates, changing the TOP actively while the Timer/Counter is running in the phase correct mode can result in an unsymmetrical output. The reason for this can be found in the time of update of the OCRnx RegRPCPWM log( ) TOP + 1 log( ) 2 = ----------------------------------- OCRnx/TOP Update and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (interrupt on TOP) 1 2 3 4 TOVn Interrupt Flag Set (interrupt on Bottom) TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3)132 7593L–AVR–09/12 AT90USB64/128 ister. Since the OCRnx update occurs at TOP, the PWM period starts and ends at TOP. This implies that the length of the falling slope is determined by the previous TOP value, while the length of the rising slope is determined by the new TOP value. When these two values differ the two slopes of the period will differ in length. The difference in length gives the unsymmetrical result on the output. It is recommended to use the phase and frequency correct mode instead of the phase correct mode when changing the TOP value while the Timer/Counter is running. When using a static TOP value there are practically no differences between the two modes of operation. In phase correct PWM mode, the compare units allow generation of PWM waveforms on the OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COMnx1:0 to three (see Table 15-3 on page 138). The actual OCnx value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OCnx). The PWM waveform is generated by setting (or clearing) the OCnx Register at the compare match between OCRnx and TCNTn when the counter increments, and clearing (or setting) the OCnx Register at compare match between OCRnx and TCNTn when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCRnx Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCRnx is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. If OCR1A is used to define the TOP value (WGM13:0 = 11) and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle. 15.8.5 Phase and frequency correct PWM mode The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM mode (WGMn3:0 = 8 or 9) provides a high resolution phase and frequency correct PWM waveform generation option. The phase and frequency correct PWM mode is, like the phase correct PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OCnx) is cleared on the compare match between TCNTn and OCRnx while upcounting, and set on the compare match while downcounting. In inverting Compare Output mode, the operation is inverted. The dual-slope operation gives a lower maximum operation frequency compared to the single-slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The main difference between the phase correct, and the phase and frequency correct PWM mode is the time the OCRnx Register is updated by the OCRnx Buffer Register, (see Figure 15- 8 on page 131 and Figure 15-9 on page 133). The PWM resolution for the phase and frequency correct PWM mode can be defined by either ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to 0x0003), and f OCnxPCPWM f clk_I/O 2 ⋅ ⋅ N TOP = ----------------------------133 7593L–AVR–09/12 AT90USB64/128 the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM resolution in bits can be calculated using the following equation: In phase and frequency correct PWM mode the counter is incremented until the counter value matches either the value in ICRn (WGMn3:0 = 8), or the value in OCRnA (WGMn3:0 = 9). The counter has then reached the TOP and changes the count direction. The TCNTn value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency correct PWM mode is shown on Figure 15-9. The figure shows phase and frequency correct PWM mode when OCRnA or ICRn is used to define TOP. The TCNTn value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes noninverted and inverted PWM outputs. The small horizontal line marks on the TCNTn slopes represent compare matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set when a compare match occurs. Figure 15-9. Phase and frequency correct PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOVn) is set at the same timer clock cycle as the OCRnx Registers are updated with the double buffer value (at BOTTOM). When either OCRnA or ICRn is used for defining the TOP value, the OCnA or ICFn Flag set when TCNTn has reached TOP. The Interrupt Flags can then be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a compare match will never occur between the TCNTn and the OCRnx. As Figure 15-9 shows the output generated is, in contrast to the phase correct mode, symmetrical in all periods. Since the OCRnx Registers are updated at BOTTOM, the length of the rising and the falling slopes will always be equal. This gives symmetrical output pulses and is therefore frequency correct. RPFCPWM log( ) TOP + 1 log( ) 2 = ----------------------------------- OCRnx/TOP Updateand TOVn Interrupt Flag Set (interrupt on Bottom) OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (interrupt on TOP) 1 2 3 4 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3)134 7593L–AVR–09/12 AT90USB64/128 Using the ICRn Register for defining TOP works well when using fixed TOP values. By using ICRn, the OCRnA Register is free to be used for generating a PWM output on OCnA. However, if the base PWM frequency is actively changed by changing the TOP value, using the OCRnA as TOP is clearly a better choice due to its double buffer feature. In phase and frequency correct PWM mode, the compare units allow generation of PWM waveforms on the OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COMnx1:0 to three (see Table 15-3 on page 138). The actual OCnx value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OCnx). The PWM waveform is generated by setting (or clearing) the OCnx Register at the compare match between OCRnx and TCNTn when the counter increments, and clearing (or setting) the OCnx Register at compare match between OCRnx and TCNTn when the counter decrements. The PWM frequency for the output when using phase and frequency correct PWM can be calculated by the following equation: The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCRnx Register represents special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCRnx is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be set to high for noninverted PWM mode. For inverted PWM the output will have the opposite logic values. If OCR1A is used to define the TOP value (WGM13:0 = 9) and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle. 15.9 Timer/Counter timing diagrams The Timer/Counter is a synchronous design and the timer clock (clkTn) is therefore shown as a clock enable signal in the following figures. The figures include information on when Interrupt Flags are set, and when the OCRnx Register is updated with the OCRnx buffer value (only for modes utilizing double buffering). Figure 15-10 shows a timing diagram for the setting of OCFnx. Figure 15-10. Timer/Counter timing diagram, setting of OCFnx, no prescaling. Figure 15-11 on page 135 shows the same timing data, but with the prescaler enabled. f OCnxPFCPWM f clk_I/O 2 ⋅ ⋅ N TOP = ---------------------------- clkTn (clkI/O/1) OCFnx clkI/O OCRnx TCNTn OCRnx value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2135 7593L–AVR–09/12 AT90USB64/128 Figure 15-11. Timer/Counter timing diagram, setting of OCFnx, with prescaler (fclk_I/O/8). Figure 15-12 shows the count sequence close to TOP in various modes. When using phase and frequency correct PWM mode the OCRnx Register is updated at BOTTOM. The timing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by BOTTOM+1 and so on. The same renaming applies for modes that set the TOVn Flag at BOTTOM. Figure 15-12. Timer/Counter timing diagram, no prescaling. Figure 15-13 on page 136 shows the same timing data, but with the prescaler enabled. OCFnx OCRnx TCNTn OCRnx value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8) TOVn (FPWM) and ICFn (if used as TOP) OCRnx (update at TOP) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2 Old OCRnx value New OCRnx value TOP - 1 TOP BOTTOM BOTTOM + 1 clkTn (clkI/O/1) clkI/O136 7593L–AVR–09/12 AT90USB64/128 Figure 15-13. Timer/Counter timing diagram, with prescaler (fclk_I/O/8). 15.10 16-bit Timer/Counter register description 15.10.1 TCCR1A – Timer/Counter1 Control Register A 15.10.2 TCCR3A – Timer/Counter3 Control Register A • Bit 7:6 – COMnA1:0: Compare Output Mode for Channel A • Bit 5:4 – COMnB1:0: Compare Output Mode for Channel B • Bit 3:2 – COMnC1:0: Compare Output Mode for Channel C The COMnA1:0, COMnB1:0, and COMnC1:0 control the output compare pins (OCnA, OCnB, and OCnC respectively) behavior. If one or both of the COMnA1:0 bits are written to one, the OCnA output overrides the normal port functionality of the I/O pin it is connected to. If one or both of the COMnB1:0 bits are written to one, the OCnB output overrides the normal port functionality of the I/O pin it is connected to. If one or both of the COMnC1:0 bits are written to one, the OCnC output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OCnA, OCnB or OCnC pin must be set in order to enable the output driver. TOVn (FPWM) and ICFn (if used as TOP) OCRnx (update at TOP) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP TOP - 1 TOP - 2 Old OCRnx value New OCRnx value TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clk Tn (clkI/O /8) Bit 7 6 5 4 3 2 1 0 COM1A1 COM1A0 COM1B1 COM1B0 COM1C1 COM1C0 WGM11 WGM10 TCCR1A Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 COM3A1 COM3A0 COM3B1 COM3B0 COM3C1 COM3C0 WGM31 WGM30 TCCR3A Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0137 7593L–AVR–09/12 AT90USB64/128 When the OCnA, OCnB or OCnC is connected to the pin, the function of the COMnx1:0 bits is dependent of the WGMn3:0 bits setting. Table 15-1 shows the COMnx1:0 bit functionality when the WGMn3:0 bits are set to a normal or a CTC mode (non-PWM). Table 15-2 shows the COMnx1:0 bit functionality when the WGMn3:0 bits are set to the fast PWM mode. Note: A special case occurs when OCRnA/OCRnB/OCRnC equals TOP and COMnA1/COMnB1/COMnC1 is set. In this case the compare match is ignored, but the set or clear is done at TOP. See “Fast PWM mode” on page 104. for more details. Table 15-3 on page 138 shows the COMnx1:0 bit functionality when the WGMn3:0 bits are set to the phase correct and frequency correct PWM mode. Table 15-1. Compare Output mode, non-PWM. COMnA1/COMnB1/ COMnC1 COMnA0/COMnB0/ COMnC0 Description 0 0 Normal port operation, OCnA/OCnB/OCnC disconnected. 0 1 Toggle OCnA/OCnB/OCnC on compare match. 1 0 Clear OCnA/OCnB/OCnC on compare match (set output to low level). 1 1 Set OCnA/OCnB/OCnC on compare match (set output to high level). Table 15-2. Compare Output mode, fast PWM. COMnA1/COMnB1/ COMnC0 COMnA0/COMnB0/ COMnC0 Description 0 0 Normal port operation, OCnA/OCnB/OCnC disconnected. 0 1 WGM13:0 = 14 or 15: Toggle OC1A on Compare Match, OC1B and OC1C disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B/OC1C disconnected. 1 0 Clear OCnA/OCnB/OCnC on compare match, set OCnA/OCnB/OCnC at TOP 1 1 Set OCnA/OCnB/OCnC on compare match, clear OCnA/OCnB/OCnC at TOP138 7593L–AVR–09/12 AT90USB64/128 Note: A special case occurs when OCRnA/OCRnB/OCRnC equals TOP and COMnA1/COMnB1//COMnC1 is set. See “Phase correct PWM mode” on page 106. for more details. • Bit 1:0 – WGMn1:0: Waveform Generation mode Combined with the WGMn3:2 bits found in the TCCRnB Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 15-4 on page 138. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare match (CTC) mode, and three types of Pulse Width Modulation (PWM) modes. (See “Modes of operation” on page 103.). Table 15-3. Compare Output mode, phase correct and phase and frequency correct PWM. COMnA1/COMnB/ COMnC1 COMnA0/COMnB0/ COMnC0 Description 0 0 Normal port operation, OCnA/OCnB/OCnC disconnected. 0 1 WGM13:0 = 8, 9 10 or 11: Toggle OC1A on Compare Match, OC1B and OC1C disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B/OC1C disconnected. 1 0 Clear OCnA/OCnB/OCnC on compare match when up-counting. Set OCnA/OCnB/OCnC on compare match when counting down. 1 1 Set OCnA/OCnB/OCnC on compare match when up-counting. Clear OCnA/OCnB/OCnC on compare match when counting down. Table 15-4. Waveform Generation mode bit description (1). Mode WGMn3 WGMn2 (CTCn) WGMn1 (PWMn1) WGMn0 (PWMn0) Timer/Counter mode of operation TOP Update of OCRnx at TOVn flag set on 0 0 0 0 0 Normal 0xFFFF Immediate MAX 1 0 0 0 1 PWM, phase correct, 8-bit 0x00FF TOP BOTTOM 2 0 0 1 0 PWM, phase correct, 9-bit 0x01FF TOP BOTTOM 3 0 0 1 1 PWM, phase correct, 10-bit 0x03FF TOP BOTTOM 4 0 1 0 0 CTC OCRnA Immediate MAX 5 0 1 0 1 Fast PWM, 8-bit 0x00FF TOP TOP 6 0 1 1 0 Fast PWM, 9-bit 0x01FF TOP TOP 7 0 1 1 1 Fast PWM, 10-bit 0x03FF TOP TOP 81 0 0 0 PWM, phase and frequency Correct ICRn BOTTOM BOTTOM 91 0 0 1 PWM, phase and frequency Correct OCRnA BOTTOM BOTTOM 10 1 0 1 0 PWM, phase correct ICRn TOP BOTTOM139 7593L–AVR–09/12 AT90USB64/128 Note: 1. The CTCn and PWMn1:0 bit definition names are obsolete. Use the WGMn2:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer. 15.10.3 TCCR1B – Timer/Counter1 Control Register B 15.10.4 TCCR3B – Timer/Counter3 Control Register B • Bit 7 – ICNCn: Input Capture Noise Canceler Setting this bit (to one) activates the Input Capture Noise Canceler. When the Noise Canceler is activated, the input from the Input Capture Pin (ICPn) is filtered. The filter function requires four successive equal valued samples of the ICPn pin for changing its output. The input capture is therefore delayed by four Oscillator cycles when the noise canceler is enabled. • Bit 6 – ICESn: Input Capture Edge Select This bit selects which edge on the Input Capture Pin (ICPn) that is used to trigger a capture event. When the ICESn bit is written to zero, a falling (negative) edge is used as trigger, and when the ICESn bit is written to one, a rising (positive) edge will trigger the capture. When a capture is triggered according to the ICESn setting, the counter value is copied into the Input Capture Register (ICRn). The event will also set the Input Capture Flag (ICFn), and this can be used to cause an Input Capture Interrupt, if this interrupt is enabled. When the ICRn is used as TOP value (see description of the WGMn3:0 bits located in the TCCRnA and the TCCRnB Register), the ICPn is disconnected and consequently the input capture function is disabled. • Bit 5 – Reserved bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when TCCRnB is written. • Bit 4:3 – WGMn3:2: Waveform Generation mode See TCCRnA Register description. 11 1 0 1 1 PWM, phase correct OCRnA TOP BOTTOM 12 1 1 0 0 CTC ICRn Immediate MAX 13 1 1 0 1 (Reserved) – – – 14 1 1 1 0 Fast PWM ICRn TOP TOP 15 1 1 1 1 Fast PWM OCRnA TOP TOP Table 15-4. Waveform Generation mode bit description (1). (Continued) Mode WGMn3 WGMn2 (CTCn) WGMn1 (PWMn1) WGMn0 (PWMn0) Timer/Counter mode of operation TOP Update of OCRnx at TOVn flag set on Bit 7 6 5 4 3 2 1 0 ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 TCCR1B Read/write R/W R/W R R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 ICNC3 ICES3 – WGM33 WGM32 CS32 CS31 CS30 TCCR3B Read/write R/W R/W R R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0140 7593L–AVR–09/12 AT90USB64/128 • Bit 2:0 – CSn2:0: Clock Select The three clock select bits select the clock source to be used by the Timer/Counter, see Figure 14-8 on page 107 and Figure 14-9 on page 108. If external pin modes are used for the Timer/Countern, transitions on the Tn pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. 15.10.5 TCCR1C – Timer/Counter1 Control Register C 15.10.6 TCCR3C – Timer/Counter3 Control Register C • Bit 7 – FOCnA: Force Output Compare for Channel A • Bit 6 – FOCnB: Force Output Compare for Channel B • Bit 5 – FOCnC: Force Output Compare for Channel C The FOCnA/FOCnB/FOCnC bits are only active when the WGMn3:0 bits specifies a non-PWM mode. When writing a logical one to the FOCnA/FOCnB/FOCnC bit, an immediate compare match is forced on the waveform generation unit. The OCnA/OCnB/OCnC output is changed according to its COMnx1:0 bits setting. Note that the FOCnA/FOCnB/FOCnC bits are implemented as strobes. Therefore it is the value present in the COMnx1:0 bits that determine the effect of the forced compare. A FOCnA/FOCnB/FOCnC strobe will not generate any interrupt nor will it clear the timer in Clear Timer on Compare Match (CTC) mode using OCRnA as TOP. The FOCnA/FOCnB/FOCnB bits are always read as zero. • Bit 4:0 – Reserved bits These bits are reserved for future use. For ensuring compatibility with future devices, these bits must be written to zero when TCCRnC is written. Table 15-5. Clock Select bit description. CSn2 CSn1 CSn0 Description 0 0 0 No clock source. (Timer/Counter stopped) 0 0 1 clkI/O/1 (no prescaling 0 1 0 clkI/O/8 (from prescaler) 0 1 1 clkI/O/64 (from prescaler) 1 0 0 clkI/O/256 (from prescaler) 1 0 1 clkI/O/1024 (from prescaler) 1 1 0 External clock source on Tn pin. Clock on falling edge 1 1 1 External clock source on Tn pin. Clock on rising edge Bit 7 6 5 4 3 2 1 0 FOC1A FOC1B FOC1C – – – – – TCCR1C Read/write W W W R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 FOC3A FOC3B FOC3C – – – – – TCCR3C Read/write W W W R R R R R Initial value 0 0 0 0 0 0 0 0141 7593L–AVR–09/12 AT90USB64/128 15.10.7 TCNT1H and TCNT1L – Timer/Counter1 15.10.8 TCNT3H and TCNT3L – Timer/Counter3 The two Timer/Counter I/O locations (TCNTnH and TCNTnL, combined TCNTn) give direct access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To ensure that both the high and low bytes are read and written simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary High Byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit registers” on page 117. Modifying the counter (TCNTn) while the counter is running introduces a risk of missing a compare match between TCNTn and one of the OCRnx Registers. Writing to the TCNTn Register blocks (removes) the compare match on the following timer clock for all compare units. 15.10.9 OCR1AH and OCR1AL – Output Compare Register 1 A 15.10.10 OCR1BH and OCR1BL – Output Compare Register 1 B 15.10.11 OCR1CH and OCR1CL – Output Compare Register 1 C Bit 7 6 5 4 3 2 1 0 TCNT1[15:8] TCNT1H TCNT1[7:0] TCNT1L Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 TCNT3[15:8] TCNT3H TCNT3[7:0] TCNT3L Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1A[15:8] OCR1AH OCR1A[7:0] OCR1AL Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1B[15:8] OCR1BH OCR1B[7:0] OCR1BL Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR1C[15:8] OCR1CH OCR1C[7:0] OCR1CL Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0142 7593L–AVR–09/12 AT90USB64/128 15.10.12 OCR3AH and OCR3AL – Output Compare Register 3 A 15.10.13 OCR3BH and OCR3BL – Output Compare Register 3 B 15.10.14 OCR3CH and OCR3CL – Output Compare Register 3 C The Output Compare Registers contain a 16-bit value that is continuously compared with the counter value (TCNTn). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OCnx pin. The Output Compare Registers are 16-bit in size. To ensure that both the high and low bytes are written simultaneously when the CPU writes to these registers, the access is performed using an 8-bit temporary High Byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit registers” on page 117. 15.10.15 ICR1H and ICR1L – Input Capture Register 1 15.10.16 ICR3H and ICR3L – Input Capture Register 3 The Input Capture is updated with the counter (TCNTn) value each time an event occurs on the ICPn pin (or optionally on the Analog Comparator output for Timer/Counter1). The Input Capture can be used for defining the counter TOP value. The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes are read simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary High Byte Register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit registers” on page 117. Bit 7 6 5 4 3 2 1 0 OCR3A[15:8] OCR3AH OCR3A[7:0] OCR3AL Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR3B[15:8] OCR3BH OCR3B[7:0] OCR3BL Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR3C[15:8] OCR3CH OCR3C[7:0] OCR3CL Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 ICR1[15:8] ICR1H ICR1[7:0] ICR1L Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 ICR3[15:8] ICR3H ICR3[7:0] ICR3L Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0143 7593L–AVR–09/12 AT90USB64/128 15.10.17 TIMSK1 – Timer/Counter1 Interrupt Mask Register 15.10.18 TIMSK3 – Timer/Counter3 Interrupt Mask Register • Bit 5 – ICIEn: Timer/Countern, Input Capture Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Countern Input Capture interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 68) is executed when the ICFn Flag, located in TIFRn, is set. • Bit 3 – OCIEnC: Timer/Countern, Output Compare C Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Countern Output Compare C Match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 68) is executed when the OCFnC Flag, located in TIFRn, is set. • Bit 2 – OCIEnB: Timer/Countern, Output Compare B Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Countern Output Compare B Match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 68) is executed when the OCFnB Flag, located in TIFRn, is set. • Bit 1 – OCIEnA: Timer/Countern, Output Compare A Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Countern Output Compare A Match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 68) is executed when the OCFnA Flag, located in TIFRn, is set. • Bit 0 – TOIEn: Timer/Countern, Overflow Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Countern Overflow interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 68) is executed when the TOVn Flag, located in TIFRn, is set. 15.10.19 TIFR1 – Timer/Counter1 Interrupt Flag Register 15.10.20 TIFR3 – Timer/Counter3 Interrupt Flag Register Bit 7 6 5 4 3 2 1 0 – – ICIE1 – OCIE1C OCIE1B OCIE1A TOIE1 TIMSK1 Read/write R R R/W R R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – ICIE3 – OCIE3C OCIE3B OCIE3A TOIE3 TIMSK3 Read/write R R R/W R R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – ICF1 – OCF1C OCF1B OCF1A TOV1 TIFR1 Read/write R R R/W R R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 – – ICF3 – OCF3C OCF3B OCF3A TOV3 TIFR3 Read/write R R R/W R R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0144 7593L–AVR–09/12 AT90USB64/128 • Bit 5 – ICFn: Timer/Countern, Input Capture Flag This flag is set when a capture event occurs on the ICPn pin. When the Input Capture Register (ICRn) is set by the WGMn3:0 to be used as the TOP value, the ICFn Flag is set when the counter reaches the TOP value. ICFn is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively, ICFn can be cleared by writing a logic one to its bit location. • Bit 3– OCFnC: Timer/Countern, Output Compare C Match Flag This flag is set in the timer clock cycle after the counter (TCNTn) value matches the Output Compare Register C (OCRnC). Note that a Forced Output Compare (FOCnC) strobe will not set the OCFnC Flag. OCFnC is automatically cleared when the Output Compare Match C Interrupt Vector is executed. Alternatively, OCFnC can be cleared by writing a logic one to its bit location. • Bit 2 – OCFnB: Timer/Counter1, Output Compare B Match Flag This flag is set in the timer clock cycle after the counter (TCNTn) value matches the Output Compare Register B (OCRnB). Note that a Forced Output Compare (FOCnB) strobe will not set the OCFnB Flag. OCFnB is automatically cleared when the Output Compare Match B Interrupt Vector is executed. Alternatively, OCFnB can be cleared by writing a logic one to its bit location. • Bit 1 – OCF1A: Timer/Counter1, Output Compare A Match Flag This flag is set in the timer clock cycle after the counter (TCNTn value matches the Output Compare Register A (OCRnA). Note that a Forced Output Compare (FOCnA) strobe will not set the OCFnA Flag. OCFnA is automatically cleared when the Output Compare Match A Interrupt Vector is executed. Alternatively, OCFnA can be cleared by writing a logic one to its bit location. • Bit 0 – TOVn: Timer/Countern, Overflow Flag The setting of this flag is dependent of the WGMn3:0 bits setting. In Normal and CTC modes, the TOVn Flag is set when the timer overflows. Refer to Table 15-4 on page 138 for the TOVn Flag behavior when using another WGMn3:0 bit setting. TOVn is automatically cleared when the Timer/Countern Overflow Interrupt Vector is executed. Alternatively, TOVn can be cleared by writing a logic one to its bit location.145 7593L–AVR–09/12 AT90USB64/128 16. 8-bit Timer/Counter2 with PWM and asynchronous operation Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. The main features are: • Single channel counter • Clear timer on compare match (auto reload) • Glitch-free, phase correct pulse width modulator (PWM) • Frequency generator • 10-bit clock prescaler • Overflow and compare match interrupt sources (TOV2, OCF2A and OCF2B) • Allows clocking from external 32kHz watch crystal independent of the I/O clock 16.1 Overview A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 16-1. For the actual placement of I/O pins, see “Pin configurations” on page 3. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “8-bit Timer/Counter register description” on page 156. The Power Reduction Timer/Counter2 bit, PRTIM2, in “PRR0 – Power Reduction Register 0” on page 54 must be written to zero to enable Timer/Counter2 module. Figure 16-1. 8-bit Timer/Counter, block diagram. Timer/counter DATA BUS OCRnA OCRnB = = TCNTn Waveform generation Waveform generation OCnA OCnB = Fixed TOP value Control logic = 0 TOP BOTTOM Count Clear Direction TOVn (int.req.) OCnA (int.req.) OCnB (int.req.) TCCRnA TCCRnB clkTn ASSRn Synchronization unit Prescaler T/C oscillator clkI/O clkASY asynchronous mode select (ASn) Synchronized status flags TOSC1 TOSC2 Status flags clkI/O146 7593L–AVR–09/12 AT90USB64/128 16.1.1 Registers The Timer/Counter (TCNT2) and Output Compare Register (OCR2A and OCR2B) are 8-bit registers. Interrupt request (abbreviated to Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFR2). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK2). TIFR2 and TIMSK2 are not shown in the figure. The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock source the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the Clock Select logic is referred to as the timer clock (clkT2). The double buffered Output Compare Register (OCR2A and OCR2B) are compared with the Timer/Counter value at all times. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pins (OC2A and OC2B). See “Output Compare unit” on page 147. for details. The compare match event will also set the Compare Flag (OCF2A or OCF2B) which can be used to generate an Output Compare interrupt request. 16.1.2 Definitions Many register and bit references in this document are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 2. However, when using the register or bit defines in a program, the precise form must be used, that is, TCNT2 for accessing Timer/Counter2 counter value and so on. The definitions in the table below are also used extensively throughout the section. 16.2 Timer/Counter clock sources The Timer/Counter can be clocked by an internal synchronous or an external asynchronous clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2 bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “ASSR – Asynchronous Status Register” on page 161. For details on clock sources and prescaler, see “Timer/Counter prescaler” on page 164. 16.3 Counter unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 16-2 on page 147 shows a block diagram of the counter and its surrounding environment. BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00). MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR2A Register. The assignment is dependent on the mode of operation.147 7593L–AVR–09/12 AT90USB64/128 Figure 16-2. Counter unit block diagram. Signal description (internal signals): count Increment or decrement TCNT2 by 1. direction Selects between increment and decrement. clear Clear TCNT2 (set all bits to zero). clkTn Timer/Counter clock, referred to as clkT2 in the following. top Signalizes that TCNT2 has reached maximum value. bottom Signalizes that TCNT2 has reached minimum value (zero). Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source, selected by the Clock Select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in the Timer/Counter Control Register (TCCR2A) and the WGM22 located in the Timer/Counter Control Register B (TCCR2B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare outputs OC2A and OC2B. For more details about advanced counting sequences and waveform generation, see “Modes of operation” on page 150. The Timer/Counter Overflow Flag (TOV2) is set according to the mode of operation selected by the WGM22:0 bits. TOV2 can be used for generating a CPU interrupt. 16.4 Output Compare unit The 8-bit comparator continuously compares TCNT2 with the Output Compare Register (OCR2A and OCR2B). Whenever TCNT2 equals OCR2A or OCR2B, the comparator signals a match. A match will set the Output Compare Flag (OCF2A or OCF2B) at the next timer clock cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is executed. Alternatively, the Output Compare Flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the WGM22:0 bits and Compare Output mode (COM2x1:0) bits. The max and bottom signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation (“Modes of operation” on page 150). Figure 15-10 on page 134 shows a block diagram of the Output Compare unit. DATA BUS TCNTn Control logic count TOVn (int.req.) bottom top direction clear TOSC1 T/C oscillator TOSC2 Prescaler clkI/O clk Tn148 7593L–AVR–09/12 AT90USB64/128 Figure 16-3. Output Compare unit, block diagram. The OCR2x Register is double buffered when using any of the Pulse Width Modulation (PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR2x Compare Register to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR2x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR2x Buffer Register, and if double buffering is disabled the CPU will access the OCR2x directly. 16.4.1 Force output compare In non-PWM waveform generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC2x) bit. Forcing compare match will not set the OCF2x Flag or reload/clear the timer, but the OC2x pin will be updated as if a real compare match had occurred (the COM2x1:0 bits settings define whether the OC2x pin is set, cleared or toggled). 16.4.2 Compare Match Blocking by TCNT2 Write All CPU write operations to the TCNT2 Register will block any compare match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR2x to be initialized to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is enabled. 16.4.3 Using the Output Compare unit Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT2 when using the Output Compare channel, independently of whether the Timer/Counter is running or not. If the value written to TCNT2 equals the OCR2x value, the compare match will be missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is downcounting. OCFnx (int.req.) = (8-bit comparator) OCRnx OCnx DATA BUS TCNTn WGMn1:0 Waveform generator top FOCn COMnX1:0 bottom149 7593L–AVR–09/12 AT90USB64/128 The setup of the OC2x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC2x value is to use the Force Output Compare (FOC2x) strobe bit in Normal mode. The OC2x Register keeps its value even when changing between Waveform Generation modes. Be aware that the COM2x1:0 bits are not double buffered together with the compare value. Changing the COM2x1:0 bits will take effect immediately. 16.5 Compare Match Output unit The Compare Output mode (COM2x1:0) bits have two functions. The Waveform Generator uses the COM2x1:0 bits for defining the Output Compare (OC2x) state at the next compare match. Also, the COM2x1:0 bits control the OC2x pin output source. Figure 16-4 shows a simplified schematic of the logic affected by the COM2x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM2x1:0 bits are shown. When referring to the OC2x state, the reference is for the internal OC2x Register, not the OC2x pin. Figure 16-4. Compare Match Output unit, schematic. The general I/O port function is overridden by the Output Compare (OC2x) from the Waveform Generator if either of the COM2x1:0 bits are set. However, the OC2x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC2x pin (DDR_OC2x) must be set as output before the OC2x value is visible on the pin. The port override function is independent of the Waveform Generation mode. The design of the Output Compare pin logic allows initialization of the OC2x state before the output is enabled. Note that some COM2x1:0 bit settings are reserved for certain modes of operation. See “8-bit Timer/Counter register description” on page 156. PORT DDR D Q D Q OCnx OCnx pin D Q Waveform generator COMnx1 COMnx0 0 1 DATA BU S FOCnx clkI/O150 7593L–AVR–09/12 AT90USB64/128 16.5.1 Compare Output mode and Waveform generating The Waveform Generator uses the COM2x1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM2x1:0 = 0 tells the Waveform Generator that no action on the OC2x Register is to be performed on the next compare match. For compare output actions in the non-PWM modes refer to Table 16-4 on page 157. For fast PWM mode, refer to Table 16-5 on page 158, and for phase correct PWM refer to Table 16-6 on page 158. A change of the COM2x1:0 bits state will have effect at the first compare match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOC2x strobe bits. 16.6 Modes of operation The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGM22:0) and Compare Output mode (COM2x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM2x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM2x1:0 bits control whether the output should be set, cleared, or toggled at a compare match (see “Compare Match Output unit” on page 149). For detailed timing information refer to Section “Timer/Counter timing diagrams” on page 154. 16.6.1 Normal mode The simplest mode of operation is the Normal mode (WGM22:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV2 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 16.6.2 Clear Timer on Compare Match (CTC) mode In Clear Timer on Compare or CTC mode (WGM22:0 = 2), the OCR2A Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT2) matches the OCR2A. The OCR2A defines the top value for the counter, hence also its resolution. This mode allows greater control of the compare match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Table 16-5 on page 151. The counter value (TCNT2) increases until a compare match occurs between TCNT2 and OCR2A, and then counter (TCNT2) is cleared.151 7593L–AVR–09/12 AT90USB64/128 Figure 16-5. CTC mode, timing diagram. An interrupt can be generated each time the counter value reaches the TOP value by using the OCF2A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR2A is lower than the current value of TCNT2, the counter will miss the compare match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the compare match can occur. For generating a waveform output in CTC mode, the OC2A output can be set to toggle its logical level on each compare match by setting the Compare Output mode bits to toggle mode (COM2A1:0 = 1). The OC2A value will not be visible on the port pin unless the data direction for the pin is set to output. The waveform generated will have a maximum frequency of fOC2A = fclk_I/O/2 when OCR2A is set to zero (0x00). The waveform frequency is defined by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. 16.6.3 Fast PWM mode The fast Pulse Width Modulation or fast PWM mode (WGM22:0 = 3 or 7) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM option by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. TOP is defined as 0xFF when WGM22:0 = 3, and OCR2A when MGM22:0 = 7. In noninverting Compare Output mode, the Output Compare (OC2x) is cleared on the compare match between TCNT2 and OCR2x, and set at BOTTOM. In inverting Compare Output mode, the output is set on compare match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct PWM mode that uses dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), and therefore reduces total system cost. TCNTn OCnx (Toggle) OCnx Interrupt Flag Set Period 1 2 3 4 (COMnx1:0 = 1) f OCnx f clk_I/O 2 ⋅ ⋅ N ( ) 1 + OCRnx = -------------------------------------------------152 7593L–AVR–09/12 AT90USB64/128 In fast PWM mode, the counter is incremented until the counter value matches the TOP value. The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 16-6. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2x and TCNT2. Figure 16-6. Fast PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches TOP. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when WGM2:0 = 7 (See Table 16-2 on page 157). The actual OC2x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC2x Register at the compare match between OCR2x and TCNT2, and clearing (or setting) the OC2x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2A Register represent special cases when generating a PWM waveform output in the fast PWM mode. If the OCR2A is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2A equal to MAX will result in a constantly high or low output (depending on the polarity of the output set by the COM2A1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC2x to toggle its logical level on each compare match (COM2x1:0 = 1). The waveform TCNTn OCRnx Update and TOVn Interrupt Flag Set Period 1 2 3 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx Interrupt Flag Set 4 5 6 7 f OCnxPWM f clk_I/O N ⋅ 256 = ------------------153 7593L–AVR–09/12 AT90USB64/128 generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2A is set to zero. This feature is similar to the OC2A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 16.6.4 Phase correct PWM mode The phase correct PWM mode (WGM22:0 = 1 or 5) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOTTOM. TOP is defined as 0xFF when WGM22:0 = 1, and OCR2A when MGM22:0 = 5. In noninverting Compare Output mode, the Output Compare (OC2x) is cleared on the compare match between TCNT2 and OCR2x while upcounting, and set on the compare match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. In phase correct PWM mode the counter is incremented until the counter value matches TOP. When the counter reaches TOP, it changes the count direction. The TCNT2 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 16-7. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2x and TCNT2. Figure 16-7. Phase correct PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM. An inverted PWM TOVn Interrupt Flag Set OCnx Interrupt Flag Set 1 2 3 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx update154 7593L–AVR–09/12 AT90USB64/128 output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7 (see Table 16-3 on page 157). The actual OC2x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC2x Register at the compare match between OCR2x and TCNT2 when the counter increments, and setting (or clearing) the OC2x Register at compare match between OCR2x and TCNT2 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2A Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR2A is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. At the very start of period 2 in Figure 16-7 on page 153 OCnx has a transition from high to low even though there is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM. There are two cases that give a transition without Compare Match. • OCR2A changes its value from MAX, like in Figure 16-7 on page 153. When the OCR2A value is MAX the OCn pin value is the same as the result of a down-counting compare match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match • The timer starts counting from a value higher than the one in OCR2A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up 16.7 Timer/Counter timing diagrams The following figures show the Timer/Counter in synchronous mode, and the timer clock (clkT2) is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should be replaced by the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are set. Figure 16-8 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. Figure 16-8. Timer/Counter timing diagram, no prescaling. f OCnxPCPWM f clk_I/O N ⋅ 510 = ------------------ clkTn (clkI/O/1) TOVn clkI/O TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1155 7593L–AVR–09/12 AT90USB64/128 Figure 16-9 shows the same timing data, but with the prescaler enabled. Figure 16-9. Timer/Counter timing diagram, with prescaler (fclk_I/O/8). Figure 16-10 shows the setting of OCF2A in all modes except CTC mode. Figure 16-10. Timer/Counter timing diagram, setting of OCF2A, with prescaler (fclk_I/O/8). Figure 16-11 on page 156 shows the setting of OCF2A and the clearing of TCNT2 in CTC mode. TOVn TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) OCFnx OCRnx TCNTn OCRnx value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8)156 7593L–AVR–09/12 AT90USB64/128 Figure 16-11. Timer/Counter timing diagram, clear timer on compare match mode, with prescaler (fclk_I/O/8). 16.8 8-bit Timer/Counter register description 16.8.1 TCCR2A – Timer/Counter Control Register A • Bits 7:6 – COM2A1:0: Compare Match Output A mode These bits control the Output Compare pin (OC2A) behavior. If one or both of the COM2A1:0 bits are set, the OC2A output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2A pin must be set in order to enable the output driver. When OC2A is connected to the pin, the function of the COM2A1:0 bits depends on the WGM22:0 bit setting. Table 16-1 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to a normal or CTC mode (non-PWM). OCFnx OCRnx TCNTn (CTC) TOP TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) Bit 7 6 5 4 3 2 1 0 COM2A1 COM2A0 COM2B1 COM2B0 – – WGM21 WGM20 TCCR2A Read/write R/W R/W R/W R/W R R R/W R/W Initial value 0 0 0 0 0 0 0 0 Table 16-1. Compare output mode, non-PWM mode. COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 Toggle OC2A on Compare Match 1 0 Clear OC2A on Compare Match 1 1 Set OC2A on Compare Match157 7593L–AVR–09/12 AT90USB64/128 Table 16-2 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Fast PWM mode” on page 151 for more details. Table 16-3 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 153 for more details. • Bits 5:4 – COM2B1:0: Compare Match Output B mode These bits control the Output Compare pin (OC2B) behavior. If one or both of the COM2B1:0 bits are set, the OC2B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2B pin must be set in order to enable the output driver. When OC2B is connected to the pin, the function of the COM2B1:0 bits depends on the WGM22:0 bit setting. Table 16-4 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to a normal or CTC mode (non-PWM). Table 16-2. Compare Output mode, fast PWM mode (1). COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 WGM22 = 0: Normal Port Operation, OC0A Disconnected. WGM22 = 1: Toggle OC2A on Compare Match. 1 0 Clear OC2A on Compare Match, set OC2A at TOP 1 1 Set OC2A on Compare Match, clear OC2A at TOP Table 16-3. Compare Output mode, phase correct PWM mode (1). COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 WGM22 = 0: Normal Port Operation, OC2A Disconnected. WGM22 = 1: Toggle OC2A on Compare Match. 1 0 Clear OC2A on Compare Match when up-counting. Set OC2A on Compare Match when down-counting. 1 1 Set OC2A on Compare Match when up-counting. Clear OC2A on Compare Match when down-counting. Table 16-4. Compare Output mode, non-PWM mode. COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Toggle OC2B on Compare Match 1 0 Clear OC2B on Compare Match 1 1 Set OC2B on Compare Match158 7593L–AVR–09/12 AT90USB64/128 Table 16-5 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Fast PWM mode” on page 151 for more details. Table 16-6 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 153 for more details. • Bits 3, 2 – Res: Reserved bits These bits are reserved bits in the Atmel AT90USB64/128 and will always read as zero. • Bits 1:0 – WGM21:0: Waveform Generation mode Combined with the WGM22 bit found in the TCCR2B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 16-7. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes (see “Modes of operation” on page 150). Table 16-5. Compare Output mode, fast PWM mode (1). COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected. 0 1 Reserved 1 0 Clear OC2B on Compare Match, set OC2B at TOP 1 1 Set OC2B on Compare Match, clear OC2B at TOP Table 16-6. Compare Output mode, phase correct PWM mode (1). COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Reserved 1 0 Clear OC2B on Compare Match when up-counting. Set OC2B on Compare Match when down-counting 1 1 Set OC2B on Compare Match when up-counting. Clear OC2B on Compare Match when down-counting Table 16-7. Waveform Generation mode bit description. Mode WGM2 WGM1 WGM0 Timer/Counter mode of operation TOP Update of OCRx at TOV flag set on (1)(2) 0 0 0 0 Normal 0xFF Immediate MAX 1 0 0 1 PWM, phase correct 0xFF TOP BOTTOM 2 0 1 0 CTC OCRA Immediate MAX 3 0 1 1 Fast PWM 0xFF TOP MAX 4 1 0 0 Reserved – – –159 7593L–AVR–09/12 AT90USB64/128 Notes: 1. MAX= 0xFF 2. BOTTOM= 0x00 16.8.2 TCCR2B – Timer/Counter Control Register B • Bit 7 – FOC2A: Force Output Compare A The FOC2A bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2A bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC2A output is changed according to its COM2A1:0 bits setting. Note that the FOC2A bit is implemented as a strobe. Therefore it is the value present in the COM2A1:0 bits that determines the effect of the forced compare. A FOC2A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2A as TOP. The FOC2A bit is always read as zero. • Bit 6 – FOC2B: Force Output Compare B The FOC2B bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2B bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC2B output is changed according to its COM2B1:0 bits setting. Note that the FOC2B bit is implemented as a strobe. Therefore it is the value present in the COM2B1:0 bits that determines the effect of the forced compare. A FOC2B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2B as TOP. The FOC2B bit is always read as zero. • Bits 5:4 – Res: Reserved bits These bits are reserved bits in the AT90USB64/128 and will always read as zero. • Bit 3 – WGM22: Waveform Generation mode See the description in the “TCCR2A – Timer/Counter Control Register A” on page 156. 5 1 0 1 PWM, phase correct OCRA TOP BOTTOM 6 1 1 0 Reserved – – – 7 1 1 1 Fast PWM OCRA TOP TOP Table 16-7. Waveform Generation mode bit description. (Continued) Mode WGM2 WGM1 WGM0 Timer/Counter mode of operation TOP Update of OCRx at TOV flag set on (1)(2) Bit 7 6 5 4 3 2 1 0 FOC2A FOC2B – – WGM22 CS22 CS21 CS20 TCCR2B Read/write W W R R R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0160 7593L–AVR–09/12 AT90USB64/128 • Bit 2:0 – CS22:0: Clock Select The three Clock Select bits select the clock source to be used by the Timer/Counter, see Table 16-8. 16.8.3 TCNT2 – Timer/Counter Register The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running, introduces a risk of missing a Compare Match between TCNT2 and the OCR2x Registers. 16.8.4 OCR2A – Output Compare Register A The Output Compare Register A contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2A pin. 16.8.5 OCR2B – Output Compare Register B The Output Compare Register B contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2B pin. Table 16-8. Clock Select bit description. CS22 CS21 CS20 Description 0 0 0 No clock source (Timer/Counter stopped) 0 0 1 clkT2S/(no prescaling) 0 1 0 clkT2S/8 (from prescaler) 0 1 1 clkT2S/32 (from prescaler) 1 0 0 clkT2S/64 (from prescaler) 1 0 1 clkT2S/128 (from prescaler) 1 1 0 clkT2S/256 (from prescaler) 1 1 1 clkT2S/1024 (from prescaler) Bit 7 6 5 4 3 2 1 0 TCNT2[7:0] TCNT2 Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR2A[7:0] OCR2A Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OCR2B[7:0] OCR2B Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0161 7593L–AVR–09/12 AT90USB64/128 16.9 Asynchronous operation of the Timer/Counter 16.9.1 ASSR – Asynchronous Status Register • Bit 6 – EXCLK: Enable External Clock Input When EXCLK is written to one, and asynchronous clock is selected, the external clock input buffer is enabled and an external clock can be input on Timer Oscillator 1 (TOSC1) pin instead of a 32 kHz crystal. Writing to EXCLK should be done before asynchronous operation is selected. Note that the crystal Oscillator will only run when this bit is zero. • Bit 5 – AS2: Asynchronous Timer/Counter2 When AS2 is written to zero, Timer/Counter2 is clocked from the I/O clock, clkI/O. When AS2 is written to one, Timer/Counter2 is clocked from a crystal Oscillator connected to the Timer Oscillator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B might be corrupted. • Bit 4 – TCN2UB: Timer/Counter2 Update Busy When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set. When TCNT2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value. • Bit 3 – OCR2AUB: Output Compare Register2 Update Busy When Timer/Counter2 operates asynchronously and OCR2A is written, this bit becomes set. When OCR2A has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2A is ready to be updated with a new value. • Bit 2 – OCR2BUB: Output Compare Register2 Update Busy When Timer/Counter2 operates asynchronously and OCR2B is written, this bit becomes set. When OCR2B has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2B is ready to be updated with a new value. • Bit 1 – TCR2AUB: Timer/Counter Control Register2 Update Busy When Timer/Counter2 operates asynchronously and TCCR2A is written, this bit becomes set. When TCCR2A has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2A is ready to be updated with a new value. • Bit 0 – TCR2BUB: Timer/Counter Control Register2 Update Busy When Timer/Counter2 operates asynchronously and TCCR2B is written, this bit becomes set. When TCCR2B has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2B is ready to be updated with a new value. If a write is performed to any of the five Timer/Counter2 Registers while its update busy flag is set, the updated value might get corrupted and cause an unintentional interrupt to occur. Bit 7 6 5 4 3 2 1 0 – EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB ASSR Read/write R R/W R/W R R R R R Initial value 0 0 0 0 0 0 0 0162 7593L–AVR–09/12 AT90USB64/128 The mechanisms for reading TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B are different. When reading TCNT2, the actual timer value is read. When reading OCR2A, OCR2B, TCCR2A and TCCR2B the value in the temporary storage register is read. 16.9.2 Asynchronous operation of Timer/Counter2 When Timer/Counter2 operates asynchronously, some considerations must be taken. • Warning: When switching between asynchronous and synchronous clocking of Timer/Counter2, the Timer Registers TCNT2, OCR2x, and TCCR2x might be corrupted. A safe procedure for switching clock source is: a. Disable the Timer/Counter2 interrupts by clearing OCIE2x and TOIE2. b. Select clock source by setting AS2 as appropriate. c. Write new values to TCNT2, OCR2x, and TCCR2x. d. To switch to asynchronous operation: Wait for TCN2UB, OCR2xUB, and TCR2xUB. e. Clear the Timer/Counter2 Interrupt Flags. f. Enable interrupts, if needed. • The CPU main clock frequency must be more than four times the Oscillator frequency • When writing to one of the registers TCNT2, OCR2x, or TCCR2x, the value is transferred to a temporary register, and latched after two positive edges on TOSC1. The user should not write a new value before the contents of the temporary register have been transferred to its destination. Each of the five mentioned registers have their individual temporary register, which means that, for example, writing to TCNT2 does not disturb an OCR2x write in progress. To detect that a transfer to the destination register has taken place, the Asynchronous Status Register – ASSR has been implemented • When entering Power-save or ADC Noise Reduction mode after having written to TCNT2, OCR2x, or TCCR2x, the user must wait until the written register has been updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode before the changes are effective. This is particularly important if any of the Output Compare2 interrupt is used to wake up the device, since the Output Compare function is disabled during writing to OCR2x or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode before the corresponding OCR2xUB bit returns to zero, the device will never receive a compare match interrupt, and the MCU will not wake up • If Timer/Counter2 is used to wake the device up from Power-save or ADC Noise Reduction mode, precautions must be taken if the user wants to re-enter one of these modes: The interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and reentering sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the device will fail to wake up. If the user is in doubt whether the time before re-entering Powersave or ADC Noise Reduction mode is sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has elapsed: a. Write a value to TCCR2x, TCNT2, or OCR2x. b. Wait until the corresponding Update Busy Flag in ASSR returns to zero. c. Enter Power-save or ADC Noise Reduction mode. • When the asynchronous operation is selected, the 32.768kHz Oscillator for Timer/Counter2 is always running, except in Power-down and Standby modes. After a Power-up Reset or wake-up from Power-down or Standby mode, the user should be aware of the fact that this Oscillator might take as long as one second to stabilize. The user is advised to wait for at least one second before using Timer/Counter2 after power-up or wake-up from Power-down or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost after 163 7593L–AVR–09/12 AT90USB64/128 a wake-up from Power-down or Standby mode due to unstable clock signal upon start-up, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin • Description of wake up from Power-save or ADC Noise Reduction mode when the timer is clocked asynchronously: When the interrupt condition is met, the wake up process is started on the following cycle of the timer clock, that is, the timer is always advanced by at least one before the processor can read the counter value. After wake-up, the MCU is halted for four cycles, it executes the interrupt routine, and resumes execution from the instruction following SLEEP • Reading of the TCNT2 Register shortly after wake-up from Power-save may give an incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2 must be done through a register synchronized to the internal I/O clock domain. Synchronization takes place for every rising TOSC1 edge. When waking up from Power-save mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC clock after waking up from Power-save mode is essentially unpredictable, as it depends on the wake-up time. The recommended procedure for reading TCNT2 is thus as follows: a. Write any value to either of the registers OCR2x or TCCR2x. b. Wait for the corresponding Update Busy Flag to be cleared. c. Read TCNT2. • During asynchronous operation, the synchronization of the Interrupt Flags for the asynchronous timer takes 3 processor cycles plus one timer cycle. The timer is therefore advanced by at least one before the processor can read the timer value causing the setting of the Interrupt Flag. The Output Compare pin is changed on the timer clock and is not synchronized to the processor clock 16.9.3 TIMSK2 – Timer/Counter2 Interrupt Mask Register • Bit 2 – OCIE2B: Timer/Counter2 Output Compare Match B Interrupt Enable When the OCIE2B bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match B interrupt is enabled. The corresponding interrupt is executed if a compare match in Timer/Counter2 occurs, that is, when the OCF2B bit is set in the Timer/Counter2 Interrupt Flag Register – TIFR2. • Bit 1 – OCIE2A: Timer/Counter2 Output Compare Match A Interrupt Enable When the OCIE2A bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match A interrupt is enabled. The corresponding interrupt is executed if a compare match in Timer/Counter2 occurs, that is, when the OCF2A bit is set in the Timer/Counter2 Interrupt Flag Register – TIFR2. • Bit 0 – TOIE2: Timer/Counter2 Overflow Interrupt Enable When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter2 occurs, that is, when the TOV2 bit is set in the Timer/Counter2 Interrupt Flag Register – TIFR2. Bit 7 6 5 4 3 2 1 0 – – – – – OCIE2B OCIE2A TOIE2 TIMSK2 Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0164 7593L–AVR–09/12 AT90USB64/128 16.9.4 TIFR2 – Timer/Counter2 Interrupt Flag Register • Bit 2 – OCF2B: Output Compare Flag 2 B The OCF2B bit is set (one) when a compare match occurs between the Timer/Counter2 and the data in OCR2B – Output Compare Register2. OCF2B is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF2B is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2B (Timer/Counter2 Compare match Interrupt Enable), and OCF2B are set (one), the Timer/Counter2 Compare match Interrupt is executed. • Bit 1 – OCF2A: Output Compare Flag 2 A The OCF2A bit is set (one) when a compare match occurs between the Timer/Counter2 and the data in OCR2A – Output Compare Register2. OCF2A is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF2A is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2A (Timer/Counter2 Compare match Interrupt Enable), and OCF2A are set (one), the Timer/Counter2 Compare match Interrupt is executed. • Bit 0 – TOV2: Timer/Counter2 Overflow Flag The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, TOV2 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE2A (Timer/Counter2 Overflow Interrupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00. 16.10 Timer/Counter prescaler Figure 16-12. Prescaler for Timer/Counter2. Bit 7 6 5 4 3 2 1 0 – – – – – OCF2B OCF2A TOV2 TIFR2 Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 10-BIT T/C PRESCALER TIMER/COUNTER2 CLOCK SOURCE clkI/O clkT2S TOSC1 AS2 CS20 CS21 CS22 clkT2S/8 clkT2S/64 clkT2S/128 clkT2S/1024 clkT2S/256 clkT2S/32 0 PSRASY Clear clkT2165 7593L–AVR–09/12 AT90USB64/128 The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main system I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter (RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port C. A crystal can then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock source for Timer/Counter2. The Oscillator is optimized for use with a 32.768kHz crystal. Applying an external clock source to TOSC1 is not recommended. For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64, clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected. Setting the PSRASY bit in GTCCR resets the prescaler. This allows the user to operate with a predictable prescaler. 16.10.1 GTCCR – General Timer/Counter Control Register • Bit 1 – PSRASY: Prescaler Reset Timer/Counter2 When this bit is one, the Timer/Counter2 prescaler will be reset. This bit is normally cleared immediately by hardware. If the bit is written when Timer/Counter2 is operating in asynchronous mode, the bit will remain one until the prescaler has been reset. The bit will not be cleared by hardware if the TSM bit is set. Refer to the description of the Section “GTCCR – General Timer/Counter Control Register” on page 97 for a description of the Timer/Counter Synchronization mode. Bit 7 6 5 4 3 2 1 0 TSM – – – – – PSRASY PSRSY NC GTCCR Read/write R/W R R R R R R/W R/W Initial value 0 0 0 0 0 0 0 0166 7593L–AVR–09/12 AT90USB64/128 17. Output Compare Modulator (OCM1C0A) 17.1 Overview The Output Compare Modulator (OCM) allows generation of waveforms modulated with a carrier frequency. The modulator uses the outputs from the Output Compare Unit C of the 16-bit Timer/Counter1 and the Output Compare Unit of the 8-bit Timer/Counter0. For more details about these Timer/Counters see “Timer/Counter0, Timer/Counter1, and Timer/Counter3 prescalers” on page 96 and “8-bit Timer/Counter2 with PWM and asynchronous operation” on page 145. Figure 17-1. Output Compare Modulator, block diagram. When the modulator is enabled, the two output compare channels are modulated together as shown in the block diagram (Figure 17-1). 17.2 Description The Output Compare unit 1C and Output Compare unit 2 shares the PB7 port pin for output. The outputs of the Output Compare units (OC1C and OC0A) overrides the normal PORTB7 Register when one of them is enabled (that is, when COMnx1:0 is not equal to zero). When both OC1C and OC0A are enabled at the same time, the modulator is automatically enabled. The functional equivalent schematic of the modulator is shown on Figure 17-2. The schematic includes part of the Timer/Counter units and the port B pin 7 output driver circuit. Figure 17-2. Output Compare Modulator, schematic. OC1C Pin OC1C / OC0A / PB7 Timer/Counter 1 Timer/Counter 0 OC0A PORTB7 DDRB7 D Q D Q Pin COMA01 COMA00 DATABUS OC1C / OC0A/ PB7 COM1C1 COM1C0 Modulator 1 0 OC1C D Q OC0A D Q (From Waveform generator) (From Waveform generator) 0 1 Vcc167 7593L–AVR–09/12 AT90USB64/128 When the modulator is enabled the type of modulation (logical AND or OR) can be selected by the PORTB7 Register. Note that the DDRB7 controls the direction of the port independent of the COMnx1:0 bit setting. 17.2.1 Timing example Figure 17-3 illustrates the modulator in action. In this example the Timer/Counter1 is set to operate in fast PWM mode (non-inverted) and Timer/Counter0 uses CTC waveform mode with toggle Compare Output mode (COMnx1:0 = 1). Figure 17-3. Output Compare Modulator, timing diagram. In this example, Timer/Counter2 provides the carrier, while the modulating signal is generated by the Output Compare unit C of the Timer/Counter1. The resolution of the PWM signal (OC1C) is reduced by the modulation. The reduction factor is equal to the number of system clock cycles of one period of the carrier (OC0A). In this example the resolution is reduced by a factor of two. The reason for the reduction is illustrated in Figure 17-3 at the second and third period of the PB7 output when PORTB7 equals zero. The period 2 high time is one cycle longer than the period 3 high time, but the result on the PB7 output is equal in both periods. 1 2 OC0A (CTC mode) OC1C (FPWM mode) PB7 (PORTB7 = 0) PB7 (PORTB7 = 1) (Period) 3 clk I/O168 7593L–AVR–09/12 AT90USB64/128 18. SPI – Serial Peripheral Interface The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the Atmel AT90USB64/128 and peripheral devices or between several AVR devices. The AT90USB64/128 SPI includes the following features: • Full-duplex, three-wire synchronous data transfer • Master or slave operation • LSB first or MSB first data transfer • Seven programmable bit rates • End of transmission interrupt flag • Write collision flag protection • Wake-up from Idle mode • Double speed (CK/2) Master SPI mode USART can also be used in Master SPI mode, see “USART in SPI mode” on page 202. The Power Reduction SPI bit, PRSPI, in “PRR0 – Power Reduction Register 0” on page 54 must be written to zero to enable SPI module. Figure 18-1. SPI block diagram (1). Note: 1. Refer to Figure 1-1 on page 3, and Table 11-6 on page 79 for SPI pin placement. The interconnection between Master and Slave CPUs with SPI is shown in Figure 18-2 on page 169. The system consists of two shift Registers, and a Master clock generator. The SPI Master initiates the communication cycle when pulling low the Slave Select SS pin of the desired Slave. SPI2X SPI2X DIVIDER /2/4/8/16/32/64/128169 7593L–AVR–09/12 AT90USB64/128 Master and Slave prepare the data to be sent in their respective shift Registers, and the Master generates the required clock pulses on the SCK line to interchange data. Data is always shifted from Master to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In – Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pulling high the Slave Select, SS, line. When configured as a Master, the SPI interface has no automatic control of the SS line. This must be handled by user software before communication can start. When this is done, writing a byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end of Transmission Flag (SPIF). If the SPI Interrupt Enable bit (SPIE) in the SPCR Register is set, an interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be kept in the Buffer Register for later use. When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long as the SS pin is driven high. In this state, software may update the contents of the SPI Data Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin until the SS pin is driven low. As one byte has been completely shifted, the end of Transmission Flag, SPIF is set. If the SPI Interrupt Enable bit, SPIE, in the SPCR Register is set, an interrupt is requested. The Slave may continue to place new data to be sent into SPDR before reading the incoming data. The last incoming byte will be kept in the Buffer Register for later use. Figure 18-2. SPI Master-slave interconnection. The system is single buffered in the transmit direction and double buffered in the receive direction. This means that bytes to be transmitted cannot be written to the SPI Data Register before the entire shift cycle is completed. When receiving data, however, a received character must be read from the SPI Data Register before the next character has been completely shifted in. Otherwise, the first byte is lost. In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure correct sampling of the clock signal, the frequency of the SPI clock should never exceed fosc/4. When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden according to Table 18-1 on page 170. For more details on automatic port overrides, refer to “Alternate port functions” on page 76. SHIFT ENABLE170 7593L–AVR–09/12 AT90USB64/128 Note: 1. See “Alternate functions of Port B” on page 79 for a detailed description of how to define the direction of the user defined SPI pins. The following code examples show how to initialize the SPI as a Master and how to perform a simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by the actual data direction bits for these pins. For example, if MOSI is placed on pin PB5, replace DD_MOSI with DDB5 and DDR_SPI with DDRB. Table 18-1. SPI pin overrides (1). Pin Direction, master SPI Direction, slave SPI MOSI User defined Input MISO Input User defined SCK User defined Input SS User defined Input171 7593L–AVR–09/12 AT90USB64/128 Note: 1. See “About code examples” on page 10. Assembly code example (1) SPI_MasterInit: ; Set MOSI and SCK output, all others input ldi r17,(1<>8); UBRRLn = (unsigned char)baud; /* Enable receiver and transmitter */ UCSRnB = (1<> 1) & 0x01; return ((resh << 8) | resl); }188 7593L–AVR–09/12 AT90USB64/128 The Receive Complete (RXCn) Flag indicates if there are unread data present in the receive buffer. This flag is one when unread data exist in the receive buffer, and zero when the receive buffer is empty (that is, does not contain any unread data). If the Receiver is disabled (RXENn = 0), the receive buffer will be flushed and consequently the RXCn bit will become zero. When the Receive Complete Interrupt Enable (RXCIEn) in UCSRnB is set, the USART Receive Complete interrupt will be executed as long as the RXCn Flag is set (provided that global interrupts are enabled). When interrupt-driven data reception is used, the receive complete routine must read the received data from UDRn in order to clear the RXCn Flag, otherwise a new interrupt will occur once the interrupt routine terminates. 19.6.4 Receiver error flags The USART Receiver has three error flags: Frame Error (FEn), Data OverRun (DORn) and Parity Error (UPEn). All can be accessed by reading UCSRnA. Common for the Error Flags is that they are located in the receive buffer together with the frame for which they indicate the error status. Due to the buffering of the Error Flags, the UCSRnA must be read before the receive buffer (UDRn), since reading the UDRn I/O location changes the buffer read location. Another equality for the Error Flags is that they can not be altered by software doing a write to the flag location. However, all flags must be set to zero when the UCSRnA is written for upward compatibility of future USART implementations. None of the Error Flags can generate interrupts. The Frame Error (FEn) Flag indicates the state of the first stop bit of the next readable frame stored in the receive buffer. The FEn Flag is zero when the stop bit was correctly read (as one), and the FEn Flag will be one when the stop bit was incorrect (zero). This flag can be used for detecting out-of-sync conditions, detecting break conditions and protocol handling. The FEn Flag is not affected by the setting of the USBSn bit in UCSRnC since the Receiver ignores all, except for the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to UCSRnA. The Data OverRun (DORn) Flag indicates data loss due to a receiver buffer full condition. A Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in the Receive Shift Register, and a new start bit is detected. If the DORn Flag is set there was one or more serial frame lost between the frame last read from UDRn, and the next frame read from UDRn. For compatibility with future devices, always write this bit to zero when writing to UCSRnA. The DORn Flag is cleared when the frame received was successfully moved from the Shift Register to the receive buffer. The Parity Error (UPEn) Flag indicates that the next frame in the receive buffer had a Parity Error when received. If Parity Check is not enabled the UPEn bit will always be read zero. For compatibility with future devices, always set this bit to zero when writing to UCSRnA. For more details see “Parity bit calculation” on page 181 and “Parity Checker” on page 188. 19.6.5 Parity Checker The Parity Checker is active when the high USART Parity mode (UPMn1) bit is set. Type of Parity Check to be performed (odd or even) is selected by the UPMn0 bit. When enabled, the Parity Checker calculates the parity of the data bits in incoming frames and compares the result with the parity bit from the serial frame. The result of the check is stored in the receive buffer together with the received data and stop bits. The Parity Error (UPEn) Flag can then be read by software to check if the frame had a Parity Error.189 7593L–AVR–09/12 AT90USB64/128 The UPEn bit is set if the next character that can be read from the receive buffer had a Parity Error when received and the Parity Checking was enabled at that point (UPMn1 = 1). This bit is valid until the receive buffer (UDRn) is read. 19.6.6 Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing receptions will therefore be lost. When disabled (that is, the RXENn is set to zero) the Receiver will no longer override the normal function of the RxDn port pin. The Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in the buffer will be lost 19.6.7 Flushing the receive buffer The receiver buffer FIFO will be flushed when the Receiver is disabled, that is, the buffer will be emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal operation, due to for instance an error condition, read the UDRn I/O location until the RXCn Flag is cleared. The following code example shows how to flush the receive buffer. Note: 1. See “About code examples” on page 10. 19.7 Asynchronous data reception The USART includes a clock recovery and a data recovery unit for handling asynchronous data reception. The clock recovery logic is used for synchronizing the internally generated baud rate clock to the incoming asynchronous serial frames at the RxDn pin. The data recovery logic samples and low pass filters each incoming bit, thereby improving the noise immunity of the Receiver. The asynchronous reception operational range depends on the accuracy of the internal baud rate clock, the rate of the incoming frames, and the frame size in number of bits. 19.7.1 Asynchronous clock recovery The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 19-5 on page 190 illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double Speed mode. The horizontal arrows illustrate the synchronization variation due to the sampling process. Note the larger time variation when using the Double Speed mode (U2Xn = 1) of operation. Samples denoted zero are samples done when the RxDn line is idle (that is, no communication activity). Assembly code example (1) USART_Flush: sbis UCSRnA, RXCn ret in r16, UDRn rjmp USART_Flush C code example (1) void USART_Flush( void ) { unsigned char dummy; while ( UCSRnA & (1< USBE=1 ID=1 Clock stopped FRZCLK=1 Macro off USBE=0 USBE=0 Host USBE=0 HW RESET USBE=1 ID=0 AT90USB647/1287 only AT90USB646/1286 forced mode247 7593L–AVR–09/12 AT90USB64/128 22.4.3 Interrupts Two interrupts vectors are assigned to USB interface. Figure 22-10. USB interrupt system. See Section 23.17, page 272 and Section 24.15, page 291 for more details on the Host and Device interrupts. USB general & OTG interrupt USB device interrupt USB host interrupt USB general interrupt vector Endpoint interrupt Pipe interrupt USB endpoint/pipe interrupt vector248 7593L–AVR–09/12 AT90USB64/128 Figure 22-11. USB general interrupt vector sources. IDTE USBCON.1 IDTI USBINT.1 VBUSTI USBINT.0 VBUSTE USBCON.0 STOI OTGINT.5 STOE OTGIEN.5 HNPERRI OTGINT.4 HNPERRE OTGIEN.4 ROLEEXI OTGINT.3 ROLEEXE OTGIEN.3 BCERRI OTGINT.2 BCERRE OTGIEN.2 VBERRI OTGINT.1 VBERRE OTGIEN.1 SRPI OTGINT.0 SRPE OTGIEN.0 USB general interrupt vector UPRSMI UDINT.6 UPRSME UDIEN.6 EORSMI UDINT.5 EORSME UDIEN.5 WAKEUPI UDINT.4 WAKEUPE UDIEN.4 EORSTI UDINT.3 EORSTE UDIEN.3 SOFI UDINT.2 SOFE UDIEN.2 SUSPI UDINT.0 SUSPE UDIEN.0 HWUPE UHIEN.6 HWUPI UHINT.6 HSOFI UHINT.5 HSOFE UHIEN.5 RXRSMI UHINT.4 RXRSME UHIEN.4 RSMEDI UHINT.3 RSMEDE UHIEN.3 RSTI UHINT.2 RSTE UHIEN.2 DDISCI UHINT.1 DDISCE UHIEN.1 DCONNI UHINT.0 DCONNE UHIEN.0 USB device interrupt USB host interrupt USB general interrupt vector Asynchronous interrupt source (allows the CPU to wake up from power down mode)249 7593L–AVR–09/12 AT90USB64/128 Figure 22-12. USB endpoint/pipe Interrupt vector sources. FLERRE UEIENX.7 OVERFI UESTAX.6 UNDERFI UESTAX.5 NAKINI UEINTX.6 NAKINE UEIENX.6 NAKOUTI UEINTX.4 TXSTPE UEIENX.4 RXSTPI UEINTX.3 RXSTPE UEIENX.3 RXOUTI UEINTX.2 RXOUTE UEIENX.2 STALLEDI UEINTX.1 STALLEDE UEIENX.1 EPINT UEINT.X Endpoint 0 Endpoint 1 Endpoint 2 Endpoint 3 Endpoint 4 Endpoint 5 Endpoint interrupt TXINI UEINTX.0 TXINE UEIENX.0 FLERRE UPIEN.7 UNDERFI UPSTAX.5 OVERFI UPSTAX.6 NAKEDI UPINTX.6 NAKEDE UPIEN.6 PERRI UPINTX.4 PERRE UPIEN.4 TXSTPI UPINTX.3 TXSTPE UPIEN.3 TXOUTI UPINTX.2 TXOUTE UPIEN.2 RXSTALLI UPINTX.1 RXSTALLE UPIEN.1 RXINI UPINTX.0 RXINE UPIEN.0 FLERRE UPIEN.X PIPE 0 PIPE 1 PIPE 2 PIPE 3 PIPE 4 PIPE 5 Pipe interrupt USB endpoint/pipe interrupt vector Endpoint 6 PIPE 6250 7593L–AVR–09/12 AT90USB64/128 Figure 22-13. USB general and OTG controller interrupt system. There are two kinds of interrupts: processing (that is, their generation are part of the normal processing) and exception (errors). Processing interrupts are generated when such events occur: • USB ID Pad change detection (insert, remove)(IDTI) • VBUS plug-in detection (insert, remove) (VBUSTI) • SRP detected(SRPI) • Role Exchanged(ROLEEXI) Exception Interrupts are generated with the following events: • Drop on VBus Detected(VBERRI) • Error during the B-Connection(BCERRI) • HNP Error(HNPERRI) • Time-out detected during Suspend mode(STOII) 22.5 Power modes 22.5.1 Idle mode In this mode, the CPU core is halted (CPU clock stopped). The Idle mode is taken wether the USB controller is running or not. The CPU “wakes up” on any USB interrupts. 22.5.2 Power down In this mode, the oscillator is stopped and halts all the clocks (CPU and peripherals). The USB controller “wakes up” when: • the WAKEUPI interrupt is triggered in the Peripheral mode (HOST cleared) IDTE USBCON.1 IDTI USBINT.1 VBUSTI USBINT.0 VBUSTE USBCON.0 STOI OTGINT.5 STOE OTGIEN.5 HNPERRI OTGINT.4 HNPERRE OTGIEN.4 ROLEEXI OTGINT.3 ROLEEXE OTGIEN.3 BCERRI OTGINT.2 BCERRE OTGIEN.2 VBERRI OTGINT.1 VBERRE OTGIEN.1 SRPI OTGINT.0 SRPE OTGIEN.0 USB general & OTG interrupt vector Asynchronous interrupt source (allows the CPU to wake up from power down mode251 7593L–AVR–09/12 AT90USB64/128 • the HWUPI interrupt is triggered in the Host mode (HOST set) • the IDTI interrupt is triggered • the VBUSTI interrupt is triggered 22.5.3 Freeze clock The firmware has the ability to reduce the power consumption by setting the FRZCLK bit, which freeze the clock of USB controller. When FRZCLK is set, it is still possible to access to the following registers: • USBCON, USBSTA, USBINT • UDCON (detach, ...) • UDINT • UDIEN • UHCON • UHINT • UHIEN Moreover, when FRZCLK is set, only the following interrupts may be triggered: • WAKEUPI • IDTI • VBUSTI • HWUPI 22.6 Speed control 22.6.1 Device mode When the USB interface is configured in device mode, the speed selection (Full Speed or Low Speed) depends on the UDP/UDM pull-up. The LSM bit in UDCON register allows to select an internal pull up on UDM (Low Speed mode) or UDP (Full Speed mode) data lines. Figure 22-14. Device mode speed selection. RPU DETACH UDCON.0 UDP UDM RPU LSM UDCON.2 UCAP USB regulator252 7593L–AVR–09/12 AT90USB64/128 22.6.2 Host mode When the USB interface is configured in host mode, internal Pull Down resistors are activated on both UDP UDM lines and the interface detects the type of connected device. 22.7 Memory management The controller does only support the following memory allocation management. The reservation of a Pipe or an Endpoint can only be made in the increasing order (Pipe/Endpoint 0 to the last Pipe/Endpoint). The firmware shall thus configure them in the same order. The reservation of a Pipe or an Endpoint “ki ” is done when its ALLOC bit is set. Then, the hardware allocates the memory and inserts it between the Pipe/Endpoints “ki-1” and “ki+1”. The “ki+1” Pipe/Endpoint memory “slides” up and its data is lost. Note that the “ki+2” and upper Pipe/Endpoint memory does not slide. Clearing a Pipe enable (PEN) or an Endpoint enable (EPEN) does not clear either its ALLOC bit, or its configuration (EPSIZE/PSIZE, EPBK/PBK). To free its memory, the firmware should clear ALLOC. Then, the “ki+1” Pipe/Endpoint memory automatically “slides” down. Note that the “ki+2” and upper Pipe/Endpoint memory does not slide. The following figure illustrates the allocation and reorganization of the USB memory in a typical example: Table 22-1. Allocation and reorganization USB memory flow. • First, Pipe/Endpoint 0 to Pipe/Endpoint 5 are configured, in the growing order. The memory of each is reserved in the DPRAM • Then, the Pipe/Endpoint 3 is disabled (EPEN=0), but its memory reservation is internally kept by the controller • Its ALLOC bit is cleared: the Pipe/Endpoint 4 “slides” down, but the Pipe/Endpoint 5 does not “slide” • Finally, if the firmware chooses to reconfigure the Pipe/Endpoint 3, with a bigger size. The controller reserved the memory after the endpoint 2 memory and automatically “slide” the Pipe/Endpoint 4. The Pipe/Endpoint 5 does not move and a memory conflict appear, in that Free memory 0 1 2 3 4 5 EPEN=1 ALLOC=1 Free memory 0 1 2 4 5 EPEN=0 (ALLOC=1) Free memory 0 1 2 4 5 Pipe/Endpoints activation Pipe/Endpoint Disable Free its memory (ALLOC=0) Free memory 0 1 2 3 (bigger size) 5 Pipe/Endpoint Activatation Lost memory 4 Conflict253 7593L–AVR–09/12 AT90USB64/128 both Pipe/Endpoint 4 and 5 use a common area. The data of those endpoints are potentially lost Note that: • the data of Pipe/Endpoint 0 are never lost whatever the activation or deactivation of the higher Pipe/Endpoint. Its data is lost if it is deactivated • Deactivate and reactivate the same Pipe/Endpoint with the same parameters does not lead to a “slide” of the higher endpoints. For those endpoints, the data are preserved • CFGOK is set by hardware even in the case where there is a “conflict” in the memory allocation 22.8 PAD suspend The next figures illustrates the pad behaviour: • In the “idle” mode, the pad is put in low power consumption mode • In the “active” mode, the pad is working Figure 22-15. Pad behaviour. The SUSPI flag indicated that a suspend state has been detected on the USB bus. This flag automatically put the USB pad in Idle. The detection of a non-idle event sets the WAKEUPI flag and wakes-up the USB pad. Moreover, the pad can also be put in the “idle” mode if the DETACH bit is set. It come back in the active mode when the DETACH bit is cleared. Idle mode Active mode USBE=1 & DETACH=0 & suspend USBE=0 | DETACH=1 | suspend SUSPI Suspend detected = USB pad power down Clear suspend by software Resume = USB pad wake-up WAKEUPI Clear resume by software PAD status Active Power Down Active254 7593L–AVR–09/12 AT90USB64/128 22.9 OTG timers customizing It is possible to refine some OTG timers thanks to the OTGTCON register that contains the PAGE bits to select the timer and the VALUE bits to adjust the value. User should refer to lastest releases of the OTG specification to select compliant timings. • PAGE=00b: AWaitVrise time-out. [OTG]. In Host mode, once VBUSREQ has been set to “1”, if no VBUS is detected on VBUS pin after this AWaitVrise delay then the VBERRI error flag is set. – VALUE=00bTime-out is set to 20ms – VALUE=01bTime-out is set to 50ms – VALUE=10bTime-out is set to 70ms – VALUE=11bTime-out is set to 100ms • PAGE=01b: VbBusPulsing. [OTG]. In Device mode, this delay corresponds to the pulse duration on Vbus during a SRP. – VALUE=00bTime-out is set to 15ms – VALUE=01bTime-out is set to 23ms – VALUE=10bTime-out is set to 31ms – VALUE=11bTime-out is set to 40ms • PAGE=10b: PdTmOutCnt. [OTG]. In Device mode, when a SRP has been requested to be sent by the firmware, this delay is waited by the hardware after VBUS has gone below the “session_valid” threshold voltage and before initiating the first pulse. This delay should be considered as an approximation of USB lines discharge (pull-down resistors vs. line capacitance) in order to wait that VBUS has gone below the “b_session_end” threshold voltae, as defined in the OTG specification. – VALUE=00bTime-out is set to 93ms – VALUE=01bTime-out is set to 105ms – VALUE=10bTime-out is set to 118ms – VALUE=11bTime-out is set to 131ms • PAGE=11b: SRPDetTmOut. [OTG]. In Host mode, this delay is the minimum pulse duration required to detect and accept a valid SRP from a Device. – VALUE=00bTime-out is set to 1µs – VALUE=01bTime-out is set to 100µs – VALUE=10bTime-out is set to 1ms – VALUE=11bTime-out is set to 11ms255 7593L–AVR–09/12 AT90USB64/128 22.10 Plug-in detection The USB connection is detected by the VBUS pad, thanks to the following architecture: Figure 22-16. Plug-in detection input block diagram. The control logic of the VBUS pad outputs a signal regarding the VBUS voltage level: • The “Session_valid” signal is active high when the voltage on the VBUS pad is higher or equal to 1.4V. If lower than 1.4V, the signal is not active • The “Vbus_valid” signal is active high when the voltage on the VBUS pad is higher or equal to 4.4V. If lower than 4.4V, the signal is not active • The VBUS status bit is set when VBUS is greater than “Vbus_valid”. The VBUS status bit is cleared when VBUS falls below “Session_valid” (hysteresis behavior) • The VBUSTI flag is set each time the VBUS bit state changes 22.10.1 Peripheral mode The USB peripheral cannot attach to the bus while VBUS bit is not set. 22.10.2 Host mode The Host must use the UVCON pin to drive an external power switch or regulator that powers the Vbus line. The UVCON pin is automatically asserted and set high by hardware when UVCONE and VBUSREQ bits are set by firmware. If a device connects (pull-up on DP or DM) within 300ms of Vbus delivery, the DCONNI flag will rise. But, once VBUSREQ bit has been set, if no peripheral connection is detected within 300ms, the BCERRI flag (and interrupt) will rise and Vbus delivery will be stopped (UVCON cleared). If that behavior represents a limitation for the Host application, the following work-around may be used : 1. UVCONE and VBUSREQ must be cleared. 2. VBUSHWC must be set (to disable hardware control of UVCON pin). 3. PORTE,7 pin (alternate function of UVCON pin) must be set by firmware. 4. a device connection will be detected thanks to the SRPI flag (that may usually be used to detect a DP/DM pulse sent by an OTG B-Device that requests a new session). VBUSTI USBINT.0 VBUS VBUS USBSTA.0 VSS VDD Pad logic Logic Session_valid RPU RPU VBus_pulsing VBus_discharge Vbus_valid256 7593L–AVR–09/12 AT90USB64/128 22.11 ID detection The ID pin transition is detected thanks to the following architecture: Figure 22-17. ID detection input block diagram. The ID pin can be used to detect the USB mode (Peripheral or Host) or software selected. This allows the UID pin to be used has general purpose I/O even when USB interface is enable. When the UID pin is selected, by default, (no A-plug or B-plug), the macro is in the Peripheral mode (internal pull-up). The IDTI interrupt is triggered when a A-plug (Host) is plugged or unplugged. The interrupt is not triggered when a B-plug (Periph) is plugged or unplugged. ID detection is independent of USB global interface enable. 22.12 Registers description 22.12.1 USB general registers • 7 – UIMOD: USB Mode bit This bit has no effect when the UIDE bit is set (external UID pin activated). Set to enable the USB device mode. Clear to enable the USB host mode • 6 – UIDE: UID pin Enable Set to enable the USB mode selection (peripheral/host) through the UID pin. Clear to enable the USB mode selection (peripheral/host) with UIMOD bit register. UIDE should be modified only when the USB interface is disabled (USBE bit cleared). • 5 – Reserved The value read from this bit is always 0. Do not set this bit. • 4 – UVCONE: UVCON pin Enable Set to enable the UVCON pin control. Clear to disable the UVCON pin control. This bit should be set only when the USB interface is enable. RPU UIMOD UHWCON.7 UID ID USBSTA.1 Internal pull up VDD UIDE UHWCON.6 1 0 Bit 7 6 5 4 3 2 1 0 UIMOD UIDE UVCONE UVREGE UHWCON Read/write R/W R/W R R/W R R R R/W Initial value 1 0 0 0 0 0 0 0257 7593L–AVR–09/12 AT90USB64/128 • 3-1 – Reserved The value read from these bits is always 0. Do not set these bits. • 0 – UVREGE: USB pad regulator Enable Set to enable the USB pad regulator. Clear to disable the USB pad regulator. • 7 – USBE: USB macro Enable bit Set to enable the USB controller. Clear to disable and reset the USB controller, to disable the USB transceiver and to disable the USB controller clock inputs. • 6 – HOST: HOST bit Set to enable the Host mode. Clear to enable the device mode. • 5 – FRZCLK: Freeze USB Clock bit Set to disable the clock inputs (the ”Resume Detection” is still active). This reduces the power consumption. Clear to enable the clock inputs. • 4 – OTGPADE: OTG Pad Enable Set to enable the OTG pad. Clear to disable the OTG pad. The OTG pad is actually the VBUS pad. Note that this bit can be set/cleared even if USBE=0. That allows the VBUS detection even if the USB macro is disabled. This pad must be enabled in both Host and Device modes in order to allow USB operation (attaching, transmitting...). • 3-2 – Reserved The value read from these bits is always 0. Do not set these bits. • 1 – IDTE: ID Transition Interrupt Enable bit Set this bit to enable the ID Transition interrupt generation. Clear this bit to disable the ID Transition interrupt generation. • 0 – VBUSTE: VBUS Transition Interrupt Enable bit Set this bit to enable the VBUS Transition interrupt generation. Clear this bit to disable the VBUS Transition interrupt generation. • 7-4 - Reserved The value read from these bits is always 0. Do not set these bits. Bit 7 6 5 4 3 2 1 0 USBE HOST FRZCLK OTGPADE - - IDTE VBUSTE USBCON Read/write R/W R/W R/W R/W R R R/W R/W Initial value 0 0 1 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - - - SPEED ID VBUS USBSTA Read/write R R R R R R R R Initial value 0 0 0 0 1 0 1 0258 7593L–AVR–09/12 AT90USB64/128 • 3 – SPEED: Speed Status Flag This should be read only when the USB controller operates in host mode, in device mode the value read from this bit is undeterminated. Set by hardware when the controller is in FULL-SPEED mode. Cleared by hardware when the controller is in LOW-SPEED mode. • 2 – Reserved The value read from this bit is always 0. Do not set this bit. • 1 – ID: IUD pin flag The value read from this bit indicates the state of the UID pin. • 0 – VBUS: VBus flag The value read from this bit indicates the state of the VBUS pin. This bit can be used in device mode to monitor the USB bus connection state of the application. See Section 22.10, page 255 for more details. 7-2 - Reserved The value read from these bits is always 0. Do not set these bits. 1 – IDTI: D Transition Interrupt flag Set by hardware when a transition (high to low, low to high) has been detected on the UID pin. Shall be cleared by software. • 0 – VBUSTI: IVBUS Transition Interrupt flag Set by hardware when a transition (high to low, low to high) has been detected on the VBUS pad. Shall be cleared by software. • 7-6 - Reserved The value read from these bits is always 0. Do not set these bits. • 5 – HNPREQ: HNP Request bit Set to initiate the HNP when the controller is in the Device mode (B). Set to accept the HNP when the controller is in the Host mode (A). Clear otherwise. Bit 7 6 5 4 3 2 1 0 - - - - - - IDTI VBUSTI USBINT Read/write R R R R R R R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - HNPREQ SRPREQ SRPSEL VBUSHWC VBUSREQ VBUSRQC OTGCON Read/write R R R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0259 7593L–AVR–09/12 AT90USB64/128 • 4 – SRPREQ: SRP Request bit Set to initiate the SRP when the controller is in Device mode. Cleared by hardware when the controller is initiating a SRP. • 3 – SRPSEL: SRP Selection bit Set to choose VBUS pulsing as SRP method. Clear to choose data line pulsing as SRP method. • 2 – VBUSHWC: VBus Hardware Control bit Set to disable the hardware control over the UVCON pin. Clear to enable the hardware control over the UVCON pin. See for more details • 1 – VBUSREQ: VBUS Request bit Set to assert the UVCON pin in order to enable the VBUS power supply generation. This bit shall be used when the controller is in the Host mode. Cleared by hardware when VBUSRQC is set. • 0 – VBUSRQC: VBUS Request Clear bit Set to deassert the UVCON pin in order to enable the VBUS power supply generation. This bit shall be used when the controller is in the Host mode. Cleared by hardware immediately after the set. • 7 – Reserved This bit is reserved and always set. • 6-5 – PAGE: Timer page access bit Set/clear to access a special timer register. See Section 22.9, page 254 for more details. • 4-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 1-0 – VALUE: Value bit Set to initialize the new value of the timer. See Section 22.9, page 254 for more details. Bit 7 6 5 4 3 2 1 0 - PAGE - - - VALUE OTGTCON Read/write R R/W R/W R R R/W R/W R/W Initial value 1 0 0 0 0 0 0 0260 7593L–AVR–09/12 AT90USB64/128 • 7-6 - Reserved The value read from these bits is always 0. Do not set these bits. • 5 – STOE: Suspend Time-out Error Interrupt Enable bit Set to enable the STOI interrupt. Clear to disable the STOI interrupt. • 4 – HNPERRE: HNP Error Interrupt Enable bit Set to enable the HNPERRI interrupt. Clear to disable the HNPERRI interrupt. • 3 – ROLEEXE: Role Exchange Interrupt Enable bit Set to enable the ROLEEXI interrupt. Clear to disable the ROLEEXI interrupt. • 2 – BCERRE: B-Connection Error Interrupt Enable bit Set to enable the BCERRI interrupt. Clear to disable the BCERRI interrupt. • 1 – VBERRE: VBus Error Interrupt Enable bit Set to enable the VBERRI interrupt. Clear to disable the VBERRI interrupt. • 0 – SRPE: SRP Interrupt Enable bit Set to enable the SRPI interrupt. Clear to disable the SRPI interrupt. • 7-6 - Reserved The value read from these bits is always 0. Do not set these bits. • 5 – STOI: Suspend Time-out Error Interrupt flag Set by hardware when a time-out error (more than 150ms) has been detected after a suspend. Shall be cleared by software. • 4 – HNPERRI: HNP Error Interrupt flag Set by hardware when an error has been detected during the protocol. Shall be cleared by software. • 3 – ROLEEXI: Role Exchange Interrupt flag Set by hardware when the USB controller has successfully swapped its mode, due to an HNP negotiation: Host to Device or Device to Host. However the mode selection bit (Host/Device) is unchanged and must be changed by firmware in order to reach the correct RAM locations and events bits. Shall be cleared by software. Bit 7 6 5 4 3 2 1 0 - - STOE HNPERRE ROLEEXE BCERRE VBERRE SRPE OTGIEN Read/write R R R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - STOI HNPERRI ROLEEXI BCERRI VBERRI SRPI OTGINT Read/write R R R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0261 7593L–AVR–09/12 AT90USB64/128 • 2 – BCERRI: B-Connection Error Interrupt flag Set by hardware when an error occur during the B-Connection (that is, if Peripheral has not connected after 300ms of Vbus delivery request). Shall be cleared by software. • 1 – VBERRI: V-Bus Error Interrupt flag Set by hardware when a drop on VBus has been detected. Shall be cleared by software. • 0 – SRPI: SRP Interrupt flag Set by hardware when a SRP has been detected. Shall be used in the Host mode only. Shall be cleared by software. 22.13 USB Software Operating modes Depending on the USB operating mode, the software should perform some the following operations: Power On the USB interface • Power-On USB pads regulator • Configure PLL interface • Enable PLL and wait PLL lock • Enable USB interface • Configure USB interface (USB speed, Endpoints configuration...) • Wait for USB VBUS information connection • Attach USB device Power Off the USB interface • Detach USB interface • Disable USB interface • Disable PLL • Disable USB pad regulator Suspending the USB interface • Clear Suspend Bit • Freeze USB clock • Disable PLL • Be sure to have interrupts enable to exit sleep mode • Make the MCU enter sleep mode Resuming the USB interface • Enable PLL • Wait PLL lock • Unfreeze USB clock • Clear Resume information262 7593L–AVR–09/12 AT90USB64/128 23. USB device operating modes 23.1 Introduction The USB device controller supports full speed and low speed data transfers. In addition to the default control endpoint, it provides six other endpoints, which can be configured in control, bulk, interrupt or isochronous modes: • Endpoint 0:programmable size FIFO up to 64 bytes, default control endpoint • Endpoints 1 programmable size FIFO up to 256 bytes in ping-pong mode • Endpoints 2 to 6: programmable size FIFO up to 64 bytes in ping-pong mode The controller starts in the “idle” mode. In this mode, the pad consumption is reduced to the minimum. 23.2 Power-on and reset The next diagram explains the USB device controller main states on power-on: Figure 23-1. USB device controller states after reset. The reset state of the Device controller is: • the macro clock is stopped in order to minimize the power consumption (FRZCLK set) • the USB device controller internal state is reset (all the registers are reset to their default value. Note that DETACH is set.) • the endpoint banks are reset • the D+ or D- pull up are not activated (mode Detach) The D+ or D- pull-up will be activated as soon as the DETACH bit is cleared and VBUS is present. The macro is in the ‘Idle’ state after reset with a minimum power consumption and does not need to have the PLL activated to enter in this state. The USB device controller can at any time be reset by clearing USBE (disable USB interface). 23.3 Endpoint reset An endpoint can be reset at any time by setting in the UERST register the bit corresponding to the endpoint (EPRSTx). This resets: • the internal state machine on that endpoint • the Rx and Tx banks are cleared and their internal pointers are restored Reset Idle HW RESET USBE=0 USBE=0 USBE=1 UID=1263 7593L–AVR–09/12 AT90USB64/128 • the UEINTX, UESTA0X and UESTA1X are restored to their reset value The data toggle field remains unchanged. The other registers remain unchanged. The endpoint configuration remains active and the endpoint is still enabled. The endpoint reset may be associated with a clear of the data toggle command (RSTDT bit) as an answer to the CLEAR_FEATURE USB command. 23.4 USB reset When an USB reset is detected on the USB line, the next operations are performed by the controller: • all the endpoints are disabled • the default control endpoint remains configured (see Section 23.3, page 262 for more details) 23.5 Endpoint selection Prior to any operation performed by the CPU, the endpoint must first be selected. This is done by setting the EPNUM2:0 bits (UENUM register) with the endpoint number which will be managed by the CPU. The CPU can then access to the various endpoint registers and data. 23.6 Endpoint activation The endpoint is maintained under reset as long as the EPEN bit is not set. The following flow must be respected in order to activate an endpoint:264 7593L–AVR–09/12 AT90USB64/128 Figure 23-2. Endpoint activation flow. As long as the endpoint is not correctly configured (CFGOK cleared), the hardware does not acknowledge the packets sent by the host. CFGOK is will not be sent if the Endpoint size parameter is bigger than the DPRAM size. A clear of EPEN acts as an endpoint reset (see Section 23.3, page 262 for more details). It also performs the next operation: • The configuration of the endpoint is kept (EPSIZE, EPBK, ALLOC kept) • It resets the data toggle field • The DPRAM memory associated to the endpoint is still reserved See Section 22.7, page 252 for more details about the memory allocation/reorganization. 23.7 Address setup The USB device address is set up according to the USB protocol: • the USB device, after power-up, responds at address 0 • the host sends a SETUP command (SET_ADDRESS(addr)) • the firmware records that address in UADD, but keep ADDEN cleared • the USB device sends an IN command of 0 bytes (IN 0 Zero Length Packet) • then, the firmware can enable the USB device address by setting ADDEN. The only accepted address by the controller is the one stored in UADD ADDEN and UADD shall not be written at the same time. UADD contains the default address 00h after a power-up or USB reset. Endpoint Activation CFGOK=1 ERROR No Yes Endpoint activated Activate the endpoint Select the endpoint EPEN=1 UENUM EPNUM=x Test the correct endpoint configuration UECFG1X ALLOC EPSIZE EPBK Configure: - the endpoint size - the bank parametrization Allocation and reorganization of the memory is made on-the-fly UECFG0X EPDIR EPTYPE ... Configure: - the endpoint direction - the endpoint type265 7593L–AVR–09/12 AT90USB64/128 ADDEN is cleared by hardware: • after a power-up reset • when an USB reset is received • or when the macro is disabled (USBE cleared) When this bit is cleared, the default device address 00h is used. 23.8 Suspend, wake-up and resume After a period of 3ms during which the USB line was inactive, the controller switches to the fullspeed mode and triggers (if enabled) the SUSPI (suspend) interrupt. The firmware may then set the FRZCLK bit. The CPU can also, depending on software architecture, enter in the idle mode to lower again the power consumption. There are two ways to recover from the “Suspend” mode: • First one is to clear the FRZCLK bit. This is possible if the CPU is not in the Idle mode • Second way, if the CPU is “idle”, is to enable the WAKEUPI interrupt (WAKEUPE set). Then, as soon as an non-idle signal is seen by the controller, the WAKEUPI interrupt is triggered. The firmware shall then clear the FRZCLK bit to restart the transfer There are no relationship between the SUSPI interrupt and the WAKEUPI interrupt: the WAKEUPI interrupt is triggered as soon as there are non-idle patterns on the data lines. Thus, the WAKEUPI interrupt can occurs even if the controller is not in the “suspend” mode. When the WAKEUPI interrupt is triggered, if the SUSPI interrupt bit was already set, it is cleared by hardware. When the SUSPI interrupt is triggered, if the WAKEUPI interrupt bit was already set, it is cleared by hardware. 23.9 Detach The reset value of the DETACH bit is 1. It is possible to re-enumerate a device, simply by setting and clearing the DETACH bit. • Setting DETACH will disconnect the pull-up on the D+ or D- pad (depending on full or low speed mode selected). Then, clearing DETACH will connect the pull-up on the D+ or D- pad Figure 23-3. Detach a device in full-speed. EN=1 D + UVREF D - Detach, then Attach EN=1 D + UVREF D -266 7593L–AVR–09/12 AT90USB64/128 23.10 Remote Wake-up The “Remote Wake-up” (or “upstream resume”) request is the only operation allowed to be sent by the device on its own initiative. Anyway, to do that, the device should first have received a DEVICE_REMOTE_WAKEUP request from the host. • First, the USB controller must have detected the “suspend” state of the line: the remote wakeup can only be sent when a SUSPI flag is set • The firmware has then the ability to set RMWKUP to send the “upstream resume” stream. This will automatically be done by the controller after 5ms of inactivity on the USB line • When the controller starts to send the “upstream resume”, the UPRSMI interrupt is triggered (if enabled). SUSPI is cleared by hardware • RMWKUP is cleared by hardware at the end of the “upstream resume” • If the controller detects a good “End Of Resume” signal from the host, an EORSMI interrupt is triggered (if enabled) 23.11 STALL request For each endpoint, the STALL management is performed using two bits: – STALLRQ (enable stall request) – STALLRQC (disable stall request) – STALLEDI (stall sent interrupt) To send a STALL handshake at the next request, the STALLRQ request bit has to be set. All following requests will be handshak’ed with a STALL until the STALLRQC bit is set. Setting STALLRQC automatically clears the STALLRQ bit. The STALLRQC bit is also immediately cleared by hardware after being set by software. Thus, the firmware will never read this bit as set. Each time the STALL handshake is sent, the STALLEDI flag is set by the USB controller and the EPINTx interrupt will be triggered (if enabled). The incoming packets will be discarded (RXOUTI and RWAL will not be set). The host will then send a command to reset the STALL: the firmware just has to set the STALLRQC bit and to reset the endpoint. 23.11.1 Special consideration for control endpoints A SETUP request is always ACK’ed. If a STALL request is set for a Control Endpoint and if a SETUP request occurs, the SETUP request has to be ACK’ed and the STALLRQ request and STALLEDI sent flags are automatically reset (RXSETUPI set, TXIN cleared, STALLED cleared, TXINI cleared...). This management simplifies the enumeration process management. If a command is not supported or contains an error, the firmware set the STALL request flag and can return to the main task, waiting for the next SETUP request. This function is compliant with the Chapter 8 test that may send extra status for a GET_DESCRIPTOR. The firmware sets the STALL request just after receiving the status. All extra status will be automatically STALL’ed until the next SETUP request.267 7593L–AVR–09/12 AT90USB64/128 23.11.2 STALL handshake and retry mechanism The Retry mechanism has priority over the STALL handshake. A STALL handshake is sent if the STALLRQ request bit is set and if there is no retry required. 23.12 CONTROL endpoint management A SETUP request is always ACK’ed. When a new setup packet is received, the RXSTPI interrupt is triggered (if enabled). The RXOUTI interrupt is not triggered. The FIFOCON and RWAL fields are irrelevant with CONTROL endpoints. The firmware shall thus never use them on that endpoints. When read, their value is always 0. CONTROL endpoints are managed by the following bits: • RXSTPI is set when a new SETUP is received. It shall be cleared by firmware to acknowledge the packet and to clear the endpoint bank • RXOUTI is set when a new OUT data is received. It shall be cleared by firmware to acknowledge the packet and to clear the endpoint bank • TXINI is set when the bank is ready to accept a new IN packet. It shall be cleared by firmware to send the packet and to clear the endpoint bank 23.12.1 Control write Figure 23-4 shows a control write transaction. During the status stage, the controller will not necessary send a NAK at the first IN token: • If the firmware knows the exact number of descriptor bytes that must be read, it can then anticipate on the status stage and send a ZLP for the next IN token • or it can read the bytes and poll NAKINI, which tells that all the bytes have been sent by the host, and the transaction is now in the status stage Figure 23-4. Control write transaction. 23.12.2 Control read Figure 23-5 on page 268 shows a control read transaction. The USB controller has to manage the simultaneous write requests from the CPU and the USB host. SETUP RXSTPI RXOUTI TXINI USB line HW SW OUT HW SW OUT HW SW IN IN NAK SW SETUP STATUS DATA268 7593L–AVR–09/12 AT90USB64/128 Figure 23-5. Control read transaction. A NAK handshake is always generated at the first status stage command. When the controller detect the status stage, all the data writen by the CPU are erased, and clearing TXINI has no effects. The firmware checks if the transmission is complete or if the reception is complete. The OUT retry is always ack’ed. This reception: - set the RXOUTI flag (received OUT data) - set the TXINI flag (data sent, ready to accept new data) software algorithm: set transmit ready wait (transmit complete OR Receive complete) if receive complete, clear flag and return if transmit complete, continue Once the OUT status stage has been received, the USB controller waits for a SETUP request. The SETUP request have priority over any other request and has to be ACK’ed. This means that any other flag should be cleared and the fifo reset when a SETUP is received. WARNING: the byte counter is reset when the OUT Zero Length Packet is received. The firmware has to take care of this. 23.13 OUT endpoint management OUT packets are sent by the host. All the data can be read by the CPU, which acknowledges or not the bank when it is empty. 23.13.1 Overview The Endpoint must be configured first. Each time the current bank is full, the RXOUTI and the FIFOCON bits are set. This triggers an interrupt if the RXOUTE bit is set. The firmware can acknowledge the USB interrupt by clearing the RXOUTI bit. The Firmware read the data and clear the FIFOCON bit in order to free the current bank. If the OUT Endpoint is composed of multiple banks, clearing the FIFOCON bit will switch to the next bank. The RXOUTI and FIFOCON bits are then updated by hardware in accordance with the status of the new bank. SETUP RXSTPI RXOUTI TXINI USB line HW SW IN HW SW IN OUT OUT NAK SW SW HW Wr Enable HOST Wr Enable CPU SETUP STATUS DATA269 7593L–AVR–09/12 AT90USB64/128 RXOUTI shall always be cleared before clearing FIFOCON. The RWAL bit always reflects the state of the current bank. This bit is set if the firmware can read data from the bank, and cleared by hardware when the bank is empty. Figure 23-6. Example with 1 and 2 OUT data bank. 23.13.2 Detailed description The data are read by the CPU, following the next flow: • When the bank is filled by the host, an endpoint interrupt (EPINTx) is triggered, if enabled (RXOUTE set) and RXOUTI is set. The CPU can also poll RXOUTI or FIFOCON, depending on the software architecture • The CPU acknowledges the interrupt by clearing RXOUTI • The CPU can read the number of byte (N) in the current bank (N=BYCT) • The CPU can read the data from the current bank (“N” read of UEDATX) • The CPU can free the bank by clearing FIFOCON when all the data is read, that is: – after “N” read of UEDATX – as soon as RWAL is cleared by hardware If the endpoint uses two banks, the second one can be filled by the HOST while the current one is being read by the CPU. Then, when the CPU clear FIFOCON, the next bank may be already ready and RXOUTI is set immediately. 23.14 IN endpoint management IN packets are sent by the USB device controller, upon an IN request from the host. All the data can be written by the CPU, which acknowledge or not the bank when it is full. OUT DATA (to bank 0) ACK RXOUTI FIFOCON HW OUT DATA (to bank 0) ACK HW SW SW SW read data from CPU BANK 0 OUT DATA (to bank 0) ACK RXOUTI FIFOCON HW OUT DATA (to bank 1) ACK SW SW Example with 2 OUT data banks read data from CPU BANK 0 HW SW read data from CPU BANK 0 read data from CPU BANK 1 NAK270 7593L–AVR–09/12 AT90USB64/128 23.14.1 Overview The Endpoint must be configured first. The TXINI bit is set by hardware when the current bank becomes free. This triggers an interrupt if the TXINE bit is set. The FIFOCON bit is set at the same time. The CPU writes into the FIFO and clears the FIFOCON bit to allow the USB controller to send the data. If the IN Endpoint is composed of multiple banks, this also switches to the next data bank. The TXINI and FIFOCON bits are automatically updated by hardware regarding the status of the next bank. TXINI shall always be cleared before clearing FIFOCON. The RWAL bit always reflects the state of the current bank. This bit is set if the firmware can write data to the bank, and cleared by hardware when the bank is full. Figure 23-7. Example with 1 and 2 IN data bank. 23.14.2 Detailed description The data are written by the CPU, following the next flow: • When the bank is empty, an endpoint interrupt (EPINTx) is triggered, if enabled (TXINE set) and TXINI is set. The CPU can also poll TXINI or FIFOCON, depending the software architecture choice • The CPU acknowledges the interrupt by clearing TXINI • The CPU can write the data into the current bank (write in UEDATX) • The CPU can free the bank by clearing FIFOCON when all the data are written, that is: – after “N” write into UEDATX – as soon as RWAL is cleared by hardware IN DATA (bank 0) ACK TXINI FIFOCON HW write data from CPU BANK 0 Example with 2 IN data banks SW SW SW SW IN IN DATA (bank 0) ACK TXINI FIFOCON write data from CPU BANK 0 SW SW SW SW IN DATA (bank 1) ACK write data from CPU BANK 0 write data from CPU BANK 1 SW HW write data from CPU BANK0 NAK271 7593L–AVR–09/12 AT90USB64/128 If the endpoint uses two banks, the second one can be read by the HOST while the current is being written by the CPU. Then, when the CPU clears FIFOCON, the next bank may be already ready (free) and TXINI is set immediately. 23.14.2.1 Abort An “abort” stage can be produced by the host in some situations: • In a control transaction: ZLP data OUT received during a IN stage • In an isochronous IN transaction: ZLP data OUT received on the OUT endpoint during a IN stage on the IN endpoint • ... The KILLBK bit is used to kill the last “written” bank. The best way to manage this abort is to perform the following operations: Table 23-1. Abort flow. 23.15 Isochronous mode 23.15.1 Underflow An underflow can occur during IN stage if the host attempts to read a bank which is empty. In this situation, the UNDERFI interrupt is triggered. An underflow can also occur during OUT stage if the host send a packet while the banks are already full. Typically, he CPU is not fast enough. The packet is lost. It is not possible to have underflow error during OUT stage, in the CPU side, since the CPU should read only if the bank is ready to give data (RXOUTI=1 or RWAL=1) 23.15.2 CRC error A CRC error can occur during OUT stage if the USB controller detects a bad received packet. In this situation, the STALLEDI interrupt is triggered. This does not prevent the RXOUTI interrupt from being triggered. Endpoint Abort Abort done Abort is based on the fact that no banks are busy, meaning that nothing has to be sent. Disable the TXINI interrupt. Endpoint reset NBUSYBK =0 Yes Clear UEIENX. TXINE No KILLBK=1 KILLBK=1 Yes Kill the last written bank. Wait for the end of the procedure. No272 7593L–AVR–09/12 AT90USB64/128 23.16 Overflow In Control, Isochronous, Bulk or Interrupt Endpoint, an overflow can occur during OUT stage, if the host attempts to write in a bank that is too small for the packet. In this situation, the OVERFI interrupt is triggered (if enabled). The packet is acknowledged and the RXOUTI interrupt is also triggered (if enabled). The bank is filled with the first bytes of the packet. It is not possible to have overflow error during IN stage, in the CPU side, since the CPU should write only if the bank is ready to access data (TXINI=1 or RWAL=1). 23.17 Interrupts Figure 23-8 shows all the interrupts sources. Figure 23-8. USB device controller interrupt system. There are two kinds of interrupts: processing (that is, their generation are part of the normal processing) and exception (errors). Processing interrupts are generated when: • VBUS plug-in detection (insert, remove)(VBUSTI) • Upstream resume(UPRSMI) • End of resume(EORSMI) • Wake up(WAKEUPI) • End of reset (Speed Initialization)(EORSTI) • Start of frame(SOFI, if FNCERR=0) • Suspend detected after 3ms of inactivity(SUSPI) Exception Interrupts are generated when: • CRC error in frame number of SOF(SOFI, FNCERR=1) UPRSMI UDINT.6 UPRSME UDIEN.6 EORSMI UDINT.5 EORSME UDIEN.5 WAKEUPI UDINT.4 WAKEUPE UDIEN.4 EORSTI UDINT.3 EORSTE UDIEN.3 SOFI UDINT.2 SOFE UDIEN.2 SUSPI UDINT.0 SUSPE UDIEN.0 USB device interrupt273 7593L–AVR–09/12 AT90USB64/128 Figure 23-9. USB device controller endpoint interrupt system. Processing interrupts are generated when: • Ready to accept IN data(EPINTx, TXINI=1) • Received OUT data(EPINTx, RXOUTI=1) • Received SETUP(EPINTx, RXSTPI=1) Exception Interrupts are generated when: • Stalled packet(EPINTx, STALLEDI=1) • CRC error on OUT in isochronous mode(EPINTx, STALLEDI=1) • Overflow in isochronous mode(EPINTx, OVERFI=1) • Underflow in isochronous mode(EPINTx, UNDERFI=1) • NAK IN sent(EPINTx, NAKINI=1) • NAK OUT sent(EPINTx, NAKOUTI=1) 23.18 Registers 23.18.1 USB device general registers EPINT UEINT.X Endpoint 0 Endpoint 1 Endpoint 2 Endpoint 3 Endpoint 4 Endpoint 5 Endpoint interrupt Endpoint 6 FLERRE UEIENX.7 OVERFI UESTAX.6 UNDERFI UESTAX.5 NAKINI UEINTX.6 NAKINE UEIENX.6 NAKOUTI UEINTX.4 TXSTPE UEIENX.4 RXSTPI UEINTX.3 TXOUTE UEIENX.3 RXOUTI UEINTX.2 RXOUTE UEIENX.2 STALLEDI UEINTX.1 STALLEDE UEIENX.1 TXINI UEINTX.0 TXINE UEIENX.0 Bit 7 6 5 4 3 2 1 0 ----- LSM RMWKUP DETACH UDCON Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 1274 7593L–AVR–09/12 AT90USB64/128 • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2 - LSM - USB Device Low Speed Mode selection When configured USB is configured in device mode, this bit allows to select the USB the USB Low Speed or Full Speed Mod. Clear to select full speed mode (D+ internal pull-up will be activate with the ATTACH bit will be set) . Set to select low speed mode (D- internal pull-up will be activate with the ATTACH bit will be set). This bit has no effect when the USB interface is configured in HOST mode. • 1- RMWKUP - Remote Wake-up bit Set to send an “upstream-resume” to the host for a remote wake-up (the SUSPI bit must be set). Cleared by hardware when signalling finished. Clearing by software has no effect. See Section 23.10, page 266 for more details. • 0 - DETACH - Detach bit Set to physically detach de device (disconnect internal pull-up on D+ or D-). Clear to reconnect the device. See Section 23.9, page 265 for more details. • 7 - Reserved The value read from this bits is always 0. Do not set this bit. • 6 - UPRSMI - Upstream Resume Interrupt flag Set by hardware when the USB controller is sending a resume signal called “Upstream Resume”. This triggers an USB interrupt if UPRSME is set. Shall be cleared by software (USB clocks must be enabled before). Setting by software has no effect. • 5 - EORSMI - End Of Resume Interrupt flag Set by hardware when the USB controller detects a good “End Of Resume” signal initiated by the host. This triggers an USB interrupt if EORSME is set. Shall be cleared by software. Setting by software has no effect. • 4 - WAKEUPI - Wake-up CPU Interrupt flag Set by hardware when the USB controller is re-activated by a filtered non-idle signal from the lines (not by an upstream resume). This triggers an interrupt if WAKEUPE is set. This interrupt should be enable only to wake up the CPU core from power down mode. Shall be cleared by software (USB clock inputs must be enabled before). Setting by software has no effect. See Section 23.8, page 265 for more details. Bit 7 6 5 4 3 2 1 0 - UPRSMI EORSMI WAKEUPI EORSTI SOFI - SUSPI UDINT Read/write Initial value 0 0 0 0 0 0 0 0275 7593L–AVR–09/12 AT90USB64/128 • 3 - EORSTI - End Of Reset Interrupt flag Set by hardware when an “End Of Reset” has been detected by the USB controller. This triggers an USB interrupt if EORSTE is set. Shall be cleared by software. Setting by software has no effect. • 2 - SOFI - Start Of Frame Interrupt flag Set by hardware when an USB “Start Of Frame” PID (SOF) has been detected (every 1ms). This triggers an USB interrupt if SOFE is set. • 1 - Reserved The value read from this bits is always 0. Do not set this bit • 0 - SUSPI - Suspend Interrupt flag Set by hardware when an USB “Suspend” ‘idle bus for three frame periods: a J state for 3ms) is detected. This triggers an USB interrupt if SUSPE is set. Shall be cleared by software. Setting by software has no effect. See Section 23.8, page 265 for more details. The interrupt bits are set even if their corresponding ‘Enable’ bits is not set. • 7 - Reserved The value read from this bits is always 0. Do not set this bit. • 6 - UPRSME - Upstream Resume Interrupt Enable bit Set to enable the UPRSMI interrupt. Clear to disable the UPRSMI interrupt. • 5 - EORSME - End Of Resume Interrupt Enable bit Set to enable the EORSMI interrupt. Clear to disable the EORSMI interrupt. • 4 - WAKEUPE - Wake-up CPU Interrupt Enable bit Set to enable the WAKEUPI interrupt. For correct interrupt handle execution, this interrupt should be enable only before entering power-down mode. Clear to disable the WAKEUPI interrupt. • 3 - EORSTE - End Of Reset Interrupt Enable bit Set to enable the EORSTI interrupt. This bit is set after a reset. Clear to disable the EORSTI interrupt. • 2 - SOFE - Start Of Frame Interrupt Enable bit Set to enable the SOFI interrupt. Clear to disable the SOFI interrupt. Bit 7 6 5 4 3 2 1 0 - UPRSME EORSME WAKEUPE EORSTE SOFE - SUSPE UDIEN Read/write Initial value 0 0 0 0 0 0 0 0276 7593L–AVR–09/12 AT90USB64/128 • 1 - Reserved The value read from this bits is always 0. Do not set this bit • 0 - SUSPE - Suspend Interrupt Enable Bit Set to enable the SUSPI interrupt. Clear to disable the SUSPI interrupt. • 7 - ADDEN - Address Enable Bit Set to activate the UADD (USB address). Cleared by hardware. Clearing by software has no effect. See Section 23.7, page 264 for more details. • 6-0 - UADD6:0 - USB Address Bits Load by software to configure the device address. • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2-0 - FNUM10:8 - Frame Number Upper Value Set by hardware. These bits are the three MSB of the 11-bits Frame Number information. They are provided in the last received SOF packet. FNUM is updated if a corrupted SOF is received. • Frame Number Lower Value Set by hardware. These bits are the eight LSB of the 11-bits Frame Number information. • 7-5 - Reserved The value read from these bits is always 0. Do not set these bits. • 4 - FNCERR -Frame Number CRC Error flag Set by hardware when a corrupted Frame Number in start of frame packet is received. This bit and the SOFI interrupt are updated at the same time. Bit 7 6 5 4 3 2 1 0 ADDEN UADD6:0 UDADDR Read/write W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - - - - FNUM10:8 UDFNUMH Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 FNUM7:0 UDFNUML Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - - FNCERR - - - - UDMFN Read/write R Initial value 0 0 0 0 0 0 0 0277 7593L–AVR–09/12 AT90USB64/128 • 3-0 - Reserved The value read from these bits is always 0. Do not set these bits. 23.18.2 USB device endpoint registers • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2-0 - EPNUM2:0 Endpoint Number bits Load by software to select the number of the endpoint which shall be accessed by the CPU. See Section 23.5, page 263 for more details. EPNUM = 111b is forbidden. • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6-0 - EPRST6:0 - Endpoint FIFO Reset bits Set to reset the selected endpoint FIFO prior to any other operation, upon hardware reset or when an USB bus reset has been received. See Section 23.3, page 262 for more information Then, clear by software to complete the reset operation and start using the endpoint. • 7-6 - Reserved The value read from these bits is always 0. Do not set these bits. • 5 - STALLRQ - STALL Request Handshake bit Set to request a STALL answer to the host for the next handshake. Cleared by hardware when a new SETUP is received. Clearing by software has no effect. See Section 23.11, page 266 for more details. • 4 - STALLRQC - STALL Request Clear Handshake bit Set to disable the STALL handshake mechanism. Cleared by hardware immediately after the set. Clearing by software has no effect. See Section 23.11, page 266 for more details. Bit 7 6 5 4 3 2 1 0 - - - - - EPNUM2:0 UENUM Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - EPRST6 EPRST5 EPRST4 EPRST3 EPRST2 EPRST1 EPRST0 UERST Read/write R R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - STALLRQ STALLRQC RSTDT - - EPEN UECONX Read/write R R W W W R R R/W Initial value 0 0 0 0 0 0 0 0278 7593L–AVR–09/12 AT90USB64/128 • RSTDT - Reset Data Toggle bit Set to automatically clear the data toggle sequence: For OUT endpoint: the next received packet will have the data toggle 0. For IN endpoint: the next packet to be sent will have the data toggle 0. Cleared by hardware instantaneously. The firmware does not have to wait that the bit is cleared. Clearing by software has no effect. • 2 - Reserved The value read from these bits is always 0. Do not set these bits. • 1 - Reserved The value read from these bits is always 0. Do not set these bits. • 0 - EPEN - Endpoint Enable bit Set to enable the endpoint according to the device configuration. Endpoint 0 shall always be enabled after a hardware or USB reset and participate in the device configuration. Clear this bit to disable the endpoint. See Section 23.6, page 263 for more details. • 7-6 - EPTYPE1:0 - Endpoint Type bits Set this bit according to the endpoint configuration: 00b: Control10b: Bulk 01b: Isochronous11b: Interrupt • 5-4 - Reserved The value read from these bits is always 0. Do not set these bits. • 3-2 - Reserved for test purpose The value read from these bits is always 0. Do not set these bits. • 1 - Reserved The value read from this bits is always 0. Do not set this bit. • 0 - EPDIR - Endpoint Direction bit Set to configure an IN direction for bulk, interrupt or isochronous endpoints. Clear to configure an OUT direction for bulk, interrupt, isochronous or control endpoints. Bit 7 6 5 4 3 2 1 0 EPTYPE1:0 - - - - - EPDIR UECFG0X Read/write R/W R/W R R R R R R/W Initial value 0 0 0 0 0 0 0 0279 7593L–AVR–09/12 AT90USB64/128 • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6-4 - EPSIZE2:0 - Endpoint Size bits Set this bit according to the endpoint size: 000b: 8 bytes 100b: 128 bytes (only for endpoint 1) 001b: 16 bytes 101b: 256 bytes (only for endpoint 1) 010b: 32 bytes 110b: Reserved. Do not use this configuration 011b: 64 bytes 111b: Reserved. Do not use this configuration • 3-2 - EPBK1:0 - Endpoint Bank bits Set this field according to the endpoint size: 00b: One bank 01b: Double bank 1xb: Reserved. Do not use this configuration • 1 - ALLOC - Endpoint Allocation bit Set this bit to allocate the endpoint memory. Clear to free the endpoint memory. See Section 23.6, page 263 for more details. • 0 - Reserved The value read from these bits is always 0. Do not set these bits. • 7 - CFGOK - Configuration Status flag Set by hardware when the endpoint X size parameter (EPSIZE) and the bank parametrization (EPBK) are correct compared to the max FIFO capacity and the max number of allowed bank. This bit is updated when the bit ALLOC is set. If this bit is cleared, the user should reprogram the UECFG1X register with correct EPSIZE and EPBK values. Bit 7 6 5 4 3 2 1 0 - EPSIZE2:0 EPBK1:0 ALLOC - UECFG1X Read/write R R/W R/W R/W R/W R/W R/W R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 CFGOK OVERFI UNDERFI - DTSEQ1:0 NBUSYBK1:0 UESTA0X Read/write R R/W R/W R/W R R R R Initial value 0 0 0 0 0 0 0 0280 7593L–AVR–09/12 AT90USB64/128 • 6 - OVERFI - Overflow Error Interrupt flag Set by hardware when an overflow error occurs in an isochronous endpoint. An interrupt (EPINTx) is triggered (if enabled). See Section 23.15, page 271 for more details. Shall be cleared by software. Setting by software has no effect. • 5 - UNDERFI - Flow Error Interrupt flag Set by hardware when an underflow error occurs in an isochronous endpoint. An interrupt (EPINTx) is triggered (if enabled). See Section 23.15, page 271 for more details. Shall be cleared by software. Setting by software has no effect. • 4 - Reserved The value read from these bits is always 0. Do not set these bits. • 3-2 - DTSEQ1:0 - Data Toggle Sequencing flag Set by hardware to indicate the PID data of the current bank: 00b Data0 01b Data1 1xb Reserved For OUT transfer, this value indicates the last data toggle received on the current bank. For IN transfer, it indicates the Toggle that will be used for the next packet to be sent. This is not relative to the current bank. • 1-0 - NBUSYBK1:0 - Busy Bank flag Set by hardware to indicate the number of busy bank. For IN endpoint, it indicates the number of busy bank(s), filled by the user, ready for IN transfer. For OUT endpoint, it indicates the number of busy bank(s) filled by OUT transaction from the host. 00b All banks are free 01b One busy bank 10b Two busy banks 11b Reserved • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. Bit 7 6 5 4 3 2 1 0 - - - - - CTRLDIR CURRBK1:0 UESTA1X Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0281 7593L–AVR–09/12 AT90USB64/128 • 2 - CTRLDIR - Control Direction (flag, and bit for debug purpose) Set by hardware after a SETUP packet, and gives the direction of the following packet: - 1 for IN endpoint - 0 for OUT endpoint Can not be set or cleared by software. • 1-0 - CURRBK1:0 - Current Bank (all endpoints except Control endpoint) flag Set by hardware to indicate the number of the current bank: 00b Bank0 01b Bank1 1xb Reserved Can not be set or cleared by software. • 7 - FIFOCON - FIFO Control bit For OUT and SETUP Endpoint: Set by hardware when a new OUT message is stored in the current bank, at the same time than RXOUT or RXSTP. Clear to free the current bank and to switch to the following bank. Setting by software has no effect. For IN Endpoint: Set by hardware when the current bank is free, at the same time than TXIN. Clear to send the FIFO data and to switch the bank. Setting by software has no effect. • 6 - NAKINI - NAK IN Received Interrupt flag Set by hardware when a NAK handshake has been sent in response of a IN request from the host. This triggers an USB interrupt if NAKINE is sent. Shall be cleared by software. Setting by software has no effect. • 5 - RWAL - Read/Write Allowed flag Set by hardware to signal: - for an IN endpoint: the current bank is not full, that is, the firmware can push data into the FIFO, - for an OUT endpoint: the current bank is not empty, that is, the firmware can read data from the FIFO. The bit is never set if STALLRQ is set, or in case of error. Cleared by hardware otherwise. This bit shall not be used for the control endpoint. Bit 7 6 5 4 3 2 1 0 FIFOCON NAKINI RWAL NAKOUTI RXSTPI RXOUTI STALLEDI TXINI UEINTX Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0282 7593L–AVR–09/12 AT90USB64/128 • 4 - NAKOUTI - NAK OUT Received Interrupt flag Set by hardware when a NAK handshake has been sent in response of a OUT/PING request from the host. This triggers an USB interrupt if NAKOUTE is sent. Shall be cleared by software. Setting by software has no effect. • 3 - RXSTPI - Received SETUP Interrupt flag Set by hardware to signal that the current bank contains a new valid SETUP packet. An interrupt (EPINTx) is triggered (if enabled). Shall be cleared by software to handshake the interrupt. Setting by software has no effect. This bit is inactive (cleared) if the endpoint is an IN endpoint. • 2 - RXOUTI / KILLBK - Received OUT Data Interrupt flag Set by hardware to signal that the current bank contains a new packet. An interrupt (EPINTx) is triggered (if enabled). Shall be cleared by software to handshake the interrupt. Setting by software has no effect. Kill Bank IN bit Set this bit to kill the last written bank. Cleared by hardware when the bank is killed. Clearing by software has no effect. See page 271 for more details on the Abort. • 1 - STALLEDI - STALLEDI Interrupt flag Set by hardware to signal that a STALL handshake has been sent, or that a CRC error has been detected in a OUT isochronous endpoint. Shall be cleared by software. Setting by software has no effect. • 0 - TXINI - Transmitter Ready Interrupt flag Set by hardware to signal that the current bank is free and can be filled. An interrupt (EPINTx) is triggered (if enabled). Shall be cleared by software to handshake the interrupt. Setting by software has no effect. This bit is inactive (cleared) if the endpoint is an OUT endpoint. • 7 - FLERRE - Flow Error Interrupt Enable flag Set to enable an endpoint interrupt (EPINTx) when OVERFI or UNDERFI are sent. Clear to disable an endpoint interrupt (EPINTx) when OVERFI or UNDERFI are sent. • 6 - NAKINE - NAK IN Interrupt Enable bit Set to enable an endpoint interrupt (EPINTx) when NAKINI is set. Clear to disable an endpoint interrupt (EPINTx) when NAKINI is set. Bit 7 6 5 4 3 2 1 0 FLERRE NAKINE - NAKOUTE RXSTPE RXOUTE STALLEDE TXINE UEIENX Read/write R/W R/W R R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0283 7593L–AVR–09/12 AT90USB64/128 • 5 - Reserved The value read from these bits is always 0. Do not set these bits. • 4 - NAKOUTE - NAK OUT Interrupt Enable bit Set to enable an endpoint interrupt (EPINTx) when NAKOUTI is set. Clear to disable an endpoint interrupt (EPINTx) when NAKOUTI is set. • 3 - RXSTPE - Received SETUP Interrupt Enable flag Set to enable an endpoint interrupt (EPINTx) when RXSTPI is sent. Clear to disable an endpoint interrupt (EPINTx) when RXSTPI is sent. • 2 - RXOUTE - Received OUT Data Interrupt Enable flag Set to enable an endpoint interrupt (EPINTx) when RXOUTI is sent. Clear to disable an endpoint interrupt (EPINTx) when RXOUTI is sent. • 1 - STALLEDE - Stalled Interrupt Enable flag Set to enable an endpoint interrupt (EPINTx) when STALLEDI is sent. Clear to disable an endpoint interrupt (EPINTx) when STALLEDI is sent. • 0 - TXINE - Transmitter Ready Interrupt Enable flag Set to enable an endpoint interrupt (EPINTx) when TXINI is sent. Clear to disable an endpoint interrupt (EPINTx) when TXINI is sent. • 7-0 - DAT7:0 -Data bits Set by the software to read/write a byte from/to the endpoint FIFO selected by EPNUM. • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2-0 - BYCT10:8 - Byte count (high) bits Set by hardware. This field is the MSB of the byte count of the FIFO endpoint. The LSB part is provided by the UEBCLX register. Bit 7 6 5 4 3 2 1 0 DAT D7 DAT D6 DAT D5 DAT D4 DAT D3 DAT D2 DAT D1 DAT D0 UEDATX Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - - - - BYCT D10 BYCT D9 BYCT D8 UEBCHX Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0284 7593L–AVR–09/12 AT90USB64/128 • 7-0 - BYCT7:0 - Byte Count (low) bits Set by the hardware. BYCT10:0 is: - (for IN endpoint) increased after each writing into the endpoint and decremented after each byte sent, - (for OUT endpoint) increased after each byte sent by the host, and decremented after each byte read by the software. • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6-0 - EPINT6:0 - Endpoint Interrupts bits Set by hardware when an interrupt is triggered by the UEINTX register and if the corresponding endpoint interrupt enable bit is set. Cleared by hardware when the interrupt source is served. Bit 7 6 5 4 3 2 1 0 BYCT D7 BYCT D6 BYCT D5 BYCT D4 BYCT D3 BYCT D2 BYCT D1 BYCT D0 UEBCLX Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - EPINT D6 EPINT D5 EPINT D4 EPINT D3 EPINT D2 EPINT D1 EPINT D0 UEINT Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0285 7593L–AVR–09/12 AT90USB64/128 24. USB host operating modes This mode is available only on Atmel AT90USB647/1287 products. 24.1 Pipe description For the USB Host controller, the term of Pipe is used instead of Endpoint for the USB Device controller. A Host Pipe corresponds to a Device Endpoint, as described in the USB specification. Figure 24-1. Pipes and endpoints in a USB system. In the USB Host controller, a Pipe will be associated to a Device Endpoint, considering the Device Configuration Descriptors. 24.2 Detach The reset value of the DETACH bit is 1. Thus, the firmware has the responsibility of clearing this bit before switching to the Host mode (HOST set). 24.3 Power-on and reset Figure 24-2 explains the USB host controller main states on power-on. Figure 24-2. USB host controller states after reset. Host Ready Host Idle Device disconnection Device connection Clock stopped Macro off Device disconnection Host Suspend SOFE=1 SOFE=0286 7593L–AVR–09/12 AT90USB64/128 USB host controller state after an hardware reset is ‘Reset’. When the USB controller is enabled and the USB Host controller is selected, the USB controller is in ‘Idle’ state. In this state, the USB Host controller waits for the Device connection, with a minimum power consumption. The USB Pad should be in Idle mode. The macro does not need to have the PLL activated to enter in ‘Host Ready’ state. The Host controller enters in Suspend state when the USB bus is in Suspend state, that is, when the Host controller doesn’t generate the Start of Frame. In this state, the USB consumption is minimum. The Host controller exits to the Suspend state when starting to generate the SOF over the USB line. 24.4 Device detection A Device is detected by the USB controller when the USB bus if different from D+ and D- low. In other words, when the USB Host Controller detects the Device pull-up on the D+ line. To enable this detection, the Host Controller has to provide the Vbus power supply to the Device. The Device Disconnection is detected by the USB Host controller when the USB Idle correspond to D+ and D- low on the USB line. 24.5 Pipe selection Prior to any operation performed by the CPU, the Pipe must first be selected. This is done by setting PNUM2:0 bits (UPNUM register) with the Pipe number which will be managed by the CPU. The CPU can then access to the various Pipe registers and data. 24.6 Pipe configuration The following flow (see Figure 24-3 on page 287) must be respected in order to activate a Pipe.287 7593L–AVR–09/12 AT90USB64/128 Figure 24-3. Pipe activation flow. Once the Pipe is activated (EPEN set) and, the hardware is ready to send requests to the Device. When configured (CFGOK = 1), only the Pipe Token (PTOKEN) and the polling interval for Interrupt pipe can be modified. A Control type pipe supports only one bank. Any other value will lead to a configuration error (CFGOK = 0). A clear of PEN will reset the configuration of the Pipe. All the corresponding Pipe registers are reset to there reset values. Please refer to “Memory management” on page 252 for more details. Note: The firmware has to configure the Default Control Pipe with the following parameters: • Type: Control • Token: SETUP • Data bank: 1 • Size: 64 Bytes The firmware asks for eight bytes of the Device Descriptor sending a GET_DESCRIPTOR request. These bytes contains the MaxPacketSize of the Device default control endpoint and the firmware re-configures the size of the Default Control Pipe with this size parameter. Pipe Activ ation UPCONX PENABLE=1 UPCFG0X PTYPE PTOKEN PEPNUM CFGOK=1 ERROR No Yes UPCFG2X INTFRQ (interrupt only) Pipe activ ated and f reezed UPCFG1X PSIZE PBK CFGMEM Enable the pipe Select the Pipe type: * Type (Control, Bulk, Interrupt) * Token (IN, OUT, SETUP) * Endpoint number Configure the Pipe memory: * Pipe size * Number of banks Configure the polling interval for Interrupt pipe288 7593L–AVR–09/12 AT90USB64/128 24.7 USB reset The USB controller sends a USB Reset when the firmware set the RESET bit. The RSTI bit is set by hardware when the USB Reset has been sent. This triggers an interrupt if the RSTE has been set. When a USB Reset has been sent, all the Pipe configuration and the memory allocation are reset. The General Host interrupt enable register is left unchanged. If the bus was previously in suspend mode (SOFEN = 0), the USB controller automatically switches to the resume mode (HWUPI is set) and the SOFEN bit is set by hardware in order to generate SOF immediately after the USB Reset. 24.8 Address setup Once the Device has answer to the first Host requests with the default address (0), the Host assigns a new address to the device. The Host controller has to send a USB reset to the device and perform a SET ADDRESS control request, with the new address to be used by the Device. This control request ended, the firmware write the new address into the UHADDR register. All following requests, on every Pipes, will be performed using this new address. When the Host controller send a USB reset, the UHADDR register is reset by hardware and the following Host requests will be performed using the default address (0). 24.9 Remote wake-up detection The Host Controller enters in Suspend mode when clearing the SOFEN bit. No more Start Of Frame is sent on the USB bus and the USB Device enters in Suspend mode 3ms later. The Device awakes the Host Controller by sending an Upstream Resume (Remote Wake-Up feature). The Host Controller detects a non-idle state on the USB bus and set the HWUPI bit. If the non-Idle correspond to an Upstream Resume (K state), the RXRSMI bit is set by hardware. The firmware has to generate a downstream resume within 1ms and for at least 20ms by setting the RESUME bit. Once the downstream Resume has been generated, the SOFEN bit is automatically set by hardware in order to generate SOF immediately after the USB resume. 24.10 USB pipe reset The firmware can reset a Pipe using the pipe reset register. The configuration of the pipe and the data toggle remains unchanged. Only the bank management and the status bits are reset to their initial values. To completely reset a Pipe, the firmware has to disable and then enable the pipe. 24.11 Pipe data access In order to read or to write into the Pipe Fifo, the CPU selects the Pipe number with the UPNUM register and performs read or write action on the UPDATX register. Host Ready Host Suspend SOFE=1 or HWUP=1 SOFE=0289 7593L–AVR–09/12 AT90USB64/128 24.12 Control pipe management A Control transaction is composed of three phases: • SETUP • Data (IN or OUT) • Status (OUT or IN) The firmware has to change the Token for each phase. The initial data toggle is set for the corresponding token (ONLY for Control Pipe): • SETUP: Data0 • OUT: Data1 • IN: Data1 (expected data toggle) 24.13 OUT pipe management The Pipe must be configured and not frozen first. Note: if the firmware decides to switch to suspend mode (clear SOFEN) even if a bank is ready to be sent, the USB controller will automatically exit from Suspend mode and the bank will be sent. The TXOUT bit is set by hardware when the current bank becomes free. This triggers an interrupt if the TXOUTE bit is set. The FIFOCON bit is set at the same time. The CPU writes into the FIFO and clears the FIFOCON bit to allow the USB controller to send the data. If the OUT Pipe is composed of multiple banks, this also switches to the next data bank. The TXOUT and FIFOCON bits are automatically updated by hardware regarding the status of the next bank.290 7593L–AVR–09/12 AT90USB64/128 Figure 24-4. Example with OUT data banks. 24.14 IN Pipe management The Pipe must be configured first. When the Host requires data from the device, the firmware has to determine first the IN mode to use using the INMODE bit: • INMODE = 0. The INRQX register is taken in account. The Host controller will perform (INRQX+1) IN requests on the selected Pipe before freezing the Pipe. This mode avoids to have extra IN requests on a Pipe • INMODE = 1. The USB controller will perform infinite IN request until the firmware freezes the Pipe The IN request generation will start when the firmware clear the PFREEZE bit. Each time the current bank is full, the RXIN and the FIFOCON bits are set. This triggers an interrupt if the RXINE bit is set. The firmware can acknowledge the USB interrupt by clearing the RXIN bit. The Firmware read the data and clear the FIFOCON bit in order to free the current OUT DATA (bank 0) ACK TXOUT FIFOCON HW Example with 1 OUT data bank write data from CPU BANK 0 Example with 2 OUT data banks SW SW SW SW OUT OUT DATA (bank 0) ACK TXOUT FIFOCON write data from CPU BANK 0 SW SW SW SW OUT DATA (bank 1) ACK write data from CPU BANK 0 write data from CPU BANK 1 SW HW write data from CPU BANK0 Example with 2 OUT data banks OUT DATA (bank 0) ACK TXOUT FIFOCON write data from CPU BANK 0 SW SW SW write data from CPU SW BANK 1 SW HW write data from CPU BANK0 OUT DATA (bank 1) ACK291 7593L–AVR–09/12 AT90USB64/128 bank. If the IN Pipe is composed of multiple banks, clearing the FIFOCON bit will switch to the next bank. The RXIN and FIFOCON bits are then updated by hardware in accordance with the status of the new bank. Figure 24-5. Example with IN data banks. 24.14.1 CRC error (isochronous only) A CRC error can occur during IN stage if the USB controller detects a bad received packet. In this situation, the STALLEDI/CRCERRI interrupt is triggered. This does not prevent the RXINI interrupt from being triggered. 24.15 Interrupt system Figure 24-6. USB host controller interrupt system. IN DATA (to bank 0) ACK RXIN FIFOCON HW IN DATA (to bank 0) ACK HW SW SW SW Example with 1 IN data bank read data from CPU BANK 0 IN DATA (to bank 0) ACK RXIN FIFOCON HW IN DATA (to bank 1) ACK SW SW Example with 2 IN data banks read data from CPU BANK 0 HW SW read data from CPU BANK 0 read data from CPU BANK 1 HWUPE UHIEN.6 HWUPI UHINT.6 HSOFI UHINT.5 HSOFE UHIEN.5 RXRSMI UHINT.4 RXRSME UHIEN.4 RSMEDI UHINT.3 RSMEDE UHIEN.3 RSTI UHINT.2 RSTE UHIEN.2 DDISCI UHINT.1 DDISCE UHIEN.1 DCONNI UHINT.0 DCONNE UHIEN.0 USB host interrupt292 7593L–AVR–09/12 AT90USB64/128 Figure 24-7. USB device controller pipe interrupt system. 24.16 Registers 24.16.1 General USB host registers • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2 - RESUME - Send USB Resume Set this bit to generate a USB Resume on the USB bus. Cleared by hardware when the USB Resume has been sent. Clearing by software has no effect. This bit should be set only when the start of frame generation is enable (SOFEN bit set). • 1 - RESET - Send USB Reset Set this bit to generate a USB Reset on the USB bus. Cleared by hardware when the USB Reset has been sent. Clearing by software has no effect. Refer to the USB reset section for more details. • 0 - SOFEN - Start Of Frame Generation Enable Set this bit to generate SOF on the USB bus in full speed mode and keep-alive in low speed mode. Clear this bit to disable the SOF generation and to leave the USB bus in Idle state. FLERRE UPIEN.7 UNDERFI UPSTAX.5 OVERFI UPSTAX.6 NAKEDI UPINTX.6 NAKEDE UPIEN.6 PERRI UPINTX.4 PERRE UPIEN.4 TXSTPI UPINTX.3 TXSTPE UPIEN.3 TXOUTI UPINTX.2 TXOUTE UPIEN.2 RXSTALLI UPINTX.1 RXSTALLE UPIEN.1 RXINI UPINTX.0 RXINE UPIEN.0 FLERRE UPIEN.7 PIPE 0 PIPE 1 PIPE 2 PIPE 3 PIPE 4 PIPE 5 Pipe interrupt PIPE 6 Bit 7 6 5 4 3 2 1 0 ----- RESUME RESET SOFEN UHCON Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0293 7593L–AVR–09/12 AT90USB64/128 • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6 - HWUPI - Host Wake-Up Interrupt Set by hardware when a non-idle state is detected on the USB bus.This interrupt should be enable only to wake up the CPU core from power down mode. Shall be clear by software to acknowledge the interrupt. Setting by software has no effect. • 5 - HSOFI - Host Start Of Frame Interrupt Set by hardware when a SOF is issued by the Host controller. This triggers a USB interrupt when HSOFE is set. When using the host controller in low speed mode, this bit is also set when a keep-alive is sent. Shall be cleared by software to acknowledge the interrupt. Setting by software has no effect. • 4 - RXRSMI - Upstream Resume Received Interrupt Set by hardware when an Upstream Resume has been received from the Device. Shall be cleared by software. Setting by software has no effect. • 3 - RSMEDI - Downstream Resume Sent Interrupt Set by hardware when a Downstream Resume has been sent to the Device. Shall be cleared by software. Setting by software has no effect. • 2 - RSTI - USB Reset Sent Interrupt Set by hardware when a USB Reset has been sent to the Device. Shall be cleared by software. Setting by software has no effect. • 1 - DDISCI - Device Disconnection Interrupt Set by hardware when the device has been removed from the USB bus. Shall be cleared by software. Setting by software has no effect. • 0 - DCONNI - Device Connection Interrupt Set by hardware when a new device has been connected to the USB bus. Shall be cleared by software. Setting by software has no effect. • 7 - Reserved The value read from these bits is always 0. Do not set these bits. Bit 7 6 5 4 3 2 1 0 - HWUPI HSOFI RXRSMI RSMEDI RSTI DDISCI DCONNI UHINT Read/write R R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 HWUPE HSOFE RXRSME RSMEDE RSTE DDISCE DCONNE UHIEN Read/write R R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0294 7593L–AVR–09/12 AT90USB64/128 • 6 - HWUPE - Host Wake-Up Interrupt Enable Set this bit to enable HWUP interrupt.For correct interrupt handle execution, this interrupt should be enable only before entering power-down mode. Clear this bit to disable HWUP interrupt. • 5 - HSOFE - Host Start Of frame Interrupt Enable Set this bit to enable HSOF interrupt. Clear this bit to disable HSOF interrupt. • 4 - RXRSME -Upstream Resume Received Interrupt Enable Set this bit to enable the RXRSMI interrupt. Clear this bit to disable the RXRSMI interrupt. • 3 - RSMEDE - Downstream Resume Sent Interrupt Enable Set this bit to enable the RSMEDI interrupt. Clear this bit to disable the RSMEDI interrupt. • 2 - RSTE - USB Reset Sent Interrupt Enable Set this bit to enable the RSTI interrupt. Clear this bit to disable the RSTI interrupt. • 1 - DDISCE - Device Disconnection Interrupt Enable Set this bit to enable the DDISCI interrupt. Clear this bit to disable the DDISCI interrupt. • 0 - DCONNE - Device Connection Interrupt Enable Set this bit to enable the DCONNI interrupt. Clear this bit to disable the DCONNI interrupt. • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6-0 - HADDR6:0 - USB Host Address These bits contain the address of the USB Device. Bit 7 6 5 4 3 2 1 0 HADDR6 HADDR5 HADDR4 HADDR3 HADDR2 HADDR1 HADDR0 HADDR6 UHADDR Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0295 7593L–AVR–09/12 AT90USB64/128 • 7-4 - Reserved The value read from these bits is always 0. Do not set these bits. • 3-0 - FNUM10:8 - Frame Number The value contained in this register is the current SOF number. This value can be modified by software. • 7-0 - FNUM7:0 - Frame Number The value contained in this register is the current SOF number. This value can be modified by software. • 7-0 - FLEN7:0 - Frame Length The value contained the data frame length transmited. 24.16.2 USB Host Pipe registers • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2-0 - PNUM2:0 - Pipe Number Select the pipe using this register. The USB Host registers ended by a X correspond then to this number. This number is used for the USB controller following the value of the PNUMD bit. Bit 7 6 5 4 3 2 1 0 - - - - - FNUM10 FNUM9 FNUM8 UHFNUMH Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 FNUM7 FNUM6 FNUM5 FNUM4 FNUM3 FNUM2 FNUM1 FNUM0 UHFNUML Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 FLEN7 FLEN6 FLEN5 FLEN4 FLEN3 FLEN2 FLEN1 FLEN0 UHFLEN Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 PNUM2 PNUM1 PNUM0 UPNUM Read/write RW RW RW Initial value 0 0 0 0 0 0 0 0296 7593L–AVR–09/12 AT90USB64/128 • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6 - P6RST - Pipe 6 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 6. • 5 - P5RST - Pipe 5 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 5. • 4 - P4RST - Pipe 4 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 4. • 3 - P3RST - Pipe 3 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 3. • 2 - P2RST - Pipe 2 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 2. • 1 - P1RST - Pipe 1 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 1. • 0 - P0RST - Pipe 0 Reset Set this bit to 1 and reset this bit to 0 to reset the Pipe 0. • 7 - Reserved The value read from this bit is always 0. Do not set this bit. • 6 - PFREEZE - Pipe Freeze Set this bit to Freeze the Pipe requests generation. Clear this bit to enable the Pipe request generation. This bit is set by hardware when: - the pipe is not configured - a STALL handshake has been received on this Pipe - An error occurs on the Pipe (UPINTX.PERRI = 1) - (INRQ+1) In requests have been processed This bit is set at 1 by hardware after a Pipe reset or a Pipe enable. Bit 7 6 5 4 3 2 1 0 - P6RST P5RST P4RST P3RST P2RST P1RST P0RST UPRST Read/write RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - PFREEZE INMODE - RSTDT - - PEN UPCONX Read/write RW RW RW RW Initial value 0 0 0 0 0 0 0 0297 7593L–AVR–09/12 AT90USB64/128 • 5 - INMODE - IN Request mode Set this bit to allow the USB controller to perform infinite IN requests when the Pipe is not frozen. Clear this bit to perform a pre-defined number of IN requests. This number is stored in the UINRQX register. • 4 - Reserved The value read from this bit is always 0. Do not set this bit. • 3 - RSTDT - Reset Data Toggle Set this bit to reset the Data Toggle to its initial value for the current Pipe. Cleared by hardware when proceed. Clearing by software has no effect. • 2 - Reserved The value read from these bits is always 0. Do not set these bits. • 1 - Reserved The value read from these bits is always 0. Do not set these bits. • 0 - PEN - Pipe Enable Set to enable the Pipe. Clear to disable and set the pipe. • 7-6 - PTYPE1:0 - Pipe Type Select the type of the Pipe: - 00: Control - 01: Isochronous - 10: Bulk - 11: Interrupt • 5-4 - PTOKEN1:0 - Pipe Token Select the Token to associate to the Pipe - 00: SETUP - 01: IN - 10: OUT - 11: reserved • 3-0 - PEPNUM3:0 - Pipe Endpoint Number Set this field according to the Pipe configuration. Set the number of the Endpoint targeted by the Pipe. This value is from 0 and 15. Bit 7 6 5 4 3 2 1 0 PTYPE1 PTYPE0 PTOKEN1 PTOKEN0 PEPNUM3 PEPNUM2 PEPNUM1 PEPNUM0 UPCFG0X Read/write RW RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0298 7593L–AVR–09/12 AT90USB64/128 • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6-4 - PSIZE2:0 - Pipe Size Select the size of the Pipe: - 000: 8 - 100: 128 (only for endpoint 1) - 001: 16 - 101: 256 (only for endpoint 1) - 010: 32 - 110: Reserved. Do not use this configuration. - 011: 64 - 111: Reserved. Do not use this configuration. • 3-2 - PBK1:0 - Pipe Bank Select the number of bank to declare for the current Pipe. - 00: 1 bank - 01: 2 banks - 10: invalid - 11: invalid • ALLOC - Configure Pipe Memory Set to configure the pipe memory with the characteristics. Clear to update the memory allocation. Refer to the Memory Management chapter for more details. 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 7 - INTFRQ7:0 - Interrupt Pipe Request Frequency These bits are the maximum value in millisecond of the polling period for an Interrupt Pipe. This value has no effect for a non-Interrupt Pipe. Bit 7 6 5 4 3 2 1 0 - PSIZE2:0 PBK1:0 ALLOC - UPCFG1X Read/write R RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 INTFRQ7 INTFRQ6 INTFRQ5 INTFRQ4 INTFRQ3 INTFRQ2 INTFRQ1 INTFRQ0 UPCFG2X Read/write RW RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0299 7593L–AVR–09/12 AT90USB64/128 • 7 - CFGOK - Configure Pipe Memory OK Set by hardware if the required memory configuration has been successfully performed. Cleared by hardware when the pipe is disabled. The USB reset and the reset pipe have no effect on the configuration of the pipe. • 6 - OVERFI - Overflow Set by hardware when a the current Pipe has received more data than the maximum length of the current Pipe. An interrupt is triggered if the FLERRE bit is set. Shall be cleared by software. Setting by software has no effect. • 5 - UNDERFI - Underflow Set by hardware when a transaction underflow occurs in the current isochronous or interrupt Pipe. The Pipe can’t send the data flow required by the device. A ZLP will be sent instead. An interrupt is triggered if the FLERRE bit is set. Shall be cleared by software. Setting by software has no effect. Note: the Host controller has to send a OUT packet, but the bank is empty. A ZLP will be sent and the UNDERFI bit is set. • 4 - Reserved The value read from these bits is always 0. Do not set these bits. • 3-2 - DTSEQ1:0 - Toggle Sequencing flag Set by hardware to indicate the PID data of the current bank: 00b Data0 01b Data1 1xb Reserved. For OUT Pipe, this value indicates the next data toggle that will be sent. This is not relative to the current bank. For IN Pipe, this value indicates the last data toggle received on the current bank. • 1-0 - NBUSYBK1:0 - Busy Bank flag Set by hardware to indicate the number of busy bank. For OUT Pipe, it indicates the number of busy bank(s), filled by the user, ready for OUT transfer. For IN Pipe, it indicates the number of busy bank(s) filled by IN transaction from the Device. 00b All banks are free 01b 1 busy bank 10b 2 busy banks 11b Reserved. Bit 7 6 5 4 3 2 1 0 CFGOK OVERFI UNDERFI - DTSEQ1:0 NBUSYBK UPSTAX Read/write R RW RW R R R R Initial value 0 0 0 0 0 0 0 0300 7593L–AVR–09/12 AT90USB64/128 • 7-0 - INRQ7:0 - IN Request Number Before Freeze Enter the number of IN transactions before the USB controller freezes the pipe. The USB controller will perform (INRQ+1) IN requests before to freeze the Pipe. This counter is automatically decreased by 1 each time a IN request has been successfully performed. This register has no effect when the INMODE bit is set (infinite IN requests generation till the pipe is not frozen). • 7-6 - Reserved The value read from these bits is always 0. Do not set these bits. • 5 - COUNTER1:0 - Error counter This counter is increased by the USB controller each time an error occurs on the Pipe. When this value reaches 3, the Pipe is automatically frozen. Clear these bits by software. • 4 - CRC16 - CRC16 Error Set by hardware when a CRC16 error has been detected. Shall be cleared by software. Setting by software has no effect. • 3 - TIMEOUT - Time-out Error Set by hardware when a time-out error has been detected. Shall be cleared by software. Setting by software has no effect. • 2 - PID - PID Error Set by hardware when a PID error has been detected. Shall be cleared by software. Setting by software has no effect. • 1 - DATAPID - Data PID Error Set by hardware when a data PID error has been detected. Shall be cleared by software. Setting by software has no effect. • 0 - DATATGL - Bad Data Toggle Set by hardware when a data toggle error has been detected. Shall be cleared by software. Setting by software has no effect. Bit 7 6 5 4 3 2 1 0 INRQ7 INRQ6 INRQ5 INRQ4 INRQ3 INRQ2 INRQ1 INRQ0 UPINRQX Read/write RW RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - COUNTER1:0 CRC16 TIMEOUT PID DATAPID DATATGL UPERRX Read/write RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0301 7593L–AVR–09/12 AT90USB64/128 • 7 - FIFOCON - FIFO Control For OUT and SETUP Pipe: Set by hardware when the current bank is free, at the same time than TXOUT or TXSTP. Clear to send the FIFO data and to switch the bank. Setting by software has no effect. For IN Pipe: Set by hardware when a new IN message is stored in the current bank, at the same time than RXIN. Clear to free the current bank and to switch to the following bank. Setting by software has no effect. • 6 - NAKEDI - NAK Handshake received Set by hardware when a NAK has been received on the current bank of the Pipe. This triggers an interrupt if the NAKEDE bit is set in the UPIENX register. Shall be clear to handshake the interrupt. Setting by software has no effect. • 5 - RWAL - Read/Write Allowed OUT Pipe: Set by hardware when the firmware can write a new data into the Pipe FIFO. Cleared by hardware when the current Pipe FIFO is full. IN Pipe: Set by hardware when the firmware can read a new data into the Pipe FIFO. Cleared by hardware when the current Pipe FIFO is empty. This bit is also cleared by hardware when the RXSTALL or the PERR bit is set • 4 - PERRI -PIPE Error Set by hardware when an error occurs on the current bank of the Pipe. This triggers an interrupt if the PERRE bit is set in the UPIENX register. Refers to the UPERRX register to determine the source of the error. Automatically cleared by hardware when the error source bit is cleared. • 3 - TXSTPI - SETUP Bank ready Set by hardware when the current SETUP bank is free and can be filled. This triggers an interrupt if the TXSTPE bit is set in the UPIENX register. Shall be cleared to handshake the interrupt. Setting by software has no effect. • 2 - TXOUTI -OUT Bank ready Set by hardware when the current OUT bank is free and can be filled. This triggers an interrupt if the TXOUTE bit is set in the UPIENX register. Shall be cleared to handshake the interrupt. Setting by software has no effect. Bit 7 6 5 4 3 2 1 0 FIFOCON NAKEDI RWAL PERRI TXSTPI TXOUTI RXSTALLI RXINI UPINTX Read/write RW RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0302 7593L–AVR–09/12 AT90USB64/128 • 1 - RXSTALLI / CRCERR - STALL Received / Isochronous CRC Error Set by hardware when a STALL handshake has been received on the current bank of the Pipe. The Pipe is automatically frozen. This triggers an interrupt if the RXSTALLE bit is set in the UPIENX register. Shall be cleared to handshake the interrupt. Setting by software has no effect. For Isochronous Pipe: Set by hardware when a CRC error occurs on the current bank of the Pipe. This triggers an interrupt if the TXSTPE bit is set in the UPIENX register. Shall be cleared to handshake the interrupt. Setting by software has no effect. • 0 - RXINI - IN Data received Set by hardware when a new USB message is stored in the current bank of the Pipe. This triggers an interrupt if the RXINE bit is set in the UPIENX register. Shall be cleared to handshake the interrupt. Setting by software has no effect. • 7 - FLERRE - Flow Error Interrupt enable Set to enable the OVERFI and UNDERFI interrupts. Clear to disable the OVERFI and UNDERFI interrupts. • 6 - NAKEDE -NAK Handshake Received Interrupt Enable Set to enable the NAKEDI interrupt. Clear to disable the NAKEDI interrupt. • 5 - Reserved The value read from these bits is always 0. Do not set these bits. • 4 - PERRE -PIPE Error Interrupt Enable Set to enable the PERRI interrupt. Clear to disable the PERRI interrupt. • 3 - TXSTPE - SETUP Bank ready Interrupt Enable Set to enable the TXSTPI interrupt. Clear to disable the TXSTPI interrupt. • 2 - TXOUTE - OUT Bank ready Interrupt Enable Set to enable the TXOUTI interrupt. Clear to disable the TXOUTI interrupt. • 1 - RXSTALLE - STALL Received Interrupt Enable Set to enable the RXSTALLI interrupt. Clear to disable the RXSTALLI interrupt. Bit 7 6 5 4 3 2 1 0 FLERRE NAKEDE - PERRE TXSTPE TXOUTE RXSTALLE RXINE UPIENX Read/write RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0303 7593L–AVR–09/12 AT90USB64/128 • 0 - RXINE - IN Data received Interrupt Enable Set to enable the RXINI interrupt. Clear to disable the RXINI interrupt. • 7-0 - PDAT7:0 - Pipe Data bits Set by the software to read/write a byte from/to the Pipe FIFO selected by PNUM. • 7-3 - Reserved The value read from these bits is always 0. Do not set these bits. • 2-0 - PBYCT10:8 - Byte count (high) bits Set by hardware. This field is the MSB of the byte count of the FIFO endpoint. The LSB part is provided by the UPBCLX register. • 7-0 - PBYCT7:0 - Byte Count (low) bits Set by the hardware. PBYCT10:0 is: - (for OUT Pipe) increased after each writing into the Pipe and decremented after each byte sent, - (for IN Pipe) increased after each byte received by the host, and decremented after each byte read by the software. • 7 - Reserved The value read from these bits is always 0. Do not set these bits. • 6-0 - PINT6:0 - Pipe Interrupts bits Set by hardware when an interrupt is triggered by the UPINTX register and if the corresponding endpoint interrupt enable bit is set. Cleared by hardware when the interrupt source is served. Bit 7 6 5 4 3 2 1 0 PDAT7 PDAT6 PDAT5 PDAT4 PDAT3 PDAT2 PDAT1 PDAT0 UPDATX Read/write RW RW RW RW RW RW RW RW Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - - - - - PBYCT10 PBYCT9 PBYCT8 UPBCHX Read/write R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 PBYCT7 PBYCT6 PBYCT5 PBYCT4 PBYCT3 PBYCT2 PBYCT1 PBYCT0 UPBCLX Read/write R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 - PINT6 PINT5 PINT4 PINT3 PINT2 PINT1 PINT0 UPINT Read/write Initial value 0 0 0 0 0 0 0 0304 7593L–AVR–09/12 AT90USB64/128 25. Analog Comparator The Analog Comparator compares the input values on the positive pin AIN0 and negative pin AIN1. When the voltage on the positive pin AIN0 is higher than the voltage on the negative pin AIN1, the Analog Comparator output, ACO, is set. The comparator’s output can be set to trigger the Timer/Counter1 Input Capture function. In addition, the comparator can trigger a separate interrupt, exclusive to the Analog Comparator. The user can select Interrupt triggering on comparator output rise, fall or toggle. A block diagram of the comparator and its surrounding logic is shown in Figure 25-1. The Power Reduction ADC bit, PRADC, in “PRR0 – Power Reduction Register 0” on page 54 must be disabled by writing a logical zero to be able to use the ADC input MUX. Figure 25-1. Analog Comparator block diagram (2). Notes: 1. See Table 25-2 on page 306. 2. Refer to Figure 1-1 on page 3 and Table 11-6 on page 79 for Analog Comparator pin placement. 25.0.1 ADCSRB – ADC Control and Status Register B • Bit 6 – ACME: Analog Comparator Multiplexer Enable When this bit is written logic one and the ADC is switched off (ADEN in ADCSRA is zero), the ADC multiplexer selects the negative input to the Analog Comparator. When this bit is written logic zero, AIN1 is applied to the negative input of the Analog Comparator. For a detailed description of this bit, see “Analog Comparator multiplexed input” on page 306. 25.0.2 ACSR – Analog Comparator Control and Status Register ACBG BANDGAP REFERENCE ADC MULTIPLEXER OUTPUT ACME ADEN (1) Bit 7 6 5 4 3 2 1 0 – ACME – – - ADTS2 ADTS1 ADTS0 ADCSRB Read/write R R/W R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 ACSR Read/write R/W R/W R R/W R/W R/W R/W R/W Initial value 0 0 N/A 0 0 0 0 0305 7593L–AVR–09/12 AT90USB64/128 • Bit 7 – ACD: Analog Comparator Disable When this bit is written logic one, the power to the Analog Comparator is switched off. This bit can be set at any time to turn off the Analog Comparator. This will reduce power consumption in Active and Idle mode. When changing the ACD bit, the Analog Comparator Interrupt must be disabled by clearing the ACIE bit in ACSR. Otherwise an interrupt can occur when the bit is changed. • Bit 6 – ACBG: Analog Comparator Bandgap Select When this bit is set, a fixed bandgap reference voltage replaces the positive input to the Analog Comparator. When this bit is cleared, AIN0 is applied to the positive input of the Analog Comparator. See “Internal voltage reference” on page 62. • Bit 5 – ACO: Analog Comparator Output The output of the Analog Comparator is synchronized and then directly connected to ACO. The synchronization introduces a delay of 1 - 2 clock cycles. • Bit 4 – ACI: Analog Comparator Interrupt Flag This bit is set by hardware when a comparator output event triggers the interrupt mode defined by ACIS1 and ACIS0. The Analog Comparator interrupt routine is executed if the ACIE bit is set and the I-bit in SREG is set. ACI is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, ACI is cleared by writing a logic one to the flag. • Bit 3 – ACIE: Analog Comparator Interrupt Enable When the ACIE bit is written logic one and the I-bit in the Status Register is set, the Analog Comparator interrupt is activated. When written logic zero, the interrupt is disabled. • Bit 2 – ACIC: Analog Comparator Input Capture Enable When written logic one, this bit enables the input capture function in Timer/Counter1 to be triggered by the Analog Comparator. The comparator output is in this case directly connected to the input capture front-end logic, making the comparator utilize the noise canceler and edge select features of the Timer/Counter1 Input Capture interrupt. When written logic zero, no connection between the Analog Comparator and the input capture function exists. To make the comparator trigger the Timer/Counter1 Input Capture interrupt, the ICIE1 bit in the Timer Interrupt Mask Register (TIMSK1) must be set. • Bits 1, 0 – ACIS1, ACIS0: Analog Comparator Interrupt Mode Select These bits determine which comparator events that trigger the Analog Comparator interrupt. The different settings are shown in Table 25-1. When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be disabled by clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt can occur when the bits are changed. Table 25-1. ACIS1/ACIS0 settings. ACIS1 ACIS0 Interrupt mode 0 0 Comparator Interrupt on Output Toggle 0 1 Reserved 1 0 Comparator Interrupt on Falling Output Edge 1 1 Comparator Interrupt on Rising Output Edge306 7593L–AVR–09/12 AT90USB64/128 25.1 Analog Comparator multiplexed input It is possible to select any of the ADC7..0 pins to replace the negative input to the Analog Comparator. The ADC multiplexer is used to select this input, and consequently, the ADC must be switched off to utilize this feature. If the Analog Comparator Multiplexer Enable bit (ACME in ADCSRB) is set and the ADC is switched off (ADEN in ADCSRA is zero), and MUX2..0 in ADMUX select the input pin to replace the negative input to the Analog Comparator, as shown in Table 25-2. If ACME is cleared or ADEN is set, AIN1 is applied to the negative input to the Analog Comparator. 25.1.1 DIDR1 – Digital Input Disable Register 1 • Bit 1, 0 – AIN1D, AIN0D: AIN1, AIN0 Digital Input Disable When this bit is written logic one, the digital input buffer on the AIN1/0 pin is disabled. The corresponding PIN Register bit will always read as zero when this bit is set. When an analog signal is applied to the AIN1/0 pin and the digital input from this pin is not needed, this bit should be written logic one to reduce power consumption in the digital input buffer. Table 25-2. Analog Comparator multiplexed input. ACME ADEN MUX2..0 Analog Comparator negative input 0 x xxx AIN1 1 1 xxx AIN1 1 0 000 ADC0 1 0 001 ADC1 1 0 010 ADC2 1 0 011 ADC3 1 0 100 ADC4 1 0 101 ADC5 1 0 110 ADC6 1 0 111 ADC7 Bit 7 6 5 4 3 2 1 0 – – – – – – AIN1D AIN0D DIDR1 Read/write R R R R R R R/W R/W Initial value 0 0 0 0 0 0 0 0307 7593L–AVR–09/12 AT90USB64/128 26. ADC – Analog to Digital Converter 26.1 Features • 10-bit resolution • 0.5 LSB integral non-linearity • ±2 LSB absolute accuracy • 65 - 260µs conversion time • Up to 15ksps at maximum resolution • Eight multiplexed single ended input channels • Seven differential input channels • Optional left adjustment for ADC result readout • 0 - VCC ADC input voltage range • Selectable 2.56V ADC reference voltage • Free running or single conversion mode • ADC start conversion by auto triggering on interrupt sources • Interrupt on ADC conversion complete • Sleep mode noise canceler 26.2 Overview The Atmel AT90USB64/128 features a 10-bit successive approximation ADC. The ADC is connected to an 8-channel Analog Multiplexer which allows eight single-ended voltage inputs constructed from the pins of Port F. The single-ended voltage inputs refer to 0V (GND). The device also supports 16 differential voltage input combinations. Two of the differential inputs (ADC1, ADC0 and ADC3, ADC2) are equipped with a programmable gain stage, providing amplification steps of 0 dB (1×), 20 dB (10×), or 46 dB (200×) on the differential input voltage before the A/D conversion. Seven differential analog input channels share a common negative terminal (ADC1), while any other ADC input can be selected as the positive input terminal. If 1× or 10× gain is used, 8-bit resolution can be expected. If 200× gain is used, 7-bit resolution can be expected. The ADC contains a Sample and Hold circuit which ensures that the input voltage to the ADC is held at a constant level during conversion. A block diagram of the ADC is shown in Figure 26-1 on page 308. The ADC has a separate analog supply voltage pin, AVCC. AVCC must not differ more than ±0.3V from VCC. See the paragraph “ADC noise canceler” on page 314 on how to connect this pin. Internal reference voltages of nominally 2.56V or AVCC are provided on-chip. The voltage reference may be externally decoupled at the AREF pin by a capacitor for better noise performance.308 7593L–AVR–09/12 AT90USB64/128 Figure 26-1. Analog to digital converter block schematic. ADC CONVERSION COMPLETE IRQ 8-BIT DATA BUS 15 0 ADC MULTIPLEXER SELECT (ADMUX) ADC CTRL. & STATUS REGISTER (ADCSRA) ADC DATA REGISTER (ADCH/ADCL) MUX2 ADIE ADATE ADEN ADSC ADIF ADIF MUX1 MUX0 ADPS2 ADPS1 ADPS0 MUX3 CONVERSION LOGIC 10-BIT DAC + - SAMPLE & HOLD COMPARATOR INTERNAL REFERENCE MUX DECODER MUX4 AVCC ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 REFS1 REFS0 ADLAR + - CHANNEL SELECTION GAIN SELECTION ADC[9:0] ADC MULTIPLEXER OUTPUT DIFFERENTIAL AMPLIFIER AREF BANDGAP REFERENCE PRESCALER SINGLE ENDED / DIFFERENTIAL SELECTION GND POS. INPUT MUX NEG. INPUT MUX TRIGGER SELECT ADTS[2:0] INTERRUPT FLAGS ADHSM START309 7593L–AVR–09/12 AT90USB64/128 26.3 Operation The ADC converts an analog input voltage to a 10-bit digital value through successive approximation. The minimum value represents GND and the maximum value represents the voltage on the AREF pin minus 1 LSB. Optionally, AVCC or an internal 2.56V reference voltage may be connected to the AREF pin by writing to the REFSn bits in the ADMUX Register. The internal voltage reference may thus be decoupled by an external capacitor at the AREF pin to improve noise immunity. The analog input channel and differential gain are selected by writing to the MUX bits in ADMUX. Any of the ADC input pins, as well as GND and a fixed bandgap voltage reference, can be selected as single ended inputs to the ADC. A selection of ADC input pins can be selected as positive and negative inputs to the differential amplifier. The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSRA. Voltage reference and input channel selections will not go into effect until ADEN is set. The ADC does not consume power when ADEN is cleared, so it is recommended to switch off the ADC before entering power saving sleep modes. The ADC generates a 10-bit result which is presented in the ADC Data Registers, ADCH and ADCL. By default, the result is presented right adjusted, but can optionally be presented left adjusted by setting the ADLAR bit in ADMUX. If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read ADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content of the Data Registers belongs to the same conversion. Once ADCL is read, ADC access to Data Registers is blocked. This means that if ADCL has been read, and a conversion completes before ADCH is read, neither register is updated and the result from the conversion is lost. When ADCH is read, ADC access to the ADCH and ADCL Registers is re-enabled. The ADC has its own interrupt which can be triggered when a conversion completes. The ADC access to the Data Registers is prohibited between reading of ADCH and ADCL, the interrupt will trigger even if the result is lost. 26.4 Starting a conversion A single conversion is started by writing a logical one to the ADC Start Conversion bit, ADSC. This bit stays high as long as the conversion is in progress and will be cleared by hardware when the conversion is completed. If a different data channel is selected while a conversion is in progress, the ADC will finish the current conversion before performing the channel change. Alternatively, a conversion can be triggered automatically by various sources. Auto Triggering is enabled by setting the ADC Auto Trigger Enable bit, ADATE in ADCSRA. The trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB (See description of the ADTS bits for a list of the trigger sources). When a positive edge occurs on the selected trigger signal, the ADC prescaler is reset and a conversion is started. This provides a method of starting conversions at fixed intervals. If the trigger signal is still set when the conversion completes, a new conversion will not be started. If another positive edge occurs on the trigger signal during conversion, the edge will be ignored. Note that an interrupt flag will be set even if the specific interrupt is disabled or the Global Interrupt Enable bit in SREG is cleared. A conversion can thus be triggered without causing an interrupt. However, the interrupt flag must be cleared in order to trigger a new conversion at the next interrupt event. 310 7593L–AVR–09/12 AT90USB64/128 Figure 26-2. ADC auto trigger logic. Using the ADC Interrupt Flag as a trigger source makes the ADC start a new conversion as soon as the ongoing conversion has finished. The ADC then operates in Free Running mode, constantly sampling and updating the ADC Data Register. The first conversion must be started by writing a logical one to the ADSC bit in ADCSRA. In this mode the ADC will perform successive conversions independently of whether the ADC Interrupt Flag, ADIF is cleared or not. If Auto Triggering is enabled, single conversions can be started by writing ADSC in ADCSRA to one. ADSC can also be used to determine if a conversion is in progress. The ADSC bit will be read as one during a conversion, independently of how the conversion was started. 26.5 Prescaling and conversion timing Figure 26-3. ADC prescaler. By default, the successive approximation circuitry requires an input clock frequency between 50kHz and 200kHz to get maximum resolution. If a lower resolution than 10 bits is needed, the input clock frequency to the ADC can be higher than 200kHz to get a higher sample rate. Alternatively, setting the ADHSM bit in ADCSRB allows an increased ADC clock frequency at the expense of higher power consumption. The ADC module contains a prescaler, which generates an acceptable ADC clock frequency from any CPU frequency above 100kHz. The prescaling is set by the ADPS bits in ADCSRA. The prescaler starts counting from the moment the ADC is switched on by setting the ADEN bit ADSC ADIF SOURCE 1 SOURCE n ADTS[2:0] CONVERSION LOGIC PRESCALER START CLKADC . . . . EDGE DETECTOR ADATE 7-BIT ADC PRESCALER ADC CLOCK SOURCE CK ADPS0 ADPS1 ADPS2 CK/128 CK/2 CK/4 CK/8 CK/16 CK/32 CK/64 Reset ADEN START311 7593L–AVR–09/12 AT90USB64/128 in ADCSRA. The prescaler keeps running for as long as the ADEN bit is set, and is continuously reset when ADEN is low. When initiating a single ended conversion by setting the ADSC bit in ADCSRA, the conversion starts at the following rising edge of the ADC clock cycle. See “Differential channels” on page 312 for details on differential conversion timing. A normal conversion takes 13 ADC clock cycles. The first conversion after the ADC is switched on (ADEN in ADCSRA is set) takes 25 ADC clock cycles in order to initialize the analog circuitry. The actual sample-and-hold takes place 1.5 ADC clock cycles after the start of a normal conversion and 13.5 ADC clock cycles after the start of an first conversion. When a conversion is complete, the result is written to the ADC Data Registers, and ADIF is set. In Single Conversion mode, ADSC is cleared simultaneously. The software may then set ADSC again, and a new conversion will be initiated on the first rising ADC clock edge. When Auto Triggering is used, the prescaler is reset when the trigger event occurs. This assures a fixed delay from the trigger event to the start of conversion. In this mode, the sample-and-hold takes place two ADC clock cycles after the rising edge on the trigger source signal. Three additional CPU clock cycles are used for synchronization logic. In Free Running mode, a new conversion will be started immediately after the conversion completes, while ADSC remains high. For a summary of conversion times, see Table 26-1 on page 312. Figure 26-4. ADC timing diagram, first conversion (single conversion mode). Figure 26-5. ADC timing diagram, single conversion. Sign and MSB of result LSB of result ADC clock ADSC Sample & hold ADIF ADCH ADCL Cycle number ADEN 1 2 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 First conversion Next conversion 3 MUX and REFS update MUX and REFS update Conversion complete 1 2 3 4 5 6 7 8 9 10 11 12 13 Sign and MSB of result LSB of result ADC clock ADSC ADIF ADCH ADCL Cycle number 1 2 One conversion Next conversion 3 Sample & hold MUX and REFS update Conversion complete MUX and REFS update312 7593L–AVR–09/12 AT90USB64/128 Figure 26-6. ADC timing diagram, auto triggered conversion. Figure 26-7. ADC timing diagram, free running conversion. 26.5.1 Differential channels When using differential channels, certain aspects of the conversion need to be taken into consideration. Differential conversions are synchronized to the internal clock CKADC2 equal to half the ADC clock frequency. This synchronization is done automatically by the ADC interface in such a way that the sample-and-hold occurs at a specific phase of CKADC2. A conversion initiated by the user (that is, all single conversions, and the first free running conversion) when CKADC2 is low will take the same amount of time as a single ended conversion (13 ADC clock cycles from the next prescaled clock cycle). A conversion initiated by the user when CKADC2 is high will take 14 ADC clock cycles due to the synchronization mechanism. In Free Running mode, a new conversion is initiated immediately after the previous conversion completes, and since CKADC2 is high at this time, all automatically started (that is, all but the first) Free Running conversions will take 14 ADC clock cycles. Table 26-1. ADC conversion time. Condition First conversion Normal conversion, single ended Auto triggered conversion Sample & Hold (Cycles from Start of Conversion) 14.5 1.5 2 Conversion Time (Cycles) 25 13 13.5 1 2 3 4 5 6 7 8 9 10 11 12 13 Sign and MSB of result LSB of result ADC clock Trigger Source ADIF ADCH ADCL Cycle number 1 2 One conversion Next conversion Conversion complete Prescaler reset ADATE Prescaler reset Sample & hold MUX and REFS update 11 12 13 Sign and MSB of result LSB of result ADC clock ADSC ADIF ADCH ADCL Cycle number 1 2 One conversion Next conversion 3 4 Conversion complete Sample & hold MUX and REFS update313 7593L–AVR–09/12 AT90USB64/128 If differential channels are used and conversions are started by Auto Triggering, the ADC must be switched off between conversions. When Auto Triggering is used, the ADC prescaler is reset before the conversion is started. Since the stage is dependent of a stable ADC clock prior to the conversion, this conversion will not be valid. By disabling and then re-enabling the ADC between each conversion (writing ADEN in ADCSRA to “0” then to “1”), only extended conversions are performed. The result from the extended conversions will be valid. See “Prescaling and conversion timing” on page 310 for timing details. The gain stage is optimized for a bandwidth of 4kHz at all gain settings. Higher frequencies may be subjected to non-linear amplification. An external low-pass filter should be used if the input signal contains higher frequency components than the gain stage bandwidth. Note that the ADC clock frequency is independent of the gain stage bandwidth limitation. For example, the ADC clock period may be 6µs, allowing a channel to be sampled at 12ksps, regardless of the bandwidth of this channel. 26.6 Changing channel or reference selection The MUXn and REFS1:0 bits in the ADMUX Register are single buffered through a temporary register to which the CPU has random access. This ensures that the channels and reference selection only takes place at a safe point during the conversion. The channel and reference selection is continuously updated until a conversion is started. Once the conversion starts, the channel and reference selection is locked to ensure a sufficient sampling time for the ADC. Continuous updating resumes in the last ADC clock cycle before the conversion completes (ADIF in ADCSRA is set). Note that the conversion starts on the following rising ADC clock edge after ADSC is written. The user is thus advised not to write new channel or reference selection values to ADMUX until one ADC clock cycle after ADSC is written. If Auto Triggering is used, the exact time of the triggering event can be indeterministic. Special care must be taken when updating the ADMUX Register, in order to control which conversion will be affected by the new settings. If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If the ADMUX Register is changed in this period, the user cannot tell if the next conversion is based on the old or the new settings. ADMUX can be safely updated in the following ways: a. When ADATE or ADEN is cleared. b. During conversion, minimum one ADC clock cycle after the trigger event. c. After a conversion, before the interrupt flag used as trigger source is cleared. When updating ADMUX in one of these conditions, the new settings will affect the next ADC conversion. Special care should be taken when changing differential channels. Once a differential channel has been selected, the stage may take as much as 125µs to stabilize to the new value. Thus conversions should not be started within the first 125µs after selecting a new differential channel. Alternatively, conversion results obtained within this period should be discarded. The same settling time should be observed for the first differential conversion after changing ADC reference (by changing the REFS1:0 bits in ADMUX). The settling time and gain stage bandwidth is independent of the ADHSM bit setting.314 7593L–AVR–09/12 AT90USB64/128 26.6.1 ADC input channels When changing channel selections, the user should observe the following guidelines to ensure that the correct channel is selected: • In Single Conversion mode, always select the channel before starting the conversion. The channel selection may be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the conversion to complete before changing the channel selection • In Free Running mode, always select the channel before starting the first conversion. The channel selection may be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the first conversion to complete, and then change the channel selection. Since the next conversion has already started automatically, the next result will reflect the previous channel selection. Subsequent conversions will reflect the new channel selection When switching to a differential gain channel, the first conversion result may have a poor accuracy due to the required settling time for the automatic offset cancellation circuitry. The user should preferably disregard the first conversion result. 26.6.2 ADC voltage reference The reference voltage for the ADC (VREF) indicates the conversion range for the ADC. Single ended channels that exceed VREF will result in codes close to 0x3FF. VREF can be selected as either AVCC, internal 2.56V reference, or external AREF pin. AVCC is connected to the ADC through a passive switch. The internal 2.56V reference is generated from the internal bandgap reference (VBG) through an internal amplifier. In either case, the external AREF pin is directly connected to the ADC, and the reference voltage can be made more immune to noise by connecting a capacitor between the AREF pin and ground. VREF can also be measured at the AREF pin with a high impedant voltmeter. Note that VREF is a high impedant source, and only a capacitive load should be connected in a system. If the user has a fixed voltage source connected to the AREF pin, the user may not use the other reference voltage options in the application, as they will be shorted to the external voltage. If no external voltage is applied to the AREF pin, the user may switch between AVCC and 2.56V as reference selection. The first ADC conversion result after switching reference voltage source may be inaccurate, and the user is advised to discard this result. If differential channels are used, the selected reference should not be closer to AVCC than indicated in Table 31-5 on page 397. 26.7 ADC noise canceler The ADC features a noise canceler that enables conversion during sleep mode to reduce noise induced from the CPU core and other I/O peripherals. The noise canceler can be used with ADC Noise Reduction and Idle mode. To make use of this feature, the following procedure should be used:315 7593L–AVR–09/12 AT90USB64/128 a. Make sure that the ADC is enabled and is not busy converting. Single Conversion mode must be selected and the ADC conversion complete interrupt must be enabled. b. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion once the CPU has been halted. c. If no other interrupts occur before the ADC conversion completes, the ADC interrupt will wake up the CPU and execute the ADC Conversion Complete interrupt routine. If another interrupt wakes up the CPU before the ADC conversion is complete, that interrupt will be executed, and an ADC Conversion Complete interrupt request will be generated when the ADC conversion completes. The CPU will remain in active mode until a new sleep command is executed. Note that the ADC will not be automatically turned off when entering other sleep modes than Idle mode and ADC Noise Reduction mode. The user is advised to write zero to ADEN before entering such sleep modes to avoid excessive power consumption. If the ADC is enabled in such sleep modes and the user wants to perform differential conversions, the user is advised to switch the ADC off and on after waking up from sleep to prompt an extended conversion to get a valid result. 26.7.1 Analog input circuitry The analog input circuitry for single ended channels is illustrated in Figure 26-8. An analog source applied to ADCn is subjected to the pin capacitance and input leakage of that pin, regardless of whether that channel is selected as input for the ADC. When the channel is selected, the source must drive the S/H capacitor through the series resistance (combined resistance in the input path). The ADC is optimized for analog signals with an output impedance of approximately 10kΩ or less. If such a source is used, the sampling time will be negligible. If a source with higher impedance is used, the sampling time will depend on how long time the source needs to charge the S/H capacitor, with can vary widely. The user is recommended to only use low impedant sources with slowly varying signals, since this minimizes the required charge transfer to the S/H capacitor. If differential gain channels are used, the input circuitry looks somewhat different, although source impedances of a few hundred kΩ or less is recommended. Signal components higher than the Nyquist frequency (fADC/2) should not be present for either kind of channels, to avoid distortion from unpredictable signal convolution. The user is advised to remove high frequency components with a low-pass filter before applying the signals as inputs to the ADC. Figure 26-8. Analog input circuitry. ADCn I IH 1..100kΩ CS/H= 14pF VCC/2 I IL316 7593L–AVR–09/12 AT90USB64/128 26.7.2 Analog noise canceling techniques Digital circuitry inside and outside the device generates EMI which might affect the accuracy of analog measurements. If conversion accuracy is critical, the noise level can be reduced by applying the following techniques: a. Keep analog signal paths as short as possible. Make sure analog tracks run over the analog ground plane, and keep them well away from high-speed switching digital tracks. b. The AVCC pin on the device should be connected to the digital VCC supply voltage via an LC network as shown in Figure 26-9. c. Use the ADC noise canceler function to reduce induced noise from the CPU. d. If any ADC port pins are used as digital outputs, it is essential that these do not switch while a conversion is in progress. Figure 26-9. ADC power connections. 26.7.3 Offset compensation schemes The gain stage has a built-in offset cancellation circuitry that nulls the offset of differential measurements as much as possible. The remaining offset in the analog path can be measured directly by selecting the same channel for both differential inputs. This offset residue can be then subtracted in software from the measurement results. Using this kind of software based offset correction, offset on any channel can be reduced below one LSB. 26.7.4 ADC accuracy definitions An n-bit single-ended ADC converts a voltage linearly between GND and VREF in 2n steps (LSBs). The lowest code is read as 0, and the highest code is read as 2n -1. Several parameters describe the deviation from the ideal behavior: VCC GND 100nF Analog ground plane (ADC0) PF0 (ADC7) PF7 (ADC1) PF1 (ADC2) PF2 (ADC3) PF3 (ADC4) PF4 (ADC5) PF5 (ADC6) PF6 AREF GND AVCC 52 53 54 55 56 57 58 59 60 61 62 63 64 1 51 NC (AD0) PA0 10μH317 7593L–AVR–09/12 AT90USB64/128 • Offset: The deviation of the first transition (0x000 to 0x001) compared to the ideal transition (at 0.5 LSB). Ideal value: 0 LSB Figure 26-10. Offset error. • Gain Error: After adjusting for offset, the Gain Error is found as the deviation of the last transition (0x3FE to 0x3FF) compared to the ideal transition (at 1.5 LSB below maximum). Ideal value: 0 LSB Figure 26-11. Gain error. • Integral non-linearity (INL): After adjusting for offset and gain error, the INL is the maximum deviation of an actual transition compared to an ideal transition for any code. Ideal value: 0 LSB Output code VREF Input voltage Ideal ADC Actual ADC Offset error Output code VREF Input voltage Ideal ADC Actual ADC Gain error318 7593L–AVR–09/12 AT90USB64/128 Figure 26-12. Integral non-linearity (INL). • Differential Non-linearity (DNL): The maximum deviation of the actual code width (the interval between two adjacent transitions) from the ideal code width (1 LSB). Ideal value: 0 LSB Figure 26-13. Differential non-linearity (DNL). • Quantization Error: Due to the quantization of the input voltage into a finite number of codes, a range of input voltages (1 LSB wide) will code to the same value. Always ±0.5 LSB. • Absolute Accuracy: The maximum deviation of an actual (unadjusted) transition compared to an ideal transition for any code. This is the compound effect of offset, gain error, differential error, non-linearity, and quantization error. Ideal value: ±0.5 LSB. 26.8 ADC conversion result After the conversion is complete (ADIF is high), the conversion result can be found in the ADC Result Registers (ADCL, ADCH). Output code VREF Input voltage Ideal ADC Actual ADC INL Output code 0x3FF 0x000 0 VREF Input voltage DNL 1 LSB319 7593L–AVR–09/12 AT90USB64/128 For single ended conversion, the result is: where VIN is the voltage on the selected input pin and VREF the selected voltage reference (see Table 26-3 on page 322 and Table 26-4 on page 322). 0x000 represents analog ground, and 0x3FF represents the selected reference voltage minus one LSB. If differential channels are used, the result is: where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative input pin, GAIN the selected gain factor and VREF the selected voltage reference. The result is presented in two’s complement form, from 0x200 (-512d) through 0x1FF (+511d). Note that if the user wants to perform a quick polarity check of the result, it is sufficient to read the MSB of the result (ADC9 in ADCH). If the bit is one, the result is negative, and if this bit is zero, the result is positive. Figure 26-14 shows the decoding of the differential input range. Table 82 shows the resulting output codes if the differential input channel pair (ADCn - ADCm) is selected with a reference voltage of VREF. ADC VIN ⋅ 1024 VREF = -------------------------- ADC VPOS VNEG ( ) – ⋅ ⋅ GAIN 512 VREF = ------------------------------------------------------------------------320 7593L–AVR–09/12 AT90USB64/128 Figure 26-14. Differential measurement range. 0 Output code 0x1FF 0x000 VREF Differential input voltage (volts) 0x3FF 0x200 - VREF321 7593L–AVR–09/12 AT90USB64/128 Example 1: – ADMUX = 0xED (ADC3 - ADC2, 10× gain, 2.56V reference, left adjusted result) – Voltage on ADC3 is 300mV, voltage on ADC2 is 500mV. – ADCR = 512 × 10 × (300 - 500) / 2560 = -400 = 0x270 – ADCL will thus read 0x00, and ADCH will read 0x9C. Writing zero to ADLAR right adjusts the result: ADCL = 0x70, ADCH = 0x02. Example 2: – ADMUX = 0xFB (ADC3 - ADC2, 1× gain, 2.56V reference, left adjusted result) – Voltage on ADC3 is 300mV, voltage on ADC2 is 500mV. – ADCR = 512 × 1 × (300 - 500) / 2560 = -41 = 0x029. – ADCL will thus read 0x40, and ADCH will read 0x0A. Writing zero to ADLAR right adjusts the result: ADCL = 0x00, ADCH = 0x29. 26.9 ADC register description 26.9.1 ADMUX – ADC Multiplexer Selection Register • Bit 7:6 – REFS1:0: Reference Selection bits These bits select the voltage reference for the ADC, as shown in Table 26-3 on page 322. If these bits are changed during a conversion, the change will not go in effect until this conversion Table 26-2. Correlation between input voltage and output codes. VADCn Read code Corresponding decimal value VADCm + VREF /GAIN 0x1FF 511 VADCm + 0.999 VREF /GAIN 0x1FF 511 VADCm + 0.998 VREF /GAIN 0x1FE 510 ... ... ... VADCm + 0.001 VREF /GAIN 0x001 1 VADCm 0x000 0 VADCm - 0.001 VREF /GAIN 0x3FF -1 ... ... ... VADCm - 0.999 VREF /GAIN 0x201 -511 VADCm - VREF /GAIN 0x200 -512 Bit 7 6 5 4 3 2 1 0 REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 ADMUX Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0322 7593L–AVR–09/12 AT90USB64/128 is complete (ADIF in ADCSRA is set). The internal voltage reference options may not be used if an external reference voltage is being applied to the AREF pin. • Bit 5 – ADLAR: ADC Left Adjust Result The ADLAR bit affects the presentation of the ADC conversion result in the ADC Data Register. Write one to ADLAR to left adjust the result. Otherwise, the result is right adjusted. Changing the ADLAR bit will affect the ADC Data Register immediately, regardless of any ongoing conversions. For a complete description of this bit, see “ADCL and ADCH – The ADC data register” on page 324. • Bits 4:0 – MUX4:0: Analog Channel Selection bits The value of these bits selects which combination of analog inputs are connected to the ADC. These bits also select the gain for the differential channels. See Table 26-4 for details. If these bits are changed during a conversion, the change will not go in effect until this conversion is complete (ADIF in ADCSRA is set). Table 26-3. Voltage reference selections for ADC. REFS1 REFS0 Voltage reference selection 0 0 AREF, internal VREF turned off 0 1 AVCC with external capacitor on AREF pin 1 0 Reserved 1 1 Internal 2.56V Voltage Reference with external capacitor on AREF pin Table 26-4. Input channel and gain selections. MUX4..0 Single ended input Positive differential input Negative differential input Gain 00000 ADC0 N/A 00001 ADC1 00010 ADC2 00011 ADC3 00100 ADC4 00101 ADC5 00110 ADC6 00111 ADC7323 7593L–AVR–09/12 AT90USB64/128 26.9.2 ADCSRA – ADC Control and Status Register A • Bit 7 – ADEN: ADC Enable Writing this bit to one enables the ADC. By writing it to zero, the ADC is turned off. Turning the ADC off while a conversion is in progress, will terminate this conversion. • Bit 6 – ADSC: ADC Start Conversion In Single Conversion mode, write this bit to one to start each conversion. In Free Running mode, write this bit to one to start the first conversion. The first conversion after ADSC has been written after the ADC has been enabled, or if ADSC is written at the same time as the ADC is enabled, 01000 N/A (ADC0 / ADC0 / 10x) 01001 ADC1 ADC0 10× 01010 (ADC0 / ADC0 / 200x) 01011 ADC1 ADC0 200× 01100 (Reserved - ADC2 / ADC2 / 10x) 01101 ADC3 ADC2 10× 01110 (ADC2 / ADC2 / 200x) 01111 ADC3 ADC2 200× 10000 ADC0 ADC1 1× 10001 (ADC1 / ADC1 / 1x) 10010 ADC2 ADC1 1× 10011 ADC3 ADC1 1× 10100 ADC4 ADC1 1× 10101 ADC5 ADC1 1× 10110 ADC6 ADC1 1× 10111 ADC7 ADC1 1× 11000 ADC0 ADC2 1× 11001 ADC1 ADC2 1× 11010 (ADC2 / ADC2 / 1x) 11011 ADC3 ADC2 1× 11100 ADC4 ADC2 1× 11101 ADC5 ADC2 1× 11110 1.1V (VBand Gap) N/A 11111 0V (GND) Table 26-4. Input channel and gain selections. (Continued) MUX4..0 Single ended input Positive differential input Negative differential input Gain Bit 7 6 5 4 3 2 1 0 ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 ADCSRA Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0324 7593L–AVR–09/12 AT90USB64/128 will take 25 ADC clock cycles instead of the normal 13. This first conversion performs initialization of the ADC. ADSC will read as one as long as a conversion is in progress. When the conversion is complete, it returns to zero. Writing zero to this bit has no effect. • Bit 5 – ADATE: ADC Auto Trigger Enable When this bit is written to one, Auto Triggering of the ADC is enabled. The ADC will start a conversion on a positive edge of the selected trigger signal. The trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB. • Bit 4 – ADIF: ADC Interrupt Flag This bit is set when an ADC conversion completes and the Data Registers are updated. The ADC Conversion Complete Interrupt is executed if the ADIE bit and the I-bit in SREG are set. ADIF is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, ADIF is cleared by writing a logical one to the flag. Beware that if doing a Read-ModifyWrite on ADCSRA, a pending interrupt can be disabled. This also applies if the SBI and CBI instructions are used. • Bit 3 – ADIE: ADC Interrupt Enable When this bit is written to one and the I-bit in SREG is set, the ADC Conversion Complete Interrupt is activated. • Bits 2:0 – ADPS2:0: ADC Prescaler Select Bits These bits determine the division factor between the XTAL frequency and the input clock to the ADC. 26.9.3 ADCL and ADCH – The ADC data register 26.9.3.1 ADLAR = 0 Table 26-5. ADC prescaler selections. ADPS2 ADPS1 ADPS0 Division factor 000 2 001 2 010 4 011 8 1 0 0 16 1 0 1 32 1 1 0 64 1 1 1 128 Bit 15 14 13 12 11 10 9 8 – – – – – – ADC9 ADC8 ADCH ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 ADCL Bit 7 6 5 4 3 2 1 0 Read/write R R R R R R R R RRRRRRRR Initial value 0 0 0 0 0 0 0 0 00000000325 7593L–AVR–09/12 AT90USB64/128 26.9.3.2 ADLAR = 1 When an ADC conversion is complete, the result is found in these two registers. If differential channels are used, the result is presented in two’s complement form. When ADCL is read, the ADC Data Register is not updated until ADCH is read. Consequently, if the result is left adjusted and no more than 8-bit precision (7 bit + sign bit for differential input channels) is required, it is sufficient to read ADCH. Otherwise, ADCL must be read first, then ADCH. The ADLAR bit in ADMUX, and the MUXn bits in ADMUX affect the way the result is read from the registers. If ADLAR is set, the result is left adjusted. If ADLAR is cleared (default), the result is right adjusted. • ADC9:0: ADC Conversion Result These bits represent the result from the conversion, as detailed in “ADC conversion result” on page 318. 26.9.4 ADCSRB – ADC Control and Status Register B • Bit 7 – ADHSM: ADC High Speed Mode Writing this bit to one enables the ADC High Speed mode. This mode enables higher conversion rate at the expense of higher power consumption. • Bit 2:0 – ADTS2:0: ADC Auto Trigger Source If ADATE in ADCSRA is written to one, the value of these bits selects which source will trigger an ADC conversion. If ADATE is cleared, the ADTS2:0 settings will have no effect. A conversion will be triggered by the rising edge of the selected interrupt flag. Note that switching from a trigger source that is cleared to a trigger source that is set, will generate a positive edge on the trigger signal. If ADEN in ADCSRA is set, this will start a conversion. Switching to Free Running mode (ADTS[2:0]=0) will not cause a trigger event, even if the ADC Interrupt Flag is set. Bit 15 14 13 12 11 10 9 8 ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADCH ADC1 ADC0 – ––––– ADCL Bit 7 6 5 4 3 2 1 0 Read/write R R R R R R R R RRRRRRRR Initial value 0 0 0 0 0 0 0 0 00000000 Bit 7 6 5 4 3 2 1 0 ADHSM ACME – – – ADTS2 ADTS1 ADTS0 ADCSRB Read/write R/W R/W R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Table 26-6. ADC auto trigger source selections. ADTS2 ADTS1 ADTS0 Trigger source 0 0 0 Free running mode 0 0 1 Analog comparator 0 1 0 External interrupt request 0 0 1 1 Timer/Counter0 compare match326 7593L–AVR–09/12 AT90USB64/128 26.9.5 DIDR0 – Digital Input Disable Register 0 • Bit 7:0 – ADC7D..ADC0D: ADC7:0 Digital Input Disable When this bit is written logic one, the digital input buffer on the corresponding ADC pin is disabled. The corresponding PIN Register bit will always read as zero when this bit is set. When an analog signal is applied to the ADC7..0 pin and the digital input from this pin is not needed, this bit should be written logic one to reduce power consumption in the digital input buffer. 1 0 0 Timer/Counter0 overflow 1 0 1 Timer/Counter1 compare match B 1 1 0 Timer/Counter1 overflow 1 1 1 Timer/Counter1 capture event Table 26-6. ADC auto trigger source selections. (Continued) ADTS2 ADTS1 ADTS0 Trigger source Bit 7 6 5 4 3 2 1 0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D DIDR0 Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0327 7593L–AVR–09/12 AT90USB64/128 27. JTAG interface and on-chip debug system 27.0.1 Features • JTAG (IEEE std. 1149.1 compliant) interface • Boundary-scan capabilities according to the IEEE std. 1149.1 (JTAG) standard • Debugger access to: – All internal peripheral units – Internal and external RAM – The internal register file – Program counter – EEPROM and flash memories • Extensive on-chip debug support for break conditions, including – AVR break instruction – Break on change of program memory flow – Single step break – Program memory break points on single address or address range – Data memory break points on single address or address range • Programming of flash, EEPROM, fuses, and lock bits through the JTAG interface • On-chip debugging supported by Atmel AVR Studio® 27.1 Overview The AVR IEEE std. 1149.1 compliant JTAG interface can be used for • Testing PCBs by using the JTAG Boundary-scan capability • Programming the non-volatile memories, Fuses and Lock bits • On-chip debugging A brief description is given in the following sections. Detailed descriptions for Programming via the JTAG interface, and using the Boundary-scan Chain can be found in the sections “Programming via the JTAG interface” on page 377 and “IEEE 1149.1 (JTAG) boundary-scan” on page 333, respectively. The On-chip Debug support is considered being private JTAG instructions, and distributed within Atmel and to selected third party vendors only. Figure 27-1 on page 328 shows a block diagram of the JTAG interface and the On-chip Debug system. The TAP Controller is a state machine controlled by the TCK and TMS signals. The TAP Controller selects either the JTAG Instruction Register or one of several Data Registers as the scan chain (Shift Register) between the TDI – input and TDO – output. The Instruction Register holds JTAG instructions controlling the behavior of a Data Register. The ID-Register, Bypass Register, and the Boundary-scan Chain are the Data Registers used for board-level testing. The JTAG Programming Interface (actually consisting of several physical and virtual Data Registers) is used for serial programming via the JTAG interface. The Internal Scan Chain and Break Point Scan Chain are used for On-chip debugging only. 27.2 TAP – Test Access Port The JTAG interface is accessed through four of the AVR’s pins. In JTAG terminology, these pins constitute the Test Access Port – TAP. These pins are: • TMS: Test mode select. This pin is used for navigating through the TAP-controller state machine • TCK: Test Clock. JTAG operation is synchronous to TCK328 7593L–AVR–09/12 AT90USB64/128 • TDI: Test Data In. Serial input data to be shifted in to the Instruction Register or Data Register (Scan Chains) • TDO: Test Data Out. Serial output data from Instruction Register or Data Register The IEEE std. 1149.1 also specifies an optional TAP signal; TRST – Test ReSeT – which is not provided. When the JTAGEN Fuse is unprogrammed, these four TAP pins are normal port pins, and the TAP controller is in reset. When programmed, the input TAP signals are internally pulled high and the JTAG is enabled for Boundary-scan and programming. The device is shipped with this fuse programmed. For the On-chip Debug system, in addition to the JTAG interface pins, the RESET pin is monitored by the debugger to be able to detect external reset sources. The debugger can also pull the RESET pin low to reset the whole system, assuming only open collectors on the reset line are used in the application. Figure 27-1. Block diagram. TAP CONTROLLER TDI TDO TCK TMS FLASH MEMORY AVR CPU DIGITAL PERIPHERAL UNITS JTAG / AVR CORE COMMUNICATION INTERFACE BREAKPOINT UNIT FLOW CONTROL UNIT OCD STATUS AND CONTROL INTERNAL SCAN CHAIN M U X INSTRUCTION REGISTER ID REGISTER BYPASS REGISTER JTAG PROGRAMMING INTERFACE PC Instruction Address Data BREAKPOINT SCAN CHAIN ADDRESS DECODER ANALOG PERIPHERIAL UNITS I/O PORT 0 I/O PORT n BOUNDARY SCAN CHAIN Analog inputs Control & clock lines DEVICE BOUNDARY329 7593L–AVR–09/12 AT90USB64/128 Figure 27-2. TAP controller state diagram. 27.3 TAP Controller The TAP Controller is a 16-state finite state machine that controls the operation of the Boundaryscan circuitry, JTAG programming circuitry, or On-chip Debug system. The state transitions depicted in Figure 27-2 depend on the signal present on TMS (shown adjacent to each state transition) at the time of the rising edge at TCK. The initial state after a Power-on Reset is TestLogic-Reset. As a definition in this document, the LSB is shifted in and out first for all Shift Registers. Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG interface is: • At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter the Shift Instruction Register – Shift-IR state. While in this state, shift the four bits of the JTAG instructions into the JTAG Instruction Register from the TDI input at the rising edge of TCK. The TMS input must be held low during input of the three LSBs in order to remain in the ShiftIR state. The MSB of the instruction is shifted in when this state is left by setting TMS high. While the instruction is shifted in from the TDI pin, the captured IR-state 0x01 is shifted out on the TDO pin. The JTAG Instruction selects a particular Data Register as path between TDI and TDO and controls the circuitry surrounding the selected Data Register Test-logic-reset Run-test/idle Shift-DR Exit1-DR Pause-DR Exit2-DR Update-DR Select-IR scan Capture-IR Shift-IR Exit1-IR Pause-IR Exit2-IR Update-IR Select-DR scan Capture-DR 0 1 0 11 1 0 0 0 0 1 1 1 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 0 0 1 1330 7593L–AVR–09/12 AT90USB64/128 • Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched onto the parallel output from the Shift Register path in the Update-IR state. The Exit-IR, Pause-IR, and Exit2-IR states are only used for navigating the state machine • At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift Data Register – Shift-DR state. While in this state, upload the selected Data Register (selected by the present JTAG instruction in the JTAG Instruction Register) from the TDI input at the rising edge of TCK. In order to remain in the Shift-DR state, the TMS input must be held low during input of all bits except the MSB. The MSB of the data is shifted in when this state is left by setting TMS high. While the Data Register is shifted in from the TDI pin, the parallel inputs to the Data Register captured in the Capture-DR state is shifted out on the TDO pin • Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected Data Register has a latched parallel-output, the latching takes place in the Update-DR state. The Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting JTAG instruction and using Data Registers, and some JTAG instructions may select certain functions to be performed in the Run-Test/Idle, making it unsuitable as an Idle state. Note: Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can always be entered by holding TMS high for five TCK clock periods. For detailed information on the JTAG specification, refer to the literature listed in “Bibliography” on page 332. 27.4 Using the Boundary-scan chain A complete description of the Boundary-scan capabilities are given in the section “IEEE 1149.1 (JTAG) boundary-scan” on page 333. 27.5 Using the on-chip debug system As shown in Figure 27-1 on page 328, the hardware support for on-chip debugging consists mainly of • A scan chain on the interface between the internal AVR CPU and the internal peripheral units • Break Point unit • Communication interface between the CPU and JTAG system All read or modify/write operations needed for implementing the Debugger are done by applying AVR instructions via the internal AVR CPU Scan Chain. The CPU sends the result to an I/O memory mapped location which is part of the communication interface between the CPU and the JTAG system. The Break Point Unit implements Break on Change of Program Flow, Single Step Break, two Program Memory Break Points, and two combined Break Points. Together, the four Break Points can be configured as either: • Four single program memory break points • Three single program memory break point + one single data memory break point • Two single program memory break points + two single data memory break points • Two single program memory break points + one program memory break point with mask (“range Break Point”)331 7593L–AVR–09/12 AT90USB64/128 • Two single program memory break points + one data memory break point with mask (“range Break Point”) A debugger, like the Atmel AVR Studio, may however use one or more of these resources for its internal purpose, leaving less flexibility to the end-user. A list of the On-chip Debug specific JTAG instructions is given in “On-chip debug specific JTAG instructions” on page 331. The JTAGEN Fuse must be programmed to enable the JTAG Test Access Port. In addition, the OCDEN Fuse must be programmed and no Lock bits must be set for the On-chip debug system to work. As a security feature, the On-chip debug system is disabled when either of the LB1 or LB2 Lock bits are set. Otherwise, the On-chip debug system would have provided a back-door into a secured device. The AVR Studio enables the user to fully control execution of programs on an AVR device with On-chip Debug capability, AVR In-Circuit Emulator, or the built-in AVR Instruction Set Simulator. AVR Studio supports source level execution of Assembly programs assembled with Atmel Corporation’s AVR Assembler and C programs compiled with third party vendors’ compilers. AVR Studio runs under Microsoft® Windows® 95/98/2000 and Microsoft Windows NT. For a full description of the Atmel AVR Studio, please refer to the AVR Studio User Guide. Only highlights are presented in this document. All necessary execution commands are available in AVR Studio, both on source level and on disassembly level. The user can execute the program, single step through the code either by tracing into or stepping over functions, step out of functions, place the cursor on a statement and execute until the statement is reached, stop the execution, and reset the execution target. In addition, the user can have an unlimited number of code Break Points (using the BREAK instruction) and up to two data memory Break Points, alternatively combined as a mask (range) Break Point. 27.6 On-chip debug specific JTAG instructions The On-chip debug support is considered being private JTAG instructions, and distributed within ATMEL and to selected third party vendors only. Instruction opcodes are listed for reference. 27.6.1 PRIVATE0; 0x8 Private JTAG instruction for accessing On-chip debug system. 27.6.2 PRIVATE1; 0x9 Private JTAG instruction for accessing On-chip debug system. 27.6.3 PRIVATE2; 0xA Private JTAG instruction for accessing On-chip debug system. 27.6.4 PRIVATE3; 0xB Private JTAG instruction for accessing On-chip debug system.332 7593L–AVR–09/12 AT90USB64/128 27.7 On-chip Debug related Register in I/O memory 27.7.1 OCDR – On-chip Debug Register The OCDR Register provides a communication channel from the running program in the microcontroller to the debugger. The CPU can transfer a byte to the debugger by writing to this location. At the same time, an internal flag; I/O Debug Register Dirty – IDRD – is set to indicate to the debugger that the register has been written. When the CPU reads the OCDR Register the seven LSB will be from the OCDR Register, while the MSB is the IDRD bit. The debugger clears the IDRD bit when it has read the information. In some AVR devices, this register is shared with a standard I/O location. In this case, the OCDR Register can only be accessed if the OCDEN Fuse is programmed, and the debugger enables access to the OCDR Register. In all other cases, the standard I/O location is accessed. Refer to the debugger documentation for further information on how to use this register. 27.8 Using the JTAG programming capabilities Programming of AVR parts via JTAG is performed via the 4-pin JTAG port, TCK, TMS, TDI, and TDO. These are the only pins that need to be controlled/observed to perform JTAG programming (in addition to power pins). It is not required to apply 12V externally. The JTAGEN Fuse must be programmed and the JTD bit in the MCUCR Register must be cleared to enable the JTAG Test Access Port. The JTAG programming capability supports: • Flash programming and verifying • EEPROM programming and verifying • Fuse programming and verifying • Lock bit programming and verifying The Lock bit security is exactly as in parallel programming mode. If the Lock bits LB1 or LB2 are programmed, the OCDEN Fuse cannot be programmed unless first doing a chip erase. This is a security feature that ensures no back-door exists for reading out the content of a secured device. The details on programming through the JTAG interface and programming specific JTAG instructions are given in the section “Programming via the JTAG interface” on page 377. 27.9 Bibliography For more information about general Boundary-scan, the following literature can be consulted: • IEEE: IEEE Std. 1149.1-1990. IEEE Standard Test Access Port and Boundary-scan Architecture, IEEE, 1993. • Colin Maunder: The Board Designers Guide to Testable Logic Circuits, Addison-Wesley, 1992. Bit 7 6 5 4 3 2 1 0 MSB/IDRD LSB OCDR Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0333 7593L–AVR–09/12 AT90USB64/128 28. IEEE 1149.1 (JTAG) boundary-scan 28.1 Features • JTAG (IEEE std. 1149.1 compliant) interface • Boundary-scan capabilities according to the JTAG standard • Full scan of all port functions as well as analog circuitry having off-chip connections • Supports the optional IDCODE instruction • Additional public AVR_RESET instruction to reset the AVR 28.2 System overview The Boundary-scan chain has the capability of driving and observing the logic levels on the digital I/O pins, as well as the boundary between digital and analog logic for analog circuitry having off-chip connections. At system level, all ICs having JTAG capabilities are connected serially by the TDI/TDO signals to form a long Shift Register. An external controller sets up the devices to drive values at their output pins, and observe the input values received from other devices. The controller compares the received data with the expected result. In this way, Boundary-scan provides a mechanism for testing interconnections and integrity of components on Printed Circuits Boards by using the four TAP signals only. The four IEEE 1149.1 defined mandatory JTAG instructions IDCODE, BYPASS, SAMPLE/PRELOAD, and EXTEST, as well as the AVR specific public JTAG instruction AVR_RESET can be used for testing the Printed Circuit Board. Initial scanning of the Data Register path will show the ID-Code of the device, since IDCODE is the default JTAG instruction. It may be desirable to have the AVR device in reset during test mode. If not reset, inputs to the device may be determined by the scan operations, and the internal software may be in an undetermined state when exiting the test mode. Entering reset, the outputs of any port pin will instantly enter the high impedance state, making the HIGHZ instruction redundant. If needed, the BYPASS instruction can be issued to make the shortest possible scan chain through the device. The device can be set in the reset state either by pulling the external RESET pin low, or issuing the AVR_RESET instruction with appropriate setting of the Reset Data Register. The EXTEST instruction is used for sampling external pins and loading output pins with data. The data from the output latch will be driven out on the pins as soon as the EXTEST instruction is loaded into the JTAG IR-Register. Therefore, the SAMPLE/PRELOAD should also be used for setting initial values to the scan ring, to avoid damaging the board when issuing the EXTEST instruction for the first time. SAMPLE/PRELOAD can also be used for taking a snapshot of the external pins during normal operation of the part. The JTAGEN Fuse must be programmed and the JTD bit in the I/O Register MCUCR must be cleared to enable the JTAG Test Access Port. When using the JTAG interface for Boundary-scan, using a JTAG TCK clock frequency higher than the internal chip frequency is possible. The chip clock is not required to run. 28.3 Data registers The Data Registers relevant for Boundary-scan operations are: • Bypass Register • Device Identification Register • Reset Register • Boundary-scan Chain334 7593L–AVR–09/12 AT90USB64/128 28.3.1 Bypass register The Bypass register consists of a single Shift register stage. When the Bypass register is selected as path between TDI and TDO, the register is reset to 0 when leaving the Capture-DR controller state. The Bypass register can be used to shorten the scan chain on a system when the other devices are to be tested. 28.3.2 Device Identification register Figure 28-1 shows the structure of the Device Identification register. Figure 28-1. The Format of the Device Identification register. 28.3.2.1 Version Version is a 4-bit number identifying the revision of the component. The JTAG version number follows the revision of the device. Revision A is 0x0, revision B is 0x1 and so on. 28.3.2.2 Part number The part number is a 16-bit code identifying the component. The JTAG Part Number for Atmel AT90USB64/128 is listed in Table 28-1. 28.3.2.3 Manufacturer ID The Manufacturer ID is a 11-bit code identifying the manufacturer. The JTAG manufacturer ID for ATMEL is listed in Table 28-2. 28.3.3 Reset register The Reset Register is a test Data Register used to reset the part. Since the AVR tri-states Port Pins when reset, the Reset Register can also replace the function of the un-implemented optional JTAG instruction HIGHZ. A high value in the Reset Register corresponds to pulling the external Reset low. The part is reset as long as there is a high value present in the Reset Register. Depending on the fuse settings for the clock options, the part will remain reset for a reset time-out period (refer to “Clock sources” on page 41) after releasing the Reset Register. The output from this Data Register is not latched, so the reset will take place immediately, as shown in Figure 28-2 on page 335. MSB LSB Bit 31 28 27 12 11 1 0 Device ID Version Part number Manufacturer ID 1 4 bits 16 bits 11 bits 1-bit Table 28-1. AVR JTAG part number. Part number JTAG part number (hex) AVR USB 0x9782 Table 28-2. Manufacturer ID. Manufacturer JTAG manufacturer ID (hex) ATMEL 0x01F335 7593L–AVR–09/12 AT90USB64/128 Figure 28-2. Reset register. 28.3.4 Boundary-scan Chain The Boundary-scan Chain has the capability of driving and observing the logic levels on the digital I/O pins, as well as the boundary between digital and analog logic for analog circuitry having off-chip connections. See “Boundary-scan chain” on page 337 for a complete description. 28.4 Boundary-scan specific JTAG instructions The Instruction Register is 4-bit wide, supporting up to 16 instructions. Listed below are the JTAG instructions useful for Boundary-scan operation. Note that the optional HIGHZ instruction is not implemented, but all outputs with tri-state capability can be set in high-impedant state by using the AVR_RESET instruction, since the initial state for all port pins is tri-state. As a definition in this datasheet, the LSB is shifted in and out first for all Shift Registers. The OPCODE for each instruction is shown behind the instruction name in hex format. The text describes which Data Register is selected as path between TDI and TDO for each instruction. 28.4.1 EXTEST; 0x0 Mandatory JTAG instruction for selecting the Boundary-scan Chain as Data Register for testing circuitry external to the AVR package. For port-pins, Pull-up Disable, Output Control, Output Data, and Input Data are all accessible in the scan chain. For Analog circuits having off-chip connections, the interface between the analog and the digital logic is in the scan chain. The contents of the latched outputs of the Boundary-scan chain is driven out as soon as the JTAG IRRegister is loaded with the EXTEST instruction. The active states are: • Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain • Shift-DR: The Internal Scan Chain is shifted by the TCK input • Update-DR: Data from the scan chain is applied to output pins 28.4.2 IDCODE; 0x1 Optional JTAG instruction selecting the 32-bit ID-Register as Data Register. The ID-Register consists of a version number, a device number and the manufacturer code chosen by JEDEC. This is the default instruction after power-up. D Q From TDI ClockDR · AVR_RESET To TDO From other internal and external reset sources Internal reset336 7593L–AVR–09/12 AT90USB64/128 The active states are: • Capture-DR: Data in the IDCODE Register is sampled into the Boundary-scan Chain • Shift-DR: The IDCODE scan chain is shifted by the TCK input 28.4.3 SAMPLE_PRELOAD; 0x2 Mandatory JTAG instruction for pre-loading the output latches and taking a snap-shot of the input/output pins without affecting the system operation. However, the output latches are not connected to the pins. The Boundary-scan Chain is selected as Data Register. The active states are: • Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain • Shift-DR: The Boundary-scan Chain is shifted by the TCK input • Update-DR: Data from the Boundary-scan chain is applied to the output latches. However, the output latches are not connected to the pins 28.4.4 AVR_RESET; 0xC The AVR specific public JTAG instruction for forcing the AVR device into the Reset mode or releasing the JTAG reset source. The TAP controller is not reset by this instruction. The one bit Reset Register is selected as Data Register. Note that the reset will be active as long as there is a logic “one” in the Reset Chain. The output from this chain is not latched. The active states are: • Shift-DR: The Reset Register is shifted by the TCK input 28.4.5 BYPASS; 0xF Mandatory JTAG instruction selecting the Bypass Register for Data Register. The active states are: • Capture-DR: Loads a logic “0” into the Bypass Register • Shift-DR: The Bypass Register cell between TDI and TDO is shifted 28.5 Boundary-scan Related Register in I/O memory 28.5.1 MCUCR – MCU Control Register The MCU Control Register contains control bits for general MCU functions. • Bits 7 – JTD: JTAG Interface Disable When this bit is zero, the JTAG interface is enabled if the JTAGEN Fuse is programmed. If this bit is one, the JTAG interface is disabled. In order to avoid unintentional disabling or enabling of the JTAG interface, a timed sequence must be followed when changing this bit: The application software must write this bit to the desired value twice within four cycles to change its value. Note that this bit must not be altered when using the On-chip Debug system. Bit 7 6 5 4 3 2 1 0 JTD – – PUD – – IVSEL IVCE MCUCR Read/write R/W R R R/W R R R/W R/W Initial value 0 0 0 0 0 0 0 0337 7593L–AVR–09/12 AT90USB64/128 28.5.2 MCUSR – MCU Status Register The MCU Status Register provides information on which reset source caused an MCU reset. • Bit 4 – JTRF: JTAG Reset Flag This bit is set if a reset is being caused by a logic one in the JTAG Reset Register selected by the JTAG instruction AVR_RESET. This bit is reset by a Power-on Reset, or by writing a logic zero to the flag. 28.6 Boundary-scan chain The Boundary-scan chain has the capability of driving and observing the logic levels on the digital I/O pins, as well as the boundary between digital and analog logic for analog circuitry having off-chip connection. 28.6.1 Scanning the digital port pins Figure 28-3 on page 338 shows the Boundary-scan Cell for a bi-directional port pin. The pull-up function is disabled during Boundary-scan when the JTAG IC contains EXTEST or SAMPLE_PRELOAD. The cell consists of a bi-directional pin cell that combines the three signals Output Control - OCxn, Output Data - ODxn, and Input Data - IDxn, into only a two-stage Shift Register. The port and pin indexes are not used in the following description The Boundary-scan logic is not included in the figures in the datasheet. Figure 28-4 on page 339 shows a simple digital port pin as described in the section “I/O-ports” on page 71. The Boundaryscan details from Figure 28-3 on page 338 replaces the dashed box in Figure 28-4 on page 339. When no alternate port function is present, the Input Data - ID - corresponds to the PINxn Register value (but ID has no synchronizer), Output Data corresponds to the PORT Register, Output Control corresponds to the Data Direction - DD Register, and the Pull-up Enable - PUExn - corresponds to logic expression PUD · DDxn · PORTxn. Digital alternate port functions are connected outside the dotted box in Figure 28-4 on page 339 to make the scan chain read the actual pin value. For analog function, there is a direct connection from the external pin to the analog circuit. There is no scan chain on the interface between the digital and the analog circuitry, but some digital control signal to analog circuitry are turned off to avoid driving contention on the pads. When JTAG IR contains EXTEST or SAMPLE_PRELOAD the clock is not sent out on the port pins even if the CKOUT fuse is programmed. Even though the clock is output when the JTAG IR contains SAMPLE_PRELOAD, the clock is not sampled by the boundary scan. Bit 7 6 5 4 3 2 1 0 – – – JTRF WDRF BORF EXTRF PORF MCUSR Read/write R R R R/W R/W R/W R/W R/W Initial value 0 0 0 See bit description338 7593L–AVR–09/12 AT90USB64/128 Figure 28-3. Boundary-scan cell for bi-directional port pin with pull-up function. D Q D Q G 0 1 0 1 D Q D Q G 0 1 0 1 0 1 Port Pin (PXn) ShiftDR To next cell EXTEST Vcc Output control (OC) Output data (OD) Input data (ID) From last cell ClockDR UpdateDR FF1 LD1 FF0 LD0 0 1 Pull-up enable (PUE)339 7593L–AVR–09/12 AT90USB64/128 Figure 28-4. General port pin schematic diagram. 28.6.2 Scanning the RESET pin The RESET pin accepts 5V active low logic for standard reset operation, and 12V active high logic for High Voltage Parallel programming. An observe-only cell as shown in Figure 28-5 is inserted for the 5V reset signal. Figure 28-5. Observe-only cell. CLK RPx RRx WRx RDx WDx PUD SYNCHRONIZER WDx: WRITE DDRx WRx: WRITE PORTx RRx: READ PORTx REGISTER RPx: READ PORTx PIN PUD: PULLUP DISABLE CLK : I/O CLOCK RDx: READ DDRx D L Q Q RESET RESET Q D Q Q Q D CLR PORTxn Q Q D CLR DDxn PINxn DATA BUS SLEEP SLEEP: SLEEP CONTROL Pxn I/O I/O See Boundary-scan description for details! PUExn OCxn ODxn IDxn PUExn: PULLUP ENABLE for pin Pxn OCxn: OUTPUT CONTROL for pin Pxn ODxn: OUTPUT DATA to pin Pxn IDxn: INPUT DATA from pin Pxn 0 1 D Q From previous cell ClockDR ShiftDR To next cell From system pin To system logic FF1340 7593L–AVR–09/12 AT90USB64/128 28.7 Atmel AT90USB64/128 Boundary-scan order Table 28-3 shows the Scan order between TDI and TDO when the Boundary-scan chain is selected as data path. Bit 0 is the LSB; the first bit scanned in, and the first bit scanned out. The scan order follows the pin-out order as far as possible. Therefore, the bits of Port A and Port Fis scanned in the opposite bit order of the other ports. Exceptions from the rules are the Scan chains for the analog circuits, which constitute the most significant bits of the scan chain regardless of which physical pin they are connected to. In Figure 28-3 on page 338, PXn. Data corresponds to FF0, PXn. Control corresponds to FF1, PXn. Bit 4, 5, 6 and 7 of Port F is not in the scan chain, since these pins constitute the TAP pins when the JTAG is enabled. The USB pads are not included in the boundary-scan. Table 28-3. AT90USB64/128 Boundary-scan order. Bit number Signal name Module 88 PE6.Data Port E 87 PE6.Control 86 PE7.Data 85 PE7.Control 84 PE3.Data 83 PE3.Control 82 PB0.Data Port B 81 PB0.Control 80 PB1.Data 79 PB1.Control 78 PB2.Data 77 PB2.Control 76 PB3.Data 75 PB3.Control 74 PB4.Data 73 PB4.Control 72 PB5.Data 71 PB5.Control 70 PB6.Data 69 PB6.Control 68 PB7.Data 67 PB7.Control 66 PE4.Data PORTE 65 PE4.Control 64 PE5.Data 63 PE5.Control 62 RSTT Reset Logic (observe only)341 7593L–AVR–09/12 AT90USB64/128 61 PD0.Data Port D 60 PD0.Control 59 PD1.Data 58 PD1.Control 57 PD2.Data 56 PD2.Control 55 PD3.Data 54 PD3.Control 53 PD4.Data 52 PD4.Control 51 PD5.Data 50 PD5.Control 49 PD6.Data 48 PD6.Control 47 PD7.Data 46 PD7.Control 45 PE0.Data Port E 44 PE0.Control 43 PE1.Data 42 PE1.Control 41 PC0.Data Port C 40 PC0.Control 39 PC1.Data 38 PC1.Control 37 PC2.Data 36 PC2.Control 35 PC3.Data 34 PC3.Control 33 PC4.Data 32 PC4.Control 31 PC5.Data 30 PC5.Control 29 PC6.Data 28 PC6.Control 27 PC7.Data 26 PC7.Control Table 28-3. AT90USB64/128 Boundary-scan order. (Continued) Bit number Signal name Module342 7593L–AVR–09/12 AT90USB64/128 28.8 Boundary-scan description language files Boundary-scan Description Language (BSDL) files describe Boundary-scan capable devices in a standard format used by automated test-generation software. The order and function of bits in the Boundary-scan Data Register are included in this description. BSDL files are available for Atmel AT90USB64/128. 25 PE2.Data Port E 24 PE2.Control 23 PA7.Data Port A 22 PA7.Control 21 PA6.Data 20 PA6.Control 19 PA5.Data 18 PA5.Control 17 PA4.Data 16 PA4.Control 15 PA3.Data 14 PA3.Control 13 PA2.Data 12 PA2.Control 11 PA1.Data 10 PA1.Control 9 PA0.Data 8 PA0.Control 7 PF3.Data Port F 6 PF3.Control 5 PF2.Data 4 PF2.Control 3 PF1.Data 2 PF1.Control 1 PF0.Data 0 PF0.Control Table 28-3. AT90USB64/128 Boundary-scan order. (Continued) Bit number Signal name Module343 7593L–AVR–09/12 AT90USB64/128 29. Boot Loader support – read-while-write self-programming The Boot Loader Support provides a real Read-While-Write Self-Programming mechanism for downloading and uploading program code by the MCU itself. This feature allows flexible application software updates controlled by the MCU using a Flash-resident Boot Loader program. The Boot Loader program can use any available data interface and associated protocol to read code and write (program) that code into the Flash memory, or read the code from the program memory. The program code within the Boot Loader section has the capability to write into the entire Flash, including the Boot Loader memory. The Boot Loader can thus even modify itself, and it can also erase itself from the code if the feature is not needed anymore. The size of the Boot Loader memory is configurable with fuses and the Boot Loader has two separate sets of Boot Lock bits which can be set independently. This gives the user a unique flexibility to select different levels of protection. General information on SPM and ELPM is provided in See “AVR CPU core” on page 11. 29.1 Boot Loader features • Read-while-write self-programming • Flexible boot memory size • High security (separate boot lock bits for a flexible protection) • Separate fuse to select reset vector • Optimized page (1) size • Code efficient algorithm • Efficient read-modify-write support Note: 1. A page is a section in the Flash consisting of several bytes (see Table 30-11 on page 364) used during programming. The page organization does not affect normal operation. 29.2 Application and Boot Loader flash sections The Flash memory is organized in two main sections, the Application section and the Boot Loader section (see Figure 29-2 on page 346). The size of the different sections is configured by the BOOTSZ Fuses as shown in Table 29-8 on page 357 and Figure 29-2 on page 346. These two sections can have different level of protection since they have different sets of Lock bits. 29.2.1 Application section The Application section is the section of the Flash that is used for storing the application code. The protection level for the Application section can be selected by the application Boot Lock bits (Boot Lock bits 0), see Table 29-2 on page 347. The Application section can never store any Boot Loader code since the SPM instruction is disabled when executed from the Application section. 29.2.2 BLS – Boot Loader section While the Application section is used for storing the application code, the The Boot Loader software must be located in the BLS since the SPM instruction can initiate a programming when executing from the BLS only. The SPM instruction can access the entire Flash, including the BLS itself. The protection level for the Boot Loader section can be selected by the Boot Loader Lock bits (Boot Lock bits 1), see Table 29-3 on page 347. 29.3 Read-while-write and no read-while-write flash sections Whether the CPU supports Read-While-Write or if the CPU is halted during a Boot Loader software update is dependent on which address that is being programmed. In addition to the two344 7593L–AVR–09/12 AT90USB64/128 sections that are configurable by the BOOTSZ Fuses as described above, the Flash is also divided into two fixed sections, the Read-While-Write (RWW) section and the No Read-WhileWrite (NRWW) section. The limit between the RWW- and NRWW sections is given in Table 29- 1 and Figure 29-1 on page 345. The main difference between the two sections is: • When erasing or writing a page located inside the RWW section, the NRWW section can be read during the operation • When erasing or writing a page located inside the NRWW section, the CPU is halted during the entire operation Note that the user software can never read any code that is located inside the RWW section during a Boot Loader software operation. The syntax “Read-While-Write section” refers to which section that is being programmed (erased or written), not which section that actually is being read during a Boot Loader software update. 29.3.1 RWW – Read-While-Write section If a Boot Loader software update is programming a page inside the RWW section, it is possible to read code from the Flash, but only code that is located in the NRWW section. During an ongoing programming, the software must ensure that the RWW section never is being read. If the user software is trying to read code that is located inside the RWW section (i.e., by load program memory, call, or jump instructions or an interrupt) during programming, the software might end up in an unknown state. To avoid this, the interrupts should either be disabled or moved to the Boot Loader section. The Boot Loader section is always located in the NRWW section. The RWW Section Busy bit (RWWSB) in the Store Program Memory Control and Status Register (SPMCSR) will be read as logical one as long as the RWW section is blocked for reading. After a programming is completed, the RWWSB must be cleared by software before reading code located in the RWW section. See “SPMCSR – Store Program Memory Control and Status Register” on page 349. for details on how to clear RWWSB. 29.3.2 NRWW – No Read-While-Write section The code located in the NRWW section can be read when the Boot Loader software is updating a page in the RWW section. When the Boot Loader code updates the NRWW section, the CPU is halted during the entire Page Erase or Page Write operation. Table 29-1. Read-While-Write features. Which section does the Zpointer address during the programming? Which section can be read during programming? Is the CPU halted? Read-While-Write supported? RWW section NRWW section No Yes NRWW section None Yes No345 7593L–AVR–09/12 AT90USB64/128 Figure 29-1. Read-While-Write vs. no Read-While-Write. Read-While-Write (RWW) section No Read-While-Write (NRWW) section Z-pointer Addresses RWW section Z-pointer addresses NRWW section CPU is halted during the operation Code located in NRWW section. Can be read during the operation346 7593L–AVR–09/12 AT90USB64/128 Figure 29-2. Memory sections. Note: 1. The parameters in the figure above are given in Table 29-8 on page 357. 29.4 Boot Loader lock bits If no Boot Loader capability is needed, the entire Flash is available for application code. The Boot Loader has two separate sets of Boot Lock bits which can be set independently. This gives the user a unique flexibility to select different levels of protection. The user can select: • To protect the entire Flash from a software update by the MCU • To protect only the Boot Loader Flash section from a software update by the MCU • To protect only the Application Flash section from a software update by the MCU • Allow software update in the entire Flash See Table 29-2 on page 347 and Table 29-3 on page 347 for further details. The Boot Lock bits can be set by software and in Serial or in Parallel Programming mode. They can only be cleared by a Chip Erase command only. The general Write Lock (Lock Bit mode 2) does not control the programming of the Flash memory by SPM instruction. Similarly, the general Read/Write Lock (Lock Bit mode 1) does not control reading nor writing by (E)LPM/SPM, if it is attempted. 0x0000 Flashend Program memory BOOTSZ = '11' Application flash section Boot loader flash section Flashend Program memory BOOTSZ = '10' 0x0000 Program memory BOOTSZ = '01' Program memory BOOTSZ = '00' Application flash section Boot loader flash section 0x0000 Flashend Application flash section Flashend End RWW Start NRWW Application flash section Boot loader flash section Boot loader flash section End RWW Start NRWW End RWW Start NRWW 0x0000 End RWW, end application Start NRWW, start boot loader Application flash section Application flash section Application flash section Read-While-Write section No Read-While-Write section Read-While-Write section No Read-While-Write section Read-While-Write section No Read-While-Write section Read-While-Write section No Read-While-Write section End application Start boot loader End application Start boot loader End application Start boot loader347 7593L–AVR–09/12 AT90USB64/128 Note: 1. “1” means unprogrammed, “0” means programmed. Note: 1. “1” means unprogrammed, “0” means programmed. 29.5 Entering the Boot Loader program The boot loader can be executed with three different conditions: 29.5.1 Regular application conditions. A jump or call from the application program. This may be initiated by a trigger such as a command received via USART, SPI or USB. 29.5.2 Boot Reset fuse The Boot Reset Fuse (BOOTRST) can be programmed so that the Reset Vector is pointing to the Boot Flash start address after a reset. In this case, the Boot Loader is started after a reset. After the application code is loaded, the program can start executing the application code. Note that the fuses cannot be changed by the MCU itself. This means that once the Boot Reset Fuse is programmed, the Reset Vector will always point to the Boot Loader Reset and the fuse can only be changed through the serial or parallel programming interface. Table 29-2. Boot Lock Bit0 protection modes (application section) (1). BLB0 Mode BLB02 BLB01 Protection 1 11 No restrictions for SPM or (E)LPM accessing the Application section. 2 1 0 SPM is not allowed to write to the Application section. 3 00 SPM is not allowed to write to the Application section, and (E)LPM executing from the Boot Loader section is not allowed to read from the Application section. If Interrupt Vectors are placed in the Boot Loader section, interrupts are disabled while executing from the Application section. 4 01 (E)LPM executing from the Boot Loader section is not allowed to read from the Application section. If Interrupt Vectors are placed in the Boot Loader section, interrupts are disabled while executing from the Application section. Table 29-3. Boot Lock Bit1 protection modes (boot loader section) (1). BLB1 Mode BLB12 BLB11 Protection 1 11 No restrictions for SPM or (E)LPM accessing the Boot Loader section. 2 1 0 SPM is not allowed to write to the Boot Loader section. 3 00 SPM is not allowed to write to the Boot Loader section, and (E)LPM executing from the Application section is not allowed to read from the Boot Loader section. If Interrupt Vectors are placed in the Application section, interrupts are disabled while executing from the Boot Loader section. 4 01 (E)LPM executing from the Application section is not allowed to read from the Boot Loader section. If Interrupt Vectors are placed in the Application section, interrupts are disabled while executing from the Boot Loader section.348 7593L–AVR–09/12 AT90USB64/128 Note: 1. “1” means unprogrammed, “0” means programmed. 29.5.3 External hardware conditions The Hardware Boot Enable Fuse (HWBE) can be programmed (see Table 29-5) so that upon special hardware conditions under reset, the boot loader execution is forced after reset. Note: 1. “1” means unprogrammed, “0” means programmed. When the HWBE fuse is enable the ALE/HWB pin is configured as input during reset and sampled during reset rising edge. When ALE/HWB pin is ‘0’ during reset rising edge, the reset vector will be set as the Boot Loader Reset address and the Boot Loader will be executed (see Figure 29-3). Figure 29-3. Boot process description. Table 29-4. Boot reset fuse (1). BOOTRST Reset address 1 Reset Vector = Application reset (address 0x0000) 0 Reset Vector = Boot loader reset (see Table 29-8 on page 357) Table 29-5. Hardware boot enable fuse (1). HWBE Reset address 1 ALE/HWB pin can not be used to force boot loader execution after reset 0 ALE/HWB pin is used during reset to force boot loader execution after reset HWBE BOOTRST ? Ext. hardware conditions ? Reset vector = Application reset Reset vector = Boot loader reset ? RESET ALE/HWB t SHRH t HHRH349 7593L–AVR–09/12 AT90USB64/128 29.5.4 SPMCSR – Store Program Memory Control and Status Register The Store Program Memory Control and Status Register contains the control bits needed to control the Boot Loader operations. • Bit 7 – SPMIE: SPM Interrupt Enable When the SPMIE bit is written to one, and the I-bit in the Status Register is set (one), the SPM ready interrupt will be enabled. The SPM ready Interrupt will be executed as long as the SPMEN bit in the SPMCSR Register is cleared. • Bit 6 – RWWSB: Read-While-Write Section Busy When a Self-Programming (Page Erase or Page Write) operation to the RWW section is initiated, the RWWSB will be set (one) by hardware. When the RWWSB bit is set, the RWW section cannot be accessed. The RWWSB bit will be cleared if the RWWSRE bit is written to one after a Self-Programming operation is completed. Alternatively the RWWSB bit will automatically be cleared if a page load operation is initiated. • Bit 5 – SIGRD: Signature Row Read If this bit is written to one at the same time as SPMEN, the next LPM instruction within three clock cycles will read a byte from the signature row into the destination register. see “Reading the Signature Row from software” on page 354 for details. An SPM instruction within four cycles after SIGRD and SPMEN are set will have no effect. This operation is reserved for future use and should not be used. • Bit 4 – RWWSRE: Read-While-Write Section Read Enable When programming (Page Erase or Page Write) to the RWW section, the RWW section is blocked for reading (the RWWSB will be set by hardware). To re-enable the RWW section, the user software must wait until the programming is completed (SPMEN will be cleared). Then, if the RWWSRE bit is written to one at the same time as SPMEN, the next SPM instruction within four clock cycles re-enables the RWW section. The RWW section cannot be re-enabled while the Flash is busy with a Page Erase or a Page Write (SPMEN is set). If the RWWSRE bit is written while the Flash is being loaded, the Flash load operation will abort and the data loaded will be lost. • Bit 3 – BLBSET: Boot Lock Bit Set If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock cycles sets Boot Lock bits, according to the data in R0. The data in R1 and the address in the Zpointer are ignored. The BLBSET bit will automatically be cleared upon completion of the Lock bit set, or if no SPM instruction is executed within four clock cycles. An (E)LPM instruction within three cycles after BLBSET and SPMEN are set in the SPMCSR Register, will read either the Lock bits or the Fuse bits (depending on Z0 in the Z-pointer) into the destination register. See “Reading the Fuse and Lock bits from software” on page 353 for details. Bit 7 6 5 4 3 2 1 0 SPMIE RWWSB SIGRD RWWSRE BLBSET PGWRT PGERS SPMEN SPMCSR Read/write R/W R R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0350 7593L–AVR–09/12 AT90USB64/128 • Bit 2 – PGWRT: Page Write If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock cycles executes Page Write, with the data stored in the temporary buffer. The page address is taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGWRT bit will auto-clear upon completion of a Page Write, or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire Page Write operation if the NRWW section is addressed. • Bit 1 – PGERS: Page Erase If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock cycles executes Page Erase. The page address is taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGERS bit will auto-clear upon completion of a Page Erase, or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire Page Write operation if the NRWW section is addressed. • Bit 0 – SPMEN: Store Program Memory Enable This bit enables the SPM instruction for the next four clock cycles. If written to one together with either RWWSRE, BLBSET, PGWRT’ or PGERS, the following SPM instruction will have a special meaning, see description above. If only SPMEN is written, the following SPM instruction will store the value in R1:R0 in the temporary page buffer addressed by the Z-pointer. The LSB of the Z-pointer is ignored. The SPMEN bit will auto-clear upon completion of an SPM instruction, or if no SPM instruction is executed within four clock cycles. During Page Erase and Page Write, the SPMEN bit remains high until the operation is completed. Writing any other combination than “10001”, “01001”, “00101”, “00011” or “00001” in the lower five bits will have no effect. Note: Only one SPM instruction should be active at any time. 29.6 Addressing the flash during self-programming The Z-pointer is used to address the SPM commands. The Z pointer consists of the Z-registers ZL and ZH in the register file, and RAMPZ in the I/O space. The number of bits actually used is implementation dependent. Note that the RAMPZ register is only implemented when the program space is larger than 64kBytes. Since the Flash is organized in pages (see Table 30-11 on page 364), the Program Counter can be treated as having two different sections. One section, consisting of the least significant bits, is addressing the words within a page, while the most significant bits are addressing the pages. This is shown in Figure 29-4 on page 351. Note that the Page Erase and Page Write operations are addressed independently. Therefore it is of major importance that the Boot Loader software addresses the same page in both the Page Erase and Page Write operation. Once a programming operation is initiated, the address is latched and the Z-pointer can be used for other operations. The (E)LPM instruction use the Z-pointer to store the address. Since this instruction addresses the Flash byte-by-byte, also bit Z0 of the Z-pointer is used. Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 RAMPZ RAMPZ7 RAMPZ6 RAMPZ5 RAMPZ4 RAMPZ3 RAMPZ2 RAMPZ1 RAMPZ0 ZH (R31) Z15 Z14 Z13 Z12 Z11 Z10 Z9 Z8 ZL (R30) Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0 76543210351 7593L–AVR–09/12 AT90USB64/128 Figure 29-4. Addressing the flash during SPM (1). Note: 1. The different variables used in Figure 29-4 are listed in Table 29-10 on page 358. 29.7 Self-programming the flash The program memory is updated in a page by page fashion. Before programming a page with the data stored in the temporary page buffer, the page must be erased. The temporary page buffer is filled one word at a time using SPM and the buffer can be filled either before the Page Erase command or between a Page Erase and a Page Write operation: Alternative 1, fill the buffer before a Page Erase • Fill temporary page buffer • Perform a Page Erase • Perform a Page Write Alternative 2, fill the buffer after Page Erase • Perform a Page Erase • Fill temporary page buffer • Perform a Page Write If only a part of the page needs to be changed, the rest of the page must be stored (for example in the temporary page buffer) before the erase, and then be rewritten. When using alternative 1, the Boot Loader provides an effective Read-Modify-Write feature which allows the user software to first read the page, do the necessary changes, and then write back the modified data. If alternative 2 is used, it is not possible to read the old data while loading since the page is already erased. The temporary page buffer can be accessed in a random sequence. It is essential that the page address used in both the Page Erase and Page Write operation is addressing the same PROGRAM MEMORY 23 1 0 Z - POINTER BIT 0 ZPAGEMSB WORD ADDRESS WITHIN A PAGE PAGE ADDRESS WITHIN THE FLASH ZPCMSB INSTRUCTION WORD PAGE PCWORD[PAGEMSB:0]: 00 01 02 PAGEEND PAGE PCPAGE PCWORD PCMSB PAGEMSB PROGRAM COUNTER352 7593L–AVR–09/12 AT90USB64/128 page. See “Simple Assembly Code example for a Boot Loader” on page 355 for an assembly code example. 29.7.1 Performing page erase by SPM To execute Page Erase, set up the address in the Z-pointer, write “X0000011” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored. The page address must be written to PCPAGE in the Z-register. Other bits in the Z-pointer will be ignored during this operation. • Page Erase to the RWW section: The NRWW section can be read during the Page Erase • Page Erase to the NRWW section: The CPU is halted during the operation 29.7.2 Filling the Temporary Buffer (page loading) To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write “00000001” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The content of PCWORD in the Z-register is used to address the data in the temporary buffer. The temporary buffer will auto-erase after a Page Write operation or by writing the RWWSRE bit in SPMCSR. It is also erased after a system reset. Note that it is not possible to write more than one time to each address without erasing the temporary buffer. If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded will be lost. 29.7.3 Performing a Page Write To execute Page Write, set up the address in the Z-pointer, write “X0000101” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored. The page address must be written to PCPAGE. Other bits in the Z-pointer must be written to zero during this operation. • Page Write to the RWW section: The NRWW section can be read during the Page Write • Page Write to the NRWW section: The CPU is halted during the operation 29.7.4 Using the SPM interrupt If the SPM interrupt is enabled, the SPM interrupt will generate a constant interrupt when the SPMEN bit in SPMCSR is cleared. This means that the interrupt can be used instead of polling the SPMCSR Register in software. When using the SPM interrupt, the Interrupt Vectors should be moved to the BLS section to avoid that an interrupt is accessing the RWW section when it is blocked for reading. How to move the interrupts is described in “Interrupts” on page 68. 29.7.5 Consideration while updating BLS Special care must be taken if the user allows the Boot Loader section to be updated by leaving Boot Lock bit11 unprogrammed. An accidental write to the Boot Loader itself can corrupt the entire Boot Loader, and further software updates might be impossible. If it is not necessary to change the Boot Loader software itself, it is recommended to program the Boot Lock bit11 to protect the Boot Loader software from any internal software changes. 29.7.6 Prevent reading the RWW section during self-programming During Self-Programming (either Page Erase or Page Write), the RWW section is always blocked for reading. The user software itself must prevent that this section is addressed during the self programming operation. The RWWSB in the SPMCSR will be set as long as the RWW section is busy. During Self-Programming the Interrupt Vector table should be moved to the BLS353 7593L–AVR–09/12 AT90USB64/128 as described in “Interrupts” on page 68, or the interrupts must be disabled. Before addressing the RWW section after the programming is completed, the user software must clear the RWWSB by writing the RWWSRE. See “Simple Assembly Code example for a Boot Loader” on page 355 for an example. 29.7.7 Setting the Boot Loader Lock bits by SPM To set the Boot Loader Lock bits, write the desired data to R0, write “X0001001” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The only accessible Lock bits are the Boot Lock bits that may prevent the Application and Boot Loader section from any software update by the MCU. See Table 29-2 on page 347 and Table 29-3 on page 347 for how the different settings of the Boot Loader bits affect the Flash access. If bits 5..2 in R0 are cleared (zero), the corresponding Boot Lock bit will be programmed if an SPM instruction is executed within four cycles after BLBSET and SPMEN are set in SPMCSR. The Z-pointer is don’t care during this operation, but for future compatibility it is recommended to load the Z-pointer with 0x0001 (same as used for reading the lOck bits). For future compatibility it is also recommended to set bits 7, 6, 1, and 0 in R0 to “1” when writing the Lock bits. When programming the Lock bits the entire Flash can be read during the operation. 29.7.8 EEPROM Write prevents writing to SPMCSR Note that an EEPROM write operation will block all software programming to Flash. Reading the Fuses and Lock bits from software will also be prevented during the EEPROM write operation. It is recommended that the user checks the status bit (EEPE) in the EECR Register and verifies that the bit is cleared before writing to the SPMCSR Register. 29.7.9 Reading the Fuse and Lock bits from software It is possible to read both the Fuse and Lock bits from software. To read the Lock bits, load the Z-pointer with 0x0001 and set the BLBSET and SPMEN bits in SPMCSR. When an (E)LPM instruction is executed within three CPU cycles after the BLBSET and SPMEN bits are set in SPMCSR, the value of the Lock bits will be loaded in the destination register. The BLBSET and SPMEN bits will auto-clear upon completion of reading the Lock bits or if no (E)LPM instruction is executed within three CPU cycles or no SPM instruction is executed within four CPU cycles. When BLBSET and SPMEN are cleared, (E)LPM will work as described in the Instruction set Manual. The algorithm for reading the Fuse Low byte is similar to the one described above for reading the Lock bits. To read the Fuse Low byte, load the Z-pointer with 0x0000 and set the BLBSET and SPMEN bits in SPMCSR. When an (E)LPM instruction is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the value of the Fuse Low byte (FLB) will be loaded in the destination register as shown below. Refer to Table 30-5 on page 361 for a detailed description and mapping of the Fuse Low byte. Bit 7 6 5 4 3 2 1 0 R0 1 1 BLB12 BLB11 BLB02 BLB01 1 1 Bit 7 6 5 4 3 2 1 0 Rd – – BLB12 BLB11 BLB02 BLB01 LB2 LB1 Bit 7 6 5 4 3 2 1 0 Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0354 7593L–AVR–09/12 AT90USB64/128 Similarly, when reading the Fuse High byte, load 0x0003 in the Z-pointer. When an (E)LPM instruction is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the value of the Fuse High byte (FHB) will be loaded in the destination register as shown below. Refer to Table 30-4 on page 361 for detailed description and mapping of the Fuse High byte. When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an (E)LPM instruction is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the value of the Extended Fuse byte (EFB) will be loaded in the destination register as shown below. Refer to Table 30-3 on page 360 for detailed description and mapping of the Extended Fuse byte. Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are unprogrammed, will be read as one. 29.7.10 Reading the Signature Row from software To read the Signature Row from software, load the Z-pointer with the signature byte address given in Table 29-6 on page 354 and set the SIGRD and SPMEN bits in SPMCSR. When an LPM instruction is executed within three CPU cycles after the SIGRD and SPMEN bits are set in SPMCSR, the signature byte value will be loaded in the destination register. The SIGRD and SPMEN bits will auto-clear upon completion of reading the Signature Row Lock bits or if no LPM instruction is executed within three CPU cycles. When SIGRD and SPMEN are cleared, LPM will work as described in the Instruction set Manual. AT90USB64/128 includes a unique 10-bytes serial number located in the signature row. This unique serial number can be used as a USB serial number in the device enumeration process. The pointer addresses to access this unique serial number are given in Table 29-6 on page 354. Note: All other addresses are reserved for future use. 29.7.11 Preventing flash corruption During periods of low VCC, the Flash program can be corrupted because the supply voltage is too low for the CPU and the Flash to operate properly. These issues are the same as for board level systems using the Flash, and the same design solutions should be applied. A Flash program corruption can be caused by two situations when the voltage is too low. First, a regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly, Bit 7 6 5 4 3 2 1 0 Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0 Bit 7 6 5 4 3 2 1 0 Rd – – – – – EFB2 EFB1 EFB0 Table 29-6. Signature Row addressing. Signature byte Z-pointer address Device Signature Byte 1 0x0000 Device Signature Byte 2 0x0002 Device Signature Byte 3 0x0004 RC Oscillator Calibration Byte 0x0001 Unique Serial Number From 0x000E to 0x0018355 7593L–AVR–09/12 AT90USB64/128 the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions is too low. Flash corruption can easily be avoided by following these design recommendations (one is sufficient): 1. If there is no need for a Boot Loader update in the system, program the Boot Loader Lock bits to prevent any Boot Loader software updates. 2. Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD) if the operating voltage matches the detection level. If not, an external low VCC reset protection circuit can be used. If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient. 3. Keep the AVR core in Power-down sleep mode during periods of low VCC. This will prevent the CPU from attempting to decode and execute instructions, effectively protecting the SPMCSR Register and thus the Flash from unintentional writes. 29.7.12 Programming time for flash when using SPM The calibrated RC Oscillator is used to time Flash accesses. Table 29-7 shows the typical programming time for Flash accesses from the CPU. 29.7.13 Simple Assembly Code example for a Boot Loader ;- the routine writes one page of data from RAM to Flash ; the first data location in RAM is pointed to by the Y-pointer ; the first data location in Flash is pointed to by the Z-pointer ;- error handling is not included ;- the routine must be placed inside the Boot space ; (at least the Do_spm sub routine). Only code inside NRWW section can ; be read during Self-Programming (Page Erase and Page Write). ;- registers used: r0, r1, temp1 (r16), temp2 (r17), looplo (r24), ; loophi (r25), spmcsrval (r20) ; storing and restoring of registers is not included in the routine ; register usage can be optimized at the expense of code size ;- it is assumed that either the interrupt table is moved to the Boot ; loader section or that the interrupts are disabled. .equ PAGESIZEB = PAGESIZE*2 ;PAGESIZEB is page size in BYTES, not words .org SMALLBOOTSTART Write_page: ; Page Erase ldi spmcsrval, (1< 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz High: > 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz 30.8.1 Serial programming algorithm When writing serial data to the Atmel AT90USB64/128, data is clocked on the rising edge of SCK. When reading data from the AT90USB64/128, data is clocked on the falling edge of SCK. See Figure 30-11 on page 375 for timing details. To program and verify the AT90USB64/128 in the serial programming mode, the following sequence is recommended (See four byte instruction formats in Table 30-16 on page 376): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0”. 2. Wait for at least 20ms and enable serial programming by sending the Programming Enable serial instruction to pin PDI. Table 30-14. Pin mapping serial programming. Symbol Pins (TQFP-64) I/O Description PDI PB2 I Serial Data in PDO PB3 O Serial Data out SCK PB1 I Serial Clock VCC GND XTAL1 SCK PDO PDI RESET +1.8 - 5.5V AVCC +1.8 - 5.5V(2)375 7593L–AVR–09/12 AT90USB64/128 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 7 LSB of the address and data together with the Load Program Memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program Memory Page is stored by loading the Write Program Memory Page instruction with the address lines 15..8. Before issuing this command, make sure the instruction Load Extended Address Byte has been used to define the MSB of the address. The extended address byte is stored until the command is re-issued, i.e., the command needs only be issued for the first page, and when crossing the 64KWord boundary. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 30- 15.) Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling is not used, the user must wait at least tWD_EEPROM before issuing the next byte. (See Table 30-15.) In a chip erased device, no 0xFFs in the data file(s) need to be programmed. 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output PDO. When reading the Flash memory, use the instruction Load Extended Address Byte to define the upper address byte, which is not included in the Read Program Memory instruction. The extended address byte is stored until the command is re-issued, that is, the command needs only be issued for the first page, and when crossing the 64KWord boundary. 7. At the end of the programming session, RESET can be set high to commence normal operation. 8. Power-off sequence (if needed): Set RESET to “1”. Turn VCC power off. Figure 30-11. Serial programming waveforms. Table 30-15. Minimum wait delay before writing the next Flash or EEPROM location. Symbol Minimum wait delay tWD_FLASH 4.5ms tWD_EEPROM 9.0ms tWD_ERASE 9.0ms MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUT376 7593L–AVR–09/12 AT90USB64/128 Table 30-16. Serial programming instruction set. Instruction Instruction format Byte 1 Byte 2 Byte 3 Byte 4 Operation Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after RESET goes low. Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash. Load Extended Address Byte 0100 1101 0000 0000 cccc cccc xxxx xxxx Defines Extended Address Byte for Read Program Memory and Write Program Memory Page. Read Program Memory 0010 H000 aaaa aaaa bbbb bbbb oooo oooo Read H (high or low) data o from Program memory at word address c:a:b. Load Program Memory Page 0100 H000 xxxx xxxx xxbb bbbb iiii iiii Write H (high or low) data i to Program Memory page at word address b. Data low byte must be loaded before Data high byte is applied within the same address. Write Program Memory Page 0100 1100 aaaa aaaa bbxx xxxx xxxx xxxx Write Program Memory Page at address c:a:b. Read EEPROM Memory 1010 0000 0000 aaaa bbbb bbbb oooo oooo Read data o from EEPROM memory at address a:b. Write EEPROM Memory 1100 0000 0000 aaaa bbbb bbbb iiii iiii Write data i to EEPROM memory at address a:b. Load EEPROM Memory Page (page access) 1100 0001 0000 0000 0000 00bb iiii iiii Load data i to EEPROM memory page buffer. After data is loaded, program EEPROM page. Write EEPROM Memory Page (page access) 1100 0010 0000 aaaa bbbb bb00 xxxx xxxx Write EEPROM page at address a:b. Read Lock bits 0101 1000 0000 0000 xxxx xxxx xxoo oooo Read Lock bits. “0” = programmed, “1” = unprogrammed. See Table 30-1 on page 359 for details. Write Lock bits 1010 1100 111x xxxx xxxx xxxx 11ii iiii Write Lock bits. Set bits = “0” to program Lock bits. See Table 30-1 on page 359 for details. Read Signature Byte 0011 0000 000x xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b. Write Fuse bits 1010 1100 1010 0000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. Write Fuse High bits 1010 1100 1010 1000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. Write Extended Fuse Bits 1010 1100 1010 0100 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to unprogram. See Table 30-3 on page 360 for details. Read Fuse bits 0101 0000 0000 0000 xxxx xxxx oooo oooo Read Fuse bits. “0” = programmed, “1” = unprogrammed. Read Fuse High bits 0101 1000 0000 1000 xxxx xxxx oooo oooo Read Fuse High bits. “0” = programmed, “1” = unprogrammed. 377 7593L–AVR–09/12 AT90USB64/128 Note: a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care. 30.8.2 Serial programming characteristics For characteristics of the Serial Programming module see “SPI timing characteristics” on page 395. 30.9 Programming via the JTAG interface Programming through the JTAG interface requires control of the four JTAG specific pins: TCK, TMS, TDI, and TDO. Control of the reset and clock pins is not required. To be able to use the JTAG interface, the JTAGEN Fuse must be programmed. The device is default shipped with the fuse programmed. In addition, the JTD bit in MCUCR must be cleared. Alternatively, if the JTD bit is set, the external reset can be forced low. Then, the JTD bit will be cleared after two chip clocks, and the JTAG pins are available for programming. This provides a means of using the JTAG pins as normal port pins in Running mode while still allowing In-System Programming via the JTAG interface. Note that this technique can not be used when using the JTAG pins for Boundary-scan or On-chip Debug. In these cases the JTAG pins must be dedicated for this purpose. During programming the clock frequency of the TCK Input must be less than the maximum frequency of the chip. The System Clock Prescaler can not be used to divide the TCK Clock Input into a sufficiently low frequency. As a definition in this datasheet, the LSB is shifted in and out first of all Shift Registers. 30.9.1 Programming specific JTAG instructions The Instruction Register is 4-bit wide, supporting up to 16 instructions. The JTAG instructions useful for programming are listed below. The OPCODE for each instruction is shown behind the instruction name in hex format. The text describes which Data Register is selected as path between TDI and TDO for each instruction. The Run-Test/Idle state of the TAP controller is used to generate internal clocks. It can also be used as an idle state between JTAG sequences. The state machine sequence for changing the instruction word is shown in Figure 30-12 on page 378. Read Extended Fuse Bits 0101 0000 0000 1000 xxxx xxxx oooo oooo Read Extended Fuse bits. “0” = programmed, “1” = unprogrammed. See Table 30-3 on page 360 for details. Read Calibration Byte 0011 1000 000x xxxx 0000 0000 oooo oooo Read Calibration Byte Poll RDY/BSY 1111 0000 0000 0000 xxxx xxxx xxxx xxxo If o = “1”, a programming operation is still busy. Wait until this bit returns to “0” before applying another command. Table 30-16. Serial programming instruction set. (Continued) Instruction Instruction format Byte 1 Byte 2 Byte 3 Byte 4 Operation378 7593L–AVR–09/12 AT90USB64/128 Figure 30-12. State machine sequence for changing the instruction word. 30.9.2 AVR_RESET (0xC) The AVR specific public JTAG instruction for setting the AVR device in the Reset mode or taking the device out from the Reset mode. The TAP controller is not reset by this instruction. The one bit Reset Register is selected as Data Register. Note that the reset will be active as long as there is a logic “one” in the Reset Chain. The output from this chain is not latched. The active states are: • Shift-DR: The Reset Register is shifted by the TCK input 30.9.3 PROG_ENABLE (0x4) The AVR specific public JTAG instruction for enabling programming via the JTAG port. The 16- bit Programming Enable Register is selected as Data Register. The active states are the following: • Shift-DR: The programming enable signature is shifted into the Data Register • Update-DR: The programming enable signature is compared to the correct value, and Programming mode is entered if the signature is valid Test-logic-reset Run-test/idle Shift-DR Exit1-DR Pause-DR Exit2-DR Update-DR Select-IR scan Capture-IR Shift-IR Exit1-IR Pause-IR Exit2-IR Update-IR Select-DR scan Capture-DR 0 1 0 11 1 0 0 0 0 1 1 1 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 0 0 1 1379 7593L–AVR–09/12 AT90USB64/128 30.9.4 PROG_COMMANDS (0x5) The AVR specific public JTAG instruction for entering programming commands via the JTAG port. The 15-bit Programming Command Register is selected as Data Register. The active states are the following: • Capture-DR: The result of the previous command is loaded into the Data Register • Shift-DR: The Data Register is shifted by the TCK input, shifting out the result of the previous command and shifting in the new command • Update-DR: The programming command is applied to the Flash inputs • Run-Test/Idle: One clock cycle is generated, executing the applied command 30.9.5 PROG_PAGELOAD (0x6) The AVR specific public JTAG instruction to directly load the Flash data page via the JTAG port. An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the eight LSBs of the Programming Command Register. The active states are the following: • Shift-DR: The Flash Data Byte Register is shifted by the TCK input • Update-DR: The content of the Flash Data Byte Register is copied into a temporary register. A write sequence is initiated that within 11 TCK cycles loads the content of the temporary register into the Flash page buffer. The AVR automatically alternates between writing the low and the high byte for each new Update-DR state, starting with the low byte for the first Update-DR encountered after entering the PROG_PAGELOAD command. The Program Counter is pre-incriminated before writing the low byte, except for the first written byte. This ensures that the first data is written to the address set up by PROG_COMMANDS, and loading the last location in the page buffer does not make the program counter increment into the next page 30.9.6 PROG_PAGEREAD (0x7) The AVR specific public JTAG instruction to directly capture the Flash content via the JTAG port. An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBs of the Programming Command Register. The active states are the following: • Capture-DR: The content of the selected Flash byte is captured into the Flash Data Byte Register. The AVR automatically alternates between reading the low and the high byte for each new Capture-DR state, starting with the low byte for the first Capture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter is post-incremented after reading each high byte, including the first read byte. This ensures that the first data is captured from the first address set up by PROG_COMMANDS, and reading the last location in the page makes the program counter increment into the next page • Shift-DR: The Flash Data Byte Register is shifted by the TCK input 30.9.7 Data Registers The Data Registers are selected by the JTAG instruction registers described in section “Programming specific JTAG instructions” on page 377. The Data Registers relevant for programming operations are: • Reset Register • Programming Enable Register • Programming Command Register • Flash Data Byte Register380 7593L–AVR–09/12 AT90USB64/128 30.9.8 Reset Register The Reset Register is a Test Data Register used to reset the part during programming. It is required to reset the part before entering Programming mode. A high value in the Reset Register corresponds to pulling the external reset low. The part is reset as long as there is a high value present in the Reset Register. Depending on the Fuse settings for the clock options, the part will remain reset for a Reset Time-out period (refer to “Clock sources” on page 41) after releasing the Reset Register. The output from this Data Register is not latched, so the reset will take place immediately, as shown in Figure 9-1 on page 58. 30.9.9 Programming Enable Register The Programming Enable Register is a 16-bit register. The contents of this register is compared to the programming enable signature, binary code 0b1010_0011_0111_0000. When the contents of the register is equal to the programming enable signature, programming via the JTAG port is enabled. The register is reset to 0 on Power-on Reset, and should always be reset when leaving Programming mode. Figure 30-13. Programming enable register. 30.9.10 Programming Command Register The Programming Command Register is a 15-bit register. This register is used to serially shift in programming commands, and to serially shift out the result of the previous command, if any. The JTAG Programming Instruction Set is shown in Table 30-17 on page 382. The state sequence when shifting in the programming commands is illustrated in Figure 30-15 on page 385. TDI TDO D A T A = D Q ClockDR & PROG_ENABLE Programming enable 0xA370381 7593L–AVR–09/12 AT90USB64/128 Figure 30-14. Programming Command register. TDI TDO S T R O B E S A D D R E S S / D A T A Flash EEPROM fuses lock bits382 7593L–AVR–09/12 AT90USB64/128 Table 30-17. JTAG programming instruction set. a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care. Instruction TDI sequence TDO sequence Notes 1a. Chip Erase 0100011_10000000 0110001_10000000 0110011_10000000 0110011_10000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx 1b. Poll for Chip Erase Complete 0110011_10000000 xxxxxox_xxxxxxxx (2) 2a. Enter Flash Write 0100011_00010000 xxxxxxx_xxxxxxxx 2b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10) 2c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx 2d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 2e. Load Data Low Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx 2f. Load Data High Byte 0010111_iiiiiiii xxxxxxx_xxxxxxxx 2g. Latch Data 0110111_00000000 1110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 2h. Write Flash Page 0110111_00000000 0110101_00000000 0110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 2i. Poll for Page Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2) 3a. Enter Flash Read 0100011_00000010 xxxxxxx_xxxxxxxx 3b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10) 3c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx 3d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 3e. Read Data Low and High Byte 0110010_00000000 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo xxxxxxx_oooooooo Low byte High byte 4a. Enter EEPROM Write 0100011_00010001 xxxxxxx_xxxxxxxx 4b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10) 4c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 4d. Load Data Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx 4e. Latch Data 0110111_00000000 1110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 4f. Write EEPROM Page 0110011_00000000 0110001_00000000 0110011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1)383 7593L–AVR–09/12 AT90USB64/128 4g. Poll for Page Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2) 5a. Enter EEPROM Read 0100011_00000011 xxxxxxx_xxxxxxxx 5b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10) 5c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 5d. Read Data Byte 0110011_bbbbbbbb 0110010_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 6a. Enter Fuse Write 0100011_01000000 xxxxxxx_xxxxxxxx 6b. Load Data Low Byte (6) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3) 6c. Write Fuse Extended Byte 0111011_00000000 0111001_00000000 0111011_00000000 0111011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 6d. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2) 6e. Load Data Low Byte (7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3) 6f. Write Fuse High Byte 0110111_00000000 0110101_00000000 0110111_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 6g. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2) 6h. Load Data Low Byte (7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3) 6i. Write Fuse Low Byte 0110011_00000000 0110001_00000000 0110011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 6j. Poll for Fuse Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2) 7a. Enter Lock Bit Write 0100011_00100000 xxxxxxx_xxxxxxxx 7b. Load Data Byte (9) 0010011_11iiiiii xxxxxxx_xxxxxxxx (4) 7c. Write Lock Bits 0110011_00000000 0110001_00000000 0110011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx (1) 7d. Poll for Lock Bit Write complete 0110011_00000000 xxxxxox_xxxxxxxx (2) 8a. Enter Fuse/Lock Bit Read 0100011_00000100 xxxxxxx_xxxxxxxx 8b. Read Extended Fuse Byte (6) 0111010_00000000 0111011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 8c. Read Fuse High Byte (7) 0111110_00000000 0111111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo Table 30-17. JTAG programming instruction set. (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care. Instruction TDI sequence TDO sequence Notes384 7593L–AVR–09/12 AT90USB64/128 Notes: 1. This command sequence is not required if the seven MSB are correctly set by the previous command sequence (which is normally the case). 2. Repeat until o = “1”. 3. Set bits to “0” to program the corresponding Fuse, “1” to un-program the Fuse. 4. Set bits to “0” to program the corresponding Lock bit, “1” to leave the Lock bit unchanged. 5. “0” = programmed, “1” = un-programmed. 6. The bit mapping for Fuses Extended byte is listed in Table 30-3 on page 360. 7. The bit mapping for Fuses High byte is listed in Table 30-4 on page 361. 8. The bit mapping for Fuses Low byte is listed in Table 30-5 on page 361. 9. The bit mapping for Lock bits byte is listed in Table 30-1 on page 359. 10. Address bits exceeding PCMSB and EEAMSB (Table 30-11 on page 364 and Table 30-12 on page 365) are don’t care. 11. All TDI and TDO sequences are represented by binary digits (0b...). 8d. Read Fuse Low Byte (8) 0110010_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 8e. Read Lock Bits (9) 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxoooooo (5) 8f. Read Fuses and Lock Bits 0111010_00000000 0111110_00000000 0110010_00000000 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo xxxxxxx_oooooooo xxxxxxx_oooooooo xxxxxxx_oooooooo (5) Fuse Ext. byte Fuse High byte Fuse Low byte Lock bits 9a. Enter Signature Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx 9b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 9c. Read Signature Byte 0110010_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 10a. Enter Calibration Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx 10b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx 10c. Read Calibration Byte 0110110_00000000 0110111_00000000 xxxxxxx_xxxxxxxx xxxxxxx_oooooooo 11a. Load No Operation Command 0100011_00000000 0110011_00000000 xxxxxxx_xxxxxxxx xxxxxxx_xxxxxxxx Table 30-17. JTAG programming instruction set. (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care. Instruction TDI sequence TDO sequence Notes385 7593L–AVR–09/12 AT90USB64/128 Figure 30-15. State machine sequence for changing/reading the data word. 30.9.11 Flash Data Byte Register The Flash Data Byte Register provides an efficient way to load the entire Flash page buffer before executing Page Write, or to read out/verify the content of the Flash. A state machine sets up the control signals to the Flash and senses the strobe signals from the Flash, thus only the data words need to be shifted in/out. The Flash Data Byte Register actually consists of the 8-bit scan chain and a 8-bit temporary register. During page load, the Update-DR state copies the content of the scan chain over to the temporary register and initiates a write sequence that within 11 TCK cycles loads the content of the temporary register into the Flash page buffer. The AVR automatically alternates between writing the low and the high byte for each new Update-DR state, starting with the low byte for the first Update-DR encountered after entering the PROG_PAGELOAD command. The Program Counter is pre-incremented before writing the low byte, except for the first written byte. This ensures that the first data is written to the address set up by PROG_COMMANDS, and loading the last location in the page buffer does not make the Program Counter increment into the next page. During Page Read, the content of the selected Flash byte is captured into the Flash Data Byte Register during the Capture-DR state. The AVR automatically alternates between reading the low and the high byte for each new Capture-DR state, starting with the low byte for the first CapTest-logic-reset Run-test/idle Shift-DR Exit1-DR Pause-DR Exit2-DR Update-DR Select-IR scan Capture-IR Shift-IR Exit1-IR Pause-IR Exit2-IR Update-IR Select-DR scan Capture-DR 0 1 0 11 1 0 0 0 0 1 1 1 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 0 0 1 1386 7593L–AVR–09/12 AT90USB64/128 ture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter is post-incremented after reading each high byte, including the first read byte. This ensures that the first data is captured from the first address set up by PROG_COMMANDS, and reading the last location in the page makes the program counter increment into the next page. Figure 30-16. Flash Data Byte Register. The state machine controlling the Flash Data Byte Register is clocked by TCK. During normal operation in which eight bits are shifted for each Flash byte, the clock cycles needed to navigate through the TAP controller automatically feeds the state machine for the Flash Data Byte Register with sufficient number of clock pulses to complete its operation transparently for the user. However, if too few bits are shifted between each Update-DR state during page load, the TAP controller should stay in the Run-Test/Idle state for some TCK cycles to ensure that there are at least 11 TCK cycles between each Update-DR state. 30.9.12 Programming algorithm All references below of type “1a”, “1b”, and so on, refer to Table 30-17 on page 382. 30.9.13 Entering Programming mode 1. Enter JTAG instruction AVR_RESET and shift 1 in the Reset Register. 2. Enter instruction PROG_ENABLE and shift 0b1010_0011_0111_0000 in the Programming Enable Register. 30.9.14 Leaving Programming mode 1. Enter JTAG instruction PROG_COMMANDS. 2. Disable all programming instructions by using no operation instruction 11a. 3. Enter instruction PROG_ENABLE and shift 0b0000_0000_0000_0000 in the programming Enable Register. 4. Enter JTAG instruction AVR_RESET and shift 0 in the Reset Register. TDI TDO D A T A Flash EEPROM fuses lock bits STROBES ADDRESS State machine387 7593L–AVR–09/12 AT90USB64/128 30.9.15 Performing Chip Erase 1. Enter JTAG instruction PROG_COMMANDS. 2. Start Chip Erase using programming instruction 1a. 3. Poll for Chip Erase complete using programming instruction 1b, or wait for tWLRH_CE (refer to Table 30-13 on page 373). 30.9.16 Programming the Flash Before programming the Flash a Chip Erase must be performed, see “Performing Chip Erase” on page 387. 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash write using programming instruction 2a. 3. Load address Extended High byte using programming instruction 2b. 4. Load address High byte using programming instruction 2c. 5. Load address Low byte using programming instruction 2d. 6. Load data using programming instructions 2e, 2f and 2g. 7. Repeat steps 5 and 6 for all instruction words in the page. 8. Write the page using programming instruction 2h. 9. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH (refer to Table 30-13 on page 373). 10. Repeat steps 3 to 9 until all data have been programmed. A more efficient data transfer can be achieved using the PROG_PAGELOAD instruction: 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash write using programming instruction 2a. 3. Load the page address using programming instructions 2b, 2c and 2d. PCWORD (refer to Table 30-11 on page 364) is used to address within one page and must be written as 0. 4. Enter JTAG instruction PROG_PAGELOAD. 5. Load the entire page by shifting in all instruction words in the page byte-by-byte, starting with the LSB of the first instruction in the page and ending with the MSB of the last instruction in the page. Use Update-DR to copy the contents of the Flash Data Byte Register into the Flash page location and to auto-increment the Program Counter before each new word. 6. Enter JTAG instruction PROG_COMMANDS. 7. Write the page using programming instruction 2h. 8. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH (refer to Table 30-13 on page 373). 9. Repeat steps 3 to 8 until all data have been programmed. 30.9.17 Reading the Flash 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash read using programming instruction 3a. 3. Load address using programming instructions 3b, 3c and 3d. 4. Read data using programming instruction 3e. 5. Repeat steps 3 and 4 until all data have been read. A more efficient data transfer can be achieved using the PROG_PAGEREAD instruction:388 7593L–AVR–09/12 AT90USB64/128 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Flash read using programming instruction 3a. 3. Load the page address using programming instructions 3b, 3c and 3d. PCWORD (refer to Table 30-11 on page 364) is used to address within one page and must be written as 0. 4. Enter JTAG instruction PROG_PAGEREAD. 5. Read the entire page (or Flash) by shifting out all instruction words in the page (or Flash), starting with the LSB of the first instruction in the page (Flash) and ending with the MSB of the last instruction in the page (Flash). The Capture-DR state both captures the data from the Flash, and also auto-increments the program counter after each word is read. Note that Capture-DR comes before the shift-DR state. Hence, the first byte which is shifted out contains valid data. 6. Enter JTAG instruction PROG_COMMANDS. 7. Repeat steps 3 to 6 until all data have been read. 30.9.18 Programming the EEPROM Before programming the EEPROM a Chip Erase must be performed, see “Performing Chip Erase” on page 387. 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable EEPROM write using programming instruction 4a. 3. Load address High byte using programming instruction 4b. 4. Load address Low byte using programming instruction 4c. 5. Load data using programming instructions 4d and 4e. 6. Repeat steps 4 and 5 for all data bytes in the page. 7. Write the data using programming instruction 4f. 8. Poll for EEPROM write complete using programming instruction 4g, or wait for tWLRH (refer to Table 30-13 on page 373). 9. Repeat steps 3 to 8 until all data have been programmed. Note that the PROG_PAGELOAD instruction can not be used when programming the EEPROM. 30.9.19 Reading the EEPROM 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable EEPROM read using programming instruction 5a. 3. Load address using programming instructions 5b and 5c. 4. Read data using programming instruction 5d. 5. Repeat steps 3 and 4 until all data have been read. Note that the PROG_PAGEREAD instruction can not be used when reading the EEPROM. 30.9.20 Programming the Fuses 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Fuse write using programming instruction 6a. 3. Load data high byte using programming instructions 6b. A bit value of “0” will program the corresponding fuse, a “1” will un-program the fuse. 4. Write Fuse High byte using programming instruction 6c. 5. Poll for Fuse write complete using programming instruction 6d, or wait for tWLRH (refer to Table 30-13 on page 373).389 7593L–AVR–09/12 AT90USB64/128 6. Load data low byte using programming instructions 6e. A “0” will program the fuse, a “1” will unprogram the fuse. 7. Write Fuse low byte using programming instruction 6f. 8. Poll for Fuse write complete using programming instruction 6g, or wait for tWLRH (refer to Table 30-13 on page 373). 30.9.21 Programming the Lock Bits 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Lock bit write using programming instruction 7a. 3. Load data using programming instructions 7b. A bit value of “0” will program the corresponding lock bit, a “1” will leave the lock bit unchanged. 4. Write Lock bits using programming instruction 7c. 5. Poll for Lock bit write complete using programming instruction 7d, or wait for tWLRH (refer to Table 30-13 on page 373). 30.9.22 Reading the Fuses and Lock Bits 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Fuse/Lock bit read using programming instruction 8a. 3. To read all Fuses and Lock bits, use programming instruction 8e. To only read Fuse High byte, use programming instruction 8b. To only read Fuse Low byte, use programming instruction 8c. To only read Lock bits, use programming instruction 8d. 30.9.23 Reading the Signature Bytes 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Signature byte read using programming instruction 9a. 3. Load address 0x00 using programming instruction 9b. 4. Read first signature byte using programming instruction 9c. 5. Repeat steps 3 and 4 with address 0x01 and address 0x02 to read the second and third signature bytes, respectively. 30.9.24 Reading the Calibration Byte 1. Enter JTAG instruction PROG_COMMANDS. 2. Enable Calibration byte read using programming instruction 10a. 3. Load address 0x00 using programming instruction 10b. 4. Read the calibration byte using programming instruction 10c.390 7593L–AVR–09/12 AT90USB64/128 31. Electrical characteristics for Atmel AT90USB64/128 31.1 Absolute maximum ratings* 31.2 DC characteristics Operating temperature..................................... -40°C to +85°C *NOTICE: Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage temperature...................................... -65°C to +150°C Voltage on any pin except RESET and VBUS with respect to ground (7) .............................-0.5V to VCC+0.5V Voltage on RESET with respect to ground ......-0.5V to +13.0V Voltage on VBUS with respect to ground...........-0.5V to +6.0V Maximum operating voltage............................................ +6.0V DC current per I/O pin.................................................. 40.0mA DC current VCC and GND pins .................................. 200.0mA TA = -40°C to 85°C, VCC = 2.7V to 5.5V (unless otherwise noted). Symbol Parameter Condition Min. (5) Typ. Max. (5) Units VIL Input Low Voltage,Except XTAL1 and Reset pin VCC = 2.7V - 5.5V -0.5 0.2VCC (1) V VIL1 Input Low Voltage, XTAL1 pin VCC = 2.7V - 5.5V -0.5 0.1VCC (1) VIL2 Input Low Voltage, RESET pin VCC = 2.7V - 5.5V -0.5 0.1VCC (1) VIH Input High Voltage, Except XTAL1 and RESET pins VCC = 2.7V - 5.5V 0.6VCC (2) VCC + 0.5 VIH1 Input High Voltage, XTAL1 pin VCC = 2.7V - 5.5V 0.7VCC (2) VCC + 0.5 VIH2 Input High Voltage, RESET pin VCC = 2.7V - 5.5V 0.9VCC (2) VCC + 0.5 VOL Output Low Voltage (3) IOL = 10mA, VCC = 5V IOL = 5mA, VCC = 3V 0.3 0.2 0.7 0.5 VOH Output High Voltage (4) IOH = -20mA, VCC = 5V IOH = -10mA, VCC = 3V 4.2 2.3 4.5 2.6 IIL Input Leakage Current I/O Pin VCC = 5.5V, pin low (absolute value) 1 µA IIH Input Leakage Current I/O Pin VCC = 5.5V, pin high (absolute value) 1 RRST Reset Pull-up Resistor 30 60 kΩ RPU I/O Pin Pull-up Resistor 20 50391 7593L–AVR–09/12 AT90USB64/128 Note: 1. "Max" means the highest value where the pin is guaranteed to be read as low 2. "Min" means the lowest value where the pin is guaranteed to be read as high 3. Although each I/O port can sink more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: Atmel AT90USB64/128: 1.)The sum of all IOL, for ports A0-A7, G2, C4-C7 should not exceed 100mA. 2.)The sum of all IOL, for ports C0-C3, G0-G1, D0-D7 should not exceed 100mA. 3.)The sum of all IOL, for ports G3-G5, B0-B7, E0-E7 should not exceed 100mA. 4.)The sum of all IOL, for ports F0-F7 should not exceed 100mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: AT90USB64/128: 1)The sum of all IOH, for ports A0-A7, G2, C4-C7 should not exceed 100mA. 2)The sum of all IOH, for ports C0-C3, G0-G1, D0-D7 should not exceed 100mA. 3)The sum of all IOH, for ports G3-G5, B0-B7, E0-E7 should not exceed 100mA. 4)The sum of all IOH, for ports F0-F7 should not exceed 100mA. 5. All DC Characteristics contained in this datasheet are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are preliminary values representing design targets, and will be updated after characterization of actual silicon 6. Values with “PRR1 – Power Reduction Register 1” disabled (0x00). ICC Power Supply Current (6) Active 4MHz, VCC = 3V (AT90USB64/128) 2.5 5 mA Active 8MHz, VCC = 3V (AT90USB64/128) 5 10 Active 8MHz, VCC = 5V (AT90USB64/128) 10 18 Active 16MHz, VCC = 5V (AT90USB64/128) 19 30 Icc Power-down mode WDT enabled, BOD enabled, VCC = 3V, 25°C 30 µA WDT enabled, BOD disabled, VCC = 3V, 25°C 10 WDT disabled, BOD disabled, VCC = 3V, 25°C 2 VACIO Analog Comparator Input Offset Voltage VCC = 5V Vin = VCC/2 10 40 mV IACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nA tACID Analog Comparator Propagation Delay VCC = 2.7V VCC = 4.0V 750 500 ns Iq USB Regulator Quiescent Current UVCC >3.6V, I = 0mA 10 30 µA Vusb USB Regulator Output Voltage (Ucap) UVCC >3.6V, I = 40mA (8) 3.0 3.3 3.5 V TA = -40°C to 85°C, VCC = 2.7V to 5.5V (unless otherwise noted). (Continued) Symbol Parameter Condition Min. (5) Typ. Max. (5) Units392 7593L–AVR–09/12 AT90USB64/128 7. As specified on the USB Electrical chapter of USB Specifications 2.0, the D+/D- pads can withstand voltages down to -1V applied through a 39Ω resistor 8. USB Peripheral consumes up to 50mA from the regulator or UVCC pin when USB is used at full-load 31.3 External clock drive waveforms Figure 31-1. External clock drive waveforms. 31.4 External clock drive Note: All DC characteristics contained in this datasheet are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are preliminary values representing design targets, and will be updated after characterization of actual silicon. 31.5 Maximum speed vs. VCC Maximum frequency is depending on VCC. As shown in Figure 31-2 on page 393, the maximum frequency vs. VCC curve is linear between 2.7V < VCC < 5.5V. VIL1 VIH1 Table 31-1. External clock drive. Symbol Parameter VCC=1.8-5.5V VCC=2.7-5.5V VCC=4.5-5.5V Min. Max. Min. Max. Min. Max. Units 1/tCLCL Oscillator Frequency 0 2 0 8 0 16 MHz tCLCL Clock Period 500 125 62.5 tCHCX High Time 200 50 25 ns t CLCX Low Time 200 50 25 tCLCH Rise Time 2.0 1.6 0.5 μs tCHCL Fall Time 2.0 1.6 0.5 ΔtCLCL Change in period from one clock cycle to the next 2 2 2%393 7593L–AVR–09/12 AT90USB64/128 Figure 31-2. Maximum frequency vs. VCC, Atmel AT90USB64/128. 31.6 2-wire serial interface characteristics Table 31-2 describes the requirements for devices connected to the 2-wire Serial Bus. The AT90USB64/128 2-wire Serial Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 31-3 on page 394. 16MHz 8MHz Table 31-2. 2-wire serial bus requirements. Symbol Parameter Condition Min Max Units VIL Input Low-voltage -0.5 0.3 VCC V VIH Input High-voltage 0.7 VCC VCC + 0.5 Vhys (1) Hysteresis of Schmitt Trigger Inputs 0.05 VCC (2) – VOL (1) Output Low-voltage 3mA sink current 0 0.4 tr (1) Rise Time for both SDA and SCL 20 + 0.1Cb (3)(2) 300 tof ns (1) Output Fall Time from VIHmin to VILmax 10pF < Cb < 400pF (3) 20 + 0.1Cb (3)(2) 250 tSP (1) Spikes Suppressed by Input Filter 0 50 (2) Ii Input Current each I/O Pin 0.1VCC < Vi < 0.9VCC -10 10 µA Ci (1) Capacitance for each I/O Pin – 10 pF fSCL SCL Clock Frequency fCK (4) > max(16fSCL, 250kHz) (5) 0 400 kHz Rp Value of Pull-up resistor fSCL ≤ 100kHz fSCL > 100kHz VCC – 0.4V 3mA ---------------------------- 1000ns Cb ------------------- Ω VCC – 0.4V 3mA ---------------------------- 300ns Cb ----------------394 7593L–AVR–09/12 AT90USB64/128 Notes: 1. In Atmel AT90USB64/128, this parameter is characterized and not 100% tested. 2. Required only for fSCL >100kHz. 3. Cb = capacitance of one bus line in pF. 4. fCK = CPU clock frequency 5. This requirement applies to all AT90USB64/128 2-wire Serial Interface operation. Other devices connected to the 2-wire Serial Bus need only obey the general fSCL requirement. 6. The actual low period generated by the AT90USB64/128 2-wire Serial Interface is (1/fSCL - 2/fCK), thus fCK must be greater than 6MHz for the low time requirement to be strictly met at fSCL = 100kHz. 7. The actual low period generated by the AT90USB64/128 2-wire Serial Interface is (1/fSCL - 2/fCK), thus the low time requirement will not be strictly met for fSCL > 308kHz when fCK = 8MHz. Still, AT90USB64/128 devices connected to the bus may communicate at full speed (400kHz) with other AT90USB64/128 devices, as well as any other device with a proper tLOW acceptance margin. Figure 31-3. 2-wire serial bus timing. tHD;STA Hold Time (repeated) START Condition fSCL ≤ 100kHz 4.0 – µs fSCL > 100kHz 0.6 – tLOW Low Period of the SCL Clock fSCL ≤ 100kHz (6) 4.7 – fSCL > 100kHz (7) 1.3 – tHIGH High period of the SCL clock fSCL ≤ 100kHz 4.0 – fSCL > 100kHz 0.6 – tSU;STA Set-up time for a repeated START condition fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 0.6 – tHD;DAT Data hold time fSCL ≤ 100kHz 0 3.45 fSCL > 100kHz 0 0.9 tSU;DAT Data setup time fSCL ≤ 100kHz 250 – ns fSCL > 100kHz 100 – tSU;STO Setup time for STOP condition fSCL ≤ 100kHz 4.0 – µs fSCL > 100kHz 0.6 – tBUF Bus free time between a STOP and START condition fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 1.3 – Table 31-2. 2-wire serial bus requirements. (Continued) Symbol Parameter Condition Min Max Units t SU;STA t LOW t HIGH t LOW t of t HD;STA t HD;DAT t SU;DAT t SU;STO t BUF SCL SDA t r395 7593L–AVR–09/12 AT90USB64/128 31.7 SPI timing characteristics See Figure 31-4 and Figure 31-5 on page 396 for details. Note: 1. In SPI Programming mode the minimum SCK high/low period is: - 2 tCLCL for fCK <12MHz - 3 tCLCL for fCK >12MHz Figure 31-4. SPI interface timing requirements (master mode). Table 31-3. SPI timing parameters. Description Mode Min. Typ. Max. 1 SCK period Master See Table 18-4 on page 174 ns 2 SCK high/low Master 50% duty cycle 3 Rise/Fall time Master 3.6 4 Setup Master 10 5 Hold Master 10 6 Out to SCK Master 0.5 × tsck 7 SCK to out Master 10 8 SCK to out high Master 10 9 SS low to out Slave 15 10 SCK period Slave 4 × tck 11 SCK high/low (1) Slave 2 × tck 12 Rise/Fall time Slave 1.6 µs 13 Setup Slave 10 ns 14 Hold Slave tck 15 SCK to out Slave 15 16 SCK to SS high Slave 20 17 SS high to tri-state Slave 10 18 SS low to SCK Slave 20 MOSI (Data output) SCK (CPOL = 1) MISO (Data input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 6 1 2 2 4 5 3 7 8396 7593L–AVR–09/12 AT90USB64/128 Figure 31-5. SPI interface timing requirements (slave mode). 31.8 Hardware boot entrance timing characteristics Figure 31-6. Hardware boot timing requirements. MISO (Data output) SCK (CPOL = 1) MOSI (Data input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 10 11 11 13 14 12 15 17 9 X 16 Table 31-4. Hardware boot timings. Symbol Parameter Min. Max. tSHRH HWB low Setup before Reset High 0 tHHRH HWB low Hold after Reset High StartUpTime (SUT) + Time Out Delay (TOUT) RESET ALE/HWB t SHRH t HHRH397 7593L–AVR–09/12 AT90USB64/128 31.9 ADC characteristics Table 31-5. ADC characteristics. Symbol Parameter Condition Min. Typ. Max. Units Resolution Single Ended Conversion 10 Bits Differential Conversion Gain = 1× or 10× 8 Differential Conversion Gain = 200× 7 Absolute accuracy (Including INL, DNL, quantization error, gain and offset error) Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 200kHz 1.5 LSB Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 1MHz Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 200kHz Noise Reduction Mode 1.5 Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 1MHz Noise Reduction Mode Absolute accuracy Gain = 1×, 10×, 200× VREF = 4V, VCC = 5V ADC Clock = 50 - 200kHz 1 Integral Non-Linearity (INL) Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 200kHz 0.5 1 Integral Non-Linearity (INL) (Accuracy after calibration for offset and gain error) Gain = 1×, 10×, 200× VREF = 4V, VCC = 5V ADC Clock = 50 - 200kHz 0.5 1 Differential Non-Linearity (DNL) Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 200kHz 0.3 1 Gain Error Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 200kHz -2 0 +2 Gain = 1×, 10×, 200× -2 0 +2 Offset Error Single Ended Conversion VREF = 4V, VCC = 4V, ADC clock = 200kHz -2 1 +2 Gain = 1×, 10×, 200× VREF = 4V, VCC = 5V ADC Clock = 50 - 200kHz -1 0 +1 Conversion Time Free Running Conversion 65 260 µs Clock Frequency Single Ended Conversion 50 1000 kHz398 7593L–AVR–09/12 AT90USB64/128 AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V VREF Reference Voltage Single Ended Conversion 2.0 AVCC Differential Conversion 2.0 AVCC - 0.5 VIN Input Voltage Single ended channels 0 VREF Differential Conversion 0 AVCC Input Bandwidth Single Ended Channels 38,5 kHz Differential Channels 4 VINT1 Internal Voltage Reference 1.1V 1.0 1.1 1.2 V VINT2 Internal Voltage Reference 2.56V 2.4 2.56 2.8 RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ Table 31-5. ADC characteristics. (Continued) Symbol Parameter Condition Min. Typ. Max. Units399 7593L–AVR–09/12 AT90USB64/128 31.10 External data memory timing Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1. 2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1. Table 31-6. External data memory characteristics, 4.5 - 5.5 Volts, no wait-state. Symbol Parameter 8MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 1 tLHLL ALE Pulse Width 115 1.0tCLCL-10 ns 2 tAVLL Address Valid A to ALE Low 57.5 0.5tCLCL-5 (1) 3a tLLAX_ST Address Hold After ALE Low, write access 5 5 3b tLLAX_LD Address Hold after ALE Low, read access 5 5 4 tAVLLC Address Valid C to ALE Low 57.5 0.5tCLCL-5 (1) 5 tAVRL Address Valid to RD Low 115 1.0tCLCL-10 6 tAVWL Address Valid to WR Low 115 1.0tCLCL-10 7 tLLWL ALE Low to WR Low 47.5 67.5 0.5tCLCL-15 (2) 0.5tCLCL+5 (2) 8 tLLRL ALE Low to RD Low 47.5 67.5 0.5tCLCL-15 (2) 0.5tCLCL+5 (2) 9 tDVRH Data Setup to RD High 40 40 10 tRLDV Read Low to Data Valid 75 1.0tCLCL-50 11 tRHDX Data Hold After RD High 0 0 12 tRLRH RD Pulse Width 115 1.0tCLCL-10 13 tDVWL Data Setup to WR Low 42.5 0.5tCLCL-20 (1) 14 tWHDX Data Hold After WR High 115 1.0tCLCL-10 15 tDVWH Data Valid to WR High 125 1.0tCLCL 16 tWLWH WR Pulse Width 115 1.0tCLCL-10 Table 31-7. External data memory characteristics, 4.5 - 5.5 Volts, 1 cycle wait-state. Symbol Parameter 8MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 10 tRLDV Read Low to Data Valid 200 2.0tCLCL-50 ns 12 tRLRH RD Pulse Width 240 2.0tCLCL-10 15 tDVWH Data Valid to WR High 240 2.0tCLCL 16 tWLWH WR Pulse Width 240 2.0tCLCL-10400 7593L–AVR–09/12 AT90USB64/128 Table 31-8. External data memory characteristics, 4.5 - 5.5 Volts, SRWn1 = 1, SRWn0 = 0. Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50 ns 12 tRLRH RD Pulse Width 365 3.0tCLCL-10 15 tDVWH Data Valid to WR High 375 3.0tCLCL 16 tWLWH WR Pulse Width 365 3.0tCLCL-10 Table 31-9. External data memory characteristics, 4.5 - 5.5 Volts, SRWn1 = 1, SRWn0 = 1. Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 16 MHz 10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50 ns 12 tRLRH RD Pulse Width 365 3.0tCLCL-10 14 tWHDX Data Hold After WR High 240 2.0tCLCL-10 15 tDVWH Data Valid to WR High 375 3.0tCLCL 16 tWLWH WR Pulse Width 365 3.0tCLCL-10 Table 31-10. External data memory characteristics, 2.7 - 5.5 Volts, no wait-state. Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 1 tLHLL ALE Pulse Width 235 tCLCL-15 ns 2 tAVLL Address Valid A to ALE Low 115 0.5tCLCL-10 (1) 3a tLLAX_ST Address Hold After ALE Low, write access 5 5 3b tLLAX_LD Address Hold after ALE Low, read access 5 5 4 tAVLLC Address Valid C to ALE Low 115 0.5tCLCL-10 (1) 5 tAVRL Address Valid to RD Low 235 1.0tCLCL-15 6 tAVWL Address Valid to WR Low 235 1.0tCLCL-15 7 tLLWL ALE Low to WR Low 115 130 0.5tCLCL-10 (2) 0.5tCLCL+5 (2) 8 tLLRL ALE Low to RD Low 115 130 0.5tCLCL-10 (2) 0.5tCLCL+5 (2) 9 tDVRH Data Setup to RD High 45 45 10 tRLDV Read Low to Data Valid 190 1.0tCLCL-60 11 tRHDX Data Hold After RD High 0 0401 7593L–AVR–09/12 AT90USB64/128 Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1. 2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1. 12 tRLRH RD Pulse Width 235 1.0tCLCL-15 ns 13 tDVWL Data Setup to WR Low 105 0.5tCLCL-20 (1) 14 tWHDX Data Hold After WR High 235 1.0tCLCL-15 15 tDVWH Data Valid to WR High 250 1.0tCLCL 16 tWLWH WR Pulse Width 235 1.0tCLCL-15 Table 31-10. External data memory characteristics, 2.7 - 5.5 Volts, no wait-state. (Continued) Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit Table 31-11. External data memory characteristics, 2.7 - 5.5 Volts, SRWn1 = 0, SRWn0 = 1. Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 10 tRLDV Read Low to Data Valid 440 2.0tCLCL-60 ns 12 tRLRH RD Pulse Width 485 2.0tCLCL-15 15 tDVWH Data Valid to WR High 500 2.0tCLCL 16 tWLWH WR Pulse Width 485 2.0tCLCL-15 Table 31-12. External data memory characteristics, 2.7 - 5.5 Volts, SRWn1 = 1, SRWn0 = 0. Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60 ns 12 tRLRH RD Pulse Width 735 3.0tCLCL-15 15 tDVWH Data Valid to WR High 750 3.0tCLCL 16 tWLWH WR Pulse Width 735 3.0tCLCL-15 Table 31-13. External data memory characteristics, 2.7 - 5.5 Volts, SRWn1 = 1, SRWn0 = 1. Symbol Parameter 4MHz oscillator Variable oscillator Min. Max. Min. Max. Unit 0 1/tCLCL Oscillator Frequency 0.0 8 MHz 10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60 ns 12 tRLRH RD Pulse Width 735 3.0tCLCL-15 14 tWHDX Data Hold After WR High 485 2.0tCLCL-15 15 tDVWH Data Valid to WR High 750 3.0tCLCL 16 tWLWH WR Pulse Width 735 3.0tCLCL-15402 7593L–AVR–09/12 AT90USB64/128 Figure 31-7. External memory timing (SRWn1 = 0, SRWn0 = 0. Figure 31-8. External memory timing (SRWn1 = 0, SRWn0 = 1). ALE T1 T2 T3 Write Read WR T4 A15:8 Prev. addr. Address DA7:0 Prev. data Address XX Data RD DA7:0 (XMBK = 0) Address Data System clock (CLK CPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 ALE T1 T2 T3 Write Read WR T5 A15:8 Prev. addr. Address DA7:0 Prev. data Address XX Data RD DA7:0 (XMBK = 0) Address Data System clock (CLK CPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 T4403 7593L–AVR–09/12 AT90USB64/128 Figure 31-9. External memory timing (SRWn1 = 1, SRWn0 = 0). Figure 31-10. External memory timing (SRWn1 = 1, SRWn0 = 1). The ALE pulse in the last period (T4-T7) is only present if the next instruction accesses the RAM (internal or external). ALE T1 T2 T3 Write Read WR T6 A15:8 Prev. addr. Address DA7:0 Prev. data Address XX Data RD DA7:0 (XMBK = 0) Address Data System clock (CLK CPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 T4 T5 ALE T1 T2 T3 Write Read WR T7 A15:8 Prev. addr. Address DA7:0 Prev. data Address XX Data RD DA7:0 (XMBK = 0) Address Data System clock (CLK CPU) 1 4 2 7 6 3a 3b 5 8 12 16 13 10 11 14 15 9 T4 T5 T6404 7593L–AVR–09/12 AT90USB64/128 32. Atmel AT90USB64/128 typical characteristics The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock source. All Active- and Idle current consumption measurements are done with all bits in the PRR registers set and thus, the corresponding I/O modules are turned off. Also the Analog Comparator is disabled during these measurements. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as CL×VCC×f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer.405 7593L–AVR–09/12 AT90USB64/128 32.1 Input voltage levels Figure 32-1. Input low voltage vs. VCC, all I/Os excluding DP/DM, XTAL1 and reset. Figure 32-2. Input high voltage vs. VCC, all I/Os excluding DP/DM, XTAL1 and reset. 0.50 0.75 1.00 1.25 1.50 1.75 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) Thres hold (V) 85 25 -40 0.50 0.75 1.00 1.25 1.50 1.75 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) Thres hold (V) 85 25 -40406 7593L–AVR–09/12 AT90USB64/128 32.2 Output voltage levels Figure 32-3. Output low voltage vs. output current, all I/Os excluding DP/DM, VCC = 3V. Figure 32-4. Output low voltage vs. output current, all I/Os excluding DP/DM, VCC = 5V. 0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 I OL (mA) VOL (V) 85 25 -40 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 I OL (mA) VOL (V) 85 25 -40407 7593L–AVR–09/12 AT90USB64/128 Figure 32-5. Output high voltage vs. output current, all I/Os excluding DP/DM, VCC = 3V. Figure 32-6. Output high voltage vs. output current, all I/Os excluding DP/DM, VCC = 5V. 1.8 2.0 2.2 2.4 2.6 2.8 3.0 0 5 10 15 20 I OH (mA) VOH (V) 85 25 -40 4.2 4.4 4.6 4.8 5.0 0 5 10 15 20 I OH (mA) VOH (V) 85 25 -40408 7593L–AVR–09/12 AT90USB64/128 32.3 Power-down supply current Figure 32-7. Power-down supply current vs. VCC, with BOD disabled, WDT disabled, T = 25°C. Figure 32-8. Power-down supply current vs. VCC, with BOD disabled, WDT enabled, T = 25°C. 0 0.5 1.0 1.5 2.0 2.5 3.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) ICC (µA) 0 2 4 6 8 10 12 14 16 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) ICC (µA)409 7593L–AVR–09/12 AT90USB64/128 Figure 32-9. Power-down supply current vs. VCC, with BOD enabled, WDT enabled, T = 25°C. 32.4 Power-save supply current Figure 32-10. Power-save supply current vs. VCC, with BOD & WDT disabled, T = 25°C. 0 10 20 30 40 50 60 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) ICC (µA) 0 1 2 3 4 5 6 7 8 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) ICC (µA)410 7593L–AVR–09/12 AT90USB64/128 32.5 Idle supply current Figure 32-11. Idle supply current vs. frequency, T = 25°C. 32.6 Active supply current Figure 32-12. Active supply current vs. frequency, T = 25°C. 0 5 10 15 20 246 8 10 12 14 16 Frequency (MHz) ICC (mA) 5.5 5.0 4.5 3.3 2.7 0 5 10 15 20 25 246 8 10 12 14 16 Frequency (MHz) ICC (mA) 5.5 5.0 4.5 3.3 2.7411 7593L–AVR–09/12 AT90USB64/128 32.7 Reset supply current Figure 32-13. Reset supply current vs. frequency. 32.8 I/O pull-up current Figure 32-14. I/O pull-up current vs. pin voltage, VCC = 5V. 0 2 4 6 8 10 12 4 6 8 10 12 14 16 Frequency (MHz) ICC (mA) 5.5 5.0 4.5 3.3 2.7 -20 0 20 40 60 80 100 120 140 012345 VOP (V) IOP (uA) 85 25 -40412 7593L–AVR–09/12 AT90USB64/128 Figure 32-15. Reset pull-up current vs. pin voltage, VCC = 5V. 32.9 Bandgap voltage Figure 32-16. Bandgap voltage vs. temperature. 0 20 40 60 80 100 120 012345 VRESET (V) IRESET (µA) 85 25 -40 1.080 1.085 1.090 1.095 1.100 1.105 1.110 1.115 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) Bandgap voltage (V) 5.5 5.0 4.5 4.0 3.6 2.7413 7593L–AVR–09/12 AT90USB64/128 32.10 Internal ARef voltage Figure 32-17. Internal ARef reference voltage vs. temperature, VCC = 2.7-5.5V. 32.11 USB regulator Figure 32-18. USB regulator quiescent current vs. input voltage, no load. 2.54 2.56 2.58 2.60 2.62 2.64 -40 -20 0 20 40 60 80 Temperature (°C) Tens ion Vref Inter (V) 0 10 20 30 40 50 60 70 80 90 100 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Voltage (V) ICC (µA)414 7593L–AVR–09/12 AT90USB64/128 Figure 32-19. USB regulator output voltage vs. input voltage, load = 75Ω. Note: The 75Ω load is equivalent to the maximum average consumption of the USB peripheral in operation (full bus load). 32.12 BOD levels Figure 32-20. BOD voltage (2.4V level) vs. temperature. 2.6 2.8 3.0 3.2 3.4 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) Output voltage (V) 85 25 -40 2.42 2.44 2.46 2.48 2.50 2.52 2.54 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) Thres hold (V) Rising Vcc Falling Vcc415 7593L–AVR–09/12 AT90USB64/128 Figure 32-21. BOD voltage (3.4V level) vs. temperature. Figure 32-22. BOD voltage (4.3V level) vs. temperature. 3.42 3.44 3.46 3.48 3.50 3.52 3.54 3.56 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) Thres hold (V) Rising Vcc Falling Vcc 4.34 4.36 4.38 4.40 4.42 4.44 4.46 4.48 4.50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) Thres hold (V) Rising Vcc Falling Vcc416 7593L–AVR–09/12 AT90USB64/128 32.13 Watchdog timer frequency Figure 32-23. WDT oscillator frequency vs. VCC. 32.14 Internal RC oscillator frequency Figure 32-24. RC oscillator frequency vs. OSCCAL, T = 25°C. 108 110 112 114 116 118 120 122 124 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) FRC (kHz) 85 25 -40 2 4 6 8 10 12 14 16 -1 15 31 47 63 79 95 111 127 143 159 175 191 207 223 239 255 OSCCAL (X1) FRC (MHz)417 7593L–AVR–09/12 AT90USB64/128 Figure 32-25. RC oscillator frequency vs. VCC. Figure 32-26. RC oscillator frequency vs. temperature. 7.8 7.9 8.0 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) FRC (MHz) 85 25 -40 7.8 8.0 8.2 8.4 8.6 8.8 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) FRC (MHz) 5.5 4.0 3.3 3.0 2.7418 7593L–AVR–09/12 AT90USB64/128 32.15 Power-on reset Figure 32-27. Power-on reset level vs. temperature. 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) POR Voltage (V)419 7593L–AVR–09/12 AT90USB64/128 33. Register summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page (0xFF) Reserved - - - - - - - - (0xFE) Reserved - - - - - - - - (0xFD) Reserved - - - - - - - - (0xFC) Reserved - - - - - - - - (0xFB) Reserved - - - - - - - - (0xFA) Reserved - - - - - - - - (0xF9) OTGTCON PAGE VALUE (0xF8) UPINT PINT7:0 (0xF7) UPBCHX - - - - - PBYCT10:8 (0xF6) UPBCLX PBYCT7:0 (0xF5) UPERRX - COUNTER1:0 CRC16 TIMEOUT PID DATAPID DATATGL (0xF4) UEINT EPINT6:0 (0xF3) UEBCHX - - - - - BYCT10:8 (0xF2) UEBCLX BYCT7:0 (0xF1) UEDATX DAT7:0 (0xF0) UEIENX FLERRE NAKINE - NAKOUTE RXSTPE RXOUTE STALLEDE TXINE (0xEF) UESTA1X - - - - - CTRLDIR CURRBK1:0 (0xEE) UESTA0X CFGOK OVERFI UNDERFI - DTSEQ1:0 NBUSYBK1:0 (0xED) UECFG1X EPSIZE2:0 EPBK1:0 ALLOC (0xEC) UECFG0X EPTYPE1:0 - - EPDIR (0xEB) UECONX STALLRQ STALLRQC RSTDT EPEN (0xEA) UERST EPRST6:0 (0xE9) UENUM EPNUM2:0 (0xE8) UEINTX FIFOCON NAKINI RWAL NAKOUTI RXSTPI RXOUTI STALLEDI TXINI (0xE7) Reserved - - - - (0xE6) UDMFN FNCERR (0xE5) UDFNUMH FNUM10:8 (0xE4) UDFNUML FNUM7:0 (0xE3) UDADDR ADDEN UADD6:0 (0xE2) UDIEN UPRSME EORSME WAKEUPE EORSTE SOFE SUSPE (0xE1) UDINT UPRSMI EORSMI WAKEUPI EORSTI SOFI SUSPI (0xE0) UDCON LSM RMWKUP DETACH (0xDF) OTGINT STOI HNPERRI ROLEEXI BCERRI VBERRI SRPI (0xDE) OTGIEN STOE HNPERRE ROLEEXE BCERRE VBERRE SRPE (0xDD) OTGCON HNPREQ SRPREQ SRPSEL VBUSHWC VBUSREQ VBUSRQC (0xDC) Reserved (0xDB) Reserved (0xDA) USBINT IDTI VBUSTI (0xD9) USBSTA SPEED ID VBUS (0xD8) USBCON USBE HOST FRZCLK OTGPADE IDTE VBUSTE (0xD7) UHWCON UIMOD UIDE UVCONE UVREGE (0xD6) Reserved (0xD5) Reserved (0xD4) Reserved (0xD3) Reserved (0xD2) Reserved - - - - - - - - (0xD1) Reserved - - - - - - - - (0xD0) Reserved - - - - - - - - (0xCF) Reserved - - - - - - - - (0xCE) UDR1 USART1 I/O Data Register (0xCD) UBRR1H - - - - USART1 Baud Rate Register High Byte (0xCC) UBRR1L USART1 Baud Rate Register Low Byte (0xCB) Reserved - - - - - - - - (0xCA) UCSR1C UMSEL11 UMSEL10 UPM11 UPM10 USBS1 UCSZ11 UCSZ10 UCPOL1 (0xC9) UCSR1B RXCIE1 TXCIE1 UDRIE1 RXEN1 TXEN1 UCSZ12 RXB81 TXB81 (0xC8) UCSR1A RXC1 TXC1 UDRE1 FE1 DOR1 PE1 U2X1 MPCM1 (0xC7) Reserved - - - - - - - - (0xC6) Reserved - - - - - - - - (0xC5) Reserved - - - - - - - - (0xC4) Reserved - - - - - - - - (0xC3) Reserved - - - - - - - - (0xC2) Reserved - - - - - - - - (0xC1) Reserved - - - - - - - - (0xC0) Reserved - - - - - - - - (0xBF) Reserved - - - - - - - -420 7593L–AVR–09/12 AT90USB64/128 (0xBE) Reserved - - - - - - - - (0xBD) TWAMR TWAM6 TWAM5 TWAM4 TWAM3 TWAM2 TWAM1 TWAM0 - (0xBC) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN - TWIE (0xBB) TWDR 2-wire Serial Interface Data Register (0xBA) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE (0xB9) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 - TWPS1 TWPS0 (0xB8) TWBR 2-wire Serial Interface Bit Rate Register (0xB7) Reserved - - - - - - - - (0xB6) ASSR - EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB (0xB5) Reserved - - - - - - - - (0xB4) OCR2B Timer/Counter2 Output Compare Register B (0xB3) OCR2A Timer/Counter2 Output Compare Register A (0xB2) TCNT2 Timer/Counter2 (8 Bit) (0xB1) TCCR2B FOC2A FOC2B - - WGM22 CS22 CS21 CS20 (0xB0) TCCR2A COM2A1 COM2A0 COM2B1 COM2B0 - - WGM21 WGM20 (0xAF) UPDATX PDAT7:0 (0xAE) UPIENX FLERRE NAKEDE - PERRE TXSTPE TXOUTE RXSTALLE RXINE (0xAD) UPCFG2X INTFRQ7:0 (0xAC) UPSTAX CFGOK OVERFI UNDERFI DTSEQ1:0 NBUSYBK1:0 (0xAB) UPCFG1X PSIZE2:0 PBK1:0 ALLOC (0xAA) UPCFG0X PTYPE1:0 PTOKEN1:0 PEPNUM3:0 (0xA9) UPCONX PFREEZE INMODE RSTDT PEN (0xA8) UPRST PRST6:0 (0xA7) UPNUM PNUM2:0 (0xA6) UPINTX FIFOCON NAKEDI RWAL PERRI TXSTPI TXOUTI RXSTALLI RXINI (0xA5) UPINRQX INRQ7:0 (0xA4) UHFLEN FLEN7:0 (0xA3) UHFNUMH FNUM10:8 (0xA2) UHFNUML FNUM7:0 (0xA1) UHADDR HADD6:0 (0xA0) UHIEN HWUPE HSOFE RXRSME RSMEDE RSTE DDISCE DCONNE (0x9F) UHINT HWUPI HSOFI RXRSMI RSMEDI RSTI DDISCI DCONNI (0x9E) UHCON RESUME RESET SOFEN (0x9D) OCR3CH Timer/Counter3 - Output Compare Register C High Byte (0x9C) OCR3CL Timer/Counter3 - Output Compare Register C Low Byte (0x9B) OCR3BH Timer/Counter3 - Output Compare Register B High Byte (0x9A) OCR3BL Timer/Counter3 - Output Compare Register B Low Byte (0x99) OCR3AH Timer/Counter3 - Output Compare Register A High Byte (0x98) OCR3AL Timer/Counter3 - Output Compare Register A Low Byte (0x97) ICR3H Timer/Counter3 - Input Capture Register High Byte (0x96) ICR3L Timer/Counter3 - Input Capture Register Low Byte (0x95) TCNT3H Timer/Counter3 - Counter Register High Byte (0x94) TCNT3L Timer/Counter3 - Counter Register Low Byte (0x93) Reserved - - - - - - - - (0x92) TCCR3C FOC3A FOC3B FOC3C - - - - - (0x91) TCCR3B ICNC3 ICES3 - WGM33 WGM32 CS32 CS31 CS30 (0x90) TCCR3A COM3A1 COM3A0 COM3B1 COM3B0 COM3C1 COM3C0 WGM31 WGM30 (0x8F) Reserved - - - - - - - - (0x8E) Reserved - - - - - - - - (0x8D) OCR1CH Timer/Counter1 - Output Compare Register C High Byte (0x8C) OCR1CL Timer/Counter1 - Output Compare Register C Low Byte (0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte (0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte (0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte (0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte (0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte (0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte (0x85) TCNT1H Timer/Counter1 - Counter Register High Byte (0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte (0x83) Reserved - - - - - - - - (0x82) TCCR1C FOC1A FOC1B FOC1C - - - - - (0x81) TCCR1B ICNC1 ICES1 - WGM13 WGM12 CS12 CS11 CS10 (0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 COM1C1 COM1C0 WGM11 WGM10 (0x7F) DIDR1 - - - - - - AIN1D AIN0D (0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D (0x7D) - - - - - - - - - Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page421 7593L–AVR–09/12 AT90USB64/128 (0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 (0x7B) ADCSRB ADHSM ACME - - - ADTS2 ADTS1 ADTS0 (0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 (0x79) ADCH ADC Data Register High byte (0x78) ADCL ADC Data Register Low byte (0x77) Reserved - - - - - - - - (0x76) Reserved - - - - - - - - (0x75) XMCRB XMBK - - - - XMM2 XMM1 XMM0 (0x74) XMCRA SRE SRL2 SRL1 SRL0 SRW11 SRW10 SRW01 SRW00 (0x73) Reserved - - - - - - - - (0x72) Reserved - - - - - - - - (0x71) TIMSK3 - - ICIE3 - OCIE3C OCIE3B OCIE3A TOIE3 (0x70) TIMSK2 - - - - - OCIE2B OCIE2A TOIE2 (0x6F) TIMSK1 - - ICIE1 - OCIE1C OCIE1B OCIE1A TOIE1 (0x6E) TIMSK0 - - - - - OCIE0B OCIE0A TOIE0 (0x6D) Reserved - - - - - - - - (0x6C) Reserved - - - - - - - - (0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 (0x6A) EICRB ISC71 ISC70 ISC61 ISC60 ISC51 ISC50 ISC41 ISC40 (0x69) EICRA ISC31 ISC30 ISC21 ISC20 ISC11 ISC10 ISC01 ISC00 (0x68) PCICR - - - - - - - PCIE0 (0x67) Reserved - - - - - - - - (0x66) OSCCAL Oscillator Calibration Register (0x65) PRR1 PRUSB - - - PRTIM3 - - PRUSART1 (0x64) PRR0 PRTWI PRTIM2 PRTIM0 - PRTIM1 PRSPI - PRADC (0x63) Reserved - - - - - - - - (0x62) Reserved - - - - - - - - (0x61) CLKPR CLKPCE - - - CLKPS3 CLKPS2 CLKPS1 CLKPS0 (0x60) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 0x3F (0x5F) SREG I T H S V N Z C 0x3E (0x5E) SPH SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 0x3C (0x5C) Reserved - - - - - - - - 0x3B (0x5B) RAMPZ - - - - - - RAMPZ1 RAMPZ0 0x3A (0x5A) Reserved - - - - - - - - 0x39 (0x59) Reserved - - - - - - - - 0x38 (0x58) Reserved - - - - - - - - 0x37 (0x57) SPMCSR SPMIE RWWSB SIGRD RWWSRE BLBSET PGWRT PGERS SPMEN 0x36 (0x56) Reserved - - - - - - - - 0x35 (0x55) MCUCR JTD - - PUD - - IVSEL IVCE 0x34 (0x54) MCUSR - - - JTRF WDRF BORF EXTRF PORF 0x33 (0x53) SMCR - - - - SM2 SM1 SM0 SE 0x32 (0x52) Reserved - - - - - - - - 0x31 (0x51) OCDR/ MONDR OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 Monitor Data Register 0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 0x2F (0x4F) Reserved - - - - - - - - 0x2E (0x4E) SPDR SPI Data Register 0x2D (0x4D) SPSR SPIF WCOL - - - - - SPI2X 0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 0x29 (0x49) PLLCSR - - - PLLP2 PLLP1 PLLP0 PLLE PLOCK 0x28 (0x48) OCR0B Timer/Counter0 Output Compare Register B 0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A 0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) 0x25 (0x45) TCCR0B FOC0A FOC0B - - WGM02 CS02 CS01 CS00 0x24 (0x44) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 - - WGM01 WGM00 0x23 (0x43) GTCCR TSM - - - - - PSRASY PSRSYNC 0x22 (0x42) EEARH - - - - EEPROM Address Register High Byte 0x21 (0x41) EEARL EEPROM Address Register Low Byte 0x20 (0x40) EEDR EEPROM Data Register 0x1F (0x3F) EECR - - EEPM1 EEPM0 EERIE EEMPE EEPE EERE 0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 0x1D (0x3D) EIMSK INT7 INT6 INT5 INT4 INT3 INT2 INT1 INT0 0x1C (0x3C) EIFR INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 INTF0 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page422 7593L–AVR–09/12 AT90USB64/128 Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the status flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O registers as data space using LD and ST instructions, $20 must be added to these addresses. The Atmel AT90USB64/128 is a complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from $60 - $1FF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. 0x1B (0x3B) PCIFR - - - - - - - PCIF0 0x1A (0x3A) Reserved - - - - - - - - 0x19 (0x39) Reserved - - - - - - - - 0x18 (0x38) TIFR3 - - ICF3 - OCF3C OCF3B OCF3A TOV3 0x17 (0x37) TIFR2 - - - - - OCF2B OCF2A TOV2 0x16 (0x36) TIFR1 - - ICF1 - OCF1C OCF1B OCF1A TOV1 0x15 (0x35) TIFR0 - - - - - OCF0B OCF0A TOV0 0x14 (0x34) Reserved - - - - - - - - 0x13 (0x33) Reserved - - - - - - - - 0x12 (0x32) Reserved - - - - - - - - 0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page423 7593L–AVR–09/12 AT90USB64/128 34. Instruction set summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z,C 2 MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z,C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z,C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z,C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2 BRANCH INSTRUCTIONS RJMP k Relative Jump PC ← PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC ← Z None 2 EIJMP Extended Indirect Jump to (Z) PC ←(EIND:Z) None 2 JMP k Direct Jump PC ← k None 3 RCALL k Relative Subroutine Call PC ← PC + k + 1 None 4 ICALL Indirect Call to (Z) PC ← Z None 4 EICALL Extended Indirect Call to (Z) PC ←(EIND:Z) None 4 CALL k Direct Subroutine Call PC ← k None 5 RET Subroutine Return PC ← STACK None 5 RETI Interrupt Return PC ← STACK I 5 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2424 7593L–AVR–09/12 AT90USB64/128 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Twos Complement Overflow. V ← 1 V1 CLV Clear Twos Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd ← Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 LPM Load Program Memory R0 ← (Z) None 3 LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 ELPM Extended Load Program Memory R0 ← (RAMPZ:Z) None 3 ELPM Rd, Z Extended Load Program Memory Rd ← (Z) None 3 ELPM Rd, Z+ Extended Load Program Memory Rd ← (RAMPZ:Z), RAMPZ:Z ←RAMPZ:Z+1 None 3 Mnemonics Operands Description Operation Flags #Clocks425 7593L–AVR–09/12 AT90USB64/128 SPM Store Program Memory (Z) ← R1:R0 None - IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 BREAK Break For On-chip Debug Only None N/A Mnemonics Operands Description Operation Flags #Clocks426 7593L–AVR–09/12 AT90USB64/128 35. Ordering information 35.1 Atmel AT90USB646 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully green. 3. See “Maximum speed vs. VCC” on page 392. Speed [MHz] Power supply [V] Ordering code (2) USB interface Package (1) Operating range 16 (3) 2.7-5.5 AT90USB646-AU AT90USB646-MU Device MD PS Industrial (-40° to +85°C) MD 64 - lead, 14 × 14mm body size, 1.0mm body thickness 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) PS 64 - lead, 9 × 9mm body size, 0.50mm pitch Quad flat no lead package (QFN)427 7593L–AVR–09/12 AT90USB64/128 35.2 Atmel AT90USB647 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully green. 3. See “Maximum speed vs. VCC” on page 392. Speed [MHz] Power supply [V] Ordering code (2) USB interface Package (1) Operating range 16 (3) 2.7-5.5 AT90USB647-AU AT90USB647-MU USB OTG MD PS Industrial (-40° to +85°C) MD 64 - lead, 14 × 14mm body size, 1.0mm body thickness 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) PS 64 - lead, 9 × 9mm body size, 0.50mm pitch Quad flat no lead package (QFN)428 7593L–AVR–09/12 AT90USB64/128 35.3 Atmel AT90USB1286 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully green. 3. See “Maximum speed vs. VCC” on page 392. Speed [MHz] Power supply [V] Ordering code (2) USB interface Package (1) Operating range 16 (3) 2.7-5.5 AT90USB1286-AU AT90USB1286-MU Device MD PS Industrial (-40° to +85°C) MD 64 - lead, 14 × 14mm body size, 1.0mm body thickness 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) PS 64 - lead, 9 × 9mm body size, 0.50mm pitch Quad flat no lead package (QFN)429 7593L–AVR–09/12 AT90USB64/128 35.4 Atmel AT90USB1287 Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging complies to the European directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully green. 3. See “Maximum speed vs. VCC” on page 392. Speed [MHz] Power supply [V] Ordering code (2) USB interface Package (1) Operating range 16 (3) 2.7-5.5 AT90USB1287-AU AT90USB1287-MU Host (OTG) MD PS Industrial (-40° to +85°C) MD 64 - lead, 14 × 14mm body size, 1.0mm body thickness 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) PS 64 - lead, 9 × 9mm body size, 0.50mm pitch Quad flat no lead package (QFN)430 7593L–AVR–09/12 AT90USB64/128 36. Packaging information 36.1 TQFP64431 7593L–AVR–09/12 AT90USB64/128432 7593L–AVR–09/12 AT90USB64/128 36.2 QFN64433 7593L–AVR–09/12 AT90USB64/128434 7593L–AVR–09/12 AT90USB64/128 37. Errata 37.1 Atmel AT90USB1287/6 errata 37.1.1 AT90USB1287/6 errata history Notes: 1. A blank or any alphanumeric string. 37.1.2 AT90USB1287/6 first release • Incorrect CPU behavior for VBUSTI and IDTI interrupts routines • USB Eye Diagram violation in low-speed mode • Transient perturbation in USB suspend mode generates over consumption • VBUS Session valid threshold voltage • USB signal rate • VBUS residual level • Spike on TWI pins when TWI is enabled • High current consumption in sleep mode • Async timer interrupt wake up from sleep generate multiple interrupts 9. Incorrect CPU behavior for VBUSTI and IDTI interrupts routines The CPU core may incorrectly execute the interrupt vector related to the VBUSTI and IDTI interrupt flags. Problem fix/workaround Do not enable these interrupts, firmware must process these USB events by polling VBUSTI and IDTI flags. 8. USB Eye Diagram violation in low-speed mode The low to high transition of D- violates the USB eye diagram specification when transmitting with low-speed signaling. Problem fix/workaround None. 7. Transient perturbation in USB suspend mode generates overconsumption In device mode and when the USB is suspended, transient perturbation received on the USB lines generates a wake up state. However the idle state following the perturbation does Silicon Release 90USB1286-16MU 90USB1287-16AU 90USB1287-16MU First Release Date Code up to 0648 Date Code up to 0714 and lots 0735 6H2726 (1) Date Code up to 0701 Second Release Date Code from 0709 to 0801 except lots 0801 7H5103 (1) from Date Code 0722 to 0806 except lots 0735 6H2726 (1) Date Code from 0714 to 0810 except lots 0748 7H5103 (1) Third Release Lots 0801 7H5103 (1) and Date Code from 0814 Date Code from 0814 Lots 0748 7H5103 (1) and Date Code from 0814 Fourth Release TBD TBD TBD435 7593L–AVR–09/12 AT90USB64/128 not set the SUSPI bit anymore. The internal USB engine remains in suspend mode but the USB differential receiver is still enabled and generates a typical 300µA extra-power consumption. Detection of the suspend state after the transient perturbation should be performed by software (instead of reading the SUSPI bit). Problem fix/workaround USB waiver allows bus powered devices to consume up to 2.5mA in suspend state. 6. VBUS session valid threshold voltage The VSession valid threshold voltage is internally connected to VBus_Valid (4.4V approx.). That causes the device to attach to the bus only when Vbus is greater than VBusValid instead of V_Session Valid. Thus if VBUS is lower than 4.4V, the device is detached. Problem fix/workaround According to the USB power drop budget, this may require connecting the device toa root hub or a self-powered hub. 5. UBS signal rate The average USB signal rate may sometime be measured out of the USB specifications (12MHz ±30kHz) with short frames. When measured on a long period, the average signal rate value complies with the specifications. This bit rate deviation does not generates communication or functional errors. Problem fix/workaround None. 4. VBUS residual level In USB device and host mode, once a 5V level has been detected to the VBUS pad, a residual level (about 3V) can be measured on the VBUS pin. Problem fix/workaround None. 3. Spike on TWI pins when TWI is enabled 100ns negative spike occurs on SDA and SCL pins when TWI is enabled. Problem fix/workaround No known workaround, enable Atmel AT90USB64/128 TWI first versus the others nodes of the TWI network. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem fix/workaround Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled.436 7593L–AVR–09/12 AT90USB64/128 1. Asynchronous timer interrupt wake up from sleep generates multiple interrupts If the CPU core is in sleep and wakes-up from an asynchronous timer interrupt and then go back in sleep again it may wake up multiple times. Problem fix/workaround A software workaround is to wait with performing the sleep instruction until TCNT2>OCR2+1.437 7593L–AVR–09/12 AT90USB64/128 37.1.3 Atmel AT90USB1287/6 second release • Incorrect CPU behavior for VBUSTI and IDTI interrupts routines • USB Eye Diagram violation in low-speed mode • Transient perturbation in USB suspend mode generates over consumption • VBUS Session valid threshold voltage • Spike on TWI pins when TWI is enabled • High current consumption in sleep mode • Async timer interrupt wake up from sleep generate multiple interrupts 7. Incorrect CPU behavior for VBUSTI and IDTI interrupts routines The CPU core may incorrectly execute the interrupt vector related to the VBUSTI and IDTI interrupt flags. Problem fix/workaround Do not enable these interrupts, firmware must process these USB events by polling VBUSTI and IDTI flags. 6. USB Eye Diagram violation in low-speed mode The low to high transition of D- violates the USB eye diagram specification when transmitting with low-speed signaling. Problem fix/workaround None. 5. Transient perturbation in USB suspend mode generates overconsumption In device mode and when the USB is suspended, transient perturbation received on the USB lines generates a wake up state. However the idle state following the perturbation does not set the SUSPI bit anymore. The internal USB engine remains in suspend mode but the USB differential receiver is still enabled and generates a typical 300µA extra-power consumption. Detection of the suspend state after the transient perturbation should be performed by software (instead of reading the SUSPI bit). Problem fix/workaround USB waiver allows bus powered devices to consume up to 2.5mA in suspend state. 4. VBUS session valid threshold voltage The VSession valid threshold voltage is internally connected to VBus_Valid (4.4V approx.). That causes the device to attach to the bus only when Vbus is greater than VBusValid instead of V_Session Valid. Thus if VBUS is lower than 4.4V, the device is detached. Problem fix/workaround According to the USB power drop budget, this may require connecting the device toa root hub or a self-powered hub. 3. Spike on TWI pins when TWI is enabled 100ns negative spike occurs on SDA and SCL pins when TWI is enabled.438 7593L–AVR–09/12 AT90USB64/128 Problem fix/workaround No known workaround, enable Atmel AT90USB64/128 TWI first versus the others nodes of the TWI network. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem fix/workaround Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled. 1. Asynchronous timer interrupt wake up from sleep generates multiple interrupts If the CPU core is in sleep and wakes-up from an asynchronous timer interrupt and then go back in sleep again it may wake up multiple times. Problem fix/workaround A software workaround is to wait with performing the sleep instruction until TCNT2>OCR2+1.439 7593L–AVR–09/12 AT90USB64/128 37.1.4 Atmel AT90USB1287/6 Third Release • Incorrect CPU behavior for VBUSTI and IDTI interrupts routines • Transient perturbation in USB suspend mode generates over consumption • Spike on TWI pins when TWI is enabled • High current consumption in sleep mode • Async timer interrupt wake up from sleep generate multiple interrupts 5. Incorrect CPU behavior for VBUSTI and IDTI interrupts routines The CPU core may incorrectly execute the interrupt vector related to the VBUSTI and IDTI interrupt flags. Problem fix/workaround Do not enable these interrupts, firmware must process these USB events by polling VBUSTI and IDTI flags. 4. Transient perturbation in USB suspend mode generates overconsumption In device mode and when the USB is suspended, transient perturbation received on the USB lines generates a wake up state. However the idle state following the perturbation does not set the SUSPI bit. The internal USB engine remains in suspend mode but the USB differential receiver is still enabled and generates a typical 300µA extra-power consumption. Detection of the suspend state after the transient perturbation should be performed by software (instead of reading the SUSPI bit). Problem fix/workaround USB waiver allows bus powered devices to consume up to 2.5mA in suspend state. 3. Spike on TWI pins when TWI is enabled 100ns negative spike occurs on SDA and SCL pins when TWI is enabled. Problem fix/workaround No known workaround, enable AT90USB64/128 TWI first, before the others nodes of the TWI network. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem fix/workaround Before entering sleep, interrupts not used to wake up the part from sleep mode should be disabled. 1. Asynchronous timer interrupt wake up from sleep generates multiple interrupts If the CPU core is in sleep mode and wakes-up from an asynchronous timer interrupt and then goes back into sleep mode, it may wake up multiple times.440 7593L–AVR–09/12 AT90USB64/128 Problem fix/workaround A software workaround is to wait before performing the sleep instruction: until TCNT2>OCR2+1.441 7593L–AVR–09/12 AT90USB64/128 37.1.5 Atmel AT90USB1287/6 Fourth Release • Transient perturbation in USB suspend mode generates over consumption • Spike on TWI pins when TWI is enabled • High current consumption in sleep mode • Async timer interrupt wake up from sleep generate multiple interrupts 4. Transient perturbation in USB suspend mode generates overconsumption In device mode and when the USB is suspended, transient perturbation received on the USB lines generates a wake up state. However the idle state following the perturbation does not set the SUSPI bit. The internal USB engine remains in suspend mode but the USB differential receiver is still enabled and generates a typical 300µA extra-power consumption. Detection of the suspend state after the transient perturbation should be performed by software (instead of reading the SUSPI bit). Problem fix/workaround USB waiver allows bus powered devices to consume up to 2.5mA in suspend state. 3. Spike on TWI pins when TWI is enabled 100ns negative spike occurs on SDA and SCL pins when TWI is enabled. Problem fix/workaround No known workaround, enable Atmel AT90USB64/128 TWI first, before the others nodes of the TWI network. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem fix/workaround Before entering sleep, interrupts not used to wake up the part from sleep mode should be disabled. 1. Asynchronous timer interrupt wake up from sleep generates multiple interrupts If the CPU core is in sleep mode and wakes-up from an asynchronous timer interrupt and then goes back into sleep mode, it may wake up multiple times. Problem fix/workaround A software workaround is to wait before performing the sleep instruction: until TCNT2>OCR2+1.442 7593L–AVR–09/12 AT90USB64/128 37.2 Atmel AT90USB646/7 errata 37.2.1 AT90USB646/7 errata history TBD Note ‘*’ means a blank or any alphanumeric string. 37.2.2 AT90USB646/7 first release. • Incorrect interrupt routine execution for VBUSTI, IDTI interrupts flags • USB Eye Diagram violation in low-speed mode • Transient perturbation in USB suspend mode generates over consumption • Spike on TWI pins when TWI is enabled • High current consumption in sleep mode • Async timer interrupt wake up from sleep generate multiple interrupts 6. Incorrect CPU behavior for VBUSTI and IDTI interrupts routines The CPU core may incorrectly execute the interrupt vector related to the VBUSTI and IDTI interrupt flags. Problem fix/workaround Do not enable these interrupts, firmware must process these USB events by polling VBUSTI and IDTI flags. 5. USB Eye Diagram violation in low-speed mode The low to high transition of D- violates the USB eye diagram specification when transmitting with low-speed signaling. Problem fix/workaround None. 4. Transient perturbation in USB suspend mode generates overconsumption In device mode and when the USB is suspended, transient perturbation received on the USB lines generates a wake up state. However the idle state following the perturbation does not set the SUSPI bit anymore. The internal USB engine remains in suspend mode but the USB differential receiver is still enabled and generates a typical 300µA extra-power consumption. Detection of the suspend state after the transient perturbation should be performed by software (instead of reading the SUSPI bit). Problem fix/workaround USB waiver allows bus powered devices to consume up to 2.5mA in suspend state. 3. Spike on TWI pins when TWI is enabled 100ns negative spike occurs on SDA and SCL pins when TWI is enabled. Silicon Release 90USB646-16MU 90USB647-16AU 90USB647-16MU First Release Second Release443 7593L–AVR–09/12 AT90USB64/128 Problem fix/workaround No known workaround, enable Atmel AT90USB64/128 TWI first versus the others nodes of the TWI network. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem fix/workaround Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled. 1. Asynchronous timer interrupt wake up from sleep generates multiple interrupts If the CPU core is in sleep and wakes-up from an asynchronous timer interrupt and then go back in sleep mode again it may wake up several times. Problem fix/workaround A software workaround is to wait with performing the sleep instruction until TCNT2>OCR2+1.444 7593L–AVR–09/12 AT90USB64/128 37.2.3 Atmel AT90USB646/7 Second Release. • USB Eye Diagram violation in low-speed mode • Transient perturbation in USB suspend mode generates over consumption • Spike on TWI pins when TWI is enabled • High current consumption in sleep mode • Async timer interrupt wake up from sleep generate multiple interrupts 5. USB Eye Diagram violation in low-speed mode The low to high transition of D- violates the USB eye diagram specification when transmitting with low-speed signaling. Problem fix/workaround None. 4. Transient perturbation in USB suspend mode generates overconsumption In device mode and when the USB is suspended, transient perturbation received on the USB lines generates a wake up state. However the idle state following the perturbation does not set the SUSPI bit anymore. The internal USB engine remains in suspend mode but the USB differential receiver is still enabled and generates a typical 300µA extra-power consumption. Detection of the suspend state after the transient perturbation should be performed by software (instead of reading the SUSPI bit). Problem fix/workaround USB waiver allows bus powered devices to consume up to 2.5mA in suspend state. 3. Spike on TWI pins when TWI is enabled 100ns negative spike occurs on SDA and SCL pins when TWI is enabled. Problem fix/workaround No known workaround, enable Atmel AT90USB64/128 TWI first versus the others nodes of the TWI network. 2. High current consumption in sleep mode If a pending interrupt cannot wake the part up from the selected mode, the current consumption will increase during sleep when executing the SLEEP instruction directly after a SEI instruction. Problem fix/workaround Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled. 1. Asynchronous timer interrupt wake up from sleep generates multiple interrupts If the CPU core is in sleep and wakes-up from an asynchronous timer interrupt and then go back in sleep mode again it may wake up several times. Problem fix/workaround A software workaround is to wait with performing the sleep instruction until TCNT2>OCR2+1.445 7593L–AVR–09/12 AT90USB64/128 38. Datasheet revision history for Atmel AT90USB64/128 Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. 38.1 Changes from 7593A to 7593B 1. Changed default configuration for fuse bytes and security byte. 2. Suppression of timer 4,5 registers which does not exist. 3. Updated typical application schematics in USB section 38.2 Changes from 7593B to 7593C 1. Update to package drawings, MQFP64 and TQFP64. 38.3 Changes from 7593C to 7593D 1. For further product compatibility, changed USB PLL possible prescaler configurations. Only 8MHz and 16MHz crystal frequencies allows USB operation (see Table 7-11 on page 50). 38.4 Changes from 7593D to 7593E 1. Updated PLL Prescaler table: configuration words are different between AT90USB64x and AT90USB128x to enable the PLL with a 16MHz source. 2. Cleaned up some bits from USB registers, and updated information about OTG timers, remote wake-up, reset and connection timings. 3. Updated clock distribution tree diagram (USB prescaler source and configuration register). 4. Cleaned up register summary. 5. Suppressed PCINT23:8 that do not exist from External Interrupts. 6. Updated Electrical Characteristics. 7. Added Typical Characteristics. 8. Update Errata section. 38.5 Changes from 7593E to 7593F 1. Removed ’Preliminary’ from document status. 2. Clarification in Stand by mode regarding USB. 38.6 Changes from 7593F to 7593G 1. Updated Errata section. 38.7 Changes from 7593G to 7593H 1. Added Signature information for 64K devices. 2. Fixed figure for typical bus powered application 3. Added min/max values for BOD levels 4. Added ATmega32U6 product 5. Update Errata section 6. Modified descriptions for HWUPE and WAKEUPE interrupts enable (these interrupts should be enabled only to wake up the CPU core from power down mode).446 7593L–AVR–09/12 AT90USB64/128 7. Added description to access unique serial number located in Signature Row see “Reading the Signature Row from software” on page 354. 38.8 Changes from 7593H to 7593I 1. Updated Table 9-2 in “Brown-out detection” on page 60. Unused BOD levels removed. 38.9 Changes from 7593I to 7593J 1. Updated Table 9-2 in “Brown-out detection” on page 60. BOD level 100 removed. 2. Updated “Ordering information” on page 426. 3. Removed ATmega32U6 errata section. 38.10 Changes from 7593J to 7593K 1. Corrected Figure 6-7 on page 34, Figure 6-8 on page 34 and Figure 6-9 on page 35. 2. Corrected ordering information for Section 35.3 ”Atmel AT90USB1286” on page 428, Section 35.4 ”Atmel AT90USB1287” on page 429 andSection 35.2 ”Atmel AT90USB647” on page 427. 3. Removed the ATmega32U6 device and updated the datasheet accordingly. 4. Updated Assembly Code Example in “Watchdog reset” on page 61. 38.11 Changes from 7593K to 7593L 1. Updated the “Ordering information” on page 426. Changed the speed from 20MHz to 16MHz. 2. Replaced ATmegaAT90USBxxxx by AT90USBxxxx through the datasheet. 3. Updated the first paragraph of “Overview” on page 307. Port A replaced by Port F. 4. Updated ADC equation in “ADC conversion result” on page 318. The equation has 1024 instead of 1023. 5. Created “Packaging Information” chapter. 6. Replaced the “QFN64” Packaging by an updated QFN64 Packaging drawing. 7. Updated “Errata” on page 434. AT90USB1286/7 has a fourth release, while AT90USB646/7 updated with a second release. 8. In Section “Overview” on page 307, “Port A” has been replaced by “Port F” in the first section. 9. In Section “Atmel AT90USB647” on page 427 the USB interface has been changed to USB OTG. 10. In Section “Atmel AT90USB1286” on page 428 the USB interface has been changed to Device. 11. In Section “Atmel AT90USB1287” on page 429 the USB interface has been changed to Host OTG. 12. General update according to new template.i 7593L–AVR–09/12 AT90USB64X/128X Table of contents Features ..................................................................................................... 1 1 Pin configurations ................................................................................... 3 2 Overview ................................................................................................... 5 2.1 Block diagram ..........................................................................................................6 2.2 Pin descriptions .......................................................................................................8 3 Resources ............................................................................................... 10 4 About code examples ............................................................................ 10 5 AVR CPU core ........................................................................................ 11 5.1 Introduction ............................................................................................................11 5.2 Architectural overview ...........................................................................................11 5.3 ALU – Arithmetic Logic Unit ..................................................................................12 5.4 Status register .......................................................................................................13 5.5 General purpose register file .................................................................................14 5.6 Stack pointer .........................................................................................................15 5.7 Instruction execution timing ...................................................................................16 5.8 Reset and interrupt handling .................................................................................17 6 Atmel AVR AT90USB64/128 memories ................................................ 20 6.1 In-system re-programmable flash program memory .............................................20 6.2 SRAM data memory ..............................................................................................21 6.3 EEPROM data memory .........................................................................................24 6.4 I/O memory ............................................................................................................30 6.5 External memory interface ....................................................................................31 7 System clock and clock options .......................................................... 40 7.1 Clock systems and their distribution ......................................................................40 7.2 Clock sources ........................................................................................................41 7.3 Low power crystal oscillator ..................................................................................42 7.4 Low frequency crystal oscillator ............................................................................44 7.5 Calibrated internal RC oscillator ............................................................................45 7.6 External clock ........................................................................................................46 7.7 Clock output buffer ................................................................................................47 7.8 Timer/counter oscillator .........................................................................................47 7.9 System clock prescaler .........................................................................................47ii 7593L–AVR–09/12 AT90USB64X/128X 7.10 PLL ......................................................................................................................49 8 Power management and sleep modes ................................................. 51 8.1 Idle mode ...............................................................................................................52 8.2 ADC noise reduction mode ...................................................................................52 8.3 Power-down mode ................................................................................................52 8.4 Power-save mode .................................................................................................52 8.5 Standby mode .......................................................................................................53 8.6 Extended Standby mode .......................................................................................53 8.7 Power Reduction Register .....................................................................................54 8.8 Minimizing power consumption .............................................................................55 9 System control and reset ...................................................................... 57 9.1 Resetting the AVR .................................................................................................57 9.2 Reset sources .......................................................................................................57 9.3 Power-on reset ......................................................................................................58 9.4 External reset ........................................................................................................59 9.5 Brown-out detection ..............................................................................................60 9.6 Watchdog reset .....................................................................................................61 9.7 Internal voltage reference ......................................................................................62 9.8 Watchdog timer .....................................................................................................63 10 Interrupts ................................................................................................ 68 10.1 Interrupt vectors in AT90USB64/128 ...................................................................68 11 I/O-ports .................................................................................................. 71 11.1 Introduction ..........................................................................................................71 11.2 Ports as general digital I/O ..................................................................................72 11.3 Alternate port functions .......................................................................................76 11.4 Register description for I/O-ports ........................................................................89 12 External interrupts ................................................................................. 92 13 Timer/Counter0, Timer/Counter1, and Timer/Counter3 prescalers ... 96 13.1 Internal clock source ...........................................................................................96 13.2 Prescaler reset ....................................................................................................96 13.3 External clock source ..........................................................................................96 13.4 GTCCR – General Timer/Counter Control Register ............................................97 14 8-bit Timer/Counter0 with PWM ............................................................ 98 14.1 Overview .............................................................................................................98iii 7593L–AVR–09/12 AT90USB64X/128X 14.2 Timer/Counter clock sources ...............................................................................99 14.3 Counter unit .........................................................................................................99 14.4 Output compare unit ..........................................................................................100 14.5 Compare Match Output Unit ..............................................................................102 14.6 Modes of operation ............................................................................................103 14.7 Timer/Counter timing diagrams .........................................................................107 14.8 8-bit Timer/Counter register description ............................................................108 15 16-bit Timer/Counter (Timer/Counter1 and Timer/Counter3) ........... 115 15.1 Overview ...........................................................................................................115 15.2 Accessing 16-bit registers .................................................................................117 15.3 Timer/Counter clock sources .............................................................................120 15.4 Counter unit .......................................................................................................121 15.5 Input Capture unit ..............................................................................................122 15.6 Output Compare units .......................................................................................124 15.7 Compare Match Output unit ..............................................................................126 15.8 Modes of operation ............................................................................................127 15.9 Timer/Counter timing diagrams .........................................................................134 15.10 16-bit Timer/Counter register description ........................................................136 16 8-bit Timer/Counter2 with PWM and asynchronous operation ........ 145 16.1 Overview ...........................................................................................................145 16.2 Timer/Counter clock sources .............................................................................146 16.3 Counter unit .......................................................................................................146 16.4 Output Compare unit .........................................................................................147 16.5 Compare Match Output unit ..............................................................................149 16.6 Modes of operation ............................................................................................150 16.7 Timer/Counter timing diagrams .........................................................................154 16.8 8-bit Timer/Counter register description ............................................................156 16.9 Asynchronous operation of the Timer/Counter ..................................................161 16.10 Timer/Counter prescaler ..................................................................................164 17 Output Compare Modulator (OCM1C0A) ........................................... 166 17.1 Overview ...........................................................................................................166 17.2 Description ........................................................................................................166 18 SPI – Serial Peripheral Interface ......................................................... 168 18.1 SS Pin Functionality ..........................................................................................172 18.2 Data modes .......................................................................................................175iv 7593L–AVR–09/12 AT90USB64X/128X 19 USART ................................................................................................... 177 19.1 Overview ...........................................................................................................177 19.2 Clock generation ...............................................................................................178 19.3 Frame formats ...................................................................................................180 19.4 USART initialization ...........................................................................................181 19.5 Data transmission – The USART transmitter ....................................................182 19.6 Data reception – The USART receiver ..............................................................185 19.7 Asynchronous data reception ............................................................................189 19.8 Multi-processor Communication mode ..............................................................192 19.9 USART register description ...............................................................................193 19.10 Examples of baud rate setting .........................................................................198 20 USART in SPI mode ............................................................................. 202 20.1 Overview ...........................................................................................................202 20.2 Clock generation ...............................................................................................202 20.3 SPI data modes and timing ...............................................................................203 20.4 Frame formats ...................................................................................................203 20.5 Data transfer ......................................................................................................205 20.6 USART MSPIM register description ..................................................................207 20.7 AVR USART MSPIM vs. AVR SPI ....................................................................209 21 2-wire serial interface .......................................................................... 211 21.1 Features ............................................................................................................211 21.2 2-wire Serial Interface bus definition .................................................................211 21.3 Data transfer and frame format .........................................................................212 21.4 Multi-master bus systems, arbitration and synchronization ...............................215 21.5 Overview of the TWI module .............................................................................216 21.6 TWI register description ....................................................................................219 21.7 Using the TWI ....................................................................................................222 21.8 Transmission modes .........................................................................................225 21.9 Multi-master systems and arbitration .................................................................239 22 USB controller ...................................................................................... 241 22.1 Features ............................................................................................................241 22.2 Block diagram ....................................................................................................241 22.3 Typical application implementation ...................................................................242 22.4 General operating modes ..................................................................................246 22.5 Power modes ....................................................................................................250v 7593L–AVR–09/12 AT90USB64X/128X 22.6 Speed control ....................................................................................................251 22.7 Memory management .......................................................................................252 22.8 PAD suspend ....................................................................................................253 22.9 OTG timers customizing ....................................................................................254 22.10 Plug-in detection ..............................................................................................255 22.11 ID detection .....................................................................................................256 22.12 Registers description .......................................................................................256 22.13 USB Software Operating modes .....................................................................261 23 USB device operating modes ............................................................. 262 23.1 Introduction ........................................................................................................262 23.2 Power-on and reset ...........................................................................................262 23.3 Endpoint reset ...................................................................................................262 23.4 USB reset ..........................................................................................................263 23.5 Endpoint selection .............................................................................................263 23.6 Endpoint activation ............................................................................................263 23.7 Address setup ...................................................................................................264 23.8 Suspend, wake-up and resume .........................................................................265 23.9 Detach ...............................................................................................................265 23.10 Remote Wake-up ............................................................................................266 23.11 STALL request ................................................................................................266 23.12 CONTROL endpoint management ..................................................................267 23.13 OUT endpoint management ............................................................................268 23.14 IN endpoint management ................................................................................269 23.15 Isochronous mode ...........................................................................................271 23.16 Overflow ..........................................................................................................272 23.17 Interrupts .........................................................................................................272 23.18 Registers .........................................................................................................273 24 USB host operating modes ................................................................. 285 24.1 Pipe description .................................................................................................285 24.2 Detach ...............................................................................................................285 24.3 Power-on and reset ...........................................................................................285 24.4 Device detection ................................................................................................286 24.5 Pipe selection ....................................................................................................286 24.6 Pipe configuration ..............................................................................................286 24.7 USB reset ..........................................................................................................288vi 7593L–AVR–09/12 AT90USB64X/128X 24.8 Address setup ...................................................................................................288 24.9 Remote wake-up detection ................................................................................288 24.10 USB pipe reset ................................................................................................288 24.11 Pipe data access .............................................................................................288 24.12 Control pipe management ...............................................................................289 24.13 OUT pipe management ...................................................................................289 24.14 IN Pipe management .......................................................................................290 24.15 Interrupt system ...............................................................................................291 24.16 Registers .........................................................................................................292 25 Analog Comparator ............................................................................. 304 25.1 Analog Comparator multiplexed input ...............................................................306 26 ADC – Analog to Digital Converter ..................................................... 307 26.1 Features ............................................................................................................307 26.2 Overview ...........................................................................................................307 26.3 Operation ...........................................................................................................309 26.4 Starting a conversion .........................................................................................309 26.5 Prescaling and conversion timing ......................................................................310 26.6 Changing channel or reference selection ..........................................................313 26.7 ADC noise canceler ...........................................................................................314 26.8 ADC conversion result .......................................................................................318 26.9 ADC register description ...................................................................................321 27 JTAG interface and on-chip debug system ....................................... 327 27.1 Overview ...........................................................................................................327 27.2 TAP – Test Access Port ....................................................................................327 27.3 TAP Controller ...................................................................................................329 27.4 Using the Boundary-scan chain ........................................................................330 27.5 Using the on-chip debug system .......................................................................330 27.6 On-chip debug specific JTAG instructions .........................................................331 27.7 On-chip Debug related Register in I/O memory ................................................332 27.8 Using the JTAG programming capabilities ........................................................332 27.9 Bibliography .......................................................................................................332 28 IEEE 1149.1 (JTAG) boundary-scan ................................................... 333 28.1 Features ............................................................................................................333 28.2 System overview ...............................................................................................333 28.3 Data registers ....................................................................................................333vii 7593L–AVR–09/12 AT90USB64X/128X 28.4 Boundary-scan specific JTAG instructions ........................................................335 28.5 Boundary-scan Related Register in I/O memory ...............................................336 28.6 Boundary-scan chain .........................................................................................337 28.7 Atmel AT90USB64/128 Boundary-scan order ...................................................340 28.8 Boundary-scan description language files .........................................................342 29 Boot Loader support – read-while-write self-programming ............. 343 29.1 Boot Loader features .........................................................................................343 29.2 Application and Boot Loader flash sections ......................................................343 29.3 Read-while-write and no read-while-write flash sections ...................................343 29.4 Boot Loader lock bits .........................................................................................346 29.5 Entering the Boot Loader program ....................................................................347 29.6 Addressing the flash during self-programming ..................................................350 29.7 Self-programming the flash ...............................................................................351 30 Memory programming ......................................................................... 359 30.1 Program and data memory lock bits ..................................................................359 30.2 Fuse bits ............................................................................................................360 30.3 Signature bytes .................................................................................................362 30.4 Calibration byte .................................................................................................362 30.5 Parallel programming parameters, pin mapping, and commands .....................362 30.6 Parallel programming ........................................................................................365 30.7 Serial downloading ............................................................................................373 30.8 Serial programming pin mapping ......................................................................374 30.9 Programming via the JTAG interface ................................................................377 31 Electrical characteristics for Atmel AT90USB64/128 ....................... 390 31.1 Absolute maximum ratings* ...............................................................................390 31.2 DC characteristics .............................................................................................390 31.3 External clock drive waveforms .........................................................................392 31.4 External clock drive ...........................................................................................392 31.5 Maximum speed vs. VCC ...........................................................................................................................392 31.6 2-wire serial interface characteristics ................................................................393 31.7 SPI timing characteristics ..................................................................................395 31.8 Hardware boot entrance timing characteristics .................................................396 31.9 ADC characteristics ...........................................................................................397 31.10 External data memory timing ...........................................................................399 32 Atmel AT90USB64/128 typical characteristics ................................. 404viii 7593L–AVR–09/12 AT90USB64X/128X 32.1 Input voltage levels ............................................................................................405 32.2 Output voltage levels .........................................................................................406 32.3 Power-down supply current ...............................................................................408 32.4 Power-save supply current ................................................................................409 32.5 Idle supply current .............................................................................................410 32.6 Active supply current .........................................................................................410 32.7 Reset supply current .........................................................................................411 32.8 I/O pull-up current ..............................................................................................411 32.9 Bandgap voltage ...............................................................................................412 32.10 Internal ARef voltage .......................................................................................413 32.11 USB regulator ..................................................................................................413 32.12 BOD levels ......................................................................................................414 32.13 Watchdog timer frequency ..............................................................................416 32.14 Internal RC oscillator frequency ......................................................................416 32.15 Power-on reset ................................................................................................418 33 Register summary ................................................................................ 419 34 Instruction set summary ..................................................................... 423 35 Ordering information ........................................................................... 426 35.1 Atmel AT90USB646 ..........................................................................................426 35.2 Atmel AT90USB647 ..........................................................................................427 35.3 Atmel AT90USB1286 ........................................................................................428 35.4 Atmel AT90USB1287 ........................................................................................429 36 Packaging information ........................................................................ 430 36.1 TQFP64 .............................................................................................................430 36.2 QFN64 ...............................................................................................................432 37 Errata ..................................................................................................... 434 37.1 Atmel AT90USB1287/6 errata ...........................................................................434 37.2 Atmel AT90USB646/7 errata .............................................................................442 38 Datasheet revision history for Atmel AT90USB64/128 ..................... 445 38.1 Changes from 7593A to 7593B .........................................................................445 38.2 Changes from 7593B to 7593C .........................................................................445 38.3 Changes from 7593C to 7593D .........................................................................445 38.4 Changes from 7593D to 7593E .........................................................................445 38.5 Changes from 7593E to 7593F .........................................................................445ix 7593L–AVR–09/12 AT90USB64X/128X 38.6 Changes from 7593F to 7593G .........................................................................445 38.7 Changes from 7593G to 7593H ........................................................................445 38.8 Changes from 7593H to 7593I ..........................................................................446 38.9 Changes from 7593I to 7593J ...........................................................................446 38.10 Changes from 7593J to 7593K ........................................................................446 38.11 Changes from 7593K to 7593L .......................................................................446 Table of contents ....................................................................................... i7593L–AVR–09/12 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 16F, Shin Osaki Kangyo Bldg. 1-6-4 Osaki Shinagawa-ku Tokyo 104-0032 JAPAN Tel: (+81) 3-6417-0300 Fax: (+81) 3-6417-0370 © 2012 Atmel Corporation. All rights reserved. Atmel®, Atmel logo and combinations thereof, AVR®, AVR Studio®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Windows® is a registered trademark of Microsoft Corporation in U.S. and or other countries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. 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Features • High performance, low power Atmel® AVR® 8-bit microcontroller • Advanced RISC architecture – 131 powerful instructions – most single clock cycle execution – 32 × 8 general purpose working registers – Fully static operation – Up to 20 MIPS throughput at 20MHz – On-chip 2-cycle multiplier • High endurance non-volatile memory segments – 4/8/16 Kbytes of in-system self-programmable flash program memory – 256/512/512 bytes EEPROM – 512/1K/1Kbytes internal SRAM – Write/erase cyles: 10,000 flash/100,000 EEPROM – Data retention: 20 years at 85°C/100 years at 25°C() – Optional boot code section with independent lock bits In-system programming by on-chip boot program True read-while-write operation – Programming lock for software security • QTouch® library support – Capacitive touch buttons, sliders and wheels – QTouch and QMatrix acquisition – Up to 64 sense channels • Peripheral features – Two 8-bit timer/counters with separate prescaler and compare mode – One 16-bit timer/counter with separate prescaler, compare mode, and capture mode – Real time counter with separate oscillator – Six PWM channels – 8-channel 10-bit ADC in TQFP and QFN/MLF package – 6-channel 10-bit ADC in PDIP Package – Programmable serial USART – Master/slave SPI serial interface – Byte-oriented 2-wire serial interface (Philips I2 C compatible) – Programmable watchdog timer with separate on-chip oscillator – On-chip analog comparator – Interrupt and wake-up on pin change • Special microcontroller features – DebugWIRE on-chip debug system – Power-on reset and programmable brown-out detection – Internal calibrated oscillator – External and internal interrupt sources – Five sleep modes: Idle, ADC noise reduction, power-save, power-down, and standby • I/O and packages – 23 programmable I/O lines – 28-pin PDIP, 32-lead TQFP, 28-pad QFN/MLF and 32-pad QFN/MLF • Operating voltage: – 1.8V - 5.5V for Atmel ATmega48V/88V/168V – 2.7V - 5.5V for Atmel ATmega48/88/168 • Temperature range: – -40°C to 85°C • Speed grade: – ATmega48V/88V/168V: 0 - 4MHz @ 1.8V - 5.5V, 0 - 10MHz @ 2.7V - 5.5V – ATmega48/88/168: 0 - 10MHz @ 2.7V - 5.5V, 0 - 20MHz @ 4.5V - 5.5V • Low power consumption – Active mode: 250µA at 1MHz, 1.8V 15µA at 32kHz, 1.8V (including oscillator) – Power-down mode: 0.1µA at 1.8V Note: 1. See “Data retention” on page 8 for details. 8-bit Atmel Microcontroller with 4/8/16K Bytes In-System Programmable Flash ATmega48/V ATmega88/V ATmega168/V Rev. 2545T–AVR–05/112 2545T–AVR–05/11 ATmega48/88/168 1. Pin configurations Figure 1-1. Pinout Atmel ATmega48/88/168. 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 (PCINT19/OC2B/INT1) PD3 (PCINT20/XCK/T0) PD4 GND VCC GND VCC (PCINT6/XTAL1/TOSC1) PB6 (PCINT7/XTAL2/TOSC2) PB7 PC1 (ADC1/PCINT9) PC0 (ADC0/PCINT8) ADC7 GND AREF ADC6 AVCC PB5 (SCK/PCINT5) 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 (PCINT21/OC0B/T1) PD5 (PCINT22/OC0A/AIN0) PD6 (PCINT23/AIN1) PD7 (PCINT0/CLKO/ICP1) PB0 (PCINT1/OC1A) PB1 (PCINT2/SS/OC1B) PB2 (PCINT3/OC2A/MOSI) PB3 (PCINT4/MISO) PB4 PD2 (INT0/PCINT18) PD1 (TXD/PCINT17) PD0 (RXD/PCINT16) PC6 (RESET/PCINT14) PC5 (ADC5/SCL/PCINT13) PC4 (ADC4/SDA/PCINT12) PC3 (ADC3/PCINT11) PC2 (ADC2/PCINT10) TQFP Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 (PCINT14/RESET) PC6 (PCINT16/RXD) PD0 (PCINT17/TXD) PD1 (PCINT18/INT0) PD2 (PCINT19/OC2B/INT1) PD3 (PCINT20/XCK/T0) PD4 VCC GND (PCINT6/XTAL1/TOSC1) PB6 (PCINT7/XTAL2/TOSC2) PB7 (PCINT21/OC0B/T1) PD5 (PCINT22/OC0A/AIN0) PD6 (PCINT23/AIN1) PD7 (PCINT0/CLKO/ICP1) PB0 PC5 (ADC5/SCL/PCINT13) PC4 (ADC4/SDA/PCINT12) PC3 (ADC3/PCINT11) PC2 (ADC2/PCINT10) PC1 (ADC1/PCINT9) PC0 (ADC0/PCINT8) GND AREF AVCC PB5 (SCK/PCINT5) PB4 (MISO/PCINT4) PB3 (MOSI/OC2A/PCINT3) PB2 (SS/OC1B/PCINT2) PB1 (OC1A/PCINT1) PDIP 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 32 MLF Top View (PCINT19/OC2B/INT1) PD3 (PCINT20/XCK/T0) PD4 GND VCC GND VCC (PCINT6/XTAL1/TOSC1) PB6 (PCINT7/XTAL2/TOSC2) PB7 PC1 (ADC1/PCINT9) PC0 (ADC0/PCINT8) ADC7 GND AREF ADC6 AVCC PB5 (SCK/PCINT5) (PCINT21/OC0B/T1) PD5 (PCINT22/OC0A/AIN0) PD6 (PCINT23/AIN1) PD7 (PCINT0/CLKO/ICP1) PB0 (PCINT1/OC1A) PB1 (PCINT2/SS/OC1B) PB2 (PCINT3/OC2A/MOSI) PB3 (PCINT4/MISO) PB4 PD2 (INT0/PCINT18) PD1 (TXD/PCINT17) PD0 (RXD/PCINT16) PC6 (RESET/PCINT14) PC5 (ADC5/SCL/PCINT13) PC4 (ADC4/SDA/PCINT12) PC3 (ADC3/PCINT11) PC2 (ADC2/PCINT10) NOTE: Bottom pad should be soldered to ground. 1 2 3 4 5 6 7 21 20 19 18 17 16 15 28 27 26 25 24 23 22 8 9 10 11 12 13 14 28 MLF Top View (PCINT19/OC2B/INT1) PD3 (PCINT20/XCK/T0) PD4 VCC GND (PCINT6/XTAL1/TOSC1) PB6 (PCINT7/XTAL2/TOSC2) PB7 (PCINT21/OC0B/T1) PD5 (PCINT22/OC0A/AIN0) PD6 (PCINT23/AIN1) PD7 (PCINT0/CLKO/ICP1) PB0 (PCINT1/OC1A) PB1 (PCINT2/SS/OC1B) PB2 (PCINT3/OC2A/MOSI) PB3 (PCINT4/MISO) PB4 PD2 (INT0/PCINT18) PD1 (TXD/PCINT17) PD0 (RXD/PCINT16) PC6 (RESET/PCINT14) PC5 (ADC5/SCL/PCINT13) PC4 (ADC4/SDA/PCINT12) PC3 (ADC3/PCINT11) PC2 (ADC2/PCINT10) PC1 (ADC1/PCINT9) PC0 (ADC0/PCINT8) GND AREF AVCC PB5 (SCK/PCINT5) NOTE: Bottom pad should be soldered to ground.3 2545T–AVR–05/11 ATmega48/88/168 1.1 Pin descriptions 1.1.1 VCC Digital supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB7:0) XTAL1/XTAL2/TOSC1/TOSC2 Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Depending on the clock selection fuse settings, PB6 can be used as input to the inverting Oscillator amplifier and input to the internal clock operating circuit. Depending on the clock selection fuse settings, PB7 can be used as output from the inverting Oscillator amplifier. If the Internal Calibrated RC Oscillator is used as chip clock source, PB7..6 is used as TOSC2..1 input for the Asynchronous Timer/Counter2 if the AS2 bit in ASSR is set. The various special features of Port B are elaborated in “Alternate functions of port B” on page 78 and “System clock and clock options” on page 27. 1.1.4 Port C (PC5:0) Port C is a 7-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The PC5..0 output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. 1.1.5 PC6/RESET If the RSTDISBL Fuse is programmed, PC6 is used as an I/O pin. Note that the electrical characteristics of PC6 differ from those of the other pins of Port C. If the RSTDISBL Fuse is unprogrammed, PC6 is used as a Reset input. A low level on this pin for longer than the minimum pulse length will generate a Reset, even if the clock is not running. The minimum pulse length is given in Table 29-3 on page 307. Shorter pulses are not guaranteed to generate a Reset. The various special features of Port C are elaborated in “Alternate functions of port C” on page 81. 1.1.6 Port D (PD7:0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up4 2545T–AVR–05/11 ATmega48/88/168 resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. The various special features of Port D are elaborated in “Alternate functions of port D” on page 84. 1.1.7 AVCC AVCC is the supply voltage pin for the A/D Converter, PC3:0, and ADC7:6. It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. Note that PC6..4 use digital supply voltage, VCC. 1.1.8 AREF AREF is the analog reference pin for the A/D Converter. 1.1.9 ADC7:6 (TQFP and QFN/MLF package only) In the TQFP and QFN/MLF package, ADC7:6 serve as analog inputs to the A/D converter. These pins are powered from the analog supply and serve as 10-bit ADC channels.5 2545T–AVR–05/11 ATmega48/88/168 2. Overview The Atmel ATmega48/88/168 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega48/88/168 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block diagram Figure 2-1. Block diagram. The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting PORT D (8) PORT B (8) PORT C (7) USART 0 8bit T/C 2 8bit T/C 0 16bit T/C 1 A/D conv. Internal bandgap Analog comp. SPI TWI Flash SRAM EEPROM Watchdog oscillator Watchdog timer Oscillator circuits / clock generation Power supervision POR / BOD & RESET GND VCC PROGRAM LOGIC debugWIRE 2 GND AREF AVCC DATABUS PD[0..7] PB[0..7] PC[0..6] ADC[6..7] 6 RESET XTAL[1..2] CPU6 2545T–AVR–05/11 ATmega48/88/168 architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The Atmel ATmega48/88/168 provides the following features: 4K/8K/16K bytes of In-System Programmable Flash with Read-While-Write capabilities, 256/512/512 bytes EEPROM, 512/1K/1K bytes SRAM, 23 general purpose I/O lines, 32 general purpose working registers, three flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, a byte-oriented 2-wire Serial Interface, an SPI serial port, a 6-channel 10-bit ADC (8 channels in TQFP and QFN/MLF packages), a programmable Watchdog Timer with internal Oscillator, and five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, USART, 2-wire Serial Interface, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or hardware reset. In Power-save mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except asynchronous timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low power consumption. Atmel offers the QTouch Library for embedding capacitive touch buttons, sliders and wheels functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambigiuous detection of key events. The easy-to-use QTouch Suite toolchain allows you to explore, develop and debug your own touch applications. The device is manufactured using the Atmel high density non-volatile memory technology. The On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI serial interface, by a conventional non-volatile memory programmer, or by an On-chip Boot program running on the AVR core. The Boot program can use any interface to download the application program in the Application Flash memory. Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega48/88/168 is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The ATmega48/88/168 AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators, and Evaluation kits. 2.2 Comparison between Atmel ATmega48, Atmel ATmega88, and Atmel ATmega168 The ATmega48, ATmega88 and ATmega168 differ only in memory sizes, boot loader support, and interrupt vector sizes. Table 2-1 summarizes the different memory and interrupt vector sizes for the three devices. Table 2-1. Memory size summary. Device Flash EEPROM RAM Interrupt vector size ATmega48 4Kbytes 256Bytes 512Bytes 1 instruction word/vector ATmega88 8Kbytes 512Bytes 1Kbytes 1 instruction word/vector ATmega168 16Kbytes 512Bytes 1Kbytes 2 instruction words/vector7 2545T–AVR–05/11 ATmega48/88/168 ATmega88 and ATmega168 support a real Read-While-Write Self-Programming mechanism. There is a separate Boot Loader Section, and the SPM instruction can only execute from there. In ATmega48, there is no Read-While-Write support and no separate Boot Loader Section. The SPM instruction can execute from the entire Flash.8 2545T–AVR–05/11 ATmega48/88/168 3. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 4. Data retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 5. About code examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. 6. Capacitive touch sensing The Atmel QTouch Library provides a simple to use solution to realize touch sensitive interfaces on most Atmel AVR microcontrollers. The QTouch Library includes support for the QTouch and QMatrix acquisition methods. Touch sensing can be added to any application by linking the appropriate Atmel QTouch Library for the AVR Microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the touch sensing API’s to retrieve the channel information and determine the touch sensor states. The QTouch Library is FREE and downloadable from the Atmel website at the following location: www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the Atmel QTouch Library User Guide - also available for download from the Atmel website.9 2545T–AVR–05/11 ATmega48/88/168 7. AVR CPU core 7.1 Overview This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 7.2 Architectural overview Figure 7-1. Block diagram of the AVR architecture. In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is In-System Reprogrammable Flash memory. Flash program memory Instruction register Instruction decoder Program counter Control lines 32 x 8 general purpose registrers ALU Status and control I/O lines EEPROM Data bus 8-bit Data SRAM Direct addressing Indirect addressing Interrupt unit SPI unit Watchdog timer Analog comparator I/O module 2 I/O module 1 I/O module n10 2545T–AVR–05/11 ATmega48/88/168 The fast-access Register File contains 32 × 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash program memory. These added function registers are the 16-bit X-register, Y-register, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every program memory address contains a 16-bit or 32-bit instruction. Program Flash memory space is divided in two sections, the Boot Program section and the Application Program section. Both sections have dedicated Lock bits for write and read/write protection. The SPM instruction that writes into the Application Flash memory section must reside in the Boot Program section. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. In addition, the ATmega48/88/168 has Extended I/O space from 0x60 - 0xFF in SRAM where only the ST/STS/STD and LD/LDS/LDD instructions can be used. 7.3 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See “Instruction set summary” on page 347 for a detailed description.11 2545T–AVR–05/11 ATmega48/88/168 7.4 Status register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. 7.4.1 SREG – AVR Status Register The AVR Status Register – SREG – is defined as: • Bit 7 – I: Global interrupt enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the instruction set reference. • Bit 6 – T: Bit copy storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half carry flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is useful in BCD arithmetic. See the “Instruction Set Description” for detailed information. • Bit 4 – S: Sign bit, S = N ⊕ V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Description” for detailed information. • Bit 3 – V: Two’s complement overflow flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Description” for detailed information. • Bit 2 – N: Negative flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 1 – Z: Zero flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. Bit 7 6 5 4 3 2 1 0 0x3F (0x5F) I T H S V N Z C SREG Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 012 2545T–AVR–05/11 ATmega48/88/168 • Bit 0 – C: Carry flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. 7.5 General purpose register file The register file is optimized for the AVR enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the register file: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 7-2 shows the structure of the 32 general purpose working registers in the CPU. Figure 7-2. AVR CPU general purpose working registers. Most of the instructions operating on the register file have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 7-2, each register is also assigned a data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file. 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E purpose R15 0x0F working R16 0x10 registers R17 0x11 … R26 0x1A X-register low byte R27 0x1B X-register high byte R28 0x1C Y-register low byte R29 0x1D Y-register high byte R30 0x1E Z-register low byte R31 0x1F Z-register high byte13 2545T–AVR–05/11 ATmega48/88/168 7.5.1 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 7-3. Figure 7-3. The X-, Y-, and Z-registers. In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the instruction set reference for details). 7.6 Stack pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x0100, preferably RAMEND. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 15 XH XL 0 X-register 7 07 0 R27 (0x1B) R26 (0x1A) 15 YH YL 0 Y-register 7 07 0 R29 (0x1D) R28 (0x1C) 15 ZH ZL 0 Z-register 70 7 0 R31 (0x1F) R30 (0x1E)14 2545T–AVR–05/11 ATmega48/88/168 7.6.1 SPH and SPL – Stack pointer high and stack pointer low register 7.7 Instruction execution timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 7-4 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Figure 7-4. The parallel instruction fetches and instruction executions. Figure 7-5 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 7-5. Single cycle ALU operation. Bit 15 14 13 12 11 10 9 8 0x3E (0x5E) SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH 0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 76543210 Read/write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND clk 1st instruction fetch 1st instruction execute 2nd instruction fetch 2nd instruction execute 3rd instruction fetch 3rd instruction execute 4th instruction fetch T1 T2 T3 T4 CPU Total execution time Register operands fetch ALU operation execute Result write back T1 T2 T3 T4 clkCPU15 2545T–AVR–05/11 ATmega48/88/168 7.8 Reset and interrupt handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate program vector in the program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. Depending on the Program Counter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12 are programmed. This feature improves software security. See the section “Memory programming” on page 285 for details. The lowest addresses in the program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 56. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSEL bit in the MCU Control Register (MCUCR). Refer to “Interrupts” on page 56 for more information. The Reset Vector can also be moved to the start of the Boot Flash section by programming the BOOTRST Fuse, see “Boot loader support – Read-while-write self-programming, Atmel ATmega88 and Atmel ATmega168” on page 269. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence.16 2545T–AVR–05/11 ATmega48/88/168 When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in this example. 7.8.1 Interrupt response time The interrupt execution response for all the enabled AVR interrupts is four clock cycles minimum. After four clock cycles the program vector address for the actual interrupt handling routine is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack. The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt execution response time is increased by four clock cycles. This increase comes in addition to the start-up time from the selected sleep mode. A return from an interrupt handling routine takes four clock cycles. During these four clock cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is incremented by two, and the I-bit in SREG is set. Assembly code example in r16, SREG ; store SREG value cli ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C code example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ _CLI(); EECR |= (1< xxx ... ... ... ... 22 0x015 ADC ADC conversion complete 23 0x016 EE READY EEPROM ready 24 0x017 ANALOG COMP Analog comparator 25 0x018 TWI 2-wire serial interface 26 0x019 SPM READY Store program memory ready Table 12-1. Reset and interrupt vectors in ATmega48. (Continued) Vector no. Program address Source Interrupt definition58 2545T–AVR–05/11 ATmega48/88/168 12.3 Interrupt vectors in Atmel ATmega88 Notes: 1. When the BOOTRST fuse is programmed, the device will jump to the boot loader address at reset, see “Boot loader support – Read-while-write self-programming, Atmel ATmega88 and Atmel ATmega168” on page 269. 2. When the IVSEL bit in MCUCR is set, interrupt vectors will be moved to the start of the boot flash section. The address of each Interrupt Vector will then be the address in this table added to the start address of the boot flash section. Table 12-3 on page 59 shows reset and interrupt vectors placement for the various combinations of BOOTRST and IVSEL settings. If the program never enables an interrupt source, the Interrupt Vectors are not used, and regular program code can be placed at these locations. This is also the case if the reset vector is in the application section while the interrupt vectors are in the boot section or vice versa. Table 12-2. Reset and interrupt vectors in ATmega88. Vector no. Program address(2) Source Interrupt definition 1 0x000(1) RESET External pin, power-on reset, brown-out reset and watchdog system reset 2 0x001 INT0 External interrupt request 0 3 0x002 INT1 External interrupt request 1 4 0x003 PCINT0 Pin change interrupt request 0 5 0x004 PCINT1 Pin change interrupt request 1 6 0x005 PCINT2 Pin change interrupt request 2 7 0x006 WDT Watchdog time-out interrupt 8 0x007 TIMER2 COMPA Timer/Counter2 compare match A 9 0x008 TIMER2 COMPB Timer/Counter2 compare match B 10 0x009 TIMER2 OVF Timer/Counter2 overflow 11 0x00A TIMER1 CAPT Timer/Counter1 capture event 12 0x00B TIMER1 COMPA Timer/Counter1 compare match A 13 0x00C TIMER1 COMPB Timer/Coutner1 compare match B 14 0x00D TIMER1 OVF Timer/Counter1 overflow 15 0x00E TIMER0 COMPA Timer/Counter0 compare match A 16 0x00F TIMER0 COMPB Timer/Counter0 compare match B 17 0x010 TIMER0 OVF Timer/Counter0 overflow 18 0x011 SPI, STC SPI serial transfer complete 19 0x012 USART, RX USART Rx complete 20 0x013 USART, UDRE USART, data register empty 21 0x014 USART, TX USART, Tx complete 22 0x015 ADC ADC conversion complete 23 0x016 EE READY EEPROM ready 24 0x017 ANALOG COMP Analog comparator 25 0x018 TWI 2-wire serial interface 26 0x019 SPM READY Store program memory ready59 2545T–AVR–05/11 ATmega48/88/168 Note: 1. The boot reset address is shown in Table 27-6 on page 281. For the BOOTRST Fuse “1” means unprogrammed while “0” means programmed. The most typical and general program setup for the reset and interrupt vector addresses in ATmega88 is: Address Labels Code Comments 0x000 rjmp RESET ; Reset Handler 0x001 rjmp EXT_INT0 ; IRQ0 Handler 0x002 rjmp EXT_INT1 ; IRQ1 Handler 0x003 rjmp PCINT0 ; PCINT0 Handler 0x004 rjmp PCINT1 ; PCINT1 Handler 0x005 rjmp PCINT2 ; PCINT2 Handler 0x006 rjmp WDT ; Watchdog Timer Handler 0x007 rjmp TIM2_COMPA ; Timer2 Compare A Handler 0X008 rjmp TIM2_COMPB ; Timer2 Compare B Handler 0x009 rjmp TIM2_OVF ; Timer2 Overflow Handler 0x00A rjmp TIM1_CAPT ; Timer1 Capture Handler 0x00B rjmp TIM1_COMPA ; Timer1 Compare A Handler 0x00C rjmp TIM1_COMPB ; Timer1 Compare B Handler 0x00D rjmp TIM1_OVF ; Timer1 Overflow Handler 0x00E rjmp TIM0_COMPA ; Timer0 Compare A Handler 0x00F rjmp TIM0_COMPB ; Timer0 Compare B Handler 0x010 rjmp TIM0_OVF ; Timer0 Overflow Handler 0x011 rjmp SPI_STC ; SPI Transfer Complete Handler 0x012 rjmp USART_RXC ; USART, RX Complete Handler 0x013 rjmp USART_UDRE ; USART, UDR Empty Handler 0x014 rjmp USART_TXC ; USART, TX Complete Handler 0x015 rjmp ADC ; ADC Conversion Complete Handler 0x016 rjmp EE_RDY ; EEPROM Ready Handler 0x017 rjmp ANA_COMP ; Analog Comparator Handler 0x018 rjmp TWI ; 2-wire Serial Interface Handler 0x019 rjmp SPM_RDY ; Store Program Memory Ready Handler ; 0x01ARESET: ldi r16, high(RAMEND); Main program start 0x01B out SPH,r16 ; Set Stack Pointer to top of RAM 0x01C ldi r16, low(RAMEND) 0x01D out SPL,r16 0x01E sei ; Enable interrupts 0x01F xxx Table 12-3. Reset and interrupt vectors placement in Atmel ATmega88(1). BOOTRST IVSEL Reset address Interrupt vectors start address 1 0 0x000 0x001 1 1 0x000 Boot reset address + 0x001 0 0 Boot reset address 0x001 0 1 Boot reset address Boot reset address + 0x00160 2545T–AVR–05/11 ATmega48/88/168 When the BOOTRST fuse is unprogrammed, the boot section size set to 2Kbytes and the IVSEL bit in the MCUCR register is set before any interrupts are enabled, the most typical and general program setup for the reset and interrupt vector addresses in Atmel ATmega88 is: Address Labels Code Comments 0x000 RESET: ldi r16,high(RAMEND); Main program start 0x001 out SPH,r16 ; Set Stack Pointer to top of RAM 0x002 ldi r16,low(RAMEND) 0x003 out SPL,r16 0x004 sei ; Enable interrupts 0x005 xxx ; .org 0xC01 0xC01 rjmp EXT_INT0 ; IRQ0 Handler 0xC02 rjmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0xC19 rjmp SPM_RDY ; Store Program Memory Ready Handler When the BOOTRST fuse is programmed and the boot section size set to 2Kbytes, the most typical and general program setup for the reset and interrupt vector addresses in ATmega88 is: Address Labels Code Comments .org 0x001 0x001 rjmp EXT_INT0 ; IRQ0 Handler 0x002 rjmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x019 rjmp SPM_RDY ; Store Program Memory Ready Handler ; .org 0xC00 0xC00 RESET: ldi r16,high(RAMEND); Main program start 0xC01 out SPH,r16 ; Set Stack Pointer to top of RAM 0xC02 ldi r16,low(RAMEND) 0xC03 out SPL,r16 0xC04 sei ; Enable interrupts 0xC05 xxx When the BOOTRST fuse is programmed, the boot section size set to 2Kbytes and the IVSEL bit in the MCUCR register is set before any interrupts are enabled, the most typical and general program setup for the reset and interrupt vector addresses in ATmega88 is: Address Labels Code Comments ; .org 0xC00 0xC00 rjmp RESET ; Reset handler 0xC01 rjmp EXT_INT0 ; IRQ0 Handler 0xC02 rjmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0xC19 rjmp SPM_RDY ; Store Program Memory Ready Handler ; 0xC1A RESET: ldi r16,high(RAMEND); Main program start 0xC1B out SPH,r16 ; Set Stack Pointer to top of RAM61 2545T–AVR–05/11 ATmega48/88/168 0xC1C ldi r16,low(RAMEND) 0xC1D out SPL,r16 0xC1E sei ; Enable interrupts 0xC1F xxx 12.4 Interrupt vectors in Atmel ATmega168 Notes: 1. When the BOOTRST fuse is programmed, the device will jump to the boot loader address at reset, see “Boot loader support – Read-while-write self-programming, Atmel ATmega88 and Atmel ATmega168” on page 269. 2. When the IVSEL bit in MCUCR is set, interrupt vectors will be moved to the start of the boot flash section. The address of each Interrupt Vector will then be the address in this table added to the start address of the boot flash section. Table 12-4. Reset and interrupt vectors in ATmega168. Vector no. Program address(2) Source Interrupt definition 1 0x0000(1) RESET External pin, power-on reset, brown-out reset and watchdog system reset 2 0x0002 INT0 External interrupt request 0 3 0x0004 INT1 External interrupt request 1 4 0x0006 PCINT0 Pin change interrupt request 0 5 0x0008 PCINT1 Pin change interrupt request 1 6 0x000A PCINT2 Pin change interrupt request 2 7 0x000C WDT Watchdog time-out interrupt 8 0x000E TIMER2 COMPA Timer/Counter2 compare match A 9 0x0010 TIMER2 COMPB Timer/Counter2 compare match B 10 0x0012 TIMER2 OVF Timer/Counter2 overflow 11 0x0014 TIMER1 CAPT Timer/Counter1 capture event 12 0x0016 TIMER1 COMPA Timer/Counter1 compare match A 13 0x0018 TIMER1 COMPB Timer/Coutner1 compare match B 14 0x001A TIMER1 OVF Timer/Counter1 overflow 15 0x001C TIMER0 COMPA Timer/Counter0 compare match A 16 0x001E TIMER0 COMPB Timer/Counter0 compare match B 17 0x0020 TIMER0 OVF Timer/Counter0 overflow 18 0x0022 SPI, STC SPI serial transfer complete 19 0x0024 USART, RX USART Rx complete 20 0x0026 USART, UDRE USART, data register empty 21 0x0028 USART, TX USART, Tx complete 22 0x002A ADC ADC conversion complete 23 0x002C EE READY EEPROM ready 24 0x002E ANALOG COMP Analog comparator 25 0x0030 TWI 2-wire serial interface 26 0x0032 SPM READY Store program memory ready62 2545T–AVR–05/11 ATmega48/88/168 Table 12-5 shows reset and interrupt vectors placement for the various combinations of BOOTRST and IVSEL settings. If the program never enables an interrupt source, the interrupt vectors are not used, and regular program code can be placed at these locations. This is also the case if the reset vector is in the application section while the interrupt vectors are in the boot section or vice versa. Note: 1. The boot reset address is shown in Table 27-6 on page 281. For the BOOTRST fuse “1” means unprogrammed while “0” means programmed. The most typical and general program setup for the reset and interrupt vector addresses in ATmega168 is: Address Labels Code Comments 0x0000 jmp RESET ; Reset Handler 0x0002 jmp EXT_INT0 ; IRQ0 Handler 0x0004 jmp EXT_INT1 ; IRQ1 Handler 0x0006 jmp PCINT0 ; PCINT0 Handler 0x0008 jmp PCINT1 ; PCINT1 Handler 0x000A jmp PCINT2 ; PCINT2 Handler 0x000C jmp WDT ; Watchdog Timer Handler 0x000E jmp TIM2_COMPA ; Timer2 Compare A Handler 0x0010 jmp TIM2_COMPB ; Timer2 Compare B Handler 0x0012 jmp TIM2_OVF ; Timer2 Overflow Handler 0x0014 jmp TIM1_CAPT ; Timer1 Capture Handler 0x0016 jmp TIM1_COMPA ; Timer1 Compare A Handler 0x0018 jmp TIM1_COMPB ; Timer1 Compare B Handler 0x001A jmp TIM1_OVF ; Timer1 Overflow Handler 0x001C jmp TIM0_COMPA ; Timer0 Compare A Handler 0x001E jmp TIM0_COMPB ; Timer0 Compare B Handler 0x0020 jmp TIM0_OVF ; Timer0 Overflow Handler 0x0022 jmp SPI_STC ; SPI Transfer Complete Handler 0x0024 jmp USART_RXC ; USART, RX Complete Handler 0x0026 jmp USART_UDRE ; USART, UDR Empty Handler 0x0028 jmp USART_TXC ; USART, TX Complete Handler 0x002A jmp ADC ; ADC Conversion Complete Handler 0x002C jmp EE_RDY ; EEPROM Ready Handler 0x002E jmp ANA_COMP ; Analog Comparator Handler 0x0030 jmp TWI ; 2-wire Serial Interface Handler 0x0032 jmp SPM_RDY ; Store Program Memory Ready Handler ; 0x0033RESET: ldi r16, high(RAMEND); Main program start Table 12-5. Reset and interrupt vectors placement in Atmel ATmega168(1). BOOTRST IVSEL Reset address Interrupt vectors start address 1 0 0x000 0x001 1 1 0x000 Boot reset address + 0x0002 0 0 Boot reset address 0x001 0 1 Boot reset address Boot reset address + 0x000263 2545T–AVR–05/11 ATmega48/88/168 0x0034 out SPH,r16 ; Set Stack Pointer to top of RAM 0x0035 ldi r16, low(RAMEND) 0x0036 out SPL,r16 0x0037 sei ; Enable interrupts 0x0038 xxx ... ... ... ... When the BOOTRST fuse is unprogrammed, the boot section size set to 2Kbytes and the IVSEL bit in the MCUCR Register is set before any interrupts are enabled, the most typical and general program setup for the reset and interrupt vector addresses in Atmel ATmega168 is: Address Labels Code Comments 0x0000 RESET: ldi r16,high(RAMEND); Main program start 0x0001 out SPH,r16 ; Set Stack Pointer to top of RAM 0x0002 ldi r16,low(RAMEND) 0x0003 out SPL,r16 0x0004 sei ; Enable interrupts 0x0005 xxx ; .org 0xC02 0x1C02 jmp EXT_INT0 ; IRQ0 Handler 0x1C04 jmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x1C32 jmp SPM_RDY ; Store Program Memory Ready Handler When the BOOTRST fuse is programmed and the boot section size set to 2Kbytes, the most typical and general program setup for the reset and interrupt vector addresses in ATmega168 is: Address Labels Code Comments .org 0x0002 0x0002 jmp EXT_INT0 ; IRQ0 Handler 0x0004 jmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x0032 jmp SPM_RDY ; Store Program Memory Ready Handler ; .org 0x1C00 0x1C00 RESET: ldi r16,high(RAMEND); Main program start 0x1C01 out SPH,r16 ; Set Stack Pointer to top of RAM 0x1C02 ldi r16,low(RAMEND) 0x1C03 out SPL,r16 0x1C04 sei ; Enable interrupts 0x1C05 xxx When the BOOTRST fuse is programmed, the boot section size set to 2Kbytes and the IVSEL bit in the MCUCR register is set before any interrupts are enabled, the most typical and general program setup for the reset and interrupt vector addresses in ATmega168 is:64 2545T–AVR–05/11 ATmega48/88/168 Address Labels Code Comments ; .org 0x1C00 0x1C00 jmp RESET ; Reset handler 0x1C02 jmp EXT_INT0 ; IRQ0 Handler 0x1C04 jmp EXT_INT1 ; IRQ1 Handler ... ... ... ; 0x1C32 jmp SPM_RDY ; Store Program Memory Ready Handler ; 0x1C33 RESET: ldi r16,high(RAMEND); Main program start 0x1C34 out SPH,r16 ; Set Stack Pointer to top of RAM 0x1C35 ldi r16,low(RAMEND) 0x1C36 out SPL,r16 0x1C37 sei ; Enable interrupts 0x1C38 xxx 12.4.1 Moving interrupts between application and boot space, Atmel ATmega88 and Atmel ATmega168 The MCU control register controls the placement of the interrupt vector table. 12.5 Register description 12.5.1 MCUCR – MCU control register • Bit 1 – IVSEL: Interrupt vector select When the IVSEL bit is cleared (zero), the interrupt vectors are placed at the start of the flash memory. When this bit is set (one), the interrupt vectors are moved to the beginning of the boot loader section of the flash. The actual address of the start of the boot flash section is determined by the BOOTSZ fuses. Refer to the section “Boot loader support – Read-while-write self-programming, Atmel ATmega88 and Atmel ATmega168” on page 269 for details. To avoid unintentional changes of interrupt vector tables, a special write procedure must be followed to change the IVSEL bit: a. Write the interrupt vector change enable (IVCE) bit to one. b. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE. Interrupts will automatically be disabled while this sequence is executed. Interrupts are disabled in the cycle IVCE is set, and they remain disabled until after the instruction following the write to IVSEL. If IVSEL is not written, interrupts remain disabled for four cycles. The I-bit in the status register is unaffected by the automatic disabling. Note: If interrupt vectors are placed in the boot loader section and boot lock bit BLB02 is programmed, interrupts are disabled while executing from the Application section. If interrupt vectors are placed in the Application section and boot lock bit BLB12 is programmed, interrupts are disabled while executing from the Boot Loader section. Refer to the section “Boot loader support – Read-whilewrite self-programming, Atmel ATmega88 and Atmel ATmega168” on page 269 for details on Boot Lock bits. This bit is not available in Atmel ATmega48. Bit 7 6 5 4 3 2 1 0 0x35 (0x55) – – – PUD – – IVSEL IVCE MCUCR Read/write R R R R/W R R R/W R/W Initial value 0 0 0 0 0 0 0 065 2545T–AVR–05/11 ATmega48/88/168 • Bit 0 – IVCE: Interrupt vector change enable The IVCE bit must be written to logic one to enable change of the IVSEL bit. IVCE is cleared by hardware four cycles after it is written or when IVSEL is written. Setting the IVCE bit will disable interrupts, as explained in the IVSEL description above. See code example below. This bit is not available in Atmel ATmega48. Assembly code example Move_interrupts: ; Get MCUCR in r16, MCUCR mov r17, r16 ; Enable change of Interrupt Vectors ori r16, (1< CSn2:0 > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execution. However, care must be taken if the other Timer/Counter that shares the same prescaler also uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it is connected to. 17.0.3 External clock source An external clock source applied to the T1/T0 pin can be used as Timer/Counter clock (clkT1/clkT0). The T1/T0 pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 17-1 shows a functional equivalent block diagram of the T1/T0 synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkT1/clkT0 pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 17-1. T1/T0 pin sampling. The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the T1/T0 pin to the counter is updated. Tn_sync (to clock select logic) Synchronization Edge detector D Q D Q LE Tn D Q clkI/O138 2545T–AVR–05/11 ATmega48/88/168 Enabling and disabling of the clock input must be done when T1/T0 has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 17-2. Prescaler for timer/counter0 and timer/counter1(1). Note: 1. The synchronization logic on the input pins (T1/T0) is shown in Figure 17-1 on page 137. PSRSYNC Clear clkT1 clkT0 T1 T0 clkI/O Synchronization Synchronization139 2545T–AVR–05/11 ATmega48/88/168 17.1 Register description 17.1.1 GTCCR – General timer/counter control register • Bit 7 – TSM: Timer/counter synchronization mode Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the value that is written to the PSRASY and PSRSYNC bits is kept, hence keeping the corresponding prescaler reset signals asserted. This ensures that the corresponding Timer/Counters are halted and can be configured to the same value without the risk of one of them advancing during configuration. When the TSM bit is written to zero, the PSRASY and PSRSYNC bits are cleared by hardware, and the Timer/Counters start counting simultaneously. • Bit 0 – PSRSYNC: Prescaler reset When this bit is one, Timer/Counter1 and Timer/Counter0 prescaler will be Reset. This bit is normally cleared immediately by hardware, except if the TSM bit is set. Note that Timer/Counter1 and Timer/Counter0 share the same prescaler and a reset of this prescaler will affect both timers. Bit 7 6 5 4 3 2 1 0 0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR Read/write R/W R R R R R R/W R/W Initial value 0 0 0 0 0 0 0 0140 2545T–AVR–05/11 ATmega48/88/168 18. 8-bit Timer/Counter2 with PWM and asynchronous operation 18.1 Features • Single channel counter • Clear timer on compare match (auto reload) • Glitch-free, phase correct pulse width modulator (PWM) • Frequency generator • 10-bit clock prescaler • Overflow and compare match interrupt sources (TOV2, OCF2A and OCF2B) • Allows clocking from external 32kHz watch crystal independent of the I/O clock 18.2 Overview Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 18-1. For the actual placement of I/O pins, refer to “Pinout Atmel ATmega48/88/168.” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “Register description” on page 153. The PRTIM2 bit in “Minimizing power consumption” on page 41 must be written to zero to enable Timer/Counter2 module. Figure 18-1. 8-bit timer/counter block diagram. Clock select Timer/counter DATA BUS OCRnA OCRnB = = TCNTn Waveform generation Waveform generation OCnA OCnB = Fixed TOP value Control logic = 0 TOP BOTTOM Count Clear Direction TOVn (Int.req.) OCnA (Int.req.) OCnB (Int.req.) TCCRnA TCCRnB Tn Edge detector (From prescaler) clkTn141 2545T–AVR–05/11 ATmega48/88/168 18.2.1 Registers The Timer/Counter (TCNT2) and Output Compare Register (OCR2A and OCR2B) are 8-bit registers. Interrupt request (shorten as Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFR2). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK2). TIFR2 and TIMSK2 are not shown in the figure. The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock source he Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the Clock Select logic is referred to as the timer clock (clkT2). The double buffered Output Compare Register (OCR2A and OCR2B) are compared with the Timer/Counter value at all times. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pins (OC2A and OC2B). See “Output compare unit” on page 142. for details. The compare match event will also set the Compare Flag (OCF2A or OCF2B) which can be used to generate an Output Compare interrupt request. 18.2.2 Definitions Many register and bit references in this document are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 2. However, when using the register or bit defines in a program, the precise form must be used, that is, TCNT2 for accessing Timer/Counter2 counter value and so on. The definitions in Table 18-1 are also used extensively throughout the section. 18.3 Timer/counter clock sources The Timer/Counter can be clocked by an internal synchronous or an external asynchronous clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2 bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “ASSR – Asynchronous status register” on page 159. For details on clock sources and prescaler, see “Timer/counter prescaler” on page 152. 18.4 Counter unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 18-2 on page 142 shows a block diagram of the counter and its surrounding environment. Table 18-1. Definitions. BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00). MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255). TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR2A Register. The assignment is dependent on the mode of operation.142 2545T–AVR–05/11 ATmega48/88/168 Figure 18-2. Counter unit block diagram. Signal description (internal signals): count Increment or decrement TCNT2 by 1. direction Selects between increment and decrement. clear Clear TCNT2 (set all bits to zero). clkTn Timer/Counter clock, referred to as clkT2 in the following. top Signalizes that TCNT2 has reached maximum value. bottom Signalizes that TCNT2 has reached minimum value (zero). Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source, selected by the Clock Select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in the Timer/Counter Control Register (TCCR2A) and the WGM22 located in the Timer/Counter Control Register B (TCCR2B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare outputs OC2A and OC2B. For more details about advanced counting sequences and waveform generation, see “Modes of operation” on page 145. The Timer/Counter Overflow Flag (TOV2) is set according to the mode of operation selected by the WGM22:0 bits. TOV2 can be used for generating a CPU interrupt. 18.5 Output compare unit The 8-bit comparator continuously compares TCNT2 with the Output Compare Register (OCR2A and OCR2B). Whenever TCNT2 equals OCR2A or OCR2B, the comparator signals a match. A match will set the Output Compare Flag (OCF2A or OCF2B) at the next timer clock cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is executed. Alternatively, the Output Compare Flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the WGM22:0 bits and Compare Output mode (COM2x1:0) bits. The max and bottom signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation (“Modes of operation” on page 145). Figure 18-3 on page 143 shows a block diagram of the Output Compare unit. DATA BUS TCNTn Control logic count TOVn (Int.req.) bottom top direction clear TOSC1 T/C oscillator TOSC2 Prescaler clkI/O clk Tn143 2545T–AVR–05/11 ATmega48/88/168 Figure 18-3. Output compare unit, block diagram. The OCR2x Register is double buffered when using any of the Pulse Width Modulation (PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR2x Compare Register to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR2x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR2x Buffer Register, and if double buffering is disabled the CPU will access the OCR2x directly. 18.5.1 Force output compare In non-PWM waveform generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (FOC2x) bit. Forcing compare match will not set the OCF2x Flag or reload/clear the timer, but the OC2x pin will be updated as if a real compare match had occurred (the COM2x1:0 bits settings define whether the OC2x pin is set, cleared or toggled). 18.5.2 Compare match blocking by TCNT2 write All CPU write operations to the TCNT2 Register will block any compare match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR2x to be initialized to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is enabled. 18.5.3 Using the output compare unit Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT2 when using the Output Compare channel, independently of whether the Timer/Counter is running or not. If the value written to TCNT2 equals the OCR2x value, the compare match will be missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is downcounting. OCFnx (int.req.) = (8-bit comparator) OCRnx OCnx DATA BUS TCNTn WGMn1:0 Waveform generator top FOCn COMnX1:0 bottom144 2545T–AVR–05/11 ATmega48/88/168 The setup of the OC2x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC2x value is to use the Force Output Compare (FOC2x) strobe bit in Normal mode. The OC2x Register keeps its value even when changing between Waveform Generation modes. Be aware that the COM2x1:0 bits are not double buffered together with the compare value. Changing the COM2x1:0 bits will take effect immediately. 18.6 Compare match output unit The Compare Output mode (COM2x1:0) bits have two functions. The Waveform Generator uses the COM2x1:0 bits for defining the Output Compare (OC2x) state at the next compare match. Also, the COM2x1:0 bits control the OC2x pin output source. Figure 18-4 shows a simplified schematic of the logic affected by the COM2x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM2x1:0 bits are shown. When referring to the OC2x state, the reference is for the internal OC2x Register, not the OC2x pin. Figure 18-4. Compare match output unit, schematic. The general I/O port function is overridden by the Output Compare (OC2x) from the Waveform Generator if either of the COM2x1:0 bits are set. However, the OC2x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC2x pin (DDR_OC2x) must be set as output before the OC2x value is visible on the pin. The port override function is independent of the Waveform Generation mode. The design of the Output Compare pin logic allows initialization of the OC2x state before the output is enabled. Note that some COM2x1:0 bit settings are reserved for certain modes of operation. See “Register description” on page 153. PORT DDR D Q D Q OCnx OCnx pin D Q Waveform generator COMnx1 COMnx0 0 1 DATA BUS FOCnx clkI/O145 2545T–AVR–05/11 ATmega48/88/168 18.6.1 Compare output mode and waveform generation The Waveform Generator uses the COM2x1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM2x1:0 = 0 tells the Waveform Generator that no action on the OC2x Register is to be performed on the next compare match. For compare output actions in the non-PWM modes refer to Table 18-5 on page 154. For fast PWM mode, refer to Table 18-6 on page 155, and for phase correct PWM refer to Table 18-7 on page 155. A change of the COM2x1:0 bits state will have effect at the first compare match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the FOC2x strobe bits. 18.7 Modes of operation The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGM22:0) and Compare Output mode (COM2x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM2x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM2x1:0 bits control whether the output should be set, cleared, or toggled at a compare match (See “Compare match output unit” on page 144.). For detailed timing information refer to “Timer/counter timing diagrams” on page 149. 18.7.1 Normal mode The simplest mode of operation is the Normal mode (WGM22:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV2 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 18.7.2 Clear timer on compare match (CTC) mode In Clear Timer on Compare or CTC mode (WGM22:0 = 2), the OCR2A Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT2) matches the OCR2A. The OCR2A defines the top value for the counter, hence also its resolution. This mode allows greater control of the compare match output frequency. It also simplifies the operation of counting external events. The timing diagram for the CTC mode is shown in Figure 18-5 on page 146. The counter value (TCNT2) increases until a compare match occurs between TCNT2 and OCR2A, and then counter (TCNT2) is cleared.146 2545T–AVR–05/11 ATmega48/88/168 Figure 18-5. CTC mode, timing diagram. An interrupt can be generated each time the counter value reaches the TOP value by using the OCF2A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR2A is lower than the current value of TCNT2, the counter will miss the compare match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the compare match can occur. For generating a waveform output in CTC mode, the OC2A output can be set to toggle its logical level on each compare match by setting the Compare Output mode bits to toggle mode (COM2A1:0 = 1). The OC2A value will not be visible on the port pin unless the data direction for the pin is set to output. The waveform generated will have a maximum frequency of fOC2A = fclk_I/O/2 when OCR2A is set to zero (0x00). The waveform frequency is defined by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). As for the normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. 18.7.3 Fast PWM mode The fast Pulse Width Modulation or fast PWM mode (WGM22:0 = 3 or 7) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM option by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7. In noninverting Compare Output mode, the Output Compare (OC2x) is cleared on the compare match between TCNT2 and OCR2x, and set at BOTTOM. In inverting Compare Output mode, the output is set on compare match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct PWM mode that uses dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), and therefore reduces total system cost. TCNTn OCnx (toggle) OCnx interrupt flag set Period 1 2 3 4 (COMnx1:0 = 1) f OCnx f clk_I/O 2 ⋅ ⋅ N ( ) 1 + OCRnx = -------------------------------------------------147 2545T–AVR–05/11 ATmega48/88/168 In fast PWM mode, the counter is incremented until the counter value matches the TOP value. The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 18-6. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2x and TCNT2. Figure 18-6. Fast PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches TOP. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7. (See Table 18-3 on page 154). The actual OC2x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC2x Register at the compare match between OCR2x and TCNT2, and clearing (or setting) the OC2x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2A Register represent special cases when generating a PWM waveform output in the fast PWM mode. If the OCR2A is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2A equal to MAX will result in a constantly high or low output (depending on the polarity of the output set by the COM2A1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC2x to toggle its logical level on each compare match (COM2x1:0 = 1). The waveform TCNTn OCRnx update and TOVn interrupt flag set Period 1 2 3 OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx interrupt flag set 4 5 6 7 f OCnxPWM f clk_I/O N ⋅ 256 = ------------------148 2545T–AVR–05/11 ATmega48/88/168 generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2A is set to zero. This feature is similar to the OC2A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 18.7.4 Phase correct PWM mode The phase correct PWM mode (WGM22:0 = 1 or 5) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOTTOM. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7. In noninverting Compare Output mode, the Output Compare (OC2x) is cleared on the compare match between TCNT2 and OCR2x while upcounting, and set on the compare match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. In phase correct PWM mode the counter is incremented until the counter value matches TOP. When the counter reaches TOP, it changes the count direction. The TCNT2 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 18-7. The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare matches between OCR2x and TCNT2. Figure 18-7. Phase correct PWM mode, timing diagram. The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM. An inverted PWM TOVn interrupt flag set OCnx interrupt flag set 1 2 3 TCNTn Period OCnx OCnx (COMnx1:0 = 2) (COMnx1:0 = 3) OCRnx update149 2545T–AVR–05/11 ATmega48/88/168 output can be generated by setting the COM2x1:0 to three. TOP is defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7 (See Table 18-4 on page 154). The actual OC2x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC2x Register at the compare match between OCR2x and TCNT2 when the counter increments, and setting (or clearing) the OC2x Register at compare match between OCR2x and TCNT2 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024). The extreme values for the OCR2A Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR2A is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. At the very start of period 2 in Figure 18-7 on page 148 OCnx has a transition from high to low even though there is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM. There are two cases that give a transition without Compare Match. • OCR2A changes its value from MAX, like in Figure 18-7 on page 148. When the OCR2A value is MAX the OCn pin value is the same as the result of a down-counting compare match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match • The timer starts counting from a value higher than the one in OCR2A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up 18.8 Timer/counter timing diagrams The following figures show the Timer/Counter in synchronous mode, and the timer clock (clkT2) is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should be replaced by the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are set. Figure 18-8 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. Figure 18-8. Timer/counter timing diagram, no prescaling. Figure 18-9 on page 150 shows the same timing data, but with the prescaler enabled. f OCnxPCPWM f clk_I/O N ⋅ 510 = ------------------ clkTn (clkI/O/1) TOVn clkI/O TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1150 2545T–AVR–05/11 ATmega48/88/168 Figure 18-9. Timer/counter timing diagram, with prescaler (fclk_I/O/8). Figure 18-10 shows the setting of OCF2A in all modes except CTC mode. Figure 18-10. Timer/counter timing diagram, setting of OCF2A, with prescaler (fclk_I/O/8). Figure 18-11 shows the setting of OCF2A and the clearing of TCNT2 in CTC mode. Figure 18-11. Timer/counter timing diagram, clear timer on compare match mode, with prescaler (fclk_I/O/8). TOVn TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8) OCFnx OCRnx TCNTn OCRnx value OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 clkI/O clkTn (clkI/O/8) OCFnx OCRnx TCNTn (CTC) TOP TOP - 1 TOP BOTTOM BOTTOM + 1 clkI/O clkTn (clkI/O/8)151 2545T–AVR–05/11 ATmega48/88/168 18.9 Asynchronous operation of Timer/Counter2 When Timer/Counter2 operates asynchronously, some considerations must be taken. • Warning: When switching between asynchronous and synchronous clocking of Timer/Counter2, the Timer Registers TCNT2, OCR2x, and TCCR2x might be corrupted. A safe procedure for switching clock source is: a. Disable the Timer/Counter2 interrupts by clearing OCIE2x and TOIE2. b. Select clock source by setting AS2 as appropriate. c. Write new values to TCNT2, OCR2x, and TCCR2x. d. To switch to asynchronous operation: Wait for TCN2xUB, OCR2xUB, and TCR2xUB. e. Clear the Timer/Counter2 Interrupt Flags. f. Enable interrupts, if needed. • The CPU main clock frequency must be more than four times the Oscillator frequency • When writing to one of the registers TCNT2, OCR2x, or TCCR2x, the value is transferred to a temporary register, and latched after two positive edges on TOSC1. The user should not write a new value before the contents of the temporary register have been transferred to its destination. Each of the five mentioned registers have their individual temporary register, which means that, for example, writing to TCNT2 does not disturb an OCR2x write in progress. To detect that a transfer to the destination register has taken place, the Asynchronous Status Register – ASSR has been implemented • When entering Power-save or ADC Noise Reduction mode after having written to TCNT2, OCR2x, or TCCR2x, the user must wait until the written register has been updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode before the changes are effective. This is particularly important if any of the Output Compare2 interrupt is used to wake up the device, since the Output Compare function is disabled during writing to OCR2x or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode before the corresponding OCR2xUB bit returns to zero, the device will never receive a compare match interrupt, and the MCU will not wake up • If Timer/Counter2 is used to wake the device up from Power-save or ADC Noise Reduction mode, precautions must be taken if the user wants to re-enter one of these modes: If reentering sleep mode within the TOSC1 cycle, the interrupt will immidiately occur and the device wake up again. The result is multiple interrupts and wake-ups within one TOSC1 cycle from the first interrupt. If the user is in doubt whether the time before re-entering Power-save or ADC Noise Reduction mode is sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has elapsed: a. Write a value to TCCR2x, TCNT2, or OCR2x. b. Wait until the corresponding Update Busy Flag in ASSR returns to zero. c. Enter Power-save or ADC Noise Reduction mode. • When the asynchronous operation is selected, the 32.768kHz Oscillator for Timer/Counter2 is always running, except in Power-down and Standby modes. After a Power-up Reset or wakeup from Power-down or Standby mode, the user should be aware of the fact that this Oscillator might take as long as one second to stabilize. The user is advised to wait for at least one second before using Timer/Counter2 after power-up or wake-up from Power-down or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost after a wake-up from Power-down or Standby mode due to unstable clock signal upon start-up, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin152 2545T–AVR–05/11 ATmega48/88/168 • Description of wake up from Power-save or ADC Noise Reduction mode when the timer is clocked asynchronously: When the interrupt condition is met, the wake up process is started on the following cycle of the timer clock, that is, the timer is always advanced by at least one before the processor can read the counter value. After wake-up, the MCU is halted for four cycles, it executes the interrupt routine, and resumes execution from the instruction following SLEEP • Reading of the TCNT2 Register shortly after wake-up from Power-save may give an incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2 must be done through a register synchronized to the internal I/O clock domain. Synchronization takes place for every rising TOSC1 edge. When waking up from Power-save mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC clock after waking up from Powersave mode is essentially unpredictable, as it depends on the wake-up time. The recommended procedure for reading TCNT2 is thus as follows: a. Write any value to either of the registers OCR2x or TCCR2x. b. Wait for the corresponding Update Busy Flag to be cleared. c. Read TCNT2. During asynchronous operation, the synchronization of the Interrupt Flags for the asynchronous timer takes 3 processor cycles plus one timer cycle. The timer is therefore advanced by at least one before the processor can read the timer value causing the setting of the Interrupt Flag. The Output Compare pin is changed on the timer clock and is not synchronized to the processor clock. 18.10 Timer/counter prescaler Figure 18-12. Prescaler for Timer/Counter2. 10-BIT T/C PRESCALER TIMER/COUNTER2 CLOCK SOURCE clkI/O clkT2S TOSC1 AS2 CS20 CS21 CS22 clkT2S/8 clkT2S/64 clkT2S/128 clkT2S/1024 clkT2S/256 clkT2S/32 PSRASY 0 Clear clkT2153 2545T–AVR–05/11 ATmega48/88/168 The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main system I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter (RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port C. A crystal can then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock source for Timer/Counter2. The Oscillator is optimized for use with a 32.768kHz crystal. For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64, clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected. Setting the PSRASY bit in GTCCR resets the prescaler. This allows the user to operate with a predictable prescaler. 18.11 Register description 18.11.1 TCCR2A – Timer/counter control register A • Bits 7:6 – COM2A1:0: Compare match output A mode These bits control the Output Compare pin (OC2A) behavior. If one or both of the COM2A1:0 bits are set, the OC2A output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2A pin must be set in order to enable the output driver. When OC2A is connected to the pin, the function of the COM2A1:0 bits depends on the WGM22:0 bit setting. Table 18-2 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to a normal or CTC mode (non-PWM). Table 18-3 on page 154 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to fast PWM mode. Bit 7 6 5 4 3 2 1 0 (0xB0) COM2A1 COM2A0 COM2B1 COM2B0 – – WGM21 WGM20 TCCR2A Read/write R/W R/W R/W R/W R R R/W R/W Initial value 0 0 0 0 0 0 0 0 Table 18-2. Compare output mode, non-PWM mode. COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 Toggle OC2A on compare match 1 0 Clear OC2A on compare match 1 1 Set OC2A on compare match154 2545T–AVR–05/11 ATmega48/88/168 Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Fast PWM mode” on page 146 for more details. Table 18-4 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 148 for more details. • Bits 5:4 – COM2B1:0: Compare match output B mode These bits control the Output Compare pin (OC2B) behavior. If one or both of the COM2B1:0 bits are set, the OC2B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC2B pin must be set in order to enable the output driver. When OC2B is connected to the pin, the function of the COM2B1:0 bits depends on the WGM22:0 bit setting. Table 18-5 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to a normal or CTC mode (non-PWM). Table 18-3. Compare output mode, fast PWM mode(1). COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 WGM22 = 0: Normal port operation, OC0A disconnected WGM22 = 1: Toggle OC2A on compare match 1 0 Clear OC2A on compare match, set OC2A at BOTTOM, (non-inverting mode) 1 1 Set OC2A on compare match, clear OC2A at BOTTOM, (inverting mode) Table 18-4. Compare output mode, phase correct PWM Mode(1). COM2A1 COM2A0 Description 0 0 Normal port operation, OC2A disconnected 0 1 WGM22 = 0: Normal port operation, OC2A disconnected WGM22 = 1: Toggle OC2A on compare match 1 0 Clear OC2A on compare match when up-counting Set OC2A on compare match when down-counting 1 1 Set OC2A on compare match when up-counting Clear OC2A on compare match when down-counting Table 18-5. Compare output mode, non-PWM mode. COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Toggle OC2B on compare match 1 0 Clear OC2B on compare match 1 1 Set OC2B on compare match155 2545T–AVR–05/11 ATmega48/88/168 Table 18-6 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to fast PWM mode. Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 148 for more details. Table 18-7 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to phase correct PWM mode. Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase correct PWM mode” on page 148 for more details. • Bits 3, 2 – Res: Reserved bits These bits are reserved bits in the Atmel ATmega48/88/168 and will always read as zero. • Bits 1:0 – WGM21:0: Waveform generation mode Combined with the WGM22 bit found in the TCCR2B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 18-8 on page 156. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes (see “Modes of operation” on page 145). Table 18-6. Compare output mode, fast PWM mode(1). COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Reserved 1 0 Clear OC2B on compare match, set OC2B at BOTTOM, (non-inverting mode) 1 1 Set OC2B on compare match, clear OC2B at BOTTOM, (invertiing mode) Table 18-7. Compare output mode, phase correct PWM mode(1). COM2B1 COM2B0 Description 0 0 Normal port operation, OC2B disconnected 0 1 Reserved 1 0 Clear OC2B on compare match when up-counting Set OC2B on compare match when down-counting 1 1 Set OC2B on compare match when up-counting Clear OC2B on compare match when down-counting156 2545T–AVR–05/11 ATmega48/88/168 Notes: 1. MAX= 0xFF 2. BOTTOM= 0x00 18.11.2 TCCR2B – Timer/counter control register B • Bit 7 – FOC2A: Force output compare A The FOC2A bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2A bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC2A output is changed according to its COM2A1:0 bits setting. Note that the FOC2A bit is implemented as a strobe. Therefore it is the value present in the COM2A1:0 bits that determines the effect of the forced compare. A FOC2A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2A as TOP. The FOC2A bit is always read as zero. • Bit 6 – FOC2B: Force output compare B The FOC2B bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR2B is written when operating in PWM mode. When writing a logical one to the FOC2B bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC2B output is changed according to its COM2B1:0 bits setting. Note that the FOC2B bit is implemented as a strobe. Therefore it is the value present in the COM2B1:0 bits that determines the effect of the forced compare. Table 18-8. Waveform generation mode bit description. Mode WGM2 WGM1 WGM0 Timer/counter mode of operation TOP Update of OCRx at TOV flag set on(1)(2) 0 0 0 0 Normal 0xFF Immediate MAX 10 0 1 PWM, phase correct 0xFF TOP BOTTOM 2 0 1 0 CTC OCRA Immediate MAX 3 0 1 1 Fast PWM 0xFF BOTTOM MAX 4 1 0 0 Reserved – – – 51 0 1 PWM, phase correct OCRA TOP BOTTOM 6 1 1 0 Reserved – – – 7 1 1 1 Fast PWM OCRA BOTTOM TOP Bit 7 6 5 4 3 2 1 0 (0xB1) FOC2A FOC2B – – WGM22 CS22 CS21 CS20 TCCR2B Read/write W W R R R R R/W R/W Initial value 0 0 0 0 0 0 0 0157 2545T–AVR–05/11 ATmega48/88/168 A FOC2B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR2B as TOP. The FOC2B bit is always read as zero. • Bits 5:4 – Res: Reserved bits These bits are reserved bits in the Atmel ATmega48/88/168 and will always read as zero. • Bit 3 – WGM22: Waveform generation mode See the description in the “TCCR2A – Timer/counter control register A” on page 153. • Bit 2:0 – CS22:0: Clock select The three Clock Select bits select the clock source to be used by the Timer/Counter, see Table 18-9. If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. 18.11.3 TCNT2 – Timer/counter register The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running, introduces a risk of missing a Compare Match between TCNT2 and the OCR2x Registers. 18.11.4 OCR2A – Output compare register A Table 18-9. Clock select bit description. CS22 CS21 CS20 Description 0 0 0 No clock source (timer/counter stopped) 0 0 1 clkT2S/(no prescaling) 0 1 0 clkT2S/8 (from prescaler) 0 1 1 clkT2S/32 (from prescaler) 1 0 0 clkT2S/64 (from prescaler) 1 0 1 clkT2S/128 (from prescaler) 1 1 0 clkT2S/256 (from prescaler) 1 1 1 clkT2S/1024 (from prescaler) Bit 7 6 5 4 3 2 1 0 (0xB2) TCNT2[7:0] TCNT2 Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 (0xB3) OCR2A[7:0] OCR2A Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0158 2545T–AVR–05/11 ATmega48/88/168 The Output Compare Register A contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2A pin. 18.11.5 OCR2B – Output compare register B The Output Compare Register B contains an 8-bit value that is continuously compared with the counter value (TCNT2). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC2B pin. 18.11.6 TIMSK2 – Timer/Counter2 interrupt mask register • Bit 2 – OCIE2B: Timer/Counter2 output compare match B interrupt enable When the OCIE2B bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match B interrupt is enabled. The corresponding interrupt is executed if a compare match in Timer/Counter2 occurs, that is, when the OCF2B bit is set in the Timer/Counter 2 Interrupt Flag Register – TIFR2. • Bit 1 – OCIE2A: Timer/Counter2 output compare match A interrupt enable When the OCIE2A bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Compare Match A interrupt is enabled. The corresponding interrupt is executed if a compare match in Timer/Counter2 occurs, that is, when the OCF2A bit is set in the Timer/Counter 2 Interrupt Flag Register – TIFR2. • Bit 0 – TOIE2: Timer/Counter2 overflow interrupt enable When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter2 occurs, that is, when the TOV2 bit is set in the Timer/Counter2 Interrupt Flag Register – TIFR2. 18.11.7 TIFR2 – Timer/Counter2 interrupt flag register • Bit 2 – OCF2B: Output compare flag 2 B The OCF2B bit is set (one) when a compare match occurs between the Timer/Counter2 and the data in OCR2B – Output Compare Register2. OCF2B is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF2B is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2B (Timer/Counter2 Compare match Interrupt Enable), and OCF2B are set (one), the Timer/Counter2 Compare match Interrupt is executed. Bit 7 6 5 4 3 2 1 0 (0xB4) OCR2B[7:0] OCR2B Read/write R/W R/W R/W R/W R/W R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 (0x70) – – – – – OCIE2B OCIE2A TOIE2 TIMSK2 Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x17 (0x37) – – – – – OCF2B OCF2A TOV2 TIFR2 Read/write R R R R R R/W R/W R/W Initial value 0 0 0 0 0 0 0 0159 2545T–AVR–05/11 ATmega48/88/168 • Bit 1 – OCF2A: Output compare flag 2 A The OCF2A bit is set (one) when a compare match occurs between the Timer/Counter2 and the data in OCR2A – Output Compare Register2. OCF2A is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF2A is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE2A (Timer/Counter2 Compare match Interrupt Enable), and OCF2A are set (one), the Timer/Counter2 Compare match Interrupt is executed. • Bit 0 – TOV2: Timer/Counter2 overflow flag The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, TOV2 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE2A (Timer/Counter2 Overflow Interrupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00. 18.11.8 ASSR – Asynchronous status register • Bit 7 – RES: Reserved bit This bit is reserved and will always read as zero. • Bit 6 – EXCLK: Enable external clock input When EXCLK is written to one, and asynchronous clock is selected, the external clock input buffer is enabled and an external clock can be input on Timer Oscillator 1 (TOSC1) pin instead of a 32kHz crystal. Writing to EXCLK should be done before asynchronous operation is selected. Note that the crystal Oscillator will only run when this bit is zero. • Bit 5 – AS2: Asynchronous Timer/Counter2 When AS2 is written to zero, Timer/Counter2 is clocked from the I/O clock, clkI/O. When AS2 is written to one, Timer/Counter2 is clocked from a crystal Oscillator connected to the Timer Oscillator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B might be corrupted. • Bit 4 – TCN2UB: Timer/Counter2 update busy When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set. When TCNT2 has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value. • Bit 3 – OCR2AUB: Output compare Register2 update busy When Timer/Counter2 operates asynchronously and OCR2A is written, this bit becomes set. When OCR2A has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2A is ready to be updated with a new value. • Bit 2 – OCR2BUB: Output compare Register2 update busy When Timer/Counter2 operates asynchronously and OCR2B is written, this bit becomes set. When OCR2B has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that OCR2B is ready to be updated with a new value. Bit 7 6 5 4 3 2 1 0 (0xB6) – EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB ASSR Read/write R R/W R/W R R R R R Initial value 0 0 0 0 0 0 0 0160 2545T–AVR–05/11 ATmega48/88/168 • Bit 1 – TCR2AUB: Timer/counter control Register2 update busy When Timer/Counter2 operates asynchronously and TCCR2A is written, this bit becomes set. When TCCR2A has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2A is ready to be updated with a new value. • Bit 0 – TCR2BUB: Timer/counter control Register2 update busy When Timer/Counter2 operates asynchronously and TCCR2B is written, this bit becomes set. When TCCR2B has been updated from the temporary storage register, this bit is cleared by hardware. A logical zero in this bit indicates that TCCR2B is ready to be updated with a new value. If a write is performed to any of the five Timer/Counter2 Registers while its update busy flag is set, the updated value might get corrupted and cause an unintentional interrupt to occur. The mechanisms for reading TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B are different. When reading TCNT2, the actual timer value is read. When reading OCR2A, OCR2B, TCCR2A and TCCR2B the value in the temporary storage register is read. 18.11.9 GTCCR – General timer/counter control register • Bit 1 – PSRASY: Prescaler reset Timer/Counter2 When this bit is one, the Timer/Counter2 prescaler will be reset. This bit is normally cleared immediately by hardware. If the bit is written when Timer/Counter2 is operating in asynchronous mode, the bit will remain one until the prescaler has been reset. The bit will not be cleared by hardware if the TSM bit is set. Refer to the description of the “Bit 7 – TSM: Timer/counter synchronization mode” on page 139 for a description of the Timer/Counter Synchronization mode. Bit 7 6 5 4 3 2 1 0 0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR Read/write R/W R R R R R R/W R/W Initial value 0 0 0 0 0 0 0 0161 2545T–AVR–05/11 ATmega48/88/168 19. SPI – Serial peripheral interface 19.1 Features • Full-duplex, three-wire synchronous data transfer • Master or slave operation • LSB first or MSB first data transfer • Seven programmable bit rates • End of transmission interrupt flag • Write collision flag protection • Wake-up from idle mode • Double speed (CK/2) master SPI mode 19.2 Overview The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the Atmel ATmega48/88/168 and peripheral devices or between several AVR devices. The USART can also be used in Master SPI mode, see “USART in SPI mode” on page 199. The PRSPI bit in “Minimizing power consumption” on page 41 must be written to zero to enable SPI module.162 2545T–AVR–05/11 ATmega48/88/168 Figure 19-1. SPI block diagram(1). Note: 1. Refer to Figure 1-1 on page 2, and Table 14-3 on page 78 for SPI pin placement. The interconnection between Master and Slave CPUs with SPI is shown in Figure 19-2 on page 163. The system consists of two shift Registers, and a Master clock generator. The SPI Master initiates the communication cycle when pulling low the Slave Select SS pin of the desired Slave. Master and Slave prepare the data to be sent in their respective shift Registers, and the Master generates the required clock pulses on the SCK line to interchange data. Data is always shifted from Master to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In – Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pulling high the Slave Select, SS, line. When configured as a Master, the SPI interface has no automatic control of the SS line. This must be handled by user software before communication can start. When this is done, writing a byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end of Transmission Flag (SPIF). If the SPI Interrupt Enable bit (SPIE) in the SPCR Register is set, an interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be kept in the Buffer Register for later use. When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long as the SS pin is driven high. In this state, software may update the contents of the SPI Data Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin until the SS pin is driven low. As one byte has been completely shifted, the end of Transmission SPI2X SPI2X DIVIDER /2/4/8/16/32/64/128163 2545T–AVR–05/11 ATmega48/88/168 Flag, SPIF is set. If the SPI Interrupt Enable bit, SPIE, in the SPCR Register is set, an interrupt is requested. The Slave may continue to place new data to be sent into SPDR before reading the incoming data. The last incoming byte will be kept in the Buffer Register for later use. Figure 19-2. SPI master-slave interconnection. The system is single buffered in the transmit direction and double buffered in the receive direction. This means that bytes to be transmitted cannot be written to the SPI Data Register before the entire shift cycle is completed. When receiving data, however, a received character must be read from the SPI Data Register before the next character has been completely shifted in. Otherwise, the first byte is lost. In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure correct sampling of the clock signal, the minimum low and high periods should be: Low periods: Longer than 2 CPU clock cycles. High periods: Longer than 2 CPU clock cycles. When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden according to Table 19-1. For more details on automatic port overrides, refer to “Alternate port functions” on page 76. Note: See “Alternate functions of port B” on page 78 for a detailed description of how to define the direction of the user defined SPI pins. The following code examples show how to initialize the SPI as a Master and how to perform a simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by the actual data direction bits for these pins. For example if MOSI is placed on pin PB3, replace DD_MOSI with DDB3 and DDR_SPI with DDRB. Table 19-1. SPI pin overrides(Note:). Pin Direction, master SPI Direction, slave SPI MOSI User defined Input MISO Input User defined SCK User defined Input SS User defined Input SHIFT ENABLE164 2545T–AVR–05/11 ATmega48/88/168 Note: 1. See ”About code examples” on page 8. Assembly code example(1) SPI_MasterInit: ; Set MOSI and SCK output, all others input ldi r17,(1<>8); UBRR0L = (unsigned char)ubrr; Enable receiver and transmitter */ UCSR0B = (1<> 1) & 0x01; return ((resh << 8) | resl); }184 2545T–AVR–05/11 ATmega48/88/168 20.7.3 Receive complete flag and interrupt The USART Receiver has one flag that indicates the Receiver state. The Receive Complete (RXCn) Flag indicates if there are unread data present in the receive buffer. This flag is one when unread data exist in the receive buffer, and zero when the receive buffer is empty (that is, does not contain any unread data). If the Receiver is disabled (RXENn = 0), the receive buffer will be flushed and consequently the RXCn bit will become zero. When the Receive Complete Interrupt Enable (RXCIEn) in UCSRnB is set, the USART Receive Complete interrupt will be executed as long as the RXCn Flag is set (provided that global interrupts are enabled). When interrupt-driven data reception is used, the receive complete routine must read the received data from UDRn in order to clear the RXCn Flag, otherwise a new interrupt will occur once the interrupt routine terminates. 20.7.4 Receiver error flags The USART Receiver has three Error Flags: Frame Error (FEn), Data OverRun (DORn) and Parity Error (UPEn). All can be accessed by reading UCSRnA. Common for the Error Flags is that they are located in the receive buffer together with the frame for which they indicate the error status. Due to the buffering of the Error Flags, the UCSRnA must be read before the receive buffer (UDRn), since reading the UDRn I/O location changes the buffer read location. Another equality for the Error Flags is that they can not be altered by software doing a write to the flag location. However, all flags must be set to zero when the UCSRnA is written for upward compatibility of future USART implementations. None of the Error Flags can generate interrupts. The Frame Error (FEn) Flag indicates the state of the first stop bit of the next readable frame stored in the receive buffer. The FEn Flag is zero when the stop bit was correctly read (as one), and the FEn Flag will be one when the stop bit was incorrect (zero). This flag can be used for detecting out-of-sync conditions, detecting break conditions and protocol handling. The FEn Flag is not affected by the setting of the USBSn bit in UCSRnC since the Receiver ignores all, except for the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to UCSRnA. The Data OverRun (DORn) Flag indicates data loss due to a receiver buffer full condition. A Data OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in the Receive Shift Register, and a new start bit is detected. If the DORn Flag is set there was one or more serial frame lost between the frame last read from UDRn, and the next frame read from UDRn. For compatibility with future devices, always write this bit to zero when writing to UCSRnA. The DORn Flag is cleared when the frame received was successfully moved from the Shift Register to the receive buffer. The Parity Error (UPEn) Flag indicates that the next frame in the receive buffer had a Parity Error when received. If Parity Check is not enabled the UPEn bit will always be read zero. For compatibility with future devices, always set this bit to zero when writing to UCSRnA. For more details see “Parity bit calculation” on page 176 and “Parity checker” on page 184. 20.7.5 Parity checker The Parity Checker is active when the high USART Parity mode (UPMn1) bit is set. Type of Parity Check to be performed (odd or even) is selected by the UPMn0 bit. When enabled, the Parity Checker calculates the parity of the data bits in incoming frames and compares the result with the parity bit from the serial frame. The result of the check is stored in the receive buffer together with the received data and stop bits. The Parity Error (UPEn) Flag can then be read by software to check if the frame had a Parity Error.185 2545T–AVR–05/11 ATmega48/88/168 The UPEn bit is set if the next character that can be read from the receive buffer had a Parity Error when received and the Parity Checking was enabled at that point (UPMn1 = 1). This bit is valid until the receive buffer (UDRn) is read. 20.7.6 Disabling the receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing receptions will therefore be lost. When disabled (that is, the RXENn is set to zero) the Receiver will no longer override the normal function of the RxDn port pin. The Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in the buffer will be lost 20.7.7 Flushing the receive buffer The receiver buffer FIFO will be flushed when the Receiver is disabled, that is, the buffer will be emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal operation, due to for instance an error condition, read the UDRn I/O location until the RXCn Flag is cleared. The following code example shows how to flush the receive buffer. Note: 1. See ”About code examples” on page 8. 20.8 Asynchronous data reception The USART includes a clock recovery and a data recovery unit for handling asynchronous data reception. The clock recovery logic is used for synchronizing the internally generated baud rate clock to the incoming asynchronous serial frames at the RxDn pin. The data recovery logic samples and low pass filters each incoming bit, thereby improving the noise immunity of the Receiver. The asynchronous reception operational range depends on the accuracy of the internal baud rate clock, the rate of the incoming frames, and the frame size in number of bits. 20.8.1 Asynchronous clock recovery The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 20-5 on page 186 illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double Speed mode. The horizontal arrows illustrate the synchronization variation due to the sampling process. Note the larger time variation when using the Double Speed mode (U2Xn = 1) of operation. Samples denoted zero are samples done when the RxDn line is idle (that is, no communication activity). Assembly code example(1) USART_Flush: sbis UCSRnA, RXCn ret in r16, UDRn rjmp USART_Flush C code example(1) void USART_Flush( void ) { unsigned char dummy; while ( UCSRnA & (1< 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz High: > 2 CPU clock cycles for fck < 12MHz, 3 CPU clock cycles for fck >= 12MHz VCC GND XTAL1 SCK MISO MOSI RESET +1.8V - 5.5V AVCC +1.8V - 5.5V(2)299 2545T–AVR–05/11 ATmega48/88/168 28.8.1 Serial programming pin mapping 28.8.2 Serial programming algorithm When writing serial data to the Atmel ATmega48/88/168, data is clocked on the rising edge of SCK. When reading data from the ATmega48/88/168, data is clocked on the falling edge of SCK. See Figure 28-9 on page 302 for timing details. To program and verify the ATmega48/88/168 in the serial programming mode, the following sequence is recommended (See Serial Programming Instruction set in Table 28-17 on page 300): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0”. 2. Wait for at least 20ms and enable serial programming by sending the Programming Enable serial instruction to pin MOSI. 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 6 LSB of the address and data together with the Load Program Memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program Memory Page is stored by loading the Write Program Memory Page instruction with the 7 MSB of the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page (see Table 28-16 on page 300). Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. A: The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte (see Table 28-16 on page 300). In a chip erased device, no 0xFFs in the data file(s) need to be programmed. B: The EEPROM array is programmed one page at a time. The Memory page is loaded one byte at a time by supplying the 6 LSB of the address and data together with the Load EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading the Write EEPROM Memory Page Instruction with the 7 MSB of the address. When using EEPROM page access only byte locations loaded with the Load EEPROM Memory Page instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is not used, the used must wait at least tWD_EEPROM before issuing the next byte (See Table Table 28-15. Pin mapping serial programming. Symbol Pins I/O Description MOSI PB3 I Serial Data in MISO PB4 O Serial Data out SCK PB5 I Serial Clock300 2545T–AVR–05/11 ATmega48/88/168 28-16 on page 300). In a chip erased device, no 0xFF in the data file(s) need to be programmed. 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output MISO. 7. At the end of the programming session, RESET can be set high to commence normal operation. 8. Power-off sequence (if needed): Set RESET to “1”. Turn VCC power off. 28.8.3 Serial programming instruction set Table 28-17 and Figure 28-8 on page 302 describes the instruction set. Table 28-16. Typical wait delay before writing the next flash or EEPROM location. Symbol Minimum wait delay tWD_FLASH 4.5ms tWD_EEPROM 3.6ms tWD_ERASE 9.0ms Table 28-17. Serial programming instruction set (hexadecimal values). Instruction/operation Instruction format Byte 1 Byte 2 Byte 3 Byte 4 Programming enable $AC $53 $00 $00 Chip erase (program memory/EEPROM) $AC $80 $00 $00 Poll RDY/BSY $F0 $00 $00 data byte out Load instructions Load extended address byte(1) $4D $00 Extended adr $00 Load program memory page, high byte $48 $00 adr LSB high data byte in Load program memory page, low byte $40 $00 adr LSB low data byte in Load EEPROM memory page (page access) $C1 $00 0000 000aa data byte in Read instructions Read program memory, high byte $28 adr MSB adr LSB high data byte out Read program memory, low byte $20 adr MSB adr LSB low data byte out Read EEPROM memory $A0 0000 00aa aaaa aaaa data byte out Read lock bits $58 $00 $00 data byte out Read signature byte $30 $00 0000 000aa data byte out Read fuse bits $50 $00 $00 data byte out Read fuse high bits $58 $08 $00 data byte out Read extended fuse bits $50 $08 $00 data byte out Read calibration byte $38 $00 $00 data byte out301 2545T–AVR–05/11 ATmega48/88/168 Notes: 1. Not all instructions are applicable for all parts. 2. a = address. 3. Bits are programmed ‘0’, unprogrammed ‘1’. 4. To ensure future compatibility, unused fuses and lock bits should be unprogrammed (‘1’). 5. Refer to the correspondig section for fuse and lock bits, calibration and signature bytes and page size. 6. Instructions accessing program memory use a word address. This word may be random within the page range. 7. See htt://www.atmel.com/avr for application notes regarding programming and programmers. If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until this bit returns ‘0’ before the next instruction is carried out. Within the same page, the low data byte must be loaded prior to the high data byte. After data is loaded to the page buffer, program the EEPROM page, see Figure 28-8. Write instructions(6) Write program memory page $4C adr MSB adr LSB $00 Write EEPROM memory $C0 0000 00aa aaaa aaaa data byte in Write EEPROM memory page (page access) $C2 0000 00aa aaaa aa00 $00 Write lock bits $AC $E0 $00 data byte in Write fuse bits $AC $A0 $00 data byte in Write fuse high bits $AC $A8 $00 data byte in Write extended fuse bits $AC $A4 $00 data byte in Table 28-17. Serial programming instruction set (hexadecimal values). (Continued) Instruction/operation Instruction format Byte 1 Byte 2 Byte 3 Byte 4302 2545T–AVR–05/11 ATmega48/88/168 Figure 28-8. Serial programming instruction example. 28.8.4 SPI serial programming characteristics Figure 28-9. Serial programming waveforms. For characteristics of the SPI module see “SPI timing characteristics” on page 309. Byte 1 Byte 2 Byte 3 Byte 4 Adr MSB Adr LSB Bit 15 B 0 Serial programming instruction Program memory/ EEPROM memory Page 0 Page 1 Page 2 Page N-1 Page buffer Write program memory page/ Write EEPROM memory page Load program memory page (high/low byte)/ Load EEPROM memory page (page access) Byte 1 Byte 2 Byte 3 Byte 4 Bit 15 B 0 Adr MSB Adr LSB Page offset Page number Adr MSB Adr LSB MSB MSB LSB LSB SERIAL CLOCK INPUT (SCK) SERIAL DATA INPUT (MOSI) (MISO) SAMPLE SERIAL DATA OUTPUT303 2545T–AVR–05/11 ATmega48/88/168 29. Electrical characteristics 29.1 Absolute maximum ratings* 29.2 DC characteristics Operating temperature................................... -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage temperature...................................... -65°C to +150°C Voltage on any pin except RESET with respect to ground .................................-0.5V to VCC+0.5V Voltage on RESET with respect to ground ......-0.5V to +13.0V Maximum operating voltage.............................................. 6.0V DC current per I/O pin.................................................. 40.0mA DC current VCC and GND pins .................................. 200.0mA TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted). Symbol Parameter Condition Minimum Typical Maximum Units VIL Input low voltage, except XTAL1 and RESET pin VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V -0.5 -0.5 0.2VCC(1) 0.3VCC(1) V VIH Input high voltage, except XTAL1 and RESET pins VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.7VCC(2) 0.6VCC(2) VCC + 0.5 VCC + 0.5 VIL1 Input low voltage, XTAL1 pin VCC = 1.8V - 5.5V -0.5 0.1VCC(1) VIH1 Input high voltage, XTAL1 pin VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.8VCC(2) 0.7VCC(2) VCC + 0.5 VCC + 0.5 VIL2 Input low voltage, RESET pin VCC = 1.8V - 5.5V -0.5 0.2VCC(1) VIH2 Input high voltage, RESET pin VCC = 1.8V - 5.5V 0.9VCC(2) VCC + 0.5 VIL3 Input low voltage, RESET pin as I/O VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V -0.5 -0.5 0.2VCC(1) 0.3VCC(1) VIH3 Input high voltage, RESET pin as I/O VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.7VCC(2) 0.6VCC(2) VCC + 0.5 VCC + 0.5 VOL Output low voltage(3), RESET pin as I/O I OL = 20mA, VCC = 5V IOL = 6mA, VCC = 3V 0.7 0.5 VOH Output high voltage(4), RESET pin as I/O I OH = -20mA, VCC = 5V I OH = -10mA, VCC = 3V 4.2 2.3 IIL Input leakage current I/O pin VCC = 5.5V, pin low (absolute value) 1 µA I IH Input leakage current I/O pin VCC = 5.5V, pin high (absolute value) 1 RRST Reset pull-up resistor 30 60 kΩ RPU I/O pin pull-up resistor 20 50304 2545T–AVR–05/11 ATmega48/88/168 Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low 2. “Min” means the lowest value where the pin is guaranteed to be read as high 3. Although each I/O port can sink more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: ATmega48/88/168: 1] The sum of all IOL, for ports C0 - C5, ADC7, ADC6 should not exceed 100mA. 2] The sum of all IOL, for ports B0 - B5, D5 - D7, XTAL1, XTAL2 should not exceed 100mA. 3] The sum of all IOL, for ports D0 - D4, RESET should not exceed 100mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 4. Although each I/O port can source more than the test conditions (20mA at VCC = 5V, 10mA at VCC = 3V) under steady state conditions (non-transient), the following must be observed: ATmega48/88/168: 1] The sum of all IOH, for ports C0 - C5, D0- D4, ADC7, RESET should not exceed 150mA. 2] The sum of all IOH, for ports B0 - B5, D5 - D7, ADC6, XTAL1, XTAL2 should not exceed 150mA. If IIOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 5. Values with “Minimizing power consumption” on page 41 enabled (0xFF). ICC Power supply current(5) Active 1MHz, VCC = 2V (Atmel ATmega48/88/168V) 0.55 mA Active 4MHz, VCC = 3V (Atmel ATmega48/88/168L) 3.5 Active 8MHz, VCC = 5V (Atmel ATmega48/88/168) 12 Idle 1MHz, VCC = 2V (ATmega48/88/168V) 0.25 0.5 Idle 4MHz, VCC = 3V (ATmega48/88/168L) 1.5 Idle 8MHz, VCC = 5V (ATmega48/88/168) 5.5 Power-down mode WDT enabled, VCC = 3V 8 15 µA WDT disabled, VCC = 3V 1 2 VACIO Analog comparator input offset voltage VCC = 5V Vin = VCC/2 10 40 mV IACLK Analog comparator input leakage current VCC = 5V Vin = VCC/2 -50 50 nA t ACID Analog comparator propagation delay VCC = 2.7V VCC = 4.0V 750 500 ns TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted). (Continued) Symbol Parameter Condition Minimum Typical Maximum Units305 2545T–AVR–05/11 ATmega48/88/168 29.3 Speed grades Maximum frequency is dependent on VCC. As shown in Figure 29-1 and Figure 29-2, the Maximum Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V and between 2.7V < VCC < 4.5V. Figure 29-1. Maximum frequency vs. VCC, Atmel ATmega48V/88V/168V. Figure 29-2. Maximum frequency vs. VCC, ATmega48/88/168. 10MHz 4MHz 1.8V 2.7V 5.5V Safe operating area 20MHz 10MHz 2.7V 4.5V 5.5V Safe operating area306 2545T–AVR–05/11 ATmega48/88/168 29.4 Clock characteristics 29.4.1 Calibrated internal RC oscillator accuracy Notes: 1. Voltage range for Atmel ATmega48V/88V/168V. 2. Voltage range for Atmel ATmega48/88/168. 29.4.2 External clock drive waveforms Figure 29-3. External clock drive waveforms. 29.4.3 External clock drive Table 29-1. Calibration accuracy of internal RC oscillator. Frequency VCC Temperature Calibration accuracy Factory calibration 8.0MHz 3V 25°C ±10% User calibration 7.3MHz - 8.1MHz 1.8V - 5.5V(1) 2.7V - 5.5V(2) -40°C - 85°C ±1% VIL1 VIH1 Table 29-2. External clock drive. Symbol Parameter VCC = 1.8V - 5.5V VCC = 2.7V - 5.5V VCC = 4.5V - 5.5V Min. Max. Min. Max. Min. Max. Units 1/tCLCL Oscillator frequency 0 4 0 10 0 20 MHz tCLCL Clock period 250 100 50 tCHCX High time 100 40 20 ns tCLCX Low time 100 40 20 tCLCH Rise time 2.0 1.6 0.5 μs tCHCL Fall time 2.0 1.6 0.5 ΔtCLCL Change in period from one clock cycle to the next 2 2 2%307 2545T–AVR–05/11 ATmega48/88/168 29.5 System and reset characteristics Note: 1. The power-on reset will not work unless the supply voltage has been below VPOT (falling). Notes: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a brown-out reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. The test is performed using BODLEVEL = 110 and BODLEVEL = 101 for Atmel ATmega48V/88V/168V, and BODLEVEL = 101 and BODLEVEL = 100 for Atmel ATmega48/88/168. Table 29-3. Reset, brown-out and internal voltage characteristics. Symbol Parameter Condition Min. Typ. Max. Units VPOT Power-on reset threshold voltage (rising) 0.7 1.0 1.4 V Power-on reset threshold voltage (falling)(1) 0.05 0.9 1.3 VPONSR Power-on slope rate 0.01 4.5 V/ms VRST RESET pin threshold voltage 0.2VCC 0.9VCC V tRST Minimum pulse width on RESET pin 2.5 µs VHYST Brown-out detector hysteresis 50 mV tBOD Min pulse width on brown-out reset 2 µs VBG Bandgap reference voltage VCC = 2.7 TA = 25°C 1.0 1.1 1.2 V t BG Bandgap reference start-up time VCC = 2.7 TA = 25°C 40 70 µs I BG Bandgap reference current consumption VCC = 2.7 TA = 25°C 10 µA Table 29-4. BODLEVEL fuse coding(1). BODLEVEL 2:0 Fuses Min. VBOT Typ. VBOT Max. VBOT Units 111 BOD disabled 110 1.7 1.8 2.0 101 2.5 2.7 2.9 V 100 4.1 4.3 4.5 011 Reserved 010 001 000308 2545T–AVR–05/11 ATmega48/88/168 29.6 2-wire serial interface characteristics Table 29-5 describes the requirements for devices connected to the 2-wire Serial Bus. The Atmel ATmega48/88/168 2-wire Serial Interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 29-4 on page 309. Notes: 1. In ATmega48/88/168, this parameter is characterized and not 100% tested. 2. Required only for fSCL > 100kHz. Table 29-5. 2-wire serial bus requirements. Symbol Parameter Condition Min. Max. Units VIL Input low-voltage -0.5 0.3VCC V VIH Input high-voltage 0.7VCC VCC + 0.5 Vhys(1) Hysteresis of schmitt trigger inputs 0.05VCC(2) – VOL(1) Output low-voltage 3mA sink current 0 0.4 tr (1) Rise time for both SDA and SCL 20 + 0.1Cb (3)(2) 300 tof ns (1) Output fall time from VIHmin to VILmax 10pF < Cb < 400pF(3) 20 + 0.1Cb (3)(2) 250 tSP(1) Spikes suppressed by input filter 0 50(2) Ii Input current each I/O pin 0.1VCC < Vi < 0.9VCC -10 10 µA Ci (1) Capacitance for each I/O pin – 10 pF fSCL SCL clock frequency fCK(4) > max(16fSCL, 250kHz)(5) 0 400 kHz Rp Value of pull-up resistor fSCL ≤ 100kHz fSCL > 100kHz tHD;STA Hold time (repeated) START condition fSCL ≤ 100kHz 4.0 – µs fSCL > 100kHz 0.6 – tLOW Low period of the SCL clock fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 1.3 – tHIGH High period of the SCL clock fSCL ≤ 100kHz 4.0 – fSCL > 100kHz 0.6 – tSU;STA Setup time for a repeated START condition fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 0.6 – tHD;DAT Data hold time fSCL ≤ 100kHz 0 3.45 fSCL > 100kHz 0 0.9 tSU;DAT Data setup time fSCL ≤ 100kHz 250 – ns fSCL > 100kHz 100 – tSU;STO Setup time for STOP condition fSCL ≤ 100kHz 4.0 – µs fSCL > 100kHz 0.6 – tBUF Bus free time between a STOP and START condition fSCL ≤ 100kHz 4.7 – fSCL > 100kHz 1.3 – VCC – 0.4V 3mA ---------------------------- 1000ns Cb ----------------- Ω VCC – 0.4V 3mA ---------------------------- 300ns Cb --------------309 2545T–AVR–05/11 ATmega48/88/168 3. Cb = capacitance of one bus line in pF. 4. fCK = CPU clock frequency. 5. This requirement applies to all Atmel ATmega48/88/168 2-wire Serial Interface operation. Other devices connected to the 2- wire Serial Bus need only obey the general fSCL requirement. Figure 29-4. 2-wire serial bus timing. 29.7 SPI timing characteristics See Figure 29-5 on page 310 and Figure 29-6 on page 310 for details. Note: 1. In SPI programming mode the minimum SCK high/low period is: - 2 tCLCL for fCK < 12MHz - 3 tCLCL for fCK > 12MHz t SU;STA t LOW t HIGH t LOW t of t HD;STA t HD;DAT t SU;DAT t SU;STO t BUF SCL SDA t r Table 29-6. SPI timing parameters. Description Mode Minimum Typical Maximum 1 SCK period Master See Table 19-5 on page 169 ns 2 SCK high/low Master 50% duty cycle 3 Rise/fall time Master 3.6 4 Setup Master 10 5 Hold Master 10 6 Out to SCK Master 0.5 • tsck 7 SCK to out Master 10 8 SCK to out high Master 10 9 SS low to out Slave 15 10 SCK period Slave 4 • tck 11 SCK high/low(1) Slave 2 • tck 12 Rise/fall time Slave 1600 13 Setup Slave 10 14 Hold Slave tck 15 SCK to out Slave 15 16 SCK to SS high Slave 20 17 SS high to tri-state Slave 10 18 SS low to SCK Slave 20310 2545T–AVR–05/11 ATmega48/88/168 Figure 29-5. SPI interface timing requirements (master mode). Figure 29-6. SPI interface timing requirements (slave mode). MOSI (Data output) SCK (CPOL = 1) MISO (Data input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 6 1 2 2 4 5 3 7 8 MISO (Data output) SCK (CPOL = 1) MOSI (Data input) SCK (CPOL = 0) SS MSB LSB MSB LSB ... ... 10 11 11 13 14 12 15 17 9 X 16311 2545T–AVR–05/11 ATmega48/88/168 29.8 ADC characteristics Note: 1. AVCC absolute min./max.: 1.8V/5.5V Table 29-7. ADC characteristics. Symbol Parameter Condition Minimum Typical Maximum Units Resolution 10 Bits Absolute accuracy (Including INL, DNL, quantization error, gain and offset error) VREF = 4V, VCC = 4V, ADC clock = 200kHz 2 LSB VREF = 4V, VCC = 4V, ADC clock = 1MHz 4.5 VREF = 4V, VCC = 4V, ADC clock = 200kHz Noise reduction mode 2 VREF = 4V, VCC = 4V, ADC clock = 1MHz Noise reduction mode 4.5 Integral non-linearity (INL) VREF = 4V, VCC = 4V, ADC clock = 200kHz 0.5 Differential non-linearity (DNL) VREF = 4V, VCC = 4V, ADC clock = 200kHz 0.25 Gain error VREF = 4V, VCC = 4V, ADC clock = 200kHz 2 Offset error VREF = 4V, VCC = 4V, ADC clock = 200kHz 2 Conversion time Free running conversion 13 260 µs Clock frequency 50 1000 kHz AVCC(1) Analog supply voltage VCC - 0.3 VCC + 0.3 VREF Reference voltage 1.0 AVCC V VIN Input voltage GND VREF Input bandwidth 38.5 kHz VINT Internal voltage reference 1.0 1.1 1.2 V RREF Reference input resistance 32 kΩ RAIN Analog input resistance 100 MΩ312 2545T–AVR–05/11 ATmega48/88/168 29.9 Parallel programming characteristics Figure 29-7. Parallel programming timing, including some general timing requirements. Figure 29-8. Parallel programming timing, loading sequence with timing requirements(1). Note: 1. The timing requirements shown in Figure 29-7 (that is, tDVXH, tXHXL, and tXLDX) also apply to loading operation. Data & contol (DATA, XA0/1, BS1, BS2) XTAL1 t XHXL t WLWH t DVXH t XLDX t PLWL t WLRH WR RDY/BSY PAGEL t PHPL t PLBX t BVPH t XLWL t WLBX tBVWL WLRL XTAL1 PAGEL t XLXH PLXH t t XLPH DATA ADDR0 (low byte) DATA (low byte) DATA (high byte) ADDR1 (low byte) BS1 XA0 XA1 LOAD ADDRESS (LOW BYTE) LOAD DATA (LOW BYTE) LOAD DATA (HIGH BYTE) LOAD DATA LOAD ADDRESS (LOW BYTE)313 2545T–AVR–05/11 ATmega48/88/168 Figure 29-9. Parallel programming timing, reading sequence (within the same page) with timing requirements(1). Note: 1. The timing requirements shown in Figure 29-7 on page 312 (that is, tDVXH, tXHXL, and tXLDX) also apply to reading operation. Table 29-8. Parallel programming characteristics, VCC = 5V ±10%. Symbol Parameter Min. Typ. Max. Units VPP Programming enable voltage 11.5 12.5 V IPP Programming enable current 250 µA tDVXH Data and control valid before XTAL1 high 67 ns tXLXH XTAL1 low to XTAL1 high 200 tXHXL XTAL1 pulse width high 150 tXLDX Data and control hold after XTAL1 low 67 tXLWL XTAL1 low to WR low 0 tXLPH XTAL1 low to PAGEL high 0 tPLXH PAGEL low to XTAL1 high 150 tBVPH BS1 valid before PAGEL high 67 tPHPL PAGEL pulse width high 150 tPLBX BS1 hold after PAGEL low 67 tWLBX BS2/1 hold after WR low 67 tPLWL PAGEL low to WR low 67 tBVWL BS1 valid to WR low 67 tWLWH WR pulse width low 150 tWLRL WR low to RDY/BSY low 0 1 µs tWLRH WR low to RDY/BSY high(1) 3.7 4.5 ms tWLRH_CE WR low to RDY/BSY high for chip erase(2) 7.5 9 XTAL1 OE DATA ADDR0 (low byte) DATA (low byte) DATA (high byte) ADDR1 (low byte) BS1 XA0 XA1 LOAD ADDRESS (LOW BYTE) READ DATA (LOW BYTE) READ DATA (HIGH BYTE) LOAD ADDRESS (LOW BYTE) t BVDV t OLDV t XLOL t OHDZ314 2545T–AVR–05/11 ATmega48/88/168 Notes: 1. tWLRH is valid for the write flash, write EEPROM, write fuse bits and write lock bits commands. 2. tWLRH_CE is valid for the chip erase command. t XLOL XTAL1 low to OE low 0 ns t BVDV BS1 valid to DATA valid 0 250 tOLDV OE low to DATA valid 250 t OHDZ OE high to DATA tri-stated 250 Table 29-8. Parallel programming characteristics, VCC = 5V ±10%. (Continued) Symbol Parameter Min. Typ. Max. Units315 2545T–AVR–05/11 ATmega48/88/168 30. Typical characteristics The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A square wave generator with rail-to-rail output is used as clock source. All Active- and Idle current consumption measurements are done with all bits in the PRR register set and thus, the corresponding I/O modules are turned off. Also the Analog Comparator is disabled during these measurements. Table 30-1 on page 321 and Table 30-2 on page 321 show the additional current consumption compared to ICC Active and ICC Idle for every I/O module controlled by the Power Reduction Register. See “Power reduction register” on page 41 for details. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. 30.1 Active supply current Figure 30-1. Active supply current vs. frequency (0.1MHz - 1.0MHz). 5.5V 5.0V 4.5V 4.0V 3.3V 2.7V 1.8V 0 0.2 0.4 0.6 0.8 1 1.2 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)316 2545T–AVR–05/11 ATmega48/88/168 Figure 30-2. Active supply current vs. frequency (1MHz - 24MHz). Figure 30-3. Active supply current vs. VCC (internal RC oscillator, 128kHz). 0 2 4 6 8 10 12 14 16 18 0 4 8 12 16 20 24 Frequency (MHz) ICC (mA) 2.7V 1.8V 3.3V 4.0V 4.5V 5.0V 5.5V , 85°C 25°C -40°C 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)317 2545T–AVR–05/11 ATmega48/88/168 Figure 30-4. Active supply current vs. VCC (internal RC oscillator, 1MHz). Figure 30-5. Active supply current vs. VCC (internal RC oscillator, 8MHz). , 85°C 25°C -40°C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) , 85°C 25°C -40°C 0 1 2 3 4 5 6 7 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)318 2545T–AVR–05/11 ATmega48/88/168 Figure 30-6. Active supply current vs. VCC (32kHz external oscillator). 30.2 Idle supply current Figure 30-7. Idle supply current vs. frequency (0.1MHz - 1.0MHz). 25°C 0 10 20 30 40 50 60 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 5.5V 5.0V 4.5V 4.0V 3.3V 2.7V 1.8V 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA)319 2545T–AVR–05/11 ATmega48/88/168 Figure 30-8. Idle supply current vs. frequency (1MHz - 24MHz). Figure 30-9. Idle supply current vs. VCC (internal RC oscillator, 128kHz). 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 0 4 8 12 16 20 24 Frequency (MHz) ICC (mA) 2.7V 1.8V 3.3V 4.0V 4.5V 5.0V 5.5V 85°C 25°C -40°C 0 0.005 0.01 0.015 0.02 0.025 0.03 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)320 2545T–AVR–05/11 ATmega48/88/168 Figure 30-10. Idle supply current vs. VCC (internal RC oscillator, 1MHz). Figure 30-11. Idle supply current vs. VCC (internal RC oscillator, 8MHz). , 85°C 25°C -40°C 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) , 85°C 25°C -40°C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)321 2545T–AVR–05/11 ATmega48/88/168 Figure 30-12. Idle supply current vs. VCC (32kHz external oscillator). 30.3 Supply current of I/O modules The tables and formulas below can be used to calculate the additional current consumption for the different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modules are controlled by the Power Reduction Register. See “Power reduction register” on page 41 for details. 25°C 0 5 10 15 20 25 30 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) Table 30-1. Additional current consumption for the different I/O modules (absolute values). PRR bit Typical numbers VCC = 2V, F = 1MHz VCC = 3V, F = 4MHz VCC = 5V, F = 8MHz PRUSART0 8.0µA 51µA 220µA PRTWI 12µA 75µA 315µA PRTIM2 11µA 72µA 300µA PRTIM1 5.0µA 32µA 130µA PRTIM0 4.0µA 24µA 100µA PRSPI 15µA 95µA 400µA PRADC 12µA 75µA 315µA Table 30-2. Additional current consumption (percentage) in active and idle mode. PRR bit Additional current consumption compared to active with external clock (see Figure 30-1 on page 315 and Figure 30-2 on page 316) Additional current consumption compared to Idle with external clock (see Figure 30-7 on page 318 and Figure 30-8 on page 319) PRUSART0 3.3% 18% PRTWI 4.8% 26% PRTIM2 4.7% 25%322 2545T–AVR–05/11 ATmega48/88/168 It is possible to calculate the typical current consumption based on the numbers from Table 30-2 on page 321 for other VCC and frequency settings than listed in Table 30-1 on page 321. 30.3.0.1 Example 1 Calculate the expected current consumption in idle mode with USART0, TIMER1, and TWI enabled at VCC = 3.0V and F = 1MHz. From Table 30-2 on page 321, third column, we see that we need to add 18% for the USART0, 26% for the TWI, and 11% for the TIMER1 module. Reading from Figure 30-7 on page 318, we find that the idle current consumption is ~0.075mA at VCC = 3.0V and F = 1MHz. The total current consumption in idle mode with USART0, TIMER1, and TWI enabled, gives: 30.3.0.2 Example 2 Same conditions as in example 1, but in active mode instead. From Table 30-2 on page 321, second column we see that we need to add 3.3% for the USART0, 4.8% for the TWI, and 2.0% for the TIMER1 module. Reading from Figure 30-1 on page 315, we find that the active current consumption is ~0.42mA at VCC = 3.0V and F = 1MHz. The total current consumption in idle mode with USART0, TIMER1, and TWI enabled, gives: 30.3.0.3 Example 3 All I/O modules should be enabled. Calculate the expected current consumption in active mode at VCC = 3.6V and F = 10MHz. We find the active current consumption without the I/O modules to be ~ 4.0mA (from Figure 30-2 on page 316). Then, by using the numbers from Table 30-2 on page 321 - second column, we find the total current consumption: PRTIM1 2.0% 11% PRTIM0 1.6% 8.5% PRSPI 6.1% 33% PRADC 4.9% 26% Table 30-2. Additional current consumption (percentage) in active and idle mode. (Continued) PRR bit Additional current consumption compared to active with external clock (see Figure 30-1 on page 315 and Figure 30-2 on page 316) Additional current consumption compared to Idle with external clock (see Figure 30-7 on page 318 and Figure 30-8 on page 319) ICCtotal ≈ ≈ 0.075mA • ( ) 1 0.18 0.26 0.11 +++ 0.116mA ICCtotal ≈ ≈ 0.42mA • ( ) 1 0.033 0.048 0.02 +++ 0.46mA ICCtotal ≈ ≈ 4.0mA • ( ) 1 0.033 0.048 0.047 0.02 0.016 0.061 0.049 + + + ++ + + 5.1mA323 2545T–AVR–05/11 ATmega48/88/168 30.4 Power-down supply current Figure 30-13. Power-down supply current vs. VCC (watchdog timer disabled). Figure 30-14. Power-down supply current vs. VCC (watchdog timer enabled). 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 2 4 6 8 10 12 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)324 2545T–AVR–05/11 ATmega48/88/168 30.5 Power-save supply current Figure 30-15. Power-save supply current vs. VCC (watchdog timer disabled). 30.6 Standby supply current Figure 30-16. Standby supply current vs. VCC (low power crystal oscillator). 25°C 0 2 4 6 8 10 12 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 6MHz Xtal 6MHz Res. 4MHz Xtal 4MHz Res. 455kHz Res. 32kHz Xtal 2MHz Xtal 2MHz Res. 1MHz Res. 0 20 40 60 80 100 120 140 160 180 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)325 2545T–AVR–05/11 ATmega48/88/168 Figure 30-17. Standby supply current vs. VCC (full swing crystal oscillator). 30.7 Pin pull-up Figure 30-18. I/O pin pull-up resistor current vs. input voltage (VCC = 5V). 6MHz Xtal (ckopt) 4MHz Xtal (ckopt) 2MHz Xtal (ckopt) 16MHz Xtal 12MHz Xtal 0 50 100 150 200 250 300 350 400 450 500 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 20 40 60 80 100 120 140 160 0123456 VOP (V) IOP (µA)326 2545T–AVR–05/11 ATmega48/88/168 Figure 30-19. I/O pin pull-up resistor current vs. input voltage (VCC = 2.7V). Figure 30-20. Reset pull-up resistor current vs. reset pin voltage (VCC = 5V). 85°C 25°C -40°C 0 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 3 VOP (V) IOP (µA) 0 20 40 60 80 100 120 0123456 VRESET (V) IRESET (µA) -40°C 25°C 85°C327 2545T–AVR–05/11 ATmega48/88/168 Figure 30-21. Reset pull-up resistor current vs. reset pin voltage (VCC = 2.7V). 30.8 Pin driver strength Figure 30-22. I/O pin source current vs. output voltage (VCC = 5V). -40°C 0 10 20 30 40 50 60 70 0 0.5 1 1.5 2 2.5 3 VRESET (V) IRESET (µA) 25°C 85°C 85°C 25°C -40°C 0 10 20 30 40 50 60 70 80 90 0123456 VOH (V) IOH (mA)328 2545T–AVR–05/11 ATmega48/88/168 Figure 30-23. I/O pin source current vs. output voltage (VCC = 2.7V). Figure 30-24. I/O pin source current vs. output voltage (VCC = 1.8V). 85°C 25°C -40°C 0 5 10 15 20 25 30 35 0 0.5 1 1.5 2 2.5 3 VOH (V) IOH (mA) 85°C 25°C -40°C 0 1 2 3 4 5 6 7 8 9 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VOH (V) IOH (mA)329 2545T–AVR–05/11 ATmega48/88/168 Figure 30-25. I/O pin sink current vs. output voltage (VCC = 5V). Figure 30-26. I/O pin sink current vs. output voltage (VCC = 2.7V). 85°C 25°C 0 10 20 30 40 50 60 70 80 0 0.5 1 1.5 2 2.5 VOL (V) IOL (mA) 85°C 25°C -40°C 0 5 10 15 20 25 30 35 40 0 0.5 1 1.5 2 2.5 VOL (V) IOL (mA)330 2545T–AVR–05/11 ATmega48/88/168 Figure 30-27. I/O pin sink current vs. output voltage (VCC = 1.8V). 30.9 Pin thresholds and hysteresis Figure 30-28. I/O pin input threshold voltage vs. VCC (VIH, I/O pin read as '1'). 85°C 25°C -40°C 0 2 4 6 8 10 12 14 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VOL (V) IOL (mA) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V)331 2545T–AVR–05/11 ATmega48/88/168 Figure 30-29. I/O pin input threshold voltage vs. VCC (VIL, I/O pin read as '0'). Figure 30-30. I/O pin input hystreresis vs. Vcc. 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.1 0.2 0.3 0.4 0.5 0.6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input hysteresis (V)332 2545T–AVR–05/11 ATmega48/88/168 Figure 30-31. Reset input threshold voltage vs. VCC (VIH, reset pin read as '1'). Figure 30-32. Reset input threshold voltage vs. VCC (VIL, reset pin read as '0'). 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V) 85°C 25°C -40°C 0 0.5 1 1.5 2 2.5 3 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Threshold (V)333 2545T–AVR–05/11 ATmega48/88/168 Figure 30-33. Reset input pin hysteresis vs. VCC. 30.10 BOD thresholds and analog comparator offset Figure 30-34. BOD thresholds vs. temperature (BODLEVEL is 4.3V). VIL 0 100 200 300 400 500 600 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Input hysteresis (mV) 4.2 4.25 4.3 4.35 4.4 4.45 4.5 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) Threshold (V) Rising Vcc Falling Vcc334 2545T–AVR–05/11 ATmega48/88/168 Figure 30-35. BOD thresholds vs. temperature (BODLEVEL is 2.7V). Figure 30-36. BOD thresholds vs. temperature (BODLEVEL is 1.8V). 2.6 2.65 2.7 2.75 2.8 2.85 2.9 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) Threshold (V) Rising Vcc Falling Vcc 1.76 1.78 1.8 1.82 1.84 1.86 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) Threshold (V) Rising Vcc Falling Vcc335 2545T–AVR–05/11 ATmega48/88/168 Figure 30-37. Bandgap voltage vs. VCC. Figure 30-38. Analog comparator offset voltage vs. common mode voltage (VCC = 5V). -40°C 85°C 1.08 1.085 1.09 1.095 1.1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VCC (V) Bandgap voltage (V) -40°C 85°C 0 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 0.009 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Common Mode Voltage (V) Analog comparator offset voltage (V)336 2545T–AVR–05/11 ATmega48/88/168 Figure 30-39. Analog comparator offset voltage vs. common mode voltage (VCC = 2.7V). 30.11 Internal oscillator speed Figure 30-40. Watchdog oscillator frequency vs. VCC. -40°C 85°C 0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 2 2.5 Common Mode Voltage (V) Analog comparator offset voltage (mV) 85°C 25°C -40°C 95 100 105 110 115 120 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (kHz)337 2545T–AVR–05/11 ATmega48/88/168 Figure 30-41. Calibrated 8MHz RC oscillator frequency vs. temperature. Figure 30-42. Calibrated 8MHz RC oscillator frequency vs. VCC. 5.0V 2.7V 1.8V 7.4 7.5 7.6 7.7 7.8 7.9 8 8.1 8.2 8.3 8.4 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) FRC (MHz) 85°C 25°C -40°C 7.4 7.6 7.8 8 8.2 8.4 8.6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) FRC (MHz)338 2545T–AVR–05/11 ATmega48/88/168 Figure 30-43. Calibrated 8MHz RC oscillator frequency vs. osccal value. 30.12 Current consumption of peripheral units Figure 30-44. Brownout detector current vs. VCC. 85°C 25°C -40°C 3.5 5.5 7.5 9.5 11.5 13.5 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL VALUE FRC (MHz) 85°C 25°C -40°C 18 20 22 24 26 28 30 32 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)339 2545T–AVR–05/11 ATmega48/88/168 Figure 30-45. ADC current vs. VCC (AREF = AVCC). Figure 30-46. AREF external reference current vs. VCC. 85°C 25°C -40°C 150 200 250 300 350 400 450 500 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 20 40 60 80 100 120 140 160 180 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA)340 2545T–AVR–05/11 ATmega48/88/168 Figure 30-47. Analog comparator current vs. VCC. Figure 30-48. Programming current vs. VCC. 85°C 25°C -40°C 0 20 40 60 80 100 120 140 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (µA) 85°C 25°C -40°C 0 2 4 6 8 10 12 14 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA) 85°C 25°C -40°C 0 2 4 6 8 10 12 14 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) ICC (mA)341 2545T–AVR–05/11 ATmega48/88/168 30.13 Current consumption in reset and reset pulse width Figure 30-49. Reset supply current vs. VCC (0.1MHz - 1.0MHz, excluding current through the reset pull-up). Figure 30-50. Reset supply current vs. VCC (1MHz - 24MHz, excluding current through the reset pull-up). 5.5V 5.0V 4.5V 4.0V 3.3V 2.7V 1.8V 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) ICC (mA) , 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 0 4 8 12 16 20 24 Frequency (MHz) ICC (mA) 2.7V 1.8V 3.3V 4.0V 4.5V 5.0V 5.5V342 2545T–AVR–05/11 ATmega48/88/168 Figure 30-51. Reset pulse width vs. VCC. 85°C 25°C -40°C 0 500 1000 1500 2000 2500 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Pulsewidth (ns)343 2545T–AVR–05/11 ATmega48/88/168 31. Register summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page (0xFF) Reserved – – – – – – – – (0xFE) Reserved – – – – – – – – (0xFD) Reserved – – – – – – – – (0xFC) Reserved – – – – – – – – (0xFB) Reserved – – – – – – – – (0xFA) Reserved – – – – – – – – (0xF9) Reserved – – – – – – – – (0xF8) Reserved – – – – – – – – (0xF7) Reserved – – – – – – – – (0xF6) Reserved – – – – – – – – (0xF5) Reserved – – – – – – – – (0xF4) Reserved – – – – – – – – (0xF3) Reserved – – – – – – – – (0xF2) Reserved – – – – – – – – (0xF1) Reserved – – – – – – – – (0xF0) Reserved – – – – – – – – (0xEF) Reserved – – – – – – – – (0xEE) Reserved – – – – – – – – (0xED) Reserved – – – – – – – – (0xEC) Reserved – – – – – – – – (0xEB) Reserved – – – – – – – – (0xEA) Reserved – – – – – – – – (0xE9) Reserved – – – – – – – – (0xE8) Reserved – – – – – – – – (0xE7) Reserved – – – – – – – – (0xE6) Reserved – – – – – – – – (0xE5) Reserved – – – – – – – – (0xE4) Reserved – – – – – – – – (0xE3) Reserved – – – – – – – – (0xE2) Reserved – – – – – – – – (0xE1) Reserved – – – – – – – – (0xE0) Reserved – – – – – – – – (0xDF) Reserved – – – – – – – – (0xDE) Reserved – – – – – – – – (0xDD) Reserved – – – – – – – – (0xDC) Reserved – – – – – – – – (0xDB) Reserved – – – – – – – – (0xDA) Reserved – – – – – – – – (0xD9) Reserved – – – – – – – – (0xD8) Reserved – – – – – – – – (0xD7) Reserved – – – – – – – – (0xD6) Reserved – – – – – – – – (0xD5) Reserved – – – – – – – – (0xD4) Reserved – – – – – – – – (0xD3) Reserved – – – – – – – – (0xD2) Reserved – – – – – – – – (0xD1) Reserved – – – – – – – – (0xD0) Reserved – – – – – – – – (0xCF) Reserved – – – – – – – – (0xCE) Reserved – – – – – – – – (0xCD) Reserved – – – – – – – – (0xCC) Reserved – – – – – – – – (0xCB) Reserved – – – – – – – – (0xCA) Reserved – – – – – – – – (0xC9) Reserved – – – – – – – – (0xC8) Reserved – – – – – – – – (0xC7) Reserved – – – – – – – – (0xC6) UDR0 USART I/O data register 190 (0xC5) UBRR0H USART baud rate register high 194 (0xC4) UBRR0L USART baud rate register low 194 (0xC3) Reserved – – – – – – – – (0xC2) UCSR0C UMSEL01 UMSEL00 UPM01 UPM00 USBS0 UCSZ01 /UDORD0 UCSZ00 / UCPHA0 UCPOL0 192/207 (0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 191 (0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 190344 2545T–AVR–05/11 ATmega48/88/168 (0xBF) Reserved – – – – – – – – (0xBE) Reserved – – – – – – – – (0xBD) TWAMR TWAM6 TWAM5 TWAM4 TWAM3 TWAM2 TWAM1 TWAM0 – 239 (0xBC) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE 236 (0xBB) TWDR 2-wire serial interface data register 238 (0xBA) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE 239 (0xB9) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 – TWPS1 TWPS0 238 (0xB8) TWBR 2-wire serial interface bit rate register 236 (0xB7) Reserved – – – – – – – (0xB6) ASSR – EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB 159 (0xB5) Reserved – – – – – – – – (0xB4) OCR2B Timer/Counter2 output compare register B 158 (0xB3) OCR2A Timer/Counter2 output compare register A 157 (0xB2) TCNT2 Timer/Counter2 (8-bit) 157 (0xB1) TCCR2B FOC2A FOC2B – – WGM22 CS22 CS21 CS20 156 (0xB0) TCCR2A COM2A1 COM2A0 COM2B1 COM2B0 – – WGM21 WGM20 153 (0xAF) Reserved – – – – – – – – (0xAE) Reserved – – – – – – – – (0xAD) Reserved – – – – – – – – (0xAC) Reserved – – – – – – – – (0xAB) Reserved – – – – – – – – (0xAA) Reserved – – – – – – – – (0xA9) Reserved – – – – – – – – (0xA8) Reserved – – – – – – – – (0xA7) Reserved – – – – – – – – (0xA6) Reserved – – – – – – – – (0xA5) Reserved – – – – – – – – (0xA4) Reserved – – – – – – – – (0xA3) Reserved – – – – – – – – (0xA2) Reserved – – – – – – – – (0xA1) Reserved – – – – – – – – (0xA0) Reserved – – – – – – – – (0x9F) Reserved – – – – – – – – (0x9E) Reserved – – – – – – – – (0x9D) Reserved – – – – – – – – (0x9C) Reserved – – – – – – – – (0x9B) Reserved – – – – – – – – (0x9A) Reserved – – – – – – – – (0x99) Reserved – – – – – – – – (0x98) Reserved – – – – – – – – (0x97) Reserved – – – – – – – – (0x96) Reserved – – – – – – – – (0x95) Reserved – – – – – – – – (0x94) Reserved – – – – – – – – (0x93) Reserved – – – – – – – – (0x92) Reserved – – – – – – – – (0x91) Reserved – – – – – – – – (0x90) Reserved – – – – – – – – (0x8F) Reserved – – – – – – – – (0x8E) Reserved – – – – – – – – (0x8D) Reserved – – – – – – – – (0x8C) Reserved – – – – – – – – (0x8B) OCR1BH Timer/Counter1 - output compare register B high byte 134 (0x8A) OCR1BL Timer/Counter1 - output compare register B low byte 134 (0x89) OCR1AH Timer/Counter1 - output compare register A high byte 134 (0x88) OCR1AL Timer/Counter1 - output compare register A low byte 134 (0x87) ICR1H Timer/Counter1 - input capture register high byte 135 (0x86) ICR1L Timer/Counter1 - input capture register low byte 135 (0x85) TCNT1H Timer/Counter1 - counter register high byte 134 (0x84) TCNT1L Timer/Counter1 - counter register low byte 134 (0x83) Reserved – – – – – – – – (0x82) TCCR1C FOC1A FOC1B – – – – – – 133 (0x81) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 132 (0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 130 (0x7F) DIDR1 – – – – – – AIN1D AIN0D 243 (0x7E) DIDR0 – – ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D 259 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page345 2545T–AVR–05/11 ATmega48/88/168 (0x7D) Reserved – – – – – – – – (0x7C) ADMUX REFS1 REFS0 ADLAR – MUX3 MUX2 MUX1 MUX0 255 (0x7B) ADCSRB – ACME – – – ADTS2 ADTS1 ADTS0 258 (0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 256 (0x79) ADCH ADC data register high byte 258 (0x78) ADCL ADC data register low byte 258 (0x77) Reserved – – – – – – – – (0x76) Reserved – – – – – – – – (0x75) Reserved – – – – – – – – (0x74) Reserved – – – – – – – – (0x73) Reserved – – – – – – – – (0x72) Reserved – – – – – – – – (0x71) Reserved – – – – – – – – (0x70) TIMSK2 – – – – – OCIE2B OCIE2A TOIE2 158 (0x6F) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 135 (0x6E) TIMSK0 – – – – – OCIE0B OCIE0A TOIE0 106 (0x6D) PCMSK2 PCINT23 PCINT22 PCINT21 PCINT20 PCINT19 PCINT18 PCINT17 PCINT16 70 (0x6C) PCMSK1 – PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 70 (0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 70 (0x6A) Reserved – – – – – – – – (0x69) EICRA – – – – ISC11 ISC10 ISC01 ISC00 67 (0x68) PCICR – – – – – PCIE2 PCIE1 PCIE0 (0x67) Reserved – – – – – – – – (0x66) OSCCAL Oscillator calibration register 37 (0x65) Reserved – – – – – – – – (0x64) PRR PRTWI PRTIM2 PRTIM0 – PRTIM1 PRSPI PRUSART0 PRADC 41 (0x63) Reserved – – – – – – – – (0x62) Reserved – – – – – – – – (0x61) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 37 (0x60) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 53 0x3F (0x5F) SREG I T H S V N Z C 11 0x3E (0x5E) SPH – – – – – (SP10) 5. SP9 SP8 13 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 13 0x3C (0x5C) Reserved – – – – – – – – 0x3B (0x5B) Reserved – – – – – – – – 0x3A (0x5A) Reserved – – – – – – – – 0x39 (0x59) Reserved – – – – – – – – 0x38 (0x58) Reserved – – – – – – – – 0x37 (0x57) SPMCSR SPMIE (RWWSB)5. – (RWWSRE)5. BLBSET PGWRT PGERS SELFPRGEN 283 0x36 (0x56) Reserved – – – – – – – – 0x35 (0x55) MCUCR – – – PUD – – IVSEL IVCE 0x34 (0x54) MCUSR – – – – WDRF BORF EXTRF PORF 0x33 (0x53) SMCR – – – – SM2 SM1 SM0 SE 39 0x32 (0x52) Reserved – – – – – – – – 0x31 (0x51) Reserved – – – – – – – – 0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 242 0x2F (0x4F) Reserved – – – – – – – – 0x2E (0x4E) SPDR SPI data register 170 0x2D (0x4D) SPSR SPIF WCOL – – – – – SPI2X 169 0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 168 0x2B (0x4B) GPIOR2 General purpose I/O register 2 26 0x2A (0x4A) GPIOR1 General purpose I/O register 1 26 0x29 (0x49) Reserved – – – – – – – – 0x28 (0x48) OCR0B Timer/Counter0 output compare register B 0x27 (0x47) OCR0A Timer/Counter0 output compare register A 0x26 (0x46) TCNT0 Timer/Counter0 (8-bit) 0x25 (0x45) TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 0x24 (0x44) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 0x23 (0x43) GTCCR TSM – – – – – PSRASY PSRSYNC 139/160 0x22 (0x42) EEARH (EEPROM address register high byte) 5. 22 0x21 (0x41) EEARL EEPROM address register low byte 22 0x20 (0x40) EEDR EEPROM data register 22 0x1F (0x3F) EECR – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE 22 0x1E (0x3E) GPIOR0 General purpose I/O register 0 26 0x1D (0x3D) EIMSK – – – – – – INT1 INT0 68 0x1C (0x3C) EIFR – – – – – – INTF1 INTF0 68 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page346 2545T–AVR–05/11 ATmega48/88/168 Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 4. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. The Atmel ATmega48/88/168 is a complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from 0x60 - 0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. 5. Only valid for ATmega88/168 0x1B (0x3B) PCIFR – – – – – PCIF2 PCIF1 PCIF0 0x1A (0x3A) Reserved – – – – – – – – 0x19 (0x39) Reserved – – – – – – – – 0x18 (0x38) Reserved – – – – – – – – 0x17 (0x37) TIFR2 – – – – – OCF2B OCF2A TOV2 158 0x16 (0x36) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 136 0x15 (0x35) TIFR0 – – – – – OCF0B OCF0A TOV0 0x14 (0x34) Reserved – – – – – – – – 0x13 (0x33) Reserved – – – – – – – – 0x12 (0x32) Reserved – – – – – – – – 0x11 (0x31) Reserved – – – – – – – – 0x10 (0x30) Reserved – – – – – – – – 0x0F (0x2F) Reserved – – – – – – – – 0x0E (0x2E) Reserved – – – – – – – – 0x0D (0x2D) Reserved – – – – – – – – 0x0C (0x2C) Reserved – – – – – – – – 0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 88 0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 88 0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 88 0x08 (0x28) PORTC – PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 87 0x07 (0x27) DDRC – DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 87 0x06 (0x26) PINC – PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 87 0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 87 0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 87 0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 87 0x02 (0x22) Reserved – – – – – – – – 0x01 (0x21) Reserved – – – – – – – – 0x0 (0x20) Reserved – – – – – – – – Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page347 2545T–AVR–05/11 ATmega48/88/168 32. Instruction set summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two registers Rd ← Rd + Rr Z, C, N, V, H 1 ADC Rd, Rr Add with carry two registers Rd ← Rd + Rr + C Z, C, N, V, H 1 ADIW Rdl,K Add immediate to word Rdh:Rdl ← Rdh:Rdl + K Z, C, N, V, S 2 SUB Rd, Rr Subtract two registers Rd ← Rd - Rr Z, C, N, V, H 1 SUBI Rd, K Subtract constant from register Rd ← Rd - K Z, C, N, V, H 1 SBC Rd, Rr Subtract with carry two registers Rd ← Rd - Rr - C Z, C, N, V, H 1 SBCI Rd, K Subtract with carry constant from reg. Rd ← Rd - K - C Z, C, N, V, H 1 SBIW Rdl,K Subtract immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z, C, N, V, S 2 AND Rd, Rr Logical AND registers Rd ← Rd • Rr Z, N, V 1 ANDI Rd, K Logical AND register and constant Rd ← Rd • K Z, N, V 1 OR Rd, Rr Logical OR registers Rd ← Rd v Rr Z, N, V 1 ORI Rd, K Logical OR register and constant Rd ← Rd v K Z, N, V 1 EOR Rd, Rr Exclusive OR registers Rd ← Rd ⊕ Rr Z, N, V 1 COM Rd One’s complement Rd ← 0xFF − Rd Z, C, N, V 1 NEG Rd Two’s complement Rd ← 0x00 − Rd Z, C, N, V, H 1 SBR Rd,K Set bit(s) in register Rd ← Rd v K Z, N, V 1 CBR Rd,K Clear bit(s) in register Rd ← Rd • (0xFF - K) Z, N, V 1 INC Rd Increment Rd ← Rd + 1 Z, N, V 1 DEC Rd Decrement Rd ← Rd − 1 Z, N, V 1 TST Rd Test for zero or minus Rd ← Rd • Rd Z, N, V 1 CLR Rd Clear register Rd ← Rd ⊕ Rd Z, N, V 1 SER Rd Set register Rd ← 0xFF None 1 MUL Rd, Rr Multiply unsigned R1:R0 ← Rd x Rr Z, C 2 MULS Rd, Rr Multiply signed R1:R0 ← Rd x Rr Z, C 2 MULSU Rd, Rr Multiply signed with unsigned R1:R0 ← Rd x Rr Z, C 2 FMUL Rd, Rr Fractional multiply unsigned R1:R0 ← (Rd x Rr) << 1 Z, C 2 FMULS Rd, Rr Fractional multiply signed R1:R0 ← (Rd x Rr) << 1 Z, C 2 FMULSU Rd, Rr Fractional multiply signed with unsigned R1:R0 ← (Rd x Rr) << 1 Z, C 2 BRANCH INSTRUCTIONS RJMP k Relative jump PC ← PC + k + 1 None 2 IJMP Indirect jump to (Z) PC ← Z None 2 JMP(1) k Direct jump PC ← k None 3 RCALL k Relative subroutine call PC ← PC + k + 1 None 3 ICALL Indirect call to (Z) PC ← Z None 3 CALL(1) k Direct subroutine call PC ← k None 4 RET Subroutine return PC ← STACK None 4 RETI Interrupt return PC ← STACK I 4 CPSE Rd,Rr Compare, skip if equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N, V, C, H 1 CPC Rd,Rr Compare with carry Rd − Rr − C Z, N, V, C, H 1 CPI Rd,K Compare register with immediate Rd − K Z, N, V, C, H 1 SBRC Rr, b Skip if bit in register cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if bit in register is set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if bit in I/O register cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if bit in I/O register is set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if status flag set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if status flag cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if not equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if carry set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if carry cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if same or higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if greater or equal, signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if less than zero, signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if half carry flag set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if half carry flag cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T flag set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T flag cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if overflow flag is set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if overflow flag is cleared if (V = 0) then PC ← PC + k + 1 None 1/2348 2545T–AVR–05/11 ATmega48/88/168 BRIE k Branch if interrupt enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if interrupt disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set bit in I/O register I/O(P,b) ← 1 None 2 CBI P,b Clear bit in I/O register I/O(P,b) ← 0 None 2 LSL Rd Logical shift left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z, C, N, V 1 LSR Rd Logical shift right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z, C, N, V 1 ROL Rd Rotate left through carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z, C, N, V 1 ROR Rd Rotate right through carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z, C, N, V 1 ASR Rd Arithmetic shift right Rd(n) ← Rd(n+1), n=0..6 Z, C, N, V 1 SWAP Rd Swap nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag set SREG(s) ← 1 SREG(s) 1 BCLR s Flag clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit store from register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to register Rd(b) ← T None 1 SEC Set carry C ← 1 C1 CLC Clear carry C ← 0 C 1 SEN Set negative flag N ← 1 N1 CLN Clear negative flag N ← 0 N 1 SEZ Set zero flag Z ← 1 Z1 CLZ Clear zero flag Z ← 0 Z 1 SEI Global interrupt enable I ← 1 I1 CLI Global interrupt disable I ← 0 I 1 SES Set signed test flag S ← 1 S1 CLS Clear signed test flag S ← 0 S 1 SEV Set Twos complement overflow V ← 1 V1 CLV Clear Twos complement overflow V ← 0 V 1 SET Set T in SREG T ← 1 T1 CLT Clear T in SREG T ← 0 T 1 SEH Set half carry flag in SREG H ← 1 H1 CLH Clear half carry flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move between registers Rd ← Rr None 1 MOVW Rd, Rr Copy register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load immediate Rd ← K None 1 LD Rd, X Load indirect Rd ← (X) None 2 LD Rd, X+ Load indirect and post-inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load indirect and pre-dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load indirect Rd ← (Y) None 2 LD Rd, Y+ Load indirect and post-inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load indirect and pre-dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load indirect with displacement Rd ← (Y + q) None 2 LD Rd, Z Load indirect Rd ← (Z) None 2 LD Rd, Z+ Load indirect and post-inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load indirect and pre-dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load indirect with displacement Rd ← (Z + q) None 2 LDS Rd, k Load direct from SRAM Rd ← (k) None 2 ST X, Rr Store indirect (X) ← Rr None 2 ST X+, Rr Store indirect and post-inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store indirect and pre-dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store indirect (Y) ← Rr None 2 ST Y+, Rr Store indirect and post-inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store indirect and pre-dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store indirect with displacement (Y + q) ← Rr None 2 ST Z, Rr Store indirect (Z) ← Rr None 2 ST Z+, Rr Store indirect and post-inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store indirect and pre-dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store indirect with displacement (Z + q) ← Rr None 2 STS k, Rr Store direct to SRAM (k) ← Rr None 2 LPM Load program memory R0 ← (Z) None 3 LPM Rd, Z Load program memory Rd ← (Z) None 3 LPM Rd, Z+ Load program memory and post-inc Rd ← (Z), Z ← Z+1 None 3 SPM Store program memory (Z) ← R1:R0 None - IN Rd, P In port Rd ← P None 1 OUT P, Rr Out port P ← Rr None 1 PUSH Rr Push register on stack STACK ← Rr None 2 Mnemonics Operands Description Operation Flags #Clocks349 2545T–AVR–05/11 ATmega48/88/168 Note: 1. These instructions are only available in Atmel ATmega168. POP Rd Pop register from stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No operation None 1 SLEEP Sleep (See specific descr. for sleep function) None 1 WDR Watchdog reset (See specific descr. for WDR/timer) None 1 BREAK Break For on-chip debug only None N/A Mnemonics Operands Description Operation Flags #Clocks350 2545T–AVR–05/11 ATmega48/88/168 33. Ordering information 33.1 Atmel ATmega48 Note: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging alternative, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. See Figure 29-1 on page 305 and Figure 29-2 on page 305. 4. NiPdAu lead finish. 5. Tape & Reel. Speed (MHz) Power supply Ordering code(2) Package(1) Operational range 10(3) 1.8V - 5.5V ATmega48V-10AUR(5) ATmega48V-10MUR(5) ATmega48V-10AU ATmega48V-10MMU ATmega48V-10MMUR(5) ATmega48V-10MMH(4) ATmega48V-10MMHR(4)(5) ATmega48V-10MU ATmega48V-10PU